Perspectives of Chiplet Technology for Specialized VLSI
The article discusses the prospects for the application of chiplet technology in the design of specialized VLSI. The use of a multi-level arrangement of systems in a package opens up the possibilities of combining high-performance specialized crystals and switching elements, performed on a passive layer, or integral control and switching components in the case of using an active layer. This approach makes it possible to design high-performance chiplets for a wide range of applications, taking into account that the adaptation of VLSI for a specific area of application will be carried out, inter alia, with the help of additional chiplets and an active layer, performed according to more accessible technological processes. Additionally, the use of an active layer makes it possible to improve information security indicators, since the ordered high-performance chiplets in this case are not complete components and the final product is formed only with the addition of a layer. Also, the division of VLSI into chiplets allows you to improve the temperature regime by controlling the mutual placement of chiplets on the interlayer, taking into account the scenarios of their joint operation.