INFLUENCE OF NON-STATIONARY ELECTROLYSIS MODES ON COPPER-TIN ALLOY COATINGS' PROPERTIES
Background. The research object is copper-tin alloy coatings, obtained by the electrochemical method; the research subject is the processes of copper-tin alloy coating electrodeposition at stationary and non-stationary deposition modes, such as cathode vibration and alternating magnetic field application over an electrolyte. The aim of the work is to study the influence of various modes of electrolysis (cathode vibration and alternating magnetic field application over an electrolyte) on physical-mechanical, electrical and corrosion properties of copper-tin alloy coatings. Materials and methods. The obtained coatings' composition was researchd by the methods of spectrophotometry and gravimetry. Operating properties of coatings, such as adhesion strength, microhardness, wear resistnace, transient electric resistance, solderability, corrosion resistance in various media, were investigated using standard and generally recognized methods. Results. The authors revealed an interrelation of operation properties of the copper-tin alloy coating (microhardness, solderability, transient resistance, corrosion resistence) and stationary and non-stationary electrolysis modes, allowing to form coatings with a set combination of properties. The researchers obtained results of corrosion tests determining a range of application of the copper-tin alloy. Conclusions. The research has established that non-stationary electrolysis modes, such as cathode vibration and alternating magnetic field application over an electrolyte promote formation of copper-tin alloy galvanic coatings with a wide range of tin content in the alloy, therefore impacting the propertie thereof. It has been experimentally proved that cathode vibration and alternating magnetic field application over an electrolyte leads to formation of coppe-tin alloya coatings that feature low and time-stable transient resistance, good solderability and high corrosion resistance. These allow to use the given coating as low-level contact coatings, as well as solder coatings, including for printed circuit board production.