Subset (3)

corpus · 45.3k rows

Split (1)

train · 45.3k rows

relevant_id large_string	earliest_claim_jusrisdiction string	jurisdiction list	ipcr_codes_str string	earliest_claim_date timestamp[ms]	earliest_claim_year string	classifications_ipcr_list_first_three_chars_list list	title_en string	abstract_en string	claims_text string	description_en string
141-679-454-772-715	DE	[ "DE", "BR", "JP", "EP", "AU", "US", "ES" ]	F16D41/07	1987-09-04T00:00:00	1987	[ "F16" ]	free wheel clutch with clamping member	purpose: to make the assembly of a spring member and a locking element easier by forming the spring element of a flat material, defining a spring section by at least one bend of the flat material extending in a space, and retaining a restraining area in a self-locking manner on an unitary cage. constitution: a spring element 18 is axially inserted into a unitary cage 1. a bent portion 24 and a wave 25 are inserted in a radial slit 17 until abutting upon the inner side of a wave 16. in this case, a tongue 23 is in snap engagement with the outside of the wave 16. thus, the spring member 18 is retained in a self-locking manner in the cage. after the spring member 18 being snap- engaged in the slit 17, a locking element 5 is inserted in to a pocket 4 to abut upon a projection 21 so that it is loaded by the spring force of a spring section 20 in a connection direction. the spring section 20 is defined by v-shaped bends 27, 28 and is positioned adjacently to the locking element 5.	1. overrunning clutch with clamping elements (5) retained secure against loss, each one by a spring element (18), in pockets (4) with plane edge surfaces in a one-piece single-cage (1), the spring element (18) being made up of an axial spring section (20) situated next to the clamping element (5), a prolongation (21) of the spring section, by which spring force is applied to the clamping element (5) in the coupling direction and a retaining region (19) bearing against the single-cage (1), characterized in that the spring element (18) is made of flat material and the spring section (20) is formed by at least one bend (27, 28) of the flat material, that the bend (27, 28) extends in the space between the radial plane (10 or 11 as the case may be) in which the end outer surface of the single-cage (1) is situated and the radial plane (12 or 13 as the case may be) in which the edges (8 or 9 as the case may be) of the pockets (4) near this outer surface and having the largest clear axial width (l) are situated, and that the retaining region (19) is fixed to the single-cage (1) by self-retention. 2. overrunning clutch according to claim 1, characterized in that on both sides of the spring element (18), at least one bend (27, 28) forming the spring section (20) is provided. 3. overrunning clutch according to claim 2, characterized in that the prolongations (21) of the bends (27, 28) situated on both sides are connected by a cross-bar (29). 4. overrunning clutch according to claim 3, characterized in that a rib (30) is formed out of the cross-bar (29) to stiffen it. 5. overrunning clutch according to claim 3 or 4, characterized in that at the centre of the cross-bar (29) a projection (31) is provided to form a bearing part for the clamping element (5). 6. overrunning clutch according to one of the preceding claims 3 to 5, characterized in that the cross-bar (29) is provided with a dip (36). 7. overrunning clutch according to one of the preceding claims, characterized in that at least two spring elements (18) form a one-piece multiple spring element by means of connecting parts (32). 8. overrunning clutch according to one of the preceding claims, characterized in that the retaining region (19) is fixed at the single-cage (1) by means of a snap connection. 9. overrunning clutch according to claim 8, characterized in that the retaining region (19) is provided with a bent clip (22) which is inserted into a slot (17) extending between adjacent pockets (4). 10. overrunning clutch according to claim 9, characterized in that on the clip (22), an angled section (24) and a resilient tongue (23) are provided which interlock with a web (16) of the single-cage (1). 11. overrunning clutch according to one of the preceding claims, characterized in that the clip (22) is provided with bevels (26). 12. overrunning clutch according to one of the preceding claims, characterized in that the clip (22) is connected to the bend (27, 28) by a web (25). 13. overrunning clutch according to one of the preceding claims, characterized in that the retaining region is provided with a frame (37) whose opening (38) is flush with the edges (6 to 9) of the pocket (4) and that hooks (39, 40) are formed on the frame (37) and engage over the webs (16) situated between the pockets (4). 14. overrunning clutch according to one of the preceding claims, characterized in that the bend (27, 28) pulls on the clamping element via the projection (31). 15. overrunning clutch according to one of the preceding claims 1 to 13, characterized in that the bend (27, 28) presses against the clamping element via the prolongation (21).	state of the art an overrunning clutch with locking elements securely retained by a respective spring element in pockets having plane end faces and being part of a one-piece unitary cage which spring element includes a spring section extending axially adjacent to the locking element and having a projection which acts upon the locking element with a spring force in the direction of engagement and a restraining area supported by the single cage is described in de-as no. 1,915,567 wherein the spring elements are defined as volute springs of wire material. these volute springs are loosely placed on lugs of the cage which project into the pockets and the volute spring thus requires structural space within the pocket. the greatest axial length of the pocket is thus not fully usable by the locking element. attachment of the volute springs to the cage is complicated because the volute spring must be guided in an aligned manner to the lug and then placed thereon. a mechanical mounting is also made difficult by the fact that the volute springs are not securely retained to the cage when the locking elements are not yet inserted in the pockets. de-as no. 2,027,763 describes an overrunning clutch with locking elements in which the spring elements are defined by leaf springs which extend in the circumferential direction between the locking elements and are retained between the locking elements at the cage by snap members. this arrangement of the spring elements limits the structural space usable by the locking elements in the circumferential direction. objects of the invention it is an object of the invention to provide an overrunning clutch of the above-stated type in which the mounting of the spring elements and of the locking elements is simplified and in which the spring elements are arranged so that the locking elements can use the maximum structural space in the axial direction and in the circumferential direction. these and other objects and advantages of the invention will become obvious from the following detailed description. the invention the novel overrunning clutch of the invention with locking elements securely retained by a respective spring element in pockets having plane end faces and being part of a one-piece unitary cage which spring element includes a spring section extending axially adjacent to the locking element projection which acts upon the locking element with a spring force in the direction of engagement and a restraining area supported by the unitary cage, characterized in that the spring element (18) is made of flat material and the spring section (20) is defined by at least one bend (27,28) of the flat material, that the bend (27,28) extends in the area between the one radial plane (10 and 11, respectively) in which the frontal outer surface of the unitary cage (1) extends and the one radial plane (12 and 13, respectively) in which the end faces (8 and 9, respectively) of the pockets (4) near this outer surface extend with the greatest axial inside width (l), and that the restraining area (19) is retained in a self-locking manner on the unitary cage (1). during assembly, the spring element f flat material can easily be handled mechanically and after being inserted into the cage, the spring element is securely retained even before the insertion of the locking elements which considerably facilitates the assembly. the bend defining the spring section extends outside the pocket axially near the locking element and radially next to the end face of the cage, thus in an area in which the locking element is not placed anyway, thereby ensuring an optimum use of the structural space by the locking elements in case of need. the locking elements may thus be arranged adjacent to each other in the circumferential direction since the spring section of the spring element does not extend therebetween. in the axial direction, the locking elements can use the maximum inside width of the pocket. referring now to the drawings: fig. 1 is a partial cross-sectional view of a unitary cage having a spring clement without a locking element, fig. 2 is a partial cross sectional view of a unitary cage with the locking element inserted, fig. 3 is a view of a spring element, fig. 4 is a modification of the spring element, fig. 5 is a further modification of the spring element, fig. 6 illustrates a double spring element, fig. 7 is a partial cross-sectional view of an overrunning clutch when assembled, fig. 8 is a partial cross-sectional view of the overrunning clutch in the disassembled state, with the spring elements applying pressure to the locking elements, fig. 9 is a view taken along the line ix--ix of fig. 8, fig. 10 is a view of fig. 8 with the spring elements acting against the locking elements by tension, fig. 11 is a view of a spring element of fig. 10, fig. 12 is a further embodiment of a spring element and fig. 13 is a partial cross sectional view of an overrunning clutch with a spring element of fig. 12. in fig. 1 the unitary cage (1) includes rims (2,3) and has pockets (4) for housing locking elements (5) and the pockets (4) are defined by flat lateral surfaces (6,7) and frontal end faces (8,9). the greatest inside width (l) is between the frontal end faces (8,9). the frontal outer surface of one of the rims (2) and thus of the unitary cage (1) extends in a radial plane (10) and the other frontal outer surface of the unitary cage (1) and thus of the rim (3) extends in a radial plane (11). the frontal ends faces (8) of the pockets (4) extend in the area of the greatest axial inside width (l) in a radial plane (12) and the frontal end faces (9) extend correspondingly in a radial plane (13). in the embodiment of fig. 2, contact surfaces (14) are formed at the end faces (8) and slightly project into the pockets (4) and corresponding contact surfaces (15) are formed at the end faces (9). the unitary cage (1) is, for example punched form flat material, rolled and welded. extending between the pockets (4) are crossbars (16) provided with axial slots (17) which interrupt the crossbars (16) so that during making through rolling they have a corresponding bend i.e. the cage is not of polygonal shape. each locking element (5) is associated with a spring element (18) which is bent from a resilient flat material and includes a restraining area (19), a spring section (20) connected to the latter and a prolongation (21) which acts upon the locking element (5) in the direction of engagement by the spring force of the spring section (20). in the embodiments of figs. 1 to 11, the restraining area (19) is defined by a u-shaped clip (22) which includes a tongue (23). the clip (22) has one shank provided with an angled area (24) and one shank of the clip (22) is connected to the spring section via a bridge (25). the clip (22) is practically as long as the slot (17) thereby ensuring the axial fixation of the spring element (18) in the slot (17). to facilitate its insertion, the clip (22) is provided with slanted edges (26). the spring element (18) can be easily attached to the unitary cage (1) by being axially introduced into the cage (1) and then radially inserted into the slot (17) until the angled area (24) and the bridge (25) bear internally against the crossbar (16), with the tongue (23) snapping externally on the crossbar (16). the fit can be improved by a certain spring force of the clip (22). the spring elements are thus attached to the unitary cage (1) in self-locking manner even when the locking elements (5) are not yet inserted. after snapping the spring elements (18) into the slots (17), the locking elements (5) are inserted into the pockets (4), with the locking elements (5) bearing against the prolongations (21) so that they are acted upon in the direction of engagement by the spring force of the spring sections (20). the spring section (20) is defined by a v-shaped bend (27,28). the bend (27) extends into the space between the radial plane (10) and the radial plane (12) and the bend (28) extends into the space between the radial plane (11) and the radial plane (13). thus, the bends (27,28) extend next to the locking elements (5), and thence do not limit the possible axial length of the locking elements. this is favorable in the event the locking elements (5) should fill the unitary cage (1) as much as possible for transmission of high forces. since the resilient bends (27,28) are also not arranged between adjoining locking elements (5),the structural space of the unitary cage (1) is used as much as possible also in the circumferential direction. in the embodiment of figs. 1 and 3, the prolongations (21) of the bend (27,28) are defined by a continuous crosspiece (29) which is reinforced by a rib (30) and includes a central projection (31) for bearing against the locking elements (5). in the embodiment of fig. 4, the prolongations (2l) of the bends (27,24) are separate and in the embodiment of fig. 5, there is a resilient bend only at one side. illustrated in fig. 6 is a double spring element which includes two spring elements (18) of fig. 3 that are connected to each other via a link (32). this double spring element is used in an unitary cage with two rings of locking elements. a multiple spring element may also be structured in a corresponding manner. fig. 7 illustrates a unitary cage (1) which is installed between two races (33,34) and the spring elements (18) press with their prolongations (21) in the direction of engagement against the locking elements (5). the locking elements (5) are solid bodies without slots, bores or journals and are supported with an enlargement (35) in the pocket (4). the projection (2i) applies pressure to the locking elements (5) so that the enlargement (35) is supported by the opposing end face (7) of the unitary cage (1) as viewed in the circumferential direction. figs. 8 and 9 illustrate the unitary cage (1) in a state in which it is not yet installed between the races. by means of the spring elements (18) which apply pressure to the locking elements (5), the latter are respectively tilted and thus securely retained. the bends (27,28) extend between the radial planes (10,12 and 11,13, respectively) )(compare fig. 9) and between the locking elements (5) (compare fig. 8). figs. 10 and 11 illustrate a spring element (18) which embraces the associated locking element (5) and the crosspiece (29) acts under tension upon the locking element (5). the crosspiece includes a flexion (36) and is provided at a central location with the projection (31) which bears against the locking element (5) thereby attaining a self-alignment of the locking element (5). in the above embodiments, the restraining area (19) is attached to the slot (17). in the event, the unitary cage (1) does not have the slots (17), a spring element (18) can be used as in figs. 12 and 13. the restraining area (19) of this spring element (18) defines a closed frame (37) with an opening (38) being aligned with the pocket (4) when attached to the unitary cage (1) (compare fig. .13) and at each side of the frame (37) are double hooks (39,40). the spring element (18) is pushed with the double hook (39,40) through the respective pocket (4) and the frame (37) thus bears on the inside of the crossbar (16) in the vicinity of the pocket (4). the double hooks (39,40) overlap the crossbars (16) from atop and locking of the plane double hooks (39,40) is possible by the resiliency in the areas (41) of the frame (37). after the spring elements (18)have been snapped in, the locking elements (5) are inserted into the pockets (4). they are then securely retained by the crosspiece (29). it is not required to provide the spring section (27 and 28, respectively) by only one bend of the flat material. it may have several bends so as to be of w-shape or z-shape. it is also possible to make the cage (1) and the spring elements (18) together of one piece of plastic material. various modifications of the overrunning clutch of the invention may be made without departing from the spirit or scope thereof and it should be understood that the invention is intended to be limited only as defined in the appended claims.
146-898-449-235-01X	US	[ "US" ]	H01H35/34	1984-07-20T00:00:00	1984	[ "H01" ]	features of a condition responsive switch	a thermal or pressure responsive switch has a base mounting a set of electrical contacts. a metallic snap acting disc support, placed on the base is provided with a bore which receives a pin to transfer motion from a disc mounted on the support to the set of electrical contacts upon snapping of the disc. a first embodiment has a pressure converter received on the disc support. the peripheral edge of the snap acting disc is received on a seat formed in the converter with an annular reaction ridge formed on the support. a second embodiment has a pressure converter with the peripheral edge of the snap acting disc received on a seat formed in the disc support and an annular force ridge on the converter is adapted to contact the upper surface of the disc. in either embodiment a layer of low friction plastic can be placed on both faces of the disc. a third embodiment has a flat metallic disc support with a recessed portion for receiving the disc and a continuous stop surface. in all embodiments a cup shaped shell has a gasket received in a channel formed in a top end wall of the shell with the outer wall portion of the shell crimped over to compress the gasket and provide a gas tight seal. the top end wall of the shell can be formed with a portion displaced from the wall to serve as an automatic valve deflator which can be used with any of the embodiments.	1. a condition responsive switch having first and second electrical contacts mounted on a base member, the contacts movable relative to one another into and out of circuit engagement, the base provided with an upstanding annular wall with a top wall surface and a lower wall surface, a metallic disc support and motion transfer pin guide member having a bottom and a top received on the base, a condition responsive disc received on the support and guide member, the disc movable between convex and concave configurations upon the occurrence of selected conditions, a bore extending through the support and guide member from the top to the bottom, a diaphragm received on top of the support member and extending over the disk, a metallic cup shaped shell having a closed end wall with an annular gasket receiving channel formed in the outer peripheral portion of the closed end wall aligned with the outer periphery of the diaphragm, the cup having a downwardly depending wall with a free distal end portion, an annular gasket received in the channel, the cup shaped shell received over the support and guide member with the free distal end portion of the depending wall crimped onto the lower wall surface of the base to compress the gasket against the diaphragm to obtain an improved gas tight seal, the metallic disc support and motion transfer pin guide member being generally flat and having a curved annular recess formed in the top adjacent the outer periphery of said member whereby the diaphragm is forced into the annular recess by flexing the gasket, a motion transfer member slidingly received in the bore of the support and guide member and adapted to transfer motion from the condition responsive disc to the electrical contact members to cause relative motion of the contact members, and a fluid pressure receiving orifice formed in the closed end of the cup shaped shell. 2. a condition responsive switch according to claim 1 in which the end wall of the shell is formed with a stop surface adjacent the gasket receiving channel to limit the amount that the gasket can be compressed. 3. a condition responsive switch according to claim 1 in which a continuous annular overtravel stop surface is formed on the disc support and motion transfer pin guide member and so disposed in the path of the disk to prevent overtravel and overstressing of the disc. 4. a condition responsive switch having first and second electrical contacts mounted on a base member, the contacts movable relative to one another into and out of circuit engagement, the base provided with an upstanding annular wall with a top wall surface and a lower wall surface, a disc support and motion transfer pin guide member having a bottom and a top received on the base, a condition condition responsive disc received on the support and guide member, the disc movable between convex and concave configurations upon the occurrence of selected conditions, a bore extending through the support and guide member from the top to the bottom, a diaphragm received on top of the support member and extending over the disk, a metallic cup shaped shell having a closed end wall with an annular gasket receiving channel formed in the outer peripheral portion of the closed end wall aligned with the outer periphery of the diaphragm, the cup having a downwardly depending wall with a free distal end portion, an annular gasket received in the channel, the cup shaped shell received over the support and guide member with spaced portions of the free distal end portion of the depending wall of the shell crimped onto the lower wall surface of the base to compress the gasket against the diaphragm to obtain an improved gas tight seal, an annular groove formed in the outer portion of the upstanding wall of the base and a gasket disposed in the annular groove to provide a moisture seal, a motion transfer member slidingly received in the bore of the support and guide member and adapted to transfer motion from the condition responsive disc to the electrical contact members to cause relative motion of the contact members, and a fluid pressure receiving orifice formed in the closed end of the cup shaped shell. 5. a condition responsive switch according to claim 4 in which a continuous annular overtravel stop surface is formed on the disc support and motion transfer pin guide member and so disposed in the path of the disk to prevent overtravel and overstressing of the disc. 6. a condition responsive switch according to claim 4 in which the end wall of the shell is formed with a stop surface adjacent the gasket receiving channel to limit the amount that the gasket can be compressed. 7. a condition responsive switch having first and second electrical contacts mounted on a base member, the contacts movable relative to one another into and out of circuit engagement, the base provided with an upstanding annular wall with a top wall surface and a lower wall surface, a disc support and motion transfer pin guide member having a bottom and a top received on the base, a condition responsive disc received on the support and guide member, the disc movable between convex and concave configurations upon the occurrence of selected conditions, a bore extending through the support and guide member from the top to the bottom, a diaphragm receied on top of the support member and extending over the disk, a metallic cup shaped shell having a closed end wall with an annular gasket receiving channel formed in the outer peripheral portion of the closed end wall aligned with the outer periphery of the diaphragm, the cup having a downwardly depending wall with a free distal end portion, an annular gasket received in the channel, the cup shaped shell received over the support and guide member with the free distal end portion of the depending wall crimped onto the lower wall surface of the base to compress the gasket against the diaphragm to obtain an improved gas tight seal, a motion transfer member slidingly received in the bore of the support and guide member and adapted to transfer motion from the condition responsive disc to the electrical contact members to cause relative motion of the contact members, a fluid pressure receiving orifice formed in the closed end of the cup shaped shell and a port fitting having an axially extending bore sealingly attached to the closed end wall of the cup shaped member circumscribing the fluid pressure receiving orifice, the fluid pressure receiving orifice being formed by a pair of slits extending through the closed end of the cup shaped shell with the wall between the slits displaced a selected distance into the axially extending bore to serve as an automatic deflator element integrally formed with the closed end wall of the cup shaped shell. 8. a condition responsive switch according to claim 7 in which a continuous annular overtravel stop surface is formed on the disc support and motion transfer pin guide member and so disposed in the path of the disk to prevent overtravel and overstressing of the disc. 9. a condition responsive switch according to claim 7 in which the end wall of the shell is formed with a stop surface adjacent the gasket receiving channel to limit the amount that the gasket can be compressed.	background of the invention this invention relates generally to electrical switches and more particularly to switches using snap acting disc elements which move between opposite convex and concave configurations and which are actuated upon the occurrence of selected conditions such as pressure or temperature. conventional condition responsive switches have a contact arm movable between first and second switch positions prebiased to one switch position and have a dished snap acting disc element movable between opposite convex and concave configurations for moving the switch between switch positions in responsive to the occurrence of selected temperature or pressure conditions. such switches are intended to perform selected control functions in response to the occurrence of the selected temperature or pressure in a zone to be monitored. in automobiles there are a number of different applications requiring such switches however the specific conditions vary significantly in some cases thereby requiring different switch characteristics. in certain applications, such as when monitoring compressor pressures a reliable seal which will prevent loss of freon for an indefinite period of time is important as well as having a switch which will perform the selected control function as intended. in certain applications the outside dimensional characteristics of the housing is critical. that is when received in a compressor well, the outer dimensions of the switch after final assembly must be very closely controlled with no bulging of the housing due to assembly techniques being permitted. even the switch components need to be changed to some extent in order to meet various switching requirements. that is, when it is intended to monitor high pressures, a pressure converter may be required to convert pressure exposed to a diaphragm to a selected force level applied to the snap acting disc. in other applications in which a lower pressure is monitored the pressure converter is not always required. another characteristic which can vary from one application to another is whether the disc is used to provide contact closure force or contact open force. while the many requirements noted above can be met by conventional switches their use is limited by various factors such as undesirable variations in thermal or pressure response characteristics due to problems with seating of the disc or limiting overtravel of the disc without causing deleterious effects on the disc calibration. other limitations include inconsistent and unreliable seals for pressure responsive switches and high costs due, inter alia, to low volume production in order to serve segmented functional needs. summary of the invention it is an object of this invention to provide a novel and improved condition responsive switch; to provide such a switch having components which are easily and inexpensively manufactured and assembled for providing the switches with consistent and reliable condition response characteristics; to provide such a switch utilizing a dished disc element which is movable between convex and concave configurations with snap action in response to the occurrence of selected pressure or temperature conditions in which overtravel of the disc can be limited without deleteriously affecting the calibration of the disc and in which the disc is provided with an improved seat for longer life in which the calibration of the disc is maintained within narrow limits; and to provide such a novel and improved switch which is of simple, rugged and inexpensive construction. briefly, in accordance with the invention the novel and improved condition responsive electrical switch comprises a base of electrically insulative material formed with a side wall to define a switch cavity in which is mounted either a normally open or a normally closed set of electrical contacts. a metallic disc support and motion transfer pin guide member is placed on top of the side wall. a motion transfer pin is received in a bore formed in the disc support and pin guide member to transfer motion from a snap acting disc element mounted on the disc support and pin guide member to the set of electrical contacts upon snapping of the disc element. according to a first embodiment of the invention the switch includes a pressure converter which is received on the disc support and pin guide member and is guided for sliding movement by an upstanding wall of the member. the peripheral edge of the snap acting disc is received on a seat formed in the converter with the lower surface of the disc contacting an annular reaction ridge formed on the support and guide member. according to a second embodiment of the invention the switch includes a pressure converter also received on the disc support and pin guide member but with the peripheral edge of the snap acting disc received on a seat formed in the disc element support and pin guide member and an annular force ridge formed on the converter is adapted to contact the upper surface of the disc element. in either embodiment a layer of low friction plastic material can be placed on either or both sides of the disc element in order to provide consistent calibration of the switch. according to a third embodiment of the invention the switch includes a flat metallic disc support with a recessed portion for receiving the disc element and a continuous stop surface for preventing overtravel of the disc. in all of the embodiments a cup shaped shell has a gasket received in a channel formed in a top end wall of the shell with the outer wall portion of the shell crimped over, either continuously or in castellated fashion, to compress the gasket and provide a gas tight seal. according to another feature of the invention, the top end wall of the shell can be formed with a portion lanced and displaced a selected distance from the wall to serve as an automatic valve deflator. by means of the invention a variety of switch types is provided utilizing many common component parts, such as the base, shell, diaphragm and sealing gasket to achieve advantageous manufacturing economies. brief description of the drawings other objects, advantages and details of the condition responsive device of this invention appear in the following detailed description of preferred embodiments of the invention, the detailed description referring to the drawings in which: fig. 1 is a sectional view along the longitudinal axis of a normally closed switch made in accordance with a first embodiment of this invention; fig. 2 is a sectional view to fig. 1 of a normally open switch otherwise the same as the switch shown in fig. 1; fig. 3 is a sectional view along the longitudinal axis of a normally open switch made in accordance with a second embodiment of this invention; fig. 4 is a sectional view similar to fig. 3 of a normally closed switch otherwise the same as the switch shown in fig. 3; fig. 5 is a sectional view along the longitudinal axis of a normally open switch made in accordance with a third embodiment of the invention; fig. 6 is a sectional view along the longitudinal axis of a combination port fitting and valve deflator useful with the above embodiments; and fig. 7 is a top plan view of the fig. 6 device. dimensions of certain of the parts as shown in the drawings may have been modified to illustrate the invention with more clarity. corresponding reference characters indicate corresponding parts throughout the several views of the drawings. description of preferred embodiments referring to the drawings, numeral 10 in figs. 1 and 2 indicates a condition responsive device of this invention which includes a base 12 preferably molded in one piece using a suitable rigid electrically insulative material such as glass filled nylon or the like. the base preferably has a cylindrical configuration including a cylindrical intermediate part 14, a bottom wall 16 and cylindrical side wall 18 which has a flat distal mounting surface 20. intermediate part 14 is formed with a bore 22 to form a terminal enclosure. bottom wall 16 is provided with first and second apertures 24 and 26 and receive therethrough terminals members 28 and 30 respectively. terminal 28 has a shelf 32 received on wall 16 and a platform 34 spaced above wall 16 and extending away from terminal 30. a flexible, electrically conductive movable contact arm 36 formed of material having good spring characteristics such as beryllium copper or the like is mounted on platform 34 in cantilever fashion by suitable means such as rivet 38. a movable contact 40 of suitable contact material is mounted on the free distal end of arm 36 in any conventional manner such as by welding and is adapted to move into and out of circuit engagement with a stationary contact 42 mounted on a shelf 44 of terminal 30 received on wall 16. contact 42 formed of suitable contact material is shown as an inlaid portion of shell 44 however the contact could be separately attached if desired. a dimple 46 is preferably formed in movable arm 36 provide more uniform motion transfer characteristics from motion transfer pin 48 to be described below. a metallic disc element support and motion transfer pin guide member 50 is received on the flat top surface 20 of base 12 and comprises a generally circular bottom wall 52 with a centrally disposed downwardly extending wall 54 forming a bore adapted to slidingly receive motion transfer pin 48. an annular force reaction ridge 56 is formed in wall 52 and is adapted to engage a snap acting disc as described below. support and guide member 50 is also provided with an upstanding wall 58 which slidingly receives a pressure converter 60 formed with a disc receiving seat 62 in its lower surface adjacent the outer periphery of the converter. a snap acting disc 64 shown in fig. 1 in its normal downwardly facing convex configuration has its outer peripheral edge received on seat 62. converter 60 is recessed at 66 to permit disc 64 to snap through to its opposite downwardly facing concave configuration upon the occurrence of preselected conditions. disc 64 is formed of a metal spring material such as stainless steel or a thermostat bimetal or the like which is adapted to move between original and inverted configurations in response to the occurrence of selected pressure or temperature conditions or the like in conventional manner. in order to provide more consistent calibration of the device, it is preferred to interpose a film 68 of kapton or the like between disc 64 and seat 62. a metallic pressure divider and support ring 70 is placed on the top edge of wall 58 with a flexible diaphragm 72 of teflon coated kapton or the like disposed over the opening in ring 70. a cup shaped metallic shell 74 has a top end wall 76 and is preferably deep drawn to form a depending side wall 78 with a gasket receiving channel 80 formed in top wall 76 adjacent the outer periphery of the shell. an annular stop surface 82 is also formed in top wall 76 for a purpose to be described below. a gasket 84 such as a suitable, compressable "o" ring is placed in channel 84 and shell 74 is placed over diaphragm 72, ring 70 and member 50 and is drawn against these elements to compress gasket 84 a selected amount determined by the location of stop surface 82. the lower distal end 86 of depending wall 78 is crimped over a lower surface 88 of base 12. this crimp can be formed entirely around the circumference of base 12, or as shown in fig. 1 the crimp may be castellated so that spaced tab portions 90 clamp surface 88 while the remainder of distal end 86 forms a guide surface 92 against which a snap ring for mounting the switch can be placed without placing undue torque on the snap ring. gasket 84 by being compressed to an accurately controllable degree directly through metallic ring 70 and metallic wall 58 provides a very effective gas tight seal to prevent leakage of fluid being monitored. when the crimp of the shell is castellated, it is preferred to include an "o" ring gasket 94 in a groove formed in the outer periphery of side wall 18 to provide an effective salt spray and moisture seal for the switch components. in assembling the switch, platform 34 is bent downwardly to provide a selected contact opening force. support and guide member 50 is placed on surface 20 and the distance between dimple 46 with the contact closed to the lower surface of disc 64 in its normal downwardly convex configuration is measured so that pin 48 formed of suitable material such as glass, plastic or ceramic of a precise, selected length can be provided to obtain desired operating characteristics. ceramic is particularly useful in that slightly overlong pins can easily be ground to the correct length to compensate in variations in manufacturing, for example slight variations in the thickness which may exist from batch to batch. a suitable orifice 96 may provided in top wall 76 so that switch 10 can be placed in position to monitor the pressure of a fluid at a desired location. thus with a first fluid pressure applied to diaphragm 72 the disc element 64 is normally disposed on the configuration shown in fig. 1 with the contacts maintained in the closed, circuit engaging state through the force exerted on arm 36 via disc 64. pressure converter 60, aligned with the opening in ring support 70 is movable in response to movement of the diaphragm as the diaphragm moves in response to variation in fluid pressures applied to the diaphragm through orifice 96. the dished disc element is positioned to be engaged on one side by the pressure converter, and reaction ridge means 56 are arranged to engage an opposite side of the dished disc element. when the applied fluid pressure is increased to the selected actuating pressure of the switch 10, the disc element 64 moves with snap action to an inverted dished configuration for permitting contact arm 36 to move way from stationary contact 42. overtravel of disc 64 is prevented by a continuous annular surface 69 formed on converter 60. subsequently, when the applied fluid pressure is lowered to a selected reset pressure level for the switch 10, movement of the diaphragm 72 allows the pressure converter 60 to reduce the force on the snap acting element 64 so that the element returns with snap action to the configuration shown in fig. 1. the support and guide member 50, as shown in fig. 1 may conveniently be stamped out of a suitable metallic piece and combines the functions of acting as a guide for the pressure converter and the motion transfer pin, a disc support, an overtravel preventing means and a structural member to transfer clamping force to provide an effective gas tight seal. device 10.1 shown in fig. 2 is a normally open switch in which the disc force is used to maintain the contacts in an open state. generally it is preferred to use the disc to provide contact closing forces but in certain applications it may be preferred to ensure that even momentary contact closure is prevented due to vibration or the like. thus stationary contact 42.1 formed on terminal 30.1 is spaced above wall 16 of base 14 and movable contact 40.1 is mounted on the opposite side of movable contact arm 36.1 compared to the fig. 1 structure. a dielectric layer 43 is preferably placed on top of shelf 31 of terminal 30.1 to prevent contact arm 36.1 from making electrical contact with shelf 31. additionally, a second layer 68.1 of friction reducing plastic material of kapton or the like is disposed on the lower side of disc 64. placement of layers 68 and 68.1 on opposite sides of disc 64 provides improved consistency of calibration of the switch and can be used advantageously whenever the pressure converter is employed. in other respects the structure shown in fig. 2 and in subsequent figures showing parts which are common and are shown and described in relation to fig. 1 will not be repeated. switch 10.2 shown in fig. 3 utilizes a modified disc support and guide member 50.1 and pressure converter 60.1. the fig. 3 switch provides a normally open switch similar to fig. 2 however it also provides contacts closure force by the disc. disc support and guide member 50.1 is formed with a disc seat 50.2 adjacent its outer periphery while a force applying annular ridge 60.2 is formed on the bottom surface of pressure converter 60.1. although not shown, a friction reducing layer can be disposed on one or both sides of disc 64 as in the figs. 1, 2 constructions. it will be seen that an increase in pressure applied to diaphragm 72 to the actuation level will place a force on disc 64 through force applying ridge 60.2 while seat 50.2 applies a reaction to cause the disc to snap from the downwardly concave configuration shown in fig. 3 to a downwardly convex configuration thereby transferring motion through pin 48 to movable arm 36 to cause contact 40 to engage stationary contact 42 with a force provided by disc 64. as in the previous embodiment, when the applied pressure drops below a selected reset value disc 64 will snap back to the configuration shown in fig. 3 and allow the contacts to open through the bias on arm 36 caused by the position of platform 34. support and guide member 50.1, as in the figs. 1 and 2 embodiment combines the several functions of serving as guide surface 58.1 and 54.1 respectively for pressure converter 60.1 and motion transfer pin 48, as a disc support, an overtravel preventing means by a continuous surface 50.3 and as a structural member 58.1 to transfer clamping force to provide an effective gas tight seal. as shown in fig. 3 member 50.1 is formed by machining to provide an extremely accurate and consistent placement of the component parts of the switch relative to one another to thereby introduce fewer variations in spacing from device to device and permit a smaller grouping of devices in a selected narrow calibration range. that is, wall 58.1 is formed with a precise right angle with bottom wall 52.1 so that it is received on flat surface 20 of base 12 with the same dimensional relationship from one device to another whereas in the stamped support and guide member some variations in dimensional relationships from one device to another may occur as the stamping tools start to wear, etc. the switch of fig. 4 is the same as that of fig. 3 except that it is a normally closed switch with the disc being used to provide a positive force to prevent contact closure when in the actuated condition. as in fig. 2 stationary contact 42.1 is spaced above bottom wall 16 with contact 40.1 mounted on the opposite side of movable contact arm 36.1 compared to the structure of fig. 3. dielectric layer 43 is placed on shelf 31 of terminal 30.1 the same reason as in the fig. 2 structure. an increase in applied pressure to a selected actuation pressure will cause disc 64 to snap from the downwardly facing concave configuration shown in fig. 4 to its opposite downwardly facing convex configuration transferring motion to arm 36.1 through pin 48 to thereby force contact 40.1 away from stationary contact 42.1 and maintain it away from the stationary contact with a positive force applied by disc 64. when the applied pressure drops below the reset value, the disc will be allowed to snap back to the fig. 4 configuration and the contacts will close through the bias applied to arm 36.1 by platform 34. fig. 5 depicts an embodiment particularly suitable for use with lower pressures where a pressure converter is not required. in this embodiment a flat metallic disc support and pin guide member 50.4 is formed which can conveniently be used with the same cup shaped shell 74 and gasket 84. member 50.4 is formed with a centrally disposed bore 50.6 to serve as a guide for a motion transfer pin 48.1. the height of member 50.4 is selected to be the same as the combination of support ring 70 and the disc support and guide member 50 and 50.1 of the previous embodiments. disc support and guide member 50.4 is formed with a disc seat 50.8 in a recess 50.10 formed in the top surface of member 50.4. it will be noted that the disc 64.1 extends beneath surface 82 of shell 74 so that surface 82 cannot be relied on to prevent excessive compression of gasket 84 as in the previous embodiments. this is caused by the need for maximizing motion transfer pin travel. that is, a disc having a smaller diameter so that recess 50.10 would not be directly beneath surface 82 would provide less pin travel. in order to avoid the possibility of the gasket from squeezing beneath surface 82 and thereby affecting the efficacy of the seal a recessed area 50.12 having a smooth curve is formed in the upper surface of member 50.4 immediately adjacent the outer periphery thereof. thus an effective seal can be obtained by placing shell 74 with gasket 84 received in channel 80 over support and guide member 50.4 and wall 18 of base 12 and applying a selected force to compress gasket 84 and then crimp wall portion 78 onto lower surface 88 of base 12. as shown in this figure, the crimp is placed completely around shell 74 by rolling over distal end portion 92. with a crimp completely around base 12 the need for a gasket in the outer surface of wall 18 is obviated. in general, a 360 degree crimp is employed when the switch is mounted utilizing a port fitting such as that described below in connection with figs. 6 and 7. when the switch is mounted by means of a snap ring cooperating with a groove in a switch receiving well, the castellated crimp shown in figs. 1-4 is preferred. support and guide member 50.4 has a continuous overtravel limit surface 50.14 disposed in the recessed area 50.10 to limit travel of disc 64.1 and avoid deleterious effects on its calibration which could result from either an absence of a stop surface or a discontinuous surface which could allow twisting of the disc. the use of a metal disc support, particularly as shown in fig. 5 rather than prior art plastic supports avoid the problem of having the disc digging into the plastic upon continued operation of the switch and eventually dislodging plastic particles which could become wedged between the disc and its support upsetting designed dimensional relationships. in addition, the relatively massive disc support of fig. 5 serves as a heat sink which can provide greater stability of calibration in some cases, for example where the switch is operating on fluid which is subject to temperature changed. the heat sink would tend to stabilize the temperature of the disc and therefore its calibration since the modulus of elasticity varies with temperature. it will be appreciated that the structure of fig. 5 could be used as either a temperature or a pressure responsive device or both. that is, if disc 64.1 is formed of bimetal, the switch can be utilized to sense temperature variations of a heat source and be adapted to actuate from the configuration shown to its opposite configuration upon selected temperature conditions. the fig. 5 switch as well as the other embodiments described above, could also be used to monitor both temperature and pressure by using a bimetal disc and be adapted to actuate upon a combination of selected fluid pressure and temperature conditions. if the disc is formed of a monometal, then it can be used solely to monitor fluid pressure. fig. 6 shows a port fitting 100 which is provided with an automatic valve deflator in a simple yet effective manner and which can be used with any of the above embodiments. port fitting 100 is hermetically attached to cap 74 as by welding thereto completely around the periphery of the port fitting. as seen in fig. 6 a circular flange 102 fits into the groove formed on the opposite side of stop surface 82 of top wall 76. top wall 76 is lanced forming parallel slits 104, 106 and surface portion 108 is drawn upwardly displacing it above wall 76 a selected distance. as port fitting 100, provided with a threaded bore 110 is screwed onto a fitting having a needle type valve member, surface 108 is adapted to contact the valve member and depress it as the port fitting is screwed into place thereby automatically opening the valve. it should be understood that although particular embodiments of the condition responsive switch of this have been described by way of illustrating the invention, the invention includes all modifications and equivalents of the disclosed embodiments falling within the scope of the appended claims.
147-849-635-015-366	US	[ "US" ]	A63B21/02	2010-08-03T00:00:00	2010	[ "A63" ]	pull exerciser	a pull exerciser includes a bar and an engaging hole extending from an end through the other end of the bar. the pull exerciser further includes two handles each having a grip portion and a connecting portion spaced from the grip portion along a longitudinal axis and a cord mounting section intermediate the grip portion and the connecting portion. the connecting portion of each handle is releasably mounted to one of the ends of the bar. the cord mounting section of each handle includes three through-holes spaced along the longitudinal axis. an end of the first elastic cord is extended through and retained in the through-holes of the cord mounting section of one of the handles. the other end of the first elastic cord or an end of a second elastic cord can be extended through and retained in the through-holes of the cord mounting section of the other handle.	1. a pull exerciser comprising, in combination: a bar including first and second ends spaced along a first longitudinal axis and an engaging hole extending from the first end through the second end along the first longitudinal axis; first and second handles each including a grip portion and a connecting portion spaced from the grip portion along a second longitudinal axis and a cord mounting section intermediate the grip portion and the connecting portion, with the connecting portion of each of the first and second handles releasably mounted to one of the first and second ends of the bar, with the cord mounting section of each of the first and second handles including first, second, and third through-holes spaced along the second longitudinal axis, a first elastic cord including first and second ends, with the first end of the first elastic cord extended through and retained in the first, second, and third through-holes of the cord mounting section of the first handle, with each of the first and second ends of the bar including a groove having a first longitudinal section extending from one of the first and second ends towards but spaced from the other of the first and second ends of the bar, with the groove further including a transverse section extending perpendicularly to the longitudinal section from the longitudinal section, with the connecting portion of each of the first and second handles including an engaging member engaged in the groove of one of the first and second handles by moving through the longitudinal section of the groove of one of the first and second ends of the bar along the first longitudinal section and then moving into the transverse section of the groove of one of the first and second ends of the bar, with a flange formed between the connecting portion and the cord mounting section of each of first and second handles, with the pull exerciser further comprising, in combination: a padding member mounted around the connecting portion of the cord mounting section of each of the first and second handles and abutting the flange, with the padding member pressing against an end face of one of the first and second ends of the bar and deformed along the second longitudinal axis before the engaging member is moved into the transverse section, with resilient returning force of the deformed padding member exerting a longitudinal force along the second longitudinal axis against a lateral wall of the transverse section perpendicular to the first longitudinal axis when the engaging member is engaged in the transverse section. 2. the pull exerciser as claimed in claim 1 , with the second end of the first elastic cord extended through and retained in the first, second, and third through-holes of the cord mounting section of the second handle. 3. the pull exerciser as claimed in claim 1 , further comprising, in combination: a flange formed between the grip portion and the cord mounting section of each of the first and second handles; and a padding member mounted around the grip portion and abutting the flange, preventing the flange from moving to the cord mounting section. 4. the pull exerciser as claimed in claim 1 , with the first, second, and third through-holes of the cord mounting section of each of the first and second handles being parallel to each other, with the first through-hole located intermediate the first, second and third through-holes along the first longitudinal axis, with the first end of the elastic cord extending through the first, second, and third through-holes in sequence. 5. the pull exerciser as claimed in claim 1 , with the first, second, and third through-holes of the cord mounting section of each of the first and second handles being at a non-parallel angle to each other. 6. the pull exerciser as claimed in claim 5 , with the first, second, and third through-holes of the cord mounting section of each of the first and second handles being at 60° to each other. 7. the pull exerciser as claimed in claim 1 , further comprising, in combination: a second elastic cord having first and second ends, with the first end of the second elastic cord extended through and retained in the first, second, and third cord mounting section of the second handle. 8. the pull exerciser as claimed in claim 7 , further comprising, in combination: an end piece mounted to the second end of each of the first and second elastic cords; and a loop releasably engaged with the end piece on the second end of each of the first and second handles.	background of the invention the present invention relates to a pull exerciser and, more particularly, to a pull exerciser having a length-adjustable elastic cord while allowing easy assembly. pull exercises with stretchable elastic cords allow exercising of selected muscles such as muscles of the chest and the arms. some of the pull exercisers with stretchable elastic cords are lightweight and small in size to allow easy carriage. one type of such pull exercisers includes a bar and an elastic cord having two ends respectively attached to two ends of the bar. in use, the user positions an intermediate portion of the elastic cord with one or both feet to retain the elastic cord and grips the ends of the bar with both hands and repeatedly raises the bar to the chest or head level for exercising the muscles of the chest and the arms. u.s. pat. no. 7,326,157 discloses an exercise device including a bar and two tubular handles releasably coupled to two ends of the bar. an attachment member is attached to each handle. the attachment members are releasably coupled with two end pieces respectively on two ends of an elastic member via hooks. however, assembly of the exercise device is troublesome and costly. furthermore, a plug must be inserted into each end of the elastic member to enlarge the diameter before the end of the elastic member is engaged with one of the end pieces, which is time-consuming. furthermore, the exercise device is not suitable for different users having different heights. thus, a need exists for a pull exerciser having a length-adjustable elastic cord while allowing easy assembly. brief summary of the invention the present invention solves this need and other problems in the field of adjustable pull exercisers by providing, in a preferred form, a pull exerciser including a bar having first and second ends spaced along a first longitudinal axis and an engaging hole extending from the first end through the second end along the first longitudinal axis. the pull exerciser further includes first and second handles each having a grip portion and a connecting portion spaced from the grip portion along a second longitudinal axis and a cord mounting section intermediate the grip portion and the connecting portion. the connecting portion of each of the first and second handles is releasably mounted to one of the first and second ends of the bar. the cord mounting section of each of the first and second handles includes first, second, and third through-holes spaced along the second longitudinal axis. a first elastic cord includes first and second ends. the first end of the first elastic cord extends through and is retained in the first, second, and third through-holes of the cord mounting section of the first handle. in a preferred form, the second end of the first elastic cord is extended through and retained in the first, second, and third through-holes of the cord mounting section of the first handle. in another preferred form, an end of a second elastic cord is extended through and retained in the first, second, and third cord mounting section of the second handle. in a preferred form, the first, second, and third through-holes are parallel to each other. in another preferred form, the first, second, and third through-holes are at a non-parallel angle to each other. the present invention will become clearer in light of the following detailed description of illustrative embodiments of this invention described in connection with the drawings. description of the drawings the illustrative embodiments may best be described by reference to the accompanying drawings where: fig. 1 shows a partial, exploded, perspective view of a pull exerciser of an embodiment according to the preferred teachings of the present invention. fig. 2 shows a partial, perspective view of the pull exerciser of fig. 1 with an end of an elastic cord extended through a first through-hole of a handle. fig. 3 shows a partial, perspective view of the pull exerciser of fig. 2 with the end of the elastic cord extended through a second through-hole of the handle. fig. 4 shows a partial, perspective view of the pull exerciser of fig. 3 with the end of the elastic cord extended through a third through-hole of the handle. fig. 5 shows a partial, top view of the pull exerciser of fig. 1 after assembly. fig. 6 shows a cross sectional view of the pull exerciser of fig. 5 according to section line 6 - 6 of fig. 5 . fig. 7 shows a partial, perspective view of the pull exerciser of fig. 1 after assembly. fig. 8 shows a perspective view illustrating a first example of use of the pull exerciser of fig. 1 . fig. 9 shows a perspective view illustrating a second example of use of the pull exerciser of fig. 1 . fig. 10 shows a perspective view illustrating a third example of use of the pull exerciser of fig. 1 . fig. 11 shows a perspective view illustrating a fourth example of use of the pull exerciser of fig. 1 . fig. 12 shows a perspective view of the pull exerciser of fig. 1 with an operative length of the elastic cord shortened. fig. 13 shows a partial, perspective view of a pull exerciser of another embodiment according to the preferred teachings of the present invention. fig. 14 shows a perspective illustrating use of the pull exerciser of fig. 13 . fig. 15 shows a partial, exploded, perspective view of a pull exerciser of a further embodiment according to the preferred teachings of the present invention. all figures are drawn for ease of explanation of the basic teachings of the present invention only; the extensions of the figures with respect to number, position, relationship, and dimensions of the parts to form the preferred embodiments will be explained or will be within the skill of the art after the following teachings of the present invention have been read and understood. further, the exact dimensions and dimensional proportions to conform to specific force, weight, strength, and similar requirements will likewise be within the skill of the art after the following teachings of the present invention have been read and understood. where used in the various figures of the drawings, the same numerals designate the same or similar parts. furthermore, when the terms “first”, “second”, “third”, “inner”, “outer”, “end”, “portion”, “section”, “longitudinal”, “lateral”, “length”, and similar terms are used herein, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings and are utilized only to facilitate describing the invention. detailed description of the invention a pull exerciser according to the preferred teachings of the present invention is shown in the drawings and generally designated 10 . in preferred forms shown in figs. 1-15 , pull exerciser 10 includes a bar 3 having two ends 31 spaced along a first longitudinal axis. an engaging hole 32 extends from one of ends 31 through the other end 31 along the first longitudinal axis. each end 31 of bar 3 includes two diametrically disposed grooves 30 each having a longitudinal section 33 extending from the end 31 towards but spaced from the other end 31 . each groove 30 further includes a transverse section 34 extending perpendicularly to the longitudinal section 33 from an inner end of longitudinal section 33 . it can be appreciated that transverse section 34 can extend from a point other than the inner end of longitudinal section 33 . in the preferred forms shown in figs. 1-15 , pull exerciser 10 further includes first and second handles 4 each having a grip portion 21 and a connecting portion 22 spaced from grip portion 21 along a second longitudinal axis and a cord mounting section 40 intermediate grip portion 21 and connecting portion 22 . a first flange 44 is formed between grip portion 21 and an end of cord mounting section 40 of each of first and second handles 4 . a second flange 42 is formed on connecting portion 22 and the other end of cord mounting section 40 of each of first and second handles 4 . thus, cord mounting section 40 is intermediate first and second flanges 42 and 44 . in the preferred forms shown in figs. 1-15 , a padding member 25 made of foam material or the like is mounted around grip portion 21 of each of first and second handles 4 to provide firm gripping by a user. an end of padding member 25 abuts against first flange 44 , preventing padding member 25 from entering cord mounting section 40 . in the preferred forms shown in figs. 1-15 , connecting portion 22 of each of first and second handles 4 includes an engaging member 221 in the form of a pin extending through a through-hole of connecting portion 22 extending perpendicularly to the second longitudinal axis, leaving two ends of engaging member 221 exposed out of connecting portion 22 . a padding member 64 made of resilient material such as rubber is mounted around connecting portion 22 and abuts second flange 42 . in the preferred forms shown in figs. 1-15 , cord mounting section 40 of each of first and second handles 4 includes first, second, and third through-holes 46 , 52 , and 58 spaced along the second longitudinal axis with first through-hole 46 intermediate second and third through-holes 52 and 58 . first through-hole 46 has first and second openings 48 and 50 . second through-hole 52 has first and second openings 54 and 56 . third through-hole 58 has first and second openings 60 and 62 . in the preferred forms shown in figs. 1-14 , first, second, and third through-holes 46 , 52 , and 58 are parallel to each other. first openings 48 , 54 , and 60 are aligned with each other along the second longitudinal axis. second openings 50 , 56 , and 62 are aligned with each other along the second longitudinal axis. in the preferred form shown in fig. 15 , first, second, and third through-holes 46 , 52 , and 58 are at a non-parallel angle in the order of 60° to each other. in assembly, connecting portion 22 of each of first and second handles 4 is inserted into an end of engaging hole 32 via one of ends 31 of bar 3 until the exposed ends of engaging member 221 reach the inner ends of longitudinal sections 33 of grooves 30 . it can be appreciated that the second longitudinal axis of each of first and second handles 4 is coincident to the first longitudinal axis of bar 3 . furthermore, padding member 64 of each of first and second handles 4 presses against an end face of one of ends 31 of bar 3 and is slightly deformed along the second longitudinal axis. then, each of first and second handles 4 is rotated through an angle to move the exposed ends of engaging member 221 into transverse section 34 . disengagement of each of first and second handles 4 from bar 3 by moving first and second handles 4 along the first or second longitudinal axis is, thus, avoided. furthermore, the resilient returning force of the deformed padding members 64 exert a longitudinal force along the second longitudinal axis against a lateral wall of each transverse section 34 perpendicular to the first longitudinal axis, further avoiding disengagement of first and second handles 4 . namely, slackening between bar 3 and first and second handles 4 is avoided. first and second handles 4 can be detached from bar 3 through reverse operation. pull exerciser 10 can be utilized with one or more elastic cords 1 according to needs. in the preferred forms shown in figs. 1-12 and 15 , pull exercisers 10 is utilized with an elastic cord 1 having first and second ends 11 and 12 and an intermediate portion 13 between first and second ends 11 and 12 . specifically, each of first and second ends 11 and 12 of elastic cord 1 extends through first, second, and third through-holes 46 , 52 , and 58 of cord mounting section 40 of one of first and second handles 4 . each of first and second ends 11 and 12 of elastic cord 1 can be extended through first, second, and third through-holes 46 , 52 , and 58 in sequence. specifically, first end 11 of elastic cord 1 is extended through second opening 50 and then first opening 48 of first through-hole 46 of cord mounting section 40 of first handle 4 . next, first end 11 of elastic cord 1 is extended through first opening 54 and then second opening 56 of second through-hole 52 . next, first end 11 of elastic cord 1 is extended through second opening 62 and then first opening 60 of third through-hole 58 . such a winding manner securely retains first end 11 of elastic cord 1 on cord mounting section 40 of first handle 4 . when elastic cord 1 is pulled, a section of first end 11 of elastic cord 1 extending through third through-hole 59 effectively prevents disengagement of first end 11 of elastic cord 1 . likewise, second end 12 of elastic cord 2 is extended through first, second, and third through-holes 46 , 52 , and 58 of cord mounting section 40 of second handle 4 , obtaining the same advantages. in the preferred form shown in fig. 15 , the disengagement preventing effect is further enhanced by the non-parallel relation between first, second, and third through-holes 46 , 52 , and 58 of cord mounting section 40 of each of first and second handles 4 . pull exercisers shown in figs. 1-12 and 15 can be used in different ways. in an example shown in fig. 8 , the user grips bar 3 with two feet stepping on intermediate portion 13 . the user can raise bar 3 for exercising purposes. in another example shown in fig. 9 , the user places bar 3 at his or her back of his or her neck and grips first and second handles 4 . the user can raise bar 3 and bend and stretch his or her legs to obtain a different exercising effect. in a further example shown in fig. 10 , the user grips first and second handles 4 with one foot stepping on intermediate portion 13 . the user can raise bar 3 and bend and stretch his or her legs to obtain another exercising effect. in still another example shown in fig. 11 , bar 3 can be detached, and the user grips first and second handles 4 with two feet stepping on intermediate portion 13 . the user can raise first and second handles 4 to obtain another exercising effect. in yet another example shown in fig. 12 , a longer section of each of first and second ends 11 and 12 of elastic cord 1 can be left after passing through third through-holes 58 of cord mounting sections 40 . this shortens the operative length of elastic cord 1 and increases the elastic coefficient of elastic cord 1 . different exercising effects can, thus, be obtained. furthermore, pull exerciser 10 according to the preferred teachings of the present invention can be utilized with different users of different heights by adjusting the operative length of elastic cord 1 . in the preferred form shown in figs. 13 and 14 , pull exerciser 10 is utilized with two elastic cords 1 . first end 11 of each elastic cord 1 extends through first, second, and third through-holes 46 , 52 , and 58 of cord mounting section 40 of one of first and second handles 4 . an attachment member 14 is mounted to second end 12 of each elastic cord 1 . a buckle 28 is engaged with each attachment member 14 . a loop 66 such as a rubber ring can be removably connected to each buckle 28 . in use, the user holds bar 3 with two feet received in loops 66 . the user can raise bar 3 for exercising purposes. it can be appreciated that attachment members 14 at second ends 12 of elastic cords 1 can be engaged with screws or pegs fixed to a wall to obtain a different exercising effect. now that the basic teachings of the present invention have been explained, many extensions and variations will be obvious to one having ordinary skill in the art. for example, engaging hole 32 can be replaced with two recesses respectively formed in two end faces of bar 3 with each groove 30 in communication with one of the recesses. furthermore, engaging member 221 can be replaced with two diametrically disposed protrusions on an outer periphery of connecting portion 22 . further, each end 31 of bar 3 can include only one groove 31 , and engaging member 221 can be in the form of a pin having only one exposed end or be in the form of a protrusion. further, first and second ends 11 and 12 of elastic cord 1 can be extended through first, second, and third through-holes 46 , 52 , and 58 in other sequences. thus since the invention disclosed herein may be embodied in other specific forms without departing from the spirit or general characteristics thereof, some of which forms have been indicated, the embodiments described herein are to be considered in all respects illustrative and not restrictive. the scope of the invention is to be indicated by the appended claims, rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.
148-180-332-429-072	US	[ "WO", "US" ]	H05K5/00,G06F1/16,G06F3/01	2013-05-13T00:00:00	2013	[ "H05", "G06" ]	systems, articles and methods for wearable electronic devices that accommodate different user forms	wearable electronic devices that provide robustness against variations in user form are described. the wearable electronic devices include a set of pod structures arranged in an annular configuration having a variable circumference, with adaptive physical coupling between adjacent pairs of pod structures. adaptive physical coupling advantageously accommodates different user sizes, forms, and movements and enhances the overall ergonomics of the wearable electronic devices. adaptive physical coupling also maintains substantially constant and/or equal angular spacing between components of the wearable electronic devices regardless of the form of the user.	claims 1 . an annular wearable electronic device having a variable circumference, the annular wearable electronic device comprising: a first pod structure positioned at least approximately on the circumference, wherein the first pod structure includes a first sensor to detect an input from a user; a second pod structure positioned at least approximately on the circumference, wherein the second pod structure includes a second sensor to detect an input from the user, and wherein the first and the second sensors are physically spaced apart from one another by a circumferential spacing c and by an angular spacing θ; and at least one adaptive coupler that physically couples the first pod structure and the second pod structure, wherein a length of the at least one adaptive coupler is variable and the circumferential spacing c between the first and second sensors is variable, and wherein the angular spacing θ between the first and the second sensors is at least approximately constant regardless of the length of the at least one adaptive coupler. 2. the annular wearable electronic device of claim 1 wherein at least one of the first sensor and the second sensor is selected from the group consisting of: an electromyography sensor; a magnetomyography sensor; a mechanomyography sensor; a blood pressure sensor; a heart rate sensor; an accelerometer; a gyroscope; a compass; and a thermometer. 3. the annular wearable electronic device of claim 1 wherein the first pod structure includes electrical circuitry and the second pod structure includes electrical circuitry, and wherein at least one of the first pod structure and the second pod structure includes at least one component selected from the group consisting of: an amplification circuit, an analog-to-digital conversion circuit, a battery, a wireless transmitter, and a connector port. 4. the annular wearable electronic device of claim 3, further comprising: at least one electrical coupling between the electrical circuitry of the first pod structure and the electrical circuitry of the second pod structure. 5. the annular wearable electronic device of claim 1 wherein the at least one adaptive coupler includes at least one elastic band. 6. the annular wearable electronic device of claim 1 , further comprising: a third pod structure positioned at least approximately on the circumference; and at least one adaptive coupler that physically couples the second pod structure and the third pod structure, wherein the at least one adaptive coupler that physically couples the second pod structure and the third pod structure has a variable length. 7. the annular wearable electronic device of claim 6 wherein a single adaptive coupler provides physical adaptive coupling both between the first pod structure and the second pod structure and between the second pod structure and the third pod structure. 8. the annular wearable electronic device of claim 6 wherein a first adaptive coupler provides physical adaptive coupling between the first pod structure and the second pod structure and a second adaptive coupler provides physical adaptive coupling between the second pod structure and the third pod structure. 9. the annular wearable electronic device of claim 6 wherein the third pod structure includes a third sensor to detect an input from the user, the second and third sensors physically spaced apart from one another by the circumferential spacing c and by the angular spacing θ, and wherein the circumferential spacing c between the second and the third sensors is variable and the angular spacing θ between the second and the third sensors is at least approximately constant regardless of the length of the at least one adaptive coupler that physically couples the second pod structure and the third pod structure. 10. the annular wearable electronic device of claim 9 wherein the angular spacing θ between the second and the third sensors is at least approximately equal to the angular spacing θ between the first and the second sensors. 1 1 . the annular wearable electronic device of claim 9, further comprising: at least one additional pod structure positioned at least approximately on the circumference, wherein each one of the first pod structure, the second pod structure, the third pod structure, and the at least one additional pod structure is positioned adjacent two other ones of the first pod structure, the second pod structure, the third pod structure, and the at least one additional pod structure, and wherein at least one adaptive coupler provides a respective physical adaptive coupling between each pair of adjacent pod structures and the respective physical adaptive coupling between each pair of adjacent pod structures has a variable length. 12. the annular wearable electronic device of claim 1 1 wherein each additional pod structure includes a respective sensor to detect an input from the user, the respective sensors in each pair of adjacent pod structures physically spaced apart from one another by the circumferential spacing c and by the angular spacing θ, and wherein the circumferential spacing c between the respective sensors in each pair of adjacent pod structures is variable and the angular spacing θ between the respective sensors in each pair of adjacent pod structures is at least approximately constant regardless of the length of the at least one adaptive coupler providing physical adaptive coupling between each pair of adjacent pod structures. 13. the annular wearable electronic device of claim 12 wherein the angular spacing θ between the respective sensors in each pair of adjacent pod structures is at least approximately equal. 14. a wearable electronic device comprising: a set of pod structures arranged in an annular configuration having a variable circumference, wherein each pod structure in the set of pod structures is positioned adjacent two other pod structures in the set of pod structures at least approximately on the circumference, and wherein a first pod structure in the set of pod structures includes a first sensor to detect an input from a user and a second pod structure in the set of pod structures includes a second sensor to detect an input from the user, the first and the second sensors physically spaced apart from one another in the annular configuration by a circumferential spacing c and an angular spacing θ; and at least one adaptive coupler that physically couples each pod structure in the set of pod structures to two adjacent pod structures in the set of pod structures and physically binds the set of pod structures in the annular configuration, wherein a length of the at least one adaptive coupler is variable and the circumferential spacing c between the first and the second sensors is variable, and wherein the angular spacing θ between the first and the second sensors is at least approximately constant regardless of the length of the at least one adaptive coupler. 15. the wearable electronic device of claim 14 wherein each pod structure in the set of pod structures includes a respective sensor to detect an input from the user. 16. the wearable electronic device of claim 15 wherein the circumferential spacing c is at least approximately equal between the respective sensors of each pair of adjacent pod structures. 17. the wearable electronic device of claim 15 wherein the angular spacing θ is at least approximately equal between the respective sensors of each pair of adjacent pod structures, and wherein the angular spacing θ between the respective sensors of each pair of adjacent pod structures is at least approximately constant regardless of the length of the at least one adaptive coupler. 18. the wearable electronic device of claim 14 wherein the set of pod structures includes at least two pod structures. 19. the wearable electronic device of claim 18 wherein the set of pod structures includes at least eight pod structures. 20. the wearable electronic device of claim 14 wherein at least one of the first sensor and the second sensor is selected from the group consisting of: an electromyography sensor; a magnetomyography sensor; a mechanomyography sensor; a blood pressure sensor; a heart rate sensor; an accelerometer; a gyroscope; a compass; and a thermometer. 21 . the wearable electronic device of claim 14 wherein each pod structure in the set of pod structures includes respective electrical circuitry, and wherein at least one pod structure in the set of pod structures includes a component selected from the group consisting of: an amplification circuit, an analog-to-digital conversion circuit, a battery, a wireless transmitter, and a connector port. 22. the wearable electronic device of claim 21 , further comprising: at least one electrical coupling between the electrical circuitry of the first pod structure and the electrical circuitry of the second pod structure. 23. the wearable electronic device of claim 22, further comprising: a respective electrical coupling between the respective electrical circuitries of each pair of adjacent pod structures in the set of pod structures. 24. the wearable electronic device of claim 14 wherein the at least one adaptive coupler includes at least one elastic band. 25. the wearable electronic device of claim 14 wherein the at least one adaptive coupler includes a single adaptive coupler that physically couples between each pair of adjacent pod structures in the set of pod structures. 26. the wearable electronic device of claim 14 wherein the at least one adaptive coupler includes a set of adaptive couplers, and wherein each adaptive coupler in the set of adaptive couplers physically adaptively couples between a respective pair of adjacent pod structures in the set of pod structures.	systems, articles and methods for wearable electronic devices that accommodate different user forms background technical field the present systems, articles and methods generally relate to wearable electronic devices and particularly relate to systems, articles and methods that enable a wearable electronic device to accommodate a wide range of user forms. description of the related art wearable electronic devices electronic devices are commonplace throughout most of the world today. advancements in integrated circuit technology have enabled the development of electronic devices that are sufficiently small and lightweight to be carried by the user. such "portable" electronic devices may include onboard power supplies (such as batteries or other power storage systems) and may be designed to operate without any wire-connections to other electronic systems; however, a small and lightweight electronic device may still be considered portable even if it includes a wire-connection to another electronic system. for example, a microphone may be considered a portable electronic device whether it is operated wirelessly or through a wire-connection. the convenience afforded by the portability of electronic devices has fostered a huge industry. smartphones, audio players, laptop computers, tablet computers, and ebook readers are all examples of portable electronic devices. however, the convenience of being able to carry a portable electronic device has also introduced the inconvenience of having one's hand(s) encumbered by the device itself. this problem is addressed by making an electronic device not only portable, but wearable. a wearable electronic device is any portable electronic device that a user can carry without physically grasping, clutching, or otherwise holding onto the device with their hand(s). for example, a wearable electronic device may be attached or coupled to the user by a strap or straps, a band or bands, a clip or clips, an adhesive, a pin and clasp, an article of clothing, tension or elastic support, an interference fit, an ergonomic form, etc. examples of wearable electronic devices include digital wristwatches, electronic armbands, electronic rings, electronic ankle-bracelets or "anklets," head-mounted electronic display units, hearing aids, and so on. the potential users of a wearable electronic device may come in many different shapes and sizes. to address this, either a unique wearable electronic device must be designed and built (i.e., customized) for each individual user, or an individual device must be able to accommodate a variety of different user forms. for some devices this is simply a matter of comfort for the user, whereas for other devices the operation/performance is affected by the fit between the device and the user. for example, the operation/performance of a wearable electronic device that employs sensors to detect inputs from a user may be influenced by the relative positions of the sensors on the user's form. in this case, the same wearable electronic device may operate/perform differently when worn by two different users, or even when worn in different ways by the same user. such operation/performance inconsistencies can result in a poor user experience and are clearly undesirable. it is impractical to design and build a customized wearable electronic device for each user, thus there is a need in the art for wearable electronic devices with improved robustness against variations in user form. human-electronics interfaces a wearable electronic device may provide direct functionality for a user (such as audio playback, data display, computing functions, etc.) or it may provide electronics to interact with, receive information from, and/or control another electronic device. for example, a wearable electronic device may include sensors that detect inputs from a user and transmit signals to another electronic device based on those inputs. sensor-types and input-types may each take on a variety of forms, including but not limited to: tactile sensors (e.g., buttons, switches, touchpads, or keys) providing manual control, acoustic sensors providing voice-control, electromyography sensors providing gesture control, and/or accelerometers providing gesture control. a human-computer interface ("hci") is an example of a human- electronics interface. the present systems, articles, and methods may be applied to wearable human-computer interfaces, but may also be applied to any other form of wearable human-electronics interface. muscle interface devices muscle interface devices are wearable electronic devices. conventionally, in the research and medical fields, electromyography ("emg") electrodes are manually positioned directly above the muscles of interest by a trained health care professional. this ensures that the sensors are properly located on a patient in order to obtain the desired signals. in order for muscle interface devices to be commercially viable as consumer devices, the sensors must be positioned in a standardized fashion across a broad range of users who will be using the device. furthermore, to be commercially viable as consumer devices, muscle interface devices cannot be designed to require the assistance of a trained professional in order to properly position the sensors each time the device is worn. thus, there is a need in the art for an improved muscle interface device which overcomes at least some of these limitations. brief summary an annular wearable electronic device having a variable circumference may be summarized as including a first pod structure positioned at least approximately on the circumference, wherein the first pod structure includes a first sensor to detect an input from a user; a second pod structure positioned at least approximately on the circumference, wherein the second pod structure includes a second sensor to detect an input from the user, and wherein the first and the second sensors are physically spaced apart from one another by a circumferential spacing c and by an angular spacing θ; and at least one adaptive coupler that physically couples the first pod structure and the second pod structure, wherein a length of the at least one adaptive coupler is variable such that the circumferential spacing c between the first and second sensors is variable, and wherein the angular spacing θ between the first and the second sensors is at least approximately constant regardless of the length of the at least one adaptive coupler. at least one of the first sensor and the second sensor may be selected from the group consisting of: an electromyography sensor; a magnetomyography sensor; a mechanomyography sensor; a blood pressure sensor; a heart rate sensor; an accelerometer; a gyroscope; a compass; and a thermometer. the first pod structure may include electrical circuitry and the second pod structure may include electrical circuitry, and at least one of the first pod structure and the second pod structure may include at least one component selected from the group consisting of: an amplification circuit, an analog-to-digital conversion circuit, a battery, a wireless transmitter, and a connector port. the annular wearable electronic device may further include at least one electrical coupling between the electrical circuitry of the first pod structure and the electrical circuitry of the second pod structure. the at least one adaptive coupler may include at least one elastic band. the annular wearable electronic device may further include a third pod structure positioned at least approximately on the circumference, where the at least one adaptive coupler provides a physical adaptive coupling between the second pod structure and the third pod structure such the physical adaptive coupling between the second pod structure and the third pod structure has a variable length. the at least one adaptive coupler may include a single adaptive coupler that provides physical adaptive coupling both between the first pod structure and the second pod structure and between the second pod structure and the third pod structure. the at least one adaptive coupler may include a first adaptive coupler that provides physical adaptive coupling between the first pod structure and the second pod structure and a second adaptive coupler that provides physical adaptive coupling between the second pod structure and the third pod structure. the third pod structure may include a third sensor to detect an input from the user, the second and third sensors physically spaced apart from one another by the circumferential spacing c and by the angular spacing θ, and the circumferential spacing c between the second and the third sensors may be variable and the angular spacing θ between the second and the third sensors may be at least approximately constant regardless of the length of the physical adaptive coupling between the second pod structure and the third pod structure. the angular spacing θ between the second and the third sensors may be at least approximately equal to the angular spacing θ between the first and the second sensors. the annular wearable electronic device may further include at least one additional pod structure positioned at least approximately on the circumference, wherein each one of the first pod structure, the second pod structure, the third pod structure, and the at least one additional pod structure is positioned adjacent two other ones of the first pod structure, the second pod structure, the third pod structure, and the at least one additional pod structure, and wherein the at least one adaptive coupler provides a respective physical adaptive coupling between each pair of adjacent pod structures such that the physical coupling between each pair of adjacent pod structures has a variable length. each additional pod structure may include a respective sensor to detect an input from the user, the respective sensors in each pair of adjacent pod structures physically spaced apart from one another by the circumferential spacing c and by the angular spacing θ, and the circumferential spacing c between the respective sensors in each pair of adjacent pod structures may be variable and the angular spacing θ between the respective sensors in each pair of adjacent pod structures may be at least approximately constant regardless of the length of the physical adaptive coupling between the each pair of adjacent pod structures. the angular spacing θ between the respective sensors in each pair of adjacent pod structures may be at least approximately equal. a wearable electronic device may be summarized as including a set of pod structures arranged in an annular configuration having a variable circumference, wherein each pod structure in the set of pod structures is positioned adjacent two other pod structures in the set of pod structures at least approximately on the circumference, and wherein a first pod structure in the set of pod structures includes a first sensor to detect an input from a user and a second pod structure in the set of pod structures includes a second sensor to detect an input from the user, the first and the second sensors physically spaced apart from one another in the annular configuration by a circumferential spacing c and an angular spacing θ; and at least one adaptive coupler that physically couples each pod structure in the set of pod structures to two adjacent pod structures in the set of pod structures such that the at least one adaptive coupler physically binds the set of pod structures in the annular configuration, wherein a length of the at least one adaptive coupler is variable such that the circumferential spacing c between the first and the second sensors is variable, and wherein the angular spacing θ between the first and the second sensors is at least approximately constant regardless of the length of the at least one adaptive coupler. each pod structure in the set of pod structures may include a respective sensor to detect an input from the user. the circumferential spacing c may be at least approximately equal between the respective sensors of each pair of adjacent pod structures. the angular spacing θ may be at least approximately equal between the respective sensors of each pair of adjacent pod structures, and the angular spacing θ between the respective sensors of each pair of adjacent pod structures may be at least approximately constant regardless of the length of the at least one adaptive coupler. the set of pod structures may include at least two pod structures. the set of pod structures may include at least eight pod structures. at least one of the first sensor and the second sensor may be selected from the group consisting of: an electromyography sensor; a magnetomyography sensor; a mechanomyography sensor; a blood pressure sensor; a heart rate sensor; an accelerometer; a gyroscope; a compass; and a thermometer. each pod structure in the set of pod structures may include respective electrical circuitry, and at least one pod structure in the set of pod structures may include a component selected from the group consisting of: an amplification circuit, an analog-to-digital conversion circuit, a battery, a wireless transmitter, and a connector port. the annular wearable electronic device may further include at least one electrical coupling between the electrical circuitry of the first pod structure and the electrical circuitry of the second pod structure. the annular wearable electronic device may further include a respective electrical coupling between the respective electrical circuitries of each pair of adjacent pod structures in the set of pod structures. the at least one adaptive coupler may include at least one elastic band. the at least one adaptive coupler may include a single adaptive coupler that provides physical coupling between each pair of adjacent pod structures in the set of pod structures., or the at least one adaptive coupler may include a set of adaptive couplers, where each adaptive coupler in the set of adaptive couplers provides physical adaptive coupling between a respective pair of adjacent pod structures in the set of pod structures. the present disclosure relates to human-computer interface devices, and more specifically to a wearable muscle interface device based human-computer interface (hci). a wearable muscle interface device may be configured to be worn on the forearm of the user, and may include a plurality of pods arranged in spaced apart relation around a resiliently expandable band. for example, the pods may be spaced apart equidistant to each other, although in some cases the space between different pods may vary. each pod may contain one or more sensors, such as an electromyography (emg) sensor, a mechanomyography (mmg) sensor, or an inertial measurement unit (imu). when the muscle interface device is worn, the resiliently expandable band may stretch over a portion of a limb, such as the forearm of a user. a muscle interface device may be adapted to be worn on a user's forearm closer to the elbow than the wrist. this allows a plurality of sensors to be positioned over and around the largest circumference of the forearm to ensure that the sensors are able to pick up the strongest electrical signals from the largest muscle masses in the forearm. as the circumference of the forearm is greater near the elbow than near the wrist, and the surface of the skin tapers as it approaches the hand, the wearable muscle interface device may be generally configured to allow a frusto-conical shape to be assumed to conform to the taper of the forearm of various users. conveniently, the resiliently expandable band of the muscle interface device may allow the device to be worn by users having differently sized forearms. furthermore, by allowing the resiliently expandable band to be stretched substantially uniformly, the resiliently expandable band may also ensure that the relative spaced apart positions of the sensors around a forearm are maintained from user to user within a defined range. advantageously, the present systems, articles, and methods do not require that the sensors be placed in exactly the same position every time the user puts the device on. rather, the present systems, articles, and method provide the ability to maintain the relative positions of the sensors from user to user allowing the wearable muscle interface device to be pre-calibrated for different users as the pattern of signals around the circumference of the users' forearms is generally maintained. other features and advantages of the present systems, articles, and methods will become apparent from the following detailed description and accompanying drawings. it should be understood, however, that the detailed description and specific examples are given by way of illustration and not limitation. many modifications and changes within the scope of the present systems, articles, and methods may be made without departing from the spirit thereof, and the present systems, articles, and methods include all such modifications. a wearable muscle interface device configured to be worn on the forearm of a user may be summarized as comprising: a resiliently expandable band; and a plurality of pods arranged around the resiliently expandable band, whereby the plurality of pods maintain a relative position around a circumference of the forearm of a user. the pods may be spaced apart and expandable in a relative relation to each other. the pods may be spaced apart in equal relation to each other. each pod may contain one or more sensors, including one or more electromyography (emg) sensor, a mechanomyography (mmg) sensor, and/or an inertial measurement unit (imu). the resiliently expandable band may be stretchable around the largest forearm muscle mass of users. the resiliently flexible band may be generally a frusto-conical shape conforming to the taper of a forearm. brief description of the several views of the drawings in the drawings, identical reference numbers identify similar elements or acts. the sizes and relative positions of elements in the drawings are not necessarily drawn to scale. for example, the shapes of various elements and angles are not drawn to scale, and some of these elements are arbitrarily enlarged and positioned to improve drawing legibility. further, the particular shapes of the elements as drawn are not intended to convey any information regarding the actual shape of the particular elements, and have been solely selected for ease of recognition in the drawings. figure 1 is a perspective view of an exemplary wearable electronic device that is designed to accommodate a variety of different user forms in accordance with the present systems, articles and methods. figure 2a is a side-elevation view of a wearable electronic device that accommodates a wide range of different user forms in accordance with the present systems, articles, and methods. figure 2b is another side-elevation view of the device from figure 2a, showing an annular configuration of pod structures having a circumference or perimeter that is larger than a corresponding circumference or perimeter from figure 2a in accordance with the present systems, articles, and methods. figure 2c is another side-elevation view of the device from figure 2a and figure 2b, showing an annular configuration of pod structures having a circumference or perimeter that is larger than both the corresponding circumference or perimeter from figure 2a and the corresponding circumference or perimeter from figure 2b in accordance with the present systems, articles, and methods. figure 2d is a side-elevation view of the device from figures 2a, 2b, and 2c, showing the three respective annular configurations of pod structures from figures 2a, 2b, and 2c, all overlaid in one figure to facilitate comparison. figure 3a is a schematic diagram of a muscle interface device that employs two continuous "resiliently expandable" elastic bands as adaptive couplers that adaptively physically couple a set of seven pod structures in an annular configuration in accordance with the present systems, articles, and methods. figure 3b is a schematic diagram of the muscle interface device from figure 3a in an expanded configuration corresponding to being worn on a larger user form, in accordance with the present systems, articles, and methods. figure 4 is a schematic diagram of a wearable electronic device implementing folded or bent wiring harnesses in between adjacent pod structures in accordance with the present systems, articles, and methods. detailed description in the following description, certain specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. however, one skilled in the relevant art will recognize that embodiments may be practiced without one or more of these specific details, or with other methods, components, materials, etc. in other instances, well-known structures associated with electronic devices, and in particular portable electronic devices such as wearable electronic devices, have not been shown or described in detail to avoid unnecessarily obscuring descriptions of the embodiments. unless the context requires otherwise, throughout the specification and claims which follow, the word "comprise" and variations thereof, such as, "comprises" and "comprising" are to be construed in an open, inclusive sense, that is as "including, but not limited to." reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structures, or characteristics may be combined in any suitable manner in one or more embodiments. as used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. it should also be noted that the term "or" is generally employed in its broadest sense, that is as meaning "and/or" unless the content clearly dictates otherwise. the headings and abstract of the disclosure provided herein are for convenience only and do not interpret the scope or meaning of the embodiments. the various embodiments described herein provide systems, articles, and methods for wearable electronic devices that accommodate different user forms. in particular, wearable electronic devices that employ sensors to detect inputs from a user (such as muscle interface devices) incorporate the present systems, articles, and methods to improve operation/performance robustness against variations in user form. throughout this specification and the appended claims, the term "form" as in "user form" is used to generally describe the physical properties of the portion of a user upon which a wearable electronic device is worn. the physical properties may include any characteristic that can influence the operation/performance of the wearable electronic device, including but not limited to: shape, size, geometry, topography, mass, volume, density, composition, elasticity, etc. figure 1 is a perspective view of an exemplary wearable electronic device 100 that is designed to accommodate a variety of different user forms in accordance with the present systems, articles and methods. exemplary device 100 is an armband designed to be worn on the wrist, forearm, or upper arm of a user, though a person of skill in the art will appreciate that the teachings described herein may readily be applied in wearable electronic devices designed to be worn elsewhere on the body of the user (including without limitation on the leg, ankle, torso, finger, or neck of the user). device 100 includes a set of eight pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 arranged in an annular configuration having a variable circumference or perimeter such that each pod structure in the set of eight pod structures is positioned adjacent (e.g., in between) two other pod structures in the set of eight pod structures at least approximately on the circumference or perimeter of the annular configuration. for example, pod structure 101 is positioned adjacent (i.e., in between) pod structures 102 and 108 at least approximately on the circumference or perimeter of the annular configuration, pod structure 102 is positioned adjacent pod structures 101 and 103 at least approximately on the circumference or perimeter of the annular configuration, pod structure 103 is positioned adjacent pod structures 102 and 104 at least approximately on the circumference or perimeter of the annular configuration, and so on. each of pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 is physically coupled to the two adjacent pod structures by at least one adaptive coupler (not shown in figure 1 ). for example, pod structure 101 is physically coupled to pod structure 108 by an adaptive coupler and to pod structure 102 by an adaptive coupler. the term "adaptive coupler" is used throughout this specification and the appended claims to denote a system, article or device that provides flexible, adjustable, modifiable, extendable, extensible, expandable, or otherwise "adaptable" physical coupling. adaptive coupling is physical coupling between two objects that permits limited motion of the two objects relative to one another. an example of an adaptive coupler is an elastic material such as an elastic band. thus, each of pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 in the set of eight pod structures may be physically coupled to the two adjacent pod structures by at least one elastic band. the set of eight pod structures may be physically bound in the annular configuration by a single elastic band that couples over or through all pod structures or by multiple disparate elastic bands that couple between adjacent pairs of pod structures or between groups of adjacent pairs of pod structures. device 100 is depicted in figure 1 with the at least one adaptive coupler completely retracted and contained within the eight pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 (and therefore the at least one adaptive coupler is not visible in figure 1 )- throughout this specification and the appended claims, the term "pod structure" is used to refer to an individual segment, pod, section, structure, component, link, unit in a connected series of units, etc. of a wearable electronic device. for the purposes of the present systems, articles, and methods, an "individual segment, pod, section, structure, component, link, unit, etc." (i.e., a "pod structure") of a wearable electronic device is characterized by its ability to be moved or displaced relative to another segment, pod, section, structure component, link, unit, etc. of the wearable electronic device. for example, pod structures 101 and 102 of device 100 can each be moved or displaced relative to one another within the constraints imposed by the adaptive coupler providing adaptive physical coupling therebetween. the desire for pod structures 101 and 102 to be movable/displaceable relative to one another specifically arises because device 100 is a wearable electronic device that advantageously accommodates the movements of a user and/or different user forms. device 100 includes eight pod structures 101 , 102, 103, 104, 105, 106, 107, and 108. the number of pod structures included in a wearable electronic device is dependent on at least the nature, function(s), and design of the wearable electronic device, and the present systems, articles, and methods may be applied to any wearable electronic device employing any number of pod structures, including wearable electronic devices employing more than eight pod structures and wearable electronic devices employing fewer than eight pod structures. in exemplary device 100 of figure 1 , each of pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 comprises a respective housing having a respective inner volume. each housing may be formed of substantially rigid material and may be optically opaque. thus, details of the components contained within the housings (i.e., within the inner volumes of the housings) of pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 may not be visible in figure 1 (unless an optically transparent or translucent material is used for the housing material). to facilitate descriptions of exemplary device 100, some internal components are depicted by dashed lines in figure 1 to indicate that these components are not actually visible in the view depicted in figure 1 . for example, any or all of pod structures 101 , 102, 103, 104, 105, 106, 107, and/or 108 may include electrical circuitry. in figure 1 , pod structure 101 is shown containing electrical circuitry 1 1 1 , pod structure 102 is shown containing electrical circuitry 1 12, and pod structure 108 is shown containing electrical circuitry 1 13. the electrical circuitry in any or all pod structures may be electrically coupled (i.e., directly or indirectly) to the electrical circuitry in any or all other pod structures. for example, figure 1 shows electrical coupling 121 between electrical circuitry 1 1 1 of pod structure 101 and electrical circuitry 1 12 of pod structure 102 and electrical coupling 122 between electrical circuitry 1 1 1 of pod structure 101 and electrical circuitry 1 13 of pod structure 108. electrical coupling between electrical circuitries of adjacent pod structures in device 100 may advantageously include systems, articles, and methods for strain mitigation as described in us provisional patent application serial no. 61/857,105, which is incorporated by reference herein in its entirety. throughout this specification and the appended claims, the term "rigid" as in, for example, "substantially rigid material," is used to describe a material that has an inherent tendency to maintain its shape and resist malformation/deformation under the moderate stresses and strains typically encountered by a wearable electronic device. as previously described, a wearable electronic device may include sensors to detect input signals from a user. in exemplary device 100, each of pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 includes a respective sensor 1 10 (only one called out in figure 1 to reduce clutter) to detect input signals from the user. sensor 1 10 may be any type of sensor that is capable of detecting a signal produced, generated, or otherwise effected by the user, including but not limited to: an electromyography sensor, a magnetomyography sensor, a mechanomyography sensor, a blood pressure sensor, a heart rate sensor, a gyroscope, an accelerometer, a compass, and/or a thermometer. in exemplary device 100, each of pod structures 101 , 102, 103, 104, 105, 106, 107, and 108 includes a respective electromyography sensor 1 10 (only one called out in figure 1 to reduce clutter) to detect input signals from the user in the form of electrical signals produced by muscle activity. exemplary device 100 is therefore a muscle interface device or "electromyography device." electromyography device 100 may transmit information based on the detected input signals to provide a human-electronics interface (e.g., a human-computer interface). further details of exemplary electromyography device 100 are described in us provisional patent application serial no. 61/752,226 (now us non-provisional patent application serial no. 14/155,087 and us non-provisional patent application serial no. 14/155,107), us provisional patent application serial no. 61/768,322 (now us non-provisional patent application serial no. 14/186,878 and us non- provisional patent application serial no. 14/186,889), and us provisional patent application serial no. 61/771 ,500 (now us non-provisional patent application serial no. 14/194,252) of which is incorporated herein by reference in its entirety. those of skill in the art will appreciate, however, that a wearable electronic device having electromyography functionality (i.e., a muscle interface device) is used only as an example in the present systems, articles, and methods and that the systems, articles and methods for wearable electronic devices that accommodate different user forms described herein are in no way limited to wearable electronic devices that employ electromyography sensors unless explicitly recited in a respective claim to such. the components and functions of the electrical circuitry in any or all of pod structures 101 , 102, 103, 104, 105, 106, 107, and/or 108 depend on the nature of device 100. in the example of device 100 as an electromyography device, electrical circuitry 1 13 of pod structure 108 may include, for example, a battery 131 , a wireless transmitter 132 (e.g., a bluetooth® transmitter) with associated antenna(s), and/or a tethered connector port 133 (e.g., wired, optical). battery 131 may be included to provide a portable power source for device 100, wireless transmitter 132 may be included to send signals to another electronic device based on the muscle activity signals detected by electromyography sensors 1 10, and connector port 133 may be included to provide a direct communicative (e.g., electrical, optical) coupling to another electronic device for the purpose of power transfer (e.g., recharging battery 131 ) and/or data transfer. connector port 133 is illustrated in figure 1 as a micro-universal serial bus port, though a person of skill in the art will appreciate that any connector port may similarly be used, including but not limited to: a universal serial bus port, a mini-universal serial bus port, a sma port, a thunderbolt® port and the like. furthermore, the electrical circuitry in any or all of pod structures 101 , 102, 103, 104, 105, 106, 107, and/or 108 may include components for processing signals from electromyography sensors 1 10, including but not limited to an amplification circuit to amplify signals from an electromyography sensor and/or an analog-to-digital conversion circuit to convert analog signals output by an electromyography sensor into digital signals for further processing. device 100 employs sensors 1 10 to detect inputs from the user and, as previously described, the operation/performance of device 100 may be influenced by the relative positions of sensors 1 10 on the user's form. to address the fact that potential users of a wearable electronic device may come in a variety of different forms, the various embodiments described herein provide systems, articles, and methods that improve the operation/performance robustness of a wearable electronic device (e.g., device 100) against variations in user form. in particular, the various embodiments described herein provide systems, articles, and methods for wearable electronic devices that achieve at least approximately equal and/or constant angular spacing between respective sensors of adjacent pod structures regardless of the form of the user wearing the device. in this way, the various embodiments described herein also enable the sensors 1 10 to be readily positioned in a standardized fashion (i.e., having at least approximately equal angular spacing therebetween) across a broad range of users who will be using the device. figure 2a is a side-elevation of a wearable electronic device 200 that accommodates a wide range of different user forms in accordance with the present systems, articles, and methods. device 200 is substantially similar to device 100 from figure 1 in that device 200 includes a set of eight pod structures 201 (only one called out in figure 2a to reduce clutter) arranged in an annular configuration having a variable circumference or perimeter, and each pod structure 201 includes a respective sensor 210 (only one called out in figure 2a to reduce clutter). in the same way as described for device 100 of figure 1 , each pod structure 201 in device 200 is physically coupled to two adjacent pod structures by at least one adaptive coupler. the at least one adaptive coupler is not clearly visible in figure 2a because device 200 is depicted with the at least one adaptive coupler completely retracted and contained within the eight pod structures 201 . in other words, device 200 is depicted in figure 2a in the smallest/tightest annular configuration that device 200 can adopt in order to accommodate the smallest user form with which device 200 is compatible. further structures and components of device 200 (e.g., electrical circuitries, connector ports, batteries, etc.) are omitted from figure 2a in order to reduce clutter. a person of skill in the art will appreciate that the omission of any component in any figure is for the purpose of enhancing illustrative clarity of other components and in no way indicates the omitted component is somehow of lesser utility or value to the present systems, articles, and methods. furthermore, figure 2a depicts all of pod structures 201 as substantially the same as one another, whereas in practice different pod structures may embody different shapes, sizes, components, and/or functions. for example, in figure 1 pod structure 108 is of a different size and shape from pod structure 101 because pod structure 108 includes battery 131 , transmitter 132, and connector port 133. the physical spacing between the respective sensors 210 of each respective pair of adjacent pod structures 201 in device 200 may be characterized in at least two ways: a circumferential spacing c and an angular spacing θ. the circumferential spacing c refers to the distance between adjacent sensors 210 measured along the circumference or perimeter of the annular configuration of pod structures 201 . in figure 2a, the circumference of the annular configuration of pod structures 201 is approximately represented by dashed line 251 . the term "circumference" and variations such as "circumferential" are used in an approximate sense throughout this specification and the appended claims to refer to the general vicinity of the perimeter of a closed or generally annular structure. the closed or generally annular structure may be an at least approximately circular geometry or a polygonal geometry (e.g., pentagon, hexagon, heptagon, octagon, nonagon, dodecagon) with a substantially closed inner perimeter and a substantially closed outer perimeter spaced radially outward from the inner perimeter across a dimension (e.g., thickness) of the pod structures, links or units 201 that form the wearable electronic device 200. each pod structure, link or unit 201 may have a generally flat cross sectional profile (as illustrated), to form a polygonal structure. alternatively, each pod structure, link or unit 201 , may have a respective arcuate cross sectional profile to form a curved, circular or substantially circular structure. unless the specific context requires otherwise, a person of skill in the art will understand that the terms "circumference" and "circumferential" as used herein are not intended to limit the corresponding description to the outer surface of a precisely circular form. thus, even though the annular configuration of pod structures 201 is depicted as octagonal in figure 2a, the octagonal annular configuration is still described as having a circumference 251 . the circumferential spacing c between adjacent sensors 210 depends on the length(s) of the at least one adaptive coupler that provides physical coupling between respective pairs of adjacent pod structures 201 . thus, because the length of the at least one adaptive coupler is variable, the circumferential spacing c is similarly variable. and because the circumferential spacing c is variable, the circumference 251 itself is variable. as previously described, device 200 is depicted in figure 2a in the smallest/tightest annular configuration that device 200 can adopt (i.e., with the at least one adaptive coupler completely retracted and contained within the eight pod structures 201 ) in order to accommodate a small user form. therefore, figure 2a depicts device 200 in an annular configuration with minimal circumferential spacing c between adjacent pod structures 201 . in geometrical terms, the circumferential spacing c is the length of the arc that subtends the angle θ formed by: a first ray extending from the center/origin of the circumference 251 of the annular configuration of pod structures 201 and passing through a first sensor 210; and a second ray extending from the center/origin of the circumference 251 of the annular configuration of pod structures 201 and passing through a second sensor 210 that is adjacent the first sensor. the angle θ has a vertex at the center/origin of the circumference 251 of the annular configuration of pod structures 201 . throughout this specification and the appended claims, the term "angular spacing" refers to the size of this angle θ, which depends on both the length of the variable (i.e., "adaptive") physical coupling between adjacent pod structures 201 (i.e., on the size of the circumferential spacing c) and on the radius of the annular configuration of pod structures 201 . in accordance with the present systems, articles, and methods, when the circumferential spacing c between respective pairs of adjacent pod structures 201 of wearable electronic device 200 is increased to accommodate the form of a user (i.e., a user whose form is too large to fit in the annular configuration of pod structures 201 with the circumferential spacing c depicted in figure 2a), the radius of the annular configuration of pod structures 201 also increases. in this way, device 200 achieves at least approximately equal and/or constant angular spacing θ between respective sensors 210 of adjacent pod structures 201 regardless of the form of the user wearing the device. figure 2b is another side-elevation of device 200 from figure 2a, showing an annular configuration of pod structures 201 having a circumference 252 that is larger than circumference 251 from figure 2a. in other words, figure 2b depicts device 200 with larger circumferential spacing c between adjacent pod structures 201 than that depicted in figure 2a in order to accommodate a user with a larger form than would fit in circumference 251 from figure 2a. the circumferential spacing c in figure 2b is larger than the circumferential spacing c in figure 2a because adaptive couplers 230 (only one called out in figure 2b to reduce clutter) providing physical coupling between respective pairs of adjacent pod structures 201 have extended in length to accommodate the larger user form. thus, adaptive couplers 230 that were fully-retracted and not visible in figure 2a are partially extended or expanded and visible in figure 2b. although the circumferential spacing c of circumference 252 depicted in figure 2b is larger than the circumferential spacing c of circumference 251 depicted in figure 2a, the angular spacing θ is at least approximately the same in both figures. in accordance with the present systems, articles, and methods, when the circumference of device 200 is increased to accommodate a larger user form, the radius of device 200 also increases and, as a result, the angular spacing θ between respective sensors 210 of adjacent pod structures 201 remains at least approximately constant regardless of the form of the user wearing device 200. in this way, the operation/performance of device 200 (and the placement/positioning of sensors 210 thereof) is made substantially robust against variations in the form of the user of device 200. figure 2c is another side-elevation of device 200 from figure 2a and figure 2b, showing an annular configuration of pod structures 201 having a circumference 253 that is larger than both circumference 251 from figure 2a and circumference 252 from figure 2b. in figure 2c, device 200 is depicted in the largest/loosest annular configuration that device 200 can adopt (i.e., with the at least one adaptive coupler 230 completely extended or expanded) in order to accommodate the largest user form with which device 200 is compatible. therefore, figure 2c depicts device 200 in an annular configuration with maximal circumferential spacing c between adjacent pod structures 201 . although the circumferential spacing c of circumference 253 depicted in figure 2c is larger than both the circumferential spacing c of circumference 252 depicted in figure 2b and the circumferential spacing c of circumference 251 depicted in figure 2a, the angular spacing θ is at least approximately the same in all three figures. thus, the angular spacing θ of device 200 is substantially robust against variations in the form of the user. figure 2d is a side-elevation of device 200 showing the three annular configurations of pod structures 201 from figures 2a, 2b, and 2c, all overlaid in one figure to facilitate comparison. the smallest/tightest annular configuration of pod structures 201 having circumference 251 from figure 2a is depicted in solid lines, the intermediate configuration of pod structures 201 having circumference 252 from figure 2b is depicted in coarsely-dashed lines, and the largest/loosest annular configuration of pod structures 201 having circumference 253 from figure 2c is depicted in finely-dashed lines. lines representing circumferences 251 , 252, and 253 are not shown in figure 2d to reduce clutter. figure 2d clearly demonstrates that the angular spacing θ for device 200 is substantially constant regardless of the circumference, circumferential spacing c, or form of the user. the present systems, articles, and methods describe maintaining a substantially constant angular spacing θ between respective sensors of respective pairs of adjacent pod structures in a wearable electronic device. as previously described, substantially constant angular spacing θ between sensors may be particularly advantageous for, e.g., a wearable electronic device employing electromyography sensors (e.g., in a muscle interface device). electromyography sensors detect electrical signals produced by muscle activity and their operation/performance can be heavily influenced by their proximity to certain muscles. for example, device 200 may be worn on the arm of a user and sensors 210 may detect muscle activity corresponding to physical gestures performed by the arm, hand, and/or fingers of the user. the arm contains multiple muscle groups that activate in characteristic ways when a user performs a particular gesture, and the angular spacing between these muscle groups may be substantially the same regardless of the form of the user. device 200 may be calibrated to detect and characterize gestures based on a particular relationship between the angular spacing between muscle groups in the arm and the angular spacing θ between sensors 210. thus, maintaining a substantially constant angular spacing θ between respective pairs of adjacent electromyography sensors 210 may improve the robustness of the operation/performance of a wearable electromyography device against variations in the form of the user. the present systems, articles, and methods also describe maintaining a substantially equal (i.e., evenly or uniformly distributed) angular spacing θ between respective sensors of respective pairs of adjacent pod structures in a wearable electronic device. the use of pair-wise adaptive couplers 230 enables the circumferential spacing c of an annular configuration of pod structures 201 to vary uniformly between each respective pair of adjacent pod structures 201 , and as a result the angular spacing θ between respective pairs of adjacent sensors 210 may vary uniformly as well. device 200 may be calibrated to detect and characterize gestures based on an equal (i.e., even or uniform) distribution of sensors 210, and maintaining an equal angular spacing θ between respective pairs of adjacent electromyography sensors 210 may improve the robustness of the operation/performance of a wearable electromyography device against variations in the form of the user. thus, the various embodiments described herein provide systems, articles, and methods that enhance robustness against variations in user form by ensuring at least one or both of: a) substantially constant angular spacing θ between respective pairs of adjacent sensors regardless of user form; and/or b) substantially equal (i.e., evenly or uniformly distributed) angular spacing θ between every respective pair of adjacent sensors regardless of user form. as previously described, the at least one adaptive coupler (230) that physically couples between one or more respective pair(s) of pod structures (201 ) is extendable/stretchable/expandable and may include elastic material. in accordance with the present systems, articles, and methods, elastic material is particularly well-suited for use as/in an adaptive coupler (230) because elastic material is "resiliently expandable" and, when expanded, exhibits a restorative force that can provide the tension necessary to hold an annular wearable electronic device on a limb of the user. throughout this specification and the appended claims, the term "resiliently expandable" is generally used to refer to any element or material that allows limited deformation under moderate stresses and strains but exhibits a restoring force that effects an inherent resiliency, i.e., a tendency to return to its original shape or configuration when the stresses or strains are removed. elastic material is a non-limiting example of a resiliently expandable material. examples of a wearable electronic device that implements elastic bands as adaptive couplers are illustrated in figures 3a and 3b. figure 3a is a schematic diagram of a muscle interface device 300 that employs two continuous "resiliently expandable" elastic bands 360a and 360b as adaptive couplers that adaptively physically couple a set of seven pod structures 350 (only one called out in the figure to reduce clutter) in an annular configuration in accordance with the present systems, articles, and methods. exemplary muscle interface device 300 is configured to be worn on the forearm of the user. each pod structure 350 includes one or more sensors 330 (only one called out in the figure to reduce clutter) such as a capacitive electromyography (cemg) sensor, a surface electromyography (semg) sensor, a mechanomyography (mmg) sensor, or an inertial measurement unit (imu), for example. one or more of the pod structures 350 may also contain a haptic feedback module including a vibrating mechanism, and/or other notification mechanisms, including for example an led indicator light. in order to cover forearm circumferences of the majority of users (e.g., from the age of twelve and up), resiliently expandable bands 360a and 360b may be configured to provide a particular stretching factor, i.e., a particular ratio of "stretch length":"unstretched length." a person of skill in the art will appreciate that the stretching factor for an elastic band depends on a number of properties, including the material used, the density of the material used, the dimensions of the band, and so on. while in general any stretching factor may be implemented, a stretching factor in the range of about 2 to 3, (e.g., a stretching factor of about 2.4) is generally found to accommodate a wide range of user forms. in order to achieve this degree of expansion/contraction, the resiliently expandable band may be formed from a variety of elastic materials, such as elasticized fabric, latex or rubber, for example. resilient, mechanically expandable linkages similar in structure to metal wrist bands for watches may also be used. in exemplary muscle interface device 300 of figure 3a, pod structures 350 are attached to two continuous bands of elastic material 360a and 360b. alternatively, the elastic material may be provided between each adjacent pod structure 350 such that pod structures 350 are continuously connected by the elastic material between each adjacent pair, or separate, discrete sections of elastic material may provide adaptive physical coupling between respective pairs of pod structures 350. some implementations may employ a single band of elastic material (i.e., band 360a or 360b) or more than two band of elastic material. the elasticity of the material(s) between pod structures 350 may be selected to be substantially the same, in order to allow pod structures 350 to expand away from each other substantially uniformly as the band(s) 360a and/or 360b is/are stretched onto the user's limb (e.g., forearm). figure 3b is a schematic diagram of muscle interface device 300 from figure 3a in an expanded configuration corresponding to being worn on a larger user form, in accordance with the present systems, articles, and methods. in this example, pod structures 350 maintain a same relative position with respect to one another (i.e., a same order and a same angular spacing θ), regardless of the size of the forearm of the user, and the amount of stretching that the resiliently expandable bands 360a and 360b undergo. however, in an alternative implementation, the relative elasticity of the elastic material(s) provided between each respective pair of pod structures 350 may be different, such that there is a controlled but uneven expansion of pod structures 350 around the forearm of the user. this may be useful, for example, if it is desired that there be little or no stretching/expansion between two of the pods (e.g. between 250a and 250b), while there should be stretching between the remainder of the pods. elastic bands 360a and 360b are completely visible in the views of figures 3a and 3b for illustrative purposes only. in general, the portions of bands 360a and 360b that are contained within pod structures will not be visible unless pod structures 350 are formed of transparent or translucent material, or pod structures 350 include holes or windows through which bands 360a and 360b may be seen. in exemplary muscle interface device 300, pod structures 350 are positioned substantially equidistant from each other, such that the expansion of pod structures 350 is uniform and they remain substantially equidistant from each other when muscle interface device 300 is in a stretched state. advantageously and in accordance with the present systems, articles, and methods, exemplary muscle interface device 300 shown in figures 3a and 3b does not require that the sensors 330 in pod structures 350 be placed in exactly the same location on the user's arm every time the user puts the device on. in other words, the user is not required to orient muscle interface device 300 in the same way each time he/she slides device 300 onto his/her arm. rather, the constant order of and angular spacing between pod structures 350 helps to ensure that the sensors 330 are properly aligned regardless of variations in the size of forearm of the user. as the circumference of a user's forearm is, typically, greater near the elbow than near the wrist, the surface of the skin typically tapers as it approaches the hand. to accommodate this form, the various embodiments of wearable electronic devices (e.g., muscle interface devices) described herein may, if so desired, have a generally frusto-conical shape to conform to the taper of the forearm. for example, each of pod structures may, in some implementations, be suitably shaped to form a segment of the generally frusto- conical shape in order to conform to the taper of a forearm. the resiliently expandable bands 360a and 360b of muscle interface device 300 allow device 300 to be worn by users having differently sized forearms. furthermore, by stretching substantially uniformly, the resiliently expandable bands 360a and 360b also ensure that the relative spaced apart positions of sensors 330 around a forearm are maintained from user to user, at least within a predictable range. in order to provide electrical connections for all of the sensors 330 at each of the pod structures around the circumference of device 300, a bent wiring harness or flexible pcb interconnect may be utilized between each respective pair of adjacent pod structures 350. figure 4 is a schematic diagram of a wearable electronic device 400 implementing folded or bent wiring harnesses 470 in between adjacent pod structures 450 in accordance with the present systems, articles, and methods. the wire harnesses 470 may be folded about 180 degrees in between each pair of pod structures 450 when device 400 is in its rest/contracted/unexpanded state (i.e., as illustrated in figure 3a). at each pod structure 450, the corresponding wiring harness 470 may have a break-out of a plurality of wires may be are used to connect to the pod structure 450 and provide power, ground, virtual ground, and output wiring. by connecting each of the pod structures 450 in this way, pod structures 450 are able to expand away from one another while maintaining electrical connections. the slack wire harnessed in between each respective pair of pod structures 450 is taken up as device 400 expands (as in figure 3b) to accommodate different user forms. to keep the wire(s) from bending in the wrong direction in between pod structures 450 and getting pinched or touching the user's skin etc., a guide may be used as described, for example, in us provisional patent application serial no. 61/857,105. as examples, this guide can either be a separate smaller pod which is also affixed to the adaptive couplers, or it can be done in the way of a molded interconnect in between each pod structure 450 which contains a track into which the wires are placed. wiring harnesses 470 may include flex printed circuit board (pcb) interconnects. in some implementations, any or all of the various embodiment of wearable electronic devices described herein may include one or more marking(s) that indicate the appropriate position and orientation for the device on the user's limb. for example, a marking on muscle interface device 300 may show the top center of the forearm and the direction in which muscle interface device 300 should be worn. the various embodiments described herein may employ elastic conductors. for example, any or all pod structures, electrical circuitry, electrical couplings, etc. may employ elastic conductors to enhance adaptability and better accommodate the size, form, and/or movements of a user. the above description of illustrated embodiments, including what is described in the abstract, is not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. although specific embodiments of and examples are described herein for illustrative purposes, various equivalent modifications can be made without departing from the spirit and scope of the disclosure, as will be recognized by those skilled in the relevant art. the teachings provided herein of the various embodiments can be applied to other portable and/or wearable electronic devices, not necessarily the exemplary wearable electronic devices generally described above. the various embodiments described above can be combined to provide further embodiments. to the extent that they are not inconsistent with the specific teachings and definitions herein, all of the u.s. patents, u.s. patent application publications, u.s. patent applications, foreign patents, foreign patent applications and non-patent publications referred to in this specification and/or listed in the application data sheet, including but not limited to us provisional patent application serial no. 61/857,105; us provisional patent application serial no. 61/752,226 (now us non-provisional patent application serial no. 14/155,087 and us non-provisional patent application serial no. 14/155,107); us provisional patent application serial no. 61/768,322 (now us non- provisional patent application serial no. 14/186,878 and us non-provisional patent application serial no. 14/186,889); us provisional patent application serial no. 61/771 ,500 (now us non-provisional patent application serial no. 14/194,252), us provisional patent application serial no. 61/822,740, filed may 13, 2013, and us provisional patent application serial no. 61/860,063, filed july 30, 2013, are incorporated herein by reference, in their entirety. aspects of the embodiments can be modified, if necessary, to employ systems, circuits and concepts of the various patents, applications and publications to provide yet further embodiments. these and other changes can be made to the embodiments in light of the above-detailed description. in general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. accordingly, the claims are not limited by the disclosure.
149-320-872-477-786	DE	[ "BR", "EP", "RU", "DE", "US", "CN", "WO", "AT", "ES" ]	B42D15/00,D21H21/40,B44F1/12,D21H27/00,D21H27/22,D21H27/32	2005-05-12T00:00:00	2005	[ "B42", "D21", "B44" ]	safety paper and method for its production	claimed is a security paper for the production of e.g. banknotes or identity cards, and incorporating two or more holes (12, 16). the first hole (12) is formed during the paper manufacturing process and bears characteristic marginal (14) irregularities. the second hole is incorporated after the paper manufacturing process has been completed. the second hole is formed by cutting or punching and has a sharply defined edge (18). the two holes have a spatial relationship to each other. the margins around each hole bear supplementary information relating to each other e.g. an image, mark or code. the second hole is surrounded by foil and cut by laser beam. the security paper product is of pre-determined thickness and further incorporates a zone of reduced thickness incorporating the second aperture and a watermark. further claimed is a process to manufacture a commensurate security document.	a security paper for manufacturing security or value documents, such as banknotes, identification cards and the like, having an embedded foil element that is visible in subregions through window regions manufactured with papermaking technology, characterized in that the security paper exhibits, in the region of the foil element, an opening that is produced after paper manufacture, by cutting or punching, having a sharply delimited edge region, and that is disposed over and/or immediately next to the window regions manufactured with papermaking technology. the security paper according to claim 1, characterized in that the sharply delimited opening is continuous, with the exception of a potential overlap region with the foil element. the security paper according to claim 1 or 2, characterized in that the window regions are disposed on a first main surface of the security paper and the sharply delimited opening extends from the opposing main surface of the security paper to the foil element. the security paper according to at least one of claims 1 to 3, characterized in that the foil element constitutes a security element, especially a security thread or a security band. the security paper according to at least one of claims 1 to 4, characterized in that the sharply delimited opening is produced by laser cutting. the security paper according to at least one of claims 1 to 5, characterized in that the security paper exhibits a predefined paper thickness and a thin site having reduced paper thickness, the sharply delimited opening being introduced in the region of the thin site. the security paper according to claim 6, characterized in that the thin site comprises a watermark. the security paper according to at least one of claims 1 to 7, characterized in that the sharply delimited opening is formed having edge surfaces that are tilted against the surface normal. the security paper according to claim 8, characterized in that the sharply delimited opening exhibits edge surfaces of varying tilt against the surface normal. the security paper according to at least one of claims 1 to 9, characterized in that the sharply delimited opening is closed on one or on both sides of the security paper with a foil element. a method for manufacturing a security paper having an embedded foil element, especially according to one of claims 1 to 10, in which - during paper manufacture, a foil element is embedded in the security paper, - window regions are produced in which the foil element becomes visible, and - after paper manufacture, an opening having a sharply delimited edge region is produced in the region of the foil element over and/or immediately next to the window regions by cutting or punching. the method according to claim 11, characterized in that the sharply delimited opening is produced by laser cutting. the method according to claim 11 or 12, characterized in that a through, sharply delimited opening is produced immediately next to the foil element. the method according to claim 12, characterized in that the sharply delimited opening overlaps the foil element, the laser parameters being set such that the laser cuts only the paper substrate, but not the foil element. the method according to at least one of claims 11 to 14, characterized in that , on a first main surface, prior to embedment, the foil element is coated contiguously with heat seal coating, and on a second, opposing main surface, is prepared with heat seal coating only at the foil edge, so that the middle region of the foil element remains uncoated. the method according to claim 15, characterized in that the window regions are produced on the contiguously coated main surface. the method according to claim 15 or 16, characterized in that the sharply delimited opening is produced in the middle region of the main surface that is coated only at the edge. the method according to at least one of claims 15 to 17, characterized in that the sharply delimited opening is produced by laser cutting. the method according to claim 18, characterized in that the beam divergence and beam tilt to the paper surface are set such that the sharply delimited opening is produced having edge surfaces that are tilted against the surface normal. the method according to claim 18 or 19, characterized in that the beam divergence and beam tilt to the paper surface are set such that the sharply delimited opening is produced having edge surfaces that are tilted differently against the surface normal. the method according to at least one of claims 11 to 20, characterized in that the sharply delimited opening is closed on one or on both sides of the security paper with a foil element. a use of a security paper according to at least one of claims 1 to 10 or of a security paper manufacturable according to at least on of claims 11 to 21 for securing goods of any kind against counterfeiting. a value document, such as a banknote, identification card and the like, having a security paper according to at least one of claims 1 to 10 or a security paper manufacturable according to at least on of claims 11 to 21.	the present invention relates to a security paper for manufacturing security or value documents, such as banknotes, identification cards and the like. for protection, security papers or value documents are often equipped with various authenticity features that permit the authenticity of the security paper or value document to be verified, and that simultaneously serve as protection against unauthorized reproduction. for the purposes of the present invention, the term “security paper” refers to the unprinted paper that is typically present in quasi-endless form and is further processed at a later time. the term “value document” refers to a document that is finished for its intended use. for the purposes of the present invention, value documents are especially banknotes, stocks, bonds, certificates, vouchers, checks, valuable admission tickets and other papers that are at risk of counterfeiting, such as passports and other identification documents, as well as product protection elements, such as labels, seals, packaging and the like. in the following, the simplified designation “security paper” or “value document” includes all such documents and product protection means. publication wo 95/10420 describes a value document in which, after its manufacture, a through opening is punched that is subsequently closed on one side with a cover foil that overlaps the opening all around. the cover foil is transparent at least in a subregion so that, when an attempt is made to copy the value document, the background shows through and is rendered by the copier accordingly. in this way, counterfeits can easily be recognized. however, the opening produced by punching can likewise be produced by a counterfeiter. although the color copy of a genuine value document no longer exhibits the transparent region, similar to the genuine value document, this region can be subsequently punched out and again closed with a suitable cover foil. such counterfeits are difficult to recognize. to remedy this, it is recommended in publication wo 03/054297 to produce a through opening already during paper manufacture. such an opening produced at sheet formation exhibits, in the edge region, characteristic irregularities that are not subsequently manufacturable in the finished paper. the irregularities reveal themselves especially through the lack of a sharp cut edge or through irregular accretion of fibers in the edge region and through individual fibers that protrude into the opening. such produced openings have a similarly high security value as a watermark produced at paper manufacture or a security thread embedded at paper manufacture. however, such openings produced at paper manufacture often vary in their quality and are not easy to manufacture reproducibly. to some extent there is also the danger that fiber bundles partially close the opening. based on that, the object of the present invention is to create a security paper that avoids the disadvantages of the background art. in particular, the security paper is intended to combine the high counterfeit security of the openings produced at paper manufacture with high reproducibility at manufacture and good perceptibility of the authenticity features formed by the openings. this object is solved by the features of the independent claims. developments of the present invention are the subject of the dependent claims. in a first aspect of the present invention, a generic security paper includes at least two through openings, a first of the through openings being produced during paper manufacture and exhibiting characteristic irregularities in the edge region, and a second of the through openings being produced after paper manufacture, by cutting or punching, having a sharply delimited edge region. here, the contour shapes of the first and the second through opening are preferably associated in meaning. in particular, it can be provided that the contour shapes of the first and the second through opening constitute related or complementary information, such as an image motif, characters or a code. in a preferred embodiment, the second, sharply delimited opening is produced by laser cutting. here, the sharply delimited edge surfaces of the second opening can run parallel and vertical to the paper surface. in contrast, in other embodiments, the second opening is formed having edge surfaces that are tilted against the surface normal. this can be achieved for example at laser cutting through a suitable selection of the beam divergence and the beam tilt relative to the paper surface. in particular, beam divergence and beam tilt to the paper surface can be set such that the second opening is produced having edge surfaces that are tilted differently against the surface normal. tapered edges lead to a softer transition between a cover foil disposed over the openings and the paper substrate, and thus to, among other things, a lower susceptibility to dirt. moreover, differently tilted edge surfaces offer advantages in a duplex lamination of the opening with foils, and minimize especially the potential problem with air entrapment in duplex lamination. furthermore, the openings having tilted edge surfaces exhibit an additional optical effect compared with vertical edge surfaces, since they appear to be of different sizes depending on the viewing direction. in an advantageous development of the present invention, the security paper exhibits a predefined paper thickness and a thin site having reduced paper thickness, at least the second through opening being introduced in the region of the thin site. the thin site can especially comprise a watermark. the two openings are expediently closed on at least one side of the security paper with a foil element. in some designs, the openings are even closed on both sides with a foil. here, potential problems with air entrapment can be minimized through the above-mentioned tilted edges. according to a further aspect of the present invention, a generic security paper includes at least one through opening, the edge surface of the through opening exhibiting first, sharply delimited subregions and second subregions having characteristic irregularities. first and second subregions preferably alternate along the contour line of the opening. in particular, it can be provided that first and second subregions alternate in irregular sequence along the contour line of the opening. in one embodiment, first and second subregions each extend through the entire paper thickness. it can also be provided that first and second subregions follow one another in succession in one direction along the thickness of the security paper and complement each other to form the through opening. for example, in one edge section, sharply delimited subregions can extend through 90% of the paper thickness, while the edge surface for the remaining 10% of the paper thickness is irregular. such edge sections can also be combined with other edge sections in which first or second subregions extend completely through the entire paper thickness. such a sequence of first and second subregions along the thickness of the security paper can be produced for example in that, during paper manufacture, a through opening having characteristic irregularities is produced in the edge region and, after paper manufacture, the edge region of the opening thus produced is modified by cutting or punching and, in this way, is sharply delimited at least in subregions. the modification is preferably produced by laser cutting, the above-mentioned possibilities for the tilt of the edge surfaces existing here, too. the sequence of first and second subregions along the thickness of the security paper can also be produced, for example, in that a piece of paper having the desired shape of the opening is defined with interrupted, sharply delimited cutting lines in the security paper, and the piece of paper thus defined is then torn out of the security paper, especially blown out or pulled out. the piece of paper is preferably defined by laser cutting, the above-mentioned possibilities for the tilt of the edge surfaces again existing. a further possibility to produce the sequence of first and second subregions consists in that a sharply delimited thin site having the shape of the desired opening is produced in the security paper, and in that the piece of paper formed in the region of the thin site by the residual paper thickness is torn out of the security paper, especially blown out or pulled out. also, in a preferred method, the sharply delimited thin site is produced by laser cutting, if desired, having tilted edge surfaces, as explained above. in an expedient embodiment, the security paper exhibits a predefined paper thickness and a thin site having reduced paper thickness, for example a watermark, the through opening being introduced in the region of the thin site. the through opening is expediently closed on one or even on both sides of the security paper with a foil element. in a further aspect of the present invention, a generic security paper includes at least one through opening, produced during paper manufacture, that exhibits characteristic irregularities in the edge region. the through opening is combined with an engraving, produced by laser etching, that complements the opening to form a projection representation. preferably, the through opening is closed on one or even on both sides of the security paper with a foil element. according to yet a further aspect of the present invention, a generic security paper includes an embedded foil element that is visible in subregions through window regions manufactured with papermaking technology. the security paper further exhibits, in the region of the foil element, an opening produced after paper manufacture, by cutting or punching, having a sharply delimited edge region. in an advantageous embodiment, the sharply delimited opening is disposed over and/or immediately next to the foil element. preferably, the sharply delimited opening is formed to be continuous, with the exception of a potential overlap region with the foil element. according to a preferred embodiment, the window regions are disposed on a first main surface of the security paper, while the sharply delimited opening extends from the opposing main surface of the security paper to the foil element. in all embodiments, the foil element can constitute a security element, especially a security thread or a security band. the sharply delimited opening is advantageously produced by laser cutting. here, the edge surfaces of the opening can be tilted, as explained above. in an expedient embodiment, the security paper exhibits a predefined paper thickness and a thin site having reduced paper thickness, for example a watermark, the sharply delimited opening being introduced in the region of the thin site. the sharply delimited opening is expediently closed on one or even on both sides of the security paper with a foil element. the present invention also includes a value document, such as a banknote, an identification card and the like, having a security paper of the kind described. the security paper or value document according to the present invention can be used for securing goods of any kind against counterfeiting. further exemplary embodiments and advantages of the present invention are explained below by reference to the drawings, in which a depiction to scale and proportion was omitted in order to improve their clarity. shown are: fig. 1 a schematic diagram of a banknote composed of a security paper according to an exemplary embodiment of the present invention, fig. 2 a top view of a security paper according to another exemplary embodiment of the present invention, figs. 3 and 4 further exemplary embodiments for inventive designs of two openings, associated in meaning, in a security paper, fig. 5 to 7 in each (a), an intermediate step in the manufacture of the security paper, shown in top view in each (b), according to further exemplary embodiments of the present invention fig. 8 in (a), an intermediate step in the manufacture of a security paper according to a further exemplary embodiment of the present invention, and in (b), a section of (a) after the removal of the cut-out shape, fig. 9 a top view of a security paper according to a further exemplary embodiment of the present invention, fig. 10 in (a), a top view of a security paper having an embedded foil element according to an exemplary embodiment of the present invention, and in (b) and (c), cross sections through the security paper in (a) along the lines b-b and c-c, figs. 11 and 12 in each (a), a top view of a security paper having a foil element according to further exemplary embodiments of the present invention, and in (b) and (c), cross sections through the security paper in (a) along the lines b-b and c-c, fig. 13 a design in which a laser-cut opening is produced in the region of a thin site produced with papermaking technology, fig. 14 in (a) and (b), in cross section, two steps in the manufacture of a security paper according to a further exemplary embodiment of the present invention, and in (c), a top view of the security paper in (b), fig. 15 in (a) to (c), a diagram as in fig. 14 , the laser-cut opening being produced in the region of a thin site produced with papermaking technology, and fig. 16 in (a) and (b), two exemplary embodiments for laser-cut openings having edge surfaces that are tilted against the surface normal. the invention will now be explained in greater detail using a banknote as an example. for this, fig. 1 shows a schematic diagram of a banknote 10 that exhibits two through openings 12 and 16 . here, the first of the through openings 12 was produced during the manufacture of the security paper used for the banknote 10 and exhibits a fibrous, irregular edge region 14 . such an edge 14 is characteristic for the openings manufactured already at sheet formation and cannot be produced subsequently by punching or cutting the paper. the second through opening 16 was produced only after paper manufacture by laser cutting or with the aid of a punching tool and exhibits a sharply delimited edge region 18 . the two through openings 12 and 16 show the same information twice, spatially separated from each other, in each case an isosceles triangle in the exemplary embodiment in fig. 1 . it is understood that, instead of the triangle, also more complex shapes can be used, whose contours constitute, for example, a numeric string or a simple graphic. even if the information depicted by the first opening 12 should not be immediately perceptible due to its irregular edge region 14 , due to the second opening 16 formed having clear contours, the viewer can establish the relationship of the two shapes and perceive the information with no doubt. due to the presentation of the information twice in different attire, the attention and the regard of the viewer is guided particularly to the difference in the two openings. the high counterfeit security of the irregularly edged opening 12 is thus combined with the clear perceptibility of the sharply edged opening 16 . the section in fig. 2 shows a top view of a security paper 20 according to a further exemplary embodiment of the present invention. the security paper 20 exhibits a first opening 22 , produced with papermaking technology and having an irregular edge region 24 , and a second opening 26 produced by laser cutting and having a sharp edge 28 . here, too, the contour shapes of the two openings 22 and 26 are associated in meaning. however, in contrast to the exemplary embodiment in fig. 1 , they do not present the same information, but form complementary parts of an aggregate piece of information. preferably, the depicted motif is matched to the different edge characteristics of the two openings. for illustration, fig. 2 shows a flower motif in which the blossom is formed by the first, irregularly edged opening 22 and the stem and the leaves by the second, sharply edged opening 26 . since blossoms have very different and variable appearances in nature, the aggregate illustration seems very realistic. at the same time, due to the use of the two opening shapes, high counterfeit protection is ensured. figs. 3 and 4 show further exemplary embodiments for designs in which the contour shapes of an irregularly edged first opening and a sharply edged second opening are associated in meaning. the exemplary embodiment in fig. 3( a ) shows a sun in the shape of a circular, irregularly edged first opening 32 having rays that point radially outward and that are formed by laser-cut or punched triangular openings 34 . in this exemplary embodiment, the rays formed by the second openings 34 constitute a motif that is dependent on the first opening. also in fig. 3( b ), the irregularly edged, star-shaped first opening 36 constitutes a main motif on which the sharply edged, circular second openings 38 are graphically dependent. fig. 4 shows a further exemplary embodiment of the present invention, in which, in each case, the irregularly edged openings 42 and the sharply edged openings 44 complement each other to form the denomination “100” of a banknote 40 . as usual, the denomination of the banknote is applied again, for example imprinted, clearly legibly in another location. in a real banknote, it is possible to use only one of the designs in fig. 4 , or both and, if applicable, further designs can be provided at various locations on the banknote. an associated meaning of the two opening types can also result in that the irregularly edged opening is modified by the sharply edged opening, as will now be explained with reference to figs. 5 to 7 . fig. 5( a ) shows a top view of a security paper 50 into which, at paper manufacture, initially a first, irregularly edged opening 52 was introduced. after paper manufacture, by laser cutting, the opening 52 is modified having two sharply edged openings 54 whose positions are drawn with dotted lines in fig. 5( a ). after laser cutting, a single, continuous and through opening 56 results that, due to the two-phase manufacture, exhibits, as shown in fig. 5( b ), on the one hand, subregions 58 having an irregular edge, and on the other hand, subregions 59 having a sharp edge. through such a modification, the edge characteristics of the two opening types can be combined in a single through opening. in the exemplary embodiment in fig. 6 , in a first step at paper manufacture, an irregularly edged opening 62 in the shape of a predefined figure, for example in the shape of the four-arrow figure shown in fig. 6( a ), is produced in a security paper 60 . the irregular edge region 64 in this figure is then partially recut with a laser. in this way, as illustrated in fig. 6( b ), a through opening 66 results that exhibits, on one hand, subregions 68 having an irregular edge and, on the other hand, subregions 69 having a sharp edge. here, the relationship and the sequence of the subregions 68 , 69 can be chosen freely. fig. 7 shows a further exemplary embodiment in which, as in the exemplary embodiment in fig. 6 , an irregularly edged opening 72 is first introduced into a security paper 70 , as shown in fig. 7( a ). after paper manufacture, the opening 72 is completely recut with a laser (reference number 74 ), the size of the recut 74 being chosen to be somewhat smaller than the size of the opening 72 . in this way, a through opening 76 is created that exhibits, in irregular sequence, subregions 78 having an irregular edge and subregions 79 having a sharp edge, as depicted in fig. 7( b ). a sequence of regular and irregular edge regions can also be achieved without involvement of an opening already produced at paper manufacture. for example, with the aid of a laser, the desired shape of a through opening 82 can be cut out of a security paper 80 in such a way that the cutting lines 84 do not form a continuous cut curvature, but rather are interrupted by uncut sub-pieces 86 , as shown in fig. 8( a ). the sub-pieces 86 form holding strips that initially prevent the removal of the cut-out shape. the cut-out shape can subsequently be, for example, blown out with an air jet or pulled out by means of vacuum. as illustrated in section 85 , depicted in detail in fig. 8( b ), in this approach, the cut-out piece of paper tears off irregularly at the holding strips 86 , while the cutting lines 84 form sharp border edges. the edge region to the opening 82 thus exhibits a sequence of irregular subregions 88 and sharply cut subregions 89 whose relative size and sequence can be chosen almost freely through the cut control when laser cutting. in the further exemplary embodiment of the present invention, shown in fig. 9 , the security paper 90 exhibits a through opening 92 produced during paper manufacture and having an irregular, fibrous edge. the opening 92 is combined with engraving lines 94 that are produced by laser etching. the engraving lines 94 are formed by locally thinned regions in the security paper 90 , as described in publication wo 98/03348, whose disclosure in this respect is incorporated in the present description. according to the present invention, the position and arrangement of the engraving lines 94 are chosen such that they complement the opening 92 to form a projection representation. when viewed in reflected light, the engraving lines 94 are practically imperceptible, the areal shape of the opening 92 determines the appearance there. if, in contrast, the security paper is viewed in transmitted light, due to the smaller paper thickness, the engraving lines 94 stand out clearly and complement the areal opening 92 to form a three-dimensional projection representation. in this way, the combination of the irregular opening 92 with the engraving lines 94 leads to an optically conspicuous interplay between the 2d and 3d depiction. according to a further embodiment of the present invention, which will now be described with reference to figs. 10 to 12 , the security paper is provided with a foil element, such as an embedded security thread or a foil strip that is covered on one side. fig. 10 shows, by way of example, a security paper 100 in which a foil strip 102 is embedded. here, fig. 10( a ) depicts a top view of the security paper, and figs. 10( b ) and 10 ( c ) show cross sections through the security paper in fig. 10( a ) along the lines b-b and c-c. prior to its embedment in the security paper, the foil strip 102 was contiguously coated on the bottom 104 with heat seal coating 107 . on the other side 106 , in contrast, only tracks 108 at the foil edge were provided with heat seal coating such that the middle foil region of the top 106 remains uncoated. at paper manufacture, a nonwoven material now forms on both sides of the foil. in addition, for example with the aid of electrotypes, on the bottom 104 of the foil strip is left uncovered a window 110 in which the foil element becomes visible. on the bottom 104 that is contiguously coated with heat seal coating 107 , the nonwoven material is set, except for the uncovered window 110 , in the drying section. on the opposing front 106 , in contrast, only the edge regions 108 prepared with heat seal coating are set in the drying section. subsequently, with a laser, a shape 112 is cut out above the uncovered window 110 of the opposite side 104 , as is best perceived in the cross-sectional diagram in fig. 10( c ). here, the laser parameters are chosen such that only the paper is cut, but not the foil strip 110 . this can be achieved in that, for example, the laser cutting is carried out with a laser wavelength for which the foil strip 102 is transparent and non-absorbent. the cut-out shape 112 can then be removed with a suction apparatus since, due to the lack of heat seal coating on the front 106 and the non-stick foil surface, no connection has been created between the cut-out piece of paper and the foil. another exemplary embodiment having a foil element will now be explained with reference to figs. 11 and 12 . first, fig. 11( a ) depicts a top view of a security paper 120 , and figs. 11( b ) and 11 ( c ) show cross sections through the security paper in fig. 11( a ) along the lines b-b and c-c. in the security paper 120 is embedded a security thread 122 that is perceptible primarily in the window regions 124 that are produced in the back of the paper with papermaking technology, as shown in fig. 11( b ). further, in the region of the window 124 in the front of the security paper 120 , a sharply edged opening 126 that extends beyond the security thread 122 is introduced into the paper substrate with a laser. for this, the laser parameters are chosen such that, although the paper substrate 120 is cut by the laser, the security thread 122 is not. in the region of the opening 126 , the security thread 122 is then perceptible from both sides, as shown in fig. 11( c ). in the alternative design shown in fig. 12 , in contrast to the embodiment in fig. 11 , the laser-cut opening 128 is not made over the security thread 122 , but rather the security thread is framed by the opening 128 . with the exception of this difference, the views in figs. 12( a ) to ( c ) correspond to those in figs. 11( a ) to ( c ). unlike in fig. 11 , in the exemplary embodiment in fig. 12 , the surface of the security thread 122 is perceptible only in the window regions 124 . such an embodiment may be used especially when the laser radiation could damage or have an undesired effect on the foil material of the security thread 122 . since the security thread normally oscillates, in this design, the opening 128 can typically not be perfectly centered on the security thread 122 , as indicated by the register variations shown in figs. 12( a ) and ( c ). fig. 13 shows a design in which a sharply edged opening 132 is produced in the region of a thin site 134 of the security paper 130 with a laser. the thin site 134 can be produced, for example, by a drawn-off pressure-former ply (a paper ply produced by jetting the pulp onto a cylinder mold) or with the aid of electrotypes. since the paper thickness is reduced in the region of the thin site 134 , it is possible to work with lower laser power when laser cutting. in this way, higher cutting speeds are achieved, such that more complex shapes can be realized. this modification can be combined with all embodiments in which a sharply edged opening is inscribed in a paper substrate with a laser. further exemplary embodiments of the present invention will now be explained with reference to figs. 14 and 15 . in the exemplary embodiment in fig. 14 , a thin site 142 of predefined shape is first produced in the paper substrate 140 with the aid of a laser. here, the paper material is vaporized, burned or otherwise ablated. just so much material is ablated that a small residual thickness 144 of the substrate remains, as shown in fig. 14( a ). at some locations, depending on the thickness tolerance of the substrate, it is also possible to ablate so much that no material at all is present any longer. since the thin site is produced by laser cutting, the edge surface 146 is sharply delimited and smooth. the piece of paper 144 remaining after the laser treatment is then removed by blowing or suctioning it out. since it is only a very thin paper ply, the piece of paper 144 tears out at the edges and, in this way, produces an irregular subregion 148 in the edge surface of the now through opening 145 , as depicted in the cross-sectional diagram in fig. 14( b ) and the top view in fig. 14( c ). if the edge surface of the opening 145 is followed along a direction extending through the paper thickness, beginning at the surface 141 of the paper substrate, then the sharply delimited subregion 146 and the characteristically irregularly shaped subregion 148 follow one another in succession. when the security paper is viewed, the through opening 145 appears with different impressions from opposing sides of the security paper, depending on whether the sharply delimited edge region 146 or the irregular edge region 148 adjoins the paper surface. as an exemplary combination of laser-produced openings with thin sites in the paper substrate ( fig. 13 ), the exemplary embodiment in fig. 15 first shows a thin site 151 produced in the security paper 150 with papermaking technology, such as a watermark. as described in connection with fig. 14 , in the region of this thin site 151 is then produced with the laser a second sharply edged thin site 152 that leaves only a small residual thickness 154 of the paper substrate remaining, as shown in fig. 15( a ). this remaining piece of paper 154 is torn out by blowing or suctioning such that, at the bottom of the paper substrate 150 , an irregular edge surface 158 is produced, as depicted in fig. 15( b ). the edge region 156 produced by laser cutting, in contrast, is sharply delimited. the through opening 160 created is embedded in a watermark region 151 that, when looked through, appears clearly, see fig. 15( c ). it is understood that the design of the opening 160 and of the watermark region 151 can likewise be associated in meaning. overall, along a direction extending through the paper thickness, the edge surface of the opening 160 exhibits, in succession, a sharply delimited subregion 156 and a characteristically irregularly shaped subregion 158 . here, too, when viewed from opposing sides of the security paper, the through opening 160 appears having different impressions, depending on whether the sharply delimited edge region 156 or the irregular edge region 158 adjoins the paper surface. in the embodiments described, the sharply edged opening can also be produced by a punching tool rather than with a laser. it is also not necessary that the edge surfaces of the laser-cut openings run parallel and vertical to the paper surface, as shown in the figures for the sake of simpler illustration. rather, it can be advantageous to set the laser source and/or the paper at an angle when cutting, so that “tapered” edges are produced. for this, fig. 16 shows, in (a) and (b), two exemplary embodiments in which sharply edged, laser-cut openings 172 and 174 are introduced into paper substrates 170 . the tilt of the edge surfaces 178 of the openings can be set as desired by choosing a suitable beam divergence and beam tilt. the openings 172 and 174 are each covered with a foil 176 . as immediately apparent, the tapered edges lead to a softer transition between the foil 176 and the paper substrate 170 . through such edge shapes, the susceptibility of the openings to dirt is significantly reduced. furthermore, the design in fig. 16( b ), in which the edge surfaces have different tilts, has proven to be particularly advantageous in a duplex lamination of the openings with foils (not shown). problems with the potential entrapment of air between the opposing foils can be minimized through such an edge design. as a further advantage, the openings in fig. 16 also exhibit an additional optical effect, as they appear to be of different sizes depending on the viewing direction.
151-177-007-914-227	NL	[ "WO", "NL" ]	F16B3/06,F03D13/20,F16B7/02,F16B7/04,F16B7/18,F16B13/06	2021-10-07T00:00:00	2021	[ "F16", "F03" ]	assembly comprising a first and a second member and a connector, and a method of assembling such an assembly	the present invention relates to an assembly, comprising a first member and a second member that are connected via a connector that is axially insertable into a channel defined by passages of the first and the second member, wherein said connector exhibits a length extending in a longitudinal direction of the channel and comprises a first expansion block, a second expansion block, and one or more than one wedge that is arranged in between the first expansion block and the second expansion block, and that is configured to be displaced longitudinally relative to the channel to thereby radially expand the connector relative to the channel, and wherein, at a cross section halfway the length of the connector, a cross sectional area and a height of a first expansion block in a radial direction relative to said channel is smaller than a cross sectional area and a height of a second expansion block in said radial direction relative to said channel. the invention further relates to a method of assembling such an assembly of a first and a second member.	1. assembly, comprising: - a first member and a second member, wherein; - the second member has a fork-shaped cross section with a main body arranged between two substantially parallel walls that each comprise at least one passage; - the first member is arranged between the two walls of the second member in abutting contact with a face of the main body of the second member, the first member comprising a passage; - said passage of the first member and the passages of the second member define a channel; - a connector that is axially insertable into said channel to an end position and consecutively expandable radially relative to said channel, to connect the first and second member relative to each other by pushing, in an expanded state of the connector, the first member in a radial direction relative to said channel against the face of the main body of the second member to define a clamping contact and thereby a pre-tensioned connection in said radial direction relative to said channel between the face of the main body of the second member and faces defined by the passages in the substantially parallel walls of the second member; - wherein said connector exhibits a length extending in a longitudinal direction of the channel and comprises: - a first expansion block that is configured to push the first member against the face of the main body of the second member; - a second expansion block that is configured to contact the faces defined by the passages in the substantially parallel walls of the second member; and - one or more than one wedge that is arranged in between the first expansion block and the second expansion block, and that is configured to be displaced longitudinally relative to the channel to thereby radially expand the connector relative to the channel, characterized in that, at a cross section halfway the length of the connector, a cross sectional area and a height of the first expansion block in the radial direction relative to said channel is smaller than a cross sectional area and a height of the second expansion block in said radial direction relative to said channel. 2. assembly according to claim 1, wherein, at the cross section halfway the length of the connector, the height of the first expansion block in the radial direction relative to said channel is equal to or less than 66% of the height of the second expansion block in said radial direction relative to said channel. 3. assembly according to claim 1 or 2, wherein, at the cross section halfway the length of the connector, the cross sectional area of the first expansion block is equal to or less than 66% of the cross sectional area of the second expansion block. 4. assembly according to one or more than one of the foregoing claims, wherein, at the cross section halfway the length of the connector, the height of the first expansion block in the radial direction relative to said channel is at least 50% of a radius of a side of the passage in the first member that is directed towards the main body of the second member. 5. assembly according to claim 4, wherein, at the cross section halfway the length of the connector, the height of the first expansion block in the radial direction relative to said channel is in the range of 100% - 125% of the radius of the side of the passage in the first member that is directed towards the main body of the second member. 6. assembly according to one or more than one of the foregoing claims, wherein: - the one or more than one wedge comprises a first sliding surface in contact with the first expansion block and a second sliding surface that is in contact with the second expansion block; - the first sliding surface encloses a first angle a relative to the longitudinal direction of the channel; - the second sliding surface encloses a second angle 0 relative to the longitudinal direction of the channel; and - the first angle a is smaller than the second angle 0. 7. assembly according to claim 6, wherein the first angle a is in the range of 0 - 15°, and preferably in the range of 0 - 5°. 8. assembly according to claim 6 or 7, wherein the second angle 0 is in the range of 5 - 30°. 9. assembly according to one or more than one of the foregoing claims, wherein the connector comprises a wedge on either side relative to the cross section halfway the length of the connector. 16 10. assembly according to claim 9, wherein the wedges are arranged in a mirrored arrangement relative to the cross section halfway the length of the connector. 11. assembly according to one or more than one of the foregoing claims, wherein the height of first expansion block reduces towards one or more than one longitudinal end thereof. 12. assembly according to one or more than one of the foregoing claims, wherein the second expansion block is configured to abut the faces defined by the passages in the substantially parallel walls of the second member only at or near longitudinal ends of said second expansion block when the connector is in an unloaded state, prior to the connector being expanded to the expanded state thereof. 13. assembly according to one or more than one of the foregoing claims, wherein the second expansion block is configured to abut the faces defined by the passages in the substantially parallel walls of the second member over at least half of the length of said faces when the connector is radially expanded to the expanded state to define the pre-tensioned connection. 14. assembly according to one or more than one of the foregoing claims, wherein an outer end of the second expansion block and the faces defined by the passages in the substantially parallel walls of the second member enclose an angle y < 2° upon initial contact in the unloaded state of the connector. 15. assembly according to claim 14, wherein the angle y is defined by a corresponding shape or curvature of at least an outer end of the second expansion block. 16. assembly according to one or more than one of the foregoing claims, wherein the material of the second expansion block exhibits a higher yield strength than the material of first expansion block. 17. assembly according to one or more than one of the foregoing claims, wherein the first expansion block comprises an abutting surface that is configured to abut the first member when the connector is radially expanded to the expanded state to define the pre-tensioned connection; wherein the abutting surface is shaped such that, in the compacted state, a distance between the abutting surface and the first member in the radial direction is smaller between a 17 central portion of the abutting surface, that is preferably arranged near the longitudinal center of the first expansion block, and the first member than between an outer portion of the abutting surface, that is preferably arranged further from the longitudinal center of the first expansion block, and the first member. 18. method of assembling a first and a second member that each comprise at least one passage, wherein the second member has a fork-shaped cross section with a main body arranged between two substantially parallel walls that each comprise at least one passage, said method comprising the steps of: - arranging the first member between the two walls of the second member; - positioning the passages of the first and the second member to define a channel; - providing a connector that comprises: - a first expansion block that is configured to push the first member against a face of the main body of the second member; - a second expansion block that is configured to contact faces defined by the passages in the substantially parallel walls of the second member; and - one or more than one wedge that is arranged in between the first expansion block and the second expansion block, and that is configured to be displaced longitudinally relative to the channel by an actuator to thereby radially expand the connector; - inserting the connector into the channel to an end position; - consecutively expanding said connector radially relative to said channel, to thereby connect the first and second member relative to each other; and - the expanded connector pushing the first member in a radial direction relative to said channel against the face of the main body of the second member to define a clamping contact and thereby a pre-tensioned connection in the radial direction relative to said channel between the face of the main body of the second member and faces defined by the passages in the substantially parallel walls of the second member, characterized in that the step of providing the connector comprises providing a connector of which, at a cross section halfway the length of the connector, the cross sectional area and the height of the first expansion block in the radial direction relative to said channel is smaller than the cross sectional area and the height of the second expansion block in said radial direction relative to said channel. 19. method according to claim 18, wherein the step of inserting the connector into the channel to an end position comprises an end position wherein the second expansion block abuts the faces defined by the passages in the substantially parallel walls of the second member only at 18 or near longitudinal ends of said second expansion block when the connector is in an unloaded state. 20. method according to claim 19, wherein the step of the expanded connector pushing the first member in the radial direction relative to said channel comprises deforming the second expansion block of the connector until the second expansion block abuts the faces defined by the passages in the substantially parallel walls of the second member over at least half of the length of said faces when the connector is radially expanded to the expanded state to define the pre-tensioned connection. 21. method according to any of claims 18-20, further comprising at least one of: - providing a connector of or for an assembly according to any of claims 1-17; and - assembling an assembly according to any of claims 1-17.	assembly comprising a first and a second member and a connector, and a method of assembling such an assembly the present invention relates to an assembly, comprising a first and a second member, and a connector to connect the first and second member relative to each other. the invention further relates to a method of assembling such an assembly of a first and a second member that each comprise at least one passage. the present invention is particularly suitable for offshore applications, e.g. for connecting a wind turbine to a monopile, a wind turbine to a transition piece, a transition piece to a monopile, as well as between members, i.e. tower segments, of a monopile or wind turbine, and jacket connections. it may also be used for a connection between the tower of a monopile and a nacelle, and possibly also for connecting rotor blades to the nacelle. according to prior art applications in offshore, the members of such assemblies are traditionally provided with flanges which are connected using bolts of significant size. currently m72 bolts are used for connecting a wind turbine tower to a monopile or transition piece. in a first step, these bolts are electrically tightened with 8.000 nm. in a second step, the preload is increased with hydraulic tools to 22.000 nm. the bolts itself are heavy and the tools for tightening the bolts is also heavy and hard to handle. it appears that the actual preload on the bolts after some settling time is hard to predict and control, and may vary significantly. although it is not exactly clear which factors influence the torque-tension relationship of the bolts, it may be concluded that installing the bolts using a “constant torque” method does not achieve satisfying results. similar issues occur with tensioning systems for bolting. the preload on the bolts must be regularly checked and adjusted, periodically requiring significant maintenance work. furthermore, the bolts are arranged all around the circumference of the flanges, leaving only a very limited gap between adjacent bolts. a connection using flanges with bolts is insufficiently scalable to meet the ever increasing demands resulting from even larger wind turbines and greater depths as sea where they are installed. international patent application wo 2018/139929 al of the same inventor proposes an assembly that is improved relative to a connection using flanges connected by bolts. this improved prior art assembly comprises: - a first and a second section, each comprising a longitudinal axis; - a fixation configured to fix the first and the second section; - wherein at least one of the first and the second section comprises a body that is configured to be engaged by the fixation; and - wherein the fixation comprises an abutment and a radially displaceable actuator. the actuator is radially displaceable with respect to the longitudinal axis of the section that comprises the actuator. this allows the actuator itself to be employed as part of a clamp. during radial displacement of the actuator, an inclined surface of the actuator engages a specially machined surface of the first section and gradually increases the clamping force that connects the first and the second section. although the assembly of wo 2018/139929 al already provided a significant improvement relative to the above-described traditional prior art connections using flanges connected by bolts, the inventor proposed further improvements, especially in order to overcome the disadvantage of the assembly of wo 2018/139929 al that a radial displacement of the actuator required a significant force due to the clamping action. moreover, sections with a specially designed contact surface were required. international patent application wo 2020/035770 al of the same inventor, which is considered the closest prior art for the present invention, proposed an improved assembly. at least the features of the characterizing portion of claim 1 are novel relative to wo 2020/035770 al. relative to the assembly of wo 2018/139929 al, a user may insert the connector of wo 2020/035770 al into the channel to an end position in a first step, followed by a further step of consecutively expanding said connector radially relative to said channel, to thereby connect the first and second member relative to each other. in this way, the connector may be accurately and easily placed in the channel by a user with very limited hassle or force. only when the connector is placed in its desired end position, it is expanded in the channel to connect the first and second member relative to each other. use of a connector as described in wo 2018/139929 al also makes specially machined contact surfaces with an inclination corresponding to an inclination of the radially displaceable actuator redundant. relative to the older prior art of bolted flanges, large scale (e.g. m72 as used nowadays in the year 2021, and future windparks even considering bolts up to m90) bolts are redundant. also, the body may be less bulky than a flange comprising passages to accommodate a bolt. as a result, the assembly according to the invention, requires less material, is therefore more compact and lighter, and also more elegant. whereas thick parts need to be forged, smaller parts may also be rolled, possibly allowing the members to be formed with alternative and more attractive manufacturing methods. also, the assembly as described in wo 2018/139929 al is scalable, providing the opportunity to arrange multiple connectors in an axial direction of the members. a further advantage of the assembly of wo 2020/035770 al relative to traditional bolted flanges, is the absence of these flanges, that would provide a significant mass outside the path where forces travel during driving the assembly into a ground using a hammer. the mass of conventional flanges may result in bending of the neck of the flanges. these bending stresses currently result in significantly reduced life time of the welds of these flanges when installed with a conventional impact hammer. an even further advantage of the assembly of wo 2020/035770 al relative to bolted flanges, is that it may be applied for connecting members under the waterline. on the one hand, longitudinal members of a limited length may be used, allowing smaller ships to transport them to a desired location for an offshore construction. the successively tightening the bolts of a bolted flange - which are typically tightened in multiple steps, as mentioned above - is very time consuming and labor-intensive. the assembly proposed in wo 2020/035770 al is less labor-intensive and time consuming than a connection having bolted flanges. compared to the older prior art of bolted flanges as described above, the connection provided by wo 2020/035770 al will show a superior fatigue resistance which is less sensitive to preload loss than typical bolted l-flanges, even under reduced preload levels relative to the initial torque upon installment. in bolted l-flanges the pre-tension is vital to prevent significant load fluctuations from occurring in the bolts or studs which have a poor fatigue resistance due to the presence of the threads. the connection provided by the proposed assembly proposed in wo 2020/035770 al does not experience these issues since the bolt only keeps the wedges in place but is, due to its orientation, not subjected to large load fluctuations. the main / dominant load fluctuations are experienced in the first member. as discussed above, the previous international patent applications wo 2018/139929 al and wo 2020/035770 al of the same inventor already proposed a large number of significant improvements relative to the older prior art of bolted flanges. nevertheless, there is an ongoing need to further improve such assemblies. in particular, there is an ongoing desire to optimize such an assembly, while preferably maintaining as much as possible of the above mentioned advantages of the closest prior art wo 2020/035770 al. an objective of the present invention is to provide an assembly, that is improved relative to the prior art and wherein at least one of the above stated problems is obviated or alleviated. said objective is achieved with the assembly according to claim 1 of the present invention, comprising: - a first member and a second member, wherein; - the second member has a fork-shaped cross section with a main body arranged between two substantially parallel walls that each comprise at least one passage; - the first member is arranged between the two walls of the second member in abutting contact with a face of the main body of the second member, the first member comprising a passage; - said passage of the first member and the passages of the second member define a channel; - a connector that is axially insertable into said channel to an end position and consecutively expandable radially relative to said channel, to connect the first and second member relative to each other by pushing, in an expanded state of the connector, the first member in a radial direction relative to said channel against the face of the main body of the second member to define a clamping contact and thereby a pre-tensioned connection in said radial direction relative to said channel between the face of the main body of the second member and faces defined by the passages in the substantially parallel walls of the second member; - wherein said connector exhibits a length extending in a longitudinal direction of the channel and comprises: - a first expansion block that is configured to push the first member against the face of the main body of the second member; - a second expansion block that is configured to contact the faces defined by the passages in the substantially parallel walls of the second member; and - one or more than one wedge that is arranged in between the first expansion block and the second expansion block, and that is configured to be displaced longitudinally relative to the channel to thereby radially expand the connector relative to the channel; and - wherein, at a cross section halfway the length of the connector, the cross sectional area and the height of the first expansion block in the radial direction relative to said channel is smaller than the cross sectional area and the height of the second expansion block in said radial direction relative to said channel. due to the cross sectional area and the height of the first expansion block being smaller than the cross sectional area and the height of the second expansion block, the total radial height of the connector may be optimized, especially in view of providing an optimized strength to dimension ratio. thus, compared to the connector of the assembly according to the closest prior art wo 2020/035770 al, the dimensions of the connector may be smaller at the same strength of the connector. a smaller connector saves materials, both in the connector itself, but also in the first and second member of the assembly. a smaller connector is also lighter in weight, which is an advantage for personnel installing said connectors. and besides providing an assembly with an optimized connector, as much as possible of the above mentioned advantages of the closest prior art wo 2020/035770 al are also maintained. the invention further relates to a method of assembling a first and a second member that each comprise at least one passage, wherein the second member has a fork-shaped cross section with a main body arranged between two substantially parallel walls that each comprise at least one passage, said method comprising the steps of: - arranging the first member between the two walls of the second member; - positioning the passages of the first and the second member to define a channel; - providing a connector that comprises: - a first expansion block that is configured to push the first member against the face of the main body of the second member; - a second expansion block that is configured to contact faces defined by the passages in the substantially parallel walls of the second member; and - one or more than one wedge that is arranged in between the first expansion block and the second expansion block, and that is configured to be displaced longitudinally relative to the channel by an actuator to thereby radially expand the connector; - inserting the connector into the channel to an end position; - consecutively expanding said connector radially relative to said channel, to thereby connect the first and second member relative to each other; - the expanded connector pushing the first member in a radial direction relative to said channel against a face of the main body of the second member to define a clamping contact and thereby a pre-tensioned connection in a radial direction relative to said channel between the face of the main body of the second member and faces defined by the passages in the substantially parallel walls of the second member; and - wherein the step of providing the connector comprises providing a connector of which, at a cross section halfway the length of the connector, the cross sectional area and the height of the first expansion block in the radial direction relative to said channel is smaller than the cross sectional area and the height of the second expansion block in said radial direction relative to said channel. preferred embodiments are the subject of the dependent claims. the various aspects and features described and shown in the specification can be applied, individually, wherever possible. these individual aspects, and in particular the aspects and features described in the attached dependent claims, may be an invention in its own right that is related to a different problem relative to the prior art and that may be made the subject of a divisional patent application. in the following description preferred embodiments of the present invention are further elucidated with reference to the drawing, in which: figure 1 is a schematic view of an offshore wind turbine tower supported by a monopile; figure 2 is a perspective view of an assembly according to the present invention; figure 3 is a cross sectional perspective view of the assembly shown in figure 2; figure 4 is a perspective view of the connector; figure 5 is a cross sectional view of the connector of figure 4; figure 6 is a detailed side view of the connector of figure 4; figure 7 is an exploded perspective view of the connector of figure 4; figures 8-10 are cross sectional views of successive steps of assembling an assembly according to the invention; figure 11 is a detailed cross sectional view of figure 10; figure 12 is a detailed cross sectional view of figure 11; figure 13 is a cross sectional view of a final step of assembling the assembly according to the invention; figure 14 is a detailed cross sectional view of figure 13; and figure 15 shows the forces acting in the radially expanded state of the connector of figure 13. an example of an offshore construction comprising multiple connections c where an assembly according to the invention may be applied is shown in figure 1. an offshore wind turbine tower 1 is supported by a supporting base structure 2 which is in figure 1 embodied as a monopile 3 with a transition piece 4. the skilled person will understand that similar connections are present for alternative supporting base structures 2, such as (not shown) jackets. the connections c may be applied between separate members 8 of the monopile 3, between the monopile 3 and the transition piece 4, between the transition piece 4 and the turbine tower 1, between members 9 of the turbine tower 1, and between a rotor blade 6 and a hub of a rotor. during use, a wind turbine 5 will be oriented such that the rotor blades 6 are optimally driven by the available wind power. the rotor blades 6 drive a (not shown) generator in the nacelle 7, wherein the generator generates electricity. the wind turbine 5 causes alternating loads on any connection c in the construction, and dependent on the wind direction, specific parts of the connection c have to absorb most of the loads. the assembly according to the present invention comprises a first member 10 and a second member 11. the second member 11 has a fork-shaped cross section with a main body 12 arranged between two substantially parallel walls 13 that each comprise at least one passage 14 (figure 8). the first member 10 is arranged between the two walls 13 of the second member 11 in abutting contact with a face 15 of the main body 12 of the second member 11. the first member 10 also comprises a passage 16. the passage 16 of the first member 10 and the passages 14 of the second member 11 define a channel 17 (figure 9). the term “substantially” in relation to the substantially parallel walls 13 of the second member 11 is to be interpreted as said walls 13 enclosing an angle of less than 10°. a connector 18 (figures 4-7) is axially insertable into said channel 17 to an end position and consecutively expandable radially relative to said channel 17, to connect the first member 10 and the second member 11 relative to each other by pushing, in an expanded state of the connector 18, the first member 10 in a radial direction relative to said channel 17 against the face 15 of the main body 12 of the second member 11. due to this pushing action, a clamping contact is defined, which results in a pre-tensioned connection in said radial direction relative to said channel 17 between the face 15 of the main body 12 of the second member 11 and faces 19 (figure 8) that are defined by the passages 14 in the substantially parallel walls 13 of the second member 11. the connector 18 exhibits a length l extending in a longitudinal direction of the channel 17 and comprises a first expansion block 20 that is configured to push the first member 10 against the face 15 of the main body 12 of the second member 11, and a second expansion block 21 that is configured to contact the faces defined 19 by the passages 14 in the substantially parallel walls 13 of the second member 11. the connector 18 furthermore comprises one or more than one wedge 22, 23 that is arranged in between the first expansion block 20 and the second expansion block 21, and that is configured to be displaced longitudinally relative to the channel 17 to thereby radially expand the connector 18 relative to the channel 17. at a cross section cs halfway the length l of the connector 18, the cross sectional area ai and the height hi of the first expansion block 20 in the radial direction relative to said channel 17 is smaller than the cross sectional area az and the height hz of the second expansion block 21 in said radial direction relative to said channel 17. after many years of testing and finite element simulations of the connector described in the closest prior art document wo 2020/035770 al, the inventor has come to the insight that the first expansion block 20 and the second expansion block 21 are exposed to bending moments of a very different magnitude, even though they jointly provide the clamping contact for the pre-tensioned connection between the first member 10 and the second member 11. this difference in bending moment may, in hindsight, be explained by the path the forces follow through the first expansion block 20, and the second expansion block 21, respectively (figure 15). forces passing through the first expansion block 20 follow a substantially straight path from the main body 12 of the second connector 11, via an end portion 24 of the first member 10 to the wedge(s) 22, 23. consequently, the first expansion block 20 is only exposed to a bending moment of limited magnitude. to the contrary, the bending moment experienced by the second expansion block 21 is directed slightly inward, i.e. towards the middle of the connector 18 where the cross section cs halfway the length l of the connector 18 is located, while the second expansion block 21 is supported only at its outer ends 25 on the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11. as a result, the second expansion block 21 has to be able to withstand a bending moment that is significantly larger than the bending moment experienced by the first expansion block 20. if, at the cross section cs halfway the length l of the connector 18, the cross sectional area ai and the height hi of the first expansion block 20 in the radial direction relative to said channel 17 is smaller than the cross sectional area az and the height hz of the second expansion block 21 in said radial direction relative to said channel 17, the connector 18 may be optimized in terms of strength in relation to its size. in other words, for connectors 18 having the same strength, the total height of the connector 18 according to the invention in radial direction relative to said channel may be significantly smaller than the height of the connector disclosed in the closest prior art document wo 2020/035770 al. a connector 18 having a smaller height results in a more compact connector 18 that requires less material and that is moreover lighter in weight and therefore easier to handle by personnel installing the connectors 18. moreover, a smaller and more compact connector 18 not only saves materials for the connector 18 itself, but also in the first member 10 and the second member 11 of the assembly. besides providing an optimized connector 18, the connector 18 according to the present invention is able to maintain as much as possible of the above mentioned advantages of the closest prior art wo 2020/035770 al. in the expanded state of the connector 18, it pushes against faces 19 of the passages 14 of the second member 11 that are directed away from the main body 12 thereof to define the pre-tensioned connection between the first member 10 and the second member 11. in the expanded state of the connector 18, wherein the connection between the first member 10 and the second member 11 is pre-tensioned, the passage 16 of the first member 10 is arranged at an offset relative to the passages 14 in the second member 11. this offset is arranged in the radial direction relative to the channel 17. the connector 18 comprises a compacted state, wherein the connector 18 has a size that is freely insertable into and out of the channel 17 (figure 9), and a connecting state, wherein the connector 18 is radially expanded in the channel 17 to connect the first 10 and second member 11 relative to each other (figure 13 and 14). at the cross section cs halfway the length l of the connector 18, the height hi of the first expansion block 20 in the radial direction relative to said channel 17 is preferably equal to or less than 66% of the height hz of the second expansion block 21 in said radial direction relative to said channel 17. the position of this cross section cs halfway the length l of the connector 18 is arranged at or near the middle of the face 15 of the main body 12 of the second member 11. as explained above, at this position, forces passing through the first expansion block 20 are only of a limited magnitude, whereas the bending forces experienced by the second expansion block 21 reach a maximum value at this position. at the cross section cs halfway the length l of the connector 18, the cross sectional area ai of the first expansion block 20 is preferably equal to or less than 66% of the cross sectional area az of the second expansion block 21. a larger cross sectional area is related to an increased bending strength. in a preferred embodiment, the height hi of the first expansion block 20 in the radial direction relative to said channel 17 is, at a cross section cs halfway the length l of the connector 18, at least 50% of a radius of a side of the passage 14 in the first member 10 that is directed towards the main body 12 of the second member 11. however, even more preferably the height hi of the first expansion block 20 in the radial direction relative to said channel 17 is, at the cross section cs halfway the length l of the connector 18, in the range of 100% - 125% of the radius of the side of the passage 14 in the first member 10 that is directed towards the main body 12 of the second member 11. in the shown embodiment, the height hi is about 100% of the radius of the side of the passage 14, which allows the first expansion block 20 to abut against substantially the full area of a face 26 of the end portion 24 of the first member 10 and distribute the forces over a maximum area, while at the same time allowing the height hi of the first expansion block 20 to be as small as possible. if the first expansion block 20 is strong enough to withstand the forces it is exposed to at this height hi, there is no need to further increase the height hi. the smaller the height hi of the first expansion block 20, the more compact and lightweight the connector 18 may be. the connector 18 is shown in great detail in figures 4-7. the one or more than one wedge 22, 23 comprises a first sliding surface 27, 28 in contact with the first expansion block 20 and a second sliding surface 29, 30 that is in contact with the second expansion block 21. the shown connector 18 comprises a wedge 22, 23 on either side relative to the cross section cs halfway the length l of the connector 18. these wedges 22, 23 are arranged in a mirrored arrangement relative to the cross section cs halfway the length l of the connector 18. the first sliding surfaces 27, 28 of the wedges 22, 23 slide along sliding surfaces 34 of the first expansion block 20. likewise, the second sliding surface 29, 30 of the wedges 22, 23 slide along sliding surfaces 35 of the second expansion block 21 (figures 6 and 7). although both wedges 22, 23 may be identical in size, this is not the case in the shown embodiment. the wedge 22 exhibits a greater length to make it easily accessible and actuated by an actuator 31, which is embodied as a nut 32 that may be driven along a threaded rod 33. however, the opposite wedge 23, that doesn’t need to be readily accessible, may deliberately be designed smaller to save weight and design the connector 18 as lightweight as possible. the first sliding surface 27, 28 encloses a first angle a relative to the longitudinal direction of the channel 17, and the second sliding surface 29, 30 encloses a second angle 0 relative to the longitudinal direction of the channel 17, wherein the first angle a is smaller than the second angle 0. the larger height h of the second expansion block 21, that is required to provide sufficient bending strength, may also be used to accommodate a wedge 22, 23 requiring a relatively large second angle 0. in this way, the radial expansion range of the connector 18 may be provided primarily or even fully by the larger second expansion block 21, allowing the height hi of the first expansion block 20 to be as small as possible. the first angle a being smaller than the second angle 0 thus allows the connector 18 to be optimized terms in of strength in relation to its size. the first angle a is in the range of 0 - 15°, and preferably in the range of 0 - 5°. in the shown preferred embodiment, the first angle a is about 0°, which allows the first expansion block 20 to be designed with a minimum height hi. the second angle 0 is in the range of 5 - 30°, which allows for a sufficient radial expansion range of the connector 18, even if the first angle a is in the range of 0 - 15°. in order to further reduce the weight of the connector 18, the height hi of first expansion block 20 may reduce towards one or more than one longitudinal end 36 thereof. a method of assembling the first member 10 and the second member 11 is now described with reference to figures 8-14. figure 8 shows the step of arranging the first member 10 between the two walls 13 of the second member 11. the next step comprises positioning the passages 14, 16 of the first 10 and the second member 11 to define a channel 17 (figure 9). figure 9 also shows the step of providing a connector 18 that comprises a first expansion block 20, a second expansion bock 21, and one or more than one wedge 22, 23. the first expansion block 20 is configured to push the first member 10 against the face 15 of the main body 12 of the second member 11, and the second expansion block 21 is configured to contact faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11. the one or more than one wedge 22, 23 is arranged in between the first expansion block 20 and the second expansion block 21, and is configured to be displaced longitudinally relative to the channel 17 to thereby radially expand the connector 18. according to the invention, this step of providing the connector 18 comprises providing a connector 18 of which, at a cross section cs halfway the length l of the connector 18, the cross sectional area ai and the height hi in the radial direction relative to said channel 17 of the first expansion block 20 is smaller than the cross sectional area az and the height h in said radial direction relative to said channel 19 of the second expansion block 21. the previous step is followed by inserting the connector 18 into the channel 17 to an end position (figure 10). in figure 10, the connector 18 is still in a compacted state, wherein the connector 18 has a size that is freely insertable into and out of the channel 17. figure 11 is a detailed cross sectional view of figure 10, showing that there is still a gap 39 in between the first expansion block 20 and the face 26 of the end portion 24 of the first member 10. the next steps comprise the step of consecutively expanding said connector 18 radially relative to said channel 17, to thereby connect the first member 10 and the second member 11 relative to each other, and the expanded connector 18 pushing the first member 10 in a radial direction relative to said channel 17 against the face 15 of the main body 12 of the second member 11 to define a clamping contact and thereby a pre-tensioned connection in a radial direction relative to said channel 17 between the face 15 of the main body 12 of the second member 11 and the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11. in the shown preferred embodiment, the second expansion block 21 is configured to abut the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11 only at or near longitudinal ends 37 of said second expansion block 21 when the connector 18 is in an unloaded state, i.e. the compacted state, prior to the connector 18 being expanded to the expanded state thereof. thus, for the method, the step of inserting the connector 18 into the channel 17 to an end position comprises an end position wherein the second expansion block 21 abuts the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11 only at or near longitudinal ends 37 of said second expansion block 21 when the connector is in an unloaded state. this is the state shown in figure 10, and in more detail in figures 11 and 12. only at or near longitudinal ends 37 is interpreted as a contact surface between the outer end 25 of the second expansion block 21 and the face 19 extending over less than 25% of the length of the faces 19 in the longitudinal direction of the channel 17. in the shown preferred embodiment, the second expansion block 21 is configured to abut the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 21 over at least half of the length of said faces 19 when the connector 18 is radially expanded to the expanded state to define the pre-tensioned connection. thus, for the method, the step of the expanded connector 18 pushing the first member 10 in a radial direction relative to said channel 17 comprises deforming the second expansion block 21 of the connector 18 until the second expansion block 21 abuts the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11 over at least half of the length of said faces 19 when the connector 18 is radially expanded to the expanded state to define the pre-tensioned connection. this is the state shown in figures 13-15. in the detailed view of figure 14, the contact surface 38 between the outer end 25 of the second expansion block 21 and the face 19 had increased due to the deformation of the second expansion bock 21. as result of this deformation, the contact surface 38 now extends over substantially the full length of the face 19 in the longitudinal direction of the channel 17. by starting the initial contact only at or near the longitudinal ends 37 of the second expansion block 21, and due to the contact surface 38 between the outer end 25 of the second expansion block 21 and the faces 19 of the second member 11 only gradually increasing when the second expansion block 21 deforms when the bending forces increase, it is prevented that the substantially parallel walls 13 of the second member 21 are pushed away from each other, i.e. outward relative to the longitudinal direction of the channel 17. as a result, the thickness of the walls 13 of the second member 21 that extends parallel to the longitudinal direction of the channel 17 may be reduced. consequently, the second member 11 may be designed lighter, saving material. starting the initial contact only at or near the longitudinal ends 37 of the second expansion block allows for a more homogeneous pressure distribution between the second member 21 and the faces 19, thereby reducing the risk of significant plastic deformation. the outer end 25 of the second expansion block 21 and the faces 19 defined by the passages 14 in the substantially parallel walls 13 of the second member 11 preferably enclose an angle y < 2° upon initial contact in the unloaded state of the connector 18. although the faces 19 may be machined to provide the angle y, this angle y is preferably defined by a corresponding shape or curvature r (see figure 11) of at least the out end of the second expansion block 21. it is easier to machine the second expansion blocks 21 during manufacture and prior to assembling the connector 18, than it is to machine the faces 19 in the passages 14. in case of a curvature r, the angle y is defined by the tangent at the contact between the outer end 25 of the second expansion block 21 and the faces 19 of the second member 11. the material of the second expansion block 21 may exhibit a higher yield strength than the material of first expansion block 20. in a preferred embodiment (as best seen in figure 13), the first expansion block 18 comprises an abutting surface 181 that is configured to abut the first member 24 when the connector is radially expanded to the expanded state to define the pre-tensioned connection. the abutting surface 181 may be shaped such that, in the compacted state, a distance between the abutting surface 181 and the first member 24 in the radial direction is smaller between a central portion 182 of the abutting surface, that is preferably arranged near the longitudinal center of the first expansion block 18, and the first member 24 than between an outer portion 183 of the abutting surface 181, that is preferably arranged further from the longitudinal center (i.e. as seen along the longitudinal direction of the channel 17) of the first expansion block 18, and the first member 24. hereby, upon tensioning the connector, the central portion 182 is first to abut the first member 24 and the outer portion 183 abuts said first member 24 at a later stage, thereby reducing stress concentrations, when in the pre-tensioned state, in the edges 241 of the first member 24. hereby, the central portion 182 preferably extends, in the radial direction towards the first member 24, 4 mm or less, more preferably 2 mm or less, most preferably 1 mm or less, preferably at least 0.01 mm, more preferably at least 0.1 mm, further than the outer portion 183. to this end, the abutting surface 181 preferably has a curvature, around an axis that is substantially perpendicular to the longitudinal direction of the channel 17 and substantially perpendicular to the radial direction, wherein said curvature preferably has a radius of at least 900 mm. the above described embodiment is intended only to illustrate the invention and not to limit in any way the scope of the invention. accordingly, it should be understood that where features mentioned in the appended claims are followed by reference signs, such signs are included solely for the purpose of enhancing the intelligibility of the claims and are in no way limiting on the scope of the claims. the scope of protection is defined solely by the following claims.
152-685-713-144-060	US	[ "US" ]	H03H9/21	1987-01-27T00:00:00	1987	[ "H03" ]	double-tuning-fork resonator with means to sense tine breakage	a double-tuning-fork (dtf) resonator having electrical circuitry operable, if either tine breaks, to develop a characteristic electrical circuit condition which is detected to produce an indication of failure. in one preferred embodiment, the circuitry includes a dual series circuit for energizing the electrodes on the dtf tines, with (1) a first series circuit passing down one tine to the remote end thereof, across the support segment at that end of the dtf, and back up the other tine, and (2) a second series circuit passing down the other tine to the remote end thereof, across said support segment at that end, and back up the first-mentioned tine. if either tine breaks, or if there is fracture of another part of the dtf carrying an electrode energizing lead, vibratory excitation of both tines ceases, and the output signal is caused to go to a level (e.g. zero) clearly indicating failure of the instrument.	1. in a double-tuning-fork (dtf) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines to be activated by a source of alternating current energy to produce vibration of said tines at the resonant frequency thereof; the improvement for assuring that failure of said resonator will be known in the event that fracture occurs in part of said dtf, comprising: circuit means forming part of said dtf and operable in the event of said fracture to develop an electrical circuit characteristic representative of said fracture; and means responsive to development of said electrical circuit characteristic for indicating failure of said dtf as a result of said fracture. 2. apparatus as claimed in claim 1, wherein said circuit means comprises series circuitry passing down one tine of the dtf to the end thereof, across the segment at that end to the other tine, and back up said other tine to provide for interruption of said series circuitry by breakage of either of said tines. 3. apparatus as claimed in claim 2, wherein said responsive means comprises electrical means coupled to said series circuitry and operable to produce a failure indication in response to any interruption of said series circuitry caused by said tine breakage. 4. in a double-tuning-fork (dtf) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines to be activated by a source of alternating current energy to produce vibration of said tines at the resonant frequency thereof; the improvement for assuring fail-safe operation of said resonator in the event that said dtf is fractured in the regions near the ends of said tines or in one of said tines, comprising: series circuitry passing down one tine of the dtf to the end thereof, across the segment at that end to the other tine, and back up said other tine to provide for interruption of said series circuitry by fracture in said regions or either of said tines; and electrical means coupled to said series circuitry and operable to produce a failure indication in response to any interruption of said series circuitry caused by said fracture. 5. apparatus as claimed in claim 4, wherein said series circuitry is a dual-series circuit comprising a first series circuit connected to a first set of said electrodes and a second series circuit connected to a second set of said electrodes; said first and second sets of electrodes together constituting all of the electrodes of said dtf. 6. apparatus as claimed in claim 5, wherein said first set of electrodes is distributed between said first and second tines, and said second set of electrodes also is distributed between said first and second tines. 7. apparatus as claimed in claim 6, wherein said second set of electrodes comprise opposed electrode pairs which are counterparts to corresponding opposed pairs of said first set of electrodes, said two sets of electrodes being cooperative when energized at opposite a-c polarities to produce vibration of said tines. 8. apparatus as claimed in claim 4, wherein said series circuitry comprises a serial circuit independent of any circuitry for activating said electrodes. 9. apparatus as claimed in claim 8, including an oscillator coupled to said dtf electrodes to produce an oscillatory signal at the resonant frequency of said dtf; and means responsive to interruption of said series circuit for deactivating said oscillator. 10. in a double-tuning-fork (dtf) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines for coupling to a source of alternating current energy for activating said electrodes to produce vibration of said tines at the resonant frequency thereof; that improvement for assuring fail-safe operation of said resonator in the event that one of said tines breaks, comprising: first circuit means for electrically activating said first set of electrodes comprising a first serial circuit connected to all of the electrodes of said first set, said first serial circuit extending down said first tine to the end thereof, across said second support segment, and back up said second tine; and second circuit means for electrically activating said second set of electrodes comprising a second serial circuit connected to all of the electrodes of said second set of electrodes, said second serial circuit extending down said second tine to the end thereof, across said second support segment, and back up said first tine. 11. apparatus as claimed in claim 10, wherein said first set of electrodes comprises pairs of electrodes on opposite surfaces of a tine of said dtf; said second set of electrodes also comprising pairs of electrodes on opposite surfaces of a tine of said dtf, with each pair of said second set interleaved with a counterpart pair of said first set of electrodes. 12. apparatus as claimed in claim 10, wherein said first series circuit is connected at its beginning to a first terminal pad on said resonator; said second series circuit being connected at its beginning to a second terminal pad on said resonator. 13. in a double-tuning-fork (dtf) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines for coupling to a source of alternating current energy for activating said electrodes to produce vibration of said tines at the resonant frequency thereof; that improvement for assuring fail-safe operation of said resonator in the event that one of said tines breaks, comprising: an oscillator coupled to said electrodes for developing an oscillator signal at the resonant frequency of the dtf; an impedance monitoring circuit coupled to said oscillator and responsive to the impedance presented by said dtf; and means for developing a failure indication when the impedance of said dtf changes in response to breakage of one of said tines. 14. apparatus as claimed in claim 13, including frequency-responsive means coupled to said oscillator; and means responsive to said impedance monitoring circuit for deactivating said frequency-responsive means when a tine breaks. 15. in a double-tuning-fork (dtf) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines for coupling to a source of alternating current energy for activating said electrodes to produce vibration of said tines at the resonant frequency thereof; that improvement for assuring fail-safe operation of said resonator in the event that one of said tines breaks, comprising: oscillator means coupled to the electrodes on one of said tines to deliver oscillatory energy thereto to produce vibration of said one tine; and receiving means coupled to the electrodes on the other of said tines to receive the signals produced in response to vibration of said other tine; whereby if either tine breaks, the output of said receiving means will cease and thereby indicate failure of said dtf. 16. in a double-tuning-fork (dta) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines to be activated by a source of alternating current energy to produce vibration of said tines at the resonant frequency thereof; the improvement for assuring that failure of said resonator will be known in the event that one of said tines breaks, comprising: circuit means forming part of said dtf and operable in the event of breakage of either of said tines to develop an electrical circuit characteristic representative of said breakage; and means responsive to development of said electrical circuit characteristic for indicating failure of said dtf as a result of said breakage. 17. in a double-tuning-fork (dtf) resonator having two side-by-side tines joined at their ends by first and second support segments, said tines having first and second sets of electrodes distributed along the surfaces of both of said tines to be activated by a source of alternating current energy to produce vibration of said tines at the resonant frequency thereof; the improvement for assuring fail-safe operation of said resonator in the event that one of said tines breaks, comprising: series circuitry passing down one tine of the dtf to the end thereof, across the segment at that end to the other tine, and back up said other tine to provide for interruption of said series circuitry by breakage of either of said tines; and electrical means coupled to said series circuitry and operable to produce a failure indication in response to any interruption of said series circuitry caused by said tine breakage.	background of the invention 1. field of the invention this invention relates to resonant sensors of the type known as double-tuning-forks (dtfs). such devices can be likened to a pair of tuning forks with their tines secured end-to-end. more particularly, this invention relates to such sensors which are coupled to an electrical circuit such as an oscillator producing output signal corresponding to the resonant frequency of the dtf, which frequency in turn is responsive to a condition such as applied force. 2. description of the prior art resonant sensors of the dtf type have been known for many years. these devices commonly are made from piezoelectric materials such as crystalline quartz. the resonant frequency typically is determined by coupling the piezoelectric excitation electrodes to an oscillator which produces an oscillatory signal at the resonant frequency of the dtf. the frequency of that signal can be measured in any of various ways. there is extensive prior art describing pertinent characteristics of dtf sensors as well as the many applications that have been proposed. because the resonant frequency of a dtf is a function of force applied to the element, many applications involve force measurement, e.g. to measure the differential-pressure developed across an orifice plate to determine the flow rate of a fluid developed in an industrial process. for a sampling of prior art disclosures relating to dtfs, reference may be made to u.s. pat. nos. 3,238,789; 4,215,570; 4,299,122; 4,321,500 and 4,372,173. dtf sensors offer important advantages when used to measure force. in particular, because dtfs have a very high mechanical q, they are able to make force measurements with high resolution. also, such sensors can be manufactured economically by use of photolithographic techniques of the kind which have been extensively developed in the semiconductor industry. such dtf sensors typically are very small in size. for example, one unit for measuring forces up to 300 grams was one-half inch long, with tines slightly less than 0.01" square and one-third inch long. with such small size, dtfs are relatively fragile, and it has been found from experience that some percentage of them can be expected to break in usage, such as due to excessive shock or vibration. particularly sensitive to breakage are the vibratory beams or tines of the fork, because of their small cross-sectional dimensions, and due to the fact that inclusions can develop during the crystal growth processes and small pits can develop during the chemical etching processes. breakage of a single tine can create a severe problem because the remaining tine may continue to vibrate, but at a frequency different from that obtained when both tines were vibrating. such continued vibration can occur in prior art dtfs because the piezoelectric excitation electrodes are activated through connection leads which branch out to provide two parallel circuits running down both tines away from the area where connections are made to the external lead wires. thus if one tine fractures, electrodes on the remaining tine are still energized so as to maintain vibration. when one tine is broken, the stress on the intact tine doubles, and its resonant frequency increases. accordingly, the output of the instrument will change, so as to produce an erroneous measurement, possibly double that of the true measurement. this is because a dtf with both tines active, or with just one of its tines intact, has approximately the same vibratory frequency as a function of applied stress, so that the increased stress on the intact tine produces a corresponding change in vibratory frequency. another undesirable mode of failure can occur when the dtf fractures in a lead-carrying region at the remote end of the crystal, i.e. at the end remote from the external wire-connection area. in this case, both tines would remain intact and can resonate at the zero stress frequency because the sensor mechanism is unable to apply stress to the resonator, thereby falsely indicating zero force input from the process. of particular concern is that such errors may not be evident in any way to the user of the instrument. such erroneous measurements can of course cause serious trouble in many applications, as where the sensor is used as an integral part of an overall instrumentation system for an industrial process or the like. thus, a solution to this problem of tine breakage is urgently needed. summary of the invention in accordance with the invention, a double-tuning-fork resonator is provided with fail-safe electrical circuitry operable, in response to breakage of either tine, to develop a corresponding electrical circuit characteristic which in turn is detected to produce a failure indication. in certain embodiments, the electrical circuitry serially traverses both tines of the dtf, passing down one tine to the end thereof, across the support segment at the end of the dtf to the other tine, and back up that other tine. this series circuitry is coupled to electrical means operable to produce a failure indication in response to any interruption of the serial circuitry caused by breakage of either dtf tine. in a specially preferred embodiment, the circuitry includes a dual series circuit for energizing the electrodes on the dtf tines, with (1) a first series circuit passing down one tine to the remote end thereof, across the support segment at that end of the dtf, and back up the other tine, and (2) a second series circuit passing down the other tine to the remote end thereof, across said support segment at that end, and back up the first mentioned tine. the series circuitry is coupled to an associated oscillator arranged to electrically excite the sets of electrodes (films or other coatings) formed on the tines, to produce vibration thereof. when one tine breaks, vibratory excitation to both tines is entirely interrupted, due to the serial nature of the energizing circuitry, and to the fact that adjacent pairs of positive and negative electrodes at any region of the dtf must be simultaneously energized to produce a bending force and resulting vibratory motion. thus in this preferred embodiment the dtf ceases vibration completely, producing an indication of failure of the sensor. the complete cessation of vibration provides for "fail-safe" operation of the sensor. other aspects and advantages of the invention will in part be pointed out in, and in part apparent from, the following description of preferred embodiments of the invention, considered together with the accompanying drawings. brief description of the drawings fig. 1 is a plan view of a force-sensing double-tuning-fork (dtf) in accordance with the present invention, coupled to an oscillator the output of which is directed to a frequency meter; fig. 2 is a cross-sectional view taken along line 2--2 of fig. 1; fig. 3 is a plan view of a dtf illustrating schematically the layout of a dual series circuit for energizing the electrodes; figs. 4 and 5 are perspective views of a dtf in accordance with the present invention, shown from different angles; fig. 6 is a diagrammatic plan view illustrating the electrode connections for the dtf of figs. 1 and 2; fig. 7 shows another embodiment with separate electrical circuitry means to provide fail-safe operation; and fig. 8 shows still another embodiment wherein the electrodes of one tine are driven, and the electrodes of the remaining tine serve as receiver elements. description of preferred embodiments referring first to fig. 1, there is shown a double-tuning-fork (dtf), generally indicated at 10, in the form of a flat piezoelectric element comprising a pair of parallel beams or tines 12, 14 joined at their ends by respective support segments 16, 18. the left-hand segment 16 typically will be clamped in place, while an input force illustrated at f is applied to the other segment, thereby controlling the resonant frequency of the dtf in accordance with the applied force. the dtf 10 is formed integrally from a sheet of piezoelectric material, usually crystalline quartz, by photolithographic techniques known in the art. such techniques also are employed to form on the tines of the dtf groups of conductive electrodes generally indicated at 20-30. commonly (see, for example, u.s. pat. no. 4,469,979), six such groups of electrodes are employed, three groups on each tine, as shown in fig. 1. each group consists of four electrodes deposited respectively on the four surfaces of the tine by photolithographic techniques. the individual electrodes of each group, as shown in the sectional view of fig. 2, are designated herein by lower case letters "a" through "d". the left-hand end 16 of the dtf carries a pair of terminal pads 32, 34 for making connection to the electrodes 20-30 through conductive leads generally indicated at 36, and also formed by photolithographic techniques together with the electrodes. these leads (to be described in more detail hereinbelow) connect the upper pad 32 to one set of electrodes 20a,c; 22b,d; 24a,c; 26b,d; 28a,c; and 30b,d, distributed along both tines. the other pad 34 is connected to a second set of electrodes, also distributed along both tines, and comprising all of the remaining electrodes not in the first set. it will be seen that opposed pairs of electrodes of the first set have counterpart opposed pairs of electrodes in the second set. for example, referring to fig. 2, the top and bottom pair 22a,c of the group of electrodes 22 have a counterpart pair 22b,d which are the side electrodes of the group. the top and bottom electrodes are energized with one polarity of an applied a-c voltage, while the side pair are energized with the other polarity of the a-c voltage. the electrodes of each group cooperate in known fashion to produce the desired vibratory piezoelectric deformation of the dtf. in order to produce the bending force on the tine needed to effect vibratory motion, both pairs of electrodes of each group must be energized simultaneously. that is, one opposed pair must receive a signal of one polarity, and the other pair must, at the same time, receive a signal of the other polarity. if either pair is de-energized while the other pair is energized, no force (and thus no motion) will be produced. accordingly, interrupting the energization circuit for either pair of electrodes, of all groups of electrodes, is sufficient to assuredly prevent vibration of all sections of both tines. to energize the dtf all of the electrodes 20-30 are connected through the pads 32, 34 to an oscillator 38 which oscillates at the resonant frequency of the dtf as is understood in the art. the frequency of oscillation thus provides a measure of the applied force, and may be indicated by a frequency meter 40 or otherwise utilized, for example, as part of an instrumentation system. referring now more specifically to the arrangement for connecting the pads 32, 34 to the electrodes 20-30, a distinctive feature of this arrangement is that it comprises series circuitry which passes down one tine to the end thereof, across the support segment 18, and back up the other tine. if either tine breaks, this series circuitry will be interrupted, thereby interrupting the operative connection between the oscillator 38 and the electrodes of both tines. consequently, the oscillator in that event ceases operation, and its output signal goes to zero, indicating failure of the sensor. in one specially preferred embodiment, the series circuitry referred to above is a dual series circuit, comprising a first series circuit connecting one pad 32 to all of the electrodes of the first set of electrodes as identified above, and a second series circuit connecting the other pad 34 to the second set of electrodes referred to above. this arrangement is schematically outlined in fig. 3 which shows first and second series circuits 42, 44 extending from the pads 32, 34 down the respective tines, across the support segment at the remote end (via circuit segments 42a, 44a), and back up the other tine to dead end points 42b, 44b. to simplify understanding, these circuits 42, 44 are shown as straight-line conductors, but in reality they are topologically somewhat more complex, in order to effect connection to the respective sets of electrodes on all four sides of each tine. one-half of the electrodes of the first set identified above as connected to the upper pad 32 are on one tine, and the other half are on the other tine; similarly, the electrodes of the second set connected to the other pad 34 are divided equally between the two tines. the first set of electrodes identified above can also be defined as (referring againg to fig. 1): the top and bottom electrodes of the first group 20, the side electrodes of the second group 22, the top and bottom electrodes of the third group 24, the side electrodes of the fourth group 26, the top and bottom electrodes of the fifth group 28, and the side electrodes of the sixth group 30. the second set of electrodes can similarly be defined as: the side electrodes of the first group 20, the top and bottom electrodes of the second group 22, the side electrodes of the third group 24, the top and bottom electrodes of the fourth group 26, the side electrodes of the fifth group 28, and the top and bottom electrodes of the sixth group 30. the plan view of fig. 1 shows the conductive leads 50, 52 which are formed on the upper surface of the dtf to serve as the dual series circuits (42, 44) referred to above, connecting the pads 32, 34 with all of the electrodes. the electrodes on the sides and bottom of the tines are connected to the pads 32 or 34 by conductive leads which join the upper surface leads and extend down along sides of the dtf to the side electrodes, and to the bottom surface for connection to the bottom electrodes. since portions of these conductive leads cannot be seen in fig. 1, the perspective views of figs. 4 and 5 have been included to show these other portions. fig. 6 is a diagrammatic plan view presentation of the piezoelectric electrodes 20-30 and connections therebetween. (note that this view is not to scale, in order to improve the clarity of the presentation.) in this figure, interrupted (dashed) lines are used to illustrate those electrodes and leads which normally would be out of sight, i.e. on the undersurface of the dtf. the terminal pads 32, 34 carry relative polarity markings (+; -), as do the electrodes connected thereto, in order to show the connection pattern. (of course, the actual signal on the pads is a-c, not d-c.) fail-safe operation of the dtf, in response to breakage of one of the tines, is achieved in the preferred embodiment of figs. 1, 4 and 5 by the employment of the above-described dual series circuit for energizing the electrodes, as schematically indicated at 42, 44 in fig. 3. with such an arrangement, fracture of a tine 12 or 14 in any place results in interruption of one of the two energizing circuits for certain group(s) of electrodes, and interruption of the other energizing circuit for the remaining group(s) of electrodes. for example, considering a transverse fracture of one tine 12 at a point "x" (fig. 3) between two groups of electrodes, one of the energizing circuits 42 is interrupted for all electrode groups beyond that break point (i.e. between the break point and the dead end point 42b), while the other energizing circuit 44 is interrupted for all electrode groups ahead of the break point (i.e. between that break point and the other dead end point 44b). thus, every group of electrodes will include one de-energized pair of electrodes so that no bending force will be developed by any of the electrode groups and hence no vibratory motion will be produced. to put it differently, if either tine fractures, then one of the two series circuits on the remaining tine will be de-energized, and thus no vibratory movement can be imparted to that remaining tine. it has been found that a dtf can be expected to fracture at places other than directly at one of the tines. for example, referring still to fig. 3, there is a realistic possibility of transverse fracture in the regions adjacent the ends of the tines 12, 14, identified as zones a and b respectively. with the connection lead arrangement shown, such fracture will cause at least part of both of the dual series circuits 42, 44 to be de-energized, even though the tines themselves have not fractured, and thereby prevent vibratory excitation of either tine. for example, if a transverse fracture occurs in zone a, both circuits on both tines will be interrupted at the very beginning and thus de-energized. vibration will of course cease. alternatively, if fracture occurs in zone b, both series circuits 42, 44 will be interrupted beyond the remote ends of the tines, thereby (as in the example of point "x" in a preceding paragraph) de-energizing one opposed pair of electrodes in every group of four electrodes. thus, even though parts of these circuits 42, 44 ahead of the break point are able to energize corresponding pairs of electrodes (i.e. between the respective pad 32 or 34 and the break point), the counterpart pairs of electrodes of such groups will not be energized, and thus there will be no vibratory excitation of the corresponding regions of the tines. to assure fail-safe operation upon fracture in zone b, it is important to arrange the series energizing circuitry to pass over that zone, just beyond the ends of the tines, as shown in fig. 3. another way of detecting failure of the dtf is illustrated in fig. 1. there, an impedance monitor 60 is coupled to the oscillator 38 to respond to changes in the impedance presented by the dtf. if a tine breaks, the impedance will increase sharply. the impedance monitor 60 produces, in response to such change in impedance, an output signal which can be employed in various ways. for example, the output signal can as shown be directed to the frequency meter 40 to disable the meter, so that its zero output indication will show that the sensor has failed. as shown in fig. 7, a separate series circuit 62 can be provided on the dtf and coupled through additional terminal pads 64, 66 to a power supply 68 in series with a relay 70. if the circuit 62 is interrupted by breakage of a tine, the relay drops out and interrupts the power to the oscillator 38, thereby causing the sensor output to go to zero. this provides a fail-safe indication of failure. alternatively, the series circuit could be used as a fuse link in the oscillator power circuit. the arrangement of fig. 7 is less advantageous than the preferred embodiment of fig. 1 because it requires additional connections to the dtf. that is, a four-wire (or with certain modifications a three-wire) connection is required rather than the two-wire circuit of fig. 1. referring to fig. 8, still another way of enabling detection of breakage of a tine is to employ the electrodes on one tine 12a as drive electrodes, by connecting those electrodes through a pair of terminal pads 80, 82 and a pair of wires 84 to the oscillator 86, and to employ the electrodes of the other tine 14a as receive electrodes, to pick up the consequent vibrations of that tine and to direct the resultant signal through another pair of terminal pads 88, 90 and a second pair of wires 92 back to the oscillator. thus, if either tine breaks, one or the other of the circuits 84 or 92 is effectively disabled so as to interrupt the feedback path of the oscillator, thereby preventing operation of the oscillator 86 and thus indicating failure of the sensor. although several embodiments of the invention have been described herein in detail, this has been for the purpose of illustrating the principles of the invention, and should not necessarily be construed as limiting of the invention since it is apparent that those skilled in the art can make many modified arrangements of the invention without departing from the true scope thereof.
152-966-857-643-580	EP	[ "US", "EP", "WO" ]	C11D3/386,C11D1/83,C11D3/20,C11D3/33,C11D3/395,C11D11/00	2018-06-29T00:00:00	2018	[ "C11" ]	detergent compositions and uses thereof	the present invention relates to compositions such as cleaning compositions comprising a mix of enzymes. the invention further relates, use of compositions comprising such enzymes in cleaning processes.	1 . a cleaning composition comprising at least one dnase, at least one dispersin and at least one cleaning component(s), wherein the dnase comprises the motifs: a.(seq id no: 58)c[dn]treand(seq id no: 59)[dn]saek;b.(seq id no: 60)[kr]e[ag]w;orc.(seq id no: 61)rt[ts][dn][apntdps]gy. 2 . the cleaning composition according to claim 1 , wherein the dnase has at least 80% sequence identity to the amino acid sequence shown in any of seq id no: 24-57 and seq id no: 64. 3 . the cleaning composition according to claim 1 wherein the dnase is obtained from rhizoctonia solani or morchella costata. 4 . the cleaning composition according to claim 1 , wherein the dispersin is selected from the group of polypeptides: a) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 1, b) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 2, c) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 3, d) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 4, e) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 5, f) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 6, g) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 7, h) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 8, i) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 9, j) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 10, k) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 11, l) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 12, m) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 13, n) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 14, o) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 15, p) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 16, q) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 17, r) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 18, s) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 19, t) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 20, u) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 21, v) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 22, w) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 23, and x) a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 63. 5 - 7 . (canceled) 8 . a method of formulating a cleaning composition according to claim 1 comprising adding a fungal dnase, a dispersin and at least one cleaning component. 9 . a kit intended for deep cleaning, wherein the kit comprises a solution of an enzyme mixture comprising a fungal dnase, and a dispersin. 10 . a method of cleaning of an item, comprising the steps of: a) contacting the item with a wash liquor solution comprising an enzyme mixture comprising at least 0.00001 ppm of at least one fungal dnase, at least 0.00001 ppm of at least one dispersin; and a cleaning component, wherein the cleaning component is selected from; i) 1 to 40 wt % surfactant, selected from anionic or non-ionic surfactant; ii) 1 to 30% builder, preferably non-phosphate e.g. citric acid, methylglycinediacetic acid (mgda) or glutamic acid-n,n-diacetic acid (glda); and iii) 0 to 20% bleach component, preferably manganese triazacyclononane (mntacn); b) optionally rinsing the item, wherein the item is preferably a textile.	reference to a sequence listing this application contains a sequence listing in computer readable form, which is incorporated herein by reference. background of the invention the present invention relates to compositions such as cleaning compositions comprising a mix of enzymes. the invention further relates i) use of compositions comprising such enzymes in cleaning processes and/or for deep cleaning of biofilm soiling, and ii) methods for removal or reduction of biofilm related soiling. description of the related art enzymes have been used in detergents for decades. usually a cocktail of various enzymes is added to detergent compositions. the enzyme cocktail often comprises various enzymes, wherein each enzyme targets a specific substrate e.g. amylases are active towards starch stains, proteases on protein stains and so forth. textiles surface and hard surfaces, such as dishes or the inner space of a laundry machine enduring a number of wash cycles, become soiled with many different types of soiling which may be composed of proteins, grease, starch etc. one type of soiling may be organic matter, such as biofilm, eps, etc. organic matter contains different molecules such as polysaccharides, extracellular dna (edna), and proteins. some organic matter comprises an extracellular polymeric matrix, which may be sticky or gluey, which when present on textile, attracts soils and may course redeposition or backstaining of soil resulting in a greying of the textile. additionally, organic matters such as biofilms often cause malodor issue as various malodor molecules can be adhered by the polysaccharides, extracellular dna (edna), and proteins in the complex extracellular matrix and be slowly released to cause consumer noticeable malodor issue. enzymes having hexosaminidase activity include dispersins such as dispersin b (dspb), which as described is 8-n-acetylglucosaminidases belonging to the glycoside hydrolase 20 family. enzymes having hexosaminidase activity include chitinase and the use of such enzymes is described in wo9850512 (proctor and gamble). wo04061117 a2 (kane biotech inc) describe compositions comprising dspb for reducing and preventing biofilm caused by poly-n-acetylglucosamine-producing bacteria and describes the use of the compositions comprising dspb for reduction/removing biofilm on medical devices and for wound care. wo 2015/155350 (novozymes a/s) discloses the use of a polypeptide having dnase activity for preventing, reducing or removing a biofilm component e.g. dna from an item, wherein the polypeptide is obtained from a fungal source, such as aspergillus oryzae and the item is a textile. wo 2014/087011(novozymes a/s) discloses the use of a polypeptide having dnase activity for preventing, reducing or removing a biofilm component e.g. dna from an item, wherein the polypeptide is obtained from a bacterial source such as bacillus. wo 2017/059082 (novozymes a/s) discloses the use of a polypeptide having dnase activity for preventing, reducing or removing a biofilm component e.g. dna from an item. there is still a need for cleaning compositions, which effectively prevent, reduce or remove components of organic soiling, an effect also described in the present application as “deep cleaning. the present invention provides new compositions fulfilling such need. summary of the invention in a first aspect, the present invention relates to a cleaning composition comprising at least one dnase, at least one dispersin and at least one cleaning component(s). the dnase is preferably obtained from a fungal source, preferably rhizactonia solani or morchella costata. another aspect relates to the use of the cleaning composition comprising at least one dnase, at least one dispersin and at least one cleaning component(s) for cleaning of an item, wherein the item is a textile or a surface. a third aspect relates to a kit intended for deep cleaning, wherein the kit comprises a solution of an enzyme mixture comprising a fungal dnase, and a dispersin. a fourth aspect of the invention relates to a method of cleaning of an item, comprising the steps of: a) contacting the item with a wash liquor solution comprising an enzyme mixture comprising at least 0.00001 ppm of at least one fungal dnase, at least 0.00001 ppm of at least one dispersin; and a cleaning component, wherein the cleaning component is selected from; i) 1 to 40 wt % surfactant, selected from anionic or non-ionic surfactant;ii) 1 to 30% builder, preferably non-phosphate e.g. citric acid, methylglycinediacetic acid (mgda) or glutamic acid-n,n-diacetic acid (glda); andiii) 0 to 20% bleach component, preferably manganese triazacyclononane (mntacn); b) optionally rinsing the item, wherein the item is preferably a textile. a fifth aspect relates to a method of formulating a cleaning composition according to the invention comprising adding a fungal dnase, a dispersin and at least one cleaning component. detailed description of the invention various enzymes are applied in cleaning processes each targeting specific types of soiling such as protein, starch and grease soiling. enzymes are now standard ingredients in detergents for laundry and dish wash. the effectiveness of these commercial enzymes provides cleaning compositions such as detergents which removes much of the soiling. however, organic matters such as eps (extracellular polymeric substance) comprised in much biofilm constitute a challenging type of soiling due to the complex nature of such organic matters. none of the commercially available cleaning compositions effectively remove or reduce eps and/or biofilm related soiling. biofilm may be produced when cells from a group of microorganisms stick to each other or stick to a surface, such as a textile, dishware or hard surface or another kind of surface. these adherent cells are frequently embedded within a self-produced matrix of extracellular polymeric substance (eps), which constitute 50% to 90% of the biofilm's total organic matter. eps is mostly composed of polysaccharides (exopolysaccharides) and proteins, but include other macro-molecules such as edna, lipids and other organic substances. organic matter like biofilm may be sticky or gluey, which when present on textile, may give rise to redeposition or backstaining of soil resulting in a greying of the textile. another drawback of organic matter e.g. biofilm is the malodor as various malodor related molecules are often associated with organic matter e.g. biofilm. further, when dirty laundry items are washed together with less dirty laundry items the dirt present in the wash liquor tend to stick to organic matter e.g. biofilm or biofilm components as a result, hereof the laundry item is more “soiled” after wash than before wash. this is effect may also be termed re-deposition. the composition of the invention is preferably a cleaning composition, the composition comprises at least one dnase and at least one hexosaminidase, preferably a dispersin. examples of useful dnases and hexosaminidases are mentioned below in the sections “polypeptides having dnase activity” and “polypeptides having hexosaminidase activity”, respectively. the compositions of the invention comprising a blend of dnase and hexosaminidase e.g. dispersin and are effective in reducing or removing organic components and soiling from organic matter. polypeptides having dnase activity the term “dnase” means a polypeptide having dnase activity that catalyzes the hydrolytic cleavage of phosphodiester linkages in a dna backbone, thus degrading dna. the term “dnases” and the expression “a polypeptide with dnase activity” are used interchangeably throughout the application. for purposes of the present invention, dnase activity is determined according to the procedure described in the assay i or iv. preferably the dnase is selected from any of the enzyme classes e.c. 3.1.21.x, where x=1, 2, 3, 4, 5, 6, 7, 8 or 9, e.g. deoxyribonuclease i, deoxyribonuclease iv, type i site-specific deoxyribonuclease, type ii site-specific deoxyribonuclease, type iii site-specific deoxyribonuclease, cc-preferring endo-deoxyribonuclease, deoxyribonuclease v, t(4) deoxyribonuclease ii, t(4) deoxyribonuclease iv or e.c. 3.1.22.y where y=1, 2, 4 or 5, e.g. deoxyribonuclease ii, aspergillus deoxyribonuclease k(1), crossover junction endo-deoxyribonuclease, deoxyribonuclease x. preferably, the polypeptide having dnase activity is obtained from a microorganism and the dnase is a microbial enzyme. the dnase is preferably of fungal origin. the dnase may preferably be obtainable from streptomyces , sp, saccharothrix australiensis, kutzneria albida, pholiota squarrosa, marasmius oreades, cercospora fusimaculans, deconica coprophila, mortierella humilis, physisporinus sanguinolentus, stropharia semiglobata, cladosporium cladosporioides, irpex lacteus, phlebia subochracea, rhizoctonia solani, ascobolus stictoideus, urnula sp, ascobolus sp. zy179 , morchella costata, trichobolus zukalii, trichophaea saccata, trichophaea minuta, trichophaea abundans, pseudoplectania nigrella, gyromitra esculenta, morchella esculenta, morchella crassipes or disciotis venosa. the dnases may be selected among polypeptides having dnase activity and comprises: a) the motifs(seq id no: 58)c[dn]treand(seq id no: 59)[dn]saek,b) the motif(seq id no: 60)[kr]e[ag]worc) the motif(seq id no: 61)rt[ts][dn][ap][tdps]gy. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having dnase activity and comprising the motifs c[dn]tre (seq id no: 58) and [dn]saek (seq id no: 59), wherein the polypeptide is selected from the group consisting of polypeptides: a) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 24,b) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 25, andc) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 26. in another embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having dnase activity and comprising the motif [kr]e[ag]w (seq id no: 60), wherein the polypeptide is selected from the group consisting of polypeptides:d) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 27,e) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 28,f) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 29,g) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 30,h) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 31,i) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 32,j) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 33,k) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 34,l) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 35,m) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 36,n) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 37,o) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 38,p) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 39,q) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 40,r) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 41,s) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 42, andt) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 43. in another embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having dnase activity and comprising the motif rt[ts][dn][ap][tdps]gy (seq id no: 61), wherein the polypeptide is selected from the group consisting of polypeptides:u) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 44,v) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 45,w) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 46,x) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 47,y) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 48,z) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 49,aa) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 50,bb) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 51,cc) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 52,dd) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 53,ee) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 54,ff) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 55,gg) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 56, andhh) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 57. polypeptides having dnase activity preferably obtained from fungi show particularly good cleaning properties e.g. the dnases are particularly effective in removing or reducing components of organic matter, such as biofilm associated dna, from an item such as a textile or a hard surface. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 24 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from streptomyces . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 24. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 25 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from saccharothrix e.g. obtainable from saccharothrix australiensis . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 25. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 26 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from kutzneria e.g. obtainable from kutzneria albida . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 26. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 27 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from pholiota e.g. obtainable from pholiota squarrosa . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 27. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 28 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from marasmius e.g. obtainable from marasmius oreades . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 28. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 29 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from cercospora e.g. obtainable from cercospora fusimaculans . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 29. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 30 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from deconica e.g. obtainable from deconica coprophila . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 30. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 31 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from mortierella e.g. obtainable from mortierella humilis . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 31. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 32 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from physisporinus e.g. obtainable from physisporinus sanguinolentus . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 32. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 33 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from stropharia e.g. obtainable from stropharia semiglobata . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 33. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 34 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from cladosporium e.g. obtainable from cladosporium cladosporioides . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 34. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 35 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from irpex e.g. obtainable from irpex lacteus . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 35. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 36 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from phlebia e.g. obtainable from phlebia subochracea . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 36. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 37 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 37. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 38 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 38. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 39 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 39. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 40 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 40. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 41 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 41. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 42 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 42. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 43 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from rhizoctonia e.g. obtainable from rhizoctonia solani . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 43. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 44 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from ascobolus e.g. obtainable from ascobolus stictoideus . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 44. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 45 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from urnula sp. in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 45. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 46 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from ascobolus sp. in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 46. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 47 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from morchella e.g. obtainable from morchella costata . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 47. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 48 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from trichobolus e.g. obtainable from trichobolus zukalii . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 48. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 49 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from trichobolus e.g. obtainable from trichophaea saccat . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 49. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 50 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from trichobolus e.g. obtainable from trichophaea minuta . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 50. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 51 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from trichobolus e.g. obtainable from trichophaea minuta . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 51. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 52 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from trichobolus e.g. obtainable from trichophaea abundans . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 52. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 53 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from pseudoplectania e.g. obtainable from pseudoplectania nigrella . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 53. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 54 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from gyromitra e.g. obtainable from gyromitra esculenta . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 54. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 55 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from morchella e.g. obtainable from morchella esculenta . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 55. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 56 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from morchella e.g. obtainable from morchella crassipes . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 56. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 57 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from disciotis e.g. obtainable from disciotis venosa . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 57. in one embodiment, the dnases to be added in the cleaning composition of the invention is a polypeptide having a sequence identity to the polypeptide shown in seq id no: 64 of at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% and which have dnase activity. preferably, the polypeptide is obtainable from acrophialophora e.g. obtainable from acrophialophora fusispora . in one aspect, the polypeptides differ by up to 10 amino acids, e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, from the mature polypeptide shown in seq id no: 64. the preparation of the polypeptide having dnase activity as described under this section can refer to the description in the nucleic acid construct, expression vectors, host cells, methods of production and fermentation broth formulations sections in wo 2017/059802 (novozymes ns). the dnase can be included in the cleaning composition of the present invention at a level of from 0.01 to 1000 ppm, from 1 ppm to 1000 ppm, from 10 ppm to 1000 ppm, from 50 ppm to 1000 ppm, from 100 ppm to 1000 ppm, from 150 ppm to 1000 ppm, from 200 ppm to 1000 ppm, from 250 ppm to 1000 ppm, from 250 ppm to 750 ppm, from 250 ppm to 500 ppm. the dnases above may be combined with hexosaminidase to form a blend to be added to the wash liquor solution according to the invention. the concentration of the dnase in the wash liquor solution is typically in the range of wash liquor from 0.00001 ppm to 10 ppm, from 0.00002 ppm to 10 ppm, from 0.0001 ppm to 10 ppm, from 0.0002 ppm to 10 ppm, from 0.001 ppm to 10 ppm, from 0.002 ppm to 10 ppm, from 0.01 ppm to 10 ppm, from 0.02 ppm to 10 ppm, 0.1 ppm to 10 ppm, from 0.2 ppm to 10 ppm, from 0.5 ppm to 5 ppm. the dnases may be combined with any of the hexosaminidases below to form a blend to be added to a composition according to the invention. polypeptides having hexosaminidase activity (hexosaminidases) the term hexosaminidase includes “dispersin” and the abbreviation “dsp”, which means a polypeptide having hexosaminidase activity, ec 3.2.1.—that catalyzes the hydrolysis of β-1,6-glycosidic linkages of n-acetyl-glucosamine polymers found e.g. in biofilm. the term hexosaminidase includes polypeptides having n-acetylglucosaminidase activity and β-n-acetylglucosaminidase activity. the term “polypeptide having hexosaminidase activity” may be used interchangeably with the term hexosaminidases and similarly the term “polypeptide having β-n-acetylglucosaminidase activity” may be used interchangeably with the term β-n-acetylglucosaminidases. for purposes of the present invention, hexosaminidase activity is determined according to the procedure described in assay ii. in a preferred embodiment, the polypeptide having hexosaminidase activity is a dispersin. in a preferred embodiment, the polypeptide having hexosaminidase activity is a β-n-acetylglucosaminidase targeting poly-β-1,6-n-acetylglucosamine. in one embodiment, the invention relates to a composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, and a cleaning component. one embodiment of the invention relates to a composition comprising a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, polypeptide wherein the polypeptide is selected from the group consisting of polypeptides: a) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 1,b) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 2,c) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 3,d) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 4,e) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 5,f) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 6,g) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 7,h) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 8,i) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 9,j) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 10,k) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 11,l) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 12,m) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 13,n) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 14,o) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 15,p) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 16,q) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 17,r) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 18s) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 19t) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 20u) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 21v) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 22w) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 23,x) a polypeptide having at least 60%, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 81%, at least 82%, at least 83%, at least 84%, at least 85%, at least 86%, at least 87%, at least 88%, at least 89%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, or 100% sequence identity to the polypeptide shown in seq id no: 63, and. a polypeptide having hexosaminidase activity may be obtained from microorganisms of any genus. preferably the hexosaminidase or the β-n-acetylglucosaminidase targeting poly-β-1,6-n-acetylglucosamine e.g. a dispersin is obtained from terribacillus, curtobacterium, aggregatibacter, haemophilus, actinobacillus, lactobacillus or staphylococcus preferably terribacillus or lactobacillus. in another aspect, the polypeptide is a aggregatibacter polypeptide, e.g., a polypeptide obtained from aggregatibacter actinomycetemcomitans . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 1 and is obtained from aggregatibacter preferably aggregatibacter actinomycetemcomitans. in another aspect, the polypeptide is a haemophilus polypeptide, e.g., a polypeptide obtained from haemophilus sputorum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 2 and is obtained from haemophilus preferably haemophilus sputorum. in another aspect, the polypeptide is a actinobacillus polypeptide, e.g., a polypeptide obtained from actinobacillus suis . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 3 and is obtained from actinobacillus preferably actinobacillus suis. in another aspect, the polypeptide is a actinobacillus polypeptide, e.g., a polypeptide obtained from actinobacillus capsulatus dsm 19761. in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 4 and is obtained from actinobacillus preferably actinobacillus capsulatus dsm 19761. in another aspect, the polypeptide is a actinobacillus polypeptide, e.g., a polypeptide obtained from actinobacillus equuli subsp. equuli . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 5 and is obtained from actinobacillus preferably actinobacillus equuli subsp. equuli. in another aspect, the polypeptide is a aggregatibacter polypeptide, e.g., a polypeptide obtained from aggregatibacter actinomycetemcomitans . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 6 and is obtained from aggregatibacter preferably aggregatibacter actinomycetemcomitans. in another aspect, the polypeptide is a aggregatibacter polypeptide, e.g., a polypeptide obtained from aggregatibacter actinomycetemcomitans . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 7 and is obtained from aggregatibacter preferably aggregatibacter actinomycetemcomitans . in another aspect, the polypeptide is a actinobacillus polypeptide, e.g., a polypeptide obtained from actinobacillus pleuropneumoniae . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 8 and is obtained from actinobacillus preferably actinobacillus pleuropneumoniae. in another aspect, the polypeptide is a curtobacterium polypeptide, e.g., a polypeptide obtained from curtobacterium oceanosedimentum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 9 and is obtained from curtobacterium preferably curtobacterium oceanosedimentum. in another aspect, the polypeptide is a curtobacterium polypeptide, e.g., a polypeptide obtained from curtobacterium flaccumfaciens . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 10 and is obtained from curtobacterium preferably curtobacterium flaccumfaciens. in another aspect, the polypeptide is a curtobacterium polypeptide, e.g., a polypeptide obtained from curtobacterium luteum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 11 and is obtained from curtobacterium preferably curtobacterium luteum. in another aspect, the polypeptide is a curtobacterium polypeptide, e.g., a polypeptide obtained from curtobacterium oceanosedimentum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 12 and is obtained from curtobacterium preferably curtobacterium oceanosedimentum. in another aspect, the polypeptide is a curtobacterium polypeptide, e.g., a polypeptide obtained from curtobacterium leaf 154. in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 13 and is obtained from curtobacterium preferably curtobacterium leaf 154. in another aspect, the polypeptide having hexosaminidase activity is a terribacillus polypeptide, e.g., a polypeptide obtained from terribacillus saccharophilus . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 14 and is obtained from terribacillus preferably terribacillus saccharophilus. in another aspect, the polypeptide is a terribacillus polypeptide, e.g., a polypeptide obtained from terribacillus goriensis . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 15 and is obtained from terribacillus preferably terribacillus goriensis. in another aspect, the polypeptide is a terribacillus polypeptide, e.g., a polypeptide obtained from terribacillus saccharophilus . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 16 and is obtained from terribacillus preferably terribacillus saccharophilus. in another aspect, the polypeptide is a terribacillus polypeptide, e.g., a polypeptide obtained from terribacillus saccharophilus . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 17 and is obtained from terribacillus preferably terribacillus saccharophilus. in another aspect, the polypeptide is a terribacillus polypeptide, e.g., a polypeptide obtained from terribacillus saccharophilus . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 18 and is obtained from terribacillus preferably terribacillus saccharophilus. in another aspect, the polypeptide is a lactobacillus polypeptide, e.g., a polypeptide obtained from lactobacillus paraplantarum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 19 and is obtained from lactobacillus , preferably lactobacillus paraplantarum. in another aspect, the polypeptide is a lactobacillus polypeptide, e.g., a polypeptide obtained from lactobacillus apinorum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 20 and is obtained from lactobacillus , preferably lactobacillus apinorum. in another aspect, the polypeptide is a lactobacillus polypeptide, e.g., a polypeptide obtained from lactobacillus paraplantarum . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 21 and is obtained from lactobacillus , preferably lactobacillus paraplantarum. in another aspect, the polypeptide is a staphylococcus polypeptide, e.g., a polypeptide obtained from staphylococcus cohnii . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 22 and is obtained from staphylococcus , preferably staphylococcus cohnii. in another aspect, the polypeptide is a staphylococcus polypeptide, e.g., a polypeptide obtained from staphylococcus fleurettii . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 23 and is obtained from staphylococcus , preferably staphylococcus fleurettii. in another aspect, the polypeptide is a streptococcus polypeptide, e.g., a polypeptide obtained from streptococcus merionis . in a preferred aspect, the polypeptide is a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 91%, at least 92%, at least 93%, at least 94%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99% or 100% sequence identity to seq id no: 63 and is obtained from streptococcus , preferably streptococcus merionis. the polypeptides useful in the present invention belong to the glycoside hydrolase family 20 (gh20, www.cazy.org). this family includes dispersins such as dispersin b (dspb) which is 13-n-acetylglucosaminidases belonging to the glycoside hydrolase 20 family. the preparation of the polypeptide having hexosaminidase activity as described under this section can refer to the description in the nucleic acid construct, expression vectors, host cells, the hexosaminidase e.g. dispersin can be included in the cleaning composition of the present invention at a level of from 0.01 to 1000 ppm, from 1 ppm to 1000 ppm, from 10 ppm to 1000 ppm, from 50 ppm to 1000 ppm, from 100 ppm to 1000 ppm, from 150 ppm to 1000 ppm, from 200 ppm to 1000 ppm, from 250 ppm to 1000 ppm, from 250 ppm to 750 ppm, from 250 ppm to 500 ppm. the hexosaminidase e.g. dispersin can be included in the wash liquor solution of the present invention at a level of from 0.00001 ppm to 10 ppm, from 0.00002 ppm to 10 ppm, from 0.0001 ppm to 10 ppm, from 0.0002 ppm to 10 ppm, from 0.001 ppm to 10 ppm, from 0.002 ppm to 10 ppm, from 0.01 ppm to 10 ppm, from 0.02 ppm to 10 ppm, from 0.1 ppm to 10 ppm, from 0.2 ppm to 10 ppm, from 0.5 ppm to 5 ppm. synergy the inventors have surprisingly discovered that the disclosed dnases and the disclosed hexosaminodases exhibit a synergistic effect when used in the cleaning compositions of the invention. synergy is understood with the usual meaning within the field as the phenomena that the combined effect of two components exceed the sum of the effect of each of the two components. thus, according to the invention the wash performance of the cleaning compositions of the invention exceeds the wash performance of the sum of the wash performance of a cleaning composition comprising a dnase as disclosed but not a hexosaminidase as disclosed; and the wash performance of a cleaning composition comprising a dnase as disclosed but not a hexosaminidase as disclosed. the synergy can be expressed as the wash performance synergy (wp syn ), measured as the difference between the wash performance of the combination of the dnase and the hexosaminidase; and the sum of the wash performances of the individual wash performances. a preferred method for measuring the wash performance synergy is the method disclosed in example 1. according to the invention, the wash performance synergy as measured according to the method of example 1 is at least 1.0, at least 2.0, at least 3.0, at least 4.0, at least 5.0, at least 6.0, at least 7.0, at least 8.0, at least 9.0 or at least 10.0, cleaning composition the invention relates to cleaning compositions comprising at least one dnase and at least one hexosaminidase in combination with one or more additional cleaning components. the choice of additional components is within the competences of the skilled artisan and includes conventional ingredients, including the exemplary non-limiting components set forth below. an enzyme blend of the current invention comprises a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component. one embodiment relates to a cleaning composition comprising at least one dnase, at least one dispersin and at least one cleaning component(s). the dnase is preferably microbial, preferably obtained from bacteria or fungi. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is microbial preferably bacteria or fungi. in one embodiment, the dnase is obtained from fungi. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from streptomyces sp, saccharothrix australiensis, kutzneria albida, pholiota squarrosa, marasmius oreades, cercospora fusimaculans, deconica coprophila, mortierella humilis, physisporinus sanguinolentus, stropharia semiglobata, cladosporium cladosporioides, irpex lacteus, phlebia subochracea, rhizoctonia solani, ascobolus stictoideus, urnula sp, ascobolus sp. zy179 , morchella costata, trichobolus zukalii, trichophaea saccata, trichophaea minuta, trichophaea abundans, pseudoplectania nigrella, gyromitra esculenta, morchella esculenta, morchella crassipes or disciotis venosa , preferably, morchella , e.g. morchella costata, morchella esculenta, morchella crassipes or preferably from rhizoctonia , e.g. rhizoctonia solani . one embodiment relates to a cleaning composition comprising at least one dnase, at least one dispersin and at least one cleaning component(s), wherein the dnase preferably is obtained from a fungal source, preferably rhizoctonia solani or morchella costata. the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is preferably selected from the genus terribacillus preferably, terribacillus goriensis or terribacillus saccharophilus . alternatively, the hexosaminidase may be obtained from the genus lactobacillus preferably, lactobacillus apinorum or lactobacillus paraplantarum . alternatively, the hexosaminidase may be obtained from the genus staphylococcus preferably, staphylococcus cohnii or staphylococcus fleurettii . alternatively, the hexosaminidase may be obtained from the genus curtobacterium preferably, curtobacterium oceanosedimentum, curtobacterium flaccumfaciens, curtobacterium luteus or curtobacterium leaf 154. alternatively, the hexosaminidase may be obtained from the genus aggregatibacter preferably, aggregatibacter actinomycetemcomitans . alternatively, the hexosaminidase may be obtained from genus haemophilus preferably, haemophilus sputorum . alternatively, the hexosaminidase may be obtained from the genus actinobacillus preferably, actinobacillus suis, actinobacillus capsulatus dsm 19761, actinobacillus equuli subsp. equuli or actinobacillus pleuro pneumoniae. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from terribacillus such as terribacillus goriensis or terribacillus saccharophilus . one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from lactobacillus such as lactobacillus apinorum or lactobacillus paraplantarum. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from staphylococcus such as staphylococcus cohnii or staphylococcus fleurettii . one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from curtobacterium such as curtobacterium oceanosedimentum, curtobacterium flaccumfaciens, curtobacterium luteus or curtobacterium leaf 154. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from aggregatibacter such as aggregatibacter actinomycetemcomitans. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from haemophilus such as haemophilus sputorum. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from actinobacillus such as actinobacillus suis, actinobacillus capsulatus dsm 19761, actinobacillus equuli subsp. equuli or actinobacillus pleuropneumoniae. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from terribacillus such as terribacillus goriensis or terribacillus saccharophilus . one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from lactobacillus such as lactobacillus apinorum or lactobacillus paraplantarum. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from staphylococcus such as staphylococcus cohnii or staphylococcus fleurettii . one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from curtobacterium such as curtobacterium oceanosedimentum, curtobacterium flaccumfaciens, curtobacterium luteus or curtobacterium leaf 154. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from aggregatibacter such as aggregatibacter actinomycetemcomitans. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from haemophilus such as haemophilus sputorum. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from actinobacillus such as actinobacillus suis, actinobacillus capsulatus dsm 19761, actinobacillus equuli subsp. equuli or actinobacillus pleuropneumoniae. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from morchella , preferably morchella costata, morchella esculenta , or morchella crassipes and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of; a) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 1,b) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 2,c) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 3,d) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 4,e) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 5,f) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 6,g) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 7,h) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 8,i) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 9,j) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 10,k) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 11,l) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 12,m) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 13,n) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 14,o) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 15,p) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 16,q) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 17,r) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 18,s) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 19,t) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 20,u) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 21,v) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 22,w) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 23,x) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is obtained from rhizoctonia , e.g. rhizoctonia solani and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of; a) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 1,b) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 2,c) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 3,d) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 4,e) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 5,f) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 6,g) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 7,h) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 8,i) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 9,j) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 10,k) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 11,l) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 12,m) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 13,n) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 14,o) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 15,p) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 16,q) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 17,r) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 18,s) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 19,t) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 20,u) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 21,v) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 22,w) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 23,x) a polypeptide having at least 60%, at least 65%, at least 70%, at least 75% at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 24. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 25. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 26. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 27. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 28. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 29. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 30. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 31. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 32. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 33. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 34. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 35. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 36. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 37. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 38. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 39. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 40. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 41. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 42. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 43. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 44. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 45. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 46. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 47. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 48. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 49. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 50. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 51. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 52. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 53. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 54. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 55. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 56. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 57. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 64. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 1. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 2. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 3. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 4. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 5. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 6. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 7. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 8. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 9. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 10. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 11. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 12. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 13. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a 6-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 14. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 15. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 16. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 17. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 18. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 19. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 20. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 21. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 22. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 23. one embodiment of the invention relates to a cleaning composition comprising a dnase, preferably a fungal dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the hexosaminidase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 63. the dnase may preferably be fungal, one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is fungal, preferably obtained from rhizoctonia and even more preferably from rhizoctonia solani and wherein the dnase comprises a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id nos: 37, 38, 39, 40, 41, 42 or 43. the dnase may preferably be fungal. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase is fungal, preferably obtained from morchella and even more preferably from morchella costata, morchella esculenta or morchella crassipes and wherein the dnase comprises a polypeptide having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id nos: 47, 55 or 56. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 37 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 38 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 39 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 40 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 41 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 42 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 43 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 47 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 55 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 56 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 64 and wherein the hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is selected from the group consisting of hexosaminidase, comprising an amino acid sequence with;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the present invention relates to a cleaning composition comprising;a) at least 0.01 ppm of at least one polypeptide having dnase activity, wherein the dnase is selected for the group consisting of: a polypeptide having dnase activity selected from: a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 64;b) at least 0.01 ppm hexosaminidase selected from the group consisting of i. a polypeptide having n-acetylglucosaminidase activity, preferably 1,6 β-n-acetylglucosaminidase activity; andii. a polypeptide comprising a gh20 domain.c) one or more cleaning components, optionally a surfactant, builders and a bleach system. one embodiment of the present invention relates to a cleaning composition comprising;a) at least 0.01 ppm of at least one polypeptide having dnase activity, preferably a fungal dnase;b) at least 0.01 ppm hexosaminidase selected from the group consisting of i. a polypeptide having hexosaminidase activity selected from the group consisting of: a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 1, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 2, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 3, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 4, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 5, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 6, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 7, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 8, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 9, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 10, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 11, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 12, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 13, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 14, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 15, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 16, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 17, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 18, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 19, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 20, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 21, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 22, a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 23, and a polypeptide having at least 80% sequence identity to the polypeptide shown in seq id no: 63;ii. a polypeptide having n-acetylglucosaminidase activity, preferably β-n-acetylglucosaminidase activity; andiii. a polypeptide comprising a gh20 domain.c) one or more cleaning components, optionally a surfactant, builders and a bleach system. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57 and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, and at least one cleaning component. one preferred embodiment relates to a cleaning composition e.g. a laundry detergent composition, comprising at least one polypeptide having dnase activity, preferably selected from the group consisting of: a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 24, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 25, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 26, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 27, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 28, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 29, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 30, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 31, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 32, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 33, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 34, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 35, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 36, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 37, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 38, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 39, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 40, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 41, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 42, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 43, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 44, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 45, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 46, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 47, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 48, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 49, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 50, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 51, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 52, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 53, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 54, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 55, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 56, a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 57, and a polypeptide having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 64; and at least one hexosaminidase having at least 60%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and at least one cleaning component. the choice of cleaning components may include, for textile care, the consideration of the type of textile to be cleaned, the type and/or degree of soiling, the temperature at which cleaning is to take place, and the formulation of the detergent product. although components mentioned below are categorized by general header according to a particular functionality, this is not to be construed as a limitation, as a component may comprise additional functionalities as will be appreciated by the skilled artisan. surfactants the cleaning composition may comprise one or more surfactants, which may be anionic and/or cationic and/or non-ionic and/or semi-polar and/or zwitterionic, or a mixture thereof. in a particular embodiment, the detergent composition includes a mixture of one or more nonionic surfactants and one or more anionic surfactants. the surfactant(s) is typically present at a level of from about 0.1% to 60% by weight, such as about 1% to about 40%, or about 3% to about 20%, or about 3% to about 10%. the surfactant(s) is chosen based on the desired cleaning application, and may include any conventional surfactant(s) known in the art. when included therein the detergent will usually contain from about 0.1% to about 40% by weight of an anionic surfactant, such as from about 0.25% to about 30%, including from about 0.5% to about 15%, from about 1% to about 10%, from about 5% to about 15%, or from about 15% to about 20%, or from about 20% to about 25% of an anionic surfactant. non-limiting examples of anionic surfactants include sulfates and sulfonates, in particular, linear alkylbenzenesulfonates (las), isomers of las, branched alkylbenzenesulfonates (babs), phenylalkanesulfonates, alpha-olefinsulfonates (aos), olefin sulfonates, alkene sulfonates, alkane-2,3-diylbis(sulfates), hydroxyalkanesulfonates and disulfonates, alkyl sulfates (as) such as sodium dodecyl sulfate (sds), fatty alcohol sulfates (fas), primary alcohol sulfates (pas), alcohol ethersulfates (aes or aeos or fes, also known as alcohol ethoxysulfates or fatty alcohol ether sulfates), secondary alkanesulfonates (sas), paraffin sulfonates (ps), ester sulfonates, sulfonated fatty acid glycerol esters, alpha-sulfo fatty acid methyl esters (alpha-sfme or ses) including methyl ester sulfonate (mes), alkyl- or alkenylsuccinic acid, dodecenyl/tetradecenyl succinic acid (dtsa), fatty acid derivatives of amino acids, diesters and monoesters of sulfo-succinic acid or salt of fatty acids (soap), and combinations thereof. when included therein the detergent will usually contain from about 0.1% to about 40% by weigh of a cationic surfactant, for example from about 0.5% to about 30%, in particular from about 1% to about 20%, from about 3% to about 10%, such as from about 3% to about 5%, from about 8% to about 12% or from about 10% to about 12%. non-limiting examples of cationic surfactants include alkyldimethylethanolamine quat (admeaq), cetyltrimethylammonium bromide (ctab), dimethyldistearylammonium chloride (dsdmac), and alkylbenzyldimethylammonium, alkyl quaternary ammonium compounds, alkoxylated quaternary ammonium (aqa) compounds, ester quats, and combinations thereof. when included therein the detergent will usually contain from about 0.2% to about 40% by weight of a nonionic surfactant, for example from about 0.5% to about 30%, in particular from about 1% to about 20%, from about 3% to about 10%, such as from about 3% to about 5%, from about 8% to about 12%, or from about 10% to about 12%. non-limiting examples of nonionic surfactants include alcohol ethoxylates (ae or aeo), alcohol propoxylates, propoxylated fatty alcohols (pfa), alkoxylated fatty acid alkyl esters, such as ethoxylated and/or propoxylated fatty acid alkyl esters, alkylphenol ethoxylates (ape), nonylphenol ethoxylates (npe), alkylpolyglycosides (apg), alkoxylated amines, fatty acid monoethanolamides (fam), fatty acid diethanolamides (fada), ethoxylated fatty acid monoethanolamides (efam), propoxylated fatty acid monoethanolamides (pfam), polyhydroxyalkyl fatty acid amides, or n-acyl n-alkyl derivatives of glucosamine (glucamides, ga, or fatty acid glucamides, faga), as well as products available under the trade names span and tween, and combinations thereof. when included therein the detergent will usually contain from about 0.01 to about 10% by weight of a semipolar surfactant. non-limiting examples of semipolar surfactants include amine oxides (ao) such as alkyldimethylamineoxide, n-(coco alkyl)-n,n-dimethylamine oxide and n-(tallow-alkyl)-n,n-bis(2-hydroxyethyl)amine oxide, and combinations thereof. when included therein the detergent will usually contain from about 0.01% to about 10% by weight of a zwitterionic surfactant. non-limiting examples of zwitterionic surfactants include betaines such as alkyldimethylbetaines, sulfobetaines, and combinations thereof. builders and co-builders the detergent composition may contain about 0-65% by weight, such as from about 0.1% to about 65%, about 0.5% to about 60%, from about 1% to about 60%, from about 5% to about 60%, of a detergent builder or co-builder, or a mixture thereof. in a dish wash detergent, the level of builder is typically 40-65%, particularly 50-65%. the builder and/or co-builder may particularly be a chelating agent that forms water-soluble complexes with ca and mg. any builder and/or co-builder known in the art for use in cleaning detergents may be utilized. non-limiting examples of builders include zeolites, diphosphates (pyrophosphates), triphosphates such as sodium triphosphate (stp or stpp), carbonates such as sodium carbonate, soluble silicates such as sodium metasilicate, layered silicates (e.g., sks-6 from hoechst), ethanolamines such as 2-aminoethan-1-ol (mea), diethanolamine (dea, also known as 2,2′-iminodiethan-1-01), triethanolamine (tea, also known as 2,2′,2″-nitrilotriethan-1-ol), and (carboxymethyl)inulin (cmi), and combinations thereof. the detergent composition may also contain 0-50% by weight, such as about 5% to about 30%, of a detergent co-builder. the detergent composition may include a co-builder alone, or in combination with a builder, for example a zeolite builder. non-limiting examples of co-builders include homopolymers of polyacrylates or copolymers thereof, such as poly(acrylic acid) (paa) or copoly(acrylic acid/maleic acid) (paa/pma). further non-limiting examples include citrate, chelators such as aminocarboxylates, aminopolycarboxylates and phosphonates, and alkyl- or alkenylsuccinic acid. additional specific examples include 2,2′,2″-nitrilotriacetic acid (nta), ethylenediaminetetraacetic acid (edta), diethylenetriaminepentaacetic acid (dtpa), iminodisuccinic acid (ids), ethylenediamine-n,n′-disuccinic acid (edds), methylglycinediacetic acid (mgda), glutamic acid-n,n-diacetic acid (glda), 1-hydroxyethane-1,1-diphosphonic acid (hedp), ethylenediaminetetra(methylenephosphonic acid) (edtmpa), diethylenetriaminepentakis(methylenephosphonic acid) (dtmpa or dtpmpa), n-(2-hydroxyethyl)iminodiacetic acid (edg), aspartic acid-n-monoacetic acid (asma), aspartic acid-n,n-diacetic acid (asda), aspartic acid-n-monopropionic acid (asmp), iminodisuccinic acid (ida), n-(2-sulfomethyl)-aspartic acid (smas), n-(2-sulfoethyl)-aspartic acid (seas), n-(2-sulfomethyl)-glutamic acid (smgl), n-(2-sulfoethyl)-glutamic acid (segl), n-methyliminodiacetic acid (mi da), α-alanine-n,n-diacetic acid (α-alda), serine-n,n-diacetic acid (seda), isoserine-n,n-diacetic acid (isda), phenylalanine-n,n-diacetic acid (phda), anthranilic acid-n,n-diacetic acid (anda), sulfanilic acid-n,n-diacetic acid (slda), taurine-n,n-diacetic acid (tuda) and sulfomethyl-n,n-diacetic acid (smda), n-(2-hydroxyethyl)ethylenediamine-n,n′,n″-triacetic acid (hedta), diethanolglycine (deg), diethylenetriamine penta(methylenephosphonic acid) (dtpmp), aminotris(methylenephosphonic acid) (atmp), and combinations and salts thereof. further exemplary builders and/or co-builders are described in, e.g., wo 09/102854, u.s. pat. no. 5,977,053. bleaching systems the cleaning composition may contain 0-30% by weight, such as from about 0.1% to about 25%, from about 0.5% to about 25%, from about 1% to about 20%, of a bleaching system. any bleaching system comprising components known in the art for use in cleaning detergents may be utilized. suitable bleaching system components include sources of hydrogen peroxide; sources of peracids; and bleach catalysts or boosters. sources of hydrogen peroxide: suitable sources of hydrogen peroxide are inorganic persalts, including alkali metal salts such as sodium percarbonate and sodium perborates (usually mono- or tetrahydrate), and hydrogen peroxideurea (1/1). sources of peracids: peracids may be (a) incorporated directly as preformed peracids or (b) formed in situ in the wash liquor from hydrogen peroxide and a bleach activator (perhydrolysis) or (c) formed in situ in the wash liquor from hydrogen peroxide and a perhydrolase and a suitable substrate for the latter, e.g., an ester. a) suitable preformed peracids include, but are not limited to, peroxycarboxylic acids such as peroxybenzoic acid and its ring-substituted derivatives, peroxy-α-naphthoic acid, peroxyphthalic acid, peroxylauric acid, peroxystearic acid, ε-phthalimidoperoxycaproic acid [phthalimidoperoxyhexanoic acid (pap)], and o-carboxybenzamidoperoxycaproic acid; aliphatic and aromatic diperoxydicarboxylic acids such as diperoxydodecanedioic acid, diperoxyazelaic acid, diperoxysebacic acid, diperoxybrassylic acid, 2-decyldiperoxybutanedioic acid, and diperoxyphthalic, -isophthalic and -terephthalic acids; perimidic acids; peroxymonosulfuric acid; peroxydisulfuric acid; peroxyphosphoric acid; peroxysilicic acid; and mixtures of said compounds. it is understood that the peracids mentioned may in some cases be best added as suitable salts, such as alkali metal salts (e.g., oxone®) or alkaline earth-metal salts. b) suitable bleach activators include those belonging to the class of esters, amides, imides, nitriles or anhydrides and, where applicable, salts thereof. suitable examples are tetraacetylethylenediamine (taed), sodium 4-[(3,5,5-trimethylhexanoyl)oxy]benzene-1-sulfonate (isonobs), sodium 4-(dodecanoyloxy)benzene-1-sulfonate (lobs), sodium 4-(decanoyloxy)benzene-1-sulfonate, 4-(decanoyloxy)benzoic acid (doba), sodium 4-(nonanoyloxy)benzene-1-sulfonate (nobs), and/or those disclosed in wo98/17767. a particular family of bleach activators of interest was disclosed in ep624154 and particularly preferred in that family is acetyl triethyl citrate (atc). atc or a short chain triglyceride like triacetin has the advantage that they are environmentally friendly. furthermore, acetyl triethyl citrate and triacetin have good hydrolytical stability in the product upon storage and are efficient bleach activators. finally, atc is multifunctional, as the citrate released in the perhydrolysis reaction may function as a builder. bleach catalysts and boosters the bleaching system may also include a bleach catalyst or booster. some non-limiting examples of bleach catalysts that may be used in the compositions of the present invention include manganese oxalate, manganese acetate, manganese-collagen, cobalt-amine catalysts and manganese triazacyclononane (mntacn) catalysts; particularly preferred are complexes of manganese with 1,4,7-trimethyl-1,4,7-triazacyclononane (me3-tacn) or 1,2,4,7-tetramethyl-1,4,7-triazacyclononane (me4-tacn), in particular me3-tacn, such as the dinuclear manganese complex [(me3-tacn)mn(o)3mn(me3-tacn)](pf6)2, and [2,2′,2″-nitrilotris(ethane-1,2-diylazanylylidene-κn-methanylylidene)triphenolato-κ3o]manganese(iii). the bleach catalysts may also be other metal compounds; such as iron or cobalt complexes. in some embodiments, where a source of a peracid is included, an organic bleach catalyst or bleach booster may be used having one of the following formulae: (iii) and mixtures thereof; wherein each r1 is independently a branched alkyl group containing from 9 to 24 carbons or linear alkyl group containing from 11 to 24 carbons, preferably each r1 is independently a branched alkyl group containing from 9 to 18 carbons or linear alkyl group containing from 11 to 18 carbons, more preferably each r1 is independently selected from the group consisting of 2-propylheptyl, 2-butyloctyl, 2-pentylnonyl, 2-hexyldecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, isononyl, isodecyl, isotridecyl and isopentadecyl. other exemplary bleaching systems are described, e.g. in wo2007/087258, wo2007/087244, wo2007/087259, ep1867708 (vitamin k) and wo2007/087242. suitable photobleaches may for example be sulfonated zinc or aluminium phthalocyanines. metal care agents metal care agents may prevent or reduce the tarnishing, corrosion or oxidation of metals, including aluminium, stainless steel and non-ferrous metals, such as silver and copper. suitable examples include one or more of the following: (a) benzatriazoles, including benzotriazole or bis-benzotriazole and substituted derivatives thereof. benzotriazole derivatives are those compounds in which the available substitution sites on the aromatic ring are partially or completely substituted. suitable substituents include linear or branch-chain ci-c20-alkyl groups (e.g., c1-c20-alkyl groups) and hydroxyl, thio, phenyl or halogen such as fluorine, chlorine, bromine and iodine. (b) metal salts and complexes chosen from the group consisting of zinc, manganese, titanium, zirconium, hafnium, vanadium, cobalt, gallium and cerium salts and/or complexes, the metals being in one of the oxidation states ii, iii, iv, v or vi. in one aspect, suitable metal salts and/or metal complexes may be chosen from the group consisting of mn(ii) sulphate, mn(ii) citrate, mn(ii) stearate, mn(ii) acetylacetonate, k{circumflex over ( )}tif6 (e.g., k2tif6), k{circumflex over ( )}zrf6 (e.g., k2zrf6), coso4, co(nos)2 and ce(nos)3, zinc salts, for example zinc sulphate, hydrozincite or zinc acetate; (c) silicates, including sodium or potassium silicate, sodium disilicate, sodium metasilicate, crystalline phyllosilicate and mixtures thereof. further suitable organic and inorganic redox-active substances that act as silver/copper corrosion inhibitors are disclosed in wo 94/26860 and wo 94/26859. preferably the composition of the invention comprises from 0.1 to 5% by weight of the composition of a metal care agent, preferably the metal care agent is a zinc salt. hydrotropes the cleaning composition may contain 0-10% by weight, for example 0-5% by weight, such as about 0.5 to about 5%, or about 3% to about 5%, of a hydrotrope. any hydrotrope known in the art for use in detergents may be utilized. non-limiting examples of hydrotropes include sodium benzenesulfonate, sodium p-toluene sulfonate (sts), sodium xylene sulfonate (sxs), sodium cumene sulfonate (scs), sodium cymene sulfonate, amine oxides, alcohols and polyglycolethers, sodium hydroxynaphthoate, sodium hydroxynaphthalene sulfonate, sodium ethylhexyl sulfate, and combinations thereof. polymers the cleaning composition may contain 0-10% by weight, such as 0.5-5%, 2-5%, 0.5-2% or 0.2-1% of a polymer. any polymer known in the art for use in detergents may be utilized. the polymer may function as a co-builder as mentioned above, or may provide antiredeposition, fiber protection, soil release, dye transfer inhibition, grease cleaning and/or anti-foaming properties. some polymers may have more than one of the above-mentioned properties and/or more than one of the below-mentioned motifs. exemplary polymers include (carboxymethyl)cellulose (cmc), poly(vinyl alcohol) (pva), poly(vinylpyrrolidone) (pvp), poly(ethyleneglycol) or poly(ethylene oxide) (peg), ethoxylated poly(ethyleneimine), carboxymethyl inulin (cmi), and polycarboxylates such as paa, paa/pma, poly-aspartic acid, and lauryl methacrylate/acrylic acid copolymers, hydrophobically modified cmc (hm-cmc) and silicones, copolymers of terephthalic acid and oligomeric glycols, copolymers of poly(ethylene terephthalate) and poly(oxyethene terephthalate) (pet-poet), pvp, poly(vinylimidazole) (pvi), poly(vinylpyridine-n-oxide) (pvpo or pvpno) and polyvinylpyrrolidone-vinylimidazole (pvpvi). suitable examples include pvp-k15, pvp-k30, chromebond s-400, chromebond s-403e and chromabond s-100 from ashland aqualon, and sokalan® hp 165, sokalan® hp 50 (dispersing agent), sokalan® hp 53 (dispersing agent), sokalan® hp 59 (dispersing agent), sokalan® hp 56 (dye transfer inhibitor), sokalan® hp 66 k (dye transfer inhibitor) from basf. further exemplary polymers include sulfonated polycarboxylates, polyethylene oxide and polypropylene oxide (peo-ppo) and diquaternium ethoxy sulfate. other exemplary polymers are disclosed in, e.g., wo 2006/130575. salts of the above-mentioned polymers are also contemplated. particularly preferred polymer is ethoxylated homopolymer sokalan® hp 20 from basf, which helps to prevent redeposition of soil in the wash liquor. fabric hueing agents the cleaning composition of the present invention may also include fabric hueing agents such as dyes or pigments, which when formulated in detergent compositions can deposit onto a fabric when said fabric is contacted with a wash liquor comprising said detergent compositions and thus altering the tint of said fabric through absorption/reflection of visible light. fluorescent whitening agents emit at least some visible light. in contrast, fabric hueing agents alter the tint of a surface as they absorb at least a portion of the visible light spectrum. suitable fabric hueing agents include dyes and dye-clay conjugates, and may also include pigments. suitable dyes include small molecule dyes and polymeric dyes. suitable small molecule dyes include small molecule dyes selected from the group consisting of dyes falling into the colour index (c.i.) classifications of direct blue, direct red, direct violet, acid blue, acid red, acid violet, basic blue, basic violet and basic red, or mixtures thereof, for example as described in wo2005/03274, wo2005/03275, wo2005/03276 and ep1876226 (hereby incorporated by reference). the detergent composition preferably comprises from about 0.00003 wt % to about 0.2 wt %, from about 0.00008 wt % to about 0.05 wt %, or even from about 0.0001 wt % to about 0.04 wt % fabric hueing agent. the composition may comprise from 0.0001 wt % to 0.2 wt % fabric hueing agent, this may be especially preferred when the composition is in the form of a unit dose pouch. suitable hueing agents are also disclosed in, e.g. wo 2007/087257 and wo2007/087243. enzymes the cleaning composition may comprise one or more additional enzymes such as one or more lipase, cutinase, an amylase, carbohydrase, cellulase, pectinase, mannanase, arabinase, galactanase, xylanase, oxidase, e.g., a laccase, and/or peroxidase. in general, the properties of the selected enzyme(s) should be compatible with the selected detergent, (i.e., ph-optimum, compatibility with other enzymatic and non-enzymatic ingredients, etc.), and the enzyme(s) should be present in effective amounts. proteases suitable proteases for the compositions of the invention include those of bacterial, fungal, plant, viral or animal origin e.g. vegetable or microbial origin. microbial origin is preferred. chemically modified or protein engineered mutants are included. it may be an alkaline protease, such as a serine protease or a metalloprotease. a serine protease may for example be of the 51 family, such as trypsin, or the s8 family such as subtilisin. a metalloproteases protease may for example be a thermolysin from e.g. family m4 or other metalloprotease such as those from m5, m7 or m8 families. examples of subtilases are those derived from bacillus such as bacillus lentus, bacillus alkalophilus, bacillus subtilis, bacillus amyloliquefaciens, bacillus pumilus and bacillus gibsonii described in; u.s. pat. no. 7,262,042 and wo09/021867 . subtilisin lentus, subtilisin novo, subtilisin carlsberg, bacillus licheniformis, subtilisin bpn′, subtilisin 309 , subtilisin 147 and subtilisin 168 and e.g. protease pd138 described in (wo93/18140). other useful proteases may be those described in wo01/016285 and wo02/016547. examples of trypsin-like proteases are trypsin (e.g. of porcine or bovine origin) and the fusarium protease described in wo94/25583 and wo05/040372, and the chymotrypsin proteases derived from cellumonas described in wo05/052161 and wo05/052146. a further preferred protease is the alkaline protease from bacillus lentus dsm 5483, as described for example in wo95/23221, and variants thereof which are described in wo92/21760, wo95/23221, ep1921147 and ep1921148. examples of metalloproteases are the neutral metalloprotease as described in wo07/044993 (proctor & gamble/genencor int.) such as those derived from bacillus amyloliquefaciens. examples of useful proteases are the variants described in: wo89/06279, wo92/19729, wo96/034946, wo98/20115, wo98/20116, wo99/011768, wo01/44452, wo03/006602, wo04/03186, wo04/041979, wo07/006305, wo11/036263, wo11/036264, especially the variants with substitutions in one or more of the following positions: 3, 4, 9, 15, 24, 27, 42, 55, 59, 60, 66, 74, 85, 96, 97, 98, 99, 100, 101, 102, 104, 116, 118, 121, 126, 127, 128, 154, 156, 157, 158, 161, 164, 176, 179, 182, 185, 188, 189, 193, 198, 199, 200, 203, 206, 211, 212, 216, 218, 226, 229, 230, 239, 246, 255, 256, 268 and 269 wherein the positions correspond to the positions of the bacillus lentus protease shown in seq id no 79. more preferred the protease variants may comprise one or more of the mutations selected from the group consisting of: s3t, v41, s9r, s9e, a15t, s24g, s24r, k27r, n42r, s55p, g59e, g59d, n60d, n60e, v66a, n74d, s85r, a96s, s97g, s97d, s97a, s97sd, s99e, s99d, s99g, s99m, s99n, s99r, s99h, s101a, v1021, v102y, v102n, s104a, g116v, g116r, h118d, h118n, a120s, s126l, p127q, s128a, s154d, a156e, g157d, g157p, s158e, y161a, r164s, q176e, n179e, s182e, q185n, a188p, g189e, v193m, n198d, v1991, y203w, 5206g, l211q, l211d, n212d, n2125, m2165, a226v, k229l, q230h, q239r, n246k, n255w, n255d, n255e, l256e, l256d t268a and r269h. the protease variants are preferably variants of the bacillus lentus protease (savinase®) shown in seq id no 79, the bacillus amylolichenifaciens protease (bpn′) shown in seq id no 80. the protease variants preferably have at least 80% sequence identity to seq id no 79 or seq id no 80 of wo 2016/001449. a protease variant comprising a substitution at one or more positions corresponding to positions 171, 173, 175, 179, or 180 of seq id no: 62, wherein said protease variant has a sequence identity of at least 75% but less than 100% to seq id no: 62. suitable commercially available protease enzymes include those sold under the trade names alcalase®, duralase™, durazym™, relase®, relase® ultra, savinase®, savinase® ultra, primase®, polarzyme®, kannase®, liquanase®, liquanase® ultra, ovozyme®, coronase®, coronase® ultra, blaze®, blaze evity® 100t, blaze evity® 125t, blaze evity® 150t, neutrase®, everlase® and esperase® (novozymes a/s), those sold under the tradename maxatase®, maxacal®, maxapem®, purafect ox®, purafect oxp®, puramax®, fn2®, fn3®, fn4®, excellase®, excellenz p1000™, excellenz p1250™, eraser®, preferenz p100™′ purafect prime®, preferenz p110™, effectenz p1000™, purafect®, effectenz p1050™′ purafect ox®, effectenz p2000™, purafast®, properase®, opticlean® and optimase® (danisco/dupont), axapem™ (gist-brocases n.v.), blap (sequence shown in fig. 29 of u.s. pat. no. 5,352,604) and variants hereof (henkel ag) and kap ( bacillus alkalophilus subtilisin ) from kao. cellulases suitable cellulases include those of bacterial or fungal origin. chemically modified or protein engineered mutants are included. suitable cellulases include cellulases from the genera bacillus, pseudomonas, humicola, fusarium, thielavia, acremonium , e.g., the fungal cellulases produced from humicola insolens, myceliophthora thermophila and fusarium oxysporum disclosed in u.s. pat. nos. 4,435,307, 5,648,263, 5,691,178, 5,776,757 and wo 89/09259. especially suitable cellulases are the alkaline or neutral cellulases having colour care benefits. examples of such cellulases are cellulases described in ep 0 495 257, ep 0 531 372, wo 96/11262, wo 96/29397, wo 98/08940. other examples are cellulase variants such as those described in wo 94/07998, ep 0 531 315, u.s. pat. nos. 5,457,046, 5,686,593, 5,763,254, wo 95/24471, wo 98/12307 and wo99/001544. other cellulases are endo-beta-1,4-glucanase enzyme having a sequence of at least 97% identity to the amino acid sequence of position 1 to position 773 of seq id no:2 of wo 2002/099091 or a family 44 xyloglucanase, which a xyloglucanase enzyme having a sequence of at least 60% identity to positions 40-559 of seq id no: 2 of wo 2001/062903. commercially available cellulases include celluzyme™, and carezyme™ (novozymes a/s) carezyme premium™ (novozymes a/s), celluclean™ (novozymes a/s), celluclean classic™ (novozymes a/s), cellusoft™ (novozymes a/s), whitezyme™ (novozymes a/s), clazinase™, and puradax ha™ (genencor international inc.), and kac-500(b)™ (kao corporation). mannanases suitable mannanases include those of bacterial or fungal origin. chemically or genetically modified mutants are included. the mannanase may be an alkaline mannanase of family 5 or 26. it may be a wild-type from bacillus or humicola , particularly b. agaradhaerens, b. licheniformis, b. halodurans, b. clausii , or h. insolens . suitable mannanases are described in wo 1999/064619. a commercially available mannanase is mannaway (novozymes a/s). peroxidases/oxidases suitable peroxidases/oxidases include those of plant, bacterial or fungal origin. chemically modified or protein engineered mutants are included. examples of useful peroxidases include peroxidases from coprinus , e.g., from c. cinereus , and variants thereof as those described in wo 93/24618, wo 95/10602, and wo 98/15257. commercially available peroxidases include guardzyme™ (novozymes a/s). lipases and cutinases: suitable lipases and cutinases include those of bacterial or fungal origin. chemically modified or protein engineered mutant enzymes are included. examples include lipase from thermomyces , e.g. from t. lanuginosus (previously named humicola lanuginosa ) as described in ep258068 and ep305216, cutinase from humicola , e.g. h. insolens (wo96/13580), lipase from strains of pseudomonas (some of these now renamed to burkholderia ), e.g. p. alcaligenes or p. pseudoalcaligenes (ep218272), p. cepacia (ep331376), p . sp. strain sd705 (wo95/06720 & wo96/27002), p. wisconsinensis (wo96/12012), gdsl-type streptomyces lipases (wo10/065455), cutinase from magnaporthe grisea (wo10/107560), cutinase from pseudomonas mendocina (u.s. pat. no. 5,389,536), lipase from thermobifida fusca (wo11/084412), geobacillus stearothermophilus lipase (wo11/084417), lipase from bacillus subtilis (wo11/084599), and lipase from streptomyces griseus (wo11/150157) and s. pristinaespiralis (wo12/137147). other examples are lipase variants such as those described in ep407225, wo92/05249, wo94/01541, wo94/25578, wo95/14783, wo95/30744, wo95/35381, wo95/22615, wo96/00292, wo97/04079, wo97/07202, wo00/34450, wo00/60063, wo01/92502, wo07/87508 and wo09/109500. preferred commercial lipase products include lipolase™, lipex™; lipolex™ and lipoclean™ (novozymes a/s), lumafast (originally from genencor) and lipomax (originally from gist-brocades). still other examples are lipases sometimes referred to as acyltransferases or perhydrolases, e.g. acyltransferases with homology to candida antarctica lipase a (wo10/111143), acyltransferase from mycobacterium smegmatis (wo05/56782), perhydrolases from the ce 7 family (wo09/67279), and variants of the m. smegmatis perhydrolase in particular the 554v variant used in the commercial product gentle power bleach from huntsman textile effects pte ltd (wo10/100028). amylases: suitable amylases include alpha-amylases and/or a glucoamylases and may be of bacterial or fungal origin. chemically modified or protein engineered mutants are included. amylases include, for example, alpha-amylases obtained from bacillus , e.g., a special strain of bacillus licheniformis , described in more detail in gb 1,296,839. suitable amylases include amylases having seq id no: 2 in wo 95/10603 or variants having 90% sequence identity to seq id no: 3 thereof. preferred variants are described in wo 94/02597, wo 94/18314, wo 97/43424 and seq id no: 4 of wo 99/019467, such as variants with substitutions in one or more of the following positions: 15, 23, 105, 106, 124, 128, 133, 154, 156, 178, 179, 181, 188, 190, 197, 201, 202, 207, 208, 209, 211, 243, 264, 304, 305, 391, 408, and 444. different suitable amylases include amylases having seq id no: 6 in wo 02/010355 or variants thereof having 90% sequence identity to seq id no: 6. preferred variants of seq id no: 6 are those having a deletion in positions 181 and 182 and a substitution in position 193. other amylases which are suitable are hybrid alpha-amylase comprising residues 1-33 of the alpha-amylase derived from b. amyloliquefaciens shown in seq id no: 6 of wo 2006/066594 and residues 36-483 of the b. licheniformis alpha-amylase shown in seq id no: 4 of wo 2006/066594 or variants having 90% sequence identity thereof. preferred variants of this hybrid alpha-amylase are those having a substitution, a deletion or an insertion in one of more of the following positions: g48, t49, g107, h156, a181, n190, m197, 1201, a209 and q264. most preferred variants of the hybrid alpha-amylase comprising residues 1-33 of the alpha-amylase derived from b. amyloliquefaciens shown in seq id no: 6 of wo 2006/066594 and residues 36-483 of seq id no: 4 of wo 2006/066594 are those having the substitutions: m197t;h156y+a181t+n190f+a209v+q264s; org48a+t491+g107a+h156y+a181t+n190f+1201f+a209v+q264s. further amylases which are suitable are amylases having seq id no: 6 in wo 99/019467 or variants thereof having 90% sequence identity to seq id no: 6. preferred variants of seq id no: 6 are those having a substitution, a deletion or an insertion in one or more of the following positions: r181, g182, h183, g184, n195, 1206, e212, e216 and k269. particularly preferred amylases are those having deletion in positions r181 and g182, or positions h183 and g184. additional amylases which can be used are those having seq id no: 1, seq id no: 3, seq id no: 2 or seq id no: 7 of wo 96/023873 or variants thereof having 90% sequence identity to seq id no: 1, seq id no: 2, seq id no: 3 or seq id no: 7. preferred variants of seq id no: 1, seq id no: 2, seq id no: 3 or seq id no: 7 are those having a substitution, a deletion or an insertion in one or more of the following positions: 140, 181, 182, 183, 184, 195, 206, 212, 243, 260, 269, 304 and 476, using seq id 2 of wo 96/023873 for numbering. more preferred variants are those having a deletion in two positions selected from 181, 182, 183 and 184, such as 181 and 182, 182 and 183, or positions 183 and 184. most preferred amylase variants of seq id no: 1, seq id no: 2 or seq id no: 7 are those having a deletion in positions 183 and 184 and a substitution in one or more of positions 140, 195, 206, 243, 260, 304 and 476. other amylases which can be used are amylases having seq id no: 2 of wo 08/153815, seq id no: 10 in wo 01/66712 or variants thereof having 90% sequence identity to seq id no: 2 of wo 08/153815 or 90% sequence identity to seq id no: 10 in wo 01/66712. preferred variants of seq id no: 10 in wo 01/66712 are those having a substitution, a deletion or an insertion in one of more of the following positions: 176, 177, 178, 179, 190, 201, 207, 211 and 264. further suitable amylases are amylases having seq id no: 2 of wo 09/061380 or variants having 90% sequence identity to seq id no: 2 thereof. preferred variants of seq id no: 2 are those having a truncation of the c-terminus and/or a substitution, a deletion or an insertion in one of more of the following positions: q87, q98, s125, n128, t131, t165, k178, r180, s181, t182, g183, m201, f202, n225, s243, n272, n282, y305, r309, d319, q320, q359, k444 and g475. more preferred variants of seq id no: 2 are those having the substitution in one of more of the following positions: q87e,r, q98r, s125a, n128c, t1311, t1651, k178l, t182g, m201l, f202y, n225e,r, n272e,r, s243q,a,e,d, y305r, r309a, q320r, q359e, k444e and g475k and/or deletion in position r180 and/or s181 or of t182 and/or g183. most preferred amylase variants of seq id no: 2 are those having the substitutions: n128c+k178l+t182g+y305r+g475k;n128c+k178l+t182g+f202y+y305r+d319t+g475k;s125a+n128c+k178l+t182g+y305r+g475k; ors125a+n128c+t1311+t1651+k178l+t182g+y305r+g475k wherein the variants are c-terminally truncated and optionally further comprises a substitution at position 243 and/or a deletion at position 180 and/or position 181. further suitable amylases are amylases having seq id no: 1 of wo13184577 or variants having 90% sequence identity to seq id no: 1 thereof. preferred variants of seq id no: 1 are those having a substitution, a deletion or an insertion in one of more of the following positions: k176, r178, g179, t180, g181, e187, n192, m199, 1203, s241, r458, t459, d460, g476 and g477. more preferred variants of seq id no: 1 are those having the substitution in one of more of the following positions: k176l, e187p, n192fyh, m199l, 1203yf, s241qadn, r458n, t459s, d460t, g476k and g477k and/or deletion in position r178 and/or s179 or of t180 and/or g181. most preferred amylase variants of seq id no: 1 are those having the substitutions: e187p+1203y+g476ke187p+1203y+r458n+t459s+d460t+g476k wherein the variants optionally further comprise a substitution at position 241 and/or a deletion at position 178 and/or position 179. further suitable amylases are amylases having seq id no: 1 of wo10104675 or variants having 90% sequence identity to seq id no: 1 thereof. preferred variants of seq id no: 1 are those having a substitution, a deletion or an insertion in one of more of the following positions: n21, d97, v128i k177, r179, s180, i181, g182, m200, l204, e242, g477 and g478. more preferred variants of seq id no: 1 are those having the substitution in one of more of the following positions: n21d, d97n, v128i k177l, m200l, l204yf, e242qa, g477k and g478k and/or deletion in position r179 and/or s180 or of i181 and/or g182. most preferred amylase variants of seq id no: 1 are those having the substitutions: n21d+d97n+v128i wherein the variants optionally further comprise a substitution at position 200 and/or a deletion at position 180 and/or position 181. other suitable amylases are the alpha-amylase having seq id no: 12 in wo01/66712 or a variant having at least 90% sequence identity to seq id no: 12. preferred amylase variants are those having a substitution, a deletion or an insertion in one of more of the following positions of seq id no: 12 in wo01/66712: r28, r118, n174; r181, g182, d183, g184, g186, w189, n195, m202, y298, n299, k302, s303, n306, r310, n314; r320, h324, e345, y396, r400, w439, r444, n445, k446, q449, r458, n471, n484. particular preferred amylases include variants having a deletion of d183 and g184 and having the substitutions r118k, n195f, r320k and r458k, and a variant additionally having substitutions in one or more position selected from the group: m9, g149, g182, g186, m202, t257, y295, n299, m323, e345 and a339, most preferred a variant that additionally has substitutions in all these positions. other examples are amylase variants such as those described in wo2011/098531, wo2013/001078 and wo2013/001087. commercially available amylases are duramyl™, termamyl™, fungamyl™, stainzyme™, stainzyme plus™, natalase™, liquozyme x and ban™ (from novozymes a/s), and rapidase™, purastar™/effectenz™, powerase, preferenz s1000, preferenz s100 and preferenz s110 (from genencor international inc./dupont). peroxidases/oxidases a peroxidase according to the invention is a peroxidase enzyme comprised by the enzyme classification ec 1.11.1.7, as set out by the nomenclature committee of the international union of biochemistry and molecular biology (iubmb), or any fragment derived therefrom, exhibiting peroxidase activity. suitable peroxidases include those of plant, bacterial or fungal origin. chemically modified or protein engineered mutants are included. examples of useful peroxidases include peroxidases from coprinopsis , e.g., from c. cinerea (ep 179,486), and variants thereof as those described in wo 93/24618, wo 95/10602, and wo 98/15257. a suitable peroxidase includes a haloperoxidase enzyme, such as chloroperoxidase, bromoperoxidase and compounds exhibiting chloroperoxidase or bromoperoxidase activity. haloperoxidases are classified according to their specificity for halide ions. chloroperoxidases (e.c. 1.11.1.10) catalyze formation of hypochlorite from chloride ions. preferably, the haloperoxidase is a vanadium haloperoxidase, i.e., a vanadate-containing haloperoxidase. haloperoxidases have been isolated from many different fungi, in particular from the fungus group dematiaceous hyphomycetes, such as caldariomyces, e.g., c. fumago, alternaria, curvularia , e.g., c. verruculosa and c. inaequalis, drechslera, ulocladium and botrytis. haloperoxidases have also been isolated from bacteria such as pseudomonas , e.g., p. pyrrocinia and streptomyces , e.g., s. aureofaciens. a suitable oxidase includes in particular, any laccase enzyme comprised by the enzyme classification ec 1.10.3.2, or any fragment derived therefrom exhibiting laccase activity, or a compound exhibiting a similar activity, such as a catechol oxidase (ec 1.10.3.1), an o-aminophenol oxidase (ec 1.10.3.4), or a bilirubin oxidase (ec 1.3.3.5). preferred laccase enzymes are enzymes of microbial origin. the enzymes may be derived from plants, bacteria or fungi (including filamentous fungi and yeasts). suitable examples from fungi include a laccase derivable from a strain of aspergillus, neurospora , e.g., n. crassa, podospora, botrytis, collybia, fomes, lentinus, pleurotus, trametes , e.g., t. villosa and t. versicolor, rhizoctonia , e.g., r. solani, coprinopsis , e.g., c. cinerea, c. comatus, c. friesii , and c. plicatilis, psathyrella , e.g., p. condelleana, panaeolus, e.g., p. papilionaceus, myceliophthora , e.g., m. thermophila, schytalidium , e.g., s. thermophilum, polyporus , e.g., p. pinsitus, phlebia , e.g., p. radiata (wo 92/01046), or coriolus , e.g., c. hirsutus (jp 2238885). suitable examples from bacteria include a laccase derivable from a strain of bacillus . a laccase derived from coprinopsis or myceliophthora is preferred; in particular, a laccase derived from coprinopsis cinerea , as disclosed in wo 97/08325; or from myceliophthora thermophila , as disclosed in wo 95/33836. dispersants the cleaning composition of the present invention can also contain dispersants. in particular, powdered detergents may comprise dispersants. suitable water-soluble organic materials include the homo- or co-polymeric acids or their salts, in which the polycarboxylic acid comprises at least two carboxyl radicals separated from each other by not more than two carbon atoms. suitable dispersants are for example described in powdered detergents, surfactant science series volume 71, marcel dekker, inc. dye transfer inhibiting agents the cleaning composition of the present invention may also include one or more dye transfer inhibiting agents. suitable polymeric dye transfer inhibiting agents include, but are not limited to, polyvinylpyrrolidone polymers, polyamine n-oxide polymers, copolymers of n-vinylpyrrolidone and n-vinylimidazole, polyvinyloxazolidones and polyvinylimidazoles or mixtures thereof. when present in a subject composition, the dye transfer inhibiting agents may be present at levels from about 0.0001% to about 10%, from about 0.01% to about 5% or even from about 0.1% to about 3% by weight of the composition. fluorescent whitening agent the cleaning composition of the present invention will preferably also contain additional components that may tint articles being cleaned, such as fluorescent whitening agent or optical brighteners. where present the brightener is preferably at a level of about 0.01% to about 0.5%. any fluorescent whitening agent suitable for use in a laundry detergent composition may be used in the composition of the present invention. the most commonly used fluorescent whitening agents are those belonging to the classes of diaminostilbene-sulfonic acid derivatives, diarylpyrazoline derivatives and bisphenyl-distyryl derivatives. examples of the diaminostilbene-sulfonic acid derivative type of fluorescent whitening agents include the sodium salts of: 4,4′-bis-(2-diethanolamino-4-anilino-s-triazin-6-ylamino) stilbene-2,2′-disulfonate, 4,4′-bis-(2,4-dianilino-s-triazin-6-ylamino) stilbene-2.2′-disulfonate, 4,4′-bis-(2-anilino-4-(n-methyl-n-2-hydroxy-ethylamino)-s-triazin-6-ylamino) stilbene-2,2′-disulfonate, 4,4′-bis-(4-phenyl-1,2,3-triazol-2-yl)stilbene-2,2′-disulfonate and sodium 5-(2h-naphtho[1,2-d][1,2,3]triazol-2-yl)-2-[(e)-2-phenylvinyl]benzenesulfonate. preferred fluorescent whitening agents are tinopal dms and tinopal cbs available from ciba-geigy ag, basel, switzerland. tinopal dms is the disodium salt of 4,4′-bis-(2-morpholino-4-anilino-s-triazin-6-ylamino) stilbene-2,2′-disulfonate. tinopal cbs is the disodium salt of 2,2′-bis-(phenyl-styryl)-disulfonate. also preferred are fluorescent whitening agents is the commercially available parawhite kx, supplied by paramount minerals and chemicals, mumbai, india. other fluorescers suitable for use in the invention include the 1-3-diaryl pyrazolines and the 7-alkylaminocoumarins. suitable fluorescent brightener levels include lower levels of from about 0.01, from 0.05, from about 0.1 or even from about 0.2 wt % to upper levels of 0.5 or even 0.75 wt %. soil release polymers the cleaning composition of the present invention may also include one or more soil release polymers which aid the removal of soils from fabrics such as cotton and polyester based fabrics, in particular the removal of hydrophobic soils from polyester based fabrics. the soil release polymers may for example be nonionic or anionic terephthalate based polymers, polyvinyl caprolactam and related copolymers, vinyl graft copolymers, polyester polyamides see for example chapter 7 in powdered detergents, surfactant science series volume 71, marcel dekker, inc. another type of soil release polymers is amphiphilic alkoxylated grease cleaning polymers comprising a core structure and a plurality of alkoxylate groups attached to that core structure. the core structure may comprise a polyalkylenimine structure or a polyalkanolamine structure as described in detail in wo 2009/087523 (hereby incorporated by reference). furthermore, random graft co-polymers are suitable soil release polymers. suitable graft co-polymers are described in more detail in wo 2007/138054, wo 2006/108856 and wo 2006/113314 (hereby incorporated by reference). suitable polyethylene glycol polymers include random graft co-polymers comprising: (i) hydrophilic backbone comprising polyethylene glycol; and (ii) side chain(s) selected from the group consisting of: c4-c25 alkyl group, polypropylene, polybutylene, vinyl ester of a saturated c1-c6 mono-carboxylic acid, cl—c6 alkyl ester of acrylic or methacrylic acid, and mixtures thereof. suitable polyethylene glycol polymers have a polyethylene glycol backbone with random grafted polyvinyl acetate side chains. the average molecular weight of the polyethylene glycol backbone can be in the range of from 2,000 da to 20,000 da, or from 4,000 da to 8,000 da. the molecular weight ratio of the polyethylene glycol backbone to the polyvinyl acetate side chains can be in the range of from 1:1 to 1:5, or from 1:1.2 to 1:2. the average number of graft sites per ethylene oxide units can be less than 1, or less than 0.8, the average number of graft sites per ethylene oxide units can be in the range of from 0.5 to 0.9, or the average number of graft sites per ethylene oxide units can be in the range of from 0.1 to 0.5, or from 0.2 to 0.4. a suitable polyethylene glycol polymer is sokalan hp22. other soil release polymers are substituted polysaccharide structures especially substituted cellulosic structures such as modified cellulose deriviatives such as those described in ep 1867808 or wo 2003/040279 (both are hereby incorporated by reference). suitable cellulosic polymers include cellulose, cellulose ethers, cellulose esters, cellulose amides and mixtures thereof. suitable cellulosic polymers include anionically modified cellulose, nonionically modified cellulose, cationically modified cellulose, zwitterionically modified cellulose, and mixtures thereof. suitable cellulosic polymers include methyl cellulose, carboxy methyl cellulose, ethyl cellulose, hydroxyl ethyl cellulose, hydroxyl propyl methyl cellulose, ester carboxy methyl cellulose, and mixtures thereof. anti-redeposition agents the cleaning composition of the present invention may also include one or more anti-redeposition agents such as carboxymethylcellulose (cmc), polyvinyl alcohol (pva), polyvinylpyrrolidone (pvp), polyoxyethylene and/or polyethyleneglycol (peg), homopolymers of acrylic acid, copolymers of acrylic acid and maleic acid, and ethoxylated polyethyleneimines. the cellulose based polymers described under soil release polymers above may also function as anti-redeposition agents. rheology modifiers the cleaning composition of the present invention may also include one or more rheology modifiers, structurants or thickeners, as distinct from viscosity reducing agents. the rheology modifiers are selected from the group consisting of non-polymeric crystalline, hydroxy-functional materials, polymeric rheology modifiers which impart shear thinning characteristics to the aqueous liquid matrix of a liquid detergent composition. the rheology and viscosity of the detergent can be modified and adjusted by methods known in the art, for example as shown in ep 2169040. other suitable cleaning composition components include, but are not limited to, anti-shrink agents, anti-wrinkling agents, bactericides, binders, carriers, dyes, enzyme stabilizers, fabric softeners, fillers, foam regulators, hydrotropes, perfumes, pigments, sod suppressors, solvents, and structurants for liquid detergents and/or structure elasticizing agents. formulation of cleaning compositions the cleaning composition of the invention may be in any convenient form, e.g., a bar, a homogenous tablet, a tablet having two or more layers, a pouch having one or more compartments, a regular or compact powder, a granule, a paste, a gel, or a regular, compact or concentrated liquid. pouches can be configured as single or multicompartments. it can be of any form, shape and material which is suitable for hold the composition, e.g. without allowing the release of the composition to release of the composition from the pouch prior to water contact. the pouch is made from water soluble film which encloses an inner volume. said inner volume can be divided into compartments of the pouch. preferred films are polymeric materials preferably polymers which are formed into a film or sheet. preferred polymers, copolymers or derivates thereof are selected polyacrylates, and water soluble acrylate copolymers, methyl cellulose, carboxy methyl cellulose, sodium dextrin, ethyl cellulose, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, malto dextrin, poly methacrylates, most preferably polyvinyl alcohol copolymers and, hydroxypropyl methyl cellulose (hpmc). preferably the level of polymer in the film for example pva is at least about 60%. preferred average molecular weight will typically be about 20,000 to about 150,000. films can also be of blended compositions comprising hydrolytically degradable and water soluble polymer blends such as polylactide and polyvinyl alcohol (known under the trade reference m8630 as sold by monosol llc, indiana, usa) plus plasticisers like glycerol, ethylene glycerol, propylene glycol, sorbitol and mixtures thereof. the pouches can comprise a solid laundry cleaning composition or part components and/or a liquid cleaning composition or part components separated by the water soluble film. the compartment for liquid components can be different in composition than compartments containing solids: us2009/0011970 a1. detergent ingredients can be separated physically from each other by compartments in water dissolvable pouches or in different layers of tablets. thereby negative storage interaction between components can be avoided. different dissolution profiles of each of the compartments can also give rise to delayed dissolution of selected components in the wash solution. a liquid or gel detergent, which is not unit dosed, may be aqueous, typically containing at least 20% by weight and up to 95% water, such as up to about 70% water, up to about 65% water, up to about 55% water, up to about 45% water, up to about 35% water. other types of liquids, including without limitation, alkanols, amines, diols, ethers and polyols may be included in an aqueous liquid or gel. an aqueous liquid or gel detergent may contain from 0-30% organic solvent. a liquid or gel detergent may be non-aqueous. granular detergent formulations the composition(s) of the invention may be formulated as a granule for example as a co-granule that combines one or more enzymes. each enzyme will then be present in more granules securing a more uniform distribution of enzymes in the detergent. this also reduces the physical segregation of different enzymes due to different particle sizes. methods for producing multi-enzyme co-granulates for the detergent industry are disclosed in the ip.com disclosure ipcom000200739d. another example of formulation of enzymes by the use of co-granulates are disclosed in wo 2013/188331, which relates to a detergent composition comprising (a) a multi-enzyme co-granule; (b) less than 10 wt zeolite (anhydrous basis); and (c) less than 10 wt phosphate salt (anhydrous basis), and the composition additionally comprises from 20 to 80 wt % detergent moisture sink component. the multi-enzyme co-granule may comprise an enzyme blend i.e. at least one dnase and at least one hexosaminidase and one or more enzymes selected from the group consisting of proteases, lipases, cellulases, xyloglucanases, perhydrolases, peroxidases, lipoxygenases, laccases, hemicellulases, proteases, cellulases, cellobiose dehydrogenases, xylanases, phospho lipases, esterases, cutinases, pectinases, mannanases, pectate lyases, keratinases, reductases, oxidases, phenoloxidases, ligninases, pullulanases, tannases, pentosanases, lichenases glucanases, arabinosidases, hyaluronidase, chondroitinase, amylases, and mixtures thereof. wo 2013/188331 also relates to a method of treating and/or cleaning a surface, preferably a fabric surface comprising the steps of (i) contacting said surface with the detergent composition as claimed and described herein in aqueous wash liquor, (ii) rinsing and/or drying the surface. an embodiment of the invention relates to an enzyme granule/particle comprising the dnase and hexosaminidase. the granule is composed of a core, and optionally one or more coatings (outer layers) surrounding the core. typically, the granule/particle size, measured as equivalent spherical diameter (volume based average particle size), of the granule is 20-2000 μm, particularly 50-1500 μm, 100-1500 μm or 250-1200 μm. the core may include additional materials such as fillers, fibre materials (cellulose or synthetic fibres), stabilizing agents, solubilising agents, suspension agents, viscosity regulating agents, light spheres, plasticizers, salts, lubricants and fragrances. the core may include binders, such as synthetic polymer, wax, fat, or carbohydrate. the core may comprise a salt of a multivalent cation, a reducing agent, an antioxidant, a peroxide decomposing catalyst and/or an acidic buffer component, typically as a homogenous blend. the core may consist of an inert particle with the enzyme absorbed into it, or applied onto the surface, e.g., by fluid bed coating. the core may have a diameter of 20-2000 μm, particularly 50-1500 μm, 100-1500 μm or 250-1200 μm. the core can be prepared by granulating a blend of the ingredients, e.g., by a method comprising granulation techniques such as crystallization, precipitation, pan-coating, fluid bed coating, fluid bed agglomeration, rotary atomization, extrusion, prilling, spheronization, size reduction methods, drum granulation, and/or high shear granulation. methods for preparing the core can be found in handbook of powder technology; particle size enlargement by c. e. capes; volume 1; 1980; elsevier. the core of the enzyme granule/particle may be surrounded by at least one coating, e.g., to improve the storage stability, to reduce dust formation during handling, or for coloring the granule. the optional coating(s) may include a salt coating, or other suitable coating materials, such as polyethylene glycol (peg), methyl hydroxy-propyl cellulose (mhpc) and polyvinyl alcohol (pva). examples of enzyme granules with multiple coatings are shown in wo 93/07263 and wo 97/23606. the coating may be applied in an amount of at least 0.1% by weight of the core, e.g., at least 0.5%, 1% or 5%. the amount may be at most 100%, 70%, 50%, 40% or 30%. the coating is preferably at least 0.1 μm thick, particularly at least 0.5 μm, at least 1 μm or at least 5 μm. in a one embodiment, the thickness of the coating is below 100 μm. in another embodiment, the thickness of the coating is below 60 μm. in an even more particular embodiment the total thickness of the coating is below 40 μm. the coating should encapsulate the core unit by forming a substantially continuous layer. a substantially continuous layer is to be understood as a coating having few or no holes, so that the core unit it is encapsulating/enclosing has few or none uncoated areas. the layer or coating should be homogeneous in thickness. the coating can further contain other materials as known in the art, e.g., fillers, antisticking agents, pigments, dyes, plasticizers and/or binders, such as titanium dioxide, kaolin, calcium carbonate or talc. a salt coating may comprise at least 60% by weight w/w of a salt, e.g., at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95% or at least 99% by weight w/w. the salt may be added from a salt solution where the salt is completely dissolved or from a salt suspension wherein the fine particles is less than 50 μm, such as less than 10 μm or less than 5 μm. the salt coating may comprise a single salt or a mixture of two or more salts. the salt may be water soluble, and may have a solubility at least 0.1 grams in 100 g of water at 20° c., preferably at least 0.5 g per 100 g water, e.g., at least 1 g per 100 g water, e.g., at least 5 g per 100 g water. the salt may be an inorganic salt, e.g., salts of sulfate, sulfite, phosphate, phosphonate, nitrate, chloride or carbonate or salts of simple organic acids (less than 10 carbon atoms, e.g., 6 or less carbon atoms) such as citrate, malonate or acetate. examples of cations in these salts are alkali or earth alkali metal ions, the ammonium ion or metal ions of the first transition series, such as sodium, potassium, magnesium, calcium, zinc or aluminium. examples of anions include chloride, bromide, iodide, sulfate, sulfite, bisulfite, thiosulfate, phosphate, monobasic phosphate, dibasic phosphate, hypophosphite, dihydrogen pyrophosphate, tetraborate, borate, carbonate, bicarbonate, metasilicate, citrate, malate, maleate, malonate, succinate, lactate, formate, acetate, butyrate, propionate, benzoate, tartrate, ascorbate or gluconate. in particular alkali- or earth alkali metal salts of sulfate, sulfite, phosphate, phosphonate, nitrate, chloride or carbonate or salts of simple organic acids such as citrate, malonate or acetate may be used. the salt in the coating may have a constant humidity at 20° c. above 60%, particularly above 70%, above 80% or above 85%, or it may be another hydrate form of such a salt (e.g., anhydrate). the salt coating may be as described in wo 00/01793 or wo 2006/034710. specific examples of suitable salts are nacl(ch 20°c =76%), na 2 co 3 (ch 20°c =92%), nano 3 (ch 20°c =73%), na 2 hpo 4 (ch 20°c =95%), na 3 po 4 (ch 25° c. =92%), nh 4 cl(ch 20°c =79.5%), (nh 4 ) 2 hpo 4 (ch 20°c =93.0%), nh 4 h 2 po 4 (ch 20°c =93.1%), (nh 4 ) 2 so 4 (ch 20°c =81.1%), kcl(ch 20°c =85%), k 2 hpo 4 (ch 20°c =92%), kh 2 po 4 (ch 20°c =96.5%), kno 3 (ch 2°c =93.5%), na 2 so 4 (ch 20°c =93%), k 2 so 4 (ch 20°c =98%), khso 4 (ch 20°c =86%), mgso 4 (ch 2°c =90%), znso 4 (ch 20°c =90%) and sodium citrate (ch 25°c =86%). other examples include nah 2 po 4 , (nh 4 )h 2 po 4 , cuso 4 , mg(no 3 ) 2 and magnesium acetate. the salt may be in anhydrous form, or it may be a hydrated salt, i.e. a crystalline salt hydrate with bound water(s) of crystallization, such as described in wo 99/32595. specific examples include anhydrous sodium sulfate (na 2 so 4 ), anhydrous magnesium sulfate (mgso 4 ), magnesium sulfate heptahydrate (mgso 4 .7h 2 o), zinc sulfate heptahydrate (znso 4 .7h 2 o), sodium phosphate dibasic heptahydrate (na 2 hpo 4 .7h 2 o), magnesium nitrate hexahydrate (mg(no 3 ) 2 (6h 2 o)), sodium citrate dihydrate and magnesium acetate tetrahydrate. preferably the salt is applied as a solution of the salt, e.g., using a fluid bed. one embodiment of the present invention provides a granule, which comprises: (a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, andand wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 37, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 38, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 39, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 40, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 41, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 42, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 43, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 47, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 55, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(a) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 56, and(b) optionally a coating consisting of one or more layer(s) surrounding the core. one embodiment of the invention relates to a granule, which comprises:(c) a core comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising an amino acid sequence with; xxv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,xxvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,xxvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,xxviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,xxix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,xxx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,xxxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,xxxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,xxxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,xxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xxxv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xxxvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xxxvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xxxviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xxxix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xl) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xli) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xlii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xliii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xliv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xlv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xlvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xlvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xlviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 64, and(d) optionally a coating consisting of one or more layer(s) surrounding the core. uses the present invention is also directed to methods for using the cleaning composition in laundry/textile/fabric (house hold laundry washing, industrial laundry washing) or hard surface cleaning (adw, car wash, industrial surface) use of cleaning composition the cleaning composition of the present invention may be formulated, for example, as a hand or machine laundry detergent composition including a laundry additive composition suitable for pretreatment of stained fabrics and a rinse added fabric softener composition, or be formulated as a detergent composition for use in general household hard surface cleaning operations, or be formulated for hand or machine dishwashing operations. in a specific aspect, the present invention provides a detergent additive comprising one or more enzymes as described herein. the present invention is directed to methods for using the compositions thereof. laundry/textile/fabric (house hold laundry washing, industrial laundry washing). hard surface cleaning (adw, car wash, industrial surface). the compositions of the invention comprise a blend of dnase and a hexosaminidase, and effectively reduce or remove organic components, such as polysaccharide and dna from surfaces such as textiles and hard surfaces e.g. dishes. the compositions of the invention comprise a blend of dnase and hexosaminidase, preferably β-n-acetylglucosaminidase, and the composition effectively reduce or remove organic components, such as polysaccharides and dna from surfaces such as textiles and hard surfaces e.g. dishes. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, and at least one cleaning component for reduction or removal of components e.g. of biofilm, such as polysaccharides, e.g. n-acetyl-glucosaminide e.g. poly-n-acetylglucosamine (pnag) and dna, of an item, wherein the item is a textile or a hard surface. one embodiment relates to the use of the cleaning composition comprising at least one dnase, at least one dispersin and at least one cleaning component(s) for cleaning of an item, wherein the item is a textile or a hard surface. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase, at least one hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, and a cleaning component for deep cleaning of an item, wherein the item is a textile or a surface. one embodiment of the invention relates to the use of a composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for reduction or removal of biofilm and/or compounds such as polysaccharide, e.g. n-acetyl-glucosaminide e.g. poly-n-acetylglucosamine (pnag) and/or dna of an item. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for reduction or removal of biofilm and/or compounds such as polysaccharide, e.g. n-acetyl-glucosaminide e.g. poly-n-acetylglucosamine (pnag) and/or dna of an item such as textile. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning when the cleaning composition is applied in e.g. laundry process. one embodiment of the invention relates to the use of a composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for reduction of redeposition or reduction of malodor. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for reduction of redeposition or reduction of malodor. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for reduction of redeposition or reduction of malodor when the cleaning composition is applied in e.g. laundry process. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for reduction of redeposition or reduction of malodor on an item e.g. textile. in one embodiment, the composition is an anti-redeposition composition. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 37. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63,and wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 38. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 39. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 40. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 41. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 42. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 43. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 47. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 55. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 56. one embodiment of the invention relates to the use of a cleaning composition comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin for deep cleaning of an item or reduction of redeposition or malodor, wherein the a hexosaminidase is selected from the group consisting of polypeptides comprising;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, andxxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 64. one embodiment relates to the use of a cleaning composition such as those described under the headline “cleaning composition”. one embodiment of the invention relates to a method of cleaning of an item, comprising the steps of: a) contacting the item with a wash liquor solution comprising an enzyme mixture comprising a fungal dnase, a dispersin and at least one cleaning component, wherein the cleaning component is selected from surfactants, builders and bleaches; and b) optionally rinsing the item, wherein the item is a textile or a hard surface. one embodiment of the invention relates to a method of cleaning of an item, comprising the steps of: a) contacting the item with a wash liquor solution comprising an enzyme mixture comprising at least 0.00001 ppm of at least one fungal dnase, at least 0.00001 ppm of at least one dispersin; and a cleaning component, wherein the cleaning component is selected from;i) 1 to 40 wt % surfactant, selected from anionic or non-ionic surfactant;ii) 1 to 30% builder, preferably non-phosphate e.g. methylglycinediacetic acid (mgda), glutamic acid-n,n-diacetic acid (glda); andiii) 0 to 20% bleach component, preferably manganese triazacyclononane (mntacn); b) optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of:a) contacting the item with a cleaning composition comprises a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component; andb) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of:a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 37, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides;i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 38, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 39, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63 and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 40, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63 and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 41, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63 and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 42, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63 and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 43, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63 and a cleaning component; andb) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of:a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 47, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22,xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63, and a cleaning component; andb) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 55, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1, ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2, iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3, iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4, v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5, vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6, vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7, viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8, ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9, x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10, xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11, xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12, xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13, xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14, xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15, xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16, xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17, xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18, xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19, xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20, xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21, xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22, xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 56, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1, ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2, iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3, iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4, v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5, vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6, vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7, viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8, ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9, x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10, xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11, xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12, xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13, xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14, xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15, xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16, xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17, xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18, xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19, xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20, xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21, xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22, xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition comprises a dnase, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 64, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin, wherein the hexosaminidase is selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1, ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2, iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3, iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4, v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5, vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6, vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7, viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8, ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9, x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10, xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11, xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12, xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13, xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14, xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15, xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16, xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17, xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18, xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19, xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20, xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21, xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22, xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63and a cleaning component; and b) and optionally rinsing the item, wherein the item is preferably a textile. the invention further relates to relates to a kit intended for deep cleaning, wherein the kit comprises a solution of an enzyme mixture comprising a fungal dnase, and a dispersin. one embodiment relates to a kit intended for deep cleaning, wherein the kit comprises a solution of an enzyme mixture comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin. the dnase is preferably selected from polypeptides having at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 37, seq id no 38, seq id no 39, seq id no 40, seq id no 41, seq id no 42, seq id no 43, seq id no 47, seq id no 55, seq id no 56 and seq id no: 64, and the a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin is preferably selected from the group consisting of the polypeptides; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1, ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2, iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3, iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4, v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5, vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6, vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7, viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8, ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9, x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10, xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11, xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12, xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13, xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14, xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15, xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16, xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17, xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18, xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19, xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20, xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21, xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22, xxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23, and xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. the invention is further described in the following paragraphs paragraph 1 a cleaning composition comprising a dnase, a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin and a cleaning component. paragraph 2. the cleaning composition according to paragraph 1, wherein the dnase is selected among polypeptides having dnase activity and comprises the motifs: a.(seq id no: 58)c[dn]treand(seq id no: 59)[dn]saek;b.(seq id no: 60)[kr]e[ag]w;orc.(seq id no: 61)rt[ts][dn][af][tdps]gy. paragraph 3. the cleaning composition according to paragraph 1 or 2, wherein the dnase is selected among polypeptides that has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in any of seq id no: 24-57 and seq id no: 64. paragraph 4 the cleaning composition according to paragraph 1-3, wherein the dnase is microbial, preferably obtained from fungi. paragraph 5 the cleaning composition according to paragraph 4, wherein the dnase is obtained from streptomyces sp., saccharothrix australiensis, kutzneria albida, pholiota squarrosa, marasmius oreades, cercospora fusimaculans, deconica coprophila, mortierella humilis, physisporinus sanguinolentus, stropharia semiglobata, cladosporium cladosporioides, irpex lacteus, phlabia subochracea, rhizoctonia solani, ascobolus stictoideus, urnula sp., ascobolus sp. zy179 , morchella costata, trichobolus zukalii, trichophaea saccata, trichophaea minuta, trichophaea abundans, pseudoplectania nigrella, gyromitra esculenta, morchella esculenta, morchella crassipes or disciotis venosa , preferably rhizoctonia solani, morchella costata, morchella esculenta or morchella crassipes. paragraph 6 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no 37. paragraph 7 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 38. paragraph 8 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 39. paragraph 9 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 40. paragraph 10 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 41. paragraph 11 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 42. paragraph 12 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 43. paragraph 13 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 47. paragraph 14 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 55. paragraph 15 the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 56. paragraph 16. the cleaning composition according to any of paragraphs 4 to 5, wherein the dnase has at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98% or 100% sequence identity to the amino acid sequence shown in seq id no: 64. paragraph 17 the cleaning composition according to any of the proceeding paragraphs, wherein the hexosaminidase is selected from the group of hexosaminidases consisting of polypeptides comprising an amino acid sequence having; i) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 1,ii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 2,iii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 3,iv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 4,v) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 5,vi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 6,vii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 7,viii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 8,ix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 9,x) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 10,xi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 11,xii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 12,xiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 13,xiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 14,xv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 15,xvi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 16,xvii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 17,xviii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 18,xix) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 19,xx) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 20,xxi) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 21,xxii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 22, andxxiii) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 23,xxiv) at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 98%, at least 99% or 100% sequence identity to the polypeptide shown in seq id no: 63. paragraph 18 the cleaning composition according to any of the preceding paragraphs wherein the amount of dnase in the composition is from 0.01 to 1000 ppm and the amount of hexosaminidase is from 0.01 to 1000 ppm. paragraph 19 the cleaning composition according to any of the preceding paragraphs, wherein the cleaning component is selected from surfactants, preferably anionic and/or nonionic, builders and bleach components. paragraph 20. the cleaning composition according to any of the preceding paragraphs, wherein the dnase and the hexosaminosade exhibit a synergistic effect. paragraph 21, the cleaning composition according to paragraph 20, wherein the wash performance synergy, measured as the difference between the wash performance of the combination of the dnase and the hexosaminidase and the sum of the wash performances of the dnase and the hexosaminidase alone, is at least 1.0, at least 2.0, at least 3.0, at least 4.0, at least 5.0, at least 6.0, at least 7.0, at least 8.0, at least 9.0 or at least 10.0. paragraph 22 use of a cleaning composition according to any of paragraphs 1 to 21 for deep cleaning of an item, wherein the item is a textile or a surface. paragraph 23 a method of formulating a cleaning composition according to any of paragraphs 1 to 21 comprising adding a dnase, a hexosaminidase and at least one cleaning component. paragraph 24 a kit intended for deep cleaning, wherein the kit comprises a solution of an enzyme mixture comprising a dnase and a hexosaminidase, preferably a β-n-acetylglucosaminidase e.g. a dispersin e.g. a β-n-acetylglucosaminidase. paragraph 25 a method of deep cleaning an item, comprising the steps of: a) contacting the item with a cleaning composition according to any of paragraphs 1 to 21; and b) and optionally rinsing the item, wherein the item is preferably a textile. definitions biofilm is produced by any group of microorganisms in which cells stick to each other or stick to a surface, such as a textile, dishware or hard surface or another kind of surface. these adherent cells are frequently embedded within a self-produced matrix of extracellular polymeric substance (eps). biofilm eps is a polymeric conglomeration generally composed of extracellular dna, proteins, and polysaccharides. biofilms may form on living or non-living surfaces. the microbial cells growing in a biofilm are physiologically distinct from planktonic cells of the same organism, which, by contrast, are single-cells that may float or swim in a liquid medium. bacteria living in a biofilm usually have significantly different properties from planktonic bacteria of the same species, as the dense and protected environment of the film allows them to cooperate and interact in various ways. one benefit of this environment for the microorganisms is increased resistance to detergents and antibiotics, as the dense extracellular matrix and the outer layer of cells protect the interior of the community. on laundry biofilm producing bacteria can be found among the following species: acinetobacter sp., aeromicrobium sp., brevundimonas sp., microbacterium sp., micrococcus luteus, pseudomonas sp., staphylococcus epidermidis , and stenotrophomonas sp. on hard surfaces biofilm producing bacteria can be found among the following species: acinetobacter sp., aeromicrobium sp., brevundimonas sp., microbacterium sp., micrococcus luteus, pseudomonas sp., staphylococcus epidermidis, staphylococcus aureus and stenotrophomonas sp. in one aspect, the biofilm producing strain is brevundimonas sp. in one aspect, the biofilm producing strain is pseudomonas alcaliphila or pseudomonas fluorescens . in one aspect, the biofilm producing strain is staphylococcus aureus. by the term “deep cleaning” is meant disruption, removal or reduction of components of organic matter, e.g. biofilm, such as polysaccharides, proteins, dna, soil or other components present in the organic matter. cleaning component: the cleaning component is different from the dnase and hexosaminidase. the precise nature of these cleaning component, and levels of incorporation thereof, will depend on the physical form of the composition and the nature of the operation for which it is to be used. suitable cleaning components include, but are not limited to the components described below such as surfactants, builders, flocculating aid, chelating agents, dye transfer inhibitors, enzymes, enzyme stabilizers, enzyme inhibitors, catalytic materials, bleach activators, hydrogen peroxide, sources of hydrogen peroxide, preformed peracids, polymeric agents, clay soil removal/anti-redeposition agents, brighteners, suds suppressors, dyes, perfumes, structure elasticizing agents, fabric softeners, carriers, hydrotropes, builders and co-builders, fabric huing agents, anti-foaming agents, dispersants, processing aids, and/or pigments. cleaning composition: the term “cleaning composition” refers to compositions that find use in the removal of undesired compounds from items to be cleaned, such as textiles. the cleaning composition may be a detergent composition and may be used to e.g. clean textiles for both household cleaning and industrial cleaning. the terms encompass any materials/compounds selected for the particular type of cleaning composition desired and the form of the product (e.g., liquid, gel, powder, granulate, paste, or spray compositions) and includes, but is not limited to, detergent compositions (e.g., liquid and/or solid laundry detergents and fine fabric detergents; fabric fresheners; fabric softeners; and textile and laundry pre-spotters/pretreatment). in addition to containing the enzyme of the invention, the detergent formulation may contain one or more additional enzymes (such as proteases, amylases, lipases, cutinases, cellulases, endoglucanases, xyloglucanases, pectinases, pectin lyases, xanthanases, peroxidases, haloperoxygenases, catalases and mannanases, or any mixture thereof), and/or detergent adjunct ingredients such as surfactants, builders, chelators or chelating agents, bleach system or bleach components, polymers, fabric conditioners, foam boosters, suds suppressors, dyes, perfume, tannish inhibitors, optical brighteners, bactericides, fungicides, soil suspending agents, anti-corrosion agents, enzyme inhibitors or stabilizers, enzyme activators, transferase(s), hydrolytic enzymes, oxido reductases, bluing agents and fluorescent dyes, antioxidants, and solubilizers. the term “cleaning composition” is used interchangeably with “detergent composition”. the cleaning composition of the present invention can be diluted with water to form a wash liquor solution upon application. the term “enzyme detergency benefit” is defined herein as the advantageous effect an enzyme may add to a detergent compared to the same detergent without the enzyme. important detergency benefits which can be provided by enzymes are stain removal with no or very little visible soils after washing and/or cleaning, prevention or reduction of redeposition of soils released in the washing process (an effect that also is termed anti-redeposition), restoring fully or partly the whiteness of textiles which originally were white but after repeated use and wash have obtained a greyish or yellowish appearance (an effect that also is termed whitening). textile care benefits, which are not directly related to catalytic stain removal or prevention of redeposition of soils, are also important for enzyme detergency benefits. examples of such textile care benefits are prevention or reduction of dye transfer from one fabric to another fabric or another part of the same fabric (an effect that is also termed dye transfer inhibition or anti-backstaining), removal of protruding or broken fibers from a fabric surface to decrease pilling tendencies or remove already existing pills or fuzz (an effect that also is termed anti-pilling), improvement of the fabric-softness, colour clarification of the fabric and removal of particulate soils which are trapped in the fibers of the fabric or garment. enzymatic bleaching is a further enzyme detergency benefit where the catalytic activity generally is used to catalyze the formation of bleaching components such as hydrogen peroxide or other peroxides. textile care benefits, which are not directly related to catalytic stain removal or prevention of redeposition of soils, are also important for enzyme detergency benefits. examples of such textile care benefits are prevention or reduction of dye transfer from one textile to another textile or another part of the same textile (an effect that is also termed dye transfer inhibition or anti-backstaining), removal of protruding or broken fibers from a textile surface to decrease pilling tendencies or remove already existing pills or fuzz (an effect that also is termed anti-pilling), improvement of the textile-softness, colour clarification of the textile and removal of particulate soils which are trapped in the fibers of the textile. enzymatic bleaching is a further enzyme detergency benefit where the catalytic activity generally is used to catalyze the formation of bleaching component such as hydrogen peroxide or other peroxides or other bleaching species.” the term “hard surface cleaning” is defined herein as cleaning of hard surfaces wherein hard surfaces may include floors, tables, walls, roofs etc. as well as surfaces of hard objects such as cars (car wash) and dishes (dish wash). dish washing includes but are not limited to cleaning of plates, cups, glasses, bowls, cutlery such as spoons, knives, forks, serving utensils, ceramics, plastics, metals, china, glass and acrylics. the term “wash performance” is used as an enzyme's ability to remove stains present on the object to be cleaned during e.g. wash or hard surface cleaning. the term “whiteness” is defined herein as a greying, yellowing of a textile. loss of whiteness may be due to removal of optical brighteners/hueing agents. greying and yellowing can be due to soil redeposition, body soils, colouring from e.g. iron and copper ions or dye transfer. whiteness might include one or several issues from the list below: colourant or dye effects; incomplete stain removal (e.g. body soils, sebum etc.); redeposition (greying, yellowing or other discolourations of the object) (removed soils reassociate with other parts of textile, soiled or unsoiled); chemical changes in textile during application; and clarification or brightening of colours. the term “laundering” relates to both household laundering and industrial laundering and means the process of treating textiles with a solution containing a cleaning or detergent composition of the present invention. the laundering process can for example be carried out using e.g. a household or an industrial washing machine or can be carried out by hand. by the term “malodor” is meant an odor which is not desired on clean items. the cleaned item should smell fresh and clean without malodors adhered to the item. one example of malodor is compounds with an unpleasant smell, which may be produced by microorganisms. another example is unpleasant smells can be sweat or body odor adhered to an item which has been in contact with human or animal. another example of malodor can be the odor from spices, which sticks to items for example curry or other exotic spices which smells strongly. the term “mature polypeptide” means a polypeptide in its final form following translation and any post-translational modifications, such as n-terminal processing, c-terminal truncation, glycosylation, phosphorylation, etc. the term “textile” means any textile material including yarns, yarn intermediates, fibers, non-woven materials, natural materials, synthetic materials, and any other textile material, fabrics made of these materials and products made from fabrics (e.g., garments and other articles). the textile or fabric may be in the form of knits, wovens, denims, non-wovens, felts, yarns, and towelling. the textile may be cellulose based such as natural cellulosics, including cotton, flax/linen, jute, ramie, sisal or coir or manmade cellulosics (e.g. originating from wood pulp) including viscose/rayon, cellulose acetate fibers (tricell), lyocell or blends thereof. the textile or fabric may also be non-cellulose based such as natural polyamides including wool, camel, cashmere, mohair, rabbit and silk or synthetic polymers such as nylon, aramid, polyester, acrylic, polypropylene and spandex/elastane, or blends thereof as well as blends of cellulose based and non-cellulose based fibers. examples of blends are blends of cotton and/or rayon/viscose with one or more companion material such as wool, synthetic fiber (e.g. polyamide fiber, acrylic fiber, polyester fiber, polyvinyl chloride fiber, polyurethane fiber, polyurea fiber, aramid fiber), and/or cellulose-containing fiber (e.g. rayon/viscose, ramie, flax/linen, jute, cellulose acetate fiber, lyocell). fabric may be conventional washable laundry, for example stained household laundry. when the term fabric or garment is used it is intended to include the broader term textiles as well. the term fungal e.g. fungal dnase or fungal hexosaminidase is in the context of the present invention in relation to polypeptide (such as an enzyme, e.g. a dnase or hexosaminidase) refers to a polypeptide encoded by and thus directly derivable from the genome of a fungus, where such fungus has not been genetically modified to encode said polypeptide, e.g. by introducing the encoding sequence in the genome by recombinant dna technology. in the context of the present invention, the terms “fungal dnase”, “fungal hexosaminidase e.g. dispersin”, “dnase obtained from a fungal source” or “hexosaminidase e.g. dispersin obtained from fungal source” thus refers to e.g. a dnase encoded by and thus directly derivable from the genome of a fungal species, where the fungal species has not been subjected to a genetic modification introducing recombinant dna encoding e.g. the dnase. thus, the nucleotide sequence encoding the fungal polypeptide having enzyme activity is a sequence naturally in the genetic background of a fungal species. the fungal polypeptide having enzyme activity encoding by such sequence may also be referred to a wildtype enzymes. in a further aspect, the invention provides polypeptides having dnase activity, wherein said polypeptides are substantially homologous to a fungal dnase. in the context of the present invention, the term “substantially homologous” denotes a polypeptide having dnase activity which is at least 80%, preferably at least 85%, more preferably at least 90%, more preferably at least 95%, even more preferably at least 96%, 97%, 98%, and most preferably at least 99% identical to the amino acid sequence of a selected fungal dnase. the polypeptides being substantially homologous to a fungal dnase may be included in a cleaning composition of the present invention and/or be used in the methods of the present invention. in a further aspect, the invention provides polypeptides having hexosaminidase activity e.g. dispersin, wherein said polypeptides are substantially homologous to a fungal hexosaminidase. in the context of the present invention, the term “substantially homologous” denotes a polypeptide having hexosaminidase activity which is at least 80%, preferably at least 85%, more preferably at least 90%, more preferably at least 95%, even more preferably at least 96%, 97%, 98%, and most preferably at least 99% identical to the amino acid sequence of a selected fungal hexosaminidase. the polypeptides being substantially homologous to a fungal hexosaminidase may be included in the detergent of the present invention and/or be used in the methods of the present invention. the term “variant” means a polypeptide having the activity of the parent or precursor polypeptide and comprising an alteration, i.e., a substitution, insertion, and/or deletion, at one or more (e.g., several) positions compared to the precursor or parent polypeptide. a substitution means replacement of the amino acid occupying a position with a different amino acid; a deletion means removal of the amino acid occupying a position; and an insertion means adding an amino acid adjacent to and immediately following the amino acid occupying a position. sequence identity: the relatedness between two amino acid sequences or between two nucleotide sequences is described by the parameter “sequence identity”. for purposes of the present invention, the sequence identity between two amino acid sequences is determined using the needleman-wunsch algorithm (needleman and wunsch, 1970, j. mol. biol. 48: 443-453) as implemented in the needle program of the emboss package (emboss: the european molecular biology open software suite, rice et al., 2000, trends genet. 16: 276-277), preferably version 6.6.0 or later. the parameters used are a gap open penalty of 10, a gap extension penalty of 0.5, and the eblosum62 (emboss version of blosum62) substitution matrix. the output of needle labeled “longest identity” (obtained using the nobrief option) is used as the percent identity and is calculated as follows: (identical residues×100)/(length of alignment total number of gaps in alignment). examples assays assay i: testing of dnase activity dnase activity was determined on dnase test agar with methyl green (bd, franklin lakes, n.j., usa), which was prepared according to the manual from supplier. briefly, 21 g of agar was dissolved in 500 ml water and then autoclaved for 15 min at 121° c. autoclaved agar was temperated to 48° c. in water bath, and 20 ml of agar was poured into petridishes with and allowed to solidify by incubation o/n at room temperature. on solidified agar plates, 5 μl of enzyme solutions are added and dnase activity is observed as colorless zones around the spotted enzyme solutions. assay ii: testing of dnase activity dnase activity was determined by using the dnasealert™ kit (11-02-01-04, idt intergrated dna technologies) according to the supplier's manual. briefly, 95 μl dnase sample was mixed with 5 μl substrate in a microtiter plate, and fluorescence was immediately measured using a clariostar microtiter reader from bmg labtech (536 nm excitation, 556 nm emission). assay iii: testing of hexosaminidase activity the hexosaminidase activity of the polypeptides was determined using 4-nitrophenyl n-acetyl-β-d-glucosaminide (sigma-aldrich) as substrate. the enzymatic reaction was performed in triplicates in a 96 well flat bottom polystyrene microtiter plate (thermo scientific) with the following conditions: 50 mm 2-(n-morpholino)ethanesulfonic acid ph 6 buffer, 1.5 mg/ml 4-nitrophenyl n-acetyl-β-d-glucosaminide and 20 μg/ml purified enzyme sample in a total reaction volume of 100 μl. blank samples without polypeptide were run in parallel. the reactions were carried out at 37° c. in a thermomixer comfort (eppendorf). after 10 minutes of incubation, 5 μl 1 m naoh was added to each reaction mixture to stop the enzymatic reaction. the absorbance was read at 405 nm using a polarstar omega plate reader (bmg labtech) to estimate the formation of 4-nitrophenolate ion released because of enzymatic hydrolysis of the 4-nitrophenyl n-acetyl-β-d-glucosaminide substrate. assay iii: mini wash assay wash performance may be assessed in laundry wash experiment using a mini wash assay, which is a test method where soiled textile is continuously is lifted up and down into the test solution and subsequently rinsed. the wash experiment is conducted under various experimental conditions one examples specified below: table 1experimental conditionsdetergentmodel a detergentmodel detergent a wash liquor (100%) is prepared by dissolving 3.33 g/l ofmodel detergent a containing 12% las, 1.1% aeo biosoft n25-7 (ni), 7%aeos (sles), 6% mpg, 3% ethanol, 3% tea (triethanolamine), 2.75%cocoa soap, 2.75% soya soap, 2% glycerol, 2% sodium hydroxide, 2%sodium citrate, 1% sodium formiate, 0.2% dtmpa and 0.2% pca (allpercentages are w/w (weight volume) in water with hardness 15 dh.detergent dose3.33 g/lphexample: “as is” in the current detergent solution and is not adjusted.water hardness15° dh, adjusted by adding cacl 2 2h 2 o, mgcl 2 6h 2 o and nahco 3(4:1:7.5) to milli-q water.enzymesenzyme blend according to the inventionenzyme conc.example 2.5 nm, 5 nm, 10 nm, 30 nm, 60 nmtest materialexample: biofilm or eps swatchestemperaturee.g. 15° c., 20° c., 30° c., 40° c. or 60° c.test systemsoiled textile continuously lifted up and down into the test solutions, 50times per minute the test solutions are kept in 125 ml glass beakers. afterwash of the textiles are continuously lifted up and down into tap water,aprox. 50 times per minute. test materials may be obtained from empa testmaterials ag mövenstrasse 12, ch-9015 st. gallen, switzerland, from center for testmaterials bv, p.o. box 120, 3133 kt vlaardingen, the netherlands, and wfk testgewebe gmbh, christenfeld 10, d-41379 brüggen, germany. the textiles are subsequently air-dried and the wash performance is measured as the brightness of the colour of these textiles. brightness can also be expressed as the remission (r), which is a measure for the light reflected or emitted from the test material when illuminated with white light. the remission (r) of the textiles is measured at 460 nm using a zeiss mcs 521 vis spectrophotometer. the measurements are done according to the manufacturer's protocol. example 1 synergistic effect between hexosaminidase and dnase on deep-cleaning in liquid model detergent on biofilm swatches a pseudomonas fluorescens isolate was restreaked on tryptone soya agar (tsa) (ph 7.3) (cm0131; oxoid ltd, basingstoke, uk) and incubated for 3 days at ambient temperature. a single colony was inoculated into 10 ml of tsb and the culture was incubated for 16 hours at ambient temperature, 200 rpm. after propagation, the culture was diluted in t-broth (10 g/i tryptone, 2.5 g/i nacl) medium and 1.65 ml aliquots were added to the wells of 12-well polystyrene flat-bottom microplates (3512; costar, corning incorporated, corning, n.y., usa), in which round swatches (diameter 2 cm) of sterile textile (wfk20a) had been placed. sterile medium was added to control wells. after incubation for 24 h at ambient temperature (static incubation), the swatches were rinsed twice with 0.9% (w/v) nacl before use. five rinsed biofilm swatches (sterile or with p. fluorescens ) were placed in 50 ml test tubes and 10 ml of wash liquor (15° dh water with 0.2 g/l iron(iii) oxide nanopowder (544884; sigma-aldrich) with 3.33 g/l liquid model a detergent) and 0.2 ppm enzyme was added to each tube. washes without enzyme were included as controls. the test tubes were placed in a stuart rotator and incubated for 1 hour at 30° c. at 20 rpm. the wash liquor was then removed, and the swatches were rinsed twice with 15° dh water and dried on filter paper over night. the remission (rem 460 nm ) values were measured using a macbeth color-eye 7000 (ce7000) and are displayed in table 2. wash performances (wp, δrem460 nm=rem 460 nm (swatches washed with enzyme) −rem 460 nm (swatches washed without enzyme) ) and the wash performance synergies, wp syn (δrem (cocktail) −δrem (sum of individual enzyme treatments) ) are also indicated. table 2synergistic effect of hexosaminidase and dnase on cleaning in modela detergent on biofilm swatches.enzymeconcentrationavg.wpswatch typeenzyme(μg/ml)rem460nm(δrem460nm)wp synwfk20a, sterileno enzyme072.8mediumwfk20a, biofilmno enzyme036.3wfk20a, biofilmseq id no: 160.247.411.1wfk20a, biofilmseq id no: 170.246.19.8wfk20a, biofilmseq id no: 470.2370.7wfk20a, biofilmseq id no: 410.238.42.1wfk20a, biofilmseq id no: 16 +0.2 + 0.251.515.23.4seq id no: 47wfk20a, biofilmseq id no: 16 +0.2 + 0.251.615.32.1seq id no: 41wfk20a, biofilmseq id no: 17 +0.2 + 0.255.319.08.5seq id no: 47wfk20a, biofilmseq id no: 17 +0.2 + 0.258.922.610.7seq id no: 41 as seen in table 2, an enzyme cocktail comprising hexosaminidase and dnase provides superior deep-cleaning properties in model a detergent as compared to the individual enzymes, given that the wash performance of the enzyme cocktail (δrem (cocktail)) exceed the sum of the performances seen for of the individual enzymes (δrem (sum of individual enzyme treatments)), i.e. wp syn >0. this clearly suggests that there is a synergetic effect between the two enzymes on the deep-cleaning properties in model a. this also suggests that the different eps components targeted by these enzymes are localized in complex macromolecular structures, which shield each other from enzymatic hydrolysis. example 2 synergistic effect between hexosaminidase and dnase on deep-cleaning in liquid model detergent on eps swatches a pnag-producing pseudomonas fluorescens isolate was used as model microorganism in the present example. the strain was restreaked on tryptone soya agar (tsa) (ph 7.3) (cm0131; oxoid ltd, basingstoke, uk) and incubated at 23° c. the strain was then inoculated into 500 ml duran® laboratory bottles containing t-broth (10 g/l bacto-tryptone, 5 g/l nacl) and incubated statically for 3 days at 26° c. the cultures were subsequently pelleted by centrifugation (10 min, 6000 g), resuspended in 3m nacl and incubated for 15 min at ambient temperature to extract the surface-associated eps (extracellular polymeric substances). the eps-containing supernatants obtained after an additional centrifugation step (4 min, 10000 g, 25° c.) were pooled and stored at −20° c. until further use (termed crude eps). for testing wash performance, 50ul aliquots of the crude eps were spotted on sterile textile swatches (wfk20a) and incubated for 15 min at ambient temperature. swatches spotted with sterile 3m nacl were included as controls. the swatches (sterile or with eps) were placed in 50 ml test tubes and 10 ml of wash liquor (15° dh water with 0.7 g/l wfk 09v pigment soil (wfk-testgewebe gmbh, #00500) and 3.33 g/l liquid model a detergent) and 0.2 μg/ml enzyme(s) was added to each tube. washes without enzyme were included as controls. the test tubes were placed in a stuart rotator and incubated for 1 hour at 30° c. at 20 rpm. the wash liquor was then removed, and the swatches were rinsed twice with 15° dh water and dried on filter paper over night. the remission (rem 460 nm ) values were measured using a macbeth color-eye 7000 (ce7000), and are displayed in table 3. delta remission values (rem 460 nm (swatches washed with enzyme) −rem 460 nm (swatches washed without enzyme) ) and the wash performance synergies, wp syn (δrem 460 nm (cocktail) −δrem 460 nm (sum of individual enzyme treatments) ) are also indicated. table 3synergistic effect of hexosaminidase and dnase on cleaning in modela detergent on eps swatches.enzymeconcentrationrem 460nmenzyme(μg/ml)valuesδrem 460nmwp synergywfk20a, no eps070.0wfk20a eps swatch,038.8no enzymewfk20a eps swatch,0.245.87.0seq id no: 16wfk20a eps swatch,0.251.312.5seq id no: 17wfk20a eps swatch,0.240.01.2seq id no: 47wfk20a eps swatch,0.239.40.6seq id no: 41wfk20a eps swatch,0.2 + 0.257.518.710.5seq id no: 16 +seq id no: 47wfk20a eps swatch,0.2 + 0.259.020.212.6seq id no: 16 +seq id no: 41wfk20a eps swatch,0.2 + 0.263.825.011.3seq id no: 17 +seq id no: 47wfk20a eps swatch,seq id no: 17 +0.2 + 0.263.724.911.8seq id no: 41 as seen in table 3, an enzyme cocktail comprising hexosaminidase and dnase also provides superior deep-cleaning properties on eps swatches in model a detergent. example 3 synergistic effect between hexosaminidases and dnases on deep-cleaning in liquid model detergent on eps stains for preparation of eps-containing stains, sterile textile swatches (wfk20a) were soaked in a mixture of eps (extracted from pseudomonas fluorescens was described above) and pigment soil (wfk 09v pigment soil, wfk-testgewebe gmbh, #00500) and left to dry overnight at ambient temperature. for wash performance testing, the stains were placed in 50 ml test tubes and 10 ml wash liquor 3.33 g/l liquid model a detergent and 0.1 μg/ml enzyme(s) was added to each tube. washes without enzyme were included as controls. the test tubes were placed in a stuart rotator and incubated for 1 hour at 30° c. at 20 rpm. the wash liquor was then removed, and the swatches were rinsed twice with 15° dh water and dried on filter paper over night. the remission (rem 460 nm ) values were measured using a datacolor 800v and are displayed in table 4, 5 and 6. delta values (rem 460 nm (swatches washed with enzyme) −rem 460 nm (swatches washed without enzyme) ) and the wash performance synergies, wp synergy (δrem 460 nm (cocktail) −δrem 460 nm (sum of individual enzyme treatments) ) are also indicated. table 4synergistic effect of hexosaminidase and dnase on cleaning inmodel a detergent on eps stains.enzymeconcentrationrem 460nmenzyme(pg/ml)valuesδrem 460nmwp synergyeps stain, no enzyme047.9eps stain, seq id no: 170.160.312.4eps stain, seq id no: 190.158.410.5eps stain, seq id no: 230.158.610.7eps stain, seq id no: 470.151.03.1eps stain seq id no: 410.149.41.5eps stain,0.1 + 0.170.622.77.2seq id no: 17 +seq id no: 47eps stain,0.1 + 0.170.322.48.5seq id no: 17 +seq id no: 41eps stain,0.1 + 0.170.122.28.6seq id no: 19 +seq id no: 47eps stain,0.1 + 0.167.519.67.6seq id no: 19 +seq id no: 41eps stain,0.1 + 0.170.822.99.1seq id no: 23 +seq id no: 47eps stain,0.1 + 0.169.121.29.0seq id no: 23 +seq id no: 41 table 5synergistic effect of hexosaminidase and dnase on cleaning in modela detergent on eps stains.enzymeconcentrationrem 460nmenzyme(μg/ml)valuesδrem 460nmwp synergyeps stain, no enzyme051.7eps stain, seq id no: 630.154.52.8eps stain, seq id no: 470.156.14.4eps stain, seq id no: 410.157.15.4eps stain, seq id no: 640.153.41.7eps stain,0.1 + 0.164.713.05.8seq id no: 63 +seq id no: 47eps stain,0.1 + 0.164.412.74.5seq id no: 63 +seq id no: 41eps stain,0.1 + 0.160.99.24.7seq id no: 63 +seq id no: 64 table 6synergistic effect of hexosaminidase and dnase on cleaning in modela detergent on eps stains.enzymeconcentrationrem 460nmenzyme(μg/ml)valuesδrem 460nmwp synergyeps stain, no enzyme047.3eps stain,0.153.76.4seq id no: 17eps stain,0.152.04.7seq id no: 19eps stain,0.152.24.9seq id no: 23eps stain,0.149.11.8seq id no: 64eps stain,0.1 + 0.161.113.85.6seq id no: 17 +seq id no: 64eps stain,0.1 + 0.157.410.13.6seq id no: 19 +seq id no: 64eps stain,0.1 + 0.155.98.61.9seq id no: 23 +seq id no: 64
153-031-192-792-401	US	[ "US" ]	H04L29/06,G06F15/16,H04L29/08	2013-05-29T00:00:00	2013	[ "H04", "G06" ]	media playback profile mapping	a network device stores a mapping configuration to associate client type profiles with particular delivery profiles for media content and receives, from a client device, a request for a link to a content selection. the request includes a content identifier and parameters for the client device. the network device constructs, based on the parameters for the client device, a particular client type profile and maps the particular client type profile to one of the particular delivery profiles in the mapping configuration. the network device constructs a uniform resource locator (url), based on the one of the particular delivery profiles and the content identifier, that provides the link to the content selection with formatting that is suitable for the particular client type profile and sends the url to the client device.	1 . a method implemented by a network device, the method comprising: storing a mapping configuration file to associate client type profiles with particular delivery profiles for media content; receiving, from a client device, a request for a link to a content selection, wherein the request includes a content identifier and parameters for the client device; constructing, based on the parameters for the client device, a particular client type profile; mapping the particular client type profile to one of the particular delivery profiles in the mapping configuration file; constructing a uniform resource locator (url) based on the one of the particular delivery profiles and the content identifier, wherein the url provides the link to the content selection with formatting that is suitable for the particular client type profile; and sending, to the client device, the url. 2 . the method of claim 1 , wherein the parameters for the client device included in the request are provided in a format that is defined to match a format used in the client type profiles of the mapping configuration. 3 . the method of claim 1 , wherein the delivery profiles include: one or more adaptive bit rate (abr) streaming profiles, and one or more download profiles. 4 . the method of claim 1 , wherein the parameters for the client device included in the request comprise indicators for a type of the client device. 5 . the method of claim 4 , wherein the parameters for the client device included in the request further comprise indicators for an access type used by the client device and an operating system for the client device. 6 . the method of claim 5 , wherein the parameters for the client device included in the request further comprise an indicator for a desired method of content delivery. 7 . the method of claim 6 , wherein the client device is one of: a personal communications system (pcs) terminal, a tablet computer, a smart phone, a personal computer, a laptop computer, a gaming console, a vehicular communication system, an internet television, or a digital video recorder (dvr) rental terminal. 8 . the method of claim 1 , wherein constructing the particular client type profile includes: concatenating one or more of the parameters for the client device into a client profile string. 9 . the method of claim 8 , wherein mapping the particular client type profile to one of the particular delivery profiles in the mapping configuration file comprises: matching the client profile string to one of the client type profile in the mapping configuration file, and selecting, from the mapping configuration file, the one of the particular delivery profiles associated with the one of the client type profiles. 10 . the method of claim 1 , wherein the content identifier included in the request comprises a content quality indication. 11 . the method of claim 1 , further comprising: receiving a change to the mapping configuration file, wherein the change associates the particular client type profile with a different one of the particular delivery profiles. 12 . the method of claim 11 , further comprising: receiving, from another client device, another request for a link to the content selection, wherein the request includes the content identifier and the parameters; constructing, based on the parameters, the particular client type profile; mapping the particular client type profile to the different one of the particular delivery profiles in the mapping configuration file; constructing another url based on the different one of the particular delivery profiles and the content identifier, wherein the other url provides the link to the content selection with different formatting that is suitable for the particular client type profile; and sending, by the network device and to the other client device, the other url. 13 . a network device, comprising: a memory configured to store instructions; and a processor configured to execute instructions in the memory to: store, in the memory, a mapping configuration to associate client type profiles with particular delivery profiles for media content; receive, from a client device, a request for a link to a content selection, wherein the request includes a content identifier and a particular client type profile for the client device; map the particular client type profile to one of the particular delivery profiles in the mapping configuration; construct a uniform resource locator (url) based on the one of the particular delivery profiles and the content identifier, wherein the url provides the link to the content selection with formatting that is suitable for the particular client type profile; and send, to the client device, the url. 14 . the network device of claim 13 , wherein the delivery profiles include: a http live streaming (hls) standard definition (sd) delivery profile, a hls high definition (hd) delivery profile, and a combined hls sd/hd delivery profile. 15 . the network device of claim 13 , wherein the parameters for the client device included in the request comprise indicators for a type of the client device and an operating system for the client device. 16 . the network device of claim 15 , wherein the parameters for the client device included in the request further comprises indicators for an access type used by the client device and a desired method of content delivery. 17 . the network device of claim 13 , where the processor is further configured to: receive an update to the mapping configuration, wherein the update associates the particular client type profile with a different one of the particular delivery profiles, and store, in the memory, updated mapping configuration. 18 . a computer-readable medium, including instructions executable by at least one processor, the computer-readable medium comprising one or more instructions for: receiving a mapping configuration file to associate client type profiles with particular delivery profiles for media content; receiving, from a client device, a request for a link to a content selection, wherein the request includes a content identifier and parameters for the client device; constructing, based on the parameters for the client device, a particular client type profile; mapping the particular client type profile to one of the particular delivery profiles in the mapping configuration file; constructing a uniform resource locator (url) based on the one of the particular delivery profiles and the content identifier, wherein the url provides the link to the content selection with formatting that is suitable for the particular client type profile; and sending the url to the client device. 19 . the computer-readable medium of claim 18 , wherein the delivery profiles include: one or more adaptive bit rate (abr) streaming profiles, and one or more downloading profiles. 20 . the computer-readable medium of claim 19 , wherein the one or more abr streaming profiles include: a http live streaming (hls) standard definition (sd) delivery profile, a hls high definition (hd) delivery profile, a smooth streaming sd delivery profile, and a smooth streaming hd delivery profile.	background media playback services may be provided to a variety of devices, including mobile devices and fixed devices that are configured to receive media via the internet. service providers may seek to determine an optimal format for providing media to individual devices. multiple factors may influence these determinations, such as the type of device, the type of connection, and the type of software. brief description of the drawings fig. 1 is an illustration of a concept described herein; fig. 2 is a diagram of an exemplary network in which systems and/or methods described herein may be implemented; fig. 3 is a diagram of exemplary components of one or more of the devices of the network depicted in fig. 2 ; fig. 4 is a block diagram of exemplary functional components of the orchestration server of figs. 1 and 2 ; fig. 5 is a diagram of an exemplary mapping definition format according to an implementation described herein; fig. 6 is a diagram of a portion of an exemplary configuration file for mapping definitions according to an implementation described herein; fig. 7 is a diagram of exemplary communications among a portion of the network of fig. 2 ; fig. 8 is an exemplary get request used in the communications of fig. 7 , according to an implementation described herein; fig. 9 is an exemplary get response used in the communications of fig. 7 , according to an implementation described herein; and fig. 10 is a flowchart of exemplary processes for mapping a content delivery profile to a requesting client device type, according to an implementation described herein. detailed description of preferred embodiments the following detailed description refers to the accompanying drawings. the same reference numbers in different drawings may identify the same or similar elements. systems, and/or methods described herein may provide a configurable mapping table for constructing a proper media playback uniform resource locator (url) in response to requests, from device clients, for media content. fig. 1 provides an illustration of concepts described herein. referring to fig. 1 , different types of user devices (e.g., a tablet device 110 and a laptop computer 120 ) may use different connection protocols, operating system, etc. to access media content via the internet. backend systems, such as backend systems 130 - 1 and 130 - 2 , may provide services (e.g., internet-based services, such as video content distribution services) to the user devices. these services may be optimized for presentation to a user based on the particular combination of features and connection protocols associated with a particular requesting user device (e.g., tablet device 110 or laptop computer 120 ). for example, backend system 130 - 1 may provide requested content in a format optimized for a mobile device using a 3g network (as defined by the third generation partnership project (3gpp)). by contrast, backend system 130 - 1 may provide requested content in a format optimized for a pc using a wi-fi network. an orchestration sever 140 may provide a proxy service (e.g., a server layer) linking a client application on user devices 110 / 120 with desired backend systems 130 . orchestration sever 140 may store a variety of delivery profiles that may distinguish, for example, between proprietary adaptive bit rate (abr) streaming formats and/or media quality (e.g., standard definition (sd) or high definition (hd). orchestration sever 140 may also store a variety of client type profiles that correspond to, for example, capabilities of particular user devices (e.g., tablet device 110 , laptop computer 120 , etc.) and/or their connection types to receive particular media formats. orchestration sever 140 may include a media playback mapping configuration with a collection of all the mappings between each client type profile and each delivery profile. when requesting particular media content to present to a user, the user devices (e.g., tablet device 110 , laptop computer 120 , etc.) may provide a client type profile with a standardized format. orchestration server 140 may map the client type profile to a particular delivery profile and use the matched delivery profile to configure a media playback url to provide the requested content in an optimal format for the requesting user device. fig. 2 is an exemplary network 200 in which concepts described herein may be implemented. network 200 may generally represent client devices connected to a video content distribution network. as illustrated, network 200 may include a video content management system (vcms) 210 , a data center 220 , a profile server 230 , a billing server 240 , a physical asset distribution system 250 , client devices 260 , a private network 270 , and a public network 280 . the particular arrangement and number of components of network 200 shown in fig. 2 are illustrated for simplicity. in practice there may be more video content management systems 210 , data centers 220 , profile servers 230 , physical asset distribution systems 250 , client devices 260 , and/or networks 270 / 280 . components of network 200 may be connected via wired and/or wireless links. vcms 210 may include one or more network devices, or other types of computation or communication devices, to aggregate content and content metadata, process content, and distribute content. in one implementation, vcms 210 may include a content delivery system 212 and a digital rights management (drm) server 214 . vcms 210 may aggregate content and transcode content into a digital format suitable for consumption on particular client devices 260 . for example, vcms 210 may include a transcoding device to convert a video file from one format to another (e.g., from one bit rate to another bit rate, from one resolution to another, from one standard to another, from one file size to another, etc.). vcms 210 may also encrypt data and communicate with drm server 214 to enforce digital rights. content delivery system 212 may include one or more network devices, or other types of computation or communication devices, to deliver digital content to client devices 260 . in one implementation, content delivery system 212 may include a streaming server that provides streaming data packets (e.g., via a media playback url) to client devices 260 (e.g., via network 280 ). in one implementation, a media playback url may be session-based, such that each url can be used only once for one client device 260 for security purposes. drm server 214 may include one or more network devices, or other types of computation or communication devices, to issue, validate, and/or enforce drm licenses to a client, such as an application running on one of client devices 260 . in implementations herein, drm server 214 may communicate with client device 260 to authenticate a user of client device 260 , the particular client device 260 , and/or an application residing on client device 260 . for example, drm server 214 may request/receive login information associated with the user, and compare the login information with stored information to authenticate the user. additionally, or alternatively, drm server 214 may request/receive device information (e.g., a unique device identifier) associated with client device 260 , and may compare the device information with stored information to authenticate client device 260 . data center 220 may include one or more network devices, or other types of computation or communication devices, to manage the authorization, selection, and/or purchase of multimedia content by a user of client devices 260 . as shown in fig. 2 , data center 220 may include orchestration server 140 , a catalog server 222 and an application server 224 . in one implementation, data center 220 may be accessed by client devices 260 via public network 280 . catalog server 222 may include one or more network devices, or other types of computation or communication devices (e.g., a server device, an application server device, a web server device, a database server device, a computer, etc.), to provide a unified catalog of both digital and physical content for users (e.g., of client devices 260 ) to consume (e.g., buy, rent, or subscribe). in one implementation, catalog server 222 may collect and/or present listings of video content available to client devices 260 . for example, catalog server 222 may receive digital and/or physical content metadata, such as lists or categories of content, from vcms 210 and/or physical asset distribution system 250 . catalog server 222 may use the content metadata to provide currently-available content options to client devices 260 . catalog server 222 may provide the content metadata to client device 260 directly or may communicate with client device 260 via application server 224 . application server 224 may include one or more network devices, or other types of computation or communication devices (e.g., a server device, an application server device, a web server device, a database server device, a computer, etc.), to provide a backend support system for mobile applications residing on client devices 260 . for example, application server 224 may permit client device 260 to download a video application that may permit a user to find content of interest or play downloaded or streaming content. the video application may enable client device 260 to present information received from data center 220 to a user of client device 260 in an interactive format to allow selection of particular digital or physical content. additionally, or alternatively, application server 224 may provide content metadata, such as lists or categories of content. also, application server 224 may authenticate a user who desires to purchase, rent, or subscribe to digital or physical content. in one implementation, the interactions between application server 224 and client device 260 may be performed using hypertext transfer protocol (http) or secure http (https) via public network 280 . orchestration server 140 may include one or more network devices, or other types of computation or communication devices (e.g., a server device, an application server device, a web server device, a database server device, a computer, etc.), to link client devices 260 with other devices/services in network 200 , such as devices in vcms 210 , devices in data center 220 , profile server 230 , billing server 240 , etc. in one implementation, orchestration server 140 may store a mapping configuration file to associate client type profiles with particular delivery profiles for media content. orchestration server 140 may receive, from a client device 260 , a request for a link to a content selection and may construct a uniform resource locator (url) that provides the link to the content selection with formatting that is suitable for the particular client device 260 . orchestration server 140 is described further in connection with, for example, figs. 4-7 . profile server 230 may include one or more network devices, or other types of computation or communication devices, to store user profile information for users (e.g., users of client devices 260 ). the user profile information may include various information regarding a user, such as login information (e.g., a user identifier and a password), billing information, address information, types of services to which the user has subscribed, a list of digital/physical content purchased by the user, a list of video content rented by the user, a list of video content to which the user has subscribed, a client device identifier (e.g., a media player identifier, a mobile device identifier, a set top box identifier, a personal computer identifier) for client device 260 , a video application identifier associated with the video application obtained from application server 224 , or the like. application server 224 may use the user profile information from profile server 230 to authenticate a user and may update the user profile information based on the user's activity (e.g., with a user's express permission). billing server 240 may include one or more network devices, or other types of computation or communication devices, to manage charging users for services provided via network 200 . billing server 240 may include, for example, a payment processing component, a billing component, and/or a settlement component. physical asset distribution system 250 may include one or more network devices, or other types of computation or communication devices, to track availability of physical content (e.g., dvds, blu-ray discs, memory cards, etc.) and provide metadata of physical content for inclusion in catalog information provided to users of client devices 260 . in one implementation, physical asset distribution system 250 may also provide physical asset information, such as location information, so that when a user wants to buy/rent a physical asset, the system can direct the user to the nearest geographic location (e.g., to retrieve the physical asset). vcms 210 , content delivery system 212 , drm server 214 , data center 220 , catalog server 222 , application server 224 , profile server 230 , billing server 240 , physical asset distribution system 250 , and orchestration server 140 may be referred to herein generally as backend servers. client device 260 may include a computation or communication device to enable a user to view video content or interact with another client device 260 or a video display device (e.g., a set-top box and/or television). client device 260 may include, for example, user devices 110 and 120 of fig. 1 . in other implementations, client device 260 may generally include a personal communications system (pcs) terminal (e.g., a smart phone that may combine a cellular radiotelephone with data processing and data communications capabilities), a tablet computer, a smart phone, a personal computer, a laptop computer, a gaming console, a vehicular communication system, an internet television, a digital video recorder (dvr) rental terminal, or other types of computation or communication devices. in one implementation, client device 260 may include a client-side application that enables client device 260 to communicate with, for example, vcms 210 or data center 220 and present information received from vcms 210 /data center 220 to a user. the client-side application may permit a user of client device 260 to log into an account (e.g., via application server 224 ), access catalog information (e.g., from catalog server 222 ), submit an order, and/or consume live streaming or downloaded video content (e.g., from vcms 210 ). private network 270 may include, for example, one or more private ip networks that use a private ip address space. private network 270 may include a local area network (lan), an intranet, a private wide area network (wan), etc. in one implementation, private network 270 may implement one or more virtual private networks (vpns) for providing communication between, for example, any of vcms 210 , data center 220 , profile server 230 , billing server 240 , and/or physical asset distribution system 250 . private network 270 may be protected and/or separated from other networks, such as public network 280 , by a firewall. although shown as a single element in fig. 2 , private network 270 may include a number of separate networks. public network 280 may include a local area network (lan), a wide area network (wan), such as a cellular network, a satellite network, a fiber optic network, or a combination of the internet and a private wan, etc. that is used to transport data. although shown as a single element in fig. 2 , public network 280 may include a number of separate networks that provide services to client devices 260 . although fig. 2 shows exemplary components of network 200 , in other implementations, network 200 may include fewer components, different components, differently-arranged components, and/or additional components than those depicted in fig. 2 . alternatively, or additionally, one or more components of network 200 may perform one or more tasks described as being performed by one or more other components of network 200 . for example, in one implementation, the functions of orchestration server 140 , catalog server 222 , and/or application server 224 may be combined in a single device or distributed among a group of devices. fig. 3 is a diagram of example components of a device 300 that may correspond to any one of the components, devices, or systems of network 200 . each of vcms 210 , content delivery system 212 , drm server 214 , data center 220 , catalog server 222 , application server 224 , profile server 230 , billing server 240 , physical asset distribution system 250 , client device 260 , and orchestration server 140 may be implemented/installed as a combination of hardware and software on one or more of devices 300 . as illustrated, device 300 may include a bus 310 , a processing unit 320 , a memory 330 , an input device 340 , an output device 350 , and a communication interface 360 . bus 310 may permit communication among the components of device 300 . processing unit 320 may include one or more processors or microprocessors that interpret and execute instructions. in other implementations, processing unit 320 may be implemented as or include one or more application specific integrated circuits (asics), field programmable gate arrays (fpgas), or the like. memory 330 may include a random access memory (ram) or another type of dynamic storage medium that stores information and instructions for execution by processing unit 320 , a read only memory (rom) or another type of static storage medium that stores static information and instructions for processing unit 320 , and/or some other type of magnetic or optical recording medium and its corresponding drive for storing information and/or instructions. input device 340 may include a device that permits an operator to input information to device 300 , such as a keyboard, a keypad, a mouse, a pen, a microphone, one or more biometric mechanisms, and the like. output device 350 may include a device that outputs information to the operator, such as a display, a speaker, etc. communication interface 360 may include any transceiver-like mechanism that enables device 300 to communicate with other devices and/or systems. for example, communication interface 360 may include mechanisms for communicating with other devices, such as other components of network 200 . as described herein, device 300 may perform certain operations in response to processing unit 320 executing software instructions contained in a computer-readable medium, such as memory 330 . a computer-readable medium may include a non-transitory memory device. a memory device may include space within a single physical memory device or spread across multiple physical memory devices. the software instructions may be read into memory 330 from another computer-readable medium or from another device via communication interface 360 . the software instructions contained in memory 330 may cause processing unit 320 to perform processes described herein. alternatively, hardwired circuitry may be used in place of or in combination with software instructions to implement processes described herein. thus, implementations described herein are not limited to any specific combination of hardware circuitry and software. although fig. 3 shows exemplary components of device 300 , in other implementations, device 300 may include fewer components, different components, differently arranged components, or additional components than depicted in fig. 3 . as an example, in some implementations, input device 340 and/or output device 350 may not be implemented by device 300 . in these situations, device 300 may be a “headless” device that does not explicitly include an input or an output device. alternatively, or additionally, one or more components of device 300 may perform one or more other tasks described as being performed by one or more other components of device 300 . fig. 4 is a block diagram of exemplary functional components of orchestration server 140 . in one implementation, the functions described in connection with fig. 4 may be performed by one or more components of device 300 ( fig. 3 ). as shown in fig. 4 , orchestration server 140 may include a profile assembly module 410 , a mapping module 420 , mapping definitions 430 , and a url assembly module 440 . profile assembly module 410 may receive sets of parameters from client devices 260 and may assemble the parameters into client type profiles. each set of parameters may be assembled into a corresponding client type profile for the requesting client device 260 . parameters received from client device 260 may include, for example, a customer identifier, a content identifier, a type of device, access configurations, and a content format for a particular viewing session. the customer identifier may include a unique alpha-numeric sequence for a particular user (e.g., of client device 260 ). the content identifier may include a unique alpha-numeric sequence for a particular content selection. the type of device may include a pre-defined description code for a type of client device. the pre-defined codes may include a make and a model descriptor. makes may include, for example, ipa for an ipad, anp for an android phone, ant for an android tablet, etc. models may include, for example, versions of particular device models (e.g., 3, 4s, galaxy, droid, etc.). the access configurations may include an access capability (e.g., 3g, 4g, wi-fi, etc.) of client device 260 . the content format may include, for example, an indicator for the desired method of content delivery (e.g., streaming or download). in one implementation, profile assembly module 410 may concatenate some or all parameters received from client device 260 into a client profile string. mapping module 420 may receive a client type profile from profile assembly module 410 and may map the client type profile to a corresponding delivery profile. for example, mapping module 420 may perform a lookup of the client type profile in mapping definitions 430 to find a corresponding delivery profile. in one implementation, a single delivery profile may be applicable to multiple client type profiles. mapping definitions 430 may include a collection of all the mappings between each client type profile and each delivery profile. mapping definitions 430 may include a table, database, xml file, or another type of data structure. for example, a network administrator may create a file to associate each client type profile with a particular delivery profile. in one implementation, mapping definitions 430 may be updated/changed such that lookups by mapping module 420 may be affected as soon as changes to mapping definitions 430 are entered and/or stored. fig. 5 provides an example of a format 500 for a mapping definition that may be stored in mapping definitions 430 . as shown in fig. 5 , mapping definition format 500 may include a device specification indicator 510 , a client type profile section 520 , and a delivery profile section 530 . device specification indicator 510 may indicate a start and stop point to define an individual mapping definition. client type profile section 520 may include a client type profile in a particular string format. particularly, in the example of fig. 5 , the client profile string format may include a concatenation of the device spec with access type, a media content quality (e.g., hd/sd), and a download/streaming indication. delivery profile section 530 may include a media profile for delivery of content from vcms 210 . media profiles may include, for example, an adaptive bit rate type and quality such as apple's http live streaming (hls), microsoft's smooth streaming, or other streaming technologies. exemplary media profiles for delivery profile section 530 may include “smooth_sd” for smooth streaming in standard definition and “smooth_hd” for smooth streaming in high definition. in some implementations, a media profile may include a sub-profile to designate, for example, different operating systems for a particular streaming type. thus, a media sub-profile may include a distinction between a group of mobile devices with similar features (e.g., “mobile_a”) and consumer electronics devices that are wi-fi enabled (e.g., “ce_devices”). exemplary media profiles with sub-profiles for delivery profile section 530 include “hls_sm_sd.mobile_a” for hls secure media in standard definition for a client device designated in group mobile type a, or “hls_sm_hd.ce_devices” for hls secure media in high definition for a client device that is a consumer electronics device. in one implementation, delivery profile section 530 may include a generic indicator (e.g., “% format %”) to combine two or more mappings into one. for example, rather than specifying hd/sd in a media profile, a particular delivery profile may direct url assembly module 440 to use the maximum allowed resolution of a particular content selection to construct a url for access to the selected content (also referred to herein as a “cdn url” or “content delivery network url”). mapping definitions 430 may store a collection of all the mappings between each client type profile and each delivery profile. in one implementation, the mapping definitions may be stored in an xml format a represented in fig. 6 , which shows a portion 600 of a configuration file according to an implementation described herein. as shown in fig. 6 , portion 600 of the configuration file may include multiple instance of mapping definition format 500 where, in some instances, the same delivery profile (e.g., “<type>”) may be applied to more than one client type (e.g., “<spec>”). returning to fig. 4 , url assembly module 440 receive a delivery profile (e.g., identified by mapping module 420 ) and content selection (e.g., from client device 260 ) and may generate a cdn url for access to the selected content. for example, url assembly module 440 may construct a cdn url to enable client device 260 to access the selected content from vcms 210 in an optimal format for client device 260 . in one implementation, the cdn url may be a session-based streaming url. although fig. 4 shows exemplary functional components of orchestration server 140 , in other implementations, orchestration server 140 may include fewer functional components, different functional components, differently-arranged functional components, and/or additional functional components than depicted in fig. 4 . alternatively, or additionally, one or more functional components of orchestration server 140 may perform one or more other tasks described as being performed by one or more other functional components of orchestration server 140 . fig. 7 is a diagram of exemplary communications among a portion 700 of network 200 . as shown in fig. 7 , network portion 700 may include orchestration server 140 , three different client devices 260 (indicated as client devices 260 - 1 , 260 - 2 and 260 - 3 ), and vcms 210 . the particular arrangement and number of components of network portion 700 are illustrated for simplicity. in practice there may be more client devices 260 , orchestration servers 140 , and/or vcms 210 . communications in fig. 7 may include communications to manage to content presentation requests from client devices 260 . client devices 260 may each include different front-end client applications that are configured to generate requests for content from orchestration server 140 . in examples described herein, client device 260 - 1 may include a mobile device operating system (e.g., google's android os, etc.) over a wi-fi network; client device 260 - 2 may include a laptop computer using a full-featured web browser/operating system over an ethernet connection; and client device 260 - 3 may include a tablet operating system (e.g., apple's ios) over a 3g network. referring to fig. 7 , client device 260 - 1 may generate a get request 710 (e.g., in response to a user's selection of particular media content to purchase/rent). get request 710 may include a call to particular application program interface (api) of orchestration server 140 . fig. 8 provides an example of get request 710 that may correspond to a particular content request from client device 260 - 1 . get request 710 may include parameters, such as user information, selected content information, and device information in pre-defined (or standardized) formats (e.g., defined within a client application of client device 260 and/or consistent with standardized formats used in mapping definitions 430 ). in one implementation, get request 710 may include parameters that can be subsequently assembled into a client type profile. in another implementation, get request 710 may include a complete client type profile (e.g., such that construction of a client type profile by profile assembly module 410 would not be needed). user information of get request 710 may include, for example, a user identifier or account number (e.g., “partnercustomernumber” of fig. 8 ). content information may include, for example, a unique content identifier and/or content source for a user's particular selection from a catalog (e.g., “purchaseoptionid” of fig. 8 ). device information in get request 710 may include a device identifier (e.g., “deviceid” of fig. 8 ), a device configuration (e.g., “devicespec” of fig. 8 ), and a distribution method (e.g., “download” of fig. 8 ) selected by client device 260 for a particular viewing session. in one implementation, get request 710 may also include transaction information, such as a unique transaction identifier, transaction time, etc. in the example of fig. 7 , particular parameters of client device 260 - 1 included in get request 710 may correspond to a samsung galaxy tablet (e.g., “galaxy”) using an android operating system (e.g., “ant”) and connecting to orchestration server 140 via wi-fi signals (e.g., “wifi”). orchestration server 140 may receive get request 710 . orchestration server 140 (e.g., profile assembly module 410 ) may extract parameters from get request 710 to construct a client type profile that corresponds to get request 710 . in one aspect, the client type profile may include the device type, the access type (e.g., wifi, 3g, or 4g), and the delivery type (e.g., streaming or download) concatenated in a particular order. for example, based on get request 710 from client device 260 - 1 , the client type profile may be constructed as “ant_galaxy_wifi_streaming.” based on the constructed client type profile, orchestration server 140 may map the client type profile to a corresponding delivery profile. for example, orchestration server 140 (e.g., mapping module 420 ) may perform a lookup of “ant_galaxy_wifi_streaming” in mapping definitions 430 to find a corresponding delivery profile. in one implementation, a single delivery profile may be applicable to multiple client type profiles. in one aspect, applying the client type profile “ant_galaxy_wifi_streaming” to the configuration portion 600 of fig. 6 , mapping module 430 may map to the delivery profile “hls_sm_sd.mobile_a.” orchestration server 140 may apply the delivery profile to the content identifier from get request 710 to construct a cdn url to enable client device 260 - 1 to access the selected content from vcms 210 in an optimal format for client device 260 - 1 . orchestration server 140 may provide the cdn url to client device 260 - 1 as part of a get response 715 . in one implementation, get response 715 may include the cdn url and other information to enforce digital rights management (e.g., tokens, expiration periods, entitlement codes, etc.). client device 260 - 1 may use the cdn url from get response 715 to retrieve the selected content identified in get request 710 , as indicated by reference number 740 . fig. 9 provides an example get response 715 that may correspond to the particular get request from client device 260 - 1 . in a similar manner to that described above for client device 260 - 1 , client device 260 - 2 may provide a get request 720 to orchestration server 140 . based on characteristics of client device 260 - 2 , get request 720 may include a user identifier, a unique content identifier, and device information. in the example of fig. 7 , particular parameters of client device 260 - 2 included in get request 720 may correspond to a pc using a web browser (e.g., “web”) and connecting to orchestration server 140 via a wired connection. orchestration server 140 (e.g., profile assembly module 410 ) may extract parameters from get request 720 to construct a client type profile that corresponds to get request 720 . for example, based on get request 720 , the client type profile for client device 260 - 2 may be constructed as “web_streaming.” using the exemplary configuration portion 600 of fig. 6 , orchestration server 140 (e.g., mapping module 420 ) may perform a lookup of “web_streaming” in mapping definitions 430 to find the corresponding delivery profile, “smooth_% format %.” orchestration server 140 may apply the delivery profile to the content identifier from get request 720 to construct a cdn url to enable client device 260 - 2 to access the selected content from vcms 210 , and may provide the cdn url to client device 260 - 2 as part of get response 725 . client device 260 - 2 may use the cdn url from get response 725 to retrieve the selected content identified in get request 720 , as indicated by reference number 745 . also similarly, client device 260 - 3 may provide a get request 730 to orchestration server 140 . based on characteristics of client device 260 - 3 , get request 730 may include a user identifier, a unique content identifier, and device information. in the example of fig. 7 , particular parameters of client device 260 - 3 included in get request 730 may correspond to an iphone (e.g., “iph”) with an unspecified or older model number (e.g., “default”) connecting to orchestration server 140 via a 3g cellular network (e.g., “3g”). orchestration server 140 (e.g., profile assembly module 410 ) may extract parameters from get request 730 to construct a client type profile that corresponds to get request 730 . for example, based on get request 730 , the client type profile for client device 260 - 3 may be constructed as “iph_defualt — 3g_download.” using the exemplary configuration portion 600 of fig. 6 , orchestration server 140 (e.g., mapping module 420 ) may perform a lookup of “iph_defualt — 3g_download” in mapping definitions 430 to find the corresponding delivery profile, “iphone.” orchestration server 140 may apply the delivery profile to the content identifier from get request 730 to construct a cdn url to enable client device 260 - 3 to access the selected content from vcms 210 , and may provide the cdn url to client device 260 - 3 as part of get response 730 . client device 260 - 3 may use the cdn url from get response 735 to retrieve the selected content identified in get request 710 , as indicated by reference number 750 . although fig. 7 shows example components of network portion 700 , in other implementations, network portion 700 may include fewer components, different components, differently arranged components, and/or additional components than depicted in fig. 7 . alternatively, or additionally, one or more components of network portion 700 may perform one or more other tasks described as being performed by one or more other components of network portion 700 . fig. 10 is a flow chart of an exemplary process 1000 for mapping a content delivery profile to a requesting client device type, according to an implementation described herein. in one implementation, process 1000 may be performed by orchestration server 140 . in another implementation, some or all of process 1000 may be performed by another device or group of devices, including or excluding orchestration server 140 . as illustrated in fig. 10 , process 1000 may include receiving and/or storing a mapping configuration for delivering media content to different client devices (block 1010 ). for example, orchestration server 140 may receive a mapping configuration file to associate client type profiles with particular delivery profiles for media content. orchestration server 140 may store the mapping configuration file as mapping definitions 430 . process 1000 may include receiving a get request from a client device for a particular content selection (block 1020 ). for example, orchestration server 140 may receive, from a client device 260 , a request (e.g., get request 710 ) for a link to a particular content selection. the request may include a content identifier and parameters for the client device, such as indicators for a type of client device 260 , indicators of an operating system for client device 260 , indicators for an access type (e.g., 3g, 4g, wi-fi, etc.) used by client device 260 , and/or an indicator for a desired method of content delivery (e.g., streaming/download). in another implementation, the request may include parameters in the form of a complete client type profile (e.g., consistent with client type profile section 520 ). process 1000 may include constructing a client type profile (block 1030 ), and mapping the client type profile to (block 1040 ). for example, if get request 710 does not include a complete client type profile, orchestration server 140 may construct, based on the parameters for client device 260 , a particular client type profile. in one aspect, the particular client type profile may be configured to match a standard format (e.g., client type profile section 520 ) used in the client type profiles of the mapping definitions 430 . orchestration server 140 may map the particular client type profile to one of the particular delivery profiles in the mapping definitions 430 . process 1000 may also include constructing a cdn url based on the delivery profile and the selected content (block 1050 ). for example, orchestration server 140 may construct a url based on the particular delivery profile previously mapped to the client type profile of client device 260 and the content identifier from get request 710 . the url may provide a link to the selected content with formatting that is suitable for the particular client type profile of client device 260 . process 1000 may further include generating and sending a response to the get request that includes the cdn url (block 1060 ). for example, orchestration server 140 may generate a response (e.g., get response 715 ) that includes include the cdn url along with other information to enforce digital rights management for the selected content. orchestration server 140 may provide the response to client device 260 . systems and/or methods described herein may store a mapping configuration to associate client type profiles with particular delivery profiles for media content and may receive, from a client device, a request for a link to a content selection. the request may include a content identifier and parameters for the client device. the systems and/or methods may construct, based on the parameters for the client device, a particular client type profile and maps the particular client type profile to one of the particular delivery profiles in the mapping configuration. the systems and/or methods may construct a uniform resource locator (url), based on the one of the particular delivery profiles and the content identifier, that provides the link to the content selection with formatting that is suitable for the particular client type profile and may send the url to the client device. to the extent the aforementioned embodiments collect, store or employ personal information provided by individuals, it should be understood that such information shall be used in accordance with all applicable laws concerning protection of personal information. additionally, the collection, storage and use of such information may be subject to consent of the individual to such activity, for example, through well known “opt-in” or “opt-out” processes as may be appropriate for the situation and type of information. storage and use of personal information may be in an appropriately secure manner reflective of the type of information, for example, through various encryption and anonymization techniques for particularly sensitive information. the foregoing description of exemplary implementations provides illustration and description, but is not intended to be exhaustive or to limit the embodiments described herein to the precise form disclosed. modifications and variations are possible in light of the above teachings or may be acquired from practice of the embodiments. further, while a series of blocks have been described with respect to fig. 10 , the order of the blocks may be varied in other implementations. moreover, non-dependent acts may be implemented in parallel. additionally, other processes described in this description may be varied and/or acts performed in parallel. it will also be apparent that various features described above may be implemented in many different forms of software, firmware, and hardware in the implementations illustrated in the figures. the actual software code or specialized control hardware used to implement the various features is not limiting. thus, the operation and behavior of the features of the invention were described without reference to the specific software code—it being understood that one would be able to design software and control hardware to implement the various features based on the description herein. further, certain features described above may be implemented as “logic” that performs one or more functions. this logic may include hardware, such as one or more processors, microprocessors, application specific integrated circuits, or field programmable gate arrays, software, or a combination of hardware and software. in the preceding specification, various preferred embodiments have been described with reference to the accompanying drawings. it will, however, be evident that various modifications and changes may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the claims that follow. the specification and drawings are accordingly to be regarded in an illustrative rather than restrictive sense. no element, act, or instruction used in the description of the present application should be construed as critical or essential to the invention unless explicitly described as such. also, as used herein, the article “a” is intended to include one or more items. further, the phrase “based on” is intended to mean “based, at least in part, on” unless explicitly stated otherwise.
153-732-193-664-382	KR	[ "CN", "US", "KR", "TW" ]	H01L21/67,C23C16/46,C23C16/52,H01L21/677	2018-06-21T00:00:00	2018	[ "H01", "C23" ]	substrate processing system	the present invention provides a substrate processing system for improving productivity of processes. in this regard, the substrate processing system includes: a first chamber providing a space whereat least one substrate is accommodated; a second chamber configured to transfer at least one substrate to the first chamber; and a temperature control unit configured to change a temperature of a gasin the second chamber.	1. a substrate processing system comprising: a reaction chamber providing a space where at least one substrate is processed; a substrate transfer chamber configured to supply the at least one substrate to the reaction chamber; a gas supply line connected to the substrate transfer chamber; and at least one heater configured to heat a gas supplied to the substrate transfer chamber, wherein, when the reaction chamber and the substrate transfer chamber communicate with each other, a pressure of the gas of the substrate transfer chamber is equal to or higher than a pressure of a gas of the reaction chamber, wherein the at least one heater comprises: a first heater arranged at the gas supply line; and a second heater arranged at the substrate transfer chamber. 2. the substrate processing system of claim 1 , wherein the at least one heater is arranged at the substrate transfer chamber, and accordingly, the gas inside the substrate transfer chamber is heated. 3. the substrate processing system of claim 1 , further comprising a protective cover configured to block heat radiated from the at least one heater. 4. the substrate processing system of claim 3 , wherein the protective cover is arranged between the substrate transfer chamber and the reaction chamber. 5. the substrate processing system of claim 1 , wherein the at least one heater is arranged at the gas supply line, and accordingly, the gas passing through the gas supply line is heated. 6. the substrate processing system of claim 1 , wherein the first heater and the second heater are independently heated. 7. the substrate processing system of claim 1 , wherein a first heating temperature of the first heater is equal to or higher than a second heating temperature of the second heater. 8. the substrate processing system of claim 1 , further comprising a substrate transfer unit arranged at the substrate transfer chamber, wherein the substrate transfer unit comprises a cooling member. 9. the substrate processing system of claim 1 , wherein a temperature of the gas heated by the at least one heater is equal to or higher than an internal temperature of the reaction chamber. 10. the substrate processing system of claim 1 , wherein, when a substrate is introduced from the substrate transfer chamber to the reaction chamber, the temperature of the gas heated by the at least one heater is higher than the internal temperature of the reaction chamber. 11. the substrate processing system of claim 1 , wherein the at least one heater is further configured to heat the gas before a substrate is discharged from the reaction chamber. 12. the substrate processing system of claim 1 , wherein the at least one heater is further configured to heat the gas before a substrate is introduced to the reaction chamber. 13. the substrate processing system of claim 1 , wherein at least some of the gas heated by the at least one heater is introduced from the substrate transfer chamber to the reaction chamber. 14. a substrate processing system comprising: a first chamber providing a space where at least one substrate is accommodated; a second chamber configured to transfer the at least one substrate to the first chamber; a gas supply line connected to the second chamber; and a temperature control unit configured to change a temperature of a gas in the second chamber, wherein the temperature control unit comprises: a first heater arranged at the gas supply line; and a second heater arranged at the second chamber. 15. the substrate processing system of claim 14 , wherein the gas having the temperature changed by the temperature control unit is introduced from the second chamber to the first chamber. 16. the substrate processing system of claim 14 , further comprising a third chamber providing a space where the at least one substrate is accommodated, wherein the temperature control unit is further configured to, when the at least one substrate is moved from the first chamber to the third chamber, change the temperature of the gas in the second chamber to correspond to a temperature condition of the third chamber. 17. a substrate processing system comprising: a load lock chamber configured to accommodate at least one substrate; a reaction chamber providing a space where the at least one substrate is processed; a substrate transfer chamber configured to transfer the at least one substrate between the load lock chamber and the reaction chamber; a gas supplier configured to supply a gas to the substrate transfer chamber; a gas supply line connecting the gas supplier and the substrate transfer chamber; and at least one heater arranged at least one of the gas supplier, the substrate transfer chamber, and the gas supply line, and configured to heat the gas, wherein, when the reaction chamber and the substrate transfer chamber communicate, at least some of the gas heated by the at least one heater is introduced from the substrate transfer chamber to the reaction chamber, and the at least one heater is further configured to heat the gas before the at least one substrate is introduced to the reaction chamber and before the at least one substrate is discharged from the reaction chamber, wherein the at least one heater comprises: a first heater arranged at the gas supply line; and a second heater arranged at the substrate transfer chamber. 18. the substrate processing system of claim 17 , further comprising a protective cover arranged between the substrate transfer chamber and the load lock chamber and configured to block heat radiated from the at least one heater.	cross-reference to related application this application claims the benefit of korean patent application no. 10-2018-0071696, filed on jun. 21, 2018, in the korean intellectual property office, the disclosure of which is incorporated herein in its entirety by reference. background 1. field one or more embodiments relate to a substrate processing system, and more particularly, to a substrate processing system providing improved productivity. 2. description of the related art during a high-temperature process, a substrate is loaded into a reactor, and then has a substrate temperature stabilization time (preheat time) for a certain period of time. during the substrate temperature stabilization time, a substrate temperature reaches a process temperature, and then stable substrate processing processes, such as deposition, etching, and cleaning, are performed. since a temperature of the substrate is an important process variable in the substrate processing processes, it is important to set a suitable substrate temperature stabilization time. in detail, when the substrate processing processes are performed while the substrate temperature is not stabilized, the substrate processing processes are not smooth and a defect ratio of semiconductor devices increases. for example, when the deposition is not performed at a suitable temperature, it is difficult to deposit a thin film having desired film quality. as such, a substrate temperature stabilization period is required for smooth substrate processing, but on the other hand, productivity per time may be decreased. accordingly, it is important to secure a time period for stabilization of the temperature of the substrate while reducing an effect on the substrate processing so as to improve productivity. summary one or more embodiments include a substrate processing system capable of improving productivity per time while securing stability of processes, by quickly securing a substrate temperature stabilization period for smooth substrate processing. additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments. according to one or more embodiments, a substrate processing system includes: a reaction chamber providing a space where at least one substrate is processed; a substrate transfer chamber configured to supply at least one substrate to the reaction chamber; and at least one heater configured to heat a gas supplied to the substrate transfer chamber, wherein, when the reaction chamber and the substrate transfer chamber communicate with each other, pressure of a gas of the substrate transfer chamber is equal to or higher than pressure of a gas of the reaction chamber. the at least one heater may be arranged at the substrate transfer chamber, and accordingly, a gas inside the substrate transfer chamber may be heated. the substrate processing system may further include a protective cover configured to block heat radiated from the at least one heater. in this case, the protective cover may be arranged between the substrate transfer chamber and the reaction chamber. the substrate processing system may further include a gas supply line connected to the substrate transfer chamber. the at least one heater may be arranged at the gas supply line, and accordingly, a gas passing through the substrate supply line may be heated. the at least one heater may include: a first heater arranged at the gas supply line; and a second heater arranged at the substrate transfer chamber. the first heater and the second heater may be independently heated. a first heating temperature of the first heater may be equal to or higher than a second heating temperature of the second heater. the substrate processing system may further include a substrate transfer unit arranged at the substrate transfer chamber, wherein the substrate transfer unit may include a cooling member. a temperature of the gas heated by the at least one heater may be equal to or higher than an internal temperature of the reaction chamber. when a substrate is introduced from the substrate transfer chamber to the reaction chamber, the temperature of the gas heated by the at least one heater may be higher than the internal temperature of the reaction chamber. the at least one heater may be further configured to heat the gas before a substrate is introduced to the reaction chamber. the at least one heater may be further configured to heat the gas before a substrate is discharged from the reaction chamber. at least some of the gas heated by the at least one heater may be introduced from the substrate transfer chamber to the reaction chamber. according to one or more embodiments, a substrate processing system includes: a first chamber providing a space where at least one substrate is accommodated; a second chamber configured to transfer at least one substrate to the first chamber; and a temperature control unit configured to change a temperature of a gas in the second chamber. the gas having the temperature changed by the temperature control unit may be introduced from the second chamber to the first chamber. the substrate processing system may further include a third chamber providing a space where at least one substrate is accommodated, wherein the temperature control unit may be further configured to, when at least one substrate is moved from the first chamber to the third chamber, change a temperature of a gas in the second chamber to correspond to a temperature condition of the third chamber. according to one or more embodiments, a substrate processing system includes: a load lock chamber configured to accommodate at least one substrate; a reaction chamber providing a space where at least one substrate is processed; a substrate transfer chamber configured to transfer at least one substrate between the load lock chamber and the reaction chamber; a gas supplier configured to supply a gas to the substrate transfer chamber; a gas supply line connecting the gas supplier and the substrate transfer chamber; and at least one heater arranged at at least one of the gas supplier, the substrate transfer chamber, and the gas supply line, and configured to heat the gas, wherein, when the reaction chamber and the substrate transfer chamber communicate, at least some of the gas heated by the at least one heater is introduced from the substrate transfer chamber to the reaction chamber, and the at least one heater is further configured to heat the gas before at least one substrate is introduced to the reaction chamber and before at least one substrate is discharged from the reaction chamber. the substrate processing system may further include a protective cover arranged between the substrate transfer chamber and the load lock chamber and configured to block heat radiated from the at least one heater. brief description of the drawings these and/or other aspects will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which: fig. 1 is a diagram of a substrate processing system according to embodiments of the present disclosure; fig. 2 shows a change in a temperature of a substrate support after a substrate is loaded onto the substrate support; figs. 3 and 4 are cross-sectional views of a substrate processing system according to other embodiments of the present disclosure; and fig. 5 is a flowchart of a substrate processing method according to an embodiment of the present disclosure. detailed description hereinafter, one or more embodiments of the present disclosure are described with reference to accompanying drawings. this disclosure may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those of ordinary skill in the art. the terms used in the present specification are merely used to describe particular embodiments, and are not intended to limit the present disclosure. an expression used in the singular encompasses the expression of the plural, unless it has a clearly different meaning in the context. in the present specification, it is to be understood that the terms such as “including” or “having,” etc., are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to preclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may exist or may be added. as used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. it will be understood that, although the terms ‘first’, ‘second’, etc., may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. these terms do not denote a certain order, top and bottom, or superiority and inferiority, but are only used to distinguish one element, component, region, layer or section from another region, layer or section. thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present disclosure. in the present disclosure, a “gas” may include an evaporated solid and/or a liquid and may consist of a single gas or a mixture of gases. in the present disclosure, a process gas introduced to a reaction chamber through a gas supply unit may include a precursor gas and an additive gas. the precursor gas and the additive gas may be typically introduced into a reaction space as a mixed gas or separately. the precursor gas may be introduced together with a carrier gas, such as an inert gas. the additive gas may include a dilute gas, such as a reactant gas and an inert gas. the reactant gas and the dilute gas may be introduced into a reaction space after being mixed or separately. a precursor may consist of at least two precursors, and the reactant gas may consist of at least two reactant gases. the precursor is chemically adsorbed onto a substrate and is a gas containing a metalloid or a metal element that typically has a main structure of a matrix of a dielectric film. the reactant gas for deposition is a gas reacting with the precursor chemically adsorbed onto the substrate when the gas is excited to anchor an atomic layer or monolayer on the substrate. “chemisorption” denotes chemical saturation absorption. a gas other than the process gas, i.e., a gas introduced without passing through the gas supply unit, may be used to seal the reaction space, and such a gas may include a seal gas, such as an insert gas. according to some embodiments, a “film” denotes a layer continuously extending in a direction perpendicular to a thickness direction without pin holes so as to cover an entire target or a related surface, or a layer simply covering a target or a related surface. according to some embodiments, a “layer” denotes a structure having a certain thickness formed on a surface, a synonym of a film, or a non-film structure. a film or layer may include a discontinuous single film or layer, or multiple films or layers having certain properties, may have clear or unclear boundaries between adjacent films or layers, and may be set based on physical, chemical, and/or other properties, formation processes or sequences, and/or functions or purposes of adjacent films or layers. in the present disclosure, the expression “same material” should be interpreted that main components are the same. for example, when a first layer and a second layer are both a silicon nitride layer and are formed of a same material, a main component of the first layer may be selected from the group consisting of si 2 n, sin, si 3 n 4 , and si 2 n 3 , and a main component of the second layer may also be selected from the group, but a detailed property may be different from that of the first layer. in addition, in the present disclosure, any two variables may constitute an operable range of the variables based on the fact that the operable range may be determined based on routine operations, and a certain indicated range may include or exclude end points. in addition, values of certain indicated variables (regardless of whether the values are indicated by “about”) may denote accurate values or approximate values, may include equivalents, and in some embodiments, may denote an average value, a median value, a representative value, a multiple value, etc. in the present disclosure where conditions and/or structures are not specified, one of ordinary skill in the art may easily provide the conditions and/or structures in the viewpoint of the present disclosure as a matter of routine experiments. in all embodiments, any component used in one embodiment includes those explicitly, necessarily, or essentially disclosed herein for intended purposes, and thus may be replaced by any equivalent component. in addition, the present disclosure may be equally applied to apparatuses and methods. embodiments of the present disclosure are described with reference to drawings schematically illustrating the embodiments. as such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. thus, embodiments of the present disclosure should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. fig. 1 is a diagram of a substrate processing system according to embodiments of the present disclosure. the substrate processing system may include at least one substrate processing apparatus, and in one example, the substrate processing system may denote one substrate processing apparatus. an example of the substrate processing apparatus described in the present specification may include a deposition apparatus of a semiconductor or display substrate, but is not limited thereto. the substrate processing apparatus may be any apparatus required to perform deposition of a material for thin-film formation, or may denote an apparatus to which a raw material for etching or polishing of a material is uniformly supplied. referring to fig. 1 , the substrate processing system may include a first chamber 110 , a second chamber 120 , a gas supplier 130 , a gas supply line 140 , a temperature control unit 150 , and a protective cover 160 . the first chamber 110 may provide a space where at least one substrate s is accommodated. for example, the substrate s may be accommodated in the first chamber 110 , and the substrate s accommodated in the first chamber 110 may be reacted (for example, a chemical reaction for deposition). for example, the first chamber 110 may be a reaction chamber. although fig. 1 illustrates that the first chamber 110 processes one substrate s, the first chamber 110 may be configured to process a plurality of substrates s. for example, when the first chamber 110 is a reaction chamber for performing a deposition process, the first chamber 110 may include a chamber wall where a gate g is arranged, a substrate support c, a heater h, and a gas supply unit d. the substrate s may be led into the chamber wall through the gate g. the heater h may be provided adjacent to the substrate support c to adjust a temperature (for example, heat) of the substrate s and a reaction space. the gas supply unit d may be configured to supply a source gas and/or a reaction gas towards the substrate s located on the substrate support c. the second chamber 120 may be configured to transfer the substrate s to the first chamber 110 . for example, the substrate s is located on a substrate transfer unit included in the second chamber 120 , and the substrate s may be transferred from the second chamber 120 to the first chamber 110 by the substrate transfer unit. the substrate s is processed in the first chamber 110 , and then may be transferred from the first chamber 110 to the second chamber 120 by the substrate transfer unit again. the gate g may be opened or closed for transfer of the substrate s, and at this time, heat energy of the first chamber 110 may be transmitted to the second chamber 120 . such heat transmission may cause decrease of temperature of the reaction space of the first chamber 110 . in this regard, the substrate processing system may further include the gas supplier 130 , the gas supply line 140 , and the temperature control unit 150 so as to prevent the temperature decrease and an additional heating time to compensate for the temperature reduction. the gas supplier 130 may be configured to supply a gas (for example, nitrogen) to the second chamber 120 . the gas supplied by the gas supplier 130 may be transmitted to the second chamber 120 through the gas supply line 140 , and accordingly, the second chamber 120 may be filled with the gas. pressure of the gas filled in the second chamber 120 as such may be equal to or higher than pressure of a gas of the first chamber 110 . for example, the pressure of the gas of the second chamber 120 may be equal to the pressure of the gas of the first chamber 110 , and accordingly, when the first chamber 110 and the second chamber 120 communicate with each other (for example, when the gate g is opened), the gas in the first chamber 110 may be prevented from moving to the second chamber 120 . as another example, the pressure of the gas of the second chamber 120 may be higher than the pressure of the gas of the first chamber 110 , and accordingly, when the first and second chambers 110 and 120 communicate with each other for a substrate exchange between chambers, the gas of the second chamber 120 may be partially introduced to the first chamber 110 . the temperature control unit 150 may be configured to change a temperature of the gas in the second chamber 120 . for example, the temperature control unit 150 may include a heater configured to increase a temperature of the gas in the second chamber 120 . as another example, the temperature control unit 150 may include a cooler configured to lower the temperature of the gas in the second chamber 120 . the temperature control unit 150 may be provided at at least one of the gas supplier 130 , the gas supply line 140 , and the second chamber 120 , and accordingly, the temperature of the gas supplied to the second chamber 120 may be changed. meanwhile, when the pressure of the gas of the second chamber 120 is higher than the pressure of the gas of the first chamber 110 , and the first and second chamber 110 and 120 communicate with each other, a part of the gas of the second chamber 120 may be introduced to the first chamber 110 . according to another embodiment, the substrate processing system may further include a third chamber providing a space where at least one substrate is accommodated. the third chamber may be a reaction chamber or a load lock chamber. according to some embodiments, the temperature control unit 150 may be configured to change the temperature of the gas in the second chamber 120 to correspond to a temperature condition of the third chamber when a substrate moves from the first chamber 110 to the third chamber. for example, when the third chamber requires a temperature condition of a relatively high temperature (for example, 500° c. or higher), the temperature control unit 150 may heat the gas in the third chamber to match the temperature condition. as another example, when the third chamber requires a temperature condition of a relatively low temperature (for example, room temperature), the temperature control unit 150 may cool the gas in the third chamber to match the temperature condition. protective covers 160 a and 160 b may block energy (for example, heat energy) discharged from the temperature control unit 150 . the protective cover 160 may include a material having low heat conductivity. according to another embodiment, the protective cover 160 a may be provided on the temperature control unit 150 such that an operator is not affected by the temperature control unit 150 . according to another embodiment, the protective cover 160 b may be provided between the first chamber 110 and the second chamber 120 such that a temperature change in any one of the first and second chambers 110 and 120 does not affect the other. fig. 2 shows a change in a temperature of the substrate support c (i.e., a temperature of the substrate support c by the heater h) after the substrate s is loaded onto the substrate support c. referring to fig. 2 , at least 140 seconds are consumed for the substrate support c to reach a set temperature of 450° c. and stably maintain the set temperature. however, due to productivity improvement issues or the like, a process is performed on the substrate s mostly after a preheat period of 60 seconds. in this case, as shown in fig. 2 , there is a temperature deviation, and thus initial thin-film formation may not be smooth. in other words, when a gate between a first chamber (for example, a reaction chamber) and a second chamber (for example, a substrate transfer chamber) is opened (i.e., when chambers communicate) for loading/unloading of a substrate, heat inside a heater block and a reactor (generally, a wall of the reactor is heated) shifts to the substrate transfer chamber, and accordingly, a temperature of the heater block is not uniform and stable after the substrate is loaded. according to one or more embodiments of the present disclosure, a gas having a temperature suitably changed through a temperature control unit exists in a second chamber. accordingly, heat loss of a first chamber, which may occur while a substrate is exchanged between the first and second chambers, may be prevented or reduced. consequently, stability of a process may be secured while a time required to preheat the substrate is reduced. fig. 3 is a cross-sectional view of a substrate processing system according to another embodiment of the present disclosure. the substrate processing system according to the current embodiment may be a modified example of the substrate processing system according to the previous embodiment. hereinafter, overlapping descriptions are omitted. referring to fig. 3 , the substrate processing system may include load lock chambers 6 and 7 , a reaction chamber 3 , a substrate transfer chamber 2 , a transport module 8 , a gas supplier 4 , a gas supply line 5 , a substrate storage portion 10 , and a heater 11 . the load lock chambers 6 and 7 may accommodate at least one substrate. the load lock chambers 6 and 7 temporarily store a substrate transferred from the substrate storage portion 10 to be moved to the reaction chamber 3 through the substrate transfer chamber 2 or vice versa. a vacuum pump (not shown) may be connected to the load lock chambers 6 and 7 , and the vacuum pump may be controlled to adjust pressure of the load lock chambers 6 and 7 to be the same as that of the substrate transfer chamber 2 . the load lock chambers 6 and 7 may align the substrate before the substrate is transferred to the reaction chamber 3 . selectively or additionally, the load lock chambers 6 and 7 may cool the substrate that has been processed in the reaction chamber 3 . the reaction chamber 3 may accommodate at least one substrate, and a process may be performed on the substrate in the reaction chamber 3 . the reaction chamber 3 provides at least one reaction space, and fig. 3 illustrates the reaction chamber 3 providing four reaction spaces, as an example. in other words, a plurality of (for example, four) substrates may be loaded and simultaneously processed. for example, substrate processing may include at least one of depositing, etching, and cleaning. each reaction space in the reaction chamber 3 may include a heater block (for example, a substrate support where a heater is installed) where a substrate is loaded and supplying heat to the substrate, and a gas supply unit supplying a process gas to the substrate. the gas supply unit may be a showerhead, or may be a lateral gas flow apparatus. also, a plasma unit activating a supplied gas may be added to perform a plasma process. the reaction chamber 3 may be connected to an exhaust pump (not shown), and accordingly maintain a vacuum state. in addition, as described above, the reaction chamber 3 may include a temperature control unit for controlling a temperature (for example, heating) of an internal space. the substrate transfer chamber 2 may be configured to transfer a substrate between the load lock chambers 6 and 7 and the reaction chamber 3 . in other words, the substrate transfer chamber 2 may load the substrate from the load lock chambers 6 and 7 , or may collect the substrate from the reaction chamber 3 and unload the substrate to the load lock chambers 6 and 7 . the substrate transfer chamber 2 may include a substrate transfer unit (not shown), such as a robot arm. through the substrate transfer unit, the substrate may be transferred to the reaction chamber 3 from the load lock chambers 6 and 7 and the substrate that has been processed in the reaction chamber 3 may be transferred to the load lock chambers 6 and 7 . a gate 9 may be provided between the substrate transfer chamber 2 and the reaction chamber 3 , and between the substrate transfer chamber 2 and the load lock chambers 6 and 7 . the gate 9 may be closed except when a substrate is loaded or unloaded. accordingly, the substrate transfer chamber 2 and the reaction chamber 3 , and the substrate transfer chamber 2 and the load lock chambers 6 and 7 may be isolated from each other except when the substrate is loaded or unloaded. the substrate transfer chamber 2 may be connected to the exhaust pump such that a vacuum state of the substrate transfer chamber 2 is maintained. the transport module 8 is a device that transfers a substrate, such as a semiconductor wafer, from the substrate storage portion 10 , such as a front opening unified pod (foup), to the load lock chambers 6 and 7 , and may be an equipment front end module (efem). the transport module 8 may be located between the substrate storage portion 10 where at least one substrate is stored, and the load lock chambers 6 and 7 . the transport module 8 may include the substrate transfer unit, and a substrate may be exchanged between the substrate storage portion 10 and the load lock chambers 6 and 7 through the substrate transfer unit. the gas supplier 4 may be configured to supply a gas to the substrate transfer chamber 2 . for example, the gas supplier 4 may supply a gas (for example, a nitrogen and/or inert gas) to the substrate transfer chamber 2 through the gas supply line 5 . in this regard, the gas supply line 5 may connect the gas supplier 4 and the substrate transfer chamber 2 . according to another embodiment, a flow controller (not shown) and a valve (not shown) may be installed in the gas supply line 5 . the flow controller and the valve may uniformly maintain the amount of gas supplied (for example, a nitrogen gas) filled in the substrate transfer chamber 2 . a gas (for example, a nitrogen gas) is filled inside the substrate transfer chamber 2 . the filled gas may prevent a gas in the reaction chamber 3 from moving to the substrate transfer chamber 2 when the gate 9 between the reaction chamber 3 and the substrate transfer chamber 2 is opened. a source gas, a reaction gas, or an etching gas supplied over a substrate remains in the reaction chamber 3 , and thus when the substrate moves to the substrate transfer chamber 2 , the above gas also moves to the substrate transfer chamber 2 , thereby corroding or damaging portions of the substrate transfer chamber 2 . accordingly, a gas, such as a nitrogen and/or inert gas, may be filled in the substrate transfer chamber 2 to prevent corrosion or damage from the corrosive gas. in addition, a substrate processing apparatus and a substrate processing system including the substrate processing apparatus, according to one or more embodiments of the present disclosure, may include the temperature control unit 150 for adjusting a temperature of the gas, in particular, the heater 11 . the heater 11 may be provided at at least one of the substrate transfer chamber 2 and the gas supply line 5 . accordingly, a temperature of a gas may be increased by the heater 11 while the gas moves from the gas supply line 5 to the substrate transfer chamber 2 . the heater 11 may heat a gas before a substrate is introduced to the reaction chamber 3 and before the substrate is discharged from the reaction chamber 3 . accordingly, when the reaction chamber 3 and the substrate transfer chamber 2 communicate, a change in a temperature of the reaction space in the reaction chamber 3 may be minimized even when at least some of the gas heated by the heater 11 is introduced from the substrate transfer chamber 2 to the reaction chamber 3 . accordingly, the problem of the loss of a substrate temperature stabilization time due to an exchange of a substrate, and the loss of productivity caused thereby may be solved. fig. 4 is a cross-sectional view of a substrate processing system according to another embodiment of the present disclosure. the substrate processing system according to the current embodiment may be a modified example of the substrate processing system according to the previous embodiment. hereinafter, overlapping descriptions are omitted. referring to fig. 4 , the heater 11 is provided around the substrate transfer chamber 2 and the gas supply line 5 . for example, the heater 11 may be provided at the substrate transfer chamber 2 , and accordingly, a gas in the substrate transfer chamber 2 may be heated. according to another embodiment, the heater 11 may be provided at the gas supply line 5 , and accordingly, a gas passing through the gas supply line 5 may be heated. accordingly, a gas (for example, a nitrogen gas) supplied from the gas supplier 4 supplying a gas may be heated to a certain temperature while passing through the heated gas supply line 5 , and then may be continuously heated by the heater 11 even while being filled in the substrate transfer chamber 2 . in addition, a state in which the substrate transfer chamber 2 and a gas (for example, a nitrogen gas) filled therein are being heated may be maintained. when the reaction chamber 3 and the substrate transfer chamber 2 communicate with each other, pressure of a gas of the substrate transfer chamber 2 may be equal to or higher than pressure of a gas of the reaction chamber 3 . accordingly, the gas (i.e., a remaining gas) of the reaction chamber 3 may not be introduced to the substrate transfer chamber 2 even when the gate 9 , i.e., a valve, between the reaction chamber 3 and the substrate transfer chamber 2 is opened for loading or unloading of a substrate, and loss of heat of the heater block of the reactor provided in the reaction chamber 3 to the substrate transfer chamber 2 may be reduced. according to another embodiment, at least some of a gas heated by the heater 11 may be introduced from the substrate transfer chamber 2 to the reaction chamber 3 . accordingly, heat energy of the heated gas may be transmitted from the substrate transfer chamber 2 to the reaction chamber 3 . according to another embodiment, a temperature of the gas heated by the heater 11 may be equal to or higher than an internal temperature of the reaction chamber 3 . for example, heat energy may be transmitted by a temperature difference even when a gas is not exchanged between the reaction chamber 3 and the substrate transfer chamber 2 . according to an embodiment, when a substrate is introduced from the substrate transfer chamber 2 to the reaction chamber, 3 , a temperature of the gas heated by the heater 11 may be set to be higher than the internal temperature of the reaction chamber 3 . a temperature of the substrate before being processed is relatively low. accordingly, the temperature of the gas heated by the heater 11 may be set to be higher than the internal temperature of the reaction chamber 3 such that a preheat time with respect to the substrate having the relatively low temperature is reduced, and heat energy (or the gas having heat energy) may be transmitted to the reaction chamber 3 from the substrate transfer chamber 2 . according to another embodiment, when a substrate is transferred from the reaction chamber 3 to the substrate transfer chamber 2 , the temperature of the gas heated by the heater 11 may be set to be equal to or lower than the internal temperature of the reaction chamber 3 . during the movement of the substrate, a preheat time in the reaction chamber 3 described above is not required, and the substrate may be moved to the load lock chambers 6 and 7 to be cooled. accordingly, the temperature of the gas heated by the heater 11 may be set to be lower than the internal temperature of the reaction chamber 3 . however, according to another embodiment, the substrate transfer chamber 2 may move the substrate to another reaction chamber (hereinafter, referred to as a second reaction chamber) 12 instead of the load lock chambers 6 and 7 , and in this case, the temperature of the gas heated by the heater 11 may be set to be equal to or higher than an internal temperature of the second reaction chamber 12 , i.e., a temperature of a reaction space during a reaction. according to another embodiment, the heater 11 may be configured to heat a gas before a substrate is introduced to the reaction chamber 3 . also, the heater 11 may be configured to heat the gas before the substrate is discharged from the reaction chamber 3 . as such, by suitably adjusting the temperature of the gas in the substrate transfer chamber 2 before the gate g between the reaction chamber 3 and the substrate transfer chamber 2 is opened, a process may be stably performed and productivity may be increased. in fig. 4 , the gas supply line 5 and the substrate transfer chamber 2 are heated by a single heater 11 , but the gas supply line 5 and the substrate transfer chamber 2 may be independently heated. for example, the heater 11 may include a first heater provided at the gas supply line 5 and a second heater provided at the substrate transfer chamber 2 , and the first and second heaters may be independently heated. according to another embodiment, a first heating temperature of the first heater may be equal to or higher than, or equal to or lower than a second heating temperature of the second heater. a gas may be quickly and efficiently heated through such independent heating of heaters and a temperature gradient configuration. also, in fig. 4 , only a side surface of the substrate transfer chamber 2 is heated, but top and bottom surfaces (not shown) of the substrate transfer chamber 2 may be heated by the heater 11 . also, according to another embodiment, a protective cover having low thermal conductivity may be provided on the heater 11 for safety of an operator. the protective cover may block heat generated by the heater 11 from being externally emitted. the protective cover may be provided not only for the safety of operator, but also to prevent thermal conduction between chambers. for example, the protective cover having low thermal conductivity may be provided between the reaction chamber 3 and the substrate transfer chamber 2 and/or between the load lock chambers 6 and 7 and the substrate transfer chamber 2 so as to prevent thermal conduction between the reaction chamber 3 and the substrate transfer chamber 2 and thermal conduction between the load lock chambers 6 and 7 and the substrate transfer chamber 2 . according to another embodiment, in order to reduce a thermal shock from the heated gas (for example, a nitrogen and/or inert gas) and/or a thermal shock from the heated substrate transfer chamber 2 , a coolant or a cooling member corresponding to the coolant may be supplied to the substrate transfer unit in the substrate transfer chamber 2 . examples of the cooling member for preventing the thermal shock may include an insulation member passively preventing a temperature increase and a cooling unit actively lowering a temperature, but are not limited thereto. according to an embodiment, by heating the substrate transfer chamber 2 and a filling gas supplied thereto, heat loss from the reaction chamber 3 to the substrate transfer chamber 2 may be reduced while loading or unloading a substrate, and a preheat time of the substrate may be reduced, and thus the number of processed substrate per hour may increase. fig. 5 is a flowchart of a substrate processing method according to an embodiment of the present disclosure. the substrate processing method according to the current embodiment may be a modified example using the substrate processing system according to the previous embodiment. hereinafter, overlapping descriptions are omitted. referring to fig. 5 , in operation 510 , a gas is supplied into a first chamber (for example, a transfer chamber). in operation 520 , a temperature of the gas in the first chamber is changed (for example, increased). the supplying of the gas and the changing of the temperature of the gas may take place simultaneously. for example, a gas from a gas supplier may be supplied to the first chamber through a gas supply line, and a temperature of the gas may change while the gas is supplied to the first chamber, by a temperature control unit provided at the gas supply line. in operation 530 , the substrate is transferred from the first chamber to the second chamber (for example, a reaction chamber). the temperature of the substrate may change according to a change in the temperature of the gas supplied to the first chamber, and accordingly, the substrate having the changed temperature may be transferred to the second chamber. according to another embodiment, while the temperature of the gas in the first chamber changes, a temperature of a substrate transfer unit in the first chamber may also change. an additional temperature control unit may be provided in the substrate transfer unit so as to prevent an effect (for example, a thermal shock) of the temperature change on the substrate transfer unit. after the substrate is transferred to the second chamber, the substrate is processed in the second chamber in operation 540 . as described above, a preheat time of the substrate in the second chamber is an important factor determining productivity. according to one or more embodiments of the present disclosure, heat loss that may occur while a substrate is loaded may be reduced, and thus a preheat time at an initial stage of processing the substrate may be reduced. such a preheat for reducing the heat loss may take place before the substrate is introduced to the second chamber, and also before the substrate is discharged from the second chamber, moved back to the first chamber, and then moved to the third chamber. for example, after the substrate is processed in the second chamber, a temperature of a gas in the first chamber is set to change in operation 550 . here, a set temperature of the gas may be determined considering a reaction temperature in the third chamber. for example, operations 540 and 550 may be simultaneously performed. in other words, while the substrate is processed in the second chamber, the temperature of the gas in the first chamber may change. the substrate is transferred from the second chamber back to the first chamber in operation 560 , and then the substrate is transferred from the first chamber to the third chamber in operation 570 . accordingly, the substrate may be additionally processed in the third chamber. at this time, since the temperature of the gas in the first chamber is heated considering the reaction temperature of the third chamber, heat loss that may occur while transferring the substrate from the first chamber to the third chamber may be reduced. accordingly, a preheat time at an initial stage for processing the substrate with respect to various chambers (for example, a plurality of reaction chambers) may be reduced. for example, when a substrate is processed stepwise by being transferred to a plurality of reactors starting from a first chamber, a temperature of a gas filled in the first chamber may be adjusted suitably to a next reactor while the substrate is being processed in a previous reactor to reduce a preheat time in each reactor, thereby improving productivity. it should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. while one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the following claims.
154-200-218-509-020	US	[ "US" ]	A01B63/111,A01B69/02,A01B73/00,A01B73/04,E02F9/22	1996-04-16T00:00:00	1996	[ "A01", "E02" ]	active roadability control for work vehicles	a system for reducing oscillations of an implement carried by a vehicle in a lifted position during travel. the implement is coupled to an implement positioning system including an actuator for raising and lowering the implement in response to a control signal. the system includes at least one load sensor for sensing implement load, a position sensor for sensing implement position, and a control circuit configured to generate a control signal to the actuator in a first manner based at least upon implement position and in a second manner based at least upon implement load. the control circuit transitions from the first manner of operation to the second manner of operation upon detecting oscillations of the implement beyond a predetermined magnitude. the control circuit improves roadability of the vehicle by operating in a roadability mode including the first and second manners of operation wherein the roadability mode is entered based at least upon the implement being in a lifted position and vehicle speed being greater than a predetermined threshold speed.	1. a system for reducing oscillations of an implement carried by a vehicle in a desired neutral lifted position during travel, the implement coupled to an implement positioning system for including an actuator for moving the implement in response to a control signal, the system comprising: at least one sensor configured to generate an oscillation signal representative of sensed oscillation of the implement about the desired neutral position while the implement is in the lifted position during travel; and a control circuit coupled to the at least one sensor, and the actuator, the control circuit configured to generate the control signal for moving the actuator to reduce oscillation of the implement by moving the implement relative to the desired neutral position of the implement. 2. the system of claim 1 wherein the actuator can selectively raise and lower the implement. 3. the system of claim 1 wherein the control signal regulates raising and lowering of the implement by changes in an electrical current. 4. the system of claim 1 wherein the at least one sensor is a draft load sensor for sensing force generated by interaction of the implement with the ground when the implement is in a working position. 5. the system of claim 1 wherein the control circuit includes a programmed microprocessor. 6. the system of claim 1 including: a position sensor configured to generate a position signal representative of implement position; and a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit is configured to operate in a first manner in which the control circuit generates the control signal for moving the actuation based at least upon the position signal and a second manner in which the control circuit generates the control signal for moving the actuator based at least upon the load signal; and wherein, when the control circuit is operating in the first manner, the control circuit generates the control signal based upon a comparison between sensed implement position and a neutral position. 7. the system of claim 6 wherein the control circuit generates the control signal to move the implement to a position within a dead-band surrounding the neutral position. 8. the system of claim 6 wherein the control circuit generates the control signal when the implement position differs from the neutral position by more than a predetermined amount. 9. the system of claim 1 including: a position sensor configured to generate a position signal representation of implement position; and a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit is configured to operate in a first manner in which the control circuit generates the control signal for moving the actuation based at least upon the position signal and a second manner in which the control circuit generates the control signal for moving the actuator based at least upon the load signal; and wherein the control circuit transitions from the first manner to the second manner of operation upon detecting oscillations of the implement beyond a predetermined magnitude. 10. the system of claim 1 wherein the control circuit is configured to generate a weight signal representative of the weight of the implement from output of the at least one sensor. 11. the system of claim 10 including: a position sensor configured to generate a position signal representation of implement position; and a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit is configured to operate in a first manner in which the control circuit generates the control signal for moving the actuation based at least upon the position signal and a second manner in which the control circuit generates the control signal for moving the actuator based at least upon the load signal; and wherein the control circuit determines a load error based upon a difference between the load signal and the implement weight, and wherein transition from the first manner to the second manner of operation is dependent at least upon the load error exceeding a minimum value. 12. the system of claim 1 wherein said at least one sensor includes a first load sensor configured to sense load exerted by the implement on a right side of the implement positioning system and a second load sensor configured to sense load on the left side of the implement positioning system. 13. the system of claim 12 including: a position sensor configured to generate a position signal representation of implement position; and a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit is configured to operate in a first manner in which the control circuit generates the control signal for moving the actuation based at least upon the position signal and a second manner in which the control circuit generates the control signal for moving the actuator based at least upon the load signal; and wherein transition from the first manner to the second manner of operation is dependent at least upon both right and left sensed implement loads increasing or decreasing at the same time. 14. the system of claim 1 including: a position sensor configured to generate a position signal representation of implement position; and a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit is configured to operate in a first manner in which the control circuit generates the control signal for moving the actuation based at least upon the position signal and a second manner in which the control circuit generates the control signal for moving the actuator based at least upon the load signal; and wherein, when the control circuit is operating in the second manner, the control circuit regulates the movement of the implement within a region of a neutral position based upon a magnitude of implement oscillations. 15. the system of claim 1 including: a position sensor configured to generate a position signal representation of implement position; and a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit is configured to operate in a first manner in which the control circuit generates the control signal for moving the actuation based at least upon the position signal and a second manner in which the control circuit generates the control signal for moving the actuator based at least upon the load signal; and wherein, when the control circuit is operating in the second manner, the control circuit limits the control signal to the actuator, thereby limiting the response rate of the actuator. 16. the system of claim 15 wherein the control circuit generates a weight signal representative of the weight of the implement from output of the at least one sensor, and the control circuit limits the control signal using a load error based upon a difference between the sensed implement load and implement weight. 17. the system of claim 16 wherein the control signal is based upon the sensed implement position. 18. the system of claim 1, wherein the at least the one sensor includes at least one load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system, wherein the control circuit generates the control signal for moving the actuator based at least upon the load signal. 19. the system of claim 1, wherein the at least one sensor includes at least one position sensor configured to generate a position signal representative of implement position, wherein the control circuit generates the control signal for moving the actuator based at least upon the position signal. 20. the system of claim 1, wherein the at least one sensor includes: a load sensor configured to generate a load signal representative of load exerted by the implement on the implement positioning system; and a position sensor configured to generate a position signal representative of implement position. 21. the system of claim 20, wherein the control circuit is configured to operate in a first manner to generate the control signal for moving the actuator based at least upon the position signal and a second manner to generate the control signal for moving the actuator based at least upon the load signal. 22. the system of claim 1, including a speed sensor coupled to the control circuit and configured to generate a speed signal representative of the speed of the vehicle, wherein the control circuit generates the control signal in response to the vehicle speed being greater than a predetermined threshold speed. 23. a system for improving roadability of a vehicle system including an implement carried by a vehicle in a lifted position during travel, the implement coupled to an implement positioning system including an actuator capable of vertically moving the implement in response to a control signal, the system comprising: a position sensor configured to generate a position signal representative of the position of the implement; a speed sensor configured to generate a speed signal representative of the speed of the vehicle; and a control circuit coupled to the position sensor, the speed sensor, and the actuator, the control circuit configured to operate in a roadability mode to generate the control signal to reduce oscillations of the implement based at least upon the implement being in the lifted position and vehicle speed being greater than a predetermined threshold speed. 24. the system of claim 23 further comprising an operator adjustable upper limit setting, wherein the lifted position of the implement for the control circuit to enter the roadability mode is in a predetermined relationship with the upper limit setting. 25. the system of claim 23 further comprising at least one load sensor for sensing load exerted by the implement on the implement positioning system, wherein the control circuit in the roadability mode detects oscillations of the implement based upon the sensed implement load. 26. the system of claim 25 wherein the control circuit limits the control signal to the actuator in response to oscillations of the implement. 27. the system of claim 23 further comprising an operator adjustable position command, wherein a further condition for entering roadability mode is the position command being in a predetermined relationship to a fully lifted position, and wherein roadability mode is exited when the position command is not in the predetermined relationship to the fully lifted position. 28. the system of claim 23 further comprising an input device including a working position and a lifting position, wherein a further condition for entering roadability mode is the input device being in the lifting position, and wherein roadability mode is exited when the input device is in the working position. 29. the system of claim 23 further comprising an operator adjustable upper limit setting, wherein a further condition for entering roadability mode is the upper limit setting being in a predetermined relationship to a fully lifted position, and wherein roadability mode is exited when the upper limit setting is not in the predetermined relationship to the fully lifted position. 30. the system of claim 23 wherein the control circuit is further configured to exit roadability mode when vehicle speed decreases below a predetermined value. 31. the system of claim 23 wherein the control circuit includes a programmed microprocessor. 32. a system for improving roadability of a vehicle carrying an implement in a lifted position during travel, the implement coupled to an implement positioning system including an actuator capable of vertically moving the implement in response to a control signal, the system comprising: means for generating a load signal representative of the load exerted by the implement on the implement positioning system; means for generating a speed signal representative of the speed of the vehicle; means for generating a position signal representative of the position of the implement; and control means coupled to the load sensing means, the position sensing means, the speed sensing means and the actuator, the control means configured to generate the control signal for moving the actuator in a first manner and a second manner when the position signal and speed signal indicate that the implement is in a lifted position during travel, wherein the control means generates the control signal in the first manner when oscillations of the implement are not detected and in the second manner when oscillations of the implement are detected. 33. the system of claim 32 wherein the control means moves the implement to a neutral position when operating in the first manner. 34. the system of claim 32 wherein the control means moves the implement within a region of a neutral position using a limited control signal when operating in the second manner. 35. the system of claim 32 wherein a first load sensor senses load exerted by the implement on a right side of the implement positioning system and a second load sensor senses load exerted by the implement on a left side of the implement positioning system, and wherein oscillations of the implement are detected dependent at least upon both right and left sensed implement loads increasing or decreasing at the same time.	field of the invention the present invention relates generally to the field of control systems for agricultural implements. more particularly, the invention relates to a system for reducing oscillations of an implement carried by a vehicle during travel wherein a control signal is generated in a first manner based at least upon implement position and in a second manner based at least upon implement load. background of the invention a number of known control arrangements regulate the position or elevation of implements, such as plows, attached to or drawn by agricultural vehicles. such control systems generally sense the position of a three-point hitch and compare this position to a command or desired position set by an operator. the control system compares the sensed implement position to the command position and generates a control signal to an actuator to vertically move the hitch, along with the implement mounted on it, to the desired elevation. control systems can also operate based on draft force. for example, the control system disclosed in u.s. pat. no. 5,421,416, filed sep. 8, 1993, commonly assigned with the present invention and incorporated herein by reference, controls the position of a ground penetrating implement based at least in part on the draft force encountered when the implement interacts with the ground. agricultural vehicles equipped with known control systems can experience oscillations when the vehicle travels at high speeds across roads or between fields. the vehicle operator commands the implement to a lifted position during travel. at high speeds, the implement can oscillate or bounce due to, for example, bumps or depressions in the road or the field. the interaction of an oscillating implement with the vehicle can cause an uncomfortable ride for the operator and can cause the vehicle's front wheels to leave the road or field surface. severe oscillations can create an undesirable condition in which the implement may approach the road or the field during transport. to compensate for the phenomena of implement oscillations, the operator may reduce the vehicle's intended travel speed. the reduced travel speed lowers the operator's productivity. u.s. pat. no. 4,924,943, filed mar. 24, 1989, discloses a control system for an agricultural vehicle which provides for active damping of implement vibrations which occur when the vehicle travels around a curve with the implement raised. when the vehicle travels around a curve, part of the implement weight normally resting on the draft load force pins is shifted by side guiding members onto the housing of the tractor. this causes the force sensed by the draft load force pins to decrease. at the end of the curve, the sensed force increases as the implement weight is shifted back onto the draft load force pins. the disclosed control system uses active damping based upon a dynamic force signal to reduce the disturbing influence of the side guiding members during turning. summary of the invention the invention features an innovative system for reducing oscillations of an implement carried by a vehicle in a lifted position during travel. in particular, the invention provides improved roadability of a vehicle, such as a tractor, construction vehicle or the like, carrying an implement in a lifted position during travel via a control system which operates in a roadability mode based at least upon the implement being in the lifted position and vehicle speed being greater than a predetermined threshold. the system is applicable to both fully and semi-mounted implements, which may be mounted on the rear or the front of the vehicle. in accordance with a first aspect of the invention, a system is provided for reducing oscillations of an implement carried by a vehicle in a lifted position during travel. the implement is coupled to an implement positioning system including an actuator for vertically moving the implement in response to a control signal. the system includes at least one load sensor for sensing load exerted by the implement on the implement positioning system, a position sensor for sensing position of the implement, and a control circuit coupled to the load sensor, the position sensor and the actuator. the control circuit is configured to operate in a first manner wherein the control circuit generates the control signal for moving the actuator based at least upon sensed implement position and in a second manner wherein the control circuit generates the control signal for moving the actuator based at least upon sensed implement load. in accordance with another feature of the invention, a system is provided for improving roadability of a vehicle system including an implement carried by a vehicle in a lifted position during travel. the implement is coupled to an implement positioning system including an actuator capable of vertically moving the implement in response to a control signal. the system includes a position sensor for sensing position of the implement, a speed sensor for sensing speed of the vehicle, and a control circuit coupled to the position sensor, the speed sensor and the actuator. the control circuit is configured to operate in a roadability mode for reducing oscillations of the implement based at least upon the implement being in the lifted position and vehicle speed being greater than a predetermined threshold speed. in accordance with still another aspect of the invention, a system is provided for improving roadability of a vehicle carrying an implement in a lifted position during travel. the implement is coupled to an implement positioning system including an actuator capable of vertically moving the implement in response to a control signal. the system includes means for sensing load exerted by the implement on the implement positioning system, means for sensing position of the implement, and control means coupled to the load sensing means, the position sensing means, and the actuator. the control means is configured to generate the control signal for moving the actuator in a first manner and a second manner when the sensed implement position and vehicle speed indicate that the implement is in a lifted position during travel. the control means generates the control signal in the first manner when oscillations of the implement are not detected and in the second manner when oscillations of the implement are detected. brief description of the drawings the invention will become more fully understood from the following detailed description, taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like parts, in which: fig. 1 is a diagrammatical representation of a tractor equipped with a control system for positioning an implement in response to a plurality of operating parameters including implement load and position; fig. 2 is a block diagram illustrating certain of the principal circuits included in the controller for the system shown in fig. 1; fig. 3 is a flow chart generally representing typical control logic implementing an implement control approach having a normal mode and a roadability mode of operation; fig. 4 is a flow chart generally representing the conditions used by the control circuit to decide whether to control implement position in the normal mode or the roadability mode; fig. 5 is a flow chart generally representing typical control logic implementing a roadability mode of operation having a non-active state and an active state; fig. 6 is a block diagram generally representing a non-active state of roadability control mode; and fig. 7 is a block diagram generally representing an active state of roadability control mode. detailed description of the preferred embodiment before proceeding to the detailed description of the preferred embodiments, several general comments can be made about the applicability and the scope of the invention. first, while reference is made throughout the following discussion to positional control of an implement mounted to a tractor hitch assembly, it should be understood that the present control system is more generally applicable to implement position control in general. thus, control systems employing the elements recited in the appended claims and used to position an implement other than on a conventional tractor hitch, such as a trailed or towed implement, are equally within the intended scope of the invention. second, while the preferred embodiment described below incorporates a hydraulic system, including valving and a hydraulic actuator for positioning the implement, other types of implement positioning systems could be used where appropriate, such as systems including electrical actuators and the like. turning now to the figures and referring first to fig. 1, a vehicle 10, such as an agricultural tractor, is illustrated diagrammatically as including a body 12 carried by front wheels 14 and rear wheels 16. front wheels 14 are mounted in a conventional manner on an axle 18 and rear wheels 16 are mounted on a rear axle 20 coupled to a differential 22. tractor 10 also includes a power plant or engine 24 coupled through a transmission 26 to differential 22 such that engine 24 may selectively drive rear wheels 16 in a number of forward and reverse gears. tractor 10 typically includes auxiliary systems coupled to engine 24, such as a power take off shaft 28 for driving implements and other detachable equipment. other on-board systems may include front wheel drive gearing and corresponding automatic control, and differential locking components for selectively locking rear and/or front differentials. the tractor is further described in incorporated u.s. pat. no. 5,421,416. a hydraulic system 30 is coupled to engine 24 to provide a source of pressurized fluid for powering various actuators. as illustrated in fig. 1, hydraulic system 30 includes a hydraulic pump 32 piped to a fluid reservoir (not shown) and to valving 34 for regulating and directing pressurized fluid to various hydraulic components. one such component is illustrated in fig. 1 in the form of a linear actuator or double-acting cylinder 36 coupled to a hitch assembly 38. hitch assembly 38 may be a conventional three-point hitch having lower and upper hitch links 40 and 42 for supporting a working implement 44, such as a plow. moreover, valving 34 preferably includes solenoid operated proportional valves for directing a flow of pressurized fluid to actuator 36 for raising and lowering hitch assembly 38 and implement 44 as commanded by an operator or control system as described below, such as to vary the penetration of implement 44 into ground being worked. valving 34 can also be used to raise hitch assembly 38, along with implement 44, to a lifted position wherein the implement is not engaged in a working position with the ground. a lifted position may be commanded by the operator or control system during travel of tractor 10 across a road or between fields. typically, the lifted position corresponds to implement 44 being in a raised position at a distance above the ground to allow implement 44 a range of movement without engaging the ground. the distance is generally sufficient to allow implement 44 to move or bounce in response to influences such as bumps or depressions in the road or field. moreover, a lifted position as referred to herein may situate implement 44 in a location below the fully raised position since, for example, the weight of implement 44 may prevent implement 44 from being fully raised. in general, implement 44 is in a lifted position when not engaged in a working position with the ground, and certain implements may include a wheel or support (not shown) coupled to the implement that remains in contact with the ground while the implement is in a raised position. it should be noted that, while throughout the following description reference is made to an agricultural tractor carrying a fully mounted implement on a rear hitch assembly, the system described herein is not limited to such applications or equipment. for example, the system may find application on other types of equipment, such as construction equipment, and may be employed to improve roadability for both front and rear mounted implements, as well as for both fully and semi-mounted implements. such applications might include loaders carrying buckets, combines carrying headers and the like, wherein roadability tends to be hampered by oscillations of the implement on the vehicle. as illustrated in fig. 1, tractor 10 is equipped with a control system, designated generally by the reference numeral 46 for controlling the position of hitch assembly 38 and implement 44. while control system 46 may include more or fewer of the elements shown in fig. 1, it may typically include brake sensors 48 and 50 coupled to the rear service brakes of tractor 10, speed sensors 52 and 54 coupled to the front and rear axles 18 and 20 respectively, a true ground speed sensor 56 (e.g., a radar-based speed sensor or non-powered wheel speed sensor in a 2-wheel drive tractor), a hitch position sensor 58 and draft load force sensors 60 and 62. control system 46 also includes a control circuit 64 and command devices 66, 68, 70 and 72 (described below) which may be provided on a single or multiple control consoles 74 in the tractor cab (not shown). while draft load force sensors 60 and 62 are preferably conventional draft pins, other sensors may be used to generate signals representative of load, such as accelerometers or pressure transducers (e.g. coupled to cylinder 36 or to another portion of the hydraulic system). moreover, it should be understood that, while sensors 60 and 62 are referred to herein as "draft" sensors, which, when the vehicle is an agricultural tractor, will typically be the same sensors provided for detection of draft force during ground-working operations, on other types of vehicle these sensors may be used to sense other operational parameters, such as loads on a combine header, or may be provided for the sole purpose of improving roadability of the vehicle/implement system. in operation, brake sensors 48 and 50 detect the application of the tractor service brakes and generate braking signals upon application of the brakes. these braking signals are applied to control circuit 64 via conductors 76 and 78 respectively. of course, for control systems employing control routines that do not make use of braking signals, sensors 48 and 50 may be omitted. speed sensors 52 and 54, which may include a variable inductance magnetic pickup, detect the rotational velocity of front wheels 14 and rear wheels 16, respectively, and generate speed signals representative thereof. these speed signals are transmitted to control circuit 64 via conductors 80 and 82. true ground speed sensor 56 is typically a radar device mounted to the body 12 of tractor 10 and configured to emit radar signals toward the ground and to receive a portion of the signals rebounding from the ground to determine the speed of travel of tractor 10. sensor 56 then generates a speed signal representative of the tractor speed and transmits this signal to control circuit 64 via conductor 84. the signals produced by sensors 48 through 56 are used as inputs by control circuit 64 to regulate various functions of tractor 10 in accordance with preset, cyclical control routines. for instance, braking signals from sensors 48 and 50 may be used to control engagement and disengagement of a locking circuit for differential 22. speed signals from sensors 52, 54 and 56 may be used to calculate a driven wheel slip value for use in controlling implement position. moreover, it should be understood that other, additional sensors may be provided on tractor 10 for additional control routines. for example, such sensors might provide signals indicative of engine speed for use in regulating engine throttling or implement position as desired. moreover, it should be understood that the various control functions required for operation of tractor 10, including the implement control functions discussed below, may be executed by a single control circuit 64 or by separate, dedicated control circuits taking as inputs only the parameter signals necessary for their precise function. control of the position of implement 44 is generally based upon information relating to the sensed implement position and draft load force. this information is provided via position sensor 58 and draft load sensors 60 and 62. thus, position sensor 58, which is typically a rotary or linear potentiometer or linear variable differential transformer (lvdt) coupled to a linkage 42 of the tractor hitch assembly 38, detects the position or elevation of implement 44 and generates a position signal representative thereof this position signal is conveyed to control circuit 64 via a conductor 86. draft load sensors 60 and 62, which typically include resistance strain gauges applied to links 40 of hitch assembly 38, generate draft load signals representative of the force exerted on links 40. these draft load signals are transmitted to control circuit 64 via conductors 88 and 90, respectively. thus, control circuit 64 receives signals representative of both the position of implement 44 and either the draft force generated by interaction of implement 44 with the ground or, when implement 44 is in a lifted position, the load exerted by implement 44 on links 40. alternatively, dedicated load sensors separate from draft load force sensors 60 and 62 could be provided on tractor 10 for measuring the load exerted by implement 44 on the right and left sides of the hitch assembly 38. when tractor 10 is stopped and implement 44 is in a lifted position, the load sensed by sensors 60 and 62 is representative of the weight of the implement. during travel of tractor 10 with implement 44 in a lifted position, the load sensed by sensors 60 and 62 is representative of the weight of implement 44 as modified by dynamic forces exerted by implement 44 on the hitch assembly 38, such as forces due to accelerations and oscillations of implement 44. in addition to sensed values of the operating parameters discussed above, control circuit 64 receives command or reference values from command devices 66, 68, 70 and 72, which typically include potentiometers and switches positionable via suitable knobs or handles (not shown). for the purposes of implement position control, command device 66 provides an implement position command signal representative of the desired position of implement 44, and includes a position corresponding to a fully lifted position. command device 68 provides a draft command value representative of the desired level of draft force on implement 44. command device 70 is an operator adjustable upper limit selector for setting the upper limit of implement position. finally, command device 72 is an implement position override switch that includes a working position and a lifting position. other command devices could provide other command inputs for control of various functions of tractor 10, such as a desired level of wheel slip. signals from devices 66, 68, 70 and 72 are applied to control circuit 64 via conductors 92, 94, 96 and 98, respectively. based upon the reference values supplied by command devices 66 through 72 and upon the sensed values from sensors 48 through 62, control circuit 64 generates control signals for raising and lowering implement 44 and applies these control signals to valving 34 via conductor 100 to move actuator 36. certain of the sub-circuits included in control circuit 64 are illustrated diagrammatically in fig. 2. control circuit 64 includes signal conditioning circuits 102, 104 and 106, a memory circuit 108, a signal processing circuit 110, a response signal generating circuit 112 and an output signal interface circuit 114. while these various circuits are illustrated in fig. 2 as separate, interconnected elements, it should be understood that all or some of these circuits may be included in a single integrated circuit and may comprise internal circuitry of an appropriately configured (e.g., programmed) microprocessor. input signals transmitted from sensors to control circuit 64 via conductors 76 through 90 are applied to signal processing circuit 110 through signal conditioning circuit 102, which will typically include an analog-to-digital converter and appropriate isolation, depending upon the type of sensors utilized and the nature of the signals produced. similarly, signals transmitted from command devices to control circuit 64 via conductors 92, 94 and 96 are applied to signal processing circuit 110 via signal conditioning circuit 104, which may be substantially identical to circuit 102 and generally includes an analog-to-digital converter. moreover, circuits 102 and 104 may be a single circuit. circuits 102 and 104 receive the input signals from the sensors and command devices, produce digital signals or values representative of the various input signals and apply these values to signal processing circuit 110. circuit 106 receives command input signals from other command devices, such as from device 72 via conductor 98, which generally produces discrete (e.g., on/off) signals for controlling operation of signal processing circuit 110. circuit 106 typically includes a multiplexer and appropriate isolation, permitting signal processing circuit 110 to select and access signals applied to circuit 106. memory circuit 108 preferably includes both volatile and non-volatile memory, such as random access memory (ram), electronically programmable read only memory (eprom) and electronically erasable programmable read only memory (eeprom), or any other type of memory that can be rewritten, such as flash memory. the volatile memory of circuit 108 is generally used to store various parameter and intermediate values used during the control functions of signal processing circuit 110. non-volatile memory, such as eprom or flash memory, serves to store the cyclic control routine implemented by signal processing circuit 110, while other non-volatile memory, such as eeprom, serves to store the calibration values and failure codes indicative of failure or non-responsiveness of system components. response signal generating circuit 112, which will typically be included in the circuitry of signal processing circuit 110, but is illustrated as a separate circuit here for explanatory purposes, receives values representative of sensed implement position and sensed implement draft or load and generates a response signal to control the movement of implement 44 as described more fully below. this response signal is applied to signal processing circuit 110 to adjust control signals generated by circuit 110. these adjusted control signals, in the form of pulse-width-modulated (pwm) output signals, are applied to output signal interface circuit 114, which includes appropriate valve drivers for energizing the solenoids of valving 34 and thereby to move actuator 36 in the desired direction and at a desired rate. it should be noted that the adjusted control signals produced by circuit 110 could have forms other than pwm signals and, where actuators other than hydraulic cylinders and the like are used for moving the implement, these control signals are, of course, adapted for the particular actuator type used. referring to fig. 3, a flowchart shows that control circuit 64 determines signals representative of implement weight before entering the cyclic control routine for implement position control. to determine these weight signals, tractor 10 must be stopped and hitch assembly 38 must be in a raised position as illustrated at step 120. control circuit 64 generally verifies these conditions by reference to a speed signal from one of the speed sensors 52, 54 or 56 and to a position signal from position sensor 58. when these conditions are met, control circuit 64 detects load signals generated by draft load sensors 60 and 62 and calculates an implement weight signal representative of the weight of implement 44 carried by tractor 10 as shown at step 122. the implement weight signal is generally calculated as the arithmetic sum of the right and left implement weight signals. while the load signals need not normalize or directly measure implement weight, they provide weight signals representative of (e.g., proportional to) the weight of implement 44. once the weight signals are calculated, they are stored in memory circuit 108 and are essentially constant during the operation of tractor 10. after calculating the implement weight signals, control circuit 64 may execute various additional logic as indicated by reference numeral 124 before entering the cyclical control routine illustrated by reference numeral 126. it should be noted that the implement weight signals generated at step 122 could be calculated during a calibration procedure and stored in a non-volatile portion of memory circuit 108, such as eeprom, for later use. alternatively, control circuit 64 could calculate the implement weight signals as part of the cyclical control routine 126 when the conditions at step 120 are met. in addition, if implement weight was known in advance, control circuit 64 could be pre-programmed with the implement weight signals and steps 120 and 122 would be unnecessary. upon entering the cyclical control routine at reference numeral 126, control circuit 64 reads sensors 48 through 62 and command devices 66 through 72 as shown at step 128. although fig. 3 shows these inputs being read together, control circuit 64 may also be configured to read the sensors and command devices as needed by the logic. at step 130, control circuit 64 uses the sensor and command device inputs to decide whether to control the position or elevation of implement 44 in a normal mode 132 or a roadability mode 134. the operation in these modes is described below. alternatively, control system 46 could be equipped with a switch under operator control to select roadability mode. after executing one of these modes, control circuit 64 waits at step 136 for the next cycle of the cyclic control routine 126. in a preferred embodiment, control system 46 includes a timer (not shown) to generate an interrupt at periodic intervals (e.g., 10 msec) to an appropriately configured microprocessor. as shown at step 138, the microprocessor returns from the interrupt at the beginning of the cyclic control routine upstream of step 120. in the normal mode, shown at step 132, control circuit 64 monitors the command or reference values for operational parameters, such as load, position, wheel slip and the like, from command devices 66 and 68. these values are filtered and compared to sensed values from sensors 58, 60 and 62 in accordance with a cyclic control routine. a number of such routines, following a variety of control schemes, are known in the art and do not, in themselves, form part of the present invention. while different manufacturers, may utilize different control routines, depending upon the type and class of vehicle being controlled and upon the parameters governing implement movement, these routines typically generate control signals for moving the implement up or down depending upon the deviation of the sensed values for at least the draft force and the implement position from the reference or command values for those parameters. a routine that generates control signals based upon the deviation of the sensed draft force from the reference draft force implements a draft control mode. moreover, these routines may select the greater of two or more parameter error values or combine two or more parameter error values to generate the implement control signals. however, commonly available systems of this type ultimately generate control signals in the form of pwm signals, the duty cycle of which is proportional to the error signal forming the basis for control. these pwm signals are then applied, through an appropriate valve driver, to the solenoid of a proportional hydraulic valve to raise or lower the implement at a rate proportional to the pwm control signal duty cycle. the rate of response of control system 46 to deviations in the sensed draft force from the reference draft force is adjusted automatically by control system 46. a preferred method of adjusting the response rate is to generate a response signal limit representing the maximum pwm duty cycle of the control signals which may be applied to valving 34 by control circuit 64 and limiting or clipping control output signals to a magnitude equal to or below the limit. because the flow rate of pressurized fluid applied to actuator 36 through valving 34 is proportional to this pwm duty cycle, limiting the duty cycle effectively limits the flow rate of fluid to the actuator, thereby limiting the maximum rate of movement of implement 44. the conditions used by control circuit 64 at step 130 to decide whether to control implement position in normal mode or roadability mode is generally shown in fig. 4. as shown at step 150, control circuit 64 can control the position or elevation of implement 44 in roadability mode only if control system 46 is equipped with load sensors 60 or 62. although roadability mode generally makes use of load sensors, which may serve as draft sensors for vehicles equipped for draft control, roadability mode is differentiated from normal control modes including a draft control mode. draft control mode, described above, is used during the normal mode of operation to control implement position based upon deviations in the sensed draft force from the reference draft force set by command device 68 when implement 44 is in a working position. roadability mode, in contrast, is a separate control mode used to reduce oscillations of an implement in a lifted position during travel. in addition, control circuit 64 is prevented from entering roadability mode, or is required to exit roadability mode, at step 152 if draft load sensors 60 and 62 are both faulty (or if the only draft load sensor in a single sensor system is faulty), or if other system faults prevent the operation of roadability mode (e.g., a faulty position sensor 58). if control system 46 is not equipped for roadability mode, or if any fault preventing operation in roadability mode occurs, control circuit 64 controls implement position in normal mode 132. if control system 46 is equipped with draft load sensors 60 or 62, and there are no system faults preventing operation in roadability mode, control circuit 64 determines if the control system is already operating in roadability mode at step 154. if not, control circuit 64 checks at step 156 whether roadability mode should be enabled based at least upon implement 44 being in a lifted position and the speed of tractor 10 being greater than a predetermined threshold speed. in a preferred embodiment, control circuit 64 requires actual implement position to be in a predetermined relationship with the upper limit set by command device 70, such as within close range to the upper limit, and preferably within 2% of the upper limit (measured over the total travel range of the implement), with the upper limit set at a maximum raised position. if this condition cannot be met, the system is disabled from entering into the roadability mode of operation. the predetermined threshold speed of tractor 10 is a speed at which implement oscillations become troublesome. this speed can be set and stored in a variety of ways. for example, the threshold speed may be set depending upon the type and class of vehicle being controlled, upon the results of a calibration procedure or upon a command from the operator. the predetermined threshold speed could also be set as a function of other control parameters. the threshold speed could also be pre-programmed at a constant value such as 10 mph or approximately 16 kph. the threshold speed may be stored in ram, eprom or eeprom within memory circuit 108, or may be stored in any other memory available to control circuit 64 (e.g., an internal microprocessor register). if control system 46 is already operating in roadability mode, control circuit 64 is configured to exit roadability mode (in addition to exiting roadability mode upon various failure conditions at step 152) if the speed of tractor 10 decreases below a predetermined value as shown at step 158. the predetermined value can be set to the threshold speed for entering roadability mode less a hysteresis value, such as 10 mph for entering roadability mode and 9 mph for exiting. moreover, although control circuit 64 enters roadability mode only when implement 44 is in a lifted position, control circuit 64 does not exit roadability mode based upon implement position. this non-symmetry prevents control circuit 64 from erroneously exiting roadability mode as implement 44 oscillates so that implement position is no longer in the predetermined relationship with the upper limit set by command device 70 (e.g., implement position becomes less than 2% below the upper limit). instead, control circuit 64 remains in roadability mode as implement 44 oscillates in order to provide roadability control as explained in detail below. as shown at step 160, control circuit 64 can require the presence of other conditions before entering roadability mode. for example, in a presently preferred embodiment, control circuit 64 requires that the implement position command from command device 66 be in a predetermined relationship to a fully lifted position of implement 44, such as a position command corresponding to a maximum lifted position. in addition, control circuit 64 requires that the implement position override from command device 72 be in the lifting position. moreover, control circuit 64 requires that the upper limit setting from command device 70 be in a predetermined relationship to a fully lifted position of implement 44 to insure that implement 44 remains above the ground during travel. the predetermined relationship could be an upper limit corresponding substantially to a maximum lifted position, or an upper limit within 10% of the maximum lifted position. requiring an upper limit near maximum to enable roadability prevents an operator from inadvertently allowing implement 44 to penetrate the ground during travel by insuring that implement 44 has adequate ground clearance. control circuit 64 could also require any combination of these conditions in order to enter roadability mode. the absence or change of any condition used to enter roadability mode (other than implement position as mentioned above) can also cause control circuit 64 to exit roadability mode. in the embodiment described above, control circuit 64 exits roadability mode if the implement position command from command device 66 no longer bears the predetermined relationship to a fully lifted position of implement 44, or if the implement position override from command device 72 changes to the working position, or if the upper limit setting from command device 70 no longer bears the predetermined relationship to a fully lifted position of implement 44. referring to fig. 5, control circuit 64 can operate in a first manner and a second manner when in the roadability mode of step 134. the first manner of operation is a non-active state 184 wherein control circuit 64 generates control signals applied to valving 34 via conductor 100 to move actuator 36 based at least upon sensed implement position. the second manner of operation is an active state 186 wherein control circuit 64 generates control signals based at least upon sensed implement load. the non-active state 184 is the main state from which control circuit 64 occasionally transitions to the active state 186 and then, when action is complete, transitions back to the non-active state. control circuit 64 transitions from the non-active state 184 to the active state 186 of roadability mode upon detecting oscillations of implement 44 beyond a predetermined magnitude at step 182. however, control circuit 64 calculates several intermediate parameters at step 180 before checking for implement oscillations. although fig. 5 shows the intermediate calculations as part of roadability mode, control circuit 64 can also calculate these values outside of roadability mode. the first intermediate parameter is total draft load error calculated as the difference between the total draft load (i.e., the arithmetic sum of the right and left draft load signals read at step 128) and total implement weight calculated at step 122. the next intermediate parameters represent the change in right and left draft load over time (i.e., derivatives) calculated as the difference between successive measurements of the right draft load sensor and the left draft load sensor, respectively, as control circuit 64 executes cyclical control routine 126. after calculating the intermediate parameters at step 180, control circuit 64 determines if implement 44 is oscillating beyond a predetermined magnitude based upon two conditions at step 182. the first condition is that total draft load error exceeds a minimum value. the minimum value is set high enough to avoid transition into active mode due to normal acceleration forces exerted by implement 44 on hitch assembly 38 during travel, but low enough so that, once oscillations of implement 44 reach a predetermined magnitude, total draft load error exceeds the minimum value. in a single draft load pin system, the minimum value compared to the total draft load error is different. the second condition for detecting excessive oscillations of implement 44 is that both right and left draft loads be increasing or decreasing at the same time (i.e., both the right and left draft derivative signals are positive or negative). this condition avoids erroneous transition into active state 186 due to travel around curves. if implement 44 is not oscillating when tractor 10 travels around a curve, the force exerted by implement 44 on hitch assembly 38 may increase on one side of tractor 10 and decrease on the other side. requiring that both right and left draft loads be increasing or decreasing at the same time prevents false triggering of the active state. however, if implement 44 oscillates due to, for example, bumps or depressions in the road or field, both the right and left draft loads may increase or decrease at the same time. this may occur during travel in a straight line, and may also occur during travel around a curve if the oscillations are severe enough to counteract forces due to the curve alone. in a single draft load pin system, the second condition may be satisfied automatically since a single draft load always changes in the same direction. step 182 may also include additional logic to avoid erroneous transition out of active state 186 due to changes in the draft load signals over a complete oscillation cycle. the additional logic may include filtering the draft load signals or applying a time delay before exiting active state 186 when the conditions for entering it are no longer met. the operation of control circuit 64 in the non-active state of roadability mode is described in relation to fig. 6. generally, control circuit 64 generates control signals applied to valving 34 via conductor 100 to move actuator 36 based upon a comparison between sensed implement position and a neutral position. in particular, control circuit 64 commands implement 44 to a position within a zone or dead-band region of the neutral position. the position of implement 44 is converted into a position error at block 200 using the following equations: if (pos>upper.sub.-- limit), then pos.sub.-- error=pos-upper.sub.-- limit; if (pos<lower.sub.-- limit), then pos.sub.-- error=lower.sub.-- limit-pos; where "pos" is sensed implement position, "upper.sub.-- limit" is the limit value set by manipulation of command device 70, and "lower.sub.-- limit," preferably set at a predetermined distance below the upper limit, such as 8 degrees below the upper limit. alternatively, the position error value may be calculated based upon a neutral implement position and a deadband, such as of 3 degrees on either side of the neutral. for example, control circuit 64 can be configured to generate a control signal and apply the signal to valving 34 only when the implement position differs from the neutral position by more than a predetermined amount (e.g., control circuit 64 outputs no current to valving 34 when implement position is within the dead-band of the neutral position). the above equations result in setting the term "pos.sub.-- error" to the absolute value of the difference between "pos" and the upper and lower limit positions. the position error is regulated at block 202 to form a command to actuator valve 34 such as a current command. while various transfer functions may be envisioned for block 202, in the presently preferred embodiment, block 202 is applies a linear gain to the position error. the command results in implement 44 moving towards the neutral position since implement 44 is lowered when the first equation is true, and implement 44 is raised when the second equation is true. under all conditions of roadability mode, hitch assembly 38 is not commanded to move outside a zone between the maximum upper limit and a lower limit ("lower.sub.-- limit") below the upper limit. if the implement command is below the lower limit, the output command to valving 34 is stopped. the operation of control circuit 64 in the active state 186 of roadability mode is described in relation to fig. 7. generally, in active state 186, control circuit 64 regulates the movement of implement 44 within a region of a neutral position based upon the magnitude of implement oscillations and rate limits the output control signals to limit such oscillations. in particular, control circuit 64 commands implement 44 to a position within a lower limit and an upper limit by calculating a position error at block 220 using the following equations: for raise: pos.sub.-- error=upper.sub.-- limit-pos; for lower: pos.sub.-- error=pos-lower.sub.- limit; where "pos.sub.-- error", "pos", "upper.sub.-- limit" and "lower.sub.-- limit" are defined above. a regulator 222 converts position error to a control signal such as a current command using a control algorithm such as a multiplication gain function. the current command is rate limited or clipped at block 224 to form a limited current command applied to actuator valve 34. the current limit for rate limit 224 is calculated as a function of position error and total draft error at block 226. block 226 is a logic engine which may be implemented in a number of ways. in the presently preferred embodiment, block 226 calls upon a look-up table relating error to a current limit. alternatively, however, techniques for generating a current limit value may implement other preset algorithms or may be based on a fuzzy logic approach. such logic typically includes membership functions for classifying and assigning values to input parameters, fuzzy logic rules for converting the parameters to output values, and de-fuzzification membership functions for converting the output values to an output signal. various control design packages are available to permit the establishment of effective membership functions and fuzzy logic rules without undue experimentation. such functions may, by way of example, classify the implement into weight classes and categorize the magnitude of draft error and position error. alternatively, conventional means may be used to set a control signal output limit, such as an operator adjustable potentiometer. moreover, where system simplification is desirable, a fixed output limit may be provided through the control routine stored in memory circuit 108. by limiting the maximum current supplied to actuator valve 34, control circuit 64 limits the maximum rate of movement of hitch assembly 38 and allows control circuit 64 to reduce oscillations of implement 44 by damping the response of implement 44 to the oscillations. while the embodiments illustrated in the figures and described above are presently preferred, it should be understood that these embodiments are offered by way of example only. the invention is not intended to be limited to any particular embodiment, but is intended to extend to various modifications that nevertheless fall within the scope of the appended claims. for example, the various flow charts and block diagrams only generally represent the steps and blocks used in the present invention. different implementations of hardware and software that fall within the scope of the appended claims would be apparent to a person of skill in the art.
154-361-002-422-302	US	[ "EP", "JP", "KR", "US", "CN" ]	C03C25/12,B08B3/02,B01D19/00,B08B3/08,C02F1/20,C02F1/46,C03C25/10,C03B37/00,D04H1/14,C03B37/07,B05D7/00,C03C25/26,C02F1/66	2005-03-03T00:00:00	2005	[ "C03", "B08", "B01", "C02", "D04", "B05" ]	method for reducing corrosion	a method for reducing corrosion of a wash water system for fiber glass forming lines, by using a corrosion meter, is provided. also provided is a fiberglass manufacturing process that utilizes the method.	a method for reducing corrosion in a fiberglass manufacturing process, said method comprising: (a) providing a glass fiber binding system comprising a feed stream comprising a polymeric binder, water, and a mineral acid, wherein said binder comprises at least one of a polyacrylic acid polymer or copolymer, and wherein the ph of said feed stream is less than 4; (b) spraying said feed stream onto glass fibers in a forming chamber; (c) providing a wash water system comprising at least one wash water process line, wherein said wash water system receives recycled water from said forming chamber through said wash water process line; (d) collecting said wash water in at least one wash water collection container; (e) positioning a corrosion meter probe to measure the rate of corrosion in at least one of a wash water line leading to said wash water collection container, a wash water line leading from said wash water collection container, or the inside of said wash water collection container; and (f) providing a first controller that adds a base to said wash water when said corrosion meter probe detects a corrosion rate above a corrosion meter setpoint, wherein said base is added at one or more points along at least one of said wash water lines, or in said wash water collection container, or both. the method, according to claim 1, wherein said corrosion meter setpoint is 10 mils/year. the method, according to claim 1, wherein said corrosion meter setpoint is 4 mils/year. the method, according to claim 1, wherein said corrosion meter setpoint is 2 mil/year. the method, according to claim 1, wherein said method further includes the steps of: (a) providing at least one second controller, and using said second controller to control the flowrate of said base to said feed stream to a flowrate setpoint; (b) using said first controller to adjust the setpoint of said second controller when said corrosion meter probe detects a corrosion rate exceeding said corrosion meter setpoint. the method, according to claim 1 or claim 5, wherein said method further comprises the step of providing at least one metal sacrificial anode. the method, according to claim 1 or claim 5, wherein said method further comprises the step of adding a zinc compound to the wash water. the method, according to claim 1 or claim 5, wherein said method further comprises the step of deoxygenating the wash water. the method, according to claim 6, wherein said sacrificial anode is made of a metal selected from the group consisting of zinc, magnesium and aluminum. a fiberglass manufacturing process comprising: (a) a glass fiber binding system comprising a feed stream comprising a polymeric binder, water, and a mineral acid, wherein said binder comprises at least one of a polyacrylic acid polymer or copolymer, and wherein the ph of said feed stream is less than 4; (b) a forming chamber for spraying said feed stream onto glass fibers; (c) a wash water system comprising at least one wash water process line, wherein said wash water system receives recycled water from said forming chamber through said wash water process line; (d) at least one wash water collection container for collecting said wash water; (e) at least one corrosion meter probe for measuring the rate of corrosion in at least one of a wash water line leading to said wash water collection container, a wash water line leading from said wash water collection container, or the inside of said wash water collection container; and (f) a first controller that adds a base to said recirculating water when said corrosion meter probe detects a corrosion rate above a corrosion meter setpoint, wherein said base is added at one or more points along at least one of said wash water lines, or in said wash water collection container, or both. the fiberglass manufacturing process according to claim 10, wherein said process further comprises at least one second controller for controlling the flowrate of said base to said feed stream to a flowrate setpoint, and wherein said first controller is used to adjust the setpoint of said second controller when said corrosion meter probe detects a corrosion rate exceeding said corrosion meter setpoint. the fiberglass manufacturing process according to claim 10 or claim 11, wherein said process further comprises at least one metal sacrificial anode.	background of the invention this invention relates to a method for reducing corrosion of a wash water system for glass forming lines, by using a corrosion meter, as well as fiber manufacturing processes utilizing the method. brief summary of the invention in the fiberglass industry, a dilute binder solution is sprayed onto molten glass fibers in a fiberglass mat forming area. the excess sprayed binder solution that did not attach to the glass fibers, as well as glass fibers coated with the binder, collect on the internal surfaces of the fiberglass mat forming area. this excess binder and glass fibers are rinsed away with wash water, and directed to a recirculation system for recycling. the sprayed glass fibers are transported from the fiberglass mat forming area by a chainbelt. excess binder and coated glass fibers also collect on the chainbelt, and must be washed off from the chainbelt after the fiberglass mat leaves the forming section. the wash water used to wash off the chainbelt is also collected and recirculated. a small portion of the recirculated wash water is recycled back into the binder feed, for the purpose of diluting the binder. the use of the wash water system helps to prevent equipment damage and blockage due to the buildup of the glass fibers, and binder which contains corrosive materials, thereby limiting the amount of downtime associated with equipment cleaning, repair and replacement. polycarboxylic acid-based fiberglass binder resins are often used in the glass industry for various applications, including for example, insulation, ceiling tiles, and other architectural products. these type of binders provide products having strong mechanical properties, decreased reliance on environmental control equipment, as well as other benefits. one problem commonly associated with currently available wash water systems is that the polycarboxylic acid binder, and hence the wash water used to wash off the binder, becomes acidic as the number of cycles of removing binder increases. this acidic wash water can corrode the process equipment, including the wash water equipment, which is typically made of carbon steel, thereby limiting the equipment's useful life. this results in added manufacturing costs due to equipment replacement and downtime. there have been a variety of attempts to address this corrosion problem. for example, others have replaced carbon steel in the forming and wash water equipment with stainless steel. however stainless steel equipment is expensive relative to equipment made of carbon steel. another proposed solution has been to decrease the amount of cycles that the wash water is introduced through the forming equipment. however, this also leads to increased costs in terms of water usage and wastewater removal. u.s. patent application publication no. 2003/0221457 discloses a method of reducing acid corrosion of the surfaces of equipment used to form fiberglass insulation, by using a closed loop wash water system, and controlling the wash water ph by automatically adding base to the wash water when a ph probe in the wash water tank registers a wash water ph of below 8.0. this is not a particularly effective means for corrosion reduction, in part because it does not take into consideration the fact that corrosiveness of the wash water is not due solely to the presence of acid, and thus the ph of the wash water. therefore, there remains a need for an effective method for reducing corrosion in the forming and wash water equipment of a glass fiber manufacturing process. applicants have found that by using a control system that utilizes a corrosion meter-based controller, it is possible to reduce the corrosion of such forming and wash water equipment. detailed description of the invention a first aspect of this invention is a method for reducing corrosion in a fiberglass manufacturing process, said method comprising: (a) providing a glass fiber binding system comprising a feed stream comprising a polymeric binder, water, and a strong acid, wherein said binder comprises at least one of a polyacrylic acid polymer or copolymer, and wherein the ph of said feed stream is less than 4; (b) spraying said feed stream onto glass fibers in a forming chamber; (c) providing a wash water system comprising at least one wash water process line, wherein said wash water system receives recycled water from said forming chamber through said wash water process line; (d) collecting said wash water in at least one wash water collection container; (e) positioning a corrosion meter probe to measure the rate of corrosion in at least one of a wash water line leading to said wash water collection container, a wash water line leading from said wash water collection container, or the inside of said wash water collection container; and (f) providing a first controller that adds a base to said wash water when said corrosion meter probe detects a corrosion rate above a corrosion meter setpoint, wherein said base is added at one or more points along at least one of said wash water lines, or in said wash water collection container, or both. a second aspect of this invention is a fiberglass manufacturing process comprising: (a) a glass fiber binding system comprising a feed stream comprising a polymeric binder, water, and a strong acid, wherein said binder comprises at least one of a polyacrylic acid polymer or copolymer, and wherein the ph of said feed stream is less than 4; (b) a forming chamber for spraying said feed stream onto glass fibers; (c) a wash water system comprising at least one wash water process line, wherein said wash water system receives recycled water from said forming chamber through said wash water process line; (d) at least one wash water collection container for collecting said wash water; (e) at least one corrosion meter probe for measuring the rate of corrosion in at least one of a wash water line leading to said wash water collection container, a wash water line leading from said wash water collection container, or the inside of said wash water collection container; and (f) a first controller that adds a base to said recirculating water when said corrosion meter probe detects a corrosion rate above a corrosion meter setpoint, wherein said base is added at one or more points along at least one of said wash water lines, or in said wash water collection container, or both. this invention is directed, among other things, toward the prevention, or reduction, of corrosion in the process equipment of a fiberglass manufacturing process, particularly the process equipment in which wash water is utilized. this is accomplished by using a controller to add base to the wash water when a corrosion meter probe, in contact with the wash water, detects a corrosion rate above a corrosion meter setpoint. this method is particularly effective in that it is not limited to any single source of corrosion, thus it provides corrosion reduction regardless of the source of the corrosion, or the presence of factors influencing the rate of corrosion, such as, for example, the overall chemistry of the wash water, the flowrate or degree of turbulence in the process equipment, oxygen content of the wash water, presence of foreign matter, biological matter, oxidizing biocides, or dissolved salts in the wash water, metal content in the wash water, and amount of binder in the wash water, among others. the invention includes a glass fiber binding system that contains a feed stream. the feed stream contains a polymeric binder, water and a strong acid, and may contain other materials commonly used with fiberglass binders. the polymeric binder may be any binder suitable for binding glass fibers, including, binders based on polyacrylic acid polymers and copolymers. by "polyacrylic acid copolymers" is meant herein, copolymers containing as copolymerized units acrylic acid, and at least one other co-monomer. the binder may include, in its formulation, a strong acid, as described below. examples of suitable binders are described, for example, in u.s. patent no. 5,661,213, u.s. patent application no. 11/053,799, and u.s. patent application publication no. 2005-0038193, all of which are herein incorporated by reference. the strong acid may be a mineral acid, such as, for example, sulfuric acid, or an organic acid, such as, for example sulfonic acid. mineral acids are preferred. the ph of the feed stream is maintained at less than 4, preferably less than 3.5, more preferably less than 3. the strong acid may be present in the binder formulation prior to feeding the binder to the feed stream. alternatively, the strong acid may be fed to the feed stream, in which case the flowrate of the strong acid directed to the feed stream is controlled so that the ph of the feed stream is maintained at the levels described above. the strong acid may be added continuously to the diluted binder immediately prior to, or simultaneous with spraying of the feed stream onto the glass fibers. preferably, a ph meter is used in conjunction with a controller to maintain the low ph of the feed stream. such low ph's are preferred, as they provide for improved curing of the binder during subsequent processing steps. the addition of the strong acid enables not only reduction of the high ph of the binder, but also eliminates any undesirable alkalinity coming from the wash water. it is known that the presence of some ions, especially sodium ions and calcium ions, inhibits the desired binder crosslinking which normally occurs in the downstream cure processing. the use of neutralized wash water for binder dilution may result in the presence of a high level of undesirable ions. one way to avoid this problem is to use fresh water, softened water, or deionized water for binder dilution. however, this generally results in an environmentally-undesirable aqueous waste stream. an alternative solution is to split the wash water system into two completely separate systems. the first system, which utilizes neutralized wash water, can be constructed of materials that are susceptible to corrosion, such as carbon steel. this first system cannot be used for binder dilution purposes. the second system, which utilized non-neutralized process water, can be constructed from expensive, corrosion resistant materials, such as stainless steel. this second system can be used for binder dilution without introducing undesirable ions. disadvantages of this approach include the high cost of the corrosion resistant materials for the second system, as well as the complexity of operating multiple wash water systems. the present invention eliminates these disadvantages. the addition of the strong acid to the process stream causes displacement of metal ions which have become attached to the binder molecules in the recirculated wash water, making that binder sufficiently reactive for effective curing, without the need to either resort to corrosion-resistant construction, or exclusive use of fresh water or non-neutralized recycled wash water for binder dilution. the feed stream is sprayed onto the glass fibers in at least one forming chamber. by "forming chamber" is meant herein, an at least partially enclosed area in which glass fibers are sprayed with the feed stream. not all of the feed stream will be deposited on the glass fibers. the sprayed feed stream not deposited on the glass fibers, the excess feed stream, may land on the internal surfaces of the forming chamber. this excess feed stream, along with glass fibers sticking to the forming chamber walls, may be removed from the forming chamber walls by means of spraying with wash water. the invention includes a wash water system which may be used for this purpose. the wash water system may also be used to remove excess feed stream from other pieces of process equipment, such as, for example, suction boxes, chainbelts, and the like. the wash water system contains at least one wash water process line, which receives wash water, including recycled wash water, from the forming chamber, and optionally from other process equipment, as described above. by "wash water process line" is meant herein piping which is suitable for transporting the wash water. the wash water from the wash water process line is collected in at least one wash water collection container. the wash water collection container may be any vessel, tank, or other container, whether fully enclosed or not, which is capable of holding at least a portion of the wash water. the wash water may be recycled into a wash water process line that is used for washing the internal surface of the forming chamber. the same, or at least one different wash water process line, may be used to recycle wash water used for washing the feed stream from other process equipment. the wash water may also be recycled into the feed stream, for purposes of diluting the binder, before, after, or simultaneous with addition of the strong acid to the feed stream. the corrosion rate of equipment in the wash water system is monitored by at least one corrosion meter, having at least one probe. preferably, the probe of the corrosion meter is positioned in a wash water process line leading from the wash water collection container, more preferably, it is located in a wash water process line leading to the wash water collection container. alternatively, the corrosion meter probe may be positioned inside the wash water collection container, in contact with the wash water. preferably, the probe is positioned where the highest degree of corrosion is expected, such as for example, in areas of high flow, or high turbulence. the corrosion meter probe may be any probe capable of measuring the rate of corrosion in the process equipment. suitable probes are well known, and include, for example, electrical resistance monitoring probes, linear polarization resistance monitoring probes, and the like. electrical resistance monitoring probes measure the change in electrical resistance of a metallic element immersed in the liquid process stream, relative to a reference element in the probe. linear polarization resistance monitoring probes measure the amount of internally applied current needed to change the corrosion potential of a freely corroding specimen by a few millivolts (usually 5 to 20mv). where a linear polarization resistance monitoring probe is utilized, those having the 2- or 3- electrode configuration are preferred. corrosion meters suitable for the present invention can be obtained from a variety of vendors, such as, for example rohrback cosasco systems (santa fe springs, california), and intercorr international (houston, texas). the corrosion meter probe is preferably permanently installed in the wash water system, allowing for continuous corrosion rate monitoring. alternatively, a portable corrosion meter probe may be used for gathering periodic corrosion rate data from one or more locations in the wash water system, however this approach is not preferred, as it does not allow for rapid identification, and correction of corrosion problems. the use of corrosion meter probes enables the rapid identification of corrosion upsets, thereby enabling swift initiation of remedial action. the use of such probes is therefore useful for at least one of prolonging the life of the manufacturing process, minimizing unscheduled downtime, minimizing the amount of base added to the feed stream, and diminishing the need for expensive stainless steel equipment. at least one base is added to the wash water when a corrosion rate exceeding a predetermined value is detected by the corrosion meter probe. preferably, the corrosion meter probe periodically, or continuously, sends a signal to a first controller, which initiates introduction of base to the wash water when the probe detects a corrosion rate exceeding a corrosion meter setpoint. the amount of corrosion reduction achievable for a given system will be dependent upon the chemistry of the feed stream and the wash water. therefore, the setpoint may be selected based on testing to determine what corrosion reduction is achievable for the specific chemistry of the feed stream and the wash water for the particular system. preferably, base is introduced when the corrosion meter probe detects a corrosion rate of greater than 15 mils/year, more preferably greater than 10 mils/year, even more preferably greater than 4 mils/year, yet more preferably greater than 4 mils/year, and still more preferably greater than 1 mil/year. however, higher rates of corrosion may be acceptable in some cases, therefore, the invention applies to any setpoint that may be selected by the user. as noted above, a base is added to the wash water when the corrosion rate exceeds a predetermined value. by "base" is meant, any material suitable for neutralizing the feed stream, to the extent necessary for the corrosion rate to be maintained within the predetermined acceptable levels. suitable bases include, but are not limited to strong and/or weak bases, such as, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, t-butylammonium hydroxide, ammonia, lower alkyl amines, and the like. the base may be added at one or more points along at least one of the wash water lines. preferably, the base is added to at least one washwater line leading from the wash water collection container. alternatively, it may be added to at least one washwater line leading to the wash water collection container, or to the washwater inside the wash water collection container. in one non-limiting and optional embodiment of this invention, the corrosion rate controller is used in conjunction with at least one second controller. the second controller preferably controls the flowrate of the base so that the amount of base added is sufficient to neutralize the acid in the feed stream. the flowrate setpoint of the controller is preferably based on the following algorithm: where, and where r = a number equal to or greater than: for any given process, 'b', and thus ratio 'r', can be determined by titrating a sample of wash water with a base until an equivalence point is reached. by "equivalence point" is meant herein the point at which all of the acid is neutralized. in this embodiment of the invention, the second controller receives a signal from the first controller when the corrosion meter probe detects a corrosion rate exceeding the corrosion meter setpoint. the signal from the first controller instructs the second controller to adjust the flowrate setpoint, thereby requiring the addition of sufficient additional base to reduce the corrosion rate below the corrosion meter setpoint. in a different, non-limiting and optional embodiment of the invention, corrosion is further reduced by use of metal sacrificial anodes. the anodes may be made of any metal suitable for reducing corrosion of the wash water system equipment, such as for example metals that will go into a multivalent state in aqueous solution, and have a higher electrochemical activity than iron or steel, including for example, magnesium, zinc, aluminum, and the like. zinc sacrificial anodes are preferred. the anodes may be placed anywhere (in one or more locations) in the wash water system where they will be constantly wetted. for example, they may be placed in the suction box beneath the chainbelt, or in any other suitable location. preferably, the sacrificial anodes are bolted to the process equipment. the sacrificial anodes are particularly useful for equipment which tends to be exposed to low ph, and which is not typically washed with wash water. the sacrificial anodes, which are electrically coupled to the equipment steel, will generate a galvanic potential which causes the steel equipment to resist corrosion, and thus aids in the reduction of the corrosion rate. the sacrificial anode provides corrosion reduction within the area surrounding the sacrificial anode. an additional benefit of use of the sacrificial anode is that metal dissolved from the anode reduces the corrosivity of the wash water in areas not in the immediate vicinity of the anode. the reduction of corrosion of the wash water may also be obtained by addition of a zinc compound to the wash water, whether or not the system uses sacrificial anodes. suitable zinc compounds include for example, zinc metal, zinc oxide, zinc hydroxide, zinc salts, and the like. in yet another embodiment of this invention, the steel equipment may be coated with zinc by hot dip galvanizing the steel. fig.1 illustrates a fiberglass manufacturing process according to one preferred, but optional embodiment of this invention. in this embodiment, molten glass is prepared in a glass melter (1a), and then formed into fibers by a fiberizer (1). a feed stream (2) is sprayed onto the glass fibers (not shown) by a plurality of spaced nozzles (not shown). the glass fibers are then drawn down via entraining air (4) into a forming chamber (5) where the majority of the glass fibers collect on a moving chainbelt (6), which conveys the glass fiber web (not shown) out of the forming chamber (5), and delivers it to downstream equipment for subsequent processing. the entraining air (4) is drawn by a fan (5a) through the forming chamber (5), through a chainbelt (6), into a suction box (5b), and then through various air emissions control devices, including a cyclone (5c), and then sent for emissions control (5d). in this embodiment, the feed stream (2), which is sprayed on the glass fibers, is prepared by metering a polyacrylic acid-based binder from a binder storage tank (7), at 50% solids, to the feed stream (2), where it is diluted with a stream of recycled wash water (8). a wash water flowmeter (8a) and wash water control valve (8b) are used to measure and control the flow of dilution wash water (8). a binder flowmeter (7a) is used to measure binder flow. a control system (7b) adjusts the binder feed rate in proportion to the flowrate of the dilution wash water to achieve the desired binder content in the feed stream (2). the ph of the feed stream is maintained at below 3.5 by addition of a mineral acid. the mineral acid is metered from a storage tank (9), to the feed stream (2), where it is mixed into the dilute binder solution using a mixer (10). since the alkalinity of the wash water can vary significantly due to a number of factors, the addition rate of acid to the dilute binder stream is controlled by a ph meter (11). the flow rate of acid is measured by a flow meter (9a). some of the feed stream-coated glass fibers, and some of the feed stream itself, stick to the walls of the forming chamber (5), and do not become part of the glass fiber web. likewise, some of the feed stream-coated glass fibers, as well as some of the feed stream itself, stick to the chainbelt (6). these fibers and feed stream materials must be washed away to prevent buildup, which would eventually clog the equipment and stop the process from working. this is accomplished by spraying wash water from wash water process lines (12) and (13), onto the walls of the forming chamber (5), onto the chainbelt (6), and anywhere else feed stream-coated glass fiber can accumulate. the wash water, now laden with feed stream-coated glass fiber, is collected in a wash water collection container. prior to being directed to the wash water collection container (18), the wash water from the chainbelt washing is collected in a chainbelt wash collector (19). the glass fibers are separated from the wash water by filtering, and discarded. the filtered wash water is pumped, by a wash water return pump (14), back to the wash water system, where a portion of it is directed toward wash water process lines (12) and (13) for equipment washing, and a different portion of it is directed toward wash water process lines for binder dilution (8). a makeup wash water process line (20) is used to replenish process water lost, for example, due to evaporation. to reduce the corrosivity of the wash water, a base is added to the wash water. this is done by metering the base, for example, a sodium hydroxide solution, from a base storage tank (15), to a wash water process line (12), where it is mixed into the wash water solution using, for example, an inline mixer (16). the rate at which the base is metered to the system is based on the measured amounts of acid (whether from the binder or the mineral acid) added to the feed stream. the setpoint of the controller (17a) is set so that the flowrate of the base is controlled such that it neutralizes the acid in the feed stream (2). the controller (17a) receives signals from a corrosion meter (17) in the wash water process line (21) leading from the suction box to the wash water collection container (18). the corrosion meter (17) measures the current corrosiveness of the wash water, and when the corrosion meter probe detects a corrosion rate of greater than 4 mils/year, the corrosion meter (17) sends a signal to the controller (17a), instructing it to adjust its setpoint to require the addition of more base. conversely, the corrosion meter (17) instructs the controller (17a) to adjust its setpoint to reduce the flowrate of the base to the wash water if the corrosion rate is below the setpoint. in one optional embodiment of the invention, the corrosion rate is further decreased by reducing the amount of oxygen dissolved in the wash water. the oxygen may be removed from the wash water by mechanical or chemical means. mechanical means for oxygen removal include for example, vacuum degassing, steam dearation, inert gas stripping, and the like. as illustrated in figure 2, vacuum degassing may be performed, for example, by introducing wash water to a vessel (22) that is under a vacuum created by a positive displacement vacuum pump (23), steam jet, water ring vacuum pump, centrifugal vacuum blower or similar mechanical device suitable for conveying gases from an evacuated space. the wash water may be sprayed into the vessel (22) as droplets to facilitate gas removal. the vessel (22) may contain trays to enable the formation of thin films of the wash water, in addition to the droplets, to further aid gas removal. as shown in figure 3, steam deaeration may be performed, for example, by spraying wash water into the top of a vessel (24) which is pressurized with low pressure steam (25) that is introduced at the bottom of the vessel (24). trays, or fill such as, for example, rings, saddles, mesh, and the like, may be placed inside the vessel (24), to improve contact between the wash water, as it falls from the top of the vessel (24) to the bottom, and the steam (25), which flows up to the top of the vessel (24) from the steam inlet (25) at the bottom. this contact assists in the disengagement of the air from the wash water. air, along with some steam (25), is purged out of the vessel (24) through a vent (26). a liquid to liquid "interchanger" heat exchanger (27) can be used to preheat the wash water entering the deaerator vessel (24), where the heating medium is the heated water leaving that vessel (24). inert gas stripping may be performed, for example, by spraying wash water in the top of a vessel, while a gas having a very low oxygen content is simultaneously introduced at the other end of the vessel. trays, or fill, such as for example, rings, saddles, mesh, and the like, may be placed inside the vessel to improve the contact between the wash water and the gas. the gas will acquire at least a portion of the oxygen in the wash water, removing the oxygen from the system via a vent in the vessel. alternatively, as shown in figure 4, this intimate wash water/gas contact can be achieved by introducing the gas into a tank containing wash water, such as, for example, the wash water collection container (18), via a pipe (18b). this pipe (18b) feeds a distribution system (28) that generates small bubbles of air which rise through the water. the distributor (28) can be a piping network with many small holes drilled in the pipe walls, a porous plate-type distributor, or any other configuration that generates a large number of evenly-distributed small bubbles in the wash water. the inert gas may be nitrogen that has been separated from air cryogenically, by diffusion, or by any other technique, low-oxygen inert combustion flue gases, or any other gas having a low oxygen content. chemical means for oxygen removal include, for example, addition to the wash water of inorganic salts of partially oxidized compounds which will further oxidize in the wash water, organic materials which will oxidize and thus consume the oxygen in the wash water, enzymes and alcohol, or other suitable materials. inorganic oxygen scavengers suitable for the invention include, for example sulfites such as sodium sulfite or sodium metabisulfite, sodium borohydride, various dithionites, thiosulfites or phosphites, and the like. the oxygen-scavenging activity of the inorganic salts may be improved by use of a catalyst, such as for example, cobalt chloride. the wash water temperature may be raised to enable oxidation by the inorganic salts to occur more efficiently and rapidly. organic materials suitable for use with the invention include, for example, tannin-based oxygen scavengers such as accepta™ 2012 (accepta, manchester, united kingdom), hydrazine (n 2 h 4 ), carbohydrazine, hydroquinone, diethylhydroxyethanol, methylethylketoxime, paramethoxyphenol, phenol, and the like. the addition of enzymes and alcohol to the wash water may cause the alcohol to react with dissolved oxygen. examples of suitable enzymes and alcohols may be found, for example, in united states patent no. 4,414,334, herein incorporated by reference. the chemical scavenger may be added directly to the wash water, or it may be added to the feed stream, or to any process line leading to the wash water. while the invention has been described in terms of preferred, but optional embodiments, it will be understood, of course, that the invention is not limited to any particular embodiment, since modifications may be made by those skilled in the art, particularly in light of the teachings in this application.
154-461-124-693-299	US	[ "WO", "US" ]	H04M7/00,H04M3/42,H04L12/28	2007-01-31T00:00:00	2007	[ "H04" ]	methods, systems, and computer program products for applying multiple communications services to a call	methods, systems, and computer program products for providing an enriched messaging service in a communications system is described. in one embodiment, the method includes receiving a signaling message associated with a call at one of a plurality of service dispatch and control (sdc) functions, wherein the call signaling message includes a subscriber identifier. a plurality of call services associated with the subscriber identifier that is to be applied to the call is determined. the method also includes communicating the signaling message from the sdc function to a service platform and receiving back at the sdc function for each of the plurality of call services and thereby sequentially applying the call services to the call.	claims what is claimed is: 1. a method for applying at least one service to a call in a communications system, the method comprising: receiving a signaling message associated with a call at one of a plurality of service dispatch and control (sdc) functions, wherein the call signaling message includes a subscriber identifier; determining a plurality of call services associated with the subscriber identifier that is to be applied to the call; and communicating at least a portion of the signaling message from the sdc function to a service platform and receiving a response back at the sdc function for each of the plurality of call services and thereby sequentially applying the call services to the call. 2. the method of claim 1 further comprising: generating call context data that is associated with the call, wherein the call context data includes an order in which the plurality of call services are to be applied to the call; and provisioning the call context data to the remaining plurality of sdc functions. 3. the method of claim 2 wherein provisioning the call context data includes providing a copy of the call context data to each of the plurality of sdc functions. 4. the method of claim 1 wherein the plurality of call services includes at least one of a call screening service, a number translation service, and a prepaid application service. 5. the method of claim 1 wherein the sdc function communicates to a local service platform using an inter process communications (ipc) mechanism. 6. the method of claim 1 wherein the subscriber identifier includes at least one of a called party identifier and a calling party identifier. 7. the method of claim 2 wherein the call context data includes at least one of an origination point code (opc), a destination point code (dpc), and a circuit identification code (cic). 8. the method of claim 1 wherein communicating a message includes: sending an encapsulated signaling message to a first service platform for applying a first call service to the call; receiving the encapsulated signaling message from the first service platform indicating that the first call service is applied to the call; and sending the encapsulated signaling message to a second service platform for applying a second call service to the call. 9. the method of claim 8 wherein the order of the first service platform and second service platform is designated in call context data. 10. the method of claim 3 wherein the call context data is provisioned if the signaling message is sent to a context sensitive application. 11. the method of claim 8 wherein the encapsulated signaling message includes an iam message encapsulated in an sccp message. 12. a system for applying a call service to a call comprising: a service dispatch and control (sdc) function for receiving a signaling message associated with a call at one of a plurality of service dispatch and control (sdc) functions, wherein the call signaling message includes a subscriber identifier, for determining a plurality of call services associated with the subscriber identifier that is to be applied to the call, and for communicating at least a portion of the signaling message from the sdc function to a service platform and receiving a response back at the sdc function for each of the plurality of call services and thereby sequentially applying the call services to the call. 13. the system of claim 12 wherein the sdc function is further adapted to generate call context data that is associated with the call, wherein the call context data includes an order in which the plurality of call services are to be applied to the call, and provision the call context data to the remaining plurality of sdc functions. 14. the system of claim 13 wherein the sdc function is further adapted to provide a copy of the call context data to each of the plurality of sdc functions. 15. the system of claim 12 wherein the plurality of call services includes at least one of a call screening service, a number translation service, and a prepaid application service. 16. the system of claim 12 wherein the sdc function communicates to a local service platform using an inter process communications (ipc) mechanism. 17. the system of claim 12 wherein the subscriber identifier includes at least one of a called party identifier and a calling party identifier. 18. the system of claim 13 wherein the call context data includes at least one of an origination point code (opc), a destination point code (dpc), and a circuit identification code (cic). 19. the system of claim 12 wherein the sdc function is further adapted to send an encapsulated signaling message to a first service platform for applying a first call service to the call, receive the encapsulated signaling message from the first service platform indicating that the first call service is applied to the call, and send the encapsulated signaling message to a second service platform for applying a second call service to the call. 20. the system of claim 19 wherein the order of the first service platform and second service platform is designated in call context data. 21. the system of claim 14 wherein the call context data is provisioned if the signaling message is sent to a context sensitive application. 22. the system of claim 19 wherein the encapsulated signaling message includes an iam message encapsulated in an sccp message. 23. a computer program product comprising computer executable instructions embodied in a computer readable medium for performing steps comprising: receiving a signaling message associated with a call at one of a plurality of service dispatch and control (sdc) functions, wherein the call signaling message includes a subscriber identifier; determining a plurality of call services associated with the subscriber identifier that is to be applied to the call; and communicating at least a portion of the signaling message from the sdc function to a service platform and receiving a response back at the sdc function for each of the plurality of call services and thereby sequentially applying the call services to the call.	description methods, systems, and computer program products for applying multiple communications services to a call related applications the present application claims the benefit of u.s. provisional patent application serial no. 60/898,754, filed january 31 , 2007; the disclosure of which is incorporated herein by reference in its entirety. technical field the subject matter described herein relates to the provisioning of telecommunications services and signaling networks. more particularly, the subject matter described herein relates to methods, systems, and computer program products for providing multiple communications services to a call. background presently, telecommunications service providers utilize different service application platforms in their networks in order to provide various services to a given call. for example, upon receiving a call signaling message, a servicing creation system (scs) server node in a provider's network may send a message or forward a call signaling message (or an encapsulated version) to a plurality of service application platforms. more specifically, the message is sent to the service applications in a predefined order. after one service application platform has processed the message (e.g., invoked the service), the message is forwarded to the next service application platform according to the predefined order. unfortunately, this configuration for distributing the call signaling message to each service application requires that each service platform is equipped with some form of intelligence so that the services applied to the call may be kept track of. in addition, because each service application platform may be required to provision the service platform subsequently accessed with failure scenarios, additional resources may be needed to provide the service platforms with the requisite processing power. moreover, communications conducted among the service platforms typically require the involvement of non-standard signaling, which can give rise to communications and compatibility problems that may otherwise be avoided. accordingly, there exists a need for improved methods, systems, and computer program products for applying multiple communications services to a call. summary according to one aspect, the subject matter described herein comprises methods, systems, and computer program products for applying multiple communications services to a call in a communications system. one method includes receiving a signaling message associated with a call at one of a plurality of service dispatch and control (sdc) functions, wherein the call signaling message may include a subscriber identifier, such as a calling party identifier and a called party identifier. in one example, a plurality of call services associated with the subscriber identifier that is to be applied to the call is determined. the method also includes communicating the signaling message from the sdc function to a service platform and receiving a message back at the sdc function for each of the plurality of call services and thereby sequentially applying the call services to the call. the subject matter described herein for applying multiple communications services to a call may be implemented using a computer program product comprising computer executable instructions embodied in a tangible computer readable medium that are executed by a computer processor. exemplary computer readable media suitable for implementing the subject matter described herein includes disk memory devices, programmable logic devices, and application specific integrated circuits. in one implementation, the computer readable medium may include a memory accessible by a processor. the memory may include instructions executable by the processor for implementing any of the methods for applying multiple communications services to a call described herein. in addition, a computer readable medium that implements the subject matter described herein may be distributed across multiple physical devices and/or computing platforms. brief description of the drawings preferred embodiments of the subject matter described herein will now be explained with reference to the accompanying drawings of which: figure 1 is an exemplary communications system for providing multiple communication services to a call according to an embodiment of the subject matter described herein; figure 2 is a flow chart illustrating exemplary steps for providing multiple communications services to a call according to an embodiment of the subject matter described herein; figure 3 depicts a call flow diagram for applying call screening, prepaid, and number translation services to a call according to an embodiment of the subject matter described herein; figure 4 depicts a call flow diagram depicting the processing of a call that has failed an initial screening process according to an embodiment of the subject matter described herein; figure 5 depicts a call flow diagram for applying screening and prepaid services to a call when no funds are available according to an embodiment of the subject matter described herein; figure 6 depicts a call flow diagram depicting a prepaid call with a mid- call release due to a shortage of funds according to an embodiment of the subject matter described herein; figure 7 depicts a call flow diagram for applying call screening service and prepaid service that utilizes an initial interactive voice response (ivr) voice message according to an embodiment of the subject matter described herein; figure 8 depicts a call flow diagram for handling a reset circuit (rsc) message according to an embodiment of the subject matter described herein; and figure 9 depicts a call flow diagram for handling a group reset (grs) message according to an embodiment of the subject matter described herein. detailed description the present subject matter relates to systems, methods, and computer program products for applying multiple communications services to a call or similar communications transaction. according to one embodiment of the present subject matter, a service dispatch and control (sdc) function may be used to provision communications services, such as screening services, number translation services, prepaid application services, and other wireline and wireless communications services to a serviced call. figure 1 illustrates an exemplary communications system 100 for applying multiple communications services to a given call or like communications transaction. for example, system 100 may be used to develop and deploy triggerless services based on isdn user part (isup)/telephone user part (tup) applications. in one embodiment, communications system 100 includes a first end office (eo) 102, a second eo 107, a first signal transfer point. (stp) pair 104, a second stp pair 105, a service creation system (scs) cluster 103, and a plurality of application servers 150i... n (e.g., ss7 service control points (scps), ip multimedia subsystem (ims) application servers, session initiation protocol (sip) application servers, simple object application protocol (soap) servers, communications service application servers, etc.). although figure 1 only depicts stp pair 104 and stp pair 105, additional stp pairs or standalone stps may be used in system 100. furthermore, any other type of network routing node, such as a session initiation protocol (sip) router, ip multimedia subsystem (ims) node, and the like, may be implemented in system 100 in the place of stp pair 104 or 105 without departing from the scope of the present subject matter. in one embodiment, end office 102 (e.g., a service signaling point (ssp)) may be configured to generate a call signaling message in response to a calling party 161 attempting to place a call to a called party 162. calling party 161 may utilize any device, such as a telephone, internet protocol (ip) telephone, a personal computer, or similar communications device, to initiate a call or communication session (e.g., multimedia session, etc.). stp pair 104 may collectively function as a network node that is adapted to receive the call signaling message from eo 102. stp pair 104 may be connected to scs cluster 103 via transport adapter layer interface (tali) links or sigtran links, such as m3ua or sua links, which may be utilized to forward the call signaling message to at least one of the scs nodes 106i... n in cluster 103. scs cluster 103 may be adapted to function as a decision maker during the initial call setup phase. for example, scs nodes 106-ι... n may act as a collection of core service logic software that handles call signaling message analysis and decision making for system 100. in one embodiment, scs cluster 103 is deployed as a set of servers that operate in a load-shared mode that handles call signaling messages from stp 104 (or stp 105). furthermore, scs nodes 106i... n in cluster 103 share the same configuration data, call context data, and provisioning data (i.e., each scs node 106 is a replica in this regard) via one or more synchronization processes that are described in detail below. in one embodiment, a communication core object library (comcol) in-memory database (idb) inetsync mechanism is used for synchronizing various data across cluster 103. thus, if any scs node 106 becomes inoperable, a failover process may be automatically handled at stp 104 (or pair 105) by a dynamic load-sharing scheme to utilize another scs node in cluster 103. in addition to scs nodes 106i... n , scs cluster 103 also includes a service management system (sms) node 108. sms node 108 may act as an scs provisioning/maintenance interface using web-based or mml applications. as shown in figure 1 , sms node 108 is coupled to each of the scs nodes 106 in cluster 103. each scs node 106 in cluster 103 contains a service dispatch and control (sdc) function 120, which may be implemented as a hardware component, software/firmware program (or module), or a combination of both. in one embodiment, sdc 120 is adapted to apply multiple subscribed services to a call session or communications transaction associated with a received call signaling message. for example, sdc 120 may route the call signaling messages and coordinate the application of scs-based services and external services to the associated call session. sdc 120 manages multiple services and ensures that the routing of a call signaling message to each of these services (if applicable to a given subscriber) is based upon a provisioned and predefined order (e.g., after a successful screening). in one embodiment, the predefined order maintained by sdc 120 is unique to each subscriber and is maintained in a database 126. for example, database 126, which may be accessed by each scs node 106, may contain a list of calling subscribers, a list of corresponding subscribed services, and the order in which the services are to be invoked with regard to a call. in addition to other functions, sdc 120 is responsible for handling call signaling messages (e.g., isup/tup) or transaction messages from end office 102 (e.g., via stp 104 through tali or sigtran links). in one embodiment, sdc 120 also maintains and manages call context data 121 and controls the call flow. in one embodiment, scs node 106 may support services that are local or internal. for example, call screening service platform 124 and number translation service platform 122 may be deployed as applications on the same scs node 106 that is hosting sdc 120. in order to optimize processing resources, sdc 120 may utilize a local inter process communications (ipc) mechanism to communicate with call screening service platform 124, number translation (nt) service platform 122, or any other service application platform that is deployed locally on scs node 106. in one embodiment, comcol's shared memory based queues may be used to implement the ipc mechanism. similarly, scs node 106 can support external services, like prepaid calling services 151 , via stp 105. in one exemplary embodiment illustrating the functionality of sdc 120, a call signaling message for a call session is received from e0 102 via stp 104. sdc 120 subsequently examines the received call signaling message for a subscriber identifier (e.g., a calling party number or a called party number) in order to determine the subscription of services that may be invoked for the call. for example, sdc 120 may query database 126 using the identifier to determine a predefined order of applicable services in which the call signaling message is to be forwarded. as mentioned above, the predefined order may be unique to a subscriber associated with the calling party identifier. sdc 120 is also responsible for creating and maintaining call context data 121 for context sensitive services, such as prepaid calling service platform 151. in one embodiment, call context data 121 may include the origination point code (opc), the destination point code (dpc), and the circuit identification code (cic) that pertains to the call. call context data 121 may also contain the list (and order) of service applications (e.g., obtained from database 126) to be invoked for a given call. in one embodiment, call context data 121 is synchronized across all the scs nodes 106i... n of cluster 103. for example, the synchronization of call context data 121 may be conducted by transmission control protocol (tcp) / stream control transmission protocol (sctp), or a user datagram protocol (udp) multicast. by synchronizing call context data 121 across cluster 103, each and every scs node 106 is able to handle any message related to a given call (since each scs node 106 is provisioned with identical call context data 121). in one embodiment, call context data 121 is synchronized only if the services which need to be invoked during the call session are either external to the scs node or are context sensitive (see more details below). as mentioned above, call context data 121 includes a list of predefined services that may be applied to a call. the services contained in call context data 121 (and database 126) may be categorized as either stateless services or context sensitive (i.e., state sensitive) services. stateless services, such as screening and number translation, are invoked upon the receipt of an initial address message (iam) from the customer network (via end office 102). these types of services are not concerned with other messages during the call control. alternatively, the context sensitive services, such as prepaid services, are services dependent on state information and are provided messages at every stage of the call (in order to keep the state updated). in general, there are two possible idb synchronization setups that may be conducted across all scs and sms servers in cluster 103. in the first setup, sdc 120 functions as the front end application at scs 106, which is adapted to interact with the customer network. sdc 120 may route the messages and coordinate with the scs based services, such as screening 124 and number translation 122, and external services like a prepaid call service 151. in one embodiment, sdc 120 exchanges messages with the subscription services by encapsulating a calling signaling message (e.g., message signaling unit (msu)) in a signaling connection control part (sccp) unit data message. for example, sdc 120 may send an sccp message to an external application (e.g., prepaid service 151) via stp 104 over tali (or sigtran), which is then routed to the external application platform over mtp3 user adaptation layer (m3ua). similarly, sdc 120 may send the message to a co-located service (e.g., screening service 124 or nt service 122) using ipc. after sending an encapsulated message to a service (e.g., screening), sdc 120 receives a successful response, such as an iam message encapsulated in an sccp message, from that service. for example, the application may use the same sccp addressing format and user data format for returning the isup data to sdc 120. the application may use the sdc point code and a subsystem number (ssn) in cdpa, and its own point code and ssn in cgpa. in addition, in the case of an external application (e.g., prepaid service 151), stp 104 may route the message transparently over tali or sigtran to scs 106. alternatively, a co-located service (e.g., screening service 124) may send a message to sdc 120 using ipc. after receiving the message from the first service platform, sdc 120 then routes the original encapsulated message to the next service listed in call context data 121. depending on its destination, a message may be routed in various ways. if the message destination (i.e., service application) is external to scs node 106, then the message is sent to stp 105 via tali or sigtran afterwards, stp 105 routes the message to the appropriate external service scp 150. for example, where the subscription service is a prepaid service 151 , sdc 120 sends the encapsulated call signaling message to stp 104 on tali or sigtran. stp 105 then routes the message to prepaid service 151 using mtp3 user adaptation layer (m3ua) protocol. after receiving the sccp message from the service, sdc 120 sends the sccp message to the next appropriate service (i.e., in the predefined order specified in the call context data 121). once sdc 120 receives the sccp message from the last service indicated in call context data 121, sdc 120 passes the original call signaling message to the actual destination (e.g., called party 162) via stp 105 in order to setup the call. one example of providing a plurality of services to a call or communications transaction is depicted as method 200 in figure 2. in block 202, a call signaling message is received. in one embodiment, sdc 120 receives a call signaling message from a calling subscriber that originates from a consumer network (e.g., device 161 by way of eo 102) via stp 104. for example, the call signaling message may be received from stp 104 via a tali or sigtran link. the received call signaling message may be an (isup) message or (tup) message, or the like. in block 203, the subscription of services associated with the origination of the call signaling message is checked. in one embodiment, a calling party identifier is extracted from the call signaling message by sdc 120. sdc 120 then compares the calling party identifier found in the signaling message with entries in a subscriber database 126. thus, the services associated with a subscriber (by using the calling party identifier) may be determined. in block 204, a call context data file is created. in one embodiment, sdc 120 creates call context data 121 for the communications transaction (e.g., a call session) associated with the received call signaling message. for example, call context data 121 for a call may include an originating point code (opc), a destination point code (dpc), a circuit identification code (cic) 1 a list of services to be applied to the call, and the like. call context data 121 is created for call context sensitive services that are found in block 203 (e.g., prepaid calls). in block 206, a determination is made as to whether the call context data is to be synchronized. the determination to synchronize (e.g., provision call context data 121 among the scs servers) may arise if the context data is created, updated, deleted, or otherwise modified by sdc 120. in one embodiment, sdc 120 determines if the services which need to be invoked during the call (e.g., services found in block 203) are external to scs server 106 or are context sensitive. notably, services that are context sensitive require frequent synchronizations. if the call context data is synchronized, method 200 proceeds to block 208. if the call context is not synchronized, method 200 continues to block 210. in block 208, the call context data is synchronized. in one embodiment, sdc 120 synchronizes call context data 121 across cluster 103 so that each of the remaining sdc 120i... n is provisioned with the most recent call context data. by being provisioned with the latest call context data, each sdc 120 is capable of processing the call further, if necessary. namely, all messages related to the call may be handled by any scs server 106 within cluster 103 by using the synchronized call context data. in one embodiment, a comcol idb inetsync mechanism or software function is used for call context data synchronization across cluster 103. in block 210, the call signaling message is encapsulated. in one embodiment, soc 120 encapsulates the call signaling message in a signaling connection and control part (sccp) unit data message. by encapsulating the call signaling message in sccp 1 sdc 120 is able to transport the call signaling message to various call service platforms. in block 212, the encapsulated signaling message is sent to a first service platform. in one embodiment, sdc 120 sends the encapsulated signaling message to call screening service platform 124. call screening service platform 124 is located on scs 106 and is frequently accessed first among all other services and applications. in one embodiment, the signaling message may be sent to the first service platform without encapsulation. in an alternate embodiment, the entire signaling message does not have to be sent to the service platform. rather, only a portion of the signaling message is needed to be received and processed (e.g., the calling party identifier, the called party identifier, etc.) by the service platform. in block 214, a response message from the first service is received. in one embodiment, sdc 120 receives a "successful" response message from screening service 124 which is sent to inform the sdc that the first service is applied. the response message may include an sccp message (e.g., iam message encapsulated in sccp message). in one embodiment, the response message may include a simple message with a designated bit (e.g., a flipped bit) to indicate that the first service is to be applied. in block 216, a determination is made as to whether the service application that sent the response is the last service application to be accessed. if the service application is the last service application on in the predefined order contained in the context data of sdc 120, then method 200 continues to block 220. otherwise, method 200 proceeds to step 218 where the encapsulated message is then sent to the next predefined service. in block 218, the encapsulated message is sent to the next service. in one embodiment, sdc 120 routes the message to the next service on the list after receiving the successful response message from screening service 124. if the message is external to scs 106, the message may be sent to stp 104 using a tali or sigtran link. stp 104 then routes the message to the appropriate external service. however, in the case of a prepaid service (which may be the next predefined service), sdc 120 may send the message to stp 104 on tali or sigtran and then stp 104 may then route the message to prepaid service 151 over mtp3 user adaptation layer (m3ua) or any other similar ss7 communication protocol. in one embodiment, block 214 may be repeated until each service on the services list is contacted. method 200 then loops back to block 214, where sdc 120 receives a response message from the service application. in block 220, the original call signaling message is forwarded to its intended destination. in one embodiment, sdc 120 forwards the original call signaling message to its intended destination with all the appropriate service applications (i.e., all the services subscribed to by the subscriber) to be applied to the call session. method 200 then ends. in one embodiment, sdc 120 may handle call signaling messages initially received by stp 104 or stp 105 and invoke specific services for the associated calls. table 1 shows a list of call signaling messages (i.e., isup/tup messages) which may be handled by sdc 120. table 1 : message types handled by the sdc and services in one embodiment, any other isup/tup message not listed in table 1 may be directly routed to the destination or called party 162 via stp 104 or 105. figure 3 is an exemplary call flow diagram pertaining to the present subject matter. specifically, figure 3 depicts the contacting a call screening service platform, a prepaid application service platform, and number translation (nt) (e.g., enum, number portability) service platform. referring to figure 3, eo 102 forwards an iam addressed with an opc=i , dpc=7 and a cic=4 to stp 104. in this example, the originating point code (opc) is the point code of eo 102 and the destination point code (dpc) is the point code of eo 107. figure 3 illustrates that a call signaling message (e.g., iam message) is then sent from stp 104 to sdc 120. upon receiving the call signaling message, context data is created locally at scs 106. after the call context data is created, figure 3 depicts a message (e.g., an encapsulated call signaling message) being sent to screening function 124. presumably, screening function 124 is the first service listed in a subscriber database 126 stored in sdc 120 (see figure 1). screening function 124 then sends a "successful" response message back to sdc 120 where context data 121 is updated locally and synchronized across cluster 103. sdc 120 then sends an iam message intended for prepaid application 151. in this scenario, it is presumed that prepaid application service 151 is the second listed service in the subscriber database 126. upon receiving the message, prepaid application 151 performs an internal query and determines that funds are available for the subscriber to continue the call. prepaid application 151 then sends a response message back to sdc 120 via stp 104. upon receiving the message, sdc 120 updates call context data 121 and synchronizes the data across the servers of cluster 103. sdc 120 then sends a message to number translation service 122 (i.e., the third service on the database list). after performing a number translation (e.g., an enum service, number portability, etc.), number translation service 122 sends a successful response message to sdc 120, which updates context data 121 and synchronizes it across cluster 103. the call signaling message is then sent to the destination end office 107 via stp 104. stp 104 then receives an acm message intended for e0 101 from eo 107. stp 104 forwards the intercepted message to sdc 120 where the context data is updated locally and a synchronization procedure is performed. sdc 120 then forwards the acm message to prepaid server 151 via stp 104. prepaid server 151 checks its database and then forwards the message to sdc 120 via stp 104. sdc 120 then sends the acm message to eo 102. after the acm message is received by eo 102, eo 107 may send an anm message to eo 102 in accordance to the transmission of the acm message previously described. however, before receiving the anm message, sdc 120 receives an encapsulated version of the message from stp 104 and updates the context data, performs a synchronization procedure, and forwards the message to prepaid service 151. the anm message is then sent to eo 102 and the calling party hangs up. consequently, a release message addressed to eo 107 is received by sdc 120 which then updates the context data, performs a synchronization procedure, and forwards the message to prepaid service 151. sdc 120 receives the release message back from prepaid service 151 and sends it to eo 107 via stp 104. eo 107 responds by issuing a release confirmation (rlc) message which is received by e0102 after being processed by sdc 120 and prepaid service 151. figure 4 is an exemplary call flow involving the present subject matter. specifically, figure 4 depicts the processing of a call that has failed an initial screening process. for example, eo 102 sends an iam message addressed to eo 107. the message is initially received by stp 104, which then forwards the message to sdc 102 where the context information is created locally. the iam message is then forwarded to the screening function 124 which subsequently determines that the initiating caller is not permitted to make the call. at this point, screening function 124 sends a release message to sdc 120, which then updates the context data locally and performs a synchronization procedure across cluster 103. the release message is then sent to eo 102 via stp 104. e0 104 then sends a release confirmation (rlc) message back to sdc 120, which subsequently deletes the context data and performs a synchronization procedure. figure 5 is an exemplary call flow involving the present subject matter. specifically, figure 5 illustrates the application of screening and prepaid services to a call when no funds are available. notably, e0102 sends an iam message addressed to eo 107 via stp 104, which then forwards the message to sdc 102 where the context information is created locally. the iam message is then forwarded to the screening function 124 which subsequently determines that the initiating caller is permitted to make the call. at this point, screening function 124 sends the iam message back to sdc 120, which then updates the context information locally and performs a synchronization procedure across cluster 103. the iam message is then sent to prepaid server 151 which then determines that there are no funds available for the calling subscriber. prepaid server 151 then sends a release message to sdc 120 (via stp 104). sdc 120 updates the context information locally and performs a synchronization procedure. sdc 120 then sends a release message to eo 102 via stp 104. eo 102 responds by sending a release confirmation (rlc) message back to sdc 120, which then deletes the context data and executes a synchronization procedure. an rlc message is then sent to prepaid server 151. figure 6 is an exemplary call flow involving the present subject matter. specifically, figure 6 depicts a prepaid call with a mid-call release due to a shortage of funds. namely, in the event the caller runs out of funds during a conversation, prepaid server 151 detects the shortage and issues a release message to sdc 120 via stp 104. sdc 120 updates context information locally and initiates a synchronization procedure across cluster 103. sdc 120 then forwards the release message to eo 107. in response, eo 107 returns an rlc message to eo 102 which is intercepted by sdc 120 (via stp 104). upon receiving the release confirmation message, sdc 120 deletes the context information and executes a synchronization process. sdc 120 then forwards the rlc message to prepaid server 151 (via stp 104). prepaid server 151 then sends an iam to sdc 120, which then creates a new instance of context information (because the call is new) and executes a synchronization procedure across cluster 103. sdc 120 then sends the iam message to eo 107. once received at e0 107, the iam message is routed to an ivr platform. in one embodiment, the ivr platform may be supported by a standalone server that is communicatively connected to eo 107. in an alternate embodiment, the ivr platform may be integrated with prepaid services platform 151. e0107 then directs an acm message to eo 102. after a series of acm and anm messages between sdc 120, stp 104, and prepaid application 151, the calling party hangs up (presumably after receiving a voice message from the ivr). eo 102 then sends a release message to eo 107. figure 7 is an exemplary call flow involving the present subject matter. specifically, figure 7 depicts the applying of call screening service and prepaid service, which utilizes an ivr voice message. eo 102 initially sends an iam message addressed to eo 107 via stp 104. stp 104 encapsulates the iam message in an sccp message and forwards it to sdc 120. sdc 120 creates context data and sends the sccp message to screening platform 124, which then returns the sccp message to sdc 120 after the screening process is complete. sdc 120 then updates the context data, synchronizes the data across cluster 103 (i.e., in case any of the services are network/context- sensitive services) and sends the encapsulated iam message to prepaid services platform 151 , which subsequently plays an initial announcement. the sccp message with the ivr is sent to e0 107 via sdc 120 and stp 104. eo 107 responds by sending an acm message addressed to e0 102 via stp 104 (and sdc 120 and prepaid platform 151). at this point, an initial announcement message (e.g., "your account has 15 minutes remaining") is played. prepaid platform 151 then sends an encapsulated release message to sdc 120. sdc then sends a release message to eo 107 (via stp 104). eo 107 responds by returning an rlc message to sdc 120, which then deletes the context data because it is no longer required and executes a synchronization procedure. sdc 120 then sends an encapsulated sccp rlc message to prepaid service platform 151. at this time, the initial announcement ends. prepaid service platform 151 then sends an encapsulated iam message addressed to e0 107 via sdc 120, which creates context data and performs a synchronization procedure. when eo 107 receives the iam message, the iam message is routed to the called party number. e0 107 responds by sending an acm message to e0102. theacm message is ultimately intercepted by prepaid service platform 151, which then forwards an encapsulated cpg message to e0 102. around this time, e0107 also sends an anm message to e0102 via stp 104, prepaid service platform 151, and sdc 120. after eo 102 receives the anm message, the conversation between the two parties commences. figure 8 is an exemplary call flow involving the present subject matter. specifically, figure 8 depicts the handling of a reset circuit (rsc) message. eo 102 initially sends an rsc message addressed to eo 107 that is received by sdc 120 via stp 104. sdc 120 then sends the rsc message (which is encapsulated in an sccp message) to prepaid application 151 before the rsc message is ultimately forwarded to eo 107. in response, eo 107 sends an rlc message to eo 102 via stp 104 and sdc 120. figure 9 is an exemplary call flow involving the present subject matter. specifically, figure 9 depicts the handling of a group reset (grs) message. eo 102 initially sends a grs message addressed to eo 107 that is received by sdc 120 via stp 104. sdc 120 then sends the grs message (which is encapsulated in an sccp message) to prepaid application 151 before the grs message is ultimately forwarded to eo 107. in response, eo 107 sends a gra message to eo 102 via stp 104 and sdc 120. as mentioned above, sdc 120 may be configured to synchronize call context information across all instances of sdc applications (i.e. , scs servers) running in cluster 103. there are at least two possible idb synchronization configurations that typically exist in system 100. in one scenario, there is synchronization between sms node 108 and all the scs nodes 106 in cluster 103. for example, the sms node 108 may act as a primary server with respect to idb synchronization management and may synchronize all ancillary servers (i.e., child servers). in one embodiment, all scs nodes 106 in cluster 103 act as "ancillary" servers and may be synchronized only with sms node 108. notably, sms node 108 may become susceptible as a single point of failure in this scenario. however, since sms node 108 is currently used for synchronizing the provisioning data (which does not change too often), sms node 108 may be considered as a non-critical resource during call processing. similarly, a second synchronization process exists between all scs nodes 106 for sdc call context synchronization in cluster 103. specifically, sms node 108 is not included in the synchronization process in this scenario. because call context data needs to be synchronized, there may be a separate idb configuration required between the scs nodes 106 in cluster 103 (i.e., sms node 108 does not require this data). in order to implement this approach, a primary server in cluster 103 may be configured/designated at installation time to handle idb network transactions from scs node 106 and propagate the instructions to the remaining scs nodes 106 in cluster 103. since the primary scs server node can be a single point of failure, a designate secondary scs server may be designated. the secondary scs server node may be configured to failover to change its role to become a primary server in the event the originally designated primary scs server node becomes unavailable. this feature may be implemented using a failmon daemon on scs servers. in one embodiment, these daemons are responsible for enabling scs nodes 106 to consider their role as predefined in database 126 at start up time. based on the pre-configured role stored in the database, a primary scs server daemon and a secondary scs server daemon may continue to run while the remaining scs server daemons exit. the primary and secondary scs servers may be configured to exchange periodic heartbeats to ensure that both scs servers are functioning properly and no failover actions need to be taken. for example, the designated secondary scs server may wait for three consecutive heartbeats to be missed (e.g., three heartbeat messages sent to primary server without a response) before initiating a failover action. in one embodiment, the heartbeat threshold number may be hardcoded. in the event a failover action is initiated, the failmon process informs all the ancillary scs servers about the primary role switchover (i.e., when the secondary server becomes the primary server). in the case where a forced or manual failover procedure is executed, the failmon process may inform the current primary server and the ancillary scs servers about the change of primary scs server (i.e., the secondary server is now the new primary server). the key to these two parallel syncing configurations is to use different (prodid, runid) idb instances. in one embodiment, the existing sms syncing mechanism may use (prodid=oi , runid=oo) and can continue its existing functionality. similarly, the new scs syncing mechanism may use (prodid=oi , runid=oi). it may have a new idb table and network transaction handlers to support syncing of call context data. sdc 120 may conduct most of its processing in the original (prodid=oi , runid=oo) setup, but when it has to generate/access any call context specific data, sdc 120 uses database handlers pointing to the (prodid=oi , runid=oi) idb. this database handler is created once at application startup and not created on per call basis. in one embodiment, the new (prodid=oi , runid=oi) setup does not have complete scs data. notably, the setup includes limited platform daemons like procmgr, inetsync, idbsvc, failmon running. one goal for this new idb configuration is to synchronize the call context data across the all scs servers 106 in scs cluster 103. also, the inetconfig utility may be used to configure this new syncing setup at install time. in one embodiment, the connection shared between sdc 120 and stps 104, 105 may include an external tali or sigtran interface. sdc 120 may utilize this link to establish and indirect interface (via stps 104, 105) to other external nodes, such as prepaid application server 151. sdc 120 may have interface with internal scs based applications (such as screening and number portability) through comcol based ipc queues. messages received by stp 104 or 105 from an external switch may be gateway screened before database transport accessed (dta) over tali or sigtran to sdc 120. sdc 120 may send sccp encapsulated isupmjp messages to stp 104 that may be gt translated and routed to a prepaid application server / scp over an m3ua interface. in one embodiment, sdc 120 only receives sccp messages from stp 104 or from local applications (e.g., number translation service platform 122 and call screening service platform 124). stp 104 has a dta feature that sends isup msu data (starting from mtp2) to sdc 120. in one embodiment, the isup msu data is encapsulated in sccp user data. an exemplary format of the encapsulated sccp message from eo 102 to sdc 120 via stp 104 is as follows: sccp header messagetype (1 byte) serviceclass (1 byte) cdpa offset (1 byte) cgpa offset (1 byte) payload offset (1 byte) called party address length (1 byte) called party address indicator ( 1 byte) pc lsb (if pc is present) pc msb (if pc is present) ssn of called party app (1 byte— if ssn is present) translation type ( 1 byte - if tl " is present) address calling party address length (1 byte) calling party address indicator ( 1 byte) pc lsb (if pc is present) pc msb (if pc is present) ssn of calling party app (1 byt e — if ssn is present) data length (sccp payload) - 1 byte mtp2 1 bit: bib 7 bit: bsn 1 bit :fib 7 bit: fsb 2 bitspare 6 bit: length lnd mtp3 sio 2 bit: network indicator 2 bit: network priority 4 bit: service indicator 8 lsbits: dpc last 6 bits->6 msbits of dpc first 2 bits -> 2 lsbits of opc 8 bits -> 8 middle bits of opc last 4 bits -> 4 msbits of opc first 4 bits -> sls isup cic (2 bytes) cic messagetype (1 byte) in one embodiment, sdc 120 may send an isup msu back to eo 102 over tali in the following exemplary format. notably, tali opcode="isot" is used for transmitting these messages via the tali link. tali processing at stp 104 may use this data for further routing to the destination switch. mtp3 sio 2 bit: network indicator 2 bit: network priority 4 bit: service indicator 8 lsbits: dpc last 6 bits->6 msbits of dpc first 2 bits -> 2 lsbits of opc 8 bits -> 8 middle bits of opc last 4 bits -> 4 msbits of opc first 4 bits -> sls isup cic (2 bytes) cic messagetype (1 byte) in one embodiment, the present subject matter may significantly affect existing scs services. for example, screening service 124 and number translation service 122 may not have any direct communication with stp 104 on tali or sigtran. also, screening service 124 and number translation service 122 may be configured to receive and send all messages to sdc 120. screening and nt services may communicate with sdc 120 on the same scs host using ipc (i.e. comcol queues which are implemented using shared memory). in one embodiment, the inter-process communication between the processes of these service platforms may be implemented using bi-directional shared memory message queues. each instance of an sdc controlled service may own a shared memory queue and act as a server for that resource. sdc 120, which can act as a client, may push the call messages on these queues and the screening service 124 or number translation service 122 may read process the message and send a response back via the same message queue. sdc 120 may also perform load balancing on these instances on a round robin basis. in one embodiment, each shm queue owned by the service instances can be uniquely identified (key) by a port number parameter (used by sdc 120, which is acting as a client to the shared memory owned by services). for example, the format for this value may include: for: application with ssn=xyz, instance id= nm => port number= xyznm in one embodiment, each instance of an application/service creates shm queues with these port values and sdc 120 may use the same algorithm while identifying and connecting to these queues. this mechanism may allow local service interactions to be very fast as well as avoiding latency and load on the stp (because of the lack of hopping on the stp). in one embodiment, sdc 120 may play the role of "turn-by-turn" invocation of services during a call in a controlled environment. the application responsible for executing this feature needs static, as well as dynamic, information about the services that the application controls. for example, graphical user interface (gui) and mml are synchronized for the update of the provisioning data in sdc 120 for add/modify and delete operations. the following exemplary tables store this provisioning data provided by the operator from the sms gui and mml commands: table name: managed service info this provisioning information is controlled by scs 106 for its internal use and is required for managing the scs hosted and external services which may be co-coordinated by sdc 120. table name: subscriber service list this provisioning information includes the subscriber and an associated list of services. sdc 120 may access this data based upon a calling party number in the iam received from a customer network and extract the list of services which need to be applied to the call. statistics and reports in one embodiment, the user can generate statistical reports through the reports display. sdc 120 may be configured to generate statistics about the messages that it receives and processes. the report selection list may include the reports based on following statistics generated by the sdc application: > isup peg counters o total number of isup messages received o total number of iam messages received o total number of acm messages received o total number of anm messages received o total number of rel messages received o total number of rlc messages received > isup peg counters by origination point code o total number of isup messages received, by origination point code o total number of iam messages received, by origination point code o total number of acm messages received, by origination point code o total number of anm messages received, by origination point code o total number of rel messages received, by origination point code o total number of rlc messages received, by origination point code > isup peg counters by destination point code o total number of isup messages received, by destination point code o total number of iam messages received, by destination point code o total number of acm messages received, by destination point code o total number of anm messages received, by destination point code o total number of rel messages received, by destination point code o total number of rlc messages received, by destination point code > tup peg counters o total number of tup messages received o total number of iai 1 iam, sam, sao messages received o total number of acm messages received o total number of clf, cbk, cfl, unn, adi messages received o total number of anc, anu, ann messages received o total number of rlg messages received > tup peg counters by origination point code o total number of tup messages received, by origination point code o total number of iai, iam, sam, sao messages received, by origination point code o total number of acm messages received, by origination point code o total number of clf, cbk 1 cfl, unn 1 adi messages received, by origination point code o total number of anc, anu, ann messages received, by origination point code o total number of rlg messages received, by origination point code > tup peg counters by destination point code o total number of tup messages received, by destination point code o total number of iai, iam, sam, sao messages received, by destination point code o total number of acm messages received, by destination point code o total number of clf, cbk, cfl, unn, adi messages received, by destination point code o total number of anc, anu, ann messages received, by destination point code o total number of rlg messages received, by destination point code to generate a report, the user may provide the reporting interval and the roll-up interval. in one embodiment, the sms maintains statistics in 15 minute units. the roll-up interval controls the number of 15 minute units that can be included in each report record. in one embodiment, program trace is the ability for an application instance to write diagnostic messages into its trace file. the type of information written to the trace file can be controlled in real-time by setting the application instance's trace mask where each bit represents a specific type of information. the trace file operates as a circular file which prevents the file from consuming unexpected amounts of disk space. the maximum size of a trace file can be set in real-time. many of the scs's programs are capable of generating trace messages. like most scs programs, sdc 120 may generate vital traces when it performs a significant activity (e.g., starting up or shutting down) and when sdc 120 detects a significant problem. vital traces may be written to a trace file. in addition to the vital traces, sdc 120 may be capable of generating several types of trace entries that are controlled by the bits in its trace mask. during performance testing and when sdc 120 is under load in the field, trace generation can have a significant impact on the performance of the sdc application. the following list identifies the important trace bits supported by sdc 120: • service invocation — these traces may include the information like calling number, called number, services subscribed and services invoked for a call. • all isup messages received — traces every isup message received by the sdc application in hexadecimal. • all isup messages sent — traces every isup message sent by the sdc application in hexadecimal. • all isup messages received from services — traces every isup message received by the sdc application in hexadecimal. • all isup messages sent to services — traces every isup message sent by the sdc application in hexadecimal. in one embodiment, alarms may be generated by the new code written for sdc 120 and may contain an alarm identifier. this may not pertain to libraries (e.g., comcol) used by sdc 120. for example, the following alarms may be generated during the call processing at sdc 120: 1. decoding error: when sdc 120 is unable to decode a message received from the stp 104, the sdc 120 may trace the message in hex, generate an alarm, and send back the message to eagle stp on tali or sigtran. the alarm may state that there was a "decoding problem" and that the scs operations staff should call customer support for help in resolving the problem. 2. overriding the existing context: if sdc 120 receives an iam message from the network and there is already existing context of the call, sdc 120 may trace the message in hex, generate an alarm, and reinitialize the context and handles it as a fresh call. the alarm may state that there was an "overriding of existing context" problem, and that the scs operations staff should call customer support for help in resolving the problem. 3. service not available: if sdc 120 is not able to write the message on the ipc channel towards the screening or nt service due to unavailability of the screening or nt instances or memory full problem, sdc 120 can trace the message in hex, generate an alarm. sdc 120 may send a rel message to all active services involved with that call and then send the release to originating party stating that the "service is not available." the alarm may state that there was a "locally hosted service not available" problem, and that the scs operations staff should call customer support for help in resolving the problem. 4. call data synchronization failed: scs 106 may generate alarm if the sdc 120 is not able to synchronize the call related data with other scs servers 106i... n . 5. service not provisioned: scs 106 may generate alarm if the sdc 120 is unable to retrieve the data (like point code, priority, etc.) for the subscribed service. in one embodiment, early in its initialization procedure, sdc 120 may generate a vital trace indicating that sdc 120 is starting up. this trace may contain the program's revision and is a clear indication that the program has restarted. late in its termination procedure, sdc 120 may generate a vital trace indicating that sdc 120 is exiting. when this trace is missing, it indicates that the program aborted instead of terminating normally. anytime sdc 120 has been killed, an scs process procmgr may restart it. it will be understood that various details of the subject matter described herein may be changed without departing from the scope of the subject matter described herein. furthermore, the foregoing description is for the purpose of illustration only, and not for the purpose of limitation, as the subject matter described herein is defined by the claims as set forth hereinafter.
154-573-623-072-901	US	[ "US" ]	F02B3/06,F02D1/02,F02D1/14,F02D17/04,F02M59/36,F02M63/02	1979-06-04T00:00:00	1979	[ "F02" ]	diesel vehicle speed control system	there is disclosed a speed control system for a diesel-powered vehicle in which a sensing element responsive to the speed of the vehicle or engine, preferably responsive to the vehicle speed, is connected through control means to close the fuel supply to the diesel engine, thereby permitting a preset limitation on vehicle and/or engine speed. the control system is designed as a retrofit to existing diesel engines and utilizes conventional elements such as the shut down lever of these engines, thereby avoiding any significant engine alterations or modifications.	1. in a vehicle having a diesel engine having multiple cylinders and fuel supply means including multiple metering valves and injectors, one set for each of said cylinders, fuel control means mechanically coupled to all said metering valves to control the volume of fuel delivered therefrom to said injectors, the improvement which comprises: a fluid pressure responsive actuator having a variably positionable actuator arm engageable with said fuel control means to effect movement thereof in a fuel limiting direction, said arm being movable in said fuel limiting direction in response to fluid pressure applied to said actuator, said actuator including bias means for biasing said arm for travel in an opposite, non-fuel limiting direction upon removal of fluid pressure from said actuator; pneumatic pressure fluid supply means including a source of air under superatmospheric pressure; conduit means connecting said fluid supply means and said actuator, and including solenoid valve means having an open position for applying said air to said actuator, and a closed position for venting air from said actuator to atmosphere; a speed sensing element responsive to one of vehicle or engine speed to generate a sensed signal responsive to sensed speed; system control means to receive said sensed signal, compare said signal to a preset signal level corresponding to a maximum permissible speed, and generate an electrical control signal when said sensed signal deviates from said preset signal level; means interconnecting said system control means to said valve means to actuate said valve means between said open and closed positions, according to the character of said electrical control signal; and air pressure restrictor means interposed between said pressure fluid supply means and said actuator, in the path of air applied to said actuator, to impede air flow to said actuator to slow extension of said arm in said fuel limiting direction, whereby said fuel is gradually restricted, permitting the speed of said vehicle to react to said reduced fuel flow during travel of said arm in said fuel limiting direction, and said restrictor means being out of the path of air venting to atmosphere from said actuator, whereby said arm is enabled to move relatively rapidly under the bias of said bias means in said non-fuel limiting direction, said restrictor means comprising a porous plug of limited permeability. 2. in a vehicle having a diesel engine having multiple cylinders and fuel supply means including multiple metering valves and injectors, one set for each of said cylinders, control means mechanically coupled to all said metering valves to control the volume of fuel delivered therefrom to said injectors, the improvement which comprises: (a) fluid pressure responsive actuator means having an actuator arm mechanically linked to said control means to effect movement thereof in a fuel limiting direction; (b) pneumatic pressure fluid supply means including a source of air under superatmospheric pressure; conduit means connecting said fluid supply means and said actuator means, and including solenoid valve means having an open position for applying said air to said actuator means, and a closed position for exhausting air from said actuator means to atmosphere, (c) a speed sensing element responsive to one of vehicle or engine speed to generate a sensed signal responsive to sensed speed; (d) control means to receive said sensed signal, compare said signal to a preset signal level corresponding to a maximum permissible speed and to generate an electrical control signal therefrom when said sensed signal deviates from said preset signal level; (e) means interconnecting said control means to said valve means to actuate said valve means in response to said electrical control signal, and to develop pneumatic pressure in or vent pneumatic pressure from said actuator means, according to the character of said electrical control signal; and (f) air pressure restrictor means in said pressure fluid supply means in the path of air applied to said actuator means to regulate flow of said air to said actuator means and dampen the response of said actuator means, said restrictor means comprising a porous plug of limited permeability and being out of the path of air exhausted from said actuator means whereby the flow of exhausting air is unimpeded to atmosphere. 3. the vehicle of claim 2 wherein said control means includes a rack coupled to said metering valves. 4. the vehicle of claim 3 wherein said engine includes a shut down lever moveably mounted and mechanically coupled to said rack, and shutdown lever actuation means coupled to said lever to effect sufficient movement of said lever to reposition said rack to a shut down position closing said metering valves to cease delivery of fuel therefrom and wherein said fluid pressure responsive actuator means is positioned to mechanically link its actuator arm to said shutdown lever. 5. the vehicle of claim 2 wherein said restrictor means comprises a sintered metal plug. 6. the vehicle of claim 5 wherein said actuator means comprises a cylinder and reciprocating piston with an inlet fitting having a through bore communicating with said pressure fluid supply means and said sintered metal plug is seated in said through bore. 7. the vehicle of claim 5 wherein said speed sensing element is responsive to vehicle speed. 8. the vehicle of claim 7 wherein said speed sensing unit is mounted adjacent to and senses the rotational speed of the driveshaft of said vehicle. 9. the vehicle of claim 2 wherein said solenoid valve is mounted on said actuator cylinder and positioned in the through bore of said inlet fitting. 10. the vehicle of claim 2 wherein said vehicle also includes manual shut down means to apply a control signal to said control valve. 11. the vehicle of claim 7 wherein said vehicle also includes sensing means responsive to any or all of engine conditions of coolant temperature and level and lubricating oil pressure and said control means is operatively connected to generate a control signal when any of said sensed engine conditions changes from a preset safe valve to a hazardous valve. 12. the vehicle of claim 2 wherein said speed sensing unit is mounted on said engine adjacent to and operatively responsive to the rotational speed of one of the engine camshaft and crankshaft. 13. the vehicle of claim 2 wherein said metering valve comprises a reciprocating hollow metering plunger with an inlet port and a sleeve slidably received over said plunger and said control means comprises fork means to adjustably position said sleeve over said inlet port. 14. the vehicle of claim 13 wherein said control means includes shut down lever means mechanically coupled to said fork means and wherein said actuator means is positioned to mechanically link to actuator arm to said shut down lever means.	background of the invention diesel-powered vehicles such as the commercial tracks and the like are frequently operated in excess of the safe and/or optimum conditions of engine and vehicle speed. the resistance of the operators of these vehicles to comply with posted and accepted safe maximum speed limits will ultimately result in provision for an automatic, self-contained unit limiting vehicle speed. such a control system is desirable not only for safety, but, also to prevent abuse of the vehicle and avoid premature engine and/or vehicle overhauls. the problems and expenses of installation of such control systems becomes enormous if applied to the millions of trucks which are presently in service. any system to be effective, therefore, must provide a very facile and inexpensive retrofitting of existing vehicles and, in particular, must not involve any substantial engine or vehicle modifications. the typical diesel-powered vehicle is not a simple vehicle for installing a retrofit speed governing device since many of such vehicles have engine compression braking whereby the exhaust valves of the engine are opened during the power stroke of the engine in the fuel shut-off or shut down mode so that the engine functions as an air compressor. accordingly, any attempted utilization of the shut down operation of the diesel engine for automatically responding to excessive vehicle and/or engine speed results in a very jerky and abrupt cycling of the vehicle, rendering the vehicle entirely unsuited for use. brief description of the invention this invention comprises a simple retrofit system for adapting diesel-powered vehicles to a speed control responsive to engine and/or vehicle speed. preferably, the system is responsive to vehicle speed and includes a speed sensing element responsive to speed of revolution of the drive shaft and/or an axle of the vehicle that generates a speed intelligent signal which is applied to a control unit and compared therein to a preset value corresponding to a maximum desirable engine and/or vehicle speed. if the sensed signal exceeds the preset value, the control means generates a control signal that is applied to a control valve located in a fluid pressure supply conduit communicating with a fluid pressure actuator which is operatively connected to the fuel control of the diesel engine. this invention includes a flow restrictor in the fluid supply conduit to the fluid pressure actuator which dampens the response of the actuator to the applied pressure, thereby avoiding abrupt surging of the engine and vehicle in response to the control means and permitting a smooth and effective governing action which does not otherwise interfere with normal vehicle operation. brief description of the drawings the invention will be described with reference to the figures of which: fig. 1 is a schematic of the control system as applied to a conventional diesel-power vehicle; fig. 2 illustrates a fuel injector of a conventional diesel engine; fig. 3 is an exploded view of a typical diesel engine governor system; figs. 4 and 5 illustrate retrofitting this invention to a conventional throttle delay mechanism of a diesel engine; figs. 6 and 7 illustrate alternative installations; and figs. 8-10 illustrate another alternative installation. description of preferred embodiments referring now to fig. 1, the invention is adapted to a conventional diesel-powered vehicle having the illustrated operative components. the vehicle has a diesel engine 10 which drives a transmission located within bell housing 12 and has a drive shaft 14 extending to a differential 16 at the rear axle 18. the diesel engine 10 is commonly provided with a fuel injection pump 20 having fuel lines discharging to the cylinder injectors such as 22. typically, the fuel pump 20 has a governor 24 which has throttle and shut down levers interconnected to manual and automatic control means of the vehicle. the invention comprises the use of a fluid responsive means, such as actuator 26, that is mechanically interconnected to the shut down lever of the vehicle. the fluid responsive actuator 26 is connected through conduit 28 to a control valve 30 which is functional to supply a source of fluid pressure, typically air pressure from reservoir 32 that is maintained at a superatmospheric pressure by blower or pump 34. typically, the control valve 30 is a three-way valve which can apply the pneumatic pressure to the actuator and/or exhaust the actuator to the atmosphere depending upon the setting of the valve. preferably, the control valve 30 is an electrical solenoid valve and is responsive to an electrical signal generated by the control means 36 and/or the manual shut down switch 38 which can apply the electrical voltage from storage battery 40 to the coil of the electrical solenoid valve 30. some of the diesel-powered vehicles have the aforementioned fluid actuator and fluid supply means. the control means of these vehicles frequently includes a sensor 44 that is responsive to the level of engine coolant, water and the like, or temperature of the coolant, element 46. such control systems can often include a sensor 48 responsive to the pressure of the lubricating oil of the engine. the aforementioned engines are adapted to speed control in accordance with the invention by positioning a speed responsive element 50 adjacent to and responsive to the rotational speed of the drive shaft 14 and/or rear axle 18 of the vehicle. the sensed signal generated by this sensing element 50 is applied to the control means 36 and compared therein to a preset electrical signal having a predetermined value whereby an excess value of the sensed signal generates a control signal that is applied through line 54 to the solenoid of the control valve 30. because the typical diesel-powered engine responds abruptly to actuation of the shut down lever, and because such abrupt response results in a very jerky operation of the vehicle, this invention also includes a flow restricting element 56 in the fluid supply conduit 28 to the fluid pressure actuator 24 of the engine. preferably this flow restricting element has a predetermined flow restriction to dampen the response of the shut down mechanism and achieve a smooth vehicle operation. a suitable element is a plug formed of metal particles, e.g., bronze particles, that are sintered together to form a body of limited permeability. the permeability of the plug can be controlled to precise values by the sintering conditions so that an infinite variation of permeability is available for selection to fit the particular application. in a typical embodiment for the engine of fig. 3, the permeability is selected to provide a cycle time of an actuator with a stroke of 1 inch from 4 to 5 seconds. other restrictor elements can also be used, however, the permeable, sintered metal plugs are preferred. referring now to fig. 2, the construction and operation of a typical fluid injector used on a commercial diesel engine will be described. the fuel injector 22 is a unit injector, one unit being employed for each of the cylinders of the engine. the fuel injector includes an injector plunger 60 that is reciprocally mounted in the through bore 62 of an injector housing 64. the housing has an inlet port 66 and a subjacent outlet port 68 communicating with through bore 62. the injector is mounted in the cylinder with its through bore 62 discharging into the cylinder and the inlet and outlet ports in communication with the fuel supply system. the plunger 60 is reciprocated in a timed relationship to the engine by a follower, not illustrated, which is axially aligned with the plunger and which is reciprocated by rocker arms, cams and the like, of the engine. the plunger has a reduced diameter segment 70 with a helix shoulder 72 at its uppermost junction with the full diameter portion of the plunger and a lower, full diameter head 74. the effective stroke of the plunger is the distance x which is the vertical separation between the outlet port 68 and the top shoulder of head 74 of the plunger when the helix shoulder 72 just covers the inlet port 66. the movement of the plunger through distance x meters and pressures an exact quantity of fuel into the cylinder. the rotation of plunger 60 will change the timing of the covering of the inlet port 66 with the helix shoulder 72 such that rotation in a counterclockwise direction as shown by arrowhead line 74 will provide covering of the inlet port 66 with shoulder 72 earlier in the stroke and thus increase the effective stroke length, distance x, and increase the fuel injected into the cylinder. the rotation of the plunger 60 is effected by the rack 76 which engages a gear 78 which is coupled to plunger 60. the rack 76 is distally carried by the control rack 80 of the injector which has a u-shaped bracket 82 which is mechanically coupled to a fuel control arm that is mounted on a fuel tube of the fuel control system which is described in greater detail with reference to fig. 3. the control system of the invention is applied to a speed limiting mechanical governor such as commonly employed with a conventional two-cycle supercharged diesel engine. an exploded view of the limiting speed governor is shown in fig. 3. this structure includes a governor housing 100 closed by a top coverplate 102 with a gasket 104. the centrifugal weight assembly of the governor is carried on shaft 106 and includes a pair of low speed weights 108 and a pair of high speed weights 110 which are pivotally mounted by weight pins 112 on a carrier bracket 114 that is secured to shaft 106. arms 116 of high speed weights 110 bear against a riser bushing 118 that is slidably mounted on shaft 106 together with a thrust bearing 120. shaft 106 is received in journal 122 with a thrust bearing 124 and lock washers 126 and retainer bolt 128. the assembly is sealed by plug 130 and gasket 132. the riser thrust bearing 120 bears against fork 134 which is secured to the throttle operating shaft 136, the latter shaft being mounted in a bracket (not shown) carried on the inside sidewall of the housing 100. bearings 138 and 140 are seated in the upper and lower brackets, respectively, to rotatably support operating shaft 136. the upper end of operating shaft 136 carries lever 142 to which is pivotally connected differential lever 144 by pin 146. link 148 extends into pinned connection to the operating control link being secured to the upper end of pin 152. the operating control link 150 is pivotally supported by pin 154 which is mounted in bracket 156 of housing 100. the fuel control rod 157 is secured to the operating control link 150 by pin 158 that extends into the fork end 160 of this member. the governor is connected to the fuel control system of the engine through the fuel control rods such as 157. in the particular application, the governor is illustrated for a v-8 diesel engine and the fuel rods 157 extend to opposite sides of the engine with each rod coupled to a control tube 159 to control the fuel injected in each of a bank of four cylinders. the control rod 157 is coupled to control tube 159 through a control lever 163 having a fork end which receives pin 165. the control tube is rotatably mounted by brackets 167 at its opposite ends and carries four rack levers 169. each rack lever has a finger 171 which is received in a respective u-shaped bracket 82 (see fig. 2). each rack lever 171 is mounted on its respective control tube 159 and secured thereto by a pin 173 which engages in a peripheral slot 175 of the control tube. the rack levers are resiliently mounted to the respective control tubes with torsion springs, not shown. the throttle control linkage is secured to shaft 162 carried on crank 164 and has a dependent pin 166 which is received in the fork end 168 of the differential level 144 thereby providing mechanical linkage from the throttle control to the fuel control rack of the engine. the stop lever of the mechanism which is utilized in the application of this invention is shown as lever 84 which is carried on the upper end of shaft 170 that also carries arm 172. arm 172 bears against the upper end of connecting pin 152 whereby movement of lever 84 in the direction shown by the arrowhead line 85 will cause a corresponding rotational movement of the operating control link 150 and effect a proportional rotation of the fuel rods such as 157 to decrease the fuel supply to the engine. resilient means in the form of a torsion spring 174 is mounted on shaft 170 to urge the lever 84 in a direction opposite that of the arrowhead line. the fluid responsive actuator 26 for the shut down lever 84 is commercially available for mounting on the governor housing 100 with a bracket 86 which is secured to the governing housing by machine screws 88. the bracket 86 has an upright side flange 89 and an upright end flange 90 having a central aperture 92. the actuator 26 comprises a conventional piston and cylinder actuator having an inlet port 94 to which conduit 28 (fig. 1) is secured. the actuator 26 is mounted on the bracket 86 by inserting the threaded neck 96 of the actuator 26 into aperture 92 and retaining it with nut 98. the piston rod 99 of the actuator 26 is mechanically linked to the shut down lever 84 of the governor assembly. this mechanical link can simply comprise a rounded head such as an acorn nut carried on the end of rod 99 that bears against the end of the shut down lever 84. the actuator assembly 26 bears internal resilient means such as a helical compression spring which is biased to urge retraction of the piston rod 99 and the shut down lever 84 is similarly biased by resilient means in the governor structure. the actuator 26 shown in fig. 3, distally carries the control valve 30 (fig. 1) and electrical lead 54 is connected to the terminal of the solenoid coil of the valve and extends to the control system 36 of the invention. the invention is readily adaptable to the conventional diesel engines without any significant structural modifications. the invention is employed in the system by the use of the fluid responsive actuator 26 and the installation of a vehicle speed transducer 50 to generate a vehicle speed intelligent signal to the control means 36. in some instances, the conventional vehicle speed transducer used with the vehicle's speedometer can be used directly, thus even further simplifying the installation. referring now to figs. 4 and 5, another embodiment of the invention will be described. fig. 4 illustrates a conventional acceleration delay mechanism that is present in diesel engines. the particularly illustrated one is mounted on the cylinder heads and is commonly found between the number 1 and number 2 cylinders on the right bank cylinder head. the assembly is mechanically coupled to the control tube 159 by u-bolt 121 that is secured to the acceleration delay lever 123. the latter is coupled to link arm 127 by pin 125. link arm 127 extends to a connection to piston 129 that is mounted in cylindrical bore 131. the cylindrical bore 131 is in casting 133 which has an oil reservoir 135 with a through bore 137 which communicates with the cylindrical bore 131 to supply oil thereto from reservoir 135. the reservoir 135 receives oil through fitting 139 which communicates with bore 141. a check valve 143 is provided in the assembly. the acceleration delay mechanism functions by dampening the rotational movement of the control tube 159. when the control tube is moved to rotate the injector racks towards the fuel shut-off position, the retraction of piston 129 draws air into cylindrical well 131 through check valve 143. when piston 129 uncovers the oil drain 137, the oil from reservoir 135 fills the cylindrical bore 131. depressing the throttle for acceleration of the engine causes piston 129 to advance into cylindrical well 131. this movement of the piston is retarded by displacement of the oil from the cylindrical well through the small diameter, calibrated orifice 145. the aforedescribed mechanism is retrofitted for the installation of the invention by tapping a threaded aperture 147 in the drain aperture 137 and fitting the tapped aperture 147 with a sealing plug 149. the counterbore 151 of the delay orifice 145 is also tapped and receives a threaded fluid pressure insert fitting 153. fitting 153 sealingly secures the fluid supply conduit 28 to this orifice, thereby converting the dampening piston 129 and cylindrical bore 131 into a fluid responsive actuator which can effect the control of the diesel engine in response to the sensed parameters previously described. referring now to fig. 6, there is illustrated a governor 11 and fuel injection pump 13 used for a conventional diesel engine. the injection pump 13 has a plurality of fuel delivery fittings 15, one for each of the cylinders of the engine and a cam shaft 17 which is driven by the engine and which drives the reciprocating pistons of the pump 13. the assembly also includes the fuel supply pump 19 with a fuel intake threaded fitting 21 and a preliminary fuel filter 23. this pump also includes a hand primer pump 25 for manual priming of the fuel supply pump. the governor 11 has control lever 27 which is mechanically connected to the throttle linkage for effecting movement of the rack (not shown) within injection pump 13. the shut-off lever 29 is also connected for movement of the rack to the shutdown position of the engine. the invention is applied to this pump and governor assembly by mounting of the actuator 26 to the pump housing with bracket 31 having a central aperture which receives a threaded neck of the actuator 26 and which is secured by nut 98. the outboard end of piston rod 99 bears against the shutdown lever 29 of the governor housing. the actuator 26 also includes the solenoid control valve 30 with the connecting leads 54 that receives a pressured fluid such as hydraulic fluid or air by a conduit which is connected to the threaded inlet port 94. fig. 7 illustrates another application of the actuator to a diesel engine governor. the governor housing has a cover plate 41 with a shutdown lever 43 which is coupled through shaft 45 to the rack of the fuel injection pump in a manner permitting displacement of the rack with pivotal movement of lever 43 whereby movement of lever 43 to the position 47 will effect complete displacement of the rack and shutdown of the engine. the actuator 26 is mounted to cover plate 41 of the governor by bracket 31 with machine bolts 49. the upright flange 51 of bracket 31 has a central aperture 52 which receives the threaded neck 96 of the actuator. the assembly is secured by nut 98 which is threadably secured to neck 96. the piston rod 99 of actuator 26 projects against the shutdown lever 43 that is resiliently biased against the end of piston rod 99 by springs carried internally of the governor. slidably mounted within the cylinder of actuator 26 is piston 53 which has a peripheral groove for o-ring 55. the control valve 30 has a cylindrical housing 57 that is permanently seated in the outboard end of the cylinder of actuator 26. this housing has a central valve seat 59 against which the reciprocal armature valve member 61 is seated. the valve housing is completed by the upper cylindrical member 63 which is threadably secured to the lower housing member 57. the electrical windings 65 of the solenoid are mounted about this member 63. member 63 has a small diameter throughbore 67 which is counterbored at 69 to receive a sintered metal plug 71 which has a closely controlled flow area for the hydraulic fluid whereby the restrictor member provides a predetermined delay in operation of the actuator, typically providing a four to five second time delay for effecting movement of piston 53 through a one inch stroke. the outer face of upper member 63 has a central cylindrical boss which bears external threads for receiving threaded union member 73 for attachment of a conduit supplying hydraulic fluid. referring now to fig. 8, there is illustrated a sectional view of a fuel injection system of a conventional diesel engine which is retrofitted with the actuator of the invention. the injection fuel pump 33 of this system has a housing supporting a rotatable shaft 35 which is driven by the engine and which has a plurality of cams 37. a plurality of individual pumps 39 are located in two banks 73 and 75, the number corresponding to the number of cylinders of the diesel engine. each individual pump 39 comprises a cylinder 77 with a reciprocating plunger 79 which bears a distal cam follower 81 in the form of a spherical bearing which is biased against the cam 37 by a helical compression spring 83. each plunger is slidably received in a pump sleeve 87 and an adaptor sleeve 42 which has a threaded neck 91 for the attachment of the nut 93 of a conduit which extends to the injector of the respective cylinder. each injection pump plunger 79 slidably supports a metering sleeve 95 which has an annular groove 97 which receives a finger 101 of control fork 103 which is mounted on rotatable shaft 105. shaft 105 also carries a timing gear 107 which meshes with gear 109 that is carried on shaft 111 which also carries lever 113. one end of lever 113 is beneath bracket 115 which supports the actuator 26 used in the invention. the actuator rod 99 extends into abutment against the end of lever 113 such that extension and retraction of the actuator rod 99 causes corresponding rotation of shaft 111 and of timing gear 107 whereby sleeve 95 can be fixedly adjusted in its position on plunger rod 79. the fuel control system also includes a rotatable control tube 117 with a corresponding control 119 for the positioning of the sleeves 95 of the opposite bank 75 of individual fuel injector pumps. the operation of the injector pumps will be explained with reference to fig. 9 which is a simplified illustration of the control system of fig. 8. as there illustrated, actuator 26 is positioned with the actuator rod 99 bearing against lever 113 carried on shaft 111 and mechanically linked to the timing gear 107 having the control fork 103 that slidably adjusts the up and down position of sleeve 95. the cam follower 81 rides on cam 37 carried on shaft 35, raising and lowering the injection pump plunger 79 within the end fitting 87. the plunger 79 is hollow with a closed lower end and has a lower spill port 155 and an upper fill port 161. these ports serve to permit the surrounding fuel 176 to enter the hollow center of the plunger 79. when the plunger 79 is moved upwardly by cam 37, the fill port 161 is covered by the end fitting 87 and the spill port 155 is covered by sleeve 95. when these ports are covered, the continued upward movement of plunger 79 compresses the fuel and forces it through conduit 177 to the injector 178 of cylinder 179 of the engine. from the structure, it can be seen that displacement of sleeve 95 downwardly to cover the spill port 155 earlier in the travel of plunger 79 will seal this port and permit delivery of a greater quantity of pressured fuel to injector 178, whereas the raising of sleeve 93 to maintain port 155 uncovered during a longer period, will reduce the quantity of fuel so injected. accordingly, the extension of rod 99 of actuator 26 of the invention will cause rotation of timing gear 107 in a counterclockwise direction as illustrated, raising the sleeve 93 and maintaining port 155 uncovered for a longer period of travel of the plunger 79, decreasing the fuel delivered to injector. the actual structure of the individual fuel injection pumps is shown in greater detail in fig. 10. as there illustrated, the sleeve 93 is shown on the pump plunger 79 having the lower spill port 155 and upper fuel fill port 161. the plunger 79 also has a spring retainer 180 which captures the helical coil spring 83 to bias the plunger and cam follower 81 against cam 37. the pressured fuel is delivered through a pressure regulator valve 181 having a helical coil compression spring 182 to permit lifting of the valve at a predetermined pressure within the injection pump. the fuel is discharged into the central through passageway 183 of fitting adapter sleeve 42. the aforedescribed system commonly employs a hydraulic actuator or electrical solenoid mounted in the position in which the actuator 26 of the invention is illustrated. these actuators effect a full displacement, sufficient to shut down the engine in an undampened, on-off operation. the direct use of such actuators in the speed control system of this invention would result in an abrupt and jerky response of the engine, particularly in engines which are provided with air compression braking. the use of the actuator of this invention with its internal flow dampening restrictor, however, provides a controlled and predetermined time delay in the complete travel of the actuator rod 99 and effects a smooth and controlled deacceleration and shutdown of the engine when activated by the control means 36. as shown in fig. 8, actuator 26 can be mounted on either side of the shaft 111 to operate on either end of lever 113; positioning the actuator to the right, above the longer arm of lever 113 will provide a slower response and require a greater displacement of actuator rod 99 to effect a complete shutdown of the engine then when the actuator is located in the illustrated position. the invention has been described with reference to the illustrated and presently preferred embodiment. it is not intended that the invention by unduly limited by this disclosure of the presently preferred embodiment. instead, the invention is intended to be defined by the means, and their obvious equivalents, set forth in the following claims.
154-820-754-151-680	JP	[ "JP", "NL", "FR", "GB", "DE", "US", "CA", "AU" ]	C25D13/00,C25B1/12,C25D1/12,C25D1/18,C25D13/04,C25D13/16,C25D17/00	1979-04-26T00:00:00	1979	[ "C25" ]	method and apparatus for formation of fibrous substance having electrophoresis charge by electrodeposition	purpose:to improve the strength, especially tear strength, by making flowing direction of suspension on the face of electrode electrodeposited the fibrous substance in two directions at least and forming by electrodeposition, at the time of carrying out electrodeposition formation of the fibrous substance having electrophoresis charge. constitution:two or more of the guide board 4 having spiral of at least one pitch or more, are provided in the electrodeposition apparatus. leading angle of the board 4 is made at 30 deg.-60 deg. (especially, 40 deg.-60 deg.). suspension of fibrous substance having electrophoresis charge which is supplied from the suspension supply opening 5, is flowed in two streams at least. on the one hand, direct current voltage is applied between both electrodes and the fibrous substance is accumulated and formed on the face of the cathode 3. at this time, electrodeposition formation is carried out orientating in flowing direction and formed body is obtained in laminated state of two layers by dividing the flow of the suspension in two. for this reason, the formed body having a high strength, is made.	1. a shaped article by electrodepositionally shaping a fibrous substance having an electrophoretic property in an aqueous suspension, said shaped article having a structure in which at least two layers of said fibrous substance are laminated in such a manner that the direction of orientation of said fibrous substance in said layer is different from layer after layer, and having a tensile strength of at least 2.5 kg/mm.sup.2 and a tear strength of at least 25 g.cm/cm. 2. a method for producing shaped articles composed of a fibrous substance having an electrophoretic property from an aqueous suspension of said fibrous substance by electrodepositional shaping, comprising giving at least two rotating motions different to each other to the flow of said aqueous suspension in the vicinity of the surface of an electrode onto which said fibrous substance is electrically deposited. 3. a method according to claim 2, wherein said at least two rotating motions are given to the flow of said aqueous suspension by installing at least two guide plates at the respectively different directions in the vicinity of said surface of said electrode. 4. a method according to claim 2, wherein said at least two rotating movements are given to the flow of said aqueous suspension by installing at least two spiral guide plates each having at least one pitch at the respectively different directions in the vicinity of said surface of said electrode. 5. an apparatus for electrodepositionally shaping a fibrous substance having an electrophoretic property comprising a vessel provided with at least one cathode, at least one anode and at least two guide plates installed at the respectively different directions in the vicinity of one of said electrodes onto which said fibrous substance is electrically deposited. 6. the apparatus according to claim 5, wherein each of said guide plates has a lead angle of 30.degree. to 60.degree.. 7. the apparatus according to claim 5, wherein said guide plates are installed at a distance of 1 to 13 mm apart from said surface of said electrode onto which said fibrous substance is electrically deposited. 8. an apparatus for electrodepositionally shaping a fibrous substance having an electrophoretic property comprising a vessel provided with at least one cathode, at least one anode and at least two spiral guide plates with at least one pitch installed at the respectively different direction in the vicinity of the surface(s) of said cathode(s) or anode(s) onto which said fibrous substance is to be electrically deposited. 9. the apparatus according to claim 8, wherein each of said spiral guide plates has a lead angle of 30.degree. to 60.degree.. 10. the apparatus according to claim 8, wherein said spiral guide plates are installed at a distance of 1 to 13 mm apart from said surface(s) of said cathode(s) or said anode(s) onto which said fibrous substance is to be electrically deposited.	background of the invention the present invention concerns a method for producing shaped articles having a high mechanical strength by applying a technique of electrodeposition on an aqueous suspension of a fibrous substance having an electrophoretic property, and an apparatus for producing the same. the herein used term, "a fibrous substance having an electrophoretic property" means a fibrous protein such as collagen contained in skins and tendons of mammals, fibroin in silk, keratin in hair, fibrinogen in blood, myosin in muscles and casein in milk, as well as polysaccharides having a fiber-forming property such as chitin and alginic acid. hitherto, methods for producing shaped articles such as casings for packing of sausages, threads for surgical operation, guts for tennis-racket and sheets for artificial skin by electrodepositional shaping of a fibrous substance having an electrophoretic property, for instance, a proteinous fibril such as collagen have been known. the above-mentioned publicly known method, for instance as is disclosed in japanese patent publication no. 13636/1971, comprises a process in which an aqueous suspension of the above-mentioned proteinous fibril is supplied into a vessel provided with at least one cathode and at least one anode, and by impressing a direct electric potential between the two electrodes, the above-mentioned proteinous fibril is accumulated electrodepositionally onto the surface of one of the electrodes to form shaped articles. in the above-mentioned method, when the ph of the above-mentioned aqueous suspension is adjusted to lower than 6, the proteinous fibrils are electrically deposited selectively on the surface of cathode, and on the other hand when it is adjusted to higher than 9, the proteinous fibrils are electrically deposited selectively onto the surface of the anode. however, in the above-mentioned method of electrodeposition, when the operation is continuously carried out, since the electrodeposited shaped articles are continuously removed away from the electrode and the aqueous suspension of the proteinous fibril is continuously supplied into the vessel of electrodeposition as a raw material, the proteinous fibrils in the aqueous suspension electrophoretically move to the almost same direction as the direction of the flow of the aqueous suspension (the aqueous suspension flows to a fixed direction in the vessel of electrodeposition) and deposit on the surface of electrode. accordingly, the electrodepositionally shaped articles have a structure in which the proteinous fibrils are oriented almost into one and same fixed direction and so, there is a defect that the article is mechanically weaker. in consideration of the above-mentioned situation, japanese patent publication no. 24257/1972 proposes the following method according to which the mechanical strength of the shaped articles obtained by the process of continuous electrodeposition will be improved. that is, in the case where an aqueous suspension of proteinous fibril of protein is continuously introduced into the vessel of electrodeposition in the same procedures as described above and the proteinous fibrils are electrically deposited from the suspension to the prescribed surface of the electrode, and the thus shaped articles by electrodeposition of the proteinous fibril is continuously removed from the vessel, the aqueous suspension in the vessel of electrodeposition is given a flow to the direction different from the direction of removing the shaped product and thus the fibrils being deposition in the shaped article take an entangled structure and the mechanical strength of the shaped article is improved. in addition, the apparatus for production of the above-mentioned shaped articles disclosed in the above-mentioned publication comprises a vessel for electrodeposition provided with at least one pillar-shaped electrode for the base of electrodeposition, at least one opposing electrode, a means for continuously removing the pipe-shaped articles electrically deposited on the surface of the above-mentioned electrode for the base of electrodeposition from the vessel for electrodeposition and a means for giving a flow of a different direction from the direction of removing the above-mentioned formulated objects to the aqueous suspension of proteinous fibrils, introduced into the vessel for electrodeposition. the means for giving the above-mentioned flow to the above-mentioned aqueous suspension disclosed in the above-mentioned publication comprises a method in which a spirally ascending flow is caused in the above-mentioned aqueous suspension by installing spiral ribbon(s) in the inner surface of the vessel for electrodeposition and by forwarding the aqueous suspension from the lower region of the vessel to the tangential direction against the cross section of the vessel, or a method in which a rotary flow is caused in the above-mentioned aqueous suspension by rotating a stirrer around the above-mentioned pillar-shaped electrode onto which the fibrous substance is to be electrodeposited, the stirrer having been installed on the opposite electrode or installed separately. however, according to the method and the apparatus disclosed in the above-mentioned japanese patent publication no. 24257/1972, although the proteinous fibrils in the shaped articles obtained as the articles electrodeposited onto the electrode have entangled mutually owing to the intra-vessel flow of the aqueous suspension into the different direction to the direction of removing the shaped articles, since the above-mentioned aqueous suspension has only one direction of rotation, the shaped article obtained as the electrodeposited body on the electrode is composed of a single layer in which only one and same structure substantially presents. accordingly, the mechanical strength of the shaped article obtained by the application of the above-mentioned method and apparatus is not satisfactory. the inventors of the present invention, as a result of studies based on the presumption that the mechanical strength of the electrodeposited shaped article consisting of the above-mentioned fibrous substance will be remarkably improved by giving the shaped article a laminated layer structure of the fibrous substance, each layer having direction of orientation of the fibrous substance different from each other, have found that in the process of electrodeposition, such laminated layers in the deposited shaped articles are available and as a result, the mechanical strength of the thus obtained shaped article is extremely improved by causing at least two flows different from each other in direction in the aqueous suspension of the above-mentioned fibrous substance during the operation of electrodeposition. accordingly, one object of the present invention is to offer a method for producing, from an aqueous suspension of an electrophoretic fibrous substance, the shaped articles excellent in mechanical strength comprising a structure of laminated layers of the fibrous substance, in which the direction of orientation of the fibrous substance in the layer is different from layer after layer. another object of the present invention is to offer an apparatus for producing continuously the above-mentioned shaped articles from the above-mentioned aqueous suspension of the fibrous substance. still another object of the present invention is to offer shaped articles having a high mechanical strength comprising laminated layers of the above-mentioned fibrous substance, the direction of the orientation of the fibrous substance in each layer of the laminated layers being different from layer after layer. brief explanation of drawings fig. 1 is a vertical sectional plan for the exemplification of the apparatus of the present invention, and fig. 2 is a vertical sectional plan for another exemplification of the apparatus of the present invention. fig. 3 is a sectional plan in the direction of a-a' of fig. 2. detailed description of the invention the characteristic feature of the present invention is, in the electrodeposition of a fibrous substance having an electophoretic property and having been suspended in an aqueous medium, to cause at least two flows different in direction in the aqueous suspension introduced into a vessel for electrodeposition, particularly in the vicinity of the surface of electrode onto which the fibrous substance in the aqueous suspension is deposited. accordingly, the characteristic feature of the apparatus of the present invention is the installation of the means for causing the above-mentioned flows in the above-mentioned aqueous suspension within the vessel for electrodeposition. the present invention will be explained in detail while referring to the drawings as follows: according to the process of the present invention, at the first place, an aqueous suspension of a fibrous substance having an electrophoretic property, as the starting material, is prepared by an ordinary procedure. for instance, in the case of using a raw hide of mamals as the starting material, it is finely cut by a slicer and after delining and fine-cutting by a refiner, it is brought into suspension in water at a content of about 1% of solid in the thus prepared suspension and the ph of the aqueous suspension is adjusted to lower than 6, for instance 3.5 to be the starting material. in the next place, the thus prepared aqueous suspension is introduced into a cylindrical vessel for electrodeposition shown in fig. 1. the cylindrical vessel 1 for electrodeposition (hereinafter referred to as e.d. vessel) for use in the process of the present invention is provided with at least one cylindrical anode 2 within e.d. vessel 1 and at least one cylindrical cathode 3 in the central region of e.d. vessel. around the cathode 3, two spirally formed guide plates 4 and 4' are installed, these guide plates being so designed that the flow of the above-mentioned aqueous suspension in e.d vessel is deflected into at least 2 mutually different directions by them. in the lower region of e.d. vessel 1, a supply port 5 for the aqueous suspension and in the upper region of e.d. vessel 1, a roller 6 for taking out the shaped articles electrodeposited onto cathode 3 from e.d. vessel 1 are respectively installed. in addition, the apparatus shown in fig. 1 is provided with a diaphragm 8 between anode 2 and cathode 3, and the acidic solution such as an aqueous hydrochloric acid solution is place between the diaphragm 8 and anode 2 to prevent the fluctuation of ph in the liquids in the anode chamber and the cathode chamber. in fig. 1, the outlet of the effluent aqueous suspension, the inlet for the acidic solution and the outlet for the acidic solution are shown by 7, 9 and 10, respectively. on carrying the electrodepositional shaping with the introduction of the aqueous suspension of the above-mentioned fibrous substance into the above-mentioned apparatus for electrodeposition, the aqueous suspension is introduced into e.d. vessel 1 from the supply port 5, and a direct electrical potential is applied between the above-mentioned anode 2 and cathode 3. then the introduced aqueous suspension flows along the above-mentioned guide plates 4 and 4' with a spiral motion, the direction of the spiral motion being, as is shown in fig. 1, counter clock-wise in the region at the lower part of cathode 3 by the guide plate 4, and on the other hand, clock-wise in the region at the upper part of cathode 3 by the guide plate 4'. naturally, almost all the length-wise directions of the respective fibrils in the aqueous suspension are equal to the direction of spiral motion of flow of the aqueous suspension, and accordingly, the shaped article formed by the electrodeposited fibrous substance onto the cathode 3 comprises laminated layers having different orientation of the fibrous substance from layer after layer. the apparatus according to the present invention, as is shown in fig. 1, in the case where the fibrous substance is to be electrodeposited onto the outer circumference of one electrode, may be provided with at least more than two guide plates 4(s) in spiral with at least more than one pitch, for instance four or six plates with their direction of spiral inversed alternately. in addition, it is preferable that the guide plates 4 are installed almost all over the surface of the electrode onto which the fibrous substance is electrodeposited, however, there are some cases where the guide plates are installed only at the end parts of the electrode. the lead angle of the above-mentioned guide plate 4 is preferably 30.degree. to 60.degree. , more preferably 40.degree. to 50.degree.. in the case of the angle of smaller than 30.degree., since the resistence of the plate to the liquid is too large, the liquid goes straight between the electrode and the guide plate with the result that the orientation of the fibrous substance is directed to the direction of the flow of the liquid. accordingly, the purpose of installing the guide plate is not achieved. on the other hand, in the case of the angle of larger than 60.degree., the effect of directing the orientation of the length-wise direction of the fibrous substance is too weak. accordingly, the angle of larger than 60.degree. is also unfavorable. in addition, it is preferable to install the guide plates at a distance of 1 to 13 mm, more preferably 3 to 8 mm apart from the surface of the electrode onto which the fibrous substance accumulates. figs. 2 and 3 show the other instances of the apparatus of the present invention, in which the e.d. vessel 1 is provided with two plate-shape electrodes 11 and 12 placed face to face. of these electrodes, in the vicinity of the surface of the electrode onto which the fibrous substance is to be electrodeposited (electrode 11 in figure), more than two guide plates 13, 13' . . . are installed, the plates having different directions. in addition, as the apparatus shown in fig. 1, the apparatus shown in figs. 2 (and 3) has the inlet 5 of the aqueous suspension, the roller 6 for taking out of the shaped articles, the supply port 9 for the acidic solution and the outlet 10 of the solution. on carrying out electrodeposition by the use of the apparatus shown in figs. 2 (and 3), the similar procedures to those taken in the operation of the apparatus shown in fig. 1 may be preferably taken. in this case, since the aqueous suspension of the fibrous substance introduced into e.d. vessel 1 flows along the guide plates 13, 13' . . . , the shaped articles, comprising laminated layers with each layer comprising the desposited fibrous substance having different direction of orientation from layer after layer corresponding to the number of guide plates installed in e.d. vessel 1, are obtained. for instance, with four guide plates so installed that their directions are different among them, the shaped articles with a four-layered structure in which the direction of orientation of the deposited fibrous substance is different from layer after layer are obtained. moreover, the multi-layered shaped articles are also available by altering the lead angle of the above-mentioned lead plates 13, 13' . . . in the range between 30.degree. to 60.degree. while altering the flow rate of the above-mentioned aqueous suspension in the range between 5 to 50 cm/sec during the operation of electrodeposition. by the way, it is naturally possible, in cases of electrodeposition of the above-mentioned fibrous fubstance using the apparatus shown in fig. 1 or 2, to have the fibrous substance deposited on the surface of anode by adjusting the ph of the aqueous suspension in an alkaline region. according to the present invention, other fiber-formable substances such as chitin and alginic acid than the proteinous fibers such as collagen, fibroin, keratin, fibrinogen, myosin and casein are possibly electrodeposited to be shaped articles, as has been described. in addition, the aqueous suspension of each substance for use in electrodeposition may contain several additives unless they give harmful effects on the operation of electrodeposition. as such an additive, for instance, reinforcing fibers, fillers, defoaming agents, surfactants, etc. may be mentioned. the content of solid matter in the above-mentioned aqueous suspension for use in electrodepositional shaping according to the present invention is not specifically limitative, and as in conventional methods, the content in percentage of 0.3 to 1.0% by weight based on the fibrous substance in dryness may be preferable. in addition, the temperature and the flow rate of the aqueous suspension in the process of electrodeposition according to the present invention as well as the voltage of direct current in that case may be adjusted not limitatively in accordance with the conventional method. according to the present invention, by selecting the form and shape of the electrode onto which the fibrous substance is electrodeposited, not only the pipe-form shaped articles but also variously shaped articles such as sheets for artificial skin, threads for surgical operations and guts for racket are optionally produced. since the shaped articles obtained according to the present invention comprise, as has been described, laminated layers with the direction of orientation of the layer-forming fibrous substance different from layer after layer, their mechanical strength in longitudinal direction is scarcely different from that in transversal direction, and they are extremely higher than the mechanical strength of the shaped articles obtained according to the conventional methods, and particularly, the tear-strength of the shaped articles obtained according to the present invention has been remarkably improved. the followings are the concrete explanation of the present invention while referring to examples, and the superiority of the present invention to the conventional methods is explained by the comparison to comparative examples of the conventional methods. example 1 an e.d. vessel comprising a cylindrical vessel made of vinyl chloride resin, 100 mm in inner diameter and 700 mm in height, provided with a cylindrical platinum wire netting of 75 mm in diameter as the anode therein, a diaphragm within the wire netting, a stainless-steel tube of 17 mm in outer diameter as the cathode in the central region of the vessel and a spiral-form guide plate around the above-mentioned anode, as shown in fig. 1 was used for electrodeposition. the lead angle of the above-mentioned guide plate was 45.degree., and the spiral had 4 pitches so that the aqueous suspension introduced into e.d. vessel rotated counterclockwise in the region at the lower part of the cathode and rotated clock-wise in the region at the upper part of the cathode. after introducing an aqueous hydrochloric acid solution of ph of 2.5 between the cathode and the diaphragm, an aqueous suspension of 0.5% by weight of fibrous collagen prepared in advance at ph of 3.6 was introduced from the supply port into the space between the cathode and the diaphragm at a flow rate of 25 cm/sec while applying a potential of 500 v between the electrodes to electrically deposit the fibrous collagen onto the cathode. the thus deposited tubular shaped articles were taken out from e. d. vessel by a roller installed at the upper part of the vessel at a pulling-up velocity of 8 m/min to be a collagen-casing (a) of 15 microns in thickness as the product. example 2 in e.d. vessel used in example 1, instead of the spiral guide plate, four plates designed to give rotating motions successively of counter clock-wise, clock-wise, counter clock-wise and then clock-wise to the flow of the aqueous suspension were installed. collagen casing (b) (with the thickness of 15 microns) was produced in the thus modified apparatus under the same conditions as in example 1. comparative example 1 except for using an e.d. vessel without the installation of spiral guide plate instead of using e.d. vessel of example 1, collagen casing (c) was produced in the same procedures as in example 1. comparative example 2 using an e.d. vessel provided with a stirrer around the cathode instead of the spiral guide plate for giving a rotary flow to the aqueous suspension, collagen casing (d) was produced by the same procedures as in example 1. comparison of the products of examples 1 and 2 and comparative examples 1 and 2 tensile strength and tear strength of the respective products (a), (b), (c), and (d) were determined in accordance with the respective methods of the japanese industrial standard (jis) p8113 and p8116. the results are shown in the following table: table ______________________________________ tensile strength tear strength item (kg/mm.sup.2) (g . cm/cm) specimen longitudinal transversal longitudinal transversal ______________________________________ (a) 2.7 2.8 30 32 (b) 2.7 2.9 38 35 (c) 2.8 1.5 12 20 (d) 2.5 1.8 15 21 ______________________________________ from the above-mentioned table, it will be easily understood that the collagen casings (a) and (b) obtained by the method of the present invention are remarkably superior to those (c) and (d) obtained in comparative examples according to the conventional methods in their tensile strength and tear strength.
