Effect of Temperature on the Kinetics of Electroless Nickel Plating from Glycinate Solutions
Effect of varying temperature on the deposition rate, copper and phosphorius content in the deposits was experimentally studied in glycinate- and glycinate-malonate solutions at different values of pH at the presence and in the absence of copper ions additions (Tables 1,2). Hardness of Ni-P coatings is reduced slightly at lower temperatures, and increases in the case of Ni-Cu-P ones (Table 3). An increase in a specific charge area per 1l of solution reduces deposition rate (Table 4). At unusually low temperatures (18-25ºC) deposition rate is much lower (Table 5).