Optimizing the placement elements of res based multilevel geoinformation model
When designing the board assembly is one of the important tasks on which depends the reliability and performance of the product is the optimal placement of elements in a given area. It should take into account a set of interrelated parameters such as resistance element to mechanical stress, heat, electromagnetic compatibility. Unlike the task trace interconnections, for which there are well-known, proven solutions to the problem of locating elements are no solutions that address the complex above parameters. This paper considers the model of integrating external impacts on the structural components of radio electronic equipment for the problem of determining the optimal layout of elements on the printing unit. Proposed multi-layered GIS model that takes into account the thermal, mechanical and microwave exposure.An algorithm that allows you to get the optimum layout for the selected criteria board assembly.