155-608-721-195-351	US	[ "US" ]	C10L1/222,C10L1/18,C10L1/26,C07D207/50,C10L1/22,C10L1/238,C10L1/30,C10M169/04,C07D213/09,C10M133/26,C07D213/20,C10M133/04	2008-06-09T00:00:00	2008	[ "C10", "C07" ]	quaternary ammonium salt detergents for use in fuels	a quaternary ammonium salt detergent made from the reaction product of the reaction of: (a) a hydrocarbyl substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and (b) a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen and the use of such quaternary ammonium salt detergents in a fuel composition to reduce intake valve deposits.	1 . a fuel composition comprising: (a) a quaternary ammonium salt which comprises the reaction product of: a. the reaction of a hydrocarbyl-substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and b. quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen wherein the quaternizing agent is selected from the group consisting of dialkyl sulfates, benzyl halides, hydrocarbyl substituted carbonates; hydrocarbyl epoxides in combination with an acid or mixtures thereof; and (b) a fuel. 2 . the composition of claim 1 , wherein the hydrocarbyl-substituted acylating agent is polyisobutylene succinic anhydride. 3 . the composition of claim 1 , wherein the compound of (a) is a n-methyl-1,3-diaminopropane. 4 . the composition of claim 1 , wherein said fuel comprises a hydrocarbon fuel, a non-hydrocarbon fuel or a mixture thereof. 5 . (canceled) 6 . (canceled) 7 . the composition of claim 1 , further comprising a component selected from the group consisting of metal deactivators, detergents other than those of claim 1 , dispersants, viscosity modifiers, friction modifiers, dispersant viscosity modifiers, extreme pressure agents, antiwear agents, antioxidants, corrosion inhibitors, foam inhibitors, demulsifiers, pour point depressants, seal swelling agents, wax control polymers, scale inhibitors, gas-hydrate inhibitors and mixtures thereof. 8 . the composition of claim 7 , wherein the component is an overbased metal containing detergent, zinc dialkyldithiophosphates or mixtures thereof. 9 . the composition of claim 1 wherein the fuel comprises a gasoline as defined by astm specification d4814. 10 . the composition of claim 1 wherein the fuel comprises a diesel fuel as defined by astm specification d975. 11 . the composition of claim 1 wherein the fuel comprises an oxygenate. 12 . the composition of claim 1 wherein the fuel has a sulphur content on a weight basis that is 300 ppm or less. 13 . the composition of claim 1 wherein the quaternizing agent comprises dialkyl sulfates. 14 . the composition of claim 1 wherein the quaternizing agent comprises benzyl halides. 15 . the composition of claim 1 wherein the quaternizing agent comprises hydrocarbyl substituted carbonates. 16 . the composition of claim 1 wherein the quaternizing agent comprises hydrocarbyl epoxides in combination with an acid. 17 . the composition of claim 1 wherein said hydrocarbyl substituted acylating agent is the reaction product of (i) a long chain polyolefin substituted with a monounsaturated carboxylic acid reactant with (ii) a compound containing an olefinic bond represented by the general formula: (r 1 )(r 2 )c═c(r 6 )(ch(r 7 )(r 8 )) formula (i) wherein each of r 1 and r 2 is independently hydrogen or a hydrocarbon based group; each of r 6 , r 7 and r 8 is independently hydrogen or a hydrocarbon based group. 18 . the composition of claim 17 wherein at least one r of formula (i) is derived from polybutene wherein the olefinic bonds are predominantly vinylidene groups such that the component (ii) comprises at least about 30 mole % vinylidene groups. 19 . the composition of claim 18 wherein component (ii) comprises at least about 50 mole % vinylidene groups. 20 . the composition of claim 18 wherein component (ii) comprises at least about 70 mole % vinylidene groups.	cross-reference to related applications this application claims priority from application no. 60/691,115. background of the invention the composition of the present invention related to a quaternary ammonium salt detergent and the use of such quaternary ammonium salt detergents in a fuel composition to reduce intake valve deposits and remove or clean up existing deposits on the intake valves. it is well known that liquid fuel contains components that can degrade during engine operation and form deposits. these deposits can lead to incomplete combustion of the fuel resulting in higher emission and poorer fuel economy. fuel additives, such as detergents, are well known additives in liquid fuels to help with control or minimize deposit formation. as the dynamics and mechanics of an engine continual advance, the requirements of the fuel must evolve to keep up with these engine advancements. for example, today's engines have injector system that have smaller tolerances and operate at higher pressure to enhance fuel spray to the compression or combustion chamber. deposit prevention and deposit reduction in these new engines has become critical to optimal operation of today's engines. advancements in fuel additive technology, such as detergents, have enabled the fuel to keep up with these engine advancements. therefore there is a need for detergent capable of providing acceptable performance in a liquid fuel to promote optimal operation of today's engines. u.s. pat. no. 5,000,792 discloses polyesteramine detergent obtainable by reacting 2 parts of polyhydroxycarboxylic acids with 1 part of dialkylenetriamine. u.s. pat. no. 4,171,959 discloses a motor fuel composition containing quaternary ammonium salts of a succinimide. the quaternary ammonium salt has a counterion of a halide, a sulphonate or a carboxylate. u.s. pat. no. 4,338,206 and u.s. pat. no. 4,326,973 discloses fuel compositions containing a quaternary ammonium salt of a succinimide, wherein the ammonium ion is heterocyclic aromatic (pyridinium ion). u.s. pat. no. 4,108,858 discloses a fuel or lubricating oil composition containing a c2 to c4 polyolefin with a mw of 800 to 1400 salted with a pyridinium salt. u.s. pat. no. 5,254,138 discloses a fuel composition containing a reaction product of a polyalkyl succinic anhydride with a polyamino hydroxyalkyl quaternary ammonium salt. u.s. pat. no. 4,056,531 discloses a lubricating oil or fuel containing a quaternary ammonium salt of a hydrocarbon with a mw of 350 to 3000 bonded to triethylenediamine. the quaternary ammonium salt counterion is selected from halides, phosphates, alkylphosphates, dialkylphosphates, borates, alkylborates, nitrites, nitrates, carbonates, bicarbonates, alkanoates, and o,o-dialkyldihtiophosphates. u.s. pat. no. 4,248,719 discloses a fuel or lubricating oil containing a quaternary ammonium salt of a succinimide with a monocarboxylic acid ester. u.s. pat. no. 4,248,719 does not teach, suggest or otherwise disclose low sulphur fuels, presence of fluidisers etc. example 1 teaches polyisobutylene succinimide with dmapa as the amine. the succinimide is then reacted with a salicylate. u.s. pat. no. 4,253,980 and u.s. pat. no. 4,306,070 disclose a fuel composition containing a quaternary ammonium salt of an ester-lactone. u.s. pat. no. 3,778,371 discloses a lubricating oil or fuel containing a quaternary ammonium salt of a hydrocarbon with a mw of 350 to 3000; and the remaining groups to the quaternary nitrogen are selected from the group of c1 to c20 alkyl, c2 to c8 hydroxyalkyl, c2 to c20 alkenyl or cyclic groups. the present invention, therefore, promotes optimal engine operation, that is, increased fuel economy, better vehicle drivability, reduced emissions and less engine maintenance by reducing, minimizing and controlling deposit formation. summary of the invention the present invention further provides a method for fueling an internal combustion engine, comprising: a. supplying to said engine: i. a fuel which is liquid at room temperature; andii. quaternary ammonium salt comprising the reaction product of: (a) the reaction of a hydrocarbyl substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and(b) a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogenwherein the quaternizing agent is selected from the group consisting of dialkyl sulfates, benzyl halides, hydrocarbyl substituted carbonates; hydrocarbyl epoxides in combination with an acid or mixtures thereof. the present invention additionally provides for composition comprising an quaternary ammonium salt which comprises the reaction product of: a. the reaction of a hydrocarbyl-substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and b. a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen wherein the quaternizing agent is selected from the group consisting of dialkyl sulfates, benzyl halides, hydrocarbyl substituted carbonates; hydrocarbyl epoxides in combination with an acid or mixtures thereof. detailed description of the invention various preferred features and embodiments will be described below by way of non-limiting illustration. field of the invention this invention involves a quaternary ammonium salt, a fuel composition that includes the quaternary ammonium salt, and a method of operating an internal combustion engine with the fuel composition. the compositions and methods of the present invention minimize, reduce and control deposit formation in the engine, which reduces fuel consumption, promotes drivability, vehicle maintenance, and reduces emissions which enables optimal engine operation. fuel the composition of the present invention can comprise a fuel which is liquid at room temperature and is useful in fueling an engine. the fuel is normally a liquid at ambient conditions e.g., room temperature (20 to 30° c.). the fuel can be a hydrocarbon fuel, a nonhydrocarbon fuel, or a mixture thereof. the hydrocarbon fuel can be a petroleum distillate to include a gasoline as defined by astm specification d4814 or a diesel fuel as defined by astm specification d975. in an embodiment of the invention the fuel is a gasoline, and in other embodiments the fuel is a leaded gasoline, or a nonleaded gasoline. in another embodiment of this invention the fuel is a diesel fuel. the hydrocarbon fuel can be a hydrocarbon prepared by a gas to liquid process to include for example hydrocarbons prepared by a process such as the fischer-tropsch process. the nonhydrocarbon fuel can be an oxygen containing composition, often referred to as an oxygenate, to include an alcohol, an ether, a ketone, an ester of a carboxylic acid, a nitroalkane, or a mixture thereof. the nonhydrocarbon fuel can include for example methanol, ethanol, methyl t-butyl ether, methyl ethyl ketone, transesterified oils and/or fats from plants and animals such as rapeseed methyl ester and soybean methyl ester, and nitromethane. mixtures of hydrocarbon and nonhydrocarbon fuels can include for example gasoline and methanol and/or ethanol, diesel fuel and ethanol, and diesel fuel and a transesterified plant oil such as rapeseed methyl ester. in an embodiment of the invention the liquid fuel is an emulsion of water in a hydrocarbon fuel, a nonhydrocarbon fuel, or a mixture thereof. in several embodiments of this invention the fuel can have a sulphur content on a weight basis that is 5000 ppm or less, 1000 ppm or less, 300 ppm or less, 200 ppm or less, 30 ppm or less, or 10 ppm or less. in another embodiment the fuel can have a sulphur content on a weight basis of 1 to 100 ppm. in one embodiment the fuel contains about 0 ppm to about 1000 ppm, about 0 to about 500 ppm, about 0 to about 100 ppm, about 0 to about 50 ppm, about 0 to about 25 ppm, about 0 to about 10 ppm, or about 0 to 5 ppm of alkali metals, alkaline earth metals, transition metals or mixtures thereof. in another embodiment the fuel contains 1 to 10 ppm by weight of alkali metals, alkaline earth metals, transition metals or mixtures thereof. it is well known in the art that a fuel containing alkali metals, alkaline earth metals, transition metals or mixtures thereof have a greater tendency to form deposits and therefore foul or plug common rail injectors. the fuel of the invention is present in a fuel composition in a major amount that is generally greater than 50 percent by weight, and in other embodiments is present at greater than 90 percent by weight, greater than 95 percent by weight, greater than 99.5 percent by weight, or greater than 99.8 percent by weight. quaternary ammonium salt the composition of the present invention comprises an quaternary ammonium salt which comprises the reaction product of (a.) the reaction of a hydrocarbyl-substituted acylating agent and a compound having an oxygen or nitrogen atom capable of condensing with said acylating agent and further having a tertiary amino group; and (b) a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen wherein the quaternizing agent is selected from the group consisting of dialkyl sulfates, benzyl halides, hydrocarbyl substituted carbonates; hydrocarbyl epoxides in combination with an acid or mixtures thereof. examples of quaternary ammonium salt and methods for preparing the same are described in the following patents, which are hereby incorporated by reference, u.s. pat. no. 4,253,980, u.s. pat. no. 3,778,371, u.s. pat. no. 4,171,959, u.s. pat. no. 4,326,973, u.s. pat. no. 4,338,206, and u.s. pat. no. 5,254,138. the hydrocarbyl substituted acylating agent the hydrocarbyl substituted acylating agent of the present invention is the reaction product of a long chain hydrocarbon, generally a polyolefin substituted with a monounsaturated carboxylic acid reactant such as (i) α,β-monounsaturated c4 to c10 dicarboxylic acid such as fumaric acid, itaconic acid, maleic acid.; (ii) derivatives of (i) such as anhydrides or c1 to c5 alcohol derived mono- or di-esters of (i); (iii) α,β-monounsaturated c3 to c10 monocarboxylic acid such as acrylic acid and methacrylic acid.; or (iv) derivatives of (iii) such as c1 to c5 alcohol derived esters of (iii) with any compound containing an olefinic bond represented by the general formula: (r 1 )(r 2 )c═c(r 6 )(ch(r 7 )(r 8 )) (i) wherein each of r 1 and r 2 is, independently, hydrogen or a hydrocarbon based group. each of r 6 , r 7 and r 8 is, independently, hydrogen or a hydrocarbon based group; preferably at least one is a hydrocarbon based group containing at least 20 carbon atoms. olefin polymers for reaction with the monounsaturated carboxylic acids can include polymers comprising a major molar amount of c 2 to c 20 , e.g. c 2 to c 5 monoolefin. such olefins include ethylene, propylene, butylene, isobutylene, pentene, octene-1, or styrene. the polymers can be homopolymers such as polyisobutylene, as well as copolymers of two or more of such olefins such as copolymers of; ethylene and propylene; butylene and isobutylene; propylene and isobutylene. other copolymers include those in which a minor molar amount of the copolymer monomers e.g., 1 to 10 mole % is a c 4 to c 18 diolefin, e.g., a copolymer of isobutylene and butadiene; or a copolymer of ethylene, propylene and 1,4-hexadiene. in one embodiment, at least one r of formula (i) is derived from polybutene, that is, polymers of c4 olefins, including 1-butene, 2-butene and isobutylene. c4 polymers can include polyisobutylene. in another embodiment, at least one r of formula (i) is derived from ethylene-alpha olefin polymers, including ethylenepropylene-diene polymers. ethylene-alpha olefin copolymers and ethylene-lower olefin-diene terpolymers are described in numerous patent documents, including european patent publication ep 0 279 863 and the following u.s. pat. nos. 3,598,738; 4,026,809; 4,032,700; 4,137,185; 4,156,061; 4,320,019; 4,357,250; 4,658,078; 4,668,834; 4,937,299; 5,324,800 each of which are incorporated herein by reference for relevant disclosures of these ethylene based polymers. in another embodiment, the olefinic bonds of formula (i) are predominantly vinylidene groups, represented by the following formulas: wherein r is a hydrocarbyl group wherein r is a hydrocarbyl group. in one embodiment, the vinylidene content of formula (i) can comprise at least about 30 mole % vinylidene groups, at least about 50 mole % vinylidene groups, or at least about 70 mole % vinylidene groups. such material and methods for preparing them are described in u.s. pat. nos. 5,071,919; 5,137,978; 5,137,980; 5,286,823, 5,408,018, 6,562,913, 6,683,138, 7,037,999 and u.s. publication nos. 20040176552a1, 20050137363 and 20060079652a1, which are expressly incorporated herein by reference, such products are commercially available by basf, under the tradename glissopal® and by texas petrochemical lp, under the tradename tpc 1105™ and tpc 595™. methods of making hydrocarbyl substituted acylating agents from the reaction of the monounsaturated carboxylic acid reactant and the compound of formula (i) are well know in the art and disclosed in the following u.s. pat. nos. 3,361,673 and 3,401,118 to cause a thermal “ene” reaction to take place; u.s. pat. nos. 3,087,436; 3,172,892; 3,272,746, 3,215,707; 3,231,587; 3,912,764; 4,110,349; 4,234,435; 6,077,909; 6,165,235 and are hereby incorporated by reference. in another embodiment, the hydrocarbyl substituted acylating agent can be made from the reaction of at least one carboxylic reactant represented by the following formulas: (r 3 c(o)(r 4 ) n c(o))r 5 (iv) and wherein each of r 3 , r 5 and r 9 is independently h or a hydrocarbyl group, r 4 is a divalent hydrocarbylene group and n is 0 or 1 with any compound containing an olefin bond as represented by formula (i). compounds and the processes for making these compounds are disclosed in u.s. pat. nos. 5,739,356; 5,777,142; 5,786,490; 5,856,524; 6,020,500; and 6,114,547. in yet another embodiment, the hydrocarbyl substituted acylating agent can be made from the reaction of any compound represented by formula (i) with (iv) or (v), and can be carried out in the presence of at least one aldehyde or ketone. suitable aldehydes include formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isobutyraldehyde, pentanal, hexanal. heptaldehyde, octanal, benzaldehyde, and higher aldehydes. other aldehydes, such as dialdehydes, especially glyoxal, are useful, although monoaldehydes are generally preferred. in one embodiment, aldehyde is formaldehyde, which can be supplied as the aqueous solution often referred to as formalin, but is more often used in the polymeric form as paraformaldehyde, which is a reactive equivalent of, or a source of, formaldehyde. other reactive equivalents include hydrates or cyclic trimers. suitable ketones include acetone, butanone, methyl ethyl ketone, and other ketones. preferably, one of the two hydrocarbyl groups is methyl. mixtures of two or more aldehydes and/or ketones are also useful. compounds and the processes for making these compounds are disclosed in u.s. pat. nos. 5,840,920; 6,147,036; and 6,207,839. in another embodiment, the hydrocarbyl substituted acylating agent can include, methylene bis-phenol alkanoic acid compounds, the condensation product of (i) aromatic compound of the formula: r m —ar—z c (vi) wherein r is independently a hydrocarbyl group, ar is an aromatic group containing from 5 to about 30 carbon atoms and from 0 to 3 optional substituents such as amino, hydroxy- or alkyl-polyoxyalkyl, nitro, aminoalkyl, carboxy or combinations of two or more of said optional substituents, z is independently oh, lower alkoxy, (or 10 ) b or 11 , or o— wherein each r 10 is independently a divalent hydrocarbyl group, r 11 is h or hydrocarbyl and b is a number ranging from 1 to about 30. c is a number ranging from 1 to about 3 and m is 0 or an integer from 1 up to about 6 with the proviso that m does not exceed the number of valences of the corresponding ar available for substitution and (ii) at least on carboxylic reactant such as the compounds of formula (iv) and (v) described above. in one embodiment, at least one hydrocarbyl group on the aromatic moiety is derived from polybutene. in one embodiment, the source of hydrocarbyl groups are above described polybutenes obtained by polymerization of isobutylene in the presence of a lewis acid catalyst such as aluminum trichloride or boron trifluoride. compounds and the processes for making these compounds are disclosed in u.s. pat. nos. 3,954,808; 5,336,278; 5,458,793; 5,620,949; 5,827,805; and 6,001,781. in another embodiment, the reaction of (i) with (ii), optionally in the presence of an acidic catalyst such as organic sulfonic acids, heteropolyacids, and mineral acids, can be carried out in the presence of at least one aldehyde or ketone. the aldehyde or ketone reactant employed in this embodiment is the same as those described above. the ratio of the hydroxyaromatic compound: carboxylic reactant:aldehyde or ketone can be 2:(0.1 to 1.5):(1.9 to 0.5). in one embodiment, the ratio is 2:(0.8 to 1.1):(1.2 to 0.9). the amounts of the materials fed to the reaction mixture will normally approximate these ratios, although corrections may need to be made to compensate for greater or lesser reactivity of one component or another, in order to arrive at a reaction product with the desired ratio of monomers. such corrections will be apparent to the person skilled in the art. while the three reactants can be condensed simultaneously to form the product, it is also possible to conduct the reaction sequentially, whereby the hydroxyaromatic is reacted first with either the carboxylic reactant and thereafter with the aldehyde or ketone, or vice versa. compounds and the processes for making these compounds are disclosed in u.s. pat. no. 5,620,949. other methods of making the hydrocarbyl substituted acylating agent can be found in the following reference, u.s. pat. nos. 5,912,213; 5,851,966; and 5,885,944 which are hereby incorporated by reference. compound having a nitrogen or oxygen atom the composition of the present invention contains a compound having an oxygen or nitrogen atom capable of condensing with the acylating agent and further having a tertiary amino group. in one embodiment, the compound having an oxygen or nitrogen atom capable of condensing with the acylating agent and further having a tertiary amino group can be represented by the following formulas: wherein x is a alkylene group containing about 1 to about 4 carbon atoms; r2, r3 and r4 are hydrocarbyl groups. wherein x is a alkylene group containing about 1 to about 4 carbon atoms; r3 and r4 are hydrocarbyl groups. examples of the nitrogen or oxygen contain compounds capable of condensing with the acylating agent and further having a tertiary amino group can include but are not limited to: dimethylaminopropylamine, n,n-dimethylaminopropylamine, n,n-diethyl-aminopropylamine, n,n-dimethylaminoethylamine ethylenediamine, 1,2-propylenediamine, 1,3-propylene diamine, the isomeric butylenediamines, pentanediamines, hexanediamines, heptanediamines, diethylenetriamine, dipropylenetriamine, dibutylenetriamine, triethylenetetraamine, tetraethylenepentaamine, pentaethylenehexaamine, hexamethylenetetramine, and bis(hexamethylene) triamine, the diaminobenzenes, the diaminopyridines or mixtures thereof. the nitrogen or oxygen containing compounds capable of condensing with the acylating agent and further having a tertiary amino group can further include aminoalkyl substituted heterocyclic compounds such as 1-(3-aminopropyl)imidazole and 4-(3-aminopropyl)morpholine, 1-(2-amino ethyl)piperidine, 3,3-diamino-n-methyldipropylamine, 3′3-aminobis(n,n-dimethylpropylamine). another type of nitrogen or oxygen containing compounds capable of condensing with the acylating agent and having a tertiary amino group include alkanolamines including but not limited to triethanolamine, trimethanolamine, n,n-dimethylaminopropanol, n,n-diethylaminopropanol, n,n-diethylaminobutanol, n,n,n-tris(hydroxyethyl)amine, n,n,n-tris(hydroxymethyl)amine. quaternizing agent the composition of the present invention contains a quaternizing agent suitable for converting the tertiary amino group to a quaternary nitrogen wherein the quaternizing agent is selected from the group consisting of dialkyl sulfates, benzyl halides, hydrocarbyl substituted carbonates; hydrocarbyl epoxides in combination with an acid or mixtures thereof. in one embodiment the quaternizing agent can include halides, such as chloride, iodide or bromide; hydroxides; sulphonates; alkyl sulphates, such as dimethyl sulphate; sultones; phosphates; c1-12 alkylphosphates; di c1-12 alkylphosphates; borates; c1-12 alkylborates; nitrites; nitrates; carbonates; bicarbonates; alkanoates; o,o-di c1-12 alkyldithiophosphates; or mixtures thereof. in one embodiment the quaternizing agent may be derived from dialkyl sulphates such as dimethyl sulphate, n-oxides, sultones such as propane and butane sultone; alkyl, acyl or araalkyl halides such as methyl and ethyl chloride, bromide or iodide or benzyl chloride, and a hydrocarbyl (or alkyl) substituted carbonates. if the acyl halide is benzyl chloride, the aromatic ring is optionally further substituted with alkyl or alkenyl groups. the hydrocarbyl (or alkyl) groups of the hydrocarbyl substituted carbonates may contain 1 to 50, 1 to 20, 1 to 10 or 1 to 5 carbon atoms per group. in one embodiment the hydrocarbyl substituted carbonates contain two hydrocarbyl groups that may be the same or different. examples of suitable hydrocarbyl substituted carbonates include dimethyl or diethyl carbonate. in another embodiment the quaternizing agent can be a hydrocarbyl epoxides, as represented by the following formula, in combination with an acid: wherein r1, r2, r3 and r4 can be independently h or a c1-50 hydrocarbyl group. examples of hydrocarbyl epoxides can include, styrene oxide, ethylene oxide, propylene oxide, butylene oxide, stilbene oxide and c2-50 epoxide. oil of lubricating viscosity the composition of the present invention can contain an oil of lubricating viscosity. the oil of lubricating viscosity includes natural or synthetic oils of lubricating viscosity, oil derived from hydrocracking, hydrogenation, hydrofinishing, unrefined, refined and re-refined oils, or mixtures thereof. in one embodiment the oil of lubricating viscosity is a carrier fluid for the dispersant and/or other performance additives. natural oils include animal oils, vegetable oils, mineral oils or mixtures thereof. synthetic oils include a hydrocarbon oil, a silicon-based oil, a liquid ester of phosphorus-containing acid. synthetic oils may be produced by fischer-tropsch reactions and typically may be hydroisomerised fischer-tropsch hydrocarbons or waxes. oils of lubricating viscosity may also be defined as specified in the american petroleum institute (api) base oil interchangeability guidelines. in one embodiment the oil of lubricating viscosity comprises an api group i, ii, iii, iv, v or mixtures thereof, and in another embodiment api group i, ii, iii or mixtures thereof. miscellaneous the composition optionally comprises one or more additional performance additives. the other performance additives include metal deactivators, detergents, dispersants, viscosity modifiers, friction modifiers, dispersant viscosity modifiers, extreme pressure agents, antiwear agents, antioxidants, corrosion inhibitors, foam inhibitors, demulsifiers, pour point depressants, seal swelling agents, wax control polymers, scale inhibitors, gas-hydrate inhibitors and mixtures thereof. the total combined amount of the additional performance additive compounds present on an oil free basis ranges from 0 wt % to 25 wt % or 0.01 wt % to 20 wt % of the composition. although one or more of the other performance additives may be present, it is common for the other performance additives to be present in different amounts relative to each other. in one embodiment the composition can be in a concentrate forming amount. if the present invention may be in the form of a concentrate (which may be combined with additional oil to form, in whole or in part, a finished lubricant and/or liquid fuel), the ratio of the additive of the invention and/or other additional performance additives in an oil of lubricating viscosity and/or liquid fuel, to diluent oil is in the range of 80:20 to 10:90 by weight. antioxidants include molybdenum dithiocarbamates, sulphurised olefins, hindered phenols, diphenylamines; detergents include neutral or overbased, newtonian or non-newtonian, basic salts of alkali, alkaline earth and transition metals with one or more of phenates, sulphurised phenates, sulphonates, carboxylic acids, phosphorus acids, mono- and/or dithiophosphoric acids, saligenins, an alkylsalicylates, salixarates. dispersants include n-substituted long chain alkenyl succinimide as well as posted treated version thereof, post-treated dispersants include those by reaction with urea, thiourea, dimercaptothiadiazoles, carbon disulphide, aldehydes, ketones, carboxylic acids, hydrocarbon-substituted succinic anhydrides, nitriles, epoxides, boron compounds, and phosphorus compounds. antiwear agents include compounds such as metal thiophosphates, especially zinc dialkyldithiophosphates; phosphoric acid esters or salt thereof; phosphites; and phosphorus-containing carboxylic esters, ethers, and amides. antiscuffing agents including organic sulphides and polysulphides, such as benzyldisulphide, bis-(chlorobenzyl) disulphide, dibutyl tetrasulphide, ditertiary butyl polysulphide, di-tert-butylsulphide, sulphurised diels-alder adducts or alkyl sulphenyl n′n-dialkyl dithiocarbamates. extreme pressure (ep) agents including chlorinated wax, organic sulphides and polysulphides, such as benzyldisulphide, bis-(chlorobenzyl) disulphide, dibutyl tetrasulphide, sulphurised methyl ester of oleic acid, sulphurised alkylphenol, sulphurised dipentene, sulphurised terpene, and sulphurised diels-alder adducts; phosphosulphurised hydrocarbons, metal thiocarbamates, such as zinc dioctyldithiocarbamate and barium heptylphenol diacid. friction modifiers include fatty amines, esters such as borated glycerol esters, partial esters of glycerol such as glycerol monooleate, fatty phosphites, fatty acid amides, fatty epoxides, borated fatty epoxides, alkoxylated fatty amines, borated alkoxylated fatty amines, metal salts of fatty acids, fatty imidazolines, condensation products of carboxylic acids and polyalkylene-polyamines, amine salts of alkylphosphoric acids. viscosity modifiers include hydrogenated copolymers of styrene-butadiene, ethylene-propylene polymers, polyisobutenes, hydrogenated styrene-isoprene polymers, hydrogenated isoprene polymers, polymethacrylate acid esters, polyacrylate acid esters, polyalkyl styrenes, alkenyl aryl conjugated diene copolymers, polyolefins, polyalkylmethacrylates and esters of maleic anhydride-styrene copolymers. dispersant viscosity modifiers (often referred to as dvm) include functionalised polyolefins, for example, ethylene-propylene copolymers that have been functionalized with the reaction product of maleic anhydride and an amine, a polymethacrylate functionalised with an amine, or styrene-maleic anhydride copolymers reacted with an amine. corrosion inhibitors include octylamine octanoate, condensation products of dodecenyl succinic acid or anhydride and a fatty acid such as oleic acid with a polyamine. metal deactivators include derivatives of benzotriazoles, 1,2,4-triazoles, benzimidazoles, 2-alkyldithiobenzimidazoles or 2-alkyldithiobenzothiazoles. foam inhibitors include copolymers of ethyl acrylate and 2-ethylhexylacrylate and optionally vinyl acetate. demulsifiers include polyethylene glycols, polyethylene oxides, polypropylene oxides and (ethylene oxide-propylene oxide) polymers; pour point depressants including esters of maleic anhydride-styrene, polymethacrylates, polyacrylates or polyacrylamides. seal swell agents include exxon necton-37™ (fn 1380) and exxon mineral seal oil industrial application in one embodiment the invention is useful as a liquid fuel for an internal combustion engine. the internal combustion engine includes spark ignition and compression ignition engines; 2-stroke or 4-stroke cycles; liquid fuel supplied via direct injection, indirect injection, port injection and carburetor; common rail and unit injector systems; light (e.g. passenger car) and heavy duty (e.g. commercial truck) engines; and engines fuelled with hydrocarbon and non-hydrocarbon fuels and mixtures thereof. the engines may be part of integrated emissions systems incorporating such elements as; egr systems; aftertreatment including three-way catalyst, oxidation catalyst, nox absorbers and catalysts, catalyzed and non-catalyzed particulate traps optionally employing fuel-borne catalyst; variable valve timing; and injection timing and rate shaping. as used herein, the term “hydrocarbyl substituent” or “hydrocarbyl group” is used in its ordinary sense, which is well-known to those skilled in the art. specifically, it refers to a group having a carbon atom directly attached to the remainder of the molecule and having predominantly hydrocarbon character. examples of hydrocarbyl groups include: hydrocarbon substituents, that is, aliphatic (e.g., alkyl or alkenyl), alicyclic (e.g., cycloalkyl, cycloalkenyl) substituents, and aromatic-, aliphatic-, and alicyclic-substituted aromatic substituents, as well as cyclic substituents wherein the ring is completed through another portion of the molecule (e.g., two substituents together form a ring); substituted hydrocarbon substituents, that is, substituents containing non-hydrocarbon groups which, in the context of this invention, do not alter the predominantly hydrocarbon nature of the substituent (e.g., halo (especially chloro and fluoro), hydroxy, alkoxy, mercapto, alkylmercapto, nitro, nitroso, and sulfoxy); hetero substituents, that is, substituents which, while having a predominantly hydrocarbon character, in the context of this invention, contain other than carbon in a ring or chain otherwise composed of carbon atoms. heteroatoms include sulfur, oxygen, nitrogen, and encompass substituents as pyridyl, furyl, thienyl and imidazolyl. in general, no more than two, preferably no more than one, non-hydrocarbon substituent will be present for every ten carbon atoms in the hydrocarbyl group; typically, there will be no non-hydrocarbon substituents in the hydrocarbyl group. it is known that some of the materials described above may interact in the final formulation, so that the components of the final formulation may be different from those that are initially added. for instance, metal ions (of, e.g., a detergent) can migrate to other acidic or anionic sites of other molecules. the products formed thereby, including the products formed upon employing the composition of the present invention in its intended use, may not be susceptible of easy description. nevertheless, all such modifications and reaction products are included within the scope of the present invention; the present invention encompasses the composition prepared by admixing the components described above. examples the invention will be further illustrated by the following examples, which sets forth particularly advantageous embodiments. while the examples are provided to illustrate the present invention, they are not intended to limit it. the detergents are evaluated in the engine nozzle fouling test, as described in cec f-23-01. the results of the engine nozzle fouling test are highlighted in tables 1 and 2. the detergents that are used in this test include: a commercial available 1000 mn polyisobutylene succinimide of dimethylaminopropylamine (comparative example 1), a commercially available 1000 mn polyisobutylene succinimide of tetraethylenepentamine (comparative example 2) and 4 experimental detergents of the present invention (examples 1-4) as described below. preparatory example a preparatory example a is prepared from a mixture of succinic anhydride prepared from 1000 mn polyisobutylene (21425 grams) and diluent oil—pilot 900 (3781 grams) which are heated with stirring to 110° c. under a nitrogen atmosphere. dimethylaminopropylamine (dmapa, 2314 grams) is added slowly over 45 minutes maintaining batch temperature below 115° c. the reaction temperature is increased to 150° c. and held for a further 3 hours. the resulting compound is a dmapa succinimide. example 1 reaction product of preparatory example a, styrene oxide (12.5 grams), acetic acid (6.25 grams) and methanol (43.4 grams) are heated with stirring to reflux (˜80° c.) for 5 hours under a nitrogen atmosphere. the reaction is purified by distillation (30° c., −1 bar) and gave a water white distillate. the resulting compound is a styrene oxide quaternary ammonium salt. example 2 reaction product of preparatory example a (373.4 grams) is heated with stirring to 90° c. dimethylsulphate (25.35 g) is charged to the reaction pot and stirring resumed (˜300 rpm) under a nitrogen blanket, exotherm raises batch temperature to ˜100° c. the reaction is maintained at 100° c. for 3 hours before cooling back and decanting. the resulting compound is a dimethylsulphate quaternary ammonium salt. example 3 reaction product of preparatory example a (1735.2 grams) is heated with stirring to 90° c. under a nitrogen atmosphere. benzyl chloride (115.4 grams) is added drop wise maintaining reaction temperature at 90° c. the reaction is held for 5 hours at 90° c. the resulting compound is a benzyl chloride quaternary ammonium salt. example 4 the reaction product of preparatory example a (152.6 grams), dimethyl carbonate (31 grams) and methanol (26.9 grams) is charged to a pressure vessel. the vessel is then pressure tested for leaks and purged with nitrogen twice. the vessel is pressurized to ˜19 psi and the batch heated to 90° c. with agitation (˜210 rpm). the batch is held on temperature for one hour before being heated to 140° c. and held on temperature for 24 hours. on cooling back to ambient temperature residual pressure is released before decanting product. the reaction was purified by distillation (100° c., −0.5 bar) to remove free dimethyl carbonate and methanol. the resulting compound is a dimethyl carbonate quaternary ammonium salt. note: for comparative examples 1 and 2 the active chemical is accompanied by inert diluent oil in a ratio of active chemical to diluent oil of 85:15 by weight. note: for examples 1-4 the active chemical is accompanied by inert diluent oil in a ratio of active chemical to diluent oil of 50:50 by weight. table 1results in the cec f-23-01 injector deposit testdose rate activepercent remaining flowdetergent(ppm)(%)none0.011.0example 117.573.2example 117.546.4example 217.531.0example 217.524example 317.533.7example 41527.1note:unadditized base fuel (no detergent present in the fuel) table 2results in the cec f-23-01 injector deposit testdose rate activepercent remaining flowdetergent(ppm)(%)comparative ex. 25179comparative ex. 25163example 250100example 25098comparative ex. 238.2534comparative ex. 238.2532.4comparative ex. 238.2530example 238.576example 438.541example 438.572example 438.584comparative ex. 138.2584.0example 135.099.6example 135.084.8 the results of the test show that formulations using quaternary ammonium salt detergents of the present invention (examples 1, 2, 3, and 4) shows equivalent or superior flow performance and less average blockage of an injector compared to formulations using an unadditized fuel and/or commercially available detergents (comparative examples 1 and 2). the detergents are further evaluated in a high speed direct injection test. the high speed direct injection test is described as follows. a diesel fuel containing 1 ppm of zinc plus the respective detergent is inserted into a 2.0 l high speed direct injection (hsdi) ford puma engine. the engine is initially run at 2000 rev/minute for 5 minutes (engine warm-up period). after the initial warm up period, the engine is run in six (6) power curve iterations under the conditions set forth in table 3. after completion of the sixth power curve iteration, the engine is subjected to the stabilization period under the conditions set forth in table 4. after the stabilization period is complete, the engine is run in another six (6) power curve iterations under the conditions set forth in table 3. the power output of the engine is measured during the 9th stage of the power curve iteration. the power at this 9th stage during the final power curve iteration (12th power curve iteration) is compared to the power at the 9th stage of the first power curve iteration and a final power loss in percent is calculated. the less power loss present in the engine the more effective the detergent is at reducing or minimizing power loss. the results of the test are summarized in table 5. the detergents that are used in this test include: a commercial available 1000 mn polyisobutylene succinimide of dimethylaminopropylamine (comparative example 1), a commercially available 1000 mn polyisobutylene succinimide of tetraethylenepentamine (comparative example 2) and 3 experimental detergents of the present invention (examples 1, 2 and 4) as described above. table 3power curve iterationtimespeedstage(min)(rev/min)151000 ± 10251250 ± 10351500 ± 10451750 ± 10552000 ± 10652250 ± 10752500 ± 10853000 ± 10953300 ± 101053500 ± 101154000 ± 10note:the ramping time between stages is 27 seconds except for the ramp from stage 11 back to stage 1 which is 30 seconds. these ramp times are not included in the stage times (i.e. total duration of the schedule is (11 * 5 minute stages) + (10 * 27 second ramps) + (1 * 30 second ramp) giving a total cycle time of 60 minutes). table 4stabilization runtimespeedloadstage(hrs)(rev/min)(n-m)123000 ± 10150222020 ± 1095313500 ± 1080 table 5results in a high speed direct injection testdetergentdose rate active (ppm)% power loss at l7 hrsnone0.09.13none0.09.71example 117.51.85example 217.53.15example 4159.95comparative ex 138.258.35comparative ex 138.256.48comparative ex 238.255.30note:* unadditized diesel base fuel (no detergent present in the fuel) the results of the test show that formulations using quaternary ammonium salt detergents of the present invention (examples 1, 2, and 4) produce equivalent or reduced power loss compared to formulations using a unadditized fuel and/or commercial available detergents (comparative examples 1 and 2). each of the documents referred to above is incorporated herein by reference. except in the examples, or where otherwise explicitly indicated, all numerical quantities in this description specifying amounts of materials, reaction conditions, molecular weights, number of carbon atoms, and the like, are to be understood as modified by the word “about.” unless otherwise indicated, each chemical or composition referred to herein should be interpreted as being a commercial grade material which may contain the isomers, by-products, derivatives, and other such materials which are normally understood to be present in the commercial grade. however, the amount of each chemical component is presented exclusive of any solvent or diluent oil, which may be customarily present in the commercial material, unless otherwise indicated. it is to be understood that the upper and lower amount, range, and ratio limits set forth herein may be independently combined. similarly, the ranges and amounts for each element of the invention can be used together with ranges or amounts for any of the other elements. as used herein, the expression “consisting essentially of” permits the inclusion of substances that do not materially affect the basic and novel characteristics of the composition under consideration.
157-518-043-401-024	US	[ "WO" ]	A61J7/00,G16H20/13	2018-07-16T00:00:00	2018	[ "A61", "G16" ]	remote controlled medication dispenser	exemplary embodiments of the present disclosure are directed towards a remote controlled medication dispenser device and a method thereof. the device comprising: at least one medication dose uptake and tracking module adapted to (i) acquire predetermined parameters from a patient for analysis; and. (ii) store said data in a communicable database; at least one treatment administration module for remote administration of medical treatment; at least one interactive audio-visual input module adapted to acquire an identification of the patient prior to said remote treatment administration by said treatment administration module; at least one computerized software program either wire or wirelessly connected with said medication dose uptake and tracking module, adapted to (i) analyze said predetermined parameters acquired by said medication dose uptake and tracking module; and, (ii) enable said remote treatment administration by said treatment administration module; and a connection hub adapted to provide a connection with a plurality of treatment devices. additional embodiments may have few or more elements than outlined above, and provide remote or locally controlled physical treatments, exercise device remote control, energy-based therapies or remotely release substances other than medications.	claims what is claimed is: 1. a remote controlled personal or public kiosk substance or treatment dispensing device for use in homes, workplaces, vehicles, public places or the outback, said device comprising: at least one treatment administration module for remote administration of one or more of medications and substances, or for delivering one or more of physical and behavior based treatments or therapies; at least one of an audio, visual and audio-visual input module coupled to the at least one treatment administration module and adapted to perform one of more functions comprising of (i) one way or bidirectional communications (ii) acquiring an identification of a person or animal (iii) acquiring body language or verification of an action and event (iv) reading a bar code or quick response code; at least one or more receivers, transmitters or transceivers coupled to the at least one treatment administration module and configured to perform wireless or wired communications for preforming one or more of one way and bidirectional communications for one or more of short, medium and long distance communications. 2. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, wherein the therapies are selected from a group comprising of digitally controlled energies in one or more forms of light, infrared, magnetic, voice, movement, pneumatic, hydraulic, sonic, thermal, radio frequency, electrical or electronic treatments. 3. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, further comprising a keypad, a bar code reader, an rfid reader, a fingerprint reader, a voice print reader or a smart card reader, wherein the identification indicia provided by the patient comprises a corresponding keypad code entry, a bar code, an rfid tag, a fingerprint, a voice print or a smart card. 4. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, wherein the at least one treatment administration module comprises: at least one medication retention area a medication tray; and a medication dose opening. 5. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, wherein a configuration interface is responsive to a command provided to at least one treatment administration module by an authorized person to control the medication tray to present one of the medication retention areas carrying a medication dose through the medication dose opening prior to lapsing of the minimum dosing interval, wherein the authorized person excludes the patient. 6. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, wherein the medications are selected from a group comprising of low risk medications, medium risk medications and high risk medications. 7. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, further comprising a communications interface for communicating information between the remote controlled personal or public kiosk substance or treatment dispensing device and a remote communications device. 8. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1 is responsive to a remote computing device via a wired or wireless network for providing dosing information to the medication dispenser. 9. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, wherein the remote computing device is associated with one or more of a central pharmacy, a medication cart and a nurse’s station. 10. the remote controlled personal or public kiosk substance or treatment dispensing device of claim 1, further comprising a sensor for determining presence of a medication dose in any retention area. 11. a remote controlled medication dispenser device comprising: at least one medication dose uptake and tracking module adapted to (i) acquire predetermined parameters from a patient for analysis; and. (ii) store said data in a communicable database; at least one treatment administration module for remote administration of medical treatment; at least one interactive audio-visual input module adapted to acquire an identification of the patient prior to said remote treatment administration by said treatment administration module; at least one computerized software program either wire or wirelessly connected with said medication dose uptake and tracking module, adapted to (i) analyze said predetermined parameters acquired by said medication dose uptake and tracking module; and, (ii) enable said remote treatment administration by said treatment administration module; and a connection hub adapted to provide a connection with a plurality of treatment devices. 12. the remote controlled medication dispenser device of claim 11, wherein the predetermined parameters acquired from the patient is selected from a group comprising, verification of time, vitals, electronic health records, consumption and general condition of a patient. 13. the remote controlled medication dispenser device of claim 11, wherein the at least one at least one medication dose uptake and tracking module comprises: an image capturing device unit configured to acquire information regarding the medication dose uptake by the patient; an audio-visual input unit configured to enter details regarding the patient identification via voice or video screen; an alarm indicator unit configured to alert a remote caregiver regarding discrepancy in medical compliance; a speaker unit configured to provide instructions from the patient or remote caregiver; a sensor unit configured to provide combined input from the plurality of treatment devices. 14. the remote controlled medication dispenser device of claim 11, wherein the treatment administration module dispenses a medication dose upon receiving instructions by one or more or a combination of actions selected from a group comprising of: a remote live caregiver action, a remote artificial intelligence action, a local automatic action, a remote timed automatic action, a local artificial intelligence action, a patient action, a patient-helper authenticated action and combinations thereof. 15. the remote controlled medication dispenser device of claim 11, wherein the treatment administration module comprises an internal delivery mechanism to dispense a medication dose to the patient. 16. the remote controlled medication dispenser device of claim 11, wherein the treatment administration module comprises at least one locking-unlocking mechanism configured to release or not release the medication dose as per requirement. 17. the remote controlled medication dispenser device of claim 11, wherein the treatment administration module comprises at least one locking-unlocking mechanism is selected from a group comprising of a digital lock, a passphrase lock, a mechanical lock and combinations thereof to prevent unauthorized tampering with or removal of the medication dose. 18. the remote controlled medication dispenser device of claim 11, wherein the plurality of treatment devices selected from a group comprising of: brainwave, mental treatment, physical treatment devices and combinations thereof. 19. the remote controlled medication dispenser device of claim 11, wherein the plurality of treatment devices check muscle reactions, motor movements, blood analysis, fluid analysis, breath analysis and skin analysis. 20. the remote controlled medication dispenser device of claim 11, wherein remote administration of the at least one treatment administration module is linked to a remote caregiver distinct device or is controlled by the patient using a smart device. 21. the remote controlled medication dispenser device of claim 11, wherein a two way communication is established between the remote controlled medication device and a remote caregiver’s distinct device. 22. the remote controlled medication dispenser device of claim 11, wherein the two way communication is selected from a group consisting of (a) landline based communication; (b) radio frequency based communication; (c) satellite communication; (d) web server based communication; (e) incorporating a two way voice communication capability; (f) providing access to a remote artificial intelligence based expert system; any combination thereof. 23. the remote controlled medication dispenser device of claim 11, wherein the device is a stationary device. 24. the remote controlled medication dispenser device of claim 11, wherein the device is a portable device. 25. the remote controlled medication dispenser device of claim 11, wherein the device is portable and used in a vehicle. 26. the remote controlled medication dispenser device of claim 11, wherein the device is a smaller version enable for injection, infusion and implantable purposes. 27. a method of remote monitoring patients and provisioning medical treatment, said method comprising: obtaining a remote controlled medication dispenser device, comprising: i. medication dose uptake and tracking module adapted to (i) acquire predetermined parameters from a patient for analysis; and (ii) store said data in communicable database; ii. at least one treatment administration module for remote administration of medical treatment; and iii. at least one computerized software program either wire or wirelessly connected with said medication dose uptake and tracking module, adapted to (i) analyze said predetermined parameters acquired by said medication dose uptake and tracking module; and (ii) enable said remote treatment administration by said treatment administration module; interconnecting said medication dose uptake and tracking module and said treatment administration module to said patient; monitoring said patient’s condition by means of said medication dose uptake and tracking module; either wire or wirelessly analyzing said predetermined parameters; thereby diagnosing said patient; and based on said predetermined parameters, treating said patient. 28. the method of claim 27, further comprising step of enabling said remote treatment administration by said treatment administration module by an expert system. 29. the method of claim 27, further comprising implanting remote controlled medication dispenser device under the patient’s skin. 30. the method of claim 27, wherein unauthorized use of the device triggers a warning signal. 31. the method of claim 27, further comprising: receiving a signal from a remote monitoring system to dispense medication; and in response to the receiving the signal from the remote monitoring system to dispense medication, automatically dispensing the medication at the remote controlled medication dispenser device. 32. the method of claim 27, wherein the control signal is received based on input from one or more of: a remote caregiver; an artificial intelligence system for diagnosing or treating medical conditions; one or more health or medical condition monitoring devices coupled to the remote controlled medication dispenser device or the remote monitoring system; and input from a patent receiving the medication via audio visual input devices of the remote controlled medication dispenser device.	remote controlled medication dispenser field of the invention [0001] the invention relates to medical devices and more particularly, to a medication dispenser for providing medication releases and/or verification of consumption. summary of the invention [0002] currently, there are a number of solutions for home medication dispensers. some of these solutions attempt to control access to the medications by using a timer to release a dose along with lights and noise to alert the person that it is time to take their medications. but these solutions fail to meet the needs of the healthcare industry and the people at risk for medication non-adherence, as for instance there is no way to know if the person is present, well-enough and ready to receive their medications, and whether they actually take their medication once released with enough liquid and at the time of release. other solutions attempt medication compliance in a simple manner but are unable to meet the needs of the millions of persons at risk for medication non-compliance. people are frequently admitted or re-admitted to the hospital resulting from medication non-compliance issues. people can also become unnecessarily dependent on opioids and other controlled substances. senior citizens often forget to take their medications and/or take too little or too much, etc. a patient will typically try to remember times at which medications need to be taken. unfortunately, this mental calculation or memorization technique often works poorly and is error prone. even if the correct times are remembered, they are often missed. poor vision has also been identified as another significant factor leading to non- compliance. patients who are unable to read the labels affixed to medication containers find it hard to adhere to a medication regimen. physical impediments, such as arthritis, make it complicated for patients to reach out and open the medication containers. [0003] current portable medication dispensers which include timing and alarm devices provide the reminder through a variety of signaling indicators, such as audible alarms, and promote compliance to a scheduled dosing regimen, do not control nor prevent patient access to the medications at intervals shorter than prescribed. [0004] none of the existing devices are reliable to accommodate the large-scale distribution of appropriate medication doses to the patients in a timely, uncomplicated manner. therefore, there is a significant need for a suitably structured remote controlled medication dispenser for use in patients that may control the medication doses in a synchronized manner, provide additional layers of security so that the medication is remotely monitored by a patient’s caregiver and may be paired with additional medical treatment devices and devices that can monitor important medical parameters of the patient to aid in diagnosis and also to help prevent further health deterioration. [0005] in an example embodiment includes a remote-controlled, remotely programmable or locally-controlled medication dispenser. the medication dispenser disclosed herein may be used by way of example for various related alternative embodiments such as remotely delivered treatment/therapy devices, remotely controlled exercise devices and remotely delivered substance devices. [0006] various embodiments of the present disclosure overcome the problems and disadvantages of the known prior devices by providing a safe, practical, remote controlled medication dispenser device to enable timely dispersal of medications and minimizing the occurrence of medical non-compliance. [0007] various embodiments of the present disclosure improve over existing technology by including a system that provides a remote controlled medication dispenser that is easy to use and is economical. [0008] various embodiments of the present disclosure improve over existing technology by including a system that provides a home, school, workplace or public medication dispenser built to only dispense via remote control or for dispensing via multiple levels of security, from no to low security to intermediate locked security levels (for example only: provided artificial intelligence (ai) programming) up to a higher locked level which is unlocked by a remote caregiver while preferably videoconferencing with the patient, client, person, senior or onsite health aide. [0009] various embodiments of the present disclosure improve over existing technology by including a system that provides verification of time, vitals, electronic health records (ehrs), consumption and general condition and mode of a person or animal which maybe optionally enabled by the features of a medical device. [0010] various embodiments of the present disclosure improve over existing technology by including a system that provides the aforementioned device programmed (locally or remotely) and constructed to be a connection and hub for various monitoring devices, brainwave, mental treatment, physical treatment, therapy, exercise device and for dispensers for dispensing other substances. [0011] various embodiments of the present disclosure improve over existing technology by including a system that provides devices that can be remotely and/or locally controlled or programmed. [0012] various embodiments of the present disclosure improve over existing technology by including a system that provides a secured medication (or other substances/objects) storage and dispenser vault with an optional anti -tamper and/or anti theft protection. [0013] various embodiments of the present disclosure improve over existing technology by including a system that provides a provision to record any non-compliant use or abuse of the remote controlled medication dispenser. [0014] various embodiments of the present disclosure improve over existing technology by including a system that provides an enclosure to strategically embed a at least one image capturing device such as camera or and display and/or video monitor speaker, microphone (or by interfacing with a smart phone or other smart device may use such connected external device components) for video-conferencing and at least one operational mode which requires the release of a medication dose by a remote caregiver and/or in other secured modes by an ai process or combination or alternating of a caregiver and ai. [0015] various embodiments of the present disclosure improve over existing technology by including a system that provides the aforementioned technological features in a remote controlled medication dispenser that may be stationary, mobile, wearable or modular having other medical devices that enable injection, infusion and implantable med-devices. [0016] other improvements and features of the present invention will become apparent when viewed in light of the detailed description of the various embodiments when taken in conjunction with the attached drawings and appended claims. brief description of the drawings [0017] the foregoing and other features of the present disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. etnderstanding that these drawings depict only several examples in accordance with the disclosure and are, therefore, not to be considered limiting in scope, the disclosure will be described with additional specificity and detail through the use of the accompanying drawings. the components in the drawings are not necessarily to scale relative to each other. like reference numerals designate corresponding parts throughout the several views. [0018] fig. 1 depicts a schematic representation of a remote controlled medication dispenser device system for providing medication doses, preventing misuse of controlled substances and tracking of a medication patient’s dose uptake by a care giver or any other authorized healthcare personnel via a video conferencing or camera and report the medication uptake reports to healthcare personnel or care giver or authorized personnel, in accordance with one or more exemplary embodiments. [0019] fig. 2 is a block diagram illustrating the details of digital processing system 200 in which various aspects of the present disclosure are operative by execution of appropriate software instructions, in accordance with one or more exemplary embodiments. [0020] fig. 3 is a block diagram illustrating the details of digital processing system 300 present in a remote controlled medication dispenser device wherein various aspects of the present disclosure are operative by execution of appropriate software instructions in communication with other treatment devices, in accordance with one or more exemplary embodiments. [0021] fig. 4 is a diagram illustrating a method for remote dispensing of medication, in accordance with one or more exemplary embodiments. detailed description [0022] in the following detailed description, reference is made to the accompanying drawings, which form a part hereof. in the drawings, similar symbols typically identify similar components, unless context dictates otherwise. the illustrative examples described in the detailed description, drawings, and claims are not meant to be limiting. other examples may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. it will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, may be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are explicitly contemplated herein. [0023] the use of“including”,“comprising” or“having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. the terms“a” and“an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. further, the use of terms“first”,“second”, and“third”, and the like, herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. [0024] the present disclosure is generally drawn to systems related to provide a remote controlled medication dispenser and a method of administration of medications by the aid of the remote controlled medication dispenser disclosed herein. [0025] in an exemplary embodiment, a remote controlled personal or public kiosk substance or treatment dispensing device for use in homes, workplaces, vehicles, public places or the outback is disclosed comprises: at least one treatment administration module for remote administration of one or more of medications and substances, or for delivering one or more of physical and behavior based treatments or therapies; at least one of an audio, visual and audio-visual input module coupled to the at least one treatment administration module and configured to perform one of more of (i) one way or bidirectional communications (ii) acquiring an identification of a person or animal (iii) acquiring body language or verification of an action and event (iv) reading a bar code or quick response code; at least one or more receivers, transmitters or transceivers for wireless or wired communications for preforming one or more of one way and bidirectional communications for one or more of short, medium and long distance communications. [0026] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device, wherein the therapies are selected from a group comprising of digitally controlled energies in one or more forms of light, infrared, magnetic, voice, movement, pneumatic, hydraulic, sonic, thermal, radio frequency, electrical or electronic treatments. [0027] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device, further comprising a keypad, a bar code reader, an rfid reader, a fingerprint reader, a voice print reader or a smart card reader, wherein the identification indicia provided by the patient comprises a corresponding keypad code entry, a bar code, an rfid tag, a fingerprint, a voice print or a smart card. [0028] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device, wherein the at least one treatment administration module comprises: at least one medication retention area 124 a medication tray 126; and a medication dose opening 128. [0029] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device 101 includes a configuration interface responsive to a command provided to at least one treatment administration module by an authorized person to control the medication tray 126 to access one of the medication retention areas 124 carrying a medication dose to present the medication at the pre- defined dose through the medication dose opening 128 prior to lapsing of the minimum dosing interval, wherein the authorized person excludes the patient. [0030] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device 101, is a device in which the medications are selected from a group comprising of low risk medications, medium risk medications and high risk medications. [0031] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device 101, further comprises a communications interface for communicating information between the remote controlled personal or public kiosk substance or treatment dispensing device and a remote communications device. [0032] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device 101 is responsive to a remote computing device via a wired or wireless network for providing dosing information to the medication dispenser. [0033] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device 101, is coupled to a remote computing device that is associated with one or more of a central pharmacy, a medication cart and a nurse’s station. [0034] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device, further comprises a sensor device 116 for determining presence of a medication dose in any retention area 124. although the sensor device 116 is shown in fig. 1 as connected to the remote controlled medication dispenser device 101 via a network 106, the sensor 116 may be a part of or integrated with the controlled medication dispenser device 101. [0035] in an exemplary embodiment, the remote controlled personal or public kiosk substance or treatment dispensing device 101 may be optionally coupled to an entertainment module (not shown) to provide entertainment to the patient. [0036] in an embodiment, the entertainment module may be selected from a group comprising a portable radio, an ipad, ipod, and a portable television. [0037] referring to fig. 1, fig. 1 is a block diagram 100 representing a system in which aspects of the present disclosure can be implemented. specifically, fig. 1 depicts a schematic representation of a remote controlled medication dispenser system including a remote controlled medication dispenser device 101 for providing medication doses, prevent misuse of controlled substances and tracking of a medication patient’s dose uptake by a care giver or any other authorized healthcare personnel via a video conferencing or camera and report the medication uptake reports to healthcare personnel or care giver or authorized personnel, in accordance with one or more exemplary embodiments. the system 100 includes a first computing device 102 which may be, comprise, be connected to, be part of or include the remote controlled medication dispenser device 101, and a second computing device 104 operatively coupled to each other through a network 106. the network 106 may include, but is not limited to, an ethernet, a wireless local area network (wlan), or a wide area network (wan), a bluetooth low energy network, a zigbee network, a wifi communication network e.g ., the wireless high speed internet, or a combination of networks, a cellular service such as a 4g (e.g, lte, mobile wimax) or 5g cellular data service, a rfid module, a nfc module, wired cables, such as the world- wide- web based internet, or other types of networks may include transport control protocol/intemet protocol (tcp/ip) or device addresses (e.g, network-based mac addresses, or those provided in a proprietary networking protocol, such as modbus tcp, or by using appropriate data feeds to obtain data from various web services, including retrieving xml data from an http address, then traversing the xml for a particular node) and so forth without limiting the scope of the present disclosure. the system 100 is preferably realized as a computer-implemented system in that the first and second computing devices (102, 104) are configured as computer-based electronic devices. [0038] although the first and second computing devices 102, 104 are shown in fig. 1, an embodiment of the system 100 may support any number of computing devices. the system 100 may support only one computing device (102 or 104). the computing devices 102, 104 may include, but are not limited to, a desktop computer, a personal mobile computing device such as a tablet computer, a laptop computer, or a notebook computer, a smart phone, a video game device, a digital media player, a piece of home entertainment equipment, backend servers hosting database and other software, and so forth. each computing device 102, 104 supported by the system 100 is realized as a computer-implemented or computer-based device having the hardware or firmware, software, and/or processing logic needed to carry out the intelligent messaging techniques and computer-implemented methodologies described in more detail herein. the first computing device 102 and/or the second computing device 104 may be configured to display and/or implement features of a medication dose uptake and tracking module 108 (also referred to as a medication dispensing module). the features may be analyze or facilitate analysis of the medication dose uptake by the patients and track the patients who fail to take the appropriate medication dose, any unauthorized uptake of medicines by unauthorized personnel and so forth. the first user may include, but not limited to, an individual patient, a group of patients, elderly people, drug or substance abusers, and so forth. the first computing device 102 may be operated by a first user and the second computing device 104 may be operated by a second user. the first user may include a patient. the second user may include, but not limited to, a health enforcement officer, a caregiver, nurse, doctor, patient’s relative, a volunteer, a paramedical personnel, and so forth. for example, the first computing device 102 captures information regarding uptake of a medication dose at a particular time interval as specified by the doctor and then sends this information to the second computing device 104. where the first computing device 102 and the second computing device 104 may be operated by the first user and the second user. [0039] the first computing device 102 and/or the second computing device 104 may include the medication dose uptake and tracking module 108 which is accessed as a mobile application, web application, software that offers the functionality of mobile applications, and viewing/processing of interactive pages, for example, are implemented in the first and second computing devices 102, 104 as will be apparent to one skilled in the relevant arts by reading the disclosure provided herein. the medication dose uptake and tracking module 108 may be downloaded from the cloud server (not shown). for example, the medication dose uptake and tracking module 108 may be configured to be downloaded from google play® (for google android devices), apple inc.’s app store® (for apple devices), or any other suitable database. in some embodiments, the medication dose uptake and tracking module 108 maybe software, firmware, or hardware that is integrated into the first and second computing devices 102 and 104. the medication dose uptake and tracking module 108 may be an artificial intelligence powered, need-based, or social networking service to enable real-time analyzations (for example, medication uptake image analyzation). [0040] the first computing device 102 and/or the second computing device 104 may be configured to enable the first user and/or the second user to capture the medication uptake information of the patient and upload the same to the medication dose uptake and tracking module 108. the first computing device and/or the second computing device 104 may include, be connected to or be configured to connect to a treatment administration module 110 for remote administration of medical treatment and an interactive audio-visual input module 112 adapted to acquire an identification of the patient prior to said remote treatment administration by said treatment administration module 110. the interactive audio-visual input module 112 may include or be connected to an image capturing device 109. the uptake of the medication dose may be captured by an image capturing device 109. the image capturing device 109 may include but is not limited to: a camera, video camera, web camera and so forth. for example, the first computing device 102 and/or the second computing device 104 are configured to facilitate the reporting by the first user and/or second user via uploads of the medication uptake content. the medication dose uptake and tracking module 108 may be configured to parse out the medication uptake content into data points and then analyzes, reconfigures, and reports the data points to clearly reveal trends in categories on the first computing device 102 and/or the second computing device 104. the first computing device 102 and/or the second computing device 104 enables the medication dose uptake and tracking module 108 to display one or more pieces of medication dose uptake information and map the same to the patients that have logged into the database (not shown). the mapping of medication uptake content correlated with an individual patient showing the patient’s movements and other vital parameters activity information. [0041] according to a preferred embodiment, the remote controlled medication dispenser is a stationary device. the remote controlled medication dispenser device 101 may comprise: at least one medication dose uptake and tracking module 108 adapted to (i) acquire predetermined parameters from a patient for analysis; and. (ii) store said data in a communicable database; at least one treatment administration module 110 for remote administration of medical treatment; at least one interactive audio-visual input module 112 adapted to acquire an identification of the patient prior to said remote treatment administration by said treatment administration module; at least one computerized software program either wire or wirelessly connected with said medication dose uptake and tracking module 108, adapted to (i) analyze said predetermined parameters acquired by said medication dose uptake and tracking module; and, (ii) enable said remote treatment administration by said treatment administration module; and a connection hub 114 adapted to provide a connection with a plurality of treatment devices. [0042] according to an embodiment, the predetermined parameters acquired from the patient is selected from a group comprising, verification of time, vitals, electronic health records, consumption and general condition of a patient. [0043] according to an embodiment, the remote controlled medication dispenser device 101 comprises at least one medication dose uptake and tracking module comprising: an image capturing device 109 unit configured to acquire information regarding the medication dose uptake by the patient; an audio-visual input unit 112 configured to enter details regarding the patient identification via voice or video screen; an alarm indicator unit configured to alert a remote caregiver computing device 118 regarding discrepancy in medical compliance; a speaker unit 122 or other output module configured to provide instructions from the patient or remote caregiver; a sensor unit 116 configured to provide combined input from the plurality of treatment devices. although the sensor device 116 is shown in fig. 1 as connected to the remote controlled medication dispenser device 101 via a network 106, the sensor 116 may be a part of or integrated with the controlled medication dispenser device 101. [0044] in another embodiment, the at least one treatment administration module dispenses a medication dose upon receiving instructions by one or more or a combination of actions selected from a group comprising of: a remote live caregiver action, a remote artificial intelligence action, a local automatic action, a remote timed automatic action, a local artificial intelligence action, a patient action, a patient-helper authenticated action and combinations thereof. [0045] according to an embodiment, the at least one treatment administration module comprises an internal delivery mechanism to dispense a medication dose to the patient. [0046] according to an embodiment, the at least one treatment administration module includes or is operably connected to at least one locking-unlocking mechanism 120 configured to release or not release the medication dose as per requirement. [0047] according to an embodiment, the at least one treatment administration module comprises at least one locking-unlocking mechanism 120 that is selected from a group comprising of a digital lock, a passphrase lock, a mechanical lock and combinations thereof to prevent unauthorized tampering with or removal of the medication dose. [0048] the plurality of treatment devices (not shown) may be operably coupled to the controlled medication dispenser device 101. such treatment device may include, but are not limited to, one of more of: brainwave, mental treatment, physical treatment devices and combinations thereof. [0049] according to an embodiment, the plurality of treatment devices check muscle reactions, motor movements, blood analysis, fluid analysis, breath analysis and/or skin analysis. [0050] according to an embodiment, the remote administration of the at least one treatment administration module 110 is linked to a remote caregiver distinct device 118 or is controlled by the patient using a smart device. [0051] according to an embodiment, a two way communication is established between the remote controlled medication dispensing device 101 and a remote caregiver’s distinct device 118. [0052] according to an embodiment, the two way communication is selected from a group consisting of (a) landline based communication; (b) radio frequency based communication; (c) satellite communication; (d) web server based communication; (e) incorporating a two way voice communication capability; (f) providing access to a remote artificial intelligence based expert system; any combination thereof. [0053] according to an embodiment, the remote controlled medication dispensing device 101 is a stationary device. [0054] according to an embodiment, the remote controlled medication dispensing device 101 is a portable device. [0055] according to an embodiment, the remote controlled medication dispensing device 101 is portable and used in a vehicle. [0056] according to an embodiment, the remote controlled medication dispensing device 101 is a smaller version enabled for injection, infusion and implantable purposes. [0057] according to an embodiment, a method of remote monitoring patients and provisioning medical treatment is disclosed. the said method may comprise: obtaining a remote controlled medication dispenser device 101, comprising: i. medication dose uptake and tracking module 108 adapted to (i) acquire predetermined parameters from a patient for analysis; and (ii) store said data in communicable database; ii. at least one treatment administration module 110 for remote administration of medical treatment; and iii. at least one computerized software program either wire or wirelessly connected with said medication dose uptake and tracking module, adapted to (i) analyze said predetermined parameters acquired by said medication dose uptake and tracking module; and (ii) enable said remote treatment administration by said treatment administration module; interconnecting said medication dose uptake and tracking module and said treatment administration module to said patient; monitoring said patient’s condition by means of said medication dose uptake and tracking module; either wire or wirelessly analyzing said predetermined parameters; thereby diagnosing said patient; and based on said predetermined parameters treating said patient. [0058] according to an embodiment, the method further comprises a step of enabling said remote treatment administration by said treatment administration module by mean of an expert system. [0059] according to an embodiment, the method comprises a step of implanting remote controlled medication dispenser device 101 under the patient’s skin. [0060] according to an embodiment, the method wherein unauthorized use of the device triggers a warning signal. [0061] in an embodiment, the device may be placed at a home, workplace or public place. [0062] referring to fig. 2, fig. 2 is a block diagram illustrating the details of digital processing system 200 in which various aspects of the present disclosure are operative by execution of appropriate software instructions. digital processing system 200 may correspond to the first computing device 102 and the second computing device l04(or any other system in which the various features disclosed above may be implemented). [0063] digital processing system 200 may contain one or more processors such as a central processing unit (cpu) 210, random access memory (ram) 220, secondary memory 227, graphics controller 260, display unit 270, network interface 280, an input interface 290. all the components except display unit 270 may communicate with each other over communication path 250, which may contain several buses as is well known in the relevant arts. the components of fig. 2 are described below in further detail. cpu 210 may execute instructions stored in ram 220 to provide several features of the present disclosure. cpu 210 may contain multiple processing units, with each processing unit potentially being designed for a specific task. alternatively, cpu 210 may contain only a single general-purpose processing unit. for example, the ram 220 and/or secondary memory 230 may store computer-executable instructions that, when executed by cpu 210, cause the medication dispenser device 101 and/or medication dispenser system 110 to perform the operations, methods processes and functionality disclosed herein, including, but not limited to, (i) analyze predetermined parameters acquired by said medication dose uptake and tracking module 108; and, (ii) enable said remote treatment administration by said treatment administration module, interconnecting said medication dose uptake and tracking module and said treatment administration module to said patient; the ram 220 and/or secondary memory 230 may store computer- executable instructions that, when executed by cpu 210, cause the medication dispenser device 101 and/or medication dispenser system 110 to perform monitoring said patient’s condition by means of said medication dose uptake and tracking module; either wire or wirelessly analyzing said predetermined parameters; thereby diagnosing said patient; and based on said predetermined parameters, treating said patient. [0064] ram 220 may receive instructions from secondary memory 230 using communication path 250. ram 220 is shown currently containing software instructions, such as those used in threads and stacks, constituting shared environment 225 and/or user programs 226. shared environment 225 includes operating systems, device drivers, virtual machines, etc., which provide a (common) run time environment for execution of user programs 226. [0065] graphics controller 260 generates display signals ( e.g ., in rgb format) to display unit 270 based on data/instructions received from cpu 210. display unit 270 contains a display screen to display the images defined by the display signals. input interface 290 may correspond to a keyboard and a pointing device (e.g., touch-pad, mouse) and may be used to provide inputs. network interface 280 provides connectivity to a network (e.g, using internet protocol), and may be used to communicate with other systems (such as those shown in fig. 1, network 106) connected to the network. [0066] secondary memory 230 may contain hard drive 235, flash memory 236, and removable storage drive 237. secondary memory 230 may store the data software instructions (e.g, for performing the actions noted above with respect to the figures), which enable digital processing system 200 to provide several features in accordance with the present disclosure. [0067] some or all of the data and instructions may be provided on the removable storage unit 240, and the data and instructions may be read and provided by removable storage drive 237 to cpu 210. floppy drive, magnetic tape drive, cd-rom drive, dvd drive, flash memory, a removable memory chip (pcmcia card, eeprom) are examples of such removable storage drive 237. [0068] the removable storage unit 240 may be implemented using medium and storage format compatible with removable storage drive 237 such that removable storage drive 237 can read the data and instructions. thus, removable storage unit 240 includes a computer readable (storage) medium having stored therein computer software and/or data. however, the computer (or machine, in general) readable medium can be in other forms (e.g, non-removable, random access, etc.). [0069] in this document, the term“computer program product” is used to generally refer to the removable storage unit 240 or hard disk installed in hard drive 235. these computer program products are means for providing software to digital processing system 200. cpu 210 may retrieve the software instructions, and execute the instructions to provide various features of the present disclosure described above. [0070] the term“storage media/medium” as used herein refers to any non- transitory media that store data and/or instructions that cause a machine to operate in a specific fashion. such storage media may comprise non-volatile media and/or volatile media. non-volatile media includes, for example, optical disks, magnetic disks, or solid-state drives, such as storage memory 230. volatile media includes dynamic memory, such as ram 220. common forms of storage media include, for example, a floppy disk, a flexible disk, hard disk, solid-state drive, magnetic tape, or any other magnetic data storage medium, a cd-rom, any other optical data storage medium, any physical medium with patterns of holes, a ram, a prom, and eprom, a flash- eprom, nvram, any other memory chip or cartridge. [0071] storage media is distinct from but may be used in conjunction with transmission media. transmission media participates in transferring information between storage media. for example, transmission media includes coaxial cables, copper wire and fiber optics, including the wires that comprise bus 250. transmission media can also take the form of acoustic or light waves, such as those generated during radio-wave and infra-red data communications. [0072] fig. 3 is a block diagram illustrating the details of digital processing system 300 present in a remote controlled medication dispenser device 101 wherein various aspects of the present disclosure are operative by execution of appropriate software instructions in communication with other treatment devices, in accordance with one or more exemplary embodiments. herein the digital processing system 300 represents the hardware or software instruction in applicable components of the remote controlled medication dispenser system 100 and/or the remote controlled medication dispenser 101. the digital processing system 300 may also be integrated and dispensed to other treatment devices (3 l4a, 3 l4b, 3 l4c...314h and so forth, represented by reference numeral 314) so that input and output of data from multiple sources may be obtained, collated and analyzed to determine and improve the treatment regimen of multiple patients. the cloud storage 316 may be communicative to a network 106 and other distinct computing devices (3 l8a, 318b, 3 l8c... 318h and so forth, represented by reference numeral 318). bidirectional communications may be established between the network 106, cloud storage 316, and distinct computing devices 318 and other treatment devices 3 l4in the remote controlled medication dispenser 101. herein, 1 and 3 represent the bidirectional communications to or from the remote controlled medication dispenser 101 or other treatment devices (3 l4a, 3 l4b...3 l4n). further, 2 and 4 represent the unidirectional output control signals to the remote controlled medication dispenser 101 or other treatment devices (3 l4a, 3 l4b...3 l4n). furthermore, c represents the audio-visual communications, signals or warnings that may be issued when an unfortunate situation may be encountered. for example: a security breach, excess dosage or medication dosage is not dispensed, etc. additionally, a/e, b/d and c may function as biometric devices, bar-code scanners/readers. in an alternate configuration, a/e, b/b or c may also represent medical drug product scanning and detection device. the communications may be established as rf, /. e. , cellular, wifi, satellite, bluetooth and so forth. the input/output may be via voice control, touch or any other physical movement. the warnings or alarms may be in the form of a optical output (light), sound, etc. [0073] fig. 4 a diagram illustrating a method for remote dispensing of medication, in accordance with one or more exemplary embodiments. [0074] at 402, the system 100 or remote controlled medication dispenser 101 monitors the conviction of a patient, for example, such as described herein. [0075] at 404, the system 100 or remote controlled medication dispenser 101 receiving a signal from a remote monitoring system to dispense medication. the control signal may be received based on input from one or more of: a remote caregiver; an artificial intelligence system for diagnosing or treating medical conditions; one or more health or medical condition monitoring devices coupled to the remote controlled medication dispenser device or the remote monitoring system; and input from a patent receiving the medication via audio visual input devices of the remote controlled medication dispenser device. [0076] at 406, the system 100 or remote controlled medication dispenser 101, in response to the receiving the signal from the remote monitoring system to dispense medication, automatically dispensing the medication at the remote controlled medication dispenser device. [0077] accordingly, it is to be understood that the embodiments of the invention herein described are merely illustrative of the application of the principles of the invention. reference herein to details of the illustrated embodiments is not intended to limit the scope of the claims, which themselves recite those features regarded as essential to the invention. [0078] the herein described subject matter sometimes illustrates different components contained within, or connected with, different other components. it is to be understood that such depicted architectures are merely examples and that in fact many other architectures may be implemented which achieve the same functionality. in a conceptual sense, any arrangement of components to achieve the same functionality is effectively“associated” such that the desired functionality is achieved. hence, any two components herein combined to achieve a particular functionality may be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components. likewise, any two components so associated may also be viewed as being“operably connected”, or“operably coupled”, to each other to achieve the desired functionality, and any two components capable of being so associated may also be viewed as being“operably couplable”, to each other to achieve the desired functionality. specific examples of operably couplable include but are not limited to physically mateable and/or physically interacting components and/or wirelessly interactable and/or wirelessly interacting components and/or logically interacting and/or logically interactable components. [0079] with respect to the use of substantially any plural and/or singular terms herein, those having skill in the art may translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. the various singular/plural permutations may be expressly set forth herein for sake of clarity. [0080] it will be understood by those within the art that, in general, terms used herein, and especially in the appended claims ( e.g ., bodies of the appended claims) are generally intended as“open” terms ( e.g ., the term“including” should he interpreted as “including but not limited to,” the term“having” should be interpreted as“having at least,” the term“includes” should be interpreted as“includes but is not limited to,” etc.). it will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. for example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases“at least one” and“one or more” to introduce claim recitations. however, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles“a” or“an” limits any particular claim containing such introduced claim recitation to examples containing only one such recitation, even when the same claim includes the introductory phrases“one or more” or“at least one” and indefinite articles such as“a” or“an” (e.g.,“a” and/or“an” should be interpreted to mean“at least one” or“one or more”); the same holds true for the use of definite articles used to introduce claim recitations. in addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should be interpreted to mean at least the recited number (e.g, the bare recitation of“two recitations,” without other modifiers, means at least two recitations, or two or more recitations). furthermore, in those instances where a convention analogous to“at least one of a, b, and c, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention“a system having at least one of a, b, and c” would include but not be limited to systems that have a alone, b alone, c alone, a and b together, a and c together, b and c together, and/or a, b, and c together, etc.). in those instances where a convention analogous to“at least one of a, b, or c, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g,“a system having at least one of a, b, or c” would include but not be limited to systems that have a alone, b alone, c alone, a and b together, a and c together, b and c together, and/or a, b, and c together, etc.). it will be further understood by those within the art that virtually any disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. for example, the phrase“a or b” will be understood to include the possibilities of“a” or“b” or“a and b.” [0081] in addition, where features or aspects of the disclosure are described in terms of markush groups, those skilled in the art will recognize that the disclosure is also thereby described in terms of any individual member or subgroup of members of the markush group. [0082] as will be understood by one skilled in the art, for any and all purposes, such as in terms of providing a written description, all ranges disclosed herein also encompass any and all possible sub ranges and combinations of sub ranges thereof. any listed range may be easily recognized as sufficiently describing and enabling the same range being broken down into at least equal halves, thirds, quarters, fifths, tenths, etc. as a non-limiting example, each range discussed herein may be readily broken down into a lower third, middle third and upper third, etc. as will also be understood by one skilled in the art all language such as“up to,”“at least,”“greater than,”“less than,” and the like include the number recited and refer to ranges which may be subsequently broken down into sub ranges as discussed above, finally, as will be understood by one skilled in the art, a range includes each individual member. thus, for example, a group having 1-3 cells refers to groups having 1, 2, or 3 cells. similarly, a group having 1-5 cells refers to groups having 1, 2, 3, 4, or 5 cells, and so forth. [0083] all of the u.s. patents, u.s. patent application publications, u.s. patent applications, foreign patents, foreign patent applications, and non-patent publications referred to in this specification are incorporated herein by reference in their entireties, including u.s. provisional application no. 62/698,688, filed july 16, 2018. [0084] while various aspects and examples have been disclosed herein, other aspects and examples will be apparent to those skilled in the art. the various aspects and examples disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.
159-474-447-097-779	US	[ "US" ]	A61B18/14,A61B17/29,A61B17/00,A61B17/04,A61B17/06,A61B17/062,A61B17/068,A61B17/10,A61B17/128,A61B17/28,A61B17/285,A61B17/295,A61B17/3201,A61B17/34,A61B18/00,A61B18/12,A61B34/00,A61B34/30,A61B90/00,A61B90/98,G06F3/147,A61B17/32,B33Y80/00,F16D27/00,F16D27/108,F16D27/12,G09G3/34,G09G3/36,G09G3/38,A61B5/05,A61B17/3205,H02P7/06,G05B9/02,H03K17/955	2017-10-30T00:00:00	2017	[ "A61", "G06", "B33", "F16", "G09", "H02", "G05", "H03" ]	surgical dissectors configured to apply mechanical and electrical energy	a surgical instrument comprising an end effector is disclosed. the end effector comprises a surgical dissector. the surgical dissector can apply mechanical and/or electrosurgical energy to treated tissue.	1 - 20 . (canceled) 21 . a surgical dissector, comprising: a first jaw member, comprising: a proximal end; a distal end; a first tissue contacting surface; a second tissue contacting surface; a metallic core, wherein said metallic core of said first jaw member is configured to transmit electrosurgical energy; and a nonmetallic layer disposed over at least a portion of said metallic core of said first jaw member; a second jaw member, comprising: a proximal end; a distal end; a first tissue contacting surface; a second tissue contacting surface; a metallic core, wherein said metallic core of said second jaw member is configured to transmit electrosurgical energy; and a nonmetallic layer disposed over at least a portion of said metallic core of said second jaw member; and a joint, wherein said first jaw member and said second jaw member are rotatable about said joint between closed and open positions. 22 . the surgical dissector of claim 21 , wherein said first tissue contacting surface of said first jaw member is positioned adjacent said first tissue contacting surface of said second jaw member when said first and said second jaw members are in said closed position. 23 . the surgical dissector of claim 22 , wherein said first tissue contacting surface of said first jaw member comprises a first pattern, and wherein said first tissue contacting surface of said second jaw member comprises a second pattern, and wherein said first pattern is different than said second pattern. 24 . the surgical dissector of claim 22 , wherein said first tissue contacting surface of said first jaw member comprises a first pattern, and wherein said first tissue contacting surface of said second jaw member comprises a second pattern, and wherein said first pattern is complementary to said second pattern. 25 . the surgical dissector of claim 22 , wherein said first tissue contacting surface of said first jaw member comprises a first pattern, and wherein said first tissue contacting surface of said second jaw member comprises a second pattern, wherein said first pattern comprises a plurality of first teeth, and wherein said second pattern comprises a plurality of second teeth. 26 . the surgical dissector of claim 22 , wherein said first tissue contacting surface of said first jaw member comprises a first pattern, and wherein said first tissue contacting surface of said second jaw member comprises a second pattern, wherein said first pattern comprises a plurality of first recesses, and wherein said second pattern comprises a plurality of second recesses. 27 . the surgical dissector of claim 22 , wherein said nonmetallic layer of said first jaw member comprises a first nonmetallic layer and a second nonmetallic layer. 28 . the surgical dissector of claim 27 , wherein said first nonmetallic layer is different than said second nonmetallic layer. 29 . the surgical dissector of claim 27 , wherein said first nonmetallic layer comprises a first rigidity, wherein said second nonmetallic layer comprises a second rigidity, and wherein said first rigidity is different than said second rigidity. 30 . the surgical dissector of claim 21 , wherein said first tissue contacting surface of said first jaw member comprises a first pattern, wherein said second tissue contacting surface of said first jaw member comprises a second pattern, and wherein said first pattern is different than said second pattern. 31 . the surgical dissector of claim 30 , wherein said first pattern comprises a symmetrical pattern, and wherein said second pattern comprises an asymmetrical pattern. 32 . the surgical dissector of claim 30 , wherein said first pattern comprises a plurality of teeth, and wherein said second pattern comprises a plurality of cavities. 33 . the surgical dissector of claim 30 , wherein said first pattern comprises a plurality of first cavities, wherein said second pattern comprises a plurality of second cavities. 34 . the surgical dissector of claim 33 , wherein said plurality of first cavities comprises a first depth, wherein said plurality of second cavities comprises a second depth, and wherein said first depth is different than said second depth. 35 . a surgical instrument, comprising: a jaw, comprising: a metallic core; and an outer skin, wherein said outer skin comprises: a plurality of first through holes exposing said metallic core to an outer surface of said jaw, wherein said plurality of first through holes comprise a first through hole size; and a plurality of second through holes exposing said metallic core to said outer surface of said jaw, wherein said plurality of second through holes comprise a second through hole size, and wherein said first through hole size is different than said second through hole size. 36 . the surgical instrument of claim 35 , wherein said jaw further comprises: a first region, wherein said plurality of first through holes are positioned within said first region; and a second region, wherein said plurality of second through holes are positioned within said second region, and wherein said first region is different than said second region. 37 . the surgical instrument of claim 35 , wherein said jaw comprises a tip region, wherein said first through hole size is smaller than said second through hole size, and wherein said plurality of first through holes are positioned within said tip region. 38 . the surgical instrument of claim 35 , wherein said jaw comprises a tip region, wherein said first through hole size is larger than said second through hole size, and wherein said plurality of first through holes are positioned within said tip region. 39 . the surgical instrument of claim 35 , wherein said plurality of first through holes and said plurality of second through holes are intermixed along said outer skin. 40 . the surgical instrument of claim 35 , wherein said plurality of first through holes are round, and wherein said plurality of second through holes are round. 41 . the surgical instrument of claim 35 , wherein said plurality of first through holes are round, and wherein said plurality of second through holes are non-round. 42 . the surgical instrument of claim 35 , wherein said plurality of first through holes are non-round, and wherein said plurality of second through holes are non-round. 43 . the surgical instrument of claim 35 , wherein said outer skin comprises an insulative plastic. 44 . the surgical instrument of claim 35 , wherein said outer skin comprises a semi-conductive plastic. 45 . the surgical instrument of claim 35 , wherein said outer skin is semi-conductive. 46 . the surgical instrument of claim 35 , wherein said outer skin comprises intrinsically conducting polymers. 47 . a surgical dissector, comprising: a first jaw member, comprising: a first tissue contacting surface, comprising: a first electrically conductive portion; and a first electrically insulative portion; a second jaw member, comprising: a second tissue contacting surface, comprising: a second electrically conductive portion; and a second electrically insulative portion; a pivot, wherein said first jaw member and said second jaw member are rotatable about said pivot; and means for separating tissue, comprising: means for applying a mechanical force to tissue of a patient through rotation of at least one of said first jaw member and said second jaw member; and means for applying electrosurgical force to the tissue through at least one of said first electrically conductive portion and said second electrically conductive portion. 48 . the surgical dissector of claim 47 , wherein said means for separating tissue comprises applying said mechanical force in an amount less than the separation pressure needed to separate the tissue and applying electrosurgical force which supplements said mechanical force to separate the tissue.	cross-reference to related applications this non-provisional application claims the benefit under 35 u.s.c. § 119(e) of u.s. provisional patent application ser. no. 62/578,793, entitled surgical instrument with remote release, filed oct. 30, 2017, of u.s. provisional patent application ser. no. 62/578,804, entitled surgical instrument having dual rotatable members to effect different types of end effector movement, filed oct. 30, 2017, of u.s. provisional patent application ser. no. 62/578,817, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions, filed oct. 30, 2017, of u.s. provisional patent application ser. no. 62/578,835, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions, filed oct. 30, 2017, of u.s. provisional patent application ser. no. 62/578,844, entitled surgical instrument with modular power sources, filed oct. 30, 2017, and of u.s. provisional patent application ser. no. 62/578,855, entitled surgical instrument with sensor and/or control systems, filed oct. 30, 2017, the disclosures of which are incorporated by reference herein in their entirety. this non-provisional application claims the benefit under 35 u.s.c. § 119(e) of u.s. provisional patent application ser. no. 62/665,129, entitled surgical suturing systems, filed may 1, 2018, of u.s. provisional patent application ser. no. 62/665,139, entitled surgical instruments comprising control systems, filed may 1, 2018, of u.s. provisional patent application ser. no. 62/665,177, entitled surgical instruments comprising handle arrangements, filed may 1, 2018, of u.s. provisional patent application ser. no. 62/665,128, entitled modular surgical instruments, filed may 1, 2018, of u.s. provisional patent application ser. no. 62/665,192, entitled surgical dissectors, filed may 1, 2018, and of u.s. provisional patent application ser. no. 62/665,134, entitled surgical clip applier, filed may 1, 2018, the disclosures of which are incorporated by reference herein in their entirety. background the present invention relates to surgical systems and, in various arrangements, to grasping instruments that are designed to grasp the tissue of a patient, dissecting instruments configured to manipulate the tissue of a patient, clip appliers configured to clip the tissue of a patient, and suturing instruments configured to suture the tissue of a patient, among others. brief description of the drawings various features of the embodiments described herein, together with advantages thereof, may be understood in accordance with the following description taken in conjunction with the accompanying drawings as follows: fig. 1 illustrates a surgical system comprising a handle and several shaft assemblies—each of which are selectively attachable to the handle in accordance with at least one embodiment; fig. 2 is an elevational view of the handle and one of the shaft assemblies of the surgical system of fig. 1 ; fig. 3 is a partial cross-sectional perspective view of the shaft assembly of fig. 2 ; fig. 4 is another partial cross-sectional perspective view of the shaft assembly of fig. 2 ; fig. 5 is a partial exploded view of the shaft assembly of fig. 2 ; fig. 6 is a partial cross-sectional elevational view of the shaft assembly of fig. 2 ; fig. 7 is an elevational view of a drive module of the handle of fig. 1 ; fig. 8 is a cross-sectional perspective view of the drive module of fig. 7 ; fig. 9 is an end view of the drive module of fig. 7 ; fig. 10 is a partial cross-sectional view of the interconnection between the handle and shaft assembly of fig. 2 in a locked configuration; fig. 11 is a partial cross-sectional view of the interconnection between the handle and shaft assembly of fig. 2 in an unlocked configuration; fig. 12 is a cross-sectional perspective view of a motor and a speed reduction gear assembly of the drive module of fig. 7 ; fig. 13 is an end view of the speed reduction gear assembly of fig. 12 ; fig. 14 is a partial perspective view of an end effector of the shaft assembly of fig. 2 in an open configuration; fig. 15 is a partial perspective view of the end effector of fig. 14 in a closed configuration; fig. 16 is a partial perspective view of the end effector of fig. 14 articulated in a first direction; fig. 17 is a partial perspective view of the end effector of fig. 14 articulated in a second direction; fig. 18 is a partial perspective view of the end effector of fig. 14 rotated in a first direction; fig. 19 is a partial perspective view of the end effector of fig. 14 rotated in a second direction; fig. 20 is a partial cross-sectional perspective view of the end effector of fig. 14 detached from the shaft assembly of fig. 2 ; fig. 21 is an exploded view of the end effector of fig. 14 illustrated with some components removed; fig. 22 is an exploded view of a distal attachment portion of the shaft assembly of fig. 2 ; fig. 22a is an exploded view of the distal portion of the shaft assembly of fig. 2 illustrated with some components removed; fig. 23 is another partial cross-sectional perspective view of the end effector of fig. 14 detached from the shaft assembly of fig. 2 ; fig. 24 is a partial cross-sectional perspective view of the end effector of fig. 14 attached to the shaft assembly of fig. 2 ; fig. 25 is a partial cross-sectional perspective view of the end effector of fig. 14 attached to the shaft assembly of fig. 2 ; fig. 26 is another partial cross-sectional perspective view of the end effector of fig. 14 attached to the shaft assembly of fig. 2 ; fig. 27 is a partial cross-sectional view of the end effector of fig. 14 attached to the shaft assembly of fig. 2 depicting a first, second, and third clutch of the end effector; fig. 28 depicts the first clutch of fig. 27 in an unactuated condition; fig. 29 depicts the first clutch of fig. 27 in an actuated condition; fig. 30 depicts the second clutch of fig. 27 in an unactuated condition; fig. 31 depicts the second clutch of fig. 27 in an actuated condition; fig. 32 depicts the third clutch of fig. 27 in an unactuated condition; fig. 33 depicts the third clutch of fig. 27 in an actuated condition; fig. 34 depicts the second and third clutches of fig. 27 in their unactuated conditions and the end effector of fig. 14 locked to the shaft assembly of fig. 2 ; fig. 35 depicts the second clutch of fig. 27 in its unactuated condition and the third clutch of fig. 27 in its actuated condition; fig. 36 depicts the second and third clutches of fig. 27 in their actuated conditions and the end effector of fig. 14 unlocked from the shaft assembly of fig. 2 ; fig. 37 is a partial cross-sectional view of a shaft assembly in accordance with at least one alternative embodiment comprising sensors configured to detect the conditions of the first, second, and third clutches of fig. 27 ; fig. 38 is a partial cross-sectional view of a shaft assembly in accordance with at least one alternative embodiment comprising sensors configured to detect the conditions of the first, second, and third clutches of fig. 27 ; fig. 39 depicts the first and second clutches of fig. 38 in their unactuated conditions and a sensor in accordance with at least one alternative embodiment; fig. 40 depicts the second and third clutches of fig. 38 in their unactuated conditions and a sensor in accordance with at least one alternative embodiment; fig. 41 is a partial cross-sectional view of a shaft assembly in accordance with at least one embodiment; fig. 42 is a partial cross-sectional view of the shaft assembly of fig. 41 comprising a clutch illustrated in an unactuated condition; fig. 43 is a partial cross-sectional view of the shaft assembly of fig. 41 illustrating the clutch in an actuated condition; fig. 44 is a partial cross-sectional view of a shaft assembly in accordance with at least one embodiment comprising first and second clutches illustrated in an unactuated condition; fig. 45 is a perspective view of the handle drive module of fig. 7 and one of the shaft assemblies of the surgical system of fig. 1 ; fig. 46 is another perspective view of the handle drive module of fig. 7 and the shaft assembly of fig. 45 ; fig. 47 is a partial cross-sectional view of the shaft assembly of fig. 45 attached to the handle of fig. 1 ; fig. 48 is another partial cross-sectional view of the shaft assembly of fig. 45 attached to the handle of fig. 1 ; fig. 49 is a partial cross-sectional perspective view of the shaft assembly of fig. 45 ; fig. 50 is a schematic of the control system of the surgical system of fig. 1 . fig. 51 is an elevational view of a handle in accordance with at least one embodiment and one of the shaft assemblies of the surgical system of fig. 1 ; fig. 52a is a partial top view of a drive module of the handle of fig. 51 illustrated in a first rotation configuration; fig. 52b is a partial top view of the drive module of fig. 52a illustrated in a second rotation configuration; fig. 53a is a partial top view of the drive module of fig. 52a illustrated in a first articulation configuration; fig. 53b is a partial top view of the drive module of fig. 52a illustrated in a second articulation configuration; fig. 54 is a partial cross-sectional perspective view of a drive module in accordance with at least one embodiment; fig. 55 is a partial perspective view of the drive module of fig. 54 illustrated with some components removed; fig. 56 is a partial cross-sectional view of the drive module of fig. 54 illustrating an eccentric drive in a disengaged condition; fig. 57 is a partial cross-sectional view of the drive module of fig. 54 illustrating the eccentric drive of fig. 56 in an engaged condition; fig. 58 is a partial top plan view of an embodiment of a surgical instrument; fig. 59 is a partial side elevation view of an embodiment of a surgical instrument; fig. 60 is a partial top plan view of various possible configurations of an embodiment of a surgical instrument; fig. 61 is a partial side elevation view of various possible configurations of an embodiment of a surgical instrument; fig. 62 is a partial top plan view of an embodiment of a surgical instrument; fig. 63 is a partial side elevation view of an embodiment of the surgical instrument depicted in fig. 62 ; fig. 64 is a partial top plan view of an embodiment of a surgical instrument; fig. 65 is a partial top plan view of an embodiment of a surgical instrument; fig. 66 is a partial top plan view of an embodiment of a surgical instrument; fig. 67 is a partial top plan view of an embodiment of a surgical instrument; fig. 68 is a partial top plan view of an embodiment of a surgical instrument which depicts a manufacturing envelope from which an end effector of the surgical instrument is created; fig. 69 is a partial side elevation view of an embodiment of the surgical instrument depicted in fig. 68 ; fig. 70 is a partial top plan view of an embodiment of a surgical instrument which depicts a manufacturing envelope from which an end effector of the surgical instrument is created; fig. 71 is a partial side elevation view of an embodiment of the surgical instrument depicted in fig. 70 which depicts a manufacturing envelope from which an end effector of the surgical instrument is created; fig. 72 is a top perspective view of a jaw of a surgical instrument; fig. 73 is a partial perspective view of the jaw depicted in fig. 72 ; fig. 74 is a top plan view of the jaw depicted in fig. 72 ; fig. 75 is a bottom perspective view of the jaw depicted in fig. 72 ; fig. 76 is a top perspective view of a jaw of a surgical instrument; fig. 77 is a top plan view of the jaw depicted in fig. 76 ; fig. 78 is a partial perspective view of the jaw depicted in fig. 76 ; fig. 79 is a partial perspective view of a jaw of a surgical instrument; fig. 80 is a partial cross-sectional view of a surgical instrument including a jaw assembly capable of grasping and dissection in accordance with at least one embodiment; fig. 81 is a graph depicting the force, speed, and orientation of the jaw assembly of fig. 80 in accordance with at least one embodiment; fig. 82 is a partial perspective view of bipolar forceps being used to cut tissue; fig. 83 is a perspective view of the bipolar forceps of fig. 82 ; fig. 84 is a graph depicting the force and speed of the jaws of the bipolar forceps of fig. 82 in accordance with at least one embodiment; and fig. 85 is another graph depicting the operation of the bipolar forceps of fig. 82 in accordance with at least one embodiment. corresponding reference characters indicate corresponding parts throughout the several views. the exemplifications set out herein illustrate various embodiments of the invention, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner. detailed description applicant of the present application owns the following u.s. patent applications that were filed on even date herewith and which are each herein incorporated by reference in their respective entireties: u.s. patent application ser. no. ______, entitled surgical suturing instrument configured to manipulate tissue using mechanical and electrical power; attorney docket no. end8567usnp1/180100-1;u.s. patent application ser. no. ______, entitled surgical suturing instrument comprising a capture width which is larger than trocar diameter; attorney docket no. end8567usnp2/180100-2;u.s. patent application ser. no. ______, entitled surgical suturing instrument comprising a non-circular needle; attorney docket no. end8567usnp3/180100-3;u.s. patent application ser. no. ______, entitled electrical power output control based on mechanical forces; attorney docket no. end8567usnp4/180100-4;u.s. patent application ser. no. ______, entitled reactive algorithm for surgical system; attorney docket no. end8567usnp5/180100-5;u.s. patent application ser. no. ______, entitled surgical instrument comprising an adaptive electrical system; attorney docket no. end8568usnp1/180101-1;u.s. patent application ser. no. ______, entitled control system arrangements for a modular surgical instrument; attorney docket no. end8568usnp2/180101-2;u.s. patent application ser. no. ______, entitled adaptive control programs for a surgical system comprising more than one type of cartridge; attorney docket no. end8568usnp3/180101-3;u.s. patent application ser. no. ______, entitled surgical instrument systems comprising battery arrangements; attorney docket no. end8569usnp1/180102-1;u.s. patent application ser. no. ______, entitled surgical instrument systems comprising handle arrangements; attorney docket no. end8569usnp2/180102-2;u.s. patent application ser. no. ______, entitled surgical instrument systems comprising feedback mechanisms; attorney docket no. end8569usnp3/180102-3;u.s. patent application ser. no. ______, entitled surgical instrument systems comprising lockout mechanisms; attorney docket no. end8569usnp4/180102-4;u.s. patent application ser. no. ______, entitled surgical instruments comprising a lockable end effector socket; attorney docket no. end8570usnp1/180103-1;u.s. patent application ser. no. ______, entitled surgical instruments comprising a shifting mechanism; attorney docket no. end8570usnp2/180103-2;u.s. patent application ser. no. ______, entitled surgical instruments comprising a system for articulation and rotation compensation; attorney docket no. end8570usnp3/180103-3;u.s. patent application ser. no. ______, entitled surgical instruments comprising a biased shifting mechanism; attorney docket no. end8570usnp4/180103-4;u.s. patent application ser. no. ______, entitled surgical instruments comprising an articulation drive that provides for high articulation angles; attorney docket no. end8570usnp5/180103-5;u.s. patent application ser. no. ______, entitled surgical dissectors and manufacturing techniques; attorney docket no. end8571usnp1/180104-1;u.s. patent application ser. no. ______, entitled surgical clip applier configured to store clips in a stored state; attorney docket no. end8572usnp1/180105-1;u.s. patent application ser. no. ______, entitled surgical clip applier comprising an empty clip cartridge lockout; attorney docket no. end8572usnp2/180105-2;u.s. patent application ser. no. ______, entitled surgical clip applier comprising an automatic clip feeding system; attorney docket no. end8572usnp3/180105-3;u.s. patent application ser. no. ______, entitled surgical clip applier comprising adaptive firing control; attorney docket no. end8572usnp4/180105-4; andu.s. patent application ser. no. ______, entitled surgical clip applier comprising adaptive control in response to a strain gauge circuit; attorney docket no. end8572usnp5/180105-5. applicant of the present application owns the following u.s. patent applications that were filed on may 1, 2018 and which are each herein incorporated by reference in their respective entireties: u.s. provisional patent application ser. no. 62/665,129, entitled surgical suturing systems;u.s. provisional patent application ser. no. 62/665,139, entitled surgical instruments comprising control systems;u.s. provisional patent application ser. no. 62/665,177, entitled surgical instruments comprising handle arrangements;u.s. provisional patent application ser. no. 62/665,128, entitled modular surgical instruments;u.s. provisional patent application ser. no. 62/665,192, entitled surgical dissectors; andu.s. provisional patent application ser. no. 62/665,134, entitled surgical clip applier. applicant of the present application owns the following u.s. patent applications that were filed on feb. 28, 2018 and which are each herein incorporated by reference in their respective entireties: u.s. patent application ser. no. 15/908,021, entitled surgical instrument with remote release;u.s. patent application ser. no. 15/908,012, entitled surgical instrument having dual rotatable members to effect different types of end effector movement;u.s. patent application ser. no. 15/908,040, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions;u.s. patent application ser. no. 15/908,057, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions;u.s. patent application ser. no. 15/908,058, entitled surgical instrument with modular power sources; andu.s. patent application ser. no. 15/908,143, entitled surgical instrument with sensor and/or control systems. applicant of the present application owns the following u.s. patent applications that were filed on oct. 30, 2017 and which are each herein incorporated by reference in their respective entireties: u.s. provisional patent application ser. no. 62/578,793, entitled surgical instrument with remote release;u.s. provisional patent application ser. no. 62/578,804, entitled surgical instrument having dual rotatable members to effect different types of end effector movement;u.s. provisional patent application ser. no. 62/578,817, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions;u.s. provisional patent application ser. no. 62/578,835, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions;u.s. provisional patent application ser. no. 62/578,844, entitled surgical instrument with modular power sources; andu.s. provisional patent application ser. no. 62/578,855, entitled surgical instrument with sensor and/or control systems. applicant of the present application owns the following u.s. provisional patent applications, filed on dec. 28, 2017, the disclosure of each of which is herein incorporated by reference in its entirety: u.s. provisional patent application ser. no. 62/611,341, entitled interactive surgical platform;u.s. provisional patent application ser. no. 62/611,340, entitled cloud-based medical analytics; andu.s. provisional patent application ser. no. 62/611,339, entitled robot assisted surgical platform. applicant of the present application owns the following u.s. provisional patent applications, filed on mar. 28, 2018, each of which is herein incorporated by reference in its entirety: u.s. provisional patent application ser. no. 62/649,302, entitled interactive surgical systems with encrypted communication capabilities;u.s. provisional patent application ser. no. 62/649,294, entitled data stripping method to interrogate patient records and create anonymized record;u.s. provisional patent application ser. no. 62/649,300, entitled surgical hub situational awareness;u.s. provisional patent application ser. no. 62/649,309, entitled surgical hub spatial awareness to determine devices in operating theater;u.s. provisional patent application ser. no. 62/649,310, entitled computer implemented interactive surgical systems;u.s. provisional patent application ser. no. 62/649,291, entitled use of laser light and red-green-blue coloration to determine properties of back scattered light;u.s. provisional patent application ser. no. 62/649,296, entitled adaptive control program updates for surgical devices;u.s. provisional patent application ser. no. 62/649,333, entitled cloud-based medical analytics for customization and recommendations to a user;u.s. provisional patent application ser. no. 62/649,327, entitled cloud-based medical analytics for security and authentication trends and reactive measures;u.s. provisional patent application ser. no. 62/649,315, entitled data handling and prioritization in a cloud analytics network;u.s. provisional patent application ser. no. 62/649,313, entitled cloud interface for coupled surgical devices;u.s. provisional patent application ser. no. 62/649,320, entitled drive arrangements for robot-assisted surgical platforms;u.s. provisional patent application ser. no. 62/649,307, entitled automatic tool adjustments for robot-assisted surgical platforms; andu.s. provisional patent application ser. no. 62/649,323, entitled sensing arrangements for robot-assisted surgical platforms. applicant of the present application owns the following u.s. patent applications, filed on mar. 29, 2018, each of which is herein incorporated by reference in its entirety: u.s. patent application ser. no. 15/940,641, entitled interactive surgical systems with encrypted communication capabilities;u.s. patent application ser. no. 15/940,648, entitled interactive surgical systems with condition handling of devices and data capabilities;u.s. patent application ser. no. 15/940,656, entitled surgical hub coordination of control and communication of operating room devices;u.s. patent application ser. no. 15/940,666, entitled spatial awareness of surgical hubs in operating rooms;u.s. patent application ser. no. 15/940,670, entitled cooperative utilization of data derived from secondary sources by intelligent surgical hubs;u.s. patent application ser. no. 15/940,677, entitled surgical hub control arrangements;u.s. patent application ser. no. 15/940,632, entitled data stripping method to interrogate patient records and create anonymized record;u.s. patent application ser. no. 15/940,640, entitled communication hub and storage device for storing parameters and status of a surgical device to be shared with cloud based analytics systems;u.s. patent application ser. no. 15/940,645, entitled self describing data packets generated at an issuing instrument;u.s. patent application ser. no. 15/940,649, entitled data pairing to interconnect a device measured parameter with an outcome;u.s. patent application ser. no. 15/940,654, entitled surgical hub situational awareness;u.s. patent application ser. no. 15/940,663, entitled surgical system distributed processing;u.s. patent application ser. no. 15/940,668, entitled aggregation and reporting of surgical hub data;u.s. patent application ser. no. 15/940,671, entitled surgical hub spatial awareness to determine devices in operating theater;u.s. patent application ser. no. 15/940,686, entitled display of alignment of staple cartridge to prior linear staple line;u.s. patent application ser. no. 15/940,700, entitled sterile field interactive control displays;u.s. patent application ser. no. 15/940,629, entitled computer implemented interactive surgical systems;u.s. patent application ser. no. 15/940,704, entitled use of laser light and red-green-blue coloration to determine properties of back scattered light;u.s. patent application ser. no. 15/940,722, entitled characterization of tissue irregularities through the use of mono-chromatic light refractivity; andu.s. patent application ser. no. 15/940,742, entitled dual cmos array imaging. applicant of the present application owns the following u.s. patent applications, filed on mar. 29, 2018, each of which is herein incorporated by reference in its entirety: u.s. patent application ser. no. 15/940,636, entitled adaptive control program updates for surgical devices;u.s. patent application ser. no. 15/940,653, entitled adaptive control program updates for surgical hubs;u.s. patent application ser. no. 15/940,660, entitled cloud-based medical analytics for customization and recommendations to a user;u.s. patent application ser. no. 15/940,679, entitled cloud-based medical analytics for linking of local usage trends with the resource acquisition behaviors of larger data set;u.s. patent application ser. no. 15/940,694, entitled cloud-based medical analytics for medical facility segmented individualization of instrument function;u.s. patent application ser. no. 15/940,634, entitled cloud-based medical analytics for security and authentication trends and reactive measures;u.s. patent application ser. no. 15/940,706, entitled data handling and prioritization in a cloud analytics network; andu.s. patent application ser. no. 15/940,675, entitled cloud interface for coupled surgical devices. applicant of the present application owns the following u.s. patent applications, filed on mar. 29, 2018, each of which is herein incorporated by reference in its entirety: u.s. patent application ser. no. 15/940,627, entitled drive arrangements for robot-assisted surgical platforms;u.s. patent application ser. no. 15/940,637, entitled communication arrangements for robot-assisted surgical platforms;u.s. patent application ser. no. 15/940,642, entitled controls for robot-assisted surgical platforms;u.s. patent application ser. no. 15/940,676, entitled automatic tool adjustments for robot-assisted surgical platforms;u.s. patent application ser. no. 15/940,680, entitled controllers for robot-assisted surgical platforms;u.s. patent application ser. no. 15/940,683, entitled cooperative surgical actions for robot-assisted surgical platforms;u.s. patent application ser. no. 15/940,690, entitled display arrangements for robot-assisted surgical platforms; andu.s. patent application ser. no. 15/940,711, entitled sensing arrangements for robot-assisted surgical platforms. applicant of the present application owns the following u.s. provisional patent applications, filed on mar. 30, 2018, each of which is herein incorporated by reference in its entirety: u.s. provisional patent application ser. no. 62/650,887, entitled surgical systems with optimized sensing capabilities;u.s. provisional patent application ser. no. 62/650,877, entitled surgical smoke evacuation sensing and controls;u.s. provisional patent application ser. no. 62/650,882, entitled smoke evacuation module for interactive surgical platform; andu.s. provisional patent application ser. no. 62/650,898, entitled capacitive coupled return path pad with separable array elements. applicant of the present application owns the following u.s. provisional patent application, filed on apr. 19, 2018, which is herein incorporated by reference in its entirety: u.s. provisional patent application ser. no. 62/659,900, entitled method of hub communication. numerous specific details are set forth to provide a thorough understanding of the overall structure, function, manufacture, and use of the embodiments as described in the specification and illustrated in the accompanying drawings. well-known operations, components, and elements have not been described in detail so as not to obscure the embodiments described in the specification. the reader will understand that the embodiments described and illustrated herein are non-limiting examples, and thus it can be appreciated that the specific structural and functional details disclosed herein may be representative and illustrative. variations and changes thereto may be made without departing from the scope of the claims. the terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”), and “contain” (and any form of contain, such as “contains” and “containing”) are open-ended linking verbs. as a result, a surgical system, device, or apparatus that “comprises,” “has,” “includes”, or “contains” one or more elements possesses those one or more elements, but is not limited to possessing only those one or more elements. likewise, an element of a system, device, or apparatus that “comprises,” “has,” “includes”, or “contains” one or more features possesses those one or more features, but is not limited to possessing only those one or more features. the terms “proximal” and “distal” are used herein with reference to a clinician manipulating the handle portion of the surgical instrument. the term “proximal” refers to the portion closest to the clinician and the term “distal” refers to the portion located away from the clinician. it will be further appreciated that, for convenience and clarity, spatial terms such as “vertical”, “horizontal”, “up”, and “down” may be used herein with respect to the drawings. however, surgical instruments are used in many orientations and positions, and these terms are not intended to be limiting and/or absolute. various exemplary devices and methods are provided for performing laparoscopic and minimally invasive surgical procedures. however, the reader will readily appreciate that the various methods and devices disclosed herein can be used in numerous surgical procedures and applications including, for example, in connection with open surgical procedures. as the present detailed description proceeds, the reader will further appreciate that the various instruments disclosed herein can be inserted into a body in any way, such as through a natural orifice, through an incision or puncture hole formed in tissue, etc. the working portions or end effector portions of the instruments can be inserted directly into a patient's body or can be inserted through an access device that has a working channel through which the end effector and elongate shaft of a surgical instrument can be advanced. a surgical instrument, such as a grasper, for example, can comprise a handle, a shaft extending from the handle, and an end effector extending from the shaft. in various instances, the end effector comprises a first jaw and a second jaw, wherein one or both of the jaws are movable relative to the other to grasp the tissue of a patient. that said, an end effector of a surgical instrument can comprise any suitable arrangement and can perform any suitable function. for instance, an end effector can comprise first and second jaws configured to dissect or separate the tissue of a patient. also, for instance, an end effector can be configured to suture and/or clip the tissue of a patient. in various instances, the end effector and/or shaft of the surgical instrument are configured to be inserted into a patient through a trocar, or cannula, and can have any suitable diameter, such as approximately 5 mm, 8 mm, and/or 12 mm, for example. u.s. patent application ser. no. 11/013,924, entitled trocar seal assembly, now u.s. pat. no. 7,371,227, is incorporated by reference in its entirety. the shaft can define a longitudinal axis and at least a portion of the end effector can be rotatable about the longitudinal axis. moreover, the surgical instrument can further comprise an articulation joint which can permit at least a portion of the end effector to be articulated relative to the shaft. in use, a clinician can rotate and/or articulate the end effector in order to maneuver the end effector within the patient. a surgical instrument system is depicted in fig. 1 . the surgical instrument system comprises a handle assembly 1000 which is selectively usable with a shaft assembly 2000 , a shaft assembly 3000 , a shaft assembly 4000 , a shaft assembly 5000 , and/or any other suitable shaft assembly. the shaft assembly 2000 is attached to the handle assembly 1000 in fig. 2 and the shaft assembly 4000 is attached to the handle assembly 1000 in fig. 45 . the shaft assembly 2000 comprises a proximal portion 2100 , an elongate shaft 2200 extending from the proximal portion 2100 , a distal attachment portion 2400 , and an articulation joint 2300 rotatably connecting the distal attachment portion 2400 to the elongate shaft 2200 . the shaft assembly 2000 further comprises a replaceable end effector assembly 7000 attached to the distal attachment portion 2400 . the replaceable end effector assembly 7000 comprises a jaw assembly 7100 configured to be opened and closed to clamp and/or manipulate the tissue of a patient. in use, the end effector assembly 7000 can be articulated about the articulation joint 2300 and/or rotated relative to the distal attachment portion 2400 about a longitudinal axis to better position the jaw assembly 7100 within the patient, as described in greater detail further below. referring again to fig. 1 , the handle assembly 1000 comprises, among other things, a drive module 1100 . as described in greater detail below, the drive module 1100 comprises a distal mounting interface which permits a clinician to selectively attach one of the shaft assemblies 2000 , 3000 , 4000 , and 5000 , for example, to the drive module 1100 . thus, each of the shaft assemblies 2000 , 3000 , 4000 , and 5000 comprises an identical, or an at least similar, proximal mounting interface which is configured to engage the distal mounting interface of the drive module 1100 . as also described in greater detail below, the mounting interface of the drive module 1100 mechanically secures and electrically couples the selected shaft assembly to the drive module 1100 . the drive module 1100 further comprises at least one electric motor, one or more controls and/or displays, and a controller configured to operate the electric motor—the rotational output of which is transmitted to a drive system of the shaft assembly attached to the drive module 1100 . moreover, the drive module 1100 is usable with one ore more power modules, such as power modules 1200 and 1300 , for example, which are operably attachable to the drive module 1100 to supply power thereto. further to the above, referring again to figs. 1 and 2 , the handle drive module 1100 comprises a housing 1110 , a first module connector 1120 , and a second module connector 1120 ′. the power module 1200 comprises a housing 1210 , a connector 1220 , one or more release latches 1250 , and one or more batteries 1230 . the connector 1220 is configured to be engaged with the first module connector 1120 of the drive module 1100 in order to attach the power module 1200 to the drive module 1100 . the connector 1220 comprises one or more latches 1240 which mechanically couple and fixedly secure the housing 1210 of the power module 1200 to the housing 1110 of the drive module 1100 . the latches 1240 are movable into disengaged positions when the release latches 1250 are depressed so that the power module 1200 can be detached from the drive module 1100 . the connector 1220 also comprises one or more electrical contacts which place the batteries 1230 , and/or an electrical circuit including the batteries 1230 , in electrical communication with an electrical circuit in the drive module 1100 . further to the above, referring again to figs. 1 and 2 , the power module 1300 comprises a housing 1310 , a connector 1320 , one or more release latches 1350 , and one or more batteries 1330 ( fig. 47 ). the connector 1320 is configured to be engaged with the second module connector 1120 ′ of the drive module 1100 to attach the power module 1300 to the drive module 1100 . the connector 1320 comprises one or more latches 1340 which mechanically couple and fixedly secure the housing 1310 of the power module 1300 to the housing 1110 of the drive module 1100 . the latches 1340 are movable into disengaged positions when the release latches 1350 are depressed so that the power module 1300 can be detached from the drive module 1100 . the connector 1320 also comprises one or more electrical contacts which place the batteries 1330 of the power module 1300 , and/or an electrical power circuit including the batteries 1330 , in electrical communication with an electrical power circuit in the drive module 1100 . further to the above, the power module 1200 , when attached to the drive module 1100 , comprises a pistol grip which can allow a clinician to hold the handle 1000 in a manner which places the drive module 1100 on top of the clinician's hand. the power module 1300 , when attached to the drive module 1100 , comprises an end grip which allows a clinician to hold the handle 1000 like a wand. the power module 1200 is longer than the power module 1300 , although the power modules 1200 and 1300 can comprise any suitable length. the power module 1200 has more battery cells than the power module 1300 and can suitably accommodate these additional battery cells owing to its length. in various instances, the power module 1200 can provide more power to the drive module 1100 than the power module 1300 while, in some instances, the power module 1200 can provide power for a longer period of time. in some instances, the housing 1110 of the drive module 1100 comprises keys, and/or any other suitable features, which prevent the power module 1200 from being connected to the second module connector 1120 ′ and, similarly, prevent the power module 1300 from being connected to the first module connector 1120 . such an arrangement can assure that the longer power module 1200 is used in the pistol grip arrangement and that the shorter power module 1300 is used in the wand grip arrangement. in alternative embodiments, the power module 1200 and the power module 1300 can be selectively coupled to the drive module 1100 at either the first module connector 1120 or the second module connector 1120 ′. such embodiments provide a clinician with more options to customize the handle 1000 in a manner suitable to them. in various instances, further to the above, only one of the power modules 1200 and 1300 is coupled to the drive module 1100 at a time. in certain instances, the power module 1200 can be in the way when the shaft assembly 4000 , for example, is attached to the drive module 1100 . alternatively, both of the power modules 1200 and 1300 can be operably coupled to the drive module 1100 at the same time. in such instances, the drive module 1100 can have access to power provided by both of the power modules 1200 and 1300 . moreover, a clinician can switch between a pistol grip and a wand grip when both of the power modules 1200 and 1300 are attached to the drive module 1100 . moreover, such an arrangement allows the power module 1300 to act as a counterbalance to a shaft assembly, such as shaft assemblies 2000 , 3000 , 4000 , or 5000 , for example, attached to the drive module 1100 . referring to figs. 7 and 8 , the handle drive module 1100 further comprises a frame 1500 , a motor assembly 1600 , a drive system 1700 operably engaged with the motor assembly 1600 , and a control system 1800 . the frame 1500 comprises an elongate shaft that extends through the motor assembly 1600 . the elongate shaft comprises a distal end 1510 and electrical contacts, or sockets, 1520 defined in the distal end 1510 . the electrical contacts 1520 are in electrical communication with the control system 1800 of the drive module 1100 via one or more electrical circuits and are configured to convey signals and/or power between the control system 1800 and the shaft assembly, such as the shaft assembly 2000 , 3000 , 4000 , or 5000 , for example, attached to the drive module 1100 . the control system 1800 comprises a printed circuit board (pcb) 1810 , at least one microprocessor 1820 , and at least one memory device 1830 . the board 1810 can be rigid and/or flexible and can comprise any suitable number of layers. the microprocessor 1820 and the memory device 1830 are part of a control circuit defined on the board 1810 which controls the operation of the motor assembly 1600 , as described in greater detail below. referring to figs. 12 and 13 , the motor assembly 1600 comprises an electric motor 1610 including a housing 1620 , a drive shaft 1630 , and a gear reduction system. the electric motor 1610 further comprises a stator including windings 1640 and a rotor including magnetic elements 1650 . the stator windings 1640 are supported in the housing 1620 and the rotor magnetic elements 1650 are mounted to the drive shaft 1630 . when the stator windings 1640 are energized with an electric current controlled by the control system 1800 , the drive shaft 1630 is rotated about a longitudinal axis. the drive shaft 1630 is operably engaged with a first planetary gear system 1660 which includes a central sun gear and several planetary gears operably intermeshed with the sun gear. the sun gear of the first planetary gear system 1660 is fixedly mounted to the drive shaft 1630 such that it rotates with the drive shaft 1630 . the planetary gears of the first planetary gear system 1660 are rotatably mounted to the sun gear of a second planetary gear system 1670 and, also, intermeshed with a geared or splined inner surface 1625 of the motor housing 1620 . as a result of the above, the rotation of the first sun gear rotates the first planetary gears which rotate the second sun gear. similar to the above, the second planetary gear system 1670 further comprises planetary gears 1665 ( fig. 13 ) which drive a third planetary gear system and, ultimately, the drive shaft 1710 . the planetary gear systems 1660 , 1670 , and 1680 co-operate to gear down the speed applied to the drive shaft 1710 by the motor shaft 1620 . various alternative embodiments are envisioned without a speed reduction system. such embodiments are suitable when it is desirable to drive the end effector functions quickly. notably, the drive shaft 1630 comprises an aperture, or hollow core, extending therethrough through which wires and/or electrical circuits can extend. the control system 1800 is in communication with the motor assembly 1600 and the electrical power circuit of the drive module 1100 . the control system 1800 is configured to control the power delivered to the motor assembly 1600 from the electrical power circuit. the electrical power circuit is configured to supply a constant, or at least nearly constant, direct current (dc) voltage. in at least one instance, the electrical power circuit supplies 3 vdc to the control system 1800 . the control system 1800 comprises a pulse width modulation (pwm) circuit which is configured to deliver voltage pulses to the motor assembly 1600 . the duration or width of the voltage pulses, and/or the duration or width between the voltage pulses, supplied by the pwm circuit can be controlled in order to control the power applied to the motor assembly 1600 . by controlling the power applied to the motor assembly 1600 , the pwm circuit can control the speed of the output shaft of the motor assembly 1600 . in addition to or in lieu of a pwm circuit, the control system 1800 can include a frequency modulation (fm) circuit. as discussed in greater detail below, the control system 1800 is operable in more than one operating mode and, depending on the operating mode being used, the control system 1800 can operate the motor assembly 1600 at a speed, or a range of speeds, which is determined to be appropriate for that operating mode. further to the above, referring again to figs. 7 and 8 , the drive system 1700 comprises a rotatable shaft 1710 comprising a splined distal end 1720 and a longitudinal aperture 1730 defined therein. the rotatable shaft 1710 is operably mounted to the output shaft of the motor assembly 1600 such that the rotatable shaft 1710 rotates with the motor output shaft. the handle frame 1510 extends through the longitudinal aperture 1730 and rotatably supports the rotatable shaft 1710 . as a result, the handle frame 1510 serves as a bearing for the rotatable shaft 1710 . the handle frame 1510 and the rotatable shaft 1710 extend distally from a mounting interface 1130 of the drive module 1110 and are coupled with corresponding components on the shaft assembly 2000 when the shaft assembly 2000 is assembled to the drive module 1100 . referring primarily to figs. 3-6 , the shaft assembly 2000 further comprises a frame 2500 and a drive system 2700 . the frame 2500 comprises a longitudinal shaft 2510 extending through the shaft assembly 2000 and a plurality of electrical contacts, or pins, 2520 extending proximally from the shaft 2510 . when the shaft assembly 2000 is attached to the drive module 1100 , the electrical contacts 2520 on the shaft frame 2510 engage the electrical contacts 1520 on the handle frame 1510 and create electrical pathways therebetween. similar to the above, the drive system 2700 comprises a rotatable drive shaft 2710 which is operably coupled to the rotatable drive shaft 1710 of the handle 1000 when the shaft assembly 2000 is assembled to the drive module 1100 such that the drive shaft 2710 rotates with the drive shaft 1710 . to this end, the drive shaft 2710 comprises a splined proximal end 2720 which mates with the splined distal end 1720 of the drive shaft 1710 such that the drive shafts 1710 and 2710 rotate together when the drive shaft 1710 is rotated by the motor assembly 1600 . given the nature of the splined interconnection between the drive shafts 1710 and 2710 and the electrical interconnection between the frames 1510 and 2510 , the shaft assembly 2000 is assembled to the handle 1000 along a longitudinal axis; however, the operable interconnection between the drive shafts 1710 and 2710 and the electrical interconnection between the frames 1510 and 2510 can comprise any suitable configuration which can allow a shaft assembly to be assembled to the handle 1000 in any suitable manner. as discussed above, referring to figs. 3-8 , the mounting interface 1130 of the drive module 1110 is configured to be coupled to a corresponding mounting interface on the shaft assemblies 2000 , 3000 , 4000 , and 5000 , for example. for instance, the shaft assembly 2000 comprises a mounting interface 2130 configured to be coupled to the mounting interface 1130 of the drive module 1100 . more specifically, the proximal portion 2100 of the shaft assembly 2000 comprises a housing 2110 which defines the mounting interface 2130 . referring primarily to fig. 8 , the drive module 1100 comprises latches 1140 which are configured to releasably hold the mounting interface 2130 of the shaft assembly 2000 against the mounting interface 1130 of the drive module 1100 . when the drive module 1100 and the shaft assembly 2000 are brought together along a longitudinal axis, as described above, the latches 1140 contact the mounting interface 2130 and rotate outwardly into an unlocked position. referring primarily to figs. 8, 10, and 11 , each latch 1140 comprises a lock end 1142 and a pivot portion 1144 . the pivot portion 1144 of each latch 1140 is rotatably coupled to the housing 1110 of the drive module 1100 and, when the latches 1140 are rotated outwardly, as mentioned above, the latches 1140 rotate about the pivot portions 1144 . notably, each latch 1140 further comprises a biasing spring 1146 configured to bias the latches 1140 inwardly into a locked position. each biasing spring 1146 is compressed between a latch 1140 and the housing 1110 of the drive module 1100 such that the biasing springs 1146 apply biasing forces to the latches 1140 ; however, such biasing forces are overcome when the latches 1140 are rotated outwardly into their unlocked positions by the shaft assembly 2000 . that said, when the latches 1140 rotate outwardly after contacting the mounting interface 2130 , the lock ends 1142 of the latches 1140 can enter into latch windows 2140 defined in the mounting interface 2130 . once the lock ends 1142 pass through the latch windows 2140 , the springs 1146 can bias the latches 1140 back into their locked positions. each lock end 1142 comprises a lock shoulder, or surface, which securely holds the shaft assembly 2000 to the drive module 1100 . further to the above, the biasing springs 1146 hold the latches 1140 in their locked positions. the distal ends 1142 are sized and configured to prevent, or at least inhibit, relative longitudinal movement, i.e., translation along a longitudinal axis, between the shaft assembly 2000 and the drive module 1100 when the latches 1140 are in their locked positions. moreover, the latches 1140 and the latch windows 1240 are sized and configured to prevent relative lateral movement, i.e., translation transverse to the longitudinal axis, between the shaft assembly 2000 and the drive module 1100 . in addition, the latches 1140 and the latch windows 2140 are sized and configured to prevent the shaft assembly 2000 from rotating relative to the drive module 1100 . the drive module 1100 further comprises release actuators 1150 which, when depressed by a clinician, move the latches 1140 from their locked positions into their unlocked positions. the drive module 1100 comprises a first release actuator 1150 slideably mounted in an opening defined in the first side of the handle housing 1110 and a second release actuator 1150 slideably mounted in an opening defined in a second, or opposite, side of the handle housing 1110 . although the release actuators 1150 are actuatable separately, both release actuators 1150 typically need to be depressed to completely unlock the shaft assembly 2000 from the drive module 1100 and allow the shaft assembly 2000 to be detached from the drive module 1100 . that said, it is possible that the shaft assembly 2000 could be detached from the drive module 1100 by depressing only one release actuator 1150 . once the shaft assembly 2000 has been secured to the handle 1000 and the end effector 7000 , for example, has been assembled to the shaft 2000 , the clinician can maneuver the handle 1000 to insert the end effector 7000 into a patient. in at least one instance, the end effector 7000 is inserted into the patient through a trocar and then manipulated in order to position the jaw assembly 7100 of the end effector assembly 7000 relative to the patient's tissue. oftentimes, the jaw assembly 7100 must be in its closed, or clamped, configuration in order to fit through the trocar. once through the trocar, the jaw assembly 7100 can be opened so that the patient tissue fit between the jaws of the jaw assembly 7100 . at such point, the jaw assembly 7100 can be returned to its closed configuration to clamp the patient tissue between the jaws. the clamping force applied to the patient tissue by the jaw assembly 7100 is sufficient to move or otherwise manipulate the tissue during a surgical procedure. thereafter, the jaw assembly 7100 can be re-opened to release the patient tissue from the end effector 7000 . this process can be repeated until it is desirable to remove the end effector 7000 from the patient. at such point, the jaw assembly 7100 can be returned to its closed configuration and retracted through the trocar. other surgical techniques are envisioned in which the end effector 7000 is inserted into a patient through an open incision, or without the use of the trocar. in any event, it is envisioned that the jaw assembly 7100 may have to be opened and closed several times throughout a surgical technique. referring again to figs. 3-6 , the shaft assembly 2000 further comprises a clamping trigger system 2600 and a control system 2800 . the clamping trigger system 2600 comprises a clamping trigger 2610 rotatably connected to the proximal housing 2110 of the shaft assembly 2000 . as discussed below, the clamping trigger 2610 actuates the motor 1610 to operate the jaw drive of the end effector 7000 when the clamping trigger 2610 is actuated. the clamping trigger 2610 comprises an elongate portion which is graspable by the clinician while holding the handle 1000 . the clamping trigger 2610 further comprises a mounting portion 2620 which is pivotably connected to a mounting portion 2120 of the proximal housing 2110 such that the clamping trigger 2610 is rotatable about a fixed, or an at least substantially fixed, axis. the closure trigger 2610 is rotatable between a distal position and a proximal position, wherein the proximal position of the closure trigger 2610 is closer to the pistol grip of the handle 1000 than the distal position. the closure trigger 2610 further comprises a tab 2615 extending therefrom which rotates within the proximal housing 2110 . when the closure trigger 2610 is in its distal position, the tab 2615 is positioned above, but not in contact with, a switch 2115 mounted on the proximal housing 2110 . the switch 2115 is part of an electrical circuit configured to detect the actuation of the closure trigger 2610 which is in an open condition the closure trigger 2610 is in its open position. when the closure trigger 2610 is moved into its proximal position, the tab 2615 comes into contact with the switch 2115 and closes the electrical circuit. in various instances, the switch 2115 can comprise a toggle switch, for example, which is mechanically switched between open and closed states when contacted by the tab 2615 of the closure trigger 2610 . in certain instances, the switch 2115 can comprise a proximity sensor, for example, and/or any suitable type of sensor. in at least one instance, the switch 2115 comprises a hall effect sensor which can detect the amount in which the closure trigger 2610 has been rotated and, based on the amount of rotation, control the speed in which the motor 1610 is operated. in such instances, larger rotations of the closure trigger 2610 result in faster speeds of the motor 1610 while smaller rotations result in slower speeds, for example. in any event, the electrical circuit is in communication with the control system 2800 of the shaft assembly 2000 , which is discussed in greater detail below. further to the above, the control system 2800 of the shaft assembly 2000 comprises a printed circuit board (pcb) 2810 , at least one microprocessor 2820 , and at least one memory device 2830 . the board 2810 can be rigid and/or flexible and can comprise any suitable number of layers. the microprocessor 2820 and the memory device 2830 are part of a control circuit defined on the board 2810 which communicates with the control system 1800 of the handle 1000 . the shaft assembly 2000 further comprises a signal communication system 2900 and the handle 1000 further comprises a signal communication system 1900 which are configured to convey data between the shaft control system 2800 and the handle control system 1800 . the signal communication system 2900 is configured to transmit data to the signal communication system 1900 utilizing any suitable analog and/or digital components. in various instances, the communication systems 2900 and 1900 can communicate using a plurality of discrete channels which allows the input gates of the microprocessor 1820 to be directly controlled, at least in part, by the output gates of the microprocessor 2820 . in some instances, the communication systems 2900 and 1900 can utilize multiplexing. in at least one such instance, the control system 2900 includes a multiplexing device that sends multiple signals on a carrier channel at the same time in the form of a single, complex signal to a multiplexing device of the control system 1900 that recovers the separate signals from the complex signal. the communication system 2900 comprises an electrical connector 2910 mounted to the circuit board 2810 . the electrical connector 2910 comprises a connector body and a plurality of electrically-conductive contacts mounted to the connector body. the electrically-conductive contacts comprise male pins, for example, which are soldered to electrical traces defined in the circuit board 2810 . in other instances, the male pins can be in communication with circuit board traces through zero-insertion-force (zif) sockets, for example. the communication system 1900 comprises an electrical connector 1910 mounted to the circuit board 1810 . the electrical connector 1910 comprises a connector body and a plurality of electrically-conductive contacts mounted to the connector body. the electrically-conductive contacts comprise female pins, for example, which are soldered to electrical traces defined in the circuit board 1810 . in other instances, the female pins can be in communication with circuit board traces through zero-insertion-force (zif) sockets, for example. when the shaft assembly 2000 is assembled to the drive module 1100 , the electrical connector 2910 is operably coupled to the electrical connector 1910 such that the electrical contacts form electrical pathways therebetween. the above being said, the connectors 1910 and 2910 can comprise any suitable electrical contacts. moreover, the communication systems 1900 and 2900 can communicate with one another in any suitable manner. in various instances, the communication systems 1900 and 2900 communicate wirelessly. in at least one such instance, the communication system 2900 comprises a wireless signal transmitter and the communication system 1900 comprises a wireless signal receiver such that the shaft assembly 2000 can wirelessly communicate data to the handle 1000 . likewise, the communication system 1900 can comprise a wireless signal transmitter and the communication system 2900 can comprise a wireless signal receiver such that the handle 1000 can wirelessly communicate data to the shaft assembly 2000 . as discussed above, the control system 1800 of the handle 1000 is in communication with, and is configured to control, the electrical power circuit of the handle 1000 . the handle control system 1800 is also powered by the electrical power circuit of the handle 1000 . the handle communication system 1900 is in signal communication with the handle control system 1800 and is also powered by the electrical power circuit of the handle 1000 . the handle communication system 1900 is powered by the handle electrical power circuit via the handle control system 1800 , but could be directly powered by the electrical power circuit. as also discussed above, the handle communication system 1900 is in signal communication with the shaft communication system 2900 . that said, the shaft communication system 2900 is also powered by the handle electrical power circuit via the handle communication system 1900 . to this end, the electrical connectors 1910 and 2010 connect both one or more signal circuits and one or more power circuits between the handle 1000 and the shaft assembly 2000 . moreover, the shaft communication system 2900 is in signal communication with the shaft control system 2800 , as discussed above, and is also configured to supply power to the shaft control system 2800 . thus, the control systems 1800 and 2800 and the communication systems 1900 and 2900 are all powered by the electrical power circuit of the handle 1000 ; however, alternative embodiments are envisioned in which the shaft assembly 2000 comprises its own power source, such as one or more batteries, for example, an and electrical power circuit configured to supply power from the batteries to the handle systems 2800 and 2900 . in at least one such embodiment, the handle control system 1800 and the handle communication system 1900 are powered by the handle electrical power system and the shaft control system 2800 and the handle communication system 2900 are powered by the shaft electrical power system. further to the above, the actuation of the clamping trigger 2610 is detected by the shaft control system 2800 and communicated to the handle control system 1800 via the communication systems 2900 and 1900 . upon receiving a signal that the clamping trigger 2610 has been actuated, the handle control system 1800 supplies power to the electric motor 1610 of the motor assembly 1600 to rotate the drive shaft 1710 of the handle drive system 1700 , and the drive shaft 2710 of the shaft drive system 2700 , in a direction which closes the jaw assembly 7100 of the end effector 7000 . the mechanism for converting the rotation of the drive shaft 2710 to a closure motion of the jaw assembly 7100 is discussed in greater detail below. so long as the clamping trigger 2610 is held in its actuated position, the electric motor 1610 will rotate the drive shaft 1710 until the jaw assembly 7100 reaches its fully-clamped position. when the jaw assembly 7100 reaches its fully-clamped position, the handle control system 1800 cuts the electrical power to the electric motor 1610 . the handle control system 1800 can determine when the jaw assembly 7100 has reached its fully-clamped position in any suitable manner. for instance, the handle control system 1800 can comprise an encoder system which monitors the rotation of, and counts the rotations of, the output shaft of the electric motor 1610 and, once the number of rotations reaches a predetermined threshold, the handle control system 1800 can discontinue supplying power to the electric motor 1610 . in at least one instance, the end effector assembly 7000 can comprise one or more sensors configured to detect when the jaw assembly 7100 has reached its fully-clamped position. in at least one such instance, the sensors in the end effector 7000 are in signal communication with the handle control system 1800 via electrical circuits extending through the shaft assembly 2000 which can include the electrical contacts 1520 and 2520 , for example. when the clamping trigger 2610 is rotated distally out of its proximal position, the switch 2115 is opened which is detected by the shaft control system 2800 and communicated to the handle control system 1800 via the communication systems 2900 and 1900 . upon receiving a signal that the clamping trigger 2610 has been moved out of its actuated position, the handle control system 1800 reverses the polarity of the voltage differential being applied to the electric motor 1610 of the motor assembly 1600 to rotate the drive shaft 1710 of the handle drive system 1700 , and the drive shaft 2710 of the shaft drive system 2700 , in an opposite direction which, as a result, opens the jaw assembly 7100 of the end effector 7000 . when the jaw assembly 7100 reaches its fully-open position, the handle control system 1800 cuts the electrical power to the electric motor 1610 . the handle control system 1800 can determine when the jaw assembly 7100 has reached its fully-open position in any suitable manner. for instance, the handle control system 1800 can utilize the encoder system and/or the one or more sensors described above to determine the configuration of the jaw assembly 7100 . in view of the above, the clinician needs to be mindful about holding the clamping trigger 2610 in its actuated position in order to maintain the jaw assembly 7100 in its clamped configuration as, otherwise, the control system 1800 will open jaw assembly 7100 . with this in mind, the shaft assembly 2000 further comprises an actuator latch 2630 configured to releasably hold the clamping trigger 2610 in its actuated position to prevent the accidental opening of the jaw assembly 7100 . the actuator latch 2630 can be manually released, or otherwise defeated, by the clinician to allow the clamping trigger 2610 to be rotated distally and open the jaw assembly 7100 . the clamping trigger system 2600 further comprises a resilient biasing member, such as a torsion spring, for example, configured to resist the closure of the clamping trigger system 2600 . the torsion spring can also assist in reducing and/or mitigating sudden movements and/or jitter of the clamping trigger 2610 . such a torsion spring can also automatically return the clamping trigger 2610 to its unactuated position when the clamping trigger 2610 is released. the actuator latch 2630 discussed above can suitably hold the clamping trigger 2610 in its actuated position against the biasing force of the torsion spring. as discussed above, the control system 1800 operates the electric motor 1610 to open and close the jaw assembly 7100 . the control system 1800 is configured to open and close the jaw assembly 7100 at the same speed. in such instances, the control system 1800 applies the same voltage pulses to the electric motor 1610 , albeit with different voltage polarities, when opening and closing the jaw assembly 7100 . that said, the control system 1800 can be configured to open and close the jaw assembly 7100 at different speeds. for instance, the jaw assembly 7100 can be closed at a first speed and opened at a second speed which is faster than the first speed. in such instances, the slower closing speed affords the clinician an opportunity to better position the jaw assembly 7100 while clamping the tissue. alternatively, the control system 1800 can open the jaw assembly 7100 at a slower speed. in such instances, the slower opening speed reduces the possibility of the opening jaws colliding with adjacent tissue. in either event, the control system 1800 can decrease the duration of the voltage pulses and/or increase the duration between the voltage pulses to slow down and/or speed up the movement of the jaw assembly 7100 . as discussed above, the control system 1800 is configured to interpret the position of the clamping trigger 2610 as a command to position the jaw assembly 7100 in a specific configuration. for instance, the control system 1800 is configured to interpret the proximal-most position of the clamping trigger 2610 as a command to close the jaw assembly 7100 and any other position of the clamping trigger as a command to open the jaw assembly 7100 . that said, the control system 1800 can be configured to interpret the position of the clamping trigger 2610 in a proximal range of positions, instead of a single position, as a command to close the jaw assembly 7100 . such an arrangement can allow the jaw assembly 7000 to be better responsive to the clinician's input. in such instances, the range of motion of the clamping trigger 2610 is divided into ranges—a proximal range which is interpreted as a command to close the jaw assembly 7100 and a distal range which is interpreted as a command to open the jaw assembly 7100 . in at least one instance, the range of motion of the clamping trigger 2610 can have an intermediate range between the proximal range and the distal range. when the clamping trigger 2610 is in the intermediate range, the control system 1800 can interpret the position of the clamping trigger 2610 as a command to neither open nor close the jaw assembly 7100 . such an intermediate range can prevent, or reduce the possibility of, jitter between the opening and closing ranges. in the instances described above, the control system 1800 can be configured to ignore cumulative commands to open or close the jaw assembly 7100 . for instance, if the closure trigger 2610 has already been fully retracted into its proximal-most position, the control assembly 1800 can ignore the motion of the clamping trigger 2610 in the proximal, or clamping, range until the clamping trigger 2610 enters into the distal, or opening, range wherein, at such point, the control system 1800 can then actuate the electric motor 1610 to open the jaw assembly 7100 . in certain instances, further to the above, the position of the clamping trigger 2610 within the clamping trigger range, or at least a portion of the clamping trigger range, can allow the clinician to control the speed of the electric motor 1610 and, thus, the speed in which the jaw assembly 7100 is being opened or closed by the control assembly 1800 . in at least one instance, the sensor 2115 comprises a hall effect sensor, and/or any other suitable sensor, configured to detect the position of the clamping trigger 2610 between its distal, unactuated position and its proximal, fully-actuated position. the hall effect sensor is configured to transmit a signal to the handle control system 1800 via the shaft control system 2800 such that the handle control system 1800 can control the speed of the electric motor 1610 in response to the position of the clamping trigger 2610 . in at least one instance, the handle control system 1800 controls the speed of the electric motor 1610 proportionately, or in a linear manner, to the position of the clamping trigger 2610 . for example, if the clamping trigger 2610 is moved half way through its range, then the handle control system 1800 will operate the electric motor 1610 at half of the speed in which the electric motor 1610 is operated when the clamping trigger 2610 is fully-retracted. similarly, if the clamping trigger 2610 is moved a quarter way through its range, then the handle control system 1800 will operate the electric motor 1610 at a quarter of the speed in which the electric motor 1610 is operated when the clamping trigger 2610 is fully-retracted. other embodiments are envisioned in which the handle control system 1800 controls the speed of the electric motor 1610 in a non-linear manner to the position of the clamping trigger 2610 . in at least one instance, the control system 1800 operates the electric motor 1610 slowly in the distal portion of the clamping trigger range while quickly accelerating the speed of the electric motor 1610 in the proximal portion of the clamping trigger range. as described above, the clamping trigger 2610 is movable to operate the electric motor 1610 to open or close the jaw assembly 7100 of the end effector 7000 . the electric motor 1610 is also operable to rotate the end effector 7000 about a longitudinal axis and articulate the end effector 7000 relative to the elongate shaft 2200 about the articulation joint 2300 of the shaft assembly 2000 . referring primarily to figs. 7 and 8 , the drive module 1100 comprises an input system 1400 including a rotation actuator 1420 and an articulation actuator 1430 . the input system 1400 further comprises a printed circuit board (pcb) 1410 which is in signal communication with the printed circuit board (pcb) 1810 of the control system 1800 . the drive module 1100 comprises an electrical circuit, such as a flexible wiring harness or ribbon, for example, which permits the input system 1400 to communicate with the control system 1800 . the rotation actuator 1420 is rotatably supported on the housing 1110 and is in signal communication with the input board 1410 and/or control board 1810 , as described in greater detail below. the articulation actuator 1430 is supported by and in signal communication with the input board 1410 and/or control board 1810 , as also described in greater detail below. referring primarily to figs. 8, 10, and 11 , further to the above, the handle housing 1110 comprises an annular groove or slot defined therein adjacent the distal mounting interface 1130 . the rotation actuator 1420 comprises an annular ring 1422 rotatably supported within the annular groove and, owing to the configuration of the sidewalls of the annular groove, the annular ring 1422 is constrained from translating longitudinally and/or laterally with respect to the handle housing 1110 . the annular ring 1422 is rotatable in a first, or clockwise, direction and a second, or counter-clockwise direction, about a longitudinal axis extending through the frame 1500 of the drive module 1100 . the rotation actuator 1420 comprises one or more sensors configured to detect the rotation of the annular ring 1422 . in at least one instance, the rotation actuator 1420 comprises a first sensor positioned on a first side of the drive module 1100 and a second sensor positioned on a second, or opposite, side of the drive module 1100 and the annular ring 1422 comprises a detectable element which is detectable by the first and second sensors. the first sensor is configured to detect when the annular ring 1422 is rotated in the first direction and the second sensor is configured to detect when the annular ring 1422 is rotated in the second direction. when the first sensor detects that the annular ring 1422 is rotated in the first direction, the handle control system 1800 rotates the handle drive shaft 1710 , the drive shaft 2710 , and the end effector 7000 in the first direction, as described in greater detail below. similarly, the handle control system 1800 rotates the handle drive shaft 1710 , the drive shaft 2710 , and the end effector 7000 in the second direction when the second sensor detects that the annular ring 1422 is rotated in the second direction. in view of the above, the reader should appreciate that the clamping trigger 2610 and the rotation actuator 1420 are both operable to rotate the drive shaft 2710 . in various embodiments, further to the above, the first and second sensors comprise switches which are mechanically closable by the detectable element of the annular ring 1422 . when the annular ring 1422 is rotated in the first direction from a center position, the detectable element closes the switch of the first sensor. when the switch of the first sensor is closed, the control system 1800 operates the electric motor 1610 to rotate the end effector 7000 in the first direction. when the annular ring 1422 is rotated in the second direction toward the center position, the detectable element is disengaged from the first switch and the first switch is re-opened. once the first switch is re-opened, the control system 1800 cuts the power to the electric motor 1610 to stop the rotation of the end effector 7000 . similarly, the detectable element closes the switch of the second sensor when the annular ring 1422 is rotated in the second direction from the center position. when the switch of the second sensor is closed, the control system 1800 operates the electric motor 1610 to rotate the end effector 7000 in the second direction. when the annular ring 1422 is rotated in the first direction toward the center position, the detectable element is disengaged from the second switch and the second switch is re-opened. once the second switch is re-opened, the control system 1800 cuts the power to the electric motor 1610 to stop the rotation of the end effector 7000 . in various embodiments, further to the above, the first and second sensors of the rotation actuator 1420 comprise proximity sensors, for example. in certain embodiments, the first and second sensors of the rotation actuator 1420 comprise hall effect sensors, and/or any suitable sensors, configured to detect the distance between the detectable element of the annular ring 1422 and the first and second sensors. if the first hall effect sensor detects that the annular ring 1422 has been rotated in the first direction, then, as discussed above, the control system 1800 will rotate the end effector 7000 in the first direction. in addition, the control system 1800 can rotate the end effector 7000 at a faster speed when the detectable element is closer to the first hall effect sensor than when the detectable element is further away from the first hall effect sensor. if the second hall effect sensor detects that the annular ring 1422 has been rotated in the second direction, then, as discussed above, the control system 1800 will rotate the end effector 7000 in the second direction. in addition, the control system 1800 can rotate the end effector 7000 at a faster speed when the detectable element is closer to the second hall effect sensor than when the detectable element is further away from the second hall effect sensor. as a result, the speed in which the end effector 7000 is rotated is a function of the amount, or degree, in which the annular ring 1422 is rotated. the control system 1800 is further configured to evaluate the inputs from both the first and second hall effect sensors when determining the direction and speed in which to rotate the end effector 7000 . in various instances, the control system 1800 can use the closest hall effect sensor to the detectable element of the annular ring 1422 as a primary source of data and the hall effect sensor furthest away from the detectable element as a confirmational source of data to double-check the data provided by the primary source of data. the control system 1800 can further comprise a data integrity protocol to resolve situations in which the control system 1800 is provided with conflicting data. in any event, the handle control system 1800 can enter into a neutral state in which the handle control system 1800 does not rotate the end effector 7000 when the hall effect sensors detect that the detectable element is in its center position, or in a position which is equidistant between the first hall effect sensor and the second hall effect sensor. in at least one such instance, the control system 1800 can enter into its neutral state when the detectable element is in a central range of positions. such an arrangement would prevent, or at least reduce the possibility of, rotational jitter when the clinician is not intending to rotate the end effector 7000 . further to the above, the rotation actuator 1420 can comprise one or more springs configured to center, or at least substantially center, the rotation actuator 1420 when it is released by the clinician. in such instances, the springs can act to shut off the electric motor 1610 and stop the rotation of the end effector 7000 . in at least one instance, the rotation actuator 1420 comprises a first torsion spring configured to rotate the rotation actuator 1420 in the first direction and a second torsion spring configured to rotate the rotation actuator 1420 in the second direction. the first and second torsion springs can have the same, or at least substantially the same, spring constant such that the forces and/or torques applied by the first and second torsion springs balance, or at least substantially balance, the rotation actuator 1420 in its center position. in view of the above, the reader should appreciate that the clamping trigger 2610 and the rotation actuator 1420 are both operable to rotate the drive shaft 2710 and either, respectively, operate the jaw assembly 7100 or rotate the end effector 7000 . the system that uses the rotation of the drive shaft 2710 to selectively perform these functions is described in greater detail below. referring to figs. 7 and 8 , the articulation actuator 1430 comprises a first push button 1432 and a second push button 1434 . the first push button 1432 is part of a first articulation control circuit and the second push button 1434 is part of a second articulation circuit of the input system 1400 . the first push button 1432 comprises a first switch that is closed when the first push button 1432 is depressed. the handle control system 1800 is configured to sense the closure of the first switch and, moreover, the closure of the first articulation control circuit. when the handle control system 1800 detects that the first articulation control circuit has been closed, the handle control system 1800 operates the electric motor 1610 to articulate the end effector 7000 in a first articulation direction about the articulation joint 2300 . when the first push button 1432 is released by the clinician, the first articulation control circuit is opened which, once detected by the control system 1800 , causes the control system 1800 to cut the power to the electric motor 1610 to stop the articulation of the end effector 7000 . in various instances, further to the above, the articulation range of the end effector 7000 is limited and the control system 1800 can utilize the encoder system discussed above for monitoring the rotational output of the electric motor 1610 , for example, to monitor the amount, or degree, in which the end effector 7000 is rotated in the first direction. in addition to or in lieu of the encoder system, the shaft assembly 2000 can comprise a first sensor configured to detect when the end effector 7000 has reached the limit of its articulation in the first direction. in any event, when the control system 1800 determines that the end effector 7000 has reached the limit of articulation in the first direction, the control system 1800 can cut the power to the electric motor 1610 to stop the articulation of the end effector 7000 . similar to the above, the second push button 1434 comprises a second switch that is closed when the second push button 1434 is depressed. the handle control system 1800 is configured to sense the closure of the second switch and, moreover, the closure of the second articulation control circuit. when the handle control system 1800 detects that the second articulation control circuit has been closed, the handle control system 1800 operates the electric motor 1610 to articulate the end effector 7000 in a second direction about the articulation joint 2300 . when the second push button 1434 is released by the clinician, the second articulation control circuit is opened which, once detected by the control system 1800 , causes the control system 1800 to cut the power to the electric motor 1610 to stop the articulation of the end effector 7000 . in various instances, the articulation range of the end effector 7000 is limited and the control system 1800 can utilize the encoder system discussed above for monitoring the rotational output of the electric motor 1610 , for example, to monitor the amount, or degree, in which the end effector 7000 is rotated in the second direction. in addition to or in lieu of the encoder system, the shaft assembly 2000 can comprise a second sensor configured to detect when the end effector 7000 has reached the limit of its articulation in the second direction. in any event, when the control system 1800 determines that the end effector 7000 has reached the limit of articulation in the second direction, the control system 1800 can cut the power to the electric motor 1610 to stop the articulation of the end effector 7000 . as described above, the end effector 7000 is articulatable in a first direction ( fig. 16 ) and/or a second direction ( fig. 17 ) from a center, or unarticulated, position ( fig. 15 ). once the end effector 7000 has been articulated, the clinician can attempt to re-center the end effector 7000 by using the first and second articulation push buttons 1432 and 1434 . as the reader can appreciate, the clinician may struggle to re-center the end effector 7000 as, for instance, the end effector 7000 may not be entirely visible once it is positioned in the patient. in some instances, the end effector 7000 may not fit back through a trocar if the end effector 7000 is not re-centered, or at least substantially re-centered. with that in mind, the control system 1800 is configured to provide feedback to the clinician when the end effector 7000 is moved into its unarticulated, or centered, position. in at least one instance, the feedback comprises audio feedback and the handle control system 1800 can comprise a speaker which emits a sound, such as a beep, for example, when the end effector 7000 is centered. in certain instances, the feedback comprises visual feedback and the handle control system 1800 can comprise a light emitting diode (led), for example, positioned on the handle housing 1110 which flashes when the end effector 7000 is centered. in various instances, the feedback comprises haptic feedback and the handle control system 1800 can comprise an electric motor comprising an eccentric element which vibrates the handle 1000 when the end effector 7000 is centered. manually re-centering the end effector 7000 in this way can be facilitated by the control system 1800 slowing the motor 1610 when the end effector 7000 is approaching its centered position. in at least one instance, the control system 1800 slows the articulation of the end effector 7000 when the end effector 7000 is within approximately 5 degrees of center in either direction, for example. in addition to or in lieu of the above, the handle control system 1800 can be configured to re-center the end effector 7000 . in at least one such instance, the handle control system 1800 can re-center the end effector 7000 when both of the articulation buttons 1432 and 1434 of the articulation actuator 1430 are depressed at the same time. when the handle control system 1800 comprises an encoder system configured to monitor the rotational output of the electric motor 1610 , for example, the handle control system 1800 can determine the amount and direction of articulation needed to re-center, or at least substantially re-center, the end effector 7000 . in various instances, the input system 1400 can comprise a home button, for example, which, when depressed, automatically centers the end effector 7000 . referring primarily to figs. 5 and 6 , the elongate shaft 2200 of the shaft assembly 2000 comprises an outer housing, or tube, 2210 mounted to the proximal housing 2110 of the proximal portion 2100 . the outer housing 2210 comprises a longitudinal aperture 2230 extending therethrough and a proximal flange 2220 which secures the outer housing 2210 to the proximal housing 2110 . the frame 2500 of the shaft assembly 2000 extends through the longitudinal aperture 2230 of the elongate shaft 2200 . more specifically, the shaft 2510 of the shaft frame 2500 necks down into a smaller shaft 2530 which extends through the longitudinal aperture 2230 . that said, the shaft frame 2500 can comprise any suitable arrangement. the drive system 2700 of the shaft assembly 2000 also extends through the longitudinal aperture 2230 of the elongate shaft 2200 . more specifically, the drive shaft 2710 of the shaft drive system 2700 necks down into a smaller drive shaft 2730 which extends through the longitudinal aperture 2230 . that said, the shaft drive system 2700 can comprise any suitable arrangement. referring primarily to figs. 20, 23, and 24 , the outer housing 2210 of the elongate shaft 2200 extends to the articulation joint 2300 . the articulation joint 2300 comprises a proximal frame 2310 mounted to the outer housing 2210 such that there is little, if any, relative translation and/or rotation between the proximal frame 2310 and the outer housing 2210 . referring primarily to fig. 22 , the proximal frame 2310 comprises an annular portion 2312 mounted to the sidewall of the outer housing 2210 and tabs 2314 extending distally from the annular portion 2312 . the articulation joint 2300 further comprises links 2320 and 2340 which are rotatably mounted to the frame 2310 and mounted to an outer housing 2410 of the distal attachment portion 2400 . the link 2320 comprises a distal end 2322 mounted to the outer housing 2410 . more specifically, the distal end 2322 of the link 2320 is received and fixedly secured within a mounting slot 2412 defined in the outer housing 2410 . similarly, the link 2340 comprises a distal end 2342 mounted to the outer housing 2410 . more specifically, the distal end 2342 of the link 2340 is received and fixedly secured within a mounting slot defined in the outer housing 2410 . the link 2320 comprises a proximal end 2324 rotatably coupled to a tab 2314 of the proximal articulation frame 2310 . although not illustrated in fig. 22 , a pin extends through apertures defined in the proximal end 2324 and the tab 2314 to define a pivot axis therebetween. similarly, the link 2340 comprises a proximal end 2344 rotatably coupled to a tab 2314 of the proximal articulation frame 2310 . although not illustrated in fig. 22 , a pin extends through apertures defined in the proximal end 2344 and the tab 2314 to define a pivot axis therebetween. these pivot axes are collinear, or at least substantially collinear, and define an articulation axis a of the articulation joint 2300 . referring primarily to figs. 20, 23, and 24 , the outer housing 2410 of the distal attachment portion 2400 comprises a longitudinal aperture 2430 extending therethrough. the longitudinal aperture 2430 is configured to receive a proximal attachment portion 7400 of the end effector 7000 . the end effector 7000 comprises an outer housing 6230 which is closely received within the longitudinal aperture 2430 of the distal attachment portion 2400 such that there is little, if any, relative radial movement between the proximal attachment portion 7400 of the end effector 7000 and the distal attachment portion 2400 of the shaft assembly 2000 . the proximal attachment portion 7400 further comprises an annular array of lock notches 7410 defined on the outer housing 6230 which is releasably engaged by an end effector lock 6400 in the distal attachment portion 2400 of the shaft assembly 2000 . when the end effector lock 6400 is engaged with the array of lock notches 7410 , the end effector lock 6400 prevents, or at least inhibits, relative longitudinal movement between the proximal attachment portion 7400 of the end effector 7000 and the distal attachment portion 2400 of the shaft assembly 2000 . as a result of the above, only relative rotation between the proximal attachment portion 7400 of the end effector 7000 and the distal attachment portion 2400 of the shaft assembly 2000 is permitted. to this end, the outer housing 6230 of the end effector 7000 is closely received within the longitudinal aperture 2430 defined in the distal attachment portion 2400 of the shaft assembly 2000 . further to the above, referring to fig. 21 , the outer housing 6230 further comprises an annular slot, or recess, 6270 defined therein which is configured to receive an o-ring 6275 therein. the o-ring 6275 is compressed between the outer housing 6230 and the sidewall of the longitudinal aperture 2430 when the end effector 7000 is inserted into the distal attachment portion 2400 . the o-ring 6275 is configured to resist, but permit, relative rotation between the end effector 7000 and the distal attachment portion 2400 such that the o-ring 6275 can prevent, or reduce the possibility of, unintentional relative rotation between the end effector 7000 and the distal attachment portion 2400 . in various instances, the o-ring 6275 can provide a seal between the end effector 7000 and the distal attachment portion 2400 to prevent, or at least reduce the possibility of, fluid ingress into the shaft assembly 2000 , for example. referring to figs. 14-21 , the jaw assembly 7100 of the end effector 7000 comprises a first jaw 7110 and a second jaw 7120 . each jaw 7110 , 7120 comprises a distal end which is configured to assist a clinician in dissecting tissue with the end effector 7000 . each jaw 7110 , 7120 further comprises a plurality of teeth which are configured to assist a clinician in grasping and holding onto tissue with the end effector 7000 . moreover, referring primarily to fig. 21 , each jaw 7110 , 7120 comprises a proximal end, i.e., proximal ends 7115 , 7125 , respectively, which rotatably connect the jaws 7110 , 7120 together. each proximal end 7115 , 7125 comprises an aperture extending therethrough which is configured to closely receive a pin 7130 therein. the pin 7130 comprises a central body 7135 closely received within the apertures defined in the proximal ends 7115 , 7125 of the jaws 7110 , 7120 such that there is little, if any, relative translation between the jaws 7110 , 7120 and the pin 7130 . the pin 7130 defines a jaw axis j about which the jaws 7110 , 7120 can be rotated and, also, rotatably mounts the jaws 7110 , 7120 to the outer housing 6230 of the end effector 7000 . more specifically, the outer housing 6230 comprises distally-extending tabs 6235 having apertures defined therein which are also configured to closely receive the pin 7130 such that the jaw assembly 7100 does not translate relative to a shaft portion 7200 of the end effector 7000 . the pin 7130 further comprises enlarged ends which prevent the jaws 7110 , 7120 from becoming detached from the pin 7130 and also prevents the jaw assembly 7100 from becoming detached from the shaft portion 7200 . this arrangement defines a rotation joint 7300 . referring primarily to figs. 21 and 23 , the jaws 7110 and 7120 are rotatable between their open and closed positions by a jaw assembly drive including drive links 7140 , a drive nut 7150 , and a drive screw 6130 . as described in greater detail below, the drive screw 6130 is selectively rotatable by the drive shaft 2730 of the shaft drive system 2700 . the drive screw 6130 comprises an annular flange 6132 which is closely received within a slot, or groove, 6232 ( fig. 25 ) defined in the outer housing 6230 of the end effector 7000 . the sidewalls of the slot 6232 are configured to prevent, or at least inhibit, longitudinal and/or radial translation between the drive screw 6130 and the outer housing 6230 , but yet permit relative rotational motion between the drive screw 6130 and the outer housing 6230 . the drive screw 6130 further comprises a threaded end 6160 which is threadably engaged with a threaded aperture 7160 defined in the drive nut 7150 . the drive nut 7150 is constrained from rotating with the drive screw 6130 and, as a result, the drive nut 7150 is translated when the drive screw 6130 is rotated. in use, the drive screw 6130 is rotated in a first direction to displace the drive nut 7150 proximally and in a second, or opposite, direction to displace the drive nut 7150 distally. the drive nut 7150 further comprises a distal end 7155 comprising an aperture defined therein which is configured to closely receive pins 7145 extending from the drive links 7140 . referring primarily to fig. 21 , a first drive link 7140 is attached to one side of the distal end 7155 and a second drive link 7140 is attached to the opposite side of the distal end 7155 . the first drive link 7140 comprises another pin 7145 extending therefrom which is closely received in an aperture defined in the proximal end 7115 of the first jaw 7110 and, similarly, the second drive link 7140 comprises another pin extending therefrom which is closely received in an aperture defined in the proximal end 7125 of the second jaw 7120 . as a result of the above, the drive links 7140 operably connect the jaws 7110 and 7120 to the drive nut 7150 . when the drive nut 7150 is driven proximally by the drive screw 6130 , as described above, the jaws 7110 , 7120 are rotated into the closed, or clamped, configuration. correspondingly, the jaws 7110 , 7120 are rotated into their open configuration when the drive nut 7150 is driven distally by the drive screw 6130 . as discussed above, the control system 1800 is configured to actuate the electric motor 1610 to perform three different end effector functions—clamping/opening the jaw assembly 7100 ( figs. 14 and 15 ), rotating the end effector 7000 about a longitudinal axis ( figs. 18 and 19 ), and articulating the end effector 7000 about an articulation axis ( figs. 16 and 17 ). referring primarily to figs. 26 and 27 , the control system 1800 is configured to operate a transmission 6000 to selectively perform these three end effector functions. the transmission 6000 comprises a first clutch system 6100 configured to selectively transmit the rotation of the drive shaft 2730 to the drive screw 6130 of the end effector 7000 to open or close the jaw assembly 7100 , depending on the direction in which the drive shaft 2730 is rotated. the transmission 6000 further comprises a second clutch system 6200 configured to selectively transmit the rotation of the drive shaft 2730 to the outer housing 6230 of the end effector 7000 to rotate the end effector 7000 about the longitudinal axis l. the transmission 6000 also comprises a third clutch system 6300 configured to selectively transmit the rotation of the drive shaft 2730 to the articulation joint 2300 to articulate the distal attachment portion 2400 and the end effector 7000 about the articulation axis a. the clutch systems 6100 , 6200 , and 6300 are in electrical communication with the control system 1800 via electrical circuits extending through the shaft 2510 , the connector pins 2520 , the connector pins 1520 , and the shaft 1510 , for example. in at least one instance, each of these clutch control circuits comprises two connector pins 2520 and two connector pins 1520 , for example. in various instances, further to the above, the shaft 2510 and/or the shaft 1510 comprise a flexible circuit including electrical traces which form part of the clutch control circuits. the flexible circuit can comprise a ribbon, or substrate, with conductive pathways defined therein and/or thereon. the flexible circuit can also comprise sensors and/or any solid state component, such as signal smoothing capacitors, for example, mounted thereto. in at least one instance, each of the conductive pathways can comprise one or more signal smoothing capacitors which can, among other things, even out fluctuations in signals transmitted through the conductive pathways. in various instances, the flexible circuit can be coated with at least one material, such as an elastomer, for example, which can seal the flexible circuit against fluid ingress. referring primarily to fig. 28 , the first clutch system 6100 comprises a first clutch 6110 , an expandable first drive ring 6120 , and a first electromagnetic actuator 6140 . the first clutch 6110 comprises an annular ring and is slideably disposed on the drive shaft 2730 . the first clutch 6110 is comprised of a magnetic material and is movable between a disengaged, or unactuated, position ( fig. 28 ) and an engaged, or actuated, position ( fig. 29 ) by electromagnetic fields ef generated by the first electromagnetic actuator 6140 . in various instances, the first clutch 6110 is at least partially comprised of iron and/or nickel, for example. in at least one instance, the first clutch 6110 comprises a permanent magnet. as illustrated in fig. 22a , the drive shaft 2730 comprises one or more longitudinal key slots 6115 defined therein which are configured to constrain the longitudinal movement of the clutch 6110 relative to the drive shaft 2730 . more specifically, the clutch 6110 comprises one or more keys extending into the key slots 6115 such that the distal ends of the key slots 6115 stop the distal movement of the clutch 6110 and the proximal ends of the key slots 6115 stop the proximal movement of the clutch 6110 . when the first clutch 6110 is in its disengaged position ( fig. 28 ), the first clutch 6110 rotates with the drive shaft 2130 but does not transmit rotational motion to the first drive ring 6120 . as can be seen in fig. 28 , the first clutch 6110 is separated from, or not in contact with, the first drive ring 6120 . as a result, the rotation of the drive shaft 2730 and the first clutch 6110 is not transmitted to the drive screw 6130 when the first clutch assembly 6100 is in its disengaged state. when the first clutch 6110 is in its engaged position ( fig. 29 ), the first clutch 6110 is engaged with the first drive ring 6120 such that the first drive ring 6120 is expanded, or stretched, radially outwardly into contact with the drive screw 6130 . in at least one instance, the first drive ring 6120 comprises an elastomeric band, for example. as can be seen in fig. 29 , the first drive ring 6120 is compressed against an annular inner sidewall 6135 of the drive screw 6130 . as a result, the rotation of the drive shaft 2730 and the first clutch 6110 is transmitted to the drive screw 6130 when the first clutch assembly 6100 is in its engaged state. depending on the direction in which the drive shaft 2730 is rotated, the first clutch assembly 6100 can move the jaw assembly 7100 into its open and closed configurations when the first clutch assembly 6100 is in its engaged state. as described above, the first electromagnetic actuator 6140 is configured to generate magnetic fields to move the first clutch 6110 between its disengaged ( fig. 28 ) and engaged ( fig. 29 ) positions. for instance, referring to fig. 28 , the first electromagnetic actuator 6140 is configured to emit a magnetic field ef l which repulses, or drives, the first clutch 6110 away from the first drive ring 6120 when the first clutch assembly 6100 is in its disengaged state. the first electromagnetic actuator 6140 comprises one or more wound coils in a cavity defined in the shaft frame 2530 which generate the magnetic field ef l when current flows in a first direction through a first electrical clutch circuit including the wound coils. the control system 1800 is configured to apply a first voltage polarity to the first electrical clutch circuit to create the current flowing in the first direction. the control system 1800 can continuously apply the first voltage polarity to the first electric shaft circuit to continuously hold the first clutch 6110 in its disengaged position. while such an arrangement can prevent the first clutch 6110 from unintentionally engaging the first drive ring 6120 , such an arrangement can also consume a lot of power. alternatively, the control system 1800 can apply the first voltage polarity to the first electrical clutch circuit for a sufficient period of time to position the first clutch 6110 in its disengaged position and then discontinue applying the first voltage polarity to the first electric clutch circuit, thereby resulting in a lower consumption of power. that being said, the first clutch assembly 6100 further comprises a first clutch lock 6150 mounted in the drive screw 6130 which is configured to releasably hold the first clutch 6110 in its disengaged position. the first clutch lock 6150 is configured to prevent, or at least reduce the possibility of, the first clutch 6110 from becoming unintentionally engaged with the first drive ring 6120 . when the first clutch 6110 is in its disengaged position, as illustrated in fig. 28 , the first clutch lock 6150 interferes with the free movement of the first clutch 6110 and holds the first clutch 6110 in position via a friction force and/or an interference force therebetween. in at least one instance, the first clutch lock 6150 comprises an elastomeric plug, seat, or detent, comprised of rubber, for example. in certain instances, the first clutch lock 6150 comprises a permanent magnet which holds the first clutch 6110 in its disengaged position by an electromagnetic force. in any event, the first electromagnetic actuator 6140 can apply an electromagnetic pulling force to the first clutch 6110 that overcomes these forces, as described in greater detail below. further to the above, referring to fig. 29 , the first electromagnetic actuator 6140 is configured to emit a magnetic field ef d which pulls, or drives, the first clutch 6110 toward the first drive ring 6120 when the first clutch assembly 6100 is in its engaged state. the coils of the first electromagnetic actuator 6140 generate the magnetic field ef d when current flows in a second, or opposite, direction through the first electrical clutch circuit. the control system 1800 is configured to apply an opposite voltage polarity to the first electrical clutch circuit to create the current flowing in the opposite direction. the control system 1800 can continuously apply the opposite voltage polarity to the first electrical clutch circuit to continuously hold the first clutch 6110 in its engaged position and maintain the operable engagement between the first drive ring 6120 and the drive screw 6130 . alternatively, the first clutch 6110 can be configured to become wedged within the first drive ring 6120 when the first clutch 6110 is in its engaged position and, in such instances, the control system 1800 may not need to continuously apply a voltage polarity to the first electrical clutch circuit to hold the first clutch assembly 6100 in its engaged state. in such instances, the control system 1800 can discontinue applying the voltage polarity once the first clutch 6110 has been sufficiently wedged in the first drive ring 6120 . notably, further to the above, the first clutch lock 6150 is also configured to lockout the jaw assembly drive when the first clutch 6110 is in its disengaged position. more specifically, referring again to fig. 28 , the first clutch 6110 pushes the first clutch lock 6150 in the drive screw 6130 into engagement with the outer housing 6230 of the end effector 7000 when the first clutch 6110 is in its disengaged position such that the drive screw 6130 does not rotate, or at least substantially rotate, relative to the outer housing 6230 . the outer housing 6230 comprises a slot 6235 defined therein which is configured to receive the first clutch lock 6150 . when the first clutch 6110 is moved into its engaged position, referring to fig. 29 , the first clutch 6110 is no longer engaged with the first clutch lock 6150 and, as a result, the first clutch lock 6150 is no longer biased into engagement with the outer housing 6230 and the drive screw 6130 can rotate freely with respect to the outer housing 6230 . as a result of the above, the first clutch 6110 can do at least two things—operate the jaw drive when the first clutch 6110 is in its engaged position and lock out the jaw drive when the first clutch 6110 is in its disengaged position. moreover, further to the above, the threads of the threaded portions 6160 and 7160 can be configured to prevent, or at least resist, backdriving of the jaw drive. in at least one instance, the thread pitch and/or angle of the threaded portions 6160 and 7160 , for example, can be selected to prevent the backdriving, or unintentional opening, of the jaw assembly 7100 . as a result of the above, the possibility of the jaw assembly 7100 unintentionally opening or closing is prevented, or at least reduced. referring primarily to fig. 30 , the second clutch system 6200 comprises a second clutch 6210 , an expandable second drive ring 6220 , and a second electromagnetic actuator 6240 . the second clutch 6210 comprises an annular ring and is slideably disposed on the drive shaft 2730 . the second clutch 6210 is comprised of a magnetic material and is movable between a disengaged, or unactuated, position ( fig. 30 ) and an engaged, or actuated, position ( fig. 31 ) by electromagnetic fields ef generated by the second electromagnetic actuator 6240 . in various instances, the second clutch 6210 is at least partially comprised of iron and/or nickel, for example. in at least one instance, the second clutch 6210 comprises a permanent magnet. as illustrated in fig. 22a , the drive shaft 2730 comprises one or more longitudinal key slots 6215 defined therein which are configured to constrain the longitudinal movement of the second clutch 6210 relative to the drive shaft 2730 . more specifically, the second clutch 6210 comprises one or more keys extending into the key slots 6215 such that the distal ends of the key slots 6215 stop the distal movement of the second clutch 6210 and the proximal ends of the key slots 6215 stop the proximal movement of the second clutch 6210 . when the second clutch 6210 is in its disengaged position, referring to fig. 30 , the second clutch 6210 rotates with the drive shaft 2730 but does not transmit rotational motion to the second drive ring 6220 . as can be seen in fig. 30 , the second clutch 6210 is separated from, or not in contact with, the second drive ring 6220 . as a result, the rotation of the drive shaft 2730 and the second clutch 6210 is not transmitted to the outer housing 6230 of the end effector 7000 when the second clutch assembly 6200 is in its disengaged state. when the second clutch 6210 is in its engaged position ( fig. 31 ), the second clutch 6210 is engaged with the second drive ring 6220 such that the second drive ring 6220 is expanded, or stretched, radially outwardly into contact with the outer housing 6230 . in at least one instance, the second drive ring 6220 comprises an elastomeric band, for example. as can be seen in fig. 31 , the second drive ring 6220 is compressed against an annular inner sidewall 7415 of the outer housing 6230 . as a result, the rotation of the drive shaft 2730 and the second clutch 6210 is transmitted to the outer housing 6230 when the second clutch assembly 6200 is in its engaged state. depending on the direction in which the drive shaft 2730 is rotated, the second clutch assembly 6200 can rotate the end effector 7000 in a first direction or a second direction about the longitudinal axis l when the second clutch assembly 6200 is in its engaged state. as described above, the second electromagnetic actuator 6240 is configured to generate magnetic fields to move the second clutch 6210 between its disengaged ( fig. 30 ) and engaged ( fig. 31 ) positions. for instance, the second electromagnetic actuator 6240 is configured to emit a magnetic field ef l which repulses, or drives, the second clutch 6210 away from the second drive ring 6220 when the second clutch assembly 6200 is in its disengaged state. the second electromagnetic actuator 6240 comprises one or more wound coils in a cavity defined in the shaft frame 2530 which generate the magnetic field ef l when current flows in a first direction through a second electrical clutch circuit including the wound coils. the control system 1800 is configured to apply a first voltage polarity to the second electrical clutch circuit to create the current flowing in the first direction. the control system 1800 can continuously apply the first voltage polarity to the second electric clutch circuit to continuously hold the second clutch 6120 in its disengaged position. while such an arrangement can prevent the second clutch 6210 from unintentionally engaging the second drive ring 6220 , such an arrangement can also consume a lot of power. alternatively, the control system 1800 can apply the first voltage polarity to the second electrical clutch circuit for a sufficient period of time to position the second clutch 6210 in its disengaged position and then discontinue applying the first voltage polarity to the second electric clutch circuit, thereby resulting in a lower consumption of power. that being said, the second clutch assembly 6200 further comprises a second clutch lock 6250 mounted in the outer housing 6230 which is configured to releasably hold the second clutch 6210 in its disengaged position. similar to the above, the second clutch lock 6250 can prevent, or at least reduce the possibility of, the second clutch 6210 from becoming unintentionally engaged with the second drive ring 6220 . when the second clutch 6210 is in its disengaged position, as illustrated in fig. 30 , the second clutch lock 6250 interferes with the free movement of the second clutch 6210 and holds the second clutch 6210 in position via a friction and/or interference force therebetween. in at least one instance, the second clutch lock 6250 comprises an elastomeric plug, seat, or detent, comprised of rubber, for example. in certain instances, the second clutch lock 6250 comprises a permanent magnet which holds the second clutch 6210 in its disengaged position by an electromagnetic force. that said, the second electromagnetic actuator 6240 can apply an electromagnetic pulling force to the second clutch 6210 that overcomes these forces, as described in greater detail below. further to the above, referring to fig. 31 , the second electromagnetic actuator 6240 is configured to emit a magnetic field ef d which pulls, or drives, the second clutch 6210 toward the second drive ring 6220 when the second clutch assembly 6200 is in its engaged state. the coils of the second electromagnetic actuator 6240 generate the magnetic field ef d when current flows in a second, or opposite, direction through the second electrical shaft circuit. the control system 1800 is configured to apply an opposite voltage polarity to the second electrical shaft circuit to create the current flowing in the opposite direction. the control system 1800 can continuously apply the opposite voltage polarity to the second electric shaft circuit to continuously hold the second clutch 6210 in its engaged position and maintain the operable engagement between the second drive ring 6220 and the outer housing 6230 . alternatively, the second clutch 6210 can be configured to become wedged within the second drive ring 6220 when the second clutch 6210 is in its engaged position and, in such instances, the control system 1800 may not need to continuously apply a voltage polarity to the second shaft electrical circuit to hold the second clutch assembly 6200 in its engaged state. in such instances, the control system 1800 can discontinue applying the voltage polarity once the second clutch 6210 has been sufficiently wedged in the second drive ring 6220 . notably, further to the above, the second clutch lock 6250 is also configured to lockout the rotation of the end effector 7000 when the second clutch 6210 is in its disengaged position. more specifically, referring again to fig. 30 , the second clutch 6210 pushes the second clutch lock 6250 in the outer shaft 6230 into engagement with the articulation link 2340 when the second clutch 6210 is in its disengaged position such that the end effector 7000 does not rotate, or at least substantially rotate, relative to the distal attachment portion 2400 of the shaft assembly 2000 . as illustrated in fig. 27 , the second clutch lock 6250 is positioned or wedged within a slot, or channel, 2345 defined in the articulation link 2340 when the second clutch 6210 is in its disengaged position. as a result of the above, the possibility of the end effector 7000 unintentionally rotating is prevented, or at least reduced. moreover, as a result of the above, the second clutch 6210 can do at least two things—operate the end effector rotation drive when the second clutch 6210 is in its engaged position and lock out the end effector rotation drive when the second clutch 6210 is in its disengaged position. referring primarily to figs. 22, 24, and 25 , the shaft assembly 2000 further comprises an articulation drive system configured to articulate the distal attachment portion 2400 and the end effector 7000 about the articulation joint 2300 . the articulation drive system comprises an articulation drive 6330 rotatably supported within the distal attachment portion 2400 . that said, the articulation drive 6330 is closely received within the distal attachment portion 2400 such that the articulation drive 6330 does not translate, or at least substantially translate, relative to the distal attachment portion 2400 . the articulation drive system of the shaft assembly 2000 further comprises a stationary gear 2330 fixedly mounted to the articulation frame 2310 . more specifically, the stationary gear 2330 is fixedly mounted to a pin connecting a tab 2314 of the articulation frame 2310 and the articulation link 2340 such that the stationary gear 2330 does not rotate relative to the articulation frame 2310 . the stationary gear 2330 comprises a central body 2335 and an annular array of stationary teeth 2332 extending around the perimeter of the central body 2335 . the articulation drive 6330 comprises an annular array of drive teeth 6332 which is meshingly engaged with the stationary teeth 2332 . when the articulation drive 6330 is rotated, the articulation drive 6330 pushes against the stationary gear 2330 and articulates the distal attachment portion 2400 of the shaft assembly 2000 and the end effector 7000 about the articulation joint 2300 . referring primarily to fig. 32 , the third clutch system 6300 comprises a third clutch 6310 , an expandable third drive ring 6320 , and a third electromagnetic actuator 6340 . the third clutch 6310 comprises an annular ring and is slideably disposed on the drive shaft 2730 . the third clutch 6310 is comprised of a magnetic material and is movable between a disengaged, or unactuated, position ( fig. 32 ) and an engaged, or actuated, position ( fig. 33 ) by electromagnetic fields ef generated by the third electromagnetic actuator 6340 . in various instances, the third clutch 6310 is at least partially comprised of iron and/or nickel, for example. in at least one instance, the third clutch 6310 comprises a permanent magnet. as illustrated in fig. 22a , the drive shaft 2730 comprises one or more longitudinal key slots 6315 defined therein which are configured to constrain the longitudinal movement of the third clutch 6310 relative to the drive shaft 2730 . more specifically, the third clutch 6310 comprises one or more keys extending into the key slots 6315 such that the distal ends of the key slots 6315 stop the distal movement of the third clutch 6310 and the proximal ends of the key slots 6315 stop the proximal movement of the third clutch 6310 . when the third clutch 6310 is in its disengaged position, referring to fig. 32 , the third clutch 6310 rotates with the drive shaft 2730 but does not transmit rotational motion to the third drive ring 6320 . as can be seen in fig. 32 , the third clutch 6310 is separated from, or not in contact with, the third drive ring 6320 . as a result, the rotation of the drive shaft 2730 and the third clutch 6310 is not transmitted to the articulation drive 6330 when the third clutch assembly 6300 is in its disengaged state. when the third clutch 6310 is in its engaged position, referring to fig. 33 , the third clutch 6310 is engaged with the third drive ring 6320 such that the third drive ring 6320 is expanded, or stretched, radially outwardly into contact with the articulation drive 6330 . in at least one instance, the third drive ring 6320 comprises an elastomeric band, for example. as can be seen in fig. 33 , the third drive ring 6320 is compressed against an annular inner sidewall 6335 of the articulation drive 6330 . as a result, the rotation of the drive shaft 2730 and the third clutch 6310 is transmitted to the articulation drive 6330 when the third clutch assembly 6300 is in its engaged state. depending on the direction in which the drive shaft 2730 is rotated, the third clutch assembly 6300 can articulate the distal attachment portion 2400 of the shaft assembly 2000 and the end effector 7000 in a first or second direction about the articulation joint 2300 . as described above, the third electromagnetic actuator 6340 is configured to generate magnetic fields to move the third clutch 6310 between its disengaged ( fig. 32 ) and engaged ( fig. 33 ) positions. for instance, referring to fig. 32 , the third electromagnetic actuator 6340 is configured to emit a magnetic field ef l which repulses, or drives, the third clutch 6310 away from the third drive ring 6320 when the third clutch assembly 6300 is in its disengaged state. the third electromagnetic actuator 6340 comprises one or more wound coils in a cavity defined in the shaft frame 2530 which generate the magnetic field ef l when current flows in a first direction through a third electrical clutch circuit including the wound coils. the control system 1800 is configured to apply a first voltage polarity to the third electrical clutch circuit to create the current flowing in the first direction. the control system 1800 can continuously apply the first voltage polarity to the third electric clutch circuit to continuously hold the third clutch 6310 in its disengaged position. while such an arrangement can prevent the third clutch 6310 from unintentionally engaging the third drive ring 6320 , such an arrangement can also consume a lot of power. alternatively, the control system 1800 can apply the first voltage polarity to the third electrical clutch circuit for a sufficient period of time to position the third clutch 6310 in its disengaged position and then discontinue applying the first voltage polarity to the third electric clutch circuit, thereby resulting in a lower consumption of power. further to the above, the third electromagnetic actuator 6340 is configured to emit a magnetic field ef d which pulls, or drives, the third clutch 6310 toward the third drive ring 6320 when the third clutch assembly 6300 is in its engaged state. the coils of the third electromagnetic actuator 6340 generate the magnetic field ef d when current flows in a second, or opposite, direction through the third electrical clutch circuit. the control system 1800 is configured to apply an opposite voltage polarity to the third electrical shaft circuit to create the current flowing in the opposite direction. the control system 1800 can continuously apply the opposite voltage polarity to the third electric shaft circuit to continuously hold the third clutch 6310 in its engaged position and maintain the operable engagement between the third drive ring 6320 and the articulation drive 6330 . alternatively, the third clutch 6210 can be configured to become wedged within the third drive ring 6320 when the third clutch 6310 is in its engaged position and, in such instances, the control system 1800 may not need to continuously apply a voltage polarity to the third shaft electrical circuit to hold the third clutch assembly 6300 in its engaged state. in such instances, the control system 1800 can discontinue applying the voltage polarity once the third clutch 6310 has been sufficiently wedged in the third drive ring 6320 . in any event, the end effector 7000 is articulatable in a first direction or a second direction, depending on the direction in which the drive shaft 2730 is rotated, when the third clutch assembly 6300 is in its engaged state. further to the above, referring to figs. 22, 32, and 33 , the articulation drive system further comprises a lockout 6350 which prevents, or at least inhibits, the articulation of the distal attachment portion 2400 of the shaft assembly 2000 and the end effector 7000 about the articulation joint 2300 when the third clutch 6310 is in its disengaged position ( fig. 32 ). referring primarily to fig. 22 , the articulation link 2340 comprises a slot, or groove, 2350 defined therein wherein the lockout 6350 is slideably positioned in the slot 2350 and extends at least partially under the stationary articulation gear 2330 . the lockout 6350 comprises at attachment hook 6352 engaged with the third clutch 6310 . more specifically, the third clutch 6310 comprises an annular slot, or groove, 6312 defined therein and the attachment hook 6352 is positioned in the annular slot 6312 such that the lockout 6350 translates with the third clutch 6310 . notably, however, the lockout 6350 does not rotate, or at least substantially rotate, with the third clutch 6310 . instead, the annular groove 6312 in the third clutch 6310 permits the third clutch 6310 to rotate relative to the lockout 6350 . the lockout 6350 further comprises a lockout hook 6354 slideably positioned in a radially-extending lockout slot 2334 defined in the bottom of the stationary gear 2330 . when the third clutch 6310 is in its disengaged position, as illustrated in fig. 32 , the lockout 6350 is in a locked position in which the lockout hook 6354 prevents the end effector 7000 from rotating about the articulation joint 2300 . when the third clutch 6310 is in its engaged position, as illustrated in fig. 33 , the lockout 6350 is in an unlocked position in which the lockout hook 6354 is no longer positioned in the lockout slot 2334 . instead, the lockout hook 6354 is positioned in a clearance slot defined in the middle or body 2335 of the stationary gear 2330 . in such instances, the lockout hook 6354 can rotate within the clearance slot when the end effector 7000 rotates about the articulation joint 2300 . further to the above, the radially-extending lockout slot 2334 depicted in figs. 32 and 33 extends longitudinally, i.e., along an axis which is parallel to the longitudinal axis of the elongate shaft 2200 . once the end effector 7000 has been articulated, however, the lockout hook 6354 is no longer aligned with the longitudinal lockout slot 2334 . with this in mind, the stationary gear 2330 comprises a plurality, or an array, of radially-extending lockout slots 2334 defined in the bottom of the stationary gear 2330 such that, when the third clutch 6310 is deactuated and the lockout 6350 is pulled distally after the end effector 7000 has been articulated, the lockout hook 6354 can enter one of the lockout slots 2334 and lock the end effector 7000 in its articulated position. thus, as a result, the end effector 7000 can be locked in an unarticulated and an articulated position. in various instances, the lockout slots 2334 can define discrete articulated positions for the end effector 7000 . for instance, the lockout slots 2334 can be defined at 10 degree intervals, for example, which can define discrete articulation orientations for the end effector 7000 at 10 degree intervals. in other instances, these orientations can be at 5 degree intervals, for example. in alternative embodiments, the lockout 6350 comprises a brake that engages a circumferential shoulder defined in the stationary gear 2330 when the third clutch 6310 is disengaged from the third drive ring 6320 . in such an embodiment, the end effector 7000 can be locked in any suitable orientation. in any event, the lockout 6350 prevents, or at least reduces the possibility of, the end effector 7000 unintentionally articulating. as a result of the above, the third clutch 6310 can do things—operate the articulation drive when it is in its engaged position and lock out the articulation drive when it is in its disengaged position. referring primarily to figs. 24 and 25 , the shaft frame 2530 and the drive shaft 2730 extend through the articulation joint 2300 into the distal attachment portion 2400 . when the end effector 7000 is articulated, as illustrated in figs. 16 and 17 , the shaft frame 2530 and the drive shaft 2730 bend to accommodate the articulation of the end effector 7000 . thus, the shaft frame 2530 and the drive shaft 2730 are comprised of any suitable material which accommodates the articulation of the end effector 7000 . moreover, as discussed above, the shaft frame 2530 houses the first, second, and third electromagnetic actuators 6140 , 6240 , and 6340 . in various instances, the first, second, and third electromagnetic actuators 6140 , 6240 , and 6340 each comprise wound wire coils, such as copper wire coils, for example, and the shaft frame 2530 is comprised of an insulative material to prevent, or at least reduce the possibility of, short circuits between the first, second, and third electromagnetic actuators 6140 , 6240 , and 6340 . in various instances, the first, second, and third electrical clutch circuits extending through the shaft frame 2530 are comprised of insulated electrical wires, for example. further to the above, the first, second, and third electrical clutch circuits place the electromagnetic actuators 6140 , 6240 , and 6340 in communication with the control system 1800 in the drive module 1100 . as described above, the clutches 6110 , 6210 , and/or 6310 can be held in their disengaged positions so that they do not unintentionally move into their engaged positions. in various arrangements, the clutch system 6000 comprises a first biasing member, such as a spring, for example, configured to bias the first clutch 6110 into its disengaged position, a second biasing member, such as a spring, for example, configured to bias the second clutch 6210 into its disengaged position, and/or a third biasing member, such as a spring, for example, configured to bias the third clutch 6110 into its disengaged position. in such arrangements, the biasing forces of the springs can be selectively overcome by the electromagnetic forces generated by the electromagnetic actuators when energized by an electrical current. further to the above, the clutches 6110 , 6210 , and/or 6310 can be retained in their engaged positions by the drive rings 6120 , 6220 , and/or 6320 , respectively. more specifically, in at least one instance, the drive rings 6120 , 6220 , and/or 6320 are comprised of an elastic material which grips or frictionally holds the clutches 6110 , 6210 , and/or 6310 , respectively, in their engaged positions. in various alternative embodiments, the clutch system 6000 comprises a first biasing member, such as a spring, for example, configured to bias the first clutch 6110 into its engaged position, a second biasing member, such as a spring, for example, configured to bias the second clutch 6210 into its engaged position, and/or a third biasing member, such as a spring, for example, configured to bias the third clutch 6110 into its engaged position. in such arrangements, the biasing forces of the springs can be overcome by the electromagnetic forces applied by the electromagnetic actuators 6140 , 6240 , and/or 6340 , respectively, as needed to selectively hold the clutches 6110 , 6210 , and 6310 in their disengaged positions. in any one operational mode of the surgical system, the control assembly 1800 can energize one of the electromagnetic actuators to engage one of the clutches while energizing the other two electromagnetic actuators to disengage the other two clutches. although the clutch system 6000 comprises three clutches to control three drive systems of the surgical system, a clutch system can comprise any suitable number of clutches to control any suitable number of systems. moreover, although the clutches of the clutch system 6000 slide proximally and distally between their engaged and disengaged positions, the clutches of a clutch system can move in any suitable manner. in addition, although the clutches of the clutch system 6000 are engaged one at a time to control one drive motion at a time, various instances are envisioned in which more than one clutch can be engaged to control more than one drive motion at a time. in view of the above, the reader should appreciate that the control system 1800 is configured to, one, operate the motor system 1600 to rotate the drive shaft system 2700 in an appropriate direction and, two, operate the clutch system 6000 to transfer the rotation of the drive shaft system 2700 to the appropriate function of the end effector 7000 . moreover, as discussed above, the control system 1800 is responsive to inputs from the clamping trigger system 2600 of the shaft assembly 2000 and the input system 1400 of the handle 1000 . when the clamping trigger system 2600 is actuated, as discussed above, the control system 1800 activates the first clutch assembly 6100 and deactivates the second clutch assembly 6200 and the third clutch assembly 6300 . in such instances, the control system 1800 also supplies power to the motor system 1600 to rotate the drive shaft system 2700 in a first direction to clamp the jaw assembly 7100 of the end effector 7000 . when the control system 1800 detects that the jaw assembly 7100 is in its clamped configuration, the control system 1800 stops the motor assembly 1600 and deactivates the first clutch assembly 6100 . when the control system 1800 detects that the clamping trigger system 2600 has been moved to, or is being moved to, its unactuated position, the control system 1800 activates, or maintains the activation of, the first clutch assembly 6100 and deactivates, or maintains the deactivation of, the second clutch assembly 6200 and the third clutch assembly 6300 . in such instances, the control system 1800 also supplies power to the motor system 1600 to rotate the drive shaft system 2700 in a second direction to open the jaw assembly 7100 of the end effector 7000 . when the rotation actuator 1420 is actuated in a first direction, further to the above, the control system 1800 activates the second clutch assembly 6200 and deactivates the first clutch assembly 6100 and the third clutch assembly 6300 . in such instances, the control system 1800 also supplies power to the motor system 1600 to rotate the drive shaft system 2700 in a first direction to rotate the end effector 7000 in a first direction. when the control system 1800 detects that the rotation actuator 1420 has been actuated in a second direction, the control system 1800 activates, or maintains the activation of, the second clutch assembly 6200 and deactivates, or maintains the deactivation of, the first clutch assembly 6100 and the third clutch assembly 6300 . in such instances, the control system 1800 also supplies power to the motor system 1600 to rotate the drive shaft system 2700 in a second direction to rotate the drive shaft system 2700 in a second direction to rotate the end effector 7000 in a second direction. when the control system 1800 detects that the rotation actuator 1420 is not actuated, the control system 1800 deactivates the second clutch assembly 6200 . when the first articulation actuator 1432 is depressed, further to the above, the control system 1800 activates the third clutch assembly 6300 and deactivates the first clutch assembly 6100 and the second clutch assembly 6200 . in such instances, the control system 1800 also supplies power to the motor system 1600 to rotate the drive shaft system 2700 in a first direction to articulate the end effector 7000 in a first direction. when the control system 1800 detects that the second articulation actuator 1434 is depressed, the control system 1800 activates, or maintains the activation of, the third clutch assembly 6200 and deactivates, or maintains the deactivation of, the first clutch assembly 6100 and the second clutch assembly 6200 . in such instances, the control system 1800 also supplies power to the motor system 1600 to rotate the drive shaft system 2700 in a second direction to articulate the end effector 7000 in a second direction. when the control system 1800 detects that neither the first articulation actuator 1432 nor the second articulation actuator 1434 are actuated, the control system 1800 deactivates the third clutch assembly 6200 . further to the above, the control system 1800 is configured to change the operating mode of the stapling system based on the inputs it receives from the clamping trigger system 2600 of the shaft assembly 2000 and the input system 1400 of the handle 1000 . the control system 1800 is configured to shift the clutch system 6000 before rotating the shaft drive system 2700 to perform the corresponding end effector function. moreover, the control system 1800 is configured to stop the rotation of the shaft drive system 2700 before shifting the clutch system 6000 . such an arrangement can prevent the sudden movements in the end effector 7000 . alternatively, the control system 1800 can shift the clutch system 600 while the shaft drive system 2700 is rotating. such an arrangement can allow the control system 1800 to shift quickly between operating modes. as discussed above, referring to fig. 34 , the distal attachment portion 2400 of the shaft assembly 2000 comprises an end effector lock 6400 configured to prevent the end effector 7000 from being unintentionally decoupled from the shaft assembly 2000 . the end effector lock 6400 comprises a lock end 6410 selectively engageable with the annular array of lock notches 7410 defined on the proximal attachment portion 7400 of the end effector 7000 , a proximal end 6420 , and a pivot 6430 rotatably connecting the end effector lock 6400 to the articulation link 2320 . when the third clutch 6310 of the third clutch assembly 6300 is in its disengaged position, as illustrated in fig. 34 , the third clutch 6310 is contact with the proximal end 6420 of the end effector lock 6400 such that the lock end 6410 of the end effector lock 6400 is engaged with the array of lock notches 7410 . in such instances, the end effector 7000 can rotate relative to the end effector lock 6400 but cannot translate relative to the distal attachment portion 2400 . when the third clutch 6310 is moved into its engaged position, as illustrated in fig. 35 , the third clutch 6310 is no longer engaged with the proximal end 6420 of the end effector lock 6400 . in such instances, the end effector lock 6400 is free to pivot upwardly and permit the end effector 7000 to be detached from the shaft assembly 2000 . the above being said, referring again to fig. 34 , it is possible that the second clutch 6210 of the second clutch assembly 6200 is in its disengaged position when the clinician detaches, or attempts to detach, the end effector 7000 from the shaft assembly 2000 . as discussed above, the second clutch 6210 is engaged with the second clutch lock 6250 when the second clutch 6210 is in its disengaged position and, in such instances, the second clutch lock 6250 is pushed into engagement with the articulation link 2340 . more specifically, the second clutch lock 6250 is positioned in the channel 2345 defined in the articulation 2340 when the second clutch 6210 is engaged with the second clutch lock 6250 which may prevent, or at least impede, the end effector 7000 from being detached from the shaft assembly 2000 . to facilitate the release of the end effector 7000 from the shaft assembly 2000 , the control system 1800 can move the second clutch 6210 into its engaged position in addition to moving the third clutch 6310 into its engaged position. in such instances, the end effector 7000 can clear both the end effector lock 6400 and the second clutch lock 6250 when the end effector 7000 is removed. in at least one instance, further to the above, the drive module 1100 comprises an input switch and/or sensor in communication with the control system 1800 via the input system 1400 , and/or the control system 1800 directly, which, when actuated, causes the control system 1800 to unlock the end effector 7000 . in various instances, the drive module 1100 comprises an input screen 1440 in communication with the board 1410 of the input system 1400 which is configured to receive an unlock input from the clinician. in response to the unlock input, the control system 1800 can stop the motor system 1600 , if it is running, and unlock the end effector 7000 as described above. the input screen 1440 is also configured to receive a lock input from the clinician in which the input system 1800 moves the second clutch assembly 6200 and/or the third clutch assembly 6300 into their unactuated states to lock the end effector 7000 to the shaft assembly 2000 . fig. 37 depicts a shaft assembly 2000 ′ in accordance with at least one alternative embodiment. the shaft assembly 2000 ′ is similar to the shaft assembly 2000 in many respects, most of which will not be repeated herein for the sake of brevity. similar to the shaft assembly 2000 , the shaft assembly 2000 ′ comprises a shaft frame, i.e., shaft frame 2530 ′. the shaft frame 2530 ′ comprises a longitudinal passage 2535 ′ and, in addition, a plurality of clutch position sensors, i.e., a first sensor 6180 ′, a second sensor 6280 ′, and a third sensor 6380 ′ positioned in the shaft frame 2530 ′. the first sensor 6180 ′ is in signal communication with the control system 1800 as part of a first sensing circuit. the first sensing circuit comprises signal wires extending through the longitudinal passage 2535 ′; however, the first sensing circuit can comprise a wireless signal transmitter and receiver to place the first sensor 6180 ′ in signal communication with the control system 1800 . the first sensor 6180 ′ is positioned and arranged to detect the position of the first clutch 6110 of the first clutch assembly 6100 . based on data received from the first sensor 6180 ′, the control system 1800 can determine whether the first clutch 6110 is in its engaged position, its disengaged position, or somewhere in-between. with this information, the control system 1800 can assess whether or not the first clutch 6110 is in the correct position given the operating state of the surgical instrument. for instance, if the surgical instrument is in its jaw clamping/opening operating state, the control system 1800 can verify whether the first clutch 6110 is properly positioned in its engaged position. in such instances, further to the below, the control system 1800 can also verify that the second clutch 6210 is in its disengaged position via the second sensor 6280 ′ and that the third clutch 6310 is in its disengaged position via the third sensor 6380 ′. correspondingly, the control system 1800 can verify whether the first clutch 6110 is properly positioned in its disengaged position if the surgical instrument is not in its jaw clamping/opening state. to the extent that the first clutch 6110 is not in its proper position, the control system 1800 can actuate the first electromagnetic actuator 6140 in an attempt to properly position the first clutch 6110 . likewise, the control system 1800 can actuate the electromagnetic actuators 6240 and/or 6340 to properly position the clutches 6210 and/or 6310 , if necessary. the second sensor 6280 ′ is in signal communication with the control system 1800 as part of a second sensing circuit. the second sensing circuit comprises signal wires extending through the longitudinal passage 2535 ′; however, the second sensing circuit can comprise a wireless signal transmitter and receiver to place the second sensor 6280 ′ in signal communication with the control system 1800 . the second sensor 6280 ′ is positioned and arranged to detect the position of the second clutch 6210 of the first clutch assembly 6200 . based on data received from the second sensor 6280 ′, the control system 1800 can determine whether the second clutch 6210 is in its engaged position, its disengaged position, or somewhere in-between. with this information, the control system 1800 can assess whether or not the second clutch 6210 is in the correct position given the operating state of the surgical instrument. for instance, if the surgical instrument is in its end effector rotation operating state, the control system 1800 can verify whether the second clutch 6210 is properly positioned in its engaged position. in such instances, the control system 1800 can also verify that the first clutch 6110 is in its disengaged position via the first sensor 6180 ′ and, further to the below, the control system 1800 can also verify that the third clutch 6310 is in its disengaged position via the third sensor 6380 ′. correspondingly, the control system 1800 can verify whether the second clutch 6110 is properly positioned in its disengaged position if the surgical instrument is not in its end effector rotation state. to the extent that the second clutch 6210 is not in its proper position, the control system 1800 can actuate the second electromagnetic actuator 6240 in an attempt to properly position the second clutch 6210 . likewise, the control system 1800 can actuate the electromagnetic actuators 6140 and/or 6340 to properly position the clutches 6110 and/or 6310 , if necessary. the third sensor 6380 ′ is in signal communication with the control system 1800 as part of a third sensing circuit. the third sensing circuit comprises signal wires extending through the longitudinal passage 2535 ′; however, the third sensing circuit can comprise a wireless signal transmitter and receiver to place the third sensor 6380 ′ in signal communication with the control system 1800 . the third sensor 6380 ′ is positioned and arranged to detect the position of the third clutch 6310 of the third clutch assembly 6300 . based on data received from the third sensor 6380 ′, the control system 1800 can determine whether the third clutch 6310 is in its engaged position, its disengaged position, or somewhere in-between. with this information, the control system 1800 can assess whether or not the third clutch 6310 is in the correct position given the operating state of the surgical instrument. for instance, if the surgical instrument is in its end effector articulation operating state, the control system 1800 can verify whether the third clutch 6310 is properly positioned in its engaged position. in such instances, the control system 1800 can also verify that the first clutch 6110 is in its disengaged position via the first sensor 6180 ′ and that the second clutch 6210 is in its disengaged position via the second sensor 6280 ′. correspondingly, the control system 1800 can verify whether the third clutch 6310 is properly positioned in its disengaged position if the surgical instrument is not in its end effector articulation state. to the extent that the third clutch 6310 is not in its proper position, the control system 1800 can actuate the third electromagnetic actuator 6340 in an attempt to properly position the third clutch 6310 . likewise, the control system 1800 can actuate the electromagnetic actuators 6140 and/or 6240 to properly position the clutches 6110 and/or 6210 , if necessary. further to the above, the clutch position sensors, i.e., the first sensor 6180 ′, the second sensor 6280 ′, and the third sensor 6380 ′ can comprise any suitable type of sensor. in various instances, the first sensor 6180 ′, the second sensor 6280 ′, and the third sensor 6380 ′ each comprise a proximity sensor. in such an arrangement, the sensors 6180 ′, 6280 ′, and 6380 ′ are configured to detect whether or not the clutches 6110 , 6210 , and 6310 , respectively, are in their engaged positions. in various instances, the first sensor 6180 ′, the second sensor 6280 ′, and the third sensor 6380 ′ each comprise a hall effect sensor, for example. in such an arrangement, the sensors 6180 ′, 6280 ′, and 6380 ′ can not only detect whether or not the clutches 6110 , 6210 , and 6310 , respectively, are in their engaged positions but the sensors 6180 ′, 6280 ′, and 6380 ′ can also detect how close the clutches 6110 , 6210 , and 6310 are with respect to their engaged or disengaged positions. fig. 38 depicts the shaft assembly 2000 ′ and an end effector 7000 ″ in accordance with at least one alternative embodiment. the end effector 7000 ″ is similar to the end effector 7000 in many respects, most of which will not be repeated herein for the sake of brevity. similar to the end effector 7000 , the shaft assembly 7000 ″ comprises a jaw assembly 7100 and a jaw assembly drive configured to move the jaw assembly 7100 between its open and closed configurations. the jaw assembly drive comprises drive links 7140 , a drive nut 7150 ″, and a drive screw 6130 ″. the drive nut 7150 ″ comprises a sensor 7190 ″ positioned therein which is configured to detect the position of a magnetic element 6190 ″ positioned in the drive screw 6130 ″. the magnetic element 6190 ″ is positioned in an elongate aperture 6134 ″ defined in the drive screw 6130 ″ and can comprise a permanent magnet and/or can be comprised of iron, nickel, and/or any suitable metal, for example. in various instances, the sensor 7190 ″ comprises a proximity sensor, for example, which is in signal communication with the control system 1800 . in certain instances, the sensor 7190 ″ comprises a hall effect sensor, for example, in signal communication with the control system 1800 . in certain instances, the sensor 7190 ″ comprises an optical sensor, for example, and the detectable element 6190 ″ comprises an optically detectable element, such as a reflective element, for example. in either event, the sensor 7190 ″ is configured to communicate wirelessly with the control system 1800 via a wireless signal transmitter and receiver and/or via a wired connection extending through the shaft frame passage 2532 ′, for example. the sensor 7190 ″, further to the above, is configured to detect when the magnetic element 6190 ″ is adjacent to the sensor 7190 ″ such that the control system 1800 can use this data to determine that the jaw assembly 7100 has reached the end of its clamping stroke. at such point, the control system 1800 can stop the motor assembly 1600 . the sensor 7190 ″ and the control system 1800 are also configured to determine the distance between where the drive screw 6130 ″ is currently positioned and where the drive screw 6130 ″ should be positioned at the end of its closure stroke in order to calculate the amount of closure stroke of the drive screw 6130 ″ that is still needed to close the jaw assembly 7100 . moreover, such information can be used by the control system 1800 to assess the current configuration of the jaw assembly 7100 , i.e., whether the jaw assembly 7100 is in its open configuration, its closed configuration, or a partially closed configuration. the sensor system could be used to determine when the jaw assembly 7100 has reached its fully open position and stop the motor assembly 1600 at that point. in various instances, the control system 1800 could use this sensor system to confirm that the first clutch assembly 6100 is in its actuated state by confirming that the jaw assembly 7100 is moving while the motor assembly 1600 is turning. similarly, the control system 1800 could use this sensor system to confirm that the first clutch assembly 6100 is in its unactuated state by confirming that the jaw assembly 7100 is not moving while the motor assembly 1600 is turning. fig. 39 depicts a shaft assembly 2000 ′″ and an end effector 7000 ′″ in accordance with at least one alternative embodiment. the shaft assembly 2000 ′″ is similar to the shaft assemblies 2000 and 2000 ′ in many respects, most of which will not be repeated herein for the sake of brevity. the end effector 7000 ′″ is similar to the end effectors 7000 and 7000 ″ in many respects, most of which will not be repeated herein for the sake of brevity. similar to the end effector 7000 , the end effector 7000 ′″ comprises a jaw assembly 7100 and a jaw assembly drive configured to move the jaw assembly 7100 between its open and closed configurations and, in addition, an end effector rotation drive that rotates the end effector 7000 ′″ relative to the distal attachment portion 2400 of the shaft assembly 2000 ′. the end effector rotation drive comprises an outer housing 6230 ′″ that is rotated relative to a shaft frame 2530 ′″ of the end effector 7000 ′″ by the second clutch assembly 6200 . the shaft frame 2530 ′″ comprises a sensor 6290 ′″ positioned therein which is configured to detect the position of a magnetic element 6190 ′″ positioned in and/or on the outer housing 6230 ′″. the magnetic element 6190 ′″ can comprise a permanent magnet and/or can be comprised of iron, nickel, and/or any suitable metal, for example. in various instances, the sensor 6290 ′″ comprises a proximity sensor, for example, in signal communication with the control system 1800 . in certain instances, the sensor 6290 ′″ comprises a hall effect sensor, for example, in signal communication with the control system 1800 . in either event, the sensor 6290 ′″ is configured to communicate wirelessly with the control system 1800 via a wireless signal transmitter and receiver and/or via a wired connection extending through the shaft frame passage 2532 ′, for example. in various instances, the control system 1800 can use the sensor 6290 ′″ to confirm whether the magnetic element 6190 ′″ is rotating and, thus, confirm that the second clutch assembly 6200 is in its actuated state. similarly, the control system 1800 can use the sensor 6290 ′″ to confirm whether the magnetic element 6190 ′″ is not rotating and, thus, confirm that the second clutch assembly 6200 is in its unactuated state. the control system 1800 can also use the sensor 6290 ′″ to confirm that the second clutch assembly 6200 is in its unactuated state by confirming that the second clutch 6210 is positioned adjacent the sensor 6290 ′″. fig. 40 depicts a shaft assembly 2000 ″″ in accordance with at least one alternative embodiment. the shaft assembly 2000 ″″ is similar to the shaft assemblies 2000 , 2000 ′, and 2000 ′″ in many respects, most of which will not be repeated herein for the sake of brevity. similar to the shaft assembly 2000 , the shaft assembly 2000 ″″ comprises, among other things, an elongate shaft 2200 , an articulation joint 2300 , and a distal attachment portion 2400 configured to receive an end effector, such as end effector 7000 ′, for example. similar to the shaft assembly 2000 , the shaft assembly 2000 ″″ comprises an articulation drive, i.e., articulation drive 6330 ″″ configured to rotate the distal attachment portion 2400 and the end effector 7000 ′ about the articulation joint 2300 . similar to the above, a shaft frame 2530 ″″ comprises a sensor positioned therein configured to detect the position, and/or rotation, of a magnetic element 6390 ″″ positioned in and/or on the articulation drive 6330 ″″. the magnetic element 6390 ″″ can comprise a permanent magnet and/or can be comprised of iron, nickel, and/or any suitable metal, for example. in various instances, the sensor comprises a proximity sensor, for example, in signal communication with the control system 1800 . in certain instances, the sensor comprises a hall effect sensor, for example, in signal communication with the control system 1800 . in either event, the sensor is configured to communicate wirelessly with the control system 1800 via a wireless signal transmitter and receiver and/or via a wired connection extending through the shaft frame passage 2532 ′, for example. in various instances, the control system 1800 can use the sensor to confirm whether the magnetic element 6390 ″″ is rotating and, thus, confirm that the third clutch assembly 6300 is in its actuated state. similarly, the control system 1800 can use the sensor to confirm whether the magnetic element 6390 ″″ is not rotating and, thus, confirm that the third clutch assembly 6300 is in its unactuated state. in certain instances, the control system 1800 can use the sensor to confirm that the third clutch assembly 6300 is in its unactuated state by confirming that the third clutch 6310 is positioned adjacent the sensor. referring to fig. 40 once again, the shaft assembly 2000 ″″ comprises an end effector lock 6400 ′ configured to releasably lock the end effector 7000 ′, for example, to the shaft assembly 2000 ″″. the end effector lock 6400 ′ is similar to the end effector lock 6400 in many respects, most of which will not be discussed herein for the sake of brevity. notably, though, a proximal end 6420 ′ of the lock 6400 ′ comprises a tooth 6422 ′ configured to engage the annular slot 6312 of the third clutch 6310 and releasably hold the third clutch 6310 in its disengaged position. that said, the actuation of the third electromagnetic assembly 6340 can disengage the third clutch 6310 from the end effector lock 6400 ′. moreover, in such instances, the proximal movement of the third clutch 6310 into its engaged position rotates the end effector lock 6400 ′ into a locked position and into engagement with the lock notches 7410 to lock the end effector 7000 ′ to the shaft assembly 2000 ″″. correspondingly, the distal movement of the third clutch 6310 into its disengaged position unlocks the end effector 7000 ′ and allows the end effector 7000 ′ to be disassembled from the shaft assembly 2000 ″″. further to the above, an instrument system including a handle and a shaft assembly attached thereto can be configured to perform a diagnostic check to assess the state of the clutch assemblies 6100 , 6200 , and 6300 . in at least one instance, the control system 1800 sequentially actuates the electromagnetic actuators 6140 , 6240 , and/or 6340 —in any suitable order—to verify the positions of the clutches 6110 , 6210 , and/or 6310 , respectively, and/or verify that the clutches are responsive to the electromagnetic actuators and, thus, not stuck. the control system 1800 can use sensors, including any of the sensors disclosed herein, to verify the movement of the clutches 6110 , 6120 , and 6130 in response to the electromagnetic fields created by the electromagnetic actuators 6140 , 6240 , and/or 6340 . in addition, the diagnostic check can also include verifying the motions of the drive systems. in at least one instance, the control system 1800 sequentially actuates the electromagnetic actuators 6140 , 6240 , and/or 6340 —in any suitable order—to verify that the jaw drive opens and/or closes the jaw assembly 7100 , the rotation drive rotates the end effector 7000 , and/or the articulation drive articulates the end effector 7000 , for example. the control system 1800 can use sensors to verify the motions of the jaw assembly 7100 and end effector 7000 . the control system 1800 can perform the diagnostic test at any suitable time, such as when a shaft assembly is attached to the handle and/or when the handle is powered on, for example. if the control system 1800 determines that the instrument system passed the diagnostic test, the control system 1800 can permit the ordinary operation of the instrument system. in at least one instance, the handle can comprise an indicator, such as a green led, for example, which indicates that the diagnostic check has been passed. if the control system 1800 determines that the instrument system failed the diagnostic test, the control system 1800 can prevent and/or modify the operation of the instrument system. in at least one instance, the control system 1800 can limit the functionality of the instrument system to only the functions necessary to remove the instrument system from the patient, such as straightening the end effector 7000 and/or opening and closing the jaw assembly 7100 , for example. in at least one respect, the control system 1800 enters into a limp mode. the limp mode of the control system 1800 can reduce a current rotational speed of the motor 1610 by any percentage selected from a range of about 75% to about 25%, for example. in one example, the limp mode reduces a current rotational speed of the motor 1610 by 50%. in one example, the limp mode reduces the current rotational speed of the motor 1610 by 75%. the limp mode may cause a current torque of the motor 1610 to be reduced by any percentage selected from a range of about 75% to about 25%, for example. in one example, the limp mode reduces a current torque of the motor 1610 by 50%. the handle can comprise an indicator, such as a red led, for example, which indicates that the instrument system failed the diagnostic check and/or that the instrument system has entered into a limp mode. the above being said, any suitable feedback can be used to warn the clinician that the instrument system is not operating properly such as, for example, an audible warning and/or a tactile or vibratory warning, for example. figs. 41-43 depict a clutch system 6000 ′ in accordance with at least one alternative embodiment. the clutch system 6000 ′ is similar to the clutch system 6000 in many respects, most of which will not be repeated herein for the sake of brevity. similar to the clutch system 6000 , the clutch system 6000 ′ comprises a clutch assembly 6100 ′ which is actuatable to selectively couple a rotatable drive input 6030 ′ with a rotatable drive output 6130 ′. the clutch assembly 6100 ′ comprises clutch plates 6110 ′ and drive rings 6120 ′. the clutch plates 6110 ′ are comprised of a magnetic material, such as iron and/or nickel, for example, and can comprise a permanent magnet. as described in greater detail below, the clutch plates 6110 ′ are movable between unactuated positions ( fig. 42 ) and actuated positions ( fig. 43 ) within the drive output 6130 ′. the clutch plates 6110 ′ are slideably positioned in apertures defined in the drive output 6130 ′ such that the clutch plates 6110 ′ rotate with the drive output 6130 ′ regardless of whether the clutch plates 6110 ′ are in their unactuated or actuated positions. when the clutch plates 6110 ′ are in their unactuated positions, as illustrated in fig. 42 , the rotation of the drive input 6030 ′ is not transferred to the drive output 6130 ′. more specifically, when the drive input 6030 ′ is rotated, in such instances, the drive input 6030 ′ slides past and rotates relative to the drive rings 6120 ′ and, as a result, the drive rings 6120 ′ do not drive the clutch plates 6110 ′ and the drive output 6130 ′. when the clutch plates 6110 ′ are in their actuated positions, as illustrated in fig. 43 , the clutch plates 6110 ′ resiliently compress the drive rings 6120 ′ against the drive input 6030 ′. the drive rings 6120 ′ are comprised of any suitable compressible material, such as rubber, for example. in any event, in such instances, the rotation of the drive input 6030 ′ is transferred to the drive output 6130 ′ via the drive rings 6120 ′ and the clutch plates 6110 ′. the clutch system 6000 ′ comprises a clutch actuator 6140 ′ configured to move the clutch plates 6110 ′ into their actuated positions. the clutch actuator 6140 ′ is comprised of a magnetic material such as iron and/or nickel, for example, and can comprise a permanent magnet. the clutch actuator 6140 ′ is slideably positioned in a longitudinal shaft frame 6050 ′ extending through the drive input 6030 ′ and can be moved between an unactuated position ( fig. 42 ) and an actuated position ( fig. 43 ) by a clutch shaft 6060 ′. in at least one instance, the clutch shaft 6060 ′ comprises a polymer cable, for example. when the clutch actuator 6140 ′ is in its actuated position, as illustrated in fig. 43 , the clutch actuator 6140 ′ pulls the clutch plates 6110 ′ inwardly to compress the drive rings 6120 ′, as discussed above. when the clutch actuator 6140 ′ is moved into its unactuated position, as illustrated in fig. 42 , the drive rings 6120 ′ resiliently expand and push the clutch plates 6110 ′ away from the drive input 6030 ′. in various alternative embodiments, the clutch actuator 6140 ′ can comprise an electromagnet. in such an arrangement, the clutch actuator 6140 ′ can be actuated by an electrical circuit extending through a longitudinal aperture defined in the clutch shaft 6060 ′, for example. in various instances, the clutch system 6000 ′ further comprises electrical wires 6040 ′, for example, extending through the longitudinal aperture. fig. 44 depicts an end effector 7000 a including a jaw assembly 7100 a , a jaw assembly drive, and a clutch system 6000 a in accordance with at least one alternative embodiment. the jaw assembly 7100 a comprises a first jaw 7110 a and a second jaw 7120 a which are selectively rotatable about a pivot 7130 a . the jaw assembly drive comprises a translatable actuator rod 7160 a and drive links 7140 a which are pivotably coupled to the actuator rod 7160 a about a pivot 7150 a . the drive links 7140 a are also pivotably coupled to the jaws 7110 a and 7120 a such that the jaws 7110 a and 7120 a are rotated closed when the actuator rod 7160 a is pulled proximally and rotated open when the actuator rod 7160 a is pushed distally. the clutch system 6000 a is similar to the clutch systems 6000 and 6000 ′ in many respects, most of which will not be repeated herein for the sake of brevity. the clutch system 6000 a comprises a first clutch assembly 6100 a and a second clutch assembly 6200 a which are configured to selectively transmit the rotation of a drive input 6030 a to rotate the jaw assembly 7100 a about a longitudinal axis and articulate the jaw assembly 7100 a about an articulation joint 7300 a , respectively, as described in greater detail below. the first clutch assembly 6100 a comprises clutch plates 6110 a and drive rings 6120 a and work in a manner similar to the clutch plates 6110 ′ and drive rings 6120 ′ discussed above. when the clutch pates 6110 a are actuated by an electromagnetic actuator 6140 a , the rotation of the drive input 6030 a is transferred to an outer shaft housing 7200 a . more specifically, the outer shaft housing 7200 a comprises a proximal outer housing 7210 a and a distal outer housing 7220 a which is rotatably supported by the proximal outer housing 7210 a and is rotated relative to the proximal outer housing 7210 a by the drive input 6030 a when the clutch plates 6110 a are in their actuated position. the rotation of the distal outer housing 7220 a rotates the jaw assembly 7100 a about the longitudinal axis owing to fact that the pivot 7130 a of the jaw assembly 7100 a is mounted to the distal outer housing 7220 a . as a result, the outer shaft housing 7200 a rotates the jaw assembly 7100 a in a first direction when the outer shaft housing 7200 a is rotated in a first direction by the drive input 6030 a . similarly, the outer shaft housing 7200 a rotates the jaw assembly 7100 a in a second direction when the outer shaft housing 7200 a is rotated in a second direction by the drive input 6030 a . when the electromagnetic actuator 6140 a is de-energized, the drive rings 6120 a expand and the clutch plates 6110 a are moved into their unactuated positions, thereby decoupling the end effector rotation drive from the drive input 6030 a. the second clutch assembly 6200 a comprises clutch plates 6210 a and drive rings 6220 a and work in a manner similar to the clutch plates 6110 ′ and drive rings 6120 ′ discussed above. when the clutch pates 6210 a are actuated by an electromagnetic actuator 6240 a , the rotation of the drive input 6030 a is transferred to an articulation drive 6230 a . the articulation drive 6230 a is rotatably supported within an outer shaft housing 7410 a of an end effector attachment portion 7400 a and is rotatably supported by a shaft frame 6050 a extending through the outer shaft housing 7410 a . the articulation drive 6230 a comprises a gear face defined thereon which is operably intermeshed with a stationary gear face 7230 a defined on the proximal outer housing 7210 a of the outer shaft housing 7200 a . as a result, the articulation drive 6230 a articulates the outer shaft housing 7200 a and the jaw assembly 7100 a in a first direction when the articulation drive 6230 a is rotated in a first direction by the drive input 6030 a . similarly, the articulation drive 6230 a articulates the outer shaft housing 7200 a and the jaw assembly 7100 a in a second direction when the articulation drive 6230 a is rotated in a second direction by the drive input 6030 a . when the electromagnetic actuator 6240 a is de-energized, the drive rings 6220 a expand and the clutch plates 6210 a are moved into their unactuated positions, thereby decoupling the end effector articulation drive from the drive input 6030 a. further to the above, the shaft assembly 4000 is illustrated in figs. 45-49 . the shaft assembly 4000 is similar to the shaft assemblies 2000 , 2000 ′, 2000 ″′, and 2000 ″″ in many respects, most of which will not be repeated herein for the sake of brevity. the shaft assembly 4000 comprises a proximal portion 4100 , an elongate shaft 4200 , a distal attachment portion 2400 , and an articulate joint 2300 which rotatably connects the distal attachment portion 2040 to the elongate shaft 4200 . the proximal portion 4100 , similar to the proximal portion 2100 , is operably attachable to the drive module 1100 of the handle 1000 . the proximal portion 4100 comprises a housing 4110 including an attachment interface 4130 configured to mount the shaft assembly 4000 to the attachment interface 1130 of the handle 1000 . the shaft assembly 4000 further comprises a frame 4500 including a shaft 4510 configured to be coupled to the shaft 1510 of the handle frame 1500 when the shaft assembly 4000 is attached to the handle 1000 . the shaft assembly 4000 also comprises a drive system 4700 including a rotatable drive shaft 4710 configured to be operably coupled to the drive shaft 1710 of the handle drive system 1700 when the shaft assembly 4000 is attached to the handle 1000 . the distal attachment portion 2400 is configured to receive an end effector, such as end effector 8000 , for example. the end effector 8000 is similar to the end effector 7000 in many respects, most of which will not be repeated herein for the sake of brevity. that said, the end effector 8000 comprises a jaw assembly 8100 configured to, among other things, grasp tissue. as discussed above, referring primarily to figs. 47-49 , the frame 4500 of the shaft assembly 4000 comprises a frame shaft 4510 . the frame shaft 4510 comprises a notch, or cut-out, 4530 defined therein. as discussed in greater detail below, the cut-out 4530 is configured to provide clearance for a jaw closure actuation system 4600 . the frame 4500 further comprises a distal portion 4550 and a bridge 4540 connecting the distal portion 4550 to the frame shaft 4510 . the frame 4500 further comprises a longitudinal portion 4560 extending through the elongate shaft 4200 to the distal attachment portion 2400 . similar to the above, the frame shaft 4510 comprises one or more electrical traces defined thereon and/or therein. the electrical traces extend through the longitudinal portion 4560 , the distal portion 4550 , the bridge 4540 , and/or any suitable portion of the frame shaft 4510 to the electrical contacts 2520 . referring primarily to fig. 48 , the distal portion 4550 and longitudinal portion 4560 comprise a longitudinal aperture defined therein which is configured to receive a rod 4660 of the jaw closure actuation system 4600 , as described in greater detail below. as also discussed above, referring primarily to figs. 48 and 49 , the drive system 4700 of the shaft assembly 4000 comprises a drive shaft 4710 . the drive shaft 4710 is rotatably supported within the proximal shaft housing 4110 by the frame shaft 4510 and is rotatable about a longitudinal axis extending through the frame shaft 4510 . the drive system 4700 further comprises a transfer shaft 4750 and an output shaft 4780 . the transfer shaft 4750 is also rotatably supported within the proximal shaft housing 4110 and is rotatable about a longitudinal axis extending parallel to, or at least substantially parallel to, the frame shaft 4510 and the longitudinal axis defined therethrough. the transfer shaft 4750 comprises a proximal spur gear 4740 fixedly mounted thereto such that the proximal spur gear 4740 rotates with the transfer shaft 4750 . the proximal spur gear 4740 is operably intermeshed with an annular gear face 4730 defined around the outer circumference of the drive shaft 4710 such that the rotation of the drive shaft 4710 is transferred to the transfer shaft 4750 . the transfer shaft 4750 further comprises a distal spur gear 4760 fixedly mounted thereto such that the distal spur gear 4760 rotates with the transfer shaft 4750 . the distal spur gear 4760 is operably intermeshed with an annular gear 4770 defined around the outer circumference of the output shaft 4780 such that the rotation of the transfer shaft 4750 is transferred to the output shaft 4780 . similar to the above, the output shaft 4780 is rotatably supported within the proximal shaft housing 4110 by the distal portion 4550 of the shaft frame 4500 such that the output shaft 4780 rotates about the longitudinal shaft axis. notably, the output shaft 4780 is not directly coupled to the input shaft 4710 ; rather, the output shaft 4780 is operably coupled to the input shaft 4710 by the transfer shaft 4750 . such an arrangement provides room for the manually-actuated jaw closure actuation system 4600 discussed below. further to the above, referring primarily to figs. 47 and 48 , the jaw closure actuation system 4600 comprises an actuation, or scissors, trigger 4610 rotatably coupled to the proximal shaft housing 4110 about a pivot 4620 . the actuation trigger 4610 comprises an elongate portion 4612 , a proximal end 4614 , and a grip ring aperture 4616 defined in the proximal end 4614 which is configured to be gripped by the clinician. the shaft assembly 4000 further comprises a stationary grip 4160 extending from the proximal housing 4110 . the stationary grip 4160 comprises an elongate portion 4162 , a proximal end 4164 , and a grip ring aperture 4166 defined in the proximal end 4164 which is configured to be gripped by the clinician. in use, as described in greater detail below, the actuation trigger 4610 is rotatable between an unactuated position and an actuated position ( fig. 48 ), i.e., toward the stationary grip 4160 , to close the jaw assembly 8100 of the end effector 8000 . referring primarily to fig. 48 , the jaw closure actuation system 4600 further comprises a drive link 4640 rotatably coupled to the proximal shaft housing 4110 about a pivot 4650 and, in addition, an actuation rod 4660 operably coupled to the drive link 4640 . the actuation rod 4660 extends through an aperture defined in the longitudinal frame portion 4560 and is translatable along the longitudinal axis of the shaft frame 4500 . the actuation rod 4660 comprises a distal end operably coupled to the jaw assembly 8100 and a proximal end 4665 positioned in a drive slot 4645 defined in the drive link 4640 such that the actuation rod 4660 is translated longitudinally when the drive link 4640 is rotated about the pivot 4650 . notably, the proximal end 4665 is rotatably supported within the drive slot 4645 such that the actuation rod 4660 can rotate with the end effector 8000 . further to the above, the actuation trigger 4610 further comprises a drive arm 4615 configured to engage and rotate the drive link 4640 proximally, and translate the actuation rod 4660 proximally, when the actuation trigger 4610 is actuated, i.e., moved closer to the proximal shaft housing 4110 . in such instances, the proximal rotation of the drive link 4640 resiliently compresses a biasing member, such as a coil spring 4670 , for example, positioned intermediate the drive link 4640 and the frame shaft 4510 . when the actuation trigger 4610 is released, the compressed coil spring 4670 re-expands and pushes the drive link 4640 and the actuation rod 4660 distally to open the jaw assembly 8100 of the end effector 8000 . moreover, the distal rotation of the drive link 4640 drives, and automatically rotates, the actuation trigger 4610 back into its unactuated position. that being said, the clinician could manually return the actuation trigger 4610 back into its unactuated position. in such instances, the actuation trigger 4610 could be opened slowly. in either event, the shaft assembly 4000 further comprises a lock configured to releasably hold the actuation trigger 4610 in its actuated position such that the clinician can use their hand to perform another task without the jaw assembly 8100 opening unintentionally. in various alternative embodiments, further to the above, the actuation rod 4660 can be pushed distally to close the jaw assembly 8100 . in at least one such instance, the actuation rod 4660 is mounted directly to the actuation trigger 4610 such that, when the actuation trigger 4610 is actuated, the actuation trigger 4610 drives the actuation rod 4660 distally. similar to the above, the actuation trigger 4610 can compress a spring when the actuation trigger 4610 is closed such that, when the actuation trigger 4610 is released, the actuation rod 4660 is pushed proximally. further to the above, the shaft assembly 4000 has three functions—opening/closing the jaw assembly of an end effector, rotating the end effector about a longitudinal axis, and articulating the end effector about an articulation axis. the end effector rotation and articulation functions of the shaft assembly 4000 are driven by the motor assembly 1600 and the control system 1800 of the drive module 1100 while the jaw actuation function is manually-driven by the jaw closure actuation system 4600 . the jaw closure actuation system 4600 could be a motor-driven system but, instead, the jaw closure actuation system 4600 has been kept a manually-driven system such that the clinician can have a better feel for the tissue being clamped within the end effector. while motorizing the end effector rotation and actuation systems provides certain advantages for controlling the position of the end effector, motorizing the jaw closure actuation system 4600 may cause the clinician to lose a tactile sense of the force being applied to the tissue and may not be able to assess whether the force is insufficient or excessive. thus, the jaw closure actuation system 4600 is manually-driven even though the end effector rotation and articulation systems are motor-driven. fig. 50 is a logic diagram of the control system 1800 of the surgical system depicted in fig. 1 in accordance with at least one embodiment. the control system 1800 comprises a control circuit. the control circuit includes a microcontroller 1840 comprising a processor 1820 and a memory 1830 . one or more sensors, such as sensors 1880 , 1890 , 6180 ′, 6280 ′, 6380 ′, 7190 ″, and/or 6290 ′″, for example, provide real time feedback to the processor 1820 . the control system 1800 further comprises a motor driver 1850 configured to control the electric motor 1610 and a tracking system 1860 configured to determine the position of one or more longitudinally movable components in the surgical instrument, such as the clutches 6110 , 6120 , and 6130 and/or the longitudinally-movable drive nut 7150 of the jaw assembly drive, for example. the tracking system 1860 is also configured to determine the position of one or more rotational components in the surgical instrument, such as the drive shaft 2530 , the outer shaft 6230 , and/or the articulation drive 6330 , for example. the tracking system 1860 provides position information to the processor 1820 , which can be programmed or configured to, among other things, determine the position of the clutches 6110 , 6120 , and 6130 and the drive nut 7150 as well as the orientation of the jaws 7110 and 7120 . the motor driver 1850 may be an a3941 available from allegro microsystems, inc., for example; however, other motor drivers may be readily substituted for use in the tracking system 1860 . a detailed description of an absolute positioning system is described in u.s. patent application publication no. 2017/0296213, entitled systems and methods for controlling a surgical stapling and cutting instrument, the entire disclosure of which is hereby incorporated herein by reference. the microcontroller 1840 may be any single core or multicore processor such as those known under the trade name arm cortex by texas instruments, for example. in at least one instance, the microcontroller 1840 is a lm4f230h5qr arm cortex-m4f processor core, available from texas instruments, for example, comprising on-chip memory of 256 kb single-cycle flash memory, or other non-volatile memory, up to 40 mhz, a prefetch buffer to improve performance above 40 mhz, a 32 kb single-cycle serial random access memory (sram), internal read-only memory (rom) loaded with stellarisware® software, 2 kb electrically erasable programmable read-only memory (eeprom), one or more pulse width modulation (pwm) modules and/or frequency modulation (fm) modules, one or more quadrature encoder inputs (qei) analog, one or more 12-bit analog-to-digital converters (adc) with 12 analog input channels, for example, details of which are available from the product datasheet. in various instances, the microcontroller 1840 comprises a safety controller comprising two controller-based families such as tms570 and rm4x known under the trade name hercules arm cortex r4, also by texas instruments. the safety controller may be configured specifically for iec 61508 and iso 26262 safety critical applications, among others, to provide advanced integrated safety features while delivering scalable performance, connectivity, and memory options. the microcontroller 1840 is programmed to perform various functions such as precisely controlling the speed and/or position of the drive nut 7150 of the jaw closure assembly, for example. the microcontroller 1840 is also programmed to precisely control the rotational speed and position of the end effector 7000 and the articulation speed and position of the end effector 7000 . in various instances, the microcontroller 1840 computes a response in the software of the microcontroller 1840 . the computed response is compared to a measured response of the actual system to obtain an “observed” response, which is used for actual feedback decisions. the observed response is a favorable, tuned, value that balances the smooth, continuous nature of the simulated response with the measured response, which can detect outside influences on the system. the motor 1610 is controlled by the motor driver 1850 . in various forms, the motor 1610 is a dc brushed driving motor having a maximum rotational speed of approximately 25,000 rpm, for example. in other arrangements, the motor 1610 includes a brushless motor, a cordless motor, a synchronous motor, a stepper motor, or any other suitable electric motor. the motor driver 1850 may comprise an h-bridge driver comprising field-effect transistors (fets), for example. the motor driver 1850 may be an a3941 available from allegro microsystems, inc., for example. the a3941 driver 1850 is a full-bridge controller for use with external n-channel power metal oxide semiconductor field effect transistors (mosfets) specifically designed for inductive loads, such as brush dc motors. in various instances, the driver 1850 comprises a unique charge pump regulator provides full (>10 v) gate drive for battery voltages down to 7 v and allows the a3941 to operate with a reduced gate drive, down to 5.5 v. a bootstrap capacitor may be employed to provide the above-battery supply voltage required for n-channel mosfets. an internal charge pump for the high-side drive allows dc (100% duty cycle) operation. the full bridge can be driven in fast or slow decay modes using diode or synchronous rectification. in the slow decay mode, current recirculation can be through the high-side or the lowside fets. the power fets are protected from shoot-through by resistor adjustable dead time. integrated diagnostics provide indication of undervoltage, overtemperature, and power bridge faults, and can be configured to protect the power mosfets under most short circuit conditions. other motor drivers may be readily substituted. the tracking system 1860 comprises a controlled motor drive circuit arrangement comprising one or more position sensors, such as sensors 1880 , 1890 , 6180 ′, 6280 ′, 6380 ′, 7190 ″, and/or 6290 ′″, for example. the position sensors for an absolute positioning system provide a unique position signal corresponding to the location of a displacement member. as used herein, the term displacement member is used generically to refer to any movable member of the surgical system. in various instances, the displacement member may be coupled to any position sensor suitable for measuring linear displacement. linear displacement sensors may include contact or non-contact displacement sensors. linear displacement sensors may comprise linear variable differential transformers (lvdt), differential variable reluctance transducers (dvrt), a slide potentiometer, a magnetic sensing system comprising a movable magnet and a series of linearly arranged hall effect sensors, a magnetic sensing system comprising a fixed magnet and a series of movable linearly arranged hall effect sensors, an optical sensing system comprising a movable light source and a series of linearly arranged photo diodes or photo detectors, or an optical sensing system comprising a fixed light source and a series of movable linearly arranged photo diodes or photo detectors, or any combination thereof. the position sensors 1880 , 1890 , 6180 ′, 6280 ′, 6380 ′, 7190 ″, and/or 6290 ′″, for example, may comprise any number of magnetic sensing elements, such as, for example, magnetic sensors classified according to whether they measure the total magnetic field or the vector components of the magnetic field. the techniques used to produce both types of magnetic sensors encompass many aspects of physics and electronics. the technologies used for magnetic field sensing include search coil, fluxgate, optically pumped, nuclear precession, squid, hall-effect, anisotropic magnetoresistance, giant magnetoresistance, magnetic tunnel junctions, giant magnetoimpedance, magnetostrictive/piezoelectric composites, magnetodiode, magnetotransistor, fiber optic, magnetooptic, and microelectromechanical systems-based magnetic sensors, among others. in various instances, one or more of the position sensors of the tracking system 1860 comprise a magnetic rotary absolute positioning system. such position sensors may be implemented as an as5055eqft single-chip magnetic rotary position sensor available from austria microsystems, ag and can be interfaced with the controller 1840 to provide an absolute positioning system. in certain instances, a position sensor comprises a low-voltage and low-power component and includes four hall-effect elements in an area of the position sensor that is located adjacent a magnet. a high resolution adc and a smart power management controller are also provided on the chip. a cordic processor (for coordinate rotation digital computer), also known as the digit-by-digit method and volder's algorithm, is provided to implement a simple and efficient algorithm to calculate hyperbolic and trigonometric functions that require only addition, subtraction, bitshift, and table lookup operations. the angle position, alarm bits, and magnetic field information are transmitted over a standard serial communication interface such as an spi interface to the controller 1840 . the position sensors can provide 12 or 14 bits of resolution, for example. the position sensors can be an as5055 chip provided in a small qfn 16-pin 4×4×0.85 mm package, for example. the tracking system 1860 may comprise and/or be programmed to implement a feedback controller, such as a pid, state feedback, and adaptive controller. a power source converts the signal from the feedback controller into a physical input to the system, in this case voltage. other examples include pulse width modulation (pwm) and/or frequency modulation (fm) of the voltage, current, and force. other sensor(s) may be provided to measure physical parameters of the physical system in addition to position. in various instances, the other sensor(s) can include sensor arrangements such as those described in u.s. pat. no. 9,345,481, entitled staple cartridge tissue thickness sensor system, which is hereby incorporated herein by reference in its entirety; u.s. patent application publication no. 2014/0263552, entitled staple cartridge tissue thickness sensor system, which is hereby incorporated herein by reference in its entirety; and u.s. patent application ser. no. 15/628,175, entitled techniques for adaptive control of motor velocity of a surgical stapling and cutting instrument, which is hereby incorporated herein by reference in its entirety. in a digital signal processing system, absolute positioning system is coupled to a digital data acquisition system where the output of the absolute positioning system will have finite resolution and sampling frequency. the absolute positioning system may comprise a compare and combine circuit to combine a computed response with a measured response using algorithms such as weighted average and theoretical control loop that drives the computed response towards the measured response. the computed response of the physical system takes into account properties like mass, inertial, viscous friction, inductance resistance, etc., to predict what the states and outputs of the physical system will be by knowing the input. the absolute positioning system provides an absolute position of the displacement member upon power up of the instrument without retracting or advancing the displacement member to a reset (zero or home) position as may be required with conventional rotary encoders that merely count the number of steps forwards or backwards that the motor 1610 has taken to infer the position of a device actuator, drive bar, knife, and the like. a sensor 1880 comprising a strain gauge or a micro-strain gauge, for example, is configured to measure one or more parameters of the end effector, such as, for example, the strain experienced by the jaws 7110 and 7120 during a clamping operation. the measured strain is converted to a digital signal and provided to the processor 1820 . in addition to or in lieu of the sensor 1880 , a sensor 1890 comprising a load sensor, for example, can measure the closure force applied by the closure drive system to the jaws 7110 and 7120 . in various instances, a current sensor 1870 can be employed to measure the current drawn by the motor 1610 . the force required to clamp the jaw assembly 7100 can correspond to the current drawn by the motor 1610 , for example. the measured force is converted to a digital signal and provided to the processor 1820 . a magnetic field sensor can be employed to measure the thickness of the captured tissue. the measurement of the magnetic field sensor can also be converted to a digital signal and provided to the processor 1820 . the measurements of the tissue compression, the tissue thickness, and/or the force required to close the end effector on the tissue as measured by the sensors can be used by the controller 1840 to characterize the position and/or speed of the movable member being tracked. in at least one instance, a memory 1830 may store a technique, an equation, and/or a look-up table which can be employed by the controller 1840 in the assessment. in various instances, the controller 1840 can provide the user of the surgical instrument with a choice as to the manner in which the surgical instrument should be operated. to this end, the display 1440 can display a variety of operating conditions of the instrument and can include touch screen functionality for data input. moreover, information displayed on the display 1440 may be overlaid with images acquired via the imaging modules of one or more endoscopes and/or one or more additional surgical instruments used during the surgical procedure. as discussed above, the drive module 1100 of the handle 1000 and/or the shaft assemblies 2000 , 3000 , 4000 , and/or 5000 , for example, attachable thereto comprise control systems. each of the control systems can comprise a circuit board having one or more processors and/or memory devices. among other things, the control systems are configured to store sensor data, for example. they are also configured to store data which identifies the shaft assembly to the handle 1000 . moreover, they are also configured to store data including whether or not the shaft assembly has been previously used and/or how many times the shaft assembly has been used. this information can be obtained by the handle 1000 to assess whether or not the shaft assembly is suitable for use and/or has been used less than a predetermined number of times, for example. a drive module 1100 ′ in accordance with at least one alternative embodiment is illustrated in figs. 51-53 . the drive module 1100 ′ is similar to the drive module 1100 in many respects, most of which will not be discussed herein for the sake of brevity. the drive module 1100 ′ comprises an actuator 1420 ′ configured to control the rotation and articulation of the end effector 7000 . similar to the actuator 1420 , discussed above, the actuator 1420 ′ is rotatable about a longitudinal axis la that extends through a shaft assembly attached to the drive module 1100 . for instance, the longitudinal axis la extends through the center, or substantially the center, of the elongate shaft 2200 of the shaft assembly 3000 ( fig. 1 ) when the shaft assembly 3000 is assembled to the drive module 1100 ′. the longitudinal axis la also extends through the center, or substantially the center, of the end effector 7000 when the end effector 7000 is attached to the shaft assembly 3000 , for example. the actuator 1420 ′ is rotatable within a channel 1190 ′ defined in the housing 1110 in a first direction to rotate the end effector 7000 in the first direction and, similarly, in a second, or opposite, direction to rotate the end effector 7000 in the second direction. similar to the drive module 1100 , the drive module 1100 ′ comprises a sensor system in communication with the control system 1800 configured to detect the rotation of the actuator 1420 ′ about the longitudinal axis la. in at least one instance, the sensor system comprises a first sensor 1422 ′ configured to detect the rotation of the actuator 1420 ′ about the longitudinal axis la in the first direction ( fig. 52a ) and a second sensor 1424 ′ configured to detect the rotation of the actuator 1420 ′ about the longitudinal axis la in the second direction ( fig. 52b ). the first and second sensors 1422 ′ and 1424 ′ comprise hall effect sensors, for example, but could comprise any suitable type of sensor. in at least one such instance, further to the above, the actuator 1420 ′ comprises a center magnetic element 1426 ′ positioned in the top of the actuator 1420 ′ which is detectable by the first and second sensors 1422 ′ and 1424 ′ to determine the rotation of the actuator 1420 ′. the center magnetic element 1426 ′ can comprise a permanent magnet and/or can be comprised of iron and/or nickel, for example. further to the above, the control system 1800 is configured to control the motor assembly 1600 and the clutch system 6000 to rotate the end effector 7000 about the longitudinal axis la in the first direction when the actuator 1420 ′ is rotated about the longitudinal axis la in the first direction. similarly, the control system 1800 is configured to control the motor assembly 1600 and the clutch system 6000 to rotate the end effector 7000 about the longitudinal axis la in the second direction when the actuator 1420 ′ is rotated about the longitudinal axis la in the second direction. by associating the rotation of the end effector 7000 about the longitudinal axis la with the rotation of the actuator 1420 ′ about the longitudinal axis la, the clinician is provided with a system that is very intuitive to use. as discussed above, the end effector 7000 is configured to rotate about a longitudinal axis within a socket defined in the distal attachment portion 2400 of the shaft assembly 2000 . depending on the amount of rotation desired, the end effector 7000 can be rotated less than 360 degrees or more than 360 degrees in either direction. in various instances, the end effector 7000 can be rotated through several rotations in either direction. in alternative embodiments, the rotation of the end effector 7000 about the longitudinal axis can be limited. in at least one embodiment, the shaft assembly 2000 comprises one or more stops which limit the rotation of the end effector 7000 to less than one rotation. in certain embodiments, the control system 1800 monitors the rotation of the drive shaft 1710 , such as by an encoder and/or an absolute positioning sensor system, for example, and limits the rotation of the end effector 7000 by stopping or pausing the motor 1610 when the end effector 7000 has reached the end of its permitted range. in at least one instance, the control system 1800 can disengage the second clutch 6210 from the drive shaft 2730 to stop or pause the rotation of the end effector 7000 when the end effector 7000 has reached the end of its permitted range. further to the above, the drive module 1100 ′ and/or a shaft module attached to the drive module 1100 ′ can provide feedback to the clinician that the end effector 7000 has reached the end of its rotation. the drive module 1100 ′ and/or the shaft module attached thereto can comprise an indicator light 1427 ′, such as a red led, for example, on a first side of the module housing 1110 ′ which is illuminated by the control system 1800 when the end effector 7000 has reached the end of its permitted rotation in the first direction, as illustrated in fig. 52a . in at least one instance, the drive module 1100 ′ and/or the shaft module attached thereto can comprise an indicator light 1429 ′, such as a red led, for example, on a second side of the module housing 1110 ′ which is illuminated by the control system 1800 when the end effector 7000 has reached the end of its permitted rotation in the second direction, as illustrated in fig. 52b . in various instances, further to the above, the illumination of either the first light 1427 ′ or the second light 1429 ′ can indicate to the clinician that the motor 1610 has been paused and that the end effector 7000 is no longer rotating. in at least one instance, the first light 1427 ′ and/or the second light 1429 ′ can blink when the motor 1610 is paused. in addition to or in lieu of the above, the drive module 1100 ′ and/or the shaft assembly attached thereto can comprise an annular series, or array, of indicator lights 1428 ′ extending around the perimeter thereof which is in communication with the control system 1800 and can indicate the rotational orientation of the end effector 7000 . in at least one instance, the control system 1800 is configured to illuminate the particular indicator light which corresponds, or at least substantially corresponds, with the position in which the top of the end effector 7000 is oriented. in at least one instance, the center of the first jaw 7110 can be deemed the top of the end effector 7000 , for example. in such instances, the illuminated light indicates the top-dead-center position of the end effector 7000 . in other instances, the control system 1800 can illuminate the particular indicator light which corresponds, or at least substantially corresponds, with the position in which the bottom, or bottom-dead-center, of the end effector 7000 is oriented. in at least one instance, the center of the second jaw 7210 can be deemed the bottom of the end effector 7000 , for example. as a result of the above, the illuminated indicator light can follow the rotation of the end effector 7000 around the array of indicator lights 1428 ′. further to the above, the actuator 1420 ′ is also rotatable, or tiltable, about a transverse axis ta within the housing channel 1190 ′. the sensor system of the drive module 1100 ′ is further configured to detect the rotation of the actuator 1420 ′ about the transverse axis ta in a first tilt direction and a second tilt direction. in at least one instance, the sensor system comprises a first tilt sensor 1423 ′ configured to detect the rotation of the actuator 1420 ′ about the longitudinal axis ta in the first tilt direction ( fig. 53a ) and a second tilt sensor 1425 ′ configured to detect the rotation of the actuator 1420 ′ in the second tilt direction ( fig. 53b ). the first and second tilt sensors 1423 ′ and 1425 ′ comprise hall effect sensors, for example, but could comprise any suitable type of sensor. the actuator 1420 ′ further comprises a first lateral magnetic element adjacent the first tilt sensor 1423 ′, the motion of which is detectable by the first tilt sensor 1423 ′. the actuator 1420 ′ also comprises a second lateral magnetic element adjacent the second tilt sensor 1425 ′, the motion of which is detectable by the second tilt sensor 1425 ′. the first and second lateral magnetic elements can comprise a permanent magnet and/or can be comprised of iron and/or nickel, for example. as illustrated in figs. 53a and 53b , the lateral sides of the actuator 1420 ′ are movable proximally and distally about the transverse axis ta and, as a result, the first and second lateral magnetic elements are also movable proximally and distally relative to the first and second tilt sensors. the reader should appreciate that, while the first and second lateral magnetic elements actually travel along arcuate paths about the transverse axis ta, the distances in which the first and second lateral magnetic elements move is small and, as a result, the arcuate motion of the first and second lateral magnetic elements approximates translation in the proximal and distal directions. in various embodiments, further to the above, the entire actuator 1420 ′ comprises a magnetic ring of material which is detectable by the tilt sensors 1423 ′ and 1425 ′ of the drive module 1100 ′. in such embodiments, the rotation of the actuator 1420 ′ about the longitudinal axis la would not create a compound motion relative to the tilt sensors when the actuator 1420 ′ is tilted. the magnetic ring of material can comprise a permanent magnet and/or can be comprised of iron and/or nickel, for example. in any event, when the sensor system detects that the actuator 1420 ′ has been tilted in the first direction, as illustrated in fig. 53a , the control system 1800 operates the motor assembly 1600 and the clutch system 6000 to articulate the end effector 7000 about the articulation joint 2300 in the first direction. similarly, the control system 1800 operates the motor assembly 1600 and the clutch system 6000 to articulate the end effector 7000 about the articulation joint 2300 in the second direction when the sensor system detects that the actuator 1420 ′ has been tilted in the second direction, as illustrated in fig. 53b . by associating the rotation of the end effector 7000 about the articulation joint 2300 with the rotation of the actuator 1420 ′ about the transverse axis ta, the clinician is provided with a system that is very intuitive to use. further to the above, the actuator 1420 ′ comprises a biasing system configured to center the actuator 1420 ′ in its unrotated and untilted position. in various instances, the biasing system comprises first and second rotation springs configured to center the actuator 1420 ′ in its unrotated position and first and second tilt springs configured to center the actuator 1420 ′ in its untilted position. these springs can comprise torsion springs and/or linear displacement springs, for example. as discussed above, the end effector 7000 rotates relative to the distal attachment portion 2400 of the shaft assembly 3000 . such an arrangement allows the end effector 7000 to be rotated without having to rotate the shaft assembly 3000 , although embodiments are possible in which an end effector and shaft assembly rotate together. that said, by rotating the end effector 7000 relative to the shaft assembly 3000 , all of the rotation of the surgical system occurs distally relative to the articulation joint 2300 . such an arrangement prevents a large sweep of the end effector 7000 when the end effector 7000 is articulated and then rotated. moreover, the articulation joint 2300 does not rotate with the end effector 7000 and, as a result, the articulation axis of the articulation joint 2300 is unaffected by the rotation of the end effector 7000 . in order to mimic this arrangement, the transverse axis ta does not rotate with the actuator 1420 ′; rather, the transverse axis ta remains stationary with respect to the drive module 1100 ′. that said, in alternative embodiments, the transverse axis ta can rotate, or track the end effector 7000 , when the articulation joint rotates with the end effector. such an arrangement can maintain an intuitive relationship between the motion of the actuator 1420 ′ and the motion of the end effector 7000 . further to the above, the transverse axis ta is orthogonal, or at least substantially orthogonal, to the longitudinal axis la. similarly, the articulation axis of the articulation joint 2300 is orthogonal, or at least substantially orthogonal, to the longitudinal axis la. as a result, the transverse axis ta is parallel to, or at least substantially parallel to, the articulation axis. in various alternative embodiments, the tiltable actuator 1420 ′ is only used to control the articulation of the end effector 7000 and is not rotatable about the longitudinal axis la. rather, in such embodiments, the actuator 1420 ′ is only rotatable about the transverse axis ta. in at least one instance, the housing of the drive module 1100 ′ comprises two posts 1421 ′ ( fig. 51 ) about which the actuator 1120 ′ is rotatably mounted which defines the transverse axis ta. the posts 1421 ′ are aligned along a common axis. the above being said, the posts 1421 ′, or any suitable structure, can be used in embodiments in which the actuator 1420 ′ is both rotatable and tiltable to control the rotation and articulation of the end effector 7000 . in at least one such instance, the actuator 1420 ′ comprises an annular groove defined therein in which the posts 1421 ′ are positioned. in various instances, the drive module 1100 and/or the shaft assembly attached thereto can comprise a series, or array, of indicator lights 1438 ′ which is in communication with the control system 1800 and can indicate the articulation orientation of the end effector 7000 . in at least one instance, the control system 1800 is configured to illuminate the particular indicator light which corresponds, or at least substantially corresponds, with the position in which the end effector 7000 is articulated. as a result of the above, the illuminated indicator light can follow the articulation of the end effector 7000 . such an array of indicator lights can assist a clinician in straightening the end effector 7000 before attempting to remove the end effector 7000 from a patient through a trocar. in various instances, an unstraightened end effector may not pass through a trocar and prevent the removable of the end effector from the patient. a drive module 1100 ″ in accordance with at least one alternative embodiment is illustrated in figs. 54-57 . the drive module 1100 ″ is similar to the drive modules 1100 and 1100 ′ in many respects, most of which will not be discussed herein for the sake of brevity. the drive module 1100 ″ comprises a feedback system configured to inform the clinician using the surgical instrument system that the drive shaft and/or any other rotatable component of the surgical instrument system is rotating. the feedback system can use visual feedback, audio feedback, and/or tactile feedback, for example. referring primarily to fig. 55 , the drive module 1100 ″ comprises a tactile feedback system which is operably engageable with the drive shaft 1710 ″ of the drive module 1100 ″. the tactile feedback system comprises a slideable clutch 1730 ″, a rotatable drive ring 1750 ″, and an eccentric, or offset, mass 1770 ″ mounted to the drive ring 1750 ″. the clutch 1730 ″ is slideable between an unactuated position ( fig. 56 ) and an actuated position ( fig. 57 ) along the drive shaft 1710 ″. the drive shaft 1710 ″ comprises one or more slots 1740 ″ defined therein which are configured to constrain the movement of the slideable clutch 1730 ″ relative to the drive shaft 1710 ″ such that the clutch 1730 ″ translates longitudinally relative to the drive shaft 1710 ″ but also rotates with the drive shaft 1710 ″. the frame shaft 1510 ″ of the handle frame 1500 ″ comprises an electromagnet 1530 ″ embedded therein which is configured to emit a first electromagnetic field to slide the clutch 1730 ″ toward its actuated position, as illustrated in fig. 57 , and a second, or opposite, electromagnetic field to slide the clutch 1730 ″ toward its unactuated position, as illustrated in fig. 56 . the clutch 1730 ″ is comprised of a permanent magnet and/or a magnetic material such as iron and/or nickel, for example. the electromagnet 1530 ″ is controlled by the control system 1800 to apply a first voltage polarity to a circuit including the electromagnet 1530 ″ to create the first electromagnetic field and a second, or opposite, voltage polarity to the circuit to create the second electromagnetic field. when the clutch 1730 ″ is in its unactuated position, as illustrated in fig. 56 , the clutch 1730 ″ is not operably engaged with the drive ring 1750 ″. in such instances, the clutch 1730 ″ rotates with the drive shaft 1710 ″, but rotates relative to the drive ring 1750 ″. stated another way, the drive ring 1750 ″ is stationary when the clutch 1730 ″ is in its unactuated position. when the clutch 1730 ″ is in its actuated position, as illustrated in fig. 57 , the clutch 1730 ″ is operably engaged with an angled face 1760 ″ of the drive ring 1750 ″ such that the rotation of the drive shaft 1710 ″ is transmitted to the drive ring 1750 ″ via the clutch 1730 ″ when the drive shaft 1710 ″ is rotated. the eccentric, or offset, mass 1770 ″ is mounted to the drive ring 1750 ″ such that the eccentric mass 1770 ″ rotates with the drive ring 1750 ″. in at least one instance, the eccentric mass 1770 ″ is integrally-formed with the drive ring 1750 ″. when the drive ring 1750 ″ and eccentric mass 1770 ″ rotate with the drive shaft 1710 ″, the eccentric mass 1770 ″ creates a vibration that can be felt by the clinician through the drive module 1100 ″ and/or the power modules assembled thereto. this vibration confirms to the clinician that the drive shaft 1710 ″ is rotating. in at least one instance, the control system 1800 energizes the electromagnet 1530 ″ when one of the clutches of the clutch system 6000 is energized. in such instances, the vibration can confirm to the clinician that the drive shaft 1710 ″ is rotating and that one of the clutches in the clutch system 6000 is engaged with the drive shaft 1710 ″. in at least one instance, the clutch 1730 ″ can be actuated when the jaw assembly 7100 , for example, has reached or is reaching its closed position such that the clinician knows that the tissue has been clamped within the jaw assembly 7100 and that the surgical instrument can be used to manipulate the tissue. the above being said, the tactile feedback system, and/or any other feedback system, of the drive module 1100 ″ can be used to provide tactile feedback when appropriate. as surgical techniques continue to advance and develop, there is a need for specialized surgical instruments. with the advent of 3-d printing and additive manufacturing, new methods and techniques have been developed to produce specialized surgical instruments. customized surgical instruments can allow a technician or surgeon to produce and use surgical instruments that are customized to a patient's physiological conditions or for a specific surgical procedure. out of an abundance of caution, many surgical instruments have become one-use devices to prevent the spread of contamination or diseases between patients. as surgical devices are becoming single patient and single-use devices, customizing the devices for the specific patient can allow for better results and faster recovery time for patients. as recovery time for patients is a substantial cost to the healthcare system, having customized surgical devices that allow surgeons to specifically target and resolve a patient's ailment can greatly reduce the overall healthcare spend. surgical instruments, such as surgical dissectors have been in widespread use in various surgical procedures. these instruments allow a surgeon to manipulate, separate, and remove specific areas of tissue of a patient. having the ability to develop custom dissectors for specific surgical procedures and for a patient's physiological conditions can be of great value. as different surgical procedures and patient conditions require different surgical instruments, the present disclosure relates to customized surgical devices, methods of producing customized devices, and means for producing customized surgical devices using various techniques, such as additive manufacturing and/or 3-d printing, for example. in developing customized surgical devices, a surgeon can determine the specifics of the required device based upon the specific procedure, the general size of the patient, i.e., a child vs. an adult, or through scans and/or x-rays of the patient to determine the specific profile required for the surgical instrument. when a surgeon is customizing a surgical instrument for a specific procedure, they may consult a directory of predefined surgical instrument shapes and configurations to determine which device may best suit the procedure at hand. such procedures for the production of ultrasonic blades are discussed in u.s. patent application publication no. 2018/0014844 a1 to conlon, titled ultrasonic surgical instrument with as hoc formed blade, the disclosure of which is incorporated by reference in its entirety. once the surgeon determines the desired device characteristics, the surgeon may take a base device, such as a end effector connector having a core or stub and use an additive manufacturing process to produce the selected end effector configuration. in addition, or in the alternative, a surgeon may use the size of a patient to determine the required size of the surgical instrument. the surgeon may use various physiological standards, such as the size of the patients hand, tibia, abdomen, or other physiological marker that can provide an adequate representation of the desired size of the surgical instrument. in addition, or in the alternative, the surgeon may conduct scans or x-rays of the patient to determine the specific size, shape, and characteristic of the surgical device needed to perform a desired procedure. fig. 58 illustrates a surgical end effector 100000 having a standard connection portion 100050 and a customizable end effector portion 100060 . the standard connection portion 100050 includes a first jaw portion 100006 and a second jaw portion 100008 . the first jaw portion 100006 and the second jaw portion 100008 are rotatable about a joint 100004 . the standard connection portion 100050 of the surgical end effector 100000 can be connected to a shaft of a surgical instrument. the shaft of the surgical instrument can have a diameter d. the customizable end effector portion 100060 can be customized within the customization region 100002 , such that the diameter of the customization region 100002 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100060 being confined to the bounds of the customization region 100002 , the surgical end effector 100000 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the first jaw portion 100006 of the end effector portion 100060 includes a core/stub portion 100010 that is adaptable through additive manufacturing techniques. the core/stub portion 100010 provides a base for building and customizing the geometry and characteristics of a customizable jaw 100012 . depending on various needs for the surgical procedure, the customizable jaw 100012 can be modified and adapted to meet the needs of the surgeon. in certain embodiments, the surgical end effector 100000 can comprise a solid customizable region 100002 . the solid customizable region 100002 can be made of various materials such as various metals and/or plastics, for example. when the surgeon determines the configuration required for the surgical procedure, the surgeon can use a manufacturing technique to remove the excess material to leave the desired shape of the customizable jaw 100012 . in the alternative, the surgeon may start with a surgical end effector 100000 that does not have a core/stub portion 100100 and, instead, only has a standard connector portion 100050 . with just the standard connector portion 100050 , the surgeon can use a manufacturing process to create the desired shape and features of the customized jaw 100012 within the bounds of the customization region 100002 . in another embodiment, a surgical instrument may have a surgical end effector 100100 , as illustrated in fig. 59 . the surgical end effector 100100 has a standard connection portion 100150 and a customizable end effector portion 100160 . the standard connection portion 100150 includes a first jaw portion 100106 and a second jaw portion 100108 . the first jaw portion 100106 and the second jaw portion 100108 are rotatable about a joint 100104 . the standard connection portion 100150 of the surgical end effector 100100 can be connected to a shaft of a surgical instrument. the shaft of the surgical instrument can have a diameter d. the customizable end effector portion 100160 can be customized within the customization region 100102 such that the diameter of the customization region 100102 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100160 being confined to the bounds of the customization region 100102 , the surgical end effector 100100 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the first jaw portion 100106 of the end effector portion 100160 includes a core/stub portion 100110 that is adaptable through additive manufacturing techniques. the core/stub portion 100110 provides a base for building and customizing the geometry and characteristics of a first customizable jaw 100112 and a second customizable jaw 100114 . depending on various needs for the surgical procedure, the first customizable jaw 100112 and the second customizable jaw 100114 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100112 and the second customizable jaw 100114 have a plurality of proximal features 100118 and a plurality of distal features 100116 . as illustrated in fig. 59 , the plurality of proximal features 100118 comprises a plurality of proximal teeth. the plurality of distal features 100116 comprises a plurality of distal teeth. the proximal teeth are smaller and have a smaller height than the distal teeth. the progression of larger distal teeth to smaller proximal teeth can allow for a more aggressive hold and manipulation of tissue when using the distal portion of the first and second customizable jaws 100112 , 100114 . in various embodiments, however, the plurality of proximal and distal teeth may take various configurations based upon the needs of the surgical procedure, such as for example, a plurality of symmetrical teeth, a plurality of asymmetrical teeth, and/or a progression from large to small or small to large teeth. in certain embodiments, the surgical end effector 100100 comprises a solid customized region 100102 . the solid customizable region 100002 can be made of various materials such as various metals and/or plastics, for example. when the surgeon determines the configuration of the end effector 100100 required for the surgical procedure, the surgeon can use a manufacturing technique, such as grinding, wire edming, and/or polishing, for example, to remove the excess material to leave the desired shape of the customizable jaw 101012 . in the alternative, the surgeon may start with a surgical end effector 100100 that only has a standard connector portion 100150 . with just the standard connector portion 100150 , the surgeon can use a manufacturing process to create the desired shape and features of the customized jaw 100112 within the bounds of the customization region 100102 . fig. 60 illustrates a surgical end effector 100200 that is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100200 includes a standard connection portion 100250 and a customizable end effector portion 100260 . the standard connection portion 100250 includes a first jaw portion 100206 and a second jaw portion 100208 . the customizable end effector portion 100260 can be customized within the customization region 100202 , such that the diameter of the customization region 100202 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100260 being confined to the bounds of the customization region 100202 , the surgical end effector 100200 can be inserted through a trocar into a patient's body cavity during minimally invasive surgical procedures. the surgical end effector 100200 is illustrated as having various different customized jaw configurations 100212 a - e . the various customized jaw configurations 100212 a - e can be selected by a surgeon or clinician depending upon the type of procedure and a patient's physiological condition. the various customized jaw configurations 100212 a - e can include different shape profiles, different diameters, different geometries, and can be comprised of various materials. in one embodiment, the various customized jaw configurations 100212 a - e can be comprised of various plastics having different durometers and deformation characteristics. in another embodiment, the various customized jaw configurations 100212 a - e can comprise metallic materials and materials having a greater rigidity. in addition, or in the alternative, the various customized jaw configurations 100212 a - e can also comprise a combination of metallic and plastic materials to provide a desired characteristic to the surgical end effector 100200 . in certain embodiments, the various customized jaw configurations 100212 a - e can have a metallic core with plastic and/or metal overlaid upon the core. the various materials used in the various customized jaw configurations 100212 a - e can create end effectors meeting the needs of the surgeon, procedure, and/or patient. fig. 61 illustrates a surgical end effector 100300 that is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100300 includes a standard connection portion 100350 and a customizable end effector portion 100360 . the standard connection portion 100350 includes a first jaw portion 100306 and a second jaw portion 100308 . the first jaw portion 100306 and the second jaw portion 100308 are rotatable about a joint 100304 . the customizable end effector portion 100360 can be customized within the customization region 100302 , such that, the diameter of the customization region 100302 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100360 being confined to the bounds of the customization region 100302 , the surgical end effector 100300 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the first jaw portion 100306 of the end effector portion 100360 includes a core/stub portion 100310 that is adaptable through additive manufacturing techniques. the core/stub portion 100310 provides a base for building and customizing the geometry and characteristics of a first customizable jaw 100312 and a second customizable jaw 100314 . depending on various needs for the surgical procedure, the first customizable jaw 100312 and the second customizable jaw 100314 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100312 and the second customizable jaw 100314 have a plurality of proximal features 100318 and a plurality of distal features 100316 . as illustrated in fig. 61 , the plurality of proximal features 100318 comprises a plurality of proximal teeth. the plurality of distal features 100316 comprises a plurality of distal teeth. the plurality of proximal teeth is approximately the same height as the plurality of distal teeth. however, in various embodiments the plurality of proximal and distal teeth may take various configurations based upon the needs of the surgical procedure, for example a plurality of symmetrical teeth, a plurality of asymmetrical teeth, and/or a progression from large to small or small to large teeth. in the alternative, the surgical end effector 100300 can include a plurality of miniature, or fine, teeth 100320 . the various features 100316 , 100318 and miniature teeth 100320 can extend along the first customizable jaw 100312 and the second customizable jaw 100314 in various lengths, can have smooth profiles, and/or can have sharper profiles depending on the desired configuration of the surgical end effector 100300 . fig. 61 illustrates various different customized jaw configurations 100322 a - c . in a first embodiment, the customized jaw configuration 100322 a can comprise a curved end effector region. in a second alternative embodiment, the customized jaw configuration 100322 b can comprise a protruding outer profile that can allow the surgical end effector 100300 to function as a dissector and divide tissue when the first jaw portion 100306 and the second jaw portion 100308 are rotated about a joint 100304 between an open configuration and a closed configuration. in a third alternative embodiment, the customized jaw configuration 100322 c can comprise a longitudinal linear body. other embodiments and configurations of the surgical end effector 100300 are also possible. one constraint on the configuration of the customizable end effector portion 100360 is that it should be confined to the bounds of the customization region 100302 so that the surgical end effector 100300 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. in embodiments where the surgical end effector 100300 is being used in open surgical procedures, the customizable end effector portion 100360 can exceed the bounds of the customization region 100302 . also, embodiments are envisioned where a portion of the end effector is collapsible to permit laparoscopic end effectors to fit through a trocar. in such embodiments, the bounds of the customizable region can be larger than the diameter d of the shaft. figs. 62 and 63 illustrate a surgical end effector 100400 . the surgical end effector 100400 is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100400 includes a standard connection portion 100450 and a customizable end effector portion 100460 . the standard connection portion 100450 includes a first jaw portion 100406 and a second jaw portion 100408 . the first jaw portion 100406 and the second jaw portion 100408 are rotatable about a joint 100404 . the customizable end effector portion 100460 can be customized within the customization region 100402 , such that the diameter of the customization region 100402 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100460 being confined to the bounds of the customization region 100402 , the surgical end effector 100400 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the first jaw portion 100406 of the end effector portion 100460 includes a core/stub portion 100410 that is adaptable through additive manufacturing techniques. the core/stub portion 100410 provides a base for building and customizing the geometry and characteristics of a first customizable jaw 100412 and a second customizable jaw 100414 . depending on various needs for the surgical procedure, the first customizable jaw 100412 and the second customizable jaw 100414 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100412 and the second customizable jaw 100414 have a plurality of proximal features 100418 and a plurality of distal features 100416 . as illustrated in fig. 63 , the plurality of proximal features 100418 comprises a plurality of proximal teeth. the plurality of distal features 100416 comprises a plurality of distal teeth. the plurality of proximal teeth is approximately the same height as the plurality of distal teeth. however, in various embodiments, the plurality of proximal and distal teeth may take various configurations based upon the needs of the surgical procedure such as, for example, a plurality of symmetrical teeth, a plurality of asymmetrical teeth, and/or a progression from large to small or small to large teeth. in addition, the first customizable jaw 100412 and the second customizable jaw 100414 have a plurality of features 100430 and 100432 , respectively, that are positioned on the outer portion of the first and second customizable jaws 100412 , 100414 . as illustrated in fig. 63 , the features 100430 , 100432 can include ridges, or teeth, that allow the surgical end effector 100400 to engage, grasp, and/or manipulate tissue. when selecting the configuration and various features for the surgical end effector 100400 , the external features 100430 , 100432 , the proximal features 100418 , the distal features 100416 , the overall geometric shape of the first and second customizable jaws 100412 , 100414 , and the materials used in producing the customizable end effector portion 100460 are independent variables that are considered during the customization process. for example, when the surgical end effector 100400 is being customized for a minimally invasive surgical procedure, the various independent variables must result in an overall profile that falls within the customization region 100402 so that the surgical end effector 100400 can be inserted through a trocar and into a patient's body cavity. figs. 64-67 illustrate surgical end effectors having various features and profiles. fig. 64 illustrates a surgical end effector 100500 that is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100500 includes a standard connection portion 100550 and a customizable end effector portion 100560 . the standard connection portion 100550 can include a first jaw portion 100506 and a second jaw portion 100508 . the first jaw portion 100506 and the second jaw portion 100508 are rotatable about a joint 100504 . the customizable end effector portion 100560 can be customized within a customization region 100502 , such that the diameter of the customization region 100502 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100560 being confined to the bounds of the customization region 100502 , the surgical end effector 100500 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the customizable end effector portion 100560 can be produced through various additive manufacturing techniques to produce custom geometry and characteristics of a first customizable jaw 100512 and a second customizable jaw 100514 . depending on various needs for the surgical procedure, the first customizable jaw 100512 and the second customizable jaw 100514 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100512 and the second customizable jaw 100514 have a plurality of proximal features 100518 and a plurality of distal features 100516 . as illustrated in fig. 64 , the plurality of proximal features 100518 comprises a plurality of small symmetrical proximal teeth. the plurality of distal features 100516 comprises a plurality of small symmetrical distal teeth. the plurality of proximal teeth is approximately the same height as the plurality of distal teeth and are continuous along the inner surfaces of the first customizable jaw 100512 and the second customizable jaw 100514 . in addition, the first customizable jaw 100512 and the second customizable jaw 100514 comprise external surface features 100530 , 100532 , respectively. as illustrated in fig. 64 , the external surface features 100530 , 100532 comprise substantially smooth surfaces. however, in alternative embodiments, the external surface features 100530 , 100532 may comprise teeth, nubs and/or other protrusions to assist with the tissue interaction of the surgical end effector 100500 . fig. 65 illustrates surgical end effector 100600 that is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100600 includes a standard connection portion 100650 and a customizable end effector portion 100660 . the standard connection portion 100650 can include a first jaw portion 100606 and a second jaw portion 100608 . the first jaw portion 100606 and the second jaw portion 100608 are rotatable about a joint 100604 . the customizable end effector portion 100660 can be customized within a customization region 100602 , such that the diameter of the customization region 100602 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100660 being confined to the bounds of the customization region 100602 , the surgical end effector 100600 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the customizable end effector portion 100660 can be produced through various additive manufacturing techniques to produce custom geometry and characteristics of a first customizable jaw 100612 and a second customizable jaw 100614 . depending on various needs for the surgical procedure, the first customizable jaw 100612 and the second customizable jaw 100614 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100612 and the second customizable jaw 100614 have a plurality of proximal features 100618 and a plurality of distal features 100616 . as illustrated in fig. 65 , the plurality of proximal features 100618 comprises a substantially smooth surface. the plurality of distal features 100616 comprises a plurality of large distal teeth. the plurality of large distal teeth is only formed on a portion of the inner surfaces of the first customizable jaw 100612 and the second customizable jaw 100614 . in addition, the first customizable jaw 100612 and the second customizable jaw 100614 comprise external surface features 100630 , 100632 , respectively. as illustrated in fig. 65 , the external surface features 100630 , 100632 comprise substantially smooth surfaces. however, in alternative embodiments, the external surface features 100630 , 100632 may comprise teeth, nubs, and/or other protrusions to assist with the tissue interaction of the surgical end effector 100600 . fig. 66 illustrates a surgical end effector 100700 that is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100700 includes a standard connection portion 100750 and a customizable end effector portion 100760 . the standard connection portion 100750 includes a first jaw portion 100706 and a second jaw portion 100708 . the first jaw portion 100706 and the second jaw portion 100708 are rotatable about a joint 100704 . the customizable end effector portion 100760 can be customized within a customization region 100702 . the diameter of the customization region 100702 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100760 being confined to the bounds of the customization region 100702 , the surgical end effector 100700 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the customizable end effector portion 100760 can be produced through various additive manufacturing techniques to produce custom geometry and characteristics of a first customizable jaw 100712 and a second customizable jaw 100714 . depending on various requirements for the surgical procedure, the first customizable jaw 100712 and the second customizable jaw 100714 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100712 and the second customizable jaw 100714 have a plurality of proximal features 100718 and a plurality of distal features 100716 . as illustrated in fig. 66 , the plurality of proximal features 100718 comprises a substantially smooth surface. the plurality of distal features 100716 comprises a plurality of smooth distal teeth. the plurality of smooth distal teeth is only formed on a portion of the inner surfaces of the first customizable jaw 100712 and the second customizable jaw 100714 . in addition, the first customizable jaw 100712 and the second customizable jaw 100714 comprise external surface features 100730 , 100732 , respectively. as illustrated in fig. 66 , the external surface features 100730 , 100732 comprise substantially smooth surfaces. however, in alternative embodiments, the external surface features 100730 , 100732 may comprise teeth, nubs, and/or other protrusions to assist with the tissue interaction of the surgical end effector 100700 . fig. 67 illustrates a surgical end effector 100800 that is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100800 includes a standard connection portion 100850 and a customizable end effector portion 100860 . the standard connection portion 100850 can include a first jaw portion 100806 and a second jaw portion 100808 . the first jaw portion 100806 and the second jaw portion 100808 are rotatable about a joint 100804 . the customizable end effector portion 100860 can be customized within a customization region 100802 , such that the diameter of the customization region 100802 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100860 being confined to the bounds of the customization region 100802 , the surgical end effector 100800 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the customizable end effector portion 100860 can be produced through various additive manufacturing techniques to produce custom geometry and characteristics of a first customizable jaw 100812 and a second customizable jaw 100814 . depending on various requirements for the surgical procedure, the first customizable jaw 100812 and the second customizable jaw 100814 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100812 and the second customizable jaw 100814 have a plurality of proximal features 100818 and a plurality of distal features 100816 . as illustrated in fig. 67 , the plurality of proximal features 100818 comprises a substantially smooth surface. the plurality of distal features 100816 comprises a substantially smooth surface of low durometer material. the low durometer material allows the inner surfaces of the first customizable jaw 100812 and the second customizable jaw 100814 to grasp and manipulate an object, such as a patient's tissue. the substantially smooth surface of low durometer material is only formed on a portion of the inner surfaces of the first customizable jaw 100812 and the second customizable jaw 100814 . the substantially smooth surface can refer to a surface, for example, that is substantially free from projections or unevenness, generally flat or unruffled, and/or substantially of uniform consistency. in addition, the first customizable jaw 100812 and the second customizable jaw 100814 comprise external surface features 100830 , 100832 , respectively. as illustrated in fig. 67 , the external surface features 100830 , 100832 comprise substantially smooth surfaces. however, in alternative embodiments, the external surface features 100830 , 100832 may comprise teeth, nubs, and/or other protrusions to assist with the tissue interaction of the surgical end effector 100800 . figs. 68 and 69 illustrate another embodiment of a surgical end effector 100900 . the surgical end effector 100900 is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 100900 includes a standard connection portion 100950 and a customizable end effector portion 100960 . the standard connection portion 100950 can include a first jaw portion 100906 and a second jaw portion 100908 . the first jaw portion 100906 and the second jaw portion 100908 are rotatable about a joint 100904 . the customizable end effector portion 100960 can be customized within the customization region 100902 . the diameter of the customization region 100902 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 100960 being confined to the bounds of the customization region 100902 , the surgical end effector 100900 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the surgical end effector 100900 includes a core/stub portion 100910 that is adaptable through additive manufacturing techniques. the core/stub portion 100910 provides a base for building and customizing the geometry and characteristics of a first customizable jaw 100912 and a second customizable jaw 100914 . depending on various needs for the surgical procedure, the first customizable jaw 100912 and the second customizable jaw 100914 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 100912 and the second customizable jaw 100914 have a plurality of proximal features 100918 and a plurality of distal features 100916 . as illustrated in fig. 69 , the plurality of proximal features 100918 comprises a plurality of proximal teeth. the plurality of distal features 100916 comprises a plurality of distal teeth. the plurality of proximal teeth is approximately the same height as the plurality of distal teeth. however, in various embodiments the plurality of proximal and distal teeth may take various configurations based upon the needs of the surgical procedure, for example a plurality of symmetrical teeth, a plurality of asymmetrical teeth, and/or a progression from large to small or small to large teeth. in addition, the first customizable jaw 100912 and the second customizable jaw 100914 have a plurality of features 100930 and 100932 , respectively that are positioned on the outer portion of the first and second customizable jaws 100912 , 100914 . as illustrated in fig. 69 , the features 100930 , 100932 can include ridges, and/or substantially smooth surfaces that allow the surgical end effector 100900 to engage, grasp, and/or manipulate an object, for example a patient's tissue. fig. 68 depicts a top plan view of the surgical end effector 100900 . fig. 69 depicts a side elevation view of the surgical end effector 100900 . the overall geometric shape of the surgical end effector 100900 is a curved configuration. from the depictions of the surgical end effector 100900 in figs. 68 and 69 , it will be apparent to a person of ordinary skill in the art that the overall profile of the surgical end effector 100900 has a three dimensional curved geometry. when selecting the configuration and various features for the surgical end effector 100900 , the external features 100930 , 100932 , the proximal features 100918 , the distal features 100916 , the overall geometric shape of the first and second customizable jaws 100912 , 100914 , and the materials used in producing the customizable end effector portion 100960 are independent variables that are considered during the customization process. for example, when the surgical end effector 100900 is being customized for a minimally invasive surgical procedure, the various independent variables must produce an overall profile of the surgical instrument that falls within the customization region 100902 so that the surgical end effector 100900 can be inserted through a trocar and into a patient's body cavity. figs. 70 and 71 illustrate another embodiment of a surgical end effector 101000 . the surgical end effector 101000 is configured to be modified and adjusted using various manufacturing techniques at the discretion of a surgeon. the surgical end effector 101000 includes a standard connection portion 101050 and a customizable end effector portion 101060 . the standard connection portion 101050 can include a first jaw portion 101006 and a second jaw portion 101008 . the first jaw portion 101006 and the second jaw portion 101008 are rotatable about a joint 101004 . the customizable end effector portion 101060 can be customized within the customization region 101002 . the diameter of the customization region 101002 is equal to or less than the diameter d of the shaft of the surgical instrument. with the customizable end effector portion 101060 being confined to the bounds of the customization region 101002 , the surgical end effector 101000 can be inserted through a trocar into a patient's body cavity through minimally invasive surgical procedures. the surgical end effector 101000 includes a core/stub portion 101010 that is adaptable through additive manufacturing techniques. the core/stub portion 101010 provides a base for building and customizing the geometry and characteristics of a first customizable jaw 101012 and a second customizable jaw 101014 . depending on various needs for the surgical procedure, the first customizable jaw 101012 and the second customizable jaw 101014 can be modified and adapted to meet the needs of the surgeon. the first customizable jaw 101012 and the second customizable jaw 101014 have a plurality of proximal features 101018 and a plurality of distal features 101016 . as illustrated in fig. 71 , the plurality of proximal features 101018 comprises a plurality of proximal teeth. the plurality of distal features 101016 comprises a plurality of distal teeth. the plurality of proximal teeth is approximately the same height as the plurality of distal teeth. however, in various embodiments the plurality of proximal and distal teeth may take various configurations based upon the needs of the surgical procedure such as, for example, a plurality of symmetrical teeth, a plurality of asymmetrical teeth, and/or a progression from large to small or small to large teeth. in addition, the first customizable jaw 101012 and the second customizable jaw 101014 have a plurality of features 101030 a - d and 101032 a - d , respectively that are positioned on the outer portion of the first and second customizable jaws 101012 , 101014 . as illustrated in fig. 71 , the features 101030 a and 101032 a comprise distal concave features. the features 101030 a and 101032 a can have a low durometer surface that is sticky to the touch and can be used to manipulate an object, such as tissue. in at least one instance, the low-durometer features 101030 a and 101032 a have a durometer between about 15 and about 70 shore 00, for example. in certain instances, the low-durometer features 101030 a and 101032 a have a durometer between about 15 and about 70 shore a, for example. the features 101030 b and 101032 b comprise convex protruding features. the features 101030 b and 101032 b can have a low durometer surface that is sticky to the touch and can be used to manipulate an object, such as tissue. in at least one instance, the low-durometer features 101030 b and 101032 b have a durometer between about 15 and about 70 shore 00, for example. in certain instances, the low-durometer features 101030 b and 101032 b have a durometer between about 15 and about 70 shore a, for example. the features 101030 c and 101032 c comprise concave features. the features 101030 c and 101032 c can have a low durometer surface that is sticky to the touch and can be used to manipulate an object, such as tissue. the features 101030 d and 101032 d comprise a substantially smooth surface. the features 101030 d and 101032 d can have a low durometer surface that is sticky to the touch and can be used to manipulate an object, such as tissue. in addition, or in the alternative, various additional configurations for the features 101030 a - d and 101032 a - d are possible. the feature 101030 a - d and 101032 a - d can include ridges, and/or substantially smooth surfaces that allow the surgical end effector 101000 to engage, grasp, and/or manipulate an object, for example a patient's tissue. fig. 70 depicts a top plan view of the surgical end effector 101000 . fig. 71 depicts a side elevation view of the surgical end effector 101000 . the overall geometric shape of the surgical end effector 101000 is a substantially linear configuration. when selecting the configuration and various features for the surgical end effector 101000 , the external features 101030 a - d , 101032 a - d , the proximal features 101018 , the distal features 101016 , the overall geometric shape of the first and second customizable jaws 101012 , 101014 , and the materials used in producing the customizable end effector portion 101060 are independent variables that are considered during the customization process. for example, when the surgical end effector 101000 is being customized for a minimally invasive surgical procedure, the various independent variables must produce an overall profile that falls within the customization region 101002 so that the surgical end effector 101000 can be inserted through a trocar and into a patient's body cavity. the various end effectors described above with respect to figs. 58-71 can be produced through a multi-step process where a first portion of the end effector, such as, a standard connection portion, for example, is produced in a manufacturing facility and shipped to hospitals or distributed to manufacturing hubs. once the standard connection portion is at its end location, such as a hospital, or at a manufacturing facility, the standard connection portion can be customized to produce an end effector meeting the needs of the user. such customization can allow surgical end effectors to be produced for specific procedures and/or specific patients. the customized end effectors described above with respect to figs. 58-71 can be produced through various techniques. a clinician can access, for example, a dedicated human-machine interface to select and design the desired attributes of an end effector. the human-machine interface can comprise, for example, a graphical user interface of a computer. the computer can be connected to a manufacturing device. the computer-manufacturing device interface can be wired, wireless, and/or remote, for example, via the internet. when the clinician accesses the human-machine interface, they can select the various attributes desired of the end effector. when selecting the various attributes of the end effector, the clinician can use information gained from the patient or information about the particular procedure to guide their design of the end effector. when the clinician is using information regarding a particular patient, for example, the patient's information can come from various patient tests, such as mris, x-rays, ct scans, and/or other medical tests. these testing results can be entered into the computer and used to control the design parameters of the end effector. when the clinician uses the results of an mri, for example, to detect a patient's tumor, the size and shape of the patient's tumor can be used as design parameters when producing the customized end effector. in addition, or in the alternative, the clinician can use parameters from the particular surgical procedure to design the customized end effector. when the end effector is being designed for various bariatric procedures, for example, the requirements of the specific procedure, such as the size of a gastric bypass reduction, can be used as the design parameters when producing the customized end effector. in selecting the various features for the end effector, the clinician can use various software programs to design the desired features of the end effector. the clinician, for example, can input the patient's scans and/or medical test information into the computer and a software program can determine the design features of the end effector to match the patient's condition. once the software program approximates the necessary features of the end effector, the clinician can review and/or modify the parameters of the end effector using the human-machine interface. in addition, or in the alternative, the clinician can access a software program using the human-machine interface to design the features of the end effector. the clinician, for example, can access the software program and select various predetermined shapes, features, and/or designs to combine to produce an end effector having the desired features. the clinician may also use a free-form command in the software to freely design the desired features of the end effector. once the features of the customized end effector are determined, the clinician and/or manufacturing staff can insert a core/stub portion into a manufacturing device. the manufacturing device is in communication with the human-machine interface of the computer via a wired, wireless, and/or remote internet connection. the clinician, using the software program, can send the design parameters to the manufacturing device to produce the end effector. the manufacturing device can be designed to use various manufacturing processes or techniques. the manufacturing device, for example, can be a metal injection molding device, a plastic injection molding device, a cnc machine, an edm device, a 3-d printing device, and/or various other manufacturing devices, such as additive manufacturing devices. after the design parameters are transferred from the computer to the manufacturing device, the software controlling the manufacturing device causes the manufacturing device to perform a manufacturing procedure to produce the customized end effector. the manufacture procedure can add material to the core/stub portion of the end effector. in the alternative, the manufacturing procedure can remove material from the core/stub portion of the end effector. the manufacturing device can use one or more of the techniques described above in the production of the customized end effector. once the manufacturing device has completed the overall design and structure of the customized end effector, the customized end effector can be finished or polished using a finishing machine and/or process. the finishing machine may be part of the manufacturing device, or it can be a separate machine/device. once the structure of the customized end effector is completed, the customized end effector can be tested, cleaned, and/or sterilized. the testing process can ensure that the customized end effector is designed to the necessary standards for the particular medical device. the cleaning process can remove any excess residual material leftover from the manufacturing process. the sterilization process can sterilize the end effector so that it can be used in a surgical procedure. after the customized end effector is sterilized, it can be packaged for storing until it is needed in a surgical procedure or can be used directly by a clinician in a surgical procedure. a method for producing a customized end effector comprises preparing an end effector connection portion for customization. the end effector connection portion comprises a proximal connector configured to attach to a distal end of a surgical instrument. the proximal connector comprises an actuator. once a standard connection portion is prepared, the user determines through interaction with a patient a first desired characteristic of the surgical end effector and a second desired characteristic of the end effector. once the characteristics of the end effector are determined, a first jaw member is created on the standard connection portion having the first desired characteristic. next, a second jaw member is created on the standard connection portion having the second desired characteristic. the first and second jaw members can be created through an additive manufacturing process, such as 3-d printing. surgical instruments can comprise devices that use mechanical energy to perform surgical procedures. certain end effectors, such as grasping forceps can be used to grasp a target, such as the tissue of a patient, for example. other end effectors, such as dissectors, for example, can be used to separate and/or tear the tissue using mechanical forces. other types of end effectors, such as electrosurgical end effectors, for example, can use electrosurgical energy to deliver energy to the tissue of a patient and destroy and/or remove targeted tissue. these types of surgical instruments have been used independently of one another. surgical dissectors, such as the dissectors disclosed in u.s. patent application publication no. 2010/0198248, entitled surgical dissector, the disclosure of which is incorporated by reference in its entirety, for example, use mechanical forces and mechanical features on the jaws of the dissector, such as teeth, for example, to manipulate a patient's tissue. the teeth can be used to stretch and/or tear a patient's tissue. depending on the type and/or amount of tissue that a mechanical dissector encounters, the mechanical dissector can apply various amounts of mechanical force to the tissue. surgical dissectors comprise a pair of jaws that are rotatable between open and closed positions. each jaw can comprise a plurality of features, such as teeth or ridges that can engage a patient's tissue on inner and/or outer surfaces of the jaw, for example. the features, such as teeth, on the inner surfaces of a pair of surgical dissector jaws can be used to gasp and/or manipulate tissue when the jaws are closed upon a portion of the patient's tissue. in addition, or in the alternative, when a pair of surgical dissector jaws comprise teeth and/or ridges on outer surfaces thereof, such teeth can increase the traction and interaction between the jaws and the patient's tissue when the jaws are moved into an open position, for example. as the pair of surgical dissector jaws are opened, the teeth on the outer surfaces of the jaws can grip, stretch, and/or tear the tissue. electrosurgical devices for applying electrical energy to tissue in order to treat and/or destroy the tissue are finding increasingly widespread applications in surgical procedures. an electrosurgical device typically includes a handpiece and an instrument having a distally-mounted end effector (e.g., one or more electrodes). the end effector can be positioned against the tissue such that electrical current is introduced into the tissue. electrosurgical devices can be configured for bipolar and/or monopolar operation. during bipolar operation, current is introduced into and returned from the tissue by active and return electrodes, respectively, of the end effector. during monopolar operation, current is introduced into the tissue by an active electrode of the end effector and returned through a return electrode (e.g., a grounding pad) separately located on a patient's body. heat generated by the current flowing through the tissue may form hemostatic seals within the tissue and/or between tissues and thus may be particularly useful for sealing blood vessels, for example. in some instances, the voltage and current used ablates the tissue. the end effector of an electrosurgical device also may include a cutting member that is movable relative to the tissue and the electrodes to transect the tissue. electrical energy applied by an electrosurgical device can be transmitted to the instrument by a generator in communication with the handpiece. the electrical energy may be in the form of radio frequency (rf) energy that may be in a frequency range described in en 60601-2-2:2009+a11:2011, definition 201.3.218-high frequency, the entire disclosure of which is incorporated by reference. in certain instances, the frequencies in monopolar rf applications are typically restricted to less than 5 mhz, for example. however, in bipolar rf applications, the frequency can be any suitable frequency. frequencies above 200 khz can be typically used for monopolar applications in order to avoid the unwanted stimulation of nerves and muscles which would result from the use of low frequency current, for instance. lower frequencies may be used for bipolar techniques if the risk analysis shows the possibility of neuromuscular stimulation has been mitigated to an acceptable level. normally, frequencies above 5 mhz are not used in order to minimize the problems associated with high frequency leakage currents. however, higher frequencies may be used in the case of bipolar techniques. in many instances, a minimum of 10 ma is needed to create thermal effects within the tissue. in application, an electrosurgical device can transmit low frequency rf energy through tissue, which causes ionic agitation, or friction—in effect resistive heating—thereby increasing the temperature of the affected tissue. because a sharp boundary is created between the affected tissue and the surrounding tissue, a surgeon can operate with a high level of precision and control without sacrificing un-targeted adjacent tissue. the low operating temperatures of rf energy is useful for removing, shrinking, and/or sculpting soft tissue while simultaneously sealing blood vessels. rf energy works particularly well on connective tissue, which is primarily comprised of collagen and shrinks when contacted by heat. other electrical surgical instruments include, without limitation, irreversible and/or reversible electroporation, and/or microwave technologies, among others. the techniques disclosed herein are applicable to ultrasonic, bipolar or monopolar rf (electrosurgical), irreversible and/or reversible electroporation, and/or microwave-based surgical instruments, among others. u.s. patent application publication no. 2017/0086914 a1, to wiener, et al., titled techniques for operating generator for digitally generating electrical signal waveforms and surgical instruments provides examples of electrosurgical instruments and electrosurgical generators that can be used with the instruments described herein, the disclosure of which is incorporated by reference in its entirety. figs. 72-79 illustrate surgical instruments that comprise the mechanical features of surgical dissectors and the electrosurgical features of electrosurgical devices. the combination of surgical dissector and electrosurgical instrument can allow the surgical instruments illustrated in figs. 72-79 to perform various surgical procedures. in addition, the combination of the mechanical and electrosurgical features may allow a surgeon to perform a surgical procedure without having to switch between different surgical instruments. as discussed in greater detail below with respect to fig. 80 , the combination of a mechanical dissector and an electrosurgical instrument can provide synergistic effects and improve the overall efficiencies and abilities of surgical end effectors. the embodiments disclosed in figs. 72-79 illustrate various end effector jaws comprising mechanical dissector features and electrosurgical device features. these end effector jaws can be used with surgical instruments to deliver mechanical as well as electrical energy to a patient's tissue. the surgical instruments can comprise proximal and distal end effector portions. the proximal portion may include a user interface, such as a handle portion and/or a connector that can connect the surgical instrument to a robotic system, for example. the distal portion of the surgical instruments can comprise a surgical end effector. the surgical end effector can comprise a pair of jaws that are rotatable between open and closed positions. the embodiments disclosed in figs. 72-79 illustrate an end effector jaw that can be used in a pair of jaws of a surgical end effector. figs. 72-75 illustrate a surgical end effector jaw 101100 comprising a frame 101102 , a metallic core 101130 , and a covering 101126 . the end effector jaw 101100 comprises an inner surface 101118 and an outer surface 101108 . when the end effector jaw 101100 is used in a pair of jaws of a surgical instrument, the inner surfaces 101118 of the end effector jaws 101100 are positioned adjacent one another. the outer surfaces, 101108 of the end effector jaw 101100 are positioned on opposite sides of the end effector jaw 101100 . the frame 101102 of the surgical end effector jaw 101100 comprises a socket 101104 . when the end effector jaw 101100 is used in a pair of jaws of a surgical instrument, the sockets 101104 of the two end effector jaws 101100 are aligned and a pin can be inserted through the sockets 101104 . the pair of end effector jaws 101100 can be rotated about the pin between open and closed positions. the surgical instrument can also comprise an actuator that can move the end effector jaws 101100 between open and closed positions. the surgical end effector jaw 101100 comprises a proximal portion 101106 and a distal portion 101110 . the overall geometry of the end effector jaw 101100 is curved between the proximal portion 101106 and the distal portion 101110 . in addition, the end effector jaw 101100 is tapered from the wider proximal portion 101106 to the narrower distal portion 101110 . the tapered profile of the end effector jaw 101100 can permit a surgeon to target a specific location within a patient. in addition, or in the alternative, the surgical end effector jaw 101100 can comprise other geometries, such as a symmetrical geometry and/or and a tapered geometry with a larger distal portion 101110 and a narrower proximal portion 101106 , for example. when the surgical end effector jaw 101100 comprises a symmetrical profile, the surgical end effector jaw 101100 can grasp a patient's tissue evenly over the entire end effector jaw 101100 . when the surgical end effector jaw 101100 comprises a tapered geometry with a larger distal portion 101110 and a narrower proximal portion 101106 , the larger distal portion 101110 can allow the surgical end effector 101100 to grasp a larger portion of the patient's tissue. the proximal portion 101106 of the outer surface 101108 comprises a substantially smooth surface. the substantially smooth surface can refer to a surface, for example, that is substantially free from projections or unevenness, generally flat or unruffled, and/or substantially of uniform consistency. the distal portion 101110 of the outer surface 101108 comprises a plurality of features. the plurality of features comprises central features 101120 , peripheral features 101122 , and lateral features 101132 , and/or any other suitable features. the central features 101120 , peripheral features 101122 , and lateral features 101132 comprise ridges, or teeth, but could comprise any suitable configuration. the central features 101120 , peripheral features 101122 , and lateral features 101132 can be comprised of various materials. the central, peripheral, and/or lateral features 101120 , 101122 , 101132 can be comprised of a first material and the outer surface 101108 of the end effector jaw 101100 can be comprised of a second material. the first material can have a greater elasticity than the second material. the second material can have a greater rigidity than the first material. with a less rigid and more elastic material, the central, peripheral, and/or lateral features 101120 , 101122 , 101132 can deform against a target, such as a patient's tissue, and increase the traction and interaction between the surgical end effector jaw 101100 and the target object. the plurality of central features 101120 can be substantially perpendicular to the chord of the arc of the jaw 101108 . the plurality of central features 101120 are raised above the outer surface of the jaw 101108 . in addition, the central features 101120 can be overlaid or overmolded with the lateral features 101132 that can be positioned along the jaw 101108 . the lateral features 101132 can be comprised of a different material having a different rigidity and elasticity. for instance, the lateral features 101132 can be more elastic and/or have greater compliance than the central features 101120 which can allow the lateral features 101132 to have a greater ability to interact with a target, such as a patient's tissue. the plurality of central features 101120 can have a slight concavity with respect to the proximal portion 101106 of the end effector jaw 101100 , for example. the plurality of peripheral features 101122 can include a convex shape with respect to the proximal portion 101106 of the end effector jaw 101100 , for example. the convex-concave-convex pattern of the peripheral-central-peripheral feature combination can allow for greater interaction with a target, such as a patient's tissue. where the central features 101120 are aligned substantially perpendicular to the chord of the arc on the surgical end effector jaw 101100 , the central features 101120 can facilitate a desired interaction with a patient's tissue. this configuration may allow the surgical end effector jaw 101100 to be drawn through the tissue plane and create a parting action of the tissue. furthermore, where the patterns of the central features 101120 at the tip of the surgical instrument are aligned with the chord of the arc of the surgical end effector jaw 101100 , this pattern facilitates the lateral movement of the surgical end effector jaw 101100 to create a tissue parting action. the central, peripheral, and lateral features 101120 , 101122 , 101132 of the end effector jaw 101100 can include symmetrical or asymmetrical patterns that extend along the end effector jaw 101100 . the patterns of the central, peripheral, and/or lateral features 101120 , 101122 , 101132 can be continuous or interlocking and become more interrupted and staggered as they extend towards the proximal portion 101106 and/or distal portion 101110 of the end effector jaw 101100 . the various configurations of the central, peripheral, and lateral features 101120 , 101122 , 101132 can result in posts or standing pillars that can enhance the interaction of these features with the target object, such as a patient's tissue. the central, peripheral, and lateral features 101120 , 101122 , 101132 can comprise overmolded plastic and/or polymers. the central, peripheral, and lateral features 101120 , 101122 , 101132 can comprise various polymers or plastics having different densities and/or properties. a first layer of plastic may be overmolded onto portions of the metallic core 101130 of the end effector jaw 101100 . the first layer of plastic can have a first density, rigidity, and elasticity. a second layer of plastic may be overmolded onto portions of the first layer of overmolded plastic and/or onto portions of the metallic core 101130 . the second layer of plastic can have a second density, rigidity, and elasticity. the first density, rigidity, and/or elasticity can be the same or different than the second density, rigidity and/or elasticity. various sections of the covering 101126 can comprise overmolded plastic and/or polymers. the various sections of the covering 101126 can comprise various polymers or plastics having different densities and/or properties. a first layer of plastics may be overmolded onto portions of the metallic core 101130 of the end effector jaw 101100 . the first layer of plastic can have a first density, rigidity, and elasticity. a second layer of plastic may be overmolded onto portions of the first layer of overmolded plastic and/or onto portions of the metallic core 101130 . the second layer of plastic can have a second density, rigidity, and elasticity. the first density, rigidity, and/or elasticity can be the same or different than the second density, rigidity and/or elasticity. in one embodiment, the first layer can comprise a rigid layer that can provide a structural support or backbone to the end effector jaw 101100 along with the metallic core 101130 . the second layer can comprise a more elastic and/or less rigid layer. the second layer can be more deformable to create a tissue interaction outer surface that allows for grasping and securing the tissue. the first layer that is more rigid can have a sharper profile and edges that can maintain its shape and actively shear tissue while the outer softer layer acts more like a bumper to prevent cutting tissue before the surgical end effector jaw 101100 is engaged with the desired location or section of tissue. the inner surface 101118 of the end effector jaw 101100 comprises a plurality of teeth 101116 that extend between the proximal portion 101106 and the distal portion 101110 of the end effector jaw 101100 . the plurality of teeth 101116 extend across the width of the inner surface 101118 and follow the tapered profile of the end effector jaw 101100 . the central portion of the plurality of teeth 101116 comprises an exposed section of the metallic core 101130 . the exposed section of the metallic core 101130 extends substantially uniformly down the central portion of the plurality of teeth 10116 between the proximal portion 101106 and the distal portion 101110 . in the alternative, the metallic core 101130 can extend to the inner surface 101118 of the end effector jaw 101100 , for example, in an asymmetrical pattern. the different exposed patterns of the metallic core 101130 can allow the end effector jaw 101100 to transmit electrosurgical energy to a patient's tissue in different ways, as described in greater detail below. when a patient's tissue comes in contact with the metallic core 101130 , a surgeon can apply electrosurgical energy to the targeted tissue through the metallic core 101130 . the electrosurgical energy can cause ablation and/or cauterization of the targeted tissue. the distal most portion of the inner surface 101118 comprises a distal bumper portion 101124 and a distal tip 101128 . the distal bumper portion 101124 comprises an elastic and/or deformable material that can allow the end effector jaw 101100 to interact with a target object with less irritation to the object. the distal tip 101128 comprises the metallic core 101130 and is configured to deliver electrosurgical energy to a target object, such as a patient's tissue. the distal bumper portion 101124 being constructed of a more elastic and less rigid material can allow the user of the surgical end effector jaw 101100 to be more aggressive without increasing the irritation of the target object, such as a patient's tissue. in addition, or in the alternative, the various polymers and/or plastics that comprise the surgical end effector jaw 101100 may comprise hydrophobic plastic or materials. the hydrophobic materials can repel liquid, such as body fluids and/or water to keep the dissection features free to dissect. in addition, by repelling fluids, the hydrophobic material may allow a user greater visibility of the interaction portions of the device when using the device in a minimally invasive procedure. the hydrophobic materials may also allow for a consistent dissection surface during the use of the surgical instrument by repelling and keeping away the fluids from the interaction site. figs. 76-78 illustrate a surgical end effector jaw 101200 comprising a frame 101202 , a metallic core 101230 , and a covering 101226 . the end effector jaw 101200 comprises an inner surface 101218 and an outer surface 101208 . when the end effector jaw 101200 is used in a pair of jaws of a surgical instrument, the inner surfaces 101218 of the end effector jaws 101200 are positioned adjacent one another. the outer surfaces 101208 of the end effector jaw 101200 are positioned on opposite sides of the end effector jaw 101200 . the frame 101202 of the surgical end effector jaw 101200 comprises a socket 101204 . when the end effector jaw 101200 is used in a pair of jaws of a surgical instrument, the sockets 101204 of the two end effector jaws 101200 are aligned and a pin can be inserted through the sockets 101204 . the pair of end effector jaws 101200 can be rotated about the pin between open and closed positions. the surgical instrument can also comprise an actuator that can move the end effector jaws 101200 between open and closed positions. the surgical end effector jaw 101200 comprises a proximal portion 101206 and a distal portion 101210 . the overall geometry of the end effector jaw 101200 is curved between the proximal portion 101206 and the distal portion 101210 . in addition, the end effector jaw 101200 is tapered from the wider proximal portion 101206 to the narrower distal portion 101210 . the tapered profile of the end effector jaw 101200 can permit a surgeon to target a specific location within a patient. in addition, or in the alternative, the surgical end effector jaw 101200 can comprise other geometries, such as a symmetrical geometry and/or and a tapered geometry with a larger distal portion 101210 and a narrower proximal portion 101206 , for example. when the surgical end effector jaw 101200 comprises a symmetrical profile, the surgical end effector jaw 101200 can grasp a patient's tissue evenly over the entire end effector jaw 101200 . when the surgical end effector jaw 101200 comprises a tapered geometry with a larger distal portion 101210 and a narrower proximal portion 101206 , the larger distal portion 101210 can allow the surgical end effector 101200 to grasp a larger portion of the patient's tissue. the proximal portion 101206 of the outer surface 101208 comprises a substantially smooth surface. the substantially smooth surface can refer to a surface, for example, that is substantially free from projections or unevenness, generally flat or unruffled, and/or substantially of uniform consistency. the distal portion 101210 of the outer surface 101208 comprises a plurality of features. the plurality of features comprises central features 101220 , peripheral features 101222 , and lateral features 101232 , and/or any other suitable features. the central features 101220 , peripheral features 101222 , and lateral features 101232 comprise recesses or through holes, but could comprise any suitable configuration. the recesses or through holes expose the metallic core 101230 to the outer surface 101208 and patient tissue. the central features 101220 , peripheral features 101122 , and lateral features 101232 can comprise different diameters and/or depths, or the same diameters and/or depths. the central features 101220 , peripheral features 101122 , and lateral features 101232 can also comprise different patterns and/or orientations along the outer surface 101208 of the surgical end effector jaw 101200 . the central features 101220 , peripheral features 101222 , and lateral features 101232 allow a patient's tissue to come in contact with the metallic core 101230 of the surgical end effector jaw 101200 . when a pair of end effector jaws 101200 is used to stretch out tissue, the mechanical forces used to stretch out the tissue can cause the tissue to flow into the central features 101220 , peripheral features 101222 , and/or lateral features 101232 . once the tissue is in contact with the metallic core 101230 within the central features 101220 , peripheral features 101222 , and/or lateral features 101232 , a clinician can apply electrosurgical energy to the tissue. the combination of mechanical force and electrosurgical energy can allow for ablation of the tissue without tearing the tissue. in addition, or in the alternative, the electrosurgical energy can allow the end effector jaws 101200 to cauterize the tissue as the tissue is spread and/or torn. the combination of electrosurgical energy and mechanical forces can allow a surgeon to perform a surgical procedure with using less mechanical force as the effects of the electrosurgical energy and mechanical force are cumulative. in various instances, less mechanical force, for example, is required to dissect tissue when more electrosurgical energy is applied. correspondingly, more mechanical force is required to dissect tissue when less electrosurgical energy is applied. that said, the ratio of mechanical force to electrosurgical energy can be held constant throughout the opening stroke of the dissector jaws. in other instances, the ratio of mechanical force to electrosurgical energy can change throughout the opening stroke of the dissector jaws. in at lease one instance, the electrosurgical energy can increase as the dissector jaws are opened. such an arrangement can apply the electrosurgical energy when tissue tearing and/or bleeding is most likely to occur. in other instances, the electrosurgical energy can decrease as the dissector jaws are opened. such an arrangement can create or start an initial otomy that then is stretched open by the mechanical force. the inner surface 101218 of the end effector jaw 101200 comprises a plurality of teeth 101216 that extend between the proximal portion 101206 and the distal portion 101210 of the end effector jaw 101200 . the plurality of teeth 101216 extend across the width of the inner surface 101218 and follow the tapered profile of the end effector jaw 101200 . the central portion of the plurality of teeth 101216 comprises an exposed section of the metallic core 101230 . the exposed section of the metallic core 101230 extends substantially uniformly down the central portion of the plurality of teeth 10126 between the proximal portion 101206 and the distal portion 101210 . in the alternative, the metallic core 101230 can extend to the inner surface 101218 of the end effector jaw 101200 , for example, in an asymmetrical pattern. the different exposed patterns of the metallic core 101230 can allow the end effector jaw 101200 to transmit electrosurgical energy to a patient's tissue in different ways, as described in greater detail below. when a patient's tissue comes in contact with the metallic core 101230 , a surgeon can apply electrosurgical energy to the targeted tissue through the metallic core 101230 . the electrosurgical energy can cause ablation and/or cauterization of the targeted tissue. the distal most portion of the inner surface 101218 comprises a distal bumper portion 101224 and a distal tip 101228 . the distal bumper portion 101224 comprises an elastic and/or deformable material that can allow the end effector jaw 101200 to interact with a target object with less irritation to the object. the distal tip 101228 comprises the metallic core 101230 and is configured to deliver electrosurgical energy to a target object, such as a patient's tissue. the distal bumper portion 101224 being constructed of a more elastic and less rigid material can allow the user of the surgical end effector jaw 101200 to be more aggressive without increasing the irritation of the target object, such as a patient's tissue. various sections of the covering 101226 can comprise overmolded plastic and/or polymers. the various sections of the covering 101226 can comprise various polymers or plastics having different densities and/or properties. a first layer of plastics may be overmolded onto portions of the metallic core 101230 of the end effector jaw 101200 . the first layer of plastic can have a first density, rigidity, and elasticity. a second layer of plastic may be overmolded onto portions of the first layer of overmolded plastic and/or onto portions of the metallic core 101230 . the second layer of plastic can have a second density, rigidity, and elasticity. the first density, rigidity, and/or elasticity can be the same or different than the second density, rigidity and/or elasticity. in addition, or in the alternative, the various polymers and/or plastics that comprise the surgical end effector jaw 101200 may comprise hydrophobic plastic or materials. the hydrophobic materials can repel liquid, such as body fluids and/or water to keep the dissection features free to dissect. in addition, by repelling fluids, the hydrophobic material may allow a user greater visibility of the interaction portions of the device when using the device in a minimally invasive procedure. the hydrophobic materials may also allow for a consistent dissection surface during the use of the surgical instrument by repelling and keeping away the fluids from the interaction site. fig. 79 illustrates an embodiment similar to the end effector 101300 , discussed above. the end effector 101300 includes a central distal feature 101336 and lateral distal features 101334 that are positioned on the distal nose of the end effector jaw 101300 . the central distal feature 101336 and lateral distal features 101334 comprise recesses or through holes. the recesses or through holes expose the metallic core 101330 to the outer surface 101308 . the central distal feature 101336 and lateral distal features 101334 can comprise different diameters and/or depths, or the same diameters and/or depths. the central distal feature 101336 and lateral distal features 101334 can also comprise different patterns and/or orientations along the outer surface 101308 of the surgical end effector jaw 101300 . the central distal feature 101336 and lateral distal features 101334 allow a patient's tissue to come in contact with the metallic core 101330 of the surgical end effector jaw 101300 . when a surgeon pushes tissue with the nose of the surgical end effector jaw 101300 , the mechanical forces used to push the jaw 101300 into the tissue to stretch out the tissue can cause the tissue to flow into the central distal feature 101336 and lateral distal features 101334 . once the tissue is in contact with the metallic core 101330 within the central distal feature 101336 and/or lateral distal features 101334 , electrosurgical energy can be transmitted to the tissue. the combination of mechanical force and electrosurgical energy can allow for ablation of the tissue without tearing the tissue. in addition, or in the alternative, the electrosurgical energy can allow the end effector jaws 101300 to cauterize the tissue as the tissue is spread and/or torn. the combination of electrosurgical energy and mechanical forces can allow a surgeon to perform a surgical procedure with using less mechanical force as the effects of the electrosurgical energy and mechanical force are cumulative. in various instances, less mechanical force, for example, is required to dissect tissue when more electrosurgical energy is applied. correspondingly, more mechanical force is required to dissect tissue when less electrosurgical energy is applied. that said, the ratio of mechanical force to electrosurgical energy can be held constant throughout the opening stroke of the dissector jaws. in other instances, the ratio of mechanical force to electrosurgical energy can change throughout the opening stroke of the dissector jaws. in at lease one instance, the electrosurgical energy can increase as the dissector jaws are opened. such an arrangement can apply the electrosurgical energy when tissue tearing and/or bleeding is most likely to occur. in other instances, the electrosurgical energy can decrease as the dissector jaws are opened. such an arrangement can create or start an initial otomy that then is stretched open by the mechanical force. the surgical end effector jaws may also have overmolded plastic bodies having fractal exterior geometries. the fractal exterior geometries can enable the distal tip of the end effector jaws to be more aggressive without creating undesired interaction with the tissue. in another embodiment, the metallic core of the end effector jaws can be positioned near the outer surface and at the distal tip as well as along the spine of the surgical end effector, as seen in figs. 76-79 . the metallic core may be exposed to the tissue through the various features and recesses along the end effector jaw's outer surface. the metallic core may be recessed within 0.0001-0.001 mm of the outer surface and in electrical contact with the shaft of the surgical instrument to permit the transmission of electrosurgical energy along the end effector jaw. with the metallic core exposed to the tissue, the metallic core can deliver electrosurgical energy to the patient's tissue. in this configuration, the surgical instrument may operate as a hybrid between a mechanical surgical dissector and an electrosurgical instrument. the various features and characteristics described with regard to the surgical instruments and end effectors illustrated in figs. 58-79 can be comprised of various materials. the end effectors illustrated in figs. 72-79 can comprise a metallic core that can deliver electrosurgical energy from an electrosurgical instrument to a patient's tissue. the various features described above can comprise overmolded plastic or polymers. the features can comprise polymers or plastics having various densities and properties. a first layer of plastics may be overmolded onto portions of the metallic core of the end effector. the first layer of plastic can have a first density, rigidity, and elasticity. a second layer of plastics may be overmolded onto portions of the first layer of overmolded plastic and/or onto portions of the metallic core. the second layer of plastic can have a second density, rigidity, and elasticity. the first density, rigidity and/or elasticity can be the same or different than the second density, rigidity and/or elasticity. in one embodiment, the first layer can comprise a rigid layer that can provide a structural support or backbone to the end effector. the second layer can comprise a more elastic and less rigid layer. the second layer can be more deformable to create a tissue interaction outer surface that allows for grasping and securing the tissue. the first layer that is more rigid can have a sharper profile and edges that can maintain its shape and actively shear tissue while the outer softer layer acts more like a bumper to prevent cutting tissue before the surgical end effector is engaged with the desired portion or section of tissue. the surgical instruments illustrated in figs. 72-79 can be produced through traditional manufacturing processes. in addition, or in the alternative, the surgical instruments illustrated in figs. 72-79 can be produced through the additive manufacturing procedures discussed above with respect to figs. 58-71 . the surgical instruments of figs. 72-79 can comprise a metallic core and the outer shape and features of the end effectors can be produced through an additive manufacturing process to produce customized surgical end effectors having desired features and/or shapes. as discussed above, with regard to figs. 72-79 , surgical end effector jaws can be used to employ a combination of electrosurgical and mechanical forces to effected tissue. fig. 80 illustrates a graphical representation 101400 of the relationship between various parameters for a surgical instrument having mechanical and electrosurgical features. the various parameters include the current delivered to the tissue 101402 , the voltage to current ratio 101404 , the impedance of the tissue being treated 101406 , and the mechanical force being applied to the tissue 101408 . the various parameters are illustrated with a reference to various aspects of a surgical procedure, such as a dissection procedure 101410 , for example. the dissection procedure 101410 includes an initial force loading condition 101412 , a tissue spreading condition 101414 , and a force unloading condition 101416 . during the initial force loading condition 101412 , the current delivered to the tissue 101402 , the voltage to current ratio 101404 , and the impedance of the tissue being treated 101406 initially increase. over the initial force loading condition 101412 , the current delivered to the tissue 101402 and the voltage to current ratio 101404 continue to increase while the impedance of the tissue being treated 101406 decreases and then levels out. the mechanical force being applied to the tissue 101408 also increases over the initial force loading condition 101412 . as the mechanical force being applied to the tissue 101408 increase, the surgical end effector jaws begin to push layers of the tissue away. once the initial force loading condition 101412 is completed, the tissue spreading condition 101414 occurs. over a first stage of the tissue spreading condition 101414 , the current delivered to the tissue 101402 and the impedance of the tissue being treated 101406 remain relatively steady while the voltage to current ratio 101404 fluctuates. in addition, over the first stage of the tissue spreading condition 101414 , the mechanical force being applied to the tissue 101408 increases and begins to exceed a higher reinforcement threshold. when the higher reinforcement threshold is exceeded, the current delivered to the tissue 101402 and the voltage to current ratio 101404 are increased to reinforce the tissue spreading, which in turn reduces the impedance of the tissue being treated 101406 . the mechanical force being applied to the tissue 101408 by the end effector jaws drop due to the assistance of the electrosurgical energy, as such, the levels for the current delivered to the tissue 101402 and the voltage to current ratio 101404 are reduced. when the mechanical force being applied to the tissue 101408 falls below a lower reinforcement threshold, the current delivered to the tissue 101402 and the voltage to current ratio 101404 are reduced as the need for reinforcement assistance from the electrosurgical aspects of the surgical instrument are reduced. once the mechanical force being applied to the tissue 101408 climbs above the lower reinforcement threshold, the current delivered to the tissue 101402 and the voltage to current ratio 101404 return to their previous levels. after the tissue spreading condition 101414 occurs, the mechanical forces and electrosurgical energy being applied are reduced as represented by the unloading condition 101416 . during the force unloading condition 101416 , the current delivered to the tissue 101402 , the voltage to current ratio 101404 , the impedance of the tissue being treated 101406 , and the mechanical force being applied to the tissue 101408 are all reduced to the initial unloaded condition. the combination of the mechanical force being applied to the tissue 101408 and electrosurgical energy allows the surgical instrument to perform the surgical procedure using less mechanical energy which can result in less tearing of the tissue. the application of the electrosurgical energy can also seal the tissue as it is being separated by the opening of the end effector jaws. to detect the various threshold levels, discussed above, a surgical instrument may have sensors to monitor the pressures, currents, voltages, impedance of the tissue, and forces applied during a surgical procedure and modify the parameters to prevent any of the threshold from being exceeded. in addition, or in the alternative, a surgeon may be provided with tactical feedback regarding the parameters and manually control the various parameters. a surgical system 128000 is illustrated in fig. 80 . the surgical system 128000 comprises a handle, a shaft 128020 extending from the handle, and an end effector 128030 extending from the shaft 128020 . in alternative embodiments, the surgical system 128000 comprises a housing configured to be mounted to a robotic surgical system. in at least one such embodiment, the shaft 128020 extends from the robotic housing mount instead of the handle. in either event, the end effector 128030 comprises jaws 128040 and 128050 which are closeable to grasp a target, such as the tissue t of a patient and/or a suture needle, for example, as discussed in greater detail below. the jaws 128040 and 128050 are also openable to dissect the tissue of a patient, for example. in at least one instance, the jaws 128040 and 128050 are insertable into the patient tissue to create an otomy therein and then spread to open the otomy, as discussed in greater detail below. referring again to fig. 80 , the jaws 128040 and 128050 are pivotably coupled to the shaft 128020 about a pivot joint 128060 . the pivot joint 128060 defines a fixed axis of rotation, although any suitable arrangement could be used. the jaw 128040 comprises a distal end, or tip, 128041 and an elongate profile which narrows from its proximal end to its distal end 128041 . similarly, the jaw 128050 comprises a distal end, or tip, 128051 and an elongate profile which narrows from its proximal end to its distal end 128051 . the distance between the tips 128041 and 128051 define the mouth width, or opening, 128032 of the end effector 128030 . when the tips 128041 and 128051 are close to one another, or in contact with one another, the mouth 128032 is small, or closed, and the mouth angle θ is small, or zero. when the tips 128041 and 128051 are far apart, the mouth 128032 is large and the mouth angle θ is large. further to the above, the jaws of the end effector 128030 are driven by a jaw drive system including an electric motor. in use, a voltage potential is applied to the electric motor to rotate the drive shaft of the electric motor and drive the jaw drive system. the surgical system 128000 comprises a motor control system configured to apply the voltage potential to the electric motor. in at least one instance, the motor control system is configured to apply a constant dc voltage potential to the electric motor. in such instances, the electric motor will run at a constant speed, or an at least substantially constant speed. in various instances, the motor control system comprises a pulse width modulation (pwm) circuit and/or a frequency modulation (fm) circuit which can apply voltage pulses to the electric motor. the pwm and/or fm circuits can control the speed of the electric motor by controlling the frequency of the voltage pulses supplied to the electric motor, the duration of the voltage pulses supplied to the electric motor, and/or the duration between the voltage pulses supplied to the electric motor. the motor control system is also configured to monitor the current drawn by the electric motor as a means for monitoring the force being applied by the jaws of the end effector 128030 . when the current being drawn by the electric motor is low, the loading force on the jaws is low. correspondingly, the loading force on the jaws is high when the current being drawn by the electric motor is high. in various instances, the voltage being applied to the electric motor is fixed, or held constant, and the motor current is permitted to fluctuate as a function of the force loading at the jaws. in certain instances, the motor control system is configured to limit the current drawn by the electric motor to limit the force that can be applied by the jaws. in at least one embodiment, the motor control system can include a current regulation circuit that holds constant, or at least substantially constant, the current drawn by the electric motor to maintain a constant loading force at the jaws. the force generated between the jaws of the end effector 128030 , and/or on the jaws of the end effector 128030 , may be different depending on the task that the jaws are being used to perform. for instance, the force needed to hold a suture needle may be high as suture needles are typically small and it is possible that a suture needle may slip during use. as such, the jaws of the end effector 128030 are often used to generate large forces when the jaws are close together. on the other hand, the jaws of the end effector 128030 are often used to apply smaller forces when the jaws are positioned further apart to perform larger, or gross, tissue manipulation, for example. referring to the upper portion 128110 of the graph 128100 illustrated in fig. 81 , the loading force, f, experienced by the jaws of the end effector 128030 can be limited by a force profile stored in the motor control system. the force limit profile 128110 o for opening the jaws 128040 and 128050 is different than the force limit profile 128110 c for closing the jaws 128040 and 128050 . this is because the procedures performed when forcing the jaws 128040 and 128050 open are typically different than the procedures performed when forcing the jaws 128040 and 128050 closed. that said, the opening and closing force limit profiles could be the same. while it is likely that the jaws 128040 and 128050 will experience some force loading regardless of whether the jaws 128050 are being opened or closed, the force limit profiles typically come into play when the jaws 128040 and 128050 are being used to perform a particular procedure within the patient. for instance, the jaws 128040 and 128050 are forced open to create and expand an otomy in the tissue of a patient, as represented by graph sections 128115 and 128116 , respectively, of graph 128100 , while the jaws 128040 and 128050 are forced closed to grasp a needle and/or the patient tissue, as represented by graph sections 128111 and 128112 , respectively, of graph 128100 . referring again to fig. 81 , the opening and closing jaw force limit profiles 128110 o and 128110 c , respectively, are depicted on the opposite sides of a zero force line depicted in the graph 128100 . as can be seen in the upper section 128110 of graph 128100 , the jaw force limit threshold is higher—for both force limit profiles 128110 o and 128110 c —when the jaws 128040 and 128050 are just being opened from their fully-closed position. as can also be seen in the upper section 128110 of graph 128100 , the jaw force limit threshold is lower—for both force limit profiles 128110 o and 128110 c —when the jaws 128040 and 128050 are reaching their fully-opened position. such an arrangement can reduce the possibility of the jaws 128040 and 128050 damaging adjacent tissue when the being fully opened, for example. in any event, the force that the jaws 128040 and 128050 are allowed to apply is a function of the mouth opening size between the jaws and/or the direction in which the jaws are being moved. for instance, when the jaws 128040 and 128050 are opened widely, or at their maximum, to grasp large objects, referring to graph section 128114 of upper graph section 128110 , the jaw force f limit is very low as compared to when the jaws 128040 and 128050 are more closed to perform gross tissue manipulation, referring to graph section 128113 of upper graph section 128110 . moreover, different jaw force limit profiles can be used for different jaw configurations. for instance, maryland dissectors, which have narrow and pointy jaws, may have a different jaw force limit profile than a grasper having blunt jaws, for example. in addition to or in lieu of the above, the speed of the jaws 128040 and 128050 can be controlled and/or limited by the motor control system as a function of the mouth opening size between the jaws 128040 and 128050 and/or the direction the jaws are being moved. referring to the middle portion 128120 and lower portion 128130 of the graph 128100 in fig. 81 , the rate limit profile for moving the jaws 128040 and 128050 permits the jaws to be moved slowly when the jaws are near their closed position and moved quickly when the jaws are near their open position. in such instances, the jaws 128040 and 128050 are accelerated as the jaws are opened. such an arrangement can provide fine control over the jaws 128040 and 128050 when they are close together to facilitate the fine dissection of tissue, for example. notably, the rate limit profile for opening and closing the jaws 128040 and 128050 is the same, but they could be different in other embodiments. in alternative embodiments, the rate limit profile for moving the jaws 128040 and 128050 permits the jaws to be moved quickly when the jaws are near their closed position and slowly when the jaws are near their open position. in such instances, the jaws 128040 and 128050 are decelerated as the jaws are opened. such an arrangement can provide fine control over the jaws 128040 and 128050 when the jaws are being used to stretch an otomy, for example. the above being said, the speed of the jaws 128040 and 128050 can be adjusted once the jaws experience loading resistance from the patient tissue, for example. in at least one such instance, the jaw opening rate and/or the jaw closing rate can be reduced once the jaws 128040 and 128050 begin to experience force resistance above a threshold, for example. in various instances, further to the above, the handle of the surgical system 128000 comprises an actuator, the motion of which tracks, or is supposed to track, the motion of the jaws 128040 and 128050 of the end effector 128030 . for instance, the actuator can comprise a scissors-grip configuration which is openable and closable to mimic the opening and closing of the end effector jaws 128040 and 128050 . the control system of the surgical system 128000 can comprise one or more sensor systems configured to monitor the state of the end effector jaws 128040 and 128050 and the state of the handle actuator and, if there is a discrepancy between the two states, the control system can take a corrective action once the discrepancy exceeds a threshold and/or threshold range. in at least one instance, the control system can provide feedback, such as audio, tactile, and/or haptic feedback, for example, to the clinician that the discrepancy exists and/or provide the degree of discrepancy to the clinician. in such instances, the clinician can make mental compensations for this discrepancy. in addition to or in lieu of the above, the control system can adapt its control program of the jaws 128040 and 128050 to match the motion of the actuator. in at least one instance, the control system can monitor the loading force being applied to the jaws and align the closed position of the actuator with the position of the jaws when the jaws experience the peak force loading condition when grasping tissue. similarly, the control system can align the open position of the actuator with the position of the jaws when the jaws experience the minimum force loading condition when grasping tissue. in various instances, the control system is configured to provide the clinician with a control to override these adjustments and allow the clinician to use their own discretion in using the surgical system 128000 in an appropriate manner. a surgical system 128700 is illustrated in figs. 82 and 83 . the surgical system 128700 comprises a handle, a shaft assembly 128720 extending from the handle, and an end effector 128730 extending from the shaft assembly 128720 . in alternative embodiments, the surgical system 128700 comprises a housing configured to be mounted to a robotic surgical system. in at least one such embodiment, the shaft 128720 extends from the robotic housing mount instead of the handle. in either event, the end effector 128730 comprises shears configured to transect the tissue of a patient. the shears comprise two jaws 128740 and 128750 configured to transect the patient tissue positioned between the jaws 128740 and 128750 as the jaws 128740 and 128750 are being closed. each of the jaws 128740 and 128750 comprises a sharp edge configured to cut the tissue and are pivotably mounted to the shaft 128720 about a pivot joint 128760 . such an arrangement can comprise bypassing scissors shears. other embodiments are envisioned in which one of the jaws 128740 and 128750 comprises a knife edge and the other comprises a mandrel against the tissue is supported and transected. such an arrangement can comprise a knife wedge in which the knife wedge is moved toward the mandrel. in at least one embodiment, the jaw comprising the knife edge is movable and the jaw comprising the mandrel is stationary. the above being said, embodiments are envisioned in which the tissue-engaging edges of one or both of the jaws 128740 and 128750 are not necessarily sharp. as discussed above, the end effector 128730 comprises two scissor jaws 128740 and 128750 movable between an open position and a closed position to cut the tissue of a patient. the jaw 128740 comprises a sharp distal end 128741 and the jaw 128750 comprises a sharp distal end 128751 which are configured to snip the tissue of the patient at the mouth 128731 of the end effector 128730 , for example. that said, other embodiments are envisioned in which the distal ends 128741 and 128751 are blunt and can be used to dissect tissue, for example. in any event, the jaws are driven by a jaw drive system including an electric drive motor, the speed of which is adjustable to adjust the closure rate and/or opening rate of the jaws. referring to the graph 128400 of fig. 84 , the control system of the surgical system is configured to monitor the loading, or shear, force on the jaws 128740 and 128750 as the jaws 128740 and 128750 are being closed and adaptively slow down the drive motor when large forces, or forces above a threshold fc, are experienced by the jaws 128740 and 128750 . such large forces often occur when the tissue t being cut by the jaws 128740 and 128750 is thick, for example. similar to the above, the control system can monitor the current drawn by the drive motor as a proxy for the loading force being experienced by the jaws 128740 and 128750 . in addition to or in lieu of this approach, the control system can be configured to measure the jaw loading force directly by one or more load cells and/or strain gauges, for example. once the loading force experienced by the jaws 128740 and 128750 drops below the force threshold fc, the control system can adaptively speed up the jaw closure rate. alternatively, the control system can maintain the lower closure rate of the jaws 128740 and 128750 even though the force threshold is no longer being exceeded. the above-provided discussion with respect to the surgical system 128700 can provide mechanical energy or a mechanical cutting force to the tissue of a patient. that said, the surgical system 128700 is also configured to provide electrosurgical energy or an electrosurgical cutting force to the tissue of a patient. in various instances, the electrosurgical energy comprises rf energy, for example; however, electrosurgical energy could be supplied to the patient tissue at any suitable frequency. in addition to or in lieu of ac power, the surgical system 128700 can be configured to supply dc power to the patient tissue. the surgical system 128700 comprises a generator in electrical communication with one or more electrical pathways defined in the instrument shaft 128720 which can supply electrical power to the jaws 128740 and 128750 and also provide a return path for the current. in at least one instance, the jaw 128740 comprises an electrode 128742 in electrical communication with a first electrical pathway in the shaft 128720 and the jaw 128750 comprises an electrode 128752 in electrical communication with a second electrical pathway in the shaft 128720 . the first and second electrical pathways are electrically insulated, or at least substantially insulated, from one another and the surrounding shaft structure such that the first and second electrical pathways, the electrodes 128742 and 128752 , and the tissue positioned between the electrodes 128742 and 128752 forms a circuit. such an arrangement provides a bipolar arrangement between the electrodes 128742 and 128752 . that said, embodiments are envisioned in which a monopolar arrangement could be used. in such an arrangement, the return path for the current goes through the patient and into a return electrode positioned on or under the patient, for example. as discussed above, the tissue of a patient can be cut by using a mechanical force and/or an electrical force. such mechanical and electrical forces can be applied simultaneously and/or sequentially. for instance, both forces can be applied at the beginning of a tissue cutting actuation and then the mechanical force can be discontinued in favor of the electrosurgical force finishing the tissue cutting actuation. such an approach can apply an energy-created hemostatic seal to the tissue after the mechanical cutting has been completed. in such arrangements, the electrosurgical force is applied throughout the duration of the tissue cutting actuation. in other instances, the mechanical cutting force, without the electrosurgical cutting force, can be used to start a tissue cutting actuation which is then followed by the electrosurgical cutting force after the mechanical cutting force has been stopped. in such arrangements, the mechanical and electrosurgical forces are not overlapping or co-extensive. in various instances, both the mechanical and electrosurgical forces are overlapping and co-extensive throughout the entire tissue cutting actuation. in at least one instance, both forces are overlapping and co-extensive throughout the entire tissue cutting actuation but in magnitudes or intensities that change during the tissue cutting actuation. the above being said, any suitable combination, pattern, and/or sequence of mechanical and electrosurgical cutting forces and energies could be used. further to the above, the surgical system 128700 comprises a control system configured to co-ordinate the application of the mechanical force and electrosurgical energy to the patient tissue. in various instances, the control system is in communication with the motor controller which drives the jaws 128740 and 128750 and, also, the electrical generator and comprises one or more sensing systems for monitoring the mechanical force and electrosurgical energy being applied to the tissue. systems for monitoring the forces within a mechanical drive system are disclosed elsewhere herein. systems for monitoring the electrosurgical energy being applied to the patient tissue include monitoring the impedance, or changes in the impedance, of the patient tissue via the electrical pathways of the electrosurgical circuit. in at least one instance, referring to the graph 128800 in fig. 85 , the rf current/voltage ratio of the electrosurgical power being applied to the patient tissue by the generator is evaluated by monitoring the current and voltage of the power being supplied by the generator. the impedance of the tissue and the rf current/voltage ratio of the electrosurgical power are a function of many variables such as the temperature of the tissue, the density of the tissue, the thickness of the tissue, the type of tissue between the jaws 128740 and 128750 , the duration in which the power is applied to the tissue, among others, which change throughout the application of the electrosurgical energy. further to the above, the control system and/or generator of the surgical system 128700 comprises one or more ammeter circuits and/or voltmeter circuits configured to monitor the electrosurgical current and/or voltage, respectively, being applied to the patient tissue. referring again to fig. 85 , a minimum amplitude limit and/or a maximum amplitude limit on the current being applied to the patient tissue can be preset in the control system and/or can be controllable by the user of the surgical instrument system through one or more input controls. the minimum and maximum amplitude limits can define a current envelope within which the electrosurgical portion of the surgical system 128700 is operated. in various instances, the control system of the surgical system 128700 is configured to adaptively increase the electrosurgical energy applied to the patient tissue when the drive motor slows. the motor slowing can be a reaction to an increase in the tissue cutting load and/or an adaptation of the control system. similarly, the control system of the surgical system 128700 is configured to adaptively increase the electrosurgical energy applied to the patient tissue when the drive motor stops. again, the motor stopping can be a reaction to an increase in the tissue cutting load and/or an adaptation of the control system. increasing the electrosurgical energy when the electric motor slows and/or stops can compensate for a reduction in mechanical cutting energy. in alternative embodiments, the electrosurgical energy can be reduced and/or stopped when the electric motor slows and/or stops. such embodiments can afford the clinician to evaluate the situation in a low-energy environment. in various instances, the control system of the surgical system 128700 is configured to adaptively decrease the electrosurgical energy applied to the patient tissue when the drive motor speeds up. the motor speeding up can be a reaction to a decrease in the cutting load and/or an adaptation of the control system. decreasing the electrosurgical energy when the electric motor slows and/or stops can compensate for, or balance out, an increase in mechanical cutting energy. in alternative embodiments, the electrosurgical energy can be increased when the electric motor speeds up. such embodiments can accelerate the closure of the jaws and provide a clean, quick cutting motion. in various instances, the control system of the surgical system 128700 is configured to adaptively increase the speed of the drive motor when the electrosurgical energy applied to the patient tissue decreases. the electrosurgical energy decreasing can be a reaction to a change in tissue properties and/or an adaptation of the control system. similarly, the control system of the surgical system 128700 is configured to adaptively increase the speed of the drive motor when electrosurgical energy applied to the patient tissue stops in response to an adaptation of the control system. increasing the speed of the drive motor when the electrosurgical energy decreases or is stopped can compensate for a reduction in electrosurgical cutting energy. in alternative embodiments, the speed of the drive motor can be reduced and/or stopped when the electrosurgical energy decreases and/or is stopped. such embodiments can afford the clinician to evaluate the situation in a low-energy and/or static environment. in various instances, the control system of the surgical system 128700 is configured to adaptively decrease the speed of the electric motor when the electrosurgical energy applied to the patient tissue increases. the electrosurgical energy increasing can be a reaction to a change in tissue properties and/or an adaptation of the control system. decreasing the drive motor speed when the electrosurgical energy increases can compensate for, or balance out, an increase in electrosurgical cutting energy. in alternative embodiments, the drive motor speed can be increased when the electrosurgical energy increases. such embodiments can accelerate the closure of the jaws and provide a clean, quick cutting motion. in various instances, the surgical system 128700 comprises controls, such as on the handle of the surgical system 128700 , for example, that a clinician can use to control when the mechanical and/or electrosurgical forces are applied. in addition to or in lieu of manual controls, the control system of the surgical system 128700 is configured to monitor the mechanical force and electrical energy being applied to the tissue and adjust one or the other, if needed, to cut the tissue in a desirable manner according to one or more predetermined force-energy curves and/or matrices. in at least one instance, the control system can increase the electrical energy being delivered to the tissue once the mechanical force being applied reaches a threshold limit. moreover, the control system is configured to consider other parameters, such as the impedance of the tissue being cut, when making adjustments to the mechanical force and/or electrical energy being applied to the tissue. the surgical instrument systems described herein are motivated by an electric motor; however, the surgical instrument systems described herein can be motivated in any suitable manner. in certain instances, the motors disclosed herein may comprise a portion or portions of a robotically controlled system. u.s. patent application ser. no. 13/118,241, entitled surgical stapling instruments with rotatable staple deployment arrangements, now u.s. pat. no. 9,072,535, for example, discloses several examples of a robotic surgical instrument system in greater detail, the entire disclosure of which is incorporated by reference herein. the surgical instrument systems described herein can be used in connection with the deployment and deformation of staples. various embodiments are envisioned which deploy fasteners other than staples, such as clamps or tacks, for example. moreover, various embodiments are envisioned which utilize any suitable means for sealing tissue. for instance, an end effector in accordance with various embodiments can comprise electrodes configured to heat and seal the tissue. also, for instance, an end effector in accordance with certain embodiments can apply vibrational energy to seal the tissue. in addition, various embodiments are envisioned which utilize a suitable cutting means to cut the tissue. examples example 1 a surgical end effector for use with a surgical instrument. the surgical end effector comprises a proximal connector configured to attach to a distal end of the surgical instrument. the proximal connector comprises an actuator. the surgical end effector further comprises a first jaw member. the first jaw member comprises a first portion comprising a first feature, and a second portion comprising a second feature. the surgical end effector further comprises a second jaw member. at least one of the first jaw member and the second jaw member is movable relative to the other one of the first jaw member and the second jaw member between an open configuration and a closed configuration. the second jaw member comprises a first portion comprising a first feature, and a second portion comprising a second feature. at least one of the first feature of the first jaw member and the first feature of the second jaw member is selected by a user in an additive manufacturing process. example 2 the surgical end effector of example 1, wherein the additive manufacturing process comprises 3-d printing. example 3 the surgical end effector of examples 1 or 2, wherein the first jaw member comprises an inner surface and an outer surface, wherein the second jaw member comprises an inner surface and an outer surface, and wherein the inner surface of the first jaw member and the inner surface of the second jaw member comprise a mating relationship when the surgical end effector is in the closed configuration. example 4 the surgical end effector of examples 1, 2, or 3, wherein the first feature of the first jaw member comprises a tooth, wherein the first feature of the second jaw member comprises a void, and wherein, when the surgical end effector is in the closed configuration, the tooth is received in the void. example 5 the surgical end effector of examples 1, 2, 3, or 4, wherein the first feature of the first jaw member comprises a first material, wherein the second feature of the first jaw member comprises a second material, and wherein the first material is different than the second material. example 6 the surgical end effector of examples 1, 2, 3, or 4, wherein the first feature of the first jaw member comprises a first material, wherein the first feature of the second jaw member comprises a second material, and wherein the first material is different than the second material. example 7 the surgical end effector of examples 1, 2, 3, 4, 5, or 6, wherein the first feature of the first jaw member comprises a first symmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second symmetrical pattern of protrusions, and wherein the first symmetrical pattern of protrusions and the second symmetrical pattern of protrusions are complementary. example 8 the surgical end effector of examples 1, 2, 3, 4, 5, or 6, wherein the first feature of the first jaw member comprises a first symmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second symmetrical pattern of protrusions, and wherein the first symmetrical pattern of protrusions is different than the second symmetrical pattern of protrusions. example 9 the surgical end effector of examples 1, 2, 3, 4, 5, or 6, wherein the first feature of the first jaw member comprises a first asymmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second asymmetrical pattern of protrusions, and wherein the first asymmetrical pattern of protrusions and the second asymmetrical pattern of protrusions are complementary. example 10 the surgical end effector of examples 1, 2, 3, 4, 5, or 6, wherein the first feature of the first jaw member comprises a first asymmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second asymmetrical pattern of protrusions, and wherein the first asymmetrical pattern of protrusions is different than the second asymmetrical pattern of protrusions. example 11 the surgical end effector of examples 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10, wherein the first portion of the first jaw member is proximal to the second portion of the first jaw member. example 12 the surgical end effector of examples 1, 2, 3, 4, 5, 6, or 11, wherein the first feature of the first jaw member comprises a plurality of protrusions. example 13 the surgical end effector of examples 1, 2, 3, 4, 5, 6, 11, or 12, wherein the second feature of the first jaw member comprises a plurality of protrusions. example 14 the surgical end effector of examples 1, 2, 3, 4, 5, 6, 11, 12, or 13, wherein the first feature of the first jaw member comprises a plurality of protrusions, and wherein the second feature of the first jaw member comprises a substantially smooth surface. example 15 the surgical end effector of examples 1 or 2, wherein the first jaw member comprises an inside surface and an outside surface, and wherein the first portion of the first jaw member is positioned along the inside surface of the first jaw member, and wherein the second portion of the first jaw member is positioned along the outside surface of the first jaw member. example 16 the surgical end effector of examples 1, 2, or 15, wherein the first feature of the first jaw member comprises a plurality of protrusions, and wherein the second feature of the first jaw member comprises a substantially smooth surface. example 17 the surgical end effector of examples 1, 2, or 15, wherein the first feature of the first jaw member comprises a substantially smooth surface, and wherein the second feature of the first jaw member comprises a plurality of protrusions. example 18 the surgical end effector of examples 1, 2, or 15, wherein the first feature of the first jaw member comprises a plurality of first protrusions, and wherein the second feature of the first jaw member comprises a plurality of second protrusions. example 19 the surgical end effector of example 18, wherein the plurality of first protrusions is different than the plurality of second protrusions. example 20 the surgical end effector of examples 1, 2, or 15, wherein the first feature of the first jaw member comprises an asymmetrical profile, and wherein the second feature of the first jaw member comprises a symmetrical profile. example 21 the surgical end effector of examples 1, 2, 15, or 20, wherein the first feature of the first jaw member comprises a low durometer surface. example 22 the surgical end effector of examples 1, 2, 15, 20, or 21 wherein the second feature of the first jaw member comprises a low durometer surface. example 23 the surgical end effector of examples 1, 2, or 15, wherein the first feature of the first jaw member comprises a curved profile. example 24 the surgical end effector of examples 1, 2, or 15, wherein the second feature of the first jaw member comprises a curved profile. example 25 the surgical end effector of examples 1, 2, 15, 16, 17, 18, 19, 20, 21, 22, 23, or 24, wherein the first feature of the first jaw member comprises a metallic material. example 26 the surgical end effector of examples 1, 2, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, or 25, wherein the second feature of the first jaw member comprises a metallic material. example 27 a surgical end effector for use with a surgical instrument. the surgical end effector comprises a proximal connector configured to attach to a distal end of the surgical instrument. the proximal connector comprises an actuator. the surgical end effector further comprises a first jaw member. the first jaw member comprises a first portion comprising a first feature, and a second portion comprising a second feature. the surgical end effector further comprises a second jaw member. at least one of the first jaw member and the second jaw member is movable relative to the other one of the first jaw member and the second jaw member between an open configuration and a closed configuration. the second jaw member comprises a first portion comprising a first feature, and a second portion comprising a second feature. the surgical end effector further comprises means for selecting at least one of the first feature of the first jaw member and the first feature of the second jaw member by a user. example 28 the surgical end effector of example 27, wherein the means comprises an additive manufacturing process. example 29 the surgical end effector of examples 27 or 28, wherein the first jaw member comprises an inner surface and an outer surface, wherein the second jaw member comprises an inner surface and an outer surface, and wherein the inner surface of the first jaw member and the inner surface of the second jaw member comprise a mating relationship when the surgical end effector is in the closed configuration. example 30 the surgical end effector of examples 27, 28, or 29, wherein the first feature of the first jaw member comprises a tooth, wherein the first feature of the second jaw member comprises a void, and wherein, when the surgical end effector is in the closed configuration, the tooth is received in the void. example 31 the surgical end effector of examples 27, 28, 29, or 30, wherein the first feature of the first jaw member comprises a first material, wherein the second feature of the first jaw member comprises a second material, and wherein the first material is different than the second material. example 32 the surgical end effector of examples 27, 28, 29, or 30, wherein the first feature of the first jaw member comprises a first material, wherein the first feature of the second jaw member comprises a second material, and wherein the first material is different than the second material. example 33 the surgical end effector of examples 27, 28, 29, 30, 31, or 32, wherein the first feature of the first jaw member comprises a first symmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second symmetrical pattern of protrusions, and wherein the first symmetrical pattern of protrusions and the second symmetrical pattern of protrusions are complementary. example 34 the surgical end effector of examples 27, 28, 29, 30, 31, or 32, wherein the first feature of the first jaw member comprises a first symmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second symmetrical pattern of protrusions, and wherein the first symmetrical pattern of protrusions is different than the second symmetrical pattern of protrusions. example 35 the surgical end effector of examples 27, 28, 29, 30, 31, or 32, wherein the first feature of the first jaw member comprises a first asymmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second asymmetrical pattern of protrusions, and wherein the first asymmetrical pattern of protrusions and the second asymmetrical pattern of protrusions are complementary. example 36 the surgical end effector of examples 27, 28, 29, 30, 31, or 32, wherein the first feature of the first jaw member comprises a first asymmetrical pattern of protrusions, wherein the first feature of the second jaw member comprises a second asymmetrical pattern of protrusions, and wherein the first asymmetrical pattern of protrusions is different than the second asymmetrical pattern of protrusions. example 37 the surgical end effector of examples 27, 28, 29, 30, 31, 32, 33, 34, 35, or 36, wherein the first portion of the first jaw member is proximal to the second portion of the first jaw member. example 38 the surgical end effector of examples 27, 28, 29, 30, 31, 32, or 37, wherein the first feature of the first jaw member comprises a plurality of protrusion. example 39 the surgical end effector of examples 27, 28, 29, 30, 31, 32, 37, or 38, wherein the second feature of the first jaw member comprises a plurality of protrusions. example 40 the surgical end effector of examples 27, 28, 29, 30, 31, 32, 37, 38, or 39, wherein the first feature of the first jaw member comprises a plurality of protrusions, and wherein the second feature of the first jaw member comprises a substantially smooth surface. example 41 the surgical end effector of examples 27 or 28, wherein the first jaw member comprises an inside surface and an outside surface, and where the first portion of the first jaw member is positioned along the inside surface of the first jaw member, and wherein the second portion of the first jaw member is positioned along the outside surface of the first jaw member. example 42 the surgical end effector of examples 27, 28, or 41, wherein the first feature of the first jaw member comprises a plurality of protrusions, and wherein the second feature of the first jaw member comprises a substantially smooth surface. example 43 the surgical end effector of examples 27, 28, or 41, wherein the first feature of the first jaw member comprises a substantially smooth surface, and wherein the second feature of the first jaw member comprises a plurality of protrusions. example 44 the surgical end effector of examples 27, 28, or 43, wherein the first feature of the first jaw member comprises a plurality of first protrusions, and wherein the second feature of the first jaw member comprises a plurality of second protrusions. example 45 the surgical end effector of example 44, wherein the plurality of first protrusions is different than the plurality of second protrusions. example 46 the surgical end effector of examples 27, 28, or 41, wherein the first feature of the first jaw member comprises an asymmetrical profile, and wherein the second feature of the first jaw member comprises a symmetrical profile. example 47 the surgical end effector of examples 27, 28, 41, or 46, wherein the first feature of the first jaw member comprises a low durometer surface. example 48 the surgical end effector of examples 27, 28, 41, 46, or 47, wherein the second feature of the first jaw member comprises a low durometer surface. example 49 the surgical end effector of examples 27, 28, or 41, wherein the first feature of the first jaw member comprises a curved profile. example 50 the surgical end effector of examples 27, 28, or 41, wherein the second feature of the first jaw member comprises a curved profile. example 51 the surgical end effector of examples 27, 28, 41, 42, 43, 44, 45, 46, 47, 48, 49, or 50, wherein the first feature of the first jaw member comprises a metallic material. example 52 the surgical end effector of examples 27, 28, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, or 51 wherein the second feature of the first jaw member comprises a metallic material. example 53 a method for producing a customized end effector. the method comprises preparing an end effector connector for customization. the end effector connector comprises a proximal connector configured to attach to a distal end of a surgical instrument. the proximal connector comprises an actuator. the method further comprises determining through interaction with a patient a first desired characteristic of the end effector, determining through interaction with a patient a second desired characteristic of the end effector, and creating a first jaw member having the first desired characteristic. the first jaw member is attached to a distal portion of the end effector. the method further comprises creating a second jaw member having the second desired characteristic. the second jaw member is attached to a distal portion of the end effector. example 54 the method of example 53, further comprising producing the first jaw member and the second jaw member using an additive manufacturing process. example 55 the method of example 54, wherein the additive manufacturing process comprises 3-d printing. example 56 the method of examples 53, 54, or 55, wherein the first characteristic of the first jaw member comprises a tooth, wherein the second characteristic of the second jaw member comprises a void. example 57 the method of examples 53, 54, 55, or 56, wherein the first characteristic comprises a first material, wherein the second characteristic comprises a second material, and wherein the first material is different than the second material. example 58 the method of examples 53, 54, 55, 56, or 57, wherein the first characteristic comprises a first symmetrical pattern of protrusions, wherein the second characteristic comprises a second symmetrical pattern of protrusions, and wherein the first symmetrical pattern of protrusions and the second symmetrical pattern of protrusions are complementary. example 59 the method of examples 53, 54, 55, 56, or 57, wherein the first characteristic comprises a first symmetrical pattern of protrusions, wherein the second characteristic comprises a second symmetrical pattern of protrusions, and wherein the first symmetrical pattern of protrusions is different than the second symmetrical pattern of protrusions. example 60 the method of examples 53, 54, 55, 56, or 57, wherein the first characteristic comprises a first asymmetrical pattern of protrusions, wherein the second characteristic comprises a second asymmetrical pattern of protrusions, and wherein the first asymmetrical pattern of protrusions and the second asymmetrical pattern of protrusions are complementary. example 61 the method of examples 53, 54, 55, 56, or 57, wherein the first characteristic comprises a first asymmetrical pattern of protrusions, wherein the second characteristic comprises a second asymmetrical pattern of protrusions, and wherein the first asymmetrical pattern of protrusions is different than the second asymmetrical pattern of protrusions. example 62 the method of example 53, further comprising creating a third desired characteristic on the first jaw member, and creating a fourth desired characteristic on the second jaw member. example 63 the method of example 62, wherein the first characteristic comprises a plurality of protrusions. example 64 the method of examples 62 or 63, wherein the third characteristic comprises a plurality of protrusions. example 65 the method of examples 62 or 64, wherein the first characteristic comprises a plurality of protrusions, and wherein the third characteristic comprises a substantially smooth surface. example 66 the method of examples 62, 63, 64, or 65, wherein the first jaw member comprises an inside surface and an outside surface, and where the first characteristic is positioned along the inside surface of the first jaw member, and wherein the third characteristic is positioned along the outside surface of the first jaw member. example 67 the method of examples 62, 63, 64, 65, or 66, wherein the first characteristic comprises a plurality of protrusions, and wherein the third characteristic comprises a substantially smooth surface. example 68 the method of examples 62, 63, 64, 65, or 66, wherein the first characteristic comprises a substantially smooth surface, and wherein the third characteristic comprises a plurality of protrusions. example 69 the method of examples 62, 63, 64, 65, or 66, wherein the first characteristic comprises a plurality of first protrusions, and wherein the third characteristic comprises a plurality of second protrusions. example 70 the method of example 69, wherein the plurality of first protrusions is different than the plurality of second protrusions. example 71 the method of examples 62, 63, 64, 65, or 66, wherein the first characteristic comprises an asymmetrical profile, and wherein the third characteristic comprises a symmetrical profile. example 72 the method of examples 62, 63, 64, 65, or 66, wherein the first characteristic comprises a low durometer surface. example 73 the method of examples 62, 63, 64, 65, or 66, wherein the third characteristic comprises a low durometer surface. example 74 the method of examples 62, 63, 64, 65, or 66, wherein the first characteristic comprises a curved profile. example 75 the method of examples 62, 63, 64, 65, or 66, wherein the third characteristic comprises a curved profile. example 76 the method of examples 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, or 75, wherein the first characteristic comprises a metallic material. example 77 the method of examples 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, or 76, wherein the third characteristic comprises a metallic material. example 78 a surgical instrument comprising a composite dissector jaw. the composite dissector jaw comprises a first jaw. the first jaw comprises a proximal portion, a distal portion, a tissue contacting surface, a metallic core, and at least one layer of molded plastic on the metallic core. the at least one layer of molded plastic defines a pattern. the pattern defines at least a portion of the tissue contacting surface. the tissue contacting surface further comprises at least a portion of the metallic core. the composite dissector jaw further comprises a second jaw. at least one of the first jaw and the second jaw is rotatable with respect to the other one of the first jaw and the second jaw. example 79 the surgical instrument of example 78, wherein the pattern comprises a first pattern on the proximal portion and a second pattern on the distal portion. example 80 the surgical instrument of example 79, wherein the first pattern is different than the second pattern. example 81 the surgical instrument of examples 79 or 80, wherein the first pattern comprises a first thickness of the at least one layer of molded plastic, wherein the second pattern comprises a second thickness of the at least one layer of molded plastic, and wherein the first thickness is different than the second thickness. example 82 the surgical instrument of example 81, wherein the first thickness is greater than the second thickness. example 83 the surgical instrument of example 81, wherein the first thickness is less than the second thickness. example 84 the surgical instrument of examples 78, 79, 80, 81, 82, or 83, wherein the at least one layer of molded plastic comprises a first layer and a second layer. example 85 the surgical instrument of example 84, wherein the first layer is different than the second layer. example 86 the surgical instrument of examples 84 or 85, wherein the first layer comprises a first material, wherein the second layer comprises a second material, and wherein the first material is different than the second material. example 87 the surgical instrument of examples 84, 85, or 86, wherein the first layer is in contact with the metallic core, and wherein the second layer is in contact with the first layer. example 88 the surgical instrument of examples 84, 85, or 86, wherein the first layer is positioned on the proximal portion, and wherein the second layer is positioned on the distal portion. example 89 the surgical instrument of examples 84, 85, 86, 87, or 88, wherein the first layer comprises a first rigidity, wherein the second layer comprises a second rigidity, wherein the first rigidity is different than the second rigidity. example 90 the surgical instrument of example 89, wherein the first rigidity is greater than the second rigidity. example 91 the surgical instrument of example 89, wherein the first rigidity is less than the second rigidity. example 92 the surgical instrument of examples 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, or 91, wherein the first pattern comprises a plurality of recesses. example 93 the surgical instrument of examples 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, or 92, wherein the first pattern comprises a plurality of ridges. example 94 the surgical instrument of examples 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, or 93, wherein the first pattern is symmetrical. example 95 the surgical instrument of examples 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, or 93, wherein the first pattern is asymmetrical. example 96 the surgical instrument of examples 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, or 95, wherein the at least one layer of molded plastic on the metallic core comprises openings, and wherein the metallic core is exposed to tissue via the openings. example 97 the surgical instrument of examples 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, or 96, wherein the first jaw and the second jaw are mechanically driven open to create an ostomy. example 98 a surgical dissector comprising a first jaw member. the first jaw member comprises a proximal end, a distal end, a first tissue contacting surface, a second tissue contacting surface, a metallic core, and a nonmetallic layer. the metallic core of the first jaw member is configured to transmit electrosurgical energy. the nonmetallic layer is disposed over at least a portion of the metallic core of the first jaw member. the surgical dissector further comprises a second jaw member. the second jaw member comprises a proximal end, a distal end, a first tissue contacting surface, a second tissue contacting surface, a metallic core, and a nonmetallic layer. the metallic core of the second jaw member is configured to transmit electrosurgical energy. the nonmetallic layer is disposed over at least a portion of the metallic core of the second jaw member. the surgical dissector further comprises a joint. the first jaw member and the second jaw member are rotatable about the joint between closed and open positions. example 99 the surgical dissector of example 98, wherein the first tissue contacting surface of the first jaw member is positioned adjacent the first tissue contacting surface of the second jaw member when the first and the second jaw members are in the closed position. example 100 the surgical dissector of examples 98 or 99, wherein the first tissue contacting surface of the first jaw member comprises a first pattern, and wherein the first tissue contacting surface of the second jaw member comprises a second pattern, and wherein the first pattern is different than the second pattern. example 101 the surgical dissector of examples 98 or 99, wherein the first tissue contacting surface of the first jaw member comprises a first pattern, and wherein the first tissue contacting surface of the second jaw member comprises a second pattern, and wherein the first pattern is complementary to the second pattern. example 102 the surgical dissector of examples 98 or 99, wherein the first tissue contacting surface of the first jaw member comprises a first pattern, and wherein the first tissue contacting surface of the second jaw member comprises a second pattern, wherein the first pattern comprises a plurality of first teeth, and wherein the second pattern comprises a plurality of second teeth. example 103 the surgical dissector of examples 98 or 99, wherein the first tissue contacting surface of the first jaw member comprises a first pattern, and wherein the first tissue contacting surface of the second jaw member comprises a second pattern, wherein the first pattern comprises a plurality of first recesses, and wherein the second pattern comprises a plurality of second recesses. example 104 the surgical dissector of examples 98, 99, 100, 101, 102, or 103, wherein the nonmetallic layer of the first jaw member comprises a first nonmetallic layer and a second nonmetallic layer. example 105 the surgical dissector of example 104, wherein the first nonmetallic layer is different than the second nonmetallic layer. example 106 the surgical dissector of examples 104 or 105, wherein the first nonmetallic layer comprises a first rigidity, wherein the second nonmetallic layer comprises a second rigidity, and wherein the first rigidity is different than the second rigidity. example 107 the surgical dissector of example 98, wherein the first tissue contacting surface of the first jaw member comprises a first pattern, wherein the second tissue contacting surface of the first jaw member comprises a second pattern, and wherein the first pattern is different than the second pattern. example 108 the surgical dissector of example 107, wherein the first pattern comprises a symmetrical pattern, and wherein the second pattern comprises an asymmetrical pattern. example 109 the surgical dissector of examples 107 or 108, wherein the first pattern comprises a plurality of teeth, and wherein the second pattern comprises a plurality of cavities. example 110 the surgical dissector of examples 107 or 108, wherein the first pattern comprises a plurality of first cavities, wherein the second pattern comprises a plurality of second cavities. example 111 the surgical dissector of example 110, wherein the plurality of first cavities comprises a first depth, wherein the plurality of second cavities comprises a second depth, and wherein the first depth is different than the second depth. example 112 a surgical instrument comprising a jaw. the jaw comprises a metallic core and an outer skin. the outer skin comprises a plurality of first through holes exposing the metallic core to an outer surface of the jaw. the plurality of first through holes comprise a first through hole size. the outer skin further comprises a plurality of second through holes exposing the metallic core to the outer surface of the jaw. the plurality of second through holes comprise a second through hole size. the first through hole size is different than the second through hole size. example 113 the surgical instrument of example 112, wherein the jaw further comprises a first region. the plurality of first through holes are positioned within the first region. the jaw further comprises a second region. the plurality of second through holes are positioned within the second region. the first region is different than the second region. example 114 the surgical instrument of examples 112 or 113, wherein the jaw comprises a tip region, wherein the first through hole size is smaller than the second through hole size, and wherein the plurality of first through holes are positioned within the tip region. example 115 the surgical instrument of examples 112 or 113, wherein the jaw comprises a tip region, wherein the first through hole size is larger than the second through hole size, and wherein the plurality of first through holes are positioned within the tip region. example 116 the surgical instrument of examples 112, 113, 114, or 115, wherein the plurality of first through holes and the plurality of second through holes are intermixed along the outer skin. example 117 the surgical instrument of examples 112, 113, 114, 115, or 116, wherein the plurality of first through holes are round, and wherein the plurality of second through holes are round. example 118 the surgical instrument of examples 112, 113, 114, 115, or 116, wherein the plurality of first through holes are round, and wherein the plurality of second through holes are non-round. example 119 the surgical instrument of examples 112, 113, 114, 115, or 116, wherein the plurality of first through holes are non-round, and wherein the plurality of second through holes are non-round. example 120 the surgical instrument of examples 112, 113, 114, 115, 116, 117, 118, or 119, wherein the outer skin comprises an insulative plastic. example 121 the surgical instrument of examples 112, 113, 114, 115, 116, 117, 118, or 119, wherein the outer skin comprises a semi-conductive plastic. example 122 the surgical instrument of examples 112, 113, 114, 115, 116, 117, 118, or 119, wherein the outer skin is semi-conductive. example 123 the surgical instrument of examples 112, 113, 114, 115, 116, 117, 118, or 119, wherein the outer skin comprises intrinsically conducting polymers. example 124 a surgical dissector comprising a first jaw member. the first jaw member comprises a first tissue contacting surface. the first tissue contacting surface comprises a first electrically conductive portion and a first electrically insulative portion. the surgical dissector further comprises a second jaw member. the second jaw member comprises a second tissue contacting surface. the second tissue contacting surface comprises a second electrically conductive portion and a second electrically insulative portion. the surgical dissector further comprises a pivot. the first jaw member and the second jaw member are rotatable about the pivot. the surgical dissector further comprises means for separating tissue. the means for separating tissue comprises means for applying a mechanical force to tissue of a patient through rotation of at least one of the first jaw member and the second jaw member, and means for applying electrosurgical force to the tissue through at least one of the first electrically conductive portion and the second electrically conductive portion. example 125 the surgical dissector of example 124, wherein the means for separating tissue comprises applying the mechanical force in an amount less than the separation pressure needed to separate the tissue and applying electrosurgical force which supplements the mechanical force to separate the tissue. the devices, systems, and methods disclosed in the subject application can be used with the devices, systems, and methods disclosed in u.s. provisional patent application no. 62/659,900, entitled method of hub communication, filed on apr. 19, 2018, u.s. provisional patent application no. 62/611,341, entitled interactive surgical platform, filed on dec. 28, 2017, u.s. provisional patent application no. 62/611,340, entitled cloud-based medical analytics, filed on dec. 28, 2017, and u.s. provisional patent application no. 62/611,339, entitled robot assisted surgical platform, filed on dec. 28, 2017, which are incorporated in their entireties herein. the devices, systems, and methods disclosed in the subject application can also be used with the devices, systems, and methods disclosed in u.s. patent application ser. no. 15/908,021, entitled surgical instrument with remote release, filed on feb. 28, 2018, u.s. patent application ser. no. 15/908,012, entitled surgical instrument having dual rotatable members to effect different types of end effector movement, filed on feb. 28, 2018, u.s. patent application ser. no. 15/908,040, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions, filed on feb. 28, 2018, u.s. patent application ser. no. 15/908,057, entitled surgical instrument with rotary drive selectively actuating multiple end effector functions, filed on feb. 28, 2018, u.s. patent application ser. no. 15/908,058, entitled surgical instrument with modular power sources, filed on feb. 28, 2018, and u.s. patent application ser. no. 15/908,143, entitled surgical instrument with sensor and/or control systems, filed on feb. 28, 2018, which are incorporated in their entireties herein. the devices, systems, and methods disclosed in the subject application can also be used with the devices, systems, and methods disclosed in u.s. patent application ser. no. 14/226,133, now u.s. patent application publication no. 2015/0272557, entitled modular surgical instrument system, filed on mar. 26, 2014, which is incorporated in its entirety herein. the entire disclosures of: u.s. patent application ser. no. 11/013,924, entitled trocar seal assembly, now u.s. pat. no. 7,371,227;u.s. patent application ser. no. 11/162,991, entitled electroactive polymer-based articulation mechanism for grasper, now u.s. pat. no. 7,862,579;u.s. patent application ser. no. 12/364,256, entitled surgical dissector, now u.s. patent application publication no. 2010/0198248;u.s. patent application ser. no. 13/536,386, entitled empty clip cartridge lockout, now u.s. pat. no. 9,282,974;u.s. patent application ser. no. 13/832,786, entitled circular needle applier with offset needle and carrier tracks, now u.s. pat. no. 9,398,905;u.s. patent application ser. no. 12/592,174, entitled apparatus and method for minimally invasive suturing, now u.s. pat. no. 8,123,764;u.s. patent application ser. no. 12/482,049, entitled endoscopic stitching devices, now u.s. pat. no. 8,628,545;u.s. patent application ser. no. 13/118,241, entitled surgical stapling instruments with rotatable staple deployment arrangements, now u.s. pat. no. 9,072,535;u.s. patent application ser. no. 11/343,803, entitled surgical instrument having recording capabilities, now u.s. pat. no. 7,845,537;u.s. patent application ser. no. 14/200,111, entitled control systems for surgical instruments, now u.s. pat. no. 9,629,629;u.s. patent application ser. no. 14/248,590, entitled motor driven surgical instruments with lockable dual drive shafts, now u.s. pat. no. 9,826,976;u.s. patent application ser. no. 14/813,242, entitled surgical instrument comprising systems for assuring the proper sequential operation of the surgical instrument, now u.s. patent application publication no. 2017/0027571;u.s. patent application ser. no. 14/248,587, entitled powered surgical stapler, now u.s. pat. no. 9,867,612;u.s. patent application ser. no. 12/945,748, entitled surgical tool with a two degree of freedom wrist, now u.s. pat. no. 8,852,174;u.s. patent application ser. no. 13/297,158, entitled method for passively decoupling torque applied by a remote actuator into an independently rotating member, now u.s. pat. no. 9,095,362;international application no. pct/us2015/023636, entitled surgical instrument with shiftable transmission, now international patent publication no. wo 2015/153642 a1;international application no. pct/us2015/051837, entitled handheld electromechanical surgical system, now international patent publication no. wo 2016/057225 a1;u.s. patent application ser. no. 14/657,876, entitled surgical generator for ultrasonic and electrosurgical devices, u.s. patent application publication no. 2015/0182277;u.s. patent application ser. no. 15/382,515, entitled modular battery powered handheld surgical instrument and methods therefor, u.s. patent application publication no. 2017/0202605;u.s. patent application ser. no. 14/683,358, entitled surgical generator systems and related methods, u.s. patent application publication no. 2016/0296271;u.s. patent application ser. no. 14/149,294, entitled harvesting energy from a surgical generator, u.s. pat. no. 9,795,436;u.s. patent application ser. no. 15/265,293, entitled techniques for circuit topologies for combined generator, u.s. patent application publication no. 2017/0086910; andu.s. patent application ser. no. 15/265,279, entitled techniques for operating generator for digitally generating electrical signal waveforms and surgical instruments, u.s. patent application publication no. 2017/0086914, are hereby incorporated by reference herein. although various devices have been described herein in connection with certain embodiments, modifications and variations to those embodiments may be implemented. particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. thus, the particular features, structures, or characteristics illustrated or described in connection with one embodiment may be combined in whole or in part, with the features, structures or characteristics of one ore more other embodiments without limitation. also, where materials are disclosed for certain components, other materials may be used. furthermore, according to various embodiments, a single component may be replaced by multiple components, and multiple components may be replaced by a single component, to perform a given function or functions. the foregoing description and following claims are intended to cover all such modification and variations. the devices disclosed herein can be designed to be disposed of after a single use, or they can be designed to be used multiple times. in either case, however, a device can be reconditioned for reuse after at least one use. reconditioning can include any combination of the steps including, but not limited to, the disassembly of the device, followed by cleaning or replacement of particular pieces of the device, and subsequent reassembly of the device. in particular, a reconditioning facility and/or surgical team can disassemble a device and, after cleaning and/or replacing particular parts of the device, the device can be reassembled for subsequent use. those skilled in the art will appreciate that reconditioning of a device can utilize a variety of techniques for disassembly, cleaning/replacement, and reassembly. use of such techniques, and the resulting reconditioned device, are all within the scope of the present application. the devices disclosed herein may be processed before surgery. first, a new or used instrument may be obtained and, when necessary, cleaned. the instrument may then be sterilized. in one sterilization technique, the instrument is placed in a closed and sealed container, such as a plastic or tyvek bag. the container and instrument may then be placed in a field of radiation that can penetrate the container, such as gamma radiation, x-rays, and/or high-energy electrons. the radiation may kill bacteria on the instrument and in the container. the sterilized instrument may then be stored in the sterile container. the sealed container may keep the instrument sterile until it is opened in a medical facility. a device may also be sterilized using any other technique known in the art, including but not limited to beta radiation, gamma radiation, ethylene oxide, plasma peroxide, and/or steam. while this invention has been described as having exemplary designs, the present invention may be further modified within the spirit and scope of the disclosure. this application is therefore intended to cover any variations, uses, or adaptations of the invention using its general principles. any patent, publication, or other disclosure material, in whole or in part, that is said to be incorporated by reference herein is incorporated herein only to the extent that the incorporated materials do not conflict with existing definitions, statements, or other disclosure material set forth in this disclosure. as such, and to the extent necessary, the disclosure as explicitly set forth herein supersedes any conflicting material incorporated herein by reference. any material, or portion thereof, that is said to be incorporated by reference herein, but which conflicts with existing definitions, statements, or other disclosure material set forth herein will only be incorporated to the extent that no conflict arises between that incorporated material and the existing disclosure material.
159-951-655-529-109	US	[ "US" ]	H04L12/28,G06F15/173,H04J1/16,H04J3/14,H04L1/00,H04L12/26,H04L12/56	2002-07-15T00:00:00	2002	[ "H04", "G06" ]	management of network quality of service	in one embodiment, a router is deployed on a local area network (lan) in addition to any routers deployed on a wide area network (wan) coupled with the lan having the router. a service management device is coupled between the two routers. the service management device provides management processing, for example, quality of service (qos) processing, traffic shaping, type of service (tos) processing, or class of service (cos) processing. for messages between devices both coupled to the wan router, the wan router diverts the messages to the lan router. the lan router then returns the messages back to the wan router through the service management device, which provides management processing. the wan router then forwards the processed message to the destination device.	1 . in a network environment comprising a first host, a second host, a first network device, a second network device, and a qos device, a method allowing the qos device to operate on packet flows transmitted between hosts, the method comprising: receiving, at the first network device, a packet transmitted from the first host and addressed to the second host, wherein the packet comprises a header including a plurality of header fields; diverting the packet from a routed communication path between the first and second hosts by transmitting the packet from the first network device to the second network device, wherein the second network device is disposed out of the routed communication path; receiving, at the first network device, the packet from the second network device; and forwarding the packet from the first network device along the routed communication path to the second host; wherein during diverting the packet, the packet traverses the qos device thereby enabling the qos device to provide quality of service processing for the packet, wherein the qos device is disposed between the first and second network devices, and wherein the qos device is located outside of the routed communication path between the first and second hosts. 2 . the method of claim 1 wherein the first network device is a first router and the second network device is a second router. 3 . the method of claim 2 wherein the packet is transmitted to the first router from a source router coupled with the first router and the packet is forwarded to a destination router coupled to the first router. 4 . the method of claim 1 wherein the first network device is a wan router, and the second network device is a lan router. 5 . a system comprising: a first network device operably coupled to a routed path between a source host and a destination host, the first network device operative to receive, from the source host, a packet addressed to the destination host; a second network device coupled to the first network device by a second path outside the routed path to receive the packet from the first network device; and a quality of service device coupled to the second path between the first network device and the second network device to receive the message when transmitted between the first and second network devices, and to perform quality of service processing on the message; wherein, in response to receiving the packet from the source host, the first network device is operative to divert the packet from the routed path along the second path to the second network device, receive the packet returned from the second network device, and forward the message to the destination host; wherein during diversion of the packet, the packet traverses the qos device thereby enabling the qos device to provide quality of service processing for the packet. 6 . the system of claim 5 wherein the first network device is a first router and the second network device is a second router.	field the invention relates to network management. more particularly, the invention relates to techniques for managing quality of service of network traffic. background in current network architectures it is possible for traffic to pass between interfaces of a single router without being processed by a quality of service (qos) device. for example, as illustrated in fig. 1 , a message can pass from host 145 to host 155 in wide area network (wan) 100 without being processed by qos device 110 , which provides quality of service processing to wan 100 . a message generated by host 145 and designated for host 155 is sent through routers 140 , 130 and 150 to host 155 . only messages that pass from router 130 to qos device 110 receive quality of service processing. that is, only messages that pass from router 130 to local area network (lan) 120 or from lan 120 to router 130 receive quality of service processing. thus, the configuration of fig. 1 cannot guarantee quality of service processing for all messages. various solutions have been provided for this problem in the prior art. for example, traffic from router 140 and router 150 can be directed to qos device 110 by separate links. this solution is expensive and provides limited scalability. simple network management protocol (snmp) can be used to communicate between qos device 110 and router 130 to use excess bandwidth provided by qos device 110 to provide quality of service processing for messages that otherwise would not received qos processing. however, this solution typically prioritizes wan traffic over lan-to-wan traffic, which may not be appropriate. a wan-based quality of service device can be used. however, the benefits of quality of service devices are significantly reduced when qos device 110 is deployed on the wan side of router 130 because the primary congestion point exists from the lan to the wan, which is not addressed in this configuration. summary methods and apparatuses for management of network quality of service are described. in one embodiment, the present invention includes the following. a first network device, for example a router receives message from remote devices. an identifier that indicates the source of the message is associated with the message. the message is passed to a second network device, for example another router. the second network device modifies the identifier to indicate a destination of the message. quality of service processing is performed for the message based on the identifier associated with the message. in one embodiment, the identifier is a differentiated services code point (dscp) that is transmitted as part of the message header. in one embodiment, quality of service processing (or other types of processing) can be performed on messages as the messages pass from the wan router to the lan router. this processing can be performed in addition to, or in place of, processing that is performed on messages as they pass from the lan router to the wan router. brief description of the drawings the invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements. fig. 1 is one embodiment of a prior art network configuration in which quality of service processing is not guaranteed for all messages. fig. 2 is one embodiment of a network configuration in which service management processing is provided for wan-to-wan traffic with a lan router. fig. 3 is a block diagram of one embodiment of an electronic system that can be used for providing identifiers for quality of service processing. fig. 4 is a flow diagram of a process in which quality of service processing is provided for wan-to-wan traffic with a lan router. fig. 5 illustrates an internet protocol header having a dscp field that can be used in quality of service processing. detailed description management of network services is described. in the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understand of the invention. it will be apparent, however, to one skilled in the art that the invention can be practiced without these specific details. in other instances, structures and devices are shown in block diagram form in order to avoid obscuring the invention. in one embodiment, a router is described on a local area network (lan) in addition to any routers deployed on a wide area network (wan) coupled with the lan having the router. a service management device is coupled between the two routers. the service management device can be any type of device that provides network management services on network traffic. the service management device can be, for example, a gateway, a router or any other provide network node. the service management device provides management processing, for example, quality of service (qos) processing, traffic shaping, type of service (tos) processing, or class of service (cos) processing. for messages between devices both coupled to the wan router, the wan router sends the messages to the lan router. the lan router then routes the messages back to the wan router through the service management device, which provides management processing. the wan router then sends the processed message to the destination device. fig. 2 is one embodiment of a network configuration in which service management processing is provided for wan-to-wan traffic with a lan router. while the example of fig. 2 includes four routers, any number of routers can be supported and used to provide the service management processing described herein. network device 245 generates a message to be transmitted to network device 255 . network devices 245 and 255 can be any type of network devices for example, computer systems, printers, personal digital assistants (pdas), etc. the message can be any type of message in any type of network formal. for example, the message can be an internet protocol (ip) packet, which is variable in length, or an asynchronous transfer mode (atm) cell, which is a fixed length. network device 245 sends the message to router 240 . router 240 analysis the message to determine the routing path and forwards the message to router 230 through wan-to-wan interface 220 . router 230 receives the message and analyzes the message to determine a routing path to the destination. because management services device 270 is not coupled between router 230 and the destination, network device 255 , management service processing (e.g., qos processing) would not be performed if the message were directly routed to network device 255 . in order to provide management service processing, router 230 routes the message to router 200 . router 200 then sends the message back to router 230 . by sending the message to router 200 when the message would not otherwise be sent to router 200 or any device on the network that would cause the message to pass through management services device 270 management services can be provided. in general, routers that are part of a wan (or other type of network) are coupled with other routers on the wan. the connections between these routers are referred to as wan-to-wan interfaces (e.g., 220 , 230 ). management services devices are often deployed on a lan side of a router and the interface between the router and the lan devices (including the management services device) is referred to as a wan-to-lan interface (e.g., 210 ). by sending messages through a management services device to a router that would not normally be on the pant of a message and then sending the message back to the otherwise normal path for the message, management services processing can be provided to messages that would not otherwise be processed. in one embodiment, when router 230 receives a message from network device 245 to network device 255 , router 230 modifies the differentiated services code point (dscp) in the header of the message to correspond to the source of the message. the message is then sent to router 200 through management services device 270 . in general, differentiated services (diffserv or ds) is a protocol for specifying and controlling network traffic by class so that certain types of traffic get precedence, for example, voice traffic, which requires a relatively uninterrupted flow of data, might get precedence over other kinds of traffic. differentiated services use a policy or rule statements to determine how to forward a given network packet. for a given set of forwarding behaviors, known as per hop behaviors (phbs), a six-bit field (the dscp), in the internet protocol header, specifies the per hop behavior for a given flow of packets. note that the use of the dscp field for qos or other management service processing is different than prior use of dscp. thus, an existing field in an ip header can be used for a non-intended purpose (i.e., to provide routing information that can be used for qos processing) to provide improved management service processing. in alternate embodiments, techniques other than use of the dscp field can be used. any technique in which uses source and destination identifiers and the concept of inbound and outbound traffic can route messages as described herein to provide improved management services processing. in one embodiment, when router 200 receives a message from router 230 , router 230 modifies the dscp of the message to correspond to the destination of the message and sends the message back to router 200 through management services device 270 . management services device 270 provides quality of service processing on the message based on the destination of the message. service management device 270 can also perform traffic shaping processing, class of service processing, type of service processing, and/or any other type of network policy processing. in one embodiment, management services device 270 provides quality of service processing on messages that pass between router 230 and router 200 . the quality of service processing can be performed on messages that pass in one direction (i.e., from router 230 to router 200 or router 200 to router 230 ) or on messages that pass in both directions. quality of service processing can be performed in any manner known in the art. router 230 then forwards the message to router 250 , which forwards the message to network device 255 . in one embodiment, the routers, network devices and/or quality of service processor of fig. 2 can be implemented as an electronic systems that executes sequences of instructions. the sequences of instructions can be stored by the electronic device or the instructions can be received by the electronic device (e.g., via a network connection). fig. 3 is a block diagram of one embodiment of an electronic system that can be used for providing identifiers for quality of service processing. the electronic system illustrated in fig. 3 is intended to represent a range of electronic systems, for example, computer systems, network access devices, routers, hubs, switches, etc. alternative systems, whether electronic or non-electronic, can include more, fewer and/or different components. electronic system 300 includes bus 301 or other communication device to communicate information, and processor 302 coupled to bus 301 to process information. while electronic system 300 is illustrated with a single processor, electronic system 300 can include multiple processors and/or co-processors. electronic system 300 further includes random access memory (ram) or other dynamic storage device 304 (referred to as memory), coupled to bus 301 to store information and instructions to be executed by processor 302 . memory 304 also can be used to store temporary variables or other intermediate information during execution of instructions by processor 302 . in one embodiment, memory 304 includes operating system 390 , which provides software control of hardware components of electronic system 300 . any type of operating system known in the art appropriate for electronic system 390 can be used. memory 304 can also store application(s) 398 , which represent one or more applications that can be executed by processor(s) 302 . in one embodiment, memory 304 includes management services agent 392 . in alternate embodiments, management services agent 392 can be stored in rom 306 , implemented as hardware, or as any combination of hardware and software. in general, management services agent 392 provides the functionality described herein to route messages through a management services device (e.g., management services device 250 of fig. 2 ). if electronic device 300 is a wan router, management services agent 392 analyzes an incoming message to determine whether the message should be routed to a lan router in order to provide management services processing. in one embodiment, management 392 analyzes the header of the message to determine the source of the message. management services agent 392 then causes the dscp field in the header of the message to be modified to indicate the source of the message. if electronic device 300 is a lan router, management services agent 392 analyzes an incoming message to determine whether the message is from the wan router and whether the message should be routed back to the wan router. if so, management services agent 392 modifies the dscp field to indicate the destination of the message and sends the message back to the wan router through a management services device. the management services device provides qos (and/or other) processing on the message. electronic system 300 also includes read only memory (rom) and/or other static storage device 306 coupled to bus 301 to store static information and instructions for processor 302 . data storage device 307 is coupled to bus 301 to store information and instructions. data storage device 307 such as a magnetic disk or optical disc and corresponding drive can be coupled to electronic system 300 . electronic system 300 can also be coupled via bus 301 to input/output (i/o) devices 310 , such as, for example, a cathode ray tube (crt) or liquid crystal display (lcd), to display information to a user, a keyboard, a mouse, a trackball, or cursor direction keys to communicate direction information and command selections to processor 302 . electronic system 300 further includes network interfaces 320 to provide access to a network, such as a local area network. instructions are provided to memory from a storage device, such as magnetic disk, a read-only memory (rom) integrated circuit, cd-rom, dvd, via a remote connection (e.g., over a network via network interface 320 ) that is either wired or wireless providing access to one or more electronically-accessible media, etc. in alternative embodiments, hard-wired circuitry can be used in place of or in combination with software instructions. thus, execution of sequences of instructions is not limited to any specific combination of hardware circuitry and software instructions. an electronically-accessible medium includes any mechanism that provides (i.e., stores and/or transmits) content (e.g., computer executable instructions) in a form readable by an electronic device (e.g., a computer, a personal digital assistant, a cellular telephone). for example, a machine-accessible medium includes read only memory (rom); random access memory (ram); magnetic disk storage media; optical storage media; flash memory devices; electrical, optical, acoustical or other form of propagated signals (e.g., carrier waves, infrared signals, digital signals); etc. fig. 4 is a flow diagram of a process in which quality of service processing is provided for wan-to-wan traffic with a lan router. messages are sent from a source network device to a wan router, 400 . the destination network device is also coupled to the same wan router through a different port than the source network device. any number of routers or other network components can be coupled between the source network device and the wan router as well as between the wan router and the destination network device. the wan router generates an indication of the source or the message, 410 . in one embodiment, the wan router modifies a dscp field in the header of the message to indicate the source network device. other indicators can also be used. the wan router sends the message to a lan router, 420 . in one embodiment, the message is sent to the lan router through a quality of service device or other network management device. in an alternate embodiment, the message passes through the quality of service device only on its return to the wan router. in one embodiment, quality of service processing (or other types of processing) can be performed on messages as the messages pass from the wan router to the lan router. this processing can be performed in addition to, or in place of, processing that is performed on messages as they pass from the lan router to the wan router. the lan router changes the indicator (e.g., the dscp field) to indicate the destination network device, 430 . the lan router sends the message to the quality of service device, which performs quality of service processing on the message, 440 . the message is returned to the wan router 450 . the message is sent to the destination network device, 460 , in accordance with the quality of service parameters provided by the quality of service device. fig. 5 illustrates an internet protocol header having a dscp field that can be used in quality of service processing. in general, packet 500 includes header 520 and data portion 530 , each of which can have any number of bits or bytes depending on the network protocol being used. in one embodiment, header 520 includes dscp field 510 that can be used as described herein to provide network management services. in one embodiment, dscp field 510 is six bits; however, any number of bits can be used. in alternate embodiments, fields other than dscp field 510 can be used in the manner described herein. reference in the specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. the appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment. in the foregoing specification, the invention has been described with reference to specific embodiments thereof. it will, however, be evident that various modifications and changes can be made thereto without departing from the broader spirit and scope of the invention. the specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
160-939-130-823-237	US	[ "US" ]	A01N25/10,A01N25/34,C08K5/00,C08K5/59	1990-04-02T00:00:00	1990	[ "A01", "C08" ]	microbicides immobilized in water soluble thermoplastic resins and aqueous dispersions of microbicides prepared therefrom	solid solutions comprise a water-soluble thermoplastic resin and a microbicide dissolved therein. these solutions may be added to a rigid thermoplastic resin composition to impart biocidal characteristics thereto. if the microbicide is water-insoluble, the solid solutions may be used to prepare stable dispersions of the microbicide. the solutions also provide for slow release of a microbicide or as a vehicle for providing microbicide to an aqueous solution.	1. a solid, melt-blended solution consisting essentially of a microbicide dissolved in a carrier resin that is a copolymer of vinyl alcohol and (alkyleneoxy) acrylate and is soluble in water to at least about 1 gm. per 100 ml. of water at 25.degree. c., said solid solution being useful as a melt-processable additive to a primary rigid, non-plasticized, water-insoluble thermoplastic resin composition to impart biocidal activity thereto, said solid solution containing said microbicide at a level that is at least about 20 times higher than the normal end-use microbicide concentration in a primary rigid, non-plasticized, water-insoluble thermoplastic resin composition, said water-soluble thermoplastic carrier resin enabling said microbicide to impart improved antimicrobial activity to a rigid, non-plasticized, water-insoluble primary thermoplastic resin composition relative to the ability of water-insoluble thermoplastic carrier resins, at similar levels in a rigid, non-plasticized water-insoluble primary thermoplastic resin composition, to enable said microbicide to impart antimicrobial activity to a rigid, non-plasticized, water-insoluble primary thermoplastic resin composition. 2. a solid solution according to claim 1 wherein said microbicide is present at a level at least about 100 times the normal end-use level in a rigid primary thermoplastic resin composition. 3. a solid solution according to claim 1 wherein said microbicide is a water-insoluble microbicide. 4. a solid solution according to claim 1 wherein said microbicide is a phenoxarsine or a phenarsazine. 5. a solid solution according to claim 4 wherein said microbicide is 10,10'-oxybisphenoxarsine. 6. a solid solution according to claim 4 wherein said phenoxarsine or phenarsazine comprises at least about 1 wt. % of said solid solution. 7. a solid solution according to claim 4, wherein said phenoxarsine or phenarsazine comprises at least about 5 wt. % of said solid solution. 8. a solid solution according to claim 1 wherein said microbicide is an anti-microbial maleimide. 9. a solid solution according to claim 1 wherein said microbicide is an anti-microbial isoindole dicarboximide. 10. a solid solution according to claim 1 wherein said microbicide is an anti-microbial halogenated aryl alkanol. 11. a solid solution according to claim 1 wherein said microbicide is an anti-microbial isothiazolinone. 12. a solid, melt-blended solution consisting essentially of a water-insoluble microbicide dissolved in a carrier resin that is a copolymer of vinyl alcohol and (alkyleneoxy) acrylate and is soluble in water to at least about 1 gm. per 100 ml. of water at 25.degree. c., said microbicide comprising at least about 0.01 wt. % of said solid solution, said solid solution when placed in an aqueous medium forming a dispersion of said water-insoluble microbicide in which said carrier resin stabilizes said dispersion. 13. a solid solution according to claim 12 wherein said microbicide is a phenoxarsine or a phenarsazine. 14. a solid solution according to claim 12 wherein said microbicide is 10,10'-oxybisphenoxarsine. 15. a solid solution according to claim 12 wherein said microbicide is an anti-microbial maleimide. 16. a solid solution according to claim 12 wherein said microbicide is an anti-microbial isoindole dicarboximide. 17. a solid solution according to claim 12 wherein said microbicide is an anti-microbial halogenated aryl alkanol. 18. a solid solution according to claim 12 wherein said microbicide is an anti-microbial isothiazolinone. 19. a solid solution according to claim 12 wherein said microbicide comprises at least about 1 wt. % of said solid solution.	background of the invention it is known to protect various thermoplastic resin compositions against fungal or bacterial attack by incorporating a microbicide therein to prevent the deterioration of articles formed from the resin compositions. microbicide inhibit growth of bacteria or fungi by acting upon the cell wall or upon cell proteins, e.g., by attacking disulfide bonds. in order for the microbicide to be effective in the resin composition, it is necessary that it be compatible with the components of the resin composition and be uniformly dispersible in the resin composition. the microbicide must be carried by the resin composition in a manner that it remains biologically active against microorganisms, and, in particular, must be available at the surfaces, including internal pore surfaces. incorporation of microbicides in resin compositions is generally effective only in compositions in which the microbicide is able to slowly migrate to the surfaces. in some cases, the microbicide migrates slowly through amorphous regions of the polymer. in other cases, biocide migration is facilitated by plasticizers which are included along with the polymeric resins in end-use resin compositions. as the microbicide at the surfaces in used up through action against microorganisms, additional microbicide migrates to the surfaces. although a microbicide may be a highly toxic chemical, its low concentration in the end-use product and its retention by the resin composition ensures that the microbicide in the end-use product poses no hazard to humans or animals. microbicides must be available in a form that is readily dispersible into the formulation mix from which the end-use resin composition is fabricated. the powdered or crystalline form in which many useful microbicides are commercially available are readily dispersible; however, at the site of mixing, powdered or crystalline microbicides pose a substantial environmental and health hazard if powder or crystal fines are dispersed into the atmosphere. furthermore, powder, or powdered fines, if dispersed into the atmosphere, represent a potential explosive hazard. recognizing the toxicity problem of microbicides in powder or crystalline form, u.s. pat. no. re. 29,409 teaches dissolving microbicides in liquid solvents which may be added to the formulation mixture from which the end-use resin compositions are fabricated. although liquid dispersions may be safely used at the site of preparing end-use resin compositions, careless use or disposal of the liquids may still pose environmental and health hazards. u.s. pat. no. 4,086,297 issued apr. 25, 1978 to rei, et al., the teachings of which are incorporated herein by reference, describes solid thermoplastic microbicide resin concentrates containing immobilized microbicides. these solid microbicide resin concentrates contain relatively high concentrations of microbicides and may be added to the formulation mixtures from which the end-use resin compositions are prepared in an amount sufficient to provide the desired end-use microbicide concentrations. the solid microbicide resin concentrates, which are typically provided in the form of small pellets, can be handled freely, posing substantially no health or environmental threat. such pellets are even safe for direct skin contact. although microbicides are sufficiently immobilized and inactive in the solid microbicide resin concentrates, in softer end-use resin compositions, the low concentration microbicides at the surface have biological activity, and gradual and continuous migration to surfaces ensures continuous biological activity. where practical, a solid microbicide resin concentrate represents a preferred manner of providing a microbicide to producers of end-use thermoplastic products. u.s. pat. no. 4,789,692, the teachings of which are incorporated herein by reference, discloses blends of polymers and also copolymers and terpolymers that are particularly suitable for carrying concentrated levels of microbicides into particular thermoplastic resins. in order that inclusion of a microbicide impart biocidal activity to an end-use product, the microbicide must be available at the surface to act against microbial growth. in a flexible end-use composition, which comprises a thermoplastic resin and a plasticizer, the plasticizer commonly provides the transport mechanism for continual replenishment of incorporated microbicide to the surface of the end-use article. a typical product of this nature is a polyvinyl chloride (pvc) shower curtain which contains substantial amounts of plasticizer and sufficient microbicide to protect the shower curtain from microbial attack for an extended period of time. on the other hand, rigid polymeric materials may be afforded substantially no protection by the inclusion of microbicides because the incorporated microbicide does not migrate to the surface where it is available to act against microbial organisms. an example of this is rigid pvc, such as that for siding of houses. unlike flexible, plasticized pvc compositions, rigid, non-plasticized pvc is not particularly subject to degradation by microbial attack. nevertheless, microbial growth on the surface of such rigid polymeric material is undesirable, particularly from an aesthetic standpoint. it is a primary object of the invention to provide solid concentrates of microbicides-in-resins that can be used to provide biocidal activity to rigid thermoplastic resins. other objects and advantages will become more fully explained in the following description of the invention. summary of the invention in accordance with the invention, there are provided concentrates of microbicides in water-soluble thermoplastic resins. these concentrates can be added to rigid thermoplastic resin compositions and impart biocidal activity thereto so as to inhibit microbial growth on the surfaces thereof. a surprising and unexpected alternative use of a concentrate, in particular such a concentrate in which a water-insoluble microbicide is dissolved in a water-soluble resin, is in the preparation of a microdispersion of the microbicide in an aqueous medium. adding the concentrate to an aqueous medium dissolves the water-soluble resin and precipitates particles of the microbicide that are sufficiently minute to form a stable dispersion in the aqueous medium. such a dispersion is useful, for example, in treating textiles to impart biocidal activity thereto. detailed description of certain preferred embodiments one aspect of the present invention is directed to concentrates of microbicides in water-soluble thermoplastic resins, which concentrates are used to carry microbicides into end-use resin compositions. it is found that water-soluble thermoplastic resins promote mobility of microbicides in end-use resin compositions, promoting migration of the microbicides to surfaces (including pore surfaces) of the end-use resin compositions. it is particularly difficult to protect surfaces of rigid or glassy thermoplastic resin compositions from surface microbial growth by incorporation of microbicides, because incorporated microbicides tend to be immobilized in such compositions. when the microbicide at the surface of such a composition is depleted, it is not replenished by migration of microbicide incorporated internally, or at least not at a sufficient rate. thus, by use of the water-soluble thermoplastic resins as microbicide carriers in accordance with the invention, thermoplastic resin compositions, which heretofore could not be adequately protected by incorporating microbicides, may now be protected. concentrates according to the invention have been shown to impart biological activity to rigid compositions of polyethylene terephthalate (pet) acrylonitrile-butadiene-styrene polymer (abs), polyvinyl chloride (pvc), polyvinylidine chloride (pvdc), polycarbonate and polystyrene. rigid or glassy thermoplastic resin compositions are generally those having a glass transition temperature above room temperature, e.g., above about 25.degree. c. however, whether or not microbicide will be migratory or non-migratory in an end-use resin composition or whether, if migratory, at any appreciable rate, will depend upon a variety of factors, including the chemical composition of the resin or resins and the additives to the end-use resin composition, such as plasticizers, flow-control agents, fillers, etc. in any case, it is believed that the water-soluble thermoplastic carrier resins used in accordance with the present invention generally promote microbicide migration in end-use thermoplastic resin compositions. thus, while a particularly important application of the concentrates is to enable solid or glassy thermoplastic resins to be protected by incorporated microbicides, the concentrates have broad applications to thermoplastic resin compositions. for example, a non-rigid, thermoplastic, end-use resin composition for which a short life-span is anticipated, e.g., a garbage bag, may require less total amount of microbicide if the migration rate of the microbicide is enhanced. by aqueous-soluble thermoplastic resin is meant a thermoplastic resin which is soluble to at least about 1 gm. per 100 ml of water at 25.degree. c. and preferably at least about 5 gm. per 100 ml of water at 25.degree. c. in order to be useful as carriers of microbicides, it is necessary that the resins be thermoplastic, and in this respect, the carrier resins must each melt at a temperature below its decomposition temperature. concentrates according to the present invention are prepared by melt-blending the carrier resins and the microbicides. furthermore, to be useful as a carrier in association with any end-use thermoplastic resin composition, the carrier resin should be stable to degradation at the processing temperature of the end-use thermoplastic resin composition. in selecting a water-soluble resin as a carrier for a particular microbicide into an end-use resin composition, an important criteria is that the resin be capable of solubilizing a high concentration of the particular microbicide. in most cases, the addition of the water-soluble carrier resin is considered to be an undesirable addition to the rigid thermoplastic resin or at least imparts no advantageous properties to the end-use thermoplastic resin composition other than facilitating migration of the microbicide. to minimize levels of water-soluble resin added to the end-use resin composition, it is therefore generally considered that the higher the concentration of microbicide in the water-soluble carrier resin, the better. of course, sufficient water-soluble resin must be added to the end-use resin composition to facilitate migration of the microbicide to the surface of the end-use resin composition during the life of the end-use product; however, solubility of the microbicide in the water soluble resin is generally the limiting factor. it is usually necessary only that the microbicide be soluble in the molten water-soluble carrier resin. depending upon the particular resin, the particular microbicide and the concentration, the concentrate in solid form may have the microbicide still fully dissolved in the solidified resin. however, it is permissable for many applications that the microbicide recrystallize to some extent upon solidification of the water-soluble carrier resin. in such case, the crystals of microbicide which form will be of very small size and will distribute evenly throughout an end-use resin composition or will be of a size suitable for other applications of the present invention hereinafter discussed. a concentrate in accordance with the invention should contain at least about 20 times the concentration of microbicide that is to be present in the end-use thermoplastic resin composition, preferably at least about 100 times the end-use concentration. depending upon the microbicide, the concentrate may contain up to 1000 times the end-use concentration. the concentrate is added to the end-use resin in an amount sufficient to provide the desired concentration of microbicide to the end-use product. thus, for example, if the concentrate contains 100 times the end-use concentration of microbicide, it will be added to the thermoplastic resin of the end-use composition at a weight ratio of 1:99. the end-use concentration is that required in the end-use resin composition to prevent microbial growth thereon. the end-use concentration will vary widely, depending upon the particular microbicide used; however, selection of an appropriate end-use concentration is believed to be within the skill of one with ordinary skill in the art, particularly with reference to published activity levels of various microbicides. end-use concentrations of several commercially-available microbicides in various types of resins are given in the table below: ______________________________________ applications/use levels active ingre- pu dients vinyl olefins tpu foam eva nylon ______________________________________ obpa 0.03 to 0.05 .05 .05 0.05 0.05 0.05% t-129 .25% unk 0.25 -- na irgasan na 0.1-0.5% unk unk 0.05 0.05% (ciba geigy) kathon- 2-4 phr 0.05% unk unk 0.5% na 893 (rohm & haas) vancide 0.5% na unk unk 0.5% na pa (r. t. van- derbilt) daconil 0.5 to unk unk unk unk 2787 1% (sds biotech) preven- 0.25 to unk unk unk unk unk tol 0.5% (bayer) tbz >0.25% na unk unk na na (merck/ carbonl) zinc 0.2% unk unk unk unk unk omadine (olin) ______________________________________ the water-soluble thermoplastic resin is further selected according to the primary thermoplastic resin so that the water-soluble resin has minimal negative effects on the properties of the primary thermoplastic resin composition. in this regard, it may be advantageous that the water-soluble thermoplastic resin be chemically similar to the primary thermoplastic resin to which it is to be added. currently preferred water-soluble resin carriers are resins based primarily upon polyvinyl alcohol (pva). polyvinyl alcohols are hydrolysis products of polyvinyl acetate or another polyvinyl ester. polyvinyl alcohols, without modification, tend to be non-thermoplastic, generally having decomposition temperatures below their melting points. however, polyvinyl alcohol.tm.based resin compositions may be either externally or internally plasticized so as to exhibit thermoplastic properties. it is known for example to plasticize pva with such plasticizers as polyethylene glycol, glycerol and neopentyl glycol and thereby give pva compositions thermoplastic properties. such externally plasticized pva resins are described, for example, in u.s. pat. nos. 3,425,979 and 4,469,837, the teachings of which are incorporated herein by reference. pva copolymers and graft polymers, such as those described in u.s. pat. nos. 2,990,398, 1,971,662, 2,844,570, 3,033,841 and 4,369,281, the teachings of which are incorporated herein by reference, also exhibit thermoplastic properties. a currently preferred internally plasticized pva-based resin is a copolymer of vinyl alcohol and (alkyleneoxy)acrylate described in u.s. pat. no, 4,618,648, the teachings of which are incorporated herein by reference. such resins are sold under the trademark vinex by air products. furthermore, it is desirable that the water-soluble resin be extrudable as a means of forming pellets of the concentrate. the microbicide and water-soluble resin are blended in the extruder above the softening point of the water-soluble resin, whereupon the microbicide is dissolved in the resin. upon cooling, a solid solution (or suspension of micro crystals) of microbicide-in-resin results. typically, the concentrates are extruded as strands and divided into pellets as they solidify. the solid concentrates, like solid concentrates heretofore described, immobilize the toxic microbicide in a manner which is inherently safe to handle, as least greatly so relative to powdered microbicides. the concentrates, e.g., in pellet or ground particulate form, are added to a thermoplastic resin in the conventional manner. typically, concentrate pellets and fragmented primary thermoplastic resin are admixed along with optional additional additives in an extruder and the resin composition extruded at an appropriately elevated temperature. the end-use resin composition which results has sufficient microbicide to protect it from microbial growth and sufficient water-soluble resin to facilitate migration of the microbicide so as to provide microbicide to the surface of the end-use product over an extended lifetime. typically, the end-use resin composition contains between about 0.1 and about 5 wt. percent of the water-soluble resin. preferably, the end-use resin composition contains no more than about 1 wt. percent of the water-soluble resin. examples of the types of microbicidal compounds which may be employed in this invention include, but are not limited to, phenoxarsines (including bisphenoxarsines), phenarsazines (including bisphenarsazines), maleimides, isoindole dicarboximides having a sulfur atom bonded to the nitrogen atom of the dicarboximide group, halogenated aryl alkanols and isothiazolinone compounds. the microbicidal phenoxarsine and phenarsazine compounds useful in the compositions of this invention include compounds represented by the formulas: ##str1## where x is halogen or thiocyanate, y is oxygen or sulfur, z is oxygen or nitrogen, r is halo or lower alkyl, and n is 0 to 3. examples of these phenoxarsines and phenarsazines include, but are not limited to, 10-chlorophenoxarsine; 10-iodophenoxarsine; 10-bromophenoxarsine; 4-methyl-10-chlorphenoxarsine, 2-tert-butyl-10-chlorophenoxarsine; 1,4-dimethyl-10-chlorophenoxarsine; 2-methyl-8,10-dichlorophenoxarsine; 1,3,10-trichlorophenoxarsine; 2,6,10-trichlorophenoxarsine; 1,2,4,10-tetrachlorophenoxarsine; 10,10'-oxybisphenoxarsine (obpa); 10,10'-oxybisphenarsazine and 10,10'-thiobisphenarsazine. the microbicidal maleimide compounds useful in the compositions of this invention by a preferred maleimide, n-(2-methylnaphthyl) maleimide. the microbicidal compounds useful in the practice of this invention which are isoindole dicarboximides having a sulfur atom bonded to the nitrogen atom of the dicarboximide group are compounds which contain at least one group having the structure: ##str2## the preferred isoindole dicarboximides are the following: ##str3## bis-[(1,1,2,2-tetrachloroethyl)thio]-4-cyclohexene-1,2-dicarboximide; ##str4## n-trichloromethylthio-4-cyclohexene-1,2-dicarboximide; ##str5## n-trichloromethylthio phthalimide. the halogenated aryl alkanols which can be used as microbicidal compounds in accordance with this invention are exemplified by a preferred compound, 2,4-dichlorobenzyl alcohol. an example of a preferred isothiazolinone compound useful in the composition of this invention is 2-(n-octyl-4-isothiazolin-3-one). the most preferred microbicidal compounds are the bisphenoxarsines and bisphenarsazines having the formula: ##str6## where y is oxygen or sulfur and z is oxygen or nitrogen. of these bisphenoxarsines and bisphenarsazines, the most preferred are 10,10'-oxybisphenoxarsine, 10,10'-thiobisphenoxarsine; 10,10'-oxybisphenarsazine; and 10,10'-thiobisphenarsazine. it is generally possible to incorporate at least about 1 wt %, more preferably 2 wt. %, of a bisphenoxarsine or bisphenarsazine in pva-based, internally or externally plasticized, thermoplastic resin compositions. using the preferred copolymer of vinyl alcohol and (alkyleneoxy)acrylate described in the above-referenced u.s. pat. no, 4,618,648, it is possible to obtain up to about 5 wt. % compositions of phenarsazines and phenoxarsines dissolved in the solidified resin. concentrates containing up to about 20 wt. percent of phenarsazines and phenoxarsines are obtainable with the poly(alkyleneoxy) acrylate resin which dissolves such concentrations when molten: however, upon solidification of the resin, the microbicide comes out of solution as microcrystals suspended in the solidified resin. material comprising microbicides in water-soluble thermoplastic resin can also be used, for example, in agriculture or to protect a body of water, where a slow release of a microbicide due to the action of water is desired. the rate may be slowed even further by admixing, e.g., by melt-blending, the water-soluble concentrate with a water-insoluble resin. unlike the case where the end-use product desirably contains only a minor amount of the water-soluble concentrate, a slow-release system may contain the water-soluble resin over a very wide percentage range, e.g., from 100 wt percent of the water-soluble resin of the concentrate to about 5 wt. %. for control of the rate of release, generally, at least about 5 wt. % of a water-insoluble polymer is required, more preferably at least about 20 wt. %. generally, such a system will contain no more than about 80 wt. % of the water-insoluble resin, lest microbicide release become extremely low. (the weight percentages in this paragraph define the relative proportions of water-soluble and water-insoluble polymer; the weight of the microbicide being a relatively minor portion of the weight of a slow-release system.) as a slow-release system is an end-use application of the microbicide, the concentration of microbicide may vary over a very extended range. generally, the slow release material will contain at least 0.01 phr microbicide, preferably at least 0.1 phr, but may contain up to the limit which may be incorporated by dissolving the microbicide in molten resin. a very surprising and unexpected aspect of the present invention is that microbicides heretofore incompatible with aqueous systems can be stably dispersed into aqueous systems through use of the concentrates. a number of commonly used microbicides, particularly the phenarsazines and phenoxarsines, are insoluble in water, and furthermore are not known to form stable dispersions in water. it is found that a number of such microbicides can be incorporated into water-soluble resins as described above as true solid solutions of the microbicides in the water-soluble resins. when such concentrates are added to water or an aqueous solution, the water-soluble polymer dissolves. the microbicide which had been dissolved in the water-soluble resin is precipitated, yet the precipitate from the concentrate is so finely divided that it remains as a stable dispersion in the water or aqueous solution. water-stable dispersions of microbicides have a wide range of utility. for example, they may be used as a vehicle for imparting the microbicide to fabric, such as that which is expected to be exposed to the elements and subject to mildew, etc. water-stable dispersions may be added to water-based paints, coatings and adhesives to impart biocidal properties thereto. for preparing aqueous dispersions of a water-insoluble microbicide, it is generally desirable that the microbicide be as concentrated relative to the water-soluble resin as possible. any effect of the resin on potential end-use applications may be unpredictable, and it is therefore generally undesirable to add large amount of the resin in order to add the requisite amount of biocide. in some cases, the water-soluble resin may actually serve a purpose. for example, polyvinyl alcohol is a commonly used size for textile yarns, and a composition of pva (or a pva-based thermoplastic resin composition) and a microbicide may both size the yarns and impart biocidal characteristics thereto. however, even where the water-soluble resin itself has end-use utility, it is desirable to form concentrates and add such concentrates to additional water-soluble resin, because there is a cost of processing water-soluble resin with microbicides that is minimized by forming concentrates. a currently useful prior art composition for imparting biological activity to an aqueous-based material, such as an aqueous latex, is as follows. a water-insoluble microbicide is dissolved in an oily liquid, such as a plasticizer. using an appropriate dispersant or surfactant, the oily solution is emulsified into an aqueous medium. this material can then be added to aqueous-based compositions, such as latex paints. the concentrates in accordance with the invention is advantageous in several respects over such prior art emulsions. to begin with, the concentrates of the present invention may be shipped in dry form and used to prepare dispersions, on site, within about 24 to 48 hours of use. alternatively, the concentrates may be added directly to an aqueous system, whereupon the dispersion of the microbicide is created in situ. dry shipping is inherently a cost saving over shipping considerable volumes of water, as is the case with emulsions. dry shipping facilitates containment of any accidental spill. until added to an aqueous system, the concentrates have an indefinite shelf-life; whereas emulsions tend to eventually settle, and the settled material may be difficult to reemulsify. also in an emulsion, there may be crystal growth of the microbicide, whereupon gravity effects increase over time. an emulsion must also generally be protected during shipping and storage against freezing. all of the inherent disadvantages of emulsions are overcome with solid concentrate material useful for forming relatively stable microbicide dispersions on-site. the dispersions which are produced when the concentrates of the present invention are dissolved in water or an aqueous medium are believed to be stabilized by the extremely small particle size of the microbicide dispersion and by the carrier resin. the carrier resin inherently increases the viscosity of the water or aqueous medium and slows settling of the microcrystals. concentrates in which the microbicide is fully dissolved in the solidified carrier resin as well as those in which the microbicide is partially recrystallized in the solidified carrier resin are all suitable for forming dispersions according to the invention. it is to be noted that when the concentrate contains a carrier resin having free hydroxyl groups, as is the case with pva and pva-based resins, a dispersion prepared therefrom will tend to thicken latexes containing free carboxylic acid groups. this may be disadvantageous. however, many such carboxylic acid-containing latex compositions, such as paints, contain thickeners, and any disadvantage of thickening may be compensated by appropriately adjusting the level of thickener added. many latexes not having free carboxylic acid groups, on the other hand, are not thickened by hydroxyl group-containing carrier resins, and dispersions prepared in accordance with the invention may be used with such latex compositions without substantial modification of the formulation. concentrates of microbicides in water-soluble resins or mixtures of end-use resins may themselves be used to form end-use products that are useful for adding the microbicides to aqueous systems. for example, concentrates may be produced in film form and manufactured into water-soluble bags for use in commercial laundries. it is presently conventional in commercial laundries to add water-soluble bags containing detergents, microbicides, water softeners, etc. it may be readily appreciated that the addition of powdered microbicides to the detergent, water softener, etc., is an inherently hazardous operation. likewise, inadvertent breakage of the bag, either at the laundry or throughout the distribution system poses a potential danger to those who might inadvertently come into contact with the hazardous mixture--probably without awareness of any such hazard. a water-soluble bag for detergents etc., in which the microbicide is dissolved in the bag material itself, greatly minimizes any potential hazard. the invention will now be described in greater detail by way of specific examples. example 1 concentrates of 1%, 2% and 5% obpa in vinex 2025 copolymer of vinyl alcohol and (alkyleneoxy) acrylate were prepared. the vinex 2025 was first ground using a brinkman mill equipped with a 4 mm screen. the vinex granules were blended with the obpa in a hobart blender. the blends were then compounded using a 0.75 inch single screw extruder. the compounds processed best with extrusion temperatures of zone 1 at 165.degree. c. zone 2 at 170.degree. c., zone 3 at 175.degree. c. and the die at 180.degree. c. the extruder was equipped with a 4 inch wide sheet die. the concentrate sheets were granulated using the brabender granulator equipped with a 4 mm screen. four rigid polymer resins were used in this example. ______________________________________ 1. abs. 2. polycarbonate (pc). 3. pet from hoechst celanese. this resin is used to make polyester fibers. 4. polystyrene (ps) ps-208. a general purpose crystalline polystyrene resin from huntsman chemical. ______________________________________ four films were prepared from each rigid polymer film using the three vinex concentrates. each of these films contained 500 ppm obpa and 1%, 21/2% or 5% of vinex. an untreated control film of each resin was also prepared. films were prepared on a single screw extruder equipped with a 4 inch sheet die. extruder conditions are given below: ______________________________________ extrusive condition for rigid films abs pc pet ps ______________________________________ zone 1 (.degree.c.) 180 270 270 190 zone 2 (.degree.c.) 185 260 260 195 zone 3 (.degree.c.) 190 250 250 200 die (.degree.c.) 200 245 245 200 screw speed (rpm) 125 125 125 125 ______________________________________ the extruded films were evaluated for activity against microorganisms. results the 1% obpa in vinex 2025 processed well. the 2% obpa in vinex 2025 processed acceptably but some slippage of the compound on the extruder screw resulted in lower output the 5% obpa in vinex 2025 processed poorly with slippage of the compound on the extruder screw resulting in a loud squeaking sound and erratic output. the addition of the vinex did not affect the processing of the abs, pc or ps films. the pet samples containing vinex had to be extruded at a lower temperature than the virgin resin because of a loss of hot strength of the film. they processed well at the lower temperature. the addition of vinex to pc and ps caused them to become slightly opaque. the biological test procedures are described in table 1 below. table 1 __________________________________________________________________________ biological test on extruded films average* zone of inhibition (mm)/ growth in contact area growth of vinex obpa staphylococcus kubsiella rhodotorula rubra polymer (%) (ppm) aureus pneumoniae in agar overlay __________________________________________________________________________ abs 0 0 0/gca 0/gca hg abs 1 500 0/gca 0/gca mg abs 2.5 500 1/ngca 0/gca lg abs 5 500 3/ngca 0/gca ng pc 0 0 0/gca 0/gca hg pc 1 500 0/gca 0/gca hg pc 2.5 500 halo/ngca 0/ngca ng pc 5 500 4/ngca 2/ngca ng pet 0 0 0/gca 0/gca hg pet 1 500 0/gca 0/gca mg pet 2.5 500 0/gca 0/gca tg pet 5 500 halo/ngca 0/gca ng ps 0 0 0/gca 0/gca hg ps 1 500 halo/ngca 0/gca ng ps 2.5 500 5/ngca 2/ngca ng ps 5 500 8/ngca 3/ngca ng __________________________________________________________________________ average of 3 determinations hg = heavy growth mg = medium growth lg = light growth tg = trace growth ng = no growth ca = contact area halo = area of inhibited growth this example demonstrates that vinex is effective in improving the migration of obpa through rigid polymers. example 2 this test was done to determine the effects of a water-soluble carrier resin on the physical properties of a righd end-use resin. no microbicide was included because only physical properties were measured in this example. films of abs (cycolac t 4500) containing 0, 1, 5, 10 and 20% vinex 2025 were prepared on a lab extruder. cycolac t is the most widely used grade of general purpose abs offered by general electric. according to the manufacturer it is recognized as the standard of the abs industry. blends containing 0, 1, 5, 10 and 20% vinex 2025 in cycolac t 4500 were made in the hobart blender. films were extruded from the blends on a 0.75 inch single screw extruder equipped with a 4 inch sheet die. they were cooled and polished on chrome rolls. the films were 20 to 25 mils thick. the tensile strength was measured according to astm test method d 638 using a type iv specimen and a crosshead speed of 5 mm/min. the addition of the vinex to the abs had no effect on the processability of the films. the films containing 10% and 20% vinex had a laminar appearance when they were cut. the film with 5% vinex showed this phenomena to a very slight extent. the vinex is believed not to be miscible with the abs and is believed to form a dispersed phase within the abs continuous phase. table 2 contains the tensile strength measurements of the films. at up to 10% vinex there is very little loss of physical properties. at 20% vinex the loss in tensile is greater than 20%. table 2 ______________________________________ tensile strength of cycolac t with vinex 2025 tensile strength (psi) + % tensile strength % vinex s.d. loss ______________________________________ 0 5970 + 180 0.0 1 5410 + 280 9.4 5 5530 + 140 7.3 10 5740 + 430 3.9 20 4570 + 190 23.5 ______________________________________ example 3 5% obpa concentrates in vinex were prepared by extrusion and pelletizing to form small cylinders (1/8" diameter 1/8" height). the pellets were dissolved in various commercial latexes. the time of dissolving (in some cases), biological activity and thickening was determined. the results are given in table 3 below: table 3 ______________________________________ solubilizing latex time thickens ______________________________________ acrylics r&h rhoplex e-31 1 hour yes-slightly r&h rhoplex wl-91 no r&h rhoplex tr-407 * no r&h rhoplex ha-16 * no r&h rhoplex nw-1402 * no r&h rhoplex k-3 * no ns&c #78-6210 * no ns&c #25-4280 * no morton-lucidene 432 * no morton-lucidene 243 * no morton-lucidene 604 * no morton-lucidene polycryl 150-b * no morton-lucidene polycryl 7f-7 * no sbr (styrene/butadiene rubbers) d.g.-genflo-3049 no d.g.-genflo-3000 >1 hour yes reichold-tylac- .sup. 2 hours yes eva (ethylene vinyl acetate) air products-airflex tl-30 >1 hour yes air products-flexbond tl-35 * no pvdc (polyvinylidine chloride) b. f. goodrich-geon 650x18 >1 hour yes ______________________________________ *a preformed dispersion was added to these samples all samples exhibited biological activity while the invention has been described in terms of certain preferred embodiments, modifications obvious to one with ordinary skill in the art may be made without departing from the scope of the present invention. various features of the invention are set forth in the following claims.
164-164-327-020-694	US	[ "US" ]	G06F3/0481,G06F3/0482,G06F3/0484,H04W4/02,G06Q50/26,H04W4/021,H04W4/33,H04W4/90	2016-11-23T00:00:00	2016	[ "G06", "H04" ]	system and method for coordinating an emergency response at a facility	systems and methods are provided for coordinating an emergency response at a facility. the system includes employee's user devices (uds), an employee database that stores employee metadata, a module that stores facilities metadata, and a server system that hosts an application that interfaces with the uds and monitors their locations within the facility. when a trigger event occurs (e.g., request for help or evacuation order), the application can determine the location of at least a first ud of an employee and identification information for the employee based on employee metadata. based on facilities metadata, the application can generate a floorplan that includes an icon that represents the location of the first ud within the facility and the identification information. some of the employees are members of an emergency response team (ert). the floorplan can be displayed at the ert member's uds along with other information that helps ert members coordinate the emergency response.	1 . a method, comprising: monitoring, via an application, locations of user devices of employees that are located within a virtual boundary around a perimeter of a facility; determining, in response to occurrence of a trigger event, a location of a first user device within the facility; determining, from an employee management service that operates in conjunction with an employee database, identification information associated with an employee who is associated with the first user device; generating, via the application working in conjunction with a facility space management module, a floorplan of a particular floor located within the facility, wherein the floorplan includes an icon that represents the location of the first user device and the identification information associated with the employee; displaying, at each of a plurality of second user devices, the floorplan via a user interface of that second user device, wherein each of the second user devices is associated with a member of an emergency response team (ert); and coordinating a response by the members of the ert based on inputs to the application via the members of the ert. 2 . a method according to claim 1 , wherein the trigger event is receipt of an alert message from the first user device by the application, and further comprising: generating the alert message in response to employee interaction with a user interface of the first user device, wherein the alert message indicates that the employee who is associated with the first user device has requested help from the ert; displaying a floorplan on the user interface of the first user device, wherein the floorplan includes: the icon that represents the location of the first user device on the particular floor located within the facility, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; and continuously updating a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility. 3 . a method according to claim 1 , wherein the trigger event is receipt of an alert message by the application from the first user device, wherein the alert message indicates that the employee who is associated with the first user device has requested help from the ert, wherein the alert message is generated in response to employee interaction with a user interface of the first user device, and further comprising: upon receiving the alert message at each of the plurality of second user devices, presenting via a user interface an option to each member of the ert to confirm whether that member wants to respond to a request for help from the employee who is associated with the first user device, wherein each member that confirms that member wants to respond to the request for help is an ert responder-member; for each ert responder-member: displaying a floorplan on a user interface of the second user device of that ert responder-member, wherein the floorplan includes: the icon that represents the location of the first user device on a particular floor located within the facility, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; and continuously updating a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility. 4 . a method according to claim 3 , further comprising: displaying a role assignment screen on a user interface of the second user device of each ert responder-member, wherein the role assignment screen prompts each ert responder-member to select their role in responding to the request for help; assigning each ert responder-member a role in responding to the request for help based on a selection by that ert responder-member via interaction with the role assignment screen; generating, via the application, a plurality of entries each comprising the role of each ert responder-member in responding to the request for help; and publishing, via the application, the entries that describe the role of each ert responder-member in a notifications feed page. 5 . a method according to claim 4 , further comprising: publishing messages, via the application, in the notifications feed page, wherein the messages comprise: any notifications regarding status of the employee or the ert responder-members; and any activity information about ert responder-members involved in responding to this request for help. 6 . a method according to claim 3 , further comprising: publishing, via the application, messages in a group chat page, wherein the messages comprise: any messages from the employee and the ert responder-members. 7 . a method according to claim 1 , wherein determining a location of a first user device within the facility; further comprises: determining the location of the first user device within the facility based on global positioning system (gps) coordinates of the first user device and floor information that indicates which floor of the facility the first user device is located on, wherein the floor information is determined by the application based on information from the first user device that identifies at least one beacon that has a known location within the facility. 8 . a method according to claim 1 , wherein the trigger event is receipt of an indicator by the application that indicates that employees are to evacuate the facility, and wherein determining further comprises: determining, in response to occurrence of the trigger event, locations of a plurality of first user devices within the facility; sending, via the application, an alert message that indicates that employees who are located in the facility are to be evacuated, wherein each of the employees is associated with one of the first user devices; upon receiving the alert message at each of a plurality of second user devices, presenting via a user interface at each of the second user devices an option to each member of the ert to confirm whether that member wants to respond to a request to help evacuate the facility, wherein each member that confirms that member wants to respond to the request is an ert responder-member; for each ert responder-member: displaying a floorplan on a user interface of the second user device of that ert responder-member, wherein the floorplan includes: icons that represent the locations of the first user devices on a particular floor located within the facility that is in proximity to that ert responder-member, icons that represent locations of any exits on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; continuously updating, within the floorplan, positions of the icons that represent the locations of the first user devices and positions of the icons that represent locations of the second user devices of any ert responder-members who are still present on that particular floor of the facility; generating, via the application in response to input from one of the ert responder-members, a message that identifies a particular employee who has not evacuated in compliance with the evacuation order and that provides a location of that employee within the facility; and sending the message to an emergency services responder who will be assisting with evacuation of the facility. 9 . a method according to claim 1 , wherein the input from one of the ert responder-members includes selecting an icon that identifies that particular employee via a user interface of the second user device associated with that ert responder-member. 10 . a server system comprising a processor and a memory, wherein the memory comprises computer-executable instructions that are capable of execution by the processor, and that when executed by the processor, cause the server system to: monitor locations of user devices of employees that have been determined to be located within a virtual boundary around a perimeter of a facility; determine, in response to occurrence of a trigger event, a location of a first user device within the facility; determine, based on employee metadata, identification information associated with an employee who is associated with the first user device; generate, based on facilities metadata, a floorplan of a particular floor located within the facility, wherein the floorplan includes an icon that represents the location of the first user device on a particular floor located within the facility and the identification information associated with the employee, wherein the floorplan is displayed at a user interface of each of a plurality of second user devices associated with a member of an emergency response team (ert); coordinate a response by members of the ert in response to inputs from the members of the ert. 11 . a server system according to claim 10 , wherein the trigger event is receipt of an alert message from the first user device, wherein the alert message indicates that the employee who is associated with the first user device has requested help from the ert, wherein the floorplan further includes: icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility, and wherein the computer-executable instructions further cause the server system to: continuously update a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; generate a notifications feed page that includes information regarding a role of each ert responder-member in responding to the request for help, any notifications regarding status of the employee or the ert responder-members; and any activity information about ert responder-members involved in responding to this request for help; and generate a group chat page that publishes any messages from the employee and the ert responder-members while the request for help is active. 12 . a server system according to claim 10 , wherein the trigger event is receipt of an indicator that indicates that employees are to evacuate the facility, and wherein the computer-executable instructions further cause the server system to: determine locations of a plurality of first user devices within the facility in response to occurrence of the trigger event, and send an alert message that indicates that employees who are located in the facility are to be evacuated, wherein each of the employees is associated with one of the first user devices, wherein the floorplan includes: icons that represent the locations of each of the first user devices on a particular floor located within the facility that is in proximity to that ert responder-member, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; continuously update a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are still present on that particular floor of the facility; generate, in response to selection of an icon that identifies that particular employee by one of the ert responder-members, a message that identifies a particular employee who has not evacuated in compliance with the evacuation order and that provides a location of that employee within the facility; and send the message to an emergency services responder who will be assisting with evacuation of the facility. 13 . a system, comprising: a plurality of user devices of employees, wherein the user devices comprise at least one first user device and second user devices is associated with a member of an emergency response team (ert); an employee database that stores employee metadata; an employee management service that operates in conjunction with the employee database; a facility space management module configurable to store facilities metadata; a server system configurable to host an application configurable to interface with the plurality of user devices, wherein the application is configurable to: monitor locations of user devices of employees that are located within a virtual boundary around a perimeter of a facility; determine, in response to occurrence of a trigger event, a location of a first user device within the facility; determine, based on employee metadata from provided from the employee management service, identification information associated with an employee who is associated with the first user device; generate, based on facilities metadata from facility space management module, a floorplan of a particular floor located within the facility that includes an icon that represents the location of the first user device and the identification information associated with the employee; and wherein each of the second user devices is configurable to display the floorplan via a user interface, and wherein the application is configurable to coordinate a response by the members of the ert based on inputs to the application by the members of the ert. 14 . a system according to claim 13 , wherein the trigger event is receipt of an alert message by the application from the first user device, wherein the alert message indicates that the employee who is associated with the first user device has requested help from the ert, wherein the alert message is generated in response to employee interaction with a user interface of the first user device, wherein the user interface of the first user device is configurable to display a floorplan that includes: the icon that represents the location of the first user device on the particular floor located within the facility, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility, and wherein the application is configurable to continuously update a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility. 15 . a system according to claim 13 , wherein the trigger event is receipt of an alert message by the application from the first user device, wherein the alert message indicates that the employee who is associated with the first user device has requested help from the ert, wherein the alert message is generated in response to employee interaction with a user interface of the first user device, wherein each of the plurality of second user devices is configurable to: present via a user interface, upon receiving the alert message, an option to each member of the ert to confirm whether that member wants to respond to a request for help from the employee who is associated with the first user device, wherein each member that confirms that member wants to respond to the request for help is an ert responder-member; wherein each of the plurality of second user devices for each ert responder-member is configurable to: display, via the user interface of the second user device of that ert responder-member, a floorplan that includes: the icon that represents the location of the first user device on a particular floor located within the facility, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; and wherein the application is configurable to continuously update a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility. 16 . a system according to claim 15 , wherein each of the plurality of second user devices for each ert responder-member is configurable to: display, via the user interface of the second user device of that ert responder-member, a role assignment screen on a user interface of the second user device of that ert responder-member, wherein the role assignment screen prompts each ert responder-member to select their role in responding to the request for help; and wherein the application is configurable to: assign each ert responder-member a role in responding to the request for help based on a selection by that ert responder-member via interaction with the role assignment screen; generate a plurality of entries each comprising the role of each ert responder-member; and publish the entries that describe the role of each ert responder-member in a notifications feed page. 17 . a system according to claim 16 , wherein the application is configurable to: publish messages in the notifications feed page, wherein the messages comprise: any notifications regarding status of the employee or the ert responder-members; and any activity information about ert responder-members involved in responding to this request for help. 18 . a system according to claim 15 , wherein the application is configurable to: publish any messages from the employee and the ert responder-members in a group chat page. 19 . a system according to claim 13 , wherein the application is configurable to: determine the location of the first user device within the facility based on global positioning system (gps) coordinates of the first user device and floor information that indicates which floor of the facility the first user device is located on, wherein the floor information is determined by the application based on information from the first user device that identifies at least one beacon that has a known location within the facility. 20 . a system according to claim 13 , wherein the trigger event is receipt of an indicator by the application that indicates that employees are to evacuate the facility, and wherein the application is configurable to: determine locations of a plurality of first user devices within the facility in response to occurrence of the trigger event, and send an alert message that indicates that employees who are located in the facility are to be evacuated, wherein each of the employees is associated with one of the first user devices; wherein each of the plurality of second user devices is configurable to: present via a user interface, upon receiving the alert message, an option to each member of the ert to confirm whether that member wants to respond to a request for help evacuate the facility, wherein each member that confirms that member wants to respond to the request is an ert responder-member; wherein each of the plurality of second user devices for each ert responder-member is configurable to: display, via the user interface of the second user device of that ert responder-member, a floorplan that includes: icons that represent the locations of the first user devices on a particular floor located within the facility that is in proximity to that ert responder-member, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the second user devices of any ert responder-members who are present on that particular floor of the facility; and wherein the application is configurable to: continuously update a position of the icon that represents the location of the first user device within the floorplan and positions of the icons within the floorplan that represent locations of the second user devices of any ert responder-members who are still present on that particular floor of the facility; and generate, in response to selection of an icon by one of the ert responder-members, a message that identifies a particular employee who has not evacuated in compliance with the evacuation order and that provides a location of that employee within the facility; and send the message to an emergency services responder who will be assisting with evacuation of the facility, wherein the icon identifies that particular employee via a user interface of the second user device associated with that ert responder-member.	technical field embodiments of the subject matter described herein relate generally to coordinating an emergency response at a facility, and, more particularly, to computer implemented methods, computer systems and mobile applications for coordinating an emergency response at a facility. background many companies today have large facilities where their employees work, and it is common for employees to spend time at more than one physical location within a facility. in many cases companies have facilities that are distributed geographically, and the employees who are at a given facility can vary at any particular time. unexpected events such as illness, injuries, extreme weather, fires, earthquakes, gas leaks and political instability are just some of the factors that can create emergency situations or events. as such, each facility can have dedicated group of employees who are part of an emergency response team (ert). members of the ert act as first responders when an emergency occurs at their facility. the ert members are trained to ensure their peers and colleagues reach safety and receive medical help if needed. when an emergency occurs one challenge that ert members face is communicating with other members of the ert to execute a coordinated response (e.g., in conducting floor sweeps for building evacuations, and giving emergency medical care to any injured employees). ert members need to be able to communicate with employees to alert them that a potential emergency is in progress, and inform them what type of action is required on their part to reach safety. it can be difficult for employees to locate distressed employee and contact them. it can also be difficult for employees to communicate their location and safety status with ert members, and/or request assistance in situations where they need help. it would be desirable to provide a system that can improve communication between ert members and employees when an emergency occurs. it would also be desirable to provide systems that can help coordinate efforts of ert members so that ert members can act quickly in a coordinated way. it would also be desirable to provide systems that let ert members know each other's status and that give them the ability to request assistance if needed. brief description of the drawing figures a more complete understanding of the subject matter may be derived by referring to the detailed description and claims when considered in conjunction with the following figures, wherein like reference numbers refer to similar elements throughout the figures. fig. 1 illustrates a block diagram of an example system in which the disclosed embodiments may be implemented. fig. 2 is a stack diagram that describes how the emergency response application integrates with apis, platform services, data sources and infrastructure in accordance with an embodiment. fig. 3 is a schematic block diagram of a user device in accordance with an embodiment. fig. 4a is a flow diagram of an exemplary method performed by an emergency response application in accordance with an embodiment. figs. 4b through 4d illustrate various elements of a system used in conjunction with the emergency response application to determine the locations of employees in accordance with an embodiment. fig. 5 is a flow diagram of an exemplary method performed by an emergency response application when an employee sends a distress call in accordance with an embodiment. figs. 6a through 6d that illustrate different screen shots of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. fig. 7 is a flow diagram of an exemplary method performed by an emergency response application when members of an emergency response team (ert) receive a distress call in accordance with an embodiment. figs. 8a through 8c that illustrate different screen shots of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. fig. 9 is a flow diagram of an exemplary method performed by an emergency response application when an ert member selects a notifications icon in accordance with an embodiment. fig. 10 that illustrates a screen shot of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. fig. 11 is a flow diagram of an exemplary method performed by an emergency response application when an ert member selects a group chat icon in accordance with an embodiment. fig. 12 that illustrates a screen shot of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. fig. 13 is a flow diagram of an exemplary method performed by an emergency response application when an order to evacuate the facility is issued to employees including ert members in accordance with an embodiment. figs. 14a through 14c that illustrate different screen shots of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. fig. 15 illustrates a block diagram of an example environment that may be used to implement the embodiments described herein. fig. 16 illustrates a block diagram of another example environment that may be used to implement the embodiments described herein. detailed description systems and methods are provided for coordinating an emergency response at a facility. the system includes employee's user devices, an employee database that stores employee metadata, a module that stores facilities metadata, and a server system that hosts an application that interfaces with the user devices and monitors their locations within a facility. when a trigger event occurs, the application can determine the location of at least a first user device and identification information for an employee who is associated with the first user device based on employee metadata. based on facilities metadata, the application can generate a floorplan that includes an icon that represents the location of the first user device within the facility. some of the employees are members of an emergency response team (ert). the ert members are a selected group of employees who have been designated as first responders. the floorplan can be displayed at the ert member's user devices along within other information that helps ert members coordinate the emergency response in one embodiment, an emergency response application (or app) is provided that can be used by employees with wireless communication devices (e.g., smartphones) to help coordinate their response efforts when an emergency occurs at a facility. when an emergency event or situation arises, the emergency response application facilitates real-time communication between ert members and employees to help improve employees' situational awareness. the emergency response application can simultaneously activate ert members and alert employees to the type of emergency in progress. the emergency response application provides employees and ert members with real-time actionable information in the event of public safety emergencies. it also allows employees to request assistance in real-time. the emergency response application can provide ert members with real-time response and collaboration tools to assist them in conducting floor sweeps for building evacuations, and giving first response emergency medical care to injured employees. the emergency response application can also provide employees with information needed to reach safety, and allow them to communicate their location and status with ert members. the emergency response application can also interface with local 911 emergency services, and provides ert members with the ability to effectively communicate with local emergency medical services (ems) personnel. among other things, the emergency response application provides ert members with mapping technologies that allow them to determine employee location and safety status so that ert members can pinpoint location of each employee and determine if he/she is safe. the emergency response application also interfaces with proprietary corporate employee management services for identification of distressed employees and to access floorplan layouts, and also leverages existing smart-phone technologies, such as bluetooth technologies (e.g., bluetooth low energy (ble)), ibeacon positioning and gps geofencing technologies to locate each employee within a building and determine if they are in a safe zone. for example, the emergency response application can interface with proprietary corporate employee management services to access employee metadata required to identify each employee, and use smart-phone technologies to locate each person within the context of a building's floor plan. the emergency response application can provide employees with directions to the nearest emergency exits, building safe-zones and if required, can allow them to request assistance from an ert member, or call 911. upon entering a safe zone, the emergency response application allows employees to easily and quickly report their compliance with the order to exit the facility. fig. 1 illustrates a block diagram of an example system 110 in which the disclosed embodiments may be implemented. fig. 1 and the following discussion are intended to provide a brief, general description of one non-limiting example of an example environment in which the embodiments described herein may be implemented. those skilled in the art will appreciate that the embodiments described herein may be practiced with other computing environments. system 110 may include user devices 112 , a network 114 , a server system system 116 , a processor system 117 , an emergency response application 126 , and system data storage 124 for storing system data 125 . in other embodiments, system 110 may not have all of the components listed and/or may have other elements instead of, or in addition to, those listed above such as laptop computers, desktop personal computers, workstations, etc. for ease of illustration, fig. 1 shows one block for each of the processor system 117 and system data storage 124 . these blocks 117 , 124 may represent multiple processor systems and system data storage units, respectively. the user devices 112 are communicatively coupled to the server system 116 over the network 114 . each user device 112 is portable or mobile meaning that they can be stationary or moving at any particular time. without limitation, a user device 112 may be any communications device such as a smartphone or other cellular phone, desktop, laptop or palmtop computer, tablet computer, a personal digital assistant (pda), any wireless access protocol (wap) enabled device, or any other bluetooth enabled device. in this regard, it is noted that as used herein, a smartphone refers to a mobile telephone built on a mobile operating system with more advanced computing capability and connectivity than a feature phone. in addition to digital voice service, a modern smartphone has the capability of running applications and connecting to the internet, and can provide a user with access to a variety of additional applications and services such as text messaging, e-mail, web browsing, still and video cameras, mp3 player and video playback, etc. many smartphones can typically include built in applications that can provide web browser functionality that can be used display standard web pages as well as mobile-optimized sites, e-mail functionality, voice recognition, clocks/watches/timers, calculator functionality, pda functionality including calendar functionality and a contact database, portable media player functionality, low-end compact digital camera functionality, pocket video camera functionality, navigation functionality (cellular or gps), etc. in addition to their built-in functions, smartphones are capable of running an ever growing list of free and paid applications that are too extensive to list comprehensively. in one embodiment, the server system 116 can be a cloud-based server system, and in one implementation, can be an on-demand database services system that implements a cloud platform. the system data storage 124 includes a database for storing metadata including employee and facilities metadata. the processor system 117 of server system 116 is configured to execute a emergency response application 126 that provides various different functions via a distress call receiving module 134 , a distress call processing module 136 , and an evacuation module 138 . the application 126 and its various modules perform various functions in conjunction with corresponding client-side functionality at user devices 112 as will be described in greater detail below with reference to corresponding client-side functionality provided at the user devices 112 . fig. 2 is a stack diagram that illustrates how the emergency response application 126 integrates with other technologies, services, apis, and data sources in accordance with an embodiment. the stack 200 include the emergency response application 126 , a platform 205 that include application programming interfaces (apis) 210 and mobile platform services 220 that the emergency response application 126 works in conjunction with, and database and infrastructure 230 that the emergency response application 126 utilizes to perform various functions that will be described below. the apis can include, for example, a geolocation api, an employee management api and messaging apis. the geolocation api allows an employee to provide their location to the emergency response application 126 if they so desire. for privacy reasons, the employee is asked for permission to report location information. for example, the geolocation api returns a location and accuracy radius based on information about cell towers and/or wifi nodes that a mobile client can detect. the employee management api allows an employee to provide the emergency response application 126 with access to employee information if they so desire. in some embodiments, for privacy reasons, the employee is asked for permission to use their employee information. the mobile platform services 220 can include geolocation services, facilities management services, employee management services, and messaging services. an example of a facilities management service can be, for example, cloud-based space planning software application provided by serraview, inc. an example of an employee management service can be, for example, human capital management applications provided by workday, inc. the database and infrastructure 230 can include an employee information database 232 , a facility space management module and floorplan database 234 that stores data for facilities of an organization that is utilized by the facilities management service, servers, virtualization and server hardware 236 , storage 238 that can store other data (e.g., data relating to events that take place during an emergency response or evacuation), and networking infrastructure 240 . the emergency response application 126 uses geolocation services to identify the real-world geographic location of a user device (i.e., a set of geographic coordinates). for example, the geolocation services can provide gps coordinates when a gps signal is available, or in cases where it is not, can use information from cell towers to triangulate the approximate position. in some embodiments, geolocation services can determine location of a user device using positioning systems (e.g., rfid, bluetooth including ble or ibeacon, wifi positioning systems) that process data associated with beacons (e.g., rfid, bluetooth including ble beacons or ibeacons, wifi beacons) that are communicated from devices at known locations throughout the facility. in some embodiments, geolocation services can determine location of a user device using other information associated with a particular employee such as desk location, and in facilities where employees must scan a badge to enter any floor in a facility, geolocation services can determine location of a user device using last badge-in information to help determine which floor a particular user device is located on. as will be described below, in the disclosed embodiments, the emergency response application 126 can use the geographic coordinates of the user device in conjunction with the floorplans provided by the facility space management module and floorplan database 234 to determine a meaningful location on a particular floor of a facility with reference to how space on that floor is allocated and laid out (e.g., where desks, cubicles, conference rooms, bathrooms, kitchens, entrances, exits, etc. are located on a particular floor). in addition, as will also be explained below, the emergency response application 126 can use the employee management services, that operate in conjunction with the employee information database 232 , to access employee information about the employee who is associated with the user device. this employee information can be stored in employee information database 232 as employee metadata. the employee information can include, but is not limited to, human resource management information such as regular work location, current work location, work schedule, title, contact information, etc. the emergency response application 126 uses the messaging services to communicate with employees, and for communications between ert members. for instance, the emergency response application 126 uses messaging services to allow ert members to communicate with each other. the emergency response application 126 uses messaging services to send push notifications to employees (e.g., evacuations orders or other information to an employee who is in distress, etc.). for example, messaging services can be used to create and send push messages to user devices of employees who have the emergency response application 126 and are located within boundaries of a geo-fenced region that corresponds to the facility. fig. 3 is a schematic block diagram of a user device in accordance with an embodiment. fig. 3 will be described with reference to fig. 1 . the user device 112 can include one or more processing system(s) 302 , main memory 304 , a network interface device (nid) 310 , a chipset 312 , a bluetooth low energy (ble) interface 311 , global positioning system (gps) interface 313 , input systems 316 , and audio output systems 318 , audio input systems 320 , and a display 322 with a user interface 324 . it will be appreciated that the user device 112 may not include all of the components shown in fig. 3 , may include other components that are not explicitly shown in fig. 3 , or may utilize an architecture completely different than that shown in fig. 3 . the chipset 312 is usually located on a motherboard of the user device 112 . the chipset 312 is a set of electronic components (e.g., in an integrated circuit) that interconnects and manages the data flow between the processing system(s) 302 and other elements of the user device 112 and any peripherals that are connected to the user device 112 . for instance, the chipset 312 provides an interface between the processing system(s) 302 and the main memory 304 , and also includes functionality for providing network connectivity through the nid 310 , such as a gigabit ethernet adapter. the chipset 312 typically contains the processor bus interface (also known as a front-side bus), memory controllers, bus controllers, i/o controllers, etc. processing system(s) 302 represents one or more general-purpose processing devices such as a microprocessor, central processing unit, or the like. more particularly, the processing system(s) 302 may be a complex instruction set computing (cisc) microprocessor, reduced instruction set computing (risc) microprocessor, very long instruction word (vliw) microprocessor, or a processor implementing other instruction sets or processors implementing a combination of instruction sets. the processing system(s) 302 may also be one or more special-purpose processing devices such as an application specific integrated circuit (asic), a field programmable gate array (fpga), a digital signal processor (dsp), network processor, or the like. the processing system(s) 302 can include one or more central processing units (“cpus”) that operate in conjunction with the chipset 312 . the processing system(s) 302 perform arithmetic and logical operations necessary for the operation of the user device 112 . the processing system(s) 302 can perform the necessary operations by transitioning from one discrete, physical state to the next through the manipulation of switching elements that differentiate between and change these states. switching elements may generally include electronic circuits that maintain one of two binary states, such as flip-flops, and electronic circuits that provide an output state based on the logical combination of the states of one or more other switching elements, such as logic gates. these basic switching elements may be combined to create more complex logic circuits, including registers, adders-subtractors, arithmetic logic units, floating-point units, and the like. the nid 310 can connect the user device 112 to other computers over the network 114 . the network 114 can be an ethernet or gigabyte ethernet lan, a fiber ring, a fiber star, wireless, optical, satellite, a wan, a man, or any other network technology, topology, protocol, or combination thereof. each user device 112 is bluetooth-enabled meaning that it includes a bluetooth module and bluetooth antenna, and can implement all known bluetooth standards and protocols including a bluetooth low energy (ble) protocol. bluetooth technical specifications are developed and published by the bluetooth special interest group (sig). bluetooth core specification version 4.2, adopted dec. 2, 2014, core specification supplement (css) v1 adopted dec. 27, 2011, core specification addendum (csa) 2 adopted dec. 27, 2011, core specification supplement (css) v2 adopted jul. 24, 2012, core specification addendum (csa) 3 adopted jul. 24, 2012, core specification addendum (csa) 4 adopted feb. 12, 2013, core specification addendum (csa) 5 adopted dec. 15, 2015, describe various features of the ble standards, and are incorporated by reference herein in their entirety. copies of any of the incorporated core specifications, including the bluetooth specification version 4.0, can be obtained from the bluetooth special interest group (sig) by contacting them in writing at bluetooth special interest group, 5209 lake washington blvd nebr., suite 350, kirkland, wash. 98033, usa, or by visiting their website and downloading a copy. bluetooth core specification version 4.2 includes classic bluetooth, bluetooth high speed (hs) protocols and bluetooth low energy (ble). each user device 112 includes bluetooth module (not illustrated) that includes both a classical bluetooth interface and a ble interface 311 . the terms “ble interface,” “ble chipset,” “ble module” can be used interchangeably herein. in general, a bluetooth module includes a bluetooth controller and a host (not illustrated in fig. 3 ) as defined in the any of the bluetooth communication standards that are incorporated by reference herein. the ble interface 311 generates signals to be transmitted via the bluetooth antenna, and also receives signals transmitted from other bluetooth-enabled devices via the bluetooth antenna. the ble interface 311 implements a ble protocol stack that is optimized for occasional connections that allow for longer sleep times between connections, small data transfers, very low duty cycles and simpler topology than classic bluetooth devices. when the ble interface 311 is in the idle state, the ble interface 311 scans for incoming ble beacons or advertisement messages from another bluetooth-enabled device. by contrast, when the ble interface 311 is in the active state, the ble interface 311 is communicating with (or connected to) another bluetooth-enabled device and measures proximity to that bluetooth-enabled device. in addition, each ble interface 311 includes a signal processing module that can be used in conjunction with a proximity detection/determination module that processes information from signals received by the bluetooth antenna to determine signal strength information, and in some implementations, to determine the approximate distance between the source of those signals that particular bluetooth module. in one embodiment, the signal processing module can determine/measure signal strength information (e.g., a received signal strength indicator (rssi)) associated with signals communicated from another bluetooth module. in one implementation, the signal processing module can generate a reporting message that includes the signal strength information, and provide it to a proximity determination module that can compare the signal strength information to one or more thresholds to determine the proximity to the other bluetooth module. rssi is just one exemplary metric that can be used to determine proximity. alternatively, any other link quality indicators, such as a bluetooth proximity profile, can be used to determine the distance between two bluetooth-enabled devices. the proximity profile is defined in the ble standard. the proximity profile uses a number of metrics including signal strength information, state of the battery charge, whether a device is connected, etc. to characterize the proximity of one ble enabled device to another ble enabled device. the gps interface 313 is a device for establishing a global position of the user device 112 . the gps interface 313 includes a processor and one or more gps receivers that receive gps radio signals via an antenna (not illustrated). these gps receivers receive differential correction signals from one or more base stations either directly or via a geocentric stationary or leo satellite, an earth-based station (e.g., cellular base station) or other means. this communication may include such information as the precise location of a user device 112 , the latest received signals from the gps satellites in view, and other information. input system(s) 316 (or input device(s)) allow the user to input information to the user device and can include things such as a keyboard, a mouse or other cursor pointing device, a pen, a webcam device, etc. audio output system(s) 318 (or output device(s)) present information to the user of the user device and can include things such as speakers, or the like. audio input system(s) 320 (or input device(s)) can include a voice input device and can include things such as microphones and associated electronics that are used by the user of the user device to input audio information. the display 322 and it's user interface 324 provide a touch screen that functions as both a touch input device and a visual output system. all of these systems/devices are well known in the art and need not be discussed at length here. the chipset 312 can provide an interface to various forms of computer-readable storage media including a main memory 304 (e.g., read-only memory (rom), flash memory, dynamic random access memory (dram) such as synchronous dram (sdram)), and hard disk. the hard disk is a form of non-volatile memory that stores operating system (os) software that is copied into ram and executed by the processing system(s) 302 to control the operation of the user device 112 , manage computer hardware and software resources, and provide common services for computer programs executed by the processing system(s) 302 . the operating system makes the different parts of the user device 112 work together. the processing system(s) 302 can communicate with the various forms for computer-readable storage media via the chipset 312 and appropriate buses. the main memory 304 may be composed of many different types of memory components. the main memory 304 can include non-volatile memory (such as read-only memory (rom) 306 , flash memory, etc.), volatile memory (such as random access memory (ram) 308 ), or some combination of the two. the ram 308 can be any type of suitable random access memory including the various types of dynamic random access memory (dram) such as sdram, the various types of static ram (sram). the main memory 304 (as well as the processing system(s) 302 ) may be distributed throughout the user device 112 . the rom 306 of the main memory 304 can be used to store firmware that includes program code containing the basic routines that help to start up the user device 112 and to transfer information between elements within the user device 112 . the rom of the main memory 304 may also store other software components necessary for the operation of the user device 112 . the ram 308 stores programs/instructions 330 or executable code for one or more programs that can be loaded and executed at processing system(s) 302 to perform various functions. the programs/instructions 330 are computer readable program code that can be stored in ram 308 (or other a non-transitory computer readable medium of the user device 112 ) that can be read and executed by processing system(s) 302 to perform various acts, tasks, functions, and steps as described herein. a few non-limiting examples of programs/instructions 330 that are stored in the ram 308 include a browser application 332 and a distress call sending module 334 , a distress call processing module 336 , and an evacuation module 338 in accordance with the embodiments described herein. the user device 112 can download the distress call sending module 334 , the distress call processing module 336 , and the evacuation module 338 as part of an application from a server (or online “store”) and load it into ram 308 . as is known in the art, the browser application 332 includes various functional modules including a user interface that includes a main window and various parts of the browser display such as the address bar, back/forward button, bookmarking menu etc., a browser engine which server as an interface for querying and manipulating one or more instances of rendering engine that is responsible for displaying the requested contents on a browser screen, a networking module used for network calls, a javascript interpreter that is used to parse and execute the javascript code, user interface backend, a data storage or persistence layer that is used to save data, including cookies, on the hard disk, etc. when executed by the processing system(s) 302 , the browser application 332 can be used for retrieving, presenting, and traversing information resources on the internet. the browser application 332 brings information resources to the user (“retrieval” or “fetching”), allowing them to view the information (“display”, “rendering”), and then access other information (“navigation”, “following links”). an information resource is identified by a uniform resource identifier (uri/url) and may be a web page, image, video or other piece of content. hyperlinks present in resources enable users easily to navigate to related resources. the distress call sending module 334 corresponds to and interacts with the distress call receiving module 134 of the server system 116 . when executed by the processing system 302 , the distress call sending module 334 can perform various functions as will be described below with reference to figs. 5 and 6a-6d . when an employee wants to send a distress call to request help from the ert, the employee launches the emergency response application at their user device and interacts with the user interface to send a request for help to the distress call receiving module 134 that is hosted at the server system, which can then send an alert message to user devices associated with ert members. the employee can cancel this request at any time if desired. in one embodiment, the distress call sending module 334 can generate and send out push notifications to the user devices 112 of ert members regarding a request for help from an employee. in one embodiment, the distress call sending module 334 can broadcast these push notifications to the user devices 112 that are associated with ert members so that all ert members are aware of that employee's request for help. in another embodiment, the distress call sending module 334 can send targeted push notifications to selected ones of the user devices 112 so that only those ert members within a certain proximity are made aware of the employee's request for help. this way not every ert member in the organization will receive every push notification, but only those that are in proximity. the distress call processing module 336 corresponds to and interacts with the distress call processing module 136 of the server system 116 . when executed by the processing system 302 , the distress call processing module 336 can perform various functions that will be described below with reference to figs. 7, 8a-8c and 9-12 . the distress call processing module 336 displays an alert message at the user interface of each ert member's user device that indicates that a particular employee is requesting help or assistance from the ert. the distress call processing module 336 can also display messages that give each ert member an option to confirm whether that member wants to respond to the employee's request for help, or dismiss the alert message. the distress call processing module 336 provides the employees and ert members with detailed floorplans that show locations of each employee and ert member who is at a particular location (e.g., on a particular floor). for instance, the distress call processing module 336 can also display a floorplan via the user interface that includes various icons that represent the locations of employee(s) including ert members on a particular floor of the facility. in one embodiment, the distress call processing module 336 can also display identifiers for each employee on the screen that includes the floorplan, either automatically or in response to user interaction with icons that appear on the floorplan ui. the distress call processing module 336 can continuously update the position of these icons on the floorplan that is displayed on the ui so that the locations of user devices of the employee(s) and ert members within the floorplan are up to date. the distress call processing module 336 can also provide various ui features that help coordinate the response of the ert members who are responding to a call. the distress call processing module 336 allows ert members to communicate their willingness to respond to an employee's request for help and can provide functionality that allows ert members to be assigned specific roles in responding to the request for help. for example, the distress call processing module 336 can provide a role assignment screen that includes prompts that allow each ert responder-member to select their role in responding to the request for help, and then based on the responses, can publish the role of each ert responder-member as an entry in a notifications feed page so that ert members know what their respective roles are in responding to the employee's request for help. this helps coordinate response efforts among the ert responder-members so that each ert responder-member knows their role and associated tasks in the response effort. the distress call processing module 336 can also can also provide other information in the notifications feed page including messages that provide notifications regarding status of the employee or the ert responder-members, and/or any activity information about or concerning ert responder-members who are involved in responding to this request for help. this allows the employee and/or ert members to communicate feedback messages (e.g., comments, questions, answers) on a notification feed page or group chat feed page as part of an interactive chat session that it is accessible by any other ert members who are responding to the help request. this allows the users to interactively communicate in real-time and exchange messages via a common forum. the evacuation module 338 corresponds to and interacts with the evacuation module 138 of the server system 116 . upon execution of the evacuation module 338 , the processing system 302 executes instructions to perform various functions that will be described below with reference to figs. 13 and 14a-14c . the evacuation module 338 of the user device 112 , and the evacuation module 138 of the server system 116 provide a system for ensuring that the employee has evacuated the facility when an evacuation order is issued. for example, when an indictor (e.g., message, command or instruction) is received that indicates that employees have been ordered to evacuate the facility, the evacuation module 138 of the server system 116 generates an alert message that is sent or pushed to user devices of all of the employees that are located in the facility that indicates to the employees that they are to evacuate the facility. the evacuation module 338 can present an alert message that gives each ert member an option to dismiss a request to help evacuate the facility, or confirm that member wants to respond and help with evacuation of the facility. to assist ert responder-members in determining which employees are still located in the facility, the evacuation module 338 can present a floorplan via a ui of the user devices 112 that identifies locations of any employees that remain in the facility (e.g., on a particular floor that the ert responder-member is helping evacuate or is in proximity to or located on). the evacuation module 338 continuously updates the positions of the icons within the floorplan so that as the evacuation takes place, positions of the icons that represent the locations of the user devices 112 of the employees who are still present in the facility will be updated. this way, the ert responder-members can quickly and easily determine who remains inside the facility on that floor. as employees leave a floor that a particular ert responder-member is responsible for helping evacuate, the floorplan will be updated so that the ert responder-member can determine which employees and still need to be evacuated. this way the ert responder-member can find specific employees who still need to be evacuated, and can leave the facility once he/she knows all employees have been evacuated. the evacuation module 338 also allows ert members to input information that indicates identity and location of any employee(s) who has/have not complied with the evacuation order, automatically generate a message that identifies the particular employee who has not evacuated in compliance with the evacuation order and the current location of that non-compliant employee within the facility, and then send this message to other such as a head of the ert, ert responder-members, all ert members, the employee's manager, emergency responders (e.g., police, firemen, etc.) who are (or will be) assisting with the evacuation of the facility, etc. for instance, in one embodiment, any ert member can select via a user interface of their user device an icon or button displayed within the floorplan that represents and identifies any employee who has not complied with the evacuation order. prior to describing further details of distress call sending, receiving and processing with reference to figs. 5-12 and evacuation with reference to figs. 13 and 14a-14c , a general description of the emergency response application and various technologies used to implement various features of the emergency response application will now be described below in greater detail with reference to figs. 4a-4d . fig. 4a is a flow diagram of an exemplary method 400 performed by an emergency response application in accordance with an embodiment. the method 400 will be described with reference to figs. 1 through 3 and figs. 4b through 4d , which illustrate various elements of a system used in conjunction with the emergency response application to determine the locations of employees. in one embodiment, the emergency response application utilizes bluetooth low energy (ble) technology that is available in most consumer smartphones, along with a beacon positioning (e.g., ibeacons) and gps geo-fencing to create a dynamic local area network that utilizes each employee's phone. for example, as illustrated in figs. 4b-4d , beacon positioning devices 430 , such as ibeacons, can be placed strategically throughout the facility 425 , for example, near exits, or where emergency equipment or first aid equipment is located so that employees can use the emergency response application to quickly and easily find key locations that become important during an emergency situation. the terms ibeacon and beacon are used interchangeably herein. as is known in the art, ibeacon is the name for a technology standard by apple®, which allows mobile applications (running on both ios and android devices) to listen for signals from beacons in the physical world and react accordingly. in essence, ibeacon technology allows mobile applications to understand their position on a micro-local scale, but the underlying communication technology is ble. any employee can have a user device 112 , such as a smartphone that is configured to run the emergency response application 126 . each user device 112 can interact with a server system to run or execute the emergency response application. an employee can have a variety of different roles within a company or organization, and some employees are also part of an emergency response team (ert). each ert member is a first responder when other employees request help or assistance in an emergency situation. the emergency response application 126 can be used by ert members to provide decentralized real-time assistance during emergency events. the method 400 begins at 402 , where the emergency response application 126 monitors locations of user devices 112 of employees that are located within a virtual boundary around a perimeter of a facility. any user devices 112 running the emergency response application can be recognized as being within the virtual boundary around the perimeter the facility or as being outside that virtual boundary. in one embodiment, as illustrated in fig. 4b , the virtual boundary is defined using geofencing technologies to define a geo-fence region 420 around the perimeter of the facility 425 . the emergency response application 126 recognizes whenever an employee enters or exits the geo-fence region 420 , and keeps track of which employees remain within the geo-fence region 420 . when an emergency event or situation occurs in which it is advisable for employees to exit the facility, members of the emergency response team have an easy way to know who remains inside the facility versus who has left the facility, and also where the located within in the facility (if they remain within the facility). for instance, in the example shown in fig. 4b , the user device 112 - 1 of an employee named sharon smith has not yet entered the geo-fence region 420 (e.g., is located outside the geo-fence region 420 ). then, as shown in fig. 4c , after the user device 112 - 1 of sharon smith has entered the geo-fence region 420 (e.g., is located inside the geo-fence region 420 ), the emergency response application 126 can determine that she is present in the facility 425 , and can display an icon that represents the location of her user device 112 - 1 within the facility 425 . likewise, in fig. 4b , when the user device 112 - 2 of an employee named john henderson has left the geo-fence region 420 , the emergency response application 126 can determine that his user device 112 - 2 is no longer present in the facility 425 . when the user device 112 - 2 of john henderson enters the geo-fence region 420 , as shown in fig. 4c , the emergency response application 126 can determine that he is present in the facility 425 , and can display an icon that represents the location of is user device 112 - 2 within the facility 425 . in response to occurrence of a trigger event at 404 , the emergency response application 126 can determine (at 406 ) a location of user devices 112 within the facility, and determine identification information associated with each employee having a user device 112 within the facility (as define by the virtual boundary). for example, as shown in fig. 4c , when a trigger event occurs, the emergency response application 126 can determine the location of user devices 112 - 1 . . . 112 - 4 that are located within the facility, and can continuously update the location of each user device as they move into, within or outside of the facility (e.g., in fig. 4c the user device 112 - 1 of sharon smith has moved within the facility 425 , whereas the user device 112 - 4 has moved from within the facility 425 to a parking lot that is outside the facility 425 and outside the geo-fence region 420 ). this allows ert members to quickly and easily determine which employees are located within the facility, and where they are located within a particular floor of the facility. the different types of trigger events can vary. for example, the trigger event could be the issuance of an evacuation order in response to a public safety emergency such as a fire, earthquake, hurricane, terrorist attack, etc. in other cases, the trigger event can occur when an employee makes a call or request for help in an emergency situation (e.g., employee is injured, disabled, trapped in a room, etc.). an example of both scenarios is illustrated in fig. 4d . in this example, an evacuation order has been issued and an employee associated with a user device 112 - 3 has requested help (e.g., the employee is trapped, injured, or disabled and can't exit the facility). in one embodiment, the location of each user device 112 within the facility can be determined based on gps coordinates of the user device 112 in combination with floor information that indicates which floor of the facility the user device 112 is located on. for example, any time an employee's user device enters the geo-fence region 420 , the emergency response application 126 can report the user device's gps coordinates to a location service that keeps track of where each employee's user device is within the facility. updates regarding the device's gps coordinates can be sent to the location service periodically, or in response to an event, etc. further, in one implementation, the emergency response application 126 can determine the floor information based on information from the first user device 112 that identifies at least one beacon (e.g., ibeacon) that has a known location within the facility 425 . this way, the emergency response application can determine the location of the employee's user device in terms of gps coordinates and a particular floor within the facility. in the event the facility 425 consists of a single floor then gps coordinates would be enough to determine the employee location without having to use beacons. however, as will be described below, use of beacons is still useful in that it can help employees locate things like exits, emergency equipment and first aid equipment. in another embodiment, if gps coordinates are not available, the location of a particular user device can be determined based on signal strength measurements (rssi) provided from three or more beacons located on a particular floor of the facility that have known fixed coordinates. for example, the approximate distance of a user device from a particular beacon can be determined based on a signal strength measurement of a signal from that beacon. this can be done for each beacon to determine distance from three beacons that are at known locations on a particular floor of the facility. using this information, the user device can compute, using triangulation processing, the approximate position or location of the user device based on its distance from the three (or more) fixed beacons, and the floor that the user device is located on is known based on the fact that each beacon is known to be located on a particular floor of the facility. in one embodiment, identification information associated with each employee who is associated with a user device 112 within the facility 425 can be determined using an employee management service that operates in conjunction with an employee information database that includes metadata about each employee such as job title, office location within this facility, work hours, date of birth, emergency contacts, whether the employee suffers from any disability or medical condition, etc. in some embodiments, corporate employee management services can be used to identify any employee within the geo-fence region 420 . for example, as illustrated in fig. 4c , when the user device 112 - 1 of sharon smith enters the geo-fence region 420 , an icon can be displayed that represents sharon smith's user device 112 - 1 within a floorplan, and by selecting that icon other information about sharon smith can be viewed including identification information, which in this non-limiting example includes her name, title (i.e., a project manager), her employee id, hire date and home building where she is normally located. likewise, as shown in fig. 4c , when the user device 112 - 2 of john henderson leaves the geo-fence region 420 , an icon can be displayed that represents the location of john henderson's user device 112 - 2 , and that when selected can display information about john henderson including identification information, which in this non-limiting example includes his name, title, employee id, hire date and home building. at 408 , the emergency response application 126 can then generate, by working in conjunction with a facility space management module and floor plan database 234 , a floorplan of a particular floor located within the facility 425 . at a minimum, the floorplan includes a map of a particular floor of a facility 425 (or a portion thereof), along with icons that represent the location of each user device 112 located on that particular floor. by selecting any icon that represents a particular user device, information about that employee whom that user device belongs to can be displayed (including identification information associated with the employee). this floorplan can be displayed on user devices 112 of the employees including those who are ert members. by displaying the floorplan via a user interface, ert members can locate employees, for example, when help is requested or an emergency situation occurs and evacuation of the facility is ordered. for example, as shown in fig. 4c , in a situation where an issue an order is issued to evacuate the facility, a floorplan can be displayed that will illustrate the locations of the nearest exits 430 , first aid equipment 440 and other emergency response equipment 450 , which are determined based on beacons mounted near those exits 430 , first said equipment 440 and other emergency response equipment 450 . this way employees can quickly and easily find the closest exit 430 evacuate the building. as another example shown in fig. 4d , when an employee (james edwards) associated with user device 112 - 3 requests help, ert members associated with user devices 112 - 1 , 112 - 2 can receive a notification message that is displayed via the user interface of her/his user device 112 - 1 , 112 - 2 . the notification can indicate that a particular employee (james edwards) has requested help and show where his user device 112 - 3 is located within the facility 425 , and can also provide identification information as discussed above. this way employees and ert members, such as sharon smith and james edwards, can quickly and easily locate any equipment 440 , 450 needed to aid james edwards, who is in distress, and if necessary find the closest exit 430 remove him from the building. at 410 , icons that are displayed within the floorplan can be continuously updated. this can include updating the locations or positions of icons within the floorplan that represent employees (including ert members) who are on a particular floor of a facility 425 . for example, as employees move about the floor, the locations or positions of icons that represent employees (including ert members) can be updated to reflect their current position. this way, if the employee moves from one location to another, the location of that employee will be updated so that the ert member can find the employee. in addition, when new employees enter that particular floor of the facility new icons with corresponding identification information can be added. for example, as shown in fig. 4c , in a situation where an issue an order is issued to evacuate the facility, the employees' locations with respect to the floorplan are continuously updated as they move in response to the evacuation order. when the employee associated with user device 112 - 4 exits the building and moves into the parking lot his location will be updated as shown. likewise when the employee, sharon smith, associated with user device 112 - 1 moves within the facility 425 her location will be updated as shown, whereas employees associated with the user devices 112 - 2 , 112 - 3 remain the same because they have not moved. when employees associated with the user devices 112 - 2 , 112 - 3 remain the same because they have not moved. at 412 , the emergency response application 126 can receive input from the ert members, and then based on inputs to the emergency response application 126 , automatically coordinate a response by the ert members. examples of input received from the ert members that is used to coordinate a response will be described in greater detail below. fig. 5 is a flow diagram of an exemplary method 500 performed by an emergency response application when an employee sends a distress call in accordance with an embodiment. the method 500 will be described with reference to figs. 1 through 3 and figs. 6a through 6d that illustrate different screen shots of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. it should be appreciated that the examples in figs. 6a-6d are non-limiting and simply illustrate exemplary implementations. the method 500 begins at 502 , where an employee launches the emergency response application at their user device by interacting with icon 610 ( fig. 6a ). here the user interaction can be selecting the icon via a touch movement, a voice command, or any other type of user input that can be used to activate the emergency response application. the method 500 proceeds to 504 , where the emergency response application 126 displays a help request button 620 on the user interface of the user device as shown in fig. 6b . when the employee interacts with (e.g., selects, pushes or otherwise activates) the help request button 620 , the emergency response application (e.g., hosted at the server system) receives or generates an alert message. the server system then pushes the alert message to user devices associated with ert members who are in proximity to the employee. the alert message indicates that the employee who is associated with a user device 112 has requested help from the ert. generation of this alert message and its communication to the server system and other user devices is one example of a trigger event. at 506 , the emergency response application hosted at the server system can also generate and display other information at the user devices associated with ert members. for example, the emergency response application can also generate and display other information as illustrated in fig. 6c at the user interface of the user device of the employee. in this example, the emergency response application 126 can generate and display a screen that includes a confirmation button 622 and a cancellation button 624 . as shown at 510 of fig. 5 , the employee can select the confirmation button 622 to confirm that the employee's location as displayed on a floorplan is correct. if the employee's location as displayed on a floorplan is incorrect, the employee can then move (at 512 ) the location of an icon (e.g., a pin) that represents the employee's location to the correct location on the floorplan to change the location of the icon that represents the employee's position, and then select the confirmation button 622 . this way ert members can more easily locate the employee when responding to the employee's request of help. in one embodiment, following 512 or 514 , the method 500 loops to keep checking with the employee to confirm the employee's location is correct until the employee cancels the request for help at 508 by selecting the cancellation button 624 (yes at 518 ). this way the employee's request will not be inadvertently disregarded in scenarios where employee submit requests at the same time. at 508 , the employee can select the cancellation button 624 at any time to cancel or end his/her request for help (at 518 ). this feature is helpful in situations where the employee inadvertently sent an alert message, or in cases where the employee has already been helped by an ert member, or in cases where the emergency situation or event has ceased. for example, when the request for help or rescue is complete the employee can select the cancellation button 624 ( fig. 6c ), which causes the emergency response application to end the request for help at 518 . in addition, at 506 , the emergency response application can also generate and display a map of a floorplan (also referred to herein as a “floorplan”) that is displayed at user devices of ert members. for example, in one non-limiting embodiment, the floorplan of a particular floor located within the facility can include an icon that represents the location of the employee's user device, icons that represent locations of any exits on that particular floor of the facility, icons that represent locations of any emergency response equipment located on that particular floor of the facility, and icons that represent locations of the user devices of any ert responder-members who are present on that particular floor of the facility. for instance, one implementation of a floorplan that can be displayed at the user interface of a user device of an employee who is sending a request for help is illustrated in fig. 6d . in this example, the floorplan can include a map of a particular floor of the facility where the employee is located. the floorplan can include the layout of any entries or exits, walls, office partitions, windows, doors, desks, equipment, cubicles, walkways, etc. the emergency response application 126 also adds various icons to the floorplan that can include an icon that represents the location of the employee's user device 112 on that particular floor, and icons that represent locations any ert responder-member's user devices who are present on that particular floor of the facility. in this particular example, the floorplan also shows three icons 630 , 640 that represent the locations of user devices, where ert member's user devices are represented via icons 630 , and where the employee's user device is represented by icon 640 . the floorplan can also include icons for a variety of other information, such as, icons that represent locations of any exits on that particular floor of the facility, and other icons that represent locations of any emergency response equipment located on that particular floor of the facility, etc. it should be appreciated that the example in fig. 6d is non-limiting and simply illustrates one exemplary implementation. in this embodiment, the floorplan can be displayed on the user interface of the user devices 112 to show the employee and other ert members the response of ert responder-members (i.e., ert members who are responding to the employee's request for help). as the ert members respond, the emergency response application 126 continuously updates (at 514 of fig. 5 ) the positions of the icons within the floorplan that represent locations of the employee's user device and the user devices 112 of any ert responder-members who are present on that particular floor of the facility. fig. 7 is a flow diagram of an exemplary method 700 performed by an emergency response application when members of an ert receive a distress call in accordance with an embodiment. the method 700 will be described with reference to figs. 1 through 3 and figs. 8a through 8c that illustrate different screen shots of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. it should be appreciated that the examples in figs. 8a-8c are non-limiting and simply illustrate exemplary implementations. the method 700 begins at 702 , when ert members receive an alert message that is displayed at the user interface of each ert member's user device, as shown, for example, in fig. 8a . as described above with reference to fig. 5 , this alert message indicates that a particular employee is requesting help or assistance from the ert, and can be communicated to ert members when the employee requests help by interacting with the emergency response application via the user device that is associated with that employee. in one embodiment, illustrated in fig. 8a , upon receiving the alert message, the emergency response application 126 can display a screen (via a user interface at each of the ert member's user devices) that gives each ert member an option (at 704 ) to confirm whether that member wants to respond to the employee's request for help. in fig. 8a , this is illustrated by the options to either dismiss the alert message (via button 820 ) or respond to the alert message (via button 830 ). each member that confirms that he/she wants to respond to the request for help is an ert responder-member (also referred to herein as a “responder” member). each member that dismisses the alert message (or confirms that he/she does not want to or cannot respond to the request for help is a “non-responder” member with respect to that request for help). it should be appreciated that the example in fig. 8a is non-limiting and simply illustrates one exemplary implementation. at 706 , for each ert responder-member, a floorplan can be displayed on a user interface of their that ert responder-member's user device as illustrated in fig. 8b . in one embodiment, the floorplan can include any of the icons described above with reference to fig. 6d and 506 of fig. 5 . it is desirable if the floorplan includes locations of any exits and any emergency or first aid equipment since that type of information may be important to ert members who are arriving at the scene if such equipment is needed to aid the employee who requested help. as also noted above, the emergency response application 126 can continuously update the position of the icon that represents the location of the employee's user device 112 within the floorplan, as well as the positions of the icons that represent locations of the ert member's user devices 112 that are present on that particular floor of the facility. thus, via the icons that are displayed on the ui of the emergency response application, the employee and ert members know the location of the employee's user device within the floorplan and locations of the user devices of any ert responder-members who are responding to the request for help. at 708 , at the user interface of each ert responder-member's user device 112 , a role assignment screen can be displayed as shown, for example, in fig. 8c . the role assignment screen can include prompts that allow each ert responder-member to select their role in responding to the request for help. for instance, in the non-limiting example illustrated in fig. 8c , the role assignment screen, which is labeled check-in, includes a button 860 that allows an ert responder-member to select the role of incident command, a button 870 that allows an ert responder-member to select the role of incident scribe, and a button 880 that allows an ert responder-member to select the role of emergency services coordinator. although not illustrated options for other roles can be displayed depending on the implementation. further, in some implementations, selection of button 880 can automatically place a call to emergency services responders such as a police department, fire department, etc., or may simply designate a particular ert member as being the lead point of contact in coordinating interactions with such emergency service responders. it should be appreciated that the example in fig. 8c is non-limiting and simply illustrates one exemplary implementation. based on the selections by each ert responder-member at 710 , for example via interaction with the role assignment screen (e.g., selecting a button via touch or voice), the emergency response application 126 can assign each ert responder-member a role in responding to the employee's request for help. at 712 , the emergency response application 126 can then publish the role of each ert responder-member as an entry in a notifications feed page (not illustrated in fig. 8c ) so that ert members know who the ert responder-members are and what their respective roles are in responding to the employee's request for help. in addition, as will be described below, the emergency response application 126 can also other information in the notifications feed page including messages that provide notifications regarding status of the employee or the ert responder-members, and/or any activity information about or concerning ert responder-members who are involved in responding to this request for help. this helps coordinate response efforts among the ert responder-members so that each ert responder-member knows their role and associated tasks in the response effort. fig. 9 is a flow diagram of an exemplary method 900 performed by an emergency response application when an ert member selects a notifications icon in accordance with an embodiment. the method 900 will be described with reference to figs. 1 through 3 and fig. 10 that illustrates a screen shot of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. it should be appreciated that the example in fig. 10 is non-limiting and simply illustrates one exemplary implementation. the method 900 begins at 902 , when an ert member selects a notifications icon 1010 , which causes the emergency response application 126 to generate a notifications feed page 1020 that can be displayed via a user interface at the ert member's user device. an ert member can select the notifications icon 1010 at any time after the emergency response application 126 has been activated or has been launched. in addition, other employees can also select the icon 1010 if they are the employee that submitted a request for help. in one implementation, other non-ert member employees who did not submit the request for help, but who are in close proximity to the employee who did submit the request for help can also select the notifications icon 110 and view the notifications feed page 1020 . the emergency response application 126 can publish a wide variety of information and notification messages within the notifications feed page 1020 including the role of each ert responder-member (as described above), and any other types of information and notification messages that might be of interest to the employee or ert members including ert responder-members. for example, the emergency response application 126 can publish messages that include information or notifications regarding status of the employee or any of the ert responder-members, or messages that include any activity information about ert responder-members and emergency services personnel involved in responding to the employee's request for help. for example, notification status messages can include things such as role check-ins by ert responder-members, information about employees who were determined to be non-compliant in response to an evacuation order, time of a 911 call and name of caller, id and location of an employee who made a distress call, etc. fig. 11 is a flow diagram of an exemplary method 1100 performed by an emergency response application when an ert member selects a group chat icon in accordance with an embodiment. the method 1100 will be described with reference to figs. 1 through 3 and fig. 12 that illustrates a screen shot of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. it should be appreciated that the example in fig. 12 is non-limiting and simply illustrates one exemplary implementation. the method 1100 begins at 1102 , when an ert member selects the group chat icon 1210 ( fig. 12 ), which causes the emergency response application 126 to generate a group chat page 1220 that can be displayed via a user interface at the ert member's user device. an ert member can select the group chat icon 1210 at any time after the emergency response application 126 has been activated or launched. in addition, other employees can also select the group chat icon 1210 if they are the employee that submitted a request for help. the group chat page 1220 provides a forum that allows the employee who submitted the request for help and the ert members to communicate with each other as a group. as such, in one embodiment, the emergency response application 126 can publish messages within the group chat page 1220 from employees, ert members and other emergency responders. for example, in one implementation, the emergency response application 126 can publish any messages from the employee who submitted a request for help and the ert responder-members who are involved in responding to that request for help. the group chat page 1220 along with other features, such as the notifications page 1020 and interactive floorplans, can help ert members efficiently coordinate their response to an employee's request for help. fig. 13 is a flow diagram of an exemplary method 1300 performed by an emergency response application when an order to evacuate the facility is issued to employees including ert members in accordance with an embodiment. the method 1300 will be described with reference to figs. 1 through 3 and figs. 14a-14c that illustrate different screen shots of a user interface of a user device in accordance with an exemplary implementation of the disclosed embodiments. it should be appreciated that the examples in figs. 14a-14c are non-limiting and simply illustrate exemplary implementations. as explained above, the emergency response application 126 can continuously monitor the locations of all the user devices 112 that are located within a geofenced region that corresponds to the boundaries of the facility. when the emergency response application 126 receives an indictor (e.g., message, command or instruction) that indicates that employees have been ordered to evacuate the facility, the method 1300 begins at 1302 , where the emergency response application 126 generates an alert message that is sent or pushed to user devices of all of the employees that are located in the facility (e.g., have or are associated with user devices 112 that are located within a geofenced region that corresponds to the boundaries of the facility). the alert message indicates to the employees that all of the employees are to evacuate the facility. at 1304 , as was described above with reference to step 704 of fig. 7 , the emergency response application 126 can determine which ert members team want to respond and help evacuate the facility. for example, as shown in fig. 14a , the emergency response application 126 can present an alert message 1410 via the user interface of a user device of each ert member. the alert message can give each ert member an option to dismiss (via button 1420 ) a request to help evacuate the facility, or confirm (via button 1430 ) that member wants to respond and help evacuate the facility. any ert member team who confirms that he/she wants to respond and help evacuate the facility (by selecting button 1430 ) are referred to below as a “ert responder-member.” although all employee should evacuate when they receive the alert message, in some cases, an employee may be unable to evacuate or may choose to ignore the order to evacuate. to assist ert responder-members in determining which employees are still located in the facility, at 1306 , the emergency response application 126 can generate and continuously update a floorplan that is presented via a user interface of the user devices 112 of ert responder-members. an example of a floorplan is shown in fig. 14b . the floorplan helps the ert responder-members identify any employee that remain in the facility on a particular floor. in one embodiment, the floorplan includes icons that represent the locations of all user devices 112 on a particular floor located within the facility that ert responder-member is in proximity to or located on. certain icons that represent locations of the user devices 112 of any ert responder-members who are present on that particular floor of the facility in a way that is distinguishable from icons that represent locations of the user devices 112 of regular employees who are present on that particular floor of the facility, which are distinguishable from icons that represent locations of any exits on that particular floor of the facility, etc. in this particular example shown in fig. 14b , the floorplan also shows seven icons 1440 , 1450 that represent the locations of user devices, where the user devices of the employees are represented by five icons 1440 , and where user devices of the ert responder-members are represented via two icons 1450 that have different symbols for purposes of differentiating between regular employees and ert responder-members. as described above, the emergency response application 126 continuously updates the positions of the icons within the floorplan. thus, as the evacuation takes place, positions of the icons that represent the locations of the user devices 112 of the employees and any ert responder-members (who are still present on that particular floor of the facility) will be updated so that the ert responder-members can quickly and easily determine who remains inside the facility on that floor. in the event all of the ert responder-members have left a particular floor of the facility, then the floorplan and information regarding employees who remain on that particular floor can be sent to all ert members so that they can act on or provide that information to others who are involved in the evacuation process. for example, in one embodiment, at 1308 , any of the ert members can input information that indicates identity and location of any employee(s) who has/have not complied with the evacuation order. for instance, in one embodiment, any ert member can select via a user interface of their user device an icon or button displayed within the floorplan that represents and identifies any employee who has not complied with the evacuation order. in response to that information, at 1310 , the emergency response application 126 can automatically generate a message that identifies the particular employee who has not evacuated in compliance with the evacuation order, and send this message to emergency responders. depending on the implementation, the emergency response application 126 can automatically send this message to ert responder-members, all ert members, and/or emergency services responders (e.g., police, firemen, etc.) who are (or will be) assisting with the evacuation of the facility. a non-limiting example of the message is shown in fig. 14c . in this example, the message 1460 includes a photo or picture that identifies the non-compliant employee, the name of the non-compliant employee, title of the non-compliant employee, and emergency contact information for the non-compliant employee; however, it should be appreciated that the message 1460 can also include any other identification or personal information associated with that non-compliant employee that is not illustrated in fig. 14 c for sake of simplicity. although not illustrated, this message 1460 can include other information associated with that non-compliant employee such as the current location of that non-compliant employee within the facility, the normal desk or office location of that non-compliant employee within the facility, etc. fig. 15 illustrates a block diagram of an example environment 1510 where a database service might be used, and which may be used to implement the embodiments described herein. environment 1510 may include user devices 1512 , network 1514 , system 1516 , processor system 1517 , application platform 1518 , network interface 1520 , tenant data storage 1522 , system data storage 1524 , program code 1526 , and process space 1528 . in other embodiments, environment 1510 may not have all of the components listed and/or may have other elements instead of, or in addition to, those listed above. environment 1510 is an environment in which an on-demand database service exists. user device 1512 may be any machine or system that is used by a user to access a database user device. for example, any of user devices 1512 can be a handheld computing device, a mobile phone, a laptop computer, a work station, and/or a network of computing devices. as illustrated in fig. 15 (and in more detail in fig. 16 ) user devices 1512 might interact via a network 1514 with an on-demand database service, which is system 1516 . system 1516 may also be referred to as a cloud service provider. system 1516 provides its resources to customers (e.g., end users) as a service. an on-demand database service, such as system 1516 , is a database system that is made available to outside users who do not need to necessarily be concerned with building and/or maintaining the database system, but instead may be available for more general use when the users need the database system (e.g., on the demand of the users). some on-demand database services may store information from one or more tenants stored into tables of a common database image to form a multi-tenant database system (mts). accordingly, “on-demand database service 1516 ” and “system 1516 ” will be used interchangeably herein. a database image may include one or more database objects. a relational database management system (rdms) or the equivalent may execute storage and retrieval of information against the database object(s). application platform 1518 may be a framework that allows the applications of system 1516 to run, such as the hardware and/or software, e.g., the operating system. in an embodiment, system 1516 may include an application platform 1518 that enables creating, managing, and executing one or more applications developed for an on-demand database service, for users accessing the on-demand database service via user devices 1512 , or for third party application developers accessing the on-demand database service via user devices 1512 . the users of user devices 1512 may differ in their respective capacities, and the capacity of a particular user device 1512 might be entirely determined by permissions (permission levels) for the current user. for example, where a salesperson is using a particular user device 1512 to interact with system 1516 , that user device has the capacities allotted to that salesperson. however, while an administrator is using that user device to interact with system 1516 , that user device has the capacities allotted to that administrator. in systems with a hierarchical role model, users at one permission level may have access to applications, data, and database information accessible by a lower permission level user, but may not have access to certain applications, database information, and data accessible by a user at a higher permission level. thus, different users will have different capabilities with regard to accessing and modifying application and database information, depending on a user's security or permission level. network 1514 is any network or combination of networks of devices that communicate with one another. for example, network 1514 can be any one or any combination of a local area network (lan), wide area network (wan), telephone network, wireless network, point-to-point network, star network, token ring network, hub network, or other appropriate configuration. as the most common type of computer network in current use is a transfer control protocol and internet protocol (tcp/ip) network, such as the global internetwork of networks often referred to as the “internet” with a capital “i.” that network will be used in many of the examples herein. however, it should be understood that the networks used with the embodiment described herein use are not so limited, although tcp/ip is a frequently implemented protocol. user devices 1512 might communicate with system 1516 using tcp/ip and, at a higher network level, use other common internet protocols to communicate, such as hypertext transfer protocol (http), file transfer protocol (ftp), andrew file system (afs), wireless application protocol (wap), etc. in an example where http is used, user device 1512 might include an http client commonly referred to as a “browser” for sending and receiving http messages to and from an http server at system 1516 . such an http server might be implemented as the sole network interface between system 1516 and network 1514 , but other techniques might be used as well or instead. in some implementations, the interface between system 1516 and network 1514 includes load sharing functionality, such as round-robin http request distributors to balance loads and distribute incoming http requests evenly over a plurality of servers. at least as for the users that are accessing that server, each of the plurality of servers has access to the mts' data; however, other alternative configurations may be used instead. in one embodiment, system 1516 , shown in fig. 15 , implements a web-based customer relationship management (crm) system. for example, in one embodiment, system 1516 includes application servers configured to implement and execute crm software applications as well as to provide related data, code, forms, webpages and other information to and from user devices 1512 . the application servers are also configured to store to, and retrieve from, a database system related data, objects, and webpage content. with a multi-tenant system, data for multiple tenants may be stored in the same physical database object. tenant data may be arranged such that data of one tenant is kept logically separate from that of other tenants so that one tenant does not have access to another tenant's data, unless such data is expressly shared. in certain embodiments, system 1516 implements applications other than, or in addition to, a crm application. for example, system 1516 may provide tenant access to multiple hosted (standard and custom) applications, including a crm application. user (or third party application developer) software applications, which may or may not include crm, may be supported by the application platform 1518 , which manages the creation and storage of the applications into one or more database objects, and executing of the applications in a virtual machine in the process space of the system 1516 . the terms “application,” “software application,” “software package,” “software code,” and “program code” are used interchangeably. one arrangement for elements of system 1516 is shown in fig. 15 , including a network interface 1520 , application platform 1518 , tenant data storage 1522 for tenant data 1523 , system data storage 1524 for system data 1525 accessible to system 1516 and possibly multiple tenants, program code 1526 for implementing various functions of system 1516 , and a process space 1528 for executing mts system processes and tenant-specific processes, such as running applications as part of an application hosting service. additional processes that may execute on system 1516 include database indexing processes. several elements in the system shown in fig. 15 include conventional, well-known elements that are explained only briefly here. for example, each user device 1512 could be a cellular telephone, such as a smartphone, laptop computer, tablet computer, desktop personal computer, workstation, pda, or any wireless access protocol (wap) enabled device or any other computing device capable of interfacing directly or indirectly to the internet or other network connection. user device 1512 typically runs an http client, e.g., a browsing program, such as google's chrome browser, microsoft's internet explorer browser, netscape's navigator browser, opera's browser, or a wap-enabled browser in the case of a cell phone, pda or other wireless device, or the like, allowing a user (e.g., subscriber of the multi-tenant database system) of user device 1512 to access, process and view information, pages and applications available to it from system 1516 over network 1514 . each user device 1512 also typically includes one or more user interface devices, such as a keyboard, a mouse, trackball, touch pad, touch screen, pen or the like, for interacting with a graphical user interface (gui) provided by the browser on a display (e.g., a monitor screen, liquid crystal display (lcd) monitor, etc.) in conjunction with pages, forms, applications and other information provided by system 1516 or other systems or servers. for example, the user interface device can be used to access data and applications hosted by system 1516 , and to perform searches on stored data, and otherwise allow a user to interact with various gui pages that may be presented to a user. as discussed above, embodiments are suitable for use with the internet, which refers to a specific global internetwork of networks. however, it should be understood that other networks can be used instead of the internet, such as an intranet, an extranet, a virtual private network (vpn), a non-tcp/ip based network, any lan or wan or the like. according to one embodiment, each user device 1512 and all of its components are operator configurable using applications, such as a browser, including computer code run using a central processing unit such as an intel pentium® processor or the like. similarly, system 1516 (and additional instances of an mts, where more than one is present) and all of their components might be operator configurable using application(s) including computer code to run using a central processing unit such as processor system 1517 , which may include an intel pentium® processor or the like, and/or multiple processor units. a computer program product embodiment includes a machine-readable storage medium (media) having instructions stored thereon/in which can be used to program a computer to perform any of the processes of the embodiments described herein. computer code for operating and configuring system 1516 to intercommunicate and to process webpages, applications and other data and media content as described herein are preferably downloaded and stored on a hard disk, but the entire program code, or portions thereof, may also be stored in any other volatile or non-volatile memory medium or device as is well known, such as a read-only memory (rom) or random-access memory (ram), or provided on any media capable of storing program code, such as any type of rotating media including floppy disks, optical discs, digital versatile disk (dvd), compact disk (cd), microdrive, and magneto-optical disks, and magnetic or optical cards, nanosystems (including molecular memory integrated circuits (ics)), or any type of media or device suitable for storing instructions and/or data. additionally, the entire program code, or portions thereof, may be transmitted and downloaded from a software source over a transmission medium, e.g., over the internet, or from another server, as is well known, or transmitted over any other conventional network connection as is well known (e.g., extranet, virtual private network (vpn), lan, etc.) using any communication medium and protocols (e.g., tcp/ip, http, https, ethernet, etc.) as are well known. it will also be appreciated that computer code for implementing embodiments can be implemented in any programming language that can be executed on a client system and/or server or server system such as, for example, c, c++, html, any other markup language, java™, javascript, activex, any other scripting language, such as vbscript, and many other programming languages as are well known may be used. (java™ is a trademark of sun microsystems, inc.). according to one embodiment, each system 1516 is configured to provide webpages, forms, applications, data and media content to user (client) systems 1512 to support the access by user devices 1512 as tenants of system 1516 . as such, system 1516 provides security mechanisms to keep each tenant's data separate unless the data is shared. if more than one mts is used, they may be located in close proximity to one another (e.g., in a server farm located in a single building or campus), or they may be distributed at locations remote from one another (e.g., one or more servers located in city a and one or more servers located in city b). as used herein, each mts could include one or more logically and/or physically connected servers distributed locally or across one or more geographic locations. additionally, the term “server” is meant to include a computer system, including processing hardware and process space(s), and an associated storage system and database application (e.g., object oriented database management system (oodbms) or rational database management system (rdbms)) as is well known in the art. it should also be understood that “server system” and “server” are often used interchangeably herein. similarly, the database object described herein can be implemented as single databases, a distributed database, a collection of distributed databases, a database with redundant online or offline backups or other redundancies, etc., and might include a distributed database or storage network and associated processing intelligence. fig. 16 illustrates a block diagram of another example environment 1510 , which may be used to implement the embodiments described herein. some of the elements in fig. 16 overlap with those in fig. 15 , and therefore fig. 16 will be described with reference to fig. 15 , and common numbering will be used for elements in fig. 16 that are shown in fig. 15 . fig. 16 also illustrates elements of system 1516 and various interconnections, according to one embodiment. fig. 16 shows that user device 1512 may include processor system 1512 a (analogous to processing system(s) 202 in fig. 3 ), memory system 1512 b (analogous to main memory 204 in fig. 3 ), input system 1512 c (analogous to input system(s) 216 in fig. 3 ), and output system 1512 d (analogous to audio output system(s) 218 and display 222 in fig. 3 ). fig. 16 shows network 1514 and system 1516 . fig. 16 also shows that system 1516 may include tenant data storage 1522 , tenant data 1523 , system data storage 1524 , system data 1525 , user interface (ui) 1630 , application program interface (api) 1632 , pl/salesforce.com object query language (pl/soql) 1634 , save routines 1636 , application setup mechanism 1638 , applications servers 1600 1 - 1000 n , system process space 1602 , tenant process spaces 1604 , tenant management process space 1610 , tenant storage area 1612 , user storage for tenant data 1614 , and application metadata 1616 . in other embodiments, environment 1510 may not have the same elements as those listed above and/or may have other elements instead of, or in addition to, those listed above. user device 1512 , network 1514 , system 1516 , tenant data storage 1522 , and system data storage 1524 were discussed above in fig. 15 . regarding user device 1512 , processor system 1512 a may be any combination of one or more processors. memory system 1512 b may be any combination of one or more memory devices, short term, and/or long term memory. input system 1512 c may be any combination of input devices, such as one or more keyboards, mice, trackballs, scanners, cameras, and/or interfaces to networks. output system 1512 d may be any combination of output devices, such as one or more monitors, printers, and/or interfaces to networks. as shown in fig. 15 , system 1516 may include a network interface 1520 (of fig. 15 ) implemented as a set of http application servers 1600 , an application platform 1518 , tenant data storage 1522 , and system data storage 1524 . also shown is system process space 1602 , including individual tenant process spaces 1604 and a tenant management process space 1610 . each application server 1600 may be configured to access tenant data storage 1522 and the tenant data 1523 therein, and system data storage 1524 and the system data 1525 therein to serve requests of user devices 1512 . the tenant data 1523 might be divided into individual tenant storage areas 1612 , which can be either a physical arrangement and/or a logical arrangement of data. within each tenant storage area 1612 , user storage 1614 and application metadata 1616 might be similarly allocated for each user. for example, a copy of a user's most recently used (mru) items might be stored to user storage 1614 . similarly, a copy of mru items for an entire organization that is a tenant might be stored to tenant storage area 1612 . a ui 1630 provides a user interface and an api 1632 provides an application programmer interface to system 1516 resident processes and to users and/or developers at user devices 1512 . the tenant data and the system data may be stored in various databases, such as one or more oracle™ databases. application platform 1518 includes an application setup mechanism 1638 that supports application developers' creation and management of applications, which may be saved as metadata into tenant data storage 1522 by save routines 1636 for execution by subscribers as one or more tenant process spaces 1604 managed by tenant management process 1610 , for example. invocations to such applications may be coded using pl/soql 1634 that provides a programming language style interface extension to api 1632 . invocations to applications may be detected by one or more system processes, which manage retrieving application metadata 1616 for the subscriber, making the invocation and executing the metadata as an application in a virtual machine. each application server 1600 may be communicably coupled to database systems, e.g., having access to system data 1525 and tenant data 1523 , via a different network connection. for example, one application server 16001 might be coupled via the network 1514 (e.g., the internet), another application server 1600 n- 1 might be coupled via a direct network link, and another application server 1600 n might be coupled by yet a different network connection. transfer control protocol and internet protocol (tcp/ip) are typical protocols for communicating between application servers 1600 and the database system. however, it will be apparent to one skilled in the art that other transport protocols may be used to optimize the system depending on the network connection used. in certain embodiments, each application server 1600 is configured to handle requests for any user associated with any organization that is a tenant. because it is desirable to be able to add and remove application servers from the server pool at any time for any reason, there is preferably no server affinity for a user and/or organization to a specific application server 1600 . in one embodiment, therefore, an interface system implementing a load balancing function (e.g., an f5 big-ip load balancer) is communicably coupled between the application servers 1600 and the user devices 1512 to distribute requests to the application servers 1600 . in one embodiment, the load balancer uses a least connections algorithm to route user requests to the application servers 1600 . other examples of load balancing algorithms, such as round robin and observed response time, also can be used. for example, in certain embodiments, three consecutive requests from the same user could hit three different application servers 1600 , and three requests from different users could hit the same application server 1600 . in this manner, system 1516 is multi-tenant, wherein system 1516 handles the storage of, and access to, different objects, data and applications across disparate users and organizations. as an example of storage, one tenant might be a company that employs a sales force where each salesperson uses system 1516 to manage his or her sales process. thus, a user might maintain contact data, leads data, customer follow-up data, performance data, goals and progress data, etc., all applicable to that user's personal sales process (e.g., in tenant data storage 1522 ). in an example of an mts arrangement, since all of the data and the applications to access, view, modify, report, transmit, calculate, etc., can be maintained and accessed by a user device having nothing more than network access, the user can manage his or her sales efforts and cycles from any of many different user devices. for example, if a salesperson is visiting a customer and the customer has internet access in their lobby, the salesperson can obtain critical updates as to that customer while waiting for the customer to arrive in the lobby. while each user's data might be separate from other users' data regardless of the employers of each user, some data might be organization-wide data shared or accessible by a plurality of users or all of the users for a given organization that is a tenant. thus, there might be some data structures managed by system 1516 that are allocated at the tenant level while other data structures might be managed at the user level. because an mts might support multiple tenants including possible competitors, the mts should have security protocols that keep data, applications, and application use separate. also, because many tenants may opt for access to an mts rather than maintain their own system, redundancy, up-time, and backup are additional functions that may be implemented in the mts. in addition to user-specific data and tenant specific data, system 1516 might also maintain system level data usable by multiple tenants or other data. such system level data might include industry reports, news, postings, and the like that are sharable among tenants. in certain embodiments, user devices 1512 (which may be client systems) communicate with application servers 1600 to request and update system-level and tenant-level data from system 1516 that may require sending one or more queries to tenant data storage 1522 and/or system data storage 1524 . system 1516 (e.g., an application server 1600 in system 1516 ) automatically generates one or more structured query language (sql) statements (e.g., one or more sql queries) that are designed to access the desired information. system data storage 1524 may generate query plans to access the requested data from the database. each database can generally be viewed as a collection of objects, such as a set of logical tables, containing data fitted into predefined categories. a “table” is one representation of a data object, and may be used herein to simplify the conceptual description of objects and custom objects according to the embodiments described herein. it should be understood that “table” and “object” may be used interchangeably herein. each table generally contains one or more data categories logically arranged as columns or fields in a viewable schema. each row or record of a table contains an instance of data for each category defined by the fields. for example, a crm database may include a table that describes a customer with fields for basic contact information such as name, address, phone number, fax number, etc. another table might describe a purchase order, including fields for information such as customer, product, sale price, date, etc. in some multi-tenant database systems, standard entity tables might be provided for use by all tenants. for crm database applications, such standard entities might include tables for account, contact, lead, and opportunity data, each containing pre-defined fields. it should be understood that the word “entity” may also be used interchangeably herein with “object” and “table”. in some multi-tenant database systems, tenants may be allowed to create and store custom objects, or they may be allowed to customize standard entities or objects, for example by creating custom fields for standard objects, including custom index fields. in certain embodiments, for example, all custom entity data rows are stored in a single multi-tenant physical table, which may contain multiple logical tables per organization. it is transparent to customers that their multiple “tables” are in fact stored in one large table or that their data may be stored in the same table as the data of other customers. any suitable programming language can be used to implement the routines of particular embodiments including c, c++, java, assembly language, etc. different programming techniques can be employed such as procedural or object oriented. the routines can execute on a single processing device or multiple processors. although the steps, operations, or computations may be presented in a specific order, this order may be changed in different particular embodiments. in some particular embodiments, multiple steps shown as sequential in this specification can be performed at the same time. particular embodiments may be implemented in a computer-readable storage medium (also referred to as a machine-readable storage medium) for use by or in connection with the instruction execution system, apparatus, system, or device. particular embodiments can be implemented in the form of control logic in software or hardware or a combination of both. the control logic, when executed by one or more processors, may be operable to perform that which is described in particular embodiments. a “processor,” “processor system,” or “processing system” includes any suitable hardware and/or software system, mechanism or component that processes data, signals or other information. a processor can include a system with a general-purpose central processing unit, multiple processing units, dedicated circuitry for achieving functionality, or other systems. processing need not be limited to a geographic location, or have temporal limitations. for example, a processor can perform its functions in “real time,” “offline,” in a “batch mode,” etc. portions of processing can be performed at different times and at different locations, by different (or the same) processing systems. a computer may be any processor in communication with a memory. the memory may be any suitable processor-readable storage medium, such as random-access memory (ram), read-only memory (rom), magnetic or optical disk, or other tangible media suitable for storing instructions for execution by the processor. particular embodiments may be implemented by using a programmed general purpose digital computer, by using application specific integrated circuits, programmable logic devices, field programmable gate arrays, optical, chemical, biological, quantum or nanoengineered systems, components and mechanisms may be used. in general, the functions of particular embodiments can be achieved by any means as is known in the art. distributed, networked systems, components, and/or circuits can be used. communication, or transfer, of data may be wired, wireless, or by any other means. it will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application. it is also within the spirit and scope to implement a program or code that can be stored in a machine-readable medium to permit a computer to perform any of the methods described above. as used in the description herein and throughout the claims that follow, “a”, “an”, and “the” includes plural references unless the context clearly dictates otherwise. also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise. the foregoing description is merely illustrative in nature and is not intended to limit the embodiments of the subject matter or the application and uses of such embodiments. furthermore, there is no intention to be bound by any expressed or implied theory presented in the technical field, background, or the detailed description. as used herein, the word “exemplary” means “serving as an example, instance, or illustration.” any implementation described herein as exemplary is not necessarily to be construed as preferred or advantageous over other implementations, and the exemplary embodiments described herein are not intended to limit the scope or applicability of the subject matter in any way. for the sake of brevity, conventional techniques related to computer programming, computer networking, and other functional aspects of the systems (and the individual operating components of the systems) may not be described in detail herein. in addition, those skilled in the art will appreciate that embodiments may be practiced in conjunction with any number of system and/or network architectures, data transmission protocols, and device configurations, and that the system described herein is merely one suitable example. furthermore, certain terminology may be used herein for the purpose of reference only, and thus is not intended to be limiting. for example, the terms “first”, “second” and other such numerical terms do not imply a sequence or order unless clearly indicated by the context. embodiments of the subject matter may be described herein in terms of functional and/or logical block components and with reference to symbolic representations of operations, processing tasks, and functions that may be performed by various computing components or devices. such operations, tasks, and functions are sometimes referred to as being computer-executed, computerized, software-implemented, or computer-implemented. in this regard, it should be appreciated that the various block components shown in the figures may be realized by any number of hardware, software, and/or firmware components configured to perform the specified functions. for example, an embodiment of a system or a component may employ various integrated circuit components, e.g., memory elements, digital signal processing elements, logic elements, look-up tables, or the like, which may carry out a variety of functions under the control of one or more microprocessors or other control devices. in this regard, the subject matter described herein can be implemented in the context of any computer-implemented system and/or in connection with two or more separate and distinct computer-implemented systems that cooperate and communicate with one another. while at least one exemplary embodiment has been presented in the foregoing detailed description, it should be appreciated that a vast number of variations exist. it should also be appreciated that the exemplary embodiment or embodiments described herein are not intended to limit the scope, applicability, or configuration of the claimed subject matter in any way. rather, the foregoing detailed description will provide those skilled in the art with a convenient road map for implementing the described embodiment or embodiments. it should be understood that various changes can be made in the function and arrangement of elements without departing from the scope defined by the claims, which includes known equivalents and foreseeable equivalents at the time of filing this patent application. accordingly, details of the exemplary embodiments or other limitations described above should not be read into the claims absent a clear intention to the contrary.
166-855-253-829-751	CN	[ "US", "WO" ]	H04N19/117,H04N19/105,H04N19/14,H04N19/176,H04N19/593,H04N19/86	2016-06-16T00:00:00	2016	[ "H04" ]	method, device, and encoder for controlling filtering of intra-frame prediction reference pixel point	a method, a device and an encoder for controlling filtering of intra-frame prediction reference pixel point are disclosed. the method includes: when various reference pixel points in a reference pixel group of an intra-frame block to be predicted are filtered, and the target reference pixel point to be filtered currently is not an edge reference pixel point in a reference pixel group (s 202 ), acquiring a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof (s 203 ); and selecting a filter with the filtering grade thereof corresponding to the pixel difference value to filter the target reference pixel point (s 204 ). for various reference pixel points not located at an edge in a reference pixel group, according to the local difference characteristics of these reference pixel points, filters with corresponding filtering grades are flexibly configured, thus providing flexibility and adaptivity to the filtering, achieving better effect.	1. a method of controlling filtering intra-frame prediction reference pixel point, comprising: in a reference pixel group of an intra-frame block to be predicted, acquiring a pixel difference value between a target reference pixel point and n adjacent reference pixel points thereof when the target reference pixel point to be filtered currently is not an edge reference pixel point in the reference pixel group, wherein n is greater than or equal to 1, wherein the step of acquiring a pixel difference value comprises: obtaining a sum h 1 of pixel values of the n pixel points; obtaining a product h 2 of n and a pixel value of the target reference pixel point; and taking absolute value diffy of the difference between the h 1 and h 2 as the pixel difference value; and selecting a filter with a filtering grade thereof corresponding to the pixel difference value to filter the target reference pixel point. 2. the method of claim 1 , wherein when the target reference pixel point is an end edge reference pixel points in the reference pixel group, no filtering processing is performed on the target reference pixel point. 3. the method of claim 1 , wherein n is equal to 2. 4. the method of claim 1 , wherein the step of selecting a filter with a filtering grade comprises: when the pixel difference value is less than a preset threshold of the weak step pixel difference value, or when the pixel difference value is greater than the preset threshold of the strong step pixel difference value, selecting the filter with a first filtering grade, wherein the filter with the first filtering grade has a length equal to 3; and when the pixel difference value is greater than or equal to the preset threshold of the weak step pixel difference value and less than or equal to the preset threshold of the strong step pixel difference value, selecting the filter with a second filtering grade, wherein the filter with the second filtering grade has a length greater than or equal to 5. 5. the method of claim 4 , wherein the filter with the second filtering grade has a length equal to 5 and a filter coefficient of [ 2/16, 3/16, 6/16, 3/16, 2/16]. 6. the method of claim 4 , wherein the filter with the first filtering grade is selected for filtering when the target reference pixel point is a secondary edge reference pixel point adjacent to an end edge reference pixel point in the reference pixel group. 7. a device for controlling filtering intra-frame prediction reference pixel point, comprising: a difference value acquiring module configured to acquire a pixel difference value between a target reference pixel point and n adjacent reference pixel points thereof in a reference pixel group of an intra-frame block to be predicted, when the target reference pixel point to be filtered currently is not an edge reference pixel point in a reference pixel group, wherein the n is greater than or equal to 1, wherein the difference value acquiring module is configured to: obtain a sum h 1 of pixel values of the n pixel points; obtain a product h 2 of n and a pixel value of the target reference pixel point; and take absolute value diffy of the difference between the h 1 and h 2 as the pixel difference value to acquire the pixel difference value; and a filtering control module configured to select a filter with a filtering grade thereof corresponding to the pixel difference value to filter the target reference pixel point. 8. the device of claim 7 , wherein the filtering control module is configured to select the filter with the first filtering grade when the pixel difference value is less than the preset threshold of the weak step pixel difference value, or when the pixel difference value is greater than the preset threshold of the strong step pixel difference value, wherein the filter with the first filtering grade has a length equal to 3, wherein the filtering control module is configured to select the filter with the second filtering grade when the pixel difference value is greater than or equal to the preset threshold of the weak step pixel difference value and less than or equal to the preset threshold of the strong step pixel difference value, wherein the filter with the second filtering grade has a length greater than or equal to 5. 9. an encoder comprising the device for controlling filtering of an intra-frame prediction reference pixel point according to claim 7 .	technical field the present invention relates to the field of video/image encoding and decoding, and specifically, to a method, a device, and an encoder for controlling filtering of intra-frame prediction reference pixel point background of the invention as people demand more on video/image resolution, video/image contents occupy more and more data transmission bandwidth and storage capacity. how to further increase the video/image compression ratio has become a serious challenge. especially in intra-frame video/image encoding, the compression efficiency cannot be effectively improved due to lack of inter-frame image reference. in intra-frame video/image encoding, intra-frame prediction is adopted to remove redundant spatial information. before performing intra-frame prediction, the reference pixel points of an intra-frame block to be predicted need to be filtered to eliminate the step effect in the reference pixels. the step in the reference pixel points will lead to a significant directional boundary in the intra-frame block to be predicted, affecting the efficiency and effect of the intra-frame prediction. at present, the following methods are used for the intra-frame reference pixel points: conducting weak filtering on reference pixel points by using a filter with a length of 3 (i.e., a 3-tap filter) and the filter coefficient of [¼, 2/4, ¼], which can only remove small step and noise in the reference pixel points; the pixel value of each reference pixel point is linearly interpolated by using the pixel value of reference pixel points at the outermost edge (i.e. edge reference pixel points). in this way, the reference pixel values are greatly modified. therefore, at present, this method only applies to cases where the overall reference pixel points are very flat. another way is to combine the above two methods, that is, to determine to use a weak filter with a length of 3 (i.e., a 3-tap filter) and the filter coefficient of [¼, 2/4, ¼] or a linear interpolation filter for filtering of various reference pixel points in a reference pixel group of an intra-frame block to be predicted according to the overall flatness of the reference pixel points (the degree of flatness is determined by the difference between the end edge reference pixel points in a reference pixel group). no matter which method is selected, the reference pixel points in a reference pixel group are uniformly filtered by the selected filtering method, that is, the filtering grades for the reference pixel points in a reference pixel group are identical. it can be seen from the above analysis that, in the current intra-frame video/image encoding process, the adaptive mechanism of filtering processing of various reference pixel points in a reference pixel group of an intra-frame block to be predicted is too simple. the reference pixel points in a reference pixel group are uniformly filtered by using a fixed filtering grade, resulting in poor filtering flexibility, filtering adaptivity and filtering effect for the intra-frame reference pixel points. summary of the invention the present invention provides a method, a device, and an encoder for controlling filtering of an intra-frame prediction reference pixel point, which solves the problem of poor filtering flexibility, filtering adaptivity and filtering effect for the intra-frame reference pixel points in a reference pixel group while the reference pixel points are uniformly filtered by using a fixed filtering grade. according to an aspect of the present invention, the invention provides a method for controlling filtering of an intra-frame prediction reference pixel point, which includes the following steps: in a reference pixel group of an intra-frame block to be predicted, when the target reference pixel point to be filtered currently is not an edge reference pixel point in a reference pixel group, acquiring a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof, the n is greater than or equal to 1; and selecting a filter with the filtering grade thereof corresponding to the pixel difference value to filter the target reference pixel point. according to a further aspect of the present invention, the invention further provides a device for controlling filtering of an intra-frame prediction reference pixel point, which includes: a difference value acquiring module that acquires a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof, wherein n is greater than or equal to 1, in a reference pixel group of an intra-frame block to be predicted, when the target reference pixel point to be filtered currently is not an edge reference pixel point in a reference pixel group; and a filtering control module that selects a filter with the filtering grade thereof corresponding to the pixel difference value to filter the target reference pixel point. according to a third aspect of the present invention, the invention further provides an encoder, comprising the device for controlling filtering of an intra-frame prediction reference pixel point. the presently disclosed a system, a method, and an encoder can include one or more of the following advantages. the present invention provides a method, a device, and an encoder for controlling filtering of an intra-frame prediction reference pixel point. when various reference pixel points in a reference pixel group of an intra-frame block to be predicted are filtered, and if the target reference pixel point to be filtered currently is not an edge reference pixel point in a reference pixel group, a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof is acquired (i.e. the local difference characteristics of the target reference pixel point is acquired); and then a filter with the filtering grade thereof corresponding to the obtained pixel difference value is selected to filter the target reference pixel point. that is, in the present invention, for various non-edge reference pixel points in a reference pixel group, according to the local difference characteristics of these reference pixel points, filters with corresponding filtering grades are flexibly configured, instead of uniformly using filters with a fixed filtering grade. thus, the filtering flexibility, the filtering adaptivity and the filtering effect are better. brief description of the drawings fig. 1 illustrates a schematic view of an intra-frame block to be predicted and a reference pixel group according to embodiment 1 in the present invention. fig. 2 is a flowchart for a method, a device, and an encoder according to embodiment 1 in the present invention. fig. 3 is a flowchart for controlling filtering processing of edge reference pixel point according to embodiment 1 in the present invention. fig. 4 is a schematic view of setting pixel difference thresholds according to embodiment 1 in the present invention. fig. 5 is a schematic view of the structure of an encoder according to embodiment 2 in the present invention. fig. 6 is a schematic view of a device for controlling filtering of an intra-frame prediction reference pixel point according to embodiment 2 in the present invention. fig. 7 is a flowchart for a method for controlling filtering of an intra-frame prediction reference pixel point according to embodiment 2 in the present invention. detailed description of the invention the technical solutions in the embodiments of the present invention will be described clearly and completely hereinafter with reference to the accompanying drawings in the embodiments of the present invention. apparently, the described embodiments are merely some embodiments in the present invention, but not all of the embodiments. according to the embodiments in the present invention, all other embodiments obtained by those skilled in the field without creative efforts shall fall within the protection scope of the present invention. embodiment 1 it should be noted that, the method, the device, and the encoder for controlling filtering of an intra-frame prediction reference pixel point provided in the present invention may be applied to intra-frame image encoding as well as intra-frame video encoding. in order to facilitate the understanding of the present invention, some concepts related to the present invention are illustrated in this embodiment with reference to fig. 1 . in video/image encoding, videos/images are commonly divided into two kinds: intra-frame images and inter-frame images, wherein the intra-frame image encoding uses only the information provided by the image itself for spatial prediction, and its encoding/decoding does not depend on other images; the inter-frame image encoding eliminates the redundant information in the time domain, and its encoding/decoding can rely on one or more of its previous images. in intra-frame image encoding, the intra-frame image may be divided into a plurality of original data blocks according to a certain rule. for example, it can be divided into mm original data blocks, and one original data block is an intra-frame block to be predicted. a reference pixel group is set for each intra-frame block to be predicted. referring to fig. 1 , the matrix block shown by dotted lines in fig. 1 is an intra-frame block to be predicted. the various reference pixel points above and to the left of the intra-frame block to be predicted form a reference pixel group of the intra-frame block to be predicted, where a, b, c, d, e, . . . , r is the pixel value of each pixel point. according to this embodiment, the reference pixel group includes various edge reference pixel points, wherein the edge reference pixel points may further include end edge reference pixel points and secondary edge reference pixel points. the secondary edge reference pixel points are reference pixel points adjacent to an end edge reference pixel point. in the reference pixel group shown in fig. 1 , the three reference pixel points with pixel value a, i and r are end edge reference pixel points, because there is no reference pixel point adjacent to these pixel points in one direction; the four reference pixel points with pixel value b, h, j and q are secondary edge reference pixel points. it should be understood that, the division of the intra-frame blocks to be predicted in the frame image and the specific manner of setting reference pixel groups for each intra-frame block to be predicted are not the focus of the present invention. there is no limitation on the division of the intra-frame blocks to be predicted and the setting of reference pixel groups for each intra-frame block to be predicted in the present invention. the intra-frame block to be predicted and the reference pixel group shown in fig. 1 are merely exemplary descriptions for facilitating understanding of the present invention. referring to fig. 2 , the method for controlling filtering of an intra-frame prediction reference pixel point provided in this embodiment comprises the following steps of: s 201 : an a acquiring target reference pixel point to be filtered currently in a reference pixel group of an intra-frame block to be predicted. s 202 : judging whether the target reference pixel point is an edge reference pixel point in a reference pixel group; if not, go to step s 203 ; otherwise, go to step s 205 . in this step, the judging rule of edge pixel points may be determined according to the storage rule of various reference pixel points in a reference pixel group or by further combining the latitude m of the intra-frame block to be predicted. for example, when various reference pixel points in a reference pixel group are stored, the subscripts may be sequentially arranged correspondingly, and it may be determined according to the subscripts of various target pixel points combining m. s 203 : acquiring a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof, wherein n is greater than or equal to 1. s 204 : selecting a filter with the filtering grade thereof corresponding to the pixel difference value obtained in step s 203 to filter the target reference pixel point. that is, in the present embodiment, for various non-edge reference pixel points in a reference pixel group, according to the local difference characteristics of these reference pixel points, filters with corresponding filtering grades are flexibly configured, instead of uniformly using filters with a fixed filtering grade. thus the filtering flexibility, the filtering adaptivity and the filtering effect are better, and s 205 : processing the target reference pixel point according to the edge reference pixel point filtering rule. in step s 203 , the value of n may be flexibly selected according to actual application requirements. for example, the value of n may be set as 1, and at this time, you can select to calculate the pixel difference value between the target reference pixel point and any one adjacent reference pixel point or any adjacent reference pixel point in any designated direction. preferably, the value of n is an even number, such as 2 or 4, to calculate pixel difference values between the target reference pixel point and any left/right (or up/down) 2 adjacent reference pixel points or 4 adjacent reference pixel points. in this step, the following method may be adopted for acquiring a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof: obtain a sum h 1 of pixel values of n pixel points and obtain a product h 2 of a pixel value of the target reference pixel point and n; take the absolute value diffy of the difference between h 1 and h 2 as the pixel difference value. for example, it is assumed that the target reference pixel point currently to be filtered is the pixel point with a pixel value n in fig. 1 . when n takes 1, and the reference pixel points are taken as the pixel points with a pixel value m, then: diffy=abs( h 1 −h 2)=abs( m−n ). when n takes 2, and the reference pixel points are taken as the pixel points with pixel value m and p, then: diffy=abs( h 1 −h 2)=abs( m+p− 2 n ). when n takes 4, and the reference pixel points are taken as the pixel points with pixel value l, m and p, q, then: diffy=abs( h 1 −h 2)=abs( l+m+p+q− 4 n ). n may take other values and so on, which will not be described again here. in step s 204 , a filter with the filtering grade thereof corresponding to the pixel difference value can be selected according to the following rules: when the pixel difference value is less than the preset threshold of the weak step pixel difference value, it indicates that the pixel points have only weak step effect, and the filter with the first filtering grade is selected; the filter with the first filtering grade has a length equal to 3 and is mainly used for removing smaller steps and noise in the reference pixel, and this embodiment may be referred to as a weak filtering grade; when the pixel difference value is greater than the preset threshold of the strong step pixel difference value, it indicates that the vicinity of the pixel points is a real boundary, and thus the filter with the first filtering grade is selected; and the filter with the first filtering grade has a length equal to 3; and when the pixel difference value is greater than or equal to the preset threshold of the weak step pixel difference value and less than or equal to the preset threshold of the strong step pixel difference value, it indicates that the pixel points have a strong step effect and the pixel points are not near the real boundary, so the filter with the second filtering grade is selected. the filter with the second filtering grade has a length greater than or equal to 5. the filtering grade is higher than that of the filter with the first filtering grade, corresponding to the strong filtering grade in this embodiment. that is, in this embodiment, the step effect can be divided into a weak step region, a strong step region and a real boundary region ( fig. 4 ) to a certain extent by using the preset threshold of weak step pixel difference and the preset threshold of strong step pixel difference. for each reference pixel points in various regions, filters with the corresponding filtering grades may be selected according to the above rule. it should be understood that, in this embodiment, the weak step region and the strong step region can further be divided into multiple levels according to actual requirements by setting multiple levels of weak step pixel difference thresholds or strong step pixel difference thresholds, corresponding to filters with multiple filtering grades, which will not be described again here. according to this embodiment, the filter with the first filtering grade has a length equal to 3. however, it should be understood that the length of the filter with the first filtering grade may be set flexibly according to the needs of a specific application scenario, such as the latitude m of the intra-frame block to be predicted and other factors. according to this embodiment, the filter coefficient of filter with the first filtering grade may also be set flexibly according to requirements. for example, it may be set as [¼, 2/4, ¼], and it may also be flexibly adjusted to [⅙, 2/6, ⅙] or other values. according to this embodiment, the length of the filter with the second filtering grade may also be flexibly selected according to such factors as the latitude m of the intra-frame block to be predicted. for example, it can be set as 5, 7 or 9. the following is an example in which the length of the filter with the second filtering grade is equal to 5. in this case, the filter coefficients of the filter with the second filtering grade can be set as [ 2/16, 3/16, 6/16, 3/16, 2/16]. however, the filter coefficients thereof can also be flexibly adjusted, such as [ 2/18, 3/18, 6/18, 3/18, 2/18]. there is no adjacent reference pixel point in one direction of the end edge reference pixel points in the edge reference pixels. there is only one adjacent end edge reference pixel point in one direction of the secondary edge reference pixel point. therefore, according to this embodiment, the target reference pixel point that is not an edge reference pixel point is processed according to the filtering processing rule shown in fig. 3 . s 301 : is the target reference pixel point an end edge reference pixel point in the edge reference pixels? if not, go to step s 302 ; otherwise, go to step s 303 . s 302 : no filtering processing is performed on the target reference pixel point. s 303 : filter the target reference pixel point directly by selecting a filter with a preset filtering grade. the filter of the preset filtering grade in step s 303 is preferably a filter with weak filtering grade to remove the smaller step and noise in the reference pixel points without using a filter with strong filtering grade. according to the embodiment, the filter with the weak filtering grade may be the filter with the first filtering grade. according to the embodiment, in the intra-frame encoding prediction process, the local difference characteristic of the pixel difference between the target reference pixel point and adjacent reference pixel points thereof is used to distinguish the real boundary, the strong step and the weak step, so as to adaptively select filters with different filtering grades thereof to filter the reference pixel points. according to the embodiment, in the intra-frame prediction, a filter with a length of 5 or more is introduced as a strong filter, so that steps with large amplitude can be effectively removed. the locally adaptive filtering mechanism used in this embodiment has increased flexibility of filtering, to calculate the local difference for each reference pixel point of the non-edge reference pixel points, and a more optimal filter is selected for each pixel point for filtering. embodiment 2 this embodiment provides an encoder, which may be used for video/image encoding, that is, a video/image encoder, as shown in fig. 5 , includes an intra-frame prediction reference pixel point filtering control device 5 . wherein, referring to fig. 6 , the device for controlling filtering of an intra-frame prediction reference pixel point includes: a judging module 51 acquires target reference pixel point to be filtered currently in a reference pixel group of an intra-frame block to be predicted, and determines whether the target reference pixel point is an edge reference pixel point in a reference pixel group. a difference value acquiring module 52 acquires a pixel difference value between the target reference pixel point and n adjacent reference pixel points thereof in a reference pixel group of an intra-frame block to be predicted, when the target reference pixel point to be filtered currently is not an edge reference pixel point in a reference pixel group, wherein n is greater than or equal to 1. a filtering control module 53 selects a filter with the filtering grade thereof corresponding to the pixel difference value obtained in the difference value acquiring module 52 to filter the target reference pixel point. a filtering control module 53 selects the first filtering grade when the pixel difference value is less than the preset threshold of the weak step pixel difference value, or when the pixel difference value is greater than the preset threshold of the strong step pixel difference value, wherein the filter with the first filtering grade has a length equal to 3; when the pixel difference value is greater than or equal to the preset threshold of the weak step pixel difference value and less than or equal to the preset threshold of the strong step pixel difference value, the filter with the second filtering grade is selected; the filter with the second filtering grade has a length greater than or equal to 5. a filtering control module 53 selects the filter in the same method as embodiment 1, which will not be described here. according to this embodiment, the filtering control module 53 can further process the target reference pixel point according to the filtering rule for edge reference pixel points when the target reference pixel point in the judging module 51 is an edge reference pixel point. specifically, the filtering control module 53 does not filter the target reference pixel point when the target reference pixel point is an end edge reference pixel point. the filtering control module 53 can filter the target reference pixel point directly by selecting a filter with a preset filtering grade when the target reference pixel point is a secondary edge reference pixel point. the filter with the preset filtering grade herein is preferably a filter with weak filtering grade to remove the smaller step and noise in the reference pixel points. further, the above filter with the first filtering grade can be used directly. it should be understood that, according to this embodiment, the above functions of the judging module 51 , the filtering control module 53 and the difference value acquiring module 52 may be implemented by a controller or a processor in an encoder. furthermore, the judging module 51 , the filtering control module 53 and the difference value acquiring module 52 may be implemented as a controller or a processor. in order to better understand the present invention, according to this embodiment, the filter with the first filtering grade has a length equal to 3 and the filter coefficient of [¼, 2/4, ¼]; the filter with the second filtering grad has a length equal to 5 and the filter coefficient of [ 2/16, 3/16, 6/16, 3/16, 2/16]. take the reference pixel group in fig. 1 as an example for illustration. fig. 7 illustrates a filtering control process that can include the following steps: s 701 : acquiring the currently input target reference pixel point as y; s 702 : judging whether y is an end edge reference pixel point (pixel points corresponding to the pixel value a, i and r in fig. 1 ), and if yes, go to step s 703 ; otherwise, go to step s 704 ; s 703 : no filtering; s 704 : judging whether y is a secondary edge reference pixel point (pixel points corresponding to the pixel value b, h, j and q in fig. 1 ), and if yes, go to step s 709 ; otherwise, go to step s 705 ; s 705 : calculating the local difference diffy of the pixel point y; s 706 : judging whether diffy is smaller than the threshold of weak step pixel difference value, and if yes, go to step s 709 ; otherwise, go to step s 707 ; s 707 : judging whether diffy is greater than the threshold of strong step pixel difference value, and if yes, go to step s 709 ; otherwise, go to step s 708 ; and s 708 : selecting the filter with the second filtering grade for y for filtering. for example, assuming that y is the pixel point with a pixel value n in fig. 1 , the pixel value n obtained after filtering by using a filter with the second filtering grade=(2l/16+3m/16+6n/16+3p/16+2q/16). compared with the filter with the first filtering grade with a filtering length of 3, according to this embodiment, the filter with the second filtering grade can provide greater filtering strength and remove stronger step effects between pixels. and further, the filter with the second filtering grade utilizes the current pixel point and more than 4 surrounding pixel points. compared with the linear interpolation filter, the filter with the second filtering grade is more local and can reduce the drastic change to the reference pixel value. s 709 : selecting the filter with the first filtering grade for y for filtering. for example, assuming that y is the pixel point with a pixel value n in fig. 1 , the pixel value n obtained after filtering by using the filter with the first filtering grade=(m/4+2*n/4+p/4). according to the embodiment, in the intra-frame encoding prediction process, the local difference characteristic of the pixel difference between the target reference pixel point and adjacent reference pixel points thereof is used to distinguish the real boundary, the strong step and the weak step, so as to adaptively select filters with different filtering grades thereof to filter the reference pixel points, increasing flexibility of filtering, to calculate the local difference for various non-edge reference pixel points, and a more optimal filter is selected for various pixel points. it is understood by those skilled in the field that all or part of steps of various methods according to the embodiments may be programmed to instruct the associated hardware to achieve the goals, which may be stored in a readable storage medium of computer, e.g. read-only memory, random access memory, disk or cd. the above contents are further detailed description of the present invention in connection with the disclosed embodiments. the invention is not limited to the embodiments referred to, but may be varied and modified by those skilled in the field without departing from the conception and scope of the present invention.
168-046-990-450-760	US	[ "EP", "US", "WO", "CA" ]	B29C48/10,B29C48/32,B29C48/885,B29C48/92,B29C55/28,B29C48/88,B01D47/10	2017-04-07T00:00:00	2017	[ "B29", "B01" ]	adjustable venturi ring	an apparatus includes an upper lip positioned with respect to an air flow passage. the upper lip is to direct air flow from the air flow passage around a bubble of blown film. the apparatus further includes a venturi ring movably mounted with respect to the upper lip and adjustable in position with respect to the upper lip. the venturi ring is to adjustably lock the bubble of blown film.	1 . an apparatus comprising: a fixed upper lip positioned to define an air flow passage of fixed dimensions, the fixed upper lip to direct air flow from the air flow passage around a bubble of blown film; and a venturi ring movably mounted with respect to the fixed upper lip and adjustable in position with respect to the fixed upper lip, the venturi ring to adjustably lock the bubble of blown film. 2 . the apparatus of claim 1 , further comprising a secondary collar extending from the venturi ring to cooperate with the venturi ring to adjustably lock the bubble of blown film. 3 . the apparatus of claim 1 , wherein a volumetric flow rate of air through the air flow passage is dependent only on blower speed. 4 . the apparatus of claim 3 , wherein the venturi ring is distant from the air flow passage and movement of the venturi ring with respect to the fixed upper lip does not substantially change the air flow passage. 5 . the apparatus of claim 1 , further comprising a proximity sensor to determine a gap between the blown film and the fixed upper lip. 6 . the apparatus of claim 5 , wherein the proximity sensor is disposed on the venturi ring. 7 . the apparatus of claim 5 , wherein the proximity sensor is movable to determine the gap between the blown film and the fixed upper lip at different positions around the bubble. 8 . the apparatus of claim 5 , further comprising a controller connected to the proximity sensor, the controller and the proximity sensor forming a feedback control loop to control a position of the venturi ring to provide a target gap between the blown film and the fixed upper lip. 9 . the apparatus of claim 8 , wherein the feedback control loop is to reference a predetermined optimal target gap for a type of the blown film. 10 . the apparatus of claim 8 , wherein the controller includes a programmed starting sequence of positioning for the venturi ring. 11 . the apparatus of claim 1 , further comprising a plurality of proximity sensors to determine a gap between the blown film and the fixed upper lip. 12 . an apparatus comprising: a fixed upper lip positioned with respect to an air flow passage, the fixed upper lip to direct air flow from the air flow passage around a bubble of blown film; and a venturi ring positioned with respect to the fixed upper lip, the venturi ring positioned at an outlet of the air flow passage, the venturi ring to lock the bubble of blown film; wherein a position of the venturi ring is independently adjustable with respect to a position of the fixed upper lip to change an angle of air flow against the bubble without altering a flow rate of air flow through the flow passage. 13 . the apparatus of claim 12 , wherein the position of the venturi ring is independently adjustable to substantially maintain a same flow rate of air flow through the air flow passage. 14 . the apparatus of claim 12 , wherein the position of the venturi ring is independently adjustable to substantially maintain a same streamlined air flow through the air flow passage. 15 . the apparatus of claim 12 , further comprising a proximity sensor to determine a gap between the blown film and the fixed upper lip. 16 . the apparatus of claim 15 , wherein the proximity sensor is movable to determine the gap between the blown film and the fixed upper lip at different positions around the bubble. 17 . the apparatus of claim 15 , further comprising a controller connected to the proximity sensor, the controller and the proximity sensor forming a feedback control loop to control a position of the venturi ring to provide a target gap between the blown film and the fixed upper lip. 18 . the apparatus of claim 17 , wherein the feedback control loop is to reference a predetermined optimal target gap for a type of the blown film. 19 . the apparatus of claim 17 , wherein the controller includes a programmed starting sequence of positioning for the venturi ring. 20 . the apparatus of claim 12 , further comprising an actuator connected to the venturi ring to adjust a position of the venturi ring with respect to a position of the fixed upper lip.	cross-reference to related applications this application claims priority to u.s. provisional application 62/482,969, filed apr. 7, 2017, which is incorporated herein by reference. background blown film extrusion typically uses an annular cooling device known as an air ring to cool the extruded plastic film as it exits the die. the extrudate is in the form of a thin-wall tube as it goes through the air ring, and is subsequently inflated into a bubble. in order to stabilize the bubble and ensure uniform cooling around the circumference of the bubble, the design of the exit nozzle of the air ring lip is such that the bubble can be “locked” against the inner diameter of the air ring lip forming cone with a constant air gap between the bubble and the forming cone. in air rings described by the prior art, the “bubble lock” is controlled by adjusting the upper lip assembly up and down which varies the degree of bubble lock by varying the size and location of low pressure regions at and near the air ring lip exit nozzle (often called the venturi, in some cases actually a result of the coanda effect). a skilled operator can observe the position of the film bubble relative to the air ring lip and predict the appropriate adjustment of the upper lip assembly in order to achieve the desired constant gap or bubble lock. however, prior art air rings are configured such that changes in the position of the upper lip assembly not only affect the bubble lock, but also change the cooling air flow rate and create step changes in the air flow path which result in undesirable air flow mixing. this interaction between bubble lock and cooling air flow rate and mixing significantly complicates the adjustment of the lip, often requiring a series of adjustments to correct unintended side-effects of previous adjustments. examples in the prior art are as follows. us 2002/0018822 a1, entitled “air cooling ring for blown plastics film,” teaches an air cooling ring having a venturi lip mounted to the annular structure u.s. pat. no. 5,804,221, entitled “air ring for cooling blown plastic film,” teaches an air ring with “an annular body . . . (having) a circumferentially extending air passage through which air can be supplied . . . ” and “circumferentially extending series of individually operable actuators . . . operable to vary the venturi-like effect at its circumferential location and cause the film to become nearer to or further from the body at said location to cause the thickness of the film at said location to decrease or increase.” u.s. pat. no. 4,826,414, entitled “air rings for production of blown plastic film,” teaches a single air cooling ring assembly comprising an upper annular chamber that uses ambient air drawn in by the vacuum effect of the cooling air emitted from the lower annular lips. the upper chamber is adjustable coaxially with the lower annular lips to adjust the flow of air admitted to it. u.s. pat. no. 4,373,273, entitled “air ring having a circular array of a large multiplicity of substantially parallel cell-like passages in the air flow path leading to the outlet,” teaches an air cooling ring surrounding the bubble immediately above the die head having at least six inlet ports tangentially mounted to an annular plenum. the plenum contains an annular element that redirects the circularly flowing incoming air to a radially inwardly flowing direction perpendicular against the bubble's exterior surface. u.s. pat. no. 3,507,006, entitled “apparatus for producing thermoplastic film,” teaches a flexible annular cone that surrounds the bubble and is variable in profile by an annular ring that moves coaxially with the bubble axis via a threaded means to alter said profile thereby causing the bubble and the cooling air stream between the bubble outer surface and the inner surface of said annular cone to change shape. ep 1719602 b1, entitled “method and apparatus for regulating the thickness profile of a blown film,” teaches two air cooling rings that surround the bubble above the die head. this document shows that the upper air ring can be moved coaxially with the bubble axis of motion. u.s. pat. no. 9,248,601, entitled “method for setting the sizes of blown film tubes as well as a blown film plant comprising a control device for implementing said method”, teaches a method by which the film tube size is changed from an initial size of a film tube to a final size of a film tube, and in which method the location of the frost area is optimized during the size change by setting the output of the cooling fan. summary of the invention according to an aspect of the invention, an air ring has an adjustable ring element (venturi ring or “vector ring”) in the lip exit nozzle which allows for adjustment of the bubble lock independent of the cooling air flow rate, while maintaining a streamlined flow through the air ring. decoupling the bubble lock control from the air flow control may make it easier to set-up and optimize the process for different film structures, gauges, or bubble widths, and may result in a larger operating range. using an adjustable ring instead of adjusting the position of the entire upper lip may reduce or eliminate the need to readjust the blower speed after every lip adjustment. the invention may reduce or eliminate the step changes in the flow path caused by the design of prior art lip adjustments, resulting in a streamlined flow with little to no mixing of the air stream (which may be critical for correcting the film gauge via introduction of subtle variations in air flow using air flow rate control valves). according to another aspect of the invention, an apparatus includes an upper lip positioned with respect to an air flow passage. the upper lip is to direct air flow from the air flow passage around a bubble of blown film. the apparatus further includes a venturi ring movably mounted with respect to the upper lip and adjustable in position with respect to the upper lip. the venturi ring is to adjustably lock the bubble of blown film. according to another aspect of the invention, an apparatus includes an upper lip positioned with respect to an air flow passage, the upper lip to direct air flow from the air flow passage around a bubble of blown film. the apparatus further includes a venturi ring positioned with respect to the upper lip, the venturi ring to lock the bubble of blown film. a position of the venturi ring is independently adjustable with respect to a position of the upper lip. an apparatus may further include a secondary collar extending from the venturi ring to cooperate with the venturi ring to adjustably lock the bubble of blown film. the upper lip may define the air flow passage. the venturi ring may be distant from the air flow passage and movement of the venturi ring with respect to the upper lip may not substantially change the air flow passage. an apparatus may further include a proximity sensor to determine a gap between the blown film and the upper lip. the proximity sensor may be disposed on the venturi ring. the proximity sensor may be movable to determine the gap between the blown film and the lip at different positions around the bubble. an apparatus may further include a controller connected to the proximity sensor, the controller and the proximity sensor forming a feedback control loop to control a position of the venturi ring to provide a target gap between the blown film and the lip. the feedback control loop may reference a predetermined optimal target gap for a type of the blown film. the controller may include a programmed starting sequence of positioning for the venturi ring. an apparatus may further include a plurality of proximity sensors to determine a gap between the blown film and the upper lip. the position of the venturi ring may be independently adjustable to substantially maintain a same flow rate of air flow through the air flow passage. the position of the venturi ring may be independently adjustable to substantially maintain a same streamlined air flow through the air flow passage. an apparatus may further include an actuator connected to the venturi ring to adjust a position of the venturi ring with respect to a position of the upper lip. furthermore, the adjustable ring may be positioned with an actuator that is controlled remotely (e.g., digitally), enabling the recording of the desired position together with a “recipe” that can be recalled later. furthermore, decoupling the bubble lock control from the cooling air flow rate with a remotely controlled adjustable ring enables programing of semi-automated or fully automated control algorithms for bubble lock, allowing non-expert operators with less advanced skills to start up or optimize the blown film line, in particular the air ring. the decoupling plus remote ring adjustment bestow the ability to use control algorithms to reduce the complexity and “black art” quality of blown film bubble processing. brief description of the drawings fig. 1 is a section view of prior art configuration. fig. 2 is a section view of prior art with unlocked bubble detail. fig. 3 is a section view of prior art with locked bubble. fig. 4 is a section view of an example inventive apparatus with a locked bubble. fig. 5 is a section view of an example inventive apparatus with a locked bubble in detail. fig. 6 is a schematic diagram of an example inventive system for automated bubble lock gap control. fig. 7 is a block diagram of an example inventive controller for automated bubble lock gap control. detailed description fig. 1 shows a section view of a prior art air ring assembly 10 , that includes an annular plenum 12 that supplies cooling air through radial passages 14 that surround the bubble 16 . cooling air is fed through the radial passages 14 and is deflected by forming cone 18 to form an annular flow path surrounding the bubble's outer surface thereby cooling the extrudate. to adjust the bubble lock, an adjustable upper lip 20 and secondary collar 28 assembly is provided that is mounted to an upper flange 22 that extends inwardly from the annular plenum 12 . the attachment structure includes a thread 24 which allows vertical adjustment of the adjustable upper lip 20 and secondary collar 28 by rotating the upper lip 20 with respect to the threaded flange 22 . fig. 2 shows an enlarged section view of the said prior art ring assembly 10 with the bubble 16 in an unlocked position. this state is typical when starting up the film blowing process. fig. 3 shows a second enlarged view of the said prior art ring assembly 10 with the bubble 16 in a locked position. arrow “a” indicates the vertical adjustment of the upper lip 20 to alter the bubble lock position. this vertical adjustment also alters the air flow rate through the consequentially enlarged flow passage 30 . in order to restore the original air flow rate for the new bubble lock position the blower speed must be adjusted. the same vertical adjustment of the upper lip 20 also creates a re-circulation region 26 of the cooling air flow as it passes through the air ring. this re-circulation region creates a step change in air flow that causes undesirable pressure drop and mixing in the cooling air flow. fig. 4 shows a section view of a blown film extrusion air ring apparatus 70 according to the invention. an annular plenum 50 supplies cooling air through radial passages 54 that surround the bubble 56 . cooling air is fed through the radial passages 54 and is deflected by forming cone 58 to form an annular flow path surrounding the bubble's outer surface thereby cooling the extrudate. an adjustable venturi ring 60 and secondary collar 68 assembly is provided for bubble lock adjustment. the adjustable venturi ring 60 and secondary collar 68 assembly is movably mounted on a fixed upper lip 72 which is an annular extension of the upper flange 52 that extends inwardly from the annular plenum 50 . forming cone 58 and upper lip 72 may serve to direct air flow in an air flow passage 74 around a bubble 56 of blown film. the adjustable venturi ring 60 and secondary collar 68 assembly are moveable by any suitable actuator (e.g., actuator 84 of fig. 6 ) which may include a structure such as a ramp, cam, helical thread, or screw. movement may be actuated manually or via servo motor powered by pneumatic, hydraulic, electrical, or mechanical power. fig. 5 shows an enlarged section view of the apparatus illustrating the cooling air flow stream 62 passing from the annular plenum 50 in an uninterrupted and streamlined flow 64 to surround and cool the locked bubble 56 . arrow “b” indicates the vertical adjustment of the venturi ring 60 and secondary collar 68 assembly. this vertical adjustment changes the angle of air flow against the bubble but does not alter the flow rate of the air flow through the flow passage 74 , and so no adjustment of the blower speed is required as a consequence of changing the bubble lock position. by controlling the bubble lock independently from the air flow control, the invention provides a less complicated means to initiate the film blow molding process, set the bubble lock position and optimize the process for different film structures. the invention also results in a larger operating range for the air ring, in terms of available combinations of bubble lock and air flow rate which result in stable blown film bubbles. the replacement of the prior art adjustable upper lip 20 with the fixed upper lip 72 and adjustable venturi ring 60 reduces or eliminates step changes in the flow path thereby providing a streamlined flow having little to no mixing of the air stream. this may be a critical requirement for various configurations of air ring that use air flow rate control valves to adjust the blown film gauge. fig. 6 shows a schematic diagram of a feedback control loop that may include a controller 82 , an actuator 84 , and one or more proximity sensors gt 1 , gt 2 , gt 3 , gt 4 located at various positions. the distance of the film relative to a feature of the air ring lip is determined by a proximity sensor gt, and this position is automatically controlled by the controller 82 by way of vertical adjustment “b” of the venturi ring with the actuator 84 . this automated control loop may be configured to function as a bubble lock control system. thus, wasted time and scrap that may be produced while an operator manually adjusts the air ring can be significantly reduced, and a desired gap or bubble lock is maintained automatically. when more than one proximity sensor gt 1 , gt 2 , gt 3 , gt 4 is used, the sensed signals may be combined in the controller 82 or at a separate node 88 . a proximity sensor to measure the film position may be located at various positions. a proximity sensor gt 1 may be located on the venturi ring. a proximity sensor gt 2 may be located on the secondary collar. a proximity sensor gt 3 may be mounted independently (e.g., mounted to other structure) upstream of the air ring lip. a proximity sensor gt 4 may be located inside the bubble, for instance on an internal bubble control (ibc) device 80 . there may be a proximity sensor at any of these locations. there may be a plurality of proximity sensors at any of these locations and such proximity sensors may be spaced around the perimeter for multiple measurements around the entire bubble. a proximity sensor may be a continuous sensor that provides minimum/maximum/average gap measurements around the entire bubble or a substantially large portion thereof. the proximity sensor may be fixed in position, or may be mounted on a moving device such that the sensor can travel around a circumference of the apparatus, scanning the film distance at various continuous positions around the lip or taking measurements at selected positions. in the latter example, the sensor position and measurement signal may be wirelessly transmitted to the controller 82 . a proximity sensor gt 1 , gt 2 , gt 3 , gt 4 may include any suitable kind of sensor, such as those based on optical, laser, sonar, capacitive, doppler, ultrasonic, or other suitable technologies. a sensor which provides an analog output approximately proportional to the distance between the sensor and film surface may be used. a signal from the sensor may be processed digitally to provide a suitable measure of an average distance and/or variability of the distance (movement of the film). the distance to the film from sensor gt 1 or sensor gt 4 can be used to calculate a gap 86 between the film and the lip of the forming cone 58 , which may be considered a primary indicator of bubble lock. measurements from sensors gt 2 or gt 3 may be used as additional information about bubble stability relative to air ring lip features (references to gap 86 in this description include these measurements). a gap 86 measurement determined from a signal transmitted by a proximity sensor gt 1 , gt 2 , gt 3 , gt 4 is inputted to the controller 82 , which may perform a gap control algorithm. the controller 82 may implement any suitable type of feedback control algorithm, such as pid (proportional-integral-derivative) control, adaptive control, and combinations thereof. the controller 82 outputs a control signal to control the actuator 84 to actuate the venturi ring 60 to move up or down, as shown at “b”. the controller 82 may be implemented in a stand-alone control device, in a control device which also allows for direct manual control of the air ring, integrated with the blown film line control system, or as part of a distributed control system. the gap setpoint sp may be inputted to the controller 82 . the gap setpoint sp represents a target bubble position relative to the air ring lip at any moment in time. the setpoint may be a predetermined optimal target gap. the target bubble position and corresponding gap setpoint sp may include a gap dimension measured by a sensor, may include an average, minimum, and/or maximum variation in the gap dimension measured at different positions around the bubble, may include a variation in gap measurement over time due to bubble movement (shaking or fluttering), or a combination of such. the gap setpoint sp may be established in several ways, which represent different control modes or control objectives. these modes or objectives include maintaining a current gap 86 ; minimizing the gap 86 ; minimizing bubble movement; seeking a specific value for the gap 86 which may be set by the operator; seeking a specific value for the gap 86 which may be saved as part of a setup recipe for the particular film product being produced; and following a preprogrammed sequence of values for the gap 86 suitable for starting up a blown film line after a planned or unplanned interruption in operation. multiple objectives, whether simultaneous or sequential, may be programmed in the controller 82 . in some of these modes of control, the controller 82 assists a skilled operator by automatically adjusting the venturi ring 60 to achieve or maintain a gap 86 desired by the operator. in other modes, the hands-on knowledge of an operator experienced in setting up the air ring depending on the type of film being produced can be captured and reproduced by less experienced operators. fig. 7 shows a block diagram of an example controller 82 . the controller 82 may include an input/output (i/o) interface 90 , a processor 92 , a user interface 94 , and memory 96 . the controller 82 may be referred to as a computer, a microcontroller, or similar. the i/o interface 90 may include conductors to receive input signals from proximity sensors and to provide a control signal to an actuator. the i/o interface 90 may include a wireless interface for wireless communications with a proximity sensor or actuator. the processor 92 executes instructions, which may be stored in memory 96 , which may include a non-transitory machine-readable storage medium, such as random-access memory (ram), read-only memory (rom), electrically-erasable programmable read-only memory (eeprom), flash memory, a storage drive, an optical disc, and the like. such a machine-readable storage medium may be encoded with executable instructions. the user interface 94 may include an input device, such as a keyboard or touchscreen, a display, or similar. the user interface 94 allows an operator to interact with the controller 82 . the memory 96 may store a setpoint sp and control program 98 to be referenced by the controller 82 in controlling the actuator based on a sensor input signal. the memory 96 may store a starting sequence 100 to be referenced by the controller 82 in controlling the actuator during startup of a blown film apparatus to which the controller 82 is provided. a setpoint sp, control program 98 , or starting sequence 100 may be provided, or a common setpoint sp, control program 98 , or starting sequence 100 may be parameterized, for various different types of film. it should be recognized that features and aspects of the various examples provided above can be combined into further examples that also fall within the scope of the present disclosure. in addition, the figures are not to scale and may have size and shape exaggerated for illustrative purposes. further, in the above the words “and”, “or”, and “and/or” should be interpreted to mean any of the items listed in any quantity. in addition, it is recognized that air may have various compositions and the term “air” as used herein is not intended to be limited to a particular composition of gasses.
168-557-831-793-453	JP	[ "CN", "US", "EP", "AU" ]	C23C28/00,C25D5/02,C25D5/48,C25D7/06,C25D9/04,H01L31/076,H01L31/18	1999-11-29T00:00:00	1999	[ "C23", "C25", "H01" ]	method and equipment for forming zinc oxide film, and method and apparatus manufacturing photovoltaic device	disclosed are an electrodeposition process comprising the steps of transporting a substrate in an electrodeposition bath, and forming a film on the substrate, which process further comprises the step of removing particles from the surface of the substrate; and an electrodeposition apparatus comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a continuous-length-substrate while holding the substrate thereon, and an opposing electrode, which apparatus further comprises a mechanism for removing particles from the surface of the continuous-length substrate. these can provide a process and an apparatus by and in which dust in the bath or any particles due to film-peeling from electrodes can be prevented from causing difficulties such as impact marks in a film-deposited substrate during its transport, to form a good-quality electrodeposited film.	1. an electrodeposition process for electrodepositing a zinc oxide film in an electrodeposition bath comprising the steps of supplying a continuous-length substrate having a zinc oxide film formed thereon, an opposing electrode and a back-side film adhesion preventive electrode; forming the film on the continuous-length substrate while transporting the continuous-length substrate under electrification so made as to be in the relation of potential which stands back-side film adhesion preventive electrode<continuous-length substrate<opposing electrode; and removing particles separated from the back-side film adhesion preventive electrode from the surface of the continuous-length substrate. 2. the electrodeposition process according to claim 1 , wherein the particles are removed by means of a member comprising an insulating material. 3. the electrodeposition process according to claim 1 , wherein the particles are removed by means of a member so disposed that its longitudinal direction is in a direction not being at right angles to the transport direction of the continuous-length substrate; the member being brought into contact with the continuous-length substrate to make the particles move in a direction different from the transport direction of the continuous-length substrate. 4. the electrodeposition process according to claim 1 , wherein the particles are dust floating in the bath. 5. the electrodeposition process according to claim 1 , wherein the particles are removed by convection of the electrodeposition bath. 6. the electrodeposition process according to claim 5 , wherein the electrodeposition bath is convected in a direction of convection which is different from the transport direction of the continuous-length substrate, to make the particles move in a direction different from the transport direction of the continuous-length substrate. 7. the electrodeposition process according to claim 1 , wherein the particles are removed by spraying a liquid or blowing a gas on the continuous-length substrate. 8. the electrodeposition process according to claim 7 , wherein the liquid or gas is sprayed or blown in a direction different from the transport direction of the continuous-length substrate, to make the particles move in a direction different from the transport direction of the continuous-length substrate, to make the particles move in a direction different from the transport direction of the continuous-length substrate. 9. the electrodeposition process according to claim 1 , wherein the particles are removed after the continuous-length substrate has passed a region where the continuous-length substrate faces the back-side film adhesion preventive electrode and before the continuous-length substrate comes into contact with a mechanism for transporting the continuous-length substrate. 10. the electro-deposition process according to claim 9 , wherein the mechanism for transporting the continuous-length substrate is a roller. 11. the electrodeposition process according to claim 1 , wherein a continuous-length substrate on the outermost surface of which a zinc oxide film has been formed by sputtering is used as the continuous-length substrate. 12. a process for producing a photovoltaic device, comprising a step of conducting the electrodeposition process of claim 1 to provide a continuous-length substrate having a zinc oxide film thereon and thereafter a step of forming a semiconductor layer on the zinc oxide film.	background of the invention 1. field of the invention this invention relates to a process for forming a zinc oxide film, an apparatus for forming a zinc oxide film, and a process, and an apparatus, for producing a photovoltaic device by using the same. 2. related background art photovoltaic devices comprised of amorphous silicon hydride, amorphous silicon germanium hydride, amorphous silicon hydride carbide, microcrystalline silicon or polycrystalline silicon are conventionally provided with reflecting layers on their backs in order to improve light-collection efficiency in the long-wavelength regions. it is desirable for such-reflecting layers to show effective reflection characteristics at wavelengths which are close to band edges of semiconductor materials and at which absorption becomes small, i.e., wavelengths of 800 nm to 1,200 nm. those which can fulfill such a condition are reflecting layers formed of a metal such as gold, silver, copper or aluminum. it is also prevalent to provide an uneven layer which is optically transparent within a stated wavelength region. this transparent uneven layer is provided between the metal layer and a semiconductor active layer so that reflected light can effectively be utilized to improve short-circuit current density jsc. in order to prevent characteristics from lowering because of shunt pass, it is still also prevalent to provide between the metal layer and a semiconductor layer a layer formed of a light-transmitting material showing a conductivity, i.e., a transparent conductive layer. this transparent conductive layer and the above transparent uneven layer may be the same layer. in general, these layers are deposited by a process such as vacuum evaporation or sputtering and show an improvement in short-circuit current density jsc by 1 ma/cm ^{ 2 } or above. as an example thereof, in light entrapment effect in a-si solar cells on 29p-mf-22 stainless steel substrates (autumn, 1990), the 51st applied physics society scientific lecture meeting, lecture drafts p.747, p-ia-15a-sic/a-si/a-sige multi-bandgap stacked solar cells with bandgap profiling, sannomiya et al., technical digest of the international pvsec-5, kyoto, japan, p.381, 1990, reflectance and texture structure are studied on a reflecting layer constituted of silver atoms. in this example, it is reported that the reflecting layer is deposited in double layer of silver by changing substrate temperature, to form effective unevenness, which has achieved an increase in short-circuit current in virtue of light entrapment effect. the transparent layer used as a light entrapment layer is deposited by vacuum evaporation utilizing resistance heating or electron beams, sputtering, ion implantation or cvd (chemical vapor deposition). however, the facts of high wages for preparing target materials and so forth, a large repayment for vacuum apparatus and not a high utilization efficiency of materials make very high the cost for photovoltaic devices produced by these techniques, and put a high barrier to industrial application of solar cells. as a technique for forming a zinc oxide film by electrodeposition from an aqueous solution, intended to solve these problems, japanese patent application laid-open no. 10-178193 discloses its combination with a metal layer and a transparent conductive layer which are formed by sputtering, applied as a reflecting layer of photovoltaic devices (solar cells). also, as an improved technique of such a zinc oxide production technique, japanese patent application laid-open no. 11-286799 by the present inventors discloses a technique in which a back-side film adhesion preventive electrode is provided to form zinc oxide films by electrodeposition causative of less or no back deposition. these methods do not require any expensive vacuum apparatus and any expensive targets, and can dramatically reduce the production cost for zinc oxide films. these also enable deposition on a large-area substrate, and are full of promise for large-area photovoltaic devices such as solar cells. however, these methods of making deposition electrochemically have matters to be improved, as shown below. 1) the back-side film adhesion preventive electrode removes any unwanted electrodeposited film (zinc oxide film) deposited on the back surface, but in that course the zinc oxide film removed keeps depositing on the back-side film adhesion preventive electrode. after its use for a long time, the deposited film comes off from the back-side film adhesion preventive electrode because of film stress or the like and film pieces fall on the substrate. the zinc oxide film having deposited on the back-side film adhesion preventive electrode is of hard and brittle nature. hence, when film pieces are held between a roller and a substrate to become crushed, they are broken into sand. this zinc oxide broken into sand adheres to the transport roller surface to cause the occurrence of impact marks continually. 2) where such film pieces or adsorbed matter have or has passed the roller as they are, crushed film pieces not only cause the occurrence of impact marks continually but also cause the occurrence of dents, scratches and so forth at the roller surface to make the roller have a short lifetime, resulting in a great damage on the apparatus. 3) dust of white powdery zinc oxide coming out from the anode also drifts or floats in the bath. such dust is so treated as to be removed with a filter attached to the apparatus. however, before it is removed with the filter, it becomes adsorbed on the film-deposited substrate to cause impact marks when it passes the transport roller as it is. 4) the impact marks having thus occurred not only make poor the surface appearance required as solar cell substrates, but also may cause cracks and film-peeling in zinc oxide film deposited by electrodeposition. where such zinc oxide film is used as a part of a photovoltaic device, the cracks and film-peeling cause shunt pass of the photovoltaic device, as so considered. summary of the invention accordingly, the present invention was made taking account of such circumstances, and an object of the present invention is to establish a technique for mass production of zinc oxide films by electrodeposition, and, in an electrodeposition process combined with substrate transportation of a roll-to-roll system or the like, to prevent occurrence of the above impact marks to stably form high-quality and low-cost zinc oxide films over a long period of time, the films being free of cracks and film-peeling, so as to contribute to real spread of sunlight electricity generation by incorporating such zinc oxide films in photovoltaic devices. another object of the present invention is, without limitation to the formation of zinc oxide films, to provide a process, and an apparatus, for forming good-quality electrodeposited films, preventing difficulties such as impact marks from being caused in the substrate in the course of its transport by any particles due to dust floating in the bath or film having peeled from the electrode. to achieve the above objects, as a preferred embodiment, the present invention provides a process for forming a zinc oxide film in an electrodeposition bath provided therein with a continuous-length substrate, an opposing electrode and a back-side film adhesion preventive electrode, to form the zinc oxide film on the continuous-length substrate while transporting the continuous-length substrate under electrification so made as to be in the relation of potential which stands back-side film adhesion preventive electrode<continuous-length substrate<opposing electrode; the process comprising the step of removing particles from the surface of the continuous-length substrate. it also provides a process for producing a photovoltaic device, having at least the steps of forming a zinc oxide film by the above zinc oxide film formation process, and forming a semiconductor layer on the zinc oxide film. as a preferred embodiment, the present invention also provides an apparatus for forming a zinc oxide film, comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a continuous-length substrate, holding the substrate thereon, an opposing electrode, a back-side film adhesion preventive electrode, and a power source and wiring for so making electrification as to be in the relation of potential which stands back-side film adhesion preventive electrode<continuous-length substrate<opposing electrode; the apparatus further comprising a mechanism for removing particles from the surface of the continuous-length substrate. it also provides an apparatus for producing a photovoltaic device having at least the above apparatus for forming a zinc oxide film, and an apparatus for forming a semiconductor layer by plasma cvd to form the semiconductor layer on the zinc oxide film. as another preferred embodiment of the process, the present invention provides a process for forming a zinc oxide film on a continuous-length substrate while transporting the continuous-length substrate in an electrodeposition bath; the process comprising the step of removing particles from the surface of the continuous-length substrate. as still another preferred embodiment of the process, the present invention provides a process for forming a zinc oxide film, comprising the steps of transporting a substrate in an electrodeposition bath, and forming the zinc oxide film on the substrate; the process further comprising the step of removing particles from the surface of the substrate. as another preferred embodiment of the apparatus, the present invention provides an apparatus for forming a zinc oxide film, comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a continuous-length substrate, holding the substrate thereon, and an opposing electrode; the apparatus further comprising a mechanism for removing particles from the surface of the continuous-length substrate. as still another preferred embodiment of the apparatus, the present invention provides an apparatus for forming a zinc oxide film, comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a substrate, holding the substrate thereon, and an opposing electrode; the apparatus further comprising a mechanism for removing particles from the surface of the substrate. in addition, without limitation to the process and apparatus for forming a zinc oxide film, the present invention also provides an electrodeposition process, and an electrodeposition apparatus, for forming other film. stated specifically, the present invention also provides; an electrodeposition process for forming a film in an electrodeposition bath provided therein with a continuous-length substrate, an opposing electrode and a back-side film adhesion preventive electrode, to form the film on the continuous-length substrate while transporting the continuous-length substrate under electrification so made as to be in the relation of potential which stands back-side film adhesion preventive electrode<continuous-length substrate<opposing electrode; the process comprises the step of removing particles from the surface of the continuous-length substrate; an electrodeposition process for forming a film on a continuous-length substrate while transporting the continuous-length substrate in an electrodeposition bath; the process comprising the step of removing particles from the surface of the continuous-length substrate; an electrodeposition process comprising the steps of transporting a substrate in an electrodeposition bath, and forming a film on the substrate; the process further comprising the step of removing particles from the surface of the substrate; an electrodeposition apparatus comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a continuous-length substrate, holding the substrate thereon, an opposing electrode, a back-side film adhesion preventive electrode, and a power source and wiring for so making electrification as to be in the relation of potential which stands back-side film adhesion preventive electrode<continuous-length substrate<opposing electrode; the apparatus further comprising a mechanism for removing particles from the surface of the continuous-length substrate; an electrodeposition apparatus comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a continuous-length substrate, holding the substrate thereon, and an opposing electrode; the apparatus further comprising a mechanism for removing particles from the surface of the continuous-length substrate; and an electrodeposition apparatus comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a substrate, holding the substrate thereon, and an opposing electrode; the apparatus further comprising a mechanism for removing particles from the surface of the substrate. more preferred embodiments of the process of the present invention may include; an embodiment in which the particles are removed by means of a member comprising an insulating material; an embodiment in which the particles are removed by means of a member so disposed that its longitudinal direction is in a direction not being at right angles to the transport direction of the continuous-length substrate; the member being brought into contact with the continuous-length substrate to make the particles move in a direction different from the transport direction of the continuous-length substrate; an embodiment in which the particles are particles having come off from the back-side film adhesion preventive electrode; an embodiment in which the particles are dust floating in the bath; an embodiment in which the particles are removed by convection of the electrodeposition bath; an embodiment in which the electrodeposition bath is convected in a direction of convection which is different from the transport direction of the continuous-length substrate, to make the particles move in a direction different from the transport direction of the continuous-length substrate; an embodiment in which the particles are removed by spraying a liquid or blowing a gas on the continuous-length substrate; an embodiment in which the liquid or gas is sprayed or blown in a direction different from the transport direction of the continuous-length substrate, to make the particles move in a direction different from the transport direction of the continuous-length substrate; an embodiment in which the particles are removed after the continuous-length substrate has passed a region where the continuous-length substrate faces the back-side film adhesion preventive electrode and before the continuous-length substrate comes into contact with a mechanism for transporting the continuous-length substrate; an embodiment in which the mechanism for transporting the continuous-length substrate is a roller. more preferred embodiments of the apparatus of the present invention may also include; an embodiment in which the mechanism for removing particles comprises a member comprising an insulating material; an embodiment in which the mechanism for removing particles comprises a member which is so disposed that its longitudinal direction is in a direction not being at right angles to the transport direction of the continuous-length substrate, and comes into contact with the continuous-length substrate; an embodiment in which the mechanism for removing particles is a mechanism for causing convection of the electrodeposition bath; an embodiment in which the mechanism causing convection of the electrodeposition bath causes the electrodeposition bath to convect in a direction different from the transport direction of the continuous-length substrate; an embodiment in which the mechanism for removing particles comprises a mechanism for spraying a liquid or blowing a gas on the continuous-length substrate; an embodiment in which the direction in which the liquid or gas is sprayed or blown is different from the transport direction of the continuous-length substrate; an embodiment in which the mechanism for removing particles is provided between a region where the continuous-length substrate faces the back-side film adhesion preventive electrode and a mechanism for transporting the continuous-length substrate with which mechanism the continuous-length substrate comes into contact first after the continuous-length substrate has passed that region; and an embodiment in which the mechanism for transporting the continuous-length substrate is a roller. brief description of the drawings fig. 1 is a diagrammatic cross-sectional view showing an example of a photovoltaic device produced using the present invention. fig. 2 is a cross-sectional illustration of an example of an electrodeposition apparatus according to the present invention. figs. 3 , 4 , 5 , 6 , 7 and 8 are partially enlarged views of the apparatus cross-sectionally illustrated in fig. 2 . fig. 9 is a cross-sectional illustration of an example of an exhaust duct system of the apparatus shown in fig. 2 . fig. 10 is a diagrammatic cross-sectional view showing an example of an electrodeposition apparatus according to the present invention. fig. 11 is a diagrammatic cross-sectional view showing an example of an electrodeposition apparatus according to the present invention. fig. 12a is a diagrammatic plan view showing an example of a mechanism for removing particles, used in the present invention, and fig. 12b is a cross-sectional view along the line 12 b 12 b of fig. 12 a. fig. 13a is a diagrammatic plan view showing an example of a mechanism for removing particles, used in the present invention, and fig. 13b is a cross-sectional view along the line 13 b 13 b of fig. 13 a. fig. 14 is a diagrammatic cross-sectional view showing an example of an electrodeposition apparatus according to the present invention. fig. 15 is a cross-sectional view along the line 15 15 of fig. 14 , showing an example of a mechanism for removing particles, used in the present invention. figs. 16a , 16 b and 16 c are diagrammatic plan views showing examples of a mechanism for removing particles, used in the present invention. fig. 17 is a diagrammatic cross-sectional view showing an example of an electrodeposition apparatus according to the present invention. fig. 18 is a diagrammatic cross-sectional view showing an example of a photovoltaic device produced using the present invention. description of the preferred embodiments in preferred embodiments of the present invention, a zinc oxide film effective for improving solar cell characteristics and having a high reliability is formed so that it can make larger the amount of electric current produced by light-collection and also contribute to an improvement in reliability. it moreover intends to achieve such aims inexpensively and stably in an industrial scale. for this end, in a process in which a back-side film adhesion preventive electrode is provided so as to form zinc oxide film while preventing unwanted films from adhering to the back side of a substrate, a fallen-particle removal mechanism is provided so that any fallen matter on a continuous-length substrate can be removed before it passes a roller, any impact marks can be made less occur and a zinc oxide film having a high reliability can be formed. this is the basic idea of the present invention. fig. 1 is a diagrammatic cross-sectional view showing an example of a photovoltaic device produced using the present invention. in fig. 1 , reference numeral 101 denotes a support; 102 , a metal layer; 103 , a zinc oxide film formed by electrodeposition; 104 , a semiconductor layer; 105 , a transparent conductive layer; and 106 , a collector electrode. the support 101 and the metal layer 102 constitute a light-reflecting metal substrate referred to in the present invention, which may also be made up using a sus stainless steel sheet or the like having thereon a layer of a metal with good reflecting properties such as aluminum or silver and a thin zinc oxide film formed in a different way. incidentally, when the device is so constructed that a transparent substrate is used as the support and light enters from the support side, the respective layers are formed in reverse order except for the support. other constituents of the present invention are described below. formation of zinc oxide film by electrodeposition as a method of forming the zinc oxide film, a layer may be formed by means of, e.g., an apparatus shown in fig. 10 . in fig. 10 , reference numeral 301 denotes an anti-corrosion container. as an aqueous electrodeposition solution 302 , an aqueous solution containing nitrate ions and zinc ions may preferably be used. in such a case, the nitrate ions may preferably be in an ion concentration of from 0.004 mol/liter to 6.0 mol/liter, more preferably from 0.001 mol/liter to 1.5 mol/liter, and still more preferably from 0.1 mol/liter to 1.4 mol/liter. the zinc ions may preferably be in an ion concentration of from 0.002 mol/liter to 3.0 mol/liter, more preferably from 0.01 mol/liter to 2.0 mol/liter, and still more preferably from 0.05 mol/liter to 1.0 mol/liter. in order to prevent abnormal growth, sucrose or dextrin may also preferably be contained in the aqueous solution. in such a case, the sucrose may preferably be in a concentration of from 500 g/liter to 1 g/liter, and more preferably from 100 g/liter to 3 g/liter. the dextrin may preferably be in a concentration of from 10 g/liter to 0.01 g/liter, and more preferably from 1 g/liter to 0.025 g/liter. such measures enable well efficient formation of a zinc oxide film having a textural structure suited for the light entrapment effect. as shown in fig. 10 , a substrate 303 (the light-reflecting metal substrate described above) and an opposing electrode 304 are connected to a power source 305 via a load resistor 306 . here, electric current may preferably be at a density of from 0.1 ma/cm ^{ 2 } to 100 ma/cm ^{ 2 } , more preferably from 1 ma/cm ^{ 2 } to 30 ma/cm ^{ 2 } , and still more preferably from 3 ma/cm ^{ 2 } to 15 ma/cm ^{ 2 } (the electric current flowing from the substrate to the opposing electrode is regarded as positive). in fig. 10 , reference numeral 314 denotes a back-side film adhesion preventive electrode. the substrate 303 and the back-side film adhesion preventive electrode 314 are connected to a power source 315 via a load resistor 316 , and a negative electric current is flowed to the substrate 303 . here, the electric current may preferably be at a density of from 0.01 a/cm ^{ 2 } to 80 ma/cm ^{ 2 } , more preferably from 0.1 a/cm ^{ 2 } to 15 ma/cm ^{ 2 } , and still more preferably from 1 a/cm ^{ 2 } to 10 ma/cm ^{ 2 } (the electric current flowing from the substrate to the back-side film adhesion preventive electrode is regarded as positive). distance between the electrode 314 and the substrate 303 may be set not larger than 50 cm, and preferably not larger than 10 cm, whereby the back-side film adhesion preventive effect can efficiently be attained. as materials, conductive materials such as sus stainless steel, zn, ti and pt are preferred. solution temperature may be set at 60 c. or above, whereby a uniform zinc oxide film with less abnormal growth can be formed in a good efficiency. to stir the whole solution, a solution circulation system is used which consists of a solution pump-in opening 308 , a solution pump-out opening 307 , a solution circulation pump 311 , a pump-in solution pipe 309 and a pump-out solution pipe 310 . when the solution is of a small scale, a magnetic stirrer may be used. description of working apparatus a continuous-length substrate electrodeposition apparatus to which the present invention is applicable is shown in fig. 2 . its dividedly enlarged views are also given in figs. 3 to 9 . in fig. 2 and figs. 3 to 9 , names and reference numerals of respective members are common. a procedure for forming or depositing an electrodeposited film on a continuous-length substrate by means of this apparatus is described below with reference to these drawings. roughly sectioned, the apparatus consists of a wind-off unit 2012 from which a continuous-length substrate wound into a coil is wound off, a first electrodeposition tank 2066 in which a first electrodeposition film is deposited or treated, a second electrodeposition tank 2116 in which a second electrodeposition film is deposited or treated, a first circulation tank 2120 from which a heated electrodeposition bath is circulatingly fed to the first electrodeposition tank, a second circulation tank 2222 from which a heated electrodeposition bath is circulatingly fed to the second electrodeposition tank, a first waste-solution tank 2172 in which the electrodeposition bath is temporarily stored before the bath of the first electrodeposition tank 2066 is discharged, a second waste-solution tank 2274 in which the electrodeposition bath is temporarily stored before the bath of the second electrodeposition tank 2116 is discharged, a filter circulation system for removing particles in the electrodeposition bath held in the first electrodeposition tank 2066 to make the bath clean (a piping system connected to a first electrodeposition tank filter circulation filter 2161 , see fig. 4 ), a filter circulation system for removing particles in the electrodeposition bath held in the second electrodeposition tank 2116 to make the bath clean (a piping system connected to a second electrodeposition tank filter circulation filter 2263 , see fig. 5 ), a piping system for sending bath-stirring compressed air to both the first electrodeposition tank 2066 and the second electrodeposition tank 2116 (a piping system extending from a compressed air feed inlet 2182 , see fig. 6 ), a pure-water shower tank 2360 in which the continuous-length substrate on which the electrodeposition film has been deposited is washed with a pure-water shower, a first hot-water tank (here is called hot water since hot water is used for the pure water of a rinsing tank) 2361 in which first pure-water rinsing is carried out, a second hot-water tank 2362 in which second pure-water rinsing is carried out, a pure-water heating tank 2339 from which necessary pure-water hot water is fed to these hot-water tanks, a drying section 2363 which dries the continuous-length substrate with film (film-deposited substrate) after it has been washed, a wind-up unit 2296 for winding again into a coil the continuous-length substrate on which film deposition has been completed, and an exhaust system for discharging water vapor generated at the stage of heating the electrodeposition bath or pure water and at the stage of drying (an exhaust system constituted of an electrodeposition water washing system exhaust duct 2020 , see figs. 4 and 5 , or a drying system exhaust duct 2370 , see fig. 7 ). the continuous-length substrate is transported on from the left to the right as viewed in the drawing, in the order of the wind-off unit 2012 , the first electrodeposition tank 2066 , the second electrodeposition tank 2116 , the pure-water shower tank 2360 , the first hot-water tank 2361 , the second hot-water tank 2362 , the drying section 2363 and the wind-up unit 2296 , so that a stated electrodeposition film is deposited. in the wind-off unit 2012 , as shown in fig. 3 a continuous-length substrate 2006 wound into a coil on a continuous-length substrate bobbin 2001 is set, and the continuous-length substrate 2006 is wound off through a feed control roller 2003 , a direction-changing roller 2004 and a delivery roller 2005 in this order. especially where a subbing layer has been deposited on the coil-shaped continuous-length substrate, the substrate is supplied in the form where an interleaf (interleaving paper) has been rolled up so that the substrate or layer can be protected. accordingly, in the case where the interleaf has been rolled up, an interleaf 2007 is wound up on an interleaf wind-up bobbin 2002 as the continuous-length substrate is wound off. the direction in which the continuous-length substrate 2006 is transported is shown by an arrow 2010 , the direction in which the continuous-length substrate bobbin 2001 is rotated is shown by an arrow 2009 , and the direction in which the interleaf wind-up bobbin 2002 is wound up is shown by an arrow 2008 . fig. 3 shows that the continuous-length substrate delivered from the continuous-length substrate bobbin 2001 and the interleaf wound up on the interleaf wind-up bobbin 2002 are not interfered with each other at the transport-starting position and the transport-ending position. for the purpose of dust-proofing, the whole wind-off unit is so structured as to be covered with a wind-off unit clean booth 2011 making use of a hepa (high-frequency particulate air) filter and a down flow. the first electrodeposition tank 2066 comprises, as shown in fig. 4 , a first electrodeposition bath holder tank 2065 which is not corrosive against the electrodeposition bath and can keep the temperature of the electrodeposition bath, and in that tank a temperature-controlled electrodeposition bath is so held as to have a first electrodeposition bath surface 2025 . the position of this bath surface is realized by an over flow attributable to a partition plate provided inside the first electrodeposition bath holder tank 2065 . the partition plate (not shown) is so installed that the electrodeposition bath is let fall toward the inner-part side by the whole first electrodeposition bath holder tank 2065 . the overflowed electrodeposition bath collected in tub structure in a first electrodeposition tank overflow return opening 2024 comes to the first circulation tank 2120 through a first electrodeposition tank overflow return path 2117 , where the bath is heated and is circulated again into the first electrodeposition bath holder tank 2065 from a first electrodeposition tank upstream circulation jet pipe 2063 and a first electrodeposition tank downstream circulation jet pipe 2064 (not shown) to form an inflow of the electrodeposition bath in a quantity enough for prompting the overflow. the continuous-length substrate 2006 is passed through the inside of the first electrodeposition tank 2066 via an electrodeposition tank entrance turn-back roller 2013 (see fig. 3 ), a first electrodeposition tank approach roller 2014 , a first electrodeposition tank withdrawal roller 2015 and an electrodeposition tank-to-tank turn-back roller 2016 . between the first electrodeposition tank approach roller 2014 and the first electrodeposition tank withdrawal roller 2015 , at least the film-forming side underside surface (often called surface side in the present specification) of the continuous-length substrate lies in the electrodeposition bath and faces twenty-four anodes 2026 to 2049 . in actual electrodeposition, negative potential is applied to the continuous-length substrate and positive potential to the anodes, and electrodeposition electric current which causes electrochemical reaction concurrently is flowed across the both in the electrodeposition bath to effect electrodeposition. in the present apparatus, the anodes 2026 to 2049 in the first electrodeposition tank 2066 are four by four placed on six anode stands 2054 to 2059 . the anode stands are so structured that the respective anodes are placed thereon through insulating plates, and are so made that individual potential is applied from independent power sources. also, the anode stands 2054 to 2059 have the function to keep distance between the continuous-length substrate 2006 and the anodes 2026 to 2049 in the electrodeposition bath. accordingly, in usual cases, the anode stands 2054 to 2059 are so designed and produced that their height is adjustable to keep a predetermined distance between the both. a first electrodeposition tank back-side film adhesion preventive electrode 2061 provided immediately at the rear of the final-positioned anode 2049 is an anode for electrochemically removing any film deposited unwantedly in the bath on the continuous-length substrate on its side opposite to the film-forming side (often called back side in the present specification). this is materialized by bringing the back-side film adhesion preventive electrode 2061 to a negative-side potential with respect to the continuous-length substrate. whether or not the back-side film adhesion preventive electrode 2061 has its effect actually is confirmable by visually observing that a film of the same materials as the film formed on the film-forming side of the continuous-length substrate is fast removed on and on, which adheres electrochemically to the back, the side opposite to the film-forming side of the continuous-length substrate, because of come-around of an electric field. a first electrodeposition tank fallen-particle removal mechanism 2060 according to the present invention, provided immediately at the rear of the first electrodeposition tank back-side film adhesion preventive electrode 2061 , removes particles having fallen on the continuous-length substrate 2006 , before the particles pass the first electrodeposition tank withdrawal roller 2015 , thus any impact marks can be prevented from occurring when the fallen particles pass the first electrodeposition tank withdrawal roller 2015 . on the film-deposited continuous-length substrate having passed the first electrodeposition tank withdrawal roller 2015 and having come out of the electrodeposition bath, the electrodeposition bath is sprayed from a first electrodeposition tank exit shower 2067 to prevent the film-formed surface from drying to cause unevenness. also, an electrodeposition tank-to-tank cover 2019 provided at a cross-over portion between the first electrodeposition tank 2066 and the second electrodeposition tank 2116 entraps the vapor generated from the electrodeposition bath, to prevent the film-formed surface of the continuous-length substrate from drying. still also, a second electrodeposition tank entrance shower 2068 likewise acts to prevent it from drying. the first circulation tank 2120 functions to heat the electrodeposition bath fed into the first electrodeposition tank 2066 to keep its temperature and jet-circulate it. as described previously, the electrodeposition bath having overflowed from the first electrodeposition tank 2066 is collected at the overflow return opening 2024 , then passes the overflow return path 2117 , and comes to a first circulation tank heating and holding tank 2121 via a first electrodeposition tank overflow return path insulating flange 2118 . inside the first circulation tank heating and holding tank 2121 , eight heaters 2122 to 2129 are provided, and are made to function when a room-temperature electrodeposition bath is initially heated or when the electrodeposition bath having come to have a low bath temperature as a result of circulation is again heated to keep the electrodeposition bath at a stated temperature. two circulation systems are connected to the first circulation tank heating and holding tank 2121 . more specifically, they are a first electrodeposition tank upstream circulation flow-back system through which the electrodeposition bath returns from the first electrodeposition tank upstream circulation jet pipe 2063 to the first electrodeposition bath holder tank 2065 via an upstream circulation main valve 2130 , an upstream circulation pump 2132 , an upstream circulation valve 2135 , an upstream circulation flexible pipe 2136 and an upstream circulation flange insulating pipe 2137 , and a first electrodeposition tank downstream circulation flow-back system through which the electrodeposition bath returns from the first electrodeposition tank downstream circulation jet pipe 2064 to the first electrodeposition bath holder tank 2065 via a downstream circulation main valve 2139 , a downstream circulation pump 2142 , a downstream circulation valve 2145 , a downstream circulation flexible pipe 2148 and a downstream circulation flange insulating pipe 2149 . the electrodeposition bath which returns from the upstream circulation jet pipe 2063 and downstream circulation jet pipe 2064 to the first electrodeposition tank 2066 is circulated so that the electrodeposition bath can effectively be exchanged in the first electrodeposition bath holder tank 2065 , and is circulated as jets from the upstream circulation jet pipe 2063 and downstream circulation jet pipe 2064 provided at a lower part of the first electrodeposition bath holder tank 2065 , through orifices bored in their respective jet pipes. the amount of flowing back of each circulation flow-back system is chiefly controlled by the degree at which the upstream circulation valve 2135 or downstream circulation valve 2145 is opened or closed, and is more delicately controllable by an upstream circulation pump by-pass valve 2133 or a downstream circulation pump by-pass valve 2141 , which is provided in a by-pass system connected by by-passing the upstream circulation pump 2132 or downstream circulation pump 2142 at its exit and entrance. such by-pass systems also have the function to prevent any cavitation in the pumps when the electrodeposition bath is circulated in a small quantity or has a bath temperature very close to the boiling point. the cavitation which may make the bath solution boil to vaporize to make any liquid unfeedable may shorten the lifetime of pumps greatly. when orifices are bored in the first electrodeposition tank upstream circulation jet pipe 2063 and first electrodeposition tank downstream circulation jet pipe 2064 to form jets, the amount of flowing back almost depends on the pressure of the solution returned to the upstream circulation jet pipe 2063 and downstream circulation jet pipe 2064 . to know this pressure, a first electrodeposition tank electrodeposition bath upstream circulation pressure gauge 2134 and a first electrodeposition tank electrodeposition bath downstream circulation pressure gauge 2143 are provided so that the balance of the amount of flowing back can be known by these pressure gauges. stated accurately, the quantity of flowed-back bath solution jetted from the orifices follows the bernouilli theorem. when, however, the orifices bored in the jet pipes are several millimeters in diameter, the jet quantity can be made substantially constant over the whole first electrodeposition tank upstream circulation jet pipe 2063 or first electrodeposition tank downstream circulation jet pipe 2064 . when also the amount of flowing back is sufficiently large, the bath can be exchanged very smoothly. hence, even when the first electrodeposition tank 2066 is fairly long, making bath concentration uniform and making temperature uniform can effectively be achieved. as a matter of course, the first electrodeposition tank overflow return path 2117 should have a diameter large enough for the bath to be flowed back in a sufficient quantity. the upstream circulation flexible pipe 2136 and the downstream circulation flexible pipe 2148 , which are provided in the respective circulation flow-back systems, absorb any strain of piping systems, and are effective especially when flange insulating piping which tends to have an insufficient mechanical strength is used. the upstream circulation flange insulating pipe 2137 and the downstream circulation flange insulating pipe 2149 , which are provided in the respective circulation flow-back systems, make the first circulation tank 2120 and first electrodeposition tank 2066 electrically float together with the first electrodeposition tank overflow return path insulating flange 2118 , provided in the course of the first electrodeposition tank overflow return path 2117 . this is based on the present inventor's findings that the breaking off of formation of unauthorized electric-current paths, i.e., the prevention of stray electric current leads to stable and effective procedure of the electrochemical film-forming reaction that utilizes electrodeposition electric current. the other circulation flow-back system is provided with a by-pass flow-back system which returns directly to the second circulation tank heating and holding tank 2223 and comprises a by-pass circulation flexible pipe 2146 and a by-pass circulation valve 2147 . this is used when the bath should be circulated without circulating the bath solution to the first electrodeposition tank 2066 , e.g., when the bath temperature is raised from room temperature to a stated temperature. the other circulation flow-back system extending from the first circulation tank 2120 is also provided with a solution feed system which passes the first electrodeposition tank withdrawal roller 2015 and extends to the first electrodeposition tank exit shower 2067 . it extends to the first electrodeposition tank exit shower 2067 via a first electrodeposition tank exit shower valve 2150 . the amount of the electrodeposition solution sprayed from the exit shower 2067 is regulated by controlling the degree of opening or closing the exit shower valve 2150 . the first circulation tank heating and holding tank 2121 is actually provided with a cover to provide a structure that can prevent the bath from vaporizing to lose water. when the bath has a high temperature, the cover also comes to have a high temperature, and hence it should be taken into consideration to, e.g., attach a heat insulation material. this is necessary in view of the safety of operation. in order to remove particles floating in the first electrodeposition tank electrodeposition bath, a filter circulation system is provided. a filter circulation system for the first electrodeposition tank 2066 consists of a filter circulation return flexible pipe 2151 , a filter circulation return flange insulating pipe 2152 , a filter circulation main valve 2154 , a filter circulation suction filter 2156 , a filter circulation pump 2157 , a filter circulation pump by-pass valve 2158 , a filter circulation pressure switch 2159 , a filter circulation pressure gauge 2160 , a filter circulation filter 2161 , a filter circulation flexible pipe 2164 , a filter circulation flange insulating pipe 2165 , a filter circulation valve 2166 , a filter circulation system electrodeposition bath upstream return valve 2167 , a filter circulation system electrodeposition bath midstream return valve 2168 and a filter circulation system electrodeposition bath downstream return valve 2169 . through this course, the electrodeposition bath flows in the direction of first electrodeposition tank filter circulation directions 2155 , 2162 and 2163 . the particles to be removed may originate from powder brought in from the outside of the system or may be formed on the electrode surface or in the bath, depending on electrodeposition reaction. minimum size of the particles to be removed depends on the filter size of the filter circulation filter 2161 . the filter circulation return flexible pipe 2151 and the filter circulation flexible pipe 2164 are pipes for absorbing any strain of piping systems to minimize any liquid leakage from pipe-connected portions and also protect the insulating pipe inferior in mechanical strength so that the constituent parts of the circulation system which includes pumps can be disposed at a greater degree of freedom. the filter circulation return flange insulating pipe 2152 and the filter circulation flange insulating pipe 2165 are provided so that the first electrodeposition bath holder tank 2065 set floating from the ground earth can be made to float electrically to prevent it from falling to the ground earth. the filter circulation suction filter 2156 is a wire cloth like a tea strainer, so to speak, and is a filter for removing large foreign matter so as to protect the subsequent filter circulation pump 2157 and filter circulation filter 2161 . the filter circulation filter 2161 is the leading part of this circulation system, and is a filter for removing any particles having mixed or occurred in the electrodeposition bath. circulation flow rate of the electrodeposition bath in this circulation system is micro-adjusted primarily by the filter circulation valve 2166 , and secondarily by the filter circulation pump by-pass valve 2158 , provided in parallel to the filter circulation pump 2157 . the filter circulation pressure gauge 2160 is provided in order to catch the circulation flow rate to be adjusted by these valves. the filter circulation pump by-pass valve 2158 not only micro-adjusts the flow rate but also prevents the filter circulation pump 2157 from breaking because of any cavitation which may occur when the whole filter circulation flow rate is reduced. the electrodeposition bath can be transferred to a first waste-solution tank 2172 (see fig. 6 ) through the filter circulation return flange insulating pipe 2152 via a first electrodeposition tank drain valve 2153 . this transfer is made when the electrodeposition bath is replaced, when the apparatus is put to maintenance work and also on occasion of emergency. the electrodeposition bath as waste solution to be transferred is fallen by gravity-drop into a first waste-solution tank waste-solution holder tank 2144 . for the purpose of maintenance work or emergency measures, the first waste-solution tank waste-solution holder tank 2144 may preferably have a capacity large enough to store the total bath volume in the first electrodeposition tank 2066 and the first circulation tank 2120 . the first waste-solution tank waste-solution holder tank 2144 is provided with a top cover 2277 and, in order to make the gravity-drop transfer of the electrodeposition bath effective, it is provided with an air vent 2171 and a first waste-solution tank air vent valve 2170 . the electrodeposition bath which has temporarily been fallen into the first waste-solution tank waste-solution holder tank 2144 is, after its temperature has lowered, sent out through a waste-solution drainage valve 2173 for drainage treatment on the side of a building, or collected in a steel drum (not shown) through a waste-solution collection valve 2174 , a waste-solution collection main valve 2175 , a waste-solution collection main suction filter 2176 and a waste-solution collection pump 2177 so as to be put to appropriate disposal. before the collection or treatment, the waste solution may also be diluted with water or treated with chemicals in the waste-solution holder tank 2144 . in order to stir the electrodeposition bath to make uniform formation of the electrodeposition film, the system is so designed that air bubbles are jetted from a plurality of orifices bored in a first electrodeposition tank stirring air feed pipe 2062 (see fig. 4 ) installed at the bottom of the first electrodeposition bath holder tank 2065 . as air, compressed air fed to a factory is taken in from a compressed-air intake opening 2182 (see fig. 6 , too) and, through an electrodeposition bath stirring compressed-air pressure switch 2183 and in the direction shown by a compressed-air feed direction 2184 , is passed through a compressed-air main valve 2185 , a compressed-air flow meter 2186 , a compressed-air regulator 2187 , a compressed-air mist separator 2188 , a compressed-air feed valve 2189 , a compressed-air flexible pipe 2190 , a compressed-air insulating pipe 2191 and a compressed-air upstream-side control valve 2193 or a compressed-air downstream-side control valve 2192 in order, and is led to the first electrodeposition tank stirring air feed pipe 2062 . the film-deposited continuous-length substrate transported to the second electrodeposition tank 2116 (see fig. 5 ) through the electrodeposition tank-to-tank turn-back roller 2016 is subjected to deposition of a second electrodeposited film or to some treatment. depending on the manner of use of the present apparatus, the second electrodeposited film may be the same as the first electrodeposited film and the first and second electrodeposited films may make up one film. alternatively, the two layers may make up a stacked layer of two layers formed of the same material but endowed with different properties (e.g., a stacked layer of layers formed of the same zinc oxide but having different particle diameters), or a stacked layer of two layers having the same properties but formed of different properties (e.g., a stacked layer of a zinc indium layer as a transparent conductive layer and a zinc oxide layer), or a stacked layer of entirely different layers. still alternatively, a low oxide may be deposited in the first electrodeposition tank 2066 and its oxidation-promoting treatment may be made in the second electrodeposition tank 2116 , or a low oxide may be deposited in the first electrodeposition tank 2066 and its etching treatment may be made in the second electrodeposition tank 2116 . such combinations are possible. accordingly, electrodeposition or treatment conditions such as electrodeposition bath, bath temperature, bath circulation quantity, electric-current density and stirring rate may be selected according to the corresponding purposes. when electrodeposition or treatment time must be made different between the first electrodeposition tank 2066 and the second electrodeposition tank 2116 , the time for which the continuous-length substrate 2006 is passed may be made different between the first electrodeposition tank 2066 and the second electrodeposition tank 2116 . to make such time different, it may be regulated by making tank length different between the first electrodeposition tank 2066 and the second electrodeposition tank 2116 , or by making the continuous-length substrate turn back. the second electrodeposition tank 2116 comprises, as shown in fig. 5 , a second electrodeposition bath holder tank 2115 which is not corrosive against the electrodeposition bath and can keep the temperature of the electrodeposition bath, and in that tank a temperature-controlled electrodeposition bath is so held as to have a second electrodeposition bath surface 2074 . the position of this bath surface is realized by an over flow attributable to a partition plate provided inside the second electrodeposition bath holder tank 2115 . the partition plate (not shown) is so installed that the electrodeposition bath is let fall toward the inner-part side by the whole second electrodeposition bath holder tank 2115 . the overflowed electrodeposition bath collected in tub structure in a second electrodeposition tank overflow return opening 2075 comes to the second circulation tank 2222 through a second electrodeposition tank overflow return path 2219 , where the bath is heated and is circulated again into the second electrodeposition bath holder tank 2115 from a second electrodeposition tank upstream circulation jet pipe 2113 and a second electrodeposition tank downstream circulation jet pipe 2114 to form an inflow of the electrodeposition bath in a quantity enough for prompting the overflow. the film-deposited continuous-length substrate 2006 is passed through the inside of the second electrodeposition tank 2116 via the electrodeposition tank-to-tank turn-back roller 2016 , a second electrodeposition tank approach roller 2069 , a second electrodeposition tank withdrawal roller 2070 and a pure-water shower tank turn-back approach roller 2279 . between the second electrodeposition tank approach roller 2069 and the second electrodeposition tank withdrawal roller 2070 , the surface side of the continuous-length substrate lies in the electrodeposition bath and faces twenty-four anodes 2076 to 2099 . in actual electrodeposition, negative potential is applied to the continuous-length substrate and positive potential to the anodes, and electrodeposition electric current which causes electrochemical reaction concurrently is flowed across the both in the electrodeposition bath to effect electrodeposition. in the present apparatus, the anodes 2076 to 2099 in the second electrodeposition tank 2116 are four by four placed on six anode stands 2104 to 2109 . the anode stands are so structured that the respective anodes are placed thereon through insulating plates, and are so made that individual potential is applied from independent power sources. also, the anode stands 2104 to 2109 have the function to keep distance between the continuous-length substrate 2006 and the anodes 2076 to 2099 in the electrodeposition bath. accordingly, in usual cases, the anode stands 2104 to 2109 are so designed and produced that their height is adjustable to keep a predetermined distance between the both. a second electrodeposition tank back-side film adhesion preventive electrode 2111 provided immediately at the rear of the second electrodeposition tank final-positioned anode 2099 is an anode for electrochemically removing any film deposited unwontedly in the bath on the back side of the continuous-length substrate on. this is materialized by bringing the second electrodeposition tank back-side film adhesion preventive electrode 2111 to a negative-side potential with respect to the continuous-length substrate. whether or not the second electrodeposition tank back-side film adhesion preventive electrode 2111 has its effect actually is confirmable by visually observing that a film of the same materials as the film formed on the film-forming side of the continuous-length substrate is fast removed on and on, which adheres electrochemically to the back side, the side opposite to the film-forming side of the continuous-length substrate, because of come-around of an electric field. a second electrodeposition tank fallen-particle removal mechanism 2110 according to the present invention, provided immediately at the rear of the second electrodeposition tank back-side film adhesion preventive electrode 2111 , removes particles having fallen on the continuous-length substrate 2006 , before the particles pass the second electrodeposition tank withdrawal roller 2070 , thus any impact marks can be prevented from occurring when the fallen particles pass the second electrodeposition tank withdrawal roller 2070 . on the film-deposited continuous-length substrate having passed the second electrodeposition tank withdrawal roller 2070 and having come out of the electrodeposition bath, the electrodeposition bath is sprayed from a second electrodeposition tank exit shower 2297 to prevent the film-formed surface from drying to cause unevenness. also, a pure-water shower tank turn-back approach roller cover 2318 provided at a cross-over portion between the second electrodeposition tank 2116 and a pure-water shower tank 2360 entraps the vapor generated from the electrodeposition bath, to prevent the film-formed surface of the continuous-length substrate from drying. still also, a pure-water shower tank entrance surface-side pure-water shower 2299 and a pure-water shower tank entrance back-side pure-water shower 2300 (see fig. 7 ) not only wash off the electrodeposition bath but also function likewise. the second circulation tank 2222 functions to heat the electrodeposition bath fed into the second electrodeposition tank 2116 to keep its temperature and jet-circulate it. as described previously, the electrodeposition bath having overflowed from the second electrodeposition tank 2116 is collected at the overflow return opening 2075 , then passes the overflow return path 2219 , and comes to a second circulation tank heating and holding tank 2223 via a second electrodeposition tank overflow return path insulating flange 2220 . inside the second circulation tank heating and holding tank 2223 , eight heaters 2224 to 2231 are provided, and are made to function when a room-temperature electrodeposition bath is initially heated or when the electrodeposition bath having come to have a low bath temperature as a result of circulation is again heated to keep the electrodeposition bath at a stated temperature. two circulation systems are connected to the second circulation tank heating and holding tank 2223 . more specifically, they are a second electrodeposition tank upstream circulation flow-back system through which the electrodeposition bath returns from the second electrodeposition tank upstream circulation jet pipe 2113 to the second electrodeposition bath holder tank 2115 via an upstream circulation main valve 2232 , an upstream circulation pump 2234 , an upstream circulation valve 2237 , an upstream circulation flexible pipe 2238 and an upstream circulation flange insulating pipe 2239 , and a second electrodeposition tank downstream circulation flow-back system through which the electrodeposition bath returns from the second electrodeposition tank downstream circulation jet pipe 2114 to the second electrodeposition bath holder tank 2115 via a downstream circulation main valve 2242 , a downstream circulation pump 2245 , a downstream circulation valve 2247 , a downstream circulation flexible pipe 2248 and a downstream circulation flange insulating pipe 2249 . the electrodeposition bath which returns from the upstream circulation jet pipe 2113 and downstream circulation jet pipe 2114 to the second electrodeposition tank 2116 is circulated so that the electrodeposition bath can effectively be exchanged in the second electrodeposition bath holder tank 2115 , and is circulated as jets from the upstream circulation jet pipe 2113 and downstream circulation jet pipe 2114 provided at a lower part of the second electrodeposition bath holder tank 2115 , through orifices bored in their respective jet pipes. the amount of flowing back of each circulation flow-back system is chiefly controlled by the degree at which the upstream circulation valve 2237 or downstream circulation valve 2247 is opened or closed, and is more delicately controllable by an upstream circulation pump by-pass valve 2235 or a downstream circulation pump by-pass valve 2244 , which is provided in a by-pass system connected by by-passing the upstream circulation pump 2234 or downstream circulation pump 2245 at its exit and entrance. such by-pass systems also have the function to prevent any cavitation in the pumps when the electrodeposition bath is circulated in a small quantity or has a bath temperature very close to the boiling point. the cavitation which, as also stated in the description of the first electrodeposition tank 2066 , may make the bath solution boil to vaporize to make any liquid unfeedable may shorten the lifetime of pumps greatly. when orifices are bored in the second electrodeposition tank upstream circulation jet pipe 2113 and second electrodeposition tank downstream circulation jet pipe 2114 to form jets, the amount of flowing back almost depends on the pressure of the solution returned to the upstream circulation jet pipe 2113 and downstream circulation jet pipe 2114 . to know this pressure, a second electrodeposition tank electrodeposition bath upstream circulation pressure gauge 2236 and a second electrodeposition tank electrodeposition bath downstream circulation pressure gauge 2246 are provided so that the balance of the amount of flowing back can be known by these pressure gauges. stated accurately, the quantity of flowed-back bath solution jetted from the orifices follows the bernouilli theorem. when, however, the orifices bored in the jet pipes are several millimeters in diameter, the jet quantity can be made substantially constant over the whole second electrodeposition tank upstream circulation jet pipe 2113 or second electrodeposition tank downstream circulation jet pipe 2114 . when also the amount of flowing back is sufficiently large, the bath can be exchanged very smoothly. hence, even when the second electrodeposition tank 2116 is fairly long, making bath concentration uniform and making temperature uniform can effectively be achieved. as a matter of course, the second electrodeposition tank overflow return path 2219 should have a diameter large enough for the bath to be flowed back in a sufficient quantity. the upstream circulation flexible pipe 2238 and the downstream circulation flexible pipe 2248 , which are provided in the respective circulation flow-back systems, absorb any strain of piping systems, and are effective especially when flange insulating piping which tends to have an insufficient mechanical strength is used. the upstream circulation flange insulating pipe 2239 and the downstream circulation flange insulating pipe 2249 , which are provided in the respective circulation flow-back systems, make the second circulation tank 2222 and second electrodeposition tank 2116 electrically float together with the second electrodeposition tank overflow return path insulating flange 2220 , provided in the course of the second electrodeposition tank overflow return path 2219 . this is based on the present inventors' findings that the breaking off of formation of unauthorized electric-current paths, i.e., the prevention of stray electric current leads to stable and effective procedure of the electrochemical film-forming reaction that utilizes electrodeposition electric current. the other circulation flow-back system is provided with a by-pass flow-back system which returns directly to the second circulation tank heating and holding tank 2223 and comprises a by-pass circulation flexible pipe 2250 and a by-pass circulation valve 2251 . this is used when the bath should be circulated without circulating the bath solution to the second electrodeposition tank 2116 , e.g., when the bath temperature is raised from room temperature to a stated temperature. both the circulation flow-back systems extending from the second circulation tank 2222 are also provided with two solution feed systems, one of which send the electrodeposition bath to a second electrodeposition tank entrance shower 2068 which sprays the bath on the film-deposited continuous-length substrate immediately before it reaches the second electrodeposition tank approach roller 2069 , and the other of which send the electrodeposition bath to a second electrodeposition tank exit shower 2297 which sprays the bath on the film-deposited continuous-length substrate having passed the second electrodeposition tank withdrawal roller 2075 (not shown) to have come out of the electrodeposition bath. the former extends to the second electrodeposition tank entrance shower 2068 via a second electrodeposition tank entrance shower valve 2241 , and the latter extends to the second electrodeposition tank exit shower 2297 via a second electrodeposition tank exit shower valve 2252 . the amount of the electrodeposition solution sprayed from the entrance shower 2068 is regulated by controlling the degree of opening or closing the entrance shower valve 2241 , and the amount of the electrodeposition solution sprayed from the exit shower 2297 is regulated by controlling the degree of opening or closing the exit shower valve 2252 . the second circulation tank heating and holding tank 2223 is actually provided with a cover to provide a structure that can prevent the bath from vaporizing to lose water. when the bath has a high temperature, the cover also comes to have a high temperature, and hence it should be taken into consideration to, e.g., attach a heat insulation material. this is necessary in view of the safety of operation. in order to remove particles floating in the second electrodeposition tank electrodeposition bath, a filter circulation system is provided. a filter circulation system for the second electrodeposition tank 2116 consists of a filter circulation return flexible pipe 2253 , a filter circulation return flange insulating pipe 2254 , a filter circulation main valve 2256 , a filter circulation suction filter 2258 , a filter circulation pump 2260 , a filter circulation pump by-pass valve 2259 , a filter circulation pressure switch 2261 , a filter circulation pressure gauge 2262 , a filter circulation filter 2263 , a filter circulation flexible pipe 2266 , a filter circulation flange insulating pipe 2267 , a filter circulation valve 2268 , a filter circulation system electrodeposition bath upstream return valve 2269 , a filter circulation system electrodeposition bath midstream return valve 2270 and a filter circulation system electrodeposition bath downstream return valve 2271 . through this course, the electrodeposition bath flows in the direction of second electrodeposition tank filter circulation directions 2257 , 2264 and 2265 . the particles to be removed may originate from powder brought in from the outside of the system or may be formed on the electrode surface or in the bath, depending on electrodeposition reaction. minimum size of the particles to be removed depends on the filter size of the filter circulation filter 2263 . the filter circulation return flexible pipe 2253 and the filter circulation flexible pipe 2266 are pipes for absorbing any strain of piping systems to minimize any liquid leakage from pipe-connected portions and also protect the insulating pipe inferior in mechanical strength so that the constituent parts of the circulation system which includes pumps can be disposed at a greater degree of freedom. the filter circulation return flange insulating pipe 2254 and the filter circulation flange insulating pipe 2267 are provided so that the second electrodeposition bath holder tank 2115 set floating from the ground earth can be made to float electrically to prevent it from falling to the ground earth. the filter circulation suction filter 2258 is a wire cloth like a tea strainer, so to speak, and is a filter for removing large foreign matter so as to protect the subsequent filter circulation pump 2260 and filter circulation filter 2263 . the filter circulation filter 2263 is the leading part of this circulation system, and is a filter for removing any particles having mixed or occurred in the electrodeposition bath. circulation flow rate of the electrodeposition bath in this circulation system is micro-adjusted primarily by the filter circulation valve 2268 , and secondarily by the filter circulation pump by-pass valve 2259 , provided in parallel to the filter circulation pump 2260 . the filter circulation pressure gauge 2262 is provided in order to catch the circulation flow rate to be adjusted by these valves. the filter circulation pump by-pass valve 2259 not only micro-adjusts the flow rate but also prevents the filter circulation pump 2260 from breaking because of any cavitation which may occur when the whole filter circulation flow rate is reduced. the electrodeposition bath can be transferred to a second waste-solution tank 2274 (see fig. 6 ) through the filter circulation return flange insulating pipe 2254 via a second electrodeposition tank drain valve 2255 . this transfer is made when the electrodeposition bath is replaced, when the apparatus is put to maintenance work and also on occasion of emergency. the electrodeposition bath as waste solution to be transferred is fallen by gravity-drop into a second waste-solution tank waste-solution holder tank 2273 . for the purpose of maintenance work or emergency measures, the second waste-solution tank waste-solution holder tank 2273 may preferably have a capacity large enough to store the total bath volume in the second electrodeposition tank 2116 and the second circulation tank 2222 . the second waste-solution tank waste-solution holder tank 2273 is provided with a top cover 2278 and, in order to make the gravity-drop transfer of the electrodeposition bath effective, it is provided with an air vent 2276 and a second waste-solution tank air vent valve 2275 . the electrodeposition bath which has temporarily been fallen into the second waste-solution tank waste-solution holder tank 2273 is, after its temperature has lowered, sent out through a waste-solution drainage valve 2180 for drainage treatment on the side of a building, or collected in a steel drum (not shown) through a waste-solution collection valve 2181 , a waste-solution collection main valve 2175 , a waste-solution collection main suction filter 2176 and a waste-solution collection pump 2177 so as to be put to appropriate disposal. before the collection or treatment, the waste solution may also be diluted with water or treated with chemicals in the waste-solution holder tank 2273 . in order to stir the electrodeposition bath to make uniform formation of the electrodeposition film, the system is so designed that air bubbles are jetted from a plurality of orifices bored in a second electrodeposition tank stirring air feed pipe 2112 (see fig. 5 ) installed at the bottom of the second electrodeposition bath holder tank 2115 . as air, compressed air fed to a factory is taken in from a compressed-air intake opening 2182 (see fig. 6 , too) and, through an electrodeposition bath stirring compressed-air pressure switch 2183 and in the direction shown by a compressed-air feed direction 2194 , is passed through a compressed-air main valve 2195 , a compressed-air flow meter 2196 , a compressed-air regulator 2197 , a compressed-air mist separator 2198 , a compressed-air feed valve 2199 , a compressed-air flexible pipe 2200 , a compressed-air insulating pipe 2201 and a compressed-air upstream-side control valve 2202 or a compressed-air downstream-side control valve 2272 in order, and is led to the second electrodeposition tank stirring air feed pipe 2112 . in the first electrodeposition tank 2066 and second electrodeposition tank 2116 , as shown in fig. 6 a preliminary feed system is installed so that a preliminary liquid or gas can be fed in. liquid or gas having entered from an electrodeposition tank preliminary feed inlet 2213 is fed via an electrodeposition tank preliminary feed valve 2214 , into the first electrodeposition tank 2066 through a first electrodeposition tank preliminary feed valve 2215 (not shown) and a first electrodeposition tank preliminary feed insulating pipe 2216 (not shown), and also into the second electrodeposition tank 2116 through a second electrodeposition tank preliminary feed valve 2217 and a second electrodeposition tank preliminary feed insulating pipe 2218 . in the preliminary feed system, those having the highest possibility of being fed in are retaining agents or replenishing chemicals which are used for keeping the ability of the bath constant for a long time. in some cases, they may be gases to be dissolved in the bath or acids capable of removing the particles. the rinsing is carried out through three stages of a pure-water shower tank 2360 , a first hot-water tank 2361 and a second hot-water tank 2362 as shown in fig. 7 . its system is so constructed that heated pure water is fed to the second hot-water tank 2362 , and its waste liquor is used in the first hot-water tank 2361 , and further its waste liquor is used in the pure-water shower tank 2360 . thus, after the electrodeposition in the electrodeposition tanks has been completed, the film-deposited continuous-length substrate is washed on with water having purities stepwise made higher. this pure water is fed to a second hot-water tank exit back-side pure-water shower 2309 and a second hot-water tank exit surface-side pure-water shower 2310 . the pure water to be fed is, as shown in fig. 8 , temporarily stored in a pure-water heating tank 2339 from a water washing system pure-water inlet 2337 through a water washing system pure-water feed main valve 2338 , then heated to a predetermined temperature by means of pure-water heaters 2340 to 2343 , and then passed through a pure-water delivery valve 2344 , a pure-water delivery pump 2346 , a tank pressure switch 2347 , a cartridge type filter 2349 and a flow meter 2350 . then the pure water is on the one hand led through a second hot-water tank exit back-side shower valve 2351 to the second hot-water tank exit back-side pure-water shower 2309 ( fig. 7 ) and on the other hand led through a second hot-water tank exit surface-side shower valve 2352 to the second hot-water tank exit surface-side pure-water shower 2310 (fig. 7 ). the heating is in order to improve cleaning effect. the pure water fed to the showers and collected in a second hot-water tank hot-water holding tank 2317 forms a pure-water rinsing bath, and the film-deposited continuous-length substrate is washed with still water. in the second hot-water tank 2362 , a hot-water warming heater 2307 is provided so that the temperature of the pure water does not drop. to the first hot-water tank 2361 , pure water having overflowed the second hot-water tank hot-water holding tank 2317 is fed from the second hot-water tank 2362 via a hot-water tank-to-tank connecting pipe 2322 . to the first hot-water tank 2361 , like the second hot-water tank 2362 , a first hot-water tank hot-water warming heater 2304 is provided so that the temperature of the pure water can be maintained. to the first hot-water tank 2361 , an ultrasonic wave source 2306 is further provided so that any stains on the film-deposited continuous-length substrate surface can positively removed between a first hot-water tank roller 2282 and a second hot-water tank turn-back approach roller 2283 . in the pure-water shower tank 2360 , pure water from a first hot-water tank hot-water holding tank 2316 is, subsequent to a pure-water shower feed main valve 2323 , sent, as shown in fig. 8 , through a pure-water shower feed pump 2325 , a pure-water shower feed pressure switch 2326 , a pure-water shower feed cartridge type filter 2328 and a pure-water shower feed flow meter 2329 , and is further sent from a pure-water shower tank entrance surface-side pure-water shower valve 2330 to a pure-water shower tank entrance surface-side pure-water shower 2299 (fig. 7 ), from a pure-water shower tank entrance back-side pure-water shower valve 2331 to a pure-water shower tank entrance back-side pure-water shower 2300 (fig. 7 ), from a pure-water shower tank exit back-side pure-water shower valve 2332 to a pure-water shower tank exit back-side pure-water shower 2302 (fig. 7 ), and from a pure-water shower tank exit surface-side pure-water shower valve 2333 to a pure-water shower tank exit surface-side pure-water shower 2303 (fig. 7 ), thus washing shower streams are applied to the respective film-deposited continuous-length substrate back side and surface side at the entrance and exit of the pure-water shower tank 2360 . the water having been served on showering is received in a pure-water shower tank receiving tank 2315 , and, as it is, joined with part of the water in the first hot-water tank hot-water holding tank 2316 and second hot-water tank hot-water holding tank 2317 , which is then discarded to a water washing system drainage 2336 . usually, the water having been served on washing contains ions and others, and must be subjected to given treatment. in the pure-water shower tank 2360 , first hot-water tank 2361 and second hot-water tank 2362 , the film-deposited continuous-length substrate is forwarded to a pure-water shower tank return-back approach roller 2279 , a pure-water shower tank roller 2280 , a first hot-water tank return-back approach roller 2281 , a first hot-water tank return-back approach roller 2281 , a first hot-water tank roller 2282 , a second hot-water tank return-back approach roller 2283 , a second hot-water tank roller 2284 and a drying-section return-back roller 2285 . immediately at the rear of the pure-water shower tank return-back approach roller 2279 , a pure-water shower tank back-side brush 2298 is provided so that any relatively large particles or weakly adherent unauthorized products having adhered to the film-deposited continuous-length substrate back side can be removed. the film-deposited continuous-length substrate 2006 having come to the drying section 2363 is first hydro-extracted with a drying-section entrance back-side air knife 2311 and a drying-section entrance back-side air knife 2312 . to the air-knives, air is fed through the course consisting of, as shown in fig. 8 , a drying-system compressed-air feed inlet 2353 , a drying-system compressed-air pressure switch 2354 , a drying-system compressed-air filter regulator 2355 , a drying-system compressed-air mist separator 2356 , a drying-system compressed-air feed valve 2357 and then a drying-section entrance back-side air knife valve 2358 or a drying-section entrance surface-side air knife valve 2359 . the air fed to the drying section 2363 may cause a difficulty especially if it contains water drops or the like. accordingly, the role of the drying-system compressed-air mist separator 2356 is important. in the course where the film-deposited continuous-length substrate is transported from the drying-section return-back roller 2285 to a wind-up unit approach roller 2286 , it is dried by radiation heat of ir lamps arranged there. as long as the ir lamps provide sufficient radiation heat, no difficulty may occur even when the continuous-length substrate 2006 is put into a vacuum apparatus such as a cvd apparatus after the electrodeposition film has been formed thereon. at the time of drying, the hydro-extraction causes fog and the ir lamp radiation causes water vapor. accordingly, it is indispensable to provide a drying-section exhaust vent 2314 communicating with an exhaust duct. the water vapor collected in a drying-system exhaust duct 2370 is, as shown in fig. 9 , almost all returned to water through a drying-system condenser 2371 , which is then discarded to a drying-system condenser water drainage 2373 and is partly discarded to drying-system exhaust 2374 . when the water vapor contains any harmful gases, it should be driven off after given treatment. in the wind-up unit 2296 (see fig. 7 ), the film-deposited continuous-length substrate 2006 is brought to pass an approach roller 2286 , a direction change roller 2287 , a wind-up regulation roller 2288 in order, and is successively wound up in a coil on a film-deposited continuous-length substrate wind-up bobbin 2289 . when it is necessary to protect the deposited film, an interleaf is wound off from an interleaf wind-off bobbin 2290 and is rolled up on the film-deposited continuous-length substrate. the direction in which the film-deposited continuous-length substrate 2006 is transported is shown by an arrow 2292 , the direction in which the film-deposited continuous-length substrate wind-up bobbin 2289 is rotated is shown by an arrow 2293 , and the direction in which the interleaf wind-off bobbin 2290 is wound up is shown by an arrow 2294 . fig. 7 shows that the film-deposited continuous-length substrate 2006 wound up on the wind-up bobbin 2289 and the interleaf wound off from the interleaf wind-off bobbin 2290 are not interfered with each other at the transport-starting position and the transport-ending position. for the purpose of dust-proofing, the whole wind-up unit is so structured as to be covered with a clean booth 2295 making use of a hepa filter and a down flow. in this wind-up unit, the direction change roller 2287 is provided with the function to correct any meandering of the continuous-length substrate 2006 . in accordance with signals from a meander detector provided between the direction change roller 2287 and the wind-up regulation roller 2288 , the direction change roller 2287 is made to swing by a hydraulic servo around a shaft set on the side of the approach roller 2286 , whereby any meandering motion can be corrected. the direction change roller 2287 is controlled by the movement of the roller approximately toward this side or the inner-part side, and the direction of its movement is opposite to the direction of detection of the meandering of the continuous-length substrate from the meander detector. gain of the servo depends on the continuous-length substrate transport speed, and is commonly not required to be large. even when a continuous-length substrate of hundreds of meters in length is wound up, its edge faces can be made even at a precision on a submillimetric order. use of the electrodeposition bath and hot water at a temperature higher than room temperature generates water vapor necessarily. in particular, their use at a temperature higher than 80 c. generates water vapor considerably. water vapor generated from the bath surface in the tank may gather on the bath surface in the tank to come to spout strongly from gaps of the apparatus or to become released in a large quantity when the cover is opened, or it may flow down in water drops from gaps of the apparatus, to worsen operational environment of the apparatus. accordingly, the water vapor may preferably be discharged forcedly by suction. water vapor is collected to the exhaust duct 2020 via an upstream exhaust vent 2021 , a midstream exhaust vent 2022 and a downstream exhaust vent 2023 of the first electrodeposition tank 2066 and also an upstream exhaust vent 2071 , a midstream exhaust vent 2072 and a downstream exhaust vent 2073 of the second electrodeposition tank 2116 , an exhaust vent 2301 of the pure-water shower tank 2360 , an exhaust vent 2305 of the first hot-water tank 2361 and an exhaust vent 2308 of the second hot-water tank 2362 , and is, as shown in fig. 9 , passed through insulating flanges ( 2364 , 2365 ) and almost all returned to water through an electrodeposition water washing system exhaust duct condenser 2366 , which is then discarded to a condenser water drainage 2368 and is partly discarded to electrodeposition water washing system exhaust 2369 . when the water vapor contains any harmful gases, it should be driven off after given treatment. in the present apparatus, the exhaust duct 2020 is constituted of stainless steel. accordingly, in order to bring the bath holder tank 2065 of the first electrodeposition tank 2066 and the bath holder tank 2115 of the second electrodeposition tank 2116 from the ground earth to the float potential, an electrodeposition water washing system exhaust duct key insulating flange 2365 and an electrodeposition water washing system exhaust duct water-washing-side insulating flange 2364 are provided so that the both tanks are electrically separated. back-side film adhesion preventive electrode unauthorized electrodeposition films formed on the back side are removed by means of the back-side film adhesion preventive electrode ( 2061 or 2111 ). a potential negative to the substrate is applied to the back-side film adhesion preventive electrode. hence, it is necessary for the both to stand float-output to each other especially so as to prevent interference with a power source for the electrodeposition. electric current of from 1 a to 60 a per back-side electrode set in one electrodeposition tank is used. as materials for the back-side film adhesion preventive electrode, usable are ti and sus stainless steel, capable of providing a high hydrogen overvoltage. electrodeposits such as zinc oxide stripped from the back side of the substrate and collected at the back-side film adhesion preventive electrode portion may mechanically be stripped on the outside of the apparatus so as to be used repeatedly, or may be discarded together with the back-side film adhesion preventive electrode where the electrode is prepared as a disposable one. fallen particles when films are continuously formed for a long time with use of the back-side film adhesion preventive electrode in the roll-to-roll system, the films may come off because of the stress of films deposited gradually on the back-side film adhesion preventive electrode. the films having come off fall in particles on the film-deposited continuous-length substrate, and thereafter the substrate with particles is transported up to rollers. where the film-deposited continuous-length substrate carrying thereon the particles having fallen thereon passes the rollers, the particles cause the occurrence of impact marks. fallen-particle-removing mechanism the fallen-particle-removing mechanism according to the present invention is installed for the purpose of removing fallen particles before they pass rollers. it may have the shape of a plate (cloth or the like may be wound around it), a brush or a curtain, any of which may also be used in combination. as materials therefor, those having a high corrosion resistance such as sus stainless steel and ti are preferred. in the case of long-time film formation, insulating materials such as teflon, heat-resistant vinyl chloride or frp are preferred. examples of how to install the fallen-particle-removing mechanism are shown in figs. 12a , 12 b, 13 a and 13 b. fig. 12b is a cross sectional view along the line 12 b 12 b in fig. 12 a. fig. 13b is a cross sectional view along the line 13 b 13 b in fig. 13 a. in these drawings, reference numerals 501 and 601 denote back-side film adhesion preventive electrodes; 502 and 602 , fallen-particle-removing mechanism; 503 and 603 , rollers; and 504 and 604 , continuous-length substrates. as shown in figs. 12a , 12 b, 13 a and 13 b, a platelike fallen-particle-removing mechanism may be disposed in parallel or inclination to the transport direction of the continuous-length substrate. also, the inclination of the fallen-particle-removing mechanism in its height direction may freely be changed according to materials therefor and so forth. the process, and the apparatus, for forming zinc oxide films, having a means for removing fallen matter or dust adhering to the continuous-length substrate according to the present invention, are described below giving another example. fig. 14 is a diagrammatic view of an apparatus for forming a zinc oxide film on a continuous-length substrate. fig. 15 is a cross-sectional view along the line 15 15 in fig. 14 . first, an electrodeposition tank 701 is filled with an electrodeposition bath 702 having a predetermined concentration. the bath is well circulated by means of a circulation pump (not shown), and is kept heated constantly at a predetermined temperature by means of a heater provided in a solution holder tank (not shown). this apparatus employs a means for removing fallen matter or dust adhering to the continuous-length substrate according to the present invention, in particular, a means for removing fallen matter or dust adhering to the substrate by utilizing convection of the bath. stated specifically, a jet pipe 712 b for stirring the electrodeposition bath 702 is so installed on the tank wall of the electrodeposition tank 701 that it does not overlap with a back-side film adhesion preventive electrode 713 so that the convection may take place vertically to the transport direction of the continuous-length substrate 703 . next, the continuous-length substrate 703 is stretched across a substrate wind-off roller 710 and a substrate wind-up roller 711 so as to be set in the electrodeposition bath 702 via a power feed roller 704 and transport rollers. anodes 705 to 709 are installed opposingly to the film-forming surface of the substrate. the back-side film adhesion preventive electrode 713 is provided opposingly to the back side of the substrate immediately at the rear of the anode 709 finally positioned. a voltage is applied across the continuous-length substrate 703 and the anodes 705 to 709 in a mode of constant electric current to cause a transparent zinc oxide film to deposit on the surface of the continuous-length substrate. to the back-side film adhesion preventive electrode 713 provided immediately at the rear of the anode 709 finally positioned, a voltage is so applied that the back-side film adhesion preventive electrode 713 comes to be the cathode, setting the substrate side as the anode. thus, the transparent zinc oxide film is successively formed on the continuous-length substrate 703 wound off from the substrate wind-off roller 710 , and any unauthorized film having adhered to the back side is stripped off by the back-side film adhesion preventive electrode 713 . after the zinc oxide film has been formed, the film-deposited continuous-length substrate 703 is passed through a water washing tank 714 and a water washing shower 715 to wash away any bath remaining on the film-deposited substrate, which is then hydro-extracted with an air knife 716 and is finally passed through heating lamps 717 to effect drying. thereafter, the film-deposited continuous-length substrate is wound up on the substrate wind-up roller 711 . substrate as materials for the substrate used in the apparatus shown in fig. 14 , any materials are usable as long as they ensure electrical conduction to their film-forming surfaces and are not attacked by the electrodeposition bath, and metals such as sus stainless steel, al, cu and fe may be used. also usable are pet (polyethylene terephthalate) films coated with metals. of these, sus stainless steel is advantageous for the continuous-length substrate in order to carry out a device fabrication process in a post step. as the sus stainless steel, either of non-magnetic sus stainless steel and magnetic sus stainless steel may be used. the former is typified by sus 304 stainless steel, which has so good abrasive properties that it can be made to have a mirror surface. the latter is typified by ferrite type sus 430 stainless steel, which is effectively usable when transported by utilizing magnetic force. the substrate may have a smooth surface or a rough surface. surface properties can be changed by changing the type of a pressure roller in a sus stainless steel rolling process. sus stainless steel called ba has a surface close to mirror surface, and the one called 2d has a remarkably uneven surface. any of the surfaces may have conspicuous hollows of microscopic order in observation by sem (scanning electron microscopy). as substrates for solar cells, solar-cell characteristics greatly reflect surfaces having an uneven structure of microscopic order, in both a good direction and a bad direction, rather than those having a greatly undulated unevenness. on the substrate, a film of different conductive material may further be formed, which may be selected according to the purpose of electrodeposition. in some cases, forming in advance a very thin layer of zinc oxide by a different process is preferred because deposition rate in electrodeposition can stably be improved. certainly, the electrodeposition has an advantage that it is economical, but it is also advantageous to use two processes in combination as long as the cost reduction can be achieved in total even when a more or less expensive process is additionally employed. back-side film adhesion preventive electrode unauthorized electrodeposition films formed on the back side are removed by means of the back-side film adhesion preventive electrode. a potential negative to the substrate is applied to the back-side film adhesion preventive electrode. hence, it is necessary for the both to stand float-output to each other especially so as to prevent interference with a power source for the electrodeposition. electric current of from 50 ma/cm ^{ 2 } to 70 ma/cm ^{ 2 } per back-side electrode set in one electrodeposition tank is used. as materials for the back-side film adhesion preventive electrode, usable are ti and sus stainless steel, capable of providing a high hydrogen overvoltage. the distance between the back-side film adhesion preventive electrode and the substrate must be neither too small nor too large to show a sufficient effect, and they may preferably be installed at a distance of from 10 mm to 40 mm, and more preferably from 15 mm to 20 mm. zinc oxide stripped from the back side of the substrate and collected at the back-side film adhesion preventive electrode portion may mechanically be stripped on the outside of the apparatus so as to be used repeatedly, or may be discarded together with the back-side film adhesion preventive electrode where the electrode is prepared as a disposable one. films deposited on back-side film adhesion preventive electrode what is deposited in film on the back-side film adhesion preventive electrode is zinc oxide. the zinc oxide deposited on this back-side film adhesion preventive electrode is of hard and brittle nature. the film becomes deposited in such a manner that the film first comes to be deposited on the back-side film adhesion preventive electrode surface facing the substrate and, after it has become deposited to a certain extent, comes to grow in leaves from the part having a high electric field (i.e., electrode cross sections, electrode corners, and heads of bolts with which the electrode is fastened to a stay). the zinc oxide having grown into leaves is affected by the stirring of the bath and affected by the vibration of the substrate to come to fall from the back-side film adhesion preventive electrode. also, the zinc oxide film deposited gradually on the back-side film adhesion preventive electrode increases in film thickness to cause film-peeling because of stress or the like the film itself has. since the distance between the back-side film adhesion preventive electrode and the substrate is as close as from 10 mm to 40 mm, the leaf-like zinc oxide films having fallen are almost all carried up to a roller while being held on the film-deposited substrate to cause impact marks and roller-surface dents and flaws unwantedly. dust when the zinc oxide film is continuously formed for a long time, zinc oxide powder may occur from a zinc plate used as the anode. dust of zinc oxide powder having occurred from the anode may float in the bath as particles and come to adhere to the film-deposited substrate, and thereafter it is transported up to the roller. where the dust adsorbed on the film-deposited continuous-length substrate passes the roller as it is, it is held between the film-deposited substrate and the roller to cause the occurrence of impact marks. impact marks what is called impact marks in the present invention refer to flaws produced when the fallen matter from the back-side film adhesion preventive electrode and the dust particles floating in the bath become adsorbed on the film-deposited substrate and are thereafter held between the roller and the film-deposited substrate. if such impact marks occur in the substrate after the zinc oxide film has been formed thereon, not only the surface appearance required as solar cell substrates is damaged but also cracks or film-peeling may occur in the zinc oxide film deposited by electrodeposition, resulting in a greatly low film quality. the size and shape of impact marks depends on the shape of fallen matter or dust having adhered. also, where the fallen matter or dust having adhered to the film-deposited substrate is crushed when it passes the roller, and the fallen matter or dust has remained between the roller and the film-deposited substrate or on the roller, they may cause the occurrence of impact marks continually. furthermore, not only they cause the occurrence of impact marks on the film-deposited substrate, but also cause dents, flaws and so forth at the roller surface also in respect of rollers which support the substrate, to lead the apparatus into a great damage. means for removing fallen matter or dust adhering to substrate a means for removing fallen matter or dust adhering to the substrate, according to the present invention, is installed in order to remove fallen matter or dust adhering to the substrate, before it passes the roller. this means is made up by, e.g., a system in which the convection of the bath is utilized or a system in which a shower is provided on the front side of the roller and a jet from the shower is utilized. convection of bath as an example of the means for removing fallen matter or dust adhering to the substrate, according to the present invention, convection of the bath is available. this is a system in which convection currents are caused in the bath so that the bath can flow vertically to the substrate transport direction and also along the substrate film-forming surface or the substrate back side, to remove the fallen matter or dust adhering to the substrate. as specific construction, as shown in fig. 15 a jet pipe 712 b is installed on the tank wall of the electrodeposition tank 701 and a reflection plate 801 on the opposing tank wall so that convention currents are caused between the back-side film adhesion preventive electrode 713 and the continuous-length substrate 703 as shown by arrows, for example. the reflection plate 801 may have the shape of a flat plate. taking account of readiness of causing the convection currents, it may preferably be an arcedly curved plate. if the convection currents as proposed in the present invention is caused in the whole bath, it is expected to accelerate the peeling of films deposited on the back-side film adhesion preventive electrode 713 , and hence this is not desirable from the viewpoint of the prevention of impact marks. as the range in which convection currents are to be caused, the convection currents may preferably be caused at part or the whole space between the back-side film adhesion preventive electrode 713 and the roller provided on the downstream side of the continuous-length substrate in its transport direction. shower as an example of the means for removing fallen matter or dust adhering to the substrate, according to the present invention, a shower is available. as the place at which this shower is to be installed, it may preferably be installed on the front side of the roller with which the substrate back side and film-forming side come into contact first after the film-deposited substrate passed the back-side film adhesion preventive electrode 713 . as materials for the shower, sus stainless steel may preferably be used taking account of strength, readiness for working and resistance to chemicals. as the structure of the shower, it may employ a simple structure in which, e.g., holes are made at several spots in a pipe made of sus stainless steel, and besides a structure in which nozzles are provided on a pipe made of sus stainless steel. the size of holes made in the pipe, the distance between the holes to be made and the nozzles to be provided and their angles to the substrate may appropriately be set so that the fallen matter or dust can be removed in a good efficiency. also, as those to be jetted out of the shower, not only liquids such as the bath and the pure water but also gases may be used. here, the flow rate of the liquids or gases may also appropriately be set so that the fallen matter or dust can be removed in a good efficiency. when the above various conditions for the shower are set, care should be taken to install the shower in such a way that its spray does not strike the back-side film adhesion preventive electrode and the zinc oxide films deposited on the back-side film adhesion preventive electrode. unless it is done so, the power of a jet from the shower may accelerate the peeling of the films deposited on the back-side film adhesion preventive electrode. this is not desirable from the viewpoint of the prevention of impact marks. the shower may have any shape which may include i-shape type one in which, as shown in fig. 16a , several nozzles or holes are arranged in a rank, v-shape type one in which, as shown in fig. 16b , nozzles or holes are arranged in a v-shape, and arc type one in which, as shown in fig. 16c , nozzles or holes are arranged in an arc. in figs. 16a to 16 c, reference numeral 901 denotes the continuous-length substrate; 902 , the transport roller; 903 , the back-side film adhesion preventive electrode; 904 , the i-shape type shower; 905 , the v-shape type shower; and 906 , the arc type shower. incidentally, the present invention is applicable not only where the film is formed on the continuous-length substrate, but also commonly where a substrate is transported in contact with a transport means. examples the present invention will be described below in greater detail by giving examples. the present invention is by no means limited to these examples. example 1 a roll-to-roll experimental apparatus shown in fig. 11 was used to make experiment. on sus 430 ba stainless steel sheet wound into a roll, previously silver was deposited in 2,000 thickness (the metal layer 102 ) by means of a roll-adapted dc magnetron sputtering apparatus and zinc oxide was deposited in thin film thereon in 1,000 thickness by means of a like roll-adapted dc magnetron sputtering apparatus to obtain a roll support 403 . on this support, the zinc oxide film 103 was formed. the roll support 403 is wound off from a wind-off roller 401 , and is transported to a zinc oxide film forming tank 406 through a transport roller 404 . a zinc oxide film forming bath 405 contains 0.1 mol/liter of zinc nitrate and 20 g/liter of sucrose. liquid circulation means is disposed in order to stir the bath. the bath is kept at a temperature of 80 c. and also kept at a ph of 4.0 to 6.0. a zinc plate is used in an opposing electrode 409 , and a back-side film adhesion preventive electrode 410 is further provided. then, a fallen-particle-removing mechanism 415 according to the present invention is provided. this fallen-particle-removing mechanism is made up using 5 mm thick sus 304 stainless steel, and is installed vertically to the substrate transport direction. the roll support 403 was grounded. the opposing electrode 409 was set as the positive-side electrode (anode), where electric current of 5.0 ma/cm ^{ 2 } (0.5 a/cm ^{ 2 } ) was flowed across the electrode and the wound-off roll substrate 403 , and electric current of 0.8 ma/cm ^{ 2 } (0.08 a/cm ^{ 2 } ) was further flowed across the support 403 and the back-side film adhesion preventive electrode 410 so that the back-side film adhesion preventive electrode 410 was in a more minus potential to carry out electrodeposition. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up on a wind-up roller 402 through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 1. example 2 electrodeposition was carried out in the same manner as in example 1 except that the fallen-particle-removing mechanism 415 was made of an insulating material. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up on the wind-up roller 402 through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 1. example 3 electrodeposition was carried out in the same manner as in example 2 except that the fallen-particle-removing mechanism 415 was so installed as to have an inclination with respect to the continuous-length substrate movement direction. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up on the wind-up roller 402 through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 1. comparative example 1 electrodeposition was carried out in the same manner as in example 1 except that the fallen-particle-removing mechanism 415 was not used. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up on the wind-up roller 402 through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 1. table 1 60 120 180 240 300 360 420 480 min. min. min. min. min. min. min. min. example 1 0 0 0 0 1 3 10 9 2 0 0 0 0 0 0 3 4 3 0 0 0 0 0 0 0 0 comparative 0 0 5 35 40 42 80 83 example 1 from the results shown in table 1, the following can be concluded. where the fallen-particle-removing mechanism is provided, the impact marks can be made greatly less occur. where the fallen-particle-removing mechanism is made of an insulating material, any films can be prevented from adhering to the fallen-particle-removing mechanism as a result of electrodeposition and any impact marks can be prevented from occurring otherwise because of film-peeling from the fallen-particle-removing mechanism. where the fallen-particle-removing mechanism is made of an insulating material and installed to have an inclination, the particles having been removed can be held at a given place, so that the particles can be prevented from again floating and can make no impact marks occur. example 4 the roll-to-roll apparatus shown in figs. 2 to 9 was used to make experiment. on sus 430 2d stainless steel sheet (the support 101 ) wound into a roll, previously aluminum was deposited in 2,000 thickness (the metal layer 102 ) by means of a roll-adapted dc magnetron sputtering apparatus and zinc oxide was deposited in thin film thereon in 2,000 thickness by means of a like roll-adapted dc magnetron sputtering apparatus to obtain the continuous-length substrate 2006 . on this substrate, the zinc oxide film 103 was formed. the continuous-length substrate 2006 is transported to zinc oxide film forming tanks. the first electrodeposition tank 2066 and the second electrodeposition tank 2116 each hold an electrodeposition bath containing 0.2 mol/liter of zinc nitrate and 1.0 g/liter of dextrin. liquid circulation means are disposed in order to stir the baths. the baths are each kept at a temperature of 80 c. and also kept at a ph of 4.0 to 6.0. zinc plates (350 cm150 cm) are used in the first electrodeposition anodes 2026 to 2049 and the second electrodeposition anodes 2076 to 2099 . the continuous-length substrate 2006 was set as the negative-side electrode (cathode), where electric current of 10.0 ma/cm ^{ 2 } (1.0 a/cm ^{ 2 } ) was flowed across the positive-side electrodes 2026 to 2049 and 2076 to 2099 and the negative-side electrode 2006 each, and also the back-side film adhesion preventive electrodes 2061 and 2111 were set as negative-side electrodes and the continuous-length substrate 2006 was set as the positive-side electrode, where electric current of 50.0 ma/cm ^{ 2 } (5.0 a/cm ^{ 2 } ) was flowed across the positive-side electrode 2006 and the negative-side electrodes 2061 and 2111 . here, as the mechanisms 2060 and 2110 for removing the particles having fallen during transport of the continuous-length substrate, blades of 20 mm, made of teflon, are installed at the rear of the back-side film adhesion preventive electrodes 2061 and 2111 , respectively, in such a fashion that they each have an inclination with respect to the continuous-length substrate movement direction. the film was continuously formed for 8 hours (720 minutes) at a substrate transport speed of 1,500 mm/minute. as the result, a zinc oxide film of 2.0 m in film thickness was continuously formed. as to the number of impact marks which might have occurred when the zinc oxide film was formed by electrodeposition, no impact mark was recognizable from the beginning to the end, in the one-minute visual observation. after the metal layer 102 and the zinc oxide film 103 were formed on the support 101 in this way, a triple-structure semiconductor layer 104 was formed on this zinc oxide film 103 by means of a roll-adapted cvd apparatus. first, a mixed gas of silane and phosphine was used, the metal layer 102 and zinc oxide film 103 formed on the support 101 were heated to 340 c. and an rf (radio frequency) power of 400 w was applied to form an n-type layer. next, a mixed gas of silane, germane and hydrogen was used and a microwave power of 400 w was applied, setting substrate temperature at 450 c., to from an i-type layer. then, setting substrate temperature to 250 c., a p-type layer was further formed using a mixed gas of boron trifluoride, silane and hydrogen. thus, a bottom p-i-n layer was formed. subsequently, a middle n-i-p layer was formed in the same manner as the above except that the ratio of mixing silane and germane in the i-type layer was made larger. then a top p-i-n layer was formed in the same manner as the above except that the i-type layer was formed using silane and hydrogen. thereafter, ito (indium-tin oxide) was deposited by a roll-adapted sputtering apparatus to form the transparent conductive layer 105 . thereafter, the collector electrode layer 106 was formed using silver paste (see fig. 1 ). of sample devices prepared, with regard to a device corresponding to the part immediately after the start of zinc oxide electrodeposition and a device corresponding to the part immediately before its finish, their photoelectric conversion efficiency was measured with a solar simulator (am 1.5, 100 mw/cm ^{ 2 } and surface temperature of 25 c.). these devices were further subjected to an h/h (high temperature/high humidity) test as an accelerated test (the devices were put in an environmental test box for 1,000 hours, having an environment of 85 c. temperature and 85% humidity) to measure the rate of deterioration of photoelectric conversion efficiency. results of the above are shown in table 2. comparative example 2 a zinc oxide film was formed and devices were produced in the same manner as in example 4 except that the fallen-particle-removing mechanism was not used. the number of impact marks occurring when the zinc oxide film was formed by electrodeposition was 0 immediately after its start and began to gradually increase after two hours to become 113 immediately before its finish, in the one-minute visual observation. of samples prepared in this way, with regard to a device obtained on the zinc oxide film at the part immediately after the start of zinc oxide electrodeposition and a device obtained thereon at the part immediately before its finish, their photoelectric conversion efficiency was measured with a solar simulator (am 1.5, 100 mw/cm ^{ 2 } and surface temperature of 25 c.). these devices were further subjected to an h/h test as an accelerated test (the devices were put in an environmental test box for 1,000 hours, having an environment of 85 c. temperature and 85% humidity) to measure the rate of deterioration of photoelectric conversion efficiency. results of the above are shown in table 2. table 2 number of impact marks at the time of photoelectric deterioration rate of zinc oxide film formation conversion efficiency photoelectric conversion (marks/minute) (relative comparison) efficiency (%) immediately immediately immediately immediately immediately immediately after start before finish after start before finish after start before finish example 4 0 0 1 1.02 2 3 comparative 0 113 0.98 1.01 2 31 example 2 with that of example 4, immediately after start from the results shown in table 2, the following can be concluded. where the film-deposited substrate is used which has been produced using the fallen-particle-removing mechanism of the present invention, provided at the time of zinc oxide film formation, devices having a high reliability can be produced over a long time in the roll-to-roll system. example 5 the roll-to-roll experimental apparatus shown in fig. 14 was used to make experiment. on sus 430 2d stainless steel sheet wound into a roll, previously silver was deposited in 200 nm (2,000 ) thickness by means of a roll-adapted dc magnetron sputtering apparatus to form a metal layer and zinc oxide was deposited in thin film thereon in 100 nm (1,000 ) thickness by means of a like roll-adapted dc magnetron sputtering apparatus to obtain the continuous-length substrate 703 . on this substrate, a zinc oxide film was formed by electrodeposition. the continuous-length substrate 703 is transported to the electrodeposition tank 701 through transport rollers. the electrodeposition bath 702 contains 0.2 mol/liter of zinc nitrate and 0.1 g/liter of dextrin. liquid circulation means is disposed using the jet pipe 712 in order to stir the bath. the bath is kept at a temperature of 80 c. and also kept at a ph of 4.0 to 6.0. zinc plates are used in the anodes 705 to 709 . then, in the present example, the method utilizing the convection of the electrodeposition bath was used as a means for removing fallen matter or dust adhering to the substrate. as specific construction for this method utilizing the convection of the electrodeposition bath, as shown in fig. 15 the jet pipe 712 b is installed on the tank wall of the electrodeposition tank 701 and the reflection plate 801 on the opposing tank wall so that convention currents are caused between the back-side film adhesion preventive electrode 713 and the continuous-length substrate 703 as shown by arrows. since the system is so constructed that the convention currents can be caused vertically to the substrate transport direction, any falling matter having fallen on the film-deposited substrate can effectively be removed. in the present example, electric current of 5.0 ma/cm ^{ 2 } was flowed across the anodes 705 to 709 and the continuous-length substrate 703 to carry out electrodeposition. electric current of 60 ma/cm ^{ 2 } was further flowed across the continuous-length substrate and the back-side film adhesion preventive electrode 713 so that the back-side film adhesion preventive electrode 713 was in a more minus potential, to remove unauthorized films having adhered to the back side of the continuous-length substrate. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up on the wind-up roller 711 through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 3. comparative example 3 electrodeposition was carried out in the same manner as in example 5 except that the means (the jet pipe 712 ) for removing fallen matter or dust adhering to the film-deposited substrate was not used. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 3. example 6 electrodeposition was carried out in the same manner as in example 5 except that, in place of the convection of the electrodeposition bath, the means for removing fallen matter or dust adhering to the film-deposited substrate was so constructed as to be the shower which as shown fig. 16b sprays the bath in a v-shape with respect to the continuous-length substrate transport direction. here, the shower was so installed that its jet angle was 30 degrees with respect to the continuous-length substrate transport direction 901 . also, the holes of the shower were made in a diameter of 2 mm, and arranged at intervals of 20 mm. its bath flow rate was set at 2 liters/minute. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 3. example 7 electrodeposition was carried out in the same manner as in example 5 except that, as the means for removing fallen matter or dust adhering to the substrate, the shower shown in fig. 16a was additionally installed so that any dust adhering to the film surface was also removable. the number of impact marks visually observable on the film-deposited substrate standing immediately before it was wound up through respective rollers was counted for 1 minute at intervals of 60 minutes over a period of 480 hours. results obtained are shown in table 3. table 3 60 120 180 240 300 360 420 480 min. min. min. min. min. min. min. min. example 5 0 0 0 0 1 4 11 10 6 0 0 0 0 0 1 2 4 7 0 0 0 0 0 0 0 0 comparative 0 0 3 36 42 48 81 89 example 3 from the results shown in table 3, the following can be concluded. 1) where the method in which the convection of the electrodeposition bath is utilized as the means for removing fallen matter or dust adhering to the substrate, the impact marks can be made greatly less occur. 2) where the means for removing fallen matter or dust adhering to the film-deposited substrate is made up by the shower which sprays the bath in a v-shape with respect to the continuous-length substrate transport direction, the fallen matter or dust adhering to the film-deposited substrate can more effectively be removed and the impact marks can be prevented from occurring. 3) where the shower for removing fallen matter or dust adhering to the film-deposited substrate is provided on the back side of the substrate and also on the film-forming side of the substrate, not only the fallen matter from the back-side film adhesion preventive electrode but also any dust adsorbed on film-formed surface can be prevented, enabling formation of high-quality zinc oxide films while preventing impact marks from occurring. example 8 a roll-to-roll type apparatus shown in fig. 17 was used to make experiment. on sus 430 2d stainless steel sheet wound into a roll, previously aluminum was deposited in 200 nm (2,000 ) thickness by means of a roll-adapted dc magnetron sputtering apparatus to form a metal layer and zinc oxide was deposited in thin film thereon in 200 nm (2,000 ) thickness by means of a like roll-adapted dc magnetron sputtering apparatus to obtain a continuous-length substrate 703 . on this substrate, a zinc oxide film was formed by electrodeposition. the continuous-length substrate 703 is transported to the electrodeposition tank 701 through transport rollers. an electrodeposition bath 702 contains 0.2 mol/liter of zinc nitrate and 1.0 g/liter of dextrin. liquid circulation means is disposed using a jet pipe 712 in order to stir the bath. the bath is kept at a temperature of 80 c. and also kept at a ph of 4.0 to 6.0. zinc plates (350 cm150 cm) are used in anodes 705 to 709 . the continuous-length substrate 703 was set as the negative-side electrode, where electric current of 10.0 ma/cm ^{ 2 } (1.0 a/cm ^{ 2 } ) was flowed across each of the the positive-side electrodes 705 to 709 and the negative-side electrode 703 , and also a back-side film adhesion preventive electrode 713 was set as the negative-side electrode and the continuous-length substrate 703 as the positive-side electrode, where electric current of 50.0 ma/cm ^{ 2 } (5.0 a/cm ^{ 2 } ) was flowed across them, setting the distance between the positive-side electrode 703 and the negative-side electrode 713 to be 20 mm. here, as a means for removing fallen matter or dust adhering to the film-deposited continuous-length substrate during its transport, the shower 906 which as shown in fig. 16c blows compressed air in an arc shape with respect to the continuous-length substrate transport direction was installed on the front side of the roller with which the substrate back side come into contact first after the film-deposited substrate passed the back-side film adhesion preventive electrode, and so installed that it jetted the air at an angle of 20 degrees with respect to the continuous-length substrate transport direction 901 . also, the shower 904 which as shown in fig. 16a sprays the bath in an i-shape with respect to the substrate transport direction was installed on the front side of the roller with which the substrate film-forming side come into contact first after the film-deposited substrate passed the back-side film adhesion preventive electrode, and so installed that it jetted the bath at an angle of 30 degrees with respect to the substrate transport direction 901 . here, the holes of each shower were made in a diameter of 1 mm, and arranged at intervals of 15 mm. flow rates of the compressed air and the bath were set at 200 nl/minute and 3 l/minute, respectively. here, nl is a unit showing volume (liter) at the standard condition. a zinc oxide film of 2.0 m in film thickness was continuously formed. the film was continuously formed for 8 hours at a substrate transport speed of 1,500 mm/minute. as the result, as to the number of impact marks which might have occurred when the zinc oxide film was formed, no impact mark was recognizable from the beginning to the end, in the one-minute visual observation made at intervals of 60 minutes over a period of 480 hours. example 9 the roll-to-roll type apparatus shown in fig. 17 was used to make experiment. on sus 430 2d stainless steel sheet wound into a roll, previously silver was deposited in 800 nm (8,000 ) thickness by means of a roll-adapted dc magnetron sputtering apparatus to form a metal layer and zinc oxide was deposited in thin film thereon in 200 nm (2,000 ) thickness by means of a like roll-adapted dc magnetron sputtering apparatus to obtain the continuous-length substrate 703 . on this substrate, a zinc oxide film was formed by electrodeposition. the continuous-length substrate 703 is transported to the electrodeposition tank 701 through transport rollers. the electrodeposition bath 702 contains 0.2 mol/liter of zinc nitrate and 1.0 g/liter of dextrin. liquid circulation means is disposed using the jet pipe 712 in order to stir the bath. the bath is kept at a temperature of 83 c. and also kept at a ph of 4.0 to 6.0. zinc plates (350 cm150 cm) are used in the anodes 705 to 709 . the continuous-length substrate 703 was set as the negative-side electrode, where electric current of 10.0 ma/cm ^{ 2 } (1.0 a/cm ^{ 2 } ) was flowed across each of the the positive-side electrodes 705 to 709 and the negative-side electrode 703 , and also the back-side film adhesion preventive electrode 713 was set as the negative-side electrode and the continuous-length substrate 703 as the positive-side electrode, where electric current of 50.0 ma/cm ^{ 2 } (5.0 a/cm ^{ 2 } ) was flowed across them, setting the distance between the positive-side electrode 703 and the negative-side electrode 713 to be 20 mm. here, as a means for removing fallen matter or dust adhering to the film-deposited continuous-length substrate during its transport, the shower 906 which as shown in fig. 16c blows compressed air in an arc shape with respect to the continuous-length substrate transport direction was installed on the front side of the roller with which the substrate back side come into contact first after the film-deposited substrate passed the back-side film adhesion preventive electrode, and so installed that it jetted the air at an angle of 45 degrees with respect to the continuous-length substrate transport direction 901 . also, the shower 904 which as shown in fig. 16a sprays the bath in an i-shape with respect to the substrate transport direction was installed on the front side of the roller with which and the continuous-length substrate 703 as the positive-side electrode, where electric current of 50.0 ma/cm ^{ 2 } (5.0 a/cm ^{ 2 } ) was flowed across them, setting the distance between the positive-side electrode 703 and the negative-side electrode 713 to be 20 mm. here, as a means for removing fallen matter or dust adhering to the film-deposited continuous-length substrate during its transport, the shower 906 which as shown in fig. 16c blows compressed air in an arc shape with respect to the continuous-length substrate transport direction was installed on the front side of the roller with which the substrate back side come into contact first after the film-deposited substrate passed the back-side film adhesion preventive electrode, and so installed that it jetted the air at an angle of 40 degrees with respect to the continuous-length substrate transport direction 901 . also, the shower 904 which as shown in fig. 16a sprays the bath in an i-shape with respect to the substrate transport direction was installed on the front side of the roller with which the substrate film-forming side come into contact first after the film-deposited substrate passed the back-side film adhesion preventive electrode, and so installed that it jetted the bath at an angle of 25 degrees with respect to the substrate transport direction 901 . here, the holes of each shower were made in a diameter of 2.5 mm, and arranged at intervals of 15 mm. flow rates of the compressed air and the bath were set at 300 nl/minute and 4 l/minute, respectively. a zinc oxide film of 2.0 m in film thickness was continuously formed. the film was continuously formed for 8 hours at a substrate transport speed of 1,500 mm/minute. as the result, as to the number of impact marks which might have occurred when the zinc oxide film was formed, no impact mark was recognizable from the beginning to the end, in the one-minute visual observation made at intervals of 60 minutes over a period of 480 hours. next, using the substrate having the zinc oxide film thus formed, a photovoltaic device having a cross-sectional structure as schematically shown in fig. 18 was produced. in fig. 18 , reference numeral 101 denotes a support (sus stainless steel substrate); 102 , a metal layer (silver, 800 nm thick); 103 a , a zinc oxide layer (200 nm thick) formed by sputtering; 103 , a zinc oxide film formed by the electrodeposition described above; 104 , a semiconductor layer of triple structure; 105 , a transparent conductive layer; and 106 , a collector electrode layer. first, the triple-structure semiconductor layer 104 was formed by means of a roll-adapted cvd apparatus. stated specifically, a mixed gas of sih _{ 4 } and ph _{ 3 } was used, a substrate member (consisting of the support 101 and formed thereon the metal layer 102 , the zinc oxide layer 103 a and the zinc oxide film 103 formed by electrodeposition) was heated to 340 c. and an rf power of 400 w was applied to from an n-type layer. next, a mixed gas of sih _{ 4 } , geh _{ 4 } and hydrogen was used and a microwave power of 400 w was applied, setting substrate temperature at 450 c., to from an i-type layer. then, setting substrate temperature to 250 c., a p-type layer was further formed using a mixed gas of bf _{ 3 } , sih _{ 4 } and hydrogen. thus, a bottom n-i-p layer was formed. subsequently, a middle n-i-p layer was formed in the same manner as the above except that the ratio of mixing sih _{ 4 } and geh _{ 4 } in the i-type layer was changed. then a top n-i-p layer was formed in the same manner as the above except that the i-type layer was formed using sih _{ 4 } and hydrogen. thereafter, ito was deposited by a roll-adapted sputtering apparatus to form the transparent conductive layer 105 . thereafter, the collector electrode layer 106 was formed using silver paste. of sample devices prepared, with regard to a device corresponding to the part immediately after the start of zinc oxide electrodeposition and a device corresponding to the part immediately before its finish, their photoelectric conversion efficiency and acceptance rate were measured with a solar simulator (am 1.5, 100 mw/cm ^{ 2 } and surface temperature of 25 c.). these devices were further subjected to an h/h test as an accelerated test (the devices were put in an environmental test box for 1,000 hours, having an environment of 85 c. temperature and 85% humidity) to measure the photoelectric conversion efficiency before and after the test. results of the above are shown in table 5. comparative example 5 a zinc oxide film was formed in the same manner as in example 10 except that the means for removing fallen matter or dust adhering to the film-deposited continuous-length substrate during its transport was not used. the number of impact marks occurring when the zinc oxide film was formed by electrodeposition was 0 immediately after its start and began to gradually increase after two hours to become 120 immediately before its finish, in the one-minute visual observation made at intervals of 60 minutes over a period of 480 hours. of sample devices prepared, with regard to a device corresponding to the part immediately after the start of zinc oxide electrodeposition and a device corresponding to the part immediately before its finish, their photoelectric conversion efficiency and acceptance rate were also measured with a solar simulator (am 1.5, 100 mw/cm ^{ 2 } and surface temperature of 25 c.). these devices were further subjected to an h/h test as an accelerated test (the devices were put in an environmental test box for 1,000 hours, having an environment of 85 c. temperature and 85% humidity) to measure the photoelectric conversion efficiency before and after the test. results of the above are shown in table 5. table 5 example 10 comparative example 5 immediately immediately immediately immediately after start of before finish of after start of before finish of electro-deposition electro-deposition electro-deposition electro-deposition (0 m) (720 m) (0 m) (720 m) number of impact marks 0 0 0 120 at the time of zinc oxide film formation: (marks/min.) photoelectric conversion 1 1.01 0.98 1.02 efficiency acceptance rate: (%) 96 100 100 68 rate of changes: (%) 99 97 98 68 photoelectric conversion efficiency relative value when the photoelectric conversion efficiency of the device corresponding to the part immediately after the start of electrodeposition (0 m) in example 10 is assumed as 1. acceptance rate percentage of non-defective samples when twenty-five sub-cells are produced in a size of 50 mm square. rate of changes (photoelectric conversion efficiency after h/h test/photoelectric conversion efficiency after h/h test)100. from the results shown in table 5, the following can be concluded. there was no particular difference in photoelectric conversion efficiency at the initial stage. however, in comparative example 5, in which the zinc oxide film was formed without providing any means of the present invention for removing fallen matter or dust adhering to the substrate during zinc oxide film formation, compared with samples corresponding to the part immediately after the start of electrodeposition, those immediately before its finish showed a low acceptance rate and a decrease in the photoelectric conversion efficiency after the h/h test. this is considered due to the fact that cracks had been caused in the zinc oxide film because the film-deposited substrate has impact marks. the samples of example 10, which made use of the film-deposited substrate free of any impact marks, produced using the apparatus provided with the means for removing fallen matter or dust adhering to the substrate during zinc oxide film formation according to the present invention, showed little difference in the acceptance rate and the photoelectric conversion efficiency after the h/h test between the samples corresponding to the part immediately after the start of electrodeposition and those immediately before its finish, enabling production of highly reliable good devices for a long time in the roll-to-roll system. as having been described above, according to the present invention, high-quality zinc oxide films can be formed continuously for a long time without causing any impact marks which might be caused when fallen matter such as film pieces coming from the back-side film adhesion preventive electrode and so forth and any adsorbed matter such as dust adhere to the film-deposited continuous-length substrate to become crushed by rollers, and also without causing any cracks in film and any film-peeling. also, since the fallen matter or dust is not caught in rollers, the rollers can be prevented from having dents or flaws and the apparatus can be greatly less damaged. moreover, since the impact marks may occur no where, the yield can be improved and the cost reduction can be achieved. introduction of this zinc oxide film formation technique into solar-cell fabrication processes as a technique for forming the back reflecting layer also enables solar cells to have higher short-circuit current density and photoelectric conversion efficiency and also enables them to be improved in acceptance rate and reliability. also, compared with sputtering and vacuum evaporation, the material cost and running cost can be made very low, and hence the present invention can contribute to real spread of sunlight electricity generation.
169-235-403-993-613	US	[ "US" ]	B01J2/20,B02C4/10,B30B11/22	1981-06-09T00:00:00	1981	[ "B01", "B02", "B30" ]	method for the manufacture of granular grit for use as abrasives	a pasty mix of granular grits, binder and filler is pressed through a sieve web by rolling action to form cylindrical, worm-like extrusions. after hardening in a heating duct the extrusions are subjected to the same action and thereby granular grit particles are formed each of which contains several grits. the apparatus for carrying out the method includes a sieve web which co-operates with a rotor having several freely rotatable rollers around its periphery.	1. a method of producing granular grit particles each including several individual grits comprises the steps of mixing the grits with a binding medium, and a filler to form a pasty mass, pressing the mass through a mesh by relative rolling motion to form extruded lengths of the mass, heating the extruded lengths to harden them, and pressing the hardened lengths through a mesh by relative rolling action to form the said required granular grit particles. 2. a method according to claim 1, wherein the same apparatus is used for both said pressing steps. 3. a method according to claim 1, wherein the said extruded lengths are dried and hardened in a through-flow drying furnace. 4. a method according to claim 1, wherein phenolurea resin is used as binding medium. 5. a method according to claim 1, wherein a melamineformaldehyde resin is used as binding medium. 6. a method according to claim 1, wherein an alkyd unsaturated polyester resin is used as binding medium.	background of the invention 1. field of the invention this invention relates to a method of manufacture of grinding grit granulate. such granulates may be of corundum and/or zirconium corundum or silicon carbide bound together with a synthetic resin binding medium, preferably phenol-formaldehyde resin, with the addition of fillers with grinding action, for example cryolite and/or inert constituents, for example, chalk. 2. summary of the prior art it has been proposed in u.s. pat. no. 2,194,472 (george h. jackson--issued mar. 26, 1940) to manufacture a flexible grinding or abrasive medium. the carrier or backing for the abrasive agglomerate is sprinkled with such grinding grit agglomerates each agglomerate being formed by a plurality of individual grits bonded together. during the actual manufacture of the described aggregate particles, the individual components, such as grinding grit, binding medium and filler are mixed, hardened into a compact mass, subsequently crushed and the resultant crushed pieces sieved to select the desired agglomerate size for further processing. apart from the substantial dust generation during such crushing and sieving, the yield of useful agglomerate following the sprinkling on a carrier of the selected individual particle sizes it is uneconomically small. according to tests, with this manufacturing method, the useful agglomerate particles amount in the final yield to an amount below 25% of the quantity initially used. furthermore, in german auslegeschrift no. 2,608,273 a sheet or strip-shaped flexible grinding tool is described, on the base of which conical grinding bodies are secured, which consist of a plurality of grinding grits, which are bound together by a binding medium together with a filler. the manufacture of conical grinding bodies from a plurality of grinding grits, binding medium and fillers is characterized in german auslegeschrift no. 2,608,273 in that the grinding grits and fluid matrix binding medium is dispersed in an organic solvent medium phase, preferably perchloro-ethylene and is held therein is suspension, until the conical grinding bodies form, which on hardening of the matrix binding medium stabilise in their conical shape. apart from the fact that this method relates to the formation of synthetic resin bound conical-shaped bodies described in german offenlegungsschrift no. 2,447,520, the manufacture of the grinding bodies prepared with cone size values which can be employed individually for sprinkling involves substantial difficulties in the technical use of the necessary quantity, so that this method has not hitherto been brought into practical use. in this respect substantial disadvantages of the method arise, in particular the environment is affected by the organic solvent medium vapours, especially during the preparation of the substantially porous grinding bodies, from which the organic solvent material must be evaporated. it has also been proposed that grinding grit agglomerates can be obtained with the exclusion of the above-mentioned disadvantages, if a pasty, water-moistened mixture of grinding grits and binding media, preferably water-soluble phenol-formaldehyde resin is pressed with the aid of a steel blade or other scraper through a sieve web or a perforated sheet with predetermined mesh or hole width, and after drying and hardening in a heating duct the cylindrical, effectively extruded, agglomerate particles are again pressed through the sieve to form the required granular grit particles. such cylindrical, extruded, granulate is formed by steel blades or scrapers driven over flexible sieve webs, with the steel blades scraping over the sieve mounted around the periphery of a cylindrical rotor and extending parallel to the rotational axis. the sieve web is applied around the under part of the rotor in a semi-cicle and is tensioned so that the grinding grit mixture to be granulated can be introduced from above. the driven bladed rotor touches, during rotation, the blades on the sieve web and presses the grinding grit mixture moistened with the binding materials through the sieve web, from which the continuous cylindrical, worm like, extruded granulate falls, which can be dried and hardened in an adjacent through-flow heating duct. this mechanical arrangement has however the disadvantage that both the hard steel blades of the rotor and also the sieve web of metal or synthetic resin filaments wear relatively rapidly as a result of the abrasive action of the grit mixture. during the dry granulation carried out with the same device for breaking and sieving it was similarly observed that high wear was caused by the dried, cylindrical, granulate particles. furthermore it was desirable, to increase the granulate yield from about 150 kilograms per hour to the large quantities required for full scale technical manufacture and furthermore to produce, as far as possible, uniform particle size. an object of the present invention is to provide a method and apparatus which advantageously provides for the large-scale manufacture of agglomerate, grinding grit containing particles of uniform size, without the disadvantages of smaller yields and giving rise to environmental disadvantages by release of dust or solvent medium vapours. summary of the invention according to the present invention there is provided a method of producing granular grit particles each including several individual grits comprises the steps of mixing the grits with a binding medium, and a filler to form a pasty mass, pressing the mass through a mesh by relative rolling motion to form extruded lengths of the mass, heating the extended lengths to harden them, and pressing the hardened lengths through a mesh by relative rolling action to form the said required granular grit particles. further, according to the present invention there is provided in apparatus for producing granular grit particles each including several individual grits, means for mixing the grits with a binding medium and a filler to form a pasty mass, a continuous sieve web, a rotor having a plurality of rollers rotatably mounted around its periphery and in co-operating relationship with the sieve web, means for supplying the pasty mass to the sieve web at the zone of co-operating relationship with the rotor whereby to press the mass through the web to form extruded lengths of the mass, heating means for hardening said extruded lengths, and means for returning the hardened lenghts to the rotor and sieve web after the extrusion has been completed whereby to break up the hardened lengths into said granular grit particles each including several individual grits. brief description of the drawings fig. 1 is a perspective view of granulate producing apparatus in accordance with the invention; fig. 2 is a longitudinal side elevation, partly in section of the rotor of the apparatus of fig. 1; and fig. 3 is an end elevation of the rotor of fig. 2. description of the preferred embodiment the apparatus includes an endless sieve web 10, guided by rollers, not shown, and a rotor 12 arranged at least substantially in contact with a lower portion 14 of the web which effectively wraps around the lower half of the rotor. the sieve web will have mesh openings appropriate to the size of the final desired agglomerate particles. drive means (not shown) for the sieve web will also be provided. the rotor 12 comprises a core 20 with an integral end plate 22 at one end and a readily detachable end plate 24 secured by a set screw 26 and located by a pin 28. the end plate 24 is provided with a central recess 30 and apertures 32 each for receiving a reduced diameter end portion of one of a plurality of freely-rotatable spindles 34. each spindle 34 carries a freely-rotatable sleeve or tube 36. the end of each spindle 34 remote from the end plate 24 is rotatably supported in an aperture 38 of the integral end plate 22. the core 20 has an extension 40 beyond the end plate 22 and this has a rectangular recess 42 to enable engagement by a drive key (not shown). in operation, assuming motion as indicated by arrows a and b, a pasty mixture of grit, binder and filler is fed into the nip between the rotor and the sieve web and the tubes or sleeves 36 of the rotor 12 press the mixture through the mesh holes thus forming cylindrical, worm-like, extrusions. the cross-section of the extrusions will, of course, be dependent upon the mesh holes. as will be appreciated no relative scraping motion occurs between the rotor and the sieve web. the extruded agglomerate is then hardened in a heating duct and returned to the illustrated or a separate but similar apparatus where it is broken up by interaction between the rotor 12 and the sieve web 10. agglomerate particles of certain sizes pass through the sieve web while coarser particles accumulate at the zone where the upwardly-moving sieve web leaves its contact path with the rotor. when the amount of over-size particles exceeds a certain amount, the infeed of fresh coarse agglomerate can be stopped and the sieve web drive reversed so that the accumulation of rejected particles can be broken down. this process can be reversed several times until the rejected coarser particles are all acceptable. by means of the hereinbefore described apparatus the movement of the previously used steel scraper blades encouraging wear is converted into a rolling motion over the sieve web, corresponding to the rotational speed of the same rotor. this rolling rotor makes possible a drastic reduction of the wear and a three or four fold increase of the yield. this constructional form renders the method suitable for large-scale technical manufacture of grinding grit granulate over the whole ambit of requirements, so that with this technical advance in the manufacture of grinding grit granulate particles the grinding means for these granulates can for the first time be used in large-scale technical practice. the yield of particle sizes utilisable directly for scattering on to a backing or carrier amounts to 85 to 95%. moreover, it is readily possible, by change of the mesh size of the preferred sieve web used to vary the overall size of the granulate according to requirements. the reduction of the wear with this dry granulating process by means of a rolling rotor and therefore becomes far more important than granulation of moist grinding grit containing mixtures. by means of the method and apparatus hereinbefore described and in particular the formation of the blades of the rotor, not only was the wear of the blades and the sieve web drastically reduced, but also the yield per unit time was increased by from 3 to 4 times, that is to 500 to 600 kilograms of granulate per hour.
169-605-945-693-506	AT	[ "AT", "US", "WO", "EP", "DE", "AU", "KR" ]	B01D53/86,B01D53/96,B01J23/92,B01J38/48,B01J38/60,B01J38/64	1998-08-26T00:00:00	1998	[ "B01" ]	process for regenerating used denox or dedioxin catalytic converters	the "s" storm shutter system is a new type of protection from wind storms and other weather phenomenon. it uses a series of low-profile "s"-shaped interlocking panels. these panels are secured by straps on either side which are then tightened by fixing them to the wall. this creates a protective system whose profile is significantly less than any other system on the market today. because of this low profile, the wind resistance is drastically reduced. in addition, once the initial anchors are installed, this system requires no tools to assemble or disassemble. this is an important factor when considering the time constraints in preparing for an oncoming storm.	1 . a process for regenerating a used denox or dedioxin catalytic converters, which comprises washing a catalytic converter with a solution of surface-active substances in a liquid with a simultaneous addition of metal compounds creating active centers. 2 . the process according to claim 1 , which comprises selecting the surface-active substances from anionic surfactants, nonionic surfactants, and mixtures thereof. 3 . the process according to claim 1 , which comprises using low-foaming surfactants as the surface-active substances. 4 . the process according to claim 1 , which comprises selecting the metal compounds from the group consisting of vanadium compounds, tungsten compounds, molybdenum compounds, and mixtures thereof. 5 . the process according to claim 1 , which comprises selecting metal compounds essentially free of alkali metals, alkaline earth metals, halogens, and sulfur. 6 . the process according to claim 1 , wherein the liquid is water. 7 . the process according to claim 5 , which comprises selecting water with a hardness of less than 10 dh. 8 . the process according to claim 1 , wherein the washing step comprises adding one of acids and lyes. 9 . the process according to claim 1 , wherein the washing step comprises adding one of complex-forming substances and ion exchangers. 10 . the process according to claim 1 , wherein the washing step comprises adding oxidizing or reducing additives. 11 . the process according to claim 1 , wherein the washing step comprises adding organic solvents. 12 . the process according to claim 1 , wherein the washing step is carried out with additional action of acoustic irradiation. 13 . the process according to claim 12 , which comprises setting a frequency of the acoustic irradiation in the ultrasound range. 14 . the process according to claim 1 , wherein the washing step comprises washing in a liquid bath and thereby moving the washing liquid. 15 . the process according to claim 14 , wherein the moving step comprises agitating the washing liquid with a liquid-circulating device or by generating gas bubbles. 16 . the process according to claim 1 , which comprises, after the washing step, rinsing the catalytic converter with liquids containing metal compounds creating active centers. 17 . the process according to claim 16 , wherein the rinsing step is carried out a plurality of times, with drying steps in between. 18 . the process according to claim 16 , wherein the metal compounds are selected from the group consisting of vanadium compounds, tungsten compounds, molybdenum compounds, and mixtures thereof. 19 . the process according to claim 16 , wherein the metal compounds are essentially free of alkali metals, alkaline earth metals, halogens, and sulfur. 20 . the process according to claim 1 , which comprises, after the washing step, applying to the catalytic converter liquids containing metal compounds creating active centers. 21 . the process according to claim 20 , wherein the applying step is carried out a plurality of times, with drying steps in between. 22 . the process according to claim 20 , wherein the metal compounds are selected from the group consisting of vanadium compounds, tungsten compounds, molybdenum compounds, and mixtures thereof. 23 . the process according to claim 20 , wherein the metal compounds are essentially free of alkali metals, alkaline earth metals, halogens, and sulfur. 24 . the process according to claim 1 , wherein the washing step is carried out at a temperature of more than 30 c. 25 . the process according to claim 1 , which comprises drying the catalytic converter subsequently to the washing step. 26 . the process according to claim 25 , wherein the drying step comprises blowing heated air through the catalytic converter.	cross-reference to related application this is a continuation of copending international application pct/at99/00182, filed jul. 20, 1999, which designated the united states. background of the invention field of the invention the present invention relates to a process for the regeneration of used denox or dedioxin catalysts. catalysts of this type are used in so-called denox or dedioxin installations for reducing and breaking down nitrogen oxides and/or in particular halogenated dioxins and furans in flue gases or other exhaust and off-gases. the process known as selective catalytic reduction, or scr for short, is one of the possible options for lowering or even substantially lowering the levels of nitrogen oxides nox, i.e. a mixture of no and no ₂ , formed for example during the combustion of fossil fuels in combustion plants. in the scr process, the nitrogen oxides are converted into nitrogen and water using ammonia or substances which form ammonia under the system conditions as reducing agent and using a catalyst. since the catalytic reactions proceed on the surface of the catalyst, a large specific surface area has to be provided through the use of correspondingly porous materials for the reaction. this requirement is met by the use of homogeneous ceramic catalysts, for example in honeycomb form. most of a catalyst of this nature consists, for example, of the base material titanium dioxide tio ₂ in which the active metal compounds, in particular v ₂ o ₃ , wo ₃ , are homogeneously distributed. however, the catalyst may also be applied as a coating to a support, for example a metal sheet. under oxidizing conditions, identical or modified catalysts can also be used to lower the levels of emissions of organic products of incomplete combustion in off-gases from combustion plants, such as for example halogenated dioxins and furans. in this context, reference is had to the disclosure in international publication wo 91/04780. there are transport processes upstream and downstream of the chemical reactions which take place on the catalyst surface. following adsorption of the reaction partners on the internal surface of the catalyst, chemical combination between the reaction participants and the catalyst leads to a lowering of the activation energy which is absolutely imperative for the reaction to commence. a consequence is that the reaction is accelerated or the equilibrium is established. if these active centers are blocked, for example by the accumulation of alkali metals and alkaline earth metals or their compounds which are contained in the fly ash, so that the activated nh ₃ adsorption required is partially impeded, the activity falls. in addition to this deterioration to the active areas of the catalyst surface through adsorbed catalyst toxins, the pores become blocked, for example, by calcium sulfate (caso ₄ ) and ammonium hydrogen sulfate (nh ₄ hso ₄ ) which are formed. since the catalyst cannot be 100% selective with respect to a specific reaction, the catalyst also promotes some secondary reactions, including the conversion of so ₂ to so ₃ , in an order of magnitude which is relevant. although this reaction can be minimized by the composition of the catalyst, the fact remains that the small amount of so ₃ is sufficient to react with the unreacted nh ₃ , which is referred to as nh ₃ slippage, and h ₂ o to form various salts, primarily to form ammonium hydrogen sulfate and ammonium sulfate (nh ₄ ) ₂ so ₄ or to combine with the fly ash. these compounds form at temperatures at which condensation takes place when the temperature drops below the dew point of ammonium hydrogen sulfate. they may be deposited on the catalyst and in addition, together with adhesive particles, for example ash, fine dust, sio ₂ , al ₂ o ₃ , may block the pores and thus lower the activity of the catalysts. therefore, the nature of the composition of the compounds which may be deposited on the catalyst is dependent on the composition of the fly ash, of the flue gas and of the operating temperature. they are generally alkali metal and alkaline earth metal compounds which are contained in the fly ash as oxides and, on account of their reaction with so ₃ , as sulfates and which are either deposited on the surface together with other compounds contained in the fly ash, such as for example sio ₂ and al ₂ o ₃ , and block the pores, or, on account of their electron donor properties, block the active centers and thus prevent the activated nh ₃ adsorption required. summary of the invention the object of the present invention is to provide a method of regenerating a denox or dedioxin catalytic converter which overcomes the above-noted deficiencies and disadvantages of the prior art devices and methods of this general kind, and which provides for a process by means of which the number of the active centers available for the catalysis is increased as far as possible or as desired, namely, for example, up to the activity of the fresh catalyst or even beyond, in order in this way for the catalytic converter, i.e., the catalyst, to be fully or partially regenerated. with the above and other objects in view there is provided, in accordance with the invention, a process for regenerating a used denox or dedioxin catalytic converters, which comprises washing a catalytic converter with a solution of surface-active substances in a liquid with a simultaneous addition of metal compounds creating active centers. in other words, the above objects are achieved by the fact that the catalysts are washed with a solution of surface-active substances in a liquid, preferably water, with the simultaneous addition of metal compounds which create active centers. as a result of this measure, deposited contaminants and chemisorbed compounds and ions are removed, old active centers are made available once more and additional active centers are created. in addition, in this way it isquite surprisinglyalso possible to increase the activity compared to the fresh catalyst. the catalysts which have been treated in this way can be refitted into a denox, dedioxin or combined plant with their restored activity. washing in, for example, aqueous liquors is a complex operation in which numerous physical and chemical influences interact. this is understood as meaning both the removal of water-soluble deposits by water or by aqueous solutions of active washing substances and the detachment of water-insoluble deposits. in the process, it is possible to prevent redeposition of the insoluble fractions which have already been detached, for example by acoustic irradiation or by stabilizing the dispersed fractions. the water serves as a solvent for washing agents and for soluble compounds and as a transport medium for the dispersed fractions. the washing operation is initiated by the wetting and penetration of the substrate. this can be achieved quickly and completely if the high surface tension of the water is reduced substantially by surfactants as important washing agent components. the physical separation of the deposits from the substrate is based on the nonspecific adsorption of surfactants at various boundary surfaces which are present in the process. substances with a low solubility are solubilized in molecularly dispersed form by surfactant micelles. the adsorption of washing agent constituents induces changes in the interfacial chemical properties and is consequently a precondition for good detachment. in accordance with an added feature of the invention, the surface-active substances are selected from anionic or nonionic surfactants, preferably low-foaming surfactants, and mixtures thereof. while anionic surfactants and nonionic surfactants are adsorbed nonspecifically at all hydrophobic surfaces, complex formers can be chemisorbed specifically on surfaces with pronounced charge centers. therefore, complex formers and surfactants augment one another in terms of their specific action at the interfaces. the function of these so-called builders, which in addition to the complex formers, such as sodium triphosphate and other phosphates, also include ion exchangers, such as for example zeolites, consists predominantly in eliminating the alkali metal ions and alkaline earth metal ions derived from the deposits, but also those from the natural water hardness, and in supporting the action of the surfactants. a series of complex formers, for example aminopolycarboxylic acids, such as edta or nta, form stable, water-soluble complexes (chelate complexes) with alkaline earth metals, and in some cases also with alkali metals. the first process is the adsorption of the complex formers at the surface, followed by the desorption of the water-soluble complexes. the removal of cations by means of adsorption/desorption processes and the shift in the solution equilibria are the most important active principles of the complex formers and ion exchangers. since, when using solid ion exchangers the ion exchange takes place in the heterogeneous phase and therefore there are no adsorption and desorption operations, it may be advantageous to use ion exchangers in combination with water-soluble complex formers which are able to take up ions from solid surfaces and to release them to the ion exchanger after transport by the aqueous medium. the water-soluble complex formers serve as carriers. weaker complex formers, such as for example citrate, tartrate, oxalate, gluconate or lactate, may also be used. the action of the surface-active substances can be intensified by further additions, such as for example complex-forming substances or ion exchangers, and also by washing at temperatures which are higher than ambient temperature. the application of active metal compounds can be reinforced by rinsing with or application of liquids which contain these compounds. if appropriate, rinsing with or application of liquids takes place a number of times, with drying steps in between. the washing of the catalysts is preferably carried out in liquors produced using water, in particular using water of low hardness, i.e. <10 dh, in which active washing substances, e.g. anionic or nonionic surfactants, above all low-foam surfactants or mixtures of the two compounds, and metal compounds, such as for example vanadium compounds, tungsten compounds or molybdenum compounds, are contained; complex-forming substances may be added in all said washing processes. the washing may also be carried out with the addition of ion exchangers. additions of, for example, dilute acids, such as inorganic and organic acids or mixtures thereof, or of lyes, if appropriate with oxidizing or reducing additives, or of organic solvents may be expedient depending on the specific type of deactivation of the catalyst. following application to the catalyst surface, the metal compounds should be able to be converted into their oxide form under the action of heat during a drying operation or after installation in the denox or dedioxin plant, without residues which have an adverse effect on the catalyst activity being produced. for this reason, metal compounds which are free from alkali metals, alkaline earth metals, halogens and sulfur are preferred. since most alkali metal compounds are water-soluble, they can be removed by washing with water. since most pore-blocking compounds which adhere to the catalyst surface are also water-soluble, the water-insoluble compounds, such as sio ₂ or al ₂ o ₃ , could penetrate still further into the pores as a result of the removal of the water-soluble compounds which initially surround them. to prevent this, the catalysts may be washed under acoustic irradiation, in which case the frequency range may extend from the infrasound range to the ultrasound range (<20 hz to >20 khz). the acoustic irradiation may take place with constant or pulsed amplitude, for example in an ultrasound bath, with the result that these insoluble compounds are ejected from the pores of the catalyst. in the case of washing in a liquid bath, the physical-chemical active principles described may be assisted, for example, by the hydrodynamics and, in addition, by a flow which is generated by means of a liquid-circulation device or by pulsed gas bubbles. moreover, it is possible, for example, for suspended particles to be made to float by applying extremely fine gas bubbles (flotation). furthermore, a mechanical abrasion of the outermost layer may be carried out prior to the washing, in order to remove the compounds which are coarsely adhering to the catalyst surface, such as for example dust, k ₂ so ₄ or na ₂ so ₄ , by suction, blowing, sandblasting, brushing or the like. after the washing, the catalytic converters are preferably dried. on the one hand, fitting regenerated catalysts which are still wet into a denox or dedioxin plant can make it easy for dust or fly ash from the flue gas to stick to the catalysts, thus immediately leading to partial deactivation again. on the other hand, the residual quantity of liquid contained in the fine cavities in the catalyst on account of capillary forces is relatively difficult to remove. after the installation of the regenerated catalysts in a denox or dedioxin plant, the first flow of hot flue gas through the catalyst could lead to sudden evaporation, resulting in damage to the catalyst caused by cracks and therefore to negative mechanical properties which cause a reduced service life of the catalyst. for this reason, gentle drying must be carried out, for example by passing through hot air at temperatures of, for example, 60 to 120 c. in addition, further fixing of the metal compounds which have been applied takes place.
170-862-451-678-157	US	[ "US" ]	A42B1/24	2007-10-25T00:00:00	2007	[ "A42" ]	pivoting helmet mount	a mounting device for mounting an associated optical device on an associated helmet includes a first pivot arm assembly removably attachable to the associated helmet. a second pivot arm assembly is pivotally attached to the first pivot arm assembly and is rotatable about a first horizontal axis. a optical device mounting arm assembly is rotatably attached to the second pivot arm assembly. the optical device mounting arm assembly rotatable about a first vertical axis relative to the second pivot arm assembly.	1. a mounting device for mounting an associated optical device on an associated helmet, said mounting device comprising: a first pivot arm assembly removably attachable to said associated helmet; a second pivot arm assembly pivotally attached to said first pivot arm assembly, said second pivot arm assembly rotatable about a first horizontal axis; and an optical device mounting arm assembly rotatably attached to said second pivot arm assembly, said optical device mounting arm assembly rotatable relative to said second pivot arm assembly about a first vertical axis, said optical device mounting arm assembly including a ball rotatably received within a complimentary cavity formed in said second pivot arm assembly; said ball rotatable about a vertical axis of said ball, the vertical axis of said ball being aligned with said first vertical axis; and a plurality of detents formed on said ball and spaced about the vertical axis of said ball for removably receiving one or more complimentary and resiliently biased engagement members received within said cavity for securing the optical device mounting arm assembly at a plurality of rotational positions about the vertical axis of said ball. 2. the mounting device of claim 1 , further comprising: said optical device mounting arm assembly being further rotatable about a second horizontal axis. 3. the mounting device of claim 1 , further comprising: each of said first and second horizontal axes extending in a transverse direction relative to a line of sight of a user. 4. the mounting device of claim 1 , said optical device mounting arm assembly including: a first member and a second member slidable with respect to said first member; and a locking member for selectively and releasably securing the second member at a desired position relative to the first member. 5. the mounting device of claim 1 , further comprising: said ball being rotatable about a horizontal axis of said ball, the horizontal axis of said ball being aligned with said first vertical axis; and a plurality of detents formed on said ball and spaced about the horizontal axis of said ball for removably receiving a complimentary and resiliently biased engagement member received within said cavity for securing the optical device mounting arm assembly at a plurality of rotational positions about the horizontal axis of said ball. 6. the mounting device of claim 1 , further comprising: said ball supported on stem which runs in an opening formed in a housing on said second pivot arm assembly defining said cavity. 7. the mounting device of claim 1 , further comprising: an optical device mounting assembly attached to said optical device mounting arm assembly, said optical device mounting assembly for removably attaching the associated optical device. 8. the mounting device of claim 7 , further comprising: said optical device mounting assembly including a mounting shoe for removably receiving a complimentary mounting foot of the associated optical device. 9. the mounting device of claim 7 , further comprising: said optical device mounting assembly rotatable about a second vertical axis. 10. the mounting device of claim 1 , further comprising: said second pivot arm assembly pivotable about said first horizontal axis between a first, deployed position and a second, stowed position. 11. the mounting device of claim 1 , further comprising: said second pivot arm assembly having a first adjustment member and a second adjustment member slidable with respect to said first adjustment member; and a locking member for selectively and releasably securing the second adjustment member at a desired position relative to the first adjustment member. 12. the mounting device of claim 1 , further comprising: a tilt adjustment mechanism for adjusting a tilt position of the associated optical device relative to an eye of a user. 13. the mounting device of claim 1 , further comprising: a mounting bracket on the associated helmet; and said first pivot arm assembly removably attachable to said mounting bracket. 14. the mounting device of claim 13 , further comprising: a connector for removably attaching said first pivot arm assembly to said mounting bracket. 15. the mounting device of claim 1 , further comprising: said first pivot arm assembly including a breakaway connector, said breakaway connector configured to release upon application of a predetermined force. 16. the mounting device of claim 1 , further comprising: said first pivot arm assembly including a breakaway connector, said breakaway connector selectively configurable between a breakaway configuration, wherein the breakaway connector is configured to release upon application of a predetermined force, and a nonbreakaway configuration. 17. the mounting device of claim 1 , further comprising: said first pivot arm assembly including a generally vertically slidable mounting base for providing a vertical adjustment of the associated optical device relative to an eye of a user. 18. the mounting device of claim 1 , wherein the associated optical device is selected from a night vision goggle optical device and an electronic night vision goggle device.	cross-reference to related application this application claims the benefit of priority under 35 u.s.c. §119(e) based on u.s. provisional patent application no. 60/982,533, filed oct. 25, 2007. the aforementioned provisional application is incorporated herein by reference in its entirety. incorporation by reference this application is related to u.s. provisional application no. 60/509,136 filed oct. 6, 2003; u.s. application ser. no. 10/959,906 filed oct. 6, 2004 (u.s. pat. no. 7,219,370); u.s. application ser. no. 11/804,813 filed may 21, 2007; u.s. provisional application no. 60/928,239 filed may 8, 2007; and u.s. application ser. no. 12/117,704 filed may 8, 2008. each of the aforementioned applications is incorporated herein by reference in its entirety. background the present disclosure relates to an improved system for mounting an optical device, including without limitation a night vision goggle (nvg) or electronic night vision goggle (envg) device, to headgear such as a field helmet. brief description of the drawings the invention may take form in various components and arrangements of components, and in various steps and arrangements of steps. the drawings are only for purposes of illustrating preferred embodiments and are not to be construed as limiting the invention. fig. 1 is an isometric view taken generally from the front and side of an associated helmet carrying an associated optical device using a helmet mount system according to an exemplary embodiment wherein the optical device is positioned in front of the left eye the user. fig. 2 is an enlarged view of the helmet mount system shown in fig. 1 wherein the optical device mounting shoe is positioned before the left eye the user. fig. 3 is an enlarged view of the helmet mount system shown in fig. 1 wherein the optical device mounting shoe is positioned before the left eye the user, and showing the for and aft adjustment lever in the unlocked position. fig. 4 is an isometric view of the embodiment appearing in fig. 1 , wherein the optical device is positioned in front of the right eye the user. fig. 5 is an enlarged view of the helmet mount system shown in fig. 3 wherein the mounting shoe is moved to a center position. figs. 6 and 7 are isometric and side views, respectively, wherein the optical device is pivoted to a stowed position on the helmet. figs. 8 and 9 are isometric and side views, respectively, showing the optical device removed and the helmet mounting system in the stowed position on the helmet. fig. 10 is an exploded isometric view of the helmet mounting assembly appearing in fig. 2 . fig. 11 is an enlarged, exploded view of the pivoting mounting shoe assembly. fig. 12 is an enlarged view of the mounting arm with a uni-ball structure, with horizontal and vertical detents and corresponding aligned horizontal and vertical positioning members. detailed description of the preferred embodiments referring now to the drawing figs. 1-12 , wherein like reference numerals refer to like or analogous components throughout the several views, there appears an exemplary helmet mounting system embodiment 100 , which includes a bracket 104 attached to the front portion of a helmet 108 . the exemplary bracket 104 may be of the flush-mount, bayonet mounted bracket as described in the aforementioned u.s. provisional application no. 60/928,239 filed may 8, 2007, and incorporated herein by reference, although other brackets are also contemplated. a breakaway base 112 is secured to the mounting bracket 104 , e.g., via a bayonet mount in which a male bayonet mount member on the breakaway base engages a complimentary bayonet plate on the bracket 104 . a bayonet lock release lever 113 is provided to release the breakaway base 112 from the bracket 104 . a pivot arm assembly 116 is secured to the breakaway base 112 in breakaway fashion and may be as described in the aforementioned commonly owned u.s. pat. no. 7,219,370, incorporated herein by reference. it will be recognized that other types of brackets, such as those shown and described in the aforementioned incorporated u.s. patent and applications. the breakaway base 112 includes a sliding plate 114 which slides vertically with respect to an interface plate 110 engaging the bracket 104 . a depressible button 118 allows the sliding plate 114 to slide with respect to the interface plate 110 to provide a vertical adjustment of the optical device relative to the eye of the user. preferably, the vertical adjustment mechanism is of the gear rack/gear tooth type described in the aforementioned u.s. pat. no. 7,219,370. a breakaway lever 126 is pivotable between a first, breakaway position and a second, non-breakaway position. when the breakaway lever 126 is in the breakaway position, the engagement between the breakaway base and the pivot arm 122 is removably detachable, i.e., such that the pivot arm 122 will detach from the breakaway base upon the application of a predetermined force. when the lever 126 is moved to the non-breakaway position, the pivot arm 126 is rigidly attached to the breakaway base 112 . the breakaway mechanism may be as described in the aforementioned u.s. pat. no. 7,219,370. an angle or tilt adjustment knob 128 is provided to allow the tilt angle of the optical device to be adjusted to a desired line of sight or optical axis, and may comprise a threaded knob rotatably engaging a threaded shaft running in an elongate or arcuate slot which may be selectively loosened for adjustment and then tightened when the tilt angle is at a desired position. the adjustment mechanism may be as described in the aforementioned u.s. pat. no. 7,219,370. pivot arm assembly 116 includes pivot arms 120 , which pivot relative to pivot arm 122 about a pivot axis 124 . the pivot arms 120 are secured to a carriage member 129 , e.g., via threaded fasteners 121 . the pivot arms 120 are selectively pivotable between a lower operative position and an upper stowed position and are configured to remain in a selected position until a user depresses a pushbutton 132 to release the pivot arms and allow them to pivot about the pivot axis 124 . alternatively or additionally to the pushbutton release 132 , the pivot arms may be configured to pivot in response to the application of some predetermined amount of force. the pushbutton 132 and the pivotal mechanism of the pivot arm assembly 116 may be as described in the aforementioned u.s. pat. no. 7,219,370. a first socket member 136 includes a sliding body 140 slidably received within grooves 144 formed in the carriage member 128 . sliding movement of the sliding body within the channels 144 provides a fore and aft adjustment mechanism for positioning the optical device at a desired distance from the user's eye. in the depicted preferred embodiment, the fore and aft positioning is infinitely adjustable. a cam lever 148 is rotatable about a pivot pin 152 and includes a cam peripheral surface 156 which exerts a force against the sidewall of the sliding body 140 to selectively securing the sliding body at a desired position within the channels 144 . the first socket member 136 also includes a first socket shell portion 160 which is secured to a second socket shell portion 164 via one or more threaded fasteners 168 and pins 172 . the two shell halves 160 and 164 rotatably enclose a ball member 178 positioned at a proximal end of an optical device mounting arm assembly 176 . the ball 178 is supported on a narrowed neck or stem 180 , which extends through an opening or slot 184 formed in the base of the housing shell 160 , 164 and extends 90 degrees, forming a 90-degree slot extending from the base of the shell 160 , 164 to the front upstanding wall 188 of the shell 160 , 164 . thus, the ball 178 may rotate freely about the y-axis (see fig. 10 ). in additional to such rotation, the ball 178 may pivot 90 degrees with the stem 180 running in the 90 degree arcuate slot 184 formed in the housing shells 160 , 164 . four vertical (in the orientation shown in fig. 10 ) detents 196 are formed at 90-degree intervals on the ball 178 for selectively engaging vertical positioning members 200 captured within the shell cavity to provide positive retention of the ball at 90 degree intervals as the ball is rotated about the y-axis (see fig. 10 ). similarly, three horizontal detents 204 are spaced about the ball at 90 degree intervals for selectively engaging a horizontal positioning member 208 received within the shell cavity to provide positive retention of the ball 178 at 90-degree intervals as the ball is rotated about the x-axis (see fig. 10 ). springs 192 and 194 are captured within the housing shells and resiliently urge the positioning members 200 , 208 , respectively, into an aligned one of the detents 196 , 204 , respectively. the optical device mounting arm assembly 176 includes an outer arm member 212 extending from the stem 180 and defining channels or passageways 216 which slidably or telescopically receive an inner sliding arm member 220 . a cam lever 224 is pivotally received within an aperture 226 in the outer arm member 212 , and includes a cam surface 228 . the cam lever 224 rotates about a pivot pin 232 . the cam lever 224 is rotatable between an open position and a locked position. in the open position, the inner arm member 220 slides freely in the x-axial direction (see fig. 10 ) with respect to the outer arm member 224 . in the locked position, the cam surface 228 exerts a force against the inner arm member 220 to secure the inner arm member 220 at a desired position relative to the outer arm member 212 . in this manner, the sliding or telescoping relationship of the inner and outer arm members provided a side-to-side adjustment mechanism so that the unit may be adjusted to position the optical device directly in front of the eye of the user. in the depicted preferred embodiment, this adjustment mechanism is infinitely adjustable in accordance with the intraocular distance of the user. a protrusion 230 , which is frustopyramidal in the illustrated embodiment, on the outer arm member is positioned to engage a like opening (not shown) in the carriage member 128 when the arm assembly 176 is pivoted to the stowed position without the optical device attached (see figs. 8 and 9 ), i.e., wherein the arm assembly 176 is pivoted about the y-axis toward the user and into alignment with the z-axis (relative to the orientation shown in fig. 10 ). an optical device mounting shoe assembly 240 is pivotally attached to the inner arm 220 at a distal end of the optical device mounting arm assembly 176 . the mounting shoe assembly 240 includes a shoe member 244 having a dovetail or like receptacle 248 for removably receiving a complimentary mating member 252 of the optical device 260 . a wedge member 264 is received within a counter bore 268 defining an aperture in the shoe member 244 . one or more springs 272 (three in the embodiment shown) urge the wedge 264 downward into engagement with a complimentary aligned depression or receptacle (not shown) on the male mounting member 252 to removably secure an attached optical device 260 to the unit. as best seen in fig. 11 , an inward flange 242 within an opening 246 includes recesses 250 to provide positive retention of the mounting shoe assembly at 90 degree spaced apart intervals for alignment with either eye of the user. the shoe member 244 is secured to an upper shoe member 274 via threaded fasteners 278 to capture the wedge 264 and springs 272 therebetween. in operation, to move an attached optical device from one eye of the user to the other, the arm assembly is pivoted 180 degrees, thus rotating the ball 178 180 degrees about the y-axis and additionally rotating the optical device 180 degrees about the pivot axis 300 . in this manner, the device may be used with either eye without the need to remove the optical device from the unit or for the use on any secondary attachment means. in operation, to stow the unit on the helmet with the optical device attached (see figs. 6 and 7 ), the mounting shoe assembly 240 may first be rotated 90 degrees about the pivot axis 300 and the ball 178 is rotated 90 degrees about the x-axis (see fig. 10 ), with the stem 180 running in the slot 184 . the pivot arms 120 are then rotated about the pivot axis 124 as described above. by moving the device back farther on the helmet when the optical device 260 is not in use, neck strain is reduced. to remove the optical device from the shoe assembly 240 , a pushbutton 276 is inwardly depressed against the urging of one or more springs 280 a , 280 b , which are retained via a spring pin 284 in the illustrated embodiment. the pushbutton includes a distal end 288 received through an opening 292 in the wedge. an inclined surface 296 on the distal end 288 lifts the wedge 264 upward against the urging of the springs 272 to disengage the wedge from the receptacle formed on the male mounting member 252 to allow the device to be removed from mounting system. the mounting shoe assembly 240 is pivotable about a pivot axis 300 . a pivot assembly includes a cylinder 304 having a groove 308 and a disc 312 having a groove 316 . a pin 320 is captured within an opening defined by the aligned grooves 308 and 316 . the cylinder 304 and disc 312 are secured via threaded fasteners 324 . as best seen in fig. 11 , the ends of the pin 320 ride on the inward flange 242 , with the detents 250 providing fixed position points at 90-degree intervals as the mounting shoe assembly 240 is rotated about the pivot axis 300 . a threaded cap 328 engages a complimentary threaded opening 332 in the inner sliding arm and captures disc springs 336 therein. the disc springs urge the pin 320 into the detents 250 to provide positive retention of the optical device at 90 degree intervals as the optical device is rotated about the axis 300 . rotation of the threaded cap selectively advances or retracts the threaded cap to selectively increase or decrease the spring force exerted on the disc 312 , and to thereby adjust the force needed to overcome the force of the disc springs 336 on the pin 320 and thereby rotate the optical device to a desired position. the invention has been described with reference to the preferred embodiments. modifications and alterations will occur to others upon a reading and understanding of the preceding detailed description. it is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
170-868-241-985-228	DE	[ "AU", "DE", "KR", "WO", "EP", "JP", "CN", "US" ]	H01T2/02,H01T1/16,H01T4/10,H01T4/02,H01T15/00,F02P7/02,F02P3/01,F02P13/00	2018-10-15T00:00:00	2018	[ "H01", "F02" ]	arrangement for firing spark gaps	the invention relates to an arrangement for firing spark gaps with a trigger electrode which is located on or in one of the main electrodes and is insulated with respect to this main electrode, wherein the trigger electrode can be electrically connected to a further main electrode via at least one voltage-switching or voltage-monitoring element, and there is an air gap between the trigger electrode and the further main electrode, wherein the trigger electrode forms a sandwich structure together with an insulating layer and a layer made of a material with lower conductivity than the material of one of the main electrodes. furthermore, the insulating layer is embodied as a thin film or layer of coating agent and the layer is composed of the material with the lower conductivity is in contact with one of the main electrodes or rests on said electrode. according to the invention, in order to conduct away energetically weak overvoltage events without triggering the spark gap formed between the main electrodes, the insulating layer of the sandwich structure is interrupted outside the firing region and/or an electrical component which influences the triggering behaviour is connected between the trigger electrode and the associated main electrode.	1 . an arrangement for firing spark gaps with a trigger electrode (t) which is located at or in one of the main electrodes (h 2 ) and which is insulated from this main electrode (h 2 ), wherein the trigger electrode (t) can be electrically connected to the further main electrode (h 1 ) via at least one voltage-switching or voltage-monitoring element (a) and there is an air gap between the trigger electrode (t) and the further main electrode (h 1 ), wherein the trigger electrode (t) forms a sandwich structure with an insulating layer (i) and a layer made of a material (m) with lower conductivity than the material of one of the main electrodes (h 1 , h 2 ), the insulating layer (i) is designed as a thin foil or lacquer layer and the layer made of the material (m) of lower conductivity is in contact with one of the main electrodes (h 2 ) or rests on it, characterized in that for discharging energetically weak overvoltage events without response of the spark gap formed between the main electrodes (h 1 ; h 2 ), the insulating layer (i) of the sandwich structure is interrupted outside the firing area and/or an electrical component which influences the response behavior is connected between the trigger electrode (t) and the main electrode (h 2 ). 2 . the arrangement as claimed in claim 1 , characterized in that an electrical connection between the trigger electrode (t) and the layer (m) is formed by interrupting (u) the insulating layer (i), wherein the limited conductivity or the resistance of the layer (m) determines the dischargeable energy content of the overvoltage event. 3 . the arrangement as claimed in claim 1 , characterized in that the electrical component is a resistor (r). 4 . the arrangement according to claim 1 , characterized in that in the case of low energy content of the overvoltage event, a current flows to the main electrode (h 2 ) by way of the electrical component (r) and/or the layer (m), wherein the measure of the voltage drop at the electrical component (r) and/or at the layer (m) determines whether the overvoltage is directly discharged or whether the voltage drop results in a flashover of the insulating section (i) in the firing area or flashover area (z) and thus in firing of the spark gap between the main electrodes (h 1 and h 2 ). 5 . the arrangement according to claim 1 , characterized in that the trigger electrode (t) is formed by a conductor track of a foil printed circuit board and the insulating layer (i) by an insulating cover, in particular a lacquer layer, on the conductor track, wherein the insulating cover is exposed for the interruption (u), and the exposed area is in connection with the layer (m). 6 . the arrangement according to claim 1 , characterized in that the layer (m) consists of a conductive plastic material. 7 . the arrangement according to claim 1 , characterized in that the layer (m) consists of a material with carbon fiber content.	the invention relates to an arrangement for firing spark gaps with a trigger electrode which is located at or in one of the main electrodes and which is insulated from this main electrode, wherein the trigger electrode can be electrically connected to the further main electrode via at least one voltage-switching or voltage-monitoring element and there is an air gap between the main electrode and the further main electrode, wherein the trigger electrode forms a sandwich structure with an insulating layer and a layer made of a material with lower conductivity than the material of one of the main electrodes, the insulating layer is designed as a thin foil or lacquer layer and the layer made of the material of lower conductivity is in contact with one of the main electrodes or rests on it according to the preamble of claim 1 . spark gaps can be differentiated with regard to their behavior as a breakdown spark gap or sliding spark gap. spark gaps of this type can be executed in a triggered manner but also in an untriggered manner. in the case of triggered spark gaps, at least one trigger electrode exists in addition to the main electrodes. the firing in the case of triggered spark gaps takes place either by using an ignition transformer with the result of a high response voltage of the correspondingly well insulated trigger electrode or alternatively by way of a particular arrangement of the trigger electrode relative to the main electrode without an ignition transformer. triggered spark gaps essentially possess a controllable response behavior. in the case of the spark gaps arrangement, which is coupled in a pressure-resistant manner, for discharging harmful disturbance variables as a result of overvoltages according to de 200 20 771 u1, a trigger voltage can be directly applied via a conductive housing which is present there for forming a partial spark gap in the discharge chamber. the main spark gap between the main electrodes is fired via the partial spark gap. moreover, an ignition transformer is used there which is part of the trigger device. however, ignition transformers require considerable installation space. in addition, the size of the firing voltage which is generated in the ignition transformer on the secondary side depends on the current change di/dt on the primary side. if a current pulse of this type does not possess a sufficient slope, the voltage which occurs on the secondary side is not sufficient to fire through the spark gap in a safe manner. an ignition transformer may be omitted if the trigger electrode is in connection with one of the main electrodes. during the firing process, a sliding discharge is triggered between one of the main electrodes and the trigger electrode for solutions of this type, which sliding discharge, after a certain time, reaches the further main electrode and triggers the firing process. a solution of this type is disclosed in de 101 46 728 b4, for example. trigger electrodes of this type are in permanent electrical contact with one of the two main electrodes. this means that there is no galvanic isolation of the main potentials. for this reason, a voltage-switching element must be connected in the trigger circuit, for example in the form of a gas arrester. an arrangement for firing spark gaps is known previously from de 10 2011 102 937 a1 which has a trigger electrode which is located at or in one of the main electrodes and which is insulated from these main electrodes, and with which arrangement the response behavior can be specified over a wide range. in this respect, the generic solution has a trigger electrode which forms a sandwich structure with an insulating layer and a layer made of a material with lower conductivity than the material of one of the main electrodes. the insulating layer is preferably designed as a thin foil or lacquer layer. the layer made of the material of lower conductivity is in contact with one of the main electrodes or rests on it. the layer dielectric of the sandwich structure is represented as a series connection of a first partial capacitance with the dielectric of the insulating section and a second partial capacitance with the material of lower conductivity as a dielectric, wherein the partial capacitances are selected to be very low. the material m of the sandwich structure possesses an often worse conductivity than the material of one of the main electrodes. the ignition arc is extended via the thickness of the layer made of the material m. the thin insulating section between the trigger electrode and the layer made of poorly conductive material can preferably be realized by printed circuit boards. the trigger electrode then corresponds to the applied conductor track and the insulating layer to the lacquer layer which is located above it, wherein an end face section remains free of a lacquer layer. the previously known solution according to de 10 2011 102 937 a1, the disclosure content of which is explained to be the subject matter of the present application, creates a plasma jet or plasma beam in the base point area of an arrangement which is preferably designed as a horn spark gap. this beam results in a strong and fast purposeful movement of ionized gases and charge carriers. this transport is used in order to significantly accelerate the firing of the main line between the main electrodes, whereby the load of the trigger electrode and the sandwich structure can be reduced and the residual voltage of the spark gap drops. the plasma jet effect explained previously is characterized by the expression of a preferred direction of the ionized gas flow. according to the prior art, measures can be taken to, on the one hand, influence the emergence of the beam but also the direction in such a way that there emerges the effect of a rapid firing of the main line. in order to overcome the air gap between the main electrodes, the proposed beam with its very effective ionization of air distances is particularly suitable, which, in turn, ensures an effective operation of the preferred horn spark gap. the electrode arrangement as well as the insulating layer and the layer made of the material with lower conductivity results in a preferred orientation of otherwise merely stochastic plasma jets. in particular, the material with lower conductivity can be suitable for gas delivery, which enables a further targeted generation of the plasma jet. compared to classic, uninsulated current trigger methods, the solution according to de 10 2011 102 937 a1 offers the advantage of a very fast firing of the main spark gap, whereby all other components of the spark gap arrangement are less energetically loaded and thus can be designed in a miniaturized manner. however, one disadvantage is the fact that even the smallest, relatively low-energy pulses of overvoltage events are sufficient to fire the entire spark gap. this results in a possible disadvantageous aging of the corresponding surge arrester arrangement. from what was previously mentioned, it is therefore an object of the invention to specify an improved arrangement for firing spark gaps using a trigger electrode, wherein the basic principle of plasma jet firing should be reverted to in this respect in order to make use of the advantages provided by this, but, on the other hand, it should also be ensured that there is no resulting premature aging of appropriately equipped surge arresters with spark gaps of this type by preventing the actual overload range between the main electrodes, in particular the main electrodes of a horn spark gap, from being activated in the case of low energy contents of overvoltage events. achieving the object of the invention takes place with an arrangement according to the feature combination as claimed in claim 1 , wherein the subclaims represent at least practical configurations and developments. an arrangement for firing spark gaps with a trigger electrode which is located at or in one of the main electrodes and which is insulated from this main electrode is therefore assumed. the trigger electrode can be electrically connected to the further main electrode via at least one voltage-switching or voltage-monitoring element. there is an air gap between the main electrode and the further main electrode. the trigger electrode forms a sandwich structure with an insulating layer and a layer made of a material with lower conductivity than the material of one of the main electrodes. the insulating layer is preferably designed as a thin foil or lacquer layer. the layer made of the material of lower conductivity is in contact with one of the main electrodes or rests on it. according to the invention, the arrangement is now further formed in such a way that an energetic limit or an energetic threshold value can be determined, wherein below the determined limit value or threshold value, energetically weak overvoltage events are discharged without response of the spark gap between the main electrodes. if the limit value or threshold value is exceeded, the correspondingly triggered discharge process takes place by firing the main spark gap. for determining the limit value or threshold value and the means which are to be provided for this purpose, the basic concept of the invention continues to involve only reverting to those which can be integrated in the spark gap itself in a spatial and structural manner. an additional external circuitry for possible necessary housing feedthroughs and other structural measures must be explicitly ruled out. according to the invention, for discharging energetically weak overvoltage events without response of the spark gap formed between the main electrodes, the insulating layer of the sandwich structure is therefore interrupted outside the firing area. alternatively or additionally, an electrical component which influences the response behavior is connected between the trigger electrode and the main electrode integrated in the spark gap. an electrical connection between the trigger electrode and the layer of lower conductivity is formed by interrupting the insulating layer, wherein the dischargeable energy content of the overvoltage event can be determined by the limited conductivity or the resistance of the layer of lower conductivity. as a result, the aforementioned limit value or threshold value can, in turn, be determined. in one embodiment, the aforementioned electrical component is an integratable, miniaturized resistor. overvoltage events with the smallest energy contents, for example burst pulses, generally no longer result in the firing of the entire spark gap, since the low or minimum pulse energy is reduced in the layer of lower conductivity. if the energy content of the overvoltage or the overvoltage event is higher, the entire spark gap fires in a virtually delayed manner. if the energy of the pulse exceeds a predetermined level, such a high voltage drops at the layer of lower conductivity that the auxiliary ignition spark gap fires and thus the main spark gap can be fired. the degree of delay can be influenced via the structural design and the material sizes or material properties. firing the auxiliary ignition spark gap takes place by way of a flashover of the insulating section in the firing area. in the case of all the overvoltages with higher energy contents, for example in the case of direct or indirect flash pulses, the main spark gap fires comparably fast, as is known from the prior art. in one preferred configuration, the trigger electrode is formed by a conductor track of a foil printed circuit board and the insulating layer by an insulating cover, in particular a lacquer layer, on the conductor track. the insulating cover is exposed for the interruption, so that the exposed section of the conductor track can be connected to the layer of lower conductivity. the layer of lower conductivity can preferably consist of a conductive plastic material or can be formed from a material with a carbon fiber content. the invention is explained in greater detail hereinafter using an exemplary embodiment and with the help of figures. in this case, in the figures: fig. 1 shows an equivalent circuit diagram with the principal arrangement of main electrodes of a spark gap as well as a sandwich structure, comprising a trigger electrode with an insulating layer as well as a layer made of a material of lower conductivity than the material of one of the main electrodes and a parallel connection of an electrical component in the form of a resistor between the trigger electrode and the associated main electrode and fig. 2 shows a representation which is similar to fig. 1 but with an indicated interruption of the insulating layer, so that the trigger electrode comes into contact with the layer with the material of lower conductivity outside the firing area, in order to achieve a direct discharge without response of the entire spark gap in the case of low energy contents of an overvoltage event. the representation according to figs. 1 and 2 comprises an electrically conductive trigger electrode t which is covered by an insulating layer i in the direction of the main electrode h 2 . the insulating layer i is followed by a layer made of a material m with lower conductivity. the layer made of the material m rests on the surface of the second main electrode h 2 . external elements can be connected between the trigger electrode t and the main electrode h 1 via a connection a. the means provided there may include gas arresters, varistors, diodes or similar electrical components, for example. the spark gap formed by the main electrodes h 1 and h 2 can be designed as a horn spark gap and is electrically connected between the paths l and n/pen. the represented configuration corresponds in principle to the arrangement for plasma jet generation according to de 10 2011 102 937 a1 and the explanations therein on the structural design. in this respect, reference is made, on the disclosure side, to the relevant explanations in de 10 2011 102 937 a1 which embody the knowledge of the relevant person skilled in the art in this case. according to the invention, an electrical component r which influences the response behavior is connected between the trigger electrode t and the main electrode h 2 according to fig. 1 . the value of the resistor r determines the response behavior and thus an energetic limit value based on the firing process of the corresponding spark gap. in the case of low energy contents of corresponding overvoltage events, the voltage drop which results via the resistor r is not sufficient in order to enable firing in the firing area of the arrangement. it is therefore possible to directly discharge low-energy overvoltage events by way of the arrangement of the resistor r without the main spark gap responding and aging unnecessarily as a result. according to the representation in fig. 2 , a fully integrated solution is shown instead of the parallel connection of the resistor r. in this respect, the thin insulating layer i is interrupted outside the firing area and flashover area, so that a conductive connection of the trigger electrode t with the material of lower conductivity m takes place. this makes it possible, owing to the resistance value of the material m, to discharge overvoltage events via the path trigger electrode, material of lower conductivity m and a main electrode h 2 , without this resulting in a response of the main spark gap between the electrodes h 1 and h 2 . in such a case, the energy content of the overvoltage is therefore so low that there is only a very small current flowing and the voltage which drops in the poorly conductive material m is not sufficient to flash over the insulating layer i. the flashover area thus does not respond and the overvoltage is discharged by the energy mapping area alone. in contrast, if the current increases very strongly as a result of an overvoltage event such that the voltage which drops in the material m flashes over the insulating layer i and generates an ignition spark, this results in firing of the entire spark gap. in this embodiment variant of the invention, the layer made of a material m not only has the task of extending the ignition arc by extending the direct flashover gap from the trigger electrode t to the main electrode h 2 , in fact the resistance value of the poorly conductive material is used via the contacting of the trigger electrode with the layer m in order to discharge weak overvoltage events. this configuration makes it possible to completely dispense with any separate electrical or electronic components for controlling the response behavior, in particular in the case of very weak overvoltage events.
172-654-455-357-613	KR	[ "US", "KR" ]	H01L33/50,H01L33/60,H01L33/48	2014-12-18T00:00:00	2014	[ "H01" ]	wavelength conversion film and light emitting device package including the same	a wavelength conversion film is provided and may include a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and a second layer attached to the first layer and having a refractive index less than a refractive index of the encapsulant and greater than a refractive index of air.	1 . a wavelength conversion film comprising: a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material; and a second layer attached to the first layer and having a refractive index less than a refractive index of the encapsulant and greater than a refractive index of air. 2 . the wavelength conversion film of claim 1 , wherein a thickness of the second layer is less than a thickness of the first layer. 3 . the wavelength conversion film of claim 1 , wherein the second layer has a first surface attached to the first layer and a second surface opposed to the first surface and having at least a portion thereof externally exposed. 4 . the wavelength conversion film of claim 3 , wherein the second layer includes an unevenness structure formed on at least a portion of the second surface. 5 . the wavelength conversion film of claim 4 , wherein a height of the unevenness structure is less than a thickness of the second layer. 6 . the wavelength conversion film of claim 1 , wherein the refractive index of the second layer is greater than about 1.0 and less than about 1.5. 7 . a light emitting device package comprising: a package body; a light emitting device coupled to at least a portion of the package body; and a wavelength conversion film disposed on the light emitting device so that light emitted by the light emitting device passes through the wavelength conversion film, wherein the wavelength conversion film comprises a wavelength conversion material that changes a wavelength of the light emitted by the light emitting device, and the wavelength conversion film includes a first layer disposed to be adjacent to the light emitting device and a second layer attached to the first layer and having a refractive index less than a refractive index of the first layer and greater than a refractive index of air. 8 . the light emitting device package of claim 7 , wherein a thickness of the second layer is less than a thickness of the first layer. 9 . the light emitting device package of claim 7 , wherein the wavelength conversion film includes an unevenness structure formed on at least a portion of a surface of the second layer. 10 . the light emitting device package of claim 9 , wherein a height of the unevenness structure is less than a thickness of the second layer. 11 . the light emitting device package of claim 7 , wherein the first layer includes the wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and the refractive index of the second layer is less than a refractive index of the encapsulant. 12 . the light emitting device package of claim 7 , wherein the package body includes a reflective wall attached to a side surface of the light emitting device. 13 . the light emitting device package of claim 12 , wherein at least a portion of the first layer is attached to an upper surface of the light emitting device and an upper surface of the reflective wall. 14 . the light emitting device package of claim 12 , wherein the upper surface of the light emitting device and the upper surface of the reflective wall are coplanar. 15 . the light emitting device package of claim 12 , wherein the reflective wall has substantially the same width in a height direction of the reflective wall. 16 . the wavelength conversion film of claim 4 , wherein the unevenness structure comprises a plurality of unevenness structures that have at least one of a polypyramidal shape, a conical shape, and a hemispherical shape. 17 . the light emitting device package of claim 9 , wherein the unevenness structure comprises a plurality of unevenness structures that have at least one of a polypyramidal shape, a conical shape, and a hemispherical shape. 18 . a method of manufacturing a wavelength conversion film that includes a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and a second layer attached to the first layer, the method comprising: disposing a mask on a film, the film having a refractive index value greater than a refractive index value of air; applying an encapsulant containing a wavelength conversion material to a space between portions of the mask, the encapsulant having a refractive index value greater than a refractive index value of the film; and removing the mask. 19 . the method of claim 18 , wherein the encapsulant is applied such that a thickness of the encapsulant is uniform and is substantially the same as a thickness of the mask. 20 . the method of claim 18 , wherein the encapsulant is applied such that a thickness of the encapsulant is greater than a thickness of the film.	cross-reference to related application this application claims priority from korean patent application no. 10-2014-0183491 filed on dec. 18, 2014, with the korean intellectual property office, the disclosure of which is herein incorporated by reference. background 1. field apparatuses, devices, methods, and articles of manufacture consistent with the present disclosure relate to a wavelength conversion film and a light emitting device package including the same. 2. description of related art in general, light emitting device packages may be applied to various types of lighting devices, the backlights of display devices, automobile headlamps, and the like. light emitting device packages may include a film to convert a wavelength of light emitted from a semiconductor light emitting device to produce an output light of a certain wavelength. in the case of manufacturing a light emitting device package, a degradation in a degree of light uniformity due to a precipitation phenomenon or the like, may be prevented. however, as at least a portion of a surface of the film is directly exposed to air, a decrease in light extraction efficiency due to total reflection and internal reflection occurring at a boundary surface between the film and air may occur. summary it is an aspect to provide a wavelength conversion film having high light extraction efficiency by decreasing a quantity of light internally reflected from a boundary surface between the wavelength conversion film and air, and a light emitting device package including the same. according to an aspect of an exemplary embodiment, a wavelength conversion film may include a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material; and a second layer attached to the first layer and having a refractive index less than a refractive index of the encapsulant and greater than a refractive index of air. a thickness of the second layer may be less than a thickness of the first layer. the second layer may have a first surface attached to the first layer and a second surface opposed to the first surface and having at least a portion thereof externally exposed. the second layer may include an unevenness structure formed on at least a portion of the second surface. a height of the unevenness structure may be less than a thickness of the second layer. the refractive index of the second layer may be greater than about 1.0 and less than about 1.5. according to an aspect of an exemplary embodiment, a light emitting device package may include a package body; a light emitting device coupled to at least a portion of the package body; and a wavelength conversion film disposed on the light emitting device so that light emitted by the light emitting device passes through the wavelength conversion film, wherein the wavelength conversion film comprises a wavelength conversion material that changes a wavelength of the light emitted by the light emitting device, and the wavelength conversion film includes a first layer disposed to be adjacent to the light emitting device and a second layer attached to the first layer and having a refractive index less than a refractive index of the first layer and greater than a refractive index of air. a thickness of the second layer may be less than a thickness of the first layer. the wavelength conversion film may include an unevenness structure formed on at least a portion of a surface of the second layer. a height of the unevenness structure may be less than a thickness of the second layer. the first layer may include the wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and the refractive index of the second layer may be less than a refractive index of the encapsulant. the package body may include a reflective wall attached to a side surface of the light emitting device. at least a portion of the first layer may be attached to an upper surface of the light emitting device and an upper surface of the reflective wall. the upper surface of the light emitting device and the upper surface of the reflective wall may be coplanar. the reflective wall may have substantially the same width in a height direction of the reflective wall. the unevenness structure may comprise a plurality of unevenness structures that have at least one of a polypyramidal shape, a conical shape, and a hemispherical shape. according to an aspect of an exemplary embodiment, there is provided a method of manufacturing a wavelength conversion film that includes a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and a second layer attached to the first layer, the method comprising disposing a mask on a film, the film having a refractive index value greater than a refractive index value of air; applying an encapsulant containing a wavelength conversion material to a space between portions of the mask, the encapsulant having a refractive index value greater than a refractive index value of the film; and removing the mask. the encapsulant may be applied such that a thickness of the encapsulant is uniform and is substantially the same as a thickness of the mask. the encapsulant may be applied such that a thickness of the encapsulant is greater than a thickness of the film. brief description of drawings the above and other aspects will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: figs. 1a through 3 are views respectively illustrating light emitting device packages according to exemplary embodiments; figs. 4 through 7 are views illustrating a method of manufacturing a wavelength conversion film for the light emitting device package according to an exemplary embodiment; figs. 8 through 10 are views illustrating a method of manufacturing a light emitting device package according to an exemplary embodiment; figs. 11 through 16 are views illustrating semiconductor light emitting devices applicable to the light emitting device package according to an exemplary embodiment; figs. 17 and 18 are views illustrating examples of backlight units in which the light emitting device package according to an exemplary embodiment is employed; fig. 19 is a view illustrating an example of a lighting device in which the light emitting device package according to an exemplary embodiment is employed; and fig. 20 is a view illustrating an example of a headlamp in which the light emitting device package according to an exemplary embodiment is employed. detailed description various exemplary embodiments will now be described more fully with reference to the accompanying drawings in which some exemplary embodiments are shown. the present inventive concept may, however, be embodied in different forms and should not be construed as limited to the exemplary embodiments set forth herein. rather, these exemplary embodiments are provided so that this disclosure is thorough and complete and fully conveys the present inventive concept to those skilled in the art. in the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. it will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. in contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. as used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. it will be understood that, although the terms “first”, “second”, “third”, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. these terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. thus, a “first” element, component, region, layer or section discussed below could be termed a “second” element, component, region, layer or section without departing from the teachings of the present disclosure. spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element's or feature's relationship to another element(s) or feature(s) as illustrated in the figures. it will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. for example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. thus, the term “below” can encompass both an orientation of above and below. the device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting of the present disclosure. as used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. it will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. it will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. meanwhile, when an exemplary embodiment can be implemented differently, functions or operations described in a particular block may occur in a different way from a flow described in the flowchart. for example, two consecutive blocks may be performed simultaneously, or the blocks may be performed in reverse according to related functions or operations. exemplary embodiments of the present inventive concept will now be described in detail with reference to the accompanying drawings. the inventive concept may, however, be embodied in many different forms and should not be construed as being limited to the specific exemplary embodiments set forth herein. rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. in the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements. figs. 1a through 3 are views respectively illustrating light emitting device packages according to exemplary embodiments. referring to fig. 1a , a light emitting device package 100 according to an exemplary embodiment may include a package body 110 , a light emitting device 120 , and a wavelength conversion film 130 . the package body 110 may include a reflective wall 111 and a package substrate 113 transferring an electrical signal to the light emitting device 120 . the light emitting device 120 may include a support substrate 121 , a first conductivity-type semiconductor layer 122 , an active layer 123 , a second conductivity-type semiconductor layer 124 and the like, sequentially stacked from the support substrate 121 . the first conductivity-type semiconductor layer 122 and the second conductivity-type semiconductor layer 124 may be electrically connected to a first electrode 125 and a second electrode 126 , respectively, and the light emitting device 120 may be mounted on the package substrate 113 through solder bumps 140 . that is, in the exemplary embodiment of fig. 1a , the light emitting device 120 may be flip-chip bonded to the package substrate 113 , and light generated from the light emitting device 120 may be externally emitted through the support substrate 121 and the wavelength conversion film 130 . when an electrical signal is applied to the light emitting device 120 through the package substrate 113 , light may be generated due to the recombination of electrons and holes supplied from the first conductivity-type semiconductor layer 122 and the second conductivity-type semiconductor layer 124 . light generated due to the recombination of electrons and holes may be directly emitted upwardly through the support substrate 121 having light-transmissive properties and the wavelength conversion film 130 , or may be reflected by the reflective wall 111 or the first and second electrodes 125 and 126 and the like and then be upwardly emitted through the support substrate 121 and the wavelength conversion film 130 . in some exemplary embodiments, the first conductivity-type semiconductor layer 122 may be an n-type nitride semiconductor layer and the second conductivity-type semiconductor layer 124 may be a p-type nitride semiconductor layer. due to characteristics of the p-type nitride semiconductor layer in which a resistance level thereof is higher than that of the n-type nitride semiconductor layer, ohmic contact between the second conductivity-type semiconductor layer 124 and the second electrode 126 may be difficult. thus, in order to secure the ohmic contact between the second conductivity-type semiconductor layer 124 and the second electrode 126 , a contact area between the second conductivity-type semiconductor layer 124 and the second electrode 126 may be relatively large. that is, the second electrode 126 may have a surface area relatively larger than that of the first electrode 125 . in addition, in terms of characteristics of the light emitting device 120 from which light is mainly extracted in a direction toward an upper portion of the light emitting device 120 to which the support substrate 121 is attached, the second electrode 126 may be formed of a material having a high degree of reflectance, whereby light extraction efficiency of the light emitting device package may be improved. in order that light generated in the active layer 123 due to the recombination of electrons and holes is reflected to be emitted outwardly through the support substrate 121 , the second electrode 126 may contain a material having excellent reflectance such as ag, ni, al, rh, pd, jr, ru, mg, zn, pt, au or the like. the reflective wall 111 may be disposed on a side surface of the light emitting device 120 . the reflective wall 111 may contain a metallic oxide having excellent reflectance such as tio 2 . an interior surface of the reflective wall 111 may be directly attached to the side surface of the light emitting device 120 as illustrated in fig. 1a , but is not limited to having such a form. for example, although the reflective wall 111 is shown in fig. 1a to be substantially parallel to the side of the device package 100 , this is only an example and, in some exemplary embodiments, the reflective wall 111 may be sloped or slanted such that the width in the height direction is not constant. an upper surface of the reflective wall 111 may form a coplanar surface with an upper surface of the support substrate 121 included in the light emitting device 120 , and the wavelength conversion film 130 may be attached to the coplanar surface formed by the upper surfaces of the reflective wall 111 and the support substrate 121 . the wavelength conversion film 130 may include a first layer 131 and a second layer 133 sequentially stacked on the light emitting device 120 . the first layer 131 may include a wavelength conversion material 131 a receiving at least a portion of light emitted from the light emitting device 120 and converting a wavelength thereof and an encapsulant 131 b containing the wavelength conversion material 131 a . by way of example, when the light emitting device 120 emits blue light, the wavelength conversion film 130 that has the wavelength conversion material 131 a excited by blue light and generating yellow light may be included in the light emitting device package 100 , whereby the light emitting device package 100 emitting white light may be manufactured. the second layer 133 , a layer provided to increase light extraction efficiency of the light emitting device package 100 , may contain a material having a refractive index lower than that of the encapsulant 131 b included in the first layer 131 and higher than that of air. for example, in the case that the encapsulant 131 b contains a resin, since a refractive index of the encapsulant 131 b is approximately 1.5 and a refractive index of air is 1.0, the second layer 133 may be formed of a material having a refractive index higher than 1.0 and lower than 1.5, for example, magnesium fluoride (mgf 2 ), epoxy resin or the like. the limit of numerical values as described above may be modified according to various exemplary embodiments. in another example, the encapsulant 131 b is formed of a material having a refractive index higher than 1.5, the second layer 133 may be formed of a silicon nitride (sin x ), a silicon oxide (sio x ) or the like, in addition to magnesium fluoride (mgf 2 ) and epoxy resin. transmittance and reflectance values of light passing through mediums having different refractive indices may be calculated by the fresnel equation. when a light passes through a first medium having a high refractive index n 1 and a second medium having a low refractive index n 2 , sequentially, transmittance t of the light in a boundary surface between the first medium and the second medium may be calculated according to the following mathematical equation 1. hereinafter, with reference to fig. 1b and mathematical equation 1, effects of improving light extraction efficiency of light generated from the wavelength conversion film 130 including the second layer 133 will be described. fig. 1b is an enlarged view of region a of the light emitting device package 100 illustrated in fig. 1a . referring to fig. 1b , internal reflection may be formed on each of a boundary surface si between the first layer 131 and the second layer 133 of the wavelength conversion film 130 and a boundary surface s 2 between the second layer 133 and air. in the case that a refractive index of the encapsulant 131 b included in the first layer 131 is 1.5 and a refractive index of the second layer 133 is 1.3, a value lower than that of the encapsulant 131 b and higher than that of air, transmittance values in the boundary surfaces 51 and s 2 may be calculated as 0.995 and 0.983, respectively. thus, light transmittance of the overall wavelength conversion film 130 may be approximately 0.978. on the other hand, in the case of a wavelength conversion film having a single layer and manufactured by containing a wavelength conversion material in an encapsulant having a refractive index of approximately 1.5, light transmittance in a boundary surface between an upper surface of the wavelength conversion film and air may be approximately 0.960. that is, the light emitting device package 100 including the wavelength conversion film 130 including the second layer 133 may have a higher degree of light transmittance as compared to the case of a light emitting device package 100 including the wavelength conversion film 130 in which the second layer 133 is not included. as illustrated in fig. 1b , since the refractive index of the second layer 133 is lower than that of the first layer 131 and higher than that of air, light emitted from the light emitting device 120 may be refracted in a boundary surface between the first and second layers 131 and 133 and a boundary surface between the second layer 133 and air. in the case that an angle between the boundary surface between the first and second layers 131 and 133 and a path of light is defined as θ 1 and an angle between the boundary surface between the second layer 133 and air and the path of light is defined as θ 2 , the relationship of θ 1 >θ 2 due to refractive indices of the first and second layers 131 and 133 and air may be established. the internal reflection generated within the wavelength conversion film 130 may be reduced, whereby light extraction efficiency may be increased and luminance may be improved. meanwhile, a thickness t 1 of the first layer 131 included in the wavelength conversion film 130 may be greater than a thickness t 2 of the second layer 133 . the thickness t 2 of the second layer 133 may be several to several tens of micrometers thick, and in consideration of skin depth, may be greater than a wavelength of light emitted from the light emitting device 120 . however, thicknesses of the first and second layers 131 and 133 are not limited to having the degrees of thickness as described above, and in some exemplary embodiments, the thickness t 2 of the second layer 133 may be greater than the thickness t 1 of the first layer 131 . meanwhile, the wavelength conversion material 131 a may be a material capable of being excited by light emitted from the light emitting device 120 and converting at least a portion of the light into light having a different wavelength. the wavelength conversion material 131 a may contain, for example, phosphors or quantum dots. as the wavelength conversion material 131 a , two or more types of material providing light having different wavelengths may be used. light having been converted or light not having been converted by the wavelength conversion material 131 a may be mixed with each other to thereby generate white light. in an example, light generated in the light emitting device 120 may be blue light and the wavelength conversion material 131 a may contain at least one of a green phosphor, a yellow phosphor, an orange phosphor and a red phosphor. the first conductivity-type semiconductor layer 122 and the second conductivity-type semiconductor layer 124 included in the light emitting device 120 may be an n-type semiconductor layer and a p-type semiconductor layer, respectively, as described above. by way of example, the first conductivity-type semiconductor layer 122 and the second conductivity-type semiconductor layer 124 may be formed of a group iii nitride semiconductor, for example, a material having a composition of al x in y ga 1-x-y n (0≦x≦1, 0≦y≦1, 0≦x+y≦1). the materials of the first conductivity-type semiconductor layer 122 and the second conductivity-type semiconductor layer 124 are not limited thereto, and may be an algainp based semiconductor or an algaas based semiconductor. meanwhile, in some exemplary embodiments, the first and second conductivity-type semiconductor layers 122 and 124 may have a single layer structure, and in other exemplary embodiments, the first and second conductivity-type semiconductor layers 122 and 124 may have a multilayer structure in which respective layers have different compositions, thicknesses or the like. for example, each of the first and second conductivity-type semiconductor layers 122 and 124 may include a carrier injection layer capable of improving injection efficiency of electrons and holes, and further, may have a superlattice structure formed in various manners. the first conductivity-type semiconductor layer 122 may further include a current spreading layer in a portion thereof adjacent to the active layer 123 . the current spreading layer may have a structure in which a plurality of al x in y ga 1-x-y n (0≦x≦1, 0≦y≦1, 0≦x+y≦1) layers having different compositions or different impurity contents are repeatedly stacked or may be partially formed of an insulating material layer. the second conductivity-type semiconductor layer 124 may further include an electron blocking layer in a portion thereof adjacent to the active layer 123 . the electron blocking layer may have a structure in which a plurality of al x in y ga 1-x-y n layers having different compositions are stacked or may have at least one layer configured of al y ga (1-y) n. the second conductivity-type semiconductor layer 124 may have a band gap greater than that of the active layer 123 to prevent electrons from passing over the second conductivity-type semiconductor layer 124 . the light emitting device 120 may be formed using an mocvd device. in order to manufacture the light emitting device 120 , an organic metal compound gas (for example, trimethylgallium (tmg), trimethyl aluminum (tma) or the like) and a nitrogen-containing gas (for example, ammonia (nh 3 ) or the like) may be supplied as a reaction gas, to a reaction container in which a growth substrate is disposed, and a temperature of the substrate may be maintained at a high temperature of approximately 900° c. to approximately 1100° c., such that gallium nitride compound semiconductors may be grown on the substrate while supplying an impurity gas thereto in some exemplary embodiments, to thereby allow the gallium nitride compound semiconductors to be stacked as an undoped layer, an n-type layer, and a p-type layer, on the substrate. an n-type impurity may be si, widely known in the art and a p-type impurity may be zn, cd, be, mg, ca, ba or the like. as the p-type impurity, mg and zn may mainly be used. in addition, the active layer 123 interposed between the first and second conductivity-type semiconductor layers 122 and 124 may have a multiple quantum well (mqw) structure in which quantum well layers and quantum barrier layers are alternately stacked. for example, in the case that the active layer 123 includes a nitride semiconductor, the active layer 123 may have a multiple quantum well (mqw) structure in which gan and ingan are alternately stacked. in some exemplary embodiments, the active layer 123 may have a single quantum well (sqw) structure. fig. 2a is a view illustrating a light emitting device package 200 according to another exemplary embodiment. referring to fig. 2a , the light emitting device package 200 may include a package body 210 including a reflective wall 211 , a circuit board 213 and the like, a light emitting device 220 , a wavelength conversion film 230 and so on. the light emitting device 220 may include a support substrate 221 having light-transmissive properties, first and second conductivity-type semiconductor layers 222 and 224 , an active layer 223 , first and second electrodes 225 and 226 , and the like. the first and second electrodes 225 and 226 may be electrically connected to circuit patterns of the circuit board 213 through solder bumps 240 or the like. the reflective wall 211 may contain a material having excellent reflectance such as tio 2 . although fig. 2a illustrates a case in which an interior surface of the reflective wall 211 is attached to the side surface of the light emitting device 220 , the reflective wall 211 is not limited to having such a form. the reflective wall 211 may be disposed to be spaced apart from the light emitting device 220 by a distance. the distance may be predetermined. in this case, the interior surface of the reflective wall 211 may be substantially parallel to the side surface of the light emitting device 220 . meanwhile, the reflective wall 211 may have a substantially constant width in a height direction thereof. however, this is only an example and, in some exemplary embodiments, the reflective wall 211 may be sloped or slanted such that the width in the height direction is not constant. referring to fig. 2a , the wavelength conversion film 230 may include a first layer 231 and a second layer 233 . at least a portion of the first layer 231 may be attached to the light emitting device 220 , and the first layer 231 may include a wavelength conversion material 231 a and an encapsulant 231 b . the wavelength conversion material 231 a may be excited by light emitted by the light emitting device 220 and may generate light having a wavelength different from that of light emitted by the light emitting device 220 . the second layer 233 may include a low-refractive index film 233 a and unevenness structures 233 b provided on a second surface s 2 of the low-refractive index film 233 a . the low-reflective index film 233 a may be disposed such that a first surface s 1 there of faces the first layer 231 . the low-refractive index film 233 a may contain a material having a refractive index lower than that of the encapsulant 231 b of the first layer 231 . for example, in the case that a refractive index of the encapsulant 231 b is approximately 1.5, the low-refractive index film 233 a may be formed of a material having a refractive index lower than 1.5, for example, magnesium fluoride (mgf 2 ), epoxy resin or the like. the unevenness structures 233 b may have conical shapes, polypyramidal shapes, hemispherical shapes or the like. the unevenness structures 233 b may be formed on at least a portion of the second surface s 2 of the low-refractive index film 233 a . since the unevenness structures 233 b are formed on a boundary surface between the low-refractive index film 233 a and air, light extraction efficiency may be further increased. a size and a shape of each of the unevenness structures 233 b may be variously determined. referring to fig. 2b which shows an enlarged view of region b of the light emitting device package 200 illustrated in fig. 2a , a height h of the unevenness structures 233 b may be less than a distance p between the unevenness structures 233 b . that is, h<p. in some exemplary embodiments, the unevenness structures 233 b may be provided at an interval indicated by distance p, such that the unevenness structures 233 b are spaced evenly apart from each other. however, in other exemplary embodiments, the unevenness structures 233 b may be positioned at varying distances with a minimum distance being the distance p. by way of example, in the case that a thickness t 2 of the low-refractive index film 233 a included in the second layer 233 is 30 μm, the unevenness structures 233 b respectively having a height of 20 μm and a conical shape may be formed at intervals of 30 μm, whereby light extraction efficiency may be improved by approximately 3%. fig. 3 is a view illustrating a light emitting device package 300 according to another exemplary embodiment. referring to fig. 3 , a package body 310 may include a reflective wall 311 , a body portion 313 , lead frames 315 and the like. the body portion 313 may include a mounting space 317 provided by removing at least a partial region thereof. at least portions of the lead frames 315 may be exposed in the mounting space 317 and in the mounting space 317 , a light emitting device 320 may be mounted on the lead frames 315 . although fig. 3 illustrates a case in which the light emitting device 320 is flip-chip bonded to the lead frames 315 , the light emitting device 320 may also be electrically connected to the lead frames 315 through a wire or the like, unlike the case of fig. 3 . the reflective wall 311 may be a wall adjacent to the light emitting device 320 in the mounting space 317 and may be formed by coating a partial surface of the body portion 313 with a material having a high degree of reflectance. the mounting space 317 may be filled with air without a separate process or may be filled with a separate encapsulant. in another example, the mounting space 317 may be provided in a vacuum state. a wavelength conversion film 330 may be attached to an upper portion of the package body 310 . the wavelength conversion film 330 may include a first layer 331 and a second layer 333 sequentially stacked from the light emitting device 320 , and the first layer 331 may include a wavelength conversion material 331 a and an encapsulant 331 b . a thickness t 1 of the first layer 331 may be greater than a thickness t 2 of the second layer 333 , but is not limited thereto. the second layer 333 may have a refractive index lower than that of the encapsulant 331 b included in the first layer 331 . in the case that the encapsulant 331 b is formed of a silicon resin such as sio 2 , the refractive index of the encapsulant 331 b may be approximately 1.5 and, in this case, the second layer 333 may be formed of epoxy resin or the like, having a refractive index lower than 1.5. as described above, since the second layer 333 having a refractive index relatively lower than that of the first layer may be formed on the first layer 331 , a light extraction efficiency of light emitted from the light emitting device 320 may be improved. meanwhile, the refractive index of the second layer 333 may be higher than a refractive index of air (i.e., 1.0) to which an upper surface of the second layer 333 is exposed. figs. 4 through 7 are views illustrating a method of manufacturing a wavelength conversion film for a light emitting device package according to an exemplary embodiment. referring to fig. 4 first, the method of manufacturing a wavelength conversion film according to an exemplary embodiment may start with applying an encapsulant 410 b containing a wavelength conversion material 410 a to a space between portions of a mask 430 after preparing the mask 430 on a low-refractive index film 420 . the encapsulant 410 b containing the wavelength conversion material 410 a may have a refractive index relatively larger than that of the low-refractive index film 420 . in some exemplary embodiments, the low-refractive index film 420 may contain epoxy resin and have a refractive index of approximately 1.4 and the encapsulant 410 b may contain a silicon oxide and have a refractive index of approximately 1.5. materials contained in the low-refractive index film 420 and the encapsulant 410 b may be variously modified in addition to the materials. the mask 430 may be disposed to be adjacent to an edge of the low-refractive index film 420 and may partially expose a surface of the low-refractive index film 420 . the encapsulant 410 b may be applied to the space between portions of the mask 430 through a method such as a dispensing method or the like. when the encapsulant 410 b is applied, the encapsulant 410 b applied between portions of the mask 430 may be spread using a blade 440 or the like as illustrated in fig. 5 , whereby a thickness of the encapsulant 410 b may be made uniform. in this case, a thickness to which the encapsulant 410 b is applied may be substantially identical to a thickness of the mask 430 . thus, the thickness of the encapsulant 410 b may be controlled by adjusting the thickness of the mask 430 . in an exemplary embodiment, a thickness t 1 of the encapsulant 410 b may be greater than a thickness t 2 of the low-refractive index film 420 . referring to figs. 6 and 7 , after curing the encapsulant 410 b applied to have a uniform thickness in fig. 6 , the mask 430 may be removed to thereby manufacture a wavelength conversion film 400 as shown in fig. 7 . the wavelength conversion film 400 may have a structure in which a plurality of layers are stacked. that is, the wavelength conversion film 400 may include a first layer 410 having the wavelength conversion material 410 a and the encapsulant 410 b , and a second layer 420 provided as a low-refractive index film. the wavelength conversion film 400 may be included within the light emitting device package so that it may be positioned in a path of light along which light emitted from the light emitting device moves, and in this case, the wavelength conversion film 400 may be included within the light emitting device package in such a matter than the first layer 410 may be disposed to be closer to the light emitting device than the second layer 420 . thus, light emitted from the light emitting device may sequentially pass through the first layer 410 and the second layer 420 and may be emitted externally, and a degradation in a light extraction efficiency due to an internal reflection of the wavelength conversion film 400 may be prevented. meanwhile, the manufacturing process illustrated in figs. 4 through 7 is merely provided as an example for manufacturing the wavelength conversion film 400 , and the wavelength conversion film 400 may also be manufactured through a process different from that illustrated in figs. 4 through 7 . by way of example, the wavelength conversion film 400 may also be manufactured by attaching the second layer 420 to the first layer 410 containing the wavelength conversion material 410 a and previously fabricated in a film shape. figs. 8 through 10 are views illustrating a method of manufacturing a light emitting device package according to an exemplary embodiment. referring to fig. 8 , the method of manufacturing a light emitting device package may start with disposing at least one or more light emitting devices 520 on a wavelength conversion film 530 . the wavelength conversion film 530 may include a first layer 531 including a wavelength conversion material 531 a and an encapsulant 531 b , and a second layer 533 attached to the first layer 531 , and a manufacturing process of the wavelength conversion film 530 may be conducted according to the exemplary embodiment illustrated in figs. 4 through 7 . each of the light emitting devices 520 may include a support substrate 521 having light-transmissive properties, a first conductivity-type semiconductor layer 522 , an active layer 523 , a second conductivity-type semiconductor layer 524 , and first and second electrodes 525 and 526 . in some exemplary embodiments, the second electrode 526 may be directly disposed on the second conductivity-type semiconductor layer 524 in order to come into ohmic-contact therewith. the first electrode 525 may be electrically connected to the first conductivity-type semiconductor layer 522 through a conductive via or the like provided in the light emitting device 520 . the light emitting device 520 may be disposed on one surface of the first layer 531 containing the wavelength conversion material 531 a . that is, at least a portion of the first layer 531 may be attached to the light emitting device 520 . the first layer 531 and the second layer 533 may be sequentially stacked from the light emitting device 520 . as described above, a thickness t 1 of the first layer 531 may be greater than a thickness t 2 of the second layer 533 , and the second layer 533 may have a refractive index lower than that of the first layer 531 . referring to fig. 9 , a reflective wall 511 may be formed in a space between the one or more light emitting devices 520 . in order to form the reflective wall 511 , a white molding composite material containing a filler may be injected into a space between the light emitting devices 520 disposed on the wavelength conversion film 530 , using a dispenser and the like and then, curing the material. the filler may contain one or more of sio 2 , tio 2 , al 2 o 3 and the like, and may have nano-sized particles contained in the white molding composite material. the white molding composite material may contain a thermosetting resin or silicon resin having high heat resistance properties, or may contain a thermoplastic resin to which a white pigment and a filler, a curing agent, a releasing agent, an antioxidant agent, an adhesion improver or the like may be added. when the reflective wall 511 is formed, the reflective wall 511 is cut along a cutting line c between the light emitting devices 520 to thereby form light emitting device packages 500 . referring to fig. 10 , each of the light emitting device packages 500 may include the wavelength conversion film 530 , the reflective wall 511 , and the light emitting device 520 . unlike the exemplary embodiment of figs. 9 and 10 , after forming the reflective wall 511 , a circuit board may be attached to the first and second electrodes 525 and 526 of the light emitting device 520 and may be cut off together with the reflective wall 511 , such that the light emitting device packages 500 may be formed. referring to fig. 10 , light generated in the active layer 523 of the light emitting device 520 may be emitted directly through the support substrate 521 or may be reflected by the reflective wall 511 and the first and second electrodes 525 and 526 and then be emitted through the support substrate 521 . thus, the wavelength conversion film 530 may be positioned in a path of light along which light emitted from the light emitting device 520 moves. at least a portion of the wavelength conversion material 531 included in the first layer 531 of the wavelength conversion film 530 may be excited by light emitted from the light emitting device 520 and may convert at least a portion of the light emitted from the light emitting device 520 into light having a different wavelength. since the second layer 533 disposed on the first layer 531 may have a refractive index lower than that of the first layer 531 , a quantity of light not emitted externally due to internal reflection within the wavelength conversion film 530 may be decreased and consequently, a light extraction efficiency may be improved. figs. 11 through 16 are views illustrating light emitting devices applicable to the light emitting device package according to various exemplary embodiments. referring to fig. 11 , a light emitting device 10 according to an exemplary embodiment may include a substrate 11 , a first conductivity-type semiconductor layer 12 , an active layer 13 , and a second conductivity-type semiconductor layer 14 . in addition, a first electrode 15 may be formed on the first conductivity-type semiconductor layer 12 and a second electrode 16 may be formed on the second conductivity-type semiconductor layer 14 . an ohmic-contact layer may be further selectively provided between the second electrode 16 and the second conductivity-type semiconductor layer 14 . according to various exemplary embodiments, the substrate 11 may be at least one of an insulating substrate, a conductive substrate and a semiconductor substrate. the substrate 11 may be, for example, sapphire, sic, si, mgal 2 o 4 , mgo, lialo 2 , ligao 2 , or gan. a homogeneous substrate, a gan substrate may be selected as the substrate 11 for epitaxial growth of a gan material, and a heterogeneous substrate may be mainly, sapphire, silicon carbide (sic) or the like. in the case of using the heterogeneous substrate, defects such as dislocations and the like may be caused due to a difference in lattice constants between a substrate material and a film material. in addition, warpage may occur at the time of a temperature variation due to a difference in coefficients of thermal expansion between the substrate material and the film material, and such a warpage phenomenon may cause cracks in the film. in order to address such defects, a buffer layer 11 a may be disposed between the substrate 11 and the first conductivity-type semiconductor layer 12 provided as a gan based layer. in the case of growing the first conductivity-type semiconductor layer 12 containing gan on the heterogeneous substrate, a dislocation density may be increased due to a mismatch in lattice constants between the substrate material and the film material, and cracks and warpage may occur due to the difference in coefficients of thermal expansion. in order to prevent the dislocation and cracks as described above, the buffer layer 11 a may be disposed between the substrate 11 and the first conductivity-type semiconductor layer 12 . the buffer layer 11 a may adjust a degree of warpage of the substrate when an active layer is grown, to reduce a wavelength dispersion of a wafer. the buffer layer 11 a may be made of al x in y ga 1-x-y n (0≦x≦1, 0≦y≦1), in particular, gan, an, algan, ingan, or ingan/aln, and a material such as zrb 2 , hfb 2 , zrn, hfn, tin, or the like, may also be used. also, the buffer layer may be formed by combining a plurality of layers or by gradually changing a composition. a silicon (si) substrate has a coefficient of thermal expansion significantly different from that of gan. thus, in case of growing a gan-based film on the silicon substrate, when a gan film is grown at a high temperature and is subsequently cooled to room temperature, tensile stress is applied to the gan film due to the difference in the coefficients of thermal expansion between the silicon substrate and the gan film, causing cracks. in this case, in order to prevent the occurrence of cracks, a method of growing the gan film such that compressive stress is applied to the gan film while the gan film is being grown is used to compensate for tensile stress. a significant difference in lattice constants between silicon (si) and gan involves a high possibility of the occurrence of defects. in the case of using a silicon substrate, a buffer layer 11 a having a composite structure may be used in order to control stress for restraining warpage as well as controlling a defect. for example, an aln layer may be formed on the substrate 11 in order to form the buffer layer 11 a . in this case, a material not including gallium (ga) may be used in order to prevent a reaction between silicon (si) and gallium (ga). besides aln, a material such as sic, or the like, may also be used. the aln layer may be grown at a temperature ranging from about 400° c. to about 1300° c. by using an aluminum (al) source and a nitrogen (n) source. an algan interlayer may be inserted in the middle of gan between a plurality of aln layers in order to control stress. the first conductivity-type semiconductor layer 12 and the second conductivity-type semiconductor layer 14 may be an n-type impurity doped semiconductor layer and a p-type impurity doped semiconductor layer, respectively but are not limited thereto. the first conductivity-type semiconductor layer 12 and the second conductivity-type semiconductor layer 14 may be a p-type semiconductor layer and an n-type semiconductor layer, respectively. by way of example, the first conductivity-type semiconductor layer 12 and the second conductivity-type semiconductor layer 14 may be formed of a group iii nitride semiconductor, for example, a material having a composition of al x in y ga 1-x-y n (0≦x≦1, 0≦y≦1, 0≦x+y≦1). the materials of the first conductivity-type semiconductor layer 12 and the second conductivity-type semiconductor layer 14 are not limited thereto, and may be an algainp based semiconductor or an algaas based semiconductor. meanwhile, the first and second conductivity-type semiconductor layers 12 and 14 may have a single layer structure but, in some exemplary embodiments, may have a multilayer structure in which respective layers have different compositions, thicknesses or the like. for example, each of the first and second conductivity-type semiconductor layers 12 and 14 may include a carrier injection layer capable of improving injection efficiency of electrons and holes and further, may have a superlattice structure formed in various manners. the first conductivity-type semiconductor layer 12 may further include a current spreading layer in a portion thereof adjacent to the active layer 13 . the current spreading layer may have a structure in which a plurality of al x in y ga 1-x-y n layers having different compositions or different impurity contents are repeatedly stacked or may be partially formed of an insulating material layer. the second conductivity-type semiconductor layer 14 may further include an electron blocking layer in a portion thereof adjacent to the active layer 13 . the electron blocking layer may have a structure in which a plurality of al x in y ga 1-x-y n layers having different compositions are stacked or may have at least one layer configured of al y ga (1-y) n. the second conductivity-type semiconductor layer 14 may have a band gap greater than that of the active layer 13 to prevent electrons from passing over the second conductivity-type semiconductor layer 14 . the first and second conductivity-type semiconductor layers 12 and 14 and the active layer 13 may be formed using an mocvd device. in order to manufacture the first and second conductivity-type semiconductor layers 12 and 14 and the active layer 13 , an organic metal compound gas (for example, trimethylgallium (tmg), trimethyl aluminum (tma) or the like) and a nitrogen-containing gas (ammonia (nh 3 ) or the like) are supplied as a reaction gas, to a reaction container in which the growth substrate 11 is installed, and a temperature of the substrate is maintained at a high temperature of about 900° c. to about 1100° c., such that gallium nitride compound semiconductors may be grown on the substrate while supplying an impurity gas thereto in some exemplary embodiments, to thereby allow the gallium nitride compound semiconductors to be stacked as an undoped layer, an n-type layer, and a p-type layer, on the substrate. an n-type impurity may be si, widely known in the art and a p-type impurity may be zn, cd, be, mg, ca, ba or the like. as the p-type impurity, mg and zn may be mainly used. in addition, the active layer 13 interposed between the first and second conductivity-type semiconductor layers 12 and 14 may have a multiple quantum well (mqw) structure in which quantum well layers and quantum barrier layers are alternately stacked. for example, in the case that the active layer 13 includes a nitride semiconductor, the active layer 13 may have a structure of gan and ingan. depending on exemplary embodiments, the active layer 13 may have a single quantum well (sqw) structure. the first or second electrode 15 or 16 may contain a material such as ag, ni, al, rh, pd, jr, ru, mg, zn, pt, au or the like. the light emitting device 10 illustrated in fig. 11 may have an epi-up structure and accordingly, may be connected to circuit patterns included in a circuit board through a wire or the like within a light emitting device package. hereinafter, in light emitting devices of figs. 12 through 16 , unless otherwise clearly contradicted by context, components of the light emitting devices according to the exemplary embodiments of figs. 12 through 16 may be understood with reference to the description of elements in connection with the exemplary embodiment of fig. 11 as described above. referring to fig. 12 , a light emitting device 20 according to another exemplary embodiment may include a support substrate 21 , first and second conductivity-type semiconductor layers 22 and 24 , an active layer 13 , and first and second electrodes 25 and 26 . the light emitting device 20 according to the exemplary embodiment illustrated in fig. 12 may be attached to a circuit board of a light emitting device package through flip-chip bonding. since light generated in the active layer 23 is emitted upwardly, the support substrate 21 may be formed of a material having light-transmissive properties. in addition, in order to reflect light generated in the active layer 23 and moving in a downward direction, the second electrode 26 may be formed of a material having excellent electrical conductivity and reflectance properties. in an example, the second electrode 26 may be formed of at least one of ag, ni, al, rh, pd, jr, ru, mg, zn, pt, and au. since the light emitting device 20 illustrated in fig. 12 may be attached to a circuit board of a light emitting device package using flip-chip bonding, the light emitting device 20 may be included in the light emitting device packages 100 and 200 as illustrated in the exemplary embodiments of fig. 1a and fig. 2a . that is, the reflective wall 111 or 211 may be attached to the side surface of the light emitting device 120 , and the wavelength conversion film 130 or 230 may be attached to an upper surface of the support substrate 21 . referring to fig. 13 , a light emitting device 30 according to another exemplary embodiment is illustrated. the light emitting device 30 according to the exemplary embodiment illustrated in fig. 13 may include a first conductivity-type semiconductor layer 32 , an active layer 33 , and a second conductivity-type semiconductor layer 34 , a first electrode 35 attached to the first conductivity-type semiconductor layer 32 , and a second electrode 36 attached to the second conductivity-type semiconductor layer 34 , and the like. a conductive substrate 31 may be disposed on a lower surface of the second electrode 36 and may be directly mounted on a circuit board or the like, and provided to configure a light emitting device package. within the light emitting device package, the conductive substrate 31 may be directly mounted on the circuit board, and the first electrode 35 may be electrically connected to circuit patterns of the circuit board through a wire or the like. in a similar manner to the case of the semiconductor light emitting devices 10 and 20 , the first conductivity-type semiconductor layer 32 and the second conductivity-type semiconductor layer 34 may include an n-type nitride semiconductor and a p-type nitride semiconductor, respectively. meanwhile, the active layer 33 interposed between the first and second conductivity-type semiconductor layers 32 and 34 may have a multiple quantum well (mqw) structure in which nitride semiconductor layers having different compositions are alternately stacked and may selectively have a single quantum well (sqw) structure. the first electrode 35 may be disposed on an upper surface of the first conductivity-type semiconductor layer 32 and the second electrode 36 may be disposed on a lower surface of the second conductivity-type semiconductor layer 34 . light generated due to the recombination of electrons and holes in the active layer 33 of the light emitting device 30 shown in fig. 13 may be emitted to an upper surface of the first conductivity-type semiconductor layer 32 on which the first electrode 35 is disposed. thus, in order to reflect light generated in the active layer 33 in a direction toward the upper surface of the first conductivity-type semiconductor layer 32 , the second electrode 36 may contain at least one of ag, al, ni, cr, cu, au, pd, pt, sn, ti, w, rh, jr, ru, mg, and zn, or an alloy material containing these materials. referring to fig. 14 , a light emitting device 40 according to an exemplary embodiment may include a first conductivity-type semiconductor layer 42 and a second conductivity-type semiconductor layer 44 , an active layer 43 interposed therebetween, and first and second electrodes 45 and 46 connected to the first and second conductivity-type semiconductor layers 42 and 44 , respectively. in the exemplary embodiment, the first and second electrodes 45 and 46 may be disposed on opposite surfaces of the first and second conductivity-type semiconductor layers 42 and 44 , respectively, and the active layer 43 interposed between the first and second electrodes 45 and 46 . a support substrate 41 may be attached to the second electrode 46 through a bonding layer 41 a and may support the light emitting device 40 . the light emitting device 40 according to the exemplary embodiment may further include a connecting electrode 47 as an electrode element in association with the second electrode 46 . the connecting electrode 47 may be connected to the second electrode 46 through a through hole h formed by at least partially removing the first and second conductive-type semiconductor layers 42 and 44 and the active layer 43 . at least a partial region of the second electrode 46 may be exposed through the through hole h and in the exposed region, the second electrode 46 and the connecting electrode 47 may be connected to each other. the connecting electrode 47 may be formed along a sidewall of the through hole h, and an insulating layer 47 a may be provided between the connecting electrode 47 and the sidewall of the through hole h in order to prevent electrical connections between the connecting electrode 47 and the active layer 43 and the first conductivity-type semiconductor layer 42 . such an electrode structure may be further efficiently applied to a form in which the first and second conductivity-type semiconductor layers 42 and 44 are n-type and p-type nitride semiconductor layers, respectively. since the p-type nitride semiconductor layer has a degree of contact resistance greater than that of the n-type nitride semiconductor layer, it may be difficult to obtain ohmic-contact. however, in the exemplary embodiment illustrated in fig. 14 , since the second electrode 46 is disposed over the entire surface of the support substrate 41 , a contact area between the second conductivity-type semiconductor layer 44 and the second electrode 46 may be sufficiently secured, whereby ohmic-contact between the second electrode 46 and the p-type nitride semiconductor layer may be obtained. meanwhile, the light emitting device 40 according to the exemplary embodiment illustrated in fig. 14 may have a flip-chip structure in which light is emitted in a direction toward the support substrate 41 . that is, the first electrode 45 and the connecting electrode 47 may be electrically connected to circuit patterns 49 a of a circuit board 49 through solder bumps 48 . thus, the first electrode 45 may contain an electrode material having a high degree of reflectance as well as ohmic-contact characteristics. the second electrode 46 and the support substrate 41 may have high light-transmissive properties. for example, the first electrode 45 may contain a material such as ag, ni, al, rh, pd, jr, ru, mg, zn, pt, au or the like. the second electrode 46 may be formed of a light-transmissive metal such as ni/au or may be formed of a transparent conductive oxide or nitride such as ito. the support substrate 41 may be a glass substrate or a substrate formed of a light-transmissive polymer resin. the connecting electrode 47 may be electrically insulated from the first conductivity-type semiconductor layer 42 and the active layer 43 by the insulating layer 47 a . as illustrated in fig. 14 , the insulating layer 47 a may be formed along the sidewall of the through hole h. in addition, the insulating layer 47 a may be formed on side surfaces of the first and second conductivity-type semiconductor layers 42 and 44 and the active layer 43 and may be provided as a passivation layer for the light emitting device 10 . the insulating layer 47 a may contain a silicon oxide or a silicon nitride. then, referring to fig. 15 , a light emitting device 50 according to another exemplary embodiment is illustrated. the light emitting device 50 may include a first conductivity-type semiconductor layer 52 , an active layer 53 , and a second conductivity-type semiconductor layer 54 sequentially stacked on one surface of a substrate 51 , and first and second electrodes 55 and 56 . in addition, the light emitting device 50 may include an insulating portion 57 . the first and second electrodes 55 and 56 may include contact electrodes 55 a and 56 a and connecting electrodes 55 b and 56 b , and partial regions of the contact electrodes 55 a and 56 a exposed by the insulating portion 57 may be connected to the connecting electrodes 55 b and 56 b. the first contact electrode 55 a may be provided as a conductive via penetrating through the second conductivity-type semiconductor layer 54 and the active layer 53 to be connected the first conductivity-type semiconductor layer 52 . the second contact electrode 56 a may be connected to the second conductivity-type semiconductor layer 54 . a plurality of conductive vias may be provided in a single region of the light emitting device. a conductive ohmic material may be deposited on the first and second conductivity-type semiconductor layers 52 and 54 to form first and second contact electrodes 55 a and 56 a . the first and second contact electrodes 55 a and 56 a may contain at least one of ag, al, ni, cr, cu, au, pd, pt, sn, ti, w, rh, ir, ru, mg, and zn, or an alloy material containing these materials. in addition, the second contact electrode 56 a may serve to reflect light generated in the active layer 53 and emitted downwardly of the light emitting device 50 . the insulating portion 57 may have open regions through which at least portions of the first and second contact electrodes 55 a and 56 a are exposed, and the first and second connecting electrodes 55 b and 56 b may be connected to the first and second contact electrodes 55 a and 56 a , respectively. the insulating portion 57 may be deposited at a thickness of about 0.01 μm to about 3 μm at a temperature of about 500° c. or lower through a sio 2 and/or sin cvd process. the first and second electrodes 55 and 56 may be mounted in a flip-chip scheme on a light emitting device package. the first and second electrodes 55 and 56 may be electrically separated from each other by the insulating portion 57 . although the insulating portion 57 may be formed of any material as long as the material has electrical insulating properties, the insulating portion 57 may be preferably, formed of a material having a low light absorption rate in order to prevent a deterioration in light extraction efficiency. for example, a silicon oxide or a silicon nitride such as sio 2 , sio x n y , si x n y or the like may be used. in some exemplary embodiments, a light reflecting structure may be formed by dispersing light reflective fillers in a light-transmissive material. the substrate 51 may have first and second surfaces opposed to each other. an unevenness structure may be formed on at least one of the first and second surfaces. the unevenness structure formed on one surface of the substrate 51 may be formed by etching a portion of the substrate 51 and may be formed of the same material as that of the substrate 51 , or may be configured of a heteromaterial different from that of the substrate 51 . for example, an unevenness structure may be formed on an interface between the substrate 51 and the first conductivity-type semiconductor layer 52 , such that a path of light emitted from the active layer 53 may be variously formed. thus, a ratio at which light is absorbed in the interior of a semiconductor layer may be reduced and a light scattering ratio may be increased to thereby enhance light extraction efficiency. in addition, a buffer layer may be provided between the first substrate 51 and the first conductivity-type semiconductor layer 52 . referring to fig. 16 , a light emitting device 60 according to another exemplary embodiment may be a light emitting device 60 having a light emitting nanostructure. the light emitting device 60 may include a base layer 62 ′ containing a first conductivity-type semiconductor material, a mask layer 67 provided on the base layer 62 ′ and providing a plurality of openings, and nanocores 62 formed in the openings of the mask layer 67 . on the nanocores 62 , active layers 63 and second conductivity-type semiconductor layers 64 may be provided. the nanocores 62 , the active layers 63 and the second conductivity-type semiconductor layers 64 may provide the light emitting nanostructure. a second contact electrode 66 a may be prepared on the second conductivity-type semiconductor layers 64 , and a second connecting electrode 66 b may be prepared on one surface of the second contact electrode 66 a . the second contact electrode 66 a and the second connecting electrode 66 b may be provided as a second electrode 66 . a support substrate 61 may be attached to one surface of the second electrode 66 and may be a conductive substrate or an insulating substrate. in the case that the support substrate 61 has conductivity, the support substrate 61 may be directly mounted on a circuit board of a light emitting device package. a first electrode 65 may be provided on the base layer 62 ′ containing a first conductivity-type semiconductor material. the first electrode 65 may be connected to circuit patterns included in the circuit board of the light emitting device package through a wire or the like. figs. 17 and 18 are views illustrating examples of backlight units in which the light emitting device package according to an exemplary embodiment may be employed. referring to fig. 17 , a backlight unit 1000 may include a substrate 1002 , a light source 1001 mounted on the substrate 1002 , and at least one optical sheet 1003 disposed thereabove. the optical sheet 1003 may include a diffusion sheet, a prism sheet and the like, and the light source 1001 may include the light emitting device package as described above. the light source 1001 in the backlight unit 1000 of fig. 17 emits light toward a liquid crystal display (lcd) device disposed thereabove. on the other hand, a light source 2001 mounted on a substrate 2002 in a backlight unit 2000 according to another embodiment illustrated in fig. 18 emits light laterally, and the emitted light may be incident onto a light guide plate 2003 and may be converted into the form of a surface light source. the light having passed through the light guide plate 2003 may be emitted upwardly and a reflective layer 2004 may be formed below a bottom surface of the light guide plate 2003 in order to improve light extraction efficiency. fig. 19 is a view illustrating an example of a lighting device in which the light emitting device package according to an exemplary embodiment may be employed. a lighting device 3000 illustrated in fig. 19 is exemplified as a bulb-type lamp, and may include a light emitting module 3003 , a driving unit 3008 , an external connector unit 3010 and the like. in addition, exterior structures such as an external housing 3006 , an internal housing 3009 , a cover unit 3007 and the like may be further included in the lighting device 3000 . the light emitting module 3003 may include a light source 3001 that may be the aforementioned semiconductor light emitting device or a package including the semiconductor light emitting device and a circuit board 3002 having the light source 3001 mounted thereon. the light source 3001 may include the light emitting device package as described above. the exemplary embodiment illustrates a case in which a single light source 3001 is mounted on the circuit board 3002 ; however, in some exemplary embodiments, a plurality of light sources may be mounted thereon. the external housing 3006 may serve as a heat radiating part, and include a heat sink plate 3004 in direct contact with the light emitting module 3003 to improve the dissipation of heat and heat radiating fins 3005 covering a lateral surface of the lighting device 3000 . the cover unit 3007 may be disposed above the light emitting module 3003 and may have a convex lens shape. the driving unit 3008 may be disposed inside the internal housing 3009 and may be connected to the external connector unit 3010 , such as a socket structure, to receive power from an external power source. in addition, the driving unit 3008 may convert the received power into a current source appropriate for driving the light emitting source 3001 of the light emitting module 3003 and supply the converted current source thereto. for example, the driving unit 3008 may be configured of an ac-dc converter, a rectifying circuit part, or the like. fig. 20 is a view illustrating an example of a headlamp in which the light emitting device package according to an exemplary embodiment may be employed. fig. 20 illustrates an example of applying the semiconductor light emitting device according to an exemplary embodiment to a headlamp. referring to fig. 20 , a headlamp 4000 used as a vehicle lighting element or the like may include a light source 4001 , a reflective unit 4005 and a lens cover unit 4004 , and the lens cover unit 4004 may include a hollow guide part 4003 and a lens 4002 . the light source 4001 may include the aforementioned semiconductor light emitting device or a package including the semiconductor light emitting device. the headlamp 4000 may further include a heat radiating unit 4012 dissipating heat generated by the light source 4001 outwardly. the heat radiating unit 4012 may include a heat sink 4010 and a cooling fan 4011 in order to effectively dissipate heat. in addition, the headlamp 4000 may further include a housing 4009 allowing the heat radiating unit 4012 and the reflective unit 4005 to be fixed thereto and supported thereby. the housing 4009 may include a central hole 4008 to which the heat radiating unit 4012 is coupled to be mounted therein, the central hole 4008 being formed in one surface of the housing 4009 . the other surface of the housing 4009 integrally connected to and bent in a direction perpendicular to the one surface of the housing 4009 may be provided with a forward hole 4007 such that the reflective unit 4005 may be disposed above the light source 4001 . accordingly, a forward side may be opened by the reflective unit 4005 and the reflective unit 4005 may be fixed to the housing 4009 such that the opened forward side corresponds to the forward hole 4007 , whereby light reflected by the reflective unit 4005 may pass through the forward hole 4007 to thereby be emitted outwardly. as set forth above, according to exemplary embodiments of the present inventive concept, a wavelength conversion film included in a light emitting device package may have a first layer and a second layer sequentially stacked and in this case, the first layer may be disposed to be adjacent to a light emitting device and a surface of the second layer may be partially exposed to air. a refractive index of the second layer may be lower than a refractive index of the first layer and may be higher than a refractive index of air. thus, a quantity of light not emitted externally due to internal reflection in a boundary surface between the wavelength conversion film and air may be decreased to improve light extraction efficiency, whereby luminance in the light emitting device package may be improved. while exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations could be made without departing from the scope of the inventive concept as defined by the appended claims.
173-034-807-638-881	US	[ "US" ]	F02C7/12,F23R3/42	2009-05-29T00:00:00	2009	[ "F02", "F23" ]	method and flow sleeve profile reduction to extend combustor liner life	a gas turbine includes a combustor liner having at least one hole formed therein. the gas turbine also includes a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum. the flow sleeve has an axial profile that is reduced in cross section dimension at a predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location. the reduction at the cross section dimension in the flow sleeve increases a velocity of the airflow in the plenum at the predetermined axial location, the increased velocity airflow increasing transfer of heat away from the liner.	1 . a gas turbine, comprising: a combustor liner having at least one hole formed therein; and a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum, the flow sleeve having an axial profile that is reduced in cross section dimension at a predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location, wherein the reduction at the cross section dimension in the flow sleeve increases a velocity of the airflow in the plenum at the predetermined axial location, thereby increasing transfer of heat away from the liner. 2 . the gas turbine of claim 1 , the predetermined axial location of the flow sleeve comprising a relatively hot temperature location of the liner. 3 . the gas turbine of claim 2 , the relatively hot temperature location of the liner being located at a head end of the liner. 4 . the gas turbine of claim 1 , the liner comprising a liner for a diffusion combustor. 5 . the gas turbine of claim 1 , the liner comprising a liner for a dry low nitrous oxides combustor. 6 . the gas turbine of claim 1 , the reduction at the cross section dimension at the predetermined axial location of the flow sleeve being with respect to a remaining portion of the flow sleeve. 7 . the gas turbine of claim 1 , the at least one hole in the liner being located at the predetermined axial location of the flow sleeve. 8 . the gas turbine of claim 7 , a portion of the airflow passing through the at least one hole in the liner and into the liner being hotter in temperature than a temperature of the airflow upstream of the predetermined axial location. 9 . a gas turbine, comprising: a combustor liner having at least one hole formed therein; a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum; and a flow sleeve insert disposed next to an inner surface of the flow sleeve at a predetermined axial location of the flow sleeve, the flow sleeve insert having an axial profile that is reduced in cross section dimension at the predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location, wherein the reduction at the cross section dimension in the flow sleeve insert increases a velocity of the airflow in the plenum at the predetermined axial location, thereby increasing transfer of heat away from the liner. 10 . the gas turbine of claim 9 , the flow sleeve insert being attached to an inner surface of the flow sleeve. 11 . the gas turbine of claim 9 , the flow sleeve insert being attached to an inner surface of the flow sleeve by one or more mounts. 12 . the gas turbine of claim 11 , the one or more mounts connected to the inner surface of the flow sleeve by welds. 13 . the gas turbine of claim 11 , the one or more mounts connected to an outer surface of the flow sleeve insert by welds, rivets, brazements, or bolts. 14 . the gas turbine of claim 9 , the liner comprising a liner for a diffusion combustor or a dry low nitrous oxides combustor. 15 . the gas turbine of claim 9 , the reduction at the cross section dimension at the predetermined axial location of the flow sleeve being with respect to a remaining portion of the flow sleeve. 16 . a method for cooling a combustor liner, comprising: providing a combustor liner with at least one hole formed therein; and providing a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum, the flow sleeve having an axial profile that is reduced in cross section dimension at a predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location, wherein the reduction at the cross section dimension in the flow sleeve increases a velocity of the airflow in the plenum at the predetermined axial location, thereby increasing transfer of heat away from the liner. 17 . the method of claim 16 , wherein the liner is provided as part of a diffusion combustor. 18 . the method of claim 16 , wherein the liner is provided as part of a dry low nitrous oxides combustor. 19 . the method of claim 16 , wherein the predetermined axial location of the flow sleeve is provided at a relatively hot temperature location of the liner. 20 . the method of claim 16 , wherein the at least one hole in the liner being provided at the predetermined axial location of the flow sleeve, a portion of the airflow passing through the at least one hole in the liner and into the liner being hotter in temperature than a temperature of the airflow upstream of the predetermined axial location.	background of the invention the subject matter disclosed herein relates to gas turbines and, in particular, to the profile of a flow sleeve that extends the useful life of a liner of a gas turbine combustor. in a gas turbine that includes a diffusion type (i.e., non-premixed) combustor, relatively high head end temperatures may be experienced on the inner surface of, e.g., the film-cooled, multi-nozzle quiet combustor (“mnqc”) liner (for example, near the row # 1 mixing holes). in general, the “head end” of the combustor typically refers to the portion or area of the combustor (usually at one end thereof) where the fuel and air are premixed together for subsequent combustion further along within the combustor. the relatively high head end temperatures may be increased even further when the combustor burns certain fuels, such as syn gas fuels (e.g., lhv, co and h2 in fuel composition, flowing through primary and secondary fuel passageways). to mitigate this issue, performance and/or operability compromises may be made, such as requiring additional diluent, or reducing the combustor firing temperature, in an attempt to reduce the liner temperatures and thereby satisfy durability requirements of the combustor design. for combustors of the dry low nitrous oxides (“nox”-“dln”) type, local liner thermal maximums or gradients are often caused by non-uniform flame structure. these dln combustors often run with different fuel splits going to various nozzles, which result in non-uniform thermal loading of the liner. for certain types of dln combustors, there is typically no available air for use in film cooling (i.e., the liner has no holes therein to pass compressed air into the liner for film cooling of the inner surface of the liner), in contrast to diffusion mnqc liners. as a result, hot side thermal barrier coatings and backside heat transfer coefficients may be utilized to attempt to enhance the ability of the dln combustor liner to meet the desired useful life requirements of the combustor. with respect to general combustor liner backside cooling, film cooling typically has been used on mnqc, diffusion liners, while turbulated liners have been used with the non-film cooling types of dln combustors. also, 2-cool designs have been implemented on liners to improve cooling in the area of the aft end hula seal. further, it is known to utilize a flow sleeve, which typically surrounds at least a portion of the combustor liner, thereby forming an annular passage or plenum therebetween through which cooling air, e.g., from the compressor, may flow to cool at least a portion of the liner through the outside surface of the liner. that is, the liner and flow sleeve may be arranged concentrically with respect to one another, with the liner on the inside and the flow sleeve on the outside. flow sleeves often have several rows of cooling holes, with or without thimbles, which typically direct cooling air onto the aft end of the liner. the compressed air may also be used for mixing with the fuel from fuel nozzles in the combustor. that is, the compressed air flowing from the gas turbine compressor into a combustion zone of the combustor typically flows through the annulus or plenum between the liner and flow sleeve and also flows through holes in the liner into the combustion zone. the compressed air typically flows in one direction between the liner and flow sleeve, and reverses direction as it enters the liner, and flows as a hot gas in an opposite direction out of the liner and combustor and into the turbine portion of the gas turbine. brief description of the invention according to an aspect of the invention, a gas turbine includes a combustor liner having at least one hole formed therein. the gas turbine also includes a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum. the flow sleeve has an axial profile that is reduced in cross section dimension at a predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location. the reduction at the cross section dimension in the flow sleeve at the predetermined axial location of the flow sleeve increases a velocity of the airflow in the plenum at the predetermined axial location, thereby increasing transfer of heat away from the liner. according to another aspect of the invention, a gas turbine includes a combustor liner having at least one hole formed therein, and a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum. the gas turbine also includes a flow sleeve insert disposed next to an inner surface of the flow sleeve at a predetermined axial location of the flow sleeve, the flow sleeve insert having an axial profile that is reduced in cross section dimension at the predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location. the reduction at the cross section dimension in the flow sleeve insert increases a velocity of the airflow in the plenum at the predetermined axial location, thereby increasing transfer of heat away from the liner. according to yet another aspect of the invention, a method for cooling a combustor liner includes providing a combustor liner with at least one hole formed therein. the method also includes providing a flow sleeve that at least partially surrounds the liner thereby forming a plenum between the flow sleeve and the liner, the plenum having an airflow therethrough, a portion of the airflow passing through the at least one hole in the liner and into the liner thereby reducing the mass of the airflow in the plenum. the flow sleeve has an axial profile that is reduced in cross section dimension at a predetermined axial location of the flow sleeve, thereby reducing a width of the plenum at the predetermined axial location. the reduction at the cross section dimension in the flow sleeve increases a velocity of the airflow in the plenum at the predetermined axial location, thereby increasing transfer of heat away from the liner. these and other advantages and features will become more apparent from the following description taken in conjunction with the drawings. brief description of the drawing the subject matter, which is regarded as the invention, is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. the foregoing and other features and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which: fig. 1 is a perspective view of a flow sleeve according to an embodiment of the invention; fig. 2 is a cross-section view of the flow sleeve of fig. 1 ; fig. 3 is a cross-section view of the flow sleeve of fig. 1 in relation to a liner of a combustor according to an embodiment of the invention; fig. 4 is an end view of the flow sleeve of fig. 1 and the combustor liner of fig. 3 ; fig. 5 is a perspective view of a flow sleeve with a retrofit insert added to the flow sleeve in accordance with an another embodiment of the invention; fig. 6 is a cross-section view of the flow sleeve and retrofit insert of fig. 5 ; and fig. 7 is a perspective view, partially cutaway, of the flow sleeve and retrofit insert of fig. 5 . the detailed description explains embodiments of the invention, together with advantages and features, by way of example with reference to the drawings. detailed description of the invention in figs. 1-3 , a flow sleeve 100 according to an embodiment of the invention is generally circular in cross section, although other shapes are possible. the length dimension of the flow sleeve 100 in figs. 1-3 (i.e., left to right in figs. 1-3 ) may be considered the axial dimension of the flow sleeve 100 , while the “profile” of the flow sleeve 100 may be considered the shape of the flow sleeve 100 as seen by viewing an outer surface 104 (and, thus, an inner surface) of the flow sleeve 100 taken along this axial dimension. the flow sleeve 100 may be part of a diffusion or dln type (or other type) of combustor of a gas turbine that utilizes film cooling. as such, the flow sleeve 100 may at least partially surround or be concentric with at least a portion of a liner 108 ( fig. 3 ) that is also part of the combustor. as mentioned, the liner 108 is typically exposed to relatively high temperatures resulting from combustion of the air and fuel mixture within the liner 108 . thus, an inside surface 112 of the liner 108 may be at a relatively high temperature at certain one or more locations along the liner 108 . typically these location(s) are where the flame is anchored and the inside surface 112 of the liner 108 is at the relatively hottest temperature within all of the liner (i.e., the combustion primary zone). a left end 116 of the flow sleeve 100 (as viewed in figs. 1-3 ) may be considered to be the “head end” of both the flow sleeve 100 and the liner 108 . it is this head end 116 of the liner 108 where the temperature resulting from combustion of the fuel/air mixture may typically be locally the hottest with respect to the liner 108 . as such, the head end 116 of the liner 108 may be the location of the liner that is life limiting for the overall liner 108 . according to an embodiment of the invention, the flow sleeve 100 has an axial profile that is reduced in its cross section dimension for at least one portion of the flow sleeve 100 at a predetermined axial location 120 of the flow sleeve 100 for a certain length thereof and with respect to the remaining portion of the flow sleeve 100 . the length of this reduced cross section dimension portion 120 of the flow sleeve 100 may be sufficient to adequately cool the length of the liner 108 that is the hottest. also, the location of this reduced cross section portion 120 may be located anywhere deemed appropriate for reducing the temperature of the liner 108 —typically, at its hottest location. further, there may be more than one reduced cross section portion 120 , if desired, depending upon the temperature characteristics of the liner 108 (i.e. more than one “hot spot” location of the liner 108 to be cooled). each reduction 120 at the cross section dimension may be uniform in dimension throughout the entire circumference of the reduction, or, in the alternative, the reduction 120 may be non-uniform in dimension circumferentially. also, as seen in figs. 1-3 , after the reduced cross section portion 120 , the flow sleeve 100 may increase in cross section along the profile of the flow sleeve as it moves down the axial length of the flow sleeve 100 . as seen in fig. 3 , the dimensional reduction at the predetermined axial location 120 of the flow sleeve 100 decreases the amount of the clearance (or the width of the annulus or plenum) 124 between an inside surface 128 of the flow sleeve 100 and an outside surface (“cold side”) 132 of the liner 108 at this location 120 (as compared to the width of the remaining portion of the annulus or plenum 124 ). this “restricted” annular area 120 has the effect of increasing the velocity of the “bulk” airflow located in the annulus 124 between the flow sleeve 100 and the liner 108 at the predetermined axial location 120 of the cross section reduction of the flow sleeve 100 . this increased airflow increases heat transfer away from the liner 108 (i.e., increases “backside cooling” or increases the heat transfer coefficient on the outer surface 132 or cold side 132 of the liner 108 ), thus providing for adequate localized cooling of the liner 108 at the relatively hottest portion thereof. this has the added benefit of increasing the durability of the liner 108 . thus, as seen from the foregoing, the use of the dimensional reduction 120 in the flow sleeve 100 allows for the axial variation of the flow sleeve cooling profile. in a typical film cooled diffusion type combustor or a film cooled dln type combustor, the liner 108 has a number of mixing holes 136 formed therein, as seen in fig. 3 . the mixing holes 136 can be circular or any other shape and can be located in the liner 108 at locations that are typical in the art. these mixing holes allow for a portion of the compressed airflow to pass through these holes 136 and enter the liner 108 where the compressed air is used to break up the cohesive fuel jets introduced with the fuel nozzles. the compressed airflow mixes with the fuel and is used in the combustion process of the fuel/air mixture entering the head end of the combustor via the fuel nozzles. there are also multiple rows of film cooling holes 139 . these circumferential rings of holes allow for a portion of the compressed airflow to pass through these holes 139 and enter the liner 108 where the compressed air is used to film cool the inside surface 112 of the liner 108 and is also later mixed with fuel and used in the combustion process of the fuel/air mixture entering the head end of the combustor via the fuel nozzles. additional locations of compressed air entry into the liner are the spark plug (sp)/flame detector (fd) hole(s) 137 , the crossfire tube hole(s) 138 , and the dilution hole(s). thus, as the compressed airflow moves through the plenum 124 between the flow sleeve 100 and the liner 108 , part of the mass of that airflow is “lost” to inside the liner 108 and, therefore, is not available for cooling of the outside surface 132 of the liner 108 . as seen in fig. 3 , the mixing holes 136 are located in the restricted annular area 120 of the flow sleeve 100 . this loss of the airflow to the inside of the liner 108 is typically not a linear loss, given the different features of the liner 108 (e.g., cooling holes, dilution holes, cross fire tubes, etc.). thus, as can be seen from the foregoing, embodiments of the invention provides for an apparatus and a method for increasing the velocity of the airflow through a restricted flow area while at the same time experiencing a loss of mass of the airflow to the inside of the liner 108 . in embodiments of the invention, the axial length of the liner 108 is typically unchanged with or without the inclusion of the flow sleeve 100 with the restricted flow area 120 . further, as the airflow passes through the restricted area 120 within the plenum 124 , the airflow will become relatively hotter in temperature, as the airflow will pick up additional heat from the liner 108 by way of convective heat transfer from the liner 108 and due to the increased velocity of the airflow in the restricted area 120 of the plenum 124 and the increased heat transfer coefficient resulting from the restricted area 120 . this cooling effectiveness occurs even though there is occurring a loss of the mass of the airflow through the mixing holes 136 and into the liner 108 . this portion of the mass airflow is relatively hotter in temperature as compared to where the airflow entered the head end of the liner 108 . then, as the relatively hotter airflow passes through the mixing holes 136 and into the liner, the relatively hotter airflow participates in the combustion process. also shown cross-hatched in fig. 3 is one of several (e.g., six) guide vanes 144 that may be located in the plenum 124 between the flow sleeve 100 and the liner 108 . each guide vane 144 may have a length that spans nearly the entire length of the plenum 124 . the guide vanes may be equally spaced around the circumference of the flow sleeve 100 (for example, between each fuel nozzle), thereby establishing a corresponding number of circumferential sections of the plenum 124 . the guide vanes 144 may be used to address any localized thermal hotspots or gradients that may otherwise limit the useful life of the liner 108 . this is achieved through the use of the guide vanes 144 channeling the airflow down the various sections of the plenum 124 effectively created by the placement of the guide vanes 144 . thus, the guide vanes 144 allow for the circumferential variation of the flow sleeve cooling profile. in fig. 4 are three liner stops 150 located on the liner 108 . the liner stops 150 control the radial (clocking) and axial (travel) of the liner 108 within the flow sleeve/combustor assembly embodiments of the flow sleeve 100 of the invention provide a solution to the relatively high temperatures typically located at the head end 116 of a film cooled, mnqc combustor liner 108 . the solution is in the form of a flow sleeve 100 having one or more diametrical reductions in one or more certain areas 120 along the axial profile of the flow sleeve 100 . this results in annular restrictions within the plenum or annulus 124 , thereby increasing the velocity of the airflow between the combustor liner 108 and the flow sleeve 100 in these reduced diametrical or cross section areas 120 . this also increases the heat transfer coefficient on the outer surface or cold side 132 of the liner 108 . the local annulus reduction increases the airflow velocity over the backside 132 of the combustor liner 108 , thereby increasing the forced convection from that surface 132 . this results in lower backside liner temperatures for the same operating and boundary conditions. this is of interest in diffusion combustors as they may experience relatively high temperatures in the associated film cooled, mnqc liners at any point or location where air enters and mixes with fuel; for example, the row # 1 mixing holes. this is also of interest in dln combustor liners employing film cooling where relatively high local temperatures and gradients result from the various fuel splits being run in the combustor. a local increase in the high temperature coefficients at the various point of interest may lower temperatures and smooth out thermal gradients. in figs. 5-7 , a flow sleeve retrofit insert 500 is attached to the inner surface 504 of an existing flow sleeve 508 (i.e., one already in service in the field). as in the embodiment of the flow sleeve 100 of figs. 1-4 , the use of the retrofit insert 500 has the similar effect of reducing the amount of clearance or distance (i.e., creating a “restriction”) between an inner surface 504 of the flow sleeve 508 and an outer surface of the liner, similar to the liner shown in fig. 3 , thereby increasing airflow velocity near the flow sleeve 508 at the predetermined axial location of the cross section reduction, which increases heat transfer away from the liner. as shown, the retrofit insert 500 (which may comprise a single piece of suitable material) has several cutouts to accommodate the liner mounts 512 and the crossfire tube retainer ramps 516 that are located on the inner surface of the flow sleeve 508 . also, fig, 7 shows one method for mounting the retrofit insert 500 to the inner surface 504 of the flow sleeve 508 using a number of spaced apart mounts 520 . each mount 520 may be welded, riveted, brazed, bolted or attached by other suitable means to both the inner surface 504 of the flow sleeve 508 and an outer surface 524 of the retrofit insert 500 . also, other devices besides mounts 520 may be utilized to attach the retrofit insert 500 to the flow sleeve 508 . adding the retrofit insert 500 to an existing flow sleeve 508 at the predetermined axial location of the flow sleeve 508 has the same effects as the embodiments of the flow sleeve 100 described hereinbefore and illustrated in figs. 1-4 . also, similar to the embodiment of figs. 1-4 , the one or more reductions in the retrofit insert 500 at the cross section dimension may be uniform throughout the entire circumference of the reduction, or, in the alternative, the reduction may be non-uniform circumferentially. embodiments of the invention address the undesirable relatively high temperatures typically located at the head end of the combustor liner and the resulting liner durability challenges (e.g., cracking) experienced with mnqc diffusion combustors in, for example, integrated gasification combined cycle (“igcc”) applications. also, embodiments of the invention may be utilized in new flow sleeve designs or may be retrofitted to flow sleeve designs already in the field, for example, those with front mounted flow sleeves. in addition, embodiments of the invention may be used to address local hot spots or streaks experienced with dln combustor liner applications (i.e., provide local liner temperature reductions, thereby improving durability of the dln combustor liner). for example, embodiments of the invention can achieve relatively significant temperature reductions on the liner assembly at the head end near the row # 1 mixing holes. this can be achieved without undesired effects such as impact to combustor pressure drop or undesirable combustor dynamics. also, there is no compromise to the operability or performance of the combustor and turbine in achieving the results obtained with the flow sleeve of embodiments of the invention. while the invention has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. additionally, while various embodiments of the invention have been described, it is to be understood that aspects of the invention may include only some of the described embodiments. accordingly, the invention is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.
173-468-795-831-577	EP	[ "CN", "JP", "WO", "US", "CA", "AU", "BR", "EP", "UY" ]	C07D401/14,A01N43/56,C07D401/02,C07D403/02,C07D403/14,C07D409/02,C07D409/14,C07D413/02,C07D413/14,C07D417/02,C07D417/14,C07D231/52,A01C1/08,A01M1/20,A01N43/80,A01N53/14,A01P3/00,A01P5/00,A01P7/00,C07D413/04,C07D403/04,A01N43/48	2017-06-19T00:00:00	2017	[ "C07", "A01" ]	pesticidally active pyrazole derivatives	compounds of formula (i), as defined herein, to processes for preparing them, to pesticidal, in particular insecticidal, acaricidal, molluscicidal and nematicidal compositions comprising them and to methods of using them to combat and control pests such as insect, acarine, mollusc and nematode pests.	1. a compound of formula (i), wherein z is selected from ci-c4-haloalkyl and f; t is selected from wherein * indicates the bond to the pyrazole group; r 5 and r 6 are independently selected from h, methyl and trifluoromethoxy; a is selected from c-h and n; r 2 is selected from h, methyl, trifluoromethyl and halogen; r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, formyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)- alkyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)-alkyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; q is selected from h, hydroxy, hc(=0)-, ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and λ/,/v-di (ci- c6-alkyl)amino, wherein each of ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyl- ci c3-alkyl, cic3-alkyl-c3-c7 cycloalkyl, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and n,n-d\ (ci- c6-alkyl)amino is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, c1 c6- alkylcarbamoyl, c3-c6-cycloalkylcarbamoyl and phenyl; wherein the compound of formula (i) is not [5-[4-[4-chloro-3-[(1-cyanocyclopropyl)carbamoyl]phenyl]pyrazol-1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3-yl] trifluoromethanesulfonate, or [5-[4-[4-chloro-3-(cyanocyclopropylcarbamoyl)phenyl]pyrazol-1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3-yl] 1 ,1 ,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate, or [5-[4-[4-chloro-3-(cyclopropylcarbamoyl)phenyl]pyrazol-1-yl]-1-methyl-4-(trifluoromethyl)pyrazol-3-yl] 1 , 1 ,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate; or an agrochemically acceptable salt or n-oxide thereof. 2. a compound or salt according to claim 1 of formula (i) wherein selected from ci-c4-haloalkyl and f; t is selected from wherein * indicates the bond to the pyrazole group; r 5 and r 6 are independently selected from h, methyl and trifluoromethoxy; a is selected from c-h and n; r 2 is selected from h, methyl, trifluoromethyl and halogen; r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, formyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)- alkyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)-alkyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; q is selected from h, hydroxy, hc(=0)-, ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and n,n-d\ (ci- c6-alkyl)amino, wherein each of ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and λ/,/v-di (ci- c6-alkyl)amino is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, ci-ce- alkylcarbamoyl, c3-c6-cycloalkylcarbamoyl and phenyl; with the proviso that when t is t6, a is c-h, r 5 and r 6 are h, z is cf 3 or cf2cf2cf2cf3, and q is cyclopropyl or 1-cyanocyclopropyl, then r is not h; or an agrochemically acceptable salt or n-oxide thereof. 3. a compound or salt according to claim 1 or 2 of formula (i) wherein z is selected from - f, - cf(cf 3 )(cf 3 ), is selected from wherein 1 indicates the bond to the pyrazole group; r 5 and r 6 are independently selected from h, methyl and trifluoromethoxy; a is selected from c-h and n; r 2 is selected from h, methyl, trifluoromethyl and halogen; r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 cycloalkyl- ci- c3-alkyl, ci c6-alkylcarbonyl, formyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)- alkyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 cycloalkyl- ci- c3-alkyl, ci c6-alkylcarbonyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)-alkyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; q is selected from h, hydroxy, hc(=0)-, ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyl- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyl, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and λ/,/v-di (ci- c6-alkyl)amino, wherein each of ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyl- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyl, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and n,n-d\ (ci- c6-alkyl)amino is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, ci-ce- alkylcarbamoyl, c3-c6-cycloalkylcarbamoyl and phenyl; with the proviso that when t is t6, a is c-h, r 5 and r 6 are h, z is cf 3 or cf2cf2cf2cf3, and q is cycloproyl or 1-cyanocyclopropyl, then r is not h; or an agrochemically acceptable salt or n-oxide thereof. 4. a compound or salt accordin to claim 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and ci-ce- alkoxycarbonyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and ci c6-alkoxycarbonyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; a is selected from c-h and n; selected from h and cn; t is t6 or an agrochemically acceptable salt or n-oxide thereof. 5. a compound or salt according to any one of claims 1 to 3 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and c1 c6- alkoxycarbonyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and ci- c6-alkoxycarbonyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t1 or an agrochemically acceptable salt or n-oxide thereof. 6. a pesticidal composition, which comprises at least one compound according to any one of claims 1 to 5, or an agrochemically acceptable salt or n-oxide thereof, as active ingredient and at least one auxiliary. 7. the composition according to claim 6, which further comprises one or more other insecticidally, acaricidally, nematicidally and/or fungicidally active agents. 8. a method for controlling and preventing pests, which comprises applying a composition according to claim 6 or 7 to the pests or their environment with the exception of a method for treatment of the human or animal body by surgery or therapy. 9. a method for the protection of plant propagation material from the attack by pests, which comprises treating the propagation material or the site, where the propagation material is planted, with a composition according to claim 6 or 7. 10. a coated plant propagation material, wherein the coating of the plant propagation material comprises a compound as defined in any one of claims 1 to 5.	pesticidally active pyrazole derivatives the present invention relates to pyrazole derivatives, to processes for preparing them, to intermediates for preparing them, to pesticidal, in particular insecticidal, acaricidal, molluscicidal and nematicidal compositions comprising those derivatives and to methods of using them to combat and control pests such as insect, acarine, mollusc and nematode pests. it has now surprisingly been found that certain pyrazole derivatives have highly potent insecticidal properties. other compounds in this area are known from wo2014/122083, wo2012/107434, wo2015/067646, wo2015/067647, wo2015/067648, wo2015/150442 and wo2010/051926. thus, as embodiment 1 , the present invention relates to a compound of formula (i), wherein selected from ci-c4-haloalkyl and f; t is selected from t6 wherein * indicates the bond to the pyrazole group; r 5 and r 6 are independently selected from h, methyl and trifluoromethoxy; a is selected from c-h and n; r 2 is selected from h, methyl, trifluoromethyl and halogen; r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 cycloalkyl- ci- c3-alkyl, ci c6-alkylcarbonyl, formyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)- alkyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 cycloalkyl- ci- c3-alkyl, ci c6-alkylcarbonyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)-alkyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; q is selected from h, hydroxy, hc(=0)-, ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyl- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyl, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and λ/,/v-di (ci- c6-alkyl)amino, wherein each of ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyl, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyl- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyl, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and n,n-d\ (ci- c6-alkyl)amino is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, ci-ce- alkylcarbamoyl, c3-c6-cycloalkylcarbamoyl and phenyl; wherein the compound of formula (i) is not [5-[4-[4-chloro-3-[(1-cyanocyclopropyl)carbamoyl]phenyl]pyrazol-1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3-yl] trifluoromethanesulfonate, or [5-[4-[4-chloro-3-(cyanocyclopropylcarbamoyl)phenyl]pyrazol-1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3-yl] 1 , 1 ,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate, or [5-[4-[4-chloro-3-(cyclopropylcarbamoyl)phenyl]pyrazol-1-yl]-1-methyl-4-(trifluoromethyl)pyrazol-3-yl] 1 , 1 ,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate; or an agrochemically acceptable salt or n-oxide thereof. the compounds disclaimed in embodiment 1 are disclosed in patent application pct/ep2016/081 167 (wo2017/108569) as examples 16, 36 and 37. embodiment 2: a compound or salt according to embodiment 1 of formula (i) z is selected from ci-c4-haloalkyl and f; t is selected from wherein * indicates the bond to the pyrazole group; r 5 and r 6 are independently selected from h, methyl and trifluoromethoxy; a is selected from c-h and n; r 2 is selected from h, methyl, trifluoromethyl and halogen; r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, formyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)- alkyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)-alkyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; q is selected from h, hydroxy, hc(=0)-, ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and λ/,/v-di (ci- c6-alkyl)amino, wherein each of ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and n,n-d\ (ci- c6-alkyl)amino is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, ci-ce- alkylcarbamoyl, c3-c6-cycloalkylcarbamoyl and phenyl; with the proviso that when t is t6, a is c-h, r 5 and r 6 are h, z is cf 3 or cf2cf2cf2cf3, and q is cyclopropyl or 1-cyanocyclopropyl, then r is not h; or an agrochemically acceptable salt or n-oxide thereof. embodiment 3: a compound or salt according to embodiment 1 or 2 of formula (i) wherein z 1 is selected from - f, - cf(cf 3 )(cf 3 ), - cf(cf 3 )(cf 2 ci), - cf(cf 3 )cf 2 cf 3 , - cf 2 cf(cf 3 )(cf 3 ), - c(cf 3 )(cf 3 )(cf 3 ); is selected from wherein * indicates the bond to the pyrazole group; r 5 and r 6 are independently selected from h, methyl and trifluoromethoxy; a is selected from c-h and n; r 2 is selected from h, methyl, trifluoromethyl and halogen; r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, formyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)- alkyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 cycloalkyi- ci- c3-alkyl, ci c6-alkylcarbonyl, ci c6-alkoxycarbonyl, aryl(co-c3)-alkyl and heteroaryl(co-c3)-alkyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; q is selected from h, hydroxy, hc(=0)-, ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and λ/,/v-di (ci- c6-alkyl)amino, wherein each of ci-ce-alkyl, ci c6-alkoxy, c3-c6 alkenyl, c3-c6 alkynyl, c3-c7 cycloalkyi, c3-c7 heterocycloalkyl ,c3-c7 cycloalkyi- ci c3-alkyl, ci c3-alkyl-c3-c7 cycloalkyi, aryl(co- c3)-alkyl, heteroaryl(co-c3)-alkyl, n- ci c6-alkylamino, n- ci c6-alkylcarbonylamino and n,n-d\ (ci- c6-alkyl)amino is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, ci-ce- alkylcarbamoyl, c3-c6-cycloalkylcarbamoyl and phenyl; with the proviso that when t is t6, a is c-h, r 5 and r 6 are h, z is cf 3 or cf2cf2cf2cf3, and q is cycloproyl or 1-cyanocyclopropyl, then r is not h; or an agrochemically acceptable salt or n-oxide thereof. embodiment 4: a compound or salt according to any one of embodiments 1 to 3 wherein t is selected from t1 t2 t3 t4 t5 embodiment 5: a compound or salt according to any one of embodiments 1 to 3 wherein t is embodiment 6: a compound or salt according to any one of embodiments 1 to 3 wherein t is embodiment 7: a compound or salt according to any one of embodiments 1 to 3 wherein t is embodiment 8: a compound or salt according to any one of embodiments 1 to 3 wherein t is embodiment 9: a compound or salt according to any one of embodiments 1 to 3 wherein t is embodiment 9.1 : a compound or salt according to any one of embodiments 1 to 3 wherein t is embodiment 10: a compound or salt according to any one of embodiments 1 to 9 wherein, r 5 and r' are h. embodiment 1 1 : a compound or salt according to any one of embodiments 1 to 10 wherein z is f. embodiment 12: a compound or salt according to any one of embodiments 1 to 10 wherein z is selected from - cf2cf3, - cf2cf2ci and - cf2cfci2. embodiment 13: a compound or salt according to any one of embodiments 1 to 10 wherein embodiment 14: a compound or salt according to any one of embodiments 1 to 10 wherein z is selected from - cf2cf2cf3, - cf(cf 3 )(cf 3 ), - cf2cf2cf2ci and - cf(cf 3 )(cf 2 ci). embodiment 15: a compound or salt according to any one of embodiments 1 to 10 wherein embodiment 16: a compound or salt according to any one of embodiments 1 to 10 wherein z is selected from - cf2cf2cf2cf3, - cf(cf 3 )cf 2 cf3, - cf 2 cf(cf3)(cf 3 ) and - c(cf3)(cf 3 )(cf 3 ). embodiment 17: a compound or salt according to any one of embodiments 1 to 10 wherein embodiment 17.1 : a compound or salt according to any one of embodiments 1 to 10 wherein z is -cf(cf 3 )(cf 3 ). embodiment 18: a compound or salt according to any one of embodiments 1 to 17 wherein r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and c1 c6- alkoxycarbonyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and ci- c6-alkoxycarbonyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl. embodiment 18.1 : a compound or salt according to any one of embodiments 1 to 17 wherein r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch3, - ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch2-0-ch(ch 3 )(ch 3 ), -ch2-0-(ch3)(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, - ch 2 -ch 2 -0-ethyl, -cha-cha-cha-o-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch2-cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl. embodiment 18.2: a compound or salt according to any one of embodiments 1 to 17 wherein r is selected from h, methyl and ethyl. embodiment 19: a compound or salt according to any one of embodiments 1 to 18 wherein q is g3-c7 cycloalkyi which is unsubstituted or substituted with 1 to 5 substituents independently selected from halogen, hydroxyl, nitro, amino, cyano, ci c6-alkoxy, ci c6-alkoxycarbonyl, hydroxycarbonyl, ci c6-alkylcarbamoyl, c 3 -c6-cycloalkylcarbamoyl and phenyl. embodiment 20: a compound or salt according to any one of embodiments 1 to 18 wherein q is g3-c7 cycloalkyi which is unsubstituted or substituted with 1 to 5 substituents independently selected from halogen, hydroxyl, nitro, amino and cyano. embodiment 21 : a compound or salt according to any one of embodiments 1 to 18 wherein q is g3-c7 cycloalkyi which is unsubstituted or substituted with 1 to 5 substituents independently selected from halogen, hydroxyl, nitro, amino and cyano. embodiment 22: a compound or salt according to any one of embodiments 1 to 18 wherein q is cyclopropyl or 1-cyanocyclopropyl. embodiment 23: a compound or salt according to embodiment 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and c1 c6- alkoxycarbonyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and ci c6-alkoxycarbonyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; a is selected from c-h and n; r 3 is selected from h and cn; t is t6 agrochemically acceptable salt or n-oxide thereof. embodiment 23.1 : a compound or salt according to embodiment 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch 3 , ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch 2 -0-ch(ch 3 )(ch 3 ), -ch 2 -0-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, ch 2 -ch 2 -0-ethyl, -cha-cha-cha-o-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch2-cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl; a is selected from c-h and n; r 3 is selected from h and cn; t is or an agrochemically acceptable salt or n-oxide thereof. embodiment 23.2: a compound or salt accordin to embodiment 1 of formula (la) z is - cf 3 and r is selected from methyl and ethyl; or z is - cf 2 cf 3 and r is selected from h, methyl and ethyl; or z is - cf 2 cf 2 cf 2 cf 3 and r is selected from methyl and ethyl; or z is - f and r is selected from h, methyl and ethyl; or z is - cf(cf 3 )(cf 3 ) and r is selected from h, methyl and ethyl; or z is - cf 2 cf 2 ci and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is or an agrochemically acceptable salt or n-oxide thereof. embodiment 24: a compound or salt according to embodiment 1 of formula (la) z is - cf3 and r is selected from h, methyl and ethyl; or z is - cf2cf3 and r is selected from h, methyl and ethyl; or z is - cf2cf2cf2cf3and r is selected from h, methyl and ethyl; or z is - f and r is selected from h, methyl and ethyl; or z is - cf(cf3)(cf3)and r is selected from h, methyl and ethyl; or z is - cf2cf2ci and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 25: a compound or salt according to embodiment 1 of formula (la) wherein z is - cf2cf3 and r is selected from h, methyl and ethyl; or z is - cf2cf2cf2cf3and r is selected from methyl and ethyl; or z is - cf(cf3)(cf3)and r is selected from h, methyl and ethyl; or z is - cf2cf2ci and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t6 or an agrochemically acceptable salt or n-oxide thereof. embodiment 26: a compound or salt according to embodiment 1 of formula (la) z is - cf2cf3 and r is selected from h, methyl and ethyl; or z is - cf2cf2cf2cf3 and r is selected from h, methyl and ethyl; or z is - cf(cf3)(cf3) and r is selected from h, methyl and ethyl; or z is - cf2cf2ci and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 27: a compound or salt according to embodiment 1 of formula (la) z is - cf2cf2cf2cf3 and r is selected from methyl and ethyl; or z is - cf(cf 3 )(cf 3 )and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t6 or an agrochemically acceptable salt or n-oxide thereof. embodiment 28: a compound or salt according to embodiment 1 of formula (la) z is - cf2cf2cf2cf3 and r is selected from h, methyl and ethyl; or z is - cf(cf 3 )(cf 3 ) and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 29: a compound or salt according to embodiment 1 of formula (la) z is - cf(cf 3 )(cf 3 ); r is selected from h, ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and c1 c6- alkoxycarbonyl, wherein each of ci-ce-alkyl, c2-c6 alkenyl, c2-c6 alkynyl, ci c6-alkylcarbonyl and c c6-alkoxycarbonyl is unsubstituted or substituted with 1 to 10 substituents independently selected from halogen, cyano, ci c6-alkoxy and ci c6-alkoxycarbonyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t1 or an agrochemically acceptable salt or n-oxide thereof. embodiment 29.1 : a com ound or salt according to embodiment 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch 3 , - ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch2-0-ch(ch 3 )(ch 3 ), -ch 2 -0-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, ch 2 -ch 2 -0-ethyl, -ch 2 -ch 2 -ch 2 -0-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t1 ; or an agrochemically acceptable salt or n-oxide thereof. embodiment 29.2: a compound or salt according to embodiment 1 of formula (la) wherein z is - cf2cf2cf2cf3 and r is selected from h, methyl and ethyl; z is - cf(cf 3 )(cf 3 )and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t1 or an agrochemically acceptable salt or n-oxide thereof. embodiment 30: a compound or salt accordin to embodiment 1 of formula (la) z is - cf2cf2cf2cf3 and r is selected from h, methyl and ethyl; z is - cf(cf 3 )(cf 3 )and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t2 or an agrochemically acceptable salt or n-oxide thereof. embodiment 30.1 : a compound or salt accordin to embodiment 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch3, - ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch2-0-ch(ch 3 )(ch 3 ), -ch2-0-(ch3)(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, ch 2 -ch 2 -0-ethyl, -ch 2 -ch 2 -ch 2 -0-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl; a is selected from c-h and n; r 3 is selected from h and cn; t is or an agrochemically acceptable salt or n-oxide thereof. embodiment 31 : a compound or salt according to embodiment 1 of formula (la) wherein z is - cf2cf2cf2cf3 and r is selected from h, methyl and ethyl; or z is - cf(cf 3 )(cf 3 )and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 31.1 : a com ound or salt according to embodiment 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch 3 , - ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch 2 -0-ch(ch 3 )(ch 3 ), -ch 2 -0-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, ch 2 -ch 2 -0-ethyl, -ch 2 -ch2-ch 2 -0-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch2-cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 32: a compound or salt according to embodiment 1 of formula (la) wherein z is - cf2cf2cf2cf 3 and r is selected from h, methyl and ethyl; or z is - cf(cf 3 )(cf 3 )and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 32.1 : a compound or salt according to embodiment 1 of formula (la) wherein z is - cf(cf 3 )(cf 3 ); r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch3, - ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch2-0-ch(ch 3 )(ch 3 ), -ch2-0-(ch3)(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, - ch 2 -ch 2 -0-ethyl, -ch 2 -ch 2 -ch 2 -0-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t4 or an agrochemically acceptable salt or n-oxide thereof. embodiment 33: a compound or salt accordin to embodiment 1 of formula (la) wherein z is - cf 2 cf 2 cf 2 cf 3 and r is selected from h, methyl and ethyl; or z is - cf(cf 3 )(cf 3 )and r is selected from h, methyl and ethyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from or an agrochemically acceptable salt or n-oxide thereof. embodiment 33.1 : a compound or salt according to embodiment 1 of formula (la) z is - cf(cf 3 )(cf 3 ); r is selected from h, methyl, ethyl, propyl, 2-methyl-propyl, 1 -methyl-ethyl, -c(=0)-h, -c(=0)-ch 3 , - ch 2 -0-ethyl, -ch 2 -0-m ethyl, -ch 2 -0-ch(ch 3 )(ch 3 ), -ch 2 -0-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -ch 2 -0-methyl, - ch 2 -ch 2 -0-ethyl, -ch 2 -ch 2 -ch 2 -0-ethyl, -ch 2 -c≡ch, -c(=0)-0-methyl, -c(=0)-0-ethyl, -c(=0)-0- ch(ch 3 )(ch 3 ), -c(=0)-ch(ch 3 )(ch 3 ), -c(=0)-(ch 3 )(ch 3 )(ch 3 ), -ch 2 -cn, -ch(methyl)-cn, - ch(ethyl)-cn, -c(=0)-ethyl, -cf=cf-cf 3 and -c(=0)-ch 2 -0-methyl; a is selected from c-h and n; r 3 is selected from h and cn; t is selected from t5 i or an agrochemically acceptable salt or n-oxide thereof. embodiment 34: a compound or salt according to embodiment 1 selected from 1 - 1 - sulfonate 1 - 1 - 1 - 1 - - -yl]- 1 - [5-[4-[4-chloro-3-[(1- cyanocyclopropyl)-ethyl- carbamoyl] phenyl] pyrazol- 1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3- yl] 1 , 1 , 1 ,2,3,3,3- heptafluoropropane-2- sulfonate [5-[4-[3-[acetyl-(1- cyanocyclopropyl)carbamo yl]-4-chloro-phenyl]pyrazol- 1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3- yl] 1 ,1 ,1 ,2,3,3,3- heptafluoropropane-2- sulfonate [5-[4-[4-chloro-3-[(1- cyanocyclopropyl)- (ethoxymethyl)carbamoyl]p henyl]pyrazol-1-yl]-1- methyl-4- (trifluoromethyl)pyrazol-3- yl] 1 ,1 ,1 ,2,3,3,3- heptafluoropropane-2- sulfonate [5-[4-[4-chloro-3-[(1- cyanocyclopropyl)- (methoxymethyl)carbanrioyl] phenyl] pyrazol- 1 -yl]- 1 - methyl-4- (trifluoromethyl)pyrazol-3- yl] 1 ,1 ,1 ,2,3,3,3- heptafluoropropane-2- sulfonate ethyl- 1 - - p 1 - ph ethyl- p [5-[4-[4-chloro-3-[(1- cyanocyclopropyl)- isopropoxycarbonyl- carbamoyl]phenyl]pyrazol- 1-yl]-1-methyl-4- (trifluoromethyl)pyrazol-3- yl] 1 ,1 ,1 ,2,3,3,3- heptafluoropropane-2- sulfonate or an agrochemically acceptable salt or n-oxide thereof. for clarity purposes, in embodiment 34, there are no examples 53, 55, 61 , 63, 66 and 70. as used herein, when one embodiment refers to several other embodiments by using the term "according to any one of", for example "according to any one of embodiments 1 to 23", then said embodiment refers not only to embodiments indicated by integers such as 1 and 2 but also to embodiments indicated by numbers with a decimal component such as 23.1 , 23.2, 23.3, 23.4, 23.20, 23.25, 23.30. definitions: the term "alkyl" as used herein- in isolation or as part of a chemical group - represents straight- chain or branched hydrocarbons, preferably with 1 to 6 carbon atoms, for example methyl, ethyl, n- propyl, isopropyl, n-butyl, isobutyl, s-butyl, t-butyl, pentyl, 1- methylbutyl, 2-methylbutyl, 3- methylbutyl, 1 ,2-dimethylpropyl, 1 , 1 -dimethylpropyl, 2,2- dimethylpropyl, 1 -ethylpropyl, hexyl, 1 - methylpentyl, 2-methylpentyl, 3-methylpentyl, 4- methylpentyl, 1 ,2-dimethylpropyl, 1 ,3-dimethylbutyl, 1 ,4-dimethylbutyl, 2,3-dimethylbutyl, 1 , 1- dimethylbutyl, 2,2-dimethylbutyl, 3,3-dimethylbutyl, 1 ,1 ,2- trimethylpropyl, 1 ,2,2-trimethylpropyl, 1- ethylbutyl and 2-ethylbutyl. alkyl groups with 1 to 4 carbon atoms are preferred, for example methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, s-butyl or t-butyl. the term "alkenyl" - in isolation or as part of a chemical group - represents straight-chain or branched hydrocarbons, preferably with 2 to 6 carbon atoms and at least one double bond, for example vinyl, 2-propenyl, 2-butenyl, 3-butenyl, 1- methyl-2-propenyl, 2-methyl-2-propenyl, 2- pentenyl, 3-pentenyl, 4-pentenyl, 1-methyl-2-butenyl, 2- methyl-2-butenyl, 3-methyl-2-butenyl, 1- methyl-3-butenyl, 2-methyl-3-butenyl, 3-methyl-3-butenyl, 1 , 1 - dimethyl-2-propenyl, 1 ,2-dimethyl-2- propenyl, 1 -ethyl-2-propenyl, 2-hexenyl, 3-hexenyl, 4- hexenyl, 5-hexenyl, 1 -methyl-2-pentenyl, 2- methyl-2-pentenyl, 3-methyl-2-pentenyl, 4-methyl-2- pentenyl, 3-methyl-3-pentenyl, 4-methyl-3- pentenyl, 1 -methyl-4-pentenyl, 2-methyl-4-pentenyl, 3- methyl-4-pentenyl, 4-methyl-4-pentenyl, 1 , 1 -dimethyl-2-butenyl, 1 ,1-dimethyl-3-butenyl, 1 ,2- dimethyl-2-butenyl, l,2-dimethyl-3-butenyl, 1 ,3- dimethyl-2-butenyl, 2,2-dimethyl-3-butenyl, 2,3- dimethyl-2-butenyl, 2,3-dimethyl-3-butenyl, 1 -ethyl- 2-butenyl, 1-ethyl-3-butenyl, 2-ethyl-2-butenyl, 2-ethyl-3-butenyl, 1 , 1 ,2-trimethyl-2-propenyl, 1 -ethyl- 1 -methyl-2-propenyl und 1-ethyl-2-methyl-2-propenyl. alkenyl groups with 2 to 4 carbon atoms are preferred, for example 2-propenyl, 2-butenyl or 1-methyl-2-propenyl. the term "alkynyl" - in isolation or as part of a chemical group - represents straight-chain or branched hydrocarbons, preferably with 2 to 6 carbon atoms and at least one triple bond, for example 2-propinyl, 2-butinyl, 3-butinyl, 1-methyl-2- propinyl, 2-pentinyl, 3-pentinyl, 4-pentinyl, 1- methyl-3-butinyl, 2-methyl-3-butinyl, 1-methyl-2- butinyl, 1 , 1 -dimethyl-2-propinyl, 1 -ethyl-2-propinyl, 2-hexinyl, 3-hexinyl, 4-hexinyl, 5-hexinyl, 1- methyl-2-pentinyl, 1-methyl-3-pentinyl, 1 -methyl-4- pentinyl, 2-methyl-3-pentinyl, 2-methyl-4- pentinyl, 3 -methyl-4-pentinyl, 4-methyl-2-pentinyl, 1 , 1 - dimethyl-3 -butinyl, 1 ,2-dimethyl-3 -butinyl, 2,2- dimethyl-3-butinyl, 1-ethyl-3-butinyl, 2-ethyl-3- butinyl, 1-ethyl-1-methyl, 1 ,2-propinyl and 2,5-hexadiynyl. alkynyls with 2 to 4 carbon atoms are preferred, for example ethinyl, 2- propinyl or 2-butinyl-2-propenyl. the term "cycloalkyl" - in isolation or as part of a chemical group - represents saturated or partially unsaturated mono-, bi- or tricyclic hydrocarbons, preferably 3 to 10 carbon atoms, for example cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, bicyclo[2.2.1 ]heptyl, bicyclo[2.2.2]octyl or adamantyl. cycloalkyls with 3, 4, 5, 6 or 7 carbon atoms are preferred, for example cyclopropyl or cyclobutyl. the term "heterocycloalkyl" - in isolation or as part of a chemical group - represents saturated or partially unsaturated mono-, bi- or tricyclic hydrocarbons, preferably 3 to 10 carbon atoms, for example cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, bicyclo[2.2.1]heptyl, bicyclo[2.2.2]octyl or adamantyl, wherein one or more of the ring atoms, preferably 1 to 4, more preferably 1 , 2 or 3 of the ring atoms are independently selected from n, o, s, p, b, si and se, more preferably n, o and s, wherein no o atoms can be located next to each other. the term "alkylcycloalkyl" represents mono-, bi- or tricyclic alkylcycloalkyl, preferably with 4 to 10 or 4 to 7 carbon atoms, for example ethylcyclopropyl, isopropylcyclobutyl, 3-methylcyclopentyl and 4- methyl-cyclohexyl. alkylcycloalkyls with 4, 5 or 7 carbon atoms are preferred, for example ethylcyclopropyl or 4-methyl-cyclohexyl. the term "halogen" represents fluoro, chloro, bromo or iodo, particularly fluoro, chloro or bromo. the chemical groups which are substituted with halogen, for example haloalkyl, halocycloalkyl, haloalkyloxy, haloalkylsulfanyl, haloalkylsulfinyl or haloalkylsulfonyl are substituted one or up to the maximum number of substituents with halogen. if "alkyl", "alkenyl" or "alkynyl" are substituted with halogen, the halogen atoms can be the same or different and can be bound at the same carbon atom or different carbon atoms. the term "halocycloalkyl" represents mono-, bi- or tricyclic halocycloalkyl, preferably with 3 to 10 carbon atoms, for example 1 -fluoro-cyclopropyl, 2-fluoro- cyclopropyl or 1 -fluoro-cyclobutyl. preferred halocycloalkyl with 3, 5 or 7 carbon atoms. the term "haloalkyl", "haloalkenyl" or "haloalkynyl" represents alkyls, alkenyls or alkynyls as defined above substituted with halogen, preferably with 1 to 9 halogen atoms that are the same or different, for example monohaloalkyls (= monohaloalkyl) like ch2ch2ci, ch2ch2f, chcich3, chfchs, ch2ci, ch2f; perhaloalkyls like cci 3 or cf 3 or cf2cf3; polyhaloalkyls like chf2, ch2f, ch2chfci, cf2cf2h, ch2cf3. the same applies for haloalkenyl and other groups substituted by halogen. examples of haloalkoxy are for example ocf 3 , ochf2, och2f, ocf2cf3, och2cf3, ocf3, ochf2, och2f, ocf2cf3, och2cf3. further examples of haloalkyls are trichloromethyl, chlorodifluoromethyl, dichlorofluoromethyl, 1- fluoroethyl, 2-fluoroethyl, 2,2-difluoroethyl, 2,2,2-trifluorethyl, 2,2,2-trichloroethyl, 2-chloro-2,2- difluoroethyl, pentafluorethyl and pentafluoro-t-butyl. haloalkyls having 1 to 4 carbon atoms and 1 to 9, preferably 1 to 5 of the same or different halogen atoms selected from fluoro, chloro or bromo, are preferred. haloalkyls having 1 or 2 carbon atoms and 1 to 5 of the same or different halogen atoms selected from fluoro or chloro, for example difluoromethyl, trifluoromethyl or 2,2-difluoroethyl, are particularly preferred. the term "hydroxyalkyl" represents straight or branched chain alcohols, preferably with 1 to 6 carbon atoms, for example methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, s- butanol and t-butanol. hydroxyalkyls having 1 to 4 carbon atoms are preferred. the term "alkoxy" represents straight or branched chain o-alkyl, preferably having 1 to 6 carbon atoms, for example methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, s-butoxy and t- butoxy. alkoxy having 1 to 4 carbon atoms are preferred. the term "haloalkoxy" represents straight or branched chain o-alkyl substituted with halogen, preferably with 1 to 6 carbon atoms, for example difluoromethoxy, trifluoromethoxy, 2,2- difluoroethoxy, 1 ,1 ,2,2-tetrafluoroethoxy, 2,2,2-trifluoroethoxy and 2-chloro-1 , 1 ,2-trifluorethoxy. haloalkoxy having 1 to 4 carbon atoms are preferred. the term "alkylcarbonyl" represents straight or branched chain alkyl-c(=0), preferably having 2 to 7 carbon atoms, for example methylcarbonyl, ethylcarbonyl, n-propylcarbonyl, isopropylcarbonyl, s- butylcarbonyl and t-butylcarbonyl. alkylcarbonyls having 1 to 4 carbon atoms are preferred. the term "cycloalkylcarbonyl" represents cycloalkyl-carbonyl, preferably 3 to 10 carbon atoms in the cycloalkyi part, for example cyclopropylcarbonyl, cyclobutylcarbonyl, cyclopentylcarbonyl, cyclohexyl- carbonyl, cycloheptyl- carbonyl, cyclooctylcarbonyl, bicyclo[2.2.1]heptyl, bycyclo[2.2.2]octylcarbonyl and adamantylcarbonyl. cycloalkylcarbonyls having 3, 5 or 7 carbon atoms in the cycloalkyi part are preferred. the term "alkoxycarbonyl" " - in isolation or as part of a chemical group - represents straight or branched chain alkoxycarbonyl, preferably having 1 to 6 carbon atoms or 1 to 4 carbon atoms in the alkoxy part, for example methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, s-butoxycarbonyl and t- butoxycarbonyl. the term "alkylaminocarbonyl" represents straight or branched chain alkylaminocarbonyl having preferably 1 to 6 carbon atoms orr 1 to 4 carbon atoms in the alkyl part, for example methylaminocarbonyl, ethylaminocarbonyl, n-proylaminocarbonyl, isopropyl- aminocarbonyl, s- butylaminocarbonyl and t-butylaminocarbonyl. the term "ν,ν-dialkylamino-carbonyl" " represents straight or branched chain n,n- dialkylaminocarbonyl with preferablyl to 6 carbon atoms or 1 to 4 carbon atoms in the alkyl part, for example n,n-dimethylamino-carbonyl, ν,ν-diethylamino-carbonyl, n,n-di(n- propylamino)-carbonyl, n,n-di-(isopropylamino)-carbonyl and n,n-di-(s-butylamino)-carbonyl. the term "aryl" represents a mono-, bi- or polycyclical aromatic system with preferably 6 to 14, more preferably 6 to 10 ring-carbon atoms, for example phenyl, naphthyl, anthryl, phenanthrenyl, preferably phenyl. "aryl" also represents polycyclic systems, for example tetrahydronaphtyl, indenyl, indanyl, fluorenyl, biphenyl. arylalkyls are examples of substituted aryls, which may be further substituted with the same or different substituents both at the aryl or alkyl part. benzyl and 1 - phenylethyl are examples of such arylalkyls. the term "heterocyclyl", "heterocyclic ring" or "heterocyclic ring system" represents a carbocyclic ring system with at least one ring, in which ring at least one carbon atom is replaced by a heteroatom, preferably selected from n, o, s, p, b, si, se, and which ring is saturated, unsaturated or partially saturated, and which ring is unsubstituted or substituted with a substituent z, wherein the connecting bond is located at a ring atom. unless otherwise defined, the heterocyclic ring has preferably 3 to 9 ring atoms, preferably 3 to 6 ring atoms, and one or more, preferably 1 to 4, more preferably 1 , 2 or 3 heteroatoms in the heterocyclic ring, preferably selected from n, o, and s, wherein no o atoms can be located next to each other. the heterocyclic rings normally contain no more than 4 nitrogens, and/or no more than 2 oxygen atoms and/or no more than 2 sulfur atoms. in case that the heterocyclic substituent or the heterocyclic ring are further substituted, it can be further annulated wth other heterocyclic rings. the term ..heterocyclic" also includes polycyclic systems, for example 8-aza-bicyclo[3.2.1 ]octanyl or 1 -aza-bicyclo[2.2.1 ] heptyl . the term ..heterocyclic" also includes spirocyclic systems, for example 1-oxa-5-aza-spiro[2.3]hexyl. examples of heterocyclyls are for example piperidinyl, piperazinyl, morpholinyl, thiomorpholinyl, dihydropyranyl, tetrahydropyranyl, dioxanyl, pyrrolinyl, pyrrolidinyl, imidazolinyl, imidazolidinyl, thiazolidinyl, oxazolidinyl, dioxolanyl, dioxolyl, pyrazolidinyl, tetrahydrofuranyl, dihydrofuranyl, oxetanyl, oxiranyl, azetidinyl, aziridinyl, oxazetidinyl, oxaziridinyl, oxazepanyl, oxazinanyl, azepanyl, oxopyrrolidinyl, dioxopyrrolidinyl, oxomorpholinyl, oxopiperazinyl and oxepanyl. particularly important are heteroaryls, i.e. heteroaromatic systems. the term„heteroaryl" represents heteroaromatic groups, i.e. completely unsaturated aromatic heterocyclic groups, which fall under the above definition of heterocycls.„heteroaryls" with 5 to 7- membered rings with 1 to 3, preferably 1 or 2 of the same or different heteroatoms selected from n, o, and s. examples of "heteroaryls" are furyl, thienyl, pyrazolyl, imidazolyl, 1 ,2,3- and 1 ,2,4- triazolyl, isoxazolyl, thiazolyl, isothiazolyl, 1 ,2,3-, 1 ,3,4-, 1 ,2,4- and 1 ,2,5-oxadiazolyl, azepinyl, pyrrolyl, pyridyl, pyridazinyl, pyrimidinyl, pyrazinyl, 1 ,3,5-, 1 ,2,4- and 1 ,2,3-triazinyl, 1 ,2,4-, 1 ,3,2-, 1 ,3,6- and 1 ,2,6-oxazinyl, oxepinyl, thiepinyl, 1 ,2,4-triazolonyl and 1 ,2,4-diazepinyl. a compound according to any one of embodiments 1 to 34 which has at least one basic centre can form, for example, acid addition salts, for example with strong inorganic acids such as mineral acids, for example perchloric acid, sulfuric acid, nitric acid, nitrose acid, a phosphorus acid or a hydrohalic acid, with strong organic carboxylic acids, such as ci-c4alkanecarboxylic acids which are unsubstitu- ted or substituted, for example by halogen, for example acetic acid, such as saturated or unsaturated dicarboxylic acids, for example oxalic acid, malonic acid, succinic acid, maleic acid, fumaric acid or phthalic acid, such as hydroxycarboxylic acids, for example ascorbic acid, lactic acid, malic acid, tartaric acid or citric acid, or such as benzoic acid, or with organic sulfonic acids, such as ci- c4alkane- or arylsulfonic acids which are unsubstituted or substituted, for example by halogen, for example methane- or p-toluenesulfonic acid. a compounds according to any one of embodiments 1 to 20 which have at least one acidic group can form, for example, salts with bases, for example mineral salts such as alkali metal or alkaline earth metal salts, for example sodium, potassium or magnesium salts, or salts with ammonia or an organic amine, such as morpholine, piperidine, pyrrolidine, a mono-, di- or tri-lower-alkylamine, for example ethyl-, diethyl-, triethyl- or dimethylpropylamine, or a mono-, di- or trihydroxy-lower-alkylamine, for example mono-, di- or triethanolamine. compounds according to any one of embodiments 1 to 34 also include hydrates which may be formed during the salt formation. the compounds according to any one of embodiments 1 to 34 may be made by a variety of methods well known to a person skilled in the art or as shown in schemes 1 to 2. further instructions regarding the preparation can be found in wo2017/055414, wo2017/108569, wo2017/140771 wo2017/012970, wo2015/067646, wo2015/150442, wo2014/122083 and wo2012/107434. for example, compounds of formula (i) may be prepared, for example, according to scheme 1 , scheme 1 : (1 ) (2) (3) wherein r , r 2 , q, a, and z are as defined in any one of embodiments 1 to 34, lg represents a leaving group such as f, ci, otf. compounds of formula (1 ), (2), (4), (6), (9) or (1 1 ) are commercially available or are known from the chemistry literature. compound of formula (3) can be prepared according to processes described in w012/158413 p. 371 , step a. compounds of formula (7) can be obtained by classical suzuki coupling between compound of formula (5) and a boronic acid, ester (e.g. pinacol ester) or trifluoroborate of formula (6) as described in n. miyaura, a. suzuki, chem. rev. 1995, 95, 2457-2483 or in g. a. molander, l. jean-gerard, org. react. 2013, 79, 1 - 316. compound of formula (la) can be prepared by sulfonylation as described in tetrahedron 2009, 65, 7817-7824 scheme 2: wherein r\ r 2 , q, a, and z are as defined in any one of embodiments 1 to 34, lg represents a leaving group such as f, ci, otf. compounds of formula (6), (9) or (1 1 ) are commercially available or are known from the chemistry literature. compound of formula (3) can be prepared according to processes described in w012/158413 p. 371 , step a. compounds of formula (16) may be prepared according to known literature methods by reacting compound (15) with compounds (6) in the presence of a base in a suitable solvent and at a suitable temperature (information can be found in wo2015/067646, p. 145-147). compounds of formula (la) can be prepared by sulfonylation as described in tetrahedron 2009, 65, 7817-7824 a compound according to any one of embodiments 1 to 34 can be converted in a manner known per se into another compound according to any one of embodiments 1 to 34 by replacing one or more substituents of the starting compound according to any one of embodiments 1 to 34 in the customary manner by (an)other substituent(s) according to the invention. depending on the choice of the reaction conditions and starting materials which are suitable in each case, it is possible, for example, in one reaction step only to replace one substituent by another substituent according to the invention, or a plurality of substituents can be replaced by other substituents according to the invention in the same reaction step. salts of compounds of formula (i) can be prepared in a manner known per se. thus, for example, acid addition salts of compounds according to any one of embodiments 1 to 34 are obtained by treatment with a suitable acid or a suitable ion exchanger reagent and salts with bases are obtained by treatment with a suitable base or with a suitable ion exchanger reagent. salts of compounds according to any one of embodiments 1 to 34 can be converted in the customary manner into the free compounds, acid addition salts, for example, by treatment with a suitable basic compound or with a suitable ion exchanger reagent and salts with bases, for example, by treatment with a suitable acid or with a suitable ion exchanger reagent. salts of compounds according to any one of embodiments 1 to 34 can be converted in a manner known per se into other salts of compounds according to any one of embodiments 1 to 34, acid addition salts, for example, into other acid addition salts, for example by treatment of a salt of inorganic acid such as hydrochloride with a suitable metal salt such as a sodium, barium or silver salt, of an acid, for example with silver acetate, in a suitable solvent in which an inorganic salt which forms, for example silver chloride, is insoluble and thus precipitates from the reaction mixture. depending on the procedure or the reaction conditions, the compounds according to any one of embodiments 1 to 34, which have salt-forming properties can be obtained in free form or in the form of salts. the compounds according to any one of embodiments 1 to 34 and, where appropriate, the tautomers thereof, in each case in free form or in salt form, can be present in the form of one of the stereoisomers which are possible or as a mixture of these, for example in the form of pure stereoisomers, such as antipodes and/or diastereomers, or as stereoisomer mixtures, such as enantiomer mixtures, for example racemates, diastereomer mixtures or racemate mixtures, depending on the number, absolute and relative configuration of asymmetric carbon atoms which occur in the molecule and/or depending on the configuration of non-aromatic double bonds which occur in the molecule; the invention relates to the pure stereoisomers and also to all stereoisomer mixtures which are possible and is to be understood in each case in this sense hereinabove and hereinbelow, even when stereochemical details are not mentioned specifically in each case. diastereomer mixtures or racemate mixtures of compounds according to any one of embodiments 1 to 34, in free form or in salt form, which can be obtained depending on which starting materials and procedures have been chosen can be separated in a known manner into the pure diasteromers or racemates on the basis of the physicochemical differences of the components, for example by fractional crystallization, distillation and/or chromatography. enantiomer mixtures, such as racemates, which can be obtained in a similar manner can be resolved into the optical antipodes by known methods, for example by recrystallization from an optically active solvent, by chromatography on chiral adsorbents, for example high-performance liquid chromatography (hplc) on acetyl celulose, with the aid of suitable microorganisms, by cleavage with specific, immobilized enzymes, via the formation of inclusion compounds, for example using chiral crown ethers, where only one enantiomer is complexed, or by conversion into diastereomeric salts, for example by reacting a basic end-product racemate with an optically active acid, such as a carboxylic acid, for example camphor, tartaric or malic acid, or sulfonic acid, for example camphorsulfonic acid, and separating the diastereomer mixture which can be obtained in this manner, for example by fractional crystallization based on their differing solubilities, to give the diastereomers, from which the desired enantiomer can be set free by the action of suitable agents, for example basic agents. pure diastereomers or enantiomers can be obtained according to the invention not only by separating suitable stereoisomer mixtures, but also by generally known methods of diastereoselective or enantioselective synthesis, for example by carrying out the process according to the invention with starting materials of a suitable stereochemistry. n-oxides can be prepared by reacting a compound according to any one of embodiments 1 to 34 with a suitable oxidizing agent, for example the hbch/urea adduct in the presence of an acid anhydride, e.g. trifluoroacetic anhydride. such oxidations are known from the literature, for example from j. med. chem., 32 (12), 2561-73, 1989 or wo 00/15615. it is advantageous to isolate or synthesize in each case the biologically more effective stereoisomer, for example enantiomer or diastereomer, or stereoisomer mixture, for example enantiomer mixture or diastereomer mixture, if the individual components have a different biological activity. the compounds according to any one of embodiments 1 to 34 and, where appropriate, the tautomers thereof, in each case in free form or in salt form, can, if appropriate, also be obtained in the form of hydrates and/or include other solvents, for example those which may have been used for the crystallization of compounds which are present in solid form. the following examples illustrate, but do not limit, the invention. the present invention also provides intermediates useful for the preparation of compounds according to any one of embodiments 1 to 34. certain intermediates are novel and as such form a further aspect of the invention. one group of novel intermediates are compounds of formula (ii) (ii) wherein a, t and r 2 are as defined in any one of embodiments 1 to 34. the preferences for a, t r 2 are the same as the preferences set out for the corresponding substituents of a compound according to any one of embodiments 1 to 34. another group of novel intermediates are compounds of formula (iii) (ml) wherein a, t, r , r 2 and q are as defined in any one of embodiments 1 to 34. the preferences for a, t, r\ r 2 and q are the same as the preferences set out for the corresponding substituents of a compound according to any one of embodiments 1 to 34. the compounds according to any one of embodiments 1 to 34 are preventively and/or curatively valuable active ingredients in the field of pest control, even at low rates of application, which have a very favorable biocidal spectrum and are well tolerated by warm-blooded species, fish and plants. the active ingredients according to the invention act against all or individual developmental stages of normally sensitive, but also resistant, animal pests, such as insects or representatives of the order acarina. the insecticidal or acaricidal activity of the active ingredients according to the invention can manifest itself directly, i. e. in destruction of the pests, which takes place either immediately or only after some time has elapsed, for example during ecdysis, or indirectly, for example in a reduced oviposition and/or hatching rate. examples of the above mentioned animal pests are: from the order acarina, for example, acalitus spp, aculus spp, acaricalus spp, aceria spp, acarus siro, amblyomma spp., argas spp., boophilus spp., brevipalpus spp., bryobia spp, calipitrimerus spp., chorioptes spp., dermanyssus gallinae, dermatophagoides spp, eotetranychus spp, eriophyes spp., hemitarsonemus spp, hyalomma spp., ixodes spp., olygonychus spp, ornithodoros spp., polyphagotarsone latus, panonychus spp., phyllocoptruta oleivora, phytonemus spp, polyphagotarsonemus spp, psoroptes spp., rhipicephalus spp., rhizoglyphus spp., sarcoptes spp., steneotarsonemus spp, tarsonemus spp. and tetranychus spp.; from the order anoplura, for example, haematopinus spp., linognathus spp., pediculus spp., pemphigus spp. and phylloxera spp.; from the order coleoptera, for example, agriotes spp., amphimallon majale, anomala orientalis, anthonomus spp., aphodius spp, astylus atromaculatus, ataenius spp, atomaria linearis, chaetocnema tibialis, cerotoma spp, conoderus spp, cosmopolites spp., cotinis nitida, curculio spp., cyclocephala spp, dermestes spp., diabrotica spp., diloboderus abderus, epilachna spp., eremnus spp., heteronychus arator, hypothenemus hampei, lagria vilosa, leptinotarsa decemlineata, lissorhoptrus spp., liogenys spp, maecolaspis spp, maladera castanea, megascelis spp, melighetes aeneus, melolontha spp., myochrous armatus, orycaephilus spp., otiorhynchus spp., phyllophaga spp, phlyctinus spp., popillia spp., psylliodes spp., rhyssomatus aubtilis, rhizopertha spp., scarabeidae, sitophilus spp., sitotroga spp., somaticus spp, sphenophorus spp, sternechus subsignatus, tenebrio spp., tribolium spp. and trogoderma spp.; from the order diptera, for example, aedes spp., anopheles spp, antherigona soccata,bactrocea oleae, bibio hortulanus, bradysia spp, calliphora erythrocephala, ceratitis spp., chrysomyia spp., culex spp., cuterebra spp., dacus spp., delia spp, drosophila melanogaster, fannia spp., gastrophilus spp., geomyza tripunctata, glossina spp., hypoderma spp., hyppobosca spp., liriomyza spp., lucilia spp., melanagromyza spp., musca spp., oestrus spp., orseolia spp., oscinella frit, pegomyia hyoscyami, phorbia spp., rhagoletis spp, rivelia quadrifasciata, scatella spp, sciara spp., stomoxys spp., tabanus spp., tannia spp. and tipula spp.; from the order hemiptera, for example, acanthocoris scabrator, acrosternum spp, adelphocoris lineolatus, amblypelta nitida, bathycoelia thalassina, blissus spp, cimex spp., clavigralla tomentosicollis, creontiades spp, distantiella theobroma, dichelops furcatus, dysdercus spp., edessa spp, euchistus spp., eurydema pulchrum, eurygaster spp., halyomorpha halys, horcias nobilellus, leptocorisa spp., lygus spp, margarodes spp, murgantia histrionic, neomegalotomus spp, nesidiocoris tenuis, nezara spp., nysius simulans, oebalus insularis, piesma spp., piezodorus spp, rhodnius spp., sahlbergella singularis, scaptocoris castanea, scotinophara spp. , thyanta spp , triatoma spp., vatiga illudens; acyrthosium pisum, adalges spp, agalliana ensigera, agonoscena targionii, aleurodicus spp, aleurocanthus spp, aleurolobus barodensis, aleurothrixus floccosus, aleyrodes brassicae, amarasca biguttula, amritodus atkinsoni, aonidiella spp., aphididae, aphis spp., aspidiotus spp., aulacorthum solani, bactericera cockerelli, bemisia spp, brachycaudus spp, brevicoryne brassicae, cacopsylla spp, cavariella aegopodii scop., ceroplaster spp., chrysomphalus aonidium, chrysomphalus dictyospermi, cicadella spp, cofana spectra, cryptomyzus spp, cicadulina spp, coccus hesperidum, dalbulus maidis, dialeurodes spp, diaphorina citri, diuraphis noxia, dysaphis spp, empoasca spp., eriosoma larigerum, erythroneura spp., gascardia spp., glycaspis brimblecombei, hyadaphis pseudobrassicae, hyalopterus spp, hyperomyzus pallidus, idioscopus clypealis, jacobiasca lybica, laodelphax spp., lecanium corni, lepidosaphes spp., lopaphis erysimi, lyogenys maidis, macrosiphum spp., mahanarva spp, metcalfa pruinosa, metopolophium dirhodum, myndus crudus, myzus spp., neotoxoptera sp, nephotettix spp., nilaparvata spp., nippolachnus piri mats, odonaspis ruthae, oregma lanigera zehnter, parabemisia myricae, paratrioza cockerelli, parlatoria spp., pemphigus spp., peregrinus maidis, perkinsiella spp, phorodon humuli, phylloxera spp, planococcus spp., pseudaulacaspis spp., pseudococcus spp., pseudatomoscelis seriatus, psylla spp., pulvinaria aethiopica, quadraspidiotus spp., quesada gigas, recilia dorsalis, rhopalosiphum spp., saissetia spp., scaphoideus spp., schizaphis spp., sitobion spp., sogatella furcifera, spissistilus festinus, tarophagus proserpina, toxoptera spp, trialeurodes spp, tridiscus sporoboli, trionymus spp, trioza erytreae , unaspis citri, zygina flammigera, zyginidia scutellaris, ; from the order hymenoptera, for example, acromyrmex, arge spp, atta spp., cephus spp., diprion spp., diprionidae, gilpinia polytoma, hoplo- campa spp., lasius spp., monomorium pharaonis, neodiprion spp., pogonomyrmex spp, slenopsis invicta, solenopsis spp. and vespa spp.; from the order isoptera, for example, coptotermes spp, corniternes cumulans, incisitermes spp, macrotermes spp, mastotermes spp, microtermes spp, reticulitermes spp.; solenopsis geminate from the order lepidoptera, for example, acleris spp., adoxophyes spp., aegeria spp., agrotis spp., alabama argillaceae, amylois spp., anticarsia gemmatalis, archips spp., argyresthia spp, argyrotaenia spp., autographa spp., bucculatrix thurberiella, busseola fusca, cadra cautella, carposina nipponensis, chilo spp., choristoneura spp., chrysoteuchia topiaria, clysia ambiguella, cnaphalocrocis spp., cnephasia spp., cochylis spp., coleophora spp., colias lesbia, cosmophila flava, crambus spp, crocidolomia binotalis, cryptophlebia leucotreta, cydalima perspectalis, cydia spp., diaphania perspectalis, diatraea spp., diparopsis castanea, earias spp., eldana saccharina, ephestia spp., epinotia spp, estigmene acrea, etiella zinckinella, eucosma spp., eupoecilia ambiguella, euproctis spp., euxoa spp., feltia jaculiferia, grapholita spp., hedya nubiferana, heliothis spp., hellula undalis, herpetogramma spp, hyphantria cunea, keiferia lycopersicella, lasmopalpus lignosellus, leucoptera scitella, lithocollethis spp., lobesia botrana, loxostege bifidalis, lymantria spp., ly- onetia spp., malacosoma spp., mamestra brassicae, manduca sexta, mythimna spp, noctua spp, operophtera spp., orniodes indica, ostrinia nubilalis, pammene spp., pandemis spp., panolis flammea, papaipema nebris, pectinophora gossypiela, perileucoptera coffeella, pseudaletia unipuncta, phthorimaea operculella, pieris rapae, pieris spp., plutella xylostella, prays spp., pseudoplusia spp, rachiplusia nu, richia albicosta, scirpophaga spp., sesamia spp., sparganothis spp., spodoptera spp., sylepta derogate, synanthedon spp., thaumetopoea spp., tortrix spp., trichoplusia ni, tuta absoluta, and yponomeuta spp.; from the order mallophaga, for example, damalinea spp. and trichodectes spp.; from the order orthoptera, for example, blatta spp., blattella spp., gryllotalpa spp., leucophaea maderae, locusta spp., neocurtilla hexadactyla, periplaneta spp. , scapteriscus spp, and schistocerca spp.; from the order psocoptera, for example, liposcelis spp.; from the order siphonaptera, for example, ceratophyllus spp., ctenocephalides spp. and xenopsylla cheopis; from the order thysanoptera, for example, calliothrips phaseoli, frankliniella spp., heliothrips spp, hercinothrips spp., parthenothrips spp, scirtothrips aurantii, sericothrips variabilis, taeniothrips spp., thrips spp; from the order thysanura, for example, lepisma saccharina. the active ingredients according to the invention can be used for controlling, i. e. containing or destroying, pests of the abovementioned type which occur in particular on plants, especially on useful plants and ornamentals in agriculture, in horticulture and in forests, or on organs, such as fruits, flowers, foliage, stalks, tubers or roots, of such plants, and in some cases even plant organs which are formed at a later point in time remain protected against these pests. suitable target crops are, in particular, cereals, such as wheat, barley, rye, oats, rice, maize or sorghum; beet, such as sugar or fodder beet; fruit, for example pomaceous fruit, stone fruit or soft fruit, such as apples, pears, plums, peaches, almonds, cherries or berries, for example strawberries, raspberries or blackberries; leguminous crops, such as beans, lentils, peas or soya; oil crops, such as oilseed rape, mustard, poppies, olives, sunflowers, coconut, castor, cocoa or ground nuts; cucurbits, such as pumpkins, cucumbers or melons; fibre plants, such as cotton, flax, hemp or jute; citrus fruit, such as oranges, lemons, grapefruit or tangerines; vegetables, such as spinach, lettuce, asparagus, cabbages, carrots, onions, tomatoes, potatoes or bell peppers; lauraceae, such as avocado, cinnamonium or camphor; and also tobacco, nuts, coffee, eggplants, sugarcane, tea, pepper, grapevines, hops, the plantain family, latex plants and ornamentals. the active ingredients according to the invention are especially suitable for controlling aphis craccivora, diabrotica balteata, heliothis virescens, myzus persicae, plutella xylostella and spodoptera littoralis in cotton, vegetable, maize, rice and soya crops. the active ingredients according to the invention are further especially suitable for controlling mamestra (preferably in vegetables), cydia pomonella (preferably in apples), empoasca (preferably in vegetables, vineyards), leptinotarsa (preferably in potatos) and chilo supressalis (preferably in rice). in a further aspect, the invention may also relate to a method of controlling damage to plant and parts thereof by plant parasitic nematodes (endoparasitic-, semiendoparasitic- and ectoparasitic nematodes), especially plant parasitic nematodes such as root knot nematodes, meloidogyne hapla, meloidogyne incognita, meloidogyne javanica, meloidogyne arenaria and other meloidogyne species; cyst-forming nematodes, globodera rostochiensis and other globodera species; heterodera avenae, heterodera glycines, heterodera schachtii, heterodera trifolii, and other heterodera species; seed gall nematodes, anguina species; stem and foliar nematodes, aphelenchoides species; sting nematodes, belonolaimus longicaudatus and other belonolaimus species; pine nematodes, bursaphelenchus xylophilus and other bursaphelenchus species; ring nematodes, criconema species, criconemella species, criconemoides species, mesocriconema species; stem and bulb nematodes, ditylenchus destructor, ditylenchus dipsaci and other ditylenchus species; awl nematodes, dolichodorus species; spiral nematodes, heliocotylenchus multicinctus and other helicotylenchus species; sheath and sheathoid nematodes, hemicycliophora species and hemicriconemoides species; hirshmanniella species; lance nematodes, hoploaimus species; false rootknot nematodes, nacobbus species; needle nematodes, longidorus elongatus and other longidorus species; pin nematodes, pratylenchus species; lesion nematodes, pratylenchus neglectus, pratylenchus penetrans, pratylenchus curvitatus, pratylenchus goodeyi and other pratylenchus species; burrowing nematodes, radopholus similis and other radopholus species; reniform nematodes, rotylenchus robustus, rotylenchus reniformis and other rotylenchus species; scutellonema species; stubby root nematodes, trichodorus primitivus and other trichodorus species, paratrichodorus species; stunt nematodes, tylenchorhynchus claytoni, tylenchorhynchus dubius and other tylenchorhynchus species; citrus nematodes, tylenchulus species; dagger nematodes, xiphinema species; and other plant parasitic nematode species, such as subanguina spp., hypsoperine spp., macroposthonia spp., melinius spp., punctodera spp., and quinisulcius spp.. the compounds according to any one of embodiments 1 to 34 may also have activity against the molluscs. examples of which include, for example, ampullariidae; arion (a. ater, a. circumscriptus, a. hortensis, a. rufus); bradybaenidae (bradybaena fruticum); cepaea (c. hortensis, c. nemoralis); ochlodina; deroceras (d. agrestis, d. empiricorum, d. laeve, d. reticulatum); discus (d. rotundatus); euomphalia; galba (g. trunculata); helicelia (h. itala, h. obvia); helicidae helicigona arbustorum); helicodiscus; helix (h. aperta); limax (l. cinereoniger, l. flavus, l. marginatus, l. maximus, l. tenellus); lymnaea; milax (m. gagates, m. marginatus, m. sowerbyi); opeas; pomacea (p. canaticulata); vallonia and zanitoides. the term "crops" is to be understood as including also crop plants which have been so transformed by the use of recombinant dna techniques that they are capable of synthesising one or more selectively acting toxins, such as are known, for example, from toxin-producing bacteria, especially those of the genus bacillus. toxins that can be expressed by such transgenic plants include, for example, insecticidal proteins, for example insecticidal proteins from bacillus cereus or bacillus popilliae; or insecticidal proteins from bacillus thuringiensis, such as δ-endotoxins, e.g. crylab, crylac, cryl f, cry1 fa2, cry2ab, cry3a, cry3bb1 or cry9c, or vegetative insecticidal proteins (vip), e.g. vip1 , vip2, vip3 or vip3a; or insecticidal proteins of bacteria colonising nematodes, for example photorhabdus spp. or xenorhabdus spp., such as photorhabdus luminescens, xenorhabdus nematophilus; toxins produced by animals, such as scorpion toxins, arachnid toxins, wasp toxins and other insect-specific neurotoxins; toxins produced by fungi, such as streptomycetes toxins, plant lectins, such as pea lectins, barley lectins or snowdrop lectins; agglutinins; proteinase inhibitors, such as trypsin inhibitors, serine protease inhibitors, patatin, cystatin, papain inhibitors; ribosome-inactivating proteins (rip), such as ricin, maize-rip, abrin, luffin, saporin or bryodin; steroid metabolism enzymes, such as 3-hydroxysteroidoxidase, ecdysteroid-udp-glycosyl-transferase, cholesterol oxidases, ecdysone inhibitors, hmg-coa-reductase, ion channel blockers, such as blockers of sodium or calcium channels, juvenile hormone esterase, diuretic hormone receptors, stilbene synthase, bibenzyl synthase, chitinases and glucanases. in the context of the present invention there are to be understood by δ-endotoxins, for example crylab, crylac, cryl f, cry1 fa2, cry2ab, cry3a, cry3bb1 or cry9c, or vegetative insecticidal proteins (vip), for example vip1 , vip2, vip3 or vip3a, expressly also hybrid toxins, truncated toxins and modified toxins. hybrid toxins are produced recombinantly by a new combination of different domains of those proteins (see, for example, wo 02/15701 ). truncated toxins, for example a truncated crylab, are known. in the case of modified toxins, one or more amino acids of the naturally occurring toxin are replaced. in such amino acid replacements, preferably non-naturally present protease recognition sequences are inserted into the toxin, such as, for example, in the case of cry3a055, a cathepsin-g-recognition sequence is inserted into a cry3a toxin (see wo 03/018810). examples of such toxins or transgenic plants capable of synthesising such toxins are disclosed, for example, in ep-a-0 374 753, wo93/07278, w095/34656, ep-a-0 427 529, ep-a-451 878 and wo 03/052073. the processes for the preparation of such transgenic plants are generally known to the person skilled in the art and are described, for example, in the publications mentioned above. cryl-type deoxyribonucleic acids and their preparation are known, for example, from wo 95/34656, ep-a-0 367 474, ep-a-0 401 979 and wo 90/13651. the toxin contained in the transgenic plants imparts to the plants tolerance to harmful insects. such insects can occur in any taxonomic group of insects, but are especially commonly found in the beetles (coleoptera), two-winged insects (diptera) and moths (lepidoptera). transgenic plants containing one or more genes that code for an insecticidal resistance and express one or more toxins are known and some of them are commercially available. examples of such plants are: yieldgard® (maize variety that expresses a crylab toxin); yieldgard rootworm® (maize variety that expresses a cry3bb1 toxin); yieldgard plus® (maize variety that expresses a crylab and a cry3bb1 toxin); starlink® (maize variety that expresses a cry9c toxin); herculex i® (maize variety that expresses a cry1 fa2 toxin and the enzyme phosphinothricine n- acetyltransferase (pat) to achieve tolerance to the herbicide glufosinate ammonium); nucotn 33b ® (cotton variety that expresses a cry 1 ac toxin); bollgard i® (cotton variety that expresses a crylac toxin); bollgard ii® (cotton variety that expresses a crylac and a cry2ab toxin); vipcot® (cotton variety that expresses a vip3a and a crylab toxin); newleaf® (potato variety that expresses a cry3a toxin); naturegard®, agrisure® gt advantage (ga21 glyphosate-tolerant trait), agrisure® cb advantage (bt1 1 corn borer (cb) trait) and protecta®. further examples of such transgenic crops are: 1. bt11 maize from syngenta seeds sas, chemin de i'hobit 27, f-31 790 st. sauveur, france, registration number c/fr/96/05/10. genetically modified zea mays which has been rendered resistant to attack by the european corn borer (ostrinia nubilalis and sesamia nonagrioides) by transgenic expression of a truncated crylab toxin. bt1 1 maize also transgenically expresses the enzyme pat to achieve tolerance to the herbicide glufosinate ammonium. 2. bt176 maize from syngenta seeds sas, chemin de i'hobit 27, f-31 790 st. sauveur, france, registration number c/fr/96/05/10. genetically modified zea mays which has been rendered resistant to attack by the european corn borer (ostrinia nubilalis and sesamia nonagrioides) by transgenic expression of a crylab toxin. bt176 maize also transgenically expresses the enzyme pat to achieve tolerance to the herbicide glufosinate ammonium. 3. mir604 maize from syngenta seeds sas, chemin de i'hobit 27, f-31 790 st. sauveur, france, registration number c/fr/96/05/10. maize which has been rendered insect-resistant by transgenic expression of a modified cry3a toxin. this toxin is cry3a055 modified by insertion of a cathepsin-g- protease recognition sequence. the preparation of such transgenic maize plants is described in wo 03/018810. 4. mon 863 maize from monsanto europe s.a. 270-272 avenue de tervuren, b-1 150 brussels, belgium, registration number c/de/02/9. mon 863 expresses a cry3bb1 toxin and has resistance to certain coleoptera insects. 5. ipc 531 cotton from monsanto europe s.a. 270-272 avenue de tervuren, b-1 150 brussels, belgium, registration number c/es/96/02. 6. 1507 maize from pioneer overseas corporation, avenue tedesco, 7 b-1 160 brussels, belgium, registration number c/nl/00/10. genetically modified maize for the expression of the protein cryl f for achieving resistance to certain lepidoptera insects and of the pat protein for achieving tolerance to the herbicide glufosinate ammonium. 7. nk603 * mon 810 maize from monsanto europe s.a. 270-272 avenue de tervuren, b-1 150 brussels, belgium, registration number c/gb/02/m3/03. consists of conventionally bred hybrid maize varieties by crossing the genetically modified varieties nk603 and mon 810. nk603 * mon 810 maize transgenically expresses the protein cp4 epsps, obtained from agrobacterium sp. strain cp4, which imparts tolerance to the herbicide roundup® (contains glyphosate), and also a crylab toxin obtained from bacillus thuringiensis subsp. kurstaki which brings about tolerance to certain lepidoptera, include the european corn borer. transgenic crops of insect-resistant plants are also described in bats (zentrum fur biosicherheit und nachhaltigkeit, zentrum bats, clarastrasse 13, 4058 basel, switzerland) report 2003, (http://bats.ch). the term "crops" is to be understood as including also crop plants which have been so transformed by the use of recombinant dna techniques that they are capable of synthesising antipathogenic substances having a selective action, such as, for example, the so-called "pathogenesis-related proteins" (prps, see e.g. ep-a-0 392 225). examples of such antipathogenic substances and transgenic plants capable of synthesising such antipathogenic substances are known, for example, from ep-a-0 392 225, w095/33818 and ep-a-0 353 191. the methods of producing such transgenic plants are generally known to the person skilled in the art and are described, for example, in the publications mentioned above. crops may also be modified for enhanced resistance to fungal (for example fusarium, anthracnose, or phytophthora), bacterial (for example pseudomonas) or viral (for example potato leafroll virus, tomato spotted wilt virus, cucumber mosaic virus) pathogens. crops also include those that have enhanced resistance to nematodes, such as the soybean cyst nematode. crops that are tolerant to abiotic stress include those that have enhanced tolerance to drought, high salt, high temperature, chill, frost, or light radiation, for example through expression of nf-yb or other proteins known in the art. antipathogenic substances which can be expressed by such transgenic plants include, for example, ion channel blockers, such as blockers for sodium and calcium channels, for example the viral kp1 , kp4 or kp6 toxins; stilbene synthases; bibenzyl synthases; chitinases; glucanases; the so-called "pathogenesis-related proteins" (prps; see e.g. ep-a-0 392 225); antipathogenic substances produced by microorganisms, for example peptide antibiotics or heterocyclic antibiotics (see e.g. w095/33818) or protein or polypeptide factors involved in plant pathogen defence (so-called "plant disease resistance genes", as described in wo 03/000906). further areas of use of the compositions according to the invention are the protection of stored goods and store rooms and the protection of raw materials, such as wood, textiles, floor coverings or buildings, and also in the hygiene sector, especially the protection of humans, domestic animals and productive livestock against pests of the mentioned type. the present invention also provides a method for controlling pests (such as mosquitoes and other disease vectors; see also http://www.who.int/malaria/vector_control/irs/en/). in one embodiment, the method for controlling pests comprises applying the compositions of the invention to the target pests, to their locus or to a surface or substrate by brushing, rolling, spraying, spreading or dipping. by way of example, an irs (indoor residual spraying) application of a surface such as a wall, ceiling or floor surface is contemplated by the method of the invention. in another embodiment, it is contemplated to apply such compositions to a substrate such as non-woven or a fabric material in the form of (or which can be used in the manufacture of) netting, clothing, bedding, curtains and tents. in another embodiment, the method for controlling such pests comprises applying a pesticidally effective amount of the compositions of the invention to the target pests, to their locus, or to a surface or substrate so as to provide effective residual pesticidal activity on the surface or substrate. such application may be made by brushing, rolling, spraying, spreading or dipping the pesticidal composition of the invention. by way of example, an irs application of a surface such as a wall, ceiling or floor surface is contemplated by the method of the invention so as to provide effective residual pesticidal activity on the surface. in another embodiment, it is contemplated to apply such compositions for residual control of pests on a substrate such as a fabric material in the form of (or which can be used in the manufacture of) netting, clothing, bedding, curtains and tents. substrates including non-woven, fabrics or netting to be treated may be made of natural fibres such as cotton, raffia, jute, flax, sisal, hessian, or wool, or synthetic fibres such as polyamide, polyester, polypropylene, polyacrylonitrile or the like. the polyesters are particularly suitable. the methods of textile treatment are known, e.g. wo 2008/151984, wo 2003/034823, us 5631072, wo 2005/64072, wo2006/128870, ep 1724392, wo20051 13886 or wo 2007/090739. further areas of use of the compositions according to the invention are the field of tree injection/trunk treatment for all ornamental trees as well all sort of fruit and nut trees. in the field of tree injection/trunk treatment, the compounds according to the present invention are especially suitable against wood-boring insects from the order lepidoptera as mentioned above and from the order coleoptera, especially against woodborers listed in the following tables a and b: table a. examples of exotic woodborers of economic importance. family species host or crop infested buprestidae agrilus planipennis ash cerambycidae anoplura glabripennis hardwoods xylosandrus crassiusculus hardwoods scolytidae x. mutilatus hardwoods tomicus piniperda conifers table b. examples of native woodborers of economic importance. family species host or crop infested agrilus anxius birch agrilus politus willow, maple agrilus sayi bayberry, sweetfern agrilus vittaticolllis apple, pear, cranberry, serviceberry, hawthorn chrysobothris femorata apple, apricot, beech, boxelder, cherry, chestnut, currant, elm, buprestidae hawthorn, hackberry, hickory, horsechestnut, linden, maple, mountain-ash, oak, pecan, pear, peach, persimmon, plum, poplar, quince, redbud, serviceberry, sycamore, walnut, willow texania campestris basswood, beech, maple, oak, sycamore, willow, yellow-poplar goes pulverulentus beech, elm, nuttall, willow, black oak, cherrybark oak, water oak, sycamore cerambycidae goes tigrinus oak neoclytus acuminatus ash, hickory, oak, walnut, birch, beech, maple, eastern family species host or crop infested hophornbeam, dogwood, persimmon, redbud, holly, hackberry, black locust, honeylocust, yellow-poplar, chestnut, osage-orange, sassafras, lilac, mountain-mahogany, pear, cherry, plum, peach, apple, elm, basswood, sweetgum neoptychodes trilineatus fig, alder, mulberry, willow, netleaf hackberry oberea ocellata sumac, apple, peach, plum, pear, currant, blackberry oberea tripunctata dogwood, viburnum, elm, sourwood, blueberry, rhododendron, azalea, laurel, poplar, willow, mulberry oncideres cingulata hickory, pecan, persimmon, elm, sourwood, basswood, honeylocust, dogwood, eucalyptus, oak, hackberry, maple, fruit trees saperda calcarata poplar strophiona nitens chestnut, oak, hickory, walnut, beech, maple corthylus columbianus maple, oak, yellow-poplar, beech, boxelder, sycamore, birch, basswood, chestnut, elm dendroctonus frontalis pine dryocoetes betulae birch, sweetgum, wild cherry, scolytidae beech, pear monarthrum fasciatum oak, maple, birch, chestnut, sweetgum, blackgum, poplar, hickory, mimosa, apple, peach, pine phloeotribus liminaris peach, cherry, plum, black cherry, elm, mulberry, mountain-ash family species host or crop infested pseudopityophthorus pruinosus oak, american beech, black cherry, chickasaw plum, chestnut, maple, hickory, hornbeam, hophornbeam paranthrene simulans oak, american chestnut sannina uroceriformis persimmon synanthedon exitiosa peach, plum, nectarine, cherry, apricot, almond, black cherry synanthedon pictipes peach, plum, cherry, beach, black cherry sesiidae synanthedon rubrofascia tupelo synanthedon scitula dogwood, pecan, hickory, oak, chestnut, beech, birch, black cherry, elm, mountain-ash, viburnum, willow, apple, loquat, ninebark, bayberry vitacea polistiformis grape in the hygiene sector, the compositions according to the invention are active against ectoparasites such as hard ticks, soft ticks, mange mites, harvest mites, flies (biting and licking), parasitic fly larvae, lice, hair lice, bird lice and fleas. examples of such parasites are: of the order anoplurida: haematopinus spp., linognathus spp., pediculus spp. and phtirus spp., solenopotes spp.. of the order mallophagida: trimenopon spp., menopon spp., trinoton spp., bovicola spp., werneckiella spp., lepikentron spp., damalina spp., trichodectes spp. and felicola spp.. of the order diptera and the suborders nematocerina and brachycerina, for example aedes spp., anopheles spp., culex spp., simulium spp., eusimulium spp., phlebotomus spp., lutzomyia spp., culicoides spp., chrysops spp., hybomitra spp., atylotus spp., tabanus spp., haematopota spp., philipomyia spp., braula spp., musca spp., hydrotaea spp., stomoxys spp., haematobia spp., morellia spp., fannia spp., glossina spp., calliphora spp., lucilia spp., chrysomyia spp., wohlfahrtia spp., sarcophaga spp., oestrus spp., hypoderma spp., gasterophilus spp., hippobosca spp., lipoptena spp. and melophagus spp.. of the order siphonapterida, for example pulex spp., ctenocephalides spp., xenopsylla spp., ceratophyllus spp.. of the order heteropterida, for example cimex spp., triatoma spp., rhodnius spp., panstrongylus spp.. of the order blattarida, for example blatta orientalis, periplaneta americana, blattelagermanica and supella spp.. of the subclass acaria (acarida) and the orders meta- and meso-stigmata, for example argas spp., ornithodorus spp., otobius spp., ixodes spp., amblyomma spp., boophilus spp., dermacentor spp., haemophysalis spp., hyalomma spp., rhipicephalus spp., dermanyssus spp., raillietia spp., pneumonyssus spp., sternostoma spp. and varroa spp.. of the orders actinedida (prostigmata) and acaridida (astigmata), for example acarapis spp., cheyletiella spp., ornithocheyletia spp., myobia spp., psorergatesspp., demodex spp., trombicula spp., listrophorus spp., acarus spp., tyrophagus spp., caloglyphus spp., hypodectes spp., pterolichus spp., psoroptes spp., chorioptes spp., otodectes spp., sarcoptes spp., notoedres spp., knemidocoptes spp., cytodites spp. and laminosioptes spp.. the compositions according to the invention are also suitable for protecting against insect infestation in the case of materials such as wood, textiles, plastics, adhesives, glues, paints, paper and card, leather, floor coverings and buildings. the compositions according to the invention can be used, for example, against the following pests: beetles such as hylotrupes bajulus, chlorophorus pilosis, anobium punctatum, xestobium rufovillosum, ptilinuspecticornis, dendrobium pertinex, ernobius mollis, priobium carpini, lyctus brunneus, lyctus africanus, lyctus planicollis, lyctus linearis, lyctus pubescens, trogoxylon aequale, minthesrugicollis, xyleborus spec.,tryptodendron spec, apate monachus, bostrychus capucins, heterobostrychus brunneus, sinoxylon spec, and dinoderus minutus, and also hymenopterans such as sirex juvencus, urocerus gigas, urocerus gigas taignus and urocerus augur, and termites such as kalotermes flavicollis, cryptotermes brevis, heterotermes indicola, reticulitermes flavipes, reticulitermes santonensis, reticulitermes lucifugus, mastotermes darwiniensis, zootermopsis nevadensis and coptotermes formosanus, and bristletails such as lepisma saccharina. in one aspect, the invention therefore also relates to pesticidal compositions such as emulsifiable concentrates, suspension concentrates, microemulsions, oil dispersibles, directly sprayable or dilutable solutions, spreadable pastes, dilute emulsions, soluble powders, dispersible powders, wettable powders, dusts, granules or encapsulations in polymeric substances, which comprise - at least - one of the active ingredients according to any one of embodiments 1 to 34 and which are to be selected to suit the intended aims and the prevailing circumstances. in these compositions, the active ingredient is employed in pure form, a solid active ingredient for example in a specific particle size, or, preferably, together with - at least - one of the auxiliaries conventionally used in the art of formulation, such as extenders, for example solvents or solid carriers, or such as surface-active compounds (surfactants). examples of suitable solvents are: unhydrogenated or partially hydrogenated aromatic hydrocarbons, preferably the fractions cs to c12 of alkylbenzenes, such as xylene mixtures, alkylated naphthalenes or tetrahydronaphthalene, aliphatic or cycloaliphatic hydrocarbons, such as paraffins or cyclohexane, alcohols such as ethanol, propanol or butanol, glycols and their ethers and esters such as propylene glycol, dipropylene glycol ether, ethylene glycol or ethylene glycol monomethyl ether or ethylene glycol monoethyl ether, ketones, such as cyclohexanone, isophorone or diacetone alcohol, strongly polar solvents, such as n-methylpyrrolid-2-one, dimethyl sulfoxide or n,n- dimethylformamide, water, unepoxidized or epoxidized vegetable oils, such as unexpodized or epoxidized rapeseed, castor, coconut or soya oil, and silicone oils. solid carriers which are used for example for dusts and dispersible powders are, as a rule, ground natural minerals such as calcite, talc, kaolin, montmorillonite or attapulgite. to improve the physical properties, it is also possible to add highly disperse silicas or highly disperse absorbtive polymers. suitable adsorptive carriers for granules are porous types, such as pumice, brick grit, sepiolite or bentonite, and suitable non-sorptive carrier materials are calcite or sand. in addition, a large number of granulated materials of inorganic or organic nature can be used, in particular dolomite or comminuted plant residues. suitable surface-active compounds are, depending on the type of the active ingredient to be formulated, non-ionic, cationic and/or anionic surfactants or surfactant mixtures which have good emulsifying, dispersing and wetting properties. the surfactants mentioned below are only to be considered as examples; a large number of further surfactants which are conventionally used in the art of formulation and suitable according to the invention are described in the relevant literature. suitable non-ionic surfactants are, especially, polyglycol ether derivatives of aliphatic or cycloaliphatic alcohols, of saturated or unsaturated fatty acids or of alkyl phenols which may contain approximately 3 to approximately 30 glycol ether groups and approximately 8 to approximately 20 carbon atoms in the (cyclo)aliphatic hydrocarbon radical or approximately 6 to approximately 18 carbon atoms in the alkyl moiety of the alkyl phenols. also suitable are water-soluble polyethylene oxide adducts with polypropylene glycol, ethylenediaminopolypropylene glycol or alkyl polypropylene glycol having 1 to approximately 10 carbon atoms in the alkyl chain and approximately 20 to approximately 250 ethylene glycol ether groups and approximately 10 to approximately 100 propylene glycol ether groups. normally, the abovementioned compounds contain 1 to approximately 5 ethylene glycol units per propylene glycol unit. examples which may be mentioned are nonylphenoxypolyethoxyethanol, castor oil polyglycol ether, polypropylene glycol/polyethylene oxide adducts, tributylphenoxypolyethoxyethanol, polyethylene glycol or octylphenoxypolyethoxyethanol. also suitable are fatty acid esters of polyoxyethylene sorbitan, such as polyoxyethylene sorbitan trioleate. the cationic surfactants are, especially, quarternary ammonium salts which generally have at least one alkyi radical of approximately 8 to approximately 22 c atoms as substituents and as further substituents (unhalogenated or halogenated) lower alkyi or hydroxyalkyl or benzyl radicals. the salts are preferably in the form of halides, m ethyls ulfates or ethylsulfates. examples are stearyltrimethylammonium chloride and benzylbis(2-chloroethyl)ethylammonium bromide. examples of suitable anionic surfactants are water-soluble soaps or water-soluble synthetic surface- active compounds. examples of suitable soaps are the alkali, alkaline earth or (unsubstituted or substituted) ammonium salts of fatty acids having approximately 10 to approximately 22 c atoms, such as the sodium or potassium salts of oleic or stearic acid, or of natural fatty acid mixtures which are obtainable for example from coconut or tall oil; mention must also be made of the fatty acid methyl taurates. however, synthetic surfactants are used more frequently, in particular fatty sulfonates, fatty sulfates, sulfonated benzimidazole derivatives or alkylaryl sulfonates. as a rule, the fatty sulfonates and fatty sulfates are present as alkali, alkaline earth or (substituted or unsubstituted) ammonium salts and they generally have an alkyi radical of approximately 8 to approximately 22 c atoms, alkyi also to be understood as including the alkyi moiety of acyl radicals; examples which may be mentioned are the sodium or calcium salts of lignosulfonic acid, of the dodecylsulfuric ester or of a fatty alcohol sulfate mixture prepared from natural fatty acids. this group also includes the salts of the sulfuric esters and sulfonic acids of fatty alcohol/ethylene oxide adducts. the sulfonated benzimidazole derivatives preferably contain 2 sulfonyl groups and a fatty acid radical of approximately 8 to approximately 22 c atoms. examples of alkylarylsulfonates are the sodium, calcium or triethanolammonium salts of decylbenzenesulfonic acid, of dibutylnaphthalenesulfonic acid or of a naphthalenesulfonic acid/formaldehyde condensate. also possible are, furthermore, suitable phosphates, such as salts of the phosphoric ester of a p-nonylphenol/(4-14)ethylene oxide adduct, or phospholipids. as a rule, the compositions comprise 0.1 to 99%, especially 0.1 to 95%, of active ingredient and 1 to 99.9%, especially 5 to 99.9%, of at least one solid or liquid adjuvant, it being possible as a rule for 0 to 25%, especially 0.1 to 20%, of the composition to be surfactants(% in each case meaning percent by weight). whereas concentrated compositions tend to be preferred for commercial goods, the end consumer as a rule uses dilute compositions which have substantially lower concentrations of active ingredient. typically, a pre-mix formulation for foliar application comprises 0.1 to 99.9 %, especially 1 to 95 %, of the desired ingredients, and 99.9 to 0.1 %, especially 99 to 5 %, of a solid or liquid adjuvant (including, for example, a solvent such as water), where the auxiliaries can be a surfactant in an amount of 0 to 50 %, especially 0.5 to 40 %, based on the pre-mix formulation. normally, a tank-mix formulation for seed treatment application comprises 0.25 to 80%, especially 1 to 75 %, of the desired ingredients, and 99.75 to 20 %, especially 99 to 25 %, of a solid or liquid auxiliaries (including, for example, a solvent such as water), where the auxiliaries can be a surfactant in an amount of 0 to 40 %, especially 0.5 to 30 %, based on the tank-mix formulation. typically, a pre-mix formulation for seed treatment application comprises 0.5 to 99.9 %, especially 1 to 95 %, of the desired ingredients, and 99.5 to 0.1 %, especially 99 to 5 %, of a solid or liquid adjuvant (including, for example, a solvent such as water), where the auxiliaries can be a surfactant in an amount of 0 to 50 %, especially 0.5 to 40 %, based on the pre-mix formulation. whereas commercial products will preferably be formulated as concentrates (e.g., pre-mix composition (formulation)), the end user will normally employ dilute formulations (e.g., tank mix composition). preferred seed treatment pre-mix formulations are aqueous suspension concentrates. the formulation can be applied to the seeds using conventional treating techniques and machines, such as fluidized bed techniques, the roller mill method, rotostatic seed treaters, and drum coaters. other methods, such as spouted beds may also be useful. the seeds may be presized before coating. after coating, the seeds are typically dried and then transferred to a sizing machine for sizing. such procedures are known in the art. in general, the pre-mix compositions of the invention contain 0.5 to 99.9 especially 1 to 95, advantageously 1 to 50 %, by mass of the desired ingredients, and 99.5 to 0.1 , especially 99 to 5 %, by mass of a solid or liquid adjuvant (including, for example, a solvent such as water), where the auxiliaries (or adjuvant) can be a surfactant in an amount of 0 to 50, especially 0.5 to 40 %, by mass based on the mass of the pre-mix formulation. examples of foliar formulation types for pre-mix compositions are: gr: granules wp: wettable powders wg: water dispersable granules (powders) sg: water soluble granules sl: soluble concentrates ec: emulsifiable concentrate ew: emulsions, oil in water me: micro-emulsion sc: aqueous suspension concentrate cs: aqueous capsule suspension od: oil-based suspension concentrate, and se: aqueous suspo-emulsion. whereas, examples of seed treatment formulation types for pre-mix compositions are: ws: wettable powders for seed treatment slurry ls: solution for seed treatment es: emulsions for seed treatment fs: suspension concentrate for seed treatment wg: water dispersible granules, and cs: aqueous capsule suspension. examples of formulation types suitable for tank-mix compositions are solutions, dilute emulsions, suspensions, or a mixture thereof, and dusts. preferred compositions are composed in particular as follows (% emulsifiable concentrates: active ingredient: 1 to 95%, preferably 5 to 20% surfactant: 1 to 30%, preferably 10 to 20 % solvent: 5 to 98%, preferably 70 to 85% dusts: active ingredient: 0.1 to 10%, preferably 0.1 to 1 % solid carrier: 99.9 to 90%, preferably 99.9 to 99% suspension concentrates: active ingredient: 5 to 75%, preferably 10 to 50% water: 94 to 24%, preferably 88 to 30% surfactant: 1 to 40%, preferably 2 to 30% wettable powders: active ingredient: 0.5 to 90%, preferably 1 to 80% surfactant: 0.5 to 20%, preferably 1 to 15% solid carrier: 5 to 99%, preferably 15 to 98% granulates: active ingredient: 0.5 to 30%, preferably 3 to 15% solid carrier: 99.5 to 70%, preferably 97 to 85% examples: the following compounds according to embodiment 1 may be prepared according to the methods described herein or according to known methods, e.g. as disclosed in wo2017/108569. experimental the following examples are intended to illustrate the invention and are not to be construed as being limitations thereon. "mp" means melting point in °c. h nmr measurements were recorded on a brucker 400mhz spectrometer, chemical shifts are given in ppm relevant to a tms standard. spectra measured in deuterated solvents as indicated. preparation of 5-fluoro-3-methoxy-1-methyl-4-(trifluoromethyl)pyrazole a mixture of methylhydrazine (1.32 ml, 24.6 mmol) and triethylamine (3.15 ml, 22.4 mmol) in 12 ml of ethanol was added dropwise at 25°c-30°c to a solution of 1-methoxy-(perfluoro-2-methyl-1-propene) (3.32 ml, 22.4 mmol) in 8 ml of ethanol. the addition was exothermic and the reaction was stirred overnight at room temperature. the ethanol was carefully evaporated, residue was diluted with tert- butyl methyl ether, and the organic layer was washed with water, brine, dried over sodium sulfate, filtrated and evaporated to give the crude product as yellow oil. ή nmr (400 mhz, cdcis) δ ppm 3.61 (d, 3 h) 3.90 (s, 3 h). preparation of 5-(4-bromopyrazol-1-yl)-3-methoxy-1-methyl-4-(trifluoromethyl)pyrazole. under argon, 5-fluoro-3-methoxy-1-methyl-4-(trifluoromethyl)pyrazole (2.9 g, 1 1.7 mmol), 4-bromo- 1 h-pyrazole (2.1 1 g, 14.1 mmol) and potassium carbonate (3.43 g, 24.6 mmol) were dissolved in 35 ml thf. the yellow solution was heated over 3 days at 80°c. the mixture was then diluted with tert- butyl methyl ether, quenched with 15 ml of water, extracted 2 times with 20 ml of ieri-butyl methyl ether, the organic phase was washed with brine, dried over sodium sulfate, filtrated and evaporated. the crude resin obtained (4.76 g) was purified over silica to give 5-(4-bromopyrazol-1-yl)-3-methoxy- 1-methyl-4-(trifluoromethyl)pyrazole. ή nmr (400 mhz, cdcis) δ ppm 3.59 (s, 3 h) 3.98 (s, 3 h) 7.66 (s, 1 h) 7.77 (s, 1 h). synthesis of 2-chloro-5-[1-[5-methoxy-2-methyl-4-(trifluoromethvnpyrazol-3-yllpyrazol-4-yllbenzoic acid. in a 3-neck round bottom flask under argon, 5-(4-bromopyrazol-1-yl)-3-methoxy-1-methyl-4- (trifluoromethyl)pyrazole (1.81 g, 5.01 mmol), methyl 2-chloro-5-(4,4,5,5-tetramethyl-1 ,3,2- dioxaborolan-2-yl)benzoate (1.56 g, 5.26 mmol) and sodium hydrogen carbonate 1 m (15 ml, 15 mmol) were dissolved in 30 ml of 2-propanol. the mixture was purged with argon for 5 min. after that, tetrakis(triphenylphosphine)palladium(0) (177 mg, 0.15 mmol) was added and the mixture was heated at 100°c overnight. the mixture was filtrated, evaporated, diluted with ethyl acetate, quenched with 10 ml of sodium hydroxide 2n, and extracted 2 times with ethyl acetate. the water phase was acidified to ph 2 using hydrochloride acid 10% and extracted 3 times with 20 ml of ethyl acetate, the organic phase was washed with brine, dried over sodium sulfate, filtrated and evaporated to give 2-chloro-5-[1-[5-methoxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]pyrazol-4- yl]benzoic acid as a yellow resin. ή nmr (400 mhz, cdci3) δ ppm 3.62 - 3.68 (m, 3 h) 4.00 (s, 3 h) 7.52 - 7.56 (m, 1 h) 7.60 - 7.64 (m, 1 h) 7.91 (s, 1 h) 8.11 (d, 1 h) 8.14 (d, 1 h). preparation of 2-chloro-5-[1-[5-hvdroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yllpyrazol-4-yllbenzoic acid. 2-chloro-5-[1-[5-methoxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]pyrazol-4-yl]benzoic acid (1.99 g, 4.57 mmol) in a 33% solution hbr in acoh (12.4 ml) was stirred under argon in a thick glass microwave tube. the colorless solution was heated at 60°c overnight. after dilution with ieri-butyl methyl ether, the solution was quenched with saturated sodium hydrogen carbonate. the water phase was acidified to ph 2 with 10% hci and extracted with 3 times with 20 ml of ethyl acetate; the organic phase was washed with brine, dried over sodium sulfate, filtrated and evaporated. the crude beige product was purified to give 2-chloro-5-[1-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol-3- yl]pyrazol-4-yl] benzoic acid as white crystals. ή nmr (400 mhz, cd 3 od) δ ppm 3.28 - 3.36 (m, 3 h) 3.51 - 3.56 (m, 3 h) 7.54 (d, 1 h) 7.78 (dd, 1 h) 8.1 1 (d, 1 h) 8.28 (s, 1 h) 8.40 (s, 1 h) preparation of 2-chloro-n-cvclopropyl-5-[1-[5-hvdroxy-2-methyl-4-(trifluoromethvnpyrazol-3- yllpyrazol-4-yllbenzamide. to a solution of 2-chloro-5-[1-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]pyrazol-4-yl]benzoic acid (200 mg) in dimethylformamide (1.55 ml) was added carbonyldiimidazole (102 mg). the resulting solution was stirred at room temperature for 30 min then cyclopropylamine (0.07 ml) was added. the resulting solution was stirred at room temperature for 2 hours then allowed to stand overnight. the reaction mixture was then diluted with ethyl acetate and poured on water. the aqueous phase was extracted twice with ethyl acetate. the organic phase was extracted with water and with brine then they were combined, dried over magnesium sulfate, filtered and concentrated under vacuo to give 2-chloro-n-cyclopropyl-5-[1-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]pyrazol-4- yl]benzamide (171 mg) as a crude solid. ή nmr (400 mhz, cdci3) δ ppm 0.56 - 0.75 (m, 2 h) 0.80 - 1.03 (m, 2 h) 2.92 - 3.01 (m, 1 h) 3.68 (s, 3 h) 6.34 - 6.55 (m, 1 h) 7.43 (d, 1 h) 7.47 - 7.57 (m, 1 h) 7.86 (d, 1 h) 7.93 (s, 1 h) 8.10 (s, 1 h) 9f nmr (377 mhz, cdci3) δ ppm -56.22 (s, 1 f) preparation of 2-chloro-n-(1-cvanocvclopropyl)-5-[1-[5-hvdroxy-2-methyl-4-(trifluoromethyl)pyrazol-3- yllpyrazol-4-yllbenzamide. a mixture of 2-chloro-5-[1-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]pyrazol-4-yl]benzoic acid (300 mg, 0.698 mmol), 3-(ethyliminomethylideneamino)-n,n-dimethylpropan-1- amine;hydrochloride (150 mg, 0.768 mmol), 1-amino-1-cyano-cyclopropane-hci (211 mg, 1.75 mmol) and 3-hydroxytriazolo[4,5-b]pyridine (107 mg, 0.768 mmol) in 10 ml of dichloromethane was stirred at room temperature. to this yellow solution was added 4-dimethylaminopyridine (215 mg, 1.75 mmol) and mixture was stirred overnight at room temperature until complete conversion. the mixture was diluted with dichloromethane, quenched with hci 2n, the organic phase was washed successively with water and once with brine, dried over mgsc , filtrated and evaporated to give after a purification on silica gel 2-chloro-n-(1-cyanocyclopropyl)-5-[1-[5-hydroxy-2-methyl-4- (trifluoromethyl)pyrazol-3-yl]pyrazol-4-yl]benzamide as a white solid. ή nmr (400 mhz, cd 3 od) δ ppm 1.27 - 1.31 (m, 2 h) 1.48 - 1.52 (m, 2 h) 3.42 (s, 3 h) 7.40 (d, 1 h) 7.63 - 7.67 (m, 2 h) 8.18 (d, 1 h) 8.29 (s, 1 h) similarly to the last two examples, the following compounds were prepared: 2-chloro-n-(1-cvanocvclopropyl)-5-[1-[5-hvdroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yllpyrazol-4- yll-n-methyl-benzamide ή nmr (400 mhz, cdci3) δ ppm 1.32 - 1.85 (m, 4 h) 2.93 - 3.03 and 3.26 (2xm, 3 h) 3.69 (m, 3 h) 7.38 - 8.40 (m, 5 h). 9f nmr (377 mhz, cdci3) δ ppm -56.25 - -56.20 (m, 3 f) 2-chloro-n-cvclopropyl-5-[1-[5-hvdroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yllpyrazol-4-yll-n- methyl-benzamide ή nmr (400 mhz, cdci3) δ ppm 0.45 - 1.05 (m, 4 h) 2.74 - 2.84 and 2.94 (2xm, 2 h) 3.16 and 3.50 (2xs, 3 h) 3.69 (s, 3 h) 7.41 - 7.52 (m, 3 h) 7.90 (s, 1 h) 8.08 (s, 1 h) 19f nmr (377 mhz, cdci3) δ ppm -56.17 (s, 3 f) 2-chloro-n-cvclopropyl-n-ethyl-5-[1-[5-hvdroxy-2-methyl-4-(trifluoromethvnpyrazol-3-yllpyrazol-4- yllbenzamide ή nmr (400 mhz, cd 3 od) δ ppm 0.52 - 1.02 (m, 4 h) 1.16 - 1.35 (m, 3 h) 2.77 - 2.90 and 3.12 - 3.29 (2xm, 1 h) 3.42 - 3.87 (m, 5 h) 7.50 (m, 1 h) 7.64 - 7.75 (m, 2 h) 8.25 - 8.53 (m, 2 h) 9f nmr (377 mhz, cd3od) δ ppm -58.13 (s, 3 f) example 1 : preparation of 5-[4-[4-chloro-3-[(1-cvanocvclopropyncarbamoyllphenyllpyrazol-1-yll-1- methyl-4-(trifluoromethvdpyrazol-3-vh 1 ,1 ,2,2,2-pentafluoroethanesulfonate to a solution of 2-chloro-n-(1-cyanocyclopropyl)-5-[1-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol- 3-yl]pyrazol-4-yl]benzamide (100 mg) in acetonitrile (0.88 ml) was added potassium carbonate (61 mg) followed by a dropwise addition of pentafluoroethanesulfonyl chloride (100 mg) at room temperature. the reaction mixture was stirred at room temperature for 1 hour and was then filtered. the resulting filtrate was concentrated under vacuo and purified on silica gel (eluant : cyclohexane/ethyl acetate, 6:4) to give 5-[4-[4-chloro-3-[(1- cyanocyclopropyl)carbamoyl]phenyl]pyrazol-1-yl]-1-methyl-4-(trifluoromethyl)pyrazol-3-yl] 1 , 1 ,2,2,2- pentafluoroethanesulfonate. 1 h nmr (400 mhz, cdci3) δ ppm 1.36 - 1.50 (m, 2 h) 1.59 - 1.76 (m, 2 h) 3.84 (s, 3 h) 6.99 (bs, 1 h) 7.46 (d, 1 h) 7.56 (dd, 1 h) 7.93 (d, 1 h) 7.99 (s, 1 h) 8.15 (s, 1 h) 19f nmr (377 mhz, cdci3) δ ppm -1 12.42 (s, 2 f) -79.06 (s, 3 f) -56.13 (s, 3 f), preparation of methyl 2-chloro-5-(1-tetrahvdropyran-2-ylpyrazol-4-yl)benzoate to a solution of 4-bromo-1-tetrahydropyran-2-yl-pyrazole (0.108 g) in isopropanol (7 ml) was added methyl 2-chloro-5-(4,4,5,5-tetramethyl-1 ,3,2-dioxaborolan-2-yl)benzoate (0.1386 g) and an aqueous solution of sodium bicarbonate (1 m, 1.4 ml). the reaction mixture was degassed with argon and then tetrakis(triphenylphosphine) palladium (0) was added (16.2 mg). the reaction mixture was then heated to 100°c for 4 hours and cooled down to room temperature. the reaction mixture was partitioned between water and acoet. the aqueous phase was extracted with acoet twice, the combined organic layers were dried on na2s04 and concentrated under vacuum. the crude material was purified by flash chromatography (cyclohexane / acoet) to give methyl 2-chloro-5-(1- tetrahydropyran-2-ylpyrazol-4-yl)benzoate as a colourless oil. 1 h nmr (400 mhz, cdcb)□ ppm 1.58 - 1.79 (m, 4 h) 2.09 - 2.18 (m, 2 h) 3.68 - 3.79 (m, 1 h) 3.95 (s, 3 h) 4.05 - 4.15 (m, 1 h) 5.38 - 5.44 (m, 1 h) 7.43 (d, 1 h) 7.52 (dd, 1 h) 7.82 (s, 1 h) 7.90 (s, 1 h) 7.93 (d, 1 h). preparation of methyl 2-chloro-5-(1 h-pyrazol-4-yl)benzoate to a solution of methyl 2-chloro-5-(1-tetrahydropyran-2-ylpyrazol-4-yl)benzoate (2.5 g) in tetrahydrofuran (31 ml) was added concentrated hydrochloric acid (36% in water, 2.3 ml). the reaction mixture was stirred at 55°c for 30 minutes and cooled down to room temperature. the reaction mixture was diluted with acoet, washed with saturated aqueous nahcch and with brine. the combined organic layers were dried over na2s04 and concentrated under vacuum. the crude material was purified by flash chromatography (cyclohexane / acoet) to give methyl 2-chloro-5-(1 h- pyrazol-4-yl)benzoate as a white solid. 1 h nmr (400 mhz, cdcis)□ ppm 3.97 (s, 3 h) 7.45 (d, 1 h) 7.55 (dd, 1 h) 7.90 (s, 2 h) 7.96 (d, 1 h). preparation of 2-chloro-5-(1 h-pyrazol-4-yl)benzoic acid methyl 2-chloro-5-(1 h-pyrazol-4-yl)benzoate (2 g) was dissolved in dioxane (10 ml) and water (4 ml). naoh pellets (0.372 g) were added at r.t. and the reaction mixture was stirred overnight at r.t. the reaction mixture was then concentrated under vacuum and diluted with some water. this basic solution was washed with methyl tert-butyl ether and was then acidified with hci 1 n. precipitation of 2-chloro-5-(1 h-pyrazol-4-yl)benzoic acid occurred. the solid was rinsed with water and dried on the filter. the solid was redissolved in ch2cl2/methanol and dried on mgsc . the solution was then concentrated under vacuum to give 2-chloro-5-(1 h-pyrazol-4-yl)benzoic acid as white crystals. melting point: 227-229°c preparation of 2-chloro-n-cvclopropyl-5-(1 h-pyrazol-4-yl)benzamide 2-chloro-5-(1 h-pyrazol-4-yl)benzoic acid (825 mg) was dissolved in dma (3 ml). then cyclopropylamine (0.280 ml), hiinig's base (1 .59 ml) were added at r.t. and the reaction mixture was stirred at r.t. for 10 minutes. the mixture was cooled down with an icebath and bop-ci (1.037 g) was added in 1 portion. the icebath was removed and the light suspension stirred for 8h at 55°c then at r.t. overnight. as the reaction was not completed, cyclopropylamine (0.127 ml), huenig's base (0.318 ml) and bop-ci (0.471 g) were added and the reaction mixture was heated again to 55°c for 6 hours. the reaction mixture was poured into water. the precipitation of white crystals occurred. after stirring for 10 minutes, the solid was filtered off and dried on filter. it was triturated in petrol ether to provide 2-chloro-n-cyclopropyl-5-(1 h-pyrazol-4-yl)benzamide as white crystals. melting point: 102-103°c. preparation of 5-methoxy-2-methyl-4-(trifluoromethyl)pyrazole-3-carbonitrile 5-fluoro-3-methoxy-1-methyl-4-(trifluoromethyl)pyrazole (20.0 g) and potassium cyanide (19.7 g) were dissolved in mecn (150 ml) and the mixture was heated under reflux for 16 h. after cooling, the precipitate was filtered off and concentrated. column chromatography afforded title compound as colorless oil (13.2g). ή nmr (400 mhz, cdcis) δ 3.98 (s, 3h), 3.94 (s, 3h). 9 f nmr (283 mhz, preparation of 5-methoxv-2-methvl-4-(trifluoromethvl)pvrazole-3-carbaldehyde a solution of diisobutylaluminum hydride in toluene (1.5 m, 42 ml) was added into a chilled (-40 °c) solution of 5-methoxy-2-methyl-4-(trifluoromethyl)pyrazole-3-carbonitrile (13.0 g) in toluene (100 ml) after 10 min the cooling bath was removed and the reaction was stirred at room temperature for 2 h followed by careful addition of 2 n hci (40 ml). the mixture was stirred at room temperature for 45 min then poured into water and extracted with ethyl acetate three times, the organic combined phases were dried over sodium sulfate and concentrated. column chromatography afforded title compound as yellow oil (7.6 g). preparation of (3e)-5-methoxv-2-methvl-4-(trifluoromethvnpvrazole-3-carbaldehyde oxime to a solution of 5-methoxy-2-methyl-4-(trifluoromethyl)pyrazole-3-carbaldehyde (7.2 g) in ethanol (80 ml) was added sodium bicarbonate (8.72 g) and hydroxylamine hydrochloride (4.81 g). the mixture was stirred at room temperature for 4 h. the reaction mixture was poured into water. the resulting crystals were collected by filtration, washed with water and dried to obtain title compound as a white powder (6.4 g). ή nmr (400 mhz, dmso-d 6 ) 512.23 - 12.22 (m, 1 h), 8.1 1 - 7.62 (m, 2h), 3.99 - 3.51 (m, 6h). 9 f nmr (283 mhz, dmso-d 6 ) δ -52.63—51.12 (m, 3f). preparation of (3z)-n-hvdroxy-5-methoxy-2-methyl-4-(trifluoromethyl)pyrazole-3-carboximidoyl chloride (3e)-5-methoxy-2-methyl-4-(trifluoromethyl)pyrazole-3-carbaldehyde oxime (6 g) was mixed n- chlorosuccinimide (3.77 g) in dmf (40.0 ml) and stirred at room temperature for 2 h. the reaction mixture was poured into water and extracted with ethyl acetate two times. the combined organic layers were dried over sodium sulfate, filtered and concentrated under vacuum to give title compound as yellow oil (6.2 g). ή nmr (400 mhz, dmso-d 6 ) δ 13.34 (s, 1 h), 3.90 (s, 3h), 3.73 (s, 3h). 9 f nmr (283 mhz, dmso-d 6 ) δ -52.48 (s, 3f). preparation of methyl 2-chloro-5-[3-[5-methoxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]isoxazol-5- yl]benzoate to a solution of (3e)-5-methoxy-2-methyl-4-(trifluoromethyl)pyrazole-3-carbaldehyde oxime (5.7g) and methyl 2-chloro-5-ethynyl-benzoate (5.47 g) in dichloromethane (60 ml) was added triethylamine (5.17g). the mixture was stirred at room temperature for 16 h. the reaction mixture was poured into water and extracted with dichloromethane twice, the combined organic layers were dried over sodium sulfate and concentrated. column chromatography afforded title compound as a white solid (4.5 g). ή nmr (400 mhz, cdcis) δ 8.28 (s, 1 h), 7.88 (d, j = 8.0 hz, 1 h), 7.61 (d, j = 8.4 hz, 1 h), 6.78 (s, 1 h), 4.00 (d, j = 3.5 hz, 6h), 3.89 (s, 3h). 9 f nmr (283 mhz, preparation of 2-chloro-5-[3-[5-methoxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]isoxazol-5-yl]benzoic acid to a stirred solution of methyl 2-chloro-5-[3-[5-methoxy-2-methyl-4-(trifluoromethyl)pyrazol-3- yl]isoxazol-5-yl]benzoate (2.1 g) in thf (10 ml) was added sodium hydroxide (77 mg) and water (3 ml). the reaction mixture was stirred at room temperature for 2 h. the ph value was adjusted to 2 with concentrated hci. the reaction mixture was extracted with ethyl acetate three times. the organic layers were dried over anhydrous sodium sulfate. after filtration and concentrated under vacuum title compound was obtained as a yellow powder (2.1 g). preparation of 2-chloro-5-[3-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]isoxazol-5-yl]benzoic acid to 20 ml of a 33 wt.% hydrogen bromide acetic acid solution was added 2-chloro-5-[3-[5-methoxy-2- methyl-4-(trifluoromethyl)pyrazol-3-yl]isoxazol-5-yl]benzoic acid (1.8 g). the mixture was stirred at 60 °c for 12 h. the reaction mixture was poured into water. the resulting crystals were collected by filtration, washed with water and dried to obtain title compound as a grey powder (1.6g). h nmr (400 mhz, dmso-d 6 ) δ 13.77 (s, 1 h), 11.19 (s, 1 h), 8.34 (s, 1 h), 8.10 (d, j = 8.3 hz, 1 h), 7.78 (d, j = 8.3 hz, 1 h), 7.58 (s, 1 h), 3.71 (s, 3h). 9 f nmr (283 mhz, dmso-d 6 ) δ -61.33 (s, 3 f). preparation of 2-chloro-n-(1-cvanocvclopropyn-5-[3-[5-hvdroxy-2-methyl-4-(trifluoromethvnpyrazol-3- yllisoxazol-5-yll-n-methyl-benzamide to a stirred solution of 2-chloro-5-[3-[5-hydroxy-2-methyl-4-(trifluoromethyl)pyrazol-3-yl]isoxazol-5- yl]benzoic acid (0.300 g), 1-(methylamino)cyclopropanecarbonitrile hydrochloride (0.154 g) and hatu (0.441 g) in dmf (10 ml) was added n,n-diisopropylethylamine (0.300 g). the mixture was stirred at room temperature for 16 h. the reaction mixture was poured into water and extracted with ethyl acetate twice. the combined organic layers were dried over sodium sulfate and concentrated. column chromatography afforded title product as a white powder (0.14 g). h nmr (400 mhz, dmso-d 6 ) δ 11.19 (s, 1 h), 8.07 (m, 2h), 7.78 (m, 1 h), 7.53 (s, 1 h), 3.70 (s, 3h), 2.86 (s, 3h), 1.69 (m, 2h), 1.52 (m, 2h). 9 f nmr (283 mhz, dmso-d 6 ) δ -61.52 (d, j = 15.6 hz, 3 f). example 37: preparation of [5-[5-[4-chloro-3-[(1-cvanocvclopropyl)-methyl- carbamoyllphenyllisoxazol-3-yll-1-methyl-4-(trifluoromethyl)pyrazol-3-yll 1 ,1 ,1 ,2,3,3,3- heptafluoropropane-2-sulfonate to a stirred solution of 2-chloro-n-(1-cyanocyclopropyl)-5-[3-[5-hydroxy-2-methyl-4- (trifluoromethyl)pyrazol-3-yl]isoxazol-5-yl]-n-methyl-benzanriide (0.100 g) and potassium carbonate (0.0890 g) in tetrahydrofuran (15 ml) was added 1 , 1 , 1 ,2,3,3,3-heptafluoropropane-2-sulfonyl fluoride (0.108 g). then the reaction was stirred at 70 °c for 24 hours. the reaction mixture were poured into water and extracted with ethyl acetate twice. the combined organic phases were dried over sodium sulfate and concentrated. column chromatography afforded title product as a yellow oil (0.08g). h nmr (400 mhz, cdcis) δ 7.99 - 7.82 (m, 2h), 7.70 - 7.52 (m, 1 h), 6.88 (d, j = 23.6 hz, 1 h), 4.07 (s, 3h), 3.26 - 2.98 (m, 3h), 1.50 (m, 2h), 1 .37 (m, 2h). 9 f nmr (283 mhz, cdci3) δ -64.00 (d, j = 32.0 hz, 3 f), -80.32 (d, j = 6.4 hz, 6 f), -175.06 (s, 1 f). preparation of 1 , 1 , 1 ,2,3,3,3-heptafluoropropane-2-sulfonyl fluoride to a solution of kf (4.6 g) in 40 ml of sulfolane in a 250 ml steel autoclave, sulphuryl fluoride (51 g) and perfluoropropene (57.6 g) were loaded below -100°c. after the addition the reaction mixture was heated to 140°c for about 4h. subsequently the reaction mixture was cooled and distilled at atmospheric pressure. title compound (43g) was obtained within the boiling range of 0-39 °c as a colorless liquid. 9 f nmr (282mz, cdci3): δ 46.2 (d, j=5.6hz, 1 f), -81 .1 (m, 6f), -176.1 (d, j=7.8hz, 1 f). the following compounds in table 1 were prepared in analogy with example 1 and 37. table 1 : examples of compounds of formula (i) ex. structure nmr data no. 1 h nmr (400 mhz, cd30d) δ ppm 1.32 - 1.45 (m, 2 h) 1.53 - 1.69 (m, 2 h) 3.79 (s, 3 h) 7.53 (d, 1 h) 7.74 - 7.83 (m, 2 h) 8.37 (d, 1 h) 8.51 (s, 1 h) 19f nmr (377 mhz, cd30d) δ ppm - 166.93 (s, 1 f) -72.85 (s, 6 f) -58.02 (s, 3 f) 1 h nmr (400 mhz, cd30d) δ ppm 1.32 - 1.45 (m, 2 h) 1.53 - 1.69 (m, 2 h) 3.79 (s, 3 h) 7.53 (d, 1 h) 7.74 - 7.83 (m, 2 h) 8.37 (d, 1 h) 8.51 (s, 1 h) 19f nmr (377 mhz, cd30d) δ ppm - 166.93 (s, 1 f) -72.85 (s, 6 f) -58.02 (s, 3 f) 1 h nmr (400 mhz, cdci3) δ ppm 0.61 - 0.73 (m, 2 h) 0.84 - 0.96 (m, 2 h) 2.85 - 3.02 (m, 1 h) 3.85 (s, 3 h) 6.35 - 6.57 (m, 1 h) 7.44 (d, 1 h) 7.49 - 7.52 (m, 1 h) 7.85 (d, 1 h) 7.95 (s, 1 h) 8.14 (s, 1 h) 19f nmr (377 mhz, cdci3) δ ppm - 56.34 (s, 3 f) 43.00 (s, 1 f) 1 h nmr (400 mhz, cdci3) δ ppm 0.61 - 0.77 (m, 2 h) 0.85 - 0.98 (m, 2 h) 2.93- 2.97 (m, 1 h) 3.83 (s, 3 h) 6.44 (br s, 1 h) 7.36 - 7.46 (m, 1 h) 7.47 - 7.57 (m, 1 h) 7.85 (d, 1 h) 7.95 (s, 1 h) 8.07 - 8.18 (m, 1 h) 19f nmr (377 mhz, cdci3) δ ppm - 165.91 (m, 1 f) -71.27 (s, 6 f) -56.21 (s, 3 f) h) - h) - - (s, 2 h) - (s, 2 h) 1 h) - (s, h) - - (s, h) - - 2 h) - - - (s, - - 1h nmr(400 mhz, cd30d) δ ppm 8.51 (s, 1 h)8.38(s, 1 h)7.78- 8.00 (m, 2 h) 7.58- 7.66 (m, 1 h)4.35- 4.79 (m, 2 h)3.79 (s, 3 h) 1.37 - 1.87 (m,4h) 19f nmr(377 mhz, cd30d) δ ppm -57.97 (s, 3 f) -72.84 (s, 6 f) - 166.94 (s, 1 f) 1h mr (400 mhz, cd30d) δ ppm 8.51 (br s, 1 h)8.38(s, 1 h)7.77 -7.94 (m, 2 h) 7.54- 7.64 (m, 1 h) 4.02 -4.76 (m, 2 h)3.79 (s, 3 h) 2.86-2.92 (m, 1 h) 1.47 - 1.82 (m, 4 h) 19f nmr(377 mhz, cd30d) δ ppm -57.99 (s, 3 f) -72.85 (s, 6 f) - 166.93 (s, 1 f) 1h nmr(400 mhz, cd30d) δ ppm 8.50 (s, 1 h)8.36(s, 1 h)7.73- 7.77 (m, 2 h) 7.46 (d, 1 h)4.15(q, 2 h)3.79 (s, 3 h) 1.80 - 1.93 (m,2h) 1.52- 1.67 (m,2h)1.07 (t, 3 h) 19f nmr(377 mhz, cd30d) δ ppm -57.98 (s, 3 f) -72.84 (s, 6 f) - 166.93 (m, 1 f) 1h nmr(400 mhz, cd30d) δ ppm 8.50 (s, 1 h)8.37 (s, 1 h)7.73- 7.77 (m, 2 h)7.47 (d, 1 h)3.79 (s, 3 h) 3.75 (s, 3 h) 1.87 (d, 2 h) 1.60 (brd, 2 h) 19f nmr(377 mhz, cd30d) δ ppm -58.01 (s, 3 f) -72.85 (s, 6 f) - 166.94 (s, 1 f) the activity of the compositions according to the invention can be broadened considerably, and adapted to prevailing circumstances, by adding other insecticidally, acaricidally and/or fungicidally active ingredients. the mixtures of the compounds according to any one of embodiments 1 to 34 with other insecticidally, acaricidally and/or fungicidally active ingredients may also have further surprising advantages which can also be described, in a wider sense, as synergistic activity. for example, better tolerance by plants, reduced phytotoxicity, insects can be controlled in their different development stages or better behaviour during their production, for example during grinding or mixing, during their storage or during their use. suitable additions to active ingredients here are, for example, representatives of the following classes of active ingredients: organophosphorus compounds, nitrophenol derivatives, thioureas, juvenile hormones, formamidines, benzophenone derivatives, ureas, pyrrole derivatives, carbamates, pyrethroids, chlorinated hydrocarbons, acylureas, pyridylmethyleneamino derivatives, macrolides, neonicotinoids and bacillus thuringiensis preparations. the following mixtures of the compounds according to any one of embodiments 1 to 34 with active ingredients are preferred (the abbreviation "tx" means "one compound selected from the compounds according to any one of embodiments 1 to 34, preferably embodiment 34): an adjuvant selected from the group of substances consisting of petroleum oils (alternative name) (628) + tx, an acaricide selected from the group of substances consisting of 1 , 1-bis(4-chlorophenyl)-2- ethoxyethanol (lupac name) (910) + tx, 2,4-dichlorophenyl benzenesulfonate (lupac/chemical abstracts name) (1059) + tx, 2-fluoro-a/-methyl-a/-1-naphthylacetamide (lupac name) (1295) + tx, 4-chlorophenyl phenyl sulfone (lupac name) (981 ) + tx, abamectin (1 ) + tx, acequinocyl (3) + tx, acetoprole [ccn] + tx, acrinathrin (9) + tx, aldicarb (16) + tx, aldoxycarb (863) + tx, alpha-cypermethrin (202) + tx, amidithion (870) + tx, amidoflumet [ccn] + tx, amidothioate (872) + tx, amiton (875) + tx, amiton hydrogen oxalate (875) + tx, amitraz (24) + tx, aramite (881 ) + tx, arsenous oxide (882) + tx, avi 382 (compound code) + tx, az 60541 (compound code) + tx, azinphos-ethyl (44) + tx, azinphos-methyl (45) + tx, azobenzene (lupac name) (888) + tx, azocyclotin (46) + tx, azothoate (889) + tx, benomyl (62) + tx, benoxafos (alternative name) [ccn] + tx, benzoximate (71 ) + tx, benzyl benzoate (lupac name) [ccn] + tx, bifenazate (74) + tx, bifenthrin (76) + tx, binapacryl (907) + tx, brofenvalerate (alternative name) + tx, bromocyclen (918) + tx, bromophos (920) + tx, bromophos-ethyl (921 ) + tx, bromopropylate (94) + tx, buprofezin (99) + tx, butocarboxim (103) + tx, butoxycarboxim (104) + tx, butylpyridaben (alternative name) + tx, calcium polysulfide (lupac name) (1 1 1 ) + tx, camphechlor (941 ) + tx, carbanolate (943) + tx, carbaryl (1 15) + tx, carbofuran (1 18) + tx, carbophenothion (947) + tx, cga 50'439 (development code) (125) + tx, chinomethionat (126) + tx, chlorbenside (959) + tx, chlordimeform (964) + tx, chlordimeform hydrochloride (964) + tx, chlorfenapyr (130) + tx, chlorfenethol (968) + tx, chlorfenson (970) + tx, chlorfensulfide (971 ) + tx, chlorfenvinphos (131 ) + tx, chlorobenzilate (975) + tx, chloromebuform (977) + tx, chloromethiuron (978) + tx, chloropropylate (983) + tx, chlorpyrifos (145) + tx, chlorpyrifos-methyl (146) + tx, chlorthiophos (994) + tx, cinerin i (696) + tx, cinerin ii (696) + tx, cinerins (696) + tx, clofentezine (158) + tx, closantel (alternative name) [ccn] + tx, coumaphos (174) + tx, crotamiton (alternative name) [ccn] + tx, crotoxyphos (1010) + tx, cufraneb (1013) + tx, cyanthoate (1020) + tx, cyflumetofen (cas reg. no.: 400882-07-7) + tx, cyhalothrin (196) + tx, cyhexatin (199) + tx, cypermethrin (201 ) + tx, dcpm (1032) + tx, ddt (219) + tx, demephion (1037) + tx, demephion-0 (1037) + tx, demephion-s (1037) + tx, demeton (1038) + tx, demeton-methyl (224) + tx, demeton-0 (1038) + tx, demeton-o-methyl (224) + tx, demeton-s (1038) + tx, demeton-s-methyl (224) + tx, demeton-s-methylsulfon (1039) + tx, diafenthiuron (226) + tx, dialifos (1042) + tx, diazinon (227) + tx, dichlofluanid (230) + tx, dichlorvos (236) + tx, dicliphos (alternative name) + tx, dicofol (242) + tx, dicrotophos (243) + tx, dienochlor (1071 ) + tx, dimefox (1081 ) + tx, dimethoate (262) + tx, dinactin (alternative name) (653) + tx, dinex (1089) + tx, dinex- diclexine (1089) + tx, dinobuton (269) + tx, dinocap (270) + tx, dinocap-4 [ccn] + tx, dinocap-6 [ccn] + tx, dinocton (1090) + tx, dinopenton (1092) + tx, dinosulfon (1097) + tx, dinoterbon (1098) + tx, dioxathion (1 102) + tx, diphenyl sulfone (lupac name) (1 103) + tx, disulfiram (alternative name) [ccn] + tx, disulfoton (278) + tx, dnoc (282) + tx, dofenapyn (1 1 13) + tx, doramectin (alternative name) [ccn] + tx, endosulfan (294) + tx, endothion (1 121 ) + tx, epn (297) + tx, eprinomectin (alternative name) [ccn] + tx, ethion (309) + tx, ethoate-m ethyl (1 134) + tx, etoxazole (320) + tx, etrimfos (1 142) + tx, fenazaflor (1 147) + tx, fenazaquin (328) + tx, fenbutatin oxide (330) + tx, fenothiocarb (337) + tx, fenpropathrin (342) + tx, fenpyrad (alternative name) + tx, fenpyroximate (345) + tx, fenson (1 157) + tx, fentrifanil (1 161 ) + tx, fenvalerate (349) + tx, fipronil (354) + tx, fluacrypyrim (360) + tx, fluazuron (1 166) + tx, flubenzimine (1 167) + tx, flucycloxuron (366) + tx, flucythrinate (367) + tx, fluenetil (1 169) + tx, flufenoxuron (370) + tx, flumethrin (372) + tx, fluorbenside (1 174) + tx, fluvalinate (1 184) + tx, fmc 1 137 (development code) (1 185) + tx, formetanate (405) + tx, formetanate hydrochloride (405) + tx, formothion (1 192) + tx, formparanate (1 193) + tx, gamma-hch (430) + tx, glyodin (1205) + tx, halfenprox (424) + tx, heptenophos (432) + tx, hexadecyl cyclopropanecarboxylate (lupac/chemical abstracts name) (1216) + tx, hexythiazox (441 ) + tx, iodomethane (lupac name) (542) + tx, isocarbophos (alternative name) (473) + tx, isopropyl 0-(methoxyaminothiophosphoryl)salicylate (lupac name) (473) + tx, ivermectin (alternative name) [ccn] + tx, jasmolin i (696) + tx, jasmolin ii (696) + tx, jodfenphos (1248) + tx, lindane (430) + tx, lufenuron (490) + tx, malathion (492) + tx, malonoben (1254) + tx, mecarbam (502) + tx, mephosfolan (1261 ) + tx, mesulfen (alternative name) [ccn] + tx, methacrifos (1266) + tx, methamidophos (527) + tx, methidathion (529) + tx, methiocarb (530) + tx, methomyl (531 ) + tx, methyl bromide (537) + tx, metolcarb (550) + tx, mevinphos (556) + tx, mexacarbate (1290) + tx, milbemectin (557) + tx, milbemycin oxime (alternative name) [ccn] + tx, mipafox (1293) + tx, monocrotophos (561 ) + tx, morphothion (1300) + tx, moxidectin (alternative name) [ccn] + tx, naled (567) + tx, nc-184 (compound code) + tx, nc-512 (compound code) + tx, nifluridide (1309) + tx, nikkomycins (alternative name) [ccn] + tx, nitrilacarb (1313) + tx, nitrilacarb 1 :1 zinc chloride complex (1313) + tx, nni-0101 (compound code) + tx, nni-0250 (compound code) + tx, omethoate (594) + tx, oxamyl (602) + tx, oxydeprofos (1324) + tx, oxydisulfoton (1325) + tx, pp'-ddt (219) + tx, parathion (615) + tx, permethrin (626) + tx, petroleum oils (alternative name) (628) + tx, phenkapton (1330) + tx, phenthoate (631 ) + tx, phorate (636) + tx, phosalone (637) + tx, phosfolan (1338) + tx, phosmet (638) + tx, phosphamidon (639) + tx, phoxim (642) + tx, pirimiphos-methyl (652) + tx, polychloroterpenes (traditional name) (1347) + tx, polynactins (alternative name) (653) + tx, proclonol (1350) + tx, profenofos (662) + tx, promacyl (1354) + tx, propargite (671 ) + tx, propetamphos (673) + tx, propoxur (678) + tx, prothidathion (1360) + tx, prothoate (1362) + tx, pyrethrin i (696) + tx, pyrethrin ii (696) + tx, pyrethrins (696) + tx, pyridaben (699) + tx, pyridaphenthion (701 ) + tx, pyrimidifen (706) + tx, pyrimitate (1370) + tx, quinalphos (71 1 ) + tx, quintiofos (1381 ) + tx, r-1492 (development code) (1382) + tx, ra-17 (development code) (1383) + tx, rotenone (722) + tx, schradan (1389) + tx, sebufos (alternative name) + tx, selamectin (alternative name) [ccn] + tx, si-0009 (compound code) + tx, sophamide (1402) + tx, spirodiclofen (738) + tx, spiromesifen (739) + tx, ssi-121 (development code) (1404) + tx, sulfiram (alternative name) [ccn] + tx, sulfluramid (750) + tx, sulfotep (753) + tx, sulfur (754) + tx, szi-121 (development code) (757) + tx, tau-fluvalinate (398) + tx, tebufenpyrad (763) + tx, tepp (1417) + tx, terbam (alternative name) + tx, tetrachlorvinphos (777) + tx, tetradifon (786) + tx, tetranactin (alternative name) (653) + tx, tetrasul (1425) + tx, thiafenox (alternative name) + tx, thiocarboxime (1431 ) + tx, thiofanox (800) + tx, thiometon (801 ) + tx, thioquinox (1436) + tx, thuringiensin (alternative name) [ccn] + tx, triamiphos (1441 ) + tx, triarathene (1443) + tx, triazophos (820) + tx, triazu ran (alternative name) + tx, trichlorfon (824) + tx, trifenofos (1455) + tx, trinactin (alternative name) (653) + tx, vamidothion (847) + tx, vaniliprole [ccn] and yi-5302 (compound code) + tx, an algicide selected from the group of substances consisting of bethoxazin [ccn] + tx, copper dioctanoate (lupac name) (170) + tx, copper sulfate (172) + tx, cybutryne [ccn] + tx, dichlone (1052) + tx, dichlorophen (232) + tx, endothal (295) + tx, fentin (347) + tx, hydrated lime [ccn] + tx, nabam (566) + tx, quinoclamine (714) + tx, quinonamid (1379) + tx, simazine (730) + tx, triphenyltin acetate (lupac name) (347) and triphenyltin hydroxide (lupac name) (347) + tx, an anthelmintic selected from the group of substances consisting of abamectin (1 ) + tx, crufomate (101 1 ) + tx, doramectin (alternative name) [ccn] + tx, emamectin (291 ) + tx, emamectin benzoate (291 ) + tx, eprinomectin (alternative name) [ccn] + tx, ivermectin (alternative name) [ccn] + tx, milbemycin oxime (alternative name) [ccn] + tx, moxidectin (alternative name) [ccn] + tx, piperazine [ccn] + tx, selamectin (alternative name) [ccn] + tx, spinosad (737) and thiophanate (1435) + tx, an avicide selected from the group of substances consisting of chloralose (127) + tx, endrin (1 122) + tx, fenthion (346) + tx, pyridin-4-amine (lupac name) (23) and strychnine (745) + tx, a bactericide selected from the group of substances consisting of 1-hydroxy-1 /- -pyridine-2-thione (lupac name) (1222) + tx, 4-(quinoxalin-2-ylamino)benzenesulfonamide (lupac name) (748) + tx, 8-hydroxyquinoline sulfate (446) + tx, bronopol (97) + tx, copper dioctanoate (lupac name) (170) + tx, copper hydroxide (lupac name) (169) + tx, cresol [ccn] + tx, dichlorophen (232) + tx, dipyrithione (1 105) + tx, dodicin (1 1 12) + tx, fenaminosulf (1 144) + tx, formaldehyde (404) + tx, hydrargaphen (alternative name) [ccn] + tx, kasugamycin (483) + tx, kasugamycin hydrochloride hydrate (483) + tx, nickel bis(dimethyldithiocarbamate) (lupac name) (1308) + tx, nitrapyrin (580) + tx, octhilinone (590) + tx, oxolinic acid (606) + tx, oxytetracycline (61 1 ) + tx, potassium hydroxyquinoline sulfate (446) + tx, probenazole (658) + tx, streptomycin (744) + tx, streptomycin sesquisulfate (744) + tx, tecloftalam (766) + tx, and thiomersal (alternative name) [ccn] + tx, a biological agent selected from the group of substances consisting of adoxophyes orana gv (alternative name) (12) + tx, agrobacterium radiobacter (alternative name) (13) + tx, amblyseius spp. (alternative name) (19) + tx, anagrapha falcifera npv (alternative name) (28) + tx, anagrus atomus (alternative name) (29) + tx, aphelinus abdominalis (alternative name) (33) + tx, aphidius colemani (alternative name) (34) + tx, aphidoletes aphidimyza (alternative name) (35) + tx, autographa californica npv (alternative name) (38) + tx, bacillus firmus (alternative name) (48) + tx, bacillus sphaericus neide (scientific name) (49) + tx, bacillus thuringiensis berliner (scientific name) (51 ) + tx, bacillus thuringiensis subsp. aizawai (scientific name) (51 ) + tx, bacillus thuringiensis subsp. israelensis (scientific name) (51 ) + tx, bacillus thuringiensis subsp. japonensis (scientific name) (51 ) + tx, bacillus thuringiensis subsp. kurstaki (scientific name) (51 ) + tx, bacillus thuringiensis subsp. tenebrionis (scientific name) (51 ) + tx, beauveria bassiana (alternative name) (53) + tx, beauveria brongniartii (alternative name) (54) + tx, chrysoperla carnea (alternative name) (151 ) + tx, cryptolaemus montrouzieri (alternative name) (178) + tx, cydia pomonella gv (alternative name) (191 ) + tx, dacnusa sibirica (alternative name) (212) + tx, diglyphus isaea (alternative name) (254) + tx, encarsia formosa (scientific name) (293) + tx, eretmocerus eremicus (alternative name) (300) + tx, helicoverpa zea npv (alternative name) (431 ) + tx, heterorhabditis bacteriophora and h. megidis (alternative name) (433) + tx, hippodamia convergens (alternative name) (442) + tx, leptomastix dactylopii (alternative name) (488) + tx, macrolophus caliginosus (alternative name) (491 ) + tx, mamestra brassicae npv (alternative name) (494) + tx, metaphycus helvolus (alternative name) (522) + tx, metarhizium anisopliae var. acridum (scientific name) (523) + tx, metarhizium anisopliae var. anisopliae (scientific name) (523) + tx, neodiprion sertifer npv and n. lecontei npv (alternative name) (575) + tx, onus spp. (alternative name) (596) + tx, paecilomyces fumosoroseus (alternative name) (613) + tx, phytoseiulus persimilis (alternative name) (644) + tx, spodoptera exigua multicapsid nuclear polyhedrosis virus (scientific name) (741 ) + tx, steinernema bibionis (alternative name) (742) + tx, steinernema carpocapsae (alternative name) (742) + tx, steinernema feltiae (alternative name) (742) + tx, steinernema glaseri (alternative name) (742) + tx, steinernema riobrave (alternative name) (742) + tx, steinernema riobravis (alternative name) (742) + tx, steinernema scapterisci (alternative name) (742) + tx, steinernema spp. (alternative name) (742) + tx, trichogramma spp. (alternative name) (826) + tx, typhlodromus occidentalis (alternative name) (844) and verticillium lecanii (alternative name) (848) + tx, a soil sterilant selected from the group of substances consisting of iodomethane (lupac name) (542) and methyl bromide (537) + tx, a chemosterilant selected from the group of substances consisting of apholate [ccn] + tx, bisazir (alternative name) [ccn] + tx, busulfan (alternative name) [ccn] + tx, diflubenzuron (250) + tx, dimatif (alternative name) [ccn] + tx, hemel [ccn] + tx, hempa [ccn] + tx, metepa [ccn] + tx, methiotepa [ccn] + tx, methyl apholate [ccn] + tx, morzid [ccn] + tx, penfluron (alternative name) [ccn] + tx, tepa [ccn] + tx, thiohempa (alternative name) [ccn] + tx, thiotepa (alternative name) [ccn] + tx, tretamine (alternative name) [ccn] and uredepa (alternative name) [ccn] + tx, an insect pheromone selected from the group of substances consisting of (e)-dec-5-en-1-yl acetate with (e)-dec-5-en-1-ol (lupac name) (222) + tx, (e)-tridec-4-en-1-yl acetate (lupac name) (829) + tx, (e)-6-methylhept-2-en-4-ol (lupac name) (541 ) + tx, (e,z)-tetradeca-4, 10-dien-1-yl acetate (lupac name) (779) + tx, (z)-dodec-7-en-1-yl acetate (lupac name) (285) + tx, (z)- hexadec-1 1-enal (lupac name) (436) + tx, (z)-hexadec-l 1-en-1-yl acetate (lupac name) (437) + tx, (z)-hexadec-13-en-1 1-yn-1-yl acetate (lupac name) (438) + tx, (z)-icos-13-en-10-one (lupac name) (448) + tx, (z)-tetradec-7-en-1-al (lupac name) (782) + tx, (z)-tetradec-9-en-1- ol (lupac name) (783) + tx, (z)-tetradec-9-en-1-yl acetate (lupac name) (784) + tx, (7e,9z)- dodeca-7,9-dien-1-yl acetate (lupac name) (283) + tx, (9z, 1 1 e)-tetradeca-9, 1 1-dien-1-yl acetate (lupac name) (780) + tx, (9z, 12e)-tetradeca-9, 12-dien-1-yl acetate (lupac name) (781 ) + tx, 14-methyloctadec-1-ene (lupac name) (545) + tx, 4-methylnonan-5-ol with 4-methylnonan-5-one (lupac name) (544) + tx, alpha-multistriatin (alternative name) [ccn] + tx, brevicomin (alternative name) [ccn] + tx, codlelure (alternative name) [ccn] + tx, codlemone (alternative name) (167) + tx, cuelure (alternative name) (179) + tx, disparlure (277) + tx, dodec-8-en-1-yl acetate (lupac name) (286) + tx, dodec-9-en-1-yl acetate (lupac name) (287) + tx, dodeca-8 + tx, 10-dien-1-yl acetate (lupac name) (284) + tx, dominicalure (alternative name) [ccn] + tx, ethyl 4-methyloctanoate (lupac name) (317) + tx, eugenol (alternative name) [ccn] + tx, frontalin (alternative name) [ccn] + tx, gossyplure (alternative name) (420) + tx, grandlure (421 ) + tx, grandlure i (alternative name) (421 ) + tx, grandlure ii (alternative name) (421 ) + tx, grandlure iii (alternative name) (421 ) + tx, grandlure iv (alternative name) (421 ) + tx, hexalure [ccn] + tx, ipsdienol (alternative name) [ccn] + tx, ipsenol (alternative name) [ccn] + tx, japonilure (alternative name) (481 ) + tx, lineatin (alternative name) [ccn] + tx, litlure (alternative name) [ccn] + tx, looplure (alternative name) [ccn] + tx, medlure [ccn] + tx, megatomoic acid (alternative name) [ccn] + tx, methyl eugenol (alternative name) (540) + tx, muscalure (563) + tx, octadeca-2, 13-dien-1-yl acetate (lupac name) (588) + tx, octadeca-3, 13-dien-1-yl acetate (lupac name) (589) + tx, orfralure (alternative name) [ccn] + tx, oryctalure (alternative name) (317) + tx, ostramone (alternative name) [ccn] + tx, siglure [ccn] + tx, sordidin (alternative name) (736) + tx, sulcatol (alternative name) [ccn] + tx, tetradec-1 1-en-1-yl acetate (lupac name) (785) + tx, trimedlure (839) + tx, trimedlure a (alternative name) (839) + tx, trimedlure bi (alternative name) (839) + tx, trimedlure b2 (alternative name) (839) + tx, trimedlure c (alternative name) (839) and trunc-call (alternative name) [ccn] + tx, an insect repellent selected from the group of substances consisting of 2-(octylthio)ethanol (lupac name) (591 ) + tx, butopyronoxyl (933) + tx, butoxy(polypropylene glycol) (936) + tx, dibutyl adipate (lupac name) (1046) + tx, dibutyl phthalate (1047) + tx, dibutyl succinate (lupac name) (1048) + tx, diethyltoluamide [ccn] + tx, dimethyl carbate [ccn] + tx, dimethyl phthalate [ccn] + tx, ethyl hexanediol (1 137) + tx, hexamide [ccn] + tx, methoquin-butyl (1276) + tx, methylneodecanamide [ccn] + tx, oxamate [ccn] and picaridin [ccn] + tx, an insecticide selected from the group of substances consisting of 1-dichloro-1-nitroethane (lupac/chemical abstracts name) (1058) + tx, 1 , 1-dichloro-2,2-bis(4-ethylphenyl)ethane (lupac name) (1056), + tx, 1 ,2-dichloropropane (lupac/chemical abstracts name) (1062) + tx, 1 ,2- dichloropropane with 1 ,3-dichloropropene (lupac name) (1063) + tx, 1-bromo-2-chloroethane (lupac/chemical abstracts name) (916) + tx, 2,2,2-trichloro-1-(3,4-dichlorophenyl)ethyl acetate (lupac name) (1451 ) + tx, 2,2-dichlorovinyl 2-ethy isu if i ny lethyl methyl phosphate (lupac name) (1066) + tx, 2-(1 ,3-dithiolan-2-yl)phenyl dimethylcarbamate (lupac/ chemical abstracts name) (1 109) + tx, 2-(2-butoxyethoxy)ethyl thiocyanate (lupac/chemical abstracts name) (935) + tx, 2-(4,5-dimethyl-1 ,3-dioxolan-2-yl)phenyl methylcarbamate (lupac/ chemical abstracts name) (1084) + tx, 2-(4-chloro-3,5-xylyloxy)ethanol (lupac name) (986) + tx, 2-chlorovinyl diethyl phosphate (lupac name) (984) + tx, 2-imidazolidone (lupac name) (1225) + tx, 2- isovalerylindan-1 ,3-dione (lupac name) (1246) + tx, 2-methyl(prop-2-ynyl)aminophenyl methylcarbamate (lupac name) (1284) + tx, 2-thiocyanatoethyl laurate (lupac name) (1433) + tx, 3-bromo-1-chloroprop-1-ene (lupac name) (917) + tx, 3-methyl-1-phenylpyrazol-5-yl dimethylcarbamate (lupac name) (1283) + tx, 4-methyl(prop-2-ynyl)amino-3,5-xylyl methylcarbamate (lupac name) (1285) + tx, 5,5-dimethyl-3-oxocyclohex-1-enyl dimethylcarbamate (lupac name) (1085) + tx, abamectin (1 ) + tx, acephate (2) + tx, acetamiprid (4) + tx, acethion (alternative name) [ccn] + tx, acetoprole [ccn] + tx, acrinathrin (9) + tx, acrylonitrile (lupac name) (861 ) + tx, alanycarb (15) + tx, aldicarb (16) + tx, aldoxycarb (863) + tx, aldrin (864) + tx, allethrin (17) + tx, allosamidin (alternative name) [ccn] + tx, allyxycarb (866) + tx, alpha-cypermethrin (202) + tx, alpha-ecdysone (alternative name) [ccn] + tx, aluminium phosphide (640) + tx, amidithion (870) + tx, amidothioate (872) + tx, aminocarb (873) + tx, amiton (875) + tx, amiton hydrogen oxalate (875) + tx, amitraz (24) + tx, anabasine (877) + tx, athidathion (883) + tx, avi 382 (compound code) + tx, az 60541 (compound code) + tx, azadirachtin (alternative name) (41 ) + tx, azamethiphos (42) + tx, azinphos-ethyl (44) + tx, azinphos-methyl (45) + tx, azothoate (889) + tx, bacillus thuringiensis delta endotoxins (alternative name) (52) + tx, barium hexafluorosilicate (alternative name) [ccn] + tx, barium polysulfide (lupac/chemical abstracts name) (892) + tx, barthrin [ccn] + tx, bayer 22/190 (development code) (893) + tx, bayer 22408 (development code) (894) + tx, bendiocarb (58) + tx, benfuracarb (60) + tx, bensultap (66) + tx, beta-cyfluthrin (194) + tx, beta-cypermethrin (203) + tx, bifenthrin (76) + tx, bioallethrin (78) + tx, bioallethrin s-cyclopentenyl isomer (alternative name) (79) + tx, bioethanomethrin [ccn] + tx, biopermethrin (908) + tx, bioresmethrin (80) + tx, bis(2-chloroethyl) ether (lupac name) (909) + tx, bistrifluron (83) + tx, borax (86) + tx, brofenvalerate (alternative name) + tx, bromfenvinfos (914) + tx, bromocyclen (918) + tx, bromo-ddt (alternative name) [ccn] + tx, bromophos (920) + tx, bromophos-ethyl (921 ) + tx, bufencarb (924) + tx, buprofezin (99) + tx, butacarb (926) + tx, butathiofos (927) + tx, butocarboxim (103) + tx, butonate (932) + tx, butoxycarboxim (104) + tx, butylpyridaben (alternative name) + tx, cadusafos (109) + tx, calcium arsenate [ccn] + tx, calcium cyanide (444) + tx, calcium polysulfide (lupac name) (1 1 1 ) + tx, camphechlor (941 ) + tx, carbanolate (943) + tx, carbaryl (1 15) + tx, carbofuran (1 18) + tx, carbon disulfide (lupac/chemical abstracts name) (945) + tx, carbon tetrachloride (lupac name) (946) + tx, carbophenothion (947) + tx, carbosulfan (1 19) + tx, cartap (123) + tx, cartap hydrochloride (123) + tx, cevadine (alternative name) (725) + tx, chlorbicyclen (960) + tx, chlordane (128) + tx, chlordecone (963) + tx, chlordimeform (964) + tx, chlordimeform hydrochloride (964) + tx, chlorethoxyfos (129) + tx, chlorfenapyr (130) + tx, chlorfenvinphos (131 ) + tx, chlorfluazuron (132) + tx, chlormephos (136) + tx, chloroform [ccn] + tx, chloropicrin (141 ) + tx, chlorphoxim (989) + tx, chlorprazophos (990) + tx, chlorpyrifos (145) + tx, chlorpyrifos-methyl (146) + tx, chlorthiophos (994) + tx, chromafenozide (150) + tx, cinerin i (696) + tx, cinerin ii (696) + tx, cinerins (696) + tx, cis-resmethrin (alternative name) + tx, cismethrin (80) + tx, clocythrin (alternative name) + tx, cloethocarb (999) + tx, closantel (alternative name) [ccn] + tx, clothianidin (165) + tx, copper acetoarsenite [ccn] + tx, copper arsenate [ccn] + tx, copper oleate [ccn] + tx, coumaphos (174) + tx, coumithoate (1006) + tx, crotamiton (alternative name) [ccn] + tx, crotoxyphos (1010) + tx, crufomate (101 1 ) + tx, cryolite (alternative name) (177) + tx, cs 708 (development code) (1012) + tx, cyanofenphos (1019) + tx, cyanophos (184) + tx, cyanthoate (1020) + tx, cyclethrin [ccn] + tx, cycloprothrin (188) + tx, cyfluthrin (193) + tx, cyhalothrin (196) + tx, cypermethrin (201 ) + tx, cyphenothrin (206) + tx, cyromazine (209) + tx, cythioate (alternative name) [ccn] + tx, cf-limonene (alternative name) [ccn] + tx, cf-tetramethrin (alternative name) (788) + tx, daep (1031 ) + tx, dazomet (216) + tx, ddt (219) + tx, decarbofuran (1034) + tx, deltamethrin (223) + tx, demephion (1037) + tx, demephion-o (1037) + tx, demephion-s (1037) + tx, demeton (1038) + tx, demeton-methyl (224) + tx, demeton-0 (1038) + tx, demeton-o-methyl (224) + tx, demeton-s (1038) + tx, demeton-s-methyl (224) + tx, demeton-s-methylsulphon (1039) + tx, diafenthiuron (226) + tx, dialifos (1042) + tx, diamidafos (1044) + tx, diazinon (227) + tx, dicapthon (1050) + tx, dichlofenthion (1051 ) + tx, dichlorvos (236) + tx, dicliphos (alternative name) + tx, dicresyl (alternative name) [ccn] + tx, dicrotophos (243) + tx, dicyclanil (244) + tx, dieldrin (1070) + tx, diethyl 5-methylpyrazol-3-yl phosphate (lupac name) (1076) + tx, diflubenzuron (250) + tx, dilor (alternative name) [ccn] + tx, dimefluthrin [ccn] + tx, dimefox (1081 ) + tx, dimetan (1085) + tx, dimethoate (262) + tx, dimethrin (1083) + tx, dimethylvinphos (265) + tx, dimetilan (1086) + tx, dinex (1089) + tx, dinex-diclexine (1089) + tx, dinoprop (1093) + tx, dinosam (1094) + tx, dinoseb (1095) + tx, dinotefuran (271 ) + tx, diofenolan (1099) + tx, dioxabenzofos (1 100) + tx, dioxacarb (1 101 ) + tx, dioxathion (1 102) + tx, disulfoton (278) + tx, dithicrofos (1 108) + tx, dnoc (282) + tx, doramectin (alternative name) [ccn] + tx, dsp (1 1 15) + tx, ecdysterone (alternative name) [ccn] + tx, el 1642 (development code) (1 1 18) + tx, emamectin (291 ) + tx, emamectin benzoate (291 ) + tx, empc (1 120) + tx, empenthrin (292) + tx, endosulfan (294) + tx, endothion (1 121 ) + tx, endrin (1 122) + tx, epbp (1 123) + tx, epn (297) + tx, epofenonane (1 124) + tx, eprinomectin (alternative name) [ccn] + tx, esfenvalerate (302) + tx, etaphos (alternative name) [ccn] + tx, ethiofencarb (308) + tx, ethion (309) + tx, ethiprole (310) + tx, ethoate-m ethyl (1 134) + tx, ethoprophos (312) + tx, ethyl formate (lupac name) [ccn] + tx, ethyl-ddd (alternative name) (1056) + tx, ethylene dibromide (316) + tx, ethylene dichloride (chemical name) (1 136) + tx, ethylene oxide [ccn] + tx, etofenprox (319) + tx, etrimfos (1 142) + tx, exd (1 143) + tx, famphur (323) + tx, fenamiphos (326) + tx, fenazaflor (1 147) + tx, fenchlorphos (1 148) + tx, fenethacarb (1 149) + tx, fenfluthrin (1 150) + tx, fenitrothion (335) + tx, fenobucarb (336) + tx, fenoxacrim (1 153) + tx, fenoxycarb (340) + tx, fenpirithrin (1 155) + tx, fenpropathrin (342) + tx, fenpyrad (alternative name) + tx, fensulfothion (1 158) + tx, fenthion (346) + tx, fenth ion-ethyl [ccn] + tx, fenvalerate (349) + tx, fipronil (354) + tx, flonicamid (358) + tx, flubendiamide (cas. reg. no.: 272451-65-7) + tx, flucofuron (1 168) + tx, flucycloxuron (366) + tx, flucythrinate (367) + tx, fluenetil (1 169) + tx, flufenerim [ccn] + tx, flufenoxuron (370) + tx, flufenprox (1 171 ) + tx, flumethrin (372) + tx, fluvalinate (1 184) + tx, fmc 1 137 (development code) (1 185) + tx, fonofos (1 191 ) + tx, formetanate (405) + tx, formetanate hydrochloride (405) + tx, formothion (1 192) + tx, formparanate (1 193) + tx, fosmethilan (1 194) + tx, fospirate (1 195) + tx, fosthiazate (408) + tx, fosthietan (1 196) + tx, furathiocarb (412) + tx, furethrin (1200) + tx, gamma-cyhalothrin (197) + tx, gamma-hch (430) + tx, guazatine (422) + tx, guazatine acetates (422) + tx, gy-81 (development code) (423) + tx, halfenprox (424) + tx, halofenozide (425) + tx, hch (430) + tx, heod (1070) + tx, heptachlor (121 1 ) + tx, heptenophos (432) + tx, heterophos [ccn] + tx, hexaflumuron (439) + tx, hhdn (864) + tx, hydramethylnon (443) + tx, hydrogen cyanide (444) + tx, hydroprene (445) + tx, hyquincarb (1223) + tx, imidacloprid (458) + tx, imiprothrin (460) + tx, indoxacarb (465) + tx, iodomethane (lupac name) (542) + tx, ipsp (1229) + tx, isazofos (1231 ) + tx, isobenzan (1232) + tx, isocarbophos (alternative name) (473) + tx, isodrin (1235) + tx, isofenphos (1236) + tx, isolane (1237) + tx, isoprocarb (472) + tx, isopropyl 0- (methoxyaminothiophosphoryl)salicylate (lupac name) (473) + tx, isoprothiolane (474) + tx, isothioate (1244) + tx, isoxathion (480) + tx, ivermectin (alternative name) [ccn] + tx, jasmolin i (696) + tx, jasmolin ii (696) + tx, jodfenphos (1248) + tx, juvenile hormone i (alternative name) [ccn] + tx, juvenile hormone ii (alternative name) [ccn] + tx, juvenile hormone iii (alternative name) [ccn] + tx, kelevan (1249) + tx, kinoprene (484) + tx, lambda- cyhalothrin (198) + tx, lead arsenate [ccn] + tx, lepimectin (ccn) + tx, leptophos (1250) + tx, lindane (430) + tx, lirimfos (1251 ) + tx, lufenuron (490) + tx, lythidathion (1253) + tx, m-cumenyl methylcarbamate (lupac name) (1014) + tx, magnesium phosphide (lupac name) (640) + tx, malathion (492) + tx, malonoben (1254) + tx, mazidox (1255) + tx, mecarbam (502) + tx, mecarphon (1258) + tx, menazon (1260) + tx, mephosfolan (1261 ) + tx, mercurous chloride (513) + tx, mesulfenfos (1263) + tx, metaflumizone (ccn) + tx, metam (519) + tx, metam-potassium (alternative name) (519) + tx, metam-sodium (519) + tx, methacrifos (1266) + tx, methamidophos (527) + tx, methanesulfonyl fluoride (lupac/chemical abstracts name) (1268) + tx, methidathion (529) + tx, methiocarb (530) + tx, methocrotophos (1273) + tx, methomyl (531 ) + tx, methoprene (532) + tx, methoquin-butyl (1276) + tx, methothrin (alternative name) (533) + tx, methoxychlor (534) + tx, methoxyfenozide (535) + tx, methyl bromide (537) + tx, methyl isothiocyanate (543) + tx, methylchloroform (alternative name) [ccn] + tx, methylene chloride [ccn] + tx, metofluthrin [ccn] + tx, metolcarb (550) + tx, metoxadiazone (1288) + tx, mevinphos (556) + tx, mexacarbate (1290) + tx, milbemectin (557) + tx, milbemycin oxime (alternative name) [ccn] + tx, mipafox (1293) + tx, mirex (1294) + tx, monocrotophos (561 ) + tx, morphothion (1300) + tx, moxidectin (alternative name) [ccn] + tx, naftalofos (alternative name) [ccn] + tx, naled (567) + tx, naphthalene (lupac/chemical abstracts name) (1303) + tx, nc-170 (development code) (1306) + tx, nc- 184 (compound code) + tx, nicotine (578) + tx, nicotine sulfate (578) + tx, nifluridide (1309) + tx, nitenpyram (579) + tx, nithiazine (131 1 ) + tx, nitrilacarb (1313) + tx, nitrilacarb 1 :1 zinc chloride complex (1313) + tx, nni-0101 (compound code) + tx, nni-0250 (compound code) + tx, nornicotine (traditional name) (1319) + tx, novaluron (585) + tx, noviflumuron (586) + tx, 0-5-dichloro-4-iodophenyl o-ethyl ethylphosphonothioate (lupac name) (1057) + tx, 0,0-diethyl 0-4-methyl-2-oxo-2a -chromen-7-yl phosphorothioate (lupac name) (1074) + tx, 0,0-diethyl 0-6- methyl-2-propylpyrimidin-4-yl phosphorothioate (lupac name) (1075) + tx, ο,ο,ο', o'-tetrapropyl dithiopyrophosphate (lupac name) (1424) + tx, oleic acid (lupac name) (593) + tx, omethoate (594) + tx, oxamyl (602) + tx, oxydemeton-methyl (609) + tx, oxydeprofos (1324) + tx, oxydisulfoton (1325) + tx, pp'-ddt (219) + tx, para-dichlorobenzene [ccn] + tx, parathion (615) + tx, parathion-methyl (616) + tx, penfluron (alternative name) [ccn] + tx, pentachlorophenol (623) + tx, pentachlorophenyl laurate (lupac name) (623) + tx, permethrin (626) + tx, petroleum oils (alternative name) (628) + tx, ph 60-38 (development code) (1328) + tx, phenkapton (1330) + tx, phenothrin (630) + tx, phenthoate (631 ) + tx, phorate (636) + tx, phosalone (637) + tx, phosfolan (1338) + tx, phosmet (638) + tx, phosnichlor (1339) + tx, phosphamidon (639) + tx, phosphine (lupac name) (640) + tx, phoxim (642) + tx, phoxim-methyl (1340) + tx, pirimetaphos (1344) + tx, pirimicarb (651 ) + tx, pirimiphos-ethyl (1345) + tx, pirimiphos-methyl (652) + tx, polychlorodicyclopentadiene isomers (lupac name) (1346) + tx, polychloroterpenes (traditional name) (1347) + tx, potassium arsenite [ccn] + tx, potassium thiocyanate [ccn] + tx, prallethrin (655) + tx, precocene i (alternative name) [ccn] + tx, precocene ii (alternative name) [ccn] + tx, precocene iii (alternative name) [ccn] + tx, primidophos (1349) + tx, profenofos (662) + tx, profluthrin [ccn] + tx, promacyl (1354) + tx, promecarb (1355) + tx, propaphos (1356) + tx, propetamphos (673) + tx, propoxur (678) + tx, prothidathion (1360) + tx, prothiofos (686) + tx, prothoate (1362) + tx, protrifenbute [ccn] + tx, pymetrozine (688) + tx, pyraclofos (689) + tx, pyrazophos (693) + tx, pyresmethrin (1367) + tx, pyrethrin i (696) + tx, pyrethrin ii (696) + tx, pyrethrins (696) + tx, pyridaben (699) + tx, pyridalyl (700) + tx, pyridaphenthion (701 ) + tx, pyrimidifen (706) + tx, pyrimitate (1370) + tx, pyriproxyfen (708) + tx, quassia (alternative name) [ccn] + tx, quinalphos (71 1 ) + tx, quinalphos-methyl (1376) + tx, quinothion (1380) + tx, quintiofos (1381 ) + tx, r-1492 (development code) (1382) + tx, rafoxanide (alternative name) [ccn] + tx, resmethrin (719) + tx, rotenone (722) + tx, ru 15525 (development code) (723) + tx, ru 25475 (development code) (1386) + tx, ryania (alternative name) (1387) + tx, ryanodine (traditional name) (1387) + tx, sabadilla (alternative name) (725) + tx, schradan (1389) + tx, sebufos (alternative name) + tx, selamectin (alternative name) [ccn] + tx, si-0009 (compound code) + tx, si-0205 (compound code) + tx, si-0404 (compound code) + tx, si-0405 (compound code) + tx, silafluofen (728) + tx, sn 72129 (development code) (1397) + tx, sodium arsenite [ccn] + tx, sodium cyanide (444) + tx, sodium fluoride (lupac/chemical abstracts name) (1399) + tx, sodium hexafluorosilicate (1400) + tx, sodium pentachlorophenoxide (623) + tx, sodium selenate (lupac name) (1401 ) + tx, sodium thiocyanate [ccn] + tx, sophamide (1402) + tx, spinosad (737) + tx, spiromesifen (739) + tx, spirotetrmat (ccn) + tx, sulcofuron (746) + tx, sulcofuron-sodium (746) + tx, sulfluramid (750) + tx, sulfotep (753) + tx, sulfuryl fluoride (756) + tx, sulprofos (1408) + tx, tar oils (alternative name) (758) + tx, tau-fluvalinate (398) + tx, tazimcarb (1412) + tx, tde (1414) + tx, tebufenozide (762) + tx, tebufenpyrad (763) + tx, tebupirimfos (764) + tx, teflubenzuron (768) + tx, tefluthrin (769) + tx, temephos (770) + tx, tepp (1417) + tx, terallethrin (1418) + tx, terbam (alternative name) + tx, terbufos (773) + tx, tetrachloroethane [ccn] + tx, tetrachlorvinphos (777) + tx, tetramethrin (787) + tx, theta-cypermethrin (204) + tx, thiacloprid (791 ) + tx, thiafenox (alternative name) + tx, thiamethoxam (792) + tx, thicrofos (1428) + tx, thiocarboxime (1431 ) + tx, thiocyclam (798) + tx, thiocyclam hydrogen oxalate (798) + tx, thiodicarb (799) + tx, thiofanox (800) + tx, thiometon (801 ) + tx, thionazin (1434) + tx, thiosultap (803) + tx, thiosultap-sodium (803) + tx, thuringiensin (alternative name) [ccn] + tx, tolfenpyrad (809) + tx, tralomethrin (812) + tx, transfluthrin (813) + tx, transpermethrin (1440) + tx, triamiphos (1441 ) + tx, triazamate (818) + tx, triazophos (820) + tx, triazuron (alternative name) + tx, trichlorfon (824) + tx, trichlormetaphos-3 (alternative name) [ccn] + tx, trichloronat (1452) + tx, trifenofos (1455) + tx, triflumuron (835) + tx, trimethacarb (840) + tx, triprene (1459) + tx, vamidothion (847) + tx, vaniliprole [ccn] + tx, veratridine (alternative name) (725) + tx, veratrine (alternative name) (725) + tx, xmc (853) + tx, xylylcarb (854) + tx, yi-5302 (compound code) + tx, zeta-cypermethrin (205) + tx, zetamethrin (alternative name) + tx, zinc phosphide (640) + tx, zolaprofos (1469) and zxi 8901 (development code) (858) + tx, cyantraniliprole [736994-63-19 + tx, chlorantraniliprole [500008-45-7] + tx, cyenopyrafen [560121-52-0] + tx, cyflumetofen [400882-07-7] + tx, pyrifluquinazon [337458-27-2] + tx, spinetoram [187166-40-1 + 187166-15-0] + tx, spirotetramat [203313-25-1] + tx, sulfoxaflor [946578-00-3] + tx, flufiprole [704886-18-0] + tx, meperfluthrin [915288-13-0] + tx, tetramethylfluthrin [84937-88-2] + tx, triflumezopyrim (disclosed in wo 2012/0921 15) + tx, a molluscicide selected from the group of substances consisting of bis(tributyltin) oxide (lupac name) (913) + tx, bromoacetamide [ccn] + tx, calcium arsenate [ccn] + tx, cloethocarb (999) + tx, copper acetoarsenite [ccn] + tx, copper sulfate (172) + tx, fentin (347) + tx, ferric phosphate (lupac name) (352) + tx, metaldehyde (518) + tx, methiocarb (530) + tx, niclosamide (576) + tx, niclosamide-olamine (576) + tx, pentachlorophenol (623) + tx, sodium pentachlorophenoxide (623) + tx, tazimcarb (1412) + tx, thiodicarb (799) + tx, tributyltin oxide (913) + tx, trifenmorph (1454) + tx, trimethacarb (840) + tx, triphenyltin acetate (lupac name) (347) and triphenyltin hydroxide (lupac name) (347) + tx, pyriprole [394730-71-3] + tx, a nematicide selected from the group of substances consisting of akd-3088 (compound code) + tx, 1 ,2-dibromo-3-chloropropane (lupac/chemical abstracts name) (1045) + tx, 1 ,2-dichloropropane (lupac/ chemical abstracts name) (1062) + tx, 1 ,2-dichloropropane with 1 ,3-dichloropropene (lupac name) (1063) + tx, 1 ,3-dichloropropene (233) + tx, 3,4-dichlorotetrahydrothiophene 1 ,1- dioxide (lupac/chemical abstracts name) (1065) + tx, 3-(4-chlorophenyl)-5-methylrhodanine (lupac name) (980) + tx, 5-methyl-6-thioxo-1 ,3,5-thiadiazinan-3-ylacetic acid (lupac name) (1286) + tx, 6-isopentenylaminopurine (alternative name) (210) + tx, abamectin (1 ) + tx, acetoprole [ccn] + tx, alanycarb (15) + tx, aldicarb (16) + tx, aldoxycarb (863) + tx, az 60541 (compound code) + tx, benclothiaz [ccn] + tx, benomyl (62) + tx, butylpyridaben (alternative name) + tx, cadusafos (109) + tx, carbofuran (1 18) + tx, carbon disulfide (945) + tx, carbosulfan (1 19) + tx, chloropicrin (141 ) + tx, chlorpyrifos (145) + tx, cloethocarb (999) + tx, cytokinins (alternative name) (210) + tx, dazomet (216) + tx, dbcp (1045) + tx, dcip (218) + tx, diamidafos (1044) + tx, dichlofenthion (1051 ) + tx, dicliphos (alternative name) + tx, dimethoate (262) + tx, doramectin (alternative name) [ccn] + tx, emamectin (291 ) + tx, emamectin benzoate (291 ) + tx, eprinomectin (alternative name) [ccn] + tx, ethoprophos (312) + tx, ethylene dibromide (316) + tx, fenamiphos (326) + tx, fenpyrad (alternative name) + tx, fensulfothion (1 158) + tx, fosthiazate (408) + tx, fosthietan (1 196) + tx, furfural (alternative name) [ccn] + tx, gy-81 (development code) (423) + tx, heterophos [ccn] + tx, iodomethane (lupac name) (542) + tx, isamidofos (1230) + tx, isazofos (1231 ) + tx, ivermectin (alternative name) [ccn] + tx, kinetin (alternative name) (210) + tx, mecarphon (1258) + tx, metam (519) + tx, metam-potassium (alternative name) (519) + tx, metam-sodium (519) + tx, methyl bromide (537) + tx, methyl isothiocyanate (543) + tx, milbemycin oxime (alternative name) [ccn] + tx, moxidectin (alternative name) [ccn] + tx, myrothecium verrucaria composition (alternative name) (565) + tx, nc-184 (compound code) + tx, oxamyl (602) + tx, phorate (636) + tx, phosphamidon (639) + tx, phosphocarb [ccn] + tx, sebufos (alternative name) + tx, selamectin (alternative name) [ccn] + tx, spinosad (737) + tx, terbam (alternative name) + tx, terbufos (773) + tx, tetrachlorothiophene (lupac/ chemical abstracts name) (1422) + tx, thiafenox (alternative name) + tx, thionazin (1434) + tx, triazophos (820) + tx, triazuron (alternative name) + tx, xylenols [ccn] + tx, yi-5302 (compound code) and zeatin (alternative name) (210) + tx, fluensulfone [318290-98-1] + tx, a nitrification inhibitor selected from the group of substances consisting of potassium ethylxanthate [ccn] and nitrapyrin (580) + tx, a plant activator selected from the group of substances consisting of acibenzolar (6) + tx, acibenzolar-s-methyl (6) + tx, probenazole (658) and reynoutria sachalinensis extract (alternative name) (720) + tx, a rodenticide selected from the group of substances consisting of 2-isovalerylindan-1 ,3-dione (lupac name) (1246) + tx, 4-(quinoxalin-2-ylamino)benzenesulfonamide (lupac name) (748) + tx, alpha-chlorohydrin [ccn] + tx, aluminium phosphide (640) + tx, antu (880) + tx, arsenous oxide (882) + tx, barium carbonate (891 ) + tx, bisthiosemi (912) + tx, brodifacoum (89) + tx, bromadiolone (91 ) + tx, bromethalin (92) + tx, calcium cyanide (444) + tx, chloralose (127) + tx, chlorophacinone (140) + tx, cholecalciferol (alternative name) (850) + tx, coumachlor (1004) + tx, coumafuryl (1005) + tx, coumatetralyl (175) + tx, crimidine (1009) + tx, difenacoum (246) + tx, difethialone (249) + tx, diphacinone (273) + tx, ergocalciferol (301 ) + tx, flocoumafen (357) + tx, fluoroacetamide (379) + tx, flupropadine (1 183) + tx, flupropadine hydrochloride (1 183) + tx, gamma-hch (430) + tx, hch (430) + tx, hydrogen cyanide (444) + tx, iodomethane (lupac name) (542) + tx, lindane (430) + tx, magnesium phosphide (lupac name) (640) + tx, methyl bromide (537) + tx, norbormide (1318) + tx, phosacetim (1336) + tx, phosphine (lupac name) (640) + tx, phosphorus [ccn] + tx, pindone (1341 ) + tx, potassium arsenite [ccn] + tx, pyrinuron (1371 ) + tx, scilliroside (1390) + tx, sodium arsenite [ccn] + tx, sodium cyanide (444) + tx, sodium fluoroacetate (735) + tx, strychnine (745) + tx, thallium sulfate [ccn] + tx, warfarin (851 ) and zinc phosphide (640) + tx, a synergist selected from the group of substances consisting of 2-(2-butoxyethoxy)ethyl piperonylate (lupac name) (934) + tx, 5-(1 ,3-benzodioxol-5-yl)-3-hexylcyclohex-2-enone (lupac name) (903) + tx, farnesol with nerolidol (alternative name) (324) + tx, mb-599 (development code) (498) + tx, mgk 264 (development code) (296) + tx, piperonyl butoxide (649) + tx, piprotal (1343) + tx, propyl isomer (1358) + tx, s421 (development code) (724) + tx, sesamex (1393) + tx, sesasmolin (1394) and sulfoxide (1406) + tx, an animal repellent selected from the group of substances consisting of anthraquinone (32) + tx, chloralose (127) + tx, copper naphthenate [ccn] + tx, copper oxychloride (171 ) + tx, diazinon (227) + tx, dicyclopentadiene (chemical name) (1069) + tx, guazatine (422) + tx, guazatine acetates (422) + tx, methiocarb (530) + tx, pyridin-4-amine (lupac name) (23) + tx, thiram (804) + tx, trimethacarb (840) + tx, zinc naphthenate [ccn] and ziram (856) + tx, a virucide selected from the group of substances consisting of imanin (alternative name) [ccn] and ribavirin (alternative name) [ccn] + tx, a wound protectant selected from the group of substances consisting of mercuric oxide (512) + tx, octhilinone (590) and thiophanate-methyl (802) + tx, and biologically active compounds selected from the group consisting of azaconazole (60207-31-0] + tx, bitertanol [70585-36-3] + tx, bromuconazole [1 16255-48-2] + tx, cyproconazole [94361-06- 5] + tx, difenoconazole [1 19446-68-3] + tx, diniconazole [83657-24-3] + tx, epoxiconazole [106325-08-0] + tx, fenbuconazole [1 14369-43-6] + tx, fluquinconazole [136426-54-5] + tx, flusilazole [85509-19-9] + tx, flutriafol [76674-21-0] + tx, hexaconazole [79983-71-4] + tx, imazalil [35554-44-0] + tx, imibenconazole [86598-92-7] + tx, ipconazole [125225-28-7] + tx, metconazole [1251 16-23-6] + tx, myclobutanil [88671-89-0] + tx, pefurazoate [101903-30-4] + tx, penconazole [66246-88-6] + tx, prothioconazole [178928-70-6] + tx, pyrifenox [88283-41-4] + tx, prochloraz [67747-09-5] + tx, propiconazole [60207-90-1] + tx, simeconazole [149508- 90-7] + tx, tebuconazole [107534-96-3] + tx, tetraconazole [1 12281-77-3] + tx, triadimefon [43121-43-3] + tx, triadimenol [55219-65-3] + tx, triflumizole [99387-89-0] + tx, triticonazole [131983-72-7] + tx, ancymidol [12771-68-5] + tx, fenarimol [60168-88-9] + tx, nuarimol [63284-71-9] + tx, bupirimate [41483-43-6] + tx, dimethirimol [5221-53-4] + tx, ethirimol [23947-60-6] + tx, dodemorph [1593-77-7] + tx, fenpropidine [67306-00-7] + tx, fenpropimorph [67564-91-4] + tx, spiroxamine [1 18134-30-8] + tx, tridemorph [81412-43-3] + tx, cyprodinil [121552-61-2] + tx, mepanipyrim [1 10235-47-7] + tx, pyrimethanil [531 12-28-0] + tx, fenpiclonil [74738-17-3] + tx, fludioxonil [131341-86-1] + tx, benalaxyl [71626-1 1-4] + tx, furalaxyl [57646-30-7] + tx, metalaxyl [57837-19-1] + tx, r-metalaxyl [70630-17-0] + tx, ofurace [58810-48-3] + tx, oxadixyl [77732-09-3] + tx, benomyl [17804-35-2] + tx, carbendazim [10605-21-7] + tx, debacarb [62732-91-6] + tx, fuberidazole [3878-19-1] + tx, thiabendazole [148-79-8] + tx, chlozolinate [84332-86-5] + tx, dichlozoline [24201-58-9] + tx, iprodione [36734-19-7] + tx, myclozoline [54864-61-8] + tx, procymidone [32809-16-8] + tx, vinclozoline [50471-44-8] + tx, boscalid [188425-85-6] + tx, carboxin [5234-68-4] + tx, fenfuram [24691-80-3] + tx, flutolanil [66332-96-5] + tx, mepronil [55814-41-0] + tx, oxycarboxin [5259-88-1] + tx, penthiopyrad [183675-82-3] + tx, thifluzamide [130000-40-7] + tx, guazatine [108173-90-6] + tx, dodine [2439-10-3] [1 12-65-2] (free base) + tx, iminoctadine [13516-27-3] + tx, azoxystrobin [131860-33-8] + tx, dimoxystrobin [149961-52-4] + tx, enestroburin {proc. bcpc, int. congr., glasgow, 2003, 1 , 93} + tx, fluoxastrobin [361377-29-9] + tx, kresoxim-methyl [143390-89-0] + tx, metominostrobin [133408-50-1] + tx, trifloxystrobin [141517-21-7] + tx, orysastrobin [248593-16-0] + tx, picoxystrobin [1 17428-22-5] + tx, pyraclostrobin [175013-18-0] + tx, ferbam [14484-64-1] + tx, mancozeb [8018-01-7] + tx, maneb [12427-38-2] + tx, metiram [9006-42-2] + tx, propineb [12071-83-9] + tx, thiram [137- 26-8] + tx, zineb [12122-67-7] + tx, ziram [137-30-4] + tx, captafol [2425-06-1] + tx, captan [133-06-2] + tx, dichlofluanid [1085-98-9] + tx, fluoroimide [41205-21-4] + tx, folpet [133-07-3 ] + tx, tolylfluanid [731-27-1] + tx, bordeaux mixture [801 1-63-0] + tx, copperhydroxid [20427- 59-2] + tx, copperoxychlorid [1332-40-7] + tx, coppersulfat [7758-98-7] + tx, copperoxid [1317-39-1] + tx, mancopper [53988-93-5] + tx, oxine-copper [10380-28-6] + tx, dinocap [131- 72-6] + tx, nitrothal-isopropyl [10552-74-6] + tx, edifenphos [17109-49-8] + tx, iprobenphos [26087-47-8] + tx, isoprothiolane [50512-35-1] + tx, phosdiphen [36519-00-3] + tx, pyrazophos [13457-18-6] + tx, tolclofos-methyl [57018-04-9] + tx, acibenzolar-s-methyl [135158-54-2] + tx, anilazine [101-05-3] + tx, benthiavalicarb [413615-35-7] + tx, blasticidin-s [2079-00-7] + tx, chinomethionat [2439-01-2] + tx, chloroneb [2675-77-6] + tx, chlorothalonil [1897-45-6] + tx, cyflufenamid [180409-60-3] + tx, cymoxanil [57966-95-7] + tx, dichlone [117- 80-6] + tx, diclocymet [139920-32-4] + tx, diclomezine [62865-36-5] + tx, dicloran [99-30-9] + tx, diethofencarb [87130-20-9] + tx, dimethomorph [110488-70-5] + tx, syp-li90 (flumorph) [211867-47-9] + tx, dithianon [3347-22-6] + tx, ethaboxam [162650-77-3] + tx, etridiazole [2593-15-9] + tx, famoxadone [131807-57-3] + tx, fenamidone [161326-34-7] + tx, fenoxanil [115852-48-7] + tx, fentin [668-34-8] + tx, ferimzone [89269-64-7] + tx, fluazinam [79622-59- 6] + tx, fluopicolide [2391 10-15-7] + tx, flusulfamide [106917-52-6] + tx, fenhexamid [126833- 17-8] + tx, fosetyl-aluminium [39148-24-8] + tx, hymexazol [10004-44-1] + tx, iprovalicarb [140923-17-7] + tx, ikf-916 (cyazofamid) [120116-88-3] + tx, kasugamycin [6980-18-3] + tx, methasulfocarb [66952-49-6] + tx, metrafenone [220899-03-6] + tx, pencycuron [66063-05-6] + tx, phthalide [27355-22-2] + tx, polyoxins [1 1 1 13-80-7] + tx, probenazole [27605-76-1] + tx, propamocarb [25606-41-1] + tx, proquinazid [189278-12-4] + tx, pyroquilon [57369-32-1] + tx, quinoxyfen [124495-18-7] + tx, quintozene [82-68-8] + tx, sulfur [7704-34-9] + tx, tiadinil [223580-51-6] + tx, triazoxide [72459-58-6] + tx, tricyclazole [41814-78-2] + tx, triforine [26644-46-2] + tx, validamycin [37248-47-8] + tx, zoxamide (rh7281 ) [156052-68-5] + tx, mandipropamid [374726-62-2] + tx, isopyrazam [881685-58-1] + tx, sedaxane [874967-67-6] + tx, 3-difluoromethyl-1-methyl-1 h-pyrazole-4-carboxylic acid (9-dichloromethylene-1 , 2,3,4- tetrahydro-1 ,4-methano-naphthalen-5-yl)-amide (dislosed in wo 2007/048556) + tx, 3- difluoromethyl-1-methyl-1 h-pyrazole-4-carboxylic acid (3',4',5'-trifluoro-biphenyl-2-yl)-amide (disclosed in wo 2006/087343) + tx, [(3s,4r,4ar,6s,6as, 12r, 12as, 12bs)-3- [(cyclopropylcarbonyl)oxy]- 1 ,3,4,4a,5,6,6a, 12, 12a, 12b-decahydro-6, 12-dihydroxy-4,6a,12b- trimethyl-1 1-oxo-9-(3-pyridinyl)-2/- , 1 1 hnaphtho[2, 1-b]pyrano[3,4-e]pyran-4-yl]methyl- cyclopropanecarboxylate [915972-17-7] + tx and 1 ,3,5-trimethyl-n-(2-methyl-1-oxopropyl)-n-[3-(2- methylpropyl)-4-[2,2,2-trifluoro-1-methoxy-1-(trifluoromethyl)ethyl]phenyl]-1 h-pyrazole-4- carboxamide [926914-55-8] + tx. the references in brackets behind the active ingredients, e.g. [3878-19-1] refer to the chemical abstracts registry number. the above described mixing partners are known. where the active ingredients are included in "the pesticide manual" [the pesticide manual - a world compendium; thirteenth edition; editor: c. d. s. tomlin; the british crop protection council], they are described therein under the entry number given in round brackets hereinabove for the particular compound; for example, the compound "abamectin" is described under entry number (1 ). where "[ccn]" is added hereinabove to the particular compound, the compound in question is included in the "compendium of pesticide common names", which is accessible on the internet [a. wood; compendium of pesticide common names, copyright © 1995-2004]; for example, the compound "acetoprole" is described under the internet address http://www.alanwood.net/pesticides/acetoprole.html. most of the active ingredients described above are referred to hereinabove by a so-called "common name", the relevant "iso common name" or another "common name" being used in individual cases. if the designation is not a "common name", the nature of the designation used instead is given in round brackets for the particular compound; in that case, the lupac name, the lupac/chemical abstracts name, a "chemical name", a "traditional name", a "compound name" or a "develoment code" is used or, if neither one of those designations nor a "common name" is used, an "alternative name" is employed. "cas reg. no" means the chemical abstracts registry number. the active ingredient mixture of the compounds according to any one of embodiments 1 to 34 with active ingredients described above comprises a compound according to any one of embodiments 1 to 34 and an active ingredient as described above preferably in a mixing ratio of from 100: 1 to 1 :6000, especially from 50: 1 to 1 :50, more especially in a ratio of from 20: 1 to 1 :20, even more especially from 10:1 to 1 : 10, very especially from 5: 1 and 1 :5, special preference being given to a ratio of from 2: 1 to 1 :2, and a ratio of from 4: 1 to 2:1 being likewise preferred, above all in a ratio of 1 : 1 , or 5: 1 , or 5:2, or 5:3, or 5:4, or 4: 1 , or 4:2, or 4:3, or 3:1 , or 3:2, or 2: 1 , or 1 :5, or 2:5, or 3:5, or 4:5, or 1 :4, or 2:4, or 3:4, or 1 :3, or 2:3, or 1 :2, or 1 :600, or 1 :300, or 1 :150, or 1 :35, or 2:35, or 4:35, or 1 :75, or 2:75, or 4:75, or 1 :6000, or 1 :3000, or 1 : 1500, or 1 :350, or 2:350, or 4:350, or 1 :750, or 2:750, or 4:750. those mixing ratios are by weight. the mixtures as described above can be used in a method for controlling pests, which comprises applying a composition comprising a mixture as described above to the pests or their environment, with the exception of a method for treatment of the human or animal body by surgery or therapy and diagnostic methods practised on the human or animal body. the mixtures comprising a compound of according to any one of embodiments 1 to 34 and one or more active ingredients as described above can be applied, for example, in a single "ready-mix" form, in a combined spray mixture composed from separate formulations of the single active ingredient components, such as a "tank-mix", and in a combined use of the single active ingredients when applied in a sequential manner, i.e. one after the other with a reasonably short period, such as a few hours or days. the order of applying the compounds according to any one of embodiments 1 to 34 and the active ingredients as described above is not essential for working the present invention. the compositions according to the invention can also comprise further solid or liquid auxiliaries, such as stabilizers, for example unepoxidized or epoxidized vegetable oils (for example epoxidized coconut oil, rapeseed oil or soya oil), antifoams, for example silicone oil, preservatives, viscosity regulators, binders and/or tackifiers, fertilizers or other active ingredients for achieving specific effects, for example bactericides, fungicides, nematocides, plant activators, molluscicides or herbicides. the compositions according to the invention are prepared in a manner known per se, in the absence of auxiliaries for example by grinding, screening and/or compressing a solid active ingredient and in the presence of at least one auxiliary for example by intimately mixing and/or grinding the active ingredient with the auxiliary (auxiliaries). these processes for the preparation of the compositions and the use of the compounds i for the preparation of these compositions are also a subject of the invention. the application methods for the compositions, that is the methods of controlling pests of the abovementioned type, such as spraying, atomizing, dusting, brushing on, dressing, scattering or pouring - which are to be selected to suit the intended aims of the prevailing circumstances - and the use of the compositions for controlling pests of the abovementioned type are other subjects of the invention. typical rates of concentration are between 0.1 and 1000 ppm, preferably between 0.1 and 500 ppm, of active ingredient. the rate of application per hectare is generally 1 to 2000 g of active ingredient per hectare, in particular 10 to 1000 g/ha, preferably 10 to 600 g/ha. a preferred method of application in the field of crop protection is application to the foliage of the plants (foliar application), it being possible to select frequency and rate of application to match the danger of infestation with the pest in question. alternatively, the active ingredient can reach the plants via the root system (systemic action), by drenching the locus of the plants with a liquid composition or by incorporating the active ingredient in solid form into the locus of the plants, for example into the soil, for example in the form of granules (soil application). in the case of paddy rice crops, such granules can be metered into the flooded paddy-field. the compounds of the invention and compositions thereof are also be suitable for the protection of plant propagation material, for example seeds, such as fruit, tubers or kernels, or nursery plants, against pests of the abovementioned type. the propagation material can be treated with the compound prior to planting, for example seed can be treated prior to sowing. alternatively, the compound can be applied to seed kernels (coating), either by soaking the kernels in a liquid composition or by applying a layer of a solid composition. it is also possible to apply the compositions when the propagation material is planted to the site of application, for example into the seed furrow during drilling. these treatment methods for plant propagation material and the plant propagation material thus treated are further subjects of the invention. typical treatment rates would depend on the plant and pest/fungi to be controlled and are generally between 1 to 200 grams per 100 kg of seeds, preferably between 5 to 150 grams per 100 kg of seeds, such as between 10 to 100 grams per 100 kg of seeds. the term seed embraces seeds and plant propagules of all kinds including but not limited to true seeds, seed pieces, suckers, corns, bulbs, fruit, tubers, grains, rhizomes, cuttings, cut shoots and the like and means in a preferred embodiment true seeds. the present invention also comprises seeds coated or treated with or containing a compound according to any one of embodiments 1 to 34. the term "coated or treated with and/or containing" generally signifies that the active ingredient is for the most part on the surface of the seed at the time of application, although a greater or lesser part of the ingredient may penetrate into the seed material, depending on the method of application. when the said seed product is (re)planted, it may absorb the active ingredient. in an embodiment, the present invention makes available a plant propagation material adhered thereto with according to any one of embodiments 1 to 34. further, it is hereby made available, a composition comprising a plant propagation material treated with a compound according to any one of embodiments 1 to 34. seed treatment comprises all suitable seed treatment techniques known in the art, such as seed dressing, seed coating, seed dusting, seed soaking and seed pelleting. the seed treatment application of the compound according to any one of embodiments 1 to 34 can be carried out by any known methods, such as spraying or by dusting the seeds before sowing or during the sowing/planting of the seeds. the pesticidal/insecticidal properties of the compounds according to any one of embodiments 1 to 34 can be illustrated via the following tests: spodoptera littoralis (egyptian cotton leaf worm) cotton leaf discs were placed on agar in 24-well microtiter plates and sprayed with aqueous test solutions prepared from 10ό00 ppm dmso stock solutions. after drying the leaf discs were infested with five l1 larvae. the samples were assessed for mortality, anti-feedant effect, and growth inhibition in comparison to untreated samples 3 days after infestation. control of spodoptera littoralis by a test sample is when at least one of mortality, anti-feedant effect, and growth inhibition is higher than the untreated sample. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 1 , 2, 4, 5, 6, 7, 8, 9, 10, 1 1 , 12, 13, 14, 15, 16, 17, 18, 19, 20, 21 , 22, 23, 24, 25, 26, 27, 28, 30, 31 , 32, 33, 34, 35, 36, 37, 38, 43, 44, 45, 46, 47, 48, 49, 50, 51 , 52, 54, 56, 57, 58, 59, 60, 62, 64, 65, 67, 68, 69. plutella xylostella (diamond back moth): 24-well microtiter plates with artificial diet were treated with aqueous test solutions prepared from 10ό00 ppm dmso stock solutions by pipetting. after drying, the plates were infested with l2 larvae (10 to 15 per well). the samples were assessed for mortality and growth inhibition in comparison to untreated samples 5 days after infestation. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 1 , 2, 5, 6, 7, 8, 9, 10, 1 1 , 12, 13, 14, 15, 16, 17, 18, 19, 20, 21 , 22, 23, 24, 25, 26, 27, 28, 29, 30, 31 , 32, 33, 34, 35, 36, 37, 38, 39, 43, 44, 45, 46, 47, 48, 49, 50, 51 , 52, 54, 56, 57, 58, 59, 60, 62, 64, 65, 67, 68, 69. diabrotica balteata, (corn root worm) maize sprouts, placed on an agar layer in 24-well microtiter plates were treated with aqueous test solutions prepared from 10ό00 ppm dmso stock solutions by spraying. after drying, the plates were infested with l2 larvae (6 to 10 per well). the samples were assessed for mortality and growth inhibition in comparison to untreated samples 4 days after infestation. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 1 , 2, 5, 6, 7, 8, 9, 10, 1 1 , 12, 13, 14, 15, 16, 17, 18, 19, 20, 21 , 22, 23, 24, 25, 26, 27, 28, 29, 30, 31 , 32, 33, 34, 35, 36, 37, 39, 41 , 43, 45, 46, 47, 48, 49, 50, 51 , 52, 54, 56, 57, 58, 59, 60 and 62. thrips tabaci (onion thrips): sunflower leaf discs were placed on agar in 24-well microtiter plates and sprayed with aqueous test solutions prepared from 10ό00 ppm dmso stock solutions. after drying the leaf discs were infested with a thrips population of mixed ages. the samples were assessed for mortality 6 days after infestation. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 2, 5, 6, 7, 8, 9, 10, 1 1 , 12, 13, 14, 17, 18, 19, 20, 21 , 22, 25, 26, 27, 28, 31 , 32, 33, 34, 35, 36, 37, 43, 45, 46, 47, 48, 49, 50, 51 , 52, 54, 56, 57, 59, 60 and 62. tetranychus urticae (two-spotted spider mite): bean leaf discs on agar in 24-well microtiter plates were sprayed with aqueous test solutions prepared from 10ό00 ppm dmso stock solutions. after drying the leaf discs were infested with a mite population of mixed ages. the samples were assessed for mortality on mixed population (mobile stages) 8 days after infestation. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 1 , 2, 5, 8, 9, 10, 12, 17, 18, 19, 20, 21 , 22, 23, 24, 25, 26, 33, 34, 35, 36, 37, 38, 45, 46, 48, 49, 50, 51 , 52, 54, 57, 58, 59, 60, 62, 64, 65, 67, 68, 69. euschistus heros (neotropical brown stink bug): soybean leaves on agar in 24-well microtiter plates were sprayed with aqueous test solutions prepared from 10ό00 ppm dmso stock solutions. after drying the leaves were infested with n2 nymphs. the samples were assessed for mortality and growth inhibition in comparison to untreated samples 5 days after infestation. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 1 , 2, 5, 6, 9, 12, 18, 21 , 25 32, 33, 34, 35, 36, 37, 38, 45, 46, 47, 48, 49, 50, 51 , 52, 54, 57, 59, 60, 62, 65, 68, 69. myzus persicae (green peach aphid): sunflower leaf discs were placed on agar in a 24-well microtiter plate and sprayed with test solutions at an application rate of 200 ppm. after drying, the leaf discs were infested with an aphid population of mixed ages. after an incubation period of 6 dat, samples were checked for mortality. the following compounds resulted in at least 80% control at an application rate of 200 ppm: compounds 2, 5, 8, 9, 10, 12, 14, 17, 18, 19, 21 , 22, 23, 25, 26, 27, 29, 33, 34, 35, 36, 37, 38, 41 , 45, 46, 47, 48, 49, 50, 51 , 52, 54, 57, 59, 60, 62, 64, 69. the compounds of the invention can be distinguished from known compounds by virtue of greater efficacy at low application rates, which can be verified by the person skilled in the art using the experimental procedures outlined in the examples, using lower application rates if necessary, for example 50 ppm, 12.5 ppm, 6 ppm, 3 ppm, 1.5 ppm, 0.8 ppm or 0.2 ppm. furthermore, besides of the insecticidal properties, the compounds according to any one of embodiments 1 to 34 have surprisingly shown to have improved degradation properties compared with prior art compounds. additionally, the compounds according to any one of embodiments 1 to 34 have surprisingly shown to be environmentally more tolerated than prior art compounds.
174-095-810-705-171	US	[ "EP", "US", "CN", "WO" ]	B29C65/00,B33Y30/00,B33Y40/00,B33Y80/00,B33Y99/00,F16L37/00,F16L37/62,B05B1/22,B23K26/34,B23K26/354,F16L21/08,B22F10/28,B22F12/53,B22F10/20,B33Y10/00,B05B7/22,B05B12/14,B05B13/04,B05B15/65,B05C7/04,B05C11/10,B22F5/10,B22F12/00,B62D27/02	2018-06-05T00:00:00	2018	[ "B29", "B33", "F16", "B05", "B23", "B22", "B62" ]	a quick-change end effector	an end effector for interfacing with a nozzle is disclosed. the end effector comprises a first end, which includes a receptacle. the end effector comprises one or more retention features positioned along a perimeter of the receptacle, where each of the one or more retention features is movable between a first position and a second position. each of the one or more retention features is configured to lock the nozzle by securing onto a corresponding one of the one or more nozzle retention features in the first position, and to release the nozzle in the second position. the end effector may further comprise one or more actuators and a first channel, which includes a first inlet and a first outlet. a method of using an end effector to interface with a nozzle is also disclosed.	1 . an end effector for interfacing with a nozzle, the end effector comprising: a first end comprising a receptacle, the receptacle being configured to receive the nozzle, the nozzle comprising one or more nozzle retention features and a first nozzle inlet; one or more retention features positioned along a perimeter of the receptacle, each of the one or more retention features being movable between a first position and a second position, each of the one or more retention features being configured to lock the nozzle by securing onto a corresponding one of the one or more nozzle retention features in the first position, and to release the nozzle in the second position; one or more actuators configured to actuate the one or more retention features between the first position and the second position; and a first channel comprising a first inlet and a first outlet, the first outlet being positioned inside the receptacle and being configured to be coupled to the first nozzle inlet in the first position. 2 . the end effector of claim 1 , wherein the one or more nozzle retention features comprises a groove, and wherein the one or more retention features comprises one or more cleats. 3 . the end effector of claim 1 , wherein the one or more nozzle retention features comprise one or more recesses, and wherein the one or more retention features comprise one or more protrusions. 4 . the end effector of claim 1 , wherein the one or more actuators include one or more pneumatic actuators. 5 . the end effector of claim 4 , wherein the one or more pneumatic actuators include one or more pneumatic cylinders. 6 . the end effector of claim 1 , wherein the one or more actuators include one or more hydraulic actuators. 7 . the end effector of claim 1 , wherein the one or more actuators include one or more electrical actuators. 8 . the end effector of claim 1 , further comprising an exterior surface, and wherein the first inlet is positioned on the exterior surface. 9 . the end effector of claim 1 , wherein the first channel is configured to inject a first fluid through the first outlet into the first nozzle inlet. 10 . the end effector of claim 1 , wherein the receptacle includes a side wall, and wherein the first outlet is disposed on the side wall to enable a first fluid to be injected into the first nozzle inlet with a positive pressure perpendicular to an axial direction of the nozzle. 11 . the end effector of claim 1 , wherein the first outlet is disposed to enable an adhesive to be injected into the first nozzle inlet radially. 12 . the end effector of claim 1 , wherein the nozzle has an effector end, and wherein the receptacle has a size compatible with a size of the effector end of the nozzle to enable the receptacle to fit into the effector end. 13 . the end effector of claim 1 , further comprising a second end, wherein the second end is configured to be coupled to a robot. 14 . the end effector of claim 1 , further comprising a second channel, wherein the nozzle further comprises a second nozzle inlet, wherein the second channel comprises a second inlet and a second outlet, and wherein the second outlet is configured to be coupled to the second nozzle inlet in the first position. 15 . the end effector of claim 14 , wherein the second channel is configured to facilitate removing adhesive first fluid from the nozzle. 16 . the end effector of claim 14 , wherein the second inlet is configured to be coupled to a negative pressure source to apply vacuum to the second nozzle inlet. 17 . the end effector of claim 14 , further comprising an exterior surface, and wherein the second inlet is positioned on the exterior surface. 18 . the end effector of claim 14 , wherein the first channel and the second channel are isolated from each other. 19 . the end effector of claim 14 , further comprising a third channel, wherein the nozzle further comprises a third nozzle inlet, wherein the third channel comprises a third inlet and a third outlet. 20 . the end effector of claim 19 , wherein the third outlet is configured to be coupled to the third nozzle inlet in the first position. 21 . the end effector of claim 19 , wherein the third channel is configured to dispense a sealant through the third outlet to the third nozzle inlet. 22 . the end effector of claim 19 , further comprising an exterior surface, and wherein the third inlet is positioned on the exterior surface. 23 . the end effector of claim 19 , wherein the receptacle includes a side wall, and wherein the third outlet is disposed on the side wall to enable another fluid to be injected into the third nozzle inlet with a positive pressure perpendicular to an axial direction of the nozzle. 24 . the end effector of claim 19 , wherein the third outlet is disposed to enable a fluid to be injected into the third nozzle inlet radially. 25 . the end effector of claim 19 , wherein a diameter of the third channel is larger than a diameter of the first channel. 26 . the end effector of claim 19 , wherein the first channel, the second channel, and the third channel are isolated from each other. 27 . the end effector of claim 1 is an additively manufactured end effector. 28 . a method of using an end effector to interface with a nozzle, the method comprising: receiving the nozzle in a receptacle of the end effector; actuating one or more retention features of the end effector to a first position to securing onto a corresponding one of one or more nozzle retention features to lock the nozzle; applying vacuum to a second inlet of the end effector, wherein a second outlet of the end effector is coupled to a second nozzle inlet; and injecting a first fluid to a first inlet of the end effector, wherein a first outlet of the end effector is coupled to a first nozzle inlet. 29 . the method of claim 28 , wherein injecting an adhesive comprises injecting the adhesive into the first nozzle inlet with a positive pressure perpendicular to an axial direction of the nozzle. 30 . the method of claim 28 , wherein injecting an adhesive comprises injecting the adhesive into the first nozzle inlet radially. 31 . the method of claim 28 , further comprising removing the adhesive from the second outlet. 32 . the method of claim 28 , further comprising dispensing another fluid to a third inlet of the end effector, wherein a third outlet of the end effector is coupled to a third nozzle inlet. 33 . the method of claim 32 , wherein dispensing another fluid comprises dispensing a sealant. 34 . the method of claim 32 , wherein dispensing another fluid comprises dispensing the another fluid into the third inlet of nozzle with a positive pressure perpendicular to an axial direction of the nozzle. 35 . the method of claim 32 , wherein dispensing another fluid comprises dispensing the another fluid into the third inlet of nozzle radially. 36 . the method of claim 28 , further comprising coupling the end effector to a robot. 37 . the method of claim 28 is performed by a robot.	incorporation by reference all publications and patent applications mentioned in this specification are incorporated herein by reference in their entirety to the same extent as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference, including: u.s. patent application ser. no. 15/975,679, titled “multi-circuit single port design in additively manufactured node”, filed on may 9, 2018. background field the present disclosure generally relates to additively manufactured end effectors, and more specifically to additively manufactured end effectors for fluid interfaces in additively manufactured nodes. background nodes perform important connection functions between various components in transport structures. the nodes may be bonded to other components including tubes, extrusions, panels, and other nodes. for example, nodes can be used to perform connections for panels. a transport structure such as an automobile, truck or aircraft employs a large number of interior and exterior panels. most panels must be coupled to, or interface with, other panels or other structures in secure, well-designed ways. these connection types may be accomplished by using nodes. the nodes, or joint members, may serve not only to attach to, interface with, and secure the panel, but they also may be used to form connections to other components of the automobile (e.g., another panel, an extrusion, tubes, other nodes, etc.). the design and manufacture of end effectors for interfacing with nozzles of the nodes has several problems. for example, the end effectors are often specialized structures requiring intricate sub-substructures. it is often extremely difficult to manufacture these types of complex structures efficiently or cheaply using traditional manufacturing processes. for another example, in the manufacturing process, there are a large number of nodes, the conventional interfaces with the nozzles of the nodes may be too time consuming and may not be efficient for mass assembly. there is a need to develop efficient end effectors with increased sophistication and superior capabilities for the interface nozzles, specifically, for the nozzles of the nodes of transport structures to implement potentially high-performance applications at manageable price points. summary end effectors for interfacing with the nozzles of the nodes, including the nodes for transport structures, and the additive manufacture thereof will be described more fully hereinafter with reference to various illustrative aspects of the present disclosure. in one aspect of the disclosure, an end effector for interfacing with a nozzle is provided. the end effector comprises a first end, which includes a receptacle. the receptacle is configured to receive the nozzle. the nozzle includes one or more nozzle retention features and a first nozzle inlet. the end effector comprises one or more retention features positioned along a perimeter of the receptacle, where each of the one or more retention features is movable between a first position and a second position. each of the one or more retention features is configured to lock the nozzle by securing onto a corresponding one of the one or more nozzle retention features in the first position, and to release the nozzle in the second position. the end effector may further comprise one or more actuators configured to actuate the one or more retention features between the first position and the second position. the end effector comprises a first channel, which includes a first inlet and a first outlet. the first outlet is positioned inside the receptacle and is configured to be coupled to the first nozzle inlet in the first position. in another aspect of the disclosure, a method of using an end effector to interface with a nozzle is provided. the method comprises receiving the nozzle in a receptacle of the end effector. the method comprises actuating one or more retention features of the end effector to a first position to secure onto a corresponding one of one or more nozzle retention features to lock the nozzle. the method comprises applying vacuum to a second inlet of the end effector, where a second outlet of the end effector is coupled to a second nozzle inlet. the method comprises injecting a first fluid to a first inlet of the end effector, wherein a first outlet of the end effector is coupled to a first nozzle inlet. it will be understood that other aspects of nodes for connecting with various components in transport structures and the manufacture thereof will become readily apparent to those skilled in the art from the following detailed description, wherein it is shown and described only several embodiments by way of illustration. as will be realized by those skilled in the art, the disclosed subject matter is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the invention. accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not as restrictive. brief description of the drawings various aspects of nodes in transport structures and the manufacture thereof will now be presented in the detailed description by way of example, and not by way of limitation, in the accompanying drawings, wherein: fig. 1 illustrates an exemplary embodiment of certain aspects of a direct metal deposition (dmd) 3-d printer. fig. 2 illustrates a conceptual flow diagram of a 3-d printing process using a 3-d printer. figs. 3a-d illustrate an exemplary powder bed fusion (pbf) system during different stages of operation. fig. 4 illustrates a cross-section view of an example of a single port node for bonding to various components. fig. 5a illustrates a cross-section view of a two-channel nozzle for the single port node in fig. 4 . fig. 5b illustrates a perspective view of the two-channel nozzle in fig. 5a . fig. 6a illustrates a cross-section view of a three-channel nozzle for the single port node in fig. 4 . fig. 6b illustrates another cross-section view of the three-channel nozzle in fig. 6a . fig. 7a illustrates a nozzle including a plurality of regions for receiving o-rings/sealants. fig. 7b illustrates a bottom view of a nozzle with a plurality of third outlets. fig. 7c illustrates a bottom view of a nozzle with a plurality of third outlets. fig. 8 is a flow diagram of an example method of using a single port node. fig. 9a illustrates a perspective view of an example of a single port node for bonding to various components. fig. 9b illustrates a top view of the single port node in fig. 9a . fig. 9c illustrates another perspective view of the single port node in fig. 9a . fig. 10 illustrates a side view of an example of an end effector for interfacing with a nozzle according to one embodiment of this disclosure. fig. 11a illustrates a top view of the end effector in fig. 10 in a first position. fig. 11b illustrates another top view of the end effector in fig. 10 in a second position. fig. 12 illustrates a perspective view of the end effector in fig. 10 . fig. 13 is a flow diagram of an example method of using an end effector to interface with a nozzle. detailed description the detailed description set forth below in connection with the appended drawings is intended to provide a description of various exemplary embodiments and is not intended to represent the only embodiments in which the invention may be practiced. the terms “example” and “exemplary” used throughout this disclosure mean “serving as an example, instance, or illustration,” and should not necessarily be construed as preferred or advantageous over other embodiments presented in this disclosure. the detailed description includes specific details for the purpose of providing a thorough and complete disclosure that fully conveys the scope of the invention to those skilled in the art. however, the invention may be practiced without these specific details. in some instances, well-known structures and components may be shown in block diagram form, or omitted entirely, in order to avoid obscuring the various concepts presented throughout this disclosure. in addition, the figures may not be drawn to scale and instead may be drawn in a way that attempts to most effectively highlight various features relevant to the subject matter described. this disclosure is generally directed an end effector for interfacing with a nozzle. the end effector comprises a first end, which includes a receptacle. the receptacle is configured to receive the nozzle. the nozzle includes one or more nozzle retention features and a first nozzle inlet. the end effector comprises one or more retention features positioned along a perimeter of the receptacle, where each of the one or more retention features is movable between a first position and a second position. each of the one or more retention features is configured to lock the nozzle by securing onto a corresponding one of the one or more nozzle retention features in the first position, and to release the nozzle in the second position. the end effector may further comprise one or more actuators configured to actuate the one or more retention features between the first position and the second position. the end effector comprises a first channel, which includes a first inlet and a first outlet. the first outlet is positioned inside the receptacle and is configured to be coupled to the first nozzle inlet in the first position. in many cases, the nodes, and other structures described in this disclosure may be formed using additive manufacturing (am) techniques, due in part to am's innumerable advantages as articulated below. accordingly, certain exemplary am techniques that may be relevant to the formation of the nodes described herein will initially be discussed. it should be understood, however, that numerous alternative manufacturing techniques, both additive and conventional, may instead be used in forming the nodes (in part or in whole) disclosed herein, and that the identified nodes need not be limited to the specific am techniques below. those that stand to benefit from the structures and techniques in this disclosure include, among others, manufacturers of virtually any mechanized form of transport, which often rely heavily on complex and labor-intensive tooling, and whose products often require the development of nodes, panels, and interconnects to be integrated with intricate machinery such as combustion engines, transmissions and increasingly sophisticated electronics. examples of such transport structures include, among others, trucks, trains, tractors, boats, aircraft, motorcycles, busses, and the like. additive manufacturing (3-d printing). additive manufacturing (am) is advantageously a non-design specific manufacturing technique. am presents various opportunities to realize structural and non-structural connections between various components. am provides the ability to create complex structures within a part. for example, nodes can be produced using am. a node is a structural member that may include one or more interfaces used to connect to other spanning components such as tubes, extrusions, panels, other nodes, and the like. using am, a node may be constructed to include additional features and functions, depending on the objectives. for example, a node may be printed with one or more ports that enable the node to secure two parts by injecting an adhesive rather than welding multiple parts together, as is traditionally done in manufacturing complex products. alternatively, some components may be connected using a brazing slurry, a thermoplastic, a thermoset, or another connection feature, any of which can be used interchangeably in place of an adhesive. thus, while welding techniques may be suitable with respect to certain embodiments, am provides significant flexibility in enabling the use of alternative or additional connection techniques. am provides the platform to print components with complex internal channels and geometries, some of which are impossible to manufacture using conventional manufacturing techniques. a variety of different am techniques have been used to 3-d print components composed of various types of materials. numerous available techniques exist, and more are being developed. for example, directed energy deposition (ded) am systems use directed energy sourced from laser or electron beams to melt metal. these systems utilize both powder and wire feeds. the wire feed systems advantageously have higher deposition rates than other prominent am techniques. single pass jetting (spj) combines two powder spreaders and a single print unit to spread metal powder and to print a structure in a single pass with apparently no wasted motion. as another illustration, electron beam additive manufacturing processes use an electron beam to deposit metal via wire feedstock or sintering on a powder bed in a vacuum chamber. single pass jetting is another exemplary technology claimed by its developers to be much quicker than conventional laser-based systems. atomic diffusion additive manufacturing (adam) is still another recently developed technology in which components are printed, layer-by-layer, using a metal powder in a plastic binder. after printing, plastic binders are removed and the entire part is sintered at once into a desired metal. one of several such am techniques, as noted, is dmd. fig. 1 illustrates an exemplary embodiment of certain aspects of a dmd 3-d printer 100 . dmd printer 100 uses feed nozzle 102 moving in a predefined direction 120 to propel powder streams 104 a and 104 b into a laser beam 106 , which is directed toward a workpiece 112 that may be supported by a substrate. feed nozzle may also include mechanisms for streaming a shield gas 116 to protect the welded area from oxygen, water vapor, or other components. the powdered metal is then fused by the laser 106 in a melt pool region 108 , which may then bond to the workpiece 112 as a region of deposited material 110 . the dilution area 114 may include a region of the workpiece where the deposited powder is integrated with the local material of the workpiece. the feed nozzle 102 may be supported by a computer numerical controlled (cnc) robot or a gantry, or other computer-controlled mechanism. the feed nozzle 102 may be moved under computer control multiple times along a predetermined direction of the substrate until an initial layer of the deposited material 110 is formed over a desired area of the workpiece 112 . the feed nozzle 102 can then scan the region immediately above the prior layer to deposit successive layers until the desired structure is formed. in general, the feed nozzle 102 may be configured to move with respect to all three axes, and in some instances to rotate on its own axis by a predetermined amount. fig. 2 is a flow diagram 200 illustrating an exemplary process of 3-d printing. a data model of the desired 3-d object to be printed is rendered (step 210 ). a data model is a virtual design of the 3-d object. thus, the data model may reflect the geometrical and structural features of the 3-d object, as well as its material composition. the data model may be created using a variety of methods, including cae-based optimization, 3d modeling, photogrammetry software, and camera imaging. cae-based optimization may include, for example, cloud-based optimization, fatigue analysis, linear or non-linear finite element analysis (fea), and durability analysis. 3-d modeling software, in turn, may include one of numerous commercially available 3-d modeling software applications. data models may be rendered using a suitable computer-aided design (cad) package, for example in an stl format. stl is one example of a file format associated with commercially available stereolithography-based cad software. a cad program may be used to create the data model of the 3-d object as an stl file. thereupon, the stl file may undergo a process whereby errors in the file are identified and resolved. following error resolution, the data model can be “sliced” by a software application known as a slicer to thereby produce a set of instructions for 3-d printing the object, with the instructions being compatible and associated with the particular 3-d printing technology to be utilized (step 220 ). numerous slicer programs are commercially available. generally, the slicer program converts the data model into a series of individual layers representing thin slices (e.g., 100 microns thick) of the object be printed, along with a file containing the printer-specific instructions for 3-d printing these successive individual layers to produce an actual 3-d printed representation of the data model. the layers associated with 3-d printers and related print instructions need not be planar or identical in thickness. for example, in some embodiments depending on factors like the technical sophistication of the 3-d printing equipment and the specific manufacturing objectives, etc., the layers in a 3-d printed structure may be non-planar and/or may vary in one or more instances with respect to their individual thicknesses. a common type of file used for slicing data models into layers is a g-code file, which is a numerical control programming language that includes instructions for 3-d printing the object. the g-code file, or other file constituting the instructions, is uploaded to the 3-d printer (step 230 ). because the file containing these instructions is typically configured to be operable with a specific 3-d printing process, it will be appreciated that many formats of the instruction file are possible depending on the 3-d printing technology used. in addition to the printing instructions that dictate what and how an object is to be rendered, the appropriate physical materials necessary for use by the 3-d printer in rendering the object are loaded into the 3-d printer using any of several conventional and often printer-specific methods (step 240 ). in dmd techniques, for example, one or more metal powders may be selected for layering structures with such metals or metal alloys. in selective laser melting (slm), selective laser sintering (sls), and other pbf-based am methods (see below), the materials may be loaded as powders into chambers that feed the powders to a build platform. depending on the 3-d printer, other techniques for loading printing materials may be used. the respective data slices of the 3-d object are then printed based on the provided instructions using the material(s) (step 250 ). in 3-d printers that use laser sintering, a laser scans a powder bed and melts the powder together where structure is desired, and avoids scanning areas where the sliced data indicates that nothing is to be printed. this process may be repeated thousands of times until the desired structure is formed, after which the printed part is removed from a fabricator. in fused deposition modelling, as described above, parts are printed by applying successive layers of model and support materials to a substrate. in general, any suitable 3-d printing technology may be employed for purposes of this disclosure. another am technique includes powder-bed fusion (“pbf”). like dmd, pbf creates ‘build pieces’ layer-by-layer. each layer or ‘slice’ is formed by depositing a layer of powder and exposing portions of the powder to an energy beam. the energy beam is applied to melt areas of the powder layer that coincide with the cross-section of the build piece in the layer. the melted powder cools and fuses to form a slice of the build piece. the process can be repeated to form the next slice of the build piece, and so on. each layer is deposited on top of the previous layer. the resulting structure is a build piece assembled slice-by-slice from the ground up. figs. 3a-d illustrate respective side views of an exemplary pbf system 300 during different stages of operation. as noted above, the particular embodiment illustrated in figs. 3a-d is one of many suitable examples of a pbf system employing principles of this disclosure. it should also be noted that elements of figs. 3a-d and the other figures in this disclosure are not necessarily drawn to scale, but may be drawn larger or smaller for the purpose of better illustration of concepts described herein. pbf system 300 can include a depositor 301 that can deposit each layer of metal powder, an energy beam source 303 that can generate an energy beam, a deflector 305 that can apply the energy beam to fuse the powder, and a build plate 307 that can support one or more build pieces, such as a build piece 309 . pbf system 300 can also include a build floor 311 positioned within a powder bed receptacle. the walls of the powder bed receptacle 312 generally define the boundaries of the powder bed receptacle, which is sandwiched between the walls 312 from the side and abuts a portion of the build floor 311 below. build floor 311 can progressively lower build plate 307 so that depositor 301 can deposit a next layer. the entire mechanism may reside in a chamber 313 that can enclose the other components, thereby protecting the equipment, enabling atmospheric and temperature regulation and mitigating contamination risks. depositor 301 can include a hopper 315 that contains a powder 317 , such as a metal powder, and a leveler 319 that can level the top of each layer of deposited powder. referring specifically to fig. 3a , this figure shows pbf system 300 after a slice of build piece 309 has been fused, but before the next layer of powder has been deposited. in fact, fig. 3a illustrates a time at which pbf system 300 has already deposited and fused slices in multiple layers, e.g., 150 layers, to form the current state of build piece 309 , e.g., formed of 150 slices. the multiple layers already deposited have created a powder bed 321 , which includes powder that was deposited but not fused. fig. 3b shows pbf system 300 at a stage in which build floor 311 can lower by a powder layer thickness 323 . the lowering of build floor 311 causes build piece 309 and powder bed 321 to drop by powder layer thickness 323 , so that the top of the build piece and powder bed are lower than the top of powder bed receptacle wall 312 by an amount equal to the powder layer thickness. in this way, for example, a space with a consistent thickness equal to powder layer thickness 323 can be created over the tops of build piece 309 and powder bed 321 . fig. 3c shows pbf system 300 at a stage in which depositor 301 is positioned to deposit powder 317 in a space created over the top surfaces of build piece 309 and powder bed 321 and bounded by powder bed receptacle walls 312 . in this example, depositor 301 progressively moves over the defined space while releasing powder 317 from hopper 315 . leveler 319 can level the released powder to form a powder layer 325 that has a thickness substantially equal to the powder layer thickness 323 (see fig. 3b ). thus, the powder in a pbf system can be supported by a powder support structure, which can include, for example, a build plate 307 , a build floor 311 , a build piece 309 , walls 312 , and the like. it should be noted that the illustrated thickness of powder layer 325 (i.e., powder layer thickness 323 ( fig. 3b )) is greater than an actual thickness used for the example involving 350 previously-deposited layers discussed above with reference to fig. 3a . fig. 3d shows pbf system 300 at a stage in which, following the deposition of powder layer 325 ( fig. 3c ), energy beam source 303 generates an energy beam 327 and deflector 305 applies the energy beam to fuse the next slice in build piece 309 . in various exemplary embodiments, energy beam source 303 can be an electron beam source, in which case energy beam 327 constitutes an electron beam. deflector 305 can include deflection plates that can generate an electric field or a magnetic field that selectively deflects the electron beam to cause the electron beam to scan across areas designated to be fused. in various embodiments, energy beam source 303 can be a laser, in which case energy beam 327 is a laser beam. deflector 305 can include an optical system that uses reflection and/or refraction to manipulate the laser beam to scan selected areas to be fused. in various embodiments, the deflector 305 can include one or more gimbals and actuators that can rotate and/or translate the energy beam source to position the energy beam. in various embodiments, energy beam source 303 and/or deflector 305 can modulate the energy beam, e.g., turn the energy beam on and off as the deflector scans so that the energy beam is applied only in the appropriate areas of the powder layer. for example, in various embodiments, the energy beam can be modulated by a digital signal processor (dsp). one aspect of this disclosure presents a node for enabling connection of various components of transport structures. the node may include a port extending inwardly from a surface to form a recess. the node may further include an inlet aperture disposed inside the port and an outlet aperture disposed inside the port. the inlet aperture is configured to receive a fluid injected into at least one region to be filled by the fluid. the outlet aperture is configured to enable the fluid to flow out of the at least one region. the port is configured to receive a nozzle to enable injection of the fluid and removal of the fluid. for example, the fluid can be an adhesive configured to bond various components together. in an embodiment, at least one connection of the node may be a part of a vehicle chassis. this type of node connection may incorporate adhesive bonding between the node and the component to realize the connection. sealants may be used to provide adhesive regions for adhesive injection. in an exemplary embodiment, a seal may act as an isolator to inhibit potential galvanic corrosion caused, e.g., by the chronic contact between dissimilar materials. fig. 4 illustrates a cross-sectional view of an example of a single port node 400 for bonding to various components according to one embodiment of this disclosure. the node 400 can include a port 402 , an inlet aperture 404 and an outlet aperture 406 . for example, the port 402 may extend inwardly from an external surface 403 to form a recess. the inlet aperture 404 is disposed inside the port 402 and configured to receive a fluid 408 injected into at least one region to be filled by the fluid. for example, the fluid may be an adhesive configured to bond to various components through at least one adhesive region. the outlet aperture 406 is disposed inside the port 402 and configured to enable the fluid 408 to flow out of the at least one region. the port 402 is configured to receive a nozzle to enable injection and removal of the fluid 408 . adhesive is used below as an example in this disclosure for the fluid, however, the fluid can be any other fluid as well. the port 402 may additionally be a vacuum port for applying negative pressure to draw the adhesive towards the outlet aperture 406 to which the port is coupled. the outlet aperture 406 is configured to be coupled to a negative pressure source, and the port 402 is configured to be both an injection port and a vacuum port. while the adhesive application process in this disclosure may include a combination of vacuum and adhesive applications, the disclosure is not limited as such, and adhesive may in some exemplary embodiments be injected without use of negative pressure. in these cases, the positive pressure causing the adhesive flow may be sufficient to fill the adhesive regions. as shown in fig. 4 , the single port 402 may be utilized for both the adhesive inlet and outlet operations. the port 402 may be in a cylindrical shape and extend in an axial direction in some embodiments. in some other embodiments, the port can be in a conical shape, a cubic shape, or any other shape. in some alternative embodiments, the port may be a protrusion extending upwardly from the external surface 403 with a recess in a central portion of the protrusion that includes the apertures or other structures. the ports may also include protrusions built in surrounding holes, such that the tips of the protrusions may be flush with or proximate in height to the external surface of the node. in embodiments utilizing protruding ports, the ports may optionally be fabricated with the intent of being broken off upon completion of the bonding process, which may also reduce mass and volume of the corresponding node or other structure that includes the ports. for example, the port may have other configurations as well. for purposes of this disclosure, “port” may be broadly construed to include either a recess or protrusion in a structure, along with their constituent aperture(s), that receives or provides a substance (including, e.g., fluids, gasses, powders, etc.), and therefore “port” would encompass any of the embodiments discussed above. as shown in fig. 4 , two apertures 404 and 406 are disposed inside the port 402 . the adhesive inlet aperture 404 is configured for receiving adhesive 408 injected into the channel 407 and toward the adhesive regions. the adhesive outlet aperture 406 is configured for removing the adhesive 408 from the channel 407 and/or for determining whether and when the adhesive 408 has substantially filled the necessary regions of the node or structure. for example, the inlet aperture 404 is disposed on a side wall of the port 402 . thus, the adhesive 408 is injected into the channel 407 by a positive pressure perpendicular to an axial direction 401 of the port 402 . this would advantageously prevent the displacement of the nozzle during the adhesive injection process. if the adhesive is injected along the axial direction 401 of the port 402 , the injection pressure may push the effector or applicator for injecting the adhesive out of the port. thus in this embodiment, the adhesive injection is perpendicular to the axial direction 401 . the outlet aperture 406 may disposed on a bottom of the port 402 . in some embodiments, the node 400 may further include a second inlet aperture disposed inside the port 402 , for example, on the side wall of the port 402 . in some embodiments, the node 400 may further include a plurality of inlet apertures disposed inside the port 402 . for example, the plurality of inlet apertures may be disposed circumferentially around the port 402 . similarly, in some embodiments, the node 400 may further include a second outlet aperture disposed inside the port 402 , for example, on the bottom of the port 402 . in some embodiments, the node 400 may further include a plurality of outlet apertures disposed inside the port 402 . for example, the plurality of outlet apertures may be disposed in the bottom of the port 402 . it will also be noted in this simplified embodiment that, while the adhesive 408 is shown as flowing from input aperture 404 through a short channel 407 to outlet aperture 406 , in practice, the adhesive 408 may be designed to flow through a desired region of the node 400 where the adhesive 408 is needed. thus, the short channel 407 may instead be a long channel or series of channels coupled intermediately to one or more adhesive bond regions, which are spaces or regions of the node 400 desired for adhesive deposit. these details are omitted from the view of fig. 4 for simplicity and clarity. there are many possible variations and configurations of the location and arrangement of the inlet aperture 404 and the outlet aperture 406 . the above example is for illustration purposes only and is not intended to limit the scope of the disclosure. in some embodiments, the inlet and outlet apertures 404 and 406 may have a diameter of 1 mm or greater, although smaller values are possible and may be equally suitable in some embodiments. for example, the inlet and outlet apertures 404 and 406 may have a diameter between 1 mm and 30 mm in an embodiment. the inlet and outlet apertures may have the same or different diameters. the inlet and outlet apertures 404 and 406 need not have the same shape, and may be shaped in geometries other than elliptical geometries. for example, the apertures 404 and 406 may be rectangular or otherwise arbitrarily shaped. in some cases, the shape of the apertures 404 and 406 coincides with the shape of one or more portions of the channels that join them. the port 402 may have a cylindrical shape or any other shape. the inlet aperture and the outlet aperture may have any suitable shape as noted. the port may also include any other shape, such as a cubic shape, a conical shape, or any arbitrary shape. the node 400 may further include at least one channel 407 extending from the adhesive inlet aperture 404 to the at least one adhesive bond region (not shown) and further to the adhesive outlet aperture 406 . the port 402 is coupled to the channel 407 through both the adhesive inlet aperture 404 and the adhesive outlet aperture 406 disposed inside the port 402 . instead of having two separate ports for injection and removal of the adhesive as is the conventional practice, the adhesive inlet aperture 404 inside the port 402 receives injection of the adhesive, and the adhesive outlet aperture 406 inside the same port 402 performs removal of the adhesive (or, in other embodiments, a visual, tactile or other indication that the adhesive is full so that the injection operation can be ended e.g., when the adhesive begins to exit aperture 406 ). in this way, the single port 402 performs the functions of both injection and removal of the adhesive. the channel(s) 407 may extend from the adhesive inlet aperture 404 , may travel through the node 400 to apply adhesive to the bond region(s), and may be coupled to the adhesive outlet aperture 406 . for example, the channel may be an elliptical channel that traverses the node in a desired location and may connect to a wider or bigger bond region, and then may be routed from the bond region as a similarly-shaped elliptical channel to the adhesive outlet aperture 406 . in some embodiments, multiple parallel channels may be employed as an alternative to a single, segmented channel. moreover, the diameter of the channels can be varied along their lengths. these structures can advantageously be manufactured using am techniques without requiring any significant post-processing operations. in other embodiments, adhesive inlet aperture 404 may comprise more than one aperture and may receive injected adhesive 408 in parallel. with reference to the single-port embodiment of fig. 4 , for example, the inlet aperture 404 may in these embodiments comprise a plurality of inlet apertures disposed along a designated circumference of the cylindrical region of the port. in addition, in these or other embodiments, more than one adhesive outlet aperture may be arranged on a bottom portion of the cylindrical region. these one or more apertures 404 and/or 406 may correspond to one or more channels 407 for delivering adhesive to and from the adhesive bond region(s). in still other embodiments, as noted above, each of the one or more apertures and/or channels may include a variety of geometries, as suitable for the application. the channel 407 may be a part of the node 400 and may be additively manufactured using any suitable am technique. the channel 407 may comprise multiple channel portions after it enters and then exits an adhesive region. depending on the embodiment and whether adhesive is injected serially or in parallel, the node may be considered to have one or more channels as described above. in general, the design of the channels may enable sequential flow of the adhesive into specific adhesive bond regions between an inner surface of the node and an outer surface of a component intended to be connected to the node. the node may also be extended, elongated, or shaped in any way to enable multiple sets of interface regions (i.e., sets of one or more adhesive bond regions with sealants and channels as described above to realize a connection) to exist on a single node. for example, in one embodiment, the node is rectangular, with separate interfaces on two or more sides of the rectangular node connecting to different panels via the adhesive process and techniques described above. in other embodiments, nodes may be constructed to have interface regions in close proximity so that two respective panels may be spaced very closely, or so that the panels may make contact. numerous embodiments and geometries of the node may be contemplated. to better facilitate assembly, the node may be printed in two or more parts, with the two or more parts being connected together prior to adhesive injection. the node may constitute additional features, such as connection features to other structures or other structural or functional features that are not explicitly shown in the illustrations herein to avoid unduly obscuring the concepts of the disclosure. these additional features of the node may cause portions of the node to take a different shape or may add structures and geometrical features that are not present in the illustrations herein. these additional features and structures may be additively manufactured along with the remainder of the node, although this may not necessarily be the case, as in some applications, traditional manufacturing techniques such as casting or machining may be used. advantageously, the single port design of the node 400 is efficient, as the port 402 is configured to perform multiple functions, such as an adhesive inlet port and an adhesive outlet port. the port 402 of the node 400 enables the adhesive injection process and removal process through a single port. the port 402 is both an entry point and an exit point for the adhesive 408 or other fluids. in some embodiments, the port 402 is further a vacuum port where the adhesive outlet port is connected to a negative pressure source. in other embodiments, the port 402 need not be a vacuum port but may, for example, be an exit point for excess adhesive. the single port node 400 is further advantageous to reduce the complexity of the adhesive applicator system, which may in some embodiments include a nozzle for performing the adhesive injection/vacuum procedure. only one nozzle is required to draw a vacuum (where desired), inject the adhesive and remove the excessive adhesive. this procedure is in contrast to conventional multi-port designs. the nozzle can further have the ability to allow for the transfer of two or more fluids through the port 402 . this would make the single port design conducive to embodiments wherein other fluids, for example, sealants, may be used to cap off the port after adhesive injection. the single port node 400 is further advantageous in that it reduces the complexity of designing an automated system for applying adhesives. as an example, the nozzle for applying adhesive may be carried or used by a robot. since the robots would have to interface with just one port, the robots can be leaner and more compact than may otherwise be required in a conventional assembly system requiring multiple ports. furthermore, because assembly systems often involve a large number of nodes, the single port node can greatly increase the efficiency of the assembly process. a plurality of nozzles, or interface nozzles, may be utilized with the nodes having a single port for adhesive as described above. the terms “nozzle” and ‘interface nozzle” are used interchangeably in this disclosure. the nozzles may include a plurality of channels, depending on the number of materials used in the adhesive injection process or other factors. o-rings or other seals may be utilized to obtain a sealed interface between the surface of the port on the node, and the nozzle. this sealed interface would ensure that the adhesive injection process occurs in a sealed manner. this sealed interface is particularly advantageous in embodiments utilizing a vacuum connection during the adhesive injection process. the nozzles may be additively manufactured. fig. 5a illustrates a cross-section view of a two-channel nozzle 500 for the single port node 400 , where the nozzle 500 is connected to the node 400 . fig. 5b illustrates a perspective view of the two-channel nozzle 500 . referring to fig. 5a and fig. 5b , the nozzle 500 includes a first channel 517 and a second channel 527 . the first channel 517 includes a first inlet 514 of nozzle and a first outlet 516 of nozzle. the first outlet 516 of nozzle is coupled to the inlet aperture 404 disposed inside the port 402 of the node 400 . the second channel 527 includes a second inlet 524 of nozzle and a second outlet 526 of nozzle. the second outlet 526 of nozzle is coupled to the outlet aperture 406 disposed inside the port 402 . the first channel 517 and the second channel 527 are isolated from one another. the first channel 517 is configured to inject an adhesive through the first outlet 516 of nozzle into the inlet aperture 404 . the second channel 527 is configured to receive the adhesive from the outlet aperture 406 . in some embodiments, the second inlet 524 of nozzle is configured to be coupled to a negative pressure source to apply vacuum to the outlet aperture 406 . the nozzle 500 may be additively manufactured as well. the nozzle 500 includes a first end 500 a and a second end 500 b. the first end 500 a is also referred to as a port end, which is configured to be inserted into the port 402 . the port end 500 a of the nozzle may have a size compatible with a diameter of the port 402 . the second end 500 b is also referred to as an effector end, which is configured to be coupled to an effector. the nozzle 500 may work with one fluid, which is referenced herein as a single circuit embodiment. the nozzle 500 may be used to inject the adhesive and remove the adhesive without applying vacuum. the single circuit embodiment may be utilized to simplify the number of variants in a manufacturing system. for example, the first outlet of nozzle 516 is disposed on a side wall of the port end 500 a, in order to enable the adhesive to be injected into the inlet aperture 404 with a positive pressure perpendicular to an axial direction 401 of the port 402 . the second outlet of nozzle 526 may be disposed on a bottom of the port end of 500 a. the single circuit embodiment can have a great flow capability, but the single circuit embodiment only works with a single fluid, such as an adhesive, or a sealant, that would not be vacuumed and would be injected with positive pressure only. the nozzle 500 may further work with two fluids, which is referenced herein as a two circuit embodiment. the nozzle 500 may be used to apply vacuum to the adhesive outlet aperture 406 of the node 400 through the second channel 527 , and inject the adhesive into the adhesive inlet aperture 404 of the node 400 through the first channel 517 . the port end 500 a of the nozzle 500 may be inserted into the port 402 of the node 400 . the vacuum may be applied to the port 402 . the negative pressure from the vacuum may cause the nozzle 500 to be pulled more tightly into the port 402 , which is an interface receptacle port. this tight connection helps ensure that the correct inlets and outlets of the nozzle meet snugly with the respective apertures of the node 400 and that the adhesive application procedure flows smoothly and efficiently. the adhesive can be applied to the inlet aperture 404 of the port 402 . here again, while the channel between inlet aperture 404 and outlet aperture 406 is shown for simplicity as a simple loop, the channel in practice may extend to one or more adhesive bond regions of the node 400 as described above with reference to fig. 4 . in an exemplary embodiment, the adhesive is injected into the inlet aperture 404 with a positive pressure perpendicular to the axial direction 401 of the port 402 . for example, the first outlet of nozzle 516 is disposed on a side wall of the port end 500 a. the pressure from the injection of the adhesive acts radially in the nozzle 500 and port 402 . that is, the injection of the adhesive causes a force applied on the nozzle along a radial direction. the force from the injection is perpendicular to the axial direction 401 of the port 402 . thus, the force neither pulls nor pushes the nozzle 500 in or out of the receptacle port 402 during the adhesive injection process. this configuration is advantageous to form a stable connection between the nozzle 500 and the node 400 . the stability may be further increased in embodiments using a vacuum. as indicated above, the negative pressure from the vacuum together with the orientation of the outlet aperture 406 at the bottom of the port 402 ensures an even tighter fit of the nozzle 500 into the port 402 as the vacuum is drawn. the first channel 517 and the second channel 527 of the nozzle 500 may have various relative orientations and configurations. for example, the first channel 517 and the second channel 527 may extend away from each other at the second end 500 b (referred to herein also as the effector end 500 b ) as shown in fig. 5a . the first channel 517 and the second channel 527 may alternatively be parallel to each other at the second end 500 b. in some embodiments, the first channel 517 and the second channel 527 substantially extend along the axial direction 401 at the port end 500 a, such that the two channels 517 and 527 can be effectively inserted into the port 402 . the nozzle 500 may further include one or more o-rings, or sealants. o-rings or sealants may be used at the nozzle-port interface as well as the nozzle-effector interface. a sealant region may include features such as a groove, dovetail groove, inset or other feature built into a surface of the nozzle. the sealant region may accept a sealant such as an o-ring. referring to fig. 5a , the nozzle 500 may include a first o-ring 535 a disposed between the first outlet of nozzle 516 and the second outlet of nozzle 526 . the second outlet of nozzle 526 is coupled to the outlet aperture 406 of the node 400 to apply the negative pressure. the first o-ring 535 a is used to provide a seal to the vacuum, to prevent unwanted flow of the adhesive, and to isolate the first outlet of nozzle 516 from the second outlet of nozzle 526 . the nozzle 500 may further include a second o-ring 535 b disposed above the first outlet of nozzle 516 at the port end 500 a. the second o-ring 535 b is used to provide an additional seal to the port 402 and further prevent unwanted flow of the adhesive. it will be appreciated that the first and second o-rings 535 a and 535 b in fig. 5a are partially obscured from view in this drawing since they extend out of and into a plane of the drawing, and laterally behind other structures (e.g. first and second channels 517 and 527 ). fig. 5b shows an alternative perspective view of the structure including an illustration of the external contour of the structure according to an embodiment. o-rings 535 a and 535 b are shown encircling portions of the port end 500 b. an external view of nozzle 500 is also shown in fig. 5b , and includes a view of the first and second inlets 514 and 524 . in an embodiment, effector end 500 b is designed to easily and efficiently fit into a corresponding portion of a robot or other structure for supplying fluids and negative pressure to the appropriate channels and for moving the effector as required from one port to another. in addition to the nozzle with two circuits described above, a third circuit can be added in another embodiment to introduce another fluid, for example, a sealant which can be used to encapsulate the injected adhesive. the sealant can be dispensed after the adhesive at the time of removal of the interface nozzle from the interface port. the sealant may be configured to cure or solidify well in advance of the adhesive curing. the nozzle with three circuits may include three channels, one channel for each respective fluid. fig. 6a illustrates a cross-section view of a three-channel nozzle 600 for the single port node 400 . fig. 6b illustrates another cross-section view of the three-channel nozzle 600 from another plane. more specifically, as described further below, fig. 6a is offset relative to fig. 6b about a longitudinal axis 601 such that cross-sections of the nozzle 600 are viewable at two different section planes. referring to fig. 6a and fig. 6b , the nozzle 600 includes a first channel 617 , a second channel 627 and a third channel 637 . the first channel 617 includes a first inlet of nozzle 614 and a first outlet of nozzle 616 . the first outlet of nozzle 616 is configured to be coupled to the inlet aperture 404 of the node 400 ( fig. 4 ). the second channel 627 includes a second inlet of nozzle 624 and a second outlet of nozzle 626 . the second outlet of nozzle 626 is configured to be coupled to the outlet aperture 406 . the first channel 617 and the second channel 627 are isolated from one another. the first channel 617 is configured to inject an adhesive through the first outlet of nozzle 616 into the inlet aperture 404 . the second channel 627 is configured to remove the adhesive from the outlet aperture 406 ( fig. 4 ). in some embodiments, the second inlet of nozzle 624 is configured to be coupled to a negative pressure source to apply vacuum to the outlet aperture 406 . the first inlet of the nozzle 614 can be connected to the first outlet of nozzle 616 through the first channel 617 . the adhesive can be injected from the robot into the first inlet of nozzle 614 and can travel to first outlet of nozzle 616 and then injected into the port. the second inlet of the nozzle 624 can be connected to the second outlet of nozzle 626 through the second channel 627 . the excess adhesive from the port can travel from the second outlet of nozzle 626 to the second inlet of nozzle 624 , and to the robot or other controlling device. in addition to the first channel 617 and the second channel 627 , a third channel 637 can be added to introduce a third fluid, for example, which can be a sealant to encapsulate the injected adhesive. the third channel 637 includes a third inlet of nozzle 634 and a third outlet of nozzle 636 . for example, the third channel 637 is configured to dispense a sealant through the third outlet of nozzle 636 . the third inlet of nozzle 634 can be connected to the third outlet of nozzle 636 through the third channel 637 . the sealant can travel from the third inlet of nozzle 634 to the third outlet of nozzle 636 , and can be injected into an appropriate inlet aperture in the port. the third channel 637 is isolated from the first channel 617 and the second channel 627 . in an embodiment, the third fluid can be dispensed after the adhesive immediately before removal of the interface nozzle from the interface port. the nozzle 600 may be additively manufactured as well. as is evident from the above description, fig. 6a and fig. 6b illustrate two cross-sections of the same nozzle 600 in order to show the positions of the various features relative to each other. fig. 6a illustrates a cross-section including the first channel 617 and the third channel 637 . fig. 6a illustrates another cross-section including the second channel 627 and the third channel 637 . as shown in fig. 6a and fig. 6b , the three channels 617 , 627 , and 637 may be disposed in different cross-sections and offset from each other. for example, the first channel 617 and the second channel 627 may be disposed on a first plane, and the third channel 637 may be disposed offset from the first plane. referring to fig. 6a and fig. 6b , the nozzle 600 includes a first end 600 a and a second end 600 b. as shown in fig. 6a and fig. 6b , the first end 600 a includes the portion of the nozzle 600 below the dotted line 650 and the second end 600 b includes the portion of the nozzle 600 above the dotted line 650 . the first end 600 a is also referred to as a port end, which is configured to be inserted into a port of a node. the second end 600 b is also referred to as an effector end. the effector end 600 b may be connected to an effector, which would be connected to the sealant, adhesive and vacuum apparatuses. since the port end 600 a is configured to be inserted into the port of the node, the port end 600 a may have a size compatible to a size of the port. in some embodiments, the first channel 617 , the second channel 627 and the third channel 637 are extending along an axial direction 601 at the port end 600 a. for example, at the port end 600 a, the first channel 617 , the second channel 627 and the third channel 637 may be parallel to each other along the axial direction 601 . however, at the effector end 600 b, the first channel 617 , the second channel 627 and the third channel 637 may have different orientations. for example, the first channel 617 , the second channel 627 and the third channel 637 may extend away from each other. fig. 7a illustrates the nozzle 600 including a plurality of regions 635 a - f for receiving o-rings/sealants. as shown in fig. 7a , o-rings or sealants can be used at both the nozzle-port interface and the nozzle-robot interface. a sealant region 635 a - f may include features such as a groove, dovetail groove, inset or other feature built into a surface of the nozzle 600 . the sealant regions 635 a - f may accept a sealant such as an o-ring. the sealant regions may be used to separate different circuits, or different channels. the sealant regions may also be used to prevent unwanted flow between different channels. for example, an o-ring in region 635 a may be disposed between the first outlet of nozzle 616 (obscured from view) and the second outlet of nozzle 626 . as another example, the o-rings in regions 635 d and 635 e may be disposed between the first inlet of nozzle 614 , the second inlet of nozzle 624 and the third inlet of nozzle 634 , respectively. referring to figs. 6a-b and 7 a, the nozzle 600 may include a first o-ring disposed in region 635 a between the first outlet of nozzle 616 and the second outlet of nozzle 626 , as noted above. the second outlet of nozzle 626 is coupled to the outlet aperture 406 of the node to apply the negative pressure. the first o-ring in region 635 a may be used to provide a seal to the vacuum and prevent unwanted flow of the adhesive. the nozzle 600 may further include a second o-ring disposed in region 635 b above the first outlet of nozzle 616 at the port end. in an embodiment, the second o-ring 635 b is used to provide additional seal to the port and to further prevent unwanted flow of the adhesive. the nozzle 600 may be additively manufactured. the nozzle 600 may be disposable. this can be advantageous as nozzles can be discarded after the channels in them have been clogged due to extended use. o-rings in remaining regions 635 c - f may be similarly discarded for providing isolation and sealing, and preventing contamination, etc. fig. 7b illustrates a bottom view of a nozzle with a plurality of sealant outlets, according to one embodiment of this disclosure. referring to fig. 7a and fig. 7b , a third channel can be added in the nozzle 600 to dispense a sealant through the third outlet of nozzle 636 . in an exemplary embodiment, the sealant or sealer can be dispensed after the adhesive is injected and at the time before removal of the interface nozzle from the port and the cure of the adhesive. the sealant or sealer may form a cap for the port. the sealant or sealer may alternatively or additionally be used as an isolator to seal the port and prevent direct contact between the node and the component to and from the connection. where, for example, the component and node are composed of dissimilar metals, this isolation may be crucial to preventing galvanic corrosion and therefore to enable reliable, long-lasting node-component connections. fig. 7b further illustrates a bottom view of a nozzle with a plurality of sealant outlets in one embodiment. instead of having one third outlet of nozzle, the nozzle 600 can include a plurality (e.g. six (6)) of third outlets of nozzle 636 . for example, the plurality of third outlets of nozzle 636 may be evenly distributed around the second outlet of the nozzle 626 , which may be a vacuum port. the sealant or sealer may flow out from the plurality of third outlets of nozzle 636 , instead of a single hole. the sealant may be deposited from the plurality of third outlets of nozzle 636 to form a sealant layer. the plurality of third outlets of nozzle 636 may be advantageous to evenly distribute the sealant and form a layer of sealant with a more uniform thickness, in comparison to the single third outlet of nozzle configuration. in general, one or more outlets of nozzles 636 may be suitable depending on the implementation. in still other embodiments (not explicitly shown), the first and second channels may include multiple outlets as well, e.g., to spread adhesive evenly and/or to correspond to multiple inlet and/or outlet apertures in the associated ports, as discussed with reference to an earlier embodiment of the port 400 . fig. 7c illustrates a bottom view of a nozzle with a plurality of sealant outlets in another embodiment. the second outlet of nozzle 626 is disposed at a side at the bottom of the nozzle 600 , and the plurality of third outlets of nozzle 636 are disposed at another side. this configuration may be used in a nozzle with a small cross-sectional bottom area. fig. 8 is a flow diagram of an exemplary method 800 of using a single port node to form a bond with various components. various embodiments of the method 800 of using the single port node are disclosed herein. when in use, a nozzle (also referred as an interface nozzle) can be inserted into the single port of the node. the step of inserting the nozzle into the port of the node 802 can be performed by a robot or other automated machinery for volume production. the step 802 , of inserting a nozzle into a port of a node, can also be performed by a human. for example, an effector of the robot can grab an effector end of the nozzle and insert a port end of the nozzle into the port. the nozzle can include a plurality of channels. an outlet of nozzle of a vacuum channel, which may be a second channel of the nozzle, can be connected to a corresponding outlet aperture disposed inside the port. the step of applying vacuum 804 includes applying vacuum to the outlet aperture disposed inside the port. in some embodiments, a step of applying vacuum 804 is used to draw the nozzle close to the port and lock the nozzle to the port. the negative pressure of vacuum may also help to speed up the process of filling the node with adhesive, e.g., by a robot sensing the presence of an output adhesive flow from the port in the second channel. for example, the step of applying vacuum 804 may include applying vacuum to the outlet aperture along an axial direction of the port. the outlet aperture may be disposed on a bottom of the port. thus, the negative pressure is applied along the axial direction of the port. in some other embodiments, the adhesive is removed without applying vacuum. the step of applying vacuum 804 may be omitted. the method of using the single port node 800 includes a step of injecting the adhesive 806 . an outlet of nozzle of an adhesive injection channel, which is a first channel of the nozzle, can be connected an inlet aperture disposed inside the port. the step of injecting the adhesive 806 includes injecting the adhesive to the inlet aperture disposed inside the port. for example, the inlet aperture may be disposed on a side wall of the port. thus, the positive injection pressure is applied perpendicular to an axial direction of the port. in other words, the positive injection pressure is acting radially. therefore, the positive pressure will not push the nozzle out of the port. in some embodiments, the step of injecting the adhesive 806 includes injecting the adhesive with the positive pressure perpendicular to the axial direction of the port. the method 800 may further include enabling the adhesive to fill at least one region of the node 808 . after the adhesive is injected, the adhesive can travel through a channel inside the node. the channel extends from the inlet aperture inside the port, to one or more one adhesive regions to be filled with the adhesive, and returns to the outlet aperture disposed inside the port. the method 800 can enable the adhesive to fill the one or more adhesive regions in the node to form bonds with various components. in some embodiments, the method 800 may further include removing the adhesive from the outlet aperture through the second channel of the nozzle. the process of removing the adhesive can be performed by applying the vacuum pressure, or can be performed without applying the vacuum. the method 800 may further include dispensing another fluid, for example, a sealant or sealer, to encapsulate the injected adhesive inside the port through a third channel of the nozzle, which may be a sealant channel. for example, when the first traces of adhesive overflow are sensed in the second channel, the robot may be enabled to sense when to stop the adhesive flow in an embodiment. for example, after the injection and removal of the excessive adhesive, the sealant or sealer can be dispensed from one or more sealant outlets of the nozzle. the sealant or sealer may form a cap to encapsulate the injected adhesive. the sealant or sealer may be dispensed before the adhesive is cured. the sealant or sealer may be cured before the adhesive is cured. for example, the sealant or sealer sealant cures quicker than the adhesive. thus, the sealant or sealer may protect the port and the process of curing the adhesive. the sealant or sealer may be dispensed from a plurality of third outlets such that the sealant or sealer may be evenly distributed and form a uniform layer of cap. in some embodiments, the method 800 may further include separating the apertures of the nozzle by one or more o-rings of the nozzle. the nozzle may include one or more o-rings at a nozzle-port interface, and a nozzle-effector interface. the o-rings of the nozzle can separate the different channels, and prevent unwanted flow between channels. the o-rings may also help applying the vacuum. in the case that multiple circuits are actuated to apply the adhesive, vacuum and sealant, the o-rings may also help to prevent a short circuit (e.g., a breach of adhesive from an adhesive inlet channel into a vacuum channel, etc.). advantageously, the method 800 disclosed herein can significantly increase the efficiency of the manufacturing process. the complexity of the adhesive injection system can be reduced because the robot only needs to move to one location to inject the adhesive and sense a complete fill of the adhesive, with or without using negative pressure. since the robots or other automated machines only have to interface with one port, these robots/machines can be made leaner and more compact than those in the conventional assembly system needed for applying adhesive to nodes requiring two (or more) ports. because the assembly system involves a large number of nodes, the method 800 can greatly increase the efficiency and reduce the complexity of the assembly process. in another aspect of this disclosure, a node for enabling connection of various components without an outlet aperture is disclosed. the node may include a port extending inwardly from a surface to form a recess. the node may further include an inlet aperture disposed inside the port. the inlet aperture is configured to receive a fluid injected into at least one bond region to be filled by the fluid. the port is configured to receive a nozzle to enable injection of the fluid. for example, the fluid can be an adhesive configured to bond various components together. in an embodiment, at least one connection of the node may be a part of a vehicle chassis. in another embodiment, at least one connection of the node may be a part of other structures. fig. 9a illustrates a perspective view of an example of a single port node 900 for bonding to various components according to another embodiment of this disclosure. fig. 9b illustrates a top view of the single port node 900 . fig. 9c illustrates another perspective view of the single port node 900 . referring to figs. 9a-9c , the node 900 can include a port 902 , and an inlet aperture 904 . for example, the port 902 may extend inwardly from an external surface 903 to form a recess. the inlet aperture 904 is disposed inside the port 902 and configured to receive a fluid injected into at least one bond region to be filled by the fluid. for example, node 900 may be part of a node/panel interface, and the fluid may be an adhesive configured to bond node 900 to the panel using at least one adhesive bond region. the port 902 is configured to receive a nozzle to enable injection of the fluid. adhesive is used below as an example in this disclosure for the fluid, however, the fluid can be any other fluid as well. the single port 902 may be utilized for the adhesive inlet operations. the port 902 may be similar as the port 402 , as shown in fig. 4 . for example, the port 902 may be in a cylindrical shape and extend in an axial direction in some embodiments. in some other embodiments, the port can be in a conical shape, a cubic shape, or any other shape. in some alternative embodiments, the port may be a protrusion extending upwardly from the external surface 903 with a recess in a central portion of the protrusion that includes the apertures or other structures. the ports may also include protrusions built within recesses in the node, such that the tips of the protrusions may be flush with or proximate in height to the external surface of the node in which the recesses are inset. in other embodiments, the protrusions may be higher or lower than the external surface. in embodiments utilizing protruding ports, the ports may optionally be fabricated with the intent of being broken off upon completion of the bonding process, which may also reduce mass and volume of the corresponding node or other structure that includes the ports. the port may have other configurations as well. the apertures 904 may be disposed inside the port 902 . the adhesive inlet aperture 904 is configured for receiving adhesive injected into the channel 907 and toward the adhesive regions. the aperture 907 may be similar to the aperture 407 , as shown in fig. 4 . for example, the inlet aperture 904 may be disposed on a side wall of the port 902 . thus, the adhesive is injected into the channel 907 by a positive pressure perpendicular to an axial direction 901 of the port 902 . the injection pressure may push the effector or applicator for injecting the adhesive out of the port when the adhesive is injected along the axial direction 901 of the port 902 . in some embodiments, the node 900 may further include a plurality of inlet apertures disposed inside the port 902 . for example, the plurality of inlet apertures may be disposed circumferentially around the port 902 . there are many variations and configurations of the location and arrangement of the inlet aperture 904 . the above examples are for illustration only and are not intended to limit the scope of the disclosure. in some embodiments, the inlet and outlet apertures 904 may have a diameter of 1 mm or greater, although smaller values are possible and may be equally suitable in some embodiments. for example, the inlet 904 may have a diameter between 1 mm and 30 mm in an embodiment. the port 902 may have a cylindrical shape or any other shape. the inlet aperture may have any suitable shape as noted. the port may also include any other shape, such as a cubic shape, a conical shape, or any arbitrary shape. the node 900 may further include at least one channel 907 extending from the adhesive inlet aperture 904 to the at least one adhesive region (not shown). the port 902 is coupled to the channel 907 through the adhesive inlet aperture 904 . in other embodiments, adhesive inlet aperture 904 may comprise more than one aperture and may receive injected adhesive in parallel. the channel 907 may be similar to the channel 407 as shown in fig. 4 . for example, the inlet aperture 904 may in these embodiments comprise a plurality of inlet apertures disposed along a designated circumference of the cylindrical region of the port. these one or more apertures 904 may correspond to one or more channels 907 for delivering adhesive. in still other embodiments, as noted above, each of the one or more apertures and/or channels may include a variety of geometries, as suitable for the application. the channel 907 may be a part of the node 900 and may be additively manufactured using any suitable am technique. the channel 907 may comprise multiple channel portions after it enters and then exits an adhesive bond region. depending on the embodiment and whether adhesive is injected serially or in parallel, the node may be considered to have one or more channels as described above. in general, the design of the channels may enable sequential flow of the adhesive into specific adhesive bond regions between an inner surface of the node and an outer surface of a component whose edge has been inserted into a recess of the node. a plurality of nozzles, or interface nozzles, may be utilized with the node 900 having a single port for adhesive as described above. for example, the nozzle may include a first channel comprising a first inlet of nozzle and a first outlet of nozzle. the first outlet of nozzle may be configured to be coupled to the inlet aperture 904 disposed inside the port 902 of the node 900 . similar to the nozzle 500 , as shown in figs. 5a and 5b , the nozzle for the single port 902 may include a first end and a second end. the first end may also referred to as a port end, which is configured to be inserted into the port 902 . the port end of the nozzle may have a size compatible with a diameter of the port 902 . the second end may be also referred to as an effector end, which is configured to be coupled to an effector. in an exemplary embodiment, the adhesive is injected into the inlet aperture 904 with a positive pressure perpendicular to the axial direction 901 of the port 902 . for example, the first outlet of nozzle is disposed on a side wall of the port end. the pressure from the injection of the adhesive acts radially in the nozzle and port 902 . that is, the injection of the adhesive causes a force applied on the nozzle along a radial direction. the force from the injection is perpendicular to the axial direction 901 of the port 902 . thus, the force neither pulls nor pushes the nozzle in or out of the receptacle port 902 during the adhesive injection process. this configuration is advantageous to form a stable connection between the nozzle and the node 900 , as discussed above. fig. 10 illustrates a side view of an example of an end effector 1000 for interfacing with a nozzle (e.g., the nozzle 600 in figs. 6a-6b , the nozzle 500 in figs. 5a-5b ) according to one embodiment of this disclosure. fig. 11a illustrates a top view of the end effector 1000 in a first position 1000 a. fig. 11b illustrates another top view of the end effector 1000 in a second position 1000 b. fig. 12 illustrates a perspective view of the end effector 1000 . in an aspect of the disclosure, the end effector 1000 for interfacing with a nozzle (e.g., 500 , 600 ) is disclosed. the end effector 1000 may comprise a first end 1000 e, which includes a receptacle 1099 ( figs. 11a-b , 12 ). the receptacle 1099 in this embodiment is a downward protrusion having a generally circular opening at the first end 1000 e and cylindrically-shaped side walls that are configured to receive the nozzle 600 and sized to the body of the nozzle 600 at the effector end. the side walls may include inlets and outlets for enabling fluids or negative pressure to flow between the end effector 100 and nozzle 600 . a variety of receptacle shapes are possible, including shapes for accommodating non-cylindrical nozzles. the nozzle 600 may include one or more nozzle retention features (e.g., 688 a ) and a first nozzle inlet (e.g. 614 ). the nozzle 600 is used as only an example of nozzles for illustration in figs. 10-12 in this disclosure. however, the end effector 1000 can be used to interface with a variety of nozzles, not being limited to the nozzle 600 . referring to figs. 10-12 , the end effector 1000 may comprise one or more retention features (e.g., 1088 a, 1088 b ) positioned along a perimeter of the receptacle 1099 , where each of the one or more retention features (e.g., 1088 a, 1088 b ) is movable between a first position 1000 a and a second position 1000 b. each of the one or more retention features (e.g., 1088 a, 1088 b ) is configured to lock the nozzle 600 by securing onto a corresponding one of the one or more nozzle retention features (e.g., 688 a ) in the first position, and to release the nozzle 600 in the second position 1000 b. the end effector 1000 may further comprise one or more actuators, for example, 1068 a and 1068 b, configured to actuate the one or more retention features (e.g., 1088 a, 1088 b ) between the first position 1000 a and the second position 1000 b. the end effector 1000 comprises a first channel 1019 ( fig. 12 ), which includes a first inlet 1012 and a first outlet 1013 . the first outlet 1013 is positioned inside the receptacle 1099 and is configured to be coupled to the first nozzle inlet 614 in the first position 1000 a. as shown in fig. 10 , the end effector 1000 is configured to connect to the nozzle 600 , for example, a multi-channel adhesive nozzle. the end effector 1000 is the component that may connect to an effector end 600 a of the nozzle 600 . the end effector 1000 may include feed ports that may be coupled to the inlet ports of the nozzle 600 . for example, the end effector 1000 may include a first inlet port 1012 connected to a first outlet 1013 , and further coupled to a first inlet port 614 (e.g., adhesive port) of the nozzle 600 . the end effector 1000 may include a second inlet port 1022 connected to a second outlet 1023 , and further coupled to a second inlet port 624 (e.g., vacuum port) of the nozzle 600 . the end effector 1000 may include a third inlet port 1032 connected to a third outlet 1033 , and further coupled to a third inlet port 634 (e.g., sealant port) of the nozzle 600 . the inlet ports and outlet ports may have other configurations, depending on the requirements. the end effector 1000 thus has the capability to inject or apply a variety of fluids at the same time. as shown in figs. 11a-b , the end effector 1000 may include a receptacle 1099 to receive the nozzle 600 . the end effector 1000 may include one or more retention features 1088 a and 1088 b, to retain the nozzle 600 to the end effector 1000 during the injection process. one or more corresponding retention features 688 a may be present on the nozzle 600 . for example, the one or more retention features 1088 a, 1088 b in the end effector 1000 may include cleats, or tangs, or protrusions, or tabs, or projections that can lock into the one or more corresponding retention feature 688 a on the nozzle 600 in a first position 1000 a ( fig. 11a ) and can thus lock the end effector 1000 to the nozzle 600 such that the fluid or vacuum application operations described herein can be initiated. once these operations are completed, end effector 1000 can be released from the nozzle 600 by moving retention features 1088 a, 1088 b into a second position 1000 b ( fig. 11b ) as described in further detail below. in some aspects, one or more actuators 1068 a, 1068 b may be utilized to lock and release the nozzle 600 by actuating the one or more retention features 1088 a and 1088 b. for example, the one or more actuator 1068 a, 1068 b may be hydraulically actuated, pneumatically actuated, electrically actuated, and the like. in an embodiment, the one or more actuators comprises one or more pneumatic cylinders, as shown in figs. 11a-b . fig. 11a illustrates the end effector 1000 in a first position 1000 a, when the one or more pneumatic cylinders 1068 a, 1068 b are actuating the cleats 1088 a, 1088 b to an extended (locking the nozzle) position. as shown in fig. 11a , the one or more retention features 1088 a, 1088 b may be positioned along a perimeter of the receptacle 1099 . for example, the one or more retention features 1088 a, 1088 b in the end effector 1000 may include cleats, or tangs, or protrusions, or tabs, or projections, etc. each of the one or more retention features 1088 a, 1088 b may be movable between the first position 1000 a which is a locked position, and a second position 1000 b which is a retracted position. each of the one or more retention features 1088 a, 1088 b may be configured to lock the nozzle 600 by securing onto a corresponding one of the one or more nozzles 600 in the first position 1000 a. the end effector 1000 can then be released from the nozzle 600 when operations are complete. for example, the one or more retention features 688 a may be locked in the first position 1000 a by their respective actuators 1068 a, 1068 b when fluid application and related procedures are ongoing. upon completion of the process, end effector 1000 may then be released into a retracted position by releasing the features 1088 a, 1088 b from nozzle 600 as describe below. various embodiments may be used in fig. 11a for locking the end effector 1000 in place. in one example, the features 1088 a, 1088 b may be configured as cleats having curved edges and being movable along the x direction as shown in figs. 11a-11b . when the cleats 1088 a, 1088 b move along the x-direction, the curved edges of the cleats 1088 a, 1088 b may be placed to secure onto, or lock into, the one or more corresponding retention feature 688 a, for example, a corresponding groove or one or more recesses on the nozzle 600 . in another example, the one or more retention features 1088 a, 1088 b on the end effector 1000 may instead be configured to be movable along the y direction, and may be placed to secure onto, or lock into the one or more corresponding retention feature on the nozzle when the retention features are moved along the y direction. in another example, the one or more retention features 1088 a, 1088 b may be tabs, or tongs that are movably attached to the receptacle and that can be moved into the one or more corresponding retention features 688 a, 688 b of the nozzle 600 to lock the end effector in place. in another example, the one or more retention features can be movable in any directions and can move anywhere on the x-y plane. fig. 11b illustrates the end effector 1000 in a second position 1000 b, when the one or more pneumatic cylinders 1068 a, 1068 b are actuating the cleats 1088 a, 1088 b to a retracted position. as shown in fig. 11b , the one or more retention features 1088 a, 1088 b may be moved away from the one or more corresponding retention features 688 a on the nozzle 600 to release the nozzle 600 from the end effector 1000 . in some other embodiments, the one or more retention features of the end effector may be grooves or one or more recesses, and the one or more corresponding retention features on the nozzle may be cleats, or tangs, or protrusions, or tabs, or projections, etc. in some embodiments as described above, one or more actuators 1068 a, 1068 b can be configured to actuate the one or more retention features 1088 a, 1088 b between the first position 1000 a, and the second position 1000 b. the one or more actuators 1068 a, 1068 b may comprise hydraulic actuators, pneumatic actuators, electronic actuators, or other types of actuators. in an alternative embodiment, the one or more retention features 1088 a, 1088 b may be actuated manually. as shown in fig. 12 , the end effector 1000 may include the receptacle 1099 to accommodate the nozzle 600 . the nozzle 600 may have an effector end, and the receptacle 1099 may have a size compatible with a size of the effector end of the nozzle 600 to enable the effector end to fit into the receptacle 1099 . the end effector 1000 may comprise a first channel 1019 , which includes a first inlet 1012 and a first outlet 1013 . the end effector 1000 may further comprise a second channel 1029 , which includes a second inlet 1022 and a second outlet 1023 . the end effector 1000 may further comprise a third channel 1039 , which includes a third inlet 1032 and a third outlet 1033 . the first outlet 1013 , the second outlet 1023 , the third outlet 1033 may be positioned inside the receptacle 1099 and are configured to be coupled to the first nozzle inlet 614 , the second nozzle inlet 624 , the third nozzle inlet 634 respectively, in the first position 1000 a. the end effector 1000 may further comprise an exterior surface, where the first inlet 1012 , the second inlet 1022 , the third inlet 1032 may be positioned on the exterior surface of the end effector 1000 . once the nozzle 600 is locked into place, the first channel 1019 , the second channel 1029 and the third channel 1039 can line up with the respective first inlet 614 , second inlet 624 , and third inlet 634 on the nozzle 600 . the nozzle 600 may further include o-rings to ensure that the volume between the outlets (e.g., 1013 , 1023 , 1033 ) of the channels (e.g., 1019 , 1029 , 1039 ) in the end effector 1000 and the corresponding nozzle inlets (e.g., 614 , 624 , 634 ) on the nozzle 600 are isolated from other inlet and outlet pairs. for example, when an adhesive inlet, a vacuum inlet and a sealant inlet are utilized, the end effector 1000 may have three inlet and outlet pairs. the adhesive inlet 1012 , the vacuum inlet 1022 and the sealant inlet 1032 may be disposed on an exterior surface of the end effector 1000 . the adhesive inlet 1012 , the vacuum inlet 1022 and the sealant inlet 1032 may be connected to the corresponding outlets 1013 , 1023 , and 1033 through isolated channels 1019 , 1029 , and 1039 , as shown in fig. 12 . for example, the first channel 1019 may be configured to enable injection of a first fluid (e.g., adhesive). for example, the second channel 1029 may be configured to facilitate removing the first fluid (e.g., adhesive) from the nozzle 600 . for another example, the second inlet 1022 of the second channel 1029 may be configured to be coupled to a negative pressure source to apply vacuum to the second nozzle inlet 624 . for another example, the second channel 1029 may also be used for a positive pressure to expel a fluid drawn into a vacuum aperture (e.g., 624 ) during a vacuum operation. for example, the third channel 1039 may be configured to dispense a second fluid through the third outlet 1033 to the third nozzle inlet 634 . the third channel 1039 may be configured to dispense a sealant through the third outlet 1033 to the third nozzle inlet 634 in some embodiments. for example, fluids may be configured to be injected from the inlets 1012 , 1022 , and 1032 , to enter the channels 1019 , 1029 , and 1039 , to exit through the outlets 1013 , 1023 and 1033 radially, which is perpendicular to an axial direction 1001 of the end effector 1000 . the fluids exiting the channels (e.g., 1019 , 1029 , 1039 ) may be configured to enter the nozzle inlets (e.g., 614 , 624 , 634 ) of the nozzle 600 radially, which is perpendicular to an axial direction of the nozzle 600 . for example, the receptacle 1099 may include a side wall, and where the first outlet 1013 may be disposed on the side wall to enable a first fluid to be injected into the first nozzle inlet 614 with a positive pressure perpendicular to an axial direction of the nozzle 600 . this can ensure that the pressure from the injection of the fluids, for example, the adhesive/sealant injection, acts radially or perpendicular to an axial direction of the nozzle 600 , thereby preventing displacement of the nozzle 600 during the fluid injection process. for example, the outlets (e.g., 1013 , 1023 , 1033 ) may be disposed to enable another fluid to be injected into the corresponding nozzle inlets (e.g., 614 , 624 , 634 ) radially. the sizes and profiles of inlets (e.g., 1012 , 1022 , 1032 ), the outlet (e.g., 1013 , 1023 , 1033 ) and the channels (e.g., 1019 , 1029 , 1039 ) can be a function of the viscosities of the fluids being transported through the end effector 1000 . more viscous fluids may require greater diameters of the channels (e.g., 1019 , 1029 , 1039 ), the inlets (e.g., 1012 , 1022 , 1032 ), and the outlets (e.g., 1013 , 1023 , 1033 ). for example, the channels can have a cross section in a circular shape, an elliptical shape, a rectangular shape, or any other shape. for example, a diameter of the third channel 1039 can be larger than a diameter of the first channel 1019 . for example, the diameter of the inlet 1032 for the sealant may be larger than the inlet 1012 for the adhesive, in one embodiment. the nozzle 600 may further include o-rings to isolate different channels (e.g., 1019 , 1029 , 1039 ). the fluids can be transferred through the isolated channels (e.g., 1019 , 1029 , 1039 ) provided in the end effector 1000 . this can ensure multiple fluids to be transferred simultaneously without mixing. the end effector 1000 may further comprise a second end. in some aspects, the second end is configured to be coupled to a robot and the end effector may be manipulated by a robot. the robot may provide the actuators for manipulating the movements of the end effector 1000 , for providing the necessary pneumatic pressure for actuating the locking and unlocking mechanisms of the end effector 1000 to the nozzle, as well as tubes or channels coupled to the necessary fluid storage and vacuum pump equipment for coupling to the necessary inlets and outlets that lead to the nozzle 600 ,via the receptacle connections, and ultimately to the node via the port in which the nozzle 600 is inserted. in some other aspects, the second end of the end effector may be grabbed by a person, and the end effector may be manipulated by a person. in various embodiments, the one or more actuators 1068 a, 1068 b may be co-printed with the one or more retention features 1088 a, 1088 b, and may be further co-printed with the receptacle 1099 of the end effector 1000 in the am process. for example, the entire end effector 1000 is an additively manufactured end effector. the receptacle 1099 , the inlets (e.g., 1012 , 1022 , 1032 ), the outlets (e.g., 1013 , 1023 , 103 ), the channels (e.g., 1019 , 1029 , 1039 ), the one or more retention features (e.g., 1088 a, 1088 b ), the one or more actuators (e.g., 1068 a, 1068 b ), of the end effector 100 are co-printed and produced by the am process. fig. 13 is a flow diagram of an example method 1300 of using an end effector to interface with a nozzle. the method 1300 comprises receiving the nozzle in a receptacle of the end effector, as illustrated at 1302 . the method comprises actuating one or more retention features of the end effector to a first position to secure onto a corresponding one of one or more nozzle retention features to lock the nozzle, as illustrated at 1304 . as illustrated at 1306 , the method 1300 may comprise applying vacuum to a second inlet of the end effector, where a second outlet of the end effector is coupled to a second nozzle inlet. as illustrated at 1308 , the method 1300 comprises injecting a first fluid to a first inlet of the end effector, where a first outlet of the end effector is coupled to a first nozzle inlet. for example, injecting an adhesive may comprise injecting the adhesive into the first nozzle inlet with a positive pressure perpendicular to an axial direction of the nozzle. for another example, injecting an adhesive may comprise injecting the adhesive into the first nozzle inlet radially. for another example, the method 1300 may further comprise removing the adhesive from the second outlet. for another example, the method 1300 may further comprise dispensing another fluid to a third inlet of the end effector, wherein a third outlet of the end effector is coupled to a third nozzle inlet. for example, dispensing another fluid may comprise dispensing a sealant. in other embodiments, the fluid may alternatively or additionally be a different type other than an adhesive or sealant, such as a lubricant. for example, dispensing another fluid may comprise dispensing the another fluid into the third inlet of nozzle with a positive pressure perpendicular to an axial direction of the nozzle. for example, dispensing another fluid may comprise dispensing the another fluid into the third inlet of nozzle radially. for another example, the method 1300 may further comprise coupling the end effector to a robot. for example, the method 1300 may be performed by a robot. for example, the method 1300 may be performed by a person. for another example, the method 1300 may further comprise, after the nozzle is installed in the end effector, performing additional fluid applications and vacuum operations by using the same nozzle. for another example, the method 1300 may further comprise, applying a positive pressure to a second inlet of the end effector, where a second outlet of the end effector is coupled to a second nozzle inlet. for example, a second channel, a vacuum channel, may also be used for a positive pressure to expel a fluid drawn into a vacuum aperture during a vacuum operation. the previous description is provided to enable any person skilled in the art to practice the various aspects described herein. various modifications to these exemplary embodiments presented throughout this disclosure will be readily apparent to those skilled in the art, and the concepts disclosed herein may be applied to other techniques for printing nodes and interconnects. thus, the claims are not intended to be limited to the exemplary embodiments presented throughout the disclosure, but are to be accorded the full scope consistent with the language claims. as used herein in the specification and claims, including as used in the examples and unless otherwise expressly specified, all numbers may be read as if prefaced by the word “about” or “approximately,” even if the term does not expressly appear. the phrase “about” or “approximately” may be used when describing magnitude and/or position to indicate that the value and/or position described is within a reasonable expected range of values and/or positions. for example, a numeric value may have a value that is +/−0.1% of the stated value (or range of values), +/−1% of the stated value (or range of values), +/−2% of the stated value (or range of values), +/−5% of the stated value (or range of values), +/−10% of the stated value (or range of values), etc. any numerical range recited herein is intended to include all sub-ranges subsumed therein. all structural and functional equivalents to the elements of the exemplary embodiments described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are intended to be encompassed by the claims. moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims. no claim element is to be construed under the provisions of 35 u.s.c. §112(f), or analogous law in applicable jurisdictions, unless the element is expressly recited using the phrase “means for” or, in the case of a method claim, the element is recited using the phrase “step for.”
174-364-197-708-069	US	[ "US" ]	G03C5/00,G03F1/00	2006-08-31T00:00:00	2006	[ "G03" ]	method of repairing a photolithographic mask	a method is described for repairing a defect detected in a photolithographic mask. a phase voxel cavity is formed in the photolithographic mask to compensate for the defect in the photolithographic mask. the phase voxel cavity and features of the mask both create a phase shift of approximately π.	1 . a method of repairing a defect detected in photolithographic mask, comprising: forming a phase voxel cavity in the photolithographic mask to compensate for the defect in the photolithographic mask. 2 . the method of claim 1 , wherein the phase voxel cavity is approximately 172 nm deep. 3 . the method of claim 1 , wherein the photolithographic mask is a phase mask with a mesa pattern creating a π phase change, the mesa pattern having a defect, and the phase voxel cavity having a depth creating an additional π phase change. 4 . the method of claim 1 , wherein the photolithographic mask has two structures with an end-to-end critical dimension that is too large, the phase voxel cavity being formed between the two structures. 5 . the method of claim 1 , wherein the photolithographic mask has a transparent substrate and a nontransparent layer formed on the transparent substrate, the defect being the absence of a portion of the nontransparent layer to leave an area of the transparent substrate exposed, the phase voxel cavity being formed in the area. 6 . a method of forming an electronics component, comprising: manufacturing a photolithographic mask having a transparent substrate and mask features carried by the transparent substrate, the mask features having a defect; detecting the defect; forming a phase voxel cavity in the photolithographic mask; and directing light through the mask onto the substrate, the mask features causing substrate features on the substrate and the phase voxel cavity compensating for a defect in at least one of the substrate features should the phase voxel cavity be absent. 7 . the method of claim 6 , further comprising; constructing a model including the defects; building an impacted image reference by optical simulation of a photolithographic mask having the defect and calibrating with an impacted image; and forming a phase voxel cavity into the model to compensate for the defect. 8 . the method of claim 6 , wherein the light has a wavelength of approximately 193 nm. 9 . the method of claim 8 , wherein the phase voxel cavity is approximately 172 nm deep. 10 . the method of claim 6 , wherein the photolithographic mask is a phase mask with a mesa pattern creating a π phase change, the mesa pattern having a defect, and the phase voxel cavity having a depth creating an additional π phase change. 11 . the method of claim 6 , wherein the photolithographic mask has two structures with an end-to-end critical dimension that is too large, the phase voxel cavity being formed between the two structures, to correct the critical dimension error. 12 . the method of claim 6 , wherein the photolithographic mask has a transparent substrate and a nontransparent layer formed on the transparent substrate, the defect being the absence of a portion of the nontransparent layer to leave an area of the transparent substrate exposed, the phase voxel cavity being formed in the area, to correct the defective and exposed transparent substrate error. 13 . a photolithographic mask comprising: a transparent substrate; features carried by the transparent substrate such that a pattern-generating phase shift occurs between light of a pre-selected wavelength propagating through the transparent substrate where the features are compared to where the features are absent, the pattern-generating phase shift being approximately π; and a phase voxel cavity formed in the transparent substrate to create a correcting phase shift of 2π between light propagating through the features and light propagating through the phase voxel cavity. 14 . the photolithographic mask of claim 13 , wherein the photolithographic mask is a phase mask with a mesa pattern creating a π phase change, the mesa pattern having a defect, and the phase voxel cavity having a depth creating an additional π phase change. 15 . the photolithographic mask of claim 13 , wherein the photolithographic mask has two structures with an end-to-end critical dimension that is too large, the phase voxel cavity being formed between the two structures, to correct the critical dimension error. 16 . the photolithographic mask of claim 13 , wherein the photolithographic mask has a transparent substrate and a nontransparent layer formed on the transparent substrate, the defect being the absence of a portion of the nontransparent layer to leave an area of the transparent substrate exposed, the phase voxel cavity being formed in the area, to correct the defective and exposed transparent substrate error.	background of the invention 1). field of the invention embodiments of this invention relate to a method of repairing a defect in a photolithographic mask, a method of forming an electronic substrate and to a photolithographic mask. 2). discussion of related art microelectronic circuits are usually formed in and on silicon or other semiconductor wafers. such a circuit has many layers formed on top of one another in a z-direction. each layer also has features in an x-y plane. a metal line may, for example, extend in an x-direction followed by a y-direction and then again in an x-direction. photolithographic techniques are utilized to form such features. a photoresist material is deposited on a substrate, and is then exposed to light having a pre-selected wavelength. a mask is located between a light source and the photoresist material and the mask carries a pattern with certain areas either attenuating or allowing full transmission of the light. optics focus and reduce the size of an image from the mask and the pattern of the mask is transmitted or reflected on the photoresist material. selective exposure of the photoresist material causes selective changing in the composition of the photoresist material. a selective etchant has been used to remove portions of the photoresist material. the pattern created in the photoresist material can then be used for further processing. metal lines may, for example, be formed within removed areas of the photoresist material. a defect is sometimes formed during the fabrication of a mask. such a defect will result in a corresponding defect in a circuit that is formed in and on the substrate. the same mask is typically used for printing many of the same circuit. each circuit will have the same defect. mask repair is usually accomplished by replacing a portion of the mask that is inadvertently removed with the same type of material. rebuilding of a defective portion of a mask is expensive, intricate and inherently inaccurate. brief description of the drawings embodiments of the invention are described by way of examples with reference to the accompanying drawings, wherein: fig. 1 is a side view representing an apparatus for photolithographically defining features on photoresist material for purposes of forming an electronics component; fig. 2 is a perspective view illustrating a photolithographic mask that can be used in the apparatus of fig. 1 ; fig. 3 is a perspective view of a photolithographic mask that is similar to the photolithographic mask of fig. 2 , but has a defect due to mesa lifting; fig. 4 is a view similar to fig. 3 wherein the defect is compensated for by forming a phase voxel cavity; fig. 5 is a top-down view illustrating at different defocus lengths the critical dimension of a line that is formed utilizing the photolithographic mask of fig. 2 ; fig. 6 is a view similar to fig. 5 wherein the photolithographic mask of fig. 3 is used; fig. 7 is a view similar to fig. 6 wherein the photolithographic mask of fig. 4 is used; fig. 8 is a graph wherein the critical dimensions of figs. 5 , 6 , and 7 are plotted for a required critical dimension of 80 nm and at different defocus lengths; fig. 9 is a flowchart of how an electronics component is fabricated; fig. 10 is a perspective view of a photolithographic mask that can alternatively be used in the apparatus of fig. 1 , wherein the mask has an end-to-end structure; fig. 11 is a perspective view of a photolithographic mask that is similar to the photolithographic mask of fig. 10 , except that a critical width between two structures of the end-to-end structure is too large and the mask is therefore defective; fig. 12 is a view similar to fig. 11 wherein the defect is compensated for by forming a phase voxel cavity; fig. 13 is a graph wherein the critical dimensions at various defocus lengths are plotted when using the photolithographic masks of figs. 10 , 11 , and 12 respectively; fig. 14 is a bottom view of a photolithographic mask that can be used as a further alternative in the apparatus of fig. 1 , the mask being of an alternating phase shift type with a chromium layer to attenuate light; fig. 15 is a bottom view of a photolithographic mask and is similar to the mask of fig. 14 except that a portion of the chromium layer is inadvertently removed to leave an area of an underlying transparent substrate exposed; and fig. 16 is a figure similar to fig. 15 , wherein the area is compensated for by forming two phase voxel cavities within the area. detailed description of the invention fig. 1 of the accompanying drawings illustrates apparatus 20 that is used for photolithographically defining features on photoresist material 22 deposited on an electronics substrate 24 the apparatus 20 includes a light source 26 , a photolithographic mask 28 , and an optical system of lenses 30 . the light source 26 emanates light having a wavelength of approximately 193 nm. the photolithographic mask 28 is placed in a path of the light from the light source 26 so that the light propagates through the photolithographic mask 28 in a z-direction. the lenses 30 are placed in a path of the light after it passes through the photolithographic mask 28 . the light radiates onto the photoresist material 22 after passing through the lenses 30 . the photolithographic mask 28 is made of a transparent material and carries a two-dimensional pattern of features in x-and-y directions. the features of the photolithographic mask 28 may attenuate the light or may change its phase to thereby reduce the brightness of the light either partially or entirely, depending on the type of mask that is used. the features of the photolithographic mask 28 result in features being created by the light radiating on the photoresist material 22 . the pattern of the features of the photolithographic mask 28 may or may not be exactly replicated on the photoresist material 22 , but the lenses 30 generally create a reduction in the overall size of the pattern, so that the pattern created on the photoresist material 22 has a cross-dimension that is approximately one-quarter of the pattern on the photolithographic mask 28 . fig. 2 illustrates one type of photolithographic mask 28 a that may be used in the system of fig. 1 . the photolithographic mask 28 a includes a transparent glass substrate 32 with a mesa pattern 34 on a lower surface of the transparent glass substrate 32 . the mesa pattern 34 is formed on select areas only of the lower surface of the transparent glass substrate 32 . light passing through areas of the photolithographic mask 28 a where the mesa pattern 34 is located leaves the mesa pattern 34 with a reference phase of 0 degrees. light leaving the photolithographic mask 28 a where the mesa pattern 34 is absent has a phase that is out-of-phase with respect to light leaving the mesa pattern 34 by π. the thickness of the mesa pattern is given by the following formula: z is the thickness of the mesa pattern; n is the refractive index of glass, namely 1.56; λ is the wavelength of the light, in this case 193 nm; the thickness of the mesa pattern 34 is thus 172 nm. fig. 3 illustrates a photolithographic mask 28 b that is the same as the photolithographic mask 28 a of fig. 2 in the sense that it includes a transparent substrate 36 and a mesa pattern 38 similar to the transparent glass substrate 32 and mesa pattern 34 of the photolithographic mask 28 a of fig. 2 . the mesa pattern 38 , however, includes a defect 40 where the mesa pattern 38 is absent. light leaving the photolithographic mask 28 b where the defect 40 is located has a phase of π and should have a phase of 0 degrees. referring again to fig. 1 , the defect 40 in fig. 3 will cause a corresponding defect in the pattern created in the photoresist material 22 . fig. 4 illustrates how the defect is compensated for. a phase voxel cavity 42 is etched into the transparent substrate 36 in an area of the defect 40 . the phase voxel cavity 42 is etched to a depth of 170 nm. a relatively precise etching depth can be obtained because the etching rate would be known and the required depth of 170 nm is the etching rate multiplied by time. light leaving the transparent glass substrate 36 in the area of the phase voxel cavity 42 will have a phase of 0 degrees. the light thus has the same phase as if the mesa pattern 38 did not have the defect 40 , because they are out-of-phase by 2π, as is the case with the mesa pattern 34 in fig. 2 . a degree of computer simulation may be required to determine the required width for the phase voxel cavity 42 because the phase voxel cavity 42 may not have a footprint that matches the footprint of the defect 40 exactly. in the present example, the defect 40 is 183 nm wide and 200 nm long and the phase voxel cavity 42 is 344 nm wide and 200 nm long. fig. 5 illustrates a critical dimension of a pattern that is formed on a photoresist material using the photolithographic mask 28 a of fig. 2 . fig. 6 illustrates a pattern that is created using the photolithographic mask 28 b of fig. 3 , and fig. 7 illustrates a pattern that is created using the photolithographic mask 28 b of fig. 4 . the defect in the pattern can be seen when comparing fig. 6 with fig. 5 . partial reparation of the pattern is created with the phase voxel cavity 42 in fig. 4 , as is shown in fig. 7 . fig. 8 illustrates the actual dimension for a critical dimension of 80 nm at different defocus distances and including figs. 5 , 6 , and 7 . fig. 9 illustrates a method of forming an electronics component, including the electronics substrate 24 of fig. 1 . at block 50 a photo mask defect inspection is carried out. defect inspection is typically accomplished by scanning the mask. block 52 is for mask defect identification (including dimension and topography) and lithography impact deposition. defects are typically identified by comparing adjacent areas of the mask for inconsistencies. next, at block 54 , a local three-dimensional mask substrate model is constructed on a computer. the model has pattern geometry including the identified defect dimension and topography. at block 56 an impacted image reference is built. the impacted reference image is built by optical simulation of the defective mask pattern and is calibrated with the actual impacted image. at block 58 an optical model is created based on optimization of the three-dimensional geometry and placement of a phase voxel cavity. the optical model is created for purposes of determining a mask repair design rule. at block 60 a high-resolution, high-accuracy quartz etching of a phase voxel cavity is carried out according to the three-dimensional model-based repair design rule. at block 62 a mask lithographic imaging impact deposition is carried out. the process of steps 54 , 56 , 58 , 60 , and 62 are carried out until the deposition specification is passed. at block 64 , the mask is shipped for silicon wafer printing. in one embodiment, a method of repairing a defect detected in the photolithographic mask is described, including forming a phase voxel cavity in the photolithographic mask to compensate for the defect in the photolithographic mask. the phase voxel cavity may be approximately 172 nm deep, although it will be appreciated that the phase voxel cavity may have any depth, provided that the depth is selected to create the necessary cancellation of light having a predetermined and select wavelength. in the embodiment described above, the photolithographic mask is a phase mask with a mesa pattern creating a π phase change, the mesa pattern having a defect, and the phase voxel cavity having a depth creating an additional π phase change. in one embodiment, a method of forming an electronics component is described, including (i) manufacturing a photolithographic mask having a transparent substrate and mask features carried by the transparent substrate, the mask features having a defect, (ii) detecting the defect, (iii) forming a phase voxel cavity in the photolithographic mask, and (iv) directing light through the mask onto the substrate, the mask features causing substrate features on the substrate and the phase voxel cavity compensating for a defect in at least one of the substrate features should the phase voxel cavity be absent. with specific reference to fig. 9 , the method may include (i) constructing a model including the defects, (ii) building an impacted image reference by optical simulation of a photolithographic mask having the defect and calibrating with an impacted image, and (iii) forming a phase voxel cavity into the model to compensate for the defect. the light has a wavelength of approximately 193 nm, in which case the phase voxel cavity is approximately 172 nm deep. other wavelengths of light and phase voxel cavities may apply in other embodiments. a photolithographic mask is also described. the photolithographic mask includes a transparent substrate, features carried by the transparent substrate such that a pattern-generating phase shift occurs between light of a pre-selected wavelength propagating through the transparent substrate where the features are compared to where the features are absent, the pattern-generating phase shift being approximately π; and a phase voxel cavity formed in the transparent substrate to create a correcting phase shift of 2π between light propagating through the features and light propagating through the phase voxel cavity. the photolithographic mask in the embodiment described above is a phase mask with a mesa pattern creating a π phase change, the mesa pattern having a defect, and the phase voxel cavity having a depth creating an additional π phase change. the masks 28 a can be used for photolithography or optical lithography. photolithography or optical lithography is a process used in semiconductor device fabrication to transfer a pattern from a photomask (also called reticle) to the surface of a substrate. often crystalline silicon in the form of a wafer is used as a choice of substrate, although there are several other options including, but not limited to, glass, sapphire, and metal. photolithography (also referred to as “microlithography” or “nanolithography”) bears a similarity to the conventional lithography used in printing and shares some of the fundamental principles of photographic processes. photolithography involves a combination of: (i) substrate preparation, (ii) photoresist application, (iii) soft-baking, (iv) exposure, (v) developing, (vi) hard-baking, and (vii) etching, and various other chemical treatments (thinning agents, edge-bead removal, etc.) in repeated steps on an initially flat substrate. a part of a typical silicon lithography procedure would begin by depositing a layer of conductive metal several nanometers thick on the substrate. a layer of photoresist—a chemical that hardens when exposed to light (often ultraviolet)—is applied on top of the metal layer. the photoresist is selectively “hardened” by illuminating it in specific places. for this purpose a transparent plate with patterns printed on it, called a photomask or shadowmask, is used together with an illumination source to shine light on specific parts of the photoresist. some photoresists work well under broadband ultraviolet light, whereas others are designed to be sensitive at specific frequencies to ultraviolet light. it is also possible to use other types of resist that are sensitive to x-rays and others that are sensitive to electron-beam exposure. a spinner is used to apply photoresist to the surface of a silicon wafer. generally most types of photoresist will be available as either “positive” or “negative.” with positive resists, the area that you can see (masked) on the photomask is the area that you will see upon developing of the photoresist. with negative resists it is the inverse, so any area that is exposed will remain, whilst any areas that are not exposed will be developed. after developing, the resist is usually hard-baked before being subjected to a chemical etching stage which will remove the metal underneath. finally, the hardened photoresist is etched using a different chemical treatment, and all that remains is a layer of metal in the same shape as the mask (or the inverse if negative resist has been used). lithography is used because it affords exact control over the shape and size of the objects it creates, and because it can create patterns over an entire surface simultaneously. its main disadvantages are that it requires a substrate to start with, it is not very effective at creating shapes that are not flat, and it can require extremely clean operating conditions. in a complex integrated circuit (for example, cmos), a wafer will go through the photolithographic area up to 50 times. for thin-film-transistor (tft) processing, many fewer photolithographical processes are usually required. a wafer is introduced onto an automated “wafertrack” system. this track consists of handling robots, bake/cool plates, and coat/develop units. the robots are used to transfer wafers from one module to another. the wafer is initially heated to a temperature sufficient to drive off any moisture that may be present on the wafer surface. hexa-methyl-disilizane (hmds) is applied in either liquid or vapor form in order to promote better adhesion of the photosensitive polymeric material, called photoresist. photoresist is dispensed in a liquid form onto the wafer as it undergoes rotation. the speed and acceleration of this rotation are important parameters in determining the resulting thickness of the applied photoresist. the photoresist-coated wafer is then transferred to a hot plate, where a “soft bake” is applied to drive off excess solvent before the wafer is introduced into the exposure system. the simplest exposure system is a contact printer or proximity printer. a contact printer involves putting a photomask in direct contact with the wafer. a proximity printer puts a small gap in between the photomask and wafer. the photomask pattern is directly imaged onto the photoresist on the wafer in both cases. the resolution is roughly given by the square root of the product of the wavelength and the gap distance. hence, contact printing with zero gap distance ideally offers best resolution. defect considerations have prevented its widespread use today. however, the resurgence of nanoimprint lithography may revive interest in this familiar technique, especially since the cost of ownership is expected to be very low. the cost will be low due to the lack of a need for complex optics, expensive light sources, or specially tailored resists. the commonly used approach for photolithography today is projection lithography. the desired pattern is projected from the photomask onto the wafer in either a machine called a stepper or scanner. the stepper/scanner functions similarly to a slide projector. light from a mercury arc lamp or excimer laser is focused through a complex system of lenses onto a “mask” (also called a reticle), containing the desired image. the light passes through the mask and is then focused to produce the desired image on the wafer through a reduction lens system. the reduction of the system can vary depending on design, but is typically on the order of 4×-5× in magnitude. when the image is projected onto the wafer, the photoresist material undergoes some wavelength-specific radiation-sensitive chemical reactions, which cause the regions exposed to light to be either more or less acidic. if the exposed regions become more acidic, the material is called a positive photoresist, while if it becomes less susceptible it is a negative photoresist. the resist is then “developed” by exposing it to an alkaline solution that removes either the exposed (positive photoresist) or the unexposed (negative photoresist) region. this process takes place after the wafer is transferred from the exposure system back to the wafertrack. developers originally often contained sodium hydroxide (naoh). however, sodium is considered an extremely undesirable contaminant in mosfet fabrication because it degrades the insulating properties of gate oxides. metal-ion-free developers such as tetramethyl ammonium hydroxide (tmah) are now used. a post-exposure bake is performed before developing, typically to help reduce standing wave phenomena caused by the destructive and constructive interference patterns of the incident light. the developing chemistry is delivered in a similar fashion to how the photoresist was applied. the resulting wafer is then “hardbaked” on a bake plate at high temperature in order to solidify the remaining photoresist, to better serve as a protecting layer in future ion implantation, wet chemical etching, or plasma etching. the ability to project a clear image of a very small feature onto the wafer is limited by the wavelength of the light that is used and the ability of the reduction lens system to capture enough diffraction orders from the illuminated mask. current state-of-the-art photolithography tools use deep ultraviolet (duv) light with wavelengths of 248 nm and 193 nm, which allow minimum resist feature sizes down to 50 nm. optical lithography can be extended to feature sizes below 50 nm using 193 nm and liquid immersion techniques. also termed immersion lithography, this enables the use of optics with numerical apertures exceeding 1.0. the liquid used is typically ultra-pure, deionised water, which provides for a refractive index above that of the usual air gap between the lens and the wafer surface. this is continually circulated to eliminate thermally-induced distortions. using water will only allow numerical apertures of up to ˜1.4 but higher refractive index materials will allow the effective numerical aperture to be increased. tools using 157 nm wavelength duv in a manner similar to current exposure systems have been developed. these were once targeted to succeed 193 nm at the 65 nm feature size node but have now all but been eliminated by the introduction of immersion lithography. this was due to persistent technical problems with the 157 nm technology and economic considerations that provided strong incentives for the continued use of 193 nm technology. high-index immersion lithography is the newest extension of 193 nm lithography to be considered. in 2006, features less than 30 nm have been demonstrated by ibm using this technique. other alternatives are extreme ultraviolet lithography (euv), nanoimprint lithography, and contact printing. euv lithography systems are currently under development which will use 13.5 nm wavelengths, approaching the regime of x-rays. nanoimprint lithography is being investigated by several groups as a low-cost, non-optical alternative. contact printing has already been established years ago and may yet be revived with the recent strong interest in nanoimprint lithography. the image for the mask is originated from a computerized data file. this data file is converted to a series of polygons and written onto a square fused quartz substrate covered with a layer of chrome using a photolithographic process. a beam of electrons is used to expose the pattern defined in the data file and travels over the surface of the substrate in either a vector or raster scan manner. where the photoresist on the mask is exposed, the chrome can be etched away, leaving a clear path for the light in the stepper/scanner systems to travel through. optical lithography can be extended to a resolution of 15 nm by using the short wavelengths of 1 nm x-ray lithography for the illumination. this is implemented by the proximity printing approach. the technique is developed to the extent of batch processing. the extension of the method relies on near field x-rays in fresnel diffraction: a clear mask feature is “demagnified” by proximity to a wafer that is set near to a “critical condition.” this condition determines the mask-to-wafer gap and depends on both the size of the clear mask feature and on the wavelength. the method is rapid because it uses broadband, and simple because it requires no lenses. fig. 10 illustrates a photolithographic mask 28 c that is non-defective. photolithographic mask 28 c has a transparent substrate 52 with two structures 54 and 56 made out of mosi forming features of the photolithographic mask 28 c. the structures 54 and 56 have an end-to-end critical dimension of 96 nm, for purposes of forming a structure on a substrate having a dimension of 24 nm. fig. 11 illustrates a photolithographic mask 28 d that is similar to the photolithographic mask 28 c of fig. 10 , in the sense that the photolithographic mask 28 d has a transparent substrate 60 and two structures 62 and 64 formed on the transparent substrate 60 . the photolithographic mask 28 d differs from the photolithographic mask 28 c in that the structures 62 and 64 have an end-to-end width of 112 nm, which would result in a structure on a substrate having a width of 28 nm. the structures 62 and 64 are thus defective in that they are 60 nm too wide or far apart. fig. 12 illustrates one method of correcting or compensating for the oversized end-to-end relationship between the structures 62 and 64 . in the embodiment of fig. 12 , a phase voxel cavity 66 is etched in the transparent substrate 60 in an area between the structures 62 and 64 . the phase voxel cavity 66 has a width of approximately 28 nm, a length of approximately 4 nm, and a depth of approximately 170 nm. a footprint of the phase voxel cavity 66 is thus smaller than a footprint of an area between the structures 62 and 64 , so that the phase voxel cavity 66 does not entirely eliminate light passing through the area between the structures 62 and 64 and only reduces the overall intensity of the light. as can be seen in fig. 13 , the photolithographic mask 28 d of fig. 12 has approximately the same critical dimension at all the focus lengths as the photolithographic mask 28 c of fig. 11 , even though the photolithographic mask 28 d of fig. 10 results in a different critical dimension at all the focus lengths. in the embodiment above the photolithographic mask has two structures with an end-to-end critical dimension that is too large, the phase voxel cavity being formed between the two structures. fig. 14 illustrates another photolithographic mask 28 e of the alternating phase-shift type. the photolithographic mask 28 e includes a transparent substrate 70 with a chromium layer 72 formed on the transparent substrate 70 . the chromium layer 72 is etched to leave windows 74 and 76 of the transparent substrate 70 visible. the transparent substrate 70 is also further etched in the areas of the windows 76 so that the transparent substrate 70 is deeper where the windows 76 are than where the windows 74 are. the windows 74 represent light at 0 degrees and the windows 76 light at π. the chromium layer 72 is opaque and attenuates all light. fig. 15 illustrates a photolithographic mask 28 f which is the same as the photolithographic mask 28 e of fig. 14 , in the sense that it has a transparent substrate 80 and a chromium layer 82 that defines windows 84 and 86 , with the windows 86 being etched deeper than the windows 84 . in addition, the photolithographic mask 28 f has a defect because a portion of the chromium layer 82 is inadvertently removed to leave an area 90 of the transparent substrate 80 exposed. in fig. 16 the defect due to the area 90 in fig. 15 is compensated for by etching two phase voxel cavities 92 into the transparent substrate 80 within the area 90 . the phase voxel cavities 92 are smaller than the area 90 and partially cancel light from the square area 90 . in the given embodiment, light having a wavelength of 193 nm is used. with a refractive index of 1.56 for glass, the windows 76 , 86 , and the phase voxel cavities 92 would have to be etched to a depth of 172 nm below the surface of the windows 74 and 84 . however, due to an effective phase of the light, the areas within the windows 76 and 86 and the phase voxel cavities 92 are etched to a depth of 160 nm below the surface of the windows 74 and 84 . the effective phase is a function of geometry, illumination, etc. in the embodiment above, the photolithographic mask has a transparent substrate and a nontransparent layer formed on the transparent substrate, the defect being the absence of a portion of the nontransparent layer to leave an area of the transparent substrate exposed, the phase voxel cavity being formed in the area. while certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this invention is not restricted to the specific constructions and arrangements shown and described since modifications may occur to those ordinarily skilled in the art.
176-105-473-821-532	KR	[ "CN", "WO", "US", "KR", "EP" ]	D06F58/02,D06F58/26,D06F58/04,D06F58/00,F26B3/34,D06F29/00,D06F39/00,D06F39/12,D06F58/10	2012-12-29T00:00:00	2012	[ "D06", "F26" ]	clothes processing machine with high-frequency drying device	the invention provides a clothes processing machine with a high-frequency drying device. the clothes processing machine comprises at least one body, a base and the high-frequency drying device, wherein each body comprises a rotary drum which is rotatably arranged in the body; the base supports each body and provides a specific drying space for accommodating to-be-dried objects; the high-frequencydrying device comprises a positive pole and a negative pole, high frequency is applied to the positive pole, the negative pole is electrically insulated from the positive pole, and an oscillating electric field is formed between the positive pole and the negative pole inside the drying space.	1. a laundry treatment machine comprising: a main body comprising a drum rotatably disposed therein; a pedestal supporting the main body and providing a certain drying space that receives a drying subject; a high frequency drying apparatus comprising an anode to which a high frequency is applied and a cathode electrically insulated from the anode to form an oscillation electric field between the anode and the cathode inside the drying space, and a variable impedance configured to control an intensity of the oscillation electric field formed between the anode and the cathode, the variable impedance provided adjacent to the pedestal such that heat generated upon application of an electric current is transmitted into the pedestal, wherein the pedestal comprises: a storage having an open upper surface such that the drying subject is received into the storage through the open upper surface; and a housing configured to receive the storage therein in a withdrawable manner, wherein the anode is formed on a surface of the housing arranged over the upper surface of the storage and facing a bottom surface of the storage, wherein the storage serves as the cathode, and wherein the variable impedance is provided over a bottom of the main body and heat generated from the impedance is transmitted to the storage by conduction through the housing. 2. the laundry treatment machine of claim 1 , wherein the cathode is electrically connected to a ground. 3. the laundry treatment machine of claim 1 , wherein the variable impedance comprises at least one of an induction coil or a condenser. 4. the laundry treatment machine of claim 1 , further comprising a blower to exhaust air inside the pedestal. 5. the laundry treatment machine of claim 1 , further comprising an exhaust duct to exhaust air inside the main body to the outside, wherein a first valve is provided at an upstream side of the exhaust duct to control air flowing into the pedestal along the exhaust duct, and a second valve is provided at a downstream side of the exhaust duct to control air exhausted from the pedestal to the exhaust duct. 6. the laundry treatment machine of claim 5 , wherein at least one of the first valve and the second valve is a three-way valve. 7. the laundry treatment machine of claim 5 , further comprising a blower that blows air inside the main body to the exhaust duct. 8. the laundry treatment machine of claim 1 , wherein: the main body comprises: a first main body in which wash water is supplied into the drum; and a second main body in which hot air is supplied into a second drum, the second main body being arranged side by side with the first main body, and wherein the pedestal comprises: a first pedestal supporting the first main body; and a second pedestal supporting the second main body, wherein the high frequency drying apparatus forms an electric field inside at least one of the first pedestal and the second pedestal. 9. the laundry treatment machine of claim 1 , wherein the main body comprises: a first main body in which wash water is supplied to the drum; and a second main body in which hot air is supplied to a second drum, the second main body being arranged side by side with the first main body, wherein the pedestal supports the first main body and the second main body. 10. the laundry treatment machine of claim 1 , wherein an internal temperature of the pedestal is less than than 30 degrees celsius when the electric field is formed inside the pedestal.	cross-reference to related patent applications this application is a u.s. national stage application under 35 u.s.c. § 371 of pct application no. pct/kr2012/011823, filed dec. 29, 2012, whose entire disclosure is hereby incorporated by reference. technical field the present disclosure relates to a laundry treatment machine with a high frequency drying apparatus. background art in general, examples of laundry treatment machines include washing machines that supply wash water into a drum holding laundry and remove contaminants from laundry and clothes and drying machines that supply hot air or cool air into a drum to dry laundry. recently, laundry treatment machines that can perform a drying function as well as a washing function are being widely used. the clothes drying machine is an apparatus that supplies hot air or cool air into a certain space or drum holding wet clothes to dry the wet clothes. generally, the clothes drying machine includes a heater for generating heat and a blower for delivering the heat generated from the heater to the space holding clothes. the clothes drying machine induces evaporation of water by increasing the temperature of water contained in clothes using heat delivered by heated air. since heat is transferred from air having a lower specific heat to water having a higher specific heat, the temperature of water does not significantly increase compared to the temperature of heated air, and the drying performance is low compared to the power consumption. also, since the air temperature inside the drum must be equal to or greater than 100 degrees celsius in order for water contained in clothes to reach the evaporative temperature, contact of hot air with clothes may cause denaturalization or damage of cloth. furthermore, the drying machine may include an exhaust system for exhausting water evaporated from clothes out of the drying machine. in this case, since the internal temperature of the drum inevitably drops due to continuous exhaust of heated air, the operation time of the heater increases, and thus the power consumption and the drying time increase. disclosure of invention technical problem embodiments provide a laundry treatment machine that can dry clothes using a high frequency. embodiments also provide a laundry treatment machine including a high frequency drying apparatus in addition to typical washer and dryer. embodiments also provide a laundry treatment machine that can minimize damage of cloth caused by drying of clothes. embodiments also provide a laundry treatment machine that can reduce power consumption and drying time spent in drying clothes. embodiments also provide a laundry treatment machine that further includes a high frequency drying apparatus while minimizing the structural modification of typical washer and dryer. solution to problem in one embodiment, a laundry treatment machine includes: at least one main body comprising a drum rotatably disposed therein; a pedestal supporting the main body and providing a certain drying space for receiving a drying subject; and a high frequency drying apparatus comprising an anode to which a high frequency is applied and a cathode electrically insulated from the anode to form an oscillation electric field between the anode and the cathode inside the drying space. the details of one or more embodiments are set forth in the accompanying drawings and the description below. other features will be apparent from the description and drawings, and from the claims. advantageous effects of invention a laundry treatment machine according to an embodiment can reduce the power consumption and the drying time by drying clothes using a high frequency. also, a laundry treatment machine according to an embodiment can perform a high frequency drying function while minimizing the structural modification of typical washer and dryer. furthermore, a laundry treatment machine according to an embodiment can prevent denaturalization of cloth caused by a high temperature, by performing drying at a relatively low temperature using a high frequency drying apparatus compared to a drying method using hot air. brief description of drawings fig. 1 is a perspective view illustrating a laundry treatment machine according to an embodiment. fig. 2 is a view illustrating an internal configuration of the laundry treatment machine shown in fig. 1 . fig. 3 is a view illustrating a control relation between main components of a high frequency drying apparatus applied to the laundry treatment machine shown in fig. 1 . fig. 4 is a view illustrating an exhaust system of a laundry treatment machine according to an embodiment. fig. 5 is a view illustrating an exhaust system of a laundry treatment machine according to another embodiment. fig. 6 is a graph illustrating a drying efficiency according to a laundry load upon drying using a high frequency drying apparatus. fig. 7 is a view illustrating a laundry treatment machine according to another embodiment. fig. 8 is a view illustrating a laundry treatment machine according to still another embodiment. best mode for carrying out the invention reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. fig. 1 is a perspective view illustrating a laundry treatment machine according to an embodiment. fig. 2 is a view illustrating an internal configuration of the laundry treatment machine shown in fig. 1 . fig. 3 is a view illustrating a control relation between main components of a high frequency drying apparatus applied to the laundry treatment machine shown in fig. 1 . hereinafter, a drying apparatus will be exemplified to explain a laundry treatment machine according to an embodiment, but the embodiments are not limited thereto. accordingly, it should be understood that the following description of the embodiments can also be applied or indirected to a washing machine or a washing and drying machine within the technical spirit. referring to figs. 1 and 3 , a dryer 100 may include a main body 110 and a high frequency drying apparatus 170 . the main body 110 and the high frequency drying apparatus 170 may independently perform a clothes drying function, respectively. however, the main body 110 may dry clothes using hot air or cool air, whereas the high frequency drying apparatus 170 may dry clothes by forming an oscillation electric field between the anode electrode and the cathode electrode disposed across clothes that are insulating materials. the main body 110 may include a casing 111 having a laundry loading opening at the front side thereof, a door 113 opening/closing the laundry loading opening, a drum holding a drying subject such as clothes and rotatably disposed inside the casing 111 , a heater 134 for heating air, a blower 131 for blowing air heated by the heater 134 , a dry duct 135 guiding air blown by the blower 131 into the drum 120 , an exhaust duct 133 for exhausting air inside the drum 120 out of the main body 110 , and a filter 132 disposed at the inlet of the exhaust duct 133 to filter foreign substances such as lint suspended in the air. a motor (not shown) may also be disposed to provide a driving force for rotating the drum 120 . the power transmission from the motor to the drum 120 may be divided into a direct driving type in which the shaft of the motor is arranged on the same line as the rotation center of the drum 120 and an indirection driving type in which the power transmission is performed using a power transmission member such as gear or belt. also, the motor may rotate the blower 131 in addition to the drum 120 . although not shown, in this embodiment, the blower 131 is rotated by the motor, and the drum 120 may be rotated by power transmission through a belt wound around the circumferential surface of the drum 120 . the high frequency drying apparatus may dry clothes by applying an electric field oscillating from a high frequency wave or a radio frequency wave to the drum 120 . high frequency energy may be used to dry an insulating material such as clothes. when the electric field oscillating from the high frequency wave is applied to clothes, molecules may be excited in the electric field, thereby producing an internal heat gain by friction between molecules. particularly, when wet clothes absorb sufficient energy, the state of water molecules may be changed from liquid to gas by the heat gain, allowing water to evaporate. the high frequency drying apparatus 170 may include a high frequency generator for generating a high frequency according to a required frequency and a coaxial cable for transmitting the high frequency from the high frequency generator to anode electrodes. in this case, cathode electrodes may be connected to the ground. generally, the high frequency generator may include an oscillator and a triode, and may be referred to as an electron tube. the triode may have an anode, a cathode, and a grid. the oscillator may generate a signal applied to the grid at a desired frequency, and a high voltage between the anode and the cathode may amplify oscillating power to provide a high frequency having high power. the electron tube may be replaced when its life ends. in order to elongate the lifespan of the electron tube, a cooling apparatus may be provided. an air cooling type of cooling apparatus may be commonly used, but a water cooling type of cooling apparatus may be more effective. meanwhile, the high frequency generator may supplement the faults of the electron tube, and may be implemented by a solid-state technology. in general, the solid-state technology may be used to generate a radio frequency or high frequency wave in the application fields of the information communication such as mobile communication or wireless network. however, this technology may be suitable for lower power, and it is desirable to further provide an amplifier to acquire high power necessary for drying of clothes. for this, a solid-state transistor may be used. the lifespan of the high frequency generator using the solid-state technology may be significantly extended, and advantageous in terms of repair and replacement compared to the electron tube type. referring to fig. 3 , the high frequency drying apparatus 170 may include a high frequency generator 175 for generating a high frequency to form an oscillation electric field between the anode and the cathode that are electrically insulated from each other, a coaxial cable 171 for applying the high frequency generated by the high frequency generator 175 to the anode, and a variable impedance for controlling the intensity of the oscillation electric field formed between the anode and the cathode. the variable impedance may include at least one of induction coil or a condenser. the variable impedance may be a tuning inductor ( 172 ). the high frequency generator 175 may include an electric power supply unit 176 for supplying a dc power and a high frequency power source 177 for receiving electric power from the electric power supply unit 176 and outputting a high frequency power according to the input of a predetermined frequency. the high frequency generator 175 may further include a frequency synthesizer 178 . the frequency synthesizer 178 may generate a signal at a predetermined high frequency, and the high frequency power source 177 may output a high frequency power according to the input of the frequency applied from the frequency synthesizer 177 . the high frequency generated by the high frequency generator 175 may be transmitted to the anode (+) through the coaxial cable 11 , and may be transmitted via the tuning inductor 172 . the reactance may be controlled by the tuning inductor 172 , thereby varying the intensity of the electric field between the anode (+) and the cathode (−). the anode (+) and the cathode (−) may be provided to be insulated from each other. the anode (+) and the cathode (−) may be electrodes only for applying of the electric field, but a portion of the dryer 100 may also be used as electrodes. particularly, the laundry treatment machine may include a pedestal 160 for supporting the main body 110 in addition to the main body 110 that performs main functions. in this embodiment, the main body 110 may perform a function of drying clothes loaded into the drum 120 , and the pedestal 160 may support the main body 110 and may allow the electric field generated by the high frequency drying apparatus 170 to be applied to drying subjects loaded therein. typically, the pedestal 160 may increase the height of the main body 110 such that a user can easily load/unload laundry to/from the main body 110 without excessively bending at the waist, and may provide an internal storage space to the main body 110 to store detergent, shoes, laundry, and various kinds of household items. in this embodiment, the high frequency drying apparatus 170 may be implemented in the space provided by the pedestal 160 . the pedestal 160 may include a housing 150 supporting the main body 110 and a storage 140 receiving drying subjects such as clothes and withdrawably disposed in the housing 150 . the storage 140 may be slidably disposed along the housing 150 . the housing 150 may surround the storage 140 , and may have an opening at the front side thereof such that the storage 140 can be inserted/withdrawn. as described above, the high frequency drying apparatus 170 may include anode electrodes to which a high frequency is applied and cathode electrodes connected to the ground and forming an electric field together with the anode electrodes. in this embodiment, the structure of the pedestal 160 may be utilized to configure the anode electrodes and the cathode electrodes without a separate structure. that is, one of the housing 150 and the storage 140 constituting the pedestal 160 may serve as the anode electrodes, and the other may serve as the cathode electrodes. both may be insulated from each other such that an electric field can be formed between the housing 150 and the storage 140 . meanwhile, it may be determined whether a high frequency is applied to the housing 150 or the storage 140 . this determination may be performed such that the electric field formed between the housing 150 and the storage 140 is not leaked to the outside. preferably, the leakage of the electric field out of the storage 140 may be minimized by allowing the housing 150 to serve as the anode and allowing the storage 140 surrounding drying subjects disposed in the housing 150 to serve as the cathode. particularly, the storage 140 may be formed to have a box shape that is opened at the upper side thereof to receive drying subjects. a surface 151 of the housing 150 facing a bottom surface 143 of the storage 140 may be determined as the anode to which a high frequency is applied. a side surfaces 141 and 142 , the bottom surface 143 and a front surface 144 of the storage 140 may be integrally formed using one metal plate. in this case, the whole internal region of the storage 140 may serve as the cathode. an outer side of the front surface 144 may be provided with an exterior panel 145 . in order to more effectively dry drying subjects inside the storage 140 , a method of providing a heat source for increasing the internal temperature of the storage 140 may be considered. for this, a heater may be additionally disposed, but preferably, the electric power supply unit 176 , the high frequency power source 177 and/or the tuning inductor 172 that generate heat upon power supply in the high frequency drying apparatus 170 may be disposed adjacent to the pedestal 160 . the heat sources may be disposed over a bottom 111 a of the casing 111 or over the housing 150 . heat generated from the heat sources may be transmitted to the storage 140 by conduction through the housing 150 or the storage 140 or the convection of air by an exhaust system described later. a supporter 146 may support drying subjects such that the drying subjects can be spaced from the bottom surface 143 of the storage 140 . the supporter 146 may have a frame or lattice structure such that an electric field can be easily formed between the housing 150 and the storage 140 . particularly, the supporter 146 may be formed of a material without an electromagnetic interference. as shown in fig. 6 , the drying using the high frequency may be excellent in drying efficiency compared to a typical drying method, i.e., a method of supplying air heated by the heater 134 into the drum 120 , which is performed in the main body 110 . since the typical hot air drying method spends most energy in increasing the temperature inside the drum 120 at the initial stage of drying, sufficient drying performance may not be exerted at the initial stage of drying, and excessive energy may be spent compared to the amount of water evaporated from drying subjects at the late stage of drying. accordingly, the hot air drying method may be low in its efficiency. however, the drying method of using a high frequency may maintain high drying efficiency over the whole drying process. since water molecules are directly excited by an electric field in the high frequency drying method, the water may be quickly evaporated. the high frequency drying method may be less dependent on the load quantity compared to the typical hot air drying method. since the high frequency drying method substantially excites water molecules contained in load by applying an electric field, the drying performance can be uniformly maintained even when the load quantity is changed. also, the high frequency drying apparatus 170 can dry subjects even when the temperature inside the drum 120 is below 30 degrees celsius. this is very low temperature compared to a typical hot air drying method in which drying is performed at a temperature of about 100 degrees celsius. accordingly, clothes can be fundamentally prevented from being denaturalized by high temperature. fig. 4 is a view illustrating an exhaust system of a laundry treatment machine according to an embodiment. referring to fig. 4 , a dryer 100 a according to an embodiment may include an exhaust fan 181 for exhausting air inside a pedestal 160 to the outside. the exhaust fan 181 may be disposed in a casing 111 of a main body 110 . the housing 150 constituting the pedestal 160 may have an outlet (not shown) at one side thereof so as to exhaust air inside the pedestal 160 by the exhaust fan 181 . air exhausted from the pedestal 160 by the exhaust fan 181 may be directly exhausted to the main body 110 , but may be exhausted out of the dryer 110 a via an exhaust duct 133 connected to the exhaust fan 181 or a separate exhaust passage. according to the high frequency drying apparatus 170 , air inside the pedestal 160 may increase in its humidity due to water evaporated from drying subjects, but the drying performance may be improved because the exhaust fan 181 operates. fig. 5 is a view illustrating an exhaust system of a laundry treatment machine according to another embodiment. referring to fig. 5 , a pedestal 160 may have an inlet receiving air from the outside and an outlet for exhausting air inside the pedestal 160 to the outside. the inlet and the outlet may be provided with a first valve 183 and a second valve 185 to control the air flow. particularly, in this embodiment, a laundry treatment machine having a drying function through a main body 110 may have a structure in which hot air or cool air is supplied into a drum 120 disposed in the main body 110 . particularly, in case of an exhaust type of dryer, air heated by a heater 134 may be delivered to the drum 120 along a dry duct 135 by a blower 131 and then may be applied to drying subjects inside the drum 120 . thereafter, air may be exhausted out of the dryer via an exhaust duct 133 . in this embodiment, this air flow in the main body 110 may be induced to a pedestal 160 through a first valve 183 and/or a second valve 185 to facilitate the improvement of the drying performance upon operation of a high frequency drying apparatus 170 . in this case, hot air or cool air may be supplied into the pedestal 160 according to whether or not the heater 134 operates. the first valve 183 and the second valve 185 may be disposed in a passage bypassing the exhaust duct 133 . in this case, the first valve 183 and the second valve 185 may be a 3-way valve. in this structure, air delivered by the blower 131 may not be exhausted out of the dryer 100 b through the exhaust duct 133 , but may be supplied into the pedestal 160 through the inlet opened by the first valve 183 and then exhausted out of the dryer 100 b along the exhaust duct 133 through the outlet opened by the second valve 185 . fig. 7 is a view illustrating a laundry treatment machine according to another embodiment. referring to fig. 7 , a laundry treatment machine 100 c may include a first main body 210 providing a washing function and a second main body 220 providing a drying function. the first main body 210 may be a washer that supplies wash water into a drum holding laundry and rotating to remove contaminants from laundry, and the second main body 220 may be a dryer that supplies hot air or cool air into a drum holding laundry and rotating to dry laundry. a user may perform washing using the washer 210 , and then may load washed laundry into the dryer 220 to dry laundry. the laundry treatment machine 100 c may include a first pedestal 230 supporting the washer 210 and a second pedestal 240 supporting the dryer 220 . a high frequency drying apparatus 170 may be implemented by utilizing at least one of the first pedestal 230 and the second pedestal 240 as a reception space for drying subjects. for example, as shown in fig. 7 , when the second pedestal 240 is used, an electric field formed between the anode and the cathode of the high frequency drying apparatus 170 may excite water molecules contained in drying subjects inside the second pedestal 240 to dry the drying subjects. similarly to the previous embodiment, the anode and the cathode may be implemented with a housing 150 and a storage 140 constituting the pedestal. fig. 8 is a view illustrating a laundry treatment machine according to still another embodiment. referring to fig. 8 , similarly to fig. 7 , a laundry treatment machine 100 d may include a first main body 210 serving as a washer and a second main body 220 serving as a dryer, but the first main body 210 and the second main body 220 may be supported a common pedestal 250 . similarly to the previous embodiments, an electric field formed between the anode and the cathode may excite water molecules contained in drying subjects inside the pedestal 250 to dry the drying subjects. similarly to the previous embodiments, the anode and the cathode may be implemented with a housing 150 and a storage 140 constituting the pedestal 250 . although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. more particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. in addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
176-268-007-315-903	US	[ "US" ]	F24J2/52,H01L31/042,H02S20/10,H02S20/20,H02S40/36	1989-03-13T00:00:00	1989	[ "F24", "H01", "H02" ]	support for photovoltaic arrays	a supported photovoltaic array and method in which support elements are in rows spaced from one another and are bi-directionally spanned by members which mount photovoltaic modules that are separated from one another and are secured to the spanning members by cushioned load-spreading attachments positioned in the spaces between adjacent modules.	1. a supported photovoltaic array comprising a first row of support elements set in the earth; a second row, spaced from said first row, of support elements set in the earth; a plurality of first members, each spanning a plurality of said support elements; a plurality of second members spanning said first members; and a set of photovoltaic modules mounted on each pair of said second members, with each module separated from an adjacent module, with each adjacent pair of modules being secured to an underlying second member by at least one cushioned, load-spreading attachment positioned in the spaces between adjacent pairs of modules. 2. the system of claim 1 wherein each load-spreading attachment is a rivet with an enlarged head having an area which is at least three times the cross-sectional area of the rivet stem. 3. the system of claim 2 wherein the ratio of head area to cross sectional area is about 25:1. 4. the system of claim 1 wherein the support elements of said first and second rows are wooden piles and said modules have glass substrates. 5. the system of claim 1 wherein said first members span support elements in rows or in columns and said modules are retained by clips. 6. the system of claim 5 wherein said first members are open-web joists and said clips are polycarbonate plastic. 7. the system of claim 6 wherein each joist is formed by an upper flange, a lower flange and a lattice structure in between. 8. the system of claim 1 wherein each second member is a rail formed from sheet metal with at least two bends. 9. the system of claim 8 wherein the modules are connected to form panels and the panels are included in sections and are electrically connected to a main bus by insulation piercing connectors. 10. the system of claim 9 wherein the bent portions of each rail contact respectively the first members and photovoltaic modules and each insulating-piercing connection includes saw-tooth members that are drawable towards one another with conductors there between. 11. the system of claim 1 wherein each attachment is accompanied by a load spreading washer positioned below the surfaces of adjacent modules. 12. the system of claim 11 wherein a load cushioning material which spans adjoining modules is interposed between each attachment and its underlying second member. 13. the system of claim 12 wherein the load cushioning material is a polycarbonate. 14. the method of providing a support system for a photovoltaic array, which comprises the steps of (1) setting a first row of support elements in the earth with each element extending vertically upward; (2) setting a second row of support elements in the earth displaced from said first row; (3) providing a plurality of reinforcement members and connecting the upper ends of adjoining support elements by a reinforcement member; (4) spanning the reinforcement members by a plurality of support members; (5) mounting a plurality of spaced apart photovoltaic modules separated from one another on said photovoltaic support members; and (6) attaching said separated photovoltaic modules to said support members by load-spreading fasteners positioned in the spaces between adjacent pairs of modules. 15. the method of claim 14 wherein said load-spreading fasteners are cushioned by spanning adjoining modules. 16. the method of claim 15 wherein said load-spreading fasteners are cushioned by placing a material between each fastener and the surfaces of adjoining photovoltaic modules. 17. the method of claim 14 wherein said support elements are driven into the earth. 18. the method of claim 14 wherein said support elements are set in augered holes and tamped. 19. the method of claim 14 wherein said reinforcement members connect support elements in either a row or a column and mount separated modules. 20. the method of generating electricity which comprises the steps of: (a) providing support elements for a photovoltaic array; (b) mounting said photovoltaic array on said support elements; (c) fastening individual modules of said array to the support members by cushioned load spreading fasteners positioned in the spaces between adjacent pairs of modules; and (d) interconnecting the, separated modules of said array to produce electricity in response to illumination of the modules of said array by solar energy.	background of the invention this invention relates to photovoltaic arrays and more particularly to support systems for such arrays. photovoltaic arrays include a large number of solar panels which are arranged to provide electric power. this is accomplished by the conversion to electricity of light incident upon the panels. significant technological progress that has been made in the production of panels, accompanied by increased efficiency and significant reductions in cost. it now appears that a major cost element involved in the establishment of a wide-scale photovoltaic array is the cost of the support structure that is used to mount the panels of the array in proper position for receiving and converting solar energy. many different arrangements have been proposed and some have been implemented experimentally. in general, these support systems are so costly and mechanically complicated that they have seriously hindered the widespread introduction of photovoltaic arrays for the generation of commercial and industrial electricity. as a result of the cost and mechanical complexity of existing arrays, there has been widespread reluctance to proceed with photovoltaic power systems, despite their obvious advantages in terms of desired environmental effects and conservation of petrochemicals which are more appropriately used for commercial and industrial products, instead of being wasted by burning. accordingly, it is an object of the invention to facilitate the low cost and mechanically simple construction of photovoltaic arrays. a related object is to achieve photovoltaic support systems that are competitive with the cost of generating electric power by conventional methods. another object of the invention is to simplify the construction of photovoltaic arrays so that construction companies, without specialized engineering skills, will be able to construct photovoltaic arrays and thus facilitate their introduction into the commercial power grid as a significant source of electricity. summary of the invention in accomplishing the foregoing and related objects the invention provides a support system for a photovoltaic array in which a first row of support elements is set in the earth and is accompanied by a second row of support elements set in the earth. a plurality of first members span the support elements either in a row or in a column. when there are two rows of support elements, each column contains only two such elements. a second plurality of members spans the first members and a set of photovoltaic modules is mounted on each pair of second members. at least one module is secured to the second member by at least one cushioned, load spreading attachment. in accordance with one aspect of the invention each load spreading attachment is a rivet with an enlarged head having an area which is at least three times the cross-sectional area of the rivet stem. the ratio of head area to cross-sectional area desirably is about 25:1. in accordance with another aspect of the invention the support elements of the first and second rows are desirably of wood and are advantageously wooden piles. in addition, the first members that span the support elements are advantageously open-webbed joists. each joist can be formed by an upper flange, a lower flange and a lattice structure in between. in particular, the second member can be a rail formed from sheet metal with at least two bends. such rails can have a "u" form or a "z" form. in addition, the bent portions of each rail contact respectively the first members and the photovoltaic modules. in accordance with a further aspect of the invention each attachment is accompanied by a load-spreading washer. a load-cushioning material can be interposed between each attachment and module and the load cushioning material is advantageously a polycarbonate. in accordance with a method of practicing the invention a support system for a photovoltaic array is provided by setting a first row of support elements in the earth with each element extending vertically upwards. a second row of support elements is also set in the earth spaced from the first row. this is followed by providing a plurality of reinforcement members and connecting the upper ends of the support elements of each row by a reinforcement member. the reinforcement members are in turn spanned by a plurality of photovoltaic support members that are used to mount photovoltaic modules. the latter are attached to the support members by load-spreading fasteners. in accordance with one aspect of the method, the load-spreading fasteners are cushioned. in addition, the load-spreading fasteners are advantageously cushioned by placing a cushioning material between each fastener and the surface of an associated photovoltaic panel. in accordance with a further aspect of the method, the support elements are driven into the earth, for example, by a pile driver. alternatively, the support elements can be set in augered holes and tamped. description of the drawings other aspects of the invention will be apparent after considering several illustrative embodiments of the invention, taken in conjunction with the drawings in which: fig. 1 is a front view of a photovoltaic support system in accordance with the invention; fig. 2a is a partial sectional view of the support system of fig. 1 showing support elements and first members; fig. 2b is a partial sectional view of an alternative support system in accordance with fig. 1; fig. 3 is a cross-sectional view showing laterally extending support members for the system of fig. 1; fig. 4a is an enlarged partial view showing the attachment of panels to the support system of fig. 1 using cushioned, load spreading fasteners; fig. 4b is a cross-section through a load spreading attachment shown in fig. 3a; fig. 5a is a diagram showing the arrangement of photovoltaic strings and their interconnection in accordance with the invention; fig. 5b is a diagram showing the relationship between photovoltaic strings and their interconnections; figs. 6a-6d are views of an alternative support system in accordance with the invention; and fig. 7a is a connection diagram illustrating the use of insulating piercing connectors (ipc's) in accordance with the invention; and fig. 7b is a perspective view of an insulation piercing connector used in fig. 7a for practicing the invention. detailed description with reference to the drawings, a support system 10 for a photovoltaic array in accordance with the invention includes a first row r1 of support elements 11-1 and 11-2. the array of fig. 1 includes only two support elements in the first row. when the array of fig. 1 is associated with adjoining arrays, the first row r1 will include "n+1" support elements depending on the number of arrays. as shown, each of the support elements is a wooden pile which has been driven into the ground, or installed in an augered hole and then tamped into position. while wooden members are particularly desirable, it will be appreciated that other materials may be used as well. examples includes pre-cast concrete and metallic elements. beyond the first row r1 is a second row r2 of support elements 12-1 and 12-2. it will be appreciated that each row will include further support elements associated with adjoining arrays and that further rows (not shown) of support elements may be included as well. for each of the rows r1 and r2 of support elements 11 and 12, there is a member 13 that spans the elements of that row. thus the elements 11-1 and 11-2 are spanned by a joist 13-1. similarly the elements 12-1 and 12-2 are spanned by a joist 13-2. when there are additional arrays with additional support elements 12-m through 12-n they can be spanned by individual joists, or the joists 13 can be extended to span all or part of the elements in each row. the joists 13-1 and 13-2 form two supports of a frame for solar modules 15. the mounting frame for the modules 15 is completed by rails 14-1 through 14-n. while there is a separate rail for each opposed pair of support elements, additional or fewer rails may be used as well. in the particular embodiment of fig. 1, the rail spacing is governed by the width of the individual solar modules 15. once the rails 14 are in place, the solar modules 15 are fastened to the rails to form a panel constituted by a plurality of modules. the modules are fastened by any suitable devices, for example cushioned fasteners 16, as illustrated in figs. 4a and 4b. each fastener 16 extends between adjoining modules into an associated rail. as described in more detail below, each fastener has an enlarged head 16-h which bears against a cushioning material 17 that spans adjoining modules. since the modules typically have a glass substrate with deposited conductive and photovoltaic materials, it is surprising and unexpected that the modules 15 could be secured in the fashion provided by the invention. it would ordinarily be expected that the pressure exerted by the fasteners would crack the modules. this does not happen in accordance with the invention because of the combined effect of the load spreading heads of the fasteners and the use of a suitable cushioning material 17. in figs. 4a and 4b the cushioning material is a retaining clip 17-c. this clip is advantageously made of a flexible material such as a polycarbonate plastic in order to provide the desired cushioning. connections of the solar modules 15 in the array 10 is made in conventional fashion. for simplicity in designating a particular module, row and column designations are used. thus the module in the third laterally extending row and the fifth longitudinally extending column is designated "15-3, 5", where "15" is the module designation and the suffix "3, 5" indicates the 3rd row and 5th column. it is to be noted that the row and column designations of the modules 15 are different than those of the support elements 11 and 12. specific constructional features of the array 10 are illustated in figs. 2a through 5b. as indicated in figs. 2a and 3, the joists 13 have an upper flange 13-u, a lower flange 13-r and an open web 13-o. in particular, as indicated in fig. 3 the web 13-o has a lattice structure. the lattice is particularly suitable in reducing the weight of the joists while at the same time preserving its structural rigidity. in addition, as indicated in figs. 2a and 3, the end of the joists 13 that is secured to an adjoining element 11 is held in position by a support angle bracket 13-a. the particular angle bracket 13-a shown in fig. 3 provides support not only for the joists 13-1 of the depicted array, it also provides support for a joist of an adjoining array. while the rails 14 of fig. 3 are "u" shaped with ends 14-a and 14-b, respectively positioned on an adjoining joist and solar panel, it will be appreciated that each rail 14 may have other forms, for example a "z" cross section where the ends are positioned as shown in fig. 3, but the web extends diagonally instead of vertically between the adjoining structural elements. a "z" shaped rail is desirable in simplifying the construction of the array since no particular attention is required in relation to the positioning of the rail on the joists, as long as the end members of the rails are in contact with the joists. it is to be noted, as shown in fig. 2a, that the array is mounted at an angle with respect to the surface of the earth. in particular an angle of about 25.degree. has been found to be particularly suitable for receiving an appropriate amount of solar energy as the position of the sun changes with respect to the earth. while the panel string of fig. 4 has been mounted longitudinally, i.e., extending upwardly with respect to the underlying frame in fig. 1, it will be appreciated that the string may also be mounted laterally, with the support rails parallel to the surface of the earth and nonintersecting. in that case, the joists 13-1 and 13-2 of fig. 1, which span the support elements in a row, are repositioned to span the support elements in a column. as a result, the joists 13-1 will extend between support elements 11-1 and 12-1, while the joist 13-2 will extend between support elements 11-2 and 12-2. the rails 14 will now extend between the joist 13-1, spanning elements 11-1 and 12-1, and the joist 13-2, spanning the elements 11-2 and 12-2. in relation to the scale of the array 10 shown in fig. 1, this modification will require extending the rails and the number of panels in order to provide an appropriate overall length that can span between the two joists. the reasons that the strings are adapted to be mounted either longitudinally or laterally is that shadow effects can otherwise produce discontinuities in the circuitry of the strings. in effect, the panels in each string are series connected. if a shadow falls on one of the panels it will have the effect of deadening that string and producing the equivalent of an open circuit. thus, if there are shadows that extend laterally, the strings will be arranged so that the shadows are in line with the interconnect and consequently cannot produce disablement of the overall string. otherwise, the strings can be arranged longitudinally, as shown in fig. 1, so that if any shadows occur they should extend along the direction of the rails and thus avoid disablement of any one string. interconnect arrangements for support systems of the kind shown in fig. 1 are illustrated in figs. 5a and 5b. in a specific embodiment 12 modules are mounted to form a panel and six panels are mounted to form a string sub-section. each string sub-section contains 72 modules. the basic mounting scheme of the invention is characterized by the mounting of multiple modules on pairs of formed galvanized sheet metal channels which lay across steel joists. this provides a basic array that is designated as a string sub-section. each string sub-section can be supported at each of its four corners. galvanized steel ground anchors and wooden pilings can be used. the anchors are set in the ground without the need for concrete. the structural elements are designed to withstand high wind loads characteristic of open solar suitable terrain that is common in such states as california, nevada and arizona. the rails are formed as channels by passing pregalvanized sheet metal through dies and punching needed attachment holes. an appropriate material is 16 gauge steel. the support for the rails by the joists is by steel members positioned with a nominal 25 per cent margin from the ends of the channels. where the string subsections are supported by anchors of the kind shown in fig. 2, the anchors are used with helix disks. alternatively, wooden poles are either driven into the ground or are set in the ground and tamped. an advantage provided by the wooden poles is that risers are not needed. with respect to the electrical wiring, a harness is used to connect six modules in parallel to a dual parallel cable. the latter connects the harness to a field junction box. in a tested embodiment, twelve cables of various lengths in a group were connected in parallel at a junction box to produce typically a peak power output of 3600 watts at 36 volts and 8.33 amperes. the 12 parallel cables from each of two sub arrays are joined in series in a junction box. a dual blocking diode prevents reverse bias of the solar modules which are joined to the series cable. this produces a doubling of the peak power output to 7200 watts at 72 volts and 100 amperes. a cable connects the junction boxes in series and the end of each string of 16 field junction boxes is terminated with a safety switch. this allows the field to be shorted for repair, test and maintenance. the cable is required for series connection of the field boxes. the peak power output becomes 1.15 megawatts (from ten times 115 kilowatts). the voltage is 1,150 at 100 amperes. the input cable from the field terminates in a direct current distributor panel. a series fused disconnect switch is included with each string along with series and shunt diodes. another embodiment of the invention is illustrated in figs. 6a-6d. the modules are series-connected horizontally, with ten modules per string shown in fig. 6a. a detail for five series-connected modules is shown in fig. 6b. the modules are joined by a simple two-connector harness and a series diode (not shown) is included in each string within a connector. the diode illustratively rated at 3 amperes and 1,000 volts prevents reverse strain in the array when there is shadowing or field shorting. eight strings in parallel connection are shown in fig. 6a forming a section. a side view in fig. 6c illustrates the location of a field switch for the array as well as cross-connected stabilization cables for the support poles. each stabilization cable is adjusted to proper tautness by a turnbuckle. in addition, each joist is positioned to resist the vertical component of wind force which is exerted against the faces of the modules. the mounting of the joist in relation to the adjoining support pole is illustrated in fig. 6d. connection to the main cable is by an insulation piercing connector of the type shown in fig. 7. the use of this type of connector eliminates the need for field junction boxes. for the insulation piercing connector of fig. 7, there are first and second ports for respective cables. each port contains sawtooth members that are drawn towards one another by the tightening of the nut and bolt connection that extends through the center of the connector. the saw tooth members of each port are joined to one another conductively so that when the cable members are inserted into the first and second ports, and the nut and bolt connection is tightened, the teeth in the ports pierce insulation of the two cables and provide a conductive connection. it will be understood that the foregoing detailed description is illustrative only and that other forms of the invention, including equivalence, will be readily apparent to those of ordinary skill in the art.
176-508-107-999-652	US	[ "JP", "US", "EP" ]	G06F9/455,G06F9/318,G06F9/34,G06F12/10	1996-02-28T00:00:00	1996	[ "G06" ]	system and method for emulating segmented virtual address space by microprocessor equipped with unsegmented virtual address space	problem to be solved: to provide a processor which processes a segmented-linear virtual address conversion instruction so as to convert a segmented virtual address in a segmented virtual address space into a linear virtual address in a linear virtual address space. solution: the segmented virtual address space includes segments which are each discriminated with one segment id, and each segment contains at least one page which is discriminated with one page id. the linear virtual address space includes pages which are each discriminated with one page id. when the segmented-linear virtual address conversion instruction is processed, the processor uses segmented-linear virtual address conversion descriptors which each relates to one page in the segmented virtual address space.	1. a processor for processing a segmented to linear virtual address conversion instruction to convert a segmented virtual address in a segmented virtual address space to a linear virtual address in a linear virtual address space, the segmented virtual address space comprising a plurality of segments, each segment comprising at least one segment page identified by a segmented page identifier, the linear virtual address space including a plurality of linear pages each identified by a linear page identifier, the processor using a plurality of segmented to linear virtual address conversion descriptors, each associated with a segment page, each segmented to linear virtual address conversion descriptor identifying the page identifier of one of said linear pages, the segmented to linear virtual address conversion instruction identifying a segmented virtual address in said segmented virtual address space, the segmented virtual address identifying one of said segment pages, the processor comprising: a. a segmented to linear virtual address conversion descriptor selector element for selecting one of said segmented to linear virtual address conversion descriptors associated with one of said segment pages as identified by the segmented to linear virtual address conversion instruction; and b. a linear virtual address generator for using the page identifier of the linear virtual address space from the segmented to linear virtual address conversion descriptor selected by said segmented to linear virtual address conversion descriptor selector element and the segmented virtual address identifier in the segmented to linear virtual address conversion instruction to generate a virtual address in said linear virtual address space. 2. a processor as defined in claim 1, the processor being connected to a memory, the memory storing the segmented to linear virtual address conversion descriptors, the processor further comprising a descriptor retrieval element for retrieving from the memory the segmented to linear virtual conversion descriptor as selected by said segmented to linear virtual address conversion descriptor element for use by said linear virtual address generator. 3. a processor as defined in claim 2 in which said processor further comprises a cache for caching segmented to linear virtual address conversion descriptors retrieved by said descriptor retrieval element, the segmented to linear virtual address conversion descriptor selector element initially determining whether the cache contains a segmented to linear virtual address conversion descriptor associated with the segment page identified by the segmented to linear virtual address conversion instruction and, if so, selecting the segmented to linear virtual address conversion descriptor. 4. a processor as defined in claim 3 in which said segmented to linear virtual address conversion descriptor selector element, if it determines that the cache does not contain a segmented to linear virtual address conversion descriptor associated with the segment page identified by the segmented to linear virtual address conversion instruction, initiates a retrieval operation to retrieve from the memory the segmented to linear virtual conversion descriptor as selected by said segmented to linear virtual address conversion descriptor element for use by said linear virtual address generator. 5. a processor as defined in claim 1 in which said segmented to linear virtual address conversion instruction is to be used in an access operation in connection with a page in the linear virtual address space, said segmented to linear virtual address conversion instruction including access rights information, and further in which each segmented to linear virtual address conversion descriptor includes access rights requirement indicia, the processor further including an access rights verifier for verifying that the access rights information in said segmented to linear virtual address conversion instruction conforms to the access rights requirement indicia. 6. a processor as defined in claim 5 in which said processor further includes an exception handler for performing selected recovery operations if the access rights verifier determines that the access rights information in said segmented to linear virtual address conversion instruction does not conform to the access rights requirement indicia in said selected segmented to linear virtual address conversion descriptor. 7. a processor as defined in claim 5 in which said access rights information in said segmented to linear virtual address conversion instruction indicates one of a plurality of access privilege levels, and said access rights requirement indicia indicates an access privilege level required for an access operation in connection with the page in the linear virtual address space, the access rights verifier verifying that the access privilege level indicated by said segmented to linear virtual address conversion instruction has a level required by the access privilege level indicated by the selected segmented to linear virtual address conversion descriptor. 8. a processor as defined in claim 5, the processor processing segmented to linear virtual address conversion instructions in connection with access operations of a plurality of selected access types, the access rights information in each said segmented to linear virtual address conversion instruction indicating the access type for which it is being processed, the access rights requirement indicia of each segmented to linear virtual address conversion descriptor indicating permitted access types for the segment page associated therewith, the access rights verifier verifying that the access rights information of the segmented to linear virtual address conversion instruction being processed indicates an access type which the access rights requirement indicia in the selected segmented to linear virtual address conversion descriptor indicates is permitted. 9. a processor as defined in claim 8 in which one of said access types is a storage operation, in which information is to be stored in the page of said linear virtual address space identified by the virtual address generated by said linear virtual address generator, the access rights information in each said segmented to linear virtual address conversion instruction indicating whether the access type is a storage operation and the access rights requirement indicia of each segmented to linear virtual address conversion descriptor indicating whether a storage operation is a permitted access type for the segment page associated therewith. 10. a processor as defined in claim 1 in which each segment in said segmented virtual address space is associated with one of a plurality of segment identifiers, each segmented to linear virtual address conversion descriptor includes a segment identifier value corresponding to the segment identifier for the segment comprising the segment page associated with the respective segmented to linear virtual address conversion descriptor, and further in which each segmented virtual address to be converted in response to said segmented to linear virtual address conversion instruction includes a segment identifier value, the processor further including a segment verifier for verifying that the segment identifier value included in said segmented to linear virtual address conversion instruction corresponds to the segment identifier value included in said segmented to linear virtual address conversion descriptor. 11. a processor as defined in claim 10 in which said processor further includes an exception handler for performing selected recovery operations if the segment verifier determines that the segment identifier value included in said segmented to linear virtual address conversion instruction does not correspond to the segment identifier value included in said segmented to linear virtual address conversion descriptor. 12. a processor as defined in claim 1 in which each segmented to linear virtual address conversion descriptor further comprises a length value identifying a length of the segment page associated therewith, and in which each segmented virtual address further includes an offset value identifying an offset into the segment page identified by said segmented virtual address, the processor further including a length verifier for verifying that the offset value included in said segmented virtual address is not greater than the length value included in said segmented to linear virtual address conversion descriptor. 13. a processor as defined in claim 12 in which said processor further includes an exception handler for performing selected recovery operations if the length verifier determines that the offset value included in said segmented virtual address is greater than the length value included in said segmented to linear virtual address conversion descriptor. 14. a processor as defined in claim 1 in which each segmented virtual address further includes an offset value identifying an offset into the segment page identified by said segmented virtual address, the linear virtual address generator using the offset value in generating said virtual address in said linear virtual address space. 15. a processor as defined in claim 14 in which said linear virtual address generator generates said virtual address in said linear virtual address space by concatenating the offset value from the segmented virtual address onto the page identifier of the linear virtual address space from the selected segmented to linear virtual address conversion descriptor. 16. a method of processing a segmented to linear virtual address conversion instruction to convert a segmented virtual address in a segmented virtual address space to a linear virtual address in a linear virtual address space, the segmented virtual address space comprising a plurality of segments, each segment comprising at least one segment page identified by a segmented page identifier, the linear virtual address space including a plurality of linear pages each identified by a linear page identifier, the method using a plurality of segmented to linear virtual address conversion descriptors, each associated with a segment page, each segmented to linear virtual address conversion descriptor identifying the page identifier of one of said linear pages, the segmented to linear virtual address conversion instruction identifying a segmented virtual address in said segmented virtual address space, the segmented virtual address identifying one of said segment pages, the method comprising the steps of: a. selecting one of said segmented to linear virtual address conversion descriptors associated with one of said segment pages as identified by the segmented to linear virtual address conversion instruction; and b. using the page identifier of the linear virtual address space from the segmented to linear virtual address conversion descriptor selected by said segmented to linear virtual address conversion descriptor selector element and the segmented virtual address identifier in the segmented to linear virtual address conversion instruction to generate a virtual address in said linear virtual address space. 17. a method as defined in claim 16, in which a memory stores the segmented to linear virtual address conversion descriptors, the method further comprising the step of retrieving from the memory the selected use in generating said virtual address in said linear virtual address. 18. a method as defined in claim 17 in which a cache is provided for caching retrieved segmented to linear virtual address conversion descriptors, the method initially determining whether the cache contains a segmented to linear virtual address conversion descriptor associated with the segment page identified by the segmented to linear virtual address conversion instruction and, if so, selecting the segmented to linear virtual address conversion descriptor. 19. a method as defined in claim 18 in which, if the cache does not contain a segmented to linear virtual address conversion descriptor associated with the segment page identified by the segmented to linear virtual address conversion instruction, retrieval operation is initiated to retrieve from the memory the selected segmented to linear virtual conversion descriptor for use in generating said virtual address in said linear virtual address space. 20. a method as defined in claim 16 in which said segmented to linear virtual address conversion instruction is to be used in an access operation in connection with a page in the linear virtual address space, said segmented to linear virtual address conversion instruction including access rights information, and further in which each segmented to linear virtual address conversion descriptor includes access rights requirement indicia, the method further including the step of verifying that the access rights information in said segmented to linear virtual address conversion instruction conforms to the access rights requirement indicia. 21. a method as defined in claim 20 in which an exception handler performs selected recovery operations if it is determined that the access rights information in said segmented to linear virtual address conversion instruction does not conform to the access rights requirement indicia in said selected segmented to linear virtual address conversion descriptor. 22. a method as defined in claim 20 in which said access rights information in said segmented to linear virtual address conversion instruction indicates one of a plurality of access privilege levels, and said access rights requirement indicia indicates an access privilege level required for an access operation in connection with the page in the linear virtual address space, the access rights verification step verifying that the access privilege level indicated by said segmented to linear virtual address conversion instruction has a level required by the access privilege level indicated by the selected segmented to linear virtual address conversion descriptor. 23. a method as defined in claim 20, the segmented to linear virtual address conversion instructions being processed in connection with access operations of a plurality of selected access types, the access rights information in each said segmented to linear virtual address conversion instruction indicating the access type for which it is being processed, the access rights requirement indicia of each segmented to linear virtual address conversion descriptor indicating permitted access types for the segment page associated therewith, the access rights verification step verifying that the access rights information of the segmented to linear virtual address conversion instruction being processed indicates an access type which the access rights requirement indicia in the selected segmented to linear virtual address conversion descriptor indicates is permitted. 24. a method as defined in claim 23 in which one of said access types is a storage operation, in which information is to be stored in the page of said linear virtual address space identified by the virtual address generated by said linear virtual address generator, the access rights information in each said segmented to linear virtual address conversion instruction indicating whether the access type is a storage operation and the access rights requirement indicia of each segmented to linear virtual address conversion descriptor indicating whether a storage operation is a permitted access type for the segment page associated therewith. 25. a method as defined in claim 16 in which each segment in said segmented virtual address space is associated with one of a plurality of segment identifiers, each segmented to linear virtual address conversion descriptor includes a segment identifier value corresponding to the segment identifier for the segment comprising the segment page associated with the respective segmented to linear virtual address conversion descriptor, and further in which each segmented virtual address to be converted in response to said segmented to linear virtual address conversion instruction includes a segment identifier value, the method further including the step of verifying that the segment identifier value included in said segmented to linear virtual address conversion instruction corresponds to the segment identifier value included in said segmented to linear virtual address conversion descriptor. 26. a method as defined in claim 25 further including exception handler step in which selected recovery operations are performed if it is determined that the segment identifier value included in said segmented to linear virtual address conversion instruction does not correspond to the segment identifier value included in said segmented to linear virtual address conversion descriptor. 27. a method as defined in claim 16 in which each segmented to linear virtual address conversion descriptor further comprises a length value identifying a length of the segment page associated therewith, and in which each segmented virtual address further includes an offset value identifying an offset into the segment page identified by said segmented virtual address, the method further including the step of verifying that the offset value included in said segmented virtual address is not greater than the length value included in said segmented to linear virtual address conversion descriptor. 28. a method as defined in claim 27 in which an exception handler performs selected recovery operations if it is determined that the offset value included in said segmented virtual address is greater than the length value included in said segmented to linear virtual address conversion descriptor. 29. a method as defined in claim 16 in which each segmented virtual address further includes an offset value identifying an offset into the segment page identified by said segmented virtual address, the offset value being used in generating said virtual address in said linear virtual address space during said virtual address generating step. 30. a method as defined in claim 29 in which said virtual address in said linear virtual address space is generated by concatenating the offset value from the segmented virtual address onto the page identifier of the linear virtual address space from the selected segmented to linear virtual address conversion descriptor. 31. a segmented to linear virtual address conversion computer program product for controlling a processor to facilitate execution of a segmented to linear virtual address conversion instruction to convert a segmented virtual address in a segmented virtual address space to a linear virtual address in a linear virtual address space, the segmented virtual address space comprising a plurality of segments, each segment comprising at least one segment page identified by a segmented page identifier, the linear virtual address space including a plurality of linear pages each identified by a linear page identifier, the processor using a plurality of segmented to linear virtual address conversion descriptors, each associated with a segment page, each segmented to linear virtual address conversion descriptor identifying the page identifier of one of said linear pages, the segmented to linear virtual address conversion instruction identifying a segmented virtual address in said segmented virtual address space, the segmented virtual address identifying one of said segment pages, the segmented to linear virtual address conversion computer program product comprising a computer-readable medium having encoded thereon: a. segmented to linear virtual address conversion descriptor selector code elements for enabling said processor to select one of said segment pages as identified by the segmented to linear virtual address conversion instruction; and b. linear virtual address generator code elements for enabling said processor to use the page identifier of the linear virtual address space from the segmented to linear virtual address conversion descriptor selected in response to processing under control of said segmented to linear virtual address conversion descriptor selector code elements and the segmented virtual address identifier in the segmented to linear virtual address conversion instruction to generate a virtual address in said linear virtual address space. 32. a computer program product as defined in claim 31, the processor being connected to a memory, the memory storing the segmented to linear virtual address conversion descriptors, the computer program product further comprising descriptor retrieval code elements for enabling said processor to retrieve from the memory the segmented to linear virtual conversion descriptor as selected during processing of said segmented to linear virtual address conversion descriptor code elements for use during processing of said linear virtual address generator code elements. 33. a computer program product as defined in claim 32 in which said processor further comprises a cache for caching segmented to linear virtual address conversion descriptors retrieved by said descriptor retrieval element, the segmented to linear virtual address conversion descriptor selector code elements enabling said processor to initially determine whether the cache contains a segmented to linear virtual address conversion descriptor associated with the segment page identified by the segmented to linear virtual address conversion instruction and, if so, select the segmented to linear virtual address conversion descriptor. 34. a computer program product as defined in claim 33 in which said segmented to linear virtual address conversion descriptor selector code elements enable said processor to, if it determines that the cache does not contain a segmented to linear virtual address conversion descriptor associated with the segment page identified by the segmented to linear virtual address conversion instruction, initiate a retrieval operation to retrieve from the memory the segmented to linear virtual conversion descriptor as selected during processing of said segmented to linear virtual address conversion descriptor code elements for use during processing of said linear virtual address generator code elements. 35. a computer program product as defined in claim 31 in which said segmented to linear virtual address conversion instruction is to be used in an access operation in connection with a page in the linear virtual address space, said segmented to linear virtual address conversion instruction including access rights information, and further in which each segmented to linear virtual address conversion descriptor includes access rights requirement indicia, the computer program product further including access rights verification code elements for enabling said processor to verify that the access rights information in said segmented to linear virtual address conversion instruction conforms to the access rights requirement indicia. 36. a computer program product as defined in claim 35 further including an exception handler for enabling said processor to perform selected recovery operations if the processor determines, during processing of said access rights verification code elements, that the access rights information in said segmented to linear virtual address conversion instruction does not conform to the access rights requirement indicia in said selected segmented to linear virtual address conversion descriptor. 37. a computer program product as defined in claim 35 in which said access rights information in said segmented to linear virtual address conversion instruction indicates one of a plurality of access privilege levels, and said access rights requirement indicia indicates an access privilege level required for an access operation in connection with the page in the linear virtual address space, the access rights verification code elements enabling said processor to verify that the access privilege level indicated by said segmented to linear virtual address conversion instruction has a level required by the access privilege level indicated by the selected segmented to linear virtual address conversion descriptor. 38. a computer program product as defined in claim 35, the processor processing segmented to linear virtual address conversion instructions in connection with access operations of a plurality of selected access types, the access rights information in each said segmented to linear virtual address conversion instruction indicating the access type for which it is being processed, the access rights requirement indicia of each segmented to linear virtual address conversion descriptor indicating permitted access types for the segment page associated therewith, the access rights verification code elements enabling said processor to verify that the access rights information of the segmented to linear virtual address conversion instruction being processed indicates an access type which the access rights requirement indicia in the selected segmented to linear virtual address conversion descriptor indicates is permitted. 39. a computer program product as defined in claim 38 in which one of said access types is a storage operation, in which information is to be stored in the page of said linear virtual address space identified by the virtual address generated by said linear virtual address generator, the access rights information in each said segmented to linear virtual address conversion instruction indicating whether the access type is a storage operation and the access rights requirement indicia of each segmented to linear virtual address conversion descriptor indicating whether a storage operation is a permitted access type for the segment page associated therewith. 40. a computer program product as defined in claim 31 in which each segment in said segmented virtual address space is associated with one of a plurality of segment identifiers, each segmented to linear virtual address conversion descriptor includes a segment identifier value corresponding to the segment identifier for the segment comprising the segment page associated with the respective segmented to linear virtual address conversion descriptor, and further in which each segmented virtual address to be converted in response to said segmented to linear virtual address conversion instruction includes a segment identifier value, the computer program product further including segment verification code elements for enabling said processor to verify that the segment identifier value included in said segmented to linear virtual address conversion instruction corresponds to the segment identifier value included in said segmented to linear virtual address conversion descriptor. conversion descriptor. 41. a computer program product as defined in claim 40 further including an exception handler for enabling said processor to perform selected recovery operations if it is determined that the segment identifier value included in said segmented to linear virtual address conversion instruction does not correspond to the segment identifier value included in said segmented to linear virtual address conversion descriptor. 42. a computer program product as defined in claim 31 in which each segmented to linear virtual address conversion descriptor further comprises a length value identifying a length of the segment page associated therewith, and in which each segmented virtual address further includes an offset value identifying an offset into the segment page identified by said segmented virtual address, the computer program product further including length verification code elements for enabling said processor to verify that the offset value included in said segmented virtual address is not greater than the length value included in said segmented to linear virtual address conversion descriptor. 43. a computer program product as defined in claim 42 further including an exception handler for performing selected recovery operations if it is determine that the offset value included in said segmented virtual address is greater than the length value included in said segmented to linear virtual address conversion descriptor. 44. a computer program product as defined in claim 31 in which each segmented virtual address further includes an offset value identifying an offset into the segment page identified by said segmented virtual address, the linear virtual address generator code elements enabling said processor to use the offset value in generating said virtual address in said linear virtual address space. 45. a computer program product as defined in claim 44 in which said linear virtual address generator code elements enable said processor to generates said virtual address in said linear virtual address space by concatenating the offset value from the segmented virtual address onto the page identifier of the linear virtual address space from the selected segmented to linear virtual address conversion descriptor.	field of the invention the invention relates generally to the field of digital computer systems, and more particularly to systems and methods for facilitating the efficient emulation of a segmented virtual address space by a microprocessor that provides a non-segmented, linear virtual address space. background of the invention digital computers process a variety of diverse types of programs, with each program including a series of instructions that enable the computer to perform specific operations in connection with specific elements of data. a variety of types of processors are available for use in digital computer systems, with each type of processor being constructed in accordance with an architecture which describes, inter alia, the set of instructions that a processor constructed in accordance with the architecture is expected to execute, the format(s) of the various instructions, the types and formats of data which may be processed, definitions for various registers that may be used during instruction processing, how information in the computer's memory will be accessed and how a processor constructed in accordance with the architecture is to handle exception conditions which may be detected during instruction processing. it is often desirable to enable one type of processor, as an "emulated processor," to be emulated by another type of processor, as a "host processor." a host processor generally emulates an emulated processor by processing programs which have been written for the emulated processor, to generate an output that effectively corresponds to the output that would be generated by the emulated processor. generally, emulation is accomplished by translating a program generated for execution by an emulated processor (an "original" program) into a program which may be processed by a host processor (a "translated" program). this translation process may include, for example, generating from instructions and other elements of the original program, instructions and other elements which are based on the host processor's architecture thereby to provide the translated program. the translation may be performed by, for example, the host processor itself, by another processor in the same computer system or by another computer system and made available to the host processor which is to process the program, under control of a translation program. in performing the translation, each instruction or sequences or various groups of instructions in the original program (that is, the program based on the emulated processor's architecture) may be translated into one or a series or group of instructions for processing by the host processor. the translation process is typically performed for all or selected portions of an original program when the processor begins processing the original program, although it will be appreciated that an instruction or group of instructions of the original program may be translated as the processing proceeds. in addition, if the emulated processor's data formats are not directly useable by the host processor, the data may be processed to convert it from the emulated processor's formats to formats usable by the host processor. as noted above, an architecture definition includes a description of how a processor constructed in accordance with the architecture accesses information in the computer's memory. to simplify management of the memory for program developers, and to ensure that, when the microprocessors process a plurality of programs concurrently, the programs do not interfere with each other, modern microprocessors and operating systems provide a "context" for each program, with the various contexts defining respective "virtual address spaces." when a program needs to access a storage location in memory, it (the program) will provide a virtual address in the virtual address space to the microprocessor (more typically to a memory management unit which is associated with the microprocessor), which determines the actual physical address of the location in the memory which corresponds to the virtual address in the virtual address space. in addition to performing the virtual to physical address conversion operation, the memory management unit will perform checking operations to verify that the program can perform the requested accessing operation in connection with the location. in some microprocessors, illustratively those of intel corporation's x86 family of microprocessors, which currently includes its 8086, 8088, 80286, 80386, 80486 and "pentium" lines of microprocessors, the virtual address space is segmented, that is, an address provided by a program defines one of a plurality of segments, with the various segments occupying various regions of a single "segmented" virtual address space. although a single virtual address space is provided, only the virtual addresses that represent locations in the various segments can be accessed. in other microprocessors, the virtual address space is not segmented, but instead any address may represent a location in the virtual address space. a problem arises if it is desired to enable a microprocessor which provides for a non-segmented "linear" virtual address space to emulate a microprocessor, such as intel's x86 family, which provides for a segmented virtual address space, since the microprocessors do not handle memory management in a similar manner. summary of the invention the invention provides a new and improved system and method for facilitating the efficient emulation of a segmented virtual address space by a microprocessor that provides a linear virtual address space. in brief summary, the invention provides a processor that processes a single segmented to linear virtual address conversion instruction to convert segmented virtual addresses in a "segmented" virtual address space to a linear virtual address in a "linear" virtual address space. the segmented virtual address space comprises a plurality of segments each identified by a segment identifier, each segment comprising at least one page identified by a page identifier. the linear virtual address space includes a plurality of pages each identified by a page identifier. in processing the segmented to linear virtual address conversion instruction, the processor uses a plurality of segmented to linear virtual address conversion descriptors, each associated with a page in the segmented virtual address space, each segmented to linear virtual address conversion descriptor identifying the page identifier of one of the pages in the linear virtual address space. the segmented to linear virtual address conversion instruction includes a segmented virtual address identifier in the segmented virtual address space. in processing the segmented to linear virtual address conversion instruction, the processor uses the segmented virtual address identifier in the segmented to linear virtual address conversion instruction to select one of the segmented to linear virtual address conversion descriptors. after selecting a segmented to linear virtual address conversion descriptor, the processor uses the page identifier of the linear virtual address space from the selected segmented to linear virtual address conversion descriptor and the segmented virtual address identifier in the segmented to linear virtual address conversion instruction in generating a virtual address in the linear virtual address space. thus, by processing the single segmented to linear virtual address conversion instruction, the processor can generate a virtual address in the linear virtual address space from a virtual address in the segmented virtual address space. brief description of the drawings this invention is pointed out with particularity in the appended claims. the above and further advantages of this invention may be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which: fig. 1 is a functional block diagram depicting a digital computer system including a segmented virtual address emulator constructed in accordance with the invention; fig. 2 is a diagram that is useful in understanding operations performed by microprocessors of a selected architecture (namely, intel's x86 family of microprocessors) in generating a segmented virtual address, which is useful in understanding the invention; fig. 3 is a functional block diagram of a segmented virtual address emulator, constructed in accordance with the invention, for converting segmented virtual addresses to linear virtual addresses, which is useful in the digital computer system depicted in fig. 1; fig. 4 is a diagram illustrating the structure of a number of the registers useful in the segmented virtual address emulator depicted in fig. 1; and fig. 5 and 5a-e are a flow diagram that depicts operations performed by the segmented virtual address emulator in converting segmented virtual addresses to linear virtual addresses. detailed description of an illustrative embodiment fig. 1 is a functional block diagram of a digital computer system 10 including a segmented virtual address emulator 50 constructed in accordance with the invention. with reference to fig. 1, the digital computer system 10 includes a microprocessor 11 which communicates with a memory subsystem 12 and one or more input/output subsystems generally identified by reference numeral 13 through a memory management unit 14. the memory subsystem 12 includes a number of physical addressable storage locations in which data and instructions (which will be referred to collectively herein as "information") to be processed by the microprocessor 11 may be stored. in addition, the microprocessor 11, after processing data, may transfer the processed data to the memory subsystem 12 for storage. the digital computer system 10 may include a number of diverse types of input/output subsystems 13, including mass storage subsystems, operator input and output subsystems, network ports and the like. the mass storage subsystems generally provide long-term storage for information which may be processed by the microprocessor 11. the mass storage subsystems may include such devices as disk or tape subsystems, optical disk storage devices and cd-rom devices in which information may be stored and/or from which information may be retrieved. one or more of the mass storage subsystems may utilize removable storage media which may be removed and installed by an operator, which may allow the operator to load programs and data into the digital computer system 10 and obtain processed data therefrom. under control of control information provided thereto by the microprocessor 11, information stored in the mass storage subsystems may be transferred to the memory subsystem 12 for storage. after the information is stored in the memory subsystem 12, the microprocessor 11 may retrieve it from the memory subsystem 12 for processing. after the processed data is generated, the microprocessor 11 may also enable the mass storage subsystems to retrieve the processed data from the memory subsystem 12 for relatively long-term storage. the operator input and output subsystems generally provide an operator interface to the digital computer system 10. in particular, the operator input subsystems may include, for example, keyboard and mouse devices, which an operator may use to interactively input information to the digital computer system 10 for processing. in addition, the operator input subsystems may provide mechanisms whereby the operator may control the digital computer system 10. the operator output subsystems may include devices such as video display devices, through which the digital computer system 10, under control of the microprocessor 11, displays results of processing to the operator. in addition, a printer may be provided to provide a hardcopy output for the operator. the network ports may enable the digital computer system 10 to connect to a communication link, thereby connecting the computer system 10 in a computer network. the network ports enable the computer system 10 to transmit information (including both program instructions and data) to, and receive information from, other computer systems and other devices in the network (not shown). in a typical network organized according to, for example, the client-server paradigm, certain computer systems in the network are designated as servers, which store information for processing by the other, client computer systems, thereby to enable the client computer systems to conveniently share the information. a client computer system which needs access to information maintained by a particular server will enable the server to download the information to it over the network. after processing the data, the client computer system may also return the processed data to the server for storage. in addition to computer systems (including the above-described servers and clients), a network may also include, for example, printers and facsimile devices, digital audio or video storage and distribution devices, and the like, which may be shared among the various computer systems connected in the network. the communication links interconnecting the computer systems in the network may, as is conventional, comprise any convenient information-carrying medium, including wires, optical fibers or other media for carrying signals among the computer systems. computer systems transfer information over the network by means of messages transferred over the communication links, with each message including information and an identifier identifying the device to receive the message. as is conventional, each of the input/output subsystems 13 will typically include registers and other data storage elements (not shown) which store control, status and other information which are used to control the operations performed by the respective input/output subsystem 13 and to indicate its operational status. the microprocessor 11 may store information in the registers and other data storage elements, thereby to control the respective input/output subsystem 13, in a manner similar to the manner in which it stores information in the memory subsystem 12. similarly, the microprocessor 11 may retrieve the information contained in the input/output subsystem 13, in a manner similar to the manner in which it retrieves information in the memory subsystem 12, to ascertain the operational status of the respective input/output subsystem 13. the memory management unit 14 performs a number of operations. in particular, the memory management unit 14 typically includes a memory cache, which caches information requested by the microprocessor 11 from the memory subsystem 12. in addition, as is typical, when the microprocessor 11 requests information to be retrieved from, for example, the memory subsystem 12, or provides processed data for storage in, for example, the memory subsystem 12, the microprocessor 11 will provide an address in a virtual address space to the memory management unit 14. the various application programs processed by the microprocessor 11 may be provided with respective virtual address spaces. the virtual address space is divided into "pages," each of which comprises a selected number of virtual addressable storage locations, with each virtual addressable storage location storing information. the pages of an application program's virtual address space are normally stored on a mass storage subsystem, and the microprocessor 11 enables individual ones of the pages to be copied to the memory subsystem 12 as they are needed during processing, and for those pages that are modified during processing the microprocessor 11 may enable them to be copied to the mass storage subsystem for long-term storage. respective pages of a virtual address space may be compactly stored in physical locations in the memory subsystem 12, which are identified by physical addresses, and in performing an access operation in connection with a particular virtual address space location (that is, a retrieval of information from or a storage of information in a particular physical location) in response to a request from the microprocessor 11, the memory management unit 14 will perform a translation of the virtual address to obtain the physical address for use in performing the access operation in connection with the memory subsystem 12. in addition, the memory management unit 14 may perform several checking operations, including checking to determine whether or not the page is in the memory subsystem 12, whether or not the application program has permission to access (that is, read data from or write data into) the page, and whether or not the requested page is a valid page in the virtual address space, and the like. if the memory management unit 14 makes a negative determination in the checking operation, that is, if it determines, for example, that the page is not in the memory subsystem 12, that the application program does not have the appropriate access permission, or if it determines that the requested page of the virtual address space page is not a valid page in the application program's virtual address space, it may generate an access fault indication, which the microprocessor 11 may receive and use in performing selected fault handling operations. in one embodiment, a microprocessor 11 useful in system 10 comprises a microprocessor constructed in accordance with the sparc version 9 architecture described in the sparc international, inc �david l. weaver and tom germond (eds)!, the sparc architecture manual version 9 (prentice-hall, 1994) (hereinafter referred to as "the sparc architecture manual, version 9"). the microprocessor 11 generally includes a number of elements, including a register set 20, one or more functional units 21, a bus interface 22 and a control circuit 23. the control circuit 23 controls the processing operations as performed by the microprocessor 11 under control of instructions provided by a program. generally, under control of the control circuit 23, the bus interface 22, cooperating with the memory management unit 14, retrieves instructions and data from the memory subsystem 12 or data storage elements maintained by particular input/output subsystems 13 for processing and loads the retrieved data into registers in the register set 20. also under control of the control circuit 23, the functional units 21 perform logical, integer and floating point arithmetic, and other processing operations in connection with data which the control circuit 23 enables to be transferred thereto from the register set 20, to generate processed data which will be transferred to the register set 20 for storage. the control circuit 23 may also enable the bus interface 22, also cooperating with the memory management unit 14, to transfer processed data from the register set 20 to the memory subsystem 12 or data storage elements maintained by particular input/output subsystems 13 for storage. in addition, in accordance with the invention, one of the functional units 21 provided by the microprocessor 11, namely a segmented virtual address emulator 50, processes a segmented to linear virtual address conversion instruction which may be provided by a program to convert virtual addresses in a segmented virtual address architecture to virtual addresses in a linear virtual address architecture, as will be described below. the segmented virtual address emulator 50, in one embodiment, facilitates the efficient emulation of programs associated with a segmented virtual address space, such as the segmented virtual address space provided by microprocessors comprising intel corporation's x86 family of microprocessors (which currently include intel's 8086, 8088, 80286, 80386, 80486 and "pentium" lines of microprocessors), which emulation is performed by a microprocessor, such as microprocessor 11, which uses a non-segmented, or "linear," virtual address space. the segmented virtual address space emulation, in turn, assists in facilitating the efficient emulation of programs that are written for microprocessors of the x86 family by microprocessor 11. the microprocessor 11 which features the linear virtual address space architecture will be referred to herein as the "host" microprocessor 11, and the microprocessor which features the segmented virtual address space architecture will be referred to herein as the "emulated" microprocessor. similarly, program(s) written for the emulated microprocessor will be referred to herein as "original program(s)" and program(s) generated for processing by the host microprocessor in emulation of the original program(s) will be referred to herein as "translated program(s)." before proceeding further, it would be helpful to generally describe an arrangement for transforming an address in a illustrative segmented virtual address space to a physical address used accessing memory. the arrangement to be described, which is generally depicted in fig. 2, is used in connection with programs to be processed by microprocessors which are constructed in accordance with the x86 architecture. with reference to fig. 2, a segmented virtual address space is formed from a number of segments, each of which is associated with a segment register 30(0) through 30(m) (generally identified by reference numeral 30(m)) in segment registers 30. in the x86 architecture, for example, there are six segments (that is, m=5), including a code segment which may typically be used for storing program instruction code, a data segment which may typically be used for storing program data, a stack segment which may typically be used for storing stack(s) used by the application program, and three extra segments ("es," "fs" and "gs") that an application program may use for other purposes, such as storing arrays or temporary data structures. in that architecture, each segment register 30(m) will be associated with a particular one of the segments, and will contain a descriptor pointer for the particular segment; thus, segment register 30(0) may contain a descriptor pointer for the code segment, segment register 30(1) may contain a descriptor pointer for the data segment, segment register 30(2) may contain a descriptor pointer for the stack segment, and other segment registers 30(3) through 30(m) will contain descriptor pointers for other segments. each segment register 30(m) contains a pointer that identifies one of a plurality of segment descriptors 31(0) through 31 (n) (generally identified by reference numeral 31(n)) in a segment descriptor table 31. each segment descriptor 31(n) in the segment descriptor table 31 generally includes three fields, including an access rights field 32(n), a segment length field 33(n) and a segment base address field 34(n). the access rights field 32(n) contains access rights information, whose use will be described below. the segment base address field 34(n) contains a segment base virtual address and the segment length field 33(n) contains a segment length value, both of which serve to define a particular segment in the segmented virtual address space. the descriptors 31(n) in the respective segment descriptor tables 31 are preferably maintained by the operating system (not shown), and the particular descriptor pointer value which is maintained in each of the segment registers 30(m) is also preferably controlled by the operating system. when a memory access operation is initiated, an address will be provided which has a structure depicted in fig. 2, which the elements depicted on fig. 2 will use to convert to a segmented virtual address and, from the segmented virtual address, to a physical address for accessing the memory. as shown in fig. 2, the address (illustratively shown in an address register 35) includes a segment identifier portion 36 and an offset portion 37. the segment identifier portion 36 identifies the particular segment referred to by the address and the offset portion 37 contains an offset value into the segment. the segment identifier portion 36 is used to select a particular segment register 30(m) (as represented by arrow 40), whose contents are used as a descriptor pointer to, in turn, select the particular segment descriptor 31(n) (as represented by arrow 41) to be used in generating the segmented virtual address. the base address from the segment base address field 34(n) of the selected descriptor 31(n) is coupled to an adder 42 and the segment length value from the segment length field 33(n) is coupled to one input of a comparator 43. the address's offset portion 37 represents an offset from the segment's base into the segment to be used in the memory access operation, and so it (the offset portion 37), along with the segment base address value from segment base address field 34(n), are coupled to respective inputs of adder 42. the adder 42 generates a value corresponding to the sum of the offset and the segment base address value, which corresponds to the segmented virtual address seg virt adrs which identifies the location in the segmented virtual address space represented by the address in register 35. the segmented virtual address is then coupled to a virtual address translator 44, which translates the segmented virtual address to a physical address in a conventional manner. to verify that the segmented virtual address does not represent an address that is beyond the end of the segment, as defined by the segment length value in field 33(n) of the segment descriptor 31(n), it (the segment length value from field 33(n)) and the offset portion 37 are coupled to respective inputs of the comparator 43. the comparator 43, in turn, compares the offset value from the offset portion 37 to the segment length value from segment length field 33(n). if the comparator 43 determines that the offset value from the offset portion 37 is less than or equal to the segment length value from segment length field 33(n), the segmented virtual address generated by adder 42 represents a location in the segmented virtual address space that is within the segment defined by the selected descriptor 31 (n)(m). on the other hand, if the comparator 43 determines that the offset value from the offset portion 37 is greater than the segment length value from segment length field 33(n), the segmented virtual address generated by adder 42 represents a location that is beyond the end of the segment defined by the selected descriptor 31 (n)(m); in that case, the comparator 43 generates a seg len viol segment length violation indication, which may result in, for example, a segment length violation exception and a trap to the operating system for processing. as described above, each segment descriptor also includes an access rights field 32(n). the access rights field 32(n) generally contains access rights information which is useful in controlling memory accesses. if the access operation initiated by the application program is within the access rights indicated by the access rights field 32(n), the access operation can proceed. on the other hand, if the access operation is not within the access rights indicated by the access rights field 32(n), the access operation will not proceed, which may result in an access rights violation exception and a trap to the operating system for processing. in the x86 architecture, access rights may be used to control whether a particular segment can be accessed by an application program or only by the operating system, and whether or not an application program can store information in storage locations in particular segments, which may facilitate read-only access to a file or portions of a file by a particular application program. in addition, the access rights can be used to indicate that particular segments are "execute only," which may indicate that such segments contain program code which an application program may only retrieve and execute. as noted above, the invention provides a segmented virtual address emulator 50 as one of the functional units 20 to process a segmented to linear virtual address conversion instruction to facilitate the efficient emulation of a segmented virtual address space by a microprocessor which uses a nonsegmented, or "linear," virtual address space. a segmented virtual address emulator 50 in accordance with the invention is shown, in block diagram form, in fig. 3. with reference to fig. 3, the segmented virtual address emulator 50 includes a cache 51, a control register 52, a control circuit 53, and comparators 54 and 55 and 58. in one embodiment, the segmented virtual addresses correspond to the x86 segmented virtual addresses as described above in connection with fig. 2, in particular the virtual addresses that are generated by adder 42 (fig. 2). in that same embodiment, the linear virtual addresses correspond to addresses in the linear virtual address space that the microprocessor provides to the memory management unit 14 (fig. 1). in processing the segmented to linear virtual address conversion instructions, the segmented virtual address emulator 50 will use segmented to linear virtual address space conversion information in a store 59 in memory subsystem 12 (fig. 1) both segmented to linear virtual address conversion instructions and segmented to linear virtual address space conversion information may be generated during the translation of a original program for execution by an emulated microprocessor into a translated program for execution by host microprocessor 11, or during processing of the translated program, as will generally be described below. before proceeding further, it would be helpful to describe the structure of a segmented to linear virtual address conversion instruction, the cache 51, control register 52 and control circuit 53. a segmented to linear virtual address conversion instruction is represented in fig. 3 being as provided to the segmented virtual address emulator 50 in a register identified by reference numeral 110. a segmented to linear virtual address conversion instruction includes a number of fields, including an instruction identifier field 11 1, a segmented virtual address input register identifier field 112, a linear virtual address register output register identifier field 113, a segment register number field 114, and two flags, namely, a privileged flag 1 15 and a write enable flag 116. the instruction identifier field 111 contains a value that corresponds to the instruction operation code, which identifies the instruction as a segmented to linear address conversion instruction. the segmented virtual address input register identifier field 112 identifies one of the registers in register set 20 as a segmented virtual address input register 56, which contains a segmented virtual address. the linear virtual address output register identifier field 113 identifies one of the registers in register set 20 as a linear virtual address output register 57, into which the segmented virtual address emulator 50 is to store the linear virtual address. generally, any of the registers in register set 20 may be selected as the segmented virtual address input register 56 and linear virtual address output register 57. the segment register number field 114 of the instruction in register 110 contains a segment number, which identifies the segment for which the segmented virtual address in register 56 was generated. the privileged and write flags 115 and 116 in the instruction in register 110 contain access control information used in determining whether the location represented by the segmented virtual address in register 56 can be accessed. the privileged flag 115 indicates whether the segmented to linear virtual address conversion operation initiated by the instruction in register 110 is part of a storage operation initiated by an application program or the operating system being emulated by microprocessor 11, that is, by an application program written for the x86 microprocessor family, and the operating system for which the application program was written, which is also a program written for the x86 microprocessor family, both of which are emulated by the microprocessor 11. the write flag 115 indicates whether the segmented to linear virtual address conversion operation initiated by the instruction in register 110 is part of a storage operation, in which information is to be stored in the location represented by the segmented virtual address in segmented virtual address input register 56. the cache 51 caches segmented to linear virtual address space conversion information from store 59 that is useful in processing the segmented to linear virtual address conversion instructions. the cache 51 includes a number of cache entries 51(0) through 51(n) (generally identified by reference numeral 51(n)), each of which contains an item of segmented to linear virtual address space conversion information from store 59 useful in converting a segmented virtual address for a particular page of the segmented virtual address space to a linear virtual address for a page of the linear virtual address space. each entry 51(n) includes a number of fields, including a segmented virtual address tag field 60(n), a context identifier field 61(n), a segment register number field 62(n), a linear virtual address (low order) field 63(n), and a segmented virtual address page length register 64(n). the cache 51 essentially forms an associative memory, with entries 51(n) being used based on a comparison between a portion of the segmented virtual address stored in the segmented virtual address input register 56, in particular a segmented virtual address space page identifier portion in a field 56(p) of segmented virtual address input register 56, and the contents of the segmented virtual address tag fields 60(n) of the entries 51(n) of cache 51. as with the linear virtual address as described above, the segmented virtual address space is also divided into pages, and the page identifier portion in field 56(p) identifies the segmented virtual address space page for the virtual address in the register 56. if the contents of the segmented virtual address tag field 60(n) of an entry 51(n) correspond to the segmented virtual address space page identifier in field 56(p), the entry 51(n) is selected for use in processing the segmented to linear virtual address conversion instruction. on the other hand, if the segmented virtual address space page identifier in field 56(p) of segmented virtual address input register 56 does not correspond to the contents of the segmented virtual address tag field 60(n) of any cache entry 51(n), a "cache miss" condition exists, in response to which the control circuit 53 may enable other components of the microprocessor 11 to retrieve appropriate information to update the cache 51. operations performed in connection with updating the cache 51 will be described generally below. the context identifier field 61(n) of cache entry 51(n) contains a context identifier indicating a context for which the segmented to linear virtual address conversion information in the entry 51(n) is valid. the various emulated x86 programs may be assigned various segmented virtual address spaces by the microprocessor 11, which, in turn, are assigned respective context identifier values. the context associated with the x86 program currently being emulated by the microprocessor 11 is stored in control register 52. in processing a segmented to linear virtual address conversion instruction, the contents of the context identifier field 61(n) of the selected entry 51(n) (that is, the entry 51(n) for which the contents of the segmented virtual address tag field 60(n) of an entry 51(n) correspond to the segmented virtual address space page identifier portion in field 56(p) of segmented virtual address input register 56) are compared to the current context as identified by control register 52 by comparator 54. if the comparator 54 determines that the context identifier in field 61(n) of the selected entry correspond to the current context identifier stored in the control register 52, the segmented to linear virtual address space conversion information stored in the entry 51(n) will be used in processing the segmented to linear virtual address conversion instruction. on the other hand, if the contents of the context identifier field 61(n) do not identify the current context, the segmented to linear virtual address space conversion information stored in the entry 51(n) is not correct for segmented virtual address space for the x86 program that the microprocessor 11 is currently emulating. in that case, the comparator 54 will indicate an acc exc access exception condition, in response to which the control circuit 53 may enable other components of the microprocessor 11 to retrieve appropriate information for the segmented virtual address space for the x86 program that the microprocessor is currently emulating from store 59 to update the cache 51. the segment register number field 62(n) contains a value which identifies the segment for the segmented virtual address page identifier in field 60(n). in processing a segmented to linear virtual address conversion instruction, the segment register number value from the segment register number field 114 from the instruction and the segment register number value from field 62(n) of the selected entry 51(n) are compared by comparator 58. if the comparator 58 determines that the segment register number values from fields 114 and 62(n) are the same, then the contents of the selected entry 51(n) were generated for the same segment as called for in the segmented to linear virtual address conversion instruction. on the other hand, if the comparator 58 determines that the segment register number values from fields 114 and 62(n) are not the same, then the contents of the selected entry 51(n) were not generated for the same segment as called for in the segmented to linear virtual address conversion instruction, and so the comparator 58 generates a segment register number exception indication, which may be received by the control circuit 53 and processed as described below. as noted above, each cache entry 51(n) further includes a segmented virtual address page length field 64(n). typically, pages of a virtual address space will all be of uniform size, but in a segmented virtual address space such as that defined by segmented virtual addresses which may be loaded register 56, portions of a page, illustratively the last page of a segment, may not be completely filled. for example, if a segment defined by a segment descriptor 31(n) has a segment length as defined in field 33(n) of the descriptor, and if the segment begins at the beginning of a page of the virtual address in the segmented virtual address space, then the last page will only define a number of locations corresponding to the remainder in the quotient of the segment length divided by the size of the segmented virtual address page. the segmented virtual address page length field 64(n) of the selected entry 51(n) identifies the number of locations in the segmented virtual address page. to verify that the segmented virtual address in register 56 does not identify a location beyond the end of a page, the contents of the segmented virtual address page length field 64(n) and a page offset portion in a field 56(o) of the segmented virtual address register 56 are coupled to comparator 55. if the comparator 55 determines that the contents of the segmented virtual address page offset in field 56(o) are greater than the segmented virtual address page length field 64(n), the segment virtual address input register 56 identifies a location beyond the segmented virtual address space, in which case it generates a page len viol page length violation indication, which the control circuit 53 can use as described below. on the other hand, if the comparator 55 determines that the contents of the segmented virtual address page offset in field 56(o) are less than or equal to the segmented virtual address page length field 64(n), the segment virtual address input register 56 identifies a valid location in the segmented virtual address space. in that case, if, as is the case in one embodiment, the pages in the linear virtual address space are the same size as the pages of the segmented virtual address space, the contents of the segmented virtual address page offset field 56(o) of register 56 can be used in processing the segmented to linear virtual address space conversion instruction. in one embodiment, in which the page structure of the segmented virtual address space is similar to the page structure of the linear virtual address space, the segmented virtual address page offset from field 56(o) may be copied to a linear virtual address page offset field 57(0) of register 57. in addition, each entry 51(n) includes two flags, namely, a privileged flag 65(n) and a write flag 66(n). the flags 65(n) and 66(n) of the selected cache entry 51(n) are coupled to the control circuit 53 and are used along with the privileged and write flags 115 and 116 of the instruction 110 to determine whether the conversion operation can proceed. in particular, the privileged flag 65(n) indicates whether the page of the segmented virtual address space that is represented by the contents of the entry 51(n) can be accessed by an application program (that is, an x86 application program being emulated by the microprocessor 11) or only by the operating system (that is, the x86 operating system for the x86 application program being emulated by the microprocessor 11). if the privileged flag 65(n) in the selected cache entry 51(n) is clear, indicating that the segmented virtual address space page associated with the entry 51(n) may be accessed by an x86 application program being emulated by the microprocessor 11, the segmented virtual address emulator 50 can perform the segmented to linear virtual address conversion operation initiated by the instruction in instruction register 110 regardless of the condition of the privileged flag 115 in the instruction. on the other hand, if the privileged flag 65(n) in the selected cache entry 51(n) is set, indicating that the segmented virtual address space page associated with the entry 51(n) may only be accessed by the x86 operating system being emulated by the microprocessor 11, the segmented virtual address emulator 50 can perform the segmented to linear virtual address conversion operation initiated by the instruction in instruction register 110 only if the privileged flag 115 in the instruction is also set. the write flag 66(n) indicates whether the page of the segmented virtual address space that is represented by the contents of the entry 51(n) can be written by an x86 program being emulated by the microprocessor 11. if the write flag 66(n) in the selected cache entry 51(n) is set, indicating that the segmented virtual address space page associated with the entry 51(n) may be written by an x86 application program being emulated by the microprocessor 11, the segmented virtual address emulator 50 can perform the segmented to linear virtual address conversion operation initiated by the instruction in instruction register 110 regardless of the condition of the write flag 116 in the instruction. on the other hand, if the write flag 66(n) in the selected cache entry 51(n) is clear, indicating that the segmented virtual address space page associated with the entry 51(n) may not be written by the x86 program being emulated by the microprocessor 11, the segmented virtual address emulator 50 can perform the segmented to linear virtual address conversion operation initiated by the instruction in instruction register 110 only if the write flag 116 in the instruction is also clear. the control register 52 includes a number of fields, including a context identifier field 70 and a linear virtual address (high order) field 71, and an enable flag 72. the context identifier field 70 contains the context identifier which identifies the current context for the x86 program being processed by the microprocessor 11. the current context identifier from the context identifier field 70 are coupled, along with the context identifier the selected entry 51(n) of the cache 51 to respective inputs of comparator 54 which, as described above, compares the contents of the entry's context identifier field 61(n) and the current context identifier in the context identifier field 70 to determine whether an acc exc access exception condition exists. as noted above, the control register 52 also includes a linear virtual address (high order) field 71. in one embodiment, for each context, the high-order portion of the linear virtual addresses associated with a context which may be converted by the segmented virtual address emulator 50 does not vary, and to save space in the cache 51, the invariant high-order portion is stored in the control register 52. during processing of a segmented to linear virtual address conversion instruction, the high-order portion is copied from the linear virtual address (high order) field 71 to a high-order linear virtual address page field 57(hp) of the linear virtual address output register 57. finally, as noted above, the control register 52 includes an enable flag 72. the enable flag 72 may be controlled by the microprocessor 11 to, in turn, control the operation of the segmented virtual address emulator 50. if the enable flag 72 is set, the control circuit 53 is enabled to control the other components of the segmented virtual address emulator 50 to, in turn, process the segmented to linear virtual address conversion instructions issued to the segmented virtual address emulator 50. on the other hand, while the enable flag 72 is clear, the control circuit 53 is disabled from processing segmented to linear virtual address conversion instructions issued to the segmented virtual address emulator 50. the control circuit 53 controls the operations of the various components of the segmented virtual address emulator 50. the control circuit 53 includes a number of registers, which are depicted in fig. 4. with reference to fig. 4, the control circuit 53 includes a cache size register 80 a cache entry data input register 81 and a cache entry index register 82, all of which are useful in connection with loading of information into the various entries 51(n) in the cache 51. the cache size register 80 contains a "last cache entry" value which identifies the number of cache entries 51(n) in the cache 51. the control circuit 53 may use the cache size value in cache size register 80 if the microprocessor control circuit 23 enables it (the control circuit 53) to load information into an entry 51(n), to verify that an entry exists to receive the information is to be loaded. the cache entry data input register 81 includes a number of fields 90 through 96 which correspond to respective fields 60(n) through 66(n) of cache entries 51(n). in one embodiment, the contents of entries 51(n) of cache 51 may be updated using two arrangements. in one arrangement, the microprocessor control circuit 23 may provide the information to be loaded in a specific entry 51(n) to the cache entry data input register 81 and an entry identifier identifying the entry 51(n) into which the information is to be loaded; thereafter, the microprocessor control circuit 23 will enable the cache control circuit 53 to (i) use the cache size register 80 to verify that an entry 51(n) exists which corresponds to the entry identifier, and (ii) if so, load the information from the cache entry data input register 81 into the specified entry 51(n). in a second arrangement, the microprocessor control circuit 23 will also provide the information to be loaded in an entry 51(n) to the cache entry data input register 81; thereafter, the microprocessor control circuit 23 will enable the cache control circuit 53 to select a cache entry 51(n) into which the information is to be loaded, using any selected cache replacement methodology, and load the information into the selected cache entry 51(n). suitable cache replacement methodologies are well known in the art and will not be described herein. for either arrangement, when the control circuit 53 loads information into a cache entry 51(n), it also loads a pointer to the entry 51(n) in the cache entry index register 82; thus, the cache entry index register 82 contains a value that identifies the last entry 51(n) into which information was stored. the control circuit 53 also includes several registers which are used in connection with exception status information, including an exception status register 83, cache entry access register 84, and a fault address register 85. if an exception condition exists in connection with processing of a segmented to linear virtual address conversion instruction, the control circuit 53 loads an exception identifier identifying the type of exception into the exception status register 83. a number of exception conditions may exist, including in one embodiment: (i) an access exception, as described above, in which the comparator 54 determines that context identifier in the field 61(n) of the selected cache entry 51(n) differs from the context identifier in field 70 of the control register 70; (ii) a privilege violation exception, which may occur if the control circuit 53 determines that the privileged flag 65(n) of the selected cache entry 51(n) is set and the privilege flag 115 in the instruction in instruction register 110 is clear; (iii) a write violation exception, which may occur if the control circuit 53 determines that the write flag 66(n) of the selected cache entry 51(n) is clear and the write flag 116 in the instruction in instruction register 110 is set; (iv) a segment register number exception, in which the comparator 58 determines that the segment register number values in fields 62(n) and 114 in the selected cache entry 51(n) and instruction register 110 differ; and (v) a page length violation, in which the comparator 55 determines that the segment page offset in field 56(o) of the segmented virtual address input register 56 is greater than the segment virtual address page length field 64(n) of the selected cache entry 51(n). several types of exceptions may represent fatal errors in connection with processing of the program which issued the segmented to linear virtual address conversion instruction, which may lead to the microprocessor terminating processing of the program. however, if the exception is an access exception (item (i) above), the control circuit 53 can enable the microprocessor control circuit 23 to, in turn, enable a cache entry 51(n) to be loaded with appropriate information for the correct context, as described above. to enable the microprocessor control circuit 23 to initiate loading of the cache entry, the control circuit 53 stores information in the access exception register 84 and access exception segment virtual address register 85. in particular, the control circuit 53 loads (i) the contents of the segmented virtual address tag field 60(n) of the entry 51(n) selected during processing of the segmented to linear virtual address conversion instruction into a field 100, which serves to identify the entry 51(n) which gave rise to the access exception; (ii) the context identifier from the context identifier field 70 of the control register 70 into a field 101, which identifies the current context, which permits verification that the update information selected to be loaded into the entry 51(n) is for the correct context; and (iii) the privileged and write flags 115 and 116 and segment register number from field 114 of the segmented to linear virtual address conversion instruction into fields 102 through 104, which also permits verification that the update information selected to be loaded into the entry 51(n) have the proper information for processing of the instruction. with this background, the operations performed by the control circuit 53 in connection with processing of a segmented to linear virtual address conversion instruction will be described in connection with fig. 5. preliminarily, if the address to be converted has a form is in the form of an address similar to that described above in connection with fig. 2, including a segment identifier portion 36 and an offset portion 37, the microprocessor 11 performs operations described above in connection with fig. 2 to generate a segmented virtual address (corresponding to the output of adder 42) and store it in a register in register set 20 which will later be used as the segmented virtual address input register for the segmented to linear virtual address conversion instruction (step 150). generally, the operations performed during step 150 to generate a segmented virtual address will be performed using other functional units 21, such as adders and the like. thereafter, the microprocessor 11 will retrieve the segmented to linear virtual address conversion instruction, which it stores in register 110 (step 151). after receiving the instruction in register 110, if the enable flag 72 is set (step 160), the control circuit 53 determines whether an entry 51(n) in the cache 51 has a segmented virtual address tag field 60(n) corresponding to the contents of the segmented virtual address page identifier field 56(p) of the segmented virtual address input register 56 identified in the instruction in register 110 (step 161). if the control circuit 53 makes a positive determination in step 161, it selects the entry 51(n) which has a segmented virtual address tag field 60(n) corresponding to the contents of the segmented virtual address page identifier field 56(p) of register 56, which it couples to other components of the segmented virtual address emulator 50 (step 162). in particular, the control circuit 53 enables (i) the context identifiers from the context identifier field 61(n) of the selected entry 51(n) and context identifier field 70 of the control register 52 to be coupled to comparator 54 (step 163a), (ii) the segment register number values from segment register number field 62(n) of the selected entry 51(n) and segment register number field 114 of instruction register 110 to comparator 58 (step 163b), and (iii) the segmented virtual address page limit value from field 64(n) of the selected entry and the segment virtual address page offset value from field 56(o) of the segmented virtual address input register 56 to comparator 55 (step 163c). in addition, the control circuit 53 receives the privileged and write flags from fields 65(n) and 66(n) of the selected entry for comparison with the corresponding flags 115 and 116 of the segmented to linear virtual address conversion instruction in instruction register 110 (step 163d). as described above, if (i) the comparator 55 determines in step 163a that the context identifiers from the context identifier field 61(n) of the selected entry 51(n) and context identifier field 70 of the control register 52 have the same value, it does not generate the acc exc access exception indication, (ii) the comparator 58 determines in step 163b that the segment register number values from segment register number field 62(n) of the selected entry 51(n) and segment register number field 114 of instruction register 110 have the same value, it does not generate the srn exc segment register number exception indication, (iii) the comparator 55 determines in step 163c that the segmented virtual address page limit value from field 64(n) of the selected entry 51(n) is greater than or equal to the segment virtual address page offset value from field 56(o) of the segmented virtual address input register 56, it does not generate the page len viol page length violation exception indication, and (iv) the control circuit 53 determines in step 163d that the conditions of the privileged and write flags from fields 65(n) and 66(n) of the selected entry correspond appropriately to the conditions of flags 115 and 116 of the segmented to linear virtual address conversion instruction in instruction register 110, the control circuit 53 enables (a) the contents of the high order portion of the linear virtual address page address in field 71 of the control register 52 to be stored in field 57(hp) of the linear virtual address output register 57 (step 164a), (b) the contents of the low order portion of the linear virtual address page address in field 63(n) of the selected entry to be stored in field 57(lp) of the linear virtual address output register 57 (step 164b), and (c) the contents of the segmented virtual address page offset value to be copied from field 56(o) of the segmented virtual address input register 56 to be stored in linear virtual address page offset field 57(o) of linear virtual address out register 57 (step 164c). following step 164c, the control circuit 53 can return control to the microprocessor's control circuit 23 (step 165). returning to step 163a, the control circuit 53 determines in that step that the comparator 54 generated an access exception indicating that context identifiers from the context identifier field 61(n) of the selected entry 51(n) and context identifier field 70 of the control register 52 have the different values, it will sequence to step 170 to load the appropriate information in registers 83 through 85 (step 170) and enable the microprocessor's control circuit 23 to process the access exception. in processing the access exception, the microprocessor 11 may either obtain the appropriate conversion information for the segmented virtual address in register 56 from memory 12 or in the alternative it may generate the information, and provide the information to the segmented virtual address emulator 50 for storage in an entry 51(n) of cache 51 (step 171). thereafter, the control circuit 53 will perform the segmented to linear virtual address conversion operation as described above (steps 161 through 166). returning to steps 163b and 163c, if the control circuit 53 determines in those steps that the comparators 55 and 58 generate the page len viol page length violation indication or the srn exc segment register number exception, or if the control circuit determines in step 163d that the conditions of the privileged and write flags from fields 65(n) and 66(n) of the selected entry do not correspond appropriately to the conditions of flags 115 and 116 of the segmented to linear virtual address conversion instruction in instruction register 110, it (the control circuit 53) will enable the microprocessor's control circuit 23 to process the appropriate exceptions (step 172). if the microprocessor's control circuit 23 is able to correct the condition which gave rise to the exception (step 173), it will return control to the control circuit 53, after which the control circuit 53 will perform the segmented to linear virtual address conversion operation as described above (steps 161 through 166). returning to step 161, if the control circuit 53 determines in step 161 that the cache 51 does not contain an entry 51(n) whose segmented virtual address tag field 60(n) corresponds to the contents of the segmented virtual address page identifier field 56(p) of the segmented virtual address in register 56, it will sequence to step 174 to enable the microprocessor 11 to provide appropriate conversion information for the segmented virtual address in register 56, which it may either obtain from memory 12 or alternatively generate. thereafter, the control circuit 53 will perform the segmented to linear virtual address conversion operation as described above (steps 161 through 166). as described above, both segmented to linear virtual address conversion instructions, which are executed by the segmented virtual address emulator 50 (fig. 1) and the segmented to linear virtual address space conversion information which is used by the emulator 50, may be generated during the translation of a original program to be executed by an emulated microprocessor into a translated program for execution by host microprocessor 11, or during processing of the translated program. preliminarily, it will be appreciated that during emulation of an original program, the segment registers 30 and the segment descriptor table 31 for the original program will be emulated, which may be maintained in the register set 20 and/or in the memory subsystem 12. in addition, a correspondence will be established between the segmented virtual address space for the original program and the linear virtual address space for the context of the host microprocessor 11 in which the original program will be emulated so that each page in the segmented virtual address space (which is defined by the segmented virtual address page identifier) can be associated with a particular page in the linear virtual address space (which is defined by both the high and low-order portions of the linear virtual address page identifier). segmented to linear virtual address conversion instructions will be generated in response to instructions in the original program which initiate memory access operations. in generating a segmented to linear virtual address conversion instruction, initially the instruction identifier for the instruction may be loaded into field 111 (fig. 3). as described above, an original program instruction which initiates memory access operations includes an address comprising a segment identifier and an offset value, and the segment identifier from the original program instruction will be used in the segment register number field 114 (fig. 3) of the segmented to linear virtual address conversion instruction. in addition, the registers in register set 20 which are to serve as segmented virtual address input register 56 and linear virtual address output register 57 will be selected in a conventional manner and pointers identifying those registers will be loaded into respective fields 112 and 113. further, the privileged and write flags 115 and 116 of the segmented to linear virtual address conversion instructions may be conditioned in response to the access rights in the field 32(n) (fig. 2) of the segment descriptor 31(n) for the segment accessed by the original program instruction. it will be appreciated that one or more additional instructions will be provided in the translated program for execution in advance of the segmented to linear virtual address conversion instruction to generate the segmented virtual address which is to be provided in the segmented virtual address input register 56 when the segmented to linear virtual address conversion instruction is executed. these additional instructions may make use of the contents of the emulated segment registers and emulated segment descriptor table and the offset value from the address provided by the original program instruction. the items of segmented to linear virtual address space conversion information can be generated from the emulated segment descriptor tables and the aforementioned correspondences between the segmented virtual address space and linear virtual address space. in particular, for each emulated segment descriptor in an emulated segment descriptor table, one or more items of segmented to linear virtual address space conversion information will be generated. if the segment has a length, as determined by the emulated segment length field (reference field 33(n), fig. 2) such that it (the segment) will fit into a single page of the segmented virtual address space, only one item of segmented to linear virtual address space conversion information need be generated. on the other hand, if the segment has a length such that it will require a plurality of pages of the segmented virtual address space, a number of items of segmented to linear virtual address space conversion information will need to be generated, one item for each page. in generating each item, the values for the segmented virtual address tag (reference field 60(n), fig. 3) and linear virtual address field (low order) (reference field 63(n), fig. 3) of the item will be conditioned in response to the correspondences between the segmented virtual address space and linear virtual address space. the segment register number (reference field 62(n), fig. 3) will correspond to the segment identifier for which the emulated segment descriptor was generated. the virtual address page limit (reference field 64(n), fig. 3) of the item will also be conditioned in response to the correspondences between the segmented virtual address space and the linear virtual address space. that is, for pages of the segmented virtual address space which are filled, the virtual address page limit field will contain a value which corresponds to the maximum number of locations in a page. on the other hand, for pages which are not filled (which may include, for example, the last page of a segment as described above), the virtual address page limit field will contain a value which corresponds to the number of locations which are actually in the page; accordingly, for the last page of a segment, the value may correspond to the remainder in the quotient of the segment length divided by the size of the segmented virtual address page. further, the privileged and write flags (reference flags 65(n) and 66(n), fig. 3) of the item may be conditioned in response to the access rights in the field 32(n) (fig. 2) of the segment descriptor for the segment for which the item is generated. finally, the context identifier (reference field 61(n), fig. 3) may be assigned by the host microprocessor's operating system. it will be appreciated that the invention provides a number of advantages. in particular, it provides an efficient arrangement for facilitating the emulation of a segmented virtual address space, such as that used in connection with programs written for intel's x86 family of microprocessors, by microprocessors which utilize a non-segmented, linear virtual address space. it will further be appreciated that a number of extensions and modifications may be made to the embodiment described above. for example, as described above, to verify that a particular entry 51(n) of cache 51 contains the segmented to linear virtual address conversion information which is associated with the correct segment, the segment register number value from segment register number field 62(n) of the entry 51(n) is compared to contents of the segment register number field 114 of the segmented to linear virtual address conversion instruction. however, the x86 architecture provides a segment register load instruction which enables a microprocessor constructed in accordance with that architecture to load a value in one of the segment registers 30(m). since the contents of the segment register 30(m) identify the particular segment descriptor 31(n) in the segment descriptor table 31 which defines the segment associated with the segment register 30(m), an instruction to change in the value contained in a segment register may result in a change in segment. in that case, if the microprocessor 11 emulates an x86 segment register load instruction, the segmented to linear virtual address conversion information in particular entries 51(n) of the cache 51 related to the segment whose segment register 30(m) is to be loaded by the segment register load instruction would contain invalid information. to accommodate that, in one embodiment the microprocessor 11 may emulate an x86 segment register load instruction by invalidating the entries 51(n) in cache 51 which are associated with the particular segment whose segment register 30(m) is to be loaded, by, for example, clearing the entries 51(n). in that operation, the contents of successive entries 51(n) may be examined to determine whether their segment register number fields 62(n) contain a value identifying the segment whose segment register 30(m) is to be loaded in response to the segment register load instruction. alternatively, each segment may be associated with a bit map (not shown) having a plurality of bits, with each bit, in turn, being associated with an entry 51(n) of cache 51. in that case, if segment register number field 62(n) of an entry 51(n) identifies a particular segment, the bit associated with the entry 51(n) will be set in the segment's bit map, with the bit associated with the entry 51(n) being cleared in the other segments' bit maps. if the microprocessor 11 emulates an x86 segment register load instruction for a particular segment register 30(m), it may use the bit map for the segment associated with the segment register 30(m) to be loaded to identify the entries 51(n) which contain segmented to linear virtual address conversion information for the segment, and which therefore are to be invalidated. in addition, it will be appreciated that the cache 51 may be organized in accordance with any convenient cache organizational arrangement, including fully associative, direct-mapped, "n"-way set-associative (where "n" is an integer) and the like. in one particular embodiment, the cache 51 is a direct-mapped cache, in which a low-order portion of the segmented virtual address page identifier in field 56(p) of the segmented virtual address in segmented virtual address input register 56 identifies a single entry 51(n) in cache 51 whose contents are to be used in the operations described above in connection with steps 161 through 165. in those operations, if the contents of the segmented virtual address tag field 60(n) of the entry 51(n) do not correspond to the segmented virtual address page identifier in field 56(p) in register 56 (reference step 161), appropriate segmented to linear virtual address conversion information will be provided for storage in the entry 51(n) for the segmented virtual address in register 56, which may be either obtained from memory 12 or alternatively generated (reference step 174). after the appropriate segmented to linear virtual address conversion information has been provided for storage in entry 51(n), to the segmented to linear virtual address conversion operation will be performed (reference step 161 through 165). in addition, while the host microprocessor 11 and memory management unit 14 have been depicted in fig. 1 as comprising separate elements, with the memory management unit 14 communicating with the microprocessor through the bus interface 22, it will be appreciated that the host microprocessor 11 and memory management unit 14 may comprise a single element integrated together on one or more integrated circuit chips. if the host microprocessor 11 and memory management unit 14 are integrated together, the bus interface 22 and memory management unit 14 may, for example, be unified into a single element. it will be further appreciated that the entire host microprocessor 11, constructed in accordance with a selected architecture (such as the aforementioned sparc, version 9, architecture as described in the aforementioned sparc architecture manual, version 9) further including the segmented virtual address emulator in accordance with the invention, may be emulated using a microprocessor of, for example, another architecture as provided with suitable emulation programs or microcode. furthermore, it will be appreciated that a microprocessor 11 including a segmented virtual address emulator in accordance with the invention can be constructed in whole or in part from special purpose hardware or one or more program-controllable devices which any portion of which may be controlled by a suitable program. the foregoing description has been limited to a specific embodiment of this invention. it will be apparent, however, that various variations and modifications may be made to the invention, with the attainment of some or all of the advantages of the invention. it is the object of the appended claims to cover these and such other variations and modifications as come within the true spirit and scope of the invention.
176-835-760-244-509	US	[ "TW", "WO", "KR", "CN", "EP", "US", "JP" ]	C07D491/048,C07D221/16,C07D495/04,C07F15/00,C09K11/06,H01L51/50,H05B33/14,H01L51/00,H01L51/54,H01L51/10,C07D213/16,C07D471/04	2009-04-06T00:00:00	2009	[ "C07", "C09", "H01", "H05" ]	metal complex comprising novel ligand structures	compounds comprising a metal complex having novel ligands are provided. in particular, the compound is an iridium complex comprising novel aza dbx ligands. the compounds may be used in organic light emitting devices, particularly as emitting dopants, providing improved efficiency, low operating voltage, and long lifetime.	claims 1. a compound comprising a ligand having the structure: formula i, wherein a is a 5-membered or 6-membered aromatic or heteroaromatic ring; wherein r a is a substituent having the structure wherein r a is fused to the pyridine ring of formula i; wherein x is selected from the group consisting of crr', c=o, br, o, s, and se; wherein r and r' are independently selected from hydrogen and alkyl; wherein ri, r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; wherein each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl; and wherein the ligand is coordinated to a metal having an atomic weight greater than 40. 2. the compound of claim 1, wherein the ligand has the structure: 3. the compound of claim 1, wherein the ligand has the structure: 4. the compound of claim 1, wherein the ligand has the structure: iv 5. the compound of claim 1, wherein the ligand has the structure: v 6. the compound of claim 1, wherein the ligand has the structure: vl 7. the compound of claim 1, wherein the ligand has the structure: 8. the compound of claim 1, wherein the metal is ir. 9. the compound of claim 1, wherein the compound has the formula (l) n (u) 3- jr: wherein n is 1 , 2, or 3; wherein l is selected from the group consisting of: iii iv v vl and vii wherein l' is selected from the group consisting of: iv v wherein x is selected from the group consisting of crr', c=o, br, o, s, and se; wherein r and r' are independently selected from hydrogen and alkyl; wherein a is a 5-membered or 6-membered aromatic or heteroaromatic ring; wherein r 4 and r 5 may represent mono, di, tri, or tetra substitutions; and wherein r 4 and r 5 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. 10. the compound of claim 9, wherein each of rj, r 2 , r 3 , r 4 , and r 5 are independently selected from hydrogen and alkyl. 11. the compound of claim 1 , wherein a is benzene. 12. the compound of claim 1, wherein a is selected from the group consisting of furan, thiophene and pyrrole. 13. the compound of claim 9, wherein n is 3. 14. the compound of claim 9, wherein n is 2. 15. the compound of claim 9, wherein n is 1. 16. the compound of claim 9, wherein the compound is selected from the group consisting of: 17. the compound of claim 9, wherein the compound is selected from the group consisting of: 18. the compound of claim 9, wherein the compound is selected from the group consisting of: 19. the compound of claim 1, wherein the compound is selected from the group consisting of: compound 1 compound 2 compound 3 compound 4 compound 5 compound 6 compound 7 compound 8 compound 9 compound 10 compound 11 compound 12 compound 13 compound 14 compound 15 compound 16 compound 17 compound 18 compound 19 compound 20 compound 21 compound 22 compound 23 compound 24 compound 37 compound 38 compound 39 compound 40 compound 41 compound 42 compound 43 compound 44 compound 45 compound 46 compound 47 compound 48 compound 49 compound 50 compound 51 compound 52 compound 53 compound 54 compound 55 compound 56 compound 57 compound 58 compound 59 compound 60 compound 61 compound 62 compound 63 compound 64 compound 65 compound 66 compound 67 compound 68 compound 69 compound 70 compound 71 compound 72 compound 73 compound 74 compound 75 compound 76 compound 77 compound 78 compound 79 compound 80 compound 81 compound 82 compound 83 compound 84 compound 85 compound 86 compound 87 compound 88 compound 89 compound 90 compound 91 compound 92 compound 93 compound 94 compound 95 compound 96 compound 118 compound 119 compound 120 compound 121 compound 122 compound 123 compound 124 compound 125 compound 126 compound 127 compound 128 compound 129 compound 130 compound 131 compound 132 compound 133 compound 134 compound 135 compound 136 compound 137 compound 138 compound 139 compound 140 compound 141 compound 142 compound 143 compound 144 compound 145 compound 146 compound 147 compound 148 compound 149 compound 150 20. the compound of claim 1 , wherein x is o. 21. the compound of claim 19, wherein the compound is selected from the group consisting of compound 1 - compound 12 and compound 61 - compound 78. 22. the compound of claim 19, wherein the compound is selected from the group consisting of compound 1 - compound 12. 23. the compound of claim 19, wherein the compound is selected from the group consisting of compound 61 - compound 78. 24. the compound of claim 1 , wherein x is s. 25. the compound of claim 19, wherein the compound is selected from the group consisting of compound 13 - compound 24 and compound 79 - compound 96. 26. the compound of claim 19, wherein the compound is selected from the group consisting of compound 13 - compound 24. 27. the compound of claim 19, wherein the compound is selected from the group consisting of compound 79 - compound 96. 28. the compound of claim 1, wherein x is crr'. 29. the compound of claim 19, wherein the compound is selected from the group consisting of compound 37 - compound 48 and compound 115 - compound 132. 30. the compound of claim 19, wherein the compound is selected from the group consisting of compound 37 - compound 48. 31. the compound of claim 19, wherein the compound is selected from the group consisting of compound 115 - compound 132. 32. the compound of claim 1, wherein x is c=o. 33. the compound of claim 19, wherein the compound is selected from the group consisting of compound 49 - compound 60 and compound 133 - comound 150. 34. the compound of claim 19, wherein the compound is selected from the group consisting of compound 49 - compound 60. 35. the compound of claim 19, wherein the compound is selected from the group consisting of compound 133 - compound 150. 36. an organic light emitting device, comprising: an anode; a cathode; and an organic layer disposed between the anode and the cathode, the organic layer further comprising a compound comprising a ligand having the structure: formula i, wherein a is a 5-membered or 6-membered aromatic or heteroaromatic ring; wherein r a is a substituent having the structure wherein r a is fused to the pyridine ring of formula i; wherein x is selected from the group consisting of crr', c=o, br, o, s, and se; wherein r and r' are independently selected from hydrogen and alkyl; wherein.ri, r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; wherein each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl; and wherein the ligand is coordinated to a metal having an atomic weight greater than 40. 37. the device of claim 36, wherein the ligand has the structure: 38. the device of claim 36, wherein the ligand has the structure: 39. the device of claim 36, wherein the ligand has the structure: iv 40. the device of claim 36, wherein the ligand has the structure: v 41. the device of claim 36, wherein the ligand has the structure: vl 42. the device of claim 36, wherein the ligand has the structure: 43. the device of claim 36, wherein the compound is selected from the group consisting of: compound 1 compound 2 compound 3 compound 4 compound 5 compound 6 compound 7 compound 8 compound 9 compound 10 compound 11 compound 12 compound 13 compound 14 compound 15 compound 16 compound 17 compound 18 compound 19 compound 20 compound 21 compound 22 compound 23 compound 24 compound 37 compound 38 compound 39 compound 40 compound 41 compound 42 compound 43 compound 44 compound 45 compound 46 compound 47 compound 48 compound 49 compound 50 compound 51 compound 52 compound 53 compound 54 compound 55 compound 56 compound 57 compound 58 compound 59 compound 60 compound 61 compound 62 compound 63 compound 64 compound 65 compound 66 compound 67 compound 68 compound 69 compound 70 compound 71 compound 72 compound 73 compound 74 compound 75 compound 76 compound 77 compound 78 compound 79 compound 80 compound 81 compound 82 compound 83 compound 84 compound 85 compound 86 compound 87 compound 88 compound 89 compound 90 compound 91 compound 92 compound 93 compound 94 compound 95 compound 96 compound 115 compound 116 compound 117 compound 118 compound 119 compound 120 compound 121 compound 122 compound 123 compound 124 compound 125 compound 126 compound 127 compound 128 compound 129 compound 130 compound 131 compound 132 compound 133 compound 134 compound 135 compound 136 compound 137 compound 138 compound 139 compound 140 compound 141 compound 142 compound 143 compound 144 compound 145 compound 146 compound 147 compound 148 compound 149 compound 150 44. the device of claim 36, wherein the organic layer is an emissive layer and the compound is an emitting dopant. 45. the device of claim 36, wherein the organic layer further comprises a host. 46. the device of claim 45, wherein the host has the formula: wherein r'i, r' 2 , r' 3 , r' 4 , r' 5 , and r' 6 may represent mono, di, tri, or tetra substitutions; and wherein each of r' 1 } r' 2 , r' 3 , r' 4 , r' 5 , and r' 6 are each independently selected from the group consisting of hydrogen, alkyl and aryl. 47. a consumer product comprising a device, the device further comprising: an anode; a cathode; and an organic layer, disposed between the anode and the cathode, the organic layer further comprising a compound comprising a ligand having the structure: formula i, wherein a is a 5-membered or 6-membered aromatic or heteroaromatic ring; wherein r a is a substituent having the structure wherein r a is fused to the pyridine ring of formula i; wherein x is selected from the group consisting of crr', c=o, br, o, s, and se; wherein r and r' are independently selected from hydrogen and alkyl; wherein ri, r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; wherein each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl; and wherein the ligand is coordinated to a metal having an atomic weight greater than 40.	metal complex comprising novel ligand structures [0001] the claimed invention was made by, on behalf of, and/or in connection with one or more of the following parties to a joint university corporation research agreement: regents of the university of michigan, princeton university, the university of southern california, and the universal display corporation. the agreement was in effect on and before the date the claimed invention was made, and the claimed invention was made as a result of activities undertaken within the scope of the agreement. field of the invention [0002] the present invention relates to organic materials that may be advantageously used in organic light emitting devices. more particularly, the present invention relates to compounds comprising a metal complex having a novel ligand structure and devices incorporating such compounds. background [0003] opto-electronic devices that make use of organic materials are becoming increasingly desirable for a number of reasons. many of the materials used to make such devices are relatively inexpensive, so organic opto-electronic devices have the potential for cost advantages over inorganic devices. in addition, the inherent properties of organic materials, such as their flexibility, may make them well suited for particular applications such as fabrication on a flexible substrate. examples of organic opto-electronic devices include organic light emitting devices (oleds), organic phototransistors, organic photovoltaic cells, and organic photodetectors. for oleds, the organic materials may have performance advantages over conventional materials. for example, the wavelength at which an organic emissive layer emits light may generally be readily tuned with appropriate dopants. [0004] oleds make use of thin organic films that emit light when voltage is applied across the device. oleds are becoming an increasingly interesting technology for use in applications such as flat panel displays, illumination, and backlighting. several oled materials and configurations are described in u.s. pat. nos. 5,844,363, 6,303,238, and 5,707,745, which are incorporated herein by reference in their entirety. [0005] one application for phosphorescent emissive molecules is a full color display. industry standards for such a display call for pixels adapted to emit particular colors, referred to as "saturated" colors. in particular, these standards call for saturated red, green, and blue pixels. color may be measured using cie coordinates, which are well known to the art. [0006] one example of a green emissive molecule is tris(2-phenylpyridine) iridium, denoted ir(ppy) 3 , which has the structure: [0007] in this, and later figures herein, we depict the dative bond from nitrogen to metal (here, ir) as a straight line. [0008] as used herein, the term "organic" includes polymeric materials as well as small molecule organic materials that may be used to fabricate organic opto-electronic devices. "small molecule" refers to any organic material that is not a polymer, and "small molecules" may actually be quite large. small molecules may include repeat units in some circumstances. for example, using a long chain alkyl group as a substituent does not remove a molecule from the "small molecule" class. small molecules may also be incorporated into polymers, for example as a pendent group on a polymer backbone or as a part of the backbone. small molecules may also serve as the core moiety of a dendrimer, which consists of a series of chemical shells built on the core moiety. the core moiety of a dendrimer may be a fluorescent or phosphorescent small molecule emitter. a dendrimer may be a "small molecule," and it is believed that all dendrimers currently used in the field of oleds are small molecules. [0009] as used herein, "top" means furthest away from the substrate, while "bottom" means closest to the substrate. where a first layer is described as "disposed over" a second layer, the first layer is disposed further away from substrate. there may be other layers between the first and second layer, unless it is specified that the first layer is "in contact with" the second layer. for example, a cathode may be described as "disposed over" an anode, even though there are various organic layers in between. [0010] as used herein, "solution processible" means capable of being dissolved, dispersed, or transported in and/or deposited from a liquid medium, either in solution or suspension form. [0011] a ligand may be referred to as "photoactive" when it is believed that the ligand directly contributes to the photoactive properties of an emissive material. a ligand may be referred to as "ancillary" when it is believed that the ligand does not contribute to the photoactive properties of an emissive material, although an ancillary ligand may alter the properties of a photoactive ligand. [0012] as used herein, and as would be generally understood by one skilled in the art, a first "highest occupied molecular orbital" (homo) or "lowest unoccupied molecular orbital" (lumo) energy level is "greater than" or "higher than" a second homo or lumo energy level if the first energy level is closer to the vacuum energy level. since ionization potentials (ip) are measured as a negative energy relative to a vacuum level, a higher homo energy level corresponds to an ip having a smaller absolute value (an ip that is less negative). similarly, a higher lumo energy level corresponds to an electron affinity (ea) having a smaller absolute value (an ea that is less negative). on a conventional energy level diagram, with the vacuum level at the top, the lumo energy level of a material is higher than the homo energy level of the same material. a "higher" homo or lumo energy level appears closer to the top of such a diagram than a "lower" homo or lumo energy level. [0013] as used herein, and as would be generally understood by one skilled in the art, a first work function is "greater than" or "higher than" a second work function if the first work function has a higher absolute value. because work functions are generally measured as negative numbers relative to vacuum level, this means that a "higher" work function is more negative. on a conventional energy level diagram, with the vacuum level at the top, a "higher" work function is illustrated as further away from the vacuum level in the downward direction. thus, the definitions of homo and lumo energy levels follow a different convention than work functions. [0014] more details on oleds, and the definitions described above, can be found in us pat. no. 7,279,704, which is incorporated herein by reference in its entirety. summary of the invention [0015] compounds comprising a metal complex with novel ligand structures are provided. the compounds may be advantageously used in organic light emitting devices. in particular, the compounds may be useful as phosphorescent emitting dopants in such devices. the novel compounds comprise a ligand having the structure: formula i. [0016] a is a 5-membered or 6-membered aromatic or heteroaromatic ring. in one aspect, preferably, a is benzene. in another aspect, preferably a is selected from the group consisting of furan, thiophene, and pyrrole. r a is a substituent having the structure wherein the substituent is fused to the pyridine ring of formula i. the dashed line present in the structure indicates where the substituent is fused to the pyridine ring of formula i. x is selected from the group consisting of crr', c=o, br, o, s, and se. r and r' are independently selected from hydrogen and alkyl. ri, r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. the ligand is coordinated to a metal having an atomic weight greater than 40. preferably, the metal is ir. [0017] in one aspect, compounds are provided which comprise an aza dibenzo-substituted (aza-dbx) ligand having the structure: [0018] in another aspect, compounds are provided wherein the ligand has the structure: [0019] in yet another aspect, compounds are provided wherein the ligands has the structure: iv [0020] in yet another aspect, compounds are provided wherein the ligands has the structure: v [0021] in yet another aspect, compounds are provided wherein the ligands has the structure: vl [0022] in a further aspect, compounds are provided wherein the ligands has the structure: [0023] preferably, the compound has the formula (l) n (l' ) 3-n ir. l is selected from the group consisting of: iv v [0024] l' is selected from the group consisting of: [0025] n is 1, 2, or 3. in one aspect, n is 1. in another aspect, n is 2. in yet another aspect, n is 3. r 4 and r 5 may represent mono, di, tri, or tetra substitutions; and r 4 and r 5 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. preferably, r 4 and r 5 are independently selected from hydrogen and alkyl. in one aspect, each of ri, r 2 , r 3 , r 4 , and r 5 are independently selected from hydrogen and alkyl. [0026] in another aspect, the compound is selected from the group consisting of: [0027] in a particular aspect, compounds comprising a aza dbx ligand and/or a phenylpyridine ligand are preferred. in another aspect, compounds comprising an aza dbx and an ancillary ligand, such as acac, are preferred. [0028] specific examples of the compounds comprising a ligand having formula i are provided, and include compounds 1-24, 37-96, and 115-150. in one aspect, compounds are provided wherein x is o (i.e., aza dibenzofuran) including compounds 1-12 and/or compounds 61-78. in another aspect, compounds are provided wherein x is s (i.e., aza dibenzothiophene) including compounds 13-24 and/pr compounds 79-96. in yet another aspect, compounds are provided wherein x is crr' (i.e., aza fluorene) including compounds 37-48 and/or compounds 155-132. in yet another aspect, compounds are provided wherein x is c=o (i.e., aza fluorenone) including compounds 49-60 and/or compounds 133-150. [0029] additionally, an organic light emitting device is provided. the device comprises an anode, a cathode, and an organic layer disposed between the anode and the cathode. the organic layer further comprises a compound comprising a ligand having formula i, as described above. in particular, the organic layer comprises a compound containing a ligand having the structure ii, iii, iv, v, vi or vii, as shown above. specifically, the organic layer comprises a compound selected from the group consisting of compounds 1-24, 37-96, and 115-150. preferably, the organic layer is an emissive layer and the compound is an emitting dopant. the emissive layer may further comprise a host. preferably, the host has the formula: . r',, r' 2 , r' 3 , r' 4 , r' 5 , and r' 6 may represent mono, di, tri, or tetra substitutions, and each of r'i, r' 2 , r' 3 , r' 4 , r's , and r' 6 are independently selected from the group consisting of hydrogen, alkyl, and aryl. selections for the heteroatoms and substituents described as preferred for compounds having formula i are also preferred for use in a device that includes a compound having formula i. these selections include those described for x, a, rj, r 2 , r 3 , r 4 , and r 5 . [0030] a consumer product is also provided. the product contains a device that has an anode, a cathode, and an organic layer disposed between the anode and the cathode. the organic layer further comprises a compound comprising a ligand having the structure formula i, as discussed above. selections for the heteroatoms and substituents described as preferred for compounds having formula i are also preferred for use in a device that includes a compound having formula i. these selections include those described for x, a 5 ri 5 r 25 r 35 r 4 , and r 5 . brief description of the drawings [0031] fig. 1 shows an organic light emitting device. [0032] fig. 2 shows an inverted organic light emitting device that does not have a separate electron transport layer. [0033] fig. 3 shows a ligand. [0034] fig. 4 shows exemplary aza dbx ligands. detailed description [0035] generally, an oled comprises at least one organic layer disposed between and electrically connected to an anode and a cathode. when a current is applied, the anode injects holes and the cathode injects electrons into the organic layer(s). the injected holes and electrons each migrate toward the oppositely charged electrode. when an electron and hole localize on the same molecule, an "exciton," which is a localized electron-hole pair having an excited energy state, is formed. light is emitted when the exciton relaxes via a photoemissive mechanism. in some cases, the exciton may be localized on an excimer or an exciplex. non- radiative mechanisms, such as thermal relaxation, may also occur, but are generally considered undesirable. [0036] the initial oleds used emissive molecules that emitted light from their singlet states ("fluorescence") as disclosed, for example, in u.s. pat. no. 4,769,292, which is incorporated by reference in its entirety. fluorescent emission generally occurs in a time frame of less than 10 nanoseconds. [0037] more recently, oleds having emissive materials that emit light from triplet states ("phosphorescence") have been demonstrated. baldo et al., "highly efficient phosphorescent emission from organic electroluminescent devices," nature, vol. 395, 151-154, 1998; ("baldo-i") and baldo et al., "very high-efficiency green organic light-emitting devices based on electrophosphorescence," appl. phys. lett., vol. 75, no. 3, 4-6 (1999) ("baldo-ii"), which are incorporated by reference in their entireties. phosphorescence is described in more detail in us pat. no. 7,279,704 at cols. 5-6, which are incorporated by reference. [0038] fig. 1 shows an organic light emitting device 100. the figures are not necessarily drawn to scale. device 100 may include a substrate 110, an anode 115, a hole injection layer 120, a hole transport layer 125, an electron blocking layer 130, an emissive layer 135, a hole blocking layer 140, an electron transport layer 145, an electron injection layer 150, a protective layer 155, and a cathode 160. cathode 160 is a compound cathode having a first conductive layer 162 and a second conductive layer 164. device 100 may be fabricated by depositing the layers described, in order. the properties and functions of these various layers, as well as example materials, are described in more detail in us 7,279,704 at cols. 6- 10, which are incorporated by reference. [0039] more examples for each of these layers are available. for example, a flexible and transparent substrate-anode combination is disclosed in u.s. pat. no. 5,844,363, which is incorporated by reference in its entirety. an example of a p-doped hole transport layer is m- mtdata doped with f.sub.4-tcnq at a molar ratio of 50:1, as disclosed in u.s. patent application publication no. 2003/0230980, which is incorporated by reference in its entirety. examples of emissive and host materials are disclosed in u.s. pat. no. 6,303,238 to thompson et al., which is incorporated by reference in its entirety. an example of an n- doped electron transport layer is bphen doped with li at a molar ratio of 1 : 1 , as disclosed in u.s. patent application publication no. 2003/0230980, which is incorporated by reference in its entirety. u.s. pat. nos. 5,703,436 and 5,707,745, which are incorporated by reference in their entireties, disclose examples of cathodes including compound cathodes having a thin layer of metal such as mg: ag with an overlying transparent, electrically-conductive, sputter- deposited ito layer. the theory and use of blocking layers is described in more detail in u.s. pat. no. 6,097,147 and u.s. patent application publication no. 2003/0230980, which are incorporated by reference in their entireties. examples of injection layers are provided in u.s. patent application publication no. 2004/0174116, which is incorporated by reference in its entirety. a description of protective layers may be found in u.s. patent application publication no. 2004/0174116, which is incorporated by reference in its entirety. [0040] fig. 2 shows an inverted oled 200. the device includes a substrate 210, a cathode 215, an emissive layer 220, a hole transport layer 225, and an anode 230. device 200 may be fabricated by depositing the layers described, in order. because the most common oled configuration has a cathode disposed over the anode, and device 200 has cathode 215 disposed under anode 230, device 200 may be referred to as an "inverted" oled. materials similar to those described with respect to device 100 may be used in the corresponding layers of device 200. fig. 2 provides one example of how some layers may be omitted from the structure of device 100. [0041] the simple layered structure illustrated in figs. 1 and 2 is provided by way of non- limiting example, and it is understood that embodiments of the invention may be used in connection with a wide variety of other structures. the specific materials and structures described are exemplary in nature, and other materials and structures may be used. functional oleds may be achieved by combining the various layers described in different ways, or layers may be omitted entirely, based on design, performance, and cost factors. other layers not specifically described may also be included. materials other than those specifically described may be used. although many of the examples provided herein describe various layers as comprising a single material, it is understood that combinations of materials, such as a mixture of host and dopant, or more generally a mixture, may be used. also, the layers may have various sublayers. the names given to the various layers herein are not intended to be strictly limiting. for example, in device 200, hole transport layer 225 transports holes and injects holes into emissive layer 220, and may be described as a hole transport layer or a hole injection layer. in one embodiment, an oled may be described as having an "organic layer" disposed between a cathode and an anode. this organic layer may comprise a single layer, or may further comprise multiple layers of different organic materials as described, for example, with respect to figs. 1 and 2. [0042] structures and materials not specifically described may also be used, such as oleds comprised of polymeric materials (pleds) such as disclosed in u.s. pat. no. 5,247,190 to friend et al., which is incorporated by reference in its entirety. by way of further example, oleds having a single organic layer may be used. oleds may be stacked, for example as described in u.s. pat. no. 5,707,745 to forrest et al, which is incorporated by reference in its entirety. the oled structure may deviate from the simple layered structure illustrated in figs. 1 and 2. for example, the substrate may include an angled reflective surface to improve out-coupling, such as a mesa structure as described in u.s. pat. no. 6,091,195 to forrest et al., and/or a pit structure as described in u.s. pat. no. 5,834,893 to bulovic et al., which are incorporated by reference in their entireties. [0043] unless otherwise specified, any of the layers of the various embodiments may be deposited by any suitable method. for the organic layers, preferred methods include thermal evaporation, ink-jet, such as described in u.s. pat. nos. 6,013,982 and 6,087,196, which are incorporated by reference in their entireties, organic vapor phase deposition (ovpd), such as described in u.s. pat. no. 6,337,102 to forrest et al., which is incorporated by reference in its entirety, and deposition by organic vapor jet printing (ovjp), such as described in u.s. patent application ser. no. 10/233,470, which is incorporated by reference in its entirety. other suitable deposition methods include spin coating and other solution based processes. solution based processes are preferably carried out in nitrogen or an inert atmosphere. for the other layers, preferred methods include thermal evaporation. preferred patterning methods include deposition through a mask, cold welding such as described in u.s. pat. nos. 6,294,398 and 6,468,819, which are incorporated by reference in their entireties, and patterning associated with some of the deposition methods such as ink-jet and ovjd. other methods may also be used. the materials to be deposited may be modified to make them compatible with a particular deposition method. for example, substituents such as alkyl and aryl groups, branched or unbranched, and preferably containing at least 3 carbons, may be used in small molecules to enhance their ability to undergo solution processing. substituents having 20 carbons or more may be used, and 3-20 carbons is a preferred range. materials with asymmetric structures may have better solution processibility than those having symmetric structures, because asymmetric materials may have a lower tendency to recrystallize. dendrimer substituents may be used to enhance the ability of small molecules to undergo solution processing. [0044] devices fabricated in accordance with embodiments of the invention may be incorporated into a wide variety of consumer products, including flat panel displays, computer monitors, televisions, billboards, lights for interior or exterior illumination and/or signaling, heads up displays, fully transparent displays, flexible displays, laser printers, telephones, cell phones, personal digital assistants (pdas), laptop computers, digital cameras, camcorders, viewfmders, micro-displays, vehicles, a large area wall, theater or stadium screen, or a sign. various control mechanisms may be used to control devices fabricated in accordance with the present invention, including passive matrix and active matrix. many of the devices are intended for use in a temperature range comfortable to humans, such as 18 degrees c. to 30 degrees c, and more preferably at room temperature (20-25 degrees c). [0045] the materials and structures described herein may have applications in devices other than oleds. for example, other optoelectronic devices such as organic solar cells and organic photodetectors may employ the materials and structures. more generally, organic devices, such as organic transistors, may employ the materials and structures. [0046] the terms halo, halogen, alkyl, cycloalkyl, alkenyl, alkynyl, arylkyl, heterocyclic group, aryl, aromatic group, and heteroaryl are known to the art, and are defined in us 7,279,704 at cols. 31-32, which are incorporated herein by reference. [0047] a new class of compounds are provided herein, the compounds comprising a ligand having a novel structure (illustrated in fig. 3). these compounds may be advantageously used in phosphorescent organic light emitting devices. preferably, these compounds may be used as an emitting dopant in the emissive layer. in particular, the novel ligands having formula 1 consist of a phenylpyridine ligand wherein the pyridine ring has been replaced with an aromatic aza group to generate a novel structure (herein referred to as an "aza dbx" or an "aza dibenzo-substituted" ligand). aza dibenzo-substituted ligands include aza dibenzofuran, aza dibenzothiophene, aza fluorene, aza fluorenone, aza carbazole, and aza dibenzoselenophene. the compounds provided herein contain an aza dbx ligand where the x represents a chemical group substituent within the aza structure. the substituent can be used to tune the properties of the compound to provide more desirable properties (e.g., color or stability). for example, substituting the aza dbx ligand with a heteroatom, such as o, s or n, may alter the electrochemical and photophysical properties of the compound. [0048] additionally, the compounds provided herein may have various properties based on the particular ligand structure. in particular, "flipping" the ligand so that the ligand has the same atomic make-up but a different orientation may influence the overall properties of the compound comprising the ligand (i.e., ii compared to iii, iv compared to v, and vi compared to vii). for example, compound 1 and compound 8 both contain an aza dbx ligand wherein x is o (i.e. aza dibenzofuran), but the ligands have a different orientation in compound 1 compared to compound 2 and consequently, there is a red-shift between these compounds. [0049] iridium complexes containing aza dibenzo-substituted ligands may demonstrate many desirable characteristics. without being bound by theory, it is thought that the novel compounds provided herein may be more stable emitters in pholeds. the lumo of phenylpyridine iridium complexes is normally localized on the ligand, whereas the compounds provided herein provide better electron destabilization via the aza dibenzo- substituted ligand. therefore, these compounds may be considered more stable to electrons resulting in a more stable emitters. in addition, these compounds may also provide devices having improved lifetime and lower operating voltage. [0050] the compounds provided herein comprise a ligand having the structure: formula i. [0051] a is a 5-membered or 6-membered aromatic or heteroaromatic ring. in one aspect, a is a 6 membered ring wherein, preferably, a is benzene. in another aspect, a is a 5 membered ring wherein, preferably, a is selected from the group consisting of furan, thiophene, and pyrrole. examples of 5-membered ring which may be used as the a ring include, for example, furan, thiophene, pyrrole, azole, thiazole, dithiolane, triazole, dithiazole, and tetrazole. [0052] r a is a substituent having the structure wherein the substituent is fused to the pyridine ring of formula i. the dashed line present in the structure indicates where the substituent is joined to the pyridine ring of formula i. x is selected from the group consisting of crr', c=o, br, nr, o, s, and se. r and r' are independently selected from hydrogen and alkyl. rj, r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. the ligand is coordinated to a metal having an atomic weight greater than 40. preferably, the metal is ir. [0053] in one aspect, compounds provided which comprise a ligand having the structure: [0054] in another aspect, compounds provided which comprise a ligand having the structure: [0055] in yet another aspect, compounds provided which comprise a ligand having the structure: [0056] in yet another aspect, compounds provided which comprise a ligand having the structure: v [0057] in yet another aspect, compounds provided which comprise a ligand having the structure: vi [0058] in yet a further aspect, compounds provided which comprise a ligand having the structure: [0059] in one aspect, the compound has the formula (l) n (l' ) 3-n ir. l is selected from the group consisting of: iv v l' is selected from the group consisting of: iv v [0060] n is 1, 2, or 3. in one aspect, n is 3. when n is 3, the compound is a homoleptic compound. in another aspect, n is 2. in yet another aspect, n is 1. when n is 1 or 2, the compound is a heteroleptic compound. [0061] r 4 and r 5 may represent mono, di, tri, or tetra substitutions; and r 4 and r 5 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. preferably, r 4 and r 5 are independently selected from hydrogen and alkyl. [0062] the novel compounds provided herein include heteroleptic and homoleptic metal complexes. in particular, compounds are provided wherein the compound is selected from the group consisting of: [0063] in one aspect, compounds comprising a phenylpyridine ligand, a pyridyl aza dbx ligand, or both ligands are preferred. these compounds include both homoleptic and heteroleptic compounds comprising the novel ligand. in particular, compounds selected from the group consisting of: [0064] in another aspect, compounds comprising pyridyl aza dibenzo-substituted ligands and an ancillary ligand, such as acac, are preferred. in particular, compounds selected from the group consisting of: [0065] specific examples of the novel compounds comprising a ligand having formula i are provided, and include compounds selected from the group consisting of: compound 1 compound 2 compound 3 compound 4 compound 5 compound 6 compound 7 compound 8 compound 9 compound 10 compound 11 compound 12 compound 13 compound 14 compound 15 compound 16 compound 17 compound 18 compound 19 compound 20 compound 21 compound 22 compound 23 compound 24 compound 25 compound 26 compound 27 compound 28 compound 29 compound 30 compound 31 compound 32 compound 33 compound 34 compound 35 compound 36 compound 37 compound 38 compound 39 compound 40 compound 41 compound 42 compound 43 compound 44 compound 45 compound 46 compound 47 compound 48 compound 49 compound 50 compound 51 compound 52 compound 53 compound 54 compound 55 compound 56 compound 57 compound 58 compound 59 compound 60 compound 61 compound 62 compound 63 compound 64 compound 65 compound 66 compound 67 compound 68 compound 69 compound 70 compound 71 compound 72 compound 73 compound 74 compound 75 compound 76 compound 77 compound 78 compound 79 compound 80 compound 81 compound 82 compound 83 compound 84 compound 85 compound 86 compound 87 compound 88 compound 89 compound 90 compound 91 compound 92 compound 93 compound 94 compound 95 compound 96 compound 97 compound 98 compound 99 compound 100 compound 101 compound 102 compound 103 compound 104 compound 105 compound 106 compound 107 compound 108 compound 109 compound 110 compound 111 compound 112 compound 113 compound 114 compound 115 compound 116 compound 117 compound 118 compound 119 compound 120 compound 121 compound 122 compound 123 compound 124 compound 125 compound 126 compound 127 compound 128 compound 129 compound 130 compound 131 compound 132 compound 133 compound 134 compound 135 compound 136 compound 137 compound 138 compound 139 compound 140 compound 141 compound 142 compound 143 compound 144 compound 145 compound 146 compound 147 compound 148 compound 149 compound 150 [0066] as discussed above, the chemical group used to substitute the aza dbx ligand may be used to tune the properties of the compound providing compounds and devices having improved characteristics. for example, the aza dbx ligands may be substituted with various heteroatoms. in one aspect, compounds are provided wherein x is o. exemplary compounds wherein x is o include compounds 1 - 12 and compounds 61 - 78. such compounds having an aza dibenzofuran ligand may have improved stability and improved efficiency. devices containing compounds wherein x is o are especially preferred because they may provide improved stability and long lifetime. [0067] in another aspect, compounds are provided wherein x is s. exemplary compounds wherein x is s include compounds 13 - 24 and compounds 79 - 96. such compounds having an aza dibenzothiophene ligand may have improved stability, increased efficiency, and long lifetime. devices using the compounds wherein x is s are particularly preferred because they may provide the highly desirable combination of good efficiency and long lifetime. [0068] in another aspect, compounds are provided wherein x is nr. exemplary compounds wherein x is nr include compounds 25 - 36 and compounds 97 - 114. such compounds having an aza carbazole ligand may have improved efficiency and stability. [0069] the aza dbx ligands may also be substituted with carbon-containing chemical groups. in one aspect, compounds are provided wherein x is crr'. exemplary compounds wherein x is crr' include compounds 37 - 48 and compounds 115 - 132. in another aspect, compounds are provided wherein x is c=o. exemplary compounds wherein x is c=o include compounds 49 - 60 and compounds 133 - 150. [0070] an organic light emitting device is also provided. the device comprises an anode, a cathode, and an organic emissive layer disposed between the anode and the cathode. the organic emissive layer includes a compound comprising a ligand having the structure formula i, as discussed above. selections for the heteroatoms and substituents described as preferred for compounds having formula i are also preferred for use in a device that includes a compound having formula i. these selections include those described for x, a, ri, r 2 , r 3 , r 4 , and r 5 . [0071] a is a 5-membered or 6-membered aromatic or heteroaromatic ring. in one aspect, preferably, a is benzene. in another aspect, preferably a is selected from the group consisting of furan, thiophene, and pyrrole. [0072] r a is a substituent having the structure wherein the substituent is fused to the pyridine ring of formula i. x is selected from the group consisting of crr', c=o, br, nr, o, s, and se. r and r' are independently selected from hydrogen and alkyl. rj, r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. the ligand is coordinated to a metal having an atomic weight greater than 40. preferably, the metal is ir. [0073] in one aspect, devices are provided wherein the compound comprises a ligand having the structure ii. in another aspect, devices are provided wherein the compound comprises a ligand having the structure iii. in yet another aspect, devices are provided wherein the compound comprises a ligand having the structure iv. in yet another aspect, devices are provided wherein the compound comprises a ligand having the structure v. in yet another aspect, devices are provided wherein the compound comprises a ligand having the structure vi. in a further another aspect, devices are provided wherein the compound comprises a ligand having the structure vii. [0074] in one aspect, device are provided wherein the compound is selected from the group consisting of: [0075] particular devices are provided, the device comprising an organic layer containing a compound selected from the group consisting of compounds 1-150, as shown above. [0076] in one aspect, the organic emissive layer is an emissive layer and the compound is an emitting dopant. the organic layer may further comprise a host. preferably, the host has the formula: . r'j, r' 2 , r' 3 , r' 4 , r' 5 , and r' 6 may represent mono, di, tri, or tetra substitutions, and each of r'i, r' 2 , r' 3 , r' 4 , r' 5 , and r' 6 are independently selected from the group consisting of hydrogen, alkyl, and aryl. [0077] additionally, a consumer product comprising a device is also provided. the device further comprises an anode, a cathode, and an organic layer disposed between the anode and the cathode. the organic layer further comprises a compound comprising a ligand having formula i, as described above. selections for the heteroatoms and substituents described as preferred for compounds having formula i are also preferred for use in a device that includes a compound having formula i. these selections include those described for x, a, r 1 , r 2 , r 3 , r 4 , and r 5 . [0078] a is a 5-membered or 6-membered aromatic or heteroaromatic ring. [0079] r a is a substituent having the structure wherein the substituent is fused to the pyridine ring of formula i. x is selected from the group consisting of crr', c=o, br, nr, o, s, and se. r and r' are independently selected from hydrogen and alkyl. r 1 , r 2 , and r 3 may represent mono, di, tri, or tetra substitutions; each of ri, r 2 , and r 3 are independently selected from the group consisting of hydrogen, alkyl, alkoxy, amino, alkenyl, alkynyl, arylkyl, aryl, and heteroaryl. the ligand is coordinated to a metal having an atomic weight greater than 40. [0080] the materials described herein as useful for a particular layer in an organic light emitting device may be used in combination with a wide variety of other materials present in the device. for example, emissive dopants disclosed herein may be used in conjunction with a wide variety of hosts, transport layers, blocking layers, injection layers, electrodes and other layers that may be present. the materials described or referred to below are non-limiting examples of materials that may be useful in combination with the compounds disclosed herein, and one of skill in the art can readily consult the literature to identify other materials that may be useful in combination. [0081] in addition to and / or in combination with the materials disclosed herein, many hole injection materials, hole transporting materials, host materials, dopant materials, exiton/hole blocking layer materials, electron transporting and electron injecting materials may be used in an oled. non-limiting examples of the materials that may be used in an oled in combination with materials disclosed herein are listed in table 1 below. table 1 lists non- limiting classes of materials, non-limiting examples of compounds for each class, and references that disclose the materials. table 1 experimental compound examples example 1. synthesis of compound 1 desired product [0082] synthesis of 2-chloro-5-iodo-4-aminopyridine: 2-chloro-4-aminopyridine (25 g, 194 mmol) and potassium acetate (19.05 g, 194 mmol) were dissolved in 250 rnl acetic acid and heated to 80 0 c. a solution of (31.56 g, 194 mmol) in acetic acid (40 ml) was added dropwise and the reaction mixture was stirred at 80 0 c for 3 h. the reaction mixture was cooled to room temperature and neutralized by saturated aq. nahco 3 solution. dark off- white solid precipitated out, which was dissolved in methylene chloride and washed with saturated aq. nahso 3 , dried over na 2 so 4 , concentrated and purified by column chromatography using hexanes and ethyl acetate as eluent. isolated 11.6 g of title compound along with 13.4 g of undesired isomer. 75 0 c [0083] synthesis of 2-chloro-5-(2-methoxyphenyl)pyridin-4-amine: potassium phosphate (18.28 g, 79 mmol), triphenyl phosphine (1.04 g, 3.97 mmol), 2-chloro-5-iodo-4- aminopyridine (10.1 g, 39.mmol), 2-methoxybenzeneboronic acid (8.44 g, 55.57 mmol) and palladium acetate (0.45 g, 1.98 mmol) were sequentially added to degassed acetonitrile (300 ml) and water (100 ml) under nitrogen. the reaction mixture was heated at 75 0 c for overnight, then cooled to room temperature. the organic layer was separated and aqueous layer and was extracted with ethyl acetate. the combined organic layers were dried over sodium sulfate, concentrated and performed column chromatography using hexanes and ethyl acetate as eluent. 7.5 g of title compound was isolated. [0084] synthesis of 3-chlorobenzofuro[3,2-c] pyridine: 2-chloro-5-(2- methoxyphenyl)pyridin-4-amine (7.5 g, 31.96 mmol) was dissolved in glacial acetic acid (200 ml) and concentrated sulfuric acid (1 ml). a solution of t-butylnitrite (11.39 ml, 95.87 mmol) in 10 ml of acetic acid was added drop wise and stirred for 30 minutes. the reaction mixture was concentrated under reduced pressure, dissolved in methylene chloride. the reaction mixture was dried over sodium sulfate, concentrated and the residue was purified by silica column using hexanes and ethyl acetate as eluent to give 5.0 g of title compound. reflux [0085] synthesis of 3-phenylbenzofuro[3,2-c]pyridine: 3-chlorobenzofuro[3,2-c]pyridine (2.89 g, 14 mmol), phenylboronic acid (2.56 g, 21 mmol), potassium phosphate (9.6 g, 42 mmol), 2-dicyclohexylphosphino-2',6'-dimethoxybiphenyl (0.45 g, 1.12 mmol) and pd 2 (bda) 3 (0.256 g, 0.28 mmol) were to toluene (100 ml) and water (10 ml). nitrogen was bubbled through the solution for 30 minutes and then the solution was refluxed for overnight in an atmosphere of nitrogen. the reaction was then allowed to cool to room temperature and the organic phase was separated from the aqueous phase. the aqueous phase was washed with ethyl acetate and the organic fractions were combined and dried over sodium sulfate and the solvent removed under vacuum. the product was chromatographed using silica gel with ethyl acetate and hexanes as the eluent. the solvent was removed to give 2.77 g of title compound. ethanol reflux [0086] synthesis of compound 1: indium intermediate (2.67 g, 3.76 mmol) and 3- phenylbenzofuro[3,2-c]pyridine (2.77 g, 11.29 mmol) was mixed in 50 ml of anhydrous ethanol. the mixture was heated to reflux under nitrogen for 24 h. the reaction mixture was cooled to room temperature; the precipitate was collected by filtration. the crude precipitate (1.9 g) was purified by silica column using 2:3 dichloromethane and hexanes to 0.9 g of desired product was obtained after column purification. the compound was further purified by high vacuum sublimation at 290 0 c to yield 0.55 g of product (hplc purity 99.7%). example 2. synthesis of compound 7 [0087] synthesis of compound 7: indium intermediate (1.82 g, 2.46 mmol) and 3- phenylbenzofuro[3,2-c]pyridine (1.81 g, 7.38 mmol) was mixed in 40 nil of anhydrous ethanol. the mixture was heated to reflux under nitrogen for 24 h. the reaction mixture was cooled to room temperature; the precipitate was collected by filtration. the crude precipitate (1.8 g) was purified by short silica column using hot dichloromethane. the compound was further purified by high vacuum sublimation at 290 0 c to yield 0.64 g of product (hplc purity 99 %). example 3. synthesis of compound 8 desired product [0088] synthesis of 6-chloro-5-iodo-2-aminopyridine: 2-chloro-6-aminopyridine (23.0 g, 178 mmol) and potassium acetate (17.5 g, 178 mmol) were dissolved in 200 ml acetic acid and heated to 80 0 c. a solution of icl (29.05 g, 178 mmol) in acetic acid (40 ml) was added dropwise and the reaction mixture was stirred at 80 0 c for 4 h. the reaction mixture was cooled to room temperature and the acetic acid was removed under reduced pressure. the residue was dissolved in ethyl acetate and neutralized by saturated aq. nahco 3 solution. the organic layer was washed with saturated aq. nahso 3 , dried over na 2 so 4 , concentrated and purified by silica column using hexanes and ethyl acetate as eluent. isolated 6.1 g of title compound. 75 0 c [0089] synthesis of 6-chloro-3-(2-methoxyphenyl)pyridin-2-amine: potassium phosphate (12.72 g, 60 mmol), triphenyl phosphine (0.682 g, 2.40 mmol), 6-chloro-5-iodo-2- aminopyridine (6.1 g, 24 mmol), 2-methoxybenzeneboronic acid (5.10 g, 33.5 mmol) and palladium acetate (0.27 g, 1.20 mmol) were sequentially added to degassed acetonitrile (200 ml) and water (60 ml) under nitrogen. the reaction mixture was heated at 75 0 c for overnight, then cooled to room temperature. the organic layer was separated and aqueous layer and was extracted with ethyl acetate. the combined organic layers were dried over sodium sulfate, concentrated and purified by silica column using hexanes and ethyl acetate as eluent furnishing 4.05 g of title compound. [0090] synthesis of 2-chlorobenzofuro[2,3-b]pyridine: 6-chloro-3-(2- methoxyphenyl)pyridin-2-amine (4.0 g, 17.04 mmol) was dissolved in glacial acetic acid (100 ml) and concentrated sulfuric acid (1 ml). a solution of ^-butylnitrite (6.1 ml, 51.2 mmol) in 6 ml of acetic acid was added drop wise and stirred for 30 minutes. the reaction mixture was concentrated under reduced pressure, dissolved in methylene chloride. the reaction mixture neutralized by saturated aq. nahco 3 solution and the organic phase was separated from the aqueous phase. the aqueous phase extracted with methylene chloride and the combined organic layers was dried over sodium sulfate, concentrated and the residue was purified by silica column using hexanes and ethyl acetate as eluent to give 1.85 g of title compound. [0091] synthesis of 2-phenylbenzofuro[2,3-b] pyridine: 2-chlorobenzofuro[2,3-b]pyridine (1.33 g, 6.53 mmol), phenylboronic acid (1.19 g, 9.80 mmol), potassium phosphate (4.51 g, 19.59 mmol), 2-dicyclohexylphosphino-2',6'-dimethoxybiphenyl (0.214 g, 0.522 mmol) and pd 2 (bda) 3 (0.119 g, 0.13 mmol) were to toluene (40 ml) and water (4 ml). nitrogen was bubbled through the solution for 30 minutes and then the solution was refluxed for overnight in an atmosphere of nitrogen. the reaction was then allowed to cool to room temperature and the organic phase was separated from the aqueous phase. the aqueous phase was extracted with ethylacetate and the organic fractions were combined and dried over sodium sulfate and the solvent removed under vacuum. the product was chromatographed using silica gel with ethylacetate and hexanes as the eluent. the solvent was removed to give 1.45 g of title compound. [0092] synthesis of compound 8: indium intermediate (1.15 g, 1.55 mmol) and 2- phenylbenzofuro[2,3-b]pyridine (1.14 g, 4.66 mmol) was mixed in 30 ml of anhydrous ethanol. the mixture was heated to reflux under nitrogen for 24. the reaction mixture was cooled to room temperature; the precipitate was collected by filtration. the crude precipitate (1.0 g) was purified by silica column using dichloromethane and hexanes as eluent. the compound was further purified by high vacuum sublimation at 290 0 c to yield 0.3 g of product (hplc purity 99%). example 4. synthesis of compound 22 water [0093] synthesis of 2-phenyl-3-azadibenzothiophene: 2-chloro-3-azadibenzothiophene (1.3 g, 5.7 mmol), phenylboronic acid (0.87 g, 7.1 mmol), dicyclohexyl(2',6'- dimethoxybiphenyl-2-yl)phosphine (s-phos) (0.09 g, 0.23 mmol), and potassium phosphate (3.3 g, 14.3 mmol) were mixed in 60 ml of toluene and 6 ml of water. nitrogen is bubbled directly into the mixture for 30 minutes. next, pd 2 (dba) 3 was added (0.05 g, 0.05 mmol) and the mixture was heated to reflux under nitrogen for 3 days. the mixture was cooled and the organic layer was separated. the organic layers are washed with brine, dried over magnesium sulfate, filtered, and evaporated to a residue. the residue was purified by column chromatography eluting with 5% ethyl acetate/hexanes. 0.4 g of desired product was obtained after purification. compound 22 [0094] synthesis of compound 22: the iridium triflate precursor (0.4 g, 1.5 mmol) and 2- phenyl-3-azadibenzothiophene (0.4 g, 0.5 mmol) were mixed in 20 ml of ethanol. the mixture was heated at reflux for 24 h under nitrogen. precipitate formed during reflux. the reaction mixture was filtered through a celite bed. the product was washed with methanol and hexanes. the solid was dissolved in dichloromethane and purified by column using 1 :1 of dichloromethane and hexanes. 0.34 g of pure product was obtained after the column purification. (hplc purity: 99.3%) example 5. synthesis of compound 31 toluene, h 2 o reflux [0095] synthesis of 5-(2-nitrophenyl)-2-phenylpyridine: 2-iodo-l -nitrobenzene (6.88 g, 27.64 mmol), 6-phenyl-3-pyridinylboronic acid (5.5 g, 27.64 mmol), potassium phosphate (17.6 g, 82.91 mmol), 2-dicyclohexylphosphino-2 ! ,6'-dimethoxybiphenyl (0.451 g, 0.522 mmol) and pd 2 (bda) 3 (0.119 g, 0.55 mmol) were to toluene (150 ml) and water (12 ml). nitrogen was bubbled through the solution for 30 minutes and then the solution was refluxed for overnight in an atmosphere of nitrogen. the reaction was then allowed to cool to room temperature and the organic phase was separated from the aqueous phase. the aqueous phase was extracted with ethylacetate and the organic fractions were combined and dried over sodium sulfate and the solvent removed under vacuum. the product was chromatographed using silica gel with ethylacetate and hexanes as the eluent. the solvent was removed to give 5.02 g of the title compound. desired product [0096] synthesis of aza-carbozole: 5-(2-nitrophenyl)-2-phenylpyridine (5.0 g, 18.10 mmol) and triethyl phosphite (30 g, 180.97 mmol) were heated at 160 0 c under nitrogen atmosphere for overnight. after the time, the reaction mixture is cooled to room temp, and aq. 6n hcl (60 ml) was added. the acidic solution was neutralized with naoh pellets till the ph is 12. the reaction mixture was extracted with ethylacetate and the combined organic fractions were dried over sodium sulfate and the solvent was removed under reduced vacuum. the product was chromatographed using silica gel with ethylacetate and hexanes as the eluent. the solvent was removed to give 3.0 g of the carbozole products. desired product [0097] synthesis of 5-ethyl-3-phenyl-5h-pyrido[4,3-b]indole: to a flask containing carbozoles (1.90 g, 7.78 mmol) and sodium hydride (0.55 g, 23.33 mmol), dry dmf (50 ml) was added and the reaction was stirred for 30 minutes at room temperature. after the time, ethyl iodide was added and the reaction was stirred for overnight. tlc showed the reaction was complete, and the reaction was quenched with saturated aq. nacl solution. the mixture was extracted with ethyl acetate and the combined organic fractions were washed with nacl solution, licl solution and dried over sodium sulfate and the solvent removed under vacuum. the product was chromatographed using silica gel with ethylacetate and hexanes as the eluent. the solvent was removed to give 502 mg of the desired title compound. [0098] synthesis of compound 31: indium intermediate (0.416 g, 0.563 mmol) and 5- ethyl-3-phenyl-5h-pyrido[4,3-b]indole (0.46 g, 1.69 mmol) was mixed in 10 ml of anhydrous ethanol. the mixture was heated to reflux under nitrogen for 24 h. the reaction mixture was cooled to room temperature, and the precipitate was collected by filtration. the crude precipitate was purified by silica column using dichloromethane and hexanes as eluent to yield 0.35 g of the complex. example 6. synthesis of compound 86 [0099] synthesis of 2-chloro-3-(phenylthio)pyridin-4-amine: into a 250 ml round bottom flask was placed the 2-chloro-3-iodo-4-aminopyridine (3.0 g, 11.8 mmol), thiophenol (1.3 g, 11.8 mmol), copper(i) iodide (0.11 g, 0.58 mmol), ethylene glycol (1.5 g, 24 mmol) and potassium carbonate (3.3 g, 24 mol). 10oml of 2-propanol was then added to the reaction mixture and the mixture was heated at reflux for 18 h. the reaction mixture was cooled to room temperature and was filtered under vacuum. the filtrate was diluted with 200 ml of water then was extracted two times with 150 ml of ethyl acetate. the extracts were dried over magnesium sulfate then were filtered and stripped under vacuum. the product was purified using silica gel chromatography with 2-15% ethyl acetate / dichloromethane as the mobile phase. 2.og (72% yield of product was collected. [0100] synthesis of 3-aza-4-chlorodibenzothiophene: into a 250 nil three neck flask was placed the aminopyridine (2.0 g, 8.5mmol). this material was dissolved in 30 ml of glacial acetic acid and was stirred at room temperature. to this mixture tert-butyl nitrite (0.87 g, 8.5 mol) was added dropwise over a 15 minute period. this mixture was then stirred for 1 h at room temperature. next, additional tert-butyl nitrite (0.44 g, 0.0043 mol) was added to the reaction mixture and this was stirred at room temperature for an additional 2 h. the reaction mixture was poured onto ice and was basifϊed using sodium bicarbonate. the mixture was then extracted with ethyl acetate and the extracts were dried over magnesium sulfate. the extracts were then filtered and stripped under vacuum. the product was purified using silica gel chromatography with 10-20% ethyl acetate / hexanes as the mobile phase. 1.55g (83% yield) of product was collected. [0101] synthesis of 4-(3',5'-dimethylphenyl)-3-azadibenzothiophene: into a 250 ml round bottom flask was placed the chloroazabenzothiophene (1.55 g, 7.1 mmol), 3,5- dimethylphenyl boronic acid (1.70 g, 11 mmol)., potassium phosphate tribasic monohydrate (7.6 g, 33 mol), pd 2 (dba) 3 (0.065 g, 0.071 mol) and 2-dicyclohexylphosphino-2',6'- dimethoxylbiphenyl (0.12 g, 0.28 mol). to this mixture was added 200 ml of toluene and 30 ml of water. this mixture was evacuated and back-filled with nitrogen. this procedure was repeated a total of 3 times. the reaction mixture was stirred and heated at reflux for 18 h. the toluene layer was separated and was dried over magnesium sulfate. the organics were then filtered and stripped under vacuum. the product was purified using silica gel chromatography with 10-20% ethyl acetate / hexanes as the mobile phase. 2.og (97% yield) of product was collected. [0102] synthesis of dimer: 4-(3',5'-dimethylphenyl)-3-azadibenzothiophene (2.0 g, 6.9 mmol) , 2-ethoxyethanol (25 ml) and water (5 ml) were charged in a 100 nil three-neck round bottom flask. nitrogen gas was bubbled through the reaction mixture 45 minutes. ircl 3 -h 2 o (0.6 g, 2 mmol) was then added and the reaction mixture was heated to reflux under nitrogen for 17 h. the reaction mixture was cooled to ambient and filtered. the orange/red residue was collected and washed with methanol (2 x 15 ml) followed by hexanes (2 x 15 ml). 1.0 gram of the dichlorobridged iridium dimer was obtained after drying in vacuum oven. compound 86 [0103] synthesis of compound 86. dichlorobridged iridium dimer (1.0 g, 0.7 mmol), 10 mol eq. 2,4-pentanedione (1.4 g), 20 mol. eq. ofna 2 co 3 (2.0 g) and 25 ml of 2- ethoxyethanol were placed in a 250 ml round bottom flask. the reaction mixture was stirred at ambient for 24 h. i g of celite and 100 ml of dichloromethane was added to the reaction mixture to dissolve the product. the mixture was then filtered through a bed of celite. the filtrate was then passed through a through a silica/alumina plug and washed with dichloromethane. the clarified solution was then filtered through gf/f filter paper the filtrate was heated to remove most of the dichloromethane. 10 ml of isopropanol was then added and the slurry was cooled to ambient and the product was filtered and washed with isopropanol and dried to give 1.0 g of crude product (57%yield). this product was then recrystallised twice using dichloromethane and isopropanol and then sublimed. device examples [0104] au devices are fabricated by high vacuum (<10 "7 torr) thermal evaporation. the anode electrode is 800 a of indium tin oxide (ito). the cathode consisted of 10 a of lif followed by 1000 a of al. all devices are encapsulated with a glass lid sealed with an epoxy resin in a nitrogen glove box (<lppm of h 2 o and o 2 ) immediately after fabrication, and a moisture getter was incorporated inside the package. [0105] particular devices are provided wherein inventive compounds, compound 1, compound 7, compound 8, compound 22, and compound 31, are the emitting dopant and hl is the host. all device examples have organic stacks consisting of sequentially, from the ito surface, 100 a of el as the hole injecting layer (hil), 300 a of 4,4'-bis[n-(l-naphthyl)- n-phenylamino]biphenyl (α-npd) as the hole transport layer (htl), 300 a of hl, a host material, doped with 7% and 10% of the invention compound, as the emissive layer (eml)(le., a% indicates the percentage of the dopant compound present in the eml), 50 a of hl as the blocking layer (bl) and 400 a of aiq 3 (tris-8-hydroxyquinoline aluminum) as the electron transport layer (etl). [0106] comparative example 1 was fabricated similarly to the device examples, except that the eml comprised hl as the host doped with 7% of el. [0107] as used herein, the following compounds have the following structures: compound 1 compound 7 compound 8 compound 22 compound 31 h1 e1 [0108] particular materials for use in an oled are provided. in particular, the materials may be used as an emitting dopant in the emissive layer of an oled are provided which may lead to devices having particularly good properties. the device structures are provided in table 2 and the corresponding measured device data is provided in table 3. devices having an emissive layer comprising compounds, 1, 7, 8, 22, and 31 show high device efficiency, reduced operating voltage and long lifetime. [0109] the following terms are used in tables 2 and 3 and are defined herein: ex. is an abbreviation for example. comp. ex. is an abbreviation for comparative example. le is luminous efficiency, which is defined as the luminance divided by the driving current density of the oled. eqe is external quantum efficiency, which is defined as the ratio of measured number of photons to the electrons passed across the junction. pe is power efficiency, which is defined as the total luminous flux emitted divided by the total power input. l 0 is the initial luminance, which is defined as the initial brightness at a certain current density. rtgoo /o is a measure of lifetime, which is defined as the time required for the initial luminance, l 0 , to decay to 80% of its value, at a constant current density of 40 ma/cm 2 at room temperature. table 2 example hil htl host a % bl etl compound 1 example 1 el iooa npd 300a hl hl 50a aiq 3 400a 7% compound 1 example 2 el 100 a npd 300a hl hl 5θa aiq 3 400a 10% compound 7 example 3 el ioo a npd 300a hl hl 50a aiq 3 400a 7% compound 7 example 4 el iooa npd 300a hl hl 50a aiq 3 400a 10% compound 8 example 5 el ioo a npd 300a hl hl 50a aiq 3 400a 7% example 6 el iooa npd 300a hl compound 8 hl 5θa aiq 3 4oθa 10% compound 22 example 7 el iooa npd 3oθa hl hl 50a aiq 3 400a 7% compound 22 example 8 el iooa npd 300a hl hl 50a aiq 3 400a 10% compound 31 example 9 el iooa npd 30θa hl hl 50a aiq 3 400a 7% compound 31 example 10 el iooa npd 300a hl hl 50a aiq 3 400a 10% comparative el 3oθa hl el 7% hl 5θa aiq 3 400a example 1 iooa npd table 3 [0110] from device examples 1-10, it can be seen that the invention compounds, compounds 1, 7, 8, 22, and 31, as emitting dopants in green phosphorescent oleds provide high device efficiency (i.e., le > 60 cd/a at 1000 cd/m2). this suggests that the novel ligand structures have a sufficiently high triplet energy for green electrophosphorescence. also of note is the high stability of devices containing invention compounds as the emitting dopant. the lifetime, rtgo % is 12o h for compound 22. thus, the invention compounds may provide devices with improved efficiency and a long lifetime. [0111] in addition, devices incorporating the inventive compounds display reduced operating voltage. for example, compound 1, compound 7, compound 8, compound 22, and compound 31 all gave a lower device voltage, 5.5 v at 1000 cd/m , 5.1 v at 1000 cd/m , 5.1 v at 1000 cd/m 2 , 5.1 v at 1000 cd/m 2 , and 5.1 v at 1000 cd/m 2 respectively) compared to el which had 6.4 v at 1000 cd/m 2 . [0112] the data suggest that these novel metal complexes containing aza dbx ligands can be excellent emitting dopants for phosphorescent oleds, providing devices having low voltage, high efficiency and long lifetime. taken together, this indicates that the novel compounds provided may be an improvement over the commonly used emitting dopants, such as ir(ppy) 3 , which display industry standards characteristics. [0113] it is understood that the various embodiments described herein are by way of example only, and are not intended to limit the scope of the invention. for example, many of the materials and structures described herein may be substituted with other materials and structures without deviating from the spirit of the invention. the present invention as claimed may therefore includes variations from the particular examples and preferred embodiments described herein, as will be apparent to one of skill in the art. it is understood that various theories as to why the invention works are not intended to be limiting.
178-869-739-752-339	US	[ "US" ]	A63B53/06,A63B53/04	2006-11-17T00:00:00	2006	[ "A63" ]	metal wood club	in one embodiment, a golf club head is presented having a sole with three recessed cavities for attachment to a hosel-bending tool. in another embodiment, a golf club head is presented having a sole that includes one predetermined contact area proximal to the toe edge of the sole. in another embodiment, a golf club head is presented having a sole in which pads of material are incorporated that may be milled to vary the relief of the sole and to modify mass characteristics of the club head. yet another embodiment presents a golf club head having a body with a cavity to receive a cartridge that has a constant density and weight.	1. a golf club head comprising: a body having a face, a sole, a crown and a skirt joining the face, sole and crown, wherein said sole includes at least three recessed cavities and at least one cutaway portion, wherein the at least three recessed cavities sized and dimensioned to match with corresponding supports on a hosel bending tool, and the cutaway portion is adapted to receive a locking mechanism located on the hosel bending tool, such that said club head is able to be fixably attached to the hosel bending tool. 2. the golf club head of claim 1 , wherein the sole further comprising a multi-relief surface. 3. the golf club head of claim 1 , wherein said cutaway portion has a first area proximal to the hitting face, wherein said first area has a first width, and a second area distal to the hitting face, wherein said second area has a width that is greater than the first width of the first area, and wherein the locking mechanism is received in the second area and is moved to the first area to retain the club head to the hosel bending tool.	related applications this application is a divisional of u.s. application ser. no. 11/850,719, filed sep. 6, 2007 now u.s. pat. no. 7,704,155, which is a continuation-in-part of u.s. application ser. no. 11/560,905, filed on nov. 17, 2006, now abandoned, which are incorporated by reference herein in their entirety. field of the invention the present invention relates to an improved golf club. more particularly, the present invention relates to a wood-type golf club head with improved physical attributes. background golf club heads come in many different forms and makes, such as wood- or metal-type (including drivers and fairway woods), iron-type (including wedge-type club heads), utility- or specialty-type, and putter-type. each of these styles has a prescribed function and make-up. the present invention relates primarily to hollow golf club heads, such as wood-type and utility-type (generally referred to herein as wood-type golf clubs). wood-type or metal-type golf club heads generally include a front or striking face, a crown, a sole and an arcuate skirt including a heel, a toe and a back. the crown and skirt are sometimes referred to as a shell. the front face interfaces with and strikes the golf ball. a plurality of grooves, sometimes referred to as “score lines,” may be provided on the face to assist in imparting spin to the ball and for decorative purposes. the crown is generally configured to have a particular look to the golfer and to provide structural rigidity for the striking face. the sole of the golf club is particularly important to the golf shot because it contacts and interacts with the ground during the swing. the complexities of golf club design are well known. the specifications for each component of the club (i.e., the club head, shaft, grip, and subcomponents thereof) directly impact the performance of the club. thus, by varying the design specifications, a golf club can be tailored to have specific performance characteristics. the design and manufacture of wood-type club heads requires careful attention to club head construction. among the many factors that must be considered are material selection, material treatment, structural integrity and overall geometrical design. exemplary geometrical design considerations include loft, lie, face angle, horizontal face bulge, vertical face roll, face size, center of gravity, sole curvature, and overall head weight. the interior design of the club head may be tailored to achieve particular characteristics, such as by including hosel or shaft attachment means, perimeter weighting on the face or body of the club head, and fillers within hollow club heads. club heads are typically formed from stainless steel, aluminum, or titanium and are cast, stamped, as by forming sheet metal with pressure, forged, or formed by a combination of any two or more of these processes. the club heads may be formed from multiple pieces that are welded or otherwise joined together to form a hollow head, as is often the case of club heads designed with inserts, such as soleplates or crown plates. the multi-piece constructions facilitate access to the cavity formed within the club head, thereby permitting the attachment of various other components to the head such as internal weights and the club shaft. the cavity may remain empty, or may be partially or completely filled, such as with foam. an adhesive may be injected into the club head to provide the correct swing weight and to collect and retain any debris that may be in the club head. in addition, due to difficulties in manufacturing one-piece club heads to high dimensional tolerances, the use of multi-piece constructions allows the manufacture of a club head to a tight set of standards. players generally seek a metal wood driver and golf ball combination that delivers maximum distance and landing accuracy. the distance a ball travels after impact is dictated by the magnitude and direction of the ball's translational velocity and the ball's rotational velocity or spin. environmental conditions, including atmospheric pressure, humidity, temperature, and wind speed, further influence the ball's flight. however, these environmental effects are beyond the control of the golf equipment manufacturer. golf ball landing accuracy is driven by a number of factors as well. some of these factors are attributed to club head design, such as center of gravity, moment of inertia and club face flexibility. known methods to enhance the weight distribution of wood-type club heads to help reduce the club from being open upon contact with the ball usually include the addition of weights to the club body. these weight elements are usually placed at specific locations, which will have a positive influence, such as increasing moment of inertia or lowering center of gravity, on the flight of the ball or to overcome a particular golfer's shortcomings. in addition to seeking to optimize the mass characteristics of club heads, players—most often highly skilled amateurs and tour professionals—may choose to customize the lie and loft angles of their clubs. see e.g., u.s. pat. nos. 6,260,250; 6,186,903 and 6,483,101. to achieve a more precise fit, the geometrical design of the club is altered by bending the hosel, thereby changing the orientation the of the club head at address position and at impact position. the known methods, however, often fail to produce predictable results due to inaccurate and inconsistent measuring of baseline loft and lie angles. as well, because most wood-type and hybrid clubs have rounded or curved soles, adjusting loft and lie angles unpredictably changes face angle; because the orientation of the club head at impact position has changed, the contact area between sole and ground at impact also changes and may force the club face open or closed, as opposed to square to the target, resulting in undesired hooking or slicing. hence, there remains a need for an accurate and repeatable system for hosel bending, and other methods of customizing the clubs for enhanced mass distribution. summary of the invention the present invention is directed to an improved weighting system for wood-type and hybrid golf clubs that allows customization of mass characteristics. in addition, the present invention is directed to a method and apparatus for adjusting loft and lie angles in a more predictable manner and reducing the change to face angle when loft and lie angles are modified. the present invention relates to a golf club head comprising a hosel and a body having a face, a sole, a crown and a skirt joining the face, sole and crown, wherein the sole contains three recesses serving as fixture locations for a loft/lie angle adjustment tool. these recesses correspond to connection recesses on a tool, such that the club head is held firmly in an upright position. two recesses are located adjacent to the hitting face, one on the toe end of the sole and one on the heal end. another recess is located on the tailing edge of the sole in a position that aligns with the center of the hitting face. a locking mechanism is provided between the tool and the club head to retain the club head fixedly to the tool during the adjustment. in another embodiment of the present invention, a golf club head comprises a hosel and body having a face, a crown, a skirt, and a sole. at address position, said sole has a contact area or region located on the edge of the cutaway portion, toward the toe side of the downward projection of the center of gravity on the sole. further, the sole of the club is slightly curved such that when the club head is placed on the ground, the toe edge and heel edge are located above the ground. in accordance with this embodiment, the lie angle of the club may be modified to be between about 44° and about 54° with no substantial shift in the position of the contact area of the sole. the sole of the club head of the present invention may also include a raised, curved portion, or sphere segment, to serve as the contact area between the sole surface and the ground plane. as in the above-described embodiment, this contact area allows loft and lie angles of the club head to be modified without causing significant change to the face angle. additionally, the sole may have a cutaway portion to create a multi-relief surface. in yet another embodiment of the present invention, the sole further comprises pads, or areas of material that may be milled, polished, shaved, or otherwise extracted to create a multi-relief sole surface. in accordance with this embodiment, a number of milling pads of varying volume and/or density may be incorporated into the sole. for example, a first pad may be located near the leading edge and roughly aligned with the center of the hitting face, a second pad may be situated at the tailing edge and roughly aligned with the center of the hitting face, a third pad may be located toward the toe end, a fourth pad may be located toward the heel end, and a fifth pad may be situated between the toe end and the center of the sole. in accordance with this embodiment, the center of gravity of the club head can be adjusted by milling or extracting mass from the first, second, third and fourth pads. the contact area between the sole and the ground plane, and hence the face angle at address and impact positions, may be adjusted by milling or extracting mass from the fifth pad. according to this aspect of the present invention, milling pads may also be disposed on the internal surface of a sole of a golf club head. preferably, four milling pads are situated on the internal surface of the sole, one toward the face and heel, one toward the back and heel, one toward the face and toe, and one toward the back and toe. similar to the previous embodiment, material may be removed from these milling pads to adjust the center of gravity of the club head. a final embodiment of the present invention teaches a golf club head comprising a hosel and a body wherein the body contains a hollow interior volume for receiving a cartridge, as taught in parent u.s. patent application ser. no. 11/560,905, previously incorporated by referenced in its entirety, wherein the cartridge has a constant density and weight so as to maintain center of gravity in a neutral position when the cartridge is inserted into the body of the club head. as discussed in the parent application, the cartridge may also have varying density, e.g., a high density end and a low density end. alternatively, the density may vary continually along its length. brief description of the drawings preferred features of the present invention are disclosed in the accompanying drawings, wherein similar reference characters denote similar elements throughout the several views, and wherein: fig. 1 is a bottom plan view of a club head of the present invention; fig. 2 is a front plan view of the club head of fig. 1 attached to a tool; fig. 3 is a heel side view of the club head of fig. 1 attached to the tool of fig. 2 ; fig. 4 is a cross-sectional view of the club head of fig. 1 , taken along b-b in fig. 2 , attached to the tool of fig. 2 ; fig. 5 is a cross-sectional view of the club head of fig. 1 , taken along c-c in fig. 3 , attached to the tool of fig. 2 ; fig. 6 is a cross-sectional view of the club head of fig. 1 , taken along d-d in fig. 3 , attached to the tool of fig. 2 ; fig. 7 is a top perspective view of the tool of fig. 2 ; fig. 8 is different top perspective view of the tool of fig. 2 on which the club head of fig. 1 is connected; fig. 9 is a cross-sectional view of the club head of fig. 4 without the tool to show a multi-relief section; fig. 10 is a front plan view of the club head of fig. 9 showing the club head at address position and having a lie angle of β 1 ; fig. 11 is a front plan view of the club head of fig. 9 showing the club head at address position and having a lie angle of β 2 ; fig. 12 is a front plan view of a golf club showing the position of the contact area of the sole in relation to the center of gravity of the club and the top of the grip; fig. 13 is a front plan view of another golf club head of the present invention; fig. 14 is a toe-side view of the club head of fig. 13 ; fig. 15 is a toe-side view of the club head of fig. 13 showing the position of the sphere segment in relation to the center of the club face; fig. 16 is a front plan view of the head and part of the shaft of a golf club showing the position of the contact area of the sphere segment in relation to the center of gravity of the club; fig. 17 is a full front plan view of the golf club of fig. 16 showing the position of the contact area of the sphere segment in relation to the center of gravity of the club and the top of the grip; fig. 18 is a bottom plan view of a club head of the present invention showing milling pads incorporated into the sole of the club head; fig. 19 is a bottom plan view of a club head of the present invention showing another configuration of milling pads incorporated into the sole of the club head; fig. 20 is another bottom plan view of the club head of fig. 19 in which material from a milling pad has been extracted; fig. 21 is a cross-sectional view of a club head of the present invention showing milling pads disposed onto the internal surface of the sole of the club head; fig. 22 is another cross-sectional view of the club head of fig. 21 , in which material from a milling pad has been extracted; fig. 23 is a bottom perspective view of another golf club head of the present invention; and fig. 24 shows a cartridge that is a component of the club head of fig. 23 . detailed description of the preferred embodiments in a first embodiment of the present invention, as illustrated in fig. 1 , golf club head 10 has hitting face 12 , hosel 14 , back 16 , sole 18 and skirt 20 . sole 18 includes three attachment points 24 a , 24 b and 24 c . as shown in figs. 2-6 , attachment points 24 a , 24 b and 24 c correspond to three posts 32 on tool 30 . an example of tool 30 is shown in more detail in figs. 7 and 8 and is preferably a machine for bending the hosels of golf club heads and thereby modifying the lie and loft angles of golf club heads. according to this embodiment, a first attachment point 24 a is located on sole 18 adjacent to hitting face 12 and toward toe 20 , a second attachment point 24 b is located on sole 18 adjacent to hitting face 12 and toward heel 22 , and a third attachment point 24 c is located toward back 16 of sole 18 , roughly aligned with the center of hitting face 12 . this configuration of three attachment points optimizes the stability of club head 10 as it rests on posts 32 , as three is the minimum number of points required to define a plane. a configuration utilizing two attachment points would not provide sufficiently stability, as an additional point would be required to create a plane on which the club head could rest; four or more attachment points would be too cumbersome and would increase the likelihood that the attachment points of the sole would not meet precisely with the posts of the tool. three attachment points, however, provide for a stable plane on which the club head may rest. as shown in figs. 2-6 , club head 10 contacts three posts 32 of tool 30 at attachment points 24 a , 24 b and 24 c . attachment points 24 a , 24 b and 24 c preferably comprise shallow cavities within the body of club head 10 into which posts 32 may be inserted and locked. as illustrated in figs. 1 and 4 - 6 , sole 18 also includes cutaway portion 28 , designed to receive locking arm 60 located on tool 30 . as best shown in fig. 1 , beginning at the end closest to face 12 (or the proximal end), cutaway portion 28 consists of a narrow aperture 28 b having a rounded edge and a constant width; moving toward the distal end, cutaway portion 28 becomes wider at neck 70 , and continues to increase in width to form opening 28 a . in this embodiment, attachment point 24 c is located at opening 28 a . as best shown in fig. 7 , locking arm 60 comprising upstanding stem 100 a and enlarged head 100 b . locking arm 60 is disposed at one end of rotating arm 62 which is rotatably attached to tool 30 at pivot 63 . also attached to pivot 63 is lever 66 . lever 66 has cam surface 67 and as lever 66 is rotated along arrow a, cam surface 67 presses rotating arm 62 and locking arm 60 downward to allow locking arm 60 to retain club head 10 , as described below. opening 28 a is wider then enlarged head 100 b of locking arm 60 , while narrow aperture 28 b is narrower than enlarged head 100 b but wide enough to accommodate stem 100 a. according to the first embodiment of the present invention, to retain/lock club head 10 to tool 30 , attachment points 24 a , 24 b and 24 c are received in posts 32 of tool 30 . enlarged head 100 b of locking arm 60 is inserted into opening 28 a of cutaway portion 28 , said locking arm projecting from movable arm 62 of tool 30 . for enlarged head 100 a to enter opening 28 a , movable arm 62 should be in position shown in fig. 7 . movable arm 62 is then moved along arrow b to move locking arm 60 toward narrow aperture 28 b to the locking position along arrow c. subsequent to moving movable arm 62 to the engaged position, club head 10 is locked firmly in place on tool 30 by moving lever 66 along arrow a, thus pushing movable arm 62 downward along arrow d, thereby pulling enlarged head 100 b downward to engage the sides of narrow aperture 28 b to retain club head 10 to tool 30 . movable arm 62 is then in the locked position as shown in fig. 8 . attachment points 24 a , 24 b and 24 c may coincide with cavities incorporated into the body of a golf club head in which weights are disposed to adjust the mass characteristics of the club head. this type of weighting system is described in parent u.s. patent application ser. no. 11/560,905, previously incorporated herein by reference in its entirety. with club head 10 secured firmly to tool 30 , as shown in fig. 8 , the loft and lie angles of club head 10 may be measured by reading hash marks 70 a and 70 b , respectively, to determine baseline values for those geometrical characteristics. alternatively, tool 30 may include position sensors and a digital display to show loft and lie angles. after initial loft and lie angles are measured, tool 30 may be used to bend hosel 14 to adjust loft and lie angles to the desired amount. according to this aspect of the present invention, hosel 14 can be adjusted by a human operator or by a pneumatic device. because attachment points 24 a , 24 b and 24 c are configured to optimize the stability of club head 10 on tool 30 , and because the attaching mechanism of posts 32 to attachment points 24 a , 24 b and 24 c and locking arm 60 to narrow aperture 28 b provides for a firm connection between club head 10 and tool 30 , the operator of tool 30 is able to exercise greater control over the bending of hosel 14 . subsequent to the bending of hosel 14 and hence the adjustment of loft and lie angles of club head 10 , the loft and lie angles may be measured again to determine the degree of adjustment that was just performed by comparing the new loft and lie angles to the baseline loft and lie angles. club head 10 may be removed from tool 30 and reattached a later time to perform subsequent loft and lie angle measurements and adjustments. attachment points 24 a , 24 b and 24 c and cutaway portion 28 allow club head 10 to be connected to tool 30 in the same position at every instance of attachment. in this way, the measurements of loft and lie angles of club head 10 are consistent and repeatable, allowing for more precise modification of loft and lie angles. sole 18 of club head 10 , as shown in fig. 1 , may also include negative relief portion 26 to create a multi-relief sole surface. fig. 9 shows the varied relief of sole 18 . sole 18 is shown substantially along the portion that would strike the ground, and is divided into three relief sections: leading section 26 adjacent to hitting face 12 , first relief section 27 , which is higher off the ground than leading section 26 , and cutaway portion 28 , discussed above. it should be appreciated by those skilled in the art that these negative relief portions 26 , 27 and 28 allow for greater ground clearance of sole 18 when club head 10 is at impact position, and strikes the ground to minimize potential drag with the ground. first relief section 27 is raised off of the ground when club head 10 is at address position with leading section 26 resting on the ground and with face 12 square to the target. the tailing edge 16 of sole 18 is also raised up off of the ground when club head 10 is at address position with the face square to the target to provide for greater ground clearance and to prevent club head 10 from digging into the ground on the backswing. fig. 9 shows the curved nature of the leading and tailing edges of sole 18 . the solid line indicates the ground plane, on which leading section 26 rests; the broken lines indicate the angles at which the leading and tailing edges of the sole curve with respect to the ground plane during the swing. referring to figs. 10 and 11 , to minimize the opening or closing of the face angle when the hosel is adjusted to alter the lie and/or loft angles, a contact area 40 can be preset or predetermined so that contact area 40 provides an area or a point where club head 10 makes contact with the ground when the lie and/or loft angles are altered within a predetermined range. this sole design allows for face angle to remain substantially undisturbed when lie and/or loft angle is adjusted. sole designs of the prior art generally provide for unpredictable face angle shift when lie and/or loft angle of the club is adjusted. because most soles in the prior art are curved and without a preset contact area, the adjustment of lie and/or loft angle and the subsequent change in orientation of the club head at address position forces the original area on the sole where the club head meets the ground plane to change to a different area of the sole. this new contact area can cause the club head to open or close relative to the target, resulting in undesired hooking and slicing. as shown in fig. 10 , contact area 40 meets the ground plane when club head 10 is at address position and face 12 is square to the target. in this configuration, shaft 42 creates a lie angle of β 1 with the ground plane. fig. 11 shows club head 10 after hosel 14 has been bent to adjust the lie angle. before bending, lie angle β 1 may be as small as about 44°. after bending, lie angle β 2 may be as large as about 55°. fig. 11 shows that contact area 40 remains the location at which sole 18 meets the ground plane, even after the hosel has been bent to adjust lie angle. because contact area 40 does not shift, club head 10 will meet the ground plane at address and impact positions at the same area as before the adjustment of lie angle, thereby preserving the face angle of club head 10 . further, adjustment of lie angle will force the angle formed between the ground plane and the invisible line between contact area 40 and the surface of the sole toward heel 22 , labeled as α 1 and α 2 in figs. 10 and 11 , respectively, to be altered. in accordance with this embodiment, α 1 , may be as small as 1° and α 2 may be as large as 9°, with no significant change in location of contact area 40 . for the same reasons, contact area 40 can also maintain a contact area with the ground when the loft angle is changed. according to another aspect of the second embodiment of the present invention and shown in fig. 12 , contact area 40 is located on sole 18 on or parallel to the x-y plane that includes the point m at the top of grip 65 and the center of gravity of club 50 , called point n. contact area 40 may be on the line that includes m and n or may be toe-ward of the intersection of said line with sole 18 . preferably, contact area 40 is located closer to the toe of club head 10 , and contact area 40 can be a contact area. this position helps to stabilize club 50 when it is supported by the hands of the golfer and is at rest in address position, as the center of gravity then behaves in a way similar to a ballast a of ship—it prevents the club from tipping or wobbling in the hands of the golfer. in an alternative embodiment of this aspect of the current invention, shown in figs. 13-17 , sole 118 of club head 110 includes contact area 140 , comprising a sphere segment. preferably, sphere segment 140 is located closer to the toe than to the heel. according to this embodiment and illustrated in figs. 16 and 17 , the sphere segment comprising contact area 140 is located on or parallel to the x-y plane that includes the point at the top of grip 165 , called e, and the center of gravity of the club, called f. more particularly, contact area 140 is located either on the line that includes e and f, which exists in plane x-y, or toe-ward of the intersection of line e-f with sole 118 and parallel to plane x-y. due to the position of the sphere segment, the angle created by contact area 140 and the surface of the sole with the ground plane, called σ in fig. 13 , can be adjusted to be between about 1° and about 9° with minimal change in face angle. the adjustment of this angle allows the lie angle of the club head to be between about 48° and about 57° without causing significant modification to face angle. this sole design also allows loft angle, called θ in fig. 14 , to be modified. club head 110 may be lofted or delofted by about 2°, again with substantially no change in face angle. fig. 15 illustrates an exemplary method for constructing the sphere segment of contact region 140 . the distance from the geometric center of hitting face 112 , called g, and the center of the sphere defined by the sphere segment 140 , called h, in the y direction is 0.48 mm toward the toe of the club head. the distance between g and h in the x direction is 7.61 mm toward the sole of the club head, and the distance in the z direction is 26.13 mm away from the face of the club head. table 1 below shows the changes in face angle of the inventive club 110 and a conventional club of the prior art, in this case the titleist 907d2 driver, when both clubs are lofted and delofted. table 1exemplaryconventional clubinventive clublofted valueface angle changeface angle change(+ lofted, − delofted)(+ closed, − open)(+ closed, − open)−2°−2.61°−0.01°0°−0.01°0.01°2°2.53°0.04° a fourth embodiment of the present invention is depicted in fig. 18 and presents sole 218 of golf club head 210 , wherein pads 46 a , 46 b , 46 c and 46 d and pad 48 are incorporated into sole 218 . pads 46 a - d and pad 240 are composed of material that may be milled, polished, shaved or otherwise extracted after initial manufacture of golf club head 210 in order to vary the relief of sole 218 and to adjust mass characteristics of club head 210 . according to an aspect of this embodiment, pads 46 a - d and pad 240 may be made of aluminum, stainless steel, carbon steel, titanium, titanium alloy, or other metals or composites. preferably, pad 46 a is located toward toe 220 and roughly centered between the edge of hitting face 212 and tailing edge 216 . pad 46 b is preferably located adjacent to the edge of hitting face 212 and roughly centered between toe 220 and heel 222 . pad 46 c is preferably located toward heel 222 and roughly centered between the edge of hitting face 212 and tailing edge 216 . pad 46 d is preferably located adjacent to tailing edge 216 and roughly centered between toe 220 and heel 222 . the surfaces of pads 46 a - d may have individual areas between 100 mm 2 and 1000 mm 2 . the depths of pads 46 a - d may be between 1 and 15 mm. by extracting material from pads 46 a - d , the mass characteristics of club head 210 may be adjusted. particularly, the center of gravity of club head 210 may be shifted toward the toe 220 , heel 222 , hitting face 212 or tailing edge 216 by strategically removing material from pads 46 a - d . players may choose the particular specifications of pads 46 a - d depending on their needs and playing styles. further, players may choose to have sole 218 customized by having pads 46 a - d and pad 240 , or the recesses left behind by the milling of the pads, painted or engraved. the sole of the current embodiment may include any combination of pads 46 a , 46 b , 46 c , 46 d or 240 . pads 46 a - d are preferably rectangular in shape, but may have any suitable shape for milling, polishing, shaving, or otherwise extracting material. figs. 19 and 20 show an example of a club head according to this aspect of the current embodiment. sole 318 of club head 310 includes pads 46 a , 46 c and 46 d . in fig. 19 , all of the pads are left intact, with no material having been extracted. this configuration provides for center of gravity s to remain neutral. in fig. 20 , pad 46 c has been milled, causing center of gravity s to shift toe-ward. in accordance with another aspect of the current embodiment, pad 240 as shown in fig. 18 is preferably located toward toe 220 , between 1.0 and 1.5 inches from the toe edge of sole 218 , and roughly centered between hitting face 212 and tailing edge 216 . pad 240 preferably has a length between 20 and 40 mm and a width between 5 and 15 mm. pad 240 preferably takes the shape of a rectangle, but may take any suitable shape for milling, polishing, shaving or otherwise extracting material. according this embodiment of the present invention, the main purpose of pad 240 is to adjust or set the contact area of sole 218 after lie and loft angles have been adjusted through the bending of hosel 214 . pad 240 functions similarly to contact areas 40 and 140 described above. after lie and loft angles are modified, the orientation of club head 210 at address position may be altered significantly, causing sole 218 to meet the ground plane at an area other than the intended contact area. this shift in contact area may cause hitting face 212 to become open or closed relative to the target. to maintain the original contact area or to ensure that sole 218 meets the ground plane in a manner that allows hitting face 212 to be square to the target at address position, pad 240 may be milled or otherwise have material removed to force the contact area into the desired location. a fifth embodiment of the present invention provides for pads of milling material to be disposed on the internal surface of the sole of a hollow-body golf club, as illustrated in figs. 21 and 22 . in this example, golf club head 410 includes four pads 75 , one pad located toward the face and heel, one pad located toward the back and heel, one pad located toward the face and toe, and one pad located toward the back and toe. it should be noted that a golf club of the current embodiment may include one to four pads, disposed to any location on the inner surface of the sole. pads 75 may be made of aluminum, stainless steel, carbon steel, titanium, titanium alloy, or other metals or composites, and may be ground, shaved, milled, or otherwise have their material extracted through an opening, such as a hitting face opening, before the hitting face insert is welded to the club head, in order to adjust the center of gravity of club head 410 . a sixth embodiment of the present invention relates to a customizable weighting system as taught in previously incorporated parent u.s. patent application ser. no. 11/560,905. in one embodiment of the '905 application, a golf club head has a coordinate system such that an x-axis is located horizontal to the club face, a y-axis is located vertical to the club face, and a z-axis is runs through the club face. as illustrated in figs. 23-24 , the club head includes a hollow interior volume 52 constructed to accommodate a cartridge 54 having the shape of a cylinder or tube. said cartridge comprises one higher density mass disposed to one end of the cartridge, creating a cartridge having a heavy end and a lighter end. said cartridge may be placed in the hollow interior volume of the club head, preferably angled downward toward the face of the club head by at least 3 degrees from a z-axis, with the heavy side toward the club face, effectively decreasing the moment of inertia of the club head and shifting the center of gravity downward, in the y-direction. alternatively, said cartridge may be placed with the lighter side toward the club face, increasing the moment of inertia of the club head and shifting the center of gravity upward in the y-direction. the following table provides a summary of the change in mass characteristics, specifically center of gravity and moment of inertia, of a cad-modeled club head and a number of prototype club heads depending on the position of the weighted cartridge within the hollow cavity of the club head. the label “weight forward” refers to a club head in which the cartridge is place with the heavier or weighted side toward the face of the club, while “weight back” refers to a club head in which the cartridge is placed with the lighter side toward the face of the club. table 2cg ycg x fromcg y fromfromgeometricgeometricgroundcentercenteri xi yi shaft axis(inch)(inch)(inch)(kg * mm 2 )(kg * mm 2 )(kg * mm 2 )cad predictionweight forward0.6890.047−0.063124232372weight back0.7050.047−0.047137247406club head 1weight forward0.6970.055−0.037weight back0.7170.051−0.020club head 2weight forward0.7010.079−0.030121229387weight back0.7130.071−0.016242423averages of 4 club headsweight forward0.7010.051−0.047122227385weight back0.7170.047−0.032131239423 the table shows that, of the club heads for which there is data, moment of inertia in the x-direction, y-direction, and about an axis defined by the shaft of the club, increases when the weighted cartridge is inserted with the weight toward the back of the club, relative to the weighted cartridge positioned with the weight toward the face. for all club heads, the “weight forward” position results in a shift of the center of gravity toward the ground plane, or downward in the y-direction. the shift in center of gravity in the horizontal, or x-direction, is minimal for each club head. alternatively, the density of cartridge 52 may vary in other ways, e.g., continually varying density instead of a heavy end and a lighter end. club head 510 of the present invention, as shown in fig. 23 , includes a body having a hollow cavity or sheath 52 in which a cartridge 54 may be inserted or removed. according to this embodiment, cartridge 54 , shown in detail in fig. 24 , has a constant density and weight. cartridge 54 may be composed of tungsten, aluminum, titanium or any other suitable material. relative to a club head in which a cartridge of the '905 application and as described above is inserted, when inserted into club head 510 , cartridge 54 allows the center of gravity of club head 510 to remain neutral. other mass characteristics of club head 510 , however, including moment of inertia, may be modified by the insertion of the cartridge into sheath 52 . preferably, the moment of inertia of club head 510 is increased upon the inclusion of cartridge 54 into sheath 52 relative to the moment of inertia of the club head without cartridge 54 . in accordance with this embodiment, cartridge 54 is preferably exposed through sole 518 , as illustrated in fig. 23 . while various descriptions of the present invention are described above, it should be understood that the various features of each embodiment could be used alone or in any combination thereof. therefore, this invention is not to be limited to only the specifically preferred embodiments depicted herein. further, it should be understood that variations and modifications within the spirit and scope of the invention might occur to those skilled in the art to which the invention pertains. accordingly, all expedient modifications readily attainable by one versed in the art from the disclosure set forth herein that are within the scope and spirit of the present invention are to be included as further embodiments of the present invention. the scope of the present invention is accordingly defined as set forth in the appended claims. other than in the operating examples, or unless otherwise expressly specified, all of the numerical ranges, amounts, values and percentages such as those for amounts of materials, and others in the specification may be read as if prefaced by the word “about” even though the term “about” may not expressly appear with the value, amount or range. accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and attached claims are approximations that may vary depending upon the desired properties sought to be obtained by the present invention. at the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. any numerical value, however, inherently contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements. furthermore, when numerical ranges of varying scope are set forth herein, it is contemplated that any combination of these values inclusive of the recited values may be used.
180-736-729-502-881	US	[ "WO", "AU", "EP", "CA", "JP", "US" ]	B01L3/00,B01L7/00,C12M1/00,C12Q1/68,G01N27/447,G01N33/50,G01N33/53,G01N33/48,G01N33/569,B01J19/00,G01N27/26	1998-02-05T00:00:00	1998	[ "B01", "C12", "G01" ]	integrated microfluidic devices	integrated microfluidic devices comprising at least an enrichment channel (10) and a main electrophoretic flowpath (12) are provided. in the subject integrated devices, the enrichment channel and the main electrophoretic flowpath are positioned so that waste fluid flows away from said main electrophoretic flowpath through a discharge outlet (6). the subject devices find use in a variety of electrophoretic applications, including clinical assays, high throughput screening for genomics and pharmaceutical applications, point-or-care in vitro diagnostics, molecular genetic analysis and nucleic acid diagnostics, cell separations, and bioresearch generally.	claims what is claimed is: 1. a method for analyzing a micromixture of first and second biological cell types using a substrate having a surface with at least one microchannel having a branched microchannel portion which is in fluid communication with an inlet and has first and second separate microchannel portions disposed in a parallel configuration, each of the first and second microchannel portions having an enrichment region and a detection region downstream of the enrichment region comprising the steps of introducing the mixture of first and second biological cell types through the inlet into the at least one microchannel, transferring electrokinetically the first and second biological cell types to the enrichment regions in each of the first and second microchannel portions, capturing the first biological cell types in the enrichment region in the first microchannel portion and capturing the second biological cell types in the enrichment region in the second microchannel portion, transporting electrokinetically the second biological cell types from the enrichment region in the first microchannel portion and away from the detection region in the first microchannel portion and transporting electrokinetically the first biological cell types from the enrichment region in the second microchannel portion and away from the detection region in the second microchannel portion, moving transporting electrokinetically the first biological cell types from the enrichment region in the first microchannel portion to the detection region in the first microchannel portion and moving transporting electrokinetically the second biological cell types from the enrichment region in the second microchannel portion to the detection region in the first microchannel portion and analyzing the first biological cell types in the detection region of the first microchannel portion and analyzing the second biological cell types in the detection region of the second microchannel portion whereby first and second biological cell types in a micromixture can be simultaneously separated from the micromixture and analyzed. 2. the method according to claim 1 wherein the capturing step includes capturing the first or second biological cell types by means of antibodies. 3. the method according to claim 1 wherein the capturing step includes capturing the first or second biological cell types by means of magnetic bodies. 4. the method according to claim 1 wherein the transporting step includes passing a wash medium through the enrichment regions of the first and second microchannel portions. 5. the method according to claim 1 wherein the moving step includes passing an elution buffer through the enrichment regions of the first and second microchannel portions. 6. the method according to claim 1 wherein the analyzing step includes detecting the presence of the first biological cell types in the detection region of the first microchannel portion and detecting the presence of the second biological cell types in the detection region of the second microchannel portion. 7. a method for nucleic acid sample clean-up using a substrate having a surface and at least one microchannel provided with an enrichment region and a working region formed in the substrate, said method comprising the steps of introducing a nucleic acid mixture having a nucleic acid portion and a waste portion into the at least one microchannel, contacting in the enrichment region the nucleic acid mixture and a plurality of affinity binding capture and release molecules to capture at least a part of the nucleic acid portion and thus separate said part of the nucleic acid portion from the waste portion wherein the waste portion of the nucleic acid mixture does not flow through the working region and transporting said part of the nucleic acid portion to the working region whereby said part of the nucleic acid portion is processed or analyzed or processed and analyzed in the working region. 8. the method according to claim 7 wherein the plurality of affinity binding capture and release molecules are bound to at least one solid support. 9. the method according to claim 8 wherein the at least one solid support includes a plurality of magnetic bodies. 10. the method according to claim 8 wherein the at least one solid support includes a plurality of paramagnetic bodies. 11. the method according to claim 7 wherein the nucleic acid portion of the nucleic acid mixture includes dna amplification reaction products. 12. the method according to claim 7 wherein the nucleic acid portion of the nucleic acid mixture includes dna sequencing reaction products. 13. the method according to claim 7 wherein the waste portion of the nucleic acid mixture includes undesired salts that contaminate nucleic acid sample processing or analysis. 14. a method for nucleic acid sample clean-up using a substrate having a surface and at least one microchannel provided with an enrichment region and a working region formed in the substrate and an affinity binding pair having complementary first and second binding members, said method comprising the steps of introducing a nucleic acid mixture having a nucleic acid portion and a waste portion into the at least one microchannel, attaching the first binding member of the affinity binding pair to the nucleic acid portion of at least some of the nucleic acid mixture to form a labelled nucleic acid portion, contacting in the enrichment region the labelled nucleic acid portion with the second binding member of the affinity binding pair which is bound to at least one solid support to capture at least a part of the labelled nucleic acid portion and form a captured nucleic acid portion, washing the captured nucleic acid portion to direct the waste portion and the nucleic acid portion excluding the captured nucleic acid portion away from the working region, releasing the captured nucleic acid portion by competitive displacement of the first binding member bound to the captured nucleic acid portion with a competitive displacing member having a higher affinity for the second binding member than the first binding member to yield a purified nucleic acid portion and transporting the purified nucleic acid portion to the working region whereby the purified nucleic acid portion is processed or analyzed or processed and analyzed in the working region. 15. the method according to claim 14 wherein the attaching step is performed after the introducing step. 16. the method according to claim 14 wherein the introducing step is performed after the attaching step. 17. the method according to claim 14 further comprising the step of amplifying the purified nucleic acid portion in the working region. 18. the method according to claim 17 wherein the amplifying step includes the step of performing pcr amplification on the purified nucleic acid portion. 19. the method according to claim 14 further comprising the step of nucleic acid sequencing the purified nucleic acid portion in the working region. 20. the method according to claim 19 wherein the nucleic acid sequencing step includes the step of dideoxy enzymatic chain- termination sequencing the purified nucleic acid portion. 21. the method according to claim 14 wherein the first binding member includes modified biotin molecule having a lower affinity than biotin to the second binding member. 22. the method according to claim 21 wherein the modified biotin molecule is dethiobiotin. 23. the method according to claim 21 wherein the modified biotin molecule is a dethiobiotin derivative. 24. the method according to claim 14 wherein the second binding member includes an avidin-based protein. 25. the method according to claim 14 wherein the at least one solid support includes a plurality of magnetic bodies. 26. the method according to claim 14 wherein the at least one solid support includes a plurality of paramagnetic bodies. 27. the method according to claim 14 wherein the competitive displacing member includes a biotin molecule. 28. the method according to claim 14 wherein the nucleic acid portion of the nucleic acid mixture includes a dna template and a sequencing primer. 29. the method according to claim 14 wherein the nucleic acid portion of the nucleic acid mixture includes a terminal dideoxynucleotide analog. 30. the method according to claim 14 wherein the nucleic acid portion of the nucleic acid mixture includes deoxynucleotide. 31. the method according to claim 14 wherein the first binding member includes dethiobiotin and wherein said second binding member includes an avidin-based protein and the competitive displacing member includes a biotin molecule, further comprising the step of performing pcr amplification on the purified nucleic acid portion in the working region.	integrated microfluidic devices background this invention relates to microfluidics, and particularly to microchannel devices in which fluids are manipulated at least in part by application of electrical fields. electrophoresis has become an indispensable tool of the biotechnology and other industries, as it is used extensively in a variety of applications, including the separation, identification and preparation of pure samples of nucleic acids, proteins, carbohydrates, the identification of a particular analyte in a complex mixture, and the like. of increasing interest in the broader field of electrophoresis is capillary electrophoresis (ce), where particular entities or species are moved through a medium in an electrophoretic chamber of capillary dimensions under the influence of an applied electric field. benefits of ce include rapid run times, high separation efficiency, small sample volumes, etc. although ce was originally carried out in capillary tubes, of increasing interest is the practice of using microchannels or trenches of capillary dimension on a planar substrate, known as microchannel electrophoresis (mce). ce and mce are increasingly finding use in a number of different applications in both basic research and industrial processes, including analytical, biomedical, pharmaceutical, environmental, molecular, biological, food and clinical applications. despite the many advantages of ce and mce, the potential benefits of these techniques have not yet been fully realized for a variety of reasons. because of the nature of the electrophoretic chambers employed in ce and mce, good results are not generally obtainable with samples having analyte concentrations of less than about 10 "6 m. this lower analyte concentration detection limit has significantly limited the potential applications for ce and mce. for example, ce and mce have not found widespread use in clinical applications, where often an analyte of interest is present in femtomolar to nanomolar concentration in a complex sample, such as blood or urine. in order to improve the detection limits of ce, different techniques have been developed, including improved sample injection procedures, such as analyte stacking (beckers & ackermans, "the effect of sample stacking for high performance capillary electrophoresis," j. chromatogr. (1993) 629: 371-378), field amplification (chien & burgi, "field amplified sample injection in high-performance capillary electrophoresis," j. chromatogr. (1991) 559: 141-152), and transient isotachophoresis (stegehuis et al , "isotachophoresis as an on-line concentration pretreatment technique in capillary electrophoresis," j. chromatogr. (1991) 538: 393-402), as well as improved sample detection procedures and "off-line" sample preparation procedures. another technique that has been developed to improve the detection limit achievable with ce has been to employ an analyte preconcentration device that is positioned directly upstream from the capillary, i.e. , in an "on-line" or "single flow path" relationship. as used herein, the term "on-line" and "single flow path" are used to refer to the relationship where all of the fluid introduced into the analyte preconcentration component, i.e. , the enriched fraction and the remaining waste fraction of the original sample volume, necessarily flows through the main electrophoretic portion of the device, i.e. , the capillary tube comprising the separation medium. a review of the various configurations that have been employed is provided in tomlinson et al. , "enhancement of concentration limits of detection in ce and ce-ms: a review of on-line sample extraction, cleanup, analyte preconcentration, and microreactor technology," j. cap. elec. (1995) 2: 247-266, and the figures provided therein. although this latter approach can provide improved results with regard to analyte detection limits, particularly with respect to the concentration limit of detection, it can have a deleterious impact on other aspects of ce, and thereby reduce the overall achievable performance. for example, analyte peak widths can be broader in on-line or single flow path devices comprising analyte preconcentrators. accordingly, there is continued interest in the development of improved ce devices capable of providing good results with samples having low concentrations of analyte, particularly analyte concentrations in the femtomolar to nanomolar range. mce devices are disclosed in u.s. 5,126,022; u.s. 5,296,114; u.s. 5, 180,480; u.s. 5, 132,012; and u.s. 4,908, 112. other references describing mce devices include harrison et al. , "micromachining a miniaturized capillary electrophoresis-based chemical analysis system on a chip," science (1992) 261 : 895; jacobsen et al , "precolumn reactions with electrophoretic analysis integrated on a microchip," anal. chem. (1994) 66: 2949; effenhauser et al. , "high-speed separation of antisense oligonucleotides on a micromachined capillary electrophoresis device," anal. chem. (1994) 66:2949; and woolley & mathies, "ultra-high-speed dna fragment separations using capillary array electrophoresis chips," p.n.a.s. usa (1994) 91: 11348. patents disclosing devices and methods for the preconcentration of analyte in a sample "on-line" prior to ce include u.s. 5,202,010; u.s. 5,246,577 and u.s. 5,340,452. a review of various methods of analyte preconcentration employed in ce is provided in tomlinson et al. , "enhancement of concentration limits of detection in ce and ce-ms: a review of on- line sample extraction, cleanup, analyte preconcentration, and microreactor technology," j. cap. elec. (1995) 2: 247-266. summary of the invention integrated electrophoretic microdevices comprising at least an enrichment channel and a main electrophoretic flowpath, as well as methods for their use in electrophoretic applications, are provided. the enrichment channel serves to enrich a particular fraction of a liquid sample for subsequent movement through the main electrophoretic flowpath. in the subject devices, the enrichment channel and electrophoretic flowpath are positioned such that waste fluid from the enrichment channel does not flow through the main electrophoretic flowpath, but instead flows through a discharge outlet. the subject devices find use in a variety of electrophoretic applications, where entities are moved through a medium in response to an applied electric field. the subject devices can be particularly useful in high throughput screening, for genomics and pharmaceutical applications such as gene discovery, drug discovery and development, and clinical development; for point-of-care in vitro diagnostics; for molecular genetic analysis and nucleic acid diagnostics; for cell separations including cell isolation and capture; and for bioresearch generally.. brief description of the drawings fig. 1 provides a diagrammatic view of an enrichment channel for use in a device according to the subject invention. fig. 2 provides a diagrammatic view of an alternative embodiment of an enrichment channel also suitable for use in the subject device. fig. 3a provides a top diagrammatic view of a device according to the subject invention. fig. 3b provides a side view of the device of fig. 3a. fig. 4 provides a diagrammatic top view of another embodiment of the subject invention. fig. 5 provides a diagrammatic view of an embodiment of the subject invention in which the enrichment channel comprises a single fluid inlet and outlet. fig. 6 provides a diagrammatic view of a device according to the subject invention in which the enrichment channel comprises an electrophoretic gel medium instead of the chromatographic material, as shown in figs. 1 and 2. fig. 7 provides a diagrammatic top view of disk shaped device according to the subject invention. fig. 8 is a flow diagram of a device as in figs. 1 or 2. fig. 9 is a flow diagram of a device as in figs. 3a, 3b. fig. 10 is a flow diagram of a device as in fig. 4. fig. 11 is a flow diagram of a device as in fig. 5. fig. 12 is a flow diagram of a device as in fig. 6. fig. 13 is a flow diagram of a device as in fig. 7. fig. 14 is a flow diagram of part of an embodiment of a device according to the invention, showing multiple inlets to the separation channel. fig. 15 is a flow diagram of an embodiment of a device according to the invention, showing an alternative configuration for the intersection between the main and secondary electrophoretic flowpaths. fig. 16 is a flow diagram of an embodiment of a device according to the invention, showing a plurality of analytical zones arranged in series downstream from the enrichment channel. fig. 17 is a flow diagram of an embodiment of a device according to the invention, showing a plurality of analytical zones arranged in parallel downstream from the enrichment channel. fig. 18 is a flow diagram of an embodiment of a device according to the invention, showing a plurality of main electrophoretic flowpaths downstream from the enrichment channel. fig. 19 is a flow diagram of an embodiment of a device according to the invention, showing a plurality of enrichment channels arranged in parallel. figs. 20 and 21 are flow diagrams of embodiments of a device according to the invention, similar to those shown in figs. 15 and 16, respectively, and additionally having a reagent flowpath for carrying a reagent from a reservoir directly to the main electrophoretic flowpath. fig. 22 is a flow diagram of an embodiment of a device according to the invention, similar to that shown in fig. 17, respectively, and additionally having a plurality of reagent flowpaths for carrying a reagent from a reservoir directly to downstream branches of the main electrophoretic flowpath. fig. 23 is a flow diagram of an embodiment of a device according to the invention, in which the enrichment medium includes coated magnetic beads. figs. 24 and 25 are flow diagrams showing embodiments of a device according to the invention, as may be used in the dna capture method described in example 7. fig. 26 is a reaction scheme showing synthesis of the 5-dethiobiotin-primer construct as described in example 7. fig. 27 is a flow diagram of an embodiment of a device according to the invention, as may be used to separate a mixture of biological entities into four different subsets, by way of .affinity-binding capture and release in affinity zones arranged in parallel. detailed description integrated electrophoretic microdevices comprising at least an enrichment channel and a main electrophoretic flowpath are provided. the enrichment channel serves to enrich a particular analyte comprising fraction of a liquid sample. the enrichment channel and main electrophoretic flowpath are positioned in the device so that waste fluid from the enrichment channel does not flow through the main electrophoretic channel, but instead flows away from the main electrophoretic flowpath through a discharge outlet. the subject devices may be used in a variety of electrophoretic applications, including clinical assay applications. in further describing the invention, the devices will first be described in general terms followed by a discussion of representative specific embodiments of the subject devices with reference to the figures. the subject device is an integrated electrophoretic microdevice. by integrated is meant that all of the components of the device, e.g. , the enrichment channel, the main electrophoretic flowpath, etc. , are present in a single, compact, readily handled unit, such as a chip, disk or the like. as the devices are electrophoretic, they are useful in a wide variety of the applications in which entities, such as molecules, particles, cells and the like are moved through a medium under the influence of an applied electric field. depending on the nature of the entities, e.g. , whether or not they carry an electrical charge, as well as the surface chemistry of the electrophoretic chamber in which the electrophoresis is carried out, the entities may be moved through the medium under the direct influence of the applied electric field or as a result of bulk fluid flow through the pathway resulting from the application of the electric field, e.g. , electroosmotic flow (eof). the microdevices will comprise a microchannel as the main electrophoretic flowpath. by microchannel is meant that the electrophoretic chamber of the main electrophoretic flowpath in which the medium is present is a conduit, e.g. , trench or channel, having a cross sectional area which provides for capillary flow through the chamber, where the chamber is present on a planar substrate, as will be described below in greater detail. according to the invention the device includes an enrichment channel that includes a sample inlet and at least one fluid outlet, and contains an enrichment medium for enriching a particular fraction of a sample; optionally, the device further includes a second fluid outlet. the purpose of the enrichment channel is to process the initial sample to enrich for a particular fraction thereof, where the particular fraction being enriched includes the analyte or analytes of interest. the enrichment channel can thus serve to selectively separate the fraction containing the target analyte from the remaining components of the initial sample volume. the target-containing fraction may be retained within the enrichment channel, and the remainder flushed out from the channel for disposal or further treatment downstream; or, alternatively, selected components may be retained within the enrichment channel, and the target-containing fraction may be permitted to pass downstream for further processing. depending on the particular application in which the device is employed, the enrichment channel can provide for a number of different functions. the enrichment channel can serve to place the analyte of interest into a smaller volume than the initial sample volume, i.e., it can serve as an analyte concentrator. furthermore, it can serve to prevent potentially interfering sample components from entering and flowing through the main electrophoretic flowpath, i.e., it can serve as a sample "clean-up" means. in addition, the enrichment channel may serve as a microreactor for preparative processes on target analyte present in a fluid sample, such as chemical, immunological, and enzymatic processes, e.g. , labeling, protein digestion, dna digestion or fragmentation, dna synthesis, and the like. . the enrichment channel may be present in the device in a variety of configurations, depending on the particular enrichment medium housed therein. the internal volume of the channel will usually range from about 1 pi to 1 ml, usually from about 1 pi to 100 nl, where the length of the channel will generally range from about 1 mm to 5 mm, usually 10 mm to 1 mm, and the cross-sectional dimensions (e.g. , width, height) will range from about 1 mm to 200 mm, usually from about 10 mm to 100 mm. the cross-sectional shape of the channel may be circular, ellipsoid, rectangular, trapezoidal, square, or other convenient configuration. a variety of different enrichment media may be present in the enrichment channel. representative enrichment medium or means include those means described in the analyte preconcentration devices disclosed in u.s. 5,202,010; u.s. 5,246,577 and u.s. 5,340,452, as well as tomlinson et al. , supra, the disclosures of which are herein incorporated by reference. specific enrichment means known in the art which may be adaptable for use in the subject integrated microchannel electrophoretic devices include: those employed in protein preconcentration devices described in kasicka & prusik, "isotachophoretic electrodesorption of proteins from an affinity adsorbent on a microscale," j. chromatogr. (1983) 273: 117128; capillary bundles comprising an affinity adsorbent as described in u.s. 5,202,101 and wo 93/05390; octadodecylsilane coated solid phases as described in cai & el rassi, "on-line preconcentration of triazine herbicides with tandem octadecyl capillaries-capillary zone electrophoresis," j. liq. chromatogr. (1992) 15: 1179-1192; solid phases coated with a metal chelating layer as described in cai & el rassi, "selective on-line preconcentration of proteins by tandem metal chelate capillaries-capillary zone electrophoresis," j. liq. chromatogr. (1993) 16:2007-2024; reversed-phase hplc solid packing materials as described in u.s. 5,246,577), protein g coated solid phases as described in cole & kennedy, "selective preconcentration for capillary zone electrophoresis using protein g immunoaffmity capillary chromatography," electrophoresis (1995) 16:549-556; meltable agarose gels as described in u.s. 5,423,966; affinity adsorbent materials as described in guzman, "biomedical applications of on-line preconcentration - capillary electrophoresis using an analyte concentrator: investigation of design options," j. liq. chromatogr. (1995) 18:3751- 3568); and solid phase reactor materials as described in u.s. 5,318,680. the disclosures of each of the above-referenced patents and other publications are hereby incorporated by reference herein. one class of enrichment media or materials that may find use as enrichment media are chromatographic media or materials, particularly sorptive phase materials. such materials include: reverse phase materials, e.g. , c8 or c18 compound coated particles; ion-exchange materials; affinity chromatographic materials in which a binding member is covalently bound to an insoluble matrix, where the binding member may group specific, e.g. , a lectin, enzyme cofactor, protein a and the like, or substance specific, e.g. , antibody or binding fragment thereof, antigen for a particular antibody of interest, oligonucleotide and the like, where the insoluble matrix to which the binding member is bound may be particles, such as porous glass, polymeric beads, magnetic beads, networks of glass strands or filaments, a plurality of narrow rods or capillaries, the wall of the channel and the like. depending on the nature of the chromatographic material employed as the enrichment means, it may be necessary to employ a retention means to keep the chromatographic material in the enrichment channel. conveniently, glass frits or plugs of agarose gel may be employed to cover the fluid outlets or inlets of the chamber, where the frits or plugs allow for fluid flow but not for particle or other insoluble matrix flow out of the enrichment channel. in embodiments where the enrichment means is a chromatographic material, typically sample will be introduced into, and allowed to flow through, the enrichment channel. as the sample flows through the enrichment channel, the analyte comprising fraction will be retained in the enrichment channel by the chromatographic material and the remaining waste portion of the sample will flow out of the channel through the waste outlet. in embodiments where the enrichment means is a bed of polymeric beads or paramagnetic beads or particles, the beads may be coated with antibodies or other target- specific affinity binding moiety, including: affinity purified monoclonal antibodies to any of a variety of mammalian cell markers, particularly human cell markers, including markers for t cells, t cell subsets, b cells, monocytes, stem cells, myeloid cells, leukocytes, and hla class ii positive cells; secondary antibodies to any of a variety of rodent cell markers, particularly mouse, rat or rabbit immunoglobulins, for isolation of b cells, t cells, and t cell subsets; uncoated or tosylactivated form for custom coating with any given biomolecule; and streptavidin-coated for use with biotinylated antibodies. paramagnetic beads or particles may be retained in the enrichment channel by application of a magnetic field. alternatively, or in addition to solid phase materials such as coated particles or other insoluble matrices as the enrichment means, one may employ a coated and/or impregnated membrane which provides for selective retention of the analyte comprising fraction of the sample while allowing the remainder of the sample to flow through the membrane and out of the enrichment means through the waste outlet. a variety of hydrophilic, hydrophobic and ion-exchange membranes have been developed for use in solid phase extraction which may find use in the subject invention. see, for example, tomlinson et al. , "novel modifications and clinical applications of preconcentration-capillary electrophoresis-mass spectrometry," j. cap. elect. (1995) 2: 97-104; and tomlinson et al. , "improved on-line membrane preconcentration-capillary electrophoresis (mpc-ce), "j. high res. chromatogr. (1995) 18:381-3. alternatively or additionally, the enrichment channel or the enrichment medium can include a porous membrane or filter. suitable materials for capturing genomic dnas and viral nucleic acids include those marketed by qiagen under the name qiamp, for analysis of blood, tissues, and viral rnas; and suitable materials for capturing dnas from plant cells and tissues include those marketed by qiagen under the name dneasy. depending on the configuration of the device, the sample can be caused to flow through the enrichment channel by any of a number of different means, and combinations of means. in some device configurations, it may be sufficient to allow the sample to flow through the device as a result of gravity forces on the sample; in some configurations, the device may be spun about a selected axis to impose a centrifugal force in a desired direction. in other embodiments, active pumping means may be employed to move sample through the enrichment channel and enrichment means housed therein. in other embodiments, magnetic forces may be applied to move the sample or to capture or immobilize a paramagnetic bead- target complex during wash and elution steps. in yet other embodiments of the subject invention, electrodes may be employed to apply an electric field which causes fluid to move through the enrichment channel. an elution liquid will then be caused to flow through the enrichment medium to release the enriched sample fraction from the material and carry it to the main electrophoretic flowpath. generally, an applied electric field will be employed to move the elution liquid through the enrichment channel. electrophoretic gel media may also be employed as enrichment means in the subject applications. gel media providing for a diversity of different sieving capabilities are known. by varying the pore size of the media, employing two or more gel media of different porosity, and/or providing for a pore size gradient and selecting the appropriate relationship between the enrichment channel and the main electrophoretic flowpath, one can ensure that only the analyte comprising fraction of interest of the initial sample enters the main electrophoretic flowpath. for example, one could have a device comprising an enrichment channel that intersects the main electrophoretic channel, where the enrichment channel comprises, in the direction of sample flow, a stacking gel of large porosity and a second gel of fine porosity, where the boundary between the gels occurs in the intersection of the enrichment channel and the main electrophoretic flowpath. in this embodiment, after sample is introduced into the stacking gel and an electric field applied to the gels in the enrichment channel, the sample components move through the stacking gel and condense into a narrow band at the gel interface in the intersection of the enrichment channel and main electrophoretic flowpath. a second electric field can then be applied to the main electrophoretic flowpath so that the narrow band of the enriched sample fraction moves into and through the main electrophoretic flowpath. alternatively, the enrichment channel could comprise a gel of gradient porosity. in this embodiment, when the band(s) of interest reaches the intersection of the enrichment channel and electrophoretic flowpath, the band(s) of interest can then be moved into and along the main electrophoretic flowpath. enrichment media that can be particularly useful for enrichment and/or purification of nucleic acids include sequence specific capture media as well as generic capture media. generic capture media include, for example: ion exchange and silica resins or membranes which nonspecifically bind nucleic acids, and which can be expected to retain substantially all the dna in a sample; immobilized single-stranded dna binding protein (ssb protein), which can be expected to bind substantially all single-stranded dna in a sample; poly-dt modified beads, which can be expected to bind substantially all the mrna in a sample. sequence specific capture media include beads, membranes or surfaces on which are immobilized any of a variety of capture molecules such as, for example: oligonucleotide probes, which can be expected to bind nucleic acids having complementary sequences in the sample; streptaviden, which can be expected to bind solution phase biotinylated probes which have hybridized with complementary sequences in the sample. suitable beads for immobilization of capture molecules include chemically or physically crosslinked gels and porous or non-porous resins such as polymeric or silica-based resins. suitable capture media for proteins include the following. suitable capture media for proteins include: ion exchange resins, including anion (e.g. , deae) and cation exchange; hydrophobic interaction compounds (e.g. , c4, c8 and c18 compounds); sulfhydryls; heparins; inherently active surfaces (e.g. , plastics, nitrocellulose blotting papers); activated plastic surfaces; aromatic dyes such as cibacron blue, remazol orange, and procion red. for carbohydrate moieties of proteins, lectins, immobilized hydrophobic octyl and phenylalkane derivatives can be suitable. for enzymes, analogs of a specific enzyme substrate-product transition-state intermediate can be suitable; for kinases, calmodulin can be suitable. suitable capture media for receptors include receptor ligand affinity compounds. as mentioned above, the enrichment channel will comprise at least one inlet and at least one outlet. of course, where there is a single inlet, the inlet must serve to admit sample to the enrichment channel at an enrichment phase of the process, and to admit an elution medium during an elution phase of the process. and where there is a single outlet, the outlet must serve to discharge the portion of the sample that has been depleted of the fraction retained by the enrichment media, and to pass to the main electrophoretic microchannel the enriched fraction during the elution phase. depending on the particular enrichment means housed in the enrichment channel, as well as the particular device configuration, the enrichment channel may have more than one fluid inlet, serving as, e.g. , sample inlet and elution buffer inlet; or the enrichment channel may have more than one outlet, serving as, e.g., waste outlet and enriched fraction fluid outlet. where the enrichment channel is in direct fluid communication with the main electrophoretic channel, i.e. , the enrichment channel and main electrophoretic flowpath are joined so that fluid flows from the enrichment channel immediately into the main electrophoretic flowpath, the enrichment channel will comprise, in addition to the waste outlet, an enriched fraction fluid outlet through which the enriched fraction of the sample flows into the main electrophoretic flowpath. when convenient, e.g. , for the introduction of wash and/or elution solvent into the enrichment channel, one or more additional fluid inlets may be provided to conduct such solvents into the enrichment channel from fluid reservoirs. to control bulk fluid flow through the enrichment channel, e.g. , to prevent waste sample from flowing into the main electrophoretic flowpath, fluid control means, e.g. , valves, membranes, etc. , may be associated with each of the inlets and outlets. where desirable for moving fluid and entities through the enrichment channel, e.g. , sample, elution buffer, reagents, reactants, wash or rinse solutions, etc. , electrodes may be provided capable of applying an electric field to the material and fluid present in the enrichment channel. the next component of the subject devices is the main electrophoretic flowpath. the main electrophoretic flowpath may have a variety of configurations, including tube-like, trench-like or other convenient configuration, where the cross-sectional shape of the flowpath may be circular, ellipsoid, square, rectangular, triangular and the like so that it forms a microchannel on the surface of the planar substrate in which it is present. the microchannel will have cross-sectional area which provides for capillary fluid flow through the microchannel, where at least one of the cross-sectional dimensions, e.g. , width, height, diameter, will be at least about 1 mm, usually at least about 10 mm, but will not exceed about 200 mm, and will usually not exceed about 100 mm. depending on the particular nature of the integrated device, the main electrophoretic flowpath may be straight, curved or another convenient configuration on the surface of the planar substrate. the main electrophoretic flowpath, as well as any additional electrophoretic flowpaths, will have associated with it at least one pair of electrodes for applying an electric field to the medium present in the flowpath. where a single pair of electrodes is employed, typically one member of the pair will be present at each end of the pathway. where convenient, a plurality of electrodes may be associated with the electrophoretic flowpath, as described in u.s. 5,126,022, the disclosure of which is herein incorporated by reference, where the plurality of electrodes can provide for precise movement of entities along the electrophoretic flowpath. the electrodes employed in the subject device may be any convenient type capable of applying an appropriate electric field to the medium present in the electrophoretic flowpath with which they are associated. critical to the subject invention is that the enrichment channel and the main electrophoretic flowpath are positioned in the device so that substantially only the enriched fraction of the sample flows through the main electrophoretic flowpath. to this end, the device will further comprise a discharge outlet for discharging a portion of sample other than the enriched fraction, e.g. , the waste portion, away from the main electrophoretic flowpath. thus, where the enrichment channel is in direct fluid communication with the main electrophoretic flowpath, the waste fluid flowpath through the enrichment channel will be in an intersecting relationship with the main electrophoretic flowpath. in other embodiments of the subject invention where the enrichment channel and main electrophoretic flowpath are connected by a second electrophoretic flowpath so that they are in indirect fluid communication, the waste flowpath through the enrichment channel does not necessarily have to be in an intersecting relationship with the main electrophoretic flowpath; the waste flowpath and main electrophoretic flowpath could be parallel to one another. the subject devices will also comprise a means for transferring the enriched fraction from the enrichment channel to the main electrophoretic flowpath. depending on the particular device configuration, the enriched fraction transfer means can be an enriched fraction fluid outlet, a secondary electrophoretic pathway, or other suitable transfer means. by having a second electrophoretic flowpath in addition to the main electrophoretic flowpath, the possibility exists to employ the second electrophoretic flowpath as a conduit for the enriched sample fraction from the enrichment channel to the main electrophoretic flowpath. in those embodiments where the waste outlet is the sole fluid outlet, the presence of a secondary electrophoretic flowpath will be essential, such that the enrichment channel and the main electrophoretic flowpath are in indirect fluid communication. in addition to the main and any secondary electrophoretic flowpath serving as an enriched sample transfer means, the subject devices may further comprise one or more additional electrophoretic flowpaths, which may or may not be of capillary dimension and may serve a variety of purposes. with devices comprising a plurality of electrophoretic flowpaths, a variety of configurations are possible, such as a branched configuration in which a plurality of electrophoretic flowpaths are in fluid communication with the main electrophoretic flowpath. see u.s. 5, 126,022, the disclosure of which is herein incorporated by reference. the main electrophoretic flowpath and/or any secondary electrophoretic flowpaths present in the device may optionally comprise, and usually will comprise, fluid reservoirs at one or both termini, i.e. , either end, of the flowpaths. where reservoirs are provided, they may serve a variety of purposes, such as a means for introducing buffer, elution solvent, reagent, rinse and wash solutions, and the like into the main electrophoretic flowpath, receiving waste fluid from the electrophoretic flowpath, and the like. another optional component that may be present in the subject devices is a waste fluid reservoir for receiving and storing the waste portion of the initial sample volume from the enrichment channel, where the waste reservoir will be in fluid communication with the discharge outlet. depending on the particular device configuration, the discharge outlet may be the same as, or distinct from, the waste outlet, and may open into a waste reservoir or provide an outlet from the device. the waste reservoir may be present in the device as a channel, compartment, or other convenient configuration which does not interfere with the other components of the device. the subject device may also optionally comprise an interface means for assisting in the introduction of sample into the sample preparation means. for example, where the sample is to be introduced by syringe into the device, the device may comprise a syringe interface which serves as a guide for the syringe needle into the device, as a seal, and the like. depending on the particular configuration and the nature of the materials from which the device is fabricated, at least in association with the main electrophoretic flowpath will be a detection region for detecting the presence of a particular species in the medium contained in the electrophoretic flowpath. at least one region of the main electrophoretic flowpath in the detection region will be fabricated from a material that is optically transparent, generally allowing light of wavelengths ranging from 180 to 1500 nm, usually 220 to 800 nm, more usually 250 to 800 nm, to have low transmission losses. suitable materials include fused silica, plastics, quartz glass, and the like. the integrated device may have any convenient configuration capable of comprising the enrichment channel and main electrophoretic flowpath, as well as any additional components. because the devices are microchannel electrophoretic devices, the electrophoretic flowpaths will be present on the surface of a planar substrate, where the substrate will usually, though not necessarily, be covered with a planar cover plate to seal the microchannels present on the surface from the environment. generally, the devices will be small, having a longest dimension in the surface plane of no more than about 200 mm, usually no more than about 100 mm so that the devices are readily handled and manipulated. as discussed above, the devices may have a variety of configurations, including parallelepiped, e.g. , credit card or chip like, disk like, syringe like or any other compact, convenient configuration. the subject devices may be fabricated from a wide variety of materials, including glass, fused silica, acrylics, thermoplastics, and the like. the various components of the integrated device may be fabricated from the same or different materials, depending on the particular use of the device, the economic concerns, solvent compatibility, optical clarity, color, mechanical strength, and the like. for example, both the planar substrate comprising the microchannel electrophoretic flowpaths and the cover plate may be fabricated from the same material, e.g. , polymefhylmethacrylate (pmma), or different materials, e.g. , a substrate of pmma and a cover plate of glass. for applications where it is desired to have a disposable integrated device, due to ease of manufacture and cost of materials, the device will typically be fabricated from a plastic. for ease of detection and fabrication, the entire device may be fabricated from a plastic material that is optically transparent, as that term is defined above. also of interest in certain applications are plastics having low surface charge under conditions of electrophoresis. particular plastics finding use include polymefhylmethacrylate, polycarbonate, polyethylene terepthalate, polystyrene or styrene copolymers, and the like. the devices may be fabricated using any convenient means, including conventional molding and casting techniques. for example, with devices prepared from a plastic material, a silica mold master which is a negative for the channel structure in the planar substrate of the device can be prepared by etching or laser micromachining. in addition to having a raised ridge which will form the channel in the substrate, the silica mold may have a raised area which will provide for a cavity into the planar substrate for housing of the enrichment channel. next, a polymer precursor formulation can be thermally cured or photopolymerized between the silica master and support planar plate, such as a glass plate. where convenient, the procedures described in u.s. 5, 110,514, the disclosure of which is herein incorporated by reference, may be employed. after the planar substrate has been fabricated, the enrichment channel may be placed into the cavity in the planar substrate and electrodes introduced where desired. finally, a cover plate may be placed over, and sealed to, the surface of the substrate, thereby forming an integrated device. the cover plate may be sealed to the substrate using any convenient means, including ultrasonic welding, adhesives, etc. generally, prior to using the subject device, a suitable first or electrophoretic medium will be introduced into the electrophoretic flowpaths or microchannels of the device, where the first medium will be different from the enrichment medium present in the enrichment channel . electrophoretic media is used herein to refer to any medium to which an electric field is applied to move species through the medium. the electrophoretic media can be conveniently introduced through the reservoirs present at the termini of the electrophoretic flowpaths or directly into the channels or chambers of the electrophoretic flowpaths prior to sealing of the cover plate to the substrate. any convenient electrophoretic medium may be employed. electrophoretic media suitable for use, depending on the particular application, include buffers, crosslinked and uncrosslinked polymeric media, organic solvents, detergents, and the like, as disclosed in barren & blanch, "dna separations by slab gel and capillary electrophoresis: theory and practice," separation and purification methods (1995) 24: 1-118, as well as in u.s. patent applications serial nos. 08/636,599 and 08/589, 150 and u.s. patent no. 5,569,364, the disclosures of which are herein incorporated by reference. of particular interest as electrophoretic media are cellulose derivatives, poly aery lamides, polyvinyl alcohols, polyethylene oxides, and the like. the subject invention will now be further described in terms of the figures. fig. 1 provides a diagrammatic view of an enrichment channel which may find use in the devices of the subject invention. enrichment channel 10 comprises side walls 1 which enclose reverse phase c18 material 2. channel 10 further comprise fluid inlets 7 and 4 and fluid outlets 5 and 6. for controlling fluid flow through the channel inlets and outlets, valves 8, 9 and 11 are provided. glass frits 3 allow for fluid flow through inlet 4 and outlet 5 but restrain reverse phase material 2 in the channel. in using this enrichment channel, sample is introduced through sample inlet 7 in the direction of flowpath 12. as sample moves through channel 10, the analyte comprising fraction is retained on reverse phase material 2 while the remaining waste fraction of the sample flows out waste outlet 6 along flowpath 13. valves 8 and 9 are closed to prevent sample from flowing or "bleeding" out inlet 4 or outlet 5. after the sample has flowed through channel 10, valve 11 is shut and valves 8 and 9 are opened. elution buffer is then introduced into channel 10 through glass frit 3 and inlet 4 in the direction of flowpath 14. as elution buffer moves through material 2, the retained fraction of the sample is released and carried with the elution buffer out enriched fraction outlet 5 through frit 3 along flowpath 15. in fig. 2, the same enrichment channel as shown in fig. 1 is depicted with the exception that reverse phase material 2 is replaced by a network of crosslinked glass filaments 16 to which binding pair member is covalently bound. fig. 3 a provides a diagrammatic top view of a credit card shaped (parallelepiped) device according to the subject invention. device 30 comprises main electrophoretic flowpath 31 having reservoir 32 at a first end and reservoir 33 at a second end. in direct fluid communication with main electrophoretic flowpath 31 is enrichment channel 34 (seen from overhead). electrodes 35 and 36 are provided for applying an electric field to the medium present in electrophoretic flowpath 31. detection region 37 is positioned over electrophoretic flowpath 31 for viewing analyte present in the medium comprised in the flowpath. a detection region can also be provided over the enrichment channel 34. although the device shown in fig. 3a comprises a single enrichment channel, additional enrichment channels could be provided in the flowpath, including in the detection region. fig. 3b provides a diagrammatic side view of the device depicted in fig. 3 a. in using this embodiment of the subject invention, sample is introduced through syringe interface 38 into enrichment channel 34, where the analyte comprising fraction of the sample is retained as the waste fraction flows out of the enrichment channel 34 through discharge outlet 39 and out of the device. elution buffer is then introduced into reservoir 32 through port 40. an electric field is then applied between electrodes 35 and 36 causing elution buffer to migrate from reservoir 32 through enrichment channel 34 and along electrophoretic flowpath 31 to reservoir 33. as the elution buffer moves through enrichment channel 34, it releases the retained analyte comprising fraction of the initial sample volume and carries it into electrophoretic flowpath 31. fig. 4 shows a diagrammatic view of an embodiment of the subject invention in which the enrichment channel 62 is separated from main electrophoretic flowpath 52 by secondary electrophoretic flowpath 55. with device 50, sample is introduced into enrichment channel 62 through syringe interface 66. as sample flows through enrichment channel 62, waste sample flows through discharge outlet 64 into waste reservoir 63. an electric field is then applied between electrodes 61 and 60 causing elution buffer present in reservoir 57 to move through enrichment channel 62, resulting in the release of analyte. analyte is then carried along secondary electrophoretic flowpath 55 along with the elution buffer. when analyte reaches intersection 51, the electric field between electrodes 60 and 61 is replaced by an electric field between electrodes 59 and 58. in this and other analogous embodiments of the subject invention, the time at which analyte reaches intersection 51 may be determined by detecting the presence of analyte in the intersection or by empirically determining the time at which the analyte should reach the intersection, based on the particular nature of the analyte, the medium in the flowpath, the strength of the electric field, and the like. following application of the electric field between electrodes 59 and 58, which are placed in reservoirs 54 and 53 respectively, the analyte moves from intersection 51 along electrophoretic flowpath 52 towards reservoir 53 and through detection region 65. fig. 5 provides a diagrammatic top view of yet another embodiment of the subject invention in which the enrichment channel comprises a single fluid inlet and outlet. device 70 comprises main electrophoretic flowpath 71 in intersecting relationship with secondary electrophoretic flowpath 73. upstream from the intersection 82 along secondary electrophoretic flowpath 73 is enrichment channel 72. in using this embodiment, sample is introduced through syringe interface 80 into enrichment channel 72, whereby the analyte comprising fraction of the sample is reversibly bound to the material present in the enrichment channel. an electric field is then applied between electrodes 81 and 79 which moves the non- reversibly bound or waste fraction of the sample out of the enrichment channel 72, along secondary electrophoretic flowpath 73, past intersection 82, and out discharge outlet 84 into waste reservoir 78. an elution buffer is then introduced into enrichment channel 72 through syringe interface 80 and an electric field applied between electrodes 81 and 79, causing elution buffer to flow through enrichment channel 72 into secondary flow electrophoretic flowpath 73, carrying analyte along with it. when analyte reaches intersection 82, the electric field between electrodes 79 and 81 is replaced by an electric field between electrodes 76 and 77, which causes analyte to move along main electrophoretic flowpath 71 and towards reservoir 74 through detection region 99. the device shown diagrammatically in fig. 6 comprises an enrichment channel having an electrophoretic enrichment means, instead of the chromatographic enrichment means of the devices of figs. 1 to 5. in device 90, sample is introduced into reservoir 96 and an electric field is applied between electrodes 87 and 88, causing the sample to migrate towards reservoir 98. as the sample migrates towards reservoir 98 it enters stacking gel 93 having a relatively large pore size and travels towards secondary gel 92 of relatively fine pore size. at interface 94, the sample components are compressed into a narrow band. at this point, the electric field between electrodes 87 and 88 is replaced by an electric field between electrodes 89 and 90, which causes the narrow band of sample components at interface 93 to migrate into main electrophoretic flowpath 95, past detection region 91 and towards reservoir 85. in device 90, instead of the stacking gel configuration, one could provide for a molecular size membrane at the region of interface 93, which can provide for selective passage of sample components below a threshold mass and retention at the membrane surface of components in excess of the threshold mass. in yet another modification of the device shown in fig. 6, present at the location of interface 93 could be an electrode by which an appropriate electric potential could be applied to maintain a sample component of interest in the region of 93, thereby providing for component concentration in the region of 93. for example, for an anionic analyte of interest, upon introduction of sample into reservoir 96 and application of an electric field between 93 and 87, in which 93 is the positive electrode and 87 the ground, the anionic will migrate towards and concentrate in the region of 93. after the analyte has concentrated in the region of electrode 93, an electric field can then be applied between 89 and 90 causing the anionic analyte to migrate towards reservoir 85. fig. 7 provides a top diagrammatic view of a disk shaped embodiment of the subject device, as opposed to the credit card shaped embodiments of figs. 3 to 6. in device 100, sample is first introduced into enrichment channel 102. an electric field is then applied between electrodes 108 and 109, moving elution buffer 103 through enrichment channel 102, whereby analyte retained in the enrichment channel 102 is released and carried with the elution buffer to intersection 114. the electric field between 108 and 109 is then replaced with an electric field between 110 and 111, causing analyte to move from intersection 114 along main electrophoretic flowpath 112, past detection region 113 and towards reservoir 107. other embodiments may be understood by reference to the flow diagrams in figs. 8 through 19, some of which correspond to embodiments shown in the sketches of figs. 1 through 7. referring, for example, to fig. 8, there is shown a flow diagram of an enrichment channel as shown in fig. 1 or fig. 2, with corresponding identification numbers. accordingly, as described with reference to figs. 1 and 2, sample enters enrichment channel 10 through sample inlet 7 by way of flowpath 12. as the sample moves through enrichment channel 10 the fraction containing the fraction of interest is retained on an enrichment medium, which may be, for example, a reverse phase c18 material (as described with reference to fig. 1) or binding pair members covalently bound to a network of glass filaments (as described with reference to fig. 2), while the remaining waste fraction flows out through waste outlet 6 along flowpath 13. after a suitable quantity of sample has flowed through enrichment channel 10, flow through inlet 7 and outlet 6 is halted, and elution buffer enters enrichment channel 10 through inlet 4 by way of flowpath 14. within enrichment channel 10 the retained fraction of interest is released into the elution buffer passing over the enrichment medium, and passes out through enriched fraction outlet 5 by way of flowpath 15. and referring to fig. 9, there is shown a flow diagram of the embodiment of a device 30 as sketched in two views in figs. 3 a, 3b and described with reference thereto. in the flow diagrams, the enrichment channel (34 in figs. 3a, 3b, 9) is represented by a square; the various reservoirs (e.g. , 32, 33 in figs. 3a, 3b, 9) are represented by small circles at the ends of the flowpaths (channels), which are represented by lines (e.g. , main electrophoretic flowpath 31 in figs. 3a, 3b, 9); electrodes (35, 36 in figs. 3a, 3b, 9) are represented by hairlines running to the centers of the reservoir circles; an interface for syringe injection (where one may be present; e.g. , 38 in figs. 3b, 9) is represented by a trapezoid at the end of the sample input flowpath; and the detection region (37 in figs. 3 a, 3b, 9) is represented by a heavy arrow touching the main electrophoretic channel. similarly, in fig. 12, there is shown a flow diagram of the embodiment of a device 90 as sketched in fig. 6 and described above with reference thereto. in this embodiment, the enrichment channel (120 in fig. 12) works by electrophoretic enrichment, which results in accumulation of the fraction of interest at the point where the enrichment channel 120 is intersected by the main electrophoretic channel 95. movement of sample material through the enrichment channel can be accomplished by application of an electrical potential difference between electrodes 87, 88; and elution of the fraction of interest from the enrichment channel through the main electrophoretic channel and to the detection region 91 can be accomplished by application of an electrical potential difference between electrodes 89, 90. as described above with reference to fig. 6, the accumulation point can be an interface 94 between a stacking gel 93 and a secondary gel 92; and in a further modification, a suitable electrical potential can be applied at an electrode (121 in fig. 12) at the site of the interface 93 to provide for component concentration in that region of the enrichment channel. fig. 10 is a flow diagram of the embodiment of a device 50 in which the enrichment channel 62 is separated from main electrophoretic flowpath 52 by secondary electrophoretic flowpath 55, as sketched in fig. 4 and described above with reference thereto. similarly, fig. 13 is a flow diagram of the disc-shaped embodiment of a device 100 as sketched in fig. 7 and described with reference thereto. fig. 13 shows the sample input flowpath by which the sample is introduced from the syringe interface 66 into the enrichment channel 102, and the discharge outlet 64 by which waste passes out to waste reservoir 63 while the fraction of interest is retained on the retention medium in the enrichment channel. these features are not shown in the top views of fig. 7 or fig. 4. in fig. 11 there is shown a flow diagram of a device 70, in which there is only one fluid inlet into, and one fluid outlet out from, the enrichment channel 72, as sketched in fig. 5 and described with reference thereto. during sample injection by way of the syringe interface the fluid inlet 116 serves as a sample inlet and the fluid outlet 118 serves as a waste outlet. while the fraction of interest is retained by the retention medium in the enrichment channel, the waste fraction flows downstream through the secondary electrophoretic flowpath 73, across the intersection 82 of the secondary electrophoretic flowpath with the main electrophoretic flowpath 71, and into discharge outlet 84, which directs the waste away from the mail electrophoretic flowpath 71 toward waste reservoir 78. during elution, elution buffer is injected by way of the syringe interface; fluid inlet 116 serves as an elution buffer inlet and the fluid outlet 118 serves as an enriched fraction outlet to the secondary electrophoretic channel. the fraction of interest moves into the elution buffer in which it is driven electrokinetically in an electric field produced by applying a voltage across electrodes 79, 81 to the intersection of the secondary electrophoretic channel and the main electrophoretic channel. once the fraction of interest has reached the intersection, a voltage is applied across electrodes 76, 77 to draw the analyte or analytes in the fraction of interest into and along the main electrophoretic flowpath to the detection zone 99. as noted with reference to fig. 5, the waste fraction (material not bound to the enrichment medium) can be washed out of the enrichment channel and away from the main electrophoretic pathway by application of an electric field between electrodes upstream from the enrichment channel and downstream from the discharge outlet. that is, prior to introducing the elution buffer to the enrichment channel, a liquid wash medium is passed over the enrichment medium and out through the discharge outlet, carrying away waste fraction components. any of a variety of materials can be suitable as a wash medium, so long as the wash medium does not substantially elute the fraction of interest from the enrichment medium. moreover, the wash medium can be chosen to facilitate a selective release or removal, prior to elution, of undesired components that may be bound to or otherwise associated with the enrichment medium. for example, where the components of interest are dna fragments, the wash medium may contain enzymes that selectively degrade proteins or polypeptides or that selectively degrade rnas, facilitating the removal of these contaminants away from the fraction of interest prior to elution. or, for example, where the components of interest are proteins, the wash medium may contain dnases and rnases. sequential movement of the various liquids into and through the enrichment channel can be readily controlled by providing a reservoir and a flowpath to the upstream part of the enrichment channel for each such liquid. as illustrated in the flow diagram of fig. 14, for example, an input 212 to enrichment channel 210 is fed by a sample supply flowpath 220 running from a sample reservoir 218, by a wash medium flowpath 218 running from a wash medium reservoir 217, and by an elution medium flowpath 216 running from an elution medium reservoir 215. movement of these materials can be selectively controlled by application of electrical potentials across electrodes (not shown the fig.) at the respective reservoirs and at suitable points (as described herein for various configurations) downstream from enrichment channel output 214. suitable wash media for proteins include, for example, ph-adjusted buffers and organic solvents; and washing can be effected by, for example, adjusting ionic strength or temperature of the wash medium. other materials may be introduced to the input flowpath as well, and, particularly, one or more reagent streams can be provided for pretreatment of the sample itself prior to moving it onto the enrichment channel. a crude sample of body fluid (blood, lymphatic fluid, amniotic fluid, cerebrospinal fluid, or urine, for example) can be pretreated by combining the sample with a reagent in the sample flowpath. for example, dna may be released from cells in a crude sample of whole blood by admixture of a reagent containing an enzyme or a detergent. other flowpath configurations downstream from the enrichment channel can be employed, and certain of these may provide some advantages for particular kinds of downstream treatment or analysis of the components of the fraction of interest. in fig. 15, for example, the secondary electrophoretic flowpath does not cross the main electrophoretic flowpath; rather, main electrophoretic flowpath 238 joins secondary electrophoretic flowpath 236 at a t intersection (compare, fig. 12). in this configuration, the upstream arm of the main electrophoretic flowpath runs in the same channel as the secondary electrophoretic flowpath 236. as in other configurations, described herein, sample enters the enrichment channel 230 by way of sample flowpath 234 from sample reservoir 233; and during the enrichment stage the waste fluid passes out from enrichment channel 230 by way of secondary electrophoretic flowpath 236, then past t intersection 237 and away through discharge outlet 240 to waste reservoir 241. once the enrichment stage is complete, a wash medium may be passed through the enrichment channel and also out through the discharge outlet. the wash medium may be introduced by way of the sample supply flowpath or, optionally, from a separate wash medium flowpath as described above with reference to fig. 14. movement of the sample and the wash medium can be accomplished by application of an electric field across electrodes (not shown in the fig.) at waste reservoir 241 and, respectively, sample reservoir 233 (and, optionally, a wash reservoir). then, an elution medium can be moved from an elution buffer reservoir 231 by way of elution buffer pathway 235 into and through enrichment channel 230, through secondary electrophoresis pathway 236. media downstream from the eluting fraction components can be directed away from main electrophoretic flowpath 238 and out by way of waste discharge flowpath 240, until the most downstream component of interest has reached the intersection 237. then an electrical potential can be applied at reservoir 239 to draw the components from secondary electrophoretic flowpath 236 through intersection 237 and within main electrophoretic flowpath 238 toward and through detection region 242. an intersection of the main and secondary electrophoretic flowpaths at an "injection cross", as shown for example in figs. 5, 12, can be advantageous where precise metering of the sample plug is desired, as for example, where the main electrophoretic flowpath is used for electrophoretic separation. such an injection cross can provide for injection from the intersection of a geometrically defined plug of sample components from the fraction of interest. on the other hand, where precise control of a sample plug is not desirable, and particularly where it is desirable to move the entire eluted sample through the main electrophoretic path way, a t intersection can be preferred. such a configuration may be advantageous where, for example, the components are analyzed by passing substantially the entire eluted fraction through an array of affinity zones downstream from the intersection. by way of example, fig. 16 is a diagram showing the flow in a configuration having a serial array of affinity zones 244, 246, 248, 250. each affinity zone is provided with an enrichment medium that has a specific affinity for a selected component of the fraction of interest. for example, the fraction of interest may consist of dna in a crude cell lysate, wherein the lysate may have been formed upstream from enrichment channel 230 and concentrated and/or purified in enrichment channel 230, so that the eluted fraction that passes into main electrophoretic flowpath 238 consists principally of a complex mixture of dna fragments of different lengths and base composition. each hybridization zone is itself an enrichment channel, in which the enrichment medium includes an immobilized oligonucleotide probe having a sequence complementary to a sequence in a target dna. as the eluted fraction passes serially through the affinity zones 244, 246, 248, 250, any target dna present in the fraction that is complementary to the probe in one of the affinity zones will become bound in that affinity zone. the affinity zones are provided with detectors 243, 245, 247, 249, configured to detect and, optionally, to quantify, a signal (such as fluorescence or electrochemilluminescence) from components of interest bound in the affinity zones. any form of biomolecular recognition may be employed as a capture principle in the affinity zones, as the skilled artisan will appreciate. useful types of affinity include antibody-antigen interactions; binding of poly-dt with adenylated rna; oligonucleotide probes for rna, dna, pna; streptavidin-biotin binding; protein-dna interactions, such as dna-binding protein g or protein a; and molecules having group specific affinities, such as arginine, benzamidine, heparin, and lectins. other examples will be apparent to the skilled artisan. accordingly, for example, the capture principle may include receptor-ligand binding, antibody-antigen binding, etc. , and thus the methods and devices according to the invention can be useful for carrying out immunoassays, receptor binding assays, and the like, as well as for nucleic acid hybridization assays. alternatively, as mentioned above, the main electrophoretic flowpath can be branched downstream from the intersection with the secondary electrophoretic flowpath, providing a parallel array of main electrophoretic flowpaths, as shown by way of example in fig. 17. electrophoretic flowpath 238 is shown as twice bifurcated, so that four main electrophoretic flowpath branches run downstream to their respective waste reservoirs 262, 264, 266, 268. the branches are provided in this example with affinity zones 254, 256, 258, 260, with detectors 253, 255, 257, 259. pertinent properties of the milieu (such as, e.g. , temperature, ph, buffer conditions, and the like) can advantageously be controlled in each flowpath branch independently of the others, as is shown in more detail with reference to fig. 22, below. where the affinity zones are arranged in parallel, as for example in fig. 17, each affinity zone receives an aliquot of the entire sample that is delivered to the main electrophoresis channel. in this embodiment, sample components that can be captured by two or more of the affinity media will appear in the respective two or more affinity zones. for example, a nucleic acid fragment that contains either one or both of two sequences complementary to two of the probe sequences will, in the parallel arrangement, be captured in the two affinity zones containing those two probes. on the other hand, where the affinity zones are serially arrayed, as for example in fig. 16, each downstream affinity zone is reached only by sample components not captured by an affinity zone upstream from it. here, for example, a nucleic acid fragment that contains both of two sequences complementary to probe sequences in two of the affinity zones will be captured only in the more upstream of the two affinity zones. this arrangement may be advantageous where it is desirable to identify sample components that contain one but not another moiety or sequence. and alternatively, as noted above, a plurality of main electrophoretic flowpaths may be provided for treatment of the enriched eluted sample. as shown by way of example in fig. 18, the main electrophoretic flowpaths 270 may carry eluted sample fraction from the secondary electrophoretic flowpath 236 through a series of intersections 272. each main electrophoretic flowpath 270 is provided with reservoirs upstream (274) and downstream (276) and each is provided with a detector 278. this configuration may be employed to run a set of tests or assays or measurements on aliquots of a single enriched sample fraction, and will be particularly useful where, as noted above, precise metering of the quantity of analyte is desirable. as will be appreciated, each of the main electrophoretic flowpaths 270 can be provided with an affinity zone or with an array of affinity zones (not shown in fig. 18) as described above with reference to figs. 16, 17. or, as shown by way of example in fig. 19, a plurality of enrichment channels 280 can receive sample from a branched sample supply manifold 281. each enrichment channel 280 can during the elution stage deliver an enriched fraction to an intersection 288 with a main electrophoretic flowpath 284. during the enrichment stage (and optionally during a wash stage) waste fraction is carried away from the intersections 288 by way of a branched discharge manifold 283 and out through discharge outlet 240 to waste 241. such an arrangement can be used to particular advantage, for example, where the fraction of interest is a mixture of dnas, and where it is desirable to obtain both sequence information and size information for the dnas. the configuration of fig. 19 can be used, for example, for a flow- through analysis analogous to a southern blot analysis. in the conventional southern blot analysis, dna fragments are first separated on a gel, and then transferred to a membrane on which probes are allowed to bind complementary fragments. the southern blot analysis is practiced mainly as a manual bench-top procedure, and is highly labor-intensive, taking several days to complete. the flow-through analysis, according to the invention, can be substantially automated, and the analysis can be completed much more rapidly. in the flow-through analysis, each but one of the enrichment channels is provided with a sequence-specific capture medium, such as a sequence-specific immobilized oligonucleotide probe, and the last one of the enrichment channels is provided with a generic capture medium which binds all dna fragments in the sample. these different enriched fractions are delivered to the intersections 288 during the elution stage, and then they are moved electrophoretically in the respective main electrophoretic flowpaths 284, each provided with a detector 286. the enriched fraction from the enrichment channel containing a generic capture medium contains a mixture of all sizes of dnas from the sample, having a range of electrophoretic mobilities, passing the detector sequentially, and resulting in a series of signal peaks. the enriched fraction from each of the other enrichment channels contains only dnas complementary to the specific capture medium in its respective enrichment channel. the use of affinity binding agents on particulate supports can, in certain configurations of flowpaths, provide for highly efficient separation of a selected subset of biological entities from among two or more subsets in a mixed population of biological entities, where each subset has a characteristic determinant. for example, several enrichment channels, or affinity zones, in each of which is held a capture agent capable of selectively binding a determinant on a subset of biological entities, can be arranged in parallel. the capture agents include a first capture agent comprising a receptor which specifically binds, either directly or indirectly, to the characteristic determinant of the first subset, and at least a second capture agent comprising a receptor which specifically binds, either directly or indirectly, to the characteristic determinant of at least one other subset. the subset to which each capture agent binds is the target subset of each capture agent. a sample of the mixed population of biological entities is contacted with the plurality of capture agents, under conditions favoring specific binding of the receptor of the first capture agent to the first subset, and of the receptor of the second capture agent to at least one other subset, where at least one of the capture agents is dissociably bound to its respective subset. the bound subsets are next separated from the sample and from any subset of the population of biological entities that is not bound to a capture agent. one of the dissociably bound subsets is thereafter dissociated from the capture agent to which it is bound, and is thereafter isolated. the isolated, selected subset is normally recovered for further processing, which may include analysis and/or propagation. these dissociation and isolation steps as described above may be repeated to yield a second or third selected subset, and so on, if desired, provided that dissociation of the one capture agent from its target subset does not result in dissociation of another capture agent from its selected target subset. according to the device and method of this embodiment of the invention, operating parameters and device configuration enable successful performance of biological and other separations not heretofore attainable. in conventional affinity separations, wherein a ligand is attached directly to a stationary solid support, such as in affinity chromatography, capture and separation of the target substance are simultaneous events. for separations using a particulate magnetic capture agent, as in an embodiment of the present invention, these two events are separate. the bifurcation of these two events according to a preferred embodiment of this invention affords significant advantages. in the method of the invention, affinity -binding reactions are coupled with respective specific cleavage reaction. thus, by creating affinity-binding/cleavage pairs, two distinct specificities for each separation procedure result. when it is desired to separate one or more selected subset of biological entities from a mixed population of such entities on a collection surface, this additional parameter allows permutations of events, such that separations which were either difficult or impossible can be carried out according to the invention with relative ease. prior to the invention, a notable obstacle to the use of particles for the separation and subsequent release of distinct, selected subsets from a mixed population of biological entities has been that the biological entities must be collected in such a manner as to allow the selected subset to be removed from the mixed population without appreciable contamination from non- selected substances. in the practice of the present invention, this difficulty is overcome in two ways. one is in the design of the integrated microfluidic device configuration. by the use of apparatus and methods described in the above-referenced u.s. ser. nos. 08/690,307 and 08/902,855, which are commonly owned with the present application, and which are incorporated by reference in the present application as if set forth herein in full, it is possible to circumvent the contamination problem. for example, a multiple parallel microchannel configuration provides for highly efficient separations. the second way involves the high degree of control that is afforded over the collection of the biological entities, such that after an individual affinity bond between the biological entity and the solid support is cleaved, which may be either before or after resuspension of the collected biological entities, a second collection of the particles results in segregation of the original mixed population with the exception of the subset of biological entities that was bound by the specific receptor which was selectively released from its target subset via bond cleavage. unlike the methods described for example in u.s. patent no. 5,646,001, which is incorporated by reference in the present application as if set forth herein in full, the present invention is not limited to the selected control and manipulation of the physiochemical environment associated with bond breaking and deposition of the captured biological substances. instead, a multiplexed microfluidic configuration provides enormous flexibility in the design of integrated devices for the separation of mixtures of biological components. thus, a combination of both approaches may be utilized in cases when multiple subsets of biological entities are to be isolated from a mixed cell population which vary greatly in frequencies. reference is now made to fig. 27, showing a configuration of flow paths in a microfluidic device according to the invention that can be used for separation of a mixture of five different biological entities (here, different cell types presenting as determinants different cell surface receptors) into four separate subsets. the separation device and method provide for efficient isolation of any of a broad range of biological entities, which may be a components of a test sample or specimen capable of selective interaction with a receptor or other specific binding substance. the term "biological entity" as used herein refers to a wide variety of substance of biological origin including cells, and cell components such as membranes, organelles, etc. , microbes, viruses, as well as molecules (e.g. , proteins) and macromolecules (e.g. , nucleic acids, including rnas, dnas and pnas). the biological entities of interest may be present in test samples or specimens of a wide range of origins, including for example biological fluids or extracts, food samples, environmental samples, etc. the term "determinant" is used here in a broad sense to denote any characteristic that identifies or determines the nature of an entity. when used in reference to any of the above- described biological entities, determinant means that portion of the biological entity involved in and responsible for selective binding to a specific binding substance, the presence of which is required for selective binding to occur. the expression "specific binding substance" as used herein refers to any substance that selectively recognizes and interacts with the characteristic determinant on a biological entity of interest, to the substantial exclusion of determinants present on biological entities that are not of interest. the capture agents used in the affinity binding separations include a specific binding agent, or receptor, attached to a solid support. the solid support may be either stationary or mobile. useful mobile solid phases include, for example, beads and particles. particulate solid supports are preferably made from magnetic material to facilitate capture of the target subsets by application of a magnetic field. in a microfluidic device configured generally as illustrated in fig. 27, and described with reference thereto, a heterogeneous mixture of biological entities is separated into sub- populations as characterized by the determinants of the constituents of the sample. as employed for isolation and purification of a subset of two or more subpopulations of cells in a mixed population in a sample, the method is simple, rapid and reliable. antibodies specific to corresponding cell surface antigens serve as capture reagents for isolating the specific targets from complex mixtures. the mixed population of biological entities may also include, but is not limited to, whole cells presenting cell surface receptors, cell membranes bearing cell surface receptors, soluble receptors, enzymes, antibodies, and specific nucleic acid sequences. thus, a wide variety of applications involving cell biology, molecular biology, tissue typing, and microbiology are therefore possible. the integrated device as shown in fig. 27 includes duplicate flow patterns configured in four parallel networks of microchannels (denoted a, b, c, and d) for illustration purposes. a highly multiplexed configuration comprising of many parallel networks (more than four) is, as will be appreciated, contemplated within the invention. similar in design to the flow configuration of fig. 15, each microfluidic network includes a capture channel (or "enrichment zone"), having specific capture reagents (in this case, immobilized antibodies), in fluid communication with two inlet and two outlet flowpaths. with reference now to network a, the inlet and outlet flow paths join the capture channel 541 at intersections 531 and 571, respectively. one inlet flowpath is supplied by sample inlet reservoir 502, which serves as the common inlet for the entire device, and microchannels 504, 506, and 511. the other inlet flowpath, specific to network a, comprises elution buffer reservoir 501 and microchannel 521. one outlet flowpath comprises of the common outlet reservoir 592 and microchannels 561, 594 and 596. the other outlet flowpath comprises the analysis channel 551, outlet reservoir 591 and the detection zone 581. the three stage cell isolation process, including affinity capture, release and detection, is initiated by injecting a complex mixture of biological cells into the multiplexed flow pattern as schematically illustrated in fig. 27. sample handling on the microfluidic device is achieved electrokinetically by controlling the electric potential across the appropriate electrodes (not shown in fig. 27) placed within the inlet and outlet reservoirs. within the enrichment zones, cells are captured by means of antibodies immobilized to the surface of the channels that recognize specific cell surface antigens. alternatively, immunomagnetic beads may be employed for cell capture. in this case, the heterogeneous suspension of cells bind the target (e.g., antibodies to cell surface antigens) by specific absorption to the particular capture moieties on the surface of the beads. immobilization of the target-bead complex to the side of enrichment chambers can then be achieved magnetically. using the device as illustrated in fig. 27, a mixture of, e.g. , six different cell types can be separated into four distinct subsets when bound to capture agents including four antibodies having different binding specificities. in this example, antibodies to cell surface antigens denoted by a, b, c, and d are immobilized in channels 541, 543, 545, and 547, respectively. as will be appreciated, each of the enrichment channels 541, 543, 545, and 547 has associated with it a corresponding set of intersecting inlet and outlet flowpaths and reservoirs, analysis channels and detection zones. thus, cells denoted a, b, c, and d arising from their respective surface antigens are captured in the above-referenced channels within the microfluidic networks a, b, c and d. the remaining cells are passed through the device and collected in the common outlet reservoir 592. the remaining cells may then be used in various applications as described further below. upon completion of the capture step, a wash medium contained within wash buffer reservoirs (not shown in the fig. 27) may be used to rinse the immobilized cells. the isolated cells captured in their respective enrichment zones can next be released and then analyzed within the detection zones 581, 583, 585, and 587 by electrokinetically pumping elution buffer from reservoirs 501, 503, 505, and 507 to the outlet reservoirs 591, 593, 595, and 597, respectively. depending on the demands of the analyses and the particular application, the detection zones may simply be an optical detector, e.g. , fluorescence detector or the like, or it may represent a further flow configuration. finally, this embodiment of the invention affords an advantageous means for isolating and enriching the target biomolecules from a sample mixture. although the affinity-capture microchannels shown in fig. 27 are in a parallel configuration, a single heterogeneous enrichment zone may alternatively be employed with a plurality of receptors (e.g. , in this case, antibodies specific to the cell surface antigens) immobilized to the affinity channel. heterogeneous capture and release methods are described in, e.g. , u.s. patent 5,646,001 to terstappen et al. , which is incorporated herein by reference in its entirety. however, an advantage of the parallel approach is that separate homogeneous capture zones minimize the physical impact on the biological entities. this is especially important when working with whole cells, which can be very sensitive to the various elution buffers and/or thermal cycling that may be required to cleave and/or dissociate the selected subset of a mixed population of biological entities. in addition, an affinity-capture method utilizing a single enrichment column with a plurality of receptors is possible only provided that the bond linking one capture agent to a selected target subset is differentially dissociable from the bond linking the other capture agents to their respective, selected target subsets, such that dissociation of the one capture agent from its target subset will not result in dissociation of another capture agent from its selected target subset. thus, precise manipulation of the physiochemical conditions (e.g. , ionic strength, ph and concentration of a particular cleaving reagent) is easier to achieve in individual microchannels of the parallel format. as a further advantage of the device and method of the invention for separating viable cells, is that in the microfluidic platform large air bubbles— detrimental to recovery of viable cells— do not form in the fluid pathway in which the cells are manipulated. a further significant advantage of the microfluidic devices and methods of the present invention includes the integrated systems capabilities which enable multiplexed cellular analyses to be performed on-line with the cell purification process. for example, a portable self-contained microfluidics cartridge similar to that illustrated schematically in fig. 27 may be employed in parallel with a conventional high gradient magnetic separation (hgms) device, as discussed below, for the rapid, quantitative and simultaneous measurement of a panel of tests to aid in the diagnosis and treatment of human disease. as an alternative to the hgms approach, a microfluidics based method and apparatus comprising a massively parallel channel configuration provides for economical, high throughput cell purification combined with integrated cellular diagnostics. in addition, this automated process is not laborious and time consuming as are conventional cell isolation methods. the present invention also broadly encompasses methods of using integrated microfluidic devices to deplete selected cells from a sample. high gradient magnetic separation (hgms) has been used for the removal of magnetically labeled cells from suspensions of bone marrow, peripheral and/or cord blood cells. see, u.s. patent nos. 5,514,340 and 5,691 ,208, which are incorporated herein by reference in their entireties. hgms methods typically involve placing a filter of fine magnetizable wires in a strong magnetic field. high gradient magnetic fields are produced around the wires, allowing the capture of even very weakly magnetic particles upon the magnetizable wires. unlike the hgms device described in u.s. 5,514,340, the present invention contemplates a microfluidic-based cell purification or cell purging apparatus and method for recovering hematopoietic stem/progenitor cells from bone marrow, peripheral and cord blood and/or hematopoietic tissue for transplantation. existing hgms methods commonly employ a three stage process to achieve cell selection. magnetically conjugated antibodies are used to specifically target the desired cells in a mixed population of cells. the noncaptured cells that have been treated in the purification process can then be used for numerous purposes, including, e.g. , bone marrow/stem cell transplantation. the integrated chip-based cell-sorting device and method includes: 1) the flow-through incubation of selected cells and antibodies specific to cell surface antigens; 2) the addition of surface-activated magnetic beads which bind with the antibodies followed by another flow-through incubation step; 3) application of a magnetic field for the affinity capture of the bead-antibody-cell complex; and 4) the magnetic release of the complex or the chemical elution/thermal dissociation of the antibody-cell surface antigen bond. the device may be employed not only to deplete but also to further analyze the unwanted "selected" cells (e.g. , t cells, tumor cells or oncotopes) from a mixed population. analyses may include, but are not limited to, cell counting, cell staining, cell sorting, cell lysis, genetic testing, competitive binding and/or "sandwich" assays employing fluorescent or other like means for detection. these assays have applications in immunodiagnostics, characterizing receptor-ligand affinity interactions and dna hybridization reactions. the release of cells from affinity matrices as described in u.s. 5,081,030, and multi- parameter cell separation using releasable colloidal magnetic particles as described in, e.g. , wo 96/31776 are incorporated herein by reference in their entireties. the invention provides means for the automated electroactive control of the fluid circuitry without requiring the use of mechanical valves, as described in u.s. 5,691,208. electrokinetic pumping methods and devices are described in, e.g. , u.s. ser. no. 08/615,642, filed march 13, 1996 (attorney docket no. a-63053-4) the disclosure of which is hereby incorporated herein by reference in its entirety. monoclonal antibodies that recognize a stage-specific antigen or immature human marrow cells and/or pluripotent lymphohematopoietic stem cells may be employed as described in, e.g. , u.s. 4,714,680, which is incorporated herein by reference in its entirety. as will be appreciated, where three or more outlet reservoirs are provided, as for example is shown in fig. 20, above, affinity capture and release can be effected, where one of the downstream reservoirs collects the purified or processed sample mixture. to provide the introduction of the selected second or competing binding pair member to release the bound entities of interest, additional input reservoirs upstream from the enrichment channel or affinity zone can be provided, as shown for example in fig. 14. the device of the invention may be used to deplete selected cells from a sample, such as cells which express cell surface antigens recognized by antibodies, preferably monoclonal antibodies. in one embodiment of the invention the method is used to deplete selected cells from cell suspensions obtained from blood and bone marrow. in particular, the method may be used to deplete tumor cells from bone marrow or blood samples harvested for autologous transplantation, or deplete t lymphocytes from bone marrow or blood samples harvested for allogeneic transplantation. the device of the invention may also be used to remove virus particles from a sample. the device and methods of the invention may be used in the processing of biological samples including bone marrow, cord blood and whole blood. the device and methods of the invention are preferably used to deplete or purge tumor cells or t lymphocytes from samples to prepare hematopoietic cell preparations for use in transplantation as well as other therapeutic methods that are readily apparent to those of skill in the art. for example, in the case of an autologous transplant, bone marrow can be harvested from a patient suffering from lymphoma or other malignancies, the sample may be substantially depleted of any tumor cells using the device and methods described herein, and the resulting hematopoietic cell preparation may be used in therapeutic methods. bone marrow or blood can also be harvested from a donor in the case of an allogenic transplant and depleted of t lymphocytes by the methods described herein. using the method of the invention it is possible to recover a highly purified preparation of hematopoietic cells. in particular, a hematopoietic cell population containing greater than 50% of the hematopoietic cells present in the original sample, and which is depleted of t lymphocytes or tumor cells in the original sample by greater than 2 logarithms may be obtained. the hematopoietic cells in the preparation are not coated with antibodies or modified making them highly suitable for transplantation and other therapeutic uses that are readily apparent to those of skill in the art. the method and device of the invention may also be used to remove red blood cells from samples such as blood and bone marrow. half of the volume of normal blood consists of mature red blood cells. typically these cells exceed nucleated cells by > 100 fold. for many clinical and research applications, removal of red blood cells with higher recovery of cells than conventional methods such as ficoll-hypaque density centrifugation. in a particular application of the invention, samples may be processed using the methods and device described herein for diagnostic flow cytometry of leukocyte subpopulations. for example, the methods may be used to prepare blood samples of patients infected with the human immuno deficiency (hiv) virus for monitoring lymphocyte populations in such patients. enumeration of the absolute numbers of leukocyte subpopulation by conventional immunofluorescence measurements and flow cytometry has been complicated by the abundant presence of red blood cells in peripheral blood and consequently, such enumeration is most often derived from separate measurements of nucleated cells numbers and immunophenotype. a variety of procedures have been proposed and are used to remove red blood cells from blood for immunophenotypic measurements but these procedures are labor intensive and difficult to automate and in some cases the procedure itself may interfere with immunofluorescence measurements. in contrast, the present invention provides an efficient and direct method for removing red blood cells from blood samples that can readily be automated as no centrifugation or wash steps are involved. specific examples of uses to which the invention may be put include: depletion of cd3 + t cells from allogeneic bone marrow using the device of the invention for the prevention of graft versus host disease (gvhd); isolation of hematopoietic progenitor cells and depletion of malignant cells in patients with b-lymphoid malignancies; removal of cd45ra+ lymphoma cells from bone marrow; purging of breast cancer cells from peripheral blood and bone marrow; purification of cd34+ cells by immunomagnetic removal of cd34- cells; depletion of murine cells that express lineage markers; immunomagnetic removal of red blood cells; cellular diagnostics - employing a microfluidic-based panel of tests; isolation of fetal nucleated erythrocytes from maternal blood; isolation of genetically modified hematopoietic stem cells and depletion of malignant cells of non-hematopoietic origin - as for gene therapy, for instance; isolation and enumeration of selected cell populations of the hematopoietic cell lineages; graft engineering for transplant; capture of dna and subsequent selective release of dna recognized by probes with specific sequences; aflp analysis; solid- phase sample clean-up of dna sequencing products employing immune release (desbiotin fluorophore); and others. in some embodiments it may be desirable to combine one or more reagents with the enriched fraction downstream from the intersection of the secondary flowpath and the main electrophoretic flowpath. fig. 20 is a flow diagram similar to one shown in fig. 15. in fig. 20 a reagent flowpath 300 carries a reagent (or reagents) from a reservoir 301 to the main electrophoretic flowpath 238, where the reagent can combine with and react with one or more analytes in the enriched fraction. and, as will be appreciated, where the main electrophoretic flowpath is branched downstream from the intersection with the secondary electrophoretic flowpath, producing subfractions in the branches, each such downstream branch can be provided with a reagent flowpath carrying reagent from a reservoir. such a configuration can provide either for replicate treatment of the subfractions with a single reagent, or for treatment of each subfraction with a different reagent, or for simultaneous treatment of subfractions with two or more reagents, each producing a particular desired result upon interaction with the analyte(s) in the enriched subfraction. figs. 21 and 22 are flow diagrams similar to those shown in figs. 16 and 17, having multiple branched main electrophoretic flowpaths, each branch provided with an affinity zone. in fig. 21 reagent flowpath 300 carries a reagent (or reagents) from a reservoir 301 to the main electrophoretic flowpath 238, where the reagent can combine with and react with one or more analytes in the enriched fraction. in this embodiment, because the reagent flowpath 300 intersects the main electrophoretic flowpath 238 at a point upstream from the first bifurcation, the reagent supplied by reservoir 301 effects a replicate treatment of all the subfractions that are treated on the downstream branches and detected in the respective affinity zones. in fig. 22, each of the downstream branches of the main electrophoretic flowpath 238 is provided with reagent flowpath (302, 304, 306, 308) each carrying a reagent from a separate reagent reservoir (303, 305, 307, 309). such a configuration can provide for different treatment of the subfractions, for example, providing independent stringency control of parallel hybridization zones. for example, devices providing flowpaths as in any of figs. 18 through 22, or a combination of these, can be used for dna profiling. more specifically, for example, restriction fragment polymorphism ("rflp") analysis can be carried out by employing a plurality of different single-locus rflp probes in reservoirs 303, 305, 307 and 309 as shown in fig. 22. by running a large number of probes in parallel, the resulting distribution of alleles should yield a rapid and representative dna profile, while significantly minimizing the possibility of random matches. the subject devices may be used in a variety of applications, where one or more electric fields are applied to a medium to move entities through the medium. representative applications include electrophoretic separation applications, nucleic acid hybridization, ligand binding, preparation applications, sequencing applications, synthesis applications, analyte identification applications, including clinical, environmental, quality control applications, and the like. thus, depending on the particular application a variety of different fluid samples may be introduced into the subject device, where representative samples include bodily fluids, environmental fluid samples, e.g. , water and the like, or other fluid samples in which the identification and/or isolation of a particular analyte is desired. depending on the particular application, a variety of different analytes may be of interest, including drugs, toxins, naturally occurring compounds such as peptides and nucleic acids, proteins, glycoproteins, organic and inorganic ions, steroids, and the like. of particular interest is the use of the subject devices in clinical applications, where the samples that may be analyzed include blood, urine, plasma, cerebrospinal fluid, tears, nasal or ear discharge, tissue lysate, saliva, ocular scratches, fine needle biopsies, and the like, where the sample may or may not need to be retreated, i.e. , combined with a solvent to decrease viscosity, decrease ionic strength, or increase solubility or buffer to a specific ph, and the like, prior to introduction into the device. for clinical applications, analytes of interest include anions, cations, small organic molecules including metabolites of drugs or xenobiotics, peptides, proteins, glycoproteins, oligosaccharides, oligonucleotides, dna, rna, lipids, steroids, cholesterols, and the like. the following examples are offered by way of illustration and not by way of limitation. example 1. high efficiency separation of organic analytes in an aqueous sample. a card as shown in fig. 4 is used in the separation of organic analytes in an aqueous sample as follows in conjunction with a device that provides for the application of appropriate electric fields through introduction of electrodes into each reservoir of the card and provides for a means of detecting analyte as it passes through detection region 65. in card 50, the enrichment channel 62 comprises porous beads coated with a c-18 phase, while the reservoirs and channels, except for the waste reservoir, comprise 20 millimolar borate buffer. a 100 ml aqueous sample is injected into enrichment channel 62 through interface 66. substantially all of the organic analyte in the sample reversibly binds to the c18 coated porous beads, while the remaining sample components flow out of enrichment channel 62 into waste reservoir 63. 10 ml of an elution buffer (90% methanol/ 10% 20 millimolar borate buffer ph 8.3) are then introduced into the enrichment channel 62 through interface 66, whereby the reversibly bound organic analyte becomes free in the elution buffer. because of the small volume of elution buffer employed, the concentration of analyte in the volume of elution buffer as compared to the analyte concentration in the original sample is increased 100 to 1000 times. the seals over reservoirs 57 and 56 are then removed and an electric field is applied between electrodes 61 and 60, causing buffer present in 57 to move towards 56, where movement of the buffer front moves the elution plug comprising the concentrated analyte to intersection 51. a voltage gradient is then applied between electrodes 58 and 59, causing the narrow band of analyte present in the volume of elution buffer to move through separation channel 52, yielding high efficiency separation of the organic analytes. the above experiment is also performed in a modified version of the device depicted in fig. 4. in the modified device, in addition to reservoir 57, the device comprises an elution buffer reservoir also in fluid communication with the enrichment channel 62. in this experiment, sample is introduced into enrichment channel 62, whereby the organic analytes present in the elution buffer reversibly bind to the c18 phase coated beads present in the enrichment channel. an electric field is applied between an electrode present in the elution buffer reservoir and electrode 60 for a limited period of time sufficient to cause 10 ml of elution buffer to migrate through the enrichment channel and release any reversibly bound organic analyte. after the elution buffer has moved into the enrichment channel, a voltage gradient is then applied between electrodes 61 and 60, resulting in the movement of buffer from 57 to 56, which carries the defined volume of organic analyte comprising elution buffer to intersection 51, as described above. example 2. sample enrichment employing paramagnetic beads for enrichment within an integrated microfluidic device. experimental protocols based on biomagnetic separation methods are provided as embodiments of the current invention. in a microfluidic device configured generally as illustrated in fig. 23, and described with reference thereto, a crude sample composed of a particular target is treated using magnetic beads, coated with an affinity medium, to capture a target having a binding affinity for the specific affinity medium. such magnetic beads are marketed, for example, by dynal, inc. new york, under the name dynabeads ® . dynabeads are superparamagnetic, monodispersed polystyrene microspheres coated with antibodies or other binding moieties that selectively bind to a target, which may be or include cells, genes, bacteria, or other biomolecules. the target-dynabead complex is then isolated using a magnet. the resulting biomagnetic separation procedure is simple, rapid and reliable, whereby the dynabeads serve as a generic enrichment medium for isolating specific targets from complex heterogeneous biological mixtures. such magnetic enrichment media may be employed according to the invention in a wide variety of applications involving cell biology, molecular biology, hla tissue typing, and microbiology, for example. two illustrative examples are provided here, specifically, methods for dna purification and cell isolation. first, the microchannel-based device is generally described, and then the method of employing dynal beads for biomagnetic separation is generally described. the integrated microfluidic device, as shown by way of example in figure 23, includes a main electrophoretic flowpath 394 coupled to an enrichment channel 382, which includes a solid phase extraction (spe) chamber 380, and which is connected to downstream waste reservoir 391. the main electrophoretic flowpath, which consists of an enriched-sample detection region 393 and fluid outlet reservoir 395, joins the secondary electrophoretic flowpath 384 at a t intersection 388. in this configuration, sample handling is achieved electrokinetically by controlling the electric potential across the appropriate electrodes placed within the inlet reservoirs for the wash 373 and elution 375 buffers and outlet reservoirs 391 and 395. the dynabeads and then the sample of interest are introduced into the device through injection inlet ports 379 and 377, respectively. within the enrichment chamber, the heterogeneous suspension of sample and dynabeads specific for a given target incubate allowing the dynabeads to bind the target by specific absorption to the particular capture moieties on the surface of the beads. immobilization of the target-bead complex to the side of enrichment chamber 380 is achieved magnetically. this is possible manually by placing a rare earth permanent magnet adjacent to the enrichment chamber. in another embodiment of the invention, an automated protocol employing electromagnetic means is used to control the applied magnetic field imposed on the spe chamber. upon completion of the magnetic immobilization step, a wash medium contained within wash buffer reservoir 373 can be moved via pathway 374 into and through enrichment channel 380. during sample rinsing, the waste fluid passes out from the enrichment chamber 380 by way of the electrophoretic flow path 384, then past the t intersection 388 and away through the discharge outlet 392 to waste reservoir 391. thus, the supernatant from the wash steps is removed from the system without having to pass the waste through the main electrophoretic channel 394. this embodiment of the invention affords an advantageous means for isolating and enriching the target biomolecule from a crude sample without first contaminating the detection region 393. example 3. dna purification from whole blood. an experimental method employing an electrophoretic microdevice as schematically represented in figure 23 is provided in which dynal ® biomagnetic beads are used as an enrichment medium for extracting and purifying genomic dna from whole blood. the source of blood may be a small dried forensic sample on a slide (e.g., on the order of a nanogram), an aliquot of freshly drawn arterial blood (as small as 10 ml) or bone marrow (approximately 5 ml). a protocol amenable to rapid dna isolation and elution will be provided for the purpose of demonstrating an automated procedure for treating whole blood on-board the device of fig. 23 so as to yield aliquots of dna for amplification and analysis or for direct analysis without amplification. the process includes the following steps: 1. reagent and sample loading; 2. cell lysis / dna capture; 3. repetitive dna washes; and 4) dna elution. each of these steps will now be discussed in more detail. for this embodiment in which commercially packaged reagents are being used, loading of the biomagnetic separation media, lysis solution and sample is achieved by means of specially designed injection ports to accommodate differences in the reagents and sample. the dynal directo reagents, which include the lysis solution and magnetic beads, are first injected directly into the solid phase extraction chamber 380 via manual injection port 379, followed by manual injection of the blood sample into the spe chamber via the injection port 377. alternatively, other commercial reagents may be used where the nuclei lysis solution and beads are not packaged together as a kit but are instead supplied separately. in this case, a lysis solution can be electrokinetically loaded into the spe chamber 380 from the inlet reservoir 371. magnetic beads, supplied for example by japan synthetic rubber, are next loaded either from the injection port 379 or electrokinetically from inlet reservoir 369. for the latter approach, the beads are confined to the chamber by electromagnetic capture, mechanical means (e.g. , membrane, mesh screen, or agarose gel plug) placed just downstream of the spe chamber in flowpath 384, or both. once the chamber is filled with beads and lysis solution, the dna sample is added via the injection port 377, or electrokinetically via a sample inlet reservoir provided with an electrode pair with an electrode downstream from the chamber. within the enrichment chamber, the blood sample, lysis solution and dynabeads are allowed to incubate for five minutes during which the cells are lysed. released nucleic acids can then absorb to the capture moieties immobilized on the surface of the microparticles to form a dna-bead complex. to enhance cell lysis, mixing can be achieved by, for example, arranging the supply channels so that the streams of beads, sample, and lysis solution merge. mixing can be enhanced electrokinetically by judicious control of the applied electric field. by periodically reversing the polarity of the electrodes placed in the inlet and outlet reservoirs 371 and 391, respectively, it is possible to electrokinetically move the blood-lysis buffer mixture in an oscillatory manner within the spe chamber. to increase further the mechanical shear applied to the cells, aperture-like structures can be molded into the spe chamber housing. following the magnetic isolation and capture of the dna-bead complex at the side of the spe chamber, rinsing is achieved by electrokinetic transport of the wash buffer solution contained in reservoir 373 through the chamber and out to the waste reservoir 391. after this 45 second rinse, the beads are resuspended into solution by releasing the magnetic field and then allowed to incubate for one minute in the wash buffer. following the same protocol, rinsing is repeated two more times, allowing the cell lysate and supernatant from each of the wash steps to be removed from the system without having to pass the waste, including pcr inhibitors, through the main electrophoretic channel 394. the final step of the purification process is dna elution. again, the capture beads with bound dna are immobilized electromagnetically before the elution buffer is electrokinetically transported from reservoir 373 into the spe chamber. to obtain quantitative elution, precise manipulation of electrode potentials is necessary, not to allow the buffer to pass through the chamber and thus prematurely wash away the purified dna. alternatively, a plug of elution buffer may be moved into the chamber by employing an injection cross (not shown in fig. 23) as described in d. benvegnu et al. u.s. patent application serial no. 08/878,447, filed june 18, 1997. with the elution buffer in the spe chamber, the beads are resuspended by releasing the magnetic field and then allowed to incubate in the elution buffer for two minutes allowing for finite dna desorption kinetics. upon completion of dna elution, the beads are immobilized electromagnetically in the sp chamber and the purified dna is electrokinetically injected as a plug into the main electrophoretic channel 394 for analysis. the detection region 395 can represent an elaborate microfluidic system (not shown in fig. 23) which may be comprised of a plurality of microchannels for restriction enzyme digestion, blot hybridizations, including southern and slot/dot blots, electrophoretic fragment sizing, and quantitative pcr analysis, among others. these embodiments of the invention will not, however, be discussed further in this example. in summary, the above protocol allows for isolation of pcr- ready aliquots of purified dna in less than ten minutes and without user intervention once the crude sample is introduced to the microfluidic device. other advantages of the method include the minute amount of reagents that are consumed in a given experiment, in addition to not requiring more labor intensive precipitation or centrifugation steps. add others. example 4. cell enrichment employing immunomagnetic isolation. an experimental protocol where dynal ® biomagnetic beads are used as an enrichment medium for isolating cell targets is provided. the procedure is similar to that described above for dna purification. as in example 3, the target is selectively captured by beads coated with specific binding moieties immobilized on the surface of the paramagnetic microparticles. dynabeads are available prepared in various forms, as follows: 1. precoated with affinity purified monoclonal antibodies to many human cell markers, including t cells, t cell subsets, b cells, monocytes, stem cells, myeloid cells, leukocytes and hla class ii positive cells; 2. coated with secondary antibodies to mouse, rat, or rabbit immunoglobulins for the isolation of rodent b cells, t cells and t cell subsets; 3. in uncoated or tosylactivated form for custom coating with any given biomolecule; or 4. in streptavidin-coated form for use with biotinylated antibodies. in a microfluidic device configured generally as illustrated in fig. 23, a heterogeneous suspension of cells is treated employing electrokinetic and magnetic manipulation methods to prepare purified aliquots of cells for further processing and analysis. biomagnetic separation is possible manually or in an automated format employing electromagnetic control of the magnetic field imposed on the spe chamber. the following four step protocol is provided as a representative embodiment of the invention. 1. loading of target cells and reagents, including biomagnetic separation media: load the solution of magnetic beads into spe chamber 380, either directly via injection port 379, or electrokinetically from the inlet reservoir 371 containing, solution of dynal beads specific to a given target; or add sample directly to spe chamber filled with solution of dynabeads by means of sample injection port 377. 2. cell capture employing dynabeads capable of binding specific target: allow sample and beads to incubate for 2.5 minutes within the spe chamber, enhance adsoφtion by employing an electrokinetic mixing step, target cells bind to dynabeads to form target-bead complex. 3. target cell wash by immobilizing the bead-target cell complex: electromagnetically immobilize capture beads that contain the bound target, rinse with wash buffer solution by electrokinetic manipulation: remove supernatant by controlling electrode potentials so as to pass wash buffer from inlet reservoir 373 through the sp chamber to waste outlet 391, stop the flow after 45 seconds and resuspend target-bead complex into solution by releasing magnetic field, incubate the target-bead complex in wash buffer for one minute, repeat above wash steps two more times. 4. target cell elution employing dynal' s detachabeado reagents: immobilize capture beads electromagnetically, load the detachabeado solution into sp chamber 380: electrokinetically move the dynal antibody-based reagent from the elution buffer reservoir 373 by manipulation of electrode potentials to avoid allowing the elution buffer to pass through the chamber, or, alternatively, an injection cross (not shown in figure 22) can be used to inject a plug of elution buffer into the sp chamber, resuspend beads by releasing magnetic field, incubate suspended beads in elution buffer for two minutes to allow for finite desorption kinetics, upon completion of target elution, immobilize beads electromagnetically isolated target cells can be electrokinetically transported from the spe chamber into the main electrophoretic channel for further treatment and analysis. cell separations employing microfluidic devices and methods provide a cost-effective alternative to conventional flow cytometry techniques. in addition, when combined with biomagnetic separation technology, microfluidic approaches enable cell enrichment and detection that yield increased sensitivity and reduced background noise. microfluidic-based magnetic isolation methods subject the target substances to minimal stress, and can accordingly leave cells intact and viable, ready for direct use in reverse transcription coupled with polymerase chain reaction amplification (rt-pcr). microfluidic-based methods employ no phenol extractions, ethanol precipitations, or centrifugations, and employ few toxic reagents. separations are provided without the use of expensive equipment and are highly scalable. example 5. tools for cost effective disease management as gene therapies move from the bench to the bedside, therapeutics and diagnostics will become more intimately interlinked. consequently, monitoring the efficacy of dna-based pharmaceuticals using bioinstruments at the bedside will become crucial to insuring the success of these treatments. more specifically, a microfluidic-based device for integrating cell collection and isolation processes with emerging molecular methods for dna amplification and detection hold great promise for addressing this market need. thus by combining methods as described in this application (particularly examples 3 and 4), it is possible to have in one analytical instrument the capability of cost-efficient disease prognosis and monitoring for helping the physician evaluate the appropriateness of a given genetic therapy. such effective disease management strategies, in addition to other pharmacogenetic approaches, have the potential for widespread use as the post-genomic era rapidly approaches. for the purpose of illustrating this embodiment of the invention, a system for managing blood-based diseases will be presented. for background puφoses, inherited blood disorders are the most common genetic diseases affecting humans. the world health organization estimates that about 5% of the world's population are carriers of different types of hemoglobin disorders and that about 300,000 new cases are diagnosed each year. sickle cell anemia and ,b-thallasemia are the two most common hemoglobinopathies that may be treated using gene therapies. of particular interest in treating the hemoglobinopathies, as well as monitoring the progress of their treatment, is the collection and isolation of hematopoietic stem cells. employing the microfluidic device as shown in figure 22, when combined with the use of dynal reagents for human hematopoietic progenitor cell selection as described in example 4, a rapid and simple-to-use method for achieving the desired stem cell isolation is possible. for example, 1 ml of dynabeads m-450 cd34 will isolate approximately 8 x 10 7 cells. 100 ml (one unit) of detachabead cd34 is used to detach 4 x 10 7 (100 ml) dynabeads m-450 cd34. cells isolated with this progenitor cell selection system are pure (95 % from bone marrow, 90 % from peripheral and cord blood) and phenotypically unaltered. on the same device, dna analysis, including gene expression monitoring, is possible employing molecular genetic methods once the stem cells are isolated and then lysed. thus, microfluidic-based bioanalytical devices and methods, as described in this embodiment of the invention, should prove to be invaluable tools for disease management at this emerging molecular medicine and diagnostics interface. example 6. solid-phase isolation and enrichment solid phase extraction (sp) of a particular target from a heterogeneous mixture is achieved in the following embodiment of the invention by employing the selective surface properties of target-specific microparticles and mechanical means for retention of the beads within the sp chamber. although biomagnetic separation methods are currently attractive because commercial reagents are readily available for a wide variety of bioresearch applications, other non-magnetic microfluidic-based approaches are possible for achieving comparable separations. in similar embodiments to those provided above, solid phase enrichment in a microfluidic format is presented. beads with target- specific binding moieties can be retained within the enrichment chamber utilizing mechanical means, including filtration membranes or mesh screens. in addition, an agarose gel may be injected (from the waste reservoir 391 prior to the experiment) into channel 384 at the outlet of the enrichment chamber 380 to prevent the beads from escaping, yet allowing the wash and elution buffers to pass through the highly porous media. thus, each of the embodiments described in example 2 for target isolation and purification from complex mixtures may be achieved, at least conceptually, without requiring the use of magnetic fields. example 7 in this example affinity -binding capture and release is employed to collect and then release and separate biological entities of interest in a sample. here the biological entity is bound to one member of an affinity binding pair, and is captured in an enrichment zone by affinity binding with the other member on a solid support. the enriched captures biological entity is then released, for example, by competitive displacement of the binding pair by a binding pair member having a higher affinity. in particular, for example, the biological entity of interest may be dna. generally, the method proceed as follows. one member of an affinity binding pair is attached at the 5' end of a selected oligonucleotide sequencing primer, which may be about 10 - 30 bases in length, usually about 15 - 25 bases, or about 20 bases in length, to form a functionalized primer. the dna of interest is combined with the functionalized primer in the presence of nucleotides under conditions favoring extension of the primer to form dnas, complementary to the dna of interest, and amplifying specific portions of the dna. a dye terminator can be employed in the reaction to provide a chromophore for fluorescence detection of the amplified dna portions. each resulting amplified dna has a functional group at the 5' end of each strand, and carries the chromophore. this sequencing reaction can be conducted outside the device, and the amplified dna can be introduced to the enrichment channel by way of an inlet port; or the reaction can be conducted on the device itself. the other member of the binding pair is then attached to a solid surface, so that when the functionalized dnas are brought into contact with the solid surface under conditions favoring affinity binding of the binding pair members, the dnas are captured on the solid phase. according to the invention, the solid phase may be particles or beads, which can themselves be manipulated into, within, and out from the channels or chambers of the device. release of the captured dnas is then effected by introducing a binding pair member that has a significantly higher affinity, with the result that it displaces either the binding pair member on the functionalized dnas, or the binding pair member on the solid support. this results in freeing the dnas of interest, which can then flow out from the enrichment channel to a separation channel. any of a variety of affinity binding pairs may be used. for example, an avidin-biotin system may be employed. avidin is attached to the solid support, and a modified biotin, having a significantly lower affinity for avidin than unmodified biotin, is attached to the oligonucleotide primer. amplification is carried out, and then the amplified dnas are captured in the device by binding of the modified biotin to the avidin on the solid support. then release of the dnas is effected by introducing biotin into the enrichment channel to displace the modified biotin, and the dnas are moved out from the enrichment channel. in an illustrative example, the functionalized oligonucleotide primer is-the m13/puc forward 23-base sequencing primer, with dethiobiotin attached at the 5' end, to form: dethiobiotin-5 ' -cccag tcacg acgtt gtaa a acg-3 ' a general method of attaching dethiobiotin molecule to an oligonucleotide is shown in fig. 26. briefly, n-hydroxysuccinimidodedliobiotin (k. ilofmann et al. (1982), biochemistry, vol. 21, page 978) (0.1 mmole) was reacted with 5'amino-modifier c6 t (glen research; 0.1 mole) as shown fig. 26, to form dethiobiotin. to prepare the dethiobiotin-functionalized primer, the dethiobiotin was introduced by using dethiobiotin amidite ([2] in fig. 26) in the last step of the oligonucleotide synthesis on a dna synthesizer. after cleavage from the solid support and removal of the base protecting groups the dethiobiotin conjugated primers were used in the sequencing reactions. following amplification the amplified dnas include a dethiobiotin functional group at the end of each strand of dna. referring now to fig. 24, the dna sequencing products in the sample can be added to sample inlet port 437. a filter or membrane material may be located at the bottom of the port to restrict access of particulate matter from sample enrichment medium 432 that is confined within sample enrichment channel 431. preferably, the channels making up the device are located within a plane of the device, while the sample is introduced into the device from outside the plane of the device (for example, from above), and the treated sample and/or wastes may leave the enrichment zone from any dimension. in the embodiments shown in figs. 24 and 25 the treated sample leaves the enrichment zone through the waste fluid outlet 433 below the plane of the device. all the reservoirs 435, 436, 434, 438, 440 contain buffer, while reservoir 435 additionally contains biotin in an amount in the range 10 mmolar to 1000 mmolar. the flow through the enrichment zone can be controlled by application of a pressure gradient between the inlet 437 and the waste fluid outlet 433. alternatively, the sample can be migrated through the enrichment zone by application of an electric field between the sample inlet and a waste fluid reservoir. beads or particles are coated with the protein carboxyavidin , which has a strong affinity for dethiobiotin, and therefore will selectively enrich that component of the sample. the enrichment zone can be rinsed by application of an electrical potential between reservoirs 436 and either 433 or 438. following capture of the dna sample, biotin located in reservoir 435 is moved through the enrichment zone by application of an electric field between reservoirs 435 and 438. biotin has significantly greater affinity for the carboxyevidin molecule than does dethiobiotin (kd = 10 "15 m for biotin, vs. 10 " " m for dethiobiotin), and consequently it displaces the dna of interest from the beads in the enrichment zone. injection of the released dnas into the main electrophoresis channel 441 is performed by switching the electric field for about 5 seconds to reservoirs 435 and 440. this causes a portion of the released dna to migrate into the separation media within separation channel 441. changing the electric field between 434 and 440 results in separation of the dna in the main electrophoresis channel. the separation is detected at an optical detector 439. in an alternative embodiment, differing in the arrangement of channels downstream from the enrichment channel, dna is moved toward reservoir 440 until a representative sampling is available at the inlet to the main separation channel 441. injection of the dna is accomplished by simply switching the electric field to reservoirs 438 and 434 to perform the separation of dna for detection at 439. it is evident from the above results and discussion that convenient, integrated microchannel electrophoretic devices are disclosed which provide for significant advantages over currently available ce and mce devices. because the subject devices comprise microchannels as electrophoretic flowpaths, they provide for all of the benefits of ce and mce devices, including rapid run times, the ability to use small sample volumes, high separation efficiency, and the like. since the subject integrated devices comprise an enrichment channel, they can be employed for the analysis of complex sample matrices comprising analyte concentrations in the femtomolar to nanomolar range. however, because of the particular positional relationship of the enrichment channel and the main electrophoretic flowpath, the shortcomings of on-line configurations, such as band broadening and the like, do not occur in the subject devices. as the subject devices are integrated and compact, they are easy to handle and can be readily used with automated devices. finally, with the appropriate selection of materials, the devices can be fabricated so as to be disposable. because of their versatility and the sensitivity they provide, the subject devices are suitable for use in a wide variety of applications, including clinical electrophoretic assays. all publications and patent applications mentioned in this specification are herein incoφorated by reference to the same extent as if each individual publication or patent application was specifically and individually indicated to be incoφorated by reference. the invention now being fully described, it will be apparent to one of ordinary skill in the art that many changes and modifications can be made thereto without departing from the spirit or scope of the appended claims.
183-009-842-281-249	FR	[ "GB", "US", "FR", "WO", "CA" ]	G01N33/38	2010-10-12T00:00:00	2010	[ "G01" ]	measurements of properties of sample of curing compositions under high pressure	the invention relates to a method for testing a curing composition, comprising: providing a curing composition; injecting the curing composition into a mold (10, 20); curing the curing composition into a cured composition, in the mold (10, 20) at a controlled curing pressure; measuring at least one physical or mechanical property of the cured sample at a controlled test pressure, in the mold (10, 20); the mold (10, 20) being rigid relatively to the cured sample during the curing step. the invention also relates to a device adapted for applying this method.	1. a method for testing a curing composition, the method comprising: (a) providing a curing composition; (b) injecting the curing composition into a hollow body of a mold so that the curing composition contacts the hollow body, the hollow body having a main axis and comprising: a flexible internal layer radially deformable to the main axis when subjected to a controlled test pressure; and a rigid external wall adapted to be in contact with the flexible internal layer in a removable way; (c) curing the curing composition into a cured sample, in the mold, at a controlled curing pressure; (d) wherein the flexible internal layer is not capable of deforming radially to the main axis when subjected to the controlled curing pressure during the curing step due to the support of the rigid internal wall; (e) removing the rigid external wall; and (f) measuring at least one physical or mechanical property of the cured sample at a controlled test pressure, in the mold. 2. the method according to claim 1 , wherein the mold includes a main axis, further comprising controlling the curing pressure by a stress exerted on the sample along the main axis of the mold. 3. the method according to claim 1 , wherein the hollow body of the mold includes a stainless steel wall. 4. the method according to claim 2 , further comprising controlling the test pressure through at least one of: (a) by injecting an internal fluid into the mold, and (b) by a stress exerted on the sample along the main axis of the mold. 5. the method according to claim 1 , wherein the curing composition is selected from compositions of gels, resins, muds and hydraulic binders. 6. the method according to claim 1 , wherein the mold is of cylindrical shape. 7. the method according to claim 1 , further comprising regulating the temperature of the sample during at least one of: (a) the curing step, and (b) the measurement step, by maintaining the sample under adiabatic conditions. 8. the method according to claim 1 , wherein the measurement step comprises at least one measurement selected from acoustic, displacement, pressure, electric resistivity, temperature, permeability measurements and combinations thereof. 9. the method according to claim 1 , further comprising controlling the test pressure by at least one of: (a) injecting an internal fluid into the internal jacket of the mold, (b) a stress exerted on the sample along the main axis of the mold, and (c) injecting a confinement fluid into a confinement enclosure surrounding the mold. 10. the method according to claim 1 , further comprising inserting acid gas into the mold containing the curing composition sample. 11. a device for testing a curing composition, the device comprising: (a) a confinement enclosure; (b) a mold adapted to receive a curing composition sample within a hollow body, the mold being positioned in the confinement enclosure, the hollow body having a main axis and comprising: a flexible internal jacket adapted to radially deform to the main axis when subjected to a controlled test pressure; and a rigid external shell adapted to be in contact with the flexible internal jacket in a removable way so that the flexible internal layer is not capable of deforming radially to the main axis when subjected to a controlled curing pressure during curing due to the support of the rigid external wall; (c) an upper base and a lower base for compressing the sample by exerting a stress along the main axis of the mold, the upper and lower bases being located at two ends of the hollow body with respect to the main axis; and (d) a confinement fluid injector for compressing the sample by injecting a confinement fluid into the confinement enclosure around the mold. 12. the device according to claim 11 , wherein the upper base or the lower base comprises a connector for compressing the sample by injecting, via the connector, an internal fluid into the internal jacket of the mold. 13. the device according to claim 11 , wherein the mold is of a cylindrical shape. 14. the device according to claim 11 , comprising at least one acoustic, displacement, pressure, electric resistivity and/or temperature sensor. 15. the device according to claim 11 , wherein the external shell comprises two half-shells which are porous, the device further comprising at least one actuator operably separating the half-shells. 16. the device according to claim 11 , wherein the curing composition sample is oil well casing cement. 17. the device according to claim 11 , wherein acid gas is inserted into the mold containing the curing composition sample. 18. the method according to claim 1 , wherein the curing composition sample is oil well casing cement.	cross-reference to related applications this application is a national phase entry of international application no. pct/ib2011/054473, filed on oct. 11, 2011, which claims priority to french patent application serial no. 1058307, filed on oct. 12, 2010, both of which are incorporated by reference herein. field of the invention the present invention relates to a method for testing a curing composition in which one or more parameters of a sample obtained by curing the curing composition under pressure and temperature are measured. the invention relates to a suitable test device for applying a particular embodiment of the above method. the invention in particular applies to curing compositions used in the field of oil extraction, and most particularly to cement compositions for cementation of casings. background cementation of a casing in an oil well consists of placing a sheath of cement in the annular space between the convex side of the casing and the wall of the hole. the hole may be formed with another casing or with the rock. this cement sheath has an essential role in the stability and isolation of oil wells. the cement sheath is obtained by pumping a cement slurry made from cement, water and adjuvants. this cement slurry is in the liquid state when it is pumped. hydration of the cement particles leads the liquid slurry towards a solid state, characterized by the existence of a backbone and pores, thereby forming a porous medium. the cement sheath is exposed to various mechanical and thermal stresses, also called bottom conditions, during the lifetime of the well, from operations conducted in the well (pressure tests, mud changing, cold and hot stimulations, production of reserves . . . ) or from phenomena directly arising in the subsoil (compaction of the reservoir, earthquakes . . . ) and this until it is abandoned, or even beyond this. these stresses may damage the constitutive material of the cement sheath, degrade its mechanical and hydraulic properties and therefore modify its contribution to the stability and seal of the well. knowledge of the behavior of the cement under bottom conditions and of the time-dependent change of this behavior is essential for analyzing the operation of the well during its drilling, its exploitation and for guaranteeing its seal for storing and sequestering gas (ch 4 , c 2 h 6 , co 2 , for example) in underground reservoirs. more generally, it is necessary to be able to conduct mechanical or physical tests on materials obtained by curing compositions (and notably cement compositions) under very specific conditions which are those encountered in the wells, i.e. generally absence of air and high pressure. these materials are actually very different from those obtained by curing compositions of the same type under ambient conditions (i.e. in air and under atmospheric pressure). many techniques have been proposed for characterizing the mechanical behavior of such materials. a first category of techniques covers static mechanical tests on samples which are cured in ageing benches at a given pressure and temperature, which are then unloaded in order to position them in a measurement apparatus. the unloading step requires bringing back the samples to atmospheric pressure and to room temperature, which may not only damage the samples but also perturb the determination of the characteristics of said samples. a second category of techniques covers dynamic tests based on indirect measurement of wave propagation and not comprising any return of the samples under ambient conditions. these techniques however have a limited benefit because of their indirect nature: in particular the static parameters have to be obtained from dynamic parameters by using correlation formulae; these formulae are themselves obtained by static tests, which may be marred with errors, or even not cover the field of application of the tested materials. a third category of techniques comprises a few proposals of static mechanical tests without the detrimental unloading and reloading step mentioned above. thus, document ep 1541987 describes a system in which a cement composition is cast into a bone-shaped mold, the sample is aged under temperature and under pressure and uniaxial tensile loading is carried out until breakage of the sample, without having to unload the sample. however, with this method, it is not possible to carry out the measurements under bottom conditions, the pressure can only be exerted on both faces of the sample and the other faces are subject to a loading condition by reaction of the mold and not by application of stress under bottom conditions. the measurements are therefore biased. further, only tensile tests are possible, but the latter are biased as regards the measurement of the elastic constants relatively to the compression tests, because of the occurrence of microcracks which invalidate the elasticity assumption. the range for determining the elastic parameters is therefore highly reduced. further, it is not possible to measure the breakage parameters in compression and finally the geometry used is unconventional. document u.s. pat. no. 7,621,186 describes an alternative of the previous system, adopting a geometry of the frusto-conical type. it therefore suffers from the same drawbacks. document wo 2007/020435 proposes a technique which consists of having the cement composition set in an annular space located between two concentric tubes, and of then varying the pressures on the concave side of the inner tube and/or on the convex side of the outer tube while measuring the induced deformations. this technique only allows confinement compression tests (radial direction), and not axial compression tests. further, this technique has the drawback of being based on a measurement in a heterogeneous field of stresses (in elasticity, the stress and deformation fields in a hollow cylinder vary as 1/r 2 ). thus the measurement of the elastic properties of the sample are highly inaccurate (very sensitive to errors), just like that of the damaging and breakage properties of the sample. document u.s. pat. no. 7,089,816 describes a technique which consists of having the cement composition set in a cylindrical casing (consisting of a deformable membrane and of two pistons) placed in a confinement enclosure, and then of directly proceeding with the mechanical tests by applying the confinement pressure through the membrane and axial loading via the pistons, just like for a conventional triaxial cell. but in reality, the use of a flexible membrane for the setting of the cement does not give the possibility of obtaining a sample with a regular shape after setting. because of the changes in volume associated with setting, there actually occur taylor instabilities leading to the sample losing its initial geometry. also, with this technique it is not possible to carry out measurements in line with the existing procedures, hydration of the cement is not properly reproduced. document u.s. pat. no. 7,549,320 corresponds to a technique of the same type, with a change in the loading technology. in particular, the document further proposes to have the sample set in a flexible membrane. the rigid compartment surrounding the flexible membrane is intended for applying fluids but it does not have an influence on the shape of the sample during the setting. document u.s. pat. no. 7,552,648 further describes another alternative, wherein fluid is injected into the sample itself, which is porous, in order to obtain the desired pressure. a tensile test is then carried out. no compression test is provided, and the provision of an exterior fluid does not properly simulate the hydric exchanges under bottom conditions. therefore, there exists a need for having a novel technique for testing cement samples (or other curing compositions) not having the above drawbacks. in particular, there exists a need for having a technique available with which measurements of mechanical, hydraulic or physico-chemical properties may be carried out under bottom conditions during the curing or even beyond this, without again passing through atmospheric temperature and pressure conditions, while controlling the shape of the sample, and without being limited to an unconventional geometry. summary the invention firstly relates to a method for testing a curing composition, comprising: providing a curing composition;injecting the curing composition into a mold;curing the curing composition into a cured sample in the mold, at a controlled curing pressure;measuring at least one physical or mechanical property of the cured sample at a controlled test pressure, in the mold;the mold being rigid with respect to the cured sample during the curing step. according to an embodiment, the mold includes a main axis, the curing pressure being controlled by a stress exerted on the sample along the main axis of the mold. according to an embodiment, the mold is also rigid with respect to the cured sample during the measurement step, the mold preferably including a metal wall, and most preferably a stainless steel wall. according to an embodiment, the test pressure is controlled by injecting an internal fluid into the mold and/or by a stress exerted on the sample along the main axis of the mold. according to an embodiment, the mold is flexible relatively to the cured sample during the measurement step. according to an embodiment, the mold includes a flexible internal jacket and a removable rigid external shell, the external shell being in contact with the internal jacket during the curing step and not being in contact with the internal jacket during the measurement step. according to an embodiment, the test pressure is controlled by injecting an internal fluid into the internal jacket of the mold and/or by a stress exerted on the sample along the main axis of the mold and/or by injecting a confinement fluid into a confinement enclosure surrounding the mold. according to an embodiment, the curing composition is selected from compositions of gels, resins, muds and hydraulic binders, and preferably is a composition comprising water and a hydraulic binder, most preferably a composition comprising water and cement. according to an embodiment, the mold has the shape of a cylinder. according to an embodiment, the temperature of the sample is regulated during the curing step and/or during the measurement step preferably by maintaining the sample under adiabatic conditions. according to an embodiment, the measurement step comprises one or more measurements selected from acoustic measurements, displacement, pressure, electric resistivity, temperature and permeability measurements and combinations thereof. the invention also relates to a device for testing a curing composition, comprising: a confinement enclosure;a mold adapted for receiving a curing composition sample, comprising a main axis, placed in the confinement enclosure and comprising: a flexible internal jacket;a rigid external shell adapted so as to be flattened against the internal jacket in a removable way;first means for compressing the sample by exerting a stress along the main axis of the mold;second means for compressing the sample by injecting a confinement fluid into the confinement enclosure around the mold. according to an embodiment, the device comprises third means for compressing the sample by injecting an internal fluid into the internal case of the mold. according to an embodiment, the mold has the shape of a cylinder. according to an embodiment, the device comprises one or more acoustic sensors, displacement, pressure, electrical resistivity and/or temperature sensors. according to an embodiment, the external shell comprises two, preferably porous, half-shells, and the device comprises a system suitable for separating the half-shells. with the present invention it is possible to overcome the drawbacks of the state of the art. more particularly it provides a technique with which measurements of properties of a sample may be carried out under bottom conditions during the curing (notably in the case of cement) or beyond this without any step perturbing the unloading, while properly controlling the shape of the sample, and without being limited to unconventional geometry. this is accomplished by using a test device comprising a mold which is rigid during the curing of the sample, provided with means for compressing the sample both for the curing step and for the test step. according to certain particular embodiments, the invention also has one or preferably several of the advantageous features listed below. the rigidity of the mold during the curing step gives the possibility of avoiding deformation of the sample during this step and guarantees that the desired shape is obtained.according to a first embodiment, the mold remains rigid during the measurement step. this allows a test of the oedometric type to be carried out (without any radial deformation of the sample). the corresponding device is of small size and easily transportable.according to a second embodiment, the mold becomes flexible during the measurement step. this allows a test of the uniaxial or triaxial type to be carried out on the sample, i.e. in which a confinement pressure is applied around the sample.the temperature of the sample may be regulated during the curing and/or during the measurement. it is also possible to operate under quasi-adiabatic conditions.with the invention, it is possible to carry out measurements of radial and axial displacements (deformation), permeability measurements, acoustic measurements with compression or shear waves, electrical resistivity measurements, temperature measurements or any other physico-chemical measurement.with the invention, it is for example possible to test cylindrical samples with a diameter of 50 mm and a height of 100 mm, at a confinement pressure ranging up to 70 mpa and at a temperature ranging up to 150° c. brief description of the figures fig. 1a schematically illustrates a mold used within the scope of the first embodiment of the invention (outer view and sectional view). figs. 1b and 1c schematically illustrate details of the mold of fig. 1a (outer view and sectional view). fig. 2 schematically illustrates an alternative of the mold used within the scope of the first embodiment of the invention (outer view and sectional view). fig. 3 schematically illustrates a mold used within the scope of the second embodiment of the invention (outer view). detailed description the invention will now be described in more detail and in a non-limiting way in the following description. by curing composition, is meant within the scope of the invention a fluid composition (liquid, slurry, granular composition . . . ) capable of passing to a solid or quasi-solid state over time (by undergoing a curing step). the curing composition may thus be a gel, resin, mud composition or preferably a composition of hydraulic binder and water (with optionally other compounds in the mixture) and more particularly a slag (a composition based on cement and water). thus, the curing in this case essentially corresponds to hydration (or setting) of the curing composition. according to the first embodiment of the method of the invention, a rigid mold is used for receiving the curing composition sample. according to the second embodiment of the method of the invention, a flexible mold is used with a removable rigid (preferably porous) shell so as to benefit from a mold which is rigid during the curing of the curing composition and supple (flexible) during the measurement on the cured sample. by “rigid”, is meant within the scope of the invention an element which is not capable of deforming (or which is not capable of substantially deforming) under conditions (notably pressure conditions) encountered during the curing step (and for the first embodiment, also during the measurement step). by “flexible” is meant within the scope of the invention a non-rigid element. rigid mold with reference to fig. 1a , the rigid mold 10 used in the first embodiment includes a wall 11 of the tubular type (which delimits a hollow body) as well as an upper base 13 and a lower base 12 at two ends of the wall 11 . preferably, the wall 11 has a main axis, the upper base 13 and the lower base 12 being located at the respective ends of this axis. according to the preferred alternative which is illustrated, the wall 11 is of cylindrical geometry, and the main axis corresponds to the axis of the cylinder. this geometry is a traditional geometry for physical and mechanical measurements on curing compositions, with which it is possible to obtain reliable results and easy to interpret as well as compare. however it is possible to contemplate other geometries, for example of the frusto-conical type. it is also possible to provide a complementary molding element in the mold 10 in order to obtain a sample, for example a cylindrical sample, having a recess. the wall 11 may be a metal wall and notably a stainless steel wall. according to an alternative, it is possible to provide inside the wall 11 an internal layer, for example in plastic material, preferably insulating and heat-stable and notably in polyetherketone (peek). with this alternative it is possible to limit the heat exchanges between the inside and the outside of the mold 10 . as an example, a cylindrical stainless steel wall 11 , with a height of 150 mm, with an external diameter of 100 mm, and an internal diameter of 70 mm and an internal peek layer with an external diameter of 70 mm and internal diameter of about 50 mm may be provided. the wall 11 may be simply slid along the internal layer. according to another alternative, which is illustrated in fig. 2 , the hollow body of the mold 10 comprises the wall 11 , an internal layer 14 as described above and a heating device inside the internal layer 14 , for example comprising a heating collar 16 and a thermal contact layer 15 . in the illustrated example, the thermal contact layer 15 is a brass tube (for example with an internal diameter of about 50 mm and an external diameter of about 56 mm) fitting into the peek tube of the internal layer 14 (for example with an internal diameter 56 mm and an external diameter of 70 mm), which itself fits into the stainless steel tube of the wall (for example with an internal diameter of 70 mm and an external diameter of 100 mm). in order to facilitate assembling and dissembling of the mold 10 , the wall 11 and the internal layer 14 are each in two portions along the main axis of the mold 10 . the heating collar 16 is positioned in a recess made at the junction between both portions. in this alternative, the heat exchanges between the sample and the external medium are limited, while imposing the temperature of the sample: this is a more practical and more accurate temperature control than the one (also possible) consisting of imposing a temperature outside the mold 10 , the transmission of heat being effected through the wall 11 of the mold 10 . an embodiment of the upper base 13 is illustrated in fig. 1b . the upper base 13 comprises a head 131 and a projection 132 . the projection 132 is adapted so as to cooperate with the central portion (hollow body) of the mold 10 , i.e. sliding in the wall 11 (or possibly in the internal layer 14 or the thermal contact layer 15 ). it is advantageously provided with a seal gasket 133 (preferably a quadring® since this is a mobile part). the head 131 is adapted so as to cooperate with a piston (not shown). a seal gasket 134 (preferably an o-ring) provides the seal with the piston. a hydraulic and electric connection 135 a , 135 b gives the possibility of providing fluid in the mold 10 as well as the electric power supply of the apparatus. an embodiment of the lower base 12 is illustrated in fig. 1c . the lower base 12 comprises a head 121 and a projection 122 . the projection 122 is adapted so as to cooperate with the central portion (hollow body) of the mold 10 without any sliding. it is advantageously provided with a seal gasket 123 (preferably an o-ring since this is a mobile part). the head 121 is adapted so as to cooperate with a piston (not shown). a seal gasket 124 (preferably an o-ring) provides the seal with the piston. with a hydraulic and electric connector 125 a , 125 b it is possible to ensure circulation of fluid in the mold 10 as well as the electric power supply of the apparatus. for applying the invention, a curing composition sample is placed in the mold 10 (the upper base 13 being removed during this phase and then positioned when the mold 10 is filled with a curing composition). next the curing composition sample is set under pressure by means of the piston described above, with which it is possible to exert an axial stress on the sample via upper 13 and lower 12 bases (for example by placing the mold 10 in a press) and thereby impose curing pressure in the mold 10 . also, the temperature of the sample may be regulated during the curing (see for example the alternative of fig. 2 ). the curing pressure and possibly the temperature in the mold 10 may follow a program so as to simulate an injection of curing composition at the well bottom. for example, the pressure of the sample may be high, up to about 20 mpa and the temperature, up to 50-150° c. during the curing. the pressure of the sample is preferably not decreased before the beginning of the measurement phase. in other words, the pressure of the sample between the curing and the measurement preferably remains always greater than or equal to 1 mpa, or 2 mpa, or 3 mpa, or 5 mpa or 10 mpa, or 15 mpa or 20 mpa. after the curing, the axial stress is modified so as to switch to a test pressure, at which is carried out the measurement of physical or mechanical property(ies) on the cured sample. the test pressure may be greater or lower than the curing pressure, constant or vary over time according to a pre-established program. the same may apply for temperature. the displacement of the upper base 13 allows measurement of the axial deformation of the sample. complementary sensors, for example pressure, temperature, electrical resistivity or further wave velocity sensors, may be provided inside the mold 10 . it should be noted that the curing of the sample is not necessarily complete (finished) when the measurement is conducted. the measurement may be carried out on a sample which is only partly cured. this first embodiment with a rigid mold gives the possibility of carrying out a measurement under oedometric conditions, i.e. without any radial displacement. according to an alternative, the test pressure may also be imposed totally or partly by injection of a fluid (a so-called internal fluid) into the mold 10 (by using the hydraulic connectors described above). in this case, the imposed pressure is pore pressure. the injected fluid may be water but also oil, or even a gas, notably an acid gas such as co 2 or h 2 s, if it is desired to study the behavior of the sample in the presence of such compounds, which are generally present in the well. according to an alternative, pads are positioned between the projections 122 , 132 of the bases 12 , 13 and inside the mold 10 , in order to create axial isolation between the sample and the bases. these pads are pierced in order to allow hydraulic and electric connections. for example it is possible to use peek pads with a thickness of 10 mm. according to an alternative, respective porous stones are positioned between the projections 122 , 132 of the bases 12 , 13 and the inside of the mold 10 , in order to facilitate control of the pore pressure in the sample. the measurements may be carried out under drained or non-drained conditions. a measurement under drained conditions is carried out at constant pore pressure. a method for carrying out a drained test consists of achieving slow loading, and of leaving the ports open so that the changes in pressure of the pores have time to dissipate. a maximum loading rate depends on the permeability of the tested sample, on the nature of the fluids present in the pores and on the geometry of the sample. a measurement under non-drained conditions is carried out at non-constant pore pressure. non-drained loading consists of rapidly loading the sample so that the pore pressures cannot be dissipated. the best method therefore consists of closing all the ports so that the fluid may escape from the sample. several measurements may be conducted on the sample, by successively or even cyclically loading it. once the procedure is finished, it is also possible to remove the sample from the mold 10 and to analyze it. the first embodiment of the invention in particular allows evaluation of the kinetic law for hydrating cement, in particular with the alternative of fig. 2 . it is possible to adjust in real time the temperature inside the mold 10 to the same value as that of the cement during hydration, so as to be under quasi-adiabatic conditions. the temperature measurement then gives information on the amount of released heat. now, it should be noted that conventional calorimetry systems allowing tracking of the hydration of the cement do not withstand the high pressure conditions of the invention. mold with a flexible jacket and removable rigid shell with reference to fig. 3 the mold 20 used in the second embodiment includes a hollow body as well as an upper base 23 and a lower base 22 at two ends of the hollow body. preferably, the hollow body has a main axis, the upper base 23 and the lower base 22 being located at the respective ends of this main axis. just like for the embodiment of the rigid mold, a cylindrical geometry is preferred for the hollow body. the hollow body comprises a flexible internal (tubular) jacket 24 and a removable rigid external (also tubular) shell 21 a , 21 b . the rigid external shell is adapted so as to surround and be flattened against (in contact with) the flexible internal jacket 24 over essentially the whole external surface of the latter; and also in order to be removed from the flexible internal jacket 24 when this is desired. in the illustrated alternative, the rigid external shell 21 a , 21 b is separated into two half-shells, according to a plane comprising the main axis. when the half-shells are closed, the whole of the rigid external shell 21 a , 21 b is in contact with the flexible internal jacket 24 , and when they are open, they are not in contact with the flexible internal jacket 24 . thus, the mold 20 is rigid when the half-shells are closed (because it then consists of the flexible internal jacket 24 and of the rigid external shell 21 a , 21 b ), and it is flexible when the half-shells are open, since it then only comprises the flexible internal jacket 24 . both half-shells are preferably made in a porous (with fine pores) and rigid material such as sintered metal. this structure ensures both rigidity of the shell and allows transmission of the confinement fluid pressure to the flexible internal jacket 24 surrounding the sample. as a metal, for example copper, brass or steel may be used. the flexible internal jacket 24 may be in, preferably heat-stable, polymeric plastic material. polytetrafluoroethylene (known under the brand of teflon®), copolymers of hexafluoropropylene and of vinylidene chloride, terpolymers of tetrafluorethylene, and of vinylidene fluoride and hexafluoropropylene, as well as elastomers containing perfluoromethylvinylether (polymers known under the brand of viton®) are examples of suitable materials for the flexible internal jacket 24 . the mold 20 is positioned in a confinement enclosure. for example it is possible to use a confinement enclosure 30 for triaxial tests marketed by gl system in germany. this confinement enclosure is a sealed enclosure provided with means for injecting a fluid 40 (for example oil) with which a control pressure may be imposed in the enclosure 30 (confinement pressure) and notably around the mold 20 . a sample holder (not shown) is positioned in the confinement enclosure 30 in order to support the whole of the mold 20 . hydraulic micro-actuators 25 attached on supports 28 connected to the sample holder allow control of the opening or closing of the half-shells, so as to place or remove the rigid external shell, 21 a , 21 b. the upper base 23 and the lower base 22 may be attached to a loading frame (not shown) which allows an axial force to be exerted on the sample in the mold 20 . these bases are of a same type as those described above in connection with figs. 1b and 1c . they comprise perforations for placing the sensors and for controlling the pore pressure in the sample, and o-rings for ensuring the seal of the system. it is possible to provide a steel head between the upper base 23 and the piston through which the frame exerts the axial stress. it is possible to provide a basin for recovering materials in the case of a leak. measurement devices of the same type as those described in connection with the embodiment of the rigid mold are also provided. further, for the measurement of axial displacements, provision may be made for one or several axial linear variable differential transformers (lvdt) and for the measurement of radial displacements, a radial lvdt 27 . loading the curing composition sample in the mold 20 is carried out similarly to the embodiment with a rigid mold. the rigid external shell 21 a , 21 b is flattened against the flexible internal jacket 24 , and the curing composition sample is set under pressure by imposing an axial stress on the sample similarly to the embodiment with a rigid mold. the temperature of the sample may be regulated during the curing by heating in the confinement enclosure 30 or else directly in the mold 20 . after the curing, a confinement pressure is applied before removing the rigid external shell 21 a , 21 b (by opening the half-shells), so that the sample does not again pass through atmospheric pressure before the measurement phase. preferably, the pressure of the sample remains quasi-constant during the removal of the rigid external shell 21 a , 21 b , by the application of the confinement pressure. the measurement phase itself is carried out at a test pressure corresponding to a controlled axial stress (similarly to the embodiment with a rigid mold) and/or to a controlled confinement pressure (imposed by the fluid lying in the confinement enclosure 30 , to which the flexible internal jacket 24 is impervious) and/or to a controlled pore pressure (similarly to the embodiment with a rigid mold). the temperature may be controlled during the measurement phase just like during the curing phase. with displacement, pressure, temperature, electric resistivity, wave velocity sensors . . . , it is possible to carry out measurement of the desired parameter(s). this second embodiment allows a measurement of the uniaxial or triaxial type to be carried out. the measurements may be carried out under drained or non-drained conditions and may be repeated successively, or even cyclically, and the sample may be removed and analyzed similarly to the embodiment with a rigid mold. examples the following examples illustrate the invention without limiting it. example 1 first measurement procedure (embodiment of the rigid mold) this procedure may be applied with the embodiment of fig. 1 or that of fig. 2 . 1. preparing the measurement cell by: a. positioning the body of the cell on its lower base;b. making the necessary connections for the measurements (axial displacement, temperature, velocity of compressional and shear waves, electric resistivity, . . . );c. placing a heating collar on the outside of the cell.2. preparing a volume of cement slag.3. filling the measurement cell with cement slag optionally pre-heated.4. positioning the upper base above the measurement cell and closing the latter by placing the end of the base having the quad ring inside the body of the cell.5. placing the measurement cell under a press or any other device with which an axial force may be applied.6. applying an axial stress ramp as well as a temperature ramp in order to reach the bottom conditions. once these conditions are reached, the pressure and temperature remain constant.7. carrying out at any moment before, during or after the setting of the cement, loading cycles with: a. axial stress;b. pore pressure;c. temperature.8. measurement of the consequences of these loading cycles in terms of: a. axial deformation of the sample;b. pore pressure;c. temperature;d. velocity of compressional and shear waves;e. electric resistivity.9. once the test is finished, disassembling the specimen and observing the cement sample. this measurement procedure allows measurement of the following parameters, at any moment during the setting of the cement: elastic oedometric modulus of the cement under drained or non-drained conditions;plastic oedometric modulus of the cement under drained or non-drained conditions;plasticity onset stress of the cement under drained or non-drained conditions;creeping properties of the cement;velocity of compressional waves of the cement under drained or non drained conditions;velocity of shear waves of the cement under drained or non-drained conditions;electric resistivity of the cement under drained or non-drained conditions;thermal expansion coefficient of the cement under drained or non-drained conditionspermeability of the cement. example 2 second measurement procedure (embodiment of the rigid mold) this procedure relates to tests of the maturometry type. it may be performed on an alternative as illustrated in fig. 2 . 1. preparing the measurement cell by: a. positioning the body of the cell on its lower base;b. making the necessary connections for the measurements (axial displacement, temperature, velocity of compressional and shear waves, electric resistivity, . . . )2. preparing a volume of cement slag.3. filling the measurement cell with the optionally pre-heated cement slag.4. positioning the upper base above the measurement cell and closing the latter by placing the end of the base having the quadring inside the body of the cell.5. placing the measurement cell under a press or any other device with which an axial force may be applied.6. applying an axial stress ramp as well as a temperature ramp in order to reach the bottom conditions. once these conditions are reached, the pressure remains constant.7. during the setting, applying a set temperature value such that the temperature of the heating collar located between the peek cylinder and the copper cylinder is always equal to the temperature of the cement, a temperature measured by means of measurement sensors such as thermocouples.8. performing at any moment, before, during or after the setting of the cement of loading cycles with a. axial stress;b. pore pressure;c. temperature.9. measurement of the consequences of these loading cycles in terms of: a. axial deformation of the sample;b. pore pressure;c. temperature;d. velocity of compressional and shear wave;e. electric resistivity.10. once the test is finished, disassembling the specimen and observing the cement sample. with this measurement procedure it is possible to measure in addition to the parameters accessible according to the first measurement procedure, the amount of heat from hydration of the cement versus progression of the chemical reactions. example 3 third measurement procedure (embodiment with a flexible jacket and rigid shell this procedure may be applied with the embodiment of fig. 3 . 1. preparing the measurement cell by: a. mounting the lower base on the sample holder;b. positioning the flexible viton® or teflon® flexible jacket on the lower base.c. closing both half-shells around the flexible jacket;d. making the necessary connections for the measurements (axial displacement, temperature, velocity of compressional and shear waves, electric resistivity, . . . ).2. preparing a volume of cement slag.3. filling the area comprised inside the flexible jacket with optionally pre-heated cement slag,4. positioning the upper base above the measurement cell and closing the area containing the cement slag by placing the end of the base inside the flexible jacket.5. placing the head on the upper base.6. inserting the sample holder (with the device, object of the invention) in a confinement enclosure with which a confinement pressure may be applied (via a confinement fluid). this confinement enclosure is equipped with heating devices. a piston is positioned above the head of the cell. it emerges from the confinement enclosure.7. placing the confinement enclosure under a press or any other device with which an axial force may be applied.8. applying an axial stress ramp and confinement pressure as well as a temperature ramp in order to reach the bottom conditions. once these conditions are reached, the pressure and temperature remain constant.9. opening at any moment after the setting of the cement, both half-shells with which it is thereby possible to obtain a cement sample with a cylindrical shape, positioned in the flexible jacket, on which a fluid pressure is applied, a configuration similar to the one encountered during a standard triaxial test.10. performing loading/unloading cycles according to what is practiced during standard triaxial tests; a. isotropic stress path: the axial stress variation is equal to that of the radial stress;b. triaxial stress path: the variation of radial stress is zero;c. proportional stress path: the axial stress variation is proportional to that of the radial stress;d. oedometric stress path: the variation of radial displacement is zero;e. stress path by controlling the pore pressure;f. stress path by controlling the temperature.11. measurement of the consequences of these loading cycles in terms of: a. axial deformation of the sample;b. radial deformation of the sample;c. pore pressure;d. temperature;e. velocity of compressional and shear wave;f. electric resistivity . . . .12. once the test is finished, disassembling the specimen and observing the cement sample. with this measurement procedure it is possible to measure the following parameters: elastic properties (young's, shear, incompressibility, oedometric, moduli, poisson coefficient) of the cement under drained or non-drained conditions;plastic properties (axial, transverse deformability) of the cement under drained or non-drained conditions;poro-mechanical coupling properties of the cement (biot coefficient, skempton coefficient . . . );creeping properties of the cement;plasticity onset stress of the cement under drained or non-drained conditions;velocity of compressional waves of the cement under drained or non-drained conditions;velocity of shear waves of the cement under drained or non-drained conditions;electric resistivity of the cement under drained or non-drained conditions;thermoexpansion coefficient of the cement under drained or non-drained conditions;permeability of the cement . . . .
183-953-589-262-977	US	[ "US" ]	H01L21/687	1999-07-09T00:00:00	1999	[ "H01" ]	reusable wafer support for semiconductor processing	a wafer holding device supports a wafer during semiconductor processing. the device has a planar disk member with a raised supporting edge on which the wafer sits. cooling gas passes through an aperture in the disk member to contact the bottom surface of the wafer. an o-ring, which sits on or near the raised supporting edge, is used to maintain an airtight seal between the wafer and the wafer holding device. pegs or a ridge on the supporting edge fix the rotational position of the wafer. the wafer is secured to the device using a ring member, with holes for the ridge or pegs, placed on top of the wafer. at the bottom of the disk member is an annular projection that is held by a robotic transfer mechanism during transport into the process chamber. the projection fits processing equipment designed to hold standard-sized wafers.	1. a wafer holding device for supporting a wafer by a bottom surface of said wafer and transporting said wafer into and out of a wafer processing chamber, said device comprising: a base member with a top surface, a bottom surface, and a perimeter edge; a raised supporting edge for supporting said wafer by said bottom surface of said wafer, said supporting edge extending to a constant height in a direction normal to said top surface of said base member and extending continuously around said perimeter edge of said base member, and forming a recession well comprising a portion of said top surface of said base member and an inner wall of said supporting edge; means for positioning said wafer on said supporting edge; means for securing said wafer to said supporting edge; and a holding portion on said base member for engaging said wafer holding device with a robotic arm. 2. the wafer holding device of claim 1 wherein said base member has an aperture extending between said top surface and said bottom surface through which a medium can pass to moderate the temperature of said wafer by contacting said bottom surface of said wafer. 3. the wafer holding device of claim 2 wherein said aperture is substantially central to said portion of said top surface of said base member. 4. the wafer holding device of claim 1 wherein said base member is a circular disk member. 5. the wafer holding device of claim 1, further comprising a resilient, deformable material to provide a substantially airtight seal between said wafer holding device and said wafer. 6. the wafer holding device of claim 5 wherein said supporting edge comprises a planar top surface parallel to said top surface of said base member. 7. the wafer holding device of claim 6 wherein said deformable material is an o-ring and said planar top surface of said supporting edge has a groove for receiving said o-ring. 8. the wafer holding device of claim 6 wherein said deformable material is an o-ring placed inside said recession well and continuously contacting said inner wall of said supporting edge. 9. the wafer holding device of claim 1 wherein said means for securing said wafer to said supporting edge comprises a ring member placed over said wafer, said ring member having a substantially central hole. 10. the wafer holding device of claim 9 wherein said ring member further comprises a raised rim depending from the bottom surface of said ring member for fitting around said perimeter edge of said base member. 11. the wafer holding device of claim 9 wherein said means for positioning said wafer on said supporting edge comprises at least three pegs mounted on said supporting edge, at least two of said pegs for contacting a flat portion of the edge of said wafer and the remaining numbers of said pegs for contacting remaining portions of the edge of said wafer, thereby fixing the rotational orientation of said wafer with respect to said wafer holding device; and said ring member has at least three peripheral holes for fitting around said pegs, the number and location of said peripheral holes corresponding to the number and location of said pegs. 12. the wafer holding device of claim 9 wherein said means for positioning said wafer on said supporting edge comprises a continuous raised ridge extending from said supporting edge, said raised ridge in the shape of said wafer for continuously contacting the edge of said wafer. 13. the wafer holding device of claim 9 wherein said means for positioning said wafer on said supporting edge comprises a raised ridge extending from said supporting edge for contacting a flat portion of the edge of said wafer and at least one peg mounted on said supporting edge for contacting a curved portion of the edge of said wafer, thereby fixing the rotational orientation of said wafer with respect to said wafer holding device; and said ring member has peripheral holes through which said raised ridge and said pegs fit when said ring member is placed over said wafer. 14. the wafer holding device of claim 1 wherein said holding portion comprises an annular protrusion depending from said bottom surface of said base member. 15. the wafer holding device of claim 14 wherein the outer diameter of said annular protrusion is equivalent to the diameter of said wafer. 16. the wafer holding device of claim 1 wherein said base member, said supporting edge, and said holding portion are fabricated of a metal selected from the group consisting of aluminum, stainless steel, and copper. 17. the wafer holding device of claim 1 wherein said base member, said supporting edge, said means for positioning said wafer on said supporting edge, said means for securing said wafer to said supporting edge, and said holding portion are sized to hold a standard-sized silicon wafer. 18. a metal reusable wafer holding device for transporting and supporting a standard-sized silicon wafer by a bottom surface of said wafer in a process chamber during very deep to through-wafer etching, said device comprising: a planar disk member with a diameter between 4 and 8 inches and a thickness between 0.030 and 1 inch; said disk member having a circular recession well in the top surface of said disk member, said recession well having a depth of between 0.01 and 0.9 inch and a diameter of between 1 and 3.9 inches and a concentric circular aperture with a diameter of between 0.1 and 2 inches, extending between the bottom surface of said recession well and the bottom surface of said disk member, through which a cooling gas can flow to contact said bottom surface of said wafer; a rubber o-ring with a diameter between 1 and 3.9 inches placed inside said recession well and continuously contacting the wall of said recession well; means for positioning said wafer on said disk member; means for securing said wafer to said disk member; and an annular concentric protrusion from said bottom surface of said disk member, sized equivalently to a standard silicon wafer, for engaging a robotic arm designed to transport a silicon wafer into and out of a processing chamber. 19. the wafer holding device of claim 18 wherein said means for positioning said wafer on said disk member comprises four cylindrical pegs with diameters between 0.1 and 0.2 inch and lengths between 0.1 and 1 inch, said pegs fixed perpendicularly to said disk member at a radial distance between 2 and 2.5 inches from the center of said disk member, the first and second of said pegs fixed 120.degree. apart and the third and fourth fixed between 0.5 and 1.5 inches apart from each other and on a chord perpendicular to a radial line 120.degree. from the first and second pegs; and means for attaching said pegs to said disk member. 20. the wafer holding device of claim 19 wherein said means for securing said wafer to said disk member comprises an annular ring with an outer diameter larger than the diameter of said disk member, an inner diameter between 1 and 3 inches, a thickness between 0.01 and 0.06 inches, a rigid raised rim at the circumference of the bottom surface of said annular ring, and four holes for fitting over said pegs, said ring placed on top of said wafer on said disk member. 21. a wafer-processing system comprising: a sealed, airtight process chamber; means for creating and maintaining a vacuum within said chamber; a processing tool; a chuck within said chamber for holding a silicon wafer, said chuck having channels for flowing gas through; means for controlling gas flow through said chuck; a wafer holding device for supporting a wafer during transport onto said chuck and during processing on said chuck, said device having a protrusion similar in size and shape to a standard silicon wafer; means for removably fixing said wafer and said wafer holding device onto said chuck; and robotic transfer means for transporting said wafer holding device into said chamber and positioning said wafer holding device on said chuck, said transfer means having an arm fitted to hold a standard silicon wafer. 22. the wafer-processing system of claim 21, further comprising means to position said wafer holding device in said arm of said robotic transfer means. 23. the wafer-processing system of claim 21 wherein said wafer holding device further comprises: a base member with a top surface, a bottom surface, a perimeter edge, and an aperture extending between said top surface and said bottom surface, through which a medium can pass to moderate the temperature of said wafer by contacting said bottom surface of said wafer; a raised supporting edge for supporting said wafer by a bottom surface of said wafer, said supporting edge extending to a constant height in a direction normal to said top surface of said base member and extending continuously around said perimeter edge of said base member, and forming a recession well comprising a portion of said top surface of said base member and an inner wall of said supporting edge; means for positioning said wafer on said supporting edge;and means for securing said wafer-to said supporting edge. 24. the wafer-processing system of claim 21 wherein said means for removably fixing said wafer and said wafer holding device onto said chuck comprises: means for electrostatically clamping said wafer holding device onto said chuck; and adjustable means for fixing said wafer onto said wafer holding device. 25. the wafer-processing system of claim 24 wherein said adjustable means for fixing said wafer onto said wafer holding device comprises spring-loaded clips. 26. the wafer-processing system of claim 21 wherein said means for removably fixing said wafer and said wafer holding device onto said chuck comprises weight mechanisms placed on top of said wafer holding device.	field of the invention this invention relates generally to a support for holding and transporting silicon wafers in a vacuum chamber during semiconductor processing. more particularly, it relates to a support used during very deep or through-wafer etching. background art semiconductor wafers are a fundamental component of the electronic industry, and improving the quality and efficiency of their processing is, therefore, highly desirable. wafers are processed in sealed vacuum chambers, where they are supported in a processing machine by a chuck, through which cooling gas flows to contact the bottom surface of the wafer. the wafer, therefore, has a different pressure environment on its top and bottom surfaces. for procedures in which holes are etched nearly or completely through the wafer, termed very deep to through-wafer etching, the etch must be stopped before it reaches the chuck. holes that reach the bottom of the wafer expose the chuck to the process environment, damaging the chuck and contaminating the chamber. to prevent this, a thin film layer is placed on the bottom surface of the wafer to stop the etch. this solution causes further problems, because the thin film sticks to the chuck when heated. the thin films used also do not adequately support the wafer structure during and after very deep to through-wafer etching, causing wafers to cleave or shatter during processing. an additional constraint introduced by very deep to through-wafer etching arises during removal of the wafer from the chuck. typically, pins rise out of the chuck to lift the wafer and a spatula reaches underneath the wafer to move it out of the process chamber. deep holes are problematic if they are in the path of the pins or if they significantly decrease the wafer's structural integrity. a current solution is to use a backing wafer adhered to the process wafer with a thin film, for example photoresist, sandwiched between the two wafers. the backing wafer system, however, introduces further problems. physical pressure on the process wafer and elevated temperatures are needed to effect adhesion, complicating processing and introducing significant potential for contamination. when the wafer is inserted into the processing chamber, air bubbles between the process and backing wafers, poor quality adhesion, or delaminating of the process wafer at high temperatures cause the wafers to break violently. wafer breakage is a catastrophic and costly event, requiring operators to shut down and clean the process equipment. what is needed is a device, such as a wafer holder, that can be used to protect the chuck and support the substrate during through-wafer etching without using a backing wafer. existing wafer holders are not designed for very deep to through-wafer etching and do not address all of the requirements outlined above. in general they are fixed to the chuck and themselves need to be protected from contamination by the process environment. in u.s. pat. no. 4,213,698, firtion et al. disclose an apparatus for holding a workpiece during semiconductor processing. their device creates a planar holding face on the ends of many closely-spaced pins. the apparatus is not applicable for very deep to through-wafer etching and does not allow for cooling gas flow through the device to the wafer. hattori describes a substrate carrier in u.s. pat. no. 4,646,418. the carrier is designed to minimize operator handling of the substrate and is not used during processing. a workpiece carrier for heat transfer under vacuum conditions is described by wagner et al. in u.s. pat. nos. 5,033,538 and 5,180,000. the carrier contains a complex system of channels and grooves through which a heat transfer gas flows. the channel system is highly complicated, and the carrier is not suitable for through-wafer etching. finally, in u.s. pat. no. 4,846,452 geneczko discloses a rotational chuck assembly for finely controlling the rotational position of a wafer on a chuck. the assembly is very mechanically complicated, and is actually part of a chuck, not a separate wafer support used to protect a chuck. objects and advantages accordingly, it is a primary object of the present invention to provide a wafer holding device for transporting a wafer into and out of a processing chamber. an advantage of this device is that it supports the substrate and protects the chuck and process chamber from damage from wafer chips and sticky material on the wafer's bottom surface. an additional advantage of the present invention is the ease with which it is loaded and unloaded from the chuck, compared with a wafer with many deep holes. it is a further object of the invention to provide a wafer holder that is reusable. it is an additional object of the invention to provide a means for positioning the wafer in a predetermined orientation in the process chamber, facilitating repeatable processing. another object of the present invention is to provide a wafer holder that is compatible with existing processing equipment designed to hold and transport a wafer without a support. specifically, the present invention fits into a robotic arm and into a chuck. allowing for efficient wafer cooling is a further object of the present invention. when a backing wafer is used, the process wafer is cooled through the backing wafer. an advantage of the present invention is that the process wafer is separated from the cooling gas by only the thin film layer. another object of the present invention is to accommodate wafers of any size and shape. finally, the present invention accomplishes these objects without significant additional wafer handling or processing steps. summary the present invention provides a supporting device for holding, supporting, and transporting wafers in a processing chamber during semiconductor processing. in the preferred embodiment, the size and shape of the device are such that it holds a standard silicon wafer. the device is supported by the processing chuck in a position usually occupied by the wafer itself. to withstand the processing environment, the device, except for the deformable material to be described later, can be fabricated of metal. the invention also provides for a wafer-processing system incorporating the holding device. the device includes a base, preferably disk shaped, with top and bottom surfaces and a perimeter edge. the bottom surface of the wafer is supported by the base. in one embodiment of the invention, the base contains an aperture through its top and bottom surfaces, preferably passing through the center of the base. cooling gas flows from the chuck through the aperture to contact the bottom surface of the wafer. a continuous, raised supporting edge at the perimeter of the base creates a recession well from the top surface of the base and the inner wall of the supporting edge. the wafer sits on this raised edge, allowing the cooling gas to flow through the aperture into the recession well. in the preferred embodiment, the edge has a planar top surface parallel to the top surface of the base. on or near the raised edge is a resilient, deformable material used to maintain an airtight seal between the wafer and the wafer holding device to isolate the cooling gas from the processing environment. in the preferred embodiment, this material is an o-ring. the o-ring can be placed in an o-ring groove on the planar top surface of the edge or, preferably, inside the recession well, contacting the inner wall of the edge. the device also contains a means for positioning the wafer in a predetermined position on the raised edge. this can include, but is not limited to, at least three pegs or a raised ridge at the perimeter of the raised supporting edge. the pegs or ridge contact the flat portion and at least part of the curved portion of the wafer edge to fix its position. a portion of the device is held by a robotic transfer mechanism for transporting the device into and out of the processing chamber and for positioning the device on the chuck. this portion can be an annular protrusion on the bottom surface of the base. in the preferred embodiment, the annular protrusion is shaped like a standard wafer to fit into a mechanical arm designed to move wafers. finally, the device contains a means for securing the wafer to the base. a ring member with a hole, preferably centrally located, is placed over the device and rests on the wafer. in the preferred embodiment, the ring member is annular and has a ridge at the circumference of its bottom edge for fitting around the edge of the base. as necessary, the ring member contains holes to accommodate the pegs or other means for positioning the wafer. the holding device is incorporated into a standard wafer-processing system. inside a vacuum processing chamber are a processing tool, a chuck containing cooling gas flow channels, and a robotic mechanism for transporting the holding device into the chamber and positioning it on the chuck. the system also contains means for creating and maintaining the vacuum and means for controlling the cooling gas flow in the chuck. the robotic mechanism contains an arm designed to fit standard silicon wafers, but in this system it fits the holding portion of the device. the device is secured to the chuck either electrostatically or mechanically. with electrostatic clamping, the wafer, ring member, and base are held together using screws or clamps. alternately, mechanical clamps used currently hold the wafer on the device and also the device on the chuck. brief description of the figures fig. 1a is a top perspective view of the backing wafer system of the prior art. fig. 1b is a side view of the backing wafer system of fig. 1a. fig. 2 is a front schematic of the prior art wafer-processing system using the backing wafer system of fig. 1. fig. 3a is a top perspective view of a wafer holding device. fig. 3b is a cross-sectional view of the device of fig. 3a. fig. 3c is an alternate embodiment of the device of fig. 3b. figs. 4a-c are cross-sectional views of alternate embodiments of the device with resilient material. fig. 5a is a top perspective view of a wafer holding device in accordance with the preferred embodiment of the invention. fig. 5b is a cross-sectional view of the device of fig. 5a. fig. 5c is a top plan view of an annular ring placed on top of the wafer holding device of fig. 5a. fig. 5d is a bottom plan view of the annular ring of fig. 5c. fig. 6a is a top plan view of a second embodiment of the invention. fig. 6b is a bottom plan view of an annular ring placed on top of the wafer supporting device of fig. 6a. fig. 7a is a top perspective view of a third embodiment of the invention. fig. 7b is a bottom plan view of an annular ring placed on top of the wafer supporting device of fig. 3a. fig. 8 is a bottom perspective view of a further embodiment of the wafer holding device including a bottom cooling gas recess. fig. 9 is a front schematic of a wafer-processing system containing the wafer holding device, using mechanical clamps. fig. 10 is a front schematic of a wafer-processing system containing the wafer holding device, using electrostatic clamps. detailed description figs. 1a and 1b show a backing wafer system 11 used in the prior art. a wafer 10 is bound to a backing wafer 14 by a thin film 12, which is usually photoresist. a wafer-processing system of the prior art, shown in fig. 2, contains a process chamber 16, a processing tool 20, a chuck 18, and robotic transfer means 22. robotic transfer means 22 hold and transport backing wafer system 11 and position it on chuck 18 for processing. although the following detailed description contains many specifics for the purposes of illustration, anyone of ordinary skill in the art will appreciate that many variations and alterations to the following details are within the scope of the invention. accordingly, the following preferred embodiment of the invention is set forth without any loss of generality to, and without imposing limitations upon, the claimed invention. the main features of the invention are shown in figs. 3a-c. a disk member 24 contains a raised supporting edge 26 for supporting a wafer, a holding portion 30 that is held by robotic transfer means 22 of fig. 2, and means for positioning the wafer 28. in fig. 3a, positioning means 28 is shown as a pin for aligning with a known point on the wafer. in fig. 3c, the device has an aperture 33 extending through a disk member 32 and a holding portion 34. a cooling gas flows through aperture 33 from below holding portion 34 to reach the bottom surface of the wafer. in general, the device is used with a cooling gas and aperture 33, in which case it includes a means for maintaining an airtight seal between the holding device and the. wafer. alternate embodiments of a raised supporting edge 36, 40, and 44 of different shapes and of correspondingly shaped deformable materials 38, 42, and 46 are shown in figs. 4a-c. a preferred embodiment of the invention is shown in figs. 5a-d. the wafer is supported by a planar top surface 56 of raised supporting edge 36. an o-ring 52 rests on the top surface of disk member 32 and contacts an inner wall 50 of raised supporting edge 36. when the wafer is secured to planar top surface 56 and o-ring 52 is compressed, an airtight seal between the wafer and the device is created. an annular protrusion 57, the preferred embodiment of holding portion 34 shown in fig. 3c, depends from the bottom surface of disk member 32. in the most preferred embodiment, annular protrusion 57 is the size of a standard silicon wafer, for fitting robotic transfer means 22, shown in fig. 2. pegs 54 and 55 position the wafer with its flat portion against pegs 55. only one rotational orientation of the wafer is permitted by the arrangement of pegs 54 and 55. to secure the wafer to disk member 32, an annular ring 58, shown in top and bottom views in figs. 5c and 5d, respectively, is placed over the wafer. annular ring 58 has holes 60 for fitting over pegs 54 and 55 and a raised rim 62 on its bottom surface for fitting around disk member 32. figs. 6a and 6b show an alternate embodiment of the invention. instead of pegs 54 and 55 of fig. 5a, the wafer is fixed in position using a raised ridge 64. an annular ring 66, shown in fig. 6b, with raised rim 68 on its bottom surface, is placed over the wafer to secure the wafer to disk member 32. annular ring 66 is similar to annular ring 58 of figs. 5c and 5d, but lacks holes 60. many alternate means for positioning the wafer may be imagined, each with correspondingly shaped rings for securing the wafer to the device. a further possible embodiment is shown in fig. 7a-b, in which a bar 70 is positioned against the flat portion of the wafer and pegs 54 restrict the wafer position. a corresponding angular ring 72 with a cutout portion 76 to accommodate bar 70 and a raised rim 74 is shown in fig. 7b. depending on the structure of the surrounding process equipment, a modified annular protrusion 78, shown in fig. 8, can have an inner diameter larger than aperture 33 to accommodate flow of a cooling gas. figs. 9 and 10 are front schematics of two possible embodiments of a wafer-processing system incorporating the present invention, a wafer holding device 84. the systems are similar to the prior art system shown in fig. 2, except that robotic transfer means 22 now hold wafer holding device 84 rather than backing wafer system 11. process chamber 16, chuck 18, processing tool 20, and robotic transfer means 22 are identical to those used in the prior art system. also shown in figs. 9 and 10 are channels 82 inside chuck 18 for flowing gas to wafer holding device 84. two methods are currently used to clamp wafer backing system 11 to chuck 18, namely mechanical and electrostatic. both methods can be used to clamp wafer holding device 84 to chuck 18. the mechanical method of fig. 9 uses weight mechanisms 86 to secure wafer holding device 84 to chuck 18. referring to fig. 5, weight mechanisms 86 also compress o-ring 52 to maintain an airtight seal between the wafer and wafer holding device 84. when electrostatic clamping is used, clips 88 secure annular ring 58 and the wafer to disk member 32. it will be clear to one skilled in the art that the above embodiment may be altered in many ways without departing from the scope of the invention. for example, instead of a ring member, the wafer can be secured to the disk member using clips. to support irregularly sized and shaped wafers, the supporting edge can also be irregularly shaped. accordingly, the scope of the invention should be determined by the following claims and their legal equivalents.
184-514-225-400-701	US	[ "US" ]	H04N19/70,H04N19/172,H04N19/44	2021-02-18T00:00:00	2021	[ "H04" ]	systems and methods for signaling buffer output information in video coding	a method of decoding video data includes receiving a first decoding unit information message corresponding to a first decoding unit of a current access unit, determining a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message, and based on the syntax element not being present in the first decoding unit information message, inferring the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit.	1 . a method of decoding video data, the method comprising: receiving a first decoding unit information message corresponding to a first decoding unit of a current access unit; determining a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message; and based on the syntax element not being present in the first decoding unit information message, inferring the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit. 2 . the method of claim 1 , wherein the syntax element used to compute the decoded picture buffer output time of the current access unit is a decoding unit information (dui) decoded picture buffer (dpb) output decoding unit (du) delay syntax element. 3 . a device comprising one or more processors configured to: receive a first decoding unit information message corresponding to a first decoding unit of a current access unit; determine a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message; and based on the syntax element not being present in the first decoding unit information message, infer the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit. 4 . the device of claim 3 , wherein the syntax element used to compute the decoded picture buffer output time of the current access unit is a decoding unit information (dui) decoded picture buffer (dpb) output decoding unit (du) delay syntax element. 5 . the device of claim 3 , wherein the device includes a video decoder. 6 . a non-transitory computer-readable storage medium comprising instructions stored thereon that, when executed, cause one or more processors of a device to: receive a first decoding unit information message corresponding to a first decoding unit of a current access unit; determine a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message; and based on the syntax element not being present in the first decoding unit information message, infer the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit. 7 . the non-transitory computer-readable storage medium of claim 6 , wherein the syntax element used to compute the decoded picture buffer output time of the current access unit is a decoding unit information (dui) decoded picture buffer (dpb) output decoding unit (du) delay syntax element.	cross-reference to related application the present application claims priority from provisional application no. 63/151,028, the contents of which are hereby incorporated by reference into this application. technical field this disclosure relates to video coding and more particularly to techniques for signaling buffering information for coded video. background digital video capabilities can be incorporated into a wide range of devices, including digital televisions, laptop or desktop computers, tablet computers, digital recording devices, digital media players, video gaming devices, cellular telephones, including so-called smartphones, medical imaging devices, and the like. digital video may be coded according to a video coding standard. video coding standards define the format of a compliant bitstream encapsulating coded video data. a compliant bitstream is a data structure that may be received and decoded by a video decoding device to generate reconstructed video data. video coding standards may incorporate video compression techniques. examples of video coding standards include iso/iec mpeg-4 visual and itu-t h.264 (also known as iso/iec mpeg-4 avc) and high-efficiency video coding (hevc). hevc is described in high efficiency video coding (hevc), rec. itu-t h.265, december 2016, which is incorporated by reference, and referred to herein as itu-t h.265. extensions and improvements for itu-t h.265 are currently being considered for the development of next generation video coding standards. for example, the itu-t video coding experts group (vceg) and iso/iec (moving picture experts group (mpeg) (collectively referred to as the joint video exploration team (jvet)) are working to standardized video coding technology with a compression capability that significantly exceeds that of the current hevc standard. the joint exploration model 7 (jem 7), algorithm description of joint exploration test model 7 (jem 7), iso/iec jtc1/sc29/wg11 document: jvet-g1001, july 2017, torino, it, which is incorporated by reference herein, describes the coding features that were under coordinated test model study by the jvet as potentially enhancing video coding technology beyond the capabilities of itu-t h.265. it should be noted that the coding features of jem 7 are implemented in jem reference software. as used herein, the term jem may collectively refer to algorithms included in jem 7 and implementations of jem reference software. further, in response to a “joint call for proposals on video compression with capabilities beyond hevc,” jointly issued by vceg and mpeg, multiple descriptions of video coding tools were proposed by various groups at the 10 th meeting of iso/iec jtc1/sc29/wg11 16-20 apr. 2018, san diego, calif. from the multiple descriptions of video coding tools, a resulting initial draft text of a video coding specification is described in “versatile video coding (draft 1),” 10 th meeting of iso/iec jtc1/sc29/wg11 16-20 apr. 2018, san diego, calif., document jvet-j1001-v2, which is incorporated by reference herein, and referred to as jvet-j1001. the current development of a next generation video coding standard by the vceg and mpeg is referred to as the versatile video coding (vvc) project. “versatile video coding (draft 10),” 20 th meeting of iso/iec jtc1/sc29/wg11 7-16 oct. 2020, teleconference, document jvet-t2001-v2, which is incorporated by reference herein, and referred to as jvet-t2001, represents the current iteration of the draft text of a video coding specification corresponding to the vvc project. video compression techniques enable data requirements for storing and transmitting video data to be reduced. video compression techniques may reduce data requirements by exploiting the inherent redundancies in a video sequence. video compression techniques may sub-divide a video sequence into successively smaller portions (i.e., groups of pictures within a video sequence, a picture within a group of pictures, regions within a picture, sub-regions within regions, etc.). intra prediction coding techniques (e.g., spatial prediction techniques within a picture) and inter prediction techniques (i.e., inter-picture techniques (temporal)) may be used to generate difference values between a unit of video data to be coded and a reference unit of video data. the difference values may be referred to as residual data. residual data may be coded as quantized transform coefficients. syntax elements may relate residual data and a reference coding unit (e.g., intra-prediction mode indices, and motion information). residual data and syntax elements may be entropy coded. entropy encoded residual data and syntax elements may be included in data structures forming a compliant bitstream. summary in general, this disclosure describes various techniques for coding video data. in particular, this disclosure describes techniques for signaling buffering period information for coded video data. it should be noted that although techniques of this disclosure are described with respect to itu-t h.264, itu-t h.265, jem, and jvet-t2001, the techniques of this disclosure are generally applicable to video coding. for example, the coding techniques described herein may be incorporated into video coding systems, (including video coding systems based on future video coding standards) including video block structures, intra prediction techniques, inter prediction techniques, transform techniques, filtering techniques, and/or entropy coding techniques other than those included in itu-t h.265, jem, and jvet-t2001. thus, reference to itu-t h.264, itu-t h.265, jem, and/or jvet-t2001 is for descriptive purposes and should not be construed to limit the scope of the techniques described herein. further, it should be noted that incorporation by reference of documents herein is for descriptive purposes and should not be construed to limit or create ambiguity with respect to terms used herein. for example, in the case where an incorporated reference provides a different definition of a term than another incorporated reference and/or as the term is used herein, the term should be interpreted in a manner that broadly includes each respective definition and/or in a manner that includes each of the particular definitions in the alternative. in one example, a method of decoding video data comprises receiving a first decoding unit information message corresponding to a first decoding unit of a current access unit, determining a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message, and based on the syntax element not being present in the first decoding unit information message, inferring the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit. in one example, a device comprises one or more processors configured to receive a first decoding unit information message corresponding to a first decoding unit of a current access unit, determine a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message, and based on the syntax element not being present in the first decoding unit information message, infer the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit. in one example, a non-transitory computer-readable storage medium comprises instructions stored thereon that, when executed, cause one or more processors of a device to receive a first decoding unit information message corresponding to a first decoding unit of a current access unit, determine a syntax element used to compute a decoded picture buffer output time of the current access unit is not present in the first decoding unit information message, and based on the syntax element not being present in the first decoding unit information message, infer the value of the syntax element to be equal to a value of a corresponding instance of the syntax element in a second decoding unit information message, wherein the second decoding unit information corresponds to a second decoding unit belonging to the current access unit. the details of one or more examples are set forth in the accompanying drawings and the description below. other features, objects, and advantages will be apparent from the description and drawings, and from the claims. brief description of drawings fig. 1 is a block diagram illustrating an example of a system that may be configured to encode and decode video data according to one or more techniques of this disclosure. fig. 2 is a conceptual diagram illustrating coded video data and corresponding data structures according to one or more techniques of this disclosure. fig. 3 is a conceptual diagram illustrating a data structure encapsulating coded video data and corresponding metadata according to one or more techniques of this disclosure. fig. 4 is a conceptual drawing illustrating an example of components that may be included in an implementation of a system that may be configured to encode and decode video data according to one or more techniques of this disclosure. fig. 5 is a block diagram illustrating an example of a video encoder that may be configured to encode video data according to one or more techniques of this disclosure. fig. 6 is a block diagram illustrating an example of a video decoder that may be configured to decode video data according to one or more techniques of this disclosure. detailed description video content includes video sequences comprised of a series of frames (or pictures). a series of frames may also be referred to as a group of pictures (gop). each video frame or picture may divided into one or more regions. regions may be defined according to a base unit (e.g., a video block) and sets of rules defining a region. for example, a rule defining a region may be that a region must be an integer number of video blocks arranged in a rectangle. further, video blocks in a region may be ordered according to a scan pattern (e.g., a raster scan). as used herein, the term video block may generally refer to an area of a picture or may more specifically refer to the largest array of sample values that may be predictively coded, sub-divisions thereof, and/or corresponding structures. further, the term current video block may refer to an area of a picture being encoded or decoded. a video block may be defined as an array of sample values. it should be noted that in some cases pixel values may be described as including sample values for respective components of video data, which may also be referred to as color components, (e.g., luma (y) and chroma (cb and cr) components or red, green, and blue components). it should be noted that in some cases, the terms pixel value and sample value are used interchangeably. further, in some cases, a pixel or sample may be referred to as a pel. a video sampling format, which may also be referred to as a chroma format, may define the number of chroma samples included in a video block with respect to the number of luma samples included in a video block. for example, for the 4:2:0 sampling format, the sampling rate for the luma component is twice that of the chroma components for both the horizontal and vertical directions. a video encoder may perform predictive encoding on video blocks and sub-divisions thereof. video blocks and sub-divisions thereof may be referred to as nodes. itu-t h.264 specifies a macroblock including 16×16 luma samples. that is, in itu-t h.264, a picture is segmented into macroblocks. itu-t h.265 specifies an analogous coding tree unit (ctu) structure (which may be referred to as a largest coding unit (lcu)). in itu-t h.265, pictures are segmented into ctus. in itu-t h.265, for a picture, a ctu size may be set as including 16×16, 32×32, or 64×64 luma samples. in itu-t h.265, a ctu is composed of respective coding tree blocks (ctb) for each component of video data (e.g., luma (y) and chroma (cb and cr). it should be noted that video having one luma component and the two corresponding chroma components may be described as having two channels, i.e., a luma channel and a chroma channel. further, in itu-t h.265, a ctu may be partitioned according to a quadtree (qt) partitioning structure, which results in the ctbs of the ctu being partitioned into coding blocks (cb). that is, in itu-t h.265, a ctu may be partitioned into quadtree leaf nodes. according to itu-t h.265, one luma cb together with two corresponding chroma cbs and associated syntax elements are referred to as a coding unit (cu). in itu-t h.265, a minimum allowed size of a cb may be signaled. in itu-t h.265, the smallest minimum allowed size of a luma cb is 8×8 luma samples. in itu-t h.265, the decision to code a picture area using intra prediction or inter prediction is made at the cu level. in itu-t h.265, a cu is associated with a prediction unit structure having its root at the cu. in itu-t h.265, prediction unit structures allow luma and chroma cbs to be split for purposes of generating corresponding reference samples. that is, in itu-t h.265, luma and chroma cbs may be split into respective luma and chroma prediction blocks (pbs), where a pb includes a block of sample values for which the same prediction is applied. in itu-t h.265, a cb may be partitioned into 1, 2, or 4 pbs. itu-t h.265 supports pb sizes from 64×64 samples down to 4×4 samples. in itu-t h.265, square pbs are supported for intra prediction, where a cb may form the pb or the cb may be split into four square pbs. in itu-t h.265, in addition to the square pbs, rectangular pbs are supported for inter prediction, where a cb may be halved vertically or horizontally to form pbs. further, it should be noted that in itu-t h.265, for inter prediction, four asymmetric pb partitions are supported, where the cb is partitioned into two pbs at one quarter of the height (at the top or the bottom) or width (at the left or the right) of the cb. intra prediction data (e.g., intra prediction mode syntax elements) or inter prediction data (e.g., motion data syntax elements) corresponding to a pb is used to produce reference and/or predicted sample values for the pb. jem specifies a ctu having a maximum size of 256×256 luma samples. jem specifies a quadtree plus binary tree (qtbt) block structure. in jem, the qtbt structure enables quadtree leaf nodes to be further partitioned by a binary tree (bt) structure. that is, in jem, the binary tree structure enables quadtree leaf nodes to be recursively divided vertically or horizontally. in jvet-t2001, ctus are partitioned according a quadtree plus multi-type tree (qtmt or qt+mtt) structure. the qtmt in jvet-t2001 is similar to the qtbt in jem. however, in jvet-t2001, in addition to indicating binary splits, the multi-type tree may indicate so-called ternary (or triple tree (tt)) splits. a ternary split divides a block vertically or horizontally into three blocks. in the case of a vertical tt split, a block is divided at one quarter of its width from the left edge and at one quarter its width from the right edge and in the case of a horizontal tt split a block is at one quarter of its height from the top edge and at one quarter of its height from the bottom edge. as described above, each video frame or picture may be divided into one or more regions. for example, according to itu-t h.265, each video frame or picture may be partitioned to include one or more slices and further partitioned to include one or more tiles, where each slice includes a sequence of ctus (e.g., in raster scan order) and where a tile is a sequence of ctus corresponding to a rectangular area of a picture. it should be noted that a slice, in itu-t h.265, is a sequence of one or more slice segments starting with an independent slice segment and containing all subsequent dependent slice segments (if any) that precede the next independent slice segment (if any). a slice segment, like a slice, is a sequence of ctus. thus, in some cases, the terms slice and slice segment may be used interchangeably to indicate a sequence of ctus arranged in a raster scan order. further, it should be noted that in itu-t h.265, a tile may consist of ctus contained in more than one slice and a slice may consist of ctus contained in more than one tile. however, itu-t h.265 provides that one or both of the following conditions shall be fulfilled: (1) all ctus in a slice belong to the same tile; and (2) all ctus in a tile belong to the same slice. with respect to jvet-t2001, slices are required to consist of an integer number of complete tiles or an integer number of consecutive complete ctu rows within a tile, instead of only being required to consist of an integer number of ctus. it should be noted that in jvet-t2001, the slice design does not include slice segments (i.e., no independent/dependent slice segments). thus, in jvet-t2001, a picture may include a single tile, where the single tile is contained within a single slice or a picture may include multiple tiles where the multiple tiles (or ctu rows thereof) may be contained within one or more slices. in jvet-t2001, the partitioning of a picture into tiles is specified by specifying respective heights for tile rows and respective widths for tile columns. thus, in jvet-t2001 a tile is a rectangular region of ctus within a particular tile row and a particular tile column position. further, it should be noted that jvet-t2001 provides where a picture may be partitioned into subpictures, where a subpicture is a rectangular region of a ctus within a picture. the top-left ctu of a subpicture may be located at any ctu position within a picture with subpictures being constrained to include one or more slices thus, unlike a tile, a subpicture is not necessarily limited to a particular row and column position. it should be noted that subpictures may be useful for encapsulating regions of interest within a picture and a sub-bitstream extraction process may be used to only decode and display a particular region of interest. that is, as described in further detail below, a bitstream of coded video data includes a sequence of network abstraction layer (nal) units, where a nal unit encapsulates coded video data, (i.e., video data corresponding to a slice of picture) or a nal unit encapsulates metadata used for decoding video data (e.g., a parameter set) and a sub-bitstream extraction process forms a new bitstream by removing one or more nal units from a bitstream. fig. 2 is a conceptual diagram illustrating an example of a picture within a group of pictures partitioned according to tiles, slices, and subpictures. it should be noted that the techniques described herein may be applicable to tiles, slices, subpictures, sub-divisions thereof and/or equivalent structures thereto. that is, the techniques described herein may be generally applicable regardless of how a picture is partitioned into regions. for example, in some cases, the techniques described herein may be applicable in cases where a tile may be partitioned into so-called bricks, where a brick is a rectangular region of ctu rows within a particular tile. further, for example, in some cases, the techniques described herein may be applicable in cases where one or more tiles may be included in so-called tile groups, where a tile group includes an integer number of adjacent tiles. in the example illustrated in fig. 2 , pic 3 is illustrated as including 16 tiles (i.e., tile 0 to tile 15 ) and three slices (i.e., slice 0 to slice 2 ). in the example illustrated in fig. 2 , slice 0 includes four tiles (i.e., tile 0 to tile 3 ), slice 1 includes eight tiles (i.e., tile 4 to tile 1 ), and slice 2 includes four tiles (i.e., tile 12 to tile 15 ). further, as illustrated in the example of fig. 2 , pic 3 is illustrated as including two subpictures (i.e., subpicture 0 and subpicture 1 ), where subpicture 0 includes slice 0 and slice 1 and where subpicture 1 includes slice 2 . as described above, subpictures may be useful for encapsulating regions of interest within a picture and a sub-bitstream extraction process may be used in order to selectively decode (and display) a region interest. for example, referring to fig. 2 , subpicture 0 may corresponding to an action portion of a sporting event presentation (e.g., a view of the field) and subpicture 1 may corresponding to a scrolling banner displayed during the sporting event presentation. by using organizing a picture into subpictures in this manner, a viewer may be able to disable the display of the scrolling banner. that is, through a sub-bitstream extraction process slice 2 nal unit may be removed from a bitstream (and thus not decoded and/or displayed) and slice 0 nal unit and slice 1 nal unit may be decoded and displayed. the encapsulation of slices of a picture into respective nal unit data structures and sub-bitstream extraction are described in further detail below. for intra prediction coding, an intra prediction mode may specify the location of reference samples within a picture. in itu-t h.265, defined possible intra prediction modes include a planar (i.e., surface fitting) prediction mode, a dc (i.e., flat overall averaging) prediction mode, and 33 angular prediction modes (predmode: 2-34). in jem, defined possible intra-prediction modes include a planar prediction mode, a dc prediction mode, and 65 angular prediction modes. it should be noted that planar and dc prediction modes may be referred to as non-directional prediction modes and that angular prediction modes may be referred to as directional prediction modes. it should be noted that the techniques described herein may be generally applicable regardless of the number of defined possible prediction modes. for inter prediction coding, a reference picture is determined and a motion vector (mv) identifies samples in the reference picture that are used to generate a prediction for a current video block. for example, a current video block may be predicted using reference sample values located in one or more previously coded picture(s) and a motion vector is used to indicate the location of the reference block relative to the current video block. a motion vector may describe, for example, a horizontal displacement component of the motion vector (i.e., mv x ), a vertical displacement component of the motion vector (i.e., mv y ), and a resolution for the motion vector (e.g., one-quarter pixel precision, one-half pixel precision, one-pixel precision, two-pixel precision, four-pixel precision). previously decoded pictures, which may include pictures output before or after a current picture, may be organized into one or more to reference pictures lists and identified using a reference picture index value. further, in inter prediction coding, uni-prediction refers to generating a prediction using sample values from a single reference picture and bi-prediction refers to generating a prediction using respective sample values from two reference pictures. that is, in uni-prediction, a single reference picture and corresponding motion vector are used to generate a prediction for a current video block and in bi-prediction, a first reference picture and corresponding first motion vector and a second reference picture and corresponding second motion vector are used to generate a prediction for a current video block. in bi-prediction, respective sample values are combined (e.g., added, rounded, and clipped, or averaged according to weights) to generate a prediction. pictures and regions thereof may be classified based on which types of prediction modes may be utilized for encoding video blocks thereof. that is, for regions having a b type (e.g., a b slice), bi-prediction, uni-prediction, and intra prediction modes may be utilized, for regions having a p type (e.g., a p slice), uni-prediction, and intra prediction modes may be utilized, and for regions having an i type (e.g., an i slice), only intra prediction modes may be utilized. as described above, reference pictures are identified through reference indices. for example, for a p slice, there may be a single reference picture list, refpiclist0 and for a b slice, there may be a second independent reference picture list, refpiclist1, in addition to refpiclist0. it should be noted that for uni-prediction in a b slice, one of refpiclist0 or refpiclist1 may be used to generate a prediction. further, it should be noted that during the decoding process, at the onset of decoding a picture, reference picture list(s) are generated from previously decoded pictures stored in a decoded picture buffer (dpb). further, a coding standard may support various modes of motion vector prediction. motion vector prediction enables the value of a motion vector for a current video block to be derived based on another motion vector. for example, a set of candidate blocks having associated motion information may be derived from spatial neighboring blocks and temporal neighboring blocks to the current video block. further, generated (or default) motion information may be used for motion vector prediction. examples of motion vector prediction include advanced motion vector prediction (amvp), temporal motion vector prediction (tmvp), so-called “merge” mode, and “skip” and “direct” motion inference. further, other examples of motion vector prediction include advanced temporal motion vector prediction (atmvp) and spatial-temporal motion vector prediction (stmvp). for motion vector prediction, both a video encoder and video decoder perform the same process to derive a set of candidates. thus, for a current video block, the same set of candidates is generated during encoding and decoding. as described above, for inter prediction coding, reference samples in a previously coded picture are used for coding video blocks in a current picture. previously coded pictures which are available for use as reference when coding a current picture are referred as reference pictures. it should be noted that the decoding order does not necessary correspond with the picture output order, i.e., the temporal order of pictures in a video sequence. in itu-t h.265, when a picture is decoded it is stored to a decoded picture buffer (dpb) (which may be referred to as frame buffer, a reference buffer, a reference picture buffer, or the like). in itu-t h.265, pictures stored to the dpb are removed from the dpb when they been output and are no longer needed for coding subsequent pictures. in itu-t h.265, a determination of whether pictures should be removed from the dpb is invoked once per picture, after decoding a slice header, i.e., at the onset of decoding a picture. for example, referring to fig. 2 , pic 2 is illustrated as referencing pic 1 . similarly, pic 3 is illustrated as referencing pic 0 . with respect to fig. 2 , assuming the picture number corresponds to the decoding order, the dpb would be populated as follows: after decoding pic 0 , the dpb would include {pic 0 }; at the onset of decoding pic 1 , the dpb would include {pic 0 }; after decoding pic 1 , the dpb would include {pic 0 , pic 1 }; at the onset of decoding pic 2 , the dpb would include {pic 0 , pic 1 }. pic 2 would then be decoded with reference to pic 1 and after decoding pic 2 , the dpb would include {pic 0 , pic 1 , pic 2 }. at the onset of decoding pic 3 , pictures pic 0 and pic 1 would be marked for removal from the dpb, as they are not needed for decoding pic; (or any subsequent pictures, not shown) and assuming pic 1 and pic 2 have been output, the dpb would be updated to include {pic 0 }. pic 3 would then be decoded by referencing pic 0 . the process of marking pictures for removal from a dpb may be referred to as reference picture set (rps) management. as described above, intra prediction data or inter prediction data is used to produce reference sample values for a block of sample values. the difference between sample values included in a current pb, or another type of picture area structure, and associated reference samples (e.g., those generated using a prediction) may be referred to as residual data. residual data may include respective arrays of difference values corresponding to each component of video data. residual data may be in the pixel domain. a transform, such as, a discrete cosine transform (dct), a discrete sine transform (dst), an integer transform, a wavelet transform, or a conceptually similar transform, may be applied to an array of difference values to generate transform coefficients. it should be noted that in itu-t h.265 and jvet-t2001, a cu is associated with a transform tree structure having its root at the cu level. the transform tree is partitioned into one or more transform units (tus). that is, an array of difference values may be partitioned for purposes of generating transform coefficients (e.g., four 8×8 transforms may be applied to a 16×16 array of residual values). for each component of video data, such sub-divisions of difference values may be referred to as transform blocks (tbs). it should be noted that in some cases, a core transform and subsequent secondary transforms may be applied (in the video encoder) to generate transform coefficients. for a video decoder, the order of transforms is reversed. a quantization process may be performed on transform coefficients or residual sample values directly (e.g., in the case, of palette coding quantization). quantization approximates transform coefficients by amplitudes restricted to a set of specified values. quantization essentially scales transform coefficients in order to vary the amount of data required to represent a group of transform coefficients. quantization may include division of transform coefficients (or values resulting from the addition of an offset value to transform coefficients) by a quantization scaling factor and any associated rounding functions (e.g., rounding to the nearest integer). quantized transform coefficients may be referred to as coefficient level values. inverse quantization (or “dequantization”) may include multiplication of coefficient level values by the quantization scaling factor, and any reciprocal rounding or offset addition operations. it should be noted that as used herein the term quantization process in some instances may refer to division by a scaling factor to generate level values and multiplication by a scaling factor to recover transform coefficients in some instances. that is, a quantization process may refer to quantization in some cases and inverse quantization in some cases. further, it should be noted that although in some of the examples below quantization processes are described with respect to arithmetic operations associated with decimal notation, such descriptions are for illustrative purposes and should not be construed as limiting. for example, the techniques described herein may be implemented in a device using binary operations and the like. for example, multiplication and division operations described herein may be implemented using bit shifting operations and the like. quantized transform coefficients and syntax elements (e.g., syntax elements indicating a coding structure for a video block) may be entropy coded according to an entropy coding technique. an entropy coding process includes coding values of syntax elements using lossless data compression algorithms. examples of entropy coding techniques include content adaptive variable length coding (cavlc), context adaptive binary arithmetic coding (cabac), probability interval partitioning entropy coding (pipe), and the like. entropy encoded quantized transform coefficients and corresponding entropy encoded syntax elements may form a compliant bitstream that can be used to reproduce video data at a video decoder. an entropy coding process, for example, cabac, may include performing a binarization on syntax elements. binarization refers to the process of converting a value of a syntax element into a series of one or more bits. these bits may be referred to as “bins.” binarization may include one or a combination of the following coding techniques: fixed length coding, unary coding, truncated unary coding, truncated rice coding, golomb coding, k-th order exponential golomb coding, and golomb-rice coding. for example, binarization may include representing the integer value of 5 for a syntax element as 00000101 using an 8-bit fixed length binarization technique or representing the integer value of 5 as 11110 using a unary coding binarization technique. as used herein each of the terms fixed length coding, unary coding, truncated unary coding, truncated rice coding, golomb coding, k-th order exponential golomb coding, and golomb-rice coding may refer to general implementations of these techniques and/or more specific implementations of these coding techniques. for example, a golomb-rice coding implementation may be specifically defined according to a video coding standard. in the example of cabac, for a particular bin, a context provides a most probable state (mps) value for the bin (i.e., an mps for a bin is one of 0 or 1) and a probability value of the bin being the mps or the least probably state (lps). for example, a context may indicate, that the mps of a bin is 0 and the probability of the bin being 1 is 0.3. it should be noted that a context may be determined based on values of previously coded bins including bins in the current syntax element and previously coded syntax elements. for example, values of syntax elements associated with neighboring video blocks may be used to determine a context for a current bin. with respect to the equations used herein, the following arithmetic operators may be used: + addition− subtractionmultiplication, including matrix multiplicationx y exponentiation. specifies x to the power of y. in other contexts, such notation is used for superscripting not intended for interpretation as exponentiation./ integer division with truncation of the result toward zero. for example, 7/4 and −7/−4 are truncated to 1 and −7/4 and 7/−4 are truncated to −1.÷ used to denote division in mathematical equations where no truncation or rounding is intended. used to denote division in mathematical equations where no truncation or rounding is intended. further, the following mathematical functions may be used: log2(x) the base-2 logarithm of x; ceil(x) the smallest integer greater than or equal to x. with respect to the example syntax used herein, the following definitions of logical operators may be applied: x && y boolean logical “and” of x and yx∥y boolean logical “or” of x and y! boolean logical “not”x ? y: z if x is true or not equal to 0, evaluates to the value of y; otherwise, evaluates to the value of z. further, the following relational operators may be applied: > greater than>= greater than or equal to< less than<= less than or equal to= equal to!= not equal to further, it should be noted that in the syntax descriptors used herein, the following descriptors may be applied: b(8): byte having any pattern of bit string (8 bits). the parsing process for this descriptor is specified by the return value of the function read_bits(8).f(n): fixed-pattern bit string using n bits written (from left to right) with the left bit first. the parsing process for this descriptor is specified by the return value of the function read_bits(n).se(v): signed integer 0-th order exp-golomb-coded syntax element with the left bit first.tb(v): truncated binary using up to maxval bits with maxval defined in the semantics of the symtax element.tu(v): truncated unary using up to maxval bits with maxval defined in the semantics of the symtax element.u(n): unsigned integer using n bits. when n is “v” in the syntax table, the number of bits varies in a manner dependent on the value of other syntax elements. the parsing process for this descriptor is specified by the return value of the function read_bits(n) interpreted as a binary representation of an unsigned integer with most significant bit written first.ue(v): unsigned integer 0-th order exp-golomb-coded syntax element with the left bit first. as described above, video content includes video sequences comprised of a series of pictures and each picture may be divided into one or more regions. in jvet-t2001, a coded representation of a picture comprises vcl nal units of a particular layer within an au and contains all ctus of the picture. for example, referring again to fig. 2 , the coded representation of pic 3 is encapsulated in three coded slice nal units (i.e., slice 0 nal unit, slice 1 nal unit, and slice 2 nal unit). it should be noted that the term video coding layer (vcl) nal unit is used as a collective term for coded slice nal units, i.e., vcl nal is a collective term which includes all types of slice nal units. as described above, and in further detail below, a nal unit may encapsulate metadata used for decoding video data. a nal unit encapsulating metadata used for decoding a video sequence is generally referred to as a non-vcl nal unit. thus, in jvet-t2001, a nal unit may be a vcl nal unit or a non-vcl nal unit. it should be noted that a vcl nal unit includes slice header data, which provides information used for decoding the particular slice. thus, in jvet-t2001, information used for decoding video data, which may be referred to as metadata in some cases, is not limited to being included in non-vcl nal units. jvet-t2001 provides where a picture unit (pu) is a set of nal units that are associated with each other according to a specified classification rule, are consecutive in decoding order, and contain exactly one coded picture and where an access unit (au) is a set of pus that belong to different layers and contain coded pictures associated with the same time for output from the dpb. jvet-t2001 further provides where a layer is a set of vcl nal units that all have a particular value of a layer identifier and the associated non-vcl nal units. further, in jvet-t2001, a pu consists of zero or one ph nal units, one coded picture, which comprises of one or more vcl nal units, and zero or more other non-vcl nal units. further, in jvet-t2001, a coded video sequence (cvs) is a sequence of aus that consists, in decoding order, of a cvss au, followed by zero or more aus that are not cvss aus, including all subsequent aus up to but not including any subsequent au that is a cvss au, where a coded video sequence start (cvss) au is an au in which there is a pu for each layer in the cvs and the coded picture in each present picture unit is a coded layer video sequence start (clvss) picture. in jvet-t2001, a coded layer video sequence (clvs) is a sequence of pus within the same layer that consists, in decoding order, of a clvss pu, followed by zero or more pus that are not clvss pus, including all subsequent pus up to but not including any subsequent pu that is a clvss pu. this is, in jvet-t2001, a bitstream may be described as including a sequence of aus forming one or more cvss. multi-layer video coding enables a video presentation to be decoded/displayed as a presentation corresponding to a base layer of video data and decoded/displayed one or more additional presentations corresponding to enhancement layers of video data. for example, a base layer may enable a video presentation having a basic level of quality (e.g., a high definition rendering and/or a 30 hz frame rate) to be presented and an enhancement layer may enable a video presentation having an enhanced level of quality (e.g., an ultra high definition rendering and/or a 60 hz frame rate) to be presented. an enhancement layer may be coded by referencing a base layer. that is, for example, a picture in an enhancement layer may be coded (e.g., using inter-layer prediction techniques) by referencing one or more pictures (including scaled versions thereof) in a base layer. it should be noted that layers may also be coded independent of each other. in this case, there may not be inter-layer prediction between two layers. each nal unit may include an identifier indicating a layer of video data the nal unit is associated with. as described above, a sub-bitstream extraction process may be used to only decode and display a particular region of interest of a picture. further, a sub-bitstream extraction process may be used to only decode and display a particular layer of video. sub-bitstream extraction may refer to a process where a device receiving a compliant or conforming bitstream forms a new compliant or conforming bitstream by discarding and/or modifying data in the received bitstream. for example, sub-bitstream extraction may be used to form a new compliant or conforming bitstream corresponding to a particular representation of video (e.g., a high quality representation). in jvet-t2001, each of a video sequence, a gop, a picture, a slice, and ctu may be associated with metadata that describes video coding properties and some types of metadata an encapsulated in non-vcl nal units. jvet-t2001 defines parameters sets that may be used to describe video data and/or video coding properties. in particular, jvet-t2001 includes the following four types of parameter sets: video parameter set (vps), sequence parameter set (sps), picture parameter set (pps), and adaption parameter set (aps), where a sps applies to apply to zero or more entire cvss, a pps applies to zero or more entire coded pictures, a aps applies to zero or more slices, and a vps may be optionally referenced by a sps. a pps applies to an individual coded picture that refers to it. in jvet-t2001, parameter sets may be encapsulated as a non-vcl nal unit and/or may be signaled as a message. jvet-t2001 also includes a picture header (ph) which is encapsulated as a non-vcl nal unit. in jvet-t2001, a picture header applies to all slices of a coded picture. jvet-t2001 further enables decoding capability information (dci) and supplemental enhancement information (sei) messages to be signaled. in jvet-t2001, dci and sei messages assist in processes related to decoding, display or other purposes, however, dci and sei messages may not be required for constructing the luma or chroma samples according to a decoding process. in jvet-t2001, dci and sei messages may be signaled in a bitstream using non-vcl nal units. further, dci and sei messages may be conveyed by some mechanism other than by being present in the bitstream (i.e., signaled out-of-band). fig. 3 illustrates an example of a bitstream including multiple cvss, where a cvs includes aus, and aus include picture units. the example illustrated in fig. 3 corresponds to an example of encapsulating the slice nal units illustrated in the example of fig. 2 in a bitstream. in the example illustrated in fig. 3 , the corresponding picture unit for pic 3 includes the three vcl nal coded slice nal units, i.e., slice 0 nal unit, slice 1 nal unit, and slice 2 nal unit and two non-vcl nal units, i.e., a pps nal unit and a ph nal unit. it should be noted that in fig. 3 , header is a nal unit header (i.e., not to be confused with a slice header). further, it should be noted that in fig. 3 , other non-vcl nal units, which are not illustrated may be included in the cvss, e.g., sps nal units, vps nal units, sei message nal units, etc. further, it should be noted that in other examples, a pps nal unit used for decoding pic 3 may be included elsewhere in the bitstream, e.g., in the picture unit corresponding to pic 0 or may be provided by an external mechanism. as described in further detail below, in jvet-t2001, a ph syntax structure may be present in the slice header of a vcl nal unit or in a ph nal unit of the current pu. jvet-t2001 defines nal unit header semantics that specify the type of raw byte sequence payload (rbsp) data structure included in the nal unit. table 1 illustrates the syntax of the nal unit header provided in jvet-t2001. table 1descriptornal_unit_header( ) {forbidden_zero_bitf(1)nub_reserved_zero_bitu(1)nuh_layer_idu(6)nal_unit_typeu(5)nuh_temporal_id_plus1u(3)} jvet-t2001 provides the following definitions for the respective syntax elements illustrated in table 1. forbidden_zero_bit shall be equal to 0. nuh_reserved_zero_bit shall be equal to 0. the value 1 of nuh_reserved_zero_bit could be specified in the future by itu-t\|iso/iec. although the value of nuh_reserved_zero_bit is required to be equal to 0 in this version of this specification, decoders conforming to this version of this specification shall allow the value of nuh_reserved_zero_bit equal to 1 to appear in the syntax and shall ignore (i.e. remove from the bitstream and discard) nal units with nuh_reserved_zero_bit equal to 1. nuh_layer_id specifies the identifier of the layer to which a vcl nal unit belongs or the identifier of a layer to which a non-vcl nal unit applies. the value of nuh_layer_id shall be in the range of 0 to 55, inclusive. other values for nuh_layer_id are reserved for future use by itu-t\|iso/iec. although the value of nuh_layer_id is required to be the range of 0 to 55, inclusive, in this version of this specification, decoders conforming to this version of this specification shall allow the value of nuh_layer_id to be greater than 55 to appear in the syntax and shall ignore (i.e. remove from the bitstream and discard) nal units with nuh_layer_id greater than 55. the value of nuh_layer_id shall be the same for all vcl nal units of a coded picture. the value of nuh_layer_id of a coded picture or a pu is the value of the nuh_layer_id of the vcl nal units of the coded picture or the pu. when nal_unit_type is equal to ph_nut, or fd_nut, nuh_layer_id shall be equal to the nub_layer_id of associated vcl nal unit. when nal_unit_type is equal to eos_nut, nuh_layer_id shall be equal to one of the nuh_layer_id values of the layers present in the cvs. note—the value of nuh_layer_id for dci, opi, vps, aud, and eob nal units is not constrained. nuh_temporal_id_plus1 minus 1 specifies a temporal identifier for the nal unit. the value of nuh_temporal_id_plus1 shall not be equal to 0. the variable temporalid is derived as follows: temporalid= nuh _temporal_id_plus1−1 when nal_unit_type is in the range of idr_w_radl to rsv_rap_11, inclusive, temporalid shall be equal to 0. when nal_unit_type is equal to stsa_nut and vps_independent_layer_flag[generallayeridx[nuh_layer_id] ] is equal to 1, temporalid shall be greater than 0. the value of temporalid shall be the same for all vcl nal units of an au. the value of temporalid of a coded picture, a pu, or an au is the value of the temporalid of the vcl nal units of the coded picture, pu, or au. the value of temporalid of a sublayer representation is the greatest value of temporalid of all vcl nal units in the sublayer representation. the value of temporalid for non-vcl nal units is constrained as follows: if nal_unit_type is equal to dci_nut, opi_nut, vps_nut, or sps_nut, temporalid shall be equal to 0 and the temporalid of the au containing the nal unit shall be equal to 0.otherwise, if nal_unit_type is equal to ph_nut, temporalid shall be equal to the temporalid of the pu containing the nal unit.otherwise, if nal_unit_type is equal to eos_nut or eob_nut, temporalid shall be equal to 0.otherwise, if nal_unit_type is equal to aud_nut, fd_nut, prefix_sei_nut, or suffix_sei_nut, temporalid shall be equal to the temporalid of the au containing the nal unit.otherwise, when nal_unit_type is equal to pps_nut, prefix_aps_nut, or suffix_aps_nut, temporalid shall be greater than or equal to the temporalid of the pu containing the nal unit. note—when the nal unit is a non-vcl nal unit, the value of temporalid is equal to the minimum value of the temporalid values of all aus to which the non-vcl nal unit applies. when nal_unit_type is equal to pps_nut, prefix_aps_nut, or suffix_aps_nut, temporalid could be greater than or equal to the temporalid of the containing au, as all ppss and apss could be included in the beginning of the bitstream (e.g., when they are transported out-of-band, and the receiver places them at the beginning of the bitstream), wherein the first coded picture has temporalid equal to 0. nal_unit_type specifies the nal unit type, i.e., the type of rbsp data structure contained in the nal unit as specified in table 2. nal units that have nal_unit_type in the range of unspec28 . . . unspec31, inclusive, for which semantics are not specified, shall not affect the decoding process specified in this specification. note—nal unit types in the range of unspec_28 . . . unspec_31 could be used as determined by the application. no decoding process for these values of nal_unit_type is specified in this specification. since different applications might use these nal unit types for different purposes, particular care is expected to be exercised in the design of encoders that generate nal units with these nal_unit_type values, and in the design of decoders that interpret the content of nal units with these nal_unit_type values. this specification does not define any management for these values. these nal_unit_type values might only be suitable for use in contexts in which “collisions” of usage (i.e., different definitions of the meaning of the nal unit content for the same nal_unit_type value) are unimportant, or not possible, or are managed—e.g., defined or managed in the controlling application or transport specification, or by controlling the environment in which bitstreams are distributed. for purposes other than determining the amount of data in the dus of the bitstream (as specified in annex c), decoders shall ignore (remove from the bitstream and discard) the contents of all nal units that use reserved values of nal_unit_type. note—this requirement allows future definition of compatible extensions to this specification. table 2nalunitname ofcontent of nal unit and rbsp syntaxtypenal_unit_typenal_unit_typestructureclass0trail_nutcoded slice of a trailing picture orvclsubpictureslice_layer_rbsp( )1stsa_nutcoded slice of an stsa picture orvclsubpictureslice_layer_rbsp( )2radl_nutcoded slice of a radl, picture or subpicturevclslice_layer_rbsp( )3rasl_nutcoded slice of a rasl picture or subpicturevclslice_layer_rbsp( )4 . . . 6rsv_vcl_4 . . .reserved non-irap vcl nal unit typesvclrsv_vcl_67idr_w_radlcoded slice of an idr picture or subpicturevcl8idr_n_lpslice_layer_rbsp( )9cra_nutcoded slice of a cra picture or subpicturevclslice_layer_rbsp( )10gdr_nutcoded slice of a gdr picture or subpicturevclslice_layer_rbsp( )11rsv_irap_11reserved irap vcl nal unit typevcl12opi_nutoperating point informationnon-vcloperating_point_information_rbsp( )13dci_nutdecoding capability informationnon-vcldecoding_capability_information_rbsp( )14vps_nutvideo parameter setnon-vclvideo_parameter_set_rbsp( )15sps_nutsequence parameter setnon-vclseq_parameter_set_rbsp( )16pps_nutpicture parameter setnon-vclpic_parameter_set_rbsp( )17prefix_aps_nutadaptation parameter setnon-vcl18suffix_aps_nutadaptation_parameter_set_rbsp( )19ph_nutpicture headernon-vclpicture_header_rbsp( )20aud_nutau delimiternon-vclaccess_unit_delimiter_rbsp( )21eos_nutend of sequencenon-vclend_of_seq_rbsp( )22eob_nutend of bitstreamnon-vclend_of_bitstream_rbsp( )23prefix_sei_nutsupplemental enhancement informationnon-vcl24suffix_sei_nutsei_rbsp( )25fd_nutfiller datanon-vclfiller_data_rbsp( )26rsv_nvcl_26reserved non-vcl nal unit typesnon-vcl27rsv_nvcl_2728 . . . 31unspec_28 . . .unspecified non-vcl nal unit typesnon-vclunspec_31indicates a property of a picture when pps_mixed_nalu_types_in_pic_flag is equal to 0 and a property of the subpicture when pps_mixed_nalu_types_in_pic_flag is equal to 1. note—a clean random access (cra) picture may have associated rasl or radl pictures present in the bitstream. note—an instantaneous decoding refresh (idr) picture having nal_unit_type equal to idr_n_lp does not have associated leading pictures present in the bitstream. an idr picture having nal_unit_type equal to idr_w_radl does not have associated rasl pictures present in the bitstream, but may have associated radl pictures in the bitstream. the value of nal_unit_type shall be the same for all vcl nal units of a subpicture. a subpicture is referred to as having the same nal unit type as the vcl nal units of the subpicture. for vcl nal units of any particular picture, the following applies: if pps_mixed_nalu_types_in_pic_flag is equal to 0, the value of nal_unit_type shall be the same for all vcl nal units of a picture, and a picture or a pu is referred to as having the same nal unit type as the coded slice nal units of the picture or pu.otherwise (pps_mixed_nalu_types_in_pic_flag is equal to 1), all of the following constraints apply: the picture shall have at least two subpictures.vcl nal units of the picture shall have two or more different nal_unit_type values.there shall be no vcl nal unit of the picture that has nal_unit_type equal to gdr_nut.when a vcl nal unit of the picture has nal_unit_type equal to nalunittypea that is equal to idr_w_radl, idr_n_lp, or cra_nut, other vcl nal units of the picture shall all have nal_unit_type equal to nalunittypea or trail_nut. the value of nal_unit_type shall be the same for all pictures in an irap or gdr au. when sps_video_parameter_set_id is greater than 0, vps_max_tid_il_ref_pics_plus1 [i][j] is equal to 0 for j equal to generallayeridx[nuh_layer_id] and any value of i in the range of j+1 to vps_max_layers_minus1, inclusive, and pps_mixed_nalu_types_in_pic_flag is equal to 1, the value of nal_unit_type shall not be equal to idr_w_radl, idr_n_lp, or cra_nut. it is a requirement of bitstream conformance that the following constraints apply:when a picture is a leading picture of an irap picture, it shall be a radl or rasl picture.when a subpicture is a leading subpicture of an irap subpicture, it shall be a radl or rasl subpicture.when a picture is not a leading picture of an irap picture, it shall not be a radl or rasl picture.when a subpicture is not a leading subpicture of an irap subpicture, it shall not be a radl or rasl subpicture.no rasl pictures shall be present in the bitstream that are associated with an idr picture.no rasl subpictures shall be present in the bitstream that are associated with an idr subpicture.no radl pictures shall be present in the bitstream that are associated with an idr picture having nal_unit_type equal to idr_n_lp. note—it is possible to perform random access at the position of an irap au by discarding all pus before the irap au (and to correctly decode the non-rasl pictures in the irap au and all the subsequent aus in decoding order), provided each parameter set is available (either in the bitstream or by external means not specified in this specification) when it is referenced.no radl subpictures shall be present in the bitstream that are associated with an idr subpicture having nal_unit_type equal to idr_n_lp.any picture, with nuh_layer_id equal to a particular value layerid, that precedes an irap picture with nuh_layer_id equal to layerid in decoding order shall precede the irap picture in output order and shall precede any radl picture associated with the irap picture in output order.any subpicture, with nuh_layer_id equal to a particular value layerid and subpicture index equal to a particular value subpicidx, that precedes, in decoding order, an irap subpicture with nuh_layer_id equal to layerid and subpicture index equal to subpicidx shall precede, in output order, the irap subpicture and all its associated radl subpictures.any picture, with nuh_layer_id equal to a particular value layerid, that precedes a recovery point picture with nuh_layer_id equal to layerid in decoding order shall precede the recovery point picture in output order.any subpicture, with nuh_layer_id equal to a particular value layerid and subpicture index equal to a particular value subpicidx, that precedes, in decoding order, a subpicture with nuh_layer_id equal to layerid and subpicture index equal to subpicidx in a recovery point picture shall precede that subpicture in the recovery point picture in output order.any rasl picture associated with a cra picture shall precede any radl picture associated with the cra picture in output order.any rasl subpicture associated with a cra subpicture shall precede any radl subpicture associated with the cra subpicture in output order.any rasl picture, with nuh_layer_id equal to a particular value layerid, associated with a cra picture shall follow, in output order, any irap or gdr picture with nuh_layer_id equal to layerid that precedes the cra picture in decoding order.any rasl subpicture, with nuh_layer_id equal to a particular value layerid and subpicture index equal to a particular value subpicidx, associated with a cra subpicture shall follow, in output order, any irap or gdr subpicture, with nuh_layer_id equal to layerid and subpicture index equal to subpicidx, that precedes the cra subpicture in decoding order.if sps_field_seq_flag is equal to 0, the following applies: when the current picture, with nuh_layer_id equal to a particular value layerid, is a leading picture associated with an irap picture, it shall precede, in decoding order, all non-leading pictures that are associated with the same irap picture. otherwise (sps_field_seq_flag is equal to 1), let pica and picb be the first and the last leading pictures, in decoding order, associated with an irap picture, respectively, there shall be at most one non-leading picture with nuh_layer_id equal to layerid preceding pica in decoding order, and there shall be no non-leading picture with nuh_layer_id equal to layerid between pica and picb in decoding order.if sps_field_seq_flag is equal to 0, the following applies: when the current subpicture, with nuh_layer_id equal to a particular value layerid and subpicture index equal to a particular value subpicidx, is a leading subpicture associated with an irap subpicture, it shall precede, in decoding order, all non-leading subpictures that are associated with the same irap subpicture. otherwise (sps_field_seq_flag is equal to 1), let subpica and subpicb be the first and the last leading subpictures, in decoding order, associated with an irap subpicture, respectively, there shall be at most one non-leading subpicture with nuh_layer_id equal to layerid and subpicture index equal to subpicidx preceding subpica in decoding order, and there shall be no non-leading picture with nuh_layer_id equal to layerid and subpicture index equal to subpicidx between pica and picb in decoding order. it should be noted that generally, an intra random access point (trap) picture is a picture that does not refer to any pictures other than itself for prediction in its decoding process. in jvet-t2001, an irap picture may be a clean random access (cra) picture or an instantaneous decoder refresh (idr) picture. in jvet-t2001, the first picture in the bitstream in decoding order must be an irap or a gradual decoding refresh (gdr) picture. jvet-t2001 describes the concept of a leading picture, which is a picture that precedes the associated irap picture in output order. jvet-t2001 further describes the concept of a trailing picture which is a non-irap picture that follows the associated irap picture in output order. trailing pictures associated with an trap picture also follow the irap picture in decoding order. for idr pictures, there are no trailing pictures that require reference to a picture decoded prior to the idr picture. jvet-t2001 provides where a cra picture may have leading pictures that follow the cra picture in decoding order and contain inter picture prediction references to pictures decoded prior to the cra picture. thus, when the cra picture is used as a random access point these leading pictures may not be decodable and are identified as random access skipped leading (rasl) pictures. the other type of picture that can follow an trap picture in decoding order and precede it in output order is the random access decodable leading (radl) picture, which cannot contain references to any pictures that precede the irap picture in decoding order. a gdr picture, is a picture for which each vcl nal unit has nal_unit_type equal to gdr_nut. if the current picture is a gdr picture that is associated with a picture header which signals a syntax element recovery_poc_cnt and there is a picture pica that follows the current gdr picture in decoding order in the clvs and that has picordercntval equal to the picordercntval of the current gdr picture plus the value of recovery_poc_cnt, the picture pica is referred to as the recovery point picture. as described above, jvet-q2001 enables set messages to be signaled which assist in processes related to decoding, display or other purposes. further, a type of sei message for vcl hrd operations includes buffering period sei messages. as provided in table 2, a nal unit may include a supplemental enhancement information (sei) syntax structure. an sei_payload( ) syntax structure may include a buffering_period( ) syntax structure. table 3 illustrates the bufferingperiod( ) syntax structure provided in jvet-t2001. table 3descriptorbuffering_period( payload size ) {bp_nal_hrd_params_present_flagu(1)bp_vcl_hrd_params_present_flagu(1)bp_cpb_initial_removal_delay_length_minus1u(5)bp_cpb_removal_delay_length_minus1u(5)bp_dpb_output_delay_length_minus1u(5)bp_du_hrd_params_present_flagu(1)if( bp_du_hrd_params_present_flag ) {bp_du_cpb_removal_delay_increment_length_minus1u(5)bp_dpb_output_delay_du_length_minus1u(5)bp_du_cpb_params_in_pic_timing_sei_flagu(1)bp_du_dpb_params_in_pic_timing_sei_flagu(1)}bp_concatenation_flagu(1)bp_additional_concatenation_info_present_flagu(1)if( bp_additional_concatenation_info_present_flag )bp_max_initial_removal_delay_for_concatenationu(v)bp_cpb_removal_delay_delta_minus1u(v)bp_max_sublayers_minus1u(3)if( bp_max_sublayers_minus1 > 0 )bp_cpb_removal_delay_deltas_present_flagu(1)if( bp_cpb_removal_delay_deltas_present_flag ) {bp_num_cpb_removal_delay_deltas_minus1ue(v)for( i = 0; i <= bp_num_cpb_removal_delay_deltas_minus1; i++ )bp_cpb_removal_delay_delta_val[ i ]u(v)}bp_cpb_cnt_minus1ue(v)if( bp_max_sublayers_minus1 > 0 )bp_sublayer_initial_cpb_removal_delay_present_flagu(1)for( i = ( bp_sublayer_initial_cpb_removal_delay_present_flag ?0 : bp_max_sublayers_minus1 ); i <= bp_max_sublayers_minus1;i++ ) {if( bp_nal_hrd_params_present_flag )for( j = 0; j < bp_cpb_cnt_minus1 + 1; j++ ) {bp_nal_initial_cpb_removal_delay[ i ][ j ]u(v)bp_nal_initial_cpb_removal_offset[ i ][ j ]u(v)if( bpu_du_hrd_params_present_flag) {bp_nal_initial_alt_cpb_removal_delay[ i ][ j ]u(v)bp_nal_initial_alt_cpb_removal_offset[ i ][ j ]u(v)}}if( bp_vcl_hrd_params_present_flag )for( j = 0; j < bp_cpb_cnt_minus1 + ; j++ ) {bp_vcl_initial_cpb_removal_delay[ i ][ j ]u(v)bp_vcl_initial_cpb_removal_offset[ i ][ j ]u(v)if( bp_du_hrd_params_present_flag ) {bp_vcl_initial_alt_cpb_removal_delay[ i ][ j ]u(v)bp_vcl_initial_alt_cpb_removal_offset[ i ][ j ]u(v)}}}if( bp_max_sublayers_minus1 > 0 )bp_sublayer_dpb_output_offsets_present_flagu(1)if( bp_sublayer_dpb_output_offsets_present_flag )for( i = 0; i < bp_max_sublayers_minus1; i++ )bp_dpb_output_tid_offset[ i ]ue(v)bp_alt_cpb_params_present_flagu(1)if( bp_alt_cpb_params_present_flag )bp_use_alt_cpb_params_flagu(1)} with respect to table 3, jvet-t2001 provides the following semantics: a bp sei message provides initial cpb removal delay and initial cpb removal delay offset information for initialization of the hrd at the position of the associated au in decoding order. when the bp sei message is present, an au is said to be a notdiscardableau when the au has temporalid equal to 0 and has at least one picture that has ph_non_ref_pic_flag equal to 0 that is not a rasl or radl picture. when the current au is not the first au in the bitstream in decoding order, let the au prevnondiscardableau be the previous au in decoding order with temporalid equal to 0 that has at least one picture that has ph_non_ref_pic_flag equal to 0 that is not a rasl or radl picture. the presence of bp sei messages is specified as follows: if nalhrdbppresentflag is equal to 1 or vclhrdbppresentflag is equal to 1, the following applies for each au in the cvs: if the au is an trap or gdr au, a bp sei message applicable to the operation point shall be associated with the au.otherwise, if the au is a notdiscardableau, a bp set message applicable to the operation point might or might not be associated with the au.otherwise, the au shall not be associated with a bp sei message applicable to the operation point.otherwise (nalhrdbppresentflag and vclhrdbppresentflag are both equal to 0), no au in the cvs shall be associated with a bp sei message.note—for some applications, frequent presence of bp sei messages could be desirable (e.g., for random access at an irap au or a non-irap au or for bitstream splicing). bp_nal_hrd_params_present_flag equal to 1 specifies that a list of syntax element pairs bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_cpb_removal_offset[i][j] are present in the bp sei message. bp_nal_hrd_params_present_flag equal to 0 specifies that no syntax element pairs bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_cpb_removal_offset[i][j] are present in the bp sei message. the value of bp_nal_hrd_params_present_flag shall be equal to general_nal_hrd_params_present_flag. bp_vcl_hrd_params_present_flag equal to 1 specifies that a list of syntax element pairs bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_cpb_removal_offset[i][j] are present in the bp sei message. bp_vcl_hrd_params_present_flag equal to 0 specifies that no syntax element pairs bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_cpb_removal_offset[i][j] are present in the bp sei message. the value of bp_vcl_hrd_params_present_flag shall be equal to general_vcl_hrd_params_present_flag. bp_vcl_hrd_params_present_flag and bp_nal_hrd_params_present_flag in a bp sei message shall not both be equal to 0. bp_cpb_initial_removal_delay_length_minus1 plus 1 specifies the length, in bits, of the syntax elements bp_nal_initial_cpb_removal_delay[i][j], bp_nal_initial_cpb_removal_offset[i][j], bp_vcl_initial_cpb_removal_delay[i][j], and bp_vcl_initial_cpb_removal_offset[i][j] of the bp sei messages, and the syntax elements pt_nal_cpb_alt_initial_removal_delay_delta[i][j], pt_vcl_cpb_alt_initial_removal_delay_delta[i][j], pt_nal_cpb_alt_initial_removal_offset_delta[i][j] and pt_vcl_cpb_alt_initial_removal_offset_delta[i][j] in the pt sei messages in the current bp. when not present, the value of bp_cpb_initial_removal_delay_length_minus1 is inferred to be equal to 23. bp_cpb_removal_delay_length_minus1 plus 1 specifies the length, in bits, of the syntax elements bp_cpb_removal_delay_delta_minus1 and bp_cpb_removal_delay_delta_val[i] in the bp sei message and the syntax elements pt_cpb_removal_delay_minus1[i], pt_nal_cpb_delay_offset[i] and pt_vcl_cpb_delay_offset[i] in the pt sei messages in the current bp. when not present, the value of bp_cpb_removal_delay_length_minus1 is inferred to be equal to 23. bp_dpb_output_delay_length_minus1 plus 1 specifies the length, in bits, of the syntax elements pt_dpb_output_delay, pt_nal_dpb_delay_offset[i] and pt_vcl_dpb_delay_offset[i] in the pt sei messages in the current bp. when not present, the value of bp_dpb_output_delay_length_minus1 is inferred to be equal to 23. bp_du_hrd_params_present_flag equal to 1 specifies that du level hrd parameters are present and the hrd can be operated at the au level or du level. bp_du_hrd_params_present_flag equal to 0 specifies that du level hrd parameters are not present and the hrd operates at the au level. when bp_du_hrd_params_present_flag is not present, its value is inferred to be equal to 0. the value of bp_du_hrd_params_present_flag shall be equal to general_du_hrd_params_present_flag. when bp_alt_cpb_params_present_flag is equal to 1, the value of bp_du_hrd_params_present_flag shall be equal to 0. bp_du_cpb_removal_delay_increment_length_minus1 plus 1 specifies the length, in bits, of the pt_du_cpb_removal_delay_increment_minus1[ ][ ] and pt_du_common_cpb_removal_delay_increment_minus1[ ] syntax elements of the pt sei messages in the current bp and the dui_du_cpb_removal_delay_increment[ ] syntax element in the dui sei messages in the current bp. when not present, the value of bp_du_cpb_removal_delay_increment_length_minus1 is inferred to be equal to 23. bp_dpb_output_delay_du_length_minus1 plus 1 specifies the length, in bits, of the pt_dpb_output_du_delay syntax element in the pt sei messages in the current bp and the dui_dpb_output_du_delay syntax element in the dui sei messages in the current bp. when not present, the value of bp_dpb_output_delay_du_length_minus1 is inferred to be equal to 23. it is a requirement of bitstream conformance that all scalable-nested and non-scalable nested bp sei messages in a cvs shall have the same value for each of the syntax elements bp_cpb_initial_removal_delay_length_minus1, bp_cpb_removal_delay_length_minus1, bp_dpb_output_delay_length_minus1, bp_du_cpb_removal_delay_increment_length_minus1, and bp_dpb_output_delay_du_length_minus1. bp_du_cpb_params_in_pic_timing_sei_flag equal to 1 specifies that du level cpb removal delay parameters are present in pt sei messages and no dui sei message is available (in the cvs or provided through external means not specified in this specification). bp_du_cpb_params_in_pic_timing_sei_flag equal to 0 specifies that du level cpb removal delay parameters are present in dui sei messages and pt sei messages do not include du level cpb removal delay parameters. when the bp_du_cpb_params_in_pic_timing_sei_flag syntax element is not present, it is inferred to be equal to 0. bp_du_dpb_params_in_pic_timing_sei_flag equal to 1 specifies that du level dpb output delay parameters are present in pt sei messages and not in dui sei messages. bp_du_dpb_params_in_pic_timing_sei_flag equal to 0 specifies that du level dpb output delay parameters are present in dui sei messages and not in pt sei messages. when the bp_du_dpb_params_in_pic_timing_sei_flag syntax element is not present, it is inferred to be equal to 0. bp_concatenation_flag indicates, when the current au is not the first au in the bitstream in decoding order, whether the nominal cpb removal time of the current au is determined relative to the nominal cpb removal time of the previous au associated with a bp sei message or relative to the nominal cpb removal time of the au prevnondiscardableau. bp_additional_concatenation_info_present_flag equal to 1 specifies that the syntax element bp_max_initial_removal_delay_for_concatenation is present in the bp sei message and the syntax element pt_delay_for_concatenation_ensured_flag is present in the pt sei messages. bp_additional_concatenation_info_present_flag equal to 0 specifies that the syntax element bp_max_initial_removal_delay_for_concatenation is not present in the bp set message and the syntax element pt_delay_for_concatenation_ensured_flag is not present in the pt sei messages. bp_max_initial_removal_delay_for_concatenation could be used together with pt_delay_for_concatenation_ensured_flag in a pt sei message to identify whether the nominal removal time from the cpb of the first au of a following bp computed with bp_cpb_removal_delay_delta_minus1 applies. the length of bp_max_initial_removal_delay_for_concatenation is bp_cpb_initial_removal_delay_length_minus1+1 bits. bp_cpb_removal_delay_delta_minus1 plus 1, when the current au is not the first au in the bitstream in decoding order, specifies a cpb removal delay increment value relative to the nominal cpb removal time of the au prevnondiscardableau. the length of this syntax element is bp_cpb_removal_delay_length_minus1+1 bits. when the current au is associated with a bp sei message and bp_concatenation_flag is equal to 0 and the current au is not the first au in the bitstream in decoding order, it is a requirement of bitstream conformance that the following constraint applies:if the au prevnondiscardableau is not associated with a bp sei message, the pt_cpb_removal_delay_minus1 of the current au shall be equal to the pt_cpb_removal_delay_minus1 of the au prevnondiscardableau plus bp_cpb_removal_delay_delta_minus1+1.otherwise, pt_cpb_removal_delay_minus1 shall be equal to bp_cpb_removal_delay_delta_minus1.note—when the current au is associated with a bp sei message and bp_concatenation_flag is equal to 1, the pt_cpb_removal_delay_minus1 for the current au is not used. the constraint expressed for pt_cpb_removal_delay_minus1 could, under some circumstances, make it possible to splice bitstreams (that use suitably-designed referencing structures) by simply changing the value of bp_concatenation_flag from 0 to 1 in the bp sei message for an trap or gdr au at the splicing point. when bp_concatenation_flag is equal to 0, the constraint expressed for pt_cpb_removal_delay_minus1 enables the decoder to check whether the constraint is satisfied as a way to detect the loss of the au prevnondiscardableau. bp_cpb_removal_delay_deltas_present_flag equal to 1 specifies that the bp sei message contains cpb removal delay deltas. bp_cpb_removal_delay_deltas_present_flag equal to 0 specifies that no cpb removal delay deltas are present in the bp sei message. when not present bp_cpb_removal_delay_deltas_present_flag is inferred to be equal to 0. bp_num_cpb_removal_delay_deltas_minus1 plus 1 specifies the number of syntax elements bp_cpb_removal_delay_delta_val[i] in the bp sei message. the value of num_cpb_removal_offsets_minus1 shall be in the range of 0 to 15, inclusive. bp_cpb_removal_delay_delta_val[i] specifies the i-th cpb removal delay delta. the length of this syntax element is bp_cpb_removal_delay_length_minus1+1 bits. bp_max_sublayers_minus1 plus 1 specifies the maximum number of temporal sublayers for which the initial cpb removal delay and the initial cpb removal offset are indicated in the bp sei message. the value of bp_max_sublayers_minus1 shall be in the range of 0 to vps_max_sublayers_minus1, inclusive. bp_cpb_cnt_minus1 plus 1 specifies the number of syntax element pairs bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_cpb_removal_offset[i][j] of the i-th temporal sublayer when bp_nal_hrd_params_present_flag is equal to 1, and the number of syntax element pairs bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_cpb_removal_offset[i][j] of the i-th temporal sublayer when bp_vcl_hrd_params_present_flag is equal to 1. the value of bp_cpb_cnt_minus1 shall be in the range of 0 to 31, inclusive. the value of bp_cpb_cnt_minus1 shall be equal to the value of hrd_cpb_cnt_minus1. bp_sublayer_initial_cpb_removal_delay_present_flag equal to 1 specifies that initial cpb removal delay related syntax elements are present for sublayer representation(s) in the range of 0 to bp_max_sublayers_minus1, inclusive. bp_sublayer_initial_cpb_removal_delay_present_flag equal to 0 specifies that initial cpb removal delay related syntax elements are present for the bp_max_sublayers_minus1-th sublayer representation. when not present, the value of bp_sublayer_initial_cpb_removal_delay_present_flag is inferred to be equal to 0. bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_alt_cpb_removal_delay[i][j] specify the j-th default and alternative initial cpb removal delay for the nal hrd in units of a 90 khz clock of the i-th temporal sublayer. the length of bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_alt_cpb_removal_delay[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. the value of bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_alt_cpb_removal_delay[i][j] shall not be equal to 0 and shall be less than or equal to 90000(cpbsize[i][j]÷bitrate[i][j]), the time-equivalent of the cpb size in 90 khz clock units. when not present, the values of bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_alt_cpb_removal_delay[i][j] are inferred to be equal to 90000(cpbsize[i][j]÷bitrate[i][j]). bp_nal_initial_cpb_removal_offset[i][j] and bp_nal_initial_alt_cpb_removal_offset[i][j] specify the j-th default and alternative initial cpb removal offset of the i-th temporal sublayer for the nal hrd in units of a 90 khz clock. the length of bp_nal_initial_cpb_removal_offset[i][j] and bp_nal_initial_alt_cpb_removal_offset[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. when not present, the values of bp_nal_initial_cpb_removal_offset[i][j] and bp_nal_initial_alt_cpb_removal_offset[i][j] are inferred to be equal to 0. over the entire cvs, for each value pair of i and j, the sum of bp_nal_initial_cpb_removal_delay[i][j] and bp_nal_initial_cpb_removal_offset[i][j] shall be constant, and the sum of bp_nal_initial_alt_cpb_removal_delay[i][j] and bp_nal_initial_alt_cpb_removal_offset[i][j] shall be constant. bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_alt_cpb_removal_delay[i][j] specify the j-th default and alternative initial cpb removal delay of the i-th temporal sublayer for the vcl hrd in units of a 90 khz clock. the length of bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_alt_cpb_removal_delay[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. the value of bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_alt_cpb_removal_delay[i][j] shall not be equal to 0 and shall be less than or equal to 90000(cpbsize[i][j]÷bitrate[i][j]), the time-equivalent of the cpb size in 90 khz clock units. when not present, the values of bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_alt_cpb_removal_delay[i][j] are inferred to be equal to 90000(cpbsize[i][j]÷bitrate[i][j]). bp_vcl_initial_cpb_removal_offset[i][j] and bp_vcl_initial_alt_cpb_removal_offset[i][j] specify the j-th default and alternative initial cpb removal offset of the i-th temporal sublayer for the vcl hrd in units of a 90 khz clock. the length of bp_vcl_initial_cpb_removal_offset[i] and bp_vcl_initial_alt_cpb_removal_offset[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. when not present, the values of bp_vcl_initial_cpb_removal_offset[i][j] and bp_vcl_initial_alt_cpb_removal_offset[i][j] are inferred to be equal to 0. over the entire cvs, for each value pair of i and j the sum of bp_vcl_initial_cpb_removal_delay[i][j] and bp_vcl_initial_cpb_removal_offset[i][j] shall be constant, and the sum of bp_vcl_initial_alt_cpb_removal_delay[i][j] and bp_vcl_initial_alt_cpb_removal_offset[i][j] shall be constant. bp_sublayer_dpb_output_offsets_present_flag equal to 1 specifies that dpb output time offsets are present for sublayer representation(s) with temporalid in the range of 0 to bp_max_sublayers_minus1−1, inclusive. bp_sublayer_dpb_output_offsets_present_flag equal to 0 specified that no such dpb output time offsets are present. when not present, the value of bp_sublayer_dpb_output_offsets_present_flag is inferred to be equal to 0. bp_dpb_output_tid_offset[i] specifies the difference between the dpb output times for the i-th sublayer representation and the bp_max_sublayers_minus1-th sublayer representation. when bp_dpb_output_tid_offset[i] is not present, it is inferred to be equal to 0. bp_alt_cpb_params_present_flag equal to 1 specifies the presence of the syntax element bp_use_alt_cpb_params_flag in the bp sei message and the presence of the alternative timing information in the pt sei messages in the current bp. when not present, the value of bp_alt_cpb_params_present_flag is inferred to be equal to 0. when the associated au is not an irap or gdr au, the value of bp_alt_cpb_params_present_flag shall be equal to 0. bp_use_alt_cpb_params_flag could be used to derive the value of usealtcpbparamsflag. when bp_use_alt_cpb_params_flag is not present, it is inferred to be equal to 0. when one or more of the following conditions apply, usealtcpbparamsflag is set equal to 1:bp_use_alt_cpb_params_flag is equal to 1.when some external means not specified in this specification is available to set usealtcpbparamsflag and the value of usealtcpbparamsflag is set equal to 1 by the external means. an sei_payload( ) syntax structure may include a decoding_unit_info( ) syntax structure. table 4 illustrates the decoding_unit_info( ) syntax structure provided in jvet-t2001. table 4de-scrip-tordecoding_unit_info( payloadsize ) {dui_decoding_unit_idxue(v)if( !bp_du_cpb_params_in_pic_timing_sei_flag )for( i = temporalid; i <= bp_max_sublayers_minus1; i++ ) {if( i < bp_max_sublayers_minus1 )dui_sublayer_delays_present_flag[ i ]u(1)if( dui_sublayer_delays_present_flag[ i ] )dui_du_cpb_removal_delay_increment[ i ]u(v)}if( !bp_du_dpb_params_in_pic_timing_sei_flag )dui_dpb_output_du_delay_present_flagu(1)if( dui_dpb_output_du_delay_present_flag )dui_dpb_output_du_delayu(v)} with respect to table 4, jvet-t2001 provides the following semantics: the dui sei message provides cpb removal delay information for the du associated with the sei message. the following applies for the dui sei message syntax and semantics: the syntax elements bp_du_hrd_params_present_flag, bp_du_cpb_params_in_pic_timing_sei_flag, bp_du_dpb_params_in_pic_timing_sei_flag, and bp_dpb_output_delay_du_length_minus1 are found in the bp sei message that is applicable to at least one of the operation points to which the dui sei message applies.the bitstream (or a part thereof) refers to the bitstream subset (or a part thereof) associated with any of the operation points to which the dui sei message applies. the presence of dui sei messages for an operation point is specified as follows:if cpbdpbdelayspresentflag is equal to 1, bp_du_hrd_params_present_flag is equal to 1 and bp_du_cpb_params_in_pic_timing_sei_flag or bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, one or more dui sei messages applicable to the operation point shall be associated with each du in the cvs.otherwise, in the cvs there shall be no du that is associated with a dui sei message applicable to the operation point. the set of nal units associated with a dui sei message consists, in decoding order, of the sei nal unit containing the dui sei message and all subsequent nal units in the au up to but not including any subsequent sei nal unit containing a dui sei message with a different value of dui_decoding_unit_idx. each du shall include at least one vcl nal unit. all non-vcl nal units associated with a vcl nal unit shall be included in the du containing the vcl nal unit. the temporalid in the dui sei message syntax is the temporalid of the sei nal unit containing the dui sei message. dui_decoding_unit_idx specifies the index, starting from 0, to the list of dus in the current au, of the du associated with the dui sei message. the value of dui_decoding_unit_idx shall be in the range of 0 to picsizeinctbsy−1, inclusive. a du identified by a particular value of duidx includes and only includes all nal units associated with all dui sei messages that have dui_decoding_unit_idx equal to duidx. such a du is also referred to as associated with the dui sei messages having dui_decoding_unit_idx equal to duidx. for any two dus dua and dub in one au with dui_decoding_unit_idx equal to duidxa and duidxb, respectively, where duidxa is less than duidxb, dua shall precede dub in decoding order. a nal unit of one du shall not be present, in decoding order, between any two nal units of another du. dui_sublayer_delays_present_flag[i] equal to 1 specifies that dui_du_cpb_removal_delay_increment[i] is present for the sublayer with temporalid equal to i. dui_sublayer_delays_present_flag[i] equal to 0 specifies that dui_du_cpb_removal_delay_increment[i] is not present for the sublayer with temporalid equal to i. when not present, the value of dui_sublayer_delays_present_flag[i] is inferred to be as follows:if bp_du_cpb_params_in_pic_timing_sei_flag is equal to 0 and i is equal to bp_max_sublayers_minus1, the value of dui_sublayer_delays_present_flag[i] is inferred to be equal to 1.otherwise, the value of dui_sublayer_delays_present_flag[i] is inferred to be equal to 0. dui_du_cpb_removal_delay_increment[i] specifies the duration, in units of clock sub-ticks, between the nominal cpb times of the last du in decoding order in the current au and the du associated with the dui sei message when htid is equal to i. this value is also used to calculate an earliest possible time of arrival of du data into the cpb for the hss, as specified in annex c. the length of this syntax element is bp_du_cpb_removal_delay_increment_length_minus1+1. when the du associated with the dui sei message is the last du in the current au, the value of dui_du_cpb_removal_delay_increment[i] shall be equal to 0. when dui_du_cpb_removal_delay_increment[i] is not present for any value of i less than bp_max_sublayers_minus1, its value is inferred to be equal to dui_du_cpb_removal_delay_increment[bp_max_sublayers_minus1]. dui_dpb_output_du_delay_present_flag equal to 1 specifies the presence of the dui_dpb_output_du_delay syntax element in the dui sei message. dui_dpb_output_du_delay_present_flag equal to 0 specifies the absence of the dui_dpb_output_du_delay syntax element in the dui sei message. when not present, the value of dui_dpb_output_du_delay_present_flag is inferred to be equal to 0. dui_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1 and bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. when not present, the value of dui_dpb_output_du_delay is inferred to be equal to pt_dpb_output_du_delay. the length of the syntax element dui_dpb_output_du_delay is given in bits by bp_dpb_output_delay_du_length_minus1+1. it is a requirement of bitstream conformance that all dui sei messages that are associated with the same au, apply to the same operation point, and have bp_du_dpb_params_in_pic_timing_sei_flag equal to 0 shall have the same value of dui_dpb_output_du_delay. the output time derived from the dui_dpb_output_du_delay of any picture that is output from an output timing conforming decoder shall precede the output time derived from the dui_dpb_output_du_delay of all pictures in any subsequent cvs in decoding order. the picture output order established by the values of this syntax element shall be the same order as established by the values of picordercntval. for pictures that are not output by the “bumping” process because they precede, in decoding order, a cvss au that has sh_no_output_of_prior_pics_flag equal to 1 or inferred to be equal to 1, the output times derived from dui_dpb_output_du_delay shall be increasing with increasing value of picordercntval relative to all pictures within the same cvs. for any two pictures in the cvs, the difference between the output times of the two pictures when decodingunithrdflag is equal to 1 shall be identical to the same difference when decodingunithrdflag is equal to 0. an sei_payload( ) syntax structure may include a pic_timing( ) syntax structure. table 5 illustrates the pic_timing( ) syntax structure provided in jvet-t2001. table 5descriptorpic_timing( payloadsize ) {pt_cpb_removal_delay_minus1[ bp_max_sublayers_minus1 ]u(v)for( i = temporalid; i < bp_max_sublayers_minus1; i++ ) {pt_sublayer_delays_present_flag[ i ]u(1)if( pt_sublayer_delays_present_flag[ i ] ) {if( bp_cpb_removal_delay_deltas_present_flag )pt_cpb_removal_delay_delta_enabled_flag[ i ]u(1)if( pt_cpb_removal_delay_delta_enabled_flag[ i ] ) {if( bp_num_cpb_removal_delay_deltas_minus1 > 0 )pt_cpb_removal_delay_delta_idx[ i ]u(v)} elsept_cpb_removal_delay_minus1[ i ]u(v)}}pt_dpb_output_delayu(v)if( bp_alt_cpb_params_present_flag ) {pt_cpb_alt_timing_info_present_flagu(1)if( pt_cpb_alt_timing_info_present_flag ) {if( bp_nal_hrd_params_present_flag ) {for( i = ( bp_sublayer_initial_cpb_removal_delay_present_flag ? 0 :bp_max_sublayers_minus1 ); i <= bp_max_sublayers_minus1;i +++) {for( j = 0; j < bp_cpb_cnt_minus + 1; j++ ) {pt_nal_cpb_alt_initial_removal_delay_delta[ i ][ j ]u(v)pt_nal_cpb_alt_initial_removal_offset_delta[ i ][ j ]u(v)}pt_nal_cpb_delay_offset[ i ]u(v)pt_nal_dpb_delay_offset[ i ]u(v)}}if( bp_vcl_hrd_params_present_flag ) {for( i = ( bp_sublayer_initial_cpb_removal_delay_present_flag ? 0 :bp_max_sublayers_minus1 ); i <= bp_max_sublayers_minus1;i++ ) {for( j = 0; j < bp_cpb_cnt_minus1 + 1; j ++ ) {pt_vcl_cpb_alt_initial_removal_delay_delta[ i ][ j ]u(v)pt_vcl_cpb_alt_initial_removal_offset_delta[ i ][ j ]u(v)}pt_vcl_cpb_delay_offset[ i ]u(v)pt_vcl_dpb_delay_offset[ i ]u(v)}}}}if( bp_du_hrd_params_present_flag &&bp_du_dpb_params_in_pic_timing_sei_flag )pt_dpb_output_du_delayu(v)if( bp_du_hrd_params_present_flag &&bp_du_cpb_params_in_pic_timing_sei_flag ) {pt_num_decoding_units_minus1ue(v)if( pt_num_decoding_units_minus1 > 0 ) {pt_du_common_cpb_removal_delay_flagu(1)if( pt_du_common_cpb_removal_delay_flag )for( i = temporalid; i <= bp_max_sublayers_minus1; i++ )if( pt_sublayer_delays_present_flag[ i ] )pt_du_common_cpb_removal_delay_increment_minus1[ i ]u(v)for( i = 0; i <= pt_num_decoding_units_minus1; i++ ) {pt_num_nalus_in_du_minus1[ i ]ue(v)if( !pt_du_common_cpb_removal_delay_flag &&i < pt_num_decoding_units_minus1 )for( j = temporalid; j <= bp_max_sublayers_minus1; j++ )if( pt_sublayer_delays_present_flag[ j ] )pt_du_cpb_removal_delay_increment_minus1[ i ][ j ]u(v)}}}if( bp_additional_concatenation_info_present_flag )pt_delay_for_concatenation_ensured_flagu(1)pt_display_elemental_periods_minus1u(8)} with respect to table 5, jvet-t2001 provides the following semantics: the pt sei message provides cpb removal delay and dpb output delay information for the au associated with the sei message. if bp_nal_hrd_params_present_flag or bp_vcl_hrd_jarams_present_flag of the bp sei message applicable for the current au is equal to 1, the variable cpbdpbdelayspresentflag is set equal to 1. otherwise, cpbdpbdelayspresentflag is set equal to 0. the presence of pt sei messages is specified as follows: if cpbdpbdelayspresentflag is equal to 1, a pt sei message shall be associated with the current au.otherwise (cpbdpbdelayspresentflag is equal to 0), there shall not be a pt sei message associated with the current au. the temporalid in the pt sei message syntax is the temporalid of the sei nal unit containing the pt sei message. pt_cpb_removal_delay_minus1[i] plus 1 is used to calculate the number of clock ticks between the nominal cpb removal times of the au associated with the pt sei message and the preceding au in decoding order that contains a bp sei message when htid is equal to i. this value is also used to calculate an earliest possible time of arrival of au data into the cpb for the hss. the length of pt_cpb_removal_delay_minus1[i] is bp_cpb_removal_delay_length_minus1+1 bits. pt_sublayer_delays_present_flag[i] equal to 1 specifies that pt_cpb_removal_delay_delta_idx[i] or pt_cpb_removal_delay_minus1[i], and pt_du_common_cpb_removal_delay_increment_minus1[i] or pt_du_cpb_removal_delay_increment_minus1[ ][ ] are present for the sublayer with temporalid equal to i. sublayer_delays_present_flag[i] equal to 0 specifies that neither pt_cpb_removal_delay_delta_idx[i] nor pt_cpb_removal_delay_minus1[i] and neither pt_du_common_cpb_removal_delay_increment_minus1[i] nor pt_du_cpb_removal_delay_increment_minus1[ ][ ] are present for the sublayer with temporalid equal to i. the value of pt_sublayer_delays_present_flag[bp_max_sublayers_minus1] is inferred to be equal to 1. when not present, the value of pt_sublayer_delays_present_flag[i] for any i in the range of 0 to bp_max_sublayers_minus1−1, inclusive, is inferred to be equal to 0. pt_cpb_removal_delay_delta_enabled_flag[i] equal to 1 specifies that pt_cpb_removal_delay_delta_idx[i] is present in the pt sei message. pt_cpb_removal_delay_delta_enabled_flag[i] equal to 0 specifies that pt_cpb_removal_delay_delta_idx[i] is not present in the pt sei message. when not present, the value of pt_cpb_removal_delay_delta_enabled_flag[i] is inferred to be equal to 0. pt_cpb_removal_delay_delta_idx[i] specifies the index of the cpb removal delta that applies to htid equal to i in the list of bp_cpb_removal_delay_delta_val[j] for j ranging from 0 to bp_num_cpb_removal_delay_deltas_minus1, inclusive. the length of pt_cpb_removal_delay_delta_idx[i] is ceil(log2(bp_num_cpb_removal_delay_deltas_minus 1+1)) bits. when pt_cpb_removal_delay_delta_idx[i] is not present and pt_cpb_removal_delay_delta_enabled_flag[i] is equal to 1, the value of pt_cpb_removal_delay_delta_idx[i] is inferred to be equal to 0. the variables cpbremovaldelaymsb[i] and cpbremovaldelayval[i] of the current au are derived as follows:if the current au is the au that initializes the hrd, cpbremovaldelaymsb[i] and cpbremovaldelayval[i] are both set equal to 0, and the value of cpbremovaldelayvaltmp[i] is set equal to pt_cpb_removal_delay_minus1[i]+1.otherwise, let the au prevnondiscardableau be the previous au in decoding order with temporalid equal to 0 that has at least one picture that has ph_non_ref_pic_flag equal to 0 that is not a rasl or radl, let prevcpbremovaldelayminus1[i], prevcpbremovaldelaymsb[i], and prevbpresetflag be set equal to the values of cpbremovaldelayvaltmp[i]−1, cpbremovaldelaymsb[i], and bpresetflag, respectively, for the au prevnondiscardablau, and the following applies: cpbremovaldelaymsb[i] is derived as follows: cpbremovaldelayvaltmp[ i ] = pt_cpb_removal delay_delta_enabled_flag[ i ] ?pt_cpb_removal_delay_minus1[ bp_max_sublayers_minus1 ] + 1 +bp_cpb_removal_delay_delta_val[ pt_cpb_removal_delay_delta_idx[ 1 ] ] :pt_cpb_removal_delay_minus1[ i ] + 1if( prevbpresetflag )cpbremovaldelaymsb[ i ] = 0else if( cpbremovaldelayvaltmp[ i ] < prevcpbremovaldelayminus1[ i ] )cpbremovaldelaymsb[ i ] = prevcpbremovaldelaymsb[ i ] +2 bp — cpb — removal — delay — length — minus1 + 1elsecpbremovaldelaymsb[ i ] = prevcpbremovaldelaymsb[ i ]- cpbremovaldelayval is derived as follows:if( pt_sublayer_delays_present_flag[ i ] )cpbremovaldelayval[ i ] = cpbremovaldelaymsb[ i ] +cpbremovaldelayvaltmp[ i ]elsecpbremovaldelayval[ i ] = cpbremovaldelayval[ i + 1 ] the value of cpbremovaldelayval[i] shall be in the range of 1 to 2 32 , inclusive. the variable audpboutputdelta[i] is derived as follows: audpboutputdelta[i]=cpbremovaldelayval[i]−cpbremovaldelayval[bp_max_sublayers_minus1]−(i==bp_max_sublayers_minus1? 0: bp_dpb_output_tid_offset[i]) where the value of bp_dpb_output_tid_offset[i] is found in the associated bp sei message. pt_dpb_output_delay is used to compute the dpb output time of the au. it specifies how many clock ticks to wait after removal of an au from the cpb before the decoded pictures of the au are output from the dpb.note—a decoded picture is not removed from the dpb at its output time when it is still marked as “used for short-term reference” or “used for long-term reference”. the length of pt_dpb_output_delay is bp_dpb_output_delay_length_minus1+1 bits. when dpb_max_dec_pic_buffering_minus1[htid] is equal to 0, the value of pt_dpb_output_delay shall be equal to 0. the output time derived from the pt_dpb_output_delay of any picture that is output from an output timing conforming decoder shall precede the output time derived from the pt_dpb_output_delay of all pictures in any subsequent cvs in decoding order. the picture output order established by the values of this syntax element shall be the same order as established by the values of picordercntval. for pictures that are not output by the “bumping” process because they precede, in decoding order, a cvss au that has sh_no_output_of_prior_pics_flag equal to 1 or inferred to be equal to 1, the output times derived from pt_dpb_output_delay shall be increasing with increasing value of picordercntval relative to all pictures within the same cvs. pt_cpb_alt_timing_info_present_flag equal to 1 specifies that the syntax elements pt_nal_cpb_alt_initial_removal_delay_delta[i][j], pt_nal_cpb_alt_initial_removal_offset_delta[i][j], pt_nal_cpb_delay_offset[i], pt_nal_dpb_delay_offset[i], pt_vcl_cpb_alt_initial_removal_delay_delta[i][j], pt_vcl_cpb_alt_initial_removal_offset_delta[i][j], pt_vcl_cpb_delay_offset[i], and pt_vcl_dpb_delay_offset[i] could be present in the pt sei message. pt_cpb_alt_timing_info_present_flag equal to 0 specifies that these syntax elements are not present in the pt sei message. when all pictures in the associated au are rasl pictures with pps_mixed_nalu_types_in_pic_flag equal to 0, the value of pt_cpb_alt_timing_info_present_flag shall be equal to 0.note—the value of pt_cpb_alt_timing_info_present_flag could be equal to 1 for more than one au following an irap au in decoding order. however, the alternative timing is only applied to the first au that has pt_cpb_alt_timing_info_present_flag equal to 1 and follows the irap au in decoding order. pt_nal_cpb_alt_initial_removal_delay_delta[i][j] specifies the alternative initial cpb removal delay delta for the i-th sublayer for the j-th cpb for the nal hrd in units of a 90 khz clock. the length of pt_nal_cpb_alt_initial_removal_delay_delta[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. when pt_cpb_alt_timing_info_present_flag is equal to 1 and pt_nal_cpb_alt_initial_removal_delay_delta[i][j] is not present for any value of i less than bp_max_sublayers_minus1, its value is inferred to be equal to 0. pt_nal_cpb_alt_initial_removal_offset_delta[i][j] specifies the alternative initial cpb removal offset delta for the i-th sublayer for the j-th cpb for the nal hrd in units of a 90 khz clock. the length of pt_nal_cpb_alt_initial_removal_offset_delta[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. when pt_cpb_alt_timing_info_present_flag is equal to 1 and pt_nal_cpb_alt_initial_removal_offset_delta[i][j] is not present for any value of i less than bp_max_sublayers_minus1, its value is inferred to be equal to 0. pt_nal_cpb_delay_offset[i] specifies, for the i-th sublayer for the nal hrd, an offset to be used in the derivation of the nominal cpb removal times of the au associated with the pt sei message and of the aus following in decoding order, when the au associated with the pt sei message directly follows in decoding order the au associated with the bp sei message. the length of pt_nal_cpb_delay_offset[i] is bp_cpb_removal_delay_length_minus1+1 bits. when not present, the value of pt_nal_cpb_delay_offset[i] is inferred to be equal to 0. pt_nal_dpb_delay_offset[i] specifies, for the i-th sublayer for the nal hrd, an offset to be used in the derivation of the dpb output times of the irap au associated with the bp sei message when the au associated with the pt set message directly follows in decoding order the irap au associated with the bp sei message. the length of pt_nal_dpb_delay_offset[i] is bp_dpb_output_delay_length_minus1+1 bits. when not present, the value of pt_nal_dpb_delay_offset[i] is inferred to be equal to 0. pt_vcl_cpb_alt_initial_removal_delay_delta[i][j] specifies the alternative initial cpb removal delay delta for the i-th sublayer for the j-th cpb for the vcl hrd in units of a 90 khz clock. the length of pt_vcl_cpb_alt_initial_removal_delay_delta[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. when pt_cpb_alt_timing_info_present_flag is equal to 1 and pt_vcl_cpb_alt_initial_removal_delay_delta[i][j] is not present for any value of i less than bp_max_sublayers_minus1, its value is inferred to be equal to 0. pt_vcl_cpb_alt_initial_removal_offset_delta[i][j] specifies the alternative initial cpb removal offset delta for the i-th sublayer for the j-th cpb for the vcl hrd in units of a 90 khz clock. the length of pt_vcl_cpb_alt_initial_removal_offset_delta[i][j] is bp_cpb_initial_removal_delay_length_minus1+1 bits. when pt_cpb_alt_timing_info_present_flag is equal to 1 and pt_vcl_cpb_alt_initial_removal_offset_delta[i][j] is not present for any value of i less than bp_max_sublayers_minus1, its value is inferred to be equal to 0. pt_vcl_cpb_delay_offset[i] specifies, for the i-th sublayer for the vcl hrd, an offset to be used in the derivation of the nominal cpb removal times of the au associated with the pt sei message and of the aus following in decoding order, when the au associated with the pt sei message directly follows in decoding order the au associated with the bp sei message. the length of pt_vcl_cpb_delay_offset[i] is bp_cpb_removal_delay_length_minus1+1 bits. when not present, the value of pt_vcl_cpb_delay_offset[i] is inferred to be equal to 0. pt_vcl_dpb_delay_offset[i] specifies, for the i-th sublayer for the vcl hrd, an offset to be used in the derivation of the dpb output times of the irap au associated with the bp sei message when the au associated with the pt sei message directly follows in decoding order the irap au associated with the bp sei message. the length of pt_vcl_dpb_delay_offset[i] is bp_dpb_output_delay_length_minus1+1 bits. when not present, the value of pt_vcl_dpb_delay_offset[i] is inferred to be equal to 0. the variable bpresetflag of the current au is derived as follows: if the current au is associated with a bp sei message, bpresetflag is set equal to 1.otherwise, bpresetflag is set equal to 0. pt_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. the length of the syntax element pt_dpb_output_du_delay is given in bits by bp_dpb_output_delay_du_length_minus1+1. the output time derived from the pt_dpb_output_du_delay of any picture that is output from an output timing conforming decoder shall precede the output time derived from the pt_dpb_output_du_delay of all pictures in any subsequent cvs in decoding order. the picture output order established by the values of this syntax element shall be the same order as established by the values of picordercntval. for pictures that are not output by the “bumping” process because they precede, in decoding order, a clvss picture that has sh_no_output_of_prior_pics_flag equal to 1 or inferred to be equal to 1, the output times derived from pt_dpb_output_du_delay shall be increasing with increasing value of picordercntval relative to all pictures within the same cvs. for any two pictures in the cvs, the difference between the output times of the two pictures when decodingunithrdflag is equal to 1 shall be identical to the same difference when decodingunithrdflag is equal to 0. pt_num_decoding_units_minus1 plus 1 specifies the number of dus in the au the pt sei message is associated with. the value of pt_num_decoding_units_minus1 shall be in the range of 0 to picsizeinctbsy−1, inclusive. pt_du_common_cpb_removal_delay_flag equal to 1 specifies that the syntax elements pt_du_common_cpb_removal_delay_increment_minus1[i] are present. pt_du_common_cpb_removal_delay_flag equal to 0 specifies that the syntax elements pt_du_common_cpb_removal_delay_increment_minus1[i] are not present. when not present pt_du_common_cpb_removal_delay_flag is inferred to be equal to 0. pt_du_common_cpb_removal_delay_increment_minus1[i] plus 1 specifies the duration, in units of clock sub-ticks, between the nominal cpb removal times of any two consecutive dus in decoding order in the au associated with the pt sei message when htid is equal to i. this value is also used to calculate an earliest possible time of arrival of du data into the cpb for the hss, as specified in annex c. the length of this syntax element is bp_du_cpb_removal_delay_increment_length_minus1+1 bits. when pt_du_common_cpb_removal_delay_increment_minus1[i] is not present for any value of i less than bp_max_sublayers_minus1, its value is inferred to be equal to pt_du_common_cpb_removal_delay_increment_minus1[bp_max_sublayers_minus1]. pt_num_nalus_in_du_minus1[i] plus 1 specifies the number of nal units in the i-th du of the au the pt sei message is associated with. the value of pt_num_nalus_in_du_minus1[i] shall be in the range of 0 to picsizeinctbsy−1, inclusive. the first du of the au consists of the first pt_num_nalus_in_du_minus1[0]+1 consecutive nal units in decoding order in the au. the i-th (with i greater than 0) du of the au consists of the pt_num_nalus_in_du_minus1[i]+1 consecutive nal units immediately following the last nal unit in the previous du of the au, in decoding order. there shall be at least one vcl nal unit in each du. all non-vcl nal units associated with a vcl nal unit shall be included in the same du as the vcl nal unit. pt_du_cpb_removal_delay_increment_minus1[i][j] plus 1 specifies the duration, in units of clock sub-ticks, between the nominal cpb removal times of the (i+1)-th du and the i-th du, in decoding order, in the au associated with the pt sei message when htid is equal to j. this value is also used to calculate an earliest possible time of arrival of du data into the cpb for the hss, as specified in annex c. the length of this syntax element is bp_du_cpb_removal_delay_increment_length_minus1+1 bits. when pt_du_cpb_removal_delay_increment_minus1[i][j] is not present for any value of j less than bp_max_sublayers_minus1, its value is inferred to be equal to pt_du_cpb_removal_delay_increment_minus1[i][bp_max_sublayers_minus1]. pt_delay_for_concatenation_ensured_flag equal to 1 specifies that the difference between the final arrival time and the cpb removal time of the au associated with the pt sei message is such that when followed by an au with a bp sei message with bp_concatenation_flag equal to 1 and initcpbremovaldelay[scidx] less than or equal to the value of bp_max_initial_removal_delay_for_concatenation, the nominal removal time of the following au from the cpb computed with bp_cpb_removal_delay_delta_minus1 applies. pt_delay_for_concatenation_ensured_flag equal to 0 specifies that the difference between the final arrival time and the cpb removal time of the au associated with the pt sei message might or might not exceed the value of max_val_initial_removal_delay_for_splicing. pt_display_elemental_periods_minus1 plus 1, when sps_field_seq_flag is equal to 0 and fixed_pic_rate_within_cvs_flag[htid] is equal to 1, indicates the number of elemental picture period intervals that the decoded pictures of the current au occupy for the display model. when fixed_pic_rate_within_cvs_flag[htid] is present and equal to 1 and both general_nal_hrd_params_present_flag and general_vcl_hrd_params_present_flag are equal to 0, the value of pt_display_elemental_periods_minus1, if provided by external means, shall be equal to 0. when sps_field_seq_flag is equal to 1, the value of pt_display_elemental_periods_minus1 shall be equal to 0. when sps_field_seq_flag is equal to 0 and fixed_pic_rate_within_cvs_flag[htid] is equal to 1, a value of pt_display_elemental_periods_minus1 greater than 0 could be used to indicate a frame repetition period for displays that use a fixed frame refresh interval equal to dpboutputelementalinterval[n] as given by the following equation dpboutputelementalinterval[ n ]=dpboutputinterval[ n ]÷(pt_display_elemental_periods_minus1+1) where dpboutputinterval[n] is specified in the equation below. it should be noted that with respect to the semantics provided above, jvet-t2001 provides the following definitions: access unit (au): a set of pus that belong to different layers and contain coded pictures associated with the same time for output from the dpb. coded picture buffer (cpb): a first-in first-out buffer containing dus in decoding order specified in the hypothetical reference decoder. decoded picture buffer (dpb): a buffer holding decoded pictures for reference, output reordering, or output delay specified for the hypothetical reference decoder. decoding unit (du): an au if decodingunithrdflag is equal to 0 or a subset of an au otherwise, consisting of one or more vcl nal units in an au and the associated non-vcl nal units. hypothetical reference decoder (hrd): a hypothetical decoder model that specifies constraints on the variability of conforming nal unit streams or conforming byte streams that an encoding process may produce. picture unit (pu): a set of nal units that are associated with each other according to a specified classification rule, are consecutive in decoding order, and contain exactly one coded picture. further, it should be noted that jvet-t2001 provides the following with respect to picture output for a picture buffer: the processes specified in this clause happen instantaneously at the cpb removal time of au n, aucpbremovaltime[n]. when picture n has pictureoutputflag equal to 1, its dpb output time dpboutputtime[n] is derived as follows, where the variable firstpicinbufferingperiodflag is equal to 1 if au n is the first au of a bp and 0 otherwise: if( !decodingunithrdflag ) {dpboutputtime[ n ] = aucpbremovaltime[ n ] + clocktick * (pt_dpb_output_delay −audpboutputdelta[ htid ] )if( firstpicinbufferingperiodflag )dpboutputtime[ n ] −= clocktick * dpbdelayoffset} elsedpboutputtime[ n ] = aucpbremovaltime[ n ] + clocksubtick dpboutputdudelay where audpboutputdelta[htid] is derived according to pt_cpb_removal_delay_minus1[htid] and pt_cpb_removal_delay_delta_idx[htid] in the pt sei message associated with au n and bp_cpb_removal_delay_delta_val[pt_cpb_removal_delay_delta_idx[htid] ] and bp_dpb_output_tid_offset[htid] in the bp sei message associated with au n, and dpboutputdudelay is the value of dui_dpb_output_du_delay in the dui sei messages associated with au n when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, or the value of pt_dpb_output_du_delay in the pt sei message associated with au n when bp_du_dpb_params_in_pic_timing_sei_flag is equal top 1. note—when the syntax element dui_dpb_output_du_delay is not present in any dui sei message associated with au n, the value is inferred to be equal to pt_dpb_output_du_delay in the pt sei message associated with au n. the output of the current picture is specified as follows:if pictureoutputflag is equal to 1 and dpboutputtime[n] is equal to aucpbremovaltime[n], the current picture is output.otherwise, if pictureoutputflag is equal to 0, the current picture is not output, but will be stored in the dpb as specified.otherwise (pictureoutputflag is equal to 1 and dpboutputtime[n] is greater than aucpbremovaltime[n]), the current picture is output later and will be stored in the dpb (as specified) and is output at time dpboutputtime[n] unless indicated not to be output by nooutputofpriorpicsflag equal to 1. when output, the picture is cropped, using the conformance cropping window for the picture. when picture n is a picture that is output and is not the last picture of the bitstream that is output, the value of the variable dpboutputinterval[n] is derived as follows: dpboutputinterval[ n ]=dpboutputtime[nextpicinoutputorder]−dpboutputtime[ n ] where nextpicinoutputorder is the picture that follows picture n in output order and has pictureoutputflag equal to 1. the signaling of buffer information in jvet-t2001 may be less than ideal. in particular, there are several cases where inference rules for syntax elements are undefined. fig. 1 is a block diagram illustrating an example of a system that may be configured to code (i.e., encode and/or decode) video data according to one or more techniques of this disclosure. system 100 represents an example of a system that may encapsulate video data according to one or more techniques of this disclosure. as illustrated in fig. 1 , system 100 includes source device 102 , communications medium 110 , and destination device 120 . in the example illustrated in fig. 1 , source device 102 may include any device configured to encode video data and transmit encoded video data to communications medium 110 . destination device 120 may include any device configured to receive encoded video data via communications medium 110 and to decode encoded video data. source device 102 and/or destination device 120 may include computing devices equipped for wired and/or wireless communications and may include, for example, set top boxes, digital video recorders, televisions, desktop, laptop or tablet computers, gaming consoles, medical imagining devices, and mobile devices, including, for example, smartphones, cellular telephones, personal gaming devices. communications medium 110 may include any combination of wireless and wired communication media, and/or storage devices. communications medium 110 may include coaxial cables, fiber optic cables, twisted pair cables, wireless transmitters and receivers, routers, switches, repeaters, base stations, or any other equipment that may be useful to facilitate communications between various devices and sites. communications medium 110 may include one or more networks. for example, communications medium 110 may include a network configured to enable access to the world wide web, for example, the internet. a network may operate according to a combination of one or more telecommunication protocols. telecommunications protocols may include proprietary aspects and/or may include standardized telecommunication protocols. examples of standardized telecommunications protocols include digital video broadcasting (dvb) standards, advanced television systems committee (atsc) standards, integrated services digital broadcasting (isdb) standards, data over cable service interface specification (docsis) standards, global system mobile communications (gsm) standards, code division multiple access (cdma) standards, 3rd generation partnership project (3gpp) standards, european telecommunications standards institute (etsi) standards, internet protocol (ip) standards, wireless application protocol (wap) standards, and institute of electrical and electronics engineers (ieee) standards. storage devices may include any type of device or storage medium capable of storing data. a storage medium may include a tangible or non-transitory computer-readable media. a computer readable medium may include optical discs, flash memory, magnetic memory, or any other suitable digital storage media. in some examples, a memory device or portions thereof may be described as non-volatile memory and in other examples portions of memory devices may be described as volatile memory. examples of volatile memories may include random access memories (ram), dynamic random access memories (dram), and static random access memories (sram). examples of non-volatile memories may include magnetic hard discs, optical discs, floppy discs, flash memories, or forms of electrically programmable memories (eprom) or electrically erasable and programmable (eeprom) memories. storage device(s) may include memory cards (e.g., a secure digital (sd) memory card), internal/external hard disk drives, and/or internal/external solid state drives. data may be stored on a storage device according to a defined file format. fig. 4 is a conceptual drawing illustrating an example of components that may be included in an implementation of system 100 . in the example implementation illustrated in fig. 4 , system 100 includes one or more computing devices 402 a- 402 n, television service network 404 , television service provider site 406 , wide area network 408 , local area network 410 , and one or more content provider sites 412 a- 412 n. the implementation illustrated in fig. 4 represents an example of a system that may be configured to allow digital media content, such as, for example, a movie, a live sporting event, etc., and data and applications and media presentations associated therewith to be distributed to and accessed by a plurality of computing devices, such as computing devices 402 a- 402 n. in the example illustrated in fig. 4 , computing devices 402 a- 402 n may include any device configured to receive data from one or more of television service network 404 , wide area network 408 , and/or local area network 410 . for example, computing devices 402 a- 402 n may be equipped for wired and/or wireless communications and may be configured to receive services through one or more data channels and may include televisions, including so-called smart televisions, set top boxes, and digital video recorders. further, computing devices 402 a- 402 n may include desktop, laptop, or tablet computers, gaming consoles, mobile devices, including, for example, “smart” phones, cellular telephones, and personal gaming devices. television service network 404 is an example of a network configured to enable digital media content, which may include television services, to be distributed. for example, television service network 404 may include public over-the-air television networks, public or subscription-based satellite television service provider networks, and public or subscription-based cable television provider networks and/or over the top or internet service providers. it should be noted that although in some examples television service network 404 may primarily be used to enable television services to be provided, television service network 404 may also enable other types of data and services to be provided according to any combination of the telecommunication protocols described herein. further, it should be noted that in some examples, television service network 404 may enable two-way communications between television service provider site 406 and one or more of computing devices 402 a- 402 n. television service network 404 may comprise any combination of wireless and/or wired communication media. television service network 404 may include coaxial cables, fiber optic cables, twisted pair cables, wireless transmitters and receivers, routers, switches, repeaters, base stations, or any other equipment that may be useful to facilitate communications between various devices and sites. television service network 404 may operate according to a combination of one or more telecommunication protocols. telecommunications protocols may include proprietary aspects and/or may include standardized telecommunication protocols. examples of standardized telecommunications protocols include dvb standards, atsc standards, isdb standards, dtmb standards, dmb standards, data over cable service interface specification (docsis) standards, hbbtv standards, w3c standards, and upnp standards. referring again to fig. 4 , television service provider site 406 may be configured to distribute television service via television service network 404 . for example, television service provider site 406 may include one or more broadcast stations, a cable television provider, or a satellite television provider, or an internet-based television provider. for example, television service provider site 406 may be configured to receive a transmission including television programming through a satellite uplink/downlink. further, as illustrated in fig. 4 , television service provider site 406 may be in communication with wide area network 408 and may be configured to receive data from content provider sites 412 a- 412 n. it should be noted that in some examples, television service provider site 406 may include a television studio and content may originate therefrom. wide area network 408 may include a packet based network and operate according to a combination of one or more telecommunication protocols. telecommunications protocols may include proprietary aspects and/or may include standardized telecommunication protocols. examples of standardized telecommunications protocols include global system mobile communications (gsm) standards, code division multiple access (cdma) standards, 3 rd generation partnership project (3gpp) standards, european telecommunications standards institute (etsi) standards, european standards (en), ip standards, wireless application protocol (wap) standards, and institute of electrical and electronics engineers (ieee) standards, such as, for example, one or more of the ieee 802 standards (e.g., wi-fi). wide area network 408 may comprise any combination of wireless and/or wired communication media. wide area network 408 may include coaxial cables, fiber optic cables, twisted pair cables, ethernet cables, wireless transmitters and receivers, routers, switches, repeaters, base stations, or any other equipment that may be useful to facilitate communications between various devices and sites. in one example, wide area network 408 may include the internet. local area network 410 may include a packet based network and operate according to a combination of one or more telecommunication protocols. local area network 410 may be distinguished from wide area network 408 based on levels of access and/or physical infrastructure. for example, local area network 410 may include a secure home network. referring again to fig. 4 , content provider sites 412 a- 412 n represent examples of sites that may provide multimedia content to television service provider site 406 and/or computing devices 402 a- 402 n. for example, a content provider site may include a studio having one or more studio content servers configured to provide multimedia files and/or streams to television service provider site 406 . in one example, content provider sites 412 a- 412 n may be configured to provide multimedia content using the ip suite. for example, a content provider site may be configured to provide multimedia content to a receiver device according to real time streaming protocol (rtsp), http, or the like. further, content provider sites 412 a- 412 n may be configured to provide data, including hypertext based content, and the like, to one or more of receiver devices computing devices 402 a- 402 n and/or television service provider site 406 through wide area network 408 . content provider sites 412 a- 412 n may include one or more web servers. data provided by data provider site 412 a- 412 n may be defined according to data formats. referring again to fig. 1 , source device 102 includes video source 104 , video encoder 106 , data encapsulator 107 , and interface 108 . video source 104 may include any device configured to capture and/or store video data. for example, video source 104 may include a video camera and a storage device operably coupled thereto. video encoder 106 may include any device configured to receive video data and generate a compliant bitstream representing the video data. a compliant bitstream may refer to a bitstream that a video decoder can receive and reproduce video data therefrom. aspects of a compliant bitstream may be defined according to a video coding standard. when generating a compliant bitstream video encoder 106 may compress video data. compression may be lossy (discernible or indiscernible to a viewer) or lossless. fig. 5 is a block diagram illustrating an example of video encoder 500 that may implement the techniques for encoding video data described herein. it should be noted that although example video encoder 500 is illustrated as having distinct functional blocks, such an illustration is for descriptive purposes and does not limit video encoder 500 and/or sub-components thereof to a particular hardware or software architecture. functions of video encoder 500 may be realized using any combination of hardware, firmware, and/or software implementations. video encoder 500 may perform intra prediction coding and inter prediction coding of picture areas, and, as such, may be referred to as a hybrid video encoder. in the example illustrated in fig. 5 , video encoder 500 receives source video blocks. in some examples, source video blocks may include areas of picture that has been divided according to a coding structure. for example, source video data may include macroblocks, ctus, cbs, sub-divisions thereof, and/or another equivalent coding unit. in some examples, video encoder 500 may be configured to perform additional sub-divisions of source video blocks. it should be noted that the techniques described herein are generally applicable to video coding, regardless of how source video data is partitioned prior to and/or during encoding. in the example illustrated in fig. 5 , video encoder 500 includes summer 502 , transform coefficient generator 504 , coefficient quantization unit 506 , inverse quantization and transform coefficient processing unit 508 , summer 510 , intra prediction processing unit 512 , inter prediction processing unit 514 , filter unit 516 , and entropy encoding unit 518 . as illustrated in fig. 5 , video encoder 500 receives source video blocks and outputs a bitstream. in the example illustrated in fig. 5 , video encoder 500 may generate residual data by subtracting a predictive video block from a source video block. the selection of a predictive video block is described in detail below. summer 502 represents a component configured to perform this subtraction operation. in one example, the subtraction of video blocks occurs in the pixel domain. transform coefficient generator 504 applies a transform, such as a discrete cosine transform (dct), a discrete sine transform (dst), or a conceptually similar transform, to the residual block or sub-divisions thereof (e.g., four 8×8 transforms may be applied to a 16×16 array of residual values) to produce a set of residual transform coefficients. transform coefficient generator 504 may be configured to perform any and all combinations of the transforms included in the family of discrete trigonometric transforms, including approximations thereof. transform coefficient generator 504 may output transform coefficients to coefficient quantization unit 506 . coefficient quantization unit 506 may be configured to perform quantization of the transform coefficients. the quantization process may reduce the bit depth associated with some or all of the coefficients. the degree of quantization may alter the rate-distortion (i.e., bit-rate vs. quality of video) of encoded video data. the degree of quantization may be modified by adjusting a quantization parameter (qp). a quantization parameter may be determined based on slice level values and/or cu level values (e.g., cu delta qp values). qp data may include any data used to determine a qp for quantizing a particular set of transform coefficients. as illustrated in fig. 5 , quantized transform coefficients (which may be referred to as level values) are output to inverse quantization and transform coefficient processing unit 508 . inverse quantization and transform coefficient processing unit 508 may be configured to apply an inverse quantization and an inverse transformation to generate reconstructed residual data. as illustrated in fig. 5 , at summer 510 , reconstructed residual data may be added to a predictive video block. in this manner, an encoded video block may be reconstructed and the resulting reconstructed video block may be used to evaluate the encoding quality for a given prediction, transformation, and/or quantization. video encoder 500 may be configured to perform multiple coding passes (e.g., perform encoding while varying one or more of a prediction, transformation parameters, and quantization parameters). the rate-distortion of a bitstream or other system parameters may be optimized based on evaluation of reconstructed video blocks. further, reconstructed video blocks may be stored and used as reference for predicting subsequent blocks. referring again to fig. 5 , intra prediction processing unit 512 may be configured to select an intra prediction mode for a video block to be coded. intra prediction processing unit 512 may be configured to evaluate a frame and determine an intra prediction mode to use to encode a current block. as described above, possible intra prediction modes may include planar prediction modes, dc prediction modes, and angular prediction modes. further, it should be noted that in some examples, a prediction mode for a chroma component may be inferred from a prediction mode for a luma prediction mode. intra prediction processing unit 512 may select an intra prediction mode after performing one or more coding passes. further, in one example, intra prediction processing unit 512 may select a prediction mode based on a rate-distortion analysis. as illustrated in fig. 5 , intra prediction processing unit 512 outputs intra prediction data (e.g., syntax elements) to entropy encoding unit 518 and transform coefficient generator 504 . as described above, a transform performed on residual data may be mode dependent (e.g., a secondary transform matrix may be determined based on a prediction mode). referring again to fig. 5 , inter prediction processing unit 514 may be configured to perform inter prediction coding for a current video block. inter prediction processing unit 514 may be configured to receive source video blocks and calculate a motion vector for pus of a video block. a motion vector may indicate the displacement of a prediction unit of a video block within a current video frame relative to a predictive block within a reference frame. inter prediction coding may use one or more reference pictures. further, motion prediction may be uni-predictive (use one motion vector) or bi-predictive (use two motion vectors). inter prediction processing unit 514 may be configured to select a predictive block by calculating a pixel difference determined by, for example, sum of absolute difference (sad), sum of square difference (ssd), or other difference metrics. as described above, a motion vector may be determined and specified according to motion vector prediction. inter prediction processing unit 514 may be configured to perform motion vector prediction, as described above. inter prediction processing unit 514 may be configured to generate a predictive block using the motion prediction data. for example, inter prediction processing unit 514 may locate a predictive video block within a frame buffer (not shown in fig. 5 ). it should be noted that inter prediction processing unit 514 may further be configured to apply one or more interpolation filters to a reconstructed residual block to calculate sub-integer pixel values for use in motion estimation. inter prediction processing unit 514 may output motion prediction data for a calculated motion vector to entropy encoding unit 518 . referring again to fig. 5 , filter unit 516 receives reconstructed video blocks and coding parameters and outputs modified reconstructed video data. filter unit 516 may be configured to perform deblocking and/or sample adaptive offset (sao) filtering. sao filtering is a non-linear amplitude mapping that may be used to improve reconstruction by adding an offset to reconstructed video data. it should be noted that as illustrated in fig. 5 , intra prediction processing unit 512 and inter prediction processing unit 514 may receive modified reconstructed video block via filter unit 216 . entropy encoding unit 518 receives quantized transform coefficients and predictive syntax data (i.e., intra prediction data and motion prediction data). it should be noted that in some examples, coefficient quantization unit 506 may perform a scan of a matrix including quantized transform coefficients before the coefficients are output to entropy encoding unit 518 . in other examples, entropy encoding unit 518 may perform a scan. entropy encoding unit 518 may be configured to perform entropy encoding according to one or more of the techniques described herein. in this manner, video encoder 500 represents an example of a device configured to generate encoded video data according to one or more techniques of this disclosure. referring again to fig. 1 , data encapsulator 107 may receive encoded video data and generate a compliant bitstream, e.g., a sequence of nal units according to a defined data structure. a device receiving a compliant bitstream can reproduce video data therefrom. further, as described above, sub-bitstream extraction may refer to a process where a device receiving a compliant bitstream forms a new compliant bitstream by discarding and/or modifying data in the received bitstream. it should be noted that the term conforming bitstream may be used in place of the term compliant bitstream. in one example, data encapsulator 107 may be configured to generate syntax according to one or more techniques described herein. it should be noted that data encapsulator 107 need not necessary be located in the same physical device as video encoder 106 . for example, functions described as being performed by video encoder 106 and data encapsulator 107 may be distributed among devices illustrated in fig. 4 . as described above, the buffering information signaling in jvet-t2001 may be less than ideal. as provided above, for syntax element dui_dpb_output_du_delay, jvet-t2001 provides the following inference rule: when not present, the value of dui_dpb_output_du_delay is inferred to be equal to pt_dpb_output_du_delay. one condition under which dui_dpb_output_du_delay is not present is when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0 and dui_dpb_output_du_delay_present_flag is equal to 0. however, in this case, since bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, pt_dpb_output_du_delay is not present and it does not have an inference rule when not present. thus, in this case pt_dpb_output_du_delay does not have a defined value and inferring dui_dpb_output_du_delay to be equal to pt_dpb_output_du_delay means dui_dpb_output_du_delay has undefined value. further, it should be noted that in jvet-t2001, there is no constraint which disallows setting bp_du_dpb_params_in_pic_timing_sei_flag equal to 0 and dui_dpb_output_du_delay equal to 0 in dui sei for each du of an au. it is asserted that an efficient design for the decoding unit information sei message should allow that when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, the syntax element dui_dpb_output_du_delay may be signaled in one or more du information sei messages for one or more dus of an au. this provides bit savings by not requiring signaling dui_dpb_output_du_delay in each decoding unit information sei message. for example, the dui_dpb_output_du_delay may only be signaled in the last du of the au and thus the value of dui_dpb_output_du_delay_present_flag is set to 1 for the last dui sei and is set to 0 for the other dui seis for the au. it is asserted that in jvet-t2001, the value of dui_dpb_output_du_delay is used to set the value of dpboutputdudelay when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0 and is used for the operation of hrd. thus, dui_dpb_output_du_delay needs to have a defined value. thus, in one example, according to the techniques herein the semantics of syntax elements dui_dpb_output_du_delay and dui_dpb_output_du_delay_present_flag may be based on the following: dui_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1 and bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. when not present and when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, the value of dui_dpb_output_du_delay is inferred to be equal to dui_dpb_output_du_delay from any du belonging to the same au for which dui_dpb_output_du_delay_present_flag is equal to 1. the length of the syntax element dui_dpb_output_du_delay is given in bits by bp_dpb_output_delay_du_length_minus1+1. dui_dpb_output_du_delay_present_flag equal to 1 specifies the presence of the dui_dpb_output_du_delay syntax element in the dui sei message. dui_dpb_output_du_delay_present_flag equal to 0 specifies the absence of the dui_dpb_output_du_delay syntax element in the dui sei message. when not present, the value of dui_dpb_output_du_delay_present_flag is inferred to be equal to 0. when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, at least one dui sei message associated with the dus of an au shall have dui_dpb_output_du_delay_present_flag equal to 1. or in other words: when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, at least one dui sei message associated with the dus of an au shall have the syntax element dui_dpb_output_du_delay signalled. or in other words: when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, at least one dui sei message associated with the dus of an au shall have the syntax element dui_dpb_output_du_delay present. further, in this example, the note “when the syntax element dui_dpb_output_du_delay is not present in any dui sei message associated with au n, the value is inferred to be equal to pt_dpb_output_du_delay in the pt sei message associated with au n” is removed from the picture output process specified in jvet-t2001. it should be noted that, according to the techniques herein, the inferences rule for syntax element dui_dpb_output_du_delay provided above may be specified as follows: dui_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1 and bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0 and dui_dpb_output_du_delay_present_flag is equal to 0, the value of dui_dpb_output_du_delay is inferred to be equal to dui_dpb_output_du_delay from any du belonging to the same au for which dui_dpb_output_du_delay_present_flag is equal to 1. the length of the syntax element dui_dpb_output_du_delay is given in bits by bp_dpb_output_delay_du_length_minus1+1. or as: dui_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1 and bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. when not present, the value of dui_dpb_output_du_delay is inferred as follows: if bp_du_dpb_params_in_pic_timing_sei_flag equal to 0 and dui_dpb_output_du_delay_present_flag is equal to 0, dui_dpb_output_du_delay is inferred to be equal to dui_dpb_output_du_delay from any du belonging to the same au for which bp_du_dpb_params_in_pic_timing_sei_flag equal to 0 and dui_dpb_output_du_delay_present_flag is equal to 1. otherwise dui_dpb_output_du_delay is inferred to be equal to pt_dpb_output_du_delay. or as: dui_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1 and bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. when not present, the value of dui_dpb_output_du_delay is inferred to be equal to dui_dpb_output_du_delay from any du belonging to the same au for which dui_dpb_output_du_delay_present_flag is equal to 1. or as: dui_dpb_output_du_delay is used to compute the dpb output time of the au when decodingunithrdflag is equal to 1 and bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0. it specifies how many sub clock ticks to wait after removal of the last du in an au from the cpb before the decoded pictures of the au are output from the dpb. when not present, the value of dui_dpb_output_du_delay is inferred to be equal to pt_dpb_output_du_delay when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 1. in another example, it may be required that dui_dpb_output_du_delay is signalled in each dui sei message when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, which may be specified in semantics as: if bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0, dui_dpb_output_du_delay_present_flag shall be equal to 1. further, the following additional condition may be added as a bitstream conformance requirement: it is a requirement of bitstream conformance that all dui sei messages that are associated with the same au, apply to the same operation point, and have bp_du_dpb_params_in_pic_timing_sei_flag equal to 0 and dui_dpb_output_du_delay_present_flag equal to 1 shall have the same value of dui_dpb_output_du_delay. further, in one example, according to the techniques herein, a picture output process may be based on the following: the processes specified in this clause happen instantaneously at the cpb removal time of au n, aucpbremovaltime[n]. when picture n has pictureoutputflag equal to 1, its dpb output time dpboutputtime[n] is derived as follows, where the variable firstpicinbufferingperiodflag is equal to 1 if au n is the first au of a bp and 0 otherwise: if (!decodingunithrdflag) { dpboutputtime[n]=aucpbremovaltime[n]+clocktick(pt_dpb_output_delay−audpboutputdelta[htid])if (firstpicinbufferingperiodflag) dpboutputtime[n]-=clocktickdpbdelayoffset} else dpboutputtime[n]=aucpbremovaltime[n]+clocksubtickdpboutputdudelay where audpboutputdelta[htid] is derived according to pt_cpb_removal_delay_minus1[htid] and pt_cpb_removal_delay_delta_idx[htid] in the pt sei message associated with au n and bp_cpb_removal_delay_delta_val[pt_cpb_removal_delay_delta_idx[htid] ] and bp_dpb_output_tid_offset[htid] in the bp sei message associated with au n, and dpboutputdudelay is the value of dui_dpb_output_du_delay in the dui sei message associated with au n when bp_du_dpb_params_in_pic_timing_sei_flag is equal to 0 and dui_dpb_output_du_delay_present_flag is equal to 1, or the value of pt_dpb_output_du_delay in the pt sei message associated with au n when bp_du_dpb_params_in_pic_timing_sei_flag is equal top 1. the output of the current picture is specified as follows:if pictureoutputflag is equal to 1 and dpboutputtime[n] is equal to aucpbremovaltime[n], the current picture is output.otherwise, if pictureoutputflag is equal to 0, the current picture is not output, but will be stored in the dpb as specified.otherwise (pictureoutputflag is equal to 1 and dpboutputtime[n] is greater than aucpbremovaltime[n]), the current picture is output later and will be stored in the dpb (as specified) and is output at time dpboutputtime[n] unless indicated not to be output by nooutputofpriorpicsflag equal to 1. when output, the picture is cropped, using the conformance cropping window for the picture. when picture n is a picture that is output and is not the last picture of the bitstream that is output, the value of the variable dpboutputinterval[n] is derived as follows: dpboutputinterval[ n ]=dpboutputtime[nextpicinoutputorder]−dpboutputtime[ n ] where nextpicinoutputorder is the picture that follows picture n in output order and has pictureoutputflag equal to 1. further, it should be noted that according to the techniques herein, the term au may be replaced with the term pu in some cases. in this manner, source device 102 represents an example of a device configured to signal decoding unit information messages for decoding units in the same access unit, signal an instance of a syntax element used to compute a decoded picture buffer output time in at least one of the decoding unit information messages, and not signal an instance of the syntax element used to compute a decoded picture buffer output time in at least one of the decoding unit information messages, where when not present, the value of the syntax element is inferred to be equal to a corresponding instance of the syntax element from any decoding unit belonging to the same access unit. referring again to fig. 1 , interface 108 may include any device configured to receive data generated by data encapsulator 107 and transmit and/or store the data to a communications medium. interface 108 may include a network interface card, such as an ethernet card, and may include an optical transceiver, a radio frequency transceiver, or any other type of device that can send and/or receive information. further, interface 108 may include a computer system interface that may enable a file to be stored on a storage device. for example, interface 108 may include a chipset supporting peripheral component interconnect (pci) and peripheral component interconnect express (pcie) bus protocols, proprietary bus protocols, universal serial bus (usb) protocols, i 2 c, or any other logical and physical structure that may be used to interconnect peer devices. referring again to fig. 1 , destination device 120 includes interface 122 , data decapsulator 123 , video decoder 124 , and display 126 . interface 122 may include any device configured to receive data from a communications medium. interface 122 may include a network interface card, such as an ethernet card, and may include an optical transceiver, a radio frequency transceiver, or any other type of device that can receive and/or send information. further, interface 122 may include a computer system interface enabling a compliant video bitstream to be retrieved from a storage device. for example, interface 122 may include a chipset supporting pci and pcie bus protocols, proprietary bus protocols, usb protocols, i 2 c, or any other logical and physical structure that may be used to interconnect peer devices. data decapsulator 123 may be configured to receive and parse any of the example syntax structures described herein. video decoder 124 may include any device configured to receive a bitstream (e.g., a sub-bitstream extraction) and/or acceptable variations thereof and reproduce video data therefrom. display 126 may include any device configured to display video data. display 126 may comprise one of a variety of display devices such as a liquid crystal display (lcd), a plasma display, an organic light emitting diode (oled) display, or another type of display. display 126 may include a high definition display or an ultra high definition display. it should be noted that although in the example illustrated in fig. 1 , video decoder 124 is described as outputting data to display 126 , video decoder 124 may be configured to output video data to various types of devices and/or sub-components thereof. for example, video decoder 124 may be configured to output video data to any communication medium, as described herein. fig. 6 is a block diagram illustrating an example of a video decoder that may be configured to decode video data according to one or more techniques of this disclosure (e.g., the decoding process for reference-picture list construction described above). in one example, video decoder 600 may be configured to decode transform data and reconstruct residual data from transform coefficients based on decoded transform data. video decoder 600 may be configured to perform intra prediction decoding and inter prediction decoding and, as such, may be referred to as a hybrid decoder. video decoder 600 may be configured to parse any combination of the syntax elements described above in tables 1-5. video decoder 600 may decode a picture based on or according to the processes described above, and further based on parsed values in tables 1-5. in the example illustrated in fig. 6 , video decoder 600 includes an entropy decoding unit 602 , inverse quantization unit 604 , transform coefficient processing unit 606 , intra prediction processing unit 608 , inter prediction processing unit 610 , summer 612 , post filter unit 614 , and reference buffer 616 . video decoder 600 may be configured to decode video data in a manner consistent with a video coding system. it should be noted that although example video decoder 600 is illustrated as having distinct functional blocks, such an illustration is for descriptive purposes and does not limit video decoder 600 and/or sub-components thereof to a particular hardware or software architecture. functions of video decoder 600 may be realized using any combination of hardware, firmware, and/or software implementations. as illustrated in fig. 6 , entropy decoding unit 602 receives an entropy encoded bitstream. entropy decoding unit 602 may be configured to decode syntax elements and quantized coefficients from the bitstream according to a process reciprocal to an entropy encoding process. entropy decoding unit 602 may be configured to perform entropy decoding according any of the entropy coding techniques described above. entropy decoding unit 602 may determine values for syntax elements in an encoded bitstream in a manner consistent with a video coding standard. as illustrated in fig. 6 , entropy decoding unit 602 may determine a quantization parameter, quantized coefficient values, transform data, and prediction data from a bitstream. in the example illustrated in fig. 6 , inverse quantization unit 604 and inverse transform coefficient processing unit 606 receive quantized coefficient values from entropy decoding unit 602 and output reconstructed residual data. referring again to fig. 6 , reconstructed residual data may be provided to summer 612 . summer 612 may add reconstructed residual data to a predictive video block and generate reconstructed video data. a predictive video block may be determined according to a predictive video technique (i.e., intra prediction and inter frame prediction). intra prediction processing unit 608 may be configured to receive intra prediction syntax elements and retrieve a predictive video block from reference buffer 616 . reference buffer 616 may include a memory device configured to store one or more frames of video data. intra prediction syntax elements may identify an intra prediction mode, such as the intra prediction modes described above. inter prediction processing unit 610 may receive inter prediction syntax elements and generate motion vectors to identify a prediction block in one or more reference frames stored in reference buffer 616 . inter prediction processing unit 610 may produce motion compensated blocks, possibly performing interpolation based on interpolation filters. identifiers for interpolation filters to be used for motion estimation with sub-pixel precision may be included in the syntax elements. inter prediction processing unit 610 may use interpolation filters to calculate interpolated values for sub-integer pixels of a reference block. post filter unit 614 may be configured to perform filtering on reconstructed video data. for example, post filter unit 614 may be configured to perform deblocking and/or sample adaptive offset (sao) filtering, e.g., based on parameters specified in a bitstream. further, it should be noted that in some examples, post filter unit 614 may be configured to perform proprietary discretionary filtering (e.g., visual enhancements, such as, mosquito noise reduction). as illustrated in fig. 6 , a reconstructed video block may be output by video decoder 600 . in this manner, video decoder 600 represents an example of a device configured to receive a decoding unit information message, determine a syntax element used to compute a decoded picture buffer output time is not present in the decoding unit information message, and infer the value of the syntax element used to compute a decoded picture buffer output time to be equal to a corresponding instance of the syntax element from any decoding unit belonging to the same access unit. in one or more examples, the functions described may be implemented in hardware, software, firmware, or any combination thereof. if implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. computer-readable media may include computer-readable storage media, which corresponds to a tangible medium such as data storage media, or communication media including any medium that facilitates transfer of a computer program from one place to another, e.g., according to a communication protocol. in this manner, computer-readable media generally may correspond to (1) tangible computer-readable storage media which is non-transitory or (2) a communication medium such as a signal or carrier wave. data storage media may be any available media that can be accessed by one or more computers or one or more processors to retrieve instructions, code and/or data structures for implementation of the techniques described in this disclosure. a computer program product may include a computer-readable medium. by way of example, and not limitation, such computer-readable storage media can comprise ram, rom, eeprom, cd-rom or other optical disk storage, magnetic disk storage, or other magnetic storage devices, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and that can be accessed by a computer. also, any connection is properly termed a computer-readable medium. for example, if instructions are transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (dsl), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, dsl, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. it should be understood, however, that computer-readable storage media and data storage media do not include connections, carrier waves, signals, or other transitory media, but are instead directed to non-transitory, tangible storage media. disk and disc, as used herein, includes compact disc (cd), laser disc, optical disc, digital versatile disc (dvd), floppy disk and blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. combinations of the above should also be included within the scope of computer-readable media. instructions may be executed by one or more processors, such as one or more digital signal processors (dsps), general purpose microprocessors, application specific integrated circuits (asics), field programmable logic arrays (fpgas), or other equivalent integrated or discrete logic circuitry. accordingly, the term “processor,” as used herein may refer to any of the foregoing structure or any other structure suitable for implementation of the techniques described herein. in addition, in some aspects, the functionality described herein may be provided within dedicated hardware and/or software modules configured for encoding and decoding, or incorporated in a combined codec. also, the techniques could be fully implemented in one or more circuits or logic elements. the techniques of this disclosure may be implemented in a wide variety of devices or apparatuses, including a wireless handset, an integrated circuit (ic) or a set of ics (e.g., a chip set). various components, modules, or units are described in this disclosure to emphasize functional aspects of devices configured to perform the disclosed techniques, but do not necessarily require realization by different hardware units. rather, as described above, various units may be combined in a codec hardware unit or provided by a collection of interoperative hardware units, including one or more processors as described above, in conjunction with suitable software and/or firmware. moreover, each functional block or various features of the base station device and the terminal device used in each of the aforementioned embodiments may be implemented or executed by a circuitry, which is typically an integrated circuit or a plurality of integrated circuits. the circuitry designed to execute the functions described in the present specification may comprise a general-purpose processor, a digital signal processor (dsp), an application specific or general application integrated circuit (asic), a field programmable gate array (fpga), or other programmable logic devices, discrete gates or transistor logic, or a discrete hardware component, or a combination thereof. the general-purpose processor may be a microprocessor, or alternatively, the processor may be a conventional processor, a controller, a microcontroller or a state machine. the general-purpose processor or each circuit described above may be configured by a digital circuit or may be configured by an analogue circuit. further, when a technology of making into an integrated circuit superseding integrated circuits at the present time appears due to advancement of a semiconductor technology, the integrated circuit by this technology is also able to be used. various examples have been described. these and other examples are within the scope of the following claims.
184-768-145-510-986	US	[ "US" ]	A61B8/12,A61B8/00,A61B8/14	2004-02-26T00:00:00	2004	[ "A61" ]	receive circuit for minimizing channels in ultrasound imaging	receive circuits and associated methods are provided for ultrasound imaging. both subarray mixing and time division multiplexing are provided with a same circuit. components of the receive circuit respond to either phasing or time slot information to implement subarray mixing or time division multiplexing. a network of switches allows combination of signals from different elements to form different sub-apertures. a controller minimizes power consumption while outputting the desired phase or time division multiplexed information by gating a clock to various registers. each of the registers corresponds to different groups of transducer elements. for loading new phasing information, the clock is turned on to the desired register. duration operation of the receive circuit, the clock is gated off. the register outputs the previously loaded values in a static state without clocking. preamplification for either of time division or subarray mixed signals is provided using a variable gain amplifier with a common mode feedback. the common mode feedback provides for a constant operating point despite changes in the desired amount of gain.	1. a receive circuit for ultrasound imaging, the receive circuit comprising: a plurality of paths connected with a respective plurality of transducer elements; and a summer connected with the plurality of paths; wherein at least one of the plurality of paths has a first component operable differently for each of at least two sub-aperture modes for different types of sub-aperture data formats for transmission from the receive circuit, the first component configured to implement the at least two sub-aperture modes by combining signals from the paths onto a fewer number of outputs in a respective at least two different ways, one of the at least two different ways being other than partial beamformation, the at least two different ways resulting in the different types of sub-aperture data formats, a first one of the different types of sub-aperture data formats allowing recovery of the signals from the transmission from the receive circuit. 2. the circuit of claim 1 wherein the first component comprises a plurality of switches, a first combination of switch connections operable for a first of the at least two different sub-aperture modes and a second combination of switch connects operable for a second of the at least two different sub-aperture modes. 3. the circuit of claim 2 wherein the plurality of switches comprises four switches, first and third switches connectable with a first input, second and fourth switches connectable with a second input, the second input being an inverse of the first input, the first and fourth switches connectable with a first output and the second and third switches connectable with a second output. 4. the circuit of claim 3 wherein the first and second switches are controllable in unison and the third and fourth switches are controllable in unison, the first sub-aperture mode corresponding to switching between (i) opening the third and fourth switches while closing the first and second switches and (ii) vice versa, the second sub-aperture mode corresponding to switching between (i) opening the third and fourth switches while closing the first and second switches and (ii) closing the first, second, third and fourth switches. 5. the circuit of claim 1 wherein the path comprises a single ended input amplifier having differential outputs connected with the first component and a differential input amplifier with a single ended output connected with the first component. 6. the circuit of claim 5 wherein the single ended input amplifier comprises a variable gain amplifier with a common mode feedback. 7. the circuit of claim 1 wherein the first component is operable to mix an input signal with a local oscillator signal in a sub-array mixing mode and is operable to output the input signal in a selected time slot in a time division multiplexing mode. 8. the circuit of claim 7 wherein the first component comprises a switch, the switch operable to open and close corresponding to the local oscillator signal in the sub-array mixing mode and the switch operable to open and close corresponding to the selected time slot in the time division multiplexing mode. 9. the circuit of claim 1 further comprising: a controller connected with the plurality of paths, the controller comprising a plurality of registers for different groups of the plurality of paths and comprising a clock enable control operable to enable a clock into each of the plurality of registers for loading or reading out data and disable the clock into each of the plurality of registers when not loading or reading out data. 10. the circuit of claim 1 wherein each of the plurality of paths includes at least one component that is operable differently for each of the at least two different sub-aperture modes; further comprising: at least one additional summer associated with the plurality of paths; and a plurality of switches connected between (i) the paths and (ii) the summer and additional summer, the plurality of switches operable to selectively connect each of the paths to either of the summer and the additional summer. 11. a method for ultrasound sub-aperture processing, the method comprising: providing a first component in a receive channel, the first component operable to both mix and slot a signal in time division multiplexing; (a) selecting between (a1) mixing and (a2) selecting a time slot for the receive channel relative to other receive channels during a reception, the selecting being of (a1) for the reception and being (a2) for a different reception; (b) controlling the first component in the receive channel as a function of the selection of (a); and (c) combining a first signal responsive to (b) with signals from the other receive channels. 12. the method of claim 11 wherein (a) comprises selecting (a1) mixing, wherein (b) comprises modulating an input signal with a switch in the receive channel at a mixing frequency, and wherein (c) comprises summing the modulated input signal with signals from the other receive channels. 13. the method of claim 11 wherein (a) comprises selecting (a2) selecting a time slot, wherein (b) comprises switching the receive channel to output the first signal at the time slot, and wherein (c) comprises outputting the first signal in the time slot and outputting the signals from other receive channels in other time slots. 14. the method of claim 11 wherein (b) comprises controlling two pairs of switches differently for each of (a1) and (a2). 15. a method of controlling sub-aperture operation in an ultrasound transducer, the method comprising: (a) selecting one of at least two different sub-aperture processes for each of a plurality of channels, the selecting being of a first one of the different sub-aperture processes for a first reception and being a second one of the different sub-aperture processes for a second reception different than the first reception; and (b) outputting a signal responsive to the selection of (a) to each of the plurality of channels; wherein the different sub-aperture processes comprise different ways to combine signals from the plurality of channels onto a fewer number of receive beamformer channels. 16. the method of claim 15 wherein (a) comprises selecting between mixing and multiplexing. 17. the method of claim 16 wherein (a) comprises selecting mixing and wherein (b) comprises outputting a local oscillation signal having a first selected phase for a first of the plurality of channels and outputting the local oscillation signal having a second selected phase, different than the first selected phase, to a second of the plurality of channels. 18. the method of claim 16 wherein (a) comprises selecting multiplexing and wherein (b) comprises outputting a respective time slot pulse for each of the plurality of channels in the sub-aperture. 19. the method of claim 15 further comprising: (c) performing (b) with a plurality of control modules, each control module corresponding to a different group of elements; and (d) disabling a clock signal to at least one of the plurality of control modules during operation. 20. the method of claim 15 further comprising: (c) selecting a plurality of sub-apertures corresponding to different groups of elements; and (d) routing signals from the different groups of elements to respective outputs for each sub-aperture.	background the present invention relates to receive circuits and associated methods for minimizing channels in ultrasound imaging systems. in particular, circuits, controllers and methods for combining signals from multiple elements onto a same path are provided. medical diagnostic ultrasound imaging systems have a limited number of receive beamformer channels. the size of coaxial cables connecting transducer elements to the imaging system and associated receive beamformer channels may also limit the number of usable elements of a transducer array. to maximize the number of elements used, signals from a plurality of elements may be multiplexed onto a same cable. u.s. pat. no. 5,573,001, the disclosure of which is incorporated herein by reference, discloses partial beamforming to combine signals from multiple elements for processing by a single receive beamformer channel. signals from different elements are mixed with signals having selected phases, and the mixed signals are then summed together to form a partially beamformed sub-array signal. the subarray signal is responsive to each of the plurality of elements and may be processed with a single receive beamformer channel. subarray mixing across an array allows the use of more elements than receive beamformer channels. subarray mixing or partial beamforming may be desired in some situations and undesired in others. multiplexing may be desired in some situations, but undesired in others. for example, multiplexing may not reduce the number of receive beamformer channels needed as compared to the number of elements. the mismatch between the number of transducer elements and the number of receive beamformer channels or cables may occur in three-dimensional imaging systems using multi-dimensional arrays of transducer elements. where the number of cables or receive beamformer channels is limited, circuitry may be provided within a transducer assembly for performing multiplexing or sub-array mixing. for example, u.s. published patent application nos. 2005-0148878 a1 and 2005-0148873 a1, the disclosures of which are incorporated herein by reference, disclose detachable transducer probe assemblies providing one of multiplexing or subarray mixing. brief summary by way of introduction, the preferred embodiments described below include receive circuits and associated methods for ultrasound imaging. both subarray mixing and time division multiplexing are provided with a same circuit. different aspects of the circuit and method are provided. first, components of the receive circuit respond to either phasing or time slot information to implement subarray mixing or time division multiplexing. second, a network of switches allows combination of signals from different elements to form different subapertures. third, a controller minimizes power consumption while outputting the desired phase or time division multiplexed information by gating a clock to various registers. each of the registers corresponds to different groups of transducer elements. for loading new phasing information, the clock is turned on to the desired register and off to the receive circuitry. during operation of the receive circuit, the clock is gated off to the desired register and gated on to the receive circuitry. the register outputs the previously loaded values in a static state without clocking. fourth, preamplification for either of time division or subarray mixed signals is provided using a variable gain amplifier with a common mode feedback. the common mode feedback provides for a constant operating point despite changes in the desired amount of gain. the present invention is defined by the following claims, and nothing in this section should be taken as a limitation on those claims. the various aspects described above may be used individually or in any possible combination. other aspects and advantages are discussed below in conjunction with the preferred embodiments. these further aspects and advantages may be used independently of any of the aspects described above. brief description of the drawings the components and the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. moreover, in the figures, like reference numerals designate corresponding parts throughout the different views. figs. 1a and 1b show one embodiment of a same receive circuit being used for subarray mixing and time division multiplexing, respectively; fig. 2 is a circuit diagram of one embodiment of a receive path with a common component for implementing both subarray mixing and time division multiplexing; fig. 3 is a circuit diagram of one embodiment of a preamplifier; fig. 4 is a circuit diagram of one embodiment of a portion of the circuit of fig. 2 ; fig. 5 is a block diagram of one embodiment of a switching network for connecting different receive channels with different summers; fig. 6 is a block diagram of one embodiment of a control circuit and associated receive circuits operating in a subarray mixed mode; fig. 7 is a control circuit of one embodiment operable with the receive circuit of fig. 2 ; fig. 8 is a circuit diagram of one embodiment of a synchronization register of fig. 7 ; and fig. 9 a circuit diagram of an element control of fig. 7 . detailed description of the drawings and presently preferred embodiments subarray mixing and time division multiplexing are performed using a same receive circuit. subarray mixing and time division multiplexing are two methods for conveying ultrasound receive signals from a large number of elements over a smaller number of channels or to a system with a smaller number of beamforming channels. other partial beamforming, multiplexing or other methods for reducing the number of paths, cables or receive beamformed channels needed may be used as an alternative or in addition to subarray mixing and time division multiplexing. the receive circuit is used for two-dimensional or three-dimensional imaging. for example, a multi-dimensional array is provided for real time three-dimensional imaging using either subarray mixing or time division multiplexing. subarray mixing and time division multiplexing both use switches and summation to combine signals from a plurality of receive elements onto a same output. by taking advantage of the similarity, a flexible receive circuit configuration allows operation in either mode with a minimum of extraneous circuitry. an output switching matrix connected prior to the summation provides scalable circuitry that may be used in a variety of sub-array or system configurations, maximizing the adaptability of the subarray mixing, multiplexing or other method of conveying a large number of signals on a fewer number of processing channels or cables. figs. 1a and 1b show a receive circuit 10 for ultrasound imaging. fig. 1a shows the receive circuit used for subarray mixing, and fig. 1b shows the receive circuit 10 used for time division multiplexing. the receive circuit 10 includes a plurality of elements 12 , a receive path 17 with a preamplifier 14 and a component 16 , a summer 18 and a cable 20 . additional, different or fewer components may be provided, such as additional summers 18 , the path 17 without the preamplifier 14 or the receive circuit 10 without the cable 20 . for both subarray mixing and time division multiplexing, the receive signals from the elements 12 are multiplied by the component 16 . for example, the component 16 is a switch or other multiplier for implementing a switching pattern prior to summation. for sub-array mixing, the switching pattern for each path 17 is a phase shifted plus and minus “1” square wave, such as shown in fig. 1a for two paths 17 . these phase shifted waveforms overlap in time so that the summation combines signals from individual elements with relative phasing. by choosing a desired multiplier phase, a steered partial receive beam is formed for the summed subarray. the use of a minus “1” or inverted multiplication suppresses harmonic mixing terms. as shown in fig. 1b , the switch pattern used for time division multiplexing is a sequence of “0” and “1” values. an inversion or minus “1” value may not be used, or may be used instead of the one value. as shown in fig. 1b , the time slot signal for each path 17 is non-overlapping with the other paths 17 . a time slot corresponds to the duration of the “1” signal. using non-overlapping patterns, signals from different elements 12 may not coincide, allowing the multiplexing and recovery. time division multiplexed signals may allow for more flexible beamforming but use switches that settle faster than otherwise required for subarray mixing due to the relatively short time slot period used in time division multiplexing. the plurality of elements 12 is piezoelectric or cmut arrays of elements. in one embodiment, the plurality of elements are distributed in a fully sampled multi-dimensional grid as a multi-dimensional transducer array. one-dimensional, sparse sampling or other grid spacings of elements may be provided. any now known or later developed array of elements may be used. in one embodiment, the arrays of elements 12 are positioned within a detachable transducer assembly. in one embodiment, the elements 12 are housed in a hand-held transducer housing. alternatively, a catheter or endoscope configuration is used. fig. 2 shows one embodiment of one path 17 of figs. 1a and 1b . the path 17 connects to the transducer element 12 , and includes the preamplifier 14 , the component 16 and an output amplifier 22 . additional, different or fewer components may be provided. one path 17 is provided for each of the respective plurality of transducer elements. alternatively, a path 17 is provided for each element 12 of a subset of the total number of elements. the preamplifier 14 is a single ended input amplifier having differential outputs connected with the component 16 in one embodiment. in alternative embodiments, differential inputs and/or a single output is provided. the preamplifier 14 includes a plurality of transistors, resistors or other now known or later developed devices for implementing an amplifier. in one embodiment, the preamplifier 14 has a variable gain, such as allowing selection of one or a range of gains for one mode of processing (e.g., time division multiplexing) and a different gain or range of gains for a different mode of processing (e.g., subarray mixing). the preamplifier 14 has a variable gain, such as for providing a higher gain for time division multiplexing to allow the output signal to use a full dynamic range, and a lesser gain for sub-array mixing where the signals are summed with non-zero values from other elements 12 . fig. 3 shows one embodiment of the preamplifier 14 . the amplifier 14 is shown as a single ended input amplifier with a variable gain and a common mode feedback. for a single ended input, the vn− is grounded. for a differential input, the signals are provided to the vn+ and − connections. receive signals from the element 12 are coupled to the amplifier through the capacitor c 1 and the resistor r 1 . the capacitor c 1 and r 1 and c 3 , c 4 , r 5 and r 6 are selected to pass desired ultrasound frequencies while rejecting low frequency transients. the emitter coupled pair q 9 and q 10 form a bipolar differential amplifier. the emitter coupled transistor pair q 9 and q 10 provide a current gain, but voltage gain may be provided in alternative embodiments. the resistors r 3 and r 4 act to convert the current gain provided by q 9 and q 10 to a voltage output and low-pass filter in conjunction with c 3 and c 4 . the current or voltage gain is varied in response to an adjustable bias current provided by the vtgco input through the transistor m 9 . the transistor m 9 acts as current source connected with the bipolar differential amplifier. the current source provides a variable gain in response to the input voltage vtgc 0 . to hold the operating point constant, a common mode feedback path is provided to the current source m 9 from the bipolar differential amplifier q 9 , q 10 . the common mode feedback path includes the transconductor gm 1 . the transconductor gm 1 generates a current in response to a difference in the voltages of a reference voltage vb 3 and the voltage output by the bipolar amplifier between resistors r 5 and r 6 . the common mode feedback path also includes mirrored transistor pairs m 8 , m 9 and m 10 , m 11 . the transistor m 8 mirrors the bias current in the transistor m 9 , and the mirrored transistors m 10 , m 11 invert and mirror the bias current. the mirror transistors are balanced or made as similar as possible by device matching. resistors r 5 , r 6 and capacitor c 5 in conjunction with the transconductor gm 1 low pass averages the output of the amplifier and generates a current correction for holding the operating point constant despite any changes in gain. the operating point for the constant voltage is input by vb 3 . the current mirrors m 10 and m 11 act to source the same current at the top or output of the amplifier as is sunk by m 9 due to gain control. in one embodiment, the preamplifier 14 provides a variable gain for implementing the different types of processing, such as subarray mixing and multiplexing. in alternative or additional embodiments, the preamplifier 14 includes a gain adjustment for depth gain control. signals associated with deeper penetration of ultrasound within tissue have a greater gain applied to compensate for attenuation. while one embodiment of the preamplifier 14 is shown above in fig. 3 , modifications may be provided, such as providing different resistor, capacitive or transistor structures. for example, the transistors m 1 , m 2 , m 3 , q 5 and q 6 shown in fig. 4 are also included as part of the preamplifier. referring again to fig. 2 , the path includes a component 16 that operates differently for each of at least two different sub-aperture modes. sub-aperture modes include time division multiplexing of a plurality of elements onto a single output, subarray mixing of signals from a plurality of elements onto a same output, partial beamforming, other types of multiplexing or any other now known or later developed process for placing signals from a plurality of elements onto a fewer number of outputs. for example, the component 16 is operable to mix an input signal with a local oscillator signal in a subarray mixing mode and is also operable to output the input signal in a selected time slot in a time division multiplexing mode. in one embodiment, the component 16 is a mode responsive switch connected between the preamplifier 14 and one of a differential amplifier 22 , a summer, or switching network for connecting the path 17 to different summers. opening and closing the switch modulates the input signal or selects a time slot for multiplexing to output the input signal. the control signal operating the switch implements the modulation or time slot selection. in the embodiment shown in fig. 2 , the component 16 includes a plurality of switches, such as four switches s 1 through s 4 . switches s 1 and s 3 connect with one of the differential outputs from the preamplifier 14 , and switches s 2 and s 4 connect with a different one of the outputs from the preamplifier 14 . the output of the switches s 1 and s 4 connect together, and the outputs of the switches s 2 and s 3 connect together. for example, the output of the switches s 1 and s 4 connect to a positive input of the differential output amplifier 22 , and the output of the switches s 2 and s 3 connect together to a minus input of the differential output amplifier 22 . other connections using fewer or additional switches may be provided. for example, additional switches are provided for implementing three or more different sub-aperture modes. different combinations of switches are operable for different sub-aperture modes. for example, the switches s 1 and s 2 are ganged together or operable in unison in response to a same control signal. similarly, switches s 3 and s 4 are ganged together or operable in unison in response to a same control signal. the four state table shown in fig. 2 shows one example of controlling the switch pairs to implement time division multiplexing and sub-array mixing with the same switches. subarray mixing is implemented by alternating between inverted and non-inverted states shown in the table. the timing of switching between the inverted and non-inverted states establishes the phase and local oscillation frequency. for example, fig. 1a shows the one minus one or inverted and non-inverted states of the component 16 and relative phasings for two paths 17 . sub-array mixing is provided by opening the third and fourth switches while closing the first and second switches and vice versa for inversion and non-inversion. time division multiplexing is implemented by alternating between the non-inverted and off states. the non-inverted state is implemented for identifying a time slot, the off-state is associated with time slots used by other paths 17 . for example, fig. 1b shows two different time slots for two different paths 17 indicated by switching between the non-inverted one state and the off zero state. time division multiplexing corresponds between opening the third and fourth switches while closing the first and second switches and closing the first, second, third and fourth switches for the off-state. for a voltage mode implementation, the cancellation state where s 1 , s 2 , s 3 , and s 4 are on at a same time is not used. instead, switches s 1 , s 2 , s 3 , and s 4 are opened and some impedance is introduced across the input terminals of amplifier 22 to provide an off state. alternatively, current mode circuits are used. fig. 4 shows one embodiment of a bicmos implementation of the component 16 , a portion of the preamplifier 14 and the differential output amplifier 22 . the transistors q 5 and q 6 form a differential voltage-to-current amplifier with a transistor m 1 controlling the transconductance via the gain signal vtgc 1 . the transistors m 2 and m 3 provide constant current sources. the transistors m 1 , m 2 , m 3 , q 5 and q 6 are a second stage of the preamplifier described above with respect to fig. 3 . the vout+ and vout− of fig. 3 connect with the vin+ and vin− of fig. 4 . the vtgc 1 signal provides an additional variable-gain control via transistor m 1 . the vb 1 signal is used to set the dc bias current in q 5 and q 6 via the transistors m 2 and m 3 , respectively. the signal can be used to adjust the circuit for different operating conditions and is responsive to a selection of preset static levels via bits in the global control register. the collector currents of the transistors q 5 and q 6 are differential and routed to the switching matrix q 1 , q 2 , q 3 and q 4 . the switching matrix q 1 through q 4 corresponds to the switches s 1 through s 4 of component 16 discussed above for fig. 2 . the control signals s 1 , s 2 , s 3 and s 4 control each of the transistors q 1 through q 4 , respectively. the transistors q 1 through q 4 and signals s 1 through s 4 form a current-mode implementation of component 16 in fig. 2 . with this circuit, the cancellation state is used to implement time-division multiplexing. in alternative embodiments, voltage-mode switches are used and the off state is used for time-division multiplexing. the differential-to-single ended output amplifier 22 is implemented with the transistors q 7 , q 8 , m 4 and m 5 . other implementations may be used, such as by using m 4 and m 5 without q 7 and q 8 . the transistors q 7 and q 8 form a cascode stage which improves the speed of the switching network, increasing the bandwidth but using more power. the transistors m 4 and m 5 form a differential-to-single ended current output stage. the output current iout is the output of the path 17 and is responsive to the mode of operation of the switches q 1 through q 4 . for example, iout represents an input signal mixed with the local oscillating frequency at a selected phase. as another example, iout represents an input signal during a desired time or time slot and otherwise has a zero output value. bias current is reused throughout the various stages to save power. the current sources m 2 and m 3 provide current biasing of the amplifiers q 5 and q 6 . this bias current is reused in the switching matrix q 1 through q 4 , the optional cascode stage q 7 and q 8 and the output stage m 4 and m 5 . referring to figs. 1a and 1b , a summer 18 combines the signals from a plurality of paths 17 . the summer 18 comprises a connection of signal traces in one embodiment, but active summers may be provided in other embodiments. in one embodiment, the summer comprises an operational amplifier. one input of the amplifier is grounded and the other input of the amplifier connects to a plurality of paths 17 . the operational amplifier converts the current output by each path to a combined voltage signal. the virtual ground summation node of the operational amplifier provides isolation between the channels or path 17 and avoids problems with parasitic capacity loading at the summation node, so a large number of paths may be summed without limiting the circuit bandwidth. the path 17 of each sub-aperture connects to a same summer 18 . for example, a plurality of summers is provided. each summer connects with a different group of paths 17 and associated elements 12 . each different group of elements 12 and paths 17 corresponds to a sub-aperture. the output of each of the summers 18 is an output sub-aperture signal. in the sub-array mixing embodiment, the output sub-aperture signal represents partial beamformation of the sub-aperture. for the time division multiplex mode of operation, the output sub-aperture signal represents time division multiplexing of the signals from the various elements within the sub-aperture. in one embodiment, the circuitry of figs. 3 and 4 with or without control circuits are implemented as an application specific integrated circuit. a path 17 is provided for each of the elements. in alternative embodiments, each of the path 17 , portions of the path 17 or one ore more components are implemented as separate devices or as a circuit on different semiconductors. for flexibility, a switch network connects the path 17 to the plurality of summers 28 . fig. 5 shows one embodiment of a circuit with a plurality of paths 17 connectable to a plurality of summers 28 with a switch network 26 . the switch network 26 is operable to selectively connect each of the paths 17 to different summers 28 . in one embodiment, the switches 26 comprise two cmos transistors switch segments as shown in fig. 5 . alternatively, a single transistor, different types of transistors, different types of switches, a multiplexer or other devices now known or later developed are used for selectively connecting different paths 17 to different summers 28 . in the embodiment shown in fig. 5 , a switch segment comprising a pair of transistors is provided for each possible connection of a given path 17 to a plurality of summers 28 . for example, a given path 17 may be selectively connected with m summers 28 . a pair of transistors is provided for each possible connection from the path 17 to each of the m summers 28 . at least one transistor switch is provided for each possible combination of each of the paths 17 to each of the plurality of summers 28 . in alternative embodiments, a given path 17 is only connectable with a subset or fewer than all of the summers 28 . using the switch network 26 , different paths 17 may be connected with different summers 28 . accordingly, different sub-apertures are formed for output by different summers 28 . by connecting different groups of the plurality of elements 12 and the associated paths 17 into respective sub-apertures, each summer 28 outputs the sub-aperture signal. in one embodiment, the number of summers 28 and associated outputs corresponds to the number of available cables 20 connecting the transducer array to the imaging system and/or the number of receive beamformer channels in the diagnostic medical imaging system. the number of paths 17 corresponds to the number of active elements 12 of the array. when the number of active elements 12 of the array is greater than the number of outputs or summers 28 , a subarray compression factor is given by the ratio of the number of active elements 12 by the number of available outputs. the compression factor may range from about 1 to 20 or more. for example, a subarray compression factor of 4 to 16 is provided for real time three dimensional imaging with a two dimensional transducer array of 2048 element using 128 to 512 cables or receive beamformer channels. the number of switches 26 provided for each path 17 is equal to or less than the number of summers 28 and associated system or cable channels. any of various subarray signals may be formed for output on the available channels. fig. 6 shows use of the circuit of fig. 5 for subarray mixing. in the embodiment shown in fig. 6 , nine different elements 12 and associated paths 17 are combined in two sub-apertures on two different outputs associated with two summers 28 . using the switch network 26 , different ones of the path 17 are mapped to different outputs or summers 28 . for example, 8 of the elements are mapped to a single summer 28 as represented at 30 . as represented at 32 , two different sub-apertures of four elements each are mapped to the two outputs or two summers 28 . as shown at 34 , nine different elements are mapped to a single output and associated summer 28 . other combinations of sub-apertures of one or more elements may be mapped to one or more of the outputs. in one embodiment, each element and associated path 17 is mapped to a single summer 28 . in alternative embodiments, a path 17 is mapped to more than one summer 28 . using the flexibility, the same circuit 10 is usable with an ultrasound imaging system with a different numbers of channels. for example, 9 to 1 mapping is used for a low channel count system (e.g., 128 receive beamformer channels) and 4 to 1 mapping is used for a system with a high channel count (e.g., about 300 receive beamformer channels) given about 1,600 elements. in some modes, such as represented at 30 and 32 , one input or path 17 is unused out of the group of nine paths 17 . additional unused paths 17 may be provided. for powering down, the current sources m 2 and m 3 of fig. 4 are deactivated. the circuit is powered down to avoid power dissipation by unused channels. alternatively, all of the elements are mapped to different sub-apertures. fig. 6 also includes a controller 40 connected with each of the paths 17 through element controllers 42 . each of the element controllers 42 is responsive to an input for selecting a mode of operation, such as selecting between subarray mixing and time division multiplexing. alternatively, the output of the shift register 44 indicates the mode of operation. the shift register 44 stores a switching kernel, such as the series of zeroes and ones shown above the shift register 44 . for subarray mixing, the switching kernel is a square wave defined by ones and zeroes of a desired length. for example, the kernel shown in fig. 6 has a 50 percent duty cycle square wave of eight ones in sequence with eight zeroes. different duty cycles, different waveforms, and lesser lengths may be used, such as two ones followed by two zeroes followed by two ones and so on. each shift register bit represents a unique phase of a local oscillator used to modulate the input signals into the path 17 . each of the element controllers 42 selects an appropriate local oscillator phase and routes the phasing to the path 17 . different phases are selected for different paths 17 . for example, the first path for element zero is associated with the phase defined by the first bit. the ninth path for element 8 is associated with the ninth bit of the kernel. different phasing relationships may be used. the multiplexers 46 and 48 allow the length of the switching kernel to be varied by up to 16 bits in this embodiment. by multiplexing different outputs from the shift register 44 into an input of the shift register 44 , a different length may be provided for the switching kernel for a different oscillation frequency. the additional multiplexer 48 also allows a new length or kernel independent of the previous kernel to be fed into the shift register 44 . for time division multiplexing operation, the kernel consists of a single one value. as the one cycles through the shift register, individual elements 12 in the associated path 17 are enabled to place their input on an output in a non-overlapping time division multiplexed fashion. in alternative embodiments, a pair of ones are used for identifying a longer time slot for each element. a longer time slot may be used in other embodiments. in one embodiment, the transducer array of elements 12 , associated paths 17 , switching network 26 , summers 28 and controller 40 are implemented in a releasable transducer assembly. for example, a hand-held probe housing houses an application specific integrated circuit implementing the receive circuit 10 . alternatively, one or more of the components are located within a connector housing that is also part of the releasable transducer assembly. the releasable transducer assembly is releasably attachable to an ultrasound imaging system. as a result, any of various transducer arrays may be used with different ultrasound systems even where the ultrasound system has a fewer number of receive beamformer channels than number of elements provided by the array. other electronics may be included within the transducer probe housing or within the transducer assembly connectable with the ultrasound imaging system. for example, the controller 40 or at least a portion of the controller is within the transducer probe housing. alternatively, the controller 40 is within the ultrasound imaging system and provides signals along one or more control lines to electronics within the transducer assembly or transducer probe housing. in alternative embodiments, a part or all of the receive circuit 10 is located within the imaging system and is not detachable. the controller 40 connects with a plurality of the paths 17 . as shown in figs. 6 and 7 , the controller 40 is modular and includes a plurality of registers 44 for different groups of the plurality of paths 17 . for example, a phase selection register 44 is provided for every group of nine elements 12 . other numbers of elements 12 for each register 44 may be used. each of the registers 44 , element controls 42 , global register 52 and/or sync register 50 is a control module for the groups of elements 12 . each of these control modules is operable to output control signals, such as the registers 44 outputting a phase selection for each of a plurality of mixing circuits. as shown in fig. 7 , a clock source 56 connects with each of the registers 44 . this clock source 56 comprises a local oscillator, an input clock signal from a remote source or any other now known or later developed clock signal. in one embodiment, the input clock signals comprise differential or positive and negative indications. alternatively, the clock source is a single input line. the clock source 56 connects with a serial interface 54 , the registers 44 , a global register 52 , and a sync register 50 of the controller 40 . a load indication signal also connects with the serial interface 54 and a and gate 58 . the other input to the and gate 58 is the clock signal. the and gate 58 outputs the clock signal to the element controllers 42 when the load signal is high. a high load signal indicates an ongoing use or operation of the receive circuit 10 . a low load signal indicates loading of parameters into the various registers 44 of the controller 40 , so the clock signal is disabled to the element controllers 42 to minimize power consumption. either the and gate 58 , the serial interface 54 , and/or gates within any register or controller act as a clock enable controller. the clock enable controller connects with a plurality of control modules, such as the registers 44 or the element controllers 42 . the clock enable controller is operable to prevent clocking of at least one of the plurality of control modules, such as the clock signal gating by the and gate 58 as described above for the element controllers 42 . the registers 44 are also or alternatively controlled by a clock enable controller, such as the serial interface 54 . the serial interface 54 provides access to the programmable control modules as a serial bus slave device. the serial bus master which controls the serial interface 54 is an application specific integrated circuit or field programmable gate array. the serial interface protocol uses a three stage transaction configuration having a start/reset stage, an address stage and a data stage, but other protocols may be used. the clock source 56 is input to the serial interface 54 as well as the load signal and a serial data input. the serial data input and output allow daisy chaining of multiple digital control networks 40 . for diagnostic purposes, a register read back may be supported by connecting the serial data output to the serial bus master controlling the clock and load line signals. the phase select registers 44 are control modules that store phase information for individual elements. the phase information is used for subarray mixing modes of operation. for nine elements, each phase select register stores a four bit phase selection. a maximum of 16 available synchronous pulse phases are provided. in other embodiments, a fewer or greater number of bits are used. for one controller 40 , four phase select registers 44 are provided, allowing control of 36 elements. in other embodiments, fewer or more than four phase select registers 44 are used. during time division multiplexing operating mode, the registers 44 are loaded once every mode change but remains static from beam to beam or during a scan of the region. for subarray mixing operating modes, the registers 44 are loaded for every scan lines or steering change. to save power, such as where the controller 40 is within a detachable transducer assembly, the clock signal to the phase select registers 44 is gated by the serial interface 54 . the clock is enabled or turned on to load and read-out the kernel or phase selection information prior to use by the receiver circuit 40 . the phase select registers 44 are then disabled or inactive during use by the receive circuit 10 . when the phase select registers 44 are off, data is output but at a static value or values. the static information is used for control or phase selection without power dissipation due to clocking. the serial interface 54 acts as a clock enable control operable to enable a clock signal into each of a plurality of registers 44 for loading data and disable the clock into each of the plurality of registers 44 during the readout operations. an additional global register 52 is provided in one embodiment. the global register stores static control parameters for all of the elements. for example, the register includes 77 bits. the bits define four types of parameters, such as an analog gain control (e.g., four bits), operating mode (e.g., one bit for identifying multiplexing or sub-array mixing), element specific output or summer selections (e.g., 36 bits defining the connections of each of nine channels 17 to two possible summers 28 ) and element enable selections (e.g. 36 bits defining which elements are enabled and disabled). the analog gain control is the same for all elements, such as a value for establishing the bias point of transistors m 2 and m 3 in fig. 3 . the operating mode also applies globally to all elements. other control structures, numbers of bits, purposes for the bits, or coding may be used in other embodiments. for example, additional global control bits can be used to provide a means of calibrating channels within one asic to match those in another asic or group of asics. the synchronization register 50 is a programmable local oscillator for providing the local oscillation control signal to the component 16 . the synchronization register 50 generates a programmable multiphase waveform. in one embodiment, the register 50 also includes an array of 36 phase multiplexers which select one phase of the local oscillation signal to be applied to each element 12 for the controller 40 . in one embodiment described above, the synchronization register 50 outputs a 16 bit synchronization pattern in a loop register with a four bit feedback path select. fig. 8 shows one embodiment of the synchronization register 50 . the phase multiplexers for each of the elements are shown at 60 . twenty flip flops 62 are provided for initial storage of a kernel for the local oscillator signal. during operation, the flip flops 62 labeled 16 through 19 are static, but the flip flops 0 through 15 are active allowing shifting in of new bits under the control from the decoder 64 . the flip flops 62 labeled 0 through 15 are set up in a variable length, circular shift register. the length of the shift register is one register more than the value stored in the flip flops 62 labeled 16 through 19. for example, implementing the subarray mixing mode of length 16 , a same number of zeroes and ones are provided in the flip flops 62 labeled 0 through 15. the flip flops 62 labeled 16 through 19 using the decoder 64 control the multiplexers 66 to select a bit for shifting, and set the frequency. for time division multiplexing nine inputs onto one output, one high value is stored with the remaining flip flops 62 having low values. the flip flops 62 labeled 16 through 19 through the decoder 64 cause the flip flops 62 labeled 0 through 8 to loop in a repeating cycle. one synchronization register is shown above, but different synchronization registers may be used. in yet other alternative embodiments, structures other than a register may be provided for outputting phase, local oscillation waveforms and/or time slot information. the element controls 42 shown in fig. 7 are digital or analog devices for outputting signals controlling the component 16 , such as switch operation control signals. fig. 9 shows one embodiment of the element control modules 42 . the element control module 42 of fig. 9 shows structure for a single element 12 or path 17 . as shown in fig. 7 , each module 42 is associated with nine paths 17 , but another number of paths, such as less than 9 or more than 9 may be controlled by each module. the structure for each path 17 is separate or independent of other paths 17 controlled by the same module 42 . for any given path 17 , the element control module 42 includes a flip flop 70 and two nand gates 72 . additional, different or fewer components may be provided. this element control module 42 is operable to output a control signal that varies as a function of selected mode of operation. for example, the phase information for a particular path 17 is input as the synchronous phase from the sync register 50 . a clock signal is also input to the flip flop 70 . as discussed above, the clock signal is enabled or disabled by the and gate 58 . the synchronous enable and n synchronous enable input lines are derived from the mode selection and element enable from the global register 52 . if a particular element 12 and associated path 17 is not enabled, both the synchronous enable and the n synchronous enable are maintained as low values, resulting in a high output for both the synchronous and the n synchronous signals. for operation in the time division multiplexing mode, only one of the synchronous enable or n synchronous enable values is set as high. for example, the synchronous enable is set as high and the n synchronous enable signal is set as low. as a result, the synchronous output varies as a function of the output of the flip flop 70 . the n synchronous output from the nand gate 72 is held high. when a desired time slot for a particular path 17 is input on the synchronous phase line to the flip flop 70 , the nand gate 72 changes from a high to a low value. in the subarray mixing mode of operation, both the sync enable and n sync enable are held high. the synchronous phase information provided to the flip flop 70 is clocked through the flip flop to both nand gates 72 . as a result, the output of the synchronous and n synchronous signals provide the “1” and “−1” values of the local oscillation at a selected phase. the synchronous and n synchronous outputs are complements. using the receive circuitry 10 described above or different receive circuitry, a method is provided for ultrasound sub-aperture processing. using the control circuits 40 described above or different control circuits, a method for controlling the sub-aperture operation in an ultrasound transducer is provided. one of at least two different sub-aperture processes are selected for each of a plurality of channels. for example, either mixing or multiplexing are selected. the same sub-aperture process is selected for each channel, but different sub-aperture processes may be selected for different sub-apertures. the selection is performed in response to a type of imaging, an imaging application, a type of imaging system, the number of receive beamformer channels, the desired resolution, or other user input or processor determination. in response to the selection of mixing, an associated phase for each of the channels or paths is determined. for example, a lookup table is used to identify phases for different elements of each sub-aperture as a function of the steering direction. the same or different phase may be used for any two elements within an aperture. for time division multiplexing, a time slot associated with each element and associated channel is identified from a lookup table or calculation. each channel within a sub-aperture has a different time slot designation. each channel within a sub-aperture is configured pursuant to the desired sub-aperture processing mode, such as for other types of multiplexing or other sub-aperture processes. in one embodiment, the sub-aperture is used for a combination of mixing and multiplexing different mixed combinations. the specific sub-apertures are also identified. for example, the number of sub-apertures desired is determined as a function of the number of receive beamformer channels of the imaging system for subarray mixing. the number of cables may be used to determine the number of sub-apertures for time division multiplexing. other factors may be used for identifying the number and position of sub-apertures in any mode. using a lookup table or other data source, a number of enabled elements is determined. for example, all of the elements of a multi-dimensional transducer array are enabled. the sub-apertures are then defined within the enabled elements. the size of each sub-aperture depends upon the number of available sub-apertures and the number of elements enabled. in one embodiment, each sub-aperture is associated with a same size multi-dimensional area as other sub-apertures. each multidimensional sub-aperture is contiguous. in alternative embodiments, the sub-apertures are non-contiguous or contiguous but linear. any possible sub-aperture shapes may be used. the sub-apertures used may vary as a function of the scan line being scanned, as a function of a depth of the focus, as a function of each scanned frame of data, as a function of an imaging session or as a function of other imaging parameters. the sub-apertures are defined by configuring the elements and associated channels to connect with different summers. the possible sub-apertures may be limited by the receive circuits 10 , such as every group of nine elements being configuration in any pattern of up to two sub-apertures. after configuring the receive circuitry, signals responsive to the configuration and selections discussed above are output to each of the channels during use. for subarray mixing, a local oscillation signal with a selected phase is output to each of the channels. different channels may have different phases. for time division multiplexing, a time slot pulse is output for each of the channels in the sub-aperture. a different time slot is identified for each of the channels. the time slot pulse activates a particular channel for a desired time slot. in response to the output signals, a component in each receive paths is controlled based on the selection of mode of operation. the same component is controlled differently or operates differently as a function of the mode of operation of sub-aperture processing. the same component performs a different function. for example, two pairs of switches are controlled differently depending on the mode of sub-aperture processing. a pair of switches are continuously operated in an inverse fashion with one pair on and the other pair off at a mixing frequency, modulating the input signal using the switches in response to a local oscillation signal. in a different mode of operation, such as time division multiplexing, the switches are switched in the receive channel to output the input signal only at desired time slots. at times other than the identified time slot, the switches remain in an off position. based on the sub-aperture configuration, input ultrasound signals responsive to the mode of operation and control of components in the plurality of receive channels are combined for the sub-aperture. the signals of one channel are combined with signals from other receive channels in the same sub-aperture. for subarray mixing, the modulated input signals are summed with signals from other receive channels. the combined subarray mixed signals represent partially beamformed information. for time division multiplexing, the signal from one channel is output in one time slot and signals from other channels are output in other time slots. the combined output is a time division multiplex signal for the sub-aperture. by selecting different sub-apertures, the signals from different groups of elements are routed to a respective output for each sub-aperture. the control of the different paths pursuant to the different modes of sub-aperture operation is performed with a plurality of control modules in one embodiment. each control module corresponds to a different group of elements. in one embodiment, each control module is operable to configure the corresponding group of elements into for one or two sub-apertures. in other embodiments, the control modules connect in such a way that a sub-aperture includes elements associated with different control modules. in yet other alternative embodiments, a single control module controls all of the elements. to save power, a clock signal to one or more of the control modules may be disabled during operation. once the desired data is loaded within a register or other source of static information, the clock is disabled to avoid unnecessary power consumption. for hand-held imaging systems, portable imaging systems or multi-dimensional transducer arrays with a limited amount of space and power availability, reductions in power consumption may allow for more efficient operation. while the invention has been described above by reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the invention. it is therefore intended that the foregoing detailed description be regarded as illustrative rather than limiting, and that it be understood that it is the following claims, including all equivalents, that are intended to define the spirit and scope of this invention.
186-752-293-438-150	US	[ "US" ]	C23F1/00,H01J37/32,C23C16/00,H01L21/306	2003-09-30T00:00:00	2003	[ "C23", "H01" ]	method and apparatus for detecting a plasma	the present invention presents an improved apparatus and method for monitoring a material processing system, where the material processing system includes a processing tool, test signal source, and a filter/detector. the test signal source providing a first test signal and a second test signal to the processing chamber, and the filter/detector detecting an intermodulation product of the first test signal and the second test signal generated when a plasma is created.	1 . a material processing system comprising: a processing tool, wherein the processing tool includes at least one process chamber; a test signal source coupled to the process chamber, the test signal source providing a first test signal and a second test signal; a filter/detector for detecting an intermodulation product of the first test signal and the second test signal; and a controller coupled to the filter/detector and the processing tool, the controller comprising means for determining when a plasma is created using the detected intermodulation product. 2 . the material processing system as claimed in claim 1 , wherein the first test signal and a second test signal are at different frequencies. 3 . the material processing system as claimed in claim 1 , wherein the first test signal and a second test signal are at the same frequency. 4 . the material processing system as claimed in claim 1 , wherein the test signal source comprises a first source for providing the first test signal, a second source for providing the second test signal, summing circuit for combining the first test signal and the second test signal, isolation amplifier for amplifying the first test signal and the second test signal, and antenna for transmitting the first test signal and the second test signal, wherein the antenna is coupled to the process chamber. 5 . the material processing system as claimed in claim 1 , further comprising: an rf bias source configured to provide an rf bias signal; and an rf subsystem coupled to the process chamber, coupled to the rf bias source and coupled to the test signal source, wherein the rf subsystem comprises means for combining the first test signal, the second test signal, and the rf bias signal and means for providing the first test signal, the second test signal, and the rf bias signal to the process chamber. 6 . the material processing system as claimed in claim 5 , wherein the rf bias signal is used to generate plasma and the first test signal and the second test signal are not harmonically related to the frequency of the rf bias signal. 7 . the material processing system as claimed in claim 1 , wherein the filter/detector comprises an antenna coupled to the process chamber, a filter coupled to the antenna, and detector coupled to the filter, wherein the filter comprises a bandpass filter (bpf) configured to pass at least one intermodulation product of the first test signal and the second test signal. 8 . the material processing system as claimed in claim 7 , wherein the at least one intermodulation product of the first test signal and the second test signal comprises an odd-order product. 9 . the material processing system as claimed in claim 8 , wherein the at least one intermodulation product of the first test signal and the second test signal comprises a fifth order product. 10 . the material processing system as claimed in claim 8 , wherein the at least one intermodulation product of the first test signal and the second test signal comprises a seventh order product. 11 . the material processing system as claimed in claim 1 , wherein the filter/detector further comprises a power source coupled to at least one of the antenna, filter, and detector. 12 . the material processing system as claimed in claim 11 , wherein the power source comprises at least one of an rf-to-dc converter configured to convert energy emitted from a process related signal into a dc signal, an rf-to-dc converter configured to convert a non-process related signal into a dc signal, a dc-to-dc converter, and a battery. 13 . the material processing system as claimed in claim 1 , wherein the filter/detector further comprises a controller coupled to at least one of the antenna, filter, and detector. 14 . the material processing system as claimed in claim 13 , wherein the controller comprises at least one of a microprocessor, a microcontroller, a timer, digital signal processor (dsp), memory, receiver, a/d converter, and d/a converter 15 . the material processing system as claimed in claim 1 , wherein the test signal source further comprises a first source providing a first signal at least one frequency; a second source providing a second signal at least one frequency; a summing circuit for combining the first signal and the second signal; an isolation amplifier coupled to the summing circuit for amplifying the first signal and the second signal; and an antenna coupled to the isolation amplifier for transmitting the first signal and the second signal into the process chamber. 16 . the material processing system as claimed in claim 15 , wherein the first source and the second source comprise sine wave oscillators. 17 . the material processing system as claimed in claim 1 , wherein the test signal source further comprises a power source coupled to at least one of the antenna, filter, and detector. 18 . the material processing system as claimed in claim 17 , wherein the power source comprises at least one of an rf-to-dc converter configured to convert energy emitted from a process related signal into a dc signal, an rf-to-dc converter configured to convert a non-process related signal into a dc signal, a dc-to-dc converter, and a battery. 19 . the material processing system as claimed in claim 1 , wherein the test signal source further comprises a controller coupled to at least one of the antenna, filter, and detector. 20 . the material processing system as claimed in claim 19 , wherein the controller comprises at least one of a microprocessor, a microcontroller, a timer, digital signal processor (dsp), memory, receiver, a/d converter, and d/a converter 21 . a method of determining the presence or absence of a plasma in a plasma processing space within semiconductor processing system comprising: coupling at least two rf signals into a processing space; coupling, from the processing space, the input of a detector configured to detect plasma-produced intermodulation products of the at least two signals. 22 . the method as claimed in claim 21 , wherein the intermodulation products include at least one odd order intermodulation product of the at least two signals. 23 . the method as claimed in claim 21 , wherein the at least two rf signals are from 10 mhz to 1500 mhz.	field of the invention the present invention relates to detecting a plasma in a processing system and, more particularly, to detecting a plasma using a simple and inexpensive monitoring device. background of the invention the fabrication of integrated circuits (ic) in the semiconductor industry typically employs plasma to create and assist surface chemistry within a plasma reactor necessary to remove material from and deposit material to a substrate. in general, plasma is formed within the plasma reactor under vacuum conditions by heating electrons to energies sufficient to sustain ionizing collisions with a supplied process gas. moreover, the heated electrons can have energy sufficient to sustain dissociative collisions and, therefore, a specific set of gases under predetermined conditions (e.g., chamber pressure, gas flow rate, etc.) are chosen to produce a population of charged species and chemically reactive species suitable to the particular process being performed within the chamber (e.g., etching processes where materials are removed from the substrate or deposition processes where materials are added to the substrate). during, for example, a deposition or an etch process, monitoring the plasma processing system can be very important when determining the state of a plasma processing system and ensuring the quality of devices being produced. additional process data can be used to prevent erroneous conclusions regarding the state of the system and the state of the products being produced. for example, the continuous use of a plasma processing system can lead to a gradual degradation of the plasma processing performance and ultimately to complete failure of the system. plasma can enable and/or enhance processes used by the semiconductor industry. in many instances it is critical that semiconductor equipment possess a mechanism for determining plasma presence to complete a process. in fact, proceeding with the manufacture of semiconductor devices without a plasma, when one is expected, often results in the scrapping of product. many techniques are available to monitor and detect the presence of plasma, however, most require cost prohibitive components and/or require physical contact with the plasma. summary of the invention the present invention provides an apparatus and method for detecting plasma in a processing system and, more particularly, to an apparatus and method for detecting a plasma using a simple and inexpensive monitoring device. according to principles of the present invention, a plasma processing apparatus used in semiconductor manufacture is provided with two rf signals coupled to the processing space in a vacuum chamber that is occupied by a plasma during processing. the apparatus is also provided with an rf detector having an input coupled to the processing space and configured to detect an intermodulation product of the two rf signals. the output of the detector is coupled to the controller of the apparatus, to which it provides an output signal having one state when a plasma is present in the processing space and another state when a signal is absent from the processing space. the two signals are in the range of frequencies effective to couple energy to and from the plasma, depending on the parameters of the system, which range includes those frequencies used to excite or ignite a plasma. the two signals may include rf energy being coupled to the plasma to sustain the plasma. the two signals may also include rf energy being coupled to a substrate to bias the substrate. the two signals may also include rf energy being coupled to a target to sputter the target. more commonly, one or both of the two signals will include rf energy being coupled to the processing space solely for purposes of serving as a test signal. any two signals, which, if multiplied together, will form an intermodulation product, may be used. when no plasma is present in the processing space, the two signals, or their sum, will be detectable at the detector, but certain intermodulation or multiplication products of the signals will be absent. when a plasma is present in the processing space, the plasma presents a nonlinear electrical impedance to the two signals, which has the effect of combining the two signals in a signal multiplier. as a result, certain intermodulation products are detectable at the detector. according to principles of the invention, a detector is provided that is configured to detect certain intermodulation products from the processing space that are produced in the space when a plasma is present, but are not so found when a plasma is absent from the processing space. the coupling of the signals to the space and the coupling of product signals from the space to the detector may employ antennas specifically provided for that purpose or may rely on a substrate support, plasma electrodes or other components in an rf coupling relationship with the processing space. the control logic of the apparatus responds to the output of the detector and controls the apparatus or drives monitoring devices so that the performance of the process can be conditioned on the ignition state of a plasma, when required. by utilizing the nonlinear electrical impedance characteristics of the plasma, the present invention provides a reliable, process independent means for detecting plasma without requiring highly specialized and expensive components. the present invention also provides a means for detecting plasma in a material processing system that includes at least one low-cost rf source and at least one low-cost filter/detector assembly. brief description of the drawings these and other advantages of the invention will become more apparent and more readily appreciated from the following detailed description of the exemplary embodiments of the invention taken in conjunction with the accompanying drawings, where: fig. 1 illustrates a simplified block diagram of a material processing system in accordance with an embodiment of the present invention; fig. 2 illustrates a simplified block diagram of another material processing system in accordance with an embodiment of the present invention; fig. 3 illustrates a simplified block diagram of another material processing system in accordance with an embodiment of the present invention; fig. 4 illustrates a simplified block diagram of another material processing system in accordance with an embodiment of the present invention; fig. 5 shows a simplified block diagram of a test signal source in accordance with an embodiment of the present invention; fig. 6 shows a simplified block diagram of a filter/detector in accordance with an embodiment of the present invention; and fig. 7 illustrates a method for monitoring a material processing system according to an embodiment of the present invention. detailed description of an embodiment the present invention is described in the context of a number of exemplary embodiments in which two signals are coupled into a processing space, and the presence or absence of certain intermodulation products of the two signals are detected from the processing space to determine whether or not a plasma is present in the processing space. the present invention provides an improved material processing system that can include a processing tool, which can comprise one or more process chambers. in addition, the processing system can include a plurality of rf-responsive process sensors that are coupled to the processing tool to generate and transmit process data and at least one sia configured to receive the process data from at least one of the plurality of rf-responsive process sensors. fig. 1 illustrates a simplified block diagram for a material processing system in accordance with an embodiment of the present invention. for example, material processing system 100 can comprise an etch system, such as a plasma etcher. alternately, material processing system 100 can comprise a photoresist coating system such as a photoresist spin coating system, and/or material processing system 100 can comprise a photoresist patterning system such as a lithography system. in another embodiment, material processing system 100 can comprise a dielectric coating system such as a spin-on-glass (sog) or spin-on-dielectric (sod) system. in another embodiment, material processing system 100 can comprise a deposition chamber such as a chemical vapor deposition (cvd) system, a physical vapor deposition (pvd) system, an atomic layer deposition (ald) system, and/or combinations thereof. in an additional embodiment, material processing system 100 can comprise a thermal processing system such as a rapid thermal processing (rtp) system. in another embodiment, material processing system 100 can comprises a batch diffusion furnace or other semiconductor processing system. in the illustrated embodiment, material processing system 100 comprises processing chamber 110 , upper assembly 120 , substrate holder 130 for supporting substrate 135 , pumping system 160 , and controller 170 . for example, pumping system 160 can provide a controlled pressure in processing chamber 110 . for example, processing chamber 110 can facilitate the formation of a processing gas in a process space 115 adjacent substrate 135 . the material processing system 100 can be configured to process 200 mm substrates, 300 mm substrates, or larger substrates. alternately, the material processing system can operate by generating plasma in one or more processing chambers. substrate 135 can be, for example, transferred into and out of processing chamber 110 through a slot valve (not shown) and chamber feed-through (not shown) via robotic substrate transfer system where it can be received by substrate lift pins (not shown) housed within substrate holder 130 and mechanically translated by devices housed therein. once substrate 135 is received from substrate transfer system, it can be lowered to an upper surface of substrate holder 130 . substrate 135 can be, for example, affixed to the substrate holder 130 via an electrostatic clamping system. furthermore, substrate holder 130 can further include a cooling system including a re-circulating coolant flow that receives heat from substrate holder 130 and transfers heat to a heat exchanger system (not shown), or when heating, transfers heat from the heat exchanger system. moreover, gas can, for example, be delivered to the backside of substrate 135 via a backside gas system to improve the gas-gap thermal conductance between substrate 135 and substrate holder 130 . such a system can be utilized when temperature control of the substrate is required at elevated or reduced temperatures. in other embodiments, heating elements, such as resistive heating elements, or thermoelectric heaters/coolers can be included. in alternate embodiments, substrate holder 130 can, for example, further comprise a vertical translation device (not shown) that can be surrounded by a bellows (not shown) coupled to the substrate holder 130 and the processing chamber 110 , and configured to seal the vertical translation device from the reduced pressure atmosphere in processing chamber 110 . additionally, a bellows shield (not shown) can, for example, be coupled to the substrate holder 130 and configured to protect the bellows. substrate holder 130 can, for example, further provide a focus ring (not shown), a shield ring (not shown), and a baffle plate (not shown). in the illustrated embodiment, shown in fig. 1 , substrate holder 130 can comprise an electrode 132 through which rf power can be coupled to the processing plasma in process space 115 . for example, substrate holder 130 can be electrically biased at an rf voltage via the transmission of rf power from rf system 150 . the rf bias can serve to heat electrons to form and maintain plasma. in this configuration, the material system can operate as a reactive ion etch (rie) reactor, wherein the chamber and upper gas injection electrode serve as ground surfaces. a typical frequency for the rf bias can range from 1 mhz to 100 mhz. for example, semiconductor processing systems that use 13.56 mhz for plasma processing are well known to those skilled in the art. in an alternate embodiment, substrate holder can be grounded or floating. as shown in fig. 1 , upper assembly 120 can be coupled to the processing chamber 110 and configured to perform at least one of the following functions: provide a gas injection system, provide a capacitively coupled plasma (ccp) source, provide an inductively coupled plasma (icp) source, provide a transformer-coupled plasma (tcp) source, provide a microwave powered plasma source, provide an electron cyclotron resonance (ecr) plasma source, provide a helicon wave plasma source, and provide a surface wave plasma source. for example, upper assembly 120 can comprise an electrode, an insulator ring, an antenna, a transmission line, and/or other rf components (not shown). in addition, upper assembly 120 can comprise permanent magnets, electromagnets, and/or other magnet system components (not shown). also, upper assembly 120 can comprise supply lines, injection devices, mass flow controllers, and/or other gas supply system components (not shown). furthermore, upper assembly 120 can comprise a housing, a cover, sealing devices, and/or other mechanical components (not shown). in an alternate embodiment, processing chamber 110 can comprise a monitoring port (not shown). a monitoring port can, for example, permit optical monitoring of process space 115 . material processing system 100 also comprises at least one source for providing at least two rf signals. as shown in the illustrated embodiment, test signal source 190 can be used to generate and transmit at least two rf signals. for example, test signal source 190 can comprise an antenna coupled to the process chamber for transmitting at least rf signals into the process space. in one embodiment, the two rf signals can be at different frequencies. alternately, the two rf signals can be at the same frequency. material processing system 100 also comprises at least one filter/detector device for receiving and processing rf signals generated by plasma in the process space 115 . in one embodiment, filter/detector 180 can comprise a narrow-band rf-filter (not shown) and a diode detector (not shown). filter/detector 180 can be coupled to controller 170 , and can exchange data with the controller. filter/detector 180 can operate using a single frequency band or multiple frequency bands, and filter/detector 180 can operate using one or more center frequencies. material processing system 100 also comprises a controller 170 . controller 170 can be coupled to chamber 110 , upper assembly 120 , substrate holder 130 , rf system 150 , pumping system 160 , filter/detector 180 , and test signal source 190 . the controller can be configured to provide control data to the filter/detector 180 and test signal source 190 , and receive data such as process data from the filter/detector 180 and test signal source 190 . for example, controller 170 can comprise a microprocessor, a memory (e.g., volatile and/or non-volatile memory), and a digital i/o port capable of generating control voltages sufficient to communicate and activate inputs to the processing system 100 as well as monitor outputs from the processing system 100 . moreover, the controller 170 can exchange information with chamber 110 , upper assembly 120 , substrate holder 130 , rf system 150 , pumping system 160 , filter/detector 180 , and test signal source 190 . also, a program stored in the memory can be utilized to control the aforementioned components of a material processing system 100 according to a process recipe. in addition, controller 170 can be configured to analyze the process data, to compare the process data with target process data, and to use the comparison to change a process and/or control the processing tool. also, the controller can be configured to analyze the process data, to compare the process data with historical process data, and to use the comparison to predict, prevent, and/or declare a fault. fig. 2 illustrates a simplified block diagram of another material processing system in accordance with an embodiment of the present invention. for example, material processing system 200 can comprise an etch system, such as a plasma etcher. alternately, material processing system 200 can comprise a photoresist coating system such as a photoresist spin coating system, and/or material processing system 200 can comprise a photoresist patterning system such as a lithography system. in another embodiment, material processing system 200 can comprise a dielectric coating system such as a spin-on-glass (sog) or spin-on-dielectric (sod) system. in another embodiment, material processing system 200 can comprise a deposition chamber such as a chemical vapor deposition (cvd) system, a physical vapor deposition (pvd) system, an atomic layer deposition (ald) system, and/or combinations thereof. in an additional embodiment, material processing system 200 can comprise a thermal processing system such as a rapid thermal processing (rtp) system. in another embodiment, material processing system 200 can comprises a batch diffusion furnace or other semiconductor processing system. in the illustrated embodiment, material processing system 200 comprises processing chamber 210 , upper assembly 220 , substrate holder 230 for supporting substrate 235 , pumping system 260 , and controller 270 . for example, pumping system 260 can provide a controlled pressure in processing chamber 210 . for example, processing chamber 210 can facilitate the formation of a processing gas in a process space 215 adjacent to substrate 235 . the material processing system 200 can be configured to process 200 mm substrates, 300 mm substrates, or larger substrates. alternately, the material processing system can operate by generating plasma in one or more processing chambers. substrate 235 can be, for example, transferred into and out of processing chamber 210 through a slot valve (not shown) and chamber feed-through (not shown) via robotic substrate transfer system where it can be received by substrate lift pins (not shown) housed within substrate holder 230 and mechanically translated by devices housed therein. once substrate 235 is received from substrate transfer system, it can be lowered to an upper surface of substrate holder 230 . substrate 235 can be, for example, affixed to the substrate holder 230 via an electrostatic clamping system. furthermore, substrate holder 230 can further include a cooling system including a re-circulating coolant flow that receives heat from substrate holder 230 and transfers heat to a heat exchanger system (not shown), or when heating, transfers heat from the heat exchanger system. moreover, gas can, for example, be delivered to the backside of substrate 235 via a backside gas system to improve the gas-gap thermal conductance between substrate 235 and substrate holder 230 . such a system can be utilized when temperature control of the substrate is required at elevated or reduced temperatures. in other embodiments, heating elements, such as resistive heating elements, or thermo-electric heaters/coolers can be included. in alternate embodiments, substrate holder 230 can, for example, further comprise a vertical translation device (not shown) that can be surrounded by a bellows (not shown) coupled to the substrate holder 230 and the processing chamber 210 , and configured to seal the vertical translation device from the reduced pressure atmosphere in processing chamber 210 . additionally, a bellows shield (not shown) can, for example, be coupled to the substrate holder 230 and configured to protect the bellows. substrate holder 230 can, for example, further provide a focus ring (not shown), a shield ring (not shown), and a baffle plate (not shown). in the illustrated embodiment, shown in fig. 2 , upper assembly 230 can comprise a means through which power can be coupled to the processing plasma in process space 215 . for example, rf power can be provided by an rf system 250 to a deposition system (not shown). a typical frequency for the rf bias can range from 2 mhz to 200 mhz. for example, semiconductor processing systems that use 13.56 mhz for plasma processing are well known to those skilled in the art. in various embodiments, the substrate holder can be grounded or floating. as shown in fig. 2 , upper assembly 220 can be coupled to the processing chamber 210 and configured to perform at least one of the following functions: provide a gas injection system, provide a capacitively coupled plasma (ccp) source, provide an inductively coupled plasma (icp) source, provide a transformer-coupled plasma (tcp) source, provide a microwave powered plasma source, provide an electron cyclotron resonance (ecr) plasma source, provide a helicon wave plasma source, provide a surface wave plasma source, and provide a deposition source. in alternate embodiments, upper assembly 220 can comprise an electrode, an insulator ring, an antenna, a transmission line, and/or other rf components (not shown). in addition, upper assembly 220 can comprise permanent magnets, electromagnets, and/or other magnet system components (not shown). also, upper assembly 220 can comprise supply lines, injection devices, mass flow controllers, and/or other gas supply system components (not shown). furthermore, upper assembly 220 can comprise a housing, a cover, sealing devices, and/or other mechanical components (not shown). in an alternate embodiment, processing chamber 210 can comprise a monitoring port (not shown). a monitoring port can, for example, permit optical monitoring of process space 215 . material processing system 200 also comprises at least one source for providing at least two rf signals. as shown in the illustrated embodiment, test signal source 290 can be used to generate and transmit at least two rf signals. for example, test signal source 290 can comprise an antenna coupled to the process chamber for transmitting at least rf signals into the process space. in one embodiment, the two rf signals can be at different frequencies. alternately, the two rf signals can be at the same frequency. for example, the two rf signals can range from 10 mhz to 1500 mhz. material processing system 200 also comprises at least one filter/detector device for receiving and processing rf signals generated by plasma in the process space 215 . in one embodiment, filter/detector 280 can comprise one or more narrow-band rf-filters (not shown) and associated diode detectors (not shown). filter/detector 280 can be coupled to controller 270 , and can exchange data with the controller. filter/detector 280 can operate using a single frequency band or multiple frequency bands, and filter/detector 280 can operate using one or more center frequencies. material processing system 200 also comprises a controller 270 . controller 270 can be coupled to chamber 210 , upper assembly 220 , substrate holder 230 , rf system 250 , pumping system 260 , filter/detector 280 , and test signal source 290 . the controller can be configured to provide control data to the filter/detector 280 and test signal source 290 , and receive data such as process data from the filter/detector 280 and test signal source 290 . for example, controller 270 can comprise a microprocessor, a memory (e.g., volatile and/or non-volatile memory), and a digital i/o port capable of generating control voltages sufficient to communicate and activate inputs to the processing system 200 as well as monitor outputs from the processing system 200 . moreover, the controller 270 can exchange information with chamber 210 , upper assembly 220 , substrate holder 230 , rf system 250 , pumping system 260 , filter/detector 280 , and test signal source 290 . also, a program stored in the memory can be utilized to control the aforementioned components of a material processing system 200 according to a process recipe. in addition, controller 270 can be configured to analyze the process data, including plasma ignition data, to compare process data such as plasma ignition data with target process data, and to use the comparison to change a process and/or control the processing tool. also, the controller can be configured to analyze plasma ignition data, to compare the plasma ignition data with historical plasma ignition data, and to use the comparison to predict, prevent, and/or declare a fault. for example, the plasma ignition data can comprise inter-modulation product data. fig. 3 illustrates a simplified block diagram of another material processing system in accordance with an embodiment of the present invention. for example, material processing system 300 can comprise an etch system, such as a plasma etcher. alternately, material processing system 300 can comprise a photoresist coating system such as a photoresist spin coating system, and/or material processing system 300 can comprise a photoresist patterning system such as a lithography system. in another embodiment, material processing system 300 can comprise a dielectric coating system such as a spin-on-glass (sog) or spin-on-dielectric (sod) system. in another embodiment, material processing system 300 can comprise a deposition chamber such as a chemical vapor deposition (cvd) system, a physical vapor deposition (pvd) system, an atomic layer deposition (ald) system, and/or combinations thereof. in an additional embodiment, material processing system 300 can comprise a thermal processing system such as a rapid thermal processing (rtp) system. in another embodiment, material processing system 300 can comprises a batch diffusion furnace or other semiconductor processing system. in the illustrated embodiment, material processing system 300 comprises processing chamber 310 , upper assembly 320 , substrate holder 330 for supporting substrate 335 , pumping system 360 , and controller 370 . for example, pumping system 360 can provide a controlled pressure in processing chamber 310 . for example, processing chamber 310 can facilitate the formation of a processing gas in a process space 315 adjacent substrate 335 . the material processing system 300 can be configured to process 200 mm substrates, 300 mm substrates, or larger substrates. alternately, the material processing system can operate by generating plasma in one or more processing chambers. substrate 335 can be, for example, transferred into and out of processing chamber 310 through a slot valve (not shown) and chamber feed-through (not shown) via robotic substrate transfer system where it can be received by substrate lift pins (not shown) housed within substrate holder 330 and mechanically translated by devices housed therein. once substrate 335 is received from substrate transfer system, it can be lowered to an upper surface of substrate holder 330 . substrate 335 can be, for example, affixed to the substrate holder 330 via an electrostatic clamping system. furthermore, substrate holder 330 can further include a cooling system including a re-circulating coolant flow that receives heat from substrate holder 330 and transfers heat to a heat exchanger system (not shown), or when heating, transfers heat from the heat exchanger system. moreover, gas can, for example, be delivered to the backside of substrate 335 via a backside gas system to improve the gas-gap thermal conductance between substrate 335 and substrate holder 330 . such a system can be utilized when temperature control of the substrate is required at elevated or reduced temperatures. in other embodiments, heating elements, such as resistive heating elements, or thermoelectric heaters/coolers can be included. in alternate embodiments, substrate holder 330 can, for example, further comprise a vertical translation device (not shown) that can be surrounded by a bellows (not shown) coupled to the substrate holder 330 and the processing chamber 310 , and configured to seal the vertical translation device from the reduced pressure atmosphere in processing chamber 310 . additionally, a bellows shield (not shown) can, for example, be coupled to the substrate holder 330 and configured to protect the bellows. substrate holder 330 can, for example, further provide a focus ring (not shown), a shield ring (not shown), and a baffle plate (not shown). in the illustrated embodiment, shown in fig. 3 , substrate holder 330 can comprise an electrode 332 through which rf power can be coupled to the processing plasma in process space 315 . for example, substrate holder 330 can be electrically biased at an rf voltage via the transmission of rf power from rf system 350 through rf subsystem 355 . a typical frequency for the rf bias can range from 1 mhz to 100 mhz. for example, semiconductor processing systems that use 13.56 mhz for plasma processing are well known to those skilled in the art. as shown in fig. 3 , upper assembly 320 can be coupled to the processing chamber 310 and configured to perform at least one of the following functions: provide a gas injection system, provide a capacitively coupled plasma (ccp) source, provide an inductively coupled plasma (icp) source, provide a transformer-coupled plasma (tcp) source, provide a microwave powered plasma source, provide an electron cyclotron resonance (ecr) plasma source, provide a helicon wave plasma source, provide a surface wave plasma source, and provide a deposition source. in alternate embodiments, upper assembly 320 can comprise an electrode, an insulator ring, an antenna, a transmission line, and/or other rf components (not shown). in addition, upper assembly 320 can comprise permanent magnets, electromagnets, and/or other magnet system components (not shown). also, upper assembly 320 can comprise supply lines, injection devices, mass flow controllers, and/or other gas supply system components (not shown). furthermore, upper assembly 320 can comprise a housing, a cover, sealing devices, and/or other mechanical components (not shown). in an alternate embodiment, processing chamber 310 can comprise a monitoring port (not shown). a monitoring port can, for example, permit optical monitoring of process space 315 . material processing system 300 also comprises at least one source for providing at least two test rf signals. as shown in the illustrated embodiment, test source 390 can be used to generate and transmit at least two rf signals. these two rf signals can be combined with the rf system bias signal in rf subsystem 355 and transmitted into the chamber using the electrode 332 . in one embodiment, the two rf signals can be at different frequencies. alternately, the two rf signals can be at the same frequency. for example, the two rf signals can range from 10 mhz to 1500 mhz. material processing system 300 also comprises at least one filter/detector device for receiving and processing rf signals generated by plasma in the process space 315 . in one embodiment, filter/detector 380 can comprise a narrow-band rf-filter (not shown) and a diode detector (not shown). filter/detector 380 can be coupled to controller 370 , and can exchange data with the controller. filter/detector 380 can operate using a single frequency band or multiple frequency bands, and filter/detector 380 can operate using one or more center frequencies. material processing system 300 also comprises a controller 370 . controller 370 can be coupled to chamber 310 , upper assembly 320 , substrate holder 330 , rf system 350 , pumping system 360 , filter/detector 380 , and test signal source 390 . the controller can be configured to provide control data to the filter/detector 380 and test signal source 390 , and receive data such as process data from the filter/detector 380 and test signal source 390 . for example, controller 370 can comprise a microprocessor, a memory (e.g., volatile and/or non-volatile memory), and a digital i/o port capable of generating control voltages sufficient to communicate and activate inputs to the processing system 300 as well as monitor outputs from the processing system 300 . moreover, the controller 370 can exchange information with chamber 310 , upper assembly 320 , substrate holder 330 , rf system 350 , pumping system 360 , filter/detector 380 , and test signal source 390 . also, a program stored in the memory can be utilized to control the aforementioned components of a material processing system 300 according to a process recipe. in addition, controller 370 can be configured to analyze the process data, including plasma ignition data, to compare process data such as plasma ignition data with target process data, and to use the comparison to change a process and/or control the processing tool. also, the controller can be configured to analyze plasma ignition data, to compare the plasma ignition data with historical plasma ignition data, and to use the comparison to predict, prevent, and/or declare a fault. for example, the plasma ignition data can comprise inter-modulation product data. fig. 4 illustrates a simplified block diagram of another material processing system in accordance with an embodiment of the present invention. for example, material processing system 400 can comprise a deposition system, such as a chemical vapor deposition (cvd) system, a physical vapor deposition (pvd) system, an atomic layer deposition (ald) system, and/or combinations thereof. alternately, material processing system 400 can comprise a photoresist coating system such as a photoresist spin coating system, and/or material processing system 400 can comprise a photoresist patterning system such as a lithography system. in another embodiment, material processing system 400 can comprise a dielectric coating system such as a spin-on-glass (sog) or spin-on-dielectric (sod) system. in another embodiment, material processing system 400 can comprise an etching chamber. in an additional embodiment, material processing system 400 can comprise a thermal processing system such as a rapid thermal processing (rtp) system. in another embodiment, material processing system 400 can comprises a batch diffusion furnace or other semiconductor processing system. in the illustrated embodiment, material processing system 400 comprises processing chamber 410 , upper assembly 420 , substrate holder 430 for supporting substrate 435 , pumping system 460 , and controller 470 . for example, pumping system 460 can provide a controlled pressure in processing chamber 410 . for example, processing chamber 410 can facilitate the formation of a processing gas in a process space 415 adjacent to substrate 435 . the material processing system 400 can be configured to process 2400 mm substrates, 300 mm substrates, or larger substrates. alternately, the material processing system can operate by generating plasma in one or more processing chambers. substrate 435 can be, for example, transferred into and out of processing chamber 410 through a slot valve (not shown) and chamber feed-through (not shown) via robotic substrate transfer system where it can be received by substrate lift pins (not shown) housed within substrate holder 430 and mechanically translated by devices housed therein. once substrate 435 is received from substrate transfer system, it can be lowered to an upper surface of substrate holder 430 . substrate 435 can be, for example, affixed to the substrate holder 430 via an electrostatic clamping system. furthermore, substrate holder 430 can further include a cooling system including a re-circulating coolant flow that receives heat from substrate holder 430 and transfers heat to a heat exchanger system (not shown), or when heating, transfers heat from the heat exchanger system. moreover, gas can, for example, be delivered to the backside of substrate 435 via a backside gas system to improve the gas-gap thermal conductance between substrate 435 and substrate holder 430 . such a system can be utilized when temperature control of the substrate is required at elevated or reduced temperatures. in other embodiments, heating elements, such as resistive heating elements, or thermoelectric heaters/coolers can be included. in alternate embodiments, substrate holder 430 can, for example, further comprise a vertical translation device (not shown) that can be surrounded by a bellows (not shown) coupled to the substrate holder 430 and the processing chamber 410 , and configured to seal the vertical translation device from the reduced pressure atmosphere in processing chamber 410 . additionally, a bellows shield (not shown) can, for example, be coupled to the substrate holder 430 and configured to protect the bellows. substrate holder 430 can, for example, further provide a focus ring (not shown), a shield ring (not shown), and a baffle plate (not shown). in the illustrated embodiment, shown in fig. 4 , upper assembly 430 can comprise a means through which power can be coupled to the processing plasma in process space 415 . for example, one or more components in upper assembly 430 can be electrically biased at an rf voltage via the transmission of rf power from rf system 450 through rf subsystem 455 . a typical frequency for the rf bias can range from 1 mhz to 100 mhz. for example, semiconductor processing systems that use 13.56 mhz for plasma processing are well known to those skilled in the art. as shown in fig. 4 , upper assembly 420 can be coupled to the processing chamber 410 and configured to perform at least one of the following functions: provide a gas injection system, provide a capacitively coupled plasma (ccp) source, provide an inductively coupled plasma (icp) source, provide a transformer-coupled plasma (tcp) source, provide a microwave powered plasma source, provide an electron cyclotron resonance (ecr) plasma source, provide a helicon wave plasma source, provide a surface wave plasma source, and provide a deposition source. in alternate embodiments, upper assembly 420 can comprise an electrode, an insulator ring, an antenna, a transmission line, and/or other rf components (not shown). in addition, upper assembly 420 can comprise permanent magnets, electromagnets, and/or other magnet system components (not shown). also, upper assembly 420 can comprise supply lines, injection devices, mass flow controllers, and/or other gas supply system components (not shown). furthermore, upper assembly 420 can comprise a housing, a cover, sealing devices, and/or other mechanical components (not shown). in an alternate embodiment, processing chamber 410 can comprise a monitoring port (not shown). a monitoring port can, for example, permit optical monitoring of process space 415 . material processing system 400 also comprises at least one source for providing at least two rf signals. as shown in the illustrated embodiment, test signal source 490 can be used to generate and transmit at least two rf signals. these two rf signals can be combined with the rf system bias signal in rf subsystem 355 and transmitted into the chamber. in one embodiment, the two rf signals can be at different frequencies. alternately, the two rf signals can be at the same frequency. for example, the two rf signals can range from 10 mhz to 1500 mhz. material processing system 400 also comprises at least one filter/detector device for receiving and processing rf signals generated by plasma in the process space 455 . in one embodiment, filter/detector 480 can comprise at least one narrow-band rf-filter (not shown) and associated diode detector(s) (not shown). filter/detector 480 can be coupled to controller 470 , and can exchange data with the controller. filter/detector 480 can operate using a single frequency band or multiple frequency bands, and filter/detector 480 can operate using one or more center frequencies. material processing system 400 also comprises a controller 470 . controller 470 can be coupled to chamber 410 , upper assembly 420 , substrate holder 430 , rf system 450 , pumping system 460 , filter/detector 480 , and test signal source 490 . the controller can be configured to provide control data to the filter/detector 480 and test signal source 490 , and receive data such as process data from the filter/detector 480 and test signal source 490 . for example, controller 470 can comprise a microprocessor, a memory (e.g., volatile and/or non-volatile memory), and a digital i/o port capable of generating control voltages sufficient to communicate and activate inputs to the processing system 400 as well as monitor outputs from the processing system 400 . moreover, the controller 470 can exchange information with chamber 410 , upper assembly 420 , substrate holder 430 , rf system 450 , pumping system 460 , filter/detector 480 , and test signal source 490 . also, a program stored in the memory can be utilized to control the aforementioned components of a material processing system 400 according to a process recipe. in addition, controller 470 can be configured to analyze the process data, including plasma ignition data, to compare process data such as plasma ignition data with target process data, and to use the comparison to change a process and/or control the processing tool. also, the controller can be configured to analyze plasma ignition data, to compare the plasma ignition data with historical plasma ignition data, and to use the comparison to predict, prevent, and/or declare a fault. for example, the plasma ignition data can comprise inter-modulation product data. fig. 5 shows a simplified block diagram of a test signal source in accordance with an embodiment of the present invention. in the illustrated embodiment, test signal source 500 comprises first source 510 , second source 520 , summing circuit 530 , isolation amplifier 540 , and antenna 550 . first source 510 can comprise a sine wave oscillator operating at a single frequency. second source 520 can also comprise a sine wave oscillator operating at a single frequency. summing circuit 530 can combine the signal from the first source 510 and the signal from the second source 520 and provide the two signals to the isolation amplifier 540 . isolation amplifier 540 amplifies the two signals and antenna 550 is used to transmit the two signals. for example, antenna can be coupled to a processing chamber and can be used to transmit the two signals into the processing chamber. in an alternate embodiment, the test signal source does not comprise an antenna and the isolation amplifier is coupled to an rf subsystem ( 355 figs. 3 and 455 fig. 4 ). the first source 510 and the second source 520 comprise control signals for turning the sources off and/or on. the first source 510 and the second source 520 can operate using one or more rf frequencies in the range from 10.0 mhz to 200.0 mhz. alternately, test source 500 can further comprise at least one of a power source, receiver, transmitter, controller, timer, memory, and a housing. test source 500 can be configured to generate the two signals for long periods of time or for short periods of time. for example, the two signals can be generated during a startup period or during one or more periods during the process. fig. 6 shows a simplified block diagram of a filter/detector in accordance with an embodiment of the present invention. in the illustrated embodiment, filter/detector 600 comprises antenna 610 , filter 620 , and detector 630 . antenna 610 can comprise a narrowband antenna coupled to the processing chamber and configured to receive signals generated with the process space. for example, antenna 610 can be configured to receive inter-modulation products generated by the non-linear impedance produced when plasma is created in the process chamber. filter 620 can be a narrowband filter that is coupled between antenna 610 and detector 630 . for example, filter 620 can be configured to pass signals in a narrow frequency range from the antenna to the detector. in an alternate embodiment, filter/detector 600 can comprise a power source that can include at least one of an rf-to-dc converter, a dc-to-dc converter, and a battery. for example, rf-to-dc converter can comprise at least one of an antenna, diode, and filter. in one case, an rf-to-dc converter can convert at least one process related frequency into a dc signal. in another case, an rf-to-dc converter can convert at least one non-process related frequency into a dc signal. for instance, an external signal can be provided to the converter. alternately, an rf-to-dc converter can convert at least one plasma related frequency into a dc signal. in other embodiments, filter/detector 600 can comprise at least one of a signal source, down converter, demodulator, decoder, controller, memory (e.g., volatile or non-volatile), and converters. for example, the filter/detector 600 can be used to receive and process narrowband and wideband signals including am signals, fm signals, and/or pm signals. in addition, the filter/detector 600 can also receive and process coded signals and/or spread spectrum signals to increase its performance within a high interference environment such as a semiconductor processing facility. in one example, the test signal source can be configured to provide two rf signals, a first signal at 120 mhz and a second signal at 106.250 mhz. a filter with a passband ranging from 824 mhz to 849 mhz can be used. for example, a filter from the cellular phone industry can be used. in this case, a seventh order intermodulation product (6120+1106.25=826.3) can be generated by the plasma and used as a plasma ignition signal. in another example, the test signal source can be configured to provide two rf signals at 106.250 mhz. a filter with a passband ranging from 525 mhz to 535 mhz can be used. for example, a low cost helical filter from toko electronics co. (tk5416-nd) can be used. in this case, a fifth order intermodulation product (4106.25+1106.25=531.5) can be generated by the plasma and used as a plasma ignition signal. in another example, the test signal source can be configured to provide two rf signals: one at 120 mhz and one at 121 mhz. a filter with a passband ranging from 824 mhz to 849 mhz can be used. for example, a filter from the cellular phone industry can be used. in this case, a seventh order intermodulation product (6120+1121=841) can be generated by the plasma and used as a plasma ignition signal. fig. 7 illustrates a method for monitoring a material processing system according to an embodiment of the present invention. procedure 700 begins in 710 . in 720 , at least two rf test signals (f 1 and f 2 ) can be provided. rf test signals can be provided using a number of different techniques to insert the test signals into a process chamber. for example, rf test signals can be inserted using one or more antennas coupled to the process chamber, or rf test signals can be inserted along with the rf bias signal using at least one of an upper assembly component, and a substrate holder component. in 730 , a filter/detector can be provided. a filter/detector can be provided in a number of different locations in a processing system. for example, a filter/detector can be coupled to at least one of a process chamber component, an upper assembly component, and substrate holder component. alternately, a filter/detector can be coupled to a monitoring port or another input port. in 740 , plasma can be created and intermodulation products are generated that are related to the two rf test signals. for example, intermodulation products can be generated according to the following (nf 1 +/−mf 2 ). in 750 , at least one intermodulation product can be detected to determine when plasma has been generated. for example, a 5 th order or a 7 th order intermodulation product can be detected. in 760 , a query can be performed to determine if a plasma has been created and the process can continue. procedure 700 ends in 770 . although only certain exemplary embodiments of this invention have been described in detail above, those skilled in the art will readily appreciate that many modifications are possible in the exemplary embodiments without materially departing from the novel teachings and advantages of this invention. accordingly, all such modifications are intended to be included within the scope of this invention.
191-912-397-297-613	JP	[ "EP", "DE", "KR", "JP" ]	C09D5/03,C09D7/12,C09D133/06,C09D163/00,C09D167/00	1986-06-12T00:00:00	1986	[ "C09" ]	coating powder	coating powder containing 0.1 to 30% by weight of the total solid of crosslinked polymer particles, which is stable, hardly producing blocking during the storage thereof, and capable of resulting a coating with excellent appearance.	coating powder consisting essentially of (a) a binder resin selected from the group consisting of acrylic resin, polyester resin and epoxy resin, which is solid at room temperature and is excellent in fluidity and film-forming properties in a molten state, (b) a hardener for the binder resin, (c) crosslinked polymer particles composed of polymer selected from the group consisting of acrylic resin, epoxy resin, polyester resin and melamine resin, which particles are insoluble in an organic solvent and cannot be fused at the baking temperature and whose mean grain diameter is in the range of 0.01 to 10µ, the crosslinking degree being such that the thermal fluidity expressed in terms of flow distance is 0 to 5mm as determined by a test in which 1g of said polymer particles are pressed under 10t/cm² pressure to form a pellet with a diameter of 2cm, the thus formed pellet is fixed on a polished steel plate with double faced tape, the plate is held at an inclination of 45° and heated at 150°c for 15 minutes and the flow distance of said pellet on the plate surface is measured, and (d) other optional additives as pigments, leveling agent, uv absorber and anti-oxidant, the said crosslinked polymer particles (c) being 0.1 to 30% by weight of the total solid of said powder. the powder according to claim 1, wherein the acrylic resin particles are obtained by an emulsion polymerization of αβ-ethylenically unsaturated monomer(s) and crosslinking monomer with the help of emulsifier. the powder according to claim 2, wherein the emulsifier is a compound containing an amphoteric ionizable group. the powder according to any of claims 1 to 3, wherein the amount of said crosslinked polymer particles is 0.1 to 10 % by weight of the total solid of said powder. the powder according to claim 4, wherein the amount of said crosslinked polymer particles is 0.1 to 5% by weight of the total solid of said powder. the powder according to any of claims 1 to 5, wherein the binder resin is a glycidyl group containing acrylic resin and the hardener is a dicarboxylic acid. the powder according to any of claims 1 to 5, wherein the binder resin is a hydroxyl group containing polyester resin and the hardener is a blocked polyisocyanate compound. the powder according to any of claims 1 to 5, wherein the binder resin is a glycidyl group containing acrylic resin and the hardener is a carboxyl group containing polyester resin. the powder according to any of claims 1 to 5, wherein the binder resin is a carboxyl group containing polyester resin and the hardener is an epoxy resin. the powder according to any of claims 1 to 5, wherein the binder resin is an epoxy resin and the hardener is a dicyandiamide. the powder according to any of claims 1 to 5, wherein the binder resin is a carboxyl group containing polyester resin and the hardener is a triglycidyl isocyanurate. the powder according to any of claims 1 to 5, wherein the binder resin is glycidyl group containing acrylic resin and the hardener is a combination of carboxyl group containing polyester resin and blocked polyisocyanate.	the present invention relates to a coating powder and more specifically, it concerns a coating powder which is excellent in blocking resistance and capable of resulting a coating with improved weather resistance, hardness and other coating properties, as well as excellent appearance. coating powder containing no or substantially no volatile components have been widely used for the coating of metallic materials in an automobile, an electric appliance and other industries. however, the coating is, in general, not so good in appearance as compared with those of solvent type coating compositions. in order to improve the said coating appearance at least to the same level as obtained with a solvent type coating composition, it is believed that a higher degree of thermal flowability should be given to the coating powder by using, for example, a comparatively low molecular weight polymer or a low tg polymer as a binder resin or by adding a plasticizer to the coating powder. in those cases, an additional problem is always encountered such that the coating powder is liable to become solid during storage thereof, resulting the so-called blocking, and in extreme case, thus solidified material can hardly be re-pulverized and used as a coating powder. thus, in a coating powder, the requirements of having improved appearance and improved blocking resistance are contrary to each other and actual use of such coating powder has been markedly limited on that account. attempts have been made to prevent or decrease the occurence of undesired blocking by the addition of inorganic microparticles such as colloidal silica, siloxane and the like with a coating powder. however, since an excess amount of such additive may cause the loss in gloss of the coating and often exert harmful influence on the film properties such as water resistance and the like, the employable amount of such additive is practically limited to at most 0.1% by weight of the total solid, which is quite insufficient for the intended blocking resistance. fr-a-2245744 provides a coating powder, comprising a binder resin, an acrylate polymer powder, a hardener and other additives. under the circumstances, there has long been desired a coating powder which, without relying on inorganic microparticles, is free from blocking during storage, has an improved thermal flowability and capable of resulting a coating with excellent appearance which is comparable with those of conventional solvent type coating compositions. the principal object of the invention is therefore to provide such coating powder. a further object of this invention is to provide a coating powder which can be applied in a thicker coating without the fear of sagging but still result a coating with improved weather resistance, hardness and other desirable properties, as well as excellent coating appearance and blocking resistance. the present invention provides a coating powder consisting essentially of (a) a binder resin selected from the group consisting of acrylic resin, polyester resin and epoxy resin, which is solid at room temperature and is excellent in fluidity and film-forming properties in a molten state, (b) a hardener for the binder resin, (c) crosslinked polymer particles composed of polymer selected from the group consisting of acrylic resin, epoxy resin, polyester resin and melamine resin, which particles are insoluble in an organic solvent and cannot be fused at the baking temperature and whose mean grain diameter is in the range of 0.01 to 10µ, the crosslinking degree being such that the thermal fluidity expressed in terms of flow distance is 0 to 5mm as determined by a test in which 1g of said polymer particles are pressed under 10t/cm² pressure to form a pellet with a diameter of 2cm, the thus formed pellet is fixed on a polished steel plate with double faced tape, the plate is held at an inclination of 45° and heated at 150°c for 15 minutes and the flow distance of said pellet on the plate surface is measured, and (d) other optional additives as pigments, levelling agent, uv absorber and anti-oxidant; the said crosslinked polymer particles (c) being 0.1 to 30% by weight of the total solid of said powder. the present invention has been made on the basis of the finding that when the crosslinked polymer particles hereinunder mentioned are added as a constituting component of coating powder, the aforesaid objects of the invention can be fully attained therewith. the crosslinked polymer particles used in the invention are three-dimensionally crosslinked. any of the known polymer materials for coating use may be satisfactorily used, providing they are three-dimensionally crosslinked. the crosslinked acrylic resin particles may be prepared by emulsion-polymerizing a mixture of ethylenically unsaturated comonomers including at least one crosslinking comonomer in an aqueous medium by a conventional method, and then removing water from the emulsion by, for example, solvent substitution, centrifugation, filtering or drying. any known emulsifier and/or dispersing agent may be used in the emulsion polymerization. an amphoteric ionizable group containing emulsifier is particularly preferable, since the crosslinked acrylic resin particles with a uniform particle size distribution may be easily obtained therewith. examples of ethylenically unsaturated comonomers used for the production of the crosslinked acrylic resin particles include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethyl hexyl (meth) acrylate, styrene, α-methyl styrene, vinyl toluene, t-butyl styrene, ethylene, propylene, vinyl acetate, vinyl propionate, acrylonitrile, methacrylonitrile, dimethylaminoethyl (meth) acrylate and the like. two or more comonomers may be combined. crosslinking comonomers include a monomer having at least two ethylenically unsaturated bonds in the molecule and the combination of two different monomers having mutually reactive groups. monomers having at least two polymerization sites may typically be represented by esters of a polyhydric alcohol with an ethylenically unsaturated monocarboxylic acid, esters of an ethylenically unsaturated monoalcohol with a polycarboxylic acid and aromatic compounds having at least two vinyl substituents. specific examples thereof include ethylene glycol diacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 1,4-butanediol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetracrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, glycerol diacrylate, glycerol allyloxy dimethacrylate, 1,1,1-tris (hydroxy methyl) ethane diacrylate, 1,1,1-tris (hydroxymethyl) ethane triacrylate, 1,1,1-tris (hydroxymethyl) ethane dimethacrylate, 1,1,1-tris (hydroxymethyl) ethane trimethacrylate, 1,1,1-tris (hydroxymethyl) propane diacrylate, 1,1,1-tris (hydroxymethyl) propane triacrylate, 1,1,1-tris (hydroxymethyl) propane dimethacrylate, 1,1,1-tris(hydroxymethyl) propane trimethacrylate, triallyl cyanurate, triallyl isocyanurate, triallyl tirmellitate, diallyl phthalate, diallyl terephthalate and divinyl benzene. combinations of two monomers having mutually reactive groups may be used in place of, or in addition to monomers having two or more polymerization sites. for example, monomers having a glycidyl group such as glycidyl acrylate or methacrylate may be combined with carboxyl group-containing monomers such as acrylic, methacrylic or crotonic acid. also, hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, allyl alcohol or methallyl alcohol may be combined with isocyanate group-containing monomers such as vinyl isocyanate or isopropenyl isocyanate. other combinations will be apparent to those skilled in the art. monomer mixtures forming the crosslinked acrylic resin particles may contain monomers having a functional group which may react with the crosslinking agent. examples of such monomers include acrylic acid, methacrylic acid, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, allyl alcohol, methallyl alcohol, acrylamide, methacrylamide and the like. the crosslinked acrylic resin particles may be of uniform structure or multilayer structure. crosslinked epoxy resin particles may be obtained by first preparing an epoxy resin in a conventional way as, for example, by a solution polymerization and the like, effecting a crosslinking reaction in the post emulsification step and removing an aqueous medium from the reaction system. since the preparation procedures per se are well known in the art, the details are omitted herein. the base coating powder to which the aforesaid crosslinked polymer particles are added in this invention are conventional ones comprising (a) a binder resin, (b) a hardener and (d) other optional additives as pigments, levelling agent, uv absorber, anti-oxidant and the like. the binder resins should preferably have such reactive groups as glycidyl, carboxyl, hydroxyl group and the like or other groups capable of producing such groups at an elevated temperature. as the hardener, any of the compounds or resins having two or more groups which are reactive with the aforesaid reactive groups of the binder resin may be satisfactorily used. thus, the binder resin and the hardener are properly selected to react with each other at a fixing stage under heated conditions. examples of such combinations are as follows. when glycidyl group containing binder resin is used, the hardener is selected from a dicarboxyl acid, a diamine, a carboxyl group containing resin and the like; when using hydroxyl group containing binder resin, the hardener is selected from a melamine resin, a blocked polyisocyanate compound and the like; and when using carboxyl group containing binder resin, the hardener is selected from a polyglycidyl compound, a glycidyl group containing resin and the like. it is, of course, possible to use more than one binder resins and/or hardeners as desired. in this invention, the aforesaid crosslinked polymer particles are added to the base coating powder at an appropriate stage in the preparation of said powder. for example, when the coating powder is prepared by a dry method wherein the solid binder resin, hardener and other additives are mixed and milled in a kneader to give pellets, which are then pulverized and sieved, the aforesaid crosslinked polymer particles may be added to the coating powder at any stage of said mixing and milling, pulverizing and shieving steps. when the coating powder is prepared by a wet process comprising dissolving or dispersing a solid binder resin, hardener, and other additives in an appropriate solvent and spray-drying the same, the aforesaid crosslinked polymer particles may be advantageously dispersed in said spray-drying solution or dispersion to obtain the present coating powder. at the time when a self-curing type binder resin is selected, the hardener may be dispensed with as might be well understood. the most characteristic features of the invention reside in the point that a flowable resin and crosslinked polymer particles having no or substantially no fluidity at an elevated temperature are combined together, thereby attaining the objects of improved coating appearance and improved blocking resistance liable to occure with the use of said flowable resin in a coating composition. thus, in the present invention, both of the conflicting natures of coating appearance and blocking resistance are well balanced by the combination of fluidity characteristics of said binder resin and of crosslinked polymer particles. if the crosslinked polymer particles have no fluidity, the binder resin may be safely selected from a wider range of resins including ones having good fluidity, which have not been used in a coating powder area from the fear of undesirable sagging. there is of course a certain degree of allowable range in the fluidity of crosslinked polymer particles from the standview of blocking resistance of coating powder capable of resulting a coating with excellent apperance. with respect to said fluidity nature of crosslinked polymer particles, the inventors have found that the polymer particles should preferably have the characteristics of 0 to 5 mm flow in the abovementioned thermal fluidity test. the crosslinked polymer particles must have a mean grain diameter of 0.01 to 10 µ. this is because if the mean grain diameter of said polymer particles exceeds over the limit of 10 µ, there is a tendency of chemical seeding in a coating, and if the mean grain diameter is less than 0.01 µ, it is unable to expect the aforesaid effects of the invention. the crosslinked polymer particles should be added to the base coating powder in an amount of 0.1 to 30 % by weight, preferably 0.1 to 10 % and most preferably 0.1 to 5 % by weight, of the total solid. this is because if the amount of said polymer particles is less than 0.1 % by weight, there is no substantial effect in the improvement of blocking resistance, whereas if the amount of said polymer particles exceeds over the limit of 30 % by weight, there is a tendency that coating appearance be lowered. from the standview of coating appearance alone, the most preferable range of said polymer particles is in a range of 0.1 to 5 % by weight of the total solid. the invention shall be now more fully explained in the following examples. unless otherwise being stated, all parts and % are by weight. reference example 1 preparation of amphoteric ionizable group containing polyester resin into a 2 liters flask fitted with a stirrer, a nitrogen gas inlet, a thermoregulator, a condenser and a decanter, were placed 134 parts of bishydroxy ethyl taurine, 130 parts of neopentyl glycol, 236 parts of azelaic acid, 186 parts of phthalic anhydride and 27 parts of xylene and the mixture was heated, while removing the formed water azeotropically with xylene. the temperature was raised to 190°c in about 2 hours from the commencement of reflux, and the reaction was continued, while stirring and continuing dehydration, until the resinous acid value based on carboxyl groups reached 145. the reaction mixture was then allowed to cool to 140°c, dropwise added with 314 parts of cardura e-10® (versatic acid glycidyl ester, trademark of shell co.) in 30 minutes at 140°c and the combined mixture was reacted at the same temperature for 2 hours to obtain an amphoteric ionizable group containing polyester resin, whose acid value was 59 and hydroxyl value was 90. number average molecular weight of the polyester resin was 1054. reference example 2 preparation of crosslinked polymer particles (g-1) into a 1 liter flask fitted with a stirrer, a condenser and a thermoregulator, were placed 282 parts of deionized water, 10 parts of the amphoteric ionizable group containing polyester resin obtained in reference example 1 and 0.75 part of dimethyl ethanol amine and the mixture was heated under stirring to 80 °c to get a clear solution. to this, a solution of 4.5 parts of azobiscyanovaleric acid in a mixture of 45 parts of deionized water and 4.3 parts of dimethyl ethanol amine was added and then a monomer mixture of 70.7 parts of methyl methacrylate, 94.2 parts of n-butyl acrylate, 70.7 parts of styrene, 30 parts of 2-hydroxyethyl acrylate and 4.5 parts of ethylene glycol dimethacrylate was dropwise added in 60 minutes. thereafter, a solution of 1.5 parts of azobiscyanovaleric acid in 15 parts of deionized water and 1.4 parts of dimethyl ethanol amine was added and the combined mixture was reacted at 80°c for 60 mintues to obtain an emulsion having a non-volatile content of 45 %, ph 7.2 and a viscosity of 92 cps (at 25°c). this emulsion was subjected to a spray-drying to obtain crosslinked polymer particles (g-1) having a mean grain diameter of 0.8 µ. ther thermal fluidity test was carried out according to the procedures as stated hereinbefore, and the flow distance (hereinafter merely referred as fluidity) was determined as 1 mm. a part of said emulsion was added with xylene, and the mixture was heated under reduced pressure while removing water azeotropically with xylene to obtain a xylene dispersion (s-1) of crosslinked polymer particles. reference example 3 preparation of crosslinked polymer particles (g-2) into a flask fitted with a stirrer and a thermometer, were placed 200 parts of deionized water, 6 parts of sodium dodecyl benzene sulfonate and 8 parts of polyethylene glycol (molecular weight 4000). to this solution, 60 parts (on solid basis) of butyrated melamine formaldehyde resin were added and dispersed therein so as to give an emulsion having a mean particle size of 0.2 µ. thus obtained emulsion was adjusted to ph 3.8 with 0.5 n-hcl aqueous solution, gradually heated to 80°c and maintained at this temperature for 6 hours to obtain a dispersion of crosslinked polymer particles. the dispersion was then subjected to spray-drying to obtain the crosslinked polymer particles (g-2), whose fluidity was 1 mm. reference example 4 preparation of crosslinked polymer particles (g-3) into a reaction vessel fitted with a stirrer and a thermometer, were placed 60 parts (on solid basis) of epicoat 1001® (epoxy resin, manufactured by shell chem. co.) and 4 parts of dicyandiamide and the mixture was heated at 150°c for 2 hours. at the stage wherein no fluid mass was observed, the content was allowed to cool, pulverized and shieved to obtain crosslinked polymer particles (g-3) having a mean grain diameter of 2 µ. the fluidity was 0 mm in substance. reference example 5 preparation of crosslinked polymer particles (g-4) into a flask fitted with a stirrer and a thermometer, were placed 200 parts of deionized water, 6 parts of sodium dodecyl benzene sulfonate and 4 parts of polyvinyl alcohol. to this, 70 parts of long oil alkyd (prepared by a conventional method from 90 parts of soy bean oil, 28 parts of phthalic anhydride, 17 parts of pentol and 1 part of maleic anhydride) and 2 parts of cobalt naphthenate were added and the mixture was emulsified. the mixture was heated, while introducing air, at 80°c for 8 hours to obtain a dispersion of crosslinked polymer particles. the dispersion was then subjected to spray-drying to obtain the crosslinked polymer particles (g-4), whose fluidity was 4.5 mm. reference example 6 preparation of acrylic resin [i] into a flask fitted with a dropping funnel, a stirrer and a thermometer, were placed 80 parts of xylene and the temperature was raised to 130°c. to this, a solution of 30 parts of glycidyl methacrylate, 10 parts of methyl methacrylate, 30 parts of styrene, 20 parts of n-butyl methacrylate, 10 parts of n-butyl methacrylate and 2 parts of azobisisobutyronitrile was dropwise added at a constant speed in 3 hours. after completion of said addition, the combined mixture was maintained at the same temperature for 30 mintues, added dropwise a solution of 0.5 part of t-butyl peroxy benzoate in 20 parts of xylene in 1 hour. thereafter, the mixture was maintained at 130°c for 2 hours and xylene was removed by a vacuum distillation to obtain an acrylic resin [i]. reference example 7 preparation of acrylic resin solution [ii] into a flask fitted with a dropping funnel, a stirrer and a thermometer, were placed 80 parts of xylene and the temperature was raised to 130°c. to this, a solution of 20 parts of n-n-butoxymethyl acrylamide, 10 parts of 2-hydroxyethyl metahcrylate, 20 parts of methyl methacrylate, 30 parts of styrene, 10 parts of n-butyl methacrylate, 10 parts of n-butyl acrylate and 2 parts of azobisisobutyronitrile was dropwise added from the dropping funnel at a constant speed in 3 hours. after completion of said addition, the mixture was maintained at the same temperature for 30 minutes and then added dropwise with a solution of 0.5 part of t-butyl peroxybenzoate in 20 parts of xylene in 1 hour. thereafter, the combined mixture was maintained at 130°c for 2 hours to obtain an acrylic resin xylene solution [ii]. reference example 8 to a flask as used in reference example 2, were placed 232 parts of deionized water, 10 parts of the polyester resin obtained in reference example 1, and 0.75 part of dimethyl ethanolamine. the mixture was stirred at 80°c to make a solution. to the solution, were added a solution of 10 parts of azobiscyanovaleric acid and 0.26 part of dimethyl ethanolamine in 20 parts of deionized water. then, a monomer mixture consisting of 108 parts of methyl methacrylate and 27 parts of ethylene glycol dimethacrylate was added dropwise over 60 minutes. the mixture was stirred for additional 60 minutes at 80°c. a solution of 0.5 part of azobiscyanovaleric acid and 0.3 part of dimethyl ethanolamine in 25 parts of water was added again to the reaction mixture. then, a monomer mixture consisting of 9.5 parts of styrene, 20 parts of methyl methacrylate, 14 parts of n-butyl acrylate and 6 parts of ethylene glycol dimethacrylate was added dropwise over 60 minutes. a solution of 1.5 parts of azobiscyanovaleric acid and 1.4 parts of dimethyl ethanolamine in 15 parts of deionized water was added and the mixture was stirred for 60 minutes at 80°c. an emulsion having a non-volatile content of 45 %, a ph of 7.2 and a viscosity of 105 cps (25°c) was obtained. upon subjecting to a spray-drying, the crosslinked acrylic resin particles (g-5) having a mean diameter of 1.0 µ were obtained. example 1 100 parts of the acrylic resin [i] obtained in reference example 6, 24 parts of decane dicarboxylic acid, 30 parts of titanium oxide and 1 part of modaflow® (levelling agent, trademark of monsanto chem.), were dry-mixed in a henschel mixer (manufactured by mitsui miike seisakusho). next, the mixture was melt-kneaded in co-kneader pr-46 (manufactured by bus in switzerland) at 100°c and then allowed to cool. the solid mass was pulverized in a hammer mill and shieved with a 150 mesh wire screen. to thus obtained powder, 5 parts of the crosslinked polymer particles (g-1) obtained in reference example 2 were added and mixed well to obtain a coating powder (a). example 2 the same procedures as stated in example 1 were repeated excepting reducing the amount of crosslinked polymer particles (g-1) to 0.2 part, to obtain a coating powder (b). example 3 the same procedures as stated in example 1 were repeated excepting increasing the amount of crosslinked polymer particles (g-1) to 20 parts, to obtain a coating powder (c). comparative example 1 the same procedures as stated in example 1 were repeated and however, the crosslinked polymer particles (g-1) were not added. thus obtained powder was referred to as coating powder (d) hereinunder. comparative example 2 the same procedures as stated in example 1 were repeated excepting increasing the amount of crosslinked polymer particles (g-1) to 35 parts to obtain a coating powder (e). example 4 in a henschel mixer (manufactured by mitsui miike seisakusho), 100 parts of the acrylic resin [i] obtained in reference example 6, 24 parts of decane dicarboxylic acid, 30 parts of titanium oxide, 1 part of modaflow and 10 parts of the crosslinked polymer particles (g-1) were mixed well and the mixture was then melt-kneaded in a co-kneader pr-46 (manufactured by bus in switzerland) at 100°c. thereafter, the mixture was allowed to cool and the solid mass was then pulverized in a hammer mill, and shieved with a 150 mesh wire screen to obtain a coating powder (f). example 5 in a henschel mixer, 100 parts of krelan u-502® (polyester resin, trademark of bayer a.g.), 36 parts of kakenate pw 4403 n® (blocked isocyanate, trademark of takeda yakuhin k.k.), 40 parts of titanium oxide and 1 part of acronal 4f® (levelling agent, trademark of basf) were dry-mixed and the mixture was then melt-kneaded in a co-kneader pr-46 at 100°c. after cooling, the solidified mass was pulverized in a hammer mill and shieved with a 150 mesh wire screen. to thus obtained powder, 3 parts of the crosslinked polymer particles (g-2) obtained in reference example 3 were mixed well to obtain a coating powder (g). comparative example 3 the same procedures as stated in example 5 were repeated and however, the crosslinked polymer particles were not added, to obtain a coating powder (h). example 6 the same procedures as stated in example 4 were repeated excepting substituting the following for the materials shown in example 4. 100 parts of epicoat 1001® (epoxy resin, trademark of shell), 6 parts of dicyandiamide, 40 parts of titanium oxide, 1 part of modaflow® and 10 parts of crosslinked polymer particles (g-3) obtained in reference example 4. the powder thus obtained was referred to as coating powder (i) hereinunder. comparative example 4 the same procedures as stated in example 6 were repeated and however, the crosslinked polymer particles (g-3) were not used, to obtain a coating powder (j). example 7 in a paint shaker, 40 parts of titanium oxide were dispersed in the acrylic resin xylene solution [ii] obtained in reference example 7 (100 parts as solid). then, modaflow® (1 part) and xylene dispersion (s-1) of crosslinked polymer particles (5 parts as solid) were added to obtain a coating composition. this was then subjected to spray-drying to obtain a coating powder (k). example 8 the same procedures as stated in example 6 were repeated excepting substituting the crosslinked polymer particles (g-4) for the crosslinked polymer particles (g-3). thus obtained coating powder was referred to (l) hereinunder. example 9 the same procedures as stated in example 6 were repeated excepting substituting the crosslinked polymer particles (g-5) for the crosslinked polymer particles (g-3). thus obtained coating powder was referred to as m hereinunder. thus obtained coating powders a to m were evaluated as follows. 1) blocking resistance test: the test powder was storred at 40°c for 1 month and thereafter, the flow property of the coating powder was evaluated. excellent ... no substantial change in flow property good ... certain re-pulverizable masses no good ... many un-pulverizable masses 2) coating appearance and properties: the test powder was applied on to a soft steel plate previously treated with a zinc phosphate bath, to a film thickness of 30 to 40µ by an electrostatic coating and the coating was baked at 180°c for 20 minutes. the coating appearance was visually evaluated. pencil hardness test was carried out according to the standard jis method. weather resistance test was conducted by using sunshine weather-o-meter (400 hours illumination). the test results are shown in the following table 1.
193-978-828-704-802	JP	[ "CA", "JP", "US" ]	H04R19/00,H04R19/01,H04R31/00	1971-08-27T00:00:00	1971	[ "H04" ]	method and apparatus for an electret transducer	an improved method for making a backplate assembly for an electret transducer used in a microphone wherein a synthetic resin film such as polytetrafluoroethylene or fluorinated ethylene-propylene copolymer is attached to a plate member having a flat conductive surface and which has been heated so as to securely attach the film thereon and charging said synthetic film to form an electret.	1. in an electret transducer including a backplate having a flat conductive surface and an electret film formed thereon, the improved method of making said backplate comprising the steps of heating said backplate; contacting a synthetic resin film selected from the group consisting of polytetrafluoroethylene and fluorinated ethylenepropylene copolymer with said flat conductive surface of said heated backplate to secure said film thereon, said synthetic resin film having a capability of forming electret, charging said synthetic resin film to form an electret, wherein said backplate has a plurality of holes and a plurality of holes are formed in said film in alignment with said plurality of holes in said backplate and wherein said backplate is heated to the range 280.degree.-400.degree. c, and wherein contacting said resin film to said heated backplate is accomplished such that the film initially contacts a point on said backplate and from said point is progressively brought into contact with areas of said flat conductive surface. 2. in a method according to claim 1, wherein air pressure is used to move said film into contact with said backplate. 3. in an electret transducer including a backplate having a flat conductive surface and an electret film formed thereon, the improved method of making said backplate comprising the steps of heating said backplate member; contacting a synthetic resin film selected from the group consisting of polytetrafluoroethylene and fluorinated ethylene-propylene copolymer with said flat conductive surface of said heated backplate to secure said film thereon, said synthetic resin film having a capability of forming electret, charging said synthetic resin film to form an electret, wherein said backplate has a plurality of holes and a plurality of holes are formed in said film in alignment with said plurality of holes in said backplate and wherein said backplate is heated to the range between 280.degree.-400.degree. c., and wherein said plurality of holes in said film are formed by applying suction to a surface of said backplate away from said film so as to draw the portion of said film covering said plurality of holes into said plurality of holes in said backplate. 4. in a method according to claim 1, wherein said backplate is heated to the range between 300.degree.-400.degree. c. 5. in a method according to claim 1, wherein said backplate is heated to the range between 325.degree.-390.degree. c. 6. in a method according to claim 1, wherein said backplate is heated to about 380.degree. c. 7. in a method according to claim 1, wherein said resin film is preheated before being brought into contact with said heated backplate.	background of the invention 1. field of the invention this invention relates in general to methods of making electret transducers and in particular to a method of making a backplate assembly for an electret transducer. 2. description of the prior art electret transducers have been utilized in microphones and earphones and a common form utilizes a metallized thin plastic diaphragm which is supported in tension adjacent a conductive backplate. the diaphragm has a permanent charge on it so that no external d.c. bias is required for such electret transducers. diaphragms made of polytetrafluoroethylene or fluorinated ethylene-propylene copolymers produce stable electrets, however, the mass of such materials is so large that electret tranducers with such diaphragms have a narrower frequency response than conventional condenser transducers utilizing a diaphragm made of titanium or a metallized diaphragm made of polyethylene terephthalate (t. m. myler). thus good results have been obtained with a conventional diaphragm mounted close to a backplate assembly which has a conductive surface and an electret film attached to the conductive surface. the electret film is secured to the conductive surface by conventional adhesives and the bond between the electret film and conductive surface has been poor in prior art devices. the bonding between the electret film and the conductive surface has been particularly poor after being charged at high temperatures such as 100.degree. c. and after the electret transducers have been used for a period of time. thus, such electret transducers of the prior art have not been used in practice. summary of the invention it is the main object of the present invention to provide a method of constructing an electret transducer which has a wide frequency response. another object of the invention is to provide a method of making an electret transducer which has an electret film firmly secured on a backplate. in the present invention, a synthetic resin film is secured to a backplate to form an electret wherein the resin sheet may be made of polytetrafluoroethylene or fluorinated ethylene-propylene copolymer (teflon fep t.m.) which is then forced down by air pressure against the backplate and slightly heated whereby the sheet is firmly attached to the backplate. the backplate is heated to the temperature range of 280.degree. c.-400.degree. c. and suction is applied to the other side of the backplate so as to form holes in the film in alignment with holes in the backplate and the backplate with the film is subjected to a voltage between 7 k and 10 k volts to cause a corona discharge thus to produce a surface charge density of 10.sup.-.sup.4 q/m.sup.2 and render it as an electret transducer. another method of the invention is heating a metal plate and then apply synthetic resin film as defined above to the plate to bond them together and then punching the plastic and metal plate with a die or punching machine so as to form backplates. other objects, features and advantages of the invention will be readily apparent from the following description of certain embodiments thereof taken in conjunction with the accompanying drawings, although variations and modifications may be effected without departing from the spirit and scope of the novel concepts of the disclosure, and in which: brief description of the drawings fig. 1 is a cut-away sectional view of an electret microphone according to this invention; fig. 2 is an exploded view of the microphone of fig. 1; figs. 3-6 illustrate steps in forming an electret backplate according to the invention; and figs. 7, 8 and 9 illustrate a modified method for forming backplate electrets according to this invention. description of the preferred embodiments fig. 1 is a sectional view of an electret microphone having unidirectional characteristics constructed according to the present invention. the microphone is designated generally by numeral 1 and comprises a cylindrical metal housing 2 which has an end cover 3 in which openings 4 are formed for receiving sound therethrough. a ring 6 is mounted within the housing 2 against the end member 3 and a diaphragm 7 of synthetic resin film which is metallized on one side thereof is connected to the electrically-conductive ring 6 by a conductive adhesive so as to connect the metallized surface of the film 7 with the ring 6 and to the end 3 of the housing 2. the diaphragm 7 may also be made of titanium foil rather than metallized synthetic resin film if desired. a backplate designated generally as 9 is supported within the housing 2 adjacent the diaphragm 7 and might be constructed of metal, as for example aluminum, which consists of a disk plate 11 in which openings 13 are formed. a central electrode 12 extends from the plate 11 on the side opposite the diaphragm 7. an insulating spacer ring 8 is mounted between the diaphragm 7 and an electret film 10 which is attached to the surface of the plate 11 which faces the diaphragm 7. openings are formed in the film 10 in alignment with the opening 13 in the plate 11. a spacer disk 14 of felt comprises a filter and serves as an acoustic resistance and prevents dust from passing into the microphone. an insulating plate 16 made of synthetic resin and formed with a central opening 15 through which the electrode 12 extends fits against the disk 14 within the housing 2. the disk 14 is formed with an annular groove 17 adjacent the disk 14 and in alignment with the openings 13 of the plate 11 so as to provide acoustic capacitance. the disk 16 is also provided with a plurality of openings 18 aligned with the openings 18 to provide acoustic resistance. an insulating ring 19 which might be made of rubber, for example, rests against the lower surface relative to fig. 1 of the disk 16 and an electrode ring 20 of electrical conducting material bears against the ring 19 and is provided with a downwardly extending electrode 21. the lower end relative to fig. 1 of the metal housing 2 is upset as shown by numeral 5 to form the complete assembled unidirectional microphone. it is to be particularly noted that the electrode 21 is connected to the upset portion 5 of the housing 1 which in turn is connected through the ring 6 to the metallized film on the diaphragm 7 and the electrode 12 is integrally formed with the disk 11 and is attached to the electret film 10. the exploded view of fig. 2 provides a clear picture of the various elements of the microphone. it is to be realized that the filter disk 14 in combination with the groove 17 and the holes 18 form an acoustic phase shifter so as to obtain a unidirectional characteristic. figs. 3, 4 and 5 illustrate one method of the invention for attaching the synthetic resin film to the backplate. the backplate 9 is positioned on a plate 22 formed with an opening 23 and with the electrode 12 extending therethrough and is heated to a temperature in the range between 280.degree. c.-400.degree. c. a synthetic resin sheet 24 which might be made of polytetrafluoroethylene or fluorinated ethylene-propylene copolymer (sold under the trademark teflon fep) is heated slightly so as not to cool the disk 11 of the backplate 9 and is then pushed downwardly by an air jet until it contacts the plate 11 initially at the center thereof and progressively outwardly until the sheet 24 covers all surfaces of the backplate 11 and is firmly attached thereto without air bubbles between the film 24 and the backplate 11. it has been discovered that if the temperature of the backplate is in the range between 280.degree. c.-400.degree. c. that very desirable and strong adhesion will result between the plate 11 and the film 24. on the other hand, if the plate 11 is heated to a temperature below 280.degree. c. the adhesion between the film and the backplate is unreliable and an electret transducer with inadequate adhesion results. on the other hand, if the temperature of the backplate 11 is above 400.degree. c. the synthetic resin sheet 24 tends to melt and becomes rough and thus poor frequency response is obtained. tests have been conducted to measure the force required to pull synthetic resin films from backplates wherein the films were attached to backplates having temperatures 280.degree. c., 330.degree. c. and 380.degree. c. the following chart illustrates the tensile force required for films attached to backplates having different temperatures: ______________________________________ temperature tensile force .degree. c. (kg/cm.sup.2) ______________________________________ 380 35.8 330 26.0 280 13.5 ______________________________________ in the pulling test a pulling speed of 50 mm/min. was utilized. the superiority of the bond between the synthetic resin film and the backplate according to the method of this invention is illustrated by that fact that with prior art methods wherein an adhesive is used between the backplate and film a tensile force of only about 5.5 kg/cm.sup.2 is obtained which does not give sufficient strength for use as an electret transducer. at the lowest temperature tested in the method of the invention or at 280.degree. c., tensile force of 13.5 kg/cm.sup.2 was obtained which is more than twice as strong a bond as that obtained by the prior art method of attaching with an adhesive. at a temperature of 380.degree. c., a tensile force of more than six times greater than that of the prior art method of attaching with an adhesive was required to separate the film from the backplate. after the sheet 24 is attached to the heated plate 11, it is cut with a cylindrically-shaped cutting blade 27 which has a knife edge 28, as shown in fig. 4, which severs the edge of the film 24 flush with the edge of the plate 11. then a suction member comprising a hollow cylindrical member 29 is placed against the lower surface of the plate 22 surrounding the opening 23 and a suction line 31 applies suction until openings aligned with the openings 13 are formed in the film 10 due to the suction. the broken edges of the film 10 become attached to the inner surfaces of the holes 13 of the plate 11 because the plate 11 is still heated and a bond will occur. in the next step of the process, the film 10 is subjected to a voltage so as to form electrets. fig. 6 illustrates one method wherein a d.c. voltage from a battery e which might be in the range between 7 k - 10 k volts is applied between a needle electrode 33 and the backplate 11 so as to cause a corona discharge therebetween. the end of the needle electrode 33 might be spaced from the backplate 9-10 mm. the resulting electret film 10 has a charge density of 10.sup.-.sup.4 q/m.sup.2 which is satisfactory for use as an electret transducer. figs. 7, 8 and 9 illustrate another method for forming a backplate with a synthetic resin film attached thereto. in fig. 7 a metal plate 36 is heated to temperature range between 280.degree. c.-400.degree. c. and a synthetic resin sheet 34 of the type utilized in the method of figs. 3-5 is brought into contact with the plate 36 and a bond results due to the temperature of the plate 36. fig. 8 illustrates the bonded sandwich of the sheet 34 with the plate 36. the bonded sandwich is then cut to form backplates 37 by suitable dies to form 37a, 37b, 37c and 37d illustrated in fig. 9. openings 38a, 38b, 38c and 38d are respectively formed in the backplates during the punching or cutting operation. a suitable electrode equivalent to the electrode 12 in the backplate illustrated in fig. 1 may be attached to the members 37 on the side opposite the film 34 to provide a backplate which may be used in a microphone as for example illustrated in fig. 1. the method utilized in fig. 6 may be utilized to form electrets on the film 34. microphones according to the present invention have a very good frequency response and are reliable for long periods of time. although in the foregoing example, the backplate has been stated as being constructed of metal, as for example, aluminum, it is to be realized that the backplate may be constructed of a synthetic resin molded member which is provided with a conductive layer which forms an electrode thereon. although the invention has been described with respect to preferred embodiments, it is not to be so limited as changes and modifications may be made therein which are within the full intended scope as defined by the appended claims.
195-768-302-485-024	SE	[ "US", "SE", "CA", "EP", "WO", "CN" ]	F16M13/02,A47K5/12,A47G29/08,A47G29/093,A47K1/08,A47J47/16	2020-03-02T00:00:00	2020	[ "F16", "A47" ]	lockable receptacle holder	a lockable receptacle holder 10 comprising a holder base portion 20 configured to support the bottom 5 of a receptacle 1 ; a holder upper portion 30 and an elongated holder back portion 40 extending between the holder base portion 20 and the holder upper portion 30 , wherein the holder base portion 20 and the holder upper portion 30 extend laterally from the holder back portion 40 and parallel to each other, and wherein; - the holder upper portion 30 comprises a closed space c configured to at least partially enclose and releasably confine the neck 2 or shoulder 3 of a receptacle placed on the holder base portion 20 , and; - a cap locking member 80 for preventing removal of a cap 9 of a receptacle 1 in the receptacle holder 10 .	1 . a lockable receptacle holder comprising: a holder base portion configured to support a bottom of a receptacle; a holder upper portion; an elongated holder back portion extending between the holder base portion and the holder upper portion; wherein the holder base portion and the holder upper portion extend laterally from the holder back portion and parallel to each other; wherein the holder upper portion inclucles an at least partially closed space configured to at least partially enclose and releasably confine a neck or a shoulder of the receptacle placed on the holder base portion; a cap locking member for preventing removal of a cap of the receptacle in the receptacle holder; wherein the cap locking member has a first cap locking section extending upwards from the holder upper portion and a second cap locking section extending laterally from the first cap locking section over a portion of the space such that the second cap locking section extends over a portion of the cap of the receptacle placed on the holder base portion. 2 . the lockable receptacle holder according to claim 1 , wherein the first cap locking section extends from a position adjacent the space in the holder upper portion. 3 . the lockable receptacle holder according to claim 2 , wherein a section of the holder upper portion extends from the holder back portion to the first cap locking section. 4 . the lockable receptacle holder according to claim 1 , wherein the cap locking memberis of a unitary, one-piece construction formed by bending. 5 . the lockable receptacle holder according to claim 1 , wherein the second cap locking sectioncomprises an arcuate end. 6 . the lockable receptacle holder according to 1 , comprising: a confining member having a hook-shaped front portion and pivotally attached to the holder upper portion such that the confining member is pivotable relative the holder upper portion between a closed position in which the hook-shaped front portion and the holder upper portion form the at least partially closed space for confining the neck and/or the shoulder of the receptacle, and a release position in which the hook-shaped front portion and the holder upper portion are spaced apart to allow removal of the receptacle from the receptacle holder; and a locking member attached to one of the holder upper portion and the confining member, the locking member having a locking portion configured to be received into a first opening of a through hole in the other of the holder upper portion and the confining member when the confining member is in the closed position, thereby preventing movement of the confining member; wherein the locking portion is resilient, such that it is disengageble from the trough hole by application of a force onto the locking portion through a second opening of the through hole, thereby allowing the confining member to pivot relative the holder upper portion. 7 . the lockable receptacle holder according to claim 1 , wherein the holder upper portion comprises an arcuate front portion for receiving a portion of the neck or the shoulder of the receptacle; and wherein the arcuate front portion comprises the first cap locking section . 8 . the receptacle hold according to claim 6 , wherein the hook-shaped front portion of the confining member is rounded to form an at least partially closed circular space with the front end of the holder upper portion. 9 . the receptacle holder according to claim 6 , wherein the through hole is configured to receive an end portion of a tool; and wherein the through hole and the end portion of the tool are configured such that at least the end portion of the tool is passable through the through hole to apply the force onto the locking portion. 10 . the receptacle holder according to claim 9 , wherein the confining member and the locking member and the holder upper portion are superimposed and the through hole and the locking portion and a receiving opening in the confining member are aligned so that the locking portion of the locking member is pushable into the receiving opening by the end portion of the tool that is inserted through the second opening of the through hole. 11 . the receptacle holderaccording to claim 6 , wherein the through holeextends between the first and the second openings. 12 . the receptacle holder according to claim 1 , wherein the cap locking member and the holder upper portion are of a unitary, one-piece construction. 13 . the receptacle holder according to claim 1 , wherein the cap locking member is formed by bending. 14 . the receptacle holder according to claim 1 , wherein a section of the holder upper portion extends from the holder back portion-(40) to the first cap locking section. 15 . the receptacle holder according to claim 5 , wherein the arcuate end extends along a semicircle.	technical field the present disclosure relates to a receptacle holder with a cap locking member. in detail the lockable receptacle holder is intended for a dispensing receptacle for dispensing liquid or creamy hygiene products such as soap, shampoo or lotion. background art for environmental reasons, disposable hygiene products such as soap or shampoo in hotel rooms are increasingly being substituted with large volume dispensers. however, a general problem with refillable containers for hygiene products is that they may be subjected to theft or tampering. to address this problem there are provided holders for hygiene product dispensers with locking mechanisms. one example is us2011/0101196 which shows a holder for a dispensing bottle that is provided with a collar plate that is provided with an opening for receiving the throat of a soap dispenser. the collar plate is guided in two rods that extend from a wall support so that the collar plate may be brought from an inward position in which the collar plate may be locked to an outward position in which the throat of a dispenser bottle may be inserted into the opening of the collar plate. a further holder for a dispenser bottle is shown in se 540307 c2. in this holder the collar plate is attached to the bottle support by screws. replacement of the dispenser bottle requires removal of the screws and is therefore time consuming. a common drawback with the known dispenser holders is that it is possible for a person to remove the cap of a receptacle that is held in the dispenser holder. this makes tampering or fouling of the liquid in the dispenser receptacle possible. thus, it is an object of the present disclosure to provide a receptacle holder which solves at least one of the problems of the prior art. in particular, it is and object of the present disclosure to provide a lockable receptacle holder which provides high resistance to unauthorized access to the content of a receptacle held in the receptacle holder. a further object of the present disclosure is to provide a lockable receptacle holder which may be manufactured at low cost. summary of the invention at least one of these objects are met by a lockable receptacle holder 10 comprising a holder base portion 20 configured to support the bottom 5 of a receptacle 1 ; a holder upper portion 30 and an elongated holder back portion 40 extending between the holder base portion 20 and the holder upper portion 30 , wherein the holder base portion 20 and the holder upper portion 30 extend laterally from the holder back portion 40 and parallel to each other, and wherein; the holder upper portion 30 comprises an at least partially closed space c configured to at least partially enclose and releasably confine the neck or shoulder of a receptacle placed on the holder base portion 20 , characterized in;a cap locking member 80 for preventing removal of a cap 9 of a receptacle 1 in the receptacle holder 100 , wherein the cap locking member 80 has a first cap locking section 81 extending upwards from the holder upper portion 30 and a second cap locking section 82 extending laterally from the first cap locking section 81 over a portion of the space c such that second cap locking section 82 extends over a portion of the cap 9 of a receptacle 1 placed on the holder base portion 20 . the lockable receptacle holder is tamper resistant and allows for secure holding of receptacle. in addition, the cap locking member effectively prevents anyone from removing the cap of a receptacle held in the receptacle holder. in practice, this ensures that unauthorized personnel cannot gain access to the content of the receptacle held in the receptacle holder. the first cap locking section 81 may extend from a position adjacent the space c in holder upper portion 30 . this allows for easy mounting and removal of a receptacle in the receptacle holder. in detail, a section of the holder upper portion 30 may thereby extend from the holder back portion 40 to the first cap locking section 81 . the cap locking member 80 may be an integral piece formed by bending. the receptacle holder thereby comprises few parts and is easy to manufacture. according to an alternative, the second cap locking section 82 comprises an arcuate end 83 which may be configured to receive a tube portion 6.1 of a dispenser that extends into the cap of the receptacle. the advantage thereof is very effective prevention from removal of the cap from the receptacle is achieved. the lockable receptacle holder may comprise a confining member 50 having a hook-shaped front portion 51 and pivotally attached to the holder upper portion 30 so that the confining member 50 may pivot relative the holder upper portion 30 between a closed position a in which the hook-shaped front portion 51 and the holder upper portion 30 forms the at least partially closed space c for confining the neck 2 and/or the shoulder 3 of a receptacle 1 , and a release position b in which the hook-shaped front portion 51 and the holder upper portion 30 are spaced apart to allow removal of a receptacle 1 from the receptacle holder 10 ; a locking member 60 attached to one of the holder upper portion 30 and the confining member 50 and having a locking portion 61 configured to be received into one opening 33 , 34 of a through hole 32 in the other of the holder upper portion 30 and the confining member 50 when the confining member 50 is in the closed position a, thereby preventing movement of the confining member 50 wherein,the locking portion 61 is resilient so that it may be brought out of engagement with the trough hole 32 by application of a force f onto the locking portion 61 through the other opening 33 , 34 of the through hole 32 thereby allowing the confining member 50 to be pivoted relative the holder upper portion 30 . the hook-shaped confining member may easily be unlocked by inserting a purposely dimensioned tool into the through hole to apply a force f unto the locking portion. subsequently the confining member is pivoted to the side thereby allowing house-keeping personnel to easily remove the receptacle for exchange or refilling. removal and replacement of the receptacle is easy, demands no tricky handling of the receptacle and may be performed in little time. the holder upper portion 30 of the he receptacle holder 10 may comprises an arcuate front portion 31 for receiving a portion of a neck 2 or shoulder 3 of a receptacle 1 and wherein the arcuate front portion 31 may comprise the first locking cap section 81 the arcuate front portion provides a secure support for the receptacle during operation of the confining member. preferably, the hook-shaped front portion 51 of the confining member 50 may be rounded to form an at least partially closed circular space c with the front end 31 of the holder upper portion 30 . the through hole 32 may be configured to receive an end portion 8 of a tool 7 wherein the cross-sectional shape of the through hole 32 and the end portion 8 of the tool 7 are configured such that end portion 8 of the tool 7 may pass through the through hole 32 . this provides the possibility to customize the through hole so that the locking portion only may be accessed by special tools. thus, unauthorized opening of the receptacle holder may be prevented or made difficult. the one of the holder upper portion 30 and the confining member 50 to which the locking member 60 is attached may comprise a receiving opening 53 for receiving the locking portion 61 of the locking member 60 when the locking portion 61 is brought out of the through hole 32 . this allows for usage of a flat and thin locking portion, which in turn provides for a compact and tamper resistant receptacle holder. 9 . the locking portion 61 may thereby be elongate, flat and provided with an upright edge 62 to be received in the through hole 32 . for example, the locking portion 61 is a part of a locking member 60 in the form of an integral piece of resilient steel strip. a particularly compact and tamper resistant receptacle holder 10 is provided when the confining member 50 and the locking member 60 and the holder upper portion 30 are superimposed and the through hole 32 and the locking portion 61 and the receiving opening 53 are aligned so that the locking portion 61 of the locking member 60 may be pushed into the receiving opening 53 by an end portion 8 of a tool 7 that is inserted through the other opening 33 , 34 of the through hole 32 . such a receptacle holder may be realized in that the locking member 60 is arranged underneath the holder upper portion 30 and the confining member 50 is arranged underneath the locking member 60 and wherein through hole 32 extends between an upper opening 33 on an upper side 35 and a lower opening 34 on a lower side 36 of the of the holder upper portion 30 . brief description of the drawings figs. 1a-1c : schematic drawings of a receptacle holder according to the present disclosure and a receptacle. fig. 2 : a schematic drawing showing an exploded view of a receptacle holder according to the present disclosure. fig. 2a : a schematic drawing of a portion of the receptacle holder according to an alternative. figs. 3a,3b-5a,5b : schematic drawings illustrating the function of the receptacle holder according to the present disclosure. fig. 6 : a sectional view of a portion of the receptacle holder according to the present disclosure. figs. 7a,7b : schematic drawings showing a second alternative of the lockable receptacle holder according to the present disclosure. figs. : 8a, 8b : schematic drawings showing receptacle holders according to further alternatives of the present disclosure. figs. 9a-9c : schematic drawings showing alternative base portions of the receptacle holder according to the present disclosure. detailed description of embodiments the receptacle holder according to the present disclosure will now be described more fully hereinafter. the receptacle holder according to the present disclosure may however be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. rather, these embodiments are provided by way of example so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those persons skilled in the art. same reference numbers refer to same elements throughout the description. a “receptacle” or “container” is configured to hold liquid, semi-liquid, creamy or paste-formed substances. typically, a receptacle is a bottle or a jar and has a neck, with a mouth, a shoulder, a body and a bottom. the receptacle may comprise a dispenser which is inserted into the mouth of the receptacle. the dispenser allows a user to pump out the content of the receptacle. the receptacle may in such case be denominated “dispenser receptacle”. fig. 1a shows a receptacle 1 in the form of a bottle. the receptacle has a neck 2 , a shoulder 3 , a body 4 , bottom 5 and a cap 9 which closes the opening of the receptacle. the receptacle 1 may further have a dispenser 6 which may have a tube 6.1 that extends into the cap 9 . in the following description of the receptacle holder according to the present disclosure it is appreciated that the receptacle holder may be realized in different sizes and dimensions to fit receptacles of varying shape, size and dimension. thus, when the receptacle holder, in the following is described with reference to a receptacle or parts thereof, it is appreciated that the receptacle holder is dimensioned in view of that receptacle. further in the following description, any references to directions such as “upright”, “upwards”, “downwards” or “lateral” are in relation to a vertical orientation of the receptacle holder in which the holder base is below the holder upper portion. it is further appreciated that the holder base and the holder upper portion may extend orthogonal to the holder back portion. fig. 1a shows the lockable receptacle holder 10 according to the present disclosure. thus, the lockable receptacle holder 10 comprising a holder base portion 20 configured to support the bottom 5 of a receptacle 1 which further comprises a cap 9 , a shoulder 3 and a neck 2 . a holder upper portion 30 and an elongated holder back portion 40 extends respectively between the holder base portion 20 and the holder upper portion 30 . the holder upper portion 30 comprises an at least partially closed space c configured to at least partially enclose and releasably confine the neck or shoulder of the receptacle 1 . i fig. 1a the space c in the holder upper portion 30 encloses and confines the neck 2 of the receptacle 1 . the space c, which may be denominated “opening c” is also shown in fig. 1b . a more detailed description of the above features of the receptacle holder 10 will further be provided in combination with the description of fig. 2 . according to the present disclosure, the holder upper portion 30 comprises a cap locking member 80 for preventing removal of the cap 9 of the receptacle 1 that is held in the receptacle holder 10 . the cap locking member 80 is shown in detail in fig. 1b and comprises a first cap locking section 81 that extends from a position on the holder upper portion 30 that is adjacent the space c. the first cap locking section 81 extends thereby in direction upwards. a second cap locking section 82 extends laterally from the first cap locking section 81 over at least a portion of the space c such that the second cap locking section extends over the top of the cap 9 of the receptacle. the cap 9 is thereby effectively prevented from being removed from the neck 2 of the receptacle 1 . the second cap locking section 82 may thereby extend parallel with the holder upper portion 30 and the first cap locking section 81 may extend traverse to the holder upper portion 30 . as shown in fig. 1b , the cap locking member 80 is an integral piece which may be formed by bending. it may further be formed integral with, or e.g. welded to, the holder upper portion. turning to fig. 1c , which shows a top view of the receptacle holder 10 . thus, the end 83 of the second cap locking section 82 may have arcuate shape so that it partially encloses the tube 6.1 of the dispenser 6 . see also fig. 1a . as is especially clear from fig. 1c , the arcuate end 83 extends along approximately a semicircle. thus, the arcuate end 83 encloses approximately half the circumference of the tube 6.1. as is understood, the arcuate and 83 may extend over a smaller portion of the tube 6.1. fig. 2 shows an exploded view of a lockable receptacle holder 10 according to the present disclosure. it should be noted that in figs. 2-6 and 8a-9c , the cap locking member 80 has been omitted to not obscure other features. however, it is appreciated that the embodiment/s shown in figs. 2-6 and 8a-9c comprises the cap locking member 80 as shown in fig. 1 . the receptacle holder 10 comprises an elongated holder back portion 40 which may be configured to be attached to a structure such as a wall (not shown). attachment of the holder back portion 40 to the structure may for example be achieved by double sided adhesive tape or by screws (not shown) through the openings 41 . the holder back portion 40 extends between a holder base portion 20 and a holder upper portion 30 . thus, the holder base portion 20 may extend from one end of the holder back portion 40 . the holder base portion 20 extends opposite to the holder upper portion 30 . the holder base portion 20 is configured to support the bottom 5 of a receptacle (not shown). in fig. 2 the holder base portion 20 therefore extends approximately perpendicular from the holder back portion 40 and has a width and a length sufficient to support the bottom 5 of a receptacle 1 (not shown). the holder upper portion 30 may extend from a second end of the holder back portion 40 . the holder upper portion 30 may thereby extend approximately parallel with the holder base portion 20 . the front portion 31 of the holder upper portion 30 points away from the holder back portion 40 . the distance between the holder upper portion 30 and the holder base portion 20 may be selected such that the front end 31 of the holder upper portion faces the neck or shoulder of a receptacle that is supported on the holder base portion 20 . the front end 31 of the holder upper portion may 30 be configured to receive a portion of the neck or shoulder of a receptacle that is supported on the holder base portion 20 . in fig. 2 , the front end 31 of the holder upper portion 30 is arcuate, i.e. has an arc-shaped recess. however, the front end 31 of the holder upper portion 30 may have a square or triangular recess. in the embodiment shown in fig. 2 , the holder upper portion 30 comprises a through hole 32 that extends between an upper opening 33 on the upper side 35 of the holder upper portion 30 and a lower opening 34 on the lower side 36 of the holder upper portion. the through hole 32 is dimensioned such that a locking portion 61 of a locking member 60 may be received through the lower opening 34 and such that at least the end portion 8 of a tool 7 may be inserted through the upper opening 33 . the cross-section of the end portion 8 of the tool 7 may thereby have the same or smaller dimensions as cross-section of the through hole 32 . the cross-sectional shape of the end portion 8 of the tool 7 and/or the tip 8 of the cross-sectional shape of the through hole may be same or similar. for example, as shown in fig. 2 , the through-hole 32 may be of rectangular cross-section and the end portion of the tool 7 may also be of rectangular cross-section. the length of the end portion 8 of the tool 7 is selected such that the end portion 8 extends through or flush with the lower opening 34 of the through hole. a shaft opening 38 for a pivot shaft 70 is provided in the rear portion 37 of the holder upper portion 30 . the rear portion 37 is located between the through hole 32 in the holder upper portion 30 and the holder back portion 40 . the receptacle holder 10 further comprises a confining member 50 which has a hook-shaped front portion 51 and a rear portion 52 which may be rectangular. the hook-shaped front portion 51 has a front end 57 , i.e. a free front end 57 . in fig. 2 , the hook-shaped front portion 51 is rounded, however it may also have other configuration such as triangular- or rectangular hook-shape. the confining member 50 is pivotally attached to the holder upper portion 30 . the confining member may thereby pivot relative the holder upper portion 30 in a plane that is parallel to the width and length extension of the holder upper portion 30 . the confining member 50 may thereby be pivotally attached to a pivot shaft 70 that extends through a shaft opening 54 in the rear portion 52 of the confining member 50 and the shaft opening 38 in the holder upper portion 30 . in the described embodiment, the confining member 50 comprises a receiving opening 53 that is provided in the rear portion 52 of the confining member 50 . for example, the receiving opening 53 is provided between the shaft opening 54 and the hook-shaped front portion 51 of the confining member 50 . the receiving opening 53 may be a through-hole or a recess, and is configured to receive a locking portion 61 of a locking member 60 . the locking member 60 comprises a locking portion 61 and a rear portion 66 from which the locking portion 61 may extend. the locking portion 61 is configured to extend into the through hole 32 in the upper holder portion 30 . the locking portion 61 may therefore be elongated and have an upright edge 62 . that is, directed in direction away from the upper surface of the locking member 60 . in the shown embodiment, the locking portion 61 is a flat. however, the locking portion 61 may have other configuration, for example rod-shaped. fig. 2a shows a flat and bent locking portion 61 that will be described herein below. it is also possible to divide the locking portion 61 in to two locking portion halves (not shown). in the shown embodiment, the locking member 60 is configured to be attached to the rear end of the confining member 50 . the rear portion 66 of the locking member 60 may therefore have attachment means 63 in the form of parallel flanges that may be inserted into corresponding openings 58 , such as grooves in the confining member 50 . alternatively, the locking member 60 may be glued or welded to the confining member 50 . the locking portion 61 is resilient. for example, the locking member 60 or at least the locking portion 61 is manufactured from resilient material such resilient steel strip such as spring steel. alternatively, plastic material such as polypropylene. the locking member 60 may be arranged such that the locking portion 61 extends over the receiving opening 53 in the confining member 50 . the rear portion 66 of the locking member 60 may comprise an opening 65 for the pivot shaft 70 . the pivot shaft may be a press pin that is riveted into the holder upper portion 30 . in assembled state, the confining member 50 and the locking member 60 and the holder upper portion are superimposed and the through hole 32 and the locking portion 61 and the receiving opening 53 are aligned so that the locking portion 61 of the locking member 60 may be pushed into the receiving opening 53 by a tool 7 inserted through the upper opening 33 of the through hole 32 . as shown in fig. 2 , the locking member 60 is arranged underneath the holder upper portion 30 and the confining member 50 is arranged underneath the locking member. the function of the receptacle holder 10 according to the present disclosure will in the following be described with reference to figs. 3a, 3b - 5a, 5b and 6 . fig. 3a shows the assembled receptacle holder 10 in a position a in which the front portion 31 of the holder upper portion 30 and the hook-shaped front portion 51 of the confining member 50 limits a partially closed space c which is configured to confine the neck or shoulder of a receptacle (not shown in fig. 3a ). by “confine” is meant that any opening between the front portion 31 of the holder upper portion 30 and the end 57 of the hook-shaped front portion 51 of the confining member 50 is too small to allow passage of a neck or shoulder of a receptacle. fig. 6 shows a cross-sectional view taken along line x - x in fig. 3a . thus, when the confining member 50 is in position a, the upright edge 62 of the locking portion 61 of the locking member 60 extends into the lower opening 34 of the through hole 32 . the locking portion 61 therefore locks the confining member 50 and prevents any pivotal movement thereof. fig. 3b shows the locking portion 61 extending over, but not beyond, the receiving opening 53 in the confining member 50 . fig. 4a shows the tool 7 inserted into the upper opening 33 of the through opening 32 . the tip 8 of the tool 7 thereby exerts a force f onto the upright edge 62 of the locking portion 61 and presses the locking portion 61 downwards into the receiving opening 53 (see fig. 4b ). when the upright edge 62 has been pushed out of the through hole 32 , the confining member 50 is released to pivot relative the holder upper portion 30 . in the described embodiment, as shown in fig. 5 , the holder upper portion 30 , the locking member 60 and the confining member 50 are superimposed with essentially no gap between them. the tool 7 may therefore be configured such that the end portion 8 thereof merely extend through the through hole 32 . this will suffice to force the upright edge 62 of the locking portion 61 into the receiving opening 53 so that the upright edge 62 is flush with the upper surface 55 of the confining member. the confining member 50 will thereby be released to pivot. however, it is possible to arrange the holder upper portion 30 and the confining member 50 superimposed with a gap between them (not shown). in this case, the tip 7 of the tool 6 may be elongated to extend through the through hole 32 and through the gap between the holder upper portion 30 and the confining member 50 in order to force the edge 62 of the locking portion 61 out of the through hole and into the receiving opening 53 . it is further possible to arrange the holder upper portion 30 and the confining member 50 superimposed with a gap that is wide enough to accommodate the edge 62 of the locking portion. in that case the receiving opening 53 in the confining member 50 may be omitted (not shown). fig. 5a shows the receptacle holder 10 in a situation where the confining member 50 is pivoted relative the holder upper portion 30 to a release position b. in this position the end 57 of the hook-shaped front portion 51 is spaced apart from the front portion 31 of the holder upper portion 30 such that an opening d is formed between the end 57 of the hook-shaped front portion 51 and the front portion 31 of the holder upper portion 30 . the opening d is sufficiently large to allow removal of a receptacle (not shown) from the receptacle holder. thus, the opening d is sufficiently large to allow passage of the neck or shoulder of the receptacle. the upright edge 62 of the locking portion is in sliding contact with the lower surface 36 of the holder upper portion 30 during pivoting from the locked position a to the release position b. the rear portion 52 of the confining member 50 may be arranged such that it hits the holder back portion 40 when the confining member 50 is in the release portion b which prevents further pivoting of the confining member 50 . this is favorable because the locking portion 61 may be kept in contact with the lower side of the holder upper portion which in turn may prevent damage of the locking portion when the confining member is pivoted towards the closed position a. a receptacle 1 may be inserted and locked into the receptacle holder 10 by performing the steps described above in reversed order. although a particular embodiment has been disclosed in detail this has been done for purpose of illustration only, and is not intended to be limiting. in particular, it is contemplated that various substitutions, alterations and modifications may be made within the scope of the appended claims. for example, figs. 7a and 7b shows a lockable receptacle holder 10 according to a second alternative of the present disclosure. the receptacle holder 10 according to the second alternative is essentially identical with the lockable receptacle holder 10 according to the first alternative and therefore only differencing features will be described herein below. thus, the receptacle holder 10 comprises a holder upper portion 30 with a closed space c configured to at least enclose and releasably confine the neck or shoulder of the receptacle 1 (not shown). the space c in the holder upper portion 30 encloses and confines the neck 2 of the receptacle 1 . the holder upper portion 30 is releasbly attachable to the receptacle holder 10 by means of screws 90 that may be received in bores 91 through the holder upper portion 30 and the holder back portion 40 . when the upper holding portion 30 is attached by the screws 90 to the holder back portion 40 , the receptacle 1 (not shown) is locked in the receptacle holder 10 . when the upper holder portion 30 is unscrewed the neck of the receptacle may be released from the space c and the receptacle 1 (not shown) may be removed from the receptacle holder 10 . according to the second alternative of the present disclosure, the holder upper portion 30 comprises a cap locking member 80 for preventing removal of the cap 9 of the receptacle 1 that is held in the receptacle holder (not shown). the cap locking member 80 comprises a first cap locking section 81 that extends from a position adjacent the space c in direction upwards. a second cap locking section 82 extends laterally from the first cap locking section 81 over at least a portion of the space c such that the second cap locking section extend over the top of the cap 9 of the receptacle. in an alternative, the receptacle holder 10 according to the present disclosure has hereinabove been described in an embodiment in which the holder upper portion 30 comprises the through hole 32 and the confining member 50 comprises the receiving opening 53 and wherein the locking member 60 is attached to the confining member 50 . in the described embodiment, the confining member 50 is arranged underneath the holder upper portion 30 . however, it is possible that the confining member 50 is arranged above the holder upper portion 30 . the confining member 50 may thereby comprise the through hole 32 and the holder upper portion 30 may comprise a receiving opening 53 and the locking member 60 may be attached to the upper surface 35 of the holder upper portion 30 such that the upright edge 62 of the locking portion 61 may enter into the through hole 32 (not shown in the figures). the confining member 50 may be mirror-inverted and arranged to pivot in opposite direction than shown fig. 5a . it is further possible to arrange the holder upper portion 30 such that the arcuate front portion 31 is oriented 90° to the facing direction of the holder back portion (not shown). the receptacle may thereby be introduced from the side of the receptacle holder. also further alternatives or modifications of the receptacle holder 10 according to the present disclosure are feasible. for example: fig. 8a shows a configuration in which the hook-shaped front portion 51 extends partially around the neck 2 of a receptacle 1 . fig. 8b shows a configuration in which the hook-shaped front portion 51 extends partially around the shoulder 3 of a receptacle 1 . in figs. 8a, and 8b , the arcuate front portion 31 of the holder upper portion 30 is configured to receive a portion of the neck 2 of the receptacle 1 . however, the front portion 31 of the holder upper portion 30 may be configured to receive a portion of the shoulder 3 of a receptacle 1 (not shown). the holder receptacle 10 may comprise retainer elements for holding the body or the bottom of a receptacle in order to further prevent lateral movement of a receptacle in the receptacle holder. for example, as shown in fig. 9a , the holder base portion 20 may comprise an arcuate lateral extension 22 having upright retainer pins 23 in each end. in use, the retainer pins 23 engage the bottom of a receptacle. fig. 9b shows a retainer element 21 in the form of a ring, which extends from the holder back portion 40 above the holder base portion 20 . the ring shaped retainer element is configured to hold the body of a receptacle. the present disclosure also relates to a receptacle holder unit 100 comprising two or more receptacle holder 10 that are joined together. fig. 9c shows a receptacle holder unit 100 comprising three receptacle holder 10 . in fig. 9c , the receptacle holder unit is integrally formed. however, it is possible to join two or more receptacle holder 10 to each other (by e.g. welding) to achieve a receptacle holder unit. fig. 9c also shows a further alternative of a retainer element 21 . the holder base portion comprises a first arcuate lateral extension 22 that extends in a concave manner from the holder base portion 20 and that has upright pins 23 in each end. a retainer element 21 in the form of a ring segment extends convexly between the upright pins and may thereby engage the body of a receptacle. fig. 2a shows an alternative configuration of the confining member 50 and the locking member 60 wherein the attachment means 63 in the form of flanges and the openings 58 in the form of grooves are omitted. in the configuration of fig. 2a , the locking member 60 is prevented from pivoting relative the confining member 50 in a plane that is parallel to the width and length extension of the confining member 50 by a part of the locking portion 61 extending into the receiving opening 53 . thus, in the assembled receptacle holder 10 , a part of the locking portion 61 extends into the receiving opening 53 at all times (also when no tool 7 is inserted through the upper opening 33 ). for this reason, the locking potion 61 may comprise at least one bend 67 such a part of the locking portion is bent to extend into the receiving opening 53 . as has been described above with reference to figs. 3a, 3b - 5a, 5b and 6 , the locking portion 61 of the locking member 60 may be pushed into the receiving opening 53 by a tool 7 inserted through the upper opening 33 of the through hole 32 . in the configuration of fig. 2a the locking portion 61 , a part of which already extends into the receiving opening, is pushed further into the receiving opening 53 by the tool such that the upright edge 62 is pushed out of the through hole 32 . as a result, the confining member 50 is released to pivot relative the holder upper portion 30 . moreover, although specific terms may be employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. furthermore, as used herein, the terms “comprise/comprises” or “include/includes” do not exclude the presence of other elements. finally, reference signs in the claims are provided merely as a clarifying example and should not be construed as limiting the scope of the claims in any way.
196-701-567-441-190	DE	[ "US" ]	G06F7/00,G08G1/16	2003-01-30T00:00:00	2003	[ "G06", "G08" ]	software for an automotive hazardous detection and information system	the invention is related to a software for an automotive hazard detection and information system for vehicles running on at least one controller, wherein the software uses data of at least one optical sensor or a sensor group including an optical sensor, and comprises at least one analysis and interpretation unit per sensor or sensor group to determine geometry data and motion data of vehicle equipped with the software and/or of objects that arise hazardous situation and/or information requiring situation in the surrounding of the vehicle. the software provides the analysed data for at least one display unit and/or warning indicator for each sensor or sensor group. the software comprises software modules for different detection and information functions that use the same optical sensor data parallel for analysing and providing the different functions and that at least two modules are activated the same time.	1 . software for an automotive hazard detection and information system for vehicles running on at least one controller, wherein the software uses data of at least one optical sensor or a sensor group including an optical sensor, and comprises at least one analysis and interpretation unit per sensor or sensor group to determine geometry data and motion data of vehicle equipped with the software and/or of objects that arise hazardous situation and/or information requiring situation in the surrounding of the vehicle, the software provides the analysed data for at least one display unit and/or warning indicator for each sensor or sensor group; characterized in that the software comprises software modules for different detection and information functions that use the same optical sensor data parallel for analysing and providing the different functions and that at least two modules are activated the same time. 2 . software for an automotive hazard detection and information system according to claim 1 , wherein at least the module dirt detection or the module auto calibration is running with another software module in parallel. 3 . software for an automotive hazard detection and information system according to claim 1 , wherein the modules that are implemented in the software are activated in the vehicle according user's requirements. 4 . software for an automotive hazard detection and information system according to claim 1 , wherein the modules are coming out of a group of: blind spot detection, bird view, side view assistant, rear view assistant, front view assistant, rear driving control, lane change assistant, lane departure control, parking assistant, approaching control, traffic sign detection, collision control, auto calibration, dirt detection, shadow detection, image rotation, shadow detection, traffic sign detection, night vision. 5 . software for an automotive hazard detection and information system according to claim 4 , wherein the module shadow detection runs parallel to other modules in day mode. 6 . software for an automotive hazard detection and information system according to claim 2 , wherein the field of view of the at least one optical sensor is adapted automatically after mounting the optical sensor at vehicle or after loading vehicle, by using auto calibration function module of the software using vanishing point detection to adapt field of view. 7 . software for an automotive hazard detection and information system according to claim 4 , wherein the software uses the direction of motion, the speed of motion, and changes therein, and the motion data of the object or objects detected, to calculate a possible collision between the vehicle and at least one object. 8 . software for an automotive hazard detection and information system according to claim 2 , wherein two sensors or sensor groups are used and the software is able to detect distortions on the optical lens by comparing sensor data of at least two optical sensors. 9 . software for an automotive hazard detection and information system according to claims 7 and 8 , wherein the software is adapted to detect a hazardous situation by an object recalculating the data of the sensor after detecting a distortion on the optical lens. 10 . software for an automotive hazard detection and information system according to claim 4 , wherein the software for image rotation recalculates data of at least one sensor or sensor group that are displayed as a bird's view image. 11 . software for an automotive hazard detection and information system according to claim 1 , wherein the software starts an indication to the driver, wherein the indication is an optical or an acoustical or a tactical signal. 12 . software for an automotive hazard detection and information system according to claim 1 that includes at least one interface to the vehicle internal bus system. 13 . software for an automotive hazard detection and information system according to claim 12 , wherein the software influences vehicle parameters via the bus system.	this patent application is a continuation-in-part patent application claiming priority to a united states patent application having application ser. no. 10/543,910, filed jun. 22, 2006, claiming priority to a patent application claiming priority to pct/de2004/000140, filed jan. 30, 2004, claiming priority to a german patent application having application number 103 03 578.8, filed jan. 30, 2003. field of the invention the invention is related to a flexible method for hazard detection and information implemented in a vehicle with at least one side and rear area sensing device, area interpretation device and a possibility to display the information and/or warning signals for the driver. description of the related art from de 44 10 620 a1 is known a monitoring device for the driver and or passenger side of vehicles. the monitoring device comprises a sensor in the vehicle's exterior mirror for monitoring the blind spot region. the sensor, an ultrasonic or infrared sensor, is connected to a control unit that causes a visual signal to light up in the exterior mirror in the event that an object is detected in the blind spot in order to warn the driver. object identification or predictive interpretation of motion is not possible here. there is a lot of prior art published related to single and stand alone solution for an assistant system in a vehicle which provides some additional benefit to driver and assist him in special actions. the plurality of different assist systems that often uses radar or ultrasonic sensors for their purpose makes is complicated for the car manufacturer to decide which assistant system should be installed. to install different independent systems reduces the effectiveness of the assistant function and the user will be overwhelmed by information flow. summary of the invention the present invention is thus intended to solve the problem of developing a flexible software for an automotive hazard detection and information system with at least one area sensing device that automatically detects present an impending hazardous situations or environmental situations for information and induces the driver at least assess the situation visually. the problem is solved by the features of the main claim. to this end the software of the hazard detection system works with one sensor or a sensor group and is structured in modules to allow the flexible activation of modules by oem and/or the driver. the software runs on a device including at least one analysis and interpretation unit per sensor or sensor group to determine geometry data and motion data of the object or objects sensed. it has at least one display unit for each sensor or sensor group. with the aid of the sensors affixed to the outside of the vehicle here, moving traffic, etc., for example in the blind spot region to the rear of the exterior mirror or mirrors is detected. by means of an analysis and interpretation unit, the images or contours detected by the sensors provide object characterization with respect to size or type, and the image sequences provide the relative motions of the object or objects observed. from the geometry and motion data, the analysis unit calculates a possible collision or near collision, in the event that the present courses of all objects involved are maintained. in hazardous cases, the driver is warned by visual, acoustic, or tactile means, and if applicable is informed and/or prompted with respect to possible reactions to avert the danger. brief description of the drawings further details of the invention are evident from the dependent claims and the description below of schematically illustrated example embodiments. fig. 1 : top view of vehicle with blind spot monitoring; fig. 2 : top view of vehicle; figs. 3 to 7 indicator lamp at different positions; fig. 8 process steps for object detections fig. 9 modular software for different functions detailed description of the preferred embodiment(s) fig. 1 shows a top view of a multi-lane road ( 70 ), for example, on which three vehicles ( 1 , 2 , 3 ) are driving in approximately the same direction ( 7 , 8 , 9 ). the first vehicle ( 1 ), the front most, has two sensors ( 11 , 15 ) detecting the traffic to the rear, see also fig. 2 . the first sensor ( 11 ) is integrated in the exterior mirror ( 10 ) on the driver side, while the second sensor ( 15 ) is installed in the vehicle's rear area, e.g. in the driver-side rear light unit ( 14 ). if applicable, both exterior mirrors ( 10 , 18 ) are also equipped with at least one sensor ( 11 ). additional sensors are alternative position of the sensors is used, to achieve the optical field of view that is required. alternatively, the sensor ( 11 ) located in the front, viewed in the direction of travel, can be accommodated in the exterior or interior mirror, on the mirror triangle for the outside mirror, on the third side directional signal, or in the grip strip of the driver-side door handle, among other locations. if the sensor ( 11 ) is integrated in a mirror, it can be located behind the mirror glass, on the mirror housing, or in the mirror base. the mirror triangle is a region of the outer vehicle shell. it is generally part of the driver-side or passenger-side door and is located between the doorpost near the a-pillar and the door-side window. the mirror triangle carries and positions the exterior mirror on the driver or passenger door and will carry in future a camera module only to replace a rear view mirror. as an alternative to placement in the rear light unit ( 14 ), the rear sensor ( 15 ) can be positioned, for example, in the rear bumper, in the region of the tailgate handle, in the centre auxiliary brake light, in the license plate light, or in a passenger compartment vent integrated in the c-pillar or d-pillar. within the rear light unit ( 14 ), the sensor can be placed in the back-up light, in the turn signal light, in the taillight, in the rear fog light, or in the rear brake light. the sensors ( 11 , 15 ) can be digital cameras, range-finding cameras, laser systems or radar systems, for example. motion sensors and other range measurement systems are also possible. different sensor types can also be combined in a sensor group. probably the sensor is an optical sensor that can be combined with other sensor types in a sensor group. the front sensor ( 11 ) has an angle of view of approximately 60 to 80 degrees, with the line delimiting the field of view ( 13 ) nearest the vehicle extending along the outer contour of the vehicle body ( 6 ); in other words, this delimiting line ( 13 ) extends parallel to the direction of travel, for example. the detection and/or analysis range is 10 to 60 meters, for example. the angle of view of the rear sensor ( 15 ) covers approximately 15 to 50 degrees, for example. the detection and/or analysis range extends to 30 to 40 meters. the optical sensor uses a wide angle optic, preferably a fish-eye optical lens that extend the angle ranges to a much higher extend than discussed above. the wide range view allows a better coverage of areas adjacent to the vehicle and increases the functions that can be implemented using the wide angle data set. the purpose of the sensors ( 11 , 15 ) is to sense the surroundings. they are meant to detect objects in motion, for example driving objects ( 2 , 3 ), which move relative to the vehicle ( 1 ) in such a way that a later collision cannot be ruled out if the driver of vehicle ( 1 ) does not react by changing the direction of travel ( 7 ) or the speed. through appropriate processing of the sensor data, the direction of motion, speed, and changes therein, are continuously calculated in an interpretation unit and compared with the comparable data for the vehicle ( 1 ). from these data are calculated a possible collision point or an encounter that is still collision-free but closer than a minimum distance. both possibilities are interpreted as a hazardous situation. driver reaction assistance is derived from this. from the fact that vehicle direction ( 7 ) and speed are maintained, or from a change in one or both that increases a risk of collision, the hazard detection system interprets that the driver of ( 1 ) does not perceive the approaching object ( 2 , 3 ) in the exterior mirror blind spot. in a first phase, the system forces the drive to look in the exterior mirror ( 10 ) by means of a lighted or blinking visual signal on or in the vicinity of the exterior mirror ( 10 ). generally, the driver of ( 1 ), continuing not to perceive a hazard, will look back over his shoulder on the side facing the appropriate exterior mirror ( 10 ), notice the vehicle ( 2 , 3 ) to the rear, and react appropriately to avert a danger. nearly any type of acoustic warning can assist the driver of ( 1 ) in this situation. if the driver of ( 1 ) continues to evidence no reaction, in a second phase his attention is drawn to an imminent hazardous situation. in this embodiment the steering wheel and/or the brake or gas pedal serves as an information device. to this end, the steering wheel and/or the relevant pedal is set into a pulsing motion. as a rule, this pulsing motion has no direct effect on steering action or vehicle acceleration. independently of this, if desired, the brake pressure is increased, for example, in order to shorten the braking response time. moreover, it is also possible for the system to activate the hot-air fan at a certain difference between the inside and outside temperatures and/or at or above a certain air humidity level in the interior air, and, by means of the ventilation grille ( 26 ), dry the side window, at least in the area of the exterior mirror, in order to improve visibility of the exterior mirror. active adjustment of the ventilation louvers for optimal hot-air conduction is also possible. the pulsing or vibrating motion of the steering wheel or at least one of the pedals makes the driver of ( 1 ), who has physical contact with at least the accelerator or steering wheel, expressly aware of a general or specific hazardous situation. for example, the vibration of the steering wheel can prepare him through tactile means for the need to avert the hazardous situation by turning the steering wheel. in addition or alternatively, in the case of a hazardous situation that turning the steering wheel would avert, the driver's seat can be palpably tilted in the direction in which the driver should steer. if desired, the seat and/or backrest can also vibrate in the process. in addition, instead of tilting of the seat—for example if it is necessary to steer toward the right—the left side of the driver's buttocks could be raised or the right side could be lowered. the palpable unilateral or alternating lifting can be in the range of millimetres. the visual signal from the first warning phase is emitted by a light source in the form of an indicator lamp ( 41 - 61 ). such lamps are shown in figs. 3 through 7 . in addition, figs. 3-7 show the inside left corner of the passenger compartment ( 20 ). visible is a part of the left-hand driver-side door ( 23 ), the part of the dashboard ( 22 ) located to the left of the steering wheel, the a-pillar ( 21 ), and an exterior mirror ( 30 ) located on a mirror triangle ( 25 ). said mirror can be the exterior mirror ( 10 ) or ( 18 )—shown in figs. 1 and 2 —as suitable for a vehicle for driving on the left or the right. in fig. 3 , a recess ( 42 ) is located in the interior panelling of the a-pillar ( 21 ); arranged in this recess is a blind spot lamp ( 41 ). the recess ( 42 ) extends, for example, primarily horizontally across the a-pillar panelling. the length of the lamp ( 41 ), measured horizontally, corresponds in this example to approximately 60% to 80% of the width of the a-pillar panelling at that location. the height of the, e.g., rhombus-shaped recess is approximately 10 millimetres, for example. the side borders ( 43 ) of the recess ( 42 ) or of the blind spot lamp ( 41 ) extend parallel to the nearest edges ( 44 ) of the a-pillar panelling, for example. the visible outside edge of the warning lamp ( 41 ) fitted into the recess is matched to the spatial curvature of the a-pillar panelling. in addition, the warning lamp ( 41 ) is domed slightly toward the passenger compartment ( 20 ) so that its centre region projects slightly beyond the spatial curvature of the a-pillar panelling. the lamp lens of the blind spot lamp ( 41 ) has a red warning colour, for example, similar to that of the emergency flasher button. if desired, the lamp lens in the inactivated state is the same colour as the a-pillar panelling. depending on the type of panelling, the lighting means, for example a light bulb or a light-emitting diode, can shine through the a-pillar panelling when activated. in vehicles without a-pillar panelling, the blind spot lamp ( 41 ) sits directly in a recess worked in the hollow profile of the a-pillar ( 21 ). fig. 4 shows a blind spot lamp ( 45 ), which is integrated in the mirror glass ( 38 ) or located behind the partially at least semi-transparent mirror glass ( 38 ) in the mirror housing ( 31 ). upon activation of the warning lamp ( 45 ), a stylized arrow ( 46 ) and a vehicle symbol ( 47 ) light up. the arrow ( 46 ) comprises two legs of equal length and equal width. the vertical height of the arrow ( 46 ) represents approximately 30% to 50% of the vertical extent of the mirror glass. the height of the triangle enclosed by the legs of the arrow is approximately 20% to 30% of the aforementioned extent of the arrow. the short height gives the driver the spatial impression that the arrow ( 46 ) is pointing into the blind spot region of the exterior mirror ( 30 ) as a warning. the vehicle symbol ( 47 ) between the arrow ( 46 ) and the edge of the mirror near the vehicle body consists of a bar with multiple bends and two rings beneath it. the bar represents the upper edge of an automobile silhouette in simplified form, while the two rings symbolize the vehicle wheels. in fig. 5 , a blind spot lamp ( 51 ) in the shape of an arrow lamp pointing backward, which is to say opposite the direction of travel, is located in the mirror triangle ( 25 ). the length of the arrow ( 51 ) is, e.g., approximately 40-60% of the length of the mirror triangle measured in the direction of travel. the arrow height is approximately equal to the arrow length. the lamp lens of the arrow ( 51 ) projects approximately 1 to 2 millimetres beyond the surrounding surface of the mirror triangle ( 25 ), for example. with respect to the colour, please refer to the description of figs. 3 and/or 4 . in figs. 6 and 7 , the blind spot lamps ( 55 ) and ( 61 ) are likewise affixed outside the passenger compartment to the exterior mirror ( 30 ). both warning lamps ( 55 , 61 ) are oriented largely vertically in the mirror housing ( 31 ) in suitable recesses. their length, measured in the vertical direction, is 5 to 10 times longer, for example, than their visible width. as shown in fig. 6 , the warning lamp ( 55 ) is seated in the—for example—vertical section of the inner frame ( 32 ) of the mirror located farthest from the passenger compartment. the light from the activated warning lamp ( 55 ) is thus also reflected in the mirror glass ( 38 ), more strongly encouraging the driver to look in the exterior mirror ( 30 ). [the warning lamp ( 61 ) shown in fig. 7 is located in the housing outer surface ( 33 ) of the mirror ( 30 ), facing the driver, between the housing inner frame ( 32 ) and the mirror-housing-side attachment of the mirror base ( 36 ). the luminous intensity of the warning lamps ( 41 - 61 ) is adapted to the ambient brightness if desired, i.e. the brighter the environment, the more intensely the warning lamp ( 41 - 61 ) glows. the lamp lens material can be a transparent plastic, glass, or a comparable material. if desired, the lamp lens is simultaneously the body of the light source, e.g. the bulb of the incandescent lamp or the housing of an led or led array. fig. 8 describes the schematic process running by software on a controller linked to the optical image sensor. the image senor is started and begins to sample data with a working frame rate. frame rates of up to 30 frames per second are actually discussed and could be basis of data conversions and date extractions. in the next step seize of data is reduced to a level that allows the processing of the data in a controller in real time. in the next step the data are processed and filter with algorithm to produce a reliable data set. the data that are sampled via a fish eye lens or another wide angle lens are distort and must be recalculated to get a rectangular image that can be use for further purposes. the step to find features for tracking is different for night or day use. in darkness the objects can be tracked by their headlamps, so that a vehicle or a motor bike can be detected and the vector of motion tracked. the software is able to distinguish between one or two headlamps and includes a plausibility check. for example it is checked whether the detected headlamps are not higher than a threshold height over street level so that no other artefacts are tracked in night. a street lamp that is detected would be rejected by the software because of the height over ground level. in the day mode the step of finding features in the image is different. the applied algorithm uses the vanishing points of structures in the image to define objects and their position in the three dimensions. the objects detected are qualified into danger categories. in the decision stage software decides about a warning signal yes or no, to be presented to vehicle's driver. basis for the warning is use of object classification and a decision tree that allows to limit warning to only hazardous situation. the bus-data input on this stage provides vehicle parameters that can be involved in the warning decision, as velocity, steering angle, setting of turn signal indicator etc. fig. 9 shows a schematic block diagram with software modules that are all linked to the sensor and includes different functionalities. a software module is a small self-contained program that carries out a clearly defined task and is intended to operate within a larger program suite. the abbreviations d and w explain whether the output of a software module is used to be displayed in form of an image on a display or used for a warning indication or for both. after the step of data reduction the same data set is used as parallel input for all blocks representing software modules of fig. 9 . auto calibration is a software module that allows the calibration of field of view independent from the installation and the mounting of the optical sensor in the production line. the software for hazard detection and information system is self-adjusting. it is important to adjust the area of detection of a hazard detection system to achieve a reliable warning situation. for the software is analysing images and deriving the hazardous status from the detected objects the view of the optical sensor must be defined. the very sensitive function of a warning system is sensible to the final optical view of the optical sensor. during normal vehicle mounting the view of a sensor can change slightly. in prior art the view of the camera sensor must be amended after the rear view mirror is attached to the vehicle or the senor is mounted somewhere else at the vehicle to tune the warning system. in details the position of the sensor must be adapted using defined target lines in the production line and amending the position. this increases the cost of installation of the assistant system. according to the invention the software recalculates the actual position and adapt the field of view to an optimum to initiate the hazardous warning system. the software module auto calibration is also used to adapt the field of view if the vehicle carries a big load and the position of the cameras sensor changes. the software uses vanishing points of detected features of the image that are calculated to define the view angles versus the vehicle coordinates. this flexibility is possible because an optical sensor with a wide angle optic has a very broad view and the field of view is shifted by software over the total range of the image recorded. another software module is able to detect dirt or fogging on the optical lens. if both a right-side and left-side sensors are used, both software modules can work together or can be independent of one another. differences arising here can also be analyzed. this is a big advantage using optical sensor systems. the optical sensors are able to compare data to detect for example any distortion that covers one of the optical lenses. the optical sensors are in some cases hidden by dust or a water droplet. these distortions arise failures in object detection. by comparing the situation on both sides of the vehicle these issues are solved. the software compensates a distortion on a lens and the object detection can successfully detect a hazardous situation again. either auto calibration or dirt detection are modules that in background parallel to further software modules. another background running module is the shadow detection. this software module derives data that shows light and dark regions in the image data that are correlated to the own vehicle, the shadow detection is important to avoid mis-warnings that occurs from the light-dark-transition and the features that are track in the image therefore. blind sport detection module is a function as discussed for fig. 8 . here the object detection in field of view that should be followed is the key software element. the field of view can be rearwardly or forwardly or sidewardly from the vehicle, dependant on which type of blind spot area is looked. another software module is detecting traffic sign, which is comparable with other object detections. also lane sign detection is done in a further software module. the lane detection is then used for two different further software module, the lane departure warning which implements a forward looking view of the optical sensor and and the lane change control. the data of the optical sensor are further used to rotate and recalculate the image pixel by pixel. these results in an image which give the bird view sight of the vehicle's surrounding. another software module used the image for a park assistant function that can be combined with bird's view function. a software module for collision control and warning is also available. the hazard detection system can be designed as a complete module that requires only few vehicle data. the system is realized with a controller connected via a bus system with the vehicle. the controller is either able to calculate all the functions of the software for example the object recognition issues or is connected to another controller that is specially adapted for video calculations in real time. data exchange with the vehicle can take place over a lin bus or can bus, for example. for adaptation to the standard bus systems the controller includes the lin- or can bus functionality that allows the communication with a master controller in the vehicle. the module consisting of sensor, optic, electrical circuit and at least one controller can be placed directly on or in the rear view mirror housing or elsewhere at the vehicle. the position of the optical sensor is only limited by the field of view and by shading of this field of view by vehicle. thus it can be permanently attached and also ensure good thermal transfer to the vehicle body. the hazard detection system with a standard controller connected to the vehicle bus system is also adapted to control more than the optical sensor data. the control of further data of devices that are mounted or attached to a rear view mirror is realized. one example is the control of a turn signal indicator. the software of hazard detection and information system can also be used for the traffic space in front of the vehicle. if desired, the monitoring of the traffic space in front of the vehicle and behind the vehicle can be integrated in one module. then, for example, pedestrians, traffic signs, special-purpose vehicles such as police, fire trucks, etc., can also be detected with the aid of the optical sensors and operated by the relevant software module. the warning indication is provided by means of a lamp arranged on the edge of the driver's field of view. the warning then takes the form of flashing of the light, for example. the lamp, for example a light-emitting diode, can be directed at the driver. the software of hazard detection and information system includes a brightness detection device. thus it can switch over from a day mode to a night mode, possibly coupled to the on-board clock, and use the appropriate software program based on the mode. normally the day and night situation is derived from the received data of the optical sensor. also, in the event of, e.g., mis-adjustment of the sensors, a warning message can be issued or the software can automatically adjust itself or compensate for a mis-adjustment. it is likewise possible for, e.g., the size and direction of the monitored region to be adjustable or settable by the driver, for example by means of an operating display. the type of warning message and if applicable the control signal issued by the hazard detection system can be governed by the severity of the danger. for example, they can be dependent on the travel speed of the monitoring vehicle, the travel speed of the monitored vehicle in the hazard zone, the radius of turn, etc. the sensors ( 11 , 15 ) can—as already mentioned—include an ordinary commercial camera and ordinary commercial optical lenses. these components are arranged directly behind a window in a housing that forms a module in or at the rear view mirror housing. the electrical components are then designed specifically for the hazard detection and information system. close to the camera or optical sensor chip an image processing unit is placed to receive data from the sensor and start calculations. the image processor unit is linked to a processor or controller that analyses and interprets the data for further use. all software is either stored in related storages of the units or controller either on one device or spread over several devices. the individual camera has a field of view of more than to 60 degrees using a wide angle lens. the lenses can have a hydrophilic or hydrophobic coating that is applied as a permanent coating, or is renewed during cleaning. the module can also be arranged in an area of the door that is subjected to moisture. the module can then be designed with ip 67 protection. in this context, the wiring is in the sealed area. large-volume, sealed connectors can be eliminated. the lens and the cmos electronics are then glued into the housing. the thermal expansions of the different device parts are compensated with a gore tex® seal. this achieves, firstly, water tightness preventing the entry of moisture, and secondly prevents the build-up of an overpressure of air in the housing. the software of the hazard detection system can be customer-specific. it can be programmed by the driver or the service shop, for example. it can be used for other applications in the vehicle in addition to the hazard detection system. for example, an interface to the data network of the vehicle can be provided. thus, for example, the settings of the sensors ( 11 , 15 ) can automatically be compensated depending on the loading of the vehicle ( 1 ). in addition, various operating states or driver-specific settings can be pre-programmed, for example based on the driver's specific field of view. in this regard, for example, it is possible to consider the seat position of the driver, the individual visual acuity of the driver, the reaction time of the driver, etc. modular software structure comprises the possibility to create software adaptable to driver's need or to the actual parameters. a system with optical sensors can be used for several functions, blind spot detection rearwardly, blind spot detection forwardly, lane change detection and assistant, parking assistant, bird's view application, surrounding monitoring. there are additional modules for traffic sign recognition, and for other assistant functions. the module auto calibration and the module dirt detection are always active. according the acquired package software is activated. the user of a vehicle equipped with this software is able to receive updates of the functionality of the hazardous warning system or to have additional functions installed. in order to protect the sensors ( 11 , 15 ), they can be equipped with an electromechanically operated cover that is closed when the vehicle ( 1 ) is stopped. a cleaning mechanism for the lens, for example a wiper, spray nozzles, etc. is also possible. the speed of the object ( 2 , 3 ) relative to that of the vehicle ( 1 ) bearing the system may be minimal. thus even if two vehicles travelling at approximately the same speed should approach one another during a lane change, this can be detected. conversely, even stopped vehicles can be detected. the hazard detection system can also warn if there is and/or will be reduced visibility. this can be caused by, e.g., a dirty lens, fog, etc. to this end, the hazard detection system has infrared sensors in addition to sensors ( 11 , 15 ) that detect objects ( 2 , 3 ) in the visible spectrum. these cited functions can also be combined in a single sensor ( 11 , 15 ). the use of a night vision device in the hazard detection system or in combination therewith is also possible. the cmos electronics of the signal generator produces a black-and-white image. the image produced can thus have a high pixel density. the invention is not limited to a black and white optical sensor. colour sensors are used if the image is displayed to give a real view of surrounding. the visual warning signal in the mirror triangle ( 25 ), for example the blind spot lamp ( 51 ) designed in the shape of an arrow, is designed such that it elicits a glance at the mirror ( 10 , 18 ). the warning signal alone thus does not provide complete information about the hazard and does not replace a look in the mirror ( 10 , 18 ). the hazard detection system can perform self-diagnostics with regard to its function. thus, it can regularly receive signals and report back over the data connection line from the vehicle ( 1 ). a special diagnostics interface is also possible. the units can be used equally well for driving on the right or left. the hazard detection system can monitor and recognize multiple vehicles ( 2 , 3 ) simultaneously, and warn of possible hazards caused by these vehicles ( 2 , 3 ). in this regard, for example, a closer vehicle ( 3 ) can be assessed as the primary danger and a vehicle ( 2 ) that is further away as a lesser danger. the individual mirror ( 10 , 18 ) can be attached by its base surface. in this way, it can be largely insensitive to vibrations, shocks, etc. in addition, the sensors ( 11 , 15 ) can then be integrated in the base plate, for example. adjustment of the mirror ( 10 , 18 ) then does not affect the position of the sensors ( 11 , 15 ). the sensors ( 11 , 15 ) are then adjusted by means of an adjusting screw on the outside of the mirror ( 10 , 18 . if the sensors are mounted in the pivotable part of the rear view mirror the view of the sensor can be adapted by the software. the software defines the area of view actually and calculated the hazardous situations according the actual views. the sensors ( 11 , 15 ) can also be arranged in such locations as on the roof, in the doors, in the rear window, in the trunk lid, etc. thus the detection regions ( 12 , 16 ) can have a large overlap. the hazard detection system can be used in the customary temperature range. thus, even low temperatures and windows that are partly iced up, do not cause the hazard detection system to fail. in order to minimize the effects of extremely high or extremely low temperatures, the hazard detection system can also have protection against heat and/or cold, a heater, a fan, and/or a defroster for the lens. the individual components of the hazard detection system can also be electrically shielded. in this way, electrical influences on the hazard detection system by other vehicle components or electric and/or magnetic fields in the surroundings of the vehicle ( 1 ) can be prevented. in addition, the hazard detection system does not electrically and/or magnetically affect any other vehicle components or the environment. the components of the hazard detection system can be arranged in a housing that is protected against unauthorized access. thus, for example, it can be sealed or it can be closed with special screws. the housing can be made of die-cast aluminium with an anodic coating as corrosion-proofing, for example. a hermetic sealed housing helps to protect electrical devices including controller from dust and humidity. the sealed module is also resistant against electromagnetic pulses and does not sent electromagnetic distortion pulses. if a camera is used as a sensor ( 11 , 15 ), the camera can include an auto focus. the optics of the camera are then set such that objects in the more remote environment do not affect the sensors ( 11 , 15 ). the brightness information of the image recorded by the camera can be used to adjust the brightness of the warning lamp ( 41 - 61 ). the warning lamps ( 41 - 61 ) are arranged such that the driver can see them without turning his head, for instance. in order to install the hazard detection system in a motor vehicle, the standard mirror can be replaced by a mirror ( 10 , 18 ) that includes components of the hazard detection system. the images detected by the sensors ( 11 , 15 ) and the information determined there from can be stored inside the vehicle ( 1 ), for example together with the operating parameters of the vehicle. in this way, an accident can be reconstructed after the fact. the data can also be transmitted to a removable storage medium. even wireless transmission is possible, either in real time or at regular time intervals. the data can also already be compressed and processed at this point. at least one of the sensors ( 11 , 15 ) can also be arranged on a vehicle that is not self-propelled, such as a trailer, a semi trailer, etc. the towed vehicle is then connected to the data bus of the towing vehicle, if desired even over a wireless connection. in the event of trailer operation, the hazard detection system can also sense yawing of the trailer, for example, before the trailer jack-knifes relative to the towing vehicle. software of hazard detection and information system includes other systems assisting the driver, such as assistive braking, assistive lane changing, etc. in this regard, software can be adapted to the course of travel. for instance, if the assistive lane changing system detects a lane change, software can monitor the danger zone accordingly. also, the image from one or more cameras of the assistive lane changing system can be projected on the windshield together with the image from one or more cameras of the system. then a complete image of the traffic space to the rear is presented on the head-up display. if desired, the mirrors ( 10 , 18 ) can be omitted entirely in this case. in this context, the software has an interface with the internal data bus by three wires and is connected to the head-up display by a two-wire line. in hazard situations and on the highway, software system can supply data in order to influence, at least the steering of the vehicle. the hardware of the system can also contain additional components, such as curb lights, mirror elements with controlled dimming and/or tint, heaters, etc that are directly of via bus system connected to the software the data transmission and the control here can be accomplished through glass fibres, wireless transmission, etc. in addition one module of the software includes an access control system with thermal profile monitoring for keyless access to the vehicle. the sensors ( 11 , 15 ) can be arranged separately from the analysis unit. the sensors ( 11 , 15 ) can be placed at the top or bottom of the mirror ( 10 , 18 ). they are then connected to the analysis unit, which is located in the door, in the frame, on the inside of the door, the mirror triangle ( 25 ), etc. it is possible to deactivate the software of hazard detection and information system complete or only per modules. thus the blind spot warning module can be switched off for parking, to enter a garage, in traffic jams, in heavy traffic, etc. but the parking assistant still runs. switch-on and switch-off can be done automatically or by the driver. the invention has been described in an illustrative manner. it is to be understood that the terminology, which has been used, is intended to be in the nature of words of description rather than of limitation. many modifications and variations of the invention are possible in light of the above teachings. therefore, within the scope of the appended claims, the invention may be practiced other than as specifically described.
197-705-568-449-244	US	[ "EP", "JP" ]	F16K17/04,F16K5/00,F16K7/07,F16K47/02,F16L55/055,F17D1/20	1982-08-18T00:00:00	1982	[ "F16", "F17" ]	system for quick interruption of flow in a liquid pipeline.	a system for quick interruption of flow in a liquid pipeline (12) comprising a conventional valve (14) with means for effecting a quick closure thereof. a by-pass line (48) around the valve (14) has a pressure responsive valve (50) which opens when and as long as pressure therein exceeds a set jacket pressure. the jacket pressure is set at a predetermined maximum safe pressure level and the main valve (14) operated quickly to close off the liquid pipeline (12) at a rate which produces potentially dangerous surge waves. the surge waves are relieved through the by-pass line (48) allowing a small amount of limited flow downstream to ensure the fastest possible safe operation.	1. a system for quick interruption of flow in a liquid pipeline comprising: a main valve having aligned flow passages of substantially the diameter of the pipeline, a valve closure member movable between an open position enabling flow of liquid through said flow passages and a closed position blocking flow therethrough; and means for moving said closure member rapidly from said open position to said closed position; a by-pass line of a diameter smaller than said pipeline diameter; and a pressure-responsive surge relief valve in said by-pass line conditioned to open when, and as long as, by-pass line pressure exceeds a predetermined level. 2. the system defined by claim 1 wherein said surge relief valve comprises: an expansible tube valve including a circular barrier centered in a housing and a flexible tube stretched around said barrier with a jacket space around said tube; and a source of gas at a fixed surge-relief pressure connected to said jacket space. 3. a method of closing a liquid pipeline valve quickly, said pipeline valve having aligned flow passages of substantially the diameter of the pipeline and a valve closure member movable between an open position enabling flow of liquid through said flow passages and a closed position blocking flow therethrough: said method comprising the steps of providing a by-pass line of a diameter smaller than said pipeline diameter, with a pressure-responsive surge relief valve in said by-pass line conditioned to open when, and as long as, by-pass line pressure exceeds a high but safe predetermined level; and operating said closure member from said open position to said closed position at a rate rapidly enough to generate liquid pressures above said predetermined level. 4. the method defined by claim 1 wherein said surge relief valve comprises: an expansible tube valve including a circular barrier centered in a housing and a flexible tube stretched around said barrier with a jacket space around said tube; and a source of gas at a fixed surge-relief pressure connected to said jacket space.	background of the invention there are many situations wherein it is highly desirable to close pipeline valves at a very rapid rate. for example, when there is a change in the type of liquid being transported through the pipeline, it is necessary to shut the valve rapidly between batches in order to minimize mixing of products. also, where emergency shutdown valves are provided to protect hoses, as when loading ship tanks, they should be shut down in the event of hose rupture as quickly as possible to minimize discharge into the ocean. however, when a valve is closed rapidly, the sudden decrease in liquid flow velocity generates a corresponding pressure surge on the upstream side of the valve which could reach dangerous proportions. generally, as a valve is being closed to decrease flow capacity thereof, there is a compensating increase in pressure differential across it, so that rate of flow through the valve does not decrease appreciably through most of the closing movement. it is just during the last increment of valve movement that there is a sharp decrease in liquid flow. accordingly, there have been proposed valve actuators which will move the valve closure member at a very rapid rate through most of its movement toward closed position and then decelerate movement so it moves relatively slowly through the last increment of movement. however, such precise control has been very difficult to achieve particularly with the momentum generated in large pipeline valves of 36 inches in diameter and larger. moreover, with varying fluid velocities and pipeline characteristics, it is extremely difficult to determine when to shift from fast to slow movement in order to gain the maximum benefits of fast operation without generating dangerous surges. objects of the invention it is an object of this invention to provide a system for quick interruption of flow in the liquid pipeline which avoids the generation of dangerous surge waves. it is a further object of this invention to provide a system for interrupting flow in a liquid pipeline in the shortest possible time without generating dangerous pressure surges. other objects and advantages of this invention will become apparent from the description to follow, particularly when in read in conjunction with the accompanying drawing. summary of the invention in carrying out this invention, there is provided a conventional pipeline valve having the capability of moving from open to closed position at a rapid rate. this may take the form of a ball valve, gate valve, check valve or the like. a smaller by-pass line is provided around the valve to open from the upstream side to the downstream side thereof, and connected in the valve is a surge relief valve of the expansible tube type, which opens to flow when pipeline pressure exceeds a predetermined maximum safe level. hence the pipeline valve may be operated virtually as rapidly as one may desire and, in the event that dangerous increases in upstream pressure are generated as the valve nears closed position, they are simply relieved to the downstream line through the by-pass surge relief valve. then, as soon as such surge conditions are alleviated, the surge relief valve is closed so that only that amount of fluid which would cause the dangerous pressure condition is by-passed to the downstream side of the main valve. brief description of the drawing the drawing is a more or less schematic plan view, partially in section, of the system of this invention. description of a preferred embodiment referring now to the drawing with greater particularity, the flow interrupting system 10 of this invention is installed in a pipeline 12, which is used for the transportation of liquids, such as crude oil or liquid components refined therefrom. installed in the pipeline is a suitable quick-closing valve 14, such as the ball valve shown. while this invention is not restricted to any particular construction, the ball valve may have a cylindrical body band 16 which is bolted at 18 to opposing end closures 20. the end closures carry cylindrical hubs 22 with flow passages 23 therethrough. radial flanges 24 on the hubs 22 are bolted at 26 to complementary flanges 28 on the pipeline 12. carried in the end closures 20 are suitable seat rings 30, which are spring biased at 32 toward sealing engagement with the spherical surface 34 of the valve ball 36 through which a flow passage 38 is formed. resilient seal rings 40 may be provided to seal against the spherical surface 34 and surrounding seal rings 42 are provided to prevent a leak path around the seat rings 30. mounted on a trunnion 43, for turning the ball 36 is any suitable means, such as a hydraulic ram 44 engaging a scotch yoke 46, for rapid movement of the ball 36 from an open position, wherein the flow passage 38 through the valve ball 36 is aligned with flow passages 23 in the valve hubs 22, to a closed position wherein the spherical surface 34 is fully engaged by the seal ring 40 to block flow through the passages 23. connected to the pipeline 12 between opposite sides of the valve 14 is a smaller by-pass line 48 in which is installed a surge relief valve 50 of the expansible tube type, comprising a housing 52 with a slotted sleeve 54 that includes a central circular barrier 56 and upstream and downstream slots 58 and 60. valves of this type are typified by that shown in u.s. patent no. 3,272,470 granted september 13, 1966 to a. u. bryant. a resilient sleeve 62 is stretched over the central barrier 56 to form a seal therearound and a jacket or chamber 64 is provided with a control pressure at a predetermined fixed level as by means of a gas bottle 66. the gas in the bottle 66 and chamber 64 is set at a predetermined, high but safe level for pipeline operation, so that only while such level is exceeded by pipeline pressure and, hence, pressure in the by-pass line 48, the sleeve 62 will expand to allow limited flow to the pipeline 12 downstream of the valve 14. in operation, the pressure in bottle 66 is set as high as possible within safe pipeline operation, and the valve operating meehanisim 44 is set to move the valve closure member 36 at a rate which, at least in the final increments of closing, will tend to generate such pressure levels. thus, the end effect is that there will be a very rapid interruption of flow through the pipeline 12, with just enough by-pass flow through the line 48 to relieve any dangerous conditions. this may result in a small amount of excessive flow to the downstream line, but it is relatively minimal compared to the effects of slow, safe closing of the closure member 36. one may operate the valve ball 36 as rapidly as possible, deliberately generating high pressures to open the by-pass valve 50, allowing a small amount of by-pass flow downstream in preference to greater flow through a slowly operated main valve 14. while this invention has been described in conjunction with a preferred embodiment thereof, it is obvious that modifications and changes therein may be made by those skilled in the art to which it pertains without departing from the spirit and scope of this invention, as defined by the claims appended hereto.
000-730-579-942-982	EP	[ "CN", "WO", "EP", "KR" ]	F01L1/32,F01L3/04	2020-03-11T00:00:00	2020	[ "F01" ]	method of configuring gas exchange valve assembly in internal combustion piston engine and gas exchange valve	the invention relates to a method of configuring a gas exchange valve assembly (10) in an internal combustion piston engine, the method comprising: providing a gas exchange valve (16); providing a valve seat (18); arranging an abrasive wear coating (28) on the base material at the region of the sealing surface (26) of the first one of the gas exchange valve disc (16.2) and the valve seat (18); assembling the valve seat into the gas exchange valve main body; assembling the valve into the gas exchange valve body; the valve (16) is rotated about its longitudinal axis during its lifting and/or closing movement in the state of operation of the engine, such that the sealing surface (26) of the valve breaks away from and/or contacts a valve seat in the gas exchange valve body by means of a movement comprising a rotational component, the sealing surface (26) being machined by the abrasive wear coating (28).	1. a method of configuring a gas exchange valve assembly in an internal combustion piston engine comprising: - providing a gas exchange valve - providing a valve seat characterized by - arranging an abrasive wearing overlay on a base material at a region of a seal ing surface of first one of the gas exchange valve disk and the valve seat, - assembling the valve seat into a gas exchange valve body - assembling the valve into the gas exchange valve body - and while running the engine, rotating the valve around its longitudinal axis dur ing its lift and/or close movements such that the sealing surface of the valve de tach and/or touch the valve seat in the gas exchange valve body by a movement comprising a rotational component, wherein the abrasive wearing overlay ma chines the sealing surface of second one of the valve disk and the valve seat into conformity with each other. 2. a method of configuring a gas exchange valve in an internal combustion piston engine according to claim 1, wherein the rotational position of the valve is changed by rotating it in one direction such that the abrasive overlay makes di mensional changes to sealing surface of the second one of the valve disk and the valve seat until the abrasive overlay is worn off from the sealing surface. 3. a method of configuring a gas exchange valve in an internal combustion piston engine according to claim 1, wherein the method comprises arranging an abrasive wearing overlay on the base material at a region of a sealing surface of the gas exchange valve disk and while running the engine, the valve is rotated around its longitudinal axis during its lift and/or close movements such that the sealing surface of the valve detach and/or touch the valve seat in the gas ex change valve body by a movement comprising a rotational component, wherein the abrasive wearing overlay machines the sealing surface of second one of the valve seat into conformity with the sealing surface of the valve, until the abrasive surface has lost its abrasive effect. 4. a method of configuring a gas exchange valve in an internal combustion piston engine according to claim 1, wherein the abrasive wearing overlay is con figured to wear away from the surface within less than 200 running hours of the engine. 5. a method of configuring a gas exchange valve in an internal combustion piston engine according to claim 1 , wherein arranging an abrasive wearing over lay on a sealing surface comprises arranging a matrix substance and abrasive particles embedded to the matrix substance on the base material. 6. a method of configuring a gas exchange valve in an internal combustion piston engine according to claim 1 , wherein arranging an abrasive wearing over lay on a sealing surface comprises arranging a metal matrix with carbide particles therein as abrasives on the base material. 7. a gas exchange valve of an internal combustion piston engine, compris ing a valve stem and a valve disc at a first end of the stem, wherein the valve disc has a sealing surface, characterized in that a base material of valve disc sealing surface is provided with an abrasive wearing overlay. 8. a gas exchange valve according to claim 7, characterized in that abra sive wearing overlay is configured to wear away from the surface within less than 200 running hours of the engine. 9. a gas exchange valve according to claim 7, characterized in that the base material comprises a hardened layer at its outer surface and the hardened layer is provided with the abrasive wearing overlay on top of it. 10. a gas exchange valve according to claim 7 or 9, characterized in that the abrasive wearing overlay consist of a matrix substance and abrasive particles embedded to the matrix substance. 11. a gas exchange valve according to claim 10, characterized in that the abrasive wearing overlay consist of metal matrix with carbide particles therein as abrasives. 12. a gas exchange valve according to claim 11, characterized in that car- bide is tungsten carbide. 13. a gas exchange valve according to claim 11, characterized in that the carbide grain size is 0.5 -20 pm. 14. a gas exchange valve according to claim 7, characterized in that the abrasive wearing overlay comprises a first abrasive overlay and a second abra- sive overlay, wherein the first abrasive overlay has a first amount of abrasive particles and the second abrasive overlay has a second amount of abrasive par ticles. 15. a gas exchange valve according to claim 7, characterized in that the abrasive wearing overlay comprises a first abrasive overlay and a second abra- sive overlay, wherein the first abrasive overlay has abrasive particles of first grain size and the second abrasive overlay has abrasive particles of second grain size. 16. a gas exchange valve according to claim 7, characterized in that the abrasive wearing overlay comprises a diamond-like carbon (dlc) coating having a thickness more than 45 pm.	method of configuring a gas exchange valve assembly in an internal combustion piston engine and a gas exchange valve technical field [001] the present invention relates to method of configuring a gas exchange valve assembly in an internal combustion piston engine according to the pream ble of claim 1. [002] the present invention relates to gas exchange valve of an internal com bustion piston engine, comprising a valve stem and a valve disc at a first end of the stem, wherein the valve disc has a sealing surface. background art [003] the interface of the combustion engine valve sealing surface and its seat surface are sensitive to non-conformity of the surfaces e.g. due to misalignment and shape deformation either during assembly or via distortions resulting from temperature and pressure during engine operation. the nonconformity of the sur faces may lead to insufficient sealing properties and or wear due to increased contact stress, both resulting in failure of the component requiring pre-mature engine shut down and repair. in particular the effects resulting from engine oper- ation are difficult to predict and compensate. [004] ep0126323 a2 discloses a component for a combustion chamber of a high speed diesel engine, of the type having sliding surfaces provided with wear- protection layers which are used up during the running-in period, and to a process for obtaining such layers. the publication recognizes that for the purpose of ex- tending the life of diesel engines and the maintenance intervals thereof it is sought to encourage a correct running-in by means of the application of wear- protection layers on the sliding surfaces of the mechanical elements forming components of the engine, and in particular those forming the combustion cham ber. there is disclosed a component of a combustion chamber of a diesel engine in particular, of the type comprising at least one sliding surface coated with a wear-protection layer which can be worn away during a running-in period, said wear layer is constituted by a nitride based heat diffusion layer containing a per centage by weight of nitrogen lying between about 4% and 12%. the process for forming a wear-protection layer over a sliding surface of an element forming a component of a combustion chamber of a diesel engine, which can be worn away during the running-in period of the said engine. the layer comprises a phase of gaseous nitriding of the said surface performed with ammonia or nitrogen ionised at a temperature less than or equal to 600°c in conditions such as to obtain on the said surface the formation of a layer of nitrides substantially of 6 - type. even if ep0126323 generally refers to a number components for a combustion cham ber of a diesel engine, the enabling disclosure of the document relates to piston rings of the engine. [005] gb983120 a discloses a surface coating on periphery of piston rings which accelerates the wear rate until the rings are bedded-in. the piston rings according to the document having their peripheral faces covered with a bonding agent, an abrasive and a lubricant. the proposed coating is not suitable for the temperatures and contact pressures in gas exchange valve they are surface smoothing but would not remove a sufficient amount of material to create the dimensional change required. [006] publication us7225781 b2 discloses particularly an engine valve used for opening or closing intake and exhaust paths of an automobile or a motorcycle engine. the document teaches a method for surface treating an engine valve made from titanium or titanium alloy in order to form a hardened coating having improved abrasion and impact resistances. a hardened layer is formed on the surface of the engine valve by furnishing the surface of the engine valve with oxygen as a solid solution and then forming a coating on the surface of the hard ened layer with a pvd process. [007] an object of the invention is to provide method of configuring a gas ex change valve assembly in an internal combustion piston engine by means of which the valve disk and the valve seat of the valve assembly are made in con formity with each other during the engine is running. [008] an object of the invention is to provide a gas exchange valve by means of which the valve disk and the valve seat of the valve assembly are made in conformity with each other during the engine is running. disclosure of the invention [009] objects of the invention can be met substantially as is disclosed in the independent claims and in the other claims describing more details of different embodiments of the invention. [0010] a method of configuring a gas exchange valve assembly in an internal combustion piston engine comprises: - providing a gas exchange valve - providing a valve seat - arranging an abrasive wearing overlay on a base material at a region of a seal ing surface of first one of the gas exchange valve disk and the valve seat, - assembling the valve seat into a gas exchange valve body - assembling the valve into the gas exchange valve body and while running the engine, rotating the valve around its longitudinal axis dur ing its lift and/or close movements such that the sealing surface of the valve de tach and/or touch the valve seat in the gas exchange valve body by a movement comprising a rotational component, wherein the abrasive wearing overlay ma chines the sealing surface of second one of the valve disk and the valve seat into conformity with each other. [0011] this provides an in-situ machining that improves the conformance of valve and valve seat sealing surfaces for engine operation conditions. [0012] according to an embodiment of the invention rotational position of the valve is changed by rotating it in one direction such that the abrasive overlay makes dimensional changes to sealing surface of the second one of the valve disk and the valve seat until the abrasive overlay is worn off from the sealing surface. [0013] according to an embodiment of the invention the method comprises ar ranging an abrasive wearing overlay on the base material at a region of a sealing surface of the gas exchange valve disk and while running the engine, the valve is rotated around its longitudinal axis during its lift and/or close movements such that the sealing surface of the valve detach and/or touch the valve seat in the gas exchange valve body by a movement comprising a rotational component, wherein the abrasive wearing overlay machines the sealing surface of second one of the valve seat into conformity with the sealing surface of the valve until the abrasive surface has lost its abrasive effect. the abrasive effect is lost when the abrasive overlay has worn off or the abrasive particles have been dislodged from the overlay. [0014] the abrasive wearing overlay containing abrasive material on the valve sealing surface machines the respective the seat surface to achieve conform ance of the surfaces during running of the engine. this is achieved by making dimensional changes in the seat surface i.e. in addition to removing any local micro-protrusion on the valve seat surface use of the valve according to the in- vention makes the valve seat sealing surface to conform with the form of the valve disk through positive dimensional changes which changes a median line of a real surface of the valve disk. the overlay comprises abrasive particles of nano scale to micro scale. the abrasive particles will dislodge from the sealing surface during the machining process and will be mainly removed along the exhaust gases and engine lubrication oil. [0015] the abrasive effect can be controlled by controlling the thickness of the coating and/or size of the abrasive particle. due to the abrasive machining the abrasives are detached from the sealing surface, however the coating may be designed to further assist or improve the contact surface friction and wear per- formance. this technique will improve conformance of the contact surfaces and in the progress reducing maximum contact pressure and wear off the valve and valve seat surface and minimizes adhesive contact in the sealing surface during early stage of the engine running process. [0016] according to an embodiment of the invention the abrasive wearing overlay is configured to wear away from the surface within less than 200 running hours of the engine. [0017] according to an embodiment of the invention arranging an abrasive wearing overlay on a sealing surface comprises arranging a matrix substance and abrasive particles embedded to the matrix substance on the base material. [0018] according to an embodiment of the invention arranging an abrasive wearing overlay on a sealing surface comprises arranging a metal matrix with carbide particles therein as abrasives on the base material. [0019] a gas exchange valve of an internal combustion piston engine, com prising a valve stem and a valve disc at a first end of the stem, wherein the valve disc has a sealing surface where a base material of valve disc sealing surface is provided with an abrasive wearing overlay. [0020] according to an embodiment of the invention the base material com prises a hardened layer at its outer surface and the hardened layer is provided with the abrasive wearing overlay on top of it. [0021] according to an embodiment of the invention the abrasive wearing overlay consist of a matrix substance and abrasive particles embedded to the matrix substance. [0022] according to an embodiment of the invention the abrasive wearing overlay consist of metal matrix with carbide particles therein as abrasives. [0023] according to an embodiment of the invention carbide is tungsten car- bide. [0024] according to an embodiment of the invention the carbide grain size is 0.5 -20 pm. [0025] according to an embodiment of the invention the abrasive wearing overlay comprises a first abrasive overlay and a second abrasive overlay, wherein the first abrasive overlay has a first amount of abrasive particles and the second abrasive overlay has a second amount of abrasive particles. [0026] according to an embodiment of the invention the abrasive wearing overlay comprises a first abrasive overlay and a second abrasive overlay, wherein the first abrasive overlay has abrasive particles of first grain size and the second abrasive overlay has abrasive particles of second grain size. [0027] according to an embodiment of the invention the abrasive wearing overlay comprises a diamond-like carbon (dlc) coating having a thickness more than 45 pm. [0028] the overlay may be multi layered e.g. having different sizes of the abra sive particles in each layer. [0029] generally the base material selected for use in the gas exchange valve, particularly the valve disk is considerably hard material minimizing the wear. de- pending on the base material and the abrasive overlay it might be desirable to provide an additional treatment to the base material for improving the attachment of the abrasive overlay. [0030] the abrasive overlay can be obtained on the base material making use of following methods, being not exclusive list but currently considered as advan- tageous methods. physical vapor deposition (pvd) [0031] physical vapor deposition (pvd) describes a variety of vacuum deposi tion methods which can be used to produce thin films and coatings. pvd is char- acterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. the most common pvd processes are sputtering and evaporation. pvd is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. some examples of implementing pvd method are as follows. [0032] cathodic arc deposition, in which a high-power electric arc discharged at the source material blasts away some into highly ionized vapor to be deposited onto the workpiece. [0033] electron beam physical vapor deposition, in which the material to be de posited is heated to a high vapor pressure by electron bombardment in high vac uum and is transported by diffusion to be deposited by condensation on the cooler workpiece. [0034] evaporative deposition in which the material to be deposited is heated to a high vapor pressure by electrical resistance heating in high vacuum. [0035] close-space sublimation, where the material and substrate are placed close to one another and radiatively heated. [0036] pulsed laser deposition, in which a high-power laser ablates material from the target into a vapor. [0037] sputter deposition, in which a glow plasma discharge bombards the ma terial sputtering some away as a vapor for subsequent deposition. [0038] pulsed electron deposition, whereas highly energetic pulsed electron beam ablates material from the target generating a plasma stream under nonequilibrium conditions. [0039] according to an embodiment the abrasive wearing layer comprises nano meter and/or micro-meter sized diamonds embedded in pvd coating. diamond-like carbon coating using pvd coating [0040] diamond-like carbon (dlc) is a class of amorphous carbon material that displays some of the typical properties of diamond. dlc is usually applied as coatings to other materials that could benefit from some of those properties. the various forms of dlc can be applied to almost any material that is compatible with a vacuum environment. [0041] even if dlc coatings are generally applied as a wear or corrosion protection coating, it has been discovered that if the coating is applied to form an increased thickness it exhibits a reverse behavior and becomes abrasive to an extent applicable to the invention. suitable thickness to obtain the effect required to implement the invention is 45 micrometers or more. [0042] according to an embodiment the abrasive wearing layer comprises nano meter and/or micro-meter sized diamonds embedded in dlc coating. [0043] according to an embodiment the abrasive wearing layer comprises nano meter and/or micro-meter sized diamonds embedded in coating provided by a combination of cold spray coating and dlc coating. cold spray of tungsten carbide composite coating [0044] a cold spray coating technology is a coating deposition method. solid powders are accelerated in a supersonic gas jet to velocities up to ca. 1200 m/s. during impact with the substrate, particles undergo plastic deformation and adhere to the surface. the kinetic energy of the particles, supplied by the expansion of the gas, is converted to plastic deformation energy during bonding.. [0045] the abrasive overlay comprises a metallic matrix into which carbides are embedded forming the abrasive part of the overlay. metallic matrix is arranged to have a hardness of 200 - 350 hv and the carbides hardness is around 1000- 2000hv. metallic matrix suitable for use in connection with the valve seat overlay according to the invention is nicrbsi-alloy or cu based alloy. carbide may be e.g. tungsten carbide, wc. the carbide grain size is fee-between 0.5 - 20 micrometers. the carbides will initially be fully embedded in the coating and as the metal matrix starts wearing carbides will be protruding and act as abrasives. also, a friction enhancing materials may be added to the matrix [0046] according to an embodiment the abrasive wearing layer comprises nano- meter and/or micro-meter sized diamonds embedded in cold spray coating. smart coating [0047] a graded coating or sometimes referred to as a smart coating is applica ble in connection with the present invention. it is technically a monolayer coating but its composition changes gradual over its thickness. smart coating can be obtained by using e.g. thermal and cold spray techniques. the smart coating can be tailored to needs at a certain time in the life of the coating by adding different abrasive and matrix compositions to the coating during the process. there can be different sizes of abrasives, different mixture grades of the metal matrix or additional material to improve thermal properties e.g. copper or even solid lubricants to improve tribological properties of the abrasive wearing overlay. [0048] it is possible to obtain several advantageous effects. firstly it is possible to improve running in and conformance of engine valves and valve seat surfaces. secondly it is possible to reduce maximum contact pressure and wear off the valve/valve seat surface due to better conformance of the sealing surfaces and also minimize adhesive contact during early stage of the running in process. the abrasive particles will disappear during the engine is used. [0049] the abrasive wearing overlay can be multi layered e.g. having different sizes of the abrasive particles in each layer. [0050] the base material of both components, namely valve disc and valve seat, are extremely stiff, such that they will not conform elastically to each other, there fore the abrasive method is needed to embed the surfaces with each other. [0051] the exemplary embodiments of the invention presented in this patent ap plication are not to be interpreted to pose limitations to the applicability of the appended claims. the verb "to comprise" is used in this patent application as an open limitation that does not exclude the existence of also unrecited features. the features recited in depending claims are mutually freely combinable unless otherwise explicitly stated. the novel features which are considered as charac teristic of the invention are set forth in particular in the appended claims. 3d printing 3d printing method or a so called hybrid approach where a 3d printed overlay is created on top of a metallic matrix can be utilized with success. the 3d printed metals generally show a rough, and therefore abrasive surface, however using 3d printing similar material approach to the spray coating could be used. brief description of drawings [0052] in the following, the invention will be described with reference to the ac companying exemplary, schematic drawings, in which figure 1 depicts schematically valve assembly in which the sealing sur-face of the valve is provided with an abrasive overlay, figure 2 depicts schematically a valve assembly in which the sealing surface of the valve seat is provided with an abrasive overlay, figure 3 depicts schematically a structure of the sealing surface provided with an abrasive overlay according to an embodiment of the invention, and figure 4 depicts schematically a structure of the sealing surface provided with an abrasive overlay according to another embodiment of the invention. detailed description of drawings [0053] figure 1 depicts schematically gas exchange valve assembly 10 of an internal combustion piston engine arranged to a cylinder head 12 of the engine. the gas exchange valve assembly is configured to controllably admit entry of combustion air into a combustion chamber 14 of the engine and removal of ex haust gases from the combustion chamber 14. the gas exchange valve assem- bly comprises a gas exchange valve 16, which may called simply as a valve, and a valve seat 18. the valve seat 18 is a ring-like member which has a sealing surface against which an intake or an exhaust valve rests during the stage of the engine operating cycle when that valve is closed. the sealing surface prevents gas leaking from the combustion chamber to the intake air receiver and to the exhaust gas manifold and it also functions as heat transfer surface for releasing heat from the valve 16 to the cylinder head 12. the valve 16 comprises a valve stem 16.1 and a valve disk 16.2 and a first end of the stem 16.1. the valve is supported by a valve guide 22 in the cylinder head. [0054] the valve assembly is also provided with a valve rotator 20 which is con figured to rotate the valve around its longitudinal axis a by positive action, while the valve is moved in the direction of the longitudinal axis a. the valve seat 18 is coaxial with the valve 16. the valve rotator may be of a type know as such for a skilled person in the art, for example a so called ball spring rotator, or such as is disclosed e.g. in the publication ep0768450 b1 or de102013013229 a1 the de scriptions of which are hereby incorporated by reference. [0055] a so-called “rotocap” valve rotator incorporates a ball-retaining plate with ramped circumferential grooves for balls to roll along. a small spring pushes each of these balls to one side. a belleville-type dished spring washer fits over these balls to form an upper race, which is supported on its outer edge by a spring-seat retainer. this retainer holds the whole assembly together and also provides a seat for the helical-coil valve springs. in the closed position of the valve, the dished spring washer is suspended between the spring-seat retainer and the ball- retainer, so that the balls move freely to a first end of the ramp and abut against the end of the groove. during opening stage of the valve, the dished spring washer deflects with the increase in the compression load on the valve spring. the outer edge of the dished washer bears against the spring-seat retainer as before, but the inner part of the washer now bears against the balls and hence pushes them along their ramps. the ramps are so shaped that, as contact with the washer is maintained, the spring-seat retainer is rotated and hence the valve is rotated by the same amount. as the valve closes, the washer comes back to its original position between the spring-seat retainer and the ball-retainer. this releases the load on the balls due to which the small bias springs now push the balls up their ramps and thereby bring the spring-seat retainer and the valve as sembly back to its starting position. [0056] the valve disc is provided with a sealing surface 24 at its radial periphery region, which surface is typically at an angle with respect to the longitudinal axis a of the valve. respectively, the valve seat 18 is provided with a sealing surface 26 which is ideally parallel to and in conformity with the sealing surface 24 of the valve. the valve disk 16.2 is made of a hard base alloy material, which is durable against wear. an abrasive wearing overlay 28 is arranged over the base material at the region of at least the sealing surface 24 of the valve 16. the sealing surface of the valve 16 may comprise a hardened layer which is provided with the abra sive wearing overlay 28. the valve 16 is made of material which experiences minimal deformations during its lifespan and is machined accurately to intended dimensions. [0057] in the figure 1 the valve 16 is at a position where it has just started its lift i.e. opening movement the sealing surface 24 of the valve has detached from the sealing surface 26 of the valve seat 18. the area of the sealing surfaces is shown in more detailed in the enlarged view encircled in the figure. in the view a there is indicated a cut-out line ll-ll which refer to the figure 2, in which the valve seat 18 is shown along the cut-out ll-ll. the view a depicts exemplary an angular flaw or non-conformance 30 in the seat surface 26. as is depicted in figure 2 the non-conformance may be a local, non-symmetrical deviation from a circular shape at a plane in the direction of the longitudinal axis a. of course, the present invention is applicable regardless of the shape of the non-conformance. the gas exchange valve assembly in an internal combustion piston engine is configured for use such that firstly a gas exchange valve 16 and a valve seat 18 are provided and an abrasive wearing overlay is arranged on a base material at a region of a sealing surface of first one of the gas exchange valve disk and the valve seat. in particularly referring to the figure 1 the abrasive wearing overlay is arranged on the sealing surface of the gas exchange valve disk 16.2. the abrasive wearing overlay is arranged to cover the area of the valve 16 which is intended to form its sealing surface. in this case the dimensional accuracy of the valve disk is im portant because the valve seat is accommodated according to the shape of the valve disk. next, the valve seat 18 and the valve 16 are assembled into a gas exchange valve body. while running the engine, the valve 16 is rotated around its longitu dinal axis during its lifting and/or closing movements such that the sealing surface 24 of the valve detach and/or touch the sealing surface 26 valve seat 18 in the gas exchange valve body by a movement comprising a rotational component. thus when the abrasive wearing overlay simultaneously moves axially and an gularly in respect to the longitudinal axis, it also machines the sealing surface of second one of the valve disk and the valve seat into conformity with each other by forming a rotational fit between the surfaces. in particularly referring to the figure 1 the abrasive wearing overlay arranged on the sealing surface of the gas exchange valve disk 16.2 machines the sealing surface 26 of the valve seat 18 into conformity with the sealing surface 24 of the valve disk 16.2. the rotational position of the valve 16 is changed by rotating it in one direction. the abrasive overlay makes dimensional changes to sealing surface until the abrasive overlay or the abrasive material in the overlay is worn off from the sealing surface. [0058] figure 3 depicts schematically a valve assembly in which the sealing sur face of the valve seat is provided with an abrasive overlay 28. this embodiment is applicable when the valve seat is made of material which experiences minimal deformations during its lifespan and is machined accurately to intended dimen sions. [0059] figure 4 depicts schematically a structure of the base material 40, 41 pro vided with an abrasive overlay 28 according to an embodiment of the invention. the base material comprises a substrate i.e. the material of the base material of the valve disk 16.1 (or alternative the valve seat 18) which may have its outer surface area 41 hardened. the outer surface are 41 is a so called working sur face which comes to use when the abrasive overlay has been worn out. the outer surface 41 can be hardened making use of methods know as such, like a heat treatments, shot peening. a thick (advantageously 1-3mm) hard intermedi ate coating can be applied between the base material and the abrasive coating. the intermediate coating can be manufactured via plasma transferred arc method or laser cladding. the intermediate coating material can be stellite or similar. [0060] figure 5 depicts schematically a structure of the base material 40, 41 pro vided with an abrasive overlay 28’, 28” according to another embodiment of the invention. the abrasive wearing overlay 28’, 28” has different abrasive properties at its top region 28” and bottom region 28’. like in the embodiment of the figure 4 the base material comprises a substrate i.e. the material of the base material of the valve disk 16.1 (or alternative the valve seat 18) which may have its outer surface area 41 hardened. the outer surface are 41 is a so called working sur face which comes to use when the abrasive wearing overlay has been worn out. the abrasive wearing overlay 28’, 28” may optionally comprise distinct layers having different abrasive properties. the abrasive wearing overlay 28’, 28” may also comprise regions from bottom to top having gradually changing abrasive properties. the different abrasive properties may be accomplished be providing different particle, or grain size of the abrasive particles and/or different amount of particles in the overlay. [0061] the abrasive wearing overlay comprises a first abrasive overlay 28’ and a second abrasive overlay 28” on top of the first abrasive overlay, wherein the first abrasive overlay 28’ has abrasive particles of first grain size and the second abrasive overlay 28” has abrasive particles of second grain size, greater than the first grain size. [0062] the abrasive wearing overlay comprises a first abrasive overlay 28’ and a second abrasive overlay 28”, wherein the first abrasive overlay 28’ has a fist amount, i.e. concentration of abrasive particles and the second abrasive over lay 28” has a second amount i.e. concentration of abrasive particles, being more than the first amount of abrasive particles. [0063] as an example of the method according to the invention the abrasive wearing overlays may be formed as follows: the base material can be any suit able hard material selected in a view of minimizing wear and deformations in the use but also ensuring adequate corrosion resistance. suitable materials are such as martensitic stainless steel, silicon-chromium steels, austenitic chromium- nickel steels or nickel-based super alloys. the base material may be hardened making use of suitable methods, such as heat treatment, shot peening, surface rolling etc. the following table shows some applicable selections for abrasive overlays in the method of the present invention. [0064] while the invention has been described herein by way of examples in connection with what are, at present, considered to be the most preferred em- bodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover various combinations or modifications of its features, and several other applications included within the scope of the in vention, as defined in the appended claims. the details mentioned in connection with any embodiment above may be used in connection with another embodi ment when such combination is technically feasible.
004-819-334-333-958	US	[ "US" ]	H01L51/00,C07F13/00,H01L51/50	2013-12-04T00:00:00	2013	[ "H01", "C07" ]	organic electroluminescent materials and devices	a novel compound having a formula re(l a )(l b ), wherein re is a rhenium(i) metal, wherein l a is a monoanionic tridentate ligand, wherein l b is a neutral tridentate ligand, and wherein l a and l b are optionally linked together to form a hexadentate ligand is disclosed.	1. a compound having a formula re(l a )(l b ), wherein re is a rhenium(i) metal; wherein l a is a monoanionic tridentate ligand having a formula selected from the group consisting of wherein l b is a neutral tridentate ligand having a formula wherein x 1 , x 2 , x 3 , x 4 , and x 5 are each independently a neutral coordinating atom selected from the group consisting of carbon, phosphorus, and nitrogen; wherein at least one of x 1 , x 2 , x 3 , x 4 , and x 5 is an imidazole derived carbene neutral carbon; wherein y is a monoanionic coordinating atom selected from the group consisting of carbon, oxygen, sulfur, and nitrogen; wherein the dash lines show the connection points to re; and wherein l a and l b are optionally linked together to form a hexadentate ligand. 2. the compound of claim 1 , wherein the neutral carbon is imidazole or benzimidazole carbene; wherein the neutral phosphorus is a phosphorus atom of a trisubstituted phosphine; and wherein the neutral nitrogen is an sp 2 nitrogen atom of n-heterocyclic ring selected from the group consisting of pyridine, pyrimidine, imidazole, benzoimidazole, pyrazole, oxazole, and triazole. 3. the compound of claim 1 , wherein the monoanionic coordinating carbon is an sp 2 carbon atom selected from the group consisting of benzene, pyridine, furan, thiophene, and pyrrole. 4. the compound of claim 1 , wherein l a has a formula selected from the group consisting of: wherein r b , r c , and r d may represent from mono-substitution to the possible maximum number of substitution, or no substitution; wherein r a , r b , r c , r d , r e , r f and r g are each independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two adjacent substituents of r a , r b , r c , r d , r e , r f and r g are optionally joined to form a ring or form a multidentate ligand. 5. the compound of claim 1 , wherein l a has a formula selected from the group consisting of: 6. the compound of claim 1 , wherein l b has a formula selected from the group consisting of: wherein r 1 , r 2 , and r 3 may represent from mono-substitution to the possible maximum number of substitution, or no substitution; wherein r 1 , r 2 , r 3 , r 4 , and r 5 are each independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two adjacent substituents of r 1 , r 2 , r 3 , r 4 , and r 5 are optionally joined to form a ring or form a multidentate ligand. 7. the compound of claim 1 , wherein l b has a formula selected from the group consisting of: 8. the compound of claim 1 , wherein the compound is selected from the group consisting of cpd #l al b1l a1l b12l a2l b13l a3l b14l a4l b15l a5l b16l a6l b17l a7l b18l a8l b19l a9l b110l a10l b111l a11l b112l a12l b113l a13l b114l a14l b115l a15l b116l a16l b117l a17l b118l a18l b119l a19l b120l a20l b121l a21l b122l a22l b123l a23l b124l a24l b125l a25l b126l a26l b127l a27l b128l a28l b129l a29l b130l a30l b131l a31l b132l a32l b133l a33l b134l a34l b135l a35l b136l a36l b137l a37l b138l a38l b139l a39l b140l a40l b141l a41l b142l a42l b143l a43l b144l a44l b145l a45l b146l a46l b147l a47l b148l a48l b149l a49l b150l a50l b151l a51l b152l a52l b153l a53l b154l a54l b155l a55l b156l a56l b157l a57l b158l a58l b159l a59l b160l a60l b161l a61l b162l a62l b163l a63l b164l a64l b165l a65l b166l a66l b167l a67l b168l a68l b169l a69l b170l a70l b171l a71l b172l a72l b173l a73l b174l a74l b175l a75l b176l a76l b177l a77l b178l a78l b179l a79l b180l a80l b181l a81l b182l a82l b183l a83l b184l a84l b185l a85l b186l a86l b187l a87l b188l a88l b189l a89l b190l a90l b191l a91l b192l a92l b193l a93l b194l a94l b195l a95l b196l a1l b297l a2l b298l a3l b299l a4l b2100l a5l b2101l a6l b2102l a7l b2103l a8l b2104l a9l b2105l a10l b2106l a11l b2107l a12l b2108l a13l b2109l a14l b2110l a15l b2111l a16l b2112l a17l b2113l a18l b2114l a19l b2115l a20l b2116l a21l b2117l a22l b2118l a23l b2119l a24l b2120l a25l b2121l a26l b2122l a27l b2123l a28l b2124l a29l b2125l a30l b2126l a31l b2127l a32l b2128l a33l b2129l a34l b2130l a35l b2131l a36l b2132l a37l b2133l a38l b2134l a39l b2135l a40l b2136l a41l b2137l a42l b2138l a43l b2139l a44l b2140l a45l b2141l a46l b2142l a47l b2143l a48l b2144l a49l b2145l a50l b2146l a51l b2147l a52l b2148l a53l b2149l a54l b2150l a55l b2151l a56l b2152l a57l b2153l a58l b2154l a59l b2155l a60l b2156l a61l b2157l a62l b2158l a63l b2159l a64l b2160l a65l b2161l a66l b2162l a67l b2163l a68l b2164l a69l b2165l a70l b2166l a71l b2167l a72l b2168l a73l b2169l a74l b2170l a75l b2171l a76l b2172l a77l b2173l a78l b2174l a79l b2175l a80l b2176l a81l b2177l a82l b2178l a83l b2179l a84l b2180l a85l b2181l a86l b2182l a87l b2183l a88l b2184l a89l b2185l a90l b2186l a91l b2187l a92l b2188l a93l b2189l a94l b2190l a95l b2191l a1l b3192l a2l b3193l a3l b3194l a4l b3195l a5l b3196l a6l b3197l a7l b3198l a8l b3199l a9l b3200l a10l b3201l a11l b3202l a12l b3203l a13l b3204l a14l b3205l a15l b3206l a16l b3207l a17l b3208l a18l b3209l a19l b3210l a20l b3211l a21l b3212l a22l b3213l a23l b3214l a24l b3215l a25l b3216l a26l b3217l a27l b3218l a28l b3219l a29l b3220l a30l b3221l a31l b3222l a32l b3223l a33l b3224l a34l b3225l a35l b3226l a36l b3227l a37l b3228l a38l b3229l a39l b3230l a40l b3231l a41l b3232l a42l b3233l a43l b3234l a44l b3235l a45l b3236l a46l b3237l a47l b3238l a48l b3239l a49l b3240l a50l b3241l a51l b3242l a52l b3243l a53l b3244l a54l b3245l a55l b3246l a56l b3247l a57l b3248l a58l b3249l a59l b3250l a60l b3251l a61l b3252l a62l b3253l a63l b3254l a64l b3255l a65l b3256l a66l b3257l a67l b3258l a68l b3259l a69l b3260l a70l b3261l a71l b3262l a72l b3263l a73l b3264l a74l b3265l a75l b3266l a76l b3267l a77l b3268l a78l b3269l a79l b3270l a80l b3271l a81l b3272l a82l b3273l a83l b3274l a84l b3275l a85l b3276l a86l b3277l a87l b3278l a88l b3279l a89l b3280l a90l b3281l a91l b3282l a92l b3283l a93l b3284l a94l b3285l a95l b3286l a1l b4287l a2l b4288l a3l b4289l a4l b4290l a5l b4291l a6l b4292l a7l b4293l a8l b4294l a9l b4295l a10l b4296l a11l b4297l a12l b4298l a13l b4299l a14l b4300l a15l b4301l a16l b4302l a17l b4303l a18l b4304l a19l b4305l a20l b4306l a21l b4307l a22l b4308l a23l b4309l a24l b4310l a25l b4311l a26l b4312l a27l b4313l a28l b4314l a29l b4315l a30l b4316l a31l b4317l a32l b4318l a33l b4319l a34l b4320l a35l b4321l a36l b4322l a37l b4323l a38l b4324l a39l b4325l a40l b4326l a41l b4327l a42l b4328l a43l b4329l a44l b4330l a45l b4331l a46l b4332l a47l b4333l a48l b4334l a49l b4335l a50l b4336l a51l b4337l a52l b4338l a53l b4339l a54l b4340l a55l b4341l a56l b4342l a57l b4343l a58l b4344l a59l b4345l a60l b4346l a61l b4347l a62l b4348l a63l b4349l a64l b4350l a65l b4351l a66l b4352l a67l b4353l a68l b4354l a69l b4355l a70l b4356l a71l b4357l a72l b4358l a73l b4359l a74l b4360l a75l b4361l a76l b4362l a77l b4363l a78l b4364l a79l b4365l a80l b4366l a81l b4367l a82l b4368l a83l b4369l a84l b4370l a85l b4371l a86l b4372l a87l b4373l a88l b4374l a89l b4375l a90l b4376l a91l b4377l a92l b4378l a93l b4379l a94l b4380l a95l b4381l a1l b5382l a2l b5383l a3l b5384l a4l b5385l a5l b5386l a6l b5387l a7l b5388l a8l b5389l a9l b5390l a10l b5391l a11l b5392l a12l b5393l a13l b5394l a14l b5395l a15l b5396l a16l b5397l a17l b5398l a18l b5399l a19l b5400l a20l b5401l a21l b5402l a22l b5403l a23l b5404l a24l b5405l a25l b5406l a26l b5407l a27l b5408l a28l b5409l a29l b5410l a30l b5411l a31l b5412l a32l b5413l a33l b5414l a34l b5415l a35l b5416l a36l b5417l a37l b5418l a38l b5419l a39l b5420l a40l b5421l a41l b5422l a42l b5423l a43l b5424l a44l b5425l a45l b5426l a46l b5427l a47l b5428l a48l b5429l a49l b5430l a50l b5431l a51l b5432l a52l b5433l a53l b5434l a54l b5435l a55l b5436l a56l b5437l a57l b5438l a58l b5439l a59l b5440l a60l b5441l a61l b5442l a62l b5443l a63l b5444l a64l b5445l a65l b5446l a66l b5447l a67l b5448l a68l b5449l a69l b5450l a70l b5451l a71l b5452l a72l b5453l a73l b5454l a74l b5455l a75l b5456l a76l b5457l a77l b5458l a78l b5459l a79l b5460l a80l b5461l a81l b5462l a82l b5463l a83l b5464l a84l b5465l a85l b5466l a86l b5467l a87l b5468l a88l b5469l a89l b5470l a90l b5471l a91l b5472l a92l b5473l a93l b5474l a94l b5475l a95l b5476l a1l b6477l a2l b6478l a3l b6479l a4l b6480l a5l b6481l a6l b6482l a7l b6483l a8l b6484l a9l b6485l a10l b6486l a11l b6487l a12l b6488l a13l b6489l a14l b6490l a15l b6491l a16l b6492l a17l b6493l a18l b6494l a19l b6495l a20l b6496l a21l b6497l a22l b6498l a23l b6499l a24l b6500l a25l b6501l a26l b6502l a27l b6503l a28l b6504l a29l b6505l a30l b6506l a31l b6507l a32l b6508l a33l b6509l a34l b6510l a35l b6511l a36l b6512l a37l b6513l a38l b6514l a39l b6515l a40l b6516l a41l b6517l a42l b6518l a43l b6519l a44l b6520l a45l b6521l a46l b6522l a47l b6523l a48l b6524l a49l b6525l a50l b6526l a51l b6527l a52l b6528l a53l b6529l a54l b6530l a55l b6531l a56l b6532l a57l b6533l a58l b6534l a59l b6535l a60l b6536l a61l b6537l a62l b6538l a63l b6539l a64l b6540l a65l b6541l a66l b6542l a67l b6543l a68l b6544l a69l b6545l a70l b6546l a71l b6547l a72l b6548l a73l b6549l a74l b6550l a75l b6551l a76l b6552l a77l b6553l a78l b6554l a79l b6555l a80l b6556l a81l b6557l a82l b6558l a83l b6559l a84l b6560l a85l b6561l a86l b6562l a87l b6563l a88l b6564l a89l b6565l a90l b6566l a91l b6567l a92l b6568l a93l b6569l a94l b6570l a95l b6571l a1l b7\572l a2l b7573l a3l b7574l a4l b7575l a5l b7576l a6l b7577l a7l b7578l a8l b7579l a9l b7580l a10l b7581l a11l b7582l a12l b7583l a13l b7584l a14l b7585l a15l b7586l a16l b7587l a17l b7588l a18l b7589l a19l b7590l a20l b7591l a21l b7592l a22l b7593l a23l b7594l a24l b7595l a25l b7596l a26l b7597l a27l b7598l a28l b7599l a29l b7600l a30l b7601l a31l b7602l a32l b7603l a33l b7604l a34l b7605l a35l b7606l a36l b7607l a37l b7608l a38l b7609l a39l b7610l a40l b7611l a41l b7612l a42l b7613l a43l b7614l a44l b7615l a45l b7616l a46l b7617l a47l b7618l a48l b7619l a49l b7620l a50l b7621l a51l b7622l a52l b7623l a53l b7624l a54l b7625l a55l b7626l a56l b7627l a57l b7628l a58l b7629l a59l b7630l a60l b7631l a61l b7632l a62l b7633l a63l b7634l a64l b7635l a65l b7636l a66l b7637l a67l b7638l a68l b7639l a69l b7640l a70l b7641l a71l b7642l a72l b7643l a73l b7644l a74l b7645l a75l b7646l a76l b7647l a77l b7648l a78l b7649l a79l b7650l a80l b7651l a81l b7652l a82l b7653l a83l b7654l a84l b7655l a85l b7656l a86l b7657l a87l b7658l a88l b7659l a89l b7660l a90l b7661l a91l b7662l a92l b7663l a93l b7664l a94l b7665l a95l b7666l a1l b8667l a2l b8668l a3l b8669l a4l b8670l a5l b8671l a6l b8672l a7l b8673l a8l b8674l a9l b8675l a10l b8676l a11l b8677l a12l b8678l a13l b8679l a14l b8680l a15l b8681l a16l b8682l a17l b8683l a18l b8684l a19l b8685l a20l b8686l a21l b8687l a22l b8688l a23l b8689l a24l b8690l a25l b8691l a26l b8692l a27l b8693l a28l b8694l a29l b8695l a30l b8696l a31l b8697l a32l b8698l a33l b8699l a34l b8700l a35l b8701l a36l b8702l a37l b8703l a38l b8704l a39l b8705l a40l b8706l a41l b8707l a42l b8708l a43l b8709l a44l b8710l a45l b8711l a46l b8712l a47l b8713l a48l b8714l a49l b8715l a50l b8716l a51l b8717l a52l b8718l a53l b8719l a54l b8720l a55l b8721l a56l b8722l a57l b8723l a58l b8724l a59l b8725l a60l b8726l a61l b8727l a62l b8728l a63l b8729l a64l b8730l a65l b8731l a66l b8732l a67l b8733l a68l b8734l a69l b8735l a70l b8736l a71l b8737l a72l b8738l a73l b8739l a74l b8740l a75l b8741l a76l b8742l a77l b8743l a78l b8744l a79l b8745l a80l b8746l a81l b8747l a82l b8748l a83l b8749l a84l b8750l a85l b8751l a86l b8752l a87l b8753l a88l b8754l a89l b8755l a90l b8756l a91l b8757l a92l b8758l a93l b8759l a94l b8760l a95l b8761l a1l b9762l a2l b9763l a3l b9764l a4l b9765l a5l b9766l a6l b9767l a7l b9768l a8l b9769l a9l b9770l a10l b9771l a11l b9772l a12l b9773l a13l b9774l a14l b9775l a15l b9776l a16l b9777l a17l b9778l a18l b9779l a19l b9780l a20l b9781l a21l b9782l a22l b9783l a23l b9784l a24l b9785l a25l b9786l a26l b9787l a27l b9788l a28l b9789l a29l b9790l a30l b9791l a31l b9792l a32l b9793l a33l b9794l a34l b9795l a35l b9796l a36l b9797l a37l b9798l a38l 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a13l b787329l a14l b787330l a15l b787331l a16l b787353l a38l b787354l a39l b787355l a40l b787356l a41l b787357l a42l b787358l a43l b787359l a44l b787360l a45l b787361l a46l b787362l a47l b787363l a48l b787364l a49l b787365l a50l b787366l a51l b787367l a52l b787368l a53l b787369l a54l b787370l a55l b787371l a56l b787372l a57l b787373l a58l b787374l a59l b787375l a60l b787376l a61l b787411l a1l b797412l a2l b797413l a3l b797414l a4l b797415l a5l b797416l a6l b797417l a7l b797418l a8l b797419l a9l b797420l a10l b797421l a11l b797422l a12l b797423l a13l b797424l a14l b797425l a15l b797426l a16l b797448l a38l b797449l a39l b797450l a40l b797451l a41l b797452l a42l b797453l a43l b797454l a44l b797455l a45l b797456l a46l b797457l a47l b797458l a48l b797459l a49l b797460l a50l b797461l a51l b797462l a52l b797463l a53l b797464l a54l b797465l a55l b797466l a56l b797467l a57l b797468l a58l b797469l a59l b797470l a60l b797471l a61l b797506l a1l b807507l a2l b807508l a3l b807509l a4l b807510l a5l b807511l a6l b807512l a7l b807513l a8l b807514l a9l b807515l a10l b807516l a11l b807517l a12l b807518l a13l b807519l a14l b807520l a15l b807521l a16l b807543l a38l b807544l a39l b807545l a40l b807546l a41l b807547l a42l b807548l a43l b807549l a44l b807550l a45l b807551l a46l b807552l a47l b807553l a48l b807554l a49l b807555l a50l b807556l a51l b807557l a52l b807558l a53l b807559l a54l b807560l a55l b807561l a56l b807562l a57l b807563l a58l b807564l a59l b807565l a60l b807566l a61l b807601l a1l b817602l a2l b817603l a3l b817604l a4l b817605l a5l b817606l a6l b817607l a7l b817608l a8l b817609l a9l b817610l a10l b817611l a11l b817612l a12l b817613l a13l b817614l a14l b817615l a15l b817616l a16l b817638l a38l b817639l a39l b817640l a40l b817641l a41l b817642l a42l b817643l a43l b817644l a44l b817645l a45l b817646l a46l b817647l a47l b817648l a48l b817649l a49l b817650l a50l b817651l a51l b817652l a52l b817653l a53l b817654l a54l b817655l a55l b817656l a56l b817657l a57l b817658l a58l b817659l a59l b817660l a60l b817661l a61l b817696l a1l b827697l a2l b827698l a3l b827699l a4l b827700l a5l b827701l a6l b827702l a7l b827703l a8l b827704l a9l b827705l a10l b827706l a11l b827707l a12l b827708l a13l b827709l a14l b827710l a15l b827711l a16l b827733l a38l b827734l a39l b827735l a40l b827736l a41l b827737l a42l b827738l a43l b827739l a44l b827740l a45l b827741l a46l b827742l a47l b827743l a48l b827744l a49l b827745l a50l b827746l a51l b827747l a52l b827748l a53l b827749l a54l b827750l a55l b827751l a56l b827752l a57l b827753l a58l b827754l a59l b827755l a60l b827756l a61l b828076l a1l b868077l a2l b868078l a3l b868079l a4l b868080l a5l b868081l a6l b868082l a7l b868083l a8l b868084l a9l b868085l a10l b868086l a11l b868087l a12l b868088l a13l b868089l a14l b868090l a15l b868091l a16l b868113l a38l b868114l a39l b868115l a40l b868116l a41l b868117l a42l b868118l a43l b868119l a44l b868120l a45l b868121l a46l b868122l a47l b868123l a48l b868124l a49l b868125l a50l b868126l a51l b868127l a52l b868128l a53l b868129l a54l b868130l a55l b868131l a56l b868132l a57l b868133l a58l b868134l a59l b868135l a60l b868136l a61l b86 . 9. the compound of claim 1 , wherein each of x 3 and x 4 is an imidazole derived carbene neutral carbon. 10. the compound of claim 1 , wherein each of x 3 and x 5 is an imidazole derived carbene neutral carbon. 11. the compound of claim 10 , wherein x 4 is a neutral nitrogen is an sp 2 nitrogen atom of an n-heterocyclic ring selected from the group consisting of pyridine, pyrimidine, imidazole, benzoimidazole, pyrazole, oxazole, and triazole; and wherein each of x 1 and x 2 is an imidazole derived carbene neutral carbon. 12. a first device comprising a first organic light emitting device, the first organic light emitting device comprising: an anode; a cathode; and an organic layer, disposed between the anode and the cathode, comprising a compound having a formula re(l a )(l b ): wherein re is a rhenium(i) metal; wherein l a is a monoanionic tridentate ligand having a formula selected from the group wherein l b is a neutral tridentate ligand having a formula wherein x 1 , x 2 , x 3 , x 4 , and x 5 are each independently a neutral coordinating atom selected from the group consisting of carbon, phosphorus, and nitrogen; wherein at least one of x 1 , x 2 , x 3 , x 4 , and x 5 is an imidazole derived carbene neutral carbon; wherein y is a monoanionic coordinating atom selected from the group consisting of carbon, oxygen, sulfur, and nitrogen; wherein the dash lines show the connection points to re; and wherein l a and l b are optionally linked together to form a hexadentate ligand. 13. the first device of claim 12 , wherein the organic layer is an emissive layer and the compound is an emissive dopant. 14. the first device of claim 12 , wherein the organic layer is an emissive layer and the compound is a non-emissive dopant. 15. the first device of claim 12 , wherein the organic layer is a charge transporting layer and the compound is a charge transporting material in the organic layer. 16. the first device of claim 12 , wherein the organic layer is a charge injecting layer and the compound is a charge injecting material in the organic layer. 17. the first device of claim 12 , wherein the organic layer is a blocking layer and the compound is a blocking material in the organic layer. 18. the first device of claim 12 , wherein the organic layer further comprises a host material. 19. the first device of claim 18 , wherein the host material comprises a triphenylene containing benzo-fused thiophene or benzo-fused furan; wherein any substituent in the host material is an unfused substituent independently selected from the group consisting of c n h 2n+1 , oc n h 2n+1 , oar 1 , n(c n h 2n+1 ) 2 , n(ar 1 )(ar 2 ), ch=ch−c n h 2n+1 , c≡cc n h 2n+1 , ar 1 , ar 1 -ar 2 , c n h 2n -ar 1 , or no substitution; wherein n is from 1 to 10; and wherein ar 1 and ar 2 are independently selected from the group consisting of benzene, biphenyl, naphthalene, triphenylene, carbazole, and heteroaromatic analogs thereof. 20. a formulation comprising a compound having the formula re(l a )(l b ): wherein re is a rhenium(i) metal; wherein l a is a monoanionic tridentate ligand having a formula selected from the group consisting of wherein l b is a neutral tridentate ligand having a formula wherein x 1 , x 2 , x 3 , x 4 , and x 5 are each independently a neutral coordinating atom selected from the group consisting of carbon, phosphorus, and nitrogen; wherein at least one of x 1 , x 2 , x 3 , x 4 , and x 5 is an imidazole derived carbene neutral carbon; wherein y is a monoanionic coordinating atom selected from the group consisting of carbon, oxygen, sulfur, and nitrogen; wherein the dash lines show the connection points to re; and wherein l a and l b are optionally linked together to form a hexadentate ligand.	parties to a joint research agreement the claimed invention was made by, on behalf of, and/or in connection with one or more of the following parties to a joint university corporation research agreement: regents of the university of michigan, princeton university, university of southern california, and the universal display corporation. the agreement was in effect on and before the date the claimed invention was made, and the claimed invention was made as a result of activities undertaken within the scope of the agreement. field of the invention the present invention relates to electroluminescent compounds for use as emitters and devices, such as organic light emitting diodes, including the same. more particularly, the compounds disclosed herein are novel rhenium(i) metal complexes. background opto-electronic devices that make use of organic materials are becoming increasingly desirable for a number of reasons. many of the materials used to make such devices are relatively inexpensive, so organic opto-electronic devices have the potential for cost advantages over inorganic devices. in addition, the inherent properties of organic materials, such as their flexibility, may make them well suited for particular applications such as fabrication on a flexible substrate. examples of organic opto-electronic devices include organic light emitting devices (oleds), organic phototransistors, organic photovoltaic cells, and organic photodetectors. for oleds, the organic materials may have performance advantages over conventional materials. for example, the wavelength at which an organic emissive layer emits light may generally be readily tuned with appropriate dopants. oleds make use of thin organic films that emit light when voltage is applied across the device. oleds are becoming an increasingly interesting technology for use in applications such as flat panel displays, illumination, and backlighting. several oled materials and configurations are described in u.s. pat. nos. 5,844,363, 6,303,238, and 5,707,745, which are incorporated herein by reference in their entirety. one application for phosphorescent emissive molecules is a full color display. industry standards for such a display call for pixels adapted to emit particular colors, referred to as “saturated” colors. in particular, these standards call for saturated red, green, and blue pixels. color may be measured using cie coordinates, which are well known to the art. one example of a green emissive molecule is tris(2-phenylpyridine) iridium, denoted ir(ppy) 3 , which has the following structure: in this, and later figures herein, we depict the dative bond from nitrogen to metal (here, ir) as a straight line. as used herein, the term “organic” includes polymeric materials as well as small molecule organic materials that may be used to fabricate organic opto-electronic devices. “small molecule” refers to any organic material that is not a polymer, and “small molecules” may actually be quite large. small molecules may include repeat units in some circumstances. for example, using a long chain alkyl group as a substituent does not remove a molecule from the “small molecule” class. small molecules may also be incorporated into polymers, for example as a pendent group on a polymer backbone or as a part of the backbone. small molecules may also serve as the core moiety of a dendrimer, which consists of a series of chemical shells built on the core moiety. the core moiety of a dendrimer may be a fluorescent or phosphorescent small molecule emitter. a dendrimer may be a “small molecule,” and it is believed that all dendrimers currently used in the field of oleds are small molecules. as used herein, “top” means furthest away from the substrate, while “bottom” means closest to the substrate. where a first layer is described as “disposed over” a second layer, the first layer is disposed further away from substrate. there may be other layers between the first and second layer, unless it is specified that the first layer is “in contact with” the second layer. for example, a cathode may be described as “disposed over” an anode, even though there are various organic layers in between. as used herein, “solution processable” means capable of being dissolved, dispersed, or transported in and/or deposited from a liquid medium, either in solution or suspension form. a ligand may be referred to as “photoactive” when it is believed that the ligand directly contributes to the photoactive properties of an emissive material. a ligand may be referred to as “ancillary” when it is believed that the ligand does not contribute to the photoactive properties of an emissive material, although an ancillary ligand may alter the properties of a photoactive ligand. as used herein, and as would be generally understood by one skilled in the art, a first “highest occupied molecular orbital” (homo) or “lowest unoccupied molecular orbital” (lumo) energy level is “greater than” or “higher than” a second homo or lumo energy level if the first energy level is closer to the vacuum energy level. since ionization potentials (ip) are measured as a negative energy relative to a vacuum level, a higher homo energy level corresponds to an ip having a smaller absolute value (an ip that is less negative). similarly, a higher lumo energy level corresponds to an electron affinity (ea) having a smaller absolute value (an ea that is less negative). on a conventional energy level diagram, with the vacuum level at the top, the lumo energy level of a material is higher than the homo energy level of the same material. a “higher” homo or lumo energy level appears closer to the top of such a diagram than a “lower” homo or lumo energy level. as used herein, and as would be generally understood by one skilled in the art, a first work function is “greater than” or “higher than” a second work function if the first work function has a higher absolute value. because work functions are generally measured as negative numbers relative to vacuum level, this means that a “higher” work function is more negative. on a conventional energy level diagram, with the vacuum level at the top, a “higher” work function is illustrated as further away from the vacuum level in the downward direction. thus, the definitions of homo and lumo energy levels follow a different convention than work functions. more details on oleds, and the definitions described above, can be found in u.s. pat. no. 7,279,704, which is incorporated herein by reference in its entirety. summary of the invention according to an embodiment of the present disclosure, a novel compound that is useful in organic electroluminescent devices is disclosed. the compound has a formula re(l a )(l b ), wherein re is a rhenium(i) metal; wherein l a is a monoanionic tridentate ligand; wherein l b is a neutral tridentate ligand; and wherein l a and l b are optionally linked together to form a hexadentate ligand. according to an aspect of the present disclosure, an organic electroluminescent device, such as an organic light emitting device, incorporating the novel compound is disclosed. a formulation comprising the novel compound is also disclosed. brief description of the drawings fig. 1 shows an organic light emitting device that can incorporate the inventive compound disclosed herein. fig. 2 shows an inverted organic light emitting device that can incorporate the inventive compound disclosed herein. detailed description generally, an oled comprises at least one organic layer disposed between and electrically connected to an anode and a cathode. when a current is applied, the anode injects holes and the cathode injects electrons into the organic layer(s). the injected holes and electrons each migrate toward the oppositely charged electrode. when an electron and hole localize on the same molecule, an “exciton,” which is a localized electron-hole pair having an excited energy state, is formed. light is emitted when the exciton relaxes via a photoemissive mechanism. in some cases, the exciton may be localized on an excimer or an exciplex. non-radiative mechanisms, such as thermal relaxation, may also occur, but are generally considered undesirable. the initial oleds used emissive molecules that emitted light from their singlet states (“fluorescence”) as disclosed, for example, in u.s. pat. no. 4,769,292, which is incorporated by reference in its entirety. fluorescent emission generally occurs in a time frame of less than 10 nanoseconds. more recently, oleds having emissive materials that emit light from triplet states (“phosphorescence”) have been demonstrated. baldo et al., “highly efficient phosphorescent emission from organic electroluminescent devices,” nature, vol. 395, 151-154, 1998; (“baldo-i”) and baldo et al., “very high-efficiency green organic light-emitting devices based on electrophosphorescence,” appl. phys. lett., vol. 75. no. 3, 4-6 (1999) (“baldo-ii”), which are incorporated by reference in their entireties. phosphorescence is described in more detail in u.s. pat. no. 7,279,704 at cols. 5-6, which are incorporated by reference. fig. 1 shows an organic light emitting device 100 . the figures are not necessarily drawn to scale. device 100 may include a substrate 110 , an anode 115 , a hole injection layer 120 , a hole transport layer 125 , an electron blocking layer 130 , an emissive layer 135 , a hole blocking layer 140 , an electron transport layer 145 , an electron injection layer 150 , a protective layer 155 , a cathode 160 , and a barrier layer 170 . cathode 160 is a compound cathode having a first conductive layer 162 and a second conductive layer 164 . device 100 may be fabricated by depositing the layers described, in order. the properties and functions of these various layers, as well as example materials, are described in more detail in u.s. pat. no. 7,279,704 at cols. 6-10, which are incorporated by reference. more examples for each of these layers are available. for example, a flexible and transparent substrate-anode combination is disclosed in u.s. pat. no. 5,844,363, which is incorporated by reference in its entirety. an example of a p-doped hole transport layer is m-mtdata doped with f 4 -tcnq at a molar ratio of 50:1, as disclosed in u.s. patent application publication no. 2003/0230980, which is incorporated by reference in its entirety. examples of emissive and host materials are disclosed in u.s. pat. no. 6,303,238 to thompson et al., which is incorporated by reference in its entirety. an example of an n-doped electron transport layer is bphen doped with li at a molar ratio of 1:1, as disclosed in u.s. patent application publication no. 2003/0230980, which is incorporated by reference in its entirety. u.s. pat. nos. 5,703,436 and 5,707,745, which are incorporated by reference in their entireties, disclose examples of cathodes including compound cathodes having a thin layer of metal such as mg:ag with an overlying transparent, electrically-conductive, sputter-deposited ito layer. the theory and use of blocking layers is described in more detail in u.s. pat. no. 6,097,147 and u.s. patent application publication no. 2003/0230980, which are incorporated by reference in their entireties. examples of injection layers are provided in u.s. patent application publication no. 2004/0174116, which is incorporated by reference in its entirety. a description of protective layers may be found in u.s. patent application publication no. 2004/0174116, which is incorporated by reference in its entirety. fig. 2 shows an inverted oled 200 . the device includes a substrate 210 , a cathode 215 , an emissive layer 220 , a hole transport layer 225 , and an anode 230 . device 200 may be fabricated by depositing the layers described, in order. because the most common oled configuration has a cathode disposed over the anode, and device 200 has cathode 215 disposed under anode 230 , device 200 may be referred to as an “inverted” oled. materials similar to those described with respect to device 100 may be used in the corresponding layers of device 200 . fig. 2 provides one example of how some layers may be omitted from the structure of device 100 . the simple layered structure illustrated in figs. 1 and 2 is provided by way of non-limiting example, and it is understood that embodiments of the invention may be used in connection with a wide variety of other structures. the specific materials and structures described are exemplary in nature, and other materials and structures may be used. functional oleds may be achieved by combining the various layers described in different ways, or layers may be omitted entirely, based on design, performance, and cost factors. other layers not specifically described may also be included. materials other than those specifically described may be used. although many of the examples provided herein describe various layers as comprising a single material, it is understood that combinations of materials, such as a mixture of host and dopant, or more generally a mixture, may be used. also, the layers may have various sublayers. the names given to the various layers herein are not intended to be strictly limiting. for example, in device 200 , hole transport layer 225 transports holes and injects holes into emissive layer 220 , and may be described as a hole transport layer or a hole injection layer. in one embodiment, an oled may be described as having an “organic layer” disposed between a cathode and an anode. this organic layer may comprise a single layer, or may further comprise multiple layers of different organic materials as described, for example, with respect to figs. 1 and 2 . structures and materials not specifically described may also be used, such as oleds comprised of polymeric materials (pleds) such as disclosed in u.s. pat. no. 5,247,190 to friend et al., which is incorporated by reference in its entirety. by way of further example, oleds having a single organic layer may be used. oleds may be stacked, for example as described in u.s. pat. no. 5,707,745 to forrest et al. which is incorporated by reference in its entirety. the oled structure may deviate from the simple layered structure illustrated in figs. 1 and 2 . for example, the substrate may include an angled reflective surface to improve out-coupling, such as a mesa structure as described in u.s. pat. no. 6,091,195 to forrest et al., and/or a pit structure as described in u.s. pat. no. 5,834,893 to bulovic et al., which are incorporated by reference in their entireties. unless otherwise specified, any of the layers of the various embodiments may be deposited by any suitable method. for the organic layers, preferred methods include thermal evaporation, ink-jet, such as described in u.s. pat. nos. 6,013,982 and 6,087,196, which are incorporated by reference in their entireties, organic vapor phase deposition (ovpd), such as described in u.s. pat. no. 6,337,102 to forrest et al., which is incorporated by reference in its entirety, and deposition by organic vapor jet printing (ovjp), such as described in u.s. pat. no. 7,431,968, which is incorporated by reference in its entirety. other suitable deposition methods include spin coating and other solution based processes. solution based processes are preferably carried out in nitrogen or an inert atmosphere. for the other layers, preferred methods include thermal evaporation. preferred patterning methods include deposition through a mask, cold welding such as described in u.s. pat. nos. 6,294,398 and 6,468,819, which are incorporated by reference in their entireties, and patterning associated with some of the deposition methods such as ink-jet and ovjd. other methods may also be used. the materials to be deposited may be modified to make them compatible with a particular deposition method. for example, substituents such as alkyl and aryl groups, branched or unbranched, and preferably containing at least 3 carbons, may be used in small molecules to enhance their ability to undergo solution processing. substituents having 20 carbons or more may be used, and 3-20 carbons is a preferred range. materials with asymmetric structures may have better solution processability than those having symmetric structures, because asymmetric materials may have a lower tendency to recrystallize. dendrimer substituents may be used to enhance the ability of small molecules to undergo solution processing. devices fabricated in accordance with embodiments of the present invention may further optionally comprise a barrier layer. one purpose of the barrier layer is to protect the electrodes and organic layers from damaging exposure to harmful species in the environment including moisture, vapor and/or gases, etc. the barrier layer may be deposited over, under or next to a substrate, an electrode, or over any other parts of a device including an edge. the barrier layer may comprise a single layer, or multiple layers. the barrier layer may be formed by various known chemical vapor deposition techniques and may include compositions having a single phase as well as compositions having multiple phases. any suitable material or combination of materials may be used for the barrier layer. the barrier layer may incorporate an inorganic or an organic compound or both. the preferred barrier layer comprises a mixture of a polymeric material and a non-polymeric material as described in u.s. pat. no. 7,968,146, pct pat. application nos. pct/us2007/023098 and pct/us2009/042829, which are herein incorporated by reference in their entireties. to be considered a “mixture”, the aforesaid polymeric and non-polymeric materials comprising the barrier layer should be deposited under the same reaction conditions and/or at the same time. the weight ratio of polymeric to non-polymeric material may be in the range of 95:5 to 5:95. the polymeric material and the non-polymeric material may be created from the same precursor material. in one example, the mixture of a polymeric material and a non-polymeric material consists essentially of polymeric silicon and inorganic silicon. devices fabricated in accordance with embodiments of the invention may be incorporated into a wide variety of consumer products, including flat panel displays, computer monitors, medical monitors, televisions, billboards, lights for interior or exterior illumination and/or signaling, heads up displays, fully transparent displays, flexible displays, laser printers, telephones, cell phones, personal digital assistants (pdas), laptop computers, digital cameras, camcorders, viewfinders, micro-displays, 3-d displays, vehicles, a large area wall, theater or stadium screen, or a sign. various control mechanisms may be used to control devices fabricated in accordance with the present invention, including passive matrix and active matrix. many of the devices are intended for use in a temperature range comfortable to humans, such as 18 degrees c. to 30 degrees c., and more preferably at room temperature (20-25 degrees c.), but could be used outside this temperature range, for example, from −40 degree c. to +80 degree c. the materials and structures described herein may have applications in devices other than oleds. for example, other optoelectronic devices such as organic solar cells and organic photodetectors may employ the materials and structures. more generally, organic devices, such as organic transistors, may employ the materials and structures. the terms halo, halogen, alkyl, cycloalkyl, alkenyl, alkynyl, aralkyl, heterocyclic group, aryl, aromatic group, and heteroaryl are known to the art, and are defined in u.s. pat. no. 7,279,704 at cols. 31-32, which are incorporated herein by reference. as used herein, “substituted” indicates that a substituent other than h is bonded to the relevant carbon. thus, where r 2 is monosubstituted, then one r 2 must be other than h. similarly, where r 3 is disubstituted, then two of r 3 must be other than h. similarly, where r 2 is unsubstituted r 2 is hydrogen for all available positions. according to an embodiment of the present disclosure, a novel compound that is useful in organic electroluminescent devices is disclosed. the compound has a formula re(l a )(l b ), wherein re is a rhenium(i) metal; wherein l a is a monoanionic tridentate ligand; wherein l b is a neutral tridentate ligand; and wherein l a and l b are optionally linked together to form a hexadentate ligand. in one embodiment of the compound, the ligand l a has a formula selected from the group consisting of: the ligand l b has a formula: wherein x 1 , x 2 , x 3 , x 4 , and x 5 are each independently a neutral coordinating atom selected from the group consisting of carbon, phosphorus, and nitrogen; wherein y is a monoanionic coordinating atom selected from the group consisting of carbon, oxygen, sulfur, and nitrogen; and wherein the dash lines show the connection points to re. in one embodiment, the neutral carbon is n-heterocyclic carbene; the neutral phosphorus is a phosphorus atom of a trisubstituted phosphine; and the neutral nitrogen is an sp 2 nitrogen atom of n-heterocyclic ring selected from the group consisting of pyridine, pyrimidine, imidazole, benzoimidazole, pyrazole, oxazole, and triazole. the monoanionic coordinating carbon is an sp 2 carbon atom selected from the group consisting of benzene, pyridine, furan, thiophene, and pyrrole. the monoanionic coordinating nitrogen is an sp 2 nitrogen atom of n-heterocyclic ring selected from the group consisting of imidazole, benzoimidazole, pyrazole, and triazole. the monoanionic oxygen atom is oxygen atom from carboxylic acid or ether. in one embodiment, the ligand l a has a formula selected from the group consisting of: wherein r b , r c , and r d may represent from mono-substitution to the possible maximum number of substitution, or no substitution;wherein r a , r b , r c , r d , r e , r f and r g are each independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; andwherein two adjacent substituents of r a , r b , r c , r d , r e , r f and r g are optionally joined to form a ring or form a multidentate ligand. in one embodiment, the ligand l a has a formula selected from the group consisting of: in one embodiment, the ligand l b has a formula selected from the group consisting of: wherein r 1 , r 2 , and r 3 may represent from mono-substitution to the possible maximum number of substitution, or no substitution; wherein r 1 , r 2 , r 3 , r 4 , and r 5 are each independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; andwherein two adjacent substituents of r 1 , r 2 , r 3 , r 4 , and r 5 are optionally joined to form a ring or form a multidentate ligand. in another embodiment, the ligand l b has a formula selected from the group consisting of: according to another embodiment, the compound having the formula re(l a )(l b ), where re is a rhenium(i) metal and l a and l b are as defined herein, is selected from the group consisting of compounds 1 through 8170 listed in the following table 1: table 1cpd #l al b1.l a1l b12.l a2l b13.l a3l b14.l a4l b15.l a5l b16.l a6l b17.l a7l b18.l a8l b19.l a9l b110.l a10l b111.l a11l b112.l a12l b113.l a13l b114.l a14l b115.l a15l b116.l a16l b117.l a17l b118.l a18l b119.l a19l b120.l a20l b121.l a21l b122.l a22l b123.l a23l b124.l a24l b125.l a25l b126.l a26l b127.l a27l b128.l a28l b129.l a29l b130.l a30l b131.l a31l b132.l a32l b133.l a33l b134.l a34l b135.l a35l b136.l a36l b137.l a37l b138.l a38l b139.l a39l b140.l a40l b141.l a41l b142.l a42l b143.l a43l b144.l a44l b145.l a45l b146.l a46l b147.l a47l b148.l a48l b149.l a49l b150.l a50l b151.l a51l b152.l a52l b153.l a53l b154.l a54l b155.l a55l b156.l a56l b157.l a57l b158.l a58l b159.l a59l b160.l a60l b161.l a61l b162.l a62l b163.l a63l b164.l a64l b165.l a65l b166.l a66l b167.l a67l b168.l a68l b169.l a69l b170.l a70l b171.l a71l b172.l a72l b173.l a73l b174.l a74l b175.l a75l b176.l a76l b177.l a77l b178.l a78l b179.l a79l b180.l a80l b181.l a81l b182.l a82l b183.l a83l b184.l a84l b185.l a85l b186.l a86l b187.l a87l b188.l a88l b189.l a89l b190.l a90l b191.l a91l b192.l a92l b193.l a93l b194.l a94l b195.l a95l b196.l a1l b297.l a2l b298.l a3l b299.l a4l b2100.l a5l b2101.l a6l b2102.l a7l b2103.l a8l b2104.l a9l b2105.l a10l b2106.l a11l b2107.l a12l b2108.l a13l b2109.l a14l b2110.l a15l b2111.l a16l b2112.l a17l b2113.l a18l b2114.l a19l b2115.l a20l b2116.l a21l b2117.l a22l b2118.l a23l b2119.l a24l b2120.l a25l b2121.l a26l b2122.l a27l b2123.l a28l b2124.l a29l b2125.l a30l b2126.l a31l b2127.l a32l b2128.l a33l b2129.l a34l b2130.l a35l b2131.l a36l b2132.l a37l b2133.l a38l b2134.l a39l b2135.l a40l b2136.l a41l b2137.l a42l b2138.l a43l b2139.l a44l b2140.l a45l b2141.l a46l b2142.l a47l b2143.l a48l b2144.l a49l b2145.l a50l b2146.l a51l b2147.l a52l b2148.l a53l b2149.l a54l b2150.l a55l b2151.l a56l b2152.l a57l b2153.l a58l b2154.l a59l b2155.l a60l b2156.l a61l b2157.l a62l b2158.l a63l b2159.l a64l b2160.l a65l b2161.l a66l b2162.l a67l b2163.l a68l b2164.l a69l b2165.l a70l b2166.l a71l b2167.l a72l b2168.l a73l b2169.l a74l b2170.l a75l b2171.l a76l b2172.l a77l b2173.l a78l b2174.l a79l b2175.l a80l b2176.l a81l b2177.l a82l b2178.l a83l b2179.l a84l b2180.l a85l b2181.l a86l b2182.l a87l b2183.l a88l b2184.l a89l b2185.l a90l b2186.l a91l b2187.l a92l b2188.l a93l b2189.l a94l b2190.l a95l b2191.l a1l b3192.l a2l b3193.l a3l b3194.l a4l b3195.l a5l b3196.l a6l b3197.l a7l b3198.l a8l b3199.l a9l b3200.l a10l b3201.l a11l b3202.l a12l b3203.l a13l b3204.l a14l b3205.l a15l b3206.l a16l b3207.l a17l b3208.l a18l b3209.l a19l b3210.l a20l b3211.l a21l b3212.l a22l b3213.l a23l b3214.l a24l b3215.l a25l b3216.l a26l b3217.l a27l b3218.l a28l b3219.l a29l b3220.l a30l b3221.l a31l b3222.l a32l b3223.l a33l b3224.l a34l b3225.l a35l b3226.l a36l b3227.l a37l b3228.l a38l b3229.l a39l b3230.l a40l b3231.l a41l b3232.l a42l b3233.l a43l b3234.l a44l b3235.l a45l b3236.l a46l b3237.l a47l b3238.l a48l b3239.l a49l b3240.l a50l b3241.l a51l b3242.l a52l b3243.l a53l b3244.l a54l b3245.l a55l b3246.l a56l b3247.l a57l b3248.l a58l b3249.l a59l b3250.l a60l b3251.l a61l b3252.l a62l b3253.l a63l b3254.l a64l b3255.l a65l b3256.l a66l b3257.l a67l b3258.l a68l b3259.l a69l b3260.l a70l b3261.l a71l b3262.l a72l b3263.l a73l b3264.l a74l b3265.l a75l b3266.l a76l b3267.l a77l b3268.l a78l b3269.l a79l b3270.l a80l b3271.l a81l b3272.l a82l b3273.l a83l b3274.l a84l b3275.l a85l b3276.l a86l b3277.l a87l b3278.l a88l b3279.l a89l b3280.l a90l b3281.l a91l b3282.l a92l b3283.l a93l b3284.l a94l b3285.l a95l b3286.l a1l b4287.l a2l b4288.l a3l b4289.l a4l b4290.l a5l b4291.l a6l b4292.l a7l b4293.l a8l b4294.l a9l b4295.l a10l b4296.l a11l b4297.l a12l b4298.l a13l b4299.l a14l b4300.l a15l b4301.l a16l b4302.l a17l b4303.l a18l b4304.l a19l b4305.l a20l b4306.l a21l b4307.l a22l b4308.l a23l b4309.l a24l b4310.l a25l b4311.l a26l b4312.l a27l b4313.l a28l b4314.l a29l b4315.l a30l b4316.l a31l b4317.l a32l b4318.l a33l b4319.l a34l b4320.l a35l b4321.l a36l b4322.l a37l b4323.l a38l b4324.l a39l b4325.l a40l b4326.l a41l b4327.l a42l b4328.l a43l b4329.l a44l b4330.l a45l b4331.l a46l b4332.l a47l b4333.l a48l b4334.l a49l b4335.l a50l b4336.l a51l b4337.l a52l b4338.l a53l b4339.l a54l b4340.l a55l b4341.l a56l b4342.l a57l b4343.l a55l b4344.l a59l b4345.l a60l b4346.l a61l b4347.l a62l b4348.l a63l b4349.l a64l b4350.l a65l b4351.l a66l b4352.l a67l b4353.l a68l b4354.l a69l b4355.l a70l b4356.l a71l b4357.l a72l b4358.l a73l b4359.l a74l b4360.l a75l b4361.l a76l b4362.l a77l b4363.l a78l b4364.l a79l b4365.l a80l b4366.l a81l b4367.l a82l b4368.l a83l b4369.l a84l b4370.l a85l b4371.l a86l b4372.l a87l b4373.l a88l b4374.l a89l b4375.l a90l b4376.l a91l b4377.l a92l b4378.l a93l b4379.l a94l b4380.l a95l b4381.l a1l b5382.l a2l b5383.l a3l b5384.l a4l b5385.l a5l b5386.l a6l b5387.l a7l b5388.l a8l b5389.l a9l b5390.l a10l b5391.l a11l b5392.l a12l b5393.l a13l b5394.l a14l b5395.l a15l b5396.l a16l b5397.l a17l b5398.l a18l b5399.l a19l b5400.l a20l b5401.l a21l b5402.l a22l b5403.l a23l b5404.l a24l b5405.l a25l b5406.l a26l b5407.l a27l b5408.l a28l b5409.l a29l b5410.l a30l b5411.l a31l b5412.l a32l b5413.l a33l b5414.l a34l b5415.l a35l b5416.l a36l b5417.l a37l b5418.l a38l b5419.l a39l b5420.l a40l b5421.l a41l b5422.l a42l b5423.l a43l b5424.l a44l b5425.l a45l b5426.l a46l b5427.l a47l b5428.l a48l b5429.l a49l b5430.l a50l b5431.l a51l b5432.l a52l b5433.l a53l b5434.l a54l b5435.l a55l b5436.l a56l b5437.l a57l b5438.l a58l b5439.l a59l b5440.l a60l b5441.l a61l b5442.l a62l b5443.l a63l b5444.l a64l b5445.l a65l b5446.l a66l b5447.l a67l b5448.l a68l b5449.l a69l b5450.l a70l b5451.l a71l b5452.l a72l b5453.l a73l b5454.l a74l b5455.l a75l b5456.l a76l b5457.l a77l b5458.l a78l b5459.l a79l b5460.l a80l b5461.l a81l b5462.l a82l b5463.l a83l b5464.l a84l b5465.l a85l b5466.l a86l b5467.l a87l b5468.l a88l b5469.l a89l b5470.l a90l b5471.l a91l b5472.l a92l b5473.l a93l b5474.l a94l b5475.l a95l b5476.l a1l b6477.l a2l b6478.l a3l b6479.l a4l b6480.l a5l b6481.l a6l b6482.l a7l b6483.l a8l b6484.l a9l b6485.l a10l b6486.l a11l b6487.l a12l b6488.l a13l b6489.l a14l b6490.l a15l b6491.l a16l b6492.l a17l b6493.l a18l b6494.l a19l b6495.l a20l b6496.l a21l b6497.l a22l b6498.l a23l b6499.l a24l b6500.l a25l b6501.l a26l b6502.l a27l b6503.l a28l b6504.l a29l b6505.l a30l b6506.l a31l b6507.l a32l b6508.l a33l b6509.l a34l b6510.l a35l b6511.l a36l b6512.l a37l b6513.l a38l b6514.l a39l b6515.l a40l b6516.l a41l b6517.l a42l b6518.l a43l b6519.l a44l b6520.l a45l b6521.l a46l b6522.l a47l b6523.l a48l b6524.l a49l b6525.l a50l b6526.l a51l b6527.l a52l b6528.l a53l b6529.l a54l b6530.l a55l b6531.l a56l b6532.l a57l b6533.l a58l b6534.l a59l b6535.l a60l b6536.l a61l b6537.l a62l b6538.l a63l b6539.l a64l b6540.l a65l b6541.l a66l b6542.l a67l b6543.l a68l b6544.l a69l b6545.l a70l b6546.l a71l b6547.l a72l b6548.l a73l b6549.l a74l b6550.l a75l b6551.l a76l b6552.l a77l b6553.l a78l b6554.l a79l b6555.l a80l b6556.l a81l b6557.l a82l b6558.l a83l b6559.l a84l b6560.l a85l b6561.l a86l b6562.l a87l b6563.l a88l b6564.l a89l b6565.l a90l b6566.l a91l b6567.l a92l b6568.l a93l b6569.l a94l b6570.l a95l b6571.l a1l b7572.l a2l b7573.l a3l b7574.l a4l b7575.l a5l b7576.l a6l b7577.l a7l b7578.l a8l b7579.l a9l b7580.l a10l b7581.l a11l b7582.l a12l b7583.l a13l b7584.l a14l b7585.l a15l b7586.l a16l b7587.l a17l b7588.l a18l b7589.l a19l b7590.l a20l b7591.l a21l b7592.l a22l b7593.l a23l b7594.l a24l b7595.l a25l b7596.l a26l b7597.l a27l b7598.l a28l b7599.l a29l b7600.l a30l b7601.l a31l b7602.l a32l b7603.l a33l b7604.l a34l b7605.l a35l b7606.l a36l b7607.l a37l b7608.l a38l b7609.l a39l b7610.l a40l b7611.l a41l b7612.l a42l b7613.l a43l b7614.l a44l b7615.l a45l b7616.l a46l b7617.l a47l b7618.l a48l b7619.l a49l b7620.l a50l b7621.l a51l b7622.l a52l b7623.l a53l b7624.l a54l b7625.l a55l b7626.l a56l b7627.l a57l b7628.l a58l b7629.l a59l b7630.l a60l b7631.l a61l b7632.l a62l b7633.l a63l b7634.l a64l b7635.l a65l b7636.l a66l b7637.l a67l b7638.l a68l b7639.l a69l b7640.l a70l b7641.l a71l b7642.l a72l b7643.l a73l b7644.l a74l b7645.l a75l b7646.l a76l b7647.l a77l b7648.l a78l b7649.l a79l b7650.l a80l b7651.l a81l b7652.l a82l b7653.l a83l b7654.l a84l b7655.l a85l b7656.l 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b837862.l a72l b837863.l a73l b837864.l a74l b837865.l a75l b837866.l a76l b837867.l a77l b837868.l a78l b837869.l a79l b837870.l a80l b837871.l a81l b837872.l a82l b837873.l a83l b837874.l a84l b837875.l a85l b837876.l a86l b837877.l a87l b837878.l a88l b837879.l a89l b837880.l a90l b837881.l a91l b837882.l a92l b837883.l a93l b837884.l a94l b837885.l a95l b837886.l a1l b847887.l a2l b847888.l a3l b847889.l a4l b847890.l a5l b847891.l a6l b847892.l a7l b847893.l a8l b847894.l a9l b847895.l a10l b847896.l a11l b847897.l a12l b847898.l a13l b847899.l a14l b847900.l a15l b847901.l a16l b847902.l a17l b847903.l a18l b847904.l a19l b847905.l a20l b847906.l a21l b847907.l a22l b847908.l a23l b847909.l a24l b847910.l a25l b847911.l a26l b847912.l a27l b847913.l a28l b847914.l a29l b847915.l a30l b847916.l a31l b847917.l a32l b847918.l a33l b847919.l a34l b847920.l a35l b847921.l a36l b847922.l a37l b847923.l a38l b847924.l a39l b847925.l a40l b847926.l a41l b847927.l a42l b847928.l a43l b847929.l a44l b847930.l a45l b847931.l a46l b847932.l a47l b847933.l a48l b847934.l a49l b847935.l a50l b847936.l a51l b847937.l a52l b847938.l a53l b847939.l a54l b847940.l a55l b847941.l a56l b847942.l a57l b847943.l a58l b847944.l a59l b847945.l a60l b847946.l a61l b847947.l a62l b847948.l a63l b847949.l a64l b847950.l a65l b847951.l a66l b847952.l a67l b847953.l a68l b847954.l a69l b847955.l a70l b847956.l a71l b847957.l a72l b847958.l a73l b847959.l a74l b847960.l a75l b847961.l a76l b847962.l a77l b847963.l a78l b847964.l a79l b847965.l a80l b847966.l a81l b847967.l a82l b847968.l a83l b847969.l a84l b847970.l a85l b847971.l a86l b847972.l a87l b847973.l a88l b847974.l a89l b847975.l a90l b847976.l a91l b847977.l a92l b847978.l a93l b847979.l a94l b847980.l a95l b847981.l a1l b857982.l a2l b857983.l a3l b857984.l a4l b857985.l a5l b857986.l a6l b857987.l a7l b857988.l a8l b857989.l a9l b857990.l a10l b857991.l a11l b857992.l a12l b857993.l a13l b857994.l a14l b857995.l a15l b857996.l a16l b857997.l a17l b857998.l a18l b857999.l a19l b858000.l a20l b858001.l a21l b858002.l a22l b858003.l a23l b858004.l a24l b858005.l a25l b858006.l a26l b858007.l a27l b858008.l a28l b858009.l a29l b858010.l a30l b858011.l a31l b858012.l a32l b858013.l a33l b858014.l a34l b858015.l a35l b858016.l a36l b858017.l a37l b858018.l a38l b858019.l a39l b858020.l a40l b858021.l a41l b858022.l a42l b858023.l a43l b858024.l a44l b858025.l a45l b858026.l a46l b858027.l a47l b858028.l a48l b858029.l a49l b858030.l a50l b858031.l a51l b858032.l a52l b858033.l a53l b858034.l a54l b858035.l a55l b858036.l a56l b858037.l a57l b858038.l a58l b858039.l a59l b858040.l a60l b858041.l a61l b858042.l a62l b858043.l a63l b858044.l a64l b858045.l a65l b858046.l a66l b858047.l a67l b858048.l a68l b858049.l a69l b858050.l a70l b858051.l a71l b858052.l a72l b858053.l a73l b858054.l a74l b858055.l a75l b858056.l a76l b858057.l a77l b858058.l a78l b858059.l a79l b858060.l a80l b858061.l a81l b858062.l a82l b858063.l a83l b858064.l a84l b858065.l a85l b858066.l a86l b858067.l a87l b858068.l a88l b858069.l a89l b858070.l a90l b858071.l a91l b858072.l a92l b858073.l a93l b858074.l a94l b858075.l a95l b858076.l a1l b868077.l a2l b868078.l a3l b868079.l a4l b868080.l a5l b868081.l a6l b868082.l a7l b868083.l a8l b868084.l a9l b868085.l a10l b868086.l a11l b868087.l a12l b868088.l a13l b868089.l a14l b868090.l a15l b868091.l a16l b868092.l a17l b868093.l a18l b868094.l a19l b868095.l a20l b868096.l a21l b868097.l a22l b868098.l a23l b868099.l a24l b868100.l a25l b868101.l a26l b868102.l a27l b868103.l a28l b868104.l a29l b868105.l a30l b868106.l a31l b868107.l a32l b868108.l a33l b868109.l a34l b868110.l a35l b868111.l a36l b868112.l a37l b868113.l a38l b868114.l a39l b868115.l a40l b868116.l a41l b868117.l a42l b868118.l a43l b868119.l a44l b868120.l a45l b868121.l a46l b868122.l a47l b868123.l a48l b868124.l a49l b868125.l a50l b868126.l a51l b868127.l a52l b868128.l a53l b868129.l a54l b868130.l a55l b868131.l a56l b868132.l a57l b868133.l a58l b868134.l a59l b868135.l a60l b868136.l a61l b868137.l a62l b868138.l a63l b868139.l a64l b868140.l a65l b868141.l a66l b868142.l a67l b868143.l a68l b868144.l a69l b868145.l a70l b868146.l a71l b868147.l a72l b868148.l a73l b868149.l a74l b868150.l a75l b868151.l a76l b868152.l a77l b868153.l a78l b868154.l a79l b868155.l a80l b868156.l a81l b868157.l a82l b868158.l a83l b868159.l a84l b868160.l a85l b868161.l a86l b868162.l a87l b868163.l a88l b868164.l a89l b868165.l a90l b868166.l a91l b868167.l a92l b868168.l a93l b868169.l a94l b868170.l a95l b86 according to another aspect of the present disclosure, a first device comprising a first organic light emitting device is disclosed. the first organic light emitting device comprises an anode; a cathode; and an organic layer disposed between the anode and the cathode. the organic layer comprises a compound having the formula re(l a )(l b ), wherein re is a rhenium(l) metal, wherein l a is a monoanionic tridentate ligand, wherein l b is a neutral tridentate ligand; and wherein l a and l b are optionally linked together to form a hexadentate ligand. in one embodiment, the first device can be a consumer product, such as a light panel, a lamp, etc. in one embodiment, the organic layer in the first device is an emissive layer and the compound is an emissive dopant. in another embodiment, the organic layer is an emissive layer and the compound is a non-emissive dopant. in one embodiment, the organic layer is a charge transporting layer and the compound is a charge transporting material in the organic layer. in one embodiment, the organic layer is a charge injecting layer and the compound is a charge injecting material in the organic layer. in one embodiment, the organic layer is a blocking layer and the compound is a blocking material in the organic layer. in another embodiment, the organic layer further comprises a host material. the host material can comprise a triphenylene containing benzo-fused thiophene or benzo-fused furan; wherein any substituent in the host material is an unfused substituent independently selected from the group consisting of c n h 2n+1 , oc n h 2n+1 , oar 1 , n(c n h 2n+1 ) 2 , n(ar 1 )(ar 2 ), ch═ch—c n h 2n+1 , c≡cc n h 2n+1 , ar 1 , ar 1 —ar 2 , c n h 2n —ar 1 , or no substitution; wherein n is from 1 to 10; and wherein art and ar 2 are independently selected from the group consisting of benzene, biphenyl, naphthalene, triphenylene, carbazole, and heteroaromatic analogs thereof. in one embodiment, the host material comprises at least one chemical group selected from the group consisting of carbazole, dibenzothiophene, dibenzofuran, dibenzoselenophene, azacarbazole, aza-dibenzothiophene, aza-dibenzofuran, and aza-dibenzoselenophene. the “aza” designation in the fragments described above, i.e. aza-dibenzofuran, aza-dibenzonethiophene, etc. means that one or more of the c—h groups in the respective fragment can be replaced by a nitrogen atom, for example, and without any limitation, azatriphenylene encompasses both dibenzo[f,h]quinoxaline and dibenzo[f,h]quinoline. one of ordinary skill in the art can readily envision other nitrogen analogs of the aza-derivatives described above, and all such analogs are intended to be encompassed by the terms as set forth herein. in one embodiment, the host material is selected from the group consisting of: and combinations thereof. in another aspect, a formulation comprising a compound having the formula re(l a )(l b ), wherein re is a rhenium(i) metal, wherein l a is a monoanionic tridentate ligand, wherein l b is a neutral tridentate ligand; and wherein l a and l b are optionally linked together to form a hexadentate ligand is disclosed. combination with other materials the materials described herein as useful for a particular layer in an organic light emitting device may be used in combination with a wide variety of other materials present in the device. for example, emissive dopants disclosed herein may be used in conjunction with a wide variety of hosts, transport layers, blocking layers, injection layers, electrodes and other layers that may be present. the materials described or referred to below are non-limiting examples of materials that may be useful in combination with the compounds disclosed herein, and one of skill in the art can readily consult the literature to identify other materials that may be useful in combination. hil/htl: a hole injecting/transporting material to be used in the present invention is not particularly limited, and any compound may be used as long as the compound is typically used as a hole injecting/transporting material. examples of the material include, but not limit to: a phthalocyanine or porphryin derivative; an aromatic amine derivative; an indolocarbazole derivative; a polymer containing fluorohydrocarbon; a polymer with conductivity dopants; a conducting polymer, such as pedot/pss; a self-assembly monomer derived from compounds such as phosphonic acid and silane derivatives; a metal oxide derivative, such as moo x ; a p-type semiconducting organic compound, such as 1,4,5,8,9,12-hexaazatriphenylenehexacarbonitrile; a metal complex, and a cross-linkable compounds. examples of aromatic amine derivatives used in hil or htl include, but not limit to the following general structures: each of ar 1 to ar 9 is selected from the group consisting aromatic hydrocarbon cyclic compounds such as benzene, biphenyl, triphenyl, triphenylene, naphthalene, anthracene, phenalene, phenanthrene, fluorene, pyrene, chrysene, perylene, azulene; group consisting aromatic heterocyclic compounds such as dibenzothiophene, dibenzofuran, dibenzoselenophene, furan, thiophene, benzofuran, benzothiophene, benzoselenophene, carbazole, indolocarbazole, pyridylindole, pyrrolodipyridine, pyrazole, imidazole, triazole, oxazole, thiazole, oxadiazole, oxatriazole, dioxazole, thiadiazole, pyridine, pyridazine, pyrimidine, pyrazine, triazine, oxazine, oxathiazine, oxadiazine, indole, benzimidazole, indazole, indoxazine, benzoxazole, benzisoxazole, benzothiazole, quinoline, isoquinoline, cinnoline, quinazoline, quinoxaline, naphthyridine, phthalazine, pteridine, xanthene, acridine, phenazine, phenothiazine, phenoxazine, benzofuropyridine, furodipyridine, benzothienopyridine, thienodipyridine, benzoselenophenopyridine, and selenophenodipyridine; and group consisting 2 to 10 cyclic structural units which are groups of the same type or different types selected from the aromatic hydrocarbon cyclic group and the aromatic heterocyclic group and are bonded to each other directly or via at least one of oxygen atom, nitrogen atom, sulfur atom, silicon atom, phosphorus atom, boron atom, chain structural unit and the aliphatic cyclic group. wherein each ar is further substituted by a substituent selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in one aspect, ar 1 to ar 9 is independently selected from the group consisting of: wherein k is an integer from 1 to 20; x 101 to x 108 is c (including ch) or n; z 101 is nar 1 , o, or s; ar 1 has the same group defined above. examples of metal complexes used in hil or htl include, but not limit to the following general formula: wherein met is a metal, which can have an atomic weight greater than 40; (y 101 -y 102 ) is a bidentate ligand, y 101 and y 102 are independently selected from c, n, o, p, and s; l 101 is an ancillary ligand; k′ is an integer value from 1 to the maximum number of ligands that may be attached to the metal; and k′+k″ is the maximum number of ligands that may be attached to the metal. in one aspect, (y 101 -y 102 ) is a 2-phenylpyridine derivative. in another aspect. (y 101 -y 102 ) is a carbene ligand. in another aspect, met is selected from ir, pt, os, and zn. in a further aspect, the metal complex has a smallest oxidation potential in solution vs. fc + /fc couple less than about 0.6 v. host: the light emitting layer of the organic el device of the present invention preferably contains at least a metal complex as light emitting material, and may contain a host material using the metal complex as a dopant material. examples of the host material are not particularly limited, and any metal complexes or organic compounds may be used as long as the triplet energy of the host is larger than that of the dopant. while the table below categorizes host materials as preferred for devices that emit various colors, any host material may be used with any dopant so long as the triplet criteria is satisfied. examples of metal complexes used as host are preferred to have the following general formula: wherein met is a metal; (y 103 -y 104 ) is a bidentate ligand, y 103 and y 104 are independently selected from c, n, o, p, and s; l 101 is an another ligand; k′ is an integer value from 1 to the maximum number of ligands that may be attached to the metal; and k′+k″ is the maximum number of ligands that may be attached to the metal. in one aspect, the metal complexes are: wherein (o—n) is a bidentate ligand, having metal coordinated to atoms o and n. in another aspect, met is selected from ir and pt. in a further aspect, (y 103 -y 104 ) is a carbene ligand. examples of organic compounds used as host are selected from the group consisting aromatic hydrocarbon cyclic compounds such as benzene, biphenyl, triphenyl, triphenylene, naphthalene, anthracene, phenalene, phenanthrene, fluorene, pyrene, chrysene, perylene, azulene; group consisting aromatic heterocyclic compounds such as dibenzothiophene, dibenzofuran, dibenzoselenophene, furan, thiophene, benzofuran, benzothiophene, benzoselenophene, carbazole, indolocarbazole, pyridylindole, pyrrolodipyridine, pyrazole, imidazole, triazole, oxazole, thiazole, oxadiazole, oxatriazole, dioxazole, thiadiazole, pyridine, pyridazine, pyrimidine, pyrazine, triazine, oxazine, oxathiazine, oxadiazine, indole, benzimidazole, indazole, indoxazine, benzoxazole, benzisoxazole, benzothiazole, quinoline, isoquinoline, cinnoline, quinazoline, quinoxaline, naphthyridine, phthalazine, pteridine, xanthene, acridine, phenazine, phenothiazine, phenoxazine, benzofuropyridine, furodipyridine, benzothienopyridine, thienodipyridine, benzoselenophenopyridine, and selenophenodipyridine; and group consisting 2 to 10 cyclic structural units which are groups of the same type or different types selected from the aromatic hydrocarbon cyclic group and the aromatic heterocyclic group and are bonded to each other directly or via at least one of oxygen atom, nitrogen atome, sulfur atom, silicon atom, phosphorus atom, boron atom, chain structural unit and the aliphatic cyclic group. wherein each group is further substituted by a substituent selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in one aspect, host compound contains at least one of the following groups in the molecule: wherein r 101 to r 107 is independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof, when it is aryl or heteroaryl, it has the similar definition as ar's mentioned above. k is an integer from 0 to 20 or 1 to 20; k′″ is an integer from 0 to 20. x 101 to x 108 is selected from c (including ch) or n. z 101 and z 102 is selected from nr 101 , o, or s. hbl: a hole blocking layer (hbl) may be used to reduce the number of holes and/or excitons that leave the emissive layer. the presence of such a blocking layer in a device may result in substantially higher efficiencies as compared to a similar device lacking a blocking layer. also, a blocking layer may be used to confine emission to a desired region of an oled. in one aspect, compound used in hbl contains the same molecule or the same functional groups used as host described above. in another aspect, compound used in hbl contains at least one of the following groups in the molecule: wherein k is an integer from 1 to 20; l 101 is an another ligand, k′ is an integer from 1 to 3. etl: electron transport layer (etl) may include a material capable of transporting electrons. electron transport layer may be intrinsic (undoped), or doped. doping may be used to enhance conductivity. examples of the etl material are not particularly limited, and any metal complexes or organic compounds may be used as long as they are typically used to transport electrons. in one aspect, compound used in etl contains at least one of the following groups in the molecule: wherein r 101 is selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof, when it is aryl or heteroaryl, it has the similar definition as ar's mentioned above. ar 1 to ar 3 has the similar definition as ar's mentioned above. k is an integer from 1 to 20. x 101 to x 108 is selected from c (including ch) or n. in another aspect, the metal complexes used in etl contains, but not limit to the following general formula: wherein (o—n) or (n—n) is a bidentate ligand, having metal coordinated to atoms o, n or n, n; l 101 is another ligand; k′ is an integer value from 1 to the maximum number of ligands that may be attached to the metal. in any above-mentioned compounds used in each layer of the oled device, the hydrogen atoms can be partially or fully deuterated. thus, any specifically listed substituent, such as, without limitation, methyl, phenyl, pyridyl, etc. encompasses undeuterated, partially deuterated, and fully deuterated versions thereof. similarly, classes of substituents such as, without limitation, alkyl, aryl, cycloalkyl, heteroaryl, etc. also encompass undeuterated, partially deuterated, and fully deuterated versions thereof. in addition to and/or in combination with the materials disclosed herein, many hole injection materials, hole transporting materials, host materials, dopant materials, exiton/hole blocking layer materials, electron transporting and electron injecting materials may be used in an oled. non-limiting examples of the materials that may be used in an oled in combination with materials disclosed herein are listed in table 2 below. table 2 lists non-limiting classes of materials, non-limiting examples of compounds for each class, and references that disclose the materials. table 2materialexamples of materialpublicationshole injection materialsphthalocyanine and porphryin compoundsappl. phys. lett. 69, 2160 (1996)starburst triarylaminesj. lumin. 72-74, 985 (1997)cf x fluorohydrocarbon polymerappl. phys. lett. 78, 673 (2001)conducting polymers (e.g., pedot:pss, polyaniline, polythiophene)synth. met. 87, 171 (1997) wo2007002683phosphonic acid and sliane samsus20030162053triarylamine or polythiophene polymers with conductivity dopantsep1725079a1andorganic compounds with conductive inorganic compounds, such as molybdenum and tungsten oxidesus20050123751 sid symposium digest, 37, 923 (2006) wo2009018009n-type semiconducting organic complexesus20020158242metal organometallic complexesus20060240279cross-linkable compoundsus20080220265polythiophene based polymers and copolymerswo 2011075644 ep2350216hole transporting materialstriarylamines (e.g., tpd, α-npd)appl. phys. lett. 51, 913 (1987)us5061569ep650955j. mater. chem. 3, 319 (1993)appl. phys. lett. 90, 183503 (2007)appl. phys. lett. 90, 183503 (2007)triaylamine on spirofluorene coresynth. met. 91, 209 (1997)arylamine carbazole compoundsadv. mater. 6, 677 (1994), us20080124572triarylamine with (di)benzothiophene/ (di)benzofuranus20070278938, us20080106190 us20110163302indolocarbazolessynth. met. 111, 421 (2000)isoindole compoundschem. mater. 15, 3148 (2003)metal carbene complexesus20080018221phosphorescent oled host materialsred hostsarylcarbazolesappl. phys. lett. 78, 1622 (2001)metal 8- hydroxyquinolates (e.g., alq 3 , balq)nature 395, 151 (1998)us20060202194wo2005014551wo2006072002metal phenoxy- benzothiazole compoundsappl. phys. lett. 90, 123509 (2007)conjugated oligomers and polymers (e.g., 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compoundswo2005030900metal coordination complexes (e.g., zn, al with n{circumflex over ( )}n ligands)us20040137268, us20040137267blue hostsarylcarbazolesappl. phys. lett, 82, 2422 (2003)us20070190359dibenzothiophene/ dibenzofuran- carbazole compoundswo2006114966, us20090167162us20090167162wo2009086028us20090030202, us20090017330us20100084966silicon aryl compoundsus20050238919wo2009003898silicon/germanium aryl compoundsep2034538aaryl benzoyl esterwo2006100298carbazole linked by non-conjugated groupsus20040115476aza-carbazolesus20060121308high triplet metal organometallic complexus7154114phosphorescent dopantsred dopantsheavy metal porphyrins (e.g., ptoep)nature 395, 151 (1998)iridium (iii) organometallic complexesappl. phys. lett. 78, 1622 (2001)us2006835469us2006835469us20060202914us20060202914us20070087321us20080261076 us20100090591us20070087321adv. mater. 19, 739 (2007)wo2009100991wo2008101842us7232618platinum (ii) organometallic complexeswo2003040257us20070103060osminum (iii) complexeschem. mater. 17, 3532 (2005)ruthenium (ii) complexesadv. mater. 17, 1059 (2005)rhenium (i), (ii), and (iii) complexesus20050244673green dopantsiridium (iii) organometallic complexesinorg. chem. 40, 1704 (2001)us20020034656us7332232us20090108737wo2010028151ep1841834bus20060127696us20090039776us6921915us20100244004us6687266chem. mater. 16, 2480 (2004)us20070190359us 20060008670 jp2007123392wo2010086089, wo2011044988adv. mater. 16, 2003 (2004)angew. chem. int. ed. 2006, 45, 7800wo2009050290us20090165846us20080015355us20010015432us20100295032monomer for polymeric metal organometallic compoundsus7250226, us7396598pt (ii) organometallic complexes, including polydentated ligandsappl. phys. lett. 86, 153505 (2005)appl. phys. lett. 86, 153505 (2005)chem. lett. 34, 592 (2005)wo2002015645us20060263635us20060182992 us20070103060cu complexeswo2009000673us20070111026gold complexeschem. commun. 2906 (2005)rhenium (iii) complexesinorg. chem. 42, 1248 (2003)osmium (ii) complexesus7279704deuterated organometallic complexesus20030138657organometallic complexes with two or more metal centersus20030152802us7090928blue dopantsiridium (iii) organometallic complexeswo2002002714wo2006009024us20060251923 us20110057559 us20110204333us7393599, wo2006056418, us20050260441, wo2005019373us7534505wo2011051404us7445855us20070190359, us20080297033 us20100148663us7338722us20020134984angew. chem. int. ed. 47, 4542 (2008)chem. mater. 18, 5119 (2006)inorg. chem. 46, 4308 (2007)wo2005123873wo2005123873wo2007004380wo2006082742osmium (ii) complexesus7279704organometallics 23, 3745 (2004)gold complexesappl. phys. lett. 74, 1361 (1999)platinum (ii) complexeswo2006098120, wo2006103874pt tetradentate complexes with at least one metal- carbene bondus7655323exciton/hole blocking layer materialsbathocuprine compounds (e.g., bcp, bphen)appl. phys. lett. 75, 4 (1999)appl. phys. lett. 79, 449 (2001)metal 8-hydroxy- quinolates (e.g., balq)appl. phys. lett. 81, 162 (2002)5-member ring electron deficient heterocycles such as triazole, oxadiazole, imidazole, benzoimidazoleappl. phys. lett. 81, 162 (2002)triphenylene compoundsus20050025993fluorinated aromatic compoundsappl. phys. lett. 79, 156 (2001)phenothiazine- s-oxidewo2008132085silylated five- membered nitrogen, oxygen, sulfur or phosphorus dibenzoheterocycleswo2010079051aza-carbazolesus20060121308electron transporting materialsanthracene- benzoimidazole compoundswo2003060956us20090179554aza triphenylene derivativesus20090115316anthracene- benzothiazole compoundsappl. phys. lett. 89, 063504 (2006)metal 8- hydroxyquinolates (e.g., alq 3 , zrq 4 )appl. phys. lett. 51, 913 (1987) us7230107metal hydroxy- benoquinolateschem. lett. 5, 905 (1993)bathocuprine compounds such as bcp, bphen, etcappl. phys. lett. 91, 263503 (2007)appl. phys. lett. 79, 449 (2001)5-member ring electron deficient heterocycles (e.g., triazole, oxadiazole, imidazole, benzoimidazole)appl. phys. lett. 74, 865 (1999)appl. phys. lett. 55, 1489 (1989)jpn. j. apply. phys. 32, l917 (1993)silole compoundsorg. electron. 4, 113 (2003)arylborane compoundsj. am. chem. soc. 120, 9714 (1998)fluorinated aromatic compoundsj. am. chem. soc. 122, 1832 (2000)fullerene (e.g., c60)us20090101870triazine complexesus20040036077zn (n{circumflex over ( )}n) complexesus6528187 re(i) complexes have been reported as phosphorescent emitters in oleds. the compounds reported in literature that were used in oleds all contain monodentate ligands such as carbonyl. the stability of the devices with these complexes is low and does not meet the commercial requirements. in this invention, bistridentate re(i) complexes are disclosed. these complexes should provide much better stability than those with monodentate ligands. neutral bistridentate re(i) complexes are disclosed. one of the tridentate ligand is monoanionic and the other is neutral. these complexes can be used as emitters or other functional materials, such as charge transporting materials, for oleds. dft (density function theory) calculations were performed for certain example compounds and comparative compounds. the results are shown in table 3 below. geometry optimization calculations were performed within the gaussian 09 software package using the b3lyp hybrid functional and cep-31g effective core potential basis set. table 3calculation results of inventive compoundscompoundhomolumonumberstructure(ev)(ev)s 1 (nm)t 1 (nm)compound 1−3.31−0.41584812compound 385−3.73−0.86583779compound 19−3.23−0.617011007compound 1729−2.99−0.848541446compound 20−3.46−1.097181012compound 2017−3.87−1.648621398compound 2031−3.96−2.202941424 table 3 summarizes the homo, lumo energy levels, singlet energy (s 1 ), and triplet energy (t 1 ) of inventive compounds. the calculated t 1 of the compound are in deep red or near ir range. therefore, the inventive compounds can be used as deep red or near ir emitters for phosphorescent oleds. in addition, the calculated homo levels of these compounds are very shallow, which make them suitable for change injection or transporting materials, especially for hole injection. general method of making the re(l a )(l b ) complexes: the inventive re(l a )(l b ) complexes may be prepared by processes known to those skilled in the art. suitable processes are mentioned, for example, in inorg. chem. 1996, 35, 5584-5594 and the literatures cited therein. the inventive complexes can be purified by processes known to those skilled in the art. typically, the workup and purification are affected by extraction, column chromatography, recrystallization, and/or sublimation by processes known to those skilled in the art. a schematic process that can be used for preparing compound 2017 embodiment of the inventive re(l a )(l b ) complex is detailed below: it is understood that the various embodiments described herein are by way of example only, and are not intended to limit the scope of the invention. for example, many of the materials and structures described herein may be substituted with other materials and structures without deviating from the spirit of the invention. the present invention as claimed may therefore include variations from the particular examples and preferred embodiments described herein, as will be apparent to one of skill in the art. it is understood that various theories as to why the invention works are not intended to be limiting.
006-466-287-440-268	FI	[ "FI", "EP", "WO", "US" ]	H04L29/06,H04W88/18,G01R31/08	2001-08-27T00:00:00	2001	[ "H04", "G01" ]	selecting an operational mode of a codec	the present invention describes a method for selecting a preferable codec mode for a connection between a first communication device (ue1) and a second communication device (ue2), where the devices communicate via a network. an element in the network observes a quality of said connection. the quality is based on a data error level of network resource. based on the observation the network element judges a preferable operational mode of the codec, from a group of operational modes of the codec. the preferable codec mode is based on the quality level of the connection. in the preferred embodiment, if a radio network controller (rnc) observes congestion by observing real-time protocol (rtp) header information, the rnc judges a lower codec mode for the connection. the lower mode for the connection is judged if there is at least one gap in a sequence of detected packets.	1. a method for selecting an operational mode of a codec of at least a first communication device (ue1), the method comprising: communicating from the first communication device (ue1) information indicating from a group of operational modes of the codec that operational mode which the first communication device (ue1) uses for a connection between the first (ue1) and a second communication device (ue2) where the first and the second communication device (ue1 , ue2) communicate via a network, characterised by observing a quality level (ql) of the connection between the first and the second communication device (ue1 , ue2) in the network, and based on the observing selecting an operational mode of the codec depending on the quality level (ql). 2. a method according to claim 1 , wherein the step of observing the quality level of the connection comprises detecting at least one packet loss if there is at least one gap in a sequence of detected packets, wherein the sequence is based values in real-time protocol (rtp) sequence number fields (200). 3. a method according to claim 1 , wherein the step of observing the quality level of the connection comprises observing real-time protocol (rtp) header information of the connection. 4. a method according to claiml , wherein an element (302, 308) of the network observes the quality level (ql). 5. a method according to claim 1 , wherein the quality level (ql) comprises a data error rate of the connection. 6. a method according to claim 1 , wherein the quality level (ql) is based on a number of packets lost per a number of packets in transmission in a network element. 7. a method according to claim 1 , 2 or 3, wherein the step of selecting an operational mode of the codec comprises selecting a lower codec mode if the quality level is above a certain maximum level. 8. a method according to claim 1 , 2 or 3, wherein the step of selecting an operational mode of the codec comprises selecting a higher codec mode if the quality level is below a certain minimum level. 9. a method according to claim 2, wherein the operational mode of the codec depending on the quality level (ql) is selected if a certain amount of packet loss is observed. 10. a method according to claim 1 , wherein an element (302, 308) of the network selects the operational mode of the codec depending on the quality level (ql) by sending a command indicating the operational mode of the codec depending on the quality level (ql) at least to the first communication device (ue1). 11.a method according to any of the preceding claims, wherein at least one of the communication devices (ue1 , ue2) comprises a mobile communication device. 12. a method according to claim 1 , wherein the network comprises a radio access network and a fixed core network. 13. a method according to any of the preceding claims, wherein the operational mode of the codec comprises an operational mode of an adaptive multi- rate (amr) codec. 14. a method according to claim 13, wherein the operation mode of the adaptive multi-rate (amr) codec comprises a bit rate of the adaptive multi- rate (amr) codec. 15. a method according to claiml , wherein the step of selecting the operational mode of the codec depending on the quality level (ql) comprises selecting a particular codec from the group of operational modes of the codec. 16. a first communication device (ue1) for communicating encoded information to a second communication device (ue2) via a network, the first communication device (ue1) comprising: a transmitter (rf) for transmitting information to the second communication device (ue2) via the network, the information indicating from a group of operational modes of a codec that operational mode which the first communication device (ue1) uses for a connection between the first communication device (ue1) and the second communication device (ue2), characterised in that the first communication device (ue1) further comprises means for transmitting the information in a format which enables a network element (302, 308) to observe a quality level (ql) of the connection between the first and the second communication device (ue1 , ue2), and means for receiving a command from the network element (302, 308) indicating an operational mode of the codec depending on the quality level (ql), where the operational mode of the codec depending on the quality level (ql) is selected by the network element (302, 308). 17. a system for communicating encoded information between a first communication device (ue1) and a second communication device (ue2) the system comprising the first communication device (ue1), the second communication device (ue1) and a network, the first communication device (ue1) comprising: a transmitter (rf) for transmitting information from the first communication device (ue1) to the second communication device (ue2) via the network, the information indicating from a group of operational modes of a codec that operational mode which the first communication device (ue1) uses for a connection between the first communication device (ue1) and the second communication device (ue2), characterised in that the network comprises a quality level observation unit (304, 310) for observing a quality level (ql) of the connection between the first and the second communication device (ue1 , ue2), and based on the observing the quality level observation unit (304, 310) selects an operational mode of the codec depending on the quality level (ql). 18. a computer program product for a network entity (302, 308), the computer program product comprising: computer executable code for enabling the network entity (302, 308) to observe a quality level (ql) of a connection between a first communication device (ue1) and a second communication device (ue2) where the first and the second communication device (ue1 , ue2) communicate via a network over the connection, and where the network entity (302, 308) receives information indicating an operational mode of a codec from a group of operational modes of the codec that the first communication device (ue1) uses for the connection between the first communication device (ue1) and the second communication device (ue2), and computer executable code for enabling the network entity (302, 308) to select an operational mode of the codec depending on the quality level (ql). 19. a computer program product according to claim 18, wherein the network entity (302, 308) comprises at least one of a radio network controller of a third generation mobile network, a base station controller and an element in a general packet radio system (gprs) enhanced radio access network (geran).	selecting an operational mode of a codec this invention relates to a selection of an operational mode of a codec between communication devices where the communication devices communicate via a network. in wireless telecommunication systems information is transferred in an encoded form between a transmitting communication device and a receiving communication device. the transmitting communication device encodes original information into encoded information and sends it to the receiving communication device. the receiving communication device decodes the received encoded information in order to recreate the original information. the encoding and decoding is performed in codecs. thus, the encoding is performed in a codec located in the transmitting communication device, and the decoding is performed in a codec located in the receiving communication device. however, since there are many different codecs available, the transmitting terminal and the receiving terminal have to agree upon the codec(s) to be used in a session. the selection of the codec takes place during the communication. the gsm (global system for mobile communication) codec mode selection over air interface is described next. the codec mode related information, which is transmitted on each link, contains cmi (codec mode lndication(s)) and cmc (codec mode command(s)) in the downlink, respectively cmi and cmr (codec mode request(s)) in the uplink. the cmi informs the receiver about the currently applied codec mode. the cmc informs the other end about the codec mode to be applied on the other link. the cmr informs the other end about the preferred codec mode on the other link. in the gsm, the codec mode information is transmitted in the speech traffic channel, using a part of its transmission capacity. codec modes are constrained to change only every second speech frame. the cmcs/cmrs and the cm is are altered such that they occur only every second frame. for codec mode adaptation the receiving side performs link quality measurements of the incoming link. the measurements are processed yielding a quality indicator (ql). for uplink (ul) adaptation, the ql is directly fed into the ul mode control unit. this unit compares the ql with certain thresholds and generates, also considering possible constraints from network control, the cmc indicating the codec mode to be used on the uplink. the cmc is then transmitted in the speech traffic channel to the mobile side where the incoming speech signal is encoded in the corresponding codec mode. for downlink (dl) adaptation, the dl mode request generator within the mobile compares the dl quality indicator with certain thresholds and generates a cmr indicating the preferred codec mode for the dl. the cmr is transmitted in the speech traffic channel to the network side where it is fed into the dl mode control unit. this unit generally grants the requested mode. however, considering possible constraints from network control, it may also override the request. the resulting codec mode is then applied to encoding of the incoming speech signal in downlink direction. both for uplink and downlink, the presently applied codec mode is transmitted in the speech channel as cmi together with the coded speech data. at the decoder, the cmi is decoded and applied for decoding of the received speech data. in both ul and dl, there is always a transcoder in the network. the transcoder causes delays in the communication. disadvantageously, the codec mode selection is only based on the quality of the radio interface. the communication of the encoded information is critical for error free data communication in real-time applications such as a voice call. for example, in the voice call it is more preferable to use lower bit rate such as a lower codec mode with fewer errors than higher bit rate with larger number of errors. generally, the communication of the real-time application uses lower bit rates with few data errors rather than high bit rates with data errors. the errors are due to packet losses or bit errors. therefore, the selection of the codec is an important compromise between the data speed and qos (quality of service). one solution to provide feedback on the quality of the data distribution is an additional companion protocol, rtcp (real-time control protocol) operating in voip (voice over internet protocol) systems. the transmitting communication device can make use of rtcp information to adapt the applied encoding scheme to changes in the network load in order to improve service at the receiving communication device. this requires that the devices support the rtcp that is undesirable because the devices would require more processing power and memory. the increase in required processing power leads to higher power consumption which is undesirable in wireless user terminals operated by a battery. because the rtcp information needs to be communicated in backward direction, the communication of the rtcp information reserves and reduces network capacity from the actual services. one solution to reduce the network capacity is a header removal technique which is a method where the rtcp can be separated from the actual data. thus, the actual data stream runs separately from the rtcp information. if the header removal is applied to the data stream, the rtcp needs to be run on a parallel pdp (packet data protocol) context. however, the header removal technique requires additional mechanisms to link or create the removed header to the 'header removed data'. therefore, a substantial associative problem to link the data and the header emerge when the header removal of the packet is used because a recognition whether a packet is the rtcp packet or not is very difficult. there are other packets with or without the header in the data stream. thereby, substantial difficulties emerge again in the linking. there is a need to observe the quality of the entire connection between the transmitting and receiving communication device and based on the observed quality select a communication mode depending on the quality. according to a first aspect of the invention there is provided a method for selecting an operational mode of a codec of at least a first communication device, the method comprising: communicating from the first communication device information indicating from a group of operational modes of the codec that operational mode which the first communication device uses for a connection between the first and a second communication device where the first and the second communication device communicate via a network, wherein observing a quality level of the connection between the first and the second communication device in the network, and based on the observing selecting an operational mode of the codec depending on the quality level. preferably, the quality level contains a data error rate of the connection. accordingly, in the preferred embodiment the quality level is represented by a value indicating an inverse quality of the connection because if the quality level is high the actual quality of the connection is worse than normal. also, if the quality level is low, the actual quality of the connection is better than normal. the quality level can be based on a number of packets lost per a number of packets in transmission in a network element. thus, the quality level can be defined by means of the packet loss rate (plr). this can be computed by the sequence number information as ql = 100 * number of packets lost / number of packets in transmission in a network element. the quality level can depend on for example, congestion in a packet based network or weak coverage of the radio part of the network, thus both resulting in bit errors or packet lost. preferably, the step of observing the quality level of the connection contains observing real-time protocol (rtp) header information of the connection. in a more particular embodiment, the step of observing the quality level of the connection contains detecting at least one packet loss if there is at least one gap in a sequence of detected packets. the sequence is based on values in real-time protocol (rtp) sequence number fields of the observed packets. advantageously, a network element is able to observe the rtp header information of the connection and there is not required additional companion information about the quality of the connection. advantageously, if the quality level exceeds a certain maximum criteria, the codec mode is changed to a lower codec mode than a requested or currently applied codec mode. if the quality level is below a certain minimum criteria, the codec mode is changed to a higher codec mode than the requested or currently applied codec mode. preferably, the communication devices comprise mobile communication devices operating in a third generation mobile network, and the network contains a radio access and an internet protocol (ip) based fixed core. preferably, the operational mode of the codec contains an operational mode/bit rate of an amr (adaptive multi-rate) codec. in a further embodiment of the invention, the step of selecting the operational mode of the codec depending on the quality level contains selecting a particular codec from the group of operational modes of the codec. the system in the embodiment contains different codecs to be applied in the communication between the first and the second communication devices via the network. the first communication device receives a command from a network entity that the particular codec for the connection is to be used. thus, the network entity has observed the quality level and based on the observing selected the particular codec for the connection. for example, the first and the second communication devices contain two codecs, a half rate codec and an adaptive multi-rate (amr) codec. the network entity selects the half rate codec by sending the command at least to the first communication device because the network element has observed the reduced quality of the connection. according to a second aspect of the invention there is provided a first communication device for communicating encoded information to a second communication device via a network, the first communication device comprising: a transmitter for transmitting information to the second communication device via the network, the information indicating from a group of operational modes of a codec that operational mode which the first communication device uses for a connection between the first communication device and the second communication device, wherein the first communication device further comprises means for transmitting the information in a format which enables a network element to observe a quality level of the connection between the first and the second communication device, and means for receiving a command from the network element indicating an operational mode of the codec depending on the quality level, where the operational mode of the codec depending on the quality level is selected by the network element. preferably, the communication devices are mobile communication devices operating in a third generation mobile communication network. according to a third aspect of the invention there is provided a system for communicating encoded information between a first communication device and a second communication device the system comprising the first communication device, the second communication device and a network, the first communication device comprising: a transmitter for transmitting information from the first communication device to the second communication device via the network, the information indicating from a group of operational modes of a codec that operational mode which the first communication device uses for a connection between the first communication device and the second communication device, wherein the network comprises a quality level observation unit for observing a quality level of the connection between the first and the second communication device, and based on the observing the quality level observation unit selects an operational mode of the codec depending on the quality level. preferably, the system comprises a third generation mobile communication system. according to another embodiment, the quality level unit operates in a conventional radio network controller (rnc) of the network. according to a fourth aspect of the invention there is provided a computer program product for a network entity, the computer program product comprising: computer executable code for enabling the network entity to observe a quality level of a connection between a first communication device and a second communication device where the first and the second communication device communicate via a network over the connection, and where the network entity receives information indicating an operational mode of a codec from a group of operational modes of the codec that the first communication device uses for the connection between the first communication device and the second communication device, and computer executable code for enabling the network entity to select an operational mode of the codec depending on the quality level. preferably, the network entity contains at least one of a radio network controller of a third generation mobile network, a base station controller, an element in a general packet radio system (gprs) enhanced radio access network (geran). the invention will now be described, by way of example only, with reference to the accompanying drawings, in which: figure 1 shows an example of a transport protocol format where the amr packets are transmitted over the ip in accordance with the invention; figure 2 shows an example of the rtp header information which is observed in accordance with the invention; figure 3 shows an embodiment of the third generation telecommunication system where rtp header information is observed; figure 4 shows a signalling diagram in changing the codec mode to a codec mode which is based on the quality level of the connection according to an embodiment of the invention; figure 5a shows in form of a flow chart a method for selecting the codec mode for downlink traffic according an embodiment of the invention; figure 5b shows in form of a flow chart a method for selecting the codec mode for uplink traffic according to an embodiment of the invention; and figure 6 shows a mobile station according to the invention. the present invention is generally directed to an apparatus and a method for selecting a preferable codec mode for a connection between a first communication device (ue1) and a second communication device (ue2), where the devices communicate via a network. an element in the network observes the quality level (ql) of said connection. the quality level (ql) is based on a data error level of network resource. based on the observation the network element judges a preferable operational mode of the codec, from a group of operational modes of the codec. the preferable codec mode is based on the quality level of the connection. if the quality level (ql) of the connection is high, a lower codec mode than the requested or currently applied codec mode is selected. also, if the quality level (ql) of the connection is low, a higher codec mode than the requested or currently applied codec mode is selected. the preferable codec mode may also be the currently applied codec. in the preferred embodiment, if a radio network controller (rnc) observes congestion by observing real-time protocol (rtp) header information, the rnc judges a lower codec mode than a requested or currently applied codec mode for the connection. the lower mode for the connection is judged if there is at least one gap in a sequence of detected packets. the lower mode for the connection can also be judged if there is a gap longer than a predefined threshold. in the preferred embodiment the ue1 is a wireless mobile station of a cellular radio network and the ue2 is another wireless mobile station of the same or another cellular radio network. an example of the cellular radio network is a wideband code division multiple access (wcdma) network or another third generation network. the ue1 and/or the ue2 may also be fixed terminal operating in a fixed network. for example, the ue1 is an ip telephone coupled with an ip based network such as the internet. figure 1 shows an example of a transport protocol format where amr (adaptive multi-rate) packets are transmitted over the ip in accordance with the invention. the voip (voice over internet protocol) is a term used in ip telephony for a set of facilities for managing the delivery of voice information using the internet protocol (ip) 100. in general, this means sending voice information in digital form in discrete packets rather than in the traditional circuit switched protocols of a public switched telephone network (pstn). advantageously, the voip and internet telephony provide means for reducing the costs of telephone service. the voip, now used somewhat generally, derives from the voip forum, an effort by major equipment providers to promote the use of itu-t's (telecommunication standardization sector of the international telecommunications union) standard for sending voice (audio) and video using the ip on the internet and within intranet. the forum also promotes for example voice mail. in addition to the ip 100, the communication of voice data uses rtp (real-time protocol) 104 to help to ensure that packets get delivered in a timely manner. using the internet or public networks, it is currently difficult to guarantee the qos. the real-time traffic in the ip network is typically carried using udp (user datagram protocol) 102 which is a very lightweight protocol. as an example, the additional services that the udp 102 provides are source and destination ports and an optional checksum that covers the udp/ip header. the rtp 104 can be used above the udp 102 to add end-to-end delivery services that are useful for real-time traffic. in particular, the rtp 104 provides transmitted datagrams / packets with sequence number, payload type identification and timestamping services. the rtp 104 is defined by the itu (international telecommunications union). the rtp 104 is typically integrated into the application layer of the end-applications rather than being implemented as a separate layer in the communications software stack. the rtp 104 can be used in both unicast and multicast communication. an rtp session is defined by an ip address and a pair of udp destination ports, one for rtp packets. in case of an audio-video conference the audio and video may use different sessions, for example, the same destination address but different port pairs. the rtp 104 is a flexible protocol and can be tailored to a particular application's needs by using for example profiles. since each application uses only a single profile, no explicit indication of which profile is in use is necessary with the rtp 104. one applicable codec in the invention is the amr (adaptive multi-rate) speech codec. the amr codec is developed by the etsi (european telecommunications standards institute). the amr codec is standardized for gsm, and is also chosen by the third generation partnership project (3gpp) as the mandatory codec for third generation systems. the amr codec will be widely used in various cellular systems. the amr codec is a multi-mode codec with 8 narrow band speech codec modes with bit rates 4.75, 5.15, 5.90, 6.70, 7.40, 7.95, 10.2 and 12.2 kbps, thus resulting in 8 different codec modes according to bit rate. the highest codec mode contains 12.2 kbps and the lowest codec mode contains 4.75 kbps. the sampling frequency is 8000 hz and processing is done on 20 ms frames, for example, 160 samples per frame. the amr codec modes are closely related to each other and use the same coding framework. three of the amr codec modes are already adopted standards of their own, the 6.7 kbps mode as pdc-efr (personal digital communications-enhanced full rate), the 7.4 kbps mode as is-641 codec in tdma (time division multiple access), and the 12.2 kbps mode as gsm-efr. another applicable codec in the invention is the adaptive multi-rate wideband (amr-wb) speech codec. the amr-wb codec was originally developed by 3gpp (3g partnership project) to be used in gsm and 3g systems. the amr-wb codec will be widely used in various cellular systems. the amr-wb codec is a multi- mode speech codec with 9 wideband speech coding modes with bit-rates 6.6, 8.85, 12.65, 14.25, 15.85, 18.25, 19.85, 23.05 and 23.85 kbps, thus resulting in 9 different codec modes according to bit rate. the highest codec mode contains 23.85 kbps and the lowest codec mode contains 6.6 kbps. the sampling frequency is 16000 hz and processing is performed on 20 ms frames, i.e. 320 speech samples per frame. the amr-wb codec modes are closely related to each other and employ the same coding framework. both codecs (amr and amr- wb) are applicable in the invention. in the embodiment of the invention, the multi-mode feature of the codec is used to preserve high speech quality under a wide range of transmission conditions. in mobile communication, the mode selection allows the system to adapt the balance between speech coding and error protection to enable the best possible speech quality in prevailing transmission conditions. the mode selection can also be utilized to adapt to the varying available transmission bandwidth. advantageously, the codec(s) can handle mode changing at least to the next lower or upper mode at any time, for example, the bit rate is changed to a lower mode 12.65 kbps from a higher mode 14.25 kbps, if there is congestion in the network resource. the codec(s) can also handle mode changing to another mode. if the quality level (ql) of the connection is high i.e. the actual quality is poor, a lower codec mode than the requested or currently applied codec mode is selected. also, if the quality level (ql) of the connection is low i.e. the actual quality is good, a higher codec mode than the requested or currently applied codec mode is selected. the mode information is transmitted together with the speech encoded bits, to indicate the mode. for example, the mode information is attached to the rtp frame. both codecs (amr, amr-wb) include voice activity detection (vad) and generation of comfort noise (cn) parameters during silence periods. thus, the codecs have the option to reduce the number of transmitted bits and packets during silence periods to a minimum. the operation to send cn parameters at regular intervals during silence periods is usually called discontinuous transmission (dtx) or source controlled rate (scr) operation. the frames containing cn parameters are called silence indicator (sid) frames. conventionally, the codecs are suitable for circuit swithed cellular systems, but due to the flexibility and robustness of these codecs, they are suitable also for other preferred application. the preferred applications are real-time services over packet switched networks. still referring to figure 1 , coded voice data (amr) 106 is transmitted on top of the rtp 104. the amr format can be designed for robustness against both bit errors and packet loss. the preferred transport format of the voice data is am r/rtp/u dp/ip as shown in the figure 1. the speech encoded bits have different perceptual sensitivity to bit errors and alternatively cellular systems may exploit this by using unequal error protection and detection (uep and ued). the payload format supports several means to increase robustness against packet loss. the simple scheme of repetition of previously sent data is one possibility. another possible scheme which is more bandwidth efficient is to use payload external fec (forward error correction), which generates extra packets containing repair data. the whole payload can also be sorted in sensitivity order to support external fec schemes using uep. several frames can be encapsulated into a single packet to decrease protocol overhead. one of the drawbacks of such an approach is that in case of packet loss this means loss of several consecutive speech frames, which usually causes clearly audible distortion in reconstructed speech. interleaving of frames can improve the speech quality in such cases by distributing the consecutive losses into series of single frame losses. interleaving and bundling several frames per payload will also increase end-to-end delay and is therefore not applicable to all types of applications. however, streaming applications are able to exploit interleaving to improve speech quality in lossy transmission conditions. figure 2 shows an example of rtp header information which is observed in the rnc (radio network controller) in accordance with the invention. the ue1 (or ue2 respectively) increments a sequence number field 200 (16 bits) by 1 each time it sends an rtp packet. alternatively, the rnc1 (or rnc2 respectively) can increment the sequence number field 200 by 1 each time it sends an rtp packet. the increment enables the rnc2 (or the rnc1 respectively) to restore the initial packet sequence in the event of any reordering that may have occurred during transmission through the network. alternatively, the ue1 (or the ue2 respectively) can restore the packet sequence. advantageously, in addition to the reordering, the rnc2 (or the rnc1 respectively) can detect packet loss if there is at least one gap in the sequence of received packets. the rnc can observe the quality of the connection such as the congestion of the network or weak network coverage and determine the reduced qos if there is at least one gap in the sequence of received packets. there may also be several gaps in the sequence of received packets. for example, if there has been previously received packets with sequence numbers 1, 2, 3 and then received packets 7 and 8, the receiving device can detect the reduced quality. advantageously, in case the quality level is below a certain threshold, the rnc is able to select the lower codec mode for the connection in order to improve the qos. the initial value of the sequence number is chosen at random. a timestamp field 202 (32 bits) reflects the sampling instant of the rtp packet and allows the rnc2 or ue2 (rnc1 or ue1 respectively) to ensure that each packet is "played" at the correct point in time to ensure that the original timing relationship between the samples is maintained. alternatively, in the case of sources that generate rtp packets periodically, for example fixed audio, the timestamp does not explicitly represent an absolute time. instead, it would be incremented by one at each sampling interval. in addition to the sequence number field 200 and the timestamp field 202, the rtp header information may comprise the following fields. a version field 204 (1 bit) identifies the version of the rtp 104. if a padding field 206 (1 bit) is set, it indicates that the packet contains one or more octets at the end which are not part of the payload. for example, in the case if certain encryption algorithms are being used. if the value of the padding field = 1 , then the last octet of the packet or header indicates how many octets of padding there are in total. if an extension field 208 (1 bit) is set, it indicates that the fixed header is followed by a single variable length header extension containing additional fields. the third and fourth octets of this header extension indicate its length. thus, applications not supporting this header extension can ignore it. this kind of header extension may be used as a temporary measure to allow individual implementations to experiment with new payload-format independent functions. if the assessment of the new functions proved favourable then they could be captured in a new profile specification. a csrc (contributing source) count field 210 (4 bits) is the number of csrc identifiers that follow the fixed header. a marker field 212 (1 bit) allows significant points to be marked in the traffic stream. for example, frame boundaries can be marked by the marker field 212. a payload type field 214 (7 bits) identifies the format of the rtp payload. a ssrc (synchronisation source) field 216 (32 bits) identifies the synchronisation source of a group of packets. it is a randomly chosen value meant to be globally unique within a particular rtp session. all packets from the same synchronisation source form a part of the same timing and sequence number. an example of a synchronisation source is a microphone or a mixer. a csrc (contributing source) list 218 is required when mixing is performed. a mixer accepts packets from one or more synchronisation sources, possibly changes the data format and combines the packets in some manner to form a combined rtp packet to be forwarded. the ssrc of the combined packet will be equal to that of the mixer while the csrc list identifies all of the original ssrcs that contributed to the combined stream. figure 3 shows an embodiment of the third generation telecommunication system where the rtp header information is observed. ue1 (first communication device) 300 is coupled with rnc1 (first radio network controller) 302 via a radio path and a base station. the rnc1 302 comprises a quality level (ql) observation unit 304. the ql observation unit 304 observes a bit error / a packet loss rate of the network based on the rtp header information and accordingly the rnc (302 or 308) decides whether to change the codec mode of the connection. the ql observation unit 304 is a computing software running in a conventional rnc. alternatively, the ql observation unit 304 can be hardware or middleware implemented by, for example, a digital signalling processor(s) (dsp). the rnc1 302 communicates with rnc2 (second radio network controller) 308 via a core network 306. the core network 306 enables the transfer of ip based data information. moreover, the ue1 300 and the rnc1 (ue2 312 and the rnc2 308 respectively) can communicate by the ip based data information. the rnc2 308 comprises the ql observation unit 310 which is equivalent to the ql unit 304 but operating under the rnc2 308. the rnc2 308 is coupled with the ue2 (second communication device) 312 via a radio path. in the embodiment of figure 4 data traffic relating to the communication between the uplink and the downlink can be transferred via the same path. the codec related information, request and command (cmi, cmr, cmc) are applicable to run in the cellular radio network. figure 4 shows a signalling diagram in changing the applied codec mode to the codec mode which depends on the quality level of the connection according to an embodiment of the invention. the ue1 sends the information cmi and a request for codec mode 12.2 kbps (cmr to the rnc1. the actual voice data communication in accordance with the cmr x and the cmi is designed to the ue2. the rnc1 receives and forwards the cmi and the cmri to the rnc2. the rnc2 receives the cmi and the cmr j . the rnc2 observes the network traffic and is able to study the data stream as referred to the examples of figures 1 , 2 and 3. if the rnc2 detects, based on studying, that a substantial amount of the packets are missing, the rnc2 creates and stores a new lower value, for example, 10.2 kbps for the request cmr j . the substantial amount of missing packets is an adjustable amount of the packets depending on the required qos set by a network operator. the rnc2 creates the command cmc indicating the applied codec mode 10.2 kbps based on the cmr^ the rnc2 transmits the cmc and the information cmi to the ue2. the ue2 receives the cmc and the cmi and sends a request for codec mode 7.95 kbps (cmr 2 ) to the rnc2. the ue2 sends the request for codec mode 7.95 kbps because the ue2 has detected reduced quality for the radio path between the rnc2 and ue2. the rnc2 receives the cmr 2 . the rnc2 compares the stored 10.2 kbps cmr j to the 7.95 kbps cmr 2 . if the value of the cmr 2 is smaller than the value of the cmr p the applied codec mode is selected to be the lower 7.95 kbps cmr 2 . if the value of the c r j had been smaller than the value of the cmr 2 , the applied codec mode would have been selected to be the lower cmr ; instead of cmr 2 . advantageously, the applied codec mode can be contained in the one of the rtp or the amr fields. the codec requests can be contained in a packet(s) or frame(s), and/or they can be contained in transmission protocol field, for example in the rtp or the amr field. in the example of figure 4, if the ue2 had not detected the reduced quality in the radio path, the rnc2 would have selected the codec mode 10.2 kbps. advantageously, the codec mode selection is based on the qos of the actual network, the network comprising both the radio access and the core network. if the flow of speech data is from ue2 to ue1 , the rnc1 has the essential role in the codec mode selection process, and advantageously the communication between the ue2 and ue1 may take place in accordance with the preferable communication mode. in figures 5a and 5b a flow of speech data is considered to be: ue1- >rnc1->rnc2->ue2. the inverse data flow, ue2->rnc2->rnc1->ue1 , is also applicable and operates inversely. figure 5a shows a method for selecting the codec mode for downlink traffic according to an embodiment of the invention. the rnc2 receives packets as the intended communication between ue1 and ue2 takes place (step 500). the rnc2 makes quality level (ql) measurements (step 502) and is able to detect packet losses based on the data communication between the ue1 and the rnc2 including, but not limited, communication over the radio interface and the core network. the rnc2 observes the network traffic and is able to study the data stream as referred to the examples of figures 1 , 2 and 3. in condition 504, based on the measurements if the ql is greater than a maximum threshold (maxthreshold), the rnc2 selects a lower codec mode than the requested or currently applied codec mode (step 506). the rnc2 selects the lower codec mode by sending a request indicating lower codec mode (cmr i0 ) to the rnc1. for example, the rnc2 has received a codec mode request for 23.05 kbps codec mode, and the rnc2 observes reduced quality and changes the codec mode request to the 19.85 kbps cmr i0 . the selection of the lower codec mode comprises also sending the command cmc i0 to the ue1. this can be a separate message or contained in the request cmr £0 which is sent to the rnc1. in the condition 504, if the ql is not greater than the maxthreshold, the rnc2 performs another condition 508. in the condition 508, if the ql is smaller than a minimum threshold (minthreshold), the rnc2 selects a higher codec mode than the requested or currently applied codec mode (step 510). the rnc2 selects the higher codec mode by sending a request indicating higher codec mode (cmr ffl ) to the rnc1. for example, the rnc2 has received a codec mode request for 15.85 kbps, and the rnc2 observes that the ql is smaller than the minthreshold and changes the codec mode to the 18.25 kbps cmr w . the selection of the higher codec mode comprises also sending the command cmc ffi to the ue1. the cmc^ y intended to the ue1 can be a separate message or contained in the request cmr ffi which is sent to the rnc1. in the condition 508, if the ql is not smaller than mintheshold, the codec mode is not changed and the process ends (step 512). figure 5b shows a method for selecting the codec mode for uplink traffic according to an embodiment of the invention. the rnc1 receives packets as the intended communication between the ue1 and the ue2 takes place (step 514). the rnc1 makes quality level (ql) measurements (step 516) and is able to detect packet losses based on the communication between the ue1 and the rnc1 including, but not limited, communication over the radio interface and the core network. the rnc1 observes the data traffic and is able to study the data stream as referred to the examples of figures 1 , 2 and 3. in condition 518, based on the measurements if the ql is greater than a maximum threshold (maxthreshold), the rnc1 selects a lower codec mode than the requested or currently applied codec mode (step 520). the rnc1 selects the lower codec mode by sending a command indicating lower codec mode (cmc i0 ) to the ue1. for example, the rnc1 has received a codec mode request for 12.2 kbps codec mode, and the rnc1 observes congestion and changes the codec mode to the 10.2 kbps cmc i0 . thus, the cmc l0 indicates lower codec mode than the codec mode which is initially received or currently applied at the rnc1. in the condition 518, if the ql is not greater than the maxthreshold, the rnc1 performs another condition 522. in the condition 522, if the ql is smaller than a minimum threshold (minthreshold), the rnc1 selects a higher codec mode than the requested or currently applied codec mode (step 524). the rnc1 selects the higher codec mode by sending a command indicating higher codec mode (cmc ffl ) to the ue1. for example, the rnc1 has received a codec mode request for 6.70 kbps codec mode, and the rnc1 observes that the ql is smaller than the minthreshold and changes the codec mode to the 7.40 kbps cmc ffi . in the condition 522, if the ql is not smaller than mintheshold, the codec mode is not changed and the process ends (step 526). the minimum threshold (minthreshold) indicates respectively the minimum quality level below which it is allowed to switch to a higher codec mode. the maximum quality threshold (maxthreshold) respectively indicates the maximum quality level above which it is recommended to switch to a lower codec mode by the network element such as the rnc. the distance between the minthreshold and the maxthreshold determines the sensitivity of the process. the minthreshold and the maxthreshold can be defined by the network operator. the quality of the connection in packet based network, comprising at least the radio path and the core part, can depend generally on two factors: 1) the number of packets in a queue and 2) the size of the packets in the queue. for quality measurement rncs do not make use of the rtcp information, but the rtp header information. in particular, the rncs make use of the sequence number field to check if the natural sequence spaced by one unit has been broken or interrupted, due to one or more packet lost. the ql is defined by means of the packet loss rate (plr). this can be computed by the sequence number information as ql = 100 * number of packets lost / number of packets in transmission in rnc. because of the nature of the speech, it may be useless to keep all the history of packet losses since the beginning of the flow. for example, it is not important if the speech quality was bad 1 minute ago, if it is good now. the ql measurement can be restricted to the latest period of time t, where t can be defined by the operator. in synthesis, points of time to determine the ql are the following. 1) when the codec (amr) mode is changed. these operations happen when the traffic checked in rnc is really transmitted with a new codec (amr) mode. 2) during a normal operation if time > t. thus, if the time index t is exceeded. another variable that is defined by the network operator is the amount of time needed before the codec (amr) mode can be changed. for example, it could be unsuitable to react too quickly when a packet loss occurs, but instead it would be better to change mode if the lossy condition persists for 1 or 2 seconds. this time can be defined by a variable r (reaction time). a transcoding enables a usage of different codec mode between different elements having different codecs in the network. for example, between the ms and the pstn in the gsm, where the msc (mobile switching centre) contains the transcoding. the transcoding further enables a usage of different codec (amr) mode between the ue1 and the ue2 when the voice call is active. preferably, the codec (amr) modes should be the same in the ue1 and in the ue2 when the voice call is activated, but the core network can adapt the communication by transcoding if the codec (amr) modes of the ue1 and the ue2 are different. disadvantageously, the transcoding creates delays in the communication. figure 6 shows a cellular mobile station 600 according to the invention. the mobile station 600 shown operates as the ue1. a corresponding mobile station may operate as the ue2. the mobile station 600 comprises a processing unit cpu, a radio frequency part rf and a user interface ul. the radio frequency part rf and the user interface ul are coupled to the processing unit cpu. the user interface ul comprises a display and a keyboard (not shown) to enable a user to use the mobile station 700. in addition, the user interface ul comprises a microphone and a speaker for receiving and producing audio signals. the user interface ul may also comprise voice recognition (not shown). the processing unit cpu comprises a microprocessor (not shown), memory mem and software sw. the software sw is stored in the memory mem. the microprocessor controls, on the basis of the software sw, the operation of the mobile station 600, such as the use of the radio frequency part rf and the presenting of information in the user interface ul and the reading of inputs received from the user interface ul. the software sw comprises a wcdma protocol stack on the basis of which a transmitter (not shown) of the radio frequency part rf transmits and a receiver (not shown) of the radio frequency part rf receives messages and other information with the aid of its antenna ant. the codecs, the selection of which is negotiated, reside in the mobile station 600. they may be implemented in the software sw. another alternative is hardware implementation of the codecs (not shown). particular implementations and embodiments of the invention have been described. it is clear to a person skilled in the art that the invention is not restricted to details of the embodiments presented above, but that it can be implemented in other embodiments using equivalent means without deviating from the characteristics of the invention. the scope of the invention is only restricted by the attached patent claims. for example, the observation can be done in a unit in the edge of the 3 rd generation network with an assumption that operator controlled 3 rd generation network does not substantially lose packets. for another example, the observation can be done in a base station controller. for another example, the observation can be done in an element in a general packet radio system (gprs) enhanced radio access network (geran).
007-507-183-245-024	US	[ "US" ]	B01J37/00,B09B3/00,C04B18/02	1987-10-21T00:00:00	1987	[ "B01", "B09", "C04" ]	method for producing insoluble industrial raw material from waste	a method for handling, treating, heating and incinerating, on-site, liquid waste, sewage, sludge, cakes or solid waste. the primary treatment process utilizes a 0.1-50% power of plastic clay and may include separation, absorption, precipitation, neutralization, sedimentation, flocculation, coagulation, filtration or dewatering. the residue remaining after the primary treatment is mixed with additional clay or silicates and a suitable absorbent for either organic or inorganic, liquid material, to form a solid mixture of approximately 5-50% clay or silicates and 0.1-10% absorbent. the solidified mixture is formed into granules or other shapes having large surface area. the stable, solid granules are transferred to a conveyorized oven, dried and pyrolized or fired. resulting organic gases may be condensed to oil or exhaust gases may be vented into a secondary incineration unit. the resulting product is composed of stable granules, detoxified of organic waste and with all inorganic waste converted into silicate form.	1. a method for treating hazardous or toxic waste containing organic matter and metals, for producing an inorganic insoluble industrial raw material, comprising the steps of: (a) mixing of said waste materials with a plastic material comprising oxides of silicon and aluminum and capable of forming nonleachable inorganic compounds with said metals to form a plastic mixture; (b) preparing the plastic mixture into shaped articles with a large surface area; (c) heat treating the shaped articles to remove the organic matters wherein drying and distillation occur at a temperature in the range of 60.degree.-200.degree. c. and pyrolysis occurs in an oxygen free environment at a temperature in the range of 400.degree.-500.degree. c.; and (d) bonding the inorganic matters to stable solid insoluble silicate complexes by calcining and sintering at a temperature in the range of 750.degree.-1150.degree. c. 2. method according to claim 1, characterized in that before the step (a), the waste is subjected to a primary treatment comprising adding plastic material and neutralizing, precipitating, coagulating, sedimenting, filtering, dewatering, absorbing or flocculating the waste depending on its consistency to form a residue. 3. method according to claim 1, characterized in that absorbents are added to the plastic material if this material does not exhibit a sufficient absorptivity by itself. 4. method according to claim 3, characterized in that the amount of the plastic material ranges between 5 and 50 wt. % and the optional absorbents comprise a range of 0.1-10 wt. % with regard to the total mixture. 5. method according to claim 2, characterized in that the amount of the plastic material lies in the range of 0.1-50 wt. % with regard to the waste material. 6. method according to claim 1 or 2, characterized in that the plastic material comprises clay and/or alumosilicates with an average particle diameter of less than 5 .mu.m. 7. method according to claim 1 or 2, characterized in that the plastic material comprises one or more of alkaline metals, earth alkaline metals, boron or iron in addition to silicon and aluminum. 8. method according to claim 1 or 2, characterized in that the plastic material includes one or more of the additive minerals albite, calcite, bauxite, borax, dolomite, felspar potash, flint, kaolinite, kyanite, magnesite, mica, montmorillonite, nepheline, orthoclase, sillimanite, spodumene, talc, vermiculite, wollastonite, aluminum oxide, silica oxide, lead bisilicate, dictometious earth, zeolyte and na/ca borosilicate glass. 9. method according to claim 1 or 2, characterized in that the plastic material comprises 40-50 wt. % of three-layered clay minerals such as illite vermiculate, montmorillonite and chlorite. 10. method according to claim 1, or 2, characterized in that the plastic material comprises at least one of shale and clay. 11. method according to claim 1, or 2, characterized in that the plastic material has a high concentration of particles with an average particle size of less than 1 .mu.m. 12. method according to claim 3, characterized in that said absorbents are selected from the group consisting of na-ca borosilicate, perlite, expanded clay, expanded silicate and acrylamide copolymers. 13. method according to claim 1, characterized in that in the step (b) the mixture is extruded, shaped and then divided into granules. 14. method according to claim 1, characterized in that in the step (c) the articles are dried thereby distilling the organic solvents and/or water and next are pyrolyzed in an oxygen-free atmosphere whereby the resulting organic gases are condensed to organic solvents or oils. 15. a method for treating a variety of different types of hazardous or toxic waste comprising the steps of: a) mixing the waste with 5-50 wt. % powdered plastic reagent and 0.1-10 wt. % of an absorbent to form a solid mixture wherein said waste is physically and chemically bound to said plastic reagent; b) extruding the solid mixture to form granules having a large surface area; c) heating the granules to a temperature in the range of 60.degree. to 200.degree. c. for distillation of any water or organic solvents and to a temperature in the range of 400.degree.-500.degree. c. for pyrolysis of any hydrocarbons present in said waste in an oxygen-free environment; d) recovering organic solvents and gases; and e) calcining and sintering said granules within the temperature range of 750.degree.-1150.degree. c. for a period of time in the range of 10 minutes to 2 hours. 16. the method of claim 15 wherein: said powdered plastic reagent has a high concentration of particles less than 1 .mu.m in size and is comprised of at least one of plastic clay, sio.sub.2, al.sub.2 o.sub.3, b.sub.2 o.sub.3, fe.sub.2 o.sub.3, feo, na.sub.2 o, cao, k.sub.2 o and mgo. 17. the method of claim 16 wherein: prior to mixing the waste with 5-50% powdered plastic reagent and 0.1-10% of an absorbent to form a solid mixture said waste is subjected to a primary treatment comprising adding 0.1-50% powdered plastic reagent to physically and chemically bind said waste to said powdered plastic reagent and neutralizing, precipitating, coagulating, sedimenting, filtering, dewatering, absorbing or flocculating the waste to form a residue. 18. the method of claim 15, 16 or 17 wherein said method is performed in an automated, conveyorized closed system and during heating said granules the exhaust air is condensed to form a useable solvent or oil and any exhaust air produced is itself incinerated. 19. the method of claims 15, 16 or 17 wherein the absorbent is na/ca borosilicate expanded glass or perlite or expanded clay. 20. the method of claims 15, 16 or 17 wherein the waste content of the solid mixture is from 50 to 94.9% waste. 21. the method of claims 15, 16 or 17 wherein said granules are calcined and sintered for 10 minutes.	the invention relates to industrial raw materials which can be produced from waste. nowadays industrial raw materials are becoming more and more expensive to produce because of the increasing shortage of the natural material sources. on the other hand, the amount of waste is increasing and raises environmental problems with regard to its destruction. disposal of waste materials is a problem of growing complexity confronting municipalities and other treatment plant operators, particularly in view of the adoption everywhere of stricter environmental standards. the most recently used treatment systems and technology are based on the principle of incineration, chemical and physical treatment and solidification. the results of such prior art treatment is a residue which is typically used as land fill. leaching of waste is a continuing problem. the treatment of waste material is very often extremely difficult, complex and expensive. equipment suitable for accommodating different types of waste from a variety of sources is more complicated and hence more expensive. the residue and emissions from waste treatment processes in use today are of concern because of the hazards they pose. furthermore, the use of toxic waste residue for the purpose of land filling has its limitations. current technology also requires transportation of huge volumes of waste materials from the source of the waste to the treatment facility. this of course poses a safety and health hazard. the threat of spillage of toxic material during transportation or leaching from the final disposal site persists. prior art references disclose attempts to utilize waste material in the production of useful materials such as construction bricks (bayer et al. u.s. pat. nos. 3,886,244 and 3,886,245). webster et al. in u.s. pat. no. 4,028,130 propose the incorporation of digested sewage sludge into a matrix of alumino--siliceous material, such as fly ash, to produce landfill or structural base materials. lingl in u.s. pat. no. 4,112,033 discloses a method for treating and handling industrial sludges without human contact to form ceramic articles. lingl, mixes industrial sludge with clay in a mixer and then stores the material to assist the subsequent extrusion process. after extrusion the material is dried and fired in a conventional kiln to produce bricks. the exhaust gases are vented into the kiln. lindl teaches using any clay to make bricks rather than using specific clay to stabilize the waste and to produce insoluble, non-leachable product. in particular, lindl does not teach use of clay for primary treatment of waste. furthermore, lindl does not discriminate as to type of clay used and accordingly has not appreciated characteristics of different types of clay which assist to stabilize waste. the process of lindl is limited to treating material with a waste content of 30-50% and a moisture content of less than 50%. lindl's process is also limited to the types of waste stated therein. furthermore, lindl utilizes a large existing brick producing facility to treat waste and accordingly has problems resulting from lack of specificity. using a modified system results in problems such as automation and accommodating source and volume of the waste. although lindl states the industrial sludges are treated without human contact, it is apparent that workers must still be on the premises with consequential exposure to organic material evaporating out of the waste. lindl does not substantiate his claims regarding the quality of his final product in view of existing government standards regarding leachability of products. for the above reasons, there is a need for the inexpensive production of industrial raw material from waste material by methods which are effective with regard to economy and environmental protection. the present invention provides for the production of material by the treating and handling of waste using a method which is flexible, efficient, economical and safe. the present invention also provides an industrial raw material producible from waste which can be used for a variety of applications. in one aspect, the present invention is an inorganic, insoluble industrial raw material, based on processed waste, which is characterized by a particle size of 0.2-15 cm, whereby 0.3-8 cm are preferred. depending on the use of the above material a particle size of 0.4-2.5 cm, especially 0.5-1.5 cm, might also be favorable. the bulk density of the above material in general lies in the range of 400-1000 kg/m.sup.3 and the specific gravity results in 600-1300 kg/m.sup.3. the material exhibits a ph value of 6.0-10.5, preferably a hydrophilic surface and an absorption of moisture in the range of 0.5-14 wt. %. the metal content is 0.5-60 wt. %, preferably 10-45 wt. %, and particularly preferred is 25-38 wt. %. the temperature resistance ranges up to 1150.degree. c. the product has a brown to grey color and is odorless. the material is furthermore characterized by very reduced or no leachability of harmful metals, especially with regard to heavy metals under atmospheric environmental conditions, especially at a temperature of 20.degree. c.-50.degree. c. and under the influence of air and water. in one preferred embodiment the raw material comprises subgroup metals whereby at least one metal is selected from the group consisting of fe, zn, cr, ni, ba, be, pb, cd, ti, co and cu or combinations thereof. preferably the material has a content of at least one of, the aforementioned subgroup metals in the range of 0.5-60 wt. %, most preferably 10-45 wt. %. the present invention is also a method for treating a variety of different types of hazardous or toxic waste comprising the steps of: a) mixing the waste materials with a plastic material (also called a reagent) capable of forming non-leachable compounds with metals by reaction to form a plastic mixture; b) forming shaped articles with large surface areas; and c) heat-treating the shaped articles to remove the organic matter and to bond the inorganic matter in stable, solid and insoluble silicate complexes. in another aspect, the above inorganic, insoluble industrial raw material can be produced by a method for treating a variety of different types of hazardous or toxic waste characterized by: a) mixing the waste materials, with a plastic material comprising oxides of silicon and aluminum and capable of forming non-leachable compounds with metals by reaction to form a plastic mixture; b) preparing or forming the mixture into shaped articles with a large surface; and c) heat-treating (calcining and sintering) the shaped articles to remove the organic matter and to bond the inorganic matter in stable, solid and insoluble silicate complexes. in yet another aspect, the present invention comprises a method for treating a variety of different types of hazardous or toxic waste comprising the steps of: a) mixing the waste with 5-50% powdered plastic reagent and 0.1-10% of an absorbent to form a cohesive mixture wherein said waste is physically and chemically bound to said plastic reagent; b) extruding the solid mixture to form granules having a large surface area; c) heating the granules; and d) sintering and calcining said granules within the temperature range of 750.degree.-1150.degree. c. the preferred waste to be used comprises organic and inorganic, industrial and hazardous, liquid and solid waste materials. such waste materials include for example electroplating sludge, na.sub.2 cr.sub.2 o.sub.7 solution, paint sludges, heavy metal sludges, miscellaneous sludges comprising heavy metals and oil, leather sludges with cr.sup.+6, paper (caustic) sludges, fly ash, bottom ash and so on. in a preferred embodiment of the present invention the waste is subjected to a primary treatment before step (a) of any of the methods comprising adding the plastic material (reagent) and separating, neutralizing, precipitating, coagulating, sedimenting, filtering, dewatering, absorbing or flocculating the waste in dependence upon its characteristics to form a residue. depending on the state of the waste material, the primary treatment process may not be necessary and can be bypassed. the choice of treatment depends on the type of waste and efficiency of technology, and will be obvious to those skilled in the art. the following are some examples: (a) neutralization would be used to raise the ph value of acidic waste; (b) precipitation would be used to isolate heavy metal hydroxides (for example cu(oh).sub.2, cr (oh).sub.3, zn(oh).sub.2, ca(oh).sub.2); (c) coagulation and flocculation would be used to coagulate and flocculate particulate matter in waste solution (e.g. leather sludge); (d) sedimentation is used when the plastic material combined with waste material results in the latter settling so that the liquid portion may be removed; and (e) filtration via filter press is used to squeeze the water out of the plastic material/waste mixture. absorbents are added if the plastic material (depending on the waste) does not exhibit a sufficient absorptivity by itself. the amount of the plastic material and the absorbent (if necessary) of the present production method depends on the properties, consistency and composition of the waste material that is mixed together. it is also dependent upon the properties of plastic materials and the absorbents themselves. for many applications, the ranges are 5-50 wt. % plastic material, 0.1-10 wt. % absorbent and from 50 to 94.9% waste material. in other applications, the constituents may be mixed together in other proportions so long as the mixture produced is shapable with conventional shaping equipment in a manner suitable to form shapes which have a form and dimensional stability for the production of the finished article. the forming in step (b) of each method of shaped articles like granules or other large surface area shapes may be performed by any conventional shaping means. for example, granules may be formed by extruding the material and then cutting it into pieces. the big advantage of granules is the increased surface area provided which facilitates the treating and handling of the waste. granules also reduce the stickiness of the original waste during thermal preparation. after extrusion and forming, the granules are stable enough to be transported without the risk currently present in transporting waste material. further possibilities of forming shapes with a large surface are by drying in a fluidized bed dryer or pressing. the amount of plastic material used in the primary treatment system depends on the relative properties of the plastic material, the waste material and the treatment technology. it generally lies in the range of 0.1-50 wt. % with regard to the waste material. the present invention also provides a secondary treatment system (commencing with step (a) of each method) which permits the fixing of the waste material to the plastic material and the maintaining of shape stability of the mixture, which is very important for thermal treatment. at the thermal preparation step of each method a very strong connection (chemical-physical bonding) is created between the plastic material and the inorganic parts of the waste material to form a stable, artificial material useful as industrial raw material for a variety of applications. a suitable plastic material for the present invention should have the following properties in powder form: good absorption high plasticity, capability to form granules capability of being sintered ability to form non-soluble complex with inorganic waste material. the plastic material of the present invention includes alkaline metals, earth alkaline metals, boron, iron, silicon or aluminum. more specifically, the plastic material must include one or more of the following, oxides: sio.sub.2 al.sub.2 o.sub.3 b.sub.2 o.sub.3 fe.sub.2 o.sub.3, feo na.sub.2 o cao k.sub.2 o mgo it should be understood that references herein to "clay" are meant to include the aforesaid oxides. the above plastic material facilitate the primary treatment and liquid absorption, silicatization and reaction of the waste to convert the waste to a stable solid complex of insoluble material. suitable silicate and additive minerals are as follows: albite, calcite, bauxite, borax, dolomite, felspar potash, flint, kaolinite, kyanite, magnesite, mica, montmorillonite, nepheline, orthoclase, sillimanite, spodumene, talc, vermiculite, wollastonite, aluminum oxide, silica oxide, lead bisilicate, diatomaceous earth, zeolyte and na/ca borosilicate glass. the plastic material used in the present invention may preferably comprise 40-50 wt. % of a mineralogical composition including the three-layer minerals illite, vermiculite, montmorillonite and chlorite. a preferred plastic material of the present invention comprises clay and/or aluminosilicates with an average particle size of less than 5 .mu.m. clay has a long history of industrial use and as a chemical reagent it is safe to handle. clay may be used in the primary treatment system to improve coagulation, flocculation, sedimentation, absorption, neutralization and dewatering, and also to fix the waste material to the clay. an especially preferred plastic material includes shale. the chemical composition of the shale used may be as follows: sio.sub.2 58.26%, al.sub.2 o.sub.3 18.82%, fe.sub.2 o.sub.3 6.96%, mgo 2.9%, cao 6.56%, nao 0.33%, k.sub.2 o 4.87%, tio.sub.2 0.98%, mno.sub.2 0.13%, b.sub.2 o.sub.3 0.19%. shale is clay previously sedimented, which has been subjected to pressure. shale can be crushed and blended to produce excellent plastic materials. such material is capable of strongly fixing trace material in its body. in the method of the present invention it is preferred to use a plastic material with a high concentration of particles less than 1 .mu.m in size. the processes of coagulation, precipitation, flocculation, sedimentation and dewatering are assisted by the use of very fine powder, especially less than 0.5 .mu.m. for neutralization of acidic waste it is preferred to use a plastic material with soluble salt concentration (mg, ca, na, k) as a substitute for hydroxides. the soluble salt concentration may be in the range of 2000 ppm. to improve the absorption of the plastic material it may be mixed with an absorbent which can absorb more water than the plastic material alone. the use of an absorbent therefore may reduce the necessary amount of the plastic material. for example clay can absorb 25% liquid whereas clay plus an absorbent can absorb up to 20 times its weight in liquid. preferred examples of absorbents are na-ca borosilicate expanded glass, expanded clay and/or expanded silicate. further possible absorbents are acrylamide copolymers. the most preferred absorbents are na-ca borosilicate expanded glass (0.1-10%) and perlite because they also contain silicate, which helps to form complexes (i.e. which help to physically and chemically bond the waste material to the plastic material), and fluxes (na-ca) which assist in the production of granules having the desired characteristics. a preferred combination of a plastic material and an absorbent may comprise 40 wt. % clay and 3 wt. % of one of the above absorbents with regard to the total mixture of the waste material. the components may be fed to a mixer automatically by conventional conveyance systems. the mixture must be plastic enough to offer good shaping and granulation properties. after shaping the mixture to shaped articles with a large surface in step (b) of each method of the present invention, the articles are heat-treated to remove organic matter and to bond the inorganic matter in stable, solid and insoluble silicate complexes. to effect the heat treatment, the material may be fed into a conveyorized dryer, oven or kiln, and the shaped articles are dried, heated, distilled, pyrolyzed, sintered or calcinated. the particular manner in which this is done will depend on the source of the waste mixture, the properties of the inorganic or organic materials and the desired process steps. conveyorized ovens and kilns provide the flexibility to economically build a small or large waste treatment unit at the waste site thereby circumventing the necessity of transporting waste material. conveyorized ovens and kilns may also may also be mobile. the capacity range of conveyorized ovens and kilns may be less than 1 ton per day to more than 100 tons per day. the process of the present invention further provides working conditions which are readily adjustable. a wide range of temperatures is available (60.degree.-1300.degree. c.) depending on the chosen process. using a conveyorized system minimizes the level of harmful substances in the system environment. during the thermal treatment the inorganic components of the waste material are transformed into compounds bound to silicates which are produced from the plastic material and made harmless. in the case of organic material included in waste products, the shaped articles are first dried or distilled and thereafter heated in an oxygen-free environment (pyrolysis). during the drying step which preferably occurs in the temperature range of 60.degree.-200.degree. c. organic solvents and water may be distilled and reclaimed. after drying the shaped articles are preferably pyrolyzed at a temperature of 450.degree.-500.degree. c. for a period of about 30 minutes. the resulting organic gases may be condensed to organic liquids (oils). in a preferred embodiment of the inventive method for producing the inorganic, insoluble industrial raw material the shaped articles are calcinated and sintered (after drying, distilling and pyrolyzing which are optional). the calcining sintering step is preferably performed at a temperature between 750.degree. and 1150.degree. c., with 800.degree. to 1050.degree. c. being particularly preferred. the calcinating time may lie within the range of 3 minutes to 2 hours and preferably lies in the range of 3 to 20 minutes, with 10 minutes being most preferred. the exhaust gases produced by heat treating may be incinerated in an incineration unit. if the exhaust air requires a cleaning system (air pollution control system) , it may be passed through scrubbers and finally filtered through a pollution filter system. in the process of the present invention the surplus heat is preferably recycled using conventional waste heat recovery methods such as a heat exchanger. the method of the present invention is preferably performed in an automatic, closed conveyorized system which is indirectly heated. by using an indirectly heated system the present invention permits reducing the volume of exhaust air and dust. in a closed system no human contact or presence is necessary in performing the method of the present invention, and since all materials are contained within the closed system until the final articles are produced, there is no health hazard. during thermal preparation of the mixture of the waste and the plastic material (sintering, silicatization, vitrification and melting reaction), the solid inorganic waste material and silicates are converted to form a stable solid complex of insoluble material with physical-chemical bonds, which is safe to use as an industrial raw material. leaching tests, particularized later herein, confirm the high stability of the final product produced using the present invention. furthermore, the inorganic, insoluble industrial raw material may be used as fillers. these fillers can advantageously be used for paint and coatings, sealants, asphalt or rubber, fire protection systems, boat construction and repair and so on. a further use for the above industrial raw material can be seen as controlled size aggregates for gypsum wall-board, roofing systems, castable and/or gunning refractories, lightweight pre-fab concrete units, lightweight structural concrete, low density oil well cements, drilling mats and so on. the industrial raw material of the present invention can also be used as an additive for abrasives, as catalyst support, or vacuum mold fabrication and energy management auto body structures. the following is description by way of example of certain embodiments to illustrate the present invention, reference being made to the accompanying drawings in which: fig. 1 is a flow chart-block diagram of one embodiment of the present invention. fig. 2 is a flow chart-block diagram of another embodiment of the present invention. fig. 3 is a flow chart-block diagram of yet another embodiment of the present invention. fig. 4 is a flow chart-block diagram of yet another embodiment of the present invention. example 1 oil sludge and heavy metals the on-site method of treating, handling, heating, sintering and calcining waste water and sludge generated from recycling metals from car destruction facilities having a high content of cu and pb was achieved according to the teachings of the present invention. the waste water was treated to prepare it for the primary treatment process. the waste water containing organic waste was mixed with 5% powdered plastic clay to improve coagulation, flocculation, sedimentation and homogeneity of the waste during primary treatment. the organic sludge generated from the sedimentation process consisted of 31% organic material (oil), 28% h.sub.2 o solution with naoh (weak) and 51% solid parts (clay, metals and heavy metals). organic sludge was mixed with plastic clay (shale) powder during primary treatment which included 1% inorganic absorbent (na/ca borosilicate expanded glass), weight ratio 2:1 (sludge:clay). this mixture was then shaped to form granules. the stable solid granules were transferred to a conveyorized electric oven where they were heated and dried for 35 minutes at a temperature of 100.degree.-120.degree. c. to 96% solid. after drying, the material was conveyed to be heated at 460.degree. c. in an oxygen-free environment for 25 minutes (pyrolysis). this produced gases which were condensed to oil. the remaining solid was calcinated and sintered in a conveyorized electrically heated kiln for 12 minutes at 1050.degree. c. and this produced inert granules with a particle size of 7 mm, a density of 630 kg/m.sup.3, a specific gravity of 800 kg/m.sup.3, a ph value of 7.3 and a temperature resistance up to 1050.degree. c. the material produced can be used in the building industry as raw material or an filler. the exhausted air was combusted in an incinerator and the surplus energy was used for producing hot water via the heat exchanger. example 2 sludge from leather treatment the method of treating, handling and calcinating of solid and liquid waste generated from leather tanning was performed on-site of the waste production according to the teachings of the present invention. waste water from leather preparation was mixed (before primary treatment) with 1-2% clay powder (shale) to improve sedimentation. the sedimented sludge which consisted of 98% h.sub.2 o and 2% solid was fixed with acrylamide copolymer flocculant and centrifuged. clay powder improved the filtration, flocculation, coagulation and centrifugation. this generated sludge, consisting of 17% organic material (fat, leather, oil), 9% solid (clay, ca, na, cr) and 74% h.sub.2 o. the sludge was then mixed with a plastic material, namely clay powder shale plus 2% inorganic absorbent consisting of na/ca borosilicate expanded glass with a ratio 1:1 (sludge:plastic material). this preparation was then mixed with dry leather shavings (leather with cr). the leather shavings improved solidification of the mixture and were used in the ratio 1:1 (leather:mixture). this mixture was then shaped to form granules with a particle size of 4 mm. the stable solid granules were transferred to a conveyorized calcinator which was electrically heated for 10 minutes at a temperature of 1070.degree. c. this produced inert granules with a bulk density of 400 kg/m.sup.3, a specific gravity of 650 kg/m.sup.3 and a ph value of 6.7. the granules were safe to use as raw material in the building industry or as filler. the exhausted air was combusted in an incinerator and the waste energy was used for producing hot water using a heat exchanger. example 3 paint sludge the method of treating, handling, heating and calcinating of paint sludge, on-site, was performed according to the teachings of the present invention. the paint sludge generated from distillation of solvent (dry distillation) and consisting of 15% solvent and 85% solid (non-metallic elements, for example s, p, metallic elements, for example co, mn, pb, zn, cr, ti, and organic constituents, for example polymers, alcohols, ketones, esters) was mixed with plastic clay (shale) powder which included 2% inorganic absorber (na/ca borosilicate expanded glass) in a weight ratio of 3:2 (sludge:clay). this mixture was then shaped to form granules of 10 mm size. the stable solid granules were transferred to an electrically heated vacuum reactor and solvent material was distilled therefrom for 25 minutes at 150.degree.-200.degree. c. and condensed. the remaining solid was calcinated and sintered in a conveyorized electrical calcinator for 10 minutes at 1010.degree. c. which produced inert granules with a bulk density of 400 kg/m.sup.3, a specific gravity of 730 kg/m.sup.3 and a ph value of 7.1. the material was safe to use for the building industry as raw material or as filler. the exhausted air was combusted in an incinerator and surplus energy was used for producing hot water by means of a heat exchanger. example 4 metallic sludge from plating system the method of treating, handling, calcining and sintering of waste from electro-plating and mechanic-plating techniques, on-site of the waste production, was achieved according to the teachings of the present invention. waste water from electro-plating and mechanic-plating techniques was treated by conventional neutralization, oxidation, reduction, precipitation, coagulation, sedimentation and filtration. to every one liter of waste water was added 2 to 3 grams of plastic clay (shale) powder to improve coagulation, flocculation, sedimentation and neutralization. after frame press filtration of sludge, a cake was produced with 55% h.sub.2 o, 45% solid (clay and heavy metals, ca, na). this cake was mixed with a material containing 97% clay plus 3% synthetic absorbent (acrylamide). the ratio was 4:1 (cake:plastic material). this mixture was then extrusion-shaped to form granules of 2 mm size which were conveyed to a conveyorized kiln for firing for 8 minutes at 1100.degree. c. the leftover solid granules had a bulk density of 700 kg/m.sup.3, a specific gravity of 1000 kg/m.sup.3, a ph value of 6.9 and a moisture absorption of 3% and were inert and safe to use as raw material for paints and fire protecting systems. example 5 31% na.sub.2 cr.sub.2 o.sub.7 the method of treating, handling, drying, calcining and sintering of sodium dichromate effluent and waste solution on-site of the waste was achieved according to the teachings of the present invention. sodium dichromate effluent is generated from chrome plating. 31% sodium dichromate waste solution was mixed with the plastic material (clay expanded glass or acrylamide copolymer and 3% of nepheline). the weight ratio was 1:1 of solution:plastic material. this mixture was then mixed in a mechanical fluidized bed with vacuum drying abilities to form granules which were dried for 25 minutes at 150.degree. to 200.degree. c. the dry granules were mixed a second time with waste solution 1:1 plus 3% absorbent. this mixture was then formed (in a mechanical fluidized bed with vacuum drying ability) into granules which were conveyed to a conveyorized kiln for firing at 1120.degree. c. for 11 minutes. the resulting solid granules were inert and safe to use as raw material for (gunning) refractories, particularly fire protecting systems and as an additive for abrasives. example 6 zinc sludge the method of treating, handling, drying, calcining and sintering of zinc sludge was achieved according to the teachings of the present invention. the composition of zinc sludge from metal industries had the following chemical composition: ______________________________________ water 35.11% ash 27.17% zinc 320 g/kg wet material iron 26.4 g/kg wet material chromium 0.564 g/kg wet material lead 9.78 g/kg wet material ______________________________________ the above zinc sludge was mixed with 50% clay, 3% nepheline and 6.5% flint. the mixture was added into the reactor-mechanical fluidized bed, where with adjustable rotation speed and temperature a desirable dimension of granulates was achieved. the granulates were then thermally treated with a graduated temperature from 20.degree. c.-990.degree. c. with a retention time of 9 minutes. for thermal treatment a continual indirect heating system, a commercially available belt system, a tube system and a roll system was used. during thermal preparation--calcination and sintration--a very stable spheric product was produced with low density spheres containing a multiplicity of independent closed air cells surrounded by a unique tough buter shell. the granulates had the following properties: ______________________________________ sphere size range: 0.5-15 mm bulk density: 400-500 kg/m.sup.3 specific gravity: 600-700 kg/m.sup.3 surface characteristics: hydrophilic color: brown, grey odor: none thermal stability: 1000.degree. c. ______________________________________ the above product may be used as controlled size aggregates for lightweight structural concrete, lightweight pre-fab concrete units, castable and/or gunning refractories, insulation blocks, gypsum wallboard and roofing systems. stability tests the treated product produced in the processes of examples 1 to 6 above was subjected to the leachate extraction procedure according to canadian standard regulation 309. also subjected to the same stability test was a normal brick of the clay variety. in each case the extraction time was 24 hours. the quantity of 0.5 n acetic acid used by ph adjustment is indicated in the table below. at the end of the extraction period, enough distilled water was added to bring the total volume of liquid to 1000 ml. the ph of the leachate was adjusted to 5.0+0.2 after 15 minutes, 1, 3, 6 and 22 hours from the start. table 1 ______________________________________ sample characteristics mois- final ture wt of volume acetic con- (g) sam- leachate acid ph sample tent % ple used (ml) ml initial final ______________________________________ example <0.1 36.90 738 7.8 5.9 4.9 #1 example <0.1 15.89 318 0.5 5.0 4.8 #2 example <0.1 36.74 735 16.1 4.7 4.9 #2 example <0.1 14.70 294 1.2 5.3 4.8 #3 example 0.44 50.22 1000 0.8 4.9 4.8 #4 example <0.1 38.69 774 0.2 4.9 4.8 #5 example <0.1 50.00 1000 0.5 6.4 5.1 #6 example (client to supply data) #6 normal 0.28 50.14 1000 0.85 5.7 5.0 brick ______________________________________ table 2 ______________________________________ test results ______________________________________ example 1 sample icap plasma scan on leachate mg/l (= ppm) silicon (si) 16.0 aluminum (al) 1.9 iron (fe) 0.05 calcium (ca) 89 magnesium (mg) 38 sodium (na) 2 potassium (k) <2 titanium (ti) <0.02 manganese (mn) 0.11 phosphorus (p) <0.05 barium (ba) 0.09 chromium (cr) <0.02 zirconium (zr) <0.02 copper (cu) 0.29 nickel (ni) 0.05 lead (pb) <0.05 zinc (zn) 1.00 vanadium (v) 0.04 strontium (sr) 0.11 cobalt (co) <0.01 molybdenum (mo) 0.07 silver (ag) <0.05 cadmium (cd) <0.005 beryllium (be) <0.01 boron (b) <0.5 ______________________________________ example 2 sample icap plasma scan on leachate mg/l (= ppm) c ______________________________________ silicon (si) 1.7 1.7 aluminum (al) <0.01 <0.01 iron (fe) <0.05 <0.05 calcium (ca) 7.0 4.8 magnesium (mg) 6.4 4.6 sodium (na) 2.9 2.0 potassium (k) 4.1 3.0 titanium (ti) <0.02 <0.02 manganese (mn) 0.08 <0.02 phosphorus (p) <0.05 <0.05 barium (ba) 0.03 0.02 chromium (cr) 0.07 0.08 zirconium (zr) <0.02 <0.02 copper (cu) 0.05 <0.02 nichel (ni) 0.03 0.04 lead (pb) <0.05 <0.05 zinc (zn) 0.05 <0.02 vanadium (v) <0.02 0.04 strontium (sr) <0.02 <0.02 cobalt (co) <0.01 <0.01 molybdenum (mo) 0.08 0.12 silver (ag) <0.05 <0.05 cadmium (cd) <0.005 <0.005 beryllium (be) <0.01 <0.01 boron (b) <0.5 <0.5 ______________________________________ example 3 sample icap plasma scan on leachate mg/l (= ppm) silicon (si) 6.2 aluminum (al) 0.7 iron (fe) <0.05 calcium (ca) 41 magnesium (mg) 9.3 sodium (na) 10 potassium (k) 6.0 titanium (ti) <0.02 manganese (mn) 0.05 phosphorus (p) <0.05 barium (ba) 0.20 chromium (cr) 0.17 zirconium (zr) <0.02 copper (cu) <0.02 nickel (ni) <0.02 lead (pb) 0.08 zinc (zn) 0.94 vanadium (v) 0.37 strontium (sr) 0.10 cobalt (co) <0.01 molybdenum (mo) 1.4 silver (ag) <0.05 cadmium (cd) 0.015 beryllium (be) <0.01 boron (b) <0.5 ______________________________________ example 4 sample icap plasma scan on leachate mg/l (= ppm) silicon (si) 3.8 aluminum (al) 1.1 iron (fe) <0.05 calcium (ca) 24 magnesium (mg) 1.8 sodium (na) 29 potassium (k) <2 titanium (ti) <0.02 manganese (mn) <0.02 phosphorus (p) <0.05 barium (ba) <0.01 chromium (cr) 0.04 zirconium (zr) <0.02 copper (cu) <0.02 nickel (ni) <0.02 lead (pb) <0.05 zinc (zn) 0.70 vanadium (v) 0.03 strontium (sr) 0.06 cobalt (co) <0.01 molybdenum (mo) <0.02 silver (ag) <0.05 cadmium (cd) 0.032 beryllium (be) <0.01 boron (b) <0.5 ______________________________________ example 5 sample icap plasma scan on leachate mg/l (= ppm) silicon (si) 1.5 aluminum (al) <0.1 iron (fe) <0.05 calcium (ca) 7.0 magnesium (mg) 0.36 sodium (na) 7 potassium (k) 4 titanium (ti) <0.02 manganese (mn) <0.02 phosphorus (p) <0.05 barium (ba) <0.01 chromium (cr) 0.16 zirconium (zr) <0.02 copper (cu) <0.02 nickel (ni) <0.02 lead (pb) <0.05 zinc (zn) <0.02 vanadium (v) 0.03 strontium (sr) <0.02 cobalt (co) <0.01 molybdenum (mo) <0.02 silver (ag) <0.05 cadmium (cd) <0.005 beryllium (be) <0.01 boron (b) <0.5 ______________________________________ example 6 sample icap plasma scan on leachate g1/1-g1/4 aluminum (al) <0.05 barium (ba) 0.02 beryllium (be) <0.005 boron (b) <0.5 calcium (ca) 43 cadmium (cd) <0.005 chromium (cr) <0.02 cobalt (co) <0.01 copper (cu) <0.02 iron (fe) 0.55 lead (pb) <0.05 magnesium (mg) 3.5 manganese (mn) 0.02 molybdenum (mo) <0.02 nickel (ni) 0.06 phosphorus (p) 0.3 potassium (k) <1 silicon (si) <0.05 silver (ag) <0.05 sodium (na) 2 strontium (sr) 0.08 titanium (ti) <0.01 vanadium (v) <0.02 zinc (zn) 0.3 zirconium (zr) <0.02 ______________________________________ normal commerical clay brick sample (produced in ontario, canada) icap plasma scan on leachate mg/l (= ppm) silicon (si) 2.7 aluminum (al) 0.2 iron (fe) <0.05 calcium (ca) 41 magnesium (mg) 3.4 sodium (na) 2 potassium (k) 4 titanium (ti) <0.02 manganese (mn) 0.05 phosphorus (p) <0.05 barium (ba) 0.10 chromium (cr) <0.02 zirconium (zr) <0.02 copper (cu) <0.02 nickel (ni) <0.02 lead (pb) < 0.05 zinc (zn) 2.0 vanadium (v) 0.22 strontium (sr) 0.09 cobalt (co) <0.01 molybdenum (mo) <0.02 silver (ag) <0.05 cadmium (cd) <0.005 beryllium (be) <0.01 boron (b) <0.5 ______________________________________ the above stability testing results show excellent stability of waste material treated using the present invention. for example, in the case of chromium, environmental protection legislation recently introduced in the province of ontario, canada, requires chromium levels less than 0.5 ppm for the waste material not to be categorized as "waste". the above test results were surprising in that the chromium levels, which are typically of most concern, were low enough for the treated waste material not to be classified as waste under province of ontario regulations. with the present invention inorganic, insoluble industrial raw materials can be economically produced from waste material which show a broad range of application. due to the high stability of the material produced which is indicated by the low leachability of metals, especially of heavy metals, the raw material can safely be handled and used.
008-340-981-151-801	JP	[ "KR", "US", "TW", "WO", "JP", "CN" ]	H01L27/12,H01L29/417,H01L29/45,H01L29/66,H01L29/786,H01L29/78,H01L21/28,H01L21/336,H01L21/768,H01L21/8242,H01L21/8247,H01L23/522,H01L27/105,H01L27/108,H01L27/115,H01L29/788,H01L29/792,H01L29/26,H01L29/41,H01L29/04,H01L29/24,H01L21/34	2013-05-09T00:00:00	2013	[ "H01" ]	semiconductor device and manufacturing method thereof	to provide a semiconductor device having a structure with which the device can be easily manufactured even if the size is decreased and which can suppress a decrease in electrical characteristics caused by the decrease in the size, and a manufacturing method thereof. a source electrode layer and a drain electrode layer are formed on an upper surface of an oxide semiconductor layer. a side surface of the oxide semiconductor layer and a side surface of the source electrode layer are provided on the same surface and are electrically connected to a first wiring. further, a side surface of the oxide semiconductor layer and a side surface of the drain electrode layer are provided on the same surface and are electrically connected to a second wiring.	1 . a semiconductor device comprising: a first oxide semiconductor layer; a source electrode layer over the first oxide semiconductor layer; a drain electrode layer over the first oxide semiconductor layer; and a second oxide semiconductor layer over the first oxide semiconductor layer, wherein the source electrode layer is in direct contact with a first part of a top surface of the first oxide semiconductor layer, wherein the source electrode layer is not in direct contact with any side surface of the first oxide semiconductor layer, wherein the drain electrode layer is in direct contact with a second part of the top surface of the first oxide semiconductor layer, wherein the drain electrode layer is not in direct contact with any side surface of the first oxide semiconductor layer, and wherein the second oxide semiconductor layer is in direct contact with a part of a top surface of the source electrode layer and a part of a top surface of the drain electrode layer. 2 . the semiconductor device according to claim 1 further comprising a third oxide semiconductor layer under the first oxide semiconductor layer. 3 . the semiconductor device according to claim 2 , wherein energy of a conduction band minimum of the second oxide semiconductor layer is closer to a vacuum level than energy of a conduction band minimum of the first oxide semiconductor layer by greater than or equal to 0.05 ev and less than or equal to 2 ev, and wherein energy of a conduction band minimum of the third oxide semiconductor layer is closer to a vacuum level than the energy of the conduction band minimum of the first oxide semiconductor layer by greater than or equal to 0.05 ev and less than or equal to 2 ev. 4 . the semiconductor device according to claim 2 , wherein the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer are each an in-m-zn oxide, wherein m is one of al, ti, ga, y, zr, la, ce, nd, and hf, and wherein an atomic ratio of m to in in each of the second oxide semiconductor layer and the third oxide semiconductor layer is higher than an atomic ratio of m to in in the first oxide semiconductor layer. 5 . the semiconductor device according to claim 2 , wherein the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer each include crystals in which c-axes are aligned. 6 . the semiconductor device according to claim 1 , wherein each of the source electrode layer and the drain electrode layer contains one of al, cr, cu, ta, ti, mo, and w. 7 . an electronic device comprising the semiconductor device according to claim 1 . 8 . a semiconductor device comprising: a first oxide semiconductor layer over an insulating surface; a second oxide semiconductor layer over the first oxide semiconductor layer; a source electrode layer and a drain electrode layer over the second oxide semiconductor layer, a third oxide semiconductor layer over the second oxide semiconductor layer, a gate insulating film over the third oxide semiconductor layer; a gate electrode layer over the gate insulating film; and an insulating layer over the insulating surface, the source electrode layer, the drain electrode layer, and the gate electrode layer, wherein a side surface of the source electrode layer and a first side surface of the second oxide semiconductor layer are on a same surface, wherein a side surface of the drain electrode layer and a second side surface of the second oxide semiconductor layer are on a same surface, wherein a first part of the third oxide semiconductor layer is in direct contact with the source electrode layer, wherein a second part of the third oxide semiconductor layer is in direct contact with the drain electrode layer, wherein a first opening that reaches a first part of the second oxide semiconductor layer and a part of the source electrode layer is located in the insulating layer, wherein a second opening that reaches a second part of the second oxide semiconductor layer and a part of the drain electrode layer is located in the insulating layer, wherein a third opening that reaches a part of the gate electrode layer is located in the insulating layer, wherein the second oxide semiconductor layer and the source electrode layer are electrically connected to a first wiring in the first opening, wherein the second oxide semiconductor layer and the drain electrode layer are electrically connected to a second wiring in the second opening, and wherein the gate electrode layer is electrically connected to a third wiring in the third opening. 9 . the semiconductor device according to claim 8 , wherein energy of a conduction band minimum of the first oxide semiconductor layer is closer to a vacuum level than energy of a conduction band minimum of the second oxide semiconductor layer by greater than or equal to 0.05 ev and less than or equal to 2 ev, and wherein energy of a conduction band minimum of the third oxide semiconductor layer is closer to a vacuum level than the energy of the conduction band minimum of the second oxide semiconductor layer by greater than or equal to 0.05 ev and less than or equal to 2 ev. 10 . the semiconductor device according to claim 8 , wherein the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer are each an in-m-zn oxide, wherein m is one of al, ti, ga, y, zr, la, ce, nd, and hf, and wherein an atomic ratio of m to in in each of the first oxide semiconductor layer and the third oxide semiconductor layer is higher than an atomic ratio of m to in in the second oxide semiconductor layer. 11 . the semiconductor device according to claim 8 , wherein the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer each include crystals in which c-axes are aligned. 12 . the semiconductor device according to claim 8 , wherein each of the source electrode layer and the drain electrode layer contains one of al, cr, cu, ta, ti, mo, and w. 13 . an electronic device comprising the semiconductor device according to claim 8 . 14 . a method for manufacturing a semiconductor device comprising the steps of: forming a stacked film of a first oxide semiconductor film and a second oxide semiconductor film over an insulating surface; forming a conductive layer over the stacked film; selectively etching the stacked film using the conductive layer as a mask; selectively etching the conductive layer to divide the conductive layer, thereby forming a stack of a first oxide semiconductor layer and a second oxide semiconductor layer, a source electrode layer over the stack, and a drain electrode layer over the stack; forming a third oxide semiconductor film over the insulating surface, the stack, the source electrode layer, and the drain electrode layer; forming an oxide insulating film over the third oxide semiconductor film; forming a gate electrode layer over the oxide insulating film; selectively etching the oxide insulating film and the third oxide semiconductor film using the gate electrode layer as a mask to form a gate insulating film and a third oxide semiconductor layer; forming an insulating layer over the source electrode layer, the drain electrode layer, and the gate electrode layer; forming, in the insulating layer, a first opening where a first part of the second oxide semiconductor layer and a part of the source electrode layer are exposed, a second opening where a second part of the second oxide semiconductor layer and a part of the drain electrode layer are exposed, and a third opening where a part of the gate electrode layer is exposed; and forming a first wiring electrically connected to the second oxide semiconductor layer and the source electrode layer in the first opening, a second wiring electrically connected to the second oxide semiconductor layer and the drain electrode layer in the second opening, and a third wiring electrically connected to the gate electrode layer in the third opening. 15 . the method for manufacturing a semiconductor device according to claim 14 , wherein energy of a conduction band minimum of the first oxide semiconductor layer is closer to a vacuum level than energy of a conduction band minimum of the second oxide semiconductor layer by greater than or equal to 0.05 ev and less than or equal to 2 ev, and wherein energy of a conduction band minimum of the third oxide semiconductor layer is closer to a vacuum level than the energy of the conduction band minimum of the second oxide semiconductor layer by greater than or equal to 0.05 ev and less than or equal to 2 ev. 16 . the method for manufacturing a semiconductor device according to claim 14 , wherein the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer are each an in-m-zn oxide, wherein m is one of al, ti, ga, y, zr, la, ce, nd, and hf, wherein a material having a higher atomic ratio of m to in than an atomic ratio of m to in in the second oxide semiconductor layer is used for the first oxide semiconductor layer, and wherein a material having a higher atomic ratio of m to in than the atomic ratio of m to in in the second oxide semiconductor layer is used for the third oxide semiconductor layer. 17 . the method for manufacturing a semiconductor device according to claim 14 , wherein a material including crystals in which c-axes are aligned is used for each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer. 18 . the method for manufacturing a semiconductor device according to claim 14 , wherein a layer containing one of al, cr, cu, ta, ti, mo, and w is used for each of the source electrode layer and the drain electrode layer.	technical field the present invention relates to an object, a method, or a manufacturing method. the present invention relates to a process, a machine, manufacture, or a composition of matter. in particular, one embodiment of the present invention relates to a semiconductor device, a display device, a light-emitting device, a storage device, an arithmetic unit, an imaging device, a method for driving any of them, or a method for manufacturing any of them. in this specification and the like, a semiconductor device generally means a device that can function by utilizing semiconductor characteristics. a transistor and a semiconductor circuit are embodiments of semiconductor devices. in some cases, a storage device, a display device, or an electronic device includes a semiconductor device. background art attention has been focused on a technique for forming a transistor using a semiconductor thin film formed over a substrate having an insulating surface (also referred to as a thin film transistor (tft)). the transistor is used in a wide range of electronic devices such as an integrated circuit (ic) and an image display device (display device). a silicon-based semiconductor material is widely known as a material for a semiconductor thin film applicable to a transistor. as another example, an oxide semiconductor has attracted attention. for example, a transistor whose active layer includes an amorphous oxide semiconductor containing indium (in), gallium (ga), and zinc (zn) is disclosed in patent document 1. reference patent document [patent document 1] japanese published patent application no. 2006-165528 disclosure of invention a high density of an integrated circuit requires miniaturization of a transistor, and a transistor having a simple structure and a simple manufacturing method of a transistor are required because the miniaturization increases the degree of difficulty of a manufacturing process. in addition, it is known that miniaturization of a transistor is likely to cause deterioration of or variation in electrical characteristics of the transistor. in other words, miniaturization of a transistor is likely to cause a decrease in yield of an integrated circuit. thus, one object of one embodiment of the present invention is to provide a semiconductor device having a structure with which the device can be manufactured through a simple process even in the case of miniaturization. another object is to provide a semiconductor device having a structure with which a decrease in a yield due to miniaturization can be suppressed. another object of one embodiment of the present invention is to provide a semiconductor device in which deterioration of electrical characteristics which becomes more noticeable as the transistor is miniaturized can be suppressed. another object is to provide a semiconductor device having a high degree of integration. another object is to provide a semiconductor device in which deterioration of electrical characteristics is reduced. another object is to provide a semiconductor device in which variation in electrical characteristics is reduced. another object is to provide a semiconductor device with low power consumption. another object is to provide a semiconductor device with high reliability. another object is to provide a semiconductor device which can retain data even when power supply is stopped. another object is to provide a method for manufacturing the semiconductor device. note that the descriptions of these objects do not disturb the existence of other objects. note that in one embodiment of the present invention, there is no need to achieve all the objects. other objects are apparent from and can be derived from the description of the specification, the drawings, the claims, and the like. one embodiment of the present invention relates to a semiconductor device in which a source electrode layer or a drain electrode layer is formed on an upper surface of an oxide semiconductor layer. note that “side contact” in this specification means a state where a side surface of one element is in contact with part of the other element, so that electrical connection between the one element and the other element is obtained. one embodiment of the present invention is a semiconductor device including a first oxide semiconductor layer over an insulating surface; a second oxide semiconductor layer over the first oxide semiconductor layer; a source electrode layer and a drain electrode layer which are over the second oxide semiconductor layer and whose side surfaces are provided on the same surface as side surfaces of the second oxide semiconductor layer; a third oxide semiconductor layer which is over the second oxide semiconductor layer and partly in contact with each of the source electrode layer and the drain electrode layer; a gate insulating film over the third oxide semiconductor layer; a gate electrode layer over the gate insulating film; and an insulating layer over the insulating surface, the source electrode layer, the drain electrode layer, and the gate electrode layer. in the insulating layer, a first opening where part of the second oxide semiconductor layer and part of the source electrode layer are exposed, a second opening where part of the second oxide semiconductor layer and part of the drain electrode layer are exposed, and a third opening where part of the gate electrode layer is exposed are formed. the second oxide semiconductor layer and the source electrode layer are electrically connected to a first wiring in the first opening. the second oxide semiconductor layer and the drain electrode layer are electrically connected to a second wiring in the second opening. the gate electrode layer is electrically connected to a third wiring in the third opening. note that in this specification and the like, ordinal numbers such as “first” and “second” are used in order to avoid confusion among components and do not limit the components numerically. further, a conduction band minimum of the first oxide semiconductor layer and a conduction band minimum of the third oxide semiconductor layer are preferably closer to a vacuum level than a conduction band minimum of the second oxide semiconductor layer by 0.05 ev or more and 2 ev or less. it is preferable that the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer each include an in-m-zn oxide (m is al, ti, ga, y, zr, la, ce, nd, or hf), and that an atomic ratio of m to in in each of the first oxide semiconductor layer and the third oxide semiconductor layer be higher than an atomic ratio of m to in in the second oxide semiconductor layer. each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer preferably includes a crystal in which c-axes are aligned. further, the source electrode layer and the drain electrode layer are each preferably formed of a single layer of al, cr, cu, ta, ti, mo, or w, a stacked film of any of these, or an alloy material containing any of these as its main component. another embodiment of the present invention is a method for manufacturing a semiconductor device comprising the steps of: forming a stacked film of a first oxide semiconductor film and a second oxide semiconductor film over an insulating surface; forming a first conductive film over the stacked film; forming a first resist mask over the first conductive film; selectively etching the first conductive film using the first resist mask as a mask to form a first conductive layer; selectively etching the stacked film using the first conductive layer as a mask and selectively etching the first conductive layer to divide the first conductive layer, thereby forming a stack of a first oxide semiconductor layer and a second oxide semiconductor layer and a source electrode layer and a drain electrode layer over the stack; forming a third oxide semiconductor film over the insulating surface, the stack, the source electrode layer, and the drain electrode layer; forming an oxide insulating film over the third oxide semiconductor film; forming a second conductive film over the oxide insulating film; forming a second resist mask over the second conductive film; selectively etching the second conductive film using the second resist mask as a mask to form a gate electrode layer; selectively etching the oxide insulating film and the third oxide semiconductor film using the gate electrode layer as a mask to form a gate insulating film and a third oxide semiconductor layer; forming an insulating layer over the insulating surface, the source electrode layer, the drain electrode layer, and the gate electrode layer; forming, in the insulating layer, a first opening where part of the second oxide semiconductor layer and part of the source electrode layer are exposed, a second opening where part of the second oxide semiconductor layer and part of the drain electrode layer are exposed, and a third opening where part of the gate electrode layer is exposed; and fanning a first wiring electrically connected to the second oxide semiconductor layer and the source electrode layer in the first opening, a second wiring electrically connected to the second oxide semiconductor layer and the drain electrode layer in the second opening, and a third wiring electrically connected to the gate electrode layer in the third opening. further, the first oxide semiconductor layer and the third oxide semiconductor layer are each preferably formed using a material in which a conduction band minimum of the first oxide semiconductor layer and a conduction band minimum of the third oxide semiconductor layer are closer to a vacuum level than a conduction band minimum of the second oxide semiconductor layer is by 0.05 ev or more and 2 ev or less. the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer are each preferably formed using an in-m-zn oxide (m is al, ti, ga, y, zr, la, ce, nd, or hf), and that an atomic ratio of m to in in each of the first oxide semiconductor layer and the third oxide semiconductor layer be higher than an atomic ratio of m to in in the second oxide semiconductor layer. for each of the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer, a material including a crystal in which c-axes are aligned is preferably used. in the above structure, it is preferable that the source electrode layer and the drain electrode layer be each formed using a single layer of al, cr, cu, ta, ti, mo, or w, a stacked layer of any of these, or an alloy material containing any of these as its main component. according to one embodiment of the present invention, a semiconductor device having a structure with which the device can be manufactured in a simple process even when the device is miniaturized can be provided. alternatively, a semiconductor device having a structure which can prevent a decrease in yield caused by miniaturization can be provided. alternatively, a semiconductor device in which a deterioration in electrical characteristics which becomes more noticeable as the transistor is miniaturized can be suppressed can be provided. alternatively, a highly integrated semiconductor device can be provided. alternatively, a semiconductor device in which deterioration in electrical characteristics is reduced can be provided. alternatively, a semiconductor device in which variation in electrical characteristics is suppressed can be provided. alternatively, a semiconductor device with low power consumption can be provided. alternatively, a highly reliable semiconductor device can be provided. alternatively, a semiconductor device in which data is retained even when not powered can be provided. alternatively, a method for manufacturing the above semiconductor device can be provided. note that the descriptions of these effects do not disturb the existence of other effects. in one embodiment of the present invention, there is no need to obtain all the effects. other effects are apparent from and can be derived from the description of the specification, the drawings, the claims, and the like. brief description of drawings in the accompanying drawings: figs. 1a and 1b are a top view and a cross-sectional view of a transistor; figs. 2a and 2b are cross-sectional views of a transistor; figs. 3a to 3c are cross-sectional views of transistors; figs. 4a to 4c are cross-sectional views of transistors; fig. 5 is a cross-sectional view of a transistor; figs. 6a and 6b are cross-sectional views of transistors; fig. 7 is a cross-sectional view of a transistor; figs. 8a to 8c are cross-sectional views illustrating a method for manufacturing a transistor; figs. 9a to 9c are cross-sectional views illustrating a method for manufacturing a transistor; figs. 10a and 10b are cross-sectional views illustrating a method for manufacturing a transistor; figs. 11a and 11b are a cross-sectional view and a circuit diagram of a semiconductor device; fig. 12 is a circuit diagram of a semiconductor device; figs. 13a to 13c illustrate electronic devices to which semiconductor devices can be applied; figs. 14a and 14b are a top view and a cross-sectional view of a transistor; figs. 15a and 15b are a top view and a cross-sectional view of a transistor; figs. 16a to 16d show models used for calculation and calculation results thereof; and figs. 17a and 17b show id-vg characteristics of a transistor. best mode for carrying out the invention embodiments are described in detail with reference to the drawings. note that the present invention is not limited to the following description and it is readily appreciated by those skilled in the art that modes and details can be modified in various ways without departing from the spirit and the scope of the present invention. therefore, the present invention should not be limited to the descriptions of the embodiments below. note that in structures of the present invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is omitted in some cases. note that in this specification and the like, when it is explicitly described that x and y are connected, the case where x and y are electrically connected, the case where x and y are functionally connected, and the case where x and y are directly connected are included therein. here, each of x and y denotes an object (e.g., a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, a layer, or the like). accordingly, a connection relation other than connection relations shown in the drawings and texts is also included, without being limited to a predetermined connection relation, for example, a connection relation shown in the drawings and texts. in the case where x and y are electrically connected, one or more elements (e.g., a switch, a transistor, a capacitor, an inductor, a resistor, a diode, a display element, a light-emitting element, and a load) that enable an electrical connection between x and y can be connected between x and y, for example. note that the switch is controlled to be turned on or off. that is, the switch has a function of determining whether current flows or not by being turned on or off (becoming an on state and an off state). alternatively, the switch has a function of selecting and changing a current path. in the case where x and y are functionally connected, one or more circuits (e.g., a logic circuit such as an inverter, a nand circuit, or a nor circuit; a signal converter circuit such as a da converter circuit, an ad converter circuit, or a gamma correction circuit; a potential level converter circuit such as a power supply circuit (e.g., a step-up circuit or a step-down circuit) or a level shifter circuit for changing the potential level of a signal; a voltage source; a current source; a switching circuit; an amplifier circuit such as a circuit that can increase signal amplitude, the amount of current, or the like, an operational amplifier, a differential amplifier circuit, a source follower circuit, or a buffer circuit; a signal generation circuit; a storage circuit; and a control circuit) that enable a functional connection between x and y can be connected between x and y, for example. note that for example, in the case where a signal output from x is transmitted to y even when another circuit is interposed between x and y, x and y are functionally connected. note that when it is explicitly described that x and y are connected, the case where x and y are electrically connected (i.e., the case where x and y are connected with another element or another circuit provided therebetween), the case where x and y are functionally connected (i.e., the case where x and y are functionally connected with another circuit provided therebetween), and the case where x and y are directly connected (i.e., the case where x and y are connected without another element or another circuit provided therebetween) are included therein. that is, when it is explicitly described that “x and y are electrically connected”, the description is the same as the case where it is explicitly only described that “x and y are connected”. even when independent components are electrically connected to each other in a circuit diagram, one component has functions of a plurality of components in some cases. for example, when part of a wiring also functions as an electrode, one conductive film functions as the wiring and the electrode. thus, an “electrical connection” in this specification includes in its category such a case where one conductive film has functions of a plurality of components. note that in this specification and the like, a transistor can be formed using any of a variety of substrates. the type of a substrate is not limited to a certain type. examples of the substrate include a semiconductor substrate (e.g., a single crystal substrate or a silicon substrate), an soi substrate, a glass substrate, a quartz substrate, a plastic substrate, a metal substrate, a stainless steel substrate, a substrate including stainless steel foil, a tungsten substrate, a substrate including tungsten foil, a flexible substrate, an attachment film, paper including a fibrous material, and a base material film. examples of a glass substrate include a barium borosilicate glass substrate, an aluminoborosilicate glass substrate, and a soda lime glass substrate. for a flexible substrate, a flexible synthetic resin such as plastics typified by polyethylene terephthalate (pet), polyethylene naphthalate (pen), and polyether sulfone (pes), or acrylic can be used, for example. examples of an attachment film include attachment films formed using polypropylene, polyester, polyvinyl fluoride, polyvinyl chloride, and the like. examples of a base film include a base film formed using polyester, polyamide, polyimide, an inorganic vapor deposition film, paper, and the like. specifically, when a transistor is formed using a semiconductor substrate, a single crystal substrate, an soi substrate, or the like, a transistor with few variations in characteristics, size, shape, or the like, high current supply capability, and a small size can be formed. by forming a circuit using such a transistor, power consumption of the circuit can be reduced or the circuit can be highly integrated. note that a transistor may be formed using one substrate, and then, the transistor may be transferred to another substrate. examples of a substrate to which a transistor is transferred include, in addition to the above-described substrates over which transistors can be formed, a paper substrate, a cellophane substrate, a stone substrate, a wood substrate, a cloth substrate (including a natural fiber (e.g., silk, cotton, or hemp), a synthetic fiber (e.g., nylon, polyurethane, or polyester), a regenerated fiber (e.g., acetate, cupra, rayon, or regenerated polyester), or the like), a leather substrate, a rubber substrate, and the like. with the use of such a substrate, a transistor with excellent properties, a transistor with low power consumption, or a device with high durability can be formed, high heat resistance can be provided, or a reduction in weight or thinning can be achieved. embodiment 1 in this embodiment, a semiconductor device of one embodiment of the present invention is described with reference to drawings. figs. 1a and 1b are a top view and a cross-sectional view of a transistor of one embodiment of the present invention. fig. 1a is the top view. fig. 1b illustrates a cross section taken along dashed-dotted line a 1 -a 2 in fig. 1a . fig. 2a is a cross-sectional view taken along dashed-dotted line a 3 -a 4 in fig. 1a . fig. 2b is a cross-sectional view taken along dashed-dotted line a 5 -a 6 in fig. 1a . note that for simplification of the drawing, some components are not illustrated in the top view in fig. 1a . in some cases, the direction of the dashed-dotted line a 1 -a 2 is referred to as a channel length direction, and the direction of the dashed-dotted line a 3 -a 4 is referred to as a channel width direction. a transistor 100 illustrated in figs. 1a and 1b and figs. 2a and 2b includes a base insulating film 120 over a substrate 110 , a stack in which a first oxide semiconductor layer 131 and a second oxide semiconductor layer 132 are formed in this order and which is over the base insulating film, a source electrode layer 140 and a drain electrode layer 150 over the second oxide semiconductor layer, a third oxide semiconductor layer 133 which is formed in contact with the base insulating film 120 and the stack and is partly in contact with each of the source electrode layer 140 and the drain electrode layer 150 , a gate insulating film 160 over the third oxide semiconductor layer, a gate electrode layer 170 over the gate insulating film, and an insulating layer 180 over the base insulating film 120 , the source electrode layer 140 , the drain electrode layer 150 , and the gate electrode layer 170 . note that functions of a “source” and a “drain” of a transistor are sometimes replaced with each other when a transistor of opposite polarity is used or when the direction of current flowing is changed in circuit operation, for example. thus, the terms “source” and “drain” can be used to denote the drain and the source, respectively, in this specification. an insulating layer 185 formed of an oxide may be formed over the insulating layer 180 . note that the insulating layer 185 may be provided as needed and another insulating layer may be further provided thereover. the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 are collectively referred to as an oxide semiconductor layer 130 . in the insulating layer 180 , a first opening 147 where the second oxide semiconductor layer 132 and the source electrode layer 140 are partly exposed is formed. further, a second opening 157 where the second oxide semiconductor layer 132 and the drain electrode layer 150 are partly exposed is formed. furthermore, a third opening 177 where the gate electrode layer 170 is partly exposed is formed. in the first opening 147 , a side surface of the second oxide semiconductor layer 132 and a side surface of the source electrode layer 140 are provided on the same surface and are electrically connected to a first wiring 145 . in the second opening 157 , a side surface of the second oxide semiconductor layer 132 and a side surface of the drain electrode layer 150 are provided on the same surface and are electrically connected to a second wiring 155 . in the third opening 177 , the gate electrode layer 170 is electrically connected to a third wiring 175 by side contact. conventionally, electrical connection has been obtained by providing an opening in an insulating layer and the like formed on an electrode layer so that part of a wiring formed in the opening is in contact with part of the upper surface of the electrode layer. however, as miniaturization of the transistor progresses, the degree of difficulty in manufacturing increases, which results in a defect in the opening provided in the insulating layer or the like, variation in the depth of the opening, and the like. thus, contact resistance between the electrode layer and the wiring is likely to vary among elements. in other words, an increase in the degree of difficulty in manufacturing a miniaturized transistor is one factor of variation in the electrical characteristics of transistors. on the other hand, in one embodiment of the present invention, part of an electrode layer exposed in an opening and part of a wiring formed in the opening are electrically connected to each other by side contact. thus, variation in contact area between the electrode layer and the wiring can be less likely to occur. in other words, variation in contact resistance between the electrode layer and the wiring in elements can be suppressed, which enables reduction in variation in the electrical characteristics of a transistor which is caused by the variation. further, in the case where an opening is provided in an insulating layer to expose an electrode layer and the like, over-etching an electrode layer and the like to expose side surfaces of the electrode layer and the like in the opening is less difficult than exposing upper surfaces of the electrode layer and the like by controlling etching conditions strictly. in the case where an opening is formed so as to extend into the electrode layer, for example, the etching conditions can be freely selected even when the etching rate of the electrode layer is sufficiently lower than that of the insulating layer. accordingly, the yield of the transistor can be improved. in one embodiment of the present invention, it is preferable to employ a structure in which the first opening 147 and the second opening 157 reach the base insulating film 120 as illustrated in fig. 1b . the structure can be formed under etching conditions having a high degree of freedom and can reduce variation in electrical characteristics of a transistor and improve yield. moreover, since a wiring in contact with a semiconductor layer functions as part of an electrode layer, contact resistance between the electrode layer and the semiconductor layer can be further reduced. further, when the gate electrode layer 170 is connected to the third wiring 175 by side contact as illustrated in figs. 2a and 2b , variation in contact area between the electrode layer and the wiring can be less likely to occur and variation in contact resistance can be suppressed. note that the bottom of the third opening 177 is positioned in a range d (in any of the gate insulating film 160 , the third oxide semiconductor layer 133 , and the base insulating film 120 ) in the drawing. note that the structures inside the first opening 147 and the second opening 157 are not limited to the example illustrated in fig. 1b . for example, as illustrated in fig. 3a , a structure may be employed in which upper surfaces of the source electrode layer 140 and the drain electrode layer 150 are partly exposed in the first opening 147 and the second opening 157 . when the etching rates of the source electrode layer 140 and the drain electrode layer 150 are sufficiently lower than that of the insulating layer 180 , the structure can be formed easily. alternatively, as illustrated in fig. 3b , a structure may be employed in which an upper surface of the second oxide semiconductor layer 132 is partly exposed in the first opening 147 and the second opening 157 . further alternatively, although not illustrated, a structure may be employed in which an upper surface of the first oxide semiconductor layer 131 is partly exposed in the openings. when the etching rate of the second oxide semiconductor layer 132 and/or the etching rate of the first oxide semiconductor layer 131 are/is sufficiently lower than that of the insulating layer 180 , the structure can be formed easily. note that in the description of figs. 3a and 3b , a layer whose upper surface is partly exposed may be partly etched in the film thickness direction. still further alternatively, as illustrated in fig. 3c , the bottoms of the first opening 147 and the second opening 157 may be positioned in the base insulating film 120 . when the etching rate of the insulating layer 180 is close to the etching rate of each of the source electrode layer 140 , the drain electrode layer 150 , the second oxide semiconductor layer 132 , the first oxide semiconductor layer 131 , and the base insulating film 120 , the structure can be formed easily. note that when the etching conditions can be controlled strictly, as illustrated in figs. 14a and 14b , a structure may be employed in which upper surfaces of the source electrode layer 140 and the drain electrode layer 150 are partly exposed to be in contact with the first wiring 145 and the second wiring 155 . alternatively, in a transistor of one embodiment of the present invention, as illustrated in figs. 15a and 15b , upper surface shapes of the third oxide semiconductor layer 133 and the gate insulating film 160 may be different from an upper surface shape of the gate electrode layer 170 . the structure illustrated in figs. 15a and 15b can reduce gate leakage current. note that the structure can be applied to another transistor described in this embodiment. since the source electrode layer 140 and the drain electrode layer 150 are formed only over the oxide semiconductor layer in the transistor of one embodiment of the present invention, there is a concern that an effective channel width is shortened and thus the on-state current decreases slightly; however, application of gate electric field to a side portion of the oxide semiconductor layer is not blocked and thus gate electric field is applied to the entire oxide semiconductor layer, whereby the s value of the transistor can be decreased. the effect is confirmed by the scientific calculation described below. fig. 16a is a top view of a model (a) assuming a transistor having a conventional structure, and the width of each of the source electrode layer 140 and the drain electrode layer 150 is larger than that of the oxide semiconductor layer. fig. 16b is a top view of a model (b) assuming one embodiment of the present invention, and the width of each of the source electrode layer 140 and the drain electrode layer 150 is the same as that of the oxide semiconductor layer. fig. 16c shows calculation results of current density distributions in cross sections of channel portions in the w width direction at a drain current of about 1e-12 [a] in the models. the left part of fig. 16c shows calculation results of the model (a) and the current density is high around the center of a lower layer of the channel portion. in other words, current cannot be controlled around the center of the lower layer of the channel portion. on the other hand, the right part of fig. 16c shows calculation results of the model (b) and the current density is high near an upper layer of the channel portion. this is because gate electric field is sufficiently applied from the side surface. as shown in fig. 16d , from id-vg characteristics obtained by calculation using the above models, it is found that the s value of the model (b) assuming one embodiment of the present invention is extremely small as compared to the model (a). next, components of the transistor 100 of one embodiment of the present invention are described in detail. the substrate 110 is not limited to a simple supporting substrate, and may be a substrate where another device such as a transistor is formed. in that case, one of the gate electrode layer 170 , the source electrode layer 140 , and the drain electrode layer 150 of the transistor 100 may be electrically connected to the above device. the base insulating film 120 can have a function of supplying oxygen to the oxide semiconductor layer 130 as well as a function of preventing diffusion of impurities from the substrate 110 . for this reason, the base insulating film 120 is preferably an insulating film containing oxygen and further preferably, the base insulating film 120 is an insulating film containing oxygen, in which the oxygen content is higher than that in the stoichiometric composition. in the case where the substrate 110 is provided with another device as described above, the base insulating film 120 also has a function as an interlayer insulating film. in that case, the base insulating film 120 is preferably subjected to planarization treatment such as chemical mechanical polishing (cmp) treatment so as to have a flat surface. further, in a region where a channel of the transistor 100 is formed, the oxide semiconductor layer 130 has a structure in which the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 are stacked in this order from the substrate 110 side. furthermore, in the first oxide semiconductor layer 131 , a region not overlapping with the second oxide semiconductor layer 132 , the source electrode layer 140 , and the drain electrode layer 150 is in contact with the third oxide semiconductor layer 133 , which means that the second oxide semiconductor layer 132 is surrounded by the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 . here, for the second oxide semiconductor layer 132 , for example, an oxide semiconductor whose electron affinity (an energy difference between a vacuum level and the conduction band minimum) is higher than those of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 is used. the electron affinity can be obtained by subtracting an energy difference between the conduction band minimum and the valence band maximum (what is called an energy gap) from an energy difference between the vacuum level and the valence band maximum (what is called an ionization potential). although the case where the oxide semiconductor layer 130 is a stack of three layers is described in detail in this embodiment, the oxide semiconductor layer 130 may be a single layer or a stack of two layers or four or more layers. in the case where the oxide semiconductor layer 130 is a single layer, for example, a layer corresponding to the second oxide semiconductor layer 132 is used as illustrated in fig. 4a . in the case where the oxide semiconductor layer 130 is a stack of two layers, for example, a structure without the third oxide semiconductor layer 133 is used as illustrated in fig. 4b . in such a case, the second oxide semiconductor layer 132 and the first oxide semiconductor layer 131 can be replaced with each other. in the case where the oxide semiconductor layer 130 is a stack of three layers, a structure different from that in figs. 1a and 1b , such as that in fig. 4c , can be employed. in the case of a stack of four or more layers, for example, a structure in which an oxide semiconductor layer is stacked over the three-layer stacked structure described in this embodiment or a structure in which an oxide semiconductor layer is provided between any of two layers in the three-layer stacked structure can be employed. it is preferable that each of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 contain one or more kinds of metal elements forming the second oxide semiconductor layer 132 and be formed, for example, using an oxide semiconductor whose energy of the conduction band minimum is closer to the vacuum level than that of the second oxide semiconductor layer 132 by 0.05 ev or more, 0.07 ev or more, 0.1 ev or more, or 0.15 ev or more and 2 ev or less, 1 ev or less, 0.5 ev or less, or 0.4 ev or less. in such a structure, when an electric field is applied to the gate electrode layer 170 , a channel is formed in the second oxide semiconductor layer 132 whose conduction band minimum is the lowest in the oxide semiconductor layer 130 . in other words, the third oxide semiconductor layer 133 is formed between the second oxide semiconductor layer 132 and the gate insulating film 160 , whereby a structure in which the channel of the transistor is not in contact with the gate insulating film 160 is obtained. further, since the first oxide semiconductor layer 131 contains one or more metal elements contained in the second oxide semiconductor layer 132 , an interface state is less likely to be formed at the interface of the second oxide semiconductor layer 132 with the first oxide semiconductor layer 131 than at the interface with the base insulating film 120 on the assumption that the second oxide semiconductor layer 132 is in contact with the base insulating film 120 . the interface state sometimes forms a channel, leading to a change in the threshold voltage of the transistor. thus, with the first oxide semiconductor layer 131 , variation in the electrical characteristics of the transistors, such as a threshold voltage, can be reduced. further, the reliability of the transistor can be improved. furthermore, since the third oxide semiconductor layer 133 contains one or more metal elements contained in the second oxide semiconductor layer 132 , scattering of carriers is less likely to occur at the interface of the second oxide semiconductor layer 132 with the third oxide semiconductor layer 133 than at the interface with the gate insulating film 160 on the assumption that the second oxide semiconductor layer 132 is in contact with the gate insulating film 160 . thus, with the third oxide semiconductor layer 133 , the field-effect mobility of the transistor can be increased. for the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 , for example, a material containing al, ti, ga, ge, y, zr, sn, la, ce, or hf with a higher atomic ratio than that used for the second oxide semiconductor layer 132 can be used. specifically, an atomic ratio of any of the above metal elements in the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 is 1.5 times or more, preferably 2 times or more, further preferably 3 times or more as much as that in the second oxide semiconductor layer 132 . any of the above elements is strongly bonded to oxygen and thus has a function of suppressing generation of an oxygen vacancy in an oxide semiconductor layer. that is, an oxygen vacancy is less likely to be generated in the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 than in the second oxide semiconductor layer 132 . note that when each of the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 is an in-m-zn oxide containing at least indium, zinc, and m (m is a metal such as al, ti, ga, ge, y, zr, sn, la, ce, or hf), and the first oxide semiconductor layer 131 has an atomic ratio of in to m and zn which is the second oxide semiconductor layer 132 has an atomic ratio of in to m and zn which is x 2 :y 2 :z 2 , and the third oxide semiconductor layer 133 has an atomic ratio of in to m and zn which is x 3 :y 3 :z 3 , each of y 1 /x 1 and y 3 /x 3 is preferably larger than y 2 /x 2 . each of y 1 /x 1 and y 3 /x 3 is 1.5 times or more, preferably 2 times or more, further preferably 3 times or more as large as y 2 /x 2 . at this time, when y 2 is greater than or equal to x 2 in the second oxide semiconductor layer 132 , the transistor can have stable electrical characteristics. however, when y 2 is 3 times or more as large as x 2 , the field-effect mobility of the transistor is reduced; accordingly, y 2 is preferably less than 3 times x 2 . note that in this specification, an atomic ratio used for describing the composition of an oxide semiconductor layer can be also used as the atomic ratio of a base material. in the case where an oxide semiconductor layer is deposited by a sputtering method using an oxide semiconductor material as a target, the composition of the oxide semiconductor layer might be different from that of the target, which is a base material, depending on the kind or a ratio of a sputtering gas, the density of the target, or deposition conditions. thus, in this specification, an atomic ratio used for describing the composition of an oxide semiconductor layer is also used as the atomic ratio of a base material. for example, in the case where a sputtering method is used for deposition, an in—ga—zn oxide film whose atomic ratio of in to ga and zn is 1:1:1 can be also understood as an in—ga—zn oxide film formed using an in—ga—zn oxide material whose atomic ratio of in to ga and zn is 1:1:1 as a target. further, in the case where zn and o are not taken into consideration, the proportion of in and the proportion of m in each of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 are preferably less than 50 atomic % and greater than or equal to 50 atomic %, respectively, and further preferably less than 25 atomic % and greater than or equal to 75 atomic %, respectively. in addition, in the case where zn and o are not taken into consideration, the proportion of in and the proportion of min the second oxide semiconductor layer 132 are preferably greater than or equal to 25 atomic % and less than 75 atomic %, respectively, and further preferably greater than or equal to 34 atomic % and less than 66 atomic %, respectively. the thicknesses of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 are each greater than or equal to 1 nm and less than or equal to 100 nm, preferably greater than or equal to 3 nm and less than or equal to 50 nm. the thickness of the second oxide semiconductor layer 132 is greater than or equal to 1 nm and less than or equal to 200 nm, preferably greater than or equal to 3 nm and less than or equal to 100 nm, further preferably greater than or equal to 3 nm and less than or equal to 50 nm. for each of the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 , an oxide semiconductor containing indium, zinc, and gallium can be used, for example. note that the second oxide semiconductor layer 132 preferably contains indium because carrier mobility can be increased. note that stable electrical characteristics can be effectively imparted to a transistor in which an oxide semiconductor layer serves as a channel by reducing the concentration of impurities in the oxide semiconductor layer to make the oxide semiconductor layer intrinsic or substantially intrinsic. the term “substantially intrinsic” refers to the state where an oxide semiconductor layer has a carrier density lower than 1×10 17 /cm 3 , preferably lower than 1×10 15 /cm 3 , further preferably lower than 1×10 13 /cm 3 . further, in the oxide semiconductor layer, hydrogen, nitrogen, carbon, silicon, and a metal element other than main components are impurities. for example, hydrogen and nitrogen form donor levels to increase the carrier density, and silicon forms impurity levels in the oxide semiconductor layer. the impurity levels serve as traps and might cause the electrical characteristics of the transistor to deteriorate. thus, it is preferable to reduce the concentration of the impurities in the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 , and at interfaces between the layers. in order to make the oxide semiconductor layer intrinsic or substantially intrinsic, in sims (secondary ion mass spectrometry), for example, the concentration of silicon at a certain depth of the oxide semiconductor layer or in a region of the oxide semiconductor layer is preferably lower than 1×10 19 atoms/cm 3 , further preferably lower than 5×10 18 atoms/cm 3 , still further preferably lower than 1×10 18 atoms/cm 3 . further, the concentration of hydrogen at a certain depth of the oxide semiconductor layer or in a region of the oxide semiconductor layer is preferably lower than or equal to 2×10 20 atoms/cm 3 , further preferably lower than or equal to 5×10 19 atoms/cm 3 , still further preferably lower than or equal to 1×10 19 atoms/cm 3 , yet still further preferably lower than or equal to 5×10 18 atoms/cm 3 . further, the concentration of nitrogen at a certain depth of the oxide semiconductor layer or in a region of the oxide semiconductor layer is preferably lower than 5×10 19 atoms/cm 3 , further preferably lower than or equal to 5×10 18 atoms/cm 3 , still further preferably lower than or equal to 1×10 18 atoms/cm 3 , yet still further preferably lower than or equal to 5×10 17 atoms/cm 3 . in the case where the oxide semiconductor layer includes crystals, high concentration of silicon or carbon might reduce the crystallinity of the oxide semiconductor layer. in order not to lower the crystallinity of the oxide semiconductor layer, for example, the concentration of silicon at a certain depth of the oxide semiconductor layer or in a region of the oxide semiconductor layer may be lower than 1×10 19 atoms/cm 3 , preferably lower than 5×10 18 atoms/cm 3 , further preferably lower than 1×10 18 atoms/cm 3 . further, the concentration of carbon at a certain depth of the oxide semiconductor layer or in a region of the oxide semiconductor layer may be lower than 1×10 19 atoms/cm 3 , preferably lower than 5×10 18 atoms/cm 3 , further preferably lower than 1×10 18 atoms/cm 3 , for example. a transistor in which the above-described highly purified oxide semiconductor layer is used for a channel formation region has an extremely low off-state current. in the case where the voltage between a source and a drain is set to about 0.1 v, 5 v, or 10 v, for example, the off-state current standardized on the channel width of the transistor can be as low as several yoctoamperes per micrometer to several zeptoamperes per micrometer. note that as the gate insulating film of the transistor, an insulating film containing silicon is used in many cases; thus, it is preferable that, as in the transistor of one embodiment of the present invention, a region of the oxide semiconductor layer, which serves as a channel, be not in contact with the gate insulating film for the above-described reason. in the case where a channel is formed at the interface between the gate insulating film and the oxide semiconductor layer, scattering of carriers occurs at the interface, whereby the field-effect mobility of the transistor is reduced in some cases. also from the view of the above, it is preferable that the region of the oxide semiconductor layer, which serves as a channel, be separated from the gate insulating film. accordingly, with the oxide semiconductor layer 130 having a stacked-layer structure including the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 , a channel can be formed in the second oxide semiconductor layer 132 ; thus, the transistor can have a high field-effect mobility and stable electrical characteristics. in the band structures of the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 , the energy of the conduction band minimum continuously changes. this can be understood also from the fact that the compositions of the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 are close to one another and oxygen is easily diffused among the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 . thus, the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 have a continuous physical property although they have different compositions and form a stack. in the drawings, interfaces between the oxide semiconductor layers of the stack are indicated by dotted lines. the oxide semiconductor layer 130 in which layers containing the same main components are stacked is formed to have not only a simple stacked-layer structure of the layers but also a continuous junction (here, in particular, a well structure having a u shape in which energies of the conduction band minimums successively vary between layers). in other words, the stacked-layer structure is formed such that there exists no impurity that forms a defect level such as a trap center or a recombination center at each interface. if impurities exist between the stacked oxide semiconductor layers, the continuity of the energy band is lost and carriers disappear by a trap or recombination. for example, an in—ga—zn oxide whose atomic ratio of in to ga and zn is 1:3:2, 1:3:3, 1:3:4, 1:3:6, 1:6:4, or 1:9:6 can be used for the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 and an in—ga—zn oxide whose atomic ratio of in to ga and zn is 1:1:1, 5:5:6, or 3:1:2 can be used for the second oxide semiconductor layer 132 . the second oxide semiconductor layer 132 of the oxide semiconductor layer 130 serves as a well, so that a channel is formed in the second oxide semiconductor layer 132 in a transistor including the oxide semiconductor layer 130 . note that since the energies of the conduction band minimums continuously changes, the oxide semiconductor layer 130 can also be referred to as a u-shaped well. further, a channel formed to have such a structure can also be referred to as a buried channel. note that trap levels due to impurities or defects might be formed in the vicinity of the interface between an insulating film such as a silicon oxide film and each of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 . the second oxide semiconductor layer 132 can be distanced away from the trap levels owing to existence of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 . however, when the energy difference between the conduction band minimum of the first oxide semiconductor layer 131 and the conduction band minimum of the second oxide semiconductor layer 132 and the energy difference between the conduction band minimum of the third oxide semiconductor layer 133 and the conduction band minimum of the second oxide semiconductor layer 132 are small, an electron in the second oxide semiconductor layer 132 might reach the trap level by passing over the energy differences. when the electron is trapped in the trap level, a negative fixed charge is generated at the interface with the insulating film, whereby the threshold voltage of the transistor is shifted in the positive direction. thus, to reduce fluctuations in the threshold voltage of the transistor, energy differences of at least certain values between the conduction band minimum of the second oxide semiconductor layer 132 and the conduction band minimum of each of the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 is necessary. each of the energy differences is preferably greater than or equal to 0.1 ev, further preferably greater than or equal to 0.15 ev. note that the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , and the third oxide semiconductor layer 133 preferably include crystal parts. in particular, when crystals in which c-axes are aligned are used, the transistor can have stable electrical characteristics. in the case where an in—ga—zn oxide is used for the oxide semiconductor layer 130 , it is preferable that the third oxide semiconductor layer 133 contain less in than the second oxide semiconductor layer 132 so that diffusion of in to the gate insulating film is prevented. for the source electrode layer 140 , the drain electrode layer 150 , the first wiring 145 , the second wiring 155 , and the third wiring 175 , a conductive material which is easily bonded to oxygen is preferably used. for example, al, cr, cu, ta, ti, mo, or w can be used. among the materials, it is particularly preferable to use ti, which is easily bonded to oxygen, or w, which has a high melting point and thus allows subsequent process temperatures to be relatively high. note that the conductive material which is easily bonded to oxygen includes, in its category, a material to which oxygen is easily diffused. note that the first wiring 145 , the second wiring 155 , and the third wiring 175 may each be a stack such as ti/al/ti. in addition, a conductive material which is not easily bonded to oxygen may be used as needed. for example, it is possible to use a single layer formed of a material containing tantalum nitride, titanium nitride, gold, platinum, palladium, or ruthenium or a stack of the conductive material and the above conductive material which is easily bonded to oxygen. when the conductive material which is easily bonded to oxygen is in contact with an oxide semiconductor layer, a phenomenon occurs in which oxygen in the oxide semiconductor layer is diffused into the conductive material which is easily bonded to oxygen. the phenomenon noticeably occurs when the temperature is high. thus, by a heat treatment step in the manufacturing process of the transistor, oxygen vacancies are generated in a region of the oxide semiconductor layer, which is in the vicinity of the interface between the oxide semiconductor layer and each of the source electrode layer and the drain electrode layer. the oxygen vacancies are bonded to hydrogen slightly contained in the film, whereby the region is likely changed to an n-type. thus, the n-type region can serve as a source or a drain of the transistor. the n-type region is illustrated in an enlarged cross-sectional view of the transistor (showing part of a cross section in the channel length direction, which is near the source electrode layer 140 ) in fig. 5 . a boundary 135 indicated by a dotted line in the first oxide semiconductor layer 131 and the second oxide semiconductor layer 132 is a boundary between an intrinsic semiconductor region and an n-type semiconductor region. in the first oxide semiconductor layer 131 and the second oxide semiconductor layer 132 , a region near the source electrode layer 140 and the first wiring 145 becomes an n-type region. the boundary 135 is schematically illustrated here, but actually, the boundary is not clearly seen in some cases. although fig. 5 shows that part of the boundary 135 extends in the lateral direction in the second oxide semiconductor layer 132 , a region in the first oxide semiconductor layer 131 and the second oxide semiconductor layer 132 , which is sandwiched between the source electrode layer 140 and the base insulating film 120 , becomes n-type entirely in the thickness direction, in some cases. in one embodiment of the present invention, the first wiring 145 and the second wiring 155 are connected to the first oxide semiconductor layer 131 and the second oxide semiconductor layer 132 by side contact, an n-type region formed in the first oxide semiconductor layer 131 and the second oxide semiconductor layer 132 can be enlarged. the n-type region serves as a source (or a drain) of the transistor. when the n-type region is enlarged, the series resistance between a channel formation region and the source electrode (or the drain electrode) or between the channel formation region and the first wiring 145 (or the second wiring 155 ) can be reduced and the electrical characteristics of the transistor can be improved. in the case of forming a transistor with an extremely short channel length, an n-type region which is formed by the generation of oxygen vacancies might extend in the channel length direction of the transistor. in that case, the electrical characteristics of the transistor change; for example, the threshold voltage is shifted, or on and off states of the transistor is hard to control with the gate voltage (in which case the transistor is turned on). accordingly, when a transistor with an extremely short channel length is formed, it is not always preferable that a conductive material easily bonded to oxygen be used for a source electrode layer and a drain electrode layer. in such a case, a conductive material which is less likely to be bonded to oxygen than the above material can be used for the source electrode layer 140 and the drain electrode layer 150 . as the conductive material which is not easily bonded to oxygen, for example, a material containing tantalum nitride, titanium nitride, gold, platinum, palladium, or ruthenium or the like can be used. note that in the case where the conductive material is in contact with the second oxide semiconductor layer 132 , the source electrode layer 140 and the drain electrode layer 150 may each have a structure in which the conductive material which is not easily bonded to oxygen and the above-described conductive material that is easily bonded to oxygen are stacked. the gate insulating film 160 can be formed using an insulating film containing one or more of aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide. the gate insulating film 160 may be a stack including any of the above materials. for the gate electrode layer 170 , a conductive film formed using al, ti, cr, co, ni, cu, y, zr, mo, ru, ag, ta, w, or the like can be used. the gate electrode layer may be a stack including any of the above materials. alternatively, a conductive film containing nitrogen may be used for the gate electrode layer. an aluminum oxide film is preferably contained in the gate insulating film 160 and the insulating layer 180 over the gate electrode layer 170 . the aluminum oxide film has a high shielding effect (blocking effect) of preventing penetration of both oxygen and impurities such as hydrogen and moisture. accordingly, the aluminum oxide film can be suitably used as a protective film that prevents entry of an impurity such as hydrogen or moisture, which causes variation in the electrical characteristics of the transistor, into the oxide semiconductor layer 130 , release of oxygen, which is a main component material of the oxide semiconductor layer 130 , from the oxide semiconductor layer during and after the manufacturing process of the transistor, and unnecessary release of oxygen from the base insulating film 120 . further, oxygen contained in the aluminum oxide film can be diffused into the oxide semiconductor layer. further, the insulating layer 185 is preferably formed over the insulating layer 180 . the insulating layer 185 can be formed using an insulating film containing one or more of magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, and tantalum oxide. the insulating layer 185 may be a stack including any of the above materials. here, the insulating layer 185 preferably contains excess oxygen. an insulating layer containing excess oxygen refers to an insulating layer from which oxygen can be released by heat treatment or the like. the insulating layer containing excess oxygen is preferably a film in which the amount of released oxygen when converted into oxygen atoms is 1.0×10 19 atoms/cm 3 or more in thermal desorption spectroscopy analysis. oxygen released from the insulating layer can be diffused into the channel formation region in the oxide semiconductor layer 130 through the gate insulating film 160 , so that oxygen vacancies formed in the channel formation region can be filled with the oxygen. in this manner, the electrical characteristics of the transistor can be stable. high integration of a semiconductor device requires miniaturization of a transistor. however, it is known that miniaturization of a transistor causes deterioration of the electrical characteristics of the transistor. in particular, a reduction in on-state current, which is directly caused by a decrease in channel width, is significant. however, in the transistor of one embodiment of the present invention, as described above, the third oxide semiconductor layer 133 is formed so as to cover the second oxide semiconductor layer 132 where a channel is formed and the channel formation layer and the gate insulating film are not in contact with each other. accordingly, scattering of carriers at the interface between the second oxide semiconductor layer 132 where a channel is formed and the gate insulating film can be reduced and the field-effect mobility of the transistor can be increased. the transistor of one embodiment of the present invention can have particular improved electrical characteristics when having a structure in which the length (w t ) of a top surface of the second oxide semiconductor layer 132 in the channel width direction is as large as or smaller than the thickness of the oxide semiconductor layer, as in a cross-sectional diagram in the channel width direction in figs. 6a and 6b . note that in the cross section in the channel width direction, the second oxide semiconductor layer 132 may have tapered side surfaces and an upper surface having a flat portion as illustrated in fig. 6a . alternatively, as illustrated in fig. 6b , the second oxide semiconductor layer 132 may have tapered side surfaces and an upper surface having a curvature. in the case where w t is sufficiently small as in either of the transistors illustrated in figs. 6a and 6b , for example, an electric field from the gate electrode layer 170 to the side surface of the second oxide semiconductor layer 132 is applied to the entire second oxide semiconductor layer 132 ; thus, a channel is formed equally in the side and top surfaces of the second oxide semiconductor layer 132 . in the case where a channel region 137 as in either of figs. 6a and 6b is formed in the transistor, the channel width can be defined as the sum of w t and the lengths of the side surfaces (w s1 and w s2 ) of the second oxide semiconductor layer 132 in the channel width direction (i.e., w t +w s1 +w s2 ), and on-state current flows in the transistor in accordance with the channel width. in the case where w t is sufficiently small, current flows in the entire second oxide semiconductor layer 132 . in other words, the transistor illustrated in figs. 6a and 6b has a higher on-state current than that of the conventional transistor because the transistor illustrated in figs. 6a and 6b has an effect of suppressing scattering of carriers and an effect of extending the effective channel width. note that in order to efficiently increase the on-state current of the transistor when w s1 and w s2 are represented by w s (w s1 =w s2 =w s ), a relation 0.3 w s ≦w t ≦3 w s (w t is greater than or equal to 0.3 w s and less than or equal to 3 w s ) is satisfied. further, w t /w s is preferably greater than or equal to 0.5 and less than or equal to 1.5, further preferably greater than or equal to 0.7 and less than or equal to 1.3. in the case where w t /w s >3, the s value and the off-state current might be increased. as described above, with the transistor of one embodiment of the present invention, sufficiently high on-state current can be obtained even when the transistor is miniaturized. in the transistor of one embodiment of the present invention, the second oxide semiconductor layer 132 is formed over the first oxide semiconductor layer 131 , so that an interface state is less likely to be formed. in addition, impurities do not enter the second oxide semiconductor layer 132 from above and below because the second oxide semiconductor layer 132 is an intermediate layer in a three-layer structure. since the second oxide semiconductor layer 132 is surrounded by the first oxide semiconductor layer 131 and the third oxide semiconductor layer 133 , not only can the on-state current of the transistor be increased but also the threshold voltage can be stabilized and the s value (subthreshold value) can be reduced. thus, icut (current when gate voltage vg is 0 v) can be reduced and power consumption can be reduced. further, the threshold voltage of the transistor becomes stable; thus, long-term reliability of the semiconductor device can be improved. the transistor of one embodiment of the present invention may include a conductive film 172 between the oxide semiconductor layer 130 and the substrate 110 as illustrated in fig. 7 . when the conductive film is used as a second gate electrode, the on-state current can be further increased and the threshold voltage can be controlled. in order to increase the on-state current, for example, the gate electrode layer 170 and the conductive film 172 are set to have the same potential, and the transistor is driven as a dual-gate transistor. further, to control the threshold voltage, a fixed potential, which is different from a potential of the gate electrode layer 170 , is supplied to the conductive film 172 . this embodiment can be combined as appropriate with any of the other embodiments and an example in this specification. embodiment 2 in this embodiment, a method for manufacturing the transistor 100 , which is described in embodiment 1 with reference to figs. 1a and 1b , is described with reference to figs. 9a to 9c , figs. 10a and 10b , and figs. 11a and 11b . for the substrate 110 , a glass substrate, a ceramic substrate, a quartz substrate, a sapphire substrate, or the like can be used. alternatively, a single crystal semiconductor substrate or a polycrystalline semiconductor substrate made of silicon, silicon carbide, or the like, a compound semiconductor substrate made of silicon germanium or the like, a silicon-on-insulator (soi) substrate, or the like can be used. further alternatively, any of these substrates further provided with a semiconductor element can be used. the base insulating film 120 can be formed by a plasma chemical vapor deposition (cvd) method, a sputtering method, or the like using an oxide insulating film of aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, tantalum oxide, or the like; a nitride insulating film of silicon nitride, silicon nitride oxide, aluminum nitride, aluminum nitride oxide, or the like; or a film in which any of the above materials are mixed. alternatively, a stack including any of the above materials may be used, and at least an upper layer of the base insulating film 120 which is in contact with the oxide semiconductor layer 130 is preferably formed using a material containing excess oxygen that might serve as a supply source of oxygen to the oxide semiconductor layer 130 . oxygen may be added to the base insulating film 120 by an ion implantation method, an ion doping method, a plasma immersion ion implantation method, or the like. adding oxygen enables the base insulating film 120 to supply oxygen much easily to the oxide semiconductor layer 130 . in the case where a surface of the substrate 110 is made of an insulator and there is no influence of impurity diffusion to the oxide semiconductor layer 130 to be formed later, the base insulating film 120 is not necessarily provided. next, a first oxide semiconductor film 331 to be the first oxide semiconductor layer 131 and a second oxide semiconductor film 332 to be the second oxide semiconductor layer 132 are deposited over the base insulating film 120 by a sputtering method, a cvd method, an mbe method, an atomic layer deposition (ald) method, or a pld method. the first oxide semiconductor film 331 and the second oxide semiconductor film 332 are preferably stacked successively without exposure to the air with the use of a multi-chamber deposition apparatus (e.g., a sputtering apparatus) including a load lock chamber. it is preferable that each chamber of the sputtering apparatus be able to be evacuated to a high vacuum (to about 5×10 −7 pa to 1×10 −4 pa) by an adsorption vacuum pump such as a cryopump and that the chamber be able to heat a substrate over which a film is to be deposited to 100° c. or higher, preferably 500° c. or higher, so that water and the like acting as impurities of an oxide semiconductor are removed as much as possible. alternatively, a combination of a turbo molecular pump and a cold trap is preferably used to prevent back-flow of a gas containing a carbon component, moisture, or the like from an exhaust system into the chamber. not only high vacuum evacuation of the chamber but also high purity of a sputtering gas is necessary to obtain a highly purified intrinsic oxide semiconductor. an oxygen gas or an argon gas used as the sputtering gas is highly purified to have a dew point of −40° c. or lower, preferably −80° c. or lower, further preferably −100° c. or lower, so that entry of moisture and the like into the oxide semiconductor layer can be prevented as much as possible. for the first oxide semiconductor film 331 , the second oxide semiconductor film 332 , and a third oxide semiconductor film 333 to be the third oxide semiconductor layer 133 formed in a later step, any of the materials described in embodiment 1 can be used. for example, an in—ga—zn oxide whose atomic ratio of in to ga and zn is 1:3:6, 1:3:4, 1:3:3, or 1:3:2 can be used for the first oxide semiconductor film 331 , an in—ga—zn oxide whose atomic ratio of in to ga and zn is 1:1:1, 5:5:6, or 3:1:2 can be used for the second oxide semiconductor film 332 , and an in—ga—zn oxide whose atomic ratio of in to ga and zn is 1:3:6, 1:3:4, 1:3:3, or 1:3:2 can be used for the third oxide semiconductor film 333 . an oxide semiconductor that can be used for each of the first oxide semiconductor film 331 , the second oxide semiconductor film 332 , and the third oxide semiconductor film 333 preferably contains at least indium (in) or zinc (zn). alternatively, the oxide semiconductor preferably contains both in and zn. in order to reduce variation in the electrical characteristics of the transistor including the oxide semiconductor, the oxide semiconductor preferably contains a stabilizer in addition to in and/or zn. examples of a stabilizer include gallium (ga), tin (sn), hafnium (hf), aluminum (al), and zirconium (zr). other examples of a stabilizer include lanthanoid such as lanthanum (la), cerium (ce), praseodymium (pr), neodymium (nd), samarium (sin), europium (eu), gadolinium (gd), terbium (tb), dysprosium (dy), holmium (ho), erbium (er), thulium (tm), ytterbium (yb), and lutetium (lu). as the oxide semiconductor, for example, any of the following can be used: indium oxide, tin oxide, zinc oxide, an in—zn oxide, a sn—zn oxide, an al—zn oxide, a zn—mg oxide, a sn—mg oxide, an in—mg oxide, an in—ga oxide, an in—ga—zn oxide, an in—al—zn oxide, an in—sn—zn oxide, a sn—ga—zn oxide, an al—ga—zn oxide, a sn—al—zn oxide, an in—hf—zn oxide, an in—la—zn oxide, an in—ce—zn oxide, an in—pr—zn oxide, an in—nd—zn oxide, an in—sm—zn oxide, an in—eu—zn oxide, an in—gd—zn oxide, an in—tb—zn oxide, an in—dy—zn oxide, an in—ho—zn oxide, an in—er—zn oxide, an in—tm—zn oxide, an in—yb—zn oxide, an in—lu—zn oxide, an in—sn—ga—zn oxide, an in—hf—ga—zn oxide, an in—al—ga—zn oxide, an in—sn—al—zn oxide, an in—sn—hf—zn oxide, and an in—hf—al—zn oxide. note that here, for example, an “in—ga—zn oxide” means an oxide containing in, ga, and zn as its main components. the in—ga—zn oxide may contain a metal element other than in, ga, and zn. further, in this specification, a film formed using an in—ga—zn oxide is also referred to as an igzo film. alternatively, a material represented by inmo 3 (zno) m (m>0, where m is not an integer) may be used. note that m represents one or more metal elements selected from ga, y, zr, la, ce, and nd. further alternatively, a material represented by in 2 sno 5 (zno) n (n>0, where n is an integer) may be used. note that as described in embodiment 1 in detail, the second oxide semiconductor layer 132 is formed so as to have an electron affinity higher than that of the first oxide semiconductor layer 131 and that of the third oxide semiconductor layer 133 . the oxide semiconductor layers are each preferably formed by a sputtering method. as a sputtering method, an rf sputtering method, a dc sputtering method, an ac sputtering method, or the like can be used. in the case of using an in—ga—zn oxide, a material whose atomic ratio of in to ga and zn is any of 1:1:1, 2:2:1, 2:2:3, 3:1:2, 5:5:6, 1:3:2, 1:3:3, 1:3:4, 1:3:6, 1:4:3, 1:5:4, 1:6:6, 1:6:4, 1:9:6, 1:1:4, and 1:1:2 can be used for the first oxide semiconductor film 331 , the second oxide semiconductor film 332 , and/or the third oxide semiconductor film 333 . note that for example, in the case where the composition of an oxide containing in, ga, and zn at the atomic ratio, in:ga:zn=a:b:c (a+b+c=1), is in the neighborhood of the composition of an oxide containing in, ga, and zn at the atomic ratio, in:ga:zn=a:b:c (a+b+c=1), a, b, and c satisfy the following relation: (a−a) 2 +(b−b) 2 +(c−c) 2 ≦r 2 , and r may be 0.05, for example. the same applies to other oxides. the indium content of the second oxide semiconductor film 332 is preferably higher than the indium content of the first oxide semiconductor film 331 and the indium content of the third oxide semiconductor film 333 . in an oxide semiconductor, the s orbital of heavy metal mainly contributes to carrier transfer, and when the proportion of in in the oxide semiconductor is increased, overlap of the s orbitals is likely to be increased. thus, an oxide having a composition in which the proportion of in is higher than that of ga has higher mobility than an oxide having a composition in which the proportion of in is equal to or lower than that of ga. for this reason, with the use of an oxide having a high indium content for the second oxide semiconductor film 332 , a transistor having high mobility can be achieved. a structure of an oxide semiconductor film is described below. note that in this specification, a term “parallel” indicates that the angle formed between two straight lines is greater than or equal to −10° and less than or equal to 10°, and accordingly also includes the case where the angle is greater than or equal to −5° and less than or equal to 5°. in addition, a term “perpendicular” indicates that the angle formed between two straight lines is greater than or equal to 80° and less than or equal to 100°, and accordingly includes the case where the angle is greater than or equal to 85° and less than or equal to 95°. in this specification, the trigonal and rhombohedral crystal systems are included in the hexagonal crystal system. an oxide semiconductor film is classified roughly into a single-crystal oxide semiconductor film and a non-single-crystal oxide semiconductor film. the non-single-crystal oxide semiconductor film includes any of a c-axis aligned crystalline oxide semiconductor (caac-os) film, a polycrystalline oxide semiconductor film, a microcrystalline oxide semiconductor film, an amorphous oxide semiconductor film, and the like. first, a caac-os film is described. the caac-os film is one of oxide semiconductor films including a plurality of crystal parts, and most of the crystal parts each fit inside a cube whose one side is less than 100 nm. thus, there is a case where a crystal part included in the caac-os film fits inside a cube whose one side is less than 10 nm, less than 5 nm, or less than 3 nm. in a transmission electron microscope (tem) image of the caac-os film, a boundary between crystal parts, that is, a grain boundary is not clearly observed. thus, in the caac-os film, a reduction in electron mobility due to the grain boundary is less likely to occur. according to the tem image of the caac-os film observed in a direction substantially parallel to a sample surface (cross-sectional tem image), metal atoms are arranged in a layered manner in the crystal parts. each metal atom layer has a morphology reflected by a surface over which the caac-os film is formed (hereinafter, a surface over which the caac-os film is formed is referred to as a formation surface) or a top surface of the caac-os film, and is arranged in parallel to the formation surface or the top surface of the caac-os film. on the other hand, according to the tem image of the caac-os film observed in a direction substantially perpendicular to the sample surface (plan tem image), metal atoms are arranged in a triangular or hexagonal configuration in the crystal parts. however, there is no regularity of arrangement of metal atoms between different crystal parts. from the results of the cross-sectional tem image and the plan tem image, alignment is found in the crystal parts in the caac-os film. a caac-os film is subjected to structural analysis with an x-ray diffraction (xrd) apparatus. for example, when the caac-os film including an ingazno 4 crystal is analyzed by an out-of-plane method, a peak appears frequently when the diffraction angle (2θ) is around 31°. this peak is derived from the (009) plane of the ingazno 4 crystal, which indicates that crystals in the caac-os film have c-axis alignment, and that the c-axes are aligned in a direction substantially perpendicular to the formation surface or the top surface of the caac-os film. on the other hand, when the caac-os film is analyzed by an in-plane method in which an x-ray enters a sample in a direction substantially perpendicular to the c-axis, a peak appears frequently when 2θ is around 56°. this peak is derived from the (110) plane of the ingazno 4 crystal. here, analysis (φ scan) is performed under conditions where the sample is rotated around a normal vector of a sample surface as an axis (φ axis) with 20 fixed at around 56°. in the case where the sample is a single-crystal oxide semiconductor film of ingazno 4 , six peaks appear. the six peaks are derived from crystal planes equivalent to the (110) plane. on the other hand, in the case of a caac-os film, a peak is not clearly observed even when φ scan is performed with 2θ fixed at around 56°. according to the above results, in the caac-os film having c-axis alignment, while the directions of a-axes and b-axes are different between crystal parts, the c-axes are aligned in a direction parallel to a normal vector of a formation surface or a normal vector of a top surface. thus, each metal atom layer arranged in a layered manner observed in the cross-sectional tem image corresponds to a plane parallel to the a-b plane of the crystal. note that the crystal part is formed concurrently with deposition of the caac-os film or is formed through crystallization treatment such as heat treatment. as described above, the c-axes of the crystal are aligned in a direction parallel to a normal vector of a formation surface or a normal vector of a top surface. thus, for example, in the case where a shape of the caac-os film is changed by etching or the like, the c-axis might not be necessarily parallel to a normal vector of a formation surface or a normal vector of a top surface of the caac-os film. further, the degree of crystallinity in the caac-os film is not necessarily uniform. for example, in the case where crystal growth leading to the caac-os film occurs from the vicinity of the top surface of the film, the degree of the crystallinity in the vicinity of the top surface is higher than that in the vicinity of the formation surface in some cases. further, when an impurity is added to the caac-os film, the crystallinity in a region to which the impurity is added is changed, and the degree of crystallinity in the caac-os film varies depending on regions. note that when the caac-os film with an ingazno 4 crystal is analyzed by an out-of-plane method, a peak of 2θ may also be observed at around 36°, in addition to the peak of 2θ at around 31°. the peak of 2θ at around 36° indicates that a crystal having no c-axis alignment is included in part of the caac-os film. it is preferable that in the caac-os film, a peak of 2θ appear at around 31° and a peak of 2θ do not appear at around 36°. the caac-os film is an oxide semiconductor film having low impurity concentration. the impurity is an element other than the main components of the oxide semiconductor film, such as hydrogen, carbon, silicon, or a transition metal element. in particular, an element that has higher bonding strength to oxygen than a metal element included in the oxide semiconductor film, such as silicon, disturbs the atomic arrangement of the oxide semiconductor film by depriving the oxide semiconductor film of oxygen and causes a reduction in crystallinity. further, a heavy metal such as iron or nickel, argon, carbon dioxide, or the like has a large atomic radius (or molecular radius), and thus disturbs the atomic arrangement of the oxide semiconductor film and causes a reduction in crystallinity when it is contained in the oxide semiconductor film. note that the impurity contained in the oxide semiconductor film might serve as a carrier trap or a carrier generation source. further, the caac-os film is an oxide semiconductor film having a low density of defect states. for example, an oxygen vacancy in the oxide semiconductor film serves as a carrier trap or a carrier generation source in some cases when hydrogen is captured therein. the state in which the impurity concentration is low and the density of defect states is low (the number of oxygen vacancies is small) is referred to as a highly purified intrinsic state or a substantially highly purified intrinsic state. a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has few carrier generation sources, and thus can have a low carrier density. thus, a transistor including the oxide semiconductor film rarely has negative threshold voltage (is rarely normally on). the highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has few carrier traps. accordingly, the transistor including the oxide semiconductor film has small variation in electrical characteristics and high reliability. electric charge trapped by the carrier traps in the oxide semiconductor film takes a long time to be released, and might behave like fixed electric charge. thus, the transistor that includes the oxide semiconductor film having high impurity concentration and a high density of defect states has unstable electrical characteristics in some cases. with the use of the caac-os film in a transistor, variation in the electrical characteristics of the transistor due to irradiation with visible light or ultraviolet light is small. next, a microcrystalline oxide semiconductor film is described. in an image obtained with a tem, crystal parts cannot be found clearly in the microcrystalline oxide semiconductor in some cases. in most cases, the size of a crystal part in the microcrystalline oxide semiconductor film is greater than or equal to 1 nm and less than or equal to 100 nm, or greater than or equal to 1 nm and less than or equal to 10 nm. an oxide semiconductor film including nanocrystal (nc), which is a microcrystal with a size greater than or equal to 1 nm and less than or equal to 10 nm, or a size greater than or equal to 1 nm and less than or equal to 3 nm, is specifically referred to as a nanocrystalline oxide semiconductor (nc-os) film. in an image of the nc-os film obtained with a tem, for example, a crystal grain cannot be observed clearly in some cases. in the nc-os film, a microscopic region (e.g., a region with a size greater than or equal to 1 nm and less than or equal to 10 nm, in particular, a region with a size greater than or equal to 1 nm and less than or equal to 3 nm) has a periodic atomic order. further, there is no regularity of crystal orientation between different crystal parts in the nc-os film; thus, the orientation in the whole film is not observed. accordingly, in some cases, the nc-os film cannot be distinguished from an amorphous oxide semiconductor film depending on an analysis method. for example, when the nc-os film is subjected to structural analysis by an out-of-plane method with an xrd apparatus using an x-ray having a diameter larger than that of a crystal part, a peak which shows a crystal plane does not appear. further, a halo pattern is observed in an electron diffraction pattern (also referred to as a selected-area electron diffraction pattern) of the nc-os film obtained by using an electron beam having a probe diameter (e.g., larger than or equal to 50 nm) larger than the diameter of a crystal part. meanwhile, spots are observed in a nanobeam electron diffraction pattern of the nc-os film obtained by using an electron beam having a probe diameter (e.g., larger than or equal to 1 nm and smaller than or equal to 30 nm) close to, or smaller than or equal to the diameter of a crystal part. in some cases, in a nanobeam electron diffraction pattern of the nc-os film, regions with high luminance in a circular (ring) pattern are observed. further, in a nanobeam electron diffraction pattern of the nc-os film, a plurality of spots are shown in a ring-like region in some cases. since an nc-os film is an oxide semiconductor film having more regularity than an amorphous oxide semiconductor film, the nc-os film has a lower density of defect states than the amorphous oxide semiconductor film. however, there is no regularity of crystal orientation between different crystal parts in the nc-os film; hence, the nc-os film has a higher density of defect states than a caac-os film. note that an oxide semiconductor film may be a stacked film including two or more films of an amorphous oxide semiconductor film, a microcrystalline oxide semiconductor film, and a caac-os film, for example. a caac-os film can be deposited by a sputtering method with a polycrystalline oxide semiconductor sputtering target, for example. when ions collide with the sputtering target, a crystal region included in the sputtering target may be separated from the target along the a-b plane; in other words, a sputtered particle having a plane parallel to the a-b plane (a flat-plate-like sputtered particle or a pellet-like sputtered particle) might flake off from the target. in this case, the flat-plate-like or pellet-like sputtered particle is electrically charged and thus reaches a substrate while maintaining its crystal state without being aggregated in plasma, whereby a caac-os film can be formed. in the case where the second oxide semiconductor film 332 is formed using an in-m-zn oxide (m is ga, y, zr, la, ce, or nd) and a sputtering target whose atomic ratio of in to m and zn is a 1 :b 1 :c 1 is used for forming the second oxide semiconductor film 332 , a 1 /b 1 is preferably greater than or equal to ⅓ and less than or equal to 6, further preferably greater than or equal to 1 and less than or equal to 6, and c 1 /b 1 is preferably greater than or equal to ⅓ and less than or equal to 6, further preferably greater than or equal to 1 and less than or equal to 6. note that when c 1 /b 1 is greater than or equal to 1 and less than or equal to 6, a caac-os film is easily formed as the second oxide semiconductor film 332 . typical examples of the atomic ratio of in to m and zn of the target are 1:1:1, 3:1:2, and 5:5:6. in the case where the first oxide semiconductor film 331 and the third oxide semiconductor film 333 are each formed using an in-m-zn oxide (m is ga, y, zr, la, ce, or nd) and a sputtering target whose atomic ratio of in to m and zn is a 2 :b 2 :c 2 is used for forming the first oxide semiconductor film 331 and the third oxide semiconductor film 333 , a 2 /b 2 is preferably less than a 1 /b 1 , and c 2 /b 2 is preferably greater than or equal to ⅓ and less than or equal to 6, further preferably greater than or equal to 1 and less than or equal to 6. note that when c 2 /b 2 is greater than or equal to 1 and less than or equal to 6, caac-os films are easily formed as the first oxide semiconductor film 331 and the third oxide semiconductor film 333 . typical examples of the atomic ratio of in to m and zn of the target are 1:3:2, 1:3:3, 1:3:4, and 1:3:6. first heat treatment may be performed after the second oxide semiconductor film 332 is formed. the first heat treatment may be performed at a temperature higher than or equal to 250° c. and lower than or equal to 650° c., preferably higher than or equal to 300° c. and lower than or equal to 500° c., in an inert gas atmosphere, in an atmosphere containing an oxidizing gas at 10 ppm or more, or under reduced pressure. alternatively, the first heat treatment may be performed in such a manner that heat treatment is performed in an inert gas atmosphere, and then another heat treatment is performed in an atmosphere containing an oxidizing gas at 10 ppm or more in order to compensate desorbed oxygen. by the first heat treatment, the crystallinity of the second oxide semiconductor film 332 can be improved, and in addition, impurities such as hydrogen and water can be removed from the base insulating film 120 and the first oxide semiconductor film 331 . note that the first heat treatment may be performed after etching for formation of the first oxide semiconductor layer 131 and the second oxide semiconductor layer 132 which is described later. next, a first conductive film 340 is formed over the second oxide semiconductor film 332 . for the first conductive film 340 , al, cr, cu, ta, ti, mo, w, or an alloy material containing any of these as its main component can be used. for example, a tungsten film with a thickness of 5 nm to 25 nm is formed by a sputtering method, a cvd method, or the like. next, a first resist mask 400 is formed over the first conductive film 340 (see fig. 8a ). it is preferable that the first resist mask 400 be formed by a photolithography process using electron beam exposure, liquid immersion exposure, or euv exposure, for example. with such a process, the first resist mask 400 having an extremely minute shape can be formed. next, the first conductive film 340 is selectively etched using the first resist mask 400 as a mask, so that a first conductive layer 341 having an upper surface shape similar to an upper surface shape of the first resist mask 400 is formed. here, the first conductive layer 341 is used as a hard mask. in an etching step, the shape of a resist mask is changed because of change in quality and reduction in thickness. thus, when the second oxide semiconductor layer 132 and the first oxide semiconductor layer 131 are formed using only a resist mask, the second oxide semiconductor layer 132 and the first oxide semiconductor layer 131 reflect the changed shape of the resist mask and thus cannot have a desired shape. when the first conductive layer 341 is used as a hard mask, the second oxide semiconductor layer 132 and the first oxide semiconductor layer 131 can be formed to have a desired shape. the second oxide semiconductor film 332 and the first oxide semiconductor film 331 are selectively etched, so that the second oxide semiconductor layer 132 and the first oxide semiconductor layer 131 are formed (see fig. 8b ). note that the base insulating film 120 may be partly etched by over-etching the first oxide semiconductor film 331 . next, a second resist mask is formed over the first conductive layer 341 by a method similar to that of the first resist mask 400 . then, the first conductive layer 341 is selectively etched using the second resist mask as a mask, so that the source electrode layer 140 and the drain electrode layer 150 are formed (see fig. 8c ). note that the first conductive layer 341 may be over-etched so that the second oxide semiconductor layer 132 is partly etched. subsequently, the third oxide semiconductor film 333 to be the third oxide semiconductor layer 133 is formed over the first oxide semiconductor layer 131 , the second oxide semiconductor layer 132 , the source electrode layer 140 , and the drain electrode layer 150 . note that second heat treatment may be performed after the third oxide semiconductor film 333 is formed. the second heat treatment can be performed under the conditions similar to those of the first heat treatment. the second heat treatment can remove impurities such as hydrogen and water from the third oxide semiconductor film 333 , the first oxide semiconductor layer 131 , and the second oxide semiconductor layer 132 . next, an insulating film 360 to be the gate insulating film 160 is formed over the third oxide semiconductor film 333 . the insulating film 360 can be formed using aluminum oxide, magnesium oxide, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide, tantalum oxide, or the like. the insulating film 360 may be a stack including any of the above materials. the insulating film 360 can be formed by a sputtering method, a cvd method, an mbe method, an ald method, a pld method, or the like. then, a second conductive film 370 to be the gate electrode layer 170 is formed over the insulating film 360 (see fig. 9a ). for the second conductive film 370 , al, ti, cr, co, ni, cu, y, zr, mo, ru, ag, ta, w, or an alloy material containing any of these as its main component can be used. the second conductive film 370 can be formed by a sputtering method, a cvd method, or the like. a stack including a conductive film containing any of the above materials and a conductive film containing nitrogen, or a conductive film containing nitrogen may be used for the second conductive film 370 . after that, a third resist mask is formed over the second conductive film 370 , and the second conductive film 370 is selectively etched using the third resist mask to form the gate electrode layer 170 . then, the insulating film 360 is selectively etched using the gate electrode layer 170 as a mask to form the gate insulating film 160 . subsequently, the third oxide semiconductor film 333 is etched using the gate electrode layer 170 or the gate insulating film 160 as a mask to form the third oxide semiconductor layer 133 (see fig. 9b ). the second conductive film 370 , the insulating film 360 , and the third oxide semiconductor film 333 may be etched individually or successively. further, either dry etching or wet etching may be used as the etching method, and an appropriate etching method may be selected individually. next, the insulating layer 180 and the insulating layer 185 are formed over the source electrode layer 140 , the drain electrode layer 150 , and the gate electrode layer 170 (see fig. 9c ). the insulating layer 180 and the insulating layer 185 can each be formed using a material and a method which are similar to those of the base insulating film 120 . in particular, aluminum oxide is preferably used for the insulating layer 180 . oxygen may be added to the insulating layer 180 and/or the insulating layer 185 by an ion implantation method, an ion doping method, a plasma immersion ion implantation method, or the like. adding oxygen enables the insulating layer 180 and/or the insulating layer 185 to supply oxygen much easily to the oxide semiconductor layer 130 . next, third heat treatment may be performed. the third heat treatment can be performed under conditions similar to those of the first heat treatment. by the third heat treatment, excess oxygen is easily released from the base insulating film 120 , the gate insulating film 160 , the insulating layer 180 , and the insulating layer 185 , so that oxygen vacancies in the oxide semiconductor layer 130 can be reduced. next, a fourth resist mask is formed over the insulating layer 185 , and the insulating layer 185 , the insulating layer 180 , the source electrode layer 140 , the drain electrode layer 150 , the second oxide semiconductor layer 132 , and the first oxide semiconductor layer 131 are selectively etched using the fourth resist mask, so that the first opening 147 and the second opening 157 are formed (see fig. 10a ). at this time, the third opening 177 illustrated in fig. 2a is also formed. note that the insulating layer 185 , the insulating layer 180 , the source electrode layer 140 , the drain electrode layer 150 , the second oxide semiconductor layer 132 , and the first oxide semiconductor layer 131 may be etched individually or successively. further, either dry etching or wet etching may be used as the etching method, and an appropriate etching method may be selected individually. by controlling etching conditions at this time, transistors having different structures illustrated in figs. 3a to 3c can be formed. after that, the first wiring 145 and the second wiring 155 are formed to cover the first opening 147 and the second opening 157 . the second oxide semiconductor layer 132 and the source electrode layer 140 are electrically connected to the first wiring 145 , and the second oxide semiconductor layer 132 and the drain electrode layer 150 are electrically connected to the second wiring 155 (see fig. 10b ). further, at this time, the third wiring 175 is formed to cover the third opening 177 illustrated in fig. 2a and is electrically connected to the gate electrode layer 170 . note that the first wiring 145 , the second wiring 155 , and the third wiring 175 can be formed using a material and a method similar to those of the source electrode layer 140 , the drain electrode layer 150 , or the gate electrode layer 170 . through the above process, the transistor 100 illustrated in figs. 1a and 1b can be fabricated. a variety of films such as the metal film described in this embodiment can be formed typically by a sputtering method or a plasma cvd method; however, these films may be formed by another method such as a thermal cvd method. a metal organic chemical vapor deposition (mocvd) method and an ald method are given as examples of a thermal cvd method. a thermal cvd method has an advantage that no defect due to plasma damage is generated since it does not utilize plasma for forming a film. deposition by a thermal cvd method may be performed in such a manner that a source gas and an oxidizer are supplied to the chamber at a time, the pressure in a chamber is set to an atmospheric pressure or a reduced pressure, and reaction is caused in the vicinity of the substrate or over the substrate. deposition by an ald method may be performed in such a manner that the pressure in a chamber is set to an atmospheric pressure or a reduced pressure, source gases for reaction are sequentially introduced into the chamber, and then the sequence of the gas introduction is repeated. for example, two or more kinds of source gases are sequentially supplied to the chamber by switching respective switching valves (also referred to as high-speed valves). in such a case, a first source gas is introduced, an inert gas (e.g., argon or nitrogen) or the like is introduced at the same time as or after the introduction of the first source gas, and then a second source gas is introduced, whereby the source gases are not mixed. note that in the case where the first source gas and the inert gas are introduced at a time, the inert gas serves as a carrier gas, and the inert gas may also be introduced at the same time as the introduction of the second source gas. instead of the introduction of the inert gas, the first source gas may be exhausted by vacuum evacuation, and then the second source gas may be introduced. the first source gas is adsorbed on the surface of the substrate to form a first layer and then, the second source gas is introduced to react with the first layer; as a result, a second layer is stacked over the first layer, so that a thin film is formed. the sequence of the gas introduction is repeated plural times until a desired thickness is obtained, whereby a thin film with excellent step coverage can be formed. the thickness of the thin film can be adjusted by the number of repetition times of the sequence of the gas introduction; therefore, an ald method makes it possible to accurately adjust a thickness and thus is suitable for manufacturing a minute fet. in the case where a tungsten film is formed using a deposition apparatus employing ald, for example, a wf 6 gas and a b 2 h 6 gas are sequentially introduced plural times to form an initial tungsten film, and then a wf 6 gas and an h 2 gas are introduced at a time, so that the tungsten film is formed. note that an sih 4 gas may be used instead of a b 2 h 6 gas. this embodiment can be combined as appropriate with any of the other embodiments and an example in this specification. embodiment 3 in this embodiment, an example of a semiconductor device (storage device) which includes the transistor of one embodiment of the present invention, which can retain stored data even when not powered, and which has an unlimited number of write cycles is described with reference to drawings. fig. 11a is a cross-sectional view of the semiconductor device, and fig. 11b is a circuit diagram of the semiconductor device. the semiconductor device illustrated in figs. 11a and 11b includes a transistor 3200 including a first semiconductor material in a lower portion, and a transistor 3300 including a second semiconductor material and a capacitor 3400 in an upper portion. note that the transistor 100 described in embodiment 1 can be used as the transistor 3300 . one electrode of the capacitor 3400 is formed using the same material as a wiring layer electrically connected to a source electrode layer or a drain electrode layer of the transistor 3300 , the other electrode of the capacitor 3400 is formed using the same material as a gate electrode layer of the transistor 3300 , and a dielectric of the capacitor 3400 is formed using the same material as the insulating layer 180 and the insulating layer 185 of the transistor 3300 ; thus, the capacitor 3400 can be formed at the same time as the transistor 3300 . here, the first semiconductor material and the second semiconductor material preferably have different energy gaps. for example, the first semiconductor material may be a semiconductor material (such as silicon) other than an oxide semiconductor, and the second semiconductor material may be the oxide semiconductor described in embodiment 1. a transistor including a material other than an oxide semiconductor can operate at high speed easily. on the other hand, a transistor including an oxide semiconductor enables charge to be retained for a long time owing to its electrical characteristics, that is, the low off-state current. although both of the above transistors are n-channel transistors in the following description, it is needless to say that p-channel transistors can be used. the specific structure of the semiconductor device, such as a material used for the semiconductor device and the structure of the semiconductor device, needs not to be limited to that described here except for the use of the transistor described in embodiment 1, which is formed using an oxide semiconductor for retaining data. the transistor 3200 in fig. 11a includes a channel formation region provided in a substrate 3000 containing a semiconductor material (such as crystalline silicon), impurity regions provided such that the channel formation region is provided therebetween, intermetallic compound regions in contact with the impurity regions, a gate insulating film provided over the channel formation region, and a gate electrode layer provided over the gate insulating film. note that a transistor whose source electrode layer and drain electrode layer are not illustrated in a drawing may also be referred to as a transistor for the sake of convenience. further, in such a case, in description of a connection of a transistor, a source region and a source electrode layer may be collectively referred to as a source electrode layer, and a drain region and a drain electrode layer may be collectively referred to as a drain electrode layer. that is, in this specification, the term “source electrode layer” might include a source region. an element isolation insulating layer 3100 is formed on the substrate 3000 so as to surround the transistor 3200 , and an insulating layer 3150 is formed so as to cover the transistor 3200 . note that the element isolation insulating layer 3100 can be formed by an element isolation technique such as local oxidation of silicon (locos) or shallow trench isolation (sti). in the case where the transistor 3200 is formed using a crystalline silicon substrate, for example, the transistor 3200 can operate at high speed. thus, when the transistor is used as a reading transistor, data can be read at high speed. the transistor 3300 is provided over the insulating layer 3150 , and the wiring layer electrically connected to the source electrode layer or the drain electrode layer of the transistor 3300 serves as the one electrode of the capacitor 3400 . further, the one electrode of the capacitor 3400 is electrically connected to the gate electrode layer of the transistor 3200 . the transistor 3300 in fig. 11a is a top-gate transistor in which a channel is formed in an oxide semiconductor layer. since the off-state current of the transistor 3300 is low, stored data can be retained for a long period owing to such a transistor. in other words, refresh operation becomes unnecessary or the frequency of the refresh operation in a semiconductor storage device can be extremely low, which leads to a sufficient reduction in power consumption. further, an electrode 3250 is provided so as to overlap with the transistor 3300 with the insulating layer 3150 provided therebetween. by supplying an appropriate potential to the electrode 3250 to be used as a second gate electrode, the threshold voltage of the transistor 3300 can be controlled. in addition, long-term reliability of the transistor 3300 can be improved. when the electrode operates with the same potential as that of the gate electrode of the transistor 3300 , on-state current can be increased. note that the electrode 3250 is not necessarily provided. the transistor 3300 and the capacitor 3400 can be formed over the substrate over which the transistor 3200 is formed as illustrated in fig. 11a , which enables the degree of the integration of the semiconductor device to be increased. an example of a circuit configuration of the semiconductor device in fig. 11a is illustrated in fig. 11b . in fig. 11b , a first wiring 3001 is electrically connected to a source electrode layer of the transistor 3200 . a second wiring 3002 is electrically connected to a drain electrode layer of the transistor 3200 . a third wiring 3003 is electrically connected to one of the source electrode layer and the drain electrode layer of the transistor 3300 . a fourth wiring 3004 is electrically connected to the gate electrode layer of the transistor 3300 . the gate electrode layer of the transistor 3200 and the other of the source electrode layer and the drain electrode layer of the transistor 3300 are electrically connected to the one electrode of the capacitor 3400 . a fifth wiring 3005 is electrically connected to the other electrode of the capacitor 3400 . note that a component corresponding to the electrode 3250 is not illustrated. the semiconductor device in fig. 11b utilizes a feature that the potential of the gate electrode layer of the transistor 3200 can be retained, and thus enables writing, retaining, and reading of data as follows. writing and retaining of data are described. first, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned on, so that the transistor 3300 is turned on. accordingly, the potential of the third wiring 3003 is supplied to the gate electrode layer of the transistor 3200 and the capacitor 3400 . that is, a predetermined charge is supplied to the gate electrode layer of the transistor 3200 (writing). here, one of two kinds of charges providing different potential levels (hereinafter referred to as a low-level charge and a high-level charge) is supplied. after that, the potential of the fourth wiring 3004 is set to a potential at which the transistor 3300 is turned off, so that the transistor 3300 is turned off. thus, the charge supplied to the gate electrode layer of the transistor 3200 is retained (retaining). since the off-state current of the transistor 3300 is extremely low, the charge of the gate electrode layer of the transistor 3200 is retained for a long time. next, reading of data is described. an appropriate potential (a reading potential) is supplied to the fifth wiring 3005 while a predetermined potential (a constant potential) is supplied to the first wiring 3001 , whereby the potential of the second wiring 3002 varies depending on the amount of charge retained in the gate electrode layer of the transistor 3200 . this is because in general, in the case of using an n-channel transistor as the transistor 3200 , an apparent threshold voltage v th — h at the time when the high-level charge is given to the gate electrode layer of the transistor 3200 is lower than an apparent threshold voltage v th — l at the time when the low-level charge is given to the gate electrode layer of the transistor 3200 . here, an apparent threshold voltage refers to the potential of the fifth wiring 3005 which is needed to turn on the transistor 3200 . thus, the potential of the fifth wiring 3005 is set to a potential v 0 which is between v th — h and v th — l , whereby charge supplied to the gate electrode layer of the transistor 3200 can be determined. for example, in the case where the high-level charge is supplied in writing and the potential of the fifth wiring 3005 is v 0 (>v th — h ), the transistor 3200 is turned on. in the case where the low-level charge is supplied in writing, even when the potential of the fifth wiring 3005 is v 0 (<v th — 1 ), the transistor 3200 remains off. thus, the data retained in the gate electrode layer can be read by determining the potential of the second wiring 3002 . note that in the case where memory cells are arrayed, it is necessary that only data of a desired memory cell be able to be read. the fifth wiring 3005 in the case where data is not read may be supplied with a potential at which the transistor 3200 is turned off regardless of the state of the gate electrode layer, that is, a potential lower than v th — h . alternatively, the fifth wiring 3005 may be supplied with a potential at which the transistor 3200 is turned on regardless of the state of the gate electrode layer, that is, a potential higher than v th — l . when including a transistor having a channel formation region formed using an oxide semiconductor and having an extremely low off-state current, the semiconductor device described in this embodiment can retain stored data for an extremely long time. in other words, refresh operation becomes unnecessary or the frequency of the refresh operation can be extremely low, which leads to a sufficient reduction in power consumption. moreover, stored data can be retained for a long time even when power is not supplied (note that a potential is preferably fixed). further, in the semiconductor device described in this embodiment, high voltage is not needed for writing data and there is no problem of deterioration of elements. unlike in a conventional nonvolatile memory, for example, it is not necessary to inject and extract electrons into and from a floating gate; thus, a problem such as deterioration of a gate insulating film is unlikely to be caused. that is, the semiconductor device of the disclosed invention does not have a limit on the number of times data can be rewritten, which is a problem of a conventional nonvolatile memory, and the reliability thereof is drastically improved. furthermore, data is written depending on the state of the transistor (on or off), whereby high-speed operation can be easily achieved. as described above, a miniaturized and highly-integrated semiconductor device having high electrical characteristics can be provided. this embodiment can be combined as appropriate with any of the other embodiments and an example in this specification. embodiment 4 in this embodiment, a semiconductor device including the transistor of one embodiment of the present invention, which can retain stored data even when not powered, which does not have a limit on the number of write cycles, and which has a structure different from that described in embodiment 3, is described. fig. 12 illustrates an example of a circuit configuration of the semiconductor device. in the semiconductor device, a first wiring 4500 is electrically connected to a source electrode layer of a transistor 4300 , a second wiring 4600 is electrically connected to a gate electrode layer of the transistor 4300 , and a drain electrode layer of the transistor 4300 is electrically connected to a first terminal of a capacitor 4400 . note that the transistor 100 described in embodiment 1 can be used as the transistor 4300 included in the semiconductor device. the first wiring 4500 can serve as a bit line and the second wiring 4600 can serve as a word line. the semiconductor device (a memory cell 4250 ) can have a connection mode similar to that of the transistor 3300 and the capacitor 3400 illustrated in figs. 11a and 11b . thus, the capacitor 4400 can be formed through the same process and at the same time as the transistor 4300 in a manner similar to that of the capacitor 3400 described in embodiment 3. next, writing and retaining of data in the semiconductor device (the memory cell 4250 ) illustrated in fig. 12 are described. first, a potential at which the transistor 4300 is turned on is supplied to the second wiring 4600 , so that the transistor 4300 is turned on. accordingly, the potential of the first wiring 4500 is supplied to the first terminal of the capacitor 4400 (writing). after that, the potential of the second wiring 4600 is set to a potential at which the transistor 4300 is turned off, so that the transistor 4300 is turned off. thus, the potential of the first terminal of the capacitor 4400 is retained (retaining). the transistor 4300 including an oxide semiconductor has an extremely low off-state current. for that reason, the potential of the first terminal of the capacitor 4400 (or a charge accumulated in the capacitor 4400 ) can be retained for an extremely long time by turning off the transistor 4300 . next, reading of data is described. when the transistor 4300 is turned on, the first wiring 4500 which is in a floating state and the capacitor 4400 are electrically connected to each other, and the charge is redistributed between the first wiring 4500 and the capacitor 4400 . as a result, the potential of the first wiring 4500 is changed. the amount of change in potential of the first wiring 4500 varies depending on the potential of the first terminal of the capacitor 4400 (or the charge accumulated in the capacitor 4400 ). for example, the potential of the first wiring 4500 after the charge redistribution is (c b ×v b0 +c×v)/(c b +c), where v is the potential of the first terminal of the capacitor 4400 , c is the capacitance of the capacitor 4400 , c b is the capacitance component of the first wiring 4500 , and v bo is the potential of the first wiring 4500 before the charge redistribution. thus, it can be found that, assuming that the memory cell 4250 is in either of two states in which the potential of the first terminal of the capacitor 4400 is v 1 and v 0 (v 1 >v 0 ), the potential of the first wiring 4500 in the case of retaining the potential v 1 (=(c b ×v b0 +c×v 1 )/(c b +c)) is higher than the potential of the first wiring 4500 in the case of retaining the potential v 0 (=(c b ×v b0 +c×v 0 )/(c b +c)). then, by comparing the potential of the first wiring 4500 with a predetermined potential, data can be read. as described above, the semiconductor device (the memory cell 4250 ) illustrated in fig. 12 can retain charge that is accumulated in the capacitor 4400 for a long time because the off-state current of the transistor 4300 is extremely low. in other words, refresh operation becomes unnecessary or the frequency of the refresh operation can be extremely low, which leads to a sufficient reduction in power consumption. moreover, stored data can be retained for a long time even when power is not supplied. a substrate over which a driver circuit for the memory cell 4250 is formed and the memory cell 4250 illustrated in fig. 12 are preferably stacked. when the memory cell 4250 and the driver circuit are stacked, the size of the semiconductor device can be reduced. note that there is no limitation on the numbers of the memory cells 4250 and the driver circuits which are stacked. it is preferable that a semiconductor material of a transistor included in the driver circuit be different from that of the transistor 4300 . for example, silicon, germanium, silicon germanium, silicon carbide, or gallium arsenide can be used, and a single crystal semiconductor is preferably used. a transistor formed using such a semiconductor material can operate at higher speed than a transistor formed using an oxide semiconductor and is suitable for the driver circuit for the memory cell 4250 . as described above, a miniaturized and highly-integrated semiconductor device having high electrical characteristics can be provided. this embodiment can be combined as appropriate with any of the other embodiments and an example in this specification. embodiment 5 the transistor described in embodiment 1 can be used in a semiconductor device such as a display device, a storage device, a cpu, a digital signal processor (dsp), an lsi such as a custom lsi or a programmable logic device (pld), or a radio frequency identification (rf-id). in this embodiment, electronic devices each including the semiconductor device will be described. examples of the electronic devices having the semiconductor devices include display devices of televisions, monitors, and the like, lighting devices, personal computers, word processors, image reproduction devices, portable audio players, radios, tape recorders, stereos, phones, cordless phones, mobile phones, car phones, transceivers, wireless devices, game machines, calculators, portable information terminals, electronic notebooks, e-book readers, electronic translators, audio input devices, video cameras, digital still cameras, electric shavers, ic chips, high-frequency heating appliances such as microwave ovens, electric rice cookers, electric washing machines, electric vacuum cleaners, air-conditioning systems such as air conditioners, dishwashers, dish dryers, clothes dryers, futon dryers, electric refrigerators, electric freezers, electric refrigerator-freezers, freezers for preserving dna, radiation counters, and medical equipment such as dialyzers and x-ray diagnostic equipment. in addition, the examples of the electronic devices include alarm devices such as smoke detectors, heat detectors, gas alarm devices, and security alarm devices. further, the examples of the electronic devices also include industrial equipment such as guide lights, traffic lights, belt conveyors, elevators, escalators, industrial robots, and power storage systems. in addition, moving objects and the like driven by fuel engines and electric motors using power from non-aqueous secondary batteries are also included in the category of electronic devices. examples of the moving objects include electric vehicles (ev), hybrid electric vehicles (rev) which include both an internal-combustion engine and a motor, plug-in hybrid electric vehicles (phev), tracked vehicles in which caterpillar tracks are substituted for wheels of these vehicles, motorized bicycles including motor-assisted bicycles, motorcycles, electric wheelchairs, golf carts, boats or ships, submarines, helicopters, aircrafts, rockets, artificial satellites, space probes, planetary probes, and spacecrafts. some specific examples of these electronic devices are illustrated in figs. 13a to 13c . in a television set 8000 illustrated in fig. 13a , a display portion 8002 is incorporated in a housing 8001 . the display portion 8002 can display an image and a speaker portion 8003 can output sound. a storage device including the transistor of one embodiment of the present invention can be used for a driver circuit for operating the display portion 8002 . the television set 8000 may also include a cpu 8004 for performing information communication or a memory. for the cpu 8004 and the memory, a cpu or a storage device including the transistor of one embodiment of the present invention can be used. an alarm device 8100 illustrated in fig. 13a is a residential fire alarm, which is an example of an electronic device including a sensor portion 8102 for smoke or heat and a microcomputer 8101 . note that the microcomputer 8101 includes a storage device or a cpu including the transistor of one embodiment of the present invention. an air conditioner which includes an indoor unit 8200 and an outdoor unit 8204 illustrated in fig. 13a is an example of an electronic device including the transistor, the storage device, the cpu, or the like described in any of the above embodiments. specifically, the indoor unit 8200 includes a housing 8201 , an air outlet 8202 , a cpu 8203 , and the like. although the cpu 8203 is provided in the indoor unit 8200 in fig. 13a , the cpu 8203 may be provided in the outdoor unit 8204 . alternatively, the cpu 8203 may be provided in both the indoor unit 8200 and the outdoor unit 8204 . by using any of the transistors of one embodiment of the present invention for the cpu in the air conditioner, a reduction in power consumption of the air conditioner can be achieved. an electric refrigerator-freezer 8300 illustrated in fig. 13a is an example of an electronic device including the transistor, the storage device, the cpu, or the like described in any of the above embodiments. specifically, the electric refrigerator-freezer 8300 includes a housing 8301 , a door for a refrigerator 8302 , a door for a freezer 8303 , a cpu 8304 , and the like. in fig. 13a , the cpu 8304 is provided in the housing 8301 . when the transistor of one embodiment of the present invention is used for the cpu 8304 of the electric refrigerator-freezer 8300 , a reduction in power consumption of the electric refrigerator-freezer 8300 can be achieved. figs. 13b and 13c illustrate an example of an electric vehicle which is an example of an electronic device. an electric vehicle 9700 is equipped with a secondary battery 9701 . the output of the electric power of the secondary battery 9701 is adjusted by a circuit 9702 and the electric power is supplied to a driving device 9703 . the circuit 9702 is controlled by a processing unit 9704 including a rom, a ram, a cpu, or the like which is not illustrated. when the transistor of one embodiment of the present invention is used for the cpu in the electric vehicle 9700 , a reduction in power consumption of the electric vehicle 9700 can be achieved. the driving device 9703 includes a dc motor or an ac motor either alone or in combination with an internal-combustion engine. the processing unit 9704 outputs a control signal to the circuit 9702 on the basis of input data such as data of operation (e.g., acceleration, deceleration, or stop) by a driver or data during driving (e.g., data on an upgrade or a downgrade, or data on a load on a driving wheel) of the electric vehicle 9700 . the circuit 9702 adjusts the electric energy supplied from the secondary battery 9701 in accordance with the control signal of the processing unit 9704 to control the output of the driving device 9703 . in the case where the ac motor is mounted, although not illustrated, an inverter which converts a direct current into an alternate current is also incorporated. this embodiment can be combined as appropriate with any of the other embodiments and an example in this specification. example in this example, the electrical characteristics of a transistor of one embodiment of the present invention are described. first, a method for manufacturing a transistor is described. the transistor in this example has the structure illustrated in figs. 15a and 15b . as a substrate, a glass substrate was used, and a silicon oxynitride film was formed over the glass substrate by a plasma cvd method. next, a first oxide semiconductor film with a thickness of approximately 10 nm and a second oxide semiconductor film with a thickness of approximately 40 nm were formed in this order over the silicon oxynitride film by a sputtering method. note that an igzo film having a composition ratio of in:ga:zn=1:3:2 and an igzo film having a composition ratio of in:ga:zn=1:1:1 or in:ga:zn=3:1:2 were used as the first oxide semiconductor film and the second oxide semiconductor film, respectively. next, a 15-nm-thick tungsten film and an organic resin were formed over the second oxide semiconductor film, a negative resist film was formed, exposure was performed on the resist film by scanning with an electron beam, and development treatment was performed, so that a first resist mask was formed. then, by using the first resist mask, the organic resin and the tungsten film were selectively etched. a dry etching apparatus using inductively coupled plasma (icp) was used for the etching. next, the first resist mask and the organic resin were removed by ashing. then, the first oxide semiconductor film and the second oxide semiconductor film were selectively etched using the tungsten film as a mask, so that a stack of a first oxide semiconductor layer, a second oxide semiconductor layer, and the tungsten film was formed. next, a second resist mask was fat lied over the tungsten film, and the tungsten film was selectively etched using the second resist mask, so that a source electrode layer and a drain electrode layer were formed. next, a 5-nm-thick third oxide semiconductor film was formed over the oxide semiconductor layers, the source electrode layer, and the drain electrode layer by a sputtering method. note that an igzo film having a composition ratio of in:ga:zn=1:3:2 was used as the third oxide semiconductor film. next, a 10-nm-thick silicon oxynitride film to be a gate insulating film was formed over the third oxide semiconductor film by a plasma cvd method. next, a 10-nm-thick titanium nitride film and a 10-nm-thick tungsten film were successively formed by a sputtering method. after that, a third resist mask was formed over the tungsten film. next, the titanium nitride film and the tungsten film were selectively etched using the third resist mask, so that a gate electrode layer was formed. next, a fourth resist mask was formed over the gate electrode layer and the gate insulating film, and the gate insulating film and the third oxide semiconductor film were selectively etched using the fourth resist mask, so that the gate insulating film and a third oxide semiconductor layer having shapes illustrated in figs. 15a and 15b were formed. next, an aluminum oxide film and a silicon oxynitride film were formed as insulating layers. through the above process, the transistor of one embodiment of the present invention (corresponding to the model (b) illustrated in fig. 16b ) was fabricated. further, a transistor having a conventional structure (corresponding to the model (a) illustrated in fig. 16a ) was also fabricated by changing part of the above process. next, electrical characteristics of the fabricated transistors are described. fig. 17a shows id-vg characteristics of the transistor having the conventional structure. the composition ratio of the second oxide semiconductor layer of the transistor was in:ga:zn=1:1:1. the field-effect mobility of the transistor was approximately 14 cm 2 /vs and the s value thereof was approximately 105 mv/decade; thus, favorable characteristics were obtained. fig. 17b shows id-vg characteristics of the transistor of one embodiment of the present invention. the composition ratio of the second oxide semiconductor layer of the transistor was in:ga:zn=3:1:2. the field-effect mobility of the transistor was approximately 21 cm 2 /vs and the s value thereof was approximately 90 mv/decade; thus, the obtained characteristics were more favorable than those of the transistor having the conventional structure. here, in the case where the composition ratio of the second oxide semiconductor layer used in the transistor having the conventional structure was in:ga:zn=3:1:2, a field-effect mobility of approximately 100 cm 2 /vs was obtained; however, favorable characteristics were not obtained (e.g., the threshold voltage was largely shifted in the negative direction). further, in the case where the composition ratio of the second oxide semiconductor layer used in the transistor of one embodiment of the present invention was in:ga:zn=1:1:1, an on-state current and a field-effect mobility were lower than those in id-vg characteristics in fig. 17a . in other words, it is found that when an appropriate material is selected for the oxide semiconductor layer, the transistor of one embodiment of the present invention can have more favorable electrical characteristics than the transistor having the conventional structure. note that this example can be combined with any of the embodiments in this specification as appropriate. explanation of reference 100 : transistor, 110 : substrate, 120 : base insulating film, 130 : oxide semiconductor layer, 131 : first oxide semiconductor layer, 132 : second oxide semiconductor layer, 133 : third oxide semiconductor layer, 135 : boundary, 137 : channel region, 140 : source electrode layer, 145 : wiring, 147 : first opening, 150 : drain electrode layer, 155 : wiring, 157 : second opening, 160 : gate insulating film, 170 : gate electrode layer, 172 : conductive film, 175 : wiring, 177 : third opening, 180 : insulating layer, 185 : insulating layer, 331 : first oxide semiconductor film, 332 : second oxide semiconductor film, 333 : third oxide semiconductor film, 340 : first conductive film, 341 : first conductive layer, 360 : insulating film, 370 : second conductive film, 400 : resist mask, 3000 : substrate, 3001 : wiring, 3002 : wiring, 3003 : wiring, 3004 : wiring, 3005 : wiring, 3100 : element isolation insulating layer, 3150 : insulating layer, 3200 : transistor, 3250 : electrode, 3300 : transistor, 3400 : capacitor, 4250 : memory cell, 4300 : transistor, 4400 : capacitor, 4500 : wiring, 4600 : wiring, 8000 : television set, 8001 : housing, 8002 : display portion, 8003 : speaker portion, 8004 : cpu, 8100 : alarm device, 8101 : microcomputer, 8102 : sensor portion, 8200 : indoor unit, 8201 : housing, 8202 : air outlet, 8203 : cpu, 8204 : outdoor unit, 8300 : electric refrigerator-freezer, 8301 : housing, 8302 : door for refrigerator, 8303 : door for freezer, 8304 : cpu, 9700 : electric vehicle, 9701 : secondary battery, 9702 : circuit, 9703 : driving device, and 9704 : processing unit. this application is based on japanese patent application serial no. 2013-099534 filed with japan patent office on may 9, 2013, the entire contents of which are hereby incorporated by reference.
008-373-319-489-171	US	[ "US", "WO" ]	A61N5/01,A61B18/20,A61B19/00,A61N5/06,A61B18/22	2003-12-31T00:00:00	2003	[ "A61" ]	dermatological treatment with visualization	the present invention provides a handheld dermatological device for visualizing a skin treatment region prior to, during, or after therapeutic treatment with therapeutic energy. an apparatus according to the teachings of the invention can include an image capture device and a display device mounted to the apparatus and electrically coupled to the image capture device. the display device is capable of displaying images of the treatment area captured by the image capture device. the apparatus can further include a head capable of transmitting therapeutic energy to a treatment area, which can be precisely aligned by the user to a desired portion of the treatment area through the use of the display device. in some embodiments, the apparatus can include one or more illumination sources for illuminating a skin target region, and shield for shielding the image capture device from direct reflection of the illuminating radiation from a selected skin surface portion.	1. a handheld dermatological device, comprising a housing capable of being manually manipulated to position a head portion thereof in proximity of a person's skin surface, an illuminating source mounted to said housing for illuminating a target skin region, a solid state laser disposed in said housing for generating radiation, an optical system coupled to said laser for directing radiation from the laser to the target skin region, an image capture device mounted in said housing for generating an image of said illuminated target skin region, a display coupled to said housing and in communication with said image capture device to display said image, and a shield mounted to the head portion for shielding a portion of the skin surface through which said image capture device obtains the image of the target skin region from direct illumination by said illuminating source. 2. the device of claim 1 , wherein said solid state laser comprises a rare earth doped laser. 3. the device of claim 2 , wherein said solid state laser comprises a neodymium (nd) laser. 4. the device of claim 2 , wherein said solid state laser comprises a nd:yag laser. 5. the device of claim 1 , further comprising a microprocessor in communication with said image capture device for processing one or more images obtained by said image capture device. 6. the device of claim 1 , wherein said image capture device comprises a ccd camera. 7. the device of claim 1 , wherein said image capture device captures at least a portion of radiation returned from the skin through said skin surface portion in response to illuminating said illuminating source. 8. a method of treating skin, comprising: applying treatment radiation generated by a solid state laser to selected vasculature located in a target skin region, illuminating indirectly said target skin region by radiation from at least one illumination source so as to avoid direct incidence of the radiation on at least a portion of the surface of said target skin region, generating an image of said target skin region, and displaying said image. 9. the method of claim 8 , further comprising selecting said solid state laser to be a rare earth doped laser. 10. the method of claim 8 , further comprising selecting said solid state laser to be a neodymium (nd) laser. 11. the method of claim 8 , further comprising displaying said image concurrently with application of the treatment radiation. 12. the method of claim 8 , further comprising utilizing said image to align a treatment radiation beam generated by said laser with said selected vasculature. 13. a handheld dermatological device, comprising a housing through which treatment energy can be applied to a person's skin, two illumination sources capable of generating radiation having at least two different wavelengths, said sources being mounted to a head portion of said housing for illuminating a target skin region, a control for selectively activating said sources, an image capture device disposed in said housing for detecting at least a portion of radiation scattered by said target skin region in response to illumination by at least one of said sources, and a shield positioned in proximity of at least one of said illumination sources for shielding a selected skin surface segment from direct illumination by said source. 14. the device of claim 13 , wherein said control is adapted for activating said sources in different temporal intervals. 15. the device of claim 13 , wherein said control is adapted for triggering said image capture device to form an image of the target region upon activation of at least one of said sources. 16. the device of claim 13 , wherein said image capture device is adapted to collect radiation via said shielded skin surface segment radiation scattered by said target skin region. 17. the device of claim 13 , further comprising a treatment source disposed in said housing for applying treatment energy to said target skin region through said shielded skin surface segment. 18. the device of claim 13 , wherein said control is adapted to activate said illumination sources in accordance to a preset temporal pattern.	related application the present application claims priority to a provisional application entitled “dermatological treatment with visualization” filed on dec. 31, 2003 and having a ser. no. 60/534,060. background of the invention this invention relates generally to methods and apparatus for utilizing energy, e.g., optical radiation, to treat various dermatological and cosmetic conditions. more particularly, the invention provides a handheld dermatological device that facilitates viewing and measuring parameters of a treatment area before, during, and after application of a treatment modality. energy such as electromagnetic, mechanical, thermal, acoustic, and particle beam radiation has been utilized for many years in medical and non-medical facilities to treat various medical and cosmetic conditions. such treatments include, but are not limited to, hair growth management, including limiting or eliminating hair growth in undesired areas and stimulating hair growth in desired areas, treatments for pfb (razor bumps), skin rejuvenation, anti-aging treatments including improving skin texture, elasticity, wrinkles and skin lifting and tightening, pore size reduction, reduction of non-uniform skin pigmentation, improving vascular and lymphatic systems, treatment of vascular lesions such as spider veins, leg vein, varicose veins, port wine stain, rosacea, telangiectasia, removal of pigmented lesions, repigmentation, improved skin moistening, treatment of acne including non-inflammatory, inflammatory and cysts, treatment of psoriasis, reduction of body odor, reduction of oiliness, reduction of sweat, reduction/removal of scars, prophylactic and prevention of skin diseases, including skin cancer, improvement of subcutaneous regions, including fat reduction and cellulite reduction, as well as numerous treatments for other conditions. the treatments can be performed, for example, by employing optical energy (including ultraviolet, visible, and infrared), microwave energy, radiofrequency, low frequency or dc current energy, acoustic energy, mechanical energy and kinetic energy of particles (for example, sapphire particles), skin cooling or heating. the flow of energy can be delivered to the treatment region via a handpiece, which can include a housing, energy distribution system (comprising, for example, a radiation source, optics and a scanner), and an optional skin cooling element. in rare cases, the handpiece can also include a diagnostic sensor (i.e., skin temperature radiometer). the diagnostic sensor in such systems is used to protect the skin from unwanted damage (i.e., due to overheating or over cooling). while various handheld devices have been disclosed for applying dermatological treatments, currently, present systems lack efficient mechanisms for positioning the treatment head of the handpiece over a selected target treatment area and/or viewing the target area while a treatment modality is being applied. further, such conventional handheld devices lack systems for preferential imaging of subsurface skin tissue. accordingly, there exists a need for handheld dermatological devices that provide mechanisms for positioning the device's treatment head over a target area and/or viewing the target area even as the treatment is being applied. there is also a need for such handheld dermatological devices that can provide better targeting and evaluation of a treatment target and surrounding tissue before, during, and after treatment to improve efficacy and safety of the treatment and provide an opportunity for self treatment with a cosmetic device suitable for home use. summary of the invention methods and devices for treating dermatological or cosmetic conditions that include imaging a target skin region, e.g., skin tissue, are disclosed that allow preferential illumination of the skin region, obtaining its image and displaying it to a user for better alignment of flow of a treatment energy relative to a target region and performing diagnostic of the target before, during and after treatment. a user of such devices can be, for example, a physician, an aesthetician, or a person who can utilize the device for self treatment of a cosmetic condition. in some embodiments, the device provide diagnostic functionality. in some embodiments, the devices include handheld devices that can, in addition to imaging capability, provide treatment energy to a subject's skin. the term “treatment energy” as used herein can refer to therapeutic energy to treat diseased condition or energy suitable for treating cosmetic conditions. in one aspect, a handheld dermatological device is disclosed that allows application of treatment energy to a target skin region as well as visualizing the skin treatment region prior to, during, or after application of the treatment energy. such a device can include, for example, an image capture device and a display device that is mounted to a housing of the handheld device and is coupled (electrically, optically or otherwise (wireless)) to the image capture device to present acquired images to a user, e.g., a medical professional or a consumer. the image capture device can be connected to the display through a microprocessor, which can be integrated with the display or the image capture device itself. the handheld device can further include a head that can be precisely aligned by a user relative to a patient's skin by utilizing one or more images presented in the display, and through which treatment energy can be applied to a target skin region. a dermatological device, as used herein, can refer to a therapeutic device or a cosmetic device, including a home cosmetic device. in one aspect, a handheld dermatological device is disclosed that includes a housing capable of being manually manipulated to position a head portion thereof in proximity to a person's skin, and is adapted for delivery of treatment energy to a target skin region. the handheld device can further include an illumination source coupled to the housing for generating radiation to illuminate the target skin region, and a detector disposed in the housing and adapted to primarily detect tissue scattered radiation emanating from the target skin region. as used herein, the term “primarily detect tissue scattered radiation emanating from the target skin region” is intended to mean detecting radiation from the illumination source that is primarily scattered by tissue below and around the target skin region depth and thus reaches the detector from beneath the skin surface thereby emanating or coming from the target skin region. this may also be referred to as “translucent radiation” where the radiation is coming from below the target skin region to make the target skin region more visible. the term “primarily” in this context is used to distinguish between such tissue scattered radiation and light that reaches the detector by reflection of illuminating or ambient light from the surface of the skin and skin above the target skin region. thus, “primarily” typically means greater than 50%, preferably greater than 60%, more preferably greater than 70%, more preferably greater than 80%, more preferably greater than 90%, more preferably greater than 95%, of the detected radiation corresponds to scattered radiation emanating from below and around the target skin region depth as opposed to light reflected by the skin surface and scattered from the skin above depth of target skin region. the detector can be positioned relative to the illumination source so as to primarily detect the scattered radiation. the detector can optionally include an image capture device for generating an image of the target skin region. further, a display can be mounted to the housing for displaying the image. the illumination source can be adapted to deliver radiation to a first skin surface segment so as to illuminate the target region such that at least a portion of the scattered radiation reaches the detector via a second skin surface segment. a shield mounted to the head portion can shield the second skin surface segment from direct (via skin surface) application of radiation from the illumination source. in some embodiments, the device can further include additional illumination sources. in some cases, the illumination sources can be selected to generate radiation with different wavelengths. a control unit can be further included for selectively activating at least one, or more of the illumination sources. for example, the control unit can activate the illumination sources according to a preset temporal pattern. in some embodiments, the housing can include an aperture through which the scattered radiation can reach the detector. the illumination source is preferably offset relative to the aperture such that illuminating radiation reaches the target region along different paths than those along which scattered light from the target region is collected by the detector. in some embodiment, the illumination source can be positioned at an angle relative to an optical axis of the device in other aspects, a treatment source can be disposed in the housing for generating the treatment energy. by way of example, the treatment source can generate electromagnetic radiation having one or more wavelengths in a range of about 290 nm to about 3000 nm, or preferably in a range of about 500 to about 3000 run, or preferably in a range of about 600 nm to about 1900 nm, or more preferably in a range of about 800 nm to about 1100. the treatment source can generate pulsed radiation having a fluence in a range of about 1 to about 200 j/cm 2 with pulse widths in a range of about 1 ns to about 10 seconds. for example, the treatment source can be a neodymium (nd) laser, such as a nd:yag laser. in another aspect, the housing can be adapted for receiving the treatment energy from an external treatment source, such as a radiation source. for example, the device can further include an optical fiber for directing radiation from an external treatment source to the target skin region. optical fiber can be utilized for delivery of illumination light from illuminating sources to the skin. in further aspects, the device can further include a first polarizer coupled to the illumination source and a second polarizer coupled to the detector, wherein the polarizers have substantially orthogonal or parallel polarization axes. in another aspect, the device can further include a radiation guiding that is adapted to contact a skin surface region. the illumination source can be optically coupled to the guiding element for coupling radiation into the guiding element so as to generate illumination waves refractively coupled to at least a portion of the target region. a polarizer can be coupled to the detector to substantially prevent radiation reflected from the skin surface region from reaching the detector while allowing detection of radiation scattered from the target region in response to the refractively coupled waves. the device can further include another polarizer coupled to the illumination source having a polarization axis substantially orthogonal to that of the polarizer coupled to the detector. in another aspect, a method of treating a target skin region is disclosed comprising illuminating the target skin region, detecting primarily tissue scattered radiation emanating from the target region in response to the illumination, and directing treatment energy to at least a portion of the target skin region. a first portion (segment) of skin surface can be illuminated with illuminating radiation propagating along a first direction such that at least a portion of the radiation penetrates the skin tissue below a second segment of skin surface. the second segment of the skin surface can be shielded from direct application of the radiation. the scattered radiation can be detected along a second direction offset relative to the first direction. the radiation emanating from the second segment of skin surface can be detected to obtain an image of the target skin region. the image can be used to align a treatment energy beam with a portion of skin tissue in the target skin region so as to apply treatment energy to that portion. by way of example, the illumination radiation can be selected to have one or more wavelengths in a range of about 290 nm to about 3000 nm. one or more images of the target skin region can be monitored before, during or after application of the treatment energy. in another aspect, a handheld dermatological device is disclosed comprising a housing capable of being manually manipulated to position a head portion thereof in proximity to a person's skin surface, an illuminating source mounted to the housing for illuminating a target skin region, a neodymium (nd) laser, e.g., a nd:yag laser, disposed in the housing for generating radiation, an optical system coupled to the laser for directing radiation from the laser to the target skin region, an image capture device mounted in the housing for generating an image of the illuminated target skin region, and a display coupled to the housing and in communication with the image capture device to display the image. the device can further include a shield mounted to the head portion for shielding a portion of a skin surface through which the image capture device obtains an image of the target skin region from direct illumination by the illumination source. a zoom lens system coupled to the laser can adjust a dimension, e.g., a diameter, of a radiation beam generated by the laser. the device can further include a microprocessor in communication with the image capture device for processing one or more images obtained by the image capture device. the image capture device can be a ccd camera, a video camera or any other suitable analog or digital imaging system. the device can also include imaging optics optically coupled to the image capture device for directing at least a portion of radiation emanating from the target skin region to the image capture device. in some embodiments, the device further includes additional illumination sources. in some cases, the illumination sources can generate radiation with different wavelengths. a control unit can be further included for selectively activating the illumination sources according to a desired temporal pattern so as to illuminate the target region with radiation having different wavelengths and/or from different angles. in another aspect, a method of treating skin is disclosed comprising applying treatment radiation, for example, radiation generated by a neodymium (nd) laser (e.g., nd:yag) to selected vasculature located in a target skin region, generating an image of the target skin region, and displaying the image. in another aspect, a method of treating skin is disclosed that comprises applying fluorescence or pumping radiation from sources providing treatment energy, for example, fluorescence from a neodymium (nd) laser, to illuminate a target skin region, generating an image of the target region, and displaying the image. as used herein, the term “treating skin” is intended to encompass both medical and cosmetic treatments, such as hair removal, hair growth management, removal of vascular lesions (e.g., telangiectasia, psoriasis, rosacea, spider vein, leg vein), pigmented lesions, treatment of nail disorders, fat reduction, acne treatment, skin rejuvenation, wrinkle reduction and tattoo removal and the like. the image can be displayed before, during or after application of the treatment radiation. the image can be used to align a treatment radiation beam with the selected vasculature. in another aspect, a handheld dermatological device is disclosed comprising a housing, a source disposed in the housing for generating both treatment radiation and illuminating radiation, an optical system for directing the treatment and illuminating radiation to a target skin region, an image capture device mounted in the housing for acquiring an image of the target region, and a display mounted to the housing for displaying the image. by way of example, the source can include a nd:yag laser. the nd:yag laser can generate lasing treatment radiation and the laser rod can generate fluorescence illumination radiation. the image capture device can be adapted to detect scattered radiation emanating from the target skin region in response to illumination by the illuminating radiation. in another aspect, a handheld dermatological device is disclosed comprising a housing through which treatment energy can be applied to a skin target region, an illumination source coupled to the housing for illuminating the target region, an image capture device mounted in the housing for acquiring one or more images of the target region, goggles suitable for wearing by an operator of the device. the goggles can incorporate one or more display devices in communication with the image capture device for displaying the images to the operator. the device can include a treatment source disposed in the housing. alternatively, the housing can be adapted to receive the treatment energy from an external source, e.g., via an optical fiber or other energy delivery systems. in another aspect, a handheld dermatological device is disclosed comprising a housing through which treatment energy can be applied to a target skin region, an illumination source coupled to the housing for generating radiation for delivery to a first skin surface segment to illuminate the skin target region such that at least a portion of radiation emanating from the target region in response to the illumination reaches a second skin surface segment, and an image capture device capable of detecting the portion of radiation emanating from the target region to form an image thereof. the device further can further comprise a treatment source disposed in the housing for generating the treatment energy. the treatment source can be a laser or a broadband source, such as led or lamps. in some embodiments, the device further comprises a shield for shielding the second skin surface segment from direct application of the illumination radiation. for example, the shield can be disposed in proximity of the illumination source to substantially prevent direct illumination of the second skin surface segment. in another aspect, the invention discloses a method for treating a target region of skin tissue comprising illuminating a first skin surface with radiation such that at least a portion of the radiation penetrates the skin tissue below a second skin surface, shielding the second skin surface from direct application of the radiation, detecting radiation emanating from the second skin surface to obtain an image of the target skin region, and directing treatment energy to the target skin region through the second skin surface. in yet another aspect, the invention discloses a handheld dermatological device comprising a housing for applying treatment energy to a portion of a person's skin surface to treat a target skin region, an illumination source coupled to the housing for illuminating the target skin region from below the portion of the skin surface, and a shield disposed in the housing so as to substantially prevent the illumination source from directly illuminating the portion of the skin surface from above the portion of the skin surface. the device can further include a detector mounted in the housing to detect at least a portion of the illumination radiation scattered by the target skin region. for example, the detector can be positioned in the housing so as to detect at least a portion of the illumination radiation emanating from the portion of the skin surface. in another aspect, a dermatological device is disclosed comprising a housing through which treatment energy can be applied to a target skin region, a radiation guiding element coupled to the housing and adapted to contact a skin surface region, at least one illumination source optically coupled to the guiding element for coupling radiation into the guiding element so as to generate illumination electromagnetic radiation (wave) refractively coupled to at least a portion of skin in contact with the guiding element, and an image capture device capable of detecting radiation scattered from the target region in response to the refractively coupled illumination radiation. the image capture device can form an image of the target region. the radiating guiding element can be formed of any suitable transparent material as discussed in more detail below. for example, the guiding element can be formed of sapphire or quartz and can have an index of refraction in a range of about 1.3 to about 1.9. in another aspect, images exhibiting interruptions of total internal reflection of illumination light at the contact surface of the guiding element and skin surface can be used for visualization of targets on the skin surface. the device can further comprise a polarizer coupled to the image capture device so as to prevent radiation having a selected polarization from reaching the image capture device. a filter coupled to the image capture device can be included in the device so as to prevent radiation having one or more selected wavelengths from reaching the image capture device. in another aspect, a method of treating person's skin is disclosed comprising placing an optical guidance element on a portion of the skin surface, coupling illuminating radiation into the guidance element so as to generate refractively coupled waves penetrating a subsurface region below the portion of the skin surface, detecting at least a portion of radiation scattered by the subsurface region in response to the refractively coupled waves to form an image of the subsurface region, and directing treatment energy to at least a portion of the subsurface region. in a related aspect, radiation can be coupled to the guidance element so as to generate evanescent waves at the interface of the guidance element with the skin. such waves can be utilized for imaging and diagnosis of dermatological structures and conditions, as discussed in more detail below. in another aspect, a handheld dermatological device is disclosed comprising a housing through which treatment energy can be applied to a person's skin, two illumination sources capable of generating radiation having at least two different wavelengths, the sources being mounted to a head portion of the housing for illuminating a target skin region, a control unit for selectively activating the sources, and an image capture device disposed in the housing for detecting at least a portion of radiation scattered by the target skin region in response to illumination by at least one of the sources. the control can be adapted for activating the sources in different temporal intervals and/or for triggering the image capture device to form an image of the target region upon activation of at least one of the sources. the device can include a shield positioned in proximity of at least one of the illumination sources for shielding a selected skin surface segment from direct illumination by that source. the image capture device can be adapted to collect radiation via the shielded skin surface segment radiation scattered by the target skin region. the device can further include a treatment source disposed in the housing for applying treatment energy to the target skin region through the shielded skin surface segment. in another aspect, the invention provides a device for imaging a subsurface target region of skin tissue that includes an illumination source for illuminating a skin surface with illuminating radiation such that at least a portion of the radiation penetrates the skin tissue below the surface and is at least partially scattered by the skin tissue. the device can further include a detector that is capable of detecting radiation scattered by the subsurface target region, and a shield for shielding the detector from illuminating radiation that is directly reflected by the skin surface. the detector can comprise an image capture device that can generate an image of the subsurface target region. any suitable image capture device can be employed. for example, the image capture device can be a ccd/cmos camera or a video camera. the device can include a handheld housing through which treatment energy can be directed to the skin. the treatment energy can be provided by a source mounted to the housing, or alternatively, it can be provided by an external source and guided through a path within the housing to the skin. in some embodiments, the treatment source is a radiation source, such as a laser or a broad band source (e.g., a lamp, led). in a related aspect, in the above imaging or the handheld device, the shield can comprise a polarizer coupled to the detector to prevent radiation having a selected polarization direction from reaching the detector. in some embodiments, another polarizer having a polarization axis orthogonal or parallel to the shield polarizer, can be coupled to the illumination source. alternatively, the shield can be formed from a material that is substantially opaque to the radiation generated by the illumination source, and can be placed in proximity of the illumination source to prevent direct illumination of a portion of the skin surface of the target region. in further aspects, the invention provides a method for imaging a subsurface target region of skin tissue that includes illuminating a skin surface with illumination radiation such that a significant portion of the radiation penetrates the skin tissue below the surface and is at least partially scattered by that tissue while minimizing scattering signal from skin tissue located deeper than the target tissue. a detector is positioned so as to detect at least a portion of radiation scattered by the subsurface target region. the detector is shielded from illumination radiation that is directly reflected by the skin surface (and scattered from tissue above the target region depth) while enhancing detection of radiation that is primarily scattered by tissue below and around target skin region depth, and an image of the subsurface target region is obtained based on the detected scattered radiation. the illumination radiation can have one or more wavelengths in a range of about 350 nm to about 2000 nm. the illumination sources can be, for example, light emitting diodes (led), diode lasers, lamps, or other suitable sources of electromagnetic energy. in some cases, treatment energy, e.g., radiation having one or more wavelengths in a range of about 290 nm to about 20,000,000 nm, can be applied to the subsurface target region in conjunction with monitoring one or more images of this region prior to, during, and/or after application of the treatment energy. in a related aspect, the invention provides a handheld dermatological device that includes a housing capable of being manually manipulated to direct treatment energy to a skin target region, an image capture device coupled to the housing to generate an image of at least a portion of the target region, and a display device mounted to the housing and electrically coupled to the image capture device to display images captured by the image capture device. the term “mounted,” as used herein, is intended to encompass mechanical coupling to the housing such that the housing and the display can be simultaneously, or separately, manually manipulated by the user to direct treatment radiation to a target area and/or view the target. the housing can further comprise a head capable of transmitting the treatment energy. the user can precisely position the head over a desired portion of the treatment region by using the display as a guide. the user can therefore diagnose and/or view the treatment region before, during and after treatment more effectively. thus, more effective and safer treatment will be possible than are currently available as the user can directly monitor the results of the treatment in real-time. in some embodiments, the handheld device can include an optical system, such as an objective, optical filter, spectral filter, spatial filter, polarizer, phase elements, masks and illumination system for facilitating acquisition of images and/or enhancing their presentation. for example, such an optical system can be disposed between the image capture device and the patient's skin to prevent radiation having selected wavelengths and/or polarizations from reaching the image capture device. further, an image of the treatment region can be processed by an image processor and/or a microprocessor, for example, to enhance its resolution (or contrast), color and brightness. for example, the microprocessor can be positioned between an image capture device and a display. in some embodiments, the microprocessor can be coupled to the image capture device such that the user can be alerted when a treatment has reached a desired preset limit. the microprocessor can provide image processing for magnification, improved contrast of the image, and/or synchronization of the image capture with skin illumination, as discussed in more detail below. for example, the image capture device can send multiple images of the treatment region during treatment to the microprocessor. the microprocessor can compare changes in selected parameters of the treatment region to threshold values previously stored, for example, in a database. various parameters, such as color or a change of fluorescence emission, can be used to monitor the applied treatment. skin conditions, such as, pigmented lesions, spider veins, port wine stains, psoriasis, can change color during and after treatment. the treatment radiation can also coagulate and/or destroy vessels resulting in a color change in images of such vessels. additionally, treatment of acne can be monitored through a measurement of fluorescence. among microbial population of pilosebaceous unit, most prominent is propionibacterium acnes ( p. acnes ). these bacteria are causative in forming inflammatory acne. p. acnes can exhibit fluorescence. upon treatment, the fluorescence will decrease. images of the treatment region can be stored in a memory card, which can be attached to the microprocessor, or sent to a computer via a wireless or hard-wired connection. these images can be used to compile a patient or treatment history file. in some embodiments, the display device can be fixedly mounted onto the housing. in other embodiments, the display device can be hingedly attached to the housing. for example, the display device can be attached to a railing or flexible wire such that the display device can be extended by the user for ease of viewing and can be folded for ease of storage. such an adjustable display device can be utilized, for example, by a patient for self-treatment in other aspects, the displays can be built into goggles to be worn by a user or a patient. the display device can be permanently attached to the housing of the handheld device, or it can be mounted to the housing in a removable and replaceable manner. in some embodiments, a large display can be used for providing better image resolution, and facilitating simultaneous observation of an image by an operator and a patient. the image capture device can detect a change in at least one of optical signals, infrared, electro capacitance, or acoustic signals. an electro capacitor image capture device can be preferable for skin surface and epidermis imaging. the image capture device can be either an analog or digital device. in some embodiments, the image capture device is a camera. in a preferred embodiment, the image capture device is a ccd/cmos camera or a video camera. a handheld dermatological device according to the teachings of the invention can be utilized to deliver different types of treatment energy to a patient. some exemplary optical radiation wavelengths and examples of conditions that can be treated by these wavelengths are provided in table 1 below. table 1preferred parameters for the treatment ofdermatological conditions with light.treatment condition or applicationwavelength, nmanti-aging400–11000superficial vascular290–6001300–2700deep vascular500–1300pigmented lesion, de pigmentation290–1300skin texture, stretch mark, scar,290–2700porousdeep wrinkle, elasticity500–1350skin lifting600–1350acne290–700, 900–1850psoriasis290–600hair growth control,400–1350pfb300–400, 450–1200cellulite600–1350skin cleaning290–700odor290–1350oiliness290–700, 900–1850lotion delivery into the skin1200–20000color lotion delivery into the skinspectrum of absorption of colorcenter and 1200–20000lotion with pdt effect on skinspectrum of absorption of photocondition including anti cancer effectsensitizerala lotion with pdt effect on skin290–700condition including anti cancer effectpain relief500–1350muscular, joint treatment600–1350blood, lymph, immune system290–1350direct singlet oxygen generation1260–1280 in embodiments in which the treatment energy is applied as pulses, the pulsewidths can be in a range of about 1 nanosecond to about 10 seconds and the pulses can have a fluence in a range of about 1 to about 200 j/cm 2 . in other aspects, the invention provides a dermatological imaging device that includes a radiation guiding element that is adapted to contact a skin surface region to provide refractive coupling of light into the skin (refractive illumination). the device can further include at least one illumination source that is optically coupled to the guiding element for coupling radiation into the guiding element so as to generate electromagnetic waves penetrating into a controlled depth of subsurface skin region. the device also includes an image capture device that is capable of detecting radiation scattered from the subsurface skin region in response to the refractive wave illumination. the image capture device can form an image of the subsurface skin region by employing the detected radiation. further, in some embodiments, a filter and/or a polarizer can be coupled to the image capture device to prevent radiation having a selected polarization, or one or more selected wavelengths, from reaching the image capture device. the refractive coupling of radiation into the skin can be utilized for precise control of treatment and/or imaging of skin surface conditions and/or features, such as, stratum corneum structure, pores, sebaceous follicle openings, hair follicle openings, skin texture, wrinkles, psoriasis. by controlling the refractive index of the guiding element and the incident angle of radiation coupled into the guiding element at the contact surface of the guiding element and the skin, the imaging contrast of a visualized target can be enhanced, as discussed in more detail below. in further aspects, the invention provides a handheld dermatological device that includes a housing through which treatment energy can be applied to a patient's skin, and further includes one or more sensors mounted to a head portion of the housing, which are capable of generating a dielectric image of a target skin region. such a dielectric image can provide a distribution of dielectric sensitivity of the skin surface of a target skin region, which can be measured, e.g., by an electro capacitor image capture device. the device can further include a display for displaying the dielectric image. in some embodiments, one or more transducer elements can be coupled to the housing for applying an electric current or acoustic energy to the patient's skin. in another aspect, the invention provides a handheld dermatological device having a housing through which treatment energy can be applied to a patient's skin, and two or more illumination sources that generate radiation having wavelengths in different wavelength bands. the sources are mounted to a head portion of the housing for illuminating a target skin region. the handheld device can further include a control for selectively activating the sources and a image capture device disposed in the housing for detecting at least a portion of radiation scattered by the target skin region in response to illumination by one or both of the sources. further understanding of the invention can be obtained by reference to the following detailed description in conjunction with the associated drawings, described briefly below. brief description of the drawings fig. 1a schematically depicts a handheld device according to one embodiment of the invention, fig. 1b schematically depicts a handheld device according to one embodiment of the invention having a display movably mounted to the device's housing, fig. 1c schematically illustrates a handheld device according to one embodiment having a display electrically or optically coupled to the device's housing via one or more flexible wires or optical cables, fig. 1d schematically illustrates a handheld device according to one embodiment of the invention having a display hingedly attached to the device's housing, fig. 1e schematically depicts a handheld device according to one embodiment of the invention having a display incorporated in goggles suitable for wearing by a user, fig. 2a schematically depicts a handheld device according to one embodiment of the invention having a housing through which therapeutic energy can be applied to the skin and an image capture device for generating an image of a target skin region, fig. 2b schematically depicts a handheld device according to another embodiment of the invention having an illumination source for illuminating a target skin region and an image capture device for acquiring an image of the target region, fig. 2c schematically illustrates a device according to another embodiment having an illumination source and image capture device for preferentially illuminating and obtaining an image of a target skin region, fig. 2d schematically illustrates a device according to an embodiment of the invention having a cooling or heating element for applying heat to or extracting heat from the skin and an image capture device for generating an image of a target skin region, fig. 2e schematically illustrates a device according to another embodiment of the invention having a plurality of radiation sources adapted for preferentially illuminating a subsurface skin region and an image capture device for generating an image of that region, fig. 3a schematically illustrates a device according to one embodiment of the invention in which polarized radiation is employed for preferential illumination of a target skin region, fig. 3b schematically illustrates a device according to one embodiment of the invention having a plurality of illumination sources for illuminating a subsurface skin region and a shield disposed in proximity of the sources for shielding a selected skin surface from direct illumination by the sources, fig. 4a is a schematic cross-sectional view of a handheld dermatological device according to one embodiment of the invention, fig. 4b is a schematic cross-sectional view of a head portion of the device of fig. 4a , fig. 4c schematically depicts illumination sources and a shield mounted to the head portion of the handheld device of figs. 4a and 4b , fig. 5 schematically depicts an image of a skin portion obtained by an image capture device incorporated in a handheld device according to one embodiment of the invention, fig. 6 schematically depicts illumination sources and a shield mounted to a head portion of a device according to one embodiment of the invention in which the sources provide radiation in different spectral bands, fig. 7 is a diagram depicting a control system for selective activation of illumination sources and/or an image capture device incorporated in a handheld device according to one embodiment of the invention, fig. 8 schematically depicts a handheld device according to one embodiment of the invention having a ccd camera and an image processor for processing images acquired by the camera, fig. 9 schematically depicts a handheld device having a communications module for transmitting images obtained by an image capture device incorporated in the handheld device to an external computing system, via wire or wireless communication, fig. 10 schematically depicts an image of a target region presented in a display of a handheld device according to one embodiment of the invention in which a graphical object in employed to show a cross-section of a treatment beam, fig. 11a schematically illustrates a handheld device according to one embodiment of the invention in which a command menu can be presented to a user, fig. 11b schematically illustrates a handheld device according to another embodiment having a microprocessor in communication with an image capture device to process images acquired by the device so as to identify occurrence of a selected condition, such as completion of a treatment protocol, fig. 12 schematically illustrates tracking the position of a marker identifying the location of a selected site in two images, which are shifted relative to one another, fig. 13a schematically illustrates a handheld device according to another embodiment of the invention having a radiating guiding element and an illumination source coupled to the guiding element so as to generate refractively coupled illumination waves for illuminating a subsurface skin region and an image capture device for generating an image of that region, fig. 13b schematically illustrates the device of fig. 13a in which total internal reflection at an contact surface of the guiding element and the skin surface is employed for visualizing the skin surface, fig. 14a schematically illustrates a device according to one embodiment of the invention having an array of sensors for generating a dielectric image of a skin portion and a display for displaying that image, fig. 14b schematically illustrates a device according to one embodiment of the invention that includes, in addition to sensors for generating a dielectric image of a skin portion and a display for displaying that image, one or more transducer elements for applying energy to the skin, fig. 15 is a schematic cross-sectional view of a handpiece dermatological device according to one embodiment of the invention having a housing to which a waveguide is coupled to transmit energy from a remote source to a skin portion, fig. 16a is a schematic cross-sectional view of a handpiece device according to another embodiment of the invention having a therapeutic radiation source and an illumination radiation source, fig. 16b is a schematic cross-sectional view of a handheld device according to one embodiment of the invention having an image capture device for generating an image of a target skin region and a memory unit for storing the images, fig. 16c schematically depicts a handheld device according to one embodiment of the invention having a housing in which various components of the device are disposed, fig. 16d schematically depicts a handheld device according to another embodiment of the invention, fig. 17 schematically depicts a handheld device according to another embodiment of the invention having a source for generating therapeutic energy and a beam forming system for focusing the therapeutic energy onto a selected target skin region, and fig. 18 schematically illustrates a handheld device according to another embodiment of the invention having a lamp source for generating treatment radiation. detailed description the present invention relates generally to dermatological devices, and more particularly to handheld dermatological devices for applying a variety of treatment modalities to a patient's skin while allowing a user to view the treatment area and target before, during, and after application of the treatment. in some embodiments, the handheld device can include one or more radiation sources for illuminating a target region of the patient's skin so as to facilitate imaging that region by an image capture device, and can further include a display in which an image of the target region can be presented. fig. 1a schematically depicts a handpiece device 112 according to one embodiment of the invention having a housing 101 that includes a handle 114 that allows a user 106 , e.g., a medical professional or a home user, to hold and aim the device at a selected target treatment area 103 . the housing, which defines an enclosure in which various components of the device are incorporated, is described in more detail below. the housing 101 can include a head or tip portion 118 at a proximal end that can be placed in proximity to, or in contact with, the treatment area 103 (which can be a surface or subsurface region) of a patient 105 to apply a selected treatment energy (e.g., electromagnetic energy, acoustic, particles, etc.) thereto. a display 102 for displaying an image of the treatment area, e.g., at a selected magnification, is coupled to the distal end of the housing 101 . the display 102 can be employed to view the treatment area 103 , which, in this embodiment, includes two crossing veins, before, during, and after the treatment, as seen in magnified image 104 . the treatment area can be located at a depth below the patient's skin surface (including a shallow subsurface region), or can be on the skin surface itself. although the display 102 is fixedly attached to the housing in this embodiment, in another embodiment shown schematically in fig. 1b , the display 102 is moveably mounted to the housing 101 to allow adjustment of its position relative to a viewer 106 , e.g., a person applying the treatment, for flexible viewing of the treatment area. in another embodiment shown in fig. 1c , the display 102 is mechanically and electrically or optically coupled to the housing 112 via one or more flexible wires or optical cable 107 , or alternatively, electrically coupled to the housing 112 via wireless, e.g., wifi connections. in another embodiment shown in fig. 1d , the display 102 is hingedly attached to the housing 101 via one or more rails 108 or flexible or bendable material for ease of positioning and storage. in some embodiments, the display 102 is removable from the housing 101 . alternatively, as shown in fig. 1e , the display 102 can be incorporated in glasses 110 that can be worn by the operator (e.g., medical or other professionals or the patient or customer themselves) to view the treatment area. the glasses can be attached to the housing 101 via a wire, or an optical cable (not shown) or can receive the images via a wireless connection. in some embodiments, the operator 105 can use the device to treat himself as shown on fig. 1e . in some embodiments, two displays are be mounted in the glasses, each corresponding to one eye of the operator. the two displays can be adapted for stereoscopic viewing of the images (three-dimensional vision). fig. 2a schematically illustrates that a selected energy flow 207 , for example, acoustic, electromagnetic, or kinetic energy, can be directed by a handpiece device 212 according to one embodiment of the invention to a target treatment area 202 . a source for generating the applied energy (not shown) can be incorporated in a housing 208 of the device, or alternatively, it can be remotely located relative to the handpiece with its generated energy transmitted via a suitable element, e.g., a waveguide, to the handpiece's housing for delivery to the treatment area. an optical system 204 , which can include, e.g., one or more lenses, prisms, mirrors, plates, apertures, masks, filters, phase elements, polarizers, diffractive elements, can direct radiation emanating from a treatment region 201 , or a portion thereof, in response to ambient illumination or illumination by one or more radiation sources (not shown) disposed in the housing 208 onto an image capture device 203 that can form an image of the treatment region 201 , or a portion thereof (e.g., area 202 ). the image capture device 203 can be an analog or a digital device with or without a microprocessor. the image captured by the image capture device 203 can be transmitted via an electrical or optical coupling, e.g., a cable 206 , or otherwise to a display 205 mounted to the housing for viewing by a user. the image capture device 203 , for example, with an integrated microprocessor, display, memory system to store the images, and battery or power supply, can be similar to those used in commercial digital photo or video cameras. the images can be magnified optically or digitally. with reference to fig. 2b , in another embodiment, in addition to the components described in fig. 2a , a handpiece device according to the teachings of the invention can include an illumination source 208 , e.g., a light source, for illuminating the treatment area, or a portion thereof, to enhance its imaging by the image capture device 203 . the illumination source 208 can be any suitable light generating element, e.g., an led, a lamp, or a laser, having a desired emission spectrum. in some embodiments, radiation from a treatment source can be employed not only for treatment but also for illumination of a target region. further, in some embodiments, a single source can generate treatment radiation in one wavelength band and illumination radiation in another wavelength band. in some embodiments, the illumination source 208 can be pulsed and/or be synchronized with the image capturing device 203 for improved spatial and thermal resolution. the illumination source 208 can be selected to generate radiation in any desired spectral region. for example, uv, violet, blue, green, yellow light or infrared radiation (e.g., about 290–600 nm, 1400–3000 nm) can be used for visualization of superficial targets, such as vascular and pigment lesions, fine wrinkles, skin texture and pores. blue, green, yellow, red and near ir light in a range of about 450 to about 1300 nm can be used for visualization of a target at depths up to about 1 millimeter below the skin. near infrared light in a range of about 800 to about 1400 nm, about 1500 to about 1800 nm or in a range of about 2050 nm to about 2350 nm can be used for visualization of deeper targets (e.g., up to about 3 millimeters beneath the skin surface). skin infrared emissions can be used for thermal imaging of the skin and/or for control of skin temperature. although in this exemplary embodiment one illumination source 208 is utilized, it should be understood that in other embodiments the handheld device can incorporate a plurality of such sources, of the same or different emission spectra. in some embodiments, a variety of optical filters and polarizing elements can be incorporated in a handpiece device of the invention to manipulate, and/or enhance, an image of the treatment area generated by the image capture device. by way of example, fig. 2c illustrates another exemplary embodiment of a handheld device in which a pair of cross or parallel polarizers, or filters, 209 and 210 are placed, respectively, in front of the light source 208 and the optical system 204 to tailor selected parameters, e.g., the polarization and/or the spectrum, of the illumination light and/or the light reflected or emanating from the treatment area in response to the illumination light. for example, a pair of cross polarizers can be employed to suppress reflections from the surface of the treatment area 201 while capturing an image of a target region 202 located at a distance below the skin surface, as described in more detail below. with reference to fig. 2d , in another embodiment, a cooling or heating element 211 , for example, a sapphire window, can be coupled to the proximal end of the handpiece's housing so that it can be placed in thermal contact with a portion of the patient's skin 202 during treatment in order to cool or heat the treatment area 201 , or a portion thereof 202 , to ensure its temperature remains within an acceptable range. in some embodiments, the element 211 can also enhance imaging of the target by improving the coupling of the illumination light into the skin and coupling the image of the target region into the image capture device. in some embodiments, a layer of a transparent lotion can be placed between the element 211 and the skin to minimize light scattering from the skin surface and reflection from the surface of the element 211 in contact with the lotion layer. in some embodiments, a handpiece according to the teachings of the invention allows preferentially obtaining an image of a portion of a target treatment region that lies a distance below the skin surface. by way of example, in the embodiment shown schematically in fig. 2e , two or more radiation sources 212 , such as, leds, lamps, or lasers, that emit radiation in a desired wavelength range, e.g., in a range of about 400 to 1400 nm, or in a range of about 1500 to about 1800 nm, or in a range of about 2050 nm to about 2350 nm, can be placed around a selected target area so as to preferentially illuminate a target region under the skin surface of the target area 202 while minimizing illumination of the skin surface of the target area itself. this approach minimizes light scatter and reflection above the target region (e.g. a lesion), thus enhancing the image contrast of the target region. in some embodiments, light from an illuminator positioned on the head of a user can be used as the illumination light. skin imaging systems can be built as optical coherent tomography systems or optical confocal microscopy systems to provide images of subsurface targets with very high resolution. in some embodiments, optical registration systems, as discussed below, can be built with decreased spatial resolution to measure average parameters of skin, such as skin pigmentation, skin redness, erythema, and/or skin birefringence. in some embodiments, a handpiece device according to the teachings of the invention is designed to preferentially provide an image of a target region 307 at a depth below the skin surface. for example, fig. 3a schematically illustrates that a light source 301 can generate a linearly polarized beam of radiation to illuminate a target area 306 a of a patient's skin 306 (alternatively, or in addition, a treatment beam 302 can be employed for illumination). a portion of the illuminating light generated by the source 301 is reflected by the skin surface of the target area towards a optical system 304 and an image capture device 303 , and another portion penetrates into the skin to illuminate a target region 307 located at a depth below the skin surface. a portion of penetrated radiation leaves the patient's skin 306 after undergoing a number of scattering events to reach the optical system 304 . while the light reflected from the surface of the target skin area 306 has substantially the same polarization direction as that of the illuminating light generated by the source 301 , the light reaching the optical system 304 after undergoing scattering at a depth beneath the skin can include a significant polarization component in a direction perpendicular to the polarization direction of the illuminating light. in this embodiment, a cross polarizer 305 that substantially blocks light having the same polarization direction as that of the light generated by the source 301 is placed in front of the optical system 304 to prevent the light reflected directly from the skin surface from reaching the optical system 304 , and hence the image capture device 303 . however, the light rays scattered by the tissue at a selected depth below the skin surface have polarization components that can pass unaffected through the polarizer 305 to be imaged by optical system onto the image capture device 303 . the focal plane of the optical system 304 can be adjusted to preferentially image scattered light emanating from a selected target region located at a depth below the skin surface. by way of example, polarized imaging of superficial dermis can be used for diagnostic and control of treatment of collagen using collagen birefringence. fig. 3b schematically illustrates another embodiment of a handheld dermatological device according to the teachings of the invention that allows preferentially viewing a target treatment region disposed at a depth below the skin surface. similar to the embodiment shown in fig. 3a , in this embodiment, a plurality of light sources 301 surrounding a selected portion 306 a of a patient's skin surface, below which a target region 307 is disposed, transmit light into the tissue below the skin surface. the transmitted light is scattered by tissue below the skin surface such that a portion of the scattered light illuminates the target region 307 . further, a portion of the light illuminating the target region 307 is reflected/scattered by tissue in the target region and finds its way, e.g., via multiple scattering events, out of the skin in a solid angle directed towards the image capture device. in addition, in this embodiment, an optical shield 308 is disposed between the light sources 301 and the portion of the skin surface below which the target region lies so as to reduce, and preferably prevent, illumination of the skin surface by photons emitted by the light sources 301 . this in turn decreases, and preferably eliminates, reflection of such photons by the portion 306 a of the surface of a skin portion 306 onto the image capture device, thereby enhancing the image of the buried target region. the optical shield 308 can be formed of any suitable material that is substantially, and preferably completely, opaque or reflective to photons emitted by the illumination sources 301 . such materials can include, for example, metal, plastic, and glass with special coating. further, the shield 308 can be formed as a single unit surrounding at least a part of the perimeter of the skin surface 306 , or alternatively, as a plurality of segments each disposed in proximity of the light sources 301 to shield the skin surface 306 from light emitted by that light source. in this embodiment, the image of the target is formed mostly by photons scattered from the tissue below the target (i.e., by “banana photons” as discussed in more detail below). this illumination arrangement at the same time minimizes the number of photons scattered from the tissue above the target. in some embodiments, the optical shield 308 can also function as a mechanism for coupling a current, rf or acoustic energy into the patient's body. for example, the shield 308 can be formed as a plurality of electrodes or transducers that not only prevent photons emitted by the light sources 301 from reaching the observation area or optical system 304 but also allow coupling of a current or acoustic energy into the patient's body. figs. 4a , 4 b and 4 c schematically illustrate an exemplary implementation of the target illumination system depicted in fig. 3b incorporated in a handheld dermatological device 112 in accordance with one embodiment of the invention. a plurality of radiation-emitting sources 411 can be disposed in a head portion 412 a of a housing 412 of the device in a ring, quadrant, pentagon, hexagon or any other suitable configuration. the radiation sources 411 , herein also referred to as illumination or imaging radiation sources, can be utilized to illuminate a target region of a subject's skin located at a depth below the skin surface, as discussed in more detail below. a treatment radiation source 413 disposed in a body portion of the handheld device 112 generates radiation having one or more wavelengths suitable for treating a dermatological condition in the target skin region. in this exemplary embodiment, the treatment source 413 includes a neodymium (nd) laser generating radiation having a wavelength around 1064 nm. the laser 413 includes a lasing medium 413 a , e.g., in this embodiment a neodymium yag laser rod (a yag host crystal doped with nd +3 ions), and associated optics (e.g., mirrors) that are coupled to the laser rod to form an optical cavity for generating lasing radiation. in other embodiments, other laser sources, such as chromium (cr), ytterbium (yt) or diode lasers, or broadband sources, e.g., lamps, can be employed for generating the treatment radiation. by way of example, the device can be employed to treat vascular lesions in depths up to about 2 millimeters with radiation having wavelengths in range of about 400 to about 1200 nm. in some embodiment, radiation generated by the treatment source 413 can be utilized not only for treating a target region but also for illuminating that region for imaging. for example, the lasing radiation generated by the nd:yag laser can be employed for treatment and fluorescence radiation emitted by the laser rod can be utilized for illumination. the illustrative handheld device 112 further includes an image capture device 414 , e.g., a ccd camera, for generating an image of a target region of the subject's skin. more particularly, as discussed in more detail below, radiation reflected from a skin target region can be directed by a beam splitter 415 to a lens 416 that in turn focuses the radiation onto the image capture device 414 . a sapphire window 417 mounted at the tip of the head portion allows extracting heat from a portion of the skin surface that can be in thermal contact therewith before, during or after application of treatment radiation. a shield 418 is mounted in the head 412 between the sapphire window and the illumination sources 411 so as to inhibit, and preferably prevent, radiation generated by the sources 411 from reaching a surface of a skin segment that will be in contact with a surface 417 a of the window formed of sapphire or other transparent thermo conductive material, when the device is utilized for imaging and/or treating a target skin portion, as discussed in more detail below. in other words, the shield prevents radiation from the illumination sources 411 from intersecting a portion of an optical path 419 (through which treatment radiation from treatment source 413 can be transmitted to a target region and through which radiation emanating from the target region, e.g., in response to illumination by illuminating sources 411 , can reach the image capture device 414 ) that extends through the sapphire window 417 . the shield 418 is preferably formed of a material that is opaque to the radiation wavelengths generated by the illumination sources 411 . some examples of materials from which the shield 418 can be formed include, without limitation, glass, metal or plastic. in some embodiments, the internal shield surface can be coated with a material that is highly reflective to the treatment radiation to minimize heating by the treatment light, and hence minimize potential skin damage due to such heating. in addition, the reflective coating can improve the treatment efficiency by providing a photon recycling effect. with reference to fig. 4c , in use, the handheld device can be manually manipulated, e.g., by utilizing a handle 112 a thereof ( fig. 4a ), so as to place its head portion in proximity of a subject's skin surface such that the surface 417 a of the sapphire window 417 is in thermal contact with a segment 419 of the skin surface. the illumination sources 411 can be activated to generate radiation that penetrates the skin surface while the shield 418 prevents this radiation from illuminating the surface of skin segment 419 . as shown schematically by arrows 420 , the radiation penetrating the skin is scattered by the skin tissue to illuminate a curved skin segment 421 in a portion of which a target skin region 422 is located. due to the curved profile of the skin segment 421 , the photons from the illumination sources 411 that illuminate via scattering by skin tissue are herein referred to as “banana photons.” in other words, the term “banana photons” refers to those photons that propagate from one point on the skin surface (e.g., point x) to another point on the skin surface (e.g., point y), which are separated from one another by a distance z. the configuration of the light field generated by the banana photons is similar in shape to a banana with one end at x and the other at y. the penetration depth of the banana photons depends on the radiation wavelength and the distance z. a maximum penetration depth is roughly about 0.5z. a distance s between the treatment target and the shield or the place of coupling of the illumination light into the skin can control the penetration depth of the banana photons. deeper targets need a larger distance s. in general, the distance s is chosen to be larger that h (s>h), wherein h is a maximum depth of the target. the sources 411 can be direct leds, diode lasers or lamps with prelensing (as shown) or can the same sources whose light is coupled into waveguides (e.g., fibers) for directing light to the skin. more particularly, the output ends of the lens or waveguides can be optically attached to the skin for better coupling of the illumination light into the skin. in some embodiments, by direct coupling of illumination light into the skin, the shield 418 can be eliminated. a portion of the “banana photons” illuminating the target region 422 are reflected or scattered by the skin tissue in the target region 422 into a solid angle extending to the skin surface segment 419 . in other words, a portion of the “banana photons” are scattered by tissue in the target region, mostly from below the target, so as to exit the skin via the skin surface segment 419 , which is shielded from direct illumination by illumination sources 411 . the beam splitter 415 directs this radiation towards the image capture device 414 , via the lens 416 , while allowing the treatment radiation generated by the treatment source 413 to pass through and reach the skin segment 422 via the sapphire window 417 . the treatment radiation can penetrate the skin to treat a dermatological condition present in the target region. the fluorescence light from the laser rod or simmer mode light from a lamp can be used for illumination. in addition, the treatment light itself can be employed for illumination to provide, for example, a better resolution of the target coagulation process during a treatment pulse. as noted above, the shield 418 prevents the radiation generated by the illumination sources 411 from illuminating the skin surface segment 419 so as to avoid reflection of this radiation from the skin surface onto the image capture device 414 , thereby maximizing the signal-to-noise ratio of the image of the target region formed by the image capture device through detection of a portion of the “banana photons” scattered by the target region. the image of the target region 422 can be utilized by an operator, e.g., a medical professional, to select a portion of the target region, or the entire target region for treatment. for example, fig. 5 shows a schematic image of the target region illustrating a plurality of vessels 511 , one or more of which it may be desired to remove. a plurality of images can be obtained during application of treatment radiation to assess the progression of the applied treatment in real-time. further, such images can indicate when the application of the treatment radiation should be terminated. alternatively, subsequent to treating a target region, one or more images of that region can be obtained to determine if the applied treatment was successful. for example, a color change exhibited by a vessel under treatment can indicate whether that vessel has been coagulated in response to treatment radiation. the images can be presented to a user in a display (not shown) mounted to the housing in a manner described in connection with the above embodiments. further, one or more images of vessels can be used to control a pressure by which the handheld device is pressed against the skin. by controlling the pressure, blood can be removed from or pumped into certain portions of the vessels to provide control of the treated vessel, thereby enhancing the treatment efficiency and preventing over-treatment. for example, for highly dense spider veins, the blood volume within the veins can be minimized before application of a treatment pulse by applying a positive pressure to prevent side effects. the treatment can be repeated several times in the same area with different pressures. using a negative pressure, it is possible to increase the blood volume within vessels before treatment. hence, the described image techniques can be utilized to control treatment results. moreover, heating of the blood can result in transformation of oxy-hemoglobin into other forms that exhibit different absorption spectra (e.g., met hemoglobin). thus, utilizing broad spectrum sources or multiwavelength sources, the temperature transformation of blood can be detected. for example, green leds (490–560 nm) can be used for visualization of vessels, such as leg veins or facial spider veins, before treatment while red and ir leds (600–670 nm, 900–1200 nm) can be used for visualization of heated blood. led illumination in a range of about 670 nm to about 750 nm can be used to distinguish blood vessels and veins with different oxy-hemoglobin concentrations. further, coagulation of vessels can be detected through the loss of image of the vessels due to stoppage of blood supply through the vessels or high scattering of coagulated tissue. referring again to figs. 4a and 4b , the exemplary handheld device 112 includes a zoom assembly comprising three lenses 423 , 424 and 425 . the lens 425 can move axially (i.e., along a direction of propagation of the treatment beam) within a slider element 426 relative to the lenses 423 and 424 so as to change the cross-sectional diameter of the treatment beam. by way of example, the cross-sectional diameter of the treatment beam can vary in a range of about 1 mm to about 15 mm. in addition, in this exemplary embodiment, a snap-in lens 427 can be employed to augment the zoom assembly and/or to modify the cross-sectional shape of the treatment beam. for example, the lens 427 can be a cylindrical lens to impart an elliptical cross-sectional shape to the treatment beam. other lens types can also be employed. in some embodiments, the image capture device 414 can be a video camera for generating a movie that can show, for example, a temporal progression of an applied treatment. providing visualization techniques in combination with treatment energy in one single device affords a user the opportunity to control a number of treatment pulses in a pulse stacking mode. for example, the device can deliver energy to a target region every 1 second (stacking mode) until coagulation of the target is completed. at this point, the user can interrupt firing of the pulses. in some embodiments, the illumination sources mounted in the head portion of the handheld device can provide radiation in different spectral ranges (e.g., different colors) for illuminating a target region. for example, fig. 6 schematically depicts a plurality of illumination radiation sources 611 mounted at a tip of a handheld device according to one embodiment of the invention and a shield 612 that prevents radiation generated by these sources from illuminating a selected skin surface segment through which an image of a target region illuminated by these sources can be obtained, in a manner described above. in this exemplary embodiment, the radiation sources in each of quadrants a, b, c and d generate radiation having one or more wavelengths different that those generated by the sources in the other quadrants. for example, while the sources in the quadrant a can provide red light, the sources in the quadrant b can generate blue light. the radiation sources in different quadrants can be activated concurrently or in succession, or in any other desired temporal pattern, to illuminate a target region. for example, the target region can be illuminated simultaneously with two or more different radiation wavelengths (e.g., two different colors). alternatively, the target region can be illuminated by sources generating radiation with the same spectral components at a time (e.g., one color at a time). in this manner, images of the target region illuminated by different radiation wavelengths can be obtained. in some embodiments, one or more of the illumination sources can generate radiation in two or more wavelength bands. in some embodiments, the image capture device can be activated in synchrony with activation of one or more radiation sources utilized for illuminating a skin target region. by way of example, the image capture device can be activated to acquire an image of the target region each time the illumination sources in one of the quadrants ( fig. 6 ) are triggered. for example, with reference to fig. 7 , the handheld device can include a control unit (e.g., a triggering switch) 711 for sending concurrent triggering signals to selected ones of the illumination radiation sources 712 mounted on the device and an image capture device 713 . alternatively, one trigger signal can be delayed relative to another by a selected time duration. for example, the triggering signal activating the image capture device can be delayed relative to that activating one or more of the radiation sources. with reference to fig. 8 , in some embodiments, the processing of the images can be achieved by an microprocessor 811 incorporated in the handheld device that is in communication with the image capture device 414 . alternatively, with reference to fig. 9 , the images can be transferred from a handheld device 911 according to one embodiment of the invention to a separate computing device 912 on which appropriate software for image construction can be executed. for example, in some embodiments, images of a target skin region acquired by the handheld device can be transmitted by employing, for example, a wireless protocol to the computing device 912 , which can be remotely located relative to the handheld device. for example, the handheld device can include a communications module 911 a for transmitting images acquired by an image capture device 911 b to the computing device 912 , via a corresponding communication module 912 a of the computing device. the computer 912 can include a display 912 b for displaying the images to a user, e.g., a medical professional. further, the computer 912 can optionally include an image processing module 912 c for processing the images of the target region. in some embodiments, the image of the target region can be analyzed by employing image recognition techniques to extract selected features, e.g., vascular legions. these extracted features can be displayed on a display mounted to the handheld device, such as a display similar to that shown above in fig. 1a in connection with the handheld device 101 . with reference to fig. 10 , in some embodiments, a display unit 1011 of a handheld device according to one embodiment of the invention can present not only an image 1011 a of a target skin region but also a graphical element 1011 b , e.g., a circle, that schematically depicts the cross-section of the treatment beam relative to the target region. in some embodiments, the user can select the portion of the target region identified by the graphical element 1011 b , e.g., the portion circumscribed by the circle, for magnified viewing. for example, with reference to fig. 11 , the handheld device can provide a menu 1111 to a user in a portion of the display utilized for displaying images, or in a separate display, that can be navigated to select commands for controlling selected display characteristics of the image of the target region. for example, the menu can provide commands for magnifying the portions of the image associated with a portion of the target region to which treatment radiation is being applied. such magnification can be achieved, for example, automatically in response to the user's selection by sending appropriate signals to a zoom lens system of the handheld device, such as the zoom lens assembly shown in the above handheld device 112 ( fig. 4a ). for example, a piezoelectric element electrically coupled to a movable lens of a zoom lens assembly can be activated in response to the user's selection to move that lens, thereby modifying the magnification of the displayed image of the target region. the graphical elements suitable for displaying the position of a treatment beam relative to an image of a target region are not limited to that described above. for example, referring again to fig. 10 , a cross-hair 1011 c can be employed to denote the center of the treatment beam's cross section. such visual aids facilitate positioning of the handheld device relative to a patient's skin so as to more effectively apply treatment radiation to a portion of a target region whose image is displayed. these alignment features can significantly increase efficacy and safety of the treatment. for example, in the absence of such features, it is difficult to position small treatment beams (e.g., spot size less than 3 mm) on small treatment targets, such as vessels. with reference to fig. 11b , a handheld device 1112 according to one embodiment of the invention can include a microprocessor 1113 electrically, or optically or via a wireless connection, coupled to an image capture device 1114 to receive images acquired by the image capture device. the microprocessor can utilize these images to monitor an applied treatment. for example, the microprocessor can be programmed to compare changes in selected parameters of the skin tissue (e.g., color of a vessel) extracted from the acquired images with threshold values for these parameters stored, for example, in a database 1115 . the database can be maintained in the handheld device, or alternatively, the needed data can be downloaded to the device from a remote database. by way of example, comparison of color of a vessel, pigment lesion, tattoo irradiated to cause its coagulation can signal that the treatment has been successful. upon detecting threshold values for one or more selected parameters, the microprocessor can alert a user, e.g., by providing a visual or audible signal, that the parameters have reached the preset threshold values. the threshold values can signal, for example, completion of a treatment protocol, or onset of an undesirable condition, e.g., the temperature of skin exceeding a threshold value. in some embodiments, the handheld device can track the position of a target region, e.g., a treatment site, which can be identified by a marker in an image, from one image to the next. for example, with reference to fig. 12 , a marker 1215 is provided on an image 1216 of a target skin region to identify a selected site, e.g., a treatment site. a subsequent image 1217 may obtained such that it is shifted relative to the image 1216 (for example, a result of movement of the handheld device). in these embodiments, the position of the marker is tracked such that it can be presented at the appropriate location of the image 1217 identifying the selected site in the new image. such tracking can be particularly advantageous when one image is shifted relative to a subsequent image, for example, as a result of motion of the handheld device. more specifically, in some embodiments, the microprocessor can implement an algorithm by which a marker placed on one image to identify a selected site (e.g., the treatment site) is transferred to a subsequent image while taking in account the motion of the image capture device between acquisition of the two images. in one exemplary tracking algorithm, the motion of an image pixel can be modeled as a combination of translation in the image plane (herein referred to as x-y plane) and rotation about an axis perpendicular to this plane. the following notations are employed in describing the algorithm: x, y denote a pixel coordinates, vx, vy velocity components of a pixel along the x and y coordinates; ux, uy indicate components of translation velocity (the same for all pixels in each image but may vary from one image to another); rx, ry denote the coordinates of the center of rotation at which the rotation axis cross the x-y plane (all pixels in each image rotate around the same center but the center may vary from one image to another); and co denotes the angular velocity of rotation. an optical flow model of the pixels can then be described by the following relations: vx=ux −ω·( y−ry ), vy=uy +ω·( x−rx ). (1) the above equations can be cast in a linear format by introducing variables x 1 , x 2 and x 3 defined as follows: x 1 =ux+ω·ry, x 2 =uy−ω·rx, x 3 =ω. (2) more specifically equations (1) take the following form when the variables x 1 , x 2 and x 3 are employed: vx=x 1 −y·x 3 , vy=x 2 +x·x 3 . (3) the following optical flow constraint equation can be utilized to determine the change in the position of a pixel between images: wherein i(x,y,t) represents the pixel brightness at a location (x,y) in an image at a time t. utilizing the notations ix, iy and it for the derivatives in equation (4) and substituting values for vx and vy defined by equations (3) into equation 4, the following equation is yielded: ix·x 1 +iy·x 2 +( x·iy−y−ix )· x 3 =−it. (5) the above equation (5) should be valid for every point of an image. when a region of the image represented by several pixels is selected, a system of equations can be obtained, which can be defined as follows: ix k ·x 1 +iy k ·x 2 +( x k ·iy k −y k ·ix k )· x 3 =−it k , (6) wherein the index k=1, 2, . . . n can represent the point number. the coefficients of x 1 , x 2 and x 3 in the above set of equations can be represented by the following matrix: by way of example, if the number of points (n) is selected to be three (n=3), then a is a square matrix, and the values of x 1 , x 2 and x 3 can be obtained by utilizing the following relation: where a −1 is the inverse of the matrix a. in many embodiments of the invention, the number of points is chosen to be much larger than 3 so that the matrix a is not square and the system of equations (6) is redundant. utilizing the least square criteria, the following solution can be obtained: the algorithm for tracking a marker initially positioned at x m ,y m in a first image can then include the steps of choosing a number of points (preferably larger than 3) in a central portion of the first image and evaluating derivatives ix k , iy k at these points to generate the matrix a. in many embodiments, the determinant of the matrix a t a is calculated to ensure that it is not too small. if the determinant is too small, additional points can be selected and the matrix a regenerated. using the first image and a second image, the time derivative it k are evaluated at the selected points (e.g., by assuming dt=1). the above relation (9) is then employed to evaluate x 1 , x 2 and x 3 . the values of vx and vy are evaluated at the marker position (x=x m , y=y m ). the marker position in the second image can then be determined as follows: x m →x m −vx·dt, y m →y m −vy·dt; dt=1. the above steps can be repeated for the subsequent images. with reference to fig. 13a , in another embodiment, refractive illumination waves, or evanescent waves, traveling at an interface of an optical element 1309 and the surface of an observation area of a patient's skin can be employed to illuminate a skin surface or a thin subsurface layer of the skin for imaging thereof by an image capture device 1303 . this embodiment can be used for precise imaging and control of skin surface conditions, for example, stratum corneum structure, pore size, sebaceous follicle opening, hair follicle opening, skin texture, wrinkles, psoriasis. more particularly, the optical element 1309 , which is disposed over the observation area, is selected to be substantially transparent to radiation emitted by the light source 1301 , which is optically coupled to the element 1309 . by control of refractive index of the guiding element and incident angle of the illumination radiation at the skin contact surface of the guiding element, imaging contrast of a visualized target can be enhanced. the light source 1301 can illuminate the optical guidance element 1309 from a side surface thereof. a portion of the light entering the optical element 1309 is totally internally reflected at the interface of the optical element and the patient's skin or partly penetrates into the skin at a control angle while generating refractive coupled illumination light waves traveling along the interface as surface or waveguide electromagnetic waves that penetrate to a depth of the patient's skin. such refractive coupled illumination waves can illuminate a subsurface region of the patient's skin, e.g., stratum corneum, epidermis or a top portion of the dermis up to 300 microns depth. depth of penetrations into the skin depends on the illumination wavelength, angle of incidence as, the refractive index of the coupling element 1309 (n 1 ) and effective refractive indices of skin layers, such as stratum corneum (n 2 ), epidermis (n 3 ), upper dermis (n 4 ) and deep dermis (n 5 ), where n 2 >n 3 >n 4 >n 5 . a portion of the refractively coupled illumination light is scattered by the target 1307 . the scattered light can then be focused by the optical system 1304 onto the image capture device 1303 to generate an image of the subsurface region. the contrast of the target image is maximized as the skin structures below the target cause minimal scattering light noise. the refractive coupling of the illumination wave can be optimized for different depths of penetration or for maximum skin resolution. for example, if an incident angle (α 1 ) is less than arcsin(n 2 /n 1 ) (α 1 <arcsin(n 2 /n 1 )), the illumination light can penetrate into the skin. if arcsin(n 3 /n 1 )<α 2 <arcsin(n 2 /n 1 ), the illumination wave propagates mostly into stratum coreum. if arcsin(n 4 /n 1 )<α 2<arcsin(n 2 /n 1 ), the illumination wave propagates mostly into epidermis and stratum corneum. if arcsin(n 5 /n 1 )<α 2 <arcsin(n 2 /n 1 ), the illumination wave propagate mostly into upper dermis, epidermis and stratum corneum. these conditions are applicable for wavelengths with low absorption and scattering in the skin bulk (500–1400 nm, 1500–1800 nm). if α 3 >arcsin(n 2 /n 1 ), the illuminating light totally internally reflects from contact surface of coupling element 1309 . in this case, an image on imaging capture device 1303 looks like uniform field and can not be used for subsurface target visualization. however, this condition can be very effective for obtaining high contrast image of skin surface. for example, with reference to fig. 13b , the total internal reflection mode can be used for visualization of skin surface irregularities, holes in stratum corneum, distribution on the skin surface of sebum, bacteria, water, oil, pores, glands and follicles opening. if α 4 <arcsin(n 2 /n 1 ), the illumination light penetrate into the skin and this contact area 1310 is imaged on 1303 as bright or a black spot, depending on the initial adjustment of the image capture device. but if arcsin(n 6 /n 1 )<α, where n 6 is reactive index of air in the gap 1311 or lotion which fills this gap, the illumination light totally reflects from the contact surface and 1311 is invisible to the image capture devise 1303 . as a result, a skin texture image can be acquired by the image capture device 1303 . in other embodiments, the total internal reflection from a contact surface of the element 1309 with the skin can be interrupted by a material on the skin having a high absorption coefficient at the illumination wavelengths. for example, for detection of water distribution on the skin surface, radiation with wavelengths around 1450, 1900 or 2940 nm can be used. further, wavelengths corresponding to the peaks of lipid absorption can be employed for visualization of oil or sebum distribution on the skin. by way of example, this embodiment can be used for control of topical drug or lotion distribution on the skin. further, a lotion (not shown) can be applied to the skin surface 1306 below the optical element 1309 . the lotion's refractive index can be selected to adjust the penetration depth of photons illuminating the subsurface region, thereby controlling the depth of observation. the use of refractively coupled illumination waves for imaging shallow subsurface regions of a patient's skin can provide certain advantages. for example, the evanescent waves, which exponentially decay within the skin, can effectively illuminate a selected subsurface region of interest and not deeper regions. this selective illumination advantageously enhances signal-to-noise ratio of an image generated by capturing photons reflected from the skin in response to illumination. the above exemplary system in which refractively coupled illumination waves are employed to image subsurface skin regions can be incorporated in a handheld device according to one embodiment of the invention. in some cases, the optical guidance element 1309 , in addition to facilitating generation of illumination subsurface waves, or evanescent waves, can also extract heat from the skin portion with which it is in thermal contact. with reference to fig. 14a , in some embodiments, the handheld device can include an array of capacitive, piezo and/or optical sensors 1402 that can be coupled to a target treatment area to provide information regarding selected properties thereof. for example, an array of capacitive sensors can be employed to generate a dielectric image of the treatment area before, during and/or after irradiation of the target area 1401 by a beam 1403 of electromagnetic radiation or any other suitable energy source. for example, capacitive touch sensors marketed by orient drive, inc. of mountain view, calif. under the trade designation mmf200-0d1-01 can be utilized for this purpose. this sensor is marketed as an integrated asic having a processor as well as sram and flash memory. other sensors that do not include integrated processor and/or memory can also be utilized in the practice of the invention. the resolution of the sensors can be selected to be sufficiently high to distinguish a treatment target, e.g., a vein, from its surrounding area. the data obtained by the sensor array can be transmitted to a display 1405 mounted to the device's housing for presentation to a user in a selected format. for example, the display can present dielectric data as a false color image in which each color hue represents a measured value of dielectric constant. with reference to fig. 14b , in another embodiment, a diagnostic/therapeutic dermatological handheld device according to the teachings of the invention can include, in addition to an array of capacitive, piezo or optical sensors 1402 coupled to a display, a plurality of electrodes or transducers 1405 that can be disposed in proximity of a selected target area so as to couple an electrical current or acoustic energy into the patient's body 1401 . optical sensor 1402 in this embodiment can be built as a confocal microscope or an optical coherent tomography head. fig. 15 schematically depicts a cross-sectional view of a handpiece dermatological device according to the teachings of the invention that includes a housing 1508 into which a waveguide 1502 , for example, an optical fiber, is coupled to transmit energy, e.g., electromagnetic energy, from a source (not shown), e.g., a source remotely located from the device, to the handpiece for delivery onto a treatment area 1501 . in this embodiment, the waveguide 1502 is an optical fiber that is optically coupled to a lens that focuses light delivered by the fiber onto a selected treatment area. a beam splitter 1504 allows the light directed by the lens 1503 towards the treatment area 1501 to pass through while it diverts a portion of light reflected from the treatment area, either in response to illumination by the treatment beam or ambient illumination, or in response to illumination by a separate light source, to an image capture device 1506 via an optical system 1505 . the image capture device 1506 in turn generates an image of the treatment area, or a portion thereof, and transmits the image to a display 1507 for viewing by a user. fig. 16a schematically illustrates another embodiment of a handpiece device 1620 according to the teachings of the invention that includes a housing 1609 having a head for delivering energy generated by a source 1602 disposed in the housing to a target treatment area. more particularly, a beam formation system 1603 , e.g., a lens, disposed in the housing directs the energy generated by the source 1602 onto the treatment area 1601 . the energy source 1602 can be, for example, a radiation source, such as a laser, a lamp or an led. alternatively, the energy source can be a particle source, such as dermal abrasion particle sources. an illumination source 1606 , for example, an led, illuminates the treatment area, or a selected portion thereof. at least a portion of light reflected from the treatment area, for example, in response to illumination by the source 1606 , is imaged by a focusing or optical system 1604 , for example, a lens, onto an image capture device 1605 , e.g., a ccd camera, that generates an image of the treatment area. the image is transmitted to a display device 1608 , mounted onto the housing, for viewing by a user. the exemplary handpiece 1620 further includes a contact cooling window 1607 that thermally couples to a selected portion of the patient's skin so as to cool the patient's epidermis in the area of the skin exposed to treatment energy as the energy is deposited into a target treatment region. the cooling window 1607 is substantially transparent to both the treatment energy as well as the optical radiation generated by the light source 1602 . fig. 16b schematically illustrates that a memory unit 1610 can be incorporated in the handheld device 1620 for storing images obtained by the image capture device 1605 . in addition, a communications interface 1611 allows the device to communicate, for example, via a wireless protocol, with an external computer. the communications interface 1611 allows for the transfer of images obtained by the image capture device 1605 to the external computer 1612 , either in real time, or with a selected delay via downloading images stored by the memory unit 1610 onto the computer. those having ordinary skill in the art will appreciate that other components, such as, processors, can also be included in the device to perform desired tasks. a variety of designs can be employed for constructing a handheld dermatological device according to the teachings of the invention, such as the device schematically depicted above in figs. 4a and 4b . by way of example, fig. 16c schematically illustrates a handheld dermatological device 1620 according to another embodiment of the invention that includes a housing 1622 having an enclosure 1624 in which various components of the device, for example, a light source, such as solid state laser together with optics for delivering radiation to a treatment area, and a ccd camera 1626 for imaging the treatment area, are disposed. the enclosure includes a treatment head 1628 , such as a contact tip, at a proximal end thereof for delivering treatment energy to a selected target area, for example, via a window 1630 that can also function as a cooling element. further, a display 1632 is mounted to the enclosure at a distal end thereof that allows a user to view the images captured by the ccd camera 1626 . the housing 1622 further includes a handle 1634 that allows a user, a medical professional or a home user, to hold and manually manipulate the device for delivering treatment energy to a target area. with reference to fig. 16d , a handheld dermatological device 1630 according to another embodiment of the invention includes a housing 1622 formed of an enclosure 1624 and a handle 1634 . the enclosure 1624 includes an optically transparent element 1650 mounted to a head portion thereof through which treatment radiation can be delivered to a target area. the enclosure further includes an opening 1652 that allows a user to directly view, via the transparent element 1650 , a target area, albeit at a slanted viewing angle. natural light from the sun, a cabinet lamp or a head lamp/led projector can be used for illumination of treatment area through opening 1652 to provide natural color of the skin. in addition, a display is mounted to the housing to allow the user to view an image of the treatment area obtained by an image capture device (not shown) incorporated in the housing. fig. 17 schematically illustrates another embodiment of a handheld dermatological device 1720 according to the teachings of the invention that includes a source 1702 for generating therapeutic energy, e.g., electromagnetic, acoustic radiation or dermal abrasion particles, and a beam forming system 1703 for focusing the energy onto a selected target area inside a housing 1709 . one or more light sources 1702 or 1706 can illuminate the target area to allow an image capture device 1705 to obtain images of this area for presentation to a viewer via a display 1708 mounted to the housing. this embodiment further includes a non-contact cooling system 1707 for cooling the target area, e.g., during application of the treatment energy. the non-contact cooling system can be, among other choices, a spray unit that sprays a suitable coolant onto the treatment area, or it can be a system for generating an air flow over the treatment area. in this case, the imaging system can also be used to control cooling of the skin by a spray, for example, by monitoring for ice formation or “lake effects,” to prevent skin from over or under cooling. fig. 18 schematically illustrates another handheld dermatological device 1820 according to another embodiment of the invention that includes a housing 1811 for enclosing a lamp source (e.g., arc, halogen, metal halide) or solid state lighting sources (led) 1802 for generating radiation, e.g., broadband radiation, and a reflector 1808 that directs at least a portion of the generated radiation to a the treatment skin region or waveguide or an optically transparent window 1809 for delivery to a target treatment area. the exemplary device 1820 further includes a light source 1806 , such as an led, a laser, or a microlamp, that illuminates the target treatment area, or a portion thereof, via an optical coupling system 1807 , e.g., a lens or prism. an optical coupling system 1805 , e.g., a lens, focuses light reflected from the treatment area onto an image capture device 1804 , e.g., a ccd camera, mounted to the device's housing for generating an image of the treatment area. the image is transmitted to a display 1810 , mounted to the housing 1811 , for viewing by a user. in some embodiments, one or more filters can be optically coupled to the lamp in order to select one or more wavelength bands from a broad spectrum generated by the lamp for causing desired therapeutic and/or cosmetic effects. the light from lamp 1802 can be used for illumination of the treatment area. several lamps like 1802 can be mounted in the same reflecting chamber. illumination sources 1806 can be mounted around skin treatment region or waveguide 1809 to provide illumination of a treatment target by banana photons. the light from illumination sources 1806 can be directly coupled to the skin. further, a shield between 1806 and the observation skin region can be used. the depth of the illuminated area and the visualization depth into the skin can be optimized by control of incident angle of the illumination light on the 1809 contact surface, the observation angle of the optical system 1805 , refractive indices of the waveguide 1809 , optics 1805 , 1807 and lotion, if utilized, between waveguide 1809 and the skin in a manner similar to that described above in connection with figs. 13a and 13b . those having ordinary skill in the art will appreciate that various changes can be made to the above embodiments without departing from the scope of the invention.
011-807-203-914-029	KR	[ "JP", "KR", "CN", "US" ]	H04N7/173,H04N21/431,H04N7/15,H04N5/16	2005-01-07T00:00:00	2005	[ "H04" ]	multimedia signal matching system and method for performing picture-in-picture function	<p>problem to be solved: to provide a multimedia signal matching system and method for performing a picture-in-picture (pip) function. <p>solution: the system includes: at least one set-top box including a decoder for decoding signals in a reference format and generating a control signal for performing the pip function; and a multimedia matching device 203 for receiving multimedia signals in various formats from a broadcast communication network, processing the received signals into signals with the reference format responsive to the control signal. the multimedia matching device 203 includes: a reference signal processor 300 for extracting video and audio signals subjected to the pip; a non-reference signal processor 310 for transcoding a multimedia signal in a non-reference format into a signal in the reference format; and a multimedia matching module 312 for performing the pip of video signals using the control signal and for selecting an audio signal to be multiplexed into a multimedia signal format decodable by the set-top box. <p>copyright: (c)2006,jpo&ncipi	1 . a multimedia signal matching system for performing a picture-in-picture function, comprising: at least one set-top box including a decoder for decoding signals in a predetermined reference format and for generating a control signal for performing the picture-in-picture function; and a multimedia matching device for receiving multimedia signals in various formats from a broadcast communication network, processing the multimedia signals into the predetermined reference format in response to the control signal, wherein said multimedia matching device includes: a reference signal processor for extracting video and audio signals from the multimedia signals to perform the picture-in-picture function; a non-reference signal processor for transcoding the multimedia signals into the predetermined reference format if the multimedia signals are in a non-reference format; and a multimedia matching module for performing the picture-in-picture function for a display of the video signals in response to the control signal and selecting an audio signal to be multiplexed into a multimedia signal format decodable by the set-top box. 2 . the multimedia signal matching system as claimed in claim 1 , further comprising a user display device for receiving picture-in-picture applied multimedia signals from the set-top box. 3 . the multimedia signal matching system as claimed in claim 1 , wherein said reference signal processor further includes a demultiplexer for demultiplexing the multimedia signals in the predetermined reference format into the video and audio signals for the picture-in-picture application. 4 . the multimedia signal matching system as claimed in claim 1 , wherein said non-reference signal processor of the multimedia matching device includes: an ethernet processor for processing an ethernet signal and extracting the multimedia signals in the non-reference format, a video conference call signal processor processing a video conference call signal in response to the control signal; and a decoder for transcoding the multimedia signals in the non-reference format into the predetermined reference format. 5 . the multimedia signal matching system as claimed in claim 4 , wherein said control signal includes a request for the picture-in-picture application. 6 . the multimedia signal matching system as claimed in claim 1 , wherein said multimedia matching module includes: a picture-in-picture generator for receiving the video signals subject to the picture-in-picture application and allocating resources to generate a picture-in-picture applied video stream in response to the control signal; an audio signal selector for receiving the audio signals and selecting an audio signal for reproduction to generate an audio signal stream in response to the control signal; and a multiplexer for multiplexing the picture-in-picture applied video stream and the audio stream to the set-top box. 7 . the multimedia signal matching system as claimed in claim 6 , wherein said control signal includes a resource allocation information necessary to form picture-in-picture multimedia signals. 8 . the multimedia signal matching system as claimed in claim 1 , wherein said set-top box decodes signals using the same reference format of the multimedia signals outputted from the multimedia matching device. 9 . a method for matching multimedia signals to perform a picture-in-picture function, the method comprising the steps of: receiving a multimedia signal and a control signal for performing the picture-in-picture function; determining whether the received multimedia signal is in a reference format; performing transcoding to convert the signal into the reference format if the received multimedia signal is not in the reference format; extracting video and audio signal for picture-in-picture application if the received multimedia signal is in the reference format,; and applying the picture-in-picture function to the extracted video signal and multiplexing the video signal and a selected audio signal to a set-top box. 10 . the method as claimed in claim 9 , wherein the step of transcoding comprises the steps of: demultiplexing the multimedia signals and extracting a video signal subject to the picture-in-picture application, and processing the extracted video signal in response to the control signal. 11 . the method as claimed in claim 9 , wherein said control signal includes a request for the picture-in-picture application and a resource allocation necessary to perform the picture-in-picture function. 12 . the method as claimed in claim 9 , further comprising the step of determining whether the non-reference format multimedia signals is an ethernet signal, and if not, decoding the received multimedia signals without performing the transcoding step. 13 . a multimedia signal matching system for performing a picture-in-picture function, comprising: a multimedia matching device, coupled to at least one set-top box, configured to receive multimedia signals in various formats, said multimedia matching device including a reference signal processor for extracting video and audio signals from the multimedia signals to perform the picture-in-picture function and a non-reference signal processor for transcoding the multimedia signals into a predetermined reference format if the multimedia signals are not in the predetermined reference format. 14 . the multimedia signal matching system as claimed in claim 13 , further comprising a multimedia matching module for performing the picture-in-picture function for a display of the video signals and selecting an audio signal to be multiplexed into a multimedia signal format decodable by the set-top box. 15 . the multimedia signal matching system as claimed in claim 13 , wherein the at least one set-top box including a decoder for decoding signals in the predetermined reference format. 16 . the multimedia signal matching system as claimed in claim 13 , further comprising a user display device for receiving picture-in-picture applied multimedia signals from the set-top box for a subsequent display. 17 . the multimedia signal matching system as claimed in claim 14 , wherein said set-top box decodes signals using the same reference format of the multimedia signals outputted from the multimedia matching device.	claim of priority this application claims priority to an application entitled “multimedia signal matching system and method for performing picture-in-picture function,” filed with the korean intellectual property office on jan. 7, 2005 and assigned serial no. 2005-1877, the contents of which are incorporated herein by reference. background of the invention 1. field of the invention the present invention relates to a broadcast-communication convergence system, and more particularly to a multimedia signal matching system and a method for performing a picture-in-picture function on video signals of various formats. 2. description of the related art network convergence describes an integrated networking environment, including voice, video and data transmissions, that has evolved to include integrated services and applications through broadcast and communication networks. broadcast services through a communication network include tv broadcast services through the internet, video-on-demand (“vod”) services offered by existing broadcast stations, and direct satellite broadcasting using communication satellites. communication services through a broadcast network, on the other hand, include value-added communication services, such as internet or telephone services, using a cable network. broadcast-communication convergence is backed up by hardware developments, such as high-speed computer networks, wide-spread deployment of internet access, and broadband communication networks, as well as by software development, such as digitalization of content with the advent of high definition television (“hdtv”), cable tv, and satellite tv. thus, current broadcast-communication systems are no longer limited to the simple functions of receiving and displaying broadcast signals, but are now offering broadcast services. accordingly, broadcast-communication systems, which receive multimedia signals in various formats from converged broadcast-communication networks, must decode the received signals and display the decoded signals. a variety of transmission technologies have been suggested and developed to provide broadcast and communication convergent services. multimedia signals (i.e., video and audio signals) are delivered in diverse formats to the users through the broadcast communication network 101 . transmission formats of multimedia signals include an mpeg (moving picture expert group) format. mpeg is a working group formed to device standards for the encoding both video and audio signals. as a format of broadcast signals, mpeg is divided into a number of formats. to transmit multimedia signals to a communication system, diverse formats for video and audio signals are used. picture-in-picture (“pip”) applications, which serves to display two video signals to display on the same screen simultaneously, can be implemented when two multimedia signals are received from different sources. there is no problem when signals in the same format are received and displayed at the same time. to receive and display video signals in different formats, multiple decoders are required for the pip application. fig. 1 schematically illustrates the receiving end of a conventional digital broadcast communication system. as shown, the conventional receiving end of, a digital broadcast communication network 101 , contains set-top boxes 103 and 107 for receiving broadcast communication signals from the broadcast communication network 101 and user display devices 105 and 109 . set-top boxes 103 and 107 include multiple decoders to decode multimedia signals received in different formats. these set-top boxes 103 and 107 convert signals received from multiple channels into binary signals through a demodulator. the binary signals are divided into audio, video, and data signals and decoded by a demultiplexer. the set-top boxes 103 and 107 convert the received signals into signals displayable on the display devices 105 and 109 . as stated earlier, to perform a pip function on video signals in various formats in conventional broadcast-communications networks requires set-top boxes 103 and 107 to include additional decoders in order to decode each multimedia format. if two or more set-top boxes are used in a home, there will be no problem in receiving multimedia signals in one and the same format. however, multimedia signals in various formats can only be displayed in a pip mode when each set-top box has multiple decoders for decoding the various formats. unless such multiple decoders are provided, the pip function cannot be implemented. summary of the invention accordingly, the present invention has been made to overcome the above-mentioned problems and provides additional advantages by providing a multimedia signal matching system and method for performing a picture-in-picture function. one aspect of the present invention is to provide a multimedia signal matching system and method for receiving broadcast signals in different formats and for performing a picture-in-picture function using the received signals. still another aspect of the present invention is to provide a multimedia signal matching system and method for providing video signals to a plurality of set-top boxes having a single decoder through a multimedia matching device having a picture-in-picture function. in one embodiment, there is provided a multimedia signal matching system for performing a picture-in-picture function which includes: at least one set-top box having a decoder for decoding multimedia signals in a predetermined reference format and for generating a control signal to perform the picture-in-picture function; and a multimedia matching device for receiving multimedia signals in various formats from a broadcast communication network and the control signal from the set-top box, for processing the received multimedia signals in the predetermined reference format using the control signal, and for sending the multimedia signals to the set-top box. the multimedia matching device includes: a reference signal processor for receiving a multimedia signal in the reference format and for extracting video and audio signals from the received multimedia signal to perform the picture-in-picture function; a non-reference signal processor for receiving a multimedia signal in a non-reference format, for transcoding the received multimedia signal to a signal in the reference format, and for extracting video and audio signals to perform the picture-in-picture function; and a multimedia matching module for performing the picture-in-picture function for display of the video signals using the control signal and for selecting an audio signal to be multiplexed into a multimedia signal format decodable by the set-top box. brief description of the drawings the above features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: fig. 1 is a view schematically illustrating a receiver of a conventional digital broadcast communication system; fig. 2 is a view schematically illustrating a multimedia signal matching system for performing a picture-in-picture function according to the present invention; fig. 3 is a view schematically illustrating the structure and components of a multimedia matching device according to the present invention; fig. 4 is a view schematically illustrating the operation of a multimedia signal matching system for performing a picture-in-picture function according to the present invention; and fig. 5 is a flow chart showing a process of matching multimedia signals to perform a picture-in-picture function according to the present invention. detailed description hereinafter, a multimedia signal matching system and method for performing a picture-in-picture function on video signals in various formats according to an embodiments of the present invention will be described with reference to the accompanying drawings. it is noted that the same elements are indicated with the same reference numeral throughout the drawings. for the purposes of simplicity and clarity, a detailed description of well known functions and configurations incorporated herein will be omitted as it may make the subject matter of the present invention unclear. referring to fig. 2 , at the receiving end of a digital broadcast system, according to the embodiment, a multimedia matching device is provided for performing the pip function and delivering multimedia signals to each set-top box 205 and 209 . it should be noted that although a limited number of set-top boxes and displays for purpose of illustration, in practice, the teachings of the present invention may be include a much larger number of set-top boxes. in operation, multimedia signals (i.e., video and audio signals) are received from a broadcast communication network 201 . a multimedia matching device 203 converts the video signal into a predetermined reference format and performs the pip function. when receiving video signals in different formats from the broadcast communication network 201 , the multimedia matching device 203 converts the received video signals into a single reference format and then applies the pip function to the converted reference format signals. as a result, the pip-applied video signals are delivered to set-top boxes 205 and 209 in a predetermined reference format. thus, the set-top boxes 205 and 209 receive signals delivered from the multimedia matching device 203 and convert the received signals to be displayable on user display devices 207 and 211 using a single decoder. in the prior art, multiple decoder were required in order to convert the various different formats of the received multimedia signals into a single reference format. in the present embodiment, decoders are added to a single device, a multimedia matching device 203 according to the number of different formats of the received signals, therefore, the pip function can be implemented regardless of an increase in the number of formats to be converted. the user display devices 207 and 209 receives the pip-applied multimedia signals from the set-top boxes 205 and 209 and display the received multimedia signals for viewing. fig. 3 which schematically illustrates the structure and components of the multimedia matching device according to the embodiment of the present invention. the multimedia matching device 203 includes a reference signal processor 300 , a non-reference signal processor 310 , and a multimedia matching module 312 . for the purpose of illustration, it is assumed that multimedia signals inputted to the multimedia matching device 203 include a video signal in mpeg-2 format (reference format) and a video conference call signal in mpeg-4 format. the multimedia matching device 203 receives two multimedia signals (a video signal in mpeg-2 and a video conference call signal in mpeg-4). the video signal in mpeg-2 is a reference format signal. the multimedia matching device 203 applies pip to the received multimedia signals and transmits the pip-applied multimedia signals in the reference format (i.e., mpeg-2) to the set-top boxes. the reference signal in mpeg-2 format is inputted to the reference signal processor 300 , whereas the non-reference signal in mpeg-4 format is inputted to the non-reference signal processor 310 . the reference signal processor 300 , for processing a signal in the reference format includes a demultiplexer 301 . the received mpeg-2 signal is demultiplexed into video and audio signals, which are transmitted to a pip generator 309 and an audio selector 311 , respectively. the non-reference signal processor 310 receives a signal in a non-reference format and performs transcoding or decoding of the signal. particularly, to process a video conference call signal which is an ethernet communication signal, the non-reference signal processor 310 comprises an ethernet processor 303 , a video conference call signal processor 305 , and a decoder 307 . when a non-reference format signal other than an ethernet signal is received, the non-reference signal processor can process the received signal using the decoder 307 only. when communication signals including a video conference call signal in mpeg-4 are inputted to the non-reference signal processor, the inputted signals are processed by the ethernet processor 303 for the pip application. the ethernet processor 303 demultiplexes the communication signals and extracts the video conference call signal in mpeg-4 which will be subject to the pip application. only the multimedia signal extracted from the communication signals for the pip application, i.e., the video conference call signal, is sent to the video conference call signal processor 305 . the video conference call signal processor 305 receives a control signal, including information about a connection session and a pip request of the video conference call, from the set-top boxes and processes the conference call signal using the control signal. the conference call signal processor 305 , in response to the control signal from the set-top boxes, sends the conference call data to the decoder 305 . the decoder 305 decodes then video and audio signals for the video conference call. more specifically, the decoder 305 performs transcoding or decoding to convert the format of the inputted signal. the conference call signal in mpeg-4 format is decoded to a compression stream in a standardized mpeg-2 format through a transcoding or decoding process. note that transcoding is a process of re-encoding a pre-compressed stream to a lower bit rate or a lower resolution or converting a stream format to another stream format in realtime. of the signals converted into an mpeg-2 stream by the decoder 309 , video signals are transmitted to the pip generator 309 , and audio signals are transmitted to the audio signal selector 311 . hence, the decoder 307 performs both transcoding of the received signals and decoding for the subsequent display. the multimedia matching module 312 includes a pip generator 309 , an audio signal selector 311 , and a multiplexer 313 . video signals outputted from the demultiplexer 301 and the decoder 307 are inputted to the pip generator 309 . the pip generator 309 receives a control signal, including resource allocation information necessary to form pip multimedia signals, from the set-top boxes and applies the pip function to the received video signals according to the control signal. the pip-applied video signals are outputted to the multiplexer 313 . the demultiplexed audio signals are inputted to the audio signal selector 311 . the audio signal selector 311 receives the demultiplexed audio signals and a control signal (i.e., a signal for selecting an audio signal to be reproduced) from the set-top boxes in order to select an audio signal. the audio signal selector 311 then generates an audio signal stream and outputs the generated stream to the multiplexer 313 . the multiplexer 313 receives the pip-applied video signals and the selected audio signal, then multiplexes the received video and audio signals and sends the multimedia signals in mpeg-2 stream to the set-top boxes. in the above, communication signals including a video conference call signal have been explained as an example of multimedia signals, and mpeg-2 has been explained as a reference format. however, it should be noted that other formats can be set as a reference format according to the teachings of the present invention. when multimedia signals in various formats such as mpeg-4 and h.264 can be received, decoders can be added in parallel in the multimedia matching device 203 according to the diverse formats of the received signals, thus enabling the pip function on different format of signals. the video conference call signal processor 305 , pip generator 309 , and audio signal selector 311 receive a control signal from the set-top boxes and operate according to the received control signal. hereinafter, the signal flow between a multimedia matching device 203 , a set-top box 205 and 209 , and a user display device 207 and 211 to perform the pip function will be explained in detail with reference to fig. 4 . fig. 4 illustrates a multimedia signal matching system with a picture-in-picture capability according to the present embodiment. the multimedia signal matching system includes a user display device 400 , a set-top box 430 and a multimedia matching device 460 . when the user display device 400 generates a request for pip signals, the request is inputted to the multimedia matching device 460 through the set-top box 430 ( 401 ). upon receiving the request, the multimedia matching device 460 analyzes inputted multimedia signals ( 403 ) as explained above in reference to fig. 3 . then, the multimedia matching device 460 classifies the inputted signals according to their formats and processes the signals according to their video formats ( 405 ). when the multimedia signals are in a reference format, the multimedia matching device 460 demultiplexes the signals for the pip application to the video data. when the multimedia signals are not in the reference format, the multimedia matching device 460 converts the signals into the reference format using a decoder so that the pip function can be applied to the video data having the same reference format. for example, a signal in mpeg-2 is divided into video and audio signals. additionally, if a video conference call signal is received in the mpeg-4 format, it is converted to the mpeg-2 format. then, the pip function can be applied to the video signals in mpeg-2 reference format. consequently, a pip-applied mpeg-2 stream is formed ( 407 ) and sent to the set-top box 430 ( 409 ). the set-top box 430 converts the received mpeg-2 stream into a displayable video signal and sends the video signal to the user display device 400 ( 411 ). the user display device 400 receives the video signal and displays pip-applied video data ( 413 ). fig. 5 is a flow chart showing a process of matching multimedia signals to perform a picture-in-picture function according to the present embodiment. when a multimedia signal is inputted to the multimedia matching device from the broadcast communication network ( 501 ), the multimedia matching device determines whether the inputted multimedia signal is in a reference format that can be decoded by the set-top box ( 503 ). if the multimedia signal is not in the reference format, the multimedia matching device will transcode the signal to convert it into a reference format signal and will extract a video signal for pip application ( 505 ). if the inputted multimedia signal is in the reference format, the multimedia matching device will directly extract pip video data, without transcoding the signal ( 507 ). thereafter, a resource allocation is performed on the extracted pip video data ( 509 ). resource allocation is a process of allocating resources for the pip display of the two multimedia data on the basis of information—such as coordinates of a secondary pip image within a main image, vertical, and horizontal lengths of the secondary image, display order of the main and secondary images, transparency level of the secondary image, and an audio signal selected for reproduction. the multimedia matching device receives such control information from a control signal from the set-top box or the user display device. this type of control information can be included in a pip request signal. when the resource allocation is performed, a pip-applied stream is generated ( 511 ). then the pip video signals and the selected audio signal are inserted in the generated stream and sent to the user display device that will display the multimedia signals in pip mode ( 513 ). the present invention additionally provides a multimedia matching device in a multimedia signal matching system. the multimedia matching device includes a plurality of decoders which have been included in a set-top box in the prior art, thereby reducing the number of decoders needed in the set-top box. it is possible to receive multimedia signals in different formats and apply the pip function to display the signals on a single screen by increasing the number of decoders added to the multimedia matching device corresponding to the number of the different formats. accordingly, the set-top box can decode the signals outputted from the multimedia matching device using only a single decoder. the set-top box sends the decoded signals to the user display device. the components and operations for the pip application to the multimedia signals have been explained above, thus omitted to avoid redundancy. the multimedia signal matching system and method according to the present invention produce the following advantageous effects. as explained above, a multimedia matching device is used to receive multimedia signals in various formats and apply a pip function to the signals. a plurality of decoders is provided in the multimedia matching device, rather than in each set-top box. therefore, the pip application can function using multimedia signals in different formats, thereby improving the resource efficiency. each set-top box can decode the signals outputted from the multimedia matching device using only a single decoder and then send the decoded signals to the user display device. the multimedia matching device enables the user to enjoy a multimedia service and at the same time make a video conference call through a pip viewing picture. although preferred embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims, including the full scope of equivalents thereof.
013-125-194-513-796	JP	[ "JP", "US" ]	F16C33/32,C22C38/00,C22C38/18,F16C33/34,F16C33/62,C21D9/40	2002-10-24T00:00:00	2002	[ "F16", "C22", "C21" ]	bearing component	<p>problem to be solved: to provide a bearing component which has high damping capacity at a low production cost. <p>solution: the bearing component consists of high damping steel comprising, by weight, 0.2 to 0.6% c, 5.0 to 15.0% cr, 0.2 to 1.3% si and 0.05 to 0.20% n, and the balance fe with inevitable impurities. the steel is subjected to normal quenching treatment to control its surface hardness to ≥57 by rockwell c hardness. <p>copyright: (c)2004,jpo	1 . a bearing part comprising damping steel that contains from 0.2 to 0.6% by weight of c, from 5.0 to 15.0% by weight of cr, from 0.2 to 1.3% by weight of si, from 0.05 to 0.20% by weight of n, and comprises fe and inevitable impurities as the remaining. 2 . the bearing part according to claim 1 , wherein the damping steel is hardened in an ordinary manner to have a surface hardness, in terms of rockwell c hardness of at least 57. 3 . the bearing part according to claim 1 , wherein the cr content falls between 6.0 and 11% by weight. 4 . the bearing part according to claim 1 , wherein the cr content falls between 9.0 and 10% by weight. 5 . the bearing part according to claim 1 , wherein the n content falls between 0.09 and 0.15% by weight.	background of the invention the present invention relates to bearing parts such as rolling elements and bearing rings (races) that are required to have good dampability (shock absorbability). for recent machinery, not only high performance and accuracy but also noiselessness is an important factor in quality evaluation, and it is much desired that bearings could satisfy the requirement of noiselessness. for example, in rolling bearings for gear supports of transmissions, the bearing may act as a vibration-transmitting route to transmit gear-working vibration to the case and the vibration may cause noises. because of the limitations in planning transmissions, an additional damping member will be difficult to dispose between a bearing and a case since it may require an additional space and may cause stiffness reduction to increase working vibration. the present applicant has previously proposed bearing parts formed of damping steel containing from 0.2 to 0.6% by weight or c, from 5.0 to 15.0% by weight of cr and from 0.2 to 1.3% by weight of si, and comprising fe and inevitable impurities as the remaining, which have been treated for carbonization or carbonitriding to form a hardened layer on their surfaces (see patent reference 1). patent reference 1 jp-a-5-125488 the above bearing parts are formed of damping steel that contains from 0.2 to 0.6% by weight of c, from 5.0 to 15.0% by weight of cr and from 0.2 to 1.3% by weight of si, and comprises fe and inevitable impurities as the remaining, and therefore they ensure good dampability. in addition, they are treated for carbonization or carbonitriding to form a hardened layer on their surfaces. therefore, even when bearings that comprise the bearing part are used under the condition where lubricating oil is contaminated with impurities, for example, as in rolling bearings for gear supports of transmissions, the bearing parts may still ensure a satisfactory rolling fatigue life. however, the related bearing parts require the treatment of carbonization or carbonitriding to form a hardened layer on their surfaces, and are therefore problematic in that the thermal treatment is expensive and increases the production costs. summary of the invention an object of the present invention is to provide bearing parts of high dampability that solve the above-mentioned problems can be produced at low costs. the bearing parts of the invention are formed of damping steel that contains from 0.2 to 0.6% by weight of c, from 5.0 to 15.0% by weight of cr, from 0.2 to 1.3% by weight of si, from 0.05 to 0.20% by weight of n, and comprises fe and inevitable impurities as the remaining. the reasons for defining the alloy components are mentioned below. c: from 0.2 to 0.6% by weight. if the c content is smaller than 0.2% by weight, then the intended surface hardness could not be attained by ordinary hardening; but if larger than 0.6% by weight, then giant carbide may be readily formed in the steel that contains cr in the above-mentioned range, and the steel could not be sufficiently tough, and if so, in addition, fine cracks to be the starting points of flaking may be readily formed and propagated in the steel to shorten the rolling fatigue life of the bearing parts formed of the steel. moreover, the increase in the c content may lower the internal friction value of steel to thereby detract from the dampability thereof. accordingly, the c content should be defined to fall between 0.2 and 0.6% by weight. cr: from 5.0 to 15.0% by weight. cr improves dampability, but if its content is smaller than 5.0% by weight, it is ineffective. however, if the cr content is larger than 15.0% by weight, then giant carbide may be readily formed and the steel could not be sufficiently tough, and if so, in addition, fine cracks to be the starting points of flaking may be readily formed and propagated in the steel to shorten the rolling fatigue life of the bearing parts formed of the steel. accordingly, the cr content should be defined to fall between 5.0 and 15.0% by weight, but is preferably from 6.0 to 11% by weight, more preferably from 9.0 to 10% by weight. si: from 0.2 to 1.3% by weight. si is an element necessary for deoxidation in steel production, and it is effective for strengthening the solid solution of steel and for improving the temper softening resistance thereof to thereby prolong the bearing life of the steel. if deoxidation is not enough, oxide-type non-metallic inclusions will increase in steel, and they may be a source of stress concentration to give fine cracks that may be the starting points of flaking. thus formed, the fine cracks may be readily propagated in the steel to shorten the rolling fatigue life of the bearing parts formed of the steel. however, if the si content is smaller than 0.2% by weight, deoxidation in steel production will be insufficient; but if larger than 1.3% by weight, then the mechanical strength of steel will lower and, in addition, the workability such as malleability and machinability of steel will also lower. accordingly, the si content should be defined to fall between 0.2 and 1.3% by weight. n: from 0.05 to 0.20% by weight. n is an element necessary for making the steel have a surface hardness, in terms of rockwell c hardness (hrc) of at least 57 as a result of ordinary hardening. however, if the n content is smaller than 0.05% by weight, it is ineffective; but if larger than 0.20% by weight, then it lowers the internal friction value of steel to thereby detract from the dampability thereof. accordingly, the n content should be defined to fall between 0.05 and 0.20% by weight, but is preferably from 0.09 to 0.15% by weight. not interfering with the above-mentioned properties of steel, the bearing parts of the invention may contain mn, cu, ni, mo and others. since the bearing parts of the invention are formed of damping steel that contains from 0.2 to 0.6% by weight of c, from 5.0 to 15.0% by weight of cr, from 0.2 to 1.3% by weight of si, from 0.05 to 0.20% by weight of n, and comprises fe and inevitable impurities as the remaining, they are tough and ensure good dampability. in addition, their surface hardness can be increased through ordinary hardening. therefore, when the bearing parts, which are tough, are treated to have a surface hardness, hrc of at least 63, then they ensure a satisfactorily long rolling life even under the condition where lubricating oil is contaminated with impurities, for example, as in transmissions. moreover, since the bearing parts of the invention may be hardened in an ordinary manner, not requiring carbonization or carbonitridinq like that for the above-mentioned conventional bearing parts, they are inexpensive in point of their thermal treatment and their production costs are therefore low. the damping steel for the bearing parts of the invention maybe hardened in an ordinary manner to have a surface hardness, in terms of rockwell c hardness of at least 57. the bearing parts having a surface hardness, hrc of at least 67 ensure a long rolling life. detailed description of preferred embodiments the invention is described below with reference to its examples and comparative examples seven steel samples of different composition as in table 1 were prepared, and they were individually worked into bearing rings of rolling bearings in an ordinary manner. thus produced, the bearing rings were thermally treated as in table 1. the surface hardness hrc of each sample was measured. the data are given in table 1. table 1 surface material composition (wt. %) thermal hardness fe c cr si n treatment (hrc) example 1 basis 0.40 9.0 0.30 0.10 ordinary 63 hardening 1 comparative 1 basis 0.23 5.7 0.23 carbonitriding 63 example hardening 2 basis 0.58 13.5 1.25 carbonitriding 64 hardening 3 basis 1.01 1.41 0.22 ordinary 61 hardening 2 4 basis 0.20 0.75 0.20 carbonization 62 hardening 5 basis 0.65 8.96 0.83 ordinary 60 hardening 1 6 basis 0.64 9.06 0.24 ordinary 60 hardening 1 the condition for each thermal treatment in table 1 is mentioned below. carbonitriding hardening: the sample is carbonitrided at 930 c. for 3 hours, then nitrided at 850 c. for 5 hours, cooled in oil, and then tempered at 180 c. for 2 hours. ordinary hardening 1: the sample is heated at 1050 c. for 40 minutes for austenization, then cooled in oil, treated for subzero cooling, and then tempered at 180 c. for 2 hours. carbonization hardening: the sample is carbonized at 930 c. for 4.5 hours, then heated at 820 c. for 20 minutes, cooled in oil, and then tempered at 180 c. for 2 hours. ordinary hardening 2: the sample is heated at 840 c. for 40 minutes for austenization, then cooled in oil, and thereafter tempered at 180 c. for 2 hours. as is obvious from table 1, the surface hardness of the sample of example 1 is comparable to that of the samples of comparative examples 1 and 2, and is higher than that of the samples of comparative examples 3 to 6. next, the bearing ring of example 1 and comparative examples 1 to 6 was combined with a cage formed of spb1 and a rolling element formed of suj2, and assembled into a bearing. this was tested for its life. in the test, the lubricating oil is turbine oil vg68, the radial load is 918 kgf, the number of revolutions is 2500 rpm, and the number of n is 10. as a result, the life of the bearing with the bearing ring of example 1 was at least 1010 ⁷ (1010 ⁷ is the highest limit in the test). on the other hand, the b ₁₀ life of the bearing with the bearing ring of comparative examples 3 to 6 was 910 ⁶ . the life of the bearing with the bearing ring of example 1 is more than 10 times that of the bearing with the bearing ring of comparative examples 3 to 6. the life of the bearing with the bearing ring of comparative examples 1 and 2 was at least 1010 ⁷ , like that of the bearing with the bearing ring of example 1. the bearing with the bearing ring of example 1 and comparative example 3 was tested in an impact test for its vibration dampability. the vibration dampability of the bearing tested was derived from the ratio of the vibration input from the hammering outer ring (outer diameter, 62 mm) to the output to the pickup fitted to the outer ring (transmission coefficient). as a result, the vibration damping ratio of the bearing with the bearing ring of example 1 was 0.00037, and that of the bearing with the bearing ring of comparative example 3 was 0.00022. the vibration dampability of the bearing with the bearing ring of example 1 was better. in addition, the vibration dampability of the bearing with the bearing ring of example 1 was comparable to that of the bearing with the bearing ring of comparative examples 1 and 2.
013-940-764-001-372	US	[ "US" ]	F16K31/18	2010-03-18T00:00:00	2010	[ "F16" ]	balanced water-intake control valve	a balanced water-intake control valve includes an adjusting mechanism for the water-level between two linkage rods. the adjusting mechanism includes a first pivot guide, a second pivot guide, a lead screw and an adjusting nut. the first pivot guide is pivoted on the first linkage rod for driving a valve rod. the second pivot guide is pivoted on the second linkage rod connecting to a float body. the first and second pivot guides are connected by the lead screw at opposite ends. an adjusting nut is placed at the middle of the lead screw. by rotating the lead screw, the length between the first and second pivot guides changes. therefore, the upper limit of the water level can be adjusted by the user after installation of the control valve.	1. a balanced water-intake control valve comprising: a valve having a water channel, the valve including an upper valve base and a lower valve base; a valve rod movably disposed inside the valve, the valve rod including a valve stopper for sealing the water channel of the valve and a linkage hole, a portion of the valve rod comprising the linkage hole guided within the lower valve base; a first linkage rod pivotably connected to the lower valve base and passing through the linkage hole for driving the valve rod; a second linkage rod pivotably connected to the upper valve base; a float body connected to the second linkage rod; and a water-level adjusting mechanism, comprising: a first pivot guide pivotably connected to the first linkage rod, the first linkage rod engaging the valve rod at a location on the first linkage rod that is between a pivot point with the lower valve base and a pivot point with the first pivot guide; a second pivot guide pivotably connected to the second linkage rod; a lead screw with ends respectively screwing to the first pivot guide and to the second pivot guide; an adjusting nut placed in a middle portion of the lead screw to rotate the lead screw to change a distance between the first pivot guide and the second pivot guide, the lead screw having a clockwise screw portion screwing to one of the first pivot guide and the second pivot guide, and a counterclockwise screw portion screwing to the other one of the first pivot guide and the second pivot guide; a first constraining nut engaged on the lead screw between the first pivot guide and the adjusting nut; and a second constraining nut engaged on the lead screw between the second pivot guide and the adjusting nut. 2. the control valve as claimed in claim 1 , wherein a plurality of first through holes are formed in peripheries of the upper valve base and a plurality of second through holes are formed in peripheries of the lower valve base, the control valve further comprising a plurality of screw bolts inserted through the first through holes and the second through holes for mechanically joining the upper valve base and the lower valve base. 3. the control valve as claimed in claim 1 , wherein peripheries of a bottom of the upper valve base are formed as an external screw, and the control valve further comprises a cap ring covering peripheries of the lower valve base and screwed to the external screw to join the upper and lower valve bases. 4. the control valve as claimed in claim 1 , wherein the float body is a float ball. 5. the control valve as claimed in claim 1 , wherein the first pivot guide and the second pivot guide are u-shaped plates.	field of the invention the present invention relates to a device for water collection, storage, and distribution, especially for a balanced water-intake control valve. background of the invention for conventional water or liquid storage devices such as water towers for industrial or civil purposes, reservoirs for breeding, or stools, a water-intake control valve is needed to install inside a storage device for automatically supplying water as the water level is low. one kind of conventional water-intake control valves is revealed by hwang in u.s. pat. no. 6,823,890 b1. a float body such as a hollow float ball is used to maintain the water level by connecting with a water-intake control valve which opens or closes depending on the water level. when the water level in a storage device is low, the valve/valve stopper of a conventional water-intake control valve will open to supply water flowing into the storage device. on the other hand, when the water level reaches a certain height, the valve/valve stopper will close to stop water flowing into the storage device. unfortunately, the conventional water-intake control valve cannot adjust the water level by the user's demand since the rotational angle of the float ball is fixed. therefore, it becomes inconvenient to the users and inefficient in water storage for being unable to change the maximum capacity of a storage device. if a user need to change the water-level upper limit, he has to change the water-intake control valve with a linkage rod of a different length or a different bending angle, which costs money and wastes time. summary of the invention the main purpose of the present invention is to provide a balanced water-intake control valve which can adjust the water level in the storage device by the user's demand. the present invention is a balanced water-intake control valve, primarily comprising a valve, a valve rod, a first linkage rod, a second linkage rod, a float body, and a water-level adjusting mechanism. the valve rod freely moving inside the valve has a valve stopper for sealing a water channel of the valve. the first linkage rod is pivoted at one end of the valve for driving the valve rod. the second linkage rod is pivoted at the other end of the valve in connection with the float body. the water-level adjusting mechanism comprises a first pivot guide, a second pivot guide, a lead screw, and an adjusting nut. the first pivot guide is pivoted at the first linkage rod and the second pivot guide is pivoted at the second linkage rod. the first and second pivot guides are connected by the lead screw at opposite ends. an adjusting nut is located at the middle of the lead screw. when the lead screw is rotated through the adjusting nut, the distance between the first pivot guide and the second pivot guide can be changed to adjust the water-level upper limit. the balanced water-intake control valve in the present invention has the following advantages and functions: 1. an adjusting mechanism is introduced to adjust the water-level depending on the user's need: by screwing both ends of the lead screw to change the screwing length of lead screw, the height of the float body changes and then the water-level of the storage device will change. 2. a cap ring is used to fasten the upper valve base and the lower valve base of the valve; therefore, it is easy to assemble or disassemble without any external tool. description of the drawings fig. 1 is a 3d disassembled component view of a balanced water-intake control valve according to the first embodiment of the present invention. fig. 2 is a side view illustrating the balanced water-intake control valve at low water level according to the first embodiment of the present invention. fig. 3 is a side view illustrating the balanced water-intake control valve at a water-level upper limit of h 1 according to the first embodiment of the present invention. fig. 4 is a side view illustrating the balanced water-intake control valve at another water-level upper limit of h 2 according to the first embodiment of the present invention. fig. 5 is a 3d disassembled component view of a balanced water-intake control valve according to the second embodiment of the present invention. fig. 6 is a side view illustrating the balanced water-intake control valve at low water level according to the second embodiment of the present invention. fig. 7 is a side view illustrating the balanced water-intake control valve at water-level upper limit of h 1 according to the second embodiment of the present invention. fig. 8 is a 3d disassembled component view of a balanced water-intake control valve according to the third embodiment of the present invention. fig. 9 is a partial side view of the balanced water-intake control valve according to the third embodiment of the present invention. detailed description of the invention with reference to the attached drawings, the present invention is described by means of the embodiment(s) below where the attached drawings are simplified for illustration purposes only to illustrate the structures or methods of the present invention by describing the relationships between the components and assembly in the present invention. therefore, the components shown in the figures are not expressed with the actual numbers, actual shapes, actual dimensions, nor with the actual ratio. some of the dimensions or dimension ratios have been enlarged or simplified to provide a better illustration. the actual numbers, actual shapes, or actual dimension ratios can be selectively designed and disposed and the detail component layouts may be more complicated. according to the first embodiment of the present invention, a water-intake control valve is illustrated in fig. 1 for a 3d disassembled component view, in fig. 2 for a side view at low water level, in fig. 3 for a side view at high water level h 1 , and in fig. 4 for a side view at high water level h 2 . the balanced water-intake control valve 100 primarily comprises a valve 110 , a valve rod 120 , a first linkage rod 130 , a second linkage rod 140 , a float body 150 , and an adjusting mechanism 160 for water-level upper limit where the valve 110 has a water channel 111 as shown in fig. 2 for controlling water to flow through and out of the valve 110 . in one of the embodiment, the valve 110 is composed of an upper valve base 112 and a lower valve base 113 to assemble and accommodate the valve rod 120 . the upper valve base 112 has a water-intake opening 117 for water to flow into the water channel 111 . the lower valve base 113 has a plurality of water outlets (as shown in arrow locations of fig. 2 ) for water to flow out of the valve 110 . normally, the material of the valve 110 is plastic to reduce the manufacture cost and weight. to be more specific, as shown in fig. 1 , a plurality of first through holes 114 are disposed at the peripheries of the edge ring of the upper valve base 112 and a plurality of second through holes 115 are disposed on the peripheries of the edge ring of the lower valve base 113 . the balanced water-intake control valve 100 further comprises a plurality of screw bolts 181 inserting through the first through holes 114 and the second through holes 115 for mechanically jointing the upper valve base 112 and the lower valve base 113 . to be more specific, a plurality of fixing nuts 182 are screwed to the corresponding screw bolts 181 to tightly joint the upper valve base 112 and the lower valve base 113 together as shown in fig. 2 . as shown in fig. 2 and fig. 3 , the valve rod 120 can freely move inside the valve 110 where the valve rod 120 has a valve stopper 121 for sealing the water channel 111 of the valve 110 to effectively stop water flowing into a storage device. preferably, the valve stopper 121 is made of flexible rubber which can tightly seal the water channel 111 to stop the water flow. when the valve rod 120 moves downward, an annular gap will be formed between the valve stopper 121 and the water channel 111 so that water will flow through the gap and flow out of the lower valve base 113 to achieve water intake as shown by the arrows in fig. 2 . therefore, the moving up and down of the valve rod 120 is able to supply water or stop water flowing into a storage device. as shown in fig. 2 , the first linkage rod 130 is pivoted at the valve 110 for driving the valve rod 120 . as shown in fig. 1 and fig. 2 again, the first linkage rod 130 has a first pivot point 131 where a joint bolt 133 is inserted at the first pivot point 131 and through the pivot hole 116 to make the first linkage rod 130 to be pivoted at the valve 110 . in the present embodiment, the pivot hole 116 is disposed at the lower valve base 113 so that the first linkage rod 130 is pivoted to the lower valve base 113 . the first linkage rod 130 further has a second pivot point 132 to make the first linkage rod 130 to be pivoted at the lower end of the adjusting mechanism 160 through another joint bolt (not shown in the figure). the first pivot point 131 and the second pivot point 132 are individually located at two ends of the first linkage rod 130 so that the first linkage rod 130 is rotatable. as shown in fig. 2 , the second linkage rod 140 is pivoted at the valve 110 . in the present embodiment, the second linkage rod 140 has a third pivot point 141 to make the second linkage rod 140 to be pivoted at the upper valve 112 of the valve 110 by a joint bolt (not shown in the figure). as shown in fig. 1 and fig. 2 , the second linkage rod 140 further has a fourth pivot point 142 to make the second linkage rod 140 to be pivoted at the top end of the adjusting mechanism 160 by inserting a joint bolt 144 at the fourth pivot point 142 and through the pivot hole 163 of the adjusting mechanism 160 . to be more specific, the second linkage rod 140 further has a connecting end 143 connecting to the float body 150 through the float body connecting rod 151 . the fourth pivot point 142 is located between the third pivot point 141 and the connecting end 143 to create an effort-saving lever. in the present embodiment, the second linkage rod 140 can be a flat strip rod in the shape of “i”. as shown in fig. 1 and fig. 2 , the float body 150 is connected with the second linkage rod 140 . the float body 150 is connected and fixed to a float body connecting rod 151 where the float body connecting rod 151 is screwed to the connecting end 143 of the second linkage rod 140 to create a module for easy assembly and disassembly. in the present embodiment, the float body 150 can be a float ball. as shown in fig. 2 and fig. 3 , both ends of the adjusting mechanism 160 are individually pivoted to the first linkage rod 130 and the second linkage rod 140 so that the second linkage rod 140 can drive the first linkage rod 130 through the adjusting mechanism 160 . as shown in fig. 2 , when the water level is low, the float body 150 exerts a downward force at the connecting end 143 of the second linkage rod 140 caused by the weight of the float body 150 . the first linkage rod 130 driven by the adjusting mechanism 160 will rotate correspondingly to lower the valve rod 120 of the balanced water-intake control valve 100 to supply water flowing into a storage device. as shown in fig. 3 , when the water level reaches the upper limit h 1 , the float body 150 exerts an upward force at the connecting end 143 of the second linkage rod 140 caused by the buoyancy of the float body 150 . the first linkage rod 130 driven by the adjusting mechanism 160 will push the valve stopper 121 for sealing the water channel 111 in the balanced water-level control valve 100 to stop water flowing into a storage device. as shown in fig. 1 , the adjusting mechanism 160 comprises a first pivot guide 161 , a second pivot guide 162 , a lead screw 170 , and an adjusting nut 171 . the first pivot guide 161 is pivoted at the first linkage rod 130 and the second pivot guide 162 is pivoted at the second linkage rod 140 . in the present embodiment, the first pivot guide 161 and the second pivot guide 162 are u-shaped plates disposed and connected to the first linkage rod 130 and the second linkage rod 140 respectively. furthermore, as shown in fig. 2 , the first linkage rod 130 is pivoted at the lower valve base 113 and the second linkage rod 140 is pivoted at the upper valve base 112 , wherein the valve rod 120 has a linkage hole 122 in which the first linkage rod 130 is inserted to linearly move the valve rod 120 to supply water or to stop water flowing into a storage device as shown in fig. 2 . the first linkage rod 130 is inserted between the first pivot point 131 with the lower valve base 113 and the second pivot point 132 with the first pivot guide 161 to form an effort-saving lever for sealing the water channel 111 by the valve stopper 121 . as shown in fig. 1 , both ends of the lead screw 170 are individually screwed to the first pivot guide 161 and the second pivot guide 162 . to be more specific, the first pivot guide 161 and the second pivot guide 162 have small sections of internal screws (not shown in the figure) to screw to the lead screw 170 . as shown in fig. 2 , the adjusting nut 171 is located at the middle of the lead screw 170 . the lead screw 170 can be rotated by the adjusting nut 171 . when rotating the lead screw 170 , the distance between the first pivot guide 161 and the second pivot guide 162 is changed. in other words, the adjustable length of the adjusting mechanism 160 can be adjusted by rotating the lead screw 170 . the lead screw 170 has a clockwise screw portion 172 and a counterclockwise screw portion 173 to individually screw to the internal screws of the first pivot guide 161 and to the internal screws of the second pivot guide 162 so that both ends of the lead screw 170 are simultaneously screwed to the first pivot guide 161 and the second pivot guide 162 . by adjusting the adjusting nut 171 to rotate the lead screw 170 , the distance between the first pivot guide 161 and the second pivot guide 162 can be changed, i.e., to move the first pivot guide 161 close to or away from the second pivot guide 162 , so that the adjustable length of the adjusting mechanism 160 can be increased or shortened. preferably, as shown in fig. 2 , the adjusting mechanism 160 further comprises a first constraining nut 174 and a second constraining nut 175 where the first constraining nut 174 is screwed to the clockwise screw portion 172 of the lead screw 170 (as shown in fig. 1 ) which can be rotated and moved between the first pivot guide 161 and the adjusting nut 171 . the second constraining nut 175 is screwed to the counterclockwise screw portion 173 of the lead screw 170 (as shown in fig. 1 ) which also can be rotated and moved between the second pivot guide 162 and the adjusting nut 171 . when the first constraining nut 174 is tightly jointed to the first pivot guide 161 and the second constraining nut 175 is tightly jointed to the second pivot guide 162 , the distance between the first pivot guide 161 and the second pivot guide 162 can be firmly constrained without any clearance. as shown in fig. 3 and fig. 4 , the user can easily change the water-level upper limit from h 1 to h 2 by adjusting the adjusting nut 171 to increase the distance between the first pivot guide 161 and the second pivot guide 162 so as to increase the upper limit height of the float body 150 so that the desired water level can be raised from the original water-level upper limit h 1 to the final water-level upper limit h 2 to achieve the maximum capacity of a storage device. on the contrary, the user also can easily reduce the water-level upper limit by adjusting the adjusting nut 171 to shorten the distance between the first pivot guide 161 and the second pivot guide 162 so as to decrease the upper limit height of the float body 150 so that the water level can be reduced to decrease the maximum capacity of a storage device. therefore, through screwing both ends of the lead screw 170 to the first pivot guide 161 and to the second pivot guide 162 , the adjustable length of the adjusting mechanism 160 can be increased or shortened so that the second linkage rod 140 connected to the float body 150 can show different angles at different water-level upper limits to achieve the maximum capacity of a storage device by rotating the lead screw 170 according to the needs of the user after installation. the specific operation mechanism of the balanced water-intake control valve 100 is described in detail as follows. the balanced water-intake control valve 100 is installed inside a water storage device where the balanced water-intake control valve 100 of the present invention is most suitable for shallow water level such as cooling tower or water storage tower. as shown in fig. 2 , when the water level of a water storage device is low and the water has not yet touched the float body 150 , the end of the second linkage rod 140 connected to the float body 150 is fallen under gravitation forces to cause the adjusting mechanism 160 moving downward to drive the first linkage rod 130 so as to push the valve rod 120 and the valve stopper 121 linearly moving downward so water will flow from the water intake opening 117 through the water channel 111 into the storage device to make the water level to rise. as shown in fig. 3 , when the water level reaches the water-level upper limit h 1 the float body 150 connected with the second linkage rod 140 is raised to reach a certain height by buoyancy, the connecting end 143 of the second linkage rod 140 connected to the float body 150 also moves upward to rotate the second linkage rod 140 to cause the adjusting mechanism 160 to move upward so as to drive the first linkage rod 130 where the first linkage rod 130 pushes the valve rod 120 with the valve stopper 121 to linearly move upward until the valve stopper 121 seals the water channel 111 to stop the water flowing into a storage device. especially, as shown in fig. 4 , when the water-level upper limit h 2 is assigned by the user, the adjusting mechanism 160 can be implemented to adjust the water-level of upper limit to reach the maximum capacity of a storage device. as shown in fig. 3 and fig. 4 , the distance between the first pivot guide 161 and the second pivot guide 162 can be increased to increase the upper limit height of the float body 150 (the water-level upper limit from h 1 to h 2 ) to increase the maximum capacity of a storage device by rotating the adjusting nut 171 along with the clockwise screw portion 172 and the counterclockwise screw portion 173 to move the first pivot guide 161 and the second pivot guide 162 away from the adjusting nut 171 . when the water level has not yet reached the upper limit height h 2 of the float body 150 after adjusting, the second linkage rod 140 through the adjusting mechanism 160 have not yet driven the first linkage rod 130 to close the balanced water-intake control valve 100 . this is because the valve rod 120 and the valve stopper 121 do not rise to the closed state by elongating the adjusting mechanism 160 . the water will keep flowing into a storage device if the water level is still below the water-level upper limit h 2 . as shown in fig. 4 , when the float body 150 reaches the upper limit height through buoyancy after adjusting to the water-level upper limit h 2 , the second linkage rod 140 is driven to move the first linkage rod 130 through the adjusting mechanism 160 to stop the water flowing into the storage device. on the contrary, when the user wants to reduce the maximum capacity of a storage device, the adjusting nut 171 and the lead screw 170 can be rotated to make the first pivot guide 161 and the second pivot guide 162 to move toward the adjusting nut 171 along the clockwise screw portion 172 and the counterclockwise screw portion 173 of the lead screw 170 to shorten the distance between the first pivot guide 161 and the second pivot guide 162 so that the float body 150 can be lowered to a specific height to reduce the water-level upper limit to achieve the desired maximum capacity of a storage device by the user. therefore, through screwing both ends of the lead screw 170 to the first pivot guide 161 and to the second pivot guide 162 , the adjustable length of the adjusting mechanism 160 can be increased or shortened to set the water-level upper limit so that the second linkage rod 140 connected to the float body 150 can show different angles at different water-level upper limit to achieve the maximum capacity of a storage device by adjusting the upper limit height of the float body 150 so as to further adjust the water-level upper limit between h 1 and h 2 according to the needs of the user after installation. according to the second embodiment of the present invention, another balanced water-intake control valve is illustrated in fig. 5 for a 3d disassembled component view, in fig. 6 for a side view at low water level h 1 , and in fig. 7 for a side view at high water level h 1 . the major components with the corresponding numbers showing the same functions are the same as described in the first embodiment which will not further be described in detail. the balanced water-intake control valve 200 primarily comprises a valve 110 , a valve rod 120 , a first linkage rod 130 , a second linkage rod 140 , a float body 150 , and an adjusting mechanism 160 for water-level upper limit where the adjusting mechanism 160 comprises a first pivot guide 161 , a second pivot guide 162 , a lead screw 170 , and an adjusting nut 171 . as shown in fig. 6 and fig. 7 , the valve rod 120 can freely move inside the valve 110 where the valve rod 120 has a valve stopper 121 for sealing the water channel 111 of the valve 110 to effectively stop water flowing into a storage device. the first pivot point 131 and the second pivot point 132 of the first linkage rod 130 are individually pivoted at the valve 110 and at the adjusting mechanism 160 where the first linkage rod 130 is configured for driving the valve rod 120 . a portion of the second linkage rod 140 is pivoted at the valve 110 . one end of the second linkage rod 140 is pivoted at the adjusting mechanism 160 , the other end 143 of the second linkage rod 140 is connected to the float body 150 where the second linkage rod 140 is driven by the float body 150 . in the present embodiment, the second linkage rod 140 is in a shape of “v” to have a better strength for bending. in the present embodiment, as shown in fig. 6 , the adjusting mechanism 160 and the water-intake opening 117 are disposed on the same side of the valve 110 where the diameter of the water-intake opening 117 can be enlarged and the volume of the float body 150 can be increased for longer operation ranges according to the needs of the user. as shown in fig. 5 and fig. 6 , in the present embodiment, the first linkage rod 130 is pivoted at a first position 213 a of the lower valve base 113 and the second linkage rod 140 is pivoted at a second position 213 b of the lower valve base 113 . the second position 213 b is vertically lower than the first position 213 a. the valve rod 120 has a linkage hole 122 in which the first linkage rod 130 is inserted. to be more specific, a pushing head 233 is formed at one end of the first linkage rod 130 opposing to the second pivot point 132 of the first linkage rod 130 with the first pivot guide 161 for driving the valve rod 120 for linear movement to achieve the operation of supply water or stop water flowing into a storage device as shown in fig. 6 and fig. 7 . the better shape of the pushing head 233 is circular or arc. the diameter of the pushing head 233 is larger than the width of the first linkage rod 130 . as shown in fig. 6 , in the present embodiment, the first pivot point 131 of the first linkage rod 130 connected with the lower valve base 113 can be located between the linkage hole 122 , i.e., the pushing head 233 , and the second pivot point 132 of the first linkage rod 130 connected with the first pivot guide 161 as a lever point. the first position 213 a is located above the second position 213 b where the second position 213 b can be located at an extruded edge of the lower valve base 113 extending downward so that the pivot point of the first linkage rod 130 is higher than the pivot point of the second linkage rod 140 . as shown in fig. 6 , when the water level is at the water-level lower limit l, the float body 150 moves downward to rotate the second linkage rod 140 to make the adjusting mechanism 160 to move upward so as to rotate the first linkage rod 130 so that the valve rod 120 and the valve stopper 121 linearly move downward to enable water flowing through the water channel 111 to continually raise the water level. as shown in fig. 7 , when the water level reaches the upper limit h 1 , the float body 150 connected with the second linkage rod 140 is raised to a certain height from the water-level upper limit h 1 by buoyancy. the connecting end 143 of the second linkage rod 140 connected to the float body 150 moves upward so as to lower the adjusting mechanism 160 by rotating the second linkage rod 140 . the first linkage rod 130 is driven to linearly move the valve rod 120 and the valve stopper 121 upward until the water channel 111 is sealed by the valve stopper 121 to stop water flowing into a storage device. using the same adjusting method as mentioned in the first embodiment, when the user wants to increase the maximum capacity of a storage device, the adjustable length of the adjusting mechanism 160 can be changed by rotating the lead screw 170 such as increasing the adjustable length of the adjusting mechanism 160 to raise the water-level upper limit (full water level) to increase the maximum capacity of a storage device. according to the third embodiment of the present invention, another balanced water-intake control valve is illustrated in fig. 8 for a 3d disassembled component view and in fig. 9 for a partial side view. the major components with the corresponding numbers showing the same functions will be the same as described in the first embodiment which will not further be described in detail. the balanced water-intake control valve 300 primarily comprises a valve 110 , a valve rod 120 , a first linkage rod 130 , a second linkage rod 140 , a float body 150 , and an adjusting mechanism 160 for water-level upper limit. as shown in fig. 8 and fig. 9 , the valve rod 120 can freely move inside the valve 110 for sealing the valve 110 to effectively stop water flowing into a storage device. both ends of the first linkage rod 130 are pivoted at the valve 110 and at the adjusting mechanism 160 . the second linkage rod 140 is pivoted at the valve 110 where one end of the second linkage rod 140 is connected to the float body 150 and the other end is pivoted at the adjusting mechanism 160 . the adjustable length of the adjusting mechanism 160 can be changed by rotating the lead screw 170 through the adjusting nut 171 . in the present embodiment, external screws 318 are disposed at the peripheries of the bottom of the upper valve base 112 . the balanced water-intake control valve 300 further comprises a cap ring 390 covering the peripheries of the lower valve base 113 and screwed to the external screws 318 of the upper valve base 112 to tightly hold on to the lower valve base 113 of the valve 110 make the upper valve base 112 and the lower valve base 113 tightly joint together without external tools such as screw drivers for easy assembly and disassembly. the above description of embodiments of this invention is intended to be illustrative but not limited. other embodiments of this invention will be obvious to those skilled in the art in view of the above disclosure which still will be covered by and within the scope of the present invention even with any modifications, equivalent variations, and adaptations.
015-950-852-916-312	EP	[ "WO" ]	G06F21/00,G06Q10/00,H01L29/00	2011-04-12T00:00:00	2011	[ "G06", "H01" ]	method and apparatus for sharing user data	a mechanism for dynamically generating a set of user attributes is described. the user attributes are triggered and tailored by the user for a specific purpose and then optionally sent to a communication partner. the user attributes are provided in a form that enables the communication partner to obtain the user attributes included in said list.	claims : 1. a method comprising: receiving instructions from a first user for the generation of a list of user attributes of said first user for sending to a communication partner, wherein the list of user attributes is a subset of user attributes of the first user; generating said list of user attributes; and providing said list in a form that enables the said communication partner to obtain the user attributes included in said list. 2. a method as claimed in claim 1, wherein the first user selects at least some of said user attributes for inclusion in said list. 3. a method as claimed in claim 1 or claim 2, wherein at least some of said instructions include details of how to modify an existing list of user attributes. 4. a method as claimed in any preceding claim, further comprising the first user selecting one or more recipients of said list. 5. a method as claimed in any preceding claim, further comprising the first user defining validity conditions for one or more of said user attributes. 6. a method as claimed in claim 5, wherein validity conditions include a time period during which a selected user attribute is available to be viewed. 7. a method as claimed in 5 or claim 6, wherein validity conditions include a level of abstraction of a user attribute. 8. a method as claimed in any preceding claim, wherein said user attributes included in said list are encrypted. 9. a method as claimed in any preceding claim, wherein said user attributes included in said list are obtainable from an identity management system. 10. an apparatus comprising: a first input for receiving instructions from a first user for the generation of a list of user attributes for the first user, wherein the list of user attributes is a subset of the user attributes for the first user, wherein said the user attributes included in said subset is controlled by the first user; a processor for generating said list of user attributes; and a first output for providing said list. 11. an apparatus as claim in claim 10, further comprising a database storing user attributes for the first user. 12. a communication card comprising a list of user attributes for a first user, wherein the list of user attributes is a subset of the user attributes for the first user, wherein said the user attributes included in said subset is controlled by the first user, wherein the list is provided in a form that enables a communication partner to obtain said user attributes included in said list. 13. a communication card as claimed in claim 12, wherein at least some of the user attributes included in said list have limited validity. 14. a communication card as claimed in claim 12 or claim 13, wherein said user attributes included in said list are encrypted . 15. a method comprising: receiving, at a first user device, a list of attributes from a communication partner, wherein the list is provided in a form that enables the apparatus to obtain the user attributes included in the list and wherein the user attributes are a subset of the user attributes of said communication partner; and obtaining the said user attributes. 16. a method as claimed in claim 15, further comprising providing a list of user attributes of a user of said first user device to said communication partner. 17. a computer program product comprising: means for receiving instructions from a first user for the generation of a list of user attributes of said first user for sending to a communication partner, wherein the list of user attributes is a subset of user attributes of the first user; means for generating said list of user attributes; and means for providing said list in a form that enables the said communication partner to obtain said user attributes included in said list.	description title method and apparatus for sharing user data the present invention is directed to a method and apparatus for sharing user data, such as identity data and user attributes. in particular, the present invention enables a user to be involved in the process of sharing at least some of his/her user data. figure 1 is a block diagram of a system, indicated generally by the reference numeral 1. the system 1 comprises a user 2 and a service provider 4. the user is in two-way communication with the service provider 4. in the use of the system 1, the service provider 4 needs to know information regarding the user 2 in order to function correctly. for example, the service provider may be an internet-based shop that needs to know name, address and credit card details of the user 2 in order to fulfil an order . as is well known in the art, the user 2 may provide the information required by the service provider 4 directly to the service provider. this is a simple procedure, but it requires the user 2 to provide this information each time the service provider 4 is used. in an alternative use of the system 1, the service provider 4 may store data relating to the user 2 (such as name, address and credit card details) so that the user only needs to provide such data once. this is more convenient for the user, but the storing of user data at the service provider 4 represents a potential security concern. many users may not be willing to make use of a service provider that stores potentially sensitive user data. furthermore, data stored at the service provider 4 may become obsolete. by way of example, in the internet-shop example considered above, an order may be made but incorrectly completed due to obsolete data. figure 2 is a block diagram of a system, indicated generally by the reference numeral 10. the system 10 comprises a user 12, a service provider 14 and an identity management (idm) system 16. the user 12 is in two-way communication with both the service provider 14 and the idm 16. the service provider 14 is additionally in two-way communication with the idm 16. user attributes for the user 12 are stored at the idm 16. accordingly, when the service provider 14 needs to know information regarding the user 12 in order to function correctly, the service provider requests this information from the idm 16. considering again the internet-shop example discussed above, in the event that the user 12 places an order at the service provider 14 for which the service provider requires name, address and credit card information concerning the user 12, the service provider 14 requests this information from the idm 16. in the event that the idm 16 trusts the service provider 14, that data may be provided. importantly, this data will be provided by the idm as required and so will always be up-to-date and does not need to be stored at the service provider, thereby overcoming two of the problems outlined above with respect of the system 1. in the system 10, a dialogue is carried out between the service provider 14 and the idm 16. a privacy policy for the user 12 may be stored at the idm 16 to enable the idm to determine whether (and to what extent) potentially sensitive user data can be shared with the service provider 14. such privacy policies can be inflexible. furthermore, such privacy policies risk either being too restrictive (potentially preventing a full operation of the service provider 14) or insufficiently restrictive (potentially leading to a user data being provided to a service provider that the user may prefer to be kept secret from that service provider) . the present invention seeks to address at least some of the problems outlined above. the invention provides a method comprising: receiving instructions (typically via a user interface of a personal data portal) from a first user for the generation of a list of user attributes of said first user for sending to a communication partner, wherein the list of user attributes is a subset of user attributes of the first user (e.g. a subset of the attributes of the first user available to said personal data portal) ; generating said list of user attributes; and providing said list in a form that enables the said communication partner to obtain said user attributes included in said list. in some embodiments, the list of user attributes does not provide the attributes themselves to the communication partner. the said personal data portal is typically provided as part of an identity management system. the invention also provides an apparatus (e.g. a data portal and/or an idm or some other central point for the management of communication cards) comprising: a first input for receiving instructions (typically via a user interface of the personal data portal) from a first user for the generation of a list of user attributes for the first user, wherein the list of user attributes is a subset of the user attributes for the first user stored, wherein said the user attributes included in (or omitted from) said subset is (at least partially) controlled by the first user; a processor for generating said list of user attributes; and a first output for providing said list (typically in a form that enables a communication partner to obtain said user attributes included in said list) . a database may be provided for storing user attributes for the first user from which the subset is selected. in some forms of the invention, the apparatus may have access to an external database of such data. thus, the present invention provides a mechanism for dynamically generating a set of user attributes. the user attributes can typically be triggered and tailored by the user for a specific purpose and then optionally sent to a communication partner. the user attributes can be provided in a form that enables the communication partner to obtain the user attributes included in said list. the communication card of the present can therefore provide fine-grained enforcement of each user's privacy preferences, but can also provide enhanced user convenience, since, for example, no unwanted or outdated or redundant information need be stored at a communication partner. in many forms of the invention, the first user selects at least some of said user attributes for inclusion in said list. for example, at least some of said instructions may be received using a check-box input. at least some of said instructions may include details of how to modify an existing list of user attributes. for example, a list may be generated (or previously stored) and the first user may be able to add attributes to the list and/or to remove attributes from the list. thus, a simple user- interface can be provided that enables a user to easily make use of the principles of the present invention. in some forms of the invention, the first user selects one or more recipients of said list. thus, a list may be generated specifically for a particular recipient or purpose. in some forms of the invention, the first user defines validity conditions for one or more of said user attributes included in said list. the said validity conditions may include a time period during which a selected user attribute is available to be viewed. alternatively, or in addition, the said validity conditions may include a level of abstraction of a user attribute. other validity conditions could readily be provided. in some forms of the invention, the user attributes are not themselves included in the list (but a means for obtaining those user attributes is included) . for example, the said user attributes may be obtainable from an identity management system. in other forms of the invention, the said user attributes are included in said list in encrypted form. for example, the principles of digital rights management may be used to control access to user data. the invention also provides a communication card comprising a list of user attributes for a first user, wherein the list of user attributes is a subset of the user attributes for the first user, wherein said the user attributes included in (or omitted from) said subset is controlled by the first user, wherein the list is provided in a form that enables a communication partner to obtain said user attributes included in said list (but does not necessarily actually provide the attributes themselves to the communication partner) . thus, a communication card can be provided that can be used to dynamically generate a set of personal attributes/data of one user, possibly triggered and tailored by the subject of these personal data for a specific purpose, and then optionally sent to his/her communication partner. that communication partner may have the option of sending his specific communication card in return to build a trusted relationship. at least some of the user attributes included in said list may have limited validity. for example, said validity may be limited in duration. alternatively, or in addition, at least some of said attributes may be abstracted. in some forms of the invention, the user attributes are not themselves included in the list (but a means for obtaining those user attributes is included) . for example, the said user attributes may be obtainable from an identity management system. in other forms of the invention, the said user attributes are included in said list in encrypted form. the invention yet further provides an apparatus (e.g. a user device) for generating a communication card (or a list of user attributes) comprising: a first interface for communicating with a user of said apparatus; and a second interface for communicating with a personal data portal, wherein the personal data portal is configured to receive instructions for the generation of a list of user attributes of the user of said apparatus for sending to a communication partner of said user, wherein the list of user attributes is a subset of user attributes of the first user available to said personal data portal. a third interface may be provided for communicating with the said communication partner. the said third interface may be configured to receive a communication card (or a list of user attributes) for said communication partner. the invention yet further provides a method comprising: receiving, at a first user device, a list of attributes from a communication partner, wherein the list is provided in a form that enables the apparatus to obtain the user attributes included in the list and wherein the user attributes are a subset of the user attributes of said communication partner; and obtaining the said user attributes. the method may further comprise providing a list of user attributes of a user of said first user device to said communication partner. the invention also provides a computer program comprising: code (or some other means) for receiving instructions (e.g. via a user interface of a personal data portal) from a first user for the generation of a list of user attributes of said first user for sending to a communication partner, wherein the list of user attributes is a subset of user attributes of the first user; code (or some other means) for generating said list of user attributes; and code (or some other means) for providing said list in a form that enables the said communication partner to obtain said user attributes included in said list (but may not actually provide the attributes themselves to the communication partner) . the computer program may be a computer program product comprising a computer-readable medium bearing computer program code embodied therein for use with a computer. the invention yet further provides a computer program comprising code (or some other means) for receiving, at a first user device, a list of attributes from a communication partner, wherein the list is provided in a form that enables the obtaining of the user attributes included in the list and wherein the user attributes are a subset of the user attributes of said communication partner; and code (or some other means) for obtaining the said user attributes. the computer program may be a computer program product comprising a computer-readable medium bearing computer program code embodied therein for use with a computer. exemplary embodiments of the invention are described below, by way of example only, with reference to the following numbered drawings . figure 1 is a block diagram of a known system for providing user data; figure 2 is a block diagram of a known system for providing user data; figure 3 is a block diagram of a system in accordance with an aspect of the present invention; figure 4 is a flow chart showing an algorithm in accordance with an aspect of the present invention; figure 5 is a flow chart showing an algorithm in accordance with an aspect of the present invention; figure 6 is a flow chart showing an algorithm in accordance with an aspect of the present invention; figure 7 is a flow chart showing an algorithm in accordance with an aspect of the present invention; figure 8 is a block diagram of a system in accordance with an aspect of the present invention; figure 9 is a flow chart showing an algorithm in accordance with an aspect of the present invention; and figure 10 is a block diagram of a system in accordance with an aspect of the present invention. figure 3 is a block diagram, indicated generally by the reference numeral 20, of a system in accordance with an aspect of the present invention. the system 20 comprises a first user 22 (typically in the form of a user device, such as a mobile communication device) , a second user 24 and an identity management (idm) system 26. the first user 22 is in two-way communication with both the second user 24 and the idm 26. as indicated by the dotted arrow, the second user 24 may, in some embodiments, be in two-way communication with the idm 26. the first user 22 is similar to the user 12 described above. the second user 24 may be a service provider (similar to the service provider 14 described above) , but this is not essential. as discussed in detail below, the second user 24 may be another user, and may therefore be similar to the first user 22 (and may be in the form of a user device, such as a mobile communication device) . figure 4 is a flow chart showing an algorithm, indicated generally by the reference numeral 30, showing, in broad terms, an exemplary use of the system 20. the algorithm 30 starts at step 32, where the user 22 generates a set of attributes, referred to herein as a "communication card". the term communication card is used herein to refer to a dynamically generated set of personal attributes/data of one user (such as the first user 22), triggered and tailored by the subject of these personal data for a specific purpose, and then optionally sent to his/her communication partner (such as the second user 24) . the second user may have the option of sending his specific communication card to the first user as another contribution to build a trusted relationship between the two communicating users, but this is not essential to all forms of the invention. the communication card could be stored in xml format containing the configuration for the card or a binary format. the communication card may be digitally signed by the idm 26 to be secure against tampering. another possible implementation (which is discussed in further detail below) could be that the card would also contain the values of the attributes, encrypted by a digital rights management (drm) key or other similar method. once the communication card has been generated, thereby completing step 32 of the algorithm 30, the algorithm moves to step 34, wherein the communication card is transferred to a communication partner of the first user (the second user 24 in this example) . finally, at step 36, the second user receives the communication card and uses the communication card to obtain attributes or other user data concerning the first user 22. as discussed in detail below, the attributes may not themselves be included in the communication card sent from the first user to the second user; rather, the communication card enables the second user to obtain that data, for example from the idm 26. in other forms of the invention, the attributes may be included in the communication card, but in encrypted form. figure 5 is a flow chart showing an algorithm, indicated generally by the reference numeral 40, showing further details of how the communication card may be generated in step 32 of the algorithm 30. the algorithm 40 starts at step 42, where the first user 22 logs into the idm 26. by way of example, the idm 26 may provide a personal data portal that the first user 22 needs to login to in order to generate communication cards. the personal data portal may, for example, be used to store both the user's personal identity attributes (e.g. address, photos, etc.) and the user's privacy preferences (e.g. regarding the forwarding of his/her personal id attributes) . the profile data for the user 22 may be viewable at the personal data portal. next, at step 44 of the algorithm 40, the first user 22 selects a sub-set of the user attributes to be included in a particular communication card. the subset may, for example, be selected by activating one or more checkboxes at the personal data portal of the idm 26. of course, this step could be implemented in many other ways; for example, the user could modify an existing communication card or the subset of attributes could be selected automatically, perhaps based on a generic set of attributes which is filtered by the user' s pre-defined privacy preferences or some other policy regarding the communication cards. in one form of the invention, the personal data portal may generate a communication card and then enable the first user 22 to edit the card according to his/her personal preferences in this moment and situation, e.g. by removing/adding or abstracting or otherwise generalizing certain personal data. with the content for the communication card defined, the first user 22 may now define one or more validity conditions for the card at step 46 of the algorithm 40. for example, the first user 22 may define that the user attributes should only be made available to the second user for a limited period of time. by way of example, the communication card could contain attributes with varying viewing policies and access durations. for example, the first user 22 could determine that the second user 24 should be able to see his mobile telephone number for one year, but see his current location (which would be an on-demand fetchable attribute) for one month. after one month the second user 24 should be able to see his location for another five months in an abstracted way (e.g. just the town) and then the location attribute should no longer be visible to the second user. finally, the first user 22 selects one or more recipients of that communication card (step 48 of the algorithm 40) . this may be done, for example, by moving to a new page at the idm 26, where group of persons (given the case that his idm offers to sort his contacts to groups) that should be allowed to see the communication card can be selected. it should be noted that the algorithm 40 is provided by way of example only. the order of steps could readily be altered. for example, the recipient (s) of the communication card could be selected earlier in the process. further, one or more of the steps could be omitted; for example, validity conditions (step 46 of the algorithm) may not be required in all circumstances. moreover, the generation of the communication card could be implemented in other ways; for example, the communication card could be generated automatically, perhaps by selecting those attributes that are acceptable based on the user' s privacy preferences for sending attributes to a particular recipient. with the communication card generated, the first user 22 could now download the communication card first to his device or directly forward it to another service or person (such as the second user 24), thereby implementing step 34 of the algorithm 30. as mentioned above, the communication card does not generally include the user attributes for the first user, but includes information required to enable the second user to obtain those details. in order for the second user to view attributes for the first user (thereby implementing step 36 of the algorithm 30), the second user may obtain the attributes from the idm 26 (as described below with reference to figure 6) . in an alternative implementation, the second user needs to decrypt the values that were already stored in the card (as described below with reference to figure 7), for example using drm technology. figure 6 is a flow chart showing an algorithm, indicated generally by the reference numeral 50, showing an exemplary implementation of step 36 of the algorithm 30. the algorithm 50 starts at step 52, where the second user 24 receives the communication card, for example from the first user 22. the communication card includes information required to enable the second user to obtain those details. accordingly, at step 54 of the algorithm 50, the second user 24 fetches the required attributes from the idm 26 in accordance with the information included in the information card received at step 52, for example in accordance with the principles outlined above. figure 7 is a flow chart showing an algorithm, indicated generally by the reference numeral 60, showing an alternative implementation of step 36 of the algorithm 30. the algorithm 60 starts at step 62, where the second user 24 receives the communication card, for example from the first user 22. next, at step 64, the second user obtains the information required to decode the user data included in the communication card. for example, the second user may need to acquire and validate his drm key (or similar technique) to be able to decrypt the values that were already stored in the card. this can be done e.g. by applying ws-* protocols or a saml attributequery . for the authorization of the access there could be included within the card a special access token. of course, step 64 could be implemented before step 62 in the algorithm 60. finally, at step 66, the second user 24 decodes the data included in the communication card to extract the user data. the card generated at step 32 of the algorithm 30 may be an xml file containing an encrypted block. for decryption, the combination of the encryption algorithm used, keys used for encryption and any other parameters is required. the step 66 of the algorithm 60 may be implemented using a communication card viewer. such a viewer might typically be implemented as a piece of software and/or hardware. the viewer understands the encryption algorithm used, but needs to acquire the keys necessary to decrypt the data included in the encrypted block of the xml file, initialize the decoding algorithm and perform the decryption. in order to do so, the communication card viewer may retrieve some data from external sources and authorize itself against the external sources. figure 8 is a block diagram of a system, indicated generally by the reference numeral 80, in accordance with an aspect of the present invention. the system 70 comprises a first user 72 (similar to the first user 22 described above) , a second user 74 (similar to the second user 24 described above), a first idm system 76 (similar to the idm system 26 described above) and a second idm system 78. the first user 72 is in two-way communication with the second user 74, the first idm system 76 and the second idm system 78. similarly, the second user 74 is in two-way communication with the first user 72, the first idm system 76 and the second idm system 78. figure 9 is a flow chart showing an algorithm, indicated generally by the reference numeral 80, showing an exemplary use of the system 70. the algorithm 80 starts at step 82, where the first user 72 generates a communication card. the communication card may be generated for the purpose of sending the communication card to the second user 74, for example using the algorithm 40 described above. the communication card generated in step 82 is sent to the second user 74 at step 84 of the algorithm 80. the second user uses the communication card to obtain attributes regarding the first user, for example by obtaining the attributes from the first idm 76 (step 86 of the algorithm 80) . the algorithm 80 then moves to step 88, where the second user 74 generates a communication card for the purpose of sending the communication card to the first user 72. the second user may, for example, use an algorithm similar to the algorithm 40 for this purpose. the communication card generated by the second user 74 is sent to the first user 72 (step 90) . finally, at step 92 of the algorithm 80, the first user uses the communication card to obtain attributes regarding the second user, for example by obtaining the attributes from the second idm 78. after both the first 72 and second 74 users have sent their specifically tailored communication cards, then each user is potentially aware of a customized selection of id attributes of his/her communication partner. thus the invention allows asymmetric exchange of personal data, under the individual governance of the two communication partners. in the event that a relationship between two users deteriorates, then each individual user may be able to disable the communication card sent to his/her communication partner remotely. for example, in the event that the communication cards enable only a copy-protected display of the communication card to be streamed to the communication partner, driven by the real data stored only in a user' s personal data portal, then the communication card can be disabled by relying on technology from digital rights management (drm) for videos and paper documents like the technology behind ms sharepoint and similar other products. basically, the receiver of such protected information is able to "see" it for a certain period of validity (as mentioned above with reference to step 46 of the algorithm 40), and is unable to forward it to third parties. this usage right can be extended periodically, e.g. for another day, as long as there is a relationship between the two users. as soon as the relationship is deemed by one partner as deteriorating, this partner can stop the periodic extension of the usage right. consequently, his/her partner is no longer able to read the information . figure 10 is a block diagram of a block diagram of a system, indicated generally by the reference numeral 100, in accordance with an aspect of the present invention. the system 100 comprises the first user device 72, second user device 74, first idm 76 and second idm 78 of the system 70 described above. as shown in figure 10, the first user device 72 comprises a processor 110, a memory 112 and a user interface 114. the processor is configured, for example, to implement the algorithms described above. the code required for implementing those algorithms may be stored within the memory 112. the user interface 114 enables the user of the user device 72 to interact with the device 72, and hence provide the input required to select the content for inclusion in a particular communication card. the second user device 74 comprises a processor 116, which is similar to the processor 110, a memory 118, which is similar to the memory 112, and a user interface 120, which is similar to the user interface 114. as shown in figure 10, the first idm 76 comprises a processor 102 and a memory 104. the processor is configured, for example, to implement the algorithms described above. the code required for implementing those algorithms may be stored within the memory 104. the memory 104 may also store the user attributes that are selectively included in the communication cards described herein. the second idm 78 comprises a processor 106, which is similar to the processor 102, and a memory 108, which is similar to the memory 104. the system 100 is provided by way of example only. the skilled person will be aware of many alternatives possible implementations of the principles of the present invention. for example, a similar system implementing the system 20 described above could readily be implemented using the user devices 72 and 74 to provide the user devices 22 and 24 of the system 20 and the idm 76 to provide the idm 26 of the system 20, but omitting the idm 78. in the embodiments of the invention described above, the communication card not only provides fine-grained enforcement of each user's privacy preferences, but also enhanced user convenience, since, for example, no unwanted or outdated or redundant information need be stored at a communication partner (such as the second user 24) . indeed, in many implementations of the invention, it would not be possible for the second user to store such data. moreover, the information stored on a communication card can be tailored by individual and/or group/company privacy policies. communication cards can also be tailored asymmetrically and updated dynamically, based on changes of the user's id attributes. by way of example, as soon as the user gets a new telephone number, this new number is seen by selected communication partners of the first user, as long as they can watch his/her communication card. in the event that a user loses his end device, data loss is avoided since they are streamed from the data portals of its partners in real ¬ time . the embodiments of the invention described above are illustrative rather than restrictive. it will be apparent to those skilled in the art that the above devices and methods may incorporate a number of modifications without departing from the general scope of the invention. it is intended to include all such modifications within the scope of the invention insofar as they fall within the scope of the appended claims.
016-628-435-282-84X	US	[ "US" ]	F02K9/48	1984-04-16T00:00:00	1984	[ "F02" ]	pre-regenerated staged-combustion rocket engine	an improvement in the design of a staged-combustion-cycle rocket engine. the preburner 16 (or preburners) is operated at a higher temperature than that above which turbine blades will be damaged. a heat-exchanger unit 40 through which the output flow of the cooling jacket 18 of the engine is passed is placed inside the preburners 16, or in close proximity to its output flow, so that heat energy is transferred from the output flow of the preburners 16 to the output flow of the cooling jacket 18. this lowers the preburners output flow to a temperature which will not damage turbine blades and raises the cooling-jacket output flow temperature. since the output flow of the cooling jacket 18 is fed to the low-pressure turbines 22, the increased temperature raises the pressure of the low-pressure turbines 22 so that their output of flow rate is increased and the flow rate to the engine is increased, thereby increasing engine output power and efficiency.	1. a method for increasing the power and thrust output of a staged-combustion rocket engine, said engine having a preburner which receives a portion of an output flow of fuel from a fuel tank, said preburner having an output flow for providing a source of energy for a high-pressure turbine of a high-pressure turbopump the output flow of said high-pressure turbine combining with the output flow of a low-pressure turbine of a low-pressure turbopump, said low-pressure turbine receiving the output flow of the cooling jacket of an engine combustion chamber, said cooling jacket having received another portion of the flow from said fuel tank, said combined flow from said high-pressure turbine and from said low-pressure turbine providing a propellant supply for the combustion chamber of said rocket engine, comprising the steps of: operating said preburner at a temperature, which is high enough so that damage to the blades of said high-pressure turbine would ordinarily occur; and sending said output flow of the cooling jacket through heat-exchange means prior to being received by said low-pressure turbine, said heat-exchange means in heat exchange relationship with said preburner to extract heat energy from said preburner so that the temperature of the flow being received by said low-pressure turbine is raised, thereby allowing said low-pressure turbopump to be operated at a higher pressure to provide a higher flow rate of fuel through said low-pressure turbopump, and the temperature of the output flow of the preburner is lowered to a level which is below that which will damage the blades of said high-pressure turbine. 2. a method as in claim 1, wherein: said heat exchange means includes a heat donee element located within the preburner in order to raise the temperature of the cooling jacket output flow. 3. a method as in claim 1, wherein: the output flow of the cooling jacket is fed through a heat donee element and the output flow of the preburner is fed to a heat donor element, the two components being in close proximity so that heat is transferred from the donor element to the donee element to raise the temperature of the flow in the donee element and lower the temperature of the flow in the donor element. 4. in a staged-combustion engine having a fuel flow path and an oxidizer flow path, said fuel flow path being split into a first flow path and a second flow path, said split occurring after the fuel leaves a fuel tank and is pumped by a low-pressure fuel pump of a low-pressure turbopump and a high-pressure fuel pump of a high-pressure turbopump, said first flow path including at least one preburner and a high-pressure turbine of a high-pressure turbopump, the output flow of said preburner for supplying the energy for said high-pressure turbine before the fuel enters an injector and is then finally combusted in a main combustion chamber, and said second flow path including a cooling jacket for the main combustion chamber and a low-pressure turbine of a low-pressure turbompump, the output flow of said cooling jacket providing the input flow for said low-pressure turbine which feeds its output to the injector, the improvement comprising: heat-exchanging means, in heat exchange relationship with said preburner, having a donee element for accepting the output flow of the cooling jacket prior to said output flow of said cooling jacket being sent to said low-pressure turbine, said preburner providing heat energy to the output flow of the cooling jacket in said donee element, whereby, the temperature of the output flow of the preburner is lowered to a level which will not damage said high-pressure turbopump and the temperature of the output flow of the cooling jacket is raised so that the pressure at the low-pressure turbine is raised and the flow to the main combustion chamber is increased. 5. the improvement set forth in claim 4, wherein: said donee element comprises a coil inside said preburner. 6. the improvement set forth in claim 4, wherein: said heat-exchanging means comprises at least two coils in close proximity, a donor coil which is connected to receive the output flow of said preburner and a donee coil which is connected to receive the output flow of the cooling jacket. 7. the improvement set forth in claim 4, wherein: said heat-exchanging means comprises at least a donor element and a donee element, said donor element being connected to receive the preburner output flow and said donee element being connected to receive the cooling jacket output flow.	background of the invention 1. field of the invention this invention relates to staged-combustion rocket engines and espcially to a pre-regenerated, staged-combustion rocket engine utilizing a heat exchanger to raise the temperature of the fluid operating the low-pressure turbines. 2. description of the prior art staged-combustion rocket cycles wherein all propellants are burned at high pressure become pressure-limited for non-cooled turbine designs because of a limited fuel flow available for turbine drive. in current staged-combustion designs, such as the space shuttle main engine (ssme), the entire fuel flow, other than that used for chamber-jacket cooling, is used to drive the turbine pump power units. any reduction of the flow of the fuel (or oxidizer) used as a coolant in the combustion-chamber cooling jacket, the coolant fuel then being sent through the low-pressure turbopumps, is generally unfeasible because the resulting higher chamber-wall temperatures and coolant temperatures result in a reduced thermal margin and thermal life characteristic of the chamber walls. additional oxidizer flow to the preburner(s) is available in such cycles but this causes a higher turbine blade temperature with a consequent blade and turbine life limitation problem. as a result, current technology limits typical o.sub.2 --h.sub.2 staged-combustion cycles to about 3500 psia combustion-chamber pressure. objects of the invention an object of the invention is to increase the flow of fuel, or fuel and oxidizer, to the combustion chamber of a staged-combustion-cycle rocket engine. another object is to achieve the above object without reducing the flow of fluid in the cooling jacket of the rocket engine. a further object is to increase the power, thrust and efficiency presently available from staged-combustion rocket engines. yet another object is to increase flow of fuel, or fuel and oxidizer, to the main combustion chamber without increasing the pressure drop or power of the high-pressure turbines and high-pressure pumps. summary of the invention the invention comprises a staged-combustion-cycle rocket engine wherein the preburners are operated at a higher temperature (up to 4000.degree. r.) than that used in present staged-combustion-cycle engines and the temperature of the output gases of the preburners is reduced to an acceptable turbine temperature (about 2150.degree. r.) by transferring some of the heat energy of the preburner to the fluid flow from the cooling jacket of the engine. the energy thus obtained is used to raise the pressure levels of the fuel and oxidizer low-pressure pumps, thereby increasing the flow of fuel, or fuel and oxidizer, to the main combustion chamber of the rocket engine. the increased input of propellant to the engine results in higher generated thrust, higher power, and greater efficiency of operation. other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawing. brief description of the drawings fig. 1 is a schematic block diagram illustrating fluid flow through the turbines, pumps, preburners and cooling jacket of one side of the power head of an ssme-type staged-combustion engine, fig. 1a being for the presently-used engine, and fig. 1b being for the new, pre-regenerative design. fig. 2a is a schematic illustration of the fluid flow shown in fig. 1a and indicating the temperature at various points. fig. 2b is a schematic illustration of the invention showing how a heat exchanger is included among the fluid-flow components and varies the fluid temperatures from those indicated in fig. 2a. fig. 3 is a schematic similar to fig. 2b but showing a heat exchanger unit which is separate from the preburner. the same elements or parts throughout the figures of the drawing are designated by the same reference characters. detailed description of the preferred embodiments a typical fuel and oxidizer flow system for a stage-combustion-cycle rocket engine such as the present ssme is shown in schematic form in fig. 1a. fuel flows from a fuel tank 10 through a low-pressure fuel pump 12 into a high-pressure fuel pump 14. the output of the high-pressure fuel pump 14 is fed to a preburner 16 (or preburners) and also through the cooling jacket 18 of the main combustion chamber 20 of the engine. after leaving the cooling jacket 18, the fuel flow is fed to a low-pressure turbine 22 whose output is combined with the output of the high-pressure turbine(s) 24, the combined output being passed through the injector 28 into the main combustion chamber 20. oxidizer is coupled from an oxidizer tank 30 into a low-pressure oxidizer pump 32 and from there into a high-pressure oxidizer pump 34. the output of the high-pressure oxidizer pump 34 is fed to the preburners 16, to the low-pressure oxidizer turbine 36, and to the injector 28. approximate temperatures in degrees rankine are shown at different points along the flow paths. the new pre-regenerative system is depicted in fig. 1b. the system is smilar to that in fig. 1a except that the fuel flow from the cooling jacket 18, instead of passing directly into the low-pressure turbine 22, is fed to a heat exchanger 40, which may be a coil or finned plate, in the preburner unit(s) 16. this enables the fuel flow from the cooling jacket 18 to be raised from a temperature of about 530.degree. r. to a temperature of about 2100.degree. r. before being fed into the low-pressure turbine(s) 22, because the preburner 16 (or preburners) is now operated at a temperature of about 4050.degree. r. instead of the temperature of 2150.degree. r. at which it operates in the present system. the preburners(s) 16 can now be operated at this higher temperature because the transfer of heat energy to the fuel in the coil of the heat exchanger 40 permits the fuel and oxidizer flow into the high-pressure turbine(s) 24 of high pressure turbopump(s) still to be maintained at the present-system level of about 2150.degree. r., above which damage would result to the turbine blades. however, the increase of temperature in the fuel fed from the heat excahnger coil 42 to the low-pressure turbine(s) 22 increases the pressure of the turbine(s) 22 thereby increasing the fuel flow through the low-pressure turbine(s) 22 into the main combustion chamber 20. this increase in fuel flow into the main combustion chamber 20 increases the chamber pressure, p.sub.c, from 3500 psia to about 5000 psia, resulting in increased engine thrust and efficiency. simplified diagrams for the fuel flows with approximate temperatures along the circuits are presented in fig. 2a and 2b. the diagrams are self-explanatory. another version of the pre-regenerative system is shown in fig. 3. a heat exchanger which is separate from the preburners 16 can be employed. the output flow from the preburners 16 can be passed through a first component 43 of the heat exchanger and the output flow of the cooling jacket 18 can be passed through a second component 45 of the heat exchanger. the two components, the heat donor 43 and the heat donee 45, should be in close proximity and may comprise two closely wound coils or may comprise two passageways through a plate stack heat exchanger, such as that manufactured by the rockwell international corporation, canoga park, calif. this type of heat exchanger is described in u.s. pat. no. 4,347,896 issued sept. 7, 1982. obviously, many modifications and variations of the present invention are possible in light of the above teachings. it is therefore to be understood that, within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.
020-061-032-720-286	DE	[ "JP", "GB", "DE", "US" ]	B21B1/08,B21B1/088	1978-10-12T00:00:00	1978	[ "B21" ]	rolling mill for large size wide flange beam or steel rail	purpose:to reduce the error in shape of the finished section of the rail and to increase the production capacity, in case of rolling the rail, etc., using two units of reversing universal roughing stands and a finishing stand, by placing and operating the edging stand for rolling the rail in the second roughing stand. constitution:the steel material is preliminarily rolled by double reversing roughing stands 1, 2, and is fed into the reversing universal stand 3, in front of which the edging stand 4 is placed. the material undergoes the normal and reverse passes in this stand 3 while the roll gap of the edging rolls is being opened; after that, the material undergoes the deformation through the normal pass in the stands 3, 4. next the material is passed through the reversing universal roughing stand 5 in front and back of which the edging stands 6, 7, are being respectively arranged; hereby, the material is worked into the rail shape being reduced by plural couples of vertical roll sets and horizontal roll sets. finally, the material is passed through the finishing stand 8 for reforming the shape; thus, the rail of superior dimensional accuracy is manufactured.	1. a rolling mill train comprising two two-high reversing rolling stands; an associated edging stand; a reversing universal rolling stand and a further reversable universal rolling stand having a preceding and a following edging stand; and a universal finishing rolling stand, wherein said further reversable universal rolling stand, said preceding and following edging stands and said universal finishing rolling stand are aligned and drivable to roll a rail in a single continuous pass therethrough, and one of said preceding and said following edging stands is movable transversely out of the train for rolling a beam without using said preceding edging stand. 2. a rolling mill train according to claim 1, wherein said one transversely movable edging stand is said preceding edging stand. 3. a rolling mill train according to claim 1, wherein said further reversible universal rolling stand is reversed when a beam is being rolled.	background of the invention the invention relates to a rolling mill train, in particular one for heavy profiled supports or rails, and comprising one or two two-high reversing pre-rolling stands, two reversing universal rolling stands with always one associated edging stand and preferably a universal finishing rolling stand at the end of the train. this type of rolling mill train for rolling profiled supports (i.e. beams or griders) or rails is already known (in general terms) from de-ps no. 1 960 601. in this specification a reversing universal rolling stand for rolling rails is preceded and/or followed by an edging stand which is displaceable transversely to the rolling line. in order to obtain the number of passes necessary for treating in particular the lateral faces of the rail profile or the head and foot faces either preceding edging stand is provided with grooved rolls which are different over the crown length of the roll set (one of which being displaceable for the first pass and the other being displaceable for a subsequent reversing pass), into the rolling line in the axial direction of the rolls. also the two different pairs of calibers of the edging stand may be arranged in an edging stand which is arranged in front of or behind the reversing universal rolling stand, wherein likewise the grooved rolls of one of the edging stands are displaced into the rolling line for one reversing pass and the grooved rolls of the other are so displaced for a subsequent reversing pass. a disadvantage of such an arrangement is that for two reversing passes in the reversing universal rolling stand the next grooved rolls following over the length of crown of the reduction rolls must be moved into the rolling line for further reduction of the side flanks of the rail profile. in this case accurate insertion of the respective reduction rolls into the rolling line presents particular difficulties. moreover the new grooved rolls must be effected into the rolling line within the period of time available prior to the next reduction pass. in this case the continuous material throughput may be disadvantageously affected by time delays, or the rolling process may be disadvantageously affected in respect of maintenance of tolerance limits of the profiled rail, or of operational reliability, respectively, owing to inaccurate alignment of the grooved rolls of the edging stand relative to the rolling line. summary of the invention it is an object of the invention to avoid a edging stand which is necessarily displaceable into the rolling line during the rolling operation and to avoid the disadvantages associated with this. these defects can be achieved while obtaining an appropriate grooved roll sequence for the optimum deformation of the highly loaded rail parts, such as head and foot pieces. in order to achieve this, especially when rolling rails, it is proposed that a further edging stand is arranged in front of or behind the second reversing universal rolling stand, and an additional compression pass is effected through this further stand, rolling being effected merely in travel-through operation in the second reversing universal rolling stand with the associated further edging stand. the further edging stand is preferably displaceable from the rolling line, for rolling profiled beams especially, and the gap is preferably bridgeable by an insertable roller train section. it is an advantage of this arrangement that, in consequence of the alignment of the grooved rolls of the further edging stand, an accurate caliber adjustment relative to the rolling can be ensured, even prior to the start of the operation. as a result, maintenance of tolerance limits of the finished cross-sections of the rails or other product can be improved. furthermore, disturbances of operation can be avoided and the throughput efficiency of the rolling mill train can be increased. brief description of the drawings the invention is further illustrated with reference to the accompanying drawings, in which: fig. 1 shows an arrangement, in principle, of rolling stands in a rolling mill train; and fig. 2 shows diagrammatically an arrangement of a second reversing universal rolling stand with preceding and following compression stands. detailed description of the invention fig. 1 shows diagrammatically a two-high reversing pre-rolling stand 1 in which a slab is pre-rolled in a plurality offorward and backward passes. further pre-rolling is then effected in a two-high reversing pre-rolling stand 2, likewise in a plurality of forward and backward passes. the rolled material rod w issuing with the pre-forming pass from the two-high reversing pre-rolling stand 2 then travels into a further group of stands comprising a reversing universal rolling stand 3 with preceding edging stand 4. the reversing universal rolling stand 3 possesses horizontal and vertical roll sets with grooved rolls lying in a common rolling plane, whereas the edging stand 4 comprises a set of horizontal rolls with grooved profiles. during the first forward and backward passes rolling is effected in the reversing universal rolling stand 3 with the rolls open, whereas during the following forward pass the edging stand 4 and the reversing universal rolling stand 3 are made to deform the rolled material rod w. thereafter the rod w travels with free exit into the next group of stands, which consists of one universal reversing rolling stand 5 with preceding and following edging stands 6 and 7. the rod w passes through these in through-travel, i.e. through the horizontal roll sets 10, 10a and 14, 14a of the edging stands 6 and 7 respectively, as well as the horizontal sets 12, 12a and vertical sets 13, 13a. these affecting roll sets deform the rolled material rod w in through-travel operation. thereafter the rolled material rod w travels through a universal finishing rolling stand 8 in which horizontal and vertical roll sets disposed in one rolling plane perform an after-treatment pass for the tolerance-holding finished rolled rail profile. owing to the additional arrangement of the edging stand 6 in the second stand group between the stand 3 and the universal finishing stand 5, it is possible to obtain at least five passes in the universal rolling stands and three edging passes. this number of passes is generally necessary for the formation of a suitable rail profile. in this case the advantage resides in the fact that the edging stand 6 can be adjusted accurately to the rolling line l prior to the start of the rail rolling, thus avoiding rolling faults and disadvantageous effects in the throughput. the horizontal rolls of the edging stands, in a particular manner, exert a deforming and reinforcing effect upon the head and foot pieces of the profiled rail. the edging stand 6 can be removed from the rolling line l for the purpose of rolling profiled supports, i.e. beams or girders and the gap produced may be bridged by an insertable roller train section. the second group of stands is diagrammatically illustrated in fig. 2. in this figure, a rolling line l is illustrated in which the rolled material rod w of the profiled rail is rolled. the horizontal grooved rolls of edging stand 6 are denoted by numerals 10, 10a. the reversing universal rolling stand 5 possesses horizontal grooved rolls 12, 12a and vertical grooved rolls 13, 13a which are disposed in one plane. for the purpose of rolling rails especially, the reversing universal rolling stand 5 is operated in through-travel operation, i.e. only in the rolling direction r. the edging stand 7 is provided with horizontal rolls 14, 14a. the rolling stands preferably have individual drives driven via gears. when profiled supports, i.e. beams or girders are being rolled, operation is effected by means of the second universal rolling stand group 5 with edging stand 7 and, under certain circumstances with edging stand 6 in reversing operation.
021-065-532-735-016	JP	[ "JP", "EP", "US" ]	G11B27/00,G11B27/034,H04N5/85,G11B27/30,G11B27/32,G11B27/34,H04N5/781,H04N5/907,H04N5/91,H04N9/804,H04N9/806,H04N9/82	2003-11-06T00:00:00	2003	[ "G11", "H04" ]	picture editor and picture editiong method	<p>problem to be solved: to provide a picture editor and a picture editing method which facilitates grasping the contents and the nature of a chapter being a partial region of a title and improves the serviceability for the user in editing operations. <p>solution: in information (ep) for showing the boundaries contained in a plurality of chapters, information for showing the attributes of the chapters including the information (ep) is established to classify the chapters, based on the established information for showing the attributes. for indicating the table of a plurality of chapters, they are shown in indication forms differentiated according to the attributes of each chapter. <p>copyright: (c)2005,jpo&ncipi	an image editing apparatus characterized by comprising: a recording unit (12 to 15) configured to record a title including image information onto a recording medium (11, 13a); a dividing unit (17) configured to divide the title into a plurality of chapters by setting information (ep) showing boundaries at arbitrary positions of a title recorded on the recording medium (11, 13a) at the recording unit (12 to 15); a setting unit (17) configured to set information showing attributes (property_flag, ep_type, prm_txti) of chapters including the information (ep), in the information (ep) showing boundaries included in the respective chapters divided at the dividing unit (17); and a control unit (17) configured to sort the chapters on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17), and to apply predetermined editing processing with respect to the plural sorted chapters (figs. 1, and 11 to 24). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: a display control unit (17) configured to sort the chapters on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17), and to display said plurality of chapters in display modes.which are different in accordance with an attribute of each chapter when said plurality of chapters are list-displayed (figs. 1, 11, and 12). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a registering unit (17) configured to register the chapters extracted at the extracting unit (17) with a play list (figs. 1, and 13). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); a registering unit (17) configured to register the chapters extracted at the extracting unit (17) with a dubbing list; and a dubbing unit (17) configured to dub the chapters registered at the registering unit (17) (figs. 1, 14, and 15). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a deleting unit (17) configured to delete the chapters extracted at the extracting unit (17) from the recording medium (11, 13a) (figs. 1 and 16). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a playback unit (17) configured to playback-display all or some of the chapters extracted at the extracting unit (17) (figs. 1 and 17). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a combining unit (17) configured to combine the chapters adjacent to one another among the chapters extracted at the extracting unit (17) into one chapter (figs. 1 and 18). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a setting unit (17) configured to set new chapter boundaries at constant time intervals with respect to the chapters extracted at the extracting unit (17) (figs. 1, 19 and 20). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a changing unit (17) configured to change the attribute information for the chapters extracted at the extracting unit (17) into different contents (figs. 1 and 21). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and a switching unit (17) configured to provide said plurality of chapters extracted at the extracting unit (17) as objects of editing processing while sequentially switching those (figs. 1, and 22 to 24). an image editing apparatus according to claim 1, characterized in that the control unit (17) comprises: an extracting unit (17) configured to extract chapters with specific attribute information or chapters without specific attribute information on the basis of the information showing attributes (property_flag, ep_type, prm_txti) set at the setting unit (17); and an editing unit (17) configured to apply predetermined editing processing with respect to said plurality of chapters extracted at the extracting unit (17) collectively (figs. 1, and 11 to 24). an image editing apparatus according to claim 1, characterized in that the setting unit (17) is configured to set flag information which can be sorted into two or more types as the information showing attributes of the chapters in the information (ep) showing boundaries included in the chapters (figs. 1 and 5) . an image editing apparatus according to claim 1, characterized in that the setting unit (17) is configured to set the information showing attributes of the chapters in accordance with presence/absence of text information in the information (ep) showing boundaries included in the chapters (figs. 1 and 8). an image editing apparatus according to claim 1, characterized in that the setting unit (17) is configured to set text information of a specific character string as the information showing attributes of the chapters in the information (ep) showing boundaries included in the chapters (figs. 1 and 9). an image editing method comprising: recording a title including image information onto a recording medium (11, 13a); dividing the title into a plurality of chapters by setting information (ep) showing boundaries at arbitrary positions of a recorded title; setting information showing attributes (property_flag, ep_type, prm_txti) of chapters including the information (ep), in the information (ep) showing boundaries included in the respective divided chapters; and sorting the chapters on the basis of the set information showing attributes (property_flag, ep_type, prm_txti), and applying predetermined editing processing with respect to the plural sorted chapters (figs. 1, and 11 to 24).	the present invention relates to an image editing apparatus and an image editing method suitable for editing image information recorded on a recording medium such as, for example, an optical disk or the like. as well known, in recent years, a technique of recording information at a high density has been developed, and an optical disk having a recording capacity of 4.7 gb (giga byte) on one side layer has been put to practical use. as this type of optical disk, for example, there are dvd-roms (digital versatile disk-read only memory). dedicated for playback, dvd-rams (random access memory) and dvd-rws (rewritable) which are rewritable, dvd-rs (recordable) which can be additionally written, and the like. by the way, in a recording and playback apparatus in which recording and playback of image information are carried out with respect to a recordable optical disk, editing processing such as changing the order of. playback or the like can be applied to the image information recorded on the optical disk by arbitrarily carrying out moving or combining in units of titles or units of chapters which are partial regions of a title. in jpn. pat. appln. kokai publication no. 2003-30675, there is disclosed a configuration in which a plurality of thumbnails corresponding to titles or chapters which are the partial regions of the titles are displayed on an operation screen, and on the screen, editing processing for a play list is carried out by selecting specific thumbnails or a space between adjacent thumbnails. in this case, when an editing operation such as moving or combining of the titles or the chapters is carried out while a plurality of thumbnails corresponding to titles or chapters are being displayed on an operation screen, setting of a title or a chapter which will be a moving origin or a combining origin, setting of a title or a chapter which will be a moving destination or a combining destination, and the like are realized in a mode in which a thumbnail corresponding to a title or a chapter is selected by operating switches of a recording and playback apparatus body or a remote controller. in this jpn. pat. appln. kokai publication no. 2003-30675, it is configured such that a user grasps titles or chapters by thumbnails displayed on an operation screen. by the way, in a case of titles, it is sufficient to grasp the broad contents in many cases, and it is possible to sufficiently grasp the contents or the characteristics of the titles by only thumbnails. however, in a case of chapters which are partial regions of titles, depending on the contents, in many cases, a user cannot sufficiently grasp the contents or the characteristics of the chapters by only thumbnails. generally, editing processing is frequently carried out in which the inside of a title is divided into a necessary portion and an unnecessary portion for a user so as to be respectively separate chapters, and a play list is prepared by gathering the chapters in the necessary portion, or the chapters in the unnecessary portion are deleted. however, unless the contents include greatly characteristic scene, both of the necessary chapters and the unnecessary chapters are displayed in similar thumbnails, and the problem that it is difficult for a user to understand what contents of chapters there were, or a distinction of necessity/disuse has been brought about. in order to cope with this problem, for example, there are cases in which a name provided to the chapter is indicated beside the thumbnail, or a preview function of playback-displaying only the image of the chapter portion corresponding to the thumbnail is provided. however, in view of circumstances in which the ease of viewing an operation screen is focused on, in many cases, relatively large-sized characters are displayed on the operation screen, and because the number of characters which can be indicated is limited in accordance therewith, it is not necessarily sufficient to grasp the contents or the characteristics of the chapter. further, in order to use a preview function, it is necessary to carry out a preview operation each time again, and the inconvenience that the operation is made complicated is brought about. the present invention has been achieved in consideration of the above-described circumstances. an object of the present invention is to provide an image editing apparatus and an image editing method in which contents and characteristics of chapters which are partial regions of a title can be easily grasped, and an attempt can be made to improve the convenience for a user in editing operations. according to one aspect of the present invention, there.is provided an image editing apparatus comprising: a recording unit configured to record a title including image information onto a recording medium; a dividing unit configured to divide the title into a plurality of chapters by setting information showing boundaries at arbitrary positions of a title recorded on the recording medium at the recording unit; a setting unit configured to set information showing attributes of chapters including the information, in the information showing boundaries included in the respective chapters divided at the dividing unit; and a control unit configured to sort the chapters on the basis of the information showing attributes set at the setting unit, and to apply predetermined editing processing with respect to the plural sorted chapters. according to another aspect of the present invention, there is provided an image editing method comprising: recording a title including image information onto a recording medium; dividing the title into a plurality of chapters by setting information showing boundaries at arbitrary positions of a recorded title; setting information showing attributes of chapters including the information, in the information showing boundaries included in the respective divided chapters; and sorting the chapters on the basis of the set information showing attributes, and applying predetermined editing processing with respect to the plural sorted chapters. this summary of the invention does not necessarily describe all necessary features so that the invention may also be a sub-combination of these described features. the invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which: brief description of the several views of the drawing fig. 1 shows an embodiment of the present invention, and is a block diagram for explaining a recording and playback apparatus; fig. 2 is a diagram for explaining relationships between management information and real picture data which are contents in the embodiment; figs. 3a and 3b are respectively diagrams for explaining one example in which thumbnails are displayed so as to be distinguishable due to the attribute information set to chapters in the. embodiment; fig. 4 is a diagram for explaining details of attribute information which is set to an ep of a chapter in the embodiment; fig. 5 is a flowchart for explaining processing operations of setting attribute information to the chapters by using property_flag in the embodiment; fig. 6 is a flowchart for explaining processing operations of registering a specific character string which will be a key for sorting the chapters with the recording and playback apparatus in the processing of setting attribute information to the chapters by using prm_txti in the embodiment; fig. 7 is a flowchart for explaining processing operations of interpreting the attribute information set to the chapters by using property_flag in the embodiment; fig. 8 is a flowchart for explaining processing operations of interpreting the attribute information set to the chapters by using ep_type in the embodiment; fig. 9 is a.flowchart for explaining processing operations of interpreting the attribute information set to the chapters by using the specific character string registered with prm_txti in the embodiment; figs. 10a and 10b are respectively diagrams for explaining another example in which the thumbnails are displayed so as to be distinguishable due to the attribute information set to the chapters in the embodiment; fig. 11 is a flowchart for explaining an example of processing operations of displaying differences in the attributes, so as to be recognizable for each chapter on the basis of the attribute information set to the chapters in the embodiment; fig. 12 is a flowchart for explaining another example of the processing operations of displaying differences in the attributes so as to be recognizable for each chapter on the basis of the attribute information set to the chapters in the embodiment; fig. 13 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically carrying out parts registration with a play list in the embodiment; fig. 14 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically dubbing those as one title in the embodiment; fig. 15 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically dubbing those as respectively separate titles in the embodiment; fig. 16 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically deleting only chapters having a specific attribute in the embodiment; fig. 17 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically playback-displaying or preview-displaying only chapters having a specific attribute in the embodiment; fig. 18 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of combining adjacent chapters having a specific attribute into one chapter in the embodiment; fig. 19 is a flowchart for explaining a part of processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of carrying out regular interval chapter division with respect to the chapters having a specific attribute in the embodiment; fig. 20 is a flowchart for explaining remaining portion of processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of carrying out regular interval chapter division with respect to the chapters having a specific attribute in the embodiment; fig. 21 is a flowchart for explaining processing operations of sorting the'chapters in the title in accordance with differences in the attribute information, and of automatically changing the chapters having a specific attribute collectively into another attribute in the embodiment; fig. 22 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of applying chapter thumbnail settings to the chapters having a specific attribute while being sequentially switched in the embodiment; fig. 23 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of applying chapter name settings to the chapters having a specific attribute while being sequentially switched in the embodiment; and fig. 24 is a flowchart for explaining processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of applying chapter deletions to the chapters having a specific attribute while being sequentially switched in the embodiment. detailed description of the invention hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. fig. 1 shows a recording and playback apparatus which will be described in this embodiment. in the recording and playback apparatus, suppose that both of a dvd-ram and a hard disk can be used as a recording medium. however, the hard disk or the dvd-ram may be replaced with a recording medium such as, for example, a semiconductor memory or the like. in the recording and playback apparatus shown in fig. 1, if respective blocks are broadly divided, main blocks as a recording unit exist at the left side, and main blocks as a playback unit exist at the right side. namely, the recording and playback apparatus has two types of disk drive units. first, there is provided a disk drive unit 12 that rotationally drives an optical disk 11 serving as a first medium which is an information recording medium on which a video file can be constructed, and that executes reading and writing of information. further, there is provided an hdd (hard disk drive) unit 13 for driving a hard disk 13a serving as a second medium. a d-pro (data-processor) unit 14 can provide recording data to the disk drive unit 12 and the hdd unit 13, and further can receive played-back signals. the disk drive unit 12 has a rotation control system, a laser driving system, an optical system, and the like with respect to the optical disk 11. the d-pro unit 14 handles data in units of recording or playback, and includes a buffer circuit, a modulation/demodulator circuit, an error correction unit, and the like. further, the recording and playback apparatus has an encoder unit 15 configuring the recording side, a decoder unit 16 configuring the playback side, and a microcomputer block 17 for controlling the operations of the apparatus body as main constituent components. the encoder unit 15 has analog to digital converters for video and for audio which digitize inputted analog video signals and analog audio signals, a video encoder, and an audio encoder. moreover, the encoder unit 15 includes a sub picture encoder. the output of the encoder unit 15 is converted into a predetermined dvd-ram format at a formatter 19 including a buffer memory 18, and is supplied to the above d-pro unit 14. an external analog video signal and an external analog audio signal from an a/v (audio/video) input unit 20, or an analog video'signal and an analog audio signal from a tv (television) tuner unit 21 are inputted to the encoder unit 15. note that, when a compressed digital video signal or digital audio signal is directly inputted to the encoder unit 15, the encoder unit 15 can supply the compressed digital video signal or digital audio signal directly to the formatter 19. further, the encoder unit 15 can supply analog-to-digital converted digital video signals or digital audio signals directly to the a v (video) mixing unit 22 or an audio selector 23. in the video encoder included in the encoder unit 15, the digital video signal is converted into a digital video signal compressed at a variable bit rate in accordance with the mpeg (moving picture experts group) 2 or mpeg 1 standard. the digital audio signal is converted into a digital audio signal compressed at a fixed bit rate in accordance with the mpeg or the ac (audio compression)-3 standard, or into a digital audio signal of a linear pcm (pulse code modulation). when a sub picture signal is inputted from the a/v input unit 20 (for example, a signal from a dvd video player with an independent output terminal for sub picture signals, or the like), or when a dvd video signal having such a data structure is broadcast, and is received on the tv tuner unit 21, a sub picture signal in the dvd video signal is encoded (run length encoding) at the sub picture encoder, and made to a bit map of the sub picture. the encoded digital video signal, digital audio signal, and sub picture signal are packed into a video pack, an audio pack, and a sub picture pack at the formatter 19. moreover, those packs are collected and are converted into a format established by the dvd-vr (video recording) standard (for example, a standard for recording onto a dvd-ram, a dvd-r, a dvd-rw, or the like). here, the recording and playback apparatus of fig. 1 can provide the information formatted (the video, audio, sub picture data, or the like packs) and management information prepared at the formatter 19 to the hdd unit 13 or the disk drive unit 12 via the d-pro unit 14, and can record those on the hard disk 13a or the optical disk 11. further, the information recorded on the hard disk 13a or the optical disk 11 can be recorded on the optical disk 11 or the hard disk 13a via the d-pro unit 14 and the disk drive unit 12. furthermore, the video objects of a plurality of programs recorded on the hard disk 13a or the optical disk 11 can be processed to edit so as to delete some of those or to join an object of a different program thereto. the reason for this is that editing is made easy due to the data unit which the format according to the embodiment handles being defined. the microcomputer block 17 includes an mpu (micro processing unit) or a cpu (central processing unit), a rom on which a control program and the like are written, and a ram for providing a work area needed for executing the program. the mpu of the microcomputer block 17 executes defective place detection, unrecorded region detection, recorded information recording position setting, udf (universal disk format) recording, av address setting, or the like by using the ram as a work area in accordance with the control program stored in the rom. further, the microcomputer block 17 has an information processing unit needed for controlling the entire system, and has a work ram 24, a directory detecting unit 25, a vmg (entire video management information) information preparing unit, a copy related information detecting unit, a copy and scrambling information processing unit (rdi processing unit), a packet header processing unit, a sequence header processing unit, an aspect ratio information processing unit, and the like. the microcomputer block 17 also has a management information control unit 26 for the time of executing recording and a management information control unit 27 for the time of executing editing. among the executed'results of the microcomputer block 17, the contents which must be reported to a user are displayed on a display unit 28 of the recording and playback apparatus or are osd (on screen display)-displayed on a monitor display 29. further, the microcomputer block 17 has a key input unit 30 for providing a control signal for operating the recording and playback apparatus. the key input unit 30 corresponds to, for example, control switches provided on the body of the recording and playback apparatus or a remote controller, or the like. further, the key input unit 30 may be a pc (personal computer) or the like connected to the recording and playback apparatus by using means such as wire communication, wireless communication, optical communication, infrared communication, or the like. in any format, due to the user operating the key input unit 30, recording processing for inputted image audio signals, playback processing for recorded contents, or editing processing with respect to the recorded contents, or the like can be applied. note that the timings when the microcomputer block 17 controls the disk drive unit 12, the hdd unit 13, the d-pro unit 14, the encoder unit 15, the decoder unit 16, and the like can be executed on the basis of time data from an stc (system time clock) 31. the operations of recording and playback are usually executed in synchronous with time clocks from the stc 31. however, processings other than those may be executed in timings independent of the stc 31. the decoder unit 16 has a separator for separating and fetching the respective packs from a dvd formatted signal having a pack_structure, a memory used at the time of executing pack separating or other signal processings, a v decoder for decoding main picture data (the contents of the video pack) separated by the separator, an sp (sub picture) decoder for decoding sub picture data (the contents of the sub picture pack) separated by the separator, and an a decoder for decoding audio data (the contents of the audio pack) separated by the separator. further, there is provided thereto a video processor which appropriately synthesizes a decoded sub picture with a decoded main picture, and which superposes a menu, a highlight button, a caption, or other sub pictures onto the main picture, and outputs it. output video signals of the decoder unit 16 are inputted to the v mixing unit 22. at the v mixing unit 22, synthesis of text data is carried out. further, lines for directly fetching signals from the tv tuner unit 21 or the a/v input unit 20 are connected to the v mixing unit 22. further, a frame memory 32 used as a buffer is connected to the v mixing unit 22. in a case where the output of the v mixing unit 22 is an analog output, the output is outputted to the exterior via an i/f (interface) 33, and in a case of a digital output, the output is outputted to the monitor display 29 at the exterior via a d/a (digital to analog) converter 34. output audio signals of the decoder unit 16 are converted into analog signals at a d/a converter 35 via the selector 23 and are outputted to an external speaker 36. the selector 23 is controlled by a select signal from the microcomputer block 17. in accordance therewith, the selector 23 can directly select signals passing through the encoder unit 15 at the time of directly monitoring the digital signals from the tv tuner unit 21 or the a/v input unit 20. note that, at the formatter 19 of the encoder unit 15, during the recording, the respective bracketed information are prepared, and those are periodically transmitted to the mpu of the microcomputer block 17 [information such as a time of interrupting the top of a gop (group of picture), or the like]. as the bracketed information, there are the number of packs of a vobu (video object unit), and an end address of an i (intra) picture from the top of the vobu, a playback time of the vobu, or the like. at the same time, the information from the aspect ratio information processing unit is transmitted to the mpu at the time of starting the recording, and the mpu prepares vob (video object) stream information (sti). here, as the sti, resolution data, aspect ratio data, and the like are stored, and at the time of playback, initial settings are carried out on the basis of the information the respective decoder units. in the recording and playback apparatus, a video file is to be one file per one disk. further, in order to continue playing-back without being interrupted during the time of accessing (seeking) data, an information unit (size) which is at least continued to be played back has been determined. this unit is called a cda (contiguous data area). a cda size is the multiple of an ecc (error correction code) block (16 sectors), and in the file system, recording is carried out in cda units. the d-pro unit 14 receives data in vobu units from the formatter 19 of the encoder unit 15, and supplies data in cda units to the disk drive unit 12 or the hdd unit 13. furthermore, the mpu of the microcomputer block 17 prepares management information needed for playing-back the recorded data, and recognizes a command to terminate data recording, and thereafter, the mpu transmits the prepared management information to the d-pro unit 14. in accordance therewith, the management information is recorded on the optical disk 11 or the hard disk 13a. therefore, when encoding is being carried out, the mpu of the microcomputer block 17 receives information in data units (bracketed information or the like) from the encoder unit 15. further, the mpu of the microcomputer block 17 recognizes the management information (file system) read from the optical disk 11 or the hard disk 13a at the time of starting the recording, recognizes unrecorded areas of the respective disks, and sets the recorded areas on the data to the disks via the d-pro unit 14. next, the relationship between the management information and the real picture data which are the contents will be simply described with reference to fig. 2. in fig. 2, first, the real picture data will be described. here, suppose that the real picture data are collected into one file on the recording medium. the one file is configured by one or a plurality of real picture data streams. individual real picture data stream may be a unit to be recorded in, for example, one time recording processing. this corresponds to a vob (video object) in the dvd-vr standard, or the like. one real picture data stream is configured by one or a plurality of stream partial regions. this corresponds to, for example, a vobu (video object unit) in the dvd-vr standard, a gop (group of picture) in the mpeg2 standard, or the like. one stream partial region is configured by a plurality of packs. as the plurality of packs, there are information packs, picture packs, audio packs, and the like. sub picture packs may exist. the information pack corresponds to, for example, an rdi pack in the dvd-vr standard, or the like. in this case, information showing a start time of playing-back the first field of a vobu in which the information pack is included, information showing a recording time of the vobu, manufacturer information (mnfi), and the like are included in the information pack. in addition, the information pack includes display control information (dci) and copy control information (cci). the display control information shows aspect ratio information, subtitle mode information, and film camera mode information. the copy control information includes copy authorizing information or copy protecting (unauthorizing) information. the picture pack is one into which video data is compressed in accordance with the system of mpeg2, and is configured by pack header, packet header, and video data portions. the audio pack is one in which audio data is processed in accordance with a system of the linear pcm, the mpeg, the ac-3, or the like, and is configured by pack header, packet header, and audio data portions. next, the management information will be described. original title (program) information which is information for managing the order of playing-back the real picture data (playback order information) is defined in the management information. this corresponds to, for example, a program in the dvd-vr standard, or the like. reference information is defined in individual original title information (or program information), and this links with real picture data information which is information relating to the real picture data which will be objects to be played-back. those correspond to, for example, cell and video object information (vobu) in the dvd-vr standard. in this way, an original title (program) has the information for managing the order of playback (playback order information) and the real picture data thereof itself, and usually, at the time of recording, this title is prepared. in contrast thereto, there are cases in which a title.is configured by only information for managing the order of playback (playback order information). this is the play list information, and for example, a play list in the dvd-vr standard, or the like corresponds thereto. the play list information has no real picture data thereof, and as shown in fig. 2, the play list information is prepared as a play list by editing (deleting, adding) the reference information linking with the real picture data information of the original title. time map information is described in the real picture data information. this time map information designates partial regions configuring an real picture data stream corresponding to the real picture data information. a link from the original title information in the management information or the reference information in the play list information to the real picture data information is specified in accordance with a logical address. further, a link from the time map information to the real picture data stream and the partial regions thereof is established on the basis of a number of the real data stream, the number of the partial regions in the stream, an entry number with respect to each partial region, and a logical address with respect to individual partial region. in accordance with such a configuration, not only the normal playback of recorded picture data, but also a special playback such as double-speed/slow-motion playback or reverse playback, and further, a search for a scene or the like can be handled. hereinafter, operations of the recording and playback apparatus will be described with reference to the drawings from figs. 3a and 3b on. however, in the following descriptions, suppose that the recording and playback apparatus uses a configuration as follows. first, suppose that the recording and playback apparatus is an optical disk recording and playback apparatus in accordance with the dvd-recording standard (dvd-vr standard). further, suppose that the recording and playback apparatus is a hybrid recording playback device having two recording media of the optical disk 11 and the hard disk 13a, and dubbing of image information between the optical disk 11 and the hard disk 13a can be carried out. further, recording onto the optical disk 11 has, not only a function of recording on dvd-rams or the like in accordance with the dvd-vr standard, but also a function of recording on dvd-rs, dvd-rws, or the like in accordance with the dvd-video video standard. in the recording and playback apparatus, suppose that partial regions in the recorded title are called chapters. moreover, the chapter uses an entry point (ep) defined by the dvd-vr standard set in the title as a marker of the boundary thereof. namely, a zone between an ep and an ep which are set in the title is made to be a chapter, and suppose that the attribute information of the chapter is stored in accordance with the ep standing at the start point of the chapter. note that, suppose that the start point and the end point of a title are boundaries of a chapter independently of the presence/absence of an ep. therefore, with respect to the first chapter of a title, there is the possibility that an ep does not stand at the start point. however, in the matter of providing the attribute information of a chapter, an ep is set to the start point of the first chapter, or, particular attribute information may be stored with respect to only the first chapter. note that recording onto the hard disk 13a is not based on the dvd-vr standard. however, the attribute information of the chapter in the present embodiment is stored so as to correspond to particular chapter boundary information which will be a marker of the chapter boundary. namely, an object to which the attribute. information of the chapter in the present embodiment is applied is not limited to only the dvd-vr standard, but also with respect to the partial regions defined in the recorded title, the attribute information of the chapter can be applied so as to correspond to the boundary information of the partial region or information defining a range of the partial region or the like. figs. 3a and 3b are diagrams showing a concept of the present embodiment. in fig. 3b, a concept of a title and chapters which are partial regions of the title is shown. further, fig. 3a shows an example of a screen on which a list of the chapters included in the title is displayed. here, the list of the chapters is displayed by indicating thumbnails of representative screens of the respective chapters. as shown in figs. 3a and 3b, there is provided the feature that attribute information showing the characteristics of the respective chapters are provided to the chapters in the title, and various processings are carried out by sorting the attribute information set to the respective chapters. in figs. 3a and 3b, as an example, in order for a user to easily distinguish chapters with specific attribute information, the thumbnails of the chapters with specific attribute information are framed and displayed. fig. 4 shows an example of attribute information. here, the attribute information is provided so as to correspond to an entry point (ep) in accordance with the dvd-vr standard standing at the start point of individual chapter in the title recorded in the recording and playback apparatus. this drawing shows a data structure which an ep has. ep_type shows whether or not the ep has text information. ep_ptm shows positional information in the title to which the ep is set. here, it is shown in a form of time information with the start point of the title being a base point. prm_txti is provided in a case where it is shown by the above-described ep_type that the ep has text information, and the text information is accommodated therein. in some cases, this is used for storing a name applied to a chapter when an ep is used as a marker of the chapter boundary. these three data are established by the dvd_vr standard. property_flag is data particularly defined in the recording and playback apparatus of the present embodiment. this is flag information used when attribute information is set to a chapter, and has a sufficient number of bits so as to be able to be sorted into at least two or more types. in addition to those data, particular information can be made to correspond to an ep for the purpose other than the contents described in the present embodiment. however, when the particular information below the dvd-vr standard are stored on a recording medium, the particular information must be stored in a form different from that of the data defined in accordance with the dvd-vr standard. note that recording onto the hard disk 13a is not based on the dvd-vr standard. however, suppose that the property_flag is defined so as to correspond to the particular chapter boundary information which will be a marker of the chapter boundary. however, in the following description, in order to simplify the description, all the information used as the markers of chapter boundaries are called entry points (ep). as one technique of setting attribute information to the chapters, the aforementioned property_flag is used. namely, the attribute information are set to the chapters which are the partial regions in the title by setting values to the property_flags, and by sorting the chapters in accordance with the values set to the property_flags, the chapters which are the partial regions in the title are sorted on the basis of the attribute information. in accordance with the technique of providing attribute to the chapters by using the property_flags, the text information in the ep can be utilized in a form independently of sorting chapters. further, as another technique of setting attribute to the chapters, there is a technique of using the aforementioned ep_type showing the presence/absence of the text information. namely, attribute information are set to the chapters which are the partial'regions in the.title by setting text information to the eps standing at the start points.of the chapters, and by sorting the chapters in accordance with the presence/absence of text information by the values set to the ep_types, the chapters which are the partial regions in the title are sorted on the basis of the attribute information. therefore, because the aforementioned property_flags are not used when attributes are set to the chapters by using ep_types, the property_flags are fallen into disuse. in accordance with the technique of providing attribute to the chapters by using the ep_types, for example, a definition of data below the standard is unnecessary in the recording and playback apparatus in accordance with the dvd-vr standard. there is no need to add new data for describing attribute information in the recording and playback apparatus dependent on a particular data structure, and it is sufficient that a mechanism in which the presence/absence of text information which has been broadly used already is interpreted in another form is merely provided. furthermore, as an even another technique of setting attribute to the chapters, there is a technique of using the aforementioned prm_txti in which text information is accommodated as well. namely, attribute information are set to the chapters which are the partial regions in the title by setting text information of specific character string to the eps standing at the start points of the chapters, and by sorting the chapters in accordance with the presence/absence of the specific character string described in the prm_txtis, the chapters which are the partial regions in the title are sorted on the basis of the attribute information. therefore, when attribute are set to the chapters by using prm_txtis, because the aforementioned property_flags are not used, the property_flags are fallen into disuse. in accordance with the technique of providing attribute to the chapters by using the prm_txtis, for example, a definition of data below the standard is unnecessary in the recording and playback apparatus in accordance with the dvd-vr standard. there is no need to add new data for describing attribute information in the recording and playback apparatus dependent on a particular data structure, and it is sufficient that a mechanism in which the presence/absence of a specific character string is interpreted is merely provided with respect to text information which has been broadly used already. fig. 5 shows processing operations of setting the attribute information to the chapters by using the property_flags. first, in step s501, parameters needed for carrying'out the processing are inputted. here, a title number for specifying a title of a processing object, a chapter number for specifying a chapter of a processing object in the title, and a value of attribute information provided to the chapter, i.e., a value provided to the property_flag shown in fig. 4 are inputted. in the following step s502, an entry point (ep) standing at the start point of the chapter specified by the inputted chapter number is specified. finally, in step s503, the value of the attribute information inputted above to the property flag corresponding to the ep is set to the ep specified in step s502, and the processing is completed. note that, in the recording and playback apparatus, suppose that the inputting of the parameters in the above-described step s501 is carried out as shown hereinafter. for example, suppose that those parameters are inputted by operating the key input unit 30 shown in fig. 1 by a user. alternatively, the above-described parameters may be inputted on the basis of the information fed-back to the microcomputer block 17 via a route (not shown) on the basis of the signal detected by the a/v input unit 20 or the tv tuner unit 21 shown in fig. 1. concretely, for example, there is an example in which switching of a main program and a cm is detected on the basis of switching of audio signals to be mono/stereo of, and a chapter boundary is set at the portion of the switching, and moreover, separate attribute information are respectively set to the main program and the cm with respect to the chapter boundary. fig. 6 shows processing operations of registering a specific character string which will be a key when the chapters are sorted in accordance with the presence/absence of the specific character string described in prm txti. first, in step s601, a specific character string which will be a key at the time of sorting the chapters is inputted. in the following step s602, the inputted specific character string is stored on the recording and playback apparatus, and the processing is completed. note that, suppose that the input of a specific character string which will be a key in the step s601 is carried out, for example, by operating the key input unit 30 shown in fig. 1 by the user. further, suppose that the registration of the inputted specific character string is recorded, for example, on the hdd unit 13 shown in fig. 1, and moreover, the registration of the inputted specific character string is usually stored on the work ram 24 in order to make an access easy. further, due to the operations in the step s601 to step s602, the specific character string registered by the user is used as a key at the time of sorting the chapters. however, in addition thereto, the specific character string which is the sort key may be registered in advance in the recording and playback apparatus body. fig. 7 shows processing operations of interpreting the attribute information set to the chapters by using property_flags. first, in step s701, a chapter number for specifying a chapter which will be processing object is inputted. next, in step s702, an entry point (ep) standing at the start point of the objective chapter is specified. next, in step s703, a value of the attribute information set to the property_flag corresponding to the ep is interpreted with respect to the ep specified in step s702. finally, in step s704, the attribute of the chapter to be processed is determined on the basis of the value set to the property_flag, and the processing is completed. in this way, due to the mechanism which is property_flag being used independently of text information, it is possible to sort and process the chapters on the basis of a difference in the attribute information thereof independently of setting of a chapter name. note that concrete processings using the attribute information of the chapters obtained here will be described later. fig. 8 shows processing operations of interpreting the attribute information set to the chapters by using ep_types. first, in step s801, a chapter number for specifying a chapter to be processing object is inputted. next, in step s802, an entry point standing at the start point of the objective chapter is specified. next, in step s803, a value set to ep_type of the ep specified in step s802 is interpreted. finally, in step s804, the attribute of the chapter to be processed is determined on the basis of the value set to the ep_type,i.e., in accordance with the presence/absence, of text information, and the processing is completed. in this way, due to the mechanism in which the presence/absence of text information is interpreted as the difference in attribute information, it is possible to sort and process the chapters on the basis of a difference in the attribute information without adding new data for the attribute information. for example, when a play list in which only necessary chapters are collected is prepared, due to a chapter name being not provided to an unnecessary chapter, it is possible that only named chapters are extracted and registered with the play list. note that the concrete processing using the attribute information of the chapters obtained here will be described later. fig. 9 shows processing operations of interpreting the attribute information.set to the chapters by the technique of registering a specific character string which will be a key at the time of sorting the chapters with prm_txti. first, in step s901, a chapter number for specifying a chapter which will be a processing object is inputted. next, in step s902, an entry point (ep) standing at the start point of the objective chapter is specified. next, in step s903, a value set to an ep_type of the ep specified in step s902 is interpreted. in the following step s904, the processing is diverged in accordance with whether or not the aforementioned ep has text information with respect to the value of the ep_type interrupted in step s903. when the aforementioned ep does not have text information, the processing proceeds to step s907, and an attribute of the chapter is determined as "without text information", and the processing is completed. on the other hand, when the aforementioned ep has text information, the processing proceeds to step s905, and a specific character string described in a prm_txti of the ep is interpreted. at that time, the specific character string registered in the recording and playback apparatus by the processing operations described above in fig. 6, or the specific character string registered in advance in the recording and playback apparatus is used as a sort key. finally, in step s906, an attribute of the chapter to be processed is determined on the basis of a compared result of the character string described in the aforementioned prm txti and the specific character string which is a sort key, and the processing is completed. in this way, due to the mechanism in which the attribute information is determined on the basis of a specific character string described as text information, it is possible to sort and process the chapters on the basis of a difference in the attribute information without adding new data for the attribute information. for example, a mechanism in which such that a received television broadcast signal is analyzed, and due to a point of changing an audio signal to be mono/stereo being detected, a chapter division is carried out at a switching position of a main program and a cm, and at the same time, a chapter name which is "cm" is automatically provided to the chapter of the cm portion has been provided in advance. in accordance therewith, it is possible that the chapters including the specific character string which is "cm" are collectively deleted,'or the chapters which do not include the specific character string which is "cm" are extracted and registered with a play list. note that the concrete processing using the attribute information of the chapters obtained here will be described later. hereinafter, from figs. 10a and 10b on, examples relating to the concrete processings using the attribute information of the chapters are described. figs. 10a and 10b to 12 describe means for displaying such that the user can recognize differences in the attribute information by using the attribute information of the chapters. figs. 10a and 10b show one example in which the chapters are displayed such that differences in the attribute of each chapter can be recognized on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. in figs. 10a and 10b, in order to easily distinguish the chapters with specific attribute information among the attribute information set to the respective chapters, when a list of the chapters in the title is displayed on the screen, marks m are appended on the thumbnails of the chapters with specific attribute information, and are displayed. for example, there is an example of a concrete example in which, when the attribute information are set to the chapters by.using prm_txti, "cm mark"s are indicated on the thumbnails of the chapters in which a specific character string which is "cm" is described in the text information among the chapters included in the recorded title. note that, in figs. 3a and 3b described above, an example is shown in which frames are appended to the thumbnails of the chapters with specific attribute information in place of the marks m, and are displayed. fig. 11 shows processing operations of displaying a difference in the attribute of each chapter so as to be recognizable on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1101, a number of a title which is an object in which a list-display of chapters is carried out is inputted. next, in step s1102, initial values of chapter numbers to be displayed are set. due to the design specification of the recording and playback apparatus, because the number of the thumbnails of the chapters which can be displayed, within the screen is limited, when there are many chapters in the title, all of the chapter thumbnails cannot be displayed at a time, and there is no choice but to take a mode in which the thumbnails are displayed by several thumbnails by using the so-called page-turning mechanism. therefore, the initial values of the chapter numbers in step s1102 are to be a number of the first chapter in the chapter group in units of several chapters which are displayed at a time. next, in step s1103, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. in the following step s1104, marks are indicated on the thumbnails of the chapters on the basis of the interpreted attribute information of the chapters. here, as shown above in fig. 10a, marks m may be indicated on the thumbnails of the chapters with specific attribute information. or, separate marks may be indicated with respect to the thumbnails of all the chapters on the basis of a difference in the attribute information. further, marks may be indicated on the basis of, not only the logic of "selection" that some specific information is provided, but also the logic of "rejection" that some specific information is not provided. next, in step s1105, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. as described above, because the number of the thumbnails of the chapters which can be displayed within the screen is limited due to the design specification of the recording and playback apparatus, the last chapter described here shows the last chapter in the chapter group in units of several chapters which are displayed at a time. when it is determined that the chapter to be processed is not the last chapter yet in the step s1105, the processing proceeds to step s1106, the chapter number is updated, and the processing operations described above in step s1103 to step s1105 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. fig. 12 shows other processing operations of displaying a difference in the attribute of each chapter so as to be recognizable on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1201, a number of the title which is an object in which a list-display of chapters is carried out is inputted. next, in step s1202, initial values of the chapter numbers to be displayed are set. the initial values of the chapter numbers are as described above in step s1102 of fig. 11. subsequently, in step s1203, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. in the following step s1204, frames are indicated on the thumbnails of the chapters on the basis of'the interpreted attribute information of the chapters. here, as shown above in fig. 3a, frames may be indicated on the thumbnails of the chapters with specific attribute information. or, frames whose colors, patterns, or the like are made different from each other on the basis of a difference in the attribute information may be indicated on the thumbnails of all the chapters. further, frames may be indicated on the basis of, not only the logic of "selection" that some specific information is provided, but also the logic of "rejection" that some specific information is not provided. next, in step s1205, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. this last chapter is as described above in step s1105 of fig. 11. when it is determined that the chapter is not the last chapter yet in the step s1205, the processing proceeds to step s1206, the chapter number is updated, and the processing operations in step s1203 to step s1205 described above are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. in accordance with a series of the processing operations in fig. 11 or 12 described above, because differences in the attribute information of the chapters in addition to the thumbnails of the chapters are visualized and displayed, it is easy to determined what characteristic the chapter has, and whether the chapter is a necessary chapter or an unnecessary chapter, and the convenience of the user is improved. note that, in the examples described by using figs. 3a, 3b, 10a, and 10b to 12; a list-display of the chapters is carried out by indicating the thumbnails of the chapters. however, it goes without saying that this is not limited to the thumbnail display, and can be applied to a chapter list-display without using the thumbnails. for example, in a list-display of the chapters by indicating character strings such as chapter names and chapter numbers, on the basis of differences in the attribute information of the chapters, it can be realized in a mode in which the colors of the character strings or the colors of the backgrounds of the character strings are made different from each other and indicated, or it can be realized in a mode in which marks are indicated beside the character strings. further, a list-display of the chapters in accordance with the examples described by using figs. 3a, 3b, 10a, and 10b to 12 can be realized, for example, in a mode in which the recorded contents are list-displayed, or may be a list-display of the chapters as a display of a parts list which can be registered with the play list at the time of editing the play list. figs. 13 to 23 describe means for carrying out processings which are the same level as even more complicated editing operations by simple operations carried out by the user by utilizing attribute information of the chapters. first, figs. 13 to 20 show examples of a case where editing processings are collectively applied with respect to a plurality of chapters in one title which exist and which have the same attribute. fig. 13 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically carrying out parts registration with a play list, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1301, a play list which is an editing object is ensured. when the play list is newly prepared, a new play list is ensured, and the title numbers thereof are made to be editing objects. further, when an existing prepared play list is reedited, the title numbers in the play list to be reedited are made to be editing objects. next, in step s1302, a number of the title selected as a part is inputted. this editing function is configured such that only necessary chapters are automatically extracted and registered with the play list due to the processings from step 51303 on which will be described hereinafter. therefore, in the step s1302, it is sufficient that the user designates only the title number as a part, and there is no need to designate the chapters to be registered as a part included in the title one by one. subsequently, in step s1303, a number of the first chapter which will be a processing object among the chapters included in the title inputted at the above-described step s1302 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the first chapter be an initial value. attribute information of the chapter to be an object is verified. further, provided that some chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be the initial value. in the following step s1304, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1305, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1304 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1306, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1307, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s1308, the processing is diverged in accordance with whether or not the chapter which is a current processing object is a chapter extracted in step s1306 or step s1307. when the chapter which is a current processing object is a chapter extracted in step s1306 or step s1307, the processing proceeds to step s1309, and the chapter is registered as a part with the play list which is an editing object. in contrast thereto, when the chapter which is a current processing object is not a chapter extracted in the step s1306 or step s1307, step s1309 is skipped, and the chapter is not registered as a part with the play list. in the following step s1310, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects; it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1310, the processing proceeds to step s1311, the chapter number is updated, and the processing operations in step s1304 to step s1310 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 13, when a play list is newly prepared or reedited, only necessary chapters are automatically registered as parts with the play list by merely designating only the title as a part by the user. in accordance therewith, an editing result which is the same as in a case where a play list is constructed by collecting necessary parts one by one can be realized with simple operations, and the ease of operation of the user is improved. fig. 14 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above, and of dubbing those as one title. first, in step s1401, a number of the title which is a dubbing object is inputted. further, in addition thereto, media which are dubbing destinations are designated. this editing function is configured such that only necessary chapters are automatically extracted and dubbed by the processings from step s1402 on. therefore, in the step s1401, it is sufficient that the user merely designates only a number of the title which is a dubbing object, and there is no need to designate the chapters which are dubbing objects included in the title one by one. further, as the dubbing destinations, separate media are designated as the dubbing destinations such that the contents on the hard disk 13a are dubbed onto the optical disk 11 or the contents on the optical disk 11 are dubbed onto the hard disk 13a by using the two types of disk drive units shown in fig. 1 which the recording and playback apparatus has. moreover, the contents on the hard disk 13a and the optical disk 11 can be respectively dubbed onto the same media. concretely, there is an example of processing in which a play list is made to be an original title on the same media by appropriating a mechanism of dubbing. in such a case, the disk drive unit on which the contents to be dubbed have been recorded is designated as a dubbing destination. next, in step s1402, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s1401 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s1403, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1404, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1403 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1405, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1406, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s1407, the processing is diverged in accordance with whether or not the chapter which is a current processing object is a chapter extracted in the step s1405 or step s1406. if the chapter which is a current processing object is a chapter extracted in the step s1405 or step s1406, the processing proceeds to step s1408, and the chapter is registered with the dubbing list in which dubbing objects are described. in contrast thereto, when the chapter which is a current processing object is not a chapter extracted in step s1405 or step s1406, step s1408 is skipped, and the chapter is not registered with the dubbing list. in the following step s1409, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1409, the processing proceeds to step s1410, the chapter number is updated, and the processing operations in step s1403 to step s1409 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, the processing proceeds to step s1411. in the following step s1411, the chapters registered with the dubbing list in the step s1408 are collected into one title, and are dubbed. next, in step s1412, the processing is diverged in accordance with whether the dubbing processing is a "moving" system in which the title which is a dubbing object is deleted or a "copy" system in which the title which is a dubbing object is stored as is. if it is the dubbing by the "moving" system, the processing proceeds to step s1413, and the title which is a dubbing object is deleted. at that time, the title which is a dubbing object may be deleted so as to include the aforementioned chapters which have not been registered with the dubbing list, or, the aforementioned chapters which have not been registered with the dubbing list may be not deleted and left. further, when it is not the dubbing by the "moving" system, step s1413 is skipped, and a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 14, when dubbing is carried out, only necessary chapters are automatically collected into one title and dubbed by merely designating only the title by the user. in accordance therewith, an editing result which is the same as in a case where dubbing is carried out by collecting necessary chapters one by one and those are collected into one title can be realized with simple operations, and the ease of operation of the user is improved. fig. 15 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically dubbing those as respectively separate titles, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1501, a number of the title which is a dubbing object is inputted. further, in addition thereto, media which are dubbing destinations are designated. this editing function is configured such that only necessary chapters are automatically extracted and dubbed by the processings from step s1502 which will be described hereinafter on. therefore, in the step s1501, it is sufficient that the user merely designates only a number of the title which is a dubbing object, and there is no need to designate the chapters which are dubbing objects included in the title one by one. further, as the dubbing destinations, separate media are designated as the dubbing destinations such that the contents on the hard disk 13a are dubbed onto the optical disk 11 or the contents on the optical disk 11 are dubbed onto the hard disk 13a by using the two types of disk drive units which the recording and playback apparatus shown in fig. 1 has. moreover, the contents on the hard disk 13a and the optical disk 11 can be respectively dubbed onto the same media. concretely, there is an example of processing in which the play list is made to be an original title on the same media by appropriating the mechanism of dubbing. in such a case, the disk drive unit on which the contents to be dubbed are recorded are designated as the dubbing destinations. next, in step s1502, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s1501 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s1503, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1504, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1503 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1505, and the chapters with some attribute information are extracted. concretely, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1506, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s1507, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s1505 or step s1506. when the chapter which is a current processing object is the chapter extracted in the step s1505 or step s1506, the processing proceeds to step s1508, and the chapter is registered with the dubbing list in which dubbing objects are described. in contrast thereto, when the chapter which is a current processing object is not the chapter extracted in the step s1505 or step s1506, step s1508 is skipped, and the chapter is not registered with the dubbing list. in the following step s1509, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1509, the processing proceeds to step s1510, the chapter number is updated, and the processing operations described above in step s1503 to step s1509 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, the processing proceeds to step s1511. next, in step s1511, the chapters registered with the dubbing list in the step s1508 are dubbed as respectively separate titles. next, in step s1512, the processing is diverged in accordance with whether the dubbing processing is a "moving" system in which the title which is a dubbing object is deleted or a "copy" system in which the title which is a dubbing object is stored as is. if it is dubbing by the "moving" system, the processing proceeds to step s1513, and the title which is a dubbing object is deleted. at that time, the title which is a dubbing object may be deleted so as to include the aforementioned chapters which have not been registered with the dubbing list, or the aforementioned chapters which have not been registered with the dubbing list may be not deleted and left. further, when it is not the dubbing by the "moving" system, step s1513 is skipped, and a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 15, when dubbing is carried out, by merely designating only the title by the user, necessary chapters are automatically dubbed as respectively separate titles. in accordance therewith, an editing result which is the same as in a case where necessary chapters are respectively dubbed one by one can be realized with simple operations, and the ease of operation of the user is improved. fig. 16 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically deleting only chapters with some attribute, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1601, a number of the title which is a deleting object is inputted. this editing function is configured such that only specific chapters are automatically extracted and deleted by the processings from step s1602 which will be described hereinafter on. therefore, in the step s1601, it is sufficient that the user merely designates only a number of the title which will be a deleting object, and there is no need to designate the chapters which are deleting objects included in the title one by one. next, in step s1602, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s1601 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s1603, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1604, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1603 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1605, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1606, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s1607, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s1605 or step s1606. when the chapter which is a current processing object is the chapter extracted in the step s1605 or step s1606, the processing proceeds to step s1608, and the chapter is deleted. in contrast thereto, when the chapter which is a current processing object is not the chapter extracted in the step s1605 or step s1606, step s1608 is skipped, and the chapter is not deleted. in the following step s1609, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is' the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1609, the processing proceeds to step s1610, the chapter number is updated, and the processing operations described above in step s1603 to step s1609 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, the processing proceeds to step s1611. in the following step s1611, the processing is diverged in accordance with whether or not the title to be processed is made to be empty by deleting the chapters. there is an example of a case where, for example, all the chapters included in the title to be processed have the same attribute, and are extracted in step s1605 or step s1606, and as a result thereof, all the chapters in the title are deleted. if the title to be processed is made to be empty, the processing proceeds to step s1612, and the empty title to be processed is deleted. further, when the title to be processed is not made to be empty, step s1612 is skipped, and a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 16, when deleting of chapters is carried out, by merely designating only the title by the user, all the chapters with some attribute included in the title are automatically deleted. in accordance therewith, an editing result which is the same as in a case where each chapter is selected and deleted can be realized with simple operations, and the ease of operation of the user is improved. fig. 17 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically deleting only chapters with some attribute, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1701, a number of the title to be played-back is inputted. this editing function is configured such that only specific chapters are automatically extracted and playback-displayed or preview-displayed by the processings from step s1702 which will be described hereinafter on. therefore, in the step s1701, it is sufficient that the user merely designates only a number of the title to be played-back, and there is no need to designate the chapters to be played-back included in the title one by one. next, in step s1702, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s1701 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s1703, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1704, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1703 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1705, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1706, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s1707, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s1705 or step s1706. if the chapter which is a current processing object is the chapter extracted in the step s1705 or step s1706, the processing proceeds to step s1708. in step s1708, the processing is diverged in accordance with whether or not the chapter to be processed is played back in a "preview mode". in a case of a "preview mode", the processing proceeds to step s1709, and only one part of the chapter is playback-displayed. further, in a case of not a "preview mode", the processing proceeds to step s1710, and the entire chapter is playback-displayed. further, in the step s1707, the chapter which is a current processing object is not the chapter which was extracted in the step s1705 or step s1706, the processings in the step s1708 to step s1710 are skipped, and a playback-display of the chapter is not carried out. next, in step s1711, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1711, the processing proceeds to step s1712, the chapter number is updated, and the processing operations in step s1703 to step s1711 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 17, when a playback or preview of chapters is carried out, by merely. designating only the title by the user, only the chapters with some attribute included in the title are automatically selectively playback-displayed. in accordance therewith, even without the contents being grasped due to only the chapters with some attribute being collectively preview-displayed, or even without a play list being prepared, it is possible to obtain a result which is the same as in the display of the prepared play list due to only the chapters which are intended to be registered with the play list being collectively playback-displayed, and the ease of operation of the user is improved. fig. 18 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of combining adjacent chapters with some attribute into one chapter, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1801, a number of the title to be processed is inputted. this editing function is configured such that only adjacent specific chapters are automatically extracted and combined by the processings from step s1802 which will be described hereinafter on. therefore, in the step s1801, it is sufficient that the user merely designates only a number of the title to be processed, and there is no need to designate the chapters to be processed included in the title one by one. next, in step s1802, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s1801 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s1803, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1804, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1803 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1805, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1806, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm"' described therein as text information are not extracted. next, in step s1807, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s1805 or step s1806. if the chapter which is a current processing object is the chapter extracted in the step s1805 or step s1806, the processing proceeds to step s1808, and the attribute information of the next chapter adjacent to the chapter which is a current processing object is verified. this is realized by the processing operations described above in figs. 7 to 9. next, the processing proceeds to step s1809, it is determined whether or not the aforementioned chapter which is a current processing object and the next chapter adjacent thereto have the same attribute. when these two chapters have the same attribute, the processing proceeds to step s1810, and the chapter which is a current processing object and the next chapter adjacent thereto are determined as a pair which can be combined together, and registered with the list. further, in contrast thereto, when these two chapters have respectively separate attributes, step s1810 is skipped, and those are not registered with the list for combination object chapters. further, in the step s1807, the chapter which is a current processing object is not the chapter extracted in the step s1805 or step s1806; a series of the processings in the step s1808 to step s1810 are skipped. next, in step s1811, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1811, the processing proceeds to step s1812, the chapter number is updated, and the processing operations in step s1803 to step s1811 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, the processing proceeds to step s1813. in step s1813, chapters which have been registered with the list for combination object chapters in the step s1810, the chapters having the same attribute and being adjacent to one another are combined into one, and a series of the processing operations are completed. in accordance with a series of the processing operations described in fig. 18, when the adjacent chapters with the same attribute are combined, by merely designating only the title by the user, chapters which have the same attribute and which are adjacent to one another are automatically combined. in accordance therewith, an editing result which is the same as in a case where the chapters with the same attribute are collected into one play list and all of the chapters are combined can be realized with simple operations, and the ease of operation of the user is improved. figs. 19 and 20 show processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of carrying out regular interval chapter division with only the chapters with some attribute being as the objects, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s1901, a number of the title to be processed and a time interval for chapter division are inputted. this editing function is configured such that only necessary chapters are automatically extracted and regular interval chapter division is carried out thereto by the processings from step s1902 which will be described hereinafter on. therefore, in the step s1901, it is sufficient that the user merely designates only a number of the title to be processed, and there is no need to designate the chapters which are processing objects included in the title one by one. next, in step s1902, an initial value of a time interval up to a dividing position at which chapter division is carried out is set. here, the time interval inputted in the step s1901 is set as is. in the following step s1903, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s1901 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. subsequently, in step s1904, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s1905, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s1904 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s1906, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names are set are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s1907, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. in the following step s1908, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s1906 or step s1907. if the chapter which is a current processing object is the chapter extracted in the step s1906 or step s1907, the processing proceeds to step s1909, and it is determined whether or not the chapter dividing position goes over the chapter. when the chapter dividing position does not go over the chapter, the processing proceeds to step s1910, and the chapter division is executed in the step. next, the processing proceeds to step s1911, a time interval up to the next dividing position is set, and the processing returns to the aforementioned step s1909. in this way, unless the chapter dividing position set on the basis of the inputted time interval goes over the chapter, the processings in the step s1909 to step s1911 are repeated, and regular interval chapter division is carried out. when the set chapter dividing position goes over the chapter in the step 1909, the processing proceeds to step s1912. in step s1912, a value obtained by subtracting a time of the remaining portion of the chapter from the set time interval is set as a time interval up to the next chapter dividing position. for example, if the time interval for the regular interval chapter division inputted in the step s1901 is at intervals of 5 minutes, and when the remaining portion of the chapter is three minutes, two minutes obtained by subtracting three minutes from five minutes is made to be the time interval up to the first chapter dividing position in the next chapter. further, in the step s1908, when the chapter which is a current processing object is not the chapter extracted in the step s1906 or step s1907, a series of the processings in step s1909 to step s1912 are skipped. in the following step s1913, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the'title. in addition, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s1913, the processing proceeds to step s1914, the chapter number is updated, and the processing operations in step s1904 to step s1913 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processings are entirely completed. in accordance with a series of the processing operations described in figs. 19 and 20, by merely designating only the title by the user, regular interval chapter division can be automatically applied to only the chapters with the same attribute. in accordance therewith, an editing result which is the same as in a case where the chapters with the same attribute are collected into one play list and regular interval chapter division is carried out can be carried out with simple operations, and the ease of operation of the user is improved. fig. 21 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of automatically changing chapters with some attribute collectively so as to have another attribute, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s2101, a number of the title to be processed is inputted. this editing function is configured such that only specific chapters are automatically extracted and the attribute thereof are changed by the processings from step s2102 which will be described hereinafter on. therefore, in the step s2101, it is sufficient that the user merely designates only a number of the title to be processed, and there is no need to designate the chapters which are changing objects included in the title one by one. further, in step s2101, in addition thereto, values of the attribute information after changing attribute are inputted. here, in a case where the above-described property_flag described above is used, a value newly set to the property_flag of an entry point (ep) is inputted. further, in a case where the above-described ep_type is used, an operation such as setting of an appropriate name, or erasing of a chapter name corresponds thereto. moreover, in a case where the above-described prm_txti is used, an operation of setting an appropriate character string as text information of a chapter corresponds thereto. next, in step s2102, a number of the first chapter which will be a processing object among the chapters included in the title inputted in the step s2101 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s2103, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s2104, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s2103 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s2105, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are'extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s2106, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s2107, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s2105 or step s2106. if the chapter which is a current processing object is the chapter extracted in the step s2105 or step s2106, the processing proceeds to step s2108, and the attribute information of the chapter is changed. in contrast thereto, when the chapter which is a current processing object is not the chapter extracted in the step s2105 or step s2106, step s2108 is skipped, and the attribute information of the chapter is not changed. next, in step s2109, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s2109, the processing proceeds to step s2110, the chapter number is updated, and the processing operations in step s2103 to step s2109 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 21, when the attribute of the chapter is changed, by merely designating only the title by the user, the attribute of the chapters with some attribute included in the title can be collectively automatically changed. next, figs. 21 to 24 show processing operations in which a plurality of chapters which exist in one title and which have the same attribute are made to be objects for editing processing while being sequentially switched. namely, originally, the editing operation is to be applied to one chapter. however, chapters with the same attribute are extracted, those are made to be a processing object one by one for the editing operation, and the user collectively applies the editing processing onto those. fig. 22 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of applying "chapter thumbnail setting" while sequentially switching chapters with the same attribute, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s2201, a number of the title to be processed is inputted. this editing function is configured such that only specific chapters are extracted and those are one by one made to be a processing object for "chapter thumbnail setting" by the processings from step s2202 which will'be described hereinafter on. therefore, in the step s2201, it is sufficient that the user merely designates only a number of the title to be processed, and there is no need to designate the chapters which are processing objects included in the title one by one. next, in step s2202, a number of the first chapter which will be a processing object for "chapter thumbnail setting" among the chapters included in the title inputted in the step s2201 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s2203, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s2204, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s2203 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s2205, and the chapters with some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having chapter names set thereto are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s2206, and the chapters without some attribute information are extracted. concretely, for example, there is an example of processing in which the chapters having the specific character string that is "cm" described therein as text information are not extracted. next, in step s2207, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s2205 or step s2206. if the chapter which is a current processing object is the chapter extracted in the step s2205 or step s2206, the processing proceeds to step s2208. in step s2208, the aforementioned current processing object chapter is made to be a processing object for "chapter thumbnail setting". in the following step s2209, the processing is diverged in accordance with whether or not "chapter thumbnail setting" processing with respect to the aforementioned current processing object chapter is carried out. in a case of carrying out this processing, the processing proceeds to step s2210, and the user executes "chapter thumbnail setting" on the operation screen. in contrast thereto, in a case where this processing is not carried out, step s2210 is skipped, and the user does not execute "chapter thumbnail setting". further, in the step s2207, when the aforementioned current processing object chapter is not the chapter extracted in the step s2205 or step s2206, a series of the processing operations in step s2208 to step s2210 is skipped. in the following step s2211, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s2211, the processing proceeds to step s2212, the chapter number is updated, and the processing operations in step s2203 to step s2211 are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 22, when "chapter thumbnail setting" is applied to the chapters with the same attribute one by one, because the chapters with the same attribute are automatically prepared as an operating object one by one without the user opening the operation screen in order to search a chapter to be processed each time, the ease of operation of the user is improved. fig. 23 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of applying "chapter name setting" while sequentially switching chapters with the same attribute, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s2301, a number of the title to be processed is inputted. this editing function is configured such that only specific chapters are extracted and those are one by one made to be a processing object for "chapter name setting" by the processings from step s2302 which will be described hereinafter on. therefore, in the step s2301, it is sufficient that the user merely designates only a number of the title to be processed, and there is no need to designate the chapters which are processing objects included in the title one by one. next, in step s2302, a number of the first chapter which will be a processing object for "chapter name setting" among the chapters included in the title inputted in the step s2301 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s2303, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s2304, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s2303 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s2305, and the chapters with some attribute information are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s2306, and the chapters without some attribute information are extracted. next, in step s2307, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s2305 or step s2306. if the chapter which is a current processing object is the chapter extracted in the step s2305 or step s2306, the processing proceeds to step s2308. in step s2308, the aforementioned current processing object chapter is made to be a processing object for "chapter name setting". in the following step s2309, the processing is diverged in accordance with whether or not "chapter name setting" processing with respect to the aforementioned current processing object chapter is carried out. in a case of carrying out this processing, the processing proceeds to step s2310, and the user executes "chapter name setting" on the operation screen. in contrast thereto, in a case where this processing is not carried out, step s2310 is skipped, and the user does not execute "chapter name setting". further, in the step s2307, when the current processing object chapter is not the chapter extracted in the step s2305 or step s2306, a series of the processing operations in step s2308 to step s2310 are skipped. in the following step s2311, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s2311, the processing proceeds to step s2312, the chapter number is updated, and the processing operations in step s2303 to step s2311 described above are applied to the new chapter. further, when it is determined that the chapter is the last chapter, a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 23, when "chapter name setting" is applied to the chapters with the same attribute one by one, because the chapters with the same attribute are automatically prepared as an operating object one by.one.without the user opening the operation screen in order to search a chapter to be processed each time, the ease of operation of the user is improved. note that a series of the processing operations described in fig. 23 are genuinely made to be an editing function for "chapter name setting" when the attribute information is set to each chapter in the title by using the property_flag described above. on the other hand, when the attribute information is set to each chapter in the title by using the ep_type or prm_txti described above, a series of the processing operations described in fig. 23 serve as a function of setting the attribute information with respect to the chapters in addition to a function as "chapter name setting". fig. 24 shows processing operations of sorting the chapters in the title in accordance with differences in the attribute information, and of applying "chapter deletion" while sequentially switching chapters with the same attribute, on the basis of the attribute information set to each chapter in the title by the three types (property_flag, ep_type, prm_txti) of means described above. first, in step s2401, a number of the title to be processed is inputted. this editing function is configured such that only specific chapters are extracted and those are one by one made to be a processing object for "chapter deletion" by the processings from step s2402 which will be described hereinafter on. therefore, in the step s2401, it is sufficient that the user merely designates only a number of the title to be processed, and there is no need to designate the chapters which are processing objects included in the title one by one. next, in step s2402, a number of the first chapter which will be a processing object for "chapter deletion" among the chapters included in the title inputted in the step s2401 is set. usually, if all of the chapters in the title are made to be objects, it is recommended that the fist chapter be made to be an initial value. further, if some of the chapters in the title are made to be objects, a number of the first chapter among the chapters included within the objective range can be made to be an initial value. in the following step s2403, the attribute information of the chapters which will be objects are verified. this is realized by the processing operations described above in figs. 7 to 9. next, in step s2404, the processing is diverged in accordance with how the attribute information of the chapters verified in the step s2403 are handled. namely, the processing is diverged in accordance with whether it is based on the logic of "selection" that the chapters with some attribute information are made to be objects, or it is based on the logic of "rejection" that the chapters without some attribute information are made to be objects. if it is based on the logic of "selection", the processing proceeds to step s2405, and the chapters with some attribute information are extracted. further, if it is based on the logic of "rejection", the processing proceeds to step s2406, and the chapters without some attribute information are extracted. next, in step s2407, the processing is diverged in accordance with whether or not the chapter which is a current processing object is the chapter extracted in the step s2405 or step s2406. if the chapter which is a current processing object is the chapter extracted in the step s2405 or step s2406, the processing proceeds to step s2408. in step s2408, the aforementioned current processing object chapter is made to be a processing object for "chapter deletion". in the following step s2409, the processing is diverged in accordance with whether or not the user consents to the deletion of the aforementioned current processing object chapter. concretely, a warning screen such as "this chapter will be deleted. are you sure you want to delete this chapter? yes/no" is indicated on the operation screen, and due to the user being made to select yes/no, the processing is diverged in accordance with whether or not the user consents to the deletion of the aforementioned current processing object chapter. if the user consents to the deletion of the chapter, the processing proceeds to step s2410, and the chapter is deleted. in contrast thereto, in a case where the user does not consent to the deletion, step s2410 is skipped, and "chapter deletion" is not carried out. further, in the step s2407, when the chapter which is a current processing object is not the chapter extracted in the step s2405 or step s2406, a series of the processing operations in step s2408 to step s2410 are skipped. in the following step s2411, the processing is diverged in accordance with whether or not the chapter to be processed is the last chapter. usually, if all of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included in the title. further, if some of the chapters in the title are made to be objects, it is determined whether or not the chapter is the last chapter among the chapters included within the objective range. when it is determined that the chapter is not the last chapter yet in the step s2411, the processing proceeds to'step s2412, the chapter number is updated, and the processing operations in step s2403 to step s2411 described above are applied to the new chapter. further, when it is determined that the chapter is the last chapter, the processing proceeds to step s2413. next, in step s2413, the processing is diverged in accordance with whether or not the title to be processed is made to be empty by deleting the chapters. there is an example of a case where, for example, all the chapters included in the title to be processed have the same attribute, and are extracted in step s2405 or step s2406, and as a result thereof, all the chapters in the title are deleted. if the title to be processed is made to be empty, the processing proceeds to step s2414, and the empty title to be processed is deleted. further, if the title to be processed is not empty, step s2414 is skipped, and a series of the processing operations are entirely completed. in accordance with a series of the processing operations described in fig. 24, when "chapter deletion" is applied to the chapters with the same attribute one by one, because the chapters with the same attribute are automatically prepared as a deleting object one by one without the user opening the operation screen in order to search a chapter which is a deleting object each time, the ease of operation of the user is improved: further, in accordance with a series of the processing operations described in fig. 24, because it is configured such that the user is asked whether deletion is possible or impossible with respect to each chapter which is a deleting object, editing operation having even minute contents in which the chapters with the same attribute are not deleted collectively, and some of those are not deleted and left is possible. therefore, the ease of operation of the user is improved. the embodiment of the present invention has been described above with reference to the drawings. however, the present invention is not limited to the above-described embodiment as is, and disclosed components can be modified and realized within a range which does not deviate from the gist of the present invention at the practical phase. for example, there has been described with reference to figs. 3a, 3b, 10a, and 10b to 12 the means for displaying such that differences in the attribute information of the chapters can be recognized in accordance with a mode in which marks m are indicated on the thumbnails of the chapters with specific attribute information, or the thumbnails of the chapters with specific attribute information are framed and displayed, when a list of the chapters in a title is displayed on the screen. however, the present invention is not limited to this mode, any means for displaying differences in the attribute of each chapter so as to be recognizable may be further in a different mode. for example, it may be a mode in which the thumbnails of all the chapters in the title are not displayed, but the chapters are divided into groups for each attribute information, and only thumbnails of a group of chapters with the same attribute information are list-displayed, and moreover, thumbnails of a group of chapters with another attribute information are list-displayed by a switching function. further, various inventions can be formed by appropriately combining a plurality of disclosed components which have been disclosed in the embodiment described above. for example, some of disclosed components may be eliminated from all the disclosed components shown in the embodiment. moreover, disclosed components according to different embodiments may be appropriately combined.
021-164-437-694-598	IT	[ "WO", "IT", "EP" ]	D06B17/06,D06B19/00,F26B13/10	2017-05-12T00:00:00	2017	[ "D06", "F26" ]	a machine for treating folded printed fabrics	a machine for the treatment of folded fabrics comprising: a box frame (10); a plurality of sticks (20), operating in said box frame (10) for supporting a printed fabric (t) and forming folds of said printed fabric (t); a handling structure (30), active on said sticks (20) to advance said sticks (20) along a substantially closed path (p). said path (p) comprises: an operating stretch (tl), wherein said sticks support the printed fabric (t), said operating stretch (tl) having a beginning (t1a) and an end (tib); a recirculation stretch (t2), wherein the sticks (20) are transported from the end (tib) of said operating stretch (tl) to the beginning (t1a) of said operating stretch (tl). the machine (1) further comprises an uncoupling station (40), active in said recirculation stretch (t2) and configured to adjust a distance between each of said sticks (20) and the next stick.	claims 1. machine for the treatment of folded fabrics comprising : a) a box frame (10) ; b) a plurality of sticks (20), operating in said box frame (10) for supporting a printed fabric (t) and forming folds of said printed fabric (t) ; c) a handling structure (30), active on said sticks (20) to advance said sticks (20) along a substantially closed path (p) , according to a predetermined advancement direction, wherein said path (p) comprises: an operating stretch (tl), wherein said sticks support the printed fabric (t) , said operating stretch (tl) having a beginning (t1a) and an end (tib) ; a recirculation stretch (t2), wherein the sticks (20) are transported from the end (tib) of said operating stretch (tl) to the beginning (t1a) of said operating stretch (tl) , d) an uncoupling station (40), active in said recirculation stretch (t2) and configured to adjust a distance between each of said sticks (20) and the next stick. 2. machine according to claim 1, wherein the sticks (20), in at least a portion of said recirculation stretch (t2), advance at different speeds with respect to the sticks (20) in said operating stretch (tl) . 3. machine according to claim 1 or 2, wherein said box frame (10) consists of a pair of side walls (11, 12), substantially parallel to the advancement direction of said sticks (20), each of said side walls (11, 12) being provided with guides (g) for said sticks (20) . 4. machine according to any one of claims 1 to 3, wherein said uncoupling station (40) comprises: a) a buffer (41) configured to accommodate one or more sticks (20) coming from the end (tib) of said operating stretch (tl) and to keep said one or more sticks (20) substantially stationary; b) a support element (41c) for supporting a stationary stick (20f), in a more advanced position with respect to the sticks (20e) accommodated in said buffer (41); c) an activation device (42) configured to act on the stick (20f) supported by said support element (41c) and advance said stick (20f) towards the beginning (t1a) of said operating stretch (tl) . 5. machine according to claim 4, wherein said activation device (42) is controllable between a stand-by condition, in which it does not act on sticks (20) present in said buffer (41), and an operating condition, in which it acts on said stick (20) . 6. machine according to claim 5, further comprising a control unit (50) configured to send a control signal (sig) to said activation device (42) to drive said activation device (42) from said stand-by condition to said operating condition. 7. machine according to any one of claims 4 to 6, wherein said activation device (42) comprises a toothed wheel or chain portion (42a) which, in said operating condition, couples with a toothed wheel (22, 23) being part of said stick (20) present in said buffer (41) to promote the advancement of said at least one stick (20) towards the beginning (t1a) of said operating stretch (tl) . 8. machine according to any one of claims 4 to 7, wherein said buffer (41) comprises: a) a chain portion (41a), kept moving by a motorized member, and supporting sticks (20) present in said buffer (41); b) a first locking device (41b) for stopping the advancement of said sticks (20) present in said buffer (41) while said chain portion (41a) is kept in motion. 9. machine according to any one of the preceding claims, wherein the handling structure (30), in said operating stretch (tl), comprises a first motorized chain (60) supporting the sticks (20a) advancing from the beginning (t1a) to the end (tib) of said operating stretch (tl) , and preferably a second motorized chain (61), arranged superiorly to said first motorized chain (60) and cooperating with said first motorized chain (60) to advance said sticks (20a) . 10. machine according to any one of the preceding claims, wherein the recirculation stretch (t2) comprises a retrieval zone (zl), in which the sticks (20) coming from the end (tib) of said operating stretch (tl) are retrieved and advanced, wherein the handling structure (30), in said retrieval zone (zl), is preferably provided with a first fixed chain or rack (70) and a third motorized chain (80) . 11. machine according to claim 10, wherein said recirculation stretch (t2) comprises a directing zone (z2) wherein the sticks (20) from said retrieval zone (zl) are directed towards said uncoupling station (40), wherein the handling structure (30), in said directing zone (z2), preferably comprises a fourth motorized chain (90) which carries the sticks from said retrieval zone (zl) to said uncoupling station (40) . 12. machine according to any one of the preceding claims, wherein said recirculation stretch (t2) comprises an ascent zone (z3) in which the sticks (20) provided by said uncoupling station (40) are guided towards the beginning (t1a) of said operating stretch (tl), wherein the handling structure (30), in said ascent zone (z3), preferably comprises a second fixed chain or rack (100) and a fifth motorized chain (110) . 13. machine according to any one of the preceding claims, wherein each of said sticks (20) comprises: a) a tubular body (21) for supporting said folded fabric (t) , said tubular body (21) having a first axial end (21a) and a second axial end (21b) opposite to said first axial end (21a) ; b) a first toothed wheel (22), mounted to the first axial end (21a) of said tubular body (21) in an axially proximal position; c) a second toothed wheel (23), mounted to the first axial end (21a) of said tubular body (21) in an axially distal position. 14. machine according to claim 13, wherein each of said sticks (20) further comprises a driving wheel (24), mounted to said first end axial (21a) in axial position opposite to said first toothed wheel (22) with respect to said second toothed wheel (23), said driving wheel being coupled to the guide (g) present on one of said side walls (11, 12) . 15. method for handling sticks (20) in a machine (1) for the treatment of folded fabrics, said method comprising: a) advancing sticks (20) along an operating stretch (tl) , from a beginning (t1a) to an end (tib) ; b) advancing said sticks (20) along a recirculation stretch (t2), from the end (tib) of said operating stretch (tl) to the beginning (t1a) of said operating stretch; c) in said recirculation stretch (t2), adjusting the distance between each stick (20) and the next stick . 16. method according to claim 15, wherein adjusting the distance between each stick (20) and the next one comprises: a) keeping one or more of said sticks stationary in an uncoupling station (40) arranged on said recirculation stretch (t2); b) picking one of the sticks (20) present in the uncoupling station (40) and advancing said picked- up stick towards the beginning (t1a) of said operating stretch (tl) .	"a machine for treating folded printed fabrics" description [technical field ] the object of the present invention is a machine for the treatment of folded printed fabrics. in particular, but not exclusively, the invention is advantageously applied to machines or apparatuses for steaming printed fabrics. [prior art] as is known, the operation of steaming serves to stably fix the dyes to the fibre of a fabric by taking advantage of the action of the condensed moisture, combined with the one of the heat of the environment, to result in the dye and all the recipe products present on the surface of the material being spread from the surface layer into the fibre and set therein. a machine of this type for the treatment of folded fabrics (for example, for preparing, steaming, dyeing, finishing and the like) generally comprises a treatment chamber in which there is supported an endless (continuous) conveyor for transferring the fabric to be treated from an inlet side of said chamber, where a support and fabric feed roller is active, to an outlet side of the treatment chamber. such conveyor comprises a pair of endless chains, which are supported and moved close to the longitudinal walls of the chamber and which advancing and return branches extend close to the top and the bottom, respectively, of the chamber itself. the fabric is supported folded inside the treatment chamber by a plurality of rollers (called sticks in the field and hereinafter in this description) , the ends of which are connected to opposing links of the aforesaid chains. generally, a conveyor of this type is caused to advance in a continuous manner to support - close to the inlet side - the formation of next folds of fabric on next sticks, and for the time required for the formation of the folded fabric in the treatment chamber. international patent application wo 2004/074567 to the same applicant describes a system for moving sticks and forming the related folds wherein each stick is connected to the respective links of the chains by means of a pair of arms, each having a first end constrained to a link of one of the chains, and a second end constrained to a corresponding end of the stick. such system provides using shaped plates on which the arms carrying the sticks slide. during the advancement of the fabric, the arms are overturned, lifting the sticks and carrying them from a condition in which they are hung on the conveyor chains in the ascending stretch, to a resting condition on tracks arranged above the active advancement branches of the chains themselves . the applicant has noted that such a machine, and other similar ones which provide advancement by means of chains of the sticks that support the folded fabric, may be subjected to drawbacks when used for the treatment of printed fabrics with ink-jet printing or more generally, with fabrics that were the object of a previous digital printing process. more specifically, the applicant has verified that the digitally printed fabrics not yet subjected to treatments such as for example, steaming, may transfer the applied colour onto other fabrics, or other portions of the same fabric, also following contacts with very low intensity. the applicant has therefore noted that folds that are too tight may promote accidental contact between adjacent portions of the same fold due to which the dye may be transferred from a surface of the fold to the one facing it (that is, the other inner surface part of the same fold) , thus creating problems of undesired patterns on certain portions of fabric. more generally, the applicant has perceived the need to prepare a machine in which the width of the folds could be determined with a certain level of freedom, without excessive constraints imposed by the mechanical structure of the machine itself . [objects and summary of the invention] it is the object of the present invention to make available a machine that is capable of preventing the formation of undesired patterns on the fabric, also following digital type prints . it is another object to provide a machine that allows modifying the width of the folds in a simple manner, without being subjected to excessive mechanical constraints. these and other objects again are substantially achieved by a machine for the treatment of folded printed fabrics, as described in the appended claims. [brief description of the drawings] further features and advantages shall be more apparent from the detailed description of preferred, but not exclusive, embodiments of the invention. such description is made herein below with reference to the accompanying drawings, also provided for indicative purposes only, and therefore not limiting, in which: - figure 1 shows a diagrammatic side view of a machine according to the invention; - figures la, lb show the same diagrammatic view of figure 1, with certain parts removed in order to better highlight others ; - figure 2 diagrammatically shows an element that is part of the machine of figure 1; - figure 3 diagrammatically shows a cross section of the machine of figure 1, according to line x-x, with certain parts removed in order to better highlight others; - figure 4 diagrammatically shows different operating conditions of a part of the machine of figure 1; - figures 4a-4c diagrammatically show plan views of the operating conditions depicted in figure 4; - figures 4d-4f diagrammatically show front views corresponding to the plan views of figures 4a-4c; - figure 5a shows a detail of the machine of figure 1; - figure 5b shows the detail of figure 5a, in a different operating configuration; - figure 5c shows a detail of figure 5a; - figure 6 shows a block diagram depicting certain parts of the machine of figure 1. [detailed description of the invention] with reference to the accompanying drawings, a machine for the treatment of folded fabrics according to the present invention is indicated as a whole with 1. the machine 1 comprises a box frame 10 that delimits a substantially pallelepiped chamber. the box frame 10 (figures 1, 3) preferably comprise a pair of substantially vertical side or longitudinal walls 11, 12, a top 13 and a bottom 14. preferably, each of the side walls 11, 12 is provided with a guide g. preferably, the guide g (figures 1, 3) is, in a cross section with respect to the planar development of the side walls 11, 12, substantially "c"-shaped, in which the vertical part gl is a part of the respective side wall 11, 12, and the transverse parts g2, g3 extend from the respective side wall 11, 12, preferably in orthogonal direction thereto. the guide g serves the purpose of guiding the sticks 20 (which are described below) during the operation of the machine 1. the guide g preferably substantially is continuous along the closed path p (figure la) that the sticks 20 follow inside the machine 1. preferably, the guide g has at least one removable portion so as to allow the insertion/extraction of the sticks, when required . the frame 10 is provided at the front with an inlet opening 15 of the printed fabric t to be treated, and at the back with an outlet opening 16 of the treated printed fabric t. preferably, both openings 15, 16 are located in the top part of the frame 10. a roller 17 for supporting and feeding fabric is supported in the chamber 1 at the opening 6, while a roller 18 for supporting the fabric is positioned close to the outlet opening 7. both rollers 17, 18 preferably have horizontal axis perpendicular to the walls 11, 12. a treatment process of the printed fabric t is executed inside the chamber delimited by the frame 10. preferably, such process is a steaming process. to this end, the machine 1 is equipped with apparatuses (in themselves known and not illustrated) for generating and distributing steam in the aforesaid chamber. it is worth noting that the invention may also be applied to other types of machines, that is machines configured to perform other processes, in which in any case a fabric is to be arranged folded and caused to advance in a closed treatment chamber. the machine 1 further comprises a plurality of sticks 20, operating in the box frame 10 for supporting a printed fabric t and forming folds of such printed fabric t. the sticks 20 are arranged according to a substantially horizontal direction, that is substantially parallel to the bottom 14 of the frame 10. preferably, the sticks 20 substantially are perpendicular to the side walls 11, 12 of the box frame 10. an example of structure of a stick 20 is now described. preferably, all the sticks in the machine 1 have a same structure . preferably, the stick 20 (figure 2) comprises a tubular body 21 for supporting the folded fabric t. the tubular body 21 is substantially cylindrical-shaped. the tubular body 21 has a first axial end 21a and a second axial end 21b opposite to the first axial end 21a. preferably, the stick 20 comprises a first toothed wheel 22, mounted on the first axial end 21a of the tubular body 21. preferably, the stick 20 comprises a second toothed wheel 23, mounted on the first axial end 21a of the tubular body 21. preferably, the first toothed wheel 22 is mounted in axially proximal position and the second toothed wheel 23 is mounted in axially distal position with respect to the first end 21a of the tubular body 21. preferably, the first toothed wheel 22 is integral with the tubular body 21. preferably, the second toothed wheel 23 is integral with the tubular body 21. preferably, the first toothed wheel 22 is mounted coaxially to the tubular body 21. preferably, the second toothed wheel 23 is mounted coaxially to the tubular body 21. preferably, the first and the second toothed wheel 22, 23 substantially have the same outer diameter. in particular, the first and the second toothed wheel 22, 23 substantially are equal to each other. preferably, the stick 20 comprises a driving wheel 24 mounted on the first axial end 21a of the tubular body 21. in particular, the driving wheel 24 is in axial position opposite to the first toothed wheel 22 with respect to the second toothed wheel 23. in other words, starting from the first axial end 21a of the tubular body 21, there are, in order: the first toothed wheel 22, the second toothed wheel 23 and the driving wheel 24. preferably, the driving wheel 24 has a greater diameter with respect to the first and/or the second toothed wheel 22, 23. in particular, the driving wheel 24 has a greater diameter with respect both to the first toothed wheel 22 and to the second toothed wheel 23. preferably, the driving wheel 24 is mounted coaxially to the tubular body 21. preferably, the driving wheel 24 is coupled to the guide g present on one of the side walls 11, 12 described above. preferably, the driving wheel 24 is not integral with the tubular body 24. preferably, the driving wheel 24 is constrained to the tubular body 21 by means of bearings or other similar members (not illustrated) . thereby, the driving wheel 24 may rotate with respect to the tubular body 21, to the first toothed wheel 22 and to the second toothed wheel 23. preferably, the driving wheel 24 is not a toothed wheel. in particular, the driving wheel 24 may have a substantially smooth circumferential profile. preferably, a first toothed wheel 22' and a second toothed wheel 23', which substantially are identical to the aforesaid first toothed wheel 22 and second toothed wheel 23, are also mounted on the second axial end 21b of the tubular body 21. preferably, the stick 20 comprises a driving wheel 24' mounted on the second axial end 21b and substantially identical to the driving wheel 24 mounted on the first axial end 21a. advantageously, the driving wheels 24, 24' are coupled to the guides g so that the sticks 20 are guided by the guides g themselves . in practical terms, the guides g prevent the sticks 20 from taking on positions that are different from the ones provided (e.g. falling from the chains on which they are resting, and which will be described below, being arranged in non- perpendicular direction with respect to the various chains, etc.), therefore increasing the overall reliability of the machine . the stick 20 having the above-described structure advantageously may also be used in machines for the treatment of fabrics having different structure and/or function with respect to the machine 1 herein described. it is worth noting that the reference numeral 20 in the present description generically indicates the sticks present in the machine 1. reference numerals 20a, 20b...20f indicate sticks that are in specific positions along the path p. the features of the sticks 20a-20f are the ones described above with respect to the stick 20. the machine 1 comprises a handling structure 30 (figure 6) that is active on the sticks 20 to advance them along a substantially closed path p. in the diagrammatic view in figure 1, the advancement of the sticks 20 occurs in clockwise direction. the path p comprises an operating stretch tl in which the sticks 20 support the printed fabric t. the operating stretch tl has a beginning t1a and an end tib. the beginning t1a of the operating stretch tl is at the aforesaid inlet opening 15; the end tib of the operating stretch tl is at the outlet opening 16. the handling structure 30 comprises a first motorized chain 60 in the operating stretch tl, which motorized chain supports the sticks 20a advancing from the beginning t1a to the end tib of the operating stretch tl. in other words, the sticks 20a advancing from the beginning t1a to the end tib of the operating stretch tl are resting on the first motorized chain 60 and execute such movement due to the sliding of the latter. the first motorized chain 60 is moved by a first motor ml that is active on a respective toothed wheel coupled to the first motorized chain 60 itself. preferably, the handling structure 30 comprises a second motorized chain 61 in the operating stretch tl, the motorized chain being arranged superiorly to the first motorized chain 60. the second motorized chain 61 cooperates with the first motorized chain 60 to advance the sticks 20a along the operating stretch tl. the second motorized chain 61 is moved by a second motor m2 that is active on a respective toothed wheel coupled to the second motorized chain 61 itself. the first and the second motorized chain 60, 61 extend according to a substantially horizontal direction between the inlet opening 15 and the outlet opening 16. in one embodiment, the second motorized chain 61 is moved at the same speed as the first motorized chain 60. thereby, there is no substantial mutual movement between the first and the second motorized chain 60, 61 and the sticks 20a translate along the operating stretch tl without rotations about its longitudinal axis. in a different embodiment (or different operating configuration of the machine 1), the second motorized chain 61 is moved at different speeds with respect to the first motorized chain 60. thereby, the sticks 20a execute a rotation about its longitudinal axis in the operating stretch tl. preferably, the first and the second motorized chain 60, 61 are engaged on the first toothed wheel 22 of the sticks 20a. the path p comprises a recirculation stretch t2, wherein the sticks 20 are transported from the end tib of the operating stretch tl to the beginning tia of the operating stretch tl. thereby, the sticks 20 may support the folded printed fabric t along the operating stretch tl during the treatment process of the printed fabric t itself, to then be separated from the fabric at the end tib of the operating stretch tl and be brought back to the beginning tia to support a new fabric portion. preferably, in at least one rectilinear portion of the recirculation stretch t2, the sticks 20 advance at different speeds with respect to the sticks 20a in the operating stretch tl . the sticks 20 are arranged according to an ordered sequence. according to such sequence, each stick is preceded, in the advancement direction of the sticks, by a preceding stick, and is followed by a next stick. preferably, such sequence is not modified during the operation of the machine 1. in other words, given a certain stick, it will always be preceded by the preceding stick and it will always precede the next stick, keeping the order with which such sticks were mounted in the machine. what may vary, as will be clearer below, is the distance between each stick and the adjacent ones, that is between each stick and the preceding one and/or the next one. preferably, the recirculation stretch t2 comprises a retrieval zone zl, in which the sticks 20 from the end tib of the operating stretch tl are retrieved and advanced. the handling structure 30 preferably comprises, at the retrieval zone zl, a first fixed chain or rack 70 and a third motorized chain 80. therefore, since the sticks 20b in the retrieval zone zl are subjected to the action of the third motorized chain 80 and of the first fixed chain or rack 70, they advance rotating about their own longitudinal axis. preferably, the first fixed chain or rack 70 and the third motorized chain 80 extend along a vertical stretch, extending from the end tib of the operating stretch tl, and along a next horizontal stretch, along part of the length of the side walls 11, 12 of the frame 10. preferably, the third motorized chain 80 mechanically is independent of the first motorized chain 60 and of the second motorized chain 61. preferably, the third motorized chain 80 is moved independently with respect to the first and the second motorized chain 61, 62. preferably, the third motorized chain 80 is moved at a different speed, in particular a greater speed, with respect to the first motorized chain 60 and to the second motorized chain 61. the third motorized chain 80 is moved by a third motor m3 that is active on a respective toothed wheel coupled to the third motorized chain 80 itself. preferably, the first fixed chain or rack 70 and the third motorized chain 80 engage the second toothed wheel 23 of the sticks 20. preferably, the recirculation stretch t2 comprises a directing zone z2 in which the sticks 20 coming from the retrieval zone zl are directed towards the beginning of the operating stretch tia and in particular, towards the uncoupling station 40, which is described below. the handling structure 30 preferably comprises, at the directing zone z2, a fourth motorized chain 90 that carries the sticks from the retrieval zone zl towards the beginning tia of the operating stretch tl. preferably, the fourth motorized chain 90 extends according to a substantially horizontal direction, from the end of the third motorized chain 80 up to the uncoupling station 40. the sticks 20c preferably are resting on the fourth motorized chain 90 along the directing zone z2. such sticks 20 therefore are translated without rotation by the fourth motorized chain 90. preferably, the fourth motorized chain 90 engages the first toothed wheel 22 of the sticks 20. preferably, the fourth motorized chain 90 is moved at the same speed as the third motorized chain 80. in particular, the fourth motorized chain 90 may be moved by the same motor that moves the third motorized chain 80. preferably, the recirculation stretch t2 comprises an ascent zone z3, in which the sticks 20 provided by the uncoupling station 40 are guided towards the beginning tia of the operating stretch tl. the handling structure 30 preferably comprises, at the ascent zone z3, a second fixed chain or rack 100. the handling structure 30 preferably comprises, at the ascent zone z3, a fifth motorized chain 110. since they are subjected to the action of the fifth motorized chain 110 and of the second fixed chain or rack 100, the sticks 20d in the ascent zone z3 advance rotating about their own longitudinal axis. preferably, the second fixed chain or rack 100 and the fifth motorized chain 110 extend according to a substantially vertical direction, from the uncoupling station 42 up to the beginning tia of the operating stretch tl. the fifth motorized chain 110 is moved by a fourth motor m4 that is active on a respective toothed wheel coupled to the fifth motorized chain 110 itself. preferably, the second fixed chain or rack 100 and the fifth motorized chain 110 engage the second toothed wheel 23 of the sticks 20d. preferably, the fourth motor m4, which is active on the fifth motorized chain 110, is adjusted at controlled speed so as to provide the accelerations required to form the folds. the machine 1 comprises an uncoupling station 40 positioned in the recirculation stretch t2. the uncoupling station 40 is configured to adjust a distance between each stick 20 and the next stick and/or the preceding stick . preferably, the uncoupling station 40 is positioned between the directing zone z2 and the ascent zone z3 of the recirculation stretch t2. as will be clearer below, the sticks coming from the directing zone z2 are caused to remain stationary at the uncoupling station 40 and then to be picked in a controlled manner to continue along the ascent zone z3. preferably, the sticks enter the uncoupling station 40 according to a determined order and leave from the uncoupling station 40 according to the same order. preferably, the uncoupling station 40 (figures 5a, 5b) comprises a buffer 41 configured to accommodate one or more sticks 20e coming from the end tib of the operating stretch tl and substantially to keep such sticks 20e stationary. the sticks 20 are fed directly to the uncoupling station 40, and in particular to the buffer 41, by an advancement chain, preferably consisting of the aforesaid fourth motorized chain 90. preferably, the buffer 41 comprises a chain portion 41a, kept in motion by a motorized member, and supporting sticks 20e present in the buffer 41. preferably, the chain portion 41a is part of the fourth motorized chain 90. preferably, the buffer 41 comprises a first locking device 41b for stopping the advancement of the sticks 20 present in the buffer 41 itself while the chain portion 41a is kept in motion. the first locking device 41b may be made as a piston or other electromechanical device capable of acting on the stick 20e, for example abutting against the stick 20e itself, and of stopping the advancement of the same stick 20e. the first locking device 41b may for example, act on the tubular body 21 or on the driving wheel 24 of the stick 20e. the first locking device 41b is controllable between a first condition (figure 5a), in which it acts on a stick 20e present in the buffer 41, thus preventing the same from advancing, and a second condition (figure 5b) , in which it does not act on such stick . preferably, the uncoupling station 40 comprises a support element 41c supporting a stick 20f in most advanced position, according to the advancement direction of the sticks 20 along the path p, with respect to the sticks 20e present in the buffer 41. in other words, the uncoupling station 40 preferably accommodates a plurality of sticks which arrive from the uncoupling station 40 itself in ordered sequence, temporally from a first stick to a last stick, according to the sequence with which the sticks themselves are mounted on the machine 1. the support element 41c supports the first of such sticks (stick 20f) , that is the one which, among the sticks currently present in the uncoupling station 40, is the one that arrived first. the buffer 41 accommodates the remaining sticks 20e that arrived in the uncoupling station 40 after the stick 20f . preferably, the first locking device 41b acts on the stick which is in the most advanced position among the ones present in the buffer 41. the remaining sticks 20e are kept stationary by such stick in the most advanced position. preferably, the support element 41c is formed by a portion of the guide g present on the side walls 11, 12. preferably, the stick 20f supported by the support element 41c is not engaged by any chain or rack. preferably, the uncoupling station 40 further comprises a second locking device 41d configured to keep in position the stick 20f supported by the support element 41c. the second locking device 41d may be made as a piston or other electromechanical device capable of acting on the stick 20f, for example abutting against the stick 20f itself, and of stopping the advancement of the same stick 20f . the second locking device 41d may for example, act on the tubular body 21 or on the driving wheel 24 of the stick 20f . the second locking device 41d is controllable between a first condition (figure 5b), in which it acts on the stick 20f, thus preventing the same from advancing, and a second condition (figure 5a) , in which it does not act on such stick. preferably, the second locking device 41d operates in an alternating manner with respect to the first locking device 41b. preferably, when the first locking device 41b is in the first condition (locking the sticks present in the buffer 41), the second locking device 41d is in the second condition, leaving free the stick 20f (when present) . this situation is diagrammatically depicted in figure 5a. preferably, when the first locking device 41b is in the second condition (no interference with the sticks present in the buffer 41), the second locking device 41d is in the first condition, leaving free the stick 20f (when present) . this situation is diagrammatically depicted in figure 5b. the synchronization between the first and the second locking device 41b, 41d may be obtained for example, by means of respective pneumatic actuators managed by the control unit 50, which is described below. preferably, the uncoupling station 40 comprises an activation device 42 configured to act on a stick present in the uncoupling station 40 and to advance such stick towards the beginning tia of the operating stretch tl. preferably, the activation device 42 is controllable between a stand-by condition, in which it does not act on the sticks 20 present in the uncoupling station 40, and an operating condition, in which it acts on at least one stick present in the uncoupling station 40. preferably, in the operating condition, the activation device 42 acts on the stick which, according to the advancement direction of the sticks 20, is in the most advanced position in the uncoupling station 40. preferably, in the operating condition, the activation device 42 acts on the aforesaid stick 20f supported by the support element 41c. preferably, the activation device 42 (figure 5c) comprises a toothed wheel or chain portion 42a which, in the operating condition, couples with a toothed wheel 22, 23 belonging to a stick 20 present in the uncoupling station 40. preferably, the activation device 42 further comprises a lever 42b, interlocked to an electromechanical actuator 42c. the lever 42b supports the aforesaid toothed wheel or chain portion 42a. the lever 42b, under the action of the electromechanical actuator 42c, moves the toothed wheel or chain portion 42a so as to engage one of the toothed wheels 22, 23 of the stick 20f (operating condition) , or so as not to engage any of the toothed wheels of the sticks present in the uncoupling station 40. preferably, the activation device 42 acts on the second toothed wheel 23 of the stick 20f (or more generally, of the stick which, in the uncoupling station 40, is in the most advanced position with respect to the others) . preferably, the toothed wheel or chain portion 42a consists of the end part of the fifth motorized chain 110. such stick is moved, under the action of the activation device 42, so as to advance towards the beginning t1a of the operating stretch tl. preferably, the activation device 42 operates in a synchronized manner with respect to the second locking device 41d: when the activation device 42 is to pick the stick 20f (operating condition) , the locking device is driven into its second condition. preferably, the machine 1 comprises a control unit 50 configured to send a control signal sig to the activation device 42 to drive the latter from the stand-by condition to the operating condition. the control unit 50 may be an electronic unit. in particular, the control unit 50 may be part of the electronic device or control system (e.g. plc) that manages the whole operation of the machine 1. in terms of operation of the machine 1, the following is worth noting. the printed fabric t is inserted into the machine 1 in a known manner, through the inlet opening 15. the sticks 20 coming from the ascent zone z3 encounter such printed fabric t and, arriving at the beginning t1a of the operating stretch tl, form respective folds with the printed fabric t itself. once a fold is formed, the respective stick 20 is advanced by the first motorized chain 60 preferably coupled to the second motorized chain 61. during the advancement of the sticks 20 along the operating stretch tl, the printed fabric t is subjected to the provided treatment (e.g. a steaming treatment) in a known manner, and therefore not further described. the control unit 50 of the machine 1 adjusts the speed of the first and of the second motorized chain 60, 61 along the operating stretch tl to comply with the time the fabric remains in the treatment chamber. in an operating configuration, the motorized chains 60, 61 process at the same speed to allow the sticks to advance without rotating - that is, the sticks 20a are translated along the advancement direction. in a different operating configuration, for example for process reasons, it is possible for the rotation of the sticks 20a in the advancement direction to be required simultaneously to the advancement caused by the first motorized chain 60. here, the second motorized chain 61 has a faster speed than the first motorized chain 60 so as to allow the rotation of the sticks. the speed of the second motorized chain 61 therefore is to be adjusted so as to obtain the rotation required. preferably, the rotation of the sticks 20a along the operating stretch tl is not carried out in time intervals in which there are sticks that are to be transferred from the recirculation stretch t2 to the beginning t1a of the operating stretch tl or from the end of the operating stretch tib to the recirculation stretch t2. preferably, the first and the second motorized chain 60, 61 are moved at the same speed when a stick is to be transferred from the end tib of the operating stretch tl to the recirculation stretch t2 and when a stick is to be transferred from the recirculation stretch t2 to the beginning t1a of the operating stretch tl. once it has arrived the end tib of the operating stretch tl, the stick 20 is separated from the printed fabric t. the treated printed fabric t is caused to exit the machine 1 by means of the outlet opening 16. the stick 20b is moved in the recirculation stretch t2 and in particular, in the retrieval zone zl. the control unit 50 of the machine 1 preferably adjusts the passage of the sticks from the end tib of the operating stretch tl to the recirculation stretch t2. in particular, the control unit 50 adjusts the transfer of the sticks from the motorized chains 60, 61 to the kinematic structure c2 formed by the first fixed chain or rack 70 and the third motorized chain 80. therefore, the following operations are carried out: 1. the control unit 50 detects that a stick is arriving at the end tib of the operating stretch tl by means of a sensor, for example a proximity sensor. 2. the stick leaves the second motorized chain 61 and engages the first fixed chain or rack 70, starting to rotate about its own axis. the passage occurs mechanically, preferably without any particular control action. 3. the third motorized chain 80 is carried by means of the control unit 50 at the same speed as the first motorized chain 60 and in phase with said first motorized chain 60. preferably speed signals provided by absolute encoders mounted on the drive shaft are used for the first motorized chain 60 and on the end of the third motorized chain 80, to carry out the timing. 4. the stick passes from the first motorized chain 60 to the third motorized chain 80. the third motorized chain 80 may then be accelerated to cause the stick to continue along the recirculation stretch t2, and in particular in the retrieval zone z 1. these steps preferably are performed each time a stick approaches the end tib of the operating stretch tl. the stick 20 then continues from the retrieval zone zl to the directing zone z2. the fourth motorized chain 90 of the directing zone z2 preferably is moved by the same motor m3 of the third motorized chain 80 of the retrieval zone zl. preferably, the motorized chains 80, 90 are in phase with each other by mechanical construction. the passage from the third motorized chain 80 to the fourth motorized chain 90 may therefore occur without performing particular controls. as mentioned, the sticks 20c in the directing zone z2 are resting on the fourth motorized chain 90 and translate advancing towards the uncoupling station 40. the end part of the fourth motorized chain 90 defines a part of the buffer 41 of the uncoupling station 40. in particular, the portion 41a of the fourth motorized chain 90 that supports the sticks 20e and which advancement is locked by the first locking device 41b is a part of the buffer 41. the first locking device 41b normally is in the first condition, that is in the condition in which it stops the advancement of the sticks 20e present on the chain portion 41a. preferably, the second locking device 41d normally is in the second condition. the first locking device 41b is active at the end 90a of the fourth motorized chain 90. the second locking device is active at the support element 41c. when a stick 20 arrives close to the end 90a of the fourth motorized chain 90, two scenarios may occur: - there are no sticks on the chain portion 41a; the stick at hand continues until it is stopped by the first locking device 41b; - there already are one or more sticks 20e on the chain portion 41a; the advancement of the stick at hand is therefore stopped, since the stick abuts against the latter of the sticks 20e present on the chain portion 41a. in particular, the driving wheel 24 of the above stick rests on the driving wheel of the last stick 20e already present. since the toothed wheels 22, 23 have a smaller diameter than the driving wheel 24, the toothed wheels of the sticks do not interfere with each other. it is worth noting that when the sticks 20e are kept in the buffer 41, they do not advance, but the tubular body 21 and the toothed wheels 22, 23 rotate, under the action of the fourth motorized chain 90 and in particular of the portion 41a on which the sticks are resting. preferably in this situation, the driving wheel 24 does not rotate due for example, to the bearings by means of which it is constrained to the tubular body 21. to prepare a stick for a new insertion in the operating stretch tl, the control unit 50 provides to drive the first locking device 41b in the second condition so that the first stick present on the chain portion 41a may translate forwards and become supported by the support element 41c. the second locking device 41d is carried in the first condition so as to keep in position the stick that arrived at the support element 41c. the first locking device 41b is then brought back to the first condition, so as to lock the next sticks 20e and prevent the same from arriving at the support element 41c while the stick 20f is occupying it. when there is the need to add a stick to the process, the control unit 50 sends a control signal sig to the activation device 42. the activation device 42 is driven by means of the control signal sig from the stand-by condition to the operating condition. thereby, the stick 20 supported by the support element 41c is engaged and moved along the ascent zone z3. the second locking device 41d was carried to the second condition in advance so as not to hinder the activation device 42. it is worth noting that the activation of the activation device 42 is caused by the distance that is to be imposed between the various sticks and therefore, by the width desired for the folds of the fabric t. also the first locking device 41b and the second locking device 41d preferably are controlled on the basis of this logic in order to ensure the stick 20f is ready when the activation device 42 is to be activated. the fifth motorized chain 110 picks the stick 20f stopped in known position, while the speed of the fifth motorized chain 110 itself is detected through an encoder mounted on the end of the fifth motorized chain 110 itself. when the waiting stick 20f has left the position in which it is supported by the support element 41c, the activation device 42 is brought back to the stand-by condition, waiting for another stick to be directed to the ascent zone z3. after being removed from the uncoupling station 40, the stick 20f (that became a "stick 20d") travels the ascent zone z3 due to the fifth motorized chain 110 and to the second fixed chain or rack 100, and arrives close to the beginning tia of the operating stretch tl. at the end of the ascent zone z3, the stick 20d is inserted at the beginning tia of the operating stretch tl. in particular, the stick leaves the fifth motorized chain 110 and the second fixed chain or rack 100 and is engaged by the first motorized chain 60 (preferably in cooperation with the second motorized chain 61) . preferably, the stick leaves the second fixed chain or rack 100 first to engage the second motorized chain 61 (meanwhile, it continues to be engaged also by the fifth motorized chain 110) . to this end, the fifth motorized chain 110 is carried in advance at the same speed and in phase with respect to the first motorized chain 60. then, the stick leaves the fifth motorized chain 110 to engage the second motorized chain 61. the first motorized chain 60 is already in phase with the second motorized chain 61. figures 4, 4a to 4f diagrammatically show the passages described above: references "a", "b", "c" indicate the next positions that the stick takes on in passing from the ascent stretch z3 to the operating stretch tl. preferably, it is worth noting that each motorized chain belonging to the present invention may be provided with a chain tensioner device, made for example by means of a pneumatic actuator and intended to adjust the tension of the respective chain . preferably, the support rollers 17, 18 are activated by specific motors which are controlled for example by means of inverter. in an operating configuration, the support rollers 17, 18 are activated with a constant, equal speed determined by the time the fabric remains in the chamber and the pace of the sticks . in other operating configurations, it is provided for the rollers to have a non-constant speed. for example, the support roller 17 may be slowed down or even stopped to ensure the correct formation of the fold. here, the average introduction speed of the fabric shall in any case be kept according to the process parameters and equal to the preferably constant speed of the outlet roller. it is worth noting that the above description is intended for one side alone of the machine 1. in other words, the first and the second motorized chain 60, 61, the first fixed chain or rack 70 and the third motorized chain 80, the fourth motorized chain 90, the second fixed chain or rack 100, the fifth motorized chain 110, are mounted at one of the side walls 11, 12 of the frame 10. there is a completely similar structure on the other side wall 12, 11, operating on the opposite end of the sticks 20. the same applies to the chain portion 41a, the first and the second locking device 41b, 41d (in particular, if they operate on the driving wheels 24) and the support element 41c, and also to the activation device 42. according to one embodiment of the invention, a machine for the treatment of folded fabrics comprises (figure lb) : - a first kinematic structure ci, formed by the first motorized chain 60, by the second motorized chain 61; - a second kinematic structure c2, formed by the first fixed chain or rack 70 and the third motorized chain 80; - a third kinematic structure c3, formed by the fourth motorized chain 90; - a fourth kinematic structure c4, formed by the second fixed chain or rack 100 and by the fifth motorized chain 110. preferably, the first kinematic structure ci is moved independently with respect to the second kinematic structure c2. preferably, the first kinematic structure ci is moved independently with respect to the fourth kinematic structure c4. the sticks 20 are moved in sequence by the aforesaid kinematic structures ci, c2, c3, c4. the sequence of first motorized chain 60, third motorized chain 80, fourth motorized chain 90 and fifth motorized chain 110 defines the path p along which the sticks 20 are caused to advance . the uncoupling station 40 is interposed between the third kinematic structure c3 and the fourth kinematic structure c4. the structure of the sticks 20 (schematized in figure 2) is such that each kinematic structure ci to c4 engages the first or the second toothed wheel 22, 23 of each stick, and the kinematic structures adjacent thereto engage the other toothed wheel 23, 22 of said sticks 20. in other words, if one kinematic structure ci to c4 engages the first toothed wheel 22 of the sticks, the preceding kinematic structure and/or the next kinematic structure engage the second toothed wheel 23 of the sticks. similarly, if one kinematic structure ci to c4 engages the second toothed wheel 23 of the sticks, the preceding kinematic structure and/or the next kinematic structure engage the first toothed wheel 22 of the sticks. generally, the presence of the first and of the second toothed wheel 22, 23 at the ends of the sticks 20 is useful for the transfer of the stick from one kinematic structure ci to c4 to the next . preferably, each kinematic structure ci to c4 partly overlaps the preceding kinematic structure and/or next kinematic structure. in other words, the passage from a specific kinematic structure to the next one provides for each stick to be engaged by at least part of the specific kinematic structure and simultaneously with at least part of the next kinematic structure. it is worth noting that the third kinematic structure c3 and the fourth kinematic structure c4 are an exception, because they do not overlap each other, rather they are separated by the uncoupling station 40. if they are mechanically independent, the two partly overlapping kinematic structures preferably are put into phase with each other before the transfer is carried out. see by way of example, the description relating to the transfer of the sticks from the ascent zone z3 to the operating stretch tl. figures 4, 4a to 4f diagrammatically show that described above: stick 20 occupies the positions a, b, c (figure 4) in sequence. when the stick 20 is in position a (figures 4, 4a, 4d) , the second toothed wheel 23 is engaged with the fifth motorized chain 110 and with the second fixed chain or rack 100. the first toothed wheel 22 is not engaged with any chain or rack. the wheel 24 is coupled to the guide g. when the stick 20 is in position b (figures 4, 4b, 4e) , the second toothed wheel 23 is engaged with the fifth motorized chain 110. the first toothed wheel 22 is engaged with the second motorized chain 61. the wheel 24 is coupled to the guide g. when the stick 20 is in position c (figures 4, 4c, 4f) , the second toothed wheel 23 is not engaged with any chain or rack. the first toothed wheel 22 is engaged with the first motorized chain 60 and with the second motorized chain 61. the wheel 24 is coupled to the guide g. generally, there is a plurality of sticks 20 in the machine 1 which are moved along a closed path p. there is a respective, substantially continuous guide g on each side wall 11, 12, which defines the aforesaid path p. the sticks 20 extend from the side wall 11 to the side wall 12 and are kept substantially perpendicular to the side walls 11, 12. the axial ends 21a, 21b of each stick 20 are engaged with the respective guides g, preferably by means of the aforesaid driving wheels 24, 24' . the sticks 20 are caused to advance along the path p by means of a plurality of motorized chains 60, 61, 80, 90, 110, preferably according to a direction that is substantially orthogonal to the longitudinal development of the sticks 20 themselves . the invention achieves important advantages. firstly, the invention allows significantly reducing the risk that the folds of fabric may be soiled by coming into contact with one another due to undesired oscillations of the folds themselves. moreover, the invention allows varying the width of the folds in a simple and dynamic manner, without being subjected to particularly stringent mechanical constraints.
022-753-754-257-713	US	[ "US", "WO" ]	B01L3/00,G01N27/06,G01N27/447,H01M4/04,G01N27/00,G01N27/02,G01N27/07,G01N27/10,G01N35/00	2016-12-08T00:00:00	2016	[ "B01", "G01", "H01" ]	digital microfluidic systems for manipulating droplets	a digital microfluidic system includes a substrate, a plurality of electrode sets provided on the substrate, wherein each of the electrode sets includes two co-planar interdigitated finger electrodes, and a driving circuit including an ac/dc voltage source and a controller. each of the electrode sets is individually addressable by the driving circuit under control of the controller such that an ac/dc voltage generated by the ac/dc voltage source may be selectively provided to one or more of the electrode sets. also, an anti-biofouling electrode for a digital microfluidic system includes an electrode layer, and a slippery liquid infused porous surface structure provided on the electrode layer.	1 . an electrode apparatus for a digital microfluidic system, comprising: a conductive electrode layer; and a slippery liquid infused porous surface structure provided on the conductive electrode layer. 2 . the electrode apparatus according to claim 1 , wherein the slippery liquid infused porous surface structure includes a porous layer made of expanded polytetrafluoroethylene. 3 . the electrode apparatus according to claim 1 , wherein the slippery liquid infused porous surface structure includes a porous layer having a pore size of 200-500 nm. 4 . the electrode apparatus according to claim 1 , wherein the slippery liquid infused porous surface structure includes a lubricant liquid that comprises an oil. 5 . the electrode apparatus according to claim 4 , wherein the oil is a perfluoropolyether (pfpe) based oil. 6 . the electrode apparatus according to claim 1 , wherein the conductive electrode layer comprises an electrode set comprising a first conductive electrode member and a second conductive electrode member, wherein the first conductive electrode member and the second conductive electrode member are spaced from one another along a longitudinal axis of the electrode apparatus. 7 . the electrode apparatus according to claim 6 , further comprising a resin layer provided between the conductive electrode layer and the slippery liquid infused porous surface structure. 8 . the electrode apparatus according to claim 7 , wherein the resin layer is provided directly on top of the conductive electrode layer. 9 . the electrode apparatus according to claim 7 , wherein the resin layer is an epoxy resin layer. 10 . the electrode apparatus according to claim 7 , further comprising a teflon layer provided on a top surface of the resin layer. 11 . the electrode apparatus according to claim 7 , further comprising a substrate, wherein the conductive electrode layer is disposed between the substrate and the slippery liquid infused porous surface structure. 12 . the electrode apparatus according to claim 6 , wherein the first conductive electrode member and the second conductive electrode member are each a thin film electrode disposed directly on the substrate. 13 . the electrode apparatus according to claim 8 , wherein the first conductive electrode member and the second conductive electrode member are each made of cr or ag. 14 . the electrode apparatus according to claim 6 , wherein the slippery liquid infused porous surface structure covers the first conductive electrode member and the second conductive electrode member in a continuous manner to form a continuous layer. 15 . the electrode apparatus according to claim 1 , wherein the slippery liquid infused porous surface structure includes an expanded polytetrafluoroethylene (eptfe) thin film having a thickness of 8 μm and a pore size of 200-500 nm, and a lubricant liquid of the slippery liquid infused porous surface structure is an oil. 16 . the electrode apparatus according to claim 1 , wherein the electrode apparatus is an open configuration wherein a top plate is not provided above or over the conductive electrode layer. 17 . the electrode apparatus according to claim 1 , wherein the electrode apparatus is a closed configuration wherein a top plate is provided above or over the conductive electrode layer. 18 . a digital microfluidic system, comprising: a substrate; and an array of electrodes provided on the substrate, wherein each of the electrodes comprises an electrode apparatus according to claim 1 . 19 . the digital microfluidic system according to claim 18 , wherein each electrode is part of an interdigitated finger electrode structure. 20 . the digital microfluidic system according to claim 18 , wherein in each electrode in the array, the slippery liquid infused porous surface structure includes an expanded polytetrafluoroethylene (eptfe) thin film, and wherein a lubricant liquid of the slippery liquid infused porous surface structure is an oil.	cross-reference to related applications this divisional application claims priority under 35 u.s.c. § 119(e) to u.s. national stage application ser. no. 16/464,766, filed on may 29, 2019, entitled “digital microfluidic systems for manipulating droplets”, which is a 371 u.s. national stage application of international application no. pct/us2017/064804, filed on dec. 6, 2017, entitled “digital microfluidic system for manipulating droplets”, which claims priority to u.s. provisional patent application no. 62/431,497, filed on dec. 8, 2016, entitled “digital microfluidic system for manipulating droplets by dielectrowetting”, the contents of which are incorporated herein by reference. background of the invention 1. field of the invention the present invention relates to digital microfluidics, and, in particular, in one aspect to a circuit and method for manipulating conductive and non-conductive fluid droplets by di electrowetting, and in another aspect to an anti-biofouling electrode for use in digital microfluidic systems. 2. description of the related art a lab-on-a-chip (loc), also often referred to as a micro total analysis system (μtas), is a device that integrates a number of laboratory functions on a single, relatively small (only millimeters to a few square centimeters) chip. locs allow for the handling of extremely small fluid volumes (e.g., down to less than pico-liters). fluid control is a fundamental aspect of locs. fluid control in the context of locs is often referred to as microfluidics. currently, there are two main branches of microfluidics that are employed in locs. the first branch, known as continuous-flow microfluidics (and also continuous fluid regulation), is based on the manipulation of continuous liquid flow through closed microfabricated channels known as microchannels. actuation of fluid flow is implemented either by external pressure sources, external mechanical pumps, integrated mechanical micropumps, or by combinations of capillary forces and electrokinetic mechanisms. continuous-flow microfluidics using closed microchannels is widely exploited in microfluidics for, among other things, emulsion generating, gas exchange, plasma separation and fluid mixing. traditionally, conventional soft lithography techniques using polydimethylsiloxane (pdms) have been used to form the closed microchannels. recently, new, alternative methods have been developed to fabricate such microchannels. there are, however, several disadvantages to using such closed microchannel structures. for example, the functionality is unchangeable after design and fabrication, limiting the further applications of the system. also, post operations, like cleaning, are often difficult for small features in a closed environment. in addition, mechanical components, such as pumps, tubes (including connectors) and valves, are required for most cases, increasing the complexity of such systems. the second technique is known as digital microfluidics. in digital microfluidics, digital circuitry is used to manipulate discrete fluid droplets on a substrate, most commonly using electrowetting. for industry, it is highly desirable for microfluidic devices to be able to be controlled automatically using a personal computer or other platform. digital microfluidic devices, which enable individual droplet manipulations, provide an ideal platform for such automatic control. one known digital microfluidic circuit is based on a technology known as electrowetting-on-dielectric (ewod). in an ewod digital microfluidic circuit, aqueous droplets are generally sandwiched and operated between two plates. one plate has an array of electrodes (typically, square or rectangular solid shape) and the other plate has a solid ground electrode covering the entire area of the plate. a thin dielectric and hydrophobic layer covers the array of electrodes and a hydrophobic layer covers the ground electrode. when an electric potential is applied to the electrodes, free charges screen the solid-liquid interface, and an electrohydro-force near the tree-phase contact line in the droplet is generated, which changes the contact angle and actuates the droplet. water droplet creating, cutting, transporting and merging may be achieved using an ewod device. ewod, however, generally and reliably works with conductive fluids. parallel-plate-channel digital microfluidic designs have also been developed to control dielectric droplets that are positioned between two parallel plates. such designs rely on forces exerted on the droplet originating from a phenomenon known as liquid dielectrophoresis (l-dep). in particular, due to the existence of the dielectric liquid between the parallel plates, a non-uniform electric field is induced when power is applied to the plates. as a result, a dipole in the droplet is subjected to an unbalanced force towards the direction where the field intensity gradient is stronger, which in turn attracts the droplet and causes it to move. the l-dep force is a body force, differing from that in ewod. in addition to the parallel-plate channel designs just described, additional efforts have been made to investigate the nature of l-dep, as well as the distinction between it and electrowetting. one application utilizes the l-dep effect on dielectric droplets on a single plate that includes interdigitated electrodes. the interdigitated electrodes generate a non-uniform electric field that penetrates into the liquid, making it possible to change the contact angle of the liquid. this technique has been called dielectrowetting. however, this actuation has only been applied to spread a single sessile droplet. furthermore, so called biofouling is a problem commonly encountered by many current digital (droplet-based) microfluidic systems. bifouling occurs when biomolecules (e.g., proteins) are adsorbed to the normally hydrophobic film surfaces that are used to transport the droplets in digital microfluidic systems. this biomolecule adsorption is undesirable as it changes the properties of the surface to a hydrophilic state, thereby paralyzing reversible droplet operations. also, cross-contaminations between different proteins can occur under such conditions. summary of the invention in one embodiment, a digital microfluidic system is provided that includes a substrate, a plurality of electrode sets provided on the substrate, wherein each of the electrode sets includes two co-planar interdigitated finger electrodes, and a driving circuit including a voltage source and a controller. each of the electrode sets is individually addressable by the driving circuit under control of the controller such that a voltage generated by the voltage source may be selectively provided to one or more of the electrode sets. in another embodiment, a method of driving a number of fluid droplets in a digital microfluidic system that includes a plurality of electrode sets provided on a substrate is provided, wherein each of the electrode sets includes two co-planar interdigitated finger electrodes. the method includes individually addressing one or more of the electrode sets, and selectively providing a voltage to the individually addressed one or more of the electrode sets. in still another embodiment, an anti-biofouling electrode for a digital microfluidic system is provided that includes an electrode layer, and a slippery liquid infused porous surface structure provided on the electrode layer. brief description of the drawings fig. 1 is a schematic diagram of a digital microfluidic system according to an exemplary embodiment of the disclosed concept; fig. 2 is a schematic diagram of dielectrowetting chip according to an exemplary embodiment of the disclosed concept; fig. 3 is a schematic diagram that illustrates a creating operation in the digital microfluidic system of fig. 1 according to the exemplary embodiment; fig. 4 is a schematic diagram that illustrates the splitting and transporting operations in the digital microfluidic system of fig. 1 according to the exemplary embodiment; fig. 5 is a schematic diagram that illustrates the splitting and merging operations in the digital microfluidic system of fig. 1 according to the exemplary embodiment; fig. 6 is a schematic diagram of an anti-biofouling coplanar electrode array according to a further aspect of the disclosed concept; fig. 7 is a cross-sectional view of an anti-biofouling electrode taken along lines a-a in fig. 6 according to one particular, non-limiting exemplary embodiment; fig. 8 is a cross-sectional view of an anti-biofouling electrode according to an alternative exemplary embodiment (implemented in a closed environment); and fig. 9 is schematic view of an anti-biofouling electrode according to a further alternative exemplary embodiment. detailed description of the invention as used herein, the singular form of “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise. as used herein, the statement that two or more parts or components are “coupled” shall mean that the parts are joined or operate together either directly or indirectly, i.e., through one or more intermediate parts or components, so long as a link occurs. as used herein, “directly coupled” means that two elements are directly in contact with each other. as used herein, the term “number” shall mean one or an integer greater than one (i.e., a plurality). as used herein, the term “controller” shall mean a programmable analog and/or digital device (including an associated memory part or portion) that can store, retrieve, execute and process data (e.g., software routines and/or information used by such routines), including, without limitation, a field programmable gate array (fpga), a complex programmable logic device (cpld), a programmable system on a chip (psoc), an application specific integrated circuit (asic), a microprocessor, a microcontroller, a programmable logic controller, or any other suitable processing device or apparatus. the memory portion can be any one or more of a variety of types of internal and/or external storage media such as, without limitation, ram, rom, eprom(s), eeprom(s), flash, and the like that provide a storage register, i.e., a non-transitory machine readable medium, for data and program code storage such as in the fashion of an internal storage area of a computer, and can be volatile memory or nonvolatile memory. as used herein, the term “slippery liquid infused porous surface structure” shall mean a thin film structure having (i) a porous layer made of a material that includes a plurality of nanopores therein (which porous layer may be periodically ordered or random), and (ii) a lubricant liquid that is infused into the nanopores of the porous layer and/or held on the surface of the porous layer by capillarity. non-limiting exemplary slippery liquid infused porous surface structures are described in u.s. pat. nos. 9,121,306, 9,121,307, and 9,353,646, each entitled “slippery surfaces with high pressure stability, optical transparency, and self-healing characteristics”, the disclosures of which are incorporated herein by reference. as used herein, the term “nanopore” shall mean a void having a maximum size parameter (e.g., characteristic diameter) that is less than 1000 nm. as used herein, the term “lubricant liquid” shall mean a friction reducing liquid that is immiscible to aqueous and hydrocarbon liquids. for example, and without limitation, in one embodiment, the lubricant liquid as described herein may be a perfluorinated liquid. in another embodiment, the lubricant liquid as described herein may also be a non-volatile, chemically inert liquid, and may have a surface tension of 25 mn m −1 or less, 20 mn m −1 or less, or 18 mn m −1 or less. as used herein, the term “provided on” shall mean that a layer is provided directly on top of another layer or indirectly on top of another layer with one or more intervening layers in between. directional phrases used herein, such as, for example and without limitation, top, bottom, left, right, upper, lower, front, back, and derivatives thereof, relate to the orientation of the elements shown in the drawings and are not limiting upon the claims unless expressly recited therein. the disclosed concept will now be described, for purposes of explanation, in connection with numerous specific details in order to provide a thorough understanding of the subject invention. it will be evident, however, that the present invention can be practiced without these specific details without departing from the spirit and scope of this innovation. four droplet operations, specifically creating, transporting, splitting and merging, are fundamental to digital microfluidics. these droplet operations correspond to the dispensing, pumping, volume controlling and mixing operations in counterpart continuous-flow microfluidics devices. while these droplet operations have been well demonstrated in digital microfluidics devices, all such devices were based on electrowetting (or electrowetting on dielectric, ewod), which is generally effective with conductive fluids that are commonly squeezed between two plates. furthermore, it has been shown that dielectrowetting, which, as noted elsewhere herein, results from l-dep, produces superspreading (significant change in contact angle) of fluid droplets and works for both conductive and non-conductive fluids. this dielectrowetting principle has not, however, been developed for the above fundamental droplet operations. as described in detail herein, the disclosed concept applies dielectrowetting to the four fundamental microfluidic droplet operations of creating, transporting, splitting and merging, to provide a system wherein both conductive and nonconductive fluid droplets on a single plate as well as between two plates can be automatically controlled. fig. 1 is a schematic diagram of a digital microfluidic system 2 according to an exemplary embodiment of the disclosed concept. as seen in fig. 1 , digital microfluidic system 2 includes a dielectrowetting chip 4 and a driving circuit 6 coupled to dielectrowetting chip 4 . fig. 2 is a schematic diagram of dielectrowetting chip 4 according to the illustrated embodiment. dielectrowetting chip 4 includes a substrate 8 , which in the exemplary embodiment is a glass wafer. an array 10 of a plurality of electrode sets 12 is provided on the top surface of substrate 8 . in the illustrated exemplary embodiment, seven electrode sets 12 are provided, and are labeled 12 - 1 through 12 - 7 in fig. 2 for identification. each electrode set 12 includes two co-planar interdigitated finger electrodes 14 a and 14 b (made of a conductive material such as a metal like cr, ag, or a combination thereof). as seen in fig. 2 , each finger electrode 14 a and 14 b includes a plurality of finger members 16 a, 16 b, respectively. in each electrode set 12 , finger members 16 a and 16 b are interdigitated with one another. in addition, in each electrode set 12 , finger members 16 a are coupled to a common feedline 18 a having a contact member 20 a, and finger members 16 b are coupled to a common feedline 18 b having a contact member 20 b. exemplary fluid droplets 22 are shown resting on electrode sets 12 - 1 , 12 - 4 , and 12 - 7 . thus, as described, exemplary dielectrowetting chip 4 is an open environment on a single plate. in the illustrated embodiment, electrode sets 12 are of two different sizes. in particular, electrode set 12 - 1 is a “reservoir” for “dispensing” electrode set, and is larger than the remaining electrode sets 12 - 2 through 12 - 7 , which are used for operating on individual fluid droplets created from the dispensing electrode set 12 - 1 . in the example shown, electrode set 12 - 1 is 5.5 mm×5.5 mm (30.25 mm 2 ) and electrode sets 12 - 2 through 12 - 7 are each 2 mm×2 mm (4 mm 2 ). also, both the width and spacing of electrode fingers is 50 μm. in addition, as seen in figs. 1 and 2 , an interlocking pattern 21 of electrode members 23 is optionally provided between each adjacent pair of electrode sets 12 . this interlocking pattern 21 facilitates smooth droplet movement from one electrode set 12 to another electrode set 12 . referring again to fig. 1 , driving circuit 6 includes a controller 24 , which in the exemplary embodiment is a programming board or computer. controller 24 is structured and configured with a number of suitable software or firmware routines for controlling operation of digital microfluidic system 2 as described herein. driving circuit 6 also includes a function generator 26 structured to generate a two terminal or two polarity ac/dc voltage that is provided to a voltage amplifier 28 for amplifying the ac/dc voltage. driving circuit 6 also includes a relay 30 comprising a plurality of switches that is coupled to voltage amplifier 28 and controller 24 . relay 30 thus receives the amplified ac/dc voltage from voltage amplifier 28 and a number of control signals from controller 24 . finally, driving circuit 6 includes a first signal bus 32 a and a second signal bus 32 b, each of which is coupled to relay 30 . first signal bus 32 a is coupled to receive a first polarity of the amplified ac/dc voltage and second signal bus 32 b is coupled to receive a second polarity of the amplified ac/dc voltage. furthermore, as seen in fig. 1 , first signal bus 32 a includes a plurality of signal lines that are individually connected to the contact members 20 a of each of finger electrodes 14 a. similarly, second signal bus 32 b includes a plurality of signal lines that are individually connected to the contact members 20 b of each of finger electrodes 14 b. in operation, controller 24 is able to selectively control the switches of relay 30 by way of one or more control signals in order to select which one or ones of electrode sets 12 is/are to receive the amplified ac/dc voltage from relay 30 at any particular time. as such, in the configuration shown in fig. 1 , the electrode sets 12 are individually addressable by controller 24 . as noted above, digital microfluidic system 2 is structured and configured to be able to perform each of the four basic droplet operations that are fundamental to digital microfluidics, namely creating, transporting, splitting and merging. in particular, controller 24 is provided with a number of software and/or firmware routines that enable digital microfluidic system 2 to perform each of the 4 basic droplet operations as described herein. an exemplary implementation of each of those operations is described below. fig. 3 illustrates the creating operation according to the exemplary embodiment. as seen in fig. 3 ( 1 ), prior to the creation of a large droplet 22 is placed in reservoir electrode set 12 - 1 . in addition, electrode sets 12 - 1 , 12 - 2 and 12 - 3 are each in an off condition, meaning that no voltage is being provided thereto. in the next step of the creating operation, as seen in fig. 3 ( 2 ), electrode sets 12 - 1 , 12 - 2 and 12 - 3 are each moved to an on condition by way of controller 24 controlling relay 30 such that an ac/dc voltage is provided thereto. this will cause spreading of droplet 22 due to dielectrowetting such that droplet 22 extends across each of electrode set 12 - 1 , 12 - 2 and 12 - 3 as seen in fig. 3 ( 2 ) (see dotted lines). next, as seen in fig. 3 ( 3 ), controller 24 causes electrode set 12 - 2 to move to an off condition, which results in a portion of droplet 22 being separated from the larger portion of the droplet in reservoir electrode set 12 - 1 . then, as seen in fig. 3 ( 4 ), controller 24 causes electrode sets 12 - 1 , 12 - 2 and 12 - 3 to each be moved to an off condition, with the result being that a separate, smaller droplet 22 will be present on electrode set 12 - 3 , with a larger, although somewhat reduced in volume, droplet 22 remaining in reservoir electrode set 12 - 1 for future creating operations. fig. 4 illustrates the splitting and transporting operations according to the exemplary embodiment using a droplet 22 initially present on electrode set 12 - 4 as seen in fig. 4(a) . in addition, in this initial state, electrode sets 12 - 2 through 12 - 6 are all in an off condition. first, as shown in fig. 4(b) , the splitting operation begins when electrode sets 12 - 3 , 12 - 4 , and 12 - 5 are moved to an on condition, which causes droplet 22 to spread over those electrode sets. then, as shown in fig. 4(c) , electrode set 12 - 4 is moved to an off condition, which causes the droplet 22 to split into two smaller droplets (each being in a spread condition). as seen in fig. 4(d) , electrode sets 12 - 3 and 12 - 5 are then moved to an off condition, which terminates the spreading of both of the smaller droplets 22 . at this point, the original droplet 22 has now been split into two, smaller droplets 22 . figs. 4(e)-(g) show the two droplets 22 being transported to the left and right, respectively. in particular, as shown in fig. 4(e) , electrode sets 12 - 2 , 12 - 3 , 12 - 5 , and 12 - 6 are moved to an on condition, which causes spreading of the two droplets 22 over those electrode sets, respectively. then, as shown in fig. 4(f) , electrode sets 12 - 3 and 12 - 5 are moved back to an off condition, which results in droplets 22 being present only on electrode sets 12 - 2 and 12 - 6 in a spread condition. then, as shown in fig. 4(g) , electrode sets 12 - 2 and 12 - 6 are moved to an off condition, which terminates the spreading of those droplets 22 , which have each been transported one electrode set in opposite directions. fig. 5 illustrates the splitting and merging operations according to the exemplary embodiment using a droplet 22 initially present on electrode set 12 - 4 as seen in fig. 5(a) . in addition, in this initial state, electrode sets 12 - 2 through 12 - 6 are all in an off condition. first, as shown in fig. 5(b) , the splitting operation begins when electrode sets 12 - 2 through 12 - 6 are all moved to an on condition, which causes droplet 22 to spread over all of those electrode sets. then, as shown in fig. 5(c) , electrode sets 12 - 3 and 12 - 5 are each moved to an off condition, which causes the droplet 22 to split in multiple (e.g., three) smaller droplets (each being in a spread condition). as seen in fig. 5(d) , electrode sets 12 - 2 through 12 - 6 are then all moved to an off condition, which terminates the spreading of the three individual droplets 22 . at this point, the original droplet 22 has now been split into three, smaller droplets 22 . figs. 5(e)-(f) show the three droplets 22 being merged back into one larger droplet 22 . first, as shown in fig. 5(e) , all of electrode sets 12 - 2 through 12 - 6 are moved to an on condition, which causes the three individual droplets 22 to be spread across all of electrode sets 12 - 2 through 12 - 6 , thereby joining together. then, as shown in fig. 5(f) , electrode sets 12 - 2 , 12 - 3 , 12 - 5 , and 12 - 6 are moved to an off condition, which causes droplet 22 to collapse into a single droplet present on only electrode set 12 - 4 . the original three droplets 22 have thus been merged into a single, larger droplet 22 . as described elsewhere herein, the exemplary dielectrowetting chip 4 configuration is an open environment on a single plate. it will be understood, however, that this is meant to be exemplary only, and that the disclosed concept as described herein may also be used to make a closed environment configuration including a top plate (not shown) positioned opposite the configuration shown in figs. 1-5 (i.e., a two-plate configuration). moreover, as noted elsewhere herein, biofouling is a problem commonly encountered by many current digital (droplet-based) microfluidic systems. thus, according to a further aspect of the disclosed concept, an anti-biofouling mechanism for droplet manipulation in digital microfluidic systems is provided. specifically, and as described in detail below, the disclosed concept includes a simple and versatile anti-biofouling droplet manipulation mechanism that may be provided on a single substrate using a slippery liquid infused porous surface structure integrated with a coplanar electrode array. this platform has been confirmed effective for both electrowetting-on-dielectric (ewod) driving of conductive liquids (e.g., water and bsa protein solutions) and dielectrophoretic (dep) driving of dielectric liquids (e.g., propylene carbonate and isopropyl alcohol or ipa) in an open environment. the slippery liquid infused porous surface structure described herein has been found to significantly reduce the biological adhesion because of the highly deformable nature of liquid. biomolecules (e.g., proteins) can move easily on the slippery liquid infused porous surface structure. as a result, this property can help to overcome the burdensome biofouling problem that exists in digital microfluidics. fig. 6 is a schematic diagram of an anti-biofouling coplanar electrode array 40 to drive droplets via ewod or l-dep according to this aspect of the disclosed concept that may be provided on a substrate 8 as described herein. coplanar electrode array 40 may be used in place of the array of electrode sets 12 described elsewhere herein (e.g., figs. 1 and 2 ) to form an alternative, anti-biofouling digital microfluidic system 2 according to an alternative embodiment of the disclosed concept. as seen in fig. 6 , coplanar electrode array 40 includes a plurality of adjacently arranged anti-biofouling electrode sets 41 , each comprising adjacent anti-biofouling electrodes 42 , labelled 42 a, 42 b (with the conductive electrode layers 44 thereof as described below being spaced from one another along the longitudinal (i.e., horizontal) axis of fig. 6 ). as described in detail below, each anti-biofouling electrode 42 a, 42 b includes a slippery liquid infused porous surface structure as a part thereof. fig. 7 is a cross-sectional view of an anti-biofouling electrode set 41 taken along lines a-a in fig. 6 according to one particular, non-limiting exemplary embodiment. as seen in fig. 7 , each anti-biofouling electrode 42 a, 42 b of anti-biofouling electrode set 41 is formed on substrate 8 and comprises a multi-layer structure as described below. specifically, each anti-biofouling electrode 42 a, 42 b includes a thin film conductive electrode layer 44 (with conductive electrode layers 44 in a given electrode set 41 being spaced from another as shown in figs. 6 and 7 ) that is provided directly on the surface of substrate 8 by a process such as, without limitation, e-beam evaporation and lift off patterning. conductive electrode layer 44 may be made of, for example and without limitation, a metal such as cr or ag. in one particular exemplary embodiment, conductive electrode layer 44 is a 10 nm thick layer of cr. in another particular exemplary embodiment, conductive electrode layer 44 is a 100 nm thick layer of ag. next, an epoxy resin layer 46 (e.g., a 2 μm thick spin coated su- 8 material) is provided directly on top of conductive electrode layer 44 . epoxy resin layer 46 may also further include a thin layer of dip coated teflon on the top side thereof. finally, a slippery liquid infused porous surface structure 48 is provided directly on top of epoxy resin layer 46 . in the exemplary embodiment shown in fig. 7 , the epoxy resin layers 46 and the slippery liquid infused porous surface structures 48 in a given electrode set 41 are provided without any spacing therebetween (i.e., without the spacing that is provided between the conductive electrode layer 44 in the given electrode set). in other words, in a given electrode set 41 , the epoxy resin layers 46 and the slippery liquid infused porous surface structures 48 are joined with one another so as to form a continuous layer across the given electrode set above the spaced conductive electrode layers 44 . in addition, in the exemplary embodiment, the porous layer of slippery liquid infused porous surface structure 48 is a porous expanded polytetrafluoroethylene (eptfe) thin film having a thickness of 8 μm and a pore size of 200-500 nm, and the lubricant liquid of slippery liquid infused porous surface structure 48 is an oil (e.g., a perfluoropolyether (pfpe) based oil such as krytox® 103 oil). during manufacturing, isopropyl alcohol may first be applied to the porous layer before application and subsequent infusion by capillarity of the lubricant liquid to make the film attachment more uniform. in the configuration just described, during use in a digital microfluidic system, slippery liquid infused porous surface structure 48 will separate biomolecules (e.g., proteins) from solid surfaces and eventually prevent biofouling due to the high mobility of liquid droplets 22 . anti-biofouling electrode 42 thus provides a significant improvement for digital microfluidics systems, and, as noted herein, may be used to drive both conductive liquids and dielectric liquids in such digital microfluidics systems. in the exemplary embodiments just described in connection with figs. 6 and 7 , each electrode set 41 together has a hexagonal shape. it will be appreciated, however, that this is meant to be exemplary only, and that other shapes, such as, without limitation, circular, rectangular, square, or triangular shapes, may also be used within the scope of the disclosed concept. in addition, the exemplary configuration shown in figs. 6 and 7 is an open configuration wherein a top plate is not provided above or over coplanar electrode array 40 . again, it will be understood that this is meant to be exemplary only, and that coplanar electrode array 40 and anti-biofouling electrodes 42 as described herein may also be used in a closed environment wherein a top plate is provided above or over coplanar electrode array 40 to make a closed configuration. this is shown in, for example, fig. 8 , wherein a top plate member 50 that includes a slippery liquid infused porous surface structure 52 as at least a part thereof is provided above or over coplanar electrode array 40 to make a closed configuration. in such a configuration, top plate member 50 may or may not directly contact liquid droplets 22 (in the illustrated example, the top plate member does directly contact liquid droplets 22 ). in such a configuration, the entirety of the closed configuration will have anti-biofouling properties. moreover, in connection with a further alternative exemplary embodiment, the anti-biofouling aspects of the disclosed concept may be used in connection with the co-planar interdigitated finger electrodes 14 a and 14 b shown in figs. 1-5 such that those finger electrodes 14 a and 14 b provided with anti-biofouling properties by providing a slippery liquid infused porous surface structure on each finger electrode 14 a and 14 b. this is shown schematically in fig. 9 , wherein an exemplary alternative electrode set 12 ′ is shown with a slippery liquid infused porous surface structure 54 provided on each interdigitated finger electrode 14 a and 14 b. in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. the word “comprising” or “including” does not exclude the presence of elements or steps other than those listed in a claim. in a device claim enumerating several means, several of these means may be embodied by one and the same item of hardware. the word “a” or “an” preceding an element does not exclude the presence of a plurality of such elements. in any device claim enumerating several means, several of these means may be embodied by one and the same item of hardware. the mere fact that certain elements are recited in mutually different dependent claims does not indicate that these elements cannot be used in combination. although the invention has been described in detail for the purpose of illustration based on what is currently considered to be the most practical and preferred embodiments, it is to be understood that such detail is solely for that purpose and that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover modifications and equivalent arrangements that are within the spirit and scope of the appended claims. for example, it is to be understood that the present invention contemplates that, to the extent possible, one or more features of any embodiment can be combined with one or more features of any other embodiment.
023-968-640-574-483	DE	[ "JP", "US", "CN", "EP", "DE" ]	A43B13/40,A43B13/12,A43B13/38,A43B13/14,A43B13/18,A43B7/14,A43B13/04,A43B5/00,A43B5/06,A43B7/08,A43B23/02,A43B1/00,A43B3/00,A43B9/20,A43B13/02,B33Y80/00	2015-06-29T00:00:00	2015	[ "A43", "B33" ]	sole for sport shoes	problem to be solved: to provide a sole for sport shoes, especially a midsole.solution: there is provided a sole which is produced in additive production according to an embodiment. the sole comprises a lattice structure (110; 210; 310) comprising plural cell elements (191; 291; 391; 392). the sole further comprises a heel element (120; 220; 320) for surrounding a heel in a three-dimensional state. the sole further comprises a base part (130; 230; 330) for mutually coupling the heel element and the lattice element, the base part having an extension part arranged so as to connect to plural adjacent cell elements which are not positioned along an edge part of the lattice structure.selected drawing: figure 1a	1 . an additively manufactured sole, in particular a midsole, for a sports shoe, comprising: a lattice structure, the lattice structure includes a plurality of cell elements; a heel element that three-dimensionally encompasses the heel; a base portion interconnecting the heel element and the lattice structure, wherein the base portion has an extension that connects to a plurality of adjacent cell elements, and wherein the plurality of adjacent cell elements are not positioned along an edge of the lattice structure. 2 . the sole according to claim 1 , wherein a physical property decreases from a rim of the sole towards a center of the sole, the physical property selected from the group consisting of density, stiffness, and air permeability. 3 . the sole according to claim 1 , wherein a geometry of the plurality of cell elements is approximately constant along a thickness of the sole. 4 . the sole according to claim 1 , wherein at least two of the lattice structure, the heel element and the base portion are manufactured from the same class of material, in particular from at least one of polyether block amide and thermoplastic polyurethane. 5 . an additively manufactured sole, in particular a midsole, for a sports shoe, comprising: a lattice structure, the lattice structure includes a plurality of cell sites, wherein a majority of the cell sites include interconnected cell elements, and wherein a subset of the cell sites include cell elements with fewer connections to at least one adjacent cell site than the majority of the cell sites or with a cell vacancy. 6 . the sole according to claim 5 , wherein at least one of the cell sites of the subset is arranged at a surface of the lattice structure, in particular at an edge of the lattice structure. 7 . the sole according to claim 5 , wherein at least one of the cell sites of the subset is arranged in a heel region of the sole. 8 . the sole according to claim 5 , wherein at least one but not more than 30 cell sites that are not part of the subset are arranged in between two closest cell sites of the subset. 9 . the sole according to claim 1 , wherein the sole further comprises an additively manufactured side or torsional stability elements. 10 . the sole according to claim 1 , wherein the sole is at least partly fabricated by means of laser sintering. 11 . the sole according to claim 1 , wherein the sole comprises a polymer material, in particular a polymer material reclaimed from an ocean. 12 . a sole, in particular a midsole, for a sports shoe, comprising: an additively manufactured lattice structure; a functional element that is manufactured separately from the lattice structure, wherein the lattice structure and the functional element include at least one receptacle, and wherein the functional element and the lattice structure are mechanically attached to each other via the at least one receptacle. 13 . the sole according to claim 12 , wherein the receptacle comprises a snap-fit or a snap-fasten element. 14 . the sole according to claim 12 , wherein the lattice structure comprises a polymer material, in particular a polymer material reclaimed from an ocean. 15 . the sole according to claim 1 , wherein the lattice structure comprises a plurality of lattice layers. 16 . the sole according to claim 1 , wherein the lattice structure comprises at least two regions that have different physical properties, in particular different densities, different stiffness, or different air permeability. 17 . the sole according to claim 1 , wherein the lattice structure is adapted to extend essentially across the entire foot. 18 . the sole according to claim 1 , wherein the lattice structure comprises at least one cell element shaped as a dodecahedron, in particular a rhombic dodecahedron. 19 . the sole according to claim 1 , wherein the lattice structure comprises at least one fluid channel extending from a top surface of the lattice structure to a bottom or side surface of the lattice structure. 20 . the sole according to claim 1 , wherein the lattice structure comprises at least two cell elements with different geometry. 21 . the sole according to claim 1 , wherein the sole further comprises a solid rim element additively manufactured with the lattice structure, the solid rim element circulating along a rim of the lattice structure. 22 . the sole according claim 1 , wherein the lattice structure comprises a first region with a first plurality of cell elements having a first geometry and a second region with a second plurality of cells having a second geometry. 23 . the sole according claim 1 , wherein the lattice structure comprises at least one moveable element. 24 . a shoe with an upper and a sole according to claim 1 . 25 . the shoe according to claim 24 , wherein the sole and the upper are directly connected to each other without an intermediate strobel last. 26 . the shoe according to claim 24 , wherein the upper is connected to a solid rim element. 27 . the shoe according to claim 24 , wherein the upper comprises a yarn that includes a polymer material, in particular a polymer material reclaimed from an ocean. 28 . the shoe according to claim 24 , wherein the upper and the sole comprise the same class of material, in particular thermoplastic polyurethane or polyether block amide.	cross-reference to related applications this application claims priority to german application 10 2015 212 099.6, filed jun. 29, 2015, which is incorporated herein in its entirety by reference thereto. background of the invention field of the invention the present invention relates to soles, in particular midsoles, for sports shoes and other types of shoes. background art soles of shoes typically fulfill a variety of different functionalities. for example, soles can provide the foot with traction, and protect the foot from sharp objects, etc. an important functionality of soles is also to cushion the foot while at the same time a sufficient level of stability is provided. various sole designs and materials have been developed to specifically optimize soles in view of the mentioned functionalities. a common material used for soles in order to provide a compromise between cushioning and stability of the foot has, for example, been foamed ethylene-vinyl-acetate (eva). more recently, the use of expanded thermoplastic polyurethane has been shown to overcome some of the drawbacks associated with eva. further, additive manufacturing techniques have been used for designing parts of shoes. generally, additive manufacturing methods allow fabricating essentially arbitrarily shaped three-dimensional objects without the need for a mold. instead, the objects may be manufactured layer by layer e.g. from liquid material, or from a powder material. exemplary techniques are for example, selective laser sintering, selective laser melting, selective heat sintering, stereo lithography, fused deposition modeling etc., or 3d-printing in general. various additive manufacturing techniques related to shoes are described for example in us 2009/0126225, wo 2010/126708, us 2014/0300676, us 2014/0300675, us 2014/0299009, us 2014/0026773, us 2014/0029030, wo 2014/008331, wo 2014/015037, us 2014/0020191, ep 2 564 719, ep 2 424 398 and us 2012/0117825. specifically, regarding soles, wo 2014/100462 for example discloses a midsole formed as a web-like structure with a plurality of elongate elements, which may provide areas of increased or decreased support, cushioning and/or stability in different regions of the midsole. us 2014/0259787 discloses a shoe including an upper and a sole coupled to the upper. the sole includes an insole, a midsole, and an outsole. the midsole includes a platform and a lattice integrally formed with the platform. however, the known soles made by additive manufacturing have several deficiencies regarding the functional properties of the shoe sole. for example concerning stability, the known soles are hardly able to meet the requirements for soles for sports shoes, in particular for high performance sports shoes. the high-impact, cyclic loading to which sports shoes are exposed to is critical to the material behavior of e.g. laser sintered materials or other materials used in additive manufacturing. moreover, very complex geometric structures are needed in order to vary the mechanical properties, and still the properties often could only be varied within a quite limited range. it may therefore be considered as an object of the present invention to overcome or alleviate at least some of the deficiencies associated with known additively manufactured soles. brief summary of the invention according to an aspect of the present invention, this object is at least partly achieved by a sole, in particular a midsole, according to claim 1 , according to claim 5 , and according to claim 12 . in an example, an additively manufactured sole, in particular midsole, for a sports shoe is provided. the sole comprises a lattice structure, the lattice structure comprising a plurality of cell elements. the sole may further comprise a heel element, three-dimensionally encompassing the heel. moreover, the sole may comprise a base portion interconnecting the heel element and the lattice structure, wherein the base portion has an extension arranged to connect to a plurality of adjacent cell elements, wherein the plurality of adjacent cell elements is not positioned along an edge of the lattice structure. it is understood that the lattice structure, the heel element and the base portion may be integrally manufactured. the additively manufactured lattice structure may be elastic and/or viscoelastic and provide the sole with cushioning. at the same time, the heel element provides the foot with ankle support and prevents it from sliding within the shoe and/or from twisting such that a stable sole suitable for high performance sports shoes, e.g. running shoes, can be provided. the stability of the sole may in particular be provided by the base portion interconnecting the heel element and the lattice structure, wherein the base portion has an extension arranged to connect to a plurality of adjacent cell elements, which are not positioned along an edge of the lattice structure. hence, the heel element is interconnected with the lattice structure not e.g. via a single line of cell elements of the lattice structure along the rear edge of the lattice structure but rather the interconnection includes adjacent cell elements that may for example be arranged at a top surface of the lattice structure. the fact that the heel element is (also) connected to the lattice structure via a plurality of adjacent cell elements not positioned along an edge of the lattice may significantly improve the transfer of lateral/medial forces and torques at the lateral and medial sides of the sole. forces and torques may be transferred to the lattice structure via an interface with cell elements effectively arranged in two dimensions. similarly, it may improve the transfer of forward/backward forces at the rear side of the sole via the heel element. in addition, the forces between the heel element and the lattice structure can be transferred via a larger number of cell elements such that the force per cell element, and therefore the risk of breaking, is reduced. hence, the heel element can transfer larger forces due to the specific connection to the lattice structure. in some examples, the base portion may connect to at least three, at least five, at least ten, or at least 20 adjacent cell elements not positioned along an edge of the lattice structure. it is understood that the extension of the base portion may be arranged to connect also to a plurality of adjacent cell elements, which are positioned along an edge of the lattice structure. in some examples, the lattice structure may e.g. comprise a first row of cells, which are arranged at an edge, and a second, third, fourth etc. row of cells which are not arranged at that edge, but which are arranged adjacent to the first, second, third etc. row of cells, respectively, for example on the top surface or a side surface of the overall lattice structure. the base portion may have an extension arranged to connect to a plurality of adjacent cell elements positioned in the first and second row, and possibly also in the third, or up to the fourth, fifth etc. row of cells. the lattice structure may offer a multitude of different design options such that the mechanical properties provided by the sole may be tailored as needed, e.g. the stiffness (including for example compressive strength, shear strength and/or bending strength and/or torsional stiffness), the density, the weight, the cushioning, the energy return etc. moreover, the lattice structure may be customized as it may be fabricated by additive manufacturing methods, which do not require a mold. hence, customized soles may be provided with short lead times. for example, the sole may be customized regarding the width and/or length of the foot, the weight of the wearer, his/her preferences regarding a tight/lose fit, and/or the type of shoe the sole is intended to be used with etc. moreover, the integral manufacturing of the midsole using additive manufacturing makes the assembly of separate elements of the midsole unnecessary. similarly, the additively manufactured midsole may be fabricated from single material, which may facilitate easy recycling of the midsole. it is noted that the heel element may be three-dimensionally shaped. in some examples, a physical property, in particular a density and/or a stiffness and/or an air permeability, of the lattice structure may decrease from a rim of the sole towards a center of the sole. for example, the sole may be provided with a higher density and/or stiffness and/or a lower air-permeability around a circumference, which may assist in providing stability along the circumference of the foot, whereas towards the center of the sole, e.g. more and more cushioning is provided to provide a nice wearing comfort. it is possible that the lattice structure comprises a plurality of struts forming the plurality of cell elements. moreover, one or more cell elements may alternatively or additionally comprise further elements, e.g. an optional nucleus. the physical properties of the lattice structure may be adjusted by the thickness of struts of the lattice structure for example. further, it is possible to adjust the physical properties by using cell elements with higher or lower density. therein, for example, one or more individual cell elements may have higher or lower density (e.g. by varying a thickness of one or more struts of a cell element, and/or by varying a dimension of the optional nucleus), and/or cell elements may be arranged at smaller or larger distance with respect to each other. in some examples, a geometry of the cell elements may be approximately constant along a thickness of the sole. for example, the geometric design (e.g., cubic, tetrahedral, dodecahedral, etc.), and/or at least one dimension of cell elements (e.g., a lateral, a longitudinal, and/or a vertical dimension), and/or a strut thickness, and/or a spacing between adjacent cell elements may be approximately constant. this may improve the provision of homogenous properties of the sole along its thickness and may improve the longevity of the lattice structure due to a homogenous force distribution within the lattice structure. in some examples, a geometry of the cell elements may be approximately constant in the entire lattice structure. according to a further example, the lattice structure comprises a protective layer on its periphery. such a protective layer could be created on the medial and/or lateral and/or toe and/or heal area side surfaces of the lattice structure, e.g. around a circumference of the lattice structure. moreover, the protective layer could be created in a medial region and/or lateral region and/or heel region and/or toe region of the lattice structure. the protective layer could be a film or foil or the like, which may be integrally manufactured with the lattice structure. the protective layer may be transparent. according to a further example, the lattice structure, the heel element and/or the base portion may be manufactured from the same class of material, in particular from polyether block amide (peba) or from thermoplastic polyurethane (tpu). this may allow a particularly efficient manufacturing of the sole and/or facilitate recycling of the sole. alternatively the components may also be manufactured from polyolefins, for example polyethylene (pe), polystyrene (ps) and/or polypropylene (pp). in principle, it is possible to use an arbitrary mixture of different materials (from different classes of materials or from the same class of materials with slightly different properties) for a single lattice structure. thus, already by combining different materials, possibly using different materials for different zones and/or regions, an arbitrary number of different functional zones may be provided. the mentioned materials may also be recycled materials, which could be for example reclaimed polymer material, e.g. reclaimed from an ocean, especially from maritime waste. reclaimed polymer material could be any plastic material, for example tpu, peba, pe, ps, pp etc. the lattice structure may be printed by using a mixture of new/virgin materials and reclaimed materials, whereby the percentage of each component can vary. in some examples, more than 50%, or more than 90% reclaimed material may be used. by additively manufacturing, e.g. printing, the lattice structure it is possible to create different zones of the structure in different colors. further individualization elements may directly printed in the lattice structure. such elements could be for example names, designs or numbers. it is possible that the lattice structure, the heel element, the base portion and/or other components are e.g. printed by using one or more materials combined to fulfil multiple performance needs in one or more single component. several components can be directly connected to each other via additively manufacturing, e.g. printing. so there is no need for bonding, e.g. via adhesives, the components to each other. outsole and/or outsole components may directly be printed on the bottom side of the lattice structure. the outsole and/or outsole components could be printed from the same class of material as the lattice structure. in some examples, the material used for the outsole could comprise different properties than the material of the lattice structure. it is also possible that a different material is used for printing the outsole as is used for printing the lattice structure. irrespective of the materials used, the outsole and the lattice structure may be printed in one manufacturing process. no bonding, e.g. via adhesives, may be necessary. according to a further example, an additively manufactured sole, in particular midsole, for a sports shoe is provided. the sole comprises a lattice structure, the lattice structure comprising a plurality of cell sites. a majority of the cell sites may comprise interconnected cell elements. a subset of the cell sites comprises cell elements with fewer connections to at least one adjacent cell site than the majority of the cell sites and/or with a cell vacancy. for example, at a cell site of the subset, a cell element may be missing at least partly (cell vacancy). additionally or alternatively, at a cell site of the subset, for example, an “irregular” cell element may be provided, which has fewer connections to at least one adjacent cell site than the majority of the cell sites (one or more cell disconnections). the underlying concept may be regarded as introducing deliberate cell disconnections (e.g. between adjacent cell elements) and/or cell vacancies (e.g. at least partly missing cell elements) into the lattice structure at specific cell sites. cell sites are understood as locations, e.g. volume elements, at which generally cell elements may be provided. for example, the plurality of cell sites may form a three-dimensional array of volume elements. for example, the plurality of cell sites may be regularly arranged. also, the majority of cell elements may be regularly arranged within the plurality of cell sites. however, at individual cell sites, cell elements may also be omitted, at least in part, such that a cell vacancy is created at each of these cell sites. generally, a cell element may comprise a nucleus. the nuclei of adjacent cell elements may be connected to each other via one or more connecting elements, e.g. via one or more struts. it is noted that a cell element may also be formed by a plurality of struts, which may e.g. cross each other at one or more positions, such that a nucleus may be formed by one or more of these crossings. the remainder of the struts, e.g. those portions of the struts outside of the nucleus, may then serve as connecting elements to adjacent cell elements. at least a part of a nucleus of a cell element may be omitted, such that a cell vacancy may be formed by means of that cell element. similarly, at least a part of one or more connecting elements, e.g. at least a part of a strut, of a cell element may be omitted, such that cell elements with fewer connections to at least one adjacent cell site than the majority of the cell sites may be formed by means of that cell element. it is noted that a cell vacancy may also be created at a cell site by providing no cell element at all at that cell site. by means of having a subset of cell sites with fewer connections to adjacent cell elements or with a cell vacancy, the mechanical properties of the lattice structure may be varied on a very fine grained level—for example cell element by cell element—and at the same time very little complexity is added to the structure. for example, the physical properties of the lattice, e.g. its stiffness, density and/or air permeability, may thus be varied without having to change the overall lattice geometry or the lattice material. the same cell element size and/or cell site size and/or cell element design and/or the same material may be used throughout the lattice structure (or at least throughout certain regions of the lattice structure). this may greatly simplify the manufacturing, increase the yields, and at the same time allow for a regular optical appearance of the lattice structure. the properties of the lattice structure may simply be varied by means of the disconnections and/or vacancies at the cell sites belonging to the subset. for example, an overall stiffness/cushioning/air-permeability etc. may be provided by cell sites which do not belong to the subset and which may have a certain fixed number of interconnections with their respective adjacent cell sites. the cell sites of the subset may be placed in one or more regions of the lattice structure, such that the stiffness, cushioning and/or air-permeability may be altered in these regions. by placing a cell site of the subset at a certain position, the physical properties of the lattice structure may specifically varied at that cell site. on the other hand, also the bulk properties of a certain region may be altered, e.g. by varying the number of cell sites belonging to the subset within that region. in some examples, the cell sites of the subset may be regularly arranged at least within a region or zone. it is noted that the majority of cell sites (at least the majority within a certain region of the lattice structure) may comprise cell elements with a fixed number of connections to adjacent cell sites. it may also be possible that the majority of cell sites comprises cell elements with varying numbers of connections. in that case, the cell sites of the subset may comprise fewer connections to at least one adjacent cell than—on average—the cell elements of the majority of cell sites. at least one of the cell sites of the subset may be arranged at a surface of the lattice structure, in particular at an edge of the lattice structure. it has turned out, for example, that by placing a cell site of the subset at a surface, in particular an edge, of the lattice structure, also the strains within the lattice structure which are due to a bending or a shearing of the sole and which may lead to a breakage of the lattice structure may be reduced. hence, the lattice structure may be more durable. at least one of the cell sites of the subset may be arranged in a heel region of the sole. this may allow an adaptation of the sole specifically to the large forces and strains occurring in that region. at least one but not more than 30 (e.g., at least one but not more than 15 or 10) cell sites that are not part of the subset (e.g. that are part of the majority) may be arranged in between two closest cell sites of the subset. this mix of cell sites of the subset and cell sites, which are not part of the subset, has turned out to provide maximum impact on the physical properties of the lattice structure without compromising the overall integrity and stability of the lattice structure. the sole may further comprise one or more additively manufactured stability elements, in particular one or more side stability elements and/or one or more torsional stability elements. these additional elements may further increase the stability provided by the additively manufactured sole. for example, the stability elements may be provided as solid elements, e.g. struts, bars, stripes etc. these additional elements may be integrally fabricated with the sole. the sole may at least partly be fabricated by means of laser sintering, e.g. selective laser sintering. this may allow a particularly flexible and cost-efficient manufacturing and at the same time may provide durable soles. in other examples, also other additive manufacturing methods may be used, e.g. selective laser melting, selective heat sintering, stereo lithography, fused deposition modeling etc., or 3d-printing in general. the sole may comprise a polymer material, in particular a reclaimed polymer material, for example reclaimed from an ocean. polymer material may readily be used for additive manufacturing such that soles may be efficiently manufactured. for example, peba and/or tpu may be used. moreover, it has turned out that also reclaimed polymer material, for example reclaimed from an ocean may be used to provide high quality soles according to the present invention. the soles may thus be provided in an environmentally friendly manner. for example, polymer material available from the initiative “parley for the oceans” may be used for that matter. in some examples, the sole may be fabricated essentially entirely from said materials. the sole may be printed by using a mixture of new/virgin materials and reclaimed materials, whereby the percentage of each component can vary. in some examples, more than 50%, or more than 90% reclaimed material may be used. in a still further example, an additively manufactured sole, in particular midsole, for a sports shoe is provided. the sole comprises a lattice structure, which comprises a plurality of interconnected cell elements. the plurality of interconnected cell elements are regularly arranged. the lattice structure may further comprise at least one cell vacancy arranged in between two or more of the plurality of interconnected cell elements (e.g., a cell element which should be present at a certain location according to the regular arrangement of the plurality of interconnected cell elements is at least partly missing). additionally or alternatively, the lattice structure may further comprise two or more irregular cell elements, which have fewer connections to at least one adjacent cell element than each of the plurality of regularly arranged interconnected cell elements. according to a still further example, a sole, in particular midsole, for a sports shoe, is provided. the sole comprises an additively manufactured lattice structure. the sole may further comprise a functional element that is manufactured separately from the lattice structure. the lattice structure and/or the functional element comprises at least one receptacle. the functional element and the lattice structure are mechanically attached to each other via the at least one receptacle. for example, if the lattice structure comprises a receptacle, the functional element may be mechanically attached to the receptacle. the mechanical attachment of the functional element by means of a receptacle allows providing a sole with different components without using any adhesive and/or glue. in some examples, the at least one functional element is attached to the at least one receptacle without any glue and/or without any adhesive. hence, potentially hazardous substances may be avoided. moreover, providing a sole that is made from a single class of materials may be facilitated such that the sole may be more easily recycled. in addition, possible curing times of adhesives during manufacturing may be avoided. instead, the additively manufactured lattice structure is provided with a receptacle that may be adapted to provide a durable mechanical attachment of the functional element. the one or more receptacle may be adapted such that the sole may also be used without having a connected functional element such that one or more functional elements may be connected to the sole only if needed. for example, a reinforcing element may be attached during cross-country running whereas the sole may be used without such an element when running on an athletic track. further, functional elements may be implemented as one or more of lace loops, heel elements, lateral support elements etc. by means of the mechanically attached functional element, two separately fabricated components may be easily joined, without chemicals, in a simple and durable, and optionally releasable manner. hence, e.g. a dedicated stabilizing element may be attached to the lattice structure to selectively increase its stability, which may not easily be possible with an integrally fabricated stabilizing element. one or more functional elements may connected by means of one or more receptacles as described above to any of the soles described herein. in particular, the receptacle may comprise a snap-fit and/or a snap-fasten element. hence, the one or more functional element may be snap-fitted and/or snap-fastened to the lattice structure. this may be done e.g. at the manufacturer. however, it may also be performed by the customer who may connect one or more functional elements according to his personal taste/physiognomy and/or according to the specific intended use of the shoe to the one or more receptacle. moreover, a receptacle may comprise a joint around which a flap element may be rotated. in an attached position (i.e. functional element and lattice structure being attached to each other), the flap element, in particular a surface of the flap element, faces the lattice structure of the midsole. the mentioned one or more snap-fit or snap-fasten elements may be arranged on the flap element, in particular that surface facing the lattice structure of the midsole. these may snap into one or more corresponding snap-fit or snap fasten elements that may be arranged at a surface of the lattice structure of the midsole facing the flap element in the attached position. the flap element may also be connected to the lattice structure of the midsole without a joint. it is noted that generally, an additively manufactured functional element for a sole, in particular for a midsole, for a sports shoe may be provided. the functional element may comprise at least one receptacle. the at least one receptacle may be adapted for attaching the functional element to the sole mechanically. the lattice structure may comprise at least one moveable element. the at least one moveable element may be integrally manufactured with the lattice structure. it may be a functional element. a moveable element may be manipulated to alter a property of the sole, like breathability or stability for example. hence, performance needs may be fulfilled or enhanced. a moveable element may for example be arranged at the bottom of the lattice structure. a moveable element could be an opening, e.g. for venting, with an adjustable size. for example, a slideable component, e.g. a lever, could be provided which enables a wearer to adjust a size of the opening and thus a breathability provided by the sole. a movable element could also be designed as a locking mechanism to attach the sole to an upper. a moveable element may be moved from a first position into a second position. first and second positions may be fixed. the lattice structure may comprise a polymer material, in particular a reclaimed polymer material, for example reclaimed from an ocean. for example, polymer material may readily be used for additive manufacturing such that the lattice structure may be efficiently manufactured. as examples, e.g. polyether block amide (peba) and/or thermoplastic polyurethane (tpu) may be used. moreover, it has turned out that also reclaimed polymer material, for example reclaimed from an ocean may be used to provide lattice structures that meet the requirements in terms of stability and cushioning for high quality sports shoes. the lattice structures may thus be provided in an environmentally friendly manner. in some examples, the lattice structure may be fabricated essentially entirely from said materials. the lattice structure may comprise a plurality of lattice layers. each lattice layer may comprise a plurality of cell elements. for example, three or more lattice layers may be provided. by using a plurality of lattice layers, a large amount of cushioning may be provided. in particular, the lattice layers may be elastically deformable relative to each other such that the distance between respective two lattice layers may vary as a function of the pressure applied on the lattice structure. for example, the lattice structure may comprise a plurality of essentially horizontal lattice layers that may at least partly be stacked on top of each other. the multi-layer lattice structure may also contribute to providing stability with a relatively low weight of the lattice structure. the lattice structure may comprise at least two regions that have different physical properties, in particular different densities, different stiffness, and/or different air permeability etc. the lattice structure may be adapted to extend essentially across the entire foot. hence, the lattice structure may be used to provide a certain degree of cushioning/stiffness/air-permeability below the entire foot of the respective wearer. the lattice structure may comprise at least one cell element shaped as a dodecahedron, in particular a rhombic dodecahedron. these cell element designs have turned out to provide lattice structures with good stability and cushioning properties and at the same time longevity. this may be attributed to the number of 12 faces of a dodecahedron, which allow a smooth force distribution amongst adjacent cell elements but at the same time still allows connections among adjacent cell elements, which are not too miniaturized. moreover, a rhombic implementation of the dodecahedron design may further contribute to this property. for example, a cell element may comprise eight interconnections to adjacent cells. the lattice structure may comprise at least one fluid channel extending from a top surface of the lattice structure to a bottom and/or a side surface of the lattice structure. more generally, the fluid channel may extend from any top, bottom or side surface to any of top, bottom or side surfaces. in particular, it may also extend from a first portion of a surface (e.g. in a toe region) to a second portion of that surface (e.g. in a heel region). such a fluid channel may be used to guide a fluid between the top and bottom and/or side surfaces of the lattice structure. for example, an airflow may be guided that way. the fluid channel may be adapted such that the inflow of air is promoted, e.g. at the bottom surface and/or the side surface for the lattice structure. thus, a sole may be provided with improved venting properties. the lattice structure may enable airflow from the medial to the lateral side, from heel to toe region and/or from the upper to the outsole. there breathability may be guaranteed in all possible directions to provide a perfectly ventilated shoe. the lattice structure may comprise at least two cell elements with different geometry. for example, a first geometric design, e.g. cell elements designed as rhombic dodecahedrons, may be combined with other geometric designs (e.g., pentagonal dodecahedrons, cubes, cuboids, prisms, parallelepipeds, etc.). also at least two cell elements with different dimensions may be used and/or a spacing between cell elements may differ between the first region and the second region. the sole may comprise a solid rim element additively manufactured with the lattice structure, wherein the solid rim element circulates along a rim of the lattice structure. the solid rim element may further increase the stability of the lattice structure. the solid rim element may comprise one or more perforations to create a transition between the solid rim element and the lattice structure. the perforations could be designed as holes cut into rim. the perforations may be integrally manufactured with the lattice structure. the perforations may be negatives of lattice structure. further, the width and the thickness/height of the solid rim element can vary in different zones or regions. the solid rim element may serve as a bonding margin, and by e.g. varying the width of the solid rim element, the bonding margin for attaching the upper to the lattice structure may be adjusted. the lattice structure may comprise a first region with a first plurality of cell elements having a first geometry and a second region with a second plurality of cell elements having a second geometry. for example, the geometric designs of the regions may be adapted to the specific requirements of that region. for example, a less dense cell element geometry (e.g., cubic) may be used in a region with reduced density and/or stiffness requirements. additionally or alternatively, also one or more dimensions of the cell elements of the first plurality may differ from that of the second plurality. moreover, a spacing between cell elements may differ between the first region and the second region. according to a further example, a shoe with an upper and a sole according to any of the examples described herein may be provided. an intermediate layer between midsole and upper may be provided. such an intermediate layer could be made of an open structure material, for example an open structure textile material. the textile material could be a knit textile, e.g. a warp knit or a weft knit. for example, the weft knit could be flat knitted or circular knitted. for example, the warp knit can be an engineered knit. besides knit textiles, woven, non-woven, braided and/or other yarn-based fabric materials may be used and/or all types of open cell meshes. in principle it is possible that the intermediate layer is attached, e.g. stitched, to the upper via strobel lasting. alternatively, the sole and the upper may be directly connected to each other without an intermediate strobel last. for example, the lattice structure of the sole may be adapted to provide a nice wearing comfort when contacting the foot of the wearer. hence, an intermediate strobel last and/or other intermediate layers may be avoided. as a result, a lighter and more cost-efficient shoe may be provided. if the sole has a solid rim element, the upper may be connected to the solid rim element. in other words, the upper may be connected to the sole via the solid rim element. for example, the upper may be glued, stitched, thermally bonded etc. to the solid rim element. the upper may also be connected to the sole via infrared (ir) welding. the upper may comprise a polymer material, in particular a reclaimed polymer material, for example reclaimed from an ocean. for example, the upper may comprise a yarn that includes the polymer material. it has turned out that such yarns may be used to provide high-quality shoes. moreover, using a reclaimed polymer material allows providing more environmentally friendly shoes. for example, polymer material available from the initiative “parley for the oceans” may be used for that matter. in particular, the shoe may therefore comprise a midsole which comprises or is essentially entirely made of reclaimed polymer material, for example reclaimed from an ocean as well as and an upper that comprises reclaimed polymer material, e.g. a yarn that includes the polymer material. the upper may be fabricated using tailored fiber placement with a yarn that comprises polymer material, e.g. reclaimed polymer material, for example reclaimed from an ocean. concerning further details with respect to tailored fiber placement, reference is made to co-pending application de 10 2015 205 750.8 that is incorporated by reference. it is possible that not just the fibers themselves comprise or are made from reclaimed material. in principle it is also possible that a base layer, as described in de 10 2015 205 750.8 comprises reclaimed material as well. the upper may also be made of a mixture of new material and reclaimed material. in some examples, more than 50%, or more than 90% reclaimed material may be used. the upper and the sole may comprise the same class of material, in particular tpu or peba. thus, recycling of the shoe may be facilitated. for collecting the reclaimed polymer material mentioned above from the ocean, a net, e.g. a fishing net, may be used. also the net may be used for manufacturing the mentioned soles and/or uppers, which may be manufactured by using the reclaimed material. for example the net could comprise nylon or the like, which could be incorporated into the final product, e.g. the sole and/or the upper, just as the reclaimed polymer material. accordingly, a method may be provided for manufacturing a sole and/or an upper. the method may include the step of reclaiming a polymer material from an ocean using a net. a further step may be to use the reclaimed polymer material as well as the material of the net as base material for the sole and/or the upper. in some examples, more than 50%, or more than 90% reclaimed material and net material may be used as a base material. it is noted that the features indicated above and described further below may also be combined with each other, although—for the sake of brevity—not all possible combinations may be explicitly described herein. moreover, it is noted that the features that are not mandatorily required for the functioning of the aforementioned examples may also be omitted. finally, it is noted that the disclosed aspects may also be used for other sports equipment than sports shoes. brief description of the drawings/figures possible embodiments of the present invention will be further described in the following detailed description with reference to the following figures: figs. 1a-c show aspects of a midsole according to some embodiments; figs. 2a-d show aspects of a midsole according to some embodiments; fig. 3a-b show aspects of a midsole according to some embodiments; fig. 4 shows aspects of a lattice structure for a midsole according to some embodiments; fig. 5 shows aspects for a separately additively manufactured lattice structure with a receptacle according to some embodiments; figs. 6a-d show aspects for a separately fabricated functional element that may be attached to a lattice structure according to some embodiments; figs. 7a-b show aspects of a midsole with one or more moveable elements accordingly to some embodiments; fig. 8 show aspects for a lattice structure accordingly to some embodiments; and fig. 9 shows aspects for a sole with various regions accordingly to some embodiments. detailed description of the invention it should be noted that in the following, only some possible examples of the present invention can be described in detail with reference to midsoles. the person skilled in the art readily recognizes that the specific details described with reference to these specific examples may be altered, developed further, combined in a different manner and that certain aspects of the specific examples described in the following may also be omitted. moreover, it is noted that various aspects described in the subsequent detailed description may be combined with aspects described in the above summary section. figs. 1a-c show perspective, rear and side views of a first embodiment of a midsole 100 according to the present invention. the midsole 100 comprises a lattice structure 110 having a plurality of cell elements 191 , a heel element 120 , which three-dimensionally encompasses the heel, and a base portion 130 interconnecting heel element 120 and lattice structure 110 . base portion 130 has an extension arranged to connect to a plurality of adjacent cell elements 191 . the plurality of cell elements 191 includes a first plurality of adjacent cell elements 191 positioned along an edge of the lattice structure 110 , as well as a second plurality of adjacent cell elements 191 not positioned along the edge of the lattice structure 110 . the first and second pluralities of adjacent cell elements 191 are arranged adjacent to each other. since base portion 130 is connected to a plurality of adjacent cell elements 191 not positioned at the edge of lattice structure 110 (in addition to the plurality of adjacent cell elements 191 positioned at the edge of lattice structure 110 ), forces and torques may be transferred to the lattice structure via an interface with cell elements 191 effectively arranged in two dimensions. this not only improves the transfer of forces and torques such that heel element 120 is able to provide increased stability. it also reduces the forces and torques that need to be transferred per cell element 191 . hence, the individual cell elements 191 are less susceptible to breaking. lattice structure 110 comprises a plurality of cell sites. a majority or all of the cell sites may be regularly arranged. a majority or all of the cell sites may comprise essentially identical cell elements 191 . alternatively, different cell elements 191 and/or a different cell site arrangement may be provided in different regions of lattice structure 110 . thus, different mechanical properties may be provided by lattice structure 110 in different regions. heel element 120 may be three-dimensionally shaped such that it can be adapted to the heel of a wearer and/or the expected force profile. in particular, the heel element 120 may be tapered, as e.g. shown in fig. 1a . heel element 120 may become thicker from a top side of the heel element 120 towards the base portion 130 connecting it to the lattice structure 110 . moreover, as illustrated in the example of fig. 1b , heel element 120 may also be shaped with a specific pattern around the circumference of the heel. heel element 120 may comprise two elevated portions 121 and 122 , which are arranged at the lateral and medial sides of the heel, respectively. moreover, heel element 120 may comprise a lower portion 123 arranged at a rear side of the heel. the combination of elevated portions 121 and 122 at lateral and medial sides with lower portion 123 at the rear side of the heel may help to provide a large degree of stability, especially in relation to lateral movements. simultaneously, the pressure exerted by heel element 120 on the sensitive rear side of the heel, which is particularly susceptible to pressure marks or blisters, may thus be minimized. in other examples, heel element 120 may also have an elevated portion at the rear side of the heel and/or each of the elevated portions 121 and 122 may also individually be implemented as lower portions or comprise lower sections as needed. midsole 100 may also comprise a solid rim element 140 such as depicted in fig. 1a . solid rim element 140 may circulate along a rim of the top surface of lattice structure 110 , e.g. extending from a medial side of base portion 130 along the rim of the midfoot and forefoot as well as toe regions of the sole until a lateral side of base portion 130 . additionally or alternatively, solid rim element 140 may be provided sideways along the rim of lattice structure 110 . solid rim element 140 may not be three-dimensionally shaped. instead, it may be provided as a flat stripe with essentially identical thickness throughout its various regions. alternatively, solid rim element 140 may at least in part also be three-dimensionally shaped. for example, solid rim element 140 may comprise a thicker cross-section at the lateral and/or medial sides of the midfoot region such that increased stability may be provided by solid rim element 140 , in these locations. additionally or alternatively, solid rim element 140 may comprise a wedged cross-section at the lateral and/or medial sides of the midfoot region to provide a graded degree of stability, there. also in other regions, solid rim element 140 may be three-dimensionally shaped. solid rim element 140 , as depicted in fig. 1a , may not comprise a lattice structure, but instead be implemented as a continuous strip of material. in some examples, solid rim element 140 may increase the stability of sole 100 around its rim. alternatively or additionally, solid rim element 140 may serve as a means for supporting the attachment of sole 100 to an upper. the solid rim element 140 may comprise one or more perforations to create a transition between solid rim element 140 and lattice structure 110 . the perforations could be designed as holes cut into solid rim element 140 . the perforations may be integrally manufactured with the lattice structure 110 and may be negatives of lattice structure 100 . as explained, the width and the thickness of the rim can vary in different zones and/or regions. sole 100 may also comprise a solid front portion 150 . solid front portion 150 may not comprise any lattice structure. rather, it may be implemented as a continuous element. it may be arranged at the front tip of sole 100 . for example, it may extend from the front tip of the sole towards the rear side of sole 100 by a length of 3 mm to 25 mm, or 5 mm to 15 mm. it may extend from a top surface of sole 100 towards a bottom surface of sole 100 and/or from the lateral side of sole 100 to the medial side of sole 100 . solid front portion may be provided to increase the stability of sole 100 in the toe region, which is the last point of contact with ground during running and thus has to withstand large forces, especially when accelerating or decelerating. as shown in fig. 1b , sole 100 may optionally also be provided with a lower layer 160 which may be provided as a solid layer 160 and may not comprise a lattice structure. lower layer 160 may comprise openings, e.g. as will be described with reference to figs. 2a-c . lower layer 160 may be provided to control the amount of fluid, e.g. humidity and/or air that may enter lattice structure 110 . moreover, it may increase the torsional and bending stability of sole 100 . lower layer 160 may for example be manufactured from a foil or sheet, or it may be integrally fabricated with lattice structure 160 . lower layer 160 may be designed as an outsole. an exemplary thickness profile of midsole 100 , and in particular of lattice structure 110 is shown in the side view of fig. 1c . the thickness profile of lattice structure 110 may coarsely be divided into four regions. in a forefoot region 171 , which extends from the front tip of sole 100 —or from the rear end of front portion 150 , if provided—towards the beginning of the metatarsals, the thickness of the lattice structure may increase towards the rear side of sole 100 . for example, the thickness may increase from 2 mm-10 mm, e.g. 3 mm-8 mm, or approximately 5 mm, to 5 mm-20 mm, e.g. 7 mm-15 mm, or approximately 10 mm. additionally or alternatively, sole 100 may be slightly inclined upwards in forefoot region 171 , e.g. in order to follow the anatomy of a human foot. the thickness may further increase towards the rear side of sole 100 within a midfoot region 172 . midfoot region 172 may be adjacent to forefoot region 171 and extend to the beginning of heel region 173 . the thickness of lattice structure 110 may increase to 10 mm-40 mm, e.g. 15 mm-30 mm, or approximately 25 mm. the reduced thickness of lattice structure 110 in forefoot region 171 and in midfoot region 172 may assist the rolling motion of the foot in these regions. in heel region 173 , the thickness of lattice structure 110 may be approximately constant. the increased thickness of lattice structure 110 in heel region 173 may reflect the fact that most of a wearer's weight is supported in this region, and it may contribute to limit the degree of vertical deformation of sole in this region. in a rear region 174 , the thickness of the lattice structure may reduce slightly, e.g. to 8 mm-35 mm, e.g. 10 mm-30 mm, e.g. approximately 20 mm. the reduced thickness in rear region 174 may support the rolling motion of the heel when contacting the ground, e.g. during running. in other examples, however, the thickness may remain constant also in rear region 174 . sole 100 , and/or its lattice structure 110 , and/or its heel element 120 , and/or its base portion 130 , and/or its solid rim element 140 , and/or its front portion 150 , and/or its lower layer 160 may all be integrally fabricated using additive manufacturing. as an example, laser sintering, e.g. selective laser sintering or more generally 3d-printing may be used to manufacture sole 100 . generally, polymer materials may be used as base materials. for example, tpu (e.g. tpu available under the commercial name desmosint x92a-1) or peba (e.g., peba available under the commercial name evonik vestosint x2611 softtouch) may be used, and they have shown to provide good stability and longevity. also reclaimed polymer material, for example reclaimed from an ocean may similarly be used. concerning lattice structure 110 , it may be formed by a plurality of struts arranged to form a plurality of cell elements 191 . the geometry of the respective struts (e.g. thickness, length etc.) may be modified to alter the geometry of the respective cell elements. the cell elements 191 may be arranged at regular cell sites. the thickness of the struts may range from 0.5 mm to 4 mm, and may comprise e.g. approximately 1.2 mm to 1.6 mm or approximately 1.8 mm to 2.2 mm. the struts may have a uniform thickness throughout the lattice structure. alternatively, local thickenings may be provided, e.g. at the intersections of the various struts, as exemplarily shown in the example of fig. 1c . in some examples, also struts with different thicknesses or struts with varying thickness may be used. typical weights of a midsole such as depicted in figs. 1a-c for standard sizes (e.g. european shoe sizes 40-45) range within 80 g and 200 g depending on the exact geometry of the lattice structure as well as the presence and design of possible further components of the sole as explained above. each cell element 191 may have a nucleus, which may be formed approximately at the center of each cell element 191 . the nucleus may be created by the intersection of several struts of a cell element 191 . as mentioned, the struts may be thickened, e.g. at the intersections, such that a more pronounced nucleus may be provided. for example, the stability of lattice structure 110 may thus be increased. in other examples, nuclei may be provided in a different manner, as already explained. for example, a more complex structure may be provided approximately at the center of a cell element, e.g. as described with reference to fig. 4 . in addition, or alternatively to the various items of sole 100 , lattice structure 110 may generally also be provided with other items. for example, various design elements, e.g. stripes, may be integrally fabricated with lattice structure 110 . additionally or alternatively, also further functional elements, e.g., lace loops, may be integrally manufactured by additive manufacturing together with lattice structure 110 . for example, 360° lace loops may be provided which include one or more tubes penetrating the lattice structure e.g. from its medial side to its lateral side. moreover, stability elements, e.g. medial and/or lateral side stability elements, torsional stability elements, one or more fluid channels, etc., may be integrally fabricated with lattice structure 110 . moreover, elements for opening closing the shoe with which sole 100 is intended to be used may be integrally provided with lattice structure 110 . for example, snap-fit or snap-fasten elements may be provided for that matter. further additionally or alternatively, lattice structure 100 may be provided with a sideways layer that may extend at least partly around the periphery of the midsole and/or the lattice structure. the sideways layer may be adapted to provide a nice hand feel of the midsole, optionally without camouflaging the lattice structure. for example, a sideways layer may be implemented as a foil or other thin layer with a lattice-like surface following the design of the lattice structure. it may also be integrally manufactured with the lattice structure. it may also serve for controlling fluid flow into the lattice structure from the sides, and e.g. have corresponding openings. the sideways layer may also prevent dirt or dust from entering the midsole from the sides. a variety of tests have been performed with midsoles similar to that shown in figs. 1a-c fabricated from peba or tpu, respectively. these tests show that the midsoles have suitable mechanical properties under specific processing conditions and provide longevity as required for high quality shoes, e.g. running shoes. torsion test a torsion around the longitudinal axis of the midsoles by 5° was applied and the required bending moment was recorded (measurement of torsional stability). the peba midsoles exhibit a bending moment in the range of approximately 0.9 nm to 1.9 nm, e.g. about 1.4 nm, for eversion (rotation of the bottom surface of the midsole in lateral direction) with respect to the forefoot. for inversion (rotation of the bottom surface of the midsole in medial direction) with respect to the forefoot, the bending moment is in the range of approximately 0.3 nm to 1.3 nm, e.g. about 0.8 nm. for the tpu midsoles the bending moments are in the range of approximately 0.2 nm to 1.2 nm, e.g. about 0.6 nm or about 0.8 nm, for inversion, and approximately 0.2 nm to 1.2 nm, e.g. about 0.6 nm or about 0.7 nm, for eversion. forefoot flex test moreover, a vertical displacement with an indentor having a diameter of 15 mm was applied to a forefoot region of the midsoles and the force required to achieve a certain displacement was recorded (measurement of forefoot bending stiffness). the force was applied in a standard three-point bend test, wherein the force was applied approximately centered between two supports arranged at a distance of 80 mm between each other. the forces required for a certain displacement of the forefoot region are an approximately linear function of the displacement for the midsoles. for the peba midsoles, a force of approximately 100 n to 200 n, e.g. 150 n to 170 n, is required to achieve a displacement of 10 mm. for the tpu midsoles, a force of approximately 55 n to 145 n, e.g. 75 n to 95 n or 110 n to 130 n, is required for that purpose. after repeating 100 thousand cycles (which simulates a distance of 280 km ran at a speed of 14 km/h), the required force reduced only by approximately 10% to 15% e.g. 12% to 13% which is a significant improvement compared to conventional eva midsoles (approximately 17%). the amount of plastic deformation after this large number of cycles is about 30%, comparable to common midsoles. midfoot flex test in addition, a vertical displacement with an indentor having a diameter of 15 mm was applied to a midfoot region of the midsoles and the force required to achieve a certain displacement was recorded (measurement of midfoot bending stiffness). the force was applied in a standard three-point bend test, wherein the force was applied approximately centered between two supports arranged at a distance of 80 mm between each other. the forces required for a certain displacement of the midfoot region are an approximately linear function of the displacement for the midsoles. for the peba midsoles, a force of approximately 240 n to 340 n, e.g. 280 n to 300 n, is required to achieve a displacement of 10 mm. for the tpu midsoles, a force of approximately 100 n to 300 n, e.g. 135 n to 155 n or 220 n to 240 n, is required. the midfoot bending stiffness is thus higher than the forefoot bending stiffness. long-term cushioning test further, the elastic displacement range when applying and releasing a vertical force of 1800 n to the heel region of the midsoles was measured after 100 thousand cycles (measurement of long-term cushioning). for the peba midsoles the displacement range is 1 mm-11 mm, e.g. 2 mm-5 mm, and for tpu midsoles the range is 3 mm-13 mm, e.g. 6 mm-10 mm. the plastic deformation present in the midsoles after 100 thousand cycles is comparable to that in conventional eva midsoles. specifically the peba midsoles, however, showed a higher amount of energy return. similarly, the long-term cushioning in the forefoot region was measured by applying a vertical force of 2000 n after 100 thousand cycles. the displacement range for the midsoles is of 1 mm-8 mm, e.g. 2.5 mm-5 mm. the plastic deformation after 100 thousand cycles is again similar to that in common eva midsoles. short-term cushioning test the short-term cushioning in the rear region was measured by applying a displacement of 14 mm to the rear region located on a ground plane with an inclination of 30°. the necessary forces are in the range of 100 n to 1000 n, e.g. in the range of 150 n to 400n or in the range of 550 n to 800 n. after 100 thousand cycles, a plastic deformation of about 20% to 30% is observed. in summary, midsole 100 may be additively manufactured in an integral manner and may provide sufficient cushioning and flexibility as well as longevity to be suitable, e.g. for high performance running shoes. figs. 2a-c show perspective, side and bottom views, respectively, of a further example for a midsole 200 according to the present invention. similarly as midsole 100 , midsole 200 may comprise a lattice structure 210 with a plurality of cell elements 291 , a heel element 220 , a base portion 230 , a solid rim element 240 , a front portion 250 , as well as a lower layer 260 . said items may generally be implemented and fabricated similarly as already explained with respect to figs. 1a-c . moreover, midsole 200 may also comprise further elements, e.g. as described with reference to midsole 100 . as can be seen from fig. 2a , a main difference between sole 100 and sole 200 is the design of the heel elements 120 and 220 , respectively. heel element 220 has a relatively constant height at the rear side of the heel as well as at the lateral and medial sides of the heel adjacent to the rear side. the height of heel element 220 is only reduced at its ends, both at the medial and laterals sides. heel element 220 is nevertheless three-dimensionally formed since its cross-section increases from its top towards its bottom such that a relatively thick cross-section is provided at the interface towards base portion 230 that connects heel element 230 to lattice structure 210 . the thickness of lattice structure 210 may vary in regions 271 - 274 similarly as already explained with reference to regions 171 - 174 of sole 100 . in addition, lattice structure 210 of sole 200 may have an increased thickness at the lateral side of the front region 271 and/or the lateral side of the midfoot region 272 such as to provide increased stability, there. this can be seen e.g. in the side view of sole 200 in fig. 2b . generally, the thickness profile as well as the entire geometry of sole 200 and in particular of lattice structure 210 may be adapted to the needs of the individual wearer, and/or the individual anatomy of his/her foot, and/or the intended use of sole 100 . fig. 2c shows a bottom view of sole 200 , which allows discerning possible details of lower layer 260 . as can be seen in fig. 2c , lower layer 260 may be provided as a solid layer with a variety of openings 261 . openings 261 may vary in size and may be adapted to the venting needs in different regions of the sole, or of the customer, or to the type of shoe with which sole 200 is intended to be used. notably, openings 261 may be arranged along a number of lines 262 . in the example of fig. 2c , a number of five lines is provided. the lines may be undulated. however, in other examples a different number of lines, which may or may not be undulating, may be provided. the lines 262 as well as the size of the openings may be arranged such that lower layer 260 provides different degrees of stiffness in various regions. for example, in the sensitive region 275 below the arch of the foot, the openings are relatively small such that some venting is provided but the solid lower layer 260 also provides a large degree of torsional stability, there. moreover, also the bending stiffness is reduced in region 275 below the arch of the foot to provide increased stability. the relatively large openings 261 in the forefoot and heel regions 272 , 273 of sole 200 reduce the bending stiffness, there, such that the rolling motion of the foot is not hindered. in toe region 271 and rear region 274 , the size of the openings may again be reduced in order to provide increased stability, there. seen from a different perspective, the lines indicated with reference signs 262 may be considered as separating individual struts provided by the lower layer 260 that extend from the rear side possibly all the way to the front side of sole 200 such that torsion may efficiently be reduced. the positioning and shape of the lines 262 may also be adapted to counteract pronation or supination as needed for the individual wearer. fig. 2d shows a bottom view of a sole 201 similar to sole 200 shown in figs. 2a-d , wherein a torsional stability element 280 is integrally fabricated with lattice structure 210 . the torsional stability element 280 may for example be provided as one or more struts with lateral dimensions of 1 mm to 40 mm, or 2 mm to 20 mm. a height of torsional stability element 280 may be similar. torsional stability element 280 may extend at least from a heel region to a midfoot region. it may be approximately centered in lateral direction. an optional lower layer of lattice structure 201 may have an opening to make torsional element 280 visible, at least partly. the exact design and position of the torsional stability element 280 may be adjusted, e.g. as required by the individual wearer. it is also possible that the torsional stability element 280 is fabricated separately and attached to the lattice structure 210 later on. figs. 3a-b shows a further example for a midsole 300 according to the present invention. midsole 300 comprises a lattice structure 310 , a heel element 320 and a base portion 330 . these items, and possible further items, may be implemented and fabricated e.g. as already explained with reference to figs. 1a-c and figs. 2a-c . in particular, lattice structure 310 may comprise a plurality of regularly arranged cell sites 390 . for example, regularly arranged cell sites 390 may be provided in a heel region and/or a rear region and/or in other regions of lattice structure 300 . a majority of the cell sites 390 within each such region may comprise interconnected cell elements 392 . for example, in the example lattice structure 310 , a majority of cell sites 390 in the rear region as well as the heel region, the midfoot, forefoot and toe regions comprises interconnected cell elements 392 . lattice structure 310 also comprises a subset of cell sites 390 with cell elements 391 comprising cell vacancies, which is arranged within one or more zones 380 . a zone 380 may for example be arranged at a rear side of lattice structure 310 , and in particular at an edge of the rear side adjacent to base portion 330 . additionally or alternatively, one or more zones 380 may also be arranged at other locations of lattice structure 310 . moreover, also zones 380 , which comprise cell elements with fewer connections to at least one adjacent cell site than the majority of the cell sites, may be provided. fig. 3b shows a close-up view of the zone 380 depicted in fig. 3a . the plurality of cell sites 390 of lattice structure 310 is indicated by dashed diamonds. a majority of the cell sites 390 comprises cell elements 392 that may each have a nucleus and four connecting elements providing connections to respective adjacent cell elements 392 . the cell elements 392 may be formed by a plurality of struts. the struts may interconnect to each other approximately at the center of each cell site 390 and they may optionally be thickened, there. the struts may thus form a nucleus approximately at the center of each cell element 392 , which, in the example of fig. 3b , coincides with the center of each cell site 390 . the portions of the struts outside of the nucleus form the connecting elements of each cell element providing the connections to the respective adjacent cell sites 390 . in zone 380 , which is arranged adjacent to base portion 330 , there are cell sites 390 , which comprise a cell element 391 with a cell vacancy (emphasized by solid circles). for example, the struts of a cell element 391 may be arranged such that they do not interconnect to each other. no nucleus may be provided in these cell elements 391 . in other words, by means of cell elements 391 , cell vacancies may be intentionally provided. this is the case in both exemplary cell elements 391 shown in fig. 3b . in other examples, a nucleus may at least partially be provided by a cell element 391 . for example, at least some of the struts may interconnect to each other. additionally or alternatively, connection elements of a cell element 391 (e.g. portions of struts) may be missing, or may comprise one or more gaps, such that cell disconnections to at least one adjacent cell are provided. hence, less connections to at least one adjacent cell may be provided by such a cell element 391 compared to cell elements 392 which are present in a majority of cell sites 390 . in the example of sole 300 , cell sites 390 are provided in rows, wherein the cell sites 390 with cell vacancies are arranged in that row which is adjacent to base portion 330 . specifically, every second cell site 390 in that row is implemented with a cell vacancy. in other examples, cell sites with vacancies may be arranged differently. in particular, only every third cell site in a specific row may be implemented with a vacancy or cell sites with vacancies may be dispersed even more scarcely and/or with a varying density. in addition or alternatively, cell sites in rows other than that adjacent to base portion 330 may be provided with vacancies, e.g. a second, third, etc. row. moreover, it is understood that cell sites with vacancies need not be arranged according to rows, and generally also cell sites in general need not be arranged in rows. in some examples—additionally or alternatively to cell sites with vacancies—cell sites with cell elements may be provided, wherein the cell elements comprise fewer connections to at least one adjacent cell site than the majority of the cell sites. for example, instead of cell sites 390 with cell elements 391 with vacancies in the example of fig. 3b , it would be possible to provide cell sites with cell elements having only three, two or a single connection with adjacent cell elements, e.g. by providing only three, two or a single strut at such a cell element, or correspondingly only three, two or a single strut without any gap. zone 380 may provide a smooth transition from base portion 330 to lattice structure 310 , which may also provide an aesthetic outer appearance) and may create a less abrupt change from the solid material of base portion 330 to lattice structure 310 . hence, strains of lattice structure 310 , in particular of struts of lattice structure 310 , may be reduced. zone 380 enables the creation of a gradient from solid base portion 330 to lattice structure 310 . the cell vacancies (or reduced number of interconnections) provided by cell elements 391 allow to selectively reduce the stiffness provided by the lattice structure 310 at specific cell sites 390 . this may allow for a smoother force transfer from base portion 330 to lattice structure 310 such that lattice structure 310 may break less easily. in some examples, a graded degree of stability may be provided in a transition zone, e.g. on a rear side of lattice structure 310 , at that edge of lattice structure 310 that faces base portion 330 . for example, the density of cell sites 390 with vacancies (or a reduced number of connections to at least one adjacent cell site) provided by cell elements 391 may increase through such a transition zone such that a graded degree of stability may be provided in the transition zone between lattice structure 310 and base portion 330 . for example, the stability may decrease closer towards the base portion 330 . in some examples, also the number of connections to adjacent cell sites 390 provided by cell elements 391 may be reduced along a transition zone. for example, three interconnections may be provided at cell sites 390 farther away from base portion 330 , whereas only two or one connections may be provided at cell sites 390 closer to base portion 330 . it is noted that a transition zone and or a zone 380 may be provided in the mentioned regions of the respective lattice structure irrespective of the optional presence of a heel element. it is noted that for ease of illustration, in fig. 3b a cell site 390 comprises only four connections to adjacent cell sites 390 , which are arranged within the same plane. in other examples, a different number, in particular a larger number of connections may be provided, and the connections of a cell site with its adjacent cell sites may also be arranged such that they do not all lie within the same plane. for example, a majority of cell sites may comprise cell elements with eight interconnections to adjacent cell sites, whereas cell sites of a subset may comprise cell elements with only seven or less interconnections to adjacent cell sites (and/or cell vacancies may be provided at cell sites of the subset). moreover, it is understood that also soles 100 and 200 may comprise one or more zones as explained with reference to sole 300 . fig. 4 shows a further example for a lattice structure 400 for a sole according to the present invention. generally, lattice structure 400 may be implemented and fabricated as explained with reference to the previous figures. lattice structure 400 comprises a forefoot portion 471 , a metatarsal region 472 , a region under the arch of the foot 473 , and a rear region 474 . as can be seen, lattice structure 400 comprises a plurality of cell sites 490 . in the rear region 474 , three layers of cell sites 490 are provided. a front portion of region 473 comprises two layers whereas a rear portion of region 473 also comprises three layers. in the metatarsal region 472 , two layers of cell sites 490 are provided. the forefoot region 471 comprises three layers, which, however, do not extend across the entire forefoot region 471 . for example, the top layer is only arranged in a front portion of forefoot region 471 , whereas the bottom layer is only arranged in a rear portion of forefoot region 471 . the cell sites are arranged equidistantly in the example of fig. 4 such that a different number of layers leads to a different thickness. in other examples, other numbers of layer may be provided in the various regions. moreover, the properties of one or more layers may vary. for example, a thickness of a layer may increase or decrease within a certain region or may be different in different regions, e.g. in order to provide a thickness profile, for example such as explained with reference to figs. 1a-c . in some examples, cell sites 490 may be arranged at least in part such that these are not equidistant. this may allow controlling the thickness of lattice structure 400 independently from the numbers of layers, as well as the properties provided by a continuous layer in different regions. cell sites 490 in regions 471 and 473 each comprise a cell element 492 . cell elements 492 may generally be provided by a plurality of struts (bar-like or tube-like elements). for example, a plurality of struts may be arranged to form a dodecahedron (e.g. rhombic), a tetrahedron, an icosahedron, a cube, a cuboid, a prism, a parallelepiped etc. this basic geometric design and its interior may be considered as the nucleus 492 a of each cell element 492 . further, additional struts or additional portions of struts may be provided to form connections with respective adjacent cell elements. for example, eight connections may be provided by cell element 492 . in other examples, four, six, eight, twelve or any other number of connections may be provided. the volume occupied by a single cell site or a single cell element may be 3 mm 3 -30 mm 3 , 5 mm 3 -20 mm 3 , 7 mm 3 -15 mm 3 , or 8 mm 3 -12 mm 3 . cell sites 490 in region 472 comprise cell elements 491 . these may be similar to cell elements 492 . however, the thickness of their struts may be reduced with respect to those of cell elements 491 . in particular, their thickness may be reduced by approximately 75-85%, e.g. 80%. similarly, rear region 474 may comprise cell elements 493 with a strut thickness, which is increased by approximately 115-125%, e.g. 120%. hence, the density and therefore also the weight, stiffness and cushioning provided by lattice structure 400 in its various regions may be varied. density variations in the range of −20% to +20% have turned out to allow for significant variations and at the same time for a homogenous feel and sufficient longevity of lattice structure 400 . in general, lattice structure 400 may be divided into any number of different regions as needed, and in particular, as specified for each individual wearer. for example, a three-dimensional scan of a foot may be performed and the arrangement of cell sites 490 and the grouping of these cell sites 490 into different regions may be carried out correspondingly. the design of the regions and their cell elements may take into account the anatomy of the wearer, e.g. his/her weight, whether he/she tends to pronate or supinate etc. further, the design of the regions, as well as of the cell elements within each region may be adapted according to the specific type of sports the sole is to be used for. for example, the lattice structure may specifically be adapted to provide lateral stability for lateral sports, such as e.g. basketball. as a result, lattice structure 400 may be customized as needed. moreover, the lattice structure may be adapted for different shoe sizes such that—irrespective of the size of the shoe—the same mechanical properties may be provided by the lattice structure. lattice structure 400 may also be provided with one or more items as described with reference to figs. 1a-c and figs. 2a-c as well as with aspects described with reference to figs. 3a-b . it is noted that also the lattice structures 110 , 210 and 310 may generally be provided with aspects described with reference to lattices structure 400 . fig. 5 shows an example for an additively manufactured lattice structure 500 with a receptacle 501 according to the present invention. lattice structure 500 comprises a plurality of cell sites that may be adapted e.g. as described with reference to the previous figures. in particular, lattice structure 500 may be integrally fabricated by additive manufacturing. lattice structure 500 may comprise one or more receptacles 501 . one or more functional elements that may be fabricated separately from lattice structure 500 , e.g. by additive manufacturing or any other manufacturing method, and that may be mechanically attached to one or more receptacles 501 . a receptacle 501 may comprise a joint 502 around which a flap element 503 may be rotated. flap element 503 , in particular a surface of flap element 503 facing a main portion of lattice structure 500 , may comprise one or more snap-fit and/or snap-fasten elements 504 . snap-fit and/or snap-fasten elements 504 may snap into one or more corresponding snap-fit and/or snap-fasten elements 505 that may be arranged at a surface of the main portion of lattice structure 500 facing flap element 503 . flap element 503 may also be connected to the main portion of lattice structure 500 without a joint 502 . although not shown in fig. 5 , one or more receptacles 501 may for example be used to mechanically attach a torsional stability element to the lattice structure 500 . hence, such separately fabricated functional elements may be safely attached to lattice structure 500 mechanically, e.g. without using any glue or adhesive. hence, the integrity of lattice structure 500 may not be compromised by adhesive or glue entering the lattice structure 500 while gluing separate elements to it. instead, separate elements may be mechanically attached as needed. for example, snap-fit or snap-fasten elements 505 , 504 may be adapted to allow a releasable attachment such that the functional elements attached to the receptacle may be interchanged, e.g. by the wearer, as needed. lattice structure 500 may be fabricated using similar methods and materials as described with reference to the previous figures. finally, it is noted that also lattice structures 110 , 210 , 310 and 400 described with respect to the previous figures may be combined with one or more receptacles and the related aspects described with reference to fig. 5 . figs. 6a-d show an example for a separately manufactured functional element 600 . functional element 600 may be fabricated by additive manufacturing or any other manufacturing method. functional element 600 may be mechanically attached to a midsole 610 as shown in fig. 6c . midsole 610 may be designed as any of the midsoles described herein and may comprise in particular comprise a lattice structure 110 , 210 , 310 , 500 as described. alternatively, the midsole 610 could also be designed as a solid midsole, e.g. made of eva, tpu or the like. in the example according to figs. 6a-d , the functional element 600 itself comprises one or more receptacles 608 . a receptacle 608 may comprises a joint 602 around which a flap element 603 may be rotated. fig. 6a shows the functional element 600 with the flap element 603 in a closed position. fig. 6b and fig. 6d show the flap element 603 in an open position. fig. 6c shows the functional element 600 attached to the midsole 610 . in the attached positon according to fig. 6c , the flap element 603 , in particular a surface of flap element 603 faces and attaches to midsole 610 . in fig. 6c , a possible lattice structure of the midsole 610 is not shown for the sake of simplicity. the flap element 603 may comprise one or more snap-fit or snap-fasten elements 604 which may snap into one or more corresponding snap-fit or snap fasten elements that may be arranged at a surface of midsole 610 , in particular of the lattice structure of midsole 610 , facing flap element 603 in the attached position. flap element 603 may also be attached to the midsole 610 without a joint 602 . the functional element shown in figs. 6a-d may be used to provide one or more lace loops 605 , one or more heel elements 606 , one or more lateral support elements 607 or other elements to support an upper of a shoe. figs. 7a-b show a further example for a sole 700 according to the present invention which may be implemented as a midsole. sole 700 may comprise a lattice structure 710 , as well as a heel element 720 , and/or a lower layer 760 . these items may be provided as explained in other examples. moreover, sole 700 may comprise further items, as described herein, which are not shown in figs. 7a-b for sake of simplicity. sole 700 may comprise one or more openings 761 . openings 761 may be arranged at a bottom surface of lattice structure 710 , e.g. to provide air permeability. openings 761 may be designed as openings in lower layer 760 of lattice structure, but may also be designed differently. sole 700 comprises one or more moveable elements 750 . the movable elements may be arranged, at least partly, at a bottom side of the sole 700 . for example, moveable elements 750 may be provided to cover one or more of openings 761 , when in a first position (cf. fig. 7b ). moveable elements 750 may be moved, e.g. by the wearer, into at least one second position (cf. fig. 7a ), in which these are at least partly removed from one or more of openings 761 . the first position may be within a midfoot region. the moveable elements 750 may be moved by a lever 751 , more generally a moveable control element 751 , which may be moved from a first position into at least one second position such that the moveable elements 750 are brought from the first position to the at least one second position. the moveable control element may be provided at a medial, lateral, front, and/or rear side of sole 700 such that a wearer can conveniently access it. by moving the moveable elements 750 , the breathability of sole 700 may be altered. hence, sole 700 may be repeatedly adjusted by the wearer as needed. it is noted that moveable elements 750 may also be provided without openings 761 . for example, moveable elements may be moved from a first position, in which these cover a larger area into a second position in which cover a smaller area, e.g. they may at least partially overlap in the second position. moreover, other control elements than moveable control element 751 may be provided, e.g. by means of a push-button etc. by means of one or more moveable elements 750 , the breathability of the sole 700 , e.g. at its bottom surface, may be reproducibly altered, for example between two or more levels, or continuously. for example, a breathability in a midfoot region may thus be modified. fig. 8 shows a portion of a further example for a lattice structure 800 that may be used with the aspects disclosed herein. lattice structure 800 comprises a plurality of cell elements and may generally be designed as the lattice structures explained heretofore. it may in particular comprise optional aspects of the lattice structures explained heretofore. fig. 8 specifically serves to illustrate that generally the density of the lattice structure may be varied in different zones of the lattice structure and/or zones of the sole, respectively. lattice structure 800 comprises a zone 820 with an average density that is above that of lattice structure 800 . zone 820 may be arranged adjacent to top surface 802 of lattice structure 800 . optionally, a zone 810 of lattice structure 810 may be provided with an average density that is below an average density of lattice structure 800 , and zone 810 may be arranged adjacent to bottom surface 801 of lattice structure 800 . in other examples zone 810 and/or zone 820 may be arranged differently. in some examples, lattice structure 800 comprises a plurality of layers, and zone 820 may comprise one or more highest layer of lattice structure 800 . optional zone 810 may correspondingly comprise one or more lowest layer of lattice structure 800 . in some examples, zone 820 (and/or optional zone 810 ) may extend essentially along the entire top surface 820 (and/or bottom surface 802 , respectively) of sole 800 . in some examples, zone 820 (and/or optional zone 820 ) is arranged along the perimeter of sole 800 , e.g. circumscribing a heel region of sole 800 or entire sole 800 . zone 820 arranged along the perimeter of sole 800 may help to provide selectively increased stability in this region. for example, when sole 800 is combined with a rim element for attachment to an upper, zone 820 may help to provide a smooth transition between the (typically solid) upper and the (typically) more refined lattice structure 800 . the forces may be gradually guided into the interior as well as lower part of the lattice structure 800 around its perimeter by means of denser, e.g. stronger, zone, such that the risk of breakage is reduced. lattice structure 800 may comprise a plurality of struts, which form a plurality of cell elements. the struts may generally comprise local thickenings at the interconnections of different struts with each other. moreover, the thickness of the struts may vary within lattice structure 800 . the thickness of the struts may generally increase from bottom surface 801 of lattice structure 800 towards top surface 802 of lattice structure 800 . zone 820 may comprise struts with an average thickness that is increased compared to an average strut thickness of lattice structure 800 . optional zone 810 may comprise struts with an average thickness that is reduced compared to an average strut thickness of lattice structure 800 . for example, the average thickness of zone 820 may be increased by 10% to 500%, or by 20% to 400%, or by 30% to 300% with respect to an average thickness of the lattice structure. in other examples, other ranges may be used. the average thickness of zone 810 may be correspondingly reduced. fig. 9 shows a further embodiment of a sole 900 according to the present invention. it may comprise a midsole with a lattice structure 910 , and a heel element, which may all be generally designed as explained heretofore. moreover, sole 900 may comprise an outsole 950 , which may be integrally fabricated together with lattice structure 910 or fabricated separately. sole 900 may further comprise any further items as described herein. specifically, sole 900 may be designed such as to provide a plurality of regions with different functionality. for example, lattice structure 910 may be adapted to provide optimized cushioning properties particularly in a toe region 942 and in region 941 , which comprises a midfoot region and also extends around the periphery of the heel region. lattice structure 910 may moreover be optimized for providing high energy return in a forefoot region 921 as well as in a central heel region 922 . a medial region 930 of lattice structure as well as the heel element three-dimensionally encompassing the heel may be adapted to provide optimized stability of sole 900 . moreover, outsole 950 may be provided such that the traction provided by sole 900 is optimized. in other examples, the various regions may be arranged differently and/or other regions may be provided. lattice structure 910 may be designed differently in various aspects, as explained herein, in different regions, e.g. regions 921 , 922 , 930 , 941 , 942 , such that different properties are provided there. the sole may be optimized as needed in these regions. in particular, different properties may e.g. be provided by cell sites (or corresponding cell elements) with cell disconnections and/or cell vacancies, and/or by using varying geometries of the cell elements at the cell sites
027-463-876-372-142	IN	[ "US" ]	G01S19/17,A61B5/00,A61B5/01,A61B5/02,A61B5/0205,A61B5/11,G01S5/02,G01S19/32	2016-03-15T00:00:00	2016	[ "G01", "A61" ]	monitoring user biometric parameters with nanotechnology in personal locator beacon	a personal locator beacon system has a personal locator beacon and a biometrics monitor. the personal locator beacon includes a first microprocessor, a first global positioning subsystem coupled to the first microprocessor, a first low energy transceiver coupled to the first microprocessor, and a first low energy antennae coupled to the first low energy transceiver. the biometrics monitor includes a second microprocessor, a second low energy transceiver coupled to the second microprocessor, a second low energy antennae coupled to the second low energy transceiver, and one or more nanosensors.	1. a personal locator beacon system comprising: at least one sensor adapted to detect a biometric parameter of a user; and a personal locator beacon communicatively coupled to the at least one sensor and associated with the user, the personal locator beacon configured to receive from the at least one sensor, the biometric parameter, an identifier of the at least one sensor, and at least one of a current geographical location information of the at least one sensor and a third associated time stamp, and a past geographical location information of the at least one sensor and a fourth associated time stamp, second route information for the user, and a second speed of travel for the user, wherein the personal locator beacon comprises: a first global positioning subsystem adapted to generate current geographical location information of the personal locator beacon and a first timestamp associated with the current geographical location information, wherein the first global positioning subsystem comprises a first static memory configured to store at least one of: the current geographical location information and the first time stamp associated with the current geographical location information, past geographical location information and a second time stamp associated with the past geographical location information, first route information for the user, and a first speed of travel for the user; and a second global positioning subsystem adapted to generate the current geographical location information of the at least one sensor, wherein the second global positioning subsystem comprises a second static memory to store the at least one of: the current geographical location information of the at least one sensor and the third time stamp associated with the current geographical location information of the at least one sensor, the past geographical location information of the at least one sensor and the fourth time stamp associated with the past geographical location information of the at least one sensor, the second route information for the user, and the second speed of travel for the user; and wherein the personal locator beacon further comprises a transceiver configured to broadcast, to a communication system associated with a responder, a distress signal comprising the biometric parameter detected by the at least one sensor, the identifier of the at least one sensor and further comprising the current geographical location information and the past geographical location information of the personal locator beacon generated by the first global positioning subsystem, the at least one of the fourth time stamp, the second route information for the user, and the second speed of travel for the user, and at least one of: the first time stamp, the second time stamp, the first route information for the user, and the first speed of travel for the user, wherein the distress signal is broadcasted to determine a geographical location of the user, and facilitate identification of an equipment to aid the user, based on the biometric parameter of the user and the identifier of the at least one sensor. 2. the personal locator beacon system of claim 1 , wherein the personal locator beacon further comprises: a first low energy transceiver; a first low energy antenna, wherein the first low energy transceiver is communicatively coupled to the first low energy antenna; and a first microprocessor communicatively coupled to the first low energy transceiver, and wherein the at least one sensor comprises: a second low energy antenna; a second low energy transceiver; a second microprocessor communicatively coupled to the second low energy transceiver; and wherein the first low energy transceiver, the first low energy antenna, the second low energy transceiver, and the second low energy antennae, are low energy bluetooth components. 3. the personal locator beacon system of claim 2 , wherein the personal locator beacon is communicatively coupled to the at least one sensor through the first low energy transceiver and antenna and the second low energy transceiver and antenna. 4. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises: a bioimpedance sensor configured to measure one or more of a user heart rate, respiration level, or hydration level. 5. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises an optical heart rate sensor. 6. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises a galvanic skin response sensor configured to monitor user sweat levels. 7. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises an accelerometer configured to count user steps or record changes in movement. 8. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises a gyroscope configured to measure orientation of the user. 9. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises a thermometer configured to monitor user body temperature. 10. the personal locator beacon system of claim 1 , wherein the at least one sensor comprises a radiation sensor configured to measure user radiation exposure. 11. the personal locator beacon system of claim 10 , wherein the radiation sensor measures user radiation exposure to ultra-violet, high-energy beta, gamma, x-ray frequencies, or any combinations thereof. 12. the personal locator beacon system of claim 2 , wherein each of the first and second global positioning subsystems comprises: a gps receiver, a gps antenna, and the first static memory and the second static memory communicatively coupled to the first gps receiver and the second gps receiver. 13. the personal locator beacon system of claim 12 , the personal locator beacon comprising a beacon static memory communicatively coupled to the first microprocessor, being configured to receive and store data from the at least one sensor for a period of configurable days. 14. the personal locator beacon system of claim 1 , wherein the at least one sensor is located on a wearable device comprising a glove, a wristband, a necklace, a headband, a hat, smartphone, smartwatch or a chest strap. 15. the personal locator beacon system of claim 1 , wherein the at least one sensor is located on a portable device carriable in a beltpack, backpack, or other external container. 16. a method of monitoring user biometric parameters in a personal locator beacon system, the method comprising: associating a personal locator beacon with a user; coupling the personal locator beacon to a sensor that detects a biometric parameter of the user; determining a first geographical information by a first global positioning subsystem, wherein the first geographical information comprises current geographical location information and past geographical location information of the personal locator beacon; determining a second geographical information by a second global positioning subsystem, wherein the second geographical information comprises current geographical location information and past geographical location information of the sensor; storing at least one of: the first geographical information, the second geographical information, a first time stamp and a second time stamp associated with the current geographical location information and the past geographical location information of the personal locator beacon, respectively, a third time stamp and a fourth time stamp associated with the current geographical location information and the past geographical location information of the sensor, respectively, a route information for the user, and a speed of travel for the user; communicating to the personal locator beacon from the sensor the biometric parameter of the user, an identifier of the sensor, and at least one of; the current geographical location information of the sensor and the third time stamp, and the past geographical location information of the sensor and the fourth time stamp; and broadcasting, to a communication system associated with a responder, from the personal locator beacon, a distress signal comprising the biometric parameter of the user and the identifier of the sensor and further comprising the first geographical information, the at least one of the current geographical location information of the sensor and the third time stamp, and the past geographical location information of the sensor and the fourth time stamp, and least one of: the first time stamp, the second time stamp the route information for the user, and the speed of travel for the user, wherein the distress signal is broadcasted to determine a geographical location of the user, and facilitate identification of an equipment to aid the user, based on the biometric parameter of the user and the identifier of the sensor. 17. the method of claim 16 , wherein each of the personal locator beacon and the sensor comprises the first global positioning system and the second global positioning subsystem respectively, having: a gps receiver, a gps antenna, and a static memory coupled to the gps receiver. 18. the method of claim 16 , wherein the sensor includes at least one of: a bioimpedance sensor configured to measure one or more biometric parameters of the user including, user heart rate, respiration level, or hydration level; an optical heart rate sensor configured to measure a biometric parameter of a user heart rate; a galvanic skin response sensor configured to monitor a biometric parameter of user sweat level; an accelerometer configured to measure a biometric parameter of user steps or changes in user movement; a gyroscope configured to measure a biometric parameter of a user orientation; a thermometer configured to monitor a biometric parameter of user body temperature; a radiation sensor configured to monitor user radiation exposure levels; or any combination thereof. 19. the method of claim 16 , wherein the sensor is located on a wearable device comprising a glove, a wristband, a necklace, a headband, a hat, smartphone, smartwatch, or a chest strap. 20. the method of claim 16 , wherein the personal locator beacon is wirelessly coupled to the sensor using bluetooth low energy. 21. the method of claim 16 , wherein the biometric parameter of the user, the identifier of the sensor and the at least one of the current geographical location information of the sensor and the third time stamp, and the past geographical location information of the sensor and the fourth time stamp, are communicated from the sensor to the personal locator beacon at configured intervals and wherein the configured intervals are event triggered intervals, predetermined fixed intervals: profile based intervals, or any combination thereof. 22. the method of claim 16 , wherein the personal locator beacon is a cospas-sarsat distress beacon or a vehicle-mounted satellite-based communication relay. 23. the method of claim 16 , wherein the distress signal comprises geographical location of the sensor, geographical information of the personal locator beacon, and the biometric parameter of the user. 24. the personal locator beacon system of claim 1 , wherein the biometric parameter of the at least one sensor, the identifier of the at least one sensor, and the at least one of the current geographical location information information of the at least one sensor and the fourth time slam the second route information for the user, and the second speed of travel for the user, are communicated to the personal locator beacon at configured intervals and wherein the configured intervals are event triggered intervals, predetermined fixed intervals, profile based intervals, or any combination thereof.	cross-reference to related application the present application claims the benefit of indian patent application no. 201611009035 for monitoring user biometric parameters with nanotechnology in personal locator beacon filed mar. 15, 2016, which is hereby incorporated by reference in its entirety. field of the invention the invention is generally related to personal locator beacons, and, more specifically, to personal locator beacon systems that monitor user biometric parameters. background personal tracker beacons are devices that track a user's geographic details, such as the user's latitude and longitude, using gps satellite data. these beacons generally have a wireless transmitter that can be activated in life-threatening emergency situations to broadcast the user's geographic location to emergency personnel. the wireless transmitter can broadcast on a number of different frequencies, such as over local cellular networks, legacy analogue signal bands of 121.5 mhz or 243 mhz, or over the internationally designated 406 mhz digital radio-frequency band. the 406 mhz band has been designated an emergency band under the international cospas-sarsat programme, which is an intergovernmental cooperative of 43 countries and agencies that maintains a network of satellites and ground facilities to receive distress signals from 406-mhz beacons and route the alerts to the proper authorities in more than 200 countries and territories. while geographical location information is critical in locating individuals in emergency situations, health data is not provided along with the location data. thus, search and rescue teams responding to an emergency do not know the physical condition of the individual in distress, and must carry a general emergency kit that addresses a wide variety of situations. if the personal tracker beacon was equipped to provide health data on the individual in distress, search and rescue teams could tailor their emergency kits to better address the needs of the individual. summary in an aspect of the invention, a personal locator beacon system comprises: a personal locator beacon comprising a first microprocessor, a first global positioning subsystem coupled to the first microprocessor, a first low energy transceiver coupled to the first microprocessor, and a first low energy antennae coupled to the first low energy transceiver; and a biometrics monitor comprising a second microprocessor, a second low energy transceiver coupled to the second microprocessor, a second low energy antennae coupled to the second low energy transceiver, and one or more nanosensors. in an embodiment, the first low energy transceiver, the first low energy antennae, the second low energy transceiver, and the second low energy antennae are low energy bluetooth components. in an embodiment, the personal locator beacon is communicatively coupled to the biometrics monitor through the first low energy transceiver and antennae and the second low energy transceiver and antennae. in an embodiment, the nanosensor is a bioimpedance sensor configured to measure one or more of a user heart rate, respiration level, or hydration level. in another embodiment, the nanosensor is an optical heart rate sensor. in another embodiment, the nanosensor is a galvanic skin response sensor configured to monitor user sweat levels. in another embodiment, the nanosensor is an accelerometer configured to count user steps or record sudden changes in movement. in yet another embodiment, the nanosensor is a gyroscope configured to measure orientation of a user. in yet another embodiment, the nanosensor is a thermometer configured to monitor user body temperature. in another embodiment, the nanosensor is a radiation sensor configured to measure user radiation exposure. in yet another embodiment, the radiation sensor measures user radiation exposure to ultra-violet, high-energy beta, gamma, x-ray frequencies, or any combination thereof. in an embodiment, the nanosensor comprises a bioimpedance sensor, an optical heart rate sensor, a galvanic skin response sensor, an accelerometer, a gyroscope, a thermometer, ultra-violet radiation sensor, or any combination thereof. in an embodiment, the biometrics monitor comprises a second gps subsystem coupled to the second microprocessor. in another embodiment, each of the first and second gps subsystems comprise: a gps receiver, a gps antenna, and a gps static memory communicatively coupled to the gps receiver and configured to store: positioning information, time stamps associated with the positioning information, route information, speed of travel, or any combination thereof. in an embodiment, the personal locator beacon comprising a beacon static memory communicatively coupled to the first microprocessor, being configured to receive and store nanosensor data for a period of configurable days. in an embodiment, the biometrics monitor is a wearable device comprising a glove, a wristband, a necklace, a headband, a hat, smartphone, smartwatch or a chest strap. in an embodiment, the biometrics monitor is a portable device carryable in a beltpack, backpack, or other external container. in another aspect of the invention, a method of monitoring user biometric parameters in a personal locator beacon system, comprises: providing a personal locator beacon wirelessly coupled to a wearable biometrics monitor comprising one or more nanosensors; detecting a user biometric parameter of a user by the nanosensor; communicating the user biometric parameter from the biometric monitor to the personal locator beacon; and broadcasting from the personal locator beacon a distress signal comprising geographical location information and the user biometric parameter. in an embodiment, the personal locator beacon comprises a gps subsystem having: a gps receiver, a gps antenna, and a static memory coupled to the gps receiver and configured to store positioning information and associated time stamps. in another embodiment, the nanosensor comprises: a bioimpedance sensor configured to measure one or more user biometric parameters of a user heart rate, respiration level, or hydration level; an optical heart rate sensor configured to measure a user biometric parameter of a user heart rate; a galvanic skin response sensor configured to monitor a user biometric parameter of user sweat level; an accelerometer configured to measure a user biometric parameter of user steps or sudden changes in user movement; a gyroscope configured to measure a user biometric parameter of a user orientation; a thermometer configured to monitor a user biometric parameter of user body temperature; a radiation sensor configured to monitor user radiation exposure levels; or any combination thereof. in another embodiment, the biometric monitor is a wearable device comprising a glove, a wristband, a necklace, a headband, a hat, smartphone, smartwatch, or a chest strap. in an embodiment, the personal locator beacon is wirelessly coupled to the wearable biometric monitor using bluetooth low energy. in an embodiment, the user biometric parameters from the biometric monitor are communicated to the personal locator beacon at configured intervals. in another embodiment, the configured intervals are event triggered intervals, predetermined fixed intervals, profile based intervals, or any combination thereof. in an embodiment, the personal locator beacon is a cospas-sarsat distress beacon or a vehicle satcom relay. brief description of the drawings the invention will now be described by way of example, with reference to that accompanying figures, of which: fig. 1 is a perspective view of a personal locator beacon system; fig. 2 is a schematic diagram of the personal locator beacon; fig. 3 is a schematic diagram of the biometrics monitor; fig. 4 is a perspective view of a biometrics monitor; and fig. 5 is a flow diagram of a method of monitoring biometrics parameters in the personal locator beacon system. detailed description all cospas-sarsat beacons are subject to the same radio-frequency specifications, but the beacons can be fashioned into a variety of mechanical structures. additionally, the beacons can have a variety of disparate activation methods, the details of which are often tailored to different applications, and named accordingly: a) emergency position indicating radio beacon (“epirb”) for marine use; b) emergency locator transmitter (“elt”) for aviation use; and c) personal locator beacon (“plb”) for personal and/or terrestrial use. for the purpose of this invention, the term “plb” will be generally used, along with “locator beacon”, or “beacon”. thus, “plb” should not be interpreted in a restricted sense unless expressly stated, and will be understood to refer to any type of radio locator beacon (not necessarily restricted only to “personal”). in an embodiment shown in fig. 1 , a personal locator beacon system 1 includes a personal locator beacon 100 and biometrics monitor 200 . in an embodiment shown in fig. 2 , the personal locator beacon 100 includes a housing 110 having one or more of a radio frequency transmitter 115 , signal transmitting circuit 120 , first radio frequency antenna 125 , first microprocessor 130 , first memory 145 , power supply 150 , first global positioning system (“gps”) subsystem 160 , first low energy transceiver 165 , and a first low energy antenna 170 . as shown in the embodiment of fig. 2 , the housing 110 houses the various components of the personal locator beacon 100 , and can be any variety of shapes or sizes, depending on the application (e.g. a user worn, vehicle mounted, etc.). the housing 110 can be made of a thermoset or thermoplastic material, metal, composite material, or any combination thereof. the radio frequency transmitter 115 is electrically connected to the first radio frequency antenna 125 and the signal transmitting circuit 120 . the signal transmitting circuit 120 is electrically connected to the first microprocessor 130 . the first microprocessor 130 sends radio transmission instructions to the radio frequency transmitter 115 via the signal transmitting circuit 120 . the radio frequency transmitter 115 sends signals to the first radio frequency antenna 125 to be transmitted by the first radio frequency antenna 125 on domestic or internationally recognized radio-frequency distress bands. in an embodiment, the first radio frequency antenna 125 transmits signals at approximately 406 mhz. in another embodiment, the first radio frequency antenna 125 transmits signals at approximately 121.5 mhz. in another embodiment, the first radio frequency antenna 125 transmits signals at approximately 243 mhz. in another embodiment, the first radio frequency antenna 125 transmits signals at a frequency corresponding to local cellular phone networks, such as 700 mhz, 800 mhz, 850 mhz, 1700 mhz, 1900 mhz, or any other commonly used cellular phone frequencies used by cellular phone networks. in an embodiment (not shown), the personal locator beacon 100 includes one or more microprocessors 130 connected to transmitting signal circuit. those of ordinary skill in the art would appreciate that in an embodiment, the radio frequency transmitter 115 can transmit on two or more of the above described frequency bands. in an embodiment, the radio frequency transmitter 115 is a transceiver. in an embodiment shown in fig. 2 , first memory 145 can include volatile memory (e.g. ram) 140 a and non-volatile memory 135 a (e.g. rom) electrically connected to first microprocessor 130 . personal locator beacon 100 can include—or have access to a computing environment that includes—a variety of computer-readable media, such as the volatile memory 140 a and non-volatile memory 135 a , a removable storage 175 , and non-removable storage 180 . first memory 145 storage includes the random access memory (ram) 140 and read only memory (rom) 135 , as well as erasable programmable read-only memory (eprom), electrically erasable programmable read-only memory (eeprom), flash memory or other memory technologies, compact disc read-only memory (cd rom), digital versatile disks (dvd) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium capable of storing computer-readable instructions. personal locator beacon 100 can include or have access to a computing environment that includes input 185 and/or output 190 . output 190 can include a display device, such as a touchscreen, that also can serve as an input device. the input 185 can include one or more of a touchscreen, touchpad, mouse, keyboard, camera, one or more device-specific buttons, one or more sensors integrated within or coupled via wired or wireless data connections to the personal locator beacon 100 , and other input devices. computer-readable instructions are stored on a computer-readable medium, such as the first memory 145 , and are executable by the first microprocessor 130 . in an embodiment shown in fig. 2 , a power supply 150 provides power to the components of the personal locator beacon 100 . an example of the power supply 150 is a battery, although other sources of power could also provide the requisite power to the components of the personal locator beacon 100 . in an embodiment shown in fig. 2 , the first gps subsystem 160 includes a gps receiver 161 , gps antenna 162 , and a gps static memory 163 . the gps receiver 161 is electrically connected to the first microprocessor 130 , gps antenna 162 , and gps static memory 163 . the gps receiver 161 receives and processes signals from positional satellites via the gps antenna 162 . generally, the processed signals are positioning information and associated time stamps. in turn, the gps receiver 161 sends the processed signals to the gps static memory 163 , which stores current and/or past positioning information and associated time stamps. the gps static memory 163 is electrically connected to the first microprocessor 130 , and the stored current and/or past positioning information and associated time stamps can be accessed by the first microprocessor 130 , which in turn, can send this information for storage in memory 135 , 140 , 145 , and/or can be sent to signal transmitting circuit 120 upon plb 100 activation. additionally, in an embodiment the gps static memory 163 can store route information and speed of travel for a user based on the current and past positioning information and associated time stamps, and this information can also be accessed by the first microprocessor 130 as shown in the embodiment of fig. 2 , the first low energy transceiver 165 is electrically connected to the first low energy antenna 170 and to the first microprocessor 130 . in an embodiment the first low energy transceiver 165 and first low energy antenna 170 are low energy bluetooth components. the first low energy transceiver 165 receives signals detected by the first low energy antenna 170 and sends the signals to the first microprocessor 130 . additionally the first low energy transceiver 165 receives signals from the first microprocessor 130 , and broadcasts those signals via the first low energy antenna 170 . in an embodiment shown in fig. 3 , the biometrics monitor 200 is a user-wearable device that includes a second microprocessor 205 , second memory 210 , wireless communication system 220 , and one or more nanosensors 230 . the biometrics monitor 200 can be fashioned in many forms, including a glove, wristband, necklace, headband, hat, chest strap, or any other wearable device. in an embodiment, the biometrics monitor 200 is a smartphone, smartwatch, or fitness band having a one or more biometric nanosensors 230 . the term biometric nanosensor referred to herein is any biometric sensor sufficiently small in size and weight to be suitable for personal use. by way of non-limiting example, biometric nanosensors can include, but are not limited to, biometric sensors positioned in devices that can be carried in a backpack, beltpack/fannypack, or similar user-carryable housing; biometric sensors in wearable devices, as discussed further herein; and biometric sensors that may be injected, implanted, or otherwise carried inside the body. in addition, the biometric nanosensors can be contained in or associated with devices having significant functionality in addition to monitoring or measurement of biometrics, such as smartphones, smartwatches, or in devices whose primary or sole functionality consists of monitoring or measurement of biometrics, such as commercially available fitness bands. the second microprocessor 205 is electrically connected to the second memory 210 , wireless communication system 220 , and to one or more of the nanosensors 230 . the second microprocessor 205 is substantially similar in function and structure to the first microprocessor 130 , and the second memory 210 is substantially similar to the first memory 145 . in an embodiment shown in fig. 3 , second memory 210 can include volatile memory (e.g. ram) 140 b and non-volatile memory 135 b (e.g. rom) electrically connected to second microprocessor 205 . biometrics monitor 200 can include—or have access to a computing environment that includes—a variety of computer-readable media, such as the volatile memory 140 b and non-volatile memory 135 b , a removable storage 260 , and non-removable storage 265 . second memory 210 storage includes the random access memory (ram) 140 b and read only memory (rom) 135 b , as well as erasable programmable read-only memory (eprom), electrically erasable programmable read-only memory (eeprom), flash memory (e.g. solid state drives), or other memory technologies, biometrics monitor 200 can include or have access to a computing environment that includes input 250 and/or output 255 . output 255 can include a display device, such as a touchscreen, that also can serve as an input device. the input 250 can include one or more of a touchscreen, touchpad, mouse, keyboard, camera, one or more device-specific buttons, one or more sensors integrated within or coupled via wired or wireless data connections to the biometrics monitor 200 , and other input devices. computer-readable instructions are stored on a computer-readable medium such as the second memory 210 , and are executable by the second microprocessor 205 . the wireless communication system 220 includes a second low energy (le) transceiver 221 communicatively coupled to the second microprocessor 205 , and a second low energy (le) antenna 223 electrically coupled to the second low energy (le) transceiver 221 . in an embodiment, the second low energy transceiver 221 and second low energy antenna 223 are low energy bluetooth components. the second low energy transceiver 221 receives signals from the second low energy antenna 223 and sends the signals to the second microprocessor 205 . additionally the second low energy transceiver 221 receives signals from the second microprocessor 205 , and broadcasts those signals using the second low energy antenna 223 . as shown in fig. 4 , the nanosensor 230 is a biometric reading device. in an embodiment, the nanosensor 230 can be one or more of a bioimpedance sensor 230 a , an optical heart rate sensor 230 b , a galvanic skin response sensor 230 c , an accelerometer 230 d , a gyroscope 230 e , a thermometer 230 f , radiation sensor 230 g , or any combination thereof. in an embodiment, the bioimpedance sensor 230 a is configured to measure one or more of a user heart rate, respiration level, or hydration level. in an embodiment, the optical heart rate sensor 230 b measure user heart rate by using a light sensor that detects minor fluctuations in the user's capillaries. in an embodiment, the galvanic skin response sensor 230 c is configured to monitor user sweat levels by measuring electrical conductance of the user's skin. in an embodiment, the accelerometer 230 d is configured to count user steps or record sudden changes in movement. in an embodiment, the gyroscope 230 e is configured to measure orientation of a user. in an embodiment, thermometer 230 f is configured to monitor user body temperature. in an embodiment, the radiation sensor 230 g is a radiation dosimeter configured to monitor levels of user ultra-violet (uv), high-energy beta, gamma, and/or x-ray radiation exposure. each nanosensor 230 a - g is electrically connected to the second microprocessor 205 , and each sends biometric information to the microprocessor 205 . the microprocessor 205 can store the biometric information in the second memory 210 , and/or send the biometric information to the wireless communication system 220 . in an embodiment, the biometrics monitor 200 includes a second gps subsystem 240 . similar to the first gps subsystem 160 , the second gps subsystem 240 includes a gps receiver 241 , gps antenna 242 , and a gps static memory 243 . the gps receiver 241 is electrically connected to the second microprocessor 205 , gps antenna 242 , and gps static memory 243 . the gps antenna 242 receives signals from global positioning satellites, which in turn, are then sent to the gps receiver 241 . the gps receiver 241 sends the signals to the gps static memory 243 , which stores current and/or past positioning information and associated time stamps. the gps receiver 241 can transmit this current and/or past positioning information and associated time stamps to the second microprocessor 205 , which in turn, can send this information to be stored in the second memory 210 , and/or can be sent to second low energy transceiver 221 upon plb 100 activation. additionally, in an embodiment the gps static memory 243 can store route information and speed of travel for a user based on the current and past positioning information and associated time stamps, and this information can also be accessed by the second microprocessor 205 . as shown in the embodiment of fig. 1 , the personal locator beacon 100 is communicatively coupled to the biometrics monitor 200 . in an embodiment, the personal locator beacon 100 is communicatively coupled to the biometrics monitor 200 through the first low energy transceiver 165 and first low energy antennae 170 , and the second low energy transceiver 221 and second low energy antennae 223 . the biometric monitor 200 sends biometric parameters collected from the nanosensors 230 a - g to the personal locator beacon 100 using low energy bluetooth signals at configured intervals. the configured intervals can be an event triggered intervals (e.g. activation of personal locator beacon 100 to broadcast distress signal 11 ), predetermined fixed intervals (e.g. user configured times), profile based intervals (e.g. schedule or activity specific times), or any combination thereof. in an embodiment, the biometrics monitor 200 sends user geographical information collected from the second gps subsystem 240 to the personal locator beacon 100 , either individually, or in combination with the biometric parameters collected from the nanosensors 230 a - g . the user geographical information can be sent to the personal locator beacon 100 at the configured intervals. in an embodiment, the biometrics monitor 200 can include an identification serial number unique to the biometric monitor 200 . the identification serial number can be sent to the personal locator beacon 100 at the same or different time the biometric parameters and/or user geographical information is sent from the biometric monitor 200 to the personal locator beacon 100 . in an embodiment, the personal locator beacon system 1 can included two or more biometrics monitors 200 , each of which can be worn by a different user. each biometrics monitor 200 would include an identification serial number unique to that biometric monitor 100 , and each of the biometric monitors 200 can send its identification serial number to the personal locator beacon 100 at the same or different time the biometric parameters and/or user geographical information is sent from each biometric monitor 200 to the personal locator beacon 100 . as generally shown in the embodiment of fig. 1 , when the personal locator beacon 100 has been activated to broadcast a distress signal 11 using the radio frequency transmitter 115 via the first radio frequency antenna 125 , the distress signal includes geographical coordinates determined by the first gps subsystem 160 . in another embodiment, the distress signal 11 would include both the geographical coordinates from the first gps subsystem 160 and biometric parameters received from one or more nanosensors 230 . in another embodiment, the distress signal 11 would include the geographical coordinates from the first gps subsystem 160 and the user geographical coordinates received from the second gps subsystem 240 . in yet another embodiment, the distress signal 11 would include the geographical coordinates from the first gps subsystem 160 , the user geographical coordinates received from the second gps subsystem 240 , and the biometric parameters received from one or more nanosensors 230 . in another embodiment, the distress signal 11 can include geographical coordinates from the first gps subsystem 160 , user geographical coordinates received from the second gps subsystem 240 , biometric parameters received from one or more nanosensors 230 , identification serial number of the biometric monitor 200 , or any combination thereof. thus, as generally shown in the embodiment of fig. 1 , the biometrics monitor 200 broadcasts a biometrics containing signal 12 to the personal locator beacon 100 . the personal locator beacon 100 in turn, broadcasts the distress signal 11 which is detected by either ground-based or satellite-based communication systems 13 . these communication systems 13 then relay 14 the information contained in the distress signal 11 to the appropriate emergency responders 15 . by including additional geographical and biometric parameter information in the distress signal 11 , emergency responders 15 will be alerted to both the exact geographical location of the user, as well as the general health condition of the user before embarking on the rescue mission. thus, it is possible for the emergency responders 15 to gear up with emergency equipment that fits the user's situation. in an embodiment shown in fig. 5 , a method 300 of monitoring biometrics parameters in the personal locator beacon system 1 comprises providing a personal locator beacon 100 wirelessly coupled to a wearable biometrics monitor 200 having one or more nanosensors 230 at block 305 ; detecting a user biometric parameter by the nanosensor 230 at block 310 ; communicating user biometric parameter from the biometric monitor 200 to the personal locator beacon 100 at block 315 ; and broadcasting from the personal locator beacon 100 a distress signal 11 comprising geographical location information and the user biometric parameter at block 320 . in an embodiment, the biometric parameters from the biometric monitor are communicated to the personal locator beacon 100 at configured intervals. the configured intervals can be event triggered intervals (e.g. when the personal locator beacon is manually or automatically activated), predetermined fixed intervals set by the 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without departing from the spirit and scope of the underlying inventive concept and that the same is not limited to the particular forms herein shown and described except insofar as indicated by the scope of the appended claims.
027-736-986-537-201	US	[ "US" ]	H01F6/00,H01L39/14	1986-01-29T00:00:00	1986	[ "H01" ]	process of producing superconducting bar magnets	a bar magnet is provided comprising a billet of superconducting material in a superconducting condition and having an established magnetic field. the bar magnet is formed by exposing the billet of superconducting material to a magnetic field of the desired extent and shape while the superconducting material is above its critical temperature. while being exposed to the magnetic field, the billet of superconducting material is lowered to its critical temperature so as to stabilize the intensity and pattern of the field. the magnetic field is them removed from the billet of material and the billet maintained at or below the critical temperature.	1. a method of forming a magnet having an established magnetic field comprising; (1) establishing a magnetic field of the desired extent and shape; (2) providing a superconducting material of desired shape; (3) positioning the material of (2) in field (1) while at a temperature above the critical temperature of the superconducting material so as to apply a magnetic field on the superconducting material; (4) cooling the superconducting material while in magnetic field (1) to below the critical temperature of the superconducting material; (5) removing the superconducting material from the magnetic field while in the supercooled condition; and (6) maintaining the material at or below the critical temperature. 2. the method of claim 1 wherein the magnet is a bar magnet. 3. the method of claim 1 wherein said magnet is a coil magnet. 4. the method of claim 1 wherein the intensity of said magnetic field is zero. 5. the method of claim 1 wherein said superconducting material is an alloy. 6. the method of claim 1 wherein said superconducting material is maintained at or below the critical temperature with liquid helium.	field of invention this invention relates to magnets. more particularly, this invention relates to magnets, such as a bar magnet, comprising a superconducting material maintained under superconducting conditions. background and prior art magnets and the concept of magnetism have been known since ancient times. faraday, in the 1830's, demonstrated the relationship between an electric charge and magnetism. when an electric charge moves, it is said to constitute an electric current. when an electric current flows, it generates a magnetic field in the space around it just as if the current system had been replaced by a magnet system with a particular shape. it takes a force, called an electromotive force (emf), analogous to the pressure needed to cause water to flow in a pipe to make a charge move and, thus, produce an electric current. faraday established that when an object capable of conducting electric current was moved through a magnetic field an emf was set up in the conductor capable of producing electric current. he also demonstrated that when the magnetic field which "threaded" a conducting object was changed, an emf was also produced. accordingly, electricity produces magnetism and magnetism produces electricity. faraday also recognized the concept that magnetism exists only in a closed loop. it can be shown that the driving force, called the magnetomotive force (mmf), in a magnetic circuit of an electromagnet, analogous to emf in an electric circuit, is proportional both to the number of turns which form the coil and the current in that coil. a recognition of the relationship between magnetism and electricity has permitted the formation of electromagnets of varying strength and capacity by winding coils onto a core material. the advent of new technologies utilizing magnets has increased the need for magnets having greater field uniformity and stability. for example, nuclear magnetic resonance, normally referred to as nmr, a technique discovered in 1945 for measuring the magnetic properties of individual atomic nuclei has become widely used in chemical analysis to determine structures of molecules. although nmr technology was originally used primarily as a tool to the chemist for determining the structure of new compounds, particularly in the pharmaceutical industry and in university research laboratories, the technique is now being applied to a much broader spectrum, including to the study of biological problems and in medical research such as in the detection of cancer in tissue. in an nmr system it is essential to have magnets which have a magnetic field of high uniformity and known and well-defined pattern. by having a magnetic field of high uniformity and known and well-defined pattern, it is possible to pick up signals from the atomic nuclei being acted upon, and then have that signal analyzed and recorded. electron magnetic resonance (emr) has also provided a need for improved magnets. the term magnetic resonance (mr) embraces both nmr and emr. in the prior art fabrication of the magnets for mr application, precision wound coils are produced under the guidance of very slow computer controlled coil winders. after fabrication, the coils are carefully tweaked and adjusted to maximize uniformity. in operation they are accompanied by a relay rack full of electronics requiring constant attention to maintain field uniformity. furthermore, the only fields allowing theoretical description are free space fields, and as a result the current designs all use fields that extend far beyond the magnet system. the fields external to the system are disturbed by magnetic objects. movement of such objects contributes to the frequent need for readjustment. accordingly, there is a need for magnets having a magnetic field of high uniformity and stability for use in mr and the like systems which are relatively inexpensive and which can be more rapidly fabricated. objects and general description of invention it is a primary object of the present invention to provide a superconducting magnetic system which is relatively inexpensive. it is another object of the present invention to provide a superconducting bar magnet which has good field uniformity and stability, and wherein the magnetic field is substantially coextensive with the magnet. it is another object of the present invention to provide a method for producing a bar magnet having a magnetic field of high uniformity and good stability. these and other objects of the present invention will be apparent from the following general description and from the presently preferred embodiment as illustrated in the drawing. the objects of the present invention are accomplished by establishing a magnetic field of predetermined extent and shape; providing a superconducting material of desired shape; positioning the superconducting material in the established magnetic field while at a temperature above the critical temperature of the superconducting material so as to apply the predetermined magnetic field on the superconducting material; cooling the superconducting material while in the magnetic field to a temperature below the critical temperature of the superconducting material; removing the superconducting material from the magnetic field while in the supercooled condition, and maintaining the material at or below the critical temperature to provide a bar magnet comprising the superconducting material in a superconducting condition and having an established magnetic field. a bar magnet as used herein defines any magnet not relying on coils to create a magnetic field. the establishing of, and the established magnetic field includes no magnetic field, as will be described more fully hereinafter. flux, as used herein, means the flow or density of magnetic lines. the objects of the present invention are possible as a result of the phenomenon of superconductivity and the recognition that if the temperature of a superconducting material is lowered to its critical temperature the material loses its ability to change the internal magnetic field, i.e., becomes magnetostatic. stated in another way, a magnetic field present in a superconductive material when it achieves the superconducting state will remain fixed in the superconducting material as long as the material is retained in the superconducting state. the phenomenon of superconductivity occurs at very low temperatures, within about 25 degrees of the absolute zero. it is characterized by the complete loss of electrical resistance in the material at a certain critical temperature known as the transition temperature, t.sub.c. above this temperature, superconductors behave in a similar way to other metals and are said to be in the normal state; and below it, they are in the superconducting state. once the temperature has been reduced below t.sub.c, electrical currents can be passed through the material without the generation of heat because the resistance is zero. this means that superconducting materials can transmit large amounts of energy without the losses which would occur in conventional conductors such as copper. the critical temperature of a superconducting material is decreased in the presence of a strong magnetic field. the bar magnets of the present invention can be made up of any of the superconducting materials, including elements and alloys which have superconducting properties. a large, but not an exhaustive listing of superconducting materials is set forth in "superconductivity," crc handbook of chemistry and physics, college edition, 49th edition 1968-1969, the chemical rubber co., cleveland, ohio, at pages e-81 through e-96. the aforesaid disclosure is incorporated herein by reference. representative and useful superconducting materials are aluminum, tin, titanium, cadmium and ruthenium; as well as alloys of aluminum and tin, and aluminum and zinc. the known superconducting materials have transition temperatures up to 23.degree. k. (-250.degree. c.). the superconducting materials having high critical temperatures and critical fields are preferred in that if the critical temperatures and critical fields are too low, they are driven normal by relatively small currents. the aforesaid characteristics are known in the art and form no part of the present invention. the drawing and presently preferred embodiment a presently preferred embodiment will be described in reference to the drawing wherein - fig. 1 is a diagrammatic view of a billet of superconducting material in a predetermined magnetic field; fig. 2 is a perspective view of a billet of superconducting material having a hole longitudinally directed through the material, fig. 3 is a diagrammatic view of the end of the billet of material of fig. 2 positioned in a magnetic field; fig. 4 is a diagrammatic end view of the superconducting bar magnet diagrammatically illustrating the magnetic field; fig. 5 is a diagrammatic side view of the billet of material of fig. 2 diagrammatically illustrating the end effects of the billet; fig. 6 is a perspective view of a cylindrical billet of superconducting material exposed to a plurality of magnetic fields; fig. 7 is an end view of the billet of fig. 6 after the magnetic fields have been applied and the material lowered to its supercritical temperature; fig. 8 is the end view of a plurality of superconducting bars configured for utilization in magnetic field piping; and fig. 9 is the plurality of magnetic bars of fig. 8 positioned so as to provide a superconducting magnet with essentially no external field, except for end effects, and having two sample chambers. as shown in fig. 1, a billet 10 of superconducting material which is an alloy of aluminum (al), niobium (nb), and tin (sn) having a longitudinally extending hole 12 is positioned in the center of a magnetic field 20 created by a generating copper coil 22. the intensity of the field is controlled by the heat applied through heating element 24 and current source 26. the shape of the field is diagrammatically illustrated at 28. as shown in fig. 2, the superconducting billet 10 has a hole 12 extending longitudinally through the material. it is recognized that in an enclosed volume the magnetic field within the volume is determined by the intensity and direction of the field at the surface of the volume. in the case of a partially enclosed volume, the same condition is true except for the effect of the opening, i.e., such as end effects, as will be considered hereinafter. in an nmr system, the sample to be analyzed can be positioned in the hole as is conventionally done. in accordance with the present invention, a magnetic field 28 of the desired extent and shape is formed utilizing conventional means such as the generating copper coil 22 as shown in fig. 1. the established field can also be no magnetic field. after the magnetic field of the desired extent and shape is established, the billet 10 is placed in the field as shown in figs. 1 and 3 above the critical temperature of the superconducting material in order to impart to the magnetic material a corresponding magnetic field. the shape of the field is defined by the coil, or coils, prior to cooling of the billet. thereafter, while the billet is in the magnetic field the temperature is lowered below the critical temperature of the superconducting material. this stabilizes the intensity and pattern of the magnetic field. after the billet is cooled to superconducting temperature within the magnetic field, the magnetic field is removed and the billet retained at superconducting conditions. as long as the billet is maintained at the critical temperature--i.e., in a superconducting condition, the magnetic field will be uniformly maintained in its stabilized condition. the magnet can be maintained in superconducting conditions in a known manner, such as with liquid helium. as shown in fig. 4, the only lack of uniformity within the field 28 is a result of the end effect as diagrammatically shown in fig. 5 at 30. the end effect can be minimized by having hole 12 of a diameter no more than about one-tenth of the length of the billet. at times it may be desirable to use a plurality of bar magnets having complementary shapes in order to obtain a magnet having the desired magnetic field shape. thus, where it is not possible to obtain the desired magnetic field shape using conventional techniques, it can be desirable to form a plurality of magnets in complementary shapes and piece the complementary shapes together to provide a bar magnet having the desired magnetic field shape. the magnetic field can be maintained substantially within a magnet in accordance with the present invention by utilizing a piping technique. as shown in fig. 8, billets 14 and 16 which complement each other are formed, each having a longitudinally extending hole 12 as shown in fig. 8. additionally, end pieces 18 and 18a are formed. after the materials are subjected to a magnetic field as above described, the elements are placed together as shown in fig. 9. as is apparent, one bar of superconducting alloy can be used for each direction the field is to be carried--in the instance shown, four directions. when the materials are placed as shown in fig. 9, the external field is almost completely eliminated. this will provide a magnet which can be retained in a relatively small area. since there is no free magnetic field, the magnet will not be influenced by external objects which may come near the magnet. field piping can also be accomplished with hollow tubes of a superconducting material. as set forth hereinbefore, according to the present invention it is possible to make the "bar magnet" in the absence of a magnetic field. when the superconducting material is lowered below its critical temperature, it will have no magnetic field at all. effectively, the bar magnet will serve as a magnetic insulator similar to an insulator for electrical current. the insulator can be used to block magnetic effects as well as have various other applications where it is desired to completely eliminate a magnetic field. the concept and the bar magnets of the present invention have applications other than as a magnet for an mr system. they can be used in virtually any application of conventional magnets and where it is possible to maintain the magnets at or below the critical temperature. for example by providing a plurality of magnetic fields 40 as around a cylindrical element as shown in fig. 8, a cylindrical magnet 42 can be formed as shown in fig. 7. this magnet having a plurality of magnetic fields can be used as an electric motor and the like. as will be apparent to one skilled in the art, various modifications can be made within the scope of the aforesaid description. such modifications such as size, shape, and intensity of field being within the ability of one skilled in the art form a part of the present invention and are embraced by the appended claims.
028-399-486-203-151	US	[ "US" ]	H01L51/00,C07D487/04,C07D519/00,C09K11/02,C09K11/06,H01L51/50,H01L51/52	2017-09-11T00:00:00	2017	[ "H01", "C07", "C09" ]	organic electroluminescent materials and devices	an oled incorporating a first emitting compound in its emissive layer is disclosed. the first emitting compound has the formula g 1 -z, formula i, where g 1 is an electron acceptor group; and z is an electron donor group, where z has the formula: formula ii; wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring.	1 . a first device comprising a first organic light emitting device, the first oled comprising: an anode; a cathode; and an emissive layer, disposed between the anode and the cathode; wherein the emissive layer comprises a first emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring. 2 . the first device of claim 1 , wherein g 1 comprises at least one chemical group selected from the group consisting of: wherein a 1 to a 6 independently comprise c or n, and at least one of a 1 to a 6 is n; wherein j 1 to j 4 independently comprise c or n, and at least one of j 1 to j 4 is n; wherein x 1 is o, s, or nr; and wherein r is selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. 3 . the first device of claim 1 , wherein g 1 comprises at least one chemical group selected from the group consisting of: wherein e 1 to e 8 independently comprise c or n; wherein l 1 to l 4 independently comprise c or n; wherein x 2 is o, s, or nr; and wherein r is selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. 4 . the first device of claim 1 , wherein z comprises a least one chemical group selected from the group consisting of: 5 . the first device of claim 1 , wherein g 1 comprises at least one chemical group selected from the group consisting of: wherein r 21 , r 22 , and r 23 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. 6 . the first device of claim 1 , wherein g 1 comprises at least one chemical group selected from the group consisting of: 7 . the first device of claim 1 , wherein g 1 comprises at least one chemical group selected from the group consisting of: 8 . the first device of claim 1 , wherein the compound is selected from the group consisting of: 9 . the first device of claim 1 , wherein the first device emits a luminescent radiation at room temperature when a voltage is applied across the first organic light emitting device; wherein the luminescent radiation comprises a delayed fluorescent process. 10 . the first device of claim 9 , wherein the emissive layer further comprises a first phosphorescent emitting material. 11 . the first device of claim 10 , wherein the emissive layer further comprises a second phosphorescent emitting material. 12 . the first device of claim 1 , wherein the emissive layer further comprises a host material. 13 . the first device of claim 10 , wherein the first device emits a white light at room temperature when a voltage is applied across the organic light emitting device. 14 . the first device of claim 13 , wherein the first emitting compound emits a blue light having a peak wavelength between about 400 nm to about 500 nm. 15 . the first device of claim 13 , wherein the first emitting compound emits a yellow light having a peak wavelength between about 530 nm to about 580 nm. 16 . the first device of claim 1 , wherein the first device comprises a second organic light-emitting device. 17 . the first device of claim 16 , wherein the second organic light emitting device is stacked on the first organic light emitting device. 18 . a consumer product comprising a first device comprising a first organic light emitting device, wherein the first organic light emitting device comprising: an anode; a cathode; and an emissive layer, disposed between the anode and the cathode; wherein the emissive layer comprises a first emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring. 19 . the consumer product of claim 18 , wherein the consumer product is selected from the group consisting of flat panel displays, computer monitors, medical monitors, televisions, billboards, lights for interior or exterior illumination and/or signaling, heads-up displays, fully or partially transparent displays, flexible displays, laser printers, telephones, mobile phones, tablets, phablets, personal digital assistants (pdas), wearable devices, laptop computers, digital cameras, camcorders, viewfinders, micro-displays, 3-d displays, virtual reality or augmented reality displays, vehicles, video walls comprising multiple displays tiled together, theater or stadium screen, and a sign. 20 . an emissive region in an organic light emitting device, the emissive region comprising an emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring.	field the present disclosure relates to compounds for use as phosphorescent emitters or hosts for organic electroluminescent devices, such as organic light emitting diodes (oleds). more specifically, this disclosure presents new organic compounds comprising benzimidazo[1,2-a]benzimidazole moieties are disclosed to improving device performance of oled devices. background opto-electronic devices that make use of organic materials are becoming increasingly desirable for a number of reasons. many of the materials used to make such devices are relatively inexpensive, so organic opto-electronic devices have the potential for cost advantages over inorganic devices. in addition, the inherent properties of organic materials, such as their flexibility, may make them well suited for particular applications such as fabrication on a flexible substrate. examples of organic opto-electronic devices include organic light emitting diodes/devices (oleds), organic phototransistors, organic photovoltaic cells, and organic photodetectors. for oleds, the organic materials may have performance advantages over conventional materials. for example, the wavelength at which an organic emissive layer emits light may generally be readily tuned with appropriate dopants. oleds make use of thin organic films that emit light when voltage is applied across the device. oleds are becoming an increasingly interesting technology for use in applications such as flat panel displays, illumination, and backlighting. several oled materials and configurations are described in u.s. pat. nos. 5,844,363, 6,303,238, and 5,707,745, which are incorporated herein by reference in their entirety. one application for phosphorescent emissive molecules is a full color display. industry standards for such a display call for pixels adapted to emit particular colors, referred to as “saturated” colors. in particular, these standards call for saturated red, green, and blue pixels. alternatively the oled can be designed to emit white light. in conventional liquid crystal displays emission from a white backlight is filtered using absorption filters to produce red, green and blue emission. the same technique can also be used with oleds. the white oled can be either a single eml device or a stack structure. color may be measured using cie coordinates, which are well known to the art. one example of a green emissive molecule is tris(2-phenylpyridine) iridium, denoted ir(ppy) 3 , which has the following structure: in this, and later figures herein, we depict the dative bond from nitrogen to metal (here, ir) as a straight line. as used herein, the term “organic” includes polymeric materials as well as small molecule organic materials that may be used to fabricate organic opto-electronic devices. “small molecule” refers to any organic material that is not a polymer, and “small molecules” may actually be quite large small molecules may include repeat units in some circumstances. for example, using a long chain alkyl group as a substituent does not remove a molecule from the “small molecule” class. small molecules may also be incorporated into polymers, for example as a pendent group on a polymer backbone or as a part of the backbone small molecules may also serve as the core moiety of a dendrimer, which consists of a series of chemical shells built on the core moiety. the core moiety of a dendrimer may be a fluorescent or phosphorescent small molecule emitter. a dendrimer may be a “small molecule” and it is believed that all dendrimers currently used in the field of oleds are small molecules. as used herein, “top” means furthest away from the substrate, while “bottom” means closest to the substrate. where a first layer is described as “disposed over” a second layer, the first layer is disposed further away from substrate. there may be other layers between the first and second layer, unless it is specified that the first layer is “in contact with” the second layer. for example, a cathode may be described as “disposed over” an anode, even though there are various organic layers in between. as used herein, “solution processible” means capable of being dissolved, dispersed, or transported in and/or deposited from a liquid medium, either in solution or suspension form. a ligand may be referred to as “photoactive” when it is believed that the ligand directly contributes to the photoactive properties of an emissive material. a ligand may be referred to as “ancillary” when it is believed that the ligand does not contribute to the photoactive properties of an emissive material, although an ancillary ligand may alter the properties of a photoactive ligand. as used herein, and as would be generally understood by one skilled in the art, a first “highest occupied molecular orbital” (homo) or “lowest unoccupied molecular orbital” (lumo) energy level is “greater than” or “higher than” a second homo or lumo energy level if the first energy level is closer to the vacuum energy level. since ionization potentials (ip) are measured as a negative energy relative to a vacuum level, a higher homo energy level corresponds to an ip having a smaller absolute value (an ip that is less negative). similarly, a higher lumo energy level corresponds to an electron affinity (ea) having a smaller absolute value (an ea that is less negative). on a conventional energy level diagram, with the vacuum level at the top, the lumo energy level of a material is higher than the homo energy level of the same material. a “higher” homo or lumo energy level appears closer to the top of such a diagram than a “lower” homo or lumo energy level. as used herein, and as would be generally understood by one skilled in the art, a first work function is “greater than” or “higher than” a second work function if the first work function has a higher absolute value. because work functions are generally measured as negative numbers relative to vacuum level, this means that a “higher” work function is more negative. on a conventional energy level diagram, with the vacuum level at the top, a “higher” work function is illustrated as further away from the vacuum level in the downward direction. thus, the definitions of homo and lumo energy levels follow a different convention than work functions. more details on oleds, and the definitions described above, can be found in u.s. pat. no. 7,279,704, which is incorporated herein by reference in its entirety. summary organic compounds comprising benzimidazo[1,2-a]benzimidazole moieties are disclosed. the compounds are useful as emitters for organic electroluminescence device for improving the performance. according to an aspect of the present disclosure, a first device comprising a first oled is disclosed. the first oled comprises: an anode; a cathode; and an emissive layer, disposed between the anode and the cathode. the emissive layer comprises a first emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring. according to another aspect, a consumer product comprising the oled is disclosed. a formulation comprising a first emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: formula ii is also disclosed. brief description of the drawings fig. 1 shows an organic light emitting device. fig. 2 shows an inverted organic light emitting device that does not have a separate electron transport layer. detailed description generally, an oled comprises at least one organic layer disposed between and electrically connected to an anode and a cathode. when a current is applied, the anode injects holes and the cathode injects electrons into the organic layer(s). the injected holes and electrons each migrate toward the oppositely charged electrode. when an electron and hole localize on the same molecule, an “exciton,” which is a localized electron-hole pair having an excited energy state, is formed. light is emitted when the exciton relaxes via a photoemissive mechanism. in some cases, the exciton may be localized on an excimer or an exciplex. non-radiative mechanisms, such as thermal relaxation, may also occur, but are generally considered undesirable. the initial oleds used emissive molecules that emitted light from their singlet states (“fluorescence”) as disclosed, for example, in u.s. pat. no. 4,769,292, which is incorporated by reference in its entirety. fluorescent emission generally occurs in a time frame of less than 10 nanoseconds. more recently, oleds having emissive materials that emit light from triplet states (“phosphorescence”) have been demonstrated. baldo et al., “highly efficient phosphorescent emission from organic electroluminescent devices,” nature, vol. 395, 151-154, 1998; (“baldo-i”) and baldo et al., “very high-efficiency green organic light-emitting devices based on electrophosphorescence,” appl. phys. lett., vol. 75, no. 3, 4-6 (1999) (“baldo-ii”), are incorporated by reference in their entireties. phosphorescence is described in more detail in u.s. pat. no. 7,279,704 at cols. 5-6, which are incorporated by reference. fig. 1 shows an organic light emitting device 100 . the figures are not necessarily drawn to scale. device 100 may include a substrate 110 , an anode 115 , a hole injection layer 120 , a hole transport layer 125 , an electron blocking layer 130 , an emissive layer 135 , a hole blocking layer 140 , an electron transport layer 145 , an electron injection layer 150 , a protective layer 155 , a cathode 160 , and a barrier layer 170 . cathode 160 is a compound cathode having a first conductive layer 162 and a second conductive layer 164 . device 100 may be fabricated by depositing the layers described, in order. the properties and functions of these various layers, as well as example materials, are described in more detail in u.s. pat. no. 7,279,704 at cols. 6-10, which are incorporated by reference. more examples for each of these layers are available. for example, a flexible and transparent substrate-anode combination is disclosed in u.s. pat. no. 5,844,363, which is incorporated by reference in its entirety. an example of a p-doped hole transport layer is m-mtdata doped with f 4 -tcnq at a molar ratio of 50:1, as disclosed in u.s. patent application publication no. 2003/0230980, which is incorporated by reference in its entirety. examples of emissive and host materials are disclosed in u.s. pat. no. 6,303,238 to thompson et al., which is incorporated by reference in its entirety. an example of an n-doped electron transport layer is bphen doped with li at a molar ratio of 1:1, as disclosed in u.s. patent application publication no. 2003/0230980, which is incorporated by reference in its entirety. u.s. pat. nos. 5,703,436 and 5,707,745, which are incorporated by reference in their entireties, disclose examples of cathodes including compound cathodes having a thin layer of metal such as mg:ag with an overlying transparent, electrically-conductive, sputter-deposited ito layer. the theory and use of blocking layers is described in more detail in u.s. pat. no. 6,097,147 and u.s. patent application publication no. 2003/0230980, which are incorporated by reference in their entireties. examples of injection layers are provided in u.s. patent application publication no. 2004/0174116, which is incorporated by reference in its entirety. a description of protective layers may be found in u.s. patent application publication no. 2004/0174116, which is incorporated by reference in its entirety. fig. 2 shows an inverted oled 200 . the device includes a substrate 210 , a cathode 215 , an emissive layer 220 , a hole transport layer 225 , and an anode 230 . device 200 may be fabricated by depositing the layers described, in order. because the most common oled configuration has a cathode disposed over the anode, and device 200 has cathode 215 disposed under anode 230 , device 200 may be referred to as an “inverted” oled. materials similar to those described with respect to device 100 may be used in the corresponding layers of device 200 . fig. 2 provides one example of how some layers may be omitted from the structure of device 100 . the simple layered structure illustrated in figs. 1 and 2 is provided by way of non-limiting example, and it is understood that embodiments of the invention may be used in connection with a wide variety of other structures. the specific materials and structures described are exemplary in nature, and other materials and structures may be used. functional oleds may be achieved by combining the various layers described in different ways, or layers may be omitted entirely, based on design, performance, and cost factors. other layers not specifically described may also be included. materials other than those specifically described may be used. although many of the examples provided herein describe various layers as comprising a single material, it is understood that combinations of materials, such as a mixture of host and dopant, or more generally a mixture, may be used. also, the layers may have various sublayers. the names given to the various layers herein are not intended to be strictly limiting. for example, in device 200 , hole transport layer 225 transports holes and injects holes into emissive layer 220 , and may be described as a hole transport layer or a hole injection layer. in one embodiment, an oled may be described as having an “organic layer” disposed between a cathode and an anode. this organic layer may comprise a single layer, or may further comprise multiple layers of different organic materials as described, for example, with respect to figs. 1 and 2 . structures and materials not specifically described may also be used, such as oleds comprised of polymeric materials (pleds) such as disclosed in u.s. pat. no. 5,247,190 to friend et al., which is incorporated by reference in its entirety. by way of further example, oleds having a single organic layer may be used. oleds may be stacked, for example as described in u.s. pat. no. 5,707,745 to forrest et al, which is incorporated by reference in its entirety. the oled structure may deviate from the simple layered structure illustrated in figs. 1 and 2 . for example, the substrate may include an angled reflective surface to improve out-coupling, such as a mesa structure as described in u.s. pat. no. 6,091,195 to forrest et al., and/or a pit structure as described in u.s. pat. no. 5,834,893 to bulovic et al., which are incorporated by reference in their entireties. unless otherwise specified, any of the layers of the various embodiments may be deposited by any suitable method. for the organic layers, preferred methods include thermal evaporation, ink-jet, such as described in u.s. pat. nos. 6,013,982 and 6,087,196, which are incorporated by reference in their entireties, organic vapor phase deposition (ovpd), such as described in u.s. pat. no. 6,337,102 to forrest et al., which is incorporated by reference in its entirety, and deposition by organic vapor jet printing (ovjp), such as described in u.s. pat. no. 7,431,968, which is incorporated by reference in its entirety. other suitable deposition methods include spin coating and other solution based processes. solution based processes are preferably carried out in nitrogen or an inert atmosphere. for the other layers, preferred methods include thermal evaporation. preferred patterning methods include deposition through a mask, cold welding such as described in u.s. pat. nos. 6,294,398 and 6,468,819, which are incorporated by reference in their entireties, and patterning associated with some of the deposition methods such as ink jet and ovjp. other methods may also be used. the materials to be deposited may be modified to make them compatible with a particular deposition method. for example, substituents such as alkyl and aryl groups, branched or unbranched, and preferably containing at least 3 carbons, may be used in small molecules to enhance their ability to undergo solution processing. substituents having 20 carbons or more may be used, and 3-20 carbons is a preferred range. materials with asymmetric structures may have better solution processability than those having symmetric structures, because asymmetric materials may have a lower tendency to recrystallize. dendrimer substituents may be used to enhance the ability of small molecules to undergo solution processing. devices fabricated in accordance with embodiments of the present invention may further optionally comprise a barrier layer. one purpose of the barrier layer is to protect the electrodes and organic layers from damaging exposure to harmful species in the environment including moisture, vapor and/or gases, etc. the barrier layer may be deposited over, under or next to a substrate, an electrode, or over any other parts of a device including an edge. the barrier layer may comprise a single layer, or multiple layers. the barrier layer may be formed by various known chemical vapor deposition techniques and may include compositions having a single phase as well as compositions having multiple phases. any suitable material or combination of materials may be used for the barrier layer. the barrier layer may incorporate an inorganic or an organic compound or both. the preferred barrier layer comprises a mixture of a polymeric material and a non-polymeric material as described in u.s. pat. no. 7,968,146, pct pat. application nos. pct/us2007/023098 and pct/us2009/042829, which are herein incorporated by reference in their entireties. to be considered a “mixture”, the aforesaid polymeric and non-polymeric materials comprising the barrier layer should be deposited under the same reaction conditions and/or at the same time. the weight ratio of polymeric to non-polymeric material may be in the range of 95:5 to 5:95. the polymeric material and the non-polymeric material may be created from the same precursor material. in one example, the mixture of a polymeric material and a non-polymeric material consists essentially of polymeric silicon and inorganic silicon. devices fabricated in accordance with embodiments of the invention can be incorporated into a wide variety of electronic component modules (or units) that can be incorporated into a variety of electronic products or intermediate components. examples of such electronic products or intermediate components include display screens, lighting devices such as discrete light source devices or lighting panels, etc. that can be utilized by the end-user product manufacturers. such electronic component modules can optionally include the driving electronics and/or power source(s). devices fabricated in accordance with embodiments of the invention can be incorporated into a wide variety of consumer products that have one or more of the electronic component modules (or units) incorporated therein. a consumer product comprising an oled that includes the compound of the present disclosure in the organic layer in the oled is disclosed. such consumer products would include any kind of products that include one or more light source(s) and/or one or more of some type of visual displays. some examples of such consumer products include flat panel displays, computer monitors, medical monitors, televisions, billboards, lights for interior or exterior illumination and/or signaling, heads-up displays, fully or partially transparent displays, flexible displays, laser printers, telephones, cell phones, tablets, phablets, personal digital assistants (pdas), wearable devices, laptop computers, digital cameras, camcorders, viewfinders, micro-displays (displays that are less than 2 inches diagonal), 3-d displays, virtual reality or augmented reality displays, vehicles, video walls comprising multiple displays tiled together, theater or stadium screen, and a sign. various control mechanisms may be used to control devices fabricated in accordance with the present invention, including passive matrix and active matrix. many of the devices are intended for use in a temperature range comfortable to humans, such as 18 degrees c. to 30 degrees c., and more preferably at room temperature (20-25 degrees c.), but could be used outside this temperature range, for example, from −40 degree c. to +80 degree c. the materials and structures described herein may have applications in devices other than oleds. for example, other optoelectronic devices such as organic solar cells and organic photodetectors may employ the materials and structures. more generally, organic devices, such as organic transistors, may employ the materials and structures. the term “halo,” “halogen,” or “halide” as used herein includes fluorine, chlorine, bromine, and iodine. the term “alkyl” as used herein contemplates both straight and branched chain alkyl radicals. preferred alkyl groups are those containing from one to fifteen carbon atoms and includes methyl, ethyl, propyl, 1-methylethyl, butyl, 1-methylpropyl, 2-methylpropyl, pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1,1-dimethylpropyl, 1,2-dimethylpropyl, 2,2-dimethylpropyl, and the like. additionally, the alkyl group may be optionally substituted. the term “cycloalkyl” as used herein contemplates cyclic alkyl radicals. preferred cycloalkyl groups are those containing 3 to 10 ring carbon atoms and includes cyclopropyl, cyclopentyl, cyclohexyl, adamantyl, and the like. additionally, the cycloalkyl group may be optionally substituted. the term “alkenyl” as used herein contemplates both straight and branched chain alkene radicals. preferred alkenyl groups are those containing two to fifteen carbon atoms. additionally, the alkenyl group may be optionally substituted. the term “alkynyl” as used herein contemplates both straight and branched chain alkyne radicals. preferred alkynyl groups are those containing two to fifteen carbon atoms. additionally, the alkynyl group may be optionally substituted. the terms “aralkyl” or “arylalkyl” as used herein are used interchangeably and contemplate an alkyl group that has as a substituent an aromatic group. additionally, the aralkyl group may be optionally substituted. the term “heterocyclic group” as used herein contemplates aromatic and non-aromatic cyclic radicals. hetero-aromatic cyclic radicals also means heteroaryl. preferred hetero-non-aromatic cyclic groups are those containing 3 to 7 ring atoms which includes at least one hetero atom, and includes cyclic amines such as morpholino, piperidino, pyrrolidino, and the like, and cyclic ethers, such as tetrahydrofuran, tetrahydropyran, and the like. additionally, the heterocyclic group may be optionally substituted. the term “aryl” or “aromatic group” as used herein contemplates single-ring groups and polycyclic ring systems. the polycyclic rings may have two or more rings in which two carbons are common to two adjoining rings (the rings are “fused”) wherein at least one of the rings is aromatic, e.g., the other rings can be cycloalkyls, cycloalkenyls, aryl, heterocycles, and/or heteroaryls. preferred aryl groups are those containing six to thirty carbon atoms, preferably six to twenty carbon atoms, more preferably six to twelve carbon atoms. especially preferred is an aryl group having six carbons, ten carbons or twelve carbons. suitable aryl groups include phenyl, biphenyl, triphenyl, triphenylene, tetraphenylene, naphthalene, anthracene, phenalene, phenanthrene, fluorene, pyrene, chrysene, perylene, and azulene, preferably phenyl, biphenyl, triphenyl, triphenylene, fluorene, and naphthalene. additionally, the aryl group may be optionally substituted. the term “heteroaryl” as used herein contemplates single-ring hetero-aromatic groups that may include from one to five heteroatoms. the term heteroaryl also includes polycyclic hetero-aromatic systems having two or more rings in which two atoms are common to two adjoining rings (the rings are “fused”) wherein at least one of the rings is a heteroaryl, e.g., the other rings can be cycloalkyls, cycloalkenyls, aryl, heterocycles, and/or heteroaryls. preferred heteroaryl groups are those containing three to thirty carbon atoms, preferably three to twenty carbon atoms, more preferably three to twelve carbon atoms. suitable heteroaryl groups include dibenzothiophene, dibenzofuran, dibenzoselenophene, furan, thiophene, benzofuran, benzothiophene, benzoselenophene, carbazole, indolocarbazole, pyridylindole, pyrrolodipyridine, pyrazole, imidazole, triazole, oxazole, thiazole, oxadiazole, oxatriazole, dioxazole, thiadiazole, pyridine, pyridazine, pyrimidine, pyrazine, triazine, oxazine, oxathiazine, oxadiazine, indole, benzimidazole, indazole, indoxazine, benzoxazole, benzisoxazole, benzothiazole, quinoline, isoquinoline, cinnoline, quinazoline, quinoxaline, naphthyridine, phthalazine, pteridine, xanthene, acridine, phenazine, phenothiazine, phenoxazine, benzofuropyridine, furodipyridine, benzothienopyridine, thienodipyridine, benzoselenophenopyridine, and selenophenodipyridine, preferably dibenzothiophene, dibenzofuran, dibenzoselenophene, carbazole, indolocarbazole, imidazole, pyridine, triazine, benzimidazole, 1,2-azaborine, 1,3-azaborine, 1,4-azaborine, borazine, and aza-analogs thereof. additionally, the heteroaryl group may be optionally substituted. the alkyl, cycloalkyl, alkenyl, alkynyl, aralkyl, heterocyclic group, aryl, and heteroaryl may be unsubstituted or may be substituted with one or more substituents selected from the group consisting of deuterium, halogen, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, cyclic amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acid, ether, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. as used herein, “substituted” indicates that a substituent other than h is bonded to the relevant position, such as carbon. thus, for example, where r 1 is mono-substituted, then one r 1 must be other than h. similarly, where r 1 is di-substituted, then two of r 1 must be other than h. similarly, where r 1 is unsubstituted, r 1 is hydrogen for all available positions. the “aza” designation in the fragments described herein, i.e. aza-dibenzofuran, aza-dibenzothiophene, etc. means that one or more of the c—h groups in the respective fragment can be replaced by a nitrogen atom, for example, and without any limitation, azatriphenylene encompasses both dibenzo[f,h]quinoxaline and dibenzo[f,h]quinoline. one of ordinary skill in the art can readily envision other nitrogen analogs of the aza-derivatives described above, and all such analogs are intended to be encompassed by the terms as set forth herein. it is to be understood that when a molecular fragment is described as being a substituent or otherwise attached to another moiety, its name may be written as if it were a fragment (e.g. phenyl, phenylene, naphthyl, dibenzofuryl) or as if it were the whole molecule (e.g. benzene, naphthalene, dibenzofuran). as used herein, these different ways of designating a substituent or attached fragment are considered to be equivalent. it is believed that the internal quantum efficiency (iqe) of fluorescent oleds can exceed the 25% spin statistics limit through delayed fluorescence. as used herein, there are two types of delayed fluorescence, i.e. p-type delayed fluorescence and e-type delayed fluorescence. p-type delayed fluorescence is generated from triplet-triplet annihilation (tta). on the other hand, e-type delayed fluorescence does not rely on the collision of two triplets, but rather on the thermal population between the triplet states and the singlet excited states. compounds that are capable of generating e-type delayed fluorescence are required to have very small singlet-triplet gaps. thermal energy can activate the transition from the triplet state back to the singlet state. this type of delayed fluorescence is also known as thermally activated delayed fluorescence (tadf). a distinctive feature of tadf is that the delayed component increases as temperature rises due to the increased thermal energy. if the reverse intersystem crossing rate is fast enough to minimize the non-radiative decay from the triplet state, the fraction of back populated singlet excited states can potentially reach 75%. the total singlet fraction can be 100%, far exceeding the spin statistics limit for electrically generated excitons. e-type delayed fluorescence characteristics can be found in an exciplex system or in a single compound. without being bound by theory, it is believed that e-type delayed fluorescence requires the luminescent material to have a small singlet-triplet energy gap (δe s-t ). organic, non-metal containing, donor-acceptor luminescent materials may be able to achieve this. the emission in these materials is often characterized as a donor-acceptor charge-transfer (ct) type emission. the spatial separation of the homo and lumo in these donor-acceptor type compounds often results in small δe s-t . these states may involve ct states. often, donor-acceptor luminescent materials are constructed by connecting an electron donor moiety such as amino- or carbazole-derivatives and an electron acceptor moiety such as n-containing six-membered aromatic rings. as used herein, the phrase “electron acceptor” is a chemical entity that accepts electrons transferred to it from another entity, and the phrase “electron donor” is a chemical entity that donates electrons to another entity. according to an aspect of the present disclosure, a first device comprising a first oled is disclosed. the first oled comprises: an anode; a cathode; and an emissive layer, disposed between the anode and the cathode. the emissive layer comprises a first emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring. in some embodiments, g 1 comprises at least one chemical group selected from the group consisting of: wherein a 1 to a 6 independently comprise c or n, and at least one of a 1 to a 6 is n; wherein j 1 to j 4 independently comprise c or n, and at least one of j 1 to j 4 is n; wherein x 1 is o, s, or nr; and wherein r is selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, sonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in some embodiments, g 1 comprises at least one chemical group selected from the group consisting of: wherein e 7 to e 8 independently comprise c or n; wherein l 1 to l 4 independently comprise c or n; wherein x 2 is o, s, or nr; and wherein r is selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in some embodiments, z comprises a least one chemical group selected from the group consisting of: in some embodiments, g 1 comprises at least one chemical group selected from the group consisting of: wherein r 21 , r 22 , and r 23 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in some embodiments, g 1 comprises at least one chemical group selected from the group consisting of: in some embodiments, g 1 comprises at least one chemical group selected from the group consisting of: in some embodiments, the compound is selected from the group consisting of: in some embodiments of the first device, the first device emits a luminescent radiation at room temperature when a voltage is applied across the first organic light emitting device; wherein the luminescent radiation comprises a delayed fluorescent process. in some embodiments of the first device, the emissive layer further comprises a first phosphorescent emitting material. in some embodiments of the first device, the emissive layer further comprises a second phosphorescent emitting material. in some embodiments of the first device, the emissive layer further comprises a host material. in some embodiments of the first device, the first device emits a white light at room temperature when a voltage is applied across the organic light emitting device. in some embodiments of the first device, the first emitting compound emits a blue light having a peak wavelength between about 400 nm to about 500 nm. in some embodiments of the first device, the first emitting compound emits a yellow light having a peak wavelength between about 530 nm to about 580 nm. in some embodiments of the first device, the first device comprises a second organic light-emitting device. in some embodiments of the first device, the second organic light emitting device is stacked on the first organic light emitting device. according to another aspect of the present disclosure, a consumer product comprising the first device comprising the first organic light emitting device described above is disclosed. such consumer products can be one of the various examples described herein. in some embodiments, the oled has one or more characteristics selected from the group consisting of being flexible, being rollable, being foldable, being stretchable, and being curved. in some embodiments, the oled is transparent or semi-transparent. in some embodiments, the oled further comprises a layer comprising carbon nanotubes. in some embodiments, the oled further comprises a layer comprising a delayed fluorescent emitter. in some embodiments, the oled comprises a rgb pixel arrangement or white plus color filter pixel arrangement. in some embodiments, the oled is a mobile device, a hand held device, or a wearable device. in some embodiments, the oled is a display panel having less than 10 inch diagonal or 50 square inch area. in some embodiments, the oled is a display panel having at least 10 inch diagonal or 50 square inch area. in some embodiments, the oled is a lighting panel. in some embodiments, an emissive region in an oled is disclosed, wherein the emissive region comprising a first emitting compound having the formula: g 1 -z, formula i; wherein g 1 is an electron acceptor group; and wherein z is an electron donor group; wherein z has the formula: wherein each of r 1 and r 2 independently represents no substitution to the maximum allowable substitution; wherein r 1 and r 2 are independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof; and wherein two or more of r 1 and r 2 substitutions are optionally joined or fused into a ring. the various other options for g 1 and z described above are also applicable to this embodiment. in some embodiments of the emissive region, the emissive region further comprises a host, wherein the host comprises at least one selected from the group consisting of metal complex, triphenylene, carbazole, dibenzothiophene, dibenzofuran, dibenzoselenophene, aza-triphenylene, aza-carbazole, aza-dibenzothiophene, aza-dibenzofuran, and aza-dibenzoselenophene. in some embodiment of the emissive region, the emissive region further comprises a host, wherein the host is selected from the group consisting of: and combinations thereof. in some embodiments, the compound can be an emissive dopant. in some embodiments, the compound can produce emissions via phosphorescence, fluorescence, thermally activated delayed fluorescence, i.e., tadf (also referred to as e-type delayed fluorescence), triplet-triplet annihilation, or combinations of these processes. according to another aspect, a formulation comprising the compound described herein is also disclosed. the oled disclosed herein can be incorporated into one or more of a consumer product, an electronic component module, and a lighting panel. the organic layer can be an emissive layer and the compound can be an emissive dopant in some embodiments, while the compound can be a non-emissive dopant in other embodiments. the organic layer can also include a host. in some embodiments, two or more hosts are preferred. in some embodiments, the hosts used maybe a) bipolar, b) electron transporting, c) hole transporting or d) wide band gap materials that play little role in charge transport. in some embodiments, the host can include a metal complex. the host can be a triphenylene containing benzo-fused thiophene or benzo-fused furan. any substituent in the host can be an unfused substituent independently selected from the group consisting of c n h 2n+1 , oc n h 2n+1 , oar 1 , n(c n h 2n+1 ) 2 , n(ar 1 )(ar 2 ), ch═ch—c n h 2n+1 , c≡c—c n h 2n+1 , ar t , ar 1 -ar 2 , and c n h 2n —ar 1 , or the host has no substitutions. in the preceding substituents n can range from 1 to 10; and ar 1 and ar 2 can be independently selected from the group consisting of benzene, biphenyl, naphthalene, triphenylene, carbazole, and heteroaromatic analogs thereof. the host can be an inorganic compound. for example a zn containing inorganic material e.g. zns. the host can be a compound comprising at least one chemical group selected from the group consisting of triphenylene, carbazole, dibenzothiophene, dibenzofuran, dibenzoselenophene, azatriphenylene, azacarbazole, aza-dibenzothiophene, aza-dibenzofuran, and aza-dibenzoselenophene. the host can include a metal complex. the host can be, but is not limited to, a specific compound selected from the group consisting of: and combinations thereof. additional information on possible hosts is provided below. in yet another aspect of the present disclosure, a formulation that comprises the novel compound disclosed herein is described. the formulation can include one or more components selected from the group consisting of a solvent, a host, a hole injection material, hole transport material, and an electron transport layer material, disclosed herein. combination with other materials the materials described herein as useful for a particular layer in an organic light emitting device may be used in combination with a wide variety of other materials present in the device. for example, emissive dopants disclosed herein may be used in conjunction with a wide variety of hosts, transport layers, blocking layers, injection layers, electrodes and other layers that may be present. the materials described or referred to below are non-limiting examples of materials that may be useful in combination with the compounds disclosed herein, and one of skill in the art can readily consult the literature to identify other materials that may be useful in combination. conductivity dopants: a charge transport layer can be doped with conductivity dopants to substantially alter its density of charge carriers, which will in turn alter its conductivity. the conductivity is increased by generating charge carriers in the matrix material, and depending on the type of dopant, a change in the fermi level of the semiconductor may also be achieved. hole-transporting layer can be doped by p-type conductivity dopants and n-type conductivity dopants are used in the electron-transporting layer. non-limiting examples of the conductivity dopants that may be used in an oled in combination with materials disclosed herein are exemplified below together with references that disclose those materials: ep01617493, ep01968131, ep2020694, ep2684932, us20050139810, us20070160905, us20090167167, us2010288362, wo06081780, wo2009003455, wo2009008277, wo2009011327, wo2014009310, us2007252140, us2015060804 and us2012146012. hil/htl: a hole injecting/transporting material to be used in the present invention is not particularly limited, and any compound may be used as long as the compound is typically used as a hole injecting/transporting material. examples of the material include, but are not limited to: a phthalocyanine or porphyrin derivative; an aromatic amine derivative; an indolocarbazole derivative; a polymer containing fluorohydrocarbon; a polymer with conductivity dopants; a conducting polymer, such as pedot/pss; a self-assembly monomer derived from compounds such as phosphonic acid and silane derivatives; a metal oxide derivative, such as moo x ; a p-type semiconducting organic compound, such as 1,4,5,8,9,12-hexaazatriphenylenehexacarbonitrile; a metal complex, and a cross-linkable compounds. examples of aromatic amine derivatives used in hil or htl include, but not limit to the following general structures: each of ar 1 to ar 9 is selected from the group consisting of aromatic hydrocarbon cyclic compounds such as benzene, biphenyl, triphenyl, triphenylene, naphthalene, anthracene, phenalene, phenanthrene, fluorene, pyrene, chrysene, perylene, and azulene; the group consisting of aromatic heterocyclic compounds such as dibenzothiophene, dibenzofuran, dibenzoselenophene, furan, thiophene, benzofuran, benzothiophene, benzoselenophene, carbazole, indolocarbazole, pyridylindole, pyrrolodipyridine, pyrazole, imidazole, triazole, oxazole, thiazole, oxadiazole, oxatriazole, dioxazole, thiadiazole, pyridine, pyridazine, pyrimidine, pyrazine, triazine, oxazine, oxathiazine, oxadiazine, indole, benzimidazole, indazole, indoxazine, benzoxazole, benzisoxazole, benzothiazole, quinoline, isoquinoline, cinnoline, quinazoline, quinoxaline, naphthyridine, phthalazine, pteridine, xanthene, acridine, phenazine, phenothiazine, phenoxazine, benzofuropyridine, furodipyridine, benzothienopyridine, thienodipyridine, benzoselenophenopyridine, and selenophenodipyridine; and the group consisting of 2 to 10 cyclic structural units which are groups of the same type or different types selected from the aromatic hydrocarbon cyclic group and the aromatic heterocyclic group and are bonded to each other directly or via at least one of oxygen atom, nitrogen atom, sulfur atom, silicon atom, phosphorus atom, boron atom, chain structural unit and the aliphatic cyclic group. each ar may be unsubstituted or may be substituted by a substituent selected from the group consisting of deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in one aspect, ar 1 to ar 9 is independently selected from the group consisting of: wherein k is an integer from 1 to 20; x 101 to x 108 is c (including ch) or n; z 101 is nar 1 , o, or s; ar 1 has the same group defined above. examples of metal complexes used in hil or htl include, but are not limited to the following general formula: wherein met is a metal, which can have an atomic weight greater than 40; (y 101 -y 102 ) is a bidentate ligand, y 101 and y 102 are independently selected from c, n, o, p, and s; l 101 is an ancillary ligand; k′ is an integer value from 1 to the maximum number of ligands that may be attached to the metal; and k′+k″ is the maximum number of ligands that may be attached to the metal. in one aspect, (y 101 -y 102 ) is a 2-phenylpyridine derivative. in another aspect, (y 101 -y 102 ) is a carbene ligand. in another aspect, met is selected from ir, pt, os, and zn. in a further aspect, the metal complex has a smallest oxidation potential in solution vs. fc + /fc couple less than about 0.6 v. non-limiting examples of the hil and htl materials that may be used in an oled in combination with materials disclosed herein are exemplified below together with references that disclose those materials: cn102702075, de102012005215, ep01624500, ep01698613, ep01806334, ep01930964, ep01972613, ep01997799, ep02011790, ep02055700, ep02055701, ep1725079, ep2085382, ep2660300, ep650955, jp07-073529, jp2005112765, jp2007091719, jp2008021687, jp2014-009196, kr20110088898, kr20130077473, tw201139402, u.s. ser. no. 06/517,957, us20020158242, us20030162053, us20050123751, us20060182993, us20060240279, us20070145888, us20070181874, us20070278938, us20080014464, us20080091025, us20080106190, us20080124572, us20080145707, us20080220265, us20080233434, us20080303417, us2008107919, us20090115320, us20090167161, us2009066235, us2011007385, us20110163302, us2011240968, us2011278551, us2012205642, us2013241401, us20140117329, us2014183517, u.s. pat. no. 5,061,569, 5,639,914, wo05075451, wo07125714, wo08023550, wo08023759, wo2009145016, wo2010061824, wo2011075644, wo2012177006, wo2013018530, wo2013039073, wo2013087142, wo2013118812, wo2013120577, wo2013157367, wo2013175747, wo2014002873, wo2014015935, wo2014015937, wo2014030872, wo2014030921, wo2014034791, wo2014104514, wo2014157018. ebl: an electron blocking layer (ebl) may be used to reduce the number of electrons and/or excitons that leave the emissive layer. the presence of such a blocking layer in a device may result in substantially higher efficiencies, and/or longer lifetime, as compared to a similar device lacking a blocking layer. also, a blocking layer may be used to confine emission to a desired region of an oled. in some embodiments, the ebl material has a higher lumo (closer to the vacuum level) and/or higher triplet energy than the emitter closest to the ebl interface. in some embodiments, the ebl material has a higher lumo (closer to the vacuum level) and or higher triplet energy than one or more of the hosts closest to the ebl interface. in one aspect, the compound used in ebl contains the same molecule or the same functional groups used as one of the hosts described below. host: the light emitting layer of the organic el device of the present invention preferably contains at least a metal complex as light emitting material, and may contain a host material using the metal complex as a dopant material. examples of the host material are not particularly limited, and any metal complexes or organic compounds may be used as long as the triplet energy of the host is larger than that of the dopant. any host material may be used with any dopant so long as the triplet criteria is satisfied. examples of metal complexes used as host are preferred to have the following general formula: wherein met is a metal; (y 103 -y 104 ) is a bidentate ligand, y 103 and y 104 are independently selected from c, n, o, p, and s; l 101 is an another ligand; k′ is an integer value from 1 to the maximum number of ligands that may be attached to the metal; and k′+k″ is the maximum number of ligands that may be attached to the metal. in one aspect, the metal complexes are: wherein (o—n) is a bidentate ligand, having metal coordinated to atoms o and n. in another aspect, met is selected from ir and pt. in a further aspect, (y 103 -y 104 ) is a carbene ligand. examples of other organic compounds used as host are selected from the group consisting of aromatic hydrocarbon cyclic compounds such as benzene, biphenyl, triphenyl, triphenylene, tetraphenylene, naphthalene, anthracene, phenalene, phenanthrene, fluorene, pyrene, chrysene, perylene, and azulene; the group consisting of aromatic heterocyclic compounds such as dibenzothiophene, dibenzofuran, dibenzoselenophene, furan, thiophene, benzofuran, benzothiophene, benzoselenophene, carbazole, indolocarbazole, pyridylindole, pyrrolodipyridine, pyrazole, imidazole, triazole, oxazole, thiazole, oxadiazole, oxatriazole, dioxazole, thiadiazole, pyridine, pyridazine, pyrimidine, pyrazine, triazine, oxazine, oxathiazine, oxadiazine, indole, benzimidazole, indazole, indoxazine, benzoxazole, benzisoxazole, benzothiazole, quinoline, isoquinoline, cinnoline, quinazoline, quinoxaline, naphthyridine, phthalazine, pteridine, xanthene, acridine, phenazine, phenothiazine, phenoxazine, benzofuropyridine, furodipyridine, benzothienopyridine, thienodipyridine, benzoselenophenopyridine, and selenophenodipyridine; and the group consisting of 2 to 10 cyclic structural units which are groups of the same type or different types selected from the aromatic hydrocarbon cyclic group and the aromatic heterocyclic group and are bonded to each other directly or via at least one of oxygen atom, nitrogen atom, sulfur atom, silicon atom, phosphorus atom, boron atom, chain structural unit and the aliphatic cyclic group. each option within each group may be unsubstituted or may be substituted by a substituent selected from the group consisting of deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof. in one aspect, the host compound contains at least one of the following groups in the molecule: wherein each of r 101 to r 107 is independently selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof, and when it is aryl or heteroaryl, it has the similar definition as ar's mentioned above. k is an integer from 0 to 20 or 1 to 20; k′″ is an integer from 0 to 20. x 101 to x 108 is selected from c (including ch) or n. z 101 and z 102 is selected from nr 101 , o, or s. non-limiting examples of the host materials that may be used in an oled in combination with materials disclosed herein are exemplified below together with references that disclose those materials: ep2034538, ep2034538a, ep2757608, jp2007254297, kr20100079458, kr20120088644, kr20120129733, kr20130115564, tw201329200, us20030175553, us20050238919, us20060280965, us20090017330, us20090030202, us20090167162, us20090302743, us20090309488, us20100012931, us20100084966, us20100187984, us2010187984, us2012075273, us2012126221, us2013009543, us2013105787, us2013175519, us2014001446, us20140183503, us20140225088, us2014034914, u.s. pat. no. 7,154,114, wo2001039234, wo2004093207, wo2005014551, wo2005089025, wo2006072002, wo2006114966, wo2007063754, wo2008056746, wo2009003898, wo2009021126, wo2009063833, wo2009066778, wo2009066779, wo2009086028, wo2010056066, wo2010107244, wo2011081423, wo2011081431, wo2011086863, wo2012128298, wo2012133644, wo2012133649, wo2013024872, wo2013035275, wo2013081315, wo2013191404, wo2014142472, additional emitters: one or more additional emitter dopants may be used in conjunction with the compound of the present disclosure. examples of the additional emitter dopants are not particularly limited, and any compounds may be used as long as the compounds are typically used as emitter materials. examples of suitable emitter materials include, but are not limited to, compounds which can produce emissions via phosphorescence, fluorescence, thermally activated delayed fluorescence, i.e., tadf (also referred to as e-type delayed fluorescence), triplet-triplet annihilation, or combinations of these processes. non-limiting examples of the emitter materials that may be used in an oled in combination with materials disclosed herein are exemplified below together with references that disclose those materials: cn103694277, cn1696137, eb01238981, ep01239526, ep01961743, ep1239526, ep1244155, ep1642951, ep1647554, ep1841834, ep1841834b, ep2062907, ep2730583, jp2012074444, jp2013110263, jp4478555, kr1020090133652, kr20120032054, kr20130043460, tw201332980, u.s. ser. no. 06/699,599, u.s. ser. no. 06/916,554, us20010019782, us20020034656, us20030068526, us20030072964, us20030138657, us20050123788, us20050244673, us2005123791, us2005260449, us20060008670, us20060065890, us20060127696, us20060134459, us20060134462, us20060202194, us20060251923, us20070034863, us20070087321, us20070103060, us20070111026, us20070190359, us20070231600, us2007034863, us2007104979, us2007104980, us2007138437, us2007224450, us2007278936, us20080020237, us20080233410, us20080261076, us20080297033, us200805851, us2008161567, us2008210930, us20090039776, us20090108737, us20090115322, us20090179555, us2009085476, us2009104472, us20100090591, us20100148663, us20100244004, us20100295032, us2010102716, us2010105902, us2010244004, us2010270916, us20110057559, us20110108822, us20110204333, us2011215710, us2011227049, us2011285275, us2012292601, us20130146848, us2013033172, us2013165653, us2013181190, us2013334521, us20140246656, us2014103305, u.s. pat. nos. 6,303,238, 6,413,656, 6,653,654, 6,670,645, 6,687,266, 6,835,469, 6,921,915, 7,279,704, 7,332,232, 7,378,162, 7,534,505, 7,675,228, 7,728,137, 7,740,957, 7,759,489, 7,951,947, 8,067,099, 8,592,586, 8,871,361, wo06081973, wo06121811, wo07018067, wo07108362, wo07115970, wo07115981, wo08035571, wo2002015645, wo2003040257, wo2005019373, wo2006056418, wo2008054584, wo2008078800, wo2008096609, wo2008101842, wo2009000673, wo2009050281, wo2009100991, wo2010028151, wo2010054731, wo2010086089, wo2010118029, wo2011044988, wo2011051404, wo2011107491, wo2012020327, wo2012163471, wo2013094620, wo2013107487, wo2013174471, wo2014007565, wo2014008982, wo2014023377, wo2014024131, wo2014031977, wo2014038456, wo2014112450. hbl: a hole blocking layer (hbl) may be used to reduce the number of holes and/or excitons that leave the emissive layer. the presence of such a blocking layer in a device may result in substantially higher efficiencies and/or longer lifetime as compared to a similar device lacking a blocking layer. also, a blocking layer may be used to confine emission to a desired region of an oled. in some embodiments, the hbl material has a lower homo (further from the vacuum level) and/or higher triplet energy than the emitter closest to the hbl interface. in some embodiments, the hbl material has a lower homo (further from the vacuum level) and/or higher triplet energy than one or more of the hosts closest to the hbl interface. in one aspect, compound used in hbl contains the same molecule or the same functional groups used as host described above. in another aspect, compound used in hbl contains at least one of the following groups in the molecule: wherein k is an integer from 1 to 20; l 101 is an another ligand, k′ is an integer from 1 to 3. etl: electron transport layer (etl) may include a material capable of transporting electrons. electron transport layer may be intrinsic (undoped), or doped. doping may be used to enhance conductivity. examples of the etl material are not particularly limited, and any metal complexes or organic compounds may be used as long as they are typically used to transport electrons. in one aspect, compound used in etl contains at least one of the following groups in the molecule: wherein r 101 is selected from the group consisting of hydrogen, deuterium, halide, alkyl, cycloalkyl, heteroalkyl, arylalkyl, alkoxy, aryloxy, amino, silyl, alkenyl, cycloalkenyl, heteroalkenyl, alkynyl, aryl, heteroaryl, acyl, carbonyl, carboxylic acids, ester, nitrile, isonitrile, sulfanyl, sulfinyl, sulfonyl, phosphino, and combinations thereof, when it is aryl or heteroaryl, it has the similar definition as ar's mentioned above. ar 1 to ar 3 has the similar definition as ar's mentioned above. k is an integer from 1 to 20. x 101 to x 108 is selected from c (including ch) or n. in another aspect, the metal complexes used in etl contains, but not limit to the following general formula: wherein (o—n) or (n—n) is a bidentate ligand, having metal coordinated to atoms o, n or n, n; l 101 is another ligand; k′ is an integer value from 1 to the maximum number of ligands that may be attached to the metal. non-limiting examples of the etl materials that may be used in an oled in combination with materials disclosed herein are exemplified below together with references that disclose those materials: cn103508940, ep01602648, ep01734038, ep01956007, jp2004-022334, jp2005149918, jp2005-268199, kr0117693, kr20130108183, us20040036077, us20070104977, us2007018155, us20090101870, us20090115316, us20090140637, us20090179554, us2009218940, us2010108990, us2011156017, us2011210320, us2012193612, us2012214993, us2014014925, us2014014927, us20140284580, u.s. pat. nos. 6,656,612, 8,415,031, wo2003060956, wo2007111263, wo2009148269, wo2010067894, wo2010072300, wo2011074770, wo2011105373, wo2013079217, wo2013145667, wo2013180376, wo2014104499, wo2014104535, charge generation layer (cgl) in tandem or stacked oleds, the cgl plays an essential role in the performance, which is composed of an n-doped layer and a p-doped layer for injection of electrons and holes, respectively. electrons and holes are supplied from the cgl and electrodes. the consumed electrons and holes in the cgl are refilled by the electrons and holes injected from the cathode and anode, respectively; then, the bipolar currents reach a steady state gradually. typical cgl materials include n and p conductivity dopants used in the transport layers. in any above-mentioned compounds used in each layer of the oled device, the hydrogen atoms can be partially or fully deuterated. thus, any specifically listed substituent, such as, without limitation, methyl, phenyl, pyridyl, etc. may be undeuterated, partially deuterated, and fully deuterated versions thereof. similarly, classes of substituents such as, without limitation, alkyl, aryl, cycloalkyl, heteroaryl, etc. also may be undeuterated, partially deuterated, and fully deuterated versions thereof. experimental the invented example (compound 1) was synthesized following the procedure reported in united states patent application publication no. 2014/0252280, the disclosure of which is encorporated herein by reference. device examples all devices were fabricated by high vacuum (˜10-7 torr) thermal evaporation. the anode electrode was 80 nm of indium tin oxide (ito). the cathode electrode consisted of 1 nm of lif followed by 100 nm of al. all devices were encapsulated with a glass lid sealed with an epoxy resin in a nitrogen glove box (<1 ppm of h 2 o and o 2 ) immediately after fabrication, and a moisture getter was incorporated inside the package. a set of device examples have organic stacks consisting of, sequentially from the ito surface, 10 nm of lg101 (from lg chem) as the hole injection layer (hil), 25 nm of pph-tpd as the hole-transport layer (htl), 30 nm of emissive layer (eml), followed by 35 nm of adbt-adn with 35 wt % liq as the electron-transport layer (etl). the eml has three components: 95 wt % of the eml being host (h-1 or h-2) and 5 wt % of the eml being the invented compound (compound 1) as the emitter. the chemical structures of the compounds used are shown below. provided in table 1 below is a summary of the device data recorded at 10 ma/cm 2 for device examples. table 1volt-deviceλ maxagelepeeqeidhostdopant[nm][v][cd/a][lm/w](%)device 1h-1compound 15137.52.31.00.9device 2h-2compound 15146.82.51.10.9 device 1 and 2 were fabricated using h-1 and h-2 as the host respectively. the external quantum efficiency (eqe) of 0.9% and 0.9% was observed at the current density of 10 ma/cm 2 . the photoluminescence quantum yield (plqy) of films of 5% of compound 1 doped into h-1 and h-2 was meausured to be 9% and 8% respectively. for a standard fluorescent oled material with only emission from singlet excition, the maximum eqe will be 25% because of the spin statistics limit. the outcouping effciency of a bottom-emitting oled device is considered to be around 20-25%. therefore, the maxium eqe of devices using compound 1 as the emitter are not expected to exceed 0.6% (plqy×0.25×0.25). the observed eqe of both devices, however, are exceeding the theoretical limit. the results suggest the invented example (compound 1) possibly exhibits thermally activated delayed fluorescence (tadf) property. it is understood that the various embodiments described herein are by way of example only, and are not intended to limit the scope of the invention. for example, many of the materials and structures described herein may be substituted with other materials and structures without deviating from the spirit of the invention. the present invention as claimed may therefore include variations from the particular examples and preferred embodiments described herein, as will be apparent to one of skill in the art. it is understood that various theories as to why the invention works are not intended to be limiting.
028-869-141-104-733	US	[ "AU", "WO", "EP", "US", "CA", "JP" ]	A61M25/01,A61M25/088	1997-12-30T00:00:00	1997	[ "A61" ]	deflectable guiding catheter	a deflectable guiding catheter generally having an elongated shaft with a deflectable distal section, a second lumen, a first lumen in fluid communication with a port in the distal end of the shaft, an elongated tapered deflection line within the second lumen, and reinforcement strands within a wall of the shaft. the first lumen is independent from the second lumen, and is therefore not obstructed by the deflection line. the longitudinal axes of the second lumen and first lumen are axially aligned with respect to one another, and are eccentric to the shaft longitudinal axis. the reinforcement strands and the deflection line extend in at least a portion of the deflectable distal shaft section to a location spaced proximally of the distal end of the deflectable distal shaft section.	what is claimed is: 1 . a guiding catheter, comprising, a) an elongated catheter shaft having a proximal end and a distal end, a relatively stiff proximal section, a deflectable distal section, and a longitudinal axis; b) a first lumen eccentric to the longitudinal axis of the shaft; c) a second lumen axially aligned with the first lumen and eccentric to the longitudinal axis; d) an elongated deflection member which has proximal and distal ends, which is disposed in the second lumen, and which has the distal end thereof secured within the shaft; and e) a port on the distal end of the shaft in fluid communication with the first lumen. 2. the catheter of claim 1 wherein the second lumen extends from the shaft proximal end and within at least a portion of the deflectable distal section to a location spaced proximally from the distal end of the catheter shaft. 3. the catheter of claim 2 wherein the deflectable distal section is about 5 to about 1 5 cm in length. 4. the catheter of claim 3 wherein the second lumen extends in about 4 to about 1 2 cm of the length of the deflectable distal section. 5. the catheter of claim 3 wherein the deflection line extends in about 4 to about 1 2 cm of the length of the deflectable distal section. 6. the catheter of claim 1 wherein the first lumen extends from the shaft proximal end to the port in the shaft distal end. 7. the catheter of claim 1 includinge reinforcements embedded in the shaft. 8. the catheter of claim 7 wherein the reinforcements are wire braids. 9. the catheter of claim 8 wherein the wire braids extend from the proximal end of the shaft to within at least a portion of the deflectable distal section. 10. the catheter of claim 9 wherein the wire braids extend to a location spaced proximally from a distal end of the second lumen. 1 1 . the catheter of claim 10 wherein the wire braids extend in about 1 to about 2.5 cm of the length of the deflectable distal section. 1 2. the catheter of claim 1 wherein the elongated deflection line has a tapered distal section with a radially decreasing diameter. 1 3. the catheter of claim 1 1 wherein the length of the deflection line tapered distal section is about 6 to about 1 5 cm. 14. the catheter of claim 1 wherein the first lumen has a diameter of about 0.09 to about 0.26 cm. 1 5. the catheter of claim 1 wherein the catheter outer diameter is about 0.20 to about 0.37 cm. 1 6. the catheter of claim 1 including a soft atraumatic distal tip on the distal end of the shaft, having a lumen extending therein in fluid communication with the first lumen, and having a port in the distal end.	deflectable guiding catheter background of the invention the invention relates to the field of intraluminal catheters, and more particularly to a guiding catheter having a deflectable distal end. guiding catheters are used in many percutaneous intravascular procedures to guide diagnostic and therapeutic devices or fluids, and the like, to a desired location within the patient. for example, a guiding catheter is typically used in conjunction with balloon catheters used in angioplasty procedures and electrophysiology (ep) devices used for ablation or mapping of cardiac tissue. u.s. patent no. 5,509,41 1 , incorporated by reference (littmann et al.) is an example of an ep catheter. in the design of guiding catheters, different and often competing considerations relating to catheter flexibility and strength must be balanced. the guiding catheter proximal section must have sufficient flexibility and strength to be advanceable and torqueable, and have sufficient column strength to limit shaft buckling. the distal end of the guiding catheter is typically more flexible than the proximal section, to provide maneuverability and to prevent trauma to the patient's vasculature. however, the distal end must have sufficient strength to prevent kinking during advancement. while a large delivery lumen is desirable for delivering devices such as ep catheters, the outer diameter of the catheter must be minimized so that the catheter can be readily advanced within the patient. therefore, when the catheter contains a large delivery lumen, the walls of the catheter are necessarily thin in order to minimize the outer diameter of the guiding catheter. typically, a tubular or braided metal line reinforcement may be provided within a wall of the catheter. the line reinforcement stiffens the catheter and transmits torque to the catheter distal end as the proximal end of the catheter outside the patient is rotated . the distal end of the guiding catheter frequently needs to be bent or shaped while within the patient. the bent shape is useful in guiding the catheter distal end into a desired body lumen or chamber. for example, during an ep ablation or mapping procedure, the guiding catheter must be maneuvered through a patient's branched vasculature to advance an ep device into a patient's coronary sinus. moreover, the shaped or shapeable distal end of the guiding catheter is used to orient the distal tip of the ep device with respect to tissue, such as a patient's endocardium, to facilitate proper delivery of the device's rf or laser energy to the tissue. consequently, the guiding catheter may be provided with a preformed distal tip which may be guided into the desired location in the patient by rotating the proximal end of the guiding catheter from outside the patient. additionally, the guiding catheter may be provided with a deflection mechanism to reversibly deflect the distal tip while within the patient. one difficulty has been providing a deflectable guiding catheter having sufficient column strength and torque transmission in combination with a relatively large lumen for delivering devices such as ep catheters. moreover, many prior deflectable catheters are typically limited to uniplanar deflection, which requires the catheter shaft to be rotated from its proximal end located outside of the patient in order to place to deflected tip into a desired plane, as, for example, to place the distal tip of the catheter into a desired branched vessel or in contact with a desired tissue wall. what has been needed is a catheter with a kink resistant, torqueable, and deflectable shaft which nonetheless defines a large unobstructed lumen for receiving a device therein. the present invention satisfies these and other needs. summary of the invention the invention is directed to a catheter comprising an elongated shaft which has a deflectable distal section and an unobstructed delivery lumen, with kink resistance and torque transmission. the guiding or delivery catheter of the invention generally has an elongated shaft with a deflectable distal section, a deflection line lumen, and a delivery lumen in fluid communication with a port in the distal end of the shaft. an elongated, preferably tapered, deflection line is disposed within the deflection line lumen. preferably the wall of the shaft has reinforcing or stiffening strands or fibers which may be braided or wound. the longitudinal axes of the deflection line lumen and delivery lumen are axially aligned with respect to one another, and are eccentric to the central longitudinal axis of the shaft. the phrase "axially aligned" refers to the fact that the two lumens are aligned along a bisecting plane intersecting the central longitudinal axis of the shaft. to selectively deflect the shaft distal section, the operator moves the deflection line longitudinally. from an undeflected position aligned with the shaft longitudinal axis, the distal shaft section is deflected away from the shaft longitudinal axis by pulling the line proximally out the proximal end of the shaft. in one embodiment, if the deflection line is stiff enough, the deflection line may be moved longitudinally toward the distal end of the shaft to deflect the shaft distal section in an opposite direction. in one example, the catheter is provided with a steering mechanism on the catheter proximal end, which facilitates the longitudinal movement of the deflection line by the operator. the catheter of the invention is kink resistant and torqueable. the deflection line, which extends to the distal end of the deflection line lumen, provides column strength and is tapered to provide a smooth transition of stiffness from the catheter proximal shaft section to the deflectable distal shaft section. the distal end of the deflection line lumen extends into at least a portion of the deflectable distal shaft section to a location spaced proximally from the distal end of the deflectable distal shaft section. the deflection line generally extends in about 70% to about 95%, preferably about 85% to about 90%, of the total length of the deflectable distal shaft section. the distal end of the shaft is provided with improved flexibility due to the deflection line terminating proximal to the distal tip of the shaft. the shaft is reinforced with suitable reinforcing strands or fibers, such as stiffening wire braids, which contribute to the shaft column strength and torque transmission. the reinforcement extends at least into a portion of the deflectable distal shaft section. generally the reinforcement extends in about 1 5% to about 50%, preferably about 25% to about 45% of the total length of the deflectable distal shaft section. the reinforcements are preferably made of stainless steel, although other materials with similar stiffness are suitable, such as nitinol, mp35n, elginoy, and high strength polymer materials such as polyamide and kevlar ® . the delivery lumen of the guiding catheter is independent from, or fluidly sealed from, the deflection line lumen, and thus provides an unobstructed passageway for slidably receiving an ep or other therapeutic or diagnostic agent or device. because the guiding catheter of the invention provides superior control in accessing desired cardiovascular structure, it is particularly useful in supporting and delivering an ep mapping or ablation catheter to various locations in cardiac chambers for diagnosis or therapy. for example, the guiding catheter of the invention may be advanced into the right atrium of the heart from the inferior vena cava to position the operative distal end of an ep catheter within the right atrium above the tricuspid valve. the electrodes on the distal end of the ep catheter can then be put into operative contact with the cardiac tissue of the right atrium by torquing and/or deflecting the tip of the guiding catheter of the invention. consequently, where a plurality of electrodes are on the ep device distal end, the range of movement and control of the guiding catheter of the invention allows for all the electrodes to be in contact with the cardiac tissue together, so that a more extensive area may be operatively engaged with the device at a given time. in this manner a continuous lesion may be formed from a plurality of individual ablations. the guiding catheter of the invention has a deflectable distal shaft section and an unobstructed delivery lumen available for delivering therapeutic and diagnostic devices, yet has sufficient strength to transmit torque and resist kinking. by offsetting the central axes of the two lumens from the shaft longitudinal axis and axially aligning the two lumens, while reinforcing the shaft with the deflection line and line braids, the catheter transmits torque and resists kinking. these and other advantages of the invention will become more apparent from the following detailed description of the invention and the accompanying exemplary drawings. brief description of the drawings fig. 1 is a longitudinal view, partially in longitudinal cross- section, of a guiding catheter embodying features of the invention. fig. 2 is a cross section of the catheter shown in fig. 1 taken along lines 2-2. fig. 3 is a cross section of the catheter shown in fig. 1 taken along lines 3-3. fig. 4 is a cross section of the catheter shown in fig. 1 taken along lines 4-4. fig. 5 is a longitudinal view of a catheter of the invention showing the deflection of the distal shaft section, and an ep device located therein. fig. 6 is a longitudinal view, partially in section, of a handle for use with the catheter of the invention. fig. 7 illustrates a transverse cross section of the handle shown in fig. 6 taken along lines 7-7. fig. 8 illustrates a guiding catheter of the invention, and an ep device located therein, positioned in the right atrium of a heart. fig. 9 illustrates a guiding catheter of the invention, and an ep device located therein, in the left atrium of the heart by transseptal insertion. fig. 10 illustrates a guiding catheter of the invention, and an ep device located therein, in the left atrium by retrograde insertion. detailed description of the invention fig. 1 illustrates an embodiment of a guiding catheter 10 of the invention comprising an elongated shaft 1 1 having a proximal end 1 2 and a distal end 1 3 and a deflectable distal shaft section 14. a first lumen 16, located eccentric to the shaft longitudinal axis, extends within the shaft 1 1 to a port 1 7 in the shaft distal end 1 3. a second lumen 1 8, located eccentric to the shaft longitudinal axis and axially aligned with the first lumen 1 6, extends to a location proximal to the shaft distal end 1 3. an elongated deflection line, or member, 1 9 is received within the second lumen 1 8, and has a tapered distal section 20 with a radially decreasing diameter. stiffening wire braids 21 , embedded in the shaft 1 1 , reinforce the shaft to provide sufficient column strength and rigidity for shaft kink resistance and torqueability. in fig. 1 , dashed lines illustrate the location of the axes of the lumens 1 6, 1 8 and the axis of the shaft 1 1 . as illustrated in figs. 2-4, showing transverse cross sections of the catheter shown in fig. 1 , the first lumen 1 6 and the second lumen 1 8 are axially aligned with respect to one another and are eccentric to the shaft longitudinal axis. thus, the axis 60 of the first lumen 1 6 and the axis 61 of the second lumen 1 8 are aligned along a plane intersecting the central axis 62 of the shaft 1 1 . in one embodiment, the first lumen 1 6 is lined with a liner 26 having a lubricious surface which facilitates advancement of a device slidably received within the first lumen 16. the lubricious liner 26 may be made of fluoropolymer. the length of the guiding catheter 10 may be about 60 cm to about 1 20 cm in working length, typically about 80 to about 100 cm for use with an ep catheter. the length of the deflectable distal shaft section 14 is about 5 cm to about 1 5 cm, preferably about 7 to about 10 cm. the wire braids 21 extend from the proximal end 1 2 of the shaft 1 1 and within at least a proximal portion 23 of the deflectable distal shaft section 14, to a location spaced proximally from the shaft 1 1 distal end 1 3. in a presently preferred embodiment, the length of the deflectable distal shaft section 14 having wire braids 21 located therein is about 1 .0 cm to about 2.5 cm. the deflection line total length depends on the length of the catheter. the second lumen 18, and deflection line 19 therein, extend from the proximal end 1 2 of the shaft at least into the deflectable distal shaft section 14 to a location spaced proximally of the distal end of the catheter shaft. in a presently preferred embodiment, the length of the deflection line located within the deflectable distal shaft section 14 is about 4 cm to about 1 2 cm, preferably about 5 cm to about 10 cm, and the length of the deflection line 19 extending beyond the distal end of the wire braids 21 is about 1 .5 cm to about 10 cm, preferably about 2.5 cm to about 7 cm. the distal end of the deflection line 1 9 is secured to the catheter shaft 1 1 at the distal end of the second lumen 18. in the embodiment illustrated in fig. 1 , an annular clamp 25 secures the deflection line 1 9 to the shaft 1 1 . the deflection line, if formed out of stainless steel wire, has a diameter of about 0.006 inch (0.01 5 cm) to about 0.01 5 inch (0.04 cm), preferably about 0.008 inch (0.02 cm) to about 0.01 2 inch (0.03 cm), which tapers to a smaller diameter at the distal extremity of the line. the length of the tapered distal section 20 is about 6 to about 15 cm, preferably about 8 cm to about 1 2 cm. the tapered line 1 9, in conjunction with other features of the invention, provides sufficient column strength that allows the guiding catheter to be deflected in two directions. the guiding catheter 10 has an outer diameter (od) of about 5 french (0.1 7 mm) to about 1 5 fr (0.5 mm), preferably about 6 fr (0.2 mm) to about 12 fr (0.4 mm) . the diameter of the first lumen will be determined by the device to be delivered, and usually should be about 0.010 inch (0.025 cm) larger than the od of the device to be delivered. the diameter of the first lumen may range from about 0.035 inch (0.09 cm) to about 0.105 inch (0.26 cm), and preferably about 0.045 inch (0.1 1 cm) to about 0.105 inch (0.26 cm), and is typically about 0.05 inch (0.1 3 cm) to about 0.08 inch (0.20 cm) for use with an ep catheter. as best illustrated in figs. 2-4, the catheter shaft 1 1 has a two layer construction, with an outer jacket 27 surrounding a core 28. the outer jacket 27 is preferably a thermoplastic material such as a thermoplastic polyurethane (pu) or pu blend, and the core 28 is preferably a thermoplastic pu or pu blend. while the outer diameter of the shaft 1 1 is constant, the outer diameter of the core 28 steps down to a smaller diameter at a location distal to the distal end of the second lumen. the outer jacket 27 has a wall thickness of about 0.004 inch (0.01 cm) to about 0.009 inch (.023 cm), preferably about 0.005 inch (0.01 3 cm) to about 0.007 inch 0.018 cm) in a section of the shaft 1 1 containing the first lumen 1 6 and the second lumen 1 8, and a nonuniform wall thickness of about 0.006 inch (0.01 5 cm) to about 0.025 inch (0.064 cm) in a section of the shaft located distally from the distal end of the second lumen 1 8. the core 28 defines the shaft lumens, and has a first diameter of about 0.060 inch (0.1 5 cm) to about 0.062 inch (0.1 6 cm) in a section of the shaft 1 1 containing the first lumen 16 and the second lumen 18, and a second diameter of about 0.014 inch (0.036 cm) to about 0.01 6 inch (0.04 cm) in a section of the shaft located distally from the distal end of the second lumen 18. fig. 5 illustrates the deflection of the distal shaft section 14 in two opposite directions. in the embodiment illustrated in fig. 5, ep device 32, having a plurality of electrodes 34, is within the first lumen 16. by deflecting the distal shaft section 14, a diagnostic or therapeutic device in the first lumen 16 can be accurately positioned within the patient. as illustrated in fig. 1 , a handle 30 may be provided on the proximal end 1 2 of the shaft 1 1 , with a mechanism for moving the deflection line 1 9 longitudinally to deflect the distal shaft section 20. a presently preferred embodiment of a handle 30, illustrated in fig. 6, generally comprises a sliding member 31 slidably disposed about a connecting member 33 and an inner member 35, and one or more o-rings 36 disposed about connecting member 33 and inner member 35. inner member 35 has a lumen 37 extending therein from a port in the proximal end to a port in the distal end of the inner member. fig. 7 illustrates a transverse cross-section of the handle shown in fig. 6, taken along lines 7-7. connecting member 33 releasably secures the proximal end 1 2 of the catheter shaft to handle 30. the sliding member 31 secures to the proximal portion of the deflection line 1 9 by a variety of suitable means including screws, hooks, and clamp connectors, such as clamping plates shown in fig. 6. the sliding member 31 generally comprises two joined pieces which may be separated to expose the deflection line securing means. when sliding member 31 , and the deflection line secured thereto, are longitudinally displaced, the distal shaft section 14 is deflected in either of two opposite directions depending on whether the sliding member is displaced proximally or distally. o- rings 36 between the sliding member 31 and the inner member 35 and connecting member 33 provide a frictional stop on the displacement of the sliding member, so that sliding member 31 can be smoothly displaced when pulled or pushed by the operator but remains set in any deflected position without the need of a separately actuated lock. in the embodiment shown in fig. 6, the connecting member 33 tapers toward the distal end, and ridges are provided on the distal end for frictional engagement with optional strain relief member 38. outer member 39, disposed about the inner member 35, provides a comfortable grip for the operator. a radially enlarged finger grip is provided on the sliding member, and may have grooves on an outer surface to improve the operator's grip on the sliding member. the guiding catheter of the invention may be used with other suitable handle configurations. for example, the handle may be provided with a knob which is rotated clockwise to longitudinally move the deflection line 19 in a distal direction toward the distal end of the catheter 10 and counterclockwise to move the deflection line in a proximal direction away from the distal end of the catheter. the range of movement and control provided by the guiding catheter of the invention provides for superior access to desired cardiac structure. fig. 8 illustrates a heart 40, and the anatomy of the heart including the left atrium 41 and left ventricle 42, and the right atrium 43 and right ventricle 44 separated by the tricuspid valve 45. the inferior vena cava 46 and superior vena cava 47 deliver deoxygenated blood from the body tissues, into the right atrium, from where it is pumped through the tricuspid valve 45 and ultimately into the lungs for reoxygenation. in fig. 8, the guiding catheter 10, and ep catheter 32 therein, are shown in the inferior vena cava 46 and the right atrium 43 above the tricuspid valve 45. the position of the guiding catheter 10 allows a plurality of the electrodes 34 on the ep catheter 32 distal end to be placed in operative contact with the cardiac tissue of the right atrium 43. fig. 9 illustrates the distal end of the guiding catheter 10, and ep catheter 32 therein, positioned in the left atrium transseptally through the fossa ovalis. as illustrated in fig. 10, the guiding catheter can also be advanced into the left cardiac chambers retrogradely through the aortic and mitral valves. fig. 10 illustrates the operative distal end of the ep catheter positioned in the left atrium, where a distal section of the catheter is shown projecting out of the plane of the figure. the material used to make the deflectable distal shaft section 14 may be softer or more flexible from the material used in the remainder of the catheter shaft 1 1 . in one embodiment, a soft atraumatic distal tip 29, illustrated in fig. 5, is provided on the distal end 1 3 of the shaft, with a lumen 50 and a distal end port in fluid communication with the first lumen 1 6. while the present invention has been described herein in terms of certain preferred embodiments, modifications and improvements may be made to the invention without departing from the scope thereof.
032-266-072-254-608	US	[ "EP", "DE", "JP", "US" ]	G03G5/05,G03G5/14	1990-10-26T00:00:00	1990	[ "G03" ]	electrophotographic imaging members containing a polyurethane adhesive layer.	a process for fabricating an electrophotographic imaging member including providing a substrate having an electrically conductive surface, applying an aqueous dispersion or aqueous latex comprising a semi-interpenetrating polymer network containing a self-cross-linkable polyurethane and a non-self-crosslinkable polyurethane, solidifying the polyurethanes to form a continuous adhesive layer, forming a thin homogeneous charge generating layer on the adhesive layer, applying a coating of a solution of a charge transport layer forming composition comprising a film forming polymer dissolved in an organic solvent and solidifying the polymer to form a charge transport layer. the photoreceptor prepared by this process comprises a substrate having an electrically conductive surface, an adhesive layer comprising a semi-interpenetrating polymer networks of a self-cross-linked polyurethane and a non-self-crosslinkable polyurethane, a thin homogeneous charge generating layer, and a charge transport layer comprising a film forming polymer.	1. a process for fabricating an electrophotographic imaging member comprising providing a substrate having an electrically conductive surface, applying an aqueous dispersion or aqueous latex comprising a non-self-crosslinkable polyurethane and a self-crosslinkable polyurethane, solidifying said polyurethane to form a continuous adhesive layer having a semi-penetrating network structure, forming a thin homogeneous charge generating layer on said adhesive layer, applying a coating of a solution of a charge transport layer forming composition comprising a film forming polymer dissolved in an organic solvent and solidifying said polymer to form a charge transport layer. 2. a process for fabricating an electrophotographic imaging member according to claim 1 wherein the dried thickness of said adhesive layer is between about 400 angstroms and about 1800 angstroms. 3. a process for fabricating an electrophotographic imaging member according to claim 1 wherein the dried thickness layer of said adhesive layer is between 800 and 1200 angstroms. 4. a process for fabricating an electrophotographic imaging member according to claim 1 wherein the solids content in said aqueous dispersion is between about 30 percent by weight and about 40 percent by weight, based on the total weight of said dispersion. 5. a process for fabricating an electrophotographic imaging member according to claim 1 wherein the solids weight ratio of said non-self-crosslinkable polyurethane to said self-crosslinkable polyurethane in said aqueous dispersion is between about 80:20 and about 60:40. 6. a process for fabricating an electrophotographic imaging member according to claim 1 wherein said self-crosslinkable polyurethane has terminal groups selected from aziridinyl-, mercapto-, amino-, epoxy- , chloromethyl, carboxyl- and alkoxymethyl- groups. 7. a process for fabricating an electrophotographic imaging member according to claim 1 wherein said non-self-crosslinkable polyurethane is a hydroxy-terminated polyurethane represented by the formula: ho-[-co-nh-r-nh-co-0-r'-o-].-h wherein r and r' are substituted or substituted alkyl groups having 1 to 10 carbon atoms and x is 1 to about 5000. 8. a process for fabricating an electrophotographic imaging member according to claim 1 forming on said adhesive layer a thin homogeneous charge generating layer having thickness of between about 5000 angstroms and about 9000 angstroms. 9. a process for fabricating an electrophotographic imaging member according to claim 8 including vacuum depositing said charge generating layer. 10. a process for fabricating an electrophotographic imaging member according to claim 8 including dispersion coating said charge generating layer. 11. a process for fabricating an electrophotographic imaging member according to claim 11 including forming a charge blocking layer having a thickness between about 200 and about 400 angstroms between said electrically conductive surface and said adhesive layer. 12. a process for fabricating an electrophotographic imaging member according to claim 1 wherein said solution of said charge transport layer forming composition comprises a film forming polymer dissolved in an organic solvent which dissolves, swells or diffuses through said adhesive layer. 13. a process for fabricating an electrophotographic imaging member according to claim 1 wherein said substrate is a thin flexible web. 14. an electrophotographic imaging member comprising a substrate having an electrically conductive surface, a dried adhesive layer comprising a semi-interpenetrating network derived from a coating mixture comprising a blend of a self-crosslinkable polyurethane and a non-self-crosslinkable polyurethane, a thin homogeneous charge generating layer, and a charge transport layer comprising a film forming polymer. 15. an electrophotographic imaging member according to claim 14 wherein the solids weight ratio of said non-self-crosslinkable polyurethane to the self-crosslinkable polyurethane in said adhesive layer is between about 80:20 and about 60:40. 16. an electrophotographic imaging member according to claim 14 wherein the thickness of said adhesive layer is between about 400 angstroms and about 1800 angstroms. 17. an electrophotographic imaging member according to claim 14 wherein the thickness of said adhesive layer is between about 800 angstroms and about 1200 angstroms. 18. an electrophotographic imaging member according to claim 14 wherein said thin homogeneous charge generating layer has thickness of between about 5000 angstroms and about 9000 angstroms. 19. an electrophotographic imaging member according to claim 14 wherein said charge generating layer comprises benzimidazole perylene. 20. an electrophotographic imaging member according to claim 14 wherein said substrate is a thin flexible web.	background of the invention this invention relates in general to electrophotographic imaging members, and more specifically, to the use of an aqueous dispersion or latex of a mixture of certain polyurethanes to form an adhesive layer during the preparation of an electrophotographic imaging member and to electrophotographic imaging members containing this adhesive layer. in the art of electrophotography an electrophotographic plate comprising a photoconductive insulating layer on a conductive layer is imaged by first uniformly electrostatically charging the imaging surface of the photoconductive insulating layer. the plate is then exposed to a pattern of activating electromagnetic radiation such as light, which selectively dissipates the charge in the illuminated areas of the photoconductive insulating layer while leaving behind an electrostatic latent image in the non-illuminated area. this electrostatic latent image may then be developed to form a visible image by depositing finely divided electrostatically attractable toner particles on the surface of the photoconductive insulating layer. the resulting visible toner image can be transferred to a suitable receiving member such as paper. this imaging process may be repeated many times with reusable photoconductive insulating layers. the electrophotographic imaging member may be multilayered photoreceptor that comprises a substrate, a conductive layer, a charge blocking layer, an adhesive layer, a charge generating layer, and a charge transport layer. although excellent toner images may be obtained with multilayered photoreceptors, it has been found that when attempts to fabricate multilayered photoreceptors in which the charge generating layer is a thin homogeneous layer formed by vacuum deposition or sublimation on a solvent soluble or solvent swellable adhesive layer, a pattern of cracks form in the charge generating layer when coating solutions of charge transport material are applied to the thin charge generating layer. the pattern of cracks print out during development and the pattern is visible in the final xerographic copy. this pattern of cracks prevents use of these photoreceptors in systems that require long service life flexible belt photoreceptors in compact imaging machines that employ small diameter support rollers for photoreceptor belt systems operating in a very confined space. small diameter support rollers are also highly desirable for simple, reliable copy paper stripping systems which utilize the beam strength of the copy paper to automatically remove copy paper sheets from the surface of a photoreceptor belt after toner image transfer. unfortunately, small diameter rollers, e.g., less than about 0.75-inch (19-mm) diameter, raise the threshold of mechanical performance criteria to such a high level that photoreceptor belt seam failure can become unacceptable for multilayered belt photoreceptors. thus, in advanced imaging systems utilizing multilayered belt photoreceptors, cracking and delamination has been encountered during belt cycling over small diameter rollers. frequent photoreceptor cracking and delamination has a serious impact on the versatility of a photoreceptor and prevents its use in automatic electrophotographic copiers, duplicators and printers. information disclosure statement us-a 4,921,769 to yuh et al. issued on may 1, 1990 - an imaging member is disclosed comprising an optional supporting substrate; a ground plane layer; a blocking layer; an optional adhesive layer; a photogenerator layer; and a charge transport layer, wherein the blocking layer comprises certain specified polyurethanes. us-a 4,571,371 to yashiki issued - an electrophotographic photosensitive member is disclosed comprising a resin or adhesive layer between a substrate and a photoconductive layer. the adhesive layer may be composed of water soluble resins like polyacrylic acids and polyamide resins like polyurethane elastomers. us-a 4,578,333 to staudenmayer et al. issued - an imaging member is disclosed comprising a charge generating layer comprising a photoconductive pigment such as a perylene compounds, a charge transport layer and an acrylonitrile copolymer interlayer disposed between the charge generating layer and the support. the acrylonitrile interlayer exhibits adhesion and freedom from cracking defects. see, for example, column 2, lines 8-13. us-a 3,932,179 to perez-albuerne issued - an electrophotographic element is disclosed comprising a conductive layer, a photoconductive layer and a polymeric interlayer. the interlayer is composed of (1) a hydrophobic polymer as a first polymeric phase and (2) a water on alkali soluble polymer as the second polymeric phase. this interlayer may serve as both a barrier and an adhesive layer. polymers of poly-(acrylic) acid are typical examples of the water soluble polymer. us-a 3,775,108 to arai et al. issued - an electrophotographic copying material is disclosed comprising an intermediary layer between a photoconductive layer and a support. the intermediary layer is composed of an acrylic emulsion, a polyurethane and a water soluble amino resin. summary of the invention it is an object of the present invention to provide improved electrophotographic imaging members which overcomes the above-noted deficiencies. it is yet another object of the present invention to provide improved electrophotographic imaging members which resist cracking. it is still another object of the present invention to provide improved electrophotographic imaging members which resist delamination due to good adhesion at the interface. it is another object of the present invention to provide improved electrophotographic imaging members which do not show print defects due to cracked interface. it is yet another object of the present invention to provide improved electrophotographic imaging members which exhibit long cyclic electrical stability resulting from dimensional stability. the foregoing objects and others are accomplished in accordance with this invention by providing a process for fabricating an electrophotographic imaging member comprising providing a substrate having an electrically conductive surface, applying an aqueous dispersion or aqueous latex comprising a semi-interpenetrating polymer network (semi-ipn) containing a self-cross-linkable polyurethane and a non-self-crosslinkable polyurethane, solidifying the polyurethanes to form a continuous adhesive layer, forming a thin homogeneous charge generating layer on the adhesive layer, applying a coating of a solution of a charge transport layer forming composition comprising a film forming polymer dissolved in an organic solvent and solidifying the polymer to form a charge transport layer. the photoreceptor prepared by this process comprises a substrate having an electrically conductive surface, an adhesive layer comprising a semi-ipn of a self-cross-linked polyurethane and a non-self-crosslinkable polyurethane, a thin homogeneous charge generating layer, and a charge transport layer comprising a film forming polymer. the substrate may be opaque or substantially transparent and may comprise numerous suitable materials having the required mechanical properties. accordingly, the substrate may comprise a layer of an electrically non-conductive or conductive material such as an inorganic or an organic composition. as electrically non-conducting materials there may be employed various resins known for this purpose including polyesters, polycarbonates, polyamides, polyurethanes, and the like which are flexible as thin webs. the electrically insulating or conductive substrate can be flexible and in the form of an endless flexible belt. preferably, the endless flexible belt shaped substrate comprises a commercially available biaxially oriented polyester known as mylar, available from e. i. du pont de nemours & co. or melinex available from ici. other film-forming polymers, such as polyether sulfone, which has a linear thermal expansion coefficient matching that of polycarbonate, are also applicable as a substrate. the thickness of the substrate layer depends on numerous factors, including beam strength and economical considerations, and thus this layer, for a flexible belt, may be of substantial thickness, for example, about 125 micrometers, or of minimum thickness less than 50 micrometers, provided there are no adverse effects on the final electrostatographic device. in one flexible belt embodiment, the thickness of this layer ranges from about 65 micrometers to about 150 micrometers, and preferably from about 75 micrometers to about 100 micrometers for optimum flexibility and minimum stretch when cycled around small diameter rollers, e.g. 19 millimeter diameter rollers. the surface of the substrate layer is preferably cleaned prior to coating to promote greater adhesion of the deposited coating. cleaning may be effected, for example, by exposing the surface of the substrate layer to plasma discharge, ion bombardment and the like. the conductive layer may vary in thickness over substantially wide ranges depending on the optical transparency and degree of flexibility desired for the electrostatographic member. accordingly, the substrate may be quite thick it if it is in the form of a metal drum or plate. for a flexible photoresponsive imaging device, the thickness of the conductive layer may be between about 20 angstrom units to about 750 angstrom units, and more preferably from about 100 angstrom units to about 200 angstrom units for an optimum combination of electrical conductivity, flexibility and light transmission. the flexible conductive layer may be an electrically conductive metal layer formed, for example, on the substrate by any suitable coating technique, such as a vacuum depositing technique. typical metals include aluminum, zirconium, niobium, tantalum, vanadium and hafnium, titanium, nickel, stainless steel, chromium, tungsten, molybdenum, and the like. typical vacuum depositing techniques include sputtering, magnetron sputtering, rf sputtering, and the like. if desired, an alloy of suitable metals may be deposited. typical metal alloys may contain two or more metals such as zirconium, niobium, tantalum, vanadium and hafnium, titanium, nickel, stainless steel, chromium, tungsten, molybdenum, and the like, and mixtures thereof. regardless of the technique employed to form the metal layer, a thin layer of metal oxide forms on the outer surface of most metals upon exposure to air. thus, when other layers overlying the metal layer are characterized as "contiguous" layers, it is intended that these overlying contiguous layers may, in fact, contact a thin metal oxide layer that has formed on the outer surface of the oxidizable metal layer. generally, for rear erase exposure, a conductive layer light transparency of at least about 15 percent is desirable. the conductive layer need not be limited to metals. other examples of conductive layers may be combinations of materials such as conductive indium tin oxide or copper iodide as a transparent layer for light having a wavelength between about 4000 angstroms and about 7000 angstroms or a conductive carbon black dispersed in a plastic binder as an opaque conductive layer. a typical electrical conductivity for conductive layers for electrophotographic imaging members in slow speed copiers is about 10 2 to 10 3 ohms/square. if desired, the conductive layer can also be constructed from any suitable thin film of conductive polymers. typical conductive polymers, include polyaniline, polyacetylene (stabilized against oxidation), polyphenylene, polythiophene, polypyrrole, and the like. a hole blocking layer may be applied to the electrically conductive surface of the substrate. generally, electron blocking layers for positively charged photoreceptors allow holes from the imaging surface of the photoreceptor to migrate toward the conductive layer. any suitable blocking layer capable of forming an electronic barrier to holes between the adjacent photoconductive layer and the underlying conductive layer may be utilized. the blocking layer may be nitrogen containing siloxanes or nitrogen containing titanium compounds such as trimethoxysilyl propylene diamine, hydrolyzed trimethoxysilyl propyl ethylene diamine, n-beta-(aminoethyl) gamma-amino-propyl trimethoxy silane, isopropyl 4-aminobenzene sulfonyl, di-(dodecylbenzene sulfonyl) titanate, isopropyl di(4-aminobenzoyl)isostearoyl titanate, isopropyl tri(n-ethylaminoethylamino)titanate, isopropyl trianthranil titanate, isopropyl tri(n,n-dimethyl-ethylamino)titanate, titanium-4-amino benzene sulfonatoxyacetate, titanium 4-aminobenzoate isostearate oxyacetate, [h 2 n(ch 2 )-4]chasi(ocha)2, (gamma-aminobutyl) methyl diethoxysilane, and [h 2 n(ch 2 ) 3] ch 3 si(och 3 ) 2 (gamma- aminopropyl) methyl diethoxysilane, as disclosed in us-a 4,291,110, 4,338,387, 4,286,033 and 4,291,110. the disclosures of us-a 4,338,387, 4,286,033 and 4,291,110 are incorporated herein in their entirety. a preferred blocking layer comprises a reaction product between a hydrolyzed silane and the oxidized surface of a metal ground plane layer. the oxidized surface inherently forms on the outer surface of most metal ground plane layers when exposed to air after deposition. the blocking layer may be applied by any suitable conventional technique such as spraying, dip coating, draw bar coating, gravure coating, silk screening, air knife coating, reverse roll coating, vacuum deposition, chemical treatment and the like. for convenience in obtaining thin layers, the blocking layers are preferably applied in the form of a dilute solution, with the solvent being removed after deposition of the coating by conventional techniques such as by vacuum, heating and the like. the blocking layer should be continuous and have a thickness of less than about 0.2 micrometer because greater thicknesses may lead to undesirably high residual voltage. the adhesive layer of this invention may applied to the optional hole blocking layer or directly to the electrically conductive surface on the substrate if the blocking layer is incorporated in the adhesive layer. the adhesive layer coating composition comprises a blend of an aqueous dispersion of a self cross-linkable polyurethane and a non-crosslinkable polyurethane. an aqueous dispersion is defined as a colloidal system containing particles (or globules) smaller than 1 micrometer, in which the particles are the dispersed phase and the solvent, the dispersion medium. generally, the dispersion medium is water. the aqueous dispersions utilized in the adhesive coating of this invention are stable, comprise prepolymer globules dispersed in an aqueous medium, and are free of any solid particles larger than 1 micrometer. these globules are submicron in size. in contrast, an aqueous latex is defined as an emulsion containing oily droplets or low molecular weight oligomers dispersed in a medium such as water. the latex generally contains an emulsifier or surface-active agent, while the dispersion contains a built-in dispersant or self- dispersant. since the prepolymer in the polyurethane dispersion has a molecular weight between 20,000 and 30,000, it forms globules instead of droplets, thus, they are generally called a dispersion instead of an emulsion. the aqueous polyurethane dispersions utilized in the coating mixtures of this invention are very stable and contain a relatively high solid content. a typical commercially available aqueous polyurethane dispersion has about a 30 to 40 percent by weight solids content, based on the total weight of the dispersion. these stable dispersions are easily dilutable. for example, an aqueous dispersion of a non-self-crosslinkable polyurethane (witco w260, available from witco chemical company) weighing about 2.35 grams may be diluted with a 7.65 grams of alcohol to obtain a stable dispersion comprises 0.8 percent by weight solids, based on the total weight of the dispersion. although the expression "aqueous dispersion" will be frequently be referred to herein, it should be understood that in some situations an "aqueous latex" can be substituted for the "aqueous dispersion" because of the relatively low molecular weight of the prepolymer. when two linear polymers are mixed in the liquid state (dispersion, emulsion, solution, or bulk liquid prepolymer), and then crosslinked in situ in the presence or absence of a catalyst, an interpenetrating polymer network (ipn) is formed. if only one of the two linear polymers becomes crosslinked, then it is a semi-interpenetreting polymer network (semi-ipn). owing to the interwining of chains, the resulting networks are generally stronger than the pure blend without intertwining of chains. the above example of the blending of two polyurethanes is actually a semi-ipn. it is the formation of a semi-ipn that produces an adhesive layer with strong adhesive strength. there are at least six processes (see table 1) which have been used to prepare polyurethane dispersions: 1) dispersant, shear force process, 2) acetone process, 3) prepolymer mixing process, 4) melt- dispersion process, 5) ketimine/ketazin process, and 6) solids self-dispersing processes. all these process require a prepolymer which generally contains an excess of isocyanate groups. all six processes can produce the non-self-crosslinkable polyurethane. however, only processes no. 3, 5 and 6 can produce rather uniform submicron particles. depending upon the addition of end-capping compounds, three of these above processes (no. 2, no. 3 and no.4) can produce both 1) non-self-crosslinkable polyurethane and 2) self-crosslinkable polyurethane. among the three processes, process no. 3 is the prepolymer mixing process which is the only one that does not require the distillation of a solvent, such as acetone, from the dispersion, and can produce uniform submicron particles. for the adhesive application of this invention, the polyurethane dispersion by the third process is the preferred process which will be illustrated in detail. however, it is not intended that this invention be limited to this process alone. the third process involves anionic, cationic or nonionic prepolymers. for the anionic prepolymer, the general method of preparation is as follows: the polyhydroxy compounds can be any suitable polyether or polyester. in a specific example cited in this application, it is a polyester with the following generic formula: wherein r 1 represents a substituted or unsubstituted aliphatic group containing from 1 to 30 or more carbon atoms, r 2 represents a substituted or unsubstituted aliphatic group containing from 1 to 30 or more carbon atoms or a substituted or unsubstituted aromatic group, and x represents a whole number of at least one. the diisocyanates used have the generic formulae: aliphatic: o = c = n - r - n = c = o aromatic: o = c = n - ar - n = c = o wherein r represents a substituted or unsubstituted aliphatic group containing from 1 to 12 carbon atoms and ar represents a substituted or unsubstituted aromatic group. for example, the diisocyanates can be tolylene diisocyanate (tdi), isophorone diisocyanate (ipdi), 4,4'-dicyclohexyl-methane diisocyanate (h, 2 mdi), and the like. thus, prepolymer-ionomer with an average molecular weight of 20,000-30,000 containing an excess of isocyanate groups can be dispersed at 20 °c - 80 ° c in an aqueous solution containing 10% - 30% n-methyl pyrrolidone (nmp), which does not require a distillation step to remove it from the dispersion, and can then be flashed out during drying. the resultant dispersion contains polymer globules of approximately 0.1 micrometer -0.5 micrometer (or 100 nm - 500 nm) in size as the dispersed phase in water. at the completion of dispersion formation, all residual isocyanate groups should have been consumed to form urethane linkages (-nh-co-) or else and the polymer chains in the globules are generally, but not limited, to those terminated with hydroxy groups. other functional groups are aziridinyl-, mercapto-, amino-, epoxy-, chloromethyl, carboxyl-, alkoxymethyl-, and the like. for example, if the terminal groups are epoxy groups, or amino groups, they should be more reactive than hydroxyl groups and the polyurethane tends to self-crosslink readily upon drying. generally, a tertiary amine is added to neutralize the carboxyl group and control the ph value to about 8. this is called the amine extension. in the final dispersion, there may be some residual tertiary amine and 5% - 15% of n-methyl pyrrolidone. for the anionic prepolymer-ionomer, the polycarboxylates provide good hydrophobic properties, while polysulfonates give excellent stable dispersions. these dispersions produce final products, e.g., films, of good mechanical stability, chemical stability, good adhesion and gloss and good solvent resistance. thus, it is preferable to use the anionic dispersions as adhesives for photoconductors. though the above example illustrates anionic prepolymer-ionomers, in fact, a cationic prepolymer-ionomer can also be used. for example, the reaction of dibromide with a diamine can lead to quaternizing polyadditions. if one of these components contains a long-chain polyether-segment, a cationic ionomer is formed. cationic polyurethanes with tertiary sulfonium groups are prepared when tert-aminoglycol is substituted for thioglycol (bis-2-hydroxy-ethyl sufide). in addition to cationic prepolymers, nonionic prepolymers have also been used. these prepolymers contain some built-in ionic centers via a modified diol as a diisocyanate. however, the disadvantages of non-ionic dispersions are their increased sensitivity to water, e.g., swelling, softening and possible hydrolytic decomposition. wherein r represents an alkyl group containing from 1 to 30 carbon atoms. a non-self-crosslinkable polyurethane is defined as a polyurethane which is essentially linear and cannot form a three dimensional network without the addition of a catalyst or a curing agent, e.g., epoxides, triaziridines, or the use of external heating. generally, non-self-crosslinkable polyurethane chains are terminated with hydroxyl-, or amino- groups. the non-self-crosslinkable polyurethanes usually do not contain reactive terminal groups which can lead to condensation polymerization upon drying. dried coatings of these non-self-crosslinkble polyurethanes are solid films soluble in solvents, e.g., acetone, methylene chloride, benzene, dimethyl formamide, and the like thus, a test to distinguish non-self-crosslinkable and cross-linked polymers simply involves saturating a cotton pad with a suitable solvent and rubbing the polyurethane coating. the uncrosslinked coating should form an observable transfer of material to the pad during rubbing whereas the cross-linked coating should not form an observable transfer of material to the pad during rubbing. polyurethanes dispersed in water are commercially available. any suitable non-self-crosslinkable polyurethane dispersed in water may be utilized. typical sources of non-self-crosslinkable polyurethane dispersed in water include, for example, witcobond w240 dispersion (available from witco chemical company). this non-self-crosslinkablepolyurethane dispersion has a solids content of about 34%. the non-self-crosslinkable polyurethane is preferably a hydroxy-terminated polyurethane represented by the formula: wherein r and r' are substituted or substituted alkyl groups having 1 to 10 carbon atoms and x is 1 to about 5000. the substitutions may be lower alkyl groups or aromatic groups. the range of solids content for the aqueous dispersions containing the non-self-crosslinkable polyurethane is between about 30 percent and about 40 percent by weight, based on the total weight of the dispersion. the anionic prepolymer-ionomers of the polyurethane can be synthesized, for example, by the reaction of the dihydroxy-functionalized monomer and a dihydroxycarboxylic acid such as, dimethylol propionic acid and the like, with a slight excess of diisocyanate in an inert solvent medium at a temperature usually below about 80 c, and preferably between about 20 ° c and about 80 c. if desired, any suitable catalyst such as tertiary amines, dibutyltin diacetate or dibutyltin dilaurate may be employed to increase the rate of polymerization. the above reaction is illustrated as follows: i stir into water nco prepolymer-ionomer dispersion i + h 2 nnh 2 (migrates from water phase into globules) wherein r represents an alkyl group containing from 1 to 5 carbon atoms. examples of suitable solvents for the above prepolymerization include ethyl acetate, tetrahydrofuran, dioxane, dimethyl sulfoxide, dimethyl acetamide, and dimethylformamide. also, the aforesaid reaction is generally accomplished in a period of from about 2 to about 24 hours depending on the nature of the reagents and reaction conditions. typical dihydroxy-functionalized monomers (a) include, for example, ethylene glycol, propylene glycol, hexamethylene glycol, hydroxy-terminated polyester, polyglycol of different molecular weights, and the like. typical dihydroxycarboxylic acids (b) include, for example, dimethylol propionic acid, dimethylol butyric acid, dimethylol valeric acid, and the like. typical examples of diisocyanates (c) that may be selected for the preparation of the copolyurethanes include methane diisocyanate, 1,2-ethane diisocyanate, 1,3-propane diisocyanate, 1,6-hexane diisocyanate, 1,4-cyclohexane diisocyanate, 1,4-dimethylenecyclohexane diisocyanate, isophorone diisocyanate, tolylene diisocyanates, methylene bis(4-phenyl isocyanate), and the like. any suitable film forming self-crosslinkable polyurethane may be utilized. a self-crosslinkable polyurethane is defined as the polyurethane containing reactive terminal groups which can further condense to form three-dimensional network in the absence of catalyst, curing agent, or heat. generally, self-crosslinkable polyurethanes comprise typical terminal groups for the self- cross-linkable polyurethanes include amino-, epoxy-, aziridiny- and the like. sufficient cross-linking is achieved upon air drying when the polymer becomes a solid film which is substantially insoluble in solvents. thus, a test for suitable cross-linking simply involves saturating a cotton pad with a chlorinated solvent and rubbing the cross-linked polyurethane coating. the cross-linked coating should be substantially unaffected by the rubbing test and no observable transfer of material to the pad should occur during rubbing. it is important that the self-crosslinkable polyurethane prepolymers disperse or form a latex in water. any self-crosslinkable polyurethane dispersed in water may be utilized. polyurethanes dispersed in water are commercially available. typical sources of polyurethane dispersed in water include, for example, witcobond w240 dispersion (available from witco chemical company). this self-crosslinkable polyurethane coating composition has a solids content of about 30%. the generic formula has been given in the above section on polyurethane dispersion. the range of solids content for the aqueous dispersion containing the cross-linkable polyurethane is between about 30 percent and about 40 percent by weight, based on the total weight of the dispersion. the self-crosslinkable polyurethane prepolymers can be synthesized as in the case of the non-crosslinkable prepolymers except the reactive terminal groups. the procedure for the preparation of the anionic dispersions has been described in the previous paragraph. the molecular weight range is between 20,000 and 30,000. for some occasions, a small amount of tri-functional monomers containing hydroxy- or isocyanato-groups may be added to promote crosslinking in the absence of a catalyst or external heating. since these trifunctional monomers can affect shelf-life of the dispersion, it is important that only a small amount is used. in the case of wicobond w-240 dispersion, the shelf-life is approximately six months. one of the physical properties which can differentiate a non-self-crosslinkable polyurethane from a self-crosslinkable polyurethane is the ultimate elongation of the dry films. for example, the elongation for the non-self-crosslinkable film from w-260 dispersion is 340%; while that for the self-crosslinkable film from w-240 dispersion is only 70%. generally, satisfactory results may be achieved when the weight ratio of the non-self-crosslinkable polyurethane aqueous dispersion to the self-crosslinkable polyurethane aqueous dispersion is between about 90:10 and about 50:50. preferably, the ratio of aqueous dispersion of the non-self-crosslinkable polyurethane aqueous dispersion to the self-crosslinkable polyurethane is between about 80:20 and about 60:40. on the basis of the solid content, the ratio should be between about 80:20 and about 60:40. the optimum solids content of the diluted dispersion depends upon various factors including the process utilized for applying the dispersions. thus, for example, the optimum solids content is generally lower when using a bird applicator than when employing a gravure roll for applying the dispersions. for coating applications using a bird applicator, the mixture of the aqueous dispersions of cross-linkable polyurethanes and linear polyurethane is diluted with alcohol to form a solids contents of between about 0.6 percent by weight and about 1.2 percent by weight based on a total weight of solids in the final dispersion. the final concentration of the dispersion may also vary depending on the thickness of the adhesive layer desirable. for example, for a thickness of 0.8-1.2 micrometers, the above concentration range is rather appropriate. thus, the range of concentration is between about 0.6 percent by weight and about 1.2 percent by weight solids, based on the total weight of solids. optimum results are achieved with a final solids content of between about 0.7 percent by weight and about 0.9 percent by weight, based on the total weight of the solids in the dispersion. when the solids content is less than about 0.6 percent, the thickness of the adhesive layer is too thin and can result in poor adhesion. when the solids content is greater than about 1.2 percent, the thickness of the adhesive layer is too thick and can result in high residual potential of the final photoreceptor. if a gravure roll is used, the range of the solids content is preferably between about 7% and about 9%, and the optimum solids content is about 8%. thus, depending upon the type of coating process utilized, it appears that there is a preferred range that can readily be experimentally determined based on the teachings herein. moreover, other factors such as the relative speed of the applicator and the surface to be coated can affect the thickness of the final coating. thus, for example, the type of gravure roll, the roll speed, the velocity of the surface to be coated, and the like can also affect the optimum solids content. any suitable alcohol may be utilized to dilute the aqueous dispersions to achieve the desired final solids content. typical alcohols include, for example, isopropyl alcohol, isobutyl alcohol, ethyl alcohol, n-butyl alcohol, n-propyl alcohol, 2-ethoxyethanol and the like. a mixture of isopropyl alcohol and isobutyl alcohol is preferably utilized to provide greater control the rate of drying of the deposited coating. for example, if drying is taking place too slowly with isobutyl alcohol alone and too rapidly with isopropyl alcohol, a mixture of the two alcohols can provide an intermediate drying speed that might be most suitable for the type of coating and drying technique employed. the ratio of isopropyl alcohol/isobutyl alcohol can range from 100 percent to 60 percent by weight of isopropyl alcohol and from 0 percent to 40 percent isobutyl alcohol. a preferred mixture of isopropyl alcohol and isobutyl alcohol comprises about 60 percent by weight of isopropyl alcohol and about 40 percent by weight isobutyl alcohol. in the process of dilution, the total volume of isopropyl alcohol should be added, and then followed by the gradual addition of isobutyl alcohol while stirring the dispersion. ethyl alcohol and methyl alcohol tend to evaporate too rapidly and n-butanol tends to dry too slowly. in another preferred embodiment, the dispersion medium comprises isopropyl alcohol (ipa) and an amount of water equal to the amount of original urethane aqueous dispersion used. the dispersion may be prepared by any suitable technique. a typical technique includes blending the self-crosslinkable and non-self-crosslinkable polyurethane dispersions first, then adding water (if used) and then adding the alcohol(s) slowly while mixing. if an aqueous dispersion of polyurethane dispersed in water is applied as a coating without the addition of an alcohol diluent, the dried coating is in the form of a powder and is not continuous. thus, it is important that water miscible alcohol be utilized as a diluent additive. generally, satisfactory results are achieved with a final dispersion containing from about 1.7 percent and about 2 percent by weight water and from about 98.3 percent and about 98 percent by weight alcohol based on the total weight of the final dispersion or latex. since the polyurethane dispersions are self-dispersable, there is no need for an external dispersant. however, in some cases involving mixtures other than a dispersion, an emulsifier may be required. any suitable coating technique may be utilized to apply the adhesive layer. typical coating techniques include, for example, drawbar, gravure, spraying, dip coating, roll coating, wire wound rod coating, bird applicator coating,and the like. since the thickness of the final solidified layer is affected by the solids content of the dispersion, the specific coating application technique used and the particular drying conditions utilized, a wide range of solids content in the dispersion may be utilized depending upon the final dried adhesive layer thickness desired. thus, for example, for application techniques utilizing spraying, a low solids content may be desirable compared to application techniques utilizing gravure coating. any suitable drying technique may be utilized to dry the deposited adhesive layer. typical drying techniques include air drying, oven drying, forced air oven drying, infrared radiation drying, air drying, zone drying, multi-stage drying, and the like. for example, satisfactory coating have been achieved with air drying for 30 minutes. similar coatings have been obtained by oven drying at 105°c for about 5 minutes. if desired, the multi-stage drying technique may be utilized for large scale coating operations in which the applied coating is subjected to higher temperature at different stages of heating. for example, the first stage might involve a temperature of about 80 c, the second stage about 115°c and the last stage about 130°c. for multiple stage drying, the heating time at each zone can be very short, e.g., 24-26 seconds. generally, satisfactory results are achieved with an adhesive layer having a dried thickness between about 400 angstroms and about 1800 angstroms. preferably, the dried thickness of the adhesive is between about 800 angstroms and about 1200 angstroms. when dried adhesive layer thickness is less than about 400 angstroms, adhesion begins to deteriorate noticeably. when the adhesive layer thickness is greater than about 1500 angstroms, the residual potential on the electrophotographic imaging member begins to build up during image cycling and can cause high background deposits in the final electrophotographic copy. the dried adhesive layer of this invention comprises a solid blend of the non-self-crosslinkable polyurethane and the self-crosslinkable polyurethane that prevents crack formation in the charge generating layer during the application of a charge transport coating composition that contains an organic solvent that normally attacks conventional adhesive layers such as polyesters (e.g. dupont 49,000 polyester, available from e.i. dupont de nemours and company and vitel pe100 polyester, available from goodyear tire & rubber). surprisingly, when the adhesive layer comprises either 100 percent non-self-crosslinkable polyurethane or 100 percent self-crosslinkable polyurethane, cracks form in the charge generating layer during application of a charge transport layer coating composition comprising a film forming polymer and an organic solvent. moreover, photoreceptors prepared with adhesive layers comprising 100 percent cross-linkable polyurethane exhibited poor adhesion between the adhesive layer and the charge generating layer and delaminated during cycling over small diameter rollers. thus, it is the semi-penetrating polymer networks that form the tough adhesive layer which provides good adhesion and toughness but not the brittleness of the crosslinked interface or the poor adhesion of the non-self-crosslinkable interface. any suitable charge generating layer may be applied onto the adhesive layer of this invention. typical charge generating materials may be vacuum deposited include benzimidazole perylenes, various phthalocyanine pigment such as chloroindium phthalocyanine, the x-form of metal free phthalocyanine described in us-a 3,357,989, metal phthalocyanines such as vanadyl phthalocyanine, titanyl phthalocyanine and copper phthalocyanine, dibromoanthanthrone, squarylium, quinacridones available from dupont under the tradename monastral red, monastral violet and monastral red y, vat orange 1 and vat orange 3 trade names for dibromoanthanthrone pigments, substituted 2,4-diaminotriazines disclosed in us-a 3,442,781, polynuclear aromatic quinones available from allied chemical corporation under the tradename indofast double scarlet, indofast violet lake b, indofast brilliant scarlet and indofast orange, and the like. other suitable photogenerating materials known in the art may also be utilized, e.g., azo pigments and chal- cogenides such as arsenic triselenide, arsenic tritelluride, trigonal selenium, if desired. these charge generating layers are thin and homogeneous. generally, the thickness of these thin homogeneous charge charge generating layers is between about 5000 angstroms and 9000 angstroms determined by a crystal monitor. preferably, the thickness of these thin homogeneous charge generating layers is between about 8000 angstroms and about 9000 angstroms. when the thickness of these thin homogeneous charge charge generating layers is less than about 5000 angstroms thick, the electrical sensitivity becomes too low. when the thickness is greater than about 9000 angstroms thick, the dark discharge potential becomes too high. any suitable and conventional technique may be utilized to apply the photogenerating layer coating mixture. typical application techniques include vacuum deposition, sublimation, coating from a dispersion and the like. coating dispersions comprise finely divided charge generating particles dispersed in a film forming binder. the active charge transport layer may comprise an activating compound useful as an additive dispersed in electrically inactive polymeric materials making these materials electrically active. these compounds may be added to polymeric materials which are incapable of supporting the injection of photogenerated holes from the generation material and incapable of allowing the transport of these holes therethrough. this will convert the electrically inactive polymeric material to a material capable of supporting the injection of photogenerated holes from the generation material and capable of allowing the transport of these holes through the active layer in order to discharge the surface charge on the active layer. an especially preferred transport layer employed in one of the two electrically operative layers in the multilayered photoconductor of this invention comprises from about 25 percent to about 75 percent by weight of at least one charge transporting aromatic amine compound, and about 75 percent to about 25 percent by weight of a polymeric film forming resin in which the aromatic amine is soluble. the charge transport layer forming mixture preferably comprises an aromatic amine compound of one or more compounds having the general formula: wherein r 1 and r 2 are an aromatic group selected from the group consisting of a substituted or unsubstituted phenyl group, naphthyl group, and polyphenyl group and r 3 is selected from the group consisting of a substituted or unsubstituted aryl group, alkyl group having from 1 to 18 carbon atoms and cycloaliphatic compounds having from 3 to 18 carbon atoms. the substituents should be free form electron withdrawing groups such as n0 2 groups, cn groups, and the like. examples of charge transporting aromatic amines represented by the structural formulae above for charge transport layers capable of supporting the injection of photogenerated holes of a charge generating layer and transporting the holes through the charge transport layer include triphenylmethane, bis(4-diethylamine-2-methylphenyl)phenylmethane; 4'-4"-bis(diethylamino)-2',2"-dimethyltriphenylmethane, n,n'- bis(alkylphenyl)-[1,1'-biphenyl]4,4'-diamine wherein the alkyl is, for example, methyl, ethyl, propyl, n-butyl, etc., n,n'-diphenyl-n,n'-bis(chlorophenyl)-[1,1'-biphenyl]-4,4'-diamine, n,n'-diphenyl-n,n'-bis(3"-methylphenyl)-(1,1'-biphenyl)-4,4'-diamine, and the like dispersed in an inactive resin binder. any suitable inactive resin binder soluble in methylene chloride or other suitable solvent may be employed in the process of this invention. typical inactive resin binders soluble in methylene chloride include polycarbonate resin, polyvinylcarbazole, polyester, polyarylate, polyacrylate, polyether, polysulfone, and the like. molecular weights can vary from about 20,000 to about 150,000. typical organic solvents for the resin binder in the charge transport layer coating mixture will normally dissolve conventional adhesive layer materials. thus, methylene chloride, 1,1,2-trichloroethane, tetrahydrofuran, toluene, or mixtures thereof will dissolve a polyester adhesive layer. since the the vacuum deposited or sublimed charge generating layer appears porous to solvents such a methylene chloride, the organic solvent can penetrate the charge generating layer and attack a conventional adhesive layer. any suitable and conventional technique may be utilized to mix and thereafter apply the charge transport layer coating mixture to the charge generating layer. typical application techniques include spraying, roll coating, wire wound rod coating, and the like. drying of the deposited coating may be enhanced by any suitable conventional technique such as oven drying, infra red radiation drying, air drying and the like because it softens the underlying adhesive and slightly imbeds loose generation layer pigment. it also reduces the thermal stresses in the charge generator layer. generally, the thickness of the hole transport layer is between about 10 to about 50 micrometers, but thicknesses outside this range can also be used. the hole transport layer should be an insulator to the extent that the electrostatic charge placed on the hole transport layer is not conducted in the absence of illumination at a rate sufficient to prevent formation and retention of an electrostatic latent image thereon. in general, the ratio of the thickness of the hole transport layer to the charge generator layer is preferably maintained from about 2:1 to 200:1 and in some instances as great as 400:1. the preferred electrically inactive resin materials are polycarbonate resins have a molecular weight from about 20,000 to about 150,000, more preferably from about 50,000 to about 120,000. the materials most preferred as the electrically inactive resin material is poly(4,4'-dipropylidene-diphenylene carbonate) with a molecular weight of from about 35,000 to about 40,000, available as lexan 145 from general electric company; poly(4,4'-isopropylidene-diphenylene carbonate) with a molecular weight of from about 40,000 to about 45,000, available as lexan 141 from the general electric company; a polycarbonate resin having a molecular weight of from about 50,000 to about 120,000, available as makrolon from farbenfabricken bayer a. g. and a polycarbonate resin having a molecular weight of from about 20,000 to about 50,000 available as merlon from mobay chemical company. methylene chloride solvent is a desirable component of the charge transport layer coating mixture for adequate dissolving of all the components and for its low boiling point. a solvent mixture containing methylene chloride and 1,1,2-trichloroethene may be utilized. examples of photosensitive members having at least two electrically operative layers include the charge generator layer and diamine containing transport layer members disclosed in us-a 4,265,990, us-a 4,233,384, us-a 4,306,008, us-a 4,299,897 and us-a 4,439,507. the disclosures of these patents are incorporated herein in their entirety. other layers such as conventional electrically conductive ground strip along one edge of the belt in contact with the conductive layer, blocking layer, adhesive layer or charge generating layer to facilitate connection of the electrically conductive surface of the photoreceptor substrate to ground or to an electrical bias. ground strips are well known and comprise usually comprise conductive particles dispersed in a film forming binder. optionally, an overcoat layer may also be utilized to improve resistance to abrasion. in some cases an anti-curl back coating may be applied to the side opposite the photoreceptor to provide flatness and/or abrasion resistance. these overcoating and anti-curl back coating layers are well known in the art and may comprise thermoplastic organic polymers or inorganic polymers that are electrically insulating or slightly semi-conductive. overcoatings are continuous and generally have a thickness of less than about 10 micrometers. the thickness of anti-curl backing layers should be sufficient to substantially balance the total forces of the layer or layers on the opposite side of the supporting substrate layer. the total forces are substantially balanced when the belt has no noticeable tendency to curl after all the layers are dried. for example, for an electrophotographic imaging member in which the bulk of the coating thickness on the photoreceptor side of the imaging member is a transport layer containing predominantly polycarbonate resin and having a thickness of about 24 micrometers on a mylar substrate having a thickness of about 76 micrometers, sufficient balance of forces can be achieved with a 13.5 micrometers thick anti-curl layer containing about 99 percent by weight polycarbonate resin, about 1 percent by weight polyester and between about 5 and about 20 percent of coupling agent treated crystalline particles. an example of an anti-curl backing layer is described in us-a 4,654,284 the entire disclosure of this patent being incorporated herein by reference. a thickness between about 70 and about 160 micrometers is a satisfactory range for flexible photoreceptors. thicknesses between about 85 micrometers and about 145 are preferred and optimum results are achieved with a photoreceptor having a thickness of between about 90 micrometers and about 135 micrometers. if desired, the photoconductive belt, may have a conductive ground strip formed along edge of the belt. the ground strip may be prepared, for example, from a uniform dispersion of carbon black in a tack-free polyester adhesive diluted with a solvent. the ground strip dispersion can be applied with any suitable applicator such as brush, gravure roll, sprayer and the like. a typical ground strip has a width of about 10 mm and a bulk resistivity of about 1 ohm-cm. thus, the multilayered photoreceptors of this invention are free from the pattern of cracks formed in the charge generating layer when coating solutions of charge transport material are applied to thin charge generating layers overlying solvent soluble, swellable or diffusable adhesive layers. also, the multilayered photoreceptor of this invention provide longer service life in the form of flexible belt photoreceptors in imaging machines that employ small diameter support rollers for photoreceptor belt systems. the long service life is achieved due to the dimensional stability and electrical stability of the photoreceptors of this invention. a number of examples are set forth hereinbelow and are illustrative of different compositions and conditions that can be utilized in practicing the invention. examples 1 through 7 are carried out at a laboratory scale; while examples 8 through 12 were carried out in a pilot plant on a much larger scale. it should be noted that the equipment and the quantities of materials are very different. all proportions are by weight unless otherwise indicated. it will be apparent, however, that the invention can be practiced with many types of compositions and can have many different uses in accordance with the disclosure above and as pointed out hereinafter. example i a photoconductive imaging member was prepared by providing a titanium coated polyester (melinex, available from ici inc.) substrate having a thickness of 3 mils and applying thereto, using a bird applicator, a solution containing 2.592 gm 3-aminopropyltriethoxysilane, 0.784 gm acetic acid, 180 gm of 190 proof denatured alcohol and 77.3 gm heptane. this layer was then allowed to dry for 5 minutes at room temperature and 10 minutes at 135 ° c in a forced air oven. the resulting blocking layer had a dry thickness of about 200-400 angstroms. an adhesive interface layer was then prepared on top of the blocking layer by applying a coating containing 0.5 percent by weight based on the total weight of the solution of polyester adhesive (dupont 49,000, available from e. i. du pont de nemours & co.) in a 70:30 volume ratio mixture of tetrahydrofuran / cyclohexanone with a 0.5-mil bird applicator. an adhesive interface layer was then prepared by the applying to the blocking layer a coating having a wet thickness of 0.5 mil and containing 0.5 percent by weight based on the total weight of the solution of polyester adhesive (dupont 49,000, available from e. i. du pont de nemours & co.) in a 70:30 volume ratio mixture of tetrahydrofuran/cyclohexanone with a bird applicator. the adhesive interface layer was allowed to dry for 1 minute at room temperature and 10 minutes at 100 ° c in a forced air oven. the resulting adhesive interface layer had a dry thickness of 800 to 1200 angstroms. benzimidazole perylene vacuum sublimed from powder form at approximately 580 ° c was deposited on the adhesive layer to an optical absorption of 85-90 percent at 650 nm to form a charge generating layer having a thickness of about 5000 angstroms. this photogenerator layer was overcoated with a charge transport layer. the charge transport layer was prepared by introducing into an amber glass bottle 5.61 grams of n,n'-diphenyl-n,n'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'-diamine and 10.4 grams of polycarbonate resin having a molecular weight of from about 50,000 to 100,000 (makrolon r, available from farbensabricken bayer a.g.). the resulting mixture was dissolved in 83.99 grams of methylene chloride. this solution was applied on the photogenerator layer using a gardner coater and a 3-mil bird applicator to form a coating. the resulting photoreceptor device containing all of the above layers was air dried at room temperature for 30 minutes and then at 135°c for 20 minutes to form a coating having a thickness of 20 micrometers. the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. numerous macrocracks and microcracks were observed. the macrocracks were greater than 660 micrometers in diameter and 35 ± 30 micrometers in the overlapped width. generally, macrocracks include those cracks greater than 500 micrometers in length with an overlap of platelets of greater than 30 micrometers wide. these types of cracks are seen visually by the naked eye. macrocracks between 100 and 500 micrometers can be verified with a microscope. microcracks are defined as those cracks of a length less than 100 micrometers and a width of overlap less than one micrometer. these microcracks are not visible to the eye, but can be only observed under a microscope. example ii the procedures described in example i were repeated to form another test sample, except that instead of depositing the polyester adhesive layer described in example i, an adhesive layer containing only an aqueous dispersion of a non-self-crosslinkable polyurethane was applied. this adhesive layer coating dispersion was prepared by stirring 2.35 grams of an aqueous dispersion of non-self-curable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) while slowly adding 97.65 grams of isopropyl alcohol. the resulting dispersion (0.8 percent by weight solids) was applied using a gardner coater and 0.5 mil bird applicator on top of the blocking layer (200-400 angstroms). this adhesive was allowed to dry for 5 minutes at room temperature and for 5 minutes at 105°c in a forced air oven. the resulting adhesive layer had a dry thickness of about 1000 angstroms. after application and drying of the charge generating and charge transporting layers as described in example i, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. numerous macrocracks and microcracks were observed. the size of the macrocracks was greater then 600 micrometers. example iii the procedures described in example i were repeated to form another test sample, except that instead of depositing the polyester adhesive layer described in example i, an adhesive layer containing only an aqueous dispersion of a non-self-crosslinkable polyurethane was applied. this adhesive layer coating dispersion was prepared by stirring 2.67 grams of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) while slowly adding 97.33 grams of isopropyl alcohol. the resulting dispersion (0.8 percent by weight solids) was applied using a gardner coater and 0.5 mil bird applicator on top of the blocking layer (200-400 angstroms). this adhesive was allowed to dry for 10 minutes at room temperature and for 5 minutes at 105 ° c in a forced air oven. the resulting adhesive layer had a dry thickness of 950 angstroms. after application and drying of the charge generating and charge transporting layers as described in example i, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and some microcracks were observed. example iv the procedures described in example i were repeated to form another test sample, except that instead of depositing the polyester adhesive layer described in example i, an adhesive layer of this invention was applied. this adhesive layer coating dispersion was prepared by stirring 1.07 grams of an aqueous dispersion of non-self-curable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 1.41 grams of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 95.72 grams of isopropyl alcohol. the resulting dispersion containing a 60:40 weight ratio of non-self-crosslinkable polyurethane to cross-linkable polyurethane, (0.8 percent by weight solids) was applied using a gardner coater and 0.5 mil bird applicator on the top of the blocking layer (200-400 angstroms). this adhesive was allowed to dry for 10 minutes at room temperature and for 5 minutes at 105°c in a forced air oven. the resulting adhesive layer had a dry thickness of about 1000 angstroms. after application and drying of the charge generating and charge transporting layers as described in example i, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example v the procedures described in example i were repeated to form another test sample, except that instead of depositing the polyester adhesive layer described in example i, an adhesive layer of this invention was applied. this adhesive layer coating dispersion was prepared by stirring 1.07 grams of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 1.41 grams of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 95.07 grams of isopropyl alcohol and 2.48 grams of water. the resulting dispersion containing a 60:40 weight ratio of non-self-crosslinkable polyurethane to self-crosslinkable polyurethane ( * 0.8% by weight solids) was applied on top of the blocking layer (200-400 angstroms). this adhesive was allowed to dry for 10 minutes at room temperature and for 5 minutes at 105°c in a forced air oven. the resulting adhesive layer had a dry thickness of 970 angstroms. after application and drying of the charge generating and charge transporting layers as described in example i, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example vi the procedures described in example i were repeated to form another test sample, except that instead of depositing the polyester adhesive layer described in example i, an adhesive layer of this invention was applied. this adhesive layer coating dispersion was prepared by stirring 1.07 grams of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 1.41 grams of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 58.51 grams of isopropyl alcohol and 39.01 grams of isobutyl alcohol. the resulting dispersion containing a 60:40 weight ratio of non-self-crosslinkable polyurethane to self-crosslinkable polyurethane (0.8 percent by weight solids) was applied using a gardner coater and 0.5 mil bird applicator on top of the blocking layer (200-400 angstroms). this adhesive was allowed to dry for 10 minutes at room temperature and for 5 minutes at 105°c in a forced air oven. the resulting adhesive layer had a dry thickness of about 960 angstrom. after application and drying of the charge generating and charge transporting layers as described in example i, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example vii the procedures described in example i were repeated to form another test sample, except that instead of depositing the polyester adhesive layer described in example i, an adhesive layer of this invention was applied. this adhesive layer coating dispersion was prepared by stirring 1.88 grams of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 0.53 gram of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 58.55 grams of isopropyl alcohol and 39.04 grams of isobutyl alcohol. the resulting dispersion containing a 60:40 weight ratio of non-self-crosslinkable polyurethane to cross-linkable polyurethane (0.8 percent by weight solids) was applied using a gardner coater and 0.5 mil bird applicator on top of the blocking layer (200-400 angstroms). this adhesive was allowed to dry for 10 minutes at room temperature and for 5 minutes at 105 ° c in a forced air oven. the resulting adhesive layer had a dry thickness of about 1000 angstroms. after application and drying of the charge generating and charge transporting layers as described in example i, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example viii a photoconductive imaging member was prepared by providing a titanium coated polyester (melinex, available from ici inc.) web substrate having a thickness of 3 mils and applying thereto, using a gravure coater, a solution containing 2.592 gm 3-aminopropyltriethoxysilane, 0.784 gm acetic acid, 180 gm of 190 proof denatured alcohol and 77.3 gm heptane. this layer was then-dried for 10 minutes at 135°c in a zoned oven. the resulting blocking layer had a dry thickness of about 200-400 angstroms. a 15000 gram adhesive interface layer dispersion was then prepared by stirring 12.35 percent by weight of an aqueous dispersion of non-self-curable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 9.33 percent by weight of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 46.99 percent by weight of isopropyl alcohol and 31.33 percent by weight of isobutyl alcohol. the resulting 60:40 non-self-crosslinkable polyurethane to self-crosslinkable polyurethane weight ratio 7 percent by weight dispersion was applied using a gravure roll at a rate of 50 feet per minute to the blocking layer. the adhesive layer was dried by passage through three temperature zones of a forced air oven maintained at 80°c, 115°c and 130°c, respectively. the time in each zone was about 24-26 seconds. the resulting adhesive interface layer had a dry thickness of 0.05 micrometer. benzimidazole perylene vacuum sublimed from powder form at approximately 580 ° c was deposited on the adhesive layer to an optical absorption of 85-90 percent at 650 nm to form a charge generating layer having a thickness of about 6000 angstroms. this photogenerator layer was overcoated with a charge transport layer. the charge transport layer was polycarbonate resin having a molecular weight of from about 50,000 to 100,000 (makrolon r, available from farbensabricken bayer a.g). containing 35 wt% of n,n'-diphenyl-n,n'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'-diamine based on polycarbonate. these two components were dissolved in a mixture of methylene chloride and 1,1,2-trichloroethane (65/35 by wt.) to form a solution of 14.5% in solids. this solution was applied on the photogenerator layer using the gravure coater. the resulting photoreceptor device containing all of the above layers was dried in the zone-heating oven with the three temperatures and the time in zones as described in the above to form a coating having a thickness of 25 micrometers. the rear, uncoated surface of the dried photoreceptor was then coated with an anti-curling coating containing polycarbonate. the resulting photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example ix the procedures described in example viii were repeated to form another test sample, except that instead of depositing the adhesive layer described in example viii, another adhesive layer of this invention was applied. about 15,000 grams of this adhesive layer coating dispersion was prepared by stirring 16.47 percent by weight of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 4.67 percent by weight of an aqueous dispersion of cross-linkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 47.32 percent by weight of isopropyl alcohol and 31.54 percent by weight of isobutyl alcohol. the resulting 80:20 non-self-crosslinkable polyurethane to self-crosslinkable polyurethane weight ratio 7 percent by weight solids dispersion was applied using a gravure coater applicator to the blocking layer (200-400 angstroms). the adhesive layer after drying had a thickness of 1000 angstroms. after application and drying of the charge generating, charge transporting, and anti-curling layers as described in example viii, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example x the procedures described in example viii were repeated to form another test sample, except that instead of depositing the adhesive layer described in example viii, another adhesive layer of this invention was applied. a 15.000 grams of this adhesive layer coating dispersion was prepared by stirring 21.18 percent by weight of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260, 34 percent by weight solids, available from witco corporation) and 6.00 percent by weight of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240, 30 percent by weight solids, available from witco corporation) while slowly adding 43.69 percent by weight of isopropyl alcohol and 29.13 percent by weight of isobutyl alcohol. the resulting 80:20 non-self-crosslinkable polyurethane to cross-linkable polyurethane weight ratio 9 percent by weight solids dispersion was applied using a gravure coater on top of the blocking layer having a dry thickness of 200-400 angstroms. the adhesive layer after drying had a thickness of 1480 angstroms. after application and drying in the zone-heating oven of the charge generating, charge transporting, and anti-curling layers as described in example viii, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example xi the procedures described in example viii were repeated to form another test sample, except that instead of depositing the adhesive layer described in example viii, another adhesive layer of this invention was applied. about 15,000 grams of this adhesive layer coating dispersion was prepared by stirring 24.4 percent by weight of an aqueous dispersion of non-self-crosslinkable polyurethane (100 percent witcobond w260 dispersion, 34 percent by weight solids, available from witco corporation) and 6.9 percent by weight of an aqueous dispersion of self-crosslinkable polyurethane (100 percent witcobond w240 dispersion, 30 percent by weight solids, available from witco corporation) while slowly adding 41.2 percent by weight of isopropyl alcohol and 27.5 percent by weight of isobutyl alcohol. the resulting 80:20 non-self-crosslinkable polyurethane to self-crosslinkable polyurethane weight ratio 11 percent by weight solids dispersion was applied using a gravure coater on top of the blocking layer (200-400) angstroms. the adhesive layer after drying in a zone-heating oven had a thickness of 1780 angstroms. after application and drying of the charge generating, charge transporting, and anti-curling layers as described in example viii, the dried photoreceptor was tested for macrocracking by visual observation and for microcracking by microscopy. no macrocracks and microcracks were observed. example xii the procedures described in example viii were repeated to form additional test samples, except that the silane blocking layer was omitted and the non-self-crosslinkable polyurethane to self-crosslinkable polyurethane weight ratios in the adhesive layer and the adhesive layer thickness were varied. the adhesion between the charge generator layer and the underlying layers was measured using peel strength tests. peel testing is described in astm d-93 peel strength test (american standard testing methods). this testing method has been somewhat modified for the testing of photoreceptors. more specifically, the reversed peel strength was obtained by using a razor blade to separate enough of the charge generating layer (and charge transport layer) from the underlying layers to allow grippers to be attached, gripping the underlying layers with a stationary gripper and using the grippers of an instron gauge to peel the generating layer and transport layer at an angle of 180 degrees from the original position of the gripped edge in a reversed mode. a similar test known as the normal peel test involves using a razor blade to separate enough of the charge generating layer (and underlying layers) from the overlying charge transport layer to allow grippers to be attached, gripping the charge transport layer with a stationary gripper and using the grippers of an instron gauge to peel the generating layer (and underlying layers) at an angle of 180 degrees from the original position of the gripped edge. in assessing the adhesion of the adhesive layer, the reversed peel strength mode is deemed the most appropriate measurement. also, the adhesion between the charge generator layer and the charge transport layer was tested using the normal peel strength test technique. the results of the tests are shown in table 2. the results in table 2 also show that the adhesive layer derived from the non-self-crosslinkable polyurethane from w-260 dispersion caused cracking. example xiii the procedures described in example viii were repeated to form additional test samples, except that the non-self-crosslinkable polyurethane to self-crosslinkable polyurethane weight ratios in the adhesive layer and the adhesive layer thickness were varied. the adhesion between the charge generator layer and the substrate was measured using the reverse peel strength test device described in example xii the results of the tests are shown in table 3. it is important to point out that the peel strength alone is insufficient in predicting the results of crack-resistance. the absence or presence of a silane blocking layer generally did not affect the mechanical properties. however, the presence of a silane blocking layer provided greater electrical property stability at low relative humidities. example xiv xerographic cycling tests conducted on the photoreceptors prepared in examples 8 through 12 showed that the charge generating layers exhibited excellent optical absorption of at least 73 percent. also, these photoreceptors had a high initial charging potential of over 1000 volts, low dark discharge potential (v ddp ) below 184 v/sec, sharp critical voltage relating to the slope of the photo-induced curve, low residual potential below 56 volts, high sensitivity (greater than 130 v/erg/cm 2 at 650 nm), good cyclic stability and good environmental stability. although the invention has been described with reference to specific preferred embodiments, it is not intended to be limited thereto, rather those skilled in the art will recognize that variations and modifications may be made therein which are within the spirit of the invention and within the scope of the claims.
032-762-882-313-57X	US	[ "US", "CN", "EP" ]	G01S17/04,B66B1/34,B66B5/00,G01N21/62,G01V8/20,B66B1/06	2017-09-25T00:00:00	2017	[ "G01", "B66" ]	elevator sensor array system	according to an aspect, a method includes detecting, by a computing system, whether there are any pre-existing objects between a first group of sensors of a sensor array in an elevator shaft. the computing system detects whether there is a foreign object between a second group of sensors of the sensor array in the elevator shaft, where the second group of sensors includes at least one sensor that differs from the first group of sensors. the computing system triggers a modification to a control aspect of an elevator car in the elevator shaft based on detection of the foreign object.	1. a method comprising: detecting, by a computing system, whether there are any pre-existing objects between a first group of sensors of a sensor array in an elevator shaft based on initially established locations of the pre-existing objects, wherein the sensor array comprises a plurality of sensors distributed about a perimeter within the elevator shaft, the perimeter comprises at least four sides, and one or more of the sensors are on each of the at least four sides forming a detection field; detecting, by the computing system, whether there is a foreign object between a second group of sensors of the sensor array in the elevator shaft, the second group of sensors including at least one sensor that does not overlap with the first group of sensors; and triggering, by the computing system, a modification to a control aspect of an elevator car in the elevator shaft based on detection of the foreign object. 2. the method of claim 1 , wherein the sensors form a grid as the detection field. 3. the method of claim 1 , wherein the sensors are arranged in pairs to form a diagonal detection pattern between at least two adjacent sides of the perimeter. 4. the method of claim 1 , wherein the sensors are light sensors, each of the light sensors comprising an emitter and a receiver. 5. the method of claim 1 , wherein the modification to the control aspect of the elevator car comprises: reducing a maximum rate of travel of the elevator car in the shaft, preventing the elevator car from going to an uppermost level of the shaft based on detecting the foreign object above the elevator car, or preventing the elevator car from going to the lowest level of the shaft based on detecting the foreign object below the elevator car. 6. the method of claim 1 , further comprising: determining a size estimate of the foreign object based on a number of sensors and a position of the sensors in the second group of sensors that are used to detect the foreign object, wherein the modification to the control aspect of the elevator car is determined, at least in part, based on the size estimate of the foreign object. 7. the method of claim 6 , further comprising: triggering a warning indicator based on the size estimate of the foreign object. 8. an elevator sensor array system comprising: a sensor array operable in an elevator shaft, wherein the sensor array comprises a plurality of sensors distributed about a perimeter within the elevator shaft, the perimeter comprises at least four sides, and one or more of the sensors are on each of the at least four sides forming a detection field; and a computing system comprising a memory and a processor that detects whether there are any pre-existing objects between a first group of sensors of the sensor array in the elevator shaft based on initially established locations of the pre-existing objects, detects whether there is a foreign object between a second group of sensors of the sensor array in the elevator shaft, and triggers a modification to a control aspect of an elevator car in the elevator shaft based on detection of the foreign object, wherein the second group of sensors includes at least one sensor that differs from does not overlap with the first group of sensors. 9. the elevator sensor array system of claim 8 , wherein the sensors form a grid as the detection field. 10. the elevator sensor array system of claim 9 , wherein the sensors are arranged in pairs to form a diagonal detection pattern between at least two adjacent sides of the perimeter. 11. the elevator sensor array system of claim 8 , wherein the sensors are light sensors, each of the light sensors comprising an emitter and a receiver. 12. the elevator sensor array system of claim 8 , wherein the modification to the control aspect of the elevator car comprises: reducing a maximum rate of travel of the elevator car in the shaft, preventing the elevator car from going to an uppermost level of the shaft based on detecting the foreign object above the elevator car, or preventing the elevator car from going to the lowest level of the shaft based on detecting the foreign object below the elevator car. 13. the elevator sensor array system of claim 8 , wherein the computing system determines a size estimate of the foreign object based on a number of sensors and a position of the sensors in the second group of sensors that are used to detect the foreign object, wherein the modification to the control aspect of the elevator car is determined, at least in part, based on the size estimate of the foreign object. 14. the elevator sensor array system of claim 13 , wherein the computing system triggers a warning indicator based on the size estimate of the foreign object.	background the subject matter disclosed herein generally relates to elevator systems and, more particularly, to an elevator sensor array system. elevator systems can present risks to maintenance personnel due to the confined spaces in which elevators operate, the weight of elevator components, and the motion of elevator components. elevator mechanics and other individuals may be exposed to an increased risk while in an elevator shaft. brief summary according to some embodiments, a method of detecting a foreign object using an elevator sensor array system is provided. a computing system detects whether there are any pre-existing objects between a first group of sensors of a sensor array in an elevator shaft. the computing system detects whether there is a foreign object between a second group of sensors of the sensor array in the elevator shaft. the second group of sensors includes at least one sensor that differs from the first group of sensors. the computing system triggers a modification to a control aspect of an elevator car in the elevator shaft based on detection of the foreign object. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include where the sensor array includes a plurality of sensors distributed about a perimeter within the elevator shaft. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include where the perimeter includes at least four sides, and one or more of the sensors are on each of the at least four sides forming a detection field. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include where the sensors form a grid as the detection field. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include where the sensors are arranged in pairs to form a diagonal detection pattern between at least two adjacent sides of the perimeter. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include where the sensors are light sensors, each of the light sensors including an emitter and a receiver. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include where the modification to the control aspect of the elevator car includes: reducing a maximum rate of travel of the elevator car in the shaft, preventing the elevator car from going to an uppermost level of the shaft based on detecting the foreign object above the elevator car, or preventing the elevator car from going to the lowest level of the shaft based on detecting the foreign object below the elevator car. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include determining a size estimate of the foreign object based on a number of sensors and a position of the sensors in the second group of sensors that are used to detect the foreign object, where the modification to the control aspect of the elevator car is determined, at least in part, based on the size estimate of the foreign object. in addition to one or more of the features described above or below, or as an alternative, further embodiments may include triggering a warning indicator based on the size estimate of the foreign object. according to some embodiments, an elevator sensor array system is provided including sensor array operable in an elevator shaft and a computing system. the computing system includes a memory and a processor that detects whether there are any pre-existing objects between a first group of sensors of the sensor array in the elevator shaft, detects whether there is a foreign object between a second group of sensors of the sensor array in the elevator shaft, and triggers a modification to a control aspect of an elevator car in the elevator shaft based on detection of the foreign object, where the second group of sensors includes at least one sensor that differs from the first group of sensors. technical effects of embodiments of the present disclosure include triggering a modification to a control aspect of an elevator car in an elevator shaft based on detection of a foreign object by an elevator sensor array system. by first establishing locations of pre-existing objects in a detection field of an elevator sensor array, foreign objects can be distinguished from the pre-existing objects and false positives reduced/prevented. the foregoing features and elements may be combined in various combinations without exclusivity, unless expressly indicated otherwise. these features and elements as well as the operation thereof will become more apparent in light of the following description and the accompanying drawings. it should be understood, however, that the following description and drawings are intended to be illustrative and explanatory in nature and non-limiting. brief description of the drawings the present disclosure is illustrated by way of example and not limited in the accompanying figures in which like reference numerals indicate similar elements. fig. 1 is a schematic illustration of an elevator system that may employ various embodiments of the present disclosure; fig. 2 is a schematic illustration of an elevator sensor array system in accordance with an embodiment of the present disclosure; fig. 3 is a schematic illustration of an elevator sensor array system with pre-existing objects in accordance with an embodiment of the present disclosure; fig. 4 is a schematic illustration of an elevator sensor array system with pre-existing objects and a foreign object in accordance with an embodiment of the present disclosure; fig. 5 is a schematic illustration of an elevator sensor array system with pre-existing objects and foreign objects in accordance with an embodiment of the present disclosure; fig. 6 is a schematic illustration of an elevator sensor array system in a diagonal configuration in accordance with an embodiment of the present disclosure; fig. 7 is a schematic illustration of a pair of sensors in an elevator sensor array system in accordance with an embodiment of the present disclosure; fig. 8 is a schematic block diagram illustrating a computing system that may be configured for one or more embodiments of the present disclosure; and fig. 9 is a process for foreign object detection by an elevator sensor array system in accordance with an embodiment of the present disclosure. detailed description a detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the figures. fig. 1 is a perspective view of an elevator system 101 including an elevator car 103 , a counterweight 105 , one or more load bearing members 107 , a guide rail 109 , a machine 111 , a position encoder 113 , and an elevator controller 115 . the elevator car 103 and counterweight 105 are connected to each other by the load bearing members 107 . the load bearing members 107 may be, for example, ropes, steel cables, and/or coated-steel belts. the counterweight 105 is configured to balance a load of the elevator car 103 and is configured to facilitate movement of the elevator car 103 concurrently and in an opposite direction with respect to the counterweight 105 within an elevator shaft 117 and along the guide rail 109 . the load bearing members 107 engage the machine 111 , which is part of an overhead structure of the elevator system 101 . the machine 111 is configured to control movement between the elevator car 103 and the counterweight 105 . the position encoder 113 may be mounted on an upper sheave of a speed-governor system 119 and may be configured to provide position signals related to a position of the elevator car 103 within the elevator shaft 117 . in other embodiments, the position encoder 113 may be directly mounted to a moving component of the machine 111 , or may be located in other positions and/or configurations as known in the art. the elevator controller 115 is located, as shown, in a controller room 121 of the elevator shaft 117 and is configured to control the operation of the elevator system 101 , and particularly the elevator car 103 . for example, the elevator controller 115 may provide drive signals to the machine 111 to control the acceleration, deceleration, leveling, stopping, etc. of the elevator car 103 . the elevator controller 115 may also be configured to receive position signals from the position encoder 113 . when moving up or down within the elevator shaft 117 along guide rail 109 , the elevator car 103 may stop at one or more landings 125 as controlled by the elevator controller 115 between a lowest level 126 and an uppermost level 128 . although shown in a controller room 121 , those of skill in the art will appreciate that the elevator controller 115 can be located and/or configured in other locations or positions within the elevator system 101 . in some embodiments, the elevator controller 115 can be configured to control features within the elevator car 103 , including, but not limited to, lighting, display screens, music, spoken audio words, etc. the machine 111 may include a motor or similar driving mechanism and an optional braking system. in accordance with embodiments of the disclosure, the machine 111 is configured to include an electrically driven motor. the power supply for the motor may be any power source, including a power grid, which, in combination with other components, is supplied to the motor. although shown and described with a rope-based load bearing system, elevator systems that employ other methods and mechanisms of moving an elevator car within an elevator shaft, such as hydraulics, ropeless, or any other methods, may employ embodiments of the present disclosure. fig. 1 is merely a non-limiting example presented for illustrative and explanatory purposes. embodiments detect the presence of a foreign object within the elevator shaft 117 using an elevator sensor array system. an elevator sensor array can be installed at a location 132 above the elevator car 103 and/or below the elevator car 103 , such as in a pit 134 below the lowest level 126 of the elevator car 103 in the elevator shaft 117 . in some locations, it is expected that pre-existing structures, such as stops 136 in the pit 134 , may partially reduce a detection field of an elevator sensor array intended to detection foreign objects, such as a person. embodiments initially establish locations of pre-existing objects to avoid false positives and assist in distinguishing foreign objects from pre-existing objects before triggering a modification to a control aspect of the elevator car 103 in the elevator shaft 117 based on detection of a foreign object. positioning offsets, such as raising elevator sensor arrays above the floor of the pit 134 or above an upper surface of the elevator car 103 can also reduce false positives and/or excessive sensor obstruction due to rodents, refuse, and other potential sources of unintended sensor obstruction. further aspects of elevator sensor array systems are described in reference to figs. 2-9 . fig. 2 is a schematic illustration of an elevator sensor array system 200 in accordance with an embodiment of the present disclosure. the elevator sensor array system 200 includes a computing system 202 and a sensor array 204 operable in the elevator shaft 117 of fig. 1 . the computing system 202 can acquire sensor data from the sensor array 204 and perform processing independently or in cooperation with cloud computing resources 206 . the cloud computing resources 206 can include computers linked through one or more wired, wireless, or satellite links. in some embodiments, one or more remote users can access the computing system 202 remotely through the cloud computing resources 206 to determine whether objects are present in a detection field 208 formed by the sensor array 204 and/or to make configuration updates. processing as described herein can be performed by any combination of the elevator controller 115 of fig. 1 , computing system 202 , and/or cloud computing resources 206 (e.g., remote processing resources). the sensor array 204 can be formed from a plurality of sensors 210 arranged in sensor rows 212 , 214 and sensor columns 216 , 218 about a perimeter 220 within the elevator shaft 117 of fig. 1 . the perimeter 220 can be formed of four or more sides 222 , 224 , 226 , 228 . the perimeter 220 can be internal walls or a support structure in the elevator shaft 117 , such as a location slightly elevated (e.g., one foot) above the floor of the pit 134 below the lowest level 126 reachable by the elevator car 103 . alternatively, the perimeter 220 can be at location 132 slightly above (e.g., one foot) the elevator car 103 , where the sensor array 204 is coupled to the elevator car 103 . it will be understood that multiple instances of the sensor array 204 can be installed within the elevator shaft 117 , such as at locations both above and below the elevator car 103 . in the example of fig. 2 , the detection field 208 is formed as a grid pattern of an emitted radiation source, such as light, that extends between sides 222 and 226 and between sides 224 and 228 of the perimeter 220 . for instance, when implemented with light sensors, the sensors 210 of sensor row 212 at side 222 emit light to be detected by sensors 210 of sensor row 214 at side 226 . the sensors 210 of sensor row 212 can also detect light emitted from sensors 210 of sensor row 214 . similarly, the sensors 210 of sensor column 216 at side 228 can emit light to be detected by sensors 210 of sensor column 218 at side 224 . the sensors 210 of sensor column 216 can also detect light emitted from sensors 210 of sensor column 218 . the sensors 210 can be arranged in alternating patterns of emitters and receivers in each of the sensor rows 212 , 214 and sensor columns 216 , 218 . when an emitter and a receiver of each sensor 210 are in close physical proximity or physically coupled together, beam redundancy can be achieved for enhanced protection in the event of an emitter or receiver failure (as best seen in fig. 7 ). an object within the detection field 208 can be sensed by one or more sensors 210 based on obstructing one or more emitted beams from reaching one or more sensors 210 configured to receive the emitted beams as further illustrated in the example of fig. 3 . fig. 3 depicts a schematic illustration of a configuration 300 of the elevator sensor array system 200 with a plurality of pre-existing objects 302 , 304 , 306 , 308 , and 310 . during a start-up or calibration mode of operation, the computing system 202 can detect that a plurality of sensors 210 are obstructed. for example, beams emitted from a group 312 of sensors 210 on side 222 and from a group 313 of sensors 210 on side 228 are obstructed by pre-existing object 302 , and thus the corresponding beams do not reach opposite sides 226 and 224 respectively. similarly, beams emitted from a group 314 of sensors 210 on side 222 and from a group 315 of sensors 210 on side 224 are obstructed by pre-existing object 304 , and thus the corresponding beams do not reach opposite sides 226 and 228 respectively. the computing system 202 can detect these beam gaps in the detection field 208 , where emitted beams are not received. arranging sensors 210 in a grid pattern of sensor rows 212 , 214 and sensor columns 216 , 218 can enable the computing system 202 and/or cloud computing resources 206 to determine locations and approximate size of the pre-existing objects 302 - 310 . as a further example, beams emitted from a group 316 of sensors 210 on side 226 and from a group 317 of sensors 210 on side 224 are obstructed by pre-existing object 306 . beams emitted from a group 318 of sensors 210 on side 226 and from a group 319 of sensors 210 on side 228 are obstructed by pre-existing object 308 . pre-existing object 310 obstructs beams emitted from a group 320 of sensors 210 on side 222 , from a group 321 of sensors 210 on side 224 , from a group 322 of sensors 210 on side 226 , and from a group 323 of sensors 210 on side 228 . based on the on/off type detection within the detection field 208 and known locations of the sensors 210 , sizing and location of the pre-existing objects 302 - 310 can be used to filter out known objects from foreign objects. for instance, if the pre-existing object 302 obstructs sensors 210 of sensor row 212 known to be offset by two feet from side 228 and spanning a placement distance of eighteen inches (e.g., example width of group 312 ) in combination with obstructing sensors 210 of sensor column 216 known to be offset by one foot from side 222 and also spanning a placement distance of eighteen inches (e.g., example width of group 313 ), then the pre-existing object 302 can be assessed as occupying an area of about 2.25 square feet at a specific location within the detection field 208 . fig. 4 depicts a schematic illustration of a configuration 400 of the elevator sensor array system 200 with pre-existing objects 302 , 304 , 306 , 308 , 310 and a foreign object 402 . the foreign object 402 can be any object detected by the elevator sensor array system 200 other than the pre-existing objects 302 - 310 . after start-up or a calibration mode of operation, the computing system 202 can detect that one or more sensors 210 are obstructed beyond those already known to be obstructed in groups 312 , 313 , 314 , 315 , 316 , 317 , 318 , 319 , 320 , 321 , 322 , 323 associated with pre-existing objects 302 - 310 . for example, beams emitted from a group 404 of sensors 210 on side 222 , from a group 405 of sensors 210 on side 224 , from group 406 of sensors 210 on side 226 , and from group 407 of sensors 210 on side 228 are obstructed by foreign object 402 . each of the groups 404 , 405 , 406 , 407 includes at least one sensor 210 that does not overlap with corresponding groups 320 , 317 , 322 , and 319 respectively. for instance, group 404 can be defined to include only sensors 210 that extend beyond group 320 due to an overlap in sensors 210 obstructed by pre-existing object 310 and foreign object 402 . alternatively, the group 404 can be defined as group 320 plus any additional sensors 210 that are obstructed extending beyond group 320 . similarly, in the example of fig. 4 , group 405 partially overlaps group 317 with respect to pre-existing object 306 , group 406 partially overlaps group 322 with respect to pre-existing object 310 , and group 407 partially overlaps group 319 with respect to pre-existing object 308 . thus, precise sizing estimates of the foreign object 402 may be limited due to the number of obstructions by pre-existing objects 302 - 310 ; however, a range of size estimates of the foreign object 402 can be made in view of the size and location of the pre-existing objects 302 - 310 . fig. 5 depicts a schematic illustration of a configuration 500 of the elevator sensor array system 200 with pre-existing objects 302 , 304 , 306 , 308 , 310 and foreign objects 402 , 502 , 504 . using sizing and location information previously learned about pre-existing objects 302 - 310 and beams of sensors 210 that are able to cross the detection field 208 unobstructed, the existence of foreign objects 402 , 502 , 504 and approximate sizing and location information can be determined by the computing system 202 . for example, beams 506 , 508 pass between sensor columns 216 , 218 on sides 228 , 224 above and below foreign object 502 , while beams 510 , 512 pass to the left and right of foreign object 502 between sensor rows 212 , 214 on sides 222 , 226 . similarly, beams 516 , 518 pass between sensor columns 216 , 218 on sides 228 , 224 above and below foreign object 504 , while beams 520 , 522 pass to the left and right of foreign object 504 between sensor rows 212 , 214 on sides 222 , 226 . fig. 6 depicts a schematic illustration a diagonal configuration 600 of a sensor array 604 including a plurality of sensors 210 arranged in sensor rows 612 , 614 and sensor columns 616 , 618 about perimeter 220 within the elevator shaft 117 of fig. 1 . in the example of fig. 6 , a detection field 608 is formed as a diagonal detection pattern between at least two adjacent sides 222 - 228 of the perimeter 220 . for instance, when implemented with light sensors, the sensors 210 of sensor row 612 at side 222 emit light to be detected by sensors 210 of sensor column 618 at side 224 . the sensors 210 of sensor row 612 can also detect light emitted from sensors 210 of sensor column 618 . similarly, the sensors 210 of sensor column 616 at side 228 can emit light to be detected by sensors 210 of sensor row 614 at side 226 . the sensors 210 of sensor column 616 can also detect light emitted from sensors 210 of sensor row 614 . similar to the example of figs. 2-5 , the sensors 210 can be arranged in alternating patterns of emitters and receivers; however, the emitters and receivers of the sensors 210 are arrange at a diagonal with respect to sides 222 - 228 rather than parallel and perpendicular as in the grid pattern of the sensor array 204 of figs. 2-5 . it will be understood that other arrangements of sensors 210 are contemplated within perimeter 220 . for example, a mix of angles can be used and/or placement of sensors 210 can vary in height to increase the three-dimensional volume of the detection field 208 , 608 . fig. 7 depicts a schematic illustration of a pair of sensors 702 , 704 in an elevator sensor array system in accordance with an embodiment of the present disclosure. the sensors 702 , 704 are embodiments of the sensors 210 of figs. 2-6 . the sensors 702 , 704 can be placed on opposite sides 222 / 226 , 224 / 228 or adjacent sides 222 / 224 , 226 / 228 depending on whether a parallel grid or diagonal pattern is used, as previous described in the examples of figs. 2-6 . in the example of fig. 7 , sensor 702 outputs a light beam 706 from an emitter 708 across an air gap 710 to a receiver 712 of sensor 704 . similarly, sensor 704 outputs a light beam 716 from an emitter 718 across the air gap 710 to a receiver 722 of sensor 702 . if an object obstructs the light beam 706 , the absence of the previous detected light beam 706 is observed at the receiver 712 of sensor 704 . similarly, if an object obstructs the light beam 716 , the absence of the previous detected light beam 716 is observed at the receiver 722 of sensor 702 . while the configuration of fig. 7 represents one example sensor configuration, other sensor configurations are contemplated such as sensor/reflector pairs, laser-based sensors, ultrasonic sensors, radar sensors, infrared sensors, and other such sensing technologies known in the art. referring now to fig. 8 , an exemplary computing system 800 that can be incorporated into elevator systems of the present disclosure is shown. the computing system 800 may be configured as part of and/or in communication with an elevator controller, e.g., controller 115 shown in fig. 1 , as part of the computing system 202 and/or cloud computing resources 206 of fig. 2 as described herein. the computing system 800 can be an embedded computing device, a mobile device, a tablet, a laptop computer, a microcontroller, a rack-based computing system or the like and can be located at or distributed between one or more network-accessible servers. for instance, the elements of computing system 800 can be duplicated in the computing system 202 and in other computing systems (not depicted) that provide the cloud computing resources 206 . the computing system 800 includes a memory 802 which can store executable instructions and/or data associated with the elevator sensor array system 200 of fig. 2 . the executable instructions can be stored or organized in any manner and at any level of abstraction, such as in connection with one or more applications, processes, routines, procedures, methods, etc. as an example, at least a portion of the instructions are shown in fig. 8 as being associated with a program 804 for processing sensor data and triggering actions in the elevator system 101 of fig. 1 . further, as noted, the memory 802 may store data 806 . the data 806 may include, but is not limited to, elevator car data, sensor location data, pre-existing object data, foreign object data, elevator modes of operation, commands, or any other type(s) of data as will be appreciated by those of skill in the art. the instructions stored in the memory 802 may be executed by one or more processors, such as a processor 808 . the processor 808 may be operative on the data 806 . the processor 808 , as shown, is coupled to one or more input/output (i/o) devices 810 . in some embodiments, the i/o device(s) 810 may include one or more of a keyboard or keypad, a touchscreen or touch panel, a display screen, a microphone, a speaker, a mouse, a button, a remote control, a joystick, a printer, a telephone or mobile device (e.g., a smartphone), a sensor, etc. the i/o device(s) 810 , in some embodiments, include communication components, such as broadband or wireless communication elements. the components of the computing system 800 may be operably and/or communicably connected by one or more buses. the computing system 800 may further include other features or components as known in the art. for example, the computing system 800 may include one or more transceivers and/or devices configured to transmit and/or receive information or data from sources external to the computing system 800 (e.g., part of the i/o devices 810 ). for example, in some embodiments, the computing system 800 may be configured to receive information over a network (wired or wireless) or through a cable or wireless connection with one or more devices remote from the computing system 800 (e.g. direct connection to an elevator machine, etc.). the information received over the communication network can stored in the memory 802 (e.g., as data 806 ) and/or may be processed and/or employed by one or more programs or applications (e.g., program 804 ) and/or the processor 808 . the computing system 800 is one example of a computing system, controller, and/or control system that is used to execute and/or perform embodiments and/or processes described herein. for example, the computing system 800 , when configured as part of an elevator control system, is used to receive commands and/or instructions and is configured to control operation of an elevator car through control of an elevator machine. for example, the computing system 800 can be integrated into or separate from (but in communication therewith) an elevator controller and/or elevator machine and operate as a portion of elevator sensor array system 200 of fig. 2 . the computing system 800 is configured to operate the elevator sensor array system 200 of fig. 2 using, for example, a flow process 900 of fig. 9 . the computing system 800 can include any combination of the computing system 202 and cloud computing resources 206 of fig. 2 . the flow process 900 can be performed by a computing system 800 of the elevator sensor array system 200 of fig. 2 as shown and described herein and/or by variations thereon. various aspects of the flow process 900 can be carried out using one or more sensors, one or more processors, and/or one or more machines and/or controllers. for example, some aspects of the flow process involve sensors, as described above, in communication with a processor or other control device and transmit detection information thereto. the flow process 900 is described in reference to figs. 1-9 . at block 902 , a computing system 800 of the elevator sensor array system 200 detects whether there are any pre-existing objects 302 - 310 between a first group of sensors 210 of a sensor array 204 in an elevator shaft 117 , where the first group can be a combination of two or more groups, such as groups 312 - 315 , groups 316 - 319 , and/or groups 320 - 323 . the sensor array 204 can include a plurality of sensors 210 distributed about a perimeter 220 within the elevator shaft 117 . the perimeter 220 can include at least four sides 222 - 228 with one or more of the sensors 210 on each of the at least four sides 222 - 228 forming a detection field 208 . the sensors 210 can form a grid as the detection field 208 , as in the examples of figs. 2-5 . the sensors 210 can be arranged in pairs in a diagonal configuration 600 to form a diagonal detection pattern between at least two adjacent sides 222 / 224 , 226 / 228 of the perimeter 220 . in embodiments, the sensors 210 are light sensors, where each of the light sensors 210 includes an emitter and a receiver, such as emitter 708 and receiver 722 of sensor 702 . at block 904 , the computing system 800 detects whether there is a foreign object 402 between a second group of sensors 210 of the sensor array 204 in the elevator shaft 117 , where the second group of sensors includes at least one sensor 210 that differs from the first group of sensors, such as group 320 (first group) and group 404 (second group) of fig. 4 . a size estimate of the foreign object 402 can be determined based on a number of sensors 210 and a position of the sensors 210 in the second group of sensors 210 that are used to detect the foreign object 402 . size estimation can be a range of sizes depending on whether the foreign object 402 is partially obstructed by a pre-existing object 302 - 310 . known spacing and sensor placement positions can be used to estimate the size of the foreign object 402 using a similar approach as described in reference to the pre-existing objects 302 - 310 . at block 906 , in the event that a foreign object is detected at step 904 , the computing system 800 triggers a modification to a control aspect of an elevator car 103 in the elevator shaft 117 based on detection of the foreign object 402 . the modification to the control aspect of the elevator car 103 can include reducing a maximum rate of travel of the elevator car 103 in the shaft 117 . where the sensor array 204 is installed above the elevator car 103 , the modification to the control aspect of the elevator car 103 can include preventing the elevator car 103 from going to an uppermost level 128 of the shaft 117 based on detecting the foreign object 402 above the elevator car 103 . where the sensor array 204 is installed below the elevator car 103 , such as in the pit 134 , the modification to the control aspect of the elevator car 103 can include preventing the elevator car 103 from going to the lowest level 126 of the shaft 117 based on detecting the foreign object 402 below the elevator car 103 . the modification to the control aspect of the elevator car 103 can be determined, at least in part, based on the size estimate of the foreign object 402 . in some embodiments, if the maximum size of the foreign object 402 is estimated to be less than a size threshold, a different action can be taken, such as triggering a warning indicator (e.g., a light and/or audible alert) rather than or in addition to limiting/halting movement of the elevator car 103 . detection of the foreign object 402 can trigger a notification to one or more of: a building security system, a remote monitoring system, a servicing tool, and/or other systems (not depicted). detection of the foreign object 402 can be logged by one or more systems to assist in event analysis and to further refine detection and response algorithms. other actions and uses are contemplated and will be apparent to one of ordinary skill in the art. as described herein, in some embodiments various functions or acts may take place at a given location and/or in connection with the operation of one or more apparatuses, systems, or devices. for example, in some embodiments, a portion of a given function or act may be performed at a first device or location, and the remainder of the function or act may be performed at one or more additional devices or locations. embodiments may be implemented using one or more technologies. in some embodiments, an apparatus or system may include one or more processors and memory storing instructions that, when executed by the one or more processors, cause the apparatus or system to perform one or more methodological acts as described herein. various mechanical components known to those of skill in the art may be used in some embodiments. embodiments may be implemented as one or more apparatuses, systems, and/or methods. in some embodiments, instructions may be stored on one or more computer program products or computer-readable media, such as a transitory and/or non-transitory computer-readable medium. the instructions, when executed, may cause an entity (e.g., an apparatus or system) to perform one or more methodological acts as described herein. the term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application. for example, “about” can include a range of ±8% or 5%, or 2% of a given value. the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. as used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. it will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof. while the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. in addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
033-313-287-630-848	NZ	[ "WO" ]	E04B1/74,E04B1/00,E04B7/02,E04C2/34	2016-12-05T00:00:00	2016	[ "E04" ]	improvements in, or relating to, building construction, components and methods therefor	the invention discloses a building panel for use in constructing a building, for example a residential dwelling. the panel has a first and second skin of planar form parallel to each other. there is also a top rib, joining between the first skin and second skin at or toward top portions thereof, the top rib providing at least one access from external of the building panel, to an internal volume of the building panel. there is also at least one side rib joining between the first skin and second skin at or toward side portions thereof. there is also at least one internal rib joining between the first skin and second skin on respective internal facing surfaces thereof. present also is an insulating material in the internal volume at least in part defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the building panel for utilities to pass therethrough, wherein the building panel can be used to at least in part define a wall of a building.	c laims 1. a building panel for use in constructing a building, comprising or including, a first skin of planar form, a second skin of planar form, parallel to and spaced from the first skin, a top rib, joining between the first skin a nd second skin at or toward top portions thereof, the top rib providing at least one access from external of the building pa nel, to a n internal volume of the building panel, at least one side rib joining between the first skin and second skin at or toward side portions thereof, at least one interna l rib joining between the first skin and second skin on res pective internal facing surfaces thereof, an insulating material in the interna l volume at least in part defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the building pa nel for utilities to pass therethrough, wherein the building panel can be used to at least in part define a wall of a building. 2. the building pa nel of claim 1 wherein the building is a residential dwelling, whether low or high rise, or a commercial building. 3. the building pa nel of either claim 1 or 2 wherein the first skin, second skin, at least one side rib, and at least one internal rib are made from magnesium oxide or magnesium sulphate. 4. the building pa nel of any one of claims 1 to 3 wherein the insulating material is acoustically insulating. 5. the building pa nel of any one of claims 1 to 4 wherein the insulating material is thermally insulating. 6. the building pa nel of any one of claims 1 to 5 wherein the insulating material is both acoustic a nd thermally insulative. 7. the building pa nel of any one of claims 1 to 6 wherein the at least one side rib, and at least one internal rib a re joined to the first skin a nd second skin by adhesive. the building pa nel of any one of claims 1 to 7 wherein there are two or more internal ribs that act to define the at least one void. the building pa nel of any one of claims 1 to 8 wherein the top rib is made from steel or meta l. the building pa nel of any one of claims 1 to 9 wherein the top rib includes lifting locations. the building pa nel of claim 10 wherein the at least one access in the top rib doubles as the lifting location. the building pa nel of any one of claims 1 to 1 1 wherein the at least one side rib is set into the interna l volume to define, with the first skin and the second skin, a side recess. the building pa nel of claim 12 wherein the pa nel has side recesses on each vertica l side. the building pa nel of any one of claims 1 to 13 wherein the building pa nel is ada pted to sit on a horizonta l pad to, at least in part, define the building. the building pa nel of either of claims 12 or 13 wherein the side recess at least in part engages over a vertical upright to hold the building panel at least vertically. the building pa nel of any one of claims 12, 13 or 1 5 wherein the side recess from each of a pair of adjacent pa nels each engage a mutual vertica l upright and cover the upright. the building pa nel of claim 16 wherein the upright is a post of steel, certified building board, or is a magnesium oxide or magnesium sulphate post, of hollow construction. 18. the building pa nel of either of claims 16 or 17 wherein the upright is filled with insulating material. the building pa nel of any one of claims 16 to 18 wherein the upright is hidden from sight at least externa lly, a nd preferably interna lly also, by the side recess(es). the building pa nel of any one of claims 1 to 19 wherein there is a variable eave girt that can act as a bracing strut, purlin for the roof, girt, strut for panel bracing and utility tray. the building pa nel of claim 20 wherein the variable eave girt has a variable angle to follow the line of the roof, yet remain vertical for the wall and its panels. a method of manufactu re of a building comprising or including the steps of providing a building pa nel having a first skin of planar form, a second skin of planar form, parallel to and spaced from the first skin, a top rib, joining between the first skin a nd second skin at or toward top portions thereof, the top rib providing at least one access from external of the pa nel, to an internal volume of the panel, at least one side rib joining between the first skin and second skin at or towa rd side portions thereof, at least one interna l rib joining between the first skin and second skin on respective interna l facing surfaces thereof, an insulating material in the internal volume at least in pa rt defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access a nd at least one void providing an internal conduit within the panel for utilities to pass therethrough, providing a base floor for the building pa nel to reset on, providing at least one vertical upright for a side of the building panel to over-engage at least in part, and locating the building panel on the at least one upright and securing it thereto, such that at least part of a wa ll for a residential dwelling is provided. the method according to claim 22 wherein the building is a residential dwelling, whether low or high rise, or a commercia l building. the method according to either claim 22 or 23 wherein the first skin, second skin, at least one side rib, and at least one internal rib are made from a certified building boa rd. 25. the method according to any one of claims 22 to 24 including the step of lifting the panel into place via a prime mover utilising the at least one access in the top rib. 26. the method according to any one of claims 22 to 25 including the step of locating utilities before or after locating the building panel in place. 27. the method according to any one of claims 22 to 26 involving the step of installing a variable eave girt over the building panels 28 a building including, at least one building panel comprising or including, a first skin of planar form, a second skin of planar form, parallel to and spaced from the first skin, a top rib, joining between the first skin a nd second skin at or toward top portions thereof, the top rib providing at least one access from external of the pa nel, to an interna l volume of the panel, at least one side rib joining between the first skin and second skin at or toward side portions thereof, at least one interna l rib joining between the first skin and second skin on res pective internal facing surfaces thereof, an insulating material in the interna l volume at least in part defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the building pa nel for utilities to pass therethrough, at least one upright to side engage the at least one building pa nel a nd hold it vertica lly, a variable eave girt engaged to the top rib, the variable eave girt including at least one access through the variable eave girt to the at least one access of the top rib below, the variable eave girt connecting to at least one roofing structure element above. 29. the building according to claim 28 wherein the building is a residentia l dwelling, whether low or high rise, or a commercia l building. 30. the building according to either claim 28 or 29 wherein the first skin, second skin, at least one side rib, and at least one internal rib are made from a certified building boa rd. 31. the building according to any one of claims 28 to 30 wherein the at least one panel is manufactured off site. 32. the building according to any one of claims 28 to 31 wherein the at least one panel is placed in location on the building by a prime mover. 33. a variable eave girt, comprising or including, a lower panel connecting portion, including at least one access as a n aperture from above the lower pa nel connecting portion to allow utility connection through to a pa nel below, the lower panel connecting portion ada pted to connect to a top rib of the lower panel, an upper angled connecting portion for connecting to a roof structure, wherein an a ngle of the upper angled connecting portion is variable to accommodate varying roof a ngles, a connecting portion between the lower panel connecting portion, and the upper angled connecting portion, wherein the va riable eave girt can connect one or more lower wa ll panels, to one or more roof structure elements, and provide access for utilities from externa l of the pa nel to internal of the panel through the variable eave girt. 34. the variable eave girt according to claim 33 wherein the lower panel connecting portion is tray shaped when seen from above a nd acts as a utility tray for utilities. 35. the variable eave girt according to either claim 33 or 34 wherein fastener apertures engage the one or more lower wall pa nels. 36. the variable eave girt according to any one of claims 33 to 35 wherein fastener apertures engage the one of more roof structure elements. the variable eave girt according to any one of claims 33 to 36 is available in indefinite length. the variable eave girt according to any one of claims 33 to 37 is made from a resilient material, such as steel or simila r. a kit of parts for at least part of a building, comprising or including, a lower wa ll pa nel, comprising, a first skin of planar form, a second skin of planar form, parallel to and spaced from the first skin, a top rib, joining between the first skin a nd second skin at or toward top portions thereof, the top rib providing at least one access from external of the pa nel, to an internal volume of the panel, at least one side rib joining between the first skin and second skin at or towa rd side portions thereof, at least one interna l rib joining between the first skin and second skin on respective interna l facing surfaces thereof, an insulating material in the internal volume at least in pa rt defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access a nd at least one void providing an internal conduit within the panel for utilities to pass therethrough, at least one vertical upright to engage a floor or roof element which a lso engages the lower wall panel from a side, a variable eave girt, to connect one or more lower wall panels to one or more roof structure elements, fastenings to engage the va riable eave girt to the lower wall pa nel, and to the one or more roof elements, wherein the lower wa ll panel can be engaged to the at least one vertical upright to form at least part of a wall for a residential dwelling, and the varia ble eave girt can engage to the top of the lower wall panel, and is then ready to accept one or more roofing elements. 40. the kit of parts according to claim 39 wherein the residential dwelling, is low or high rise, or a commercia l building. 41. the building according to either of claims 39 or 40 wherein the first skin, second skin, at least one side rib, a nd at least one internal rib a re made from a certified building board. 42. the building according to any one of claims 39 to 41 wherein the certified building boa rd is a magnesium oxide, or magnesium sulphate board. 43. a building panel, as described herein with reference to any one or more of the accompanying drawings. 44. a method of ma nufactu re of a building, as described herein with reference to any one or more of the accompanying drawings. 45. a building as described herein with reference to any one or more of the accompanying drawings. 46. a variable eave girt, as described herein with reference to any one or more of the accompanying drawings. 47. a kit of pa rts, as described herein with reference to a ny one or more of the accompanying drawings.	imp r ove me nts in, or r e lating to, b uil ding c ons tr uction, c omp one nts and me th ods t h e r e f or te c h nical fie l d of th e inve ntion the present invention relates to building construction. in particular, though not solely, the present invention is directed to a panel for constructing buildings, and methods for its construction and use. bac k g r ound of t h e inve ntion there are many technologies for building residential housing, whether low or high rise a nd commercial buildings. residential requirements are different to those of commercial buildings, but both can take advantages in construction efficiencies. the residential building is often built to a higher standard in terms of building performance therma lly a nd acoustically, as well as finishes required. f lexibility must a lso be available in the building technology to allow for low cost building as well as high specification buildings, while not compromising the fundamental building basics and performance. typically, there are more utility locations, for example power, internet, gas and water, in a residential dwelling than a commercial dwelling, and so therefore there must be a llowance to install these. in open framing systems, for example prefabricated fra ming, where none, or only one side of the frame is covered, this is facilitated by the ability to enclose the framing after utility installation on site. however, in systems where large portions of the building are manufactured offsite in a prefabrication with interior and exterior cladding a pplied then this is more difficult and requires majority of utility placement in place offsite. it would therefore be beneficial to allow utility placement at least to a certain degree on site in prefabricated wa ll panels. this may be useful for last minute cha nges to utility placement on site during building, or after building is completed and a user wishes to add or remove utilities. a well-known method is framing that is that clad interna lly and externa lly, for example timber of steel framing. once the framing is up, and typically the externa l cladding in place, then insulation and utilities are run inside the framing cavity. t he interna l cladding is then placed over the cavity to seal it. interna l and external finishings, such as paint and render, are then applied to therefore finish the walls of the residence. a problem with such a method is that, even if the timber framing is made in large sections, for example sections of walls, and then brought on site, erected and fastened into place, then internal and external claddings, utilities a nd insulation a nd waterproofing must still then be applied. this is costly and adds to the construction time. g enerally, the interna l and externa l claddings are fragile and so cannot be a pplied beforehand. even if they were, this creates an issue when utilities, such as water, power, gas, telecoms come to be installed. internally such framing construction must also have cross members, or nogs, running crosswise between the vertically running studs. therefore, utilities must be installed prior to either the external, or internal (typically internal), being attached. unless there are exacting design specifications made to allow pre-installation of utilities offsite, then this requires installation of utilities onsite before the fina l cladding is applied. further, such construction makes later fitting of utilities difficult as the nogs prevent access down the framing. unless access can be gained from above to drill, then the only way to add utilities on the other side of a nog is to remove the internal cladding (or external), add the utility, and then reclad that section. further, such framing requires frequent addition of bracing, either with stra ps running diagona lly, or a sheet brace, for example a sheet of plywood or similar. t he internal a nd external cladding itself plays little part in bracing the framing against movement para llel to the plane of the framing. therefore, again this ca lls for a further different material to be located on the framing, which then must also be covered and finished. it is also then undesirable at a later date to cut into the shear bracing to add utilities, and possibly compromise its performance. a further disadvantage of frame type construction is that it is typically dependent on being bolted down to the floor slab a nd temporarily braced until all remaining framing is in place. then the bracing can be removed. this results in additional work, and materials. also, timber frame construction must be dried and reach a certain moisture threshold before cladding can be applied. therefore, unless the entire building floor is covered, for example from above, then the construction is subject to the elements. this causes unexpected delays in construction due to weather, then drying and subsequent scheduling of the various trades required to complete the build. in this specification where reference has been made to patent specifications, other external documents, or other sources of information, this is generally for the purpose of providing a context for discussing the features of the invention. unless specifically stated otherwise, reference to such external documents is not to be construed as an admission that such documents, or such sources of information, in any jurisdiction, are prior art, or form part of the common genera l knowledge in the art. it is therefore an object of the present invention to provide an improved building panel and constructions therefrom, which s peeds up at least the onsite construction time, or which reduces waste, or which reduces the chances of compromising the integrity of the building envelope, or which provides the user more flexibility, or to overcome the above shortcomings or address the above desiderata, or to at least provide the public with a useful choice. b rie f de s c r iption of th e inve ntion in a first aspect the present invention consists in a build ing pa nel for use in constructing a building, comprising or including, a first skin of plana r form, a second skin of pla nar form, parallel to and spaced from the first skin, a top rib, joining between the first and second skins at or toward top portions thereof, the top rib providing at least one access from external of the panel, to an internal volume of the panel, at least one side rib joining between the first and second skins at or toward side portions thereof, at least one internal rib joining between the first and second skins on respective internal facing surfaces thereof, an insulating material in the internal volume at least in part defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the pa nel for utilities to pass therethrough, wherein the building panel can be used to at least in pa rt define a wall of a residential building. p referably the building is a residential dwelling, whether low or high rise, or a commercial building. p referably the first a nd second skins, at least one side rib, a nd at least one internal rib are made from a certified building board. p referably the certified building boa rd is a magnesium oxide or magnesium sulphate. p referably the insulating material is acoustically insulating. p referably the insulating material is thermally insulating. p referably the insulating material is both acoustic and thermally insulative. p referably the at least one side rib, at at least one internal rib are joined to the first skin and second skin by adhesive. p referably there are two or more interna l ribs that act to define the at least one void. p referably the top rib is made from steel or metal. p referably the top rib includes lifting locations. p referably the at least one access in the top rib doubles as the lifting location. p referably the at least one side rib is set into the internal volume to define with the first skin and the second skin a side recess. p referably the panel has side recesses on each vertical side. p referably the building pa nel is adapted to sit on a horizontal pad to at least one pa rt define the building. p referably the side recess at least in pa rt engages over a vertical upright to hold the pa nel at least vertically. p referably the side recesses of a pair of adjacent panels each engage a mutua l upright and cover the upright. p referably the upright is a post of steel, or is a magnesium oxide or magnesium sulphate post of hollow construction. p referably the upright is filled with insulating materia l. p referably the vertical upright is hidden from sight at least externally, a nd preferably internally also, by the side recess(es). p referably there is a variable eave girt that ca n act as a bracing strut, purlin for the roof, girt, strut for panel bracing and utility tray. p referably the variable eave girt has a variable angle to follow the line of the roof, yet remain vertical for the wall a nd its pa nels. in another aspect the present invention consists in a method of manufactu re of a building comprising or including the steps of p roviding a building pa nel having a first skin of planar form, a second skin of pla nar form, parallel to a nd spaced from the first skin, a top rib, joining between the first and second skins at or towa rd top portions thereof, the top rib providing at least one access from external of the panel, to a n internal volume of the panel, at least one side rib joining between the first and second skins at or toward side portions thereof, at least one internal rib joining between the first and second skins on res pective internal facing surfaces thereof, an insulating material in the interna l volume at least in part defined by the first skin, second skin, top rib and the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the panel for utilities to pass there through, p roviding a base floor for the building panel to reset on, p roviding at least one vertica l upright for a side of the building panel to over- engage at least in pa rt, and locating the building panel on the at least one upright and securing it thereto, such that at least part of a wall for a residential dwelling is provided. p referably the building is a residential dwelling, whether low or high rise, or a commercial building. p referably the first a nd second skins, at least one side rib, a nd at least one internal rib being made from magnesium oxide or magnesium sulphate. p referably the method includes the step of lifting the panel into place via a prime mover utilising the at least one access in the top rib. p referably the method includes the step of locating utilities before or after locating the panel in place. p referably the method involves the step of installing a variable eave girt over the building panels in another aspect the present invention consist in a building including, at least one panel comprising or including, a first skin of planar form, a second skin of pla nar form, parallel to a nd spaced from the first skin, a top rib, joining between the first and second skins at or towa rd top portions thereof, the top rib providing at least one access from externa l of the panel, to a n internal volume of the panel, at least one side rib joining between the first and second skins at or toward side portions thereof, at least one internal rib joining between the first and second skins on respective interna l facing surfaces thereof, an insulating material in the internal volume at least in part defined by the first skin, second skin, top rib a nd the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the panel for utilities to pass therethrough, at least one upright to side engage the at least one panel and hold it vertica lly, a variable eave girt engaged to the top rib, the variable eave girt including at least one access through the varia ble eave girt to the at least one access of the top rib below, the variable eave girt connecting to at least one roofing structure element above. p referably the building is a residential dwelling, whether low or high rise, or a commercial building. p referably the first a nd second skins, at least one side rib, a nd at least one internal rib being made from magnesium oxide or magnesium sulphate. p referably the at least one pa nel is ma nufactured off site. p referably the at least one pa nel is placed in location on the building by a prime mover. in another aspect the present invention consists in a va ria ble eave girt, comprising or including, a lower panel connecting portion, including at least one access as an a perture from above the lower panel connecting portion to a llow utility connection through to a panel below, the lower panel ada pted to connect to a top rib of the lower panel, an upper angled connecting portion for connecting to a roof structure, wherein an angle of the upper a ngled connecting portion is varia ble to accommodate varying roof angles, a connecting portion between the lower pa nel connecting portion, and the upper angled connecting portion, wherein the variable eave girt can connect one or more lower wall panels, to one or more roof structure elements, and provide access for utilities from external of the pa nel to internal of the pa nel through the variable eave girt. p referably the lower panel connecting portion is tray s haped when seen from above and acts as a utility tray for utilities. p referably the variable eave girt includes fastener a pertures to engage the one or more lower wa ll panels. p referably the variable eave girt includes fastener a pertures to engage the one of more roof structure elements. p referably the variable eave girt is availa ble in indefinite length. p referably the variable eave girt is made from a resilient material, such as steel or similar. in yet another aspect the present invention consists in a kit of parts for at least part of a building, comprising or including, a lower wa ll panel, comprising, a first skin of planar form, a second skin of pla nar form, parallel to a nd spaced from the first skin, a top rib, joining between the first and second skins at or towa rd top portions thereof, the top rib providing at least one access from externa l of the panel, to a n internal volume of the panel, at least one side rib joining between the first and second skins at or toward side portions thereof, at least one internal rib joining between the first and second skins on respective interna l facing surfaces thereof, an insulating material in the internal volume at least in part defined by the first skin, second skin, top rib a nd the at least one side rib, the insulating material having at least one void therein located under the at least one access, the at least one access and at least one void providing an internal conduit within the panel for utilities to pass therethrough, at least one vertical upright to engage a floor or roof element which also engages the lower wall panel from a side, a variable eave girt, to connect one or more lower wall panels to one or more roof structure elements, fastenings to engage the variable eave girt to the lower wall pa nel, a nd to the one or more roof elements, wherein the lower wall panel can be engaged to the at least one vertical upright to form at least part of a wa ll for a residential dwelling, and the variable eave girt ca n engage to the top of the lower wall panel, and is then ready to accept one or more roofing elements. p referably the building is a residential dwelling, whether low or high rise, or a commercial building. p referably the first a nd second skins, at least one side rib, a nd at least one internal rib being made from magnesium oxide or magnesium sulphate. in another aspect the present invention consists in a building pa nel, as described herein with reference to any one or more of the accompanying drawings. in another aspect the present invention consists in a method of manufactu re of a building, as described herein with reference to any one or more of the accompanying drawings. in another aspect the present invention consists in a va ria ble eave girt, as described herein with reference to any one or more of the accompa nying drawings. in another aspect the present invention consists in a kit of parts, as described herein with reference to any one or more of the accompanying drawings. as used herein the term and/or. means and. or or., or both. as used herein ' (s) . following a noun means the plural and/or singular forms of the noun. the term comprising , as used in this specification means consisting at least in part of.. when interpreting statements in this specification which include that term, the features, prefaced by that term in each statement, all need to be present, but other features can also be present. related terms such as comprise . and comprised. are to be interpreted in the same manner. it is intended that reference to a range of numbers disclosed herein (for example, 1 to 10) also incorporates reference to a ll rationa l numbers within that range (for example, 1 , 1.1 , 2, 3, 3.9, 4, 5, 6, 6.5, 7, 8, 9 and 10) and also a ny range of rational numbers within that range (for example, 2 to 8, 1.5 to 5.5 a nd 3.1 to 4.7). the entire disclosures of all applications, patents and publications, cited above and below, if any, are hereby incorporated by reference. to those skilled in the art to which the invention relates, many changes in construction and widely differing embodiments a nd application of the invention will suggest themselves without departing from the scope of the invention as defined in the appended claims. the disclosures and the descriptions herein are purely illustrative and are not intended to be in any sense limiting. other aspects of the invention may become apparent from the following description which is given by way of example only and with reference to the accompanying drawings. b rie f d e s c r iption of th e d rawing s p referred forms of the present invention will now be described with reference to the accompanying drawings in which; figu re 1 s hows an exploded schematic of a building utilising the pa nel a nd building method of the present invention, figure 2 shows an isometric cutaway upperviewof a panel of the present invention, figure 3 shows a close up top view of the top rib with utility access and lifting hole visible, figure 4 shows an isometric close up view of the top region of the panel showing the variable eave girt, and support by the wall structural post, figure 5 s hows a similar view to that of figure 4, with the exception the wall structural post is replaced by a post made of the same or similar material as the panel skin, with insulation in the post, figure 6 shows an isometric close up view of the connection between the panel, variable eave girt (providing a utility tray), and a roof, and figure 7 shows in side elevation a cutaway view of a building panel on a foundation slab. detailed description of the invention preferred embodiments will now be described with reference to figures 1 through 7. shown in figure 2 is a building panel 1, which consists of a firstskin 2, and a parallel to, and spaced from it, is a second skin 3. between these two is formed an internal void 7. on side portions 9 are side ribs 8. the side ribs 8 are inset into the internal volume 7 to form a side recess 16 on each side, the use of which will be described below. the recess 16 is shown with an even length of first and second skin forming the recess, however, in otherforms one skin may be longer than the other, for example the first skin extending further than the second, or the second skin extending further than the first. at a top portion 5 of the panel there is a top rib 4. in some embodiments, there is a bottom rib towards the bottom of the panel 1 also. within the internal volume 7 there are internal ribs 10, as stringers, running between the firstskin 2 and second skin 3 and these run in the preferred form from at or near the top rib 4 to the bottom, or bottom rib 30 (as seen in figure 7) if present. these ribs add stiffness and strength to the sandwich building panel 1. in one embodiment the first skin 2, second skin 3, side ribs 8, internal rib 10 and optional bottom rib are made from a certified building board, such as magnesium sulphate, mgs 04, or magnesium oxide, mgo. however, other materials with comparable properties as needed may be used, for example plywood or other engineered timber, or other magnesium, or simila r material boards may be used. in the preferred form, this is cut from sheet, or may be moulded in the desired shape. t he top rib 4 is made from steel, or a similar resilient material. in the preferred form, the top rib 4 is made from rolled steel, preferably galva nised, but may be made from other forming techniques a lso. in the form shown the top rib 4 is channel shaped with the opening 31 of the cha nnel facing downwards as s hown in f igure 2, but other forms are a lso envisaged. p resent in the top rib 4 is at least one access 6, and preferably there are many accesses 6 evenly, or not, spread along the top, as shown in f igures 3 through 5. the access is through the thickness of the top rib 4 as a hole. p refera bly there are no rough edges a nd the access 6 is smooth. p resent a lso, though not shown in figure 2, are fastener apertures 24 to allow for connection to the variable eave girt 19 described below, or other structures. within the internal volume 7 there is insulating material 11 that performs either thermal insulation, or acoustic insulation, or that performs both these functions. in one form, this insulation is that sold under, or known as r oc kwoolu insulation, but could be any form of suitable insulation, such as polyisocyanurate (pir). the insulation a lso has preferably the added property of water resista nce, fungal resistance, a nd fire resistance. the interna l ribs 10 are preferably located evenly throughout the internal volume 7. t he internal voids 12 are preferably located directly under, a nd are accessible from above, through the access 6 in the top rib 4. in the preferred form, these voids 12 form conduits 13 a nd allow for running utilities, such as, but not limited to, electricity, water, gas, telecommunications, or others as needed. the smooth internal form of the conduit 13 formed by the void allows for easy running of utilities as needed and prevents snags if utilities are later insta lled. in the preferred form, the voids 12 a re formed by a pair of internal ribs 7 located either side of the access 6. in the void 7 so formed there is no insulation to allow for easy location of utilities. in other less preferred forms the voids may be formed by other structures, such as, but not limited to, pipes, reduction in internal insulation or similar. in the preferred form, the panel 1 is laminated from one skin 2 through to the other skin 3. for example, the first skin 2 is laid down, then top rib 4, side ribs 8, and optional bottom rib located and glued into place against the first skin 2. internal ribs 10 are then located and glued into place using adhesive 14, for example to form the voids 12 described. in one form, the interna l ribs 10 are rebated at their top region to account for the thickness of the cha nnel walls of the top rib 4, to a llow them to s lide all the way in, if needed, into the cha nnel of the top rib 4. insulation material 1 1 is then located in the pa rtially formed internal volume 7. at this stage utilities from the top rib, down through the access 6, into the conduits 13, may be added a nd partially terminated. f inally, the other skin, for example the second skin 3, is then located a nd glued into place against the top rib 4, side ribs 8, interna l ribs 10 and optional bottom rib. apertures (not s hown) may be present in which ever of the first or second skins is the building internal facing skin to allow for further fixing a nd termination of utilities, for example power points, gas connection points, telecommunication junctions, water, waste water a nd simila r. p ressure may then be applied perpendicularly to the major plan of the first and second skins to ensure the correct connection of all the components, for example by adhesive 14, though other systems may be used such as small pins, screws or similar, as well as geometrical requirements. if necessary to cure the glue or adhesive 14, then heat or other conditions may be applied also. in the preferred form, the glue or adhesive 14 is a high-strength fire-rated bonding agent to form the composite structural building pa nel 1 . a va riable eave girt 19, in keeping with the present invention is shown in f igures 4 through 6, including its usage with the panel 1. t he variable eave girt 19 consists of a lower connecting portion 27, connecting portion 29 and upper angled connecting portion 28. the lower connecting portion 27 in the embodiment shown is substantially flat on its lower outer surface, and its inner surface forms a channel with the connecting portion 29 as shown in figure 6. t his forms a utility tray 23 which helps control utilities for the pa nels 1 located below. the lower connecting portion 27 in the preferred form has at least one access 6 also, and preferably has multiple accesses 6 along its length. in the preferred form, these are arranged to coincide with the access 6 in the top rib 4 below of the panel 1 the girt 19 connects to. this allows ease of connection of utilities 21. the upper angled connecting portion 28 provides a purlin structure that is at the correct angle to follow the pitch of the roof 26, while the connecting portion 29 a nd lower panel connecting portion 27 remain para llel, and perpendicular respectively to the plane of the panel 1 below. the girt 19 connects to the rafter system of the roof 26, which connects to the apex connection at the top of the roof. p resent also in each of the lower connecting portion 27 and upper connecting portion 28 are fastener apertures 24 as seen in figure 4. these in one form line up with like apertures in the top rib 4 below, and roofing elements 26 above, to a llow fasteners 25 to connect the pa nel 1 to the girt 19, and the roofing elements 26 to the girt 19. the variable eave girt 19 performs the following functions: i bracing strut i p urlin for affixing roof 26 i g irt for affixing panels 1 and transiting loads to post a nd rafter frames i s trut for in pla ne bracing connection i locking pa nels down in place prior to roof 26 insta llation. the top rib 4 has as described, accesses 6. once assembled into a panel 1 the access serves a further vital function as a lifting location 1 5 for a prime mover 20 to lift the panel 1 into place. t herefore, the top rib 4 and access 6 must be resilient enough to carry this load, in one form the access 6 is swaged into the top rib 4. in use to form a residential dwelling 22 it is preferred that a horizontal pad 17 as a base or floor is formed, for example a concrete or similar sla b. as part of forming the slab, or separate thereto, vertical uprights 18 as stringers are placed at the correct intervals to receive a panel 1 , as shown in f igure 1 " the side recesses 16 of the panel covering all or part of the upright 18. t he upright interval is defined as the dista nce between the outer facing surfaces of the side ribs 8 of a single pa nel " that is the distance across the panel between the inner surfaces of the side recesses 16. thus, the uprights 18 will be recessed into, preferably, the pa nel side recesses 16 a nd therefore at least in part covered by either or both of the first and second skins 2, 3. the vertical uprights may for example be a steel or metal post as shown in figure 4, or may be made from a similar materia l, for example, but not limited to certified building boa rd, or magnesium based, to the pa nels 1 , as shown in figure 5, and both may be filled with insulation material 1 1. when the upright 18 is steel or meta l then it can form a dew point and collect condensation. t he recesses are therefore sealed from the internal volume 7 of the panel to prevent moisture getting inside the pa nel. this way the side recesses and upright ca n breathe from interna l to the external environment. this allows condensation a nd other gases to escape from the interior of the building to the exterior. optionally a bottom post 33 may also be located into place on the slab 17, and this will sit within the bottom recess 32, as seen in f igure 7. t he panels 1 a re located into place by lifting locations 15 by a prime mover 20, a nd lowered into place from a bove between the two uprights 17. if a bottom post 33 is present, then an optiona l bottom recess 32 in the panel may fit over the bottom post 33. once the panel or pa nels 1 is/are located in place then the girt 19 can be located and fastened in place to the panel 1 using fasteners 25. in the preferred form, the girt 19 a lso fastens down onto the vertical post 18 to lock the panels 1 and girt 19 down, and thus also the roof 26. the upper angled connecting portion 28 may be at the correct angle for the roof pitch, or may be varied on site as needed. t he roofing elements 26 can then be located in place. the s kins of the panels may a lso be textured as desired, for example they may have an embossed pattern to resemble wood or pa nelling or similar. the foregoing description of the invention includes preferred forms thereof. modifications may be made thereto without departing from the scope of the invention.
035-957-286-986-46X	EP	[ "EP", "US", "CA", "WO" ]	E04F21/08,F16L11/00,B05B7/14,F16L25/00,E04F21/12,F15D1/02,F16L11/118,F16L11/12	2022-04-13T00:00:00	2022	[ "E04", "F16", "B05", "F15" ]	loosefill insulation hose connector, loosefill insuation hose and loosefill insulation installation system	the present disclosure relates generally to loose fill insulation installation systems, for example, suitable for installing loose fill insulation to an installation site. the present disclosure relates more particularly to a loose fill insulation hose including a plurality of tubular sections coupled together so as to form a conduit configured to convey loose fill insulation along a path from a blowing machine to an installation site. the tubular sections include a first hose section, a first connector section, and a second connector section. the first hose section includes a flexible body that forms an opening with a first cross-sectional area. the first connector section includes a plurality of projections that extend inward. the second connector section includes a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area.	a loose fill insulation hose comprising a plurality of tubular sections coupled together so as to form a conduit configured to convey loose fill insulation along a path from a blowing machine to an installation site, the tubular sections comprising: a first hose section extending from a proximal end to a distal end, the first hose section including a flexible body that surrounds the path and forms an opening with a first cross-sectional area; a first connector section coupled to the first hose section, the first connector section comprising a first tubular body including a first interior surface that surrounds the path, wherein the first interior surface includes a major surface portion and a plurality of projections that extend inward from the major surface portion, wherein the projections are configured to open the loose fill insulation; and a second connector section coupled to the first hose section, the second connector section comprising a second tubular body including a second interior surface that surrounds the path, the second interior surface including a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area. the loose fill insulation hose according to claim 1, wherein the first connector section and second connector section are part of a first connection module, wherein the plurality of projections of the first connector section comprises a series of annular projections along a length of the first connector section including smaller projections that extend into the path by a first radial depth and larger projections that extend into the path by a second radial depth that is greater than the first radial depth, and wherein the constricted opening of the second connector section is formed by a circumferential projection that extends inward into the path. the loose fill insulation hose according to claim 2, wherein the smaller projections and larger projections alternate along the length of the first connector section. the loose fill insulation hose according to any of claim 2 or claim 3, wherein at least some of the annular projections are tapered so as to have a reduced thickness at a radially inner edge. the loose fill insulation hose according to claim 4, wherein the tapered annular projections include a conical upstream surface. the loose fill insulation hose according to any of claims 2 to 5, wherein each of the larger projections has the same geometry and wherein each of the smaller projections has the same geometry. the loose fill insulation hose according to any of claims 2 to 6, wherein the first connection module is attached to the proximal end of the first hose section. the loose fill insulation hose according to any of claims 2 to 6, wherein the first connection module is attached to the distal end of the first hose section. the loose fill insulation hose according to any of claims 1 to 8, wherein the opening formed by the tubular body of the first hose section is circular and has a first diameter, wherein the constricted opening of the interior surface of the second connector section is circular and has a second diameter, and wherein the second diameter is no more than 70% of the first diameter, e.g., no more than 65% of the first diameter, e.g., no more than 62% of the first diameter, e.g., no more than 50% of the first diameter. the loose fill insulation hose according to any of claims 1 to 9, wherein the first hose section is one of a group of hose sections that are connected in series using a group of connection modules. a system for delivering loose fill insulation, the system comprising: a loose fill insulation blowing machine comprising: a hopper configured to receive loose fill insulation, an outlet, and a blower operable to expel loose fill insulation through the outlet; and a loose fill insulation hose according to any of claims 1 to 10 attached to the outlet of the loose fill insulation blowing machine. a method of delivering loose fill insulation to an installation site using the system according to claim 11, the method comprising: expelling loose fill insulation from a blowing machine into the loose fill insulation hose; and conveying the loose fill insulation through the loose fill insulation hose to the installation site. the method according to claim 12, wherein the delivered loose fill insulation has an increased r value of at least 1%, e.g., at least 1.5%, e.g., at least 2%, compared to an unmodified system using the same blowing machine and operating parameters with an unmodified hose, and wherein the unmodified hose includes the same hose sections as the loose fill insulation hose that are coupled with connection modules having a smooth interior surface of constant diameter and an interior diameter that is the same as the major surface portion of the first interior surface of the first connection section. the method according to claim 12, wherein the delivered loose fill insulation has an increased coverage of at least 10%, e.g., at least 20%, e.g., at least 30%, compared to an unmodified system using the same blowing machine and operating parameters with an unmodified hose, and wherein the unmodified hose includes the same hose sections as the loose fill insulation hose that are coupled with connection modules having a smooth interior surface of constant diameter and an interior diameter that is the same as the major surface portion of the first interior surface of the first connection section. a connection module for a loose fill insulation hose, the connection module comprising: a tubular body including an interior surface that surrounds a path for conveying loose fill insulation, wherein the interior surface includes a major surface portion and a series of annular projections along a length of the tubular body that extend inward from the major surface portion, wherein the major surface portion forms an opening having a first cross-sectional area, wherein the series of annular projections includes smaller projections and larger projections that extend into the path by a radial depth that is greater than the smaller projections, and wherein at least one of the larger projections forms a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area.	background of the disclosure 1. field of the disclosure the present disclosure relates generally to loose fill insulation installation systems, for example, suitable for installing loose fill insulation to an installation site. the present disclosure relates more particularly to a loose fill insulation hose operable to convey loose fill insulation from an insulation blowing machine. 2. technical background loose fill insulation is packaged in bags in which the material becomes compacted prior to storage and shipment. when removed from the bags, the insulation separates into clumps. in order to effectively install the insulation material, it is initially conditioned to increase its volume and to reduce its density. traditionally, pneumatic devices are used to both install the insulation and perform the conditioning. the conditioning process breaks up clumps and alters the arrangement of the fibers so as to "open up' the insulation, conditioning the fiber to a more flake-like form. the conditioned insulation is then applied pneumatically to an area by blowing it through a hose connected to the pneumatic device. the insulation may be moistened and/or treated in the pneumatic device before installation. while existing systems for installing loose fill insulation are effective, the present inventors have identified certain aspects of these systems that can be improved. summary of the disclosure in one aspect, the present disclosure provides a loose fill insulation hose comprising a plurality of tubular sections coupled together so as to form a conduit configured to convey loose fill insulation along a path from a blowing machine to an installation site, the tubular sections comprising: a first hose section extending from a proximal end to a distal end, the first hose section including a flexible body that surrounds the path and forms an opening with a first cross-sectional area; a first connector section coupled to the first hose section, the first connector section comprising a first tubular body including a first interior surface that surrounds the path, wherein the first interior surface includes a major surface portion and a plurality of projections that extend inward from the major surface portion, wherein the projections are configured to open the loose fill insulation; and a second connector section coupled to the first hose section, the second connector section comprising a second tubular body including a second interior surface that surrounds the path, the second interior surface including a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area. in another aspect, the disclosure provides a system for delivering loose fill insulation, the system comprising: a loose fill insulation blowing machine comprising: a hopper configured to receive loose fill insulation, an outlet, and a blower operable to expel loose fill insulation through the outlet; and a loose fill insulation hose according to the disclosure attached to the outlet of the loose fill insulation blowing machine. in another aspect, the disclosure provides a method for delivering loose fill insulation to an installation site using the system of the disclosure, the method comprising: expelling loose fill insulation from a blowing machine into the loose fill insulation hose; and conveying the loose fill insulation through the loose fill insulation hose to the installation site. in another aspect, the disclosure provides a connection module for a loose fill insulation hose, the connection module comprising: a tubular body including an interior surface that surrounds a path for conveying loose fill insulation, wherein the interior surface includes a major surface portion and a series of annular projections along a length of the tubular body that extend inward from the major surface portion, wherein the major surface portion forms an opening having a first cross-sectional area, wherein the series of annular projections includes smaller projections and larger projections that extend into the path by a radial depth that is greater than the smaller projections, and wherein at least one of the larger projections forms a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area. additional aspects of the disclosure will be evident from the disclosure herein. brief description of the drawings the accompanying drawings are included to provide a further understanding of the methods and devices of the disclosure, and are incorporated in and constitute a part of this specification. the drawings are not necessarily to scale, and sizes of various elements may be distorted for clarity. the drawings illustrate one or more embodiment(s) of the disclosure, and together with the description serve to explain the principles and operation of the disclosure. fig. 1a is a schematic side view of a loose fill insulation system according to an embodiment of the disclosure; fig. 1b is a schematic front view of the loose fill insulation system of fig. 1a ; fig. 1 c is a schematic cross-sectional side view of a portion of the loose fill insulation hose of the system of fig. 1a ; fig. 1d is a schematic perspective view of a connection module show in the portion of the loose fill insulation hose of fig. 1c ; fig. 2 is a schematic cross-sectional side view of a portion of a loose fill insulation hose according to another embodiment of the disclosure; fig. 3 is a schematic cross-sectional side view of a portion of a loose fill insulation hose according to another embodiment of the disclosure; fig. 4a is a schematic cross-sectional view of a connection module according to an embodiment of the disclosure; fig. 4b is a schematic perspective view of the connection module of fig. 4a ; and fig. 5 is chart showing installation performance with several hose configurations. detailed description the present inventors have acknowledged that the internal geometries of loose fill insulation hoses can help open the loose fill insulation during installation, and improve the installation performance. moreover, the inventors have identified that the internal geometry within one or more connectors attached to hose sections can provide such improved performance. accordingly, one aspect of the disclosure is a loose fill insulation hose that includes a plurality of tubular sections coupled together to form a conduit configured to convey loose fill insulation along a path from a blowing machine to an installation site. the tubular sections include a first hose section, a first connector section and a second connector section. the first hose section extends from a proximal end to a distal end and includes a flexible body that surrounds the path for the insulation. the flexible body of the first hose section forms an opening with a first cross-sectional area. the first and second connector sections are both coupled to the first hose section so as to form the continuous path for conveying insulation. the first connector section includes a first tubular body with a first interior surface that surrounds the path. the first interior surface of the first tubular body includes a major surface portion and a plurality of projections that extend inward from the major surface portion. the second connector section includes a second tubular body including a second interior surface that surrounds the path. the second interior surface includes a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area. such a loose fill insulation hose is schematically shown in figs. 1a and 1b as part of a loose fill insulation system. loose fill insulation hose 120 includes several tubular sections coupled together to form a conduit for conveying loose fill insulation along a path from a blowing machine to an installation site. as used herein, the term coupled is not limited to direct connections between elements. rather, two tubular sections may be coupled to one another indirectly by other sections such that both tubular sections form part of the same path for loose fill insulation. as shown in figs. 1a and 1b , loose fill insulation hose 120 includes a first hose section 130, a second hose section 140, and a third hose section 150 that are arranged in a sequence from a distal end of loose fill insulation hose 120 to a proximal end that attaches to the blowing machine. first hose section 130 includes a flexible body 133 that extends from a proximal end 131 to a distal end 132. similarly, second hose section 140 includes a flexible body 143 that extends from a proximal end 141 to a distal end 142, and third hose section 150 includes a flexible body 153 that extends from a proximal end 151 to a distal end 152. loose fill insulation hose 120 also includes several connection modules, such as connection module 160 between first hose section 130 and second hose section 140, and connection module 180 between second hose section 140 and third hose section 150. in the embodiment of loose fill insulation hose 120, as shown in fig. 1a , the hose sections are attached to the connection modules using clamps. for example, first hose section 130 is coupled to connection module 160 using a clamp 134 that surrounds first hose section 130 and fastens the first hose section 130 to the connection module 160. similarly, second hose section 140 is coupled to the opposite side of connection module 160 using another clamp 144. on the other hand, in some embodiments, the hose sections include end fittings that are configured to attach to the connection modules. other methods of securing the hose sections to the connection modules are also possible. in embodiments of the loose fill insulation hose, the connection modules include various sections. as explained in further detail below, at least one of the connection modules includes a section with projections, and at least one of the connection modules includes a constricted opening. in some embodiments, the loose fill insulation hose has a connection module that includes both of these types of connector sections. in other embodiments, the loose fill insulation hose includes a first connection module with a section that includes projections and a second connection module with a section that includes a constricted opening. further, in some embodiments, the loose fill insulation hose includes a connection module that has both of these sections and a connection module that has only one of these sections. further still, in some embodiments, the loose fill insulation hose includes other types of connector sections, such as simple tubular sections. fig. 1c illustrates a section of loose fill insulation hose 120 that includes connection module 160 positioned between first hose section 130 and second hose section 140. fig. 1d shows a perspective view of connection module 160. as shown in fig. 1c , in the embodiment of loose fill insulation hose 120, connection module 160 includes a first connector section 164 and a second connector section 174. first connector section 164 includes a tubular body 165 with an interior surface 166 that surrounds the path 163 for the conveyed loose fill insulation. interior surface 166 has a major surface portion 167 that defines the outer portion of the conduit through tubular body 165. a plurality of projections 168, 169 extend radially inward from major surface portion 167 into the path 163. the projections 168, 169 are configured to open the loose fill insulation as it travels through connection module 160. as air flowing through the hose carries the loose fill insulation through connection module 160, fibers or particles of the loose fill insulation may catch on the projections 168, 169 and be pulled open or apart. second connector section 174 includes a second tubular body 175 with a second interior surface 176 that surrounds the path 163. the second interior surface 176 includes a constricted opening 177 with cross-sectional area that is substantially less than the cross-sectional area of the first hose section 130. for example, as shown in fig. 1c , the cross-sectional area of the constricted opening 177 is defined by the diameter 178 while the cross-sectional area of the first hose section 130 is defined by the diameter 138 of the first hose section 130. in some embodiments the, the cross-sectional area of the constricted opening is no more than 50% of the cross-sectional area of the first hose section, e.g. no more than 40% of the cross-sectional area of the first hose section, e.g., no more than 30% of the cross-sectional area of the first hose section, no more than 20% of the cross-sectional area of the first hose section. by reducing the size of path 163 through connection module 160, constricted opening 177 causes air passing through connection module 160 to accelerate, which may increase turbulence and help condition the loose fill insulation flowing through connection module 160. in certain embodiments of the loose fill insulation hose as otherwise described herein, the opening formed by the tubular body of the first hose section is circular and has a first diameter, the constricted opening of the interior surface of the second connector section is circular and has a second diameter, and the second diameter is no more than 70% of the first diameter, e.g., no more than 65% of the first diameter, e.g., no more than 62% of the first diameter, e.g., no more than 50% of the first diameter, e.g. no more than 40% of the first diameter. for example, in the embodiment shown in figs. 1a-1d , the tubular body 133 of first hose section 130 has a circular cross section such that the cross-sectional opening through the first hose section 130. accordingly, the area of the opening that is formed by tubular body 133 is defined by the diameter 138 of first hose section 130, as shown in fig. 1c . similarly, as shown in fig. 1d , the constricted opening 177 of connection module 160 is also circular. as a result, the area of the constricted opening 177 is defined by diameter 178 (see fig. 1c ) of constricted opening 177. in other embodiments, the constricted opening is not circular. for example, in some embodiments, the constricted opening is formed by a slot. in other embodiments, the constricted opening is the result of various projections around the circumference of the tubular body, such that the constricted opening has the shape of a gear or star. other shapes are also possible. the area of the constricted opening, as described herein, is determined at a particular location along the length of the connector section and based on the cross-section of the opening at that location. in certain embodiments of the loose fill insulation hose as otherwise described herein, the plurality of projections of the first connector section includes a series of annular projections along a length of the first connector section. for example, each of the projections 168, 169 of first connection section 164 of connection module 160 is formed as an annular ring that encircles path 163 and extends radially inward from interior surface 166 around the circumference of tubular body 175. the projections 168, 169 are spaced at regular intervals along the length of first connector section 164. in other embodiments, the spacing along the length of the first connector section is irregular. further, in some embodiments, the projections are not annular and have other shapes and forms. for example, the projections may be formed as spikes, as explained in more detail below. further the projections may have various different shapes, such as square, triangular, round, or other shapes, including randomly configured shapes. in certain embodiments of the loose fill insulation hose as otherwise described herein, the series of annular projections includes smaller projections that extend into the path by a first radial depth and larger projections that extend into the path by a second radial depth that is greater than the first radial depth. for example, connection module 160 includes a group of larger projections 169 that extend into path 163 by about 25% of the diameter of major surface portion 167, and a group of smaller projections 168 that extend radially inward about half the distance of larger projections 169. the use of both larger and smaller projections may help increase turbulence of the air flowing through connection module 160, which can assist in conditioning loose fill insulation travelling through the hose. in certain embodiments of the loose fill insulation hose as otherwise described herein, the smaller projections and larger projections alternate along the length of the first connector section. for example, the smaller projections 168 of first connector section 164 of connection module 160 are interspersed between the larger projections 169. this repeated change in diameter may also increase turbulence within connection module 160. in other embodiments, the smaller and larger projections are arranged in a different pattern. for example, in some embodiments, the first connector section includes a greater number of smaller projections upstream and greater number of larger projections downstream. on the other hand, in other embodiments the first connector section includes a greater number of smaller projections downstream. in certain embodiments of the loose fill insulation hose as otherwise described herein, at least some of the annular projections are tapered so as to have a reduced thickness at a radially inner edge. for example, in some embodiments, the upstream surface of the projections has a conical shape such that the projection narrows toward the center of the connection module. for example, each of the projections 168, 169 of tapered annular projections include a conical upstream surface as demonstrated by surface 171 in fig. 1c . the conical shape of the upstream surface of projections 168 and 169 can help direct the flow through connection module 160 by angling toward the open center of the tubular body 165. while the projections 168, 169 of connection module have a flat downstream surface, in other embodiments, the projections include conical surfaces on both sides, such that the projections may be symmetric. in certain embodiments of the loose fill insulation hose as otherwise described herein, each of the larger projections has the same geometry. likewise, in some embodiments each of the smaller projections has the same geometry. for example, in first connector section 164, each of the larger projections 169 have the same geometry and each of the smaller projections 168 also have the same geometry. in other embodiments, the projections have different shapes and sizes. for example, in some embodiments, the first connector section includes smaller projections with a range of radial depths that vary but are all below a threshold depth, and larger projections with a range of radial depths that are all above the threshold depth. such projections may have similar shapes or different shapes. in certain embodiments of the loose fill insulation hose as otherwise described herein, the constricted opening of the second connector section is formed by a circumferential projection that extends inward into the path and has the same geometry as the larger projections of the first connector section. for example, in connection module 160, constricted opening 177 of second connector section 174 is formed by a circumferential projection 179 that has the same geometry as each of the larger projections 169 of first connector section 164. in other embodiments, the constricted opening of the second connector section has a different geometry from any of the projections of the first connector section. such an embodiment is shown in fig. 2 . connection module 260 is part of loose fill insulation hose 220 and is connected between a first hose section 230 and a second hose section 240. connection module 260 includes a first connector section 264 that is formed by a tubular body 265 that surrounds a path 263 extending through connection module 260. tubular body 265 has an interior surface 266 that includes a major surface portion 267, which defines the outer dimension of the path 263. the interior surface 266 of first connector section 264 also includes a plurality of projections 268 that extend radially inward into path 263. in contrast to the annular projections of connection module 160, the projections 268 of connection module 260 are formed as spikes that extend into the flow path. it will be appreciated that in various embodiments of the connection modules, the projections can cause the flow of material to take on a path directed by the flow generated, and as such may impart a spin or tumble, that can modify the turbulence being experienced by the loose fill insulation particles. connection module 260 also includes a second connector section 274 including a tubular body 270 with an interior surface 276 that narrows to a constricted opening 277. the constricted opening 277 has a reduced diameter 278 compared to the diameter of the first hose section 230 and second hose sections 230. in certain embodiments of the loose fill insulation hose as otherwise described herein, the first connector section and the second connector section are part of the same connection module. for example, as shown in fig. 1c , connection module 160 includes both first connector section 164 including projections 168 and 169 as well as second connector section 174 including constricted opening 177. furthermore, in connection module 160, the tubular body 165 of first connector section 164 is formed in a single integral piece with the tubular body 175 of second connector section 174. likewise, as shown in fig. 2 , connection module 260 includes both first connector section 264 and including projections 268 and second connector section 274 including constricted opening 277. again, the tubular body 265 of first connector section 264 is formed in a single integral piece with the tubular body 275 of second connector section 274. in other embodiments, the first and second connector sections are coupled to one another in a single connection module without being integrally formed. for example, the first connector section may interlock with the second connector section to form a combined connection module. in some embodiments, the second connector section is downstream of the first connector section. for example, in connection module 160, second connector section 174 including constricted opening 177 is downstream of first connector section 164. likewise, in connection module 260, second connector section 274 is downstream of first connector section 264. in other embodiments, the second connector section is upstream of the first connector section. for example, in some embodiments, the connection module includes a connector section with a plurality of projections downstream of a connector section with a constricted opening. while the first and second connector sections may be provided in the same connection module, as in connection module 160 and connection module 260, in other embodiments, the first connector section and second connector sections are provided in separate connection modules. a portion of such a loose fill insulation hose is shown in fig. 3 . loose fill insulation hose 320 includes a first connection module 360 attached to a proximal end of a first hose section 330 and a second connection module 370 attached to the distal end of first hose section 330. connection module 360 includes a first connector section 364 that is formed by a tubular body 365 that surrounds a path 363 extending through connection module 360. tubular body 365 has an interior surface 366 that includes a major surface portion 367, which defines the outer dimension of the path 363. the interior surface 366 of first connector section 364 also includes a plurality of projections 368 that extend radially inward into path 363. connection module 370 includes a second connector section 374. second connector section 374 includes a tubular body 375 that surrounds a path 373 extending through connection module 370. tubular body 375 has an interior surface 376 that narrows to a constricted opening 377. the constricted opening 377 has a reduced diameter 378 compared to the diameter of the first hose section 330. in some embodiments, the second connection module is downstream of the first connection module. for example, in loose fill insulation hose 320, second connection module 370 including second connector section 374 with constricted open 377 is downstream of first connection module 360 with first connector section 364. in other embodiments, the second connection module is upstream of the first connection module. the first and second connectors sections of the loose fill insulation hose may be positioned in connection modules at various locations along the loose fill insulation hose. for example, in loose fill insulation hose 120, as shown in figs. 1a-1c , both the first connector section 164 and second connector section 174 are located in first connection module 160, which is between first hose section 130 and second hose section 140 near the distal end of hose 120. in other embodiments, the first and second connector section may be located in a connection module between other pairs of hose sections along the length of the hose, or in separate connection modules, as explained above. in certain embodiments of the loose fill insulation hose as otherwise described herein, the loose fill insulation hose further comprises a proximal connection module including a first side configured to attach to an outlet of a loose fill insulation blowing machine and a second side attached to the proximal end of the first hose section. for example, loose fill insulation hose 120, shown in figs. 1a and 1b , includes a proximal connection module 185 that has a first side 186 and a second side 187. the second side 187 of the proximal connection module 185 is attached to the proximal end 151 of first hose section 150 while the first side 186 of proximal connection module 185 is attached to an outlet 106 of loose fill insulation blowing machine 102. accordingly, proximal connection module 185 is at the proximal end of loose fill insulation hose 120 and receives the loose fill insulation as it leaves blowing machine 102. in some embodiments, the proximal connection module may include one or more connector sections having projections and/or constricted openings, as described above. accordingly, loose fill insulation passing through the proximal connection module may be conditioned toward the beginning of the hose. alternatively, in other embodiments, the loose fill insulation hose includes a proximal connection module and a coupler configured to attach to an outlet of the loose fill insulation blowing machine. in such an embodiment, a first side of the proximal connection module is attached to the coupler and a second side of the proximal connection module is attached to the proximal end of a hose section. in some embodiments, the coupler is used to enable the connection between the loose fill insulation hose and the outlet of the blowing machine. for example, in some embodiments, the coupler has two female couplings to receive male couplings on the blowing machine outlet and proximal connection module. in other embodiments, the coupler has two male couplings. in still yet other embodiments the coupler may contain one male and one female coupling on opposite ends. further, in some embodiments, the coupling changes the diameter of the opening so that a hose and blowing machine outlet of different diameters can be connected. in other embodiments the loose fill insulation hose does not include a proximal connection module. for example, in some embodiments, one of the hose sections is either directly attached to the blowing machine outlet or is attached to the blowing machine outlet using a coupler. in certain embodiments of the loose fill insulation hose as otherwise described herein, the first hose section and the second hose section are part of a group of hose sections that are connected in series, and the loose fill insulation hose further comprises a distal connection module attached at a distal end of the hose. for example, loose fill insulation hose 120 shown in fig. 1 includes a group of hose sections that includes first hose section 130, second hose section 140 and third hose section 150 connected in series. in other embodiments, the hose may include more than three hose sections, such as 4, 5, or more hose sections connected in series. at the distal end of loose fill insulation hose 120 is a distal connection module 190. in some embodiments, the distal connection module may include one or more connector sections having projections and/or constricted openings, as described above. accordingly, loose fill insulation passing through the distal connection module may be conditioned toward the end of the hose. in some embodiments, the loose fill connection hose may include an outlet nozzle attached to the distal connection module. still, in other embodiments, the loose fill insulation module may exclude a distal connection module. for example, in some embodiments, an outlet nozzle is connected directly to a hose section. further, in other embodiments, the end of the hose is formed by a hose section, and neither a connection module nor an outlet nozzle is included at the end. in certain embodiments of the loose fill insulation hose as otherwise described herein, the projections of the first connector section vary in size. for example, in some embodiments, the projections extend to varying depths from the outer surface portion. likewise, in some embodiments, the projections vary in size along the length of the respective connection module. further, in some embodiments, the projections vary in all dimension, while in other embodiments, the projections have some consistent dimensions and some varying dimensions. the projections may have various different shapes. for example, in some embodiments, the projections have triangular, trapezoidal or square shapes. further, in some embodiments, the projections have conical or cylindrical shapes. further, the projections may have other shapes. it should be understood that the shapes described herein refer to a characteristic of the projection from one or more perspective. in certain embodiments of the loose fill insulation hose as otherwise described herein, each of the projections of the first connector section forms a spike that extends into the path. for example, the projections 268 of connection module 260 are formed as spikes that extend from the major surface portion 267 into the path 263. in other embodiments, the projections may have other forms. for example, in some embodiments, the projections have ring shapes as in connection module 160, shown in figs. 1c and 1d . the projections may also take other forms. in certain embodiments of the loose fill insulation hose as otherwise described herein, the annular projections are perpendicular to the length of the connection module. for example, each of the projections 168, 169 of connection module 160 is aligned around an axis of the connection module 160 so that the annular projections are perpendicular to the length of connector section 164. in other embodiments, the annular projections are tilted with respect to the length of the connection module. for example, connection module 460, shown in figs. 4a and 4b , includes an interior surface 466 with a major surface portion 467 and plurality of projections 468 that extend inward from major surface portion 467 along the length of connection module 460. each of the projections 468 is tilted with respect to the axis that runs along the length of connection module 460. a connector section including projections, such as that shown in fig. 4 , may be incorporated into a connection module that also includes a second connector section with a restricted opening, or may form a stand-alone connection module. in certain embodiments of the loose fill insulation hose as otherwise described herein, the first tubular body of the first hose section includes projections that extend inward into the path. such hose configurations are described, for example, in u.s. patent no. 7,284,573 , which is hereby incorporated by reference herein in its entirety. in some embodiments, the first tubular body of the first hose section extend into the path by a first radial depth and at least some of the projections of the first connector section extend into the path by a second radial depth that is at least 3 times larger than the first radial, e.g., at least 5 times larger. in certain embodiments of the loose fill insulation hose as otherwise described herein, the diameter of the interior surface of the first connection module is at least 1.5 inches, e.g., at least 2 inches, e.g., at least 2.5 inches. in some embodiments, the diameter of the interior surface of the first connection module is no more than 8 inches, e.g., no more than 6 inches, e.g., no more than 4 inches. for example, in some embodiments, the diameter of the interior surface of the first connection module is in a range from 1.5 inches to 8 inches, e.g., from 2 inches to 6 inches; or from 1.5 inches to 4 inches, e.g., from 2.5 inches to 3.5 inches. further, in some embodiments each of the connection modules has the same inner diameter. in other embodiments, some of the connection modules have different inner diameters. in certain embodiments of the loose fill insulation hose as otherwise described herein, the first side of the first connection module is a male fitting that is inserted into the distal end of the first hose section, and the second side of the first connection module is a male fitting that is inserted into the proximal end of the second hose section. for example, as shown in fig. 1a , each of the first side 161 and second side 162 of first connection module 160 are formed as a male fitting that is inserted into the first hose section 130 and second hose section 140, respectively. in other embodiments, the first connection module includes female fittings and the hose sections include male fittings that are inserted into the connection module. further, in some embodiments, the first connection module includes a male fitting on one side and a female fitting on the other side. such a configuration allows connection between two adjacent connection modules without an intervening hose section or coupler. in certain embodiments of the loose fill insulation hose as otherwise described herein, the first hose section is corrugated. for example, first hose section 130 of loose fill insulation hose 120, as shown in figs. 1a-1c , has a corrugated tubular body 133. corrugated hose can have increased flexibility and strength compared to similar hose with a smooth outer surface. the other hose sections of loose fill insulation hose 120 are similarly corrugated, as shown in figs. 1a and 1b . in other embodiments, the hose section may have a different profile, such as smooth. in certain embodiments of the loose fill insulation hose as otherwise described herein, the first hose section has a length of at least 10 feet, e.g., at least 15 feet, e.g., at least 20 feet. in some embodiments, the first hose section has a length of no more than 100 feet, e.g., no more than 80 feet, e.g., no more than 60 feet, e.g., about 50 feet. for example, in some embodiments, the first hose section has a length in a range from 10 feet to 100 feet, e.g., from 12 feet to 80 feet, e.g., from 15 feet to 60 feet, e.g., from 20 feet to 50 feet. in some embodiments each of the hose sections has the same length. in other embodiments the hose sections of the loose fill insulation hose have different lengths. in certain embodiments of the loose fill insulation hose as otherwise described herein, an inner diameter of the first hose section is at least 1.5 inches, e.g., at least 2 inches, e.g., at least 2.5 inches. in certain embodiments of the loose fill insulation hose as otherwise described herein, an inner diameter of the first hose section is no more than 8 inches, e.g., no more than 6 inches, e.g., no more than 4 inches. for example, in some embodiments, the inner diameter of the first hose section is in a range from 1.5 inches to 8 inches, e.g. from 2 inches to 6 inches, e.g., from 2.5 inches to 4 inches. further, in some embodiments each of the hose sections has the same inner diameter. in other embodiments, some of the hose sections have different inner diameters. in another aspect, the disclosure provides a system for delivering loose fill insulation that includes a loose fill insulation blowing machine and the loose fill insulation hose of the disclosure. the blowing machine includes a hopper configured to receive loose fill insulation, an outlet, and a blower operable to expel loose fill insulation through the outlet. the loose fill insulation hose is attached to the outlet of the loose fill insulation blowing machine. such a system is schematically shown in figs. 1a and 1b . loose fill insulation system 100 includes a blowing machine coupled to loose fill insulation hose 120, which is described in detail above. loose fill insulation blowing machine 102 includes a hopper 104 configured to receive insulation. blowing machine 102 conditions the insulation, which is then delivered to hose 120 through outlet 106 through the use of a blower 108. the blower 108 circulates air through blowing machine 102 to carry the loose fill insulation through hose 120 to an installation site at the distal end of the hose. in certain embodiments of the system of the disclosure, the hopper includes a shredder box configured to break apart the loose fill insulation. for example, hopper 104 includes a shredder box 110 including a plurality of shredding members that rotate through the packed insulation to break the insulation apart and "open" the insulation. in certain embodiments of the system of the disclosure, the loose fill insulation blowing machine includes an air lock configured to transfer the loose fill insulation to the outlet. for example, the insulation in system 100 moves from the shredder box 110 through a stator bar 112 that includes tines for further opening the insulation and into an air lock 114. as shown in fig. 2 , the air lock 114 includes a plurality of sealed vanes 116 (see fig. 1b ) that rotate around a drum and transport the insulation to an area where the air flow from blower 108 carries the insulation through outlet 106. the air lock 114 directs the air flow out through the outlet 106 rather than back into the shredder box 110. in another aspect, the disclosure provides a method of delivering loose fill insulation to an installation site using the system of the disclosure. the method includes expelling loose fill insulation from a blowing machine into the loose fill insulation hose. the loose fill insulation is conveyed through the loose fill insulation hose to the installation site. such a method is depicted in fig. 1a . packed insulation 101 is initially introduced into blowing machine 102 via the hopper 104. the packed insulation 101 is broken up and opened by the shredder box 110 and stator bar 112 as it moves into air lock 114. the air lock 114 then moves the insulation to a position where air from blower 108 can carry the insulation through hose 120 to an installation site at the distal end of hose 120, where the loose fill insulation 118 is delivered to the installation site. in certain embodiments of the method as otherwise described herein, the method further includes opening the loose fill insulation that is passing through the first connection module using projections extending inward into the path between the first hose section and the second hose section. for example, as the loose fill insulation in system 100 passes through first connection module 160, the projections 168 interact with the insulation and further open the insulation, as explained in more detail above. in certain embodiments of the method as otherwise described herein, the loose fill insulation includes a fibrous material. for example, in some embodiments, the loose fill insulation is a fiberglass insulation, a cellulose insulation, a stonewool insulation, a plastic fiber insulation, a natural wool insulation, a natural cotton insulation, or another insulation including fibers. in other embodiments, the loose fill insulation includes small insulating components, such as a foam bead insulation or a plastic particle insulation. as stated above, the first connector section including projections and the second connector section including a constricted opening may be located at various positions along the length of the loose fill insulation hose. the position of the connector sections may impact the performance of insulation that is installed using the loose fill insulation hose. for example, fig. 5 shows the r value at 0.427pcf, 7.5in (hr·ft 2 ·f°/btu) as measured in accordance with astm c518 and total coverage at 12" (sqft) of 62 lbs of loose fill insulation installed using a blowing machine and various loose fill insulation hose configurations. each of the loose fill insulation hose configurations includes three 50 ft hose sections, each having a 3 inch diameter. the hose sections are connected either by standard tubular connectors (i.e., with a uniform circular inner wall) or with an enhanced connection module having the configuration of connection module 160 shown in figs. 1c and 1d . specifically, the enhanced connection module includes four smaller annular projections that form a 2 inch diameter opening. each of the smaller projections is followed by a larger annular projection that forms a 1.5 inch diameter opening. (in accordance with the foregoing description, the final larger annular projection forms a constricted opening of a second connector section.) fig. 5 shows data for various hose configurations when insulating an attic to a depth of 12 inches using 62 lbs. of loose fill insulation. the data compares hoses using at least one instance of the above-described enhanced connection module with a hose using only standard connection modules to couple the hose sections. further, the hoses that include enhanced connection modules in only certain locations utilize standard connection modules in the rest of the hose. the standard connection modules have a smooth interior surface of constant diameter that extends over the length of the standard connection module. further, the interior diameter of the standard connection module is the same as the diameter of the major surface portion of the interior surface of the first connection section of the enhanced connection module. as shown, compared to the hoses with only standard connection modules, the hoses with the enhanced connection modules yield increased r value and substantially increased coverage. consistent with the description above, "section 1" is the hose section positioned toward the distal end of the hose and "section 3" is the hose section positioned near the blowing machine. for example, each of the hoses including at least one of the enhanced connection module yields an increase in average r value of at least 2%. likewise, each of the hoses including at least one enhanced connection module yields an increase in coverage of at least 20%. the data in fig. 5 also shows further gains in r value and coverage when including the enhanced connection module at the distal end of the hose compared to positioning the enhanced connection module between hose sections. for example, each of the hoses including an enhanced connection module at the distal end yields an increased r value of at least 4% and an increased coverage of at least 30%. moreover, positioning an enhanced connection module at each position along the hose length yields further improvement in r value and may also provide increased coverage. however, the present inventors found that including the enhanced connection module at the distal end of the hose resulted in the insulation projecting out from the hose further than when the enhanced connection module was separated from the distal end of the hose. this increased arc length of the insulation exiting the hose can complicate installation in certain scenarios, such as in enclosed spaces like an attic. accordingly, in some embodiments, the second connector section including a constricted opening is spaced from a distal end of the hose by at least 3 feet, e.g., by at least 6 feet. the distance between the constricted opening and the distal end of the hose can help reduce the arc length of the insulation exiting the hose. on the other hand, in some embodiments, a larger arc length may be desirable, and the constricted opening may be included near or at the end of the hose. it will be apparent to those skilled in the art that various modifications and variations can be made to the processes and devices described here without departing from the scope of the disclosure. thus, it is intended that the present disclosure cover such modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. embodiments embodiment 1. a loose fill insulation hose comprising a plurality of tubular sections coupled together so as to form a conduit configured to convey loose fill insulation along a path from a blowing machine to an installation site, the tubular sections comprising: a first hose section extending from a proximal end to a distal end, the first hose section including a flexible body that surrounds the path and forms an opening with a first cross-sectional area; a first connector section coupled to the first hose section, the first connector section comprising a first tubular body including a first interior surface that surrounds the path, wherein the first interior surface includes a major surface portion and a plurality of projections that extend inward from the major surface portion, wherein the projections are configured to open the loose fill insulation; and a second connector section coupled to the first hose section, the second connector section comprising a second tubular body including a second interior surface that surrounds the path, the second interior surface including a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area. embodiment 2. the loose fill insulation hose according to embodiment 1, wherein the opening formed by the tubular body of the first hose section is circular and has a first diameter, wherein the constricted opening of the interior surface of the second connector section is circular and has a second diameter, and wherein the second diameter is no more than 70% of the first diameter, e.g., no more than 65% of the first diameter, e.g., no more than 62% of the first diameter, e.g., no more than 50% of the first diameter. embodiment 3. the loose fill insulation hose according to embodiment 1 or embodiment 2, wherein the first connector section is part of a first connection module. embodiment 4. the loose fill insulation hose according to embodiment 3, wherein the first connection module is attached to the proximal end of the first hose section. embodiment 5. the loose fill insulation hose according to embodiment 3, wherein the first connection module is attached to the distal end of the first hose section. embodiment 6. the loose fill insulation hose according to embodiment 5, wherein the first connection module is disposed at a distal end of the hose. embodiment 7. the loose fill insulation hose according to any of embodiments 3 to 6, wherein the second connector section is part of the first connection module. embodiment 8. the loose fill insulation hose according to embodiment 7, wherein the second connector section is downstream of the first connector section. embodiment 9. the loose fill insulation hose according to embodiment 1 to 6, wherein the second connector section is part of a second connection module. embodiment 10. the loose fill insulation hose according to embodiment 9, wherein the second connection module is downstream of the first connection module. embodiment 11. the loose fill insulation hose according to embodiment 10, wherein the second connection module is attached to the distal end of the first hose section. embodiment 12. the loose fill insulation hose according to any of embodiments 1 to 10, wherein the first hose section is one of a group of hose sections that are connected in series using a group of connection modules. embodiment 13. the loose fill insulation hose according to any of embodiments 1 to 12, wherein the constricted opening of the second connector section is formed by a circumferential projection that extends inward into the path. embodiment 14. the loose fill insulation hose according to any of embodiments 1 to 13, wherein the plurality of projections of the first connector section includes a series of annular projections along a length of the first connector section. embodiment 15. the loose fill insulation hose according to embodiment 14, wherein the series of annular projections includes smaller projections that extend into the path by a first radial depth and larger projections that extend into the path by a second radial depth that is greater than the first radial depth. embodiment 16. the loose fill insulation hose according to embodiment 15, wherein the smaller projections and larger projections alternate along the length of the first connector section. embodiment 17. the loose fill insulation hose according to any of embodiments 14 to 16, wherein at least some of the annular projections are tapered so as to have a reduced thickness at a radially inner edge. embodiment 18. the loose fill insulation hose according to embodiment 17, wherein the tapered annular projections include a conical upstream surface. embodiment 19. the loose fill insulation hose according to any of embodiments 15 to 19, wherein each of the larger projections has the same geometry. embodiment 20. the loose fill insulation hose according to embodiment 19, wherein each of the smaller projections has the same geometry. embodiment 21. the loose fill insulation hose according to any of embodiments 1 to 20, wherein the first tubular body of the first hose section includes projections that extend inward into the path. embodiment 22. the loose fill insulation hose according to embodiment 21, wherein the projections of the first tubular body of the first hose section extend into the path by a first radial depth and at least some of the projections of the first connector section extend into the path by a second radial depth that is at least 3 times larger than the first radial, e.g., at least 5 times larger. embodiment 23. a system for delivering loose fill insulation, the system comprising: a loose fill insulation blowing machine comprising: a hopper configured to receive loose fill insulation, an outlet, and a blower operable to expel loose fill insulation through the outlet; and a loose fill insulation hose according to any of embodiments 1 to 28 attached to the outlet of the loose fill insulation blowing machine. embodiment 24. a method of delivering loose fill insulation to an installation site using the system according to embodiment 23, the method comprising: expelling loose fill insulation from a blowing machine into the loose fill insulation hose; and conveying the loose fill insulation through the loose fill insulation hose to the installation site. embodiment 25. a method of delivering loose fill insulation to an installation site using the system according to embodiment 23, the method comprising: expelling loose fill insulation from a blowing machine into the loose fill insulation hose; and conveying the loose fill insulation through the loose fill insulation hose to the installation site, wherein the delivered loose fill insulation has an increased r value of at least 1%, e.g., at least 1.5%, e.g., at least 2%, compared to an unmodified system using the same blowing machine and operating parameters with an unmodified hose, wherein the unmodified hose includes the same hose sections as the loose fill insulation hose that are coupled with connection modules having a smooth interior surface of constant diameter and an interior diameter that is the same as the major surface portion of the first interior surface of the first connection section. embodiment 26. a method of delivering loose fill insulation to an installation site using the system according to embodiment 23, the method comprising: expelling loose fill insulation from a blowing machine into the loose fill insulation hose; and conveying the loose fill insulation through the loose fill insulation hose to the installation site, wherein the delivered loose fill insulation has an increased coverage of at least 10%, e.g., at least 20%, e.g., at least 30%, compared to an unmodified system using the same blowing machine and operating parameters with an unmodified hose, wherein the unmodified hose includes the same hose sections as the loose fill insulation hose that are coupled with connection modules having a smooth interior surface of constant diameter and an interior diameter that is the same as the major surface portion of the first interior surface of the first connection section. embodiment 27. a connection module for a loose fill insulation hose, the connection module comprising: a tubular body including an interior surface that surrounds a path for conveying loose fill insulation, wherein the interior surface includes a major surface portion and a series of annular projections along a length of the tubular body that extend inward from the major surface portion, wherein the major surface portion forms an opening having a first cross-sectional area, wherein the series of annular projections includes smaller projections and larger projections that extend into the path by a radial depth that is greater than the smaller projections, and wherein at least one of the larger projections forms a constricted opening with a second cross-sectional area that is no more than 50% of the first cross-sectional area. embodiment 28. the connection module according to embodiment 27, wherein the smaller projections and larger projections alternate along the length of the first connector section. embodiment 29. the connection module according to embodiment 27 or embodiment 28, wherein each of the smaller projections extends into the path by the same radial depth. embodiment 30. the connection module according to any of embodiments 27 to 29, wherein each of the larger projections extends into the path by the same radial depth. embodiment 31. the connection module according to any of embodiments 27 to 30, wherein at least some of the annular projections are tapered so as to have a reduced thickness at a radially inner edge. embodiment 32. the connection module according to embodiment 31, wherein the tapered annular projections include a conical upstream surface.
036-609-943-617-636	JP	[ "US" ]	H01L29/10	2009-03-06T00:00:00	2009	[ "H01" ]	semiconductor device and method for manufacturing the same	it is an object to provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. in a semiconductor device including an inverted staggered thin film transistor whose semiconductor layer is an oxide semiconductor layer, a buffer layer is provided over the oxide semiconductor layer. the buffer layer is in contact with a channel formation region of the semiconductor layer and source and drain electrode layers. a film of the buffer layer has resistance distribution. a region provided over the channel formation region of the semiconductor layer has lower electrical conductivity than the channel formation region of the semiconductor layer, and a region in contact with the source and drain electrode layers has higher electrical conductivity than the channel formation region of the semiconductor layer.	1. a semiconductor device comprising a transistor, the transistor comprising: a first oxide semiconductor layer; a second oxide semiconductor layer over the first oxide semiconductor layer; a source electrode over the second oxide semiconductor layer; and a drain electrode over the second oxide semiconductor layer, wherein the first oxide semiconductor layer includes a channel formation region, wherein the second oxide semiconductor layer includes a first region overlapping with the channel formation region, wherein the second oxide semiconductor layer includes a second region in contact with the source electrode, wherein the second oxide semiconductor layer includes a third region in contact with the drain electrode, wherein the first region is located between the source electrode and the drain electrode, wherein a thickness of each of the second region and the third region is thicker than a thickness of the first region, wherein the first region has a first electrical conductivity, wherein the second region has a second electrical conductivity, wherein the third region has a third electrical conductivity, and wherein each of the second electrical conductivity and the third electrical conductivity is higher than the first electrical conductivity. 2. the semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises titanium. 3. the semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises molybdenum. 4. the semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises manganese. 5. the semiconductor device according to claim 1 , wherein each of the source electrode and the drain electrode is in direct contact with a top surface of the second oxide semiconductor layer. 6. the semiconductor device according to claim 1 , wherein each of the source electrode and the drain electrode comprises a titanium film, and wherein the titanium film is in direct contact with the second oxide semiconductor layer. 7. the semiconductor device according to claim 1 , further comprising an insulating film over the source electrode and the drain electrode, wherein an entire top surface of the first region is in contact with the insulating film. 8. the semiconductor device according to claim 1 , wherein the semiconductor device is incorporated in one selected from the group consisting of a computer, a portable information terminal, a mobile phone, a camera and a television device. 9. a display module comprising the semiconductor device according to claim 1 , comprising an fpc. 10. an electronic apparatus comprising the semiconductor device according to claim 1 , comprising at least one of a speaker, a battery, and an operation key. 11. a semiconductor device comprising a transistor, the transistor comprising: a first oxide semiconductor layer; a second oxide semiconductor layer over the first oxide semiconductor layer; a source electrode over the second oxide semiconductor layer; and a drain electrode over the second oxide semiconductor layer, wherein the first oxide semiconductor layer includes a channel formation region, wherein the second oxide semiconductor layer includes a first region overlapping with the channel formation region, wherein the second oxide semiconductor layer includes a second region in contact with the source electrode, wherein the second oxide semiconductor layer includes a third region in contact with the drain electrode, wherein the first region is located between the source electrode and the drain electrode, wherein a thickness of each of the second region and the third region is thicker than a thickness of the first region, wherein the first region has a first electrical conductivity, wherein the second region has a second electrical conductivity, wherein the third region has a third electrical conductivity, wherein each of the second electrical conductivity and the third electrical conductivity is higher than the first electrical conductivity, and wherein the first region contains oxygen at a higher concentration than the second region and the third region. 12. the semiconductor device according to claim 11 , wherein the second oxide semiconductor layer comprises titanium. 13. the semiconductor device according to claim 11 , wherein the second oxide semiconductor layer comprises molybdenum. 14. the semiconductor device according to claim 11 , wherein the second oxide semiconductor layer comprises manganese. 15. the semiconductor device according to claim 11 , wherein each of the source electrode and the drain electrode is in direct contact with a top surface of the second oxide semiconductor layer. 16. the semiconductor device according to claim 11 , wherein each of the source electrode and the drain electrode comprises a titanium film, and wherein the titanium film is in direct contact with the second oxide semiconductor layer. 17. the semiconductor device according to claim 11 , further comprising an insulating film over the source electrode and the drain electrode, wherein an entire top surface of the first region is in contact with the insulating film. 18. the semiconductor device according to claim 11 , wherein the semiconductor device is incorporated in one selected from the group consisting of a computer, a portable information terminal, a mobile phone, a camera and a television device. 19. a display module comprising the semiconductor device according to claim 11 , comprising an fpc. 20. an electronic apparatus comprising the semiconductor device according to claim 11 , comprising at least one of a speaker, a battery, and an operation key.	background of the invention 1. field of the invention the present invention relates to a semiconductor device including an oxide semiconductor and a manufacturing method thereof. 2. description of the related art there are a variety of kinds of metal oxides intended for many uses. indium oxide is a well-known material and is used as a transparent electrode material necessary for a liquid crystal display or the like. some metal oxides have semiconductor characteristics. for example, metal oxides having semiconductor characteristics include tungsten oxide, tin oxide, indium oxide, zinc oxide, and the like, and thin film transistors in which a channel formation region is formed using such a metal oxide having semiconductor characteristics are already known (see patent documents 1 to 4, non-patent document 1). examples of metal oxides include not only an oxide of a single metal element but also an oxide of a plurality of metal elements. for example, ingao 3 (zno) m (m: natural number) having a homologous series is known as an oxide semiconductor of a plurality of metal elements, including in, ga, and zn (see non-patent documents 2 to 4). further, it is proved that the oxide semiconductor formed using an in—ga—zn based oxide as described above can be used for a channel layer of a thin film transistor (see patent document 5, non-patent documents 5 and 6). reference patent document [patent document 1] japanese published patent application no. s60-198861[patent document 2] japanese published patent application no. h8-264794[patent document 3] japanese translation of pct international application no. h11-505377[patent document 4] japanese published patent application no. 2000-150900[patent document 5] japanese published patent application no. 2004-103957 non-patent document [non-patent document 1] m. w. prins, k. o. grosse-holz, g muller, j. f. m. cillessen, j. b. giesbers, r. p. weening, and r. m. wolf, “a ferroelectric transparent thin-film transistor,” appl. phys. lett., 17 jun. 1996, vol. 68 pp. 3650-3652[non-patent document 2] m. nakamura, n. kimizuka, and t. mohri, “the phase relations in the in 2 o 3 —ga 2 zno 4 —zno system at 1350 °c”, j. solid state chem., 1991, vol. 93, pp. 298-315[non-patent document 3] n. kimizuka, m. isobe, and m. nakamura, “syntheses and single-crystal data of homologous compounds, in 2 o 3 (zno) m (m=3, 4, and 5), ingao 3 (zno) 3 , and ga 2 o 3 (zno) m (m=7, 8, 9, and 16) in the in 2 o 3 —znga 2 o 4 —zno system”, j. solid state chem., 1995, vol. 116, pp. 170-178[non-patent document 4] m. nakamura, n. kimizuka, t. mohri, and m. isobe, “syntheses and crystal structures of new homologous compounds, indium iron zinc oxides (infeo 3 (zno) m ) (m:natural number) and related compounds”, kotai butsuri ( solid state physics ), 1993, vol. 28, no. 5, pp. 317-327[non-patent document 5] k. nomura, h. ohta, k. ueda, t. kamiya, m. hirano, and h. hosono, “thin-film transistor fabricated in single-crystalline transparent oxide semiconductor”, science, 2003, vol. 300, pp. 1269-1272[non-patent document 6] k. nomura, h. ohta, a. takagi, t. kamiya, m. hirano, and h. hosono, “room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors”, nature, 2004, vol. 432 pp. 488-492 summary of the invention it is an object to provide a highly reliable semiconductor device including a thin film transistor having stable electric characteristics. in a semiconductor device including an inverted staggered thin film transistor in which an oxide semiconductor layer is used as a semiconductor layer, a buffer layer is provided over the oxide semiconductor layer. the buffer layer is provided to be in contact with a channel formation region of the semiconductor layer and source and drain electrode layers. a film of the buffer layer has resistance distribution. in the buffer layer, a region provided over the channel formation region of the semiconductor layer has lower electrical conductance (electrical conductivity) than the channel formation region of the semiconductor layer, and regions in contact with the source and drain electrode layers have higher electrical conductance (electrical conductivity) than the channel formation region of the semiconductor layer. in addition, the buffer layer and the semiconductor layer have higher electrical conductance (electrical conductivity) (i.e., lower resistance) than a gate insulating layer. specifically, the descending order of electrical conductance (electrical conductivity) in respective portions is as follows: electrical conductivity in low resistance regions of the buffer layer (regions in contact with the source and drain electrode layers), electrical conductivity in the channel formation region of the semiconductor layer, electrical conductivity in a high resistance region of the buffer layer (region provided over the channel formation region), and electrical conductivity in the gate insulating layer. the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, electric characteristics of the thin film transistor are stable and increase in off current can be prevented. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, contact resistance can be reduced and on current can be increased. as a result, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. the buffer layer can be formed using an oxide semiconductor layer including titanium, molybdenum, or manganese. addition of a metal element such as titanium, molybdenum, or manganese to the oxide semiconductor layer makes the oxide semiconductor layer have high resistance. note that in this specification, an element to be included in the buffer layer, such as titanium, molybdenum, or manganese is added in forming the buffer layer. for example, the buffer layer is formed by a sputtering method with use of a target containing titanium, molybdenum, or manganese. the oxide semiconductor layer used for the buffer layer may be formed using an oxide material having semiconductor characteristics. for example, an oxide semiconductor whose composition formula is represented by inmo 3 (zno) m (m>0) can be used, and particularly, an in—ga—zn—o based oxide semiconductor is preferably used. note that m denotes one or more metal elements selected from gallium (ga), iron (fe), nickel (ni), manganese (mn), and cobalt (co). for example, m denotes ga in some cases; meanwhile, m denotes the above metal element such as ni or fe in addition to ga (ga and ni or ga and fe) in other cases. further, the above oxide semiconductor may contain fe or ni, another transitional metal element, or an oxide of the transitional metal as an impurity element in addition to the metal element contained as m. in this specification, among the oxide semiconductors whose composition formulas are represented by inmo 3 (zno) m (m>0), an oxide semiconductor whose composition formula includes at least ga as m is referred to as an in—ga—zn—o based oxide semiconductor, and a thin film of the in—ga—zn—o based oxide semiconductor is referred to as an in—ga—zn—o-based non-single-crystal film. as the oxide semiconductor applied to the buffer layer, any of the following oxide semiconductors can be applied besides the above: an in—sn—zn—o based oxide semiconductor; an in—al—zn—o based oxide semiconductor; a sn—ga—zn—o based oxide semiconductor; an al—ga—zn—o based oxide semiconductor; a sn—al—zn—o based oxide semiconductor; an in—zn—o based oxide semiconductor; a sn—zn—o based oxide semiconductor; an al—zn—o based oxide semiconductor; an in—o based oxide semiconductor; a sn—o based oxide semiconductor; and a zn—o based oxide semiconductor. alternatively, a film having a low resistance metal region and a high resistance metal oxide region can be used as the buffer layer. in this case, after formation of the metal film, oxidation treatment is selectively performed on the metal film, whereby a high resistance metal oxide region can be formed in the buffer layer. an embodiment of a structure of the invention disclosed in this specification includes a gate electrode layer over a substrate having an insulating surface, a gate insulating layer over the gate electrode layer, an oxide semiconductor layer including a channel formation region over the gate insulating layer, a buffer layer over the oxide semiconductor layer, and source and drain electrode layers over the buffer layer. in the buffer layer, a first region which is in contact with the source and drain electrode layers has higher electrical conductivity than a second region which in contact with the channel formation region of the oxide semiconductor layer. another embodiment of a structure of the invention disclosed in this specification includes a gate electrode layer over a substrate having an insulating surface, a gate insulating layer over the gate electrode layer, an oxide semiconductor layer including a channel formation region over the gate insulating layer, a buffer layer over the oxide semiconductor layer, and source and drain electrode layers over the buffer layer, in which the buffer layer is an oxide semiconductor layer including titanium, molybdenum, or manganese. in the buffer layer, a first region which is in contact with the source and drain electrode layers has higher electrical conductivity than a second region which is in contact with the channel formation region of the oxide semiconductor layer. in the case of using an oxide semiconductor layer including titanium, molybdenum, or manganese for the buffer layer, a material including a metal with high affinity for oxygen is preferably used in the source and drain electrode layers. it is preferable that the metal with high affinity for oxygen be one or more materials selected from titanium, aluminum, manganese, magnesium, zirconium, beryllium, and thorium. in this case, it is preferable that in the buffer layer, the first region which is in contact with the source and drain electrode layers have the lower proportion of oxygen (lower oxygen concentration) than the second region which is in contact with the channel formation region of the oxide semiconductor layer. another embodiment of a structure of the invention disclosed in this specification includes a gate electrode layer over a substrate having an insulating surface, a gate insulating layer over the gate electrode layer, an oxide semiconductor layer including a channel formation region over the gate insulating layer, a buffer layer over the oxide semiconductor layer, and source and drain electrode layers over the buffer layer. in the buffer layer, a first region which is in contact with the source and drain electrode layers is a metal region, and a second region which is in contact with the channel formation region of the oxide semiconductor layer is a metal oxide region. the metal oxide region has lower electrical conductivity than the channel formation region of the oxide semiconductor layer. another embodiment of a structure of the invention disclosed in this specification includes the following steps: forming a gate electrode layer over a substrate having an insulating surface; forming a gate insulating layer over the gate electrode layer; forming a first oxide semiconductor layer including a channel formation region over the gate insulating layer; forming a second oxide semiconductor layer including titanium, molybdenum, or manganese over the first oxide semiconductor layer; forming source and drain electrode layers over the second oxide semiconductor layer; and performing heat treatment on the second oxide semiconductor layer including titanium, molybdenum, or manganese and the source and drain electrode layers, so that in the second oxide semiconductor layer, a first region which is in contact with the source and drain electrode layers has higher electrical conductivity than a second region which is in contact with the channel region of the first oxide semiconductor layer. by the heat treatment, the concentration of oxygen contained in the first region is made lower than the concentration of oxygen contained in the second region. another embodiment of a structure of the invention disclosed in this specification includes the following steps: forming a gate electrode layer over a substrate having an insulating surface; a gate insulating layer over the gate electrode layer; forming an oxide semiconductor layer including a channel formation region over the gate insulating layer; forming a metal film over the oxide semiconductor layer; forming source and drain electrode layers over a first region of the metal film; and performing oxidation treatment on a second region of the metal film, which is in contact with the channel formation region of the oxide semiconductor layer, so that a metal oxide region is formed. the oxidation treatment is oxygen plasma treatment. an insulating film may be formed so as to cover a thin film transistor which includes the oxide semiconductor layer including the channel formation region, the buffer layer, and the source and drain electrode layers and to be in contact with the oxide semiconductor layer including the channel formation region. since a thin film transistor is easily broken due to static electricity or the like, a protective circuit for protecting a driver circuit is preferably provided over the same substrate for a gate line or a source line. the protective circuit is preferably formed with a non-linear element including an oxide semiconductor. note that the ordinal numbers such as “first” and “second” in this specification are used for convenience and do not denote the order of steps and the stacking order of layers. in addition, the ordinal numbers in this specification do not denote particular names which specify the present invention. moreover, as a display device including a driver circuit, a light-emitting display device in which a light-emitting element is used and a display device in which an electrophoretic display element is used, which is also referred to as an “electronic paper”, are given in addition to a liquid crystal display device. in the light-emitting display device in which a light-emitting element is used, a plurality of thin film transistors are included in a pixel portion, and in the pixel portion, there is a region where a gate electrode of one thin film transistor is connected to a source wiring or a drain wiring of another thin film transistor. in addition, in a driver circuit of the light-emitting display device in which a light-emitting element is used, there is a region where a gate electrode of a thin film transistor is connected to a source wiring or a drain wiring of the thin film transistor. in this specification, a semiconductor device generally means a device which can function by utilizing semiconductor characteristics, and an electrooptic device, a semiconductor circuit, and an electronic device are all semiconductor devices. a thin film transistor having stable electric characteristics can be obtained and a thin film transistor having favorable dynamic characteristics can be manufactured. thus, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. brief description of the drawings figs. 1a and 1b illustrate a semiconductor device. figs. 2a to 2e illustrates a method for manufacturing a semiconductor device. figs. 3a and 3b illustrate a semiconductor device. figs. 4a to 4e illustrate a method for manufacturing a semiconductor device. figs. 5a and 5b illustrate a semiconductor device. figs. 6a to 6e illustrate a method for manufacturing a semiconductor device. figs. 7a and 7b illustrate a semiconductor device. figs. 8a to 8e illustrate a method for manufacturing a semiconductor device. figs. 9a to 9c illustrate a method for manufacturing a semiconductor device. figs. 10a to 10c illustrate a method for manufacturing a semiconductor device. fig. 11 illustrates a method for manufacturing a semiconductor device. fig. 12 illustrates a method for manufacturing a semiconductor device. fig. 13 illustrates a method for manufacturing a semiconductor device. fig. 14 illustrates a semiconductor device. figs. 15 a 1 and a 2 and 15 b 1 and b 2 illustrate a semiconductor device. fig. 16 illustrates a semiconductor device. fig. 17 illustrates a semiconductor device. figs. 18 a 1 and a 2 and 18 b illustrate a semiconductor device. figs. 19a and 19b illustrate a semiconductor device. fig. 20 illustrates a pixel equivalent circuit of a semiconductor device. figs. 21a to 21c illustrate a semiconductor device. fig. 22 illustrates a semiconductor device. figs. 23a and 23b each illustrate an example of a usage pattern of an electronic paper. fig. 24 is an external view of an example of an electronic book reader. fig. 25a is an external view of an example of a television set and fig. 25b is an external view of an example of a digital photo frame. figs. 26a and 26b are external views of examples of an amusement machine. fig. 27a is an external view of an example of a portable computer and fig. 27b is an external view of an example of a mobile phone. fig. 28 shows a structure used for calculation. fig. 29 shows a structure used for calculation. figs. 30a to 30c are graphs showing density of states by calculation. figs. 31a to 31d are graphs showing density of states by calculation. figs. 32a to 32d are graphs showing density of states by calculation. figs. 33a and 33b are graphs showing density of states by calculation. figs. 34a and 34b show a structure before and after calculation. fig. 35 is a graph showing density of atoms before and after calculation. detailed description of the invention embodiments of the present invention are described in detail with reference to the accompanying drawings. however, the present invention is not limited to the description below, and it is easily understood by those skilled in the art that modes and details disclosed herein can be modified in various ways without departing from the spirit and the scope of the present invention. therefore, the present invention is not construed as being limited to description of the embodiments. in the structures to be given below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and repetitive description thereof is omitted. (embodiment 1) a semiconductor device and a manufacturing method thereof will be described with reference to figs. 1a and 1b and figs. 2a to 2e . fig. 1a is a plan view of a thin film transistor 470 of a semiconductor device, and fig. 1b is a cross-sectional view along line c 1 -c 2 of fig. 1a . the thin film transistor 470 is an inverted staggered thin film transistor and includes, over a substrate 400 which is a substrate having an insulating surface, a gate electrode layer 401 , a gate insulating layer 402 , a semiconductor layer 403 , a buffer layer 404 , and source and drain electrode layers 405 a and 405 b . in addition, an insulating film 407 is provided so as to cover the thin film transistor 470 and be in contact with the buffer layer 404 . the buffer layer 404 includes first regions 409 a and 409 b which are low resistance regions and in contact with the source and drain electrode layers 405 a and 405 b , and a second region 408 which is a high resistance region and in contact with a channel formation region of the semiconductor layer 403 . note that in drawings of this specification, shaded regions of the buffer layer 404 and the semiconductor layer 403 indicate the first regions 409 a and 409 b and low resistance regions 435 a and 435 b. a film of the buffer layer 404 has resistance distribution. the second region 408 provided over the channel formation region of the semiconductor layer 403 has lower electrical conductivity than the channel formation region of the semiconductor layer 403 , and the first regions 409 a and 409 b in contact with the source and drain electrode layers 405 a and 405 b have higher electrical conductivity than the channel formation region of the semiconductor layer 403 . in addition, the buffer layer 404 and the semiconductor layer 403 have higher electrical conductivity (i.e., lower resistance) than the gate insulating layer 402 . that is, the descending order of electrical conductivity in respective portions is as follows: electrical conductivity in the low resistance region of the buffer layer 404 (the first regions 409 a and 409 b ); that in the channel formation region of the semiconductor layer 403 ; that in the high resistance region of the buffer layer 404 (the second region 408 ); and that in the gate insulating layer 402 . the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. as a result, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. the buffer layer 404 can be an oxide semiconductor layer including titanium, molybdenum, or manganese. addition of a metal element such as titanium, molybdenum, or manganese to the oxide semiconductor layer makes the semiconductor layer have high resistance. as an example of the buffer layer 404 , an electronic state of a structure where titanium (ti) or molybdenum (mo) was added to an in—ga—zn—o based oxide semiconductor was calculated. a calculation method is described below. both densities of an in—ga—zn—o based oxide semiconductor structure including ti and an in—ga—zn—o based oxide semiconductor including mo were fixed at 5.9 g/cm 3 which was an experimental value of an amorphous in—ga—zn—o based oxide semiconductor. these two structures were calculated under the conditions described below. note that simulation software “materials explorer 5.0” manufactured by fujitsu limited was used for classical molecular dynamics (md) simulation, and software of first principle calculation “castep” manufactured by accelrys software inc. was used for first principle calculation. first, ti or mo was included in an in—ga—zn—o based oxide semiconductor formed by classical molecular dynamics (md) simulation and first principle calculation. next, while the temperature was gradually decreased from 3000 k to 1500 k, and then to 300 k, first principle md calculation was performed under the conditions of: a fixed number of particles (n), a fixed volume (v), and a fixed temperature (t) (ensemble nvt); a time step of 1 fesc; a step number of 2000 step, at each temperature; a cut-off energy of 260 ev, of electrons; and k-point sets of 1×1×1. after that, the structure was optimized by first principle calculation under the conditions of a cut-off energy of 420 ev, of electrons and k-point sets of 2×2×2. figs. 28 and 29 show an in—ga—zn—o based oxide semiconductor structure including ti and an in—ga—zn—o based oxide semiconductor structure including mo, respectively, which were obtained by the calculation. in figs. 28 and 29 , black circles indicate metal atoms and white circles indicate oxygen atoms. large black circles indicate ti or mo. in the in—ga—zn—o based oxide semiconductor structure including ti of fig. 28 , the number of each of in, ga, and zn atoms is 12, the number of o atoms is 50, and the number of ti atoms is one. in the in—ga—zn—o based oxide semiconductor structure including mo of fig. 29 , the number of each of in, ga, and zn atoms is 12, the number of o atoms is 51, and the number of mo atoms is one. the electron density of states in the in—ga—zn—o based oxide semiconductor structure including ti of fig. 28 and the electron density of states in the in—ga—zn—o based oxide semiconductor structure including mo of fig. 29 were calculated by first principle calculation under the conditions of a cut-off energy of 420 ev, of electrons and k-point sets of 3×3×3. fig. 30a shows the density of states in the whole in—ga—zn—o based oxide semiconductor structure, fig. 30b shows the density of states in the whole in—ga—zn—o based oxide semiconductor structure including ti, and fig. 30c shows the density of states in the whole in—ga—zn—o based oxide semiconductor structure including mo. in each of figs. 30a to 30c , an origin on the horizontal axis is fermi energy. each of the structures of figs. 30a to 30c has a band gap, and an upper end of a valence band and a lower end of a conduction band are indicated in each of figs. 30a to 30c . fermi energy is at the upper end of the valence band. fig. 31a shows the partial density of states of in atoms per one atom in the in—ga—zn—o based oxide semiconductor structure including ti, fig. 31b shows the partial density of states of ga atoms per one atom therein, and fig. 31c shows the partial density of states of zn atoms per one atom therein. fig. 32a shows the partial density of states of in atoms per one atom in the in—ga—zn—o based oxide semiconductor structure including mo, fig. 32b shows the partial density of states of ga atoms per one atom therein, and fig. 32c shows the partial density of states of zn atoms per one atom therein. each of these elements has 12 atoms in one system, and each density of states is an average value. from the results of figs. 31a , 31 b, and 31 c and figs. 32a , 32 b, and 32 c, each level in the vicinity of the lower end of the conduction band where n-type carriers enter is mainly formed by the s orbital of in, ga, or zn. fig. 31d shows the partial density of states of ti atoms in the in—ga—zn—o based oxide semiconductor structure including ti, and fig. 32d shows the partial density of states of mo atoms in the in—ga—zn—o based oxide semiconductor structure including mo. from the results of fig. 31d and fig. 32d , the most contributing orbital is not the s orbital but the d orbital. when the concentration of ti or mo is increased, the level at the lower end of the conduction band is formed not by the s orbitals of in, ga, and zn but by the d orbital of ti or mo. the d orbital has a feature of strong anisotropy as compared to the s orbital and has difficulty in conducting n-type carriers in the amorphous structure, and mobility is decreased. consequently, it is found that by adding ti or mo to the in—ga—zn—o based oxide semiconductor, n-type carriers become difficult to flow with increase of the concentration of ti or mo and the electrical conductivity is reduced in a film of the in—ga—zn—o based oxide semiconductor. thus, by adding ti or mo, which is a transition metal element whose d orbital or f orbital is empty, to an oxide semiconductor layer, the electrical conductivity can be reduced; i.e., resistance can be increased. note that the source and drain electrode layers 405 a and 405 b are preferably formed using a material which includes a metal with high oxygen affinity. it is preferable that the metal with high oxygen affinity be one or more materials selected from titanium, aluminum, manganese, magnesium, zirconium, beryllium, and thorium. the source and drain electrode layers 405 a and 405 b in contact with the buffer layer 404 are preferably formed using a metal with high oxygen affinity. as a metal with high oxygen affinity, a metal whose normal electrode potential is smaller than that of zinc can be given, such as titanium, aluminum, manganese, magnesium, zirconium, beryllium, or thorium. alternatively, copper or the like may be used. heat treatment or the like is performed under the condition where the metal with high oxygen affinity and the oxide semiconductor layer are in contact with each other, whereby in the buffer layer 404 which is an oxide semiconductor layer, the proportion of oxygen in the regions which are in contact with the source and drain electrode layers 405 a and 405 b is smaller than that in the other region. the regions with low oxygen concentration become a low resistance region because conductivity tends to increase in such a region. note that the metal with high oxygen affinity is not limited to the above material. the above phenomenon is caused by extraction of oxygen from the oxide semiconductor layer by the metal with high oxygen affinity. thus, in the electrode layer, the proportion of oxygen in the region in contact with the oxide semiconductor layer is considered to be higher than that in the other region; that is, the electrode layer in the region in contact with the oxide semiconductor layer is oxidized. in consideration of this, the metal oxide formed in the region of the electrode layer, which is in contact with the oxide semiconductor layer preferably has a conductive property. for example, in the case of using titanium as a metal with high oxygen affinity, various kinds of treatment may be performed under the condition where an oxide whose composition ratio is close to that of monoxide (for example, in the case of tio x , the range of x is approximately 0.5<x<1.5) is formed. this is because monoxide of titanium has a conductive property but dioxide of titanium has an insulating property. here, an effect of using a metal with high oxygen affinity as an electrode layer is described on the basis of computer simulation. this time, simulation was performed in the case where titanium was used as a metal with high affinity and an in—ga—zn—o based oxide semiconductor material was used for an oxide semiconductor layer; however, an embodiment of the disclosed invention in not limited thereto. note that the composition ratio of the in—ga—zn—o based oxide semiconductor material was set to in:ga:zn:o=1:1:1:4. first, an effect caused by extracting oxygen from an amorphous oxide semiconductor was examined. an amorphous structure of an in—ga—zn—o based oxide semiconductor was prepared by a melt-quench method using classical molecular dynamics (md) simulation. here, the structure where the total number of atoms was 84 and the density was 5.9 g/cm 3 was calculated. born-mayer-huggins potential was used for the interatomic potential between metal and oxygen and between oxygen and oxygen, and lennard-jones potential was used for the interatomic potential between metal and metal. ntv ensemble was used for calculation. materials explorer was used as a calculation program. after that, the structure obtained by the above classical md simulation was optimized by first principle calculation (quantum md calculation) using a plane wave-pseudopotential method based on density functional theory (dft), so that the density of states was calculated. in addition, structure optimization was also performed on a structure in which one of oxygen atoms was removed randomly, and the density of states was calculated. castep was used as a calculation program, and gga-pbe was used as an exchange-correlation functional. figs. 33a and 33b each show the density of states of the structure obtained by the above simulation. fig. 33a shows the density of states of the structure without oxygen vacancy, and fig. 33b shows the density of states of the structure with oxygen vacancy. here, 0 (ev) represents energy corresponding to fermi level. according to figs. 33a and 33b , fermi level exists at the upper end of the valence band in the structure without oxygen vacancy, whereas fermi level exists in the conduction band in the structure with oxygen vacancy. in the structure with oxygen vacancy, since fermi level exists in the conduction band, the number of electrons contributing to conduction is increased, so that a structure having low resistance (i.e., high conductivity) can be obtained. next, movement of oxygen from the amorphous oxide semiconductor to a metal with high oxygen affinity was observed, by using the metal with high oxygen affinity as an electrode layer. here, titanium crystal was stacked over the in—ga—zn—o based amorphous structure obtained by the first principle calculation, and quantum md calculation was performed on the structure by using nvt ensemble. castep was used as a calculation program, and gga-pbe was used as an exchange-correlation functional. the temperature condition was 623 k (350° c.). figs. 34a and 34b show structures before and after quantum md calculation. fig. 34a shows a structure before quantum md calculation, and fig. 34b shows the structure after quantum md calculation. the number of oxygen atoms bonded to titanium atoms is increased in the structure after quantum md calculation as compared to the structure before quantum md calculation. the structure change indicates that oxygen atoms move from the amorphous oxide semiconductor layer to the metal layer with high oxygen affinity. fig. 35 shows the density of titanium and oxygen before and after quantum md calculation. curves represent the density of titanium before quantum md calculation (ti_before), the density of titanium after quantum md calculation (ti_after), the density of oxygen before quantum md calculation (o_before), and the density of oxygen after quantum md calculation (o_after). also from fig. 35 , it is found that oxygen atoms move to the metal with high oxygen affinity. as described above, the oxide semiconductor layer and the metal layer with high oxygen affinity were in contact with each other and heat treatment was performed, whereby movement of oxygen atoms was confirmed from the oxide semiconductor layer to the metal layer and the carrier density in the vicinity of interface was confirmed to be increased. this phenomenon indicates that a low resistance region is formed in the vicinity of the interface, which brings an effect of reduction of contact resistance between the semiconductor layer and the electrode layer. as the semiconductor layer 403 including the channel formation region may be formed using an oxide material having semiconductor characteristics. for example, an oxide semiconductor whose composition formula is represented by inmo 3 (zno) m (m>0) can be used, and an in—ga—zn—o based oxide semiconductor is preferably used. note that m denotes one or more metal elements selected from gallium (ga), iron (fe), nickel (ni), manganese (mn), and cobalt (co). for example, m denotes ga in some cases; meanwhile, m denotes the above metal element such as ni or fe in addition to ga (ga and ni or ga and fe) in other cases. further, the above oxide semiconductor may contain fe or ni, another transitional metal element, or an oxide of the transitional metal as an impurity element in addition to the metal element contained as m. in this specification, among the oxide semiconductors whose composition formulas are represented by inmo 3 (zno) m (m>0), an oxide semiconductor including at least ga as m is referred to as an in—ga—zn—o based oxide semiconductor, and a thin film of the in—ga—zn—o based oxide semiconductor is referred to as an in—ga—zn—o-based non-single-crystal film. as the oxide semiconductor which is applied to the oxide semiconductor layer, any of the following oxide semiconductors can be applied in addition to the above: an in—sn—zn—o based oxide semiconductor; an in—al—zn—o based oxide semiconductor; a sn—ga—zn—o based oxide semiconductor; an al—ga—zn—o based oxide semiconductor; a sn—al—zn—o based oxide semiconductor; an in—zn—o based oxide semiconductor; a sn—zn—o based oxide semiconductor; an al—zn—o based oxide semiconductor; an in—o based oxide semiconductor; a sn—o based oxide semiconductor; and a zn—o based oxide semiconductor. figs. 2a to 2e are cross-sectional views illustrating manufacturing steps of the thin film transistor 470 . in fig. 2a , the gate electrode layer 401 is provided over the substrate 400 which is a substrate having an insulating surface. an insulating film serving as a base film may be provided between the substrate 400 and the gate electrode layer 401 . the base film has a function of preventing diffusion of an impurity element from the substrate 400 , and can be formed to have a single-layer or stacked-layer structure using one or more of a silicon nitride film, a silicon oxide film, a silicon nitride oxide film, and a silicon oxynitride film. the gate electrode layer 401 can be formed to have a single-layer or stacked-layer structure using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium, or an alloy material which contains any of these materials as its main component. for example, as a two-layer structure of the gate electrode layer 401 , the following structures are preferable: a two-layer structure of an aluminum layer and a molybdenum layer stacked thereover, a two-layer structure of a copper layer and a molybdenum layer stacked thereover, a two-layer structure of a copper layer and a titanium nitride layer or a tantalum nitride layer stacked thereover, and a two-layer structure of a titanium nitride layer and a molybdenum layer. as a three-layer structure, a stack of a tungsten layer or a tungsten nitride layer, a layer of an alloy of aluminum and silicon or an alloy of aluminum and titanium, and a titanium nitride layer or a titanium layer is preferable. the gate insulating layer 402 is formed over the gate electrode layer 401 . the gate insulating layer 402 can be formed using a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, or a silicon nitride oxide layer to have a single-layer or stacked-layer structure by a plasma cvd method, a sputtering method, or the like. alternatively, the gate insulating layer 402 can be formed using a silicon oxide layer by a cvd method with use of an organosilane gas. as an organosilane gas, a silicon-containing compound such as tetraethoxysilane (teos) (chemical formula: si(oc 2 h 5 ) 4 ), tetramethylsilane (tms) (chemical formula: si(ch 3 ) 4 ), tetramethylcyclotetrasiloxane (tmcts), octamethylcyclotetrasiloxane (omcts), hexamethyldisilazane (hmds), triethoxysilane (chemical formula: sih(oc 2 h 5 ) 3 ), or trisdimethylaminosilane (chemical formula: sih(n(ch 3 ) 2 ) 3 ) can be used. over the gate insulating layer 402 , a first oxide semiconductor film 433 and a second oxide semiconductor film 434 are stacked in this order (see fig. 2a ). note that before the first oxide semiconductor film 433 is formed by a sputtering method, dust on a surface of the gate insulating layer 402 is preferably removed by reverse sputtering in which an argon gas is introduced and plasma is generated. the reverse sputtering refers to a method in which, without application of a voltage to a target side, an rf power source is used for application of a voltage to a substrate side in an argon atmosphere to modify a surface. note that instead of an argon atmosphere, a nitrogen atmosphere, a helium atmosphere, or the like may be used. alternatively, an argon atmosphere to which oxygen, n 2 o, or the like is added may be used. further alternatively, an argon atmosphere to which cl 2 , cf 4 , or the like is added may be used. an in—ga—zn—o based non-single-crystal film is used as the first oxide semiconductor film 433 . the first oxide semiconductor film 433 is formed by a sputtering method with use of an in—ga—zn—o based oxide semiconductor target. as the second oxide semiconductor film 434 , an in—ga—zn—o based non-single-crystal film including titanium is used. the second oxide semiconductor film 434 is formed by a sputtering method with use of an in—ga—zn—o based oxide semiconductor target including titanium oxide. the gate insulating layer 402 , the first oxide semiconductor film 433 , and the second oxide semiconductor film 434 may be formed successively without being exposed to the air. successive film formation without being exposed to air makes it possible to obtain each interface of stacked layers, which are not contaminated by atmospheric components or impurity elements floating in air. therefore, variation in characteristics of the thin film transistor can be reduced. the first oxide semiconductor film 433 and the second oxide semiconductor film 434 are processed into the island-shaped semiconductor layer 403 which is an oxide semiconductor layer and an island-shaped oxide semiconductor layer 431 by a photolithography step. a conductive film 432 is formed over the gate insulating layer 402 , the semiconductor layer 403 , and the oxide semiconductor layer 431 (see fig. 2b ). as a material of the conductive film 432 , a film of titanium which is a metal with high oxygen affinity is used. in addition, an element selected from al, cr, ta, mo, and w, an alloy including any of the above elements, an alloy film including these elements in combination, and the like may be stacked over the titanium film. the oxide semiconductor layer 431 and the conductive film 432 are etched in an etching step, so that the buffer layer 404 and the source and drain electrode layers 405 a and 405 b are formed (see fig. 2c ). note that the buffer layer 404 is partly etched, whereby the buffer layer 404 has a groove (a depressed portion). next, heat treatment is performed on the buffer layer 404 which is an oxide semiconductor layer and the source and drain electrode layers 405 a and 405 b . by heat treatment, oxygen atoms move from the oxide semiconductor layer to a metal layer, whereby resistance of the first regions 409 a and 409 b which are in contact with the source and drain electrode layers 405 a and 405 b is reduced. in contrast, the second region 408 which is in contact with the channel formation region of the semiconductor layer 403 keeps resistance high. thus, the first regions 409 a and 409 b which are low resistance regions and the second region 408 which is a high resistance region are formed in the buffer layer 404 (see fig. 2d ). moreover, by this heat treatment, also in the semiconductor layer 403 , oxygen atoms in regions which are in contact with the source and drain electrode layers 405 a and 405 b move from the oxide semiconductor layer to the metal layer, so that the low resistance regions 435 a and 435 b are formed. heat treatment is preferably performed at 200° c. to 600° c., typically 300° c. to 500° c. for example, heat treatment is performed at 350° c. for an hour under a nitrogen atmosphere. through the above steps, the inverted staggered thin film transistor 470 illustrated in fig. 2e can be completed. in addition, the insulating film 407 is formed so as to cover the thin film transistor 470 and be in contact with the buffer layer 404 . the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. therefore, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. (embodiment 2) in embodiment 2, an example of a semiconductor device including a thin film transistor will be described with reference to figs. 3a and 3b and figs. 4a to 4e . in the thin film transistor of this embodiment, the oxide semiconductor layer including a channel formation region and the buffer layer described in embodiment 1 are separately processed in different etching steps from each other. note that except for formation of the oxide semiconductor layer and the buffer layer, the thin film transistor can be formed in a manner similar to embodiment 1; thus, repetitive description of the same components or components having similar functions as in embodiment 1 and manufacturing steps of forming those components will be omitted. fig. 3a is a plan view of a thin film transistor 471 included in a semiconductor device, and fig. 3b is a cross-sectional view along line c 3 -c 4 of fig. 3a . the thin film transistor 471 is an inverted staggered thin film transistor and includes, over a substrate 400 which is a substrate having an insulating surface, a gate electrode layer 401 , a gate insulating layer 402 , a semiconductor layer 403 , a buffer layer 404 , and source and drain electrode layers 405 a and 405 b . in addition, an insulating film 407 is provided so as to cover the thin film transistor 471 and be in contact with the buffer layer 404 . the buffer layer 404 includes first regions 409 a and 409 b which are low resistance regions and in contact with the source and drain electrode layers 405 a and 405 b , and a second region 408 which is a high resistance region and in contact with a channel formation region of the semiconductor layer 403 . in the thin film transistor 471 , the buffer layer 404 is formed to cover end portions of the semiconductor layer 403 and extend below the source and drain electrode layers 405 a and 405 b. figs. 4a to 4e are cross-sectional views illustrating manufacturing steps of the thin film transistor 471 . the gate electrode layer 401 is over the substrate 400 which is a substrate having an insulating surface. the gate insulating layer 402 is formed over the gate electrode layer 401 . over the gate insulating layer 402 , an oxide semiconductor film is formed and then etched to have an island shape, so that the semiconductor layer 403 is formed (see fig. 4a ). an oxide semiconductor film 436 is formed so as to cover the island-shaped oxide semiconductor layer 403 , and a conductive film 432 is stacked over the oxide semiconductor film 436 (see fig. 4b ). the oxide semiconductor film 436 is the same film as the second oxide semiconductor film 434 in embodiment 1, which is an in—ga—zn—o based non-single-crystal film including titanium. the oxide semiconductor film 436 is formed by a sputtering method with use of an in—ga—zn—o target including titanium oxide. as a material of the conductive film 432 , a film of titanium which is a metal with high oxygen affinity is used. the oxide semiconductor film 436 and the conductive film 432 are etched in an etching step, so that the buffer layer 404 and the source and drain electrode layers 405 a and 405 b are formed (see fig. 4c ). note that the buffer layer 404 is partly etched, whereby the buffer layer 404 has a groove (a depressed portion). next, heat treatment is performed on the buffer layer 404 which is an oxide semiconductor layer and the source and drain electrode layers 405 a and 405 b . by heat treatment, oxygen atoms move from the oxide semiconductor layer to the metal layer, whereby resistance of the first regions 409 a and 409 b which are in contact with the source and drain electrode layers 405 a and 405 b is reduced. in contrast, the second region 408 which is in contact with the channel formation region of the semiconductor layer 403 keeps resistance high. thus, the first regions 409 a and 409 b which are low resistance regions and the second region 408 which is a high resistance region are formed in the buffer layer 404 (see fig. 4d ). heat treatment is preferably performed at 200° c. to 600° c., typically 300° c. to 500° c. for example, heat treatment is performed at 350° c. for an hour under a nitrogen atmosphere. through the above steps, the inverted staggered thin film transistor 471 illustrated in fig. 4e can be completed. in addition, the insulating film 407 is formed so as to cover the thin film transistor 471 and be in contact with the buffer layer 404 . in such a manner, the order of etching steps in the manufacturing process of the thin film transistor is changed, whereby a variety of thin film transistors having different shapes can be manufactured. the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. therefore, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. (embodiment 3) another example of a semiconductor device and a manufacturing method thereof will be described with reference to figs. 5a and 5b and figs. 6a to 6e . in this embodiment, an example in which a material of the buffer layer and a manufacturing method thereof are different from those of embodiments 1 and 2 is described. note that except for the buffer layer, a thin film transistor of this embodiment can be formed in a manner similar to embodiments 1 and 2, and repetitive description of the same portions as or portions having functions similar to those in embodiments 1 and 2 and manufacturing steps will be omitted. fig. 5a is a plan view of a thin film transistor 460 included in a semiconductor device, and fig. 5b is a cross-sectional view along line d 1 -d 2 of fig. 5a . the thin film transistor 460 is an inverted staggered thin film transistor and includes, over a substrate 450 which is a substrate having an insulating surface, a gate electrode layer 451 , a gate insulating layer 452 , a semiconductor layer 453 , a buffer layer 454 , and source and drain electrode layers 455 a and 455 b . in addition, an insulating film 457 is provided so as to cover the thin film transistor 460 and be in contact with the buffer layer 454 . the buffer layer 454 includes first regions 459 a and 459 b which are low resistance regions and in contact with the source and drain electrode layers 455 a and 455 b and a second region 458 which is a high resistance region and in contact with a channel formation region of the semiconductor layer 453 . a film of the buffer layer 454 has resistance distribution. the second region 458 provided over the channel formation region of the semiconductor layer 453 has lower electrical conductivity than the channel formation region of the semiconductor layer 453 . the first regions 459 a and 459 b in contact with the source and drain electrode layers 455 a and 455 b have higher electrical conductivity than the channel formation region of the semiconductor layer 453 . the buffer layer 454 and the semiconductor layer 453 have higher electrical conductivity (i.e., lower resistance) than the gate insulating layer 452 . thus, the descending order of electrical conductivity in respective portions is as follows: electrical conductivity in the low resistance regions of the buffer layer 454 (the first regions 459 a and 459 b ), that in the channel formation region of the semiconductor layer 453 , that in the high resistance region of the buffer layer 454 (the second region 458 ), and that in the gate insulating layer 452 . in the buffer layer 454 , the first regions 459 a and 459 b having low resistance are formed as metal regions and the second region 458 having high resistance is formed as a metal oxide region. such a buffer layer 454 can be formed as follows: a metal film is formed; and oxidation treatment is selectively performed on the metal film. figs. 6a to 6e are cross-sectional views illustrating manufacturing steps of the thin film transistor 460 . the gate electrode layer 451 is formed over the substrate 450 , and the gate insulating layer 452 is formed over the gate electrode layer 451 . over the gate insulating layer 452 , an oxide semiconductor film 463 is formed, and a metal film 464 is stacked over the oxide semiconductor film 463 (see fig. 6a ). as the oxide semiconductor film 463 , an in—ga—zn—o based non-single-crystal film is used. the oxide semiconductor film 463 is formed by a sputtering method with use of an in—ga—zn—o based oxide semiconductor target. the metal film 464 may be formed using a material which can be subjected to oxidation treatment selectively in a formation process of the high resistance region, and tantalum (ta) or aluminum (al) can be used. as the metal film 464 , a tantalum film is formed. the oxide semiconductor film 463 and the metal film 464 are processed into a semiconductor layer 453 which is an island-shaped oxide semiconductor layer and an island-shaped buffer layer 454 by a photolithography step. a conductive film 462 is formed over the gate insulating layer 452 , the semiconductor layer 453 , and the buffer layer 454 (see fig. 6b ). the conductive film 462 is etched in an etching step, so that the source and drain electrode layers 455 a and 455 b are formed (see fig. 6c ). next, oxidation treatment is performed selectively on the buffer layer 454 . modification treatment by plasma treatment or chemical treatment may be performed as oxidation treatment. the region in the buffer layer 454 , which is not covered with the source and drain electrode layers 455 a and 455 b , is subjected to oxygen plasma treatment as oxidation treatment, so that a high resistance metal oxide region is formed. this metal oxide region is the second region 458 in the buffer layer 454 , which is in contact with the channel formation region of the semiconductor layer 453 . on the other hand, since the first regions 459 a and 459 b which are in contact with the source and drain electrode layers 455 a and 455 b are not subjected to oxidation treatment, the first regions 459 a and 459 b keep the metal region having low resistance. accordingly, in the buffer layer 454 , the first regions 459 a and 459 b which are low resistance regions and the second region 458 which is a high resistance region are formed (see fig. 6d ). after that, heat treatment is preferably performed at 200° c. to 600° c., typically 300° c. to 500° c. for example, heat treatment is performed at 350° c. for an hour under a nitrogen atmosphere. by this heat treatment, rearrangement at an atomic level of the in—ga—zn—o based oxide semiconductor included in the semiconductor layer 453 is performed. this heat treatment (including optical annealing) can release strain energy which inhibits carrier movement in the semiconductor layer 453 . note that there is no particularly limitation on the timing of the above heat treatment as long as it is after the formation of the oxide semiconductor film 463 . moreover, a film of titanium which is a metal with high oxygen affinity is used for the source and drain electrode layers 455 a and 455 b . thus, by this heat treatment, oxygen atoms in the regions of the semiconductor layer 453 , which are in contact with the source and drain electrode layers 455 a and 455 b , move from the oxide semiconductor layer to the metal layer as in embodiments 1 and 2. accordingly, the low resistance regions 465 a and 465 b are formed. through the above steps, as illustrated in fig. 6e , the inverted staggered thin film transistor 460 in which the semiconductor layer 453 includes a channel formation region can be completed. in addition, the insulating film 457 is formed so as to cover the thin film transistor 460 and be in contact with the buffer layer 454 . the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. therefore, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. (embodiment 4) in embodiment 4, an example of a semiconductor device including a thin film transistor will be described with reference to figs. 7a and 7b and figs. 8a to 8e . in the thin film transistor of this embodiment, the oxide semiconductor layer including a channel formation region and the buffer layer described in embodiment 3 are processed in different etching steps from each other. note that except for formation of the oxide semiconductor layer and the buffer layer, the thin film transistor can be formed in a manner similar to embodiment 3, and repetitive description of the same portions as or portions having functions similar to those in embodiment 3 and manufacturing steps will be omitted. fig. 7a is a plan view of a thin film transistor 480 included in a semiconductor device, and fig. 7b is a cross-sectional view along line d 3 -d 4 of fig. 7a . the thin film transistor 480 is an inverted staggered thin film transistor and includes, over a substrate 450 which is a substrate having an insulating surface, a gate electrode layer 451 , a gate insulating layer 452 , a semiconductor layer 453 , a buffer layer 454 , and source and drain electrode layers 455 a and 455 b . in addition, an insulating film 457 is provided so as to cover the thin film transistor 480 and be in contact with the buffer layer 454 . the buffer layer 454 includes first regions 459 a and 459 b which are low resistance regions and in contact with the source and drain electrode layers 455 a and 455 b and a second region 458 which is a high resistance region and in contact with a channel formation region of the semiconductor layer 453 . the buffer layer 454 is formed so as to selectively cover the channel formation region of the semiconductor layer 453 and its vicinity. in the semiconductor layer 453 , exposed regions which are not covered with the buffer layer 454 are in direct contact with the source and drain electrode layers 455 a and 455 b . the regions which are in contact with the source and drain electrode layers 455 a and 455 b are low resistance regions 465 a and 465 b. in the buffer layer 454 , the first regions 459 a and 459 b having low resistance are formed as metal regions, and the second region 458 having high resistance is formed as a metal oxide region. such a buffer layer 454 can be formed as follows: a metal film is formed; and oxidation treatment is selectively performed on the metal film. figs. 8a to 8e are cross-sectional views illustrating manufacturing steps of the thin film transistor 480 . the gate electrode layer 451 is formed over the substrate 450 , and the gate insulating layer 452 is formed over the gate electrode layer 451 . an oxide semiconductor film is formed over the gate insulating layer 452 and processed to have an island shape by a photolithography step, so that the semiconductor layer 453 is formed. a metal film 464 is formed using a tantalum film over the semiconductor layer 453 (see fig. 8a ). a tantalum film is formed as the metal film 464 . the metal film 464 is processed by a photolithography step, so that the buffer layer 454 covering the semiconductor layer 453 selectively is formed. the buffer layer 454 is selectively formed so as to cover the channel formation region of the semiconductor layer 453 and its vicinity. a conductive film 462 is formed over the gate insulating layer 452 , the semiconductor layer 453 , and the buffer layer 454 (see fig. 8b ). the conductive film 462 is etched in an etching step, so that the source and drain electrode layers 455 a and 455 b are formed (see fig. 8c ). next, insulating treatment is selectively performed on the buffer layer 454 . the region of the buffer layer 454 , which is not covered with the source and drain electrode layers 455 a and 455 b , is subjected to oxygen plasma treatment as oxidation treatment, so that a high resistance metal oxide region is formed. in the buffer layer 454 , this metal oxide region is the second region 458 which is in contact with the channel formation region of the semiconductor layer 453 . on the other hand, since the first regions 459 a and 459 b which are in contact with the source and drain electrode layers 455 a and 455 b are not subjected to oxidation treatment, the first regions 459 a and 459 b keep the metal region having low resistance. accordingly, in the buffer layer 454 , the first regions 459 a and 459 b which are low resistance regions and the second region 458 which is a high resistance region are formed (see fig. 8d ). after that, heat treatment is preferably performed at 200° c. to 600° c., typically 300° c. to 500° c. for example, heat treatment is performed at 350° c. for an hour under a nitrogen atmosphere. moreover, a film of titanium which is a metal with high oxygen affinity is used for the source and drain electrode layers 455 a and 455 b . thus, by this heat treatment, oxygen atoms in the regions of the semiconductor layer 453 , which are in contact with the source and drain electrode layers 455 a and 455 b , move from the oxide semiconductor layer to the metal layer as in embodiments 1 and 2. accordingly, the low resistance regions 465 a and 465 b are formed. through the above steps, as illustrated in fig. 8e , the inverted staggered thin film transistor 480 in which the semiconductor layer 453 includes a channel formation region can be completed. in addition, the insulating film 457 is formed so as to cover the thin film transistor 480 and be in contact with the buffer layer 454 . in such a manner, the order of etching steps in the manufacturing process of the thin film transistor is changed, whereby a variety of thin film transistors having different shapes can be manufactured. the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. therefore, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. (embodiment 5) manufacturing steps of a semiconductor device including a thin film transistor will be described with reference to figs. 9a to 9c , figs. 10a to 10c , fig. 11 , fig. 12 , fig. 13 , fig. 14 , figs. 15 a 1 and a 2 and 15 b 1 and b 2 , and fig. 16 . in fig. 9a , a glass substrate of barium borosilicate glass, aluminoborosilicate glass, or the like can be used as a substrate 100 having a light-transmitting property. next, a conductive layer is formed entirely over a surface of the substrate 100 , and then a first photolithography step is performed. a resist mask is formed, and an unnecessary portion is removed by etching, so that wirings and electrodes (a gate wiring including a gate electrode layer 101 , a capacitor wiring 108 , and a first terminal 121 ) are formed. at this time, the etching is performed so that at least end portions of the gate electrode layer 101 have a tapered shape. a cross-sectional view at this stage is illustrated in fig. 9a . a plan view at this stage is illustrated in fig. 11 . each of the gate wiring including the gate electrode layer 101 , the capacitor wiring 108 , and the first terminal 121 at a terminal portion is preferably formed using a heat-resistant conductive material such as an element selected from titanium (ti), tantalum (ta), tungsten (w), molybdenum (mo), chromium (cr), neodymium (nd), and scandium (sc); an alloy containing any of these elements as its component; an alloy film containing a combination of any of these elements; or a nitride containing any of these elements as its component. in the case of using a low-resistant conductive material such as aluminum (al) or copper (cu), the low-resistant conductive material is used in combination with the above heat-resistant conductive material because al alone has problems of low heat resistance, being easily corroded, and the like. next, a gate insulating layer 102 is formed throughout the surface over the gate electrode layer 101 . the gate insulating layer 102 is formed to a thickness of 50 to 250 nm by a sputtering method or the like. for example, as the gate insulating layer 102 , a silicon oxide film is formed to a thickness of 100 nm by a sputtering method. needless to say, the gate insulating layer 102 is not limited to such a silicon oxide film and may be a single layer or a stack of layers including another insulating film, such as a silicon oxynitride film, a silicon nitride film, an aluminum oxide film, or a tantalum oxide film. next, a first oxide semiconductor film 133 (a first in—ga—zn—o based non-single-crystal film) is formed over the gate insulating layer 102 . formation of the first in—ga—zn—o based non-single-crystal film without exposure to air after plasma treatment is effective in preventing powder substances (also called particles or dust) from attaching to the interface between the gate insulating layer and the semiconductor film. here, the first in—ga—zn—o based non-single-crystal film is formed in an argon or oxygen atmosphere with use of an oxide semiconductor target having a diameter of 8 inches and containing in, ga, and zn (the composition ratio is set to in 2 o 3 : ga 2 o 3 : zno=1:1:1), with the distance between the substrate and the target set to 170 mm, under a pressure of 0.4 pa, and with a direct-current (dc) power source of 0.5 kw. note that a pulse direct current (dc) power source is preferable because dust can be reduced and the film thickness can be uniform. the first in—ga—zn—o based non-single-crystal film has a thickness of 5 nm to 200 nm. here, the thickness of the first in—ga—zn—o based non-single-crystal film is 100 nm. next, a second oxide semiconductor film 134 including titanium (an in—ga—zn—o based non-single-crystal film including titanium) is formed by a sputtering method without exposure to air (see fig. 9b ). the second oxide semiconductor film 134 is formed by a sputtering method with use of an in—ga—zn—o based oxide semiconductor target including titanium. examples of a sputtering method include an rf sputtering method in which a high-frequency power source is used as a sputtering power source, a dc sputtering method, and a pulsed dc sputtering method in which a bias is applied in a pulsed manner. an rf sputtering method is mainly used in the case where an insulating film is formed, and a dc sputtering method is mainly used in the case where a metal film is formed. in addition, there is also a multi-source sputtering apparatus in which a plurality of targets of different materials can be set. with the multi-source sputtering apparatus, films of different materials can be formed to be stacked in the same chamber, or a film of plural kinds of materials can be formed by electric discharge at the same time in the same chamber. moreover, there are a sputtering apparatus provided with a magnet system inside the chamber and used for a magnetron sputtering, and a sputtering apparatus used for an ecr sputtering in which plasma generated with use of microwaves is used without using glow discharge. furthermore, as a deposition method by sputtering, there are also a reactive sputtering method in which a target substance and a sputtering gas component are chemically reacted with each other during deposition to form a thin compound film thereof, and a bias sputtering in which a voltage is also applied to a substrate during deposition. next, a second photolithography step is performed. a resist mask is formed, and the first oxide semiconductor film 133 and the second oxide semiconductor film 134 are etched. for example, unnecessary portions are removed by wet etching using a mixed solution of phosphoric acid, acetic acid, and nitric acid, so that a semiconductor layer 103 and an oxide semiconductor layer 111 are formed. note that etching here is not limited to wet etching but dry etching may also be performed. note that a plan view at this stage corresponds to fig. 12 . as the etching gas for dry etching, a gas containing chlorine (chlorine-based gas such as chlorine (cl 2 ), boron chloride (bcl 3 ), silicon chloride (sicl 4 ), or carbon tetrachloride (ccl 4 )) is preferably used. alternatively, a gas containing fluorine (fluorine-based gas such as carbon tetrafluoride (cf 4 ), sulfur fluoride (sf 6 ), nitrogen fluoride (nf), or trifluoromethane (chf 3 )); hydrogen bromide (hbr); oxygen (o 2 ); any of these gases to which a rare gas such as helium (he) or argon (ar) is added; or the like can be used. as the dry etching method, a parallel plate rie (reactive ion etching) method or an icp (inductively coupled plasma) etching method can be used. in order to etch the films into desired shapes, the etching condition (the amount of electric power applied to a coil-shaped electrode, the amount of electric power applied to an electrode on a substrate side, the temperature of the electrode on the substrate side, or the like) is adjusted as appropriate. as an etchant used for wet etching, a solution obtained by mixing phosphoric acid, acetic acid, and nitric acid, an ammonia peroxide mixture (hydrogen peroxide:ammonia:water=5:2:2), or the like can be used. in addition, ito07n (produced by kanto chemical co., inc.) may also be used. the etchant used in the wet etching is removed by cleaning together with the material which is etched off. the waste liquid including the etchant and the material etched off may be purified and the material may be reused. when a material such as indium included in the oxide semiconductor layer is collected from the waste liquid after the etching and reused, the resources can be efficiently used and the cost can be reduced. the etching conditions (such as an etchant, etching time, and temperature) are appropriately adjusted depending on the material so that the material can be etched into a desired shape. next, a third photolithography step is performed. a resist mask is formed, and unnecessary portions are removed by etching, whereby a contact hole that reaches the electrode layer or the wiring which is formed from the same material as the gate electrode layer 101 is formed. the contact hole is provided for direct connection with a conductive film to be formed later. for example, a contact hole is formed when a thin film transistor in which a gate electrode layer is in direct contact with a source or drain electrode layer in a driver circuit portion is formed, or when a terminal that is electrically connected to a gate wiring of a terminal portion is formed. then, a conductive film 132 made of a metal material is formed over the semiconductor layer 103 and the oxide semiconductor layer 111 by a sputtering method or a vacuum evaporation method (see fig. 9c ). as a material of the conductive film 132 , a film of titanium which is a metal with high oxygen affinity is used. in addition, an element selected from al, cr, ta, mo, and w, an alloy including any of the above elements, an alloy film including these elements in combination, and the like may be stacked over the titanium film. next, a fourth photolithography step is performed. a resist mask 131 is formed, and unnecessary portions are removed by etching, whereby source and drain electrode layers 105 a and 105 b , a buffer layer 104 , and a second terminal 122 are formed (see fig. 10a ). wet etching or dry etching is employed as an etching method at this time. for example, when an aluminum film or an aluminum-alloy film is used as the conductive film 132 , wet etching using a mixed solution of phosphoric acid, acetic acid, and nitric acid can be carried out. here, by wet etching using an ammonia hydrogen peroxide mixture (with the ratio of hydrogen peroxide:ammonia:water=5:2:2), the conductive film 132 of a ti film is etched to form the source and drain electrode layers 105 a and 105 b . in this etching, an exposed region of the oxide semiconductor layer 111 is partly etched, whereby the buffer layer 104 is formed. thus, a region (second region 112 ) of the buffer layer 104 has a small thickness, which is between the source and drain electrode layers 105 a and 105 b and over a channel formation region of the semiconductor layer 103 . in fig. 10a , etching for forming the source and drain electrode layers 105 a and 105 b and the buffer layer 104 is performed at a time by using an etchant of an ammonia hydrogen peroxide mixture. accordingly, an end portion of the source or drain electrode layer 105 a and an end portion of the source or drain electrode layer 105 b are aligned with end portions of the buffer layer 104 ; thus, continuous structures are formed. in addition, wet etching allows the layers to be etched isotropically, so that the end portions of the source and drain electrode layers 105 a and 105 b are recessed from the resist mask 131 . then, the resist mask 131 is removed, and heat treatment is performed on the buffer layer 104 which is an oxide semiconductor layer and the source and drain electrode layers 105 a and 105 b . by heat treatment, oxygen atoms move from the oxide semiconductor layer to the metal layer; thus, resistance of first regions 109 a and 109 b which are in contact with the source and drain electrode layers 105 a and 105 b is reduced. in contrast, the second region 112 which is in contact with the channel formation region of the semiconductor layer 103 keeps resistance high. as a result, in the buffer layer 104 , the first regions 109 a and 109 b which are low resistance regions and the second region 112 which is a high resistance region are formed (see fig. 10b ). moreover, by this heat treatment, also in the semiconductor layer 103 , oxygen atoms in regions which are in contact with the source and drain electrode layers 105 a and 105 b move from the oxide semiconductor layer to the metal layer similarly. thus, low resistance regions are formed in the above regions. heat treatment is preferably performed at 200° c. to 600° c., typically 300° c. to 500° c. for example, heat treatment is performed at 350° c. for an hour under a nitrogen atmosphere. through the above steps, a thin film transistor 170 can be completed. fig. 13 is a plan view of at this stage. in the fourth photolithography step, the second terminal 122 made from the same material as the source and drain electrode layers 105 a and 105 b is also left in the terminal portion. note that the second terminal 122 is electrically connected to a source wiring (a source wiring including the source or drain electrode layer 105 a or 105 b ). further, by use of a resist mask having regions with plural thicknesses (typically, two different thicknesses) which is formed using a multi-tone mask, the number of resist masks can be reduced, resulting in simplified process and lower costs. next, a protective insulating layer 107 is formed so as to cover the thin film transistor 170 . for the protective insulating layer 107 , a silicon nitride film, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, a tantalum oxide film, or the like which is obtained by a sputtering method or the like can be used. next, a fifth photolithography step is performed. a resist mask is formed, and the protective insulating layer 107 is etched, so that a contact hole 125 reaching the source or drain electrode layer 105 b is formed. in addition, a contact hole 127 reaching the second terminal 122 and a contact hole 126 reaching the first terminal 121 are also formed in the same etching step. a cross-sectional view at this stage is illustrated in fig. 10b . then, after the resist mask is removed, a transparent conductive film is formed. the transparent conductive film is formed using indium oxide (in 2 o 3 ), indium oxide-tin oxide alloy (in 2 o 3 —sno 2 , abbreviated to ito), or the like by a sputtering method, a vacuum evaporation method, or the like. such a material is etched with a hydrochloric acid-based solution. however, since a residue is easily generated in etching ito particularly, indium oxide-zinc oxide alloy (in 2 o 3 —zno) may be used to improve etching processability. next, a sixth photolithography step is performed. a resist mask is formed, and an unnecessary portion of the transparent conductive film is removed by etching, so that a pixel electrode layer 110 is formed. through this sixth photolithography step, a storage capacitor is formed by the capacitor wiring 108 and the pixel electrode layer 110 , in which the gate insulating layer 102 and the protective insulating layer 107 in the capacitor portion are used as a dielectric. in addition, in this sixth photolithography step, the first terminal 121 and the second terminal 122 are covered with the resist mask, and transparent conductive films 128 and 129 are left in the terminal portion. the transparent conductive films 128 and 129 function as electrodes or wirings connected to an fpc. the transparent conductive film 128 formed over the first terminal 121 is a connecting terminal electrode which functions as an input terminal of a gate wiring. the transparent conductive film 129 formed over the second terminal 122 is a connection terminal electrode which functions as an input terminal of the source wiring. then, the resist mask is removed. a cross-sectional view at this stage is illustrated in fig. 10c . note that fig. 14 is a plan view at this stage. figs. 15 a 1 and 15 a 2 are respectively a cross-sectional view and a plan view of a gate wiring terminal portion at this stage. fig. 15 a 1 is a cross-sectional view along line e 1 -e 2 of fig. 15 a 2 . in fig. 15 a 1 , a transparent conductive film 155 formed over a protective insulating film 154 is a connection terminal electrode functioning as an input terminal. furthermore, in the terminal portion of fig. 15 a 1 , a first terminal 151 made of the same material as the gate wiring and a connection electrode layer 153 made of the same material as the source wiring overlap each other with a gate insulating layer 152 interposed therebetween, and are electrically connected to each other through the transparent conductive film 155 . note that a part of fig. 10c , where the transparent conductive film 128 is in contact with the first terminal 121 , corresponds to a part of fig. 15 a 1 where the transparent conductive film 155 is in contact with the first terminal 151 . figs. 15 b 1 and 15 b 2 are respectively a cross-sectional view and a plan view of a source wiring terminal portion which is different from that illustrated in fig. 10c . fig. 15 b 1 is a cross-sectional view along line f 1 -f 2 of fig. 15 b 2 . in fig. 15 b 1 , the transparent conductive film 155 formed over the protective insulating film 154 is a connection terminal electrode functioning as an input terminal. furthermore, in the terminal portion of fig. 15 b 1 , an electrode layer 156 made of the same material as the gate wiring is disposed below the second terminal 150 electrically connected to the source wiring, with the gate insulating layer 152 interposed between the second terminal 150 and the electrode layer 156 . the electrode layer 156 is not electrically connected to the second terminal 150 , and a capacitor for preventing noise or static electricity can be formed if the potential of the electrode layer 156 is set to a potential different from that of the second terminal 150 , such as floating, gnd, or 0 v. the second terminal 150 is electrically connected to the transparent conductive film 155 with the protective insulating film 154 therebetween. a plurality of gate wirings, source wirings, and capacitor wirings are provided depending on the pixel density. also in the terminal portion, a plurality of terminals including the first terminal at the same potential as the gate wiring, the second terminal at the same potential as the source wiring, a third terminal at the same potential as the capacitor wiring, and the like are each arranged. the number of each of the terminals may be any number, and the number of the terminals may be determined by a practitioner as appropriate. through these six photolithography steps, using six photomasks, a pixel thin film transistor portion including the thin film transistor 170 that is a bottom-gate n-channel thin film transistor, and a storage capacitor can be completed. by disposing the thin film transistor and the storage capacitor in each pixel of a pixel portion in which pixels are arranged in a matrix form, one of substrates for manufacturing an active matrix display device can be obtained. in this specification, such a substrate is referred to as an active matrix substrate for convenience. in the case of manufacturing an active matrix liquid crystal display device, an active matrix substrate and a counter substrate provided with a counter electrode are bonded to each other with a liquid crystal layer interposed therebetween. note that a common electrode electrically connected to the counter electrode on the counter substrate is provided over the active matrix substrate, and a fourth terminal electrically connected to the common electrode is provided in the terminal portion. the fourth terminal is provided so that the common electrode is set to a fixed potential such as gnd or 0 v. an embodiment of the present invention is not limited to the pixel structure of fig. 14 , and an example of the plan view different from fig. 14 is illustrated in fig. 16 . fig. 16 illustrates an example in which a capacitor wiring is not provided but a pixel electrode overlaps with a gate wiring of an adjacent pixel, with a protective insulating film and a gate insulating layer therebetween to form a storage capacitor. in that case, the capacitor wiring and the third terminal connected to the capacitor wiring can be omitted. note that in fig. 16 , the same parts as those in fig. 14 are denoted by the same reference numerals. in an active matrix liquid crystal display device, pixel electrodes arranged in a matrix form are driven to form a display pattern on a screen. specifically, voltage is applied between a selected pixel electrode and a counter electrode corresponding to the pixel electrode, so that a liquid crystal layer provided between the pixel electrode and the counter electrode is optically modulated and this optical modulation is recognized as a display pattern by an observer. in displaying moving images, a liquid crystal display device has a problem that a long response time of liquid crystal molecules themselves causes afterimages or blurring of moving images. in order to improve the moving-image characteristics of a liquid crystal display device, a driving method called black insertion is employed in which black is displayed on the whole screen every other frame period. alternatively, a driving method so-called double-frame rate driving may be employed in which a vertical synchronizing frequency is 1.5 times or more, preferably 2 times or more as high as a usual vertical synchronizing frequency, whereby the moving-image characteristics are improved. further alternatively, in order to improve the moving-image characteristics of a liquid crystal display device, a driving method may be employed, in which a plurality of leds (light-emitting diodes) or a plurality of el light sources are used to form a surface light source as a backlight, and each light source of the surface light source is independently driven in a pulsed manner in one frame period. as the surface light source, three or more kinds of leds may be used and an led emitting white light may be used. since a plurality of leds can be controlled independently, the light emission timing of leds can be synchronized with the timing at which a liquid crystal layer is optically modulated. according to this driving method, leds can be partly turned off; therefore, an effect of reducing power consumption can be obtained particularly in the case of displaying an image having a large part on which black is displayed. by combining these driving methods, the display characteristics of a liquid crystal display device, such as moving-image characteristics, can be improved as compared to those of conventional liquid crystal display devices. the n-channel transistor disclosed in this specification includes an oxide semiconductor film which is used for a channel formation region and has excellent dynamic characteristics; thus, it can be combined with these driving techniques. in manufacturing a light-emitting display device, one electrode (also referred to as a cathode) of an organic light-emitting element is set to a low power supply potential such as gnd or 0 v; thus, a terminal portion is provided with a fourth terminal for setting the cathode to a low power supply potential such as gnd or 0 v. also in manufacturing a light-emitting display device, a power supply line is provided in addition to a source wiring and a gate wiring. accordingly, the terminal portion is provided with a fifth terminal electrically connected to the power supply line. the use of an oxide semiconductor in a thin film transistor leads to reduction in manufacturing cost. the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. therefore, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. this embodiment can be implemented in appropriate combination with the structures described in the other embodiments. (embodiment 6) instead of the in—ga—zn—o based non-single-crystal film, another oxide semiconductor film may be used for the buffer layer described in any of embodiments 1, 2, and 5. for example, a film whose composition formula is represented by inmo 3 (zno) m (m>0) may be used, where m denotes another metal element. note that m denotes a metal element selected from iron (fe), nickel (ni), manganese (mn), and cobalt (co) or denotes a plurality of elements selected from gallium (ga), iron (fe), nickel (ni), manganese (mn), and cobalt (co). for example, there is a case where ga and the above metal elements other than ga, for example, ga and ni or ga and fe are contained as m. further, the above oxide semiconductor may contain fe or ni, another transitional metal element, or an oxide of the transitional metal as an impurity element in addition to the metal element contained as m. note that the metal element denoted by m and the above impurity element are contained during deposition of the oxide semiconductor film, so that the inmo 3 (zno) m (m>0) film is obtained. as the oxide semiconductor which is applied to the oxide semiconductor layer, any of the following oxide semiconductors can be applied in addition to the above: an in—sn—zn—o based oxide semiconductor; an in—al—zn—o based oxide semiconductor; a sn—ga—zn—o based oxide semiconductor; an al—ga—zn—o based oxide semiconductor; a sn—al—zn—o based oxide semiconductor; an in—zn—o based oxide semiconductor; a sn—zn—o based oxide semiconductor; an al—zn—o based oxide semiconductor; an in—o based oxide semiconductor; a sn—o based oxide semiconductor; and a zn—o based oxide semiconductor. when a metal element such as titanium, molybdenum, or manganese is added to the above oxide semiconductor layer, resistance of the oxide semiconductor layer is increased and the above oxide semiconductor layer can be used as a buffer layer. note that in this specification, an element such as titanium, molybdenum, or manganese which is to be included in the buffer layer is added to the buffer layer in forming the buffer layer. for example, the buffer layer is formed by a sputtering method with use of a target including titanium, molybdenum, or manganese. the buffer layer is provided so as to include a high resistance region and low resistance regions. the region in the buffer layer which is in contact with the channel formation region is a high resistance region; thus, the buffer layer of the high resistance region can make the electric characteristics of the thin film transistor stable and prevent off current from increasing. in contrast, the regions in the buffer layer which are in contact with the source and drain electrode layers are low resistance regions; thus, the buffer layer of the low resistance regions can reduce contact resistance and increase on current. therefore, a semiconductor device including a thin film transistor having high electric characteristics and high reliability can be provided. through the above steps, a semiconductor device having high reliability can be manufactured. this embodiment can be implemented in appropriate combination with the structures described in the other embodiments. (embodiment 7) a thin film transistor is manufactured, and a semiconductor device having a display function (also referred to as a display device) can be manufactured using the thin film transistor in a pixel portion and further in a driver circuit. further, part or whole of a driver circuit can be formed over the same substrate as that of a pixel portion, using a thin film transistor, whereby a system-on-panel can be obtained. the display device includes a display element. as the display element, a liquid crystal element (also referred to as a liquid crystal display element) or a light-emitting element (also referred to as a light-emitting display element) can be used. the light-emitting element includes, in its category, an element whose luminance is controlled by a current or a voltage, and specifically includes, in its category, an inorganic electroluminescent (el) element, an organic el element, and the like. furthermore, a display medium whose contrast is changed by an electric effect, such as electronic ink, can be used. in addition, the display device includes a panel in which the display element is sealed, and a module in which an ic or the like including a controller is mounted on the panel. furthermore, an element substrate, which corresponds to one mode before the display element is completed in a manufacturing process of the display device, is provided with a means for supplying current to the display element in each of a plurality of pixels. specifically, the element substrate may be in a state in which only a pixel electrode of the display element is provided, a state after formation of a conductive film to be a pixel electrode and before etching of the conductive film to form the pixel electrode, or any other states. note that a display device in this specification means an image display device, a display device, or a light source (including a lighting device). further, the “display device” includes the following modules in its category: a module including a connector such as a flexible printed circuit (fpc), a tape automated bonding (tab) tape, or a tape carrier package (tcp) attached; a module having a tab tape or a tcp which is provided with a printed wiring board at the end thereof; and a module having an integrated circuit (ic) which is directly mounted on a display element by a chip on glass (cog) method. the appearance and a cross section of a liquid crystal display panel, which is one embodiment of a semiconductor device, will be described with reference to figs. 18 a 1 , 18 a 2 , and 18 b. figs. 18 a 1 and 18 a 2 are each a plan view of a panel in which highly reliable thin film transistors 4010 and 4011 each including the buffer layer and the oxide semiconductor layer described in embodiment 5, and a liquid crystal element 4013 are sealed between a first substrate 4001 and a second substrate 4006 with a sealant 4005 . fig. 18b is a cross-sectional view along line m-n in figs. 18 a 1 and 18 a 2 . the sealant 4005 is provided so as to surround a pixel portion 4002 and a scan line driver circuit 4004 which are provided over the first substrate 4001 . the second substrate 4006 is provided over the pixel portion 4002 and the scan line driver circuit 4004 . therefore, the pixel portion 4002 and the scan line driver circuit 4004 are sealed together with a liquid crystal layer 4008 , by the first substrate 4001 , the sealant 4005 , and the second substrate 4006 . a signal line driver circuit 4003 that is formed using a single crystal semiconductor film or a polycrystalline semiconductor film over a substrate separately prepared is mounted in a region that is different from the region surrounded by the sealant 4005 over the first substrate 4001 . note that the connection method of a driver circuit which is separately formed is not particularly limited, and a cog method, a wire bonding method, a tab method, or the like can be used. fig. 18 a 1 illustrates an example of mounting the signal line driver circuit 4003 by cog, and fig. 18 a 2 illustrates an example of mounting the signal line driver circuit 4003 by tab. the pixel portion 4002 and the scan line driver circuit 4004 provided over the first substrate 4001 each include a plurality of thin film transistors. fig. 18b illustrates the thin film transistor 4010 included in the pixel portion 4002 and the thin film transistor 4011 included in the scan line driver circuit 4004 . over the thin film transistors 4010 and 4011 , insulating layers 4020 and 4021 are provided. any of the highly reliable thin film transistors including the buffer layer and the oxide semiconductor layer which are described in embodiment 5, can be used as the thin film transistors 4010 and 4011 . alternatively, any of the thin film transistors described in embodiments 1 to 4 and 6 can be employed. in this embodiment, the thin film transistors 4010 and 4011 are n-channel thin film transistors. a pixel electrode layer 4030 included in the liquid crystal element 4013 is electrically connected to the thin film transistor 4010 . a counter electrode layer 4031 of the liquid crystal element 4013 is provided on the second substrate 4006 . a portion where the pixel electrode layer 4030 , the counter electrode layer 4031 , and the liquid crystal layer 4008 overlap with one another corresponds to the liquid crystal element 4013 . note that the pixel electrode layer 4030 and the counter electrode layer 4031 are provided with an insulating layer 4032 and an insulating layer 4033 respectively which each function as an alignment film, and the liquid crystal layer 4008 is sandwiched between the pixel electrode layer 4030 and the counter electrode layer 4031 with the insulating layers 4032 and 4033 therebetween. note that the first substrate 4001 and the second substrate 4006 can be formed of glass, metal (typically, stainless steel), ceramic, or plastic. as plastic, a fiberglass-reinforced plastics (frp) plate, a polyvinyl fluoride (pvf) film, a polyester film, or an acrylic resin film can be used. in addition, a sheet with a structure in which an aluminum foil is sandwiched between pvf films or polyester films can be used. reference numeral 4035 denotes a columnar spacer obtained by selectively etching an insulating film, which is provided to control the distance between the pixel electrode layer 4030 and the counter electrode layer 4031 (a cell gap). alternatively, a spherical spacer may also be used. in addition, the counter electrode layer 4031 is electrically connected to a common potential line formed over the same substrate as the thin film transistor 4010 . with use of the common connection portion, the counter electrode layer 4031 and the common potential line can be electrically connected to each other by conductive particles arranged between a pair of substrates. note that the conductive particles are included in the sealant 4005 . alternatively, liquid crystal exhibiting a blue phase for which an alignment film is unnecessary may be used. a blue phase is one of liquid crystal phases, which is generated just before a cholesteric phase changes into an isotropic phase while temperature of cholesteric liquid crystal is increased. since the blue phase is generated within an only narrow range of temperature, liquid crystal composition containing a chiral agent at 5 wt % or more so as to improve the temperature range is used for the liquid crystal layer 4008 . the liquid crystal composition which includes liquid crystal exhibiting a blue phase and a chiral agent have such characteristics that the response time is 10 μs to 100 μs, which is short, the alignment process is unnecessary because the liquid crystal composition has optical isotropy, and viewing angle dependency is small. an embodiment of the present invention can also be applied to a reflective liquid crystal display device or a semi-transmissive liquid crystal display device, in addition to a transmissive liquid crystal display device. an example of the liquid crystal display device is described in which a polarizing plate is provided on the outer surface of the substrate (on the viewer side) and a coloring layer and an electrode layer used for a display element are provided on the inner surface of the substrate; however, the polarizing plate may be provided on the inner surface of the substrate. the stacked structure of the polarizing plate and the coloring layer is not limited to this embodiment and may be set as appropriate depending on materials of the polarizing plate and the coloring layer or conditions of manufacturing process. further, a light-blocking film serving as a black matrix may be provided. in order to reduce surface unevenness of the thin film transistor and to improve reliability of the thin film transistor, the thin film transistor obtained in any of the above embodiments is covered with the insulating layers (the insulating layer 4020 and the insulating layer 4021 ) functioning as a protective film or a planarizing insulating film. note that the protective film is provided to prevent entry of contaminant impurities such as organic substance, metal, or moisture existing in air and is preferably a dense film. the protective film may be formed with a single layer or a stacked layer of a silicon oxide film, a silicon nitride film, a silicon oxynitride film, a silicon nitride oxide film, an aluminum oxide film, an aluminum nitride film, an aluminum oxynitride film, and an aluminum nitride oxide film by a sputtering method. although an example in which the protective film is formed by a sputtering method is described in this embodiment, an embodiment of the present invention is not limited to this method and a variety of methods may be employed. in this embodiment, the insulating layer 4020 having a stacked-layer structure is formed as a protective film. here, as a first layer of the insulating layer 4020 , a silicon oxide film is formed by a sputtering method. the use of a silicon oxide film as a protective film has an effect of preventing hillock of an aluminum film used for the source and drain electrode layers. as a second layer of the protective film, an insulating layer is formed. in this embodiment, as a second layer of the insulating layer 4020 , a silicon nitride film is formed by a sputtering method. the use of the silicon nitride film as the protective film can prevent mobile ions such as sodium ions from entering a semiconductor region, thereby suppressing variations in electric characteristics of the tft. after the protective film is formed, the semiconductor layer may be subjected to annealing (300° c. to 400° c.). the insulating layer 4021 is formed as the planarizing insulating film. as the insulating layer 4021 , an organic material having heat resistance such as polyimide, acrylic, benzocyclobutene, polyamide, or epoxy can be used. other than such organic materials, it is also possible to use a low-dielectric constant material (a low-k material), a siloxane-based resin, psg (phosphosilicate glass), bpsg (borophosphosilicate glass), or the like. note that the insulating layer 4021 may be formed by stacking a plurality of insulating films formed of these materials. note that the siloxane-based resin corresponds to a resin including a si—o—si bond formed using a siloxane-based material as a starting material. the siloxane-based resin may include as a substituent an organic group (e.g., an alkyl group or an aryl group) or a fluoro group. in addition, the organic group may include a fluoro group. a formation method of the insulating layer 4021 is not particularly limited, and the following method can be employed depending on the material: a sputtering method, an sog method, a spin coating method, a dipping method, a spray coating method, a droplet discharge method (e.g., an ink-jet method, screen printing, offset printing, or the like), a doctor knife, a roll coater, a curtain coater, a knife coater, or the like. in a case of forming the insulating layer 4021 using a material solution, annealing (300° c. to 400° c.) of the semiconductor layer may be performed at the same time as a baking step. the baking step of the insulating layer 4021 also serves as annealing of the semiconductor layer, whereby a semiconductor device can be manufactured efficiently. the pixel electrode layer 4030 and the counter electrode layer 4031 can be formed using a light-transmitting conductive material such as indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium tin oxide (hereinafter referred to as ito), indium zinc oxide, indium tin oxide to which silicon oxide is added, or the like. conductive compositions including a conductive high molecule (also referred to as a conductive polymer) can be used for the pixel electrode layer 4030 and the counter electrode layer 4031 . the pixel electrode formed using the conductive composition preferably has a sheet resistance of less than or equal to 10000 ohms per square and a transmittance of greater than or equal to 70% at a wavelength of 550 nm further, the resistivity of the conductive high molecule included in the conductive composition is preferably less than or equal to 0.1 ω·cm. as the conductive high molecule, a so-called π-electron conjugated conductive polymer can be used. for example, polyaniline or a derivative thereof, polypyrrole or a derivative thereof, polythiophene or a derivative thereof, a copolymer of two or more kinds of them, and the like can be given. further, a variety of signals and potentials are supplied to the signal line driver circuit 4003 which is formed separately, the scan line driver circuit 4004 , or the pixel portion 4002 from an fpc 4018 . a connection terminal electrode 4015 is formed from the same conductive film as that of the pixel electrode layer 4030 included in the liquid crystal element 4013 , and a terminal electrode 4016 is formed from the same conductive film as that of the source and drain electrode layers of the thin film transistors 4010 and 4011 . the connection terminal electrode 4015 is electrically connected to a terminal included in the fpc 4018 via an anisotropic conductive film 4019 . note that figs. 18 a 1 , 18 a 2 , and 18 b illustrate an example in which the signal line driver circuit 4003 is formed separately and mounted on the first substrate 4001 ; however, the present invention is not limited to this structure. the scan line driver circuit may be separately formed and then mounted, or only part of the signal line driver circuit or part of the scan line driver circuit may be separately formed and then mounted. fig. 22 shows an example in which a liquid crystal display module is formed as a semiconductor device using a tft substrate 2600 which is manufactured according to the manufacturing method disclosed in this specification. fig. 22 illustrates an example of a liquid crystal display module, in which the tft substrate 2600 and a counter substrate 2601 are fixed to each other with a sealant 2602 , and a pixel portion 2603 including a tft and the like, a display element 2604 including a liquid crystal layer, and a coloring layer 2605 are provided between the substrates to form a display region. the coloring layer 2605 is necessary to perform color display. in the rgb system, respective coloring layers corresponding to colors of red, green, and blue are provided for respective pixels. polarizing plates 2606 and 2607 and a diffusion plate 2613 are provided outside the tft substrate 2600 and the counter substrate 2601 . a light source includes a cold cathode tube 2610 and a reflective plate 2611 , and a circuit substrate 2612 is connected to a wiring circuit portion 2608 of the tft substrate 2600 by a flexible wiring board 2609 and includes an external circuit such as a control circuit or a power source circuit. the polarizing plate and the liquid crystal layer may be stacked with a retardation plate therebetween. for the liquid crystal display module, a twisted nematic (tn) mode, an in-plane-switching (ips) mode, a fringe field switching (ffs) mode, a multi-domain vertical alignment (mva) mode, a patterned vertical alignment (pva) mode, an axially symmetric aligned micro-cell (asm) mode, an optical compensated birefringence (ocb) mode, a ferroelectric liquid crystal (flc) mode, an antiferroelectric liquid crystal (aflc) mode, or the like can be used. through the above steps, a highly reliable liquid crystal display panel as a semiconductor device can be manufactured. this embodiment can be implemented in appropriate combination with the structures described in the other embodiments. (embodiment 8) an example of an electronic paper will be described as a semiconductor device. an electronic paper which drives electronic ink by utilizing a switching element and an element which is electrically connected to the switching element and includes the electronic paper can be applied to the thin film transistor using the oxide semiconductor layer described in embodiments 1 to 6. the electronic paper is also referred to as an electrophoretic display device (an electrophoretic display) and has advantages in that it has the same level of readability as plain paper, it has lower power consumption than other display devices, and it can be made thin and lightweight. electrophoretic displays can have various modes. electrophoretic displays contain a plurality of microcapsules dispersed in a solvent or a solute, each microcapsule containing first particles which are positively charged and second particles which are negatively charged. by applying an electric field to the microcapsules, the particles in the microcapsules move in opposite directions to each other and only the color of the particles gathering on one side is displayed. note that the first particles and the second particles each contain pigment and do not move without an electric field. moreover, the first particles and the second particles have different colors (which may be colorless). thus, an electrophoretic display is a display that utilizes a so-called dielectrophoretic effect by which a substance having a high dielectric constant moves to a high-electric field region. an electrophoretic display device does not need to use a polarizer which is required in a liquid crystal display device, and both the thickness and weight of the electrophoretic display device can be reduced to a half of those of a liquid crystal display device. a solution in which the above microcapsules are dispersed in a solvent is referred to as electronic ink. this electronic ink can be printed on a surface of glass, plastic, cloth, paper, or the like. furthermore, by using a color filter or particles that have a pigment, color display can also be achieved. in addition, if a plurality of the above microcapsules are arranged as appropriate over an active matrix substrate so as to be interposed between two electrodes, an active matrix display device can be completed, and display can be performed by application of an electric field to the microcapsules. as the active matrix substrate, for example, the active matrix substrate with use of any of the thin film transistors obtained in embodiments 1 to 6 can be used. note that the first particles and the second particles in the microcapsules may each be formed of a single material selected from a conductive material, an insulating material, a semiconductor material, a magnetic material, a liquid crystal material, a ferroelectric material, an electroluminescent material, an electrochromic material, and a magnetophoretic material, or formed of a composite material of any of these. fig. 17 illustrates an active matrix electronic paper as an example of a semiconductor device. a thin film transistor 581 used for the semiconductor device can be formed in a manner similar to the thin film transistor described in embodiment 5, which is a highly reliable thin film transistor including a buffer layer and an oxide semiconductor layer. any of the thin film transistors described in embodiments 1 to 4 and 6 can also be used as the thin film transistor 581 of this embodiment. the electronic paper in fig. 17 is an example of a display device using a twisting ball display system. the twisting ball display system refers to a method in which spherical particles each colored in black and white are arranged between a first electrode layer and a second electrode layer which are electrode layers used for a display element, and a potential difference is generated between the first electrode layer and the second electrode layer to control orientation of the spherical particles, so that display is performed. the thin film transistor 581 sealed between a substrate 580 and a substrate 596 is a thin film transistor with a bottom gate structure, and a source or drain electrode layer thereof is in contact with a first electrode layer 587 through an opening formed in insulating layers 583 , 584 , and 585 , whereby the thin film transistor 581 is electrically connected to the first electrode layer 587 . between the first electrode layer 587 and a second electrode layer 588 , spherical particles 589 each having a black region 590 a , a white region 590 b , and a cavity 594 around the regions which are filled with liquid are provided. a space around the spherical particles 589 is filled with a filler 595 such as a resin (see fig. 17 ). in this embodiment, the first electrode layer 587 corresponds to the pixel electrode and the second electrode layer 588 corresponds to the common electrode. the second electrode layer 588 is electrically connected to a common potential line provided over the same substrate as the thin film transistor 581 . with the use of a common connection portion, the second electrode layer 588 can be electrically connected to the common potential line through conductive particles provided between a pair of substrates. further, instead of the twisting ball, an electrophoretic element can also be used. a microcapsule having a diameter of about 10 μm to 200 μm in which transparent liquid, positively charged white microparticles, and negatively charged black microparticles are encapsulated, is used. in the microcapsule which is provided between the first electrode layer and the second electrode layer, when an electric field is applied by the first electrode layer and the second electrode layer, the white microparticles and the black microparticles move to opposite sides, so that white or black can be displayed. a display element using this principle is an electrophoretic display element and is generally called electronic paper. the electrophoretic display element has higher reflectance than a liquid crystal display element, and thus, an auxiliary light is unnecessary, power consumption is low, and a display portion can be recognized in a dim place. in addition, even when power is not supplied to the display portion, an image which has been displayed once can be maintained. accordingly, a displayed image can be stored even if a semiconductor device having a display function (which may be referred to simply as a display device or a semiconductor device provided with a display device) is distanced from an electric wave source. through the above steps, a highly reliable electronic paper as a semiconductor device can be manufactured. this embodiment can be implemented in appropriate combination with the structures described in the other embodiments. (embodiment 9) an example of a light-emitting display device will be described as a semiconductor device. as a display element included in a display device, a light-emitting element utilizing electroluminescence is described here. light-emitting elements utilizing electroluminescence are classified according to whether a light-emitting material is an organic compound or an inorganic compound. in general, the former is referred to as an organic el element, and the latter is referred to as an inorganic el element. in an organic el element, by application of voltage to a light-emitting element, electrons and holes are separately injected from a pair of electrodes into a layer containing a light-emitting organic compound, and current flows. the carriers (electrons and holes) are recombined, and thus, the light-emitting organic compound is excited. the light-emitting organic compound returns to a ground state from the excited state, thereby emitting light. owing to such a mechanism, this light-emitting element is referred to as a current-excitation light-emitting element. the inorganic el elements are classified according to their element structures into a dispersion-type inorganic el element and a thin-film inorganic el element. a dispersion-type inorganic el element has a light-emitting layer where particles of a light-emitting material are dispersed in a binder, and its light emission mechanism is donor-acceptor recombination type light emission that utilizes a donor level and an acceptor level. a thin-film inorganic el element has a structure where a light-emitting layer is sandwiched between dielectric layers, which are further sandwiched between electrodes, and its light emission mechanism is localized type light emission that utilizes inner-shell electron transition of metal ions. note that an example of an organic el element as a light-emitting element is described here. fig. 20 illustrates an example of a pixel structure to which digital time grayscale driving can be applied, as an example of a semiconductor device. a structure and operation of a pixel to which digital time grayscale driving can be applied are described. here, one pixel includes two n-channel transistors each of which includes an oxide semiconductor layer as a channel formation region. a pixel 6400 includes a switching transistor 6401 , a driver transistor 6402 , a light-emitting element 6404 , and a capacitor 6403 . a gate of the switching transistor 6401 is connected to a scan line 6406 , a first electrode (one of a source electrode and a drain electrode) of the switching transistor 6401 is connected to a signal line 6405 , and a second electrode (the other of the source electrode and the drain electrode) of the switching transistor 6401 is connected to a gate of the driver transistor 6402 . the gate of the driver transistor 6402 is connected to a power supply line 6407 via the capacitor 6403 , a first electrode of the driver transistor 6402 is connected to the power supply line 6407 , and a second electrode of the driver transistor 6402 is connected to a first electrode (pixel electrode) of the light-emitting element 6404 . a second electrode of the light-emitting element 6404 corresponds to a common electrode 6408 . the common electrode 6408 is electrically connected to a common potential line provided over the same substrate. the second electrode (common electrode 6408 ) of the light-emitting element 6404 is set to a low power supply potential. note that the low power supply potential is a potential satisfying that the low power supply potential is lower than a high power supply potential (low power supply potential<high power supply potential) based on the high power supply potential that is set to the power supply line 6407 . as the low power supply potential, gnd, 0 v, or the like may be employed, for example. a potential difference between the high power supply potential and the low power supply potential is applied to the light-emitting element 6404 and current is supplied to the light-emitting element 6404 , so that the light-emitting element 6404 emits light. here, in order to make the light-emitting element 6404 emit light, each potential is set so that the potential difference between the high power supply potential and the low power supply potential is a forward threshold voltage or higher of the light-emitting element 6404 . note that gate capacitor of the driver transistor 6402 may be used as a substitute for the capacitor 6403 , so that the capacitor 6403 can be omitted. the gate capacitor of the driver transistor 6402 may be formed between the channel region and the gate electrode. in the case of a voltage-input voltage driving method, a video signal is input to the gate of the driver transistor 6402 so that the driver transistor 6402 is in either of two states of being sufficiently turned on or turned off. that is, the driver transistor 6402 operates in a linear region. since the driver transistor 6402 operates in the linear region, a voltage higher than the voltage of the power supply line 6407 is applied to the gate of the driver transistor 6402 . note that a voltage higher than or equal to the sum voltage of the power supply line voltage and v th of the driver transistor 6402 (voltage of the power supply line+v th of the driver transistor 6402 ) is applied to the signal line 6405 . in the case of using an analog grayscale method instead of the digital time grayscale method, the same pixel structure as in fig. 20 can be employed by inputting signals in a different way. in the case of performing analog grayscale driving, a voltage higher than or equal to the sum voltage of forward voltage of the light-emitting element 6404 and v th of the driver transistor 6402 (forward voltage of the light-emitting element 6404 +v th of the driver transistor 6402 ) is applied to the gate of the driver transistor 6402 . the forward voltage of the light-emitting element 6404 indicates a voltage at which a desired luminance is obtained, and includes at least forward threshold voltage. the video signal by which the driver transistor 6402 operates in a saturation region is input, so that current can be supplied to the light-emitting element 6404 . in order for the driver transistor 6402 to operate in the saturation region, the potential of the power supply line 6407 is set higher than the gate potential of the driver transistor 6402 . when an analog video signal is used, it is possible to feed current to the light-emitting element 6404 in accordance with the video signal and perform analog grayscale driving. note that the pixel structure is not limited to that illustrated in fig. 20 . for example, the pixel in fig. 20 can further include a switch, a resistor, a capacitor, a transistor, a logic circuit, or the like. next, structures of the light-emitting element will be described with reference to figs. 21a to 21c . here, a cross-sectional structure of a pixel is described by taking an n-channel driving tft as an example. driving tfts 7001 , 7011 , and 7021 used in semiconductor devices illustrated in figs. 21a , 21 b, and 21 c, respectively can be formed in a manner similar to the thin film transistor described in embodiment 5 and are highly reliable thin film transistors each including a buffer layer and an oxide semiconductor layer. alternatively, any of the thin film transistors described in embodiments 1 to 4, and 6 can be employed as the driving tfts 7001 , 7011 , and 7021 . in order to extract light emitted from the light-emitting element, at least one of an anode and a cathode is required to transmit light. a thin film transistor and a light-emitting element are formed over a substrate. a light-emitting element can have a top emission structure, in which light emission is extracted through the surface opposite to the substrate; a bottom emission structure, in which light emission is extracted through the surface on the substrate side; or a dual emission structure, in which light emission is extracted through the surface opposite to the substrate and the surface on the substrate side. the pixel structure can be applied to a light-emitting element having any of these emission structures. a light-emitting element having a top emission structure will be described with reference to fig. 21a . fig. 21a is a cross-sectional view of a pixel in the case where the driving tft 7001 is an n-channel transistor and light is emitted from a light-emitting element 7002 to an anode 7005 side. in fig. 21a , a cathode 7003 of the light-emitting element 7002 is electrically connected to the driving tft 7001 , and a light-emitting layer 7004 and the anode 7005 are stacked in this order over the cathode 7003 . the cathode 7003 can be formed using a variety of conductive materials as long as they have a low work function and reflect light. for example, ca, al, mgag, alli, or the like is preferably used. the light-emitting layer 7004 may be formed using a single layer or a plurality of layers stacked. when the light-emitting layer 7004 is formed using a plurality of layers, the light-emitting layer 7004 is formed by stacking an electron-injecting layer, an electron-transporting layer, a light-emitting layer, a hole-transporting layer, and a hole-injecting layer in this order over the cathode 7003 . it is not necessary to form all of these layers. the anode 7005 is formed using a light-transmitting conductive film such as a film of indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium tin oxide (hereinafter referred to as ito), indium zinc oxide, or indium tin oxide to which silicon oxide is added. the light-emitting element 7002 corresponds to a region where the light-emitting layer 7004 is sandwiched between the cathode 7003 and the anode 7005 . in the case of the pixel illustrated in fig. 21a , light is emitted from the light-emitting element 7002 to the anode 7005 side as indicated by an arrow. next, a light-emitting element having a bottom emission structure will be described with reference to fig. 21b . fig. 21b is a cross-sectional view of a pixel in the case where the driving tft 7011 is an n-channel transistor and light is emitted from a light-emitting element 7012 to a cathode 7013 side. in fig. 21b , the cathode 7013 of the light-emitting element 7012 is formed over a light-transmitting conductive film 7017 which is electrically connected to the driving tft 7011 , and a light-emitting layer 7014 and an anode 7015 are stacked in this order over the cathode 7013 . a light-blocking film 7016 for reflecting or blocking light may be formed to cover the anode 7015 when the anode 7015 has a light-transmitting property. for the cathode 7013 , various materials can be used, like in the case of fig. 21a , as long as they are conductive materials having a low work function. the cathode 7013 is formed to have a thickness that can transmit light (preferably, approximately 5 nm to 30 nm). for example, an aluminum film with a thickness of 20 nm can be used as the cathode 7013 . similarly to the case of fig. 21a , the light-emitting layer 7014 may be formed using either a single layer or a plurality of layers stacked. the anode 7015 is not required to transmit light, but can be made of a light-transmitting conductive material like in the case of fig. 21a . as the light-blocking film 7016 , a metal or the like that reflects light can be used for example; however, it is not limited to a metal film. for example, a resin or the like to which black pigments are added can also be used. the light-emitting element 7012 corresponds to a region where the light-emitting layer 7014 is sandwiched between the cathode 7013 and the anode 7015 . in the case of the pixel illustrated in fig. 21b , light is emitted from the light-emitting element 7012 to the cathode 7013 side as indicated by an arrow. next, a light-emitting element having a dual emission structure will be described with reference to fig. 21c . in fig. 21c , a cathode 7023 of a light-emitting element 7022 is formed over a light-transmitting conductive film 7027 which is electrically connected to the driving tft 7021 , and a light-emitting layer 7024 and an anode 7025 are stacked in this order over the cathode 7023 . like in the case of fig. 21a , the cathode 7023 can be made of a variety of conductive materials as long as they have a low work function. the cathode 7023 is formed to have a thickness that can transmit light. for example, a film of al having a thickness of 20 nm can be used as the cathode 7023 . like in fig. 21a , the light-emitting layer 7024 may be formed as either a single layer or a plurality of layers stacked. the anode 7025 can be made of a light-transmitting conductive material like in the case of fig. 21a . the light-emitting element 7022 corresponds to a region where the cathode 7023 , the light-emitting layer 7024 , and the anode 7025 overlap with one another. in the case of the pixel illustrated in fig. 21c , light is emitted from the light-emitting element 7022 to both the anode 7025 side and the cathode 7023 side as indicated by arrows. note that, although the organic el elements are described here as the light-emitting elements, an inorganic el element can also be provided as a light-emitting element. note that the example is described in which a thin film transistor (a driving tft) which controls the driving of a light-emitting element is electrically connected to the light-emitting element; however, a structure may be employed in which a tft for current control is connected between the driving tft and the light-emitting element. note that the structure of the semiconductor device is not limited to those illustrated in figs. 21a to 21c and can be modified in various ways based on techniques disclosed in this specification. next, the appearance and cross section of a light-emitting display panel (also referred to as a light-emitting panel) which corresponds to one embodiment of a semiconductor device will be described with reference to figs. 19a and 19b . fig. 19a is a plan view of a panel in which a thin film transistor and a light-emitting element formed over a first substrate are sealed between the first substrate and a second substrate with a sealant. fig. 19b is a cross-sectional view along line h-i of fig. 19a . a sealant 4505 is provided so as to surround a pixel portion 4502 , signal line driver circuits 4503 a and 4503 b , and scan line driver circuits 4504 a and 4504 b which are provided over a first substrate 4501 . in addition, a second substrate 4506 is provided over the pixel portion 4502 , the signal line driver circuits 4503 a and 4503 b , and the scan line driver circuits 4504 a and 4504 b . accordingly, the pixel portion 4502 , the signal line driver circuits 4503 a and 4503 b , and the scan line driver circuits 4504 a and 4504 b are sealed together with a filler 4507 , by the first substrate 4501 , the sealant 4505 , and the second substrate 4506 . it is preferable that a panel be packaged (sealed) with a protective film (such as a laminate film or an ultraviolet curable resin film) or a cover material with high air-tightness and little degasification so that the panel is not exposed to the outside air, in this manner. the pixel portion 4502 , the signal line driver circuits 4503 a and 4503 b , and the scan line driver circuits 4504 a and 4504 b formed over the first substrate 4501 each include a plurality of thin film transistors. in fig. 19b , a thin film transistor 4510 included in the pixel portion 4502 and a thin film transistor 4509 included in the signal line driver circuit 4503 a are illustrated. for the thin film transistors 4509 and 4510 , the highly reliable thin film transistor including the buffer layer and the oxide semiconductor layer described in embodiment 5 can be employed. alternatively, any of the thin film transistors described in embodiments 1 to 4 and 6 may be employed. the thin film transistors 4509 and 4510 are n-channel thin film transistors. moreover, reference numeral 4511 denotes a light-emitting element. a first electrode layer 4517 which is a pixel electrode included in the light-emitting element 4511 is electrically connected to a source electrode layer or a drain electrode layer of the thin film transistor 4510 . note that the structure of the light-emitting element 4511 is, but not limited to, the stack structure which includes the first electrode layer 4517 , an electroluminescent layer 4512 , and a second electrode layer 4513 . the structure of the light-emitting element 4511 can be changed as appropriate depending on the direction in which light is extracted from the light-emitting element 4511 , or the like. a partition 4520 is formed using an organic resin film, an inorganic insulating film, or organic polysiloxane. it is particularly preferable that the partition 4520 be formed using a photosensitive material and an opening be formed over the first electrode layer 4517 so that a sidewall of the opening is formed as an inclined surface with continuous curvature. the electroluminescent layer 4512 may be formed with a single layer or a plurality of layers stacked. a protective film may be formed over the second electrode layer 4513 and the partition 4520 in order to prevent entry of oxygen, hydrogen, moisture, carbon dioxide, or the like into the light-emitting element 4511 . as the protective film, a silicon nitride film, a silicon nitride oxide film, a dlc film, or the like can be formed. in addition, a variety of signals and potentials are supplied to the signal line driver circuits 4503 a and 4503 b , the scan line driver circuits 4504 a and 4504 b , or the pixel portion 4502 from fpcs 4518 a and 4518 b. a connection terminal electrode 4515 is formed from the same conductive film as the first electrode layer 4517 included in the light-emitting element 4511 , and a terminal electrode 4516 is formed from the same conductive film as the source and drain electrode layers included in the thin film transistors 4509 and 4510 . the connection terminal electrode 4515 is electrically connected to a terminal included in the fpc 4518 a via an anisotropic conductive film 4519 . as the second substrate located in the direction in which light is extracted from the light-emitting element 4511 needs to have a light-transmitting property. in that case, a light-transmitting material such as a glass plate, a plastic plate, a polyester film, or an acrylic film is used for the second substrate 4506 . as the filler 4507 , an ultraviolet curable resin or a thermosetting resin can be used, in addition to an inert gas such as nitrogen or argon. for example, pvc (polyvinyl chloride), acrylic, polyimide, an epoxy resin, a silicone resin, pvb (polyvinyl butyral), or eva (ethylene vinyl acetate) can be used. for example, nitrogen is used for the filler. in addition, if needed, an optical film, such as a polarizing plate, a circularly polarizing plate (including an elliptically polarizing plate), a retardation plate (a quarter-wave plate or a half-wave plate), or a color filter, may be provided as appropriate on a light-emitting surface of the light-emitting element. further, the polarizing plate or the circularly polarizing plate may be provided with an anti-reflection film. for example, anti-glare treatment by which reflected light can be diffused by projections and depressions on the surface so as to reduce the glare can be performed. the signal line driver circuits 4503 a and 4503 b and the scan line driver circuits 4504 a and 4504 b may be mounted as driver circuits formed using a single crystal semiconductor film or a polycrystalline semiconductor film over a substrate separately prepared. alternatively, only the signal line driver circuits or part thereof, or only the scan line driver circuits or part thereof may be separately formed and mounted. this embodiment is not limited to the structure illustrated in figs. 19a and 19b . through the above steps, a highly reliable light-emitting display device (display panel) as a semiconductor device can be manufactured. this embodiment can be implemented in appropriate combination with the structures described in the other embodiments. (embodiment 10) a semiconductor device disclosed in this specification can be applied to an electronic paper. an electronic paper can be used for electronic appliances of a variety of fields as long as they can display data. for example, an electronic paper can be applied to an e-book reader (electronic book), a poster, an advertisement in a vehicle such as a train, or displays of various cards such as a credit card. examples of the electronic devices are illustrated in figs. 23a and 23b and fig. 24 . fig. 23a illustrates a poster 2631 formed using an electronic paper. in the case where an advertising medium is printed paper, the advertisement is replaced by hands; however, by using electronic paper disclosed in this specification, the advertising display can be changed in a short time. furthermore, stable images can be obtained without display defects. note that the poster may have a configuration capable of wirelessly transmitting and receiving data. fig. 23b illustrates an advertisement 2632 in a vehicle such as a train. in the case where an advertising medium is printed paper, the advertisement is replaced by hands; however, by using electronic paper disclosed in this specification, the advertising display can be changed in a short time with less manpower. furthermore, stable images can be obtained without display defects. note that the advertisement may have a configuration capable of wirelessly transmitting and receiving data. fig. 24 illustrates an example of an electronic book reader 2700 . for example, the e-book reader 2700 includes two housings, a housing 2701 and a housing 2703 . the housing 2701 and the housing 2703 are combined with a hinge 2711 so that the e-book reader 2700 can be opened and closed with the hinge 2711 as an axis. with such a structure, the e-book reader 2700 can operate like a paper book. a display portion 2705 and a display portion 2707 are incorporated in the housing 2701 and the housing 2703 , respectively. the display portion 2705 and the display portion 2707 may display one image or different images. in the case where the display portion 2705 and the display portion 2707 display different images, for example, a display portion on the right side (the display portion 2705 in fig. 24 ) can display text and a display portion on the left side (the display portion 2707 in fig. 24 ) can display graphics. fig. 24 illustrates an example in which the housing 2701 is provided with an operation portion and the like. for example, the housing 2701 is provided with a power switch 2721 , an operation key 2723 , a speaker 2725 , and the like. with the operation key 2723 , pages can be turned. note that a keyboard, a pointing device, and the like may be provided on the same surface as the display portion of the housing. furthermore, an external connection terminal (an earphone terminal, a usb terminal, a terminal that can be connected to various cables such as an ac adapter and a usb cable, or the like), a recording medium insertion portion, and the like may be provided on the back surface or the side surface of the housing. moreover, the e-book reader 2700 may have a function of an electronic dictionary. the e-book reader 2700 may have a configuration capable of wirelessly transmitting and receiving data. through wireless communication, desired book data or the like can be purchased and downloaded from an electronic book server. (embodiment 11) a semiconductor device disclosed in this specification can be applied to a variety of electronic appliances (including game machines). examples of electronic devices are a television set (also referred to as a television or a television receiver), a monitor of a computer or the like, a camera such as a digital camera or a digital video camera, a digital photo frame, a mobile phone handset (also referred to as a mobile phone or a mobile phone device), a portable game console, a portable information terminal, an audio reproducing device, a large-sized game machine such as a pachinko machine, and the like. fig. 25a illustrates an example of a television set 9600 . in the television set 9600 , a display portion 9603 is incorporated in a housing 9601 . the display portion 9603 can display images. here, the housing 9601 is supported by a stand 9605 . the television set 9600 can be operated with an operation switch of the housing 9601 or a separate remote controller 9610 . channels and volume can be controlled with an operation key 9609 of the remote controller 9610 so that an image displayed on the display portion 9603 can be controlled. furthermore, the remote controller 9610 may be provided with a display portion 9607 for displaying data output from the remote controller 9610 . note that the television set 9600 is provided with a receiver, a modem, and the like. with the use of the receiver, general television broadcasting can be received. moreover, when the display device is connected to a communication network with or without wires via the modem, one-way (from a sender to a receiver) or two-way (between a sender and a receiver or between receivers) information communication can be performed. fig. 25b illustrates an example of a digital photo frame 9700 . for example, in the digital photo frame 9700 , a display portion 9703 is incorporated in a housing 9701 . the display portion 9703 can display a variety of images. for example, the display portion 9703 can display data of an image taken with a digital camera or the like and function as a normal photo frame note that the digital photo frame 9700 is provided with an operation portion, an external connection portion (a usb terminal, a terminal that can be connected to various cables such as a usb cable, or the like), a recording medium insertion portion, and the like. although these components may be provided on the surface on which the display portion is provided, it is preferable to provide them on the side surface or the back surface for the design of the digital photo frame 9700 . for example, a memory storing data of an image taken with a digital camera is inserted in the recording medium insertion portion of the digital photo frame, whereby the image data can be transferred and then displayed on the display portion 9703 . the digital photo frame 9700 may be configured to transmit and receive data wirelessly. the structure may be employed in which desired image data is transferred wirelessly to be displayed. fig. 26a is a portable amusement machine and includes two housings, a housing 9881 and a housing 9891 , which are connected with a joint portion 9893 so that the portable amusement machine can be opened or folded. a display portion 9882 and a display portion 9883 are incorporated in the housing 9881 and the housing 9891 , respectively. in addition, the portable amusement machine illustrated in fig. 26a is provided with a speaker portion 9884 , a recording medium insert portion 9886 , an led lamp 9890 , input means (operation keys 9885 , a connection terminal 9887 , a sensor 9888 (having a function of measuring force, displacement, position, speed, acceleration, angular velocity, rotation number, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, electric power, radial ray, flow rate, humidity, gradient, vibration, odor, or infrared ray), and a microphone 9889 ), and the like. it is needless to say that the structure of the portable amusement machine is not limited to the above and other structures provided with at least a semiconductor device disclosed in this specification can be employed. the portable amusement machine may include other accessory equipment as appropriate. the portable amusement machine illustrated in fig. 26a has a function of reading a program or data stored in a recording medium to display it on the display portion, and a function of sharing information with another portable amusement machine by wireless communication. note that a function of the portable amusement machine illustrated in fig. 26a is not limited to those described above, and the portable amusement machine can have a variety of functions. fig. 26b illustrates an example of a slot machine 9900 which is a large-sized amusement machine. in the slot machine 9900 , a display portion 9903 is incorporated in a housing 9901 . in addition, the slot machine 9900 includes an operation means such as a start lever or a stop switch, a coin slot, a speaker, and the like. it is needless to say that the structure of the slot machine 9900 is not limited to the above and other structures provided with at least a semiconductor device disclosed in this specification may be employed. the slot machine 9900 may include other accessory equipment as appropriate. fig. 27a is a perspective view illustrating an example of a portable computer. in the portable computer of fig. 27a , a top housing 9301 having a display portion 9303 and a bottom housing 9302 having a keyboard 9304 can overlap with each other by closing a hinge unit which connects the top housing 9301 and the bottom housing 9302 . the portable computer of fig. 27a can be convenient for carrying, and in the case of using the keyboard for input, the hinge unit is opened and the user can input data looking at the display portion 9303 . the bottom housing 9302 includes a pointing device 9306 with which input can be performed, in addition to the keyboard 9304 . further, when the display portion 9303 is a touch input panel, input can be performed by touching part of the display portion. the bottom housing 9302 includes an arithmetic function portion such as a cpu or hard disk. in addition, the bottom housing 9302 includes another device, for example, an external connection port 9305 into which a communication cable conformable to communication standards of a usb is inserted. the top housing 9301 includes a display portion 9307 and can keep the display portion 9307 therein by sliding it toward the inside of the top housing 9301 ; thus, the top housing 9301 can have a large display screen. in addition, the user can adjust the orientation of a screen of the display portion 9307 which can be kept in the top housing 9301 . when the display portion 9307 which can be kept in the top housing 9301 is a touch input panel, input can be performed by touching part of the display portion 9307 which can be kept in the top housing 9301 . the display portion 9303 or the display portion 9307 which can be kept in the top housing 9301 are formed with an image display device of a liquid crystal display panel, a light-emitting display panel such as an organic light-emitting element or an inorganic light-emitting element, or the like. in addition, the portable computer of fig. 27a can be provided with a receiver and the like and can receive television broadcast to display an image on the display portion. the user can watch television broadcast when the whole screen of the display portion 9307 is exposed by sliding the display portion 9307 while the hinge unit which connects the top housing 9301 and the bottom housing 9302 is kept closed. in this case, the hinge unit is not opened and display is not performed on the display portion 9303 . in addition, start up of only a circuit for displaying television broadcast is performed. therefore, power can be consumed to the minimum, which is useful for the portable computer whose battery capacity is limited. fig. 27b is a perspective view illustrating an example of a mobile phone that the user can wear on the wrist like a wristwatch. this mobile phone is formed with a main body which includes a communication device including at least a telephone function, and battery; a band portion which enables the main body to be wore on the wrist; an adjusting portion 9205 for adjusting the fixation of the band portion fixed for the wrist; a display portion 9201 ; a speaker 9207 ; and a microphone 9208 . in addition, the main body includes operating switches 9203 . the operating switches 9203 have a function, for example, of a switch for starting a program for the internet when the switch is pushed, in addition to a function of a switch for turning on a power source, a switch for shifting a display, a switch for instructing to start taking images, or the like, and can be used so as to correspond to each function. input to this mobile phone is operated by touching the display portion 9201 with a finger or an input pen, operating the operating switches 9203 , or inputting voice into the microphone 9208 . note that displayed buttons 9202 which are displayed on the display portion 9201 are illustrated in fig. 27b . input can be performed by touching the displayed buttons 9202 with a finger or the like. further, the main body includes a camera portion 9206 including an image pick-up means having a function of converting an image of an object, which is formed through a camera lens, to an electronic image signal. note that the camera portion is not necessarily provided. the mobile phone illustrated in fig. 27b is provided with a receiver of television broadcast and the like, and can display an image on the display portion 9201 by receiving television broadcast. in addition, the mobile phone illustrated in fig. 27b is provided with a memory device and the like such as a memory, and can record television broadcast in the memory. the mobile phone illustrated in fig. 27b may have a function of collecting location information such as gps. an image display device of a liquid crystal display panel, a light-emitting display panel such as an organic light-emitting element or an inorganic light-emitting element, or the like is used as the display portion 9201 . the mobile phone illustrated in fig. 27b is compact and lightweight, and the battery capacity of such a mobile phone is limited. therefore, a panel which can be driven with low power consumption is preferably used as a display device for the display portion 9201 . note that fig. 27b illustrates the electronic appliances which is worn on the wrist; however, this embodiment is not limited thereto as long as a portable shape is employed. this application is based on japanese patent application serial no. 2009-053399 filed with japan patent office on mar. 6, 2009, the entire contents of which are hereby incorporated by reference.
039-110-093-196-666	US	[ "JP", "US", "EP", "WO", "CN", "KR" ]	C23C28/00,C23C10/00,C23C10/36,C23C8/12,C23C10/08,C23C10/14,C23C10/60,G21D1/00,B21B21/00,B21C1/00,B21C1/22,C21D6/00,C21D9/00,C21D9/08,C23C8/02,C23C8/10,C23C8/14,C23C10/52,C23C10/54,C23C22/53,C09D5/08,B05D7/22,B21C37/00,C22C38/18,C23C10/16	2015-10-29T00:00:00	2015	[ "C23", "G21", "B21", "C21", "C09", "B05", "C22" ]	methods for creating a zinc-metal oxide layer in metal components for corrosion resistance	the present invention provides a method for manufacturing a finished metal object or product having a corrosion resistant layer integral to or within a top portion of at least one of its surfaces that would be exposed to a corrosive environment. in one embodiment, the method for manufacturing is directed to a finished metal tubing product having a corrosion resistant layer within its inside surface that is exposed to a fluid and wherein the corrosion resistant layer is a zinc-metal oxide layer, such as a zinc-chromium oxide layer, or a zinc-mixed metal oxide layer. in addition to methods of manufacturing, the present invention provides finished metal objects or products having a corrosion resistant layer integral to or within a top portion of at least one surfaces that would be exposed to a corrosive environment.	1. a method for creating a metal object having a corrosion resistant layer, comprising: incorporating zinc within at least one portion of a metal body of a metal object, wherein the metal body comprises an outer surface and an interior, wherein the at least one portion extends from the outer surface of the metal body inwardly toward the interior of the metal body, and wherein the outer surface of the metal body will be exposed during use of the metal object; forming a corrosion resistant layer within the portion of the metal body. 2. the method of claim 1 , wherein the corrosion resistant layer comprises a zinc-metal oxide layer. 3. the method of claim 2 , wherein the metal surface comprises chromium and wherein the zinc-metal oxide layer comprises a zinc-chromium oxide layer. 4. the method of claim 1 , wherein the metal surface comprises an alloy comprising chromium. 5. the method of claim 1 , wherein the metal surface comprises nickel-iron-chromium bearing steel. 6. the method of claim 1 , further comprising: incorporating a second metal into the portion of the metal body. 7. the method of claim 6 , wherein the second metal comprises chromium. 8. a method for creating a metal object having a corrosion resistant layer, comprising: incorporating zinc into at least one portion of a metal body of a metal object extending from an outer surface of the metal body inwardly, thereby avoiding formation of a layer comprising zinc on top of the outer surface of the metal body and wherein the outer surface of the metal body will be exposed during use of the metal object; forming a corrosion resistant layer within the portion of the metal body. 9. the method of claim 8 , wherein the metal surface comprises an alloy comprising chromium and the corrosion resistant layer comprises a zinc-mixed metal oxide. 10. the method of claim 8 , wherein the metal surface comprises nickel-iron-chromium bearing steel and the corrosion resistant layer comprises a zinc-mixed metal oxide. 11. the method of claim 8 , further comprising: incorporating a second metal into the portion of the metal body. 12. the method of claim 11 , wherein the second metal comprises chromium. 13. a method for creating a finished metal product having a corrosion resistant layer, comprising: adding zinc into a pre-existing portion of a metal body of a semi-finished metal product, wherein the pre-existing portion extends from and beneath a pre-existing outer metal surface of the metal body, and wherein the pre-existing outer metal surface will be exposed during use of a finished metal product produced from the semi-finished metal product; forming the semi-finished metal product into a predetermined shape of the finished metal product after said adding; and heat-treating the semi-finished metal product after said forming to form a zinc-metal oxide layer within the portion of the metal body. 14. the method of claim 13 , wherein the metal surface comprises chromium and the zinc-metal oxide comprises a zinc-chromium oxide. 15. the method of claim 13 , wherein the zinc-metal oxide comprises a zinc-mixed metal oxide. 16. the method of claim 13 , further comprising: incorporating a second metal into the portion of the metal body. 17. a method for creating a metal tube having a corrosion resistant layer integral to an exposed inner surface of the metal tube, comprising: adding zinc into an existing portion of a metal body of a semi-finished metal product, wherein the existing portion extends from a metal surface of the metal body and into the metal body; forming a metal tube from the semi-finished metal product before or after said adding, wherein the metal surface is an inner surface of the metal tube that will be exposed during use of the metal tube; heat-treating the metal tube after said forming to form a zinc-metal oxide layer within the existing portion of the metal tube, wherein the zinc-metal oxide layer extends to the metal surface. 18. the method of claim 17 , further comprising: processing the metal tube after said adding, after said forming, and before said heat-treating by pilgering or using a cold drawing process. 19. the method of claim 17 , wherein the metal surface comprises chromium and the zinc-metal oxide comprises a zinc-chromium oxide. 20. the method of claim 17 , further comprising: incorporating a second metal into the metal surface. 21. a method for creating a metal product having a corrosion resistant layer, comprising: incorporating zinc into a portion of a metal body of a metal object, wherein, prior to said incorporating, the portion has an outer surface that will be exposed during use of a corresponding finished metal product; processing the metal object into a finished metal product; and forming a corrosion resistant layer integral to the portion, wherein the corrosion resistant layer extends from the outer surface of the portion into the body of the corresponding finished metal product.	cross reference to related applications this application claims the benefit of u.s. provisional application no. 62/247,945, filed oct. 29, 2015, the content of which is incorporated by reference herein in its entirety. background of the invention field of the invention the present invention in its various embodiments provides a method for manufacturing a corrosion resistant layer integral to a top portion of a metal surface of a metal object or product to reduce corrosion of the metal surface and release of metal species. in particular, the present invention provides a method for manufacturing a finished metal object or product having a stabilized zinc-metal oxide or zinc-mixed metal oxide layer integral to an exposed surface, such as the interior surface of a metal tube, to reduce corrosion and release of metals from the metal. the present invention in its various embodiments also provides finished metal objects or products having an integral corrosion resistant layer. description of related art in the power generating industry, metal corrosion in water cooled systems is a major reliability factor. water-borne corrosion is driven by metal release from a metal surface, which is controlled by metal species solubility under given conditions. any metal, steel, or alloy is subject to such corrosion. the released material is often deposited elsewhere in the system, such as in low-flow regions or on heat transfer surfaces, causing fouling and efficiency losses. in the nuclear industry in particular, metallic releases are a source for generating radiation fields external to the reactor vessel. numerous technologies to reduce metal corrosion and release of metals by protecting metal surfaces from corrosion have been developed. for example, in nuclear power applications, an in-situ treatment is used to “precondition” metal surfaces during the hot functional testing (hft) period. in new pressurized water reactors (pwrs), steam generator tubing is treated with a given chemistry for a given period of time to precondition the inner surface of the tubing. in boiling water reactors (bwrs), feedwater tubing and other metal surfaces (e.g., feedwater heaters) that transport or would be exposed to reactor coolant water during normal operation may also be preconditioned. the expectation of such “preconditioning” is to provide stable corrosion films on the metal surfaces that would limit subsequent corrosion and metal release during operation, thereby reducing incorporation of radioactive species in the reactor water during plant operation. unfortunately, such preconditioning does not provide a stable, long-lasting corrosion resistant film that avoids metal release during normal operation. additionally, plants have only a limited amount of time available for such preconditioning and cannot devote thousands of exposure hours that may otherwise be necessary to establish a stable film on most metal surfaces. accordingly, there is a need for a more stable corrosion resistant layer for exposed metal surfaces, in particular, those used in a pwr or bwr environment. in particular, there is a need for a manufacturing process to make metal products with a more stable corrosion resistant layer integral to a top portion of an exposed surface of the metal product, such as a zinc-metal oxide layer that resists corrosion and the corresponding release of metals. brief summary of the invention the present invention provides a method for manufacturing a finished metal object or product having a corrosion resistant layer within a top portion of at least one of its surfaces that would be exposed in use to at least a potentially corrosive or corrosive environment. therefore, it should be appreciated that the corrosion resistant oxide layer is formed during the manufacturing process used to make the finished metal object or product, as opposed to creating a protective layer after manufacturing, e.g., by creating a protective layer in-situ (i.e., wherein the finished metal object or product has been completely manufactured and is ready for its intended use, has been put in place for such use, and thereafter, but prior to use, the protective layer is created). in one embodiment, the corrosion resistant layer is a zinc-metal oxide layer in which zinc has been incorporated into and bonds with a metal within the metal object or product to form a zinc-metal oxide layer. in one embodiment, the zinc-metal oxide layer is a zinc-chromium oxide layer. in another embodiment, the corrosion resistant layer is a zinc-mixed metal oxide layer in which zinc has been incorporated into and bonds to more than one metal within the metal object or product to form a zinc-mixed metal oxide layer. it should be appreciated that the zinc-metal oxide layer and the zinc-mixed metal oxide layer are more stable than a similar layer that has been manufactured in-situ. in one embodiment, the present invention provides a method for creating a finished metal product having a corrosion resistant oxide layer, comprising incorporating zinc into at least one surface of a semi-finished metal product that will be exposed during use of a finished metal product produced from the semi-finished metal product, wherein the semi-finished metal product comprises a metal; forming the semi-finished metal product into a predetermined shape of the finished metal product after the incorporation of zinc; and heat-treating the semi-finished metal product in a controlled environment after the forming to form a zinc-metal oxide layer within a top portion of the at least one surface. in one embodiment, the semi-finished metal product comprises a metal that is chromium and the zinc-metal oxide formed is a zinc-chromium oxide layer. in one embodiment, the controlled environment includes the presence of hydrogen and oxygen. in another embodiment, the present invention provides a method for creating a metal tube having a corrosion resistant oxide layer within a portion of the exposed inner surface of the metal tube, comprising incorporating zinc into at least one surface of a semi-finished metal product comprising a metal; forming a metal tube from the semi-finished metal product, wherein the at least one surface is an inner surface of the metal tube; heat-treating the metal tube in a controlled environment after the forming to form a zinc-metal oxide layer within a top portion of the inner surface of the metal tube. in an additional embodiment, the metal tube is further processed after the heat-treating by pilgering or using a cold drawing process. in another embodiment, the zinc is incorporated into a metal tube that has already been formed, followed by heat treating and optional further processing after the heat-treating by pilgering or using a cold drawing process. in one embodiment, the semi-finished metal product comprises a metal that is chromium and the zinc-metal oxide formed is a zinc-chromium oxide layer. in one embodiment, the controlled environment includes the presence of hydrogen and oxygen. in another embodiment, the present invention provides a metal product having a corrosion resistant surface, comprising a finished metal product, ready for use without further processing of the metal, having a corrosion resistant layer within at least one surface of said finished metal product, wherein said corrosion resistant layer is produced by the processes described herein. for example, in one embodiment, the process includes incorporating zinc into at least one surface of a semi-finished metal product that will be exposed during use of the finished metal product produced from the semi-finished metal product, wherein the semi-finished metal product comprises a metal; forming the semi-finished metal product into a predetermined shape of the finished metal product after the incorporation of zinc; and heat-treating the semi-finished metal product in a controlled environment after the forming to form a zinc-metal oxide layer within a top portion of the at least one surface. in one embodiment, the semi-finished metal product comprises a metal that is chromium and the zinc-metal oxide formed is a zinc-chromium oxide layer. in one embodiment, the controlled environment includes the presence of hydrogen and oxygen. in an additional embodiment, the metal product comprises a tube and wherein the corrosion resistant layer is within an inner surface of the tube and wherein the tube and corrosion resistant layer have been made by the processes described herein. it should be appreciated that the present invention provides a stable corrosion resistant layer, formed during the manufacturing process of a given finished metal object or product, that is more stable and has more long-term viability than a corrosion resistant layer formed in-situ of after completion of manufacture of the finished metal object or product and it has been readied for service or use, for example, by being put in place and connected for service (e.g., a finished metal tube being connected in a process in which it will be used). accordingly, the present invention provides this more stable corrosion resistant layer by incorporating zinc into the top or upper portion of a given surface of a semi-finished metal object or product (i.e., prior to the last component manufacturing steps) to ensure that a subsequent and final heat treatment used in the manufacturing process creates zinc-metal oxide or zinc-mixed metal oxide layer and stabilized surface structure prior to use. as a result, corrosion of the underlying metal can be reduced, which may significantly increase asset reliability and plant availability and efficiency. such also reduces the effects of the release of any metals that would otherwise occur as a result of such corrosion. in a nuclear power application, where the finished metal object or product may include a tube used as steam generator tubing associated with a pressurized water reactor (pwr) or feedwater tubing or other metal surfaces (e.g., feedwater heaters) that would be exposed to reactor coolant water from a boiling water reactor (bwr), reducing the release of metals into the fluid can reduce radiation fields that otherwise may be generated elsewhere in these systems. accordingly, it should be appreciated that in some embodiments the result of the present invention provides a component surface that does not require any lengthy preconditioning period to ensure minimal corrosion and metal release, such as what is done in-situ. the present invention is widely applicable to coolant circuit component manufacturing for power plants of any chromium-containing steel or any alloy, including alloys without chromium, in particular for steam generators, heat exchangers, and moisture separators. however, it may also be employed for piping and other related components. while the emphasis is on new component manufacturing, the principles are applicable to chemically and/or physically cleaned component surfaces that are already in service, in an effort to extend life-times and reduce metal releases upon placing back into service. benefits of installing components manufactured using this process include reduced corrosion resulting in improved component performance, reliability, and lifetime; lower metal releases resulting in improved plant heath, less fouling, reduced activation, improved core performance, and fuel reliability in nuclear plants; and lower metal releases, in particular of nickel from high-nickel alloys and cobalt from steels or any other alloys, that significantly reduce the ex-core radiation fields in nuclear plants thereby lowering the collected radiation exposures (cre) to plant personnel. brief description of the several views of the drawings fig. 1 illustrates a method for manufacturing a metal product having a corrosion resistant layer according to one embodiment of the present invention; fig. 2 illustrates a method for manufacturing a metal tube having a corrosion resistant layer according to one embodiment of the present invention; fig. 3 illustrates the results of theoretical calculations showing the composition of a metal surface as a function of depth for i600 base alloy; and fig. 4 illustrates the results of theoretical calculations showing the composition of a metal surface as a function of depth for ss304 base steel. detailed description of the invention the present invention is described below with reference to the accompanying figures. while the invention will be described in conjunction with particular embodiments, it should be understood that the invention includes different embodiments and can be applied to a wide variety of applications. accordingly, the following description is exemplary and is intended to cover alternatives, modifications, and equivalents within the spirit and scope of the invention. further, the various embodiments may be described by use of the terms “preferably,” “for example,” or “in one embodiment,” but this characterization should not be viewed as limiting or as setting forth the only embodiments of the invention, as the invention encompasses other embodiments that may not be specifically recited in this description. further, the use of the terms “invention,” “present invention,” “embodiment,” and similar terms throughout this description are used broadly and are not intended to mean that the invention requires, or is limited to, any particular aspect being described in connection with one embodiment or that such description is the only manner in which the invention may be made or used. in general, the present invention is directed to a method for manufacturing a finished metal object or product having a corrosion resistant layer within a top portion of an exposed surface of the metal object or product. in other words, the corrosion resistant layer is integral to the metal object or product and extends from the surface of the metal object or product into the interior of the metal object or product. therefore, the corrosion resistant layer is the integral top portion of the metal having a given depth and where the surface is a surface that is exposed or to be exposed to a potentially corrosive or corrosive environment. accordingly, the composition of this top portion of the metal is different from the initial composition of this portion of the metal object, as it now has the composition of the corrosion resistant layer. it should be appreciated that the metal object or product that is manufactured to have the corrosion resistant layer may be composed of any metal or alloy. for example, inconel, incoloy, stainless steel, chrom-moly steel, low alloy steel, stellite/haynes alloys, hasteloys, and ultimet may be used. in some embodiments, the metal or alloy contains chromium. in other embodiments, the metal or alloy contains relatively low levels of chromium or no chromium. the corrosion resistant layer would be formed within a portion of the given metal or alloy such that a surface of the corrosion resistant layer would be the surface that would be exposed to a corrosive environment. it should be appreciated that it may not be necessary for the corrosion resistant layer to extend laterally along the entirety of the given surface of the metal object or product. in some embodiments, however, the corrosion resistant layer will be formed such that its surface is co-extensive with the entirety of that particular surface of the metal object or product. in other embodiments, the surface of the corrosion resistant layer may only extend laterally such that one portion of a given metal surface of the metal object or product does not have a corrosion resistant layer while another portion of that same surface of the metal object or product does contain a corrosion resistant layer. in one embodiment, the present invention is directed to manufacturing a finished metal object or product having a corrosion resistant layer composed of zinc-metal oxide or zinc-mixed metal oxide that is stable enough to provide long-term resistance during use of the finished metal object or product or during exposure to a corrosive environment of fluid. in one embodiment, the present invention is used to create a corrosion resistant layer composed of a stable zinc-metal oxide layer or zinc-mixed metal oxide layer within at least one surface of a finished metal object or product. it should be appreciated that the zinc-metal oxide layer includes zinc bonded to a single metal inherently present in the metal, such as chromium. it should be appreciated that the zinc-mixed metal oxide layer includes zinc bonded to more than one metal inherently present in the metal. in one embodiment, the present invention is used to create a stable zinc-chromium oxide layer within a surface of a finished metal object or product that is, for example, a nickel-iron-chromium bearing steel or any alloy containing chromium. it should be appreciated that in some embodiments, there may be an insufficient amount of chromium present to create a stable zinc-chromium oxide layer. in such cases, additional chromium may be added as described below to allow for creation of a stable zinc-chromium oxide layer. it should be appreciated that in some embodiments, other metals may be added along with the metal used to create the corrosion resistant layer. for example, in one embodiment in which zinc is used to create the corrosion resistant layer, another metal, such as chromium, may be incorporated into the metal object or product in combination with the zinc. in this embodiment, the chromium is being added to the metal object or product or infused along with the zinc, even though there may be chromium inherently present in the metal object before such addition or in cases where the metal object or product does not contain chromium. in this manner, a metal object or product may be enhanced by adding metals, in addition to the metal being added to create the corrosion resistant layer, for example, in those cases in which the metal object or product is deemed to have a deficiency of a given metal species. therefore, the addition of such metals in combination with the metal used to create the corrosion resistant layer can be used to ensure a desired composition of the top layer of the metal object or product. it should be appreciated that more than one metal can be added along with the metal used to create the corrosion resistant layer. in some embodiments, additional metals that may be incorporated include aluminum, molybdenum, titanium, zirconium, platinum, and mixtures of the foregoing. more particularly, it should be appreciated that a better corrosion resistant layer may be formed by incorporating or adding an additional metal or metals along with the metal used to in combination form the corrosion resistant layer. by adjusting the composition of the top layer of the metal object or product to provide a composition that, in combination with the incorporation of a metal specifically used to form the corrosion resistant layer, yields a more desirable composition for the corrosion resistant layer itself. for example, in cases where the metal object or product either lacks chromium or has a relatively low concentration of chromium, the incorporation or addition of chromium along with the metal specifically incorporated or added to form the corrosion resistant layer, such as zinc, acts to increase the concentration of chromium and produce the desired zinc-chromium oxide formation that provides a better corrosion resistant layer compared to the absence of chromium. in some embodiments, additional metals that may be incorporated include aluminum, molybdenum, titanium, zirconium, platinum, and mixtures of the foregoing. in one embodiment, the present invention is directed to a method of manufacturing a metal tube having a corrosion resistant layer within a top portion of its inside surface through which a corrosive fluid would flow during use of the metal tube. such a metal tube may be used, for example, as steam generator tubing associated with a pressurized water reactor (pwr) or feedwater tubing and other metal surfaces (e.g., feedwater heaters) that transport or would be exposed to reactor coolant water from a boiling water reactor (bwr). the present invention is also generally directed to a variety of finished metal objects or products having a corrosion resistant layer that has been created during the manufacturing process, as opposed to a corrosion resistant layer created or deposited on the metal surface after manufacture of the finished metal object or product has been completed. as described above, the corrosion resistant layer is formed within an upper portion of the given metal or alloy or within the surface of the given metal or alloy such that the surface of the corrosion resistant layer would be the surface that would be exposed to a corrosive environment. again, it should be appreciated that the metal object or product that is manufactured to have the corrosion resistant layer may be composed of any metal or alloy. as noted above, in one embodiment, the finished metal object or product may be a metal tube or tubing that carries a corrosive fluid. for example, the metal tubing may be used as steam generator tubing associated with a pwr or feedwater tubing and other metal surfaces that would be exposed to reactor coolant water from a bwr. the use of such tubing in a nuclear power environment is particularly important because, in addition to the damage to the tubing itself, any corrosion of the tubing leads to metals being released from the tubing into the fluid and often being deposited elsewhere in the system, such as in low-flow regions or on heat transfer surfaces causing fouling and efficiency losses. in the nuclear power industry in particular, these metallic releases may be sources for generating radiation fields external to the nuclear reactor vessel, which is otherwise to be avoided. in one embodiment, the present invention is used to create and includes a finished metal object or product that has a zinc-metal oxide layer or zinc-mixed metal oxide layer within a surface of the finished metal object or product that will be exposed to a potentially corrosive or corrosive environment or fluid. in one embodiment, the present invention is used to create a finished metal object or product from a nickel-iron-chromium bearing steel or any alloy containing chromium that has a stable zinc-chromium oxide layer within a surface of the finished metal object or product that will be exposed to a potentially corrosive or corrosive environment or fluid. in one embodiment, the present invention is used to create a finished metal object or product made from any metal or alloy, including metals or alloys that do not contain any chromium or that have insufficient amounts of chromium needed to form a stable zinc-chromium oxide or sufficient corrosion resistant layer, that has a stable zinc-chromium oxide layer within a surface of the finished metal object or product that will be exposed to a potentially corrosive or corrosive environment or fluid. following, various embodiments of the methods and products of the present invention are described in connection with the figures. it should be appreciated that use of the term “metal” is intended to be generic such that it includes any metal or alloy. further, it should be appreciated that the use of the term “semi-finished metal product” refers to any metal object that still requires further processing before being a finished metal object or product that is ready for use, or for which there is still one or more steps or processes that must be completed, such as annealing, before becoming a finished metal object or product that is ready for use or sale. for example, a semi-finished metal product includes products produced from hot metal or the products that have been casted from the hot metal or molten steel, including ingots, blooms, billets, slabs, rods, and tube rounds. once these semi-finished metal products are further processed, for example, by annealing or other steps typically taken in metal manufacturing as known to one of skill in the art, they would become finished metal products. accordingly, a “finished” metal object or product is one for which no further processing steps in the standard metal manufacturing process are required and the metal object or product is ready for use in a manner for which it is ultimately intended. it should also be appreciated that the corrosive resistant layer created by the process of the present invention is not a physically separate layer, such as a cladding that is attached to the surface of the metal object or product or an additional, separate coating applied on top of the existing surface of the metal object or product. rather, as described above, the corrosion resistant layer is created within a top portion of the metal body of the object or product itself such that the corrosion resistant layer extends from the surface into the interior of the metal object or product. the depth of the corrosion resistant layer may vary depending upon the composition of the metal object or product and the metal used to form the corrosion resistant layer, whether any additional metals are being added, and the conditions under which the corrosion resistant layer is formed. accordingly, the composition of this layer will be different than that of the underlying portion of the metal that exists below the corrosive resistant layer, the latter composition being that of the starting metal or alloy itself or that of the semi-finished metal product. for example, the corrosion resistant layer may be created by incorporation of zinc into the metal followed by oxidation to create a zinc-metal oxide layer or zinc-mixed metal oxide layer inherent in the upper portion of the metal object and, as noted, extending from the exposed outer surface of the metal to a given depth within the metal. it should also be appreciated that the composition of the corrosion resistant layer will change with depth in the metal itself. using zinc as an example, the amount of zinc that diffuses into the metal will affect that overall depth or thickness of the corrosion resistant layer. further, the concentration of zinc within the corrosion resistant layer or within the top portion of the metal itself will likely change as a function of depth within the metal. therefore, the overall composition of the corrosion resistant layer may itself change with depth within the metal itself, and the depth of the corrosion resistant layer will be different depending upon, for example, the different methods and conditions used to create the corrosion resistant layer during manufacturing (e.g., type of method used to contact the metal with zinc and the operating conditions for such method, such as temperature during contact, the composition of the base metal or alloy used, etc.). however, in one embodiment, the depth or thickness of the corrosion resistant layer can be defined as that depth within the metal for which the composition is different from the underlying composition of the metal itself prior to creation of the corrosion resistant layer or the composition of the semi-finished metal product. in one embodiment, the depth or thickness of the corrosion resistant layer can be defined as that depth within the metal having a composition that includes zinc, where zinc has been used to form the corrosion resistant layer and the initial composition of the metal object did not contain zinc. in one embodiment, the depth or thickness of the corrosion resistant layer can be defined as that depth within the metal having a composition that includes zinc-metal (e.g., zinc-chromium) or zinc-mixed metal oxide. fig. 1 illustrates a method for manufacturing a metal product having a corrosion resistant layer according to one embodiment of the present invention. in this process 100 , in a first step 102 , zinc is incorporated into at least one surface of a semi-finished metal object or product. depending upon the specific process used to diffuse zinc into the surface of the metal, zinc may be incorporated into one or more surfaces exposed to the zinc. for example, zinc may be incorporated into any surface of a semi-finished metal object or product, including large metal components as well as tubing used in heat exchangers. at a minimum, however, the zinc is incorporated into a predetermined metal surface that will, during use of the finished metal object or product, be exposed to a corrosion, or potentially corrosive, environment. it should be appreciated that the process of the present invention may be applied to any semi-finished metal object or product. in one embodiment, the semi-finished metal object or product is a nickel-iron-chromium bearing steels or any alloy, including, for example, any alloy containing chromium. in some embodiments, the semi-finished metal object or product is composed of any metal or alloy, including metals or alloys that do not contain any chromium or that have insufficient amounts of chromium needed to form a stable zinc-chromium oxide or sufficient corrosion resistant layer. the process for incorporating zinc into the metal surface may be performed using any process for incorporating metal atoms or compounds into a metal surface known in the art. for example, diffusing pack diffusion, pack cementation, chemical deposition, or vapor deposition processes may be used. the form of zinc used may be any form of zinc that will diffuse or incorporate into the metal surface and that will ultimately form a zinc-metal bond, such as a zinc-chromium oxide. for example, in one embodiment, diethyl zinc or dimethyl zinc may be used. in one embodiment, highly reactive diethyl zinc gas (or other zinc gas) can be diluted with an inert gas. the diluted diethyl zinc gas (or other zinc gas) is then brought into contact with the desired metal surface in which diffusion of zinc is desired. it should be appreciated that incorporation of zinc into the metal surface is not limited to any particular chemical or physical mechanism, such as diffusion. in other words, incorporation of a metal atom or compound into the metal surface by diffusion should not be construed as limiting the present invention to incorporation of the metal atom or compound into the metal surface specifically or exclusively by the process of diffusion. it should be appreciated that the gaseous diethyl-zinc and dimethyl-zinc may be used to manufacture metal objects or products having “depleted” zinc or zinc without the zinc 64 isotope, which can be activated and converted to zinc-65. the latter, zinc-65, is to be minimized in a nuclear power application. accordingly, it is preferable to generate the finished metal object or product with depleted zinc-64 when it will be used in a nuclear power environment. however, it should be appreciated that finished metal objects or products that will be used in other than nuclear power applications can also be generated with any zinc isotopic composition including natural zinc. at a step 104 , the semi-finished metal object or product is formed into a shape desired for the finished metal object or product. since the zinc is incorporated into a semi-finished metal object or product, it must be then formed into a shape desired for the finished metal object or product. accordingly, step 104 is forming the semi-finished metal object or product into the desired shape of the finished metal product. for example, if the finished metal product is a flat metal panel, then whatever starting semi-finished metal object or product is used, such as a metal slab, in this step 104 , that metal slab will be formed into the desired shape of the flat metal panel. the step 104 may be performed using any process known in the art for taking a semi-finished metal object or product and shaping it to place it in the shape desired for the finished metal object or product, as is typically done in metal manufacturing processes known by one of skill in the art. at the step 106 , the semi-finished metal object or product having the shape desired for the finished metal object or product is heat-treated. this heat treatment includes heating the semi-finished metal object or product as is typically done in an annealing process used in the standard manufacture of finished metal objects or products. this heat treatment is performed in a controlled environment to promote the formation of a stable zinc-metal oxide layer, such as a zinc-chromium oxide layer, or zinc-mixed metal oxide layer. for example, the controlled environment may include the presence of hydrogen and oxygen so that the incorporated zinc forms a stable zinc-metal oxide layer, such as a zinc-chromium oxide layer, within the top portion of a surface of the semi-finished metal object or product. the creation of this oxide layer provides a stable oxide layer that is more stable than oxide layers created using a finished metal object or product, such as the preconditioning performed during operational chemical exposure after manufacturing. without being limited by theory, it is believed that by incorporating zinc within a portion of the metal surface before heat-treating, the corresponding zinc-metal oxide layer extends to a greater depth or is more thick, as well as more stable and permanent, compared to any zinc oxide layer formed in-situ, in which case, the depth to which the zinc is incorporated is more shallow. as described above, it should be appreciated that one or more additional metals may be incorporated into the metal object or product along with the zinc. for example, in one embodiment in which zinc is used to create the corrosion resistant layer, another metal, such as chromium, may be added to the metal object or product in combination with the zinc. in one embodiment, the chromium is incorporated into the metal object or product in the same manner as the incorporation of the zinc. in one embodiment, the chromium is incorporated into the metal object or product at the same time as the incorporation of the zinc. it should be appreciated that any metal may be incorporated into the metal object or product with the zinc to allow for the creation of a tailored metal composition in the top portion of the metal object or product. for example, in those cases in which the metal object or product is deemed to have a deficiency of a given metal species, such metal species can be incorporated into the metal object or product, including into the top portion, along with the metal used to create the corrosion resistant layer. it should be appreciated that more than one metal can be added along with the metal used to create the corrosion resistant layer. although the foregoing has been described in the context of manufacturing the metal object or product and the benefits of forming the corrosion resistant layer during such manufacturing, in other embodiments, it is still possible to form a corrosion resistant layer for metal objects or products after manufacturing and even after such metal objects or products have been placed in use or service. in some embodiments, it is possible to form the corrosion resistant layer with the metal object or product in place or in-situ. in these situations, the metal used to form the corrosion resistant layer can be incorporated into the metal object or product in the same manner described above in with respect to fig. 1 . it should be appreciated that additional metals may also be incorporated as described above. fig. 2 illustrates a method for manufacturing a metal tube having a corrosion resistant layer according to one embodiment of the present invention. the method of manufacturing 200 is similar to that shown in fig. 1 , except that the process 200 shown in fig. 2 is specifically directed to the manufacture of metal tubing as the finished metal object or product. in a first step 202 , zinc is incorporated into at least one surface of the semi-finished metal produce, which in this embodiment is a semi-finished metal product that can be ultimately manufactured into a metal tube, such as a flat strip. the incorporation of the zinc can be performed in the same manner and using any of the same processes described above in connection with fig. 1 . it should be appreciated, however, that in this embodiment, the zinc needs to be incorporated into the top portion of the surface of the semi-finished metal product that will ultimately form the inner surface of the metal tubing. in a second step 204 , the semi-finished metal object or product, such as the flat strip, is formed into a tube (e.g., welded tube). this step is performed as is typically done in the metal manufacturing process as known to one of skill in the art. however, it should be appreciated that depending upon the process used to form the metal tube, in another embodiment, the zinc may not be incorporated into the metal surface until after the metal tube has been formed. in that case, the first step 202 of incorporating the zinc would be done after the second step 204 of forming the metal tube. in this embodiment, the metal tube (e.g. a seamless metal tube) could be formed from a semi-finished metal object or product such as an ingot or bloom or metal billet. once the metal tube is formed, then the zinc would be incorporated into the inner surface of the metal tube as described above in connection with fig. 1 . in a next step 206 , the metal tube can be optionally (as represented by the dashed lines) further processed. for example, in the case of the metal tube, it can be further processed, as known in the art, by pilgering or through use of a cold-drawing process. in a next step 208 , the metal tube is heat-treated. this process can be performed in the same manner and for the same purpose as that described in connection with fig. 1 . fig. 3 illustrates theoretical example calculations of the composition of a metal surface as a function of depth for i600 base alloy. fig. 4 illustrates theoretical example calculations of the composition of a metal surface as a function of depth for ss304 base steel. for clarity, each of these figures illustrates the concentration of various components of the metal from the exposed surface (left side of each graph) to a given depth within the metal (right side of each graph). specifically, the relative concentrations of nickel, iron, chromium, and zinc are shown individually from bottom to top of each graph, respectively. as shown, the decrease in the amount of zinc (the top component in each graph) is shown from left to right, to a depth at which there is no zinc and the composition of the metal is same as that of the starting semi-finished metal object or product prior to incorporation of zinc. it should be appreciated that figs. 3 and 4 illustrate the results of theoretical calculations for these specific metals; however, similar metals would be expected to behave similarly. various embodiments of the invention have been described above. however, it should be appreciated that alternative embodiments are possible and that the invention is not limited to the specific embodiments described above.
039-261-326-483-892	US	[ "US" ]	A42B3/04,G05B1/01	2013-01-25T00:00:00	2013	[ "A42", "G05" ]	helmet with wireless sensor using intelligent main shoulder pad	a helmet with wireless sensor system for monitoring of surrounding objects. the helmet with wireless sensor system comprises a wireless sensor transceiver with a number of patch antennas to transmit a particular signal and receive reflected signals from surrounding objects; a processing unit located in a main shoulder pad communicating through radio frequency with a helmet uses the information from reflected signal received by wireless sensor transceiver to calculate the speed, distance, and direction of the object to determine when and where an impact will occur; and a number of inflatable/deflatable pads installed on the helmet and external to the helmet that will be activated prior to an impact.	1. a helmet armed to monitor surrounding environment of the helmet, to detect an impact from an object and to activate protection comprising: inflatable pads; a transceiver mounted on a shell of the helmet to transmit a signal and detect the signal from surrounding environment comprising: a plurality of patch antennas mounted at various locations on the helmet; a switch mounted on the helmet to select the patch antennas for transmission and reception; a plurality of transmission lines to connect the switch to the patch antennas; the transceiver using the patch antennas to transmit the signal, which is a coded signal, generated in a control processor located on a shoulder pad where data information is stored; the transceiver using the patch antennas to receive the signal from surrounding environment, to detect the signal from the object in surrounding environment and send data information of the detected signal to the control processor on the shoulder pad; a radio communication device mounted on the helmet to facilitate communication of the data information of the detected signal between the transceiver and the control processor on the shoulder pad where the data information of the detected signal is processed to determine when and which inflatable pads need to be activated. 2. the helmet of claim 1 , wherein the control processor on the shoulder pad coordinates a transmit time and a receive time for the transceiver on the helmet, activates the transceiver and the switch, generates and sends the coded signal to the transceiver for transmission, receives the data information of the detected signal from the object, calculates and estimates a distance and an approaching speed of the object, and activates the inflatable pads. 3. the helmet of claim 1 , wherein the control processor on the shoulder pad uses a radio communication device on the shoulder pad to communicate with the radio communication device on the helmet. 4. the helmet of claim 1 , wherein the transceiver is connected to the plurality of patch antennas via the switch and the plurality of transmission lines using at least one of stripline line, microstrip line, or coaxial line technologies. 5. the helmet of claim 1 , wherein the inflatable pads are installed on the helmet and the shoulder pad. 6. the helmet of claim 1 , wherein the switch simultaneously connects the transceiver to one or more patch antennas. 7. the helmet of claim 1 , wherein the transceiver is time multiplexed for transmission and reception.	background a concussion is an injury to the brain. the brain does not work right for a while after a concussion. one may have problems with things like memory, balance, concentration, judgment, and coordination. the brain will need time to heal after a concussion. most will have a full recovery with the proper rest and monitoring. a concussion is caused by a sudden, violent jolt to the brain. it may be caused by: a blow to the head severe jarring or shaking—like a bad fall abruptly coming to a stop—most common in car accidents concussions most often occur with events that involve: motor vehiclesbicyclesskates, skateboards, and scooterssports and recreationfalling downfirearmsphysical violence such as assault and batterydomestic violencechild abuse traumatic brain injury or concussions occur when the head sustains a blunt and powerful force. though typically it is not the impact or bruising that causes the neurotrauma. it is the rapid motion of the head. when the head is spun violently or sent into a state of rapid acceleration followed by an abrupt stop, brain neuron functions are disrupted. in cte (chronic traumatic encephalopathy), this disruption has caused “tau” proteins—structures commonly found in neurons—to progressively amass to toxic levels and form tangled structures within the brain. as a result, electrical signaling between neurons is diminished and the brain's ability to process and retain information becomes increasingly impaired. emotional disorders such as dementia and depression may also ensue. historically, research on tbi (traumatic brain injury) and cte has focused on amateur and professional athletes. initially diagnosed in boxers who had sustained multiple concussions in the ring, cte is commonly associated with contact sports such as football, wrestling and ice hockey (in addition to boxing). now, however, researchers are making a similar association between blast neurotrauma and cte in u.s. military veterans who have served in war. over the last few years, safety concerns regarding football helmets and concussions have become a most pressing issue. safety issues in football are now ubiquitous, ranging from increased safety measures in the nfl to academics rating the best football helmets. and now legislation is spreading across america aimed at treating student-athletes with concussions. football helmet manufacturers are very aware of this, which is why they have created the most innovative and advanced helmets the sport has ever seen. helmets have radically transformed over the last 10 years into engineering marvels. the drive to minimize head injuries in sports is stronger than ever, especially in football. the nfl, recognizing the importance, has put stricter player-safety rules and policies in place—but technology is catching up to offer preventive methods to combat the issue. as described above, traumatic brain injury or concussions occur when the head sustains a blunt and powerful force that results in violent spun of the head or sending the head into a state of rapid acceleration followed by an abrupt stop. when this happen brain neuron functions are disrupted. helmets are useful as safety gear to prevent brain injuries in an uncontrolled environment. if one can't prevent a crash or impact, but knows it will occur, a helmet can prevent or minimize injury to the head and brain. no helmet can protect against all possible impacts, and the impact may exceed the helmet's protection. no helmet protects any part of the body that it does not cover, so even if the head injury is minimized one may have a smashed face, broken bones or worse. standards define laboratory tests for helmets that are matched to the use intended. if a helmet can pass the tests for a sport or activity, it provides adequate impact protection. a construction helmet will not pass the more severe bicycle helmet tests. a bicycle helmet will not pass the more severe motorcycle helmet tests. none of them provides the protection against shrapnel that is required of a military helmet. standards also define other tests for such parameters as strap strength, shell configuration, visor attachments, and the head coverage that must be provided, depending on the activity. helmets designed to handle major crash energy generally contain a layer of absorbable pad. when one crashes and hit a hard object, the pad part of a helmet crushes, controlling the crash energy and extending the head's stopping time by about few thousandths of a second to reduce the peak impact to the brain. rotational forces and internal strains are likely to be reduced by the crushing. thicker pad is better, giving the head more room and milliseconds to stop. if the pad is 15 mm thick it obviously has to stop you in half the distance of a 30 mm thick pad. basic laws of physics result in more force to the brain if the stopping distance is shorter, whatever the “miracle” pad may be. less dense pad can be better as well, since it can crush in a lesser impact, but it has to be thicker in order to avoid crushing down and “bottoming out” in a harder impact. the ideal “rate sensitive” pad would tune itself for the impact, stiffening up for a hard one and yielding more in a more moderate hit. if the helmet is very thick, the outer circumference of the head is in effect extended. if the helmet then does not skid on the crash surface, that will wrench the head more, contributing to strain on the neck and possibly to rotational forces on the brain. in short, there are always tradeoffs, and a super-thick helmet will probably not be optimal. it will also fail on consumer acceptance. if there are squishy fitting pads inside the helmet they are there for comfort, not impact. the impact is so hard and sharp that squishy pad just bottoms out immediately. in most helmets a smooth plastic skin holds the helmet's pad together as it crushes and helps it skid easily on the crash surface, rather than jerking your head to a stop. in activities that involve forward speed on rough pavement, rounder helmets are safer, since they skid more easily. the straps keep the helmet on the head during the crash sequence. a helmet must fit well and be level on the head for the whole head to remain covered after that first impact. brief description of the drawings fig. 1 illustrates an embodiment of a wireless sensing system with intelligent shoulder pad. fig. 2 illustrate embodiments of a helmet with wireless sensing sensor. fig. 3 illustrates embodiment s of a method for minimizing and protecting the head movement using a wireless sensing system. the drawings referred to in this description should be understood as not being drawn to scale except if specifically noted. description of embodiments reference will now be made in detail to embodiments of the present technology, examples of which are illustrated in the accompanying drawings. while the technology will be described in conjunction with various embodiment(s), it will be understood that they are not intended to limit the present technology to these embodiments. on the contrary, the present technology is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the various embodiments as defined by the appended claims. furthermore, in the following description of embodiments, numerous specific details are set forth in order to provide a thorough understanding of the present technology. however, the present technology may be practiced without these specific details. in other instances, well known methods, procedures, components, and circuits have not been described in detail as not to unnecessarily obscure aspects of the present embodiments. fig. 1 depicts an embodiment of wireless sensing system 100 . in general, wireless sensing system 100 facilitates in the providing of information, to a processing unit (p-u) 104 , from radio unit 109 , radio unit 110 , wireless sensor (w-s) 107 through a switch (sw) 103 and patch antenna (p-a) 102 1 - 102 k . for example, processing unit 104 requests information from the wireless sensor 107 through radio units 109 and 110 . in response to the request, wireless sensor 107 through switch 103 , transmission lines 108 1 - 108 k and patch antennas 102 1 - 102 k provides the requested information to the processing unit 104 using radio units 109 and 110 . in various embodiments, the wireless sensor 107 provides raw information such as but not limited to, distance of objects 101 1 - 101 n from patch antennas 102 1 - 102 k , speed of objects 101 1 - 101 n towards patch antenna 102 1 - 102 k . it should be appreciated that wireless system 100 is time division multiplexed. wireless sensor system 100 includes, among other things, processing unit 104 , radio units 109 and 110 , switch 103 , wireless sensor 107 , transmission line 108 1 - 108 k , patch antenna 102 1 - 102 k , helmet pads (h-p) 105 1 - 105 i , shoulder pads (s-p) 106 1 - 106 j , and objects 101 1 - 101 n . in one embodiment, radio unit 109 , switch 103 , wireless sensor 107 , transmission lines 108 1 - 108 k and patch antenna 102 1 - 102 k are components of wireless system 100 that could reside on the helmet and these components provides activation signal to the helmet pads 105 1 - 105 i . for example, helmet pad 105 2 , through wireless system 100 , is activated to provide protection. in various embodiments, the pads can be helmet pads that are attached to helmet or pads that are attached to shoulder pad. in one embodiment processing unit 104 , radio unit 110 and shoulder pads 106 1 - 106 j are components of wireless system 100 that could reside on the shoulder pad. processing unit 104 provides activation signal to shoulder pads and communicate with helmet using radio unit 110 . processing unit 104 is for processing information received from wireless sensor 107 through radio units 109 and 110 , switch 103 , transmission lines 108 1 - 108 k and patch antenna 102 1 - 102 k . processing unit 104 typically utilizes appropriate hardware and software algorithm to properly process the information. in one embodiment, the helmet 111 communicates with main shoulder pad 112 wirelessly using rf transceivers 109 , and 110 . for example, helmet pad 105 2 is activated from processing unit 104 using rf transceiver 109 . wireless sensor can be any wireless transceiver that is able to wirelessly transmit communication signals, such as short coded pulses. wireless sensor is disposed on any physical platform that is conductive to effectively transmit the signals. for example, is disposed on inner shell of a helmet. in various embodiments, all communication to and from the wireless sensor 107 passes through the switch 103 . for example, the switch 103 through processing unit 104 radio units 109 and 110 is configured to communicate through transmission lines 108 1 - 108 k to one of the patch antenna 102 1 - 102 k only for a specified period of time. for example, processing unit 104 requests information from the wireless sensor 107 through radio units 109 and 110 by configuring switch 103 to communicate through transmission line 108 1 with patch antenna 102 1 . the request is received by the wireless sensor 107 is in form or an activation signal for a specified period of time. upon receipt of activation signal, the wireless sensor 107 transmits signals through switch 103 , transmission lines 108 1 - 108 k and patch antenna 102 1 - 102 k to surrounding objects 101 1 - 101 n . a portion of transmitted signal reflects from objects 101 1 - 101 n . the reflected signals from objects 101 1 - 101 n are received by wireless sensor 107 through patch antennas 102 1 - 102 k and switch 103 and then sent to processing unit 104 through radio units 109 and 110 . in particular the processing unit 104 receives the information (in the form of reflected signal from objects 101 1 - 101 n ) via wireless sensor 107 . in one embodiment, communications through wireless network 100 are selected by switch 103 . switch 103 can be, but is not limited to, a one to k port switch. in general switch 103 at any specified period of time connects processing unit 104 and wireless sensor 107 to one of patch antenna 102 1 - 102 k . it is commonly used as transmitter or receiver between processing unit 104 and patch antenna 102 1 - 102 k . in one embodiment, communication between processing unit 104 and wireless transceiver 107 is done wirelessly by radio units 109 and 110 . wireless units 109 and 110 can be, but are not limited to rf transceivers. in general rf transceivers 109 and 110 transmit data information from processing unit 104 to wireless transceiver 107 and control information to helmet pads 105 1 - 105 i . in one embodiment, communication through wireless network 100 is transmitted by one of patch antenna 102 1 - 102 k . in general at any specified period of time one of the patch antennas 102 1 - 102 k is selected by switch 103 for transmission and reception. each one of patch antennas 102 1 - 102 k can comprise of one transmit and one receive antenna. transmit and receive patch antennas are physically separated to provide sufficient isolation between transmit and receive patch antennas. in one embodiment, communication through wireless network 100 is transmitted by one of patch antenna 102 1 - 102 k . in general at any specified period of time one of the patch antennas 102 1 - 102 k is selected by switch 103 for transmission and reception. each one of patch antennas 102 1 - 102 k can comprise of one antenna only. transmit and receive selection is performed by wireless transceiver 107 . processing unit 104 has a variety of functions. in general, processing unit 104 is utilized for signal processing, calculation, estimation, activities, methods, procedures, and tools that pertain to the operation, administration, maintenance, and provisioning of wireless sensor network. in one embodiment, processing unit 104 includes a database that is used for various applications. the database can be utilized for analyzing statistics in real-time. such statistics can be related to number of impacts, severity of impacts, number of helmet pads and shoulder pads, and any other available statistics. processing unit 104 also has a variety of thresholds, such as, but not limited to, distance of object before helmet pads activation, distance of object before shoulder pads activation, wireless sensor activation time, distance before any impact, pulse signal width, etc. in general, processing unit 104 provides controls to various components that are connected to it. moreover, processing unit 104 is a high capacity communication facility that connects primary nodes. in one embodiment, received information from wireless sensor 107 is used in processing unit 104 . as such, processing unit 104 will utilize the received information to calculate the distance, speed and direction of object 101 1 - 101 n . the processing unit 104 then uses the calculated information and various thresholds stored in its data base to activate one of the helmet pads 105 1 - 105 i and/or one of the shoulder pads 106 1 - 106 j before an impact occurs. in one embodiment the processing unit 104 activates one or more of helmet pads 105 1 - 105 i and shoulder pads 106 1 - 106 j . both helmet pads 105 1 - 105 i and shoulder pads 106 1 - 106 j are inflatable/deflatable pads, pillows and elastic bands to prevent rotational acceleration, by stiffening the movement of the head through stabilization technique just before impact. both helmet pads 105 1 - 105 i and shoulder pads 106 1 - 106 j will also act as a shock absorber when at impact, making them reducing the impact as well as rotational acceleration. in one embodiment the wireless sensor 107 is a transceiver that periodically switches between transmission and reception. during transmission a signal is transmitted and during the reception period the reflected signals from the objects 101 1 - 101 n are received. the received signal by patch antennas 102 1 - 102 k , transmission lines 108 1 - 108 k , is then sent to processing unit 104 through, wireless sensor 107 , switch 103 , and radio units 109 and 110 for further processing. in one embodiment the wireless sensor 107 is microwave, or milimetric wave transceiver. the wireless sensor 107 could be connected to the switch 103 via a transmission line. in one embodiment wireless sensor 107 is controlled by processing unit 104 . the processing unit 104 controls transmit pulse width and number of times a pulse is transmitted by wireless sensor 107 . processing unit 104 also coordinates the transmit time and receive time period for the wireless sensor 107 . in one embodiment wireless sensor 107 is connected to patch antenna 102 1 - 102 k through switch 103 and transmission lines 108 1 - 108 k . the transmission lines 108 1 - 108 k are coaxial, micro strip, or strip lines. fig. 2 depicts an embodiment of helmet wireless sensor system 200 comprising of a helmet 111 and main shoulder pad 112 . in one embodiment, helmet wireless system 200 comprises of an intelligent wireless sensing system 100 as shown in fig. 1 . in general, helmet wireless system 200 is configured for facilitating in the monitoring/detection of possible collision by any object. in particular, helmet wireless system 200 is able to process a high volume of data and control various pads to minimize the effect of collision impact. in one embodiment helmet wireless system 200 is capable of providing protection that requires for all sorts of collision impacts. in one embodiment, helmet wireless sensor 200 is implemented in line with wireless sensor system 100 . in another embodiment, pluralities of patch antennas are disposed at various locations in wireless sensor system 100 for facilitating in the monitoring/detection of a possible impact. helmet 111 includes radio unit 109 , switch 103 , wireless transceiver 107 , transmission lines 108 1 - 108 k , patch antenna 102 1 - 102 k , and helmet pads 105 1 - 105 i . main shoulder pad 112 includes processing unit 104 , radio unit 109 , and shoulder pads 106 1 - 106 j . the processing unit 104 on main shoulder pad 112 communicate with shoulder pads 106 - 106 j . a physical connection between processing unit 104 and shoulder pads 106 - 106 j wilt facilitate this communication. in one embodiment, the processing unit 104 on main shoulder pad 112 communicates with helmet pads 105 1 - 105 i . wireless connection using radio units 109 and 110 between main shoulder pad 112 and helmet 111 facilitate this communication. in one embodiment, the processing unit 104 on main shoulder pad 112 communicates with helmet wireless transceiver 107 . wireless connection using radio units 109 and 110 between main shoulder pad 112 and helmet 111 facilitate this communication. in one embodiment the patch antenna 102 1 - 102 k are installed at location on helmet to provide most effective information for processing unit 104 . processing unit 104 will use this information to estimate location, speed and direction of objects with high accuracy the helmet pads 105 1 - 105 i are installed at locations on helmet 111 to provide the most effective protection from an impact. processing unit 104 will activate one or more of the helmet pads 105 1 - 105 i prior to impact once a potential impact is detected. the shoulder pads 106 1 - 106 j are installed at locations on main shoulder pad 112 to provide the most effective protection from an impact. processing unit 104 will activate one or more of the shoulder pads 106 1 - 106 j prior to impact once a potential impact is detected. processing unit 104 is configured to receive the pertinent information and to determine whether the helmet is going to experience a possible impact from an external object based at least in part on the pertinent information provided by the wireless sensor 107 . for example, processing unit 104 executes an algorithm (e.g., impact determination algorithm) that utilizes the pertinent information to determine whether or not an external object 101 1 - 101 n is approaching the helmet wireless sensor 200 . in various embodiments, processing unit 104 is a multicore cpu, dsp, or fpga. fig. 3 depicts an embodiment of helmet wireless system 300 . in one embodiment, helmet wireless system 300 is similar to helmet wireless system 200 . for instance, helmet wireless system 300 includes main shoulder pad 112 and helmet 111 . in one embodiment, helmet wireless system 300 shows a scenario after an impact from an external object. for example helmet wireless system 300 shows activation of some of the helmet pads 105 1 - 105 i , and some of shoulder pads 106 1 - 106 j . in one embodiment, helmet wireless system 300 shows a scenario after an impact from an external object. for example helmet wireless system 300 shows activation of some of the helmet pads 105 1 - 105 i . one of the helmet pads 105 3 is activated and inflated to absorb the impact force. in one embodiment, helmet wireless system 300 shows a scenario after an impact from an external object. for example helmet wireless system 300 shows activation of some of the helmet pads 105 1 - 105 i . helmet wireless system 300 shows activation of helmet pad 105 1 to hold head steady and avoid any violent movement of head. in one embodiment, helmet wireless system 300 shows a scenario after an impact from an external object. for example helmet wireless system 300 shows activation of some of the shoulder pads 106 1 - 106 j . helmet wireless system 300 shows activation of helmet pads 106 1 , and 106 2 to hold head steady and avoid any violent movement of head. various embodiments are thus described. while particular embodiments have been described, it should be appreciated that the embodiments should not be construed as limited by such description, but rather construed according to the following claims.
040-195-280-442-608	AU	[ "WO" ]	A45C13/36,A45C3/00	2014-03-24T00:00:00	2014	[ "A45" ]	a bag	a bag (1) including body portion (18a) defining an interior space (11), and a sole (20) fastened to the portion.	claims 1. a bag including a portion defining an interior space; and a sole fastened to the portion. 2. the bag of claim 1 wherein the sole is at least predominantly formed of resiliently deformable material. 3. the bag of claim 2 wherein the sole is at least predominantly formed of rubber. 4. the bag of any one of claims 1 to 3 wherein the sole is at least predominantly integrally formed. 5. the bag of any one of claims 1 to 4 wherein the sole is bonded to the portion. 6. the bag of any one of claims 1 to 5 wherein the sole is vulcanised to the portion. 7. the bag of claim 6 wherein vulcanising rubber is interposed between the sole and the portion to vulcanise the sole to the portion. 8. the bag of any one of claims 1 to 7 wherein at least one portion of a periphery of the sole extends upwardly to tolerate scuffing. 9. the bag of claim 8 wherein the bag is in plan longer than it is wide and the sole has upwardly extending ends. 10. the bag of claim 8 wherein in substance the entire periphery of the sole extends upwardly to tolerate scuffing. 11. the bag of claim 8 wherein in substance the entire periphery of the sole extends upwardly to tolerate scuffing; the bag is in plan longer than it is wide; and the sole has ends upwardly extending beyond other portions of the periphery of the sole. 12. the bag of any one of claims 8 to 1 1 wherein the upwardly extending portions are shaped to cup the portion to shield the portion from scuffing. 13. the bag of any one of clams 1 to 12 being configured to stand upright on a horizontal planar surface. 14. the bag of any one of claims 1 to 13 wherein the sole downwardly presents a textured gripping surface. 15. the bag of claim 14 wherein the gripping surface includes parallel ridges. 16. the bag of any one of claims 14 to 15 wherein the sole has at least one tapered edge. 17. the bag of any one of claims 1 to 16 including at least one carry handle. 18. the bag of any one of claims 1 to 17 including at least one shoulder strap. 19. the bag of any one of claims 1 to 18 having a volume of at least 2l. 20. a method of manufacturing a bag including fastening a sole to a portion for defining an interior space. 21. the method of claim 20 wherein the fastening is bonding. 22. the method of claim 20 wherein the fastening is vulcanising. 23. the method of claim 22 wherein the vulcanising includes interposing, between the sole and the portion, vulcanising rubber.	a bag field the invention relates to bags. background a bag is a flexible container for carrying things. by way of example, many carry a handbag to conveniently store and transport a wide assortment of small items required for everyday life. as some bags can become one's almost constant companion through life, it is important that such bags be robust and practical and also be aesthetically pleasing. indeed many regard the aesthetics of certain types of bags as critically important. a wide assortment of bags has been developed to suit a vast array of purposes and individual preferences. nonetheless, the present inventors have recognised various deficiencies in existing bag design. some existing leather bags are formed of pliable leather that is sufficiently rigid, and otherwise configured, so that the bag can stand upright on a horizontal planar surface to attractively display the bag. over time the "ground"-contacting portions of the bag, and the adjacent lower portions of its side walls, become worn. scratches and scuff marks, immediately detracting from the aesthetics of the bag, may first become apparent. with ongoing wear, the leather can become more pliable such that the bag is no longer able to neatly stand upright. in the extreme, holes may be worn through the leather. bags formed of fabric tend to be more scuff and scratch resistant but more inclined to accumulate dirt. the mentioned lower portions of the bag are typically first to accumulate dirt. accumulated dirt of course detracts from the aesthetics of the bag. the invention aims to provide improvements in and for bags, or at least to provide an alternative for those concerned with bags. it is not admitted that any of the information in this patent specification is common general knowledge, or that the person skilled in the art could be reasonably expected to ascertain or understand it, regard it as relevant or combine it in any way at the priority date. summary in a first aspect, the invention provides a bag including a portion defining an interior space; and a sole fastened to the portion. the sole is preferably at least predominantly formed of resiliently deformable material such as rubber, and is most preferably at least predominantly integrally formed. the sole may be bonded to the portion. most preferably the sole is vulcanised to the portion. optionally vulcanising rubber is interposed between the sole and the portion to vulcanise the sole to the portion. preferably at least one portion of a periphery of the sole extends upwardly to tolerate scuffing. by way of example, if the bag is in plan longer than it is wide, the sole preferably has upwardly extending ends. the entire periphery of the sole may extend upwardly to tolerate scuffing. preferably in substance the entire periphery of the sole extends upwardly to tolerate scuffing; the bag is in plan longer than it is wide; and the sole has ends upwardly extending beyond other portions of the periphery of the sole. the upwardly extending portions are preferably shaped to cup the portion to shield the portion from scuffing. preferably the bag is in plan at least twice as long as it is wide. preferred forms of the bag are configured to stand upright on a horizontal planar surface. the sole may downwardly present a textured gripping surface, which gripping surface preferably includes parallel ridges. the sole may have at least one tapered edge. the bag may have at least one carry handle and/or at least one shoulder strap. preferably the bag has a volume of at least 2l. another aspect of the invention provides a method of manufacturing a bag including fastening, e.g. bonding, a sole to a portion for defining an interior space. preferably the fastening is vulcanising. optionally the vulcanising includes interposing, between the sole and the portion, vulcanising rubber. brief description of drawings the figures illustrate various non-limiting examples of bags and details thereof. figure 1 is a front view of a bag. figure 2 is a rear view of the bag of figure 1. figure 3 is an end view of the bag of figure 1. figure 4a is a perspective view of a sole of the bag of figure 1. figure 4b is a front view of the sole of figure 4a. figure 4c is a bottom view of the sole of figure 4a. figure 5 is a schematic vertical transverse cross-section view of the bag of figure 1. figure 6 is a front view of another bag. figure 7 is an elevation of an internal side face of the bag of figure 6. figure 8 is an elevation of a rear internal face of the bag of figure 6. figure 9 is an elevation of a front internal face of the bag of figure 6. figure 10 is a front view of an assortment of bags. description of embodiments figure 1 shows an exemplary bag 1 including a body 10, sole 20, carry handle 30 and a shoulder strap 40. the body 10 defines an interior space 1 1 (figure 5) for carrying personal items such as a wallet, keys, mobile phone, etc. as best illustrated in figure 5, the body 10 has a multi-layered construction. heavy canvas 12 defines an outer layer. a fusing layer 13 followed by an internal lining 14 lie inwardly of the outer canvas 12. the fusing layer 13 is a fusing interface serving to mutually bond the layers 12, 14. the layers 12, 13, 14 are together pliable sheet material and are shaped to define a vessel, in the form of body portion 18a, encompassing the volume 1 1 and being upwardly open at opening 19. a similar composite layer, or web, 12, 13, 14 extends upwardly from a rear face of the body 18a to define a flap 18b which in its free condition overlies the opening 19 and a front 12a, 12b of the body 18a. in doing so, the flap 18b closes the opening 19. other forms of pliable sheet material are contemplated. the flap 18b is suitably weighted so that in its free condition it lies substantially flat against the front 12a, 12b. in this example the flap 18b is weighted by the addition of an additional layer 16 of heavy canvas overlying the internal lining 14. the layer 16 overlies about two thirds of the flap 18b and is positioned adjacent the flap's free "end" (which end is at the top of figure 5 but is at the bottom of the flap 18b when the flap is hanging downwardly in its free condition). the flap 18b is trimmed with 3 mm cord piping 17 captured within a return fold running along the free end of the flap 18b from end to end of the bag. the outer canvas 12 of the body 18a is formed of front panels 12a, 12b. as will be appreciated from the figures, the body 18a is longer than it is wide, and approximately rectangular, when viewed in plan (see for example figure 4c). it is also approximately rectangular in its front and side elevations (see for example figures 1 and 3). in front and side elevation the extremities of the bag upwardly converge at a shallow angle. for example in figure 3 the side edges of the panel 12c upwardly converge. in the same view it is apparent that the panels are shaped for the front and rear panels to bulge outwardly beyond the edges of the panel 12c. likewise figures 1 and 2 show that the side panels 12c and 12d are shaped to bulge outwardly beyond their edges. the four upright seams towards the end of the bag may carry corded piping. the panel 12a has a vertical edge at which it is fastened to the panel 12b and an upright but slightly inclined edge at which it is bonded to the end panel 12d. panel 12b is a mirror image of the panel 12a including an upright but slightly inclined edge at which it is fastened to the panel 12c. the rear panels 12e, 12f are of similar construction to the front panels 12a, 12b. in this example, adjacent ones of the panels 12a to 12f are mutually fastened by split stitched seams. as best illustrated in figure 2, a horizontal row of double stitching fastens the rear panels 12e, 12f to the flap 18b and also to the handle 30. a pair of bar tacks 12h at each end of the handle serve to reinforce this attachment. in this example the seam 12g is a 3 mm two-needle topstitch seam. the carry handle 30 is in substance about 38 cm long. strap 40 is in substance about 125 cm long by about 5 cm wide. each end of the strap 40 is finished with a respective metal cap 41. metal caps 41 are convenient locations to display indicia such as branding information. the strap 40 attaches to the end panels 12c, 12d of the bag with the aid of a pair of buckles 42. in this example the buckles are slider buckles, each consisting of an integrally formed body defining three vertically spaced horizontal bars. each buckle 42 is attached to its one of the end panels 12c, 12d via a loop of suitable fabric capturing its central bar and being suitably stitched to its end panel. each end of the strap 40 is then woven through a respective one of the buckles 42. as illustrated in figure 1 , the strap 40 may be sleeved with a suitable shoulder pad 43. returning to figure 5, in this example of the bag, the lower extent of the outer canvas 12 wraps around to underlie the interior space 1 1. a foam layer 15 and an additional layer of heavy canvas 16 are interposed between these underlying portions of the canvas 12 and the internal lining 14. the layer 15 serves to provide a padded base of the bag. the layer 16 is inwards (on top of) the layer 15. the periphery 16a of the layer 16 is contoured, its highest portions being at the ends of the bag. this contour is complementary to a contour of the sole 20 whereby the periphery 16a is a constant about 5 cm above a periphery of the sole 20 as suggested by dimensions a and b in figure 1. turning to figure 4a, the sole 20 is an integral body of rubber including a side wall 21 and a planar base 22. the side wall 21 encircles and extends upwardly from the base 22. the sole 20 and canvas 12 mutually conform such that the sole 20 is shaped to cup the lower portions of the body 18a. in this example the base 22 is ovoid when viewed in plan and a constant about 6 mm thick. the upper and lower surfaces of the wall 21 tangentially join the upper and lower surfaces of the base 22 and then outwardly converge such that the thickness of the side wall tapers from about 6 mm thick adjacent base 22 down to about 0.5 mm thick at its peripheral edge 20a. the variable thickness of the sole 20 and in particular the thickness reducing in directions approaching its edges allows for a thick and durable ground-engaging portion without an obtrusive step about the periphery of the sole 20. desirably sole 20 is formed of a resilient material so as to be impact resistant and provide a pleasing sound and feel when placing the bag on a ground surface. desirably the peripheral edge 20a is a continuous smooth edge formed of tangentially connected line and curve segments and free of angular corners. end portions 21a, 21 b of the wall 21 (i.e. the portions at the ends of the bag's long horizontal axis) are higher than its side portions 21 c, 21 d. in this example the end portions rise to about 55 mm above a ground surface (dimension c) and the side walls 21 c, 21 d rise to about 12 mm above the ground surface (dimension d). in preferred forms of the bag the sole 20 downwardly presents a high friction surface. this is another measure enhancing the feel of the bag when placing the bag onto a ground surface. by way of example, when placing the bag onto a shiny table top, the high friction surface of the sole serves to prevent the noise and sensation of sliding and scratching. the sole may be formed of various materials which are inherently high friction, e.g. soft rubber, and/or include textural elements for enhanced gripping. this example of the bag includes textural elements in the form of parallel ridges. the ridges extend across, and are spaced along, the bag. the ridges are very fine line ridges being about 0.5 mm thick by about 0.5 mm deep. the sole is another convenient location to present information. in this example a trade mark 23 is moulded into the base 22. the sole 20 is shaped to bear the brunt of scuffing and day to day impacts. in particular the ends 21 a, 21 b extend upwardly to define the lower portions of the ends of the bag, which portions have been recognised by the present inventors as being particularly prone to scuffing. in this example, the sole 20 shields underlying pliable material 12, 13, 14 from scuffing, although in other examples this pliable material may not underlie the sole. by way of example a suitable edge of a tube like body of pliable material may be bonded to the edge 20a. for the avoidance of doubt such a tube like body defines an interior space as this wording is used herein. in this example of the bag, the sole is fastened to the portion 18a. various modes of fastening are contemplated. for the avoidance of doubt, "fastened" and similar terms as used herein require a positive fastening act. by way of example, "a being fastened to b" typically does not take in "a being integrally formed with b", although a may be fastened to b by welding so as to form a common integral body of material. in preferred forms of the bag, the sole 20 is vulcanised to the body 18a. vulcanisation is a form of bonding. at least preferred forms of vulcanisation avoid the need for stitching and are more durable than stitching. optionally, vulcanising rubber, and more preferably a layer of vulcanising rubber, is interposed between the sole 20 and the canvas 12 of the body 18a. vulcanising rubber is any glue or adhesive suitable for vulcanisation. figures 6 to 9 illustrate an alternate bag differing from the bag of figure 1 by the omission of handle 30 and strap 40 and in internal details. the internal surface of the flap 18b is trimmed with a curved line of heavy chain stitching running from end to end of the bag. the same internal surface also carries a pair of mutually spaced elasticised bands 14b for retaining a pen or pencil. cut out pocket 14k exposing an inner lining opens from a top edge of the front of the bag. the pocket 14k is stitched through to an outer. figures 7, 8 and 9 are elevations of the internal panels at an end, the rear and the front of the bag. the panels are rivet overlaid to the underlying material. the internal end carries a pocket 14c formed of flexible fabric loosely overlying a lining and having an elasticised binding 14d running across its horizontal top edge. the pocket 14c carries a foldaway shopping bag. the rear internal face of the bag carries a further elasticised band 14e and a zippered pocket 14f. the band 14e runs horizontally and, like the bands 14b, is bar-tacked at its ends and adapted to accommodate a pen or pencil. in this example, the zippered pocket is purse shaped. the pocket 14f is trapezoid in shape when viewed in elevation, being about 25 cm wide at its base by about 12 cm high by about 19 cm wide at its zippered top. the pocket 14f is formed of pliable sheet material and includes gathering at its top to give fullness. the horizontal opening of a further pocket 14g runs from end to end of the bag and across the top of the pocket 14f. the pocket 14g is defined by two close fitting layers which are separable such that sheets of paper and other thin objects can be conveniently received between the layers. one of the layers carries the pocket 14f. behind the other of the two layers is a layer of foam in the vicinity of 2 mm thick to enhance the feel of the bag. the pocket 14g is a full depth pocket span in substance covering the entire rear internal face of the bag. the forward internal face of the bag includes a further thin pocket 14h which is relevantly similar to the pocket 14g. from this face pocket 14i is presented to the interior of the bag. pocket 14i is rectangular when viewed in elevation, being in the vicinity of 10 cm wide by about 14 cm high. the pocket 14i is defined by a rectangular web of material suitably stitched along its base and sides to the backing material such that the pocket is upwardly open. the upper vertices of the pocket, i.e. the vertices at each end of the pocket's opening, are attached to the backing material with suitable bar tacks. the preferred materials are as follows: material description specifications required finishes fabric a (outer) 100% cotton 18 oz (510 g) / m 2 waxed finish for canvas waterproofing fabric b (lining) 100% cotton 8 oz (227 g) / m 2 silicon finish for canvas soft hand feel material description specifications required finishes fabric c (purse 100% polyester 75-83 g / m 2 satin finish pocket lining) poplin lining fabric d (foldaway 100% nylon ripstop light weight shopping bag) rubber sole moulded sole vulcanised to base of bag slider buckle slider buckle for marine grade to fit matt nickel finish strap 4.8 cm wide strap metal strap / belt metal end for bag marine grade to fit matt nickel finish end strap 4.8 cm wide strap whilst various examples of the invention have been described, the invention is not limited to details of the described examples. as suggested in figure 10, the invention may be embodied in bags of various shapes and sizes.
042-490-358-506-224	US	[ "WO" ]	G06Q10/02,G06Q10/0631,G06F9/54,G06Q10/00,G06Q10/10	2021-09-07T00:00:00	2021	[ "G06" ]	systems and methods for event organizing and attending ecosystem	the present disclosure relates to a novel and advantageous system and method for event organizing and attending. in particular, the present disclosure relates to an event system including a user module, an organizer module, and an administrator module. the event system is usable by an event organizer to plan an event, book a venue, offer merchandise, and offer ticketing. the event system is usable by a user to receive recommendations about events, to buy tickets to events, and to organize a group of people to attend events and communicate about and at the event.	what is claimed is: 1. a system for event organizing and attending, the system comprising: a user api server and a user interface associated with the user api server; an admin server; an event organizer api server and an event organizer interface associated with the event organizer api server; a cloud server linked to each of the user api server, the admin server, and the event organizer api; and at least one task algorithm associated with the cloud server, wherein the at least one task algorithm includes an event recommender task algorithm, wherein the event recommender task algorithm uses data from a user and data about an event to make an event recommendation to a user based on a percent match. 2. the system of claim 1, wherein the event recommender task algorithm uses event data from an event organizer and regional data to make event hosting recommendations based on a likelihood of success. 3. the system of claim 1, wherein the at least one task algorithm further comprises an event archiver schedule task algorithm and a web scraper schedule task algorithm. 4. a method for making recommendations to a user, wherein the user is an event goer: receiving user preferences regarding events; developing a user profile based on the received user preferences; comparing the user preferences against event data for an event; calculating a percent match between the user profile and the event; presenting the percent match to the user. 5. the method of claim 4, further comprising refining the user profile based on events attended by the user. 6. the method of claim 4, further comprising calculating percent matches between friend user profiles and the event and presenting the percent matches to the user. 7. the method of claim 6, wherein the user invites friends to the event based on the percent match of the friend user profile and the event. 8. the method of claim 7, wherein friends who accept an invitation from the user are grouped into an event group. 9. the method of claim 8, wherein the user sets a meet time for the event group. 10. the method of claim 9, further comprising sending a notification to members of the event group. 11. the method of claim 10, wherein the notification is sent when a member purchases a ticket to the event. 12. the method of claim 10, wherein the notification is sent when a member arrives at the event. 13. the method of claim 4, further comprising identifying upcoming events, comparing the user preferences against event data for the upcoming events, and sending notifications to the user with recommendations for certain upcoming events. 14. the method of claim 10, wherein the certain upcoming events are selected based on calculating a percent match between the user profile and each event and choosing the certain events based on events that exceed a threshold percent match. 15. a method for making recommendations to a user, wherein the user is an event organizer: receiving proposed event details for a proposed event; comparing the proposed event details against existing event details of scheduled events; calculating a percent likelihood of success of the proposed event; and presenting the percent likelihood of success to the event organizer. 16. the method of claim 15, wherein the proposed event details comprise the type of event. 17. the method of claim 16, wherein the proposed event details further comprise at least one of a date, time, and region 18. the method of claim 15, further comprising evaluating alternative event details for the proposed event, calculating a percent likelihood of success based on the alternative event details, and presenting at least one alternative recommendation for the event. 19. the method of claim 18, wherein the at least one alternative recommendation is made based on exceeding a threshold percent likelihood of success. 20. the method of claim 15, further comprising providing analytics regarding the event after the event takes place.	systems and methods for event organizing and attending ecosystem cross-reference to related applications [001] the present application claims priority to the u.s. provisional application no. 63/241,528, entitled systems and methods for event organizing and attending ecosystem, and filed 07 september 2021, the content which is hereby incorporated by reference in its entirety field of the invention [002] the present disclosure relates to a novel and advantageous system and method for event organizing and attending. in particular, the present disclosure relates to an event system including a user module, an organizer module, and an administrator module. the event system is usable by an event organizer to plan an event, book a venue, offer merchandise, and offer ticketing. the event system is usable by a user to receive recommendations about events, to buy tickets to events, and to organize a group of people to attend events and communicate about and at the event. background of the invention [003] the background description provided herein is for the purpose of generally presenting the context of the disclosure. work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure. [004] many events occur on any given night in any given city. no easy means exist for finding all events that may be interesting to a user. further, no comprehensive system exists for finding events, receiving recommendations to events, inviting others to events, buying tickets to the events, and rating events. [005] as an event organizer, it can be difficult to anticipate likely success of an event. factors that go into success include how many other similar events are in a given region. currently, no means exist for an event organizer to evaluate likelihood of success of an event and get recommendations for increasing the likelihood of success for an event. [006] a need exists for a system for event planning for attendees and organizers. brief summary of the invention [007] the following presents a simplified summary of one or more embodiments of the present disclosure in order to provide a basic understanding of such embodiments. this summary is not an extensive overview of all contemplated embodiments, and is intended to neither identify key or critical elements of all embodiments, nor delineate the scope of any or all embodiments. [008] in one embodiment, a system for event organizing and attending is provided. the system may comprise a user api server and a user interface associated with the user api server, an admin server, an event organizer api server and an event organizer interface associated with the event organizer api server, and a cloud server linked to each of the user api server, the admin server, and the event organizer api. a least one task algorithm may be associated with the cloud server, wherein the at least one task algorithm includes an event recommender task algorithm, wherein the event recommender task algorithm uses data from a user and data about an event to make an event recommendation to a user based on a percent match. the event recommender task algorithm may use event data from an event organizer and regional data to make event hosting recommendations based on a likelihood of success. the at least one task algorithm may further comprise an event archiver schedule task algorithm and a web scraper schedule task algorithm. [009] in another embodiment, a method for making recommendations to user, wherein the user is an event goer, is provided. the method may comprise receiving user preferences regarding events, developing a user profile based on the received user preferences, comparing the user preferences against event data for an event, calculating a percent match between the user profile and the event, and presenting the percent match to the event goer. the method may further comprise refining the user profile based on events attended by the user. [010] the method may further comprise calculating percent matches between friend user profiles and the event and presenting the percent matches to the user, wherein the user may invite friends to the event based on the percent match of the friend user profile and the event. in some embodiments, friends who accept an invitation form the user are grouped into an event group. the user may set a meet time for the event. the method may further comprise sending a notification to members of the event group. the notification may be sent when a member purchases a ticket to the event and/or when a member arrives at the event. [oh] in some embodiments, the method may further comprise identifying upcoming events, comparing the user preferences against event data for the upcoming events, and sending notifications to the user with recommendations for certain upcoming events. the certain upcoming events may be selected based on calculating a percent match between the user profile and each event and choosing the certain events based on events that exceed a threshold percent match. [012] in a further embodiment, a method for making recommendations to a user, wherein the user is an event organizer, is provided. the method may comprise receiving proposed event details for a proposed event, comparing the proposed event details against existing event details of scheduled events, calculating a percent likelihood of success of the proposed event, and presenting the percent likelihood of success to the event organizer. the proposed event details may include the type of event, date, time, and/or region. the method may further comprise evaluating alternative event details for the proposed event, calculating a percent likelihood of success based on the alternative event details, and presenting at least one alternative recommendation for the event. the at least one alternative recommendation may be made based on exceeding a threshold percent likelihood of success. the method may further comprise providing analytics regarding the event after the event takes place. [013] in yet another embodiment, computer-readable storage medium containing program instructions for a method for making recommendations to an event goer and making recommendations to an event organizer, wherein execution of the program instructions by one or more processors of a computer system causes the one or more processors to perform steps, may be provided. the steps may comprise, for making recommendations to an event goer, receiving user preferences regarding events, comparing the user preferences against event data for an event, calculating a percent match between the user preferences and the event data, and presenting the percent match to the event goer. the steps may further comprise, for making recommendations to an event organizer, receiving proposed event details for a proposed event, the proposed event details including date, time, and region, comparing the proposed event details against existing event details of scheduled events, calculating a percent likelihood of success of the proposed event, and presenting the percent likelihood of success to the event organizer. [014] while multiple embodiments are disclosed, still other embodiments of the present disclosure will become apparent to those skilled in the art from the following detailed description, which shows and describes illustrative embodiments of the invention. as will be realized, the various embodiments of the present disclosure are capable of modifications in various obvious aspects, all without departing from the spirit and scope of the present disclosure. accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not restrictive. brief description of the drawings [015] while the specification concludes with claims particularly pointing out and distinctly claiming the subject matter that is regarded as forming the various embodiments of the present disclosure, it is believed that the invention will be better understood from the following description taken in conjunction with the accompanying figures, in which: [016] figure la illustrates a flow chart of how a user uses the event system, in accordance with one embodiment. [017] figure lb lb illustrates a flow chart of how users can use the event system in conjunction with a third party app, in accordance with one embodiment. [018] figure 2a illustrates a flow chart of group creation and use in the event system, in accordance with one embodiment. [019] figure 2b illustrates a flow chart of group creation and use for a specific event, in accordance with one embodiment. [020] figure 3a illustrates a flow chart of how an event organizer uses the event system, in accordance with one embodiment. [021] figure 3b illustrate a flow chart of how an event organizer uses the event system, in accordance with one embodiment. [022] figure 4 illustrates a block diagram of an exemplary event system, in accordance with one embodiment. [023] figure 5 illustrates a confidence circle of a user display, in accordance with one embodiment. [024] figure 6a illustrates a search screen overlaying a map of an area, in accordance with one embodiment. [025] figure 6b illustrates a result screen of a search for a keyword, in accordance with one embodiment. [026] figure 7 illustrates pins that may be provided on a map, in accordance with one embodiment. [027] figure 8 illustrates a map with pins, in accordance with one embodiment. [028] figure 9 illustrates an event card, in accordance with one embodiment. [029] figure 10 illustrates a friend selection screen, in accordance with one embodiment. [030] figure 11 illustrates an invitation screen, in accordance with one embodiment. [031] figure 12 illustrates a group event details screen, in accordance with one embodiment. [032] figure 13 illustrates an upcoming events screen, in accordance with one embodiment. [033] figure 14 illustrates a flow chart of the event system being used as a total ticket centralization system. detailed description [034] the present disclosure relates to a novel and advantageous system and method for event organizing and attending. in particular, the present disclosure relates to an event system including a user module, an organizer module, and an administrator module. an event database is linked to each of the user module, the organizer module, and the administrator module. a plurality of algorithms are provided for use within one or more of the modules. the event system is usable by an event organizer to plan an event, book a venue, and offer ticketing. the event system is usable by a user to receive recommendations about events, to buy tickets to events, and to organize a group of people to attend events and communicate about and at the event. in some embodiments, the event system may work with another system, such as a dating system, for facilitating connection between two users based on interests in similar types of events. in general, recommendations may be made based on events exceeding a threshold percentage match to a event attendee or based on event exceeding a threshold percent likelihood of success for an event organizer. the threshold percentage match or the threshold percent likelihood of success may be set by the user. [035] user experience [036] a user may use the event system to find events that they may be interested in attending. figure la illustrates a flow chart 10 of how a user uses the event system. in general, the event system provides event recommendations to a user based on the user’s likes, habits, and ratings. the event system enables a user to form groups for events and to form those groups based on the rating given by the system to potential group members for certain types of events. [037] the user signs up with the event system 12 to receive event recommendations, purchase event tickets, calendar events, and coordinate event attendance with friends. the event system may be configured to provide event recommendations to the user based on user preferences. signing up for the system thus generally includes inputting event preferences 14. this may be done, for example, by filling out one or more “this-or-thaf ’ questionnaires or surveys. [038] a this-or-that survey narrows in on preferences of a user by asking a series of questions, wherein the questions may change as the user provides answers, or wherein the questions may be static. for example, a this-or-that survey may start with a question such as “do you prefer music events or non-music events?”. the next question may be, for example, “do you prefer rock concerts or classical performances?” or “do you prefer stand-up comedy or plays?”. the system can process the this-or-that answers to develop a ranking of types of events for the user. the system can further use the this-or-that answers to develop a “percent match” of an event to a user, discussed more fully below. [039] in other embodiments, a user may input their event preferences 14 to the event system in any suitable manner. for example, the event system may provide a questionnaire, a this-or-that question list, or other. in one embodiment, a user is prompted to choose at least x of y keywords associated with events they may like. for example, a user may be prompted to choose at least 5 of 20 keywords with events they may like - such as rock, opera, art festival, football, etc. in another embodiment, a user chooses types of events they like (concerts, theater, sporting events) and then may be prompted to select categories within those events (rock, alt, pop; drama, comedy; football, baseball, basketball, hockey). in another embodiment, as discussed above, the user proceeds through a this-or-that question list where the user goes through a series of choices and chooses their preference of two options in each choice. based on the questionnaire, the question list, or any other data source regarding user preference, the event system builds an initial profile for the user that is used by a user side event recommendation algorithm. this profile may be updated automatically, such as by machine learning, as the user uses the system. such updating may be continuous or may be periodic at set intervals or at random intervals. alternatively, the profile may be manually updated if the user indicates they want to change aspects of their profile. [040] to sign up with the event system, the user may sign up directly or may sign up with a third party app such as a social media app or a dating app. when signing up with the event system, regardless of how the user signs up with the event system, the user may download an event app to their phone or mobile device. the event app of the event system may be referred to as the nrby app. in some embodiments, when interfacing with the event system, the user may use the event app. in alternative embodiments, the user may interface with an event website or through other interface. [041] if signing up through a third party app, the user may be prompted to give the event system access to identifying information, such as name and email, and friend lists. the friend list may be used to populate one or more friend lists in the event system (described more fully below). if signing up directly with the event system, the user may be prompted to input identifying information, such as name and email, and to input friend information for building one or more friend lists in the event system. [042] using the event system, the user has the option of building a friend list 16. the user can build a friend list in order to, for example, see events their friends are interested in, to invite friends to events, and/or to coordinate groups for an event. the friend list may be built automatically by the system by importing a friend list from a third party app. this friend list may be limited to friends on the friend list from the third party app having the event system downloaded. the friend list may be built manually be the user by inviting friends to register on the event system. further, the friend list may be built automatically and supplemented manually. in general, the friend list may be modified by the user at any time. further, the user may have the option of blocking certain other users from seeing the user or the user’s preferences on the event app. [043] the event system can be used to make recommendations to the user based on their profile and, optionally, within a geographical area. the user can request recommendations based on specific details. for example, the user can input a date range and a geographical area for a recommendation. regarding geographical area, a user may select a temporary region (for example a region to which they may be travelling) or may select their home region (based on their home address or preferred central point). alternatively, the event system may automatically generate a geographical area. in one embodiment, to automatically determine geographical area, the system may calculate the region that is closest to the user given their latitude and longitude. [044] the event system queries the event database for events having a threshold level of matching with the user’s profile, in the date range, and in the geographical area. a percentage may be calculated with each event indicating the likelihood that the user will be interested in the event - referred to as a percent match. such calculation may be done based on user preferences, user past activity, or other factors. [045] events in which the user may be interested are displayed to the user. the user thus receives event recommendations 18 from the system. in some embodiments, this may be limited to types of events that the user has said they are interested in. the event display can show the percent match for each event. this may be done by showing a confidence circle (discussed below). the percent match is based on the alignment of the user preferences with the event details and is indicative of the likelihood that the user will be interested in the event. the user display is discussed below with respect to the user module. [046] in addition to event recommendations, the system may be configured such that a user receives notifications 20 with event recommendations for upcoming or imminent events. for example, the system may be configured to send notifications with a user’s top rated events that are happening in an upcoming weekend, or on a user’s preferred/available day of the week. [047] the user may like events (thus optimizing their event preferences) and/or may purchase tickets to events 22. if interested in an event, the user may calendar the event within the system or pushed to an outside calendar app. if the user decides to attend an event, the user can purchase tickets, either directly through the event system or through redirection to a third party ticket vendor. any events for which tickets are purchased may be added to the user’s calendar. [048] a user may be prompted to purchase merchandise (or other items additional to the ticket) within the event system, if listed as available by the event organizer, as described more fully below. such prompt may be upon buying the ticket, upon creation of a group for that event (if the event cost is $0), or upon selecting attending (if the event cost is $0). [049] orders can be made by users instantly through the event system. merchandise listings may include, but are not limited to, pictures, descriptions, and cost. in one embodiment, payment processing occurs through event system and customer order information including shipping details are sent to the fulfillment center for processing. orders may be shipped out directly to the users from the distribution facility. [050] after attending an event, a user is prompted to rate the event 24. that rating may be used by the user side recommendation algorithm to further refine the user’s profile. [051] the user can also access a listing of events that their friend(s) are going to. the user can recommend events to their friend(s) and their friend(s) may recommend events to them. the user can select through the events (listed as friends attending or recommend by a friend) and purchase tickets to the event through the event system or through redirection to a third party ticket vendor. [052] figure lb illustrates a flow chart 30 of how users can use the event system in conjunction with a third party app such as a dating app in order to facilitate pairing of users. more specifically, the event system may be integrated with third parties via api calls. in general, the event system provides event recommendations to a user based on the user’s likes, habits, and ratings and these can be used to find common interests among users. [053] a user, for example user 1 , signs up with the event system 32. the event system may be configured to provide event recommendations to the user based on user preferences. signing up for the system thus generally includes inputting event preferences 34. this may be done, for example, by filling out one or more “this-or-that” questionnaires or surveys. in general, the user may input their event preferences to the event system in any suitable manner. based on the questionnaire, the question list, or any other data source regarding user preference, the event system builds an initial profile for the user 36. this profile may be updated automatically, such as by machine learning, as the user uses the system. such updating may be continuous or may be periodic at set intervals or at random intervals. alternatively, the profile may be manually updated if the user indicates they want to change aspects of their profile. [054] user 1 can choose the profile of someone with whom they would like to match 38, user 2. if user 2 is on the third party app but does not have an event system profile, user 2 is prompted to create a profile in the event system (including by inputting event preferences) 40. [055] when user 1 and user 2 each have event system profiles, the event system can provide recommendations 42 to either user for events that they both may be interested. in some embodiments, the recommendations may be limited to parameters input by one of the users. for example, the user may specify a potential date and time for meeting and the event system may provide recommendations only on that date at that time. alternatively, the user may select a type of event, such as music only events, and the event system may provide recommendations based on the type of event (and any other input parameters). the recommendations can take into account the percent match for the event with each user and provide a list of events that have the highest overlapping percent match and meet all requested parameters. [056] the user then chooses their top choice(s) and these are sent to the other user 44 for confirmation. for example, user 1 may ask for event recommendations, select their top choices, and send the top choices to user 2. user 2 is then prompted to confirm one of the events. user 2 may alternatively indicate they are not interested in any user l’s top choices and/or may suggest one or more other events. different event options may be suggested back and forth until a confirmation occurs 46 (or the users decide not to meet). [057] upon confirmation, the users are prompted to indicate that they are attending the event. mutual attending status is returned via api to the event system and/or within the third party system. upon confirmation of attendance, normal notification flow occurs 48 for both users as described with respect to figure 2. [058] group experience [059] figures 2a and 2b illustrate flow charts 50, 60 for group creation and use in the event system. groups can be created for a specific event (e.g., for a specific concert) and exist only for that event. groups can alternatively be created for a type of event and (e.g., for all outdoor country festivals in a region). [060] figure 2a illustrates a flowchart 50 of an overarching scheme for forming a group to use within the event system. a user selects friends to invite to a group 52. the user sends invitations to friends 54 to join the group. messages can be sent within the group 56. in some embodiments, any group member may send messages; in other embodiments only the founding group member or a select set of group members may send messages. members can leave the group and/or the group can be disbanded 58 after an event or at any other time. [061] when selecting friends to invite to a group, the user can see the friend’s percent matches for various events. in some embodiments, a user may form a group for a specific event. this may be referred to as an event group. in some embodiments, a user may form a group and then the event system may make recommendations of events based on the percent matches of all the uses in the group. this may be referred to as a freeform group. in forming an event group, a user may select an event and then may view friends who may be interested in that event. from those friends, the user may choose which friends to invite to the event group. [062] in forming a freeform group, a user may select a plurality of friends and then see recommendations of events that those friends may like. this may include a group rating score for each event. from those events, the user may choose an event. [063] the user sends invitations to friends to j oin the group. once in the group, friends may send messages within the group about events or other. the event system may be configured to send push notifications to the group members. such notifications may include, for example, that a new user has joined the group (by accepting an invitation), that a member has purchased ticket(s) to the event, that a member has arrived at the event, that a message has been sent to the group, the notification that a member has purchased tickets to the event may include how many tickets were purchased to help inform other members of whether they need to purchase a ticket or whether the member has purchased tickets for the group. [064] users can leave the group and/or the group can be disbanded (for example if the friend group was created for a specific event). [065] figure 2b illustrates an embodiment of group creation and use for a specific event. as an initial step, a user selects an event 62 for which a group is being created. the user then selects friends for possible inclusion in the group 64. upon selection, the system displays the ratings of the event for each friend. more specifically, the user can see the friend’s percent match for the selected event 66 - the percentage likelihood that the friend will like or dislike that specific event. [066] the user can view the event start time and set a group meeting time 68 (before or after the event start time). [067] to form a group, a user selects friends to invite 70 and sends invitations to the selected friends to join the group 72. the invitation may include the group meeting time or the group meeting time may be agreed upon after the group is formed. in some embodiments, a friend may not be able to join multiple groups for a single event. the friend can then accept or decline the invitation. in some embodiments, a friend who accepts the invitation and becomes a group member can send invitations to their friends. [068] once the group is formed and friends have accepted invitations and thus j oined the group, the members of the group can message one another in the event system app 74. in some embodiments, any group member may send messages; in other embodiments only the founding group member or a select set of group members may send messages. [069] the event system may be configured to send push notifications to the group members. in some embodiments, only the founding group member can see such notifications, in other embodiments all or some subset group members may see such notifications. [070] a notification may be sent when a friend confirms attendance status for an event. more specifically, a status of “attending” or “not attending” may be shown within the group. group members can see the notification when a friend confirms attendance 76. a notification may be sent when a friend has purchased ticket(s) to the event (if the event is ticketed). the notification that a member has purchased tickets to the event may include how many tickets were purchased to help inform other members of whether they need to purchase a ticket or whether the member has purchased tickets for the group. such purchase notification may be shown within the group. a notification may be sent when a friend arrives at the event, with the notification being shown generally within the group. group members can see the notification when a friend confirms arrives at the event 78. [071] a member can choose to leave the group at any time. 79 for event specific groups, the group may be set to automatically disband at a time period after the event. [072] event organizer experience [073] an event organizer (sometimes referred to as an event host or event planner) may use the event system to create events that can be recommended to users. it is to be appreciated that the term “event organizer” or “planner” can refer to a venue. more specifically, venue booking availability may be provided through the system such that a venue, as an event organizer, can show other event organizers availability for renting their space(s). figures 3a and 3b illustrate flow charts 80, 81 of how an event organizer uses the event system. the event organizer may use a web portal to interface with the event system. like steps of flow charts 80 and 81 have the same element number. [074] the event organizer creates an event. creating an event may comprise, for example, inputting event parameters 82. event parameters may include region, venue, type of event, keywords for event, date of event, time of event, and user requirements (e.g. over 21). [075] during creation of the event, the event system may provide recommendations regarding the event 84 using an event organizer side recommendation algorithm. these recommendations may include a likelihood of success percentage. the likelihood of success percentage reflects the likelihood that the event will be well attended. the event organizer can change event parameters to evaluate whether changing one or more parameters will increase the likelihood of success percentage. it is to be appreciated that what comprises a “success” level may vary based on the type of event. this may be a sliding scale based on how many other events are happening, market demographics, event types already occurring in a set time period, etc. in some embodiments, an event organizer can select a region and a date and request a recommendation for the type of event that has the highest likelihood of success percentage. [076] in further embodiments, and as shown in figure 3b, an event organizer can receive alternative recommendations 86 with other locations, dates, keywords, or event types that have a calculated potential success score. more specifically, the event system may run through various locations, dates, keywords, and event types to give recommendations that have a calculated potential success core. in such embodiments, the event organizer can input the desired potential success / likelihood of success percentage and the event system will output parameters for events that are most likely to give that potential success. [077] the event organizer must specify at least one ticketing option for the event 88. the ticket options can include, for example, any combination of (1) free admission, (2) tickets that are $0 to a specified capacity, (3) tickets that are greater than $0 in price. the event system may make, and the event organizer may receive, ticket and pricing recommendations 90 for events based on location, date, keywords, and/or event type. [078] the event organizer may restrict access to tickets to a specified date and time. this may be done, for example, to prevent unauthorized ticket resale. logistical restriction may be done in any suitable way. for example, the tickets may be sent to a user via a qr code that directs to a url that is not live until the specified date and time. alternatively, an email may be sent to a user indicating that their live ticket email will be sent at the specified date and time and then a live ticket email sent at that time. in general, any way of providing a ticket link that goes live at the specified date and time may be used. [079] after creation of the event, including selection of all event parameters and input of at least one ticketing option, the event organizer can finalize the event 92. upon finalization of an event, the event is visible to users on, for example, a mobile app, and any ticket options that exist are accessible. [080] the event organizer can create event planning groups 94, also referred to as event organizing groups. members of the planning groups assist the event organizer in organizing and putting on an event. the event organizer can associate a planning group with an event 96. any person can be invited to be part of the planning group and can be assigned different permissions or assignments within the planning group. in some embodiments the planning group may be exclusive to one event, in other embodiments, the planning group may be associated with multiple events. for example, an event organizer may have region specific event groups - such as a minneapolis planning group - and a region specific planning group may be associated to all events that the event organizer plans in that region. [081] the event organizer may include a merchandise offering. for example, the event organizer may list merchandise that may be purchased at the time of ticket sale. the merchandise may be chosen to be shipped to the user or to be picked up at the venue. the user may further have the option of purchasing the merchandise through the event planning system after the ticket sale. [082] more specifically, event organizers are able to directly list merchandise for users to purchase in the event system with fulfillment being done through event system or contracted third-party partners. merchandise may be shipped from a central distribution facility. such merchandise may be sent to the central distribution by the event organizer or by a merchandise manufacturer. [083] in general, an event organizer may select an option where users are able to pay in advance for anything additional to event tickets, such as any items from wearable goods, to food and drink vouchers, parking permits, etc. [084] order fulfillment may be done in any suitable way and generally can be based on the preference of the event organizer. the merchandise can be shipped before the event starts, after the event is finished, or user can pick up the item(s) at the event. [085] after creation of an event, the event organizer can use the event system to book a venue, described more fully below with respect to the event organizer module. [086] after an event has been published, an event organizer may view analytics regarding the event 98. these analytics may include existing event ticket purchase including number of tickets purchased, revenue earned, estimated payout, fees charged to customers, etc. [087] before or after an event, an event organizer may be provided with the option for directed in-app promotions 99 to users with high ratings for the event or for similar events. in general, event organizers may have access to ratings for events for existing users based on the user’s profile and event preferences. the event organizer thus can target in-app promotions to users who have, for example, a desired percent match (for example over 50%) for an event. [088] system [089] figure 4 illustrates a block diagram of an exemplary event system 100, in accordance with one embodiment. as shown, the system may include three servers: a mobile api server 102 (user server), an admin website server 104 (administrator server), and a web portal api server 106 (event organizer server). each of these servers may be associated with a user interface. for example, the mobile api server 102 may be associated with a mobile app 108 which a user may use to access the event system 100. the admin website server 104 may be associated with an admin website 110 user interface which an admin may use to access the event system 100. the web portal api server 106 may be associated with a web portal user interface 112 which an event organizer can use to access the event system 100. [090] each of the mobile api server 102, the admin website server 104, and the web portal api server 106 may be linked to a cloud server 114 for storing data. in the embodiment shown, the cloud server 114 works with task algorithms. these task algorithms may include an event archiver schedule task algorithm 116, a web scraper schedule task algorithm 118, and an event recommender task algorithm 120. the algorithms may be schedule to run on a schedule such as once daily and send data back to the cloud server, which can be pushed to the respective server. [091] in some embodiments, a third party api may be provided. a third party mobile app user interface and/or a third party website user interface may be provided associated with the third party api. the third party api may be linked to the cloud server 114 [092] user module [093] the user module is the module used by a user interested in going to events. the user module may include, for example, a mobile app. a user interface is associated with the user module for facilitating user use of the user module. [094] user display [095] in one embodiment, the user’s primary interface is a map of the area around them. the user receives recommended events (or can set the event system to show all events) as pins on a map. there are a series of cards that can be scrolled through to cycle between the visible pins. these cards may be expanded to provide more details about the event. [096] events on the map may display a confidence circle, as shown in figure 5. figure 1 illustrates a screenshot showing a map 132 and a confidence circle 134. as shown, the confidence circle reflects the percent match of the user to the event. in figure 5, the percent match is 50% and the circle is filled in to a half circle. this half circle may be green, indicating a likely match. in a percent match of 25%, the circle is filled in to a quarter circle and may be red, indicating not a likely match. in other embodiments, a thumbs up (optionally green), for example for a 50% or more percent match, and a thumbs down (optionally red), for example for a less than 50% percent match, may be shown. [097] figure 6a illustrates a search screen 136 overlaying a map 132 of an area. as shown, various events are shown as pins 138. a user can search by venue, event title, event type, keyword, or other. figure 6b illustrates a result screen 140 of a search for the keyword “dance” and including an event card 142 for a result. in the embodiment shown, the event card includes the percent match 144 (25% in the example), the event title 146, the event date 148, and a cost indicator 150. the venue and time 152 are shown on the map 132. [098] figure 7 illustrates a map screen 156 showing pins 138 that may be provided on a map 132, in accordance with one embodiment. as shown, the pins may include an outer color a, and inner color b, and an event indicator c. the outer color a may correspond to timing of the event. for example, an outer green pin may indicate the event is happening now, an outer red pin may indicate that the event is happening in less than two hours, and an outer black pin may indicate that an event is happening in more than two hours. this example gives color codings for relatively immediate events (such as if a user is looking for an event to attend that day). the user may alternatively select color coding for future events where an outer green pin indicates that an event is happening in the next week, an outer red pin may indicate that an event is happening in the next month, and an outer black pin indicates that an event is happening in more than a month. the inner color b of the pin is a visual indicator of the percent match of the event to the user. [099] figure 8 illustrates screen 158 showing a map 132 with pins 138, in accordance with one embodiment. as discussed above with respect to figure 7, the outer color corresponds to timing of the event and may be selected to reflect immediate timing or future timing. the inner color of the pin is a visual indicator of the percent match of the event to the user. green may indicate a percent match of 50% or more and red may indicate a percent match of less than 50%. the inner ring may further correspond to a confidence circle, described with respect to figure 5, and the color may be illustrates along a percentage of the circle. the event indicator may be provided generally central to the pin and may reflect the type of event - such as theater, sports, concert, etc. [0100] figure 9 illustrates a screen 160 including a map 132, a date for events 162, pins 138 with events occurring on that date, and an event card 142 for a selected event on that date, in accordance with one embodiment. as shown, the event card 142 may include the event name 146, an image associated with the event 164, the start time 149 of the event, the percent match 144 for the event, and a price indicator 150 for the event. the venue 164 for the event may be shown on the map 132. in some embodiments, the event card may give the user an option to see further details 168 and/or to invite others 166 to the event. [0101] figure 10 illustrates a friend invitation screen 170. as shown, the user is presented with a list of friends 172 and their percent matches 174 with the event being viewed. a user can select friends from the list and/or can search 176 for a specific friend(s) to invite. [0102] figure 11 illustrates a meet time invitation screen 180. upon selection of what friends to invite to the event (described with respect to figure 2a), a user may be prompted to select a time 182 for the group to meet. the meet time invitation screen may include details about the event and/or about the group. in the example shown, the meet time invitation screen indicates how many people are in the group 184 and what time the event starts at 186. [0103] figure 12 illustrates a group event details screen 190. as shown, the group event details screen 190 shows a meeting time 192 and a list of friends 194. the list of friends includes an indication of whether each friend is attending 196 and whether each friend has arrived 198. [0104] returning to the event card, in some embodiments the user may be presented with ticket buy options in the expanded version of each event card. the user can choose how many of each ticket they want to purchase. once they have made their selection, the user can go to a preview order screen. the preview order screen previews total costs including ticket prices, service fees, sales tax, processing fees (for example, stripe processing fee) and the total cost. the user can choose to checkout, which results in the finalized order. [0105] if the order is greater than $0 (it may be $0 for free events), the user will be prompted to enter payment information and will be charged via a payment processing system (such as the stripe payment system). once the payment is successfully process, the payment processing system sends a payment status update to the event system and the event is set to a successful state. access information is created for the user to access the tickets. for example, a qr code may be generated. [0106] if the order is $0, the event is automatically set to a successful state and access information is created for the user to access the tickets. for example, a qr code may be generated. access to the qr code, or to the tickets through the qr code, may be date and time restricted (described more fully above). if date and time restricted, the user may be given information about accessing their tickets at that time. [0107] once tickets are purchased, the user can view their ticket access information through a tickets button visible on the expanded event card. [0108] users can send tickets directly to other members, for example, members of a group, by pressing a “share ticket” button under ticketing. in one embodiment, a share ticket menu opens and the user can either send the ticket to a member or can text the ticket out. [0109] figure 13 illustrates an upcoming events screen 200. a list of upcoming events 202 can be automatically generated. for example, a list of events on a weekend may be generated the preceding wednesday. a user can be prompted to rate the event with a thumbs up 204 or a thumbs down 206 to further optimize the user’s event preferences. [0110] recommendation engine - user side [0111] the event system includes a user side recommendation engine. the user side recommendation engine runs an algorithm to process event data and user profile data (such as preferences and history) to generate a percent match / make recommendations of events to users. this algorithm is associated with the event recommender scheduled task. [0112] in one embodiment, the recommendation engine is a single console application that runs, for example, once daily. the recommendation may be configured to use free machine learning developed by microsoft, or other machine learning or machine learning algorithms. the machine learning model is trained using a user’s past event associations (attendance or marked interest). keywords associated with these events and the users rating of the event are metrics that may be fed into the machine learning model for training it to make recommendations. [0113] once the model is trained, the algorithm is applied to all upcoming events to generate a percent match for the user for all events. the percent match is based on the alignment of the user preferences with the event details and is indicative of the likelihood that the user will be interested in the event. upon generation of the percent match, the percent match is saved to the database and viewable by a user. thus, when a user views an event, they can see their percent match for it. in some embodiments, events that have a percent match above a certain threshold may be highlighted to the user. [0114] organizer module [0115] the organizer module is the module used by an event creator. the organizer module may include, for example, a web portal and a web portal user interface. [0116] organizer user display [0117] the organizer module may comprise a web portal that the event organizer interfaces with in order to create and save an event. [0118] administrators of the web portal may change any data and have their own series of dashboard to manage web portal data that is not accessible to users and event organizers. [0119] venue booking sub-module [0120] the event system includes a venue booking sub-module to help connect venues with available space and event organizers who need to rent space to hold an event. when a venue uses the web portal (associated with the event organizer module) to list and sell tickets, they give the event system access to their full event calendar. the event system can be prompted to bulk select all other days without a scheduled event and list them for rent in the web portal. the venue is able to set the price they are willing to book the space for and this information is displayed in the web portal for event organizers to view. the event organizer can then request to book the venue. when an event organizer makes such request in the event system, the event system alerts the venue and requests a confirmation. after confirmation, payment may be done between the event organizer and the venue or through event system. [0121] recommendation engine - organizer side [0122] the event system includes a organizer side recommendation engine. the organizer side recommendation engine runs an algorithm to process event data against proposed events being planned by the event organizer to generate a percent likelihood of success. the likelihood of success percentage reflects the likelihood that the event will be well attended. this algorithm is associated with the event recommender scheduled task. [0123] in one embodiment, the recommendation engine is a single console application that runs, for example, once daily. the recommendation may be configured to use free machine learning developed by microsoft, or other machine learning or machine learning algorithms. the machine learning model is trained using a consolidated list of crawled events and the events listed directly on the event system (by event organizers). it also may use time/date associated with each event, keywords associated with each event, the number of events in a region for a category (the more of the same event category, the less likely any one event will be successful due to limits on available people/audience within the region), event revenue of this type of event against other parameters. the algorithm analyzes event system user data to determine projected attendance for a given date to other events. the algorithm further analyzes existing proprietary event data for number of attendees per event based on day of week or time of day. these metrics may be fed into the machine learning model for training it to output a percent likelihood of success and/or make recommendations [0124] once the model is trained, the algorithm is applied to all upcoming events to generate a likelihood of success and/or recommendation for an event organizer based on what days of the week and time of day would be more advantageous for specific keywords and event categories. in some embodiments, the category and event keywords drive the algorithm analysis. once the recommendations are generated, they are saved to the event database and can be used at any time. once saved to the event database, the event organizer scheduling an event is able to see what their percent likelihood of success for the specific parameters is and/or a time/date recommendation for an event having a specific category and venue. [0125] in some embodiments, a web scraper may be used to collect the number of sold tickets to an event, the number of available tickets to an event, the total amount of venue max capacity space (both used and unused for a specific date and time), and trending social media tags for a specific venue and/or a specific event. the event system can use the total ticket sales purchased through the event system and compare that against the total active user base in a region. based on this, the event system is able to guide predictive success scores for event organizers and venues by calculating the potential available event goer userbase. the event system can cross reference applicable data points to help guide an accurate predictive success score. [0126] administrator module [0127] the administrator module is the module used by an administrator of the event planning system. the administrator module may include, for example, an admin website, a web scraper, an event database, and an admin website user interface. [0128] spider [0129] the administrator module includes a web scraper, referred to as a spider, for finding events. the spider can be set to look at individual regions and find events in that region to populate to an event database. for each region, the spider is configured as a different spider location. the spider may have configuration settings that target specific event details from external data sources. external data sources may include, for example eventbrite™, meetup™, etc. [0130] to create a new spider location, configurations from an existing spider location may be copied to a new spider location that shares the same event field targeting information. spider locations with the same event field targeting information may be grouped together so bulk edit operations can be performed on a plurality of spider locations upon updating a of a single spider location in a group. [0131] migrations can be performed between test and production environments so that a configuration that is changed or added in a test database can be migrated to a production database (or vice versa). spider locations can be tested via the admin website using a lightweight version of the web scraper code to verify that a data source passes validation. [0132] each different region for each web scraper location (spider location) may have its own console application. in general, regions are defined as central event hubs. for example, a region may be a metropolitan area. in one embodiment, each region gets a new instance of the web scraper application activated by a daily scheduled task. once the web scraper is run, the event system gets all spider locations configurations for the run region and consumes events from the associated data sources. [0133] in some situations, events may be culled directly from a third party api rather than through scraping. for example, for major third party ticket vendors, such as ticketmaster™ and stubhub™, [0134] events are uploaded to an event database. in some embodiments, before an event is uploaded to the event database, it has to pass a series of validations. parallel programming may be used to process multiple events at once to increase the web scraper’s efficiency. once events are uploaded to the event database, they are viewable by users. [0135] in some situations, events may be removed from the event database and archived, for example on a separate storage medium. for example, if an event occurring in the future was added to the event database based on a first web scraping and then is not present in a second web scraping, the event may be removed from the event database. further, events that have passed that have no user connection (meaning that no users expressed interest in the event or purchased tickets to the event), the event may be archived to a separate storage meeting. events that occur in the past are also archived. [0136] validation [0137] the event system may have validation algorithms, such as an event validation algorithm and an event organizer validation algorithm. [0138] an event validation algorithm validates an event before it is added to the event database. this may include such as validating the event name, date/time, address, venue, etc. such event validation may be applied to events that are web scraped by a location spider and to events that are generated by an event organizer on the event system. [0139] an event organizer validation algorithm validates an event organizer before the event organizer is elevated to event organizer within the event system. event organizer validation may be done to confirm that the event organizer is a legitimate event organizer and, upon such validation, events hosted by the event organizer may be shown to the user as validated events. event validation may be done by an event organizer validation algorithm. validation may be done through various means including, but not limited to, business ein verification, direct referrals, confirmed event hosting history, etc. [0140] total ticket centralization system [0141] figure 14 illustrates a flow chart of the event system being used as a total ticket centralization system. as shown, a user finds an event on the event app 212 and wants to purchase a ticket for the event 214. tickets being sold through an external system may be consolidated by the event system for offering to the user. [0142] in such situation, the event system may have preset needed user requirements for ticket purchase from each external ticket source (backend). the event system displays ticket options 216 to the user, which may be based in part on the preset needed user requirements. the user selects a ticket(s) for purchase 218, for example in real time. the user purchases the ticket(s) from the event system 220 (frontend). this may be done by entering payment information and personal information for purchase within the event system. based on the purchase by the user, the event system purchases ticket(s) for the user in real-time from the external source 222 (backend). [0143] the user receives confirmation from the event system of success or failure of the purchase 224. if successful, the tickets may be stored on the event system server(s) 226 and displayed in-app. this may include scannable data such as a qr code or a bar code. the tickets may be stored as a native component. [0144] for purposes of this disclosure, any system described herein may include any instrumentality or aggregate of instrumentalities operable to compute, calculate, determine, classify, process, transmit, receive, retrieve, originate, switch, store, display, communicate, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, or other purposes. for example, a system or any portion thereof may be a minicomputer, mainframe computer, personal computer (e.g., desktop or laptop), tablet computer, embedded computer, mobile device (e.g., personal digital assistant (pda) or smart phone) or other hand-held computing device, server (e.g., blade server or rack server), a network storage device, or any other suitable device or combination of devices and may vary in size, shape, performance, functionality, and price. a system may include volatile memory (e.g., random access memory (ram)), one or more processing resources such as a central processing unit (cpu) or hardware or software control logic, rom, and/or other types of nonvolatile memory (e.g., eprom, eeprom, etc.). a basic input/output system (bios) can be stored in the non-volatile memory (e.g., rom), and may include basic routines facilitating communication of data and signals between components within the system. the volatile memory may additionally include a high-speed ram, such as static ram for caching data. [0145] additional components of a system may include one or more disk drives or one or more mass storage devices, one or more network ports for communicating with external devices as well as various input and output (i/o) devices, such as digital and analog general purpose i/o, a keyboard, a mouse, touchscreen and/or a video display. mass storage devices may include, but are not limited to, a hard disk drive, floppy disk drive, cd-rom drive, smart drive, flash drive, or other types of nonvolatile data storage, a plurality of storage devices, a storage subsystem, or any combination of storage devices. a storage interface may be provided for interfacing with mass storage devices, for example, a storage subsystem. the storage interface may include any suitable interface technology, such as eide, ata, sata, and ieee 1394. a system may include what is referred to as a user interface for interacting with the system, which may generally include a display, mouse or other cursor control device, keyboard, button, touchpad, touch screen, stylus, remote control (such as an infrared remote control), microphone, camera, video recorder, gesture systems (e.g., eye movement, head movement, etc.), speaker, led, light, joystick, game pad, switch, buzzer, bell, and/or other user input/output device for communicating with one or more users or for entering information into the system. these and other devices for interacting with the system may be connected to the system through i/o device interface(s) via a system bus, but can be connected by other interfaces such as a parallel port, ieee 1394 serial port, a game port, a usb port, an ir interface, etc. output devices may include any type of device for presenting information to a user, including but not limited to, a computer monitor, flat-screen display, or other visual display, a printer, and/or speakers or any other device for providing information in audio form, such as a telephone, a plurality of output devices, or any combination of output devices. [0146] a system may also include one or more buses operable to transmit communications between the various hardware components. a system bus may be any of several types of bus structure that can further interconnect, for example, to a memory bus (with or without a memory controller) and/or a peripheral bus (e.g., pci, pcie, agp, lpc, i2c, spi, usb, etc.) using any of a variety of commercially available bus architectures. [0147] one or more programs or applications, such as a web browser and/or other executable applications, may be stored in one or more of the system data storage devices. generally, programs may include routines, methods, data structures, other software components, etc., that perform particular tasks or implement particular abstract data types. programs or applications may be loaded in part or in whole into a main memory or processor during execution by the processor. one or more processors may execute applications or programs to run systems or methods of the present disclosure, or portions thereof, stored as executable programs or program code in the memory, or received from the internet or other network. any commercial or freeware web browser or other application capable of retrieving content from a network and displaying pages or screens may be used. in some embodiments, a customized application may be used to access, display, and update information. a user may interact with the system, programs, and data stored thereon or accessible thereto using any one or more of the input and output devices described above. [0148] a system of the present disclosure can operate in a networked environment using logical connections via a wired and/or wireless communications subsystem to one or more networks and/or other computers. other computers can include, but are not limited to, workstations, servers, routers, personal computers, microprocessor-based entertainment appliances, peer devices, or other common network nodes, and may generally include many or all of the elements described above. logical connections may include wired and/or wireless connectivity to a local area network (lan), a wide area network (wan), hotspot, a global communications network, such as the internet, and so on. the system may be operable to communicate with wired and/or wireless devices or other processing entities using, for example, radio technologies, such as the ieee 8o2.xx family of standards, and includes at least wi-fi (wireless fidelity), wimax, and bluetooth wireless technologies. communications can be made via a predefined structure as with a conventional network or via an ad hoc communication between at least two devices. [0149] hardware and software components of the present disclosure, as discussed herein, may be integral portions of a single computer, server, controller, or message sign, or may be connected parts of a computer network. the hardware and software components may be located within a single location or, in other embodiments, portions of the hardware and software components may be divided among a plurality of locations and connected directly or through a global computer information network, such as the internet. accordingly, aspects of the various embodiments of the present disclosure can be practiced in distributed computing environments where certain tasks are performed by remote processing devices that are linked through a communications network. in such a distributed computing environment, program modules may be located in local and/or remote storage and/or memory systems. [0150] as will be appreciated by one of skill in the art, the various embodiments of the present disclosure may be embodied as a method (including, for example, a computer-implemented process, a business process, and/or any other process), apparatus (including, for example, a system, machine, device, computer program product, and/or the like), or a combination of the foregoing. accordingly, embodiments of the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, middleware, microcode, hardware description languages, etc.), or an embodiment combining software and hardware aspects. furthermore, embodiments of the present disclosure may take the form of a computer program product on a computer-readable medium or computer-readable storage medium, having computer-executable program code embodied in the medium, that define processes or methods described herein. a processor or processors may perform the necessary tasks defined by the computer-executable program code. computer-executable program code for carrying out operations of embodiments of the present disclosure may be written in an object oriented, scripted or unscripted programming language such as java, perl, php, visual basic, smalltalk, c++, or the like. however, the computer program code for carrying out operations of embodiments of the present disclosure may also be written in conventional procedural programming languages, such as the c programming language or similar programming languages. a code segment may represent a procedure, a function, a subprogram, a program, a routine, a subroutine, a module, an object, a software package, a class, or any combination of instructions, data structures, or program statements. a code segment may be coupled to another code segment or a hardware circuit by passing and/or receiving information, data, arguments, parameters, or memory contents. information, arguments, parameters, data, etc. may be passed, forwarded, or transmitted via any suitable means including memory sharing, message passing, token passing, network transmission, etc. [0151] in the context of this document, a computer readable medium may be any medium that can contain, store, communicate, or transport the program for use by or in connection with the systems disclosed herein. the computer-executable program code may be transmitted using any appropriate medium, including but not limited to the internet, optical fiber cable, radio frequency (rf) signals or other wireless signals, or other mediums. the computer readable medium may be, for example but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device. more specific examples of suitable computer readable medium include, but are not limited to, an electrical connection having one or more wires or a tangible storage medium such as a portable computer diskette, a hard disk, a random access memory (ram), a read-only memory (rom), an erasable programmable read-only memory (eprom or flash memory), a compact disc readonly memory (cd-rom), or other optical or magnetic storage device. computer- readable media includes, but is not to be confused with, computer-readable storage medium, which is intended to cover all physical, non-transitory, or similar embodiments of computer-readable media. [0152] various embodiments of the present disclosure may be described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products. it is understood that each block of the flowchart illustrations and/or block diagrams, and/or combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computerexecutable program code portions. these computer-executable program code portions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a particular machine, such that the code portions, which execute via the processor of the computer or other programmable data processing apparatus, create mechanisms for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. alternatively, computer program implemented steps or acts may be combined with operator or human implemented steps or acts in order to carry out an embodiment of the invention. [0153] additionally, although a flowchart or block diagram may illustrate a method as comprising sequential steps or a process as having a particular order of operations, many of the steps or operations in the flowchart(s) or block diagram(s) illustrated herein can be performed in parallel or concurrently, and the flowchart(s) or block diagram(s) should be read in the context of the various embodiments of the present disclosure. in addition, the order of the method steps or process operations illustrated in a flowchart or block diagram may be rearranged for some embodiments. similarly, a method or process illustrated in a flow chart or block diagram could have additional steps or operations not included therein or fewer steps or operations than those shown. moreover, a method step may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc. [0154] as used herein, the term “substantially” refers to the complete or nearly complete extent or degree of an action, characteristic, property, state, structure, item, or result. for example, an object that is “substantially” enclosed would mean that the object is either completely enclosed or nearly completely enclosed. the exact allowable degree of deviation from absolute completeness may in some cases depend on the specific context. however, the nearness of completion will be so as to have generally the same overall result as if absolute and total completion were obtained. the use of “substantially” is equally applicable when used in a negative connotation to refer to the complete or near complete lack of an action, characteristic, property, state, structure, item, or result. for example, an element, combination, embodiment, or composition that is “substantially free of’ an element may still actually contain such element as long as there is generally no significant effect thereof. [0155] to aid the patent office and any readers of any patent issued on this application in interpreting the claims appended hereto, applicants wish to note that they do not intend any of the appended claims or claim elements to invoke 35 u.s.c. § 112(f) unless the words “means for” or “step for” are explicitly used in the particular claim. [0156] additionally, as used herein, the phrase “at least one of [x] and [y],” where x and y are different components that may be included in an embodiment of the present disclosure, means that the embodiment could include component x without component y, the embodiment could include the component y without component x, or the embodiment could include both components x and y. similarly, when used with respect to three or more components, such as “at least one of [x], [y], and [z],” the phrase means that the embodiment could include any one of the three or more components, any combination or sub-combination of any of the components, or all of the components. [0157] in the foregoing description various embodiments of the present disclosure have been presented for the purpose of illustration and description. they are not intended to be exhaustive or to limit the invention to the precise form disclosed. obvious modifications or variations are possible in light of the above teachings. the various embodiments were chosen and described to provide the best illustration of the principals of the disclosure and their practical application, and to enable one of ordinary skill in the art to utilize the various embodiments with various modifications as are suited to the particular use contemplated. all such modifications and variations are within the scope of the present disclosure as determined by the appended claims when interpreted in accordance with the breadth they are fairly, legally, and equitably entitled.
042-892-523-719-525	US	[ "EP", "US", "CA", "JP", "WO", "AU", "NZ" ]	A61K39/395,C07K16/30,A61K38/17,A61K48/00,C07K16/18,C12N5/10,C12N15/13,C12N15/63,A61K31/7088,A61K38/16,A61P35/00,A61P35/02,C07H21/00,C07K16/40,G01N33/53,C12N15/09,A61K38/00,A61K39/00,A61K39/385,C12Q1/68,C07K14/82,G01N33/574,A61P35/04	2004-10-12T00:00:00	2004	[ "A61", "C07", "C12", "G01" ]	binding molecules for the detection of cancer	the present invention provides new tumor-associated antigens, binding molecules that specifically bind to the antigens, nucleic acid molecules encoding the binding molecules, compositions comprising the binding molecules and methods of identifying or producing the binding molecules. the new tumor-associated antigen are expressed on cancer cells and binding molecules capable of specifically binding to the antigens can be used in the diagnosis, prevention and/or treatment of cancer.	a binding molecule capable of binding to the leukocyte antigen-related receptor protein tyrosine phosphatase (lar ptp), an immunoconjugate comprising at least the binding molecule, or a pharmaceutical composition comprising at least the binding molecule, for use in the in vivo-detection of aml. a binding molecule for use according to claim 1, the binding molecule comprising a heavy chain variable region comprising the amino acid sequence of seq id no:3 and a light chain variable region comprising the amino acid sequence of seq id no:7. a binding molecule for use according claim 1 or 2, characterized in that the binding molecule is a human binding molecule. use of a binding molecule capable of binding to the leukocyte antigen-related receptor protein tyrosine phosphatase (lar ptp), an immunoconjugate comprising at least the binding molecule, or a pharmaceutical composition comprising at least the binding molecule for the in vitro detection of aml use according to claim 4, the binding molecule comprising a heavy chain variable region comprising the amino acid sequence of seq id no:3 and a light chain variable region comprising the amino acid sequence of seq id no:7. use according claim 4 or 5, characterized in that the binding molecule is a human binding molecule.	field of the invention the present invention relates to the field of medicine. the invention in particular relates to binding molecules capable of specifically binding to cancer-associated antigens. the binding molecules are useful in the prevention, treatment and detection of cancer. background of the invention cancer describes a class of diseases characterized by the uncontrolled growth of aberrant cells. it is the second leading cause of human death next to coronary disease. worldwide, millions of people die from cancer every year. in the united states alone, cancer causes the death of well over a half-million people each year, with some 1.4 million new cases diagnosed per year. one form of cancer, accounting for about 3% of all cancers in the united states of america, is leukemia. this malignant disease is characterised by an abnormal proliferation of white blood cells which can be detected in the peripheral blood and/or bone marrow. leukemia can be broadly classified into acute and chronic leukemia. acute leukemia can be subclassified into myeloid and lymphoid leukemia in a variety of ways, including cell morphology and cytochemistry. acute myeloid leukemia (aml) is the most common form of leukemia accounting for about 50% of all leukemia cases and even 85% of all acute leukemia cases involving adults. the standard treatment regime for aml is chemotherapy, which often includes an anthracycline. this results in a 70% complete remission (cr) rate in aml patients. anthracycline therapy, however, is associated with severe side effects, including myelosuppression and dose-limiting cardiotoxicity, as well as a significant incidence of relapse. less than 20% of cr patients survive in the long term. relapsed aml disease exhibits multiple drug resistance (mdr), making the relapsed disease frequently refractory to further treatment with a variety of chemotherapeutic agents, including drugs. in the light thereof novel therapies for aml have been developed. some therapies make use of antibodies capable of binding to aml-associated antigens such as cd33 or cd45 (see wo 2004/043344 ). although aml-associated antigens have been described, there is still a great need for new aml antigens useful in antibody and other biological therapies. in addition, there is a corresponding need for aml-associated antigens which may be useful as markers for antibody-based diagnostic and imaging methods, hopefully leading to the development of earlier diagnosis and greater prognostic precision. the present invention addresses this need by providing new antigens useful in the diagnosis of aml. description of the figures figure 1 shows the binding intensity (depicted in mean fluorescence) of the phage antibody sc02-401 to aml in relation to the binding intensity of the phage antibody to different cell populations in peripheral blood of a healthy donor. figure 2 shows the binding intensity (depicted in mean fluorescence) of the phage antibody sc02-361 to aml in relation to the binding intensity of the phage antibody to different cell populations in peripheral blood of a healthy donor. figure 3 shows an immunoblot of a ls 174t cell lysate immunoprecipitated with a negative control igg1 (cr2428; left lane), a positive control igg1 directed against cd46 (cr2300; middle lane), or igg1 cr2401 (right lane). on the left side of the blot molecular weight markers are indicated. figure 4 shows an immunoblot of a nb4 cell lysate immunoprecipitated with a negative control igg1 (cr2428; left lane), a positive control igg1 directed against cd46 (cr2300; middle lane), or igg1 cr2361 (right lane). on the left side of the blot molecular weight markers are indicated. figure 5 shows a silver staned sds-page gel of the proteins eluting from an affinity column of cr2401. the arrow indicates the protein of interest (150 kda) specifically released from the column in fraction 8-10. the asterix indicates two protein bands somewhat smaller than 150 kda. on the left side of the blot molecular weight markers are indicated. figure 6 shows an immunoblot using a murine anti-lar ptp antibody. on the left side the molecular weight markers are indicated. from left to right are shown, an immunoprecipitate of the negative control antibody cr2428, an immunoprecipitate of the antibody cr2401, an immunoprecipitate of the positive control antibody cr2300, a purified fraction, a purified control fraction and a complete ls174t cell lysate. figure 7 shows a silver staned sds-page gel of the proteins eluting from an affinity column of cr2361. the arrows indicate the proteins of interest (30, 40, 75 and 150 kda; e, f, g and h, respectively) specifically released from the column in fraction 9-12. on the left side the molecular weight markers are indicated. figure 8 shows immunoblots of hek93t cells transfected with atad3a, mycatad3a and atad3amyc constructs (right, left and middle part of blot, respectively). cells were lysed and cell lysates obtained were biotinylated and immunoprecipitated with the negative control antibody cr2428, the positive control antibody cr2300 and antibody cr2361. immunoblots were developed with anti-myc. on the left side the molecular weight markers are shown. figure 9 shows an immunoblot of a cell surface biotinylated nb4 cell lysate immunoprecipitated with cr2361 (left lane) and a complete cell lysate of hek293t cells transfected with atad3amyc (right lane). on the left side of the blot molecular weight markers are indicated. summary of the invention the scope of the present invention is defined by the claims. any information that does not fall within the claims is provided for information only. in particular, antigens associated with aml are provided. furthermore, several binding molecules capable of binding to the tumor-associated antigens have been identified and obtained by using phage display technology. furthermore, methods of producing these binding molecules and the use of the binding molecules in diagnosis, prevention and treatment of neoplastic disorders and diseases, in particular aml, have been described. detailed description of the invention the present disclosure encompasses binding molecules capable of binding to an antigen present on tumor cells such as aml cells. as used herein the term "acute myeloid leukemia (aml)" is characterized by an uncontrolled proliferation of progenitor cells of myeloid origin including, but not limited to, myeloid progenitor cells, myelomonocytic progenitor cells, and immature megakaryoblasts. subtypes of aml according to the fab classification include fab-m0, fab-m1, fab-m2, fab-m3, fab-m4, fab-m5, fab-m6 and fab-m7. the binding molecules according to the disclosure are preferably human binding molecules. they can be intact immunoglobulin molecules such as polyclonal or monoclonal antibodies, such as chimeric, humanized or in particular human monoclonal antibodies, or the binding molecules can be antigen-binding fragments including, but not limited to, fab, f(ab'), f(ab')2, fv, dab, fd, complementarity determining region (cdr) fragments, single-chain antibodies (scfv), bivalent single-chain antibodies, diabodies, triabodies, tetrabodies, and (poly)peptides that contain at least a fragment of an immunoglobulin that is sufficient to confer specific antigen binding to the (poly)peptides. the term "binding molecule", as used herein also includes the immunoglobulin classes and subclasses known in the art. depending on the amino acid sequence of the constant domain of their heavy chains, binding molecules can be divided into the five major classes of intact antibodies: iga, igd, ige, igg, and igm, and several of these may be further divided into subclasses (isotypes), e.g., iga1, iga2, igg1, igg2, igg3 and igg4. the methods of production of antibodies are well known in the art and are described, for example, in antibodies: a laboratory manual, edited by: e. harlow and d, lane (1988), cold spring harbor laboratory, cold spring harbor, new york . the binding molecules of the disclosure can be used in non-isolated or isolated form. furthermore, the binding molecules of the invention can be used alone or in a mixture comprising at least one binding molecule (or variant or fragment thereof). in other words, the binding molecules can be used in combination, e.g., as a pharmaceutical composition comprising two or more binding molecules or fragments thereof. for example, binding molecules having different, but complementary, activities can be combined in a single therapy to achieve a desired therapeutic or diagnostic effect, but alternatively, binding molecules having identical activities can also be combined in a single therapy to achieve a desired therapeutic or diagnostic effect. the mixture may further comprise at least one other therapeutic agent. typically, binding molecules according to the invention can bind to their binding partners, i.e. the aml-associated antigens of the invention, with an affinity constant (kd-value) that is lower than 0.210 -4 m, 1.010 -5 m, 1.010 -6 m, 1.010 -7 m, preferably lower than 1.010 -8 m, more preferably lower than 1.010 -9 m, more preferably lower than 1.010 -10 m, even more preferably lower than 1.010- 11 m, and in particular lower than 1.010 -12 m. the affinity constants can vary for antibody isotypes. for example, affinity binding for an igm isotype refers to a binding affinity of at least about 1.010 -7 m. affinity constants can be measured using surface plasmon resonance, i.e. an optical phenomenon that allows for the analysis of real-time biospecific interactions by detection of alterations in protein concentrations within a biosensor matrix, for example using the biacore system (pharmacia biosensor ab, uppsala, sweden). the binding molecules according to the disclosure may bind to the aml-associated antigens of the invention in soluble form or may bind to the aml-associated antigens of the invention bound or attached to a carrier or substrate, e.g ., microtiter plates, membranes and beads, etc. carriers or substrates may be made of glass, plastic ( e.g ., polystyrene), polysaccharides, nylon, nitrocellulose, or teflon, etc. the surface of such supports may be solid or porous and of any convenient shape. furthermore, the binding molecules may bind to the aml-associated antigens in purified or non-purified form and/or in isolated or non-isolated form. preferably, the binding molecules are capable of binding to the antigens when they are associated with cells, such as a human cells positive for the antigen, e.g . aml cells or cells transfected with the aml-associated antigens of the invention, or portions or parts of these cells comprising the aml-associated antigens or a fragment thereof such as the extracellular part of the antigens. as the aml-associated antigens according to the invention are overexpressed by tumor cells as compared to normal cells of the same tissue type, the binding molecules according to the invention can be used to selectively target the tumor cells. in particular, the aml-associated antigens according to the invention are overexpressed by aml cells as compared to normal blood cells. the binding molecules of the disclosure which stay bound to the surface upon binding to the antigens present on the surface of target cells, such as aml cells, may be used in the format of naked binding molecules to support possible effector functions of antibody-dependent cellular cytotoxicity (adcc) and/or complement-dependent cytotoxicity (cdc). assays to distinguish adcc or cdc are well-known to the person skilled in the art. naked antibodies according to the invention may also induce apoptosis of target cells in another way than by means of adcc or cdc. alternatively, they may internalise upon binding to the aml-associated antigens of the invention. internalisation of binding molecules can be assayed by techniques known to the person skilled in the art. in a preferred embodiment, the binding molecules according to the disclosure comprise at least a cdr3 region, preferably a heavy chain cdr3 region, comprising the amino acid sequence of seq id no:1 or seq id no:2. in another embodiment, the binding molecules according to the invention comprise a heavy chain variable region comprising the amino acid sequence of seq id no:3 or seq id no:4. in yet a further embodiment, the binding molecules according to the comprise a heavy chain variable region comprising the amino acid sequence shown in seq id no:3 and a light chain variable region comprising the amino acid sequence of seq id no:7, or a heavy chain variable region comprising the amino acid sequence shown in seq id no:4 and a light chain variable region comprising the amino acid sequence of seq id no:8. another aspect of the disclosure includes functional variants of binding molecules or fragments thereof as defined herein. molecules are considered to be functional variants of a binding molecule according to the disclosure, if the variants are capable of competing for specifically binding to the aml-associated antigens of the invention with the parent binding molecules. in other words, when the functional variants are still capable of binding to the aml-associated antigens or a portion thereof. functional variants include, but are not limited to, derivatives that are substantially similar in primary structural sequence, but which contain e.g. in vitro or in vivo modifications, chemical and/or biochemical, that are not found in the parent binding molecule. such modifications are well known to the skilled artisan. alternatively, functional variants can be binding molecules as defined in the present invention comprising an amino acid sequence containing substitutions, insertions, deletions or combinations thereof of one or more amino acids compared to the amino acid sequences of the parent binding molecules. furthermore, functional variants can comprise truncations of the amino acid sequence at either or both the amino or carboxy termini. functional variants according to the invention may have the same or different, either higher or lower, binding affinities compared to the parent binding molecule but are still capable of binding to the aml-associated antigens of the invention. for instance, functional variants according to the invention may have increased or decreased binding affinities for the aml-associated antigens of the invention compared to the parent binding molecules. preferably, the amino acid sequences of the variable regions, including, but not limited to, framework regions, hypervariable regions, in particular the cdr3 regions, are modified. functional variants intended to fall within the scope of the present invention have at least about 50% to about 99%, preferably at least about 60% to about 99%, more preferably at least about 70% to about 99%, even more preferably at least about 80% to about 99%, most preferably at least about 90% to about 99%, in particular at least about 95% to about 99%, and in particluar particular at least about 97% to about 99% amino acid sequence homology with the parent binding molecules as defined herein. computer algorithms such as inter alia gap or bestfit known to a person skilled in the art can be used to optimally align amino acid sequences to be compared and to define similar or identical amino acid residues. functional variants can be obtained by altering the parent binding molecules or parts thereof by general molecular biology methods known in the art including, but not limited to, error-prone pcr, oligonucleotide-directed mutagenesis and site-directed mutagenesis. in an embodiment the aml-associated antigen is leukocyte antigen-related receptor protein tyrosine phosphatase (lar ptp). lar ptp is a prototype of a family of transmembrane phosphatases whose extracellular domains are composed of three ig and several fibronectin type iii domains (streuli et al. 1988). lar ptp is expressed in cells of many different lineages including epithelial cells, smooth muscle cells and cardiac myocytes and increased levels of lar ptp expression and differential patterns of extracellular alternative splicing were found in breast cancer cell lines and pheochromocytoma tumor tissue. another aspect of the invention pertains to a human binding molecule as herein defined capable of specifically binding to lar ptp or the extracellular part thereof. the amino acid sequence of lar ptp is shown in seq id no:40. the extracellular part of the protein consists of amino acids 1 - 1259 (streuli et al., 1992). in a preferred embodiment the human binding molecule specifically binding to lar ptp comprises at least a heavy chain cdr3 region comprising the amino acid sequence of seq id no:1. the binding molecule capable of specifically binding to lar ptp can be used in indications wherein lar ptp has been suggested to play a role such as inter alia obesity, type-ii diabetes, and tumors. as lar ptp is overexpressed in aml cells the binding molecule capable of specifically binding to lar ptp can be used as a medicament, in detection, prevention and/or treatment of aml. the binding molecules of the invention have specific immunoreactivity with aml subtypes mo, m1/2 and m3 and can thus advantageously be used in detection of these specific aml subtypes. in another embodiment the aml-associated antigen is a polypeptide comprising the amino acid sequence of seq id no:6. this protein has been called atad3a. it contains a potential atp-ase region from amino acids 347-467 and potentially belongs to the aaa-superfamily of atp-ases. in general, atp-ases are associated with a wide variety of cellular activities, including membrane fusion, proteolysis, and dna replication. the present disclosure further provides that the polypeptide is overexpressed in tumors, particularly in aml. the polypeptide is expressed by all aml subtypes. an aspect of the disclosure is concerned with a nucleic acid molecule encoding the polypeptide comprising the amino acid sequence of seq id no:6. in a specific embodiment the nucleic acid molecule comprises the nucleotide sequence of seq id no:5. another aspect of the disclosure is concerned with a pharmaceutical composition comprising a polypeptide comprising the amino acid sequence of seq id no:6 or a nucleic acid molecule encoding the polypeptide. the pharmaceutical composition further comprises a pharmaceutically acceptable carrier. such a composition could be used as a vaccine. in yet another embodiment the disclosure provides a binding molecule as herein defined capable of specifically binding to a polypeptide comprising the amino acid sequence of seq id no:6. the polypeptide comprising the amino acid sequence of seq id no:6, a pharmaceutical composition comprising this polypeptide or nucleic acid molecule encoding this polypeptide or binding molecule specifically binding to this polypeptide can be used as a medicament for inter alia the detection, prevention and/or treatment of cancer, in particular for the detection, prevention and/or treatment of aml. naturally-occurring truncated or secreted forms, naturally-occurring variant forms ( e.g ., alternatively spliced forms) and naturally-occurring allelic variants of the aml-associated antigens of the invention are also a part of the present invention. binding molecules of the invention may also be capable of specifically binding to non-naturally occuring variants or analogues of these antigens as long as the modifications do not abolish the binding of the binding molecules to the antigens. a nucleic acid molecule encoding the polypeptide as described above, preferably comprising the amino acid sequence of seq id no:6, preferably comprises the nucleotide sequence as shown in seq id no:5. the nucleic acid molecule may be used as a vaccine or for making a vaccine. in yet a further aspect, the invention includes immunoconjugates, i.e . molecules comprising at least one binding molecule as described above and further comprising at least one tag, such as a therapeutic moiety that inhibits or prevents the function of cells and/or causes destruction of cells. also contemplated in the present invention are mixtures of immunoconjugates according to the invention or mixtures of at least one immunoconjugates according to the invention and another molecule, such as a therapeutic or diagnostic agent or another binding molecule or immunoconjugate. in a further embodiment, the immunoconjugates of the invention may comprise more than one tag. these tags can be the same or distinct from each other and can be joined/conjugated non-covalently to the binding molecules. the tags can also be joined/conjugated directly to the binding molecules through covalent bonding. alternatively, the tags can be joined/conjugated to the binding molecules by means of one or more linking compounds. techniques for conjugating tags to binding molecules, are well known, see, e.g., arnon et al., monoclonal antibodies for immunotargeting of drugs in cancer therapy, p. 243-256 in monoclonal antibodies and cancer therapy (1985), edited by: reisfeld et al., a. r. liss, inc. ; hellstrom et al., antibodies for drug delivery, p. 623-653 in controlled drug delivery, 2nd edition (1987), edited by: robinson et al., marcel dekker, inc. ; thorpe, antibody carriers of cytotoxic agents, p. 475-506 in cancer therapy: a review, in monoclonal antibodies'84 : biological and clinical applications (1985), edited by: pincher a et al.; analysis, results, and future prospective of the therapeutic use of radiolabeled antibody in cancer therapy, p. 303-316 in monoclonal antibodies for cancer detection and therapy (1985), edited by: baldwin et al., academic press . tags according to the invention include, but are not limited to, toxic substances, radioactive substances, liposomes, enzymes, polynucleotide sequences, plasmids, proteins, peptides or combinations thereof. toxic substances include, but are not limited to, cytotoxic agents, such as small molecule toxins or chemotherapeutic agents, or enzymatically active toxins of bacterial, fungal, plant or animal origin, or fragments thereof. in general, suitable chemotherapeutic agents are described in remington's pharmaceutical sciences, 18th edition (1990), edited by: a.r. gennaro, mack publishing co., philadelphia and in goodman and gilman's the pharmacological basis of therapeutics, 7th edition (1985), edited by: a.g. gilman, l.s. goodman, t.w. rall and f. murad. macmillan publishing co., new york . suitable chemotherapeutic agents that are still in the experimental phase are known to those of skill in the art and might also be used as toxic substances in the present invention. fusion proteins comprising enzymatically active toxins and binding molecules of the immunoconjugate of the invention can be produced by methods known in the art such as, e.g., recombinantly by constructing nucleic acid molecules comprising nucleotide sequences encoding the binding molecules in frame with nucleotide sequences encoding the enzymatically active toxin and then expressing the nucleic acid molecules. alternatively, fusion proteins can be produced chemically by conjugating, directly or indirectly via for instance a linker, binding molecules as defined herein to enzymatically active toxins. immunoconjugates comprising enzymes may be useful in antibody-directed enzyme-prodrug therapy (adept). also contemplated within the present invention are binding molecules of the immunoconjugate of the invention that are labeled with radionuclides. the skilled man knows suitable radionuclides. the choice of radionuclide will be dependent on many factors such as, e.g., the type of disease to be treated, the stage of the disease to be treated, the patient to be treated and the like. binding molecules can be attached to radionuclides directly or indirectly via a chelating agent by methods well known in the art. in another embodiment, the binding molecules of the immunoconjugate of the invention can be conjugated to liposomes to produce so-called immunoliposomes. a liposome may be conjugated to one or more binding molecules, the binding molecules being either the same or different. a variety of methods are available for preparing liposomes. these methods are well known in the art and include, but are not limited to, sonication, extrusion, high pressure/homogenization, microfluidisation, detergent dialysis, calcium-induced fusion of small liposome vesicles, and ether-infusion methods. the liposomes may be multilamellar vesicles, but preferably the liposomes are unilamellar vesicles such as small unilamellar (200 - 500 å) or large unilamellar vesicles (500 - 5000 a). the drugs that can be loaded into liposomes include, but are not limited to, the toxic substances mentioned above. liposomes having loaded different drugs and different liposomes, each liposome having loaded one kind of drug, may be alternative embodiments of liposomes that can be used and these embodiments are therefore also contemplated in the present invention. binding molecules of the invention may be attached at the surface of the liposomes or to the terminus of polymers such as polyethylene glycol that are grafted at the surface of the liposomes using conventional chemical-coupling techniques. in yet another embodiment, the binding molecules of the invention may be linked to water-soluble, biodegradable polymers, such as for instance polymers of hydroxypropylmethacrylamine (hpma). in another aspect the binding molecules of the invention may be conjugated/attached to one or more antigens. preferably, these antigens are antigens which are recognised by the immune system of a subject to which the binding molecule-antigen conjugate is administered. the antigens may be identical but may also be different. conjugation methods for attaching the antigens and binding molecules are well known in the art and include, but are not limited to, the use of cross-linking agents. alternatively, the binding molecules as described in the present invention can be conjugated to tags and be used for detection and/or analytical and/or diagnostic purposes. the tags used to label the binding molecules for those purposes depend on the specific detection/analysis/diagnosis techniques and/or methods used such as inter alia immunohistochemical staining of tissue samples, flow cytometric detection, scanning laser cytometric detection, fluorescent immunoassays, enzyme-linked immunosorbent assays (elisa's), radioimmunoassays (ria's), bioassays ( e.g ., growth inhibition assays), western blotting applications, etc. the binding molecules of the invention may also be conjugated to photoactive agents or dyes such as fluorescent and other chromogens or dyes to use the so obtained immunoconjugates in photoradiation, phototherapy, or photodynamic therapy. when the immunoconjugates of the invention are used for in vivo diagnostic use, the binding molecules can also be made detectable by conjugation to e.g . magnetic resonance imaging (mri) contrast agents, ultrasound contrast agents or to x-ray contrast agents, or by radioisotopic labeling. furthermore, the binding molecules or immunoconjugates of the invention can also be attached to solid supports, which are particularly useful for immunoassays or purification of the binding partner. such solid supports might be porous or nonporous, planar or nonplanar. the binding molecules can also for example usefully be conjugated to filtration media, such as nhs-activated sepharose or cnbr-activated sepharose for purposes of immunoaffinity chromatography. they can also usefully be attached to paramagnetic microspheres, typically by biotin-streptavidin interaction. the microspheres can be used for isolation of cells that express or display the aml-associated antigens or fragments thereof. as another example, the binding molecules of the present invention can usefully be attached to the surface of a microtiter plate for elisa. it is clear to the skilled artisan that any of the tags described above can also be conjugated to the new antigens of the invention. another aspect of the present disclosure concerns nucleic acid molecules as defined herein encoding binding molecules of the present invention. in yet another aspect, the disclosure provides nucleic acid molecules encoding at least the binding molecules specifically binding to the aml-associated antigens described above. in a preferred embodiment, the nucleic acid molecules are isolated or purified. the skilled man will appreciate that functional variants of the nucleic acid molecules of the invention are also intended to be a part of the present invention. functional variants are nucleic acid sequences that can be directly translated, using the standard genetic code, to provide an amino acid sequence identical to that translated from the parent nucleic acid molecules. preferably, the nucleic acid molecules encode binding molecules comprising a cdr3 region, preferably a heavy chain cdr3 region, comprising the amino acid sequence of seq id no:1 or seq id no:2. even more preferably, the nucleic acid molecules encode binding molecules comprising a heavy chain variable region comprising the amino acid sequence of seq id no:3 or seq id no:4. in yet another embodiment, the nucleic acid molecules encode binding molecules comprising a heavy chain variable region comprising the amino acid sequence of seq id no:3 and a light chain variable region comprising the amino acid sequence of seq id no:7, or they encode a heavy chain variable region comprising the amino acid sequence of seq id no:4 and a light chain variable region comprising the amino acid sequence of seq id no:8. in a specific embodiment of the invention the nucleic acid molecules encoding the binding molecules of the invention comprise the nucleotide sequence of seq id no:9 or seq id no:10 it is another aspect of the disclosure to provide vectors, i.e . nucleic acid constructs, comprising one or more nucleic acid molecules according to the present invention. vectors can be derived from plasmids; cosmids; phages; plant viruses; or animal viruses. vectors can be used for cloning and/or for expression of the binding molecules of the invention and might even be used for gene therapy purposes. vectors comprising one or more nucleic acid molecules according to the invention operably linked to one or more expression-regulating nucleic acid molecules are also covered by the present invention. the choice of the vector is dependent on the recombinant procedures followed and the host used. introduction of vectors in host cells can be effected by inter alia calcium phosphate transfection, virus infection, deae-dextran mediated transfection, lipofectamin transfection or electroporation. vectors may be autonomously replicating or may replicate together with the chromosome into which they have been integrated. preferably, the vectors contain one or more selection markers. the choice of the markers may depend on the host cells of choice, although this is not critical to the invention as is well known to persons skilled in the art. vectors comprising one or more nucleic acid molecules encoding the binding molecules as described above operably linked to one or more nucleic acid molecules encoding proteins or peptides that can be used to isolate the binding molecules are also covered by the disclosure. hosts containing one or more copies of the vectors mentioned above are an additional subject of the present disclosure. preferably, the hosts are host cells. host cells include, but are not limited to, cells of mammalian, plant, insect, fungal or bacterial origin. bacterial cells include, but are not limited to, cells from gram positive bacteria such as several species of the genera bacillus, streptomyces and staphylococcus or cells of gram negative bacteria such as several species of the genera escherichia and pseudomonas. in the group of fungal cells preferably yeast cells are used. expression in yeast can be achieved by using yeast strains such as inter alia pichia pastoris, saccharomyces cerevisiae and hansenula polymorpha. furthermore, insect cells such as cells from drosophila and sf9 can be used as host cells. besides that, the host cells can be plant cells. transformed (transgenic) plants or plant cells are produced by known methods. expression systems using mammalian cells such as chinese hamster ovary (cho) cells, cos cells, bhk cells or bowes melanoma cells are preferred in the present invention. mammalian cells provide expressed proteins with posttranslational modifications that are most similar to natural molecules of mammalian origin. since the present invention deals with molecules that may have to be administered to humans, a completely human expression system would be particularly preferred. therefore, even more preferably, the host cells are human cells. examples of human cells are inter alia hela, 911, at 1080, a549, 293 and hek293t cells. in preferred embodiments, the human producer cells comprise at least a functional part of a nucleic acid sequence encoding an adenovirus e1 region in expressible format. in even more preferred embodiments, said host cells are human retina cells and immortalised with nucleic acids comprising adenoviral e1 sequences such as 911 cells or the cell line deposited at the european collection of cell cultures (ecacc), camr, salisbury, wiltshire sp4 ojg, great britain on 29 february 1996 under number 96022940 and marketed under the trademark per.c6® (per.c6 is a registered trademark of crucell holland b.v.). for the purposes of this application "per.c6" refers to cells deposited under number 96022940 or ancestors, passages up-stream or downstream as well as descendants from ancestors of deposited cells, as well as derivatives of any of the foregoing. production of recombinant proteins in host cells can be performed according to methods well known in the art. the use of the cells marketed under the trademark per.c6® as a production platform for proteins of interest has been described in wo 00/63403 . it is another aspect of the disclosure to provide a method of producing binding molecules or functional variants thereof, preferably human binding molecules or functional variants thereof according to the present disclosure. the method comprises the steps of a) culturing a host as described above under conditions conducive to the expression of the binding molecules, and b) optionally, recovering the expressed binding molecules. the expressed binding molecules can be recovered from the cell free extract, but preferably they are recovered from the culture medium. methods to recover proteins, such as binding molecules, from cell free extracts or culture medium are well known to the man skilled in the art. binding molecules as obtainable by the above described method are also a part of the present disclosure. alternatively, next to the expression in hosts, such as host cells, the binding molecules of the invention can be produced synthetically by conventional peptide synthesizers or in cell-free translation systems using rnas derived from dna molecules according to the invention. binding molecule as obtainable by the above described synthetic production methods or cell-free translation systems are also a part of the present disclosure. in addition, the above-mentioned methods of producing binding molecules can also be used to produce the aml-associated antigens of the invention. in yet another alternative embodiment, binding molecules according to the present invention may be generated by transgenic non-human mammals. protocols for immunizing non-human mammals are well established in the art. see using antibodies: a laboratory manual, edited by: e. harlow, d. lane (1998), cold spring harbor laboratory, cold spring harbor, new york and current protocols in immunology, edited by: j.e. coligan, a.m. kruisbeek, d.h. margulies, e.m. shevach, w. strober (2001), john wiley & sons inc., new york . in a further aspect, the disclosure provides a method of identifying binding molecules, preferably human binding molecules such as human monoclonal antibodies or fragments thereof, according to the invention or nucleic acid molecules according to the disclosure and comprises the steps of a) contacting a phage library of binding molecules, preferably human binding molecules, with material comprising the aml-associated antigens of the invention or fragments thereof, b) selecting at least once for a phage binding to the material comprising the aml-associated antigens of the invention or fragments thereof, and c) separating and recovering the phage binding to the material comprising the aml-associated antigens of the invention or fragments thereof. the selection step according to the present invention is preferably performed in the presence of at least part of the aml-associated antigens of the invention, e.g. cells transfected with expression plasmids of the aml-associated antigens, isolated aml-associated antigens, the extracellular part thereof, fusion proteins comprising such, and the like. in an embodiment the selection step is performed in the presence of aml cells. prior to or concurrent with this selection step the phage library of binding molecules can be contacted to normal blood cells and/or tumor cell lines expressing the aml-associated antigens of the invention. phage display methods for identifying and obtaining binding molecules, e.g. antibodies, are by now well-established methods known by the person skilled in the art. they are e.g. described in us patent number 5,696,108 ; burton and barbas, 1994; and de kruif et al., 1995b. for the construction of phage display libraries, collections of human monoclonal antibody heavy and light chain variable region genes are expressed on the surface of bacteriophage, preferably filamentous bacteriophage, particles, in for example single chain fv (scfv) or in fab format (see de kruif et al., 1995b). large libraries of antibody fragment-expressing phages typically contain more than 1.010 9 antibody specificities and may be assembled from the immunoglobulin v regions expressed in the b-lymphocytes of immunized- or non-immunized individuals. alternatively, phage display libraries may be constructed from immunoglobulin variable regions that have been partially assembled in vitro to introduce additional antibody diversity in the library (semi-synthetic libraries). for example, in vitro assembled variable regions contain stretches of synthetically produced, randomized or partially randomized dna in those regions of the molecules that are important for antibody specificity, e.g. cdr regions. antigen specific phage antibodies can be selected from the library by immobilising target antigens on a solid phase and subsequently exposing the target antigens to a phage library to allow binding of phages expressing antibody fragments specific for the solid phase-bound antigen. non-bound phages are removed by washing and bound phages eluted from the solid phase for infection of escherichia coli ( e . coli ) bacteria and subsequent propagation. multiple rounds of selection and propagation are usually required to sufficiently enrich for phages binding specifically to the target antigen. phages may also be selected for binding to complex antigens such as complex mixtures of proteins or whole cells such as cells transfected with antigen expression plasmids or cells naturally expressing the aml-associated antigens of the invention. selection of antibodies on whole cells has the advantage that target antigens are presented in their native configuration, i . e. unperturbed by possible conformational changes that might have been introduced in the case where an antigen is immobilized to a solid phase. antigen specific phage antibodies can be selected from the library by incubating a cell population of interest, expressing known and unknown antigens on their surface, with the phage antibody library to let for example the scfv or fab part of the phage bind to the antigens on the cell surface. after incubation and several washes to remove unbound and loosely attached phages, the cells of interest are stained with specific fluorescent labeled antibodies and separated on a fluorescent activated cell sorter (facs). phages that have bound with their scfv or fab part to these cells are eluted and used to infect e. coli to allow amplification of the new specificity. generally, one or more selection rounds are required to separate the phages of interest from the large excess of non-binding phages. monoclonal phage preparations can be analyzed for their specific staining patterns and allowing identification of the antigen being recognized (de kruif et al., 1995a). the phage display method can be extended and improved by subtracting non-relevant binders during screening by addition of an excess of non-target molecules that are similar, but not identical, to the target, and thereby strongly enhance the chance of finding relevant binding molecules (this process is referred to as the mabstract® process. mabstract® is a registered trademark of crucell holland b.v., see also us patent number 6,265,150 ). in yet a further aspect, the disclosure provides a method of obtaining a binding molecule or a nucleic acid molecule according to the invention, wherein the method comprises the steps of a) performing the above described method of identifying binding molecules, preferably human binding molecules such as human monoclonal antibodies or fragments thereof according to the invention, or nucleic acid molecules according to the disclosure, and b) isolating from the recovered phage the human binding molecule and/or the nucleic acid encoding the human binding molecule. once a new monoclonal phage antibody has been established or identified with the above mentioned method of identifying binding molecules or nucleic acid molecules encoding the binding molecules, the dna encoding the scfv or fab can be isolated from the bacteria or phages and combined with standard molecular biological techniques to make constructs encoding bivalent scfv's or complete human immunoglobulins of a desired specificity ( e.g . igg, iga or igm). these constructs can be transfected into suitable cell lines and complete human monoclonal antibodies can be produced (see huls et al., 1999; boel et al., 2000). in a further aspect, the disclosure provides compositions comprising at least one binding molecule, at least one functional variant or fragment thereof, at least one immunoconjugate according to the invention or a combination thereof. in another aspect, the disclosure provides compositions comprising the new aml-associated antigens of the invention. in addition to that, the compositions may comprise inter alia stabilising molecules, such as albumin or polyethylene glycol, or salts. if necessary, the binding molecules or antigens of the disclosure may be coated in or on a material to protect them from the action of acids or other natural or non-natural conditions that may inactivate the binding molecules. in yet a further aspect, the disclosure provides compositions comprising at least one nucleic acid molecule as defined in the present invention. the compositions may comprise aqueous solutions such as aqueous solutions containing salts ( e.g ., nacl or salts as described above), detergents ( e.g ., sds) and/or other suitable components. furthermore, the present disclosure pertains to pharmaceutical compositions comprising at least one binding molecule according to the invention, at least one functional variant or fragment thereof, at least one immunoconjugate according to the invention, at least one composition according to the invention, or combinations thereof. the present disclosure also provides a pharmaceutical composition comprising the aml-associated antigens of the invention. the pharmaceutical composition of the disclosure further comprises at least one pharmaceutically acceptable carrier/excipient. a pharmaceutical composition according to the disclosure can further comprise at least one other therapeutic, prophylactic and/or diagnostic agent. typically, pharmaceutical compositions must be sterile and stable under the conditions of manufacture and storage. the binding molecules, variant or fragments thereof, immunoconjugates, nucleic acid molecules, compositions or antigens of the present disclosure can be in powder form for reconstitution in the appropriate pharmaceutically acceptable excipient before or at the time of delivery. in the case of sterile powders for the preparation of sterile injectable solutions, the preferred methods of preparation are vacuum drying and freeze-drying (lyophilization) that yield a powder of the active ingredient plus any additional desired ingredient from a previously sterile-filtered solution thereof. alternatively, the binding molecules, variant or fragments thereof, immunoconjugates, nucleic acid molecules or compositions of the present invention can be in solution and the appropriate pharmaceutically acceptable excipient can be added and/or mixed before or at the time of delivery to provide a unit dosage injectable form. preferably, the pharmaceutically acceptable excipient used in the present invention is suitable to high drug concentration, can maintain proper fluidity and, if necessary, can delay absorption. the choice of the optimal route of administration of the pharmaceutical compositions will be influenced by several factors including the physico-chemical properties of the active molecules within the compositions, the urgency of the clinical situation and the relationship of the plasma concentrations of the active molecules to the desired therapeutic effect. the routes of administration can be divided into two main categories, oral and parenteral administration. the preferred administration route is intravenous. the binding molecules, preferably the human binding molecules such as human monoclonal antibodies according to the invention, the variants or fragments thereof, the immunoconjugates according to the invention the nucleic acid molecules according to the disclosure, the compositions according to the disclosure or the pharmaceutical compositions according to the disclosure can be used as medicaments. they can inter alia be used in the diagnosis, of cancer. preferably, the cancer is aml, however other tumors, preferably tumors wherein the new antigens of the invention are overexpressed, can also be diagnosed. in addition, the novel antigens of the invention or pharmaceutical compositions comprising such may be used in the diagnosis of cancer. preferably, the cancer a tumor wherein the novel antigens are overexpressed such as aml. the above mentioned molecules or compositions may be employed in conjunction with other molecules useful in diagnosis, prevention and/or treatment. they can be used in vitro, ex vivo or in vivo. the molecules are typically formulated in the compositions and pharmaceutical compositions of the invention in a prophylactically, therapeutically or diagnostically effective amount. dosage regimens can be adjusted to provide the optimum desired response ( e.g., a therapeutic response). the molecules and compositions according to the present invention are preferably sterile. methods to render these molecules and compositions sterile are well known in the art. the other molecules useful in diagnosis, prevention and/or treatment can be administered in a similar dosage regimen as proposed for the binding molecules of the invention. if the other molecules are administered separately, they may be adminstered to a subject with cancer prior ( e.g., 2 minutes, 5 minutes, 10 minutes, 15 minutes, 30 minutes, 45 minutes, 60 minutes, 2 hours, 4 hours, 6 hours, 8 hours, 10 hours, 12 hours, 14 hours, 16 hours, 18 hours, 20 hours, 22 hours, 24 hours, 2 days, 3 days, 4 days, 5 days, 7 days, 2 weeks, 4 weeks or 6 weeks before) to, concomitantly with, or subsequent ( e.g., 2 minutes, 5 minutes, 10 minutes, 15 minutes, 30 minutes, 45 minutes, 60 minutes, 2 hours, 4 hours, 6 hours, 8 hours, 10 hours, 12 hours, 14 hours, 16 hours, 18 hours, 20 hours, 22 hours, 24 hours, 2 days, 3 days, 4 days, 5 days, 7 days, 2 weeks, 4 weeks or 6 weeks after) to the administration of one or more of the binding molecules or pharmaceutical compositions of the invention. the dosing regimen is usually sorted out during clinical trials in human patients. human binding molecules and pharmaceutical compositions comprising the human binding molecules are particularly useful, and often preferred, when to be administered to human beings as in vivo diagnostic or therapeutic agents, since recipient immune response to the administered antibody will often be substantially less than that occasioned by administration of a monoclonal murine, chimeric or humanized binding molecule. alternatively, cells that are genetically engineered to express the binding molecules of the invention are administered to patients in vivo. such cells may be obtained from an animal or patient or an mhc compatible donor and can include, but are not limited to fibroblasts, bone marrow cells, blood cells ( e.g., lymphocytes), adipocytes, muscle cells, endothelial cells, etc. the cells are genetically engineered in vitro using recombinant dna techniques to introduce the nucleic acid molecules of the invention into the cells. preferably, the binding molecules are secreted from the cells. the engineered cells which express and preferably secrete the binding molecules as described herein can be introduced into the patient for example systemically, e.g., in the circulation, or intraperitoneally. in other embodiments, the cells can be incorporated into a matrix or can be encapsulated and implanted in the body. in a gene therapy setting the binding molecules may be administered in the form of a vector capable of infecting cells of the host, coding for a binding molecule according to the invention. in another aspect, the invention concerns the use of binding molecules, preferably human binding molecules such as human monoclonal antibodies, fragments or variants thereof, immunoconjugates according to the invention, nucleic acid molecules, compositions or pharmaceutical compositions in the preparation of a medicament for the diagnosis of cancer such as aml. kits comprising at least one binding molecule, preferably human binding molecule such as human monoclonal antibody according to the invention, at least one variant or fragment thereof, at least one immunoconjugate according to the invention, at least one nucleic acid molecule, at least one composition, at least one pharmaceutical composition, at least one vector, at least one host or a combination thereof are also a part of the present disclosure. optionally, the above described kits also comprise an aml-associated antigen of the invention. optionally, the above described components of the kits are packed in suitable containers and labeled for diagnosis and/or treatment of the indicated conditions. the above-mentioned components may be stored in unit or multi-dose containers. the kit may further comprise more containers comprising a pharmaceutically acceptable buffer. it may further include other materials desirable from a commercial and user standpoint, including other buffers, diluents, filters, needles, syringes, culture medium for one or more of the suitable hosts. associated with the kits can be instructions customarily included in commercial packages of therapeutic or diagnostic products, that contain information about for example the indications, usage, dosage, manufacture, administration, contraindications and/or warnings concerning the use of such therapeutic or diagnostic products. furthermore, the present invention is directed to a method of screening a binding molecule or a functional variant or fragment thereof for specific binding to the same epitope of an aml-associated antigens of the invention or fragment thereof, as the epitope bound by the binding molecule according to the invention, wherein the method comprises the steps of (a) contacting a binding molecule (or a functional variant or fragment thereof) to be screened, a binding molecule (or functional fragment or variant thereof) according to the invention and an aml-associated antigen of the invention (or a fragment thereof comprising the antigenic determinant), (b) measure if the binding molecule (or functional variant or fragment thereof) to be screened is capable of competing for specifically binding to an aml-associated antigen of the invention (or fragment thereof comprising the antigenic determinant) with the binding molecule of the invention. binding molecules identified by these competition assays ("competitive binding molecules" or "cross-reactive binding molecules") include, but are not limited to, antibodies, antibody fragments and other binding agents that bind to an epitope or binding site bound by the reference binding molecule, i.e . a binding molecule of the invention, as well as antibodies, antibody fragments and other binding agents that bind to an epitope or binding site sufficiently proximal to an epitope bound by the reference binding molecule for competitive binding between the binding molecules to be screened and the reference binding molecule to occur. examples to illustrate the invention, the following examples are provided. these examples are not intended to limit the scope of the invention. example 1 selection of phages carrying single chain fv fragments specifically recognizing human acute myeloid leukemia cells antibody fragments were selected using antibody phage display libraries, general phage display technology and mabstract® technology, essentially as described in us patent number 6,265,150 and in wo 98/15833 (both of which are incorporated by reference herein). furthermore, the methods and helper phages as described in wo 02/103012 (incorporated by reference herein) were used in the present invention. for identifying phage antibodies recognizing aml tumor cells phage selection experiments were performed using the erythroid leukemia cell line k562 or the aml cell line called hl60 and primary aml tumor cells that were obtained from bone marrow aspirates of aml patients. an aliquot of a phage library (500 µl, approximately 10 13 cfu, amplified using ct helper phage (see wo 02/103012 )) was blocked and presubtracted by mixing the library with 10 ml of rpmi 1640 medium with 10% fbs containing 23010 6 peripheral blood leukocytes (pbl). the obtained mixture was rotated at 4°c for 1.5 hours. hereafter, the cells were pelleted and the supernatant containing the phage library was transferred to a new tube containing a fresh pellet of 23010 6 pbl. the cells were resuspended in the phage library supernatant and the mixture was again rotated at 4°c for 1.5 hours. this procedure was repeated once more and eventually 10 ml of supernatant containing the blocked phage library which was 3 times subtracted with pbl was transferred to a new tube and was kept overnight at 4°c. the next day 410 6 cells of the erythroid leukemia cell line called k562 or aml cell line called hl60 were pelleted in a separate 15 ml tube and the cells were resuspended in 1 ml of rpmi 1640 medium with 10% fbs. to the tube 3.3 ml of the presubtracted blocked phage library and 5 ml of rpmi 1640 medium with 10% fbs was added and the mixture was rotated at 4°c for 2 hours. hereafter, the obtained mixture was transferred to a 50 ml tube and washed 5 times with 30 ml rpmi 1640 medium with 10% fbs. to the pelleted cells 0.8 ml of 50 mm glycine-hcl ph 2.2 was added, mixed well and left at room temperature for 10 minutes to elute the attached phages. after that, 0.4 ml of 1 m tris-hcl ph 7.4 was added for neutralization. then, the cells were pelleted again and the supernatant was used to infect 5 ml of a xl1-blue e. coli culture that had been grown at 37°c to an od600nm of approximately 0.3. the phages were allowed to infect the xl1-blue bacteria for 30 minutes at 37°c. subsequently, the mixture was centrifuged for 10 minutes, at 3200g at room temperature and the bacterial pellet was resuspended in 1 ml 2-trypton yeast extract (2ty) medium. the obtained bacterial suspension was divided over a-2ty agar plate supplemented with tetracyclin, ampicillin and glucose. after incubation overnight of the plates at 37°c, the colonies were scraped from the plates and used to prepare an enriched phage library, essentially as described by de kruif et al. (1995a) and wo 02/103012 . briefly, scraped bacteria were used to inoculate 2ty medium containing ampicillin, tetracycline and glucose and grown at a temperature of 37°c to an od600nm of ~0.3. ct helper phages were added and allowed to infect the bacteria after which the medium was changed to 2ty containing ampicillin, tetracycline and kanamycin. incubation was continued overnight at 30°c. the next day, the bacteria were removed from the 2ty medium by centrifugation after which the phages in the medium were precipitated using polyethylene glycol (peg) 6000/nacl. finally, the phages were dissolved in 2 ml of phosphate buffered saline (pbs) with 1% bovine serum albumin (bsa), filter-sterilized and used for the next round of selection. to this purpose a 500 µl aliquot of the k562-derived amplified sublibrary or hl-60-derived amplified sublibrary was blocked with 2 ml of rpmi 1640 medium with 10% fbs for 30 minutes at 4°c. to the blocked sublibrary 5x10 6 thawed primary aml blasts (90% cd33+ cd34+ blasts, fab type m0) were added that previously had been stained with a pe-labelled anti-cd34 antibody (becton dickinson). the obtained mixture rotated at 4°c for 2.5 hours. hereafter, the mixture was transferred to a 50 ml tube, washed 3 times with 30 ml cold rpmi 1640 medium with 10% fbs. subsequently, the mixture was passed over a 70 micron cell strainer and was subjected to flow cytometry. cell sorting was performed using a facsvantage flow cytometer (becton dickinson). cells were gated on the basis of low sideward scatter (ssc) combined with cd34-pe staining. approximately 910 5 cells were sorted. the sorted cells were spun down, the supernatant was saved and the bound phages were eluted from the cells by resuspending the cells in 800 µl 50 mm glycin-hcl ph 2.2 followed by incubation for 5 minutes at room temperature. the obtained mixture was neutralized with 400 µl 1 m tris-hcl ph 7.4 and added to the rescued supernatant. the eluted phages were used to re-infect xl1-blue e. coli cells as described supra. after the second round of selection, individual e. coli colonies were used to prepare monoclonal phage antibodies. essentially, individual colonies were grown to log-phase in 96 well plate format and infected with ct helper phages after which phage antibody production was allowed to proceed overnight. the produced phage antibodies were peg/nacl-precipitated and filter-sterilized and tested using flow cytometry (facscalibur, becton dickinson) for binding to both the k562 erythroid leukemia cell line or hl-60 acute myeloid leukemia cell line as well as to the primary aml blasts (that were used for the second round selection). two of the selected phage antibodies, i.e. sc02-361 and sc02-401, bound well to both the primary aml tumor blasts as well as to k562 erythroid leukemia cells or hl-60 cells and were analyzed in further detail (see examples below). example 2 characterization of scfv sc02-401 and sc02-361 plasmid dna was obtained from the selected scfv clones sc02-401 and sc02-361 according to standard techniques known in the art. thereafter, the nucleotide sequence of scfv clones sc02-401 and sc02-361 was determined according to standard techniques well known to a person skilled in the art. the nucleotide sequence of sc02-401 and sc02-361 are listed in table 1 and have seq id no: 11 and seq id no: 13, respectively. the amino acid translation of the nucleotide sequences is also listed in table 1. they have seq id no: 12 and seq id no:14, respectively. the vh and vl gene identity and amino acid sequence of the heavy chain cdr3 regions are also depicted in table 1. example 3 expression of the antigen recognized by sc02-401 and sc02-361 on primary aml samples, tumor cell lines and normal hematopoetic cells the distribution of the target antigens recognized by the phage antibodies sc02-401 and sc02-361 was analyzed by flow cytometry using primary aml samples, tumor cell lines and normal hematopoetic cells derived from peripheral blood. for flow cytometry analysis, phage antibodies were first blocked in an equal volume of pbs containing 4% w/v milkprotein (mpbs) for 15 minutes at 4°c prior to the staining of the various cells. the binding of the phage antibodies to the cells was visualized using a biotinylated anti-m13 antibody (santa cruz biotechnology) followed by addition of streptavidin-allophycocyanin or streptavidin-phycoerythrin (caltag). in addition to the phage antibody the following antibody combinations were used: cd45-percp, indirect labeling of sc02-01 and sc02-361 with myc biotin and streptavidin-pe and cd33-apc. the cells were washed twice with pbs containing 1% w/v bsa and resuspended in binding buffer for annexin v conjugates (caltag) supplemented with annexin v-fitc for exclusion of dead and apoptotic cells. cells were analyzed on a facs calibur (bd) using cellquest software. for final analysis blasts cells were gated based on low side scatter versus cd45 expression. a sample was considered positive if more than 20% of the cells expressed the antigen of interest (compared to staining with a control antibody cr2428. the cd45 positive blast population of a set of different primary aml blasts ( inter alia fab subtypes: fab-m0, fab-m1, fab-m2, fab-m3, fab-m4 and fab-m5) was analyzed for binding of the sc02-401 and sc02-361 phage antibody in a direct comparison with cd33 expression. phage antibody sc02-401 showed strong binding to fab-m0, fab-m1/2 and fab-m3 and binding to fab-m5. sc02-401 did not show significant binding to primary aml blasts of the fab-m1, fab-m2, fab-m4, fab-m5a and fab-m5b type as compared to a control phage antibody cr 2428 (see table 2). phage antibody sc02-361 showed strong binding to fab-m0, fab-m1, fab-m1/2, fab-m2, fab-m3, fab-m4, fab-m5, fab-m5a and fab-m5b type as compared to a control phage antibody cr2428 (see table 3). analysis of a panel of tumor cell lines of both hematopoetic and non-hematopoetic origin revealed that expression of the antigen recognized by sc02-401 was not restricted to a subset of tumor cell lines of myeloid origin (hl-60 and nb4), since it was also expressed by other tumor cell lines, namely u937, k562, 293t, ls174t and hep-2 (see table 4). the antigen recognised by sc02-361 was detectable on tumor cell lines of myeloid origin and additionally on the tumor cell lines u937, ls174t and hep-2. flow cytometric analysis was performed by gating the lymphocyte-, monocyte- and granulocyte subpopulations on the basis of their forward- and side-scatter characteristics. the lymphocytes were further divided in b-cells and t-cells by staining the sample with an apc-conjugated anti-cd19 antibody (pharmingen) and a fitc-conjugated anti-cd3 antibody (becton dickinson). within peripheral blood, subsets of leukocytes were analyzed by staining with antibodies recognizing the cell surface antigens cd14 (fitc-labeled, becton dickinson), cd16 (fitc-labeled, pharmingen) and cd33 (apc-labelled, becton dickinson). within peripheral blood the sc02-401 phage antibody did not significantly bind to any of the subsets analyzed (see table 5). sc02-361 did recognize a subpopulation of monocytes and dendritic cells, but did not significantly bind to granulocytes, b- and t-cells, natural killer (nk) cells, erythrocytes or platelets (see table 5). in figures 1 and 2 is shown that the binding intensity of the phage antibody sc02-401 and sc02-361, respectively, to aml cells is much higher than the binding intensity of the phage antibody to different cell populations in peripheral blood of a healthy donor indicating overexpression of the antigens recognised by the antibodies in aml. the mean fluorescence of sc02-401 and sc02-361 was calculated for aml and the different cell populations. furthermore, the mean fluorescence of a control antibody (called sc02-006 and binding to thyroglobulin) was calculated for aml and the different cell populations (data not shown) and this value was deducted from the mean fluorescence value of sc02-401 or sc02-361. from these combined expression data it was concluded that the antigens recognized by sc02-401 and sc02-361 represent a good target antigen for diagnosis, prevention and/or treatment of cancer, in particular of aml. example 4 generation of cr2401 and cr2361 igg1 molecules heavy- and light chain variable regions of the scfvs sc02-401 and sc02-361 were pcr-amplified using oligonucleotides to append restriction sites and/or sequences for expression in igg expression vectors. the vl chains were amplified using the oligonucleotides 5k-c (seq id no:15) and 3k-c (seq id no:16). the pcr products were cloned into vector pcdna3.1 and the nucleotide sequences were verified according to standard techniques known to the skilled artisan. vh genes were amplified using oligonucleotides 5h-b (seq id no:17) and sy3h-a reversed (seq id no:18). thereafter, the pcr products were cloned into vector psyn-c03-hcg1 and nucleotide sequences were verified according to standard techniques known to the skilled person in the art. 5h-b acctgtcttgaattctccatggccgaggtgcagctggtggagtctg sy3h-a reversed ggggccagggcaccctggtgaccgtctccagcgctagcaccaagggc 5k-c acctgtctcgagttttccatggctgacatccagatgacccagtctccatcctccc 3k-c caagggaccaaggtggagatcaaacgtaagtgcactttgcggccgctaaggaaaa the expression constructs of the heavy and light chains were transiently expressed in 293t cells and supernatants containing igg1 antibodies were obtained. the nucleotide sequences of the heavy chain of cr2401 is shown in seq id no:19 and the amino acid sequences is shown in seq id no:20. the nucleotide sequences of the light chain of cr2401 is shown in seq id no:23 and the amino acid sequences is shown in seq id no:24. the nucleotide sequences of the heavy chain of cr2361 is shown in seq id no:21 and the amino acid sequences is shown in seq id no:22. the nucleotide sequences of the light chain of cr2361 is shown in seq id no:25 and the amino acid sequences is shown in seq id no:26. the antibodies were purified on protein-a columns and size-exclusion columns using standard purification methods used generally for immunoglobulins (see for instance wo 00/63403 ). example 5 immunoprecipitation of membrane extractable antigen recognized by cr2401 and membrane extractable antigen recognized by cr2361 to identify whether cr2401 reacted with a membrane extractable antigen, the cell surface of 10 8 ls174t cells were biotinylated during 1 hour at room temperature with a final concentration of 2 mg sulfo-nhs-lc-lc-biotin in physiological buffer (0.2 m phosphate buffer containing 0.12 m nacl, ph 7.4). subsequently, the remaining free biotin was blocked during a 30 minute incubation at room temperature with 10 mm glycine in physiological buffer. after labeling, the cells were washed with cold physiological buffer and solubilized for 30 minutes on ice at a concentration of 3x10 7 cells/ml in tx-100 lysis buffer (1% triton x-100, 150 mm nacl, 50 mm tris ph 7.4, protease inhibitors (roche)). the unsoluble material was removed by centrifugation for 30 minutes at 4°c at 20,000g. hereafter, the biotinylated solubilized lysate was pre-cleared with protein-a beads for 2 hours at 4°c. in the mean time, 4 µg of cr2401, control antibody cr2428 (negative control), and control antibody cr2300 igg1 (positive control; antibody directed against cd46, present on every nucleated cell) were coupled to protein-a beads at room temperature. next, the pre-cleared samples were incubated with the iggs coupled to the beads for 2 hours at 4°c. the protein-a beads were washed three times for 5 minutes with 1 ml of tx-100 lysis buffer and bound complexes were eluted by the addition of sample loading buffer. the samples were subjected to sds-page under non-reducing and reducing conditions. after blotting on pvdf membranes, the biotinylated proteins were detected with streptavidin-hrp (amersham) and enhanced chemoluminescence (amersham). similar steps as above were followed to identify whether cr2361 reacted with a membrane extractable antigen, with the proviso that 10 8 nb4 cells and a ripa lysis buffer containing 1% v/v triton x-100, 0.5 % w/v desoxycholate, 0.1 % w/v sds, 150 mm nacl, 50 mm tris ph 7.4, protease inhibitors (roche) were used for immunoprecipitation purposes. in the cr2401 immunoprecipitation of the ls174t cell lysate a major band at approximately 150 kda and one minor band at approximately 45 kda was detected. none of these bands were present in immunoprecipitations performed with the negative control igg1 cr2428 or the positive control igg1 cr2300 directed against cd46 (see figure 3 ). to establish wash and elution conditions for the big scale purification of immune complexes of cr2401, immunoprecipitates were subjected to washes with different concentrations of nacl 150 mm - 500 mm, and immune complexes were eluted off the protein-a beads using low (ph 2.7) or high (ph 11) ph buffers. the immune complexes were still present after washes with 500 mm nacl, whereas they became eluted at ph 11 (data not shown). in the cr2361 immunoprecipitation of the nb4 cell lysate four clear distinct bands running at approximately 30, 40, 75 and 150 kda were detected. none of these bands were present in immunoprecipitations performed with the negative control igg1 cr2428 or the positive control igg cr2300 directed against cd46 (see figure 4 ). to establish wash and elution conditions for the big scale purification of immune complexes of cr2361, immunoprecipitates were subjected to washes with different concentrations of nacl 150 mm - 500 mm, and immune complexes were eluted off the protein-a beads using low (ph 2.7) or high (ph 11) buffers. the immune complexes were still present after washed with 500 mm nacl, whereas they became eluted at ph 2.7 (data not shown). example 6 purification of the immune complexes reacting with cr2401 or cr2361 for the purification of the target antigens of cr2401 and cr2361 affinity columns were prepared by coupling 1.5 mg cr2401 or cr2361 to 1 ml cnbr activated sepharose-4b beads according to standard techniques known to the skilled artisan. in advance the igg1s were passed over a 100 kda ultracentrifugal device to remove incomplete small igg fragments. a cell lysate of 510 9 ls174t cells was prepared in tx-100 lysis buffer according to the method described in example 5. next, the cell lysate was passed through a 0.22 µm filter to remove aggregates. the cell lysate was pre-cleared for 4 hours at 4°c with 60 ml blocked cnbr activated sepharose cl-4b beads, followed by a pre-clearing step for 4 hours at 4°c with 5 ml of cnbr-activated beads to which human control igg1 was coupled (1 mg igg1/ml cappel) to clear the lysate from proteins that interact aspecifically with igg. next, the lysate was passed through a 0.22 µm filter to remove insoluble material. next, an affinity column of the negative control antibody cr2428 was prepared as described for cr2401 and connected in series to the affinity column of antibody cr2401 and an äkta fplc 900. the system was equilibrated with tx-100 buffer (1% triton x-100, 150 mm nacl, 50 mm tris ph 7.4, protease inhibitors (roche)). the lysate was applied to the columns at 1 ml/min and columns were washed with 5 column volumes tx-100 buffer followed by a salt gradient buffer from 150 mm nacl to 500 mm nacl, a wash with 5 column volumes tx-100 buffer and an elution with 5 column volumes lysine, ph 11, whereby after 1 column volume of elution buffer the flow through was put on hold for 10 minutes to enhance the release of the immune complexes. next, the column was washed again with 5 column volumes of tx-100 buffer. the eluted fractions of 0.5 ml were neutralized with 50 µl 0.1 m citric acid and 20 µl of the samples were run on a non-reducing sds-page criterion gels and stained with silver stain according to standard techniques known to the skilled artisan. the sds-page profile of the proteins eluting from the cr2401 column showed that a protein of 150 kda (indicated by the arrow) was specifically released from the column in fraction 8-10 (see figure 5 ). fraction 8 contained in addition two protein bands somewhat smaller than 150 kda (indicated with an asterix). then, fraction 8 was 5 times concentrated using ym filters and loaded on a non-reducing sds-page gel. the 150 kda band was cut out from the gels with a sharp razor and subjected to mass spectrometry analysis by maldi-ms or nano-electrospray ionization tandem ms (nanoesi-ms-ms). using maldi-ms twelve peptides were identified, i.e. feviefddgagsvlr (seq id no:27), aagtegpfqevdgvattrysigglspfseyafr (seq id no:28), tgeqapssppr (seq id no:29), iqlswllppqer (seq id no:30), vswvpppadsr (seq id no:31), ahtdvgpgpesspvlvr (seq id no:32), iisytwfr (seq id no:33), vaaamktsvllswevpdsyk (seq id no:34), gssagglqhlvsir (seq id no:35), wfyivwpidr (seq id no:36), yanviaydhsr (seq id no:37), and tgcfividamlermkhektvdiyghvtcmr (seq id no:38). one peptide, i.e. nvlelsnvvr (seq id no:39), was identified by nanoesi-ms-ms. the peptides were identified by blast analysis as being part of the human protein lar ptp (see accession number 4506311 in the nih blast database). the amino acid sequence of human lar ptp is also depicted in seq id no:40. to confirm the identification of lar ptp as the target antigen recognised by cr2401, the purified fraction 8, a negative control fraction, a positive cell lysate and the immunoprecipitation lysates of cr2428, cr2300 and cr2401 were analyzed for the presence of lar ptp using a lar ptp specific murine monoclonal antibody. the samples were subjected to sds-page under non-reducing conditions to prevent cross-reactivity with immunoglobulin bands that migrate around 55 and 25 kda. after blotting on pvdf membranes, the membranes were placed in tbst-buffer containing 4% non-fat milk powder and incubated with 1 µg/ml of the murine monoclonal antibody directed against lar ptp (bd) (in tbst/milk) for 1 hour at room temperature followed by a 3 times wash of 5 minutes in tbst. next, the membranes were incubated with horseradish conjugated rabbit anti-mouse antibody (dako) (1 µg/ml in tbst/milk) for one hour at room temperature. finally, the membranes were washed extensively in tbst followed by a pbs washing step and reactive proteins were revealed by a chemofluorescence detection system (ecl). as demonstrated in figure 6 , lar ftp was detected in the cr2401 immunoprecipitate, whereas no reactive band was observed in the negative (cr2428) and positive control (cr2300) immunoprecipitates. furthermore lar ptp was present in the cell lysate and eluted fraction, but absent in the control fraction. two additional bands of a slightly lower molecular weight also reacted with the murine anti-lar ptp antibody in the eluted fraction. these bands might represent potential lar ptp degradation products that were also observed on the silver stained gel of the eluted fractions as depicted by the asterix in figure 5 supra. for the purification of the target antigen of cr2361 an affinity column was prepared as described above for cr2401. a cell lysate of 410 9 nb4 cell was prepared in ripa buffer, according to the method described in example 5. the cell lysate was treated essentially as described above and applied to the negative control affinity column that was connected in series to the cr2361 affinity column and an akta fplc 900. the system was equilibrated with ripa buffer. the lysate was applied to the columns at 1 ml/min and the columns were washed with 5 column volumes of ripa buffer, followed by a salt gradient from 150 mm nacl to 500 mm nacl, a wash with 5 column volumes tx-100 buffer (1% triton x-100, 150 mm nacl, 50 mm tris ph 7.4, protease inhibitors (roche)) and an elution of 5 column volumes glycine, ph 2.7, whereby after 1 column volume of elution buffer the flow through was put for 10 minutes on hold to enhance the release of immune complexes. next, the column was washed with 5 column volumes of tx-100 buffer. the eluted fractions of 0.5 ml were neutralized with 20 µl 2 m tris/hcl, ph 7.4, and 20 µl of the samples were run on a non-reducing sds-page criterion gel and stained with silver stain according to standard techniques known to the skilled artisan. the sds-page profile of the proteins eluting from the cr2361 column shows that proteins with a molecular weight of 30, 40, 75 and 150 kda (indicated by the arrows and the letters e, f, g and h in figure 7 ) were released from the column. the four bands were cut out from the gels with a sharp razor, destained, and digested in the gel using trypsin. the conditions used were according to pappin et al. briefly, destaining was performed using a freshly prepared 1/1 mixture of 30 mm potassium ferricyanide (k 3 fe(cn)6) and 100 mm sodium thiosulfate (na 2 so 3 ). the gel bands were washed three times with 50 mm nh 4 hco 3 in 30% acetonitril and subsequently dried by incubation with pure acetonitril. the tryptic digest was performed overnight at 37°c (75 ng trypsin in 4,2 µl 5 mm tris, ph 8). after digestion, the peptides were eluted with 60% acetonitril and 1% tfa. the samples were desalted using c18-ziptips (millipore) according to the manufacturer's instructions. the eluted peptides were mixed 1:1 with a solution of maldi matrix (2,5-dihydroxybenzoic acid (dhb): 2-hydroxy-5-methoxybenzoic acid 9:1) and analyzed by maldi-ms (voyager str, applied biosystems). the resulting peptide masses were used for database search against the ncblnr database using the software profound (genomic solutions). several peptides were identified from the 30, 40, and 75 kda proteins. no peptides were identified from the 150 kda protein. peptides identified from the 30kda band were mswlfgink (seq id no:41), tlseetr (seq id no:42), qtvlesirtagtlfgegfr (seq id no:43), and lgkpslvr (seq id no:44). peptides identified from the 40kda band were wsnfdptgler (seq id no:45), itvlealr (seq id no:46), and csevarltegmsgr (seq id no:47). peptides identified from the 75 kda band were aarelehsr (seq id no:48), qryedqlk (seq id no:49), diaiatr (seq id no:50), atlnaflyr (seq id no:51), myfdkyvlkpategk (seq id no:52), laqfdygr (seq id no:53), and vqdavqqhqqkmcwlkaegpgr (seq id no:54). peptides identified from the 30 and 40 kda bands were glgdrpapk (seq id no:55), atveremelr (seq id no:56), aerenadiir (seq id no:57), natlvagr (seq id no:58), and nilmygppgtgk (seq id no:59). finally, the peptides identified from the 30, 40 and 75 kda band were gegagpppplppaqpgaegggdr (seq id no:60) and qqqllneenlr (seq id no:61). the peptides were identified by blast analysis as being part of a human protein having the amino acid sequence seq id no:6 (see accession number aah63607 in the nih blast database). this protein has been given the name atad3a, but no function has been assigned to the protein. the nucleotide sequence of atad3a has the nucleotide sequence of seq id no:5. to confirm the identification of atad3a as the target antigen recognised by cr2361, mrna was extracted from 210 7 nb4 cells using the nucleotrap mrna mini purification kit (beckton dickinson) according to protocols provided by the manufacturer. then, rt-pcr was performed on the mrna isolated. for the pcr, the following primers were designed: forward primer 5'-gtgcgagcatgtcgtggc-3' (seq id no:62) and reverse primer 5'-ggagatccacagctcacgg-3' (seq id no:63). pcr was performed with pfu (promega) in the presence of 5% dmso and resulted in a 1800 bp product. the resulting fragment was cloned in the pcr4topo vector (invitrogen) and transformed into dh5a cells. the resulting clone was verified by sequence analysis and aligned with the sequence present in the database. the protein construct was subsequently digested with ecori and cloned in the corresponding sites ofpcdna3.1zeo, to create construct atad3apcdna3.1zeo. to simplify the detection of the protein in the subsequent transfection experiments, the protein was fused with a myc tag at the 5'prime or 3'prime end by means of pcr (using the construct as a template). for the 5'myc construct the following primers were designed: forward primer 5'-cgggatccagcatggaacaaaaacttatttctgaagaagatctgtcgtggctctt cggcattaacaag-3'(seq id no:64) and reversed primer 5'-cggaattcgactcaggatggggaaggc-3' (seq id no:65). for the 3'myc construct the primers were constructed in such a way that the protein became in frame with the myc tag in pcdna3myca. in that case the forward primer was 5'-cgggatcctgcgagcatgtcgtggc-3' (seq-id no:66) and the reverse primer was 5'-gctctagaggatggggaaggctcg-3'(seq id no:67). pcr was performed using pfu polymerase and the resulting fragment of the 5'myc tag was cloned bamhi/ecori in pcdna3.1zeo vector (invitrogen) resulting in the mycatad3a construct, whereas the resulting fragment for the 3'myc tag was cloned bamhi/xbai in pcdna3.1/hismyca (invitrogen) resulting in the atad3amyc construct. the constructs were verified by sequencing. all cloning procedures were performed according to standard molecular techniques known to a person skilled in the art. 210 7 hek293t cells were transfected using the fugene (roche) reagent according to protocols provided by the manufacturer with the expression constructs described supra , i . e . atad3a, mycatad3a, atad3amyc and a positive control construct expressing the cell surface receptor cd38. 72 hours after transfection, cells were harvested and stained for facs analysis with the phage antibody sc02-361 as described in example 3 supra. the stained cells were analyzed by flow cytometry, but sc02-361 did not stain any transfectants indicating that the protein was not expressed on the surface of the cell. however, western blot analysis on cell lysates of the transfected cells using an anti-myc antibody according to procedures known to a skilled person in the art revealed that the protein was expressed, probably inside the cell. next, hek93t cells transfected with atad3a, mycatad3a and atad3amyc constructs were lysed in 1% triton x-100 buffer followed by biotinylation of the cell lysate and immunoprecipitation with cr2361 and control antibodies cr2300 and cr2428 as described supra. immunoblots developed with anti-myc demonstrated that protein that was 3' or 5' myc-tagged and present in the cytoplasmic fraction was immunoprecipitated by cr2361 and not by the control antibodies (see figure 8 ). immunoprecipitations with biotinylated complete cell lysates of nb4 cells and hek293t transfected cells revealed that the molecular weight of the cloned protein corresponded with a band present at 75 kda (see figure 9 ). table-tabl0001 table 1: nucleotide and amino acid sequence of the scfvs and vh and vl gene identity. name scfv seq id no of nucleotide sequence seq id no of amino acid sequence cdr3 vh-germline vl-germline sc02-401 seq id no:11 seq id no:12 ddtptsdygfds (seq id no:1) 3-20 (dp-32) vk i (012/02 - dpk9) sc02-361 seq id no:13 seq id no:14 wapshsfdy (seq id no:2) 3-43 (dp-33) vki (o12/02 - dpk9) table-tabl0002 table 2: flow cytometry analysis of binding of sc02-401 to various aml samples. fab cases positive (%) cd33 m0 100 (1#/1) 100 (1#/1) m1 25 (1/4) 100 (4/4) m/2 100 (1/1) 100 (1/1) m2 0 (0/4) 100 (4/4) m3 100 (1/1) 100 (1/1) m4 20 (1/5) 100 (5/5) m5 50 (2/4) 75 (3/4) m5a 33 (1/3) 100 (3/3) m5b 0 (0/1) 100 (1/1) unclassified 0 (0/4) 75 (3/4) all 8/28 26/28 percentage (%) 29 93 # number of positive cases; a sample was considered positive if more than 20% of the blast population stained with sc02-401 or anti-cd33 antibody. number of cases tested. table-tabl0003 table 3: flow cytometry analysis of binding of sc02-361 to various aml samples. fab % positive cases cd33 m0 100 (1#/1) 100 (1#/1) m1 67 (2/3) 100 (3/3) m/2 100 (1/1) 100 (1/1) m2 75 (3/4) 100 (4/4) m3 100 (1/1) 100 (1/1) m4 60 (3/5) 100 (5/5) m5 75 (3/4) 75 (3/4) m5a 66 (2/3) 100 (3/3) m5b 100 (1/1) 100 (1/1) unclassified 100 (3/3) 67 (2/3) all 20/26 24/26 percentage (%) 77 92 # number of positive cases; a sample was considered positive if more than 20% of the blast population stained with the sc02-361 antibody or anti-cd33 antibody. * number of cases tested. table-tabl0004 table 4: analysis of tumor cell lines of hematopoetic and non-hematopoetic origin for reactivity with sc02-401 and sc02-361. cell line origin sc02-401 reactivity sc02-361 reactivity hl-60 acute myeloid leukemia + +/- nb4 acute promyelocytic leukemia + + u937 histiocytic lymphoma +/- +/- k562 erythroid leukemia + - 293t embryonal kidney + - ls174t colon adenocarcinoma + +/- hep-2 cervix epithelial cells + +/- reactivity <5% = -; reactivity 5-25% = +/-; reactivity 25-75% = +; reactivity >75% = ++ table-tabl0005 table 5. expression of antigens recognized by sc02-401 and sc02-361 on subsets of peripheral blood as analyzed by facs. sc02-401 reactivity sc02-361 reactivity monocytes - s 1 + granulocytes - - b cells - - t cells - - dendritic cells - s 2 + natural killer cells - - erythrocytes - - platelets - - s 1 +: 50% of the cells positive; s 2 +: 40% of the cells positive references boel-e, verlaan-s, poppelier mj, westerdaal na, van strijp ja and logtenberg t (2000), functional human monoclonal antibodies of all isotypes constructed from phage display library-derived single-chain fv antibody fragments. j. immunol. methods 239:153-166 . burton dr and barbas cf (1994), human antibodies from combinatorial libraries. adv. immunol. 57:191-280 . de kruif j, terstappen l, boel e and logtenberg t (1995a), rapid selection of cell subpopulation-specific human monoclonal antibodies from a synthetic phage antibody library. proc. natl. acad. sci. usa 92:3938 . de kruif j, boel e and logtenberg t (1995b), selection and application of human single chain fv antibody fragments from a semi-synthetic phage antibody display library with designed cdr3 regions. j. mol. biol. 248:97 . huls g, heijnen ij, cuomo e, van der linden j, boel e, van de winkel j and logtenberg t (1999), antitumor immune effector mechanisms recruited by phage display-derived fully human igg1 and iga1 monoclonal antibodies. cancer res. 59: 5778-5784 . pappin, djc, hojrup p and bleasby a (1993), rapid identification of proteins by peptide-mass fingerprinting. curr. biol. 3:327-332 . streuli m, krueger nx, hall lr, schlossman sf, and saito h (1988) a new member of the immunoglobulin superfamily that has a cytoplasmic region homologous to the leukocyte common antigen. j. exp.med. 168:1523-1530 . streuli m, krueger nx, ariniello pd, tang m, munro jm, blattler wa, adler da, disteche cm, saito h (1992) expression of the receptor-linked protein tyrosine phosphatase lar: proteolytic cleavage and shedding of the cam-like extracellular region. embo j. 11:897-907 . sequence listing <110> crucell holland b.v. geuijen, cecilia a.w. de kruif, cornelis a. <120> binding molecules for treatment and detection of cancer <130> 0113 ep 01 div <160> 67 <170> patentin version 3.1 <210> 1 <211> 12 <212> prt <213> artificial sequence <220> <223> hcdr3 sc02-401 <400> 1 <210> 2 <211> 9 <212> prt <213> artificial sequence <220> <223> hcdr3 sc02-361 <400> 2 <210> 3 <211> 121 <212> prt <213> artificial sequence <220> <223> variable heavy chain sc02-401 <400> 3 <210> 4 <211> 118 <212> prt <213> artificial sequence <220> <223> variable heavy chain sc02-361 <400> 4 <210> 5 <211> 1761 <212> dna <213> homo sapiens <220> <221> cds <222> (1)..(1761) <223> <400> 5 <210> 6 <211> 586 <212> prt <213> homo sapiens <400> 6 <210> 7 <211> 100 <212> prt <213> artificial sequence <220> <223> variable light chain sc02-401 <400> 7 <210> 8 <211> 100 <212> prt <213> artificial sequence <220> <223> variable light chain sc02-361 <400> 8 <210> 9 <211> 363 <212> dna <213> artificial sequence <220> <223> variable heavy chain sc02-401 <400> 9 <210> 10 <211> 354 <212> dna <213> artificial sequence <220> <223> variable heavy chain sc02-361 <400> 10 <210> 11 <211> 741 <212> dna <213> artificial sequence <220> <223> sc02-401 <220> <221> cds <222> (1)..(741) <223> <400> 11 <210> 12 <211> 247 <212> prt <213> artificial sequence <220> <223> sc02-401 <400> 12 <210> 13 <211> 732 <212> dna <213> artificial sequence <220> <223> sc02-361 <220> <221> cds <222> (1)..(732) <223> <400> 13 <210> 14 <211> 244 <212> prt <213> artificial sequence <220> <223> sc02-361 <400> 14 <210> 15 <211> 55 <212> dna <213> artificial sequence <220> <223> oligonucleotide 5k-c <400> 15 acctgtctcg agttttccat ggctgacatc cagatgaccc agtctccatc ctccc 55 <210> 16 <211> 55 <212> dna <213> artificial sequence <220> <223> oligonucleotide 3k-c <400> 16 caagggacca aggtggagat caaacgtaag tgcactttgc ggccgctaag gaaaa 55 <210> 17 <211> 46 <212> dna <213> artificial sequence <220> <223> oligonucleotide 5h-b <400> 17 acctgtcttg aattctccat ggccgaggtg cagctggtgg agtctg 46 <210> 18 <211> 47 <212> dna <213> artificial sequence <220> <223> oligonucleotide sy3h-a reversed <400> 18 ggggccaggg caccctggtg accgtctcca gcgctagcac caagggc 47 <210> 19 <211> 1353 <212> dna <213> artificial sequence <220> <223> heavy chain cr2401 <220> <221> cds <222> (1)..(1353) <223> <400> 19 <210> 20 <211> 451 <212> prt <213> artificial sequence <220> <223> heavy chain cr2401 <400> 20 <210> 21 <211> 1344 <212> dna <213> artificial sequence <220> <223> heavy chain cr2361 <220> <221> cds <222> (1)..(1344) <223> <400> 21 <210> 22 <211> 448 <212> prt <213> artificial sequence <220> <223> heavy chain cr2361 <400> 22 <210> 23 <211> 642 <212> dna <213> artificial sequence <220> <223> light chain cr2401 <220> <221> cds <222> (1)..(642) <223> <400> 23 <210> 24 <211> 214 <212> prt <213> artificial sequence <220> <223> light chain cr2401 <400> 24 <210> 25 <211> 642 <212> dna <213> artificial sequence <220> <223> light chain cr2361 <220> <221> cds <222> (1)..(642) <223> <400> 25 <210> 26 <211> 214 <212> prt <213> artificial sequence <220> <223> light chain cr2361 <400> 26 <210> 27 <211> 15 <212> prt <213> artificial sequence <220> <223> peptide <400> 27 <210> 28 <211> 33 <212> prt <213> artificial sequence <220> <223> peptide <400> 28 <210> 29 <211> 11 <212> prt <213> artificial sequence <220> <223> peptide <400> 29 <210> 30 <211> 12 <212> prt <213> artificial sequence <220> <223> peptide <400> 30 <210> 31 <211> 11 <212> prt <213> artificial sequence <220> <223> peptide <400> 31 <210> 32 <211> 17 <212> prt <213> artificial sequence <220> <223> peptide <400> 32 <210> 33 <211> 9 <212> prt <213> artificial sequence <220> <223> peptide <400> 33 <210> 34 <211> 20 <212> prt <213> artificial sequence <220> <223> peptide <400> 34 <210> 35 <211> 14 <212> prt <213> artificial sequence <220> <223> peptide <400> 35 <210> 36 <211> 11 <212> prt <213> artificial sequence <220> <223> peptide <400> 36 <210> 37 <211> 11 <212> prt <213> artificial sequence <220> <223> peptide <400> 37 <210> 38 <211> 30 <212> prt <213> artificial sequence <220> <223> peptide <400> 38 <210> 39 <211> 10 <212> prt <213> artificial sequence <220> <223> peptide <400> 39 <210> 40 <211> 1897 <212> prt <213> homo sapiens <400> 40 <210> 41 <211> 9 <212> prt <213> artificial sequence <220> <223> peptide <400> 41 <210> 42 <211> 7 <212> prt <213> artificial sequence <220> <223> peptide <400> 42 <210> 43 <211> 19 <212> prt <213> artificial sequence <220> <223> peptide <400> 43 <210> 44 <211> 8 <212> prt <213> artificial sequence <220> <223> peptide <400> 44 <210> 45 <211> 11 <212> prt <213> artificial sequence <220> <223> peptide <400> 45 <210> 46 <211> 8 <212> prt <213> artificial sequence <220> <223> peptide <400> 46 <210> 47 <211> 14 <212> prt <213> artificial sequence <220> <223> peptide <400> 47 <210> 48 <211> 9 <212> prt <213> artificial sequence <220> <223> peptide <400> 48 <210> 49 <211> 8 <212> prt <213> artificial sequence <220> <223> peptide <400> 49 <210> 50 <211> 7 <212> prt <213> artificial sequence <220> <223> peptide <400> 50 <210> 51 <211> 9 <212> prt <213> artificial sequence <220> <223> peptide <400> 51 <210> 52 <211> 15 <212> prt <213> artificial sequence <220> <223> peptide <400> 52 <210> 53 <211> 8 <212> prt <213> artificial sequence <220> <223> peptide <400> 53 <210> 54 <211> 22 <212> prt <213> artificial sequence <220> <223> peptide <400> 54 <210> 55 <211> 9 <212> prt <213> artificial sequence <220> <223> peptide <400> 55 <210> 56 <211> 10 <212> prt <213> artificial sequence <220> <223> peptide <400> 56 <210> 57 <211> 10 <212> prt <213> artificial sequence <220> <223> peptide <400> 57 <210> 58 <211> 8 <212> prt <213> artificial sequence <220> <223> peptide <400> 58 <210> 59 <211> 12 <212> prt <213> artificial sequence <220> <223> peptide <400> 59 <210> 60 <211> 23 <212> prt <213> artificial sequence <220> <223> peptide <400> 60 <210> 61 <211> 11 <212> prt <213> artificial sequence <220> <223> peptide <400> 61 <210> 62 <211> 18 <212> dna <213> artificial sequence <220> <223> forward primer <400> 62 gtgcgagcat gtcgtggc 18 <210> 63 <211> 19 <212> dna <213> artificial sequence <220> <223> reverse primer <400> 63 ggagatccac agctcacgg 19 <210> 64 <211> 68 <212> dna <213> artificial sequence <220> <223> forward primer <400> 64 <210> 65 <211> 27 <212> dna <213> artificial sequence <220> <223> reverse primer <400> 65 cggaattcga ctcaggatgg ggaaggc 27 <210> 66 <211> 25 <212> dna <213> artificial sequence <220> <223> forward primer <400> 66 cgggatcctg cgagcatgtc gtggc 25 <210> 67 <211> 24 <212> dna <213> artificial sequence <220> <223> reverse primer <400> 67 gctctagagg atggggaagg ctcg 24
042-910-072-540-855	US	[ "DK", "DE", "EP", "JP", "AU", "GR", "AT", "WO", "ES", "US" ]	C12P21/00,C12N15/09,C12P19/34,C12P21/02	1991-10-11T00:00:00	1991	[ "C12" ]	coupled transcription and translation in eukaryotic cell-free extract.	a method for coupling transcription and translation from dna using a solution comprising a eukaryotic cell-free extract comprising adding a sufficient amount of a magnesium compound to the extract to raise the magnesium concentration to a level where rna is transcribed from dna and rna translates into protein.	a method of carrying out transcription and translation from dna in eukaryotic cell-free extract comprising adjusting the magnesium concentration of said extract to a level such that transcription and translation are coupled in the sense that rna is transcribed from dna and, simultaneously therewith, rna translates into protein. the method of claim 1 wherein said extract is rabbit reticulocyte lysate. the method of claim 2 wherein said final magnesium concentration is about 2.5 mm to about 3.5 mm. the method of claim 2 wherein said final magnesium concentration is about 2.6mm to about 3.0 mm. the method of claim 2 wherein a polyamine is added to said lysate. the method of claim 5 wherein said polyamine is spermidine. the method of claim 6 wherein said spermidine is added to said lysate to a concentration of about 0.2 mm to about 0.4 mm. the method of claim 2 wherein the potassium concentration of said lysate is adjusted to about 40 mm to about 100 mm. the method of claim 2 including adding a sufficient amount of a ribonuclease inhibitor to said lysate to effectively inactivate endogenous ribonucleases. the method of claim 9 wherein said ribonuclease inhibitor is rnasin. the method of claim 2 wherein an rna polymerase is added to the lysate. the method of claim 11 wherein said polymerase is selected from the group consisting of sp6, t7 and t3 rna polymerases. the method of claim 2 wherein a dna template is added to said lysate. the method of claim 13 wherein said dna template has a multiple cloning region. the method of claim 14 wherein a polymerase promoter sequence is located at one end of said multiple cloning region. the method of claim 15 wherein said template has a poly a sequence at the opposite end of said multiple cloning region, so that cloning into said multiple cloning region produces a gene that is flanked by an rna polymerase promoter at the 5' end and a poly a sequence at the 3' end. the method of claim 15 wherein the polymerase corresponding to said promoter sequence is added to said lysate. the method of claim 13 wherein said dna template is in a form which is selected from the group consisting of a supercoiled molecule, a covalently closed circular molecule, a linear molecule or a dna segment made by the process known as a polymerase chain reaction. the method of claim 2 including adding an amount of ribonucleotide triphosphates to said lysate. the method of claim 19 wherein 0.4 mm of each of said ribonucleotide triphosphates are added to said lysate. the method of claim 1 wherein said extract is wheat germ extract. the method of claim 21 wherein said final magnesium concentration is about 3.0 mm to about 5.25 mm. the method of claim 21 wherein said final magnesium concentration is about 4.0 mm to about 4.75 mm. the method of claim 21 wherein a polyamine is added to said extract. the method of claim 24 wherein said polyamine is spermidine. the method of claim 25 wherein said spermidine is added to said extract to a concentration of about 0.2 mm to about 0.9 mm. the method of claim 21 wherein the potassium concentration of said extract is adjusted to about 50 mm to about 150 mm. the method of claim 21 including adding a sufficient amount of a ribonuclease inhibitor to said lysate to effectively inactivate endogenous ribonucleases. the method of claim 28 wherein said ribonuclease inhibitor is rnasin. the method of claim 21 wherein an rna polymerase is added to the extract. the method of claim 30 wherein said polymerase is selected from the group consisting of sp6, t7 and t3 rna polymerases. the method of claim 21 wherein a dna template is added to said extract. the method of claim 32 wherein said dna template has a multiple cloning region. the method of claim 33 wherein a polymerase promoter sequence is located at one end of said multiple cloning region. the method of claim 34 wherein said template has a poly a sequence at the opposite end of said multiple cloning region, so that cloning into said multiple cloning region produces a gene that is flanked by an rna polymerase promoter at the 5' end and a poly a sequence at the 3' end. the method of claim 34 wherein the polymerase corresponding to said promoter sequence is added to said extract. the method of claim 32 wherein said dna template is in a form which is selected from the group consisting of a supercoiled molecule, a covalently closed circular molecule, a linear molecule or a dna segment made by the process known as a polymerase chain reaction. the method of claim 21 including adding an amount of ribonucleotide triphosphates to said extract. the method of claim 38 wherein said ribonucleotide triphosphates are added to said extract at the levels of 0.4 mm ctp, 0.4 mm utp, 0.5 mm gtp and 1.6 mm atp. a process for producing protein from a dna template having a specific polymerase promoter sequence through coupled transcription and translation in a solution, said process comprising the steps of preparing a solution of a standard preparation of a eukaryotic cell-free extract containing said dna template, modifying said extract solution with sufficient concentrations of ribonucleotide triphosphates, amino acids and the polymerase corresponding to said promoter sequence of said template dna to support transcription and translation, and adjusting the final magnesium concentration of the extract solution to a level where rna is transcribed from said dna template and, simultaneously therewith, rna so transcribed translates into protein. the method of claim 40 wherein the final concentration of magnesium in said extract solution mixture is raised by about 0.5 mm. the method of claim 40 wherein said extract is rabbit reticulocyte lysate. the method of claim 42 wherein said final magnesium concentration is about 2.5 mm to about 3.5 mm. the method of claim 42 wherein said final magnesium concentration is about 2.6 mm to about 3.0 mm. the method of claim 42 wherein a polyamine is added to said solution. the method of claim 45 wherein said polyamine is spermidine. the method of claim 46 wherein said spermidine is added to said solution to a concentration of about 0.2 mm to about 0.4 mm. the method of claim 42 wherein the potassium concentration of said solution is adjusted to about 40 mm to about 100 mm. the method of claim 42 including adding a sufficient amount of a ribonuclease inhibitor to said solution to effectively inactivate endogenous ribonucleases. the method of claim 49 wherein said ribonuclease inhibitor is rnasin. the method of claim 42 wherein said polymerase is selected from the group consisting of sp6, t7 and t3 rna polymerases. the method of claim 42 wherein said dna template is in a form which is selected from the group consisting of a supercoiled molecule, a covalently closed circular molecule, a linear molecule or a dna segment made by the process known as a polymerase chain reaction. the method of claim 42 wherein said dna template has a multiple cloning region. the method of claim 53 wherein a polymerase promoter sequence is located at one end of said multiple cloning region. the method of claim 54 wherein said template has a poly a sequence at the opposite end of said multiple cloning region, so that cloning into said multiple cloning region produces a gene that is flanked by an rna polymerase promoter at the 5' end and a poly a sequence at the 3' end. the method of claim 42 wherein 0.4 mm of each of said ribonucleotide triphosphates are added to said solution. the method of claim 40 wherein said extract is wheat germ extract. the method of claim 57 wherein said final magnesium concentration is about 3.0 mm to about 5.25 mm. the method of claim 58 wherein said final magnesium concentration is about 4.0 mm to about 4.74 mm. the method of claim 57 wherein a polyamine is added to said solution. the method of claim 60 wherein said polyamine is spermidine. the method of claim 61 wherein said spermidine is added to said solution to a concentration of about 0.2 mm to about 0.9 mm. the method of claim 57 wherein the potassium concentration of said solution is adjusted to about 50 mm to about 150 mm. the method of claim 57 including adding a sufficient amount of a ribonuclease inhibitor to said solution to effectively inactivate endogenous ribonucleases. the method of claim 64 wherein said ribonuclease inhibitor is rnasin. the method of claim 57 wherein said polymerase is selected from the group consisting of sp6, t7 and t3 rna polymerases. the method of claim 57 wherein said dna template is in a form which is selected from the group consisting of a supercoiled molecule, a covalently closed circular molecule, a linear molecule or a dna segment made by the process known as polymerase chain reaction. the method of claim 57 wherein said dna template has a multiple cloning region. the method of claim 68 wherein a polymerase promoter sequence is located at one end of said multiple cloning region. the method of claim 69 wherein said template has a poly a sequence at the opposite end of said multiple cloning region, so that cloning into said multiple cloning region produces a gene that is flanked by an rna polymerase promoter at the 5' end and a poly a sequence at the 3' end. the method of claim 57 wherein said ribonucleotide triphosphates are added to said solution at the levels of 0.4 mm ctp, 0.4 mm utp, 0.5 mm gtp and 1.6 mm atp. the method of claim 1 wherein said transcription and translation are coupled in a batch reaction. the method of claim 40 wherein said transcription and translation are coupled in a batch reaction. a method for carrying out transcription and translation in a eukaryotic cell-free extract to produce protein, said method comprising adding a dna template to said extract, adding ribonucleotide triphosphates to said extract, adding a rna polymerase to said extract, and adjusting the magnesium concentration of the extract to a level such that transcription and translation are coupled in the sense that rna is transcribed from said template dna and, simultaneously therewith, rna so transcribed translates into said protein. a kit for producing protein from a dna template through coupled transcription and translation, said kit comprising the following components: eukaryotic cell-free extract, ribonucleotide triphosphates, rna polymerase, and magnesium at a concentration such that, when the kit components are mixed ready for use in a method according to claim 1, the final magnesium concentration in the mixture is at a level at which rna is transcribed from dna and rna translates into protein. a kit as set forth in claim 75 wherein said extract is rabbit reticulocyte lysate. a kit as set forth in claim 76 wherein said magnesium has a concentration of about 2.5mm to about 3.5mm. a kit as set forth in claim 75 wherein said extract is wheat germ extract. a kit as set forth in claim 78 wherein said magnesium has a concentration of about 3.0mm to about 5.25mm. a kit as set forth in claim 75 and further comprising a polyamine. a kit as set forth in claim 75 and further comprising amino acids. a eukaryotic cell-free extract for producing protein from a dna template through coupled transcription and translation, said extract comprising: lysed cells selected from the group of eukaryotic cells, ribonucleotide triphosphates, rna polymerase, and a magnesium concentration such that when the extract is used for carrying out the method of according to claim 1, the final magnesium concentration is such that rna is transcribed from the dna template and rna translates into protein.	background of the invention this invention relates generally to molecular biology, and more particularly, to a new method allowing coupling of the transcription of rna from a template dna and the translation of the rna in eukaryotic cellular lysates or other extracts. the steps involved in the transcription and translation (expression) of genes in cells are very complex and are not yet completely understood. there is a basic pattern that must be followed, however, for protein to be produced from dna. the dna is first transcribed into rna, and then the rna is translated by the interaction of various cellular components into protein. in prokaryotic cells (bacteria) transcription and translation are "coupled", meaning that rna is translated into protein during the time that it is being transcribed from the dna. in eukaryotic cells (animals, plants) the two activities are separate, making the overall process much more complicated. dna is transcribed into rna inside the nucleus of the cell, but the rna is further processed into mrna and then transported outside the nucleus to the cytoplasm where it is translated into protein. the ability of molecular biologists to isolate and clone genes, as well as their ability to isolate particular mrnas or "messages" from cells, has brought about the need for systems which can be used to express these genes or messages. the expression of a gene is important in the overall understanding of its function and regulation. methods are now available for rapid expression of proteins, making it possible to manipulate genes and then study the effect of the manipulations on their function. the amount of protein to be produced, whether the gene is prokaryotic or eukaryotic and the relative merits of an in vitro cell-free or an in vitro whole-cell system, are some of the factors considered by researchers when selecting an expression system. the choice of a system is influenced by the gene being studied. for the most part, a prokaryotic gene is expressed best in a prokaryotic system, and a eukaryotic gene is more efficiently and accurately expressed in a eukaryotic system. this is because of the many regulatory sequences and promoters that are recognized more efficiently in a like system. the expression of genes can be achieved in both in vitro whole-cell and in vitro cell-free systems. in vitro transcription systems using prokaryotic or eukaryotic cells are available, however, these systems are difficult to work with since intact cells are used. in vitro cell-free systems, on the other hand, are made from cell-free extracts produced from prokaryotic or eukaryotic cells that contain all the necessary components to translate dna or rna into protein. cell-free extracts can be prepared from prokaryotic cells such as e. coli and from eukaryotic cells such as rabbit reticulocytes and wheat germ. cell-free systems are very popular because there are standard protocols available for their preparation and because they are commercially available from a number of sources. e. coli s30 cell-free extracts were first described by zubay, g. (1973, ann. rev. genet. vol 7, p. 267). these can be used when the gene to be expressed has been cloned into a vector containing the appropriate prokaryotic regulatory sequences, such as a promoter and ribosome binding site. prokaryotic e. coli cell-free systems are considered "coupled" because transcription and translation occur simultaneously after the addition of dna to the extract. the use of rna as a template in e. coli extracts results in protein production but such a reaction is not coupled. rabbit reticulocyte lysates and wheat germ extracts are used preferably for the expression of eukaryotic genes or mrna. both systems require the use of rna as the template for protein translation because, as previously mentioned, eukaryotic systems are not coupled. rabbit reticulocyte lysate was described by pelham, h.r.b. and jackson, r.j. (1976, eur. j. biochem. vol. 67, p.247). this expression system is probably the most widely used cell-free system for in vitro translation, and is used in the identification of mrna species, the characterization of their products, the investigation of transcriptional and translational control. processing events, such as signal peptide cleavage and core glycosylation, are examined by adding canine microsomal membranes to a standard translation reaction (walter, p. and blobel, g. (1983) meth. enzymol, 96 84). rabbit reticulocyte lysate also contains a variety of post-translational processing activities, including acetylation, isoprenylation, proteolyis and some phosphorylation activity (glass, c.a. and pollard, k.m. (1990) promega notes 26). wheat germ extract was described by roberts, b.e. and paterson, b.m. (1973, proc. natl. acad. sci. usa, vol. 70, p. 2330). cell-free extracts of wheat germ support the translation in vitro of a wide variety of viral and other prokaryotic rnas, as well as eukaryotic mrnas. (anderson, c., et al. (1983) meth, enzymol, 101, 635). generally, it is found necessary to include a ribonuclease inhibitor in the reaction mix of a wheat germ translation system, as ribonuclease activities in wheat germ extract are present. rna for translational studies is obtained by either isolating mrna or by making in vitro rna transcripts from dna that has been cloned into a vector containing an rna polymerase promoter. the final method isolates mrna or "message" directly from cells. the second obtains rna for in vitro translation by in vitro transcription. in vitro transcription of cloned dna behind phage polymerase promoters was described by krieg, p. and melton, d (1984, nucl. acids res. , vol. 12, p. 7057). this has become a standard method for obtaining rna from cloned genes for use in in vitro translation reactions. this method requires that the dna or gene of interest be cloned into a vector containing a promoter for one of the following rna polymerases, sp6, t7 or t3. the vector is then linearized at the 3' end of the cloned gene using a restriction enzyme, followed by an in vitro transcription reaction to make rna transcripts. a number of vectors containing the sp6, t7 and t3 rna polymerase promoters are commercially available and are widely used for cloning dna. in any case, the process of obtaining rna transcripts for use in rabbit reticulocyte lysate or wheat germ systems introduces a variable which can affect the efficiency of the translation reaction. extra care must always be taken when working with rna as it is easily degraded by ribonucleases. dna templates are much more stable. after rabbit reticulocyte lysate and wheat germ extract were developed as cell-free translation systems, attempts were made to couple transcription and translation. one system that was developed was a "linked" transcription and translation system (roberts, b.e., et al. (1975), proc. natl. acad. sci. usa, vol 72, 1922-1926). this system involved the use of wheat germ extract and looked at transcription and translation of sv40 viral dna using e. coli rna polymerase. in this system transcription occurs in 15 minute incubation step just prior to the addition of the wheat germ extract. the steps are separated because of incompatibility between the buffer conditions necessary for transcription and those necessary for translation, and also because of the different temperature requirements for both processes. this system has a number of drawbacks. one is the lack of control over which protein product is produced, as a number of different proteins are synthesized simultaneously from the same sv40 dna template. although the authors of that study indicated that a coupled system had been developed no data for a coupled system was shown. another system was developed by pelham, h.r.b, et al. (1978), eur. j. biochem. , vol. 82, 199-209, where coupled transcription and translation occurred after the introduction of vaccinia viral core particles into rabbit reticulocyte lysate. the production of vaccinia proteins from the viral dna was presumably due to transcription by the endogenous vaccinia rna polymerase and subsequent translation by the lysate. this system was limited by the fact that only vaccinia proteins would be produced while exogenous dna from sources other than vaccinia would not be recognized by the rna polymerase and therefore no transcription or translation could occur. viral core particles had to be isolated, and the authors were unable to exclusively produce a single protein. work has also been described using "continuous" cell-free in vitro translation systems with the emphasis on large scale production of protein. one example of such a method is diclosed in wo-a-91/02076. continuous systems are very different than the more common batch type, or static, in vitro cell-free translation reactions which occur in a contained reaction volume. continuous translation involves a bioreactor (such as an amicon 8mc ultrafiltration unit) in which large scale reactions are set up and protein is "continually" translated over extended periods of time. the reaction requires that a buffer be fed into the reaction as it progresses, and also requires that the products of translation be removed from the reaction filter unit. this type of system works well with e. coli s30 extract and wheat germ extract when rna template is introduced. see spirin, et al. (1988) science , vol 242, 1162-1164. the system also works using rna templates in rabbit reticulocyte lysate. see ryabova, et al. (1989) nucl.acid res., vol.17, no.11, 4412. the system is also known to work well with dna templates in e. coli s30 extracts. see baranov, et al. (1989) gene , vol 84, 463-466. the continuous process described in wo-a-91/02076 produces protein from dna templates in eukaryotic cell-free extracts. the process uses a reaction container comprising a membrane, and involves continuous addition of reagents and removal of products. the concentrations of the reagents required for transcription and translation change over the course of the reaction. additionally, this process utilises high levels of rna polymerase. continuous reactions are performed variously from tens of hours up to around one hundred hours, and require a substantial investment of time and resources to set up and run. translation in a "continuous" system is also directed towards producing large amounts of protein, and differs substantially from standard (static) in vitro translation reactions. static reactions can be run in a small reaction volume, typically measured in microliters, and are often completed in one or two hours. a static translation reaction is not directed towards producing preparative amounts (milligrams) of proteins. a static reaction is generally used to produce protein for investigative applications, such as the identification and characterization of mrna species, or studies of transcriptional or translation control. none of the rabbit reticulocyte or wheat germ systems currently known for in vitro translation provide for coupled transcription and translation in a static reaction mixture. summary of the invention it is an object of the invention, therefore, to provide a simple method for producing protein from a template dna in a standard in vitro translation reaction utilizing a eukaryotic cellular lysate. a more specific object of the invention is to provide such a method which can be used to couple transcription and translation of a single protein coded by the dna template. another object is to provide a process for enhanced in vitro protein production from dna templates through coupled transcription and translation reactions using eukaryotic cell-free lysates. a further object is to provide a method for manufacturing eukaryotic cellular lysates for use in coupled transcription and translation experiments. it is another object to provide such a preparation for use in coupled transcription and translation experiments. a further object of the invention is to provide a kit having a prepared rabbit reticulocyte lysate or wheat germ extract and including other components or reagents necessary for producing a reaction mixture for coupling transcription and translation from a dna template. a more specific object is to provide a kit having as at least one component a prepared rabbit reticulocyte lysate or wheat germ extract preparation which has one or more of the reagents necessary for coupling transcription and translation. for the achievement of these and other objects, this invention provides a method of carrying out transcription and translation from dna in eukaryotic cell-free extract, comprising adjusting the magnesium concentration of said extract to a level such that transcription and translation are coupled in the sense that rna is transcribed from dna and, simultaneously therewith, rna translates into protein. the invention also provides a process for producing protein from a dna template having a specific polymerase promoter sequence through coupled transcription and translation in a solution. this is accomplished by preparing a solution of a standard preparation of a eukaryotic cell-free extract containing said dna template, modifying said extract solution with sufficient concentrations of ribonucleotide triphosphates, amino acids and the polymerase corresponding to said promoter sequence of said template dna to support transcription and translation, and adjusting the final magnesium concentration of said extract solution to a level where rna is transcribed from said dna template and, simultaneously therewith, rna so transcribed translates into protein. only that protein corresponding to the gene adjacent the promoter sequence in the dna will be produced. the invention additionally provides a modified eukaryotic cellular lysate prepared in accordance with the method whereby the magnesium concentration is raised to a level such that, when the lysate is used in a method according to the invention, the final magnesium concentration in the reaction mixture in such that rna is transcribed from dna and rna translates into protein. the lysate can have its magnesium concentration so adjusted during manufacture. the invention also provides a kit that comprises a container containing prepared eukaryotic cellular lysate for coupled transcription and translation. in addition to having an adjusted magnesium concentration, this lysate can contain a variety of additional components required for coupled transcription and translation. one of the additional components that can be included is an rna polymerase. others are various buffers or salts or other components or reagents for optimizing coupled transcription and translation reaction conditions, such as spermidine, which is known to stimulate the efficiency of chain elongation. the coupling of transcription and translation in rabbit reticulocyte or wheat germ systems significantly increases protein production when compared to standard in vitro translation with rna templates, and the coupled transcription and translation has been shown to work for a variety of different proteins over a wide range of molecular weight sizes. the gene or dna to be translated is preferably cloned behind an rna polymerase promoter such as the sp6, t7, or t3 promoters, or any rna polymerase promoter for which a polymerase is available. the dna template can be introduced into the coupled transcription and translation reaction in the form of a closed circular plasmid dna or as a linearized plasmid dna. rna polymerase promoter sequences can also be attached to specific dna fragments by the thermocycling amplification process, and these linear dna fragments can be used in coupled transcription and translation reactions. standard in vitro translation reactions require very little investment of time and resources and are a well established method for expressing protein qualitatively. by coupling transcription and translation in standard in vitro translation reactions using rabbit reticulocyte lysate or wheat germ extract the need for a separate in vitro transcription reaction is eliminated and protein production is significantly enhanced. thus, coupled transcription and translation using rabbit reticulocyte lysate or wheat germ extract provides a significant improvement over current standard in vitro translation reactions. an unexpected benefit is that the production of the desired protein product is increased dramatically (several fold) over that which is seen by the addition of rna to standard in vitro translation reactions. in addition, there is no need for a separate capping reaction with coupled transcription and translation. another advantage is that protein production can be achieved from a cloned or amplified dna template containing a specific rna polymerase promoter. in this manner rna can be directed to be synthesized from a single gene downstream of the promoter, and only the proteins translated from that rna are produced. if that rna directs only one protein, then only one protein is produced through the reaction. plasmid vectors for such use are well known in the art and are available from several sources, allowing the researcher to produce protein from any cloned gene at will. other features and advantages of the invention will become apparent to those of ordinary skill in the art upon review of the following detailed description and claims. description of the preferred embodiment for purposes of the invention, any eukaryotic cellular lysate can be used, and a number of conventional techniques exist for their preparation. eukaryotic cell-free lysates are preferred expression systems for many reasons, at least partially because they retain a variety of post-translational processing activities. with the addition of canine microsomal membranes processing events, such as signal peptide cleavage and core glycosylation, can be examined. eukaryotic cellular lysates also support the translation in vitro of a wide variety of viral and other prokaryotic rnas, as well as eukaryotic mrnas. while other eukaryotic systems are suitable, rabbit reticulocyte lysate and wheat germ extract are preferred. these eukaryotic lysates are popular with researchers, and are widely available. in a preferred embodiment, rabbit reticulocyte lysate is prepared by a method described by pelham, h. and jackson, r.j. (1976, eur. j. biochem. 67, 247-256) and modified according to the manufacturing protocol l415/l416, promega corp., madison, wi. reticulocyte lysate is prepared from new zealand white rabbits injected with phenylhydrazine, which ensures reliable and consistent reticulocyte production in each lot. the reticulocytes are purified to remove contaminating cells which could otherwise alter the translational properties of the final extract. after the reticulocytes are lysed, the extract is treated with micrococcal nuclease and cacl 2 , to destroy endogenous mrna and thus reduce background translation to a minimum. egta is then added to chelate the cacl 2 and thereby inactivate the nuclease. the lysate contains cellular components necessary for protein synthesis. these include trnas, rrnas, amino acids and initiation, elongation, and termination factors. the lysate is further optimized for mrna translation by adding an energy generating system, consisting of pre-tested phosphocreatine kinase and phosphocreatine. also added are a mixture of trnas to expand the range of mrnas which can be translated, and hemin to prevent inhibition of initiation. hemin is included in the reticulocyte lysate because it is a suppressor of an inhibitor of the initiation factor eif2a. in the absence of hemin, protein synthesis in reticulocyte lysates ceases after a short period of incubation (jackson, r. and hunt, t. 1983 meth. in enzymol. 96, 50). potassium acetate and magnesium acetate are added at a level recommended for the translation of most mrna species. this is the standard rabbit reticulocyte lysate used for in vitro translations. the final magnesium concentrations for standard rabbit reticulocyte lysate, as described in the following table, are typically in the range of about 4.2 to 5.0 mm, which is used at a 50% ratio in coupled transcription and translation reactions. table-tabl0001 final concentration contributions of added components in a rabbit reticulocyte lysate translation reaction which is 50% lysate creatine phosphate 7 mm creatine phosphokinase 35 µg/ml dtt 1.4 mm calf liver trna 35 µg/ml potassium acetate 56 mm magnesium acetate 350 µm hemin 14.3 µm another preferred embodiment utilizes wheat germ extract. this can be prepared by a method described by roberts, b.e. and paterson, b.m. (1973), proc. natl. acad. sci. usa vol. 70, no. 8, pp. 2330-2334), following the modifications described by anderson, c.w., et al. (1983, meth. enzymol. vol.101, p. 635) and modified as in the manufacturing protocol l418, promega corp. madison, wi. generally, wheat germ extract is prepared by grinding wheat germ in an extraction buffer, followed by centrifugation to remove cell debris. the supernatant is then separated by chromatography from endogenous amino acids and plant pigments that are inhibitory to translation. the extract is also treated with micrococcal nuclease to destroy endogenous mrna, to reduce background translation to a minimum. the extract contains the cellular components necessary for protein synthesis, such as trna, rrna and initiation, elongation, and termination factors. the extract is further optimized by the addition of an energy generating system consisting of phosphocreatine kinase and phosphocreatine, and magnesium acetate is added at a level recommended for the translation of most mrna species. the final magnesium concentration for standard wheat germ extract, as described in the following table, is typically in the range of about 6.0 mm to 7.5 mm. table-tabl0002 final concentration contributions of added components in a wheat germ extract translation reaction which is 50% extract creatine phosphate 10 mm creatine phosphokinase 50 µg/ml dtt 5 mm calf liver trna 50 µg/ml magnesium acetate 3.0 - 3.75 mm potassium acetate 50 mm spermidine 0.5 mm atp 1.2 mm gtp 0.1 mm hepes (ph 7.6) 12 mm for coupled transcription and translation the magnesium concentration of the eukaryotic cellular lysate must be adjusted by an additional magnesium compound, preferably a salt. preferred salts include magnesium chloride and magnesium acetate. the addition of a buffering agent can be used in the solution to stabilize the ph, although this isn't necessary. for coupling transcription and translation, a sufficient amount of magnesium chloride or acetate is added to the lysate to raise the final magnesium concentration to a level where rna is transcribed from dna and rna translates into protein. this level will vary depending upon the lysate used. the simple addition of a prokaryotic rna polymerase and ribonucleotide triphosphates to a standard rabbit reticulocyte lysate or wheat germ extract does not allow in vitro protein production from dna templates. the particular adjustments of the salt concentrations in the system that will be described, however, allow protein production by creating conditions within the lysate which permit both transcription of dna into rna and translation of the rna into protein. magnesium is known to be important for optimizing translation, as it enhances the stability of assembled ribosomes and functions in their binding together during translation. magnesium also appears to play a role in facilitating polymerase binding. potassium is important as well for optimizing translation, but unlike the case for magnesium, for coupled transcription and translation the concentration of potassium ions does not need to be altered beyond standard translation preparation levels. potassium and magnesium are in the standard rabbit lysate. the levels are partially from the endogenous lysate levels, and partially from the additions made in the preparation of the lysate, as are done for translation lysates. lysate is diluted somewhat in manufacture, and the prepared lysate is then only used at 50% for coupled transcription and translation reactions. as the magnesium concentration should be adjusted to within a rather narrow optimal range, it is preferred that the lysate magnesium levels be measured directly through the use of a magnesium assay, prior to the addition of extra magnesium, so that the amount of magnesium in a reaction can be standardized from one batch of lysate to the next. the lancer "magnesium rapid stat diagnostic kit" (oxford lab ware division, sherwood medical co., st. louis, mo), is one such assay which can accurately measure the magnesium levels in biological fluid. once the magnesium ion concentration for a given batch of lysate is known then additional magnesium, for instance in the form of a concentrated magnesium salt solution, can be added in a known manner to bring the magnesium concentration of the lysate to within the optimal range, or, in the case of a modified lysate preparation to be used as one-half of a reaction mixture, to within twice the optimal range. thus, it has been found that when the final magnesium concentration of rabbit reticulocyte lysate is adjusted, such as by adding a concentrated solution of magnesium chloride or acetate, to a concentration greater than 2.5 mm but less than 3.5 mm, preferably between 2.6 mm and 3.0 mm, coupled transcription and translation occurs. for coupling transcription and translation using wheat germ extract, a final concentration of magnesium chloride or acetate greater than about 3.0 mm but less than about 5.25 mm produces protein, preferably adjusted to approximately 4.0 mm to 4.75 mm. reaction conditions for coupled transcription and translation must include the addition of ribonucleotide triphosphates (atp, gtp, ctp, utp) and amino acids, for rabbit reticulocyte lysate to final concentrations of 0.4 mm each, and 20 µm each respectively. reaction conditions for wheat germ extract are modified by the addition of ribonucleotide triphosphates to final concentrations of 0.4 mm for ctp and utp, 0.5 mm for gtp and 1.6 mm for atp, while amino acids are added to a rinal concentration of 20-80 µm. if a radiolabeled amino acid is used in the coupled reaction, such as 35 s methionine or 3 h leucine, then the corresponding amino acid is left out of the amino acid mix. an rna polymerase, either sp6, t7, or t3, is then added, preferably to a final concentration of about 80-160 units per 50 µl reaction. the dna template with the gene to be translated is added at a concentration of 1 µg, and the reaction volume is adjusted to 50 µl with the addition of water. the reaction is then incubated at 30°c for 1-2 hours. although potassium is added to the reaction mixture in the preferred embodiment, in contrast to magnesium additional potassium does not greatly increase protein production, but only offers a slight improvement when proper magnesium levels are already present. potassium acetate is added to an optimal final concentration of about 59 mm. although potassium chloride or acetate can be added, because of the greater amounts added than is the case for magnesium, potassium acetate is preferred. the standard translation lysate level can be used, a concentration of approximately 56 mm, while spermidine is added to give a final concentration of about 0.2 mm. the final concentration of potassium chloride or acetate is also an estimation based on the amount of this component in standard lysate, but it must be recognized that this concentration, as well as the magnesium concentration, can vary slightly due to endogenous components. additional components can be added to the lysate as desired for improving the efficiency or stability of the coupled transcription and translation reaction. one common addition to coupled transcription and translation reactions is an amount of a polyamine sufficient to stimulate the efficiency of chain elongation. although not absolutely necessary, for coupled transcription and translation a final concentration of spermidine in the mixture of about 0.2 mm is optimal, in that an increase of protein production is observed with this concentration. polyamines affect optimal magnesium levels as well, and are known to lower the effective magnesium concentration for translation reactions somewhat. it appears that the polyamines may substitute for magnesium at some level, and thus would play a role in the optimization of magnesium requirements, possibly even permitting some lowering of optimal magnesium levels for coupled transcription and translation. optimal magnesium concentrations in the in vitro environment are affected by other conditions and considerations, too. as the ribonucleotide triphosphate concentration goes up, for instance, there is a concomitant increase in the optimal magnesium concentration, as the ribonucleotide triphosphates tend to associate, or chelate, with magnesium in solution. thus, when the ribonucleotide triphosphate concentrations cited for the above reactions are increased to 0.6 mm, the production of protein from coupled transcription and translation reactions is greatly reduced. the optimal concentration of magnesium also varies with the type of cellular lysate, whether using wheat germ extract or rabbit reticulocyte lysate. the amount of magnesium required to be added to achieve optimal levels will vary with the concentration of the lysate used in the reaction mixture, as increasing the concentration of the lysate will increase the contribution of magnesium from the lysate itself. due to the large number of components in a lysate mixture, it can not be said with certainty whether it is the protein translation from rna, the transcription of rna from dna or both that is adversely affected at other than optimal salt conditions. the observation is the same in any case, that detectible levels of protein are not produced in the reaction. with a small adjustment to the magnesium concentration, possibly adjusted by the polyamine concentration and watching that ribonucleotide triphosphate concentration levels do not become a problem, coupled transcription and translation is observed, but only through a relatively small range. dithiothreitol (dtt) is preferably added to the translation mixture. when included in coupled transcription and translation reactions, dtt is preferably added to a final concentration of about 1.45 mm. optimal dtt is about 5.1 mm for wheat germ. also, a ribonuclease inhibitor, such as rnasin, can be added to the lysate, to effectively inactivate endogenous ribonucleases. concentrations of 40 units per 50 µl reaction have been shown to help prolong the reaction. it is not an absolute requirement for coupled transcription and translation in rabbit reticulocyte lysate, but rnasin is required for coupled transcription and translation using wheat germ extract. the omission of rnasin from the latter results in no protein translation, as there are active ribonucleases present in the lysate. the preferred coupled transcription and translation concentrations for rabbit reticulocyte lysate, of potassium chloride or acetate, magnesium chloride or acetate and spermidine, can be achieved by the addition of 2.5 µl of an optimized tris/acetic acid buffer (1xta buffer = 33 mm tris/acetic acid ph 7.8, 65 mm potassium acetate, 10 mm magnesium acetate, 4 mm spermidine, 1 mm dtt). when added to a standard 50 µl in vitro translation reaction, this buffer raises the magnesium level in the lysate by 0.5 mm overall. rabbit reticulocyte lysate can be modified during manufacture. the lysate is used at a 50% concentration (25 µl lysate per 50 µl reaction, typically), and so a preferred modification involves adjusting the potassium acetate concentration to 118 mm, the magnesium acetate to about 5.2 mm to 6.0 mm, and spermidine to 0.4 mm. this gives optimal final concentrations of 59 mm potassium acetate, 2.6 mm to 3.0 mm magnesium acetate and 0.2 mm spermidine when 50% lysate is used in a coupled transcription and translation reaction. the lysate can be further modified by the addition of one of the rna polymerases (sp6, t7, or t3) to the lysate, preferably at a concentration of 80-160 units per 50 µl reaction. such a modified lysate can be stored frozen until needed. spermidine is also preferably added to wheat germ extract, optimally to a final concentration of about 0.9 mm. potassium acetate is preferably added to a final concentration of approximately 56.5 mm. these concentrations can be achieved by the addition of 5.0 µl of 1xta buffer to a 50 µl in vitro translation using standard wheat germ extract, although these concentrations are based on estimations of the amounts of these components in standard wheat germ extract and may vary slightly due to endogenous components in the lysate itself. wheat germ extract can also be modified during the manufacturing process so that the final concentrations of potassium acetate, magnesium acetate and spermidine will equal those described in the reaction conditions above for wheat germ when the lysate is used at a 50% concentration. wheat germ extract can be further modified during manufacture by the addition of one of the rna polymerases to a final concentration of 80-160 units per reaction. modified extract is stored frozen until it is used. leaving magnesium concentrations at levels present in the standard lysate, production of protein does not occur. the addition of all of the other components of the 1xta buffer to the reaction mixture, only without the magnesium, results in a reaction that produces no protein. on the other hand, addition of excess magnesium will cease translation altogether. for instance, in a similar reaction mixture utilizing rabbit reticulocyte lysate, but having final magnesium concentrations of about 3.5 mm, translation of protein again ceases. this upper limit will presumably vary slightly depending upon other parameters such as potassium and spermidine concentrations, as well as ribonucleotide triphosphate concentrations both of which are known to vary the optimal magnesium concentration for translation of rna into proteins. both modified wheat germ extract and modified rabbit reticulocyte lysate can be included as part of a kit for facilitating the set up of coupled transcription and translation reactions. such a kit improves the convenience to the researcher, as the eukaryotic cellular lysate comes prepared and ready for use. in addition to the rabbit reticulocyte lysate or wheat germ extract, such a kit can include the components, reagents, including enzymes, and buffers necessary to perform coupled transcription and translation upon the introduction of a dna template. the lysate can be standard, or can be of the type where the adjustments to its salt concentrations have already been made during manufacture, or additionally where one or more of the components, reagents or buffers necessary for coupled transcription and translation have been included. the amount of protein produced in a coupled in vitro transcription and translation can be measured in various fashions. one method relies on the availability of an assay which measures the activity of the particular protein being translated. an example of an assay for measuring protein activity is the luciferase assay system described in technical bulletin 101, promega corp., madison, wi. these assays measure the amount of functionally active protein produced from the coupled in vitro transcription and translation reaction. activity assays will not measure full length protein that is inactive due to improper protein folding or lack of other post translational modifications necessary for protein activity. another method of measuring the amount of protein produced in coupled in vitro transcription and translation reactions is to perform the reactions using a known quantity of radiolabeled amino acid such as 35 s methionine or 3 h leucine and subsequently measuring the amount of radiolabeled amino acid incorporated into the newly translated protein. for a description of this method see the in vitro translation technical manual, promega corp., madison, wi. incorporation assays will measure the amount of radiolabeled amino acids in all proteins produced in an in vitro translation reaction including truncated protein products. it is important to separate the radiolabeled protein on a protein gel, and by autoradiography confirm that the product is the proper size and that secondary protein products have not been produced. the most accurate measure of protein production is to correlate the measure of activity with the measurements of incorporation. as described above, coupled transcription and translation reactions require the introduction of a dna template. further enhancement of in vitro protein translation has been achieved with the use of a vector containing a poly a sequence at one end of the multiple cloning region. a preferred vector also contains an sp6, t7 or t3 rna polymerase promoter at the opposite end of the multiple cloning region, so that cloning into the vector produces a gene that is flanked by an rna polymerase promoter at the 5' end and a poly a sequence at the 3' end. many cloning vectors commercially available contain one or more of the promoters sp6, t7, or t3 as they are widely used for standard in vitro transcription reactions. the vector psp64 (polya) is commercially available from promega corp., madison, wi. this vector was used to clone the luciferase gene which was subsequently translated in a coupled transcription and translation reaction using rabbit reticulocyte lysate. the same luciferase gene was cloned into a different vector lacking the poly a sequence and subsequently translated in a coupled transcription and translation reaction. when activity assays were performed on product from these reactions, a significant increase in activity was evident in the reaction which contained the poly a construct. to study the cotranslational and initial post-translational modifications of proteins, coupled transcription and translation reactions can be performed in the presence of canine pancreatic microsomal membranes. signal peptide cleavage, membrane insertion, translocation and core glycosylation are some of the modifications that can be studied. a coupled transcription and translation reaction using a clone of the b-lactamase precursor in the presence of microsomal membranes produced the expected form of the protein showing signal processing had taken place. likewise, a coupled transcription and translation reaction using a clone of the precursor for α factor from s. cerevisiae in the presence of microsomal membranes produced the expected processed form of the protein showing glycosylation. coupled transcription and translation can be used in any method that requires the in vitro translation of proteins. these methods include in vitro mutagenesis of genes to study structure and function of the resulting proteins. other methods are the in vitro translation of modified proteins for the purpose of isolating or purifying the protein away from the rest of the reaction and the in vitro translation of protein for the purpose of producing antibodies to that protein. the method of coupled transcription and translation in rabbit reticulocyte lysate or wheat germ extract offers advantages over current methods of in vitro translation in that these systems require less time and yield enhanced levels of protein. there are also a number of advantages in using such a static coupled transcription and translation reaction over continuous or flow-through reactions. first of all, there is a major difference in the applications for the two systems. the continuous system is for large scale industrial production of proteins whereas static system reactions are suited to the everyday researcher currently doing in vitro translations. continuous translation is much more expensive to perform, requiring an investment in equipment (a single amicon unit costs approximately $2,000) as well as significant amounts of reagents. in particular, the levels of rna polymerases used to make continuous eukaryotic reactions work is prohibitive for simple research applications (20,000-30,000 units/reaction). continuous reactions are designed to be performed in relatively large volumes, while static reactions require no extra equipment and only small amounts of reagents, since the reaction volume is typically only on the order of 50 µl or less. the time required for a continuous reaction is significant, anywhere from 24 to 100 hours, whereas static reactions require only 1 to 2 hours to completion. for researchers currently performing in vitro translation, the static system offers significant time savings for most analytical or other research applications by bypassing the in vitro transcription step. because of the time required both for the set up and for the running of continuous reactions there is no net time savings for a typical researcher, even for coupled translation and transcription in such a system. furthermore, with the static coupled transcription and translation system significant increases in protein production are observed when compared to standard in vitro translation using rna templates. further increase in protein production is observed in the static system when the dna template contains a 3' poly a sequence. in general, then, the static system makes coupled transcription and translation available to the everyday researcher, not only because of the cost effectiveness and ease of use, but also because of the significant time savings and increased protein production over other known eukaryotic systems. example 1 coupled transcription and translation was performed on a dna construct containing the luciferase gene. the reaction was assayed for the production of luciferase enzyme using the luciferase assay system (promega, corp., madison, wi). luciferase activity is measured in turner light units using a turner luminometer. coupled transcription and translation was achieved under the following reaction conditions: table-tabl0003 25.0 µl standard rabbit reticulocyte lysate 8.0 µl rntp's (atp, gtp, utp, ctp) 2.5 mm each 1.0 µl sp6 rna polymerase (80 units/µl) 2.5 µl 1xta buffer* 1.0 µl rnasin (40 units/µl) 1.0 µl psp64polya/luc dna (1 µg) circular plasmid dna 1.0 µl 1 mm amino acids (complete) 9.5 µl h 2 o 50.0 µl * lxta buffer consists of 33 mm tris/acetic acid ph 7.8, 65 mm potassium acetate, 10 mm magnesium acetate, 4 mm spermidine, and 1 mm dtt. the reaction was incubated at 30°c for 1.5 hours. after 1.5 hours a 2.5 µl sample from the above reaction was assayed in the luminometer with a 100x light filter in place. the sample produced greater than 30,000 turner light units. control experiments where either dna was omitted from the reaction or where no 1xta was included produced no turner light units. example 2 coupled transcription and translation was likewise performed in a reaction containing wheat germ extract. again, the dna construct used contained the luciferase gene. coupled transcription and translation was achieved under the following conditions: table-tabl0004 25.0 µl standard wheat germ extract 8.0 µl rntp's (atp, gtp, ctp, utp) 2.5 mm each 5.0 µl 1xta buffer 1.0 µl rnasin (40 units/µl) 1.0 µl sp6 rna polymerase (80 units/µl) 1.0 µl psp64polya/luc dna (1 µg) circular plasmid dna 1.0 µl 1 mm amino acids (complete) 8.0 µl h 2 o 50.0 µl the reaction was incubated for 1 hour at 30°c. after 1 hour a 2.5 µl sample from the reaction was measured in the luminometer with a 100x light filter in place. the sample produced greater than 5,000 turner light units. example 3 coupled transcription and translation was also performed with lysates modified during manufacture by the addition of certain components or reagents. during the manufacture of a rabbit reticulocyte lysate an aliquot was set aside and sp6 rna polymerase was added to the lysate before it was frozen. sp6 was added to the level of 160 units of sp6 per 25 µl lysate. the lysate was quick frozen and stored at -70°c until used. coupled transcription and translation reactions were set up following conditions in example 1 except that no additional sp6 was added. the reactions performed with rabbit reticulocyte lysate that had sp6 rna polymerase added during manufacture produced protein. further experiments have shown that the other components (buffers and amino acids, for instance) necessary for coupled transcription and translation can be added to the lysate during its manufacture. the lysate with the components added can be used to produce protein in coupled reactions upon the introduction of dna templates. example 4 dna constructs containing genes for a variety of proteins were tested in coupled transcription and translation reactions. the same reaction conditions as in example 1 were used except that a radiolabeled amino acid ( 35 s methionine) was included in the reaction mix. methionine was eliminated from the amino acid mix. reactions were performed using plasmid dna constructs cloned behind the sp6 or t7 rna polymerase promoters. pgemluc plasmid dna coding for luciferase was used in coupled transcription and translation reactions and yielded 15.3% incorporation of the radiolabeled amino acid. this compared to a standard in vitro translation using a transcribed rna template of the luciferase clone which yielded 0.8% incorporation. samples from these reactions were run on sds/page gels to confirm that the protein product was the proper size for luciferase. further experiments were performed using a clones of the b-lactamase gene and the α factor of s. cerevisiae behind the sp6 promoter. standard in vitro translation using an rna template of b-lactamase yielded 3% incorporation of the labeled amino acid whereas a coupled transcription and translation reaction using a dna template yielded 26.8% incorporation. a standard in vitro translation reaction using an rna template of the α factor gene yielded 0.8% incorporation while a coupled transcription and translation reaction using a dna template yielded 12.4% incorporation. again, samples of the reactions were run on sds/page gels to confirm the size of the proteins produced. other proteins produced from dna templates in coupled transcription and translation reactions include: tfiid transcription factor, behind the t7 promoter, yielding 5% incorporation; cjun transcription factor, behind t7, yielding 13.4% incorporation; b-galactosidase, behind the sp6 promoter, yielding 28% incorporation; and polya/luc, a luciferase gene in a poly a vector, behind sp6, yielding 25.9% incorporation. example 5 coupled transcription and translation was performed in rabbit reticulocyte lysate using a dna construct of b-lactamase precursor, in the presence and absence of canine microsomal membranes, to test post-translational modification of proteins. the reactions contained a labeled amino acid in order to visualize the products by autoradiography. products from the reactions were run on sds/page gels. the protein product from the reaction without microsomal membranes migrated at about 31.5 kilodaltons (kda) while the protein product from the reaction containing microsomal membranes migrated at about 28.9 kda, indicating that the signal sequence had been processed. in a similar coupled transcription and translation experiment a dna construct of the α factor of s. cerevisiae was translated both in the presence and absence of canine microsomal membranes. again, the radiolabeled products were run on a gel and the results indicated the 18.6 kda precursor had been processed to a protein migrating at 32.0 kda, indicating that the α factor was glycosylated. example 6 coupled transcription and translation was performed on dna produced from a thermocycled amplification process. the only requirement for such a dna is that the amplified fragment contain an rna polymerase promoter. the experiment was performed using a dna fragment amplified from the pgemluc plasmid. the resulting fragment contained the sequence for the sp6 rna polymerase promoter and the sequence for the luciferase gene. when this dna fragment was introduced into a coupled reaction under conditions similar to example 1, luciferase protein was produced. other amplified dna fragments have been translated in coupled reactions including a pgemex/gene 10 fragment, behind the t7 promoter, and a β-galactosidase fragment, behind the sp6 promoter.
047-509-091-058-264	GB	[ "GB", "US", "WO", "EP" ]	G06F1/32,G05B19/042,H02J13/00	2010-04-20T00:00:00	2010	[ "G06", "G05", "H02" ]	energy management system	an energy management system has several energy nodes 9. each node controls the electrical power supply to a device. it may use a relay or a solid state switch, such as a triac. it may also contain a meter to measure the power supplied to the device. the system also contains an energy automation appliance, which controls the nodes according to an energy policy. the appliance may be a computer and may communicate with the nodes via an ethernet network. computers 17, which have their power controlled by nodes, may have a status module 19 and a shutdown module 15. the status module informs the appliance of the status of the computer. the shutdown module allows the appliance to shut down the computer. a policy override device 21 may allow a user to override the energy policy. a web server 13 may be used to interface to the automation appliance.	1 . an energy management system comprising: policy establishment means for establishing one or more energy policies, the or each said policy being configured for managing the energy consumption of at least one energy consuming appliance; and at least one energy node configured to communicate with said energy policy establishing means to implement an energy policy for the control of at least one energy consuming appliance with which said energy node is configured to communicate. 2 - 42 . (canceled)	cross reference to related applications this application is a continuation of u.s. patent application ser. no. 13/642,216, filed 29 may 2013, which is a national stage application under 35 u.s.c. 371 of pct application no. pct/ep2011/056061 having an international filing date of 15 apr. 2011, which designated the united states, which pct application claimed the benefit of great britain application no. 1006510.0 filed 20 apr. 2010, each of which are incorporated herein by reference in their entirety. field this invention relates to energy management systems, particularly but not exclusively to systems for the management of electrical energy consumption. in one envisaged implementation the invention relates to a distributed management system with a plurality of controllable energy nodes. background as energy consumption, and the resultant effect on emissions, becomes more of an environmental concern, it is becoming more common for individuals, companies and other organisations to seek to reduce their consumption of energy, particularly but not exclusively electrical energy consumption. these concerns, coupled with recent increases in energy costs, government efforts to encourage energy frugality, and a growing public appreciation of the finite nature of fossil fuel resources have all helped raise public acceptance of the need for managing energy consumption. in the commercial environment, it has become more commonplace for companies and other organisations to adopt a formal environmental policy, and such policies typically exhort members of those companies and organisations to find ways to reduce energy consumption. one illustrative way of achieving this is to post notices around a company or other organisation which remind staff to conserve energy, for example by switching off lights and other electrical devices when not in use. another more extreme way of managing consumption is to periodically power down the organisation or company for predetermined periods of time. the first approach only tends to work well if staff share the environmental concerns of the organisation that is seeking to conserve energy and consistently remember to conserve energy. unfortunately, however it is often the case that many staff fail to see energy conservation as a being a benefit to them, and as such this approach can often be not particularly effective. the other aforementioned approach to energy conservation can be very effective in reducing power consumption, but it requires careful on-site management and can cause problems if staff are working unusual hours. aspects of the present invention seek to address these and other problems. summary to this end, a first aspect of the teachings of the invention provides an energy management system that comprises: means for establishing one or more energy policies, each said policy being configured for managing the energy consumption of at least one energy consuming appliance; at least one energy node configured to communicate with said energy policy establishing means to implement an energy policy for the control of at least one energy consuming appliance with which said energy node is configured to communicate. other features, advantages and implementations of the teachings of the invention will be apparent from the following detailed description. brief description of the drawings various aspects of the teachings of the present invention, and arrangements embodying those teachings, will hereafter be described by way of illustrative example with reference to the accompanying drawings, in which: fig. 1 is a schematic representation of an illustrative energy management system; fig. 2 is a schematic representation of an envisaged implementation of an energy management system; fig. 3 is a schematic representation of another envisaged implementation of an energy management system; fig. 4 is a schematic representation of an illustrative energy node; fig. 5 is a schematic representation of another envisaged implementation of the energy management system in fig. 2 ; and fig. 6 is a schematic representation of another envisaged implementation of the energy management system in fig. 3 . detailed description illustrative energy management systems will now be described with particular reference to systems for the management of electrical energy consumption. it will be appreciated, however, that this particular application of the teachings of the invention is merely illustrative and that the systems described herein may be employed for consumption management of other forms of energy. as such, the following detailed description should not be construed as being a limitation of the teachings of this invention, but instead as being merely illustrative of one particular application of those teachings. with the above proviso in mind, reference will now be made to fig. 1 of the accompanying drawings in which there is depicted an illustrative energy management system 1 accordingly to an envisaged implementation of the teachings of the invention. the system 1 comprises means 3 for establishing one or more energy policies, and at least one energy node 5 . for simplicity this illustrative example includes a single energy node, but it will be appreciated that a typical installation will include a plurality of such nodes. as shown in fig. 1 the policy establishing means 3 is configured to communicate with the energy node 5 , in particular to enable a user to cause the node to be provided with a desired energy policy. the energy node 5 is configured to communicate and optionally control an energy consuming appliance 7 . the energy policy established by the policy establishing means may comprise, for example, user instructions as to when the energy consuming appliance is to be powered up, and when the appliance is to be powered down. in one envisaged implementation the policy establishing means 3 may comprise a computing resource, such as a desktop or laptop computer, that is enabled to communicate with the energy node via an internet interface to establish a policy for an appliance. the energy node 5 may have a number of different forms depending on the appliance to be controlled. in one illustrative implementation the energy node 5 comprises a computing resource that is configured to control an electrical supply to an appliance in accordance with an established energy policy. the energy node may communicate with the appliance via a wired connection (such as an ethernet lan (local area network) connection) or a wireless connection (such as a wi-fi connection). the energy node 5 may also be configured to monitor operation of the appliance, and optionally obtain measurements of energy consumption for local processing by the energy node 5 , or remote processing (for example at the energy policy establishing means 3 ). fig. 2 is a schematic representation of an envisaged implementation of an illustrative energy management system. in this illustrative implementation the system is configured for managing electrical energy consumption, for example of computing resources, and comprises a plurality of distributed energy nodes 9 (one of which is shown) that are coupled to an energy automation appliance 1 1 which forms, with an energy automation service 13 , the aforementioned energy policy establishing means 3 . in this illustrative arrangement, the energy node 9 comprises a small item of hardware which is designed to fit within the cable management infrastructure of a building (such as perimeter cable trunking, floor boxes, power poles, etc.). an advantage of such an arrangement is that it is then possible to provide an “invisible” system with energy management devices hidden behind power outlets within the building. the energy automation appliance 11 of this illustrative implementation comprises a computing device (for example a computing device with a standard pc (portable computer) architecture in a server or pc format) that connects to each of the energy nodes, for example by means of a standard ethernet infrastructure of the building in which the nodes are installed. the energy automation appliance 11 comprises software and hardware that functions to collect and store energy usage data from each of the nodes and to execute “energy policy orchestration” software which sends control messages to the nodes—allowing them to be turned on or off in line with a user defined energy policy. the system also comprises an energy automation service 13 that comprises, in this particular implementation; a web based service that allows a building owner access to their “energy management” system from outside the building so that they can set and change energy policies from a remote location. the energy automation service may also provide other tools such as reporting, billing, etc. in addition to the aforementioned core components, the system of this implementation further comprises shutdown software modules 15 ; each executable by a computing resource 17 that is being managed. the shutdown modules each comprise a software application that is operable to turn off a computing resource at a predetermined time. the system also comprises status software modules 19 , each executable by a computing resource that is being managed. the status modules 19 each comprise a software module that is configured to communicate the current energy status of the computing resource with which it is associated to the energy automation appliance 11 , which appliance is configured to ensure that power to that computing resource is not turned off while the resource is still in use. the current energy status of the computing resource is indicative of whether or not the computing resource is in use. when the computing resource is not in use it may occupy a reduced energy state such as: i) a screen saver mode; ii) a hibernation mode; iii) a sleep mode; or iv) a shut down mode. the system of this implementation also comprises a policy override device 21 which comprises an input device such as a push-button located in the vicinity of a group of computing resources and other appliances that are being managed by the system. the policy override device 21 communicates with the energy automation appliance 11 and allows an energy management policy to be easily overridden—for example if an employee returns to an office out of hours. working together, these elements enable the provision of a fully automated energy management system that can be configured to automatically adapt to how a building is being used by its inhabitants—thereby enabling continuous optimisation and reduction of the operational energy consumption of the building as a whole. further details of these elements are provided in the headed sections below. energy node as aforementioned, in an envisaged implementation the energy node is a small hardware device which fits behind the power sockets of the building. in one envisaged implementation the energy node comprises: an energy meter (for measuring the energy consumed by (in this instance) a computing resource with which the energy node is associated);a power control component—which enables a connected appliance to be turned on or off. this component could comprise a relay or a solid-state switch such as a triac (triode for alternating current) or a combination of the two—where the triac is used to switch the current (handling any inrush currents) while the more efficient relay carries the current shortly after the switching event. other suitable devices will immediately be apparent to persons of ordinary skill in the art.a main processor which is configured to measure and calculate analogue variables such as voltage, current, energy consumption, etc. of the connected appliance(s) and communicate measurements and calculations to the energy automation appliance for processing and storage. in one envisaged implementation the main processor runs an embedded operating system, application and web server and is responsible for all of the complex tasks carried out within the energy node including communications to the appliance.a secondary processor (labelled “2 nd micro”) which is configured to manage the on/off control of the power output. this processor is configured to turn off the power output when correctly requested to do so by the main processor. in an envisaged implementation the secondary processor has sufficient autonomy and intelligence to automatically turn the power on at power-up (while the main processor is busy booting up) and to turn the power on if it loses communication with the main processor for a pre-defined period of time. the secondary processor may also have the ability to automatically reset the main processor if communications with it are lost for an extended period of time. in an envisaged arrangement the requirements of this processor are relatively simple and the embedded firmware can be written in the lowest level language to thereby enable full and extensive testing in order to improve its long-term reliability.a three-port ethernet switch which eliminates the need for additional network cabling or infrastructure. in an envisaged arrangement, one port of the switch connects to the existing network in place of the pc, the second port of the switch connects to the pc, and the third port of the switch is used to connect the energy node to the network.optionally, surge protection and emi (electromagnetic interference) filtering circuitry can also be included into the energy node helping to protect the attached appliance from surges on the power supply and reducing the amount of emi noise put back onto the mains supply by the appliance. in an envisaged implementation the above functionality could be integrated into the power socket itself or an intelligent cable management product. it is also envisaged that the power line carrier could replace the ethernet communications network. as the energy node connects to both the power infrastructure of the building and the data network, particular attention has been given to ensuring the robustness of the electrical isolation barriers (as shown in fig. 4 ) within the energy node. in one envisaged implementation the node communicates with the energy automation appliance 11 using a restful “web services” architecture. under this architecture, each of the nodes acts as a web server that delivers a “service” in response to a request from the energy appliance which acts as the “client”. the restful element refers to the fact that the details behind the request are contained within the header of the http (hypertext transfer protocol) request. in such an arrangement the energy automation appliance 11 makes a request for information or for an update to the nodes configuration, by sending an http request to a specific uri (uniform resource identifier) that is served by the energy node's web server. in response the energy node returns the requested information back in either xml (extensible markup language) or json (javascript object notation) format. as mentioned above, although this document place particular emphasis on the interaction between computing resources, nodes and the energy automation appliance, the teachings of the present invention are equally applicable to any energy consuming appliance within or outside of the building. energy automation appliance in this implementation the energy automation appliance is a piece of computing hardware; in some implementations a standard pc architecture that runs dedicated software. the elements of the software include: an operating system; for example a linux derivative for long-term stability and reliabilitya database; for example mysqla web server; used to display web pages which form the user interface to the system, and to deliver web services to the shutdown module, the status module and the energy automation service; anda policy orchestrator application; which application comprises a dedicated software module that is configured to automatically run an energy management policy at the correct time and/or under the correct conditions. the policy orchestrator also carries out a number of interactions within the system to ensure that it is safe to turn off a connected appliance before doing so. the policy orchestrator is also able to send “wake on lan” messages to specific pcs on the network in order to wake them up from sleep or hibernation in line with a “wake up” type policy. shutdown module the shutdown module is a simple application that will automatically turn a computing resource off at a pre-determined time when other requirements are also met—such as when it is determined that that resource is not being used. if the resource is in use at the time the shutdown is set for, the user is not interrupted by any pop-ups the software module is configured simply to wait a further pre-defined period and check again to see if the resource is still in use. the shutdown module will continue to do this until the resource is no longer in use—then it will produce a pop-up giving the user (if still present) an opportunity to delay the shutdown process. unusually, the shutdown software module is configured to use a web-services methodology to allow the shutdown settings to be managed centrally—by the energy automation appliance. in this case, the computing resource is the “client” which requests an update (from the energy automation appliance—the server) to its shutdown settings every time the energy status of the computing resource changes. the significance of this architecture is that it enables centralised management of shut-down policies while still meeting the very strict security requirements of certain commercial enterprises—which requirements dictate that a users computer can only ever be a client on the enterprise's network. for security organisations such as banks will not allow any computer to act as a “server” on their network. in a particularly preferred implementation the shutdown module is also configured to automatically save any unsaved documents to a secure location on the computing resource (or a network to which it is connected) before it shuts down. these documents can be easily recovered from a folder on the user's desktop. status module the status module is a small foot-print software “service that runs on the computing resource and monitors the current energy status of the resource. in the context of a personal computer, the status modules is configured to send a message to the energy automation appliance if the status changes between any one of the standard windows energy states, such as hibernate, resume, user log-on, etc. similar arrangements may be devised for other types of computing resource. understanding this status is important to ensure that a resource is not accidentally turned off while it is still in use—as this will almost certainly result in data loss. again a web-services methodology is used to communicate with the appliance where the resource is the client—meeting the security requirements of certain commercial enterprises. policy override device in an envisaged implementation the policy override device is a wired or wireless switch or other input device that is used to override a policy in a specific area. when the button is pressed or the device is triggered by another input such as an alarm relay or pir detector, a message is sent to the appliance informing the appliance that someone has just entered a specific area and wishes to override any shutdown policies in that area. the policy override switch may be connected directly to the energy appliance or may communicate with it over the ethernet network in order to extend the distance that the override device can be away from the energy automation appliance. where the override device communicates across the network a web-services methodology is used. the policy override device can also be used in conjunction with a “protection policy” to trigger a single or series of protection events within the building. for example, if a fire alarm is triggered, the energy automation appliance could automatically turn off all appliances under its control to help limit the spread of the fire. similarly, all pcs could be turned off in the event of a burglary—reducing the risk of data theft. during system installation, the building is divided up into virtual “energy zones”. each override device can be assigned to a specific zone, group of zones or even an individual user—allowing a single override device to control a single user or an entire enterprise. energy automation service the energy automation service is a web based service that allows a building owner access to his “energy automation” system remotely allowing him/her to set and change energy policies from a remote location. the energy automation service is a set of software applications that are remotely hosted, for example in a data centre—the services are delivered to the customer through the “software as a service” model. the service is provided by exploiting historical energy consumption data stored within the data centre. this data is collected from the energy appliances within the customers building either using a web services architecture (where allowed by the customer) or by an automatic back-up process—where each energy appliance packages and sends data to the data centre on a regular basis. in order to provide some near real-time elements to the services, a web services model may be used. through this model specific pieces of current information are requested from the buildings energy automation appliance by the service. in this case, the energy automation appliance acts as the server and the data centre is the client. this architecture allows the energy automation service to provide a wide range of tools and services such as reporting, billing, alerts, etc. key features of this implementation are as follows: an energy node with a 2 processor architecture enhances the reliability of the energy node by removing direct control of the on/off functionality from the main processor. as a consequence, if the main processor should “crash” it can be re-booted by the secondary processor without interrupting the power supply to the attached appliance.an energy node with an integrated 3-port ethernet switch reduces the need for any additional ethernet cabling or additional external switches.the combed use of energy nodes, energy automation appliance and status module allows energy management policies to be used safely together—for example without accidentally turning off an appliance when it is still in use.the use of computing resources as “sensors”—once the status of all pcs are known, the system can make assumptions and decisions about how to manage the appliances within the building. fig. 3 is a schematic representation of another envisaged implementation of an illustrative energy management system (in this instance, a system for managing energy usage by computing resources). in this illustrative implementation the system comprises: distributed energy nodes 23 —a small item of hardware which is designed to fit within the cable management infrastructure of a building, such as perimeter cable trunking, floor boxes, power poles, etc.—effectively placing an energy management device behind one or more power sockets within the buildinga shutdown software module 25 ; an application which will turn a computing resource off at a particular time of day,a status module 27 ; an application that communicates the current energy status of an appliance (in this instance, a computing resource) to its associated energy node 23 ensuring that the power to the appliance is not turned off while the appliance is still running (i.e. when it is in use). the current energy status of the appliance is indicative of whether or not the appliance is in use. when the appliance (in this instance, a computing resource) is not in use it may occupy a reduced energy state such as: i) a screen saver mode; ii) a hibernation mode; iii) a sleep mode; or iv) a shut down mode.policy override device 29 ; a simple input device such as a push-button located in the vicinity of a group of computing resources and other appliances being controlled by the system. the policy override device broadcasts to all with the energy nodes and allows a local energy management policy to be easily overridden—for example if an employee returns to an office out of hours.an energy automation service 31 ; in this implementation a web based service that allows a user remote access to their “energy automation” system so that they can set and change energy policies from a remote location. the energy automation service also provides other tools such as reporting, billing, etc. working together, these five elements provide an energy management system that can automatically adapt to how the building is being used by its inhabitants—continuously optimising and reducing the operational energy consumption of the building as a whole. further details of these elements are provided in the headed sections below. energy node in an envisaged implementation (see fig. 4 ) the energy node 23 is a small hardware device which can be fitted behind the power sockets of a building. the energy node consists of: an energy metera device for controlling the power output—allowing a connected appliance to be turned on or off. this device could be a relay or a solid-state switch such as a triac or a combination of the two—where the triac is used to switch the current (handling any inrush currents) while the more efficient relay carries the current shortly after the switching event.a main processor which measures and calculates analogue variables such as voltage, current, energy consumption, etc. of the connected appliance(s) and communicates the measurements to the energy automation services for processing and storage. the main processor runs an embedded operating system, real-time clock, local policy orchestrator application, embedded database (for short-term local storage of energy data) and a web server and is responsible for all of the complex tasks carried out within the node including communications to the energy automation service. in this implementation there is provided a local policy orchestrator application that comprises a dedicated application which runs within the main processor of the energy node to automatically orchestrate an energy management policy at the correct time and/or under the correct conditions. the policy orchestrator also carries out a number of interactions with the appliance being managed and other elements of the system to ensure that it is safe to turn off a connected appliance before doing so. the policy orchestrator is also able to send “wake on lan” messages—when its attached appliance comprises a computing resource—through its direct ethernet connection in order to wake the computing resource up from sleep or hibernation in line with a “wake up” type policy.a secondary processor (labelled “2 nd micro.”) which manages the on/off control of the power output. this process will turn off the power output when correctly requested to do so by the main processor. in a preferred arrangement, the secondary processor has sufficient autonomy and intelligence to automatically turn the power on at power-up (while the main processor is busy booting up) and to turn the power on if it loses communication with the main processor for a pre-defined period of time. the secondary processor also has the ability to automatically reset the main processor if communications with it are lost for an extended period of time. the requirements of this processor have been deliberately simplified and the embedded firmware has been written in the lowest level language so that it can be fully and extensively tested to ensure its long-term reliability.a three-port ethernet switch that eliminates the need for additional network cabling or infrastructure. one port of the switch connects to the existing network in place of the computing resource, the second port of the switch connects to the computing resource, and the third port of the switch is used to connect the main processor of the energy node to the network.optionally, surge protection and emi filtering circuitry can also be included into the energy node helping to protect the attached appliance from surges on the power supply and reducing the amount of emi noise put back onto the mains supply by the appliance. optionally the node may have a local policy override switch attached directly to the node which will directly override the node when operated. in some implementations, the above functionality could be integrated into the power socket itself or an intelligent cable management product. in addition (as before) in some implementations a power line carrier could replace the ethernet communications network. as the energy node connects to both the power infrastructure of the building and the data network, particular attention has been given to ensuring the robustness of the isolation barriers within the product (as shown in fig. 4 ). where the appliance being managed is a computing resource, it is envisaged that the energy node communicates with the energy automation service using a restful “web services” architecture. under this architecture, each of the nodes acts as a web server that delivers a “service” in response to a request from the computing resource or energy automation service which acts as the “client”. the restful element refers to the fact that the details behind the request are contained within the header of the http request. the computing resource or energy automation service makes a request for information or for an update to the nodes configuration, real-time clock settings or local energy policy by sending an http request to a specific uri (uniform resource identifier) that is served by the nodes web server. in response the node returns the requested information back in either xml or json format. as aforementioned, although this document describes the interaction between computing resources, nodes and the energy automation service at length, this solution is equally applicable to any appliance within or outside of a building. shutdown module the shutdown module is a simple application that will automatically turn the resource off at a pre-determined time when other requirements are also met—such as when its not being used. if the resource is in use at the time the shutdown is set for, the user is not interrupted by any pop-ups the software will simply wait a further pre-defined period and check again to see if the resource is still in use. the application will continue to do this until the resource is no longer in use—then it will produce a pop-up giving the user (if still present) an opportunity to delay the shutdown process. unusually, the shutdown module uses a web-services methodology to allow the shutdown settings to be managed centrally—by the energy automation service or its local energy node. in this case, the computing resource is the “client” which requests an update (from the energy service or node—the server) to its shutdown settings every time the energy status of the computing resource changes. the significance of this architecture is that it enables centralised management of shut-down policies while still meeting the very strict security requirements of certain enterprises—where a user's computer can only ever be a client. the shutdown module is also configured to automatically save any unsaved documents to a secure location on the computing resource or to a connected network before it shuts down. these documents can be easily recovered from a folder on the user desktop. status module the status module is a small foot-print “service” that runs on the computing resource and monitors the current energy status of the resource. in the context of a pc, if the status changes between any one of the standard windows energy states, such as hibernate, resume, user log-on, etc.; the status module sends a message to its connected energy node. understanding this status reduces the change of a computing resource being accidentally turned off while it is still in use—as this will almost certainly result in data loss. again a web-services methodology is used to communicate with the energy node where the resource is the client—meeting the security requirements of the certain organisations. policy override device in this implementation the policy override device is a wired or wireless switch or other input device that is used to override a policy in a specific area. when the button is pressed or the device is triggered by another input such as an alarm relay or pir detector, a message is broadcast across the ethernet network to all energy nodes informing them that someone has just entered a specific area and wishes to override any shutdown policies in that area. the energy nodes are “paired” to all relevant override devices during the installation process. each energy node is responsible for listening to each broadcast and determining whether any action is required as a result of the override device being triggered. the policy override device can also be used in conjunction with a “protection policy” to trigger a single or series of protection events within the building. for example, if a fire alarm is triggered, the energy system could automatically turn off all appliances under its control to help limit the spread of the fire. similarly, all appliances could be turned off in the event of a burglary—reducing the risk of data theft. during system installation, the building is divided up into virtual “energy zones”. each override device can be assigned to a specific zone, group of zones or even an individual user—allowing a single override device to control a single user or an entire enterprise. energy automation service the energy automation service is a web based service that allows remote access to an “energy automation” system from a remote location, thereby allowing a user to set and change energy policies from a remote location. the energy automation service is a set of software applications that are remotely hosted, for example in a data centre—the services are delivered to the customer through the “software as a service” model. the service is provided by exploiting historical energy consumption data stored within the data centre. this data is collected from the energy nodes within the user's building either using a web services architecture (where allowed by the customer) or by an automatic back-up process—where each energy node packages and sends data to the data centre on a regular basis. because of the small physical size of the node, it can only hold a relatively small amount of energy data—perhaps a month or so of data; so this back-up process is more significant in a distributed system. in order to provide some near real-time elements to the services, a web services model is used. through this model specific pieces of current information are requested directly from the distributed energy nodes by the service. in this case, the energy nodes act as the server and the data centre is the client. this architecture allows the energy automation service to provide a wide range of tools and services such as reporting, billing, alerts, etc. system interactions within a distributed system the widely distributed nature of the energy management system of this particular implementation, means that the system-level interactions needed to change policy settings and to view the collected data are very different to a system which has a centralised data collection and policy setting entity. in this implementation the node itself is responsible for the collection and short-term storage of energy data and the orchestration of “local” energy management policies. as a result, when a user or system administrator wishes to view data about the user, that data is generated and displayed by the web-server embedded into the node of the device. the user uses his/her web browser to directly access the node. to simplify navigation between a large number of nodes within a building or enterprise an “indexing application” may be run on the customers' intranet web site or through the energy automation service. any “aggregated view” of data collected from multiple energy nodes would be collected and viewed in real-time from this indexing application. if the user then wishes to drill down into data at the single energy node level—the user is automatically and seamlessly switched to data that is generated and presented by the node itself. similarly, if the user wishes to update an energy policy, if the policy applies to multiple nodes, the user will interact with the indexing application that will pass-down the policy to all of the relevant nodes. if only one node is relevant than the user will again be directed seamlessly to the node itself. all changes to policies are made through a web based form interface. the advantage of this approach is that the system is effective and easy to manage as a single node and scales easily to several hundred nodes. the system of this implementation has several advantages over that previously disclosed, for example: lower system cost; there is no need for an “energy automation appliance”-particularly important in low node-count installationsreduced traffic over the ethernet network; most interactions occur between the node and it's directly connected pc as a result the amount of energy management data transmitted through the enterprise wide ethernet network is greatly reducedimproved system reliability; there is no centralised energy appliance to fail—providing improved reliability and better service availability it will be appreciated that whilst various aspects and embodiments of the present invention have heretofore been described, the scope of the present invention is not limited to the particular arrangements set out herein and instead extends to encompass all arrangements, and modifications and alterations thereto, which fall within the scope of the appended claims. for example, it is envisaged that information corresponding to the current energy status of at least one computing resource may be transferred to one or more secondary energy management systems. current energy status information may be utilised by a secondary energy management system for the purpose of increasing the efficiency with which energy is used by that system. one example of a secondary energy management system is a building management system (bms) configured to control the lighting and/or heating in a building. a bms configured to control the lights in a building may utilise information detailing which computing resources are currently not in use in that building (and where such computing resources are located). in particular a bms may use such information to switch off or reduce the amount of lighting in the vicinity of computing resources that are not in use (on the assumption that people are not in that area and hence lighting is not required). similarly a bms configured to control the heating or other services in a building may utilise computing resource status information to switch off (or reduce) heat or other services in parts of a building where computing resources that are not in use are located. with reference to fig. 5 , the status module 19 (in the energy management system of fig. 2 ) may be configured to transfer information concerning the energy status of computing resource 17 to the energy automation appliance 11 each time the energy status of the computing resource 17 changes. the energy status of a computing resource may change for example when a user logs on or off the computing resource and/or when the computing resource changes between: i) an in use state; ii) a screensaver mode; iii) a sleep mode; iv) a hibernation mode; or v) a shut down mode for example. it is envisaged that energy status information may be transferred from the energy automation appliance 11 (via the energy automation service 13 in one implementation) to a secondary energy management system 33 . similarly with reference to fig. 6 , it is also envisaged that the status module 27 (in the energy management system of fig. 3 ) may be configured to transfer information concerning the energy status of its respective computing resource to the energy node 23 each time the energy status of the computing resource changes. such energy status information may then be transferred from the energy node 23 (via the energy automation service 31 in one implementation) to a secondary energy management system 33 . in other envisaged implementations, the information transferred to the secondary energy management system may also be used for purposes other than energy management. for example, if the information transferred indicates that a given computing resource has not been used during business hours of a given day, then it may be inferred (and optionally recorded, for example in a personnel management system) that the person to whom that computing resource has been allocated was not at work that day. similarly, the information transferred may be used to record a time at which a given computing resource was first switched on in the morning, and a time at which the computing resource was switched off in the evening, and from this information it may be inferred the number of hours worked by a given employee in a given day. as aforementioned, in some arrangements more than one computing resource may be coupled to a particular node. in such an arrangement a bms may cause the amount of lighting and/or heating in the location of a node coupled to more than one computing resource to be turned off (or reduced) when all the computing resources coupled to that node are determined not to be in use. it will further be appreciated that where certain functionality has been described above in the context of software modules, persons skilled in the art will be aware that this functionality could alternatively be implemented in hardware, or indeed in a mix of hardware and software, and hence the teachings of the present invention should not be interpreted as being limited only to a software implementation. lastly, it should also be noted that whilst the accompanying claims set out particular combinations of features described herein, the scope of the present invention is not limited to the particular combinations hereafter claimed, but instead extends to encompass any combination of features (from any implementation) herein disclosed.
051-294-451-257-857	US	[ "US" ]	B01D61/30,B01D61/02,B01D61/14,B01D61/58,C02F1/00,C02F1/02,C02F1/28,C02F1/44,C02F9/00,C02F103/02,F24H1/12,A61L2/04,A61L2/00,B01D61/28,C02F1/20,B01D61/26,A61M1/16,B01D61/08,B01D61/18,A61K33/00,C02F9/20	2010-06-07T00:00:00	2010	[ "B01", "C02", "F24", "A61" ]	fluid purification system	certain disclosed embodiments concern systems and methods of preparing dialysate for use in a home dialysis system that is compact and light-weight relative to existing systems and consumes relatively low amounts of energy. the method includes coupling a household water stream to a dialysis system; filtering the water stream; heating the water stream to at least about 138 degrees celsius in a non-batch process to produce a heated water stream; maintaining the heated water stream at or above at least about 138 degrees celsius for at least about two seconds; cooling the heated water stream to produce a cooled water stream; ultrafiltering the cooled water stream; and mixing dialysate components into the cooled water stream in a non-batch process.	1. a fluid purification system having an inlet and an outlet, and defining a fluid flow pathway, comprising: a pump; a microfluidic pasteurizer downstream of the pump and coupled to the fluid flow pathway, the fluid flow pathway comprising (a) a first region where fluid flows in a first direction at a first temperature; (b) a heater region downstream of the first region, and including at least one heater that transfers heat into the fluid flowing through the heater region at the first temperature to increase the temperature to a second temperature greater than the first temperature to pasteurize the fluid flowing through the pathway; and (c) a second region downstream of the heater region where fluid flows in a second direction at a temperature greater than the first temperature, wherein fluid flowing in the second region thermally communicates with fluid flowing in the first region such that heat transfers from fluid flowing in the second region to fluid flowing in the first region resulting in a temperature reduction in the fluid as it flows through the second region, wherein fluid flows out of the pathway through the outlet at a temperature less than the second temperature; and a throttling valve downstream of the microfluidic pasteurizer, wherein the pump and the throttling valve operate in a closed loop control setup to maintain the fluid at a desired pressure and flow rate as the fluid passes through the pasteurizer. 2. the fluid purification system of claim 1 , wherein the pump is configured to increase the fluid pressure in the fluid flow pathway to a pressure higher than saturation pressure in the pasteurizer. 3. the fluid purification system of claim 1 , wherein the desired pressure is at least a saturation pressure such that the fluid does not change state as the fluid passes through the pasteurizer. 4. the fluid purification system of claim 1 , further comprising a filter upstream of the pasteurizer. 5. the fluid purification system of claim 4 , where the filter is a carbon filter. 6. the fluid purification system of claim 1 , further comprising a reverse osmosis element upstream of the pasteurizer. 7. the fluid purification system of claim 1 , further comprising an ultra-filtration element downstream of the pasteurizer. 8. the fluid purification system of claim 1 , further comprising a de-gassifier system downstream of the pasteurizer. 9. the fluid purification system of claim 1 , wherein the fluid is water. 10. the fluid purification system of claim 1 , further comprising a dialysate mixer that receives fluid from the outlet and mixes the fluid with dialysate components to form a dialysate. 11. the fluid purification system of claim 10 , further comprising a dialyzer that receives dialysate from the dialysate mixer. 12. the fluid purification system of claim 1 , further comprising: a reverse osmosis element upstream of the pasteurizer; an ultra-filtration element downstream of the pasteurizer; and a de-gassifier system downstream of the pasteurizer. 13. the fluid purification system of claim 1 , further comprising a recirculation loop adapted to permit fluid leaving the fluid pathway to be recirculated back into the fluid pathway. 14. the fluid purification system of claim 13 , further comprising a source of sterilizing fluid coupled to the recirculation loop. 15. a method for purifying a fluid, comprising: introducing a fluid stream into a fluid pathway; passing the fluid stream through a pump configured to achieve a predetermined fluid pressure in the fluid flow pathway; passing the fluid through a microfluidic pasteurizer coupled to the fluid flow pathway, the fluid flow pathway comprising (a) a first region where the fluid flows in a first direction at a first temperature; (b) a heater region downstream of the first region, and including at least one heater that transfers heat into the fluid flowing through the heater region at the first temperature to increase the temperature to a second temperature greater than the first temperature to pasteurize the fluid flowing through the pathway; and (c) a second region downstream of the heater region where fluid flows in a second direction at a temperature greater than the first temperature, wherein fluid flowing in the second region thermally communicates with fluid flowing in the first region such that heat transfers from fluid flowing in the second region to fluid flowing in the first region resulting in a temperature reduction in the fluid as it flows through the second region, wherein fluid flows out of the pathway at a temperature less than the second temperature; and passing the fluid stream through a throttling valve after the fluid exits the microfluidic pasteurizer, wherein the pump and the throttling valve operate in a closed-loop to collectively maintain the fluid at a flow rate and pressure that inhibits the fluid from undergoing a phase change in the pasteurizer. 16. the method of claim 15 wherein the fluid is water. 17. the method of claim 16 , further comprising passing the water stream through a filter. 18. the method of claim 17 where the filter is a carbon filter. 19. the method of claim 16 , further comprising passing the water stream through a reverse osmosis element. 20. the fluid purification system of claim 1 , wherein the fluid is maintained at or above the second temperature for at least two seconds. 21. the method of claim 16 , further comprising passing the water through a dialyzer after the water exits the throttling valve.	cross reference to related application this is a continuation of u.s. patent application ser. no. 13/068,038, now issued as u.s. pat. no. 8,524,086, filed apr. 29, 2011, which is a continuation of u.s. patent application ser. no. 12/795,382, now issued as u.s. pat. no. 8,501,009, filed jun. 7, 2010, both of which prior applications are incorporated herein by reference in their entirety. field the present disclosure concerns a fluid purification system, particularly a liquid purification system, and even more particularly a system for preparing fluids for use in dialysis. background there are, at present, hundreds of thousands of patients in the united states with end-stage renal disease. most of those require dialysis to survive. united states renal data system projects the number of patients in the u.s. on dialysis will climb past 600,000 by 2012. many patients receive dialysis treatment at a dialysis center, which can place a demanding, restrictive and tiring schedule on a patient. patients who receive in-center dialysis typically must travel to the center at least three times a week and sit in a chair for 3 to 4 hours each time while toxins and excess fluids are filtered from their blood. after the treatment, the patient must wait for the needle site to stop bleeding and blood pressure to return to normal, which requires even more time taken away from other, more fulfilling activities in their daily lives. moreover, in-center patients must follow an uncompromising schedule as a typical center treats three to five shifts of patients in the course of a day. as a result, many people who dialyze three times a week complain of feeling exhausted for at least a few hours after a session. given the demanding nature of in-center dialysis, many patients have turned to home dialysis as an option. home dialysis provides the patient with scheduling flexibility as it permits the patient to choose treatment times to fit other activities, such as going to work or caring for a family member. one requirement of a home dialysis system is a reliable water purification system as dialysis requires purified water for mixing with a dialysate concentrate. even trace amounts of mineral concentrates and biological contamination in the water can have severe adverse effects on a dialysis patient. in addition, water purification systems in typical dialysis systems must be capable of purifying the very large quantities of water required to run a full dialysis session. unfortunately, existing water purifications have drawbacks that limit practical usage of such systems in a home dialysis system. existing water purification systems are large and bulky, often being as large as a residential washing machine and weighing over three hundred pounds. such systems also very often consume large amounts of energy in order to purify relatively small amounts of water. in sum, existing water purification systems are bulky and expensive, making them practically unsuitable for use in the average patient's home. summary in view of the foregoing, there is a need for improved water purification systems that may be used in conjunction with home dialysis. such a system would ideally be small, lightweight, portable, and have the capability of reliably, reproducibly, highly efficiently and relatively inexpensively providing a source of purified water of sufficient volumes to enable home dialysis. in addition, such a water purification system could ideally be incorporated into a dialysis system that requires much less purified water at any one time than the volumes typically needed for dialysis today, thereby further reducing the expense of running the system at home. in addition, the system would be capable of producing real-time, on-demand ultrapure water for dialysis, the gold standard of present-day dialysis. disclosed herein is an in-line, non-batch water purification system that utilizes a microfluidics heat exchanger for heating, purifying and cooling water. the system is compact and light-weight relative to existing systems and consumes relatively low amounts of energy. the water purification system is suitable for use in a home dialysis system although it can be used in other environments where water purification is desired. the system can also be used to purify fluids other than water. the system can be connected to a residential source of water (such as a running water tap to provide a continuous or semi-continuous household stream of water) and can produce real-time pasteurized water for use in home dialysis, without the need to heat and cool large, batched quantities of water. in one aspect, disclosed is a method of preparing dialysate for use in a dialysis system. the method includes coupling a water source, such as a household water stream, to a dialysis system; filtering the water stream; heating the water stream to at least about 138 degrees celsius in a non-batch process to produce a heated water stream; maintaining the heated water stream at or above at least about 138 degrees celsius for at least about two seconds; cooling the heated water stream to produce a cooled water stream; ultrafiltering the cooled water stream; and mixing dialysate components into the cooled water stream in a non-batch process. in another aspect, disclosed is a method of preparing dialysate for use in a dialysis system that includes processing a household water stream in a non-batch process to produce an ultra-high-temperature-pasteurized water stream; and mixing dialysate components into said ultra-high-temperature-pasteurized water stream. the mixing of dialysate components is performed in a non-batch process. in another aspect, disclosed is a method of ultrapasteurizing a fluid including providing a microfluidic heat exchanger having a fluid flowpath for only a single fluid. the flowpath includes multiple fluid pathways for said single fluid to travel. the fluid flowpath includes an inlet portion, a heating portion and an outlet portion that thermally communicates with the inlet portion when the heat exchanger is in operation. the method also includes introducing the fluid into the inlet portion of the heat exchanger at a selected flow rate; transferring heat to the fluid in the inlet portion from the fluid in the outlet portion, thereby heating the fluid in the inlet portion and cooling the fluid in the outlet portion; further heating the fluid in the heating portion to a temperature greater than about 130 degrees celsius; maintaining the fluid at a temperature greater than about 130 degrees celsius for a period of at least about two seconds at the selected flow rate; and cooling the fluid in the outlet portion at least in part by the transfer of heat to the fluid in the inlet portion, and permitting the fluid to exit the microfluidic heat exchanger without interaction with a second fluid within the heat exchanger. in another aspect, disclosed is a fluid purification system including a fluid pathway having an inlet where fluid flows into the system and an outlet where fluid flows out of the system. the fluid pathway further includes a first region where fluid flows in a first direction at a first temperature; a heater region downstream of the first region; and a second region downstream of the heater region where fluid flows in a second direction at a temperature greater than the first temperature. the heater region includes at least one heater that transfers heat into fluid flowing through the heater region to increase the temperature of fluid flowing in the heater region to a second temperature greater than the first temperature. fluid flowing in the second region thermally communicates with fluid flowing in the first region such that heat transfers from fluid flowing in the second region to fluid flowing in the first region resulting in a temperature reduction in the fluid as it flows through the second region. fluid flows out of the pathway through the outlet at a temperature less than the second temperature. other features and advantages should be apparent from the following description of various embodiments, which illustrate, by way of example, the principles of the disclosed devices and methods. brief description of the drawings fig. 1 shows a high level, schematic view of a fluid purification system adapted to purify a fluid such as a liquid. fig. 2 shows a schematic, plan view of an exemplary embodiment of a microfluidic heat exchange system adapted to heat and cool a single fluid without the use of a second fluid stream to add heat to or remove heat from the fluid. fig. 3a shows an exemplary embodiment of an inlet lamina that forms at least one inlet pathway where fluid flows in an inward direction through the heat exchange system. fig. 3b shows an exemplary embodiment of an outlet lamina that forms at least one outlet pathway where fluid flows in an outward direction through the heat exchange system. fig. 3c shows an exemplary embodiment having superimposed inlet and outlet laminae. fig. 4 shows an enlarged view of an inlet region of the inlet lamina. fig. 5 shows an enlarged view of a heater region of the inlet lamina. fig. 6 shows an enlarged view of a residence chamber of both the inlet lamina and outlet lamina. fig. 7a shows a plan view of another embodiment of an inlet lamina. fig. 7b shows a plan view another embodiment of an outlet lamina. fig. 8 shows a perspective view of an exemplary stack 805 of laminae. fig. 9 shows a perspective view of an example of an assembled microfluidic heat exchange system. fig. 10 shows a schematic view of an exemplary heater control system coupled to the microfluidic heat exchange system. fig. 11 shows a schematic, plan view of another exemplary embodiment of flow pathways for the microfluidic heat exchange system. fig. 12 shows a schematic, plan view of another exemplary embodiment of flow pathways for the microfluidic heat exchange system. fig. 13a shows another embodiment of an inlet lamina that forms an inlet pathway where fluid flows in an inward direction through the heat exchange system. fig. 13b shows another embodiment of an outlet lamina that forms an outlet pathway where fluid flows in an outward direction through the heat exchange system. fig. 14 is a table illustrating combinations of temperature and time to achieve various pasteurization levels. detailed description in order to promote an understanding of the principals of the disclosure, reference is made to the drawings and the embodiments illustrated therein. nevertheless, it will be understood that the drawings are illustrative and no limitation of the scope of the disclosure is thereby intended. any such alterations and further modifications in the illustrated embodiments, and any such further applications of the principles of the disclosure as illustrated herein are contemplated as would normally occur to one of ordinary skill in the art. fig. 1 shows a high level, schematic view of a fluid purification system adapted to purify a fluid such as a liquid. in an embodiment, the system is adapted to be used for purifying water, such as water obtained from a household tap, in a dialysis system and is sometimes described herein in that context. however, it should be appreciated that the fluid purification system can be used for purifying water in other types of systems and is not limited for use in a dialysis system. also, the purification system can be used to purify liquids other than water. with reference to fig. 1 , the fluid purification system includes a plurality of subsystems and/or components each of which is schematically represented in fig. 1 . a fluid such as water enters the fluid purification system at an entry location 105 and communicates with each of the subsystems and components along a flow pathway toward an exit location 107 . upon exiting the fluid purification system, the fluid is in a purified state. this may include the fluid being in a pasteurized state although the fluid system does not necessarily pasteurize the fluid in all circumstances. the embodiment shown in fig. 1 is exemplary and not all of the components shown in fig. 1 are necessarily included in the system. the individual components included in the system may vary depending on the type and level of purification or pasteurization required. the quantity and sequential order of the subsystems along the flow pathway shown in fig. 1 is for purposes of example and it should be appreciated that variations are possible. the fluid purification system includes at least one microfluidic heat exchange (hex) system 110 adapted to achieve pasteurization of the liquid passing through the fluid purification system, as described more fully below. the fluid purification system may also include one or more additional purification subsystems, such as a sediment filter system 115 , a carbon filter system 120 , a reverse osmosis system 125 , an ultrafilter system 130 , an auxiliary heater system 135 , a degassifier system 140 , or any combination thereof. the fluid purification system may also include hardware and/or software to achieve and control fluid flow through the fluid purification system. the hardware may include one or more pumps 150 or other devices for driving fluid through the system, as well as sensors for sensing characteristics of the fluid and fluid flow. the operation of the fluid purification system is described in detail below. microfluidic heat exchange system fig. 2 shows a schematic, plan view of an exemplary embodiment of the microfluidic heat exchange system 110 , which is configured to achieve pasteurization of a liquid (such as water) flowing through the system without the need for a second fluid stream to add heat to or remove heat from the liquid. fig. 2 is schematic and it should be appreciated that variations in the actual configuration of the flow pathway, such as size and shape of the flow pathway, are possible. as described more fully below, the microfluidic heat exchange system defines a fluid flow pathway that includes (1) at least one fluid inlet; (2) a heater region where incoming fluid is heated to a pasteurization temperature via at least one heater; (3) a residence chamber where fluid remains at or above the pasteurization temperature for a predetermined time period; (4) a heat exchange section where incoming fluid receives heat from hotter (relative to the incoming fluid) outgoing fluid, and the outgoing fluid cools as it transfers heat to the incoming fluid; and (5) a fluid outlet where outgoing fluid exits in a cooled, pasteurized state. depending on the desired temperature of the outgoing fluid, one or more additional heat exchanges may be required downstream to adjust the actual temperature of the outgoing fluid to the desired temperature for use, for example, in dialysis. this is especially true in warmer climates, where incoming water may be tens of degrees higher than water supplied in colder climates, which will result in higher outlet temperatures than may be desired unless further cooling is applied. in an embodiment, the flow pathway is at least partially formed of one or more microchannels, although utilizing microfluidic flow fields as disclosed in u.s. provisional patent application no. 61/220,117, filed on jun. 24, 2009, and its corresponding utility application u.s. patent application ser. no. 12/795,371 entitled “microfluidic devices,” filed jun. 7, 2010, and naming richard b. peterson, james r. curtis, hailei wang, robbie ingram-gobel, luke w. fisher and anna e. garrison, incorporated herein by reference, for portions of the fluid flow pathway such as the heat exchange section is also within the scope of the invention. the relatively reduced dimensions of a microchannel enhance heat transfer rates of the heat exchange system by providing a reduced diffusional path length and amount of material between counterflow pathways in the system. in an embodiment, a microchannel has at least one dimension less than about 1000 μm. the dimensions of a microchannel can vary and are generally engineered to achieve desired heat transfer characteristics. a microchannel in the range of about 0.1 to about 1 mm in hydraulic diameter generally achieves laminar fluid flow through the microchannel, particularly in a heat exchange region of the microchannel. the small size of a microchannel also permits the heat exchange system 110 to be compact and lightweight. in an embodiment, the microchannels are formed in one or more lamina that are arranged in a stacked configuration, as formed below. the flow pathway of the microfluidic heat exchange system 110 may be arranged in a counterflow pathway configuration. that is, the flow pathway is arranged such that cooler, incoming fluid flows in thermal communication with hotter, outgoing fluid. the hotter, outgoing fluid transfers thermal energy to the colder, incoming fluid to assist the heaters in heating the incoming fluid to the pasteurization temperature. this internal preheating of the incoming fluid to a temperature higher than its temperature at the inlet 205 reduces the amount of energy used by the heaters 220 to reach the desired peak temperature. in addition, the transfer of thermal energy from the outgoing fluid to the incoming fluid causes the previously heated, outgoing fluid to cool prior to exiting through the fluid outlet. thus, the fluid is “cold” as it enters the microfluidic heat exchange system 110 , is then heated (first via heat exchange and then via the heaters) as it passes through the internal fluid pathway, and is “cold” once again as it exits the microfluidic heat exchange system 110 . in other words, the fluid enters the microfluidic heat exchange system 110 at a first temperature and is heated (via heat exchange and via the heaters) to a second temperature that is greater than the first temperature. as the fluid follows an exit pathway, the fluid (at the second temperature) transfers heat to incoming fluid such that the fluid drops to a third temperature that is lower than the second temperature and that is higher than the first temperature. exemplary embodiments of a fluid pathway and corresponding components of the microfluidic heat exchange system 110 are now described in more detail with reference to fig. 2 , which depicts a bayonet-style heat exchanger, with the inlet and outlet on one side of the device, a central heat exchange portion, and a heating section toward the opposite end. the fluid enters the microfluidic heat exchange system 110 through an inlet 205 . in the illustrated embodiment, the flow pathway branches into one or more inflow microchannels 210 that are positioned in a counterflow arrangement with an outflow microchannel 215 . as mentioned, microfluidic heat exchange system 110 may be formed by a stack of layered lamina. the inflow microchannels 210 may be positioned in separate layers with respect to the outflow microchannels 215 such that inflow microchannels 210 are positioned above or below the outflow microchannels 215 in an interleaved fashion. in another embodiment, the inflow microchannels 210 and outflow microchannels 215 are positioned on a single layer. the outflow microchannel 215 communicates with an outlet 207 . in the illustrated embodiment, the inlet 205 and outlet 207 are positioned on the same end of the microfluidic heat exchange system 110 , although the inlet 205 and outlet 207 may also be positioned at different positions relative to one another. the counterflow arrangement places the inflow microchannels 210 in thermal communication with the outflow microchannel 215 . in this regard, fluid in the inflow microchannels 210 may flow along a directional vector that is oriented about 180 degrees to a directional vector of fluid flow in the outflow microchannels 215 . the inflow and outflow microchannels may also be in a cross flow configuration wherein fluid in the inflow microchannels 210 may flow along a directional vector that is oriented between about 180 degrees to about 90 degrees relative to a directional vector of fluid flow in the outflow microchannels 215 . the orientation of the inflow microchannels relative to the outflow microchannels may vary in any matter that is configured to achieve the desired degree of thermal communication between the inflow and outflow microchannels. one or more heaters 220 are positioned in thermal communication with at least the inflow microchannels 210 such that the heaters 220 can provide heat to fluid flowing in the system. the heaters 220 may be positioned inside the inflow microchannels 210 such that fluid must flow around multiple sides of the heaters 220 . or, the heaters 220 may be positioned to the side of the inflow microchannels 210 such that fluid flows along one side of the heaters 220 . in any event, the heaters 220 transfer heat to the fluid sufficient to cause the temperature of the fluid to achieve a desired temperature, which may include a pasteurization temperature in the case of water to be purified. in an embodiment, the fluid is water and the heaters 220 assist in heating the fluid to a temperature of at least 100 degrees celsius at standard atmospheric pressure. in an embodiment, the fluid is water and the heaters 220 assist in heating the fluid to a temperature of at least 120 degrees celsius. in an embodiment, the fluid is water and the heaters 220 assist in heating the fluid to a temperature of at least 130 degrees celsius. in an embodiment, the fluid is water and the heaters 220 assist in heating the fluid to a temperature of at least 138 degrees celsius. in another embodiment, the fluid is water and is heated to a temperature in the range of about 138 degrees celsius to about 150 degrees celsius. in another embodiment, the fluid is heated to the highest temperature possible without achieving vaporization of the fluid. thus, the microfluidic heat exchange system 110 may maintain the fluid as a single phase liquid. because water typically changes phases from a liquid into a gaseous state around 100 degrees celsius, heating water to the temperatures set forth above requires pressurization of the heat exchange system so that the single-phase liquid is maintained throughout. pressures above the saturation pressure corresponding to the highest temperature in the heat exchange system are sufficient to maintain the fluid in a liquid state. as a margin of safety, the pressure is typically kept at 10 psi or higher above the saturation pressure. in an embodiment, the pressure of water in the microfluidic heat exchange system is maintained greater than 485 kpa to prevent boiling of the water, and may be maintained significantly in excess of that level, such as 620 kpa or even as high as 900 kpa, in order to ensure no boiling occurs. these pressures are maintained in the heat exchange system using a pump and a throttling valve. a pump upstream of the heat exchange system and a throttling valve downstream of the heat exchange system are used where the pump and throttling valve operate in a closed loop control setup (such as with sensors) to maintain the desired pressure and flow rate throughout the heat exchange system. once the fluid has been heated to the pasteurization temperature, the fluid passes into a residence chamber 225 where the fluid remains heated at or above the pasteurization temperature for a predetermined amount of time, referred to as the “residence time”, or sometimes referred to as the “dwell time”. in an embodiment, the dwell time can be less than or equal to one second, between one and two seconds, or at least about two seconds depending on the flow path length and flow rate of the fluid. higher temperatures are more effective at killing bacteria and shorter residence times mean a more compact device. ultrahigh temperature pasteurization, that is designed to kill all colony forming units (cfus) of bacteria down to a concentration of less than 10 −6 cfu/ml (such as for purifying the water for use with infusible dialysate is defined to be achieved when water is heated to a temperature of 138 degrees celsius to 150 degrees celsius for a dwell time of at least about two seconds. ultrapure dialysate has a bacterial load no greater than 0.1 cfu·ml. fig. 14 indicates the required temperature and residence time to achieve various levels of pasteurization. the heat exchange system described herein is configured to achieve the various levels of pasteurization shown in fig. 14 . the fluid then flows from the residence chamber 225 to the outflow microchannel 215 , where it flows toward the fluid outlet 207 . as mentioned, the outflow microchannel 215 is positioned in a counterflow relationship with the inflow microchannel 210 and in thermal communication with the inflow microchannel 210 . in this manner, outgoing fluid (flowing through the outflow microchannel 215 ) thermally communicates with the incoming fluid (flowing through the inflow microchannel 210 ). as the heated fluid flows through the outflow microchannel 215 , thermal energy from the heated fluid transfers to the cooler fluid flowing through the adjacent inflow microchannel 210 . the exchange of thermal energy results in cooling of the fluid from its residence chamber temperature as it flows through the outflow microchannel 215 . moreover, the incoming fluid is preheated via the heat exchange as it flows through the inflow microchannel 210 prior to reaching the heaters 220 . in an embodiment, the fluid in the outgoing microchannel 210 is cooled to a temperature that is no lower than the lowest possible temperature that precludes bacterial infestation of the fluid. when the heat exchange system pasteurizes the fluid, bacteria in the fluid down to the desired level of purification are dead as the fluid exits the heat exchange system. in such a case, the temperature of the fluid after exiting the heat exchange system may be maintained at room temperature before use in dialysis. in another embodiment, the fluid exiting the heat exchange system is cooled to a temperature at or below normal body temperature. although an embodiment is shown in fig. 2 as having an outlet channel sandwiched between an inflow channel, other arrangements of the channels are possible to achieve the desired degrees of heating and cooling and energy requirements of the heaters. common to all embodiments, however, is that all fluid pathways within the system are designed to be traveled by a single fluid, without the need for a second fluid to add heat to or remove heat from the single fluid. in other words, the single fluid relies on itself, at various positions in the fluid pathway, to heat and cool itself. the dimensions of the microfluidic heat exchange system 110 may vary. in an embodiment, the microfluidic heat exchange system 110 is sufficiently small to be held in the hand of a user. in another embodiment, the microfluidic heat exchange system 110 is a single body that weighs less than 5 pounds when dry. in another embodiment, the microfluidic heat exchange portion 350 of the overall system 110 has a volume of about one cubic inch. the dimensions of the microfluidic heat exchange system 110 may be selected to achieve desired temperature and dwell time characteristics. as mentioned, an embodiment of the microfluidic heat exchange system 110 is made up of multiple laminar units stacked atop one another to form layers of laminae. a desired microfluidic fluid flow path may be etched into the surface of each lamina such that, when the laminae are stacked atop one another, microfluidic channels or flow fields are formed between the lamina. furthermore, both blind etching and through etching may be used for forming the channels in the laminae. in particular, through etching allows the fluid to change the plane of laminae and move to other layers of the stack of laminae. this occurs in one embodiment at the outlet of the inflow laminae where the fluid enters the heater section, as described below. through etching allows all laminae around the heater section to participate in heating of the fluid instead of maintaining the fluid only in the plane of the inlet laminae. this embodiment provides more surface area and lower overall fluid velocity to facilitate the heating of the fluid to the required temperature and ultimately contributes to the efficiency of the device. the microchannels or flow fields derived from blind and/or through etching of the laminae form the fluid flow pathways. fig. 3a shows a plan view of an exemplary embodiment of an inlet lamina 305 that forms at least one inlet pathway where fluid flows in an inward direction (as represented by arrows 307 ) through the heat exchange system 110 . fig. 3b shows a plan view an exemplary embodiment of an outlet lamina 310 that forms at least one outlet pathway where fluid flows in an outward direction (as represented by arrows 312 ) through the heat exchange system 110 . the inlet pathway and the outlet pathway may each comprise one or more microchannels. in an embodiment, the inlet and outlet pathway comprise a plurality of microchannels arranged in parallel relationship. figs. 3a and 3b show the lamina 305 and 310 positioned adjacent each other, although in assembled device the lamina are stacked atop one another in an interleaved configuration. fig. 3c shows the inlet lamina 305 and outlet lamina 310 superimposed over one another showing both the inlet pathway and outlet pathway. the inlet lamina 305 and outlet lamina 310 are stacked atop one another with a fluid conduit therebetween so fluid may flow through the conduit from the inlet pathway to the outlet pathway, as described more fully below. when stacked, a transfer layer may be interposed between the inlet lamina 305 and the outlet lamina 310 . the transfer layer is configured to permit heat to transfer from fluid in the outlet pathway to fluid in the inlet pathway. the transfer layer may be any material capable of conducting heat from one fluid to another fluid at a sufficient rate for the desired application. relevant factors include, without limitation, the thermal conductivity of the heat transfer layer 110 , the thickness of the heat transfer layer, and the desired rate of heat transfer. suitable materials include, without limitation, metal, metal alloy, ceramic, polymer, or composites thereof. suitable metals include, without limitation, stainless steel, iron, copper, aluminum, nickel, titanium, gold, silver, or tin, and alloys of these metals. copper may be a particularly desirable material. in another embodiment, there is no transfer layer between the inlet and outlet laminae and the laminae themselves serve as the thermal transfer layer between the flow pathways. the inlet lamina 305 and outlet lamina 310 both include at least one inlet opening 320 and at least one outlet opening 325 . when the inlet lamina 305 and outlet lamina 310 are stacked atop one another and properly aligned, the inlet openings 320 align to collectively form a fluid pathway that extends through the stack and communicates with the inlet pathway of the inlet laminae 305 , as shown in fig. 3c . likewise, the outlet openings 325 also align to collectively form a fluid pathway that communicates with the outlet pathway of the outlet laminae 310 . any quantity of inlet lamina and outlet lamina can be stacked to form multiple layers of inlet and outlet pathways for the heat exchange system 110 . the quantity of layers can be selected to provide predetermined characteristics to the microfluidic heat exchange system 110 , such as to vary the amount of heat exchange in the fluid, the flow rate of the fluid capable of being handled by the system, etc. in an embodiment, the heat exchange system 110 achieves incoming liquid flow rates of at least 100 ml/min. in another embodiment, the heat exchange system 110 achieves incoming liquid flow rates of at least 1000 ml/min. such a heat exchange system may be manufactured of a plurality of laminae in which the microfluidic pathways have been formed using a masking/chemical etching process. the laminae are then diffusion bonded in a stack, as described in more detail below. in an embodiment, the stack includes 40-50 laminae with a flow rate of 2-3 ml/min occurring over each lamina. higher flow rates can be achieved by increasing the number of pairs of stacked laminae within the heat exchanger. in other embodiments, much higher flow rates can be handled through the system. in operation, fluid flows into the inlet pathway of the inlet lamina 305 via the inlet opening 320 . this is described in more detail with reference to fig. 4 , which shows an enlarged view of an inlet region of the inlet lamina 305 . the inlet opening 320 communicates with an inlet conduit 405 that guides the fluid to the inlet pathway. the inlet opening 320 may configured with a predetermined size relative to the size of the inlet conduit 405 , which may have a diameter of 2-mm. for example, in an embodiment, the inlet opening 320 has an associated hydraulic diameter that may be about ten to fifteen times larger than the hydraulic diameter of the inlet conduit 405 . such a ratio of hydraulic diameters has been found to force fluid to distribute relatively evenly among the multiple inlet laminae. in another embodiment, for a 2-mm wide inlet flow path, a hydraulic diameter ratio of greater than 10:1, such as 15:1, may be used to ensure an even distribution of fluid flow over the stack. with reference still to fig. 4 , a downstream end of the inlet conduit 405 opens into the inlet pathway, which flares outward in size relative to the size of the inlet conduit 405 . in this regard, one or more flow separation guides, such as fins 410 , may be positioned at the entryway to the inlet pathway. the flow separation fins are sized and shaped to encourage an even distribution of fluid as the fluid flows into the inlet pathway from the inlet conduit 405 . it should be appreciated that the size, shape, and contour of the inlet conduit 405 and inlet pathway may vary and that the embodiment shown in fig. 4 is merely exemplary. by way of example only, this region of the system could also comprise a flow field of pin-shaped members (of the sort disclosed in u.s. provisional patent application no. 61/220,177, filed on jun. 24, 2009, and its corresponding utility application entitled “microfluidic devices”, filed jun. 7, 2010, and naming richard b. peterson, james r. curtis, hailei wang, robbie ingram-gobel, luke w. fisher and anna e. garrison, incorporated herein by reference) around which the fluid flows. with reference again to fig. 3a , the inlet pathway and outlet pathway each include a heat exchange region. the heat exchange regions are referred to collectively using the reference numeral 350 and individually using reference numeral 350 a (for the inlet pathway) and reference numeral 350 b (for the outlet pathway). the heat exchange regions 350 are the locations where the colder fluid (relative to the fluid in the outlet pathway) of the inlet pathway receives heat transferred from the hotter fluid (relative to the fluid in the inlet pathway) of the outlet pathway. as discussed above, the relatively colder fluid in the inflow pathway is positioned to flow in thermal communication with the relatively hotter fluid in the outflow pathway. in this layered embodiment, the inflow pathway is positioned immediately above (or below) the outflow pathway when the lamina are stacked. heat transfers across the transfer layer from the fluid in the outflow pathway to the fluid in the inflow pathway as a result of the temperature differential between the fluid in the inflow pathway and the fluid in the outflow pathway and the thermal conductivity of the material separating the two pathways. again rather than comprising a series of microchannels, the heat exchange regions may also comprise a microfluidic flow field as described above. with reference still to fig. 3a , the fluid in the inflow pathway flows into a heater region 355 from the heat exchange region 350 . a plurality of pins 357 may be positioned in the inlet flow pathway between the heat exchange region 350 and the heater region 355 . the pins 357 disrupt the fluid flow and promote mixing, which may improve both fluid flow and heat distribution. fig. 5 shows an enlarged view of the heater region 355 . in an embodiment, the inflow pathway bifurcates into at least two flow pathways in the heater region 355 to accommodate a desired flow rate. alternatively only one flow path through the heater region may be utilized, or three or more flow paths may be selected. the heater region 355 includes one or more heaters 220 that thermally communicate with fluid flowing through this region, but are hermetically isolated from the flow path. the heaters 220 add heat to the incoming fluid sufficient to raise temperature of the fluid to the desired temperature, which may include a pasteurization temperature. the incoming fluid was previously preheated as it flowed through the heat exchange region 350 . this advantageously reduced the energy requirements for the heaters. the laminae in the stack may include through-etches at entry locations 505 to the heater region 355 such that fluid entering the heater region can pass through all the laminae in the stack. through etching allows all laminae around the heater section to participate in heating of the fluid instead of maintaining the fluid only in the plane of the inlet laminae. this provides more surface area between the fluid and the heaters and also provides lower overall fluid velocity to facilitate the heating of the fluid to the required temperature. as mentioned, the inflow pathway may bifurcate into multiple flow pathways. each pathway may include one or more heaters 220 arranged within the pathway so as to maximize or otherwise increase the amount of surface area contact between the heaters 220 and fluid flowing through the pathways. in this regard, the heaters 220 may be positioned towards the middle of the pathway such that the fluid must flow around either side of the heaters 220 along a semicircular or otherwise curvilinear pathway around the heaters 220 . the heaters 220 can vary in configuration. in an embodiment, the heaters 220 are conventional cartridge heaters with a ⅛-inch diameter which can be run in an embodiment at a combined rate of between about 70,000 and 110,000 w/m2, which results in energy usages of less than 100 w in one embodiment, and less than 200 w in another embodiment, for the entire stack running at about 100 ml/minute. in an embodiment, the system uses six heaters in a configuration of three heaters per flow pathway wherein each heater uses about 70 w for a 100 ml/min flow rate. in an embodiment the fluid is forced to flow around the heaters in paths 1.6 mm wide. with reference again to fig. 3a , the inflow pathway transitions from the heater section 355 to the residence chamber 360 . by the time the fluid flows into the residence chamber 360 , it has been heated to the desired temperature, such as the pasteurization temperature, as a result of the heat transfer in the heat exchange region 350 and/or by being heated in the heater section 355 . in the case of multiple laminae being stacked, the residence chamber 360 may be a single chamber that spans all of the layers of laminae in the stack such that the fluid from each inlet lamina flows into a single volume of fluid in the residence chamber 360 . the residence chamber 360 is configured such that fluid flow ‘shortcuts’ are eliminated, all of the fluid is forced to travel a flow pathway such that no portion of the fluid will reside in the residence chamber for the less than the desired duration at a specified flow rate, and the fluid is maintained at or above the pasteurization temperature for the duration of the time (i.e., the dwell time) that the fluid is within the residence chamber 360 . in effect, the residence time is a result of the dimensions of the flowpath through the residence area and the flow rate. it will thus be apparent to one of skill in the art how to design a residence pathway for a desired duration. fig. 6 shows an enlarged view of the region of the residence chamber 360 for the inlet lamina 305 and outlet lamina 310 . for clarity of illustration, fig. 6 shows the inlet lamina 305 and outlet lamina 310 positioned side-by-side although in use the laminae are stacked atop one another such that the residence chambers align to form a residence chamber that spans upward along the stack. in an embodiment, the residence chamber 360 incorporates a serpentine flow path as shown in the enlarged view of the residence chamber of fig. 6 . the serpentine flow path provides a longer flow path to increase the likelihood of the liquid spending a sufficient amount of time within the residence chamber 360 . after the fluid has reached the end of the serpentine flow path, it passes (represented by arrow 610 in fig. 6 ) to the outlet pathway of the outlet lamina 310 . with reference now to fig. 3b , the outlet pathway passes between the heaters 220 , which act as insulators for the fluid to lessen the likelihood of the fluid losing heat at this stage of the flow pathway. the heated fluid of the outlet pathway then flows toward the heat exchange region 350 b . the outlet flow pathway expands prior to reaching the heat exchange region 350 b . a set of expansion fans 367 directs the fluid into the expanded heat exchange region 350 b of the outlet pathway, where the fluid thermally communicates with the cooler fluid in the inflow pathway. as discussed, heat from the fluid in the hotter outflow pathway transfers to the cooler fluid in the inflow pathway. this results in cooling of the outflowing fluid and heating of the inflowing fluid. the fluid then flows from the heat exchange region 350 b to the outlet opening 325 . at this stage, the fluid is in a cooled, pasteurized state. in an embodiment, laminae having a thickness of 350 microns with an etch-depth of 175 microns, with 2.5-mm wide channels having a hydraulic diameter of 327 microns were utilized. each pair of laminae was able to handle a fluid flow rate of approximately 3.3. ml/min of fluid, which thus required 30 pairs of laminae in order to facilitate a flow of 100 ml/min, with only a 15-mm long heat exchanger section. in an embodiment, the fluid flowpaths are designed in smooth, sweeping curves and are substantially symmetrically designed along the longitudinal axis of the stack; if the flow paths are not designed symmetrically, they are designed to minimize differences in the path line or lengths so as to evenly distribute the flow, the heating of the fluid and the various dwell times. the width of the ribs separating channels in the heat exchange portion can be reduced, which would have the effect of increasing the available heat transfer area and reducing the length of the heat exchange portion required for the desired energy efficiency level of the device. energy efficiency levels of at least about 85%, and in some embodiment of at least about 90% can be achieved, meaning that 90% of the thermal energy from the outgoing fluid can be transferred to the incoming fluid stream and recaptured without loss. in this manner, a heat exchange system may be constructed to provide pasteurized water continuously at a desired flow rate for real-time mixing of dialysate in a dialysis system, without the need either to heat, purify and store water in batched quantities or to provide bags of pure water or of premixed dialysate for use by the patient. fig. 7a shows a plan view of another embodiment of an inlet lamina 705 that forms at least one inlet pathway where fluid flows in an inward direction (as represented by arrows 707 ) through the heat exchange system 110 . fig. 7b shows a plan view another embodiment of an outlet lamina 710 that forms at least one outlet pathway where fluid flows in an outward direction (as represented by arrows 712 ) through the heat exchange system 110 . the flow pathway in this embodiment generally follows a different contour than the flow pathway of the embodiment of figs. 3a and 3b . in actual use, the inlet lamina 705 and outlet lamina 710 are stacked atop one another. the fluid enters the inlet pathway of the inlet lamina 705 at an inlet 720 . the inlet pathway then splits into multiple pathways at the heat exchange region 750 a , which thermally communicates with a corresponding heat exchange region 750 b of the outlet lamina 710 . in another embodiment, the inlet pathway does not split into multiple pathways but remains a single pathway. the inlet pathway could also be at least partially formed of one or more microfluidic flow fields as disclosed in u.s. provisional patent application no. 61/220,117, filed on jun. 24, 2009, and its corresponding utility application u.s. patent application ser. no. 12/795,371 entitled “microfluidic devices”, filed jun. 7, 2010, and naming richard b. peterson, james r. curtis, hailei wang, robbie ingram-gobel, luke w. fisher and anna e. garrison, incorporated herein by reference. after the heat exchange region 750 a , the inlet pathway transitions to an arc-shaped heater region 760 that thermally communicates with a heater 765 , such as a 150-watt mcmaster-carr cartridge heater (model 3618k451). the heater region serves as both a region where the heater 765 heats the fluid and as a residence chamber where the fluid remains heated at or above the desired temperature for a predetermined amount of time. from the heater region 760 and residence chamber of the inlet lamina 710 , the fluid flows to the outlet lamina 710 at an entrance location 770 . the fluid then flows into the heat exchange region 750 b of the outlet lamina 710 , where the fluid transfers heat to the incoming fluid flowing through the heat exchange region 750 a of the inlet lamina 705 . the fluid then exits the outlet lamina at an outlet 775 . in embodiment, the lamina 705 and 710 are about 600 μm thick and the microfluidic flow pathways have a depth of about 400 μm to 600 μm. in each of the embodiments disclosed herein, the fluid flow path completely encircles each of the heaters so that any shim material conducting heat away from the heater will have fluid flowing over it to receive the heat, thereby minimizing heat loss to the environment. in addition, ideally, the flowpaths around each heater will be relatively narrow so that non-uniform heating due to separation from the heaters will be avoided. as mentioned, the microfluidic heat exchange system 110 may be formed of a plurality of lamina stacked atop one another and diffusion bonded. additional information concerning diffusion bonding is provided by u.s. patent application ser. no. 11/897,998 (now abandoned) and ser. no. 12/238,404 (now issued as u.s. pat. no. 8,622,606), which are incorporated herein by reference. in an embodiment, the stack includes multiple sets of lamina with each set including an inlet lamina 305 juxtaposed with an outlet lamina 310 . each set of juxtaposed inlet lamina and outlet lamina forms a single heat exchange unit. the stack of lamina may therefore include a plurality of heat exchange units wherein each unit is formed of an inlet lamina 305 coupled to an outlet lamina 310 . the flow pathways for each lamina may be formed by etching on the surface of the lamina, such as by etching on one side only of each lamina. when the laminae are juxtaposed, the etched side of a lamina seals against the unetched sided of an adjacent, neighboring lamina. this may provide desirable conditions for heat exchange and separation of the incoming fluid (which is not pasteurized) and the outgoing fluid (which is pasteurized). fig. 8 shows a perspective view of an exemplary stack 805 of laminae. the stack 805 is shown in partial cross-section at various levels of the stack including at an upper-most outlet lamina 310 , a mid-level inlet lamina 305 a , and a lower level inlet lamina 305 b . as mentioned, the stack 805 is formed of alternating inlet lamina and outlet lamina interleaved with one another. the heaters 220 are positioned within cut-outs that extend through the entire stack 805 across all the laminae in the stack 805 . the residence chamber 360 and the aligned inlet openings 320 and outlet openings 325 also extend entirely through the stack 805 . the laminae may also include one or more holes 810 that align when the lamina are stacked to form shafts through which alignment posts may be inserted. the quantity of laminae in the stack may be varied to accommodate desired specifications for the microfluidic heat exchange system 110 , such as the heating specifications. the heating specifications may be dependent on flow rate of fluid, heater power input, initial temperature of incoming fluid, etc. in an embodiment, the stack 805 is less than about 100 mm long, less than about 50 mm wide at its widest dimension, and less than about 50 mm deep, with a volume of less than about 250 cubic centimeters, although the dimensions may vary. in another embodiment, the stack 805 is about 82 mm long, about 32 mm wide at its widest dimension, and about 26 mm deep, with a volume of about 69-70 cubic centimeters, and a weight of about five pounds when dry, although the dimensions may vary. the lamina 305 and 310 may be any material capable of being patterned with features useful for a particular application, such as microchannels. the thickness of the lamina may vary. for example, the lamina may have a thickness in the range of about 200 μm to about 100 μm. in another embodiment, the lamina may have a thickness in the range of about 500 μm to about 100 μm. some suitable lamina materials include, without limitation, polymers and metals. the lamina may be manufactured of any diffusion bondable metal, including stainless steel, copper, titanium alloy, as well as diffusion bondable plastics. because of the operating pressures and temperatures involved, the need to avoid leaching of the lamina material into the heated fluid, such as water, and the desirability of multiple uses of this device before disposal, it has been found that manufacturing the heat exchange system from stainless steel, such as 316l stainless steel, has proven adequate, although other materials may be used as long as they withstand the operating conditions without degradation. the laminae are stacked in a manner that achieves proper alignment of the lamina. for example, when properly stacked, the inlet openings 320 of all the lamina align to collectively form an inlet passage for fluid to flow into the system and the outlet openings 325 align to collectively form an outlet passage, as shown in fig. 8 . the properly-aligned stack of lamina may also include one or more seats for coupling the heaters 220 in the stack. one or more features can be used to assist in proper alignment of the lamina in the stack, such as alignment posts and/or visual indicators of proper alignment. the stack may include a top cover positioned on the top-most lamina and a bottom cover positioned on the bottom-most lamina. the stack may also include an external insulation wrap to prevent heat loss to the outside environment. fig. 9 shows a perspective view of an example of an assembled microfluidic heat exchange system 110 . the stack 805 of inlet/outlet laminae includes chemically etched upper and lower covers that seal the stack 805 against the atmosphere. these covers typically are thicker than the laminae, and may be about 1 mm or more in thickness in an embodiment to withstand damage and the operating pressures necessary to maintain the fluid in a single state. the cartridge heaters 220 are mounted in cavities that extend through the entire stack 805 . a plate 910 is secured (such as via bolts) to the stack and provides a means of securing an inlet port 915 and an outlet port 920 to the stack 805 . the inlet port 915 and outlet port 920 can be piping having internal lumens that communicate with the inlet openings 320 and outlet openings 325 . before assembly of the stack, each hole of each lamina that is to accept a cartridge heater is designed slightly smaller than the diameter of the cartridge heater itself. after assembly of the entire stack, the hole is enlarged for a clearance fit between the hole inner diameter and the cartridge heater outer diameter, taking into account thermal expansion of the heater during operation, to provide a uniform surface for optimum heat transfer from the heater to the pasteurizer. this method avoids any potential issues with misalignment of the shims if the holes in each shim were to be properly sized to the cartridge heater prior to assembly. a second plate 925 is also secured to the stack 805 . the plate 925 is used to couple one or more elongated and sheathed thermocouples 930 to the stack 805 . the thermocouples 930 extend through the stack 805 and communicate with the laminae in the stack 805 in the region of the dwell chamber for monitoring fluid temperature in the dwell chamber. the thermocouples that are to be inserted into solid sections of the stack utilize a slip fit for installation. the thermocouples that enter into the fluid flow paths require a seal to prevent fluid leakage. in these cases, the holes for accepting the thermocouples are generated after the stack is assembled by electrical discharge machining (edm), because this technique generates very small debris that can easily be flushed out of the system, as compared with traditional drilling, which could result in larger debris blocking some of the flow paths. any of a variety of sealing members, such as o-rings or gaskets, may be coupled to the stack to provide a sealed relationship with components attached to the stack, such as the plates 910 and 925 , thermocouples 930 , and inlet port 915 and outlet port 920 . it should be appreciated that the assembled microfluidic heat exchange system 110 shown in fig. 9 is an example and that other configurations are possible. in an exemplary manufacture process, a stack of lamina is positioned in a fixture or casing and is then placed into a bonding machine, such as a high temperature vacuum-press oven or an inert gas furnace. the machine creates a high temperature, high pressure environment that causes the lamina to physically bond to one another. in an embodiment, the weight of the overall stack can be reduced by removing some of the excess material from the sides of the stack, thereby eliminating the rectangular footprint in favor of a more material-efficient polygonal footprint. fig. 11 shows a schematic, plan view of another exemplary embodiment of the microfluidic heat exchange system 110 . fig. 11 is schematic and it should be appreciated that variations in the actual configuration of the flow pathway, such as size and shape of the flow pathway, are possible. the embodiment of fig. 11 includes a first flow pathway 1105 and a second flow pathway 1110 separated by a transfer layer 1115 . fluid enters the first flow pathway at an inlet 1120 and exits at an outlet 1125 . fluid enters the second flow pathway at an inlet 1130 and exits at an outlet 1135 . the first and second flow pathways are arranged in a counterflow configuration such that fluid flows through the first flow pathway 1105 in a first direction and fluid flows through the second flow pathway 1110 in a direction opposite the first direction. in this regard, the inlet 1120 of the first flow pathway 1105 is located on the same side of the device as the outlet 1135 of the second flow pathway 1110 . likewise, the outlet 1125 of the first flow pathway 1105 is located on the same side of the device as the inlet 1130 of the second flow pathway 1110 . the flow pathways may be least partially formed of one or more microchannels, although utilizing microfluidic flow fields as disclosed in u.s. provisional patent application no. 61/220,117, filed on jun. 24, 2009, and its corresponding utility application u.s. patent application ser. no. 12/795,371 entitled “microfluidic devices”, filed jun. 7, 2010, and naming richard b. peterson, james r. curtis, hailei wang, robbie ingram-gobel, luke w. fisher and anna e. garrison, incorporated herein by reference, for portions of the fluid flow pathway is also within the scope of the invention. with reference still to fig. 11 , fluid enters the first flow pathway 1120 at the inlet 1120 and passes through a heater region 1140 . a heater is positioned in thermal communication with the heater region 1140 so as to input heat into the fluid passing through the heater region 1140 . prior to passing through the heater region 1140 , the fluid passes through a heat exchange region 1145 that is in thermal communication (via the transfer layer 1115 ) with fluid flowing through the second flow pathway 1110 . in an embodiment, the fluid flowing through the second flow pathway 1110 is fluid that previously exited the first flow pathway 1105 (via the outlet 1125 ) and was routed into the inlet 1125 of the second flow pathway 1110 . as the previously-heated fluid flows through the second flow pathway 1110 , thermal energy from the previously-heated fluid in the second flow pathway 110 transfers to the fluid flowing through the first flow pathway 1120 . in this manner, the fluid in the second flow pathway 1110 pre-heats the fluid in the heat exchange region 1145 of the first flow pathway prior to the fluid reaching the heater region 1140 . in the heater region 1140 , the heater provides sufficient thermal energy to heat the fluid to a desired temperature, which may be the pasteurization temperature of the fluid. from the heater region 1140 , the fluid flows into a residence chamber 1150 where the fluid remains heated at or above the desired temperature for the residence time. the fluid desirably remains flowing, rather than stagnant, while in the residence chamber 1150 . from the residence chamber 1150 , the fluid exits the first flow pathway 1105 through the outlet 1125 and is routed into the inlet 1130 of the second flow pathway 1110 . the fluid then flows through the second flow pathway 1110 toward the outlet 1135 . as mentioned, the second flow pathway 1110 is in thermal communication with the first flow pathway 1105 at least at the heat exchange region 1145 . in this manner, the previously-heated fluid flowing through the second flow pathway 1110 thermally communicates with the fluid flowing through the first flow pathway 1105 . as the previously-heated fluid flows through the second flow pathway 1110 , thermal energy from the heated fluid transfers to the fluid flowing through the adjacent heat exchange region 1145 of the first flow pathway 1105 . the exchange of thermal energy results in cooling of the fluid from its residence chamber temperature as it flows through the second flow pathway 1110 . in an embodiment, the fluid in the second flow pathway 1110 is cooled to a temperature that is no lower than the lowest possible temperature that precludes bacterial infestation of the fluid. in another embodiment of the device of fig. 11 , the fluid flowing into the second flow pathway 1110 is not fluid re-routed from the first flow pathway 1105 but is rather a separate fluid flow from the same source as, or from a different source than, the source for the first fluid flow pathway 1105 . the fluid in the second flow pathway 1110 may or may not be the same type of fluid in the first flow pathway 1105 . for example, water may flow through both pathways; or water may flow through one flow pathway and a non-water fluid may flow through the other flow pathway. in this embodiment where a separate fluid flows through the second pathway relative to the first pathway, the separate fluid has desirably been pre-heated in order to be able to transfer heat to the fluid in the first flow pathway 1105 at the heat exchange region 1145 . as in the previous embodiments, the embodiment of fig. 11 may be made up of multiple laminar units stacked atop one another to form layers of laminae. in addition, the embodiment of fig. 11 may have the same or similar specifications as the other embodiments described herein, including materials, dimensions, residence times, and temperature levels. in another embodiment shown in fig. 12 , a microfluidic heat exchange system 110 purifies a single fluid. fig. 12 represents an exemplary flow pathway configuration for a single lamina. a plurality of such laminae may be interleaved to form a stack of lamina as described above for other embodiments. the purification of the fluid may comprise pasteurizing the fluid although pasteurization is not necessary such as where the device is not used for dialysis. the heat exchange system receives a stream of incoming fluid 1205 , which splits before entering the heat exchange system. a first portion of the stream of incoming fluid 1205 a enters at a first inlet 1210 a on one end of the system and a second portion of the stream of incoming fluid 1205 enters at a second inlet 1205 b on the other, opposite end of the system. the two streams of incoming fluid 1205 are distributed across the stacked laminae in alternating fashion such that there is no direct contact between the two fluid streams. each stream of incoming fluid 1205 enters a flow pathway 1207 and flows along the flow pathway toward an outlet 1215 . one stream of fluid enters via the inlet 1205 a and exits at an outlet 1215 a positioned on the same end of the system as the inlet 1210 b , while the other stream of fluid enters via the inlet 1205 b and exits at an outlet 1215 b on the same end of the system as the inlet 1210 a . each flow pathway 1207 includes a first heat exchange region 1220 where heat is exchanged through a transfer layer between the incoming fluid and the previously-heated outgoing fluid flowing through a lamina immediately above (or below) the instant lamina in the stack. as the fluid flows through the heat exchange region 1220 it receives heat via the heat transfer and is pre-heated prior to entering a heater region 1225 . for each flow pathway 1207 , the fluid then flows into the heater region 1225 , which thermally communicates with at least one heater, and preferably multiple heaters, for communicating heat into the flowing fluid. the fluid is heated under pressure to a temperature at or above the desired threshold pasteurization temperature as described above for other embodiments. the heater region 1225 also serves as a residence chamber. the fluid flows through the residence chamber while held at or above the desired temperature for the desired residence time. the desired residence time may be achieved, for example, by varying the flow rate and/or by employing a serpentine flow path of the required length within the heater region 1225 . after leaving the heater region 1225 , the outgoing fluid enters a second heat exchange region 1230 where the outgoing fluid exchanges heat with the incoming fluid flowing through a lamina immediately above (or below) the instant lamina in the stack. the outgoing fluid then exits the flow pathways through the outlets 1210 a and 1210 b . the two streams of outgoing fluid then recombine into a single stream of outgoing fluid 1235 before continuing on to the ultrafilter to remove all or substantially all of the dead bacteria killed by the pasteurization process. fig. 13a shows another embodiment of an inlet lamina that forms a spiral inlet pathway where fluid flows in an inward direction through the heat exchange system. fig. 13b shows a corresponding outlet lamina that forms a similar spiral pathway where fluid flows in an outward direction. a plurality of such inlet and outlet laminae may be interleaved to form a stack of laminae as described above for other embodiments. the laminae are shown having a circular outer contour although the outer shape may vary as with the other embodiments. with reference to fig. 13a , the inlet lamina has a header forming an inlet 1305 where incoming fluid enters the inlet pathway. the inlet pathway spirals inward toward a center of the pathway, where a heating chamber 1310 is located. the heating chamber 1310 also serves as a residence chamber for the fluid, as described below. one or more heaters are positioned in thermal communication with the heating chamber 1310 to provide heat to fluid flowing in the heating chamber 1310 . the heating chamber 1310 extends across multiple laminae in the stack and includes a conduit that communicates with the outlet lamina shown in fig. 13b . the fluid enters the outlet lamina from the heating chamber 1310 . the outlet lamina has an outflow pathway that spirals outward from the heating chamber 1310 toward an outlet 1320 . in use, the fluid enters the inlet pathway of the inlet lamina through the inlet 1305 shown in fig. 13b . the fluid then flows along the spiral inlet pathway toward the heater chamber 1310 . as in the previous embodiments, the incoming fluid is at a temperature that is less than the previously-heated fluid flowing through the outlet lamina, which is positioned immediately above or below the inlet lamina. as the fluid flows through the inlet pathway, the fluid receives heat from the previously-heated fluid flowing through the outlet pathway of the outlet lamina. this serves to pre-heat the fluid prior to the fluid flowing into the heating chamber 1310 . the fluid then flows into the heating chamber 1310 where the fluid receives heat from the one or more heaters. while in the heating chamber 1310 , the fluid is heated under pressure to a temperature at or above the desired threshold pasteurization temperature as described above for other embodiments. as mentioned, the heating chamber 1310 also serves as a residence chamber. the fluid flows through the residence chamber while held at or above the desired temperature for the desired residence time. as in other embodiments, the desired residence time may be achieved, for example, by varying the flow rate and/or by employing a serpentine flow path of the required length within the heater chamber 1310 . after leaving the heater chamber, the outgoing fluid enters the outlet pathway of an outlet lamina such as shown in fig. 13b . the outgoing fluid flows outward from the heating chamber 1310 along the spiral flow pathway toward the outlet 1320 . the spiral pathway of the inlet lamina thermally communicates with the spiral pathway of the outlet lamina across a transfer layer as the outgoing fluid flows along the spiral pathway, it exchanges heat with the incoming fluid flowing through an inlet lamina immediately above (or below) the instant lamina in the stack. the outgoing fluid then exits the stack of lamina via the outlet 1320 before continuing on to the ultrafilter to remove all or substantially all of the dead bacteria killed by the pasteurization process. control system the microfluidic heat exchange system 110 may include or may be coupled to a control system adapted to regulate and/or control one or more aspects of the fluid flow through the system, such as fluid flow rate, temperature and/or pressure of the fluid, chemical concentration of the fluid, etc. fig. 10 shows a schematic view of an exemplary heater control system 805 communicatively coupled to the microfluidic heat exchange system 110 . the heater control system 1005 includes at least one power supply 1015 communicatively coupled to a heater control unit 1020 , which communicates with a control logic unit 1025 . the heater control unit 1020 is adapted to control the power supply to the heaters, either on an individual basis or collectively to a group of heaters. this permits temporal and spatial control of heat supplied to the microfluidic heat exchange system 110 . the heater control system 1005 may include one or more temperature sensors 1010 positioned in or around the microfluidic heat exchange system 110 for sensing fluid temperature at one or more locations within the fluid flow path. the type of sensor can vary. in an embodiment, one or more thermocouples are used as the sensors 1010 . the sensors 1010 communicate with the heater control unit 1020 and the control logic unit 1025 to provide a temperature feedback loop. the heater control system 1005 provides for feedback control of fluid temperature in the system to ensure, for example, that fluid is being heated to the required pasteurization temperature and/or that the fluid is not overheated or underheated. for example, the heater control unit 1020 in conjunction with the control logic unit 1025 may adjust power to one or more of the heaters based on a sensed temperature in order to achieve a desired temperature profile in one or more locations of the fluid flow path. the heater control system 1005 may include other types of sensors such as, for example, pressure sensors, flow rate sensors, etc. to monitor and adjust other parameters of the fluid as desired. the heater control system 1005 may also be configured to provide one or more alarms, such as a visual and/or audio indication and/or a telecommunications signal, to the user or a remote monitor of system functions to inform such parties when the temperature is at an undesired level. for example, the control unit 1020 may comprise one or more temperature set limits within which to maintain, for example, the residence chamber temperature. if a limit is exceeded—i.e., if the temperature falls below the lower operating limit or above the upper operating limit, the control system may bypass the heater, set off an alarm and cease operation of the overall water purification system until the problem can be diagnosed and fixed by the operator. in this regard, the control system 1005 may include a reporting unit 1030 that includes a database. the reporting unit 1005 is configured to log and store data from the sensors and to communicate such data to a user or monitor of the system at a remote site. exemplary fluid purification procedure with reference again to fig. 1 , an exemplary configuration for purifying fluid using the fluid purification system is now described including a description of a fluid flow path through the system. it should be appreciated that the description is for example and that variations to the flow path as well as to the arrangement of the subsystems and hardware are possible. the fluid purification system is described in an exemplary context of being a component of a dialysis system. in this example, the fluid purification system is used to purify water that is used by the dialysis system. the fluid purification system is not limited to use for purifying water in dialysis systems. as shown in fig. 1 , water enters the system via an entry location 105 , flows along a flow pathway, and exits the system via an exit location 107 . the flow pathway may be formed by any type of fluid conduit, such as piping. the piping may include one or more sample ports that provide access to water flowing through the piping. one or more subsystems, including the microfluidic heat exchange system 110 , are positioned along the pathway for processing the water prior to the water exiting the system. as mentioned, the subsystems may include, for example, a sediment filter system 115 , a carbon filter system 120 , a reverse osmosis system 125 , an ultrafilter system 130 , an auxiliary heater system 135 , a degassifier system 140 , or any combination thereof. the fluid purification system may also include hardware and/or software to achieve and control fluid flow through the fluid purification system. the hardware may include one or more pumps 150 and a throttling valve or other devices for driving fluid through the system, as well as sensors for sensing characteristics of the fluid and fluid flow, such as flow sensors, conductivity sensors, pressure sensors, etc. the hardware may communicate with a control system that controls operation of the hardware. upon entering the system, the water flows through at least one sediment filter system 115 , which includes one or more sediment filters that filter sediment from the water flowing therethrough. the water then flows through a carbon filter system 120 , which includes one or more carbon filters that filter organic chemicals, chlorine and chloramines in particular from the water. one or more pumps may be positioned at various locations along the water flow pathway such as between the filter subsystems. in addition, a conductivity sensor may be coupled to the pathway downstream of the carbon filter system 120 and downstream of the reverse osmosis system to determine the percentage of dissolves solids removed. the water flows from the carbon filter system 120 to a reverse osmosis system 125 configured to remove particles from the water pursuant a reverse osmosis procedure. the sediment filter 115 removes particulate matter down to 5 microns or even 1 micron. the carbon filter 120 removes chlorine compounds. the reverse osmosis system 125 usually removes greater than 95% of the total dissolved solids from the water. the sediment filter system 115 , carbon filter system 120 , and reverse osmosis system 125 collectively form a pre-processing stage that removes a majority of dissolved solids, bacteria contamination, and chemical contamination, if any, from the water. the water is therefore in a somewhat macro-purified state prior to reaching the heat exchange system 110 . thus, the preprocessing stage supplies relatively clean water to the downstream pumps and also to the heat exchange system 110 . this reduces or eliminates the potential for scale build-up and corrosion during heating of the water by the heat exchange system 110 . after the water passes the pre-processing stage, a pump 150 may be used to increase the water pressure to a level higher than the saturation pressure encountered in the heat exchange system 110 . this would prevent phase change of the water inside the heat exchange system 110 . thus, if the highest temperature reached in the heat exchange system 110 is 150 degrees celsius where the water would have a saturation pressure of 475 kpa (approximately 4.7 atmospheres or 69 psia), the pressure of the water coming out of the pump would exceed the saturation pressure. the pump desirably increases the water pressure to a level that is at or exceeds the saturation pressure to ensure no localized boiling. this can be important where the heat exchange system is used to pasteurize water and the water is exposed to high temperatures that may be greater than 138 degrees celsius, i.e., well above the boiling point of water at atmospheric pressure. the water, which is now pressurized above, or significantly above, the saturation pressure, enters the heat exchange system 110 , which pasteurizes the water as described in detail above. the heat exchange system 110 may be encased in insulation to reduce the likelihood of heat loss of the water passing therethrough. after leaving the heat exchange system 110 , the water passes into a throttling valve 160 , which maintains the pressure though the water path from the pump 150 to outlet of the heat exchange system 110 . the throttling valve 160 and the pump 150 may be controlled and adjusted to achieve a flow rate and a desired pressure configuration. the pump 150 and the throttling valve 160 may communicate with one another in a closed loop system to ensure the required pressure is maintained for the desired flow rate and temperature. a degassifier system 140 may also be incorporated into the flow path for removing entrained gas from the water. after the water leaves the throttling valve 160 , it passes to an ultrafilter system 130 that removes macromolecules and all or substantially all of the dead bacteria killed by the pasteurization process from the water to ensure no endotoxins remain in the water before mixing the dialysate. where the water is used in a dialysis system, the presence of macromolecules may be detrimental to the dialysis process. the water then passes through a heater system that may heat the water to a desired temperature, such as to normal body temperature (98.6 degrees fahrenheit). where the water is used for dialysis, the water is then passed to a mixer 170 that mixes the clean water with a supply of concentrate solutions in order to make dialysate. startup and shutdown of fluid purification system where the fluid purification system is used for dialysis, it is important to avoid bacterial contamination of the fluid flow path, both within the heat exchanger system 110 and throughout the components downstream of the heat exchanger system 110 . in this regard, the heat exchanger system 110 , which serves as a pasteurizer, is desirably operated in a manner that ensures clean fluid flow upon startup of the fluid purification system and also avoids bacterial contamination of the downstream components, or at least mitigates the contamination effects, upon shut down (i.e., when the heaters 220 are de-powered). in an embodiment, clean fluid flow upon startup is achieved by initially flowing a sterilizing liquid through the heat exchanger system 110 while the heaters 220 are being powered up. the sterilizing liquid then flows through all the components downstream of the heat exchanger system 110 until the heat exchanger system 110 attains a desired operating temperature. upon the heat exchanger system 110 reaching the desired operating temperature, fluid flow to the heat exchanger system 110 switches to water from the reverse osmosis system 125 . the water passes through the heat exchanger system 110 (which has achieved the desired operating temperature) to flush the sterilizing liquid out of the flow pathway of the heat exchanger system 110 . various sterilizing solutions may be used. the solution, for example, can be a 1% chlorine in water mixture, or some other widely recognized water additive that can kill bacteria. the fluid purification system may be shut down as follows. the heaters 220 are de-powered while fluid flow through the heat exchanger system 110 is maintained. alternatively, a sterilizing liquid may be flowed through the heat exchanger system 110 until the heat exchanger system 110 attains near room temperature conditions. in this manner, the flow pathway is maintained in a sterilized condition as the heat exchanger system 110 shuts down. the flow pathway of the heat exchanger system 110 is then closed or “locked down” with sterilizing liquid present in the flow pathway of the heat exchanger system 110 . the presence of the sterilizing liquid greatly reduces the likelihood of bacterial contamination during shutdown. in another embodiment, one or more valves are positioned in the flow pathway of fluid purification system wherein the valves allow a circulating flow of solution to loop through the pump 150 , heat exchanger system 110 , and downstream components in a recirculation loop until desired pasteurization conditions are achieved during startup. the valves are then set to allow the sterilizing liquid to be flushed from the system. an auxiliary component, such as a microchannel fluid heater (without heat exchange capability), can also be incorporated to provide the ability to circulated a warmed (e.g., less than 100 degrees celsius) sterilizing liquid through the downstream components and/or through the unpowered heat exchanger system 110 . the sterilizing liquid can be used during either a start-up or shut-down process for keeping the flow pathway and components clean over the span of weeks and/or months. the use of a recirculation loop for sterilizing liquid at start up is another manner to prevent bacteria from entering the fluid purification system before the heat exchanger system 110 achieves operating temperatures. a timing control logic may be used with a temperature sensing capability to implement a process that ensures quality control over the start-up and shut down processes. the control logic may be configured to initiate flow only after the heat exchanger system 110 or a heater attains a preset temperature. the flow path may include one or more bypass circulation routes that permit circulation of cleaning and/or sterilization fluid through the flow path. the circulation route may be an open flow loop wherein fluid flowing through the circulation route is dischargeable from the system after use. in another embodiment, the circulation route may be a closed flow loop wherein fluid flowing the circulation route not dischargeable from the system. alternately, the system may include both open and closed circulation routes. the present specification is related to subject matter disclosed in u.s. pat. no. 8,753,515 entitled “dialysis system with ultrafiltration control,” filed on jun. 7, 2010, naming james r. curtis, ladislaus f. nonn, and julie wrazel, and u.s. pat. no. 8,801,922, entitled “dialysis system,” filed on jun. 7, 2010, naming julie wrazel, james r. curtis, ladislaus f. nonn, richard b. peterson, hailei wang, robbie ingram-goble, luke w. fisher, anna b. garrision, m. kevin drost, goran jovanovic, richard todd miller, bruce johnson, alana warner-tuhy and eric k. anderson, which are incorporated herein by reference in their entirety. while this specification contains many specifics, these should not be construed as limitations on the scope of an invention that is claimed or of what may be claimed, but rather as descriptions of features specific to particular embodiments. certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination. moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub-combination or a variation of a sub-combination. similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. although embodiments of various methods and devices are described herein in detail with reference to certain versions, it should be appreciated that other versions, embodiments, methods of use, and combinations thereof are also possible. therefore the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
053-546-433-078-477	US	[ "US", "EP", "CN", "WO" ]	G08G1/01,B60W30/18,G08G1/017,G08G1/0962	2018-08-17T00:00:00	2018	[ "G08", "B60" ]	reducing vehicular congestion at an intersection	to control vehicular congestion at intersections, a method includes detecting a group of two or more vehicles stopped at an intersection regulated by a traffic light, where for each of the vehicles in the group, movement through the intersection in response to a change in a state of the traffic light is affected by movement of at least one other vehicle in the group. the method further includes determining a time when the state of the traffic light changes to allow the group of vehicles to start moving through the intersection, determining acceleration parameters for a certain vehicle in the group in view of potential and/or actual movement of the other vehicles in the group through the intersection, and providing guidance to a device operated by a driver of the certain vehicle regarding the determined acceleration parameters, in accordance with the determined time.	1 . a method for controlling vehicular congestion at intersections, the method comprising: detecting, by one or more processors, a group of two or more vehicles stopped at an intersection regulated by a traffic light, including determining that a head vehicle in the group is within a first distance from the intersection, and that each subsequent vehicle in the group is within a second distance from the head vehicle, wherein for each of the vehicles in the group, movement through the intersection in response to a change in a state of the traffic light is affected by movement of at least one other vehicle in the group; determining, by the one or more processors, a time when the state of the traffic light changes to allow the group of vehicles to start moving through the intersection; determining, by the one or more processors, one or more acceleration parameters for a certain vehicle in the group in view of potential and/or actual movement of the other vehicles in the group through the intersection; providing, by the one or more processors, guidance to a device operated by a driver of the certain vehicle regarding the determined one or more acceleration parameters, in accordance with the determined time. 2 . the method of claim 1 , wherein detecting the group of vehicles includes determining that all of the vehicles in the group are in a same lane. 3 . the method of claim 1 , wherein detecting the group of vehicles further includes determining that a distance between each two adjacent vehicles in the group is within a predefined threshold. 4 . the method of claim 1 , wherein detecting the group of vehicles includes using at least one of (i) a sensor of at least one of the vehicles in the group, (ii) a stationary camera configured to capture images of the intersection, a (iii) a camera operating in an unmanned aerial vehicle (uav), or (iv) satellite imagery. 5 . the method of claim 1 , wherein determining the time when the state of the traffic light changes includes receiving a traffic light data from a network server that operates the traffic light, the traffic light data indicative of a current state of the traffic light and a time when the traffic light is scheduled to transition a different state. 6 . the method of claim 1 , wherein determining the time when the state of the traffic light changes includes using imagery captured in a camera operating in one of the vehicles in the group. 7 . the method of claim 1 , wherein determining the acceleration parameters includes determining a time when the vehicle is to start accelerating and a rate at which the vehicle is to accelerate. 8 . the method of claim 1 , further comprising: monitoring a movement of the group of vehicles through the intersection, adjusting the acceleration parameters in view of the movement of the group of vehicles, and providing updated guidance to the device operated by the driver, the updated guidance related to the adjusted acceleration parameters. 9 . the method of claim 1 , further comprising: determining a respective make and model of each vehicle in the group, and determining the acceleration parameters for the certain vehicle in the group in view of the makes and models of the other vehicles in the group. 10 . the method of claim 1 , further comprising: determining that at least some of the vehicles in the group are turning at the intersection, and determining the acceleration parameters for the certain vehicle in the group to prevent the vehicle from exceeding a threshold speed for turning. 11 . the method of claim 1 , further comprising: determining that at least some of the vehicles in the group are making a u-turn at the intersection, and determining the acceleration parameters for the certain vehicle in the group to prevent the vehicle from exceeding a threshold speed for a u-turn maneuver. 12 . the method of claim 1 , wherein providing the guidance to the device operated by the driver includes generating a vocalized instruction to be played back via a speaker of the device or a head unit of the vehicle. 13 . the method of claim 1 , wherein providing the guidance to the device operated by the driver includes providing a navigation instruction in advance of the traffic light changing to green. 14 . the method of claim 1 , wherein providing the guidance to the device operated by the driver includes providing a navigation instruction in response to the traffic light changing to green. 15 . a portable computing device comprising: one or more processors; a short-range communication interface to communicatively couple the portable computing device to a vehicle; a long-range communication interface to communicatively couple the portable computing device to a vehicle; and a non-transitory computer-readable medium storing thereon instructions that, when executed by the one or more processors, cause the portable computing device to: detect a group of two or more vehicles stopped at an intersection regulated by a traffic light, including determine that a head vehicle in the group is within a first distance from the intersection, and that each subsequent vehicle in the group is within a second distance from the head vehicle, wherein for each of the vehicles in the group, wherein for each of the vehicles in the group, movement through the intersection in response to a change in a state of the traffic light is affected by movement of at least one other vehicle in the group, determine a time when the state of the traffic light changes to allow the group of vehicles to start moving through the intersection, determine one or more acceleration parameters for a certain vehicle in the group in view of potential and/or actual movement of the other vehicles in the group through the intersection, provide guidance to the portable device operated by a driver of the certain vehicle regarding the determined one or more acceleration parameters, in accordance with the determined time. 16 . a network server comprising: one or more computing devices; and a non-transitory computer-readable medium storing thereon instructions that, when executed by the one or more computing devices, cause the network server to: detect a group of two or more vehicles stopped at an intersection regulated by a traffic light, wherein for each of the vehicles in the group, movement through the intersection in response to a change in a state of the traffic light is affected by movement of at least one other vehicle in the group, determine a time when the state of the traffic light changes to allow the group of vehicles to start moving through the intersection, determine one or more acceleration parameters for a certain vehicle in the group in view of potential and/or actual movement of the other vehicles in the group through the intersection. 17 . the portable computing device of claim 16 , wherein to detect the group of vehicles, the instructions further cause the portable computing device to determine that all of the vehicles in the group are in a same lane. 18 . the portable computing device of claim 16 , wherein to detect the group of vehicles, the instructions further cause the portable computing device to determine that a distance between each two adjacent vehicles in the group is within a predefined threshold. 19 . the portable computing device of claim 16 , wherein the instructions cause the portable computing device to: monitor a movement of the group of vehicles through the intersection; modify the group in response to vehicles entering or leaving a lane, and adjust the acceleration parameters in view of the modified group. 20 . the portable computing device of claim 16 , wherein the instructions cause the portable computing device to: determine a respective make and model of each vehicle in the group, and determine the acceleration parameters for the certain vehicle in the group in view of the makes and models of the other vehicles in the group.	field of the disclosure the present disclosure relates to navigation applications and, in particular, to providing guidance to vehicles or devices operating in vehicles stopped at an intersection. background today, digital maps of geographic areas and step-by-step directions for navigating through geographic areas by driving, walking, bicycling, or riding on public transport can be provided on numerous electronic devices such as personal computers, tablets, mobile phones, navigators provided as special-purpose devices or embedded into head units of vehicles, etc. the digital maps and/or navigation directions can be provided via special-purpose mapping applications or “apps,” for example. typical driving navigation directions advise drivers to make turns on certain streets, drive straight for certain distances, merge onto certain roads, etc. when going through intersections (or “crossroads”) or generally any traffic lights or other road junctions, which are known to be one of the major sources of traffic congestion, drivers typically rely on their experience to decide when and how fast they should accelerate. the information available to drivers generally is limited to what they see in front of them and behind them in the rear-view mirror. as a result, many drivers leave more space than necessary between their vehicles and the vehicles directly in front. moreover, vehicles accelerate at different rates due to the differences in torque. one result of sub-optimal human decisions and the differences in vehicle capability is that fewer vehicles move through a typical intersection per unit of time than possible. for example, a certain traffic light can display green for 90 seconds and allow approximately 300 vehicles to pass through the intersection at a normal speed, but only 200 vehicles may pass through the intersection during a typical green phase. summary one example embodiment of the techniques of this disclosure is a method for controlling vehicular congestion at intersections. the method comprises detecting, by one or more processors, a group of two or more vehicles stopped at an intersection regulated by a traffic light, such that for each of the vehicles in the group, movement through the intersection in response to a change in a state of the traffic light is affected by movement of at least one other vehicle in the group. the method further comprises determining, by the one or more processors, a time when the state of the traffic light changes to allow the group of vehicles to start moving through the intersection, determining, by the one or more processors, acceleration parameters for a certain vehicle in the group in view of potential and/or actual movement of the other vehicles in the group through the intersection, and providing, by the one or more processors, guidance to a device operated by a driver of the certain vehicle regarding the determined acceleration parameters, in accordance with the determined time. another example embodiment of the techniques of this disclosure is a portable computing device comprising one or more processors, a short-range communication interface to communicatively couple the portable computing device to a vehicle, a long-range communication interface to communicatively couple the portable computing device to a vehicle, and a non-transitory computer-readable medium storing instructions. the instructions, when executed by the one or more processors, cause the portable computing device to execute the method above. yet another example embodiment of the techniques of this disclosure is a network server comprising one or more computing devices and a non-transitory computer-readable medium storing instructions. the instructions, when executed by the one or more computing devices, cause the network server to execute the method above. still another example embodiment of the techniques of this disclosure is a computing system comprising one or more processors and a non-transitory computer-readable memory storing instructions. when executed by the one or more processors, the instructions cause the computing system to detect a group of two or more vehicles stopped at an intersection regulated by a traffic light, such that for each of the vehicles in the group, movement through the intersection in response to a change in a state of the traffic light is affected by movement of at least one other vehicle in the group; determine a time when the state of the traffic light changes to allow the group of vehicles to start moving through the intersection; determine acceleration parameters for a certain vehicle in the group in view of potential and/or actual movement of the other vehicles in the group through the intersection; and provide guidance to a device operated by a driver of the certain vehicle regarding the determined acceleration parameters, in accordance with the determined time. brief description of the drawings fig. 1 is a block diagram of an example system in which techniques for reducing congestion can be implemented; fig. 2 is a flow diagram of an example method for identifying a group (or “cluster”) of vehicles at an intersection for coordinated guidance through the intersection, which can be implemented in the system of fig. 1 ; fig. 3 is a diagram of an example scenario in which the system of fig. 1 can identify a cluster of vehicles for coordinated guidance through an intersection; fig. 4 is a diagram of an example scenario in which the system of fig. 1 can identify several clusters of vehicles for coordinated guidance through an intersection; fig. 5 is a diagram of another example scenario in which the system of fig. 1 can identify a cluster of vehicles for coordinated guidance through an intersection; fig. 6 is a flow diagram of an example method for guiding a cluster of vehicles through the intersection, which can be implemented in the system of fig. 1 ; fig. 7 is a diagram of an example scenario in which the system of fig. 1 can guide several clusters of vehicles through an intersection; and fig. 8 illustrates an example timeline for providing guidance to vehicles being guided through an intersection. detailed description overview generally speaking, a congestion control system of this disclosure coordinates acceleration between vehicles at a traffic light so that the vehicles travel through the intersection efficiently and safely. the system thus improves throughput of traffic at an intersection, which in turn allows vehicles to reach their destinations faster and with lower energy consumption and/or vehicle emissions. to synchronize acceleration, the system can determine which vehicles can define a group (or cluster) and provide guidance to smartphones or other suitable computing devices operating in these vehicles, or directly to the vehicles in some cases. when multiple autonomous, or “self-driving,” vehicles are stopped at an intersection, control units implemented in these autonomous vehicles can exchange messages using a suitable wireless communication standard to form an ad hoc cluster of autonomous vehicles. the control units then can synchronize movement through the intersection to accelerate at a particular time at the maximum safe rate so as to maintain the shortest safe distance between adjacent vehicles in the cluster. a congestion control system thus can control the movement of each autonomous vehicle in view of the movement of the other autonomous vehicles in the cluster. movement of semi-autonomous vehicles, which implement such technologies as adaptive cruise control for example, can be controlled in a similar manner. a typical semi-autonomous vehicle can automatically adjust its speed to maintain a certain safe separation from the vehicle directly ahead. in this case, a congestion control system can be implemented in the control units of the semi-autonomous vehicles in the cluster or in a network device operating outside the cluster to control acceleration and deceleration of the semi-autonomous vehicles through an intersection. once the semi-autonomous vehicles reach a certain speed or detect any change in the surroundings (e.g., the vehicle in front turns on its right turn signal or “blinker”), the congestion control system can notify the corresponding drivers that they should take back control of the vehicles. however, even as various types of autonomous and semi-autonomous vehicles are being tested and deployed today, many drivers continue to control their vehicles manually. a congestion control system in this case can generate navigation directions related to the timing and rate of acceleration at an intersection, and provide these navigation directions to devices operating in the vehicles. the congestion control system in these cases does not rely on the ability of a vehicle to automatically adjust its speed. in one example implementation, the congestion control system of this disclosure detects when multiple vehicles approach an intersection or already have reached the intersection, from a certain direction. the detection can be based on sensors operating in the vehicles (cameras, radars, lidars, etc.), sensors operating as components of an urban infrastructure (e.g., cameras mounted on traffic lights), cameras mounted in low-flying drones, cameras mounted in satellites, etc. the congestion control system then organizes at least two of the vehicles into a cluster. the cluster in some cases is only conceptual, as discussed below, and the vehicles or the portable devices operating in these vehicles are not always informed of being organized into a cluster. for example, the congestion control system can organize vehicles in a left-only lane into one cluster, vehicles in the right lane headed straight c into another cluster, etc. the congestion control system in some cases can infer the “intent” of a vehicle from navigation directions provided to a portable device operating in this vehicle via a corresponding software application, or from the turn signal currently activated in the vehicle. once the congestion control system identifies a cluster of vehicles, the congestion control system determines, for a certain vehicle in the cluster, suitable acceleration parameters in view of the potential or actual movement of the other vehicles in the cluster. the congestion control system in some cases can use additional signals to determine these parameters, e.g., types of the vehicles in the cluster, the current weather conditions, the current lighting conditions. the congestion control system then provides this information to the vehicle in any suitable format or to a portable device operating in the vehicle in the form of text or audio instructions. the acceleration parameters can specify the time of acceleration and, in some implementations, also the rate of acceleration. the congestion control system can determine these acceleration parameters so as to cause the vehicles in the cluster to reach a certain speed more quickly and/or in a more environment-friendly manner, all the while maintaining a safe distance between the vehicles. in one example scenario, a user of a navigation service receives step-by-step driving directions, including real-time updates, via a software application running on a smartphone while the user is driving. when the user's vehicle is stopped at an intersection, the user may see only the car in front and, in the rear-view mirror, only one car behind. on the other hand, the congestion control system determines which vehicles will affect the timing and the rate of acceleration of the user's vehicle when the traffic light changes. these vehicles can define an ad hoc cluster and can include vehicles separated from the user's vehicle by multiple intervening vehicles. the congestion control system then generates an appropriate instruction and provides the instruction to the user via the application running on the smartphone. for example, the instruction may include a countdown to the time the user should start accelerating as well as a warning regarding the safe rate of acceleration. as another example, the congestion control system can provide an estimate of when the vehicle in front of the user's vehicle will start moving. in another example scenario, more than one user in the ad hoc cluster including the user's vehicle operates the software application associated with the navigation service. the congestion control system in this case coordinates the acceleration of these vehicles. more particularly, the system can first provide acceleration instructions to the smartphone in the vehicle disposed closer to the intersection, and then provide acceleration instructions to the smartphone in the vehicle farther away to the intersection. example computing environment referring to fig. 1 , an example environment 10 in which the techniques outlined above can be implemented includes a vehicle 12 , a computing device 14 operating in the vehicle, and a server 16 that provides mapping and navigation services. the example environment 10 in some cases can include one or more external cameras/sensors 18 that in turn can include one or more cameras, radars, lidars, infrared or thermal imaging devices, etc., or any suitable combination of these devices. the server 16 can communicate with the computing device 14 and the one or more external cameras/sensors 18 via a communication network 20 , which can be a wide area network such as the internet. the vehicle 12 in the scenario of fig. 1 can be a non-autonomous, i.e., a conventional, vehicle or a semi-autonomous vehicle. in addition to an engine, a transmission, brakes, etc. 30 , the vehicle 12 can be equipped with sensors such as one or more proximity sensors 32 and one or more cameras 34 . a control circuitry 36 can be configured to detect whether vehicles are present within a certain distance immediately ahead of the vehicle 12 and/or immediately behind the vehicle 12 , using the proximity sensor(s) 32 and/or the camera(s) 34 . in some implementations, the vehicle circuitry 34 also determines the approximate distance to these vehicles (e.g., 10 feet, 12 feet, 50 feet). the vehicle 12 also can include a head unit 38 equipped with input and output devices such as a touchscreen, a speaker, a microphone, etc. further, the head unit 38 in one example embodiment is equipped with a wireless communication module that supports a bluetooth™—based wireless personal area network (wpan) to communicate with proximate electronic devices such as the computing device 14 for example. the head unit 38 also can be configured to measure the signal strength for bluetooth beacons transmitted from nearby vehicles to determine approximate distances to these vehicles. the computing device 14 can be for example a portable device such as a smartphone, a tablet computer, or a wearable device such as a smartwatch. the computing device 14 alternatively can be a special-purpose car navigator or an electronic device embedded in the head unit of the vehicle 12 . in the example implementation of fig. 1 , the computing device 14 includes one or more processing units 40 which can include a central processing unit (cpu), a graphics processing unit (gpu), etc. the computing device 14 further includes a non-transitory memory 42 that can include random access memory (ram), read-only memory (rom), flash memory, other types of persistent memory, etc. the memory 42 can store instructions that implement an operating system (os) 52 , which can be any suitable mobile or general-purpose operating system, and a navigation application 54 . the computing device 14 also can include a short-range communication interface 44 , a long-range communication interface 46 , a camera 48 , and a user interface 50 . the short-range communication interface 44 can support communications via a wireless personal area network (wpan) such as bluetooth, a wireless local area network (wlan) such as wifi™, a wired connection such as universal serial bus (usb), etc. the computing device 14 is coupled to the vehicle 12 via a short-range communication link supported by the short-range communication interface 44 , in the example of fig. 1 . the long-range communication interface 46 can support, for example, cellular communications according to various 3g, 4g, 5g, etc. communication standards and/or wide area network communications such as wifi. the camera 48 can be any suitable charge-coupled device (ccd) or complementary metal-oxide semiconductor (cmos) camera. in an example scenario, the computing device 14 is mounted on the dashboard of the vehicle 12 so that the camera 48 faces the road ahead of the vehicle 12 , and a software application executing on the computing device 14 detects an approximate distance to the vehicle immediately ahead of the vehicle 12 . in addition to the camera 48 , the computing device 14 in various embodiments can include sensor components or modules such as a global positioning system (gps) module to detect the position of the computing device 14 , a compass to determine the direction of the computing device 14 , a gyroscope to determine the rotation and tilt, an accelerometer, etc. the user interface 50 can include any suitable combination of input devices such as a touchscreen, a keyboard, a microphone, etc. and output devices such as screens, speakers, etc. in operation, the navigation application 54 can receive instructions from the user and provide navigation directions in the form of text, images, videos, vocalized instructions, etc. via the user interface 50 . the navigation application 54 can provide an interactive digital map via the user interface 50 . the navigation application 52 in some cases can operate in a projected mode and direct some or all of the output to an external device such as the head unit 38 . the navigation application 54 can receive map data in a raster (e.g., bitmap) or non-raster (e.g., vector graphics) format from the server 16 . in some cases, the map data can be organized into layers, such as a basic layer depicting roads, streets, natural formations, etc., a traffic layer depicting current traffic conditions, a weather layer depicting current weather conditions, a navigation layer depicting a path to reach a destination, etc. the navigation application 54 can provide navigation directions as a graphic overlay on a digital map, as a sequence of instructions that include text and/or images, as a set of vocalization instructions via speakers, or any suitable combination thereof. with continued reference to fig. 1 , the server 16 can be operated by a provider of mapping and navigation services. the server device 16 can provide map data and navigation data to the computing device 14 and other client devices. the server device 16 can be communicatively coupled to a database 60 that stores geographic data including map data for various geographic areas. the map data can be stored in any suitable format such as vector graphics, rasterized images, text for labels, etc. and organized according to any suitable principle (e.g., square map tiles covering the same amount of area at a certain zoom level). the map data can specify the shapes and various properties of geographic features such as roads, buildings, lakes, rivers, parks, etc. the map data also can include street-level imagery and photographs taken from various vantage points. further, map data for a geographic areas can include information about brick-at-mortar businesses located at the respective locations within the geographic area: hours of operation, description of products and services, user reviews, etc. the geographic data in the database 60 also can store data related to roads and lanes such as indications of which lanes at certain intersections are left-turn-only lanes, right-turn-only lanes, etc. as discussed below, the system can use road and lane data when defining clusters of vehicles at intersections. the server 16 can implement a mapping/navigation module 62 and a congestion controller 64 . each of the modules 62 and 64 can be implemented as a set of instructions stored in a memory that includes non-transitory medium such as a hard disk, a flash drive, etc., and executable by one or more processors of the server 16 . for simplicity, fig. 1 illustrates the server device 16 as only one instance of a server. however, the server device 16 according to some implementations includes a group of one or more server devices, each equipped with one or more processors and capable of operating independently of the other server devices. server devices operating in such a group can process requests from the client computing device 14 individually (e.g., based on availability), in a distributed manner where one operation associated with processing a request is performed on one server device while another operation associated with processing the same request is performed on another server device, or according to any other suitable technique. for the purposes of this discussion, the term “server device” may refer to an individual server device or to a group of two or more server devices. the one or more external cameras/sensors 18 can operate in any suitable structure, vehicle, aircraft, etc. for example, the one or more external cameras/sensors 18 can be installed on traffic lights, light posts, walls of buildings, etc. in other scenarios, the one or more external cameras/sensors 18 can operate in unmanned aerial vehicles (uavs) or satellites. in any case, imagery captured by the one or more external cameras/sensors 18 can be processed to determine locations of vehicles, spacing between vehicles, types of vehicles (e.g., a car, a van, a truck). this imagery in some cases also can be used to determine the state of the traffic light. in some embodiments, the server 16 can receive real-time data related to the state of traffic lights from a dedicated electronic service. for example, a certain municipality may expose an api using which software systems can determine the current state of a selected traffic light, the time remaining in the current state, the expected duration of the next state, etc. using the data stored in the database 60 , the mapping/navigation module 62 can generate routes traversing geographic areas and navigation instructions to guide drivers along the generated routes. the congestion controller 64 can augment these navigation instructions with guidance for efficiently traversing intersections, as discussed in more detail below. in some embodiments, the functionality of the congestion controller 64 can be implemented partially or fully in the navigation application 54 or multiple instances of the navigation application 54 . more particularly, multiple instances of the navigation application 54 operating in different respective devices (which in turn are disposed in different respective vehicles) can exchange information with each other to cooperatively determine the acceleration parameters for the corresponding vehicles. guiding vehicles through intersections now referring to fig. 2 , an example method 100 for identifying a group (or “cluster”) of vehicles at an intersection for coordinated guidance through the intersection can be implemented as a set of instructions executable by one or more processors. these instructions can be included in the congestion controller 64 , the navigation application 54 , or partially in the congestion controller 64 and partially in the navigation application 54 . further, the method 100 in some embodiments is implemented in the head unit 38 . for clarity, the method 100 is discussed below with reference to a congestion control system that can include one or more of: (i) the congestion controller 64 , (ii) one or more instances of the navigation application 54 , and (ii) one or more instances of the control circuitry 36 . at block 102 , the congestion control system detects a vehicle within a certain distance of an intersection. referring to fig. 3 , for example, each of the vehicles v 1 , v 2 , and v 3 is within a distance d max of an intersection 150 controlled by a traffic light 152 . the congestion control system first can determine that the vehicle v 1 is proximate to the intersection 150 . as one specific example, a portable computing device similar to the device 14 of fig. 1 can operate in the vehicle v 1 . an instance of the navigation application 54 running on the portable device can receive, from a navigation service, a description of a route to a certain destination along with step-by-step navigation instructions. the description of the route can include locations of intersections. the positioning module operating in the vehicle v 1 , which can rely on gps or wifi signals for example, can determine at some point that the vehicle v 1 is within the distance d max of the intersection 150 . referring back to fig. 2 , the congestion control system at block 104 can determine that the vehicle has stopped, or is about to stop, at the intersection. to continue with the example above, the portable device operating in the vehicle v 1 can determine that the current speed of the vehicle v 1 is below a certain threshold v t (e.g., 5 mph, 3 mph) using the positioning module of the portable device or based on one or more sensors of the vehicle v 1 . the congestion control system also can determine whether the vehicle is stopped at the intersection due to the state of the traffic light. the congestion control system can refrain from forming a cluster of vehicles at the intersection (or form a different type of cluster) if the vehicle is stopped due to traffic congestion or some other reason. in some embodiments, the congestion control system attempts to form a cluster of vehicles only in response to determining a transition of the traffic light from red to green. for example, the congestion control system can rely on the dashboard camera of the vehicle with a clear view of the traffic light to detect the changes in the state of the traffic light. in other embodiments, the congestion control system attempts to form a cluster of vehicles in advance of the transition of the traffic light from red to green. as indicated above, the congestion control system can obtain an indication of not only the current state of the traffic light but also of when the traffic light will change from red to green. next, at block 106 , it is determined whether another vehicle can be added to the cluster. the congestion control system can determine for example whether there is another vehicle that is traveling in the same direction and is within the certain distance of the intersection. in some cases, the congestion control system can impose the additional requirement that the other vehicle be in the same lane. in other cases, the congestion control system can determine that lanes from multiple vehicles can be clustered due to lane merging, for example, as discussed with reference to fig. 5 . referring again to fig. 3 , the congestion control system can determine that the vehicle v 2 is in the same lane l 2 as the vehicle v 1 , and that the vehicle v 1 is within the distance d max of the intersection 150 . another requirement the congestion control system can impose is a certain maximum separation d t between adjacent vehicles in the cluster. the congestion control system can determine that the vehicles v 1 and v 2 are separated by a gap of length d 1 , and that d 1 is smaller than d t . the congestion control system can approximately measure the gap d 1 between the vehicles v 1 and v 2 using sensors internal to these vehicles or portable devices operating in these vehicles, external to these vehicles or the portable devices, or any suitable combination of both. as discussed above with reference to fig. 1 , the control circuitry 36 embedded in the vehicle can determine approximate distances to other vehicles and/or other objects on the road immediately ahead of the vehicle and immediately behind the vehicle using the proximity sensor(s) 32 and/or the camera(s) 34 . in another embodiment, the congestion control system can determine the spacing between vehicles in a cluster using the external cameras/sensors 18 . in yet another embodiment, the congestion control system can use positioning data, such as gps data for example, obtained by the portable devices disposed in the vehicles. more particularly, the os 52 can automatically determine when the computing device 14 operates in a vehicle, and users can configure their portable devices so that during driving, these devices provide positioning data, in an anonymized manner, to the congestion control system for the specific purpose of determining gaps between vehicles. in another embodiment, the portable devices determine approximate distances to nearby portable devices operating in vehicles based on signal strength measurements for bluetooth or wifi beacons. if it determined at block 106 than another vehicle satisfies the one or more conditions for entry into the cluster, the flow proceeds to block 108 , where the congestion control system adds this vehicle to the cluster. in the example above, the congestion control system can add the vehicle v 2 to the cluster c 1 , so that c 1 becomes {v 1 ,v 2 }. the flow then returns to block 106 . the congestion control system similarly can determine that vehicle v 3 is in the same lane l 2 as the vehicle v 1 , that the vehicle v 3 is within the distance d max of the intersection 150 , and that the vehicles v 2 and v 3 are separated by gap of length d 1 , where d 1 <d t . in response to this determination, the congestion control system can add the vehicle v 3 to the cluster c 1 , so that c 1 becomes {v 1 ,v 2 ,v 3 }. otherwise, if it determined at block 106 that no other vehicle satisfies the one or more conditions for being added to the cluster, the flow proceeds to block 110 , where the formation of the cluster completes. the congestion control system then can begin to control, or at least affect, movement of an individual vehicle in the cluster in view of movement of the other vehicles in the cluster. for example, the congestion control system can control the time and the rate of acceleration for the vehicle v 2 in view of the movement of the vehicle v 1 , and similarly control the time and the rate of acceleration for the vehicle v 3 in view of the movement of the vehicle v 2 . the congestion control system thus can form a cluster of vehicles according to the method 100 with or without the vehicles in the cluster communicating with each other. in some implementations, the vehicles v 1 ,v 2 , and v 3 illustrated in fig. 3 and/or portable devices operating in these vehicles can form an ad hoc communication network when these vehicles are within the distance d max of the intersection 150 , are stopped or stopping, and are headed in the same direction. the vehicles to this end can use a wlan, wpan, or another suitable communication scheme. this ad hoc communication network can serve the specific purpose of controlling acceleration and spacing between the vehicles in the cluster at the intersection 150 , and the communication network can automatically dissolve once the vehicles reach a certain minimum speed and clear the intersection or in response to another event as discussed below. the congestion control system in this case can operate in a distributed manner in the communication network. in other implementations, the congestion control system can identify a cluster and provide guidance to the vehicles without notifying these vehicles of the formation of the cluster. the congestion control system in this embodiment need not rely on any direct communication between the vehicles in the cluster. moreover, the congestion control system in some embodiments can provide guidance to vehicles based solely on data collected from outside the cluster, e.g., from the external cameras/sensors 18 , and need not rely on any data reported by the vehicles or portable devices operating in these vehicles. further, the congestion control system need not require that each vehicle in the cluster have the same capability. for example, the vehicle v 1 can be an autonomous vehicle, the vehicle v 2 can be a conventional vehicle in which the driver currently does not operate a portable device at all, and the vehicle v 3 can be a conventional vehicle in which the driver operates a portable device currently executing an instance of the navigation application 54 . the congestion control system can provide guidance to the portable device in the vehicle v 3 with respect to movement through the intersection in view of what the congestion control system can observe regarding the other vehicles in the cluster, even if the congestion control system cannot provide guidance to the other vehicles and thus cannot coordinate the movement through the intersection between the vehicles in this cluster. fig. 4 illustrates another example formation of clusters at an intersection. vehicles v 4 and v 5 have either come to a complete stop or are moving at a speed below v t in lane l 1 . the congestion control system forms a cluster c 2 ={v 4 ,v 5 } upon determining that every condition for forming such a cluster is satisfied. these conditions can include for example the vehicles being within a certain threshold distance of the intersection 150 , the traffic light 152 being in the red state, the spacing between the vehicles being within a certain threshold value, and the vehicles being headed in the same direction. thus, although vehicle v 6 is also in the lane l 1 and is headed in the same direction, the spacing between the vehicles v 5 and v 6 is too large, and the congestion control system does not include the vehicle v 6 in the cluster c 2 . the congestion control system also can determine that the vehicles in the cluster c 2 will turn left. the congestion control system can make this determination based on the turn signals activated in the vehicles v 4 and v 5 or based on the navigation directions provided to the portable devices operating in these vehicles, for example. the congestion control system can determine acceleration parameters in view of whether a cluster of vehicles will move forward through the intersection, turn right, turn left, or make a u-turn. fig. 5 illustrates still another example of forming a cluster of vehicles at an intersection. in this scenario, the congestion control system forms a cluster c 4 including vehicles v 7 ,v 8 , and v 9 , even though the vehicle v 8 is in a different lane than the vehicles v 7 and v 9 . the congestion control system determines that the vehicles v 7 ,v 8 , and v 9 are headed in the same direction, that there is only one lane available for movement in this direction after the intersection 150 , and that the vehicles v 7 ,v 8 , and v 9 thus will need to merge. the congestion control system can adjust the acceleration parameters for the vehicles in the cluster c 4 in view of the anticipated merge maneuver. next, fig. 6 illustrates an example method 200 for guiding a cluster of vehicles through an intersection. similar to the method 100 , the method 200 can be implemented as a set of instructions executable by one or more processors, and these instructions can operate in the congestion control system. the method 200 begins at block 202 , where a cluster of vehicles is identified. for example, the cluster can be initially identified in accordance with the method 100 discussed above. the make-up of a cluster however need not stay the same during the period when the congestion control system guides vehicles through an intersection. for example, vehicles can enter and leave lanes, turn left or right, etc. the congestion control system can support dynamic clustering to account for these situations. as illustrated in fig. 7 , after the traffic light 152 transitions from red to green and the congestion control system begins guiding the cluster c 1 through the intersection 150 , the vehicle v 1 changes lanes while the vehicle v 2 following immediately behind remains in the original lane. the congestion control system accordingly can modify the cluster c 1 so that the modified cluster c′ 1 includes only vehicles v 2 and v 3 . referring again to fig. 6 , one or more acceleration parameters for the vehicles in the cluster are determined at block 204 . the acceleration parameters in general can include one or more times when the vehicle should modify its speed (e.g., start accelerating at time t 0 , decrease the rate of acceleration at the speed at time t 1 ), the rate of acceleration (e.g., 3 m/s 2 , 4 m/s 2 ), etc. as discussed below, the congestion control system in some cases can map these numeric values to instructions with qualitative terms (e.g., “faster,” “slower”) a driver can follow more easily. in one embodiment, the parameters determined at block 204 include only the time when the vehicle should start to accelerate, for each of the vehicles in the cluster. the congestion control system can operate according to this embodiment when the vehicles in the cluster do not have any autonomous or semi-autonomous capability: the congestion control system can provide the timing information to the portable devices operated in the corresponding vehicles, and the drivers can accelerate in accordance with their abilities and preferences. the precise timing of acceleration can provide an improvement in traffic throughput at the intersection, even if this improvement is less significant than the improvement due to controlling both the timing and the rate of acceleration. referring back to fig. 4 , for example, the cluster c 1 includes the vehicles v 1 at the head of the queue, the vehicle v 2 immediately behind the vehicle v 1 , and the vehicle v 3 immediately behind the vehicle v 2 . the congestion control system can determine that the cluster c 1 can efficiently move through the intersection if the vehicles v 1 , v 2 , and v 3 accelerate at times t 1 , t 2 , and t 3 , respectively. as a more specific example, the congestion control system can determine that the vehicle v 1 should accelerate immediately in response to the traffic light 152 changing to green, that the vehicle will be at a safe distance d safe from the vehicle v 2 after t 2 amount of time, etc. the congestion control system generally can implement any suitable analytical or numerical technique for estimating the distance a vehicle is expected to cover with a certain acceleration. in another scenario, however, the congestion control system can determine that all vehicles in the cluster should start accelerating at the same time to move through the intersection more efficiently. in some embodiments, the parameters determined at block 204 include the time when the vehicle should start to accelerate as well as the rate when the vehicle should accelerate, for each of the vehicles in the cluster. according to one such embodiment, the congestion control system provides the rate of acceleration parameter along with the timing parameter to a semi-autonomous vehicle capable of accelerating at a relatively precise rate for a relatively precise amount of time (e.g., “accelerate at 2 m/s 2 at time t 0 =13:58:59.22, for 1.9 seconds”). according to another embodiment, the congestion control system provides the rate of acceleration parameter along with the timing parameter to a conventional vehicle, but maps the numeric values and some quantitative instructions to qualitative instructions the driver can understand, e.g., “accelerate slowly for about two seconds,” “accelerate freely until you reach 20 mph.” the congestion control system can determine the one or more acceleration parameters in view of the capability of individual vehicles, in some embodiments. for the example cluster c 1 , the congestion control system can determine that the vehicle v 1 is a sedan and should accelerate relatively quickly, the vehicle v 2 is a truck and should accelerate relatively slowly, etc. to this end, the congestion controller 64 or another component of the congestion control system in one embodiment processes the imagery captured by the external cameras/sensors 18 and runs a classifier to determine the types of vehicles. in another embodiment, the congestion control system obtains more precise vehicle data (e.g., make, model) from the vehicles in the cluster c 1 and/or the portable devices operating in these vehicles, provided that the user configured the corresponding software applications to provide this data to the congestion control system for the purpose of executing the method 200 or a similar method. further, the congestion control system can adjust the one or more acceleration parameters for a certain vehicle in view of what the vehicle, or the driver of the vehicle, cannot see due to the limited vision from the vantage point of the vehicle. in the example scenario of fig. 4 , the driver of the vehicle v 3 most likely cannot see the vehicle v 1 due to the large size of the truck v 2 . the congestion control system in some cases may determine that the vehicle v 1 may not be able to accelerate quickly (or is not accelerating quickly, after the initial guidance has been provided), and accordingly adjust the one or more acceleration parameters downward for the vehicle v 3 . in this manner, in addition to improving the efficiency of moving multiple vehicles through an intersection, the congestion control system can provide warnings to drivers regarding slower-than-expected acceleration and thereby improve safety. still further, the congestion control system can adjust the one or more acceleration parameters for a certain vehicle depending on how many of the other vehicles in the cluster, or the corresponding portable devices, currently participate in the coordinated movement through the intersection. the congestion control system can project less efficient acceleration for vehicles in the cluster that are not currently receiving guidance from the congestion control system. the congestion control system in some cases can adjust the one or more acceleration parameters in view of the weather conditions and/or lighting conditions. more particularly, the congestion control system may determine that the vehicles in the cluster should accelerate more slowly if the ambient conditions include rain, snow, or fog. the congestion control system can receive an indication of the current weather conditions at the intersection from a real-time weather service or from the sensors in the vehicles or the portable devices. the congestion control system may determine that the vehicles in the cluster should accelerate more slowly at certain hours at night. the congestion control system also can adjust the one or more acceleration parameters upon determining that the cluster or a portion of the cluster will make a turn. the guidance the congestion control system provides in these cases can include slower acceleration. the congestion control system can indicate that even lower acceleration is appropriate upon determining that the cluster or a portion of the cluster plans a u-turn. for example, the congestion control system can select the one or more acceleration parameters so that none of the vehicles in the cluster exceeds a certain threshold speed. the threshold speed for the u-turn scenario can have one value, the threshold speed for the left or right turn scenario can have another, higher value, and the threshold speed for the driving straight scenario can have an even higher value. the congestion control system can select and adjust these values in view of the speed limit near the intersection, the weather conditions, the lighting conditions, etc. with continued reference to fig. 6 , at block 206 , guidance is generated for the one or more vehicles in the cluster. as discussed above, the congestion control system can provide semi-autonomous vehicles with instructions that are relatively precise with respect to the time and rate of acceleration. on the other hand, the congestion control system can generate less precise guidance to a portable device operating in a conventional vehicle. the guidance provided to a conventional vehicle can include textual instructions that can be inserted into the sequence of step-by-step driving directions, imagery, vocalized instructions, etc. in an example embodiment, the congestion controller 64 augments the step-by-step driving directions generated by the navigation module 62 , so that the example sequence includes the vocalized instructions “head north on oak st.,” “turn right on lake st.,” “prepare to start accelerating in 2 seconds,” “accelerate freely to 15 mph,” “continue driving on lake st. for two miles,” etc. at block 208 , the congestion control system can provide the generated guidance to one, several, or all vehicles in the cluster, at the respective times. these times can be the same or different, depending on what the congestion control system previously determined would result in a more efficient scheme. not every vehicle in a cluster may be configured to receive guidance from the congestion control system, as discussed above. further, the congestion control system can provide guidance to different vehicles in different formats, e.g., in one format at one degree of precision for a semi-autonomous vehicle and in a different format at a different degree of precision to a conventional vehicle in the cluster. the congestion control system can determine whether the vehicle has reached a target speed at block 210 . to this end, the congestion control system can use the sensors of the vehicle, the portable device, or imagery collected via a camera external to the cluster. if the vehicle has reached the target speed, the flow can proceed to block 216 , where the congestion control system can dissolve the cluster. otherwise, the flow proceeds to block 212 . in another scenario, the congestion control system detects a change in the surroundings or a change related to the cluster of vehicles. examples of such changes include a vehicle in the cluster activating its turn signal, failure of a vehicle in the cluster to accelerate, a dog running out on the road in front of or near a vehicle in the cluster, etc. the congestion control system in this case proceeds to block 216 to dissolve the cluster or divide the cluster into two or more smaller clusters. in one example scenario in which the congestion control system divides the cluster, the congestion control system initially forms a cluster of ten vehicles and guides the cluster through an intersection. the driver of the fifth vehicle in the cluster intends to make a right turn into a gas station 1000 feet past the intersection. the driver of this vehicle turns on the right turn signal after driving 500 feet past the intersection. in response to detecting that the right turn signal in the fifth vehicle has been activated, the congestion control system can automatically divide the cluster into three clusters: a first cluster with the four vehicles in front of the fifth vehicle preparing for the turn, a second cluster including only the fifth vehicle preparing for the turn, and a third cluster including the last five vehicles of the original cluster. at block 212 , the congestion control system can monitor the movement of the cluster at block 212 . in particular, the congestion control system can ensure that the vehicles maintain a safe distance, that none of the vehicles accelerates too quickly or too slowly, that the make-up of the cluster remains the same, etc. for those vehicles being actively guided, the congestion control system can provide updated guidance at block 214 . for example, the congestion control system can generate a vocalized instruction “slow down” or “do not accelerate to a speed above 20 mph.” the flow then returns to block 210 . for further clarity, fig. 8 illustrates an example timeline 300 for providing guidance to a portable device operating in a vehicle. in this example scenario, each of the vehicles in the cluster is capable of receiving guidance, in the same or different formats, from the congestion control system. the event 302 can include advance guidance to vehicles regarding the traffic light. in one scenario, the advance guidance can include an indication of how much time remains until the traffic light changes to green. more generally, the advance guidance can include any potentially useful information such as an estimated amount of time it will take the vehicle to move through the intersection, an indication of how many vehicles are queued up at the intersection in front of the vehicle, etc. the congestion control system then can notify each of the vehicles in the cluster of the traffic light change (event 304 ) and cause the vehicles to start accelerating (events 306 a, 306 b, etc.). in one scenario, each of the events 306 a, 306 b, etc. occurs at the same time, at the same time as or shortly after the event 304 . in another scenario, the congestion control system spreads out in time the events 306 so as to account for the differences in the ability of the vehicles in the cluster to accelerate. for example, the truck in fig. 2 may accelerate significantly slower than a lighter vehicle, and the congestion control system can delay the instruction to start accelerating for the vehicle positioned behind the truck. the congestion control system can monitor the movement of the cluster through the intersection and, in some cases, provide updates to the corresponding vehicles and/or portable devices operating in these vehicles (events 308 ). as discussed above, the make-up of a cluster can change, some vehicle can accelerate faster or slower than expected, etc. when the desired speed is reached, or when the congestion control system determines that the cluster should be dissolved for another reason as discussed above (event 310 ), the congestion control system can stop providing guidance to the vehicles and, in some cases, notify the vehicles of the termination of this procedure. referring generally to figs. 1-8 , it is noted that the term “intersection” can apply to any junction between roads such as a four-way road junction as shown in the drawings, a three-way junction (such as t-junction or a y-junction), a junction of more than four roads, a staggered junction, or a roundabout (also known as a traffic circle). these junctions can be controlled by traffic lights, stop signs, yield signs, or other types of road signs. the congestion control system can determine the type of an intersection and adjust the acceleration parameters accordingly. for example, for a traffic circle, the congestion control system can identify a cluster that includes vehicles that approached the traffic circle from different directions and currently stopped at different entry points of the traffic circle. the congestion control system can guide the vehicles in such a cluster to start accelerating at the same time to enter the traffic circle at the same time at different locations. additional considerations the following additional considerations apply to the foregoing discussion. throughout this specification, plural instances may implement components, operations, or structures described as a single instance. although individual operations of one or more methods are illustrated and described as separate operations, one or more of the individual operations may be performed concurrently, and nothing requires that the operations be performed in the order illustrated. structures and functionality presented as separate components in example configurations may be implemented as a combined structure or component. similarly, structures and functionality presented as a single component may be implemented as separate components. these and other variations, modifications, additions, and improvements fall within the scope of the subject matter of the present disclosure. additionally, certain embodiments are described herein as including logic or a number of components, modules, or mechanisms. modules may constitute either software modules (e.g., code stored on a machine-readable medium) or hardware modules. a hardware module is tangible unit capable of performing certain operations and may be configured or arranged in a certain manner. in example embodiments, one or more computer systems (e.g., a standalone, client or server computer system) or one or more hardware modules of a computer system (e.g., a processor or a group of processors) may be configured by software (e.g., an application or application portion) as a hardware module that operates to perform certain operations as described herein. in various embodiments, a hardware module may comprise dedicated circuitry or logic that is permanently configured (e.g., as a special-purpose processor, such as a field programmable gate array (fpga) or an application-specific integrated circuit (asic)) to perform certain operations. a hardware module may also comprise programmable logic or circuitry (e.g., as encompassed within a general-purpose processor or other programmable processor) that is temporarily configured by software to perform certain operations. it will be appreciated that the decision to implement a hardware module mechanically, in dedicated and permanently configured circuitry, or in temporarily configured circuitry (e.g., configured by software) may be driven by cost and time considerations. accordingly, the term hardware should be understood to encompass a tangible entity, be that an entity that is physically constructed, permanently configured (e.g., hardwired), or temporarily configured (e.g., programmed) to operate in a certain manner or to perform certain operations described herein. as used herein “hardware-implemented module” refers to a hardware module. considering embodiments in which hardware modules are temporarily configured (e.g., programmed), each of the hardware modules need not be configured or instantiated at any one instance in time. for example, where the hardware modules comprise a general-purpose processor configured using software, the general-purpose processor may be configured as respective different hardware modules at different times. software may accordingly configured on a processor, for example, to constitute a particular hardware module at one instance of time and to constitute a different hardware module at a different instance of time. hardware modules can provide information to, and receive information from, other hardware. accordingly, the described hardware modules may be regarded as being communicatively coupled. where multiple of such hardware modules exist contemporaneously, communications may be achieved through signal transmission (e.g., over appropriate circuits and buses) that connect the hardware modules. in embodiments in which multiple hardware modules are configured or instantiated at different times, communications between such hardware modules may be achieved, for example, through the storage and retrieval of information in memory structures to which the multiple hardware modules have access. for example, one hardware module may perform an operation and store the output of that operation in a memory device to which it is communicatively coupled. a further hardware module may then, at a later time, access the memory device to retrieve and process the stored output. hardware modules may also initiate communications with input or output devices, and can operate on a resource (e.g., a collection of information). the methods 100 and 200 may include one or more function blocks, modules, individual functions or routines in the form of tangible computer-executable instructions that are stored in a non-transitory computer-readable storage medium and executed using a processor of a computing device (e.g., a server, a personal computer, a smart phone, a tablet computer, a smart watch, a mobile computing device, or other personal computing device, as described herein). the methods 100 and 200 may be included as part of any backend server (e.g., a map data server, a navigation server, or any other type of server computing device, as described herein), portable device modules of the example environment, for example, or as part of a module that is external to such an environment. though the figures may be described with reference to the other figures for ease of explanation, the methods 100 and 200 can be utilized with other objects and user interfaces. furthermore, although the explanation above describes steps of the methods 100 and 200 being performed by specific devices, this is done for illustration purposes only. the various operations of example methods described herein may be performed, at least partially, by one or more processors that are temporarily configured (e.g., by software) or permanently configured to perform the relevant operations. whether temporarily or permanently configured, such processors may constitute processor-implemented modules that operate to perform one or more operations or functions. the modules referred to herein may, in some example embodiments, comprise processor-implemented modules. similarly, the methods or routines described herein may be at least partially processor-implemented. for example, at least some of the operations of a method may be performed by one or more processors or processor-implemented hardware modules. the performance of certain of the operations may be distributed among the one or more processors, not only residing within a single machine, but deployed across a number of machines. in some example embodiments, the processor or processors may be located in a single location (e.g., within a home environment, an office environment or as a server farm), while in other embodiments the processors may be distributed across a number of locations. the one or more processors may also operate to support performance of the relevant operations in a “cloud computing” environment or as an saas. for example, as indicated above, at least some of the operations may be performed by a group of computers (as examples of machines including processors), these operations being accessible via a network (e.g., the internet) and via one or more appropriate interfaces (e.g., apis). still further, the figures depict some embodiments of the example environment for purposes of illustration only. one skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles described herein. upon reading this disclosure, those of skill in the art will appreciate still additional alternative structural and functional designs for reducing congestion at intersections through the disclosed principles herein. thus, while particular embodiments and applications have been illustrated and described, it is to be understood that the disclosed embodiments are not limited to the precise construction and components disclosed herein. various modifications, changes and variations, which will be apparent to those skilled in the art, may be made in the arrangement, operation and details of the method and apparatus disclosed herein without departing from the spirit and scope defined in the appended claims.
055-874-457-817-17X	JP	[ "US", "JP", "CN", "EP" ]	G06F3/038,G06F3/00,G06F3/01,G06F3/03,G06F3/0338,G06F3/0481,G09G5/08	2003-11-10T00:00:00	2003	[ "G06", "G09" ]	force-feedback input device	in a force-feedback input device, when the cursor moves on a line parallel to a line between a center of a first button and a center of a second button, an area is determined between a first position, which corresponds to the center of the first button, and a second position, which corresponds to the center of the second button, such that the area extends a distance w on both sides of a mid-point between the first and second positions. in this area, the first and second external-force generation portions are controlled so that a scalar value \|f\| of an attractive force exerted on an operating portion is decreased according to the equation \|f\|=d/w·\|f\| as the cursor moves closer to the mid-point, where d is a distance between the cursor and the mid-point.	1 . a force-feedback input device comprising: display means for displaying a cursor and a plurality of buttons; input means comprising an operating portion, a detecting portion for detecting an amount of movement of the operating portion, and an actuator for providing a required external force to the operating portion; and control means for controlling the display of the cursor based on an operational amount signal from the detecting portion and for controlling driving of the actuator so as to provide an attractive force to the operating portion based on a positional relationship between the cursor and the buttons; wherein the control means controls driving of the actuator based on a positional relationship between the cursor and a borderline between a first attractive area and a second attractive area appearing in vicinities of adjacent first and second buttons. 2 . the force-feedback input device according to claim 1 , wherein the control means controls driving of the actuator such that the attractive force decreases as a distance between the cursor and the borderline decreases.	background of the invention 1. field of the invention the present invention relates to a force-feedback input device used for, for example, car navigation systems and, in particular, to an improvement in the operational sensation of an input device having a function of automatically attracting a cursor into a position of a menu-selection button displayed on display means in order to facilitate the selection of a desired button. 2. description of the related art input devices are known in which display means displays menu-selection buttons and a cursor, and in which input means allows an operator to select a desired menu by moving the cursor to the display position of the desired button among the menu-selection buttons. in addition, some input means have a function that automatically attracts a cursor to the displayed position of the button to facilitate a movement of the cursor to the displayed button position. fig. 9 is a block diagram of a known input device having an automatic cursor attraction function. this input device includes input means 101 which is operated by an operator and detects the amount of movement by itself, display means 102 which displays a cursor moved by the input means 101 and input points (buttons), position detecting means 103 which finds the coordinates of the cursor displayed on the display means 102 from the amount of movement of the input means 101 , and driving means 104 for providing force-feedback to the input means 101 in accordance with the coordinates of the position of the cursor. the input means 101 includes a rolling ball 105 which moves on a desk while rotating, and rotation-angle detecting means 106 and 107 disposed in accordance with the x-axis and y-axis directions of the display means 102 in order to detect the amount of rotation of the rolling ball 105 in the x-axis direction and in the y-axis direction. the driving means 104 includes a driving unit 108 composed of motors 108 a and 108 b to drive the rolling ball 105 and a driving signal generation unit 109 for generating a driving signal to drive the driving unit 108 in accordance with a signal from the position detecting means 103 (refer to, for example, japanese examined patent application publication no. 07-120247). as shown in fig. 10 c , the driving signal generation unit 109 pre-stores a relationship among a relative distance between a cursor and an input point, a relative moving direction of the cursor towards the input point, and a driving signal supplied to the driving unit 108 . as shown in fig. 10a , when the cursor is moved towards the input point by the operation of the input means 101 and the cursor enters the range of x1≦x≦x2, the driving signal “+1” shown in fig. 10c is supplied to the driving unit 108 from the driving signal generation unit 109 . accordingly, a driving force is provided to the rolling ball 105 so that a sensation is provided to the input means 101 as if it is attracted by the input point, as shown in fig. 10b , and the cursor is attracted to the input point. in contrast, when the cursor is moved away from the input point by the operation of the input means 101 and the cursor enters the range of x3≦x≦x4, the driving signal “−1” shown in fig. 10c is supplied to the driving unit 108 from the driving signal generation unit 109 . accordingly, a resistive force is provided to the rolling ball 105 so that a sensation is provided to the input means 101 as if it is pulled back by the input point. therefore, an input device of the above-described structure facilitates the operation for a cursor to move on the desired input point. for example, this input device facilitates the menu selection displayed on the display means 102 . in the above-described known example, it is designed such that, when the cursor moves into a predetermined area for an input point, the cursor is attracted to the display area of the input point by applying a driving signal to the driving unit 108 . in addition, in some of the known input devices, a cursor is attracted to the closest input point even when the cursor is placed at any location outside the display area of the input point. that is, the input devices have an infinite attractive area. additionally, in the above-described known example, the cursor is not attracted to the center of the input point. however, some of the known input devices move a cursor into the center of the input point. furthermore, in the above-described known example, a mouse is used as the input means 101 . however, some of the known input devices employ a joystick instead of a mouse. as described in japanese examined patent application publication no. 07-120247, a plurality of menu selection buttons (input points) is normally disposed on display means in various ways. however, the technology described in the publication discloses no method for controlling an attractive force when a plurality of buttons is displayed on display means, in particular, when the buttons are closely located to each other. that is, the strength of the attractive force is controlled based on only the distance between a cursor and one of the buttons. therefore, when the technology described in that publication is applied to an actual device, and a cursor is moved from the display position of one button or the vicinity of the button to the display position of another button or the vicinity of the button, impact strength occurs in the input means, and therefore, the operability of the input means becomes degraded or the cursor cannot be smoothly moved in the desired direction, which is a problem. in other words, when a plurality of buttons is displayed on display means, a cursor is attracted in the direction towards the closest displayed button of the cursor. accordingly, if the closest button changes to another button and the direction of the attractive force is switched while the cursor is moving, the strength of the attractive force abruptly changes. therefore, unless the strength of the attractive force exerted on the input means is reduced before and after the change, a large impact strength occurs in the input means. as shown in fig. 11 , two buttons b 1 and b 2 are displayed in the x-axis direction of the display means 102 . the attractive force of a cursor c is determined based on only a distance between the cursor c and the button. for example, the strength of the attractive force is constant. when the cursor c moves from the left of the button b 1 to the right of the button b 2 on a line m 1 between a center o 1 of the button b 1 to a center o 2 of the button b 2 , a component force fx of the attractive force in the x-axis direction and a component force fy of the attractive force in the y-axis direction, as shown in fig. 12a , are provided to the input means 101 by two driving means, for example, the motors 108 a and 108 b , disposed along the x-axis direction and the y-axis direction. if the cursor c moves from the left of the button b 1 to the right of the button b 2 on a line m 2 parallel to the line m 1 , a component force fx of the attractive force in the x-axis direction and a component force fy of the attractive force in the y-axis direction, as shown in fig. 12b , are provided to the input means 101 by the two driving means. as can be seen from figs. 12a and 12b , when an attractive force exerted on the cursor c is controlled only by a distance between the cursor c and a button regardless of the displayed position of the cursor c with respect to the buttons b 1 and b 2 , the direction of a component force fx of the attractive force in the x-axis direction is reversed at the time when the cursor c passes across the mid-point between the center o 1 of the button b 1 and the center o 2 of the button b 2 , that is, when the cursor c passes across a center line y-y between the buttons in fig. 11 . accordingly, the strength of the attractive force abruptly changes and, thus, an unnatural click sensation occurs from button to button and provides an operator with an unpleasant sensation. summary of the invention accordingly, it is an object of the present invention to provide a force-feedback input device that does not produce an unnatural click sensation from button to button and, therefore, does not provide an operator with an unpleasant sensation even when a plurality of buttons is displayed on the display means. according to the present invention, a force-feedback input device includes display means, input means, and control means. the display means displays a cursor and a plurality of buttons. the input means includes an operating portion, a detecting portion for detecting an amount of movement of the operating portion, and an actuator for providing a required external force to the operating portion. the control means controls the display of the cursor based on an operational amount signal from the detecting portion and driving of the actuator so as to provide an attractive force to the operating portion based on the relationship between positions of the cursor and the buttons. the control means controls driving of the actuator based on the relationship between positions of the cursor and a borderline between a first attractive area and a second attractive area appearing in the vicinities of adjacent first and second buttons. since driving of the actuator is controlled based on the relationship between positions of the cursor and the borderline between the attractive areas, no unnatural click sensation occurs when the cursor passes across the borderline between the attractive areas by preventing an abrupt change in the strength of the attractive force on the borderline. preferably, in the force-feedback input device, the control means controls driving of the actuator such that the attractive force decreases as the distance between the cursor and the borderline decreases. since the actuator is controlled so that the attractive force decreases as the distance between the cursor and the borderline is decreased, an abrupt change in the strength of the attractive force on the borderline is prevented. therefore, no unnatural click sensation occurs when the cursor passes across a borderline between the attractive areas. according to the present invention, when a plurality of buttons is displayed on display means, a force-feedback input device controls driving of an actuator based on the relationship between a cursor and a borderline of attractive areas. consequently, abrupt change in the strength of the attractive force on the borderline is prevented and, therefore, no unnatural click sensation occurs when the cursor passes across a borderline between the attractive areas. brief description of the drawings fig. 1 is a block diagram of a force-feedback input device according to an embodiment of the present invention; fig. 2 is a side cross-sectional view of input means according to the embodiment; fig. 3 is a top plan cross-sectional view of the input means according to the embodiment; figs. 4a, 4b , and 4 c are diagrams explaining the operation of the force-feedback input device according to the embodiment; fig. 5 is a vector diagram illustrating the change in an attractive force exerted on the input means when two buttons are displayed on display means; fig. 6 is a schematic diagram explaining a scheme for controlling the attractive force in the input means according to the embodiment; figs. 7a and 7b are graph charts illustrating a change in an attractive force exerted on the input means when two buttons are displayed on display means; fig. 8 is a schematic diagram of an attractive area set on the display means; fig. 9 is a block diagram of a known input device; figs. 10a, 10b , and 10 c are diagrams explaining the operation of the known input device; fig. 11 is a vector diagram illustrating a change in an attractive force exerted on input means when two buttons are displayed on display means; and figs. 12a and 12b are graph charts illustrating the change in an attractive force exerted on the input means when two buttons are displayed on the display means. description of the preferred embodiments embodiments of the present invention will be described below with reference to figs. 1 to 8 . fig. 1 is a block diagram of a force-feedback input device according to an embodiment of the present invention. fig. 2 is a side cross-sectional view of input means according to an embodiment. fig. 3 is a top plan cross-sectional view of the input means according to the embodiment. figs. 4a, 4b , and 4 c are diagrams explaining the operation of the force-feedback input device according to the embodiment. fig. 5 is a vector diagram illustrating a change in an attractive force exerted on the input means when two buttons are displayed on display means. fig. 6 is a schematic diagram explaining a scheme for controlling the attractive force in the input means according to the embodiment. figs. 7a and 7b are graph charts illustrating the change in an attractive force exerted on the input means when two buttons are displayed on display means. fig. 8 is a schematic diagram of an attractive area set on the display means. as shown in fig. 1 , a force-feedback input device according to the embodiment includes display means 1 for displaying required images including a cursor c and a plurality of buttons b 1 to bn, input means 2 for moving the cursor c displayed on the display means 1 and selecting one of the buttons b 1 to bn, and control means 3 for controlling the display means 1 and the input means 2 . the display means 1 may be any well-known display device. however, when the input device according to the present invention is used for car navigation systems and mobile game machines, a liquid crystal display device is preferably used among others since the manufacturing cost and the size can be reduced. the coordinates of the cursor c and the buttons b 1 to bn are determined assuming that the horizontal direction and the vertical direction of the display means 1 are the x-axis and the y-axis, respectively. as shown in fig. 8 , attractive areas a 1 to an of the cursor c are arranged around the buttons b 1 to bn, respectively. only when the cursor c is moved into the attractive areas a 1 to an is the cursor c attracted to the center of the closest one of the above-described buttons displayed on the display means 1 by driving first and second external force generation portions 23 and 24 . as shown in fig. 1 , the input means 2 includes a mechanism portion 21 having a pivoted lever 21 a , an operating portion 22 attached to a top end of the pivoted lever 21 a , the first and second external force generation portions 23 and 24 for providing an attractive force to the operating portion 22 via the pivoted lever 21 a , and first and second detecting portions 25 and 26 for detecting the amounts of operational movement in the two orthogonal directions of the pivoted lever 21 a. as shown in figs. 2 and 3 , the mechanism portion 21 includes the pivoted lever 21 a , a casing 31 , a lever-holding shaft 32 , and a swing arm 33 , both of which are rotatably supported by the casing 31 . the lever-holding shaft 32 and the swing arm 33 are orthogonally disposed to each other. the pivoted lever 21 a is attached to the lever-holding shaft 32 so that the pivoted lever 21 a can rotate only in the rotational direction of the swing arm 33 . reference numeral 21 b in the drawing denotes a central shaft of pivotal movement of the pivoted lever 21 a . on the other hand, the swing arm 33 has a long slit 33 a so that a lower end of the pivoted lever 21 a passes through. the width of the long slit 33 a is slightly greater than the diameter of the lower end of the pivoted lever 21 a . when the pivoted lever 21 a swings in the rotational direction of the lever-holding shaft 32 , namely, in the direction x-x, the lower end of the pivoted lever 21 a can freely swing in the long slit 33 a . in contrast, when the pivoted lever 21 a swings in the rotational direction of the central shaft 21 b , namely, in the direction y-y, the swing arm 33 can swing along with the pivoted lever 21 a. thus, the pivoted lever 21 a can swing in any direction about the lever-holding shaft 32 and the central shaft 21 b . the lever-holding shaft 32 rotates by an amount of rotation in proportion to an amount of pivotal movement of the pivoted lever 21 a in the x-x direction. the swing arm 33 rotates by an amount of rotation in proportion to an amount of pivotal movement of the pivoted lever 21 a in the y-y direction. the operating portion 22 has a shape and a size that an operator can manipulate. a selection switch 22 a for selecting one of the buttons b 1 to bn displayed on the display means 1 is disposed as a part of the operating portion 22 . the first external-force generation portion 23 is coupled with the lever-holding shaft 32 and drives the operating portion 22 so that the operating portion 22 moves in the x-axis direction of the display means 1 . in contrast, the second external-force generation portion 24 is coupled with the swing arm 33 and drives the operating portion 22 so that the operating portion 22 moves in the y-axis direction of the display means 1 . an electric actuator, such as a motor and a solenoid, may be used as the first and second external-force generation portions 23 and 24 . when a linear actuator, such as a linear motor and a solenoid, is used as the first and second external-force generation portions 23 and 24 , an appropriate power transfer mechanism is disposed between the first external-force generation portion 23 and the lever-holding shaft 32 and between the second external-force generation portion 24 and the swing arm 33 so that linear motion of the first and second external-force generation portions 23 and 24 is converted to rotary motion of the lever-holding shaft 32 and the swing arm 33 , respectively. the first and second detecting portions 25 and 26 detect rotational directions and amounts of rotational movement of the rotational shafts and convert them to electric signals in accordance with the detected result in order to output them. for example, a rotary encoder or a rotary variable resistor may be used as the first and second detecting portions 25 and 26 . the rotational shaft of the first detecting portion 25 is coupled with the lever-holding shaft 32 and the rotational shaft of the second detecting portion 26 is coupled with the swing arm 33 . as shown in fig. 1 , the control means 3 includes an input unit 41 , an arithmetic unit 42 , a storage unit 43 , first and second driver circuits 44 and 45 , a third driver circuit 46 , and a cpu 47 . the input unit 41 receives a first operational amount signal a output from the first detecting portion 25 , a second operational amount signal b output from the second detecting portion 26 , and a switching signal c output from the selection switch 22 a . the arithmetic unit 42 calculates a moving direction and moving distance of the cursor c based on the first and second operational amount signals a and b, and driving signals d and e for driving the first and second external-force generation portions 23 and 24 based on the first and second operational amount signals a and b. also, the arithmetic unit 42 switches display screens based on the switching signal c. the storage unit 43 stores formulae and coefficients for the calculation and the coordinates of the centers of the buttons b 1 to bn. the first and second driver circuits 44 and 45 drive the first and second external-force generation portions 23 and 24 by outputting external-force generation driving electric power g and h in accordance with the driving signals d and e output from the arithmetic unit 42 . the third driver circuit 46 drives the display means 1 by outputting display-means driving electric power i in accordance with a display-means driving signal f output from the arithmetic unit 42 . the cpu 47 controls the above-described units 41 to 46 . as shown in fig. 4a , when the operating portion 22 is operated, the arithmetic unit 42 calculates a moving direction and moving distance of the cursor c displayed on the display means 1 based on the first and second operational amount signals a and b and formulae and coefficients stored in the storage unit 43 , and then causes the cursor c displayed on the display means 1 to move in the direction corresponding to the operational direction of the operating portion 22 by a distance corresponding to the operational amount of the operating portion 22 based on the calculation result. additionally, as shown in fig. 4b , the arithmetic unit 42 finds a button displayed at the closest position from the cursor c based on the coordinates (x, y) of the current position of the cursor c and the coordinates (x1, y1) of the center of each of the buttons b 1 to bn. that is, in the example shown in fig. 4b , a button b 5 is found. the arithmetic unit 42 then drives the first and second external-force generation portions 23 and 24 so as to attract the cursor c to the center of the found button. as shown in fig. 4c , in order to attract the cursor c to the center of each of the buttons b 1 to bn, for example, an attractive force \|f\| provided to the operating portion 22 by the first and second external-force generation portions 23 and 24 is linearly increased in accordance with the distance from the cursor c to the center of each of the buttons b 1 to bn when the cursor c is positioned outside a predetermined radius p 1 from the center of each of the buttons b 1 to bn. when the cursor c is positioned between the radius p 1 and a predetermined radius p 2 , the attractive force \|f\| is set to constant. when the cursor c is positioned outside the radius p 2 , the attractive force \|f\| is linearly decreased in accordance with the distance from the cursor c to the center of each of the buttons b 1 to bn. however, as shown in fig. 5 , when the cursor c moves on a line m 2 parallel to a line m 1 between a center o 1 of the button b 1 and a center o 2 of the button b 2 , an area is determined between a position p 1 , which corresponds to the center o 1 of the button b 1 , and a position p 2 , which corresponds to the center o 2 of the button b 2 , such that the area extends a distance w on both sides of a mid-point pm between the positions p 1 and p 2 . in this area, the first and second external-force generation portions 23 and 24 are controlled so that a scalar value \|f\| of the attractive force exerted on the operating portion 22 is decreased according to the equation \|f\|=d/w·\|f\| as the cursor c moves closer to the mid-point pm, where d is a distance between the cursor c and the mid-point pm. that is, an adjusting method of the attractive force \|f\| according to the embodiment is characterized in that, as shown in fig. 6 , both a component force fx of the attractive force \|f\| in the x-axis direction generated by the first external-force generation portion 23 and a component force fy of the attractive force if 1 in the y-axis direction generated by the second external-force generation portion 24 are decreased when the cursor c moves on the line m 2 . accordingly, as shown in figs. 7a and 7b , even when the cursor c moves from the left of the button b 1 to the right of the button b 2 on the line m 1 between the center o 1 of the button b 1 to the center o 2 of the button b 2 , and even when the cursor c moves from the left of the button b 1 to the right of the button b 2 on the line m 2 parallel to the line m 1 , the strength of the attractive force \|f\| provided to the operating portion 22 does not change abruptly. therefore, in the input device according to the embodiment, no unnatural click sensation occurs when the cursor c passes across a borderline pm between the attractive areas. a distance l between the current position of the cursor c and the center of each of the buttons b 1 to bn displayed on the display means 1 is given by the following equation: l ={square root}[( x−x 1) 2 +( y−y 1) 2 ], where the coordinates of the current position of the cursor c is (x, y) and the center of each of the buttons b 1 to bn displayed on the display means 1 is (x1, y1). additionally, the component force \|f\| of the attractive force \|f\| in the x-axis direction generated by the first external-force generation portion 23 and the component force fy of the attractive force \|f\| in the y-axis direction generated by the second external-force generation portion 24 are given by the following equations: fx =−cos θ× f fy =−sin θ× f cos θ=( x−x 1)/ l sin θ=( y−y 1)/ l, where θ is a slope angle of the attractive force f with respect to the x-axis of the display means 1 . as described above, when a plurality of the buttons b 1 to bn are displayed on the display means 1 , the input device according to the embodiment controls driving of the first and second external-force generation portions 23 and 24 based on the relationship between the positions of the borderline pm of the attractive areas and the cursor c. consequently, no unnatural click sensation occurs when the cursor c passes across a borderline pm between the attractive areas by controlling the first and second external-force generation portions 23 and 24 so as not to change the strength of the attractive force \|f\| abruptly at the borderline pm. additionally, the input device according to the embodiment controls driving of the first and second external-force generation portions 23 and 24 so that the attractive force \|f\| decreases as the distance between the cursor c and the borderline pm decreases. consequently, the strength of the attractive force \|f\| does not abruptly change at the borderline pm and, therefore, no unnatural click sensation occurs when the cursor c passes across the borderline. in the above-described embodiment, two buttons b 1 and b 2 are arranged along the x-axis direction of the display means 1 . however, in the case where two buttons b 1 and b 2 are arranged along the y-axis direction of the display means 1 or are arranged at an angle with respect to the x-axis and y-axis directions, driving of the first and second external-force generation portions 23 and 24 can be controlled in the same manner. in addition, in the above-described embodiment, attractive areas a 1 to an of the cursor c are arranged around the buttons b 1 to bn and, only when the cursor c is moved into the attractive areas a 1 to an, an attractive force that attracts the cursor c to the center of the closest one of the above-described buttons displayed on the display means 1 is provided to the operating portion 22 . however, instead of arranging attractive areas of the cursor c around the buttons b 1 to bn, a force that attracts the cursor c positioned outside the centers of the buttons b 1 to bn to the center of a button displayed at a position closest to the cursor c may be applied at all times. furthermore, although the input device includes the operating portion 22 of a joystick type in the above-described embodiment, the present invention can be applied to an input device of a mouse type.
058-096-427-381-96X	US	[ "WO", "US", "TW" ]	H01Q1/52,H01Q1/38,H01Q1/00	2006-02-28T00:00:00	2006	[ "H01" ]	integrated filter in antenna-based detector	an antenna system includes a dielectric structure formed on a substrate; an antenna, partially within the dielectric structure, and supported by the dielectric structure; a reflective surface formed on the substrate. a shield blocks radiation from a portion of the antenna and from at least some of the dielectric structure. the shield is supported by the dielectric structure.	1 . an antenna system comprising: a dielectric structure; an antenna, partially within the dielectric structure, and supported by the dielectric structure; and a detection system disposed to detect electrical field changes in the antenna. 2 . a system as in claim 1 wherein the dielectric structure is formed on a substrate, the system further comprising: a reflective surface formed on the substrate. 3 . a system as in claim 1 further comprising: a shield blocking radiation from a portion of the antenna. 4 . a system as in claim 3 wherein the shield also blocks radiation from the dielectric structure. 5 . a system as in claim 3 wherein the shield is supported by the dielectric structure. 6 . a system as in claim 1 wherein: the antenna comprises: a first metal portion on one side of the dielectric structure; a middle portion comprising a portion of the dielectric structure; and a second metal portion on another side of the dielectric structure. 7 . a system as in claim 6 wherein the length of the first metal portion is substantially equal to the length of the second metal portion. 8 . a system as in claim 7 wherein the length of the dielectric portion of the antenna is based, at least in part, as a function of the dielectric constant of the dielectric material. 9 . a system as in claim 1 wherein the detection system includes a source of charged particles. 10 . a system as in claim 6 wherein the first metal portion and the second metal portions are comprised of the same metal. 11 . a system as in claim 6 wherein the first metal portion and the second metal portions are comprised of different metals. 12 . an antenna system comprising: a dielectric structure formed on a substrate; an antenna, partially within the dielectric structure, and supported by the dielectric structure; a reflective surface formed on the substrate; a shield blocking radiation from a portion of the antenna and from at least some of the dielectric structure, the shield being supported by the dielectric structure; and a detection system disposed to detect electrical field changes in the antenna, wherein the detection system includes a source of charged particles. 13 . an antenna comprising: a dielectric portion; a first metal portion on a first side of the dielectric portion; and a second metal portion on a second side of the dielectric portion. 14 . an antenna as in claim 13 wherein the antenna is constructed and adapted to detect electromagnetic waves having a particular frequency, and wherein a first length of the first metal portion and a second length of the second metal portion and a third length, of the dielectric portion, are each based, at least in part, on a function of the particular frequency. 15 . an antenna as in claim 13 wherein the first length is substantially the same as the second length. 16 . an antenna as in claim 13 wherein the first metal portion and the second metal portion are comprised of the same metal. 17 . an antenna system comprising: a first antenna portion; a second antenna portion on a first side of the first antenna portion; and a third antenna portion on a second side of the first antenna portion. a shield blocking radiation from at least a part of the antenna; and a detection system disposed to detect electrical field changes in the antenna, wherein the detection system includes a source of charged particles. 18 . an antenna system as in claim 17 wherein: the first antenna portion and the third antenna portion comprise a first metal; and the second antenna portion comprises a second metal. 19 . an antenna system as in claim 17 wherein: the first antenna portion and the third antenna portion comprise a first dielectric material; and the second antenna portion comprises a second dielectric material. 20 . an antenna system as in claim 17 wherein: the first antenna portion and the third antenna portion comprise a metal; and the second antenna portion comprises a dielectric material.	cross-reference to related applications this application is related to and claims priority from the following co-pending u.s. patent application, the entire contents of which is incorporated herein by reference: u.s. provisional patent application no. 60/777,120, titled “systems and methods of utilizing resonant structures,” filed feb. 28, 2006 [atty. docket no. 2549-0087]. the present invention is related to the following co-pending u.s. patent applications which are all commonly owned with the present application, the entire contents of each of which are incorporated herein by reference: (1) u.s. patent application ser. no. 11/238,991, entitled “ultra-small resonating charged particle beam modulator,” and filed sep. 30, 2005;(2) u.s. patent application ser. no. 10/917,511, entitled “patterning thin metal film by dry reactive ion etching,” filed on aug. 13, 2004;(3) u.s. application ser. no. 11/203,407, entitled “method of patterning ultra-small structures,” filed on aug. 15, 2005;(4) u.s. application ser. no. 11/243,476, entitled “structures and methods for coupling energy from an electromagnetic wave,” filed on oct. 5, 2005; (5) u.s. application ser. no. 11/243,477, entitled “electron beam induced resonance,” filed on oct. 5, 2005; (6) u.s. application ser. no. 11/325,432, entitled “resonant structure-based display,” filed on jan. 5, 2006;(7) u.s. application ser. no. 11/410,924 [atty. docket no. 2549-0010], entitled “selectable frequency emr emitter,” filed on apr. 26, 2006; and(8) u.s. application ser. no. 11/400,280 [atty. docket no. 2549-0068], entitled “resonant detector for optical signals,” filed on apr. 10, 2006. copyright notice a portion of the disclosure of this patent document contains material which is subject to copyright or mask work protection. the copyright or mask work owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the patent and trademark office patent file or records, but otherwise reserves all copyright or mask work rights whatsoever. field of the disclosure this relates to ultra-small devices, and, more particularly, to ultra-small antennas. introduction & background antennas are used for detecting electromagnetic radiation (emr) of a particular frequency. as is well known, frequency (f) of a wave has an inverse relationship to wavelength (generally denoted λ). the wavelength is equal to the speed of the wave type divided by the frequency of the wave. when dealing with electromagnetic radiation (emr) in a vacuum, this speed is the speed of light c in a vacuum. the relationship between the wavelength λ of an electromagnetic wave its frequency f is given by the equation: as shown in fig. 1 , a typical antenna 10 is formed to detect electromagnetic waves having a certain frequency f, with a corresponding wavelength (λ m ). this desired frequency may be referred to herein as the desired detection frequency. the antenna 10 is a so-called quarter wavelength antenna, and its length is a multiple (preferably an odd multiple) of a quarter of the desired detection wavelength, i.e., an odd multiple of ¼ λ m . note that when a electromagnetic wave (w) with wavelength λ m is incident on the antenna 10 , this causes a standing wave (denoted by the dashed line in the drawing) to be formed in the antenna. the standing wave is reflected of the end of the antenna, to form a second standing wave (denoted by the dotted line in the drawing). the wavelength of the standing wave is ½ λ m . when an electromagnetic wave travels through a dielectric, the velocity of the wave will be reduced and it will effectively behave as if it had a shorter wavelength. generally, when an electromagnetic wave enters a medium, its wavelength is reduced (by a factor equal to the refractive index n of the medium) but the frequency of the wave is unchanged. the wavelength of the wave in the medium, λ′ is given by: where λ 0 is the vacuum wavelength of the wave. note that the antenna 10 shown in fig. 1 is formed of an homogenous material, typically a metal. it is desirable to have more selectivity/sensitivity to specific frequencies in antenna detectors. brief description of the drawings the following description, given with respect to the attached drawings, may be better understood with reference to the non-limiting examples of the drawings, wherein: fig. 1 shows various aspects of operation of an antenna; figs. 2-3 are side and top views, respectively, of an antenna with an integrated filter; fig. 4 shows various aspects of operation of an antenna; and figs. 5 ( a )- 5 ( d ) show an exemplary process for making an antenna structure. the presently preferred exemplary embodiments figs. 2-3 show a side view and a top view, respectively, of an antenna 100 formed within a dielectric structure 102 . the dielectric 102 may be formed on a substrate 104 . a detector system 106 is coupled with the antenna. the detector system may comprise an emitter 108 (a source of charged particles) and a detector 110 (not shown in fig. 1 ) various structures for the emitter/detector are disclosed in co-pending u.s. patent application ser. no. 11/400,280, [atty. docket 2549-0068], entitled “resonant detector for optical signals,” and filed on apr. 10, 2006, the entire contents of which have been incorporated herein by reference. the detector system may be formed on substrate 104 or elsewhere. preferably the detector system 106 is disposed at end e 2 of the antenna system. although shown as rectangular, the end e 2 of the antenna may be pointed to intensify the field. a shield structure 112 (not shown in fig. 2 ) is formed to block emr from interacting with the detector system 106 , in particular, with the particle beam emitted by the emitter 108 . the shield 112 may be formed on a top surface of the dielectric structure. an optional reflective surface 114 may be formed on the substrate 104 to reflect emr to a receiving end e 1 of the antenna 100 . the entire antenna structure, including the detection system, should preferably be provided within a vacuum. for the purposes of this description, the antenna has three logical portions, namely a first antenna portion (shown in the drawing to the left of the dielectric structure 102 ), a second antenna portion within the dielectric structure, and a third antenna portion (shown in the drawing to the right of the dielectric structure). the antenna 100 is formed to detect electromagnetic waves having a certain frequency f, with corresponding wavelength (λ). accordingly, the length of the first antenna portion, l 1 and that of the third antenna portion l 2 are both ¼λ. the length l d of the second antenna portion, the portion within the dielectric, is ¼λ d , where λ d is the wavelength of the signal within the dielectric 102 . the antenna 100 is formed at a height h of ¼ λ above the substrate 104 . recall that when an electromagnetic wave travels through a dielectric, its wavelength is reduced but the frequency of the wave is unchanged. the dielectric structure thus acts as a filter for a received signal, allowing emr of the appropriate wavelength to pass therethrough. fig. 4 shows the standing wave(s) formed in the antenna 100 . as can be seen from the drawing, in the two metal segments 101 -a, and 101 -b, the wavelength of the standing wave is ¼λ, whereas in the dielectric segment 103 , the wavelength of the standing wave is ¼λ d —i.e., the wavelength corresponding to dielectric. the dimensions of the dielectric element can be determined, e.g., based on the relationship between the dielectric constants of the antenna material and the dielectric, e.g., using the following equation: where l v is the length of the metal portion (corresponding to λ v , the wavelength of the wave in a vacuum), and l d is the length of the dielectric portion (corresponding to λ d is the wavelength of the wave in the dielectric material); e d is the dielectric constant of the dielectric material and e m is the dielectric constant of the metal. those skilled in the art will understand that l v /l d =λ v /λ d ). from this equation, the value of l d can be determined as: the dielectric layer acts as a support for the antenna, and a filter. the antenna structures may be formed of a metal such as silver (ag). with reference to figs. 5 ( a )- 5 ( d ), the antenna structures may be formed as follows (although other methods may be used): first, the dielectric (d 1 ) is formed on the substrate, along with two sacrificial portions (s 1 , s 2 ) ( fig. 5 ( a )). the antenna (a) is then formed on the dielectric (d 1 ) and the two sacrificial portions (s 1 , s 2 ) ( fig. 5 ( b )). the sacrificial portions can then be removed ( fig. 5 ( c )), and then remainder of the dielectric (d 2 ) can be formed on the antenna. as shown in the drawings, the antenna comprises three portions, namely metal, dielectric, metal. those skilled in the art will realize, upon reading this description, that the antenna may comprise three metal portions (e.g., in the order metal a , metal b , metal a , where metal a and metal b different metals, e.g., silver and gold). those skilled in the art will realize, upon reading this description, that the antenna may comprise three dielectric portions (e.g., in the order d a , d b , d a , where d a and d b are different dielectric materials). while certain configurations of structures have been illustrated for the purposes of presenting the basic structures of the present invention, one of ordinary skill in the art will appreciate that other variations are possible which would still fall within the scope of the appended claims. while the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
058-746-955-098-086	JP	[ "CN", "JP", "US" ]	G11B7/09,G02B7/08,G11B11/00	2008-09-16T00:00:00	2008	[ "G11", "G02" ]	objective lens actuator and an optical pickup	an objective lens actuator, being suitable for a thin-sized optical pickup and a thin-sized optical disc apparatus, comprises: an objective lens for focusing a light upon a recording surface of an optical disc; and a driving means including a focusing coil, tracking coils, and a magnetic circuit, for operating the objective lens into a focusing direction of approaching/receding to/from the optical disc, and into a tracking direction of a radius of the optical disc, wherein the magnetic circuit has two (2) pieces of magnets putting the objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet, thereby brining an unnecessary moment, which is applied upon a moving part including the objective lens therein, to be small, and suppressing inclination or tile and vibration of the objective lens, so as to deal with high-density and high-speed recording/reproducing of information.	1 . an objective lens actuator, comprising: an objective lens for focusing a light upon a recording surface of an optical disc; and a driving means including a focusing coil, tracking coils, and a magnetic circuit, for operating said objective lens into a focusing direction of approaching/receding to/from said optical disc, and into a tracking direction of a radius of the optical disc, wherein said magnetic circuit has two (2) pieces of magnets putting said objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet. 2 . the objective lens actuator, as is described in the claim 1 , wherein a line connecting between centers of two (2) driving forces in the focusing direction, which are generated on said focusing coils by said two (2) pieces of magnets, is in conformity with a center of gravity of a moving part, including said objective lens therein. 3 . an objective lens actuator, comprising: an objective lens for focusing a light upon a recording surface of an optical disc; and a driving means including a focusing coil, tracking coils, and a magnetic circuit, for operating said objective lens into a focusing direction of approaching/receding to/from said optical disc, and into a tracking direction of a radius of the optical disc, wherein said magnetic circuit has two (2) pieces of magnets putting said objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet, so that those two (2) magnets are same in values thereof. 4 . the objective lens actuator, as is described in the claim 3 , wherein a line connecting between centers of two (2) driving forces in the focusing direction, which are generated on said focusing coils by said two (2) pieces of magnets, is in conformity with a center of gravity of a moving part, including said objective lens therein. 5 . an objective lens actuator, comprising: an objective lens for focusing a light upon a recording surface of an optical disc; a driving means including a focusing coil, tracking coils, and a magnetic circuit, for operating said objective lens into a focusing direction of approaching/receding to/from said optical disc, and into a tracking direction of a radius of the optical disc; and an optical part on a reverse side of said optical disc putting said objective lens therebetween, wherein a light in a direction in parallel with an optical disc surface, being incident upon said optical part and passing through said objective, is focused on the recording surface of said optical disc, and said magnetic circuit has two (2) pieces of magnets putting said objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet. 6 . the objective lens actuator, as is described in the claim 1 , wherein a line connecting between centers of two (2) driving forces in the focusing direction, which are generated on said focusing coils by said two (2) pieces of magnets, is in conformity with a center of gravity of a moving part, including said objective lens therein. 7 . the optical pickup, being mounted on an optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the objective lens actuator as described in the claim 1 . 8 . the optical pickup, being mounted on an optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the objective lens actuator as described in the claim 3 . 9 . the optical pickup, being mounted on an optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the objective lens actuator as described in the claim 5 . 10 . the optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the optical pickup as described in the claim 7 . 11 . the optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the optical pickup as described in the claim 8 . 12 . the optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the optical pickup as described in the claim 9 .	background of the invention the present invention relates to an objective lens actuator for driving an objective lens for focusing recording/reproducing light onto a recording surface of an optical disc within an optical disc apparatus, and further it relates to, in particular, an optical pickup and an optical disc apparatus comprising the same objective lens actuator therein. an optic disc apparatus, for recording information on a disc-like recording medium or reading the information recorded thereon, is able to record a relatively large amount or volume of information on a disc, and the medium is large in the rigidity thereof, so as to be handled easily; therefore, it is used widely, such as, an external recording device for a computer or a recording apparatus for video/audio, for example. in such optical disc apparatus, the objective lens actuator is an apparatus for driving the objective lens for focusing lights upon the recording surface on the optical disc into a focusing direction (i.e., the direction of approaching/receding to/from the optical disc surface) and a tracking direction (i.e., the radius direction of the disc). in the following patent document 1 , there is disclosed the objective lens actuator within the conventional optical disc apparatus. as is sown in fig. 1 and so on of the patent document 1, in general, the objective lens actuator is constructed with a moving part, including the objective lens therein, a supporting member for supporting this moving part thereon, and a magnetic circuit made up with a yoke and permanent magnets. on the moving part are attached a focusing coil and a tracking coil, and with supplying drive current through the focusing coil, the moving part is driven into the focusing direction with electro-magnetic forces, which are generated due to actions between the magnetic flux from the permanent magnets, and also in a similar manner, with supplying drive current through the tracking coil, the moving part is driven into the tracking direction with electro-magnetic forces, which are generated due to actions between the magnetic flux from the permanent magnets. [patent document 1] japanese patent laying-open no. hei 11-316962 (1999), (see, page 5 and fig. 1). brief summary of the invention with the conventional art mentioned above, the magnetic circuit has two (2) sets of magnets, with putting the objective lens therebetween, wherein since those two (2) sets of magnets are equal to each other, of the length in the focusing direction, therefore a difference is generated between the two (2) driving forces in the focusing direction, which are generated on the focusing coil due to the two (2) sets of magnets, and a moment is produced on the moving part including the objective lens therein. the moment mentioned above inclines the objective lens, and this comes to a cause of deteriorating focusing condition of a light spot. such deterioration of quality of the light spot results into signal deterioration when recording/reproducing. in particular, advancement is made on high density recording on the optical disc, in recent years, and then a laser wavelength of the recording/reproducing light comes to be short while an aperture of the objective lens comes to large. for this reason, unnecessary inclination or tilt of the objective lens, which is generated on the objective lens with respect to the optical disc, affects ill influences upon the focusing condition of the optical spot even if it is very small. accordingly, there is brought about a necessity of suppressing the unnecessary change of position and/or the inclination of the objective lens with respect to the optical disc to be small, further than in the conventional objective lens actuator. also, the moment mentioned above is a cause of reason of vibration of the moving part including the objective lens, too, in a high frequency band, on the vibration characteristics of the objective lens actuator, and disturbance of phase and/or position change due to the vibration mentioned above result into a factor of instability of the control. in particular, advancement is made on high speed recording/reproducing onto/from the optical disc, in recent years, and since it is desired to heighten or increase the frequency of control band, then the vibration mentioned above comes to an obstacle for achieving the high speed recording/reproducing, and disables to deal with the high speed recording/reproducing. an object of the present invention, accomplished by taking such the situation into the consideration thereof, is to provide an objective lens actuator for enabling to suppress unnecessary inclination and vibration of the objective lens to the optical disc. for accomplishing the object mentioned above, according to the present invention, there is provided an objective lens actuator, comprising: an objective lens for focusing a light upon a recording surface of an optical disc; and a driving means including a focusing coil, tracking coils, and a magnetic circuit, for operating said objective lens into a focusing direction of approaching/receding to/from said optical disc, and into a tracking direction of a radius of the optical disc, wherein said magnetic circuit has two (2) pieces of magnets putting said objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet. also, the object mentioned above is accomplished by the objective lens actuator, as described above, wherein said magnetic circuit has two (2) pieces of magnets putting said objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet, so that those two (2) magnets are same in values thereof. also, the object mentioned above is accomplished by the objective lens actuator, as described above, further comprising an optical part on a reverse side of said optical disc putting said objective lens therebetween, wherein a light in a direction in parallel with an optical disc surface, being incident upon said optical part and passing through said objective, is focused on the recording surface of said optical disc, and said magnetic circuit has two (2) pieces of magnets putting said objective lens therebetween, and one of the magnets is short of length in the focusing direction and is long in length in the tracking direction, comparing to the other magnet. further, the object mentioned above is accomplished by the objective lens actuator, as described above, wherein a line connecting between centers of two (2) driving forces in the focusing direction, which are generated on said focusing coils by said two (2) pieces of magnets, is in conformity with a center of gravity of a moving part, including said objective lens therein. and further, the object mentioned above is accomplished by an optical pickup, or an optical disc apparatus for reproducing information from an optical disc and for recording information onto the optical disc, comprising the objective lens actuator as described above. thus, according to the present invention, because of the structures of applying no unnecessary moment upon the moving part, including the objective lens therein, an unnecessary inclination or tilt of the objection lens to the optical disc can be suppressed to be small. for this reason, since the quality of a beam spot can be improved, therefore it is possible to conduct recording/reproducing upon an optical disc, which will be heighten in the recoding density thereof, with stability. also, because of the structures of applying no unnecessary moment upon the moving part, including the objective lens therein, it is possible to provide an objective lens actuator without unnecessary vibration in the moving part, and with applying this objective lens actuator, it is possible to provide an optical pickup, as well as, an optical disc apparatus, having preferable information recording/reproducing characteristics and enabling high-speed recording/reproducing. also, since the length of one of the magnets can be shorten in the focusing direction, it is possible to conduct recording/reproducing, preferably, due to the reason mentioned above, even if using a lower surface of the same magnet, on the opposite side to the disc side in the focusing direction. for this reason, it is possible to provide an objective lens actuator, being suitable for thin-sizing of the optical pickup and the optical disc apparatus. brief description of the several views of the drawing those and other objects, features and advantages of the present invention will become more readily apparent from the following detailed description when taken in conjunction with the accompanying drawings wherein: fig. 1 is a perspective view for showing an embodiment of an objective lens actuator, according to the present invention; figs. 2a and 2b are cross-section views of a magnetic circuit, according to the present invention, seen in the focusing direction and the tracking direction, respectively; figs. 3a and 3b are cross-section views of a magnetic circuit, according to the prior art, seen in the focusing direction and the tracking direction, respectively; fig. 4 is a view for showing other embodiment of the present invention; fig. 5 is a perspective view for showing an optical pickup, applying the objective lens actuator according to the present invention therein; and fig. 6 is a block diagram for showing an optical disc apparatus, applying the objective lens actuator according to the present invention therein. detailed description of the preferred embodiments hereinafter, embodiments according to the present invention will be fully explained by referring to the attached drawings. figs. 1 to 6 are drawings for showing the embodiment of the present invention, wherein it is assumed that an element attached with the same depicts the same, and that the fundamental structures and operations thereof are equal to each other. also, in figs. 1 to 6 , “x”-axis direction is the direction of tangential line of an optical disc not shown in the figure, i.e., the tangential direction, “y”-axis is the direction of radius of the optical disc, i.e., the tracking direction, and “z”-axis is the direction of optical axis of an objective lens, i.e., the focus direction, respectively. embodiment 1 explanation will be made on a first embodiment of the objective lens actuator, according to the present invention. fig. 1 is a perspective view for showing the outline structures of the objective lens actuator, according to the present embodiment. in fig. 1 , the objective lens actuator comprises an objective lens 1 , a lens holder 2 for holding it thereon, a support means of the lens holder 2 , and magnets disposed on the periphery the lens holder 2 . on a side surface of the lens holder 2 are attached a focusing coil 3 , tracking coils 4 a , 4 b , 4 c and 4 d at the predetermined positions thereof. the holder means of the lens holder 2 is supported by elastic supporting members 5 a , 5 b , 5 c and 5 d , each end of which is fixed on a fixed portion 6 . those elastic supporting members have conductivity, so that they play the poles of supplying current to the tracking coils 4 a to 4 d , in common. the focusing coil 3 and the tracking coils 4 a to 4 d are electrically connected with end portions of the elastic supporting members 5 a to 5 d , on the side at which they hold the lens holder, through a conductive welding material, such as, a solder, etc. on the fixed portion 6 is fixed a dumping holder, which is filled up with an elastic member, such as, a silicon gel, etc., i.e., building up the structure for supplying attenuations to the elastic supporting members 5 a to 5 d. herein, the objective lens 1 , the lens holder 2 , the focusing coil 3 and the tracking coils 4 a to 4 d are movable portions. on the periphery of the lens holder are disposed permanent magnets 11 a and 11 b and a yoke 12 , as a magnet for applying driving forces onto a group of coils. the permanent magnets 11 a and 11 b are so disposed that, in the magnetizing directions thereof, the magnetic surfaces opposing to each other in the “x”-axis direction are in the same phase. each of the magnets 11 a and 11 b is fixed by attaching it on the yoke 12 made from a yoke member of magnetic material forms a magnetic circuit, and forms a magnetic circuit. with this magnetic circuit, the objective lens actuator can move into the focusing direction and the tracking direction. figs. 2a and 2b show the structures and the arrangement of the magnets 11 a and 11 b , according to the present invention. for dealing with thin-sizing, according to the present invention, on the reverse side to the optical disc, putting the objective lens therebetween, there is provided an optical part 13 , such as, a reflection mirror or a prism or the like, for example, and a light 14 propagating from the direction in parallel with the optical disc surface (i.e., the “x”-axis direction in fig. 2 ) is incident upon the optical part 13 mentioned above, and upon the optical parts 13 it is reflected to direct to the recording surface of an optical disc 15 , vertically, and it passes through the objective lens 1 so that the light is focused on the recording surface of the optical disc 15 . the magnet 11 a in the direction, into which the light 14 is incident upon the optical part 13 , has such structures that it is shorter of the length in the focusing direction (i.e., height “h” of the magnet) and is longer of the length in the focusing direction (i.e., width “w” of the magnet), comparing to the other magnet 11 b . since the magnet 11 a in the direction, into which the light 14 is incident upon the optical part 13 , can be shorten of the length in the focusing direction, then the light 14 can passes through the reverse side against to the optical disc, in the focusing direction of the magnet 11 a , i.e., having the structures for enabling thin-sizing of the objective lens actuator. explanation will be made on effects obtainable according to the present invention, by referring to figs. 2a and 2b and 3 a and 3 b. figs. 3a and 3b show the structures of shortening the length of a magnet 21 a on the side, upon which the light 14 is incident, for dealing with the thin-sizing. in the structures shown in figs. 3a and 3b , when current is supplied into the focusing coil 3 , the driving force 32 a in the focusing direction, which is applied by the magnet 21 a provided on the side, upon which the light 14 is incident, since it is smaller in the size thereof comparing to that of the other magnet 21 b , comes to be smaller than the focusing driving force 32 b , which is applied upon the focusing coil 3 by the other magnet 21 b . because of this difference between two (2) driving forces 32 a and 32 b in the focusing direction, which is produced on the focusing coil 3 , a moment 30 is generated on the moving part, including the objective lens 1 therein. the mentioned moment 30 inclines the objective lens 1 , and comes into a reason of deterioration of focusing condition of a beam spot. such deterioration of quality of the beam spot also results into deterioration of signals when recording/reproducing. also, the moment 30 mentioned above is a factor of vibration of the moving part, including the objective lens therein, in high-frequency band, on the vibration characteristics of the objective lens actuator, and disturbances of the phase and/or change of position result into factors of instability. for this reason, it is impossible to heighten the control band, and it is difficult to deal with the high-speed recording/reproducing. on the contrary to that, according to the present invention, when current is applied into the focusing coil 3 , as is shown in fig. 2 , the driving force 31 a in the focusing direction, which is applied on the focusing coil 3 on the incident side magnet 11 a , since it is equal to in the size thereof, comparing to the other magnet 11 b , comes to be equal to the driving force 31 b in the focusing direction, which is applied upon the focusing coil 3 by the other magnet 11 b . the moment 30 is zero (0), and then no moment is generated. accordingly, with provision of the objective lens actuator according to the present invention, because of the structures of applying no unnecessary moment upon the moving part, including the objective lens 1 therein, since the unnecessary inclination or tilt of the objective lens 1 can be suppressed to be small with respect to the optical disc, and the quality of the beam spot can be improved, then it is possible to conduct the recording/reproducing onto/from the optical disc, on which further high-density recording is demanded much more, with stability. also, because of the structures of applying no unnecessary moment upon the moving part, including the objective lens 1 therein, it is possible to provide an objective lens actuator without unnecessary vibration of the moving part, an optical pickup and further an optical disc apparatus, being preferable in the characteristics of recording or reproducing of information and enabling the high-speed recording/reproducing. also, since it is possible to shorten the length of the magnet 11 a provided on the side, upon which the light 14 is incident, in the length thereof, even if using a lower surface of the same magnet on the reverse side, i.e., opposing to the side of the optical disc, in the focusing direction, preferable recording/reproducing can be made with the reasons mentioned above, and therefore it is possible to provide the objective lens actuator, being suitable for achieving thin-sizing of the optical pickup and the optical disc apparatus. in that instance, the length of the magnet 11 a provided on the side, upon which the light 14 is incident, may be shorten in the focusing direction, and lengthen in the tracking direction, so that those two (2) sets of magnets come to be equal to in the size (or volume) thereof. embodiment 2 next, other embodiment according to the present invention will be shown in fig. 4 . as is shown in fig. 4 , when difference is produced between the positions where those two (2) sets of magnets, in the focusing direction, a driving force 41 a in the focusing direction, which is applied upon the focusing coil 3 by the magnet 11 a on the incident side, acts at a driving center 42 a , while a driving force 41 b in the focusing direction, which is applied upon the focusing coil 3 by the other magnet 11 b , acts at a driving center 42 b , then a distance is generated between the positions of the two (2) driving centers 42 a and 42 b in the focusing direction. with a magnetic circuit, disposing the focusing coil 3 or the magnets 11 a and 11 b are so arranged that a center of gravity 43 of the moving part, including the objective lens 1 therein, on a line 44 connecting between the driving center 42 a and the driving center 42 b , since the distance can be made small, from the center of gravity up to the driving center where the driving force is applied onto the moving part, even if variety or fluctuation is generated in attaching of parts when assembling, then the unnecessary moment comes to be small; therefore, it is possible suppress the vibration. also, disposing a support center, which can be obtained by the elastic supporting members 5 a to 5 d , on the line 44 connecting between the driving center 42 a and the driving center 42 b , in the place of the center of gravity mentioned above, since the distance can be made small, from the support center up to the driving center where the driving force is applied onto the moving part, even if variety or fluctuation is generated in attaching of parts when assembling, then the unnecessary moment comes to be small; therefore, it is possible suppress the vibration. embodiment 3 next, explanation will be given on an embodiment of mounting the objective lens actuator 101 onto an optical pickup 111 , according to the present invention, by referring to fig. 5 . herein is shown an embodiment of applying therein the objective lens actuator 101 shown in the first embodiment mentioned above, however the optical pickup 111 can be also built up with, in the similar manner, even if applying therein the objective lens actuator shown in the other embodiment. as is shown in fig. 5 , the objective lens actuator 101 is installed within the optical pickup 111 . a light emitting from a light emitting element 102 is focused upon the recording surface of an optical disc by means of the objective lens 1 . in this manner, with applying the objective lens actuator according to the present invention, there can be obtained the optical pickup 111 suitable for high-density of data and high-speed recording/reproducing thereof, and also for small or thin-sizing of the apparatus. embodiment 4 next, explanation will be made on an embodiment of an optical disc apparatus applying the optical pickup 111 , which mounts the objective lens actuator thereon, according to the present invention, by referring to fig. 6 . herein is shown an embodiment of applying the optical pickup 111 , which is shown in the first embodiment mentioned above, however the optical disc apparatus 112 can be built up with, in the similar manner, in case of applying therein the optical pickup in the other embodiments. the optical disc apparatus 112 comprises a spindle motor 114 for rotating the optical disc 113 , the optical pickup 111 m a transfer mechanism for moving the optical pickup 111 into the radius direction of the optical disc 113 , and a controller 115 for controlling those. with the controller 115 is connected a rotation control circuit 116 of the spindle motor 114 , so that the rotation control is conducted on the optical disc 113 , which is attached on the spindle motor 114 . also, with the controller 15 is connected a transfer control circuit 117 of the optical pickup 1 , so that the transfer control is conducted for transferring the optical pickup 111 into the radius direction of the optical disc 113 . various kinds of signals 118 , which are detected by the optical pickup 111 , are sent to a servo signal detector circuit 119 and a reproduction signal detector circuit 120 , and a focus error signal and a tracking error signal are produced by the servo signal detector circuit 119 , wherein position control of the objective lens is conducted upon basis of a signal from an actuator driver circuit 121 , in addition to an instruction from the controller 115 . also, by means of the reproduction signal detector circuit, the information recorded on the optical disc 113 is reproduced. in this manner, with mounting the optical pickup 111 according to the present invention thereon, it is possible to achieve the high-performance optical disc apparatus 112 , being suitable for the high-speed recording/reproducing and high-density recording/reproducing of data. the present invention may be embodied in other specific forms without departing from the spirit or essential feature or characteristics thereof. the present embodiment(s) is/are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the forgoing description and range of equivalency of the claims are therefore to be embraces therein.
060-133-917-786-267	US	[ "CA", "US" ]	F24C15/10,F24C7/08,F24C15/20	2000-07-26T00:00:00	2000	[ "F24" ]	ceramic-based downdraft cooktop having angled front face portion	a unitary, one-piece, bent ceramic-based cooktop, mounted on a countertop or upon an appliance cabinet, includes a main plate portion, which defines various spaced heating element zones, and a face plate portion, which is integral with the main plate portion, and extends forward and downward from a frontal section of the main plate portion. the face plate portion defines a control panel having various knobs and/or switches for use in regulating the operation of heating elements of the cooktop, as well as a control device for a downdraft venting system that includes a grill provided in a generally, laterally centered portion of the main plate portion. in accordance with the most preferred form of the invention, electronic control components are utilized and openings are formed in the face plate portion to accommodate mounting of the electronic control components generally flush with the exposed surface of the face plate portion.	1. a kitchen cooking arrangement comprising: a substantially planar countertop including an upper surface and a front edge portion which extends below a plane of the upper surface; and a unitary, ceramic-based cook-top supported upon the countertop, said cooktop including: a main plate portion having a frontal section, a rear section and side edge sections, within which are defined a plurality of spaced heating element zones of said cooktop, said main plate portion extending in a first plane; and a face plate portion, integral with the main plate portion, extending forward and downward from the frontal section of the main plate portion such that the face plate portion extends in a second plane that intersects the first plane, said face plate portion defining a heating element control panel for said cooktop, wherein said main and face plate portions have respective upper surfaces, said face plate portion being bent relative to the main plate portion such that an angle in the range of 225.degree.-240.degree. is defined between the upper surface of the face plate portion and the upper surface of the main plate portion. 2. the kitchen cooking arrangement according to claim 1, wherein the cooktop has a substantially uniform thickness from the rear section of the main plate portion to the face plate portion. 3. the kitchen cooking arrangement according to claim 1, further comprising: a downdraft grill positioned atop the main body portion and outside the spaced heating element zones. 4. the kitchen cooking arrangement according to claim 1, wherein the face plate portion extends over and beyond the front edge portion of the countertop. 5. a kitchen cooking arrangement comprising: a substantially planar countertop including an upper surface and a front edge portion which extends below a plane of the upper surface; a unitary, ceramic-based cooktop supported upon the countertop, said cooktop including: a main plate portion having a frontal section, a rear section and side edge sections, within which are defined a plurality of spaced heating element zones of said cooktop, said main plate portion extending in a first plane; and a face plate portion, integral with the main plate portion, extending forward and downward from the frontal section of the main plate portion such that the face plate portion extends in a second plane that intersects the first plane, said face plate portion defining a heating element control panel for said cooktop, said main and face plate portions having respective upper surfaces, said face plate portion being bent relative to the main plate portion such that an angle in the range of 225.degree.-240.degree. is defined between the upper surface of the face plate portion and the upper surface of the main plate portion, wherein the face plate portion extends over and beyond the front edge portion of the countertop; and at least one cover extending between the face plate portion of the cooktop and the front edge portion of the countertop. 6. the kitchen cooking arrangement according to claim 5, wherein said main and face plate portions have respective upper surfaces, said face plate portion being bent relative to the main plate portion such that an angle is defined between the upper surface of the face plate portion and the upper surface of the main plate portion. 7. the kitchen cooking arrangement according to claim 6, wherein the angle is in the range of 225.degree.-240.degree.. 8. a unitary, ceramic-based cooktop comprising: a main plate portion having a frontal section, a rear section and side edge sections, within which are defined a plurality of spaced heating element zones of said cooktop, said main plate portion extending in a first plane; and a face plate portion, integral with the main plate portion, extending forward and downward from the frontal section of the main plate portion such that the face plate portion extends in a second plane that intersects the first plane, said face plate portion defining a heating element control panel for said cooktop, wherein said main and face plate portions have respective upper surfaces, said face plate portion being bent relative to the main plate portion such that an angle in the range of 225.degree.-240.degree. is defined between the upper surface of the face plate portion and the upper surface of the main plate portion. 9. the ceramic-based cooktop according to claim 8, wherein the cooktop has a substantially uniform thickness from the rear section of the main plate portion to the face plate portion. 10. the ceramic-based cooktop according to claim 8, further comprising: a downdraft grill positioned atop the main body portion and outside the spaced heating element zones. 11. the ceramic-based cooktop according to claim 8, further comprising: a plurality of electronic control elements mounted along the face plate portion. 12. the ceramic-based cooktop according to claim 11, wherein the electronic control elements include a digital display for each of the spaced heating element zones.	background of the invention 1. field of the invention the present invention pertains to the art of cooking and, more particularly, to a ceramic-based cooktop including a main plate portion extending in a substantially horizontal plane and a face plate portion which projects forward and downward from a frontal section of the main plate portion, with the face plate portion defining a control panel for regulating the activation state of various heating elements arranged on the main plate portion. 2. discussion of the prior art both gas and electric cooking appliances are widely available in today's marketplace. the cooktops associated with electric cooking arrangements employ either coiled, electric resistance burner elements which project slightly above the upper surface of the associated cooktop, or smooth cooktops. smooth cooktops are formed of glass or ceramic-based, i.e., ceramic and glass-ceramic, materials. due to material characteristic limitations, care must be taken when forming a ceramic-based cooktop as the material can be subject to cracking and the like when stressed. this potential problem is of particular concern given that the ceramic-based cooktop must be free to flex during use. for at least these reasons, a ceramic-based cooktop will almost invariably be made as a plate extending in a single plane and without any openings. however, it has been proposed, as disclosed in u.s. pat. no. 5,357,079, to create a bend at a rear section of a cooktop. although controls for various heating elements are arranged adjacent to the bent zone of the cooktop, the controls are actually supported by a frame upon which the cooktop is supported. the upper surface of a ceramic-based cooktop is generally provided with a grid pattern to diminish the inherent transparent nature of the material. in the '079 patented arrangement, small transparent regions are maintained to provide visual clarity of illuminated displays mounted below the cooktop. in order to enhance the use and versatility of ceramic-based cooktops, it would be desirable to enable heating element control devices to be mounted to the cooktop. however, mounting of the control devices from the upper planar surface is not considered most desirable from a ergodynamic standpoint. therefore, it is considered desirable to provide a ceramic-based cooktop with a front, angled portion at which are mounted readily available operator controls. summary of the invention the present invention is directed to a unitary, ceramic-based cooktop, adapted to be mounted on a countertop or upon an appliance cabinet, having an angled front portion. more specifically, the cooktop is formed as a one-piece member including a main plate portion, which defines varies spaced heating element zones, and a face plate portion which is integral with the main plate portion and extends forward and downward from a frontal section of the main plate portion. therefore, the main and face plate portion extend in respective, intersecting planes. the face plate portion defines a control panel having various knobs and/or switches for use in regulating the operation of heating elements of the cooktop. the cooktop also preferably incorporates a downdraft venting system including a grill provided in a generally, laterally centered portion of the main plate portion, with the face plate portion also including suitable controls for the downdraft venting system. in accordance with the most preferred form of the invention, electronic control components are utilized and openings are formed in the face plate portion to accommodate mounting of the electronic control components. most preferably, the electronic control components are generally flush with an exposed surface of the face plate portion to avoid the components being any type of obstruction during use of the cooktop. additional objects, features and advantages of the invention will become more fully apparent below from the following description of a preferred embodiment of the invention when taken in conjunction with the drawings wherein like reference numerals refer to corresponding parts in the several views. brief description of the drawings fig. 1 is a perspective view of a ceramic-based cooktop having an angled front face portion constructed in accordance with the invention mounted upon a countertop; and fig. 2 is a side elevational view of the cooktop of fig. 1. detailed description of the preferred embodiment with reference to both figs. 1 and 2, a kitchen cooking arrangement, generally indicated at 2, includes a countertop 5 having an upper surface 7 which extends in a generally horizontal plane and a front edge portion 10 which is depicted to be generally perpendicular to upper surface 7. below countertop 5 is illustrated to be cabinetry 12. at this point, it should be noted that countertop 5 could be positioned against a wall within a kitchen or can form part of an island. kitchen cooking arrangement 2 also incorporates a cooktop 15 that includes a main plate portion 18 which is secured upon upper surface 7 of countertop 5. main plate portion 18 is generally defined by a frontal section 21, a rear section 22 and side edge sections 23 and 24. main plate portion 18 has an upper surface 27 which defines various spaced heating element zones 30-34, with heating element zone 30 being concentrically arranged within heating element zone 31. as shown, in the most preferred embodiment, upper surface 27 constitutes a smooth top-type cooking surface. more specifically, cooktop 15 is made from a ceramic-based material. by referring to cooktop 15 as being made from a ceramic-based material, it is intended to cover various materials including ceramic, glass-ceramic and like materials. although cooktop 15 preferably includes a smooth cooking surface, heating element zones 30-34 could be defined by coiled resistance-type heating elements or even gas burners extending above upper surface 27. however, a smooth cooking surface is provided in accordance with the preferred invention. also provided in accordance with the most preferred form of the invention is a downdraft venting arrangement including a grill 36 which, as shown, extends fore-to-aft from frontal section 21 to rear section 22 in a central portion of upper surface 27. cooktop 15 also includes a face plate portion 38 that defines a heating element control panel. face plate portion 38 includes an exposed surface 41 and is formed integral with main plate portion 18 such that the overall cooktop 15 defines a unitary, one-piece and integrally formed member. as clearly shown in these figures, face plate portion 38 extends downwardly and forwardly from main plate portion 18. in a preferred embodiment, cooktop 15 is positioned upon countertop 5 with face plate portion 38 projecting beyond front edge portion 10. in the most preferred form of the invention, face plate portion 38 is angled downwardly from main plate portion 18 in a range of about 45.degree.-60.degree.. that is, main plate portion 18 extends in a first plane which is substantially horizontal and face plate portion 38 extends in a second plane which intersects the first plane of main plate portion 18. in the most preferred form of the invention, these planes intersect at a 60.degree. angle. in other words, exposed surface 41 of face plate portion 38 is preferably located at an obtuse angle in the range of 225.degree.-240.degree., most preferably 240.degree., from upper surface 27 of main plate portion 18. with face plate portion 38 extending at an angle to the horizontal and projecting forward of front edge portion 10 of countertop 5, face plate portion 38 can be advantageously utilized as a control panel for the heating elements in zones 30-34. in the most preferred form of the invention, face plate portion 38 is formed with various openings (not separately labeled) which receive electronic control element arrays generally indicated at 45-50. electronic control element array 45 includes an illumination display 55 which preferably constitutes a single, eight-segment led, a main on/off button 57, a heating element regulating switch 59, a heating element zone indicator 61 and a secondary on/off button 63. in accordance with the embodiment shown, main on/off button 57 directly controls the activation of heating element zone 30. more specifically, depressing on/off button 57 a single time will activate the heating element associated with zone 30 and pressing on/off button a second time will de-activate the heating element associated with zone 30. zone indicator 61 preferably provides a reference to the user that electronic control element array 45 pertains to heating element zones 30 and 31. that is, zone indicator 61 takes the form of a box representative of main plate portion 18, with the box including spaced individual circles representing the various heating element zones 30-34. in the most preferred embodiment, zone indicator 61 has simply darkened in the upper leftmost circular area to bring the user's attention to the fact that electronic control element array 45 controls zones 30 and 31. it is also possible in accordance with the present invention to illuminate the particular zone represented area in zone indicator 61, such as with a red diode, to indicate when a heating element zone 30, 31 is activated. such a diode can be connected to a temperature sensor to remain lit even after the heating element zone 30, 31 is deactivated, with the light being extinguished when the temperature extends below a level at which it is safe to touch that portion of upper surface 27 of cooktop 15. button 63 controls the activation of the heating element associated with zone 31 in a manner analogous to the operation of button 57. at this point, it should be understood that zone 31 can be activated through button 63 either only following the placement of button 57 in an on condition or button 63 can actually be used to simultaneously activate zones 30 and 31. in any event, it is desired to only permit activation of zone 31 concurrently with zone 30. electronic control element arrays 46, 49 and 50 are essentially identically constructed to that of electronic control element array 45, except that control element arrays 46, 49 and 50 lack a corresponding control button 63 and a different portion of zone indicator 61 is highlighted. since these various control element arrays 46, 49 and 50 are structured and function in a corresponding manner, the description thereof will not be duplicated here. electronic control element array 47 includes a corresponding display 66 which provides a visual indication for the exhaust speed level for the downdraft system associated with grill 36. therefore, display 66 indicates the fan speed level; power to the downdraft system is controlled by on/off button 67; and the level of operation of downdraft system is controlled by regulating switch 69. electronic control element array 48 is provided to establish a timer control in connection with cooktop 15. therefore, control element array 48 includes a timer on/off button 72, a multi-digit display 73 and a timer regulator switch 75 which can be used to toggle up and down the display. although not shown, this overall timer arrangement would be linked to an audible signalling device. in fact, all of the electronic control element arrays 45-50 are linked to a main controller (not shown) used for regulating the operation of cooktop 15. since the use of such a controller is considered well within one of ordinary skill in the art, details thereof are not provided here. based on the above, it should be readily apparent that the cooktop 15 of the present invention provides for an enhanced control panel arrangement for a user while maintaining the integrity of the overall cooktop. that is, face plate portion 38 supports the control components necessary to operate cooktop 15 in more conveniently located positions versus the more conventional arrangement wherein separate knobs would be provided upon countertop 5 adjacent cooktop 15. of course, it should be realized that, although electronic control element arrays 45-50 are utilized in accordance with the preferred embodiment, other types of control elements, including rotary knobs or the like, could also be employed. the extension of face plate portion 38 beyond front edge portion 10 of countertop 5 enables cooktop 15 to be readily utilized in connection with countertops positioned against a wall and also kitchen island arrangements, while providing an advantageous clearance for the routing of wires or the like. in the preferred form of the invention, one or more covers, such as wire cover 80, is provided for containment and aesthetic purposes. of course, the style and materials used in connection with cover 80 can vary in accordance with the invention. in the most preferred form, cover 80 actually extends across cooktop 15 behind face plate portion 38 to further block access to the electronic control components and associated wiring. given the positioning of the face plate portion 38, electronic control array elements 45-50 are generally isolated from the main flexing of main plate portion 18 during operation of cooktop 15 and it has been found that this construction enables face plate portion 38 to be formed with multiple apertures which will not result in fatigue failure. due to the unitary construction, cleaning of both surfaces 27 and 41 can be readily performed. in any event, although the invention has been described with respect to a preferred embodiment, it should be recognized that various changes and/or modifications can be made without departing from the spirit of the invention. instead, the invention is only intended to be limited by the scope of the following claims.
061-492-620-126-373	JP	[ "JP", "KR", "US" ]	H01L29/786,H01L21/28,H01L21/8234,H01L21/8242,H01L27/06,H01L27/088,H01L27/108,H01L29/41,H01L29/417,H01L21/336,H01L21/8239,H01L27/105,H01L27/11551,H01L27/1156,H01L29/788,H01L29/792,H01L27/12,H10B12/00,H10B41/70,H01L29/66,H01L29/12,H01L21/31,H01L21/8244,H01L21/8247,H01L27/11,H01L27/115,H01L27/08,H01L27/11556	2011-10-13T00:00:00	2011	[ "H01", "H10" ]	semiconductor device	a transistor with a fine structure is provided with good yield. in addition, provided is a semiconductor device capable of high-speed response and high-speed driving by improving the on-state characteristics of the transistor. an oxide semiconductor layer, a gate insulating layer, a gate electrode layer, an insulating layer, a conductive film, and an interlayer insulating layer are sequentially stacked, and the conductive film is cut, so that the conductive film on the gate electrode layer and the insulating layer are removed, so as to form an electrode layer having a source electrode layer and a drain electrode layer formed in self-alignment, overlapping with a region in contact with the source electrode layer and the drain electrode layer and being in contact with the oxide semiconductor layer.	1. a method for manufacturing a semiconductor device comprising the steps of: forming a first electrode layer and a second electrode layer; forming an oxide semiconductor layer over the first electrode layer and the second electrode layer; forming a gate insulating layer over the oxide semiconductor layer; forming a gate electrode layer and a first insulating layer over the gate insulating layer to overlap with the oxide semiconductor layer; introducing an impurity element into the oxide semiconductor layer using the gate electrode layer and the first insulating layer as masks so that a first region, a second region and a channel formation region between the first region and the second region are formed; forming a second insulating layer over the first insulating layer to cover side surfaces of the gate electrode layer; forming a conductive film over the oxide semiconductor layer, the gate electrode layer, the second insulating layer, and the first insulating layer; forming a first insulating film over the conductive film; forming a source electrode layer, a drain electrode layer, and a third insulating layer by removing parts of the first insulating film and the conductive film by a chemical mechanical polishing method until the first insulating layer is exposed so that the conductive film is divided; and forming a fourth insulating layer over the first insulating layer, the second insulating layer, the source electrode layer, the drain electrode layer, and the third insulating layer. 2. the method according to claim 1 , wherein the third insulating layer comprises an aluminum oxide layer in contact with the source electrode layer and the drain electrode layer. 3. the method according to claim 1 , wherein a resistance of the first region and a resistance of the second region are lower than a resistance of the channel formation region. 4. the method according to claim 1 , wherein the fourth insulating layer comprises at least one of silicon oxide, silicon oxynitride, aluminum oxide, aluminum oxynitride, silicon nitride, aluminum nitride, silicon nitride oxide, and aluminum nitride oxide. 5. the method according to claim 1 , wherein the impurity element comprises phosphorus, and wherein an acceleration voltage for introducing the impurity element is 0.5 kv to 80 kv. 6. the method according to claim 1 further comprising: forming a first wiring layer electrically connected to the first region through a first opening and a second wiring layer electrically connected to the second region through a second opening, wherein the first opening and the second opening are formed in the third insulating layer and the fourth insulating layer, wherein the first wiring layer overlaps with the first electrode layer, and wherein the second wiring layer overlaps with the second electrode layer. 7. the method according to claim 6 , wherein the first wiring layer is electrically connected to the first region through the source electrode layer, and wherein the second wiring layer is electrically connected to the second region through the drain electrode layer. 8. the method according to claim 1 , wherein the impurity element is one selected from the group consisting of phosphorus, boron, nitrogen, arsenic, argon, and aluminum. 9. the method according to claim 8 , wherein a dosage of the impurity element is 1×10 13 ions/cm 2 to 5×10 16 ions/cm 2 . 10. a method for manufacturing a semiconductor device comprising the steps of: forming a first electrode layer and a second electrode layer; forming an oxide semiconductor layer over the first electrode layer and the second electrode layer; forming a gate insulating layer over the oxide semiconductor layer; forming a gate electrode layer over the gate insulating layer to overlap with the oxide semiconductor layer; introducing an impurity element into the oxide semiconductor layer using the gate electrode layer as a mask so that a first region, a second region and a channel formation region between the first region and the second region are formed; forming a first insulating layer over the gate electrode layer to cover side surfaces of the gate electrode layer; forming a source electrode layer over a part of the first region and on a side surface of the first insulating layer, and a drain electrode layer over a part of the second region and on another side surface of the first insulating layer; forming a second insulating layer over the first insulating layer, the source electrode layer, and the drain electrode layer; and forming a first wiring layer electrically connected to the first region through a first opening and a second wiring layer electrically connected to the second region through a second opening, wherein the first opening and the second opening are formed in the second insulating laver, wherein the first wiring layer overlaps with the first electrode layer, and wherein the second wiring layer overlaps with the second electrode layer. 11. the method according to claim 10 , wherein the first wiring layer is electrically connected to the first region through the source electrode layer, and wherein the second wiring layer is electrically connected to the second region through the drain electrode layer. 12. the method according to claim 10 , wherein a resistance of the first region and a resistance of the second region are lower than a resistance of the channel formation region. 13. the method according to claim 10 , wherein the second insulating layer comprises at least one of silicon oxide, silicon oxynitride, aluminum oxide, aluminum oxynitride, silicon nitride, aluminum nitride, silicon nitride oxide, and aluminum nitride oxide. 14. the method according to claim 10 , wherein the impurity element comprises phosphorus, and wherein an acceleration voltage for introducing the impurity element is 0.5 kv to 80 kv. 15. the method according to claim 10 , wherein the impurity element is one selected from the group consisting of phosphorus, boron, nitrogen, arsenic, argon, and aluminum. 16. the method according to claim 15 , wherein a dosage of the impurity element is 1×10 13 ions/cm 2 to 5×10 16 ions/cm 2 . 17. a method for manufacturing a semiconductor device comprising the steps of: forming a first electrode layer and a second electrode layer; forming an oxide semiconductor layer over the first electrode layer and the second electrode layer; forming a gate insulating layer over the oxide semiconductor layer; forming a gate electrode layer and a first insulating layer over the gate insulating layer to overlap with the oxide semiconductor layer; forming a second insulating layer over the first insulating layer to cover side surfaces of the gate electrode layer; forming a conductive film over the oxide semiconductor layer, the gate electrode layer, the second insulating layer, and the first insulating layer; forming a first insulating film over the conductive film; forming a source electrode layer, a drain electrode layer, and a third insulating layer by removing parts of the first insulating film and the conductive film by a chemical mechanical polishing method until the first insulating layer is exposed so that the conductive film is divided; and forming a fourth insulating layer over the first insulating layer, the second insulating layer, the source electrode layer, the drain electrode layer, and the third insulating layer. 18. the method according to claim 17 , wherein the third insulating layer comprises an aluminum oxide layer in contact with the source electrode layer and the drain electrode layer. 19. the method according to claim 17 further comprising: forming a first wiring layer electrically connected to the oxide semiconductor layer through a first opening and a second wiring layer electrically connected to the oxide semiconductor layer through a second opening, wherein the first opening and the second opening are formed in the third insulating layer and the fourth insulating layer, wherein the first wiring layer overlaps with the first electrode layer, and wherein the second wiring layer overlaps with the second electrode layer. 20. the method according to claim 17 , wherein the fourth insulating layer comprises at least one of silicon oxide, silicon oxynitride, aluminum oxide, aluminum oxynitride, silicon nitride, aluminum nitride, silicon nitride oxide, and aluminum nitride oxide.	background of the invention 1. field of the invention one embodiment of the present invention relates to a semiconductor device and a method for manufacturing the semiconductor device. 2. description of the related art attention has been focused on a technique for forming a transistor using a thin semiconductor film formed over a substrate having an insulating surface (also referred to as a thin film transistor (tft)). for example, a transistor whose active layer includes an amorphous oxide including indium (in), gallium (ga), and zinc (zn) is disclosed (see patent document 1). reference patent document [patent document 1] japanese published patent application no. 2006-165528 summary of the invention it is necessary to miniaturize the transistor in order to achieve high-speed operation, low power consumption, or high integration of the transistor. however, as the transistor is miniaturized, concern about a decrease in yield of a manufacturing process rises. therefore, an object is to provide a miniaturized transistor with high yield. further, an improvement in on-state characteristics of a miniaturized transistor is required with an improvement in performance of a semiconductor device including the transistor. therefore, another object is to provide a structure of a miniaturized transistor which is capable of high-speed response and high-speed operation and a method for manufacturing the transistor. summary of the invention in a semiconductor device of one embodiment of the present invention, a conductive film and an interlayer insulating layer are stacked in this order over an oxide semiconductor layer, a gate insulating layer over the oxide semiconductor layer, a gate electrode layer over the gate insulating layer, and an insulating layer over the gate electrode layer. a source electrode layer and a drain electrode layer are formed in a self-aligned manner by cutting the conductive film so that the conductive film over the gate electrode layer and the insulating layer is removed and the conductive film is divided. the oxide semiconductor layer includes low-resistance regions whose resistance is lowered by introduction of an impurity element and a channel formation region. the oxide semiconductor layer is in contact with the source electrode layer and the drain electrode layer in the low-resistance regions. an electrode layer formed using metal, a conductive metal compound, a semiconductor, or the like is provided under and in contact with the low-resistance regions. precise processing can be performed accurately because an etching step using a resist mask is not performed in a step for forming the source electrode layer and the drain electrode layer. consequently, in a process for manufacturing the semiconductor device, the transistor having a miniaturized structure with less variation in shape or characteristics can be manufactured with high yield. the low-resistance regions of the oxide semiconductor layer are in contact with the source electrode layer and the drain electrode layer, and function as a source region and a drain region. accordingly, the contact resistance between the oxide semiconductor layer and each of the source and drain electrode layers is reduced. when electrode layers are provided under and in contact with the low-resistance regions, the electrode layers also function as a source region and a drain region; thus, the thickness of the source region and the drain region can be increased. when the thickness of the source region and the drain region are increased, the resistances of the source region and the drain region are reduced and electric fields in the source electrode layer and the drain electrode layer are relaxed; consequently, a semiconductor device which has excellent on-state characteristics can be provided. in view of the above, one embodiment of the present invention is a semiconductor device including a pair of electrode layers; an oxide semiconductor layer which is over the pair of electrode layers and includes a pair of low-resistance regions in contact with the pair of electrode layers and a channel formation region sandwiched between the pair of low-resistance regions; a gate insulating layer over the oxide semiconductor layer; a gate electrode layer which is over the gate insulating layer and overlaps with the channel formation region; an upper insulating layer over the gate electrode layer; sidewall insulating layers covering side surfaces of the gate electrode layer and side surfaces of the upper insulating layer; a source electrode layer and a drain electrode layer in contact with the oxide semiconductor layer, side surfaces of the gate insulating layer, and side surfaces of the sidewall insulating layer; a first insulating layer over the source electrode layer and the drain electrode layer; a second insulating layer over the upper insulating layer, the sidewall insulating layers, the source electrode layer, and the drain electrode layer; and a pair of wiring layers in contact with the source electrode layer and the drain electrode layer through openings provided in the first insulating layer and the second insulating layer. the heights of top surfaces of the source electrode layer and the drain electrode layer are lower than the heights of top surfaces of the upper insulating layer, the sidewall insulating layers, and the first insulating layer, and higher than the height of a top surface of the gate electrode layer. the pair of wiring layers overlaps with the pair of electrode layers. further, in the semiconductor device, the electrode layers are provided in or over the base insulating layer under the oxide semiconductor layer, and top surfaces of the electrode layers are exposed from the base insulating layer or each have the same height as a top surface of the base insulating layer and a top surface of the electrode layer. in that case, the thickness of the electrode layers can be greater than the thickness of the oxide semiconductor layer, so that the source region and the drain region can be thicker. alternatively, the electrode layers may be formed over the base insulating layer so that the oxide semiconductor layer is formed over the electrode layers. the number of steps for forming the semiconductor device can be reduced in that case. further, the first insulating layer preferably includes an aluminum oxide layer in contact with the source electrode layer and the drain electrode layer. further, a surface on which the channel formation region is to be formed preferably has planarity. another embodiment of the present invention is a method for manufacturing a semiconductor device including the following steps: forming a pair of electrode layers; forming an oxide semiconductor layer over the pair of electrode layers; forming a gate insulating layer over the oxide semiconductor layer; forming a gate electrode layer and an upper insulating layer over the gate insulating layer to overlap with the oxide semiconductor layer; introducing an impurity element into the oxide semiconductor layer using the gate electrode layer and the upper insulating layer as masks so that a pair of low-resistance regions and a channel formation region are formed in a self-aligned manner; forming sidewall insulating layers over the gate insulating layer to cover side surfaces of the gate electrode layer; forming a conductive film over the oxide semiconductor layer, the gate electrode layer, the sidewall insulating layers, and the upper insulating layer; forming an interlayer insulating layer over the conductive film; forming a source electrode layer and a drain electrode layer by removing the interlayer insulating layer and the conductive film by a chemical mechanical polishing method until the upper insulating layer is exposed so that the conductive film is divided; and forming a second insulating layer over the first insulating layer, the upper insulating layer, the source electrode layer, and the drain electrode layer. further, openings reaching the source electrode layer and the drain electrode layer may be formed in the first insulating layer and the second insulating layer, and wiring layers in contact with the source electrode layer and the drain electrode layer through the openings may be formed. note that in this specification and the like, the term such as “over” does not necessarily mean that a component is placed “directly on” another component. for example, the expression “a gate electrode layer over an insulating layer” does not exclude the case where there is an additional component between the insulating layer and the gate electrode layer. the same applies to the term “under”. in this specification and the like, the term “electrode layer” or “wiring layer” does not limit the function of components. for example, an “electrode layer” can be used as part of a “wiring layer”, and the “wiring layer” can be used as part of the “electrode layer”. in addition, the term “electrode layer” or “wiring layer” can also mean a combination of a plurality of “electrode layers” and “wiring layers”, for example. functions of a “source” and a “drain” are sometimes replaced with each other when a transistor of opposite polarity is used or when the direction of current flowing is changed in circuit operation, for example. therefore, the terms “source” and “drain” can be replaced with each other in this specification. note that in this specification and the like, the term “electrically connected” includes the case where components are connected through an object having any electric function. there is no particular limitation on an object having any electric function as long as electric signals can be transmitted and received between components that are connected through the object. examples of an “object having any electric function” include an electrode and a wiring. one embodiment of the present invention can provide a miniaturized transistor with high yield. further, another embodiment of the present invention can provide a structure of a miniaturized transistor which has high on-state characteristics and which is capable of high-speed response and high-speed operation and a method for manufacturing the transistor. brief description of the drawings figs. 1a and 1b are a top view and a cross-sectional view, respectively, illustrating a semiconductor device of one embodiment of the present invention. figs. 2a to 2d illustrate a method for manufacturing a semiconductor device of one embodiment of the present invention. figs. 3a to 3d illustrate a method for manufacturing a semiconductor device of one embodiment of the present invention. figs. 4a to 4d illustrate a method for manufacturing a semiconductor device of one embodiment of the present invention. figs. 5a and 5b are cross-sectional views each illustrating a semiconductor device of one embodiment of the present invention. figs. 6a and 6b are a top view and a cross-sectional view, respectively, illustrating a semiconductor device of one embodiment of the present invention. fig. 7 is a cross-sectional view illustrating a semiconductor device of one embodiment of the present invention. figs. 8a to 8c are a cross-sectional view, a top view, and a circuit diagram illustrating one embodiment of a semiconductor device; figs. 9a and 9b are a top view and a cross-sectional view, respectively, illustrating one embodiment of a semiconductor device. figs. 10a and 10b are a circuit diagram and a perspective view, respectively, illustrating one embodiment of a semiconductor device. fig. 11 is a cross-sectional view illustrating one embodiment of a semiconductor device. figs. 12a and 12b are a top view and a cross-sectional view, respectively, illustrating one embodiment of a semiconductor device. figs. 13a and 13b are a top view and a cross-sectional view, respectively, illustrating one embodiment of a semiconductor device. figs. 14a and 14b are circuit diagrams each illustrating one embodiment of a semiconductor device. fig. 15 is a block diagram illustrating one embodiment of a semiconductor device. fig. 16 is a block diagram illustrating one embodiment of a semiconductor device. fig. 17 is a block diagram illustrating one embodiment of a semiconductor device. detailed description of the invention hereinafter, embodiments of the present invention are described in detail with reference to the accompanying drawings. however, the present invention is not limited to the description below, and it is easily understood by those skilled in the art that modes and details thereof can be modified in various ways. therefore, the present invention is not construed as being limited to description of the embodiments. in embodiments hereinafter described, the same parts are denoted with the same reference numerals throughout the drawings. the thickness, width, relative relation of position, and the like of a layer, a region, or the like illustrated in the drawings are exaggerated for clarification of description of the embodiments in some cases. (embodiment 1) in this embodiment, a basic structure and a basic method for manufacturing a semiconductor device of one embodiment of the present invention are described with reference to drawings. figs. 1a and 1b illustrate a semiconductor device of one embodiment of the present invention. fig. 1a is a top view of a transistor which is one embodiment of the present invention, and fig. 1b is a cross-sectional view taken along dashed-dotted line a 1 -a 2 in fig. 1a . a semiconductor device including a transistor 420 includes, over a substrate 400 , a base insulating layer 436 ; electrode layers 405 a and 405 b which are formed in the base insulating layer 436 and top surfaces of which are exposed from the base insulating layer 436 ; an oxide semiconductor layer 409 including low-resistance regions 404 a and 404 b which are in contact with the electrode layers 405 a and 405 b , respectively, and a channel formation region 403 sandwiched by the low-resistance regions 404 a and 404 b ; a gate insulating layer 402 over the oxide semiconductor layer 409 ; a gate electrode layer 401 over the gate insulating layer 402 ; sidewall insulating layers 412 a and 412 b which cover side surfaces of the gate electrode layer 401 ; an upper insulating layer 413 covering a top surface of the gate electrode layer 401 ; a source electrode layer 406 a and a drain electrode layer 406 b which are over the base insulating layer 436 and the oxide semiconductor layer 409 and which are in contact with a side surface of the sidewall insulating layer 412 a and a side surface of the sidewall insulating layer 412 b ; an insulating layer 415 over the source electrode layer 406 a and the drain electrode layer 406 b ; an insulating layer 417 over the insulating layer 415 , the source electrode layer 406 a , the drain electrode layer 406 b , the sidewall insulating layers 412 a and 412 b , and the upper insulating layer 413 ; and wiring layers 465 a and 465 b which are in contact with the source electrode layer 406 a and the drain electrode layer 406 b , respectively, through openings provided in the insulating layer 415 and the insulating layer 417 . the height of a top surface of the insulating layer 415 is substantially the same as the height of top surfaces of the sidewall insulating layer 412 a , the sidewall insulating layer 412 b , and the upper insulating layer 413 . the heights of top surfaces of the source electrode layer 406 a and the drain electrode layer 406 b are lower than the heights of top surfaces of the insulating layer 415 , the sidewall insulating layer 412 a , and the sidewall insulating layer 412 b , and are higher than the height of a top surface of the gate electrode layer 401 . note that “a height of a top surface” here means a distance from a top surface of the substrate 400 . the oxide semiconductor layer 409 includes the channel formation region 403 with which the gate electrode layer 401 overlaps, and the low-resistance region 404 a and the low-resistance region 404 b in each of which resistance is reduced by introduction of an impurity element. the low-resistance regions 404 a and 404 b are formed in a self-aligned manner by introducing an impurity element into the oxide semiconductor layer 409 using the gate electrode layer 401 as a mask. further, the source electrode layer 406 a and the drain electrode layer 406 b are provided in contact with the sidewall insulating layers 412 a and 412 b , respectively, and are provided in contact with a top surface of the oxide semiconductor layer 409 . accordingly, the distance (minimum distance) between the gate electrode layer 401 and a region (contact region) in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b corresponds to a width of the sidewall insulating layer 412 a or 412 b in the channel length direction, whereby the miniaturization can be achieved and variation in the minimum distance in the manufacturing process can be suppressed. the low-resistance region 404 a and the low-resistance region 404 b of the oxide semiconductor layer 409 are in contact with the source electrode layer 406 a and the drain electrode layer 406 b , respectively, and function as a source region and a drain region of the transistor 420 , respectively. the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a in the low-resistance region 404 a , and is in contact with the drain electrode layer 406 b in the low-resistance region 404 b . thus, the contact resistance between the oxide semiconductor layer 409 and each of the source electrode layer 406 a and the drain electrode layer 406 b is reduced. the low-resistance regions 404 a and 404 b are in contact with the electrode layers 405 a and 405 b , respectively, which are embedded in the base insulating layer 436 . the electrode layers 405 a and 405 b are formed using metal, a conductive metal compound, a semiconductor, or the like. the low-resistance regions 404 a and 404 b function as a source region and a drain region of the transistor 420 . the electrode layers 405 a and 405 b are provided under the source region and the drain region, so that the source region and the drain region can be thicker, the resistances of the source region and the drain region can be reduced, and the on-state characteristics of the transistor can be improved. since the electrode layers 405 a and 405 b are embedded in the base insulating layer, the coverage with the oxide semiconductor layer 409 provided over the electrode layers 405 a and 405 b is not affected even when the electrode layers 405 a and 405 b are formed thick. thus, the electrode layers 405 a and 405 b can be thick enough so that the resistances of the source region and the drain region of the transistor 420 are sufficiently reduced. further, the channel formation region 403 can be formed thin, and only the source region and the drain region can be formed thick because an electrode layer is not provided under the channel formation region 403 . next, an example of a method for manufacturing the transistor 420 illustrated in figs. 1a and 1b is described with reference to figs. 2a to 2d , figs. 3a to 3d , figs. 4a to 4d , and figs. 5a and 5b . first, a conductive film to be the electrode layers 405 a and 405 b is formed over the substrate 400 . a resist mask is formed over the conductive film, and the conductive film is selectively etched to form the electrode layers 405 a and 405 b . after that, the resist mask is removed. there is no particular limitation on a substrate that can be used as long as it has heat resistance high enough to withstand heat treatment performed later. for example, a glass substrate of barium borosilicate glass, aluminoborosilicate glass, or the like, a ceramic substrate, a quartz substrate, or a sapphire substrate can be used. further, a single crystal semiconductor substrate or a polycrystalline semiconductor substrate which is made of silicon, silicon carbide, or the like, a compound semiconductor substrate made of silicon germanium, or the like, an soi substrate, any of these substrates over which a semiconductor element is provided, or the like can be used. a conductive film to be the electrode layers 405 a and 405 b is formed using a material having heat resistance enough to withstand heat treatment performed later by a cvd method or a sputtering method to have a thickness of greater than or equal to 10 nm and smaller than or equal to 500 nm. for example, a metal film containing an element selected from al, cr, cu, ta, ti, mo, and w, or a metal nitride film containing any of the above elements as a component (a titanium nitride film, a molybdenum nitride film, a tungsten nitride film, or a tantalum nitride film) can be used. further, a stacked-layer structure in which a metal film of al, cu, or the like and a metal film of ti, mo, w, or the like which has a high melting point are stacked may be employed. note that the metal film of ti, mo, w, or the like which has a high melting point may be provided under and/or over the metal film of al, cu, or the like. further, the conductive film may be formed using an oxide semiconductor material. as the oxide semiconductor, indium oxide (in 2 o 3 ), tin oxide (sno 2 ), zinc oxide (zno), indium oxide-tin oxide (in 2 o 3 —sno 2 ), indium oxide-zinc oxide (in 2 o 3 —zno), or any of these metal oxide materials in which silicon oxide is contained can be used. in the case where the conductive film is formed using an oxide semiconductor, an oxide semiconductor material which is the same as or different from that used for the oxide semiconductor layer 409 may be used. in particular, when the conductive film and the oxide semiconductor layer 409 are formed using the same oxide semiconductor material, the contact resistance between the oxide semiconductor layer 409 and each of the electrode layers 405 a and 405 b can be further reduced, and thus, a transistor with favorable electrical characteristics can be manufactured. for example, when an in—ga—zn based oxide (also referred to as igzo) is used as the oxide semiconductor material, the igzo is preferably also used for the electrode layers 405 a and 405 b. in this embodiment, a 30-nm-thick igzo film with an atomic ratio of in to ga and zn of 1:1:1 is formed by a sputtering method as the conductive film, and then etched using a resist mask to form the electrode layers 405 a and 405 b. next, a base insulating film 435 is formed to cover the substrate 400 and the electrode layers 405 a and 405 b (see fig. 2a ). the base insulating film 435 can be formed by a sputtering method, an mbe method, a cvd method, a pulsed laser deposition method, an ald method, or the like as appropriate. when the base insulating film 435 is formed by a sputtering method, an impurity element such as hydrogen can be reduced. as the base insulating film 435 , an oxide insulating layer formed using silicon oxide, gallium oxide, aluminum oxide, silicon oxynitride, silicon nitride oxide, hafnium oxide, tantalum oxide, or the like is preferably used. further, the base insulating film 435 can be formed with a single-layer structure or a stacked-layer structure including two or more layers with the use of these compounds. in the case of a stacked-layer structure, for example, it is possible to use a silicon oxide film formed by a cvd method as a base insulating layer which is in contact with a substrate and a silicon oxide film formed by a sputtering method as a base insulating layer which is in contact with the oxide semiconductor layer 409 . an oxide insulating layer in which the concentration of hydrogen is reduced is used as the insulating layer which is in contact with the oxide semiconductor layer, whereby diffusion of hydrogen in the oxide semiconductor layer 409 is prevented, and in addition, oxygen is supplied from the oxide insulating layer, which is to be the base insulating layer 436 , to oxygen defects in the oxide semiconductor layer 409 . thus, the transistor 420 having favorable electrical characteristics can be provided. here, silicon oxynitride means the one that contains more oxygen than nitrogen and for example, silicon oxynitride includes oxygen, nitrogen, and silicon at concentrations ranging from greater than or equal to 50 atomic % and less than or equal to 70 atomic %, greater than or equal to 0.5 atomic % and less than or equal to 15 atomic %, and greater than or equal to 25 atomic % and less than or equal to 35 atomic %, respectively. note that rates of oxygen, nitrogen, and silicon fall within the aforementioned ranges in the cases where measurement is performed using rutherford backscattering spectrometry (rbs) or hydrogen forward scattering (hfs). in addition, the total of the percentages of the constituent elements does not exceed 100 atomic %. because the base insulating film 435 is to be in contact with the oxide semiconductor layer 409 , the base insulating film 435 preferably contains oxygen which exceeds at least the stoichiometric composition in the layer (the bulk). for example, in the case where a silicon oxide layer is used as the base insulating film 435 , the composition formula is sio 2+α (α>0). the electrode layers 405 a and 405 b may be subjected to nitrogen plasma treatment before the base insulating film 435 is formed. by performing nitrogen plasma treatment, the contact resistance between the oxide semiconductor layer 409 to be formed later and each of the electrode layers 405 a and 405 b can be further reduced. next, polishing treatment (e.g., chemical mechanical polishing (cmp)) or etching treatment are performed on the base insulating film 435 , whereby top surfaces of the electrode layers 405 a and 405 b are exposed from the base insulating film 435 , and the base insulating layer 436 a top surface of which has the same height as top surfaces of the electrode layer 405 a and the electrode layer 405 b is formed (see fig. 2b ). as the polishing treatment or etching treatment may be performed plural times and/or in combination. when the polishing treatment and etching treatment are performed in combination, there is no particular limitation on the order of the steps. the surface of the base insulating layer 436 is preferably formed as flat as possible in order to improve the crystallinity of the oxide semiconductor layer to be provided over the base insulating layer 436 . a method in which the base insulating layer 436 is formed after the electrode layers 405 a and 405 b are formed is described in this embodiment; however, a method for forming the electrode layers 405 a and 405 b and the base insulating layer 436 is not limited thereto. for example, the electrode layers 405 a and 405 b may be formed as follows: the base insulating layer 436 is provided over the substrate 400 , openings are formed in the base insulating layer 436 by an etching step or the like, and the openings are filled with a conductive material. since, in this embodiment, the electrode layers 405 a and 405 b are embedded in the base insulating layer 436 , the coverage with the oxide semiconductor layer to be provided later is not affected even when the electrode layers 405 a and 405 b are formed thick. thus, the electrode layers 405 a and 405 b can be thick enough so that the resistances of the source region and the drain region are sufficiently reduced. for example, the electrode layers 405 a and 405 b are preferably thicker than the source electrode layer 406 a , the drain electrode layer 406 b , or the oxide semiconductor layer 409 which are to be formed later. next, an oxide semiconductor film is formed over the base insulating layer 436 and the electrode layers 405 a and 405 b . the oxide semiconductor film can be formed by a sputtering method, an evaporation method, a pulsed laser deposition (pld) method, an ald method, an mbe method, or the like. a resist mask is formed over the oxide semiconductor film, and the oxide semiconductor film is etched to have an island shape. after that, the resist mask is removed, and the oxide semiconductor layer 409 is formed. the oxide semiconductor layer 409 may cover the electrode layers 405 a and 405 b completely. alternatively, the following structure may be used: end portions of the oxide semiconductor layer 409 overlap with the electrode layers 405 a and 405 b , and part of the top surfaces of the electrode layers 405 a and 405 b is exposed. in the case where part of the top surfaces of the electrode layers 405 a and 405 b is exposed, the electrode layers 405 a and 405 b may be in contact with the source electrode layer 406 a and the drain electrode layer 406 b , respectively, which are to be formed later. for example, fig. 5a illustrates a structure in which the electrode layers 405 a and 405 b are in contact with the source electrode layer 406 a and the drain electrode layer 406 b , respectively. an oxide semiconductor to be used for the oxide semiconductor layer 409 preferably contains at least indium (in) or zinc (zn). in particular, in and zn are preferably contained. as a stabilizer for reducing variation in electrical characteristics of the transistor including the oxide semiconductor, gallium (ga) is preferably additionally contained. in addition, the oxide semiconductor preferably contains tin (sn), hafnium (hf), or aluminum (al) as a stabilizer. as another stabilizer, one or plural kinds of lanthanoid such as lanthanum (la), cerium (ce), praseodymium (pr), neodymium (nd), samarium (sm), europium (eu), gadolinium (gd), terbium (tb), dysprosium (dy), holmium (ho), erbium (er), thulium (tm), ytterbium (yb), lutetium (lu), or zirconium (zr) may be contained. as the oxide semiconductor, for example, any of the following can be used: a single-component metal oxide such as indium oxide, tin oxide, or zinc oxide; a two-component metal oxide such as an in—zn-based oxide, a sn—zn-based oxide, an al—zn-based oxide, a zn—mg-based oxide, a sn—mg-based oxide, an in—mg-based oxide, or an in—ga-based oxide; a three-component metal oxide such as an in—ga—zn-based oxide, an in—al—zn-based oxide, an in—sn—zn-based oxide, a sn—ga—zn-based oxide, an al—ga—zn-based oxide, a sn—al—zn-based oxide, an in—hf—zn-based oxide, an in—la—zn-based oxide, an in—ce—zn-based oxide, an in—pr—zn-based oxide, an in—nd—zn-based oxide, an in—sm—zn-based oxide, an in—eu—zn-based oxide, an in—gd—zn-based oxide, an in—tb—zn-based oxide, an in—dy—zn-based oxide, an in—ho—zn-based oxide, an in—er—zn-based oxide, an in—tm—zn-based oxide, an in—yb—zn-based oxide, or an in—lu—zn-based oxide; and a four-component metal oxide such as an in—sn—ga—zn-based oxide, an in—hf—ga—zn-based oxide, an in—al—ga—zn-based oxide, an in—sn—al—zn-based oxide, an in—sn—hf—zn-based oxide, or an in—hf—al—zn-based oxide. note that here, for example, an “in—ga—zn-based oxide” means an oxide containing in, ga, and zn as its main component and there is no particular limitation on the ratio of in:ga:zn. the in—ga—z-based oxide may contain another metal element in addition to in, ga, and zn. alternatively, a material represented by a chemical formula, inmo 3 (zno) m (m>0, m is not an integer) may be used as an oxide semiconductor. note that m represents one or more metal elements selected from ga, fe, mn, and co. alternatively, as the oxide semiconductor, a material expressed by a chemical formula, in 2 sno 5 (zno) n (n>0, n is an integer) may be used. for example, an in—ga—zn-based oxide with an atomic ratio of in to ga and zn of 1:1:1 (=1/3:1/3:1/3) or 2:2:1 (=2/5:2/5:1/5), or an oxide with an atomic ratio close to the above atomic ratios can be used. alternatively, an in—sn—zn-based oxide with an atomic ratio of in to sn and zn of 1:1:1 (=1/3:1/3:1/3), 2:1:3 (=1/3: 1/6:1/2), or 2:1:5 (=1/4:1/8:5/8), or an oxide with an atomic ratio close to the above atomic ratios may be used. for example, in the case where the composition of an oxide containing in, ga, and zn at the atomic ratio, in:ga:zn=a:b:c (a+b+c=1), is in the neighborhood of the composition of an oxide containing in, ga, and zn at the atomic ratio, in:ga:zn=a:b:c (a+b+c=1), a, b, and c satisfy the following relation: (a−a) 2 +(b−b) 2 +(c−c) 2 ≦r 2 , and r may be 0.05, for example. the same applies to other oxides. however, without limitation to the materials given above, a material with an appropriate composition may be used depending on needed electrical characteristics (e.g., mobility, threshold voltage, and variation). in order to obtain the needed electrical characteristics, it is preferable that the carrier concentration, the impurity element concentration, the defect density, the atomic ratio between a metal element and oxygen, the interatomic distance, the density, and the like be set to appropriate values. for example, high mobility can be obtained relatively easily in the case of using an in—sn—zn-based oxide. however, the mobility can be increased by reducing the defect density in the bulk also in the case of using the in—ga—zn-based oxide. note that the oxide semiconductor film may have an amorphous structure or a crystalline structure. as a preferable embodiment of the oxide semiconductor film, a c-axis aligned crystalline oxide semiconductor (caac-os) film can be given. the caac-os film is not completely single crystal nor completely amorphous. the caac-os film is an oxide semiconductor film with a crystal-amorphous mixed phase structure where crystal parts and amorphous parts are included in an amorphous phase. note that in most cases, the crystal part fits inside a cube whose one side is less than 100 nm. note that from an observation image obtained with a transmission electron microscope (tem), a boundary between an amorphous part and a crystal part in the caac-os film is not always clear. further, with the tem, a grain boundary in the caac-os film is not found. thus, in the caac-os film, a reduction in mobility, due to the grain boundary, is suppressed. in each of the crystal parts included in the caac-os film, a c-axis is aligned in a direction parallel to a normal vector of a surface where the caac-os film is formed or a normal vector of a surface of the caac-os film, triangular or hexagonal atomic arrangement which is seen from the direction perpendicular to the a-b plane is formed, and metal atoms are arranged in a layered manner or metal atoms and oxygen atoms are arranged in a layered manner when seen from the direction perpendicular to the c-axis. note that, among crystal parts, the directions of the a-axis and the b-axis of one crystal part may be different from those of another crystal part. in this specification, a simple term “perpendicular” includes a range from 85° to 95°. in addition, a simple term “parallel” includes a range from −5° to 5°. note that part of oxygen included in the oxide semiconductor film may be substituted with nitrogen. in the caac-os film, distribution of crystal parts is not necessarily uniform. for example, in the formation process of the caac-os film, in the case where crystal growth occurs from a surface side of the oxide semiconductor film, the proportion of crystal parts in the vicinity of the surface of the oxide semiconductor film is higher than that in the vicinity of the surface where the oxide semiconductor film is formed in some cases. further, when an impurity is added to the caac-os film, the crystal part in a region to which the impurity is added becomes amorphous in some cases. since the c-axes of the crystal parts included in the caac-os film are aligned in the direction parallel to a normal vector of a surface where the caac-os film is formed or a normal vector of a surface of the caac-os film, the directions of the c-axes may be different from each other depending on the shape of the caac-os film (the cross-sectional shape of the surface where the caac-os film is formed or the cross-sectional shape of the surface of the caac-os film). note that when the caac-os film is formed, the direction of c-axis of the crystal part is the direction parallel to a normal vector of the surface where the caac-os film is formed or a normal vector of the surface of the caac-os film. the crystal part is formed by film formation or by performing treatment for crystallization such as heat treatment after film formation. with use of the caac-os film in a transistor, change in electrical characteristics of the transistor due to irradiation with visible light or ultraviolet light is small. thus, the transistor has high reliability. further, when the oxide semiconductor layer 409 is formed to have a stacked structure, the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film may be formed using oxide semiconductor films having different crystallinity. that is, the oxide semiconductor layer 409 may be formed by combining a single crystal oxide semiconductor film, a polycrystalline oxide semiconductor film, an amorphous oxide semiconductor film, and a caac-os film as appropriate. when an amorphous oxide semiconductor film is applied to any of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film, internal stress or external stress of the oxide semiconductor film is relieved, variation in characteristics of a transistor is reduced, and reliability of the transistor can be further improved. note that part of oxygen included in the oxide semiconductor film may be substituted with nitrogen. note that for example, in the case where the oxide semiconductor layer is formed using an in—zn-based metal oxide, a target has a composition where in/zn is 1 to 100, preferably 1 to 20, more preferably 1 to 10 in an atomic ratio. the atomic ratio of zn is in the preferred range, whereby the mobility can be improved. here, when the atomic ratio of the metal oxide is in:zn:o═x:y:z, it is preferable to satisfy the relation of z>1.5x+y so that excess oxygen is contained. in the case of forming the oxide semiconductor layer using an in—ga—zn-based oxide by a sputtering method, it is preferable to use an in—ga—zn—o target having an atomic ratio of in to ga and zn of 1:1:1, 4:2:3, 3:1:2, 1:1:2, 2:1:3, or 3:1:4. when the oxide semiconductor film is formed using an in—ga—zn—o target having the above atomic ratio, a polycrystal semiconductor film or a caac-os film is easily formed. in the case of forming the oxide semiconductor layer using an in—sn—zn-based oxide by a sputtering method, it is preferable to use an in—sn—zn—o target having an atomic ratio of in to sn and zn of 1:1:1, 2:1:3, 1:2:2, or 20:45:35. when the oxide semiconductor layer is formed using an in—sn—zn—o target having the above atomic ratio, a polycrystal semiconductor film or a caac-os film is easily formed. the relative density of the target is greater than or equal to 90% and less than or equal to 100%, preferably greater than or equal to 95% and less than or equal to 99.9%. with the target having a high filling factor, a dense oxide semiconductor layer can be formed. note that the energy gap of a metal oxide which can be applied to the oxide semiconductor layer is preferably greater than or equal to 2 ev, more preferably greater than or equal to 2.5 ev, still more preferably greater than or equal to 3 ev. in this manner, the off-state current of a transistor can be reduced by using a metal oxide having a wide band gap. note that the concentrations of an alkali metal and an alkaline earth metal in the oxide semiconductor layer are preferably low, and these concentrations are preferably lower than or equal to 1×10 18 atoms/cm 3 , more preferably lower than or equal to 2×10 16 atoms/cm 3 . when an alkali metal and an alkaline earth metal are bonded to an oxide semiconductor, carriers are generated in some cases, which causes an increase in the off-state current of the transistor. further, the oxide semiconductor film may have a structure in which a plurality of oxide semiconductor films is stacked. for example, the oxide semiconductor layer may have a stacked-layer structure of a first oxide semiconductor film and a second oxide semiconductor film which are formed using metal oxides with different compositions. for example, the first oxide semiconductor film may be formed using any of two-component metal oxide, a three-component metal oxide, and a four-component metal oxide, and the second oxide semiconductor film may be formed using any of these which is different from the oxide for the first oxide semiconductor film. further, the constituent elements of the first oxide semiconductor film and the second oxide semiconductor film are made to be the same and the composition of the constituent elements of the first oxide semiconductor film and the second oxide semiconductor film may be made to be different. for example, the first oxide semiconductor film may have an atomic ratio of in to ga and zn of 1:1:1 or an atomic ratio in the neighborhood of the atomic ratio and the second oxide semiconductor film may have an atomic ratio of in to ga and zn of 3:1:2 or an atomic ratio in the neighborhood of the atomic ratio. alternatively, the first oxide semiconductor film may each have an atomic ratio of in to ga and zn of 1:3:2 or an atomic ratio in the neighborhood of the atomic ratio, and the second oxide semiconductor film may have an atomic ratio of in to ga and zn of 2:1:3 or an atomic ratio in the neighborhood of the atomic ratio. at this time, one of the first oxide semiconductor film and the second oxide semiconductor film which is closer to the gate electrode layer 401 to be formed later (on a channel side) preferably contains in and ga at a proportion of in>ga. the other which is farther from the gate electrode layer 401 (on a back channel side) preferably contains in and ga at a proportion of in≦ga. further, the constituent elements of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are made to be the same, and the composition of the constituent elements of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film may be made to be different. for example, the first oxide semiconductor film may have an atomic ratio of in to ga and zn of 1:3:2, the second oxide semiconductor film may have an atomic ratio of in to ga and zn of 3:1:2, and the third oxide semiconductor film may have an atomic ratio of in to ga and zn of 1:1:1. an oxide semiconductor film which contains less in than ga and zn at atomic ratio, typically, the first oxide semiconductor film having an atomic ratio of in to ga and zn of 1:3:2, has a higher insulating property than an oxide semiconductor film which contains more in than ga and zn at atomic ratio, typically, the second oxide semiconductor film, and an oxide semiconductor film which contains ga, zn, and in at the same atomic ratio, typically, the third oxide semiconductor film. further, when the first oxide semiconductor film having an atomic ratio of in to ga and zn of 1:3:2 has an amorphous structure, the insulating property is further improved. since the constituent elements of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are the same, the first oxide semiconductor film has fewer trap levels at the interface with the second oxide semiconductor film. accordingly, when an oxide semiconductor film has the above structure, changes over time or variation in threshold voltage of a transistor due to a bt stress test under light can be reduced. in an oxide semiconductor, the s orbital of heavy metal mainly contributes to carrier transfer, and when the in content in the oxide semiconductor is increased, overlap of the s orbital is likely to be increased. therefore, an oxide having a composition of in>ga has higher mobility than an oxide having a composition of in≦ga. further, in ga, the formation energy of oxygen defects is larger and thus oxygen defects is less likely to occur, than in in; therefore, the oxide having a composition of in≦ga has more stable characteristics than the oxide having a composition of in>ga. an oxide semiconductor containing in and ga at a proportion of in>ga is used on a channel side, and an oxide semiconductor containing in and ga at a proportion of in≦ga is used on a back channel side; so that field-effect mobility and reliability of a transistor can be further improved. the oxide semiconductor layer 409 has a thickness greater than or equal to 1 nm and less than or equal to 100 nm, preferably greater than or equal to 1 nm and less than or equal to 20 nm. in the transistor 420 , the oxide semiconductor layer 409 is in contact with the wiring layer 465 a in a region where the oxide semiconductor layer 409 overlaps with the electrode layer 405 a , and is in contact with the wiring layer 465 b in a region where the oxide semiconductor layer 409 overlaps with the electrode layer 405 b . therefore, even when the thickness of the oxide semiconductor layer is reduced by miniaturization of the transistor, electrical connection between the oxide semiconductor layer 409 and each of the wiring layers 465 a and 465 b can be ensured by the electrode layers 405 a and 405 b which are provided to overlap with the oxide semiconductor layer 409 . the oxide semiconductor layer 409 is formed in an oxygen gas atmosphere preferably by a sputtering method. the substrate heating temperature is set to higher than or equal to 100° c. and lower than or equal to 600° c., preferably higher than or equal to 150° c. and lower than or equal to 550° c., further preferably higher than or equal to 200° c. and lower than or equal to 500° c. the impurity element concentration in the obtained oxide semiconductor layer 409 is decreased with an increase in the substrate heating temperature in film formation. further, the atomic arrangement in the oxide semiconductor layer 409 is ordered and the density thereof is increased, so that a polycrystalline oxide semiconductor film or a caac-os film is likely to be formed. when a caac-os film is formed, for example, the caac-os film is formed by a sputtering method with a polycrystalline oxide semiconductor sputtering target. when ions collide with the sputtering target, a crystal region included in the sputtering target may be separated from the target along an a-b plane; in other words, a sputtered particle having a plane parallel to an a-b plane (flat-plate-like sputtered particle or pellet-like sputtered particle) may flake off from the sputtering target. in that case, the flat-plate-like sputtered particle reaches a substrate while maintaining their crystal state, whereby the caac-os film can be formed. for the formation of the caac-os film, the following conditions are preferably used. by reducing the amount of impurities entering the caac-os film during formation, the crystal state can be prevented from being broken by the impurities. for example, the concentration of impurities (e.g., hydrogen, water, carbon dioxide, or nitrogen) which exist in the deposition chamber may be reduced. furthermore, the concentration of impurities in a deposition gas may be reduced. specifically, a deposition gas whose dew point is −80° c. or lower, preferably −100° c. or lower is used. by increasing the substrate heating temperature during formation, migration of a sputtered particle is likely to occur after the sputtered particle reaches a substrate surface. specifically, the substrate heating temperature during formation is higher than or equal to 100° c. and lower than or equal to 740° c., preferably higher than or equal to 200° c. and lower than or equal to 500° c. by increasing the substrate heating temperature during formation, when the flat-plate-like sputtered particle reaches the substrate, migration occurs on the substrate surface, so that a flat plane of the flat-plate-like sputtered particle is attached to the substrate. furthermore, it is preferable that the proportion of oxygen in the deposition gas be increased and the power be optimized in order to reduce plasma damage at the formation. the proportion of oxygen in the deposition gas is higher than or equal to 30 vol %, preferably 100 vol %. as an example of the sputtering target, an in—ga—zn-based oxide target is described below. the in—ga—zn-based oxide target, which is polycrystalline, is made by mixing ino x powder, gao y powder, and zno z powder in a predetermined molar ratio, applying pressure, and performing heat treatment at a temperature higher than or equal to 1000° c. and lower than or equal to 1500° c. note that x, y and z are given positive numbers. here, the predetermined molar ratio of ino x powder to gao y powder and zno z powder is, for example, 2:2:1, 8:4:3, 3:1:1, 1:1:1, 4:2:3, or 3:1:2. the kinds of powder and the molar ratio for mixing powder may be determined as appropriate depending on the desired sputtering target. furthermore, when an oxygen gas atmosphere is employed for the formation, an unnecessary atom such as a rare gas atom is not contained in the oxide semiconductor layer 409 , so that a polycrystalline oxide semiconductor film or a caac-os film is easily formed. note that a mixed gas atmosphere including an oxygen gas and a rare gas may be used. in that case, the percentage of an oxygen gas is higher than or equal to 30 vol.%, preferably higher than or equal to 50 vol.%, more preferably higher than or equal to 80 vol.%. it is preferable that argon and oxygen used for formation of the oxide semiconductor film do not contain water, hydrogen, and the like. for example, it is preferable that argon have a purity of 9n, a dew point of −121° c., a water content of 0.1 ppb, and a hydrogen content of 0.5 ppb and oxygen have a purity of 8n, a dew point of −112° c., a water content of 1 ppb, and a hydrogen content of 1 ppb. in this embodiment, a 10-nm-thick igzo film having an atomic ratio of in to ga and zn of 3:1:2 is formed by a sputtering method under an atmosphere of argon and oxygen at a flow ratio of 2:1, respectively. in an oxide semiconductor in an amorphous state, a flat surface can be obtained with relative ease, so that interface scattering of a carrier (electron) of a transistor including the oxide semiconductor in an amorphous state in operation can be suppressed, and relatively high mobility can be obtained with relative ease. in an oxide semiconductor having crystallinity, defects in the bulk can be further reduced and when a surface flatness is improved, mobility higher than that of an oxide semiconductor in an amorphous state can be obtained. in order to improve the surface flatness, the oxide semiconductor is preferably formed over a flat surface. specifically, the oxide semiconductor may be formed over a surface with the average surface roughness (ra) of less than or equal to 1 nm, preferably less than or equal to 0.3 nm, more preferably less than or equal to 0.1 nm. note that ra is obtained by expanding, into three dimensions, arithmetic mean surface roughness that is defined by jis b 0601:2001 (iso4287:1997) so as to be able to apply it to a curved surface. ra can be expressed as an “average value of the absolute values of deviations from a reference surface to a designated surface” and is defined by the following formula. here, the specific surface is a surface which is a target of roughness measurement, and is a quadrilateral region which is specified by four points represented by the coordinates (x 1 , y 1 , f(x 1 , y 1 )), (x 1 , y 2 , f(x 1 , y 2 )), (x 2 , y 1 , f(x 2 , y 1 )), and (x 2 , y 2 , f(x 2 , y 2 )). moreover, s 0 represents the area of a rectangle which is obtained by projecting the specific surface on the xy plane, and z 0 represents the height of the reference surface (the average height of the specific surface). ra can be measured using an atomic force microscope (afm). in addition, the reference surface is a surface parallel to an x-y plane at the average height of the specific surface. in short, when the average value of the height of the specific surface is denoted by z 0 , the height of the reference surface is also denoted by z 0 . in order to make the average surface roughness of the base insulating layer in a region of the oxide semiconductor layer in which a channel is formed less than or equal to 0.3 nm, planarization treatment may be performed. the planarization treatment may be performed before the oxide semiconductor film is formed. for example, dry etching or the like may be performed as the planarization treatment. as the etching gas, a chlorine-based gas such as a chlorine gas, a boron chloride gas, a silicon chloride gas, or a carbon tetrachloride gas, a fluorine-based gas such as a carbon tetrafluoride gas, a sulfur fluoride gas, or a nitrogen fluoride gas, or the like may be used. further, it is preferable that hydrogen contained in the oxide semiconductor layer be as little as possible. note that the hydrogen may be contained in the oxide semiconductor layer in the form of a hydrogen molecule, water, a hydroxyl group, or hydride in some cases, in addition to a hydrogen atom. thus, the oxide semiconductor layer is preferably subjected to heat treatment for removing excess hydrogen (including water and a hydroxyl group) in the oxide semiconductor layer (dehydration or dehydrogenation). the temperature of the heat treatment is higher than or equal to 300° c. and lower than or equal to 700° c., or lower than the strain point of a substrate. the heat treatment can be performed under reduced pressure, a nitrogen atmosphere, or the like. note that the heat treatment may be performed before the formed oxide semiconductor film is processed into an island-like shape or after the oxide semiconductor film is processed into an island-like shape. further, the heat treatment for the dehydration or dehydrogenation may be performed plural times, and may double as another heat treatment. the heat treatment is preferably performed in such a manner that after heat treatment is performed in a reduced-pressure atmosphere or an inert atmosphere, the atmosphere is switched to an oxidation atmosphere with the temperature maintained and heat treatment is further performed. when the heat treatment is performed in a reduced-pressure atmosphere or an inert atmosphere, the concentration of an impurity (e.g., hydrogen) in the oxide semiconductor layer can be reduced; however, oxygen vacancies might be caused at the same time. by the heat treatment in the oxidation atmosphere, the caused oxygen vacancies can be reduced. by performing heat treatment on the oxide semiconductor layer, the concentration of an impurity element (e.g., hydrogen) in the layer can be significantly reduced. as a result, the field-effect mobility of the transistor can be increased to close to the ideal field-effect mobility. note that it is preferable that oxygen be contained in the oxide semiconductor layer 409 in excess of the amount in the stoichiometric composition. when excess oxygen is contained, generation of carriers due to oxygen defects in the formed oxide semiconductor layer 409 can be prevented. in order for the oxide semiconductor layer 409 to contain excess oxygen, film formation may be performed under conditions such that a large amount of oxygen is contained at the time of the film formation. alternatively, oxygen (including at least one of an oxygen radical, an oxygen atom, and an oxygen ion) may be introduced after formation of the oxide semiconductor film so that oxygen is contained in excess of the amount in the film. as the method for introduction of oxygen, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, plasma treatment, or the like can be used. note that in the case where the oxide insulating layer is used as the base insulating layer, when heat treatment is performed while the oxide semiconductor layer is provided over the oxide insulating layer, oxygen can be supplied to the oxide semiconductor layer, the oxygen defects in the oxide semiconductor layer can be reduced, and electrical characteristics can be improved. the oxide semiconductor layer and the oxide insulating layer may be subjected to a heating step in a state where the oxide semiconductor layer and the oxide insulating layer are at least partly in contact with each other so that oxygen is supplied to the oxide semiconductor layer. note that the heat treatment may be performed before the oxide semiconductor film is processed into an island-like shape or after the oxide semiconductor film is processed into an island-like shape. it is preferable to perform the heat treatment before the oxide semiconductor film is processed into an island-like shape, because the amount of oxygen released from the base insulating layer to the outside is small and thus the larger amount of oxygen can be supplied to the oxide semiconductor layer. subsequently, a gate insulating film 452 is formed over the oxide semiconductor layer 409 (see fig. 2c ). when the gate insulating film 452 is formed using a high-k material such as hafnium oxide, yttrium oxide, hafnium silicate (hfsi x o y (x>0, y>0)), hafnium silicate (hfsi x o y (x>0, y>0)) to which nitrogen is added, hafnium aluminate (hfal x o y (x>0, y>0)), or lanthanum oxide, gate leakage current can be reduced. further, the gate insulating film 452 may have either a single-layer structure or a stacked-layer structure. the gate insulating film 452 has a thickness greater than or equal to 1 nm and less than or equal to 20 nm and can be formed by a sputtering method, an mbe method, a cvd method, a pld method, an ald method, or the like as appropriate. the gate insulating film 452 may also be formed with a sputtering apparatus which performs film formation in the state where surfaces of a plurality of substrates are substantially perpendicular to a surface of a sputtering target. in this embodiment, a 20-nm-thick silicon oxynitride film is formed by a cvd method. like the base insulating layer 436 , the gate insulating film 452 is in contact with the oxide semiconductor layer. thus, a large amount of oxygen, which exceeds at least the stoichiometric composition, is preferably contained in the layer (the bulk). a planarization treatment may be performed on the top surface of the oxide semiconductor layer 409 in order to improve coverage with the gate insulating film 452 . the surface of the oxide semiconductor layer 409 preferably has favorable planarity particularly when an insulating layer having a small thickness is used as the gate insulating film 452 . next, a conductive film and an insulating film are stacked over the gate insulating film 452 and the oxide semiconductor layer 409 , and the conductive film and the insulating film are etched, so that the gate electrode layer 401 and the upper insulating layer 413 are formed in a region which overlaps with a region which is sandwiched between the electrode layers 405 a and 405 b (see fig. 2d ). the gate electrode layer 401 can be formed using a metal material such as molybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium, neodymium, or scandium or an alloy material which contains any of these materials as its main component. a semiconductor film which is doped with an impurity element such as phosphorus and is typified by a polycrystalline silicon film, or a silicide film of nickel silicide or the like can also be used as the gate electrode layer 401 . further, the gate electrode layer 401 can also be formed using a conductive material such as indium tin oxide, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, or indium tin oxide to which silicon oxide is added. it is also possible that the gate electrode layer 401 has a stacked structure of the above conductive material and the above metal material. as one layer of the gate electrode layer 401 which is in contact with the gate insulating film 452 , a metal oxide film containing nitrogen, specifically, an in—ga—zn—o film containing nitrogen, an in—sn—o film containing nitrogen, an in—ga—o film containing nitrogen, an in—zn—o film containing nitrogen, a sn—o film containing nitrogen, an in—o film containing nitrogen, or a metal nitride (e.g., inn or snn) film can be used. these films each have a work function higher than or equal to 5 ev, preferably higher than or equal to 5.5 ev; thus, when these are used as a gate electrode, the threshold voltage of the electrical characteristics of the transistor can be positive. in this embodiment, a 100-nm-thick tungsten film is formed by a sputtering method. for the upper insulating layer 413 , typically, an inorganic insulating material such as silicon oxide, silicon oxynitride, aluminum oxide, aluminum oxynitride, silicon nitride, aluminum nitride, silicon nitride oxide, or aluminum nitride oxide can be used. the upper insulating layer 413 can be formed by a cvd method, a sputtering method, or the like. in this embodiment, a 200-nm-thick silicon oxynitride film is formed by a cvd method as the upper insulating layer 413 . after that, the upper insulating layer 413 and the gate electrode layer 401 are processed into an island shape by a dry etching method. at this time, the gate insulating layer 402 may also be etched. next, an impurity element 421 is introduced into the oxide semiconductor layer 409 using the gate electrode layer 401 and the upper insulating layer 413 as masks, so that the low-resistance regions 404 a and 404 b are formed in a self-aligned manner in a region of the oxide semiconductor layer 409 which does not overlap with the gate electrode layer 401 (see fig. 3a ). note that a region of the oxide semiconductor layer 409 to which the impurity element 421 is not introduced serves as the channel formation region 403 . consequently, in the oxide semiconductor layer 409 , the channel formation region 403 with which the gate electrode layer 401 overlaps is formed, and the low-resistance region 404 a and the low-resistance region 404 b each having resistance lower than that of the channel formation region 403 are formed with the channel formation region 403 interposed therebetween. as the method for adding the impurity element 421 , an ion implantation method, an ion doping method, a plasma immersion ion implantation method, or the like can be used. phosphorus, boron, nitrogen, arsenic, argon, aluminum, a molecular ion containing any of the above element, or the like can be used as the impurity element to be introduced. the dosage of such an element is preferably 1×10 13 ions/cm 2 to 5×10 16 ions/cm 2 . when phosphorus is introduced as the impurity element, the acceleration voltage is preferably 0.5 kv to 80 kv. in this embodiment, phosphorus is introduced as the impurity element. note that the treatment for introducing the impurity element into the oxide semiconductor layer 409 may be performed plural times. in the case where the treatment for introducing the impurity element into the oxide semiconductor layer 409 is performed plural times, the kind of impurity element may be the same in the plural treatments or different in every treatment. when the oxide semiconductor layer 409 includes the low-resistance regions 404 a and 404 b which have resistance reduced by introduction of an impurity element, the resistance between the oxide semiconductor layer 409 and each of the source electrode layer 406 a and the drain electrode layer 406 b is reduced. accordingly, an electric field near the source electrode layer 406 a and the drain electrode layer 406 b is relaxed, and the transistor 420 can be a semiconductor device with good electrical characteristics, which has high on-state characteristics and which is capable of high-speed operation and high-speed response. note that due to the introduction of an impurity element, a crystal structure of the oxide semiconductor layer is changed in some cases. in the semiconductor device in this embodiment, an oxide semiconductor layer which includes regions differing in crystallinity may be used. for example, the channel formation region 403 may have crystallinity higher than that of the low-resistance region 404 a and the low-resistance region 404 b . specifically, the oxide semiconductor of the channel formation region 403 can be formed using the caac-os film, while a region of the low-resistance region 404 a which is in contact with the electrode layer 405 a and a region of the low-resistance region 404 b which is in contact with the electrode layer 405 b can be amorphous films. further, in the case where the electrode layers 405 a and 405 b are formed using an oxide semiconductor material, an impurity element can be introduced into the electrode layers 405 a and 405 b at the time of introducing the impurity element into the oxide semiconductor layer 409 , so that the electrode layers 405 a and 405 b can also be reduced in resistance. the electrode layer 405 a and the electrode layer 405 b are in contact with the oxide semiconductor layer 409 in a region whose resistance is reduced. thus, a semiconductor device can have low contact resistance and excellent on-state characteristics. next, an insulating film is formed over the gate electrode layer 401 and the upper insulating layer 413 , and the insulating film is etched, so that the sidewall insulating layers 412 a and 412 b are formed. further, the gate insulating film 452 is etched using the gate electrode layer 401 and the sidewall insulating layers 412 a and 412 b as masks, so that the gate insulating layer 402 is formed (see fig. 3b ). the sidewall insulating layers 412 a and 412 b can be formed using a material and a method similar to those of the upper insulating layer 413 . in this embodiment, a 70-nm-thick silicon oxynitride film is formed by a cvd method. next, a conductive film for forming a source electrode layer and a drain electrode layer (including a wiring or the like formed of the same layer as the source electrode layer and the drain electrode layer) is formed over the oxide semiconductor layer 409 , the gate insulating layer 402 , the gate electrode layer 401 , the sidewall insulating layers 412 a and 412 b , and the upper insulating layer 413 . the conductive film can be formed using a material and a method similar to those of the gate electrode layer 401 . in this embodiment, a 30-nm-thick tungsten film is formed by a sputtering method. a resist mask is formed over the conductive film by a photolithography process, and is selectively etched, so that an island-shaped conductive film 406 is formed. then, the resist mask is removed (see fig. 3c ). note that in this etching step, a region of the conductive film 406 which overlaps with the gate electrode layer 401 is not removed. the insulating layer 415 is formed over the island-shaped conductive film 406 (see fig. 3d ). the insulating layer 415 can be formed using a material and a method similar to those of the upper insulating layer 413 . the insulating layer 415 is formed to have a thickness which is large enough to planarize unevenness caused by the transistor 420 . in this embodiment, a 500-nm-thick silicon oxynitride film is formed by a cvd method. further the insulating layer 415 may be a single layer or a stacked layer of different insulating layers. when the insulating layer 415 has a stacked-layer structure, a structure in which the insulating layer 415 and an insulating layer 416 are provided over the source electrode layer 406 a and the drain electrode layer 406 b can be employed as in a transistor 430 illustrated in fig. 5a . for example, the insulating layer 416 can be an aluminum oxide layer, and the insulating layer 415 can be a silicon oxide layer. next, chemical mechanical polishing treatment is performed on the insulating layer 415 and the conductive film 406 . part of the insulating layer 415 and part of the conductive film 406 are removed so that the upper insulating layer 413 is exposed (see fig. 4a ). by the polishing treatment, the conductive film 406 which overlaps with the gate electrode layer 401 is removed; thus, the conductive film 406 becomes the source electrode layer 406 a and the drain electrode layer 406 b. the source electrode layer 406 a and the drain electrode layer 406 b are provided in contact with the top surface of the oxide semiconductor layer 409 , and are in contact with the sidewall insulating layers 412 a and 412 b , respectively. accordingly, the distance (minimum distance) between the gate electrode layer 401 and the region (contact region) in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b corresponds to a width of the sidewall insulating layer 412 a or 412 b in the channel length direction, whereby the further miniaturization can be achieved and variation in the minimum distance in the manufacturing process can be suppressed. a chemical mechanical polishing method is used for removing the insulating layer 415 and the conductive film 406 in this embodiment; however, another cutting (grinding or polishing) method may be used. further, in addition to the cutting (grinding or polishing) method such as a chemical mechanical polishing method, an etching (dry etching or wet etching) method, plasma treatment, or the like may be employed in combination for the step of removing the conductive film 406 which overlaps the gate electrode layer 401 . for example, after the removing step by a chemical mechanical polishing method, a dry etching method or plasma treatment may be performed in order to improve the planarity of the processed surface. when the cutting (grinding or polishing) method is employed in combination with an etching method, plasma treatment, or the like, the order of steps is not particularly limited and may be set as appropriate depending on the materials, the film thicknesses, and the surface roughness of the insulating layer 415 and the conductive film 406 . note that in this embodiment, the source electrode layer 406 a and the drain electrode layer 406 b are provided in contact with side surfaces of the sidewall insulating layers 412 a and 412 b provided on side surfaces of the gate electrode layer 401 , and the source electrode layer 406 a and the drain electrode layer 406 b each of which has an upper end portion positioned a little lower than those of the sidewall insulating layers 412 a and 412 b cover the side surfaces of the sidewall insulating layers 412 a and 412 b . the shapes of the source electrode layer 406 a and the drain electrode layer 406 b depend on the conditions of the polishing treatment for removing the conductive film 406 , and in some cases, as described in this embodiment, the source electrode layer 406 a and the drain electrode layer 406 b are depressed in the film thickness direction from top surfaces of the sidewall insulating layers 412 a and 412 b and the upper insulating layer 413 on which polishing treatment has been performed. however, depending on the conditions of the polishing treatment, the height of each of the top surfaces of the source electrode layer 406 a and the drain electrode layer 406 b is almost equal to that of each of the top surfaces of the sidewall insulating layers 412 a and 412 b and the upper insulating layer 413 in some cases. further, in a step for removing the conductive film 406 , as illustrated in fig. 5b , a transistor 440 may have a structure in which the upper insulating layer 413 is removed completely, and the gate electrode layer 401 is exposed. further, part of the gate electrode layer 401 may also be removed. as in the transistor 440 , a structure in which the gate electrode layer 401 is exposed can be used for an integrated circuit in which another wiring or semiconductor element is stacked over the transistor 440 . next, the insulating layer 417 is formed over the insulating layer 415 , the source electrode layer 406 a , the drain electrode layer 406 b , and the upper insulating layer 413 (see fig. 4b ). the insulating layer 417 can be formed using a material and a method similar to those of the upper insulating layer 413 . when an highly dense inorganic insulating film (typically, an aluminum oxide film or the like) is used as the insulating layer 417 , the insulating layer 417 functions as a protective insulating film of the transistor 420 . note that in this embodiment, the insulating layer 417 has a stacked-layer structure of a 50-nm-thick aluminum oxide film formed by a sputtering method and a 350-nm-thick silicon oxynitride film formed by a cvd method. after the aluminum oxide film is formed, heat treatment may be performed. an aluminum oxide film has a function of preventing entry of water or hydrogen into an oxide semiconductor layer and a function of preventing oxygen detachment from an oxide semiconductor layer. thus, when the oxide semiconductor layer 409 or an insulating layer in contact with the oxide semiconductor layer 409 has a region containing oxygen which exceeds the stoichiometric composition (also referred to as an oxygen-excess region), at least one oxygen-excess region can be provided in the oxide semiconductor layer or at the interface of the oxide semiconductor layer with the insulating layer by performing heat treatment while an aluminum oxide film is provided. next, an opening 455 a which penetrates through the insulating layer 417 and the insulating layer 415 and reaches the source electrode layer 406 a is formed in a region overlapping with the electrode layer 405 a , and an opening 455 b which penetrates through the insulating layer 417 and the insulating layer 415 and reaches the drain electrode layer 406 b is formed in a region overlapping with the electrode layer 405 b (see fig. 4c ). the openings are formed by selective etching using a mask or the like. dry etching, wet etching, or both wet etching and dry etching can be used to form the openings. further, the shapes of the openings are not particularly restricted as long as the openings reach the source electrode layer 406 a and the drain electrode layer 406 b . note that the tapered shape as illustrated in fig. 4c is preferable because the wiring layer to be formed later can be formed without disconnection. in this embodiment, the openings are formed by a dry etching method. in a step of forming the openings 455 a and 455 b , the source electrode layer 406 a , the drain electrode layer 406 b , or the oxide semiconductor layer 409 may be etched by etching of the insulating layer 417 and the insulating layer 415 , so that the source electrode layer 406 a , the drain electrode layer 406 b , or the oxide semiconductor layer 409 is reduced in film thickness in some cases. in the transistor of this embodiment, the openings 455 a and 455 b are formed in regions overlapping with the electrode layers 405 a and 405 b , respectively. therefore, the wiring layers can be electrically connected to the oxide semiconductor layer 409 even when the film thickness of the source electrode layer 406 a , the drain electrode layer 406 b , or the oxide semiconductor layer 409 is reduced by etching. subsequently, the wiring layers 465 a and 465 b are formed over the openings 455 a and 455 b and the insulating layer 417 using a conductive material (see fig. 4d ). for the wiring layers 465 a and 465 b , a material which is substantially the same as the material used for the gate electrode layer 401 described above can be used. in this embodiment, a 50-nm-thick titanium film, a 100-nm-thick aluminum film, and a 50-nm-thick titanium film are formed in this order by a sputtering method. through the above-described steps, the transistor 420 can be manufactured. in the process for manufacturing the transistor described in this embodiment, the conductive film 406 provided over the gate electrode layer 401 , the upper insulating layer 413 , and the sidewall insulating layers 412 a and 412 b is removed by chemical mechanical polishing treatment, so that the conductive film 406 is divided; thus, the source electrode layer 406 a and the drain electrode layer 406 b are formed. further, the source electrode layer 406 a and the drain electrode layer 406 b are provided in contact with the top surface of the oxide semiconductor layer 409 and the sidewall insulating layers 412 a and 412 b . the distance (minimum distance) between the gate electrode layer 401 and the region (contact region) in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b corresponds to a width of the sidewall insulating layer 412 a or 412 b in the channel length direction, whereby the further miniaturization can be achieved and variation in the minimum distance in the manufacturing process can be suppressed. accordingly, the distance between the gate electrode layer 401 and the region in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b can be made short, so that the resistance between the gate electrode layer 401 and the region in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b is reduced; thus, the on-state characteristics of the transistor 420 can be improved. further, precise processing can be performed accurately because an etching step using a resist mask is not performed in a step for removing the conductive film 406 over the gate electrode layer 401 , which is one step of the formation process of the source electrode layer 406 a and the drain electrode layer 406 b . consequently, in a process for manufacturing the semiconductor device, the transistor having a miniaturized structure with less variation in shape or characteristics can be manufactured with high yield. further, in a semiconductor device described in this embodiment, low-resistance regions are formed by introducing an impurity element into an oxide semiconductor layer, and the low-resistance regions serve as a source region and a drain region which are in contact with a source electrode layer and a drain electrode layer. accordingly, the contact resistance between the oxide semiconductor layer and each of the source and drain electrode layers can be reduced. when the electrode layers 405 a and 405 b are provided under the source region and the drain region, the source region and the drain region can be thicker, the resistances of the source region and the drain region can be reduced, and the on-state characteristics of the transistor can be improved. although not shown, an insulating layer may be further provided over the transistor 420 . as the insulating layer, a single layer or a stack of one or more inorganic insulating films, typical examples of which are a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, an aluminum oxynitride film, a hafnium oxide film, a gallium oxide film, a silicon nitride film, an aluminum nitride film, a silicon nitride oxide film, and an aluminum nitride oxide film, can be used. a heating step may be additionally performed after the insulating layer is formed. for example, a heating step may be performed at a temperature of higher than or equal to 100° c. and lower than or equal to 200° c. in the air for longer than or equal to 1 hour and shorter than or equal to 30 hours. this heating step may be performed at a fixed heating temperature. alternatively, the following change in the heating temperature may be conducted plural times repeatedly: the heating temperature is increased from room temperature to a temperature of higher than or equal to 100° c. and lower than or equal to 200° c. and then decreased to room temperature. in addition, a planarization insulating film may be formed in order to reduce surface unevenness caused by the transistor 420 . as the planarization insulating film, an organic material such as polyimide, acrylic, or a benzocyclobutene-based resin can be used. other than such organic materials, it is also possible to use a low dielectric constant material (low-k material) or the like. note that the planarization insulating film may be formed by stacking a plurality of insulating films formed from these materials. this embodiment can be combined with any of the other embodiments as appropriate. (embodiment 2) in this embodiment, semiconductor devices of embodiments of the present invention which are different from the semiconductor devices described in embodiment 1 are described. note that only the difference between embodiments 1 and 2 is described in this embodiment. figs. 6a and 6b illustrate a transistor of this embodiment. fig. 6a is a top view illustrating a transistor of one embodiment of the present invention, and fig. 6b is a cross-sectional view taken along dashed-dotted line b 1 -b 2 in fig. 6a . a semiconductor device including a transistor 520 includes, over the substrate 400 , a base insulating layer 536 ; an electrode layer 505 a and an electrode layer 505 b over the base insulating layer 536 ; the oxide semiconductor layer 409 including the low-resistance regions 404 a and 404 b which are in contact with the electrode layers 505 a and 505 b , respectively, and the channel formation region 403 which is formed over the base insulating layer 536 and is sandwiched by the low-resistance region 404 a and the low-resistance region 404 b ; the gate insulating layer 402 over the oxide semiconductor layer 409 ; the gate electrode layer 401 over the gate insulating layer 402 ; the sidewall insulating layers 412 a and 412 b which cover side surfaces of the gate electrode layer 401 ; an upper insulating layer 413 covering a top surface of the gate electrode layer 401 ; the source electrode layer 406 a and the drain electrode layer 406 b which are over the base insulating layer 536 and the oxide semiconductor layer 409 and which are in contact with the side surface of the sidewall insulating layer 412 a and the side surface of the sidewall insulating layer 412 b , respectively; an insulating layer 415 over the source electrode layer 406 a and the drain electrode layer 406 b ; an insulating layer 417 over the insulating layer 415 , the source electrode layer 406 a , the drain electrode layer 406 b , the sidewall insulating layers 412 a and 412 b , and the upper insulating layer 413 ; and the wiring layer 465 a and the wiring layer 465 b which are in contact with the source electrode layer 406 a and the drain electrode layer 406 b , respectively, through openings provided in the insulating layer 415 and the insulating layer 417 . the low-resistance regions 404 a and 404 b are in contact with the electrode layers 505 a and 505 b , respectively. the electrode layers 505 a and 505 b are formed using metal, a metal compound, a conductive metal compound, a semiconductor, or the like. the low-resistance regions 404 a and 404 b function as a source region and a drain region of the transistor 520 . the electrode layers 505 a and 505 b are provided under the source region and the drain region, so that the source region and the drain region can be thicker, the resistances of the source region and the drain region can be reduced, and the on-state characteristics of the transistor can be improved. the transistor 520 described in this embodiment is different from the transistor 420 described in embodiment 1 in that the electrode layers 505 a and 505 b are formed over the base insulating layer. the transistor 520 can be manufactured with a smaller number of steps than the transistor 420 because the electrode layers 505 a and 505 b are not embedded in the base insulating layer. a method of manufacturing the transistor 520 is described. first, the base insulating layer 536 is formed over the substrate 400 . the base insulating layer 536 can be formed using a material and a method similar to those of the base insulating layer 436 described in embodiment 1. next, a conductive film to be the electrode layers 505 a and 505 b is formed and selectively etched by a photolithography step, so that the electrode layers 505 a and 505 b are formed. the conductive film to be the electrode layers 505 a and 505 b can be formed using a material and a method similar to those of the electrode layers 405 a and 405 b described in embodiment 1. the both end portions of the electrode layers 505 a and 505 b are preferably tapered in consideration of the coverage with the oxide semiconductor layer 409 to be formed later. the electrode layers 505 a and 505 b preferably have a thickness with which the electrode layers 505 a and 505 b can be sufficiently covered with the oxide semiconductor layer 409 . here, the conductive film may be subjected to nitrogen plasma treatment before the formed conductive film is processed to form the island-shaped electrode layers 505 a and 505 b . by performing nitrogen plasma treatment, the contact resistance between the oxide semiconductor layer 409 to be formed later and each of the electrode layers 505 a and 505 b can be reduced. next, an oxide semiconductor film is formed over the base insulating layer 536 , the electrode layer 505 a , and the electrode layer 505 b , and is processed by etching to form the island-shaped oxide semiconductor layer 409 . the oxide semiconductor layer 409 does not need to cover the electrode layers 505 a and 505 b completely, and may be at least partly in contact with the electrode layers 505 a and 505 b as in the transistor 520 illustrated in fig. 6b . further, as in a transistor 530 illustrated in fig. 7 , the oxide semiconductor layer 409 may cover the electrode layers 505 a and 505 b completely. by adjusting the contact area between the oxide semiconductor layer 409 and each of the electrode layers 505 a and 505 b as appropriate, the contact resistance between the oxide semiconductor layer 409 and each of the electrode layers 505 a and 505 b can be set as appropriate. a region of the electrode layer 505 a and a region of the electrode layer 505 b which are not covered with the oxide semiconductor layer 409 may be in contact with the source electrode layer 406 a and the drain electrode layer 406 b which are to be formed later, respectively. the oxide semiconductor layer 409 can be formed using a material and a method similar to those in embodiment 1. the oxide semiconductor layer 409 preferably has a thickness large enough to prevent disconnection caused by the electrode layers 505 a and 505 b. a method similar to that of the transistors described in embodiment 1 is used for forming the gate electrode layer 401 , the upper insulating layer 413 , the sidewall insulating layer 412 a , the sidewall insulating layer 412 b , the source electrode layer 406 a , the drain electrode layer 406 b , the insulating layer 415 , the insulating layer 417 , and the wiring layers 465 a and 465 b . embodiment 1 can be referred to for the details; thus, description thereof is omitted here. in the process for manufacturing the transistor described in this embodiment, the conductive film 406 provided over the gate electrode layer 401 , the upper insulating layer 413 , and the sidewall insulating layers 412 a and 412 b is removed by chemical mechanical polishing treatment, so that the conductive film 406 is divided; thus, the source electrode layer 406 a and the drain electrode layer 406 b are formed. further, the source electrode layer 406 a and the drain electrode layer 406 b are provided in contact with the top surface of the oxide semiconductor layer 409 , and the sidewall insulating layers 412 a and 412 b . the distance (minimum distance) between the gate electrode layer 401 and the region (contact region) in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b corresponds to a width of the sidewall insulating layer 412 a or 412 b in the channel length direction, whereby the further miniaturization can be achieved and variation in the minimum distance in the manufacturing process can be suppressed. accordingly, the distance between the gate electrode layer 401 and the region in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b can be made short, so that the resistance between the channel formation region 403 and the region in which the oxide semiconductor layer 409 is in contact with the source electrode layer 406 a or the drain electrode layer 406 b is reduced; thus, the on-state characteristics of the transistor 520 can be improved. further, precise processing can be performed accurately because an etching step using a resist mask is not performed in a step for removing the conductive film 406 over the gate electrode layer 401 , which is one step of the formation process of the source electrode layer 406 a and the drain electrode layer 406 b . consequently, in a process for manufacturing the semiconductor device, a transistor having a miniaturized structure with less variation in shape or characteristics can be manufactured with high yield. further, in the semiconductor device described in this embodiment, the electrode layers 405 a and 405 b are provided under the source region and the drain region of the oxide semiconductor layer, so that the source region and the drain region can be thicker, the resistances of the source region and the drain region can be reduced, and the on-state characteristics of the transistor can be improved. this embodiment can be combined with any of the other embodiments as appropriate. (embodiment 3) in this embodiment, an example of a semiconductor device which includes any of the transistors described in embodiments 1 and 2, which can hold stored data even when not powered, and which does not have a limitation on the number of write cycles, is described with reference to drawings. note that the semiconductor device in this embodiment includes any of the transistors described in embodiments 1 and 2 as a transistor 162 . any of the structures of the transistors described in embodiments 1 and 2 can be used as the transistor 162 . figs. 8a to 8c illustrate an example of a structure of a semiconductor device. fig. 8a is a cross-sectional view of the semiconductor device, fig. 8b is a top view of the semiconductor device, and fig. 8c is a circuit diagram of the semiconductor device. here, fig. 8a corresponds to a cross section along line c 1 -c 2 and line d 1 -d 2 in fig. 8b . note that in fig. 8b , some components of the semiconductor device illustrated in fig. 8a are omitted for clarity. the semiconductor device illustrated in figs. 8a and 8b includes a transistor 160 including a first semiconductor material in a lower portion, and a transistor 162 including a second semiconductor material in an upper portion. the transistor 162 can have the same structure as any of the structures described in embodiment 1 and 2. here, the first semiconductor material and the second semiconductor material are preferably materials having different band gaps. for example, the first semiconductor material may be a semiconductor material other than an oxide semiconductor (e.g., silicon) and the second semiconductor material may be an oxide semiconductor. a transistor including a material other than an oxide semiconductor can operate at high speed easily. on the other hand, charge can be held in a transistor including an oxide semiconductor for a long time owing to its characteristics. although all the transistors are n-channel transistors here, p-channel transistors can be used. in addition, because the technical nature of the disclosed invention is to use an oxide semiconductor in the transistor 162 so that data can be stored, it is not necessary to limit a specific structure of the semiconductor device, such as a material of the semiconductor device or a structure of the semiconductor device, to the structure described here. the transistor 160 in fig. 8a includes a channel formation region 116 provided in a substrate 185 containing a semiconductor material (e.g., silicon), impurity element regions 120 provided so that the channel formation region 116 is sandwiched therebetween, intermetallic compound regions 124 in contact with the impurity element regions 120 , a gate insulating layer 108 provided over the channel formation region 116 , and a gate electrode layer 110 provided over the gate insulating layer 108 . note that a transistor whose source electrode layer and drain electrode layer are not illustrated in a drawing may be referred to as a transistor for the sake of convenience. further, in such a case, in description of a connection of a transistor, a source region and a source electrode layer are collectively referred to as a “source electrode layer,” and a drain region and a drain electrode layer are collectively referred to as a “drain electrode layer”. that is, in this specification, the term “source electrode layer” may include a source region. further, an element isolation insulating layer 106 is formed on the substrate 185 to surround the transistor 160 , and an insulating layer 130 is formed to cover the transistor 160 . in order to realize high integration, the transistor 160 preferably has a structure without a sidewall insulating layer as illustrated in fig. 8a . on the other hand, in the case where the characteristics of the transistor 160 are important, the sidewall insulating layers may be formed on side surfaces of the gate electrode layer 110 , and the impurity element regions 120 may include regions having different impurity element concentrations. the transistor 162 illustrated in fig. 8a includes an oxide semiconductor in the channel formation region. here, an oxide semiconductor layer 144 included in the transistor 162 is preferably highly purified. by using a highly purified oxide semiconductor, the transistor 162 which has extremely favorable off-state current characteristics can be obtained. any of the transistors described in embodiments 1 and 2 can be applied to the transistor 162 . since the off-state current of the transistor 162 is small, stored data can be held for a long time owing to such a transistor. in other words, power consumption can be sufficiently reduced because a semiconductor device in which refresh operation is unnecessary or the frequency of refresh operation is extremely low can be provided. the transistor 162 includes, over and in contact with the insulating layer 130 , an electrode layer 143 a in contact with the gate electrode layer 110 , an electrode layer 143 b , and an insulating layer 145 in which the electrode layers 143 a and 143 b are embedded. by cmp treatment performed when top surfaces of the electrode layers 143 a and 143 b is exposed form the insulating layer 145 , planarization treatment can be performed on a surface on which the oxide semiconductor layer 144 is to be formed. the surface on which the oxide semiconductor layer 144 is to be formed is sufficiently planarized (the average surface roughness of the top surfaces of the electrode layer and the base insulating layer is preferably less than or equal to 0.15 nm), so that the oxide semiconductor layer 144 having excellent crystallinity can be formed, and the transistor 162 can have favorable characteristics. in the process for manufacturing the transistor 162 , a conductive film provided over a gate insulating layer 146 , a gate electrode layer 148 , an insulating film 137 , and sidewall insulating layers 136 a and 136 b is removed by chemical mechanical polishing treatment to form electrode layers 142 a and 142 b. accordingly, in the transistor 162 , the distance between the gate electrode layer 148 and a region (contact region) in which the oxide semiconductor layer 144 is in contact with the electrode layer 142 a or the electrode layer 142 b which functions as a source or drain electrode layer can be made short, so that the resistance between a channel formation region 144 c and the region (contact region) in which the oxide semiconductor layer 144 is in contact with the electrode layer 142 a or the electrode layer 142 b is reduced; thus, the on-state characteristics of the transistor 162 can be improved. precise processing can be performed accurately because an etching step using a resist mask is not performed in a step for removing the conductive film which overlaps the gate electrode layer 148 , which is one step of the formation process of the electrode layers 142 a and 142 b . consequently, in a process for manufacturing the semiconductor device, a transistor having a miniaturized structure with less variation in shape or characteristics can be manufactured with high yield. an insulating layer 135 and an insulating layer 140 are provided over the electrode layers 142 a and 142 b . through openings provided in the insulating layer 135 and the insulating layer 140 , a wiring layer 157 a is provided in contact with the electrode layer 142 a which functions as a source or drain electrode layer, and a wiring layer 157 b is provided in contact with the electrode layer 142 b which functions as a source or drain electrode layer. further, the wiring layers 157 a and 157 b are provided to overlap with the electrode layers 143 a and 143 b , respectively. the oxide semiconductor layer 144 is in contact with the electrode layer 142 a and the electrode layer 142 b which function as the source electrode layer and the drain electrode layer while the electrode layer 142 a and the electrode layer 142 b overlap with the electrode layers 143 a and 143 b , respectively; thus, the thickness of the source region and the drain region of the transistor can be made greater, the contact resistance between the oxide semiconductor layer 144 and each of the source and drain electrode layers can be reduced, and the transistor 162 can have favorable on-state characteristics. further, the oxide semiconductor layer 144 is subjected to treatment for introducing an impurity element. by performing the treatment for introducing an impurity element into the oxide semiconductor layer 144 using the gate electrode layer 148 as a mask, a low-resistance region 144 a , a low-resistance region 144 b , and the channel formation region 144 c are formed in a self-aligned manner in the oxide semiconductor layer 144 . the low-resistance region 144 a and the low-resistance region 144 b have higher impurity element concentrations than the channel formation region 144 c . when the impurity element concentration is made high, carrier density in the oxide semiconductor layer 144 is increased and the contact resistance between the oxide semiconductor layer 144 and each of the electrode layers 142 a and 142 b is reduced. accordingly, on-state current or mobility can be improved and high-speed response can be achieved. an insulating layer 150 is provided over the transistor 162 . further, an electrode layer 156 is provided in a region which is over the insulating layer 150 and overlaps with the wiring layer 157 a . a capacitor 164 includes the electrode layer 156 , the insulating layer 150 , and the wiring layer 157 a . that is, the source electrode layer 157 a of the transistor 162 functions as one electrode of the capacitor 164 , and the electrode layer 156 functions as the other electrode of the capacitor 164 . note that the capacitor 164 may be omitted if a capacitor is not needed. alternatively, the capacitor 164 may be separately provided above the transistor 162 . in figs. 8a and 8b , the transistor 160 is provided to overlap with at least part of the transistor 162 . the source region or the drain region of the transistor 160 is preferably provided to overlap with part of the oxide semiconductor layer 144 . further, the transistor 162 and the capacitor 164 are provided to overlap with at least part of the transistor 160 . with such a planar layout, the area occupied by the semiconductor device can be reduced; thus, higher integration can be achieved. next, an example of a circuit configuration corresponding to figs. 8a and 8b is illustrated in fig. 8c . in fig. 8c , a first line (1st line) is electrically connected to a source electrode layer of the transistor 160 . a second line (2nd line) is electrically connected to a drain electrode layer of the transistor 160 . a third line (a 3rd line) and one of source or drain electrode layers of the transistor 162 are electrically connected to each other, and a fourth line (a 4th line) and a gate electrode layer of the transistor 162 are electrically connected to each other. a gate electrode layer of the transistor 160 and the other of the source electrode layer and the drain electrode layer of the transistor 162 are electrically connected to one electrode of a capacitor 164 , and a fifth line (a 5th line) and the other electrode of the capacitor 164 are electrically connected to each other. the semiconductor device in fig. 8c utilizes a characteristic in which the potential of the gate electrode layer of the transistor 160 can be held, and thus enables data writing, holding, and reading as follows. writing and holding of data are described. first, the potential of the fourth line is set to a potential at which the transistor 162 is turned on, so that the transistor 162 is turned on. accordingly, the potential of the third line is supplied to the gate electrode layer of the transistor 160 and the capacitor 164 . that is, a predetermined charge is given to the gate electrode layer of the transistor 160 (writing). here, one of two kinds of charges providing different potential levels (hereinafter referred to as a low-level charge and a high-level charge) is applied. after that, the potential of the fourth line is set to a potential at which the transistor 162 is turned off, so that the transistor 162 is turned off. thus, the charge given to the gate electrode layer of the transistor 160 is held (holding). since the off-state current of the transistor 162 is extremely small, the charge of the gate electrode layer of the transistor 160 is held for a long time. next, reading of data is described. by supplying an appropriate potential (reading potential) to the fifth line while a predetermined potential (constant potential) is supplied to the first line, the potential of the second line varies depending on the amount of charge held in the gate electrode layer of the transistor 160 . this is because in general, when the transistor 160 is an n-channel transistor, an apparent threshold voltage v th — h in the case where a high level charge is given to the gate electrode layer of the transistor 160 is lower than an apparent threshold voltage v th — l in the case where a low level charge is given to the gate electrode layer of the transistor 160 . here, an apparent threshold voltage refers to the potential of the fifth line, which is needed to turn on the transistor 160 . thus, the potential of the fifth line is set to a potential v 0 which is between v th — h and v th — l , whereby charge given to the gate electrode layer of the transistor 160 can be determined. for example, in the case where a high level charge is given in writing, when the potential of the fifth line is set to v 0 (>v th — h ), the transistor 160 is turned on. in the case where a low level charge is given in writing, even when the potential of the fifth line is set to v 0 (<v th — l ), the transistor 160 remains in an off state. therefore, the stored data can be read by the potential of the second line. note that in the case where memory cells are arrayed to be used, only data of desired memory cells needs to be read. in the case of a memory cell in which reading is not performed, a potential at which the transistor 160 is turned off, that is, a potential smaller than v th — h may be given to the fifth line regardless of the state of the gate electrode layer of the transistor 160 . alternatively, a potential which allows the transistor 160 to be turned on regardless of a state of the gate electrode layer, that is, a potential higher than v th — l may be applied to the fifth line. when a transistor having a channel formation region formed using an oxide semiconductor and having extremely small off-state current is applied to the semiconductor device in this embodiment, the semiconductor device can store data for an extremely long period. in other words, power consumption can be adequately reduced because refresh operation becomes unnecessary or the frequency of refresh operation can be extremely low. moreover, stored data can be held for a long period even when power is not supplied (note that a potential is preferably fixed). further, in the semiconductor device described in this embodiment, high voltage is not needed for writing data and there is no problem of deterioration of elements. for example, unlike a conventional non-volatile memory, it is not necessary to inject and extract electrons into and from a floating gate; thus, the problem of deterioration of a gate insulating layer does not occur. in other words, the semiconductor device according to one embodiment of the disclosed invention does not have a limit on the number of times of writing which is a problem in a conventional nonvolatile memory, and reliability thereof is drastically improved. furthermore, data is written depending on the on state and the off state of the transistor, whereby high-speed operation can be easily realized. figs. 9a and 9b illustrate another example of the structure of the semiconductor device. figs. 9a and 9b are a top view and a cross-sectional view of the semiconductor device, respectively. here, fig. 9b corresponds to a cross section along line e 1 -e 2 in fig. 9a . note that in fig. 9a , some components of the semiconductor device illustrated in fig. 9b are omitted for clarity. a semiconductor device illustrated in figs. 9a and 9b includes the transistor 162 in which a channel is formed in an oxide semiconductor layer, the transistor 160 in which a channel is formed in a layer of a semiconductor material other than an oxide semiconductor (e.g., silicon), and the capacitor 164 . the structures of the transistors 162 and 160 are similar to that of the semiconductor device illustrated in figs. 8a and 8b ; thus, detailed description thereof is omitted here. in figs. 9a and 9b , the capacitor 164 includes the electrode layer 143 b , the oxide semiconductor layer 144 , an insulating layer 173 , and a conductive layer 174 . the conductive layer 174 is formed in the same step as the gate electrode layer 148 , and a top surface of the conductive layer 174 is covered with the insulating film 176 and side surfaces of the conductive layer 174 are covered with sidewall insulating layers 175 a and 175 b. by introducing an impurity element into the oxide semiconductor layer 144 using the gate electrode layer 148 and the conductive layer 174 as masks, low-resistance regions are formed in a self-aligned manner in a region of the oxide semiconductor layer 144 which does not overlap with the gate electrode layer 148 and the conductive layer 174 . the electrode layers 142 a and 142 b functioning as a source electrode layer and a drain electrode layer are in contact with the low-resistance regions of the oxide semiconductor layer 144 and function as a source region and a drain region of the transistor 162 ; thus, the contact resistance between the oxide semiconductor layer 144 and each of the source and drain electrode layers can be reduced. the electrode layers 143 a and 143 b are provided under and in contact with the low-resistance regions functioning as a source region and a drain region. thus, the thickness of the source region and the drain region is increased, and the contact resistance between the oxide semiconductor layer 144 and each of the source and drain electrode layers is reduced. the electrode layer 142 b of the transistor 162 is electrically connected to the electrode layer 156 in an opening which is formed in the insulating layer 135 and the insulating layer 150 and reaches the electrode layer 142 b . a conductive layer 172 is formed under and in contact with the electrode layer 143 a , and a source electrode layer or a drain electrode layer of the transistor 160 is electrically connected with a source electrode layer or a drain electrode layer of the transistor 162 . as illustrated in figs. 9a and 9b , the transistor 160 , the transistor 162 , and the capacitor 164 are closely stacked to overlap with each other. accordingly, the area occupied by the semiconductor device can be reduced; thus, higher integration can be achieved. in the transistor 162 described in this embodiment, the electrode layer is formed under and in contact with the oxide semiconductor layer, and treatment for introducing an impurity element into the oxide semiconductor layer using the gate electrode layer as a mask is performed. thus, the transistor 162 can have favorable electrical characteristics and off-state current can be sufficiently reduced. then, by using such a transistor, a semiconductor device in which stored data can be stored for an extremely long time can be obtained. the above transistor has high on-state characteristics (e.g., on-state current) and is capable of high-speed operation and high-speed response. further, the transistor can be miniaturized. accordingly, by using the transistor, a high-performance, highly reliable semiconductor device can be provided. the structures and methods described in this embodiment can be combined as appropriate with any of the structures and methods described in the other embodiments. (embodiment 4) in this embodiment, in a semiconductor device which includes any of the transistors described in embodiment 1 and 2, which can hold stored data even when not powered, and which does not have a limitation on the number of write cycles, a structure which is different from the structure described in embodiment 3 is described with reference to figs. 10a and 10b , fig. 11 , figs. 12a and 12b , and figs. 13a and 13b . note that in a semiconductor device in this embodiment, any of the transistors described in embodiments 1 and 2 can be used as the transistor 162 . fig. 10a illustrates an example of a circuit configuration of a semiconductor device, and fig. 10b is a conceptual diagram illustrating an example of a semiconductor device. first, the semiconductor device illustrated in fig. 10a is described, and then, the semiconductor device illustrated in fig. 10b is described below. in the semiconductor device illustrated in fig. 10a , a bit line bl is electrically connected to the source electrode or the drain electrode layer of the transistor 162 , a word line wl is electrically connected to the gate electrode layer of the transistor 162 , and the source electrode layer or the drain electrode layer of the transistor 162 is electrically connected to a first terminal of a capacitor 254 . off-state current is extremely small in the transistor 162 formed using an oxide semiconductor. for that reason, a potential of the first terminal of the capacitor 254 (or a charge accumulated in the capacitor 254 ) can be held for an extremely long period by turning off the transistor 162 . next, writing and holding of data in the semiconductor device (a memory cell 250 ) illustrated in fig. 10a are described. first, the potential of the word line wl is set to a potential at which the transistor 162 is turned on, so that the transistor 162 is turned on. thus, the potential of the bit line bl is supplied to the first terminal of the capacitor 254 (writing). after that, the potential of the word line wl is set to a potential at which the transistor 162 is turned off, so that the transistor 162 is turned off. thus, the potential of the first terminal of the capacitor 254 is held (holding). the transistor 162 has extremely small off-state current; thus, a potential of the first terminal of the capacitor 254 (or a charge accumulated in the capacitor 254 ) can be held for a long period. next, reading of data is described. when the transistor 162 is turned on, the bit line bl which is in a floating state and the capacitor 254 are electrically connected to each other, and the charge is redistributed between the bit line bl and the capacitor 254 . as a result, the potential of the bit line bl is changed. the amount of change in potential of the bit line bl varies depending on the potential of the first terminal of the capacitor 254 (or the charge accumulated in the capacitor 254 ). for example, the potential of the bit line bl after charge redistribution is (c b ×v b0 +c×v)/(c b +c), where v is the potential of the first terminal of the capacitor 254 , c is the capacitance of the capacitor 254 , c b is the capacitance of the bit line bl (hereinafter also referred to as bit line capacitance), and v b0 is the potential of the bit line bl before the charge redistribution. therefore, it can be found that assuming that the memory cell 250 is in either of two states in which the potentials of the first terminal of the capacitor 254 are v 1 and v 0 (v 1 >v 0 ), the potential of the bit line bl in the case of holding the potential v 1 (=(c b ×v b0 +c×v 1 )/(c b +c)) is higher than the potential of the bit line bl in the case of holding the potential v 0 (=(c b ×v b0 +c×v 0 )/(c b +c)). then, by comparing the potential of the bit line bl with a predetermined potential, data can be read. as described above, since the off-state current of the transistor 162 is extremely small, the semiconductor device illustrated in fig. 10a can hold a charge that is accumulated in the capacitor 254 for a long time. in other words, power consumption can be adequately reduced because refresh operation becomes unnecessary or the frequency of refresh operation can be extremely low. moreover, stored data can be stored for a long time even when power is not supplied. next, the semiconductor device illustrated in fig. 10b is described. the semiconductor device illustrated in fig. 10b includes memory cell arrays 251 a and 251 b including a plurality of memory cells 250 illustrated in fig. 10a as memory circuits in an upper portion, and a peripheral circuit 253 in a lower portion which is necessary for operating a memory cell array 251 (the memory cell arrays 251 a and 251 b ). note that the peripheral circuit 253 is electrically connected to the memory cell array 251 . in the structure illustrated in fig. 10b , the peripheral circuit 253 can be provided under the memory cell array 251 (the memory cell arrays 251 a and 251 b ). thus, the size of the semiconductor device can be decreased. it is preferable that a semiconductor material of the transistor provided in the peripheral circuit 253 be different from that of the transistor 162 . for example, silicon, germanium, silicon germanium, silicon carbide, gallium arsenide, or the like can be used, and a single crystal semiconductor is preferably used. alternatively, an organic semiconductor material or the like may be used. a transistor including such a semiconductor material can operate at sufficiently high speed. therefore, a variety of circuits (e.g., a logic circuit or a driver circuit) which needs to operate at high speed can be favorably realized by the transistor. note that fig. 10b illustrates, as an example, the semiconductor device in which two memory cell arrays 251 (the memory cell array 251 a and the memory cell array 251 b ) are stacked; however, the number of memory cell arrays to be stacked is not limited thereto. three or more memory cell arrays may be stacked. next, a specific structure of the semiconductor device illustrated in figs. 10a and 10b is described with reference to fig. 11 . fig. 11 is a cross sectional view of a semiconductor device. the semiconductor device illustrated in fig. 11 includes a plurality of memory cell arrays 251 stacked in the upper portion and the peripheral circuit 253 in a lower portion. the memory cell arrays 251 and the peripheral circuit 253 are electrically connected to each other. fig. 11 illustrates the memory cell array 251 a and the memory cell array 251 b as representative examples of the plurality of memory cell arrays, and the peripheral circuit 253 . a transistor 162 a and a capacitor 254 a which are included in the memory cell array 251 a and an electrode layer 343 c which connects the memory cell array 251 a and another memory cell are illustrated as representative examples. in the transistor 162 a , a channel is formed in an oxide semiconductor layer. any of the transistors described in embodiments 1 and 2 can be used as the transistor 162 a ; thus, description thereof is omitted here. the capacitor 254 a includes a source electrode layer of the transistor 162 a and an electrode which is formed in the same layer as a wiring layer. the electrode layer 343 c is formed in the same layer as the electrode layers 143 a and 143 b included in the transistor 162 a. a transistor 162 b and a capacitor 254 b which are included in the memory cell array 251 b , an electrode layer 343 b which connects the memory cell array 251 b and another memory cell, and an electrode layer 343 a which connects the memory cell array 251 b and the peripheral circuit 253 are illustrated as representative examples. in the transistor 162 b , a channel is formed in an oxide semiconductor layer. any of the transistors described in embodiments 1 and 2 can be used as the transistor 162 b ; thus, description thereof is omitted here. the capacitor 254 b includes a source electrode layer of the transistor 162 b and an electrode which is formed in the same layer as a wiring layer. the electrode layer 343 b is formed in the same layer as the wiring layers 157 a and 157 b included in the transistor 162 b . the electrode layer 343 a is formed in the same layer as the electrode layers 143 a and 143 b included in the transistor 162 b. the periphery circuit 253 includes a transistor 301 in which a semiconductor material other than an oxide semiconductor is used for a channel formation region. the transistor 301 has a structure in which element separation insulating layers 306 are formed over a substrate 300 containing a semiconductor material (e.g., silicon) and a channel region is formed in a region sandwiched between the element separation insulating layers 306 . note that the transistor 301 may have a structure in which a channel is formed in a semiconductor layer, such as a silicon layer formed on an insulating surface, or in a silicon layer of an soi substrate. a known structure can be used as the structure of the transistor 301 . a wiring layer 310 a is provided between the periphery circuit 253 and the memory cell array 251 b . an insulating layer 341 a is provided between the periphery circuit 253 and the wiring layer 310 a . an insulating layer 341 b is provided between the wiring layer 310 a and the memory cell array 251 b . the insulating layer 341 a is provided with a wiring layer 355 a which electrically connects the periphery circuit 253 and the wiring layer 310 a . the insulating layer 341 b is provided with a wiring layer 355 b which electrically connects the wiring layer 310 a and the memory cell array 251 b. note that the periphery circuit 253 and the memory cell array 251 b are electrically connected to each other through the wiring layer 310 a here; however, a method for connecting the periphery circuit 253 and the memory cell array 251 b is not limited thereto. the periphery circuit 253 and the memory cell array 251 b are electrically connected to each other in a region which does not overlap with the transistor 301 and the transistor 162 b here; however, the structure is not limited thereto. for example, the electrode layers 143 a and 143 b included in the transistor 162 b may be directly connected to the periphery circuit 253 . a wiring layer 310 b is provided between the memory cell array 251 a and the memory cell array 251 b . the wiring layer 310 b is provided over an insulating layer 341 c provided in the memory cell array 251 b . an insulating layer 341 d is provided between the wiring layer 310 b and the memory cell array 251 a . the insulating layer 341 c is provided with a wiring layer 355 c which electrically connects the wiring layer 310 b and the memory cell array 251 b . the insulating layer 341 d is provided with a wiring layer 355 d which electrically connects the wiring layer 310 b and the memory cell array 251 a. when the layout illustrated in fig. 11 is employed, the area occupied by the semiconductor device can be reduced; thus, the degree of integration can be increased. figs. 12a and 12b and figs. 13a and 13b illustrate other examples of the semiconductor device which can be applied to the memory cell 250 illustrated in figs. 10a and 10b . fig. 12a and fig. 12b are a top view and a cross-sectional view of the semiconductor device, respectively. here, fig. 12b corresponds to a cross section along line f 1 -f 2 in fig. 12a . note that in fig. 12a , some components of the semiconductor device illustrated in fig. 12b are omitted for clarity. a memory cell in figs. 12a and 12b includes the transistor 162 in which a channel is formed in an oxide semiconductor layer and the capacitor 254 . the structure of the transistor 162 is similar to that of the transistors 162 illustrated in figs. 8a and 8b ; thus, detailed description thereof is omitted here. in figs. 12a and 12b , the capacitor 254 includes the electrode layer 143 b , the oxide semiconductor layer 144 , the insulating layer 173 , and the conductive layer 174 . the conductive layer 174 is formed in the same step as the gate electrode layer 148 , and a top surface of the conductive layer 174 is covered with the insulating film 176 and side surfaces of the conductive layer 174 are covered with the sidewall insulating layers 175 a and 175 b. by introducing an impurity element into the oxide semiconductor layer 144 using the gate electrode layer 148 and the conductive layer 174 as masks, low-resistance regions are formed in a self-aligned manner in a region of the oxide semiconductor layer 144 which does not overlap with the gate electrode layer 148 and the conductive layer 174 . the electrode layers 142 a and 142 b functioning as a source electrode layer and a drain electrode layer are in contact with the low-resistance regions of the oxide semiconductor layer 144 and function as a source region and a drain region of the transistor 162 ; thus, the contact resistance between the oxide semiconductor layer 144 and each of the source and drain electrode layers can be reduced. the electrode layer 142 b of the transistor 162 is electrically connected to a wiring 260 in an opening which is formed in the insulating layer 135 and the insulating layer 150 and reaches the electrode layer 142 b. fig. 13a and fig. 13b are a top view and a cross-sectional view of the semiconductor device, respectively. here, fig. 13b corresponds to a cross section along line g 1 -g 2 in fig. 13a . note that in fig. 13a , some components of the semiconductor device illustrated in fig. 13b are omitted for clarity. the memory cell in figs. 13a and 13b includes the transistor 162 in which a channel is formed in an oxide semiconductor layer and the capacitor 254 . the structure of the transistor 162 is similar to that of the transistors 162 illustrated in figs. 8a and 8b ; thus, detailed description thereof is omitted here. in figs. 13a and 13b , the capacitor 254 includes a conductive layer 192 , an insulating layer 193 , and a conductive layer 194 , and is formed in an insulating film 196 . note that an insulating material having high dielectric constant is preferably used for the insulating layer 193 . the capacitor 254 and the transistor 162 are electrically connected to each other through a conductive layer 191 provided in the opening which is formed in the interlayer insulating layer 135 , the insulating layer 150 , and an insulating film 195 and reaches the electrode layer 142 b of the transistor 162 . by introducing an impurity element into the oxide semiconductor layer 144 using the gate electrode layer 148 as a mask, low-resistance regions are formed in a self-aligned manner in a region of the oxide semiconductor layer 144 which does not overlap with the gate electrode layer 148 . the electrode layers 142 a and 142 b functioning as a source electrode layer and a drain electrode layer are in contact with the low-resistance regions of the oxide semiconductor layer 144 and function as a source region and a drain region of the transistor 162 ; thus, the contact resistance between the oxide semiconductor layer 144 and each of the source and drain electrode layers can be reduced. as illustrated in figs. 12a and 12b and figs. 13a and 13b , the transistor 162 and the capacitor 254 are closely stacked to overlap with each other, whereby the occupied area of the semiconductor device can be decreased; thus, the semiconductor device can be highly integrated. as described above, the plurality of memory cells formed in the upper portion of the semiconductor device includes the transistors including an oxide semiconductor. since the off-state current of the transistor including an intrinsic oxide semiconductor which is highly purified is small, stored data can be held for a long time with the use of such a transistor. in other words, the frequency of the refresh operation can be extremely lowered, which leads to a sufficient reduction in power consumption. a semiconductor device having a novel feature can be obtained by being provided with both a peripheral circuit including the transistor including a material other than an oxide semiconductor (in other words, a transistor capable of operating at sufficiently high speed) and a memory circuit including the transistor including an oxide semiconductor (in a broader sense, a transistor whose off-state current is sufficiently small). in addition, with a structure where the peripheral circuit and the memory circuit are stacked, the degree of integration of the semiconductor device can be increased. in the transistor 162 described in this embodiment, the electrode layer is formed under and in contact with the oxide semiconductor layer, and treatment for introducing an impurity element into the oxide semiconductor layer using the gate electrode layer as a mask is performed. thus, the transistor 162 can have favorable electrical characteristics and off-state current can be sufficiently reduced. further, with the use of such a transistor, a semiconductor device in which stored data can be stored for an extremely long time can be obtained. the transistor described above has high on-state characteristics (e.g., on-state current) and is capable of high-speed operation and high-speed response. further, the transistor can be miniaturized. accordingly, with the use of the transistor, a high-performance, highly reliable semiconductor device can be provided. this embodiment can be implemented in appropriate combination with the structures described in the other embodiments. (embodiment 5) in this embodiment, examples of application of the semiconductor device described in any of the above embodiments to portable devices such as cellular phones, smartphones, or e-book readers are described with reference to figs. 14a and 14b , fig. 15 , fig. 16 , and fig. 17 . in portable devices such as a mobile phone, a smartphone, and an e-book reader, an sram or a dram is used so as to store image data temporarily. an sram or a dram is used because a flash memory, whose response is slow, is unsuitable to be used for image processing. on the other hand, an sram or a dram has the following characteristics when used for temporary storage of image data. in an ordinary sram, as illustrated in fig. 14a , one memory cell includes six transistors, that is, transistors 801 to 806 , which are driven with an x decoder 807 and a y decoder 808 . the transistors 803 and 805 and the transistors 804 and 806 each serve as an inverter, and high-speed driving can be performed therewith. however, an sram has a disadvantage of large cell area because one memory cell includes six transistors. provided that the minimum feature size of a design rule is f, the area of a memory cell in an sram is generally 100 f 2 to 150 f 2 . therefore, a price per bit of an sram is expensive. on the other hand, as illustrated in fig. 14b , a memory cell in a dram includes a transistor 811 and a storage capacitor 812 , and is driven by an x decoder 813 and a y decoder 814 . one cell includes one transistor and one capacitor and thus the area of a memory cell is small. the area of a memory cell of a dram is generally less than or equal to 10 f 2 . note that the dram needs to be refreshed periodically and consumes electric power even when a rewriting operation is not performed. however, the area of the memory cell of the semiconductor device described in the above embodiments is about 10 f 2 and frequent refreshing is not needed. therefore, the area of a memory cell can be decreased, and power consumption can be reduced. next, a block diagram of a portable device is illustrated in fig. 15 . the portable device illustrated in fig. 15 includes an rf circuit 901 , an analog baseband circuit 902 , a digital baseband circuit 903 , a battery 904 , a power supply circuit 905 , an application processor 906 , a flash memory 910 , a display controller 911 , a memory circuit 912 , a display 913 , a touch sensor 919 , an audio circuit 917 , a keyboard 918 , and the like. the display 913 includes a display portion 914 , a source driver 915 , and a gate driver 916 . the application processor 906 includes a cpu 907 , a dsp 908 , and an interface (if) 909 . in general, the memory circuit 912 includes an sram or a dram; by employing the semiconductor device described in any of the above embodiments for the memory circuit 912 , it is possible to provide a portable device in which writing and reading of data can be performed at high speed, data can be held for a long time, and power consumption can be sufficiently reduced. fig. 16 illustrates an example of using the semiconductor device described in any of the above embodiments in a memory circuit 950 for a display. the memory circuit 950 illustrated in fig. 16 includes a memory 952 , a memory 953 , a switch 954 , a switch 955 , and a memory controller 951 . the memory circuit 950 is connected to a display controller 956 that reads and controls image data input through a signal line (input image data) and data stored in the memory 952 and the memory 953 (stored image data), and is also connected to a display 957 that displays an image based on a signal input from the display controller 956 . first, image data (input image data a) is formed by an application processor (not shown). the input image data a is stored in the memory 952 through the switch 954 . the image data (stored image data a) stored in the memory 952 is transmitted and displayed to the display 957 through the switch 955 and the display controller 956 . in the case where the input image data a is not changed, the stored image data a is read from the memory 952 through the switch 955 by the display controller 956 normally at a frequency of approximately 30 hz to 60 hz. next, for example, when data displayed on the screen is rewritten by a user (that is, in the case where the input image data a is changed), new image data (input image data b) is formed by the application processor. the input image data b is stored in the memory 953 through the switch 954 . the stored image data a is read periodically from the memory 952 through the switch 955 even during that time. after the completion of storing the new image data (stored image data b) in the memory 953 , from the next frame for the display 957 , the stored image data b starts to be read, transmitted to the display 957 through the switch 955 and the display controller 956 , and displayed on the display 957 . this reading operation is continued until another new image data is stored in the memory 952 . by alternately writing and reading image data to and from the memory 952 and the memory 953 as described above, images are displayed on the display 957 . the memories 952 and 953 are not necessarily different memories, and a memory region included in one memory may be divided to be used. by employing the semiconductor device described in any of the above embodiments for the memory 952 and the memory 953 , data can be written and read at high speed and held for a long time, and power consumption can be sufficiently reduced. next, a block diagram of an e-book reader is illustrated in fig. 17 . the e-book reader in fig. 17 includes a battery 1001 , a power supply circuit 1002 , a microprocessor 1003 , a flash memory 1004 , an audio circuit 1005 , a keyboard 1006 , a memory circuit 1007 , a touch panel 1008 , a display 1009 , and a display controller 1010 . here, the semiconductor device described in any of the above embodiments can be used for the memory circuit 1007 in fig. 17 . the memory circuit 1007 has a function of temporarily holding the contents of a book. for example, when a user uses a highlight function, the memory circuit 1007 stores and holds data of a portion specified by the user. note that the highlight function is used to make a difference between a specific portion and the other portions while reading an e-book, by marking the specific portion, e.g., by changing the display color, underlining, making characters bold, changing the font of characters, or the like. in order to store the data for a short time, the data may be stored in the memory circuit 1007 . in order to store the data for a long time, the data stored in the memory circuit 1007 may be copied to the flash memory 1004 . also in such a case, by employing the semiconductor device described in any of the above embodiments, data can be written and read at high speed and held for a long time, and power consumption can be sufficiently reduced. as described above, the semiconductor device in any of the above embodiments is mounted on each of the portable devices described in this embodiment. therefore, a portable device in which writing and reading of data are performed at high speed, data is held for a long time, and power consumption is sufficiently reduced, can be obtained. the structures, methods, and the like described in this embodiment can be combined as appropriate with any of the structures, methods, and the like described in the other embodiments. this application is based on japanese patent application serial no. 2011-226135 filed with japan patent office on oct. 13, 2011, the entire contents of which are hereby incorporated by reference.
061-604-940-722-290	DE	[ "CH", "US", "DE", "FR", "GB" ]	G02F1/1335,G02F1/13357,G02F1/1345	1974-07-30T00:00:00	1974	[ "G02" ]	liquid crystal display device	a liquid crystal display screen having at least one liquid crystal cell and operating in a reflective mode of operation characterized by the screen having at least a pair of tandemly arranged chambers with all but one chamber being provided with transparent electrically conductive layers to provide electrode patterns for acting on liquid crystal material disposed therein, the remaining chamber being filled with a partially to completely reflecting medium which medium is inserted into the chamber while in either the gaseous or liquid state.	1. in a liquid crystal display screen having at least one liquid crystal cell and operating in a reflective mode, said screen having an outer transparent wall component coacting with a transparent thin wall component extending parallel and in spaced relationship thereto to form a chamber for a liquid crystal layer, said wall components having surfaces facing said layer provided with transparent electrically conductive coatings with at least one coating being in an electrode pattern, and means for reflecting light disposed on a surface of the thin wall component facing away from the liquid crystal layer, the improvement comprising said thin wall component coacting with a second outer wall component to form a sealed chamber, and said means for reflecting comprising a partially to completely reflecting medium disposed in the sealed chamber, said medium being inserted into the sealed chamber while in the gaseous or liquid state. 2. in a liquid crystal display screen according to claim 1, wherein each of the wall components consist of glass and are held in parallel spaced relationship by a plurality of u-shaped members engaging the edges of the components and wherein the chambers are hermetically sealed by glass solder securing the edges of the wall components together. 3. in a liquid crystal display screen according to claim 1, wherein the medium is a fluorescent liquid. 4. in a liquid crystal display screen according to claim 3, wherein the second outer wall component is provided with a reflective metal layer. 5. in a liquid crystal display screen according to claim 1, wherein the reflective medium is selected from a group consisting of metal and metal alloys. 6. in a liquid crystal display screen according to claim 5, wherein said reflective medium is mercury. 7. in a liquid crystal display screen according to claim 5, wherein the medium is wood's alloy. 8. in a liquid crystal display screen according to claim 1, wherein the reflective medium is a liquid of high viscosity containing finely dispersed deposits of metal powder.	background of the invention 1. field of the invention the present invention relates to a liquid crystal screen having at least one liquid crystal cell and operating in a reflective mode. 2. prior art reflective liquid crystal display elements, the optical effect of the represented image can be simply improved by reflecting the oncoming light on a wall component which when considered from the position of the observer, lies at the rear of the screen. reflectors suitable for this purpose have usually been provided in the form of a vapor-deposited layers of metal on a surface of a rear component or member of the display screen. however, two problems exist with using the metal layer. one of these problems is that the metal layer cannot be in contact with the material of the liquid crystal layer on account of a chemical reaction between the metal layer and the material which reaction would cause damage to the liquid crystal layer. the other problem is providing the layer as close as possible to the liquid crystal layer in order to reduce to a minimum any shading effects or parallax errors which would impair the clarity of the image when it is observed from the other side. one solution to the above problems is to provide an insulating film which has a thickness of a maximum of 51 .mu.m and which may consist of sio.sub.2 among other materials. this insulating film acts as electrode bearing transparent layer which is disposed between the liquid crystal layer and the reflective wall component. such a solution is described in u.s. pat. no. 3,612,654. instead of using an insulating film, it has also been suggested to use a self-supporting thin glass plate having a thickness of preferably 100-300 .mu.m and which is reflective on a rear surface. such a solution is suggested in a german offenlegungsschrift 2 338 558. both of these screen devices have image representations which, even at large angles of observation, are clear, but nevertheless, these solutions involve a series of fundamental production based shortcomings. for example, as mentioned in the u.s. patent, the insulating film can only be applied in the requisite minimum thickness to the substrate by an expensive process. the thin glass carrier described in the above mentioned offenlegungsschrift must be provided on one surface with the segmented electrodes and the other surface with the reflecting layer. then the thin glass carrier is mechanically secured to a thicker glass plate by being pressed thereagainst at increased temperatures and pressures with a thermal plastically deformable synthetic intermediate layer interposed therebetween to hold or secure the two members together. a liquid crystal display screen, which has a plurality of chambers which are arranged in a series and are separated from one another by glass plates have been suggested. an example is disclosed in u.s. pat. no. 3,645,604. in these known arrangements, the chambers always form active liquid crystal cells and serve to produce a gray scale. summary of the invention the present invention is directed to providing a reliable, mechanical sturdy liquid crystal display element or screen which supplies high contrast images, which can be easily recognized even when observed obliquely, and which screen can also be produced relatively cheaply. to accomplish this task, the invention is directed to an improvement in a liquid crystal display screen having at least one liquid crystal cell and operating in a reflective mode, said screen having an outer transparent wall component coacting with a transparent thin wall component extending parallel and in spaced relationship thereto to form a chamber for a liquid crystal layer, said wall components having surfaces facing said layer provided with transparent electrically conducting coatings with at least one coating being an electrode pattern, and means for reflecting light disposed on a surface of the thin wall component facing away from the liquid crystal layer. the improvement comprises the thin wall component coacting with a second outer wall component to form a sealed chamber and the means for reflecting comprising a partially to completely reflecting medium disposed in the sealed chamber with said medium being inserted in the sealed chamber while in a gaseous or liquid state. in this display screen, the optical contrast between the image and the background to the image is increased not as in the previously known devices by making the carrier faces reflective but by virtue of back scattering and reflecting of the light on a medium which fills a chamber. the medium at least when inserted in the chamber is in a liquid or gaseous state. when the background is in this form, the thin wall component which is provided with an electrode coating does not require any additional processes apart from having its edges secured to the other wall components. furthermore, over considerable temperature ranges, the thin wall component and the reflective medium are relieved of mechanical load, are protected from external influences and are components of an overall fracture-proof stable display element. preferably, all the wall components should be of glass and their edges should be secured to one another using a glass solder. in such a type of construction, the chambers are hermetically sealed and are durable. the structure of the chamber also prevents thermal stresses from being applied to the display element. preferred examples of the reflecting medium are the use of a fluorescent liquid, a medium selected from a group consisting of metal and metal alloys which is inserted into the chamber in a liquid form and a high viscosity liquid such as oil which contains a finely dispersed deposited metal powder or other suitable light scattering and reflecting particles. in the embodiment utilizing a fluorescent liquid as the reflecting medium, the outer wall component forming the sealed chamber may be provided with a reflective coating. in the embodiment utilizing a metal or metal alloy, the metal or metal alloy is preferably either one such as mercury which is liquid at room temperature or one which has a low melting point. brief desciption of the drawings the figure is a cross-sectional view of an indicator screen in accordance with the present invention. description of the preferred embodiment the principles of the present invention are particularly useful when incorporated in a liquid crystal display screen generally indicated at 10 in the figure. the screen is illuminated from the left such as from the direction of the arrow 12 and is also observed from this direction. the screen which is a single cell liquid crystal display screen comprises a front wall component or plate 1, a central thin wall component or foil 2 and a rear or second wall component or plate 3. all three wall components are preferably of glass plates having parallel extending surfaces. mica could also be selected as the material for the thin wall component 2, but the thickness of the thin wall component should never be greater than approximately 500 .mu.m. the glass plate 1 is provided on the side facing the thin foil 2 with a transparent electrically conductive coating 4 and the thin plate 2 is provided on a front side facing the wall component 1 with a transparent electrical conductive coating which is in the form of a plurality of strip electrodes 6. the coating 4 may be also strip electrodes which extend perpendicular to the strips 6. another example of electrode configuration is the coating 4 being a continuous coating with the coating on the thin member 2 being a segmented electrode of the desired pattern or configuration. in either type of electrode configuration, the electrically conducting coatings are transparent to light. in order to maintain the desired distance between the thin wall component 2 and the front wall component 1 and the second wall component 3, the peripheral areas of the two outer plates 1 and 3 are gripped by a number of u-shaped metal clips 7 so that one leg of each clip is positioned between the individual plates forming the wall components. the peripheral area of the plates or the wall components 1, 2 and 3 and the metal clips 7, which space these apart, are secured to one another with glass solder 8. in this arrangement, the space between the individual plates 1, 2 and 3 form two hermetically sealed chambers 9 and 10. the front chamber 9 is filled with a layer of liquid crystal material and the rear chamber 11 is filled with the reflecting medium. a more detailed discussion of the production of liquid crystal display screens is contained in co-pending u.s. patent applications, ser. nos. 497,878 and 545,108. the reflecting medium provided in chamber 11 may consist of a fluorescent liquid or gas. in this case, only a partial reflection or back scattering of the light which hits the medium in chamber 11 will occur. by the selection of the fluorescent medium having a suitable frequency-dependent absorption spectrum, it is possible to enable the image to be represented to appear even in front of a colored background which can be provided by a coating on the second wall component 3. a number of fluorescent materials or mixtures can be utilized. for example, a mixture of mercury vapor with either a thallium, silver, lead, sodium, cadmium or bismuth vapor. a discussion of fluorescent materials is given in herman franke, lexikon der physik, frankh'sche verlagshandlung, stuttgart, 1969, page 507. independent of the concrete absorption profile, the backscattering or reflecting medium always strengthens the scattering intensity of the liquid crystal zones which zones are subject to the voltage, and thus strengthens the brightness of the picture or image being created. in certain circumstances the backscattering intensity could be further increased by providing the second or rear outer wall component with either a reflective coating or as a reflecting member. instead of filling the chamber 11 with a fluorescent liquid, it may be filled with a metal or metal alloy such as mercury which is introduced in a liquid form. if the rear surface of the thin wall component 2 is flat, the metal contacting this surfaces acts as a fully reflective reflector. it is not necessary that the reflecting medium remain in a gaseous or liquid form or state at room temperatures, as is the case with the use of mercury. thus, other metals such as cadmium or tin or metal alloys having suitable low melting points, for example wood's alloy (a melting point of approximately 70.degree. c) can also be used. finally, the chamber 11 may be filled with a liquid having a high viscosity, for example an oil, which liquid contains a finely dispersed deposit or suspension of metal powders or other light scattering or reflecting particles. the screen 10 illustrated in the figure can be formed in such a manner that initially in the first step of production, the plates forming the wall components 1 and 2 are connected to one another. in the second step, the second outer wall component 3 is then attached to this unit. finally, the liquid crystal layer and the reflecting medium are inserted into the chambers 9 and 11. with this assembly sequence, particularly after the first step, one has available an elementary liquid crystal cell which is suitable for a series of different operating modes, for example, transillumination or tandem reflection operation, and thus facilitates the rationalization of the production of a whole program of modes. while the exemplary embodiment of the invention has been described as a display screen having a single liquid crystal cell and a chamber containing a reflective medium, the screen could have a plurality of series connected liquid crystal cells which are arranged in tandem. this is accomplished by providing additional thin wall components 2 between the outer two members 1 and 3 which additional thin wall members are spaced apart to provide additional sealed chambers. while the display screen of the present invention was discussed as being illuminated by daylight, it can be illuminated from a source of artificial light. finally, it is also possible to use other materials such as a phosphorescent medium instead of or in addition to the above mentioned reflecting medium in the rear chamber 11. the phosphorescence of suitable phosphors can be used to produce contrasts even in dark areas. for example, bright images, which are provided with daylight in front of a darker background, will appear at night as dark images in front of a bright background. although various minor modifications may be suggested by those versed in the art, it should be understood that i wish to employ within the scope of the patent granted hereon, all such modifications as reasonably and properly come within the scope of my contribution to the art.
064-609-759-762-88X	US	[ "US" ]	H01L21/78,H01L21/033,H01L21/304,H01L21/306,H01L21/3065,H01L21/56,H01L21/66,H01L21/683,H01L23/00,H01L23/31	2016-06-22T00:00:00	2016	[ "H01" ]	semiconductor die singulation methods	implementations of a method of singulating a plurality of die may include: providing a semiconductor wafer including a plurality of die located on a first side of the semiconductor wafer where the plurality of die include a desired thickness. the method may include etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer where the plurality of trenches is located adjacent to a perimeter of the plurality of die. a depth of the plurality of trenches may be greater than the desired thickness of the plurality of die. the method may also include mounting the first side of the semiconductor wafer to a backgrinding tape. the method may also include thinning a second side of the semiconductor wafer to a predetermined distance to the depth of the plurality of trenches to singulate the plurality of die.	1 . a method of singulating a plurality of die, the method comprising: providing a semiconductor wafer comprising a plurality of die located on a first side of the semiconductor wafer, the plurality of die comprising a desired thickness; etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer, the plurality of trenches located adjacent a perimeter of the plurality of die and a depth of the plurality of trenches being greater than the desired thickness of the plurality of die; mounting the first side of the semiconductor wafer to a back grinding tape; thinning a second side of the semiconductor wafer to a predetermined distance to the depth of the plurality of trenches to singulate the plurality of die. 2 . the method of claim 1 , wherein etching the plurality of trenches comprises plasma etching. 3 . the method of claim 1 , wherein etching the plurality of trenches further comprises defining a pattern of the plurality of trenches using one of passivation material, metal material, photolithographic masking, temporary film, shadow masking, and any combination thereof. 4 . the method of claim 1 , wherein the semiconductor wafer comprises silicon and etching the plurality of trenches further comprises using a deep reactive ion etch (drie) process. 5 . the method of claim 1 , further comprising at least one of the following after etching the plurality of trenches: forming a plurality of bumps on the plurality of die; testing one or more of the plurality of die; probing one or more of the plurality of die; adding memory data to one or more of the plurality of die; forming a solderable surface on a surface of one or more of the plurality of die; or any combination thereof. 6 . the method of claim 1 , wherein thinning the second side of the semiconductor wafer to the depth of the trenches further comprises using an edge ring grinding process. 7 . the method of claim 1 , further comprising picking the plurality of die from the back grinding tape. 8 . a method of singulating a plurality of die, the method comprising: providing a semiconductor wafer comprising a plurality of die located on a first side of the semiconductor wafer, the plurality of die comprising a desired thickness; etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer, the plurality of trenches located adjacent a perimeter of the plurality of die and a depth of the plurality of trenches being greater than the desired thickness of the plurality of die; forming a plurality of bumps on the plurality of die; mounting the first side of the semiconductor wafer to a back grinding tape; thinning a second side of the semiconductor wafer to a predetermined distance to the depth of the plurality of trenches to singulate the plurality of die. 9 . the method of claim 8 , wherein etching the plurality of trenches comprises plasma etching. 10 . the method of claim 8 , wherein etching the plurality of trenches further comprises defining a pattern of the plurality of trenches using one of passivation material, metal material, photolithographic masking, temporary film, shadow masking, or any combination thereof. 11 . the method of claim 8 , wherein the semiconductor wafer comprises silicon and etching the plurality of trenches further comprise using a deep reactive ion etch (drie) process. 12 . the method of claim 8 , further comprising at least one of the following after etching the plurality of trenches: testing one or more of the plurality of die; probing one or more of the plurality of die; adding memory data to one or more of the plurality of die; forming a solderable surface on a surface of one or more of the plurality of die; or any combination thereof. 13 . the method of claim 8 , wherein thinning the second side of the semiconductor wafer to the depth of the trenches further comprises using an edge ring grinding process. 14 . a method of singulating a plurality of die, the method comprising: providing a semiconductor wafer comprising a plurality of die located on a first side of the semiconductor wafer, the plurality of die comprising a desired thickness; etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer, the plurality of trenches located adjacent a perimeter of the plurality of die and a depth of the plurality of trenches being greater than the desired thickness of the plurality of die; mounting the first side of the semiconductor wafer to a back grinding tape; thinning a second side of the semiconductor wafer to the depth of the plurality of trenches; singulating the plurality of die through thinning the second side of the semiconductor wafer; and transferring the plurality of die from the back grinding tape to a transporting tape. 15 . the method of claim 14 , wherein etching the plurality of trenches comprises plasma etching. 16 . the method of claim 14 , wherein etching the plurality of trenches further comprises defining a pattern of the plurality of trenches using one of passivation material, metal material, photolithographic masking, temporary film, shadow masking, or any combination thereof. 17 . the method of claim 14 , wherein the semiconductor wafer comprises silicon and etching the plurality of trenches further comprises using a deep reactive ion etch (drie) process. 18 . the method of claim 14 , further comprising at least one of the following after etching the plurality of trenches: forming a plurality of bumps on the plurality of die; testing one or more of the plurality of die; probing one or more of the plurality of die; adding memory data to one or more of the plurality of die; forming a solderable surface on a surface of one or more of the plurality of die; or any combination thereof. 19 . the method of claim 14 , wherein thinning the second side of the semiconductor wafer to the depth of the trenches further comprises using an edge ring grinding process. 20 . the method of claim 14 , further comprising picking the plurality of die from the transporting tape.	cross reference to related applications this application is a continuation-in-part application of the earlier u.s. utility patent application to michael j. seddon entitled “semiconductor singulation methods,” application ser. no. 15/955,581, filed apr. 17, 2018, now pending, which is a divisional application of the earlier u.s. utility patent application to michael j. seddon entitled “semiconductor singulation methods,” application ser. no. 15/189,611, filed jun. 22, 2016, issued jun. 5, 2018, the disclosure of each of which are hereby incorporated entirely herein by reference. background 1. technical field aspects of this document relate generally to methods for singulating semiconductor die. 2. background semiconductor die (chips) contain electronic circuits and are typically fabricated simultaneously on a silicon wafer. after processing of the wafer, the die need to be separated from each other so they can be either sent for additional semiconductor packaging processing, or for inclusion into an electronic device. some singulating techniques involve using a saw blade. sawing is often done in two steps, a first wider width saw blade cut followed by a second narrower width saw blade cut that fully cuts through the wafer thickness. summary implementations of a method of singulating a plurality of die may include: providing a semiconductor wafer including a plurality of die located on a first side of the semiconductor wafer where the plurality of die include a desired thickness. the method may include etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer where the plurality of trenches is located adjacent to a perimeter of the plurality of die. a depth of the plurality of trenches may be greater than the desired thickness of the plurality of die. the method may also include mounting the first side of the semiconductor wafer to a backgrinding tape. the method may also include thinning a second side of the semiconductor wafer to a predetermined distance to the depth of the plurality of trenches to singulate the plurality of die. implementations of a first method of singulating a plurality of die may include one, all, or any of the following: etching the plurality of trenches may include plasma etching. etching the plurality of trenches may further include defining a pattern of the plurality of trenches using passivation material, metal material, photolithographic masking, temporary film, shadow masking, or any combination thereof. the semiconductor wafer may include silicon and etching the plurality of trenches may further include using a deep reactive ion etch (drie) process. the method may further include doing one of the following after etching the plurality of trenches: forming a plurality of bumps on the plurality of die; testing one or more of the plurality of die; probing one or more of the plurality of die; adding memory data to one or more of the plurality of die; forming a solderable surface on a surface of one or more of the plurality of die, or any combination thereof. thinning the second side of the semiconductor wafer to the depth of the trenches may include using an edge ring grinding process. the method may further include picking the plurality of die from the back grinding tape. implementations of a method of singulating a plurality of die may include providing a semiconductor wafer including a plurality of die located on a first side of the semiconductor wafer. the plurality of die may include a desired thickness. the method may also include etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer. the plurality of trenches may be located adjacent a perimeter of the plurality of die. the depth of the plurality of trenches may be greater than the desired thickness of the plurality of die. the method may include forming a plurality of bumps on the plurality of die. the method may include mounting the first side of the semiconductor wafer to a back grinding tape. the method may also include thinning a second side of the semiconductor wafer to a predetermined distance to the depth of the plurality of trenches to singulate the plurality of die. implementations of the second method of singulating the plurality of die may include one, all, or any of the following: etching the plurality of trenches may include plasma etching. etching the plurality of trenches may further include defining a pattern of the plurality of trenches using passivation material, metal material, photolithographic masking, temporary film, shadow masking, or any combination thereof. the semiconductor wafer may include silicon and etching the plurality of trenches may further include using a drie process. the method may further include doing one of the following after etching the plurality of trenches: testing one or more of the plurality of die, probing one or more of the plurality of die, adding memory data to one or more of the plurality of die, forming a solderable surface on a surface of one or more of the plurality of die, or any combination thereof. etching the second side of the semiconductor wafer to expose the plurality of trenches may further include etching using plasma etching, wet etching, or any combination thereof. thinning the second side of the semiconductor wafer to the depth of the trenches further comprises using an edge ring grinding process. implementations of a method of singulating a plurality of die may include: providing a semiconductor wafer including a plurality of die located one a first side of the semiconductor wafer. the plurality of die may include a desired thickness. the method may further include etching a plurality of trenches into the semiconductor wafer only from the first side of the semiconductor wafer. the plurality of trenches may be located adjacent a perimeter of the plurality of die. a depth of the plurality of trenches may be greater than the desired thickness of the plurality of die. the method may also include mounting the first side of the semiconductor wafer to a back grinding tape. the method may include thinning a second side of the semiconductor wafer to the depth of the plurality of trenches and singulating the plurality of die through thinning the second side of the semiconductor wafer. the method may include transferring the plurality of die from the back grinding tape to a transporting tape. implementations of the third method of singulating a plurality of die may include one, all, or any of the following: etching the plurality of trenches may include plasma etching. etching the plurality of trenches may further include defining a pattern of the plurality of trenches using passivation material, metal material, photolithographic masking, temporary film, shadow masking, or any combination thereof. the semiconductor wafer may include silicon and etching the plurality of trenches and etching may further include using a drie process. the method may further include doing one of the following after etching the plurality of trenches: forming a plurality of bumps on the plurality of die, testing one or more of the plurality of die, probing one or more of the plurality of die, adding memory data to one or more of the plurality of die, forming a solderable surface on a surface of one or more of the plurality of die, or any combination thereof. thinning a second side of the semiconductor wafer to the depth of the trenches may further include using an edge ring grinding process. the method may further include picking the plurality of die from the transporting tape. the foregoing and other aspects, features, and advantages will be apparent to those artisans of ordinary skill in the art from the description and drawings, and from the claims. brief description of the drawings implementations will hereinafter be described in conjunction with the appended drawings, where like designations denote like elements, and: fig. 1 is a cross section view of an implementation of a wafer with a plurality of die with a patterning material/layer thereon; fig. 2 is a cross section view of the wafer of fig. 1 following etching of trenches around a perimeter of the plurality of die; fig. 3 is a cross sectional view of the wafer of fig. 1 following additional processing steps; fig. 4 is a cross sectional view of the wafer of fig. 1 flipped over and mounted to a tape; fig. 5 is a cross sectional view of the wafer of fig. 1 following thinning of a second side of the wafer, exposing the bottoms of the plurality of trenches, and singulation of the plurality of die; fig. 6 is a cross sectional view of the plurality of die of fig. 5 flipped over and mounted on a picking tape attached to a frame; fig. 7 is a cross sectional view of another implementation of a wafer with a plurality of die with a patterning material thereon; fig. 8 is a cross sectional view of the wafer of fig. 7 following etching of trenches around the perimeter of the plurality of die; fig. 9 is a cross sectional view of the wafer of fig. 7 following additional processing steps fig. 10 is a cross sectional view of the wafer of fig. 7 flipped over and mounted to a back grinding tape; fig. 11 is a cross sectional view of the wafer of fig. 7 following thinning of the second side of the wafer using a taiko back grinding process; fig. 12 is a cross sectional view of the wafer of fig. 7 following demounting of the wafer from the back grinding tape and mounting to a picking tape attached to a frame; fig. 13 is a cross sectional view of the wafer of fig. 7 following etching or grinding of the second side of the wafer, exposing the bottoms of the plurality of trenches, and singulating the plurality of die; fig. 14 is a cross sectional view of the plurality of die of fig. 13 flipped onto another picking/transporting tape; fig. 15 is a cross sectional view of another implementation of a wafer with a plurality of die with a patterning material thereon; fig. 16 is a cross sectional view of the wafer of fig. 15 following etching of trenches around the perimeter of the plurality of die; fig. 17 is a cross sectional view of the wafer of fig. 15 following additional processing steps; fig. 18 is a cross sectional view of the wafer of fig. 15 flipped over and mounted to a back grinding tape; fig. 19 is a cross sectional view of the wafer of fig. 15 following thinning of the second side of the wafer using a taiko back grinding process; fig. 20 is a cross sectional view of the wafer of fig. 15 following demounting of the wafer from the back grinding tape and mounting to a picking tape attached to a frame; fig. 21 is a cross sectional view of the wafer of fig. 15 following removal of the taiko ring; fig. 22 is a cross sectional view of the wafer of fig. 15 following etching of the wafer at the plurality of trenches to singulate the plurality of die; fig. 23 is a cross sectional view of a wafer having a plurality of die where each die includes an under bump metal layer; fig. 24 is a cross sectional view of the wafer of fig. 23 following etching of trenches around the perimeter of the plurality of die; fig. 25 is a cross sectional view of the wafer of fig. 23 following formation of a plurality of bumps on the under bump metal layer of the various die of the plurality of die; fig. 26 is a cross sectional view of the wafer of fig. 23 following mounting of the wafer to a back grinding tape; fig. 27 is a cross sectional view of the wafer of fig. 23 following thinning of the second side (back side) of the wafer using a taiko grinding process; fig. 28 is a cross sectional view of the wafer of fig. 23 following demounting of the wafer from the back grinding tape and mounting of the first side of the semiconductor wafer to a picking tape; fig. 29 is a cross sectional view of the wafer of fig. 23 following etching or grinding in the second side of the semiconductor wafer to expose the bottoms of the plurality of trenches thereby singulating the plurality of die; fig. 30 is a cross sectional view of the wafer of fig. 23 flipped onto another picking/transporting tape; fig. 31 is a cross section view of an implementation of a wafer with a plurality of die with a patterning material/layer thereon; fig. 32 is a cross section view of the wafer of fig. 31 following etching of trenches around a perimeter of the plurality of die; fig. 33 is a cross sectional view of the wafer of fig. 31 flipped over and mounted to a tape; fig. 34 is a cross sectional view of the wafer of fig. 31 following thinning of a second side of the wafer singulating of the plurality of die; fig. 35 is a cross sectional view of the plurality of die of fig. 34 flipped over and mounted on a picking tape attached to a frame; fig. 36 is a cross sectional view of a wafer having a plurality of die where each die includes an under bump metal layer; fig. 37 is a cross sectional view of the wafer of fig. 36 following etching of trenches around the perimeter of the plurality of die; fig. 38 is a cross sectional view of the wafer of fig. 36 following formation of a plurality of bumps on the under bump metal layer of the various die of the plurality of die; fig. 39 is a cross sectional view of the wafer of fig. 36 following mounting of the wafer to a back grinding tape; fig. 40 is a cross sectional view of the wafer of fig. 36 following thinning of the second side of the wafer to singulate the plurality of die; and fig. 41 is a cross sectional view of the wafer of fig. 36 flipped onto another picking/transporting tape. description this disclosure, its aspects and implementations, are not limited to the specific components, assembly procedures or method elements disclosed herein. many additional components, assembly procedures and/or method elements known in the art consistent with the intended method for singulating a plurality of die will become apparent for use with particular implementations from this disclosure. accordingly, for example, although particular implementations are disclosed, such implementations and implementing components may comprise any shape, size, style, type, model, version, measurement, concentration, material, quantity, method element, step, and/or the like as is known in the art for such methods of singulating a plurality of die, and implementing components and methods, consistent with the intended operation and methods. during fabrication of chip scale semiconductor device packages (csp), challenges have existed that are created as the package approaches the size of the die, including those created by elimination of the mold compound that covers the die and the use of bumped die. some packaging technologies with more surface area can compensate for some defects in the die, such as chipouts or cracking of the die caused during the wafer sawing process (whether single pass or double pass processes). the sawing process can also create damage along the sidewalls of the die which creates cracks or stress concentration points which can later propagate through the die and cause failures in the field. the reliability issues created in csp packages due to chipouts or die cracking increase as the thickness of the die themselves decreases. many die used in csp processes are thinned to about 250 microns to about 500 microns in thickness from the full wafer thickness. while alternative approaches to singulation of thinned die such as laser singulation have been proposed, they have not produced die with equivalent strength to sawn die due to reformation of the molten silicon side walls of the die into a non-single crystal structure following singulation. because the chipouts are often on the back side of the die, they cannot be effectively visually inspected for, so prevention of the chipouts entirely would eliminate failures relating to these defects. various method implementations for singulating semiconductor die using in whole or in part plasma etching are disclosed in this document. these various method implementations may be effective on many different wafer types, including single crystal silicon, amorphous silicon, sapphire, silicon-on-insulator, gallium arsenide (gaas), ruby, and any other semiconductor substrate type, provided the plasma etch chemistry is appropriate for the specific substrate type. furthermore, the method implementations may be employed with any closed shaped substrate of any size, provided the plasma etching can be accomplished. where the semiconductor die include bumps (tin-silver, copper, lead-tin, etc.), attempting to use plasma etching to singulate the die on the side where the bumps are present may cause processing issues resulting from oxidation of the bump surfaces or interactions with residual materials on the bumps during the etch process, depending on the chemistry of the particular etch involved. accordingly, processes that do not require that the bumps are present during the plasma etch process may be more desirable in some implementations to those where the bumps are in place already. referring to fig. 1 , an implementation of a wafer 2 with a plurality of die 4 is illustrated. while in fig. 1 , the plurality of die 4 are illustrated as being the same size and the same type of die, in various implementations, die of different sizes and types on the same wafer could be processed in various method implementations. each die 4 is shown has having a particular thickness 6 into the material of the wafer 2 . however, those of ordinary skill in the art will appreciate that this is merely for the purposes of illustrating the desired die thickness in fig. 1 , since the process of forming the die generally means the structure of the die is formed close to the surface of the wafer and on top of the surface of the wafer. accordingly, each die 4 generally can be thinned to various thicknesses without encroaching on the active portions of the die 4 that extend into the die. because of this, the thickness of the die is generally determined by the packaging requirements and packaging processing conditions. above each die is a layer that defines a perimeter of each die. this layer may be formed of any of a wide variety of etch-resistant materials such as, by non-limiting example, passivation material, metal material (such as under bump metallization), photoresist, temporarily applied film, and any other method of patterning/providing an etch-resistant pattern on the wafer. in various implementations, shadow masking could be used to define the perimeter of each die. in such implementations where shadow masking is employed, no additional layer above each die may be needed. once the perimeters of the die are defined/protected by the layer 5 (or shadow mask), a plasma etch process is used to etch a plurality of trenches 8 into the semiconductor wafer from the die side (first side) of the wafer. fig. 2 illustrates the wafer 2 of fig. 1 following the etching process, showing that the depth/bottom 10 of the plurality of trenches lies below the desired thickness of the plurality of die 4 . because in various method implementations, the plasma etch does not need to etch all the way through the full-thickness wafer, the methods may be more manufacturable and less capital intensive. as can be observed, the plurality of trenches lie adjacent to or at the perimeter of the die. in particular implementations, the semiconductor wafer 2 is a silicon wafer and the plasma etching process is the bosch deep reactive ion etch (drie) deposition/etching process that employs, by non-limiting example, an argon/sulfur hexafluoride chemistry for etching steps and trifluoromethane/argon chemistry for the alternating side wall deposition steps. in other implementations, however, other etching processes/chemistries could be used, depending upon the particular material that forms the wafer 2 . following the etching step, the wafer may be rinsed or otherwise cleaned to remove any remaining etchant or residue from the etching process. in various implementations, the wafer can then have a wide variety of additional processes performed to the die side of the wafer. these include, by non-limiting example, forming bumps on the die; electrically testing the die; probing the die; adding data to memory portions of the die erased by exposure to the plasma etch process; removal of the layer 5 above the die; forming a solderable surface on one or more of the die; or any other desired process that needs to be performed to the front side of the die. this is possible because the wafer still remains at full thickness and can be handled by standard wafer processing equipment. in various implementations, these additional processes may not be performed, as they may be done depending upon the nature of the particular device being formed. fig. 3 illustrates the wafer following application of a metal interconnect layer 12 to the plurality of die 4 . the wafer is then prepared for thinning. in some implementations, this is done by mounting the die side of the wafer to back grinding tape. such an implementation is illustrated in fig. 4 . in particular implementations, the back grinding tape may be stiff relative to other back grinding tapes and may or may not be supported on a frame. in other implementations, a wafer carrier employing a substrate may be bonded to the back side (non-die side or second side) of the wafer 2 . in other implementations, a wafer film frame may be employed with the various tapes. in some implementations, the front side of the wafer may be coated with a protective layer prior to be mounted to the tape. this protective layer could be a photoresist or other removable polymer or other material. thinning of the wafer can be accomplished by several different techniques. back grinding may be used, which may include grinding across the full diameter of the wafer or grinding using the taiko process developed by disco hi-tec america, inc. of santa clara, calif. the taiko process leaves a ring of thick wafer material (taiko ring) around the outer edge of the backside of the wafer and grinds the center of the wafer down to the desired die thickness. in various method implementations, the thickness of the ring may be about 3 mm. in other implementations, wet chemical etching or plasma bulk etching of the material of the backside (second side) of the wafer may be employed either alone or in combination with back grinding to thin the wafer. as is illustrated in fig. 5 , the plurality of die 4 have been singulated through the wafer thinning operation as the bottoms of the plurality of trenches 8 have been exposed at the point the thinning reached the desired thickness for the plurality of die 4 and fully removed the excess wafer material. the singulated plurality of die are now attached to the back grinding tape. in various method implementations, additional processing steps could be employed to process the back sides of the plurality of die. by non-limiting example, these steps could include laser marking, stress relief etching of the die (wet etching, gas/fuming etching, plasma etching); washing of the die; application of die attach film, application of die bonding materials, any combination thereof, or any other desired die backside processing technique. in some implementations, the die may be picked directly from the back grinding tape. in other implementations, the die may be flipped by being transferred from the back grinding tape to a picking tape for die picking. as illustrated in fig. 6 , this picking tape 16 may be supported by a frame 18 and the plurality of die 4 and plurality of trenches 8 are now facing front side up again. various method implementations like those illustrated in figs. 1-6 may be employed using wafer thinning equipment which is capable of carrying out the wafer singulation method on a single tool that can thin the wafer to singulate the plurality of die and also place the die on a film frame without having to use a separate mounting process tool. for example, the tool may thin the wafer, rinse it, and then transfer the singulated die from the back grinding tape to picking film all while the wafer is in the same tool. referring to fig. 7 , another implementation of a wafer 20 that includes a plurality of die 24 each with a layer 26 covering a perimeter of the die 24 is illustrated. this wafer 20 may be any type of substrate disclosed in this document, and the die 24 may also be any disclosed herein. fig. 8 illustrates the wafer 20 following plasma etching where the plurality of trenches 28 with bottoms 32 deeper than the predetermined thickness 30 of the plurality of die have been created. in fig. 8 , the edge of the wafer shows that it has been completely etched away, which may be done in some implementations. however, in fig. 8 and subsequent figures, the edge is not shown just for the purposes of simplifying illustration of the method. any of the previously discussed additional processes may be performed to the front side of the wafer at this point in the process. fig. 9 illustrates the plurality of die 24 following application of a metallization layer 34 to the die. following etching, the wafer 20 may be rinsed and then mounted with the front side coupled to back grinding tape 36 as illustrated in fig. 10 . in this method implementation, the wafer 20 is then thinned to the point where a predetermined distance between the second (back) side of the wafer and the bottom (depth) 32 of the plurality of trenches 28 is reached (partially thinned). as illustrated in fig. 11 , the back grinding technique used for the wafer 20 was the taiko process and the taiko ring 38 can be observed on the back side of the wafer. however, any of the other back grinding or etching processes previously discussed could also be used to partially thin the wafer in various method implementations. in particular implementations, the predetermined distance between the bottoms 32 of the plurality of trenches 28 and the second side of the wafer after the partial thinning process may be between about 25 microns to about 100 microns. in some implementations where taiko grinding is used, the predetermined distance may be between about 25 microns to about 35 microns. referring to fig. 12 , the wafer 20 is shown following being demounted from the back grind tape and mounted, first side down, to a picking tape 40 supported by a frame 42 . at this point, the back side of the wafer is either etched or ground to remove the remaining material of the wafer to expose the plurality of trenches and thereby singulate the plurality of die from each other. in various implementations, this may involve removing the taiko ring, then using plasma or wet etching to remove the silicon. while any etching process disclosed in this document could be used at this point, generally bosch plasma etching would not be used here, as it would unnecessary to remove only bulk material. fig. 13 illustrates the singulated plurality of die 24 on the picking tape 40 following the singulation process. the die 24 can now be picked directly from the picking tape. in some implementations, the wafer 20 may not be demounted from the back grind tape and mounted to picking tape, so the process of completing the singulation may take place while the wafer 20 is still mounted to the back grind tape 36 . in these implementations, the plurality of die 24 may be picked directly from the back grind tape 36 . any of the subsequent processes discussed in this document used for processing the plurality of singulated die may be utilized in various method implementations, such as laser marking, stress relief etching, washing, applying die attach film, and so forth. in some implementations, the die 24 may be flipped from the back grinding tape or original die picking tape to another picking or other transporting tape 44 as illustrated in fig. 14 . this method implementation may be useful as it may be less capital intensive, as multiple process tools can be involved since the use of the taiko process permits the thinned wafer to be moved from one process tool to another. accordingly, full in-line equipment may not be necessary for use with this method implementation. referring to fig. 15 , another implementation of a wafer 46 with a plurality of die 48 each including a layer 50 that defines/protects the perimeters of the plurality of die 48 is illustrated. fig. 16 illustrates the wafer 46 following plasma etching of a plurality of trenches 52 into the wafer 46 . as previously discussed, the bottoms 54 of the plurality of trenches 52 are located below the desired thickness of the die 48 . the etching of the wafer 46 can take place using any of the methods disclosed in this document, though in particular implementations, the bosch process is used. any of the front side wafer processing options previously discussed in this document may then be carried out (bumping, testing, probing, etc.). fig. 17 illustrates the wafer 26 after a metallization layer 56 has been applied. the wafer 46 is then mounted to back grinding tape 58 front side down, as illustrated in fig. 18 . the wafer 46 is then thinned from the back side (second side) using any of the grinding/etching process disclosed herein until the back side 60 reaches a predetermined distance between the back side 60 and the bottom 54 of the plurality of trenches 52 . in various implementations, taiko back grinding may be used, though standard back grinding could also be used along with bulk plasma etching or wet chemical etching. where taiko grinding is used, the predetermined distance may be about 25 microns to about 100 microns. in some implementations, a wafer carrier could be coupled with the wafer as a processing aid. at this point, in this method implementation, any of the previously disclosed processes for treating the back side of the plurality of singulated die may be carried out on the back sides of the plurality of die 48 . these include, by non-limiting example, laser marking, stress relief etching, washing, applying die attach film, and any other disclosed herein. fig. 19 illustrates a wafer 46 that has been taiko process ground showing the taiko ring 62 . following partial thinning of the wafer 46 , the front side of the wafer 46 may be demounted from the back grinding tape and then the back side (second side) of the wafer 46 may be mounted to a picking tape 64 supported by a frame 66 . as illustrated in fig. 20 , this process can be done with the taiko ring 62 in place, though in some implementations, the taiko ring 62 may be removed following mounting using a circular saw cut process. the particular picking tape 64 may be a uv cure tape or a uv release tape in various implementations. in some implementations, a picking tape 64 may not be used but a substrate carrier/wafer carrier may be bonded to the wafer 46 or another wafer may be bonded to the wafer 46 . in some implementations, the other wafer may be one which includes a plurality of die to be included in the finished semiconductor package. in various method implementations, the wafer with the back grinding tape will be mounted to the picking tape 64 first and then the back grinding tape is then removed. in these situations, it may be easier for the operator or equipment to remove the back grinding tape while the wafer is already mounted on a frame to the picking tape. fig. 21 illustrates the wafer 46 following removal of the taiko ring 62 . at this point, the remaining wafer material of the predetermined distance between the bottom 54 of the plurality of trenches 52 and the back side of the wafer 6 is etched or ground away. in particular implementations, etching process used is the bosch process. in other implementations, wet etching could be used, or the wafer 46 may be flipped or otherwise mounted to allow for additional back grinding to take place. during the etching/grinding process the bottoms 54 of the plurality of trenches 52 are extended through the wafer 46 until the plurality of trenches 52 extend completely through the wafer 46 and the plurality of die 48 are singulated. also, where the taiko ring is still present, the etching process will singulate the taiko ring from the wafer at the same time the plurality of trenches are exposed. fig. 22 illustrates the plurality of die 48 following the singulation process attached to the picking tape 64 . since these die 48 are already front side up, they may not need to be flipped for die picking but are already to be picked directly from the picking tape 64 . however, they could be transferred to another transfer tape as previously discussed in various method implementations. this method implementation may be useful in situations where capital equipment is not available that would allow for wafer flipping and where the devices in the die can withstand the effects of the additional plasma wafer processing from the front side of the wafer. referring to fig. 23 , another implementation of a wafer 68 is illustrated. in this implementation, the wafer 68 includes a plurality of die 70 each of which includes a layer of under bump metal (ubm, bump metal layer) 72 along with associated passivation layer material which defines the perimeter of the die 70 . the passivation layer material may be an organic material such as, by non-limiting example, a polyimide, a benzo-cyclo-butene (bcb) material, a resin material, silicon dioxide, silicon nitride, or any other material capable of protecting the area of the die around the ubm. the ubm 72 in combination with the passivation layer material serves as an etching mask during the following plasma etching process, which may be any disclosed in this document. fig. 24 illustrates the wafer 68 following plasma etching showing the formed plurality of trenches 74 , each with a bottom 76 that is below the desired thickness of the die as previously described. in various implementations, one or more bumps 78 are formed on the ubm 72 through any of a wide variety of process including, by non-limiting example, ball dropping, solder stenciling, electroplating, electroless plating, and any other process capable of forming bumps or stud bumps. after formation of the bumps 78 , any of the front side processes disclosed in this document may be employed, such as testing, probing, adding memory, etc. in some implementations, however, one or more of the front side processes may be carried out before the bumps 78 are formed on the ubm 72 . the wafer 68 is then mounted to a back grinding tape 80 , bump side down, as illustrated in fig. 26 . the wafer 68 can then be thinned until the back side 82 reaches a predetermined distance between the back side 82 and the bottom 76 of the plurality of trenches 74 . any of the grinding/etching processes disclosed in this document may be used for the partial thinning process. in various implementations, the predetermined distance is about 25 microns to about 100 microns. in implementations where taiko grinding is used, the predetermined distance may be about 25 microns to about 35 microns. fig. 27 illustrates the wafer following the thinning operation where the thinning has been done using taiko grinding. in various implementations, the wafer 68 is then demounted from the back grinding tape 80 and mounted to picking tape 84 supported by a frame 86 with the front side of the wafer 68 down, as illustrated in fig. 28 . in various implementations, the picking tape 84 may be uv cure or uv release tape. in other implementations, however, picking tape 84 may not be used and the wafer 68 may be bonded to a substrate carrier or other wafer as previously described. in some implementations where taiko grinding was used, the taiko ring is then removed using any of the processes disclosed in this document. at this point, the remaining material of the wafer 68 is etched using any process disclosed in this document until the bottoms 76 of the plurality of trenches 74 are exposed, thereby singulating the plurality of die 70 , as illustrated in fig. 29 . since the die 70 are supported by the picking tape 84 , they may be directly picked from the tape, or any of the previously disclosed operations may be used to additionally process the back sides of the die, such as, by non-limiting example, laser marking, stress relief etching, washing, adding die attach film, and so forth. in some implementations, the die 70 will be flipped onto another picking or transport tape for die picking or transporting. in some implementations, the die will be placed into another carrier, such as a waffle pack for subsequent processing. fig. 30 illustrates the plurality of die 70 flipped onto another die picking tape, now with the bump side of the die up. in various method implementations, the ubm 72 may be formed and in place before the trenches are etched. however, in other implementations, the trenches could be formed first and the ubm then formed on the die. this may be accomplished, by non-limiting example, by using an electroless plating process, such as a nickel/gold process to form the ubm. because electroless plating does not require an electrical connection to the back side of the plurality of die, the metal can still be deposited even when the die are electrically isolated through the plurality of trenches. referring to fig. 31 , an implementation of a wafer 88 with a plurality of die 90 is illustrated. the plurality of die are located on a first side of the die. while in fig. 31 , the plurality of die 90 are illustrated as being the same size and the same type of die, in various implementations, die of different sizes and types on the same wafer could be processed in various method implementations. each die 90 illustrated has a particular thickness 94 into the material of the wafer 88 . each die 90 may be thinned to various thicknesses without encroaching on the active portions of the die 90 that extend into the die. included above each die is a layer of etch-resistant material that defines a perimeter of each die. in various implementations, this layer may be formed of any of a wide variety of materials such as, by non-limiting example, passivation material, metal material (such as under bump metallization), photoresist, temporarily applied film, and any other method of patterning/providing an etch-resistant pattern on the wafer. in various implementations, shadow masking could be used to define the perimeter of each die. referring to fig. 32 , a plasma etch process is used to etch a plurality of trenches 96 into the semiconductor wafer from the die/active side (first side) of the wafer. in this particular implementation of a method of singulating die from a semiconductor wafer, etching is performed only once. therefore, the trenches must have a depth that is large enough to allow singulation through a thinning process. the trenches, therefore, are etched more deeply that the desired final thickness of the die. in particular implementations, the semiconductor wafer 88 is a silicon wafer and the plasma etching process is the bosch deep reactive ion etch (drie) process. as previously described the bosch drie is a deposition/etching process that employs, by non-limiting example, an argon/sulfur hexafluoride chemistry for etching steps and trifluoromethane/argon chemistry for the alternating side wall deposition steps. in other implementations, however, other etching processes/chemistries could be used, depending upon the particular material that forms the wafer 88 . referring to fig. 33 , the wafer 88 may be prepared for thinning through mounting to a back grinding tape 100 . as illustrate, the first side of the wafer 88 is mounted directly to the back grinding tape. in particular implementations, the back grinding tape may be stiff relative to other back grinding tapes and may or may not be supported on a frame. in other implementations, a wafer carrier employing a substrate may be bonded to the back side (non-die side or second side) of the wafer 88 . in other implementations, a wafer film frame may be employed with the various tapes. in some implementations, the front side of the wafer may be coated with a protective layer prior to be mounted to the tape. this protective layer could be a photoresist or other removable polymer or other material. thinning of the wafer may be accomplished by several different techniques. back grinding may be used, which may include grinding across the full diameter of the wafer or grinding using the taiko process as previously described to form an edge ring. in other implementations, wet chemical etching or plasma bulk etching of the material of the second side of the wafer may be employed either alone or in combination with back grinding to thin the wafer. in fig. 34 , thinning a second side of the semiconductor wafer to the depth of the plurality of trenches is illustrated. the singulated plurality of die 90 are illustrated attached to the back grinding tape 100 . in some implementations, the die may be picked directly from the back grinding tape. in other implementations, the die may be flipped by being transferred from the back grinding tape to a picking tape for die picking. as illustrated in fig. 35 , this picking tape 102 may be supported by a frame 104 and the plurality of die 90 and plurality of trenches 96 are facing front side up. referring to figs. 36-41 , another implementation of a method of singulating a wafer 100 into a plurality of die 108 is illustrated. in this implementation, each die 108 including a layer of under bump metal (ubm, bump metal layer) along with associated passivation layer material which defines the perimeter of the die 108 . the passivation layer material may be an organic material such as, by non-limiting example, a polyimide, a benzo-cyclo-butene (bcb) material, a resin material, silicon dioxide, silicon nitride, or any other material capable of protecting the area of the die around the ubm. as previously described, the ubm 108 in combination with the passivation layer material serves as an etching mask during the following plasma etching process, which may be any disclosed in this document. fig. 37 illustrates the wafer 106 following plasma etching showing the formed plurality of trenches 112 . the plurality of trenches may extend a predetermined depth that allows singulation of the plurality of die using thinning. in this particular implementation of a singulation method, etching is performed only once. referring to fig. 38 , one or more bumps 116 are formed on the ubm through any of a wide variety of processes including, by non-limiting example, ball dropping, solder stenciling, electroplating, electroless plating, and any other process capable of forming bumps or stud bumps. in other implementations of the method, the die may not have ubm and the bumps may be formed directly on the die 108 or the die pads or metal lines themselves. the method may further include mounting the wafer 106 to a back grinding tape 118 , bump side down, as illustrated in fig. 39 . in various implementations, the bumps may include a metal such as, by non-limiting example, gold, solder, tin, lead, copper, any combination thereof, or any other metal used in semiconductor interconnects. referring to fig. 40 , the wafer 106 may be thinned to the depth of the trenches 114 . thinning the semiconductor wafer to the depth of the trenches results in singulating the plurality of semiconductor wafers. in various implementations, the plurality of die may be demounted from the back grinding tape directly. in other implementations, the plurality of die may be flipped and transferred to a picking tape before being further processed. in various implementations, the picking tape 120 may be uv cure or uv release tape. in other implementations, however, picking tape 120 may not be used and the wafer may be bonded to a substrate carrier or other wafer before grinding as previously described. in various implementations, back grinding may include forming an edge ring around the perimeter of the wafer (such as using the taiko process previously disclosed herein). the edge ring may be integral to the wafer and may provide support to the wafer and the plurality of die. the method may further include removing any remaining material of the wafer through etching using any process disclosed in this document. since the die 108 are supported by the picking tape 120 , they may be directly picked from the tape, or any of the previously disclosed operations may be used to additionally process the back sides of the die, such as, by non-limiting example, laser marking, stress relief etching, washing, adding die attach film, and so forth. in some implementations, the die 120 will be flipped onto another picking or transport tape for die picking or transporting. in some implementations, the die will be placed into another carrier, such as a waffle pack for subsequent processing. fig. 41 illustrates the plurality of die 108 flipped onto another die picking tape, now with the bump side of the die up. in various method implementations, the ubm may be formed and in place before the trenches are etched. however, in other implementations, the trenches could be formed first and the ubm then formed on the die. this may be accomplished, by non-limiting example, by using an electroless plating process, such as a nickel/gold process to form the ubm. because electroless plating does not require an electrical connection to the back side of the plurality of die, the metal can still be deposited even when the die are electrically isolated through the plurality of trenches. in places where the description above refers to particular implementations of methods of singulating die and implementing components, sub-components, methods and sub-methods, it should be readily apparent that a number of modifications may be made without departing from the spirit thereof and that these implementations, implementing components, sub-components, methods and sub-methods may be applied to other methods of singulating die.
064-884-698-049-875	US	[ "US" ]	G06F15/18,G06N5/00	2007-12-31T00:00:00	2007	[ "G06" ]	system and method of feature selection for text classification using subspace sampling	an improved system and method is provided for feature selection for text classification using subspace sampling. a text classifier generator may be provided for selecting a small set of features using subspace sampling from the corpus of training data to train a text classifier for using the small set of features for classification of texts. to select the small set of features, a subspace of features from the corpus of training data may be randomly sampled according to a probability distribution over the set of features where a probability may be assigned to each of the features that is proportional to the square of the euclidean norms of the rows of left singular vectors of a matrix of the features representing the corpus of training texts. the small set of features may classify texts using only the relevant features among a very large number of training features.	1 . a computer system for classification, comprising: a text classifier using a plurality of features selected by subspace sampling from a corpus of training data for classification of a document; and a storage operably coupled to the text classifier for storing a plurality of texts classified using the plurality of features selected by subspace sampling into a plurality of classes. 2 . the system of claim 1 further comprising a text classifier generator operably coupled to the storage for learning a classification function for each of the plurality of classes to train the text classifier for using the plurality of features selected by subspace sampling for classification of the document. 3 . the system of claim 1 further comprising a feature selector using subspace sampling operably coupled to the text classifier generator for selecting the plurality of features using subspace sampling from the corpus of training data for classification of the document. 4 . a computer-readable medium having computer-executable components comprising the system of claim 1 . 5 . a computer-implemented method for classification, comprising: receiving a text represented by a plurality of features for classification; classifying the text using a subset of the plurality of features selected from the plurality of features by subspace sampling; and outputting the classification of the text classified using the subset of the plurality of features selected by subspace sampling. 6 . the method of claim 5 further comprising receiving a corpus of classified training texts represented by a plurality of features for classification of a document. 7 . the method of claim 5 further comprising receiving a probability distribution over a plurality of features from a corpus of training texts, the probability distribution having a probability assigned to each of the plurality of features that is proportional to a square of euclidean norms of a plurality of rows of a plurality of left singular vectors of a matrix of the plurality of features representing the corpus of training texts. 8 . the method of claim 5 further comprising selecting the subset of the plurality of features from the plurality of features by subspace sampling. 9 . the method of claim 8 further comprising outputting the subset of the plurality of features selected from the plurality of features by subspace sampling. 10 . the method of claim 8 wherein selecting the subset of the plurality of features from the plurality of features by subspace sampling comprises randomly sampling a subspace of the plurality of features using a probability distribution with a probability assigned to each of the plurality of features that is proportional to a square of euclidean norms of a plurality of rows of a plurality of left singular vectors of a matrix of the plurality of features representing the corpus of training texts. 11 . the method of claim 8 wherein selecting the subset of the plurality of features from the plurality of features by subspace sampling comprises selecting the subset of the features from the randomly sampled subspace of the plurality of features using a probability distribution with a probability assigned to each of the plurality of features that is proportional to a square of euclidean norms of a plurality of rows of a plurality of left singular vectors of a matrix of the plurality of features representing the corpus of training texts. 12 . the method of claim 5 wherein selecting the subset of the plurality of features from the plurality of features by subspace sampling comprises defining a kernel matrix over the subset of the plurality of features selected from a sampled subspace of the plurality of features. 13 . the method of claim 5 wherein selecting the subset of the plurality of features from the plurality of features by subspace sampling comprises determining an optimal vector representing the subset of the plurality of features that characterize a classification function using a kernel matrix defined over the subset of the plurality of features. 14 . the method of claim 5 wherein outputting the classification of the text classified using the subset of the plurality of features selected by subspace sampling comprises storing an association of the text and a class. 15 . a computer-readable medium having computer-executable instructions for performing the method of claim 5 . 16 . a computer system for classification, comprising: means for selecting a subset of a plurality of features from a corpus of classified training texts represented by the plurality of features; and means for outputting the subset of the plurality of features selected from the corpus of classified training texts represented by the plurality of features. 17 . the computer system of claim 16 further comprising means for classifying a text using the subset of the plurality of features selected from the corpus of classified training texts represented by the plurality of features. 18 . the computer system of claim 17 further comprising means for outputting a text classifier using the subset of the plurality of features selected from the corpus of classified training texts represented by the plurality of features. 19 . the computer system of claim 16 wherein means for selecting the subset of the plurality of features from the corpus of classified training texts represented by the plurality of features comprises means for using a probability distribution with a probability assigned to each of the plurality of features to select the subset of the plurality of features. 20 . the computer system of claim 16 wherein means for selecting the subset of the plurality of features from the corpus of classified training texts represented by the plurality of features comprises means for randomly sampling a subspace of the plurality of features.	field of the invention the invention relates generally to computer systems, and more particularly to an improved system and method of feature selection for text classification using subspace sampling. background of the invention text classification, the task of automatically assigning categories to natural language text, has become one of the key methods for organizing online information. automated text classification is a particularly challenging task in modern data analysis, both from an empirical and from a theoretical perspective. this problem is of central interest in many internet applications, and consequently it has received attention from researchers in such diverse areas as information retrieval, machine learning, and the theory of algorithms. challenges associated with automated text categorization come from many fronts: an appropriate data structure must be chosen to represent the documents; an appropriate objective function must be chosen to optimize in order to avoid over fitting and obtain good generalization; and algorithmic issues arising as a result of the high formal dimensionality of the data must be addressed. feature selection of a subset of the features available for describing the data before applying a learning algorithm is a common technique for addressing this last challenge. see for example, a. l. blum and p. langley, selection of relevant features and examples in machine learning , artificial intelligence, 97:245-271, 1997; g. forman, an extensive empirical study of feature - selection metrics for text classification , journal of machine learning research, 3:1289-1305, 2003; and i. guyon and a. elisseeff, an introduction to variable and feature selection , journal of machine learning research, 3:1157-1182, 2003. it has been widely observed that feature selection can be a powerful tool for simplifying or speeding up computations, and when employed appropriately it can lead to little loss in classification quality. nevertheless, general theoretical performance guarantees are modest and it is often difficult to claim more than a vague intuitive understanding of why a particular feature selection algorithm performs well when it does. indeed, selecting an optimal set of features is in general difficult, both theoretically and empirically, and in practice greedy heuristics are often employed. recent work in applied data analysis—for example, work on regularized least squares classification (rlsc), support vector machine (svm) classification, and the lasso shrinkage and selection method for linear regression and classification employ the singular value decomposition, which, upon truncation, results in a small number of dimensions, each of which is a linear combination of up to all of the original features. see for example, d. fragoudis, d. meretakis, and s. likothanassis, integrating feature and instance selection for text classification , in proceedings of the 8th annual acm sigkdd conference, pages 501-506, 2002, and t. joachims, text categorization with support vector machines: learning with many relevant features , in proceedings of the 10th european conference on machine learning, pages 137-142, 1998. although rlsc performs comparable to the popular svms for text categorization, rlsc is conceptually and theoretically simpler than svms, since rlsc can be solved with vector space operations instead of convex optimization techniques required by svms. in practice, however, rlsc is often slower, in particular for problems where the mapping to the feature space is not the identity. for a nice overview, see r. rifkin, everything old is new again: a fresh look at historical approaches in machine learning , phd thesis, massachusetts institute of technology, 2002, and r. rifkin, g. yeo, and t. poggio, regularized least - squares classification , in j. a. k. suykens, g. horvath, s. basu, c. micchelli, and j. vandewalle, editors, advances in learning theory: methods, models and applications, nato science series iii: computer and systems sciences, pages 131-154. vios press, 2003. what is needed is a system and method for rlsc to efficiently learn classifications function and perform feature selection to find a small set of features that may preserve the relevant geometric structure in the data. such a system and method should be able to be used by online applications for text classification where the text content may change rapidly. summary of the invention briefly, the present invention may provide a system and method of feature selection for text classification using subspace sampling. a text classifier generator may be provided for learning classification functions and may include a feature selector for selecting a small set of features using subspace sampling from the corpus of training data to train a text classifier for using the small set of features selected by subspace sampling for classification of texts. the small set of features may classify texts using only the relevant features among a very large number of training features. in an embodiment, the small set of features may be selected by randomly sampling features according to a probability distribution over the set of training features. in general, features of a corpus of training data may be sampled according to an input probability distribution and a small set of features may be selected. a kernel matrix may be defined over the small set of features selected from a randomly sampled subspace of the training features, and an optimal vector representing the small set of features may be defined using regularized least-squares classification that may characterize a classification function using the kernel matrix. an unseen text may then be classified using the classification function. in various embodiments, a text classifier may be generated for using the small set of features selected by subspace sampling for classification of texts. to select the small set of features, a subspace of features from the corpus of training data may be randomly sampled in an embodiment according to a probability distribution over the set of features where a probability may be assigned to each of the features that is proportional to the square of the euclidean norms of the rows of left singular vectors of a matrix of the features representing the corpus of training texts. the present invention may flexibly use other probability distributions for randomly sampling features. for instance, weight-based sampling of features may be used, where the probability of choosing each feature is proportional to the length squared of the corresponding row of a matrix of the features representing the corpus of training texts. or, uniform sampling of features may be used, where the probability of choosing each feature is equal. advantageously, the present invention may be used by many applications for feature selection for text classification using subspace sampling. for example, a document classification application may use the present invention to select only the relevant features among a very large number of features to speed up classification of documents. many other internet applications may use the present invention for text classification where the content of web pages such as chat pages, blog pages, a stream of news items, email, and so forth, may change rapidly, and classification of a web page may be performed online to select content. for any of these applications, the present invention may be used, especially when computational resources including memory, processing time, and network transmission time, require that textual content be represented using a small number of features. other advantages will become apparent from the following detailed description when taken in conjunction with the drawings, in which: brief description of the drawings fig. 1 is a block diagram generally representing a computer system into which the present invention may be incorporated; fig. 2 is a block diagram generally representing an exemplary architecture of system components for feature selection for text classification using subspace sampling, in accordance with an aspect of the present invention; fig. 3 is a flowchart generally representing the steps undertaken in one embodiment for feature selection for text classification using subspace sampling, in accordance with an aspect of the present invention; and fig. 4 is a flowchart generally representing the steps undertaken in an embodiment for selecting a subset of features using subspace sampling, in accordance with an aspect of the present invention. detailed description exemplary operating environment fig. 1 illustrates suitable components in an exemplary embodiment of a general purpose computing system. the exemplary embodiment is only one example of suitable components and is not intended to suggest any limitation as to the scope of use or functionality of the invention. neither should the configuration of components be interpreted as having any dependency or requirement relating to any one or combination of components illustrated in the exemplary embodiment of a computer system. the invention may be operational with numerous other general purpose or special purpose computing system environments or configurations. the invention may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. generally, program modules include routines, programs, objects, components, data structures, and so forth, which perform particular tasks or implement particular abstract data types. the invention may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. in a distributed computing environment, program modules may be located in local and/or remote computer storage media including memory storage devices. with reference to fig. 1 , an exemplary system for implementing the invention may include a general purpose computer system 100 . components of the computer system 100 may include, but are not limited to, a cpu or central processing unit 102 , a system memory 104 , and a system bus 120 that couples various system components including the system memory 104 to the processing unit 102 . the system bus 120 may be any of several types of bus structures including a memory bus or memory controller, a peripheral bus, and a local bus using any of a variety of bus architectures. by way of example, and not limitation, such architectures include industry standard architecture (isa) bus, micro channel architecture (mca) bus, enhanced isa (eisa) bus, video electronics standards association (vesa) local bus, and peripheral component interconnect (pci) bus also known as mezzanine bus. the computer system 100 may include a variety of computer-readable media. computer-readable media can be any available media that can be accessed by the computer system 100 and includes both volatile and nonvolatile media. for example, computer-readable media may include volatile and nonvolatile computer storage media implemented in any method or technology for storage of information such as computer-readable instructions, data structures, program modules or other data. computer storage media includes, but is not limited to, ram, rom, eeprom, flash memory or other memory technology, cd-rom, digital versatile disks (dvd) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by the computer system 100 . communication media may include computer-readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media. the term “modulated data signal” means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. for instance, communication media includes wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, rf, infrared and other wireless media. the system memory 104 includes computer storage media in the form of volatile and/or nonvolatile memory such as read only memory (rom) 106 and random access memory (ram) 110 . a basic input/output system 108 (bios), containing the basic routines that help to transfer information between elements within computer system 100 , such as during start-up, is typically stored in rom 106 . additionally, ram 110 may contain operating system 112 , application programs 114 , other executable code 116 and program data 118 . ram 110 typically contains data and/or program modules that are immediately accessible to and/or presently being operated on by cpu 102 . the computer system 100 may also include other removable/non-removable, volatile/nonvolatile computer storage media. by way of example only, fig. 1 illustrates a hard disk drive 122 that reads from or writes to non-removable, nonvolatile magnetic media, and storage device 134 that may be an optical disk drive or a magnetic disk drive that reads from or writes to a removable, a nonvolatile storage medium 144 such as an optical disk or magnetic disk. other removable/non-removable, volatile/nonvolatile computer storage media that can be used in the exemplary computer system 100 include, but are not limited to, magnetic tape cassettes, flash memory cards, digital versatile disks, digital video tape, solid state ram, solid state rom, and the like. the hard disk drive 122 and the storage device 134 may be typically connected to the system bus 120 through an interface such as storage interface 124 . the drives and their associated computer storage media, discussed above and illustrated in fig. 1 , provide storage of computer-readable instructions, executable code, data structures, program modules and other data for the computer system 100 . in fig. 1 , for example, hard disk drive 122 is illustrated as storing operating system 112 , application programs 114 , other executable code 116 and program data 118 . a user may enter commands and information into the computer system 100 through an input device 140 such as a keyboard and pointing device, commonly referred to as mouse, trackball or touch pad tablet, electronic digitizer, or a microphone. other input devices may include a joystick, game pad, satellite dish, scanner, and so forth. these and other input devices are often connected to cpu 102 through an input interface 130 that is coupled to the system bus, but may be connected by other interface and bus structures, such as a parallel port, game port or a universal serial bus (usb). a display 138 or other type of video device may also be connected to the system bus 120 via an interface, such as a video interface 128 . in addition, an output device 142 , such as speakers or a printer, may be connected to the system bus 120 through an output interface 132 or the like computers. the computer system 100 may operate in a networked environment using a network 136 to one or more remote computers, such as a remote computer 146 . the remote computer 146 may be a personal computer, a server, a router, a network pc, a peer device or other common network node, and typically includes many or all of the elements described above relative to the computer system 100 . the network 136 depicted in fig. 1 may include a local area network (lan), a wide area network (wan), or other type of network. such networking environments are commonplace in offices, enterprise-wide computer networks, intranets and the internet. in a networked environment, executable code and application programs may be stored in the remote computer. by way of example, and not limitation, fig. 1 illustrates remote executable code 148 as residing on remote computer 146 . it will be appreciated that the network connections shown are exemplary and other means of establishing a communications link between the computers may be used. feature selection for text classification using subspace sampling the present invention is generally directed towards a system and method of feature selection for text classification using subspace sampling. a text as used herein may mean a document, web page, email or other representation of a set of characters. a simple unsupervised algorithm for feature selection is presented and applied to the rlsc problem. in particular, a subspace of features from a corpus of training data may be randomly sampled according to a probability distribution over the set of training features. accordingly, a univariate “score” or “importance” may be assigned to every feature, then a small number of features may be randomly sampled, and the rlsc problem induced on those features may be solved. as will be seen, the present invention chooses a small number of these features that preserve the relevant geometric structure in the data by using a sufficiently simple and sufficiently rich feature selection strategy that may perform well when evaluated against common feature selection algorithms. as will be understood, the various block diagrams, flow charts and scenarios described herein are only examples, and there are many other scenarios to which the present invention will apply. turning to fig. 2 of the drawings, there is shown a block diagram generally representing an exemplary architecture of system components for feature selection for text classification using subspace sampling. those skilled in the art will appreciate that the functionality implemented within the blocks illustrated in the diagram may be implemented as separate components or the functionality of several or all of the blocks may be implemented within a single component. for example, the functionality of the feature selector using subspace sampling 206 may be implemented as a separate component from the text classifier generator 204 . moreover, those skilled in the art will appreciate that the functionality implemented within the blocks illustrated in the diagram may be executed on a single computer or distributed across a plurality of computers for execution. in various embodiments, a computer 202 , such as computer system 100 of fig. 1 , may include a text classifier generator 204 operably coupled to a text classifier 208 and storage 210 . in general, the text classifier generator 204 and the text classifier 208 may be any type of executable software code such as a kernel component, an application program, a linked library, an object with methods, and so forth. the storage 210 may be any type of computer-readable media and may store a training corpus 212 of training texts 214 , each described by training features 216 and a class label 218 , and classes 220 of texts 222 classified by a set of selected features 224 . in an embodiment, training features 216 from the training corpus 212 may be used by the text classifier generator 204 to train a text classifier 208 to classify unseen texts 222 into classes 220 by a set of selected features 224 . the text classifier generator 204 may learn classification functions for each of the classes and may include a feature selector using subspace sampling 206 for training a text classifier 208 by selecting a small number of features using subspace sampling. each of these modules may also be any type of executable software code such as a kernel component, an application program, a linked library, an object with methods, or other type of executable software code. upon selecting a small number of features, a text classifier 208 may be output with the small set of features for classifying unseen texts. there are many applications which may use the present invention of feature selection for text classification using subspace sampling. many internet applications that use automated text classification can involve many categories and a very large feature space where the features consist of a large vocabulary of words and phrases that may be many times the size of the representation of a text. for example, a document classification application may use the present invention to select only the relevant features among a very large number of features to speed up classification of documents. many other internet applications may use the present invention for text classification where the content of web pages such as chat pages, blog pages, a stream of news items, email, and so forth, may change rapidly, and classification of a web page may be performed online to select content. for any of these applications, the present invention may be used, especially when computational resources including memory, processing time, and network transmission time, require that textual content be represented using a small number of features. in general, learning a classification function can be regarded as approximating a multivariate function from sparse data. this problem is solved in classical regularization theory by finding a function f that simultaneously has small empirical error and small norm in a reproducing kernel hilbert space (rkhs). that is, if the data consist of d examples (z 1 ,y 1 ), . . . , (z d ,y d ), where z i ε and y i ε{−1,+1}, then a tikhonov regularization problem may be solved to find a function f that minimizes where v(.,.) is a loss function, ∥f∥ k is a norm in a rkhs h defined by the positive definite function k, d is the number of data points, and λ is a regularization parameter. see, for example, t. evgeniou, m. pontil, and t. poggio, regularization networks and support vector machines , advances in computational mathematics, 13(1):1-50, 1999; a. n. tikhonov and v. y. arsenin, solutions of ill - posed problems , w. h. winston, washington, d.c., 1977; and v. n. vapnik, statistical learning theory , wiley, new york, 1998. under general conditions, any fεh minimizing admits a representation of the form: for some set of coefficients x i , i={1, . . . , d}. see bernhard scholkopf, ralf herbrich, alex j. smola, and robert c. williamson, a generalized representer theorem , in proceedings of the 14th annual conference on computational learning theory (colt2001) and the 5th european conference on computational learning theory (eurocolt 2001), pages 416-426, 2001. thus, the optimization problem can be reduced to finding a set of coefficients x i , i={1, . . . , d}. the theory of vapnik then justifies the use of regularization functionals of the form appearing in for learning from finite data sets. if one chooses the square loss function, v(y,f(z))=(y−f(z)) 2 , then, by combining v(y,f(z))=(y−f(z)) 2 with the following regularized least squares classification (rlsc) problem may be obtained: where the d×d kernel matrix k is defined over the finite training data set and y is a d-dimensional {+1} class label vector. see for example t. evgeniou, m. pontil, and t. poggio, regularization networks and support vector machines , advances in computational mathematics, 13(1):1-50, 1999; and r. rifkin, g. yeo, and t. poggio, regularized least - squares classification , in j. a. k. suykens, g. horvath, s. basu, c. micchelli, and j. vandewalle, editors, advances in learning theory: methods, models and applications, nato science series iii: computer and systems sciences, pages 131-154. vios press, 2003. as is standard, a document may be represented by an n-dimensional feature vector, and thus a corpus of d training documents may be represented as an n×d matrix a. similarly, an identity mapping to the feature space may be represented by a kernel expressed as k=a t a. if the singular value decomposition (svd) of a is a=uσv t , then the solution and residual of may be expressed as: x opt =v(σ 2 +λi) −1 v t y. the vector x opt characterizes a classification function of the form that generalizes well to new data. thus, if qε is a new test or query document, then from the following binary classification function may be derived: f(q)=x opt t a t q. that is, given a new document q to be classified, if f(q)>0 then q is classified as belonging to the class in question, and not otherwise. accordingly, a regularized least-squares classification problem of the form may be solved exactly or approximately to get a vector to classify successfully a new document according to a classification function of the form f(q)=x opt t a t q. by choosing a small number r of features, where d≦r<<n, good classification quality may be obtained by using only those r features when compared to using the full set of n features. in an embodiment, feature selection and classification may generally be implemented by the following pseudo-code using sampling for regularized least squares classification: srls algorithminput: a ∈ n×d ; y ∈ d ; q ∈ n ; λ ∈ + ; {p i ∈ [0,1]:i ∈ [n], p i ≧ 0,σ i p i = 1}, and a positive integer r ≦ n.output: a solution vector {tilde over (x)} opt ∈ d ; a residual {tilde over (z)} ∈ ; and aclassification {tilde over (f)}.for i = 1, . . . , n dopick i with probability {tilde over (p)} i = min{1, rp i };if i is picked theninclude a (i) /√{tilde over (p)} i as a row of ã;include q i /√{tilde over (p)} i as the corresponding element of {tilde over (q)};endset {tilde over (k)} = ã t ã;solvesetcompute {tilde over (f)} = f({tilde over (q)}) = {tilde over (q)} t ã{tilde over (x)} opt . the srls algorithm may take as input the n×d term-document (or feature-document) matrix a, a vector yε d of document labels where sign(y j )labels the class of document a (j) (where a (j) denotes the j th column of the matrix a and a (i) denotes the i th row of a), and a query document qε n . the srls algorithm also takes as input a regularization parameter λε + , a probability n distribution {p i } i=1 n over the features, and a positive integer r. the algorithm first randomly samples roughly r features according to the input probability distribution. consider ã be the matrix whose rows consist of the chosen feature vectors, rescaled appropriately, and consider {tilde over (q)} be the vector consisting of the corresponding elements of the input query document q, rescaled in the same manner. then, if the d×d matrix {tilde over (k)}=ã t ã may be defined as an approximate kernel, the algorithm next solves the following rlsc problem: thereby obtaining an optimal vector {tilde over (x)} opt . finally, the algorithm classifies the query q by computing, {tilde over (f)}=f({tilde over (q)})={tilde over (q)} t ã{tilde over (x)} opt . if {tilde over (f)}≧0, then q is labeled ‘positive’; and otherwise, q is labeled ‘negative’. fig. 3 presents a flowchart generally representing the steps undertaken in one embodiment for feature selection for text classification using subspace sampling. the steps of fig. 3 represent the general steps of the pseudo-code of the srls algorithm presented above. at step 302 , a corpus of classified training texts described by features may be received. for instance, an n×d term-document (or feature-document) matrix a and a vector yε d of document labels where sign(y j ) labels the class of document a (j) may be received as input to the srls algorithm. at step 304 , a subset of features may be selected using subspace sampling. in particular, a subspace of features may be randomly sampled according to a probability distribution over the set of features. this is described in more detail in conjunction with fig. 4 below. the subset of features selected by subspace sampling may be output at step 306 . the srls algorithm may obtain and store an optimal vector {tilde over (x)} opt by solving the rlsc problem: at step 308 , a text described: by features may be received, such as a query document qε n . at step 310 , the text may be classified using the subset of features selected by subspace sampling. for instance, the srls algorithm classifies the query q by computing, {tilde over (f)}=f({tilde over (q)})={tilde over (q)} t ã{tilde over (x)} opt . and at step 312 , the classification of the text may be output. for example, if {tilde over (f)}≧0 upon computing {tilde over (f)}=f({tilde over (q)})={tilde over (q)} t ã{tilde over (x)} opt , then q is labeled ‘positive’ as a document label indicating q belongs to the class; and otherwise, q is labeled ‘negative’. fig. 4 presents a flowchart generally representing the steps undertaken in one embodiment for selecting a subset of features using subspace sampling. at step 402 , a subspace of features may be randomly sampled according to a probability distribution over the set of features. considering all n features, a feature may be randomly selected in an embodiment by probability, {tilde over (p)} i =min{1,rp i }, according to a probability distribution over the set of features such as subspace sampling probability p i =∥u k(i) ∥ 2 2 /k, where the probability of choosing each feature is proportional to the length squared of the corresponding row of the matrix u k consisting of the top k left singular vectors of a. at step 404 , a subset of features may be selected from the subspace of randomly sampled features. in an embodiment, a (i) /√{square root over ({tilde over (p)} i )} may be included as a row of a for each feature randomly selected. for example, the slrs algorithm computes, for every iε{1, . . . , n}, a probability {tilde over (p)} i =min{1,rp i }ε[0,1], and then the i th row of a is chosen with probability {tilde over (p)} i . at step 406 , a kernel matrix may be defined over the subset of features selected from the subspace of randomly sampled features, and an optimal vector of the subset of features that characterize a classification function using the kernel matrix may be determined at step 408 . for instance, the d×d matrix {tilde over (k)}=ã t ã may be defined as an approximate kernel, and the slrs algorithm solves obtain an optimal vector {tilde over (x)} opt . and the quality of fitting the subset of features to the set of features may be measured at step 410 , for instance by computing {tilde over (z)}=∥{tilde over (k)}{tilde over (x)} opt −y∥ 2 2 +λ{tilde over (x)} opt t {tilde over (k)}{tilde over (x)} opt . an important aspect of slrs algorithm is the probability distribution {p i } i=1 n input to the algorithm. although random sampling could be performed with respect to any probability distribution, more intelligent sampling can lead to improved classification performance, both theoretically and empirically. in an embodiment, a subspace sampling probability distribution may be passed to the srls algorithm, where the probability of choosing each feature is proportional to the length squared of the corresponding row of the matrix u k consisting of the top k left singular vectors of a. more formally, subspace sampling of features representing documents means sampling the features using a probability distribution where the probability of choosing each feature is proportional to the square of the euclidean norms of the rows of the left singular vectors of an n×d matrix of the features representing a corpus of documents, such as matrix a for instance. roughly õ(d/ε 2 ) features may be randomly sampled according to this carefully chosen probability distribution. in various embodiments, a subspace sampling probability distribution may be generalized in an embodiment to p i =∥u k(i) ∥ 2 2 /k to permit k to be a parameter. also, note that rather than using the probability distribution {p i } i=1 n over the features directly in r independent and identically distributed sampling trials which might lead to the same feature being chosen multiple times, the srls algorithm computes, for every iε{1, . . . , n}, a probability {tilde over (p)} i =min{1,rp i }ε[0,1], and then the i th row of a is chosen with probability {tilde over (p)} i . thus, r actually specifies an upper bound on the expected number of chosen rows of a: if x i is a random variable that indicates whether the i th row is chosen, then the expected number of chosen rows is r′=e[σ i x i ]=σ i min{1,rp i }≦rς i p i =r. the srls algorithm may also flexibly use other probability distributions {p i } i=1 n input to the algorithm for randomly sampling features. in various embodiments, weight-based sampling of features may be used, where the probability of choosing each feature is proportional to the length squared of the corresponding row of the matrix a, namely p i =∥a (i) ∥ 2 2 /∥a∥ k 2 . or, uniform sampling of features may be used, where the probability of choosing each feature is equal, such that p i =1/n, for all i=1, . . . , n. thus the present invention may efficiently select a small set of features by intelligent sampling for improved classification performance. various probability distributions may be flexibly used for randomly sampling features, and such a feature selection strategy may preserve the relevant geometric structure in the training data. the system and method of the present invention may typically reduce the number of features by an order of magnitude or more from sets of training features and allow small feature sets to represent documents that may change rapidly and require classification to be performed, especially online. as can be seen from the foregoing detailed description, the present invention provides an improved system and method for feature selection for text classification using subspace sampling. a small subset of features may be selected by randomly sampling a subspace of features from a corpus of training data according to a probability distribution over the set of features. advantageously, the small set of features may classify texts using only the relevant features among a very large number of training features. such a system and method may support many web applications for text classification, and may also be applied to other domains where the text is required to be represented by a small number of features. as a result, the system and method provide significant advantages and benefits needed in contemporary computing. while the invention is susceptible to various modifications and alternative constructions, certain illustrated embodiments thereof are shown in the drawings and have been described above in detail. it should be understood, however, that there is no intention to limit the invention to the specific forms disclosed, but on the contrary, the intention is to cover all modifications, alternative constructions, and equivalents falling within the spirit and scope of the invention.
064-986-194-102-801	US	[ "JP", "US", "CN", "EP" ]	G06F16/18,G06F12/00,G06F3/06	2014-12-22T00:00:00	2014	[ "G06" ]	delayed trim of managed nand flash memory in computing devices	a method of managing nand flash memory in an electronic device whereby system performance of the electronic device is minimally impacted is disclosed. the method comprises collecting files that are marked for deletion or truncation; monitoring an activity level of the electronic device; monitoring a total size of the list of files that are marked for deletion or truncation; determining if the electronic device is idle; and trimming the flash memory of the electronic device if predetermined criteria are met.	1. a method of managing nand flash memory in an electronic device, comprising: collecting files that are marked for deletion or truncation; monitoring an activity level of the electronic device; creating a system folder in the nand flash memory to contain files marked for deletion or truncation; moving files marked for deletion or truncation to the system folder; monitoring a size of the system folder in the nand flash memory; determining if the electronic device is idle; in an instance in which the activity level of the electronic device is determined to be idle, trimming the system folder; and in an instance in which the size of the system folder in the nand flash memory exceeds a predetermined size, trimming the system folder, wherein trimming the system folder comprises deleting the files in the system folder. 2. the method of claim 1 , comprising loading a file system filter driver at boot time of the electronic device. 3. the method of claim 1 , comprising setting a correct filter mode of the file system driver. 4. the method of claim 1 , comprising assigning a thread priority to the file system filter driver. 5. the method of claim 1 , comprising creating hooks to a file system of the electronic device from the file system device driver. 6. the method of claim 1 , comprising extending file system i/o functions to the file system device driver. 7. the method of claim 1 , comprising spawning a process to monitor idle time of the electronic device. 8. the method of claim 1 , comprising spawning a process to monitor the system folder. 9. the method of claim 1 , wherein trimming the flash memory of the electronic device occurs at the next reboot of the electronic device. 10. the method of claim 1 , wherein trimming the flash memory of the electronic device occurs when the electronic device is determined to be idle. 11. an electronic device, comprising: a nand flash memory with a file system; an operating system having file system i/o functions; and a file system filter driver operative to: execute file system i/o functions of the operating system, monitor an activity level of the electronic device, create a system folder on the nand flash memory to contain files that are marked for deletion or truncation, move files that are marked for deletion or truncation to the system folder, determine if the electronic device is idle, monitor the size of the system folder, trim the system folder at an instance when the activity level of the electronic device is determined to be idle; and trim the system folder at an instance when the size of the system folder on the nand flash memory exceeds a predetermined size, wherein trimming the system folder comprises deleting the files in the system folder. 12. the electronic device of claim 11 , wherein the electronic device is configured to load the file system filter driver at boot time of the electronic device. 13. the electronic device of claim 11 , wherein the file system filter driver is operative to spawn a process to monitor idle time of the electronic device. 14. the electronic device of claim 11 , wherein the file system filter driver is operative to spawn a process to monitor the system folder. 15. the electronic device of claim 11 , wherein the file system filter driver is operative to trim the flash memory of the electronic device at the next reboot of the electronic device. 16. the electronic device of claim 11 , wherein the file system filter driver is operative to trim the flash memory of the electronic device when the electronic device is determined to be idle.	cross-reference to related application the present application claims the benefit of u.s. patent application no. 62/095,470 for delayed trim of managed nand flash memory in computing devices filed dec. 22, 2014. the foregoing patent application is hereby incorporated by reference in its entirety. field of the invention the invention is generally related to flash memory in electronic devices, and, more specifically, to managing nand flash memory. background in order for managed nand flash memory to work properly, and to provide longevity in the field, the flash controller must be aware of which flash cells are ‘in use’. this “in-use” information is used to allow for wear leveling, and other flash maintenance. the traditional method available to keep the controller informed of unused blocks is to implement a trim command on each block, i.e. “trimming” the flash memory. typically, a trim command permits an operating system to tell the flash controller which blocks of data are no longer in use, and can be erased and reused. however, implementing a trim command immediately upon deletion can have a significant impact on file system performance. once a file is deleted, most file systems do not provide a low-impact method of determining which blocks are free, although they are able reuse those blocks at a future opportunity due to internal accounting in the file system. however, since the flash controller is not aware of these “unused” blocks, it is unable to use them for flash maintenance. summary in an aspect of the invention, a method of managing nand flash memory in an electronic device, comprises collecting files that are marked for deletion or truncation; monitoring an activity level of the electronic device; monitoring a total size of the list of files that are marked for deletion or truncation; determining if the electronic device is idle; and trimming the flash memory of the electronic device if predetermined criteria are met; whereby system performance of the electronic device is minimally impacted. in an embodiment, the method comprises loading a file system filter driver at boot time of the electronic device. in another embodiment, the method comprises setting a correct filter mode of the file system driver. in another embodiment, the method comprises assigning a thread priority to the file system filter driver in yet another embodiment, the method comprises creating hooks to a file system of the electronic device from the file system device driver. in another embodiment, the method comprises extending file system i/o functions to the file system device driver. in another embodiment, the method comprises spawning a process to monitor idle time of the electronic device. in an embodiment, the method comprises creating a system folder to contain files marked for deletion or truncation. in another embodiment, the method comprises spawning a process to monitor the system folder. in yet another embodiment, the method comprises moving files marked for deletion or truncation to a system folder. in an embodiment, trimming the flash memory of the electronic device occurs after the system folder exceeds a predetermined size. in an embodiment, trimming the flash memory of the electronic device occurs at the next reboot of the electronic device. in an embodiment, trimming the flash memory of the electronic device occurs when the electronic device is determined to be idle. in another aspect of the invention, a method of managing nand flash memory in an electronic device comprises providing an electronic device having a nand flash memory with a file system, and an operating system having file system i/o functions; providing a file system filter driver on the electronic device, the file system filter driver operative to: execute file system i/o functions of the operating system, monitor an activity level of the electronic device, create a system folder to contain files that are marked for deletion or truncation, move files that are marked for deletion or truncation to the system folder, determine if the electronic device is idle, monitor the size of the system folder, and trim the flash memory of the electronic device if a predetermined criteria are met; whereby system performance of the electronic device is minimally impacted by trim operations of the flash memory. in an embodiment, the method comprises configuring the electronic device to load the file system filter driver at boot time of the electronic device. in an embodiment, the file system filter driver is operative to spawn a process to monitor idle time of the electronic device. in another embodiment, the file system filter driver is operative to spawn a process to monitor the system folder. in yet another embodiment, the file system filter driver is operative to trim the flash memory of the electronic device after the system folder exceeds a predetermined size. in another embodiment, the file system filter driver is operative to trim the flash memory of the electronic device at the next reboot of the electronic device. in yet another embodiment, the file system filter driver is operative to trim the flash memory of the electronic device when the electronic device is determined to be idle. brief description of the drawings the invention will now be described by way of example, with reference to the accompanying figures, of which: fig. 1 is a block diagram of an electronic device with software operative for managing nand flash memory; fig. 2 is a flowchart of a method of managing nand flash memory on an electronic device; and fig. 3 is a flowchart of a method of installing and setting up software on an electronic device that is operative for managing nand flash memory. detailed description generally, a method of managing nand flash memory in an electronic device minimizes the system performance impact of trim operations of the flash memory. as described in further detail below, the method includes providing an electronic device having nand flash memory with a file system, an operating system having file system i/o functions and providing a file system filter driver on the electronic device. the file system filter driver is operative to execute file system i/o functions of the operating system; monitor an activity level of the electronic device; create a system folder to contain files that are marked for deletion or truncation; move the files that are marked for deletion or truncation to the system folder; determine if the electronic device is idle; and trim the flash memory of the electronic device during an optimal period, such as idle time, a reboot or if the system folder has exceeded a predetermined size. referring to fig. 1 , an exemplary electronic device 100 includes a processor 102 , a flash memory controller 104 , nand flash memory 106 , and at least one host file system 107 . system folders 108 , as described further below, are operative for temporarily accumulating files marked for deletion or truncation. the file system 107 is stored within the flash memory 106 . the system folders 108 are in turn stored in the file system 107 . the electronic device 100 further includes memory 110 . the electronic device 100 includes an operating system 112 and file system filter driver 114 , for managing deletions from the file system 107 . the file system filter driver 114 includes an idlethread thread 116 and a trimthread thread 118 , which will be described in greater detail below, which monitor the activity of the electronic device 100 and size of the system folders 108 , respectively. referring to fig. 2 , the file system filter driver 114 is implemented to keep track of which files have been marked for deletion or truncation at 200 . the file system filter driver 114 collects these marked files. the file system filter driver 114 further monitors the activity level of the device 204 and the total size of the files marked for deletion or truncation 206 . the file system filter driver 114 further determines when the electronic device 100 is idle 208 and “trims” the flash memory at an optimal time 210 . by keeping these files set aside, a trim command may be executed at a later time to delete and/or truncate the files. in accordance with the disclosure, instead of immediately deleting the files (and removing knowledge as to blocks that belong to this file) at the time the user requests the delete, the file is renamed or moved instead. this allows the record of now unused blocks to be maintained and protected. then, the marked files may be deleted with the trim command at an appropriate time. that appropriate time may be at the next reboot, after a certain amount of ‘files-to-trim’ exist, or when the system is known to be less busy, so the performance impact will not be noticed by the user. referring to fig. 3 , the method of setting up the electronic device to implement the method of managing nand flash memory is shown generally at 300 . the file system filter driver 114 is loaded at boot time 302 . upon boot, the file system filter drive 114 reads the registry for the correct “filtermode” desired to be set 304 . the registry (in windows systems) is also read for the correct thread priority desired to be assign the file system filter driver thread (i.e. process) 306 . the file system filter driver 114 will also setup hooks to certain volumes on the file system 308 . this allows the file system manager to know when to call into the file system filter driver 114 . the file system i/o functions such as deletefile, createfolder, removefolder, etc., are also extended to the file system filter driver 114 to enable these functions to be called directly 310 . the functions to be exported can be found in the .def file of the file system driver filter 114 in windows systems. once this setup is completed, the file system driver filter 114 creates one or more system folders where files can be moved to for later trimming 312 . the title of these system folders may be “$trim.bin” or other suitable filename. the location may be at the root of the file system or other suitable location. this folder is also designated as a system folder and hidden to prevent inadvertent tampering of the contents. the file system driver filter 114 spawns two threads 314 , 316 . specifically, the idlethread and the trimthread. the purpose of the idlethread is to measure the systems idle time. the purpose of the trimthread is to constantly monitor the $trim.bin folders for any files to be trimmed. once found, and the correct system conditions are detected, the file system filter driver 114 can now execute a trim command to trim the files based on the previously set filter mode. the trimthread thread constantly monitors conditions in the system. as mentioned earlier, certain conditions can allow the trimthread not to trim files. these conditions may be: the system being in a busy state and being suspended. the trimthread can also adjust itself to certain system conditions where files are trimmed more aggressively. these conditions may include being in “flush” mode and being close to reaching the maximum size of the trim folder. files are only moved to the $trim.bin folder when a user calls the customer facing deletefile api on the volume into which the file system filter driver 114 has created a hook. most of the other functions that have been exported simply relay the user's commands down to the other filters that may or may not be set up on the electronic device. in summary, those of ordinary skill in the art would appreciate from the foregoing description and illustrations that the disclosed method of managing nand flash memory enhances the overall performance of the electronic device. by saving the deletion and truncation of files for a time when the electronic device is idle, the impact of trim commands on the system performance of the electronic device is minimized to the user, thus enhancing the user's productivity. while there is shown and described herein certain specific structure embodying the disclosure, it will be manifest to those skilled in the art that various modifications and rearrangements of the parts may be made without departing from the spirit and scope of the underlying concept and that the same is not limited to the particular forms herein shown and described except insofar as indicated by the scope of the appended claim. to supplement the present disclosure, this application incorporates entirely by reference the following patents, patent application publications, and patent applications: u.s. pat. nos. 6,832,725; 7,128,266;u.s. pat. nos. 7,159,783; 7,413,127;u.s. pat. nos. 7,726,575; 8,294,969;u.s. pat. nos. 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signal filed may 27, 2015 (showering et al.);u.s. patent application ser. no. 29/528,165 for in-counter barcode scanner filed may 27, 2015 (oberpriller et al.);u.s. patent application ser. no. 14/724,134 for electronic device with wireless path selection capability filed may 28, 2015 (wang et al.);u.s. patent application ser. no. 14/724,849 for method of programming the default cable interface software in an indicia reading device filed may 29, 2015 (barten);u.s. patent application ser. no. 14/724,908 for imaging apparatus having imaging assembly filed may 29, 2015 (barber et al.);u.s. patent application ser. no. 14/725,352 for apparatus and methods for monitoring one or more portable data terminals (caballero et al.);u.s. patent application ser. no. 29/528,590 for electronic device filed may 29, 2015 (fitch et al.);u.s. patent application ser. no. 29/528,890 for mobile computer housing filed jun. 2, 2015 (fitch et al.);u.s. patent application ser. no. 14/728,397 for device management using virtual interfaces cross-reference to related applications filed jun. 2, 2015 (caballero);u.s. patent application ser. no. 14/732,870 for data collection module and system filed jun. 8, 2015 (powilleit);u.s. patent application ser. no. 29/529,441 for indicia reading device filed jun. 8, 2015 (zhou et al.);u.s. patent application ser. no. 14/735,717 for indicia-reading systems having an interface with a user's nervous system filed jun. 10, 2015 (todeschini);u.s. patent application ser. no. 14/738,038 for method of and system for detecting object weighing interferences filed jun. 12, 2015 (amundsen et al.);u.s. patent application ser. no. 14/740,320 for tactile switch for a mobile electronic device filed jun. 16, 2015 (bandringa);u.s. patent application ser. no. 14/740,373 for calibrating a volume dimensioner filed jun. 16, 2015 (ackley et al.);u.s. patent application ser. no. 14/742,818 for indicia reading system employing digital gain control filed jun. 18, 2015 (xian et 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wireless charging and eas deactivation, filed jun. 24, 2015 (xie et al.).
067-845-344-861-361	US	[ "US" ]	F26B11/00,F26B3/00,F26B17/00,F26B17/10,F26B19/00,F26B11/12	2003-10-27T00:00:00	2003	[ "F26" ]	air dryer system and method employing a jet engine	an air dryer and process employs a jet engine for producing high quality dried products. a turbofan jet engine in an air-drying system uses both thermal and non-thermal air-drying. the turbofan jet engine is housed within an air distribution chamber for directing exhaust air and bypass air from the jet engine into a product drying tube, where it is dried through a combination of thermal drying from heat content in an engine exhaust, and by the kinetic energy of air flowing past the product traveling through the drying tube, that may include a physical impediment for retarding retard the speed of the product solids flowing in the air stream through the tube.	1 . an apparatus comprising: a housing having a chamber therein; a jet engine carried within the chamber; a hopper operable with the chamber at a first end thereof; a drying tube operable with the chamber at a second end thereof; a drying cyclone operable with the drying tube; and a separating cyclone operable with the drying cyclone.	cross-reference to related applications this application is a continuation application of u.s. utility application ser. no. 10/975,032, filed oct. 27, 2004, which claims the benefit of u.s. provisional application no. 60/514,477, filed oct. 27, 2003, the disclosures of which are hereby incorporated by reference herein in their entireties, all commonly owned. field of the invention the present invention generally relates to industrial dryers and in particular to a dryer employing a jet engine as a source of heat and air. background of the invention many different types of commercial and production endeavors require that a primary product produced and/or by-products thereof are to be dried at a stage after production process. drying is generally needed in, for example, food processing, fertilizer production, sludge removal and processing, chip and bark processing, agriculture manure processing, and in the processing of distiller's grain, cotton, soybean hulls, mine tailings, coal fines, pellets and powders employed in nuclear waste water cleaning, and many other applications. by way of example, equipment and systems used for drying or de-watering have been proposed over the years, and have met with varying degrees of success. such equipment has taken the form of presses (particularly screw presses), centrifuges, gravity screens, and thermal dryers of varying configurations and energy sources. in many of these types of units, drawbacks have included high purchase and operating costs, low output or throughput levels, a lack of range of drying ability, production of “burned” end product, and emissions control problems. in order for a new equipment design or approach to find some level of acceptability, the equipment should address one or more of the above drawbacks, and provide superior features over existing designs. many products, in order to serve their intended purpose, are subjected to thermal drying processes in order to reach the level of dryness necessary for use of the product. thermal drying is, however, a high cost operation. for cost reasons, many products can only be partially dried by known methods, as the price that such products are able to command does not allow for the cost of thermal drying. in many instances, these partially dried products could have a more beneficial use if the cost of drying were lower. many, if not most, refined products are thermally dried. there have been known efforts that attempted to develop a practical non-thermal air-drying system that would provide the necessary commercial production rates, but at a lower cost than that of thermal drying. the possibility exists that the end product would be of a higher quality, as well. it would appear that to date, known efforts have not yielded any truly promising systems or designs. one object of the present invention is to provide an apparatus and method for achieving a high production rate, with drying comparable to known high-cost thermal drying, at a cost lower than that of known thermal drying equipment. summary of the invention in view of the foregoing background, the present invention provides a process for producing a high quality dried product. objects of the present invention may be achieved by employing a power plant, in the form of a turbofan jet engine, in an air-drying system that may use both thermal and non-thermal air-drying. the power plant may produce large quantities of air and heat, and operate with efficiency and an operating cost that provides a system suitable for use in situations for which existing thermal drying systems are too costly to operate. one dryer system of the present invention may include a turbofan jet engine housed within an air distribution chamber that directs the exhaust air and bypass air from the jet into a material drying tube arrangement. material to be dried may be injected into the tube and is carried in the airflow stream, where it is dried through a combination of thermal drying from the heat content in the engine exhaust, and by the kinetic energy of air flowing past the material traveling through the tube arrangement. the tube arrangement may include one or more types of physical impediments designed to retard the speed of the solids flowing in the air stream through the tube and/or to create turbulence in the air stream, so that the material is further dried as the high speed air passes by at a higher relative velocity. the air distribution chamber may include a material preheating system in the form of a material feed belt and material flipper, wherein the material feed belt is thermally coupled to a jet exhaust air chamber, by sharing a common wall through which heat transfer is achieved, by way of example. for wetter materials that are initially in a mostly flowable form, a heat exchange coil can be employed, with the material being pumped through the coil, and the coil and material moving therethrough heated by the jet exhaust. the drying tube arrangement may include one or more drying cyclones, which are preferably designed to further impede the flow of material, so as to increase contact with the faster airflow through the tube arrangement. one or more product extraction cyclones may be provided at the terminal end of the drying tube arrangement. a material feed system embodiment may include a hopper for feeding material downwardly into rotating, spoked feed cylinders, which move the material from a position below the hopper into a path of the drying tube arrangement. at this position, the airflow through the drying tube arrangement draws the material from the cylinders into the drying tubes. brief description of the drawings the above and other aspects of the present invention will be more clearly understood from the ensuing detailed description of he preferred embodiments of the present invention, taken in conjunction with the following drawings in which: fig. 1 is a generally schematic side view of the apparatus according to one embodiment of the present invention; fig. 2 is a generally schematic view of the housing for the power plant according to an embodiment of the present invention; fig. 3 is a substantially schematic side view of the housing and feed system; fig. 4a and fig. 4b are schematic views illustrating airflow through a housing in accordance with an embodiment of the present invention; fig. 5 is a schematic top view of a preheating and/or pre-drying subassembly in accordance with an embodiment of the present invention. fig. 6 is a side elevation view of a material flipper used in the fig. 5 subassembly; fig. 7 is a perspective line drawing of the material flipper used in the fig. 5 subassembly; fig. 8 is a schematic top plan view of an alternative embodiment of a preheating and/or pre-drying subassembly; fig. 9 is a schematic side view of the housing/chamber incorporating the fig. 8 preheating and/or pre-drying subassembly; fig. 10 is a schematic side elevation view of a material injector subassembly in accordance with an embodiment of the present invention fig. 11 is a schematic top plan view of the fig. 10 material injector subassembly; fig. 12 is a perspective view of a feeder cylinder for use in the fig. 10 material injector subassembly; fig. 13 is a schematic side view of an alternative embodiment of a material injector subassembly; fig. 14 is a schematic cross-sectional view of the fig. 13 material injector subassembly; fig. 15 is a schematic side elevation view of a feed wheel and auger suitable for use with the fig. 13 material injector subassembly; fig. 16 is a schematic top plan view of the auger of the fig. 13 material injector subassembly, coupled to a tube carrying drying air therethrough; fig. 17 is a schematic side elevation view of an alternative preferred embodiment of a drying apparatus in accordance with teachings of the present invention; figs. 18 a-d are schematic cross-sectional views of a drying tube assembly employed in an embodiment of the present invention; figs. 19 a-e are schematic cross-sectional views of a drying tube assembly employed in an alternative embodiment of the present invention; figs. 20 a , b are schematic cross-sectional views of a drying tube assembly according to an alternative embodiment of the present invention; fig. 21 is a schematic cross-sectional view of a drying cyclone which may be employed in accordance with one embodiment of the present invention; fig. 22 is a schematic cross-sectional view of a lateral drying elevator in accordance with a preferred embodiment of the present invention; fig. 23 is a schematic side sectional view of one lateral drying elevator; fig. 24 is a schematic top plan view of the lateral drying elevator and a flared inlet section of tubing; fig. 25 is a schematic view of a particle collider in accordance with an embodiment of the present invention. detailed description of the preferred embodiments the present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. this invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. like numbers refer to like elements throughout, and prime notation is used to indicate similar elements in alternate embodiments. referring initially to fig. 1 , components an air-dryer apparatus 10 according to the present invention are shown. a housing 12 includes an air distribution chamber 11 is provided at the front end of the apparatus 10 . the chamber 11 has mounted therein a jet engine 14 , such as a turbofan jet engine, by way of example. the structure and operating characteristics of turbofan engines are generally known in the art. by way of example, a turbofan engine has a core engine and a bypass duct that directs most of the airflow around the core engine or turbojet, where it is ejected through a cold nozzle surrounding a propelling nozzle at the exit of the core engine. the bypass air is at a lower temperature and a relatively lower velocity, compared with the air exiting the core engine. as is well known in the aviation art, the use of bypass airflow makes the turbofan engine considerably more fuel-efficient than a pure turbojet engine. the specific operating and performance parameters and characteristics of the turbofan engine to be used in the apparatus of the present invention will likely vary depending upon the size/capacity of each particular drying apparatus that is designed and engineered for a specific drying application. it is anticipated, however, that the design of a given dryer apparatus will be driven in part by selection of commercially available turbofan engines. with reference again to fig. 1 , the chamber 11 may be on the order of eight (8) feet in height, by 7.5 feet in width, by about twenty-four (24) feet in length. the chamber 11 illustrated in fig. 1 has a hopper 16 and a preheating unit 18 disposed at an upper surface of the housing 12 . the preheating unit 18 is coupled to housing 12 such that heat generated by the turbofan engine 14 is transferred to the material to be dried, thereby elevating the temperature of the material and bringing the water or other liquids contained in the material to be dried closer to an evaporation point. fig. 1 also illustrates a drying tube assembly 20 into which the material to be dried is introduced. as discussed in greater detail later, the drying tube may include protrusions or other obstacles to slow the speed of the material to be dried relative to the air flow velocity of the jet air. also shown in fig. 1 are two drying cyclones 22 , 24 , in which the solid material is further slowed by protrusions disposed on the inside of the cyclone wall. the solid material may also be broken up by the protrusions. the material and airflow are carried through the two drying cyclones 22 , 24 to a separating cyclone 26 which separates the material from the air flow, and removes the material as a finished product from the lower portion of the cyclone 26 . the length or amount of drying tube to be employed, as well as the number and size of the drying cyclones to be used (if any), will be determined as the equipment design and layout is undertaken for each particular application in which the apparatus is to be used. the schematic view of chamber 11 in fig. 2 is provided to show one general positioning of the turbofan jet engine 14 in that chamber. the jet engine 14 may be mounted in an appropriate manner at one end of the chamber 11 , with the engine having its air intake at the outer periphery of the chamber. it is envisioned that, in one preferred embodiment, all or a portion of the intake air to the engine will be air that is recovered from the product separating cyclone at the terminal end of the process, and is treated prior to returning it to the inlet of the jet. with reference to figs. 1, 2 , 3 and figs. 4a and 4b , it can be seen that the air distribution chamber 11 , handles the high temperature, high velocity jet exhaust air, the jet engine bypass air, and an ambient air flow. the jet exhaust air may preferably be passed through a transfer pipe 30 into a hot air duct 32 , and passed upwardly into heating chamber 34 . heating chamber 34 will transfer heat to and through an upper wall 36 of the heating chamber 34 . the engine exhaust air will then flow out of heating chamber 34 through 35 , into an air mixing chamber 38 , where the hot air is mixed with the engine bypass air, as well as, optionally, ambient air drawn into chamber 12 through one or more openings in the walls thereof. the vents can be controlled (i.e., opened or closed) as desired to regulate the pressure in heating chamber 34 , as desired or as may be required. in the construction illustrated in figs. 1-4 , the mixed air then passes through exit openings 40 ( figs. 4a, 4b ) disposed along each lateral wall 42 , 44 of chamber 11 , and into drying tube 20 ( fig. 1 ), that is connected to each of the exit openings 40 . fig. 3 illustrates a preheating system 18 , having a wet material hopper or bin 16 , a feed belt 54 , made of stainless steel, by way of example, in consideration of the temperatures that will be experienced, and a series of material flippers 56 . in this embodiment, wet material is fed to bin or hopper 16 , and may be deposited therefrom onto feed belt 54 . feed belt 54 runs along upper wall 36 of heating chamber 34 , and is either in contact with, or is spaced closely apart from, the wall 36 . as the feed belt 54 advances the material, the material flippers rotate to lift and flip the material on the belt, so that different surfaces of the material are exposed to the heat emanating from heating chamber 34 . once the material reaches the end of the belt, it has been pre-heated and/or dried to a desired extent, and the material is deposited into a material injection box 100 , which operates to introduce the material into the airflow of the drying tube 20 , in a manner that will be discussed in greater detail later herein. figs. 5-7 illustrate in greater detail the construction of the preheating/predrying subassembly. feed belt 54 may be driven by a motor and gearbox, illustrated schematically at 58 in fig. 5 . the wet material bin or hopper 16 is disposed above the belt at its forward end. each of shafts 60 is intended to show the position of the center shaft of a plurality of material flippers 56 . as seen in figs. 6 and 7 , the material flippers have a central shaft 60 and a plurality (three shown) of arcuate flipping blades 62 extending along a majority of the length of central shaft 60 . the length of the blades will preferably be determined to correlate to approximately the width of feed belt 54 . the central shafts 60 of the material flippers will be rotated by gearing, belt, or other drive coupling means, and will preferably be driven by either motor/gearbox 58 or by an independent motor or drive means. the material flippers 56 may be rotated in a direction counter to the feed direction of the belt such that the blades operate to scoop and lift material from the feed belt, and deposit the material substantially on a side which was not previously in contact with the feed belt. the number of, and spacing between, the material flippers will preferably be determined based upon the particular requirements and features of a given dryer unit. consideration should generally be given to the length of time which the material should stay in contact with the belt to be heated and dried, and how many times a flipping or agitation to expose other portions of the material to the heat will affect the desired drying results. figs. 8 and 9 illustrate an alternative preheat design that takes advantage of a large thermal capacity of the jet engine exhaust. in the place of a feed belt 54 , a tubing or pipe construction, that will herein be termed a coil 70 , is provided in the heating chamber 34 . the coil 70 may preferably comprise multiple straight runs of pipe or tubing 72 connected at alternate ends in a serpentine-type manner, through which wet material may be passed to be preheated and/or partially dried. it is envisioned that a coil may be used in place of the feed belt preheat subsystem particularly where the drying apparatus is designed to process wetter materials, such as those having an initial liquids content of greater than about 50%, or even higher. the high liquid-content (or low solids content) material may preferably be pumped from a holding tank 74 through the coil by a positive displacement pump 76 having a variable drive, of a type known to those of ordinary skill in the art. where the preheating coil subassembly is employed with materials expected to exhibit higher viscosities, it is envisioned that other material delivery equipment of an injection type, such as a concrete pump, may be employed. the coil may be mounted in the heating chamber 34 from the bottom, or may alternatively be suspended from the top of the chamber. fig. 8 illustrates the tubing 72 running essentially parallel to the longitudinal direction of chamber 11 , with the inlet 78 disposed at one end, and the outlet 80 at the other. variations to this, such as other positioning of the inlet and outlet, and tubing orientation (e.g., extending transverse to the longitudinal direction of the chamber), are seen as being design choices available to persons of ordinary skill in the art, and within the scope of the invention herein. the material passing through the coil 70 is heated, such that the liquid may partially evaporate and become a separate phase from the wet solids material. it is also envisioned that the material emanating from the outlet could be introduced into a large volume, low pressure area or chamber, where the heated liquid would be permitted to “flash” off as a separate vapor phase, leaving the material considerably drier as it is introduced into the main dryer. if it is desired to provide an air-dryer apparatus that could be used to process both high liquids content materials and higher solids content materials, both the coil subassembly within the heating chamber and the feed belt subassembly atop the heating chamber may be provided. selection of which preheat system to use may then be made based upon the properties of the material being introduced. figs. 10, 11 and 12 illustrate one preferred embodiment of a material injector subassembly 100 , used to introduce a mushy material (either preheated/predried or not) into the main drying tube assembly 20 . this drying tube system, as illustrated, includes two sets of tubing 24 , 26 , which run along essentially identical paths (or mirror image paths), or, alternatively are joined together into a single tubing run at a desired point downstream of the material injector subassembly 100 . if smaller drying capacities or throughput are desired, the system may be designed to have only one tubing run, and a single injector in the injector subassembly. alternatively, the system may be designed to run at half-capacity, wherein the material is fed to only one half of the material injector subassembly 100 . illustrated with reference to fig. 3 , the material injector subassembly 100 may be located at an exit end of the feed belt subassembly, or at the exit to the preheating coil subassembly, when this equipment is present in place of feed belt 54 . fig. 10 illustrates schematically that the solids material is fed from the preheater subassembly 102 into injector hopper 104 . operating within hopper 104 are a pair of feeder cylinders 106 . feeder cylinders include a drum core 108 affixed to a drive shaft 110 . extending radially outwardly from drum core 108 are a plurality of spokes 112 , and, attached at an outer periphery of the spokes is an outer cylinder wall 114 . as illustrated with reference to fig. 10 , the feeder cylinders 106 are coupled to a gearbox and motor assembly 116 , which operates to rotate the feeder cylinders 106 inside of hopper 104 . the material to be dried is deposited into hopper 104 , at a central portion thereof. the material may substantially fill each sector 118 formed by the spokes 112 extending between the drum core 108 and the outer cylinder wall 114 , as each sector rotates through the central portion of the hopper. the sectors 118 carry the material from the central portion of the hopper to a position at the outer portion of the hopper which is in alignment with, and open to, the two sets of tubing 24 , 26 of the drying tube assembly 20 . as the sectors rotate into alignment with openings 120 in the hopper 104 , which openings are in alignment with and sealed to tubing sections, the material will, by force of the airstream flowing through tubing 24 , 26 , and/or gravity, exit out of the hopper and into the drying tube assembly 20 . as will be recognized from viewing fig. 11 in particular, the material will be fed substantially continuously into the drying tube 20 , as the spokes are continuously advancing new material toward the openings 120 . it will be recognized that this material injector equipment may be sized and operated for various feed rates or capacities, as an ordinary exercise in engineering. in a system, for example, in which drying tubing 24 , 26 has a 24″ diameter, the feeder cylinders 106 may preferably be six (6) feet in outer diameter, the drum core may be two (2) feet in diameter, thus resulting in the spokes 112 being 24 inches in length, correlating to the 24-inch diameter of tubing (see fig. 11 ). with the material injector equipment so sized, and with the feeder cylinders 106 rotating at a speed of one (1) revolution every eight (8) minutes, the equipment is capable of delivering about 20 tons of material per hour into the drying tube assembly 20 . with reference again to fig. 10 , at the upper and lower portions of hopper 104 , appropriate seals 122 , 124 are provided that abut the upper and lower surfaces of the feeder cylinders 106 , so as to contain the material deposited in sectors 118 as the feeder cylinders turn. by way of example, the seals 122 , 124 , may preferably be made of delrin®, which will also serve to lubricate the regions of contact between the cylinders and seals. other materials may be employed, as will be recognized by persons of ordinary skill in the art. an alternative preferred material injector subassembly 300 is illustrated in figs. 13-16 . in this embodiment, the housing 12 for turbofan engine 14 has a single, substantially horizontally oriented, tube 302 that is coupled to the drying tube assembly described earlier with reference to fig. 1 . a hopper 304 is positioned to receive material from a preheat section, such as the feed belt system illustrated in fig. 3 . hopper 304 has one or more, and preferably two feed wheels 306 , 308 at a lower extent thereof. material advances downwardly through hopper 304 , and is optionally agitated by a stirring bar 310 , and then enters sectors 312 of the vertically oriented rotating feed wheels 306 , 308 . it will be recognized, in viewing especially figs. 14 and 15 , that feed wheels 306 , 308 , have spokes extending radially from a central core, but are open at the periphery to receive the material therein. thus, the construction may be similar to that of feeder cylinders 106 , but without using outer cylinder wall. feed wheels 306 , 308 rotate around a horizontal axis, and deliver material to an auger 314 having blades 316 , 318 canted to advance the material inwardly into tube 302 , and into the airstream exiting housing 12 . fig. 15 illustrates that feed wheels 306 , 308 , and auger 314 may be mounted in a structure 320 that serves as an air lock, which prevents the air flowing through tube 302 from exiting out through the material injector subassembly 300 . after material is dumped out of each successive sector 312 of the rotating feed wheels into auger 314 , auger rotates to advance the material inwardly toward tube 302 . as can be seen in fig. 16 , tube 302 may be provided with a vane or vanes 322 , or other flow restrictor, to provide a venturi effect at the area where auger empties into tube 302 . the vanes may be disposed only at the area immediately upstream of the auger entry openings, or may be provided around the entire inner diameter of the tube 302 in this region. fig. 17 illustrates an alternative preferred variation on the unit illustrated in figs. 13-16 . in this embodiment, no preheater subassembly is provided, in that there are some potential applications for this apparatus which will not require a preheating stage. in this embodiment, the housing 400 will not generally serve as an air distribution box, and is provided principally for noise reduction, with appropriate sound insulation. engine exhaust air and engine bypass air, as well as any ambient bypass air brought into housing 400 , are joined and sent directly into tube 402 , which is coupled to a drying assembly 410 . in this embodiment, one preferred material injector subassembly may be the subassembly 300 described and illustrated with reference to figs. 13-16 . material will enter tube 402 from an auger 314 , ( fig. 14 ), and the material will become entrained in the airstream exiting housing 400 , and conveyed to the drying tube assembly. material may be fed to the hopper 304 by a material conveyor or any other suitable means, by way of example. by way of example, the above-described material injector subassemblies may be used where the material to be dried is either a mushy solid, a pretreated material that contains on the order of 35% solids, or superhydrated materials. other feed systems, such as positive displacement pumps with variable drives may be used where the material is more fluid. further, for higher viscosity materials, an injection system such as a concrete pump may be used. by way of further example, once the material enters the drying tube assembly 20 , an objective in obtaining the maximum of a desired level of drying in the system is to maintain the air flow at as high a rate as the system will permit, while slowing down the material traveling through the drying tube assembly to a maximum extent possible, without causing clogging. this will permit both the thermal energy and the kinetic energy of the flowing air stream to operate to dry the material to a desired level. one approach may involve simply using vertical tubing runs with an upward airflow, as would be the case in tubing section a in figs. 1 and 17 . the material resists becoming fully entrained in the upward airflow through tubes 24 , 26 , due to gravitational forces acting on the material. this approach is believed to be especially suitable for use when the material is at its wettest or heaviest condition, such as at a point shortly after being initially introduced into the drying tube assembly 20 . another approach may involve the use of physical obstructions within the drying tubing runs. figs. 18 a-d, 19 a-e, and 20 a, b, illustrate some preferred examples as to how this approach could be implemented. figs. 18 a-d represent, schematically, cross-sections of a drying tube ( 24 or 26 ) at successive positions along the length of the tube. a plurality of rods 90 , made of steel or other material, may be positioned to protrude across a portion of the cross-sectional area inside the tube. the rods would preferably be positioned to be perpendicular to the flow direction, and, as seen in the successive views, may be rotated by 90° at each successive position, i.e., horizontal upper, vertical left, horizontal lower, vertical right, within the tube (as shown in figs. 18 a-d). such a pattern may be repeated at several locations along the length of the tube. the rods are positioned to impede the progress of solid materials passing thereby, by physically interfering with the passage of the material. it can be seen in viewing all of figs. 18 a-d collectively that a central area of the tube may have no rods or other physical impediments such that the airflow may continue substantially unimpeded while various portions of the material will collide with the rods 90 as the material is advanced by the airstream. the rods may, alternatively, be positioned at angles, orientations, and positions that are not illustrated, as desired. figs. 19 a-e illustrate an alternative embodiment in which material flow is impeded by placement of physical obstacles. a plurality of flaps 92 are provided. the flaps 92 may be constructed of steel or other material, and may be secured to an inner wall of the tube by weldment or other suitable fastening means. flaps 92 may individually occupy approximately 25% of the cross-sectional area of the tube, or any lesser or greater percentage, as desired. the flaps 92 may preferably be canted or inclined in the direction of airflow through the tube (see fig. 19e ), such that the material impinging against each flap 92 will be allowed to slide free of the flap after being slowed by the collision with the flap. the positioning of the flaps 92 may be successively at different orientations relative to the previous flap. thus, moving in the direction of airflow proceeding from fig. 19a to fig. 19d , the flaps may be positioned (in the orientation illustrated), in a top portion of the tube, a bottom portion, a left portion, and a right portion. alternatively, the 90° rotation scheme used with rods 90 in figs. 18 a-d could be employed. while the flaps 92 are shown as being somewhat fan-shaped or rounded, the shape is not seen as being critical to the proper operation of the flaps, and other shapes may perform equally as well. by way of example, figs. 20 a , b, illustrate yet an additional embodiment of a physical impediment to material flow. this embodiment employs a diverter flap 94 that is preferably mounted along a centerline of the cross-section of the tube, and is mounted by control arm 96 so as to be pivotable within the tube. as can best be seen in the cross-sectional view of fig. 20b , the diverter flap 94 may be pivoted or rotated into varying positions to impede the flow of solid material (principally), to varying degrees. it is envisioned that a handle 98 extending from control arm 46 will be moved cyclically by an automated program and control means (not shown), such as solenoids and timers, to provide intermittent and varying degrees of blockage to one side of the tube, and then the other side of the tube. the handle 98 and diverter flap 94 are preferably positioned to lie in the same plane, such that the position of the handle at the exterior of the tube is representative of the position of the diverter flap 94 inside the tube. with reference again to the schematic illustration of the system in fig. 1 , drying cyclones 22 , 24 , may be employed as a further means of retarding material flow while permitting the airflow to remain at higher rates. fig. 21 is a schematic cross sectional illustration of one embodiment of such a cyclone 22 , 24 . the airflow with entrained material enters the cyclone, preferably tangentially, through inlet 81 . the material spins in a circular motion in an upper portion 82 of the cyclone, while a center spool 83 collects a majority of the airflow, and conveys the air through air line 84 to a continuation of drying tubing 28 , 29 . the upper portion 82 may have hardened teeth 85 protruding from the walls to slow and breakup the solid material while moving toward the bottom of the cyclone. a deflector assembly 86 extending underneath center spool 83 and extending outwardly to the walls of the upper portion 82 of the cyclone may be provided to aid in controlling air and material flow. the walls 87 of cyclone 22 , 24 may be heated to enhance the drying/evaporation of the material coming into contact with the walls. heating elements 88 may preferably be hot air chambers into which heated air from the airflow stream is passed, or any other type of heating element that will not significantly detract from the energy efficiency of the overall system. as the material slows and falls to the lower portion of the cyclone, it exits through cyclone outlet 89 . cyclone outlet 89 is coupled to the continuation of drying tubing 28 , 29 , and deposits the material into the air flow in the tubing. in one preferred embodiment, the region in which the material reenters the airflow stream is configured such that a venturi effect can be achieved in tube 28 , 29 as the material is introduced, or immediately upstream thereof. it is envisioned that it may be necessary to introduce additional, or makeup, air prior to the entry point where the material rejoins the airstream, as indicated by arrow b. the continuation of tube 28 , 29 , will convey the material further downstream, to either a second drying cyclone, or through additional drying subassemblies, or to the final material separating cyclone 26 . the size of the drying cyclone will likely vary for each dryer apparatus that is designed and engineered for different applications. the cyclone or cyclones are employed, as noted, to increase the differential in speed between the main air flow and the material to be dried, and the size, including internal diameter and length, may be varied as a matter of routine engineering to achieve the desired effect. with reference now to figs. 22-24 a lateral drying element (lde) 500 may advantageously be used in the dryer apparatus of the present invention. the lde 500 has an inlet 502 into a generally cylindrical chamber 504 . as can best be seen in figs. 23 and 24 , the inlet is coupled to tube 28 or 29 by a flared section of tubing 27 , which flattens the cross-section through which the air and material must flow. the air and material are introduced into chamber 504 substantially tangentially to the chamber. a wedge-shaped flow splitter 506 is provided at substantially the center of the longitudinal extent of chamber 504 . flow splitter 506 extends along the wall of chamber 504 from a point substantially adjacent inlet 502 , and around approximately one-half to two-thirds of the inner periphery of chamber 504 . the inlet and flow splitter will operate to divide the incoming air flow and material into two approximately equal flow streams, and the air and solid material will travel around the interior of the lde several times before being advanced to outlet tubes 508 , 510 . as shown schematically in fig. 22 , the outlet tubes are recombined downstream into a continuation of tube 28 or 30 . internal tubes 512 , 514 may optionally be suspended at the central area in chamber 504 , which will operate to more directly and more quickly direct principally an air flow of the incoming air and material toward the outlet tubes. one or more ldes 500 may be positioned in the run of tubing 28 , 29 , either in place of, or in addition to the one or more drying cyclones. the lde 500 increases the dwell time or retention time of the air and material in the dryer. one potential advantage of an lde as compared with, for example, a drying cyclone, is that the unit may be oriented in any number of ways, as it is not ultimately wholly dependent on gravity to operate effectively. with reference to fig. 25 , a chamber 530 may be used in the air dryer apparatus of the present invention. this solids particle collision chamber 530 may preferably be used in tandem with an lde 500 , in that the material leaving the lde is preferably split into two material streams, shown schematically at 532 , 534 . one collision chamber 530 may include a housing 536 and two inlet pipes 538 , 540 . the inlet pipes 538 , 540 are positioned to direct the two material streams 532 , 534 , toward one another, so that the solid particles will collide into one another. with the speed of the particles expected to be on the order of 400 mph, and thus having a high momentum, the collisions induced will cause the particles to break up. this results in a reduction of the average particle size of the solid material, which in turn increases the exposed surface area of the solids material. the increased surface area will enhance the ability of the flowing air stream to dry the material. after the opposing material streams collide in housing 536 , these streams may preferably be united into a single stream flowing through outlet 542 . outlet 542 will be coupled to the dryer tube system 20 , and the air stream and material carried therein will continue to a further component in the air dryer apparatus 10 . many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. therefore, it is understood that the invention is not to be limited to the specific embodiments disclosed, and that modifications and embodiments are intended to be included within the scope of the appended claims.
069-349-779-196-911	US	[ "US" ]	B25J9/16,B65B11/00	2014-11-14T00:00:00	2014	[ "B25", "B65" ]	sorting apparatus and method	a system for sorting comprising an x-y-z stage including a suction cup attached thereto, a camera, a computer connected to the x-y-z stage and the camera, and a translucent platform for sorting with the platform mounted below the camera and the x-y-z stage.	1 . a system for sorting comprising: an x-y-z stage including a suction cup attached thereto; a camera; a computer connected to said x-y-z stage and said camera; and a translucent platform for sorting, said platform mounted below said camera and said x-y-z stage. 2 . the system of claim 1 wherein said camera comprises two or more cameras above said platform. 3 . the system of claim 1 further comprising a camera mounted below said platform. 4 . the system of claim 1 further comprising a light source mounted below said platform. 5 . the system of claim 1 further comprising light sources mounted above and below said platform. 6 . the system of claim 1 wherein said platform comprises hdpe. 7 . the system of claim 1 wherein said platform includes a fiducial marker that is visible to said camera. 8 . the system of claim 1 wherein said suction cup is a bellows type suction cup. 9 . the system of claim 1 further comprising a utensil wrapper. 10 . the system of claim 1 wherein said suction cup is connected to a rotation motor. 11 . a system for sorting comprising: a computer connected to an x-y-z stage, said x-y-z stage including a vacuum gripper; a camera connected to said computer; and a surface including a fiducial marker within the field of view of said camera. 12 . the system of claim 11 wherein said camera comprises two or more cameras above said surface. 13 . the system of claim 11 further comprising a camera mounted below said surface. 14 . the system of claim 11 further comprising a light source mounted below said surface and wherein said surface is translucent. 15 . the system of claim 11 further comprising light sources mounted above and below said surface wherein said surface is translucent. 16 . the system of claim 11 wherein said surface comprises hdpe. 17 . the system of claim 11 wherein said vacuum gripper is a bellows type suction cup. 18 . the system of claim 11 further comprising a utensil wrapper. 19 . the system of claim 11 wherein said vacuum gripper is connected to a rotation motor. 20 . a method for sorting comprising the steps of: taking an image of one or more items on a sorting platform; identifying an item in the image; determining the location of the item in the image relative to a pick-up head; moving said pick-up head to the location of the item; picking up the item using a suction cup; and moving said pick-up head and item to a different location.	i. background a. field of the invention the invention relates to the fields of electro-mechanical sorting systems, data processing systems, and food service related machinery. b. description of related art sorting/separating and/or counting items from a group or mixed bunch is a task that is frequently encountered in manufacturing and processing items. for example, a batch of walnuts might need to be: 1) counted; 2) sorted to separate discolored walnuts from desired walnuts; 3) sorted to separate broken walnuts from whole walnuts; and/or 4) sorted based on a variety of other selection criteria. the task of sorting/separating and/or counting items from a group or mixed bunch can be classified in two ways: 1) sorting items with regular/consistent shapes/characteristics; and 2) sorting items with irregular shapes/characteristics or mixed items. the need to sort items with regular or consistent shapes frequently occurs in manufacturing and operating environments. for example, in the manufacturing of nuts or bolts, each item is substantially regular such that highly engineered processing equipment that relies on regularity can be used. vibratory feeder bowls are one such piece of equipment. typically, this equipment relies on the fact that the items are (1) unmixed (e.g., only nuts or only bolts); (2) substantially regular; (3) serially presented; and/or (4) not entangled so that they may be processed mechanically. often, each sorting device is specific to the characteristics of a particular item. thus, sorting different items requires different sorting apparatus and/or substantial reconfiguration of the hardware components. similarly, sorting items of irregular or inconsistent shapes, or mixed items, is a difficult problem encountered in a variety of manufacturing and operating situations. an exemplary situation is the processing of mixed eating utensils in either manufacturing, cleaning, or sorting operations. for example, styles of utensils vary greatly in their dimension, weight, color and other physical characteristics. accordingly, mechanical equipment (e.g., a vibratory feeder bowl) designed to process one style of spoon is unlikely to work for another style of spoon. moreover, even among spoons of the same style, substantial variation often exists in other physical characteristics such as weight, shape, or color. another layer of difficulty is encountered processing a mixed group of eating utensils which may include forks, knives, spoons or other items (e.g., soup spoons, serving spoons, butter knives, pickle forks, etc.). equipment to process such a group must separate and process each item. designing equipment with such flexibility is challenging. yet another level of difficulty in sorting, separating, counting and/or packaging eating utensil is presented by fork tines. fork tines contribute to forks becoming entangled with each other and other comingled eating utensils including knives and spoons. thus, sorting and processing eating utensils from a mixed group has presented a difficult problem for manufacturers, vendors and others handling such a mixed group. one approach to sorting mixed items relies on material properties. for example, some sorting equipment sorts metallic from non-metallic items using magnetism. although this approach can work in some instances, it may not be suitable for instances where the items to be sorted from each other are either all austenic or non-austenic or where the different magnetic properties vary by small or difficult to control or predict amounts. even in the case where all austenic sorting can be used, such sorting equipment is limited to items that are metallic and can be effectively magnetized. accordingly, sorting equipment that relies on the regularity of the austenic property has limited flexibility and funcationality. one effort to separate and process a mixed group of eating utensils is described in akella (2008). this method is designed to process only utensils that can be magnetized. in akella, mixed utensils are placed in a vibrating, sloped bin with baffles. as a utensil falls through the bin and the baffles, it is separated until it collects at a point against a moving conveyor that is sloped. beneath the conveyor are a series of moving magnets. as the magnets pass the collected utensils, utensils are attracted and carried towards an electronic camera. software processes images from the camera to identify the utensil as it passes the camera by examining the perimeter and area of the item. the utensil continues on the conveyor until it reaches a series of selectors. a selector corresponds to each type of utensil (e.g., fork, knife, or spoon) which is under control of a processor running an image processing algorithm. items that are unrecognized continue on the conveyor to a final selector where they are collected in a bin for out-of process attention. a similar style of device is the acs-400c cutlery sorting system manufactured by wexiodisk. although this approach has advantages over other solutions, it suffers from a number of drawbacks. one deficiency is that the method works only on utensils that can be magnetized. many common styles of eating utensils are not susceptible to magnetization including those made of plastic, wood or non-austenic metal. further, many styles of utensils are made from a combination of metal (which may or may not be sufficiently magnetizable) and another material (e.g., wood on wooden handles). these items either cannot be sorted by equipment relying on magnetism or cannot be sorted meaningfully, i.e., with sufficient sorting to avoid a significant portion being unsorted. another drawback of this method is the size of the sorting mechanism. the elements of such a system, i.e., bin, conveyor belt, and selector, require a significant area and are not practical in areas with limited space, including, but not limited to, restaurants. accordingly, a pressing need exists for equipment that can sort, separate or count items, especially mixed items, that does not rely on a material property or its regularity as the principal sorting feature. the present invention overcomes many of the disadvantages of prior systems and methods. as a subset of the more general sorting/separating problem, a pressing need exists for equipment that can sort, separate and count eating utensils, particularly when such utensils are comingled. comingled utensils are a common occurrence in the food service industry. for example, mixed soiled utensils are collected and then either: 1) sorted before being placed in dishwashing trays; or 2) placed mixed in dishwashing trays and sorted after washing. frequently, the sorted utensils are assembled into groups (e.g., fork/knife/spoon, fork/knife, fork/spoon, or another group) and wrapped in either a paper or linen napkin. in the food service industry, utensils wrapped in a napkin are often referred to as “roll-ups.” roll-ups are used in the food service industry for numerous reasons including 1) enabling more rapid setting of dining tables and 2) protecting eating utensils from contamination before use, which contamination may result from being touched by personnel prior to use. a roll-up facilitates a rapid table setting with the correct number and combination of utensils. although roll-ups have the above described advantages, one significant disadvantage is the time and cost needed to assemble the roll-ups. typically, servers, bus persons, hosts, bar staff, or other food service personnel spend significant amounts of time assembling roll-ups before, after, or during food service shifts. in some cases, in view of the significant time required to prepare roll-ups, a food service establishment, manufacturer or supplier, may hire personnel for the primary task of preparing roll-ups which adds to labor costs. in addition to cost, preparing roll-ups is known to be a disfavored task among food service employees because it is perceived as monotonous, repetitious, unskilled and/or mindless. further, the task does not directly result in increased income because it does not result in gratuities which typically are a significant component for such food service personnel. these factors cause significant problems for food service managers who must hire, train and supervise employees assembling roll-ups. in addition, employment laws and regulations often affect which employees can be assigned a roll-up task, their compensation, work breaks and other employment issues. finally, roll-ups inherently involve health risks because cleaned utensils are handled by food service personnel before use by a diner. even with strict hygiene practices, the handling of washed utensils by food service workers is a potential source of contamination and illness. a single health related incident at a food service establishment can effectively terminate a food service business. thus, there is a pressing need for a system and method that can separate and sort utensils, and assemble such utensils in various groups, preferably wrapped in a napkin, in an automated fashion. ii. summary of the invention the problem of sorting mixed items is addressed by using an x-y-z stage connected to a computer and one or more cameras. the camera(s) take images of items to be sorted. using the information of the image, the computer directs the x-y-z stage to a desired location where a vacuum is applied through a suction cup to retrieve an item. in one embodiment, items to be sorted are placed on a sorting table. in yet other embodiments, the sorting table is lit from above to facilitate imaging by the camera(s). in yet other embodiments, the sorting table is translucent and lit from below to further facilitate imaging by enhancing contrast. in further embodiments, the sorting table includes one or more fiducial markers to facilitate determining the relative position of items in the image. in yet further embodiments, a camera looks up at retrieved items to verify the item actually retrieved. in yet further embodiments, the suction cup is provided with the ability to rotate and a look up camera provides an image of the item retrieved to enable the connected computer to determine how to rotate the item to achieve a desired orientation. in another embodiment, the suction cup is a bellows type. in another embodiment, the sorting platform is made of hdpe. when used with utensils, yet a further embodiment includes a wrapping mechanism that can roll utensil assemblies in a napkin to form a roll-up. iii. brief description of the drawings fig. 1 is a cross sectional view showing major components of the apparatus. fig. 2 is an overhead view of the sorting platform; figs. 3a and 3b depict fields of views of look down cameras. figs. 4a and 4b depict the fields of view and heights of the look down cameras of figs. 3a and 3b respectively. fig. 5 is an overhead view of the sorting platform depicting regions that may be designated. figs. 6a and 6b depict alternative sorting platform and support structures. fig. 7 is a cross sectional view depicting an alternative arrangement of the xys stage. figs. 8a and 8b are overhead and side views of item orientation. fig. 9 is a block diagram of control components. fig. 10 is a detailed view of the pick-up head. figs. 11a, 11b, and 11c depict the components of and axes of movement of the xyz stage. fig. 12 is an exterior view of the apparatus. fig. 13 is a flow diagram of image processing steps. the drawings are intended to depict only the general features and relationship of the items depicted therein in exemplary embodiments and are not to scale. iv. detailed description of the preferred embodiments exemplary embodiments will be described hereinafter with reference to the accompanying drawings, in which exemplary embodiments and examples are shown. like numbers refer to like elements throughout. other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented herein. it will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, separated and designated in a wide variety of different configurations. further, in the following description, numerous details are set forth to further describe and explain one or more embodiments. although these details are helpful to explain one or more embodiments of the disclosure, those skilled in the art will understand that these specific details are not required to practice the inventions set forth in the claims. fig. 1 depicts the general layout of a preferred embodiment of the invention. shown there is a utensil sorting and wrapping apparatus ( 101 ). starting at the top, shown there are light panel ( 102 ), camera(s) support/diffuser panel ( 103 ), camera(s) ( 104 ), xyz stage ( 105 ) including pick-up head ( 106 ), sorting platform ( 111 ) including lookup camera(s) ( 109 ), and pass through aperture ( 108 ). apparatus ( 101 ) further includes a light panel ( 107 ), wrapping area ( 112 ) and collection bin ( 113 ). the individual items are further described below. although not part of the apparatus itself, also shown is dishwashing tray 110 . as shown in fig. 2 , dishwashing tray 205 may contain utensils for sorting. sorting items from a dishwashing tray eliminates the step of unloading utensils from the tray and, therefore, facilitates operations. nevertheless, any container for utensils may used or no container used at all. because it is envisioned that a dishwashing tray will be used, the description that follows assumes use of a dishwashing tray but it is not intended to be limiting. not shown in fig. 1 are additional components, including a control computer, cnc controller, and pneumatic air source and controller. the relationship of those items to the depicted items will be apparent and is discussed below. a. lighting as shown in fig. 1 , light sources 102 and 107 are panels supporting lighting elements shining down (panel 102 ) and up (panel 107 ). in the preferred embodiment, the lighting elements are led light strips sufficient to light the length and width of sorting platform ( 111 ), a subsection thereof, or dishwashing tray 110 . the lighting elements may also be comprised of any other light source including fluorescent lighting. as described below, the lighting elements illuminate sorting platform 111 (and anything thereon), a subsection thereof, or dishwashing tray 110 either from above (light source 102 ) or below (light source 107 ). although the preferred embodiment includes a plurality of light sources 102 and 107 with lighting elements, alternative embodiments include those with no lighting source, a single lighting source, or lighting panel(s) may be present but no lighting elements provided. in the case where at least one panel with lighting elements is present, that panel should provide sufficient lighting to enable the camera(s) 104 to capture images used to locate and recognize an item in dishwashing tray 110 and/or on sorting platform 111 . in the case where no light sources are present, ambient lighting may be sufficient. although not depicted, an ultraviolet (uv) light source may optionally be included. uv light may be directed towards utensils at any stage of the sorting or separating method to provide a disinfecting/sterilizing feature. b. sorting platform in a preferred embodiment, sorting platform ( 111 ) is made of a material of sufficient thickness and properties to be translucent, such as high density polyethelene (hdpe). hdpe is commonly used in the food service industry for cutting boards and other items that contact food items and can be washed with commonly used cleansing products without degrading the material. with appropriate thickness and lighting, hdpe is translucent and can support the weight of a typical fully loaded dishwashing tray. in the preferred embodiment, the surface of the sorting platform has a matte finish which reduces glare from lighting which might affect the quality of images taken by camera(s) 104 . in a preferred embodiment, sorting platform ( 111 ) serves several purposes. first, sorting platform ( 111 ) provides a support surface for dishwashing tray ( 110 ). second, when lit from below by light source ( 107 ), sorting platform ( 111 ) acts as a diffuser so that light is spread more evenly and glare/reflections from light source ( 107 ) are reduced. when viewed from above by camera(s) ( 104 ), this arrangement enhances the contrast of items placed on the surface of sorting platform ( 111 ). this may facilitate item recognition by software that processes images from camera(s) ( 104 ). third, sorting platform ( 111 ) serves as a protective barrier that prevents and/or minimizes water and other debris from reaching areas of the machine below. for example, in the preferred embodiment, bin ( 113 ) collects roll ups deposited from wrapping area ( 112 ). sorting platform ( 111 ) prevents and/or minimizes water or other debris from reaching bin ( 113 ) or other items below sorting platform ( 111 ). fourth, sorting platform ( 111 ) also may serve as a surface on which to place or engrave optional fiducial markers. finally, sorting platform ( 111 ) may serve as a sorting surface even when no dishwashing tray is utilized. in this mode of operation, items that are to be sorted are simply placed on sorting platform ( 111 ) for sorting. fiducial markers are items placed in the field of view of a camera that are used as points of reference and/or for measuring and are described, e.g., in bergamacso (2011) and garrido-jorado (2014). a fiducial marker is a marker of a known shape, size and/or location such that the marker serves as a reference point from which to determine the camera pose, and/or the relative position of the camera/marker to each other and/or to another item. for example, if a marker of known size and orientation is identified in an image, from that information the camera pose (i.e., the camera's relative position to the marker) can be determined. further, the marker size can be used to determine the relative distance/characteristics of other items in the field of view. thus, in a preferred embodiment, a fiducial marker(s) ( 507 , 508 ) are embedded in the surface of sorting platform ( 111 ) such that they are within the field of view of camera(s) ( 104 ), as shown in fig. 5 . identification of the marker(s) facilitates a determination of the camera(s) pose. further, the marker(s) are placed at a known (or deduced) location(s) relative to the homing point of the cnc pick-up head (described below). with this information, the xy location of a utensil may be determined relative to the marker(s) and the pick-up head directed to that location to retrieve a utensil. finally, sorting platform ( 111 ) may serve as an additional surface on which to place/sort items after they have been removed from dishwashing tray ( 110 ). this functionality may facilitate sorting and selection strategies in some embodiments of the invention. fig. 5 is an exemplary sorting platform of the configuration shown in fig. 2 . in fig. 5 , area 501 is a dishwashing tray support area, area 502 is an additional sorting space area, area 503 includes a port ( 505 ) for a look up camera for item orientation, and area 504 includes the pass through aperture 108 where sorted, oriented items may be passed through for further processing. while at least area 501 is within the field of view of look down camera(s) 104 of fig. 1 , if one or more of areas 502 - 504 are also within the field of view of look down camera(s) 104 of fig. 1 , additional sorting and selection strategies may be enabled. port 505 may comprise either a simple aperture through which a look up camera (e.g., camera 109 ) may look. alternatively, port 505 may be covered by or be comprised of a transparent material (e.g., acrylic glass or plexiglass) that serves as a protector for a look up camera mounted below. during the process of assembling a utensil collection, there may be times when a required utensil is not recognized. for example, if a roll-up requires a knife, fork, and spoon, one or all of the items may not be recognized in the tray. this may occur because a desired item(s) is not in the tray or the item is in the tray but is not recognized. a desired item in the tray may not be recognized because the item is covered/occluded by other items. fig. 2 shows several examples where one item obscures, an item below it. a strategy for addressing such a situation is to remove items from the tray (whether recognized or not) to locate a desired item. the removed items may be placed in area 502 and the process continued until either all the items have been removed from the tray, a desired item is revealed, and/or some other end condition. in addition to area 502 , the areas of 503 and 504 that are not the viewing port 505 or pass through aperture 506 or any other area may also be used for this purpose. if a recognized (but initially unwanted item) is placed in these areas, when the item is desired it may be retrieved from these areas rather than the tray. these same areas may also be places where unrecognized items are placed to remove them from the tray, thereby uncovering items below them (in which case, areas 502 - 504 may not need to be within the field of view of look down camera(s) 104 of fig. 1 ). these processes may be repeated until all the items have been removed from the tray, the desired item revealed, a desired number of roll ups is formed, or some other end condition. figs. 6a and 6b illustrate alternative arrangements with a reduced sorting platform ( fig. 6a ) or no sorting platform at all ( fig. 6b ). in both figures, dishwashing tray 110 is supported by something other than the sorting platform but variants in which the dishwashing tray is supported by the sorting platform also may be used. although fig. 6a shows a reduced sorting platform that provides both some support for look up camera ( 109 ) and a sorting area, in fig. 6b , the sorting platform is eliminated and look up camera 109 requires some other support. in the case of fig. 6b where there is no sorting platform, fiducial makers may be placed on some other surface within the field of view of look down camera(s) 104 of fig. 1 or eliminated entirely. c. cameras 1. look down camera(s) in fig. 1 , camera(s) 104 looks down on sorting platform 111 and anything thereon, including dishwashing tray 110 . thus, depending on the configuration, camera(s) 104 may see some or all of the view of fig. 2 . camera(s) 104 may comprise one or more camera(s) with the number and arrangement thereof affecting both the field of view and the distance camera(s) 104 must be placed from platform 111 to achieve the desired coverage. figs. 3a-4b illustrate the trade-off. fig. 3a shows an exemplary field of view ( 302 ) of a camera ( 301 ). as is common with modern cameras, the field of view may not have a square aspect ratio and the field of view depicted is a theater aspect ratio one (i.e., 16:9). any aspect ratio sufficient to obtain a field of view of the desired area at the desired height may be used. as shown in fig. 3b , camera 301 must be height 304 from the surface of platform 111 to achieve field of view 303 . fig. 4a shows a two camera configuration with cameras 401 and 402 having field of views 403 and 404 respectively. as shown, the two cameras have a somewhat smaller total field of view, than camera 301 . however, as shown in fig. 4b , height 408 that achieves fields of view 407 and 406 is lower than height 304 . as a result the total height of the machine may be reduced. although a “stacked” arrangement of the cameras is shown in fig. 4a , alternative camera configurations may be used including side-by-side arrangements. in the preferred embodiment, camera(s) 104 of fig. 1 are two commercially available, high definition, web cameras in the arrangement shown in fig. 4a . additionally or alternatively, a depth sensor (such as the microsoft kinect) may be used to gather image/depth data of items on the sorting platform. 2. look up camera in addition to the look down camera(s) 104 of fig. 1 , the preferred embodiment includes look up camera 109 . as shown in figs. 1 and 2 , look up camera 109 “looks up” through sorting platform 111 through aperture 207 . in the preferred embodiment, items held by the pick-up head 106 are moved to be above camera 108 which looks up to view the items or portions thereof. figs. 8a and 8b illustrate item orientation. there, pick-up head 106 of fig. 1 is shown, in illustrative/simplified form, as item 803 while aperture 207 is shown as 801 . when an item is held by pick-up head 803 , the item may or may not be in the desired alignment, particularly with respect to pass through aperture 208 of fig. 2 . to check the orientation of an item held by pick-up head 803 , the item is moved over aperture 801 as shown in fig. 8a . there, look up camera 805 looks up at the item and views the orientation of the item. if the item is not in the desired orientation, pick-up head 803 (or a portion thereof) rotates until the item is in the desired orientation. thereafter, pick-up head 803 may move the item over and through pass through aperture 208 of fig. 1 for further processing. in addition to orientation, look up camera 109 may also serve as a means to obtain additional images of the item actually picked up for further object recognition. these images may serve as a way to verify that the item picked up was the desired item, and only the desired item. for example, although a spoon may be desired and was selected, the spoon may have become entangled with a fork such that both items were picked up. camera 109 is a source of images of the item(s) actually picked up for item verification before further processing. by looking up at the item (rather than from above), the view of the item is not obscured by the xyz stage 105 or pick-up head 106 . in alternative embodiments, either in place of or in addition to camera 109 , a camera or cameras may be mounted in other locations (for example, on pick-up head 106 or xyz stage 105 themselves) to obtain item imagery. yet another alternative is to use the camera(s) 104 for such a task. yet another alternative is to not attempt to correct item orientation or to verify the item and eliminate this function and camera 109 . although all the cameras are depicted as direct view cameras, mirrors may also be used to mount the cameras at different locations while still viewing the desired region. thus, for example, camera(s) 104 may be mounted at a location other than directly above and looking down at platform 111 . instead, camera(s) 104 may look at mirrors which redirect the view to observe platform 111 . in addition, rather than looking up or down at the item, camera 109 may be mounted (either on xyz stage 105 or pick-up head 106 or on the structure of the apparatus itself) to view the item retrieved from the side. likewise, camera(s) 104 may be mounted so as to not be perpendicular to platform 111 , but mounted at an angle. mounting in this fashion may facilitate imaging the item held by pick-up head 106 while at the same time viewing platform 111 . permutations and combinations of all of these camera locations may be employed. additionally or alternatively, a depth sensor (such as the microsoft kinect) may be used to gather image/depth data of item held by the pick-up head. d. xyz stage fig. 1 , xyz stage 105 including pick up head 106 is described in greater detail. figs. 11a, 11b, and 11c are three views of the xyz stage from different vantage points. as shown in fig. 11a , the xyz stage includes a gantry 1101 supporting a pick-up head 106 . the gantry itself comprises three components: an x axis (generally 1101 ), a y axis, and a z axis ( 1103 ). the x axis moves along the path of axis 1102 while the z axis moves along the path of axis 1104 . movement along the axis is provided by motors or other motive sources that drive the relevant components along each axis. wheels are shown for illustration purposes only and the actual motion may be provided by wheels, lead screws, linear motors, rack and pinion, pneumatics, linear rail or belt drives. fig. 11b is an overhead view showing the xy axes of movement ( 1105 and 1102 respectively). fig. 11c is a view showing the yz axes of movement ( 1105 and 1104 respectively). while the figures depict the x axis as the major axis, the major axis may be any axis. fig. 7 depicts an alternate arrangement where xyz stage 105 hangs from panel 103 . this arrangement eliminates mechanical interference between xyz stage 105 and elements below the surface of sorting platform 107 . for example, wrapping area 112 may include structure that rises above or meets the surface of sorting platform 107 . that structure may interfere with the movement of xyz stage 105 if it rides on or is supported by panel 107 . thus, the alternative arrangement eliminates this potential interference. another advantage of having xyz stage 105 hang from above is that the mechanical components of xyz stage 105 are placed in a location where they are less likely to be damaged by having items fall onto them. in this arrangement, dishwashing trays are not loaded over an operating axis and its mechanical components. that is, the dishwashing trays will not need to pass over a rolling surface for the axis. this arrangement eliminates one avenue for potential malfunction from items interfering with the operation of the xyz stage. e. pick-up head fig. 10 shows a more detailed view of pick-up head ( 106 ) as attached to xyz stage ( 105 ) of fig. 1 . more specifically, the pick-up head may include a suction cup ( 1001 ) through which a vacuum is applied to pick up an item. as shown in fig. 10 , the suction cup is a round, bellows type suction cup but other types of suction cups (e.g., oval, non-bellows) may be used. a bellows type cup reduces the accuracy needed in z axis placement to retrieve an item. when retrieving an item, the precise z height at which the item is located may not be clear, may be unknown, or may change. for example, in one mode of operation, the x and y axes locations of the item to be retrieved are determined, while the z axis remains unknown or known only in a general sense (e.g., between the bottom and top of a tray). the pick-up head may be moved to the correct x and y locations. from some starting height, the pick-up head may be progressively lowered on the z axis with the vacuum on while monitoring the vacuum pressure. when the vacuum pressure changes to indicate that an item has been retrieved, the downward z axis movement is stopped. in such an operation, the bellows type cup provides a margin of variability that can assist in dealing with the height differences encountered. in addition, when contact is made, the item to be retrieved may move (e.g., be pushed down into the tray) and a bellows type cup facilitates addressing height changes. finally, the item to be retrieved may itself have height variances (e.g., the cup end of a spoon or the tine end of a fork) and a bellows type cup facilitates handling this variability. where even greater z axis variability is desired, a level compensator (e.g., the piab lc10-f0510) (not shown) as part of the z axis structure may also be provided. although a single suction cup may be used, alternative arrangements using multiple suction cups may also be employed. multiple suction cups may facilitate item pick up because all of the vacuum force need not be applied at a single point. two or more suction cups spread the item weight among the cups, reducing the force each cup needs to apply to retain an item. in a preferred embodiment, the capability of weighing the retrieved item is also provided. an exemplary weighing component is shown as item 1002 . such weighing may be either individual (i.e., weighing only the retrieved item) or indirect (i.e., weighing the retrieved item as attached to something else). the weighing capability may be provided through the use of strain gauges, load cells, or force sensitive resisters, e.g. alternatively, the weight may be deduced by closely monitoring the vacuum pressure needed to lift and/or retain the retrieved item. in addition, to accommodate item orientation correction, in a preferred embodiment, the capability of rotating the retrieved item held by suction cup 1001 is also provided. an exemplary motor to provide rotation is shown as item 1003 . in operation, motor 1003 rotates at least suction cup 1001 (to which a retrieved item is attached by suction) about the axis 1004 to rotate the retrieved item. not shown in fig. 10 is an optional background plate/mask. the view from a lookup camera (such as camera 109 of fig. 1 ) will include the item(s) retrieved but will also include views of portions of the pick-up head as well as possibly the xyz stage and other portions of the structure. thus, a background plate/mask may be mounted to the xyz stage (preferably just above the suction cup 1001 ) to obscure the view of the gantry itself and/or portions of the structure that are within the field of view of look up camera 109 . including a background plate/mask may provide a clearer image of the retrieved item that minimizes images of items not of interest. in the preferred embodiment the background plate/mask is circular in shape and made of hdpe, though other shapes and materials may also be used to accomplish the same purpose. f. pneumatic air supply/pump not shown in the figures is a pneumatic air supply and pump that generates the vacuum used by the pick-up head to retrieve an item. in the preferred embodiment, a pneumatic pump operates to store compressed air in a tank. that compressed air is fed to a venturi vacuum pump generator (e.g., a piab picompact pump). the vacuum generated is then fed by a line to suction cup 1001 . in the preferred embodiment, the tank storing compressed air is optionally equipped with a pressure sensor that is connected to or communicates with the control computer (or other controller). this allows the control computer to monitor the pressure in the tank to determine if it is at the desired level to generate the vacuum. alternatively, compressed air may be provided by any air source such as “shop air”, where available. alternatively, a vacuum pump not reliant on compressed air may be provided. the vacuum pump is also connected to or communicates with the control computer (or other controller) which controls when the vacuum turns on and off and may have additional sensors and features. for example, the piab product includes a vacuum sensor to measure the vacuum pressure generated and also includes a blow-off feature to blow off any attached item when the vacuum is turned off. in addition, the plab product includes a vacuum “hold” feature where a valve is activated once a vacuum is applied to hold the vacuum while turning off the air supply. this minimizes the amount of air required to maintain a vacuum and the strain put on the air pump. in operation, the control computer (or other controller) monitors the vacuum pressure for changes. a substantial increase in vacuum pressure indicates that something is attached to the pick-up head. g. wrapper shown as item 112 of fig. 1 is the area where wrapping of utensil assemblies in napkins occurs. assemblies of utensils are presented and wrapped in a napkin to form a roll-up. the roll-up may be further secured through a band (with or without adhesive) to prevent the roll-up from coming apart. mechanisms that will roll utensil assemblies in napkins are well known in the art and are described, e.g., in u.s. pat. no. 6,615,566 (heisey); u.s. pat. no. 6,837,028 (miano); u.s. pat. no. 6,918,226 (hellman); u.s. pat. no. 7,076,932 (rubin); and u.s. pat. no. 7,322,172 (hoffman). once rolled, the roll-up is deposited in a bin ( 113 ) or other container for later retrieval. fig. 1 shows collection bin 113 within apparatus 101 . alternatively, bin 113 may be located outside the envelope of apparatus 101 with a chute or other mechanism directing the roll-up into the bin. alternatively, bin 113 may be located within the envelope of apparatus 101 but not behind a door (described below) to allow roll-up retrieval without suspending or stopping the roll up process. in an alternative embodiment, the wrapping function does not exist such that only the sorting and orienting or sorting capabilities are utilized. h. control components fig. 9 shows the general relationship of the control components not shown in the other figures. as shown there, a control computer 901 communicates with and controls the various features of the apparatus. the control computer executes software that performs the various tasks as described above and below. the control computer 901 may be a separate device (for example, an intel i7 processor running the windows operating system and the control application) or it may be included as part of another controller (e.g., cnc controller 902 ). likewise, other controllers (e.g., the cnc controller) may be incorporated in the control computer. in addition, control computer 901 may include or be connected to a graphics processing unit (gpu) such as those marketed by nvidia, inc. a gpu speeds graphics operations and can also be used for more general purpose computing tasks, particularly those susceptible to massively parallel operations. when programmed to perform general purpose computing tasks, non-graphics operations such as image processing may be sped up. general purpose programming frameworks for gpus include opengl and cuda. as shown, the control computer 901 is connected to the look down camera(s) 904 , look up camera(s) 905 , cnc controller 902 , pneumatic pump and controller 903 and optional weight sensor 906 . images from the look down camera(s) are fed to the control computer which processes the images and performs object recognition. when an item is recognized (or some other action is determined), the control computer directs the cnc controller to move the xyz stage (with pick-up head) to the appropriate location. in one embodiment, the cnc controller is the tinyg open source cnc controller manufactured by synthetos. that device contains motor drivers and interfaces and its own processor and can accept gcode commands and direct the attached motors to move the xyz stage to the indicated location. in this embodiment, the control computer issues gcode commands to the tinyg, which then operates the motors to move the xyz stage to the desired location. when the xyz stage is at the specified x and y axis locations (either as part of coordinated multi-axis move or as a separate step), the pick-up head is moved downward on the z axis. the control computer directs the pneumatic pump and controller to turn the vacuum on, and with the pick-up head moving down on the z axis, the control computer monitors the sensed vacuum pressure for a change indicating that something has become attached to the pick-up head. alternatively, the pick-up head may reach the maximum allowed z axis travel. when the control computer determines that something is attached or the maximum z axis travel is reached, the control computer directs the cnc controller to begin upward movement of the pick-up head along the z axis. if an acceptable vacuum has been achieved and a vacuum maintaining switch is available, the control computer directs the pneumatic pump and controller to activate the switch to maintain the vacuum and the vacuum pump/air flow is turned off. in addition, a “blow off” capability may be provided. when an item is attached to the pick-up head and it is determined to release the item, in addition to simply releasing the vacuum switch (and thereby releasing the vacuum), the item may be blown off by providing positive air pressure to blow the item off the pick-up head. when the optional weight sensor is included, the control computer determines the weight to compare the weight of the retrieved item to the item/image library. thereafter, the control computer directs xyz stage to move to an area above the look up camera 109 . while above the look up camera 109 , the control computer retrieves images from the look up camera and determines the item orientation (and also optionally performs additional object recognition). thereafter, the control computer directs the cnc controller to rotate the pick-up head to align the retrieved item in the desired orientation. alternatively, if the retrieved item is not recognized, then the retrieved item may be deposited either back in the dishwashing tray or some other location. once aligned, the control computer may direct the cnc controller to move the pick-up head to the area above the pass through aperture and then turn off the vacuum/release the vacuum switch to release the item or both lower the pick-up head to some z axis location and release the item. x, y and/or z axis limit switches may also be included. these switches indicate that the xyz stage has reached a limit of travel on an axis and the cnc controller/control computer stops motor movement along the axis tripping the switch. in addition, control computer 901 may also be provided with a connection (either wired or wireless) to the internet or another network or computer. this connection may be used to remotely monitor the various parameters of the apparatus. such parameters may include the number of roll-ups performed, number of sorting operations, consumables status (e.g., empty, full, or state), general status (e.g., ready, in operation, error state), elapsed time of operation, motor and controller status and other parameters. this information may be used to remotely diagnose the apparatus for maintenance. in addition, this information may also be used to facilitate per roll-up charging for use of the machine. with remote monitoring, an operator can charge for each use of the machine without needing to physically visit each device to gather information on uses. in addition, a wired or wireless connection may be used to provide an update capability to update the control application with bug fixes or new or different features. in addition, the data files associated with the application may also be updated. for example, new data files associated with the item/image library may be provided to allow recognition of different items without requiring the operator to create those images. i. exterior/external view fig. 12 shows an external view of the apparatus. as shown, the apparatus 1201 includes three doors or panels ( 1202 , 1203 , and 1204 ) that open to provide access to portions of the internal workings. door 1203 corresponds to the area where completed roll-ups may be stored in a bin and/or where consumables (napkins and/or adhesive tabs/tape/strips) may be stored or loaded. door 1202 corresponds to the portion of the sorting platform where the dishwashing tray may be present and may also include a smaller door/slot 1205 through which dishwashing trays may be loaded or unloaded. thus, in typical operation, a user would need to only access door/slot 1205 and would not need to open the larger door 1202 . door 1204 corresponds to the portions of the apparatus containing the wrapping area and portions of the sorting platform. thus, in operation, the user would typically not need to open door 1204 . as a safety feature, some or all of the doors or slots may be provided with switches/interlocks indicating whether the door/slot is opened or closed. the control computer may monitor these switches to prevent machine operations when a door or slot is open. in addition, all or portions of each of the doors may be transparent to allow a user to view inside the apparatus to review the number of roll-ups in the bin or utensils remaining to be sorted. transparent doors of this type may be made from acrylic or plexiglass, e.g., and allow the user to determine the status without opening a door and interrupting machine operation. as shown, the apparatus optionally includes other features, including a display ( 1206 ), status light(s) ( 1207 ), start button ( 1208 ) and emergency stop ( 1209 ). display 1206 may be a touchscreen and be used to display information to the user and accept user input. for example, display 1206 may show the number of roll-ups in the bin, any status information and may be interactive. when used interactively, display 1206 may allow the user to select different roll-up configurations (e.g., fork/knife/spoon or fork/knife, etc.) or to configure the apparatus initially by inputting reference images and weights in response to application prompts. when a touchscreen is not used, a keyboard connection (either wired or wireless) may be provided. status light(s) 1207 are optionally included to allow an indication of the apparatus state from longer distances. the status light(s) may use colors to indicate condition. for example, red may indicate that attention is needed (e.g., no utensils, not the desired combination of utensils, bin full), yellow that supplies are needed (e.g., napkins, adhesive strips, or utensils running low), while green may indicate that the apparatus is ready or running as expected. in addition to or in the alternative to color, flashing light(s) may be used to convey information. status light(s) 1207 enable a user to quickly determine the apparatus condition from across a room, e.g., without having to come closer and examine information displayed on display 1206 . optional start button 1208 provides a quick way of starting the apparatus without interacting with display 1206 . thus, a user could load a dishwashing tray through slot 1205 and then simply press start button 1208 to start processing. emergency stop (also known as an “e-stop”) 1209 provides a large button that can be pressed in an emergency situation to stop all machine movement. in a preferred embodiment, the structure of apparatus 1201 is constructed of stainless steel or aluminum. in addition, in a preferred embodiment, the interior of the structure is provided with a matte finish in order to minimize glare/reflections caused by the light panels. j. software aspects and process description the control computer executes instructions comprising a control application which processes received data and controls the various aspects of the apparatus. in the preferred embodiment, the video related operations (described above and below) are implemented using the opencv open source computer vision library of routines. opencv is well known to those of skill in the art and is one of the most widely used computer vision libraries. while the preferred embodiment utilizes opencv routines, any algorithms offering substantially the same overall functionality as the mentioned routines may be employed. 1. system calibration several aspects of the apparatus benefit from calibration to function optimally. a) cameras due to imperfections in the lenses and the “fish-eye effect” resulting from the use of lenses, the image seen by cameras is distorted. calibration of cameras (or more specifically the images from the cameras) minimizes or eliminates the distortions caused by these defects. calibration is accomplished by imaging a target with known features, identifying distortions in the image (by comparing the known features to what is actually imaged), and generating a map/matrix/function that reflects the transformation to be applied either to each pixel imaged or the image more generally to transform the perceived image into an image in which the distortions are minimized or corrected. this transformation map/matrix/function may thereafter be applied to each scene imaged by the camera to minimize or correct the distortions. because the distortions may be unique to each camera (i.e., each camera may have different defects in the lenses, etc.), calibration may be performed on each camera independently. in the preferred embodiment, only the look down camera(s) are calibrated. while the look up camera also suffers from distortions, because only the general orientation of the item is needed, an uncalibrated image is sufficient for that purpose. alternatively, the look up camera may also be calibrated and that may be desirable if the look up camera is used for a purpose other than/in addition to utensil orientation. for example, if the look up camera is used for object recognition purposes to identify the picked up item, then an undistorted image may be preferable. in addition to calibration, color balancing may also be performed to result in a color corrected image. color balancing may aid in object recognition by enhancing edge or keypoint detection or when color is an object descriminator. b) cnc platform/fiducial markers the cnc platform itself needs to be calibrated in two ways. first, the “home” (i.e., the xyz zero location) must be determined. this may be performed by using limit switches which activate when one or more stages move into contact with them, which position is designated the minimum position. once at the minimum position, that position is designated the “zero” location from which future movements may be measured relative to. while typically, assigned a value of zero, any arbitrary value may be assigned or recorded as the zero location. alternatively, one or more limit switches may be eliminated and any arbitrary position designated the zero position or “home” of the machine. the actual pick-up head may be offset (in either the x or y axes or both axes) from the home position of the machine and the offset amount may be measured or determined and this value stored. thereafter, the offset amount may be combined with the machine home position to allow the control computer to move the pick-up head to any designated location. where fiducial markers are used, the position of the markers relative to the home position should also be determined. this can be accomplished by simply measuring the position in an initial machine setup operation that is not repeated each time the machine is used. for example, by first moving the machine to the home location and then moving the pick-up head in such a situation, the relative position is stored for use when the machine is next turned on. alternatively, the fiducial position may be designated arbitrarily by the user. in addition, the fiducial marker position in the retrieved images from each camera should also be determined. with these data points (machine home (including pick-up head offset), fiducial marker position relative to home, fiducial position in image, the absolute location of a recognized item may be determined by knowing its location relative to the fiducial position in the image. this information may be used to determine which xyz location to move the pick-up head to for an operation. c) pneumatic/vacuum pump while not technically part of a calibration process, as part of the machine startup process, the pneumatic pump may be activated to fill a tank to a preset pressure. when the tank is at the desired pressure, the apparatus is ready to generate a vacuum using the vacuum pump at the direction of the control computer. 2. image processing and item retrieval a) image pipeline images retrieved from the cameras are processed in a pipeline (shown in fig. 13 ) that provides prepared images on which object recognition is performed. while the processing of images from a single camera is next described, the same process may be applied to images retrieved from multiple cameras. while the steps in the pipeline are described herein in an order, other orderings of the image pipeline steps may be used and/or steps eliminated or added depending on the desired application. typically, focus and brightness control are performed by the camera itself such that the provided image is already focused and brightness controlled. however, if these operations have not already been performed, and are available, then focus a brightness control filter are applied. the calibration transformation matrix/map/function is applied to minimize or correct the distortions. either before or after, the image may also be color balanced to even out the color differences in the image. in the preferred embodiment, if there is more than one camera 104 , the images provided by each camera are processed independent of the processing of another camera 104 . thus, each camera 104 sees a somewhat different image and object recognition is performed on each image independent of the image retrieved by another camera. this approach minimizes the processing required to evaluate an image which may result in faster image processing, i.e., more frames per second. one disadvantage of this approach is that the overall control program must be more complex because it must evaluate two images independently and then choose which image on which to take appropriate action. in an alternative embodiment, images from multiple cameras 104 are stitched together to form a single image on which object recognition is performed. this approach has the advantage that the overall control program may be simplified because there is only one resulting image on which to take appropriate action. disadvantages of this approach include increased processing required to stitch the images together and distortions and incongruities resulting from the image stitching itself. b) image/item library the process of object recognition compares characteristics of an input image to characteristics that describe or relate to the item to be recognized. in the present invention, this is accomplished through the use of a reference image/item library that contains images of the items to be recognized and/or the characteristics of the items to be recognized. for example, if a fork is to be recognized, an image of a fork is stored in the library and/or characteristics of the fork are stored. such characteristics may include keypoints, contours, perimeter, area, moment of area or any other basis on which discrimination is to be accomplished. the same characteristics are then computed for the input images and compared to the values stored in the image/item library to determine if there is a match and the item is recognized. thus, data corresponding to a fork, knife and spoon, e.g., may be stored in the image/item library and then compared to images retrieved from the camera(s) 104 or 109 to determine if there is a match. in some instances, a margin of error may be applied so that only approximate matching is required to determine if a match exists. in addition, more than one image of each item desired to be recognized may be stored. for example, multiple images of forks may be stored showing the fork in either the same or different orientations (e.g., tines up, tines down, tines on top, tines on bottom, on its side to the right, on its side to the left, etc.). the differing images allow for multiple modes of gathering characteristics which may improve object recognition. even where the item is in the same orientation, multiple images may have value because lighting and sensor variations mean that an image taken from the same location of an item in the same pose may have differences that result in characteristic differences. when processing, images from the camera(s) 104 and/or 109 may be compared to all of the images/items in the library or merely a subset. for example, if a fork is desired, the images from the camera(s) may be compared to only the images/items in the library that correspond to a fork. reviewing only a subset may speed processing and therefore result in faster system operation. where the optional weighing is employed, the image/item library also contains one or more weights corresponding to the item stored in the library. these weights may be either be entered directly through an input screen/keyboard or sample weights obtained through the pick-up head may be taken. when processing, after an item is retrieved, the weight of the item is compared to weights stored in the image/item library to determine if there is a match and/or to confirm that the expected item was in fact retrieved. again, a margin of error may be applied to the weights to allow for variations between individual items and allow approximate matching. c) image processing algorithms and object recognition in the preferred embodiment, many of the image processing functions are implemented using routines available in opencv. utilized functions include: findchessboardcorners (for camera calibration), canny (edge detection); findcontours (locate contours in image); and remap (to correct image with calibration values). in addition, object recognition may be performed using various keypoint detectors and feature extractors (e.g., sift, surf, fast, brief, orb) to detect keypoints in images and extract the features thereof for use in matching to similar features calculated for reference images stored in the item/image library. in addition, shape matching and other approaches to object recognition may be used. in operation, items may be retrieved in any specified order and/or combination and/or no order by repeating the above described recognition and placement processes. thus, for example, if a fork, knife, spoon combination in that order is specified, then, first a fork is sought by comparing the processed image from the camera(s)/weight to the fork characteristics stored in the library. once a fork is recognized, retrieved and oriented and deposited in the wrapping area, then a spoon, and then a knife are processed in the same fashion. in addition, any combination of desired items may be specified (e.g., fork/knife, fork/knife/spoon/soup spoon, salad fork/fork/knife, etc.). k. pick up strategies once an item is selected to be picked up, the place on the item from which to retrieve it may be selected according to different strategies. in one strategy, once an item is recognized, the contours of the item are identified and the portion with the largest area (i.e., the moment of area) is selected as the location on which to place the suction cup. alternatively, the center of gravity may be estimated or determined and that point selected as the location on which to place the suction cup. yet a third strategy may be to simply select half way along the length of the item as the pick up point. in addition, the strategies may be combined, alternated, or used in a cascade fashion. l. sorting strategies when processing items, different sorting strategies may be employed. in creating a collection of utensils, a particular order of utensils may be utilized (e.g., first a knife, then a fork, then a spoon). alternatively, one or more items may have already been retrieved and a particular utensil or utensils are needed to complete a set. in either case, the selection of a particular item may be desired but the item may not be recognized. in that case, a sorting strategy may be employed. one strategy is to select a recognized (but not desired item) in the dishwashing tray, retrieve the item, and then move the retrieved item to an open area on the sorting platform. this process may be repeated until either no more items (whether desired or not) are recognized within the dishwashing tray or until a desired item is retrieved. in an alternate strategy, the retrieved item may be placed in an open area of the dishwashing tray itself. yet another aspect of a sorting strategy may be to segregate retrieved but undesired items by type in different storage areas. for example, forks may be stored in one area, knives, in another, etc. if sorting areas are utilized and items stored therein, when an item is needed, it may be retrieved from the storage area rather than the dishwashing tray. the availability of identified items in a storage area may speed making assemblies because the items in the storage area have already been recognized and are known to not be entangled with another item. thus, selection and retrieval of an item from the storage area may be faster than an item from the dishwashing tray. in one embodiment, the control application records where each item is placed for later retrieval. in another embodiment, the item is recognized for retrieval simply because it is within the field of view of the look down camera(s). one aspect of these strategies may be to utilize the look up camera and the orientation capability to maximize the space that may be used to store undesired items. for example, by orienting an the long axis of a utensil or item at forty-five degrees, more items may be stored in an area without overlapping than might be stored otherwise. in addition, if a retrieved item is not recognized (e.g., the weight does not correspond to a programmed weight), then the unrecognized item may be stored either in a designated area of the sorting platform or a designated area of the dishwashing tray or some other location. as discussed, it is possible that an item may become entangled with another item such that picking one of them up also picks up the other item. where weighing or item verification capabilities are provided, this condition may be detected (and/or simple detection of an unrecognized item) and an appropriate response made. one response is to segregate the item in area of the dishwashing tray, sorting platform or other location designated for this purpose. items placed in this area may be separated or addressed by personnel servicing the equipment. by removing the item from the area of active sorting, the item will not occlude items below. alternatively, another response is to release the item and let it fall form some height. the resulting impact of the item may act to separate any entangled items so that processing of those items may continue. m. determining the end condition the apparatus will have a means of knowing when it has completed its task. when a task is completed, the apparatus may optionally signal the user to replace the dishwashing tray or for other service or attention by lighting the status lights 1207 . the end condition may be determined to have occurred when, 1) no more items are recognized to be sorted (either in the dishwashing tray 110 or otherwise on the sorting platform); 2) no more desired items are recognized and no further sorting of undesired items can be accomplished or is desired; 3) no more consumables (e.g., napkins and/or adhesive bands); 4) the roll up bin is full; or 5) some error condition. although various aspects and embodiment have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. it is particularly emphasized that while the above description is primarily in the context of utensil sorting and wrapping, the concepts disclosed herein are suitable for and applicable to any operation where item sorting is desired, including those where item orientation and/or wrapping is not desired). thus, for example, the disclosure herein would be applicable to any singulate, sort, pick and place operation. the various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.
069-426-552-990-623	JP	[ "JP", "EP", "TW", "US", "CN", "WO" ]	C12P19/02,C12N1/21,C12N15/09,C12P19/12,C07C35/16,C12N9/04,C12N9/16,C12N9/90,C12P7/02,C12P19/46,C07H15/207,C12P7/18,C12N15/70,C12R1/19	2012-02-02T00:00:00	2012	[ "C12", "C07" ]	method for producing scyllo-inositol	the disclosure provides a method of producing a scyllo-inositol or a new scyllo-inositol derivative in a one-step process, from ubiquitous and inexpensive raw materials. also provided is a scyllo-inositol derivative bonded to saccharides such as glucose and similar.	a method for producing scyllo-inositol and a scyllo-inositol derivative comprising the following steps: 1) a step for preparing a transformed microorganism possessing an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene; and 2) a step for bringing the microorganism into contact with glucose or disaccharides or polysaccharides having glucose units under conditions suited to the growth and/or maintenance of the microorganism. the production method according to claim 1 wherein the scyllo-inositol derivative is a compound shown by the following structural formula: the production method according to claim 1 or 2 wherein the transformed microorganism has a gene recombination or mutation to induce functional inositol monophosphatase overproduction or inositol monophosphatase activation. the production method according to any of claims 1 to 3 wherein the transformed microorganism is derived from a microorganism that does not have an ability to assimilate myo-inositol. the production method according to any of claims 1 to 4 wherein the transformed microorganism is derived from a bacterium selected from the group consisting of escherichia coli, bacteria belonging to the genus bacillus, bacteria belonging to the genus corynebacterium, and bacteria belonging to the genus zymomonas. the production method according to any of claims 3 to 5 wherein the inositol monophosphatase overproduction is induced by, in the transformed microorganism: a) introducing an exogenous inositol monophosphatase gene, b) increasing the number of copies of an endogenous inositol monophosphatase gene, c) introducing a mutation into a regulatory region of the endogenous inositol monophosphatase gene, d) replacing the regulatory region of the endogenous inositol monophosphatase gene with a high expression-inducing exogenous regulatory region, or e) deleting the regulatory region of the endogenous inositol monophosphatase gene. the production method according to claim 6 wherein the inositol monophosphatase overproduction is induced by introducing the exogenous inositol monophosphatase gene into the transformed microorganism. the production method according to any of claims 3 to 5 wherein the inositol monophosphatase activation is induced by, in the transformed microorganism: f) introducing a mutation into an endogenous inositol monophosphatase gene, g) replacing all or part of the endogenous inositol monophosphatase gene, h) deleting part of the endogenous inositol monophosphatase gene, i) reducing other proteins that lower inositol monophosphatase activity, or j) reducing production of compounds that lower inositol monophosphatase activity. a transformed microorganism capable of fermentatively producing scyllo-inositol from glucose and possessing an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene. the transformed microorganism according to claim 9, further possessing a gene recombination or mutation to induce functional inositol monophosphatase overproduction or inositol monophosphatase activation. the transformed microorganism according to claims 9 or 10, being derived from a microorganism that does not have an ability to assimilate myo-inositol. the transformed microorganism according to any of claims 9 to 11, being derived from a bacterium selected from the group consisting of escherichia coli, bacteria belonging to the genus bacillus, bacteria belonging to the genus corynebacterium, and bacteria belonging to the genus zymomonas. the transformed microorganism according to any of claims 10 to 12 wherein the inositol monophosphatase overproduction is induced by, in the transformed microorganism: a) introducing an exogenous inositol monophosphatase gene, b) increasing the number of copies of an endogenous inositol monophosphatase gene, c) introducing a mutation into a regulatory region of the endogenous inositol monophosphatase gene, d) replacing the regulatory region of the endogenous inositol monophosphatase gene with a high expression-inducing exogenous regulatory region, or e) deleting the regulatory region of the endogenous inositol monophosphatase gene. the transformed microorganism according to claim 13 wherein the inositol monophosphatase overproduction is induced by introducing the exogenous inositol monophosphatase gene into the transformed microorganism. the transformed microorganism according to any of claims 10 to 12 wherein the inositol monophosphatase activation is induced by, in the transformed microorganism: f) introducing a mutation into an endogenous inositol monophosphatase gene, g) replacing all or part of the endogenous inositol monophosphatase gene, h) deleting part of the endogenous inositol monophosphatase gene, i) reducing other proteins that lower inositol monophosphatase activity, or j) reducing production of compounds that lower inositol monophosphatase activity.	technical field the present invention relates to the application of gene recombination technology in the production of scyllo-inositol. in particular, it relates to transformants capable of producing scyllo-inositol from ubiquitous raw materials such as glucose and the like by a one-step process and to a method for the industrial production of scyllo-inositol that utilizes these transformants. the invention also relates to a scyllo-inositol derivative that can be produced by the transformants, a method for its production, and a method for producing scyllo-inositol from the derivative. background art scyllo-inositol (cis-1,3,5-trans-2,4,6-cyclohexanehexol) is an optically inactive isomer of inositol and is a compound that was found long ago in plants and animals. recently, however, various bioactivities of scyllo-inositol have drawn attention. for example, non-patent reference 1 reports that scyllo-inositol has an inhibitory effect on amyloid β protein aggregation. this effect suggests the potential usefulness of scyllo-inositol in the treatment of alzheimer's disease. patent reference 1 claims a blood sugar-lowering agent containing scyllo-inositol as an active ingredient. therefore, there clearly exists a need to industrially produce scyllo-inositol. classic production methods were extraction of scyllo-inositol from plants or chemical synthesis of this compound using myo-inositol as a raw material (non-patent references 2 and 3, patent reference 2, and the like). in recent years, however, more efficient methods of producing scyllo-inositol using natural microorganisms or enzymes from microorganism have been studied. patent reference 3 discloses a method for producing inositol stereoisomers in culture broth by culturing microorganisms belonging to the genus agrobacterium in medium containing myo-inositol or producing inositol stereoisomers by causing cells or treated cells of microorganisms belonging to the genus agrobacterium to act on myo-inositol. these isomerizations are said to convert myo-inositol into a mixture of scyllo-inositol, chiro-inositol (as a mixture of d- and l-forms), and neo-inositol. patent reference 4 states that myo-inositol is converted into scyllo-inosose by causing pseudomonas sp. ab10064 (ferm p-18330) or acetobacter sp. ab10253 (ferm p-18868) to act on myo-inositol. synthesis of scyllo-inositol by reducing the scyllo-inosose produced in this way by sodium borohydride was also attempted, but this reduction treatment basically produced scyllo-inositol only as a mixture with myo-inositol (that is, a retrograde reaction to the raw material). therefore, it was necessary to increase the content of scyllo-inositol gradually while repeating conversion of myo-inositol into scyllo-inositol by microorganisms and reduction treatment by sodium borohydride in the method for producing scyllo-inositol described in patent reference 4. patent reference 5 discloses a method for producing scyllo-inositol using myo-inositol as a raw material, in which myo-inositol is enzymatically converted into scyllo-inositol in a solution obtained by mixing myo-inositol 2-dehydrogenase (ec 1.1.1.18) which produces scyllo-inosose from myo-inositol, scyllo-inositol dehydrogenase which stereoselectively reduces scyllo-inosose to scyllo-inositol, and nad + or nadp + . the conversion of myo-inositol into scyllo-inositol is said to be 31% on a yield base in this reference. therefore, all of the above references relate to methods for producing scyllo-inositol using myo-inositol as a raw material; none teach the de novo biosynthesis of scyllo-inositol, that is, direct production of scyllo-inositol from ubiquitous raw materials such as glucose and the like by a one-step process. in particular, myo-inositol itself is in the first place an extremely useful and valuable bioactive substance. specifically, myo-inositol is widely utilized as a component of nutritional foods, feeds, pharmaceuticals, and the like since it is an essential substance for many higher animals. for example, myo-inositol is known to play an important role in the metabolism of fats and cholesterols and is held to be effective in the prevention and treatment of hypercholesterolemia and the like. therefore, many improvements are in fact being proposed for industrial-scale myo-inositol production processes. for example, patent reference 6 discloses the discovery and utilization of yeast of the genus candida capable of secreting inositol extracellularly. patent references 7 and 8 disclose the introduction of mutations to impart resistance to glucose antimetabolites and antibiotics, respectively, to the above yeast of the genus candida. patent references 9, 10, and 11 also disclose improvement of the yield of inositol by introducing mutations to impart resistance to tertiary amines, hexachlorocyclohexane, and cetyl trimethylammonium salt, respectively, to yeasts of the genus candida having the ability to produce inositol. patent reference 12 discloses the introduction of a mutation to impart resistance to 6-halogeno-6-deoxyglucose to a yeast of the genus candida having the ability to produce inositol. patent reference 13 also discloses the introduction of a mutation to impart resistance to halogenated pyruvic acid to a yeast of the genus candida having the ability to produce inositol. in addition, patent reference 14 discloses that it is possible to impart the ability to produce inositol to a yeast of the genus candida that does not have the ability to secrete inositol by transforming the yeast by inositol-1-phosphoric acid synthase-encoding dna alone, based on the reasonable inference that inositol-1-phosphoric acid synthase is responsible for a rate-limiting reaction in the series of myo-inositol biosynthetic reactions. patent reference 15 discloses that the inositol productivity of the yeast is improved by introducing inositol-1-phosphoric acid synthase-encoding dna alone into yeast under the control of a glycerol-3-phosphate dehydrogenase gene promoter. all of the above tells us that establishing an efficient, economical production method for myo-inositol itself still remains a significant technical problem even today. therefore, the scyllo-inositol production processes of the prior art that must use valuable, expensive myo-inositol as a raw material are obviously inefficient and uneconomical. moreover, none of the above references dislose or even suggest a scyllo-inositol derivative, especially scyllo-inositol derivatized from sugars. wo 00/56911 describes a bioengineered synthesis scheme for the production of 1,2,3,4-tetrahydroxybenzene from a carbon source. wo 2011/063304 relates to a method for producing fatty acid methyl esters. ep 1674578 describes a method of producing scyllo-inositol from myo-inositol by means of microbial conversion. yamaoka et al (microb. cell fact., 2011, 10(69):1-6 ) describes the manipulation of inositol metabolism in b. subtilis to permit the possible bioconversion from myo-inositol to scyllo-inositol kamano et al (chem. pharm. bull., 1971, 19(6):1113-1117 ) report the isolation of 1-o-β-d-glucopyranosyl-scylloinositol (ia) and 1-o-β-d-glucopyranosyl-proto-quercitol (ila) from an aqueous extract of the leaves and branches of quercus stenophylla. prior art references patent references patent reference 1: jp kokai 2003-160478 patent reference 2: west german patent no. 3,405,663 patent reference 3: jp kokai 9-140388 patent reference 4: jp kokai 2003-102492 patent reference 5: jp kokai 2010-187688 patent reference 6: jp kokai 8-00258 patent reference 7: jp kokai 8-38188 patent reference 8: jp kokai 8-89262 patent reference 9: jp kokai 9-117295 patent reference 10: jp kokai 10-42860 patent reference 11: jp kokai 10-42882 patent reference 12: jp kokai 10-42883 patent reference 13: jp kokai 2000-41689 patent reference 14: jp kokai 9-220093 patent reference 15: jp kokai 10-271995 non-patent references non-patent reference 1: the journal of biological chemistry, vol. 275, no. 24, pp. 18495-18502 (2000 ) non-patent reference 2: yakugaku zasshi, vol. 89, pp. 1302-1305 (1969 ) non-patent reference 3: liebigs ann. chem., pp. 866-868 (1985 ) summary of the invention problems to be solved by the invention therefore, the first object of the present invention relates to an industrial production method capable of producing scyllo-inositol by a one-step process from inexpensive, ubiquitous raw materials such as glucose and the like. the present inventors also discovered the sugar-coupled scyllo-inositol derivative for the first time during the course of this research. this scyllo-inositol derivative demonstrated remarkably superior water solubility even in comparison to the inherent water-solubility of scyllo-inositol. the finding of the present invention was surprising given that cellobiose (d-glucopyranosyl-(β1→4)-d-glucose) presents lower solubility than glucose. therefore, the second object described herein is a novel scyllo-inositol derivative. means used to solve the above-mentioned problems as was mentioned above, all of the recent research has concerned only the methods of enzymatic conversion of scyllo-inositol using myo-inositol as a raw material. none of the prior art references succeeded in constructing a functional de novo scyllo-inositol biosynthetic system inside a host microbial cell, that is, in establishing a method for the direct fermentative production of scyllo-inositol from ubiquitous raw materials such as glucose and the like by a one-step process. however, the present inventors discovered that transformants expressing an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene are capable of fermentatively producing scyllo-inositol from glucose directly in one step. the present inventors also discovered a novel scyllo-inositol derivative in cultures of such transformants. therefore, the first aspect of the present invention is: (1) a method for producing scyllo-inositol and a scyllo-inositol derivative including the following steps: 1) a step for preparing a transformed microorganism possessing an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene; and 2) a step for bringing the microorganism into contact with glucose or disaccharides or polysaccharides having glucose units under conditions suited to the growth and/or maintenance of the microorganism. more specifically, it is a method for producing scyllo-inositol and a derivative thereof using a transformant wherein the transformant expresses an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene. the scyllo-inositol derivative produced in the culture of (1) above is a novel compound; glucose and scyllo-inositol are β1→4 bonded in this derivative. therefore, one embodiment of the present invention is the production method according to (1) wherein the scyllo-inositol derivative is a compound shown by the following structural formula: surprisingly enough, enhancing the inositol monophosphatase activity of such transformants greatly improved the scyllo-inositol production capacity. unexpectedly, scyllo-inositol was produced predominantly and production of myo-inositol was slight in these transformants. none of the prior literature of before the priority date of the present application either suggested or disclosed enhancing inositol monophosphatase activity for this purpose. therefore, the second aspect of the present invention is: (3) the production method according to (1) or (2) above wherein the transformed microorganism has a gene recombination or mutation to induce functional inositol monophosphatase overproduction or inositol monophosphatase activation. prokaryotic microorganisms typified by escherichia coli are very attractive from the viewpoint of industrial fermentative production due to their rapid growth ability and ease of fermentation control and have advantages from the viewpoint of the practical accomplishment in the application of gene recombination techniques and the established safety. the many prokaryotic microorganisms that do not have a biosynthetic pathway for scyllo-inositol from glucose via myo-inositol also have an advantage in ease of control of scyllo-inositol productivity by the use of synthetic biology techniques in cooperation with genetic recombination techniques. prokaryotic microbial hosts such as e. coli in particular make the application of synthetic biology techniques even easier since they do not have the ability to assimilate(ability to decompose) myo-inositol, an intermediate of the scyllo-inositol biosynthetic pathway. therefore, preferred embodiments of the present invention are: (4) the production method according to any of (1) to (3) above wherein the transformed microorganism is derived from a microorganism that does not have the ability to assimilate myo-inositol; and (5) the production method according to any of (1) to (4) above wherein the transformed microorganism is derived from a bacterium selected from the group consisting of escherichia coli , bacteria belonging to the genus bacillus, bacteria belonging to the genus corynebacterium, and bacteria belonging to the genus zymomonas. as regards preferred embodiment (3) above, regardless of whether or not the host microorganism has endogenous inositol monophosphatase activity, inducing overproduction of inositol monophosphatase within the cell can enhance the inositol monophosphatase activity of the cell. inositol monophosphatase overproduction can be induced in the cell by applying various known techniques. therefore, the present invention includes the following embodiments: (6) the production method according to any of (3) to (5) above wherein the inositol monophosphatase overproduction is induced by, in the transformed microorganism: a) introducing an exogenous inositol monophosphatase gene, b) increasing the number of copies of an endogenous inositol monophosphatase gene, c) introducing a mutation into a regulatory region of the endogenous inositol monophosphatase gene, d) replacing the regulatory region of the endogenous inositol monophosphatase gene with a high expression-inducing exogenous regulatory region, or e) deleting the regulatory region of the endogenous inositol monophosphatase gene; and (7) the production method according to (6) above wherein the inositol monophosphatase overexpression is induced by introducing an exogenous inositol monophosphatase gene into the above transformed microorganism. in addition, when the host cell has an endogenous inositol monophosphatase gene, the inositol monophosphatase activity of the cell can be enhanced by the following embodiments as well. therefore, the present invention also includes the following embodiment: (8) the production method according to any of (3) to (5) above wherein the inositol monophosphatase activation is induced by, in the transformed microorganism: f) introducing a mutation into an endogenous inositol monophosphatase gene, g) replacing all or part of the endogenous inositol monophosphatase gene, h) deleting part of the endogenous inositol monophosphatase gene, i) reducing other proteins that lower inositol monophosphatase activity, or j) reducing production of compounds that lower inositol monophosphatase activity. the present invention also intends transformants for use in the production method of scyllo-inositol and a derivative thereof. therefore, another aspect of the present invention is: (9) a transformed microorganism, capable of fermentatively producing scyllo-inositol from glucose and possessing an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene. matters and embodiments mentioned with regard to the second aspect of the present invention are also true for the transformants of (9) above of the present invention. therefore, they include the following: (10) the transformed microorganism according to (9) above, further possessing a gene recombination or mutation to induce functional inositol monophosphatase overexpression or inositol monophosphatase activation; (11) the transformed microorganism according to (9) or (10) above, being derived from a microorganism that does not have the ability to assimilate myo-inositol; (12) the transformed microorganism according to any of (9) to (11) above, being derived from a bacterium selected from the group consisting of escherichia coli, bacteria belonging to the genus bacillus, bacteria belonging to the genus corynebacterium, and bacteria belonging to the genus zymomonas; and (13) the transformed microorganism according to any of (10) to (12) above wherein the inositol monophosphatase overproduction is induced by, in the transformed microorganism: a) introducing an exogenous inositol monophosphatase gene, b) increasing the number of copies of an endogenous inositol monophosphatase gene, c) introducing a mutation into a regulatory region of the endogenous inositol monophosphatase gene, d) replacing the regulatory region of the endogenous inositol monophosphatase gene with a high expression-inducing exogenous regulatory region, or e) deleting the regulatory region of the endogenous inositol monophosphatase gene; (14) the transformed microorganism according to (13) above wherein the inositol monophosphatase overproduction is induced by introducing the exogenous inositol monophosphatase gene into the transformed microorganism; and (15) the transformed microorganism according to any of (10) to (12) above wherein the inositol monophosphatase activation is induced by, ino the transformed microorganism: f) introducing a mutation into an endogenous inositol monophosphatase gene, g) replacing all or part of the endogenous inositol monophosphatase gene, h) deleting part of the endogenous inositol monophosphatase gene, i) reducing other proteins that lower inositol monophosphatase activity, or j) reducing production of compounds that lower inositol monophosphatase activity. there is also described herein a novel scyllo-inositol derivative discovered to be produced in the culture of the above transformant. specifically, there is described herein: (16) a compound shown by the following structural formula: the scyllo-inositol derivative described herein can be decomposed by enzymes, for example, β-glucosidase(ec 3.2.1.21), capable of catalyzing a reaction that hydrolyzes β-glycoside bounds, and produces glucose and scyllo-inositol easily. the high water solubility demonstrated by the scylloinositol derivative described herein can be advantageous in such enzymatic reactions. therefore, described herein is: (17) a method for producing scyllo-inositol, the method being characterized in that the compound of (16) above is decomposed by an enzyme capable of catalyzing a reaction that hydrolyzes β-glycoside bonds, to produce scyllo-inositol. there is also described herein: (18) a composition containing scyllo-inositol and the compound of (16) above, advantages of the invention the present invention makes it possible to achieve more efficient industrial scyllo-inositol production through microbial culture techniques. there is also described herein a novel scyllo-inositol derivative. since it has very high water-solubility, this derivative can improve the concentration produced per batch in the production process and provides excellent handling when producing related products. the industrial productivity of scyllo-inositol can also be improved. brief description of the drawings [ fig. 1 ] shows a coding region of ino1 gene (seq id no: 1). [ fig. 2 ] shows a coding region of suhb gene (seq id no: 3). [ fig. 3 ] shows a coding region of iolg gene (seq id no: 5). [ fig. 4 ] shows a coding region of iolw gene (seq id no: 7). [ fig. 5 ] is a 1 h-nmr spectrum of the scyllo-inositol derivative of the present invention. in the figure, the peak shown by the arrow is from an impurity. [ fig. 6 ] is a 13 c-nmr spectrum of the scyllo-inositol derivative of the present invention. [ fig. 7 ] is an example of decomposition of the scyllo-inositol derivative of the present invention by β-glucosidase (cellobiase). best mode for carrying out the invention the first problem of the present invention is solved by fermenting a transformed microorganism possessing an inositol-1-phosphoric acid synthase gene, inositol monophosphatase gene, myo-inositol dehydrogenase gene, and scyllo-inositol dehydrogenase gene in a medium containing glucose or disaccharides or polysaccharides having glucose units as the carbon source or by bringing this transformant into contact with this carbon source. namely, the transformed microorganism of the present invention has the capacity to convert a glucose substrate into scyllo-inositol and a derivative thereof by one-step fermentation by consecutive biosynthetic pathways newly constructed within the microorganism. typically, the biosynthetic pathway that converts a glucose substrate into the scyllo-inositol (or simultaneously produced scyllo-inositol derivative; the two together are sometimes referred to hereinafter as "scyllo-inositol described herein") described herein includes a partial pathway for conversion of the glucose substrate into myo-inositol, an important intermediate. specifically, in the case of a prokaryotic host, a partial pathway for myo-inositol biosynthesis can be made to function within the microorganism by causing the following catalytic activities to be expressed. activity 1: activity to produce glucose-6-phosphate from a suitable carbon source; activity 2: activity to convert glucose-6-phosphate into myo-inositol-1-phosphate, that is, inositol-1-phosphoric acid synthase activity; and activity 3: phosphatase activity taking myo-inositol-1-phosphate as a substrate. however, since glucose-6-phosphate that is the product of activity 1 is a metabolic intermediate universally produced by prokaryotic microorganisms, it is not essential to impart this activity to prokaryotic microorganisms. with regard to activity 3 as well, as far as the inventors know, endogenous inositol monophosphatase is expressed in the majority of prokaryotic microbial host cells suited to industrial production by conventional gene recombination techniques, or they have general monophosphatase activity capable of using myo-inositol-1-phosphate as a substrate. on the other hand, as for activity 2, there are many examples of prokaryotic microorganisms that do not have an inositol-1-phosphoric acid synthase gene. inositol-1-phosphoric acid synthase is believed to be responsible for a rate-limiting reaction in myo-inositol biosynthetic reactions (refer to patent references 14 and 15). it was therefore thought to be necessary and sufficient to introduce an exogenous inositol-1-phosphoric acid synthase gene into the cell to construct a functional myo-inositol biosynthetic pathway within a prokaryotic microbial host. however, in the co-pending japanese patent application no. 2011-248438 , the present inventors discovered unexpectedly that the myo-inositol production capacity is vastly improved by enhancing the inositol monophosphatase activity in transformants having an exogenous inositol-1-phosphoric acid synthase gene introduced as described above. surprisingly enough, it also became clear that the transformants of the present invention produce very large amounts of scyllo-inositol predominantly while on the other hand producing a substantial amount of the scyllo-inositol derivative described herein without virtually any myo-inositol being produced by enhancing their inositol monophosphatase activity, as in the examples below. therefore, it is preferable to introduce a gene recombination or mutation to induce functional inositol monophosphatase overproduction or inositol monophosphatase activation in addition to introducing an exogenous inositol-1-phosphoric acid synthase gene as described above in the transformants of the present invention. regardless of whether or not the host microorganism has endogenous inositol monophosphatase activity, inducing overproduction of inositol monophosphatase within the cell of the transformed microorganism can enhance the inositol monophosphatase activity of the cell. overproduction of inositol monophosphatase can preferably be induced by introducing an exogenous inositol monophosphatase gene into the transformed microorganism, but possibilities are not limited thereto. furthermore, in this specification, the term "exogenous" is used to mean that a gene or nucleic acid sequence based on the present invention is introduced into a host in a case in which the host microorganism prior to transformation does not have the gene to be introduced by the present invention, in a case in which it substantially does not express the enzyme encoded by this gene, and in a case in which the amino acid sequence of this enzyme is encoded by a different gene, but endogenous enzyme activity comparable to that after transformation is not expressed. next, the following catalytic activities are imparted to the transformant of the present invention, that is, to a transformed microorganism having consecutive biosynthetic pathways capable of converting a glucose substrate into scyllo-inositol (or simultaneously produced scyllo-inositol derivative). activity 4: enzyme activity to convert myo-inositol into 2-keto-myo-inositol (myo-inosose; 2,3,4,5,6-pentahydroxycyclohexan-1-one); and activity 5: enzyme activity to convert 2-keto-myo-inositol into scyllo-inositol. examples of enzymes having activity 4 include myo-inositol dehydrogenase (enzyme no. e.c.1.1.1.18) which oxidizes myo-inositol in the presence of nad + , for example. examples of enzymes having activity 5 include scyllo-inositol dehydrogenase which oxidizes scyllo-inositol in the presence of nadp + , for example. namely, scyllo-inositol dehydrogenase that can be used in the present invention is capable of converting 2-keto-myo-inositol into scyllo-inositol in the presence of nadph, for example. the transformant of the present invention can be made using various host microbial cells. using a prokaryotic microorganism as a host in particular is highly attractive for the application of synthetic biology techniques since it allows a biosynthetic pathway of the scyllo-inositol of the present invention to be newly constructed (that is, with no effect of an existing endogenous pathway) within the host cell. prokaryotic microorganisms that can be given as examples are bacteria belonging to the genera escherichia, pseudomonas, bacillus, geobacillus, methanomonas, methylobacillus, methylophilus, protaminobacter, methylococcus, corynebacterium, brevibacterium, zymomonas, and listeria. nonlimiting examples of prokaryotic microorganisms suited to industrial fermentative production include escherichia coli, bacteria belonging to the genus bacillus, bacteria belonging to the genus corynebacterium, and bacteria belonging to the genus zymomonas. escherichia coli is an especially preferred example of a host microorganism of the present invention because of its rapid growth capacity and ease of fermentation control. cell lines that can be utilized as host cells of the present invention may be wild types in the ordinary sense or may be auxotrophic mutants or antibiotic-resistant mutants. cell lines that can be utilized as host cells of the present invention may also be already transformed so as to have various marker genes related to the mutations as mentioned above. these mutations and genes make it possible to provide properties beneficial to the production, maintenance, and control of the transformants of the present invention. preferably, the use of a strain presenting resistance to chloramphenicol, ampicillin, kanamycin, tetracycline, and other such antibiotics makes it possible to produce the scyllo-inositol of the present invention easily. as was mentioned above, the scyllo-inositol biosynthetic pathway that the transformant of the present invention should have includes a partial pathway for converting the glucose substrate into myo-inositol, an important intermediate. since inositol-1-phosphoric acid synthase is believed to be responsible for a rate-limiting reaction in myo-inositol biosynthesis, as was also mentioned above, the transformant of the present invention must express inositol-1-phosphoric acid synthase activity as the first bioactivity. since there are many examples of prokaryotic microorganisms that do not have an inositol-1-phosphoric acid synthase gene, an exogenous inositol-1-phosphoric acid synthase gene is usually introduced expressibly into the cell of the transformant of the present invention. inositol-1-phosphoric acid synthase genes are known (for example, genbank accession nos. ab032073, af056325, af071103, af078915, af120146, af207640, af284065, bc111160, l23520, u32511), and any of these can be used for the purposes of the present invention. the ino1 gene (seq id no: 1) gene derived from yeast is a well-known example of an inositol-1-phosphoric acid synthase gene and can be used appropriately in the present invention as well. however, inositol-1-phosphoric acid synthase genes that can be utilized in the present invention are not limited to those derived from yeasts and may be derived from other eukaryotic microorganisms and other organisms or may be artificially synthesized, as long as they are capable of expressing substantial inositol-1-phosphase synthase activity within the host microbial cells. therefore, inositol-1-phosphoric acid synthase genes that can be utilized for purposes of the present invention may have any mutations capable of occurring in the natural world and artificially introduced mutations and modifications as long as they are capable of expressing substantial inositol-1-phosphase synthase activity within the transformed microorganism. for example, the presence of excess codons (redundancy) is known in various codons that encode specific amino acids. alternate codons that are finally translated into the same amino acids may therefore also be utilized in the present invention. in other words, since the genetic code degenerates, multiple codons can be used to encode certain specific amino acids, and the amino acid sequence can therefore be encoded by a dna oligonucleotide similar to any one set. while only one member of that set is identical to the genetic sequence of the native enzyme, even mismatched dna oligonucleotides can hybridize with the native sequence under suitable stringent conditions (for example, hybridization by 3 × ssc, 68°c; washing by 2 × ssc, 0.1% sds, and 68°c), and dna that encodes the native sequence can be identified and isolated. such genes can also be utilized in the present invention. in particular, since virtually all organisms are known to use subsets of specific codons (optimal codons) preferentially ( gene, vol. 105, pp. 61-72, 1991 , and the like), "codon optimization" in accordance with the host microorganism can also be useful in the present invention. those skilled in the art will appreciate that, in producing the transformant of the present invention as well, a more stable, higher level of inositol-1-phosphoric acid synthase activity is obtained by introducing an inositol-1-phosphoric acid synthase gene into the host microbial cells as an "expression cassette." in this specification, "expression cassette" means a nucleotide containing a nucleic acid sequence that regulates transcription and translation functionally linked to the nucleic acid to be expressed or the gene to be expressed. typically, an expression cassette of the present invention contains a promoter sequence 5' upstream from the coding sequence and a terminator sequence 3' downstream from the sequence. sometimes it contains a further normal regulatory element in a functionally linked state. in such cases, the nucleic acid to be expressed or the gene to be expressed is introduced expressibly into the host microorganism. a promoter is defined as a dna sequence that links rna polymerase to dna and initiates rna synthesis, regardless of whether it is a constitutive promoter or a regulatory promoter. a strong promoter means a promoter that initiates mrna synthesis at high frequency and is also preferably used in producing the transformant of the present invention. a lac promoter, trp promoter, tac or trc promoter, major operator and promoter regions of λ phage, fd coat protein control region, promoters for a glycolytic enzyme (for example, 3-phosphoglycerate kinase, glyceraldehyde-3-phosphate dehydrogenase), glutamate decarboxylase a, serine hydroxymethyl transferase, and the like can be utilized in accordance with the properties and the like of the host cells. examples of regulatory elements other than promoter and terminator sequences include selection markers, amplification signals, replication origins, and the like. suitable regulatory sequences are listed, for example, in " gene expression technology: methods in enzymology 185," academic press (1990 ). the expression cassette explained above is incorporated, for example, into a vector consisting of a plasmid, phage, transposon, is element, phasmid, cosmid, linear or circular dna, or the like, and inserted into the host microorganism. plasmids and phages are preferred. these vectors may be autonomously replicated in the host microorganism or may be replicated chromosomally. suitable plasmids include, for example, e. coli plg338, pacyc184, pbr322, puc18, puc19, pkc30, prep4, phs1, pkk223-3, pdhe19.2, phs2, pplc236, pmbl24, plg200, pur290, pin-iii113-b1. λgt11 or pbdci; bacillus pub110, pc194 or pbd214; corynebacterium psa77 or paj667; and the like. plasmids and the like that can also be used in addition to these are listed in " cloning vectors," elsevier, 1985 . the expression cassette can be introduced into the vector by ordinary methods, including excision by suitable restriction enzymes, cloning, and ligation. after having constructed a vector having an expression cassette as discussed above, coprecipitation, protoplast fusion, electroporation, retrovirus transfection, and other such ordinary cloning methods and transfection methods are used as methods that can be used to introduce the vector into the host microorganism. examples of these are listed in " current protocols in molecular biology," f. ausubel et al., publ. wiley interscience, new york, 1997 or sambrook et al., "molecular cloning: laboratory manual," 2nd edition, cold spring harbor laboratory, cold spring harbor laboratory press, cold spring harbor, ny, 1989 . next, the second bioactivity that the transformant of the present invention should have is inositol monophosphatase activity. this inositol monophosphatase activity is also required to convert the glucose substrate into the intermediate myo-inositol. however, as was mentioned above, since the majority of prokaryotic microbial host cells suited to industrial production by conventional gene recombination techniques express endogenous inositol monophosphatase or have general monophosphatase activity capable of using myo-inositol-1-phosphate as a substrate, there is often no need to introduce this enzyme activity into the transformant of the present invention. nonetheless, the transformant of the present invention more preferably presents enhanced inositol monophosphatase. specifically, it was unexpectedly made clear that the scyllo-inositol-producing transformant of the present invention not only produces virtually no myo-inositol while producing a very large amount of scyllo-inositol predominantly but also notably produces a scyllo-inositol derivative by enhancing this inositol monophosphatase activity. therefore, a preferred aspect of the present invention includes inducing overproduction of inositol monophosphatase within the scyllo-inositol-producing transformant. the inositol monophosphatase intended in the present invention includes proteins capable of substantially hydrolyzing inositol-1-phosphate by presenting phosphoric monoester hydrolase activity capable of acting on a wide range of substrates in addition to those presenting high substrate specificity for inositol-1-phosphate. for example, inositol-1-monophosphatase is known as a typical inositol monophosphatase, and this gene (suhb gene) from many organisms has been published in genbank accession nos. zp_04619988, yp_001451848, and the like. in particular, the use of a suhb gene from e . coli (seq id no: 3: aac75586 (mg1655)) is convenient when e . coli is used as the host cell. the third bioactivity that the transformant of the present invention should have is myo-inositol dehydrogenase activity. this enzyme typically converts myo-inositol into 2-keto-myo-inositol in the presence of nad + by the following reaction. [chemical formula 3] myo-inositol + nad + ↔ 2-keto-myo-inositol + nadh + h + various myo-inositol dehydrogenase genes are known and can be utilized. for example, jp kokai 6-7158 describes an enzyme (ec 1.1.1.18) from bacteria of the genus bacillus capable of converting myo-inositol into 2-keto-myo-inositol in the presence of nad + and a nucleic acid sequence that encodes the enzyme. in addition, patent reference 5 discloses nad + -independent myo-inositol dehydrogenase, and this enzyme can also be used in production of the transformant of the present invention. in particular, it is convenient to use an iolg gene (seq id no: 5 below) from bacillus subtilis nbrc13719. the fourth bioactivity that the transformant of the present invention should have is scyllo-inositol dehydrogenase activity. this enzyme typically converts scyllo-inositol into 2-keto-myo-inositol in the presence of nadp + by the following reaction, and selectively reduces 2-keto-myo-inositol into scyllo-inositol in the presence of nadph. the latter reaction is utilized within the transformant of the present invention. [chemical formula 5] scyllo-inositol + nadp + ↔ 2-keto-myo-inositol + nadph + h + various scyllo-inositol dehydrogenase genes are known and can be utilized. patent reference 5 discloses scyllo-inositol dehydrogenase from e. coli, bacteria of the genus acetobacter, bacteria of the genus bacillus, bacteria of the genus agrobacterium, and bacteria of the genus xanthomonas and related amino acid sequences. in particular, the use of an iolw gene (seq id no: 7 below) from bacillus subtilis nbrc13719 is convenient. those skilled in the art will readily appreciate that the above explanation of mutation, modification, and codon optimization, expression cassette, promoter and other regulator sequences and plasmids, and transformation thereby given with regard to the inositol-1-phosphoric acid synthase gene holds true for all of the above inositol monophosphatase genes, myo-inositol dehydrogenase genes, and scyllo-inositol dehydrogenase genes. therefore, the transformant of the present invention possesses three expression cassettes: an expression cassette containing nucleic acid to encode inositol-1-phosphoric acid synthase, an expression cassette containing nucleic acid to encode myo-inositol dehydrogenase, and an expression cassette containing nucleic acid to encode scyllo-inositol dehydrogenase, in which case an endogenous inositol monophosphatase gene is present in the transformant of the present invention. the transformant of the present invention preferably possesses an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 1, an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 5, and an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 7. the above three expression cassettes may be placed on one vector and transfected into a host microorganism. alternatively, a vector on which any two expression cassettes have been placed and a vector on which the remaining expression cassette has been placed may be co-transfected into a host microorganism, or three vectors on each of which one expression cassette each has been placed may be co-transfected into a host microorganism. any one or more of the above three expression cassettes may also be incorporated into the genome of a host microorganism, and the remaining expression cassettes may be present in the transformant as plasmids. for example, it is also possible to transfect a plasmid on which an expression cassette containing nucleic acid to encode myo-inositol dehydrogenase and an expression cassette containing nucleic acid to encode scyllo-inositol dehydrogenase have been placed into e. coli akc-017 (deposited as ferm p-22180 on october 25, 2011 at the incorporated administrative agency national institute of technology and evaluation, patent microorganisms depositary. international accession no.: ferm bp-11513) obtained by incorporating an expression cassette containing nucleic acid for encoding inositol-1-phosphoric acid synthase (ino1) on a chromosome. in addition, as has been stated repeatedly, it is particularly preferable that the transformant of the present invention presents enhanced inositol monophosphatase. therefore, the transformant of the present invention preferably possesses an expression cassette containing nucleic acid to encode inositol monophosphatase in addition to the above three expression cassettes. therefore, examples of more preferred transformants of the present invention include transformants possessing an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 1, an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 3, an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 5, and an expression cassette containing nucleic acid having a nucleotide sequence shown by seq id no: 7. the above four expression cassettes may be placed on one vector and transfected into a host microorganism. alternatively, a vector on which any two or more expression cassettes have been placed and a vector on which the remaining expression cassettes have been placed may be co-transfected into a host microorganism, or four vectors on each of which one expression cassette each has been placed may be co-transfected into a host microorganism. any one or more of the above four expression cassettes may also be incorporated into the genome of a host microorganism, and the remaining expression cassettes may be present in the transformant as plasmids. for example, it is also possible to transfect a plasmid on which an expression cassette containing nucleic acid to encode myo-inositol dehydrogenase and an expression cassette containing nucleic acid to encode scyllo-inositol dehydrogenase have been placed into e. coli akc-018 (deposited as ferm p-22181 on october 25, 2011 at the incorporated administrative agency national institute of technology and evaluation, patent microorganisms depositary. international accession no.: ferm bp-11514) having both an expression cassette containing nucleic acid for encoding inositol-1-phosphoric acid synthase (ino1) and an expression cassette containing nucleic acid for encoding inositol monophosphatase (subb) on a chromosome. furthermore, in connection with methods of inducing enhanced inositol monophosphatase activity in a preferred transformant of the present invention, overproduction of the inositol monophosphatase can also be induced by increasing the number of copies of an endogenous inositol monophosphatase gene; introducing a mutation into a regulatory region of the endogenous inositol monophosphatase gene; replacing the regulatory region of the endogenous inositol monophosphatase gene with a high expression-inducing exogenous regulatory region, and deleting the regulatory region of the endogenous inositol monophosphatase gene. specifically, overexpression of inositol monophosphatase can be achieved by transforming the host microorganism by a construct containing the endogenous inositol monophosphatase gene or an expression cassette in which a suitable regulatory region has been added to a coding region of this endogenous gene to substantially increase the number of copies of this inositol monophosphatase gene within this transformant in comparison to the original host cell or, with respect to an original host cell having an endogenous inositol monophosphatase gene, conducting chromosomal mutation, addition, and deletion by known gene recombination techniques or introducing random mutation on a chromosome using a mutagen or the like. the overproduction of inositol monophosphatase can be confirmed using known sds-page analytical methods, and the like. another embodiment of the present invention for enhancing inositol monophosphatase activity includes inducing activation of inositol monophosphatase in the transformant of the present invention. examples of techniques used for this purpose are 1) introducing a mutation into an endogenous inositol monophosphatase gene, 2) replacing all or part of the endogenous inositol monophosphatase gene, 3) deleting part of the endogenous inositol monophosphatase gene, 4) reducing other proteins that lower inositol monophosphatase activity, and/or 5) reducing production of compounds that lower inositol monophosphatase activity. with regard to the above methods 1)-5) to enhance inositol monophosphatase activity, inositol monophosphatase having enhanced inositol monophosphatase activity can be obtained by evaluating the activity of inositol monophosphatase encoded by this gene after having subjected the inositol monophosphatase gene to mutation, addition, or deletion. the transformants obtained as described above are cultured and maintained under conditions suited to the growth and/or maintenance of the transformants to produce the scyllo-inositol of the present invention. suitable medium compositions, culture conditions, and culture times for transformants derived from various host microbial cells are known to those skilled in the art. the medium may be a natural, semisynthetic, or synthetic medium containing one or more carbon sources, nitrogen sources, inorganic salts, vitamins, and, sometimes, trace elements or vitamins, and other such trace components. however, it goes without saying that the medium used must properly satisfy the nutrient requirements of the transformants to be cultured. media that can be used in the present invention also contain glucose or disaccharides or polysaccharides having glucose units to cause de novo scyllo-inositol biosynthesis and biosynthesis of the scyllo-inositol derivative to advance easily by the transformants of the present invention. many disaccharides or polysaccharides having glucose units are known to those skilled in the art. nonlimiting examples include sucrose, maltose, lactose, starch, and cellulose. since these are contained in large amounts in rice bran, molasses, decomposed corn solution, decomposed cellulose solution, and other such biomasses, it is preferable to use a medium having these natural sources as a carbon source. when the transformants express useful additional traits, for example, when they have resistance markers for antibiotics, the medium may contain the corresponding antibiotics. this reduces the risk of contamination by foreign bacteria during fermentation. furthermore, when the host microorganisms cannot assimilate cellulose or other such carbon sources, the host microorganisms can be adapted to production of scyllo-inositol and its derivative using these carbon sources by introducing an exogenous gene or other such known genetic engineering techniques. examples of exogenous genes include cellulase genes, amylase genes, and the like. culture may be either by batch or continuous. in either case, it may be in the form of supplying additional above-mentioned carbon source and the like at a suitable point in time during culture. culture should also be continued while maintaining a suitable temperature, oxygen concentration, ph, and the like. a suitable culture temperature for transformants derived from common microbial host cells is usually 15-45°c, preferably in the 25-37°c range. when the host microorganism is aerobic, shaking (flask culture and the like), stirring/aeration (jar fermenter culture and the like) is necessary to assure a suitable oxygen concentration during fermentation. these culture conditions are easy to establish for those skilled in the art. methods of refining scyllo-inositol or its derivative from the above culture may be suitable combinations of refining techniques known to those skilled in the art. in the case of transformants of prokaryotic microbial host cells, the scyllo-inositol of the present invention is present in the culture supernatant or in the cells, and may be extracted from the cultured cells if necessary. in the case of extraction from cultured cells, for example, the culture is centrifuged to separate the supernatant and cells, and the cells can be broken down by surfactant, organic solvent, enzyme, or the like while utilizing a homogenizer. typical methods of refining scyllo-inositol and its derivative from the culture supernatant and sometimes from a cell extraction liquid include deproteination utilizing protein precipitation by ph adjustment or the like, removal of impurities by adsorption utilizing activated carbon, chromatography utilizing ionexchange resin or the like, and other such refining processes. a solid obtained by drying a fraction separated by chromatography may also be recrystallized, for example, from a water-ethanol system. as shall be apparent, some steps may be omitted or additional chromatography, recrystallization, and the like may be implemented depending on the target purity of the product. the scyllo-inositol derivative pertaining to the second problem described herein has a structure consisting of glucose residues and scyllo-inositol residues linked by β1→4 bonds and is represented by the following structural formula. the above compound is novel and can also be called 1-o-β-d-glucopyranosyl-scyllo-inositol. as in the examples discussed below, the scyllo-inositol derivative described herein can be decomposed easily by an enzyme capable of catalyzing a reaction that hydrolyzes β-glycoside bonds, for example, β-glucosidase (ec 3.2.1.21), easily producing glucose and scyllo-inositol. therefore scyllo-inositol can be produced by causing this enzyme to act on the scyllo-inositol derivative described herein. in particular, the scyllo-inositol derivative described herein, as will be discussed below, presents at least four times greater water solubility (25°c, w/v) than the original scyllo-inositol. since the scyllo-inositol derivative described herein can be produced and treated at high concentration in an aqueous solution, producing scyllo-inositol by obtaining the scyllo-inositol derivative described herein and treating it enzymatically has many advantages. such methods are therefore one preferred method of utilizing the scyllo-inositol derivative described herein. in enzymatic decomposition of the scyllo-inositol derivative described herein by β-glucosidase or the like to produce scyllo-inositol as described above, an appropriate amount of enzyme is added to a solution of the scyllo-inositol derivative obtained by water or buffer (acetate buffer, phosphate buffer, or the like), and the solution may be incubated using conditions and time suited to the enzymatic reaction. β-glucosidases that can be used for this purpose are marketed, and all can be used. cellobiase (sigma) from molds of the genus aspergillus, for example, may be utilized. the amount of enzyme added may be decided as appropriate based on the concentration of the scyllo-inositol derivative described herein in the solution and other such factors while referring to the manufacturer's instructions. the ph during reaction is generally in the ph 4.0-9.0 range, but in essence should be the optimum ph for the enzyme used. the temperature during reaction should also be within the optimum temperature range of the enzyme used, for example, a range of about 20-50°c. the reaction may be continued until the time when basically all of the scyllo-inositol derivative described herein has been converted into scyllo-inositol while quantitatively tracing the decomposition rate of the scyllo-inositol derivative. scyllo-inositol may then be separated from the reaction solution by recrystallization or the like, furthermore, as in the examples discussed below, the scyllo-inositol productivity can be further increased when the transformant of the present invention is cultured under conditions that produce a substantial amount of scyllo-inositol derivative described herein together with scyllo-inositol by treating the culture as is of this transformant by the above-mentioned enzyme or by enzyme treatment after having crudely refined the culture by deproteination treatment or activated charcoal treatment. use as an active ingredient or functional component of drugs, foods, cosmetics, and the like is a potential application of the scyllo-inositol derivative described herein. in other words, since the bioactivity of scyllo-inositol is being clarified, as was mentioned above, and scyllo-inositol is produced easily by enzymatic decomposition of the scyllo-inositol derivative described herein, addition of the scyllo-inositol derivative itself to drugs and the like, with the expectation that the scyllo-inositol derivative is enzymatically decomposed within the body to produce scyllo-inositol, is a very interesting mode of use of the present invention. those skilled in the art who have been provided with the above explanation can implement the present invention adequately. examples are given below for the sake of further explanation. therefore, the present invention is not limited to these examples. furthermore, the nucleotide sequences in this specification are described in the direction from 5' to 3' unless stated otherwise. examples example 1: scyllo-inositol do novo production by a transformant without enhancement of inositol monophosphatase activity in this example, a transformed microorganism of the present invention possessing three expression cassettes: an expression cassette containing nucleic acid encoding inositol-1-phosphoric acid synthase, an expression cassette containing nucleic acid encoding myo-inositol dehydrogenase, and an expression cassette containing nucleic acid encoding scyllo-inositol dehydrogenase, was produced, and its capacity to produce scyllo-inositol was investigated. 1-a) inositol-1-phosphoric acid synthase expression cassette the cells were collected from the isolated distillery yeast culture broth, and the genomic dna was extracted using nucleo spin tissue (product name, manufactured by macherey-nagel). using the extracted genomic dna as a template, pcr amplification (primestar max dna polymerase (product name, manufactured by takara bio), reaction conditions: 98°c 10 sec, 55°c 5 sec, 72°c 20 sec, 28 cycles) was carried out by the following primers, and the coding region of the ino1 gene (seq id no: 1) was cloned. next, the ino1 coding region obtained was inserted transcribably downstream of a promoter of the following sequence. specifically, a terminator sequence and the above promoter sequence were inserted at the multicloning site of plasmid pnfp-a51 (deposited as ferm p-22182 on october 25, 2011 at the incorporated administrative agency national institute of technology and evaluation, patent microorganisms depositary. international accession no.: ferm bp-11515). the ino1 coding region cloned as described above was ligated downstream of the promoter sequence introduced, and pnfp-d78 was constructed. the pnfp-d78 constructed was transfected into e. coli akc-016 (deposited as ferm p-22104 on april 20, 2011 at the incorporated administrative agency national institute of technology and evaluation, patent microorganisms depositary. international accession no.: ferm bp-11512) by the calcium chloride method (refer to genetic engineering laboratory notebook (part i), by takaaki tamura, yodosha). high expression of inositol-1-phosphoric acid synthase was confirmed in the soluble fraction of this e. coli by sds-page. 1-b) myo-inositol dehydrogenase expression cassette bacillus subtilis (nbrc13719) was shake-cultured at 30°c in lb medium (2 ml). after culture had been completed, the cells were collected from the culture broth, and the genomic dna was extracted using nucleo spin tissue (product name, manufactured by macherey-nagel). using the extracted genomic dna as a template, pcr amplification (primestar max dna polymerase (product name, manufactured by takara bio), reaction conditions: 98°c for 10 sec, 55°c for 5 sec, and 72°c for 20 sec, 28 cycles) was carried out by the following primers, and the coding region of the iolg gene (seq id no: 5) was cloned. the iolg coding region obtained was inserted transcribably downstream of a promoter of seq id no: 11. specifically, a terminator sequence and the above promoter sequence were inserted at the multicloning site of the above pnfp-a51. the iolg coding region cloned as described above was ligated downstream of the promoter sequence introduced, and pnfp-j22 was constructed. the pnfp-j22 constructed was transfected into e. coli ferm p-22104 by the calcium chloride method (refer to genetic engineering laboratory notebook (part i), by takaaki tamura, yodosha). high expression of myo-inositol dehydrogenase was confirmed in the soluble fraction of this e. coli by sds-page. 1-c) scyllo-inositol dehydrogenase expression cassette bacillus subtilis (nbrc13719) was shake-cultured at 30°c in lb medium (2 ml). after culture had been completed, the cells were collected from the culture broth, and the genomic dna was extracted using nucleo spin tissue (product name, manufactured by macherey-nagel). using the extracted genomic dna as a template, pcr amplification (primestar max dna polymerase (product name, manufactured by takara bio), reaction conditions: 98°c for 10 sec, 55°c for 5 sec, and 72°c for 20 sec, 28 cycles) was carried out by the following primers, and the coding region of the iolw gene (seq id no: 7) was cloned. [chemical formula 11] forward: atgataacgcttttaaagggg (seq id no: 14) reverse: ttagtgctccagcataatgg (seq id no: 15) the iolw coding region obtained was inserted transcribably downstream of a promoter of seq id no: 11. specifically, a terminator sequence and the above promoter sequence were inserted at the multicloning site of the above pnfp-a51. the iolw coding region cloned as described above was ligated downstream of the promoter sequence introduced, and pnfp-j36 was constructed. the pnfp-j36 constructed was transfected into e. coli ferm p-22104 by the calcium chloride method (refer to genetic engineering laboratory notebook (part i), by takaaki tamura, yodosha). high expression of scyllo-inositol dehydrogenase was confirmed in the soluble fraction of this e. coli by sds-page. 1-d) construction of a plasmid for transformation pnfp-d78 was digested by sal i, blunted, and the 5' end dephosphorylated. the iolg expression cassette in pnfp-j22 and the iolw expression cassette in pnfp-j36 were cloned, and the two expression cassettes were ligated into pnfp-d78. a plasmid having an ino1 expression cassette and an iolg expression cassette and iolw expression cassette in the forward direction ligated in pnfp-d78 was obtained. 1-e) scyllo-inositol production by transformants transfected by an expression cassette-containing plasmid a plasmid constructed according to the procedure described above was transfected into e. coli akc-016 (deposited as ferm p-22104 on april 20, 2011 at the incorporated administrative agency national institute of technology and evaluation, patent microorganisms depositary. international accession no.: ferm bp-11512) by the calcium chloride method (refer to genetic engineering laboratory notebook (part i), by takaaki tamura, yodosha). the transformant obtained was cultured for one day at 37°c on lb plates containing ampicillin (100 mg/l) to form colonies. two milliliters of lb medium containing ampicillin (100 mg/l) was placed in a 15 ml test tube and inoculated by a platinum loop with colonies from the above plate. culture was carried out at 37°c for 3-5 hours at 180 rpm until od (600 nm) reached approximately 0.5. this was taken as preculture broth for the main culture. a quantity of 2 g/l of glucose and 30 ml of lb medium containing 100 mg/l of ampicillin were placed in a 150 ml flask; 0.6 ml of preculture broth was added, and the main culture (scyllo-inositol production test) was conducted. the culture conditions were as follows: culture temperature 32°c; stirring 180 rpm; culture time 16.5 h. the above culture broth was centrifuged at 4°c for 10 min at 10,000 × g, and the supernatant was collected. the scyllo-inositol concentration in the culture supernatant was measured. specifically, the scyllo-inositol concentration in the culture supernatant was assayed by hplc (detector: ri, column temperature: 70°c, flow rate: 1 ml/min,) linked to ks-g (guard column), sugar ks-801, and sugar ks-802 (all trade names, manufactured by showa denko k.k.). the results of assay clarified that 0.15 g/l of scyllo-inositol was produced in the culture supernatant and that the glucose was completely consumed. this results shows that the transformed microorganism of the present invention possessing three expression cassettes: an expression cassette containing nucleic acid encoding inositol-1-phosphoric acid synthase, an expression cassette containing nucleic acid encoding myo-inositol dehydrogenase, and an expression cassette containing nucleic acid encoding scyllo-inositol dehydrogenase, and having an endogenous inositol monophosphatase gene (that is, unenhanced inositol monophosphatase) produced scyllo-inositol from glucose directly by a one-step procedure. example 2: scyllo-inositol de novo production by a transformant having enhanced inositol monophosphatase activity in this example, a transformed microorganism of the present invention possessing four expression cassettes: an expression cassette containing nucleic acid encoding inositol-1-phosphoric acid synthase, an expression cassette containing nucleic acid encoding inositol monophosphatase, an expression cassette containing nucleic acid encoding myo-inositol dehydrogenase, and an expression cassette containing nucleic acid encoding scyllo-inositol dehydrogenase, was produced, and its capacity to produce scyllo-inositol was investigated. 2-a) inositol monophosphatase expression cassette e. coli w3110 (nbrc12713) was shake-cultured at 37°c in lb medium (2 ml). after culture had been completed, the cells were collected from the culture broth, and the genomic dna was extracted using nucleo spin tissue (product name, manufactured by macherey-nagel). using the extracted genomic dna as a template, pcr amplification (primestar max dna polymerase (product name, manufactured by takara bio), reaction conditions: 98°c for 10 sec, 55°c for 5 sec, and 72°c for 20 sec, 28 cycles) was carried out by the following primers, and the coding region of the suhb gene (seq id no: 3) was cloned. the suhb coding region obtained was inserted transcribably downstream of a promoter of the following sequence. specifically, a terminator sequence and a promoter sequence of seq id no: 18 were inserted at the multicloning site of the above pnfp-a51. the suhb coding region cloned as described above was ligated downstream of the promoter sequence introduced, and pnfp-a54 was constructed. the pnfp-a54 constructed was transfected into e. coli ferm p-22104 by the calcium chloride method (refer to genetic engineering laboratory notebook (part i), by takaaki tamura, yodosha). high expression of inositol monophosphatase was confirmed in the soluble fraction of this e. coli by sds-page. 2-b) construction of a plasmid for transformation the pnfp-d78 produced in example 1 was digested by sal i, blunted, and the 5' end dephosphorylated. the suhb expression cassette was cloned in pnfp-a54 and ligated into pnfp-d78. pnfp-g22 having an ino1 expression cassette and an suhb expression cassette in the forward direction ligated in pnfp-d78 was obtained. next, pnfp-g22 was digested by sal i, blunted, and the 5' end dephosphorylated. the iolg expression cassette in pnfp-j22 and the iolw expression cassette in pnfp-j36 were cloned, and the two expression cassettes were ligated into pnfp-g22. a plasmid having an ino1 expression cassette and suhb expression cassette and an iolg expression cassette and iolw expression cassette in the forward direction ligated in pnfp-g22 was obtained. 2-c) scyllo-inositol production by transformants transfected by an expression cassette-containing plasmid a plasmid constructed according to the procedure described above was transfected into e. coli akc-016 (deposited as ferm p-22104 on april 20, 2011 at the incorporated administrative agency national institute of technology and evaluation, patent microorganisms depositary. international accession no.: ferm bp-11512) by the calcium chloride method (refer to genetic engineering laboratory notebook (part i), by takaaki tamura, yodosha). the transformant obtained was cultured for one day at 37°c on lb plates containing ampicillin (100 mg/l) to form colonies. two milliliters of lb medium containing ampicillin (100 mg/l) was placed in a 15 ml test tube and inoculated by a platinum loop with colonies from the above plate. culture was carried out at 37°c for 3-5 hours at 180 rpm until od (600 nm) reached approximately 0.5. this was taken as preculture broth for the main culture. 2 g/l of glucose and 30 ml of synthetic medium containing 100 mg/l of ampicillin (table 1) were placed in a 150 ml flask; 0.6 ml of preculture broth was added, and the main culture (scyllo-inositol production test) was conducted. the culture conditions were as follows: culture temperature 32°c; stirring 180 rpm; culture time 16.5 h. [table 1] table-tabl0001 (table 1) synthetic medium composition kh 2 po 4 13.3 g (nh 4 ) 2 hpo 4 4 g mgso 4 ·7n 2 o 1.2 g edta·2na 8.4 mg cocl 2 ·6h 2 o 2.5 mg mncl 2 ·4h 2 o 15 mg cucl 2 ·2h 2 o 1.5 mg h 3 bo 3 3 mg na 2 moo 4 ·2h 2 o 2.5 mg zn(ch 3 coo) 2 ·2h 2 o 13 mg fecl 3 ·6h 2 o 100 mg total 1 l ph adjusted to 6.7 using 8n koh the above culture broth was centrifuged at 4°c for 10 min at 10,000 × g, and the supernatant was collected. the scyllo-inositol concentration in the culture supernatant was measured. specifically, the scyllo-inositol concentration in the culture supernatant was assayed by hplc (detector: ri, column temperature: 70°c, flow rate: 1 ml/min,) linked to ks-g (guard column), sugar ks-801, and sugar ks-802 (all trade names, manufactured by showa denko k.k.). the results of assay clarified that 0.09 g/l of scyllo-inositol was produced in the culture supernatant and that the glucose was completely consumed. on the other hand, no scyllo-inositol peak was detected in the culture supernatant in a line having unenhanced inositol monophosphatase activity at a culture time of 16.5 hours under these scyllo-inositol production conditions by synthetic medium. therefore, enhancement of the inositol monophosphatase activity in transformed microorganisms of the present invention was proved to be advantageous. 2-d) scyllo-inositol production by transformants transfected by an expression cassette-containing plasmid using a jar fermenter the transformant in 2-c) above was cultured for one day at 37°c on lb plates containing ampicillin (100 mg/l) to form colonies. thirty milliliters of lb medium containing ampicillin (100 mg/l) was placed in a 150 ml flask and inoculated by a platinum loop with colonies from the above plate. culture was carried out at 37°c for 3-5 hours at 180 rpm until od (600 nm) reached approximately 0.5. this was taken as preculture broth for the main culture. 1 g/l of glucose and 300 ml of the following synthetic medium containing 100 mg/l of ampicillin (table 2) were placed in a 1000 ml jar fermenter (manufactured by marubishi bioengineering); 6 ml of preculture broth was added, and the main culture (scyllo-inositol production test using a jar fermenter) was conducted. the culture conditions were as follows: culture temperature 32°c; culture ph 6.0 (lower limit); alkali added 28% (w/v) ammonia water; stirring at 850 rpm; ventilation 1 vvm. the glucose feed solution (table 3) that served as the raw material was added as appropriate to adjust a glucose concentration to 0-5 g/l in the culture broth. [table 2] table-tabl0002 (table 2) synthetic medium composition kh 2 po 4 13.3 g (nh 4 ) 2 hpo 4 4 g mgso 4 ·7h 2 o 1.2 g edta·2na 8.4 mg cocl 2 ·6h 2 o 2.5 mg mncl 2 ·4h 2 o 15 mg cucl 2 ·2h 2 o 1.5 mg h 3 bo 3 3 mg na 2 moo 4 ·2h 2 o 2.5 mg zn(ch 3 coo) 2 ·2h 2 o 13 mg fecl 3 ·6h 2 o 100 mg total 1 l ph adjusted to 6.3 using 8n koh [table 3] table-tabl0003 (table 3) glucose feed solution glucose 700 g mgso 4 v7h 2 o 20 g edta·2na 13 mg cocl 2 ·6h 2 o 5 mg mncl 2 ·4h 2 o 29 mg cucl 2 ·2h 2 o 4 mg h 3 bo 3 5 mg na 2 moo 4 ·2h 2 o 4 mg zn(ch 3 coo) 2 ·2h 2 o 21 mg fecl 3 ·6h 2 o 41 mg total 1 l after a culture time of 68 hours, the above culture broth was centrifuged at 4°c for 10 min at 10,000 × g, and the supernatant was collected. the scyllo-inositol concentration in the culture supernatant was measured. specifically, the scyllo-inositol concentration in the culture supernatant was assayed by hplc (detector: ri, column temperature: 70°c, flow rate: 1 ml/min,) linked to ks-g (guard column), sugar ks-801, and sugar ks-802 (all trade names, manufactured by showa denko k.k.). as a result of assay, an unprecedented scyllo-inositol concentration of 12.4 g/l was produced in the culture supernatant. on the other hand, virtually no myo-inositol which poses a problem in the refining step was present in the culture supernatant; its concentration was 0.1% or less. example 3: isolation and determination of structure of the scyllo-inositol derivative when the culture supernatant obtained in the scyllo-inositol production test using a jar fermenter in example 2 was analyzed by hplc (column: shodex asahipak nh 2 p-50 4e (trade name, manufactured by showa denko k.k.; mobile phase: water/acetonitrile = 25/75; flow rate: 0.8 ml/min, column temperature: 40°c; detection: ri), 1.4 g/l of scyllo-inositol derivative was produced together with 12.4 g/l of scyllo-inositol in the culture supernatant. the peak of this scyllo-inositol derivative was collected and used in the following studies. the structure of the compound separated was determined by nmr analysis as follows. instrument: avance 600 (manufactured by bruker biospin) probe: cryoprobe ( 13 c high sensitivity) measurement temperature: 18°c (all set at 291k (18°c) to prevent deterioration of the sample and to move the water signal during 1 h-nmr.) solvent: d 2 o (manufactured by aldrich) internal standard: tsp 1 h frequency: 600.13 mhz 13 c frequency: 150.92 mhz the results of measurement and assignment of peaks were as follows. furthermore, the peak number "gh-1" in the table shows the position 1 hydrogen of the glucose residue. "ih-1" shows the position 1 hydrogen of the scyllo-inositol residue. the others are also the same. table-tabl0004 [table 4] 1 h-nmr peak no. δ h (ppm) peak splitting pattern j (hz) gh-1 4.75 d 7.9 gh-2 3.35-3.39 dd 7.9, 9.3 gh-3 3.53 dd 9.3, 9.3 gh-4 3.41 dd 9.4, 9.4 gh-5 3.48 m 9.4, 1.9, 6.0 gh-6 3.92 dd 1.9, 12.5 gh-6' 3.73 dd 12.5, 6.0 ih-1 3.62 dd 9.3, 9.3 ih-2 3.56 dd -- ih-3 3.35-3.39 -- -- ih-4 3.35-3.39 -- -- ih-5 3.35-3.39 -- -- ih-6 3.45 dd 9.1, 9.1 table-tabl0005 [table 5] 13 c-nmr peak no. δ c (ppm) gc-1 105.74 gc-2 76.35 gc-3 78.43 gc-4 72.40 gc-5 78.89 gc-6 63.51 ic-1 84.92 ic-2 76.30 ic-3 76.09 ic-4 76.17 ic-5 76.17 ic-6 74.86 the above 1 h-nmr and 13 c-nmr are shown in figures 5 and 6 , respectively. the assignment of peaks was also confirmed by cosy, ch-cosy, hmbc, and j-resolved two-dimensional nmr. example 4: enzymatic decomposition of the scyllo-inositol derivative the compound obtained in example 3 was decomposed by cellobiase (sigma), which is a β-glucosidase derived from mold of the genus aspergillus. specifically, the compound obtained in example 3 was dissolved in a concentration of 6 mg/ml in 400 µl of 150 mm bis-tris buffer (ph = 7.0). one hundred microliters of 25 u/ml cellobiase was added to the solution and reacted by incubating (1200 rpm, bioshaker m-bro22, taitec) up to 20 hours at 40°c. the reaction solution was sampled in hours 0, 3, and 20 of the reaction, and the reaction status was confirmed by hplc (column: shodex asahipak nh 2 p-50 4e (trade name: manufactured by showa denko k.k.), mobile phase: water/acetonitrile = 25/75, flow rate: 0.8 ml/min, column temperature: 40°c, detector: ri). as shown by the results in figure 7 , virtually all of the compound obtained in example 3, that is, the scyllo-inositol derivative described herein, decomposed from the start of the reaction to hour 3, and corresponding amounts of glucose and scyllo-inositol were produced. the scyllo-inositol derivative described herein decomposed completely from the start of the reaction to after 20 hours. the results proved that the scyllo-inositol derivative described herein is easily decomposed by β-glucosidase. this enzyme experiment also confirmed the correctness of the structure determined for the scyllo-inositol derivative described herein. industrial applicability the present invention can be utilized in the industrial fermentative production of scyllo-inositol. the novel scyllo-inositol derivative described herein is also useful in the industrial production of scyllo-inositol. when it is stated that the plasmids and microorganisms mentioned in this specification have been deposited, all were deposited with the (name of depository institution) "ipod national institute of technology and evaluation, patent microorganisms depositary (ipod, nite)"; (address of depository institution) central 6, 1-1 higashi 1-chome, tsukuba-shi, ibaraki-ken, 305-8566." sequence listing <110> asahi kasei chemicals corporation <120> method for producing scyllo-inositol <130> p105359ep <140> 13743267.0 <141> 2013-01-22 <150> jp 2012-020556 <151> 2012-02-02 <150> jp 2012-248490 <151> 2012-11-12 <160> 18 <170> patentin version 3.5 <210> 1 <211> 1602 <212> dna <213> saccharomyces cerevisiae <220> <221> cds <222> (1)..(1602) <400> 1 <210> 2 <211> 533 <212> prt <213> saccharomyces cerevisiae <400> 2 <210> 3 <211> 804 <212> dna <213> escherichia coli <220> <221> cds <222> (1)..(804) <400> 3 <210> 4 <211> 267 <212> prt <213> escherichia coli <400> 4 <210> 5 <211> 1035 <212> dna <213> bacillus subtilis <220> <221> cds <222> (1)..(1035) <400> 5 <210> 6 <211> 344 <212> prt <213> bacillus subtilis <400> 6 <210> 7 <211> 1077 <212> dna <213> bacillus subtilis <220> <221> cds <222> (1)..(1077) <400> 7 <210> 8 <211> 358 <212> prt <213> bacillus subtilis <400> 8 <210> 9 <211> 22 <212> dna <213> artificial sequence <220> <223> forward pcr primer for ino1 coding region <400> 9 atgacagaag ataatattgc tc 22 <210> 10 <211> 19 <212> dna <213> artificial sequence <220> <223> reverse pcr primer for ino1 coding region <400> 10 ttacaacaat ctctcttcg 19 <210> 11 <211> 155 <212> dna <213> artificial sequence <220> <223> promoter for ino1 coding sequence <400> 11 <210> 12 <211> 22 <212> dna <213> artificial sequence <220> <223> forward pcr primer for iolg coding region <400> 12 atgagtttac gtattggcgt aa 22 <210> 13 <211> 27 <212> dna <213> artificial sequence <220> <223> reverse pcr primer for iolg coding region <400> 13 ttagttttga actgttgtaa aagattg 27 <210> 14 <211> 21 <212> dna <213> artificial sequence <220> <223> forward pcr primer for iolw coding region <400> 14 atgataacgc ttttaaaggg g 21 <210> 15 <211> 20 <212> dna <213> artificial sequence <220> <223> reverse pcr primer for iolw coding region <400> 15 ttagtgctcc agcataatgg 20 <210> 16 <211> 18 <212> dna <213> artificial sequence <220> <223> forward pcr primer for suhb coding region <400> 16 atgcatccga tgctgaac 18 <210> 17 <211> 19 <212> dna <213> artificial sequence <220> <223> reverse pcr primer for suhb coding region <400> 17 ttaacgcttc agagcgtcg 19 <210> 18 <211> 109 <212> dna <213> artificial sequence <220> <223> promoter for suhb coding region <400> 18
069-965-675-854-819	JP	[ "JP", "US" ]	G06F15/173,G06F9/45,G06F9/46,G06F9/52	1995-10-27T00:00:00	1995	[ "G06" ]	parallel process scheduling method in parallel computer and processor for parallel computer	problem to be solved: to realize a cooperative scheduling without deteriorating the throughput performance of the system of a parallel computer at the time of executing one job as a parallel process while it is synchronized for respective steps by more than two processors in a parallel computer constituted by connecting plural processors so that they can mutually make communication. solution: when the parallel process in the middle of execution becomes a parallel synchronism waiting state, an inactivating means 4 makes the parallel process inactive and inhibits the allocation of the parallel process. an allocation function 6 allocates the process of the other job which can be executed. when a condition which is set by a condition setting function 5 during the execution of the other job is satisfied, an allocation generation function 7 generates an allocation signal for a processing during execution at present. an activating function 8 activates the parallel process in the parallel synchronism waiting state and resumes the allocation of the parallel process.	1. a parallel process scheduling method used in a parallel computer having plural processing apparatus for executing processes individually and a communication network for communicably connecting said plural processing apparatus to each other to execute a certain job as a parallel process in synchronization in each step by two or more processing apparatus among said plural processing apparatus, said parallel process scheduling method comprising the steps of: if each of said processing apparatus completes a process allocated in this step as said parallel process and gets into a parallel synchronization waiting state where said processing apparatus waits for another one or more processing apparatus to complete processes allocated in this step as the parallel process, in a processing apparatus in the parallel synchronization waiting state in respect to said parallel process, deactivating said parallel process in order to inhibit allocation of said parallel process, setting a condition that should be satisfied when allocation of said parallel process is resumed; allocating a process of another job if another job executable by said processing apparatus exists; and generating an interruption signal for a process in execution when said condition is satisfied to activate said parallel process so as to resume allocation of said parallel process. 2. the parallel process scheduling method used in a parallel computer according to claim 1, wherein if data is transferred from a transmitter side processing apparatus to a receiver side processing apparatus over said communication network in packet transmission/reception implemented asynchronously with a data processing operation in said parallel computer, in a processing apparatus in the parallel synchronization waiting state in respect to said parallel process, the number of packets to be transferred from said another processing apparatus executing said parallel process to said processing apparatus is counted by count-up or count-down by a counter; an expected value of a count value of said counter is set on the basis of the number of packets which are intended to be transferred to said processing apparatus from when said parallel process gets into the parallel synchronization waiting state to when said another processing apparatus complete a step of this time; and it is judged that said condition is satisfied if said expected value agrees with an actual counted value obtained by said counter to generate said interruption signal. 3. the parallel process scheduling method used in a parallel computer according to claim 2, wherein if plural jobs are executed separately as parallel processes, a process identifier corresponding to each job is set in a packet; said expected value is set for each process identifier and a region in which a count value by said counter is stored is ensured on a main storage for each process identifier in each processing apparatus; and counting by said counter, setting of said expected value and generating of said interruption signal are implemented for each of said process identifier in a processing apparatus being in the parallel synchronization waiting state in respect to said parallel process. 4. the parallel process scheduling method used in a parallel computer according to claim 1, wherein in said parallel computer, if data is transferred from a transmitter side processing apparatus to a receiver side processing apparatus over said communication network in packet transmission/reception implemented asynchronously with a data processing operation, the received data is stored in a message receiving queue that is a cyclic queue on a main storage according to an added value of a base address and a write pointer besides an indicated value of said write pointer is updated to be a leading address of the next free region in said message receiving queue when a message packet that is a packet of a specific type is received; in a processing apparatus in the parallel synchronization waiting state in respect to said parallel process, an expected value of an indicated value of said write pointer is set on the basis of information such as a data capacity and the like of all message packets that are intended to be transferred to said processing apparatus from when said parallel process gets into the parallel synchronization waiting state to when said another processing apparatus complete a step of this time; and if said expected value agrees with an actual indicated value of said write. pointer, if said expected value disagrees with an actual indicated value of said write pointer, or if an actual indicated value of said write pointer exceeds said expected value, it is judged that said condition is satisfied to generate an interruption signal for a process in execution. 5. the parallel process scheduling method used in a parallel computer according to claim 1, wherein if plural jobs are separately executed as parallel processes, a process identifier corresponding to each job is set in a message packet; said expected value and said base address are set for each of said process identifier, and said message receiving queue and said write pointer are provided for each of said process identifier in each processing apparatus; and data writing in said message receiving queue, updating of said write pointer, setting of said expected value and generating of said interruption signal are implemented for each of said process identifier in a process apparatus being in the parallel synchronization waiting state in respect to said parallel process. 6. the parallel process scheduling method used in a parallel computer according to claim 1, wherein in said parallel computer, if a state value of one or more bits representing whether each processing apparatus completes a process allocated in this step as said parallel process or not is transmitted and received among said plural processing apparatus, and a synchronization detecting mechanism for outputting a synchronization detection signal if detecting that state values from processing apparatus executing said parallel process are all in agreement is provided to each processing apparatus, in a processing apparatus being in the parallel synchronization waiting state in respect to said parallel process, it is judged that said condition is satisfied if the synchronization detection signal is outputted from said synchronization detecting mechanism to generate an interruption signal for a process in execution. 7. the parallel process scheduling method used in said parallel computer according to claim 6, wherein if plural jobs are separately executed as parallel processes, said synchronization detecting mechanism is provided for each parallel process in said each processing apparatus, synchronization detection by said synchronization detecting mechanism and generation of said interruption signal are implemented for each parallel process in a processing apparatus being in the parallel synchronization waiting state in respect to said parallel process. 8. a processing apparatus for a parallel computer communicably connected to another plural processing apparatus over a communication network to constitute a parallel computer for executing a certain job as a parallel process in synchronization with another one or more processing apparatus among said plural processing apparatus in each step, said processing apparatus comprising: a deactivating mechanism for deactivating said parallel process in order to inhibit allocation of said parallel process if said processing apparatus completes a process allocated in this step as said parallel process and gets into a parallel synchronization waiting state where said processing apparatus waits for said another one or more processing apparatus to complete processes allocated as said parallel process in this step; a condition setting mechanism for setting a condition that should be satisfied when allocation of said parallel process is resumed simultaneously with deactivation of said parallel process by said deactivating mechanism; an allocating mechanism for allocating a process of another job while said parallel process is in a deactivated state if another executable job exists; an interruption generating mechanism for generating an interruption signal for a process in execution if said condition is satisfied; and an activating mechanism for activating said parallel process in order to resume allocation of said parallel process according to the interruption signal from said interruption generating mechanism. 9. the processing apparatus for a parallel computer according to claim 8 further comprising a transfer processing unit for transferring data to said another plural processing apparatus over said communication network in packet transmission implemented asynchronously with a data processing operation; and wherein said interruption generating mechanism comprising: a counter for counting the number of packets transferred from said another one or more processing apparatus executing said parallel process by counting up or counting down the same if said parallel process gets into the parallel synchronization waiting state; an expected value register being set thereto an expected value of a count value obtained by said counter by said condition setting mechanism on the basis of the number of packets that are intended to be transferred from said another one or more processing apparatus from when said parallel process gets into the parallel synchronization waiting state to when said another one or more processing apparatus complete a step of this time; a comparator for comparing the expected value set in said expected value register with an actual counted value obtained by said counter; and an interruption generating circuit for generating said interruption signal according to a result of comparison by said comparator. 10. the processing apparatus for a parallel computer according to claim 9, wherein if plural jobs are separately executed as parallel processes, a process identifier corresponding to each job is set in a packet; and said expected value is set for each of said process identifier and a region in which a counted value by said counter is stored is ensured on a main storage for each of said process identifier. 11. the processing apparatus for a parallel computer according to claim 8 further comprising: a transfer processing unit for transferring data to said another plural processing apparatus over said communication network in packet transmission/reception implemented asynchronously with a data processing operation; if said transfer processing unit receives a message packet that is a packet of a specific type from said another one or more processing apparatus executing said parallel process, the received data being stored in a message receiving queue that is a cyclic queue on a main storage according to an added value of a base address and a write pointer, besides an indicated value of said write pointer being updated to be a leading address of the next free region in said message receiving queue; and wherein said interruption generating mechanism comprising: an expected value register being set thereto an expected value of an indicated value of said write pointer by said condition setting mechanism on the basis of information such as a data capacity and the like of all message packets that are intended to be transferred from said another one or more processing apparatus from when said parallel process gets into the parallel synchronization waiting state to when said another one or more processing apparatus complete a step of this time; a comparator for comparing the expected value set in said expected value register with an actual indicated value of said write pointer; and an interruption generating circuit for generating said interruption signal according to a result of comparison by said comparator. 12. the processing apparatus for a parallel computer according to claim 11 wherein if plural jobs are separately executed as parallel processes, a process identifier corresponding to each job is set in a message packet, and said expected value and said base address are set for each of said process identifier besides said message receiving queue and said write pointer are provided for each of said process identifier. 13. the processing apparatus for a parallel computer according to claim 8 further comprising: a state communicating unit for transmitting/receiving a state value of one or more bits representing whether a process allocated as said parallel process in this step is completed or not to/from said another plural processing apparatus; and a synchronization detecting mechanism for outputting a synchronization detection signal if detecting that state values of all processing apparatus executing said parallel process obtained through said state communicating unit agree with each other; said condition setting mechanism setting that the synchronization detection signal is outputted from said synchronization detecting mechanism as said condition; said interruption generating mechanism being accomplished by said synchronization detecting mechanism, and the synchronization detection signal from said synchronization detecting mechanism being used as said interruption signal. 14. the processing apparatus for a parallel computer according to claim 13, wherein if plural jobs are separately executed as parallel processes, said synchronization detecting mechanism is provided for each of said parallel processes.	background of the invention 1) field of the invention the present invention relates to a parallel process scheduling method applied when a certain job is executed by two or more processing apparatus while being synchronized in each step in a parallel computer configured with plural processing apparatus �hereinafter referred as pes (processor elements)! communicably connected to each other, and a processing apparatus applied this method thereto. in particular, the present invention relates to a technique suitable for use in a parallel computer of a distributed main storage mimd (multiple instruction stream multiple data stream) type which implements plural tasks in parallel by plural pes. 2) description of the related art in recent years, the necessity to process enormous data at a high speed as in a numerical computation, image processing or the like requires a high-speed or large-capacity computer system. accompanying this, there have been searched and developed a parallel processing technique using plural pes to process in parallel while the plural pes communicate with each other. in a parallel computer system, n pes (assuming that #0 through n-1 are given as pe numbers to the pes. respectively) 101 are, in general, communicably connected to each other over an inter-pe coupling network 100 as a communication network as shown in fig. 9, for example. each of the pes 101 has a transfer processing unit 102, an instruction processing unit (cpu) 103 and a main storage 104 as shown in fig. 10. the transfer processing unit 102 performs a transmitting/receiving process on data on the main storage 104. the instruction processing unit 103 performs a programing process upon communication among the pes 101. the transfer processing unit 102 and the instruction processing unit 103 are separately provided as above, thereby cutting a load on and an overhead of the instruction processing unit 103. the transfer processing unit 102 is so configured as to perform a transmitting process and a receiving process concurrently and in parallel, thereby improving a data transfer speed and a data transfer efficiency. in a parallel computer of a distributed main storage mimd type, one job is generally executed as a process in parallel (hereinafter referred as a parallel process) by plural different pes 101. a job such executed is called a parallel job. further, a multiple executing function for plural parallel jobs, or a multiple executing function for a parallel job and a non-parallel job is demanded in recent years. if plural parallel jobs (or a parallel job and a non-parallel job) are executed in a multiplex fashion in a system, it is necessary to schedule processes on each pe 101 to implement a process switching (a switching of processes). if the parallel process is scheduled without coordinating the plural pes 101 at that time, there rises a problem that a wait time for synchronization of the parallel process due to microscopic differences in executing time of the parallel process increases. to avoid an increase of the synchronization wait time, it is necessary to coordinately schedule the plural pes 101, that is, to implement an inter-pe coordinate scheduling, in a scheduling of a parallel process. fig. 11 shows an example of a general parallel process scheduling if only one parallel job is being executed in a system. in the example shown in fig. 11, one job is being executed in parallel as five processes given process numbers 0 through 4, respectively, on five pes 101. each of the processes is being executed in synchronization with each other in each step as indicated by synchronous points 1 and 2. on the other hand, fig. 12 shows an example where a synchronous scheduling called a gang scheduling is implemented as an inter-pe coordinate scheduling for a parallel process. in the example shown in fig. 12, one job is being executed in parallel as five processes given process numbers 0 through 4, respectively, on five pes 101. each of the processes is being executed in synchronization with each other in each step as shown by synchronous points 1 and 2, similarly to the example shown in fig. 11. according to the gang scheduling, all parallel processes are simultaneously allocated with reception of a broadcasted process switch instruction or with that timers synchronized with each other in the pes 101 show a due time as an opportunity. in the example shown in fig. 12, processes (omitted in fig. 12) of another parallel job or non-parallel job are dispatched (allocation) in each time slice. according to such synchronous scheduling, an increase of the synchronous overhead among processes due to a process switching of parallel processes does not occur. in addition, a performance can be improved by a factor of a rate of executing time of a parallel job per unit time as compared with a case where only one parallel job is operated in the system as shown in fig. 11. in figs. 11 and 12, t shows a time slice, ".smallcircle." hows a point of time at which each of the processes gets into a parallel synchronization waiting state (that is, a point of time at which a process allocated in this step has been just completed), and ".circle-solid." shows a point of time at which parallel synchronization (barrier) is detected in each pe 101 executing each process (that is, a point of time at which every pe 101 executing this parallel process has just completed a process allocated in this step). a thick line in the horizontal direction shows a period during which a process is actually executed, and a thin line in the horizontal direction shows that a process is in the parallel synchronization waiting state. as shown by the thin line, each process is dispatched (allocation) to each slice time until parallel synchronization is detected even if it is in the parallel synchronization waiting state and no process is actually executed. according to the parallel process scheduling shown in either fig. 11 or 12, each process is dispatched to each time slice until parallel synchronization is detected even if it is in the synchronization waiting state and no process is actually executed. in consequence, there is a problem that a time lice is given to a parallel process being in the parallel synchronization waiting state even if there exists another executable process so that a throughput performance of an entire system degrades if there is a difference in process time of each parallel process. summary of the invention in the light of the above problem, an object of the present invention is to realize a coordinate scheduling which does not dispatch a parallel process in the parallel synchronization waiting state but dispatches another executable job process so as to prevent a throughput performance of the system from degrading. the present invention therefore provides a parallel process scheduling method used in a parallel computer having plural processing apparatus for executing processes individually and a communication network for communicably connecting the plural processing apparatus to each other to execute a certain job as a parallel process in synchronization in each step by two or more processing apparatus among the plural processing apparatus, the parallel process scheduling method comprising the steps of, if each of the processing apparatus completes a process allocated in this step as the parallel process and gets into a parallel synchronization waiting state where said processing apparatus waits for another more than one or more processing apparatus to complete processes allocated in this step as the parallel processes, in a processing apparatus in the parallel synchronization waiting state in respect to the parallel process, deactivating the parallel process in order to inhibit allocation of the parallel process, setting a condition that should be satisfied when allocation of the parallel process is resumed, allocating a process of the another job if the another job executable by the processing apparatus exists, and generating an interruption signal for a process in execution when said condition is satisfied to activate the parallel process so as to resume allocation of the parallel process. the present invention also provides a processing apparatus for a parallel computer communicably connected to another plural processing apparatus over a communication network to constitute a parallel computer for executing a certain job as a parallel process in synchronization with another one or more processing apparatus among the plural processing apparatus in each step, the processing apparatus comprising a deactivating mechanism for deactivating the parallel process in order to inhibit allocation of the parallel process if the processing apparatus completes a process allocated in this step as the parallel process and gets into a parallel synchronization waiting state where the processing apparatus waits for the one or more processing apparatus to complete processes allocated as the parallel process in this step, a condition setting mechanism for setting a condition that should be satisfied when allocation of the parallel process is resumed simultaneously with deactivation of the parallel process by the deactivating mechanism, a allocating mechanism for allocating a process of another job while the parallel process is in a deactivated state if another executable job exists, an interruption generating mechanism for generating an interruption signal for a process in execution if the condition is satisfied, and an activating mechanism for activating the parallel process in order to resume allocation of the parallel process according to the interruption signal from the interruption generating mechanism. according to a parallel process scheduling method used in a parallel computer and a processing apparatus for a parallel computer according to this invention, a coordinate scheduling such that a process of another executable job is dispatched instead of a parallel process being in the parallel synchronization waiting state in a multiple job environment where plural parallel jobs are concurrently executed or a parallel job and a non-parallel job are concurrently executed becomes possible so that a throughput performance of a parallel computer in such multiple job environment may be largely improved. brief description of the drawings fig. 1 is a block diagram showing an aspect of this invention; fig. 2 is a block diagram showing an entire structure of a parallel computer to which a parallel process scheduling method according to an embodiment of this invention is applied; fig. 3 is a diagram for illustrating a function of the embodiment; fig. 4 is a block diagram showing a structure of an essential part of a processing apparatus for a parallel computer according to a first embodiment of this invention; fig. 5 is a flowchart for illustrating an operation of the processing apparatus for a parallel computer according to the first embodiment; fig. 6 is a block diagram showing a structure of an essential part of a processing apparatus for a parallel computer according to a second embodiment of this invention; fig. 7 is a flowchart for illustrating an operation of the processing apparatus for a parallel computer according to the second embodiment; fig. 8 is a block diagram showing a structure of an essential part of a processing apparatus for a parallel computer according to a third embodiment of this invention; fig. 9 is a block diagram showing a structure of a general parallel computer system; fig. 10 is a block diagram showing a structure of a general processing apparatus for a parallel computer; fig. 11 is a diagram showing an example of a general parallel process scheduling; and fig. 12 is a diagram showing an example where a gang scheduling is implemented as an inter-pe coordinate scheduling for parallel processes. description of the preferred embodiments (a) description of an aspect of the present invention fig. 1 is a block diagram showing an aspect of the present invention. as shown in fig. 1, a parallel computer 1 to which a parallel process scheduling method of this invention is applied has plural processing apparatus (hereinafeter referred as pes) for executing processes individually, and a communication network 3 for communicably connecting the plural pes 2 to each other. in the parallel computer 1, a certain job is executed as parallel processes in synchronization in each step by two or more pes 2 among the plural pes 2. each of the pes 2 has a deactivating mechanism 4, a condition setting mechanism 5, an allocating mechanism 6, an interruption generating mechanism 7 and an activating mechanism 8. the deactivating mechanism 4 is a mechanism for deactivating a parallel process in order to inhibit allocation of the parallel process if its own pe 2 completes a process allocated in this step as the parallel process and gets into a parallel synchronization waiting state where its own pe waits for another pes 2 to complete processes allocated in this step as the parallel process. the condition setting mechanism 5 is a mechanism for setting a condition that should be satisfied when allocation of the parallel process is resumed simultaneously with deactivation of the parallel process by the deactivating mechanism 4. the allocating mechanism 6 is a mechanism for allocating a process of another job while the parallel process is in a deactivated state if another executable job exists. the interruption generating mechanism 7 is a mechanism for generating an interruption signal for a process in execution if the condition set by the condition setting mechanism 5 is satisfied. the activating mechanism 8 is a mechanism for activating the parallel process in order to resume allocation of the parallel process according to an interruption signal from the interruption generating mechanism 7. in the pe 2 having the above mechanisms 4 through 8 described above, if a parallel process in execution gets into the parallel synchronization waiting state, the deactivating mechanism 4 deactivates the parallel process so as to inhibit allocation of the parallel process. if another executable job exists instead of this parallel process, the allocating mechanism 6 allocates a process of this another job. if the condition set by the condition setting mechanism 5 is satisfied during execution of this another job, the interruption generating mechanism 7 generates an interruption signal for the process in execution, after that, the activating mechanism 8 activates the parallel process in the parallel synchronization waiting state to resume allocation of this parallel process. as above, a parallel process in the parallel synchronization waiting state is not dispatched. instead of that, a process of another executable job is dispatched, then allocation of the parallel process is resumed when a predetermined condition is satisfied to perform a process in the next step, whereby a coordinate scheduling for a parallel process is realized. there are three kinds of techniques of realizing the interruption generating mechanism 7 as described in items �1! through �3! below. �1! interruption generating mechanism according to the number of transferred packets if a transfer processing unit for transferring data is provided in each pe 2 in the parallel computer 1 in order to transfer data (a packet) to a receiver side pe 2 from a transmitter side pe 2 over the communication network 3 in packet transmission implemented asynchronously with a data processing operation, the interruption generating mechanism 7 may be configured with a counter, an expected value register, a comparator and an interruption generating circuit. the counter counts the number of packets transferred from another pes 2 executing a parallel process by counting up or counting down the same when the parallel process gets into the parallel synchronization waiting state. the expected value register is set thereto an expected value of a count value obtained by the counter by the condition setting mechanism 5 on the basis of the number of packets which are intended to be transferred from another pes 2 from when the parallel process gets into the parallel synchronization waiting state to when another pes 2 complete a step of this time. the comparator compares an expected value set in the expected value register with an actual count value counted by the counter. the interruption generating circuit generates the interruption signal according to a result of comparison by the comparator. in the pe 2 having the interruption generating mechanism 7 with the above structure, if a parallel process in execution gets into the parallel synchronization waiting state, the number of packets transferred from another pes 2 to own pe 2 executing the parallel process is counted by count-up or count-down by the counter. if the comparator detects that an actual count value obtained by the counter and an expected value set in the expected value register set by the condition setting mechanism 5 agree with each other, the interruption generating circuit generates an interruption signal. in other words, it is possible to accomplish the interruption generating mechanism 7 with that the number of transferred packets reaches the expected value as a condition to resume allocation of the parallel process (a condition to release the parallel synchronization waiting state). if plural jobs are individually executed as parallel processes on the parallel computer 1, a process identifier corresponding to each job is set in a packet, an expected value is set for each process identifier in each pe 2, a region in which a count value obtained by the counter is stored is ensured on the main storage for each process identifier, and counting by the counter, setting of an expected value and generation of an interruption signal are implemented for each process identifier, thereby deactivating/activating the parallel process for each job. �2! interruption generating mechanism according to a quantity of received message packets in the parallel computer 1, each of the pes 2 is provided with a transfer processing unit for transferring data (a packet) in order to transfer data from the transmitter side pe 2 to the receiver side pe 2 over the communication network 3 in packet transmission implemented asynchronously with a data processing operation. when receiving a message packet which is a packet of a specific type from another pe 2 executing the parallel process, the transfer processing unit stores the received data in a message receiving queue that is a cyclic queue on the main storage according to an added value of a base address and a write pointer, besides updating an indicated value of the write pointer to make it be a leading address of the next free region of the message receiving queue. at this time, the interruption generating mechanism 7 may be configured with an expected value register, a comparator and an interruption generating circuit. the expected value register is set thereto an expected value of an indicated value of the write pointer of the transfer processing unit by the condition setting mechanism 5 on the basis of information such as a data capacity and the like of all message packets that are intended to be transferred from another pes 2 from when the parallel process gets into the parallel synchronization waiting state to when another pes 2 complete a step of this time. the comparator compares an expected value set in the expected value register with an actually indicated value of the write pointer. the interruption generating circuit generates the interruption signal according to a result of comparison by the comparator. in the pe 2 having the interruption generating mechanism 7 with the above structure, if a parallel process in execution gets into the parallel synchronization waiting state and the pe 2 receives a message packet from another pe 2 executing the parallel process, the received data is stored in the message receiving queue that is a cyclic queue on the main storage according to an added value of a base address and a write pointer. in addition, an indicated value of the write pointer is updated to be a leading address of the next free region in the message receiving queue. if the comparator detects that the actually indicated value of the write pointer agrees with the expected value set in the expected value register by the condition setting mechanism 5, the expected value disagrees with the actually indicated value, or the actually indicated value exceeds the expected value, the interruption generating circuit generates an interruption signal. in other words, the interruption generating mechanism 7 may be accomplished with that a quantity of received message packets reaches the expected value as a condition to resume allocation of the parallel process (a condition to release the parallel synchronization waiting state). if plural jobs are executed as parallel processes separately on the parallel computer 1, a process identifier corresponding to each job is set in a packet, an expected value and a base address are set for each process identifier, the message receiving queue and the write pointer are provided for each process identifier, and data writing to the message receiving queue, updating of the write pointer, setting of the expected value and generation of the interruption signal are implemented for each process identifier in each pe 2, thereby deactivating/activating the parallel process. �3! interruption generating mechanism according to synchronization detection (barrier detection) if each of the pes 2 is provided with a state communicating unit for transmitting/receiving a state value of one or more bits representing whether each of the pes 2 completes a process allocated in this step as the parallel process or not among the plural pes 2, and a synchronization detecting mechanism for outputting a synchronization detection signal if detecting that state values from pes executing the parallel process obtained through the state communicating unit all agree with each other, the condition setting mechanism 5 sets that a synchronization detection signal is outputted from the synchronization detecting mechanism as the condition so that the interrupting generating mechanism 7 is realized with the synchronization detecting mechanism by using the synchronization detection signal from the synchronization detecting mechanism as the interruption signal. in the pe 2 having the interruption generating mechanism 7 with the above structure, the synchronization detection mechanism of the pe 2 outputs a synchronization detection signal as an interruption signal of the interruption generating mechanism 7 after the parallel process in execution has got into the parallel synchronization waiting state. in other words, the interruption generating mechanism 7 may be accomplished with synchronization detection (barrier detection) of each pe 2 as a condition to resume allocation of the parallel process. if plural jobs are executed as parallel processes separately on the parallel computer 1, a process identifier corresponding to each job is set in a packet, the synchronization detecting mechanism realizing the interruption generating mechanism 7 is provided for each process identifier, and synchronization detection by the synchronization detecting mechanism and generation of an interruption signal are implemented for each process identifier, thereby deactivating/activating the parallel process for each job. according to the parallel process scheduling method used in the parallel computer 1 and the processing apparatus 2 for a parallel computer according to this invention, a coordinate scheduling to dispatch a process of another executable job instead of a parallel process in the parallel synchronization waiting state becomes feasible in a multiple job environment where plural parallel jobs are concurrently executed or a parallel job and a non-parallel job are concurrently executed, as described above. it is therefore possible to largely contribute to an improvement of a throughput performance of the parallel computer 1 in such multiple job environment. an interruption signal is generated with that the number of transferred packets reaches an expected value, a quantity of received message packets reaches an expected value or synchronization is detected as a condition to release the parallel synchronization waiting state (a interruption generating condition) to resume allocation of the parallel process to proceed to the next step, whereby the parallel process may be executed as usual. by generating interruption for each process identifier corresponding to each job, it is possible to deactivate/activate the parallel process for each job even if plural jobs are executed as parallel processes separately on the parallel computer 1. (b) description of a parallel computer according to embodiments fig. 2 is a block diagram showing an entire structure of a parallel computer to which a parallel process scheduling method according to an embodiment of the present invention is applied. as shown in fig. 2, a parallel computer 10 according to this embodiment has n pes (given pe numbers #0 through #n-1, respectively) 11 individually executing processes, and an inter-pe coupling network 12 communicably connecting these pes 11 to each other, similarly to that shown in fig. 1. one job is executed as a parallel process while being synchronized in each step by two or more pes 11 among the n pes 11. each pe 11 has at least a transfer processing unit 13, a cpu 14 and a main storage 15, as inscribed in blocks of the pe 11 given a pe number #0 in fig. 2. in fig. 2, an inside of only the pe 11 given a pe number #0 is shown, but another pes 11 of pe numbers #1 through #n-1 are, of course, configured similarly and have various mechanisms described later. the transfer processing unit 13 performs a transmitting/receiving process on data on the main storage 15 to transfer data to another pe 11 over the inter-pe coupling network 12 in packet transmission in asynchronization with a data processing operation by the cpu 14. the transfer processing unit 13 (or a synchronization detecting mechanism 61, which will be described later in a third embodiment, of the pe 11) is provided with an interruption generating mechanism 24 described later. a detailed structure or an operation of the transfer processing unit 13 (a structure of the interruption generating mechanism 24, in particular) will be described later with reference to figs. 4 through 8. the cpu 14 performs a data processing operation (an actual executing operation of a parallel process) on the basis of various data, programs and the like on the main storage 15, besides making a data transfer instruction to the transfer processing unit 13. the cpu 14 has a deactivating mechanism 21, a condition setting mechanism 22, an allocating mechanism 23 and an activating mechanism 25. the deactivating mechanism 21 deactivates a parallel process in order to inhibit allocation of the parallel process if its own pe completes a process allocated in this step as the parallel process and gets into a parallel synchronization waiting state where the pe 11 waits for another pes 11 to complete processes allocated in this step as the parallel process. the condition setting mechanism 22 is a mechanism for setting a condition (a condition to release the parallel synchronization waiting state) that should be satisfied when an allocation of the parallel process is resumed simultaneously with deactivation of the parallel process by the deactivating mechanism 21. the allocating mechanism 23 is a mechanism for allocating a process of another job while the parallel process is in a deactivated state if there is another executable job. the interruption generating mechanism 24 is a mechanism for generating an interruption signal to a process in execution if a condition set by the condition setting mechanism 22 is satisfied. the activating mechanism 25 is a mechanism for activating the parallel process according to an interrupt signal from the interruption generating mechanism 24 in order to resume allocation of the parallel process. incidentally, the deactivating mechanism 21, the condition setting mechanism 22, the allocating mechanism 23 and the activating mechanism 25 are actually mechanisms realized by a supervisor that is a fundamental part of an os (operating system) as will be described later. here, the supervisor is a program resident in the main storage 15 to control mechanisms for time sharing, input/output, multiprogramming and the like, which is an os in a narrow sense. next description will be of an operation (that is, a parallel process scheduling method according to this embodiment) of each pe 11 with the above structure. if a parallel process now executed by the cpu 14 gets into the parallel synchronization waiting state in each pe 11, a system call representing that the parallel process has got into the parallel synchronization waiting state is issued accompanied with the above condition from the parallel process. the supervisor having received the system call sets parameters of the transfer processing unit 13 (the interruption generating mechanism 24) in order to cause the interruption generating mechanism 24 to generate an interruption signal when the notified condition is established, at the same time, shifting the parallel process now in the parallel synchronous waiting state into in a deactivated state so as to prevent the parallel process from being dispatched (the above is by the deactivating mechanism 21 and the condition setting mechanism 22). in the cpu 14, the allocating mechanism 23 allocates a process of another job (another parallel job or non-parallel job) if there is any executable job excepting the parallel process in the parallel synchronization waiting state. if the above condition set on the side of the transfer processing unit 13 (or the synchronization detecting mechanism 61) by the condition setting mechanism 5 establishes during execution of another job, an interruption signal to a process in execution is generated by the interruption generating mechanism 24 and outputted to the cpu 14. the supervisor notified the interruption signal activates the parallel process being in the parallel synchronization waiting state (by the activating mechanism 25) to resume dispatch of the parallel process. fig. 3 is a diagram illustrating a function of this embodiment. fig. 3 corresponds to the gang scheduling described hereinbefore and shown in fig. 12. in an example shown in fig. 3, a parallel job is being executed in parallel as five processes given process numbers 0 through 4, respectively, on five pes 11 similarly to the example shown in fig. 12. each of the processes is synchronously executed in each step as indicated by synchronous points 1 and 2. in fig. 3, t represents a time slice, ".smallcircle." represents a point of time at which each process gets into the parallel synchronization waiting state and issues a system call (that is, a point of time at which a process allocated in this step is just completed), and ".circle-solid." represents a point of time at which the condition establishes in each of the pes 11 so that an interruption signal is generated by the interruption generating mechanism 24. a thick line in a horizontal direction shows a period for which a process is actually in execution. the scheduling method according to this embodiment shown in fig. 3 differs from the general scheduling method shown in fig. 12 in a point that thin lines in a horizontal direction shown in fig. 12 are omitted. namely, each process is heretofore dispatched to each time slice until parallel synchronization is detected even in a state where the process is in the parallel synchronization waiting state and no process is actually being executed. according to this embodiment, a parallel process in the parallel synchronization waiting state is not dispatched, whereby it is possible to dispatch another process to a time slice becoming newly free of the cpu 14 until the condition establishes. as a result, in a multiple job environment where plural parallel jobs are concurrently executed or a parallel job and a non-parallel job are concurrently executed, a coordinate scheduling such as to dispatch a process of another executable job instead of a parallel process in the parallel synchronization waiting state becomes possible so that a throughput performance of the parallel computer 10 in such multiple job environment may be largely improved. fig. 3 shows an example where this invention is applied to a gang scheduling. it is however possible to apply this invention to the general parallel process scheduling shown in fig. 11 in a manner similar to the above, by which a function and an effect the same as those of this embodiment are available, needless to say. next, three embodiments realizing the interruption generating apparatus 24 in each pe will be described in detail with reference to figs. 4 through 8. (c) description of a processing apparatus for a parallel computer according to a first embodiment fig. 4 is a block diagram showing a structure of an essential, part of a processing apparatus for a parallel computer according to a first embodiment of this invention. in fig. 4, there are shown in detail a receiving system in the transfer processing unit 13 and the interruption generating mechanism 24 added to the receiving system. however, a transmitting system originally provided to the transfer processing unit 13 is omitted in fig. 4. in fig. 4, reference numeral 16 denotes a main storage access control unit for the cpu 14. the main storage access control unit 16 accesses to the main storage 15 according to an instruction from the cpu 14 to control data transfer from the main storage 15 to the cpu 14 or data transfer from the cpu 14 to the main storage 15. in fig. 4, reference numeral 30 denotes a main storage access control unit constituting a part of the transfer processing unit 13. the main storage access control unit 30 accesses to the main storage 15 according to an instruction from the receiving system and the transmitting system of the transfer processing unit 13 to control data transfer from the main storage 15 to the transmitting system or data transfer from the receiving system to the main storage 15. further, a function to set data to various registers (described later) in the interruption generating mechanism 24 is provided as an address decoder 30a to the main storage access control unit 30. as shown in fig. 4, the receiving system of the transfer processing unit 13 of the pe 11 according to the first embodiment has a command register 31, a decoder 32, a control circuit 33, an input buffer 34, an address register 35 and an address generating circuit 36. the command register 31 temporarily retains a transfer command (a command code) included in a header of a received packet when receiving data from the inter-pe coupling network 12. the decoder 32 analyzes a command code retained in the command register 31. the control circuit 33 controls each part of the receiving system on the basis of a result of the analysis by the decoder 32. the input buffer 34 temporarily retains a packet received from the transmitter side pe 11 over the inter-pe coupling network 12. data of the packet body retained in the input buffer 34 is combined with an address indicated in the address register 35 as will be described later with reference to a flowchart shown in fig. 5 to be successively stored in the main storage 15 via the main storage access control unit 30. the address register 35 temporarily retains an address on the main storage 15 in which the packet body retained in the input buffer 34 should be written. in the address register 35, address data designated by a header of the received packet (a packet body address date) is retained, thereafter address data generated by the address generating circuit 36 is retained. when the address data designated by the header is set in the address register 35, the address generating circuit 36 adds one data store byte length to an address value set in the address register 35 each time data is written from the input buffer 34 in the main storage 15. a result of the addition is set in the address register 35. the adding process by the address generating circuit 36 is performed until reception (writing) of the packet body is completed. the interruption generating mechanism 24 is added to the receiving system of the above-mentioned transfer processing unit 13. the interruption generating mechanism 24 in the pe 11 according to the first embodiment is realized with a counter address register 41, a counter value register 42, a decrementer 43, a counter expected value register 44, a comparator 45 and an interruption generating circuit 46 as shown in fig. 4. the counter address register 41 retains a receive counter address designated by a header of a received packet. according to the first embodiment, the number of packets transferred from another pes 11 in respect to the parallel process getting into the parallel synchronization waiting state is counted as will be described later. a receive counter address retained in the counter address register 41 designates an address on the main storage 15 in which a result of the count (a count value) should be stored. the count value register 42 retains a count value read out from the receive counter address on the main storage 15 (the address retained in the counter address register 41) via the main storage access control unit 30 each time a packet in respect to the parallel process getting into the parallel synchronization waiting state is received. the decrementer 43 subtracts 1 from a count value retained in the count value register 42. a result of the subtraction is outputted to the comparator 45, besides written in the receive counter address on the main storage 15 via the main storage address control unit 30. a result of the subtraction obtained by the decrementer 43 is written in a receive counter address on the main storage 15 as above, thereby updating a count value that is information about the number of received packets in respect to the parallel process having got into the parallel synchronization waiting state. according to the first embodiment, the above-mentioned counter address register 41, counter value register 42 and decrementer 43 realize a function as a counter for counting the number of packets transferred from another pes 11 executing a parallel process in the parallel synchronization waiting state by counting down the same. the counter expected value register 44 is set thereto a predetermined counter expected value by the condition setting mechanism 22 of the above-mentioned cpu 14 (the supervisor) through the main storage access control unit 30 (the address decoder 30a) when the parallel process now in process gets into the parallel synchronization waiting state. the counter expected value is set on the basis of the number of packets that will be transferred from another pes 11 from when the pe 11 gets into the parallel synchronization waiting state to when another pes 11 complete a step of this time. for instance, if a count value at a receive counter address on the main storage 15 is "8" and the number of packets that will be received from when the pe 11 gets into the parallel synchronization waiting state is "6", "2" is set as the predetermined counter expected value. the comparator 45 compares a counter expected value set in the counter expected value register 44 with an output value (an actual count value) of the decrementer 43, and outputs a coincidence signal �a signal becoming "0" (a low level) in the case of disagreement, and "1" (a high level) in the case of agreement! when these values coincide with each other. the interruption generating circuit 46 generates an interruption signal to the cpu 14 (the supervisor) according to a result of the comparison by the comparator 45. the interruption generating circuit 46 has an interruption holding register 47, an interruption generation masking register 48 and an and gate 49. the interruption holding register 47 retains a coincidence signal from the comparator 45, and outputs the held signal to the and gate 49. the interruption generation masking register 48 is set thereto mask information used to set in advance whether an interruption is generated or not from the cpu 14 side, and outputs the set information to the and gate 49. as the mask information, "1" is set if an interruption is generated, or "0" is set if an interruption is not generated (that is, if a signal from the interruption holding register 47 is masked). the and gate 49 calculates a logical product of a signal from the interruption holding register 47 and a signal from the interruption generation masking register 48, and outputs the result as an interruption generating signal to the cpu 14. more specifically, when a coincidence signal from the comparator 45 rises so as to cause a signal retained in the interruption holding register 47 to be "1" if "1" is set as the mask information in the interruption generation masking register 48, an interruption generating signal that is to be outputted to the cpu 14 from the and gate 49 rises and becomes "1" so that an interrupting process is performed in the cpu 14. next, an operation of the cpu 11 according to the first embodiment will be described with reference to a flowchart (steps s1 through s16) in fig. 5. for the purpose of describing an operation of, in particular, the interruption generating mechanism 24, a description will be now made of operations of the receiving system of the transfer processing unit 13 and the interruption generating mechanism 24 if the pe 11 receives a packet about a certain parallel process from another pe 11 after the pe 11 has got into the parallel synchronization state in respect to the parallel process. assuming here that a predetermined counter expected value has been already set in the counter expected value register 44 by the condition setting mechanism 22 of the cpu 14 (the supervisor). the inter-pe coupling network 12 always grasps the number of free words in the input buffer 34 of each pe 11 connected to the inter-pe coupling network 12 (step s1). if a packet whose destination (a receiver side pe) is a predetermined pe 11 exists and the input buffer 34 of the receiver side pe 11 is free (step s2), the inter-pe coupling network starts transferring a packet accompanied with a packet transmission start signal at the first word (step 3), and transfers an entire of the packet to the receiver side pe 11 depending on a state of freedom of the input buffer 34 of the receiver side pe 11 (step s4). a process at step s4 is repeated until the transfer of one packet is completed (until a judgement at step s5 becomes yes). if the transfer of the packet is completed, the procedure returns to step s1. when the transfer of a packet from the inter-pe coupling network 12 to the receiver side pe 11 is initiated at steps 3 and 4, the receiver system within the transfer processing unit 13 of the receiver side pe 11 reads the packet so long as the input buffer 34 is free (step s6). at this time, each designating data is read into the corresponding register 31, 35 or 41 at a timing that each designating data in the packet header flows. more specifically, a command code is read into the command register 31, a packet body address date is read into the address register 35, and a receive counter address is read into the counter address register 41 (step s7). the command code read in the command register 31 at step s7 is decoded by the decoder 32, then a signal used to control a packet receiving/storing method is generated by the control circuit 33 (step s8). the receiving system of the transfer processing unit 13 combines an address set in the address register 35 and packet data from the input buffer 34, sends it to the main storage access control unit 30, then stores the packet body in a designated address on the main storage 15 via the main storage access control unit 30 (step s9). when the packet data is stored once at step s9, the address generating circuit 36 adds one data store byte length to an address value of the address register 35, and sets the result in the address register 35 (step s10). the processes at steps s9 and s10 are repeated until the entire packet body is received (until a judgement at step s11 becomes yes). when receiving the entire packet body, the receiving system of the transfer processing unit 13 sends an address retained in the counter address register 41 to the main storage access control unit 30, reads a count value of the parallel process from the address on the main storage 15, and sets it in the count value register 42 (step s12). a count value set in the count value register 42 is subtracted 1 by the decrementer 43. after that, a result of the subtraction (a new count value) is sent to the main storage access control unit 30 as data along with data retained in the counter address register 41 as an address. whereby, the result of the subtraction obtained by the decrementer 43 is written in the receive counter address on the main storage 15, and a count value that is information about the number of received packets in respect to a parallel process having got into a parallel synchronization waiting state is updated (step s13). the comparator 45 compares a counter expected value set in the counter expected value register 44 with an output value (an actual count value) of the decrementer 43 simultaneously with that the result of the subtraction obtained by the decrementer 43 is written in the main storage 15. if these values agree with each other (if a judgement at step s14 becomes yes), a coincidence signal from the comparator 45 rises so that "1" is set in the interruption holding register 47 (step s15). if "1" is set as the mask information in the interruption generation masking register 48 at this time, an interruption signal "1" that should be outputted from the interruption generating circuit 46 (the and gate 49) to the cpu 14 rises and becomes "1" (step s16) so that an interrupting process is performed in the cpu 14. after completion of the process at step s16 or if comparison by the comparator 45 results in disagreement (if a judgement at step s14 is no), the receiving system of the transfer processing unit 13 gets into a reception waiting state. in the pe 11 according to the first embodiment, if a parallel process in execution gets into the parallel synchronization waiting state, the number of packets transferred from another pes 11 to own pe 11 executing the parallel process is counted by count-down. if the comparator 45 detects that the actual count value coincides with an expected value set in the counter expected value register 44 by the condition setting mechanism 22, an interruption signal is generated by the interruption generating circuit 46. namely, the interruption generating mechanism 24 is realized with that the number of transferred packets reaches the expected value as a condition to resume allocation of the parallel process (a condition to release the parallel synchronization waiting state). according to the first embodiment described above, a parallel process executed in the cpu 14 of the pe 11 is of only one kind. however, the first embodiment can comply with if plural jobs are executed as respective parallel processes on the parallel computer 10. in which case, it is noted that a process identifier corresponding to each job is set in a header of a transferred packet. in addition, the interruption generating mechanism 24 is provided for each process identifier to set a counter expected value for each process identifier in the counter expected value register 44, besides a region in which an output value (a count value) of the decrementer 43 is stored is ensured on the main storage 15 for each process identifier. it is thereby possible to count the number of received packets, set a counter expected value and generate an interruption signal correspondingly to the process identifier in the packet header so as to deactivate/activate the parallel process for each job. according to the first embodiment described above, the number of received packets are counted in subtraction (counted down) by the decrementer 43. it is alternatively possible to count the number of received packet by counting up the same by an incrementer. in which case, a value corresponding to the count-up process is, of course, set as a counter expected value in the counter expected value register 45. for instance, if a count value in the receive counter address on the main storage is "8" and the number of packets that will be received after the pe has got into the parallel synchronization waiting state is "6", "14" is set as a predetermined counter expected value. (d) description of a processing apparatus for a parallel computer according to a second embodiment fig. 6 is a block diagram showing a structure of an essential part of a processing apparatus for a parallel computer according to a second embodiment of this invention. in fig. 6, the receiving system in the transfer processing unit 13 and the interruption generating mechanism 24 added to the receiving system are shown in detail similarly to the first embodiment. the transmitting system originally provided to the transfer processing unit 13 is omitted in fig. 6. in fig. 6, like reference characters designate like or corresponding parts, detailed descriptions of which are omitted here. according to the second embodiment, it is noted that a message passing model is employed as a programming model in the parallel computer 10 and a message packet is transferred as a packet by the transfer processing unit 13. as shown in fig. 6, the receiving system of the transfer processing unit 13 of a pe 11 according to the second embodiment has a command register 31, a decoder 32, a control circuit 33 and an input buffer 34, which are similar to those according to the first embodiment. the receiving system of the transfer processing unit 13 also has an address register 37, an adder 38, a message receiving queue base address register 39, a write pointer 40, a one-adder 50, a read pointer 51 and a comparator 52. the input buffer 34 temporarily retains a packet received from a transmitter side pe 11 over the inter-pe coupling network similarly to that according to the first embodiment. data of a packet body retained in the input buffer 34 is combined with an address shown in the address register 37 and successively stored in the message receiving queue (a cyclic queue) 17 on the main storage 15 via the main storage access control unit 30, as will be described later with reference to a flowchart in fig. 7. the address register 37 temporarily retains an address in which a packet body retained in the input buffer 34 should be written. a value from the adder 41 is retained as address data in the address register 37. the adder 38 successively generates a write address used when a packet body retained in the input buffer 34 is stored in the message receiving queue 17 on the main storage 15. the adder 38 adds a message receiving queue base address (a leading address of a vacancy of the message receiving queue 17) retained in the register 39 to a value of the write pointer 40, and outputs the result as the write address to the address register 37. the write pointer 40 is set thereto 0 as an initial value. when a data writing in the main storage 15 is initiated, the value of the write pointer 40 is counted up by one by the one-adder 50 each time data for one block of the message receiving queue 17 is written in the message receiving queue 17. an output from the adder 38 is therefore increased by one with a message receiving queue base address as an initial value each time data for one block is written. such address value from the adder 38 is successively set in the address register 39 until all packets are written. data of the packet body is combined with an address successively set in the address register 37, and written in the message receiving queue 17 of the main storage 15 via the main storage access control unit 30. the read pointer 51 indicates a read point of the message receiving queue 17 which is a cyclic queue. the comparator 52 compares a value of the write pointer obtained by adding one by the one-adder 50 with a value of the read pointer 51. if a result of the comparison is agreement, the comparator 52 judges that data overflows from the message receiving queue 17, generates an interruption signal, and outputs it to the cpu 14. meanwhile, the above-mentioned receiving system of the transfer processing unit 13 is provided with the interruption generating mechanism 24 similarly to the first embodiment. the interruption generating mechanism 24 in a pe 11 according to the second embodiment is realized with a write pointer expected value register 53, a comparator 54 and an interruption generating circuit similar to that according to the first embodiment, as shown in fig. 6. here, the write pointer expected value register 53 is set thereto a predetermined write pointer expected value by the above-mentioned condition setting mechanism 22 of the cpu 14 (the supervisor) via the main storage access control unit 30 (the address decoder 30a) when a parallel process in process gets into the parallel synchronization waiting state. the write pointer expected value is set on the basis of a data capacity of all message packets that will be transferred from another pes 11 from when the parallel process gets into the parallel synchronization waiting state to when another pes 11 complete this step, which is a value considered to be indicated by the write pointer when the all message packets are received. the comparator 54 compares a write pointer expected value set in the write pointer expected value register 53 with an actually indicated value of the write pointer 40. if these values are in agreement, the comparator 54 outputs a coincidence signal (a signal becomes "0" in the case of disagreement, and "1" in the case of agreement). it is alternatively possible that the comparator 54 outputs a predetermined signal as stated above if the comparator 54 detects that the comparison of a write pointer expected value with an actually indicated value of the write pointer 40 results in disagreement or that an actually indicated value exceeds an expected value. the interruption generating circuit 46 generates an interruption signal to the cpu 14 (the supervisor) according to a result of comparison by the comparator 54 similarly to the first embodiment, which has an interruption holding register 47, an interruption generation masking register 48 and an and gate 49 quite similar to those described hereinbefore. when a coincidence signal from the comparator 54 rises so that a signal retained in the interruption holding register 47 becomes "1" in the case where "1" is set as the mask information in the interruption generation masking register 48, an interruption generating signal that should be outputted from the and gate 49 to the cpu 14 rises and becomes "1", whereby an interrupting process is performed in the cpu 14. next, an operation of the pe 11 according to the second embodiment will be described with reference to a flowchart (steps s21 through s39) shown in fig. 7. for the purpose of describing an operation of, in particular, the interruption generating mechanism 24, operations of the receiving system of the transfer processing unit 13 and the interruption generating mechanism 24 if the pe 11 receives a message packet in respect to a parallel process from another pe 11 after the pe 11 has got into the parallel synchronization waiting state in relation to the parallel process. assuming here that a predetermined write pointer expected value has been already set in the write pointer expected value register 53 by the condition setting mechanism 22 of the cpu 14 (the supervisor) at that time. the inter-pe coupling network 12 always grasps the number of free words of the input buffer 34 of each pe 11 connected to the inter-pe coupling network 12 (step s21). if a message packet addressed to a predetermined pe 11 (a receiver side pe) exists and the input buffer 34 of this receiver side pe 11 is free (step s22), the inter-pe coupling network 12 starts transferring the message packet accompanied with a packet transmission start signal at the first word (step s23), then transfers an entire of the message packet to the receiver side pe 11 depending on a state of freedom of the input buffer 34 of the receiver side pe 11. the process at step s24 is repeated until transfer of one message packet is completed (until a judgement at step s25 becomes yes). when the transfer of the message packet is completed, the procedure returns to step s21. when the transfer of the message packet from the inter-pe coupling network 12 to the receiver side pe 11 is initiated at steps s23 and s24, the receiving system in the transfer processing unit 13 of the receiver side pe 11 reads in the message packet so long as the input buffer 34 is free (step s26). at this time, the receiving system reads a command code into the command register 31 at a timing that the command code within a packet header flows (step s27). the command code read into the command register 31 is decoded by the decoder 32, then a signal used to control a packet receiving/storing method is generated by the control circuit 33 (step s28). in the receiving system of the transfer processing unit 13, a result of addition of a message receiving queue base address retained by the register 39 to a value of the write pointer 40 obtained by the adder 38 is set as a write address in the address register 37 (step s29). after that, a value of the write pointer 40 is counted up by one by the one-adder 50 (step s30). a value (an actually indicated value) of the write pointer 40 counted up by one at step s30 is compared with an expected value set in the write pointer expected value register 53 by the comparator 54. if these values agree with each other (if a judgement at step s31 becomes yes), a coincidence signal from the comparator 54 rises so that "1" is set in the interruption holding register 47 (step s32). if "1" is set as the mask information in the interruption generating circuit 48 at this time, an interruption signal that should be outputted from the interruption generating circuit 46 (the and gate 49) to the cpu 14 rises (step s33) so that an interrupting process is performed in the cpu 14, the receiving system of the transfer processing unit 13 thus gets into a reception waiting state. if the comparison by the comparator 54 results in disagreement (if a judgement at step s31 becomes no), the comparator 52 compares a value (an actually indicated value) of the write pointer 40 counted up by one at step s30 with a value of the read pointer 51. if these values agree with each other (if a judgement at step s34 becomes yes), it is judged that data overflows from the message receiving queue 17 so that an interruption signal that should be outputted from the comparator 52 to the cpu 14 rises (step s35), which causes the cpu 14 to perform an interruption process, whereby the receiving system of the transfer processing unit 13 gets into a reception waiting state. if the comparison by the comparator 52 results in disagreement (if a judgement at step s34 becomes no), the receiving system of the transfer processing unit 13 combines an address set in the address register 37 and packet data from the input buffer 34, then sends it to the main storage access control unit 30 to store the packet data in the message receiving queue 17 on the main storage 15 via the main storage access control unit 30 (step s36). when the packet data is stored once at step s36, the address generating circuit not shown adds one data store byte length to an address value of the address register 37, then a result of the addition is set in the address register 37 (step s37). the processes at steps s36 and s37 are repeated until transfer of packet data for one block to the message receiving queue 17 is completed or all packets are transferred to the message receiving queue 17 (until a judgement at step s38 becomes yes). the above-mentioned processes at steps s29 through s38 are repeated until reception of packets is completed, that is, until all packets are transferred to the message receiving queue 17 (until a judgement at step s39 becomes yes). if the judgement at step s39 becomes yes, the receiving system of the transfer processing unit 13 gets into the reception waiting state. in the pe 11 according to the second embodiment, if a parallel process gets into the parallel synchronization waiting state and the pe 11 receives a message packet from another pe 11 executing the parallel process, the received data is stored in the message receiving queue 17 on the main storage 15 according to an indicated value of the write pointer 40, besides the indicated value of the write pointer 40 is updated so as to be a leading address of the next free region of the message receiving queue 17, as described above. if the comparator 54 detects that an actually indicated value of the write pointer 40 agrees with an expected value set in the write pointer expected value register, the interruption generating circuit 46 generates an interruption signal. namely, the interruption generating mechanism 24 is realized with that a quantity of received message packets reaches the expected value as a condition to resume allocation of a parallel process (a condition to release the parallel synchronization waiting state). according to the second embodiment described above, the parallel process executed in the cpu 14 of the pe 11 is of one kind. however, the second embodiment can comply with a case where plural jobs are executed as parallel processes separately on the parallel computer 10. in which case, a process identifier corresponding to each job is set in a header of a packet that should be transferred. in addition, the interruption generating mechanism 24 is provided for each process identifier, a write pointer expected value is set in the write pointer expected value register 53 for each process identifier, the message receiving queue base address register 39, the write pointer 40, the read pointer 51 and the like are provided for each process identifier, and the message receiving queue 17 is ensured on the main storage 15 for each process identifier. with such arrangement, a data writing in the message receiving queue 17, an updating of the write pointer 40, a setting of an expected value and a generating of an interrupting signal are implemented for each process identifier correspondingly to the process identifier in the packet header, thereby deactivating/activating the parallel process for each job. (e) description of a processing apparatus for a parallel computer according to a third embodiment fig. 8 is block diagram showing a structure of an essential part of a processing apparatus for a parallel computer according to a third embodiment of this invention. a pe 11 according to the third embodiment has an interruption generating mechanism 24 adapted to synchronization detection (barrier detection). the interruption generating mechanism 24 according to the third embodiment is configured with a synchronization detecting mechanism 61 as shown in fig. 8, an interruption generation masking register 48 and an and gate 49 similar to those described hereinbefore. according to the third embodiment, the pes 11 are interconnected by a bst (barrier state) broadcasting apparatus 60 as a state communicating unit. the bst broadcasting apparatus 60 is served to transmit and receive a barrier state value (a variable of one bit length) representing whether each pe 11 completes a process allocated in this step as the parallel process among plural pes 11. for instance, the bst broadcasting apparatus 60 broadcasts a barrier state value (a value retained in an output register 62 described later) of each pe 11 to all pes 11 in the order of pe number #0, #1, #2, . . . #(n-1), #0, #1, . . . and so on. each pe 11 is provided with a synchronization detecting mechanism 61 for outputting a synchronization detection signal �a signal which becomes "1" (a high level) when synchronization is detected! when detecting that all barrier state values from pes 11 executing the parallel process obtained through the bst broadcasting apparatus 60 agree to each other. in the interruption generating mechanism 24 according to this embodiment, the and gate 49 calculates a logical product of a synchronization detection signal from the synchronization detecting mechanism 61 and an output of the interruption generation masking register 48, and outputs a result of the logical product as an interruption signal to the cpu 14. more specifically, when a synchronization detection signal from the synchronization detecting mechanism 61 rises in the case where "1" is set as the mask information in the interruption generation masking register 48, an interruption generating signal that is to be outputted from the and gate 49 to the cpu 14 rises and becomes "1" so that an interrupting process is performed in the cpu 14. next description will be of a structure and an operation of the synchronization detecting mechanism 61 used in the third embodiment with reference to fig. 8. the synchronization detecting mechanism 61 has a barrier state value output register 62, a barrier state value input register 63, a current synchronization value register 64, an exclusive-or gate 65, an and gate 66, a barrier masking register 67, a selector 68, a current pointer 69, a one-adder 70, a synchronization start pe number pointer 71, a comparator 72, a preceding barrier synchronization value register 73, a not gate 74, and an and gate 75 and a not comparator 76. in fig. 8, "<e" represent an input of an enable signal providing a write timing for latches (the registers 64 and 73, and the pointer 71). ".di-elect cons. " attached to the registers 48, 62, 67 and 73 represents accessibility from the cpu 14 (a program). the barrier state value output register 62 retains a barrier state value (bst.sub.-- out) of its own pe 11, and outputs it to the bst broadcasting apparatus 60. the barrier state input register 63 successively receives a barrier state value (bst.sub.-- in) of each pe 11 broadcasted from the bst broadcasting apparatus 60 as described hereinbefore, and retains it therein. the current synchronization value register 64 retains a current synchronization value (csync; current synchronization value). the exclusive-or gate (eor) 65 calculates an exclusive or of a value (bst.sub.-- in) of the barrier state value input register 63 and a value (csync) of the current synchronization value register 64. more specifically, an output value of the exclusive-or gate 65 becomes "1" if a value (bst.sub.-- in) of the barrier state value input register 63 differs from a value (csync) of the current synchronization value register 64. the and gate 66 calculates a logical product of a value from the exclusive-or gate 65 and a value from the selector 68, and outputs a result. the barrier masking register 67 is configured as a bit string of a n bit length if n pes 11 are provided to the parallel computer 10 of this embodiment. at a bit x (x=0 through n-1) of the barrier masking register 67, whether a barrier state value from a pe 11 of a pe number x is to be an object of parallel synchronization of this pe 11 or not is set. for example, if a barrier state value from a pe 11 of a pe number x is to be an object of parallel synchronization of this pe 11, "1" is set. if not, "0" is set. the selector 68 selects a barrier mask value of a bit position indicated by the current pointer 69 from the barrier masking register 67, and outputs it to the and gate 66. the current pointer (c.sub.-- pointer; current pointer) 69 indicates a pe number of a pe 11 which has sent a barrier state value currently retained in the barrier synchronization value input register 63, and outputs it to the selector 68. an indicated value of the current pointer 69 is added 1 by the one-adder 70 each machine cycle. so long as an initial value of the current pointer 69 is appropriately set, it is possible to always coincide a value indicated by the current pointer 69 with a pe number corresponding to a barrier state value from the barrier synchronization value input register 63. the synchronization start pe number pointer (ss.sub.-- pointer; synchronization start pointer) 71 retains a pe number of the first pe 11 on the occasion when a barrier state value broadcasted by the bst broadcasting apparatus 60 comes to be equal to a value (csync) of the current synchronization register 64. namely, a barrier state value (bst.sub.-- out) of a pe 11 which has a pe number falling in a region from "an indicated value of the synchronization start pe number pointer 71" to "an indicated value of the current pointer 69" when a barrier mask value of a pe number within this indicated value region is "1" is equal to a value (csync) retained in the current synchronization value register 64. the comparator 72 compares a value obtained by adding 1 to an indicated value of the current pointer 69 with a value indicated by the synchronization start pe number pointer 71. if these value agree with each other, the comparator 72 outputs "1" as a result of the comparison to the and gate 75. the preceding barrier synchronization value register 73 retains a barrier state value (lbsy; last barrier synchronization value) at the time of the last synchronization. an output value of the and gate 66 is inputted as an enable signal to the current synchronization value register 64 and the synchronization start pe number pointer 71. the not gate 74 inverts an output value of the and gate 66. the and gate 75 calculates a logical product of an output value of the not gate 74 and a result of the comparison from the comparator 72, and outputs it as an enable signal to the preceding barrier synchronization value register 73. the not comparator (\|comparator) 76 compares a value (lbsy) retained in the preceding barrier synchronization value register 73 with a value (bst.sub.-- out) retained in the barrier state value output register 62 in a procedure described later to detect barrier synchronization. if barrier synchronization is detected, the not comparator 76 outputs "1" as a synchronization detection signal. in the synchronization detecting mechanism 61 having the above structure, an output value from the and gate 66 becomes "1" if a transmission source pe 11 of a barrier state value received this time is an object of synchronization (if an output value from the selector 68 is "1") and the barrier state value received this time differs from a current synchronization value (csync). at a timing when an output value from the and gate 66 becomes "1", an enable signal is inputted to the current synchronization value register 64 and the synchronization start pe number pointer 71, a value (bst.sub.-- in) of the barrier state value input register 63 is set as a value (csync) of the current synchronization value register 64, and a value of the current pointer 69 is set as a value of the synchronization start pe number pointer 71. whereby, a pe number indicated by the current pointer 69 is retained as a pe number of a pe 11 first synchronizing in the synchronization start pe number pointer 71. a signal from the comparator 72 rises and becomes "1" if a value obtained by adding 1 to an indicated value of the current pointer 69 agrees with a value indicated by the synchronization start pe number pointer 71, that is, at a timing when barrier synchronization is detected, as described above. at this time, a pe 11 having a pe number falling in a region from "a value of the synchronization start pe number pointer 71" to "a value obtained by adding n-2 to a value of the pointer 71" synchronizes. an output value of the not gate 74 becomes "1" if an output value from the and gate 66 is "0", that is, if a barrier state value from a pe 11 having a pe number indicated by the current pointer 69 does not break current synchronization. in consequence, if a signal from the comaparator 72 becomes "1" and an output value of the not gate 74 is "1", that is, at a point of time at which an output value of the and gate 75 becomes "1", it is shown that barrier state values of all pes 11 that are objects of synchronization are in equal to a value (csync) of the current synchronization value register 64. as described above, an output value "1" of the and gate 75 is given as an enable signal to the preceding barrier synchronization value register 73 at a timing when an output value of the and gate 75 becomes "1", and a value (csync) of the current synchronization value register 64 is set as a value (lbsy) of the preceding barrier value register 73. the not comparator (\| comparator) 76 then compares a value (lbsy) of the preceding barrier synchronization value register 73 with a value (bst.sub.-- out) of the barrier state value output register 62. a procedure of synchronization detection by the comparator 76 is as follows. assuming that "lbsy"="bst.sub.-- out" before this operation. by inverting a value of "bst.sub.-- out", "bst.sub.-- out" \|="lbsy". here, "\|" means not in c language, and "\|=" means "not equal". when barrier state values of all pes 11 that are objects of synchronization agree with each other, that is, when barrier synchronization is detected, "lbsy"="bst.sub.-- out" is set. therefore, a period of "lbsy" \|="bst.sub.-- out" is a period of waiting for barrier synchronization so that a period of "lsby"=="bst.sub.-- out" is a barrier synchronization period, during which the comparator 76 outputs "1" as a synchronization detection signal. as stated above, when a synchronization detection signal from the synchronization detecting mechanism 61 (the comparator 76) rises if "1" is set as the mask information in the interruption generation masking register 48, an interruption signal that is to be outputted from the and gate 49 to the cpu 14 rises and becomes "1", whereby an interrupting process is performed in the cpu 14. in the pe 11 according to the third embodiment, when a parallel process in execution gets into the parallel synchronization waiting state, a synchronization detection signal of the synchronization detecting mechanism 61 of each pe 11 is used as an interruption signal of the interruption generating mechanism 24. in other words, synchronization detection (barrier detection) of each pe 11 is used as a condition to resume allocation of a parallel process so as to realize the interruption generating mechanism 7. in the third embodiment described above, a parallel process executed in the cpu 14 of a pe 11 is of one kind. however, the third embodiment may comply with a case where plural jobs are executed as parallel processes separately on the parallel computer 10. in which case, a process identifier corresponding to each job is set in a header of a transferred packet. in addition, the synchronization detecting mechanism 61 realizing the interruption generating mechanism 24 is provided for each process identifier, and synchronization detection by the synchronization detecting mechanism 61 and generation of an interruption signal are implemented for each process identifier, thereby deactivating/activating the parallel process for each job.
070-700-471-797-199	US	[ "US", "CA", "MX", "WO" ]	H04W72/08,H04L5/00,H04W28/04,H04W36/04,H04W36/32,H04W72/04,H04W84/04,H04W72/00	2015-09-16T00:00:00	2015	[ "H04" ]	method and apparatus for managing utilization of wireless resources	aspects of the subject disclosure may include, for example, a wireless communication node that receives instructions in a control channel directing it to utilize a spectral segment at a first carrier frequency to communicate with a mobile communication device. responsive to the instructions, the wireless communication node receives a modulated signal in the spectral segment at a second carrier frequency from the base station, the modulated signal including communications data provided by the base station. the wireless communication node down-shifts the modulated signal at the second carrier frequency to the first carrier frequency, and wirelessly transmits the modulated signal at the first carrier frequency to the mobile communication device. other embodiments are disclosed.	1. a base station, comprising: a processor; and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations, the operations comprising: responsive to determining that a rate of travel of a mobile communication device of a plurality of mobile communication devices satisfies a threshold, selecting, according to a location of the mobile communication device, a wireless communication node from a plurality of wireless communication nodes in a wireless communication range of the mobile communication device, the plurality of wireless communication nodes serving to reduce utilization of wireless resources of the base station by the plurality of mobile communication devices, wherein the plurality of mobile communication devices engage in wireless communications with the base station, and wherein the plurality of mobile communication devices utilize a plurality of spectral segments operating at a first carrier frequency; assigning a spectral segment from the plurality of spectral segments operating at a second carrier frequency to the wireless communication node to enable the wireless communication node to communicate with the mobile communication device; modulating a signal to generate a modulated signal in the spectral segment at the second carrier frequency; performing a first frequency shifting of the modulated signal at the second carrier frequency to a third carrier frequency; and transmitting the modulated signal at the third carrier frequency to the wireless communication node to enable the wireless communication node to perform a second frequency shifting of the modulated signal at the third carrier frequency to the second carrier frequency and to wirelessly transmit the modulated signal at the second carrier frequency to the mobile communication device. 2. the base station of claim 1 , wherein the modulated signal includes a reference signal to enable the wireless communication node to mitigate distortion in the modulated signal at the third carrier frequency. 3. the base station of claim 2 , wherein the distortion that is mitigated is phase distortion. 4. the base station of claim 1 , wherein the first carrier frequency and the second carrier frequency have non-overlapping frequency ranges. 5. the base station of claim 1 , wherein the operations further comprise transmitting instructions in a control channel at the third carrier frequency directing the wireless communication node to utilize the spectral segment at the second carrier frequency for communicating with the mobile communication device. 6. the base station of claim 1 , wherein the spectral segment assigned to the wireless communication node differs from one or more spectral segments of the plurality of spectral segments used by the base station to communicate wirelessly with the mobile communication device. 7. the base station of claim 1 , wherein the modulating comprises modulating the signal according to a signaling protocol, and wherein the first frequency shifting is performed without modifying the signaling protocol. 8. the base station of claim 7 , wherein the signaling protocol comprises a cellular communications protocol or a wireless access protocol. 9. the base station of claim 8 , wherein the cellular communications protocol comprises a long-term evolution (lte) wireless protocol. 10. a non-transitory computer-readable storage medium comprising executable instructions that, when executed by a processing system of a base station including a processor, perform operations, the operations comprising: responsive to determining that a rate of travel of a mobile communication device satisfies a threshold, selecting, according to a location of the mobile communication device, a wireless communication node from a plurality of wireless communication nodes in a wireless communication range of the mobile communication device, the plurality of wireless communication nodes serving to reduce utilization of wireless resources of the base station, wherein the mobile communication device engages in wireless communications with the base station, and wherein the mobile communication device utilizes a spectral segment operating at a first carrier frequency; assigning the spectral segment operating at a second carrier frequency to the wireless communication node to enable the wireless communication node to communicate with the mobile communication device; modulating a signal to generate a modulated signal in the spectral segment at the second carrier frequency, wherein the modulating comprises modulating the signal according to a signaling protocol; performing a first frequency shifting of the modulated signal at the second carrier frequency to a third carrier frequency, wherein the first frequency shifting is performed without modifying the signaling protocol; and transmitting the modulated signal at the third carrier frequency to the wireless communication node to enable the wireless communication node to perform a second frequency shifting of the modulated signal at the third carrier frequency to the second carrier frequency and to wirelessly transmit the modulated signal at the second carrier frequency to the mobile communication device. 11. the non-transitory computer-readable storage medium of claim 10 , wherein the modulated signal includes a reference signal to enable the wireless communication node to mitigate distortion. 12. the non-transitory computer-readable storage medium of claim 11 , wherein the distortion that is mitigated is phase distortion. 13. the non-transitory computer-readable storage medium of claim 11 , wherein: the first frequency shifting comprises up-converting and the second frequency shifting comprises down-converting; or the first frequency shifting comprises down-converting and the second frequency shifting comprises up-converting. 14. a method, comprising: responsive to determining that a rate of travel of a mobile communication device of a plurality of mobile communication devices satisfies a threshold, selecting by a base station comprising a processor, according to a location of the mobile communication device, a wireless communication node from a plurality of wireless communication nodes in a wireless communication range of the mobile communication device, the plurality of wireless communication nodes serving to reduce utilization of wireless resources of the base station by the plurality of mobile communication devices, wherein the plurality of mobile communication devices engage in wireless communications with the base station, and wherein the plurality of mobile communication devices utilize a plurality of spectral segments operating at a first carrier frequency; assigning, by the base station, a spectral segment from the plurality of spectral segments operating at a second carrier frequency to the wireless communication node to enable the wireless communication node to communicate with the mobile communication device; modulating, by the base station, a signal to generate a modulated signal in the spectral segment at the second carrier frequency; performing, by the base station, a first frequency shifting of the modulated signal at the second carrier frequency to a third carrier frequency; and transmitting, by the base station, the modulated signal at the third carrier frequency to the wireless communication node to enable the wireless communication node to perform a second frequency shifting of the modulated signal at the third carrier frequency to the second carrier frequency and to wirelessly transmit the modulated signal at the second carrier frequency to the mobile communication device. 15. the method of claim 14 , wherein the modulated signal includes a reference signal to enable the wireless communication node to mitigate distortion in the modulated signal at the third carrier frequency. 16. the method of claim 15 , wherein the distortion that is mitigated is phase distortion. 17. the method of claim 14 , wherein the first carrier frequency and the second carrier frequency have non-overlapping frequency ranges. 18. the method of claim 14 , wherein the method further comprises transmitting, by the base station, instructions in a control channel at the third carrier frequency directing the wireless communication node to utilize the spectral segment at the second carrier frequency for communicating with the mobile communication device. 19. the method of claim 14 , wherein the spectral segment assigned to the wireless communication node differs from one or more spectral segments of the plurality of spectral segments used by the base station to communicate wirelessly with the mobile communication device. 20. the method of claim 14 , wherein the modulating comprises modulating the signal according to a signaling protocol, and wherein the first frequency shifting is performed without modifying the signaling protocol.	cross-reference to related application(s) this application is a divisional of u.s. patent application ser. no. 14/855,499, filed sep. 16, 2015. all sections of the aforementioned application(s) are incorporated herein by reference in their entirety. field of the disclosure the subject disclosure relates to a method and apparatus for managing utilization of wireless resources. background as smart phones and other portable devices increasingly become ubiquitous, and data usage increases, macrocell base station devices and existing wireless infrastructure in turn require higher bandwidth capability in order to address the increased demand. to provide additional mobile bandwidth, small cell deployment is being pursued, with microcells and picocells providing coverage for much smaller areas than traditional macrocells. in addition, most homes and businesses have grown to rely on broadband data access for services such as voice, video and internet browsing, etc. broadband access networks include satellite, 4g or 5g wireless, power line communication, fiber, cable, and telephone networks. brief description of the drawings reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein: fig. 1 is a block diagram illustrating an example, non-limiting embodiment of a guided-wave communications system in accordance with various aspects described herein. fig. 2 is a block diagram illustrating an example, non-limiting embodiment of a transmission device in accordance with various aspects described herein. fig. 3 is a graphical diagram illustrating an example, non-limiting embodiment of an electromagnetic field distribution in accordance with various aspects described herein. fig. 4 is a graphical diagram illustrating an example, non-limiting embodiment of an electromagnetic field distribution in accordance with various aspects described herein. fig. 5a is a graphical diagram illustrating an example, non-limiting embodiment of a frequency response in accordance with various aspects described herein. fig. 5b is a graphical diagram illustrating example, non-limiting embodiments of a longitudinal cross-section of an insulated wire depicting fields of guided electromagnetic waves at various operating frequencies in accordance with various aspects described herein. fig. 6 is a graphical diagram illustrating an example, non-limiting embodiment of an electromagnetic field distribution in accordance with various aspects described herein. fig. 7 is a block diagram illustrating an example, non-limiting embodiment of an arc coupler in accordance with various aspects described herein. fig. 8 is a block diagram illustrating an example, non-limiting embodiment of an arc coupler in accordance with various aspects described herein. fig. 9a is a block diagram illustrating an example, non-limiting embodiment of a stub coupler in accordance with various aspects described herein. fig. 9b is a diagram illustrating an example, non-limiting embodiment of an electromagnetic distribution in accordance with various aspects described herein. figs. 10a and 10b are block diagrams illustrating example, non-limiting embodiments of couplers and transceivers in accordance with various aspects described herein. fig. 11 is a block diagram illustrating an example, non-limiting embodiment of a dual stub coupler in accordance with various aspects described herein. fig. 12 is a block diagram illustrating an example, non-limiting embodiment of a repeater system in accordance with various aspects described herein. fig. 13 illustrates a block diagram illustrating an example, non-limiting embodiment of a bidirectional repeater in accordance with various aspects described herein. fig. 14 is a block diagram illustrating an example, non-limiting embodiment of a waveguide system in accordance with various aspects described herein. fig. 15 is a block diagram illustrating an example, non-limiting embodiment of a guided-wave communications system in accordance with various aspects described herein. figs. 16a and 16b are block diagrams illustrating an example, non-limiting embodiment of a system for managing a communication system in accordance with various aspects described herein. fig. 17a illustrates a flow diagram of an example, non-limiting embodiment of a method for detecting and mitigating disturbances occurring in a communication network of the system of figs. 16a and 16b . fig. 17b illustrates a flow diagram of an example, non-limiting embodiment of a method for detecting and mitigating disturbances occurring in a communication network of the system of figs. 16a and 16b . fig. 18a is a block diagram illustrating an example, non-limiting embodiment of a communication system in accordance with various aspects described herein. fig. 18b is a block diagram illustrating an example, non-limiting embodiment of a portion of the communication system of fig. 18a in accordance with various aspects described herein. figs. 18c-18d are block diagrams illustrating example, non-limiting embodiments of a communication node of the communication system of fig. 18a in accordance with various aspects described herein. fig. 19 is a block diagram illustrating an example, non-limiting embodiment of downlink and uplink communication techniques for enabling a base station to communicate with communication nodes in accordance with various aspects described herein. fig. 20 illustrates a flow diagram of an example, non-limiting embodiment of a method in accordance with various aspects described herein. fig. 21 is a block diagram of an example, non-limiting embodiment of a computing environment in accordance with various aspects described herein. fig. 22 is a block diagram of an example, non-limiting embodiment of a mobile network platform in accordance with various aspects described herein. fig. 23 is a block diagram of an example, non-limiting embodiment of a communication device in accordance with various aspects described herein. detailed description one or more embodiments are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. in the following description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the various embodiments. it is evident, however, that the various embodiments can be practiced without these details (and without applying to any particular networked environment or standard). in an embodiment, a guided wave communication system is presented for sending and receiving communication signals such as data or other signaling via guided electromagnetic waves. the guided electromagnetic waves include, for example, surface waves or other electromagnetic waves that are bound to or guided by a transmission medium. it will be appreciated that a variety of transmission media can be utilized with guided wave communications without departing from example embodiments. examples of such transmission media can include one or more of the following, either alone or in one or more combinations: wires, whether insulated or not, and whether single-stranded or multi-stranded; conductors of other shapes or configurations including wire bundles, cables, rods, rails, pipes; non-conductors such as dielectric pipes, rods, rails, or other dielectric members; combinations of conductors and dielectric materials; or other guided wave transmission media. the inducement of guided electromagnetic waves on a transmission medium can be independent of any electrical potential, charge or current that is injected or otherwise transmitted through the transmission medium as part of an electrical circuit. for example, in the case where the transmission medium is a wire, it is to be appreciated that while a small current in the wire may be formed in response to the propagation of the guided waves along the wire, this can be due to the propagation of the electromagnetic wave along the wire surface, and is not formed in response to electrical potential, charge or current that is injected into the wire as part of an electrical circuit. the electromagnetic waves traveling on the wire therefore do not require a circuit to propagate along the wire surface. the wire therefore is a single wire transmission line that is not part of a circuit. also, in some embodiments, a wire is not necessary, and the electromagnetic waves can propagate along a single line transmission medium that is not a wire. more generally, “guided electromagnetic waves” or “guided waves” as described by the subject disclosure are affected by the presence of a physical object that is at least a part of the transmission medium (e.g., a bare wire or other conductor, a dielectric, an insulated wire, a conduit or other hollow element, a bundle of insulated wires that is coated, covered or surrounded by a dielectric or insulator or other wire bundle, or another form of solid, liquid or otherwise non-gaseous transmission medium) so as to be at least partially bound to or guided by the physical object and so as to propagate along a transmission path of the physical object. such a physical object can operate as at least a part of a transmission medium that guides, by way of an interface of the transmission medium (e.g., an outer surface, inner surface, an interior portion between the outer and the inner surfaces or other boundary between elements of the transmission medium), the propagation of guided electromagnetic waves, which in turn can carry energy, data and/or other signals along the transmission path from a sending device to a receiving device. unlike free space propagation of wireless signals such as unguided (or unbounded) electromagnetic waves that decrease in intensity inversely by the square of the distance traveled by the unguided electromagnetic waves, guided electromagnetic waves can propagate along a transmission medium with less loss in magnitude per unit distance than experienced by unguided electromagnetic waves. unlike electrical signals, guided electromagnetic waves can propagate from a sending device to a receiving device without requiring a separate electrical return path between the sending device and the receiving device. as a consequence, guided electromagnetic waves can propagate from a sending device to a receiving device along a transmission medium having no conductive components (e.g., a dielectric strip), or via a transmission medium having no more than a single conductor (e.g., a single bare wire or insulated wire). even if a transmission medium includes one or more conductive components and the guided electromagnetic waves propagating along the transmission medium generate currents that flow in the one or more conductive components in a direction of the guided electromagnetic waves, such guided electromagnetic waves can propagate along the transmission medium from a sending device to a receiving device without requiring a flow of opposing currents on an electrical return path between the sending device and the receiving device. in a non-limiting illustration, consider electrical systems that transmit and receive electrical signals between sending and receiving devices by way of conductive media. such systems generally rely on electrically separate forward and return paths. for instance, consider a coaxial cable having a center conductor and a ground shield that are separated by an insulator. typically, in an electrical system a first terminal of a sending (or receiving) device can be connected to the center conductor, and a second terminal of the sending (or receiving) device can be connected to the ground shield. if the sending device injects an electrical signal in the center conductor via the first terminal, the electrical signal will propagate along the center conductor causing forward currents in the center conductor, and return currents in the ground shield. the same conditions apply for a two terminal receiving device. in contrast, consider a guided wave communication system such as described in the subject disclosure, which can utilize different embodiments of a transmission medium (including among others a coaxial cable) for transmitting and receiving guided electromagnetic waves without an electrical return path. in one embodiment, for example, the guided wave communication system of the subject disclosure can be configured to induce guided electromagnetic waves that propagate along an outer surface of a coaxial cable. although the guided electromagnetic waves will cause forward currents on the ground shield, the guided electromagnetic waves do not require return currents to enable the guided electromagnetic waves to propagate along the outer surface of the coaxial cable. the same can be said of other transmission media used by a guided wave communication system for the transmission and reception of guided electromagnetic waves. for example, guided electromagnetic waves induced by the guided wave communication system on an outer surface of a bare wire, or an insulated wire can propagate along the bare wire or the insulated bare wire without an electrical return path. consequently, electrical systems that require two or more conductors for carrying forward and reverse currents on separate conductors to enable the propagation of electrical signals injected by a sending device are distinct from guided wave systems that induce guided electromagnetic waves on an interface of a transmission medium without the need of an electrical return path to enable the propagation of the guided electromagnetic waves along the interface of the transmission medium. it is further noted that guided electromagnetic waves as described in the subject disclosure can have an electromagnetic field structure that lies primarily or substantially outside of a transmission medium so as to be bound to or guided by the transmission medium and so as to propagate non-trivial distances on or along an outer surface of the transmission medium. in other embodiments, guided electromagnetic waves can have an electromagnetic field structure that lies primarily or substantially inside a transmission medium so as to be bound to or guided by the transmission medium and so as to propagate non-trivial distances within the transmission medium. in other embodiments, guided electromagnetic waves can have an electromagnetic field structure that lies partially inside and partially outside a transmission medium so as to be bound to or guided by the transmission medium and so as to propagate non-trivial distances along the transmission medium. the desired electronic field structure in an embodiment may vary based upon a variety of factors, including the desired transmission distance, the characteristics of the transmission medium itself, and environmental conditions/characteristics outside of the transmission medium (e.g., presence of rain, fog, atmospheric conditions, etc.). it is further noted that guided wave systems as described in the subject disclosure also differ from fiber optical systems. guided wave systems of the subject disclosure can induce guided electromagnetic waves on an interface of a transmission medium constructed of an opaque material (e.g., a dielectric cable made of polyethylene) or a material that is otherwise resistive to the transmission of light waves (e.g., a bare conductive wire or an insulated conductive wire) enabling propagation of the guided electromagnetic waves along the interface of the transmission medium over non-trivial distances. fiber optic systems in contrast cannot function with a transmission medium that is opaque or other resistive to the transmission of light waves. various embodiments described herein relate to coupling devices, that can be referred to as “waveguide coupling devices”, “waveguide couplers” or more simply as “couplers”, “coupling devices” or “launchers” for launching and/or extracting guided electromagnetic waves to and from a transmission medium at millimeter-wave frequencies (e.g., 30 to 300 ghz), wherein the wavelength can be small compared to one or more dimensions of the coupling device and/or the transmission medium such as the circumference of a wire or other cross sectional dimension, or lower microwave frequencies such as 300 mhz to 30 ghz. transmissions can be generated to propagate as waves guided by a coupling device, such as: a strip, arc or other length of dielectric material; a horn, monopole, rod, slot or other antenna; an array of antennas; a magnetic resonant cavity, or other resonant coupler; a coil, a strip line, a waveguide or other coupling device. in operation, the coupling device receives an electromagnetic wave from a transmitter or transmission medium. the electromagnetic field structure of the electromagnetic wave can be carried inside the coupling device, outside the coupling device or some combination thereof. when the coupling device is in close proximity to a transmission medium, at least a portion of an electromagnetic wave couples to or is bound to the transmission medium, and continues to propagate as guided electromagnetic waves. in a reciprocal fashion, a coupling device can extract guided waves from a transmission medium and transfer these electromagnetic waves to a receiver. according to an example embodiment, a surface wave is a type of guided wave that is guided by a surface of a transmission medium, such as an exterior or outer surface of the wire, or another surface of the wire that is adjacent to or exposed to another type of medium having different properties (e.g., dielectric properties). indeed, in an example embodiment, a surface of the wire that guides a surface wave can represent a transitional surface between two different types of media. for example, in the case of a bare or uninsulated wire, the surface of the wire can be the outer or exterior conductive surface of the bare or uninsulated wire that is exposed to air or free space. as another example, in the case of insulated wire, the surface of the wire can be the conductive portion of the wire that meets the insulator portion of the wire, or can otherwise be the insulator surface of the wire that is exposed to air or free space, or can otherwise be any material region between the insulator surface of the wire and the conductive portion of the wire that meets the insulator portion of the wire, depending upon the relative differences in the properties (e.g., dielectric properties) of the insulator, air, and/or the conductor and further dependent on the frequency and propagation mode or modes of the guided wave. according to an example embodiment, the term “about” a wire or other transmission medium used in conjunction with a guided wave can include fundamental guided wave propagation modes such as a guided waves having a circular or substantially circular field distribution, a symmetrical electromagnetic field distribution (e.g., electric field, magnetic field, electromagnetic field, etc.) or other fundamental mode pattern at least partially around a wire or other transmission medium. in addition, when a guided wave propagates “about” a wire or other transmission medium, it can do so according to a guided wave propagation mode that includes not only the fundamental wave propagation modes (e.g., zero order modes), but additionally or alternatively non-fundamental wave propagation modes such as higher-order guided wave modes (e.g., 1 st order modes, 2 nd order modes, etc.), asymmetrical modes and/or other guided (e.g., surface) waves that have non-circular field distributions around a wire or other transmission medium. as used herein, the term “guided wave mode” refers to a guided wave propagation mode of a transmission medium, coupling device or other system component of a guided wave communication system. for example, such non-circular field distributions can be unilateral or multi-lateral with one or more axial lobes characterized by relatively higher field strength and/or one or more nulls or null regions characterized by relatively low-field strength, zero-field strength or substantially zero-field strength. further, the field distribution can otherwise vary as a function of azimuthal orientation around the wire such that one or more angular regions around the wire have an electric or magnetic field strength (or combination thereof) that is higher than one or more other angular regions of azimuthal orientation, according to an example embodiment. it will be appreciated that the relative orientations or positions of the guided wave higher order modes or asymmetrical modes can vary as the guided wave travels along the wire. as used herein, the term “millimeter-wave” can refer to electromagnetic waves/signals that fall within the “millimeter-wave frequency band” of 30 ghz to 300 ghz. the term “microwave” can refer to electromagnetic waves/signals that fall within a “microwave frequency band” of 300 mhz to 300 ghz. the term “radio frequency” or “rf” can refer to electromagnetic waves/signals that fall within the “radio frequency band” of 10 khz to 1 thz. it is appreciated that wireless signals, electrical signals, and guided electromagnetic waves as described in the subject disclosure can be configured to operate at any desirable frequency range, such as, for example, at frequencies within, above or below millimeter-wave and/or microwave frequency bands. in particular, when a coupling device or transmission medium includes a conductive element, the frequency of the guided electromagnetic waves that are carried by the coupling device and/or propagate along the transmission medium can be below the mean collision frequency of the electrons in the conductive element. further, the frequency of the guided electromagnetic waves that are carried by the coupling device and/or propagate along the transmission medium can be a non-optical frequency, e.g., a radio frequency below the range of optical frequencies that begins at 1 thz. as used herein, the term “antenna” can refer to a device that is part of a transmitting or receiving system to transmit/radiate or receive wireless signals. in accordance with one or more embodiments, a method can include initiating, by a macro base station, wireless communications services with a first mobile communication device utilizing a first spectral segment at a first carrier frequency, determining, by the macro base station, that a rate of travel of the first mobile communication device satisfies a threshold, responsive to the determining, identifying, by the macro base station, a micro base station in a communication range of the first mobile communication device, assigning, by the macro base station, a second spectral segment to the micro base station to enable the micro base station to communicate with the first mobile communication device, modulating, by the macro base station, a signal to generate a first modulated signal in the second spectral segment, up-converting, by the macro base station, the first modulated signal to a second carrier frequency, transmitting, by the macro base station, first instructions in a control channel at the second carrier frequency to direct the micro base station to utilize the second spectral segment for communicating with the first mobile communication device, and transmitting, by the macro base station, the first modulated signal at the second carrier frequency to the micro base station, the transmitting enabling the micro base station to down-convert the first modulated signal at the second carrier frequency and to wirelessly transmit the first modulated signal to the first mobile communication device. in accordance with one or more embodiments, a base station can include a processor, and a memory that stores executable instructions that, when executed by the processor, facilitate performance of operations. the operations can include initiating wireless communications with a plurality of mobile communication devices utilizing a plurality of spectral segments operating at a first carrier frequency, responsive to determining that a rate of travel of a mobile communication device of the plurality of mobile communication devices satisfies a threshold, selecting, according to a location of the mobile communication device, a wireless communication node from a plurality of wireless communication nodes in a wireless communication range of the mobile communication device, the plurality of communication nodes serving to reduce utilization of wireless resources of the base station by the plurality of mobile communication devices, assigning a spectral segment operating at a second carrier frequency to the wireless communication node to enable the wireless communication node to communicate with the mobile communication device, modulating a signal to generate a modulated signal in the spectral segment at the second carrier frequency, up-converting the modulated signal at the second carrier frequency to a third carrier frequency, and transmitting the modulated signal at the third carrier frequency to the wireless communication node to enable the wireless communication node to down-convert the modulated signal at the third carrier frequency to the second carrier frequency and to wirelessly transmit the modulated signal at the second carrier frequency to the mobile communication device. in accordance with one or more embodiments, a method can include receiving, by a wireless communication node, instructions in a control channel to utilize a spectral segment at a first carrier frequency to communicate with a mobile communication device, the instructions being sent by a base station responsive to the base station determining that wireless communications between the mobile communication device and the base station can be redirected to the wireless communication node based on a location of the mobile communication device and a rate of travel of the mobile communication device, receiving, by the wireless communication node, a first modulated signal in the spectral segment at a second carrier frequency from the base station, the first modulated signal including first communications data provided by the base station, down-shifting, by the wireless communication node, the first modulated signal at the second carrier frequency to the first carrier frequency, and wirelessly transmitting, by the wireless communication node, the first modulated signal at the first carrier frequency to the mobile communication device. referring now to fig. 1 , a block diagram 100 illustrating an example, non-limiting embodiment of a guided wave communications system is shown. in operation, a transmission device 101 receives one or more communication signals 110 from a communication network or other communications device that includes data and generates guided waves 120 to convey the data via the transmission medium 125 to the transmission device 102 . the transmission device 102 receives the guided waves 120 and converts them to communication signals 112 that include the data for transmission to a communications network or other communications device. the guided waves 120 can be modulated to convey data via a modulation technique such as phase shift keying, frequency shift keying, quadrature amplitude modulation, amplitude modulation, multi-carrier modulation such as orthogonal frequency division multiplexing and via multiple access techniques such as frequency division multiplexing, time division multiplexing, code division multiplexing, multiplexing via differing wave propagation modes and via other modulation and access strategies. the communication network or networks can include a wireless communication network such as a mobile data network, a cellular voice and data network, a wireless local area network (e.g., wifi or an 802.xx network), a satellite communications network, a personal area network or other wireless network. the communication network or networks can also include a wired communication network such as a telephone network, an ethernet network, a local area network, a wide area network such as the internet, a broadband access network, a cable network, a fiber optic network, or other wired network. the communication devices can include a network edge device, bridge device or home gateway, a set-top box, broadband modem, telephone adapter, access point, base station, or other fixed communication device, a mobile communication device such as an automotive gateway or automobile, laptop computer, tablet, smartphone, cellular telephone, or other communication device. in an example embodiment, the guided wave communication system 100 can operate in a bi-directional fashion where transmission device 102 receives one or more communication signals 112 from a communication network or device that includes other data and generates guided waves 122 to convey the other data via the transmission medium 125 to the transmission device 101 . in this mode of operation, the transmission device 101 receives the guided waves 122 and converts them to communication signals 110 that include the other data for transmission to a communications network or device. the guided waves 122 can be modulated to convey data via a modulation technique such as phase shift keying, frequency shift keying, quadrature amplitude modulation, amplitude modulation, multi-carrier modulation such as orthogonal frequency division multiplexing and via multiple access techniques such as frequency division multiplexing, time division multiplexing, code division multiplexing, multiplexing via differing wave propagation modes and via other modulation and access strategies. the transmission medium 125 can include a cable having at least one inner portion surrounded by a dielectric material such as an insulator or other dielectric cover, coating or other dielectric material, the dielectric material having an outer surface and a corresponding circumference. in an example embodiment, the transmission medium 125 operates as a single-wire transmission line to guide the transmission of an electromagnetic wave. when the transmission medium 125 is implemented as a single wire transmission system, it can include a wire. the wire can be insulated or uninsulated, and single-stranded or multi-stranded (e.g., braided). in other embodiments, the transmission medium 125 can contain conductors of other shapes or configurations including wire bundles, cables, rods, rails, pipes. in addition, the transmission medium 125 can include non-conductors such as dielectric pipes, rods, rails, or other dielectric members; combinations of conductors and dielectric materials, conductors without dielectric materials or other guided wave transmission media. it should be noted that the transmission medium 125 can otherwise include any of the transmission media previously discussed. further, as previously discussed, the guided waves 120 and 122 can be contrasted with radio transmissions over free space/air or conventional propagation of electrical power or signals through the conductor of a wire via an electrical circuit. in addition to the propagation of guided waves 120 and 122 , the transmission medium 125 may optionally contain one or more wires that propagate electrical power or other communication signals in a conventional manner as a part of one or more electrical circuits. referring now to fig. 2 , a block diagram 200 illustrating an example, non-limiting embodiment of a transmission device is shown. the transmission device 101 or 102 includes a communications interface (i/f) 205 , a transceiver 210 and a coupler 220 . in an example of operation, the communications interface 205 receives a communication signal 110 or 112 that includes data. in various embodiments, the communications interface 205 can include a wireless interface for receiving a wireless communication signal in accordance with a wireless standard protocol such as lte or other cellular voice and data protocol, wifi or an 802.11 protocol, wimax protocol, ultra wideband protocol, bluetooth protocol, zigbee protocol, a direct broadcast satellite (dbs) or other satellite communication protocol or other wireless protocol. in addition or in the alternative, the communications interface 205 includes a wired interface that operates in accordance with an ethernet protocol, universal serial bus (usb) protocol, a data over cable service interface specification (docsis) protocol, a digital subscriber line (dsl) protocol, a firewire (ieee 1394) protocol, or other wired protocol. in additional to standards-based protocols, the communications interface 205 can operate in conjunction with other wired or wireless protocol. in addition, the communications interface 205 can optionally operate in conjunction with a protocol stack that includes multiple protocol layers including a mac protocol, transport protocol, application protocol, etc. in an example of operation, the transceiver 210 generates an electromagnetic wave based on the communication signal 110 or 112 to convey the data. the electromagnetic wave has at least one carrier frequency and at least one corresponding wavelength. the carrier frequency can be within a millimeter-wave frequency band of 30 ghz-300 ghz, such as 60 ghz or a carrier frequency in the range of 30-40 ghz or a lower frequency band of 300 mhz-30 ghz in the microwave frequency range such as 26-30 ghz, 11 ghz, 6 ghz or 3 ghz, but it will be appreciated that other carrier frequencies are possible in other embodiments. in one mode of operation, the transceiver 210 merely upconverts the communications signal or signals 110 or 112 for transmission of the electromagnetic signal in the microwave or millimeter-wave band as a guided electromagnetic wave that is guided by or bound to the transmission medium 125 . in another mode of operation, the communications interface 205 either converts the communication signal 110 or 112 to a baseband or near baseband signal or extracts the data from the communication signal 110 or 112 and the transceiver 210 modulates a high-frequency carrier with the data, the baseband or near baseband signal for transmission. it should be appreciated that the transceiver 210 can modulate the data received via the communication signal 110 or 112 to preserve one or more data communication protocols of the communication signal 110 or 112 either by encapsulation in the payload of a different protocol or by simple frequency shifting. in the alternative, the transceiver 210 can otherwise translate the data received via the communication signal 110 or 112 to a protocol that is different from the data communication protocol or protocols of the communication signal 110 or 112 . in an example of operation, the coupler 220 couples the electromagnetic wave to the transmission medium 125 as a guided electromagnetic wave to convey the communications signal or signals 110 or 112 . while the prior description has focused on the operation of the transceiver 210 as a transmitter, the transceiver 210 can also operate to receive electromagnetic waves that convey other data from the single wire transmission medium via the coupler 220 and to generate communications signals 110 or 112 , via communications interface 205 that includes the other data. consider embodiments where an additional guided electromagnetic wave conveys other data that also propagates along the transmission medium 125 . the coupler 220 can also couple this additional electromagnetic wave from the transmission medium 125 to the transceiver 210 for reception. the transmission device 101 or 102 includes an optional training controller 230 . in an example embodiment, the training controller 230 is implemented by a standalone processor or a processor that is shared with one or more other components of the transmission device 101 or 102 . the training controller 230 selects the carrier frequencies, modulation schemes and/or guided wave modes for the guided electromagnetic waves based on feedback data received by the transceiver 210 from at least one remote transmission device coupled to receive the guided electromagnetic wave. in an example embodiment, a guided electromagnetic wave transmitted by a remote transmission device 101 or 102 conveys data that also propagates along the transmission medium 125 . the data from the remote transmission device 101 or 102 can be generated to include the feedback data. in operation, the coupler 220 also couples the guided electromagnetic wave from the transmission medium 125 and the transceiver receives the electromagnetic wave and processes the electromagnetic wave to extract the feedback data. in an example embodiment, the training controller 230 operates based on the feedback data to evaluate a plurality of candidate frequencies, modulation schemes and/or transmission modes to select a carrier frequency, modulation scheme and/or transmission mode to enhance performance, such as throughput, signal strength, reduce propagation loss, etc. consider the following example: a transmission device 101 begins operation under control of the training controller 230 by sending a plurality of guided waves as test signals such as pilot waves or other test signals at a corresponding plurality of candidate frequencies and/or candidate modes directed to a remote transmission device 102 coupled to the transmission medium 125 . the guided waves can include, in addition or in the alternative, test data. the test data can indicate the particular candidate frequency and/or guide-wave mode of the signal. in an embodiment, the training controller 230 at the remote transmission device 102 receives the test signals and/or test data from any of the guided waves that were properly received and determines the best candidate frequency and/or guided wave mode, a set of acceptable candidate frequencies and/or guided wave modes, or a rank ordering of candidate frequencies and/or guided wave modes. this selection of candidate frequenc(ies) or/and guided-mode(s) are generated by the training controller 230 based on one or more optimizing criteria such as received signal strength, bit error rate, packet error rate, signal to noise ratio, propagation loss, etc. the training controller 230 generates feedback data that indicates the selection of candidate frequenc(ies) or/and guided wave mode(s) and sends the feedback data to the transceiver 210 for transmission to the transmission device 101 . the transmission device 101 and 102 can then communicate data with one another based on the selection of candidate frequenc(ies) or/and guided wave mode(s). in other embodiments, the guided electromagnetic waves that contain the test signals and/or test data are reflected back, repeated back or otherwise looped back by the remote transmission device 102 to the transmission device 101 for reception and analysis by the training controller 230 of the transmission device 101 that initiated these waves. for example, the transmission device 101 can send a signal to the remote transmission device 102 to initiate a test mode where a physical reflector is switched on the line, a termination impedance is changed to cause reflections, a loop back mode is switched on to couple electromagnetic waves back to the source transmission device 102 , and/or a repeater mode is enabled to amplify and retransmit the electromagnetic waves back to the source transmission device 102 . the training controller 230 at the source transmission device 102 receives the test signals and/or test data from any of the guided waves that were properly received and determines selection of candidate frequenc(ies) or/and guided wave mode(s). while the procedure above has been described in a start-up or initialization mode of operation, each transmission device 101 or 102 can send test signals, evaluate candidate frequencies or guided wave modes via non-test such as normal transmissions or otherwise evaluate candidate frequencies or guided wave modes at other times or continuously as well. in an example embodiment, the communication protocol between the transmission devices 101 and 102 can include an on-request or periodic test mode where either full testing or more limited testing of a subset of candidate frequencies and guided wave modes are tested and evaluated. in other modes of operation, the re-entry into such a test mode can be triggered by a degradation of performance due to a disturbance, weather conditions, etc. in an example embodiment, the receiver bandwidth of the transceiver 210 is either sufficiently wide or swept to receive all candidate frequencies or can be selectively adjusted by the training controller 230 to a training mode where the receiver bandwidth of the transceiver 210 is sufficiently wide or swept to receive all candidate frequencies. referring now to fig. 3 , a graphical diagram 300 illustrating an example, non-limiting embodiment of an electromagnetic field distribution is shown. in this embodiment, a transmission medium 125 in air includes an inner conductor 301 and an insulating jacket 302 of dielectric material, as shown in cross section. the diagram 300 includes different gray-scales that represent differing electromagnetic field strengths generated by the propagation of the guided wave having an asymmetrical and non-fundamental guided wave mode. in particular, the electromagnetic field distribution corresponds to a modal “sweet spot” that enhances guided electromagnetic wave propagation along an insulated transmission medium and reduces end-to-end transmission loss. in this particular mode, electromagnetic waves are guided by the transmission medium 125 to propagate along an outer surface of the transmission medium—in this case, the outer surface of the insulating jacket 302 . electromagnetic waves are partially embedded in the insulator and partially radiating on the outer surface of the insulator. in this fashion, electromagnetic waves are “lightly” coupled to the insulator so as to enable electromagnetic wave propagation at long distances with low propagation loss. as shown, the guided wave has a field structure that lies primarily or substantially outside of the transmission medium 125 that serves to guide the electromagnetic waves. the regions inside the conductor 301 have little or no field. likewise regions inside the insulating jacket 302 have low field strength. the majority of the electromagnetic field strength is distributed in the lobes 304 at the outer surface of the insulating jacket 302 and in close proximity thereof. the presence of an asymmetric guided wave mode is shown by the high electromagnetic field strengths at the top and bottom of the outer surface of the insulating jacket 302 (in the orientation of the diagram)—as opposed to very small field strengths on the other sides of the insulating jacket 302 . the example shown corresponds to a 38 ghz electromagnetic wave guided by a wire with a diameter of 1.1 cm and a dielectric insulation of thickness of 0.36 cm. because the electromagnetic wave is guided by the transmission medium 125 and the majority of the field strength is concentrated in the air outside of the insulating jacket 302 within a limited distance of the outer surface, the guided wave can propagate longitudinally down the transmission medium 125 with very low loss. in the example shown, this “limited distance” corresponds to a distance from the outer surface that is less than half the largest cross sectional dimension of the transmission medium 125 . in this case, the largest cross sectional dimension of the wire corresponds to the overall diameter of 1.82 cm, however, this value can vary with the size and shape of the transmission medium 125 . for example, should the transmission medium 125 be of a rectangular shape with a height of 0.3 cm and a width of 0.4 cm, the largest cross sectional dimension would be the diagonal of 0.5 cm and the corresponding limited distance would be 0.25 cm. the dimensions of the area containing the majority of the field strength also vary with the frequency, and in general, increase as carrier frequencies decrease. it should also be noted that the components of a guided wave communication system, such as couplers and transmission media can have their own cut-off frequencies for each guided wave mode. the cut-off frequency generally sets forth the lowest frequency that a particular guided wave mode is designed to be supported by that particular component. in an example embodiment, the particular asymmetric mode of propagation shown is induced on the transmission medium 125 by an electromagnetic wave having a frequency that falls within a limited range (such as fc to 2fc) of the lower cut-off frequency fc for this particular asymmetric mode. the lower cut-off frequency fc is particular to the characteristics of transmission medium 125 . for embodiments as shown that include an inner conductor 301 surrounded by an insulating jacket 302 , this cutoff frequency can vary based on the dimensions and properties of the insulating jacket 302 and potentially the dimensions and properties of the inner conductor 301 and can be determined experimentally to have a desired mode pattern. it should be noted however, that similar effects can be found for a hollow dielectric or insulator without an inner conductor. in this case, the cutoff frequency can vary based on the dimensions and properties of the hollow dielectric or insulator. at frequencies lower than the lower cut-off frequency, the asymmetric mode is difficult to induce in the transmission medium 125 and fails to propagate for all but trivial distances. as the frequency increases above the limited range of frequencies about the cut-off frequency, the asymmetric mode shifts more and more inward of the insulating jacket 302 . at frequencies much larger than the cut-off frequency, the field strength is no longer concentrated outside of the insulating jacket, but primarily inside of the insulating jacket 302 . while the transmission medium 125 provides strong guidance to the electromagnetic wave and propagation is still possible, ranges are more limited by increased losses due to propagation within the insulating jacket 302 —as opposed to the surrounding air. referring now to fig. 4 , a graphical diagram 400 illustrating an example, non-limiting embodiment of an electromagnetic field distribution is shown. in particular, a cross section diagram 400 , similar to fig. 3 is shown with common reference numerals used to refer to similar elements. the example shown corresponds to a 60 ghz wave guided by a wire with a diameter of 1.1 cm and a dielectric insulation of thickness of 0.36 cm. because the frequency of the guided wave is above the limited range of the cut-off frequency of this particular asymmetric mode, much of the field strength has shifted inward of the insulating jacket 302 . in particular, the field strength is concentrated primarily inside of the insulating jacket 302 . while the transmission medium 125 provides strong guidance to the electromagnetic wave and propagation is still possible, ranges are more limited when compared with the embodiment of fig. 3 , by increased losses due to propagation within the insulating jacket 302 . referring now to fig. 5a , a graphical diagram illustrating an example, non-limiting embodiment of a frequency response is shown. in particular, diagram 500 presents a graph of end-to-end loss (in db) as a function of frequency, overlaid with electromagnetic field distributions 510 , 520 and 530 at three points for a 200 cm insulated medium voltage wire. the boundary between the insulator and the surrounding air is represented by reference numeral 525 in each electromagnetic field distribution. as discussed in conjunction with fig. 3 , an example of a desired asymmetric mode of propagation shown is induced on the transmission medium 125 by an electromagnetic wave having a frequency that falls within a limited range (such as fc to 2fc) of the lower cut-off frequency fc of the transmission medium for this particular asymmetric mode. in particular, the electromagnetic field distribution 520 at 6 ghz falls within this modal “sweet spot” that enhances electromagnetic wave propagation along an insulated transmission medium and reduces end-to-end transmission loss. in this particular mode, guided waves are partially embedded in the insulator and partially radiating on the outer surface of the insulator. in this fashion, the electromagnetic waves are “lightly” coupled to the insulator so as to enable guided electromagnetic wave propagation at long distances with low propagation loss. at lower frequencies represented by the electromagnetic field distribution 510 at 3 ghz, the asymmetric mode radiates more heavily generating higher propagation losses. at higher frequencies represented by the electromagnetic field distribution 530 at 9 ghz, the asymmetric mode shifts more and more inward of the insulating jacket providing too much absorption, again generating higher propagation losses. referring now to fig. 5b , a graphical diagram 550 illustrating example, non-limiting embodiments of a longitudinal cross-section of a transmission medium 125 , such as an insulated wire, depicting fields of guided electromagnetic waves at various operating frequencies is shown. as shown in diagram 556 , when the guided electromagnetic waves are at approximately the cutoff frequency (f c ) corresponding to the modal “sweet spot”, the guided electromagnetic waves are loosely coupled to the insulated wire so that absorption is reduced, and the fields of the guided electromagnetic waves are bound sufficiently to reduce the amount radiated into the environment (e.g., air). because absorption and radiation of the fields of the guided electromagnetic waves is low, propagation losses are consequently low, enabling the guided electromagnetic waves to propagate for longer distances. as shown in diagram 554 , propagation losses increase when an operating frequency of the guide electromagnetic waves increases above about two-times the cutoff frequency (f c )—or as referred to, above the range of the “sweet spot”. more of the field strength of the electromagnetic wave is driven inside the insulating layer, increasing propagation losses. at frequencies much higher than the cutoff frequency (f c ) the guided electromagnetic waves are strongly bound to the insulated wire as a result of the fields emitted by the guided electromagnetic waves being concentrated in the insulation layer of the wire, as shown in diagram 552 . this in turn raises propagation losses further due to absorption of the guided electromagnetic waves by the insulation layer. similarly, propagation losses increase when the operating frequency of the guided electromagnetic waves is substantially below the cutoff frequency (f c ), as shown in diagram 558 . at frequencies much lower than the cutoff frequency (f c ) the guided electromagnetic waves are weakly (or nominally) bound to the insulated wire and thereby tend to radiate into the environment (e.g., air), which in turn, raises propagation losses due to radiation of the guided electromagnetic waves. referring now to fig. 6 , a graphical diagram 600 illustrating an example, non-limiting embodiment of an electromagnetic field distribution is shown. in this embodiment, a transmission medium 602 is a bare wire, as shown in cross section. the diagram 300 includes different gray-scales that represent differing electromagnetic field strengths generated by the propagation of a guided wave having a symmetrical and fundamental guided wave mode at a single carrier frequency. in this particular mode, electromagnetic waves are guided by the transmission medium 602 to propagate along an outer surface of the transmission medium—in this case, the outer surface of the bare wire. electromagnetic waves are “lightly” coupled to the wire so as to enable electromagnetic wave propagation at long distances with low propagation loss. as shown, the guided wave has a field structure that lies substantially outside of the transmission medium 602 that serves to guide the electromagnetic waves. the regions inside the conductor 602 have little or no field. referring now to fig. 7 , a block diagram 700 illustrating an example, non-limiting embodiment of an arc coupler is shown. in particular a coupling device is presented for use in a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 . the coupling device includes an arc coupler 704 coupled to a transmitter circuit 712 and termination or damper 714 . the arc coupler 704 can be made of a dielectric material, or other low-loss insulator (e.g., teflon, polyethylene, etc.), or made of a conducting (e.g., metallic, non-metallic, etc.) material, or any combination of the foregoing materials. as shown, the arc coupler 704 operates as a waveguide and has a wave 706 propagating as a guided wave about a waveguide surface of the arc coupler 704 . in the embodiment shown, at least a portion of the arc coupler 704 can be placed near a wire 702 or other transmission medium, (such as transmission medium 125 ), in order to facilitate coupling between the arc coupler 704 and the wire 702 or other transmission medium, as described herein to launch the guided wave 708 on the wire. the arc coupler 704 can be placed such that a portion of the curved arc coupler 704 is tangential to, and parallel or substantially parallel to the wire 702 . the portion of the arc coupler 704 that is parallel to the wire can be an apex of the curve, or any point where a tangent of the curve is parallel to the wire 702 . when the arc coupler 704 is positioned or placed thusly, the wave 706 travelling along the arc coupler 704 couples, at least in part, to the wire 702 , and propagates as guided wave 708 around or about the wire surface of the wire 702 and longitudinally along the wire 702 . the guided wave 708 can be characterized as a surface wave or other electromagnetic wave that is guided by or bound to the wire 702 or other transmission medium. a portion of the wave 706 that does not couple to the wire 702 propagates as a wave 710 along the arc coupler 704 . it will be appreciated that the arc coupler 704 can be configured and arranged in a variety of positions in relation to the wire 702 to achieve a desired level of coupling or non-coupling of the wave 706 to the wire 702 . for example, the curvature and/or length of the arc coupler 704 that is parallel or substantially parallel, as well as its separation distance (which can include zero separation distance in an embodiment), to the wire 702 can be varied without departing from example embodiments. likewise, the arrangement of arc coupler 704 in relation to the wire 702 may be varied based upon considerations of the respective intrinsic characteristics (e.g., thickness, composition, electromagnetic properties, etc.) of the wire 702 and the arc coupler 704 , as well as the characteristics (e.g., frequency, energy level, etc.) of the waves 706 and 708 . the guided wave 708 stays parallel or substantially parallel to the wire 702 , even as the wire 702 bends and flexes. bends in the wire 702 can increase transmission losses, which are also dependent on wire diameters, frequency, and materials. if the dimensions of the arc coupler 704 are chosen for efficient power transfer, most of the power in the wave 706 is transferred to the wire 702 , with little power remaining in wave 710 . it will be appreciated that the guided wave 708 can still be multi-modal in nature (discussed herein), including having modes that are non-fundamental or asymmetric, while traveling along a path that is parallel or substantially parallel to the wire 702 , with or without a fundamental transmission mode. in an embodiment, non-fundamental or asymmetric modes can be utilized to minimize transmission losses and/or obtain increased propagation distances. it is noted that the term parallel is generally a geometric construct which often is not exactly achievable in real systems. accordingly, the term parallel as utilized in the subject disclosure represents an approximation rather than an exact configuration when used to describe embodiments disclosed in the subject disclosure. in an embodiment, substantially parallel can include approximations that are within 30 degrees of true parallel in all dimensions. in an embodiment, the wave 706 can exhibit one or more wave propagation modes. the arc coupler modes can be dependent on the shape and/or design of the coupler 704 . the one or more arc coupler modes of wave 706 can generate, influence, or impact one or more wave propagation modes of the guided wave 708 propagating along wire 702 . it should be particularly noted however that the guided wave modes present in the guided wave 706 may be the same or different from the guided wave modes of the guided wave 708 . in this fashion, one or more guided wave modes of the guided wave 706 may not be transferred to the guided wave 708 , and further one or more guided wave modes of guided wave 708 may not have been present in guided wave 706 . it should also be noted that the cut-off frequency of the arc coupler 704 for a particular guided wave mode may be different than the cutoff frequency of the wire 702 or other transmission medium for that same mode. for example, while the wire 702 or other transmission medium may be operated slightly above its cutoff frequency for a particular guided wave mode, the arc coupler 704 may be operated well above its cut-off frequency for that same mode for low loss, slightly below its cut-off frequency for that same mode to, for example, induce greater coupling and power transfer, or some other point in relation to the arc coupler's cutoff frequency for that mode. in an embodiment, the wave propagation modes on the wire 702 can be similar to the arc coupler modes since both waves 706 and 708 propagate about the outside of the arc coupler 704 and wire 702 respectively. in some embodiments, as the wave 706 couples to the wire 702 , the modes can change form, or new modes can be created or generated, due to the coupling between the arc coupler 704 and the wire 702 . for example, differences in size, material, and/or impedances of the arc coupler 704 and wire 702 may create additional modes not present in the arc coupler modes and/or suppress some of the arc coupler modes. the wave propagation modes can comprise the fundamental transverse electromagnetic mode (quasi-tem 00 ), where only small electric and/or magnetic fields extend in the direction of propagation, and the electric and magnetic fields extend radially outwards while the guided wave propagates along the wire. this guided wave mode can be donut shaped, where few of the electromagnetic fields exist within the arc coupler 704 or wire 702 . waves 706 and 708 can comprise a fundamental tem mode where the fields extend radially outwards, and also comprise other, non-fundamental (e.g., asymmetric, higher-level, etc.) modes. while particular wave propagation modes are discussed above, other wave propagation modes are likewise possible such as transverse electric (te) and transverse magnetic (tm) modes, based on the frequencies employed, the design of the arc coupler 704 , the dimensions and composition of the wire 702 , as well as its surface characteristics, its insulation if present, the electromagnetic properties of the surrounding environment, etc. it should be noted that, depending on the frequency, the electrical and physical characteristics of the wire 702 and the particular wave propagation modes that are generated, guided wave 708 can travel along the conductive surface of an oxidized uninsulated wire, an unoxidized uninsulated wire, an insulated wire and/or along the insulating surface of an insulated wire. in an embodiment, a diameter of the arc coupler 704 is smaller than the diameter of the wire 702 . for the millimeter-band wavelength being used, the arc coupler 704 supports a single waveguide mode that makes up wave 706 . this single waveguide mode can change as it couples to the wire 702 as guided wave 708 . if the arc coupler 704 were larger, more than one waveguide mode can be supported, but these additional waveguide modes may not couple to the wire 702 as efficiently, and higher coupling losses can result. however, in some alternative embodiments, the diameter of the arc coupler 704 can be equal to or larger than the diameter of the wire 702 , for example, where higher coupling losses are desirable or when used in conjunction with other techniques to otherwise reduce coupling losses (e.g., impedance matching with tapering, etc.). in an embodiment, the wavelength of the waves 706 and 708 are comparable in size, or smaller than a circumference of the arc coupler 704 and the wire 702 . in an example, if the wire 702 has a diameter of 0.5 cm, and a corresponding circumference of around 1.5 cm, the wavelength of the transmission is around 1.5 cm or less, corresponding to a frequency of 70 ghz or greater. in another embodiment, a suitable frequency of the transmission and the carrier-wave signal is in the range of 30-100 ghz, perhaps around 30-60 ghz, and around 38 ghz in one example. in an embodiment, when the circumference of the arc coupler 704 and wire 702 is comparable in size to, or greater, than a wavelength of the transmission, the waves 706 and 708 can exhibit multiple wave propagation modes including fundamental and/or non-fundamental (symmetric and/or asymmetric) modes that propagate over sufficient distances to support various communication systems described herein. the waves 706 and 708 can therefore comprise more than one type of electric and magnetic field configuration. in an embodiment, as the guided wave 708 propagates down the wire 702 , the electrical and magnetic field configurations will remain the same from end to end of the wire 702 . in other embodiments, as the guided wave 708 encounters interference (distortion or obstructions) or loses energy due to transmission losses or scattering, the electric and magnetic field configurations can change as the guided wave 708 propagates down wire 702 . in an embodiment, the arc coupler 704 can be composed of nylon, teflon, polyethylene, a polyamide, or other plastics. in other embodiments, other dielectric materials are possible. the wire surface of wire 702 can be metallic with either a bare metallic surface, or can be insulated using plastic, dielectric, insulator or other coating, jacket or sheathing. in an embodiment, a dielectric or otherwise non-conducting/insulated waveguide can be paired with either a bare/metallic wire or insulated wire. in other embodiments, a metallic and/or conductive waveguide can be paired with a bare/metallic wire or insulated wire. in an embodiment, an oxidation layer on the bare metallic surface of the wire 702 (e.g., resulting from exposure of the bare metallic surface to oxygen/air) can also provide insulating or dielectric properties similar to those provided by some insulators or sheathings. it is noted that the graphical representations of waves 706 , 708 and 710 are presented merely to illustrate the principles that wave 706 induces or otherwise launches a guided wave 708 on a wire 702 that operates, for example, as a single wire transmission line. wave 710 represents the portion of wave 706 that remains on the arc coupler 704 after the generation of guided wave 708 . the actual electric and magnetic fields generated as a result of such wave propagation may vary depending on the frequencies employed, the particular wave propagation mode or modes, the design of the arc coupler 704 , the dimensions and composition of the wire 702 , as well as its surface characteristics, its optional insulation, the electromagnetic properties of the surrounding environment, etc. it is noted that arc coupler 704 can include a termination circuit or damper 714 at the end of the arc coupler 704 that can absorb leftover radiation or energy from wave 710 . the termination circuit or damper 714 can prevent and/or minimize the leftover radiation or energy from wave 710 reflecting back toward transmitter circuit 712 . in an embodiment, the termination circuit or damper 714 can include termination resistors, and/or other components that perform impedance matching to attenuate reflection. in some embodiments, if the coupling efficiencies are high enough, and/or wave 710 is sufficiently small, it may not be necessary to use a termination circuit or damper 714 . for the sake of simplicity, these transmitter 712 and termination circuits or dampers 714 may not be depicted in the other figures, but in those embodiments, transmitter and termination circuits or dampers may possibly be used. further, while a single arc coupler 704 is presented that generates a single guided wave 708 , multiple arc couplers 704 placed at different points along the wire 702 and/or at different azimuthal orientations about the wire can be employed to generate and receive multiple guided waves 708 at the same or different frequencies, at the same or different phases, at the same or different wave propagation modes. fig. 8 , a block diagram 800 illustrating an example, non-limiting embodiment of an arc coupler is shown. in the embodiment shown, at least a portion of the coupler 704 can be placed near a wire 702 or other transmission medium, (such as transmission medium 125 ), in order to facilitate coupling between the arc coupler 704 and the wire 702 or other transmission medium, to extract a portion of the guided wave 806 as a guided wave 808 as described herein. the arc coupler 704 can be placed such that a portion of the curved arc coupler 704 is tangential to, and parallel or substantially parallel to the wire 702 . the portion of the arc coupler 704 that is parallel to the wire can be an apex of the curve, or any point where a tangent of the curve is parallel to the wire 702 . when the arc coupler 704 is positioned or placed thusly, the wave 806 travelling along the wire 702 couples, at least in part, to the arc coupler 704 , and propagates as guided wave 808 along the arc coupler 704 to a receiving device (not expressly shown). a portion of the wave 806 that does not couple to the arc coupler propagates as wave 810 along the wire 702 or other transmission medium. in an embodiment, the wave 806 can exhibit one or more wave propagation modes. the arc coupler modes can be dependent on the shape and/or design of the coupler 704 . the one or more modes of guided wave 806 can generate, influence, or impact one or more guide-wave modes of the guided wave 808 propagating along the arc coupler 704 . it should be particularly noted however that the guided wave modes present in the guided wave 806 may be the same or different from the guided wave modes of the guided wave 808 . in this fashion, one or more guided wave modes of the guided wave 806 may not be transferred to the guided wave 808 , and further one or more guided wave modes of guided wave 808 may not have been present in guided wave 806 . referring now to fig. 9a , a block diagram 900 illustrating an example, non-limiting embodiment of a stub coupler is shown. in particular a coupling device that includes stub coupler 904 is presented for use in a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 . the stub coupler 904 can be made of a dielectric material, or other low-loss insulator (e.g., teflon, polyethylene and etc.), or made of a conducting (e.g., metallic, non-metallic, etc.) material, or any combination of the foregoing materials. as shown, the stub coupler 904 operates as a waveguide and has a wave 906 propagating as a guided wave about a waveguide surface of the stub coupler 904 . in the embodiment shown, at least a portion of the stub coupler 904 can be placed near a wire 702 or other transmission medium, (such as transmission medium 125 ), in order to facilitate coupling between the stub coupler 904 and the wire 702 or other transmission medium, as described herein to launch the guided wave 908 on the wire. in an embodiment, the stub coupler 904 is curved, and an end of the stub coupler 904 can be tied, fastened, or otherwise mechanically coupled to a wire 702 . when the end of the stub coupler 904 is fastened to the wire 702 , the end of the stub coupler 904 is parallel or substantially parallel to the wire 702 . alternatively, another portion of the dielectric waveguide beyond an end can be fastened or coupled to wire 702 such that the fastened or coupled portion is parallel or substantially parallel to the wire 702 . the fastener 910 can be a nylon cable tie or other type of non-conducting/dielectric material that is either separate from the stub coupler 904 or constructed as an integrated component of the stub coupler 904 . the stub coupler 904 can be adjacent to the wire 702 without surrounding the wire 702 . like the arc coupler 704 described in conjunction with fig. 7 , when the stub coupler 904 is placed with the end parallel to the wire 702 , the guided wave 906 travelling along the stub coupler 904 couples to the wire 702 , and propagates as guided wave 908 about the wire surface of the wire 702 . in an example embodiment, the guided wave 908 can be characterized as a surface wave or other electromagnetic wave. it is noted that the graphical representations of waves 906 and 908 are presented merely to illustrate the principles that wave 906 induces or otherwise launches a guided wave 908 on a wire 702 that operates, for example, as a single wire transmission line. the actual electric and magnetic fields generated as a result of such wave propagation may vary depending on one or more of the shape and/or design of the coupler, the relative position of the dielectric waveguide to the wire, the frequencies employed, the design of the stub coupler 904 , the dimensions and composition of the wire 702 , as well as its surface characteristics, its optional insulation, the electromagnetic properties of the surrounding environment, etc. in an embodiment, an end of stub coupler 904 can taper towards the wire 702 in order to increase coupling efficiencies. indeed, the tapering of the end of the stub coupler 904 can provide impedance matching to the wire 702 and reduce reflections, according to an example embodiment of the subject disclosure. for example, an end of the stub coupler 904 can be gradually tapered in order to obtain a desired level of coupling between waves 906 and 908 as illustrated in fig. 9a . in an embodiment, the fastener 910 can be placed such that there is a short length of the stub coupler 904 between the fastener 910 and an end of the stub coupler 904 . maximum coupling efficiencies are realized in this embodiment when the length of the end of the stub coupler 904 that is beyond the fastener 910 is at least several wavelengths long for whatever frequency is being transmitted. turning now to fig. 9b , a diagram 950 illustrating an example, non-limiting embodiment of an electromagnetic distribution in accordance with various aspects described herein is shown. in particular, an electromagnetic distribution is presented in two dimensions for a transmission device that includes coupler 952 , shown in an example stub coupler constructed of a dielectric material. the coupler 952 couples an electromagnetic wave for propagation as a guided wave along an outer surface of a wire 702 or other transmission medium. the coupler 952 guides the electromagnetic wave to a junction at x 0 via a symmetrical guided wave mode. while some of the energy of the electromagnetic wave that propagates along the coupler 952 is outside of the coupler 952 , the majority of the energy of this electromagnetic wave is contained within the coupler 952 . the junction at x 0 couples the electromagnetic wave to the wire 702 or other transmission medium at an azimuthal angle corresponding to the bottom of the transmission medium. this coupling induces an electromagnetic wave that is guided to propagate along the outer surface of the wire 702 or other transmission medium via at least one guided wave mode in direction 956 . the majority of the energy of the guided electromagnetic wave is outside or, but in close proximity to the outer surface of the wire 702 or other transmission medium. in the example shown, the junction at x 0 forms an electromagnetic wave that propagates via both a symmetrical mode and at least one asymmetrical surface mode, such as the first order mode presented in conjunction with fig. 3 , that skims the surface of the wire 702 or other transmission medium. it is noted that the graphical representations of guided waves are presented merely to illustrate an example of guided wave coupling and propagation. the actual electric and magnetic fields generated as a result of such wave propagation may vary depending on the frequencies employed, the design and/or configuration of the coupler 952 , the dimensions and composition of the wire 702 or other transmission medium, as well as its surface characteristics, its insulation if present, the electromagnetic properties of the surrounding environment, etc. turning now to fig. 10a , illustrated is a block diagram 1000 of an example, non-limiting embodiment of a coupler and transceiver system in accordance with various aspects described herein. the system is an example of transmission device 101 or 102 . in particular, the communication interface 1008 is an example of communications interface 205 , the stub coupler 1002 is an example of coupler 220 , and the transmitter/receiver device 1006 , diplexer 1016 , power amplifier 1014 , low noise amplifier 1018 , frequency mixers 1010 and 1020 and local oscillator 1012 collectively form an example of transceiver 210 . in operation, the transmitter/receiver device 1006 launches and receives waves (e.g., guided wave 1004 onto stub coupler 1002 ). the guided waves 1004 can be used to transport signals received from and sent to a host device, base station, mobile devices, a building or other device by way of a communications interface 1008 . the communications interface 1008 can be an integral part of system 1000 . alternatively, the communications interface 1008 can be tethered to system 1000 . the communications interface 1008 can comprise a wireless interface for interfacing to the host device, base station, mobile devices, a building or other device utilizing any of various wireless signaling protocols (e.g., lte, wifi, wimax, ieee 802.xx, etc.) including an infrared protocol such as an infrared data association (irda) protocol or other line of sight optical protocol. the communications interface 1008 can also comprise a wired interface such as a fiber optic line, coaxial cable, twisted pair, category 5 (cat-5) cable or other suitable wired or optical mediums for communicating with the host device, base station, mobile devices, a building or other device via a protocol such as an ethernet protocol, universal serial bus (usb) protocol, a data over cable service interface specification (docsis) protocol, a digital subscriber line (dsl) protocol, a firewire (ieee 1394) protocol, or other wired or optical protocol. for embodiments where system 1000 functions as a repeater, the communications interface 1008 may not be necessary. the output signals (e.g., tx) of the communications interface 1008 can be combined with a carrier wave (e.g., millimeter-wave carrier wave) generated by a local oscillator 1012 at frequency mixer 1010 . frequency mixer 1010 can use heterodyning techniques or other frequency shifting techniques to frequency shift the output signals from communications interface 1008 . for example, signals sent to and from the communications interface 1008 can be modulated signals such as orthogonal frequency division multiplexed (ofdm) signals formatted in accordance with a long-term evolution (lte) wireless protocol or other wireless 3g, 4g, 5g or higher voice and data protocol, a zigbee, wimax, ultrawideband or ieee 802.11 wireless protocol; a wired protocol such as an ethernet protocol, universal serial bus (usb) protocol, a data over cable service interface specification (docsis) protocol, a digital subscriber line (dsl) protocol, a firewire (ieee 1394) protocol or other wired or wireless protocol. in an example embodiment, this frequency conversion can be done in the analog domain, and as a result, the frequency shifting can be done without regard to the type of communications protocol used by a base station, mobile devices, or in-building devices. as new communications technologies are developed, the communications interface 1008 can be upgraded (e.g., updated with software, firmware, and/or hardware) or replaced and the frequency shifting and transmission apparatus can remain, simplifying upgrades. the carrier wave can then be sent to a power amplifier (“pa”) 1014 and can be transmitted via the transmitter receiver device 1006 via the diplexer 1016 . signals received from the transmitter/receiver device 1006 that are directed towards the communications interface 1008 can be separated from other signals via diplexer 1016 . the received signal can then be sent to low noise amplifier (“lna”) 1018 for amplification. a frequency mixer 1020 , with help from local oscillator 1012 can downshift the received signal (which is in the millimeter-wave band or around 38 ghz in some embodiments) to the native frequency. the communications interface 1008 can then receive the transmission at an input port (rx). in an embodiment, transmitter/receiver device 1006 can include a cylindrical or non-cylindrical metal (which, for example, can be hollow in an embodiment, but not necessarily drawn to scale) or other conducting or non-conducting waveguide and an end of the stub coupler 1002 can be placed in or in proximity to the waveguide or the transmitter/receiver device 1006 such that when the transmitter/receiver device 1006 generates a transmission, the guided wave couples to stub coupler 1002 and propagates as a guided wave 1004 about the waveguide surface of the stub coupler 1002 . in some embodiments, the guided wave 1004 can propagate in part on the outer surface of the stub coupler 1002 and in part inside the stub coupler 1002 . in other embodiments, the guided wave 1004 can propagate substantially or completely on the outer surface of the stub coupler 1002 . in yet other embodiments, the guided wave 1004 can propagate substantially or completely inside the stub coupler 1002 . in this latter embodiment, the guided wave 1004 can radiate at an end of the stub coupler 1002 (such as the tapered end shown in fig. 4 ) for coupling to a transmission medium such as a wire 702 of fig. 7 . similarly, if guided wave 1004 is incoming (coupled to the stub coupler 1002 from a wire 702 ), guided wave 1004 then enters the transmitter/receiver device 1006 and couples to the cylindrical waveguide or conducting waveguide. while transmitter/receiver device 1006 is shown to include a separate waveguide—an antenna, cavity resonator, klystron, magnetron, travelling wave tube, or other radiating element can be employed to induce a guided wave on the coupler 1002 , with or without the separate waveguide. in an embodiment, stub coupler 1002 can be wholly constructed of a dielectric material (or another suitable insulating material), without any metallic or otherwise conducting materials therein. stub coupler 1002 can be composed of nylon, teflon, polyethylene, a polyamide, other plastics, or other materials that are non-conducting and suitable for facilitating transmission of electromagnetic waves at least in part on an outer surface of such materials. in another embodiment, stub coupler 1002 can include a core that is conducting/metallic, and have an exterior dielectric surface. similarly, a transmission medium that couples to the stub coupler 1002 for propagating electromagnetic waves induced by the stub coupler 1002 or for supplying electromagnetic waves to the stub coupler 1002 can, in addition to being a bare or insulated wire, be wholly constructed of a dielectric material (or another suitable insulating material), without any metallic or otherwise conducting materials therein. it is noted that although fig. 10a shows that the opening of transmitter receiver device 1006 is much wider than the stub coupler 1002 , this is not to scale, and that in other embodiments the width of the stub coupler 1002 is comparable or slightly smaller than the opening of the hollow waveguide. it is also not shown, but in an embodiment, an end of the coupler 1002 that is inserted into the transmitter/receiver device 1006 tapers down in order to reduce reflection and increase coupling efficiencies. before coupling to the stub coupler 1002 , the one or more waveguide modes of the guided wave generated by the transmitter/receiver device 1006 can couple to the stub coupler 1002 to induce one or more wave propagation modes of the guided wave 1004 . the wave propagation modes of the guided wave 1004 can be different than the hollow metal waveguide modes due to the different characteristics of the hollow metal waveguide and the dielectric waveguide. for instance, wave propagation modes of the guided wave 1004 can comprise the fundamental transverse electromagnetic mode (quasi-tem 00 ), where only small electrical and/or magnetic fields extend in the direction of propagation, and the electric and magnetic fields extend radially outwards from the stub coupler 1002 while the guided waves propagate along the stub coupler 1002 . the fundamental transverse electromagnetic mode wave propagation mode may or may not exist inside a waveguide that is hollow. therefore, the hollow metal waveguide modes that are used by transmitter/receiver device 1006 are waveguide modes that can couple effectively and efficiently to wave propagation modes of stub coupler 1002 . it will be appreciated that other constructs or combinations of the transmitter/receiver device 1006 and stub coupler 1002 are possible. for example, a stub coupler 1002 ′ can be placed tangentially or in parallel (with or without a gap) with respect to an outer surface of the hollow metal waveguide of the transmitter/receiver device 1006 ′ (corresponding circuitry not shown) as depicted by reference 1000 ′ of fig. 10b . in another embodiment, not shown by reference 1000 ′, the stub coupler 1002 ′ can be placed inside the hollow metal waveguide of the transmitter/receiver device 1006 ′ without an axis of the stub coupler 1002 ′ being coaxially aligned with an axis of the hollow metal waveguide of the transmitter/receiver device 1006 ′. in either of these embodiments, the guided wave generated by the transmitter/receiver device 1006 ′ can couple to a surface of the stub coupler 1002 ′ to induce one or more wave propagation modes of the guided wave 1004 ′ on the stub coupler 1002 ′ including a fundamental mode (e.g., a symmetric mode) and/or a non-fundamental mode (e.g., asymmetric mode). in one embodiment, the guided wave 1004 ′ can propagate in part on the outer surface of the stub coupler 1002 ′ and in part inside the stub coupler 1002 ′. in another embodiment, the guided wave 1004 ′ can propagate substantially or completely on the outer surface of the stub coupler 1002 ′. in yet other embodiments, the guided wave 1004 ′ can propagate substantially or completely inside the stub coupler 1002 ′. in this latter embodiment, the guided wave 1004 ′ can radiate at an end of the stub coupler 1002 ′ (such as the tapered end shown in fig. 9 ) for coupling to a transmission medium such as a wire 702 of fig. 9 . it will be further appreciated that other constructs the transmitter/receiver device 1006 are possible. for example, a hollow metal waveguide of a transmitter/receiver device 1006 ″ (corresponding circuitry not shown), depicted in fig. 10b as reference 1000 ″, can be placed tangentially or in parallel (with or without a gap) with respect to an outer surface of a transmission medium such as the wire 702 of fig. 4 without the use of the stub coupler 1002 . in this embodiment, the guided wave generated by the transmitter/receiver device 1006 ″ can couple to a surface of the wire 702 to induce one or more wave propagation modes of a guided wave 908 on the wire 702 including a fundamental mode (e.g., a symmetric mode) and/or a non-fundamental mode (e.g., asymmetric mode). in another embodiment, the wire 702 can be positioned inside a hollow metal waveguide of a transmitter/receiver device 1006 ′″ (corresponding circuitry not shown) so that an axis of the wire 702 is coaxially (or not coaxially) aligned with an axis of the hollow metal waveguide without the use of the stub coupler 1002 —see figs. 10b reference 1000 ′″. in this embodiment, the guided wave generated by the transmitter/receiver device 1006 ′″ can couple to a surface of the wire 702 to induce one or more wave propagation modes of a guided wave 908 on the wire including a fundamental mode (e.g., a symmetric mode) and/or a non-fundamental mode (e.g., asymmetric mode). in the embodiments of 1000 ″ and 1000 ′″, for a wire 702 having an insulated outer surface, the guided wave 908 can propagate in part on the outer surface of the insulator and in part inside the insulator. in embodiments, the guided wave 908 can propagate substantially or completely on the outer surface of the insulator, or substantially or completely inside the insulator. in the embodiments of 1000 ″ and 1000 ′″, for a wire 702 that is a bare conductor, the guided wave 908 can propagate in part on the outer surface of the conductor and in part inside the conductor. in another embodiment, the guided wave 908 can propagate substantially or completely on the outer surface of the conductor. referring now to fig. 11 , a block diagram 1100 illustrating an example, non-limiting embodiment of a dual stub coupler is shown. in particular, a dual coupler design is presented for use in a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 . in an embodiment, two or more couplers (such as the stub couplers 1104 and 1106 ) can be positioned around a wire 1102 in order to receive guided wave 1108 . in an embodiment, one coupler is enough to receive the guided wave 1108 . in that case, guided wave 1108 couples to coupler 1104 and propagates as guided wave 1110 . if the field structure of the guided wave 1108 oscillates or undulates around the wire 1102 due to the particular guided wave mode(s) or various outside factors, then coupler 1106 can be placed such that guided wave 1108 couples to coupler 1106 . in some embodiments, four or more couplers can be placed around a portion of the wire 1102 , e.g., at 90 degrees or another spacing with respect to each other, in order to receive guided waves that may oscillate or rotate around the wire 1102 , that have been induced at different azimuthal orientations or that have non-fundamental or higher order modes that, for example, have lobes and/or nulls or other asymmetries that are orientation dependent. however, it will be appreciated that there may be less than or more than four couplers placed around a portion of the wire 1102 without departing from example embodiments. it should be noted that while couplers 1106 and 1104 are illustrated as stub couplers, any other of the coupler designs described herein including arc couplers, antenna or horn couplers, magnetic couplers, etc., could likewise be used. it will also be appreciated that while some example embodiments have presented a plurality of couplers around at least a portion of a wire 1102 , this plurality of couplers can also be considered as part of a single coupler system having multiple coupler subcomponents. for example, two or more couplers can be manufactured as single system that can be installed around a wire in a single installation such that the couplers are either pre-positioned or adjustable relative to each other (either manually or automatically with a controllable mechanism such as a motor or other actuator) in accordance with the single system. receivers coupled to couplers 1106 and 1104 can use diversity combining to combine signals received from both couplers 1106 and 1104 in order to maximize the signal quality. in other embodiments, if one or the other of the couplers 1104 and 1106 receive a transmission that is above a predetermined threshold, receivers can use selection diversity when deciding which signal to use. further, while reception by a plurality of couplers 1106 and 1104 is illustrated, transmission by couplers 1106 and 1104 in the same configuration can likewise take place. in particular, a wide range of multi-input multi-output (mimo) transmission and reception techniques can be employed for transmissions where a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 includes multiple transceivers and multiple couplers. it is noted that the graphical representations of waves 1108 and 1110 are presented merely to illustrate the principles that guided wave 1108 induces or otherwise launches a wave 1110 on a coupler 1104 . the actual electric and magnetic fields generated as a result of such wave propagation may vary depending on the frequencies employed, the design of the coupler 1104 , the dimensions and composition of the wire 1102 , as well as its surface characteristics, its insulation if any, the electromagnetic properties of the surrounding environment, etc. referring now to fig. 12 , a block diagram 1200 illustrating an example, non-limiting embodiment of a repeater system is shown. in particular, a repeater device 1210 is presented for use in a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 . in this system, two couplers 1204 and 1214 can be placed near a wire 1202 or other transmission medium such that guided waves 1205 propagating along the wire 1202 are extracted by coupler 1204 as wave 1206 (e.g. as a guided wave), and then are boosted or repeated by repeater device 1210 and launched as a wave 1216 (e.g. as a guided wave) onto coupler 1214 . the wave 1216 can then be launched on the wire 1202 and continue to propagate along the wire 1202 as a guided wave 1217 . in an embodiment, the repeater device 1210 can receive at least a portion of the power utilized for boosting or repeating through magnetic coupling with the wire 1202 , for example, when the wire 1202 is a power line or otherwise contains a power-carrying conductor. it should be noted that while couplers 1204 and 1214 are illustrated as stub couplers, any other of the coupler designs described herein including arc couplers, antenna or horn couplers, magnetic couplers, or the like, could likewise be used. in some embodiments, repeater device 1210 can repeat the transmission associated with wave 1206 , and in other embodiments, repeater device 1210 can include a communications interface 205 that extracts data or other signals from the wave 1206 for supplying such data or signals to another network and/or one or more other devices as communication signals 110 or 112 and/or receiving communication signals 110 or 112 from another network and/or one or more other devices and launch guided wave 1216 having embedded therein the received communication signals 110 or 112 . in a repeater configuration, receiver waveguide 1208 can receive the wave 1206 from the coupler 1204 and transmitter waveguide 1212 can launch guided wave 1216 onto coupler 1214 as guided wave 1217 . between receiver waveguide 1208 and transmitter waveguide 1212 , the signal embedded in guided wave 1206 and/or the guided wave 1216 itself can be amplified to correct for signal loss and other inefficiencies associated with guided wave communications or the signal can be received and processed to extract the data contained therein and regenerated for transmission. in an embodiment, the receiver waveguide 1208 can be configured to extract data from the signal, process the data to correct for data errors utilizing for example error correcting codes, and regenerate an updated signal with the corrected data. the transmitter waveguide 1212 can then transmit guided wave 1216 with the updated signal embedded therein. in an embodiment, a signal embedded in guided wave 1206 can be extracted from the transmission and processed for communication with another network and/or one or more other devices via communications interface 205 as communication signals 110 or 112 . similarly, communication signals 110 or 112 received by the communications interface 205 can be inserted into a transmission of guided wave 1216 that is generated and launched onto coupler 1214 by transmitter waveguide 1212 . it is noted that although fig. 12 shows guided wave transmissions 1206 and 1216 entering from the left and exiting to the right respectively, this is merely a simplification and is not intended to be limiting. in other embodiments, receiver waveguide 1208 and transmitter waveguide 1212 can also function as transmitters and receivers respectively, allowing the repeater device 1210 to be bi-directional. in an embodiment, repeater device 1210 can be placed at locations where there are discontinuities or obstacles on the wire 1202 or other transmission medium. in the case where the wire 1202 is a power line, these obstacles can include transformers, connections, utility poles, and other such power line devices. the repeater device 1210 can help the guided (e.g., surface) waves jump over these obstacles on the line and boost the transmission power at the same time. in other embodiments, a coupler can be used to jump over the obstacle without the use of a repeater device. in that embodiment, both ends of the coupler can be tied or fastened to the wire, thus providing a path for the guided wave to travel without being blocked by the obstacle. turning now to fig. 13 , illustrated is a block diagram 1300 of an example, non-limiting embodiment of a bidirectional repeater in accordance with various aspects described herein. in particular, a bidirectional repeater device 1306 is presented for use in a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 . it should be noted that while the couplers are illustrated as stub couplers, any other of the coupler designs described herein including arc couplers, antenna or horn couplers, magnetic couplers, or the like, could likewise be used. the bidirectional repeater 1306 can employ diversity paths in the case of when two or more wires or other transmission media are present. since guided wave transmissions have different transmission efficiencies and coupling efficiencies for transmission medium of different types such as insulated wires, un-insulated wires or other types of transmission media and further, if exposed to the elements, can be affected by weather, and other atmospheric conditions, it can be advantageous to selectively transmit on different transmission media at certain times. in various embodiments, the various transmission media can be designated as a primary, secondary, tertiary, etc. whether or not such designation indicates a preference of one transmission medium over another. in the embodiment shown, the transmission media include an insulated or uninsulated wire 1302 and an insulated or uninsulated wire 1304 (referred to herein as wires 1302 and 1304 , respectively). the repeater device 1306 uses a receiver coupler 1308 to receive a guided wave traveling along wire 1302 and repeats the transmission using transmitter waveguide 1310 as a guided wave along wire 1304 . in other embodiments, repeater device 1306 can switch from the wire 1304 to the wire 1302 , or can repeat the transmissions along the same paths. repeater device 1306 can include sensors, or be in communication with sensors (or a network management system 1601 depicted in fig. 16a ) that indicate conditions that can affect the transmission. based on the feedback received from the sensors, the repeater device 1306 can make the determination about whether to keep the transmission along the same wire, or transfer the transmission to the other wire. turning now to fig. 14 , illustrated is a block diagram 1400 illustrating an example, non-limiting embodiment of a bidirectional repeater system. in particular, a bidirectional repeater system is presented for use in a transmission device, such as transmission device 101 or 102 presented in conjunction with fig. 1 . the bidirectional repeater system includes waveguide coupling devices 1402 and 1404 that receive and transmit transmissions from other coupling devices located in a distributed antenna system or backhaul system. in various embodiments, waveguide coupling device 1402 can receive a transmission from another waveguide coupling device, wherein the transmission has a plurality of subcarriers. diplexer 1406 can separate the transmission from other transmissions, and direct the transmission to low-noise amplifier (“lna”) 1408 . a frequency mixer 1428 , with help from a local oscillator 1412 , can downshift the transmission (which is in the millimeter-wave band or around 38 ghz in some embodiments) to a lower frequency, such as a cellular band (˜1.9 ghz) for a distributed antenna system, a native frequency, or other frequency for a backhaul system. an extractor (or demultiplexer) 1432 can extract the signal on a subcarrier and direct the signal to an output component 1422 for optional amplification, buffering or isolation by power amplifier 1424 for coupling to communications interface 205 . the communications interface 205 can further process the signals received from the power amplifier 1424 or otherwise transmit such signals over a wireless or wired interface to other devices such as a base station, mobile devices, a building, etc. for the signals that are not being extracted at this location, extractor 1432 can redirect them to another frequency mixer 1436 , where the signals are used to modulate a carrier wave generated by local oscillator 1414 . the carrier wave, with its subcarriers, is directed to a power amplifier (“pa”) 1416 and is retransmitted by waveguide coupling device 1404 to another system, via diplexer 1420 . an lna 1426 can be used to amplify, buffer or isolate signals that are received by the communication interface 205 and then send the signal to a multiplexer 1434 which merges the signal with signals that have been received from waveguide coupling device 1404 . the signals received from coupling device 1404 have been split by diplexer 1420 , and then passed through lna 1418 , and downshifted in frequency by frequency mixer 1438 . when the signals are combined by multiplexer 1434 , they are upshifted in frequency by frequency mixer 1430 , and then boosted by pa 1410 , and transmitted to another system by waveguide coupling device 1402 . in an embodiment bidirectional repeater system can be merely a repeater without the output device 1422 . in this embodiment, the multiplexer 1434 would not be utilized and signals from lna 1418 would be directed to mixer 1430 as previously described. it will be appreciated that in some embodiments, the bidirectional repeater system could also be implemented using two distinct and separate unidirectional repeaters. in an alternative embodiment, a bidirectional repeater system could also be a booster or otherwise perform retransmissions without downshifting and upshifting. indeed in example embodiment, the retransmissions can be based upon receiving a signal or guided wave and performing some signal or guided wave processing or reshaping, filtering, and/or amplification, prior to retransmission of the signal or guided wave. referring now to fig. 15 , a block diagram 1500 illustrating an example, non-limiting embodiment of a guided wave communications system is shown. this diagram depicts an exemplary environment in which a guided wave communication system, such as the guided wave communication system presented in conjunction with fig. 1 , can be used. to provide network connectivity to additional base station devices, a backhaul network that links the communication cells (e.g., macrocells and macrocells) to network devices of a core network correspondingly expands. similarly, to provide network connectivity to a distributed antenna system, an extended communication system that links base station devices and their distributed antennas is desirable. a guided wave communication system 1500 such as shown in fig. 15 can be provided to enable alternative, increased or additional network connectivity and a waveguide coupling system can be provided to transmit and/or receive guided wave (e.g., surface wave) communications on a transmission medium such as a wire that operates as a single-wire transmission line (e.g., a utility line), and that can be used as a waveguide and/or that otherwise operates to guide the transmission of an electromagnetic wave. the guided wave communication system 1500 can comprise a first instance of a distribution system 1550 that includes one or more base station devices (e.g., base station device 1504 ) that are communicably coupled to a central office 1501 and/or a macrocell site 1502 . base station device 1504 can be connected by a wired (e.g., fiber and/or cable), or by a wireless (e.g., microwave wireless) connection to the macrocell site 1502 and the central office 1501 . a second instance of the distribution system 1560 can be used to provide wireless voice and data services to mobile device 1522 and to residential and/or commercial establishments 1542 (herein referred to as establishments 1542 ). system 1500 can have additional instances of the distribution systems 1550 and 1560 for providing voice and/or data services to mobile devices 1522 - 1524 and establishments 1542 as shown in fig. 15 . macrocells such as macrocell site 1502 can have dedicated connections to a mobile network and base station device 1504 or can share and/or otherwise use another connection. central office 1501 can be used to distribute media content and/or provide internet service provider (isp) services to mobile devices 1522 - 1524 and establishments 1542 . the central office 1501 can receive media content from a constellation of satellites 1530 (one of which is shown in fig. 15 ) or other sources of content, and distribute such content to mobile devices 1522 - 1524 and establishments 1542 via the first and second instances of the distribution system 1550 and 1560 . the central office 1501 can also be communicatively coupled to the internet 1503 for providing internet data services to mobile devices 1522 - 1524 and establishments 1542 . base station device 1504 can be mounted on, or attached to, utility pole 1516 . in other embodiments, base station device 1504 can be near transformers and/or other locations situated nearby a power line. base station device 1504 can facilitate connectivity to a mobile network for mobile devices 1522 and 1524 . antennas 1512 and 1514 , mounted on or near utility poles 1518 and 1520 , respectively, can receive signals from base station device 1504 and transmit those signals to mobile devices 1522 and 1524 over a much wider area than if the antennas 1512 and 1514 were located at or near base station device 1504 . it is noted that fig. 15 displays three utility poles, in each instance of the distribution systems 1550 and 1560 , with one base station device, for purposes of simplicity. in other embodiments, utility pole 1516 can have more base station devices, and more utility poles with distributed antennas and/or tethered connections to establishments 1542 . a transmission device 1506 , such as transmission device 101 or 102 presented in conjunction with fig. 1 , can transmit a signal from base station device 1504 to antennas 1512 and 1514 via utility or power line(s) that connect the utility poles 1516 , 1518 , and 1520 . to transmit the signal, radio source and/or transmission device 1506 upconverts the signal (e.g., via frequency mixing) from base station device 1504 or otherwise converts the signal from the base station device 1504 to a microwave band signal and the transmission device 1506 launches a microwave band wave that propagates as a guided wave traveling along the utility line or other wire as described in previous embodiments. at utility pole 1518 , another transmission device 1508 receives the guided wave (and optionally can amplify it as needed or desired or operate as a repeater to receive it and regenerate it) and sends it forward as a guided wave on the utility line or other wire. the transmission device 1508 can also extract a signal from the microwave band guided wave and shift it down in frequency or otherwise convert it to its original cellular band frequency (e.g., 1.9 ghz or other defined cellular frequency) or another cellular (or non-cellular) band frequency. an antenna 1512 can wireless transmit the downshifted signal to mobile device 1522 . the process can be repeated by transmission device 1510 , antenna 1514 and mobile device 1524 , as necessary or desirable. transmissions from mobile devices 1522 and 1524 can also be received by antennas 1512 and 1514 respectively. the transmission devices 1508 and 1510 can upshift or otherwise convert the cellular band signals to microwave band and transmit the signals as guided wave (e.g., surface wave or other electromagnetic wave) transmissions over the power line(s) to base station device 1504 . media content received by the central office 1501 can be supplied to the second instance of the distribution system 1560 via the base station device 1504 for distribution to mobile devices 1522 and establishments 1542 . the transmission device 1510 can be tethered to the establishments 1542 by one or more wired connections or a wireless interface. the one or more wired connections may include without limitation, a power line, a coaxial cable, a fiber cable, a twisted pair cable, a guided wave transmission medium or other suitable wired mediums for distribution of media content and/or for providing internet services. in an example embodiment, the wired connections from the transmission device 1510 can be communicatively coupled to one or more very high bit rate digital subscriber line (vdsl) modems located at one or more corresponding service area interfaces (sais—not shown) or pedestals, each sai or pedestal providing services to a portion of the establishments 1542 . the vdsl modems can be used to selectively distribute media content and/or provide internet services to gateways (not shown) located in the establishments 1542 . the sais or pedestals can also be communicatively coupled to the establishments 1542 over a wired medium such as a power line, a coaxial cable, a fiber cable, a twisted pair cable, a guided wave transmission medium or other suitable wired mediums. in other example embodiments, the transmission device 1510 can be communicatively coupled directly to establishments 1542 without intermediate interfaces such as the sais or pedestals. in another example embodiment, system 1500 can employ diversity paths, where two or more utility lines or other wires are strung between the utility poles 1516 , 1518 , and 1520 (e.g., for example, two or more wires between poles 1516 and 1520 ) and redundant transmissions from base station/macrocell site 1502 are transmitted as guided waves down the surface of the utility lines or other wires. the utility lines or other wires can be either insulated or uninsulated, and depending on the environmental conditions that cause transmission losses, the coupling devices can selectively receive signals from the insulated or uninsulated utility lines or other wires. the selection can be based on measurements of the signal-to-noise ratio of the wires, or based on determined weather/environmental conditions (e.g., moisture detectors, weather forecasts, etc.). the use of diversity paths with system 1500 can enable alternate routing capabilities, load balancing, increased load handling, concurrent bi-directional or synchronous communications, spread spectrum communications, etc. it is noted that the use of the transmission devices 1506 , 1508 , and 1510 in fig. 15 are by way of example only, and that in other embodiments, other uses are possible. for instance, transmission devices can be used in a backhaul communication system, providing network connectivity to base station devices. transmission devices 1506 , 1508 , and 1510 can be used in many circumstances where it is desirable to transmit guided wave communications over a wire, whether insulated or not insulated. transmission devices 1506 , 1508 , and 1510 are improvements over other coupling devices due to no contact or limited physical and/or electrical contact with the wires that may carry high voltages. the transmission device can be located away from the wire (e.g., spaced apart from the wire) and/or located on the wire so long as it is not electrically in contact with the wire, as the dielectric acts as an insulator, allowing for cheap, easy, and/or less complex installation. however, as previously noted conducting or non-dielectric couplers can be employed, for example in configurations where the wires correspond to a telephone network, cable television network, broadband data service, fiber optic communications system or other network employing low voltages or having insulated transmission lines. it is further noted, that while base station device 1504 and macrocell site 1502 are illustrated in an embodiment, other network configurations are likewise possible. for example, devices such as access points or other wireless gateways can be employed in a similar fashion to extend the reach of other networks such as a wireless local area network, a wireless personal area network or other wireless network that operates in accordance with a communication protocol such as a 802.11 protocol, wimax protocol, ultrawideband protocol, bluetooth protocol, zigbee protocol or other wireless protocol. referring now to figs. 16a & 16b , block diagrams illustrating an example, non-limiting embodiment of a system for managing a power grid communication system are shown. considering fig. 16a , a waveguide system 1602 is presented for use in a guided wave communications system, such as the system presented in conjunction with fig. 15 . the waveguide system 1602 can comprise sensors 1604 , a power management system 1605 , a transmission device 101 or 102 that includes at least one communication interface 205 , transceiver 210 and coupler 220 . the waveguide system 1602 can be coupled to a power line 1610 for facilitating guided wave communications in accordance with embodiments described in the subject disclosure. in an example embodiment, the transmission device 101 or 102 includes coupler 220 for inducing electromagnetic waves on a surface of the power line 1610 that longitudinally propagate along the surface of the power line 1610 as described in the subject disclosure. the transmission device 101 or 102 can also serve as a repeater for retransmitting electromagnetic waves on the same power line 1610 or for routing electromagnetic waves between power lines 1610 as shown in figs. 12-13 . the transmission device 101 or 102 includes transceiver 210 configured to, for example, up-convert a signal operating at an original frequency range to electromagnetic waves operating at, exhibiting, or associated with a carrier frequency that propagate along a coupler to induce corresponding guided electromagnetic waves that propagate along a surface of the power line 1610 . a carrier frequency can be represented by a center frequency having upper and lower cutoff frequencies that define the bandwidth of the electromagnetic waves. the power line 1610 can be a wire (e.g., single stranded or multi-stranded) having a conducting surface or insulated surface. the transceiver 210 can also receive signals from the coupler 220 and down-convert the electromagnetic waves operating at a carrier frequency to signals at their original frequency. signals received by the communications interface 205 of transmission device 101 or 102 for up-conversion can include without limitation signals supplied by a central office 1611 over a wired or wireless interface of the communications interface 205 , a base station 1614 over a wired or wireless interface of the communications interface 205 , wireless signals transmitted by mobile devices 1620 to the base station 1614 for delivery over the wired or wireless interface of the communications interface 205 , signals supplied by in-building communication devices 1618 over the wired or wireless interface of the communications interface 205 , and/or wireless signals supplied to the communications interface 205 by mobile devices 1612 roaming in a wireless communication range of the communications interface 205 . in embodiments where the waveguide system 1602 functions as a repeater, such as shown in figs. 12-13 , the communications interface 205 may or may not be included in the waveguide system 1602 . the electromagnetic waves propagating along the surface of the power line 1610 can be modulated and formatted to include packets or frames of data that include a data payload and further include networking information (such as header information for identifying one or more destination waveguide systems 1602 ). the networking information may be provided by the waveguide system 1602 or an originating device such as the central office 1611 , the base station 1614 , mobile devices 1620 , or in-building devices 1618 , or a combination thereof. additionally, the modulated electromagnetic waves can include error correction data for mitigating signal disturbances. the networking information and error correction data can be used by a destination waveguide system 1602 for detecting transmissions directed to it, and for down-converting and processing with error correction data transmissions that include voice and/or data signals directed to recipient communication devices communicatively coupled to the destination waveguide system 1602 . referring now to the sensors 1604 of the waveguide system 1602 , the sensors 1604 can comprise one or more of a temperature sensor 1604 a , a disturbance detection sensor 1604 b , a loss of energy sensor 1604 c , a noise sensor 1604 d , a vibration sensor 1604 e , an environmental (e.g., weather) sensor 1604 f , and/or an image sensor 1604 g . the temperature sensor 1604 a can be used to measure ambient temperature, a temperature of the transmission device 101 or 102 , a temperature of the power line 1610 , temperature differentials (e.g., compared to a setpoint or baseline, between transmission device 101 or 102 and 1610 , etc.), or any combination thereof. in one embodiment, temperature metrics can be collected and reported periodically to a network management system 1601 by way of the base station 1614 . the disturbance detection sensor 1604 b can perform measurements on the power line 1610 to detect disturbances such as signal reflections, which may indicate a presence of a downstream disturbance that may impede the propagation of electromagnetic waves on the power line 1610 . a signal reflection can represent a distortion resulting from, for example, an electromagnetic wave transmitted on the power line 1610 by the transmission device 101 or 102 that reflects in whole or in part back to the transmission device 101 or 102 from a disturbance in the power line 1610 located downstream from the transmission device 101 or 102 . signal reflections can be caused by obstructions on the power line 1610 . for example, a tree limb may cause electromagnetic wave reflections when the tree limb is lying on the power line 1610 , or is in close proximity to the power line 1610 which may cause a corona discharge. other obstructions that can cause electromagnetic wave reflections can include without limitation an object that has been entangled on the power line 1610 (e.g., clothing, a shoe wrapped around a power line 1610 with a shoe string, etc.), a corroded build-up on the power line 1610 or an ice build-up. power grid components may also impede or obstruct with the propagation of electromagnetic waves on the surface of power lines 1610 . illustrations of power grid components that may cause signal reflections include without limitation a transformer and a joint for connecting spliced power lines. a sharp angle on the power line 1610 may also cause electromagnetic wave reflections. the disturbance detection sensor 1604 b can comprise a circuit to compare magnitudes of electromagnetic wave reflections to magnitudes of original electromagnetic waves transmitted by the transmission device 101 or 102 to determine how much a downstream disturbance in the power line 1610 attenuates transmissions. the disturbance detection sensor 1604 b can further comprise a spectral analyzer circuit for performing spectral analysis on the reflected waves. the spectral data generated by the spectral analyzer circuit can be compared with spectral profiles via pattern recognition, an expert system, curve fitting, matched filtering or other artificial intelligence, classification or comparison technique to identify a type of disturbance based on, for example, the spectral profile that most closely matches the spectral data. the spectral profiles can be stored in a memory of the disturbance detection sensor 1604 b or may be remotely accessible by the disturbance detection sensor 1604 b . the profiles can comprise spectral data that models different disturbances that may be encountered on power lines 1610 to enable the disturbance detection sensor 1604 b to identify disturbances locally. an identification of the disturbance if known can be reported to the network management system 1601 by way of the base station 1614 . the disturbance detection sensor 1604 b can also utilize the transmission device 101 or 102 to transmit electromagnetic waves as test signals to determine a roundtrip time for an electromagnetic wave reflection. the round trip time measured by the disturbance detection sensor 1604 b can be used to calculate a distance traveled by the electromagnetic wave up to a point where the reflection takes place, which enables the disturbance detection sensor 1604 b to calculate a distance from the transmission device 101 or 102 to the downstream disturbance on the power line 1610 . the distance calculated can be reported to the network management system 1601 by way of the base station 1614 . in one embodiment, the location of the waveguide system 1602 on the power line 1610 may be known to the network management system 1601 , which the network management system 1601 can use to determine a location of the disturbance on the power line 1610 based on a known topology of the power grid. in another embodiment, the waveguide system 1602 can provide its location to the network management system 1601 to assist in the determination of the location of the disturbance on the power line 1610 . the location of the waveguide system 1602 can be obtained by the waveguide system 1602 from a pre-programmed location of the waveguide system 1602 stored in a memory of the waveguide system 1602 , or the waveguide system 1602 can determine its location using a gps receiver (not shown) included in the waveguide system 1602 . the power management system 1605 provides energy to the aforementioned components of the waveguide system 1602 . the power management system 1605 can receive energy from solar cells, or from a transformer (not shown) coupled to the power line 1610 , or by inductive coupling to the power line 1610 or another nearby power line. the power management system 1605 can also include a backup battery and/or a super capacitor or other capacitor circuit for providing the waveguide system 1602 with temporary power. the loss of energy sensor 1604 c can be used to detect when the waveguide system 1602 has a loss of power condition and/or the occurrence of some other malfunction. for example, the loss of energy sensor 1604 c can detect when there is a loss of power due to defective solar cells, an obstruction on the solar cells that causes them to malfunction, loss of power on the power line 1610 , and/or when the backup power system malfunctions due to expiration of a backup battery, or a detectable defect in a super capacitor. when a malfunction and/or loss of power occurs, the loss of energy sensor 1604 c can notify the network management system 1601 by way of the base station 1614 . the noise sensor 1604 d can be used to measure noise on the power line 1610 that may adversely affect transmission of electromagnetic waves on the power line 1610 . the noise sensor 1604 d can sense unexpected electromagnetic interference, noise bursts, or other sources of disturbances that may interrupt reception of modulated electromagnetic waves on a surface of a power line 1610 . a noise burst can be caused by, for example, a corona discharge, or other source of noise. the noise sensor 1604 d can compare the measured noise to a noise profile obtained by the waveguide system 1602 from an internal database of noise profiles or from a remotely located database that stores noise profiles via pattern recognition, an expert system, curve fitting, matched filtering or other artificial intelligence, classification or comparison technique. from the comparison, the noise sensor 1604 d may identify a noise source (e.g., corona discharge or otherwise) based on, for example, the noise profile that provides the closest match to the measured noise. the noise sensor 1604 d can also detect how noise affects transmissions by measuring transmission metrics such as bit error rate, packet loss rate, jitter, packet retransmission requests, etc. the noise sensor 1604 d can report to the network management system 1601 by way of the base station 1614 the identity of noise sources, their time of occurrence, and transmission metrics, among other things. the vibration sensor 1604 e can include accelerometers and/or gyroscopes to detect 2d or 3d vibrations on the power line 1610 . the vibrations can be compared to vibration profiles that can be stored locally in the waveguide system 1602 , or obtained by the waveguide system 1602 from a remote database via pattern recognition, an expert system, curve fitting, matched filtering or other artificial intelligence, classification or comparison technique. vibration profiles can be used, for example, to distinguish fallen trees from wind gusts based on, for example, the vibration profile that provides the closest match to the measured vibrations. the results of this analysis can be reported by the vibration sensor 1604 e to the network management system 1601 by way of the base station 1614 . the environmental sensor 1604 f can include a barometer for measuring atmospheric pressure, ambient temperature (which can be provided by the temperature sensor 1604 a ), wind speed, humidity, wind direction, and rainfall, among other things. the environmental sensor 1604 f can collect raw information and process this information by comparing it to environmental profiles that can be obtained from a memory of the waveguide system 1602 or a remote database to predict weather conditions before they arise via pattern recognition, an expert system, knowledge-based system or other artificial intelligence, classification or other weather modeling and prediction technique. the environmental sensor 1604 f can report raw data as well as its analysis to the network management system 1601 . the image sensor 1604 g can be a digital camera (e.g., a charged coupled device or ccd imager, infrared camera, etc.) for capturing images in a vicinity of the waveguide system 1602 . the image sensor 1604 g can include an electromechanical mechanism to control movement (e.g., actual position or focal points/zooms) of the camera for inspecting the power line 1610 from multiple perspectives (e.g., top surface, bottom surface, left surface, right surface and so on). alternatively, the image sensor 1604 g can be designed such that no electromechanical mechanism is needed in order to obtain the multiple perspectives. the collection and retrieval of imaging data generated by the image sensor 1604 g can be controlled by the network management system 1601 , or can be autonomously collected and reported by the image sensor 1604 g to the network management system 1601 . other sensors that may be suitable for collecting telemetry information associated with the waveguide system 1602 and/or the power lines 1610 for purposes of detecting, predicting and/or mitigating disturbances that can impede the propagation of electromagnetic wave transmissions on power lines 1610 (or any other form of a transmission medium of electromagnetic waves) may be utilized by the waveguide system 1602 . referring now to fig. 16b , block diagram 1650 illustrates an example, non-limiting embodiment of a system for managing a power grid 1653 and a communication system 1655 embedded therein or associated therewith in accordance with various aspects described herein. the communication system 1655 comprises a plurality of waveguide systems 1602 coupled to power lines 1610 of the power grid 1653 . at least a portion of the waveguide systems 1602 used in the communication system 1655 can be in direct communication with a base station 1614 and/or the network management system 1601 . waveguide systems 1602 not directly connected to a base station 1614 or the network management system 1601 can engage in communication sessions with either a base station 1614 or the network management system 1601 by way of other downstream waveguide systems 1602 connected to a base station 1614 or the network management system 1601 . the network management system 1601 can be communicatively coupled to equipment of a utility company 1652 and equipment of a communications service provider 1654 for providing each entity, status information associated with the power grid 1653 and the communication system 1655 , respectively. the network management system 1601 , the equipment of the utility company 1652 , and the communications service provider 1654 can access communication devices utilized by utility company personnel 1656 and/or communication devices utilized by communications service provider personnel 1658 for purposes of providing status information and/or for directing such personnel in the management of the power grid 1653 and/or communication system 1655 . fig. 17a illustrates a flow diagram of an example, non-limiting embodiment of a method 1700 for detecting and mitigating disturbances occurring in a communication network of the systems of figs. 16a & 16b . method 1700 can begin with step 1702 where a waveguide system 1602 transmits and receives messages embedded in, or forming part of, modulated electromagnetic waves or another type of electromagnetic waves traveling along a surface of a power line 1610 . the messages can be voice messages, streaming video, and/or other data/information exchanged between communication devices communicatively coupled to the communication system 1655 . at step 1704 the sensors 1604 of the waveguide system 1602 can collect sensing data. in an embodiment, the sensing data can be collected in step 1704 prior to, during, or after the transmission and/or receipt of messages in step 1702 . at step 1706 the waveguide system 1602 (or the sensors 1604 themselves) can determine from the sensing data an actual or predicted occurrence of a disturbance in the communication system 1655 that can affect communications originating from (e.g., transmitted by) or received by the waveguide system 1602 . the waveguide system 1602 (or the sensors 1604 ) can process temperature data, signal reflection data, loss of energy data, noise data, vibration data, environmental data, or any combination thereof to make this determination. the waveguide system 1602 (or the sensors 1604 ) may also detect, identify, estimate, or predict the source of the disturbance and/or its location in the communication system 1655 . if a disturbance is neither detected/identified nor predicted/estimated at step 1708 , the waveguide system 1602 can proceed to step 1702 where it continues to transmit and receive messages embedded in, or forming part of, modulated electromagnetic waves traveling along a surface of the power line 1610 . if at step 1708 a disturbance is detected/identified or predicted/estimated to occur, the waveguide system 1602 proceeds to step 1710 to determine if the disturbance adversely affects (or alternatively, is likely to adversely affect or the extent to which it may adversely affect) transmission or reception of messages in the communication system 1655 . in one embodiment, a duration threshold and a frequency of occurrence threshold can be used at step 1710 to determine when a disturbance adversely affects communications in the communication system 1655 . for illustration purposes only, assume a duration threshold is set to 500 ms, while a frequency of occurrence threshold is set to 5 disturbances occurring in an observation period of 10 sec. thus, a disturbance having a duration greater than 500 ms will trigger the duration threshold. additionally, any disturbance occurring more than 5 times in a 10 sec time interval will trigger the frequency of occurrence threshold. in one embodiment, a disturbance may be considered to adversely affect signal integrity in the communication systems 1655 when the duration threshold alone is exceeded. in another embodiment, a disturbance may be considered as adversely affecting signal integrity in the communication systems 1655 when both the duration threshold and the frequency of occurrence threshold are exceeded. the latter embodiment is thus more conservative than the former embodiment for classifying disturbances that adversely affect signal integrity in the communication system 1655 . it will be appreciated that many other algorithms and associated parameters and thresholds can be utilized for step 1710 in accordance with example embodiments. referring back to method 1700 , if at step 1710 the disturbance detected at step 1708 does not meet the condition for adversely affected communications (e.g., neither exceeds the duration threshold nor the frequency of occurrence threshold), the waveguide system 1602 may proceed to step 1702 and continue processing messages. for instance, if the disturbance detected in step 1708 has a duration of 1 msec with a single occurrence in a 10 sec time period, then neither threshold will be exceeded. consequently, such a disturbance may be considered as having a nominal effect on signal integrity in the communication system 1655 and thus would not be flagged as a disturbance requiring mitigation. although not flagged, the occurrence of the disturbance, its time of occurrence, its frequency of occurrence, spectral data, and/or other useful information, may be reported to the network management system 1601 as telemetry data for monitoring purposes. referring back to step 1710 , if on the other hand the disturbance satisfies the condition for adversely affected communications (e.g., exceeds either or both thresholds), the waveguide system 1602 can proceed to step 1712 and report the incident to the network management system 1601 . the report can include raw sensing data collected by the sensors 1604 , a description of the disturbance if known by the waveguide system 1602 , a time of occurrence of the disturbance, a frequency of occurrence of the disturbance, a location associated with the disturbance, parameters readings such as bit error rate, packet loss rate, retransmission requests, jitter, latency and so on. if the disturbance is based on a prediction by one or more sensors of the waveguide system 1602 , the report can include a type of disturbance expected, and if predictable, an expected time occurrence of the disturbance, and an expected frequency of occurrence of the predicted disturbance when the prediction is based on historical sensing data collected by the sensors 1604 of the waveguide system 1602 . at step 1714 , the network management system 1601 can determine a mitigation, circumvention, or correction technique, which may include directing the waveguide system 1602 to reroute traffic to circumvent the disturbance if the location of the disturbance can be determined. in one embodiment, the waveguide coupling device 1402 detecting the disturbance may direct a repeater such as the one shown in figs. 13-14 to connect the waveguide system 1602 from a primary power line affected by the disturbance to a secondary power line to enable the waveguide system 1602 to reroute traffic to a different transmission medium and avoid the disturbance. in an embodiment where the waveguide system 1602 is configured as a repeater the waveguide system 1602 can itself perform the rerouting of traffic from the primary power line to the secondary power line. it is further noted that for bidirectional communications (e.g., full or half-duplex communications), the repeater can be configured to reroute traffic from the secondary power line back to the primary power line for processing by the waveguide system 1602 . in another embodiment, the waveguide system 1602 can redirect traffic by instructing a first repeater situated upstream of the disturbance and a second repeater situated downstream of the disturbance to redirect traffic from a primary power line temporarily to a secondary power line and back to the primary power line in a manner that avoids the disturbance. it is further noted that for bidirectional communications (e.g., full or half-duplex communications), repeaters can be configured to reroute traffic from the secondary power line back to the primary power line. to avoid interrupting existing communication sessions occurring on a secondary power line, the network management system 1601 may direct the waveguide system 1602 to instruct repeater(s) to utilize unused time slot(s) and/or frequency band(s) of the secondary power line for redirecting data and/or voice traffic away from the primary power line to circumvent the disturbance. at step 1716 , while traffic is being rerouted to avoid the disturbance, the network management system 1601 can notify equipment of the utility company 1652 and/or equipment of the communications service provider 1654 , which in turn may notify personnel of the utility company 1656 and/or personnel of the communications service provider 1658 of the detected disturbance and its location if known. field personnel from either party can attend to resolving the disturbance at a determined location of the disturbance. once the disturbance is removed or otherwise mitigated by personnel of the utility company and/or personnel of the communications service provider, such personnel can notify their respective companies and/or the network management system 1601 utilizing field equipment (e.g., a laptop computer, smartphone, etc.) communicatively coupled to network management system 1601 , and/or equipment of the utility company and/or the communications service provider. the notification can include a description of how the disturbance was mitigated and any changes to the power lines 1610 that may change a topology of the communication system 1655 . once the disturbance has been resolved (as determined in decision 1718 ), the network management system 1601 can direct the waveguide system 1602 at step 1720 to restore the previous routing configuration used by the waveguide system 1602 or route traffic according to a new routing configuration if the restoration strategy used to mitigate the disturbance resulted in a new network topology of the communication system 1655 . in another embodiment, the waveguide system 1602 can be configured to monitor mitigation of the disturbance by transmitting test signals on the power line 1610 to determine when the disturbance has been removed. once the waveguide system 1602 detects an absence of the disturbance it can autonomously restore its routing configuration without assistance by the network management system 1601 if it determines the network topology of the communication system 1655 has not changed, or it can utilize a new routing configuration that adapts to a detected new network topology. fig. 17b illustrates a flow diagram of an example, non-limiting embodiment of a method 1750 for detecting and mitigating disturbances occurring in a communication network of the system of figs. 16a and 16b . in one embodiment, method 1750 can begin with step 1752 where a network management system 1601 receives from equipment of the utility company 1652 or equipment of the communications service provider 1654 maintenance information associated with a maintenance schedule. the network management system 1601 can at step 1754 identify from the maintenance information, maintenance activities to be performed during the maintenance schedule. from these activities, the network management system 1601 can detect a disturbance resulting from the maintenance (e.g., scheduled replacement of a power line 1610 , scheduled replacement of a waveguide system 1602 on the power line 1610 , scheduled reconfiguration of power lines 1610 in the power grid 1653 , etc.). in another embodiment, the network management system 1601 can receive at step 1755 telemetry information from one or more waveguide systems 1602 . the telemetry information can include among other things an identity of each waveguide system 1602 submitting the telemetry information, measurements taken by sensors 1604 of each waveguide system 1602 , information relating to predicted, estimated, or actual disturbances detected by the sensors 1604 of each waveguide system 1602 , location information associated with each waveguide system 1602 , an estimated location of a detected disturbance, an identification of the disturbance, and so on. the network management system 1601 can determine from the telemetry information a type of disturbance that may be adverse to operations of the waveguide, transmission of the electromagnetic waves along the wire surface, or both. the network management system 1601 can also use telemetry information from multiple waveguide systems 1602 to isolate and identify the disturbance. additionally, the network management system 1601 can request telemetry information from waveguide systems 1602 in a vicinity of an affected waveguide system 1602 to triangulate a location of the disturbance and/or validate an identification of the disturbance by receiving similar telemetry information from other waveguide systems 1602 . in yet another embodiment, the network management system 1601 can receive at step 1756 an unscheduled activity report from maintenance field personnel. unscheduled maintenance may occur as result of field calls that are unplanned or as a result of unexpected field issues discovered during field calls or scheduled maintenance activities. the activity report can identify changes to a topology configuration of the power grid 1653 resulting from field personnel addressing discovered issues in the communication system 1655 and/or power grid 1653 , changes to one or more waveguide systems 1602 (such as replacement or repair thereof), mitigation of disturbances performed if any, and so on. at step 1758 , the network management system 1601 can determine from reports received according to steps 1752 through 1756 if a disturbance will occur based on a maintenance schedule, or if a disturbance has occurred or is predicted to occur based on telemetry data, or if a disturbance has occurred due to an unplanned maintenance identified in a field activity report. from any of these reports, the network management system 1601 can determine whether a detected or predicted disturbance requires rerouting of traffic by the affected waveguide systems 1602 or other waveguide systems 1602 of the communication system 1655 . when a disturbance is detected or predicted at step 1758 , the network management system 1601 can proceed to step 1760 where it can direct one or more waveguide systems 1602 to reroute traffic to circumvent the disturbance. when the disturbance is permanent due to a permanent topology change of the power grid 1653 , the network management system 1601 can proceed to step 1770 and skip steps 1762 , 1764 , 1766 , and 1772 . at step 1770 , the network management system 1601 can direct one or more waveguide systems 1602 to use a new routing configuration that adapts to the new topology. however, when the disturbance has been detected from telemetry information supplied by one or more waveguide systems 1602 , the network management system 1601 can notify maintenance personnel of the utility company 1656 or the communications service provider 1658 of a location of the disturbance, a type of disturbance if known, and related information that may be helpful to such personnel to mitigate the disturbance. when a disturbance is expected due to maintenance activities, the network management system 1601 can direct one or more waveguide systems 1602 to reconfigure traffic routes at a given schedule (consistent with the maintenance schedule) to avoid disturbances caused by the maintenance activities during the maintenance schedule. returning back to step 1760 and upon its completion, the process can continue with step 1762 . at step 1762 , the network management system 1601 can monitor when the disturbance(s) have been mitigated by field personnel. mitigation of a disturbance can be detected at step 1762 by analyzing field reports submitted to the network management system 1601 by field personnel over a communications network (e.g., cellular communication system) utilizing field equipment (e.g., a laptop computer or handheld computer/device). if field personnel have reported that a disturbance has been mitigated, the network management system 1601 can proceed to step 1764 to determine from the field report whether a topology change was required to mitigate the disturbance. a topology change can include rerouting a power line 1610 , reconfiguring a waveguide system 1602 to utilize a different power line 1610 , otherwise utilizing an alternative link to bypass the disturbance and so on. if a topology change has taken place, the network management system 1601 can direct at step 1770 one or more waveguide systems 1602 to use a new routing configuration that adapts to the new topology. if, however, a topology change has not been reported by field personnel, the network management system 1601 can proceed to step 1766 where it can direct one or more waveguide systems 1602 to send test signals to test a routing configuration that had been used prior to the detected disturbance(s). test signals can be sent to affected waveguide systems 1602 in a vicinity of the disturbance. the test signals can be used to determine if signal disturbances (e.g., electromagnetic wave reflections) are detected by any of the waveguide systems 1602 . if the test signals confirm that a prior routing configuration is no longer subject to previously detected disturbance(s), then the network management system 1601 can at step 1772 direct the affected waveguide systems 1602 to restore a previous routing configuration. if, however, test signals analyzed by one or more waveguide coupling device 1402 and reported to the network management system 1601 indicate that the disturbance(s) or new disturbance(s) are present, then the network management system 1601 will proceed to step 1768 and report this information to field personnel to further address field issues. the network management system 1601 can in this situation continue to monitor mitigation of the disturbance(s) at step 1762 . in the aforementioned embodiments, the waveguide systems 1602 can be configured to be self-adapting to changes in the power grid 1653 and/or to mitigation of disturbances. that is, one or more affected waveguide systems 1602 can be configured to self-monitor mitigation of disturbances and reconfigure traffic routes without requiring instructions to be sent to them by the network management system 1601 . in this embodiment, the one or more waveguide systems 1602 that are self-configurable can inform the network management system 1601 of its routing choices so that the network management system 1601 can maintain a macro-level view of the communication topology of the communication system 1655 . while for purposes of simplicity of explanation, the respective processes are shown and described as a series of blocks in figs. 17a and 17b , respectively, it is to be understood and appreciated that the claimed subject matter is not limited by the order of the blocks, as some blocks may occur in different orders and/or concurrently with other blocks from what is depicted and described herein. moreover, not all illustrated blocks may be required to implement the methods described herein. turning now to fig. 18a , a block diagram illustrating an example, non-limiting embodiment of a communication system 800 in accordance with various aspects of the subject disclosure is shown. the communication system 800 can include a macro base station 1802 having antennas that cover multiple sectors (e.g., 6 or more sectors). the macro base station 1802 can be communicatively coupled to a communication node 1804 a that serves as a master or distribution node for other communication nodes 1804 b-e distributed at differing geographic locations in a coverage area of the macro base station 1802 . the communication nodes 1804 can operate as micro base stations, which can be configured to offload communications traffic associated with mobile devices (e.g., cell phones) and/or stationary devices (e.g., a communication device in a residence, or commercial establishment) that are wirelessly coupled to a sector of the macro base station 1802 . the wireless resources of the macro base station 1802 can be made available to other mobile devices by redirecting certain mobile and/or stationary devices to utilize the wireless resources of a communication node 1804 in a communication range of the mobile or stationary devices. the communication nodes 1804 a-e can be communicatively coupled to each other over an interface 1810 . in one embodiment, the interface 1810 can comprise a wired or tethered interface (e.g., fiber optic cable). in other embodiments, the interface 1810 can comprise a wireless rf interface. the communication nodes 1804 a-e can be configured to provide communication services to mobile and stationary devices according to instructions provided by the macro base station 1802 . the micro base stations (depicted as communication nodes 1804 ) can differ from the macro base station in several ways. for example, the communication range of the micro base stations can be smaller than the communication range of the macro base station. consequently, the power consumed by the micro base stations can be less than the power consumed by the macro base station. additionally, the macro base station directs the micro base stations as to which mobile and/or stationary devices they are to communicate with, and which carrier frequency, spectral segment(s) and/or timeslot schedule of such spectral segment(s) are to be used by the micro base stations when communicating with certain mobile or stationary devices. accordingly, the resources of the micro base stations can be simpler and less costly than the resources utilized by the macro base station. control of the micro base stations by the macro base station can be performed in a master-slave configuration or other suitable control configurations. turning now to fig. 18b , a block diagram illustrating an example, non-limiting embodiment of the communication nodes 1804 b-e of the communication system 1800 of fig. 18a is shown. in this illustration, the communication nodes 1804 b-e are placed on a utility fixture such as a light post. in other embodiments, some of the communication nodes 1804 b-e can be placed on a utility post that is used for distributing power and/or communication lines. the communication nodes 1804 b-e in these illustrations can be configured to communicate with each other over the interface 1810 , which in this illustration is shown as a wireless interface. the communication nodes 1804 b-e can also be configured to communicate with mobile or stationary devices 1806 a-c over a wireless interface 1811 that conforms to a communication protocol (e.g., 4g or lte signals). the communication nodes 1804 can be configured to exchange signals over the interface 1810 at an operating frequency that is much higher (e.g., 80 ghz or higher) than the operating frequency used for communicating with the mobile or stationary devices (e.g., 1.9 ghz) over interface 1811 . the high carrier frequency used for communicating between the communication nodes 1804 enables the communication nodes 1804 to provide communication services to multiple mobile or stationary devices as will be illustrated by spectral downlink and uplink diagrams of fig. 19 described below. turning now to figs. 18c-18d , block diagrams illustrating example, non-limiting embodiments of a communication node 1804 of the communication system 1800 of fig. 18a is shown. the communication node 1804 can be attached to a support structure 1818 of a utility fixture as shown in fig. 18c . the communication node 1804 can be affixed to the support structure 1818 with an arm 1820 constructed of plastic or other suitable material that attaches to an end of the communication node 1804 . the communication node 1804 can further include a plastic housing assembly 1816 that covers components of the communication node 1804 . the communication node 1804 can be powered by a power line 1820 (e.g., 110/220 vac). the power line 1820 can originate from a light pole or can be coupled to a power line of a utility pole. in an embodiment where the communication nodes 1804 communicate wirelessly with other communication nodes 1804 as shown in fig. 18b , a top side 1812 of the communication node 1804 (illustrated also in fig. 18d ) can comprise a plurality of antennas 1822 (e.g., 16 dielectric antennas devoid of metal surfaces) coupled to one or more transceivers such as, for example, in whole or in part, the transceiver 1400 illustrated in fig. 14 . each of the plurality of antennas 1822 of the top side 1812 can operate as a sector of the communication node 1804 , each sector configured for communicating with at least one communication node 1804 in a communication range of the sector. alternatively, or in combination, the interface 1810 between communication nodes 1804 can be a tethered interface (e.g., a fiber optic cable, or a power line used for transport of guided electromagnetic waves as previously described). in other embodiments, the interface 1810 can differ between communication nodes 1804 . that is, some communications nodes 1804 may communicate over a wireless interface, while others communicate over a tethered interface. in yet other embodiments, some communications nodes 1804 may utilize a combined wireless and tethered interface. a bottom side 1814 of the communication node 1804 can also comprise a plurality of antennas 1824 for wirelessly communicating with one or more mobile or stationary devices 1806 at a carrier frequency that is suitable for the mobile or stationary devices 1806 . as noted earlier, the carrier frequency used by the communication node 1804 for communicating with the mobile or station devices over the wireless interface 1811 shown in fig. 18b can be substantially lower than the carrier frequency used for communicating between the communication nodes 1804 over interface 1810 . the plurality of antennas 1824 of the bottom portion 1814 of the communication node 1804 can also utilize a transceiver such as, for example, in whole or in part, the transceiver 1400 illustrated in fig. 14 . turning now to fig. 19 , a block diagram illustrating an example, non-limiting embodiment of downlink and uplink communication techniques for enabling a base station to communicate with the communication nodes 1804 of fig. 18a is shown. in the illustrations of fig. 19 , downlink signals (i.e., signals directed from the macro base station 1802 to the communication nodes 1804 ) can be spectrally divided into control channels 1902 , spectral segments 1906 for enabling the communication nodes 1804 to communicate with one or more mobile or stationary devices 1906 , and pilot signals 1904 which can be supplied with some or all of the spectral segments 1906 . the pilot signals 1904 can be processed by the top side 1816 (tethered or wireless) transceivers of downstream communication nodes 1804 to remove distortion from a receive signal (e.g., phase distortion). each spectral segment 1906 can have a bandwidth sufficiently wide (e.g., 50 mhz) to include one or more cellular signals (e.g., 10-20 mhz), which can be used by the communication nodes 1804 for communicating with one or more mobile or stationary devices 1806 . the uplink signals (i.e., signals directed from the communication nodes 1804 to the macro base station 1802 ) can have spectral segments 1910 of similar bandwidth with pilot signals 1908 included with some or all spectral segments 1910 to enable upstream communication nodes 1804 and/or the macro base station 1802 to remove distortion (e.g., phase error). turning now to fig. 20 , a flow diagram of an example, non-limiting embodiment of a method 2000 , is shown. method 2000 can be used with one or more functions and features presented in conjunction with figs. 1-19 . method 2000 can begin with step 2002 in which a base station, such as the macro base station 1802 of fig. 18a , determines a rate of travel of a communication device. the communication device can be a mobile communication device such as one of the mobile devices 1806 illustrated in fig. 18b , or stationary communication device (e.g., a communication device in a residence, or commercial establishment). the base station can communicate directly with the communication device utilizing wireless cellular communications technology (e.g., lte), which enables the base station to monitor the movement of the communication device by receiving location information from the communication device, and/or to provide the communication device wireless communication services such as voice and/or data services. during a communication session, the base station and the communication device exchange wireless signals that operate at a certain carrier frequency (e.g., 1.9 ghz) utilizing one or more spectral segments (e.g., resource blocks) of a certain bandwidth (e.g., 10-20 mhz). in some embodiments, the spectral segments are used according to a time slot schedule assigned to the communication device by the base station. the rate of travel of the communication device can be determined at step 2002 from gps coordinates provided by the communication device to the base station by way of cellular wireless signals. if the rate of travel is above a threshold (e.g., 25 miles per hour) at step 2004 , the base station can continue to provide wireless services to the communication device at step 2006 utilizing the wireless resources of the base station. if, on the other hand, the communication device has a rate of travel below the threshold, the base station can be configured to further determine whether the communication device can be redirected to a communication node to make available the wireless resources of the base station for other communication devices. for example, suppose the base station detects that the communication device has a slow rate of travel (e.g., 3 mph or near stationary). under certain circumstances, the base station may also determine that a current location of the communication device places the communication device in a communication range of a particular communication node 1804 . the base station may also determine that the slow rate of travel of the communication device will maintain the communication device within the communication range of the particular communication node 1804 for a sufficiently long enough time (another threshold test that can be used by the base station) to justify redirecting the communication device to the particular communication node 1804 . once such a determination is made, the base station can proceed to step 2008 and select the communication node 1804 that is in the communication range of the communication device for providing communication services thereto. accordingly, the selection process performed at step 2008 can be based on a location of the communication device determined from gps coordinates provided to the base station by the communication device. the selection process can also be based on a trajectory of travel of the communication device, which may be determined from several instances of gps coordinates provided by the communication device. in some embodiments, the base station may determine that the trajectory of the communication device will eventually place the communication device in a communication range of a subsequent communication node 1804 neighboring the communication node selected at step 2008 . in this embodiment, the base station can inform multiple communication nodes 1804 of this trajectory to enable the communication nodes 1804 coordinate a handoff of communication services provided to the communication device. once one or more communication nodes 1804 have been selected at step 2008 , the base station can proceed to step 2010 where it assigns one or more spectral segments (e.g., resource blocks) for use by the communication device at a first carrier frequency (e.g., 1.9 ghz). it is not necessary for the first carrier frequency and/or spectral segments selected by the base station to be the same as the carrier frequency and/or spectral segments in use between the base station and the communication device. for example, suppose the base station and the communication device are utilizing a carrier frequency at 1.9 ghz for wireless communications between each other. the base station can select a different carrier frequency (e.g., 900 mhz) at step 2010 for the communication node selected at step 2008 to communicate with the communication device. similarly, the base station can assign spectral segment(s) (e.g., resource blocks) and/or a timeslot schedule of the spectral segment(s) to the communication node that differs from the spectral segment(s) and/or timeslot schedule in use between the base station and the communication device. at step 2012 , the base station can generate first modulated signal(s) in the spectral segment(s) assigned in step 2010 at the first carrier frequency. the first modulated signal(s) can include data directed to the communication device, the data representative of a voice communication session, a data communication session, or a combination thereof. at step 2014 , the base station can up-convert (with a mixer, bandpass filter and other circuitry) the first modulated signal(s) at the first carrier frequency (e.g., 1.9 ghz) to a second carrier frequency (e.g., 80 ghz) for transport of such signals to the communication node 1804 selected at step 2008 . alternatively, the base station can provide the first modulated signal(s) at the first carrier frequency to the first communication node 1804 a (illustrated in fig. 18a ) for up-conversion to the second carrier frequency and transport thereafter to the communication node 1804 selected at step 2008 . at step 2016 , the base station can also transmit instructions to transition the communication device to the communication node 1804 selected at step 2008 . the instructions can be directed to the communication device while the communication device is in direct communications with the base station utilizing the wireless resources of the base station. alternatively, the instructions can be communicated to the communication node 1804 selected at step 2008 by way of a control channel 1902 of the downlink illustrated in fig. 19 . step 2016 can occur before, after or contemporaneously with steps 2012 - 2014 . once the instructions have been transmitted, the base station can proceed to step 2018 where it transmits the first modulated signal at the second carrier frequency (e.g., 80 ghz) by way of the first communication node 1804 a (illustrated in fig. 18a ). alternatively, the first communication node 1804 a can perform the up-conversion at step 2014 once the base station provides the first modulated signal(s) at the first carrier frequency. the first communication node 1804 a can serve as a master communication node for distributing downlink signals generated by the base station to downstream communication nodes 1804 according to the spectral segments 1906 assigned to each communication node 1804 at step 2010 . the assignment of the spectral segments 1906 can be provided to the communication nodes 1804 by way of instructions transmitted by the first communication node 1808 a in the control channel 1902 illustrated in fig. 19 . at step 2018 , the communication node 1804 receiving the first modulated signal(s) at the second carrier frequency can be configured to down-convert it to the first carrier frequency, and utilize the pilot signal supplied with the first modulated signal(s) to remove distortions (e.g., phase distortion) caused by the distribution of spectral segments over communication hops between the communication nodes 1804 b-d. once the down-conversion process is completed, the communication node 1804 can transmit at step 2022 the first modulated signal at the first carrier frequency (e.g., 1.9 ghz) to the communication device utilizing the same spectral segment assigned to the communication node 1804 . step 2022 can be coordinated so that it occurs after the communication device has transition to the communication node 1804 in accordance with the instructions provided at step 2016 . to make such a transition seamless, and so as to avoid interrupting an existing wireless communication session between the base station and the communication device, the instructions provided in step 2016 can direct the communication device and/or the communication node 1804 to transition to the assigned spectral segment(s) and/or time slot schedule as part of and/or subsequent to a registration process between the communication device and the communication node 1804 selected at step 2008 . in some instances such a transition may require that the communication device have concurrent wireless communications with the base station and the communication node 1804 for a short period of time. once the communication device successfully transitions to the communication node 1804 , the communication device can terminate wireless communications with the base station, and continue the communication session by way of the communication node 1804 . termination of wireless services between the base station and the communication device makes certain wireless resources of the base station available for use with other communication devices. it should be noted that although the base station has in the foregoing steps delegated wireless connectivity to a select communication node 1804 , the communication session between base station and the communication device continues as before by way of the network of communication nodes 1804 illustrated in fig. 18a . the difference is, however, that the base station no longer needs to utilize its own wireless resources to communicate with the communication device. in order to provide bidirectional communications between the base station and the communication device, by way of the network of communication nodes 1804 , the communication node 1804 and/or the communication device can be instructed to utilize one or more spectral segments and/or a timeslot schedule on the uplink illustrated in fig. 19 . uplink instructions can be provided to the communication node 1804 and/or communication device at step 2016 as part of and/or subsequent to the registration process between the communication device and the communication node 1804 selected at step 2008 . accordingly, when the communication device has data it needs to transmit to the base station, it can wirelessly transmit second modulated signal(s) at the first carrier frequency which can be received by the communication node at step 2024 . the second modulated signal(s) can be included in one or more uplink spectral segments 1910 specified in the instructions provided to the communication device and/or communication node at step 2016 . to convey the second modulated signal(s) to the base station, the communication node 1804 can up-convert these signals at step 2026 from the first carrier frequency (e.g., 1.9 ghz) to the second carrier frequency (e.g., 80 ghz). to enable upstream communication nodes and/or the base station to remove distortion, the second modulated signal(s) at the second carrier frequency can be transmitted at step 2028 by the communication node 1804 with one or more uplink pilot signals 1908 . once the base station receives the second modulated signal(s) at the second carrier frequency, it can down-convert these signals at step 2030 from the second carrier frequency to the first carrier frequency to obtain data provided by the communication device at step 2032 . alternatively, the first communication node 1804 a can perform the down-conversion of the second modulated signal(s) at the second carrier frequency to the first carrier frequency and provide the resulting signals to the base station. the base station can then processes the second modulated signal(s) at the first carrier frequency to retrieve data provided by the communication device in a manner similar or identical to how the base station would have processed signals from the communication device had the base station been in direct wireless communications with the communication device. the foregoing steps method 2000 provide a way for a base station 1802 to make available wireless resources (e.g., sector antennas, spectrum) for fast moving communication devices and in some embodiments increase bandwidth utilization by redirecting slow moving communication devices to one or more communication nodes 1804 communicatively coupled to the base station 1802 . for example, suppose a base station 1802 has ten (10) communication nodes 1804 that it can redirect mobile and/or stationary communication devices to. further suppose that the 10 communication nodes 1804 have substantially non-overlapping communication ranges. further suppose, the base station 1802 has set aside certain spectral segments (e.g., resource blocks 5, 7 and 9) during particular timeslots and at a particular carrier frequency, which it assigns to all 10 communication nodes 1804 . during operations, the base station 1802 can be configured not to utilize resource blocks 5, 7 and 9 during the timeslot schedule and carrier frequency set aside for the communication nodes 1804 to avoid interference. as the base station 1802 detects slow moving or stationary communication devices, it can redirect the communication devices to different ones of the 10 communication nodes 1804 based on the location of the communication devices. when, for example, the base station 1802 redirects communications of a particular communication device to a particular communication node 1804 , the base station 1802 can up-convert resource blocks 5, 7 and 9 during the assigned timeslots and at the carrier frequency to one or more spectral range(s) on the downlink (see fig. 19 ) assigned to the communication node 1804 in question. the communication node 1804 in question can also be assigned to one or more spectral range(s) on the uplink which it can use to redirect communication signals provided by the communication device to the base station 1802 . such communication signals can be up-converted by the communication node 1804 according to the assigned uplink spectral range(s) and transmitted to the base station 1802 for processing. the downlink and uplink spectral assignments can be communicated by the base station 1802 to each communication node 1804 by way of a control channel as depicted in fig. 19 . the foregoing downlink and uplink assignment process can also be used for the other communication nodes 1804 for providing communication services to other communication devices redirected by the base station 1802 thereto. in this illustration, the reuse of resource blocks 5, 7 and 9 during a corresponding timeslot schedule and carrier frequency by the 10 communication nodes 1804 can effectively increase bandwidth utilization by the base station 1802 up to a factor of 10. although the base station 1802 can no longer use resource blocks 5, 7 and 9 it set aside for the 10 communication nodes 1804 for wirelessly communicating with other communication devices, its ability to redirect communication devices to 10 different communication nodes 1804 reusing these resource blocks effectively increases the bandwidth capabilities of the base station 1802 . accordingly, method 2000 in certain embodiments can increase bandwidth utilization of a base station 1802 and make available resources of the base station 1802 for other communication devices. it will be appreciated that in some embodiments, the base station 1802 can be configured to reuse spectral segments assigned to communication nodes 1804 by selecting one or more sectors of an antenna system of the base station 1802 that point away from the communication nodes 1804 assigned to the same spectral segments. accordingly, the base station 1802 can be configured in some embodiments to avoid reusing certain spectral segments assigned to certain communication nodes 1804 and in other embodiments reuse other spectral segments assigned to other communication nodes 1804 by selecting specific sectors of the antenna system of the base station 1802 . similar concepts can be applied to sectors of the antenna system 1824 employed by the communication nodes 1804 . certain reuse schemes can be employed between the base station 1802 and one or more communication nodes 1804 based on sectors utilized by the base station 1802 and/or the one or more communication nodes 1804 . method 2000 also enables the reuse of legacy systems when communication devices are redirected to one or more communication nodes. for example, the signaling protocol (e.g., lte) utilized by the base station to wirelessly communicate with the communication device can be preserved in the communication signals exchanged between the base station and the communication nodes 1804 . accordingly, when assigning spectral segments to the communication nodes 1804 , the exchange of modulated signals in these segments between the base station and the communication nodes 1804 can be the same signals that would have been used by the base station to perform direct wireless communications with the communication device. thus, legacy base stations can be updated to perform the up and down-conversion process previously described, with the added feature of distortion mitigation, while all other functions performed in hardware and/or software for processing modulated signals at the first carrier frequency can remain substantially unaltered. it is further noted that method 2000 can be adapted without departing from the scope of the subject disclosure. for example, when the base station detects that a communication device has a trajectory that will result in a transition from the communication range of one communication node to another, the base station (or the communication nodes in question) can monitor such a trajectory by way of periodic gps coordinates provided by the communication device, and accordingly coordinate a handoff of the communication device to the other communication node. method 2000 can also be adapted so that when the communication device is near a point of transitioning from the communication range of one communication node to another, instructions can be transmitted by the base station (or the active communication node) to direct the communication device and/or the other communication node to utilize certain spectral segments and/or timeslots in the downlink and uplink channels to successfully transition communications without interrupting an existing communication session. it is further noted that method 2000 can also be adapted to coordinate a handoff of wireless communications between the communication device and a communication node 1804 back to the base station when the base station or the active communication node 1804 detects that the communication device will at some point transition outside of a communication range of the communication node and no other communication node is in a communication range of the communication device. other adaptations of method 2000 are contemplated by the subject disclosure. while for purposes of simplicity of explanation, the respective processes are shown and described as a series of blocks in fig. 20 , it is to be understood and appreciated that the claimed subject matter is not limited by the order of the blocks, as some blocks may occur in different orders and/or concurrently with other blocks from what is depicted and described herein. moreover, not all illustrated blocks may be required to implement the methods described herein. referring now to fig. 21 , there is illustrated a block diagram of a computing environment in accordance with various aspects described herein. in order to provide additional context for various embodiments of the embodiments described herein, fig. 21 and the following discussion are intended to provide a brief, general description of a suitable computing environment 2100 in which the various embodiments of the subject disclosure can be implemented. while the embodiments have been described above in the general context of computer-executable instructions that can run on one or more computers, those skilled in the art will recognize that the embodiments can be also implemented in combination with other program modules and/or as a combination of hardware and software. generally, program modules comprise routines, programs, components, data structures, etc., that perform particular tasks or implement particular abstract data types. moreover, those skilled in the art will appreciate that the inventive methods can be practiced with other computer system configurations, comprising single-processor or multiprocessor computer systems, minicomputers, mainframe computers, as well as personal computers, hand-held computing devices, microprocessor-based or programmable consumer electronics, and the like, each of which can be operatively coupled to one or more associated devices. as used herein, a processing circuit includes processor as well as other application specific circuits such as an application specific integrated circuit, digital logic circuit, state machine, programmable gate array or other circuit that processes input signals or data and that produces output signals or data in response thereto. it should be noted that while any functions and features described herein in association with the operation of a processor could likewise be performed by a processing circuit. the terms “first,” “second,” “third,” and so forth, as used in the claims, unless otherwise clear by context, is for clarity only and doesn't otherwise indicate or imply any order in time. for instance, “a first determination,” “a second determination,” and “a third determination,” does not indicate or imply that the first determination is to be made before the second determination, or vice versa, etc. the illustrated embodiments of the embodiments herein can be also practiced in distributed computing environments where certain tasks are performed by remote processing devices that are linked through a communications network. in a distributed computing environment, program modules can be located in both local and remote memory storage devices. computing devices typically comprise a variety of media, which can comprise computer-readable storage media and/or communications media, which two terms are used herein differently from one another as follows. computer-readable storage media can be any available storage media that can be accessed by the computer and comprises both volatile and nonvolatile media, removable and non-removable media. by way of example, and not limitation, computer-readable storage media can be implemented in connection with any method or technology for storage of information such as computer-readable instructions, program modules, structured data or unstructured data. computer-readable storage media can comprise, but are not limited to, random access memory (ram), read only memory (rom), electrically erasable programmable read only memory (eeprom), flash memory or other memory technology, compact disk read only memory (cd-rom), digital versatile disk (dvd) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices or other tangible and/or non-transitory media which can be used to store desired information. in this regard, the terms “tangible” or “non-transitory” herein as applied to storage, memory or computer-readable media, are to be understood to exclude only propagating transitory signals per se as modifiers and do not relinquish rights to all standard storage, memory or computer-readable media that are not only propagating transitory signals per se. computer-readable storage media can be accessed by one or more local or remote computing devices, e.g., via access requests, queries or other data retrieval protocols, for a variety of operations with respect to the information stored by the medium. communications media typically embody computer-readable instructions, data structures, program modules or other structured or unstructured data in a data signal such as a modulated data signal, e.g., a carrier wave or other transport mechanism, and comprises any information delivery or transport media. the term “modulated data signal” or signals refers to a signal that has one or more of its characteristics set or changed in such a manner as to encode information in one or more signals. by way of example, and not limitation, communication media comprise wired media, such as a wired network or direct-wired connection, and wireless media such as acoustic, rf, infrared and other wireless media. with reference again to fig. 21 , the example environment 2100 for transmitting and receiving signals via or forming at least part of a base station (e.g., base station devices 1504 , macrocell site 1502 , or base stations 1614 ) or central office (e.g., central office 1501 or 1611 ). at least a portion of the example environment 2100 can also be used for transmission devices 101 or 102 . the example environment can comprise a computer 2102 , the computer 2102 comprising a processing unit 2104 , a system memory 2106 and a system bus 2108 . the system bus 2108 couples system components including, but not limited to, the system memory 2106 to the processing unit 2104 . the processing unit 2104 can be any of various commercially available processors. dual microprocessors and other multiprocessor architectures can also be employed as the processing unit 2104 . the system bus 2108 can be any of several types of bus structure that can further interconnect to a memory bus (with or without a memory controller), a peripheral bus, and a local bus using any of a variety of commercially available bus architectures. the system memory 2106 comprises rom 2110 and ram 2112 . a basic input/output system (bios) can be stored in a non-volatile memory such as rom, erasable programmable read only memory (eprom), eeprom, which bios contains the basic routines that help to transfer information between elements within the computer 2102 , such as during startup. the ram 2112 can also comprise a high-speed ram such as static ram for caching data. the computer 2102 further comprises an internal hard disk drive (hdd) 2114 (e.g., eide, sata), which internal hard disk drive 2114 can also be configured for external use in a suitable chassis (not shown), a magnetic floppy disk drive (fdd) 2116 , (e.g., to read from or write to a removable diskette 2118 ) and an optical disk drive 2120 , (e.g., reading a cd-rom disk 2122 or, to read from or write to other high capacity optical media such as the dvd). the hard disk drive 2114 , magnetic disk drive 2116 and optical disk drive 2120 can be connected to the system bus 2108 by a hard disk drive interface 2124 , a magnetic disk drive interface 2126 and an optical drive interface 2128 , respectively. the interface 2124 for external drive implementations comprises at least one or both of universal serial bus (usb) and institute of electrical and electronics engineers (ieee) 1394 interface technologies. other external drive connection technologies are within contemplation of the embodiments described herein. the drives and their associated computer-readable storage media provide nonvolatile storage of data, data structures, computer-executable instructions, and so forth. for the computer 2102 , the drives and storage media accommodate the storage of any data in a suitable digital format. although the description of computer-readable storage media above refers to a hard disk drive (hdd), a removable magnetic diskette, and a removable optical media such as a cd or dvd, it should be appreciated by those skilled in the art that other types of storage media which are readable by a computer, such as zip drives, magnetic cassettes, flash memory cards, cartridges, and the like, can also be used in the example operating environment, and further, that any such storage media can contain computer-executable instructions for performing the methods described herein. a number of program modules can be stored in the drives and ram 2112 , comprising an operating system 2130 , one or more application programs 2132 , other program modules 2134 and program data 2136 . all or portions of the operating system, applications, modules, and/or data can also be cached in the ram 2112 . the systems and methods described herein can be implemented utilizing various commercially available operating systems or combinations of operating systems. examples of application programs 2132 that can be implemented and otherwise executed by processing unit 2104 include the diversity selection determining performed by transmission device 101 or 102 . a user can enter commands and information into the computer 2102 through one or more wired/wireless input devices, e.g., a keyboard 2138 and a pointing device, such as a mouse 2140 . other input devices (not shown) can comprise a microphone, an infrared (ir) remote control, a joystick, a game pad, a stylus pen, touch screen or the like. these and other input devices are often connected to the processing unit 2104 through an input device interface 2142 that can be coupled to the system bus 2108 , but can be connected by other interfaces, such as a parallel port, an ieee 1394 serial port, a game port, a universal serial bus (usb) port, an ir interface, etc. a monitor 2144 or other type of display device can be also connected to the system bus 2108 via an interface, such as a video adapter 2146 . it will also be appreciated that in alternative embodiments, a monitor 2144 can also be any display device (e.g., another computer having a display, a smart phone, a tablet computer, etc.) for receiving display information associated with computer 2102 via any communication means, including via the internet and cloud-based networks. in addition to the monitor 2144 , a computer typically comprises other peripheral output devices (not shown), such as speakers, printers, etc. the computer 2102 can operate in a networked environment using logical connections via wired and/or wireless communications to one or more remote computers, such as a remote computer(s) 2148 . the remote computer(s) 2148 can be a workstation, a server computer, a router, a personal computer, portable computer, microprocessor-based entertainment appliance, a peer device or other common network node, and typically comprises many or all of the elements described relative to the computer 2102 , although, for purposes of brevity, only a memory/storage device 2150 is illustrated. the logical connections depicted comprise wired/wireless connectivity to a local area network (lan) 2152 and/or larger networks, e.g., a wide area network (wan) 2154 . such lan and wan networking environments are commonplace in offices and companies, and facilitate enterprise-wide computer networks, such as intranets, all of which can connect to a global communications network, e.g., the internet. when used in a lan networking environment, the computer 2102 can be connected to the local network 2152 through a wired and/or wireless communication network interface or adapter 2156 . the adapter 2156 can facilitate wired or wireless communication to the lan 2152 , which can also comprise a wireless ap disposed thereon for communicating with the wireless adapter 2156 . when used in a wan networking environment, the computer 2102 can comprise a modem 2158 or can be connected to a communications server on the wan 2154 or has other means for establishing communications over the wan 2154 , such as by way of the internet. the modem 2158 , which can be internal or external and a wired or wireless device, can be connected to the system bus 2108 via the input device interface 2142 . in a networked environment, program modules depicted relative to the computer 2102 or portions thereof, can be stored in the remote memory/storage device 2150 . it will be appreciated that the network connections shown are example and other means of establishing a communications link between the computers can be used. the computer 2102 can be operable to communicate with any wireless devices or entities operatively disposed in wireless communication, e.g., a printer, scanner, desktop and/or portable computer, portable data assistant, communications satellite, any piece of equipment or location associated with a wirelessly detectable tag (e.g., a kiosk, news stand, restroom), and telephone. this can comprise wireless fidelity (wi-fi) and bluetooth® wireless technologies. thus, the communication can be a predefined structure as with a conventional network or simply an ad hoc communication between at least two devices. wi-fi can allow connection to the internet from a couch at home, a bed in a hotel room or a conference room at work, without wires. wi-fi is a wireless technology similar to that used in a cell phone that enables such devices, e.g., computers, to send and receive data indoors and out; anywhere within the range of a base station. wi-fi networks use radio technologies called ieee 802.11 (a, b, g, n, ac, ag etc.) to provide secure, reliable, fast wireless connectivity. a wi-fi network can be used to connect computers to each other, to the internet, and to wired networks (which can use ieee 802.3 or ethernet). wi-fi networks operate in the unlicensed 2.4 and 5 ghz radio bands for example or with products that contain both bands (dual band), so the networks can provide real-world performance similar to the basic 10baset wired ethernet networks used in many offices. fig. 22 presents an example embodiment 2200 of a mobile network platform 2210 that can implement and exploit one or more aspects of the disclosed subject matter described herein. in one or more embodiments, the mobile network platform 2210 can generate and receive signals transmitted and received by base stations (e.g., base station devices 1504 , macrocell site 1502 , or base stations 1614 ), central office (e.g., central office 1501 or 1611 ), or transmission device 101 or 102 associated with the disclosed subject matter. generally, wireless network platform 2210 can comprise components, e.g., nodes, gateways, interfaces, servers, or disparate platforms, that facilitate both packet-switched (ps) (e.g., internet protocol (ip), frame relay, asynchronous transfer mode (atm)) and circuit-switched (cs) traffic (e.g., voice and data), as well as control generation for networked wireless telecommunication. as a non-limiting example, wireless network platform 2210 can be included in telecommunications carrier networks, and can be considered carrier-side components as discussed elsewhere herein. mobile network platform 2210 comprises cs gateway node(s) 2222 which can interface cs traffic received from legacy networks like telephony network(s) 2240 (e.g., public switched telephone network (pstn), or public land mobile network (plmn)) or a signaling system #7 (ss7) network 2270 . circuit switched gateway node(s) 2222 can authorize and authenticate traffic (e.g., voice) arising from such networks. additionally, cs gateway node(s) 2222 can access mobility, or roaming, data generated through ss7 network 2270 ; for instance, mobility data stored in a visited location register (vlr), which can reside in memory 2230 . moreover, cs gateway node(s) 2222 interfaces cs-based traffic and signaling and ps gateway node(s) 2218 . as an example, in a 3gpp umts network, cs gateway node(s) 2222 can be realized at least in part in gateway gprs support node(s) (ggsn). it should be appreciated that functionality and specific operation of cs gateway node(s) 2222 , ps gateway node(s) 2218 , and serving node(s) 2216 , is provided and dictated by radio technology(ies) utilized by mobile network platform 2210 for telecommunication. in addition to receiving and processing cs-switched traffic and signaling, ps gateway node(s) 2218 can authorize and authenticate ps-based data sessions with served mobile devices. data sessions can comprise traffic, or content(s), exchanged with networks external to the wireless network platform 2210 , like wide area network(s) (wans) 2250 , enterprise network(s) 2270 , and service network(s) 2280 , which can be embodied in local area network(s) (lans), can also be interfaced with mobile network platform 2210 through ps gateway node(s) 2218 . it is to be noted that wans 2250 and enterprise network(s) 2260 can embody, at least in part, a service network(s) like ip multimedia subsystem (ims). based on radio technology layer(s) available in technology resource(s) 2217 , packet-switched gateway node(s) 2218 can generate packet data protocol contexts when a data session is established; other data structures that facilitate routing of packetized data also can be generated. to that end, in an aspect, ps gateway node(s) 2218 can comprise a tunnel interface (e.g., tunnel termination gateway (ttg) in 3gpp umts network(s) (not shown)) which can facilitate packetized communication with disparate wireless network(s), such as wi-fi networks. in embodiment 2200 , wireless network platform 2210 also comprises serving node(s) 2216 that, based upon available radio technology layer(s) within technology resource(s) 2217 , convey the various packetized flows of data streams received through ps gateway node(s) 2218 . it is to be noted that for technology resource(s) 2217 that rely primarily on cs communication, server node(s) can deliver traffic without reliance on ps gateway node(s) 2218 ; for example, server node(s) can embody at least in part a mobile switching center. as an example, in a 3gpp umts network, serving node(s) 2216 can be embodied in serving gprs support node(s) (sgsn). for radio technologies that exploit packetized communication, server(s) 2214 in wireless network platform 2210 can execute numerous applications that can generate multiple disparate packetized data streams or flows, and manage (e.g., schedule, queue, format . . . ) such flows. such application(s) can comprise add-on features to standard services (for example, provisioning, billing, customer support . . . ) provided by wireless network platform 2210 . data streams (e.g., content(s) that are part of a voice call or data session) can be conveyed to ps gateway node(s) 2218 for authorization/authentication and initiation of a data session, and to serving node(s) 2216 for communication thereafter. in addition to application server, server(s) 2214 can comprise utility server(s), a utility server can comprise a provisioning server, an operations and maintenance server, a security server that can implement at least in part a certificate authority and firewalls as well as other security mechanisms, and the like. in an aspect, security server(s) secure communication served through wireless network platform 2210 to ensure network's operation and data integrity in addition to authorization and authentication procedures that cs gateway node(s) 2222 and ps gateway node(s) 2218 can enact. moreover, provisioning server(s) can provision services from external network(s) like networks operated by a disparate service provider; for instance, wan 2250 or global positioning system (gps) network(s) (not shown). provisioning server(s) can also provision coverage through networks associated to wireless network platform 2210 (e.g., deployed and operated by the same service provider), such as the distributed antennas networks shown in fig. 1(s) that enhance wireless service coverage by providing more network coverage. repeater devices such as those shown in figs. 7, 8, and 9 also improve network coverage in order to enhance subscriber service experience by way of ue 2275 . it is to be noted that server(s) 2214 can comprise one or more processors configured to confer at least in part the functionality of macro network platform 2210 . to that end, the one or more processor can execute code instructions stored in memory 2230 , for example. it is should be appreciated that server(s) 2214 can comprise a content manager 2215 , which operates in substantially the same manner as described hereinbefore. in example embodiment 2200 , memory 2230 can store information related to operation of wireless network platform 2210 . other operational information can comprise provisioning information of mobile devices served through wireless platform network 2210 , subscriber databases; application intelligence, pricing schemes, e.g., promotional rates, flat-rate programs, couponing campaigns; technical specification(s) consistent with telecommunication protocols for operation of disparate radio, or wireless, technology layers; and so forth. memory 2230 can also store information from at least one of telephony network(s) 2240 , wan 2250 , enterprise network(s) 2270 , or ss7 network 2260 . in an aspect, memory 2230 can be, for example, accessed as part of a data store component or as a remotely connected memory store. in order to provide a context for the various aspects of the disclosed subject matter, fig. 22 , and the following discussion, are intended to provide a brief, general description of a suitable environment in which the various aspects of the disclosed subject matter can be implemented. while the subject matter has been described above in the general context of computer-executable instructions of a computer program that runs on a computer and/or computers, those skilled in the art will recognize that the disclosed subject matter also can be implemented in combination with other program modules. generally, program modules comprise routines, programs, components, data structures, etc. that perform particular tasks and/or implement particular abstract data types. fig. 23 depicts an illustrative embodiment of a communication device 2300 . the communication device 2300 can serve as an illustrative embodiment of devices such as mobile devices and in-building devices referred to by the subject disclosure (e.g., in figs. 15, 16a and 16b ). the communication device 2300 can comprise a wireline and/or wireless transceiver 2302 (herein transceiver 2302 ), a user interface (ui) 2304 , a power supply 2314 , a location receiver 2316 , a motion sensor 2318 , an orientation sensor 2320 , and a controller 2306 for managing operations thereof. the transceiver 2302 can support short-range or long-range wireless access technologies such as bluetooth®, zigbee®, wifi, dect, or cellular communication technologies, just to mention a few (bluetooth® and zigbee® are trademarks registered by the bluetooth® special interest group and the zigbee® alliance, respectively). cellular technologies can include, for example, cdma-1×, umts/hsdpa, gsm/gprs, tdma/edge, ev/do, wimax, sdr, lte, as well as other next generation wireless communication technologies as they arise. the transceiver 2302 can also be adapted to support circuit-switched wireline access technologies (such as pstn), packet-switched wireline access technologies (such as tcp/ip, voip, etc.), and combinations thereof. the ui 2304 can include a depressible or touch-sensitive keypad 2308 with a navigation mechanism such as a roller ball, a joystick, a mouse, or a navigation disk for manipulating operations of the communication device 2300 . the keypad 2308 can be an integral part of a housing assembly of the communication device 2300 or an independent device operably coupled thereto by a tethered wireline interface (such as a usb cable) or a wireless interface supporting for example bluetooth®. the keypad 2308 can represent a numeric keypad commonly used by phones, and/or a qwerty keypad with alphanumeric keys. the ui 2304 can further include a display 2310 such as monochrome or color lcd (liquid crystal display), oled (organic light emitting diode) or other suitable display technology for conveying images to an end user of the communication device 2300 . in an embodiment where the display 2310 is touch-sensitive, a portion or all of the keypad 2308 can be presented by way of the display 2310 with navigation features. the display 2310 can use touch screen technology to also serve as a user interface for detecting user input. as a touch screen display, the communication device 2300 can be adapted to present a user interface having graphical user interface (gui) elements that can be selected by a user with a touch of a finger. the touch screen display 2310 can be equipped with capacitive, resistive or other forms of sensing technology to detect how much surface area of a user's finger has been placed on a portion of the touch screen display. this sensing information can be used to control the manipulation of the gui elements or other functions of the user interface. the display 2310 can be an integral part of the housing assembly of the communication device 2300 or an independent device communicatively coupled thereto by a tethered wireline interface (such as a cable) or a wireless interface. the ui 2304 can also include an audio system 2312 that utilizes audio technology for conveying low volume audio (such as audio heard in proximity of a human ear) and high volume audio (such as speakerphone for hands free operation). the audio system 2312 can further include a microphone for receiving audible signals of an end user. the audio system 2312 can also be used for voice recognition applications. the ui 2304 can further include an image sensor 2313 such as a charged coupled device (ccd) camera for capturing still or moving images. the power supply 2314 can utilize common power management technologies such as replaceable and rechargeable batteries, supply regulation technologies, and/or charging system technologies for supplying energy to the components of the communication device 2300 to facilitate long-range or short-range portable communications. alternatively, or in combination, the charging system can utilize external power sources such as dc power supplied over a physical interface such as a usb port or other suitable tethering technologies. the location receiver 2316 can utilize location technology such as a global positioning system (gps) receiver capable of assisted gps for identifying a location of the communication device 2300 based on signals generated by a constellation of gps satellites, which can be used for facilitating location services such as navigation. the motion sensor 2318 can utilize motion sensing technology such as an accelerometer, a gyroscope, or other suitable motion sensing technology to detect motion of the communication device 2300 in three-dimensional space. the orientation sensor 2320 can utilize orientation sensing technology such as a magnetometer to detect the orientation of the communication device 2300 (north, south, west, and east, as well as combined orientations in degrees, minutes, or other suitable orientation metrics). the communication device 2300 can use the transceiver 2302 to also determine a proximity to a cellular, wifi, bluetooth®, or other wireless access points by sensing techniques such as utilizing a received signal strength indicator (rssi) and/or signal time of arrival (toa) or time of flight (tof) measurements. the controller 2306 can utilize computing technologies such as a microprocessor, a digital signal processor (dsp), programmable gate arrays, application specific integrated circuits, and/or a video processor with associated storage memory such as flash, rom, ram, sram, dram or other storage technologies for executing computer instructions, controlling, and processing data supplied by the aforementioned components of the communication device 2300 . other components not shown in fig. 23 can be used in one or more embodiments of the subject disclosure. for instance, the communication device 2300 can include a slot for adding or removing an identity module such as a subscriber identity module (sim) card or universal integrated circuit card (uicc). sim or uicc cards can be used for identifying subscriber services, executing programs, storing subscriber data, and so on. in the subject specification, terms such as “store,” “storage,” “data store,” data storage,” “database,” and substantially any other information storage component relevant to operation and functionality of a component, refer to “memory components,” or entities embodied in a “memory” or components comprising the memory. it will be appreciated that the memory components described herein can be either volatile memory or nonvolatile memory, or can comprise both volatile and nonvolatile memory, by way of illustration, and not limitation, volatile memory, non-volatile memory, disk storage, and memory storage. further, nonvolatile memory can be included in read only memory (rom), programmable rom (prom), electrically programmable rom (eprom), electrically erasable rom (eeprom), or flash memory. volatile memory can comprise random access memory (ram), which acts as external cache memory. by way of illustration and not limitation, ram is available in many forms such as synchronous ram (sram), dynamic ram (dram), synchronous dram (sdram), double data rate sdram (ddr sdram), enhanced sdram (esdram), synchlink dram (sldram), and direct rambus ram (drram). additionally, the disclosed memory components of systems or methods herein are intended to comprise, without being limited to comprising, these and any other suitable types of memory. moreover, it will be noted that the disclosed subject matter can be practiced with other computer system configurations, comprising single-processor or multiprocessor computer systems, mini-computing devices, mainframe computers, as well as personal computers, hand-held computing devices (e.g., pda, phone, smartphone, watch, tablet computers, netbook computers, etc.), microprocessor-based or programmable consumer or industrial electronics, and the like. the illustrated aspects can also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network; however, some if not all aspects of the subject disclosure can be practiced on stand-alone computers. in a distributed computing environment, program modules can be located in both local and remote memory storage devices. some of the embodiments described herein can also employ artificial intelligence (ai) to facilitate automating one or more features described herein. for example, artificial intelligence can be used in optional training controller 230 evaluate and select candidate frequencies, modulation schemes, mimo modes, and/or guided wave modes in order to maximize transfer efficiency. the embodiments (e.g., in connection with automatically identifying acquired cell sites that provide a maximum value/benefit after addition to an existing communication network) can employ various ai-based schemes for carrying out various embodiments thereof. moreover, the classifier can be employed to determine a ranking or priority of the each cell site of the acquired network. a classifier is a function that maps an input attribute vector, x=(x1, x2, x3, x4, . . . , xn), to a confidence that the input belongs to a class, that is, f(x)=confidence (class). such classification can employ a probabilistic and/or statistical-based analysis (e.g., factoring into the analysis utilities and costs) to prognose or infer an action that a user desires to be automatically performed. a support vector machine (svm) is an example of a classifier that can be employed. the svm operates by finding a hypersurface in the space of possible inputs, which the hypersurface attempts to split the triggering criteria from the non-triggering events. intuitively, this makes the classification correct for testing data that is near, but not identical to training data. other directed and undirected model classification approaches comprise, e.g., naïve bayes, bayesian networks, decision trees, neural networks, fuzzy logic models, and probabilistic classification models providing different patterns of independence can be employed. classification as used herein also is inclusive of statistical regression that is utilized to develop models of priority. as will be readily appreciated, one or more of the embodiments can employ classifiers that are explicitly trained (e.g., via a generic training data) as well as implicitly trained (e.g., via observing ue behavior, operator preferences, historical information, receiving extrinsic information). for example, svms can be configured via a learning or training phase within a classifier constructor and feature selection module. thus, the classifier(s) can be used to automatically learn and perform a number of functions, including but not limited to determining according to a predetermined criteria which of the acquired cell sites will benefit a maximum number of subscribers and/or which of the acquired cell sites will add minimum value to the existing communication network coverage, etc. as used in some contexts in this application, in some embodiments, the terms “component,” “system” and the like are intended to refer to, or comprise, a computer-related entity or an entity related to an operational apparatus with one or more specific functionalities, wherein the entity can be either hardware, a combination of hardware and software, software, or software in execution. as an example, a component may be, but is not limited to being, a process running on a processor, a processor, an object, an executable, a thread of execution, computer-executable instructions, a program, and/or a computer. by way of illustration and not limitation, both an application running on a server and the server can be a component. one or more components may reside within a process and/or thread of execution and a component may be localized on one computer and/or distributed between two or more computers. in addition, these components can execute from various computer readable media having various data structures stored thereon. the components may communicate via local and/or remote processes such as in accordance with a signal having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, and/or across a network such as the internet with other systems via the signal). as another example, a component can be an apparatus with specific functionality provided by mechanical parts operated by electric or electronic circuitry, which is operated by a software or firmware application executed by a processor, wherein the processor can be internal or external to the apparatus and executes at least a part of the software or firmware application. as yet another example, a component can be an apparatus that provides specific functionality through electronic components without mechanical parts, the electronic components can comprise a processor therein to execute software or firmware that confers at least in part the functionality of the electronic components. while various components have been illustrated as separate components, it will be appreciated that multiple components can be implemented as a single component, or a single component can be implemented as multiple components, without departing from example embodiments. further, the various embodiments can be implemented as a method, apparatus or article of manufacture using standard programming and/or engineering techniques to produce software, firmware, hardware or any combination thereof to control a computer to implement the disclosed subject matter. the term “article of manufacture” as used herein is intended to encompass a computer program accessible from any computer-readable device or computer-readable storage/communications media. for example, computer readable storage media can include, but are not limited to, magnetic storage devices (e.g., hard disk, floppy disk, magnetic strips), optical disks (e.g., compact disk (cd), digital versatile disk (dvd)), smart cards, and flash memory devices (e.g., card, stick, key drive). of course, those skilled in the art will recognize many modifications can be made to this configuration without departing from the scope or spirit of the various embodiments. in addition, the words “example” and “exemplary” are used herein to mean serving as an instance or illustration. any embodiment or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments or designs. rather, use of the word example or exemplary is intended to present concepts in a concrete fashion. as used in this application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or”. that is, unless specified otherwise or clear from context, “x employs a or b” is intended to mean any of the natural inclusive permutations. that is, if x employs a; x employs b; or x employs both a and b, then “x employs a or b” is satisfied under any of the foregoing instances. in addition, the articles “a” and “an” as used in this application and the appended claims should generally be construed to mean “one or more” unless specified otherwise or clear from context to be directed to a singular form. moreover, terms such as “user equipment,” “mobile station,” “mobile,” subscriber station,” “access terminal,” “terminal,” “handset,” “mobile device” (and/or terms representing similar terminology) can refer to a wireless device utilized by a subscriber or user of a wireless communication service to receive or convey data, control, voice, video, sound, gaming or substantially any data-stream or signaling-stream. the foregoing terms are utilized interchangeably herein and with reference to the related drawings. furthermore, the terms “user,” “subscriber,” “customer,” “consumer” and the like are employed interchangeably throughout, unless context warrants particular distinctions among the terms. it should be appreciated that such terms can refer to human entities or automated components supported through artificial intelligence (e.g., a capacity to make inference based, at least, on complex mathematical formalisms), which can provide simulated vision, sound recognition and so forth. as employed herein, the term “processor” can refer to substantially any computing processing unit or device comprising, but not limited to comprising, single-core processors; single-processors with software multithread execution capability; multi-core processors; multi-core processors with software multithread execution capability; multi-core processors with hardware multithread technology; parallel platforms; and parallel platforms with distributed shared memory. additionally, a processor can refer to an integrated circuit, an application specific integrated circuit (asic), a digital signal processor (dsp), a field programmable gate array (fpga), a programmable logic controller (plc), a complex programmable logic device (cpld), a discrete gate or transistor logic, discrete hardware components or any combination thereof designed to perform the functions described herein. processors can exploit nano-scale architectures such as, but not limited to, molecular and quantum-dot based transistors, switches and gates, in order to optimize space usage or enhance performance of user equipment. a processor can also be implemented as a combination of computing processing units. as used herein, terms such as “data storage,” data storage,” “database,” and substantially any other information storage component relevant to operation and functionality of a component, refer to “memory components,” or entities embodied in a “memory” or components comprising the memory. it will be appreciated that the memory components or computer-readable storage media, described herein can be either volatile memory or nonvolatile memory or can include both volatile and nonvolatile memory. what has been described above includes mere examples of various embodiments. it is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing these examples, but one of ordinary skill in the art can recognize that many further combinations and permutations of the present embodiments are possible. accordingly, the embodiments disclosed and/or claimed herein are intended to embrace all such alterations, modifications and variations that fall within the spirit and scope of the appended claims. furthermore, to the extent that the term “includes” is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term “comprising” as “comprising” is interpreted when employed as a transitional word in a claim. in addition, a flow diagram may include a “start” and/or “continue” indication. the “start” and “continue” indications reflect that the steps presented can optionally be incorporated in or otherwise used in conjunction with other routines. in this context, “start” indicates the beginning of the first step presented and may be preceded by other activities not specifically shown. further, the “continue” indication reflects that the steps presented may be performed multiple times and/or may be succeeded by other activities not specifically shown. further, while a flow diagram indicates a particular ordering of steps, other orderings are likewise possible provided that the principles of causality are maintained. as may also be used herein, the term(s) “operably coupled to”, “coupled to”, and/or “coupling” includes direct coupling between items and/or indirect coupling between items via one or more intervening items. such items and intervening items include, but are not limited to, junctions, communication paths, components, circuit elements, circuits, functional blocks, and/or devices. as an example of indirect coupling, a signal conveyed from a first item to a second item may be modified by one or more intervening items by modifying the form, nature or format of information in a signal, while one or more elements of the information in the signal are nevertheless conveyed in a manner than can be recognized by the second item. in a further example of indirect coupling, an action in a first item can cause a reaction on the second item, as a result of actions and/or reactions in one or more intervening items. although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement which achieves the same or similar purpose may be substituted for the embodiments described or shown by the subject disclosure. the subject disclosure is intended to cover any and all adaptations or variations of various embodiments. combinations of the above embodiments, and other embodiments not specifically described herein, can be used in the subject disclosure. for instance, one or more features from one or more embodiments can be combined with one or more features of one or more other embodiments. in one or more embodiments, features that are positively recited can also be negatively recited and excluded from the embodiment with or without replacement by another structural and/or functional feature. the steps or functions described with respect to the embodiments of the subject disclosure can be performed in any order. the steps or functions described with respect to the embodiments of the subject disclosure can be performed alone or in combination with other steps or functions of the subject disclosure, as well as from other embodiments or from other steps that have not been described in the subject disclosure. further, more than or less than all of the features described with respect to an embodiment can also be utilized.
074-730-711-553-971	US	[ "US" ]	G09F19/22	1993-11-15T00:00:00	1993	[ "G09" ]	method and apparatus for displaying information along compliant ground	method and apparatus for displaying information along an extended area of compliant ground, such as along a sandy beach, the method and apparatus temporarily displaying a series of repetitive messages upon the extended area by impressing the messages into the compliant ground at regularly spaced intervals along the extended area.	1. a method of displaying information along an extended area of compliant ground, the method comprising: temporarily displaying a series of repetitive messages upon the extended area by smoothing the compliant ground alone at least a portion of the extended area to establish a path of smoothed compliant ground along the extended area; and impressing the messages into the compliant ground at regularly spaced intervals along the path of smoothed compliant around by rolling an impressing means along the smoothed compliant ground immediately subsequent to smoothing the compliant ground along the portion of the extended area to attain rolling contact between the rolling impressing means and the compliant ground along the path of smoothed compliant ground, the rolling impressing means carrying at least one latent image of the message. 2. a method of displaying information along an extended area of compliant ground, the method comprising: temporarily displaying a series of repetitive messages upon the extended area by smoothing the compliant around along at least a portion of the extended area to establish a path of smoothed compliant around along the extended area, the smoothing including raking the compliant around of the extended area along the portion thereof; and impressing the messages into the compliant around at regularly spaced intervals along the path of smoothed compliant around by rolling an impressing means along the smoothed compliant ground immediately subsequent to raking to attain rolling contact between the rolling impressing means and the compliant ground along the path of smoothed compliant ground, the rolling impressing means carrying at least one latent image of the message. 3. a method of displaying information along an extended area of compliant ground, the method comprising: temporarily displaying a series of repetitive messages upon the extended area by smoothing the compliant around along at least a portion of the extended area to establish a path of smoothed compliant around along the extended area; and impressing the messages into the compliant ground at regularly spaced intervals along the path of smoothed compliant ground by embossing the compliant ground along the path of smoothed compliant ground immediately subsequent to smoothing the portion of the extended area. 4. a method of displaying information along an extended area of compliant ground, the method comprising: temporarily displaying a series of repetitive messages upon the extended area by smoothing the compliant around along at least a portion of the extended area to establish a path of smoothed compliant around along the extended area; and impressing the messages into the compliant around at regularly spaced intervals along the path of smoothed compliant around by debossing the compliant ground along the path of smoothed compliant ground immediately subsequent to smoothing the portion of the extended area. 5. apparatus for displaying information along an extended area of compliant ground, the apparatus comprising: means for temporarily displaying a series of repetitive messages upon the extended area; the means for temporarily displaying including impressing means carrying at least one latent image of the message for impressing the messages into the compliant around at regularly spaced intervals along the extended area; and means for smoothing the compliant ground along at least a portion of the extended area to establish a path of smoothed compliant ground along the extended area immediately ahead of the impressing means. 6. the apparatus of claim 5 wherein: the means for temporarily displaying includes rolling impressing means; and the apparatus includes means for rolling the rolling impressing means along the compliant ground for impressing the messages into the compliant ground at fixed regularly spaced intervals along a path established along the compliant ground by rolling contact between the rolling impressing means and the compliant ground along the extended area. 7. the apparatus of claim 6 wherein the means for impressing the messages includes coupling means for coupling the impressing means to a vehicle for traversing the extended area. 8. the apparatus of claim 7 wherein the impressing means includes a roller having an outer surface for engaging the compliant ground, and graphic elements carried by the outer surface for impressing the messages in the compliant ground. 9. the apparatus of claim wherein the graphic elements are recessed within the outer surface and the messages are embossed in the compliant ground. 10. the apparatus of claim wherein the graphic elements are raised upon the outer surface and the messages are debossed on the compliant ground. 11. the apparatus of claim 5 wherein the means for smoothing includes a rake.	the present invention relates generally to the display and dissemination of information and pertains, more specifically, to method and apparatus for creating temporary messages over an extended area of compliant ground, such as along beaches and the like, for view during a limited period. the dissemination of information over extended areas through the use of visual displays capable of being viewed over a wide field of view is quite well known. for example, advertising and public service announcements commonly are disseminated at resort areas and at various sporting events by visual messages displayed for wide view, such as on airships and aircraft, and by skywriting, as well as by the placement of a myriad of signs throughout the various areas. some of these practices are considered by many to be obtrusive and quite unattractive, as well as wasteful of resources and harmful to the ecology, and especially the ecology associated with bathing beaches, which have become a favorite site for such activities. the present invention provides method and apparatus for creating temporary displays for the dissemination of information over extended areas, such as the temporary placement of messages along a beach for purposes of advertising or public service announcements. as such, the present invention attains several objects and advantages, some of which are summarized as follows: enables the dissemination of information, such as advertising messages and public service announcements, along extended areas, such as bathing beaches, unobtrusively and without permanent defacement of the extended area; creates a series of repetitive visual displays of information along an extended area of compliant ground, such as along a sandy bathing beach, a snow-covered ski slope, and the like, without permanently affecting the extended area over which the information is disseminated; enables the use of generally available equipment, with only minimal additional apparatus, for impressing messages over an extended area of compliant ground to convey advertising and public service information; promotes conservation and protects against the defacement of resort and recreation areas; conveys information, such as advertising and public service messages, over a wide area without additional clutter and without permanent alteration of the area. the above objects and advantages, as well as further objects and advantages, are attained by the present invention, which may be described briefly as the method of and apparatus for displaying information along an extended area of compliant ground, such as along a sandy beach, the method and apparatus comprising: the step of and means for temporarily displaying a series of repetitive messages upon the extended area by impressing the messages into the compliant ground at regularly spaced intervals along the extended area. the invention will be understood more fully, while still further objects and advantages will become apparent, in the following detailed description of preferred embodiments of the invention illustrated in the accompanying drawing, in which: fig. 1 is a pictorial perspective view of an apparatus constructed in accordance with the invention and illustrates a method of the invention; fig. 2 is an enlarged fragmentary view of a portion of fig. 1; fig. 3 is a top plan view of a portion of the apparatus; fig. 4 is a cross-sectional view taken along line 4--4 of fig. 3; and fig. 5 is a cross-sectional view similar to fig. 4, but illustrating another embodiment of the invention. referring now to the drawing, and especially to figs. 1 and 2 thereof, an extended area of relatively soft, compliant ground is illustrated in the form of a bathing beach 10, where the compliant ground is constituted primarily of sand. bathing beach 10 provides a recreational or resort facility for the public and, as such, is visited daily by large numbers of people. during the season of such daily visits, a grounds keeper 12 combs the beach 10 each morning with a rake 14 coupled to a tractor 16 by means of a draw bar 18 so as to be drawn by the tractor 16 over the beach 10 to maintain the beach 10 clean and orderly for the day's use. usually, such beaches have various signs posted along the beach advising the users of the beach of rules and regulations and admonishing users to make an effort to keep the beach clean and generally free of litter. however, such posted signs are found by many to be unsightly and to detract from the natural beauty of the beach. moreover, the signs are subjected to weather and other wear and tear and do not exhibit a long service life. in addition, vandalism and graffiti often take their toll of such signs. the present invention replaces conventional signs with messages impressed directly in the sand. thus, an apparatus constructed in accordance with the invention includes a roller 20 journaled on a frame 22 coupled at 23 to the draw bar 18 for following the rake 14. roller 20 has an outer cylindrical surface 24 which carries a latent message 26, in relief. upon drawing the roller 20 along the beach 10, behind the rake 14, the latent message 26 is impressed in the compliant sand of beach 10, and is repeated in a series of repetitive visual messages 28 placed in regular spaced intervals along the path 29 traveled by the tractor 16. impressing of the latent message 26 to establish a visual message 28 in the compliant sand of the beach 10 is facilitated by smoothing the sand somewhat, immediately ahead of roller 20, preferably with the rake 14, so as to enable the roller 20 to traverse a relatively smooth surface along the path 29. as the roller 20 rotates, the series of repetitive visual messages 28 is laid down by rolling contact between the surface 24 of the roller 20 and the sand of the beach 10 along the path 29. in the illustrated example, the visual messages 28 are in the form of a series of repetitive signs 30 admonishing users of the beach 10 to refrain from littering the beach 10. in addition, each visual message 28 includes a logo, or the like, for identifying an advertiser who sponsors the program promoted by the text of the visual message 28. the signs 30 are spread over the beach 10 so as to be viewed by users of the beach 10, all along the beach 10. the signs 30 are temporary in that the signs 30 are obliterated during the day by the traffic on the beach 10; however, enough signs 30 are present so that the visual message 28 is seen by users before all of the signs 30 are obliterated. since the beach 10 normally is raked daily, the signs 30 are replaced daily, without excessive added effort, and are made available for each day's visitors. turning now to figs. 3 and 4, latent message 26 is seen to include graphic elements in the form of raised characters 32 along the outer cylindrical surface 24 of the roller 20. in this manner, the visual messages 28 of signs 30 are embossed in the sand of the beach 10. in the alternate embodiment shown in fig. 5, the latent message 26 is seen to include graphic elements in the form of recessed characters 34 along the cylindrical surface 24 of the roller 20 and the visual messages 28 of signs 30 are debossed in the sand of the beach 10. in either instance, the signs 30 are laid down in a repetitive series of visual messages 28 at regularly spaced intervals along the beach 10 for presenting the information in sign 30 for view over a very wide area. the signs 30 are temporary and represent no harm to the ecology of the beach 10. it will be appreciated that the method and apparatus of the invention is available for displaying visual messages 28 in compliant ground found at a variety of locations. thus, in addition to providing visual messages 28 along beaches 10, as described above, visual messages 28 may be impressed in snow at ski slopes and along other areas at winter resorts. various race tracks, such as horse racing tracks and automobile dirt tracks, which ordinarily are raked between races, may be impressed with a series of visual messages 28, as described herein. it will be seen that the present invention attains all of the objects and advantages summarized above, namely: enables the dissemination of information, such as advertising messages and public service announcements, along extended areas, such as bathing beaches, unobtrusively and without permanent defacement of the extended area; creates a series of repetitive visual displays of information along an extended area of compliant ground, such as along a sandy bathing beach, a snow-covered ski slope, and the like, without permanently affecting the extended area over which the information is disseminated; enables the use of generally available equipment, with only minimal additional apparatus, for impressing messages over an extended area of compliant ground to convey advertising and public service information; promotes conservation and protects against the defacement of resort and recreation areas; conveys information, such as advertising and public service messages, over a wide area without additional clutter and without permanent alteration of the area. it is to be understood that the above detailed description of preferred embodiments of the invention are provided by way of example only. various details of procedure, design and construction may be modified without departing from the true spirit and scope of the present invention as set forth in the appended claims.
075-244-351-485-479	US	[ "US", "GB", "WO" ]	D05C15/04,D05C15/18,D05C15/32,D05C15/34,D05C17/02	1992-12-21T00:00:00	1992	[ "D05" ]	textured surface effect fabric and methods of manufacture	tufting apparatus includes servomotors driving front and back yarn feed rolls for feeding yarns to the needles of the front and back needle bars, respectively. incremental servomotor control for each stitch enables a height differential between immediately adjacent stitches in excess of 3/32 inch (2.38 mm). by providing yarns of multiple colors and textures, a variety of patterns and textured surface effects are provided in the surface of the tufted pile fabric.	1. a method of manufacturing a tufted pile fabric comprising the steps of: providing front and back needle bars spaced one from another in a warp direction with each bar carrying a plurality of needles spaced from one another in the weft direction with at least one needle bar movable in a weft direction relative to another of said needle bars; supplying a plurality of yarns to a single feed roll for each of the front and back needle bars, respectively; stitching a plurality of yarns into a substrate by operation of the needle bars to form a tufted pile fabric; controlling yarn feed to said needle bars during stitching to provide a warpwise pattern effect in the tufted pile fabric with immediately adjacent tufts in warpwise rows thereof having different heights relative to the substrate and to one another, including (i) providing a single servomotor for driving each yarn feed roll and (ii) incrementally advancing each said yarn feed roll under control of said servomotor to provide the warpwise pattern effect in the tufted pile fabric; and controlling the movement of said one needle bar in the weft direction to effect a difference in height between next-adjacent stitches in the weft direction, thereby providing warpwise and weftwise patterning effects. 2. a method according to claim 1 wherein the step of controlling yarn feed includes incrementally advancing said yarn feed roll under control of said servomotor to provide a height difference in immediately-adjacent stitches in excess of 3/32 inch. 3. a method according to claim 2 wherein the step of controlling yarn feed includes incrementally advancing said yarn feed roll under control of said servomotor to provide a height difference in immediately-adjacent stitches of about 5/32 inch. 4. a method of manufacturing a tufted pile fabric comprising the steps of: providing front and back needle bars spaced one from another in a warp direction with each bar carrying a plurality of needles spaced from one another in the weft direction with at least one needle bar movable in a weft direction relative to another of said needle bars; supplying a plurality of yarns to a single feed roll for each of the front and back needle bars, respectively; stitching a plurality of yarns from said yarn feed rolls into a substrate to form a tufted file fabric; and effecting a pattern in the tufted fabric of different tuft heights in one-tuft increments in the warp and weft directions by (i) providing a single servomotor for driving each yarn feed roll; (ii) incrementally advancing said yarn feed roll under control of said servomotor; and (iii) controlling the movement of said one needle bar in the weft direction while incrementally advancing the yarn feed rolls by said servomotors. 5. a method according to claim 4 including incrementally advancing said yarn feed roll under control of said servomotor to provide a difference in tuft height in immediately-adjacent warpwise stitches in excess of 3/32 inch. 6. a method according to claim 4 including incrementally advancing said yarn feed roll under control of said servomotor to provide a height difference in immediately-adjacent warpwise stitches of about 5/32 inch. 7. a method according to claim 4 including stitching at a rate of about 8 stitches per second or more and effecting said pattern by stitching at said rate or more to obtain a difference in tuft height between immediately-adjacent warpwise stitches in excess of 3/32 inch in about 0.24 seconds or less. 8. a method according to claim 5 including the steps of providing a loop pile and a cut pile in immediately-adjacent warpwise stitches.	technical field the present invention relates to tufted pile fabrics and methods of manufacturing such fabrics and particularly relates to a tufted pile fabric affording novel and improved patterns and textures for surface effects and methods of manufacture. background as well known, tufted fabrics are those fabrics in which a plurality of pile yarns are pushed or stitched through a primary backing or substrate forming loops which comprise the fabric surface or which loops may be cut to form a cut pile fabric surface. machinery for forming these tufted fabrics is likewise well known. in machinery of this type, one or more needle bars having a plurality of needles threaded with individual yarns are reciprocated, typically vertically, to pass the needles through the substrate to form loops which can remain as the fabric surface or be subsequently cut to form cut pile. the yarns are fed to the needle bars from yarn supply creels by one or more feed rolls. where straight stitches are formed in the warp direction and the needle bar or bars are not shifted in the weft direction, the yarn feed rolls are typically controlled to provide a constant yarn feed to the needles. with a weftwise shift in the one or more of the needle bars, the yarn feed rolls are controlled to provide more or less yarn to the needles so that a smooth face of constant pile height relative to the substrate is maintained on the fabric surface. in certain tufting machines, the feed rolls which control the yarn feed to the needles of the needle bar or bars are driven by servomotors which allow different lengths of yarn to be fed to the needles upon shifting the needle bar or bars. that is, when a needle bar shifts so that the needles are aligned with different hooks or loopers, there is insufficient yarn fed to the needles to preclude a chop or low line from appearing across the face of the fabric. to preclude this and to provide a smooth face across the fabric surface, a variation in yarn feed is adjusted by adjusting the servomotors driving the feed rolls to compensate for the extra yarn required to accommodate the weftwise movement of the needle bar. thus, to avoid robbing previous tufts or stitches of yarn due to insufficient yarn feed to the next tuft or stitch, the servomotor controlled feed rolls in the past have been designed, programmed and utilized to provide the yarn feed compensation necessary to create a smooth face in the resulting fabric. that is to say, feed rolls for controlling yarn feed to the tufting needles have heretofore been driven by servomotors to allow different or preselected lengths of yarn to be fed to the needles when the needle bar or bars are shifted to new hook or looper positions, to enable the resulting fabric surface to remain smooth and level. further, tufted fabrics, i.e., fabrics having tufts of different heights throughout the fabric, have been provided in the past, for example, in carpets. various techniques have been previously employed to provide tufted piles of such different heights. for example, cam disks have been used for varying the height of individual tufts in a stitch row in the weft direction. as the cam disks rotate, the yarn feed tension changes and differences in pile height are thus created. roll pattern attachments, pattern slats and control scrolls have similarly been used to vary pattern height. however, in none of these prior tufting arrangements, has precise and accurate control of the height of each tuft been achieved in such manner that the difference in height between next-adjacent tufts in one or more stitch rows in the warp direction can be greater than 3/32 inch (2.38 mm). that is to say, with prior mechanisms, the variation in tuft height from one tuft to a succeeding tuft in the same stitch row in the warp direction has not exceeded 3/32 inch (2.38 mm). where a jump in height of next-adjacent tufts in a warpwise stitch row in excess of 3/32 inch (2.38 mm) was required, the resulting fabric necessarily, because of the type of tufting apparatus used, had tufts of an intermediate height intervening between the tufts of the desired heights. that is, the incremental height adjustment of warpwise immediately next-adjacent tufts was limited in prior machines to 3/32 inch (2.38 mm) or less in the fabric, hence limiting the nature of the pattern in the fabric. these intermediate tufts produced an undesirable tapering effect in the tufts, albeit the fabric was patterned with warpwise non-next-adjacent tufts ultimately having a height differential in excess of 3/32 inch (2.38 mm). disclosure of the invention in accordance with the present invention, unique patterns and textures providing novel and improved visual effects are achieved by utilizing a yarn feed control in a tufting apparatus to intentionally accurately and precisely create high and low areas in the tufted pile surface. the surface effects are enhanced and accentuated when yarns having different colors and/or textures are creeled and fed the various needles of the needle bar or bars. in a preferred embodiment of the present invention, a tufting apparatus is provided having a pair of staggered needle bars. the needles of the front needle bar are fed by front yarn feed rolls, while the needles of the back needle bar are fed by back yarn feed rolls. each of the front and back feed rolls are controlled independently by an associated servomotor. the servomotors of the front and back feed rolls are preferably programmed differently to provide different yarn feeds to the needles of the associated needle bar, with or without likewise shift of the needle bars, to provide high and low tufts in warpwise and/or weftwise adjacent stitches. for example, without shifting the needle bars, a high or low tuft striping effect may be created in the warp direction, with one or more rows of low tuft piles exposed to a greater or lesser extent between one or more rows of high tuft piles. by timing the occurrences of the formation of the high and low tufts on the front and back bars, high and low ribs across the fabric face can be formed. by timing the occurrences of the high pile stitches on the front bar out-of-phase with the high pile stitches on the back feed roll, an unusual texture is provided. when one or both of the needle bars are shifted or stepped in the weft direction, a pattern of high and low or intermediate height tufts can be provided in both the warp and weft directions. unique color combinations and variations in surface aesthetics can be achieved by a thread up of different colored yarns and/or yarns of different textures. by using servomotors to intentionally, precisely and accurately control yarn feed to provide high and low pile heights within a graphic tufted pattern, a completely different visual effect is achieved as compared with employing servomotors to compensate by yarn feed control for the more or less yarn required upon a needle bar shift to achieve a level surface in the resulting fabric. in a preferred embodiment according to the present invention, there is provided a tufted pile fabric comprising a substrate, and a plurality of yarns stitched into the substrate in warpwise stitch rows and spaced weftwise from one another forming a tufted pile on one face of the substrate, at least one pair of immediately-adjacent tufts having a difference in height in one stitch row greater than 3/32 inch (2.38 mm). in a further preferred embodiment according to the present invention, there is provided a method of manufacturing a tufted pile fabric comprising the steps of stitching a plurality of yarns into a substrate to form a tufted pile fabric and controlling yarn feed during stitching to provide a pattern effect in the tufted pile fabric with immediately-adjacent tufts in warpwise rows thereof having differences in heights of the tufts relative to the substrate and to one another, including (i) providing a servomotor for driving a yarn feed roll and (ii) incrementally advancing the yarn feed roll under control of the servomotor to provide the pattern effect in the tufted pile fabric including the differential heights of the tufts. in a still further preferred embodiment according to the present invention, there is provided a method of manufacturing a tufted pile fabric comprising the steps of stitching a plurality of yarns from a yarn feed roll into a substrate to form a tufted pile fabric and effecting a pattern in the tufted fabric of different tuft heights in one-tuft increments in the warp direction by (i) providing a servomotor for driving the yarn feed roll and (ii) incrementally advancing the yarn feed roll under control of the servomotor to provide the pattern in one-tuft increments. accordingly, it is a primary object of the present invention to provide a novel and improved tufted fabric and methods of making the tufted fabric using servomotor controlled yarn feed rollers to create texture and patterns in the fabric. brief description of the drawings fig. 1 is a schematic representation of a tufting apparatus for forming the tufted fabric according to the present invention; fig. 2 is a fragmentary perspective view illustrating the tufted surface of a fabric constructed in accordance with the present invention; fig. 3 is a cross-sectional view thereof taken generally about on line 3--3 in fig. 2; fig. 4 is a fragmentary perspective view similarly as in fig. 2 illustrating a combined cut/loop pile fabric; and fig. 5 is a fragmentary side elevational view illustrating a fabric having alternating high cut pile and low loop pile in one stitch. best mode for carrying out the invention reference will now be made in detail to a present preferred embodiment of the invention, an example of which is illustrated in the accompanying drawings. referring now to fig. 1, there is illustrated a tufting apparatus for forming a tufted fabric f. to form fabric f, a substrate s is provided on a roll r and is moved linearly in a longitudinal direction, indicated by the arrow. in the illustrated form, two needle bars are provided for forming the tufts in substrate s as the substrate moves longitudinally past the needle bars. thus, front and back needle bars 10 and 12, respectively, are provided, although it will be appreciated that a single needle bar may be used in the present invention. as well known, each needle bar 10 and 12 includes a plurality of needles n spaced one from the other in the weft direction, with the needles of one bar being staggered weftwise relative to the needles of the other bar. the needle bars 10 and 12 are mounted for reciprocating movement toward and away from substrates, i.e., in the vertical direction indicated by the double arrows. yarn y is fed from a pair of feed rolls 14 and 16 from supply creels, not shown, to the eyes of the needles of the respective needle bars 10 and 12. it will be appreciated that a plurality of yarns are fed to each of the front and back feed rolls 14 and 16, as is conventional. servomotors 18 and 20 are drivingly coupled to the feed rolls 14 and 16, respectively, for incrementally advancing the feed rolls and hence the yarns for supplying the yarns to the needles of the front and back needle bars, respectively. the operation of the servomotors 18 and 20 is under the control of a computer c, which, in accordance with the present invention, instructs the servomotors to drive the feed rolls to supply the same or a greater or lesser extent of yarns in each of the front and back needle bars in accordance with a predetermined program. in an exemplary embodiment of a tufting apparatus for use in producing a tufted fabric, e.g., a carpet, according to the present invention, the front and back needle bars 10 and 12, respectively, may be spaced one from the other in the warp direction of the tufting machine a distance, for example, of 0.25 inches. the needles on each needle bar may be spaced one from the other in the weft direction on 1/5 inch (5.08 mm) centers and, hence, the needles of the front and back needle bars provide a 1/10 gauge. for manufacturing a typical twelve-foot wide carpet, for example, there would be a total of 1,440 needles in a 1/10 ga tufting machine with each needle bar carrying 720 needles and hence 720 discrete yarns. while not shown in the drawings, each needle bar is associated with a plurality of weftwise spaced loopers for forming tufted loop pile or with hooks-and-knives for forming tufted cut pile. the loopers or hooks-and-knives are, of course, located below the substrate s as viewed in fig. 1, a separate set of loopers or hooks-and-knives being provided each needle bar. in accordance with the present invention, servomotors 18 and 20 are provided to independently adjust the yarn feed precisely and accurately for each of the front and back feed rolls 14 and 16, respectively, in a predetermined number of increments. for example, eight different increments of movement may be provided within a predetermined total range of movement. in this example, therefore, eight different yarn feeds may be provided each of the front and back feed rolls independently of one another. thus, various combinations of yarn feeds among the front and back feed rolls are provided. also, a selected yarn feed corresponding to a selected increment of the servomotor is programmed for each weftwise row of stitches in the fabric to provide a preselected height of tuft in that tow. accordingly, by variously incrementally adjusting the servomotors under computer control, the magnitude of the yarn feed for each needle bar for each weftwise row of stitches is predetermined. the height of each tuft above the substrate in each weftwise extending stitch row can therefore be selectively accurately and precisely adjusted by preselecting the incremental advance of the associated servomotor. thus, the height of immediately-adjacent stitches in each warpwise extending row can be varied precisely and accurately according to each selected increment of servomotor advance. further, by placing yarns of various colors or textures, or both, in a planned thread-up for each needle bar, a wide variety of patterning can be provided. by employing servomotor driven yarn feed rolls, the present invention achieves patterning effects in the fabric surface not heretofore obtainable. this is due to the ability of the servomotor to accurately and precisely control the yarn feed for each warpwise stitch such that the height of next-adjacent tufts in the warp direction can be accurately and precisely controlled. that is, the servomotors provide the instantaneous response necessary for the accurate and precise underfeed or overfeed of the yarn to form the desired pile height in the pattern. particularly, this permits jumps in heights between next-adjacent warpwise tufts in excess of 3/32 inch (2.38 mm) and which height jumps were not obtainable without tufts of in-between height intervening between immediately-adjacent warpwise tufts in fabrics produced by prior tufting machinery. also, because of the use of two needle bars, timed in operation relative to one another, the present invention also provides for accurate and precise differences in height between next-adjacent stitches in the weft direction including height differentials in excess of 3/32 inch (2.38 mm). referring now to a specific embodiment of the present invention illustrated in fig. 2, there is provided a tufted loop pile fabric comprising the substrate s and a plurality of rows of stitches forming tufts extending in the machine or warp direction, as indicated by the arrow. the needle bars 10 and 12 and individual needles on those bars are also schematically illustrated. it will be appreciated that fig. 2 illustrates the fabric from the tufted side of the fabric, the needle bars 10 and 12 forming the tufts from the underside of the substrate s in this view. in contrast, the illustration in fig. 1 shows the manufacture of the fabric, with the backside of the substrate facing upwardly and the tufts facing downwardly from the substrate. the step of the needle bars 10 and 12 in the weft direction is illustrated by the weftwise distance between the dashed lines from the needles to the stitches formed by those needles. in this form of exemplary fabric, it will be appreciated from a review of drawing fig. 2, that a plurality of rows of stitches are formed, with the stitches in each row in the warp direction having two high piles followed by two low piles with that configuration being repeated in the machine direction. additionally, the two high piles in each warpwise stitch row lie in registration with two low piles in the adjoining stitch row. depending upon the relative difference in height between high and low tufts, the low tufts will, for large height differentials, be obscured or blocked from view by the high tufts. for example, where the difference in height between the high and low tufts, whether in the warp or weft directions, or both, is about 5/32 inch (3.97 mm) or more, the low piles will be substantially obscured from view in a 1/10 gauge fabric with a 1/4 inch stagger between needle bars. obviously, the nature of the pile yarn will also, to some extent, determine whether or not the low loop tufts are obscured and the difference in height between the high and low tufts necessary for those low tufts to be obscured. it will be appreciated that a variety of patterning effects may be accomplished by varying the high and low tufts within the fabric. for example, a striping or ribbing effect in the warp direction can be accomplished by maintaining the tufts in one or more weftwise adjacent rows in a low pile configuration, while an intervening row or rows of tufts in the warp direction have a high pile configuration. high and low checkerboard patterns can be obtained, for example. also, meandering high and low patterns can be provided throughout the fabric. it will be appreciated that these various combinations of high and low tufts can be provided because of the precise and accurate incremental yarn feed control, and hence yarn height control for each tuft, afforded by the servomotors. this precision and accuracy of control in the formation of patterns in the fabric has heretofore been unknown and particularly controlling heights in the warp direction of immediately-adjacent tufts in excess of 3/32 inch (2.38 mm) height differentials. additional aesthetic characteristics can be accomplished by color variations in and/or textures of the plurality of yarns provided the fabric. for example, and for color variation, if the yarns supplied the front needle bar 10 have a three-color repeat for needles 1, 3 and 5 across the machine width, then similarly the yarns supplied the back needle bar 12 have a three-color repeat for needles 2, 4 and 6 (the colors in each needle bar being different). variations in color readily appear in the fabric depending on weftwise movement of the needle bars and pile height. for example, for most yarns and fabrics, the low loop will be obscured, and hence their colors, by the adjacent high loops if the height differential exceeds a predetermined value, e.g., 5/32 inch (3.97 mm). fig. 2 illustrates a single-step sequence for each needle bar for each stitch. that is, the front and back bars move one step in opposite weftwise directions for each stitch for a predetermined number of steps before returning in similar but opposite steps to the neutral position. thus, for the first transverse stitch row a, yarns 1, 3, 5 of different colors appear in warpwise stitch rows a, c and e as high loops. in that same transverse stitch row, different color yarns 2, 4 and 6 appear as low loops in warpwise stitch rows b, d and f. in the next warpwise stitch row, the needle bars 10 and 12 have been shifted one step in opposite weft directions as indicated by the arrows. accordingly, yarn 1 appears in weft stitch row b, warp row c as a high loop. yarn 3 appears in weft row b, warp row e as a high loop. stitch yarn 5 appears in weft row b, warp row g as a high loop. with the shift of the back needle bar 12, yarn 2 is shifted from warp row h, weft row a, to warp row f, weft row b and appears as a low loop. yarn 6 shifts from warp row f, weft row a, to warp row d, weft row b and appears as a low loop. yarn 4 shifts from warp row d, weft row a to warp row e, weft row b and appears as a low loop. upon the second shift of needle bar 10 to the right, stitch yarn 1 becomes a low loop in warp row e, weft row c and, in the next stitch and after the next step, becomes a low loop in warp row g, weft row d as a low loop. stitch yarns 3 and 5 are similarly shifted in location and height. stitch yarn 2, upon the second shift of needle bar 12 to the left, becomes a high loop in warp row d, weft row c and, in the next stitch, becomes a high loop in warp row b, weft row d. stitch yarns 4 and 6 are similarly shifted in location and height. the pattern repeats itself throughout the fabric, with a predetermined number of steps of the needle bars and stepped return before the sequence is repeated. the servomotors are incrementally advanced to provide additional yarn to accommodate the further yarn needed to step from one warp row to a different warp row for each stitch in the illustrated form and also any more or less yarn to provide precise and accurate height control. consequently, with a height differential between the high and low loops sufficient to obscure the low loops from view, e.g., 5/32 inch (3.97 mm), the colors of yarns 1, 3 and 5 appears in the fabric when the tufts formed by yarns 1, 3 and 5 form high loops and are obscured in the fabric when the tufts formed by yarns 1, 3 and 5 form low loops. similarly, the colors of yarns 2, 4 and 6 appear in the fabric when the tufts formed by yarns 2, 4 and 6 form high loops and are obscured in the fabric when yarns 2, 4 and 6 form low loops. with the virtually unlimited patterns of high and low tufts and variations in color available, coupled with the capacity to precisely and accurately control the height of the tufts from stitch to stitch including height differentials in excess of 3/32 inch (2.38 mm), a wide variety of different patterns and textures is available. it will be appreciated that the foregoing description with respect to fig. 2 applies equally to cut/loop piles and is not limited to the illustrative example of looped pile fabric. additionally, the present invention is applicable to combined cut/loop pile fabrics, e.g., illustrated in fig. 4. thus, a pattern of low loops and high cut loops 30 and 32, respectively, may be provided as illustrated similar to the previously described pattern but with the high loops cut. with reference to fig. 5, there is illustrated a fabric having alternating high cut tufts and low loop tufts for each stitch. the high cut tufts 36 and the low loop pile 38 provide a difference in tuft height in successive stitches in excess of 3/32 inch (2.38 mm) between immediately adjacent stitches in the warp direction. in the illustrated form, the rows of stitches alternate vis-a-vis the location of the high cut tufts and the low loop tufts in the weft direction. in a preferred embodiment and as a representative example hereof, the tufting machine may be driven at 500 rpm to provide about 8.33 stitches per second. accordingly, the present invention can provide a difference in tuft height in excess of 3/32 inch (2.38 mm) between immediately-adjacent stitches in the warp direction in about 0.24 seconds and this can be accomplished with a needle bar shift of up to three gauges. at a maximum speed of about 1100 rpm, about 18 stitches per second can be provided affording a difference in tuft height in excess of 3/32 inch (2.38 mm) between immediately-adjacent stitches in the warp direction in about 0.11 seconds. while the invention has been described with respect to what is presently regarded as the most practical embodiments thereof, it will be understood by those of ordinary skill in the art that various alterations and modifications may be made which nevertheless remain within the scope of the invention as defined by the claims which follow.
075-480-017-277-388	US	[ "US", "EP" ]	A42B3/30,A42B3/04,F41H1/04,G01S19/13	2018-01-08T00:00:00	2018	[ "A42", "F41", "G01" ]	helmet with integrated sensors	a ballistic helmet system having an integrated circuit layer electrically coupled to one or more powered devices, where the ballistic helmet is configured to operate and control the powered devices. the ballistic helmet system comprises a base layer configured to retain the circuit layer. the circuit layer comprises one or more circuit substrates, which may be formed of a flexible material capable of withstanding elevated temperatures that may result from the bonding and curing process of the helmet components.	1 . an integrated helmet system comprising: a base layer defining a helmet portion; a circuit layer, wherein the circuit layer is attached to the helmet portion; and at least one powered device, wherein the at least one powered device is electrically connected to the circuit layer. 2 . the integrated helmet system of claim 1 , wherein the circuit layer further comprises one or more circuit substrates. 3 . the integrated helmet system of claim 2 , wherein the at least one circuit substrates is formed of a flexible material. 4 . the integrated helmet system of claim 3 , wherein the flexible material is capable of withstanding high temperatures. 5 . the integrated helmet system of claim 2 , wherein each of the one or more circuit substrates further comprises one or more conductive pathways for transmitting power, control, and data signals to the one or more powered devices. 6 . the integrated helmet system of claim 2 , wherein each of the one or more circuit substrates further comprises one or more antennas, wherein the one or more antennas are electrically coupled to a communications device. 7 . the integrated helmet system of claim 6 , wherein the one or more antennas are selected from the group consisting of radio-frequency identification (rfid) antennas for coupling to an rfid device and global positioning system (gps) antennas for coupling to a navigation system. 8 . the integrated helmet system of claim 2 , wherein at least one of the one or more circuit substrates further comprises a video controller. 9 . the integrated helmet system of claim 1 , wherein the helmet portion further comprises an outer layer. 10 . the integrated helmet system of claim 1 , wherein the one or more powered devices are selected from the group consisting of flashlights, illumination devices, passive night vision devices, enhanced night vision devices, thermal imaging devices, cameras, video recorders, and friend or foe identification (iff) devices. 11 . the integrated helmet system of claim 1 , wherein the helmet portion further comprises a housing portion having a control means for the at least one powered device, wherein the control means is selected from the group consisting of one or more push buttons disposed on the housing, a keypad associated with the at least one powered device, and an on screen interface displayed on a display screen associated with the at least one powered device. 12 . the integrated helmet system of claim 1 , wherein the one or more powered devices is a positioning system. 13 . the integrated helmet system of claim 12 , wherein the positioning system is selected from the group consisting of celestial camera systems, digital compasses, and telemetry devices. 14 . the integrated helmet system of claim 1 , further comprising one or more motion sensors positioned around the helmet portion. 15 . the integrated helmet system of claim 14 , wherein the one or more motion sensors are operatively coupled with one or more cameras, wherein detection of an outside motion by the one or more motion sensors activates transmission of images from the one or more cameras to a user-viewable display screen. 16 . the integrated helmet system of claim 14 , wherein the one or more motion sensors are operatively coupled with one or more audio speakers, wherein detection of an outside motion by the one or more motion sensors activates an aural alert. 17 . the integrated helmet system of claim 1 , further comprising a mounting assembly for mounting an accessory device, wherein said mounting assembly is removably attached to the helmet portion. 18 . the integrated helmet system of claim 17 , wherein the accessory device is selected from the group consisting of camera systems, night vision goggle devices, thermal imaging devices, infrared imaging devices, and head mounted displays. 19 . the integrated helmet system of claim 1 , further comprising an acoustical ring having at least one microphone for detecting directional sound. 20 . the integrated helmet system of claim 1 , further comprising one or more body sensors communicatively coupled to the helmet portion. 21 . the integrated helmet system of claim 20 , wherein at least one of the one or more body sensors is configured to monitor impact. 22 . the integrated helmet system of claim 20 , wherein at least one of the one or more body sensors if configured to monitor vital signs of a user. 23 . the integrated helmet system of claim 1 , further comprising a radio frequency (rf) antenna coupled to an rf transceiver received in the helmet portion. 24 . the integrated helmet system of claim 1 , wherein the helmet portion is formed of a ballistic-resistant material. 25 . the integrated helmet system of claim 1 , further comprising a power source.	cross reference to related application this application claims the priority benefit of provisional application no. 62/614,765 filed jan. 8, 2018. the aforementioned application is incorporated herein by reference in its entirety. background the present invention relates generally to protective helmets such as ballistic helmets or other helmets having a similar construction, such as a ballistic tactical helmet for use by law enforcement personnel, military field or combat helmets, or the like. more particularly, the present disclosure relates to a helmet housing circuit boards for controlling one or more electrical or electronic accessory devices or components attached, integrated, or mounted to the helmet. commonly, a military ballistic helmet or the like is configured to carry one or more accessories or attachments, such as flashlights, viewing optics and devices, such as a number of sensors, cameras, monocular, binoculars, monocular or binocular night vision devices (including passive night vision (nvg) devices and enhanced night vision (envg) devices), thermal imaging devices, cameras (including without limitation visible light camera, thermal cameras, short wave infrared (swir) cameras and so forth), identification friend or foe (iff) systems, communications devices, and so forth. the helmet may be provided with a plurality of openings or holes therein for mounting such accessories to the helmet or for receiving fasteners or other mounting mechanisms or hardware such as threaded fasteners, brackets, grommets, etc. by way of example, the front of a helmet may have openings and holes for mounting an accessory such as a flashlight or a bracket or shroud which can accept a helmet mount for a viewing device as described above. similarly, holes or vias through the ballistic material may be provided in order to provide an electrical connection or signal transmission, e.g., between a power supply mounted at one location on the helmet, e.g., at the rear of the helmet, and an accessory or device located at another position on the helmet, e.g., by running an electrical cable along the interior of the helmet. such hardware or openings which penetrate the ballistic shell, either partially or completely, compromise the anti-ballistic properties of the helmet in these regions. the number and complexity of helmet mounted components are increasing, and such components may be computer or microcontroller-based and controlled through the use of electronic signals and sensors, thus resulting in larger and more complex wiring assemblies and posing difficulties in installing such devices while maintaining the ballistic integrity of the helmet. therefore, there exists a need for an improved method of integrating accessories and electrical interconnection devices into a ballistic or non-ballistic helmet which could replace the surface mounting and wiring typically used for electrical power, data, and/or signal transmission and which would reduce wiring complexity, simplify helmet assembly and device attachment, reduce weight, and allow for additional functionality. summary in one aspect, a ballistic helmet system having an integrated circuit layer electrically coupled to one or more powered devices is provided, where the ballistic helmet is configured to operate and control the powered devices. the ballistic helmet system comprises a base layer configured to retain the circuit layer. the circuit layer comprises one or more circuit substrates, which may be formed of a flexible material capable of withstanding elevated temperatures that may result from the bonding and curing process of the helmet components. in a more limited aspect, a ballistic helmet system having a circuit layer includes communications antennas that may be formed on the circuit substrate and are electrically coupled to a communications devices configured for wireless communications. in another more limited aspect, a ballistic helmet system comprises a combat identification system, such as a friend or foe (iff) system. in another more limited aspect, the ballistic helmet comprises a housing, wherein the brim of the housing contains buttons, keypads, or the like, for controlling the functions and devices integrated into the helmet. in certain preferred embodiments, the controls are situated for ease of access by the wearer while the helmet is in use. in another more limited aspect, a ballistic helmet system comprises one or more video and/or control circuit boards for controlling one or more image sensors and cameras integrated into the ballistic helmet. the helmet system includes a low lux camera, left and right side cameras, and a rear camera. in certain preferred embodiments, the ballistic helmet system includes video controls for controlling operation of the camera system. in another more limited aspect, a ballistic helmet system comprises a positioning system, such as a celestial camera system positioned at the top of the helmet, for calculating the position of the wearer. in another more limited aspect, a ballistic helmet system includes one or more motion sensors positions around the ballistic helmet. the motion sensors may be passive infrared, ultrasonic, microwave, or image sensor based motion detectors. in certain embodiments, the motion sensors may notify the wearer of activity detected from a certain direction through an alert. in certain further embodiments, the motion sensors may be operatively connected to cameras activated by proximity or by detection of motion, upon which the camera will transmit images or video captured to a display screen. in another more limited aspect, a ballistic helmet system includes a mounting assembly configured to removably attach an additional device. the additional device may draw power from the ballistic helmet. in certain embodiments, the mounting assembly includes a pivot assembly to allow the additional device, such as a viewing device, to pivot away from the user's line of sight when the additional device is not in use. in certain embodiments, where the additional device is a viewing device, certain features, such as the video and control circuit boards, may be integrated into the helmet to reduce the size and weight of the additional device. brief description of the drawings the invention may take form in various components and arrangements of components, and in various steps and arrangements of steps. the drawings are only for purposes of illustrating preferred embodiments and are not to be construed as limiting the invention. fig. 1 is an isometric view of an exemplary helmet in accordance with the present disclosure, taken generally from the front and left side. fig. 2 is an isometric view of the helmet appearing in fig. 1 , taken generally from the front and left side, with the outer layer removed for ease of exposition. fig. 3 is another isometric view of the helmet appearing in fig. 1 , taken generally from the front and right side, with the outer layer removed for ease of exposition. fig. 4 is an isometric view of the embodiment appearing in fig. 1 , taken generally from the bottom and left side. fig. 5 is a bottom view of the embodiment appearing in fig. 1 . fig. 6 is a left side elevation view of the embodiment appearing in fig. 1 . fig. 7 is a left side elevation view of the embodiment appearing in fig. 1 , with the outer layer removed for ease of illustration. fig. 8 is a rear elevation view of the embodiment appearing in fig. 1 . fig. 9 is a rear elevation view of the embodiment appearing in fig. 1 , with the outer layer removed for ease of illustration. fig. 10 is a top view of the embodiment appearing in fig. 1 , with the outer layer removed for ease of illustration. fig. 11 is a front elevation view of the embodiment appearing in fig. 1 . fig. 12 is an enlarged, fragmentary view of the helmet illustrating an optional identification friend or foe module. detailed description of the preferred embodiments referring now to the drawings, figs. 1-12 illustrate a ballistic helmet 100 which includes a ballistic shell or base layer 300 , an intermediate circuit layer 400 , and an outer layer(s) 500 (shown in phantom in fig. 2 ) formed in accordance with an embodiment of the present disclosure. in certain embodiments, the base layer 300 may comprise a molded helmet base, e.g., formed by laying up and molding, on a generally helmet shaped pre-form, multiple plies of a fiber reinforced composite material, such as aramid fibers (e.g., kevlar®) or other ballistic fiber impregnated with a polymer resin. other ballistic and non-ballistic helmet types, including metal helmets, are also contemplated. in certain embodiments, the base layer may be formed of a molded ballistic polymer construction. an example of a ballistic helmet into which an integrated accessory mounting and electrical interconnection may be provided includes ballistic helmets available from ceradyne under the product name seamless ballistic® helmet. it will be recognized that the present laminated construction in accordance with this disclosure may be adapted for use with a base component 300 formed of other materials, including other plastic or metal helmet types. the base layer may be a finished helmet or, alternatively, may be an unfinished helmet. when the base layer 300 is a finished helmet, the outer layer 500 serves to retain the circuit layer 400 and integrated devices. in certain embodiments, the outer layer 500 may comprise one or more plies of a ballistic fiber reinforced composite material which contributes to the anti-ballistic properties of the finished helmet. in certain embodiments, the helmet also comprises an inner liner cover 310 which is situated between the circuit layer 400 and the outer layer 500 . the circuit layer 400 includes one or more circuit substrates 115 which may be formed of a flexible material, such as a flexible film or tape, e.g., polyimide, polyester, or other material that is able to withstand the elevated temperatures that may result from the bonding and curing of the helmet 100 components. a conductive, e.g., metalized, pattern is formed on the substrate 420 and is comprised of one or more conductive pathways to provide power, control, and/or data signals, e.g. between integrated sensors and functions or between integrated sensors and the power source. the electrically conductive pattern may be formed via etching, depositing, printing (e.g., using conductive ink containing carbon or other conductive filler), electroplating, or the like to provide a desired conductive pattern. although the illustrated circuit substrate is shown with a plurality of circuit strips extending radially outwardly from the center of the helmet 100 , any desired number of substrates in other shapes and configurations are also contemplated. in addition, circuit components such as one or more antennas may be formed as a part of the electrically conductive pattern on the circuit substrates. for example, one or more communications antennas may be formed on the circuit substrate and electrically coupled to a communications device, which may include one or more rf transceivers 412 , of the type which provides wireless communications between devices or between the wearer and other operators. such communications device may be mounted on the helmet and electrically coupled to the antennas via exposed terminals on the circuit. other antenna types contemplated are radio frequency identification (rfid) antenna(s) for coupling to an rfid device; or gps antenna(s) for coupling to a navigation system worn by the user and either mounted to the helmet system 100 herein or worn or carried elsewhere on the user and eclectically coupled via an adapter. in certain embodiments, the rf transceiver(s) is/are provided on the helmet logic/circuit boards 410 . in certain embodiments, the transceiver(s) 412 include one or more bluetooth transceivers. in certain embodiments, as best seen in fig. 5 , the brim 110 of the helmet 100 may further comprise a housing 115 that wraps in part or entirely around the brim 110 of the helmet 100 . an annular printed circuit substrate 430 is received within the brim housing 115 and electrically couples the circuit substrate elements 420 . the brim housing 115 may contain buttons, keypads, or the like, for controlling the functions and devices integrated into the helmet 100 , such as controls 120 for a video recorder(s) and controls 133 for an iff module 130 . in preferred embodiments, the controls 120 , 133 are situated towards the front of the helmet such that they are accessible by the wearer while the helmet is in use. in certain embodiments, as best seen in fig. 12 , the helmet may include a combat identification system, such as a secure covert identification friend or foe (iff) system. in certain embodiments, the iff system comprises one or more modules 130 incorporated into the housing 115 . the iff module 130 further comprises one or more led lights 131 , which may emit in one or more wavelengths including, but not limited to, infrared (ir), visible, off band short wave infrared (swir), among others. in certain embodiments, the iff module 130 further includes a receiver/responder 132 for responding to an encoded laser interrogation signal. it is contemplated that the iff module 130 may be located elsewhere on the helmet 100 . the iff module 130 further includes led driver circuitry for controlling the led lights 131 . buttons 133 may be provided for actuating the led elements. exemplary button functions include powering on, powering off, blink, blink rate, sos signals, and so forth. such controls 133 may be located on the brim housing 115 . in alternative embodiments, a graphical interface for controlling the led lights 131 through a screen display 535 (e.g., via a graphical user interface or a hierarchy of menu commands) may be provided. in certain embodiments, the circuit layer 400 of the helmet 100 comprises one or more video and/or control circuit boards 410 for controlling one or more image sensors and cameras integrated into the helmet 100 . in certain embodiments, the helmet 100 includes one or more complementary cameras employing photo sensitive arrays, such as metal oxide semiconductor (cmos) image sensors, ccd arrays, or the like positioned around the helmet. in the illustrated embodiments, the helmet system comprises a low lux camera 550 , left and right side cameras 590 , and a rear camera 580 . in certain embodiments, a positioning system, such as a celestial camera system 520 , is positioned at the top of the helmet 100 , for calculating the position of the wearer. in certain embodiments, the celestial camera system 520 may also aid in positioning weapons. the celestial camera system 520 includes at least one sensor for imaging the sky and/or at least one celestial object and associated control logic and memory programmed with a celestial catalog of known positions of at least one celestial object at various times. the celestial camera system 520 further comprises control logic for calculating a user's position based on the images captured by the camera and known positions of the celestial object as provided by the celestial catalog. in alternative embodiments, the celestial camera system 520 may transmit data to a remote database of known positions of celestial objects at various times for reference and/or calculation through the algorithms to determine location. in certain embodiments, as an alternative or additional positioning system, a digital compass and/or a telemetry device to establish magnetic azimuth, gyroscopic azimuth and elevation, is provided on the helmet 100 . the video controls 120 may include a plurality of buttons, allowing the user to navigate an on-screen interface, e.g., a menu-based or other graphical interface, displayed on the display screen 535 for controlling operation of the camera system 520 and/or other cameras integrated into the helmet, such as the cameras 550 , 580 , 590 . the controls may optionally include a dedicated power button, which may be omitted, wherein the camera system can be powered on via one or more of the buttons, including through button press combinations and/or sequences, and/or through a “power off” option available through the on-screen interface. each image sensor may automatically transmit images to a display screen 535 , such as a liquid crystal display (lcd), light emitting diode (led) display, or organic light emitting diode (oled) display, or the like. the display screen 535 may also be integrated into the helmet, such that the display screen 535 is viewable by the wearer. in certain embodiments, the display screen 535 is removably attached to the helmet 100 , such that the display screen 535 is viewable by the wearer when attached. in certain embodiments, the helmet may include one or more motion sensors 540 , positioned around the helmet 100 . such sensors may be passive infrared, ultrasonic, microwave, or image sensor based motion detectors. such motion sensors 540 may notify the wearer of activity detected from a certain direction through an alert, such as sound notification via audio speakers 560 disposed in the helmet 100 and/or a separate earpiece, headset, or the like (not shown) worn by the user. additionally or alternatively, the motion sensors 540 may communicate with the display screen 535 to display information regarding activity detected from a certain direction. in still further embodiments, a silent alert device 565 may be provided on the helmet, such as a haptic alert device. in certain embodiments, the silent alert device 565 is a vibration motor having an eccentric rotating mass. in this manner, the one or more of the integrated motion sensors or cameras function as a warning system, e.g., for warning the wearer of a potential intruder in the vicinity and the direction from which the intruder is approaching. in certain further embodiments, the cameras may be activated by proximity and/or motion detectors. motion detectors 540 may be programmed with timing control logic, such that detected motion for a period of time will activate a video controller 410 , triggering transmission of images or video captured by the camera to be transmitted to display screen 535 . in certain embodiments, the helmet system includes a mounting assembly to removably attach an additional device to the helmet 100 . in the illustrated embodiment, a viewing device 530 is removably attached and positioned such that the viewing device 530 is positioned in front of an eye of the user. in certain embodiments, the mounting assembly includes a pivot assembly to allow the viewing device to pivot away from the user's line of sight to a stowed position when the camera is not in use. in certain embodiments, the viewing device 530 is a camera system. in certain embodiments, the video and control circuit boards 410 are integrated into the helmet 100 , allowing the viewing device 530 may be reduced in size and weight. as best seen in figs. 6 and 7 , reducing the size and weight of the hearing device 530 allows for more even weight distribution, left neck strain, and increased visibility for the helmet wearer. in certain embodiments, the camera system 530 comprises a photosensor element and a human viewable display. in certain embodiments, the photosensor is sensitive to infrared (ir) radiation. in preferred embodiments, the photosensor is sensitive to radiation in the short wave infrared (swir) region and may be, for example, an indium gallium arsenide (ingaas) sensor. in certain embodiments, the viewing device the photosensor could be a visible light imaging sensor or a thermal imaging sensor. in certain embodiments, the viewing device 530 is a night vision device employing a photomultiplier tube, such as in nvg device or an enhanced nvg device. in certain embodiments, the display screen 535 is removably attached to the helmet. in certain embodiments, the display screen 535 is adjacent to the camera system, positioned to face the eye of the user. in alternative embodiments, the viewing device 530 may be a night vision goggle (monocular or binocular) device or other optical or imaging device, such as thermal or infrared (ir) devices, including swir devices, head mounted displays (such as head-up displays, immersive displays, etc.), or other type of device. a radio frequency (rf) antenna 510 is coupled to the rf transceiver (e.g., bluetooth) 412 received in the helmet 100 , to allow the helmet 100 to communicate with teammates wearing the same or similar devices. in certain embodiments, the helmet 100 includes one or more audio speakers 560 on the inner surface of the helmet, e.g., positioned to be close to the ears of the wearer. in alternative embodiments, earphones or like wearable earpiece communicating with the helmet via an rf interface (e.g., bluetooth) may be used. the audio speakers 560 and/or earphones/ear piece may output audio associated with video images shown on the screen display 535 . in certain embodiments, the audio speakers 560 and/or earphones/ear piece provide audio output from a weapon system to provide audible information from the weapon system. the display screen 535 and/or the audio speakers 560 or earphones may be used to communicate distress signals from teammates as well as provide the location of teammates. for example, in certain embodiments, the geographic location of one team member may pop up on the display screens of other teammates upon issuance of a distress signal. in certain embodiments, the one or more rf receivers includes a receiver for receiving data from sensors external to the helmet 100 . in certain embodiments, the external sensor(s) comprise one or more sensors 700 located around the body of the user. in certain embodiments, an acoustical ring is embedded around the brim 110 of the helmet 100 . the acoustical ring comprises an array of small microphones 112 embedded in the brim housing 115 configured to pick up directional sound. a processor 414 processes the signals from the microphones and outputs an audio signal to an audio output device, such as an audio amplifier coupled to the speakers 560 and/or an rf (e.g., bluetooth) ear piece, earphone, headset or the like. in certain embodiments, the acoustical ring is used to provide a noise cancelling function to the helmet audio system, e.g., using digital signal processing or like circuitry to output an inverted or phase shifted waveform of the ambient noise to reduce the ambient noise through destructive interference. audible output to the soldier may be via a wireless (e.g., bluetooth) ear piece or head set worn by the user and/or the audio speakers 560 within the helmet. in certain embodiments, the audio output is audible output of sound received by acoustical ring. in certain embodiments, the audio output includes include weapon information received from a weapon-mounted round counter, warning notices or alerts from the cameras mounted and/or motion sensors around the helmet. such alerts may be spoken alerts, e.g., generated using synthetic speech or via audible playback of prerecorded digital sound files. in certain embodiments, the helmet-mounted cameras include an image recognition software function for sensing an intruder or any other potential threat within the cameras' field of view. in such embodiments, other information to be communicated to the user includes information transmitted from one or more weapon-mounted sensors to the rf transceiver(s) 412 . as an alternative to (or in addition to) audio output, data, alerts, warnings, or the like can be projected in human viewable form through the display 535 and/or a head up display 536 . in certain embodiments, the head up display takes the form of a visor 537 attached to the helmet 100 via a helmet-mounted bracket 538 . the visor includes one or more projectors 539 for projecting the indicia onto the visor 537 wherein is reflected to an eye of the user. in certain embodiments, the helmet-mounted bracket 538 is configured to mount the head up display 536 in front of either the right or left eye of the user. in certain embodiments, the helmet-mounted bracket 538 is configured to mount the head up display 536 in both the right and left eye of the user. in certain embodiments, the helmet system 100 is configured to receive signals, e.g., via wireless transmission, with one or more sensors (not shown) located on or around the body of the user to monitor impact to the user. the helmet system 100 may alternatively or additionally communicate with sensors (not shown) include as part of a vital sign monitoring system for sensing one or more vital signs or health conditions of the wearer, such as heart rate, body temperature, respiratory rate, and so forth. the impact/vital sign monitoring system may send the detected information to one or more receiving points in the helmet, which may include an rf communication interface via the one or more rf transceivers 412 or cabled or hard-wired communication link. in certain embodiments, the one or more rf transceivers 412 may, in turn, send the information gathered from the helmet systems and associated sensors and transmit such information to, for example, a hospital, a triage center, or a central command center for monitoring the user's information. other sensors contemplated include a satellite-based positioning system (e.g., gps) receiver 416 for determining positional information of the user and a thermometer (e.g., thermistor-based temperature sensor) 418 for sensing ambient air temperature and other environmental factors. information from such sensors may be accessed through and displayed on the screen display, using voice commands and/or controls located on the helmet 100 . in certain embodiments, a directional 3-axis telemetry 422 sensor is provided on one of the helmet logic boards 410 . the purpose of the 3-axis telemetry sensor is to be able to know the position of the helmet in an x, y, z point cloud. in the illustrated embodiments, a battery pack 570 includes a mount which removably receives a powered shoe on a rear helmet bracket. electrical conductors 420 pass over, under, or within the helmet 100 and electrically couple each electrically powered function or device received in the helmet 100 as well as to the viewing device 530 . certain embodiments of the helmet 100 include fixed contact pins/pads mounted to printed circuit board (pcb) embedded in the helmet to provide for the transmission of power and/or data signals between the battery back 570 and the electrically powered functions and devices integrated into the helmet 100 . in an alternative embodiment, the helmet and any additional devices may be powered by a battery management system (not illustrated) operable to provide power via the helmet system 100 to one or more functions or devices received in the helmet. a battery compartment includes mounting rails for connection to the rear of the helmet. the battery compartment may be secured in position via threaded fasteners. in certain embodiments, the battery compartment 570 may be as shown and described in commonly owned u.s. application ser. no. 15/404,505 filed jan. 12, 2017, now u.s. publication no. 2017/0205202, the entire contents of which are incorporated herein by reference. the battery compartment 570 includes a housing 571 with one or more rear covers 572 which houses one or more (two in the illustrated embodiment) batteries within an interior compartment thereof. in certain embodiments, the batteries are 3-volt lithium batteries such as cr123 batteries. in certain embodiments, the batteries may be rechargeable batteries. the housing 571 includes removable covers 572 for providing access to the interior compartment of the housing for inserting or replacing the battery cells. the helmet 100 includes an electrical mounting shoe 573 having electrical contacts or terminals in electrical communication with the circuit elements. the shoe 573 removably interfaces with a complementary receptacle 574 on the housing 571 . the receptacle includes contacts or terminals which are electrically coupled to the battery cells and aligned with the electrical contacts on the mounting shoe 573 . in certain embodiments, electrical circuitry within the battery compartment is provided to couple the terminals of the cells, in series or in parallel, to the circuitry of the helmet 100 . alternatively, electrical circuitry within the battery compartment is provided to individually couple the terminals of a selected cell battery within compartment 570 to the circuitry of the helmet 100 , as discussed below. in certain embodiments, an electrical connector assembly includes a circuit substrate carrying an electrical connector which mates with an aligned, complementary connector element within the helmet 100 . the circuit substrate is received within an opening in the housing. pins extend through an opening in a cover, which is secured to the substrate and housing via threaded fasteners. sealing rings or gaskets are provided on either side of the substrate to protect against entry of external contamination or moisture into the interior compartment. the electrical circuitry within the battery compartment includes a switch for selective electrical coupling of a selected one of the batteries to the connector, such as a rotary switch on a circuit board. the switch includes a lever which is pivotal between a first position in which battery is coupled to the connector and position in which battery is coupled to the connector, as well as an intermediate “off” position in which neither battery is electrically coupled to the connector. the lever may include a spring biased detent assembly to provide positive retention in the desired position and resist against inadvertent movement of the lever from the desired position. in operation, one of the batteries (e.g., battery when the lever is in the first position) is used to power the helmet system 100 . when the battery is depleted, the user may manually throw the lever to the other position (e.g., the second position) to continue powering the helmet system 100 . preferably, each battery is individually swappable such that when one cell is depleted it can be changed without affecting operation of the helmet system 100 . the invention has been described with reference to the preferred embodiments. modifications and alterations will occur to others upon a reading and understanding of the preceding detailed description. it is intended that the invention be construed as including all such modifications and alterations.

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