Fatigue Life of Flexible Printed-Circuit Boards on Polyimide Films in Manufacture and Operation of Electronic Engineering Devices
The method for calculation of the low-cycle fatigue life of flexible printed-circuit boards and their resistance to bends has been developed. The resistance to cyclical bends of the flexible printed-circuit boards has been tested. The influence of constructive and technological factors on the fatigue life of polyimide boards has been determined. The recommendations of designing the flexible printed-circuit boards on the polyimide films have been developed.