ADVANTAGES AND DISADVANTAGES OF 2.5 D ASSEMBLY TECHNOLOGY IN THE MANUFACTURE OF NON-ISOLATED PULSE VOLTAGE REGULATORS
The company has developed and implemented a technology that allows placing and switching silicon crystals for ICS in planar boards with high thermal conductivity, followed by sealing the entire Board. The resulting universal non-isolated pulse microassemblies of step-down conversion are designed for harsh operating conditions in special and industrial applications.