Investigation of kinetics of platinum dissolution in molten solders. Properties of platinum surface wettability by molten eutectic solder
Platinum as a chemical element is not susceptible to oxidation and has a slow reaction rate with solders based on Pb-Sn, Sn-Cu widely used in microelectronics and Sn-Ag-Cu that allows it to replace two layers of metallization in solder balls contact pads with only one platinum layer on semiconductor die for flip-chip surface mount method: oxidation protection layer and diffusion barrier layer. Platinum solder wetting ability and tin-based solder dissolution rate of platinum in comparison with nickel - the most common material for barrier layers were investigated in this article.