FOR THE CREATION OF ADHESIVE CONNECTIONS OF INCREASED HEAT CONDUCTION
A method of creating adhesive joints with high thermal conductivity is considered, the basis for which is the method of influencing the adhesive layer, previously filled with a non ferromagnetic dispersion filler, with a constant electric field. Bridges of filler particles formed in the polymer matrix of adhesive bonding under the action of a constant electric field, lead to an increase in its thermal conductivity. It has been experimentally proved that the thermal conductivity of an adhesive compound directly depends on the concentration of the filler, its dispersion and field strength.