THE EFFECT OF DOPING WITH COPPER IONS ON THE CORROSION-ELECTROCHEMICAL BEHAVIOR OF ALUMINUM FILMS
By measuring potentiostatic polarization curves of the investigated corrosion-electrochemical behavior of aluminum films in the surface, where implanted copper ions. The dependence of corrosion-electrochemical characteristics of the film of aluminum on the concentration of implanted ions. Auger electron spectroscopic analysis with layer-by-layer etching revealed that the effects of copper ions on the surface film of aluminium leads to the formation in the electrochemical process connection of aluminium oxide with the participation of the dopant